<?xml version="1.0" encoding="utf-8"?>
<tw-patent-applications total-count="2026">
  <tw-patent-application no="1" publication-number="202616395">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616395</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113122307</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置的製造方法</chinese-title>
        <english-title>METHOD FOR MANUFACTURING ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H01L21/56</main-classification>
        <further-classification edition="200601120260112B">H01L23/28</further-classification>
        <further-classification edition="201801120260112B">C09J7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學艾喜緹瑪蒂莉亞股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS ICT MATERIA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三浦徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIURA, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置的製造方法，包括：步驟（A），準備結構體（a）（200），所述結構體（a）（200）包括積層體（100）、電子零件（70）以及支持基板（80），所述積層體（100）依序包括環氧樹脂層（10）、基材層（40）以及黏著性樹脂層（B）（50），所述電子零件（70）固著於環氧樹脂層（10），所述支持基板（80）貼附於黏著性樹脂層（B）（50）；步驟（C），利用密封材（60）將電子零件（70）密封；以及步驟（D），獲得結構體（b）（300），所述結構體（b）（300）包括將環氧樹脂層（10）硬化而成的絕緣樹脂層（20）、以及固著於絕緣樹脂層（20）且經密封材（60）密封的電子零件（70），所述電子裝置的製造方法中，當將環氧樹脂層（10）中的樹脂成分的合計含量設為100質量份時，環氧樹脂層（10）中的環氧樹脂的含量為10質量份以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for manufacturing an electronic device comprising: step (A): preparing a structural body (a) (200) comprising a laminated body (100), an electronic component (70) and a support subtract (80), wherein the laminated body (100) sequentially comprises an epoxy resin layer (10), a base material layer (40), and an adhesive resin layer (B) (50), the electronic component (70) is fixed to the epoxy resin layer (10), and the support subtract (80) is attached to the adhesive resin layer (B) (50); step (C): sealing the electronic component (70) using a sealing material (60); and step (D): obtaining a structural body (b) (300) comprising an insulating resin layer (20) formed by curing the epoxy resin layer (10), and an electronic component (70) fixed to the insulating resin layer (20) and sealed by a sealing material (60), wherein in the method for manufacturing an electronic device, when a total content of resin composition in the epoxy resin layer (10) is 100 parts by mass, a content of the epoxy resin in the epoxy resin layer (10) is 10 parts by mass or more.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:環氧樹脂層</p>
        <p type="p">20:絕緣樹脂層</p>
        <p type="p">40:基材層</p>
        <p type="p">50:黏著性樹脂層(B)</p>
        <p type="p">60:密封材</p>
        <p type="p">70:電子零件</p>
        <p type="p">80:支持基板</p>
        <p type="p">100:積層體</p>
        <p type="p">200:結構體(a)</p>
        <p type="p">300:結構體(b)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2" publication-number="202616608">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616608</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113136053</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電力控制系統及電力控制方法</chinese-title>
        <english-title>POWER CONTROL SYSTEM AND POWER CONTROL METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H02J13/00</main-classification>
        <further-classification edition="202201120260102B">G06V40/10</further-classification>
        <further-classification edition="202201120260102B">G06V40/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳衛鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李繼濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JI-TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭輝祖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, HUI-TSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭光傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, KUNG-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電力控制系統及電力控制方法。所述電力控制系統包括圖像採集模組和控制設備。圖像採集模組用於採集目的地區域的圖像。控制設備用於基於所述目的地區域的圖像檢測所述目的地區域內的人體；若檢測到所述目的地區域內不存在人體，輸出斷電信號；所述斷電信號用於控制所述目的地區域內的用電設備立即斷電或延時斷電。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power control system and a power control method. The power control system comprises an image acquisition module and a control device. The image acquisition module is configured to capture images of a destination area. The control device is configured to detect a human body in the destination area based on the images of the destination area. If no human body is detected in the destination area, the control device outputs power off signals. The power off signals are configured to control an immediate power off or a delayed power off of an electrical equipment in the destination area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電力控制系統</p>
        <p type="p">110:圖像採集模組</p>
        <p type="p">120:控制設備</p>
        <p type="p">130:控制模組</p>
        <p type="p">140:顯示模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="3" publication-number="202615859">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615859</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137199</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製備生物檢測元件並以超快雷射誘導晶相轉變的方法及生物檢測元件</chinese-title>
        <english-title>METHOD FOR PREPARING BIOLOGICAL DETECTION COMPONENT AND INDUCING CRYSTAL PHASE TRANSITION USING ULTRAFAST LASER, AND BIOLOGICAL DETECTION COMPONENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250512B">G01N33/48</main-classification>
        <further-classification edition="200601120250512B">H01S3/10</further-classification>
        <further-classification edition="200601120250512B">C01G23/047</further-classification>
        <further-classification edition="201701120250512B">C01B32/182</further-classification>
        <further-classification edition="202301120250512B">H10K77/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣師範大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN NORMAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張天立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TIEN-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳奇軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, QI-XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃崧溥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SONG-PU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳源濬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUAN-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種製備生物檢測元件並以超快雷射誘導晶相轉變的方法及生物檢測元件。方法包含於基板上形成包含氧化石墨烯及金屬氧化物的複合材料膜層；其中複合材料膜層中的金屬氧化物具有一第一晶相，並且第一晶相為銳鈦礦相；及以超快雷射誘導複合材料膜層表面進行晶相轉變，以使金屬氧化物由第一晶相至少部分轉變為第二晶相，並且使氧化石墨烯還原為還原氧化石墨烯，以於基板上形成表面改質結構。其中第二晶相為金紅石相。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for preparing a biological detection component and inducing crystal phase transition using ultrafast laser, and a biological detection component are provided. The method includes forming a composite material film layer containing graphene oxide and a metal oxide on a substrate, in which the metal oxide has a first crystal phase, which is an anatase phase. The method further involves inducing a phase transition on the composite material film layer using an ultrafast laser, causing the metal oxide to partially transition to a second crystal phase (rutile phase), and reducing the graphene oxide to reduced graphene oxide, thereby forming a surface-modified structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">2:複合材料膜層</p>
        <p type="p">2a:表面改質結構</p>
        <p type="p">S1:氧化石墨烯</p>
        <p type="p">S2:金屬氧化物</p>
        <p type="p">E2:雷射單元</p>
        <p type="p">UL:超快雷射</p>
        <p type="p">S130:步驟S130</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="4" publication-number="202616203">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616203</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137202</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>再生能源供應來源管理系統及其方法</chinese-title>
        <english-title>RENEWABLE ENERGY SUPPLY SOURCE MANAGEMENT SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250203B">G06Q50/06</main-classification>
        <further-classification edition="202301120250203B">G06Q10/06</further-classification>
        <further-classification edition="200601120250203B">H02J3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方湘婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, HSIANG-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃名嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, MING-JIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宏軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HUNG-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周志宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, JEA-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連振廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIEN, CHEN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種再生能源供應源管理系統及其方法，用於至少一個用電端透過至少一個購電契約向至少一個發電端取得供電，以計算管理所需之複數個綠能指標。該系統包括：一電量資料模組；一場景資料模組；一綠電指標計算模組，用以對一指定時間區間，基於對應的電量資料，對應的場景資料，與該時間區間所對應的一綠能轉供公式，計算出各項綠能指標；以及一報表模組，以呈現關於各項綠電指標、場景資料、或發電端/契約/用電端相關等的圖表。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a renewable energy supply source management system and method thereof, which are used for obtaining power supply from at least one power generation source through at least one purchase agreement for at least one power consumption end, in order to calculate various green energy indicators for management usage. The system includes: a power data module; a scenario data module; a green power indicator calculation module for calculating various green energy indicators for a specified time interval based on the corresponding power data, corresponding scenario data, and the green energy formula corresponding to the specified time interval; and a reporting module for presenting various graphs or charts related to green energy indicators, scenario data, power generation source/contact/power consumption end.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:再生能源供應源管理系統</p>
        <p type="p">101:電量資料模組</p>
        <p type="p">102:場景資料模組</p>
        <p type="p">103:綠電指標計算模組</p>
        <p type="p">104:報表模組</p>
        <p type="p">20:電錶</p>
        <p type="p">30:用電資料</p>
        <p type="p">40:場景資料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="5" publication-number="202615668">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615668</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137205</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鑑別大腸直腸癌之檢測套組及方法</chinese-title>
        <english-title>DETECTION KIT AND METHOD FOR DISTINGUISHING COLORECTAL CANCER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120241101B">C12Q1/6886</main-classification>
        <further-classification edition="201901120241101B">G16B20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王瑞智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JUI-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周柏豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, PO-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳常善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHANG-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅宇書</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, YU-SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡昆男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, KUN-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟子青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENG, TZU-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種評估罹患大腸直腸癌之風險之檢測套組及方法，該檢測套組包括第一檢測序列組及第二檢測序列組，第一檢測序列組包括順向引子，具有如SEQ ID NO：7所示之核苷酸序列；反向引子，具有如SEQ ID NO：8所示之核苷酸序列；及探針，具有如SEQ ID NO：9所示之核苷酸序列。第二檢測序列組包括順向引子，具有如SEQ ID NO：10所示之核苷酸序列；反向引子，具有如SEQ ID NO：11所示之核苷酸序列；及探針，具有如SEQ ID NO：12所示之核苷酸序列。該方法係將樣本加入檢測套組以進行qPCR，並透過風險運算式計算以評估罹患大腸直腸癌之風險。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and detection kit for evaluating the risk of suffering from colorectal cancer are provided. The detection kit for colorectal cancer includes a first detection sequence group and a second detection sequence group. The first detection sequence group includes a forward primer having a nucleotide sequence as shown in SEQ ID NO: 7; a reverse primer having a nucleotide sequence as shown in SEQ ID NO:8; and a probe having a nucleotide sequence as shown in SEQ ID NO:9. The second detection sequence group includes a forward primer having a nucleotide sequence shown in SEQ ID NO: 10; a reverse primer having a nucleotide sequence shown in SEQ ID NO: 11; and a probe having a nucleotide sequence shown in SEQ ID NO: 12. The method for colorectal cancer includes steps of adding a sample to the detection kit for qPCR, and colorectal cancer by a risk calculation formula.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="6" publication-number="202615370">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615370</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137208</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>輕質水泥的製造方法、其製造之輕質水泥、其人行道地磚建材結構、其輕隔間建材結構、其輕質樓地板建材結構</chinese-title>
        <english-title>MANUFACTURING METHOD FOR LIGHTWEIGHT CEMENT, THE LIGHTWEIGHT CEMENT PRODUCED THEREBY, ITS SIDEWALK TILE BUILDING MATERIAL STRUCTURE, ITS LIGHTWEIGHT PARTITION BUILDING MATERIAL STRUCTURE, AND ITS LIGHTWEIGHT FLOOR BUILDING MATERIAL STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">C04B28/00</main-classification>
        <further-classification edition="200601120241104B">C04B24/26</further-classification>
        <further-classification edition="200601120241104B">C04B38/00</further-classification>
        <further-classification edition="200601120241104B">C04B40/00</further-classification>
        <further-classification edition="200601120241104B">E04B1/86</further-classification>
        <further-classification edition="200601120241104B">E04B2/28</further-classification>
        <further-classification edition="200601120241104B">E01C5/04</further-classification>
        <further-classification edition="200601120241104B">E01C15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華彩塗料實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUA TSAI PAINTS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郁文華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, WUN-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIAN-JHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郁肇倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, JHAO-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周容青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHOU, RONG-CING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種輕質水泥的製造方法、其製造之輕質水泥、其人行道地磚建材結構、其輕隔間建材結構、及其輕質樓地板建材結構。該輕質水泥的製造方法包含一調配步驟、一前置步驟及一混合步驟。本創作之輕質水泥的製造方法製造之輕質水泥之密度低於1500公斤/立方公尺。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method for lightweight cement, the lightweight cement produced thereby, its sidewalk tile building material structure, its lightweight partition building material structure, and its lightweight floor building material structure. The manufacturing method includes a formulation step, a pre-treatment step, and a mixing step. The density of the lightweight cement produced by this manufacturing method is less than 1500 kg/m³.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(S0):調配步驟</p>
        <p type="p">(S1):前置步驟</p>
        <p type="p">(S2):混和步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="7" publication-number="202615161">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615161</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137209</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低碳足跡仿石塗料及其主材</chinese-title>
        <english-title>LOW CARBON FOOTPRINT STONE-LIKE COATING AND MAIN MATERIAL THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">B05D7/00</main-classification>
        <further-classification edition="200601120241105B">B44F9/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華彩塗料實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUA TSAI PAINTS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郁文華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, WUN-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIAN-JHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郁肇倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, JHAO-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周容青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHOU, RONG-CING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種低碳足跡仿石塗料，適用於一底材，包含：一底漆層，用以附著於該底材；一主材層，直接或間接地附著於該底漆層上，用以提供仿石紋路；及一面漆層，塗覆於該主材層上，用以防護該主材層，其中，該主材層包含一無機骨材，該無機骨材為含矽廢棄物經回收處理後得到之矽化物。藉此，該低碳足跡仿石塗料更加環保、更低碳足跡，且具有更高硬度及更高耐磨性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A low carbon footprint stone-like coating is suitable for application on a substrate and comprises a primer layer for adhering to the substrate, a main material layer that is directly or indirectly attached to the primer layer to provide a stone-like texture, and a topcoat layer applied over the main material layer for protection. The main material layer includes an inorganic aggregate, which is a silicate obtained from recycled silicon-containing waste. This low carbon footprint stone-like coating is more environmentally friendly, has a reduced carbon footprint, and offers higher hardness and improved wear resistance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(W):底材</p>
        <p type="p">(11):底漆層</p>
        <p type="p">(12):中塗層</p>
        <p type="p">(13):主材層</p>
        <p type="p">(131):色漿</p>
        <p type="p">(132):無機骨材</p>
        <p type="p">(133):樹脂</p>
        <p type="p">(14):面漆層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="8" publication-number="202615944">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615944</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137214</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防窺裝置</chinese-title>
        <english-title>PRIVACY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241211B">G02F1/1335</main-classification>
        <further-classification edition="200601120241211B">G02F1/1337</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀚宇彩晶股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANNSTAR DISPLAY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭舒展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, SHU-CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉家宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIA-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉丁瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高翎誌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, LING-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種防窺裝置，其包括第一偏光片、第二偏光片、防窺介質層、第一配向層與第二配向層。第一偏光片包括第一穿透軸，第二偏光片與第一偏光片相對設置，並包括第二穿透軸，防窺介質層設置在第一偏光片與第二偏光片之間。第一配向層設置在第一偏光片與防窺介質層之間，並具有第一配向方向。第二配向層設置在第二偏光片與防窺介質層之間，並具有第二配向方向。第一穿透軸與第二穿透軸之間具有第一夾角，第一夾角不大於90度。第一配向方向與第二配向方向之間具有第二夾角，且第二夾角小於第一夾角。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A privacy device includes a first polarizer, a second polarizer, a privacy medium layer, a first alignment layer and a second alignment layer. The first polarizer includes a first transmission axis, the second polarizer is opposite to the first polarizer and includes a second transmission axis, and the privacy medium layer is disposed between the first polarizer and the second polarizer. The first alignment layer is disposed between the first polarizer and the privacy medium layer and has a first aligning direction. The second alignment layer is disposed between the second polarizer and the privacy medium layer and has a second aligning direction. A first included angle is between the first transmission axis and the second transmission axis, and the first included angle is not greater than 90 degrees. A second included angle is between the first aligning direction and the second aligning direction, and the second included angle is less than the first included angle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">132:第一偏光片</p>
        <p type="p">132a:第一穿透軸</p>
        <p type="p">134:第二偏光片</p>
        <p type="p">134a:第二穿透軸</p>
        <p type="p">142:第一配向層</p>
        <p type="p">142d:第一配向方向</p>
        <p type="p">144:第二配向層</p>
        <p type="p">144d:第二配向方向</p>
        <p type="p">X,Y,Z:方向</p>
        <p type="p">θ1:第一夾角</p>
        <p type="p">θ2:第二夾角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="9" publication-number="202615861">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615861</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137228</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>乳酸檢測電極及其製造方法</chinese-title>
        <english-title>LACTIC ACID DETECTION ELECTRODE AND METHOD FOR PRODUCING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">G01N33/50</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣師範大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN NORMAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張天立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TIEN-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳奇軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, QI-XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃崧溥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SONG-PU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳源濬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUAN-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種乳酸檢測電極及其製造方法。乳酸檢測電極包含基板以及形成於基板上的電極圖案。電極圖案的表面具有表面改質結構，且表面改質結構具有由基於p型的還原氧化石墨烯與基於n型的金屬氧化物所形成的p-n異質接面。電極圖案包含第一電極及第二電極。第一電極具有第一螺旋線條。第二電極具第二螺旋線條。第一螺旋線條及第二螺旋線條分別沿一螺旋路徑朝彼此靠近的方向延伸，彼此螺旋纏繞且間隔設置而互相不接觸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a lactic acid detection electrode and a method for producing the same. The lactic acid detection electrode includes a substrate and an electrode pattern formed on the substrate. The surface of the electrode pattern has a surface modification structure, and the surface modification structure has a p-n heterojunction formed by p-type-based reduced graphene oxide and n-type-based metal oxide. The electrode pattern includes a first electrode and a second electrode. The first electrode has a first spiral line. The second electrode has a second spiral line. The first spiral line and the second spiral line respectively extend along a spiral path in a direction approaching each other, and are spirally wound around and spaced apart from each other without contacting each other.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:乳酸檢測電極</p>
        <p type="p">1:基板</p>
        <p type="p">2a:表面改質結構</p>
        <p type="p">21:第一螺旋線條</p>
        <p type="p">21a:第一電極端</p>
        <p type="p">211:第一電極指</p>
        <p type="p">22:第二螺旋線條</p>
        <p type="p">22a:第二電極端</p>
        <p type="p">221:第二電極指</p>
        <p type="p">G、G’、G”:指叉間距</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="10" publication-number="202615855">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615855</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137229</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣體檢測晶片及其製造方法</chinese-title>
        <english-title>GAS DETECTION CHIP AND METHOD FOR PRODUCING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241217B">G01N27/04</main-classification>
        <further-classification edition="202101120241217B">C25B11/04</further-classification>
        <further-classification edition="201401120241217B">B23K26/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣師範大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN NORMAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張天立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TIEN-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃崧溥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SONG-PU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳奇軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, QI-XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳源濬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUAN-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明主要公開一種利用雷射薄膜電極結構製程於氣體檢測晶片技術。不同於傳統化學蝕刻或長脈衝雷射的製程方式，本發明是利用超快雷射（Ultrafast laser）製程，以進行薄膜複材結構的製作於氣體檢測的開發，且本發明利用可撓性材料（如：聚亞醯胺基材）上多尺度複合結構於氣體檢測。本發明製備的氣體檢測晶片有助可攜式微型氣體偵測的需求，能應用於基準醫學、電動車、新能源、航太、和次世代5G之檢測應用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention discloses a method utilizing a laser-film electrode structure process for gas detection chip technology. Unlike traditional chemical etching or long-pulse laser processes, this invention employs an ultrafast laser process to create thin-film composite structures for the development of gas detection. The invention uses flexible materials (such as polyimide substrates) with multi-scale composite structures for gas detection. The gas detection chips prepared by this invention facilitate the needs for portable miniaturized gas detection, and can be applied in fields such as benchmark medicine, electric vehicles, new energy, aerospace, and next-generation 5G detection applications.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:氣體檢測晶片</p>
        <p type="p">1:基板</p>
        <p type="p">11:表面</p>
        <p type="p">2:石墨烯層</p>
        <p type="p">3:奈米線</p>
        <p type="p">E:電極圖案</p>
        <p type="p">S150b:步驟S150</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="11" publication-number="202616411">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616411</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137230</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶圓冷擴設備</chinese-title>
        <english-title>WAFER COLD-EXPANSION APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241029B">H01L21/67</main-classification>
        <further-classification edition="200601120241029B">H01L21/64</further-classification>
        <further-classification edition="200601120241029B">G05D23/19</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翌實實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YISHI INDUSTRIAL CO.,LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WEN-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種晶圓冷擴設備，包含一工作台、對應於所述工作台設置的一升降機構、及安裝於所述升降機構的一冷卻腔體。所述工作台用以固定一藍膜，以使黏接於所述藍膜的晶圓的位置對應於所述工作台的一作業孔。所述冷卻腔體能用於接收低於0℃且露點溫度低於-10℃的一乾燥氣體。當所述工作台固定所述藍膜時，所述冷卻腔體能移動壓抵於所述藍膜的背面而共同形成一下作業空間，其用於接收所述乾燥氣體來對所述藍膜持續地降溫一預設時間，而後所述冷卻腔體能移動上升、以擴張拉伸所述藍膜而完成所述晶圓的裂片作業。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a wafer cold-expansion apparatus, which includes a workbench, a lifting mechanism corresponding in position to the workbench, and a cooling chamber assembled to the lifting mechanism. The workbench is configured to fix a blue tape for enabling a wafer adhered on the blue tape to correspond in position to a processing hole of the workbench. The cooling chamber is configured to receive a dry gas that has a temperature lower than 0℃ and a dew point temperature lower than -10℃. When the workbench is fixed with the blue tape, the cooling chamber can be moved to abut against a backside of the blue tape for jointly define a lower processing space that can receive the dry gas to continuously cool down the blue tape by a predetermined period, and then the cooling chamber can be upwardly moved to stretch the blue tape for completing a splitting process of the wafer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:晶圓冷擴設備</p>
        <p type="p">1:工作台</p>
        <p type="p">11:作業孔</p>
        <p type="p">2:遮罩模組</p>
        <p type="p">21:罩體</p>
        <p type="p">211:外環部</p>
        <p type="p">22:壓迫環</p>
        <p type="p">23:加壓彈性件</p>
        <p type="p">24:緊固機構</p>
        <p type="p">25:加熱機構</p>
        <p type="p">3:升降機構</p>
        <p type="p">41:冷卻腔體</p>
        <p type="p">411:底板</p>
        <p type="p">412:內環壁</p>
        <p type="p">413:均流板</p>
        <p type="p">414:外環壁</p>
        <p type="p">422:輸入管路</p>
        <p type="p">423:回流管路</p>
        <p type="p">5:回溫機構</p>
        <p type="p">6:外殼</p>
        <p type="p">200:藍膜</p>
        <p type="p">201:正面</p>
        <p type="p">202:背面</p>
        <p type="p">300:晶圓</p>
        <p type="p">S1:上作業空間</p>
        <p type="p">S2:下作業空間</p>
        <p type="p">G:乾燥氣體</p>
        <p type="p">R1:第一腔室</p>
        <p type="p">R2:第二腔室</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="12" publication-number="202615295">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615295</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137231</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電動自行車的傳動裝置</chinese-title>
        <english-title>TRANSMISSION DEVICE FOR ELECTRIC BICYCLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120241029B">B62M6/60</main-classification>
        <further-classification edition="200601120241029B">F16H1/16</further-classification>
        <further-classification edition="201001120241029B">B62M6/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威剛科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADATA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭家祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, CHIA-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱祐諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, YU-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種電動自行車的傳動裝置，其包括驅動馬達、第一蝸桿、第一蝸輪、第二蝸桿、第二蝸輪以及曲軸。驅動馬達具有傳動軸。第一蝸桿同軸連接於傳動軸。第一蝸輪與第一蝸桿相互嚙合。第二蝸桿同軸連接於第一蝸輪。第二蝸輪與第二蝸桿相互嚙合。曲軸連接於第二蝸輪。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transmission device for an electric bicycle includes a drive motor, a first worm, a first worm gear, a second worm, a second worm gear, and a crankshaft. The drive motor has a transmission shaft. The first worm is coaxially connected to the transmission shaft. The first worm gear and the first worm gear mesh with each other. The second worm is coaxially connected to the first worm gear. The second worm gear and the second worm gear mesh with each other. The crankshaft is connected to the second worm gear.</p>
      </isu-abst>
      <representative-img>
        <p type="p">D:傳動裝置</p>
        <p type="p">S:殼體</p>
        <p type="p">1:驅動馬達</p>
        <p type="p">6:曲軸</p>
        <p type="p">61:第一端</p>
        <p type="p">62:第二端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="13" publication-number="202615935">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615935</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137232</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智慧隱形眼鏡及其內埋模組</chinese-title>
        <english-title>SMART CONTACT LENS AND EMBEDDED MODULE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">G02C7/04</main-classification>
        <further-classification edition="200601120241230B">G02C7/08</further-classification>
        <further-classification edition="200601120241230B">G02C11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海華科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AZUREWAVE TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉桐林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, TUNG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖育萱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, YU-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡煌展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, HUANG-CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種智慧隱形眼鏡及其內埋模組。所述內埋模組包含一環形載板、一電子晶片、形成於所述環形載板的多條金屬線路、及一封裝體。所述環形載板具有一C形段、分別相連於所述C形段的兩末端的兩個緩衝段、及相連於兩個所述緩衝段之間的一固晶段。所述環形載板的外邊緣於所述C形段與每個所述緩衝段之間凹設形成有一應力阻斷槽。所述電子晶片安裝於所述固晶段且埋置所述封裝體內。於所述內埋模組的橫截面之中，所述固晶段呈直線狀，每個所述緩衝段呈圓弧狀且具有一第一半徑，所述C形段呈圓弧狀且具有大於所述第一半徑的一第二半徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a smart contact lens and an embedded module thereof. The embedded module includes a ring-shaped carrier, an electronic chip, a plurality of metal circuits formed on the ring-shaped carrier, and an encapsulant. The ring-shaped carrier has a C-shaped segment, two buffer segments respectively connected to two ends of the C-shaped segment, and a chip-bonding segment that is connected to the two buffer segments. The ring-shaped carrier has two stress blocking slots that are recessed in an outer edge thereof, and each of the two stress blocking slots is located between the C-shaped segment and one of the two buffer segments. The electronic chip is mounted on the chip-bonding segment and is embedded in the encapsulant. In a cross section of the embedded module, the chip-bonding segment has a straight shape, each of the two buffer segment has an arc shape having a first radius, and the C-shaped segment has an arc shape that has a second radius being greater than the first radius.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:內埋模組</p>
        <p type="p">21:環形載板</p>
        <p type="p">21a:外邊緣</p>
        <p type="p">211a:應力阻斷槽</p>
        <p type="p">212a:應力調節槽</p>
        <p type="p">21b:內邊緣</p>
        <p type="p">211:C形段</p>
        <p type="p">212:緩衝段</p>
        <p type="p">213:固晶段</p>
        <p type="p">214:圓弧孔</p>
        <p type="p">215:圓孔</p>
        <p type="p">22:電子晶片</p>
        <p type="p">23:金屬線路</p>
        <p type="p">231:天線</p>
        <p type="p">2311:主體段</p>
        <p type="p">2312:側翼段</p>
        <p type="p">2313:末端部</p>
        <p type="p">232:感測線路</p>
        <p type="p">233:結構強化線路</p>
        <p type="p">24:封裝體</p>
        <p type="p">L:中軸線</p>
        <p type="p">σ212:緩衝角度</p>
        <p type="p">σ1:第一角度</p>
        <p type="p">σ2:第二角度</p>
        <p type="p">σ214:圓心角</p>
        <p type="p">Y:縱軸</p>
        <p type="p">X:橫軸</p>
        <p type="p">Q1:第一象限</p>
        <p type="p">Q2:第二象限</p>
        <p type="p">Q3:第三象限</p>
        <p type="p">Q4:第四象限</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="14" publication-number="202616101">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616101</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137233</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>建立向量化文本資料庫的方法、系統以及應用系統</chinese-title>
        <english-title>METHOD FOR ESTABLISHING TEXT-VECTORIZATION DATABASE, SYSTEM THEREOF AND APPLICATION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250203B">G06F16/30</main-classification>
        <further-classification edition="201901120250203B">G06F16/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高登智慧科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOLDEN SMART HOME TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何庭緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, TING WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種建立向量化文本資料庫的方法、系統以及應用系統，建立向量化文本資料庫的方法包括先取得一文本，接著切分文本形成多個段落，通過小型語言模型分析多個段落，取得各段落中的一或多個關鍵字詞。之後結合多個段落中各段落文字與段落對應的一或多個關鍵字詞，以形成多個結合關鍵字詞的新段落，藉此可以強化關鍵字詞的在各個段落的重要性，多個新段落執行向量化程序後形成多個向量化段落，建立向量化文本資料庫，此向量化文本資料庫可實現準確對應不同領域的知識庫。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for establishing a text-vectorization database, a system thereof and an application system are provided. In the method, a textual content is retrieved, the textual content is divided into multiple sections, and a small language model is incorporated to analyze the multiple sections so as to obtain one or more keywords with respect to each of the sections. After that, the texts in each of the sections are combined with the corresponding one or more keywords so as to form a new section combined with the one or more keywords. Therefore, the importance of the keywords in every section can be strengthened. The multiple new sections are then processed by a vectorization process to multiple vectorized sections. The text-vectorization database is established. The text-vectorization database can implement various knowledge query applications in various fields.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:網路</p>
        <p type="p">210:終端裝置</p>
        <p type="p">220:文本資料庫</p>
        <p type="p">230:企業伺服器</p>
        <p type="p">200:伺服系統</p>
        <p type="p">201:文本處理模組</p>
        <p type="p">203:關鍵字取得模組</p>
        <p type="p">205:向量化文本資料庫</p>
        <p type="p">207:對話處理模組</p>
        <p type="p">208:輸出入介面模組</p>
        <p type="p">209:向量化模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="15" publication-number="202616606">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616606</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137238</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>放電裝置與充放電系統及其操作方法</chinese-title>
        <english-title>DISCHARGING DEVICE AND CHARGING/DISCHARGING SYSTEM AND METHOD OF OPERATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241120B">H02J7/34</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS,INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施仁親</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHR, REN-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種放電裝置包括儲能元件與負載單元。儲能元件進行定電流充電，且於儲能元件的電壓達到參考電壓時致能負載單元，使該儲能元件以定電壓放電至固定電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A discharging device includes an energy storage component and a load unit. The energy storage component is charged in a constant-current manner. When a voltage of the energy storage component reaches a reference voltage, the load unit is enabled to discharge the energy storage component in a constant-voltage manner to a fixed voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:儲能元件</p>
        <p type="p">20:開關</p>
        <p type="p">30:負載單元</p>
        <p type="p">40:控制器</p>
        <p type="p">50:隔離通訊元件</p>
        <p type="p">60:電源供應器</p>
        <p type="p">70:連接器</p>
        <p type="p">80:旁路開關</p>
        <p type="p">12:串聯支路</p>
        <p type="p">S1:第一控制信號</p>
        <p type="p">S2:第二控制信號</p>
        <p type="p">Se:外部控制信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="16" publication-number="202615945">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615945</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137240</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">G02F1/1335</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀚宇彩晶股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANNSTAR DISPLAY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳許合</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HSU-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭柏隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, BO-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃崑財</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, KUN-TSAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種顯示裝置，其包括第一基板、第二基板、顯示介質層、光反射層以及蠟質層。第一基板與第二基板相對設置，顯示介質層設置在第一基板與第二基板之間，光反射層設置在第一基板與顯示介質層之間，蠟質層設置在光反射層與顯示介質層之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device includes a first substrate, a second substrate, a display medium layer, a light reflecting layer and a waxy layer. The first substrate and the second substrate are opposite to each other, the display medium layer is disposed between the first substrate and the second substrate, the light reflecting layer is disposed between the first substrate and the display medium layer, and the waxy layer is disposed between the light reflecting layer and the display medium layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示裝置</p>
        <p type="p">110:第一基板</p>
        <p type="p">120:第二基板</p>
        <p type="p">130:顯示介質層</p>
        <p type="p">130d:介質層間隙</p>
        <p type="p">140:光反射層</p>
        <p type="p">150:蠟質層</p>
        <p type="p">160:色彩轉換層</p>
        <p type="p">162:轉換部</p>
        <p type="p">162a:紅色轉換部</p>
        <p type="p">162b:綠色轉換部</p>
        <p type="p">162c:藍色轉換部</p>
        <p type="p">SP:子像素</p>
        <p type="p">SP1:紅色子像素</p>
        <p type="p">SP2:綠色子像素</p>
        <p type="p">SP3:藍色子像素</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="17" publication-number="202616575">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616575</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137248</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器</chinese-title>
        <english-title>ELECTRICAL CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241115B">H01R13/40</main-classification>
        <further-classification edition="200601120241115B">H01R13/02</further-classification>
        <further-classification edition="200601120241115B">H01R13/648</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>發明人放棄姓名表示權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電連接器，用於接收一電子卡，包括絕緣本體和複數導電端子，所述絕緣本體設有縱長的插槽及位於所述插槽的縱長方向兩側的側壁，所述導電端子排列於所述側壁且包括延伸至所述插槽的接觸部、自所述接觸部向上延伸的頭部、自所述接觸部向下延伸的連接部以及自所述連接部向下延伸的焊腳；所述電連接器包括位於所述側壁的端子保護件，所述端子保護件遮蔽所述導電端子的頭部；在所述電子卡插入所述插槽初期，所述端子保護件導引所述電子卡插入；隨著電子卡繼續插入，所述端子的接觸部被所述電子卡抵頂而在所述端子保護件內沿與所述縱長方向垂直的橫向方向移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical connector for receiving an electronic card includes an insulating housing and plural conductive terminals. The insulating body has a longitudinal slot and two side walls located on both sides of the slot in the longitudinal direction. The conductive terminals are arranged on the side wall and include a contacting portion extending to the slot, a head portion extending upward from the contacting portion, a connecting portion extending downward from the contacting portion, and a soldering leg extending downward from the connecting portion. The electrical connector includes a terminal protective member located on the side wall, and the terminal protective member covers the head portion of the conductive terminal. When the electronic card is inserted into the slot initially, the terminal protective member guides the electronic card, as the electronic card is further inserted, the contacting portion of the terminal is pushed against by the electronic card and moves in a transverse direction within the terminal protective member.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:插槽</p>
        <p type="p">121:容置槽</p>
        <p type="p">122:浮動間隙</p>
        <p type="p">123:安裝槽</p>
        <p type="p">201:接地端子</p>
        <p type="p">21:接觸部</p>
        <p type="p">31:抵接部</p>
        <p type="p">22:頭部</p>
        <p type="p">23:連接部</p>
        <p type="p">24:焊腳</p>
        <p type="p">30:端子保護件</p>
        <p type="p">32:保護槽</p>
        <p type="p">33:主體部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="18" publication-number="202615946">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615946</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137249</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241213B">G02F1/1335</main-classification>
        <further-classification edition="200601120241213B">G02B5/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃騰緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃美蓮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, MEI-LIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭家斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, CHIA-BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種顯示裝置，包括顯示介質層、第一濾光結構以及第二濾光結構。第一濾光結構包括多個第一濾光單元以及一第一遮光層，其中各第一濾光單元包括多個第一濾光層。第一遮光層包括分別配置於該些第一濾光層之間的多個第一黑色矩陣。第二濾光結構包括多個第二濾光單元以及一第二遮光層，其中各第二濾光單元包括多個第二濾光層。第二遮光層包括分別配置於該些第二濾光層之間的多個第二黑色矩陣。各第二黑色矩陣的紅外光穿透率大於各第一黑色矩陣的紅外光穿透率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device including a display media layer, a first light filtering structure and a second light filtering structure is provided. The first light filtering structure includes a plurality of first light filtering units and a first shading layer, wherein each of the first light filtering units includes a plurality of first light filtering layers. The first shading layer includes a plurality of first black matrixes respectively disposed between the first light filtering layers. The second light filtering structure includes a plurality of second light filtering units and a second shading layer, wherein each of the second light filtering units includes a plurality of second light filtering layers. The second shading layer includes a plurality of second black matrixes respectively disposed between the second light filtering layers. An infrared light transmittance of each second black matrix is larger than an infrared light transmittance of each first black matrix.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10、20:基板</p>
        <p type="p">30:顯示介質層</p>
        <p type="p">40:填充層</p>
        <p type="p">100、200:濾光結構</p>
        <p type="p">101:第二遮光層</p>
        <p type="p">201:第一遮光層</p>
        <p type="p">300:影像感測器</p>
        <p type="p">BM1:第一黑色矩陣</p>
        <p type="p">BM2:第二黑色矩陣</p>
        <p type="p">CF1:紅色濾光層</p>
        <p type="p">CF2:綠色濾光層</p>
        <p type="p">CF3:藍色濾光層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="19" publication-number="202616248">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616248</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137251</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光二極體顯示裝置</chinese-title>
        <english-title>LIGHT EMITTING DIODE DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120241029B">G09G3/32</main-classification>
        <further-classification edition="200601120241029B">H01L23/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾竣帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, CHUN-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐鳳明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, FENG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和家璞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHIA-PU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種發光二極體顯示裝置，包括發光二極體顯示面板以及第一薄膜覆晶封裝結構。第一薄膜覆晶封裝結構接合至發光二極體顯示面板，且包括第一晶片、第二晶片以及第一電路基板。第一晶片包括多個第一訊號輸出凸塊以及多個第一虛設凸塊。第二晶片包括多個第二訊號輸出凸塊。第一訊號輸出線分別電性連接至第一訊號輸出凸塊。第二訊號輸出線分別電性連接至第二訊號輸出凸塊。至少部分的第二訊號輸出線分別電性連接至第一虛設凸塊。第一晶片以及第二晶片中的一者為發光訊號控制晶片。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light-emitting diode display device includes a light-emitting diode display panel and a first film chip on film package structure. The first chip on film package structure is bonded to the light-emitting diode display panel and includes a first chip, a second chip and a first circuit substrate. The first chip includes first signal output bumps and first dummy bumps. The second chip includes second signal output bumps. First signal output lines are electrically connected to the first signal output bumps respectively. Second signal output lines are electrically connected to the second signal output bumps respectively. At least part of the second signal output lines are electrically connected to the first dummy bumps respectively. One of the first chip and the second chip is a light-emitting signal control chip.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:第一電路基板</p>
        <p type="p">101A:輸入接墊</p>
        <p type="p">102A:第一訊號輸出接墊</p>
        <p type="p">104A:第二訊號輸出接墊</p>
        <p type="p">106A:電源傳輸接墊</p>
        <p type="p">110A:第一晶片</p>
        <p type="p">120A:第二晶片</p>
        <p type="p">132A:電源傳輸線</p>
        <p type="p">134A:第一訊號輸入線</p>
        <p type="p">135A:第二訊號輸入線</p>
        <p type="p">136A:第一電源供應線</p>
        <p type="p">137A:第二電源供應線</p>
        <p type="p">142A:第一連接線</p>
        <p type="p">144A:第二連接線</p>
        <p type="p">152A:第一訊號輸出線</p>
        <p type="p">154A:第二訊號輸出線</p>
        <p type="p">C1:第一電路</p>
        <p type="p">C2:第二電路</p>
        <p type="p">CFA:第一薄膜覆晶封裝結構</p>
        <p type="p">DR1:第一方向</p>
        <p type="p">DR2:第二方向</p>
        <p type="p">S1:第一側</p>
        <p type="p">S2:第二側</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="20" publication-number="202616206">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616206</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137257</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>行為功能評估與正向行為支持策略產生方法及裝置、電腦可讀取的記錄媒體</chinese-title>
        <english-title>METHOD AND DEVICE FOR BEHAVIORAL FUNCTION EVALUATION AND FORWARD BEHAVIORAL SUPPORT STRATEGY GENERATION, COMPUTER-READABLE RECORDING MEDIA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250203B">G06Q50/20</main-classification>
        <further-classification edition="200601120250203B">G09B19/00</further-classification>
        <further-classification edition="200601120250203B">G09B7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣師範大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN NORMAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王慧婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王佳盈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIA-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林芳羽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, FANG YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁家萁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, JIA-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種行為功能評估與正向行為支持策略產生方法，由一電腦裝置顯示一行為問題收集頁面供輸入一個案的複數行為問題，該電腦裝置根據輸入的該等行為問題產生並顯示一問卷供作答，該電腦裝置根據該問卷的一作答結果判斷該個案可能的行為功能，該電腦裝置根據該作答結果、該個案可能的行為功能和互競行為模式之邏輯即時產生並顯示至少一正向行為支持策略供選取，該電腦裝置根據該至少一正向行為支持策略其中被選取的一正向行為支持策略，產生並顯示與被選取的該正向行為支持策略對應的一教案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for behavioral function evaluation and forward behavioral support strategy generation is provided, by a computer device, displaying a behavioral problem collection page for inputting a plurality of behavioral problems of a case, the computer device generating and displaying a questionnaire according to the inputted behavioral problems, the computer device determining possible behavioral functions of the case based on a answering result of the questionnaire, the computer device generating and displaying at least one forward behavioral support strategy for selection according to the answering result, the possible behavioral functions of the case, and the logic of the mutual race behavioral mode in real time, the computer device generates and displays a teaching corresponding to the selected forward behavioral support strategy of the at least one forward behavioral support strategy.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S5:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="21" publication-number="202616236">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616236</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137258</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>溝通能力評估與輔助溝通策略產生方法及裝置、電腦可讀取的記錄媒體</chinese-title>
        <english-title>METHOD AND DEVICE FOR COMMUNICATION ABILITY EVALUATION AND AAUXILIARY COMMUNICATION STRATEGY GENERATING, COMPUTER-READABLE RECORDING MEDIA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">G09B7/02</main-classification>
        <further-classification edition="200601120250203B">G09B19/00</further-classification>
        <further-classification edition="202301120250203B">G06Q10/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣師範大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN NORMAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王慧婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王佳盈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIA-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUN-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁家萁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, JIA-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種溝通能力評估與輔助溝通策略產生方法，由一電腦裝置顯示輸入頁面供輸入與個案相關的活動及活動目標，且據此產生並顯示一包含達成活動目標所需的複數個關鍵步驟的關鍵步驟評估表，供輸入與各該關鍵步驟對應的一溝通能力資訊，而據此產生並顯示複數溝通需求供確認，並根據被確認的該等溝通需求顯示一阻礙評估問卷供作答，以根據該關鍵步驟評估表中對應各該關鍵步驟的各該溝通能力資訊、被確認的該等溝通需求及該阻礙評估問卷的一作答結果產生並顯示至少一溝通策略及與該至少一溝通策略對應的一教案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for communication ability evaluation and auxiliary communication strategy generating, which displays, by a computer device, an input page for inputting activities and an activity goal related to a case, and accordingly generates and displays a key steps evaluation table including a plurality of key steps required to achieve the activity goal, for inputting a communication ability information corresponding to each of the key steps, so as to generate and display a plurality of communication requirements for confirmation, based on the confirmed communication requirements, the computer device generates and displays a barrier evaluation questionnaire for answer , and generates and displays at least one communication strategy and a teaching corresponding to the at least one communication strategy according to each of the communication capability information that corresponds to each of the key steps in the key steps evaluation table, the confirmed communication requirements and an answering result of the barrier evaluation questionnaire.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S5:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="22" publication-number="202615775">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615775</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137286</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>換氣扇裝置</chinese-title>
        <english-title>VENTILATION FAN DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241212B">F04D29/44</main-classification>
        <further-classification edition="200601120241212B">F04D29/46</further-classification>
        <further-classification edition="200601120241212B">F04D25/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS,INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭樁億</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, WEN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案係一種換氣扇裝置，包括機座、風機組及導風組件。機座包含外蓋及外殼。外蓋設置有第一入風口及第一出風口。外殼設置有第二出風口。外蓋結合在外殼上。風機組安裝在外殼內，包含殼體及離心扇。殼體具有第二入風口及連通第二入風口的風道。殼體具有位在風道中的翼型導流部。離心扇設置在殼體中。導風組件包含步進馬達及導風板。步進馬達設置在翼型導流部內。導風板結合在風道中並受馬達帶動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A ventilation fan device includes a base, a fan set, and a wind guide set. The base includes a cover and a shell. The cover includes a first inlet and a first outlet. The shell includes a second outlet. The cover is combined with the shell. The fan set is installed in the shell and includes a housing and a centrifugal fan. The housing includes a second inlet and a wind passage connecting to the second inlet. The housing includes an airfoil guide block located in the wind passage. The centrifugal fan is placed in the housing. The wind guide set includes a stepping motor and a guide frame. The stepping motor is installed in the airfoil guide block. The guide frame is integrated into the wind passage and is driven by the motor</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:換氣扇裝置</p>
        <p type="p">10:機座</p>
        <p type="p">11:外蓋</p>
        <p type="p">111:第一入風口</p>
        <p type="p">21:殼體</p>
        <p type="p">214:風道</p>
        <p type="p">215:循環開口</p>
        <p type="p">216:排氣開口</p>
        <p type="p">22:離心扇</p>
        <p type="p">23:翼型導流部</p>
        <p type="p">31:步進馬達</p>
        <p type="p">32:導風板</p>
        <p type="p">321:擋板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="23" publication-number="202616569">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616569</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137290</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器限位塞頭、連接器組件及連接頭組件</chinese-title>
        <english-title>CONNECTOR POSITION LIMITING PLUG, CONNECTOR ASSEMBLY, AND CONNECTION PLUG ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120250122B">H01R12/73</main-classification>
        <further-classification edition="200601120250122B">H01R13/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏正自動科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATEN INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳智明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施佑霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, YOU-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種連接器限位塞頭包括本體與延伸結構。本體的後側具有擋牆。延伸結構從本體的前側往遠離擋牆的方向延伸出，配置以插入連接器的第一插槽中。延伸結構與本體之間有一間隙。延伸結構的底面具有抵接部，抵接部鄰近間隙，抵接部的底端低於本體的底面。當公連接頭插入連接器的第二插槽中後，抵接部配置以抵接公連接頭而往間隙旋轉，並對公連接頭施以彈性壓制力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A connector position limiting plug includes main body and a flexible arm structure. A rear side of the main body has a stop wall. The flexible arm structure extends outward in a direction away from the stop wall from a front side of the main body, and is configured to be inserted into a first insertion port of a connector. There is a gap between the flexible arm structure and the main body. A bottom surface of the flexible arm structure has an abutting portion adjacent to the gap, and a bottom end of the abutting portion is lower than a bottom surface of the main body. After a male connector plug is inserted into a second insertion port of the connector, the abutting portion is configured to abut against the male connector plug to rotate toward the gap and apply an elastic pressing force to the male connector plug.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:連接器限位塞頭</p>
        <p type="p">110:本體</p>
        <p type="p">112:擋牆</p>
        <p type="p">130:延伸結構</p>
        <p type="p">131:凹槽</p>
        <p type="p">132:抵接部</p>
        <p type="p">200:連接器</p>
        <p type="p">210:第一插槽</p>
        <p type="p">212:勾部</p>
        <p type="p">220:第二插槽</p>
        <p type="p">D1:方向</p>
        <p type="p">G:間隙</p>
        <p type="p">P:公連接頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="24" publication-number="202616885">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616885</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137291</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10D84/80</main-classification>
        <further-classification edition="202501120250102B">H10D30/60</further-classification>
        <further-classification edition="202501120250102B">H10D62/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊詠舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YUNG-SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王富民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, FU-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃聖峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHENG-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱鈺梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YU-MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置，包括：基板；第一電晶體，設置於基板上，具有第一操作電壓；以及第二電晶體，設置於基板上，具有第二操作電壓。第一電晶體包括第一半導體層、第一閘極、以及第一絕緣結構，第一絕緣結構設置於第一半導體層與第一閘極之間。第二電晶體包括第二半導體層、第二閘極、以及第二絕緣結構，第二絕緣結構設置於第二半導體層與第二閘極之間。第一操作電壓大於第二操作電壓，且第一絕緣結構的厚度大於第二絕緣結構的厚度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes: a substrate; a first transistor disposed on the substrate and having a first operating voltage; and a second transistor disposed on the substrate and having a second operating voltage. The first transistor includes a first semiconductor layer, a first gate, and a first insulating structure, the first insulating structure is disposed between the first semiconductor layer and the first gate. The second transistor includes a second semiconductor layer, a second gate, and a second insulating structure, the second insulating structure is disposed between the second semiconductor layer and the second gate. The first operating voltage is higher than the second operating voltage, and a thickness of the first insulating structure is larger than a thickness of the second insulating structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電子裝置</p>
        <p type="p">10A:第一元件區</p>
        <p type="p">10B:第二元件區</p>
        <p type="p">100:基板</p>
        <p type="p">120:緩衝結構</p>
        <p type="p">122:絕緣層</p>
        <p type="p">124:絕緣層</p>
        <p type="p">130A:第一半導體層</p>
        <p type="p">130B:第二半導體層</p>
        <p type="p">132A:通道區</p>
        <p type="p">132B:通道區</p>
        <p type="p">134A:輕摻雜區</p>
        <p type="p">134B:輕摻雜區</p>
        <p type="p">136A:重摻雜區</p>
        <p type="p">136B:重摻雜區</p>
        <p type="p">140:絕緣層</p>
        <p type="p">142:絕緣層</p>
        <p type="p">144:絕緣層</p>
        <p type="p">150:絕緣層</p>
        <p type="p">152:絕緣層</p>
        <p type="p">162:第二閘極</p>
        <p type="p">162S:側壁</p>
        <p type="p">170:絕緣層</p>
        <p type="p">172:絕緣層</p>
        <p type="p">174:絕緣層</p>
        <p type="p">180:絕緣層</p>
        <p type="p">182:絕緣層</p>
        <p type="p">192:第一閘極</p>
        <p type="p">600A:第一絕緣結構</p>
        <p type="p">600B:第二絕緣結構</p>
        <p type="p">L1:長度</p>
        <p type="p">L2:長度</p>
        <p type="p">T1:厚度</p>
        <p type="p">T2:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="25" publication-number="202615117">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615117</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137295</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可拆解照射靶結構</chinese-title>
        <english-title>DISMANTLING THE IRRADIATION TARGET STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">A61N5/00</main-classification>
        <further-classification edition="200601120241105B">H01J35/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國家原子能科技研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL ATOMIC RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>褚國源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, KUO-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐奉璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可拆解照射靶結構，係包括一靶背、一靶面、一靶物質坩鍋、一靶支撐器以及數個固定件所構成。本發明設計有坩鍋狀承載槽可容納熔融狀態的靶物質，可對該部位零件直接以水冷方式冷卻以提高散熱效果，並經過特殊設計使靶面可獨立拆卸，此部分設計明顯有別於現有的照射靶設計；本發明利用可拆解的固體照射靶可以適應更多元的靶物質物理特性，尤其適合難以電鍍於照射靶的靶物質使用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A disassembleable irradiation target structure is composed of a target back, a target surface, a target material crucible, a target supporter and several fixing parts. The present invention is designed with a crucible-shaped bearing groove to accommodate the target material in the molten state, the part of this part can be directly cooled in a water-cooled mode to improve the heat dissipation effect, and the target surface can be disassembled independently after special design, and this part design is obviously different from the existing irradiation target design; The present invention can adapt to more diverse physical characteristics of the target substance by utilizing a disassembled solid irradiation target, and is especially suitable for the use of the target substance that is difficult to plating on the irradiation target.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:可拆解照射靶結構</p>
        <p type="p">1:靶背</p>
        <p type="p">2:靶面</p>
        <p type="p">3:靶支撐器</p>
        <p type="p">4:靶物質坩鍋</p>
        <p type="p">5:固定件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="26" publication-number="202616138">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616138</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137298</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>RFID標籤及RFID標籤袋體</chinese-title>
        <english-title>RFID TAG AND BAG HAVING RFID TAG</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">G06K19/077</main-classification>
        <further-classification edition="200601120250203B">H01Q1/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商永道無線射頻標籤(香港)有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARIZON RFID TECHNOLOGY (HONG KONG) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZHENG YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡志炘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, CHIH-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>隋壽齡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種RFID標籤包含耦合天線、接地天線、訊號源結構、連接線段、彎折天線及載體。耦合天線包含傳導段及耦合段。傳導段向第一方向延伸。耦合段由傳導段的一端向第二方向延伸。接地天線與耦合段平行且間隔一間距。訊號源結構包含RFID晶片及迴圈天線，RFID晶片電性連接迴圈天線，且訊號源結構與耦合段位在傳導段的同一側。連接線段的一端連接迴圈天線，且連接線段的另一端連接傳導段。彎折天線由傳導段的另一端延伸出。載體承載耦合天線、訊號源結構、連接線段、接地天線及彎折天線。在此亦揭露一種RFID標籤袋體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An RFID tag includes a coupling antenna, a grounding antenna, a signal source structure, a connection segment, a bent antenna, and a carrier. The coupling antenna includes a conducting segment and a coupling segment. The conducting segment extends in a first direction. The coupling segment extends from an end of the conducting segment in a second direction. The grounding antenna is parallel to the coupling segment and is spaced apart from the the coupling segment by a gap. The signal source structure includes an RFID chip and a loop antenna, with the RFID chip electrically connected to the loop antenna. The signal source structure and the coupling segment are positioned at a same side of the conducting segment. One end of the connection segment is connected to the loop antenna, and another end of the connection segment is connected to the conducting segment. The bent antenna extends from another end of the conducting segment. The carrier is configured to carry the coupling antenna, signal source structure, connection segment, grounding antenna, and bent antenna. A bag having a RFID tag is disclosed as well.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10a:RFID標籤</p>
        <p type="p">100:耦合天線</p>
        <p type="p">102:傳導段</p>
        <p type="p">102a、102b:傳導段的相對兩端部</p>
        <p type="p">110:耦合段</p>
        <p type="p">112:開放端</p>
        <p type="p">130:淨空區</p>
        <p type="p">200:訊號源結構</p>
        <p type="p">210:RFID晶片</p>
        <p type="p">220:迴圈天線</p>
        <p type="p">300:連接線段</p>
        <p type="p">400:接地天線</p>
        <p type="p">500:彎折天線</p>
        <p type="p">505:延伸段</p>
        <p type="p">506:末端</p>
        <p type="p">510:第一短線段</p>
        <p type="p">520:第一長線段</p>
        <p type="p">530:第二短線段</p>
        <p type="p">540:第二長線段</p>
        <p type="p">600:載體</p>
        <p type="p">102L、110L、130W、220L、400L、505L、520L、540L:長度</p>
        <p type="p">102W、110W、220W、300W、400W、505W、510W、520W、530W、540W:寬度</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">G1、G2、G3、G4、G5:間距</p>
        <p type="p">Y:特徵長度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="27" publication-number="202615933">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615933</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137301</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學裝置</chinese-title>
        <english-title>OPTICAL DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">G02B27/18</main-classification>
        <further-classification edition="200601120250102B">G02B5/20</further-classification>
        <further-classification edition="202501120250102B">H10F77/40</further-classification>
        <further-classification edition="200601120250102B">G01M11/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾佳蓉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, CHIA-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供一種光學裝置，包括：鏡頭、雙層轉盤模組、以及感光裝置，沿光軸依序排列。雙層轉盤模組包括：第一轉盤，配置有多個第一光學元件，第一轉盤沿支撐軸旋轉，使多個第一光學元件的一者的中心設置於光軸上；第二轉盤，位於第一轉盤與感光裝置之間，配置有多個第二光學元件，第二轉盤沿支撐軸旋轉，使多個第二光學元件的一者的中心設置於光軸上。第二孔洞包括一第三透光區域與多個第四透光區域。當感光裝置沿光軸與鏡頭的成像視角在第二轉盤產生一第二投影時，第二投影的第一部分包含於第三透光區域中，第二投影的第二部分的一部分包含於多個第四透光區域中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an optical device, including: a lens, a double-layer turntable module, and a photosensitive device, arranged in sequence along the optical axis. The double-layer turntable module includes: a first turntable configured with a plurality of first optical elements. The first turntable rotates along the support axis so that the center of one of the plurality of first optical elements is disposed on the optical axis; a second turntable, located between the first turntable and the photosensitive device, is configured with a plurality of second optical elements, and the second turntable rotates along the support axis so that the center of one of the plurality of second optical elements is disposed on the optical axis. The second hole includes a third light-transmitting area and a plurality of fourth light-transmitting areas. When the photosensitive device generates a second projection on the second turntable along the optical axis and the imaging angle of the lens, the first part of the second projection is included in the third light-transmitting area, and a part of the second portion of the second projection is included in the plurality of fourth light-transmitting areas.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:光學裝置</p>
        <p type="p">20:鏡頭</p>
        <p type="p">22:焦點</p>
        <p type="p">24:透鏡</p>
        <p type="p">40:雙層轉盤模組</p>
        <p type="p">42:支撐軸</p>
        <p type="p">44:第一轉盤</p>
        <p type="p">46:第一孔洞</p>
        <p type="p">48:第一光學元件</p>
        <p type="p">50:第二轉盤</p>
        <p type="p">52:第二孔洞</p>
        <p type="p">54:第二光學元件</p>
        <p type="p">60:感光裝置</p>
        <p type="p">O:光軸</p>
        <p type="p">θ1:視角</p>
        <p type="p">θ2:像角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="28" publication-number="202615220">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615220</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137302</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電動工具及其防拐手控制方法</chinese-title>
        <english-title>A POWER TOOL AND A CONTROL METHOD FOR PREVENTING TORSION OF A HAND</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241211B">B25B23/00</main-classification>
        <further-classification edition="200601120241211B">H02P3/06</further-classification>
        <further-classification edition="200601120241211B">G01P15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鑽全實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASSO INDUSTRY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡承恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHENG-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁碩聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, SHUO-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電動工具防拐手控制方法，包含下列步驟：(A)將一馬達之電流值依一預定的權重階數進行轉換而得出一電流權重值。(B)感測於一工作平面上之加速度運動並輸出一加速度信號，該加速度信號相關該電動工具於一A軸與一B軸的加速度值。(C)取該B軸之加速度值為正值時所對應的該A軸與該B軸的加速度值進行運算，得出一角加速度值。(D)根據該電流權重值與該角加速度值進行運算，得出一運作判斷值。(E)於該運作判斷值大於一門檻值且判斷目前為一運作狀態時，停止該馬達運作。藉此，可在判斷即將發生拐手狀態時即停止馬達運轉，以避免發生工安意外。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power tool and a control method for preventing torsion of a hand includes the following steps: (A) Converting a current value of a motor by a predetermined weighted order to obtain a current weighted value. (B) Sensing an acceleration motion on a working plane and outputting an acceleration signal, the acceleration signal relating to an acceleration value of the power tool on an A - axis and a B - axis. (C) Calculating the acceleration value on the A - axis and the B - axis that corresponds to when the acceleration value on the B - axis is a positive value to obtain an angular acceleration value. (D) Calculating the current weight and the angular acceleration value to obtain an operation determination value. (E) When the operation determination value is greater than a threshold and it is determined that the motor operates in an operational state, the motor is stopped. Thereby, the motor operation is determined to stop when a hand-torsion state is to occur, so as to avoid occurrence of work accidents.</p>
      </isu-abst>
      <representative-img>
        <p type="p">81~87:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="29" publication-number="202616524">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616524</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137303</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靜電放電保護電路</chinese-title>
        <english-title>ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241011B">H01L23/60</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭仁豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, JEN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種靜電放電保護電路，耦接在第一墊以及第二墊之間。靜電放電保護電路包括基板、第二導電型電晶體結構、電阻結構及矽控整流器結構。基板具有第一導電型。第二導電型電晶體結構位在基板中，且具有閘極端。電阻結構位在基板中，且包括第一電阻器。第二導電型電晶體結構的閘極端通過電阻結構耦接到第二墊。矽控整流器結構位在基板中，具有第一端、第二端及第三端。矽控整流器結構的第一端耦接到第一墊，矽控整流器結構的第二端耦接到第二墊，且矽控整流器結構的第三端耦接到第二導電型電晶體結構的閘極端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrostatic discharge (ESD) protection circuit of this invention is provided, the ESD protection circuit is coupled between a first pad and a second pad. The ESD protection circuit includes a substrate having a first conductive type, a transistor structure of a second conductive type, a resistor structure, and a silicon controlled rectifier (SCR) structure. The transistor structure is disposed in the substrate and has a gate terminal. The resistive structure is disposed in the substrate and includes a first resistor. The gate end of the transistor structure is coupled to the second pad through the resistor structure. The SCR structure is disposed in the substrate and has a first end, a second end, and a third end. The first end, the second end, and the third end of the SCR structure are respectively coupled to the first pad, the second pad, and the gate end of the transistor structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:靜電放電保護電路</p>
        <p type="p">130:第一電阻器</p>
        <p type="p">210,220:第一墊，第二墊</p>
        <p type="p">310:矽控整流器結構</p>
        <p type="p">311,322:P型井(第三井)，P型井(第一井)</p>
        <p type="p">312,333:N型井(第四井)，N型井(第二井)</p>
        <p type="p">313,314,315,316:第三重摻雜區，第四重摻雜區，第五重摻雜區，第六重摻雜區</p>
        <p type="p">320:N型(第二導電型)電晶體結構</p>
        <p type="p">324B:基極區</p>
        <p type="p">324D,324S:第一源/汲極區，第二源/汲極區</p>
        <p type="p">324G:閘極電極</p>
        <p type="p">330:電阻結構</p>
        <p type="p">331,332:第一重摻雜區，第二重摻雜區</p>
        <p type="p">340:P型(第一導電型)基板</p>
        <p type="p">Cgd:寄生電容</p>
        <p type="p">Itri:觸發電流</p>
        <p type="p">Qpnp,Qnpn:第二電晶體，第三電晶體</p>
        <p type="p">Rnw,Rpw:第二電阻器，第三電阻器</p>
        <p type="p">Vg:閘極端的電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="30" publication-number="202615215">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615215</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137304</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>角度可調式虎鉗</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241212B">B25B1/22</main-classification>
        <further-classification edition="200601120241212B">B25B1/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聖傑機器工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉嘉盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡杰原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林岳勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱謙成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種角度可調式虎鉗，包含一基座、一設置於基座的第一夾持件、一移動裝置、一第二夾持件及一限制裝置，移動裝置包含一設置於基座的線性移動件，以及一能隨線性移動件移動的軸桿，第二夾持件係能相對於軸桿轉動地套設於軸桿，限制裝置包含一能在限制位置與鬆開位置之間轉換地設於第二夾持件的限制件，限制件位於限制位置時係一部位與移動裝置相接而使限制件與第二夾持件受移動裝置限制轉動，限制件位於鬆開位置時，其所述部位與移動裝置分離；藉此，第二夾持件能設置成自由轉動或被限制轉動，在不同使用狀況下都可達到良好的夾持效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:角度可調式虎鉗</p>
        <p type="p">11:基座</p>
        <p type="p">12:本體</p>
        <p type="p">13:螺桿座</p>
        <p type="p">14:溝槽</p>
        <p type="p">20:移動裝置</p>
        <p type="p">21:線性移動件</p>
        <p type="p">212:前端部</p>
        <p type="p">22:軸桿</p>
        <p type="p">25:把手</p>
        <p type="p">30:第一夾持件</p>
        <p type="p">313:夾持面</p>
        <p type="p">314:圓弧形溝槽</p>
        <p type="p">40:第二夾持件</p>
        <p type="p">45:安裝槽</p>
        <p type="p">50:限制裝置</p>
        <p type="p">52:螺栓</p>
        <p type="p">60:橫移式限制裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="31" publication-number="202616134">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616134</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137305</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>條碼掃描器及其操作方法</chinese-title>
        <english-title>BARCODE SCANNER AND METHOD OF OPERATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">G06K7/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神基科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GETAC TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃成良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHENG-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供了一種條碼掃描器的操作方法。該方法包含：藉由影像擷取裝置擷取影像，影像包含條碼，且影像擷取裝置具有第一焦距，其中影像擷取裝置配置以自動對焦影像；調整影像擷取裝置之第一焦距至第二焦距，且第二焦距不同於第一焦距；掃描影像中之條碼；以及固定第二焦距直至超過時間區間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a method of operating a barcode scanner. The method includes: capturing an image by an image capturing device, the image including a barcode, and the image capturing device having a first focal length, in which the image capturing device is configured to auto-focus the image; adjusting the first focal length of the image capturing device to a second focal length different from the first focal length; scanning the barcode in the image; and fixing the second focal length until a time interval is exceeded.</p>
      </isu-abst>
      <representative-img>
        <p type="p">M:方法</p>
        <p type="p">S101,S102,S103,S104,S105,S106,S107:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="32" publication-number="202616223">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616223</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137311</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於影像的鋼捲定位及辨識方法</chinese-title>
        <english-title>IMAGE-BASED METHOD OF STEEL COIL POSITIONING AND IDENTIFICATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120241204B">G06V10/40</main-classification>
        <further-classification edition="200601120241204B">G01B11/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林哲民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHE-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">基於影像的鋼捲定位及辨識方法包括：控制攝影機以固定頻率擷取影像；偵測影像內的感興趣區域是否包含對應至鋼捲的內孔的第一影像特徵；當偵測出感興趣區域包含第一影像特徵，根據第一影像特徵來對鋼捲的移動狀態進行動態追蹤，從而判斷鋼捲是否已載運到位；當判定鋼捲已載運到位，根據第一影像特徵來定義標籤設置區域；偵測標籤設置區域是否包含對應至紙本標籤的第二影像特徵；及當偵測出標籤設置區域包含第二影像特徵，辨識紙本標籤上的多個字元，並比對所述多個字元與資訊系統所紀錄的鋼捲的身分資訊是否相符。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image-based method of steel coil positioning and identification includes: controlling a camera to capture images at a fixed frequency; detecting whether a region of interest within the image contains a first image feature corresponding to an inner hole of a steel coil; when the region of interest contains the first image feature, dynamically tracking a movement of the steel coil according to the first image feature, thereby determining whether the steel coil has been carried in place; when the steel coil has been carried in place, defining a label area according to the first image feature; detecting whether the label area contains a second image feature corresponding to a label; and when the label area contains the second image feature, identifying multiple characters on the label, and comparing the characters with an identity information recorded by an information system to determine whether the characters match the identity information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S12:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="33" publication-number="202616803">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616803</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137312</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>導熱塊及散熱裝置與電路板總成的組合</chinese-title>
        <english-title>THERMAL CONDUCTIVE BLOCK AND COMBINATION OF HEAT DISSIPATION DEVICE AND PRINTED CIRCUIT BOARD ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">H05K7/20</main-classification>
        <further-classification edition="200601120241204B">G06F1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>致茂電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHROMA ATE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉崇琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHONG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃建興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIEN HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種散熱裝置與電路板總成的組合，包含一電路板總成，及一散熱裝置。該電路板總成包括一電路板，及一電子元件。該電路板具有一底面，及相反於該底面的一頂面。該電路板形成有延伸於該底面與該頂面之間的一穿孔。該電子元件設置於該頂面且位於該穿孔頂端。該散熱裝置包括設置於該底面的一散熱器，及嵌入該穿孔且熱連接於該散熱器與該電子元件之間的一導熱塊。藉此，能有效地提升該散熱裝置的散熱速度及效率並能滿足高功率的該電子元件所需的快速導熱及散熱的需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A combination of heat dissipation device and printed circuit board assembly comprising a printed circuit board assembly, and a heat dissipation device. The printed circuit board assembly includes a printed circuit board, and an electronic component. The printed circuit board has a bottom surface, and a top surface opposite to the bottom surface. The printed circuit board is formed with a through hole extending between the bottom surface and the top surface. The electronic component disposed on the top surface and located at the top of the through hole. The heat dissipation device includes a radiator disposed on the bottom surface, and a thermal conductive block embedded in the through hole and thermally connected between the radiator and the electronic component. Thus, the heat dissipation speed and efficiency of the heat dissipation device can be effectively improved and the rapid heat conduction and heat dissipation requirements required by the high-power electronic component can be met.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:散熱裝置與電路板總成的組合</p>
        <p type="p">1:電路板總成</p>
        <p type="p">11:電路板</p>
        <p type="p">111:底面</p>
        <p type="p">112:頂面</p>
        <p type="p">113:穿孔</p>
        <p type="p">12:電子元件</p>
        <p type="p">2:散熱裝置</p>
        <p type="p">21:散熱器</p>
        <p type="p">211:上端面</p>
        <p type="p">212:平面</p>
        <p type="p">213:側面</p>
        <p type="p">214:容置槽</p>
        <p type="p">22:導熱塊</p>
        <p type="p">221:第一塊體</p>
        <p type="p">222:第二塊體</p>
        <p type="p">223:下表面</p>
        <p type="p">224:上表面</p>
        <p type="p">225:抵止面</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="34" publication-number="202616563">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616563</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137313</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁電偶極天線陣列</chinese-title>
        <english-title>MAGNETO-ELECTRIC DIPOLE ANTENNA ARRAY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">H01Q21/06</main-classification>
        <further-classification edition="200601120250203B">H01Q15/24</further-classification>
        <further-classification edition="200601120250203B">H01Q3/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明泰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPHA NETWORKS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白大川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAI, TA-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林丁丙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, DING-BING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝松年</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, SUNG-NIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許茗榤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, MING-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種磁電偶極天線陣列，包含一基板及至少一天線單元。該基板具有相反的一上表面及一下表面。該至少一天線單元包含一電偶極元件、一磁偶極元件、一第一饋入探針、一第二饋入探針及一帶狀線。該電偶極元件設置於該基板的該上表面。該磁偶極元件設置於該基板中且位於該上表面與該下表面之間，並且與該電偶極元件電連接。該第一饋入探針設置於該基板的該上表面用以垂直極化。該第二饋入探針設置於該基板的該上表面與該下表面之間用以水平極化。該帶狀線設置於該第一饋入探針與第二饋入探針之間用以電容耦合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A magneto-electric dipole antenna array includes a substrate and at least one antenna unit. The substrate has an upper surface and a lower surface opposite to each other. Said at least one antenna unit includes an electric-dipole component, a magnetic-dipole component, a first feeding probe, a second feeding probe and a stripline. The electric-dipole component is disposed on the upper surface of the substrate. The magnetic-dipole component is disposed in the substrate and between the upper surface and the lower surface, and is electrically connected to the electric-dipole component. The first feeding probe is disposed on the upper surface of the substrate for vertical polarization. The second feeding probe is disposed between the upper surface and the lower surface for horizontal polarization. The stripline is disposed between the first feeding probe and the second feeding probe for capacitive coupling.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">11:上表面</p>
        <p type="p">12:下表面</p>
        <p type="p">2:天線單元</p>
        <p type="p">21:電偶極元件</p>
        <p type="p">211:導電矩形貼片</p>
        <p type="p">22:磁偶極元件</p>
        <p type="p">221:導電柱</p>
        <p type="p">231:第一饋入探針</p>
        <p type="p">232:第一饋入線</p>
        <p type="p">233:第一導電連接線</p>
        <p type="p">241:第二饋入探針</p>
        <p type="p">242:第二饋入線</p>
        <p type="p">243:第二導電連接線</p>
        <p type="p">25:帶狀線</p>
        <p type="p">26:接地層</p>
        <p type="p">27:L型寄生共振器</p>
        <p type="p">28:蜿蜒型寄生共振器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="35" publication-number="202616592">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616592</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137314</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用外注光斑進行雷射模態整形的雷射裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250512B">H01S3/10</main-classification>
        <further-classification edition="202301120250512B">H01S3/08</further-classification>
        <further-classification edition="200601120250512B">H01S3/091</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷大光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEDLAS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃衍介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YEN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種雷射裝置包含一雷射腔、一端注入雷射、一側泵源及一雷射模態整形器。該雷射腔包括一增益介質，且產生一沿著該雷射腔的一軸向方向的輸出雷射光束。該端注入雷射在該軸向方向朝向該雷射腔發射一端注入射雷射光束。該側泵源為該增益介質提供一泵光。該雷射模態整形器用於對該端注入雷射的雷射光強度進行空間再分布，讓經由該端注入雷射發出並注入至該增益介質的該端注入雷射光束為具有空間再分布強度。該雷射腔用於產生具有一輸出模態的該輸出雷射光束，且該輸出模態為模擬投射至該增益介質的該端注入雷射光束的該注入模態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:雷射腔</p>
        <p type="p">11:第一腔鏡</p>
        <p type="p">12:第二腔鏡</p>
        <p type="p">13:增益介質</p>
        <p type="p">150:輸出雷射光束</p>
        <p type="p">2:端注入雷射</p>
        <p type="p">200:端注入雷射光束</p>
        <p type="p">3:側泵源</p>
        <p type="p">4:雷射模態整形器</p>
        <p type="p">41:固定圖案遮罩</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="36" publication-number="202615089">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615089</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137315</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於促進傷口癒合的組成物及其用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">A61K38/39</main-classification>
        <further-classification edition="200601120250501B">A61K38/02</further-classification>
        <further-classification edition="200601120250501B">A61P17/00</further-classification>
        <further-classification edition="200601120250501B">A61P17/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰陞國際科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱育普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張益萌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於促進傷口癒合的組成物，其包含有呈一範圍落在1：3至3：1內之重量比的胺基酸以及魚膠原蛋白，該胺基酸包括甘胺酸與脯胺酸。本發明亦揭示該組成物可被用來促進傷口癒合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="37" publication-number="202615841">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615841</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137317</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>混合還原氣氛下鐵礦石還原度計算之裝置與方法</chinese-title>
        <english-title>DEVICE AND METHOD FOR ASSESSING REDUCTION DEGREE OF IRON ORE IN COMPOSED REDUCING GAS ENVIRONMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241205B">G01N5/04</main-classification>
        <further-classification edition="202101120241205B">G01N27/62</further-classification>
        <further-classification edition="200601120241205B">C21B13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-KANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱鈺甯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YU-NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃聰彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TSUNG-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭嘉賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIAU, JIA-SHYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張凱鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KAI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜憲文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DU, SHAN-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種混合還原氣氛下鐵礦石還原度計算之裝置與方法。該裝置包含：氣密加熱裝置，用以將反應樣品加熱；進氣裝置，與氣密加熱裝置相連接，用以將惰性氣體和/或還原氣體通入氣密加熱裝置中；氣體分析裝置，用以分析部分尾氣；熱重分析裝置，用以分析因還原產生的重量變化；氣體對流緩衝部，設置於氣密加熱裝置與熱重分析裝置之間，用以減緩氣體回流對熱重分析裝置之測量的擾動；氣體分流裝置，設置於氣體對流緩衝部和氣體分析裝置之間，用以將尾氣分流，使得尾氣保持流速恆定量或流量恆定量，其中根據氣體分析裝置之測值和熱重分析裝置之測值，分別計算在不同還原氣氛下造成之鐵礦還原度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device and a method for assessing the reduction degree of iron ore in a composed reducing gas environment are provided. The device includes a hermetic heating device for heating a reaction sample; an air intake device connected to the hermetic heating device, configured to introduce an inert gas and/or a reducing gas into the hermetic heating device; a gas analysis device configured to analyze a part of exhaust gases; a thermogravimetric analysis device configured to analyze weight changes caused by reduction; a gas convection buffer section provided between the hermetic heating device and the thermogravimetric analysis device, configured to mitigate the disturbance of gas reflux on the measurement of the thermogravimetric analysis device; a gas shunt device provided between the gas convection buffer section and the gas analysis device to shunt the exhaust gas thereby maintaining the exhaust gas at a constant flow rate or a constant flow, in which the reduction rate of iron ore under different reducing gas is calculated according to the measured values of the gas analysis device and the thermogravimetric analysis device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:裝置</p>
        <p type="p">100:氣密加熱裝置</p>
        <p type="p">110:進氣裝置</p>
        <p type="p">120:氣體分析裝置</p>
        <p type="p">130:熱重分析裝置</p>
        <p type="p">140:氣體對流緩衝部</p>
        <p type="p">150:氣體分流裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="38" publication-number="202616625">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616625</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137319</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>降壓轉換器</chinese-title>
        <english-title>BUCK CONVERTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">H02M3/156</main-classification>
        <further-classification edition="200601120250102B">H02M1/08</further-classification>
        <further-classification edition="200601120250102B">G05F1/565</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇景光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIMAX TECHNOLOGIES LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏嘉玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, CHIA LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊耀傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUAN, YAO CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡文丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, WEN CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林敬倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種降壓轉換器，包含功率級電路，於輸出節點提供輸出電壓；感測電路，感測功率級電路之儲能元件，以產生回授信號；控制電路，根據回授信號以產生控制信號；及驅動電路，受控於控制信號以產生偏壓及驅動電壓，用以驅動功率級電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A buck converter includes a power stage circuit that provides an output voltage at an output node; a sensing circuit that senses an energy storage element of the power stage circuit to generate a feedback signal; a control circuit that generates control signals according to the feedback signal; and a driving circuit, controlled by the control signal to generate bias voltages and driving voltages to drive the power stage circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:降壓轉換器</p>
        <p type="p">10:負載</p>
        <p type="p">11:功率級電路</p>
        <p type="p">12:感測電路</p>
        <p type="p">13:控制電路</p>
        <p type="p">14:驅動電路</p>
        <p type="p">V&lt;sub&gt;OUT&lt;/sub&gt;:輸出電壓/輸出節點</p>
        <p type="p">V&lt;sub&gt;F_DIV&lt;/sub&gt;:回授信號</p>
        <p type="p">SWn_low:第一控制信號</p>
        <p type="p">SWp_low:第二控制信號</p>
        <p type="p">V&lt;sub&gt;NBIAS&lt;/sub&gt;:第一偏壓</p>
        <p type="p">V&lt;sub&gt;PBIAS&lt;/sub&gt;:第二偏壓</p>
        <p type="p">N_drive:第一驅動電壓</p>
        <p type="p">P_drive:第二驅動電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="39" publication-number="202616769">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616769</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137326</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>網路管理系統及其操作方法</chinese-title>
        <english-title>NETWORK MANAGEMENT SYSTEM AND OPERATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120250203B">H04W88/18</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃暐傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEI-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方澤涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, TSE-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信捷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSIN CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種網路管理系統及其操作方法。操作方法包括：根據連線指示訊號與基地台元件進行連線以取得組構資料；將連線資訊及組構資料輸入人工智慧模型以取得元件參數；根據元件參數產生待儲存參數，並根據待儲存參數決定資料庫名稱，並且將待儲存參數及資料庫名稱輸入人工智慧模型以取得儲存語法；基於儲存語法將待儲存參數及連線資訊儲存至對應於資料庫名稱的資料庫；指示人工智慧模型基於組構資料產生對應於基地台元件的修改指令；將修改指令輸出至基地台元件；週期性地自基地台元件接收效能檔案，並據以輸出可讀性佳的標準效能檔案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A network management system and an operation method thereof are provided. The operation method includes: connecting with a base station component according to a connection instruction signal to obtain an organizational data; inputting a connection information and the organizational data into an artificial intelligence model to obtain a component parameter; generating a parameter to be stored and determining a database name based on the parameter to be stored, and inputting the parameter to be stored and the database name into the artificial intelligence model to obtain a storage syntax; storing the parameter to be stored and the connection information to a database corresponding to the database name based on the storage syntax; instructing the artificial intelligence model to generate a modification command corresponding to the base station component based on the organizational data; outputting the modification command to the base station component; periodically receiving a performance file from the base station component and outputting a standard performance file with good readability according to the performance file.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:網路管理系統</p>
        <p type="p">110:處理器</p>
        <p type="p">120:儲存媒體</p>
        <p type="p">121:核心模組</p>
        <p type="p">122:資源收集模組</p>
        <p type="p">1221、1222、1223:資源收集單元</p>
        <p type="p">123:人工智慧模型</p>
        <p type="p">124:南向介面模組</p>
        <p type="p">125:訊息中介模組</p>
        <p type="p">130:收發器</p>
        <p type="p">200-1、200-2、200-3:基地台元件</p>
        <p type="p">300-1、300-2、300-N:資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="40" publication-number="202616558">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616558</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137327</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>背光模組</chinese-title>
        <english-title>BACKLIGHT MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241217B">H01Q1/22</main-classification>
        <further-classification edition="200601120241217B">H01Q1/44</further-classification>
        <further-classification edition="200601120241217B">G02F1/1333</further-classification>
        <further-classification edition="200601120241217B">G02F1/13357</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡政霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, JENG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許仲𪟩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHUNG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王宏祺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUNG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林卓賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUO HSIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種背光模組包括驅動線路基板、多個發光元件及天線。驅動線路基板具有發光元件驅動線路。多個發光元件設置於驅動線路基板上，且電性連接至發光元件驅動線路。天線設置於驅動線路基板上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A backlight module includes a driving circuit substrate, light-emitting elements and an antenna. The driving circuit board has a light-emitting element driving circuit. The light-emitting elements are disposed on the driving circuit substrate and are electrically connected to the light-emitting element driving circuit. The antenna is disposed on the driving circuit substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:背光模組</p>
        <p type="p">100:驅動線路基板</p>
        <p type="p">100a:第一表面</p>
        <p type="p">100b:第二表面</p>
        <p type="p">100c:天線覆蓋區</p>
        <p type="p">100d:非天線覆蓋區</p>
        <p type="p">110:發光元件驅動線路</p>
        <p type="p">112:鏤空處</p>
        <p type="p">200:發光元件</p>
        <p type="p">300:天線</p>
        <p type="p">400:反射片</p>
        <p type="p">410、620:開口</p>
        <p type="p">500:導磁元件</p>
        <p type="p">600:外殼</p>
        <p type="p">610:容置空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="41" publication-number="202615939">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615939</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137328</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示面板</chinese-title>
        <english-title>DISPLAY PANEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250210B">G02F1/1333</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇柏元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, BO YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李尹婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YIN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示面板，包括基板、至少一微晶片、反射蓋以及多個發光元件。基板具有第一表面及第二表面。至少一微晶片電性連接於基板且位於第一表面。反射蓋覆蓋至少一微晶片。反射蓋包括多個開孔。所述多個發光元件電性連接於基板且位於第一表面。所述多個發光元件位於所述多個開孔中。排氣結構設置於基板內且自第一表面穿透至第二表面，以排除反射蓋與至少一微晶片之間的氣泡。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display panel includes a substrate, at least one microchip, a reflective cover and a plurality of light-emitting elements. The substrate has a first surface and a second surface. The at least one microchip is electrically connected with the substrate and is located on the first surface. The reflective cover covers the at least one microchip and includes a plurality of openings. The plurality of light-emitting elements are electrically connected with the substrate and are located on the first surface. The plurality of light-emitting elements are located in the plurality of openings. An exhaust structure is disposed in the substrate and penetrates from the first surface to the second surface to eliminate a bubble between the reflective cover and the at least one microchip.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示面板</p>
        <p type="p">110:基板</p>
        <p type="p">111:第一表面</p>
        <p type="p">112:第二表面</p>
        <p type="p">120:微晶片</p>
        <p type="p">121:側面</p>
        <p type="p">130:反射蓋</p>
        <p type="p">131:開孔</p>
        <p type="p">140:發光元件</p>
        <p type="p">150:排氣結構</p>
        <p type="p">160:覆蓋層</p>
        <p type="p">B:氣泡</p>
        <p type="p">S:空隙</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="42" publication-number="202615905">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615905</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137329</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>導光板與光源裝置</chinese-title>
        <english-title>LIGHT GUIDE PLATE AND LIGHT SOURCE DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241212B">G02B6/00</main-classification>
        <further-classification edition="200601120241212B">G02F1/1335</further-classification>
        <further-classification edition="200601120241212B">G02F1/13357</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>誠屏科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAMP VISION DISPLAY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉勁谷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIN-KU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳中豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUNG-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種導光板與包括此導光板的光源裝置。導光板具有入光面以及第一表面，第一表面具有沿著一第一方向延伸的多個假想參考定位線，在第一表面上對應每一假想參考定位線分別設置有至少一光學微結構組。每一光學微結構組分別具有多個棒狀微結構，且在第一表面上的多個假想參考定位線中的部分棒狀微結構形成為圖案微結構群。在俯視第一表面時，圖案微結構群的每一棒狀微結構與第一表面交界的交界線的中垂線均通過光源中的發光元件的發光面的中心點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light guide plate and a light source device including the light guide plate are provided. The light guide plate has a light incident surface and a first surface. The first surface has a plurality of imaginary reference positioning lines extending along a first direction. At least one optical microstructure group is provided on the first surface correSP1、SP2onding to each of the imaginary reference positioning lines. Each optical microstructure group has a plurality of rod-shaped microstructures, and some of the rod-shaped microstructures on the plurality of imaginary reference positioning lines of the first surface are formed as a patterned microstructure group. When plan viewing at the first surface, a mid-perpendicular line of a junction line between each of the rod-shaped microstructure of the patterned microstructure group and the first surface passes through a center point of a light-emitting surface of a light-emitting element of a light source, and some of the optical surfaces of the rod-shaped microstructures of the patterned microstructure group are not parallel to each other.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:導光板</p>
        <p type="p">200:光源裝置</p>
        <p type="p">210:光源</p>
        <p type="p">BS:交界線</p>
        <p type="p">D1:第一方向</p>
        <p type="p">LE:發光元件</p>
        <p type="p">LS:發光面</p>
        <p type="p">MS:棒狀微結構</p>
        <p type="p">OG、OG1、OG2a、OG2b、OG3:光學微結構組</p>
        <p type="p">P:組成圖案</p>
        <p type="p">PL、PL1、PL2、PL3:假想參考定位線</p>
        <p type="p">PG:圖案微結構群</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="43" publication-number="202616249">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616249</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137330</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120241029B">G09G3/32</main-classification>
        <further-classification edition="200601120241029B">G09G5/02</further-classification>
        <further-classification edition="200601120241029B">G02B5/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育玄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-SYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置包括驅動背板、堤岸層、多個發光元件及彩色濾光基板。堤岸層設置於驅動背板上，且具有第一開口、第二開口及第三開口，其中第一開口及第二開口位於第三開口的同一側。多個發光元件位於第一開口、第二開口及第三開口中，且電性連接至驅動背板。彩色濾光基板設置於驅動背板的對向。彩色濾光基板具有黃色濾光圖案及青色濾光圖案。黃色濾光圖案位於第一開口及第二開口上。青色濾光圖案位於第三開口上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display apparatus includes a driving backplane, a bank layer, light-emitting elements and a color filter substrate. The bank layer is disposed on the driving backplane and has a first opening, a second opening and a third opening, wherein the first opening and the second opening are located on the same side of the third opening. The light-emitting elements are located in the first opening, the second opening and the third opening, and are electrically connected to the driving backplane. The color filter substrate is disposed opposite to the driving backplane. The color filter substrate has a yellow filter pattern and a cyan filter pattern. The yellow filter pattern is located above the first opening and the second opening. The cyan filter pattern is located above the third opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:顯示裝置</p>
        <p type="p">110:驅動背板</p>
        <p type="p">120:焊墊組</p>
        <p type="p">120M:主要焊墊組</p>
        <p type="p">120M’:閒置焊墊組</p>
        <p type="p">120M-1:第一主要焊墊組</p>
        <p type="p">120R:備用焊墊組</p>
        <p type="p">120R-1:第一備用焊墊組</p>
        <p type="p">120R-2:第二備用焊墊組</p>
        <p type="p">122:焊墊</p>
        <p type="p">130:堤岸層</p>
        <p type="p">132:開口</p>
        <p type="p">132-1:第一開口</p>
        <p type="p">132-2:第二開口</p>
        <p type="p">132-3:第三開口</p>
        <p type="p">140、140’:發光元件</p>
        <p type="p">140-1:第一發光元件</p>
        <p type="p">140-2’:第二發光元件</p>
        <p type="p">140-3’:第三發光元件</p>
        <p type="p">150:光學結構</p>
        <p type="p">151:色轉換圖案</p>
        <p type="p">152:第一透光圖案</p>
        <p type="p">153:第二透光圖案</p>
        <p type="p">210:遮光圖案層</p>
        <p type="p">212:開口</p>
        <p type="p">212-1:第一開口</p>
        <p type="p">212-2:第二開口</p>
        <p type="p">220:彩色濾光圖案</p>
        <p type="p">220Y:黃色濾光圖案</p>
        <p type="p">220C:青色濾光圖案</p>
        <p type="p">W1、W2:寬度</p>
        <p type="p">PX:畫素區</p>
        <p type="p">SPX1:第一子畫素區</p>
        <p type="p">SPX2:第二子畫素區</p>
        <p type="p">SPX3:第三子畫素區</p>
        <p type="p">I-I’、II-II’、III-III’:線段</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="44" publication-number="202616743">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616743</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137331</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於行動邊緣運算之用戶分群組網資訊開放之系統及其方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR USER GROUP NETWORK INFORMATION OPENING BASED ON MOBILE EDGE COMPUTING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120250203B">H04W8/18</main-classification>
        <further-classification edition="200901120250203B">H04W4/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王柏崴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LI-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李岳峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YUEH-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏勝盈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, SHENG-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基於行動邊緣運算之用戶分群組網資訊開放之系統及其方法，方法包括用戶於行動邊緣運算系統區域上線時，經由基地台接收用戶的用戶封包，以獲取用戶資訊，用戶資訊包括用戶識別資訊，並傳送用戶識別資訊；依據用戶識別資訊識別用戶並且儲存用戶的上下線狀態資訊；依據上下線狀態資訊從用戶供裝規則資料庫中查詢與用戶對應的用戶供裝規則，並且傳送用戶供裝規則；以及依據用戶供裝規則進行用戶分群組網以及用戶間連線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and method for user group network information opening base on mobile edge computing is provided, the method includes receiving a user’s user packet through a base station to obtain user information when the user is online in a mobile edge computing system area, the user information includes user identification information, and transmitting the user identification information, identifying the user according to the user identification information and storing user online and offline status information, querying user installation rules corresponding to the user from a user installation rule database according to the online and offline status information, and transmitting the user installation rules, and performing user group networking and connection between the users according to the user installation rules.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基於行動邊緣運算之用戶分群組網資訊開放之系統</p>
        <p type="p">11:封包處理模組</p>
        <p type="p">12:用戶識別記憶模組</p>
        <p type="p">13:用戶分群組網管控模組</p>
        <p type="p">14:用戶供裝規則資料庫</p>
        <p type="p">20:基地台</p>
        <p type="p">30:用戶</p>
        <p type="p">40:管理者網頁</p>
        <p type="p">50:資訊開發平台API</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="45" publication-number="202616130">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616130</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137332</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>應用平台操作模式分析方法及裝置</chinese-title>
        <english-title>METHOD AND APPARATUS FOR ANALYSING OPERATION MODE OF APPLICATION PLATFORM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250203B">G06F30/398</main-classification>
        <further-classification edition="202001120250203B">G06F30/39</further-classification>
        <further-classification edition="200601120250203B">G06F11/34</further-classification>
        <further-classification edition="200601120250203B">G06F11/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘嗣文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, TZI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雍有明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONG, YOU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林正豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHENG-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種應用平台操作模式分析方法及裝置。所述方法包括下列步驟：擷取應用平台對產品執行操作所產生的操作訊號，並將操作訊號轉換為文字形式的指令序列；根據產品的資料表單，定義由應用平台對產品進行操作的多個操作組合作為目標語句以建立語句查詢地圖；根據語句查詢地圖中的各目標語句，利用N元語法演算法對指令序列進行掃描，以找出指令序列中符合目標語句的多個指令語句；以及計算各指令語句的多個時間參數並進行統計，輸出各指令語句依時序的統計結果，以模擬應用平台在各時序的操作模式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and an apparatus for analysing an operation mode of an application platform are provided. The method includes following steps: capturing operation signals generated by the application platform performing operations on a product, and converting the operation signals into a command sequence in a text form; defining multiple operation combinations operated by the application platform on the product as target sentences to establish a sentence finding map according to a data sheet of the product; scanning, according to each target sentence in the sentence finding map, the command sequence by using N-gram algorithm to find multiple command sentences in the command sequence that match the target sentence; and calculating multiple time parameters of each command sentence and performing statistics on the command sentences, and outputting a statistical result of each command sentence in time series to simulate the operation mode of the application platform in each time series.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S302~S308:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="46" publication-number="202615304">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615304</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137336</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>托盤模組</chinese-title>
        <english-title>TRAY MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">B65D19/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>致伸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRIMAX ELECTRONICS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭瑞仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, JUI-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHANG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種托盤模組，其包括底板、環形件、限位件、彈性件及托盤。環形件設置在底板上方，並且包括多個滾動部面向底板。限位件設置在環形件的外圍及環形件上方，使環形件僅能在限位件限定的區域內移動。彈性件直接或間接連接在環形件的內環表面與底板的上表面之間。托盤設置在限位件上方，並且設置用以連接環形件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A tray module includes a bottom plate, a ring member, a limiting member, an elastic member and a tray. The ring member is disposed over the bottom plate and includes a plurality of rolling portions facing the bottom plate. The limiting member is disposed at a periphery of the ring member and over the ring member, so that the ring member is only able to move within a region defined by the limiting member. The elastic member is directly or indirectly connected between an inner ring surface of the ring member and an upper surface of the bottom plate. The tray is disposed over the limiting member and configured to be connected to the ring member.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:底板</p>
        <p type="p">120:環形件</p>
        <p type="p">130:限位件</p>
        <p type="p">132:限位柱</p>
        <p type="p">134:限位板</p>
        <p type="p">150:托盤</p>
        <p type="p">150t:貫孔</p>
        <p type="p">170:隔震墊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="47" publication-number="202615815">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615815</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137337</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有全域反捲積表面形貌重建的線掃描彩色共焦量測系統</chinese-title>
        <english-title>LINE-SCAN CHROMATIC CONFOCAL SYSTEM HAVING FULL-FIELD DECONVOLUTION FOR RECONSTRUCTING SURFACE PROFILE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241213B">G01B11/24</main-classification>
        <further-classification edition="200601120241213B">G01B11/30</further-classification>
        <further-classification edition="200601120241213B">G01J3/28</further-classification>
        <further-classification edition="200601120241213B">G02B26/10</further-classification>
        <further-classification edition="201701120241213B">G06T7/44</further-classification>
        <further-classification edition="200601120241213B">G06F17/15</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳亮嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LIANG-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡翰儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HAN-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林礽俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有全域反捲積表面形貌重建的線掃描彩色共焦量測系統，包括有產生線形偵測光的光源模組、第一空間濾波器、色散模組以及光譜分析裝置。第一空間濾波器將線形偵測光濾波成線形濾波光。色散模組將線形濾波光色散，以形成色散光投射至待測物上，再反射形成測物光。光譜分析裝置用以接收與解析測物光，光譜分析裝置更具有第二空間濾波器、光譜儀以及運算處理單元。第二空間濾波器對測物光進行濾波以形成濾波測物光。光譜儀接收濾波測物光以產生相應的光譜資訊。運算處理單元具有點擴散函數，運算處理單元接收光譜資訊，並將點擴散函數和光譜資訊進行反捲積演算，以重建該待測物之表面形貌影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A line-scan chromatic confocal system with full-field deconvolution for reconstructing surface profile comprises a light source module for generating a detecting light, a first spatial filter, an image module, and a spectrum analyzing device. The first spatial filter filters the detecting light to form a filtered detecting light. The dispersing module disperses the filtered detecting light to form a dispersed light projecting onto a sample thereby forming an object light reflecting from the sample. The spectrum analyzing device receiving and analyzing the object light further comprises a second spatial filter, a spectrometer, and a processing unit. The object light is filtered by the second spatial filter so as to form a filtered object light. The spectrometer receives the filtered object light and generates a spectrum information corresponding to the filtered object light. The processing unit having a point spread function (PSF) receives the spectrum information and performs a deconvolution calculation using the PSF and spectrum information for reconstructing a surface profile image with respect to the sample.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:線掃描彩色共焦量測系統</p>
        <p type="p">20:光源模組</p>
        <p type="p">200:發光源</p>
        <p type="p">201:準直鏡</p>
        <p type="p">202:調制鏡組</p>
        <p type="p">202a:擴束鏡組</p>
        <p type="p">202b:消色差鏡組</p>
        <p type="p">202c、202d:膠合凸透鏡</p>
        <p type="p">220:準直鏡組</p>
        <p type="p">221:分光元件</p>
        <p type="p">222:振鏡元件</p>
        <p type="p">223:第一掃描鏡組</p>
        <p type="p">224:色散物鏡</p>
        <p type="p">225:第二掃描鏡組</p>
        <p type="p">226:線性偏振片</p>
        <p type="p">21:第一空間濾波器</p>
        <p type="p">22:色散模組</p>
        <p type="p">23:光譜分析裝置</p>
        <p type="p">230:偏極分光元件</p>
        <p type="p">231:第二空間濾波器</p>
        <p type="p">232:光譜儀</p>
        <p type="p">233:運算處理單元</p>
        <p type="p">24:圓柱凹透鏡</p>
        <p type="p">25:擴散片</p>
        <p type="p">90:發射出光束</p>
        <p type="p">91:線形偵測光</p>
        <p type="p">92:線形濾波光</p>
        <p type="p">93:測物光</p>
        <p type="p">94:濾波測物光</p>
        <p type="p">92a:線形色散光</p>
        <p type="p">920~922:線形色散光</p>
        <p type="p">S:待測物</p>
        <p type="p">SP:乘載台</p>
        <p type="p">FP:前焦面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="48" publication-number="202616195">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616195</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137340</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>帳戶風險預警系統及其方法</chinese-title>
        <english-title>ACCOUNT RISK WARNING SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241230B">G06Q40/02</main-classification>
        <further-classification edition="201201120241230B">G06Q20/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺灣土地銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAND BANK OF TAIWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孔盈傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHONG, ING-KIAT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種帳戶風險預警系統包括通訊模組、資訊整合模組及風險預警模組。上述通訊模組用以接收及傳輸資訊。上述資訊整合模組用於整合通訊模組傳輸之多個帳戶狀態訊息，生成一帳戶狀態整合報告。上述風險預警模組根據歷史帳戶活動數據分析並識別一風險條件，並判斷帳戶狀態整合報告是否符合風險條件，當符合時，風險預警模組生成一風險預警資訊，傳輸至多個交易系統及對應的客戶通訊裝置，並在多個交易系統標示對應帳戶的風險狀態。風險預警模組還透過通訊模組將對應的帳戶狀態整合報告傳輸至AML洗錢系統，用以進行洗錢判斷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An account risk warning system includes a communication module, an information integration module, and a risk alert module. The communication module is designed to receive and transmit information. The information integration module consolidates multiple account status messages received through the communication module and generates an account status integration report. The risk alert module analyzes historical account activity data to identify a risk condition and assesses whether the account status integration report meets the risk condition. When the condition is met, the risk alert module generates a risk alert message, which is transmitted to multiple transaction systems and the corresponding customer communication devices, and marks the corresponding account's risk status within the multiple transaction systems. The risk alert module further transmits the corresponding account status integration report to the AML (Anti-Money Laundering) system via the communication module for money laundering evaluation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:帳戶風險預警系統</p>
        <p type="p">110:通訊模組</p>
        <p type="p">120:資訊整合模組</p>
        <p type="p">130:帳務查詢模組</p>
        <p type="p">140:風險預警模組</p>
        <p type="p">150:報表模組</p>
        <p type="p">160:交易系統</p>
        <p type="p">170:客戶通訊裝置</p>
        <p type="p">180:AML洗錢系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="49" publication-number="202616573">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616573</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137349</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器</chinese-title>
        <english-title>CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241029B">H01R13/22</main-classification>
        <further-classification edition="200601120241029B">H01R13/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祥峰實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIMMET INDUSTRIAL CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳祥峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIANG FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭俐瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之連接器，至少包含：一殼體與一端子座，前述殼體設端子座槽，前述端子座係自前述端子座槽後側往前置入前述殼體。前述殼體的前端部的上方設連接卡榫，前述連接卡榫係自前述殼體之前端部往後延伸到前述殼體的後端部，前述後端部設保護元件，以包覆前述連接卡榫的後端，且不會影響該連接卡榫的操作。前述端子座係安裝在前述端子座槽內。如此，藉由前述保護元件以防止前述連接卡榫被碰撞斷裂，而影響其與其它連接器之連接結合，並確保連接器的訊號可正常傳輸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention relates to a connector, which includes at least a casing and a terminal base. Said casing provided with a terminal base cavity, and said terminal seat inserted into said casing from the rear side of said terminal base cavity. A connecting latch provided above the front end of said housing, and said connecting latch extends backward from a front end portion of said casing to a rear end portion of the casing. A protective member provided at said rear end portion to cover the rear end of said connecting latch and will not affect the operation of said connecting latch. Said terminal base is arranged in said terminal base cavity. In this way, said protective member is used to prevent the connecting latch from being broken by impact, thereby affecting its connection with other connectors, and ensuring that the signal of the connector can be transmitted normally.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:殼體</p>
        <p type="p">10:前端部</p>
        <p type="p">11:後端部</p>
        <p type="p">12:端子座槽</p>
        <p type="p">13:連接卡榫</p>
        <p type="p">14:保護元件</p>
        <p type="p">140:第一邊面</p>
        <p type="p">141:第二邊面</p>
        <p type="p">142:第三邊面</p>
        <p type="p">143:容置空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="50" publication-number="202616056">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616056</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137353</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>觸控感測裝置以及用於觸控感測裝置的操作方法</chinese-title>
        <english-title>TOUCH SENSING DEVICE AND OPERATING METHOD FOR TOUCH SENSING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241211B">G06F3/041</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奕力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ILI TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜俊宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, CHUN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種觸控感測裝置以及用於觸控感測裝置的操作方法。觸控感測裝置包括觸控感測電極陣列、參考電極、第一前端電路、第二前端電路以及控制器。參考電極圍繞觸控感測電極陣列。第一前端電路接收來自於觸控感測電極陣列的第一觸控感測信號。第二前端電路接收來自於參考電極的第二觸控感測信號。基於發生於觸控感測電極陣列的邊緣的觸控事件，控制器依據第一觸控感測信號以及第二觸控感測信號來判斷觸控事件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A touch sensing device and an operating method for the touch sensing device are provided. The touch sensing device includes a touch sensing electrode array, a reference electrode, a first front-end circuit, a second front-end circuit and a controller. The reference electrode surrounds the touch sensing electrode array. The first front-end circuit receives a first touch sensing signal from the touch sensing electrode array. The second front-end circuit receives a second touch sensing signal from the reference electrode. Based on a touch event occurring at an edge of the touch sensing electrode array, the controller determines the touch event according to the first touch sensing signal and the second touch sensing signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:觸控感測裝置</p>
        <p type="p">110:觸控感測電極陣列</p>
        <p type="p">120:參考電極</p>
        <p type="p">130:第一前端電路</p>
        <p type="p">140:第二前端電路</p>
        <p type="p">150:控制器</p>
        <p type="p">EVN:觸控事件</p>
        <p type="p">PE:觸控感測電極</p>
        <p type="p">S1、S2:觸控感測結果</p>
        <p type="p">STS1:第一觸控感測信號</p>
        <p type="p">STS2:第二觸控感測信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="51" publication-number="202616919">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616919</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137354</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示面板</chinese-title>
        <english-title>DISPLAY PANEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10H20/851</main-classification>
        <further-classification edition="202501120250102B">H10H20/855</further-classification>
        <further-classification edition="202501120250102B">H10H29/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃子芩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TZU-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種顯示面板，包括多個像素單元。至少一個像素單元包括一子像素。該子像素包括第一區域以及第二區域。第一區域與基板的距離小於第二區域與基板的距離。第一區域上配置有第一發光元件以及覆蓋第一發光元件的第一光學層，第二區域上配置有第二發光元件以及覆蓋第二發光元件的第二光學層。第二光學層鄰接第一光學層。第一光學層的頂面與基板之間的距離大於第二發光元件的頂面與基板之間的距離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display panel including a plurality of pixel units is provided. At least one of the pixel units includes a sub pixel. The sub pixel includes a first region and a second region. A distance between the first region and a substrate is smaller than a distance between the second region and the substrate. A first light emitting element and a first optical layer covering the first light emitting element are disposed on the first region. A second light emitting element and a second optical layer covering the second light emitting element are disposed on the second region. The second optical layer is adjacent to the first optical layer. A distance between a top surface of the first optical layer is larger than a distance between a top surface of the second light emitting element and the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1、2:基板</p>
        <p type="p">10、20:子像素</p>
        <p type="p">11、12、21、22:區域</p>
        <p type="p">110、120、210、220:發光元件</p>
        <p type="p">110C、210C:絕緣層</p>
        <p type="p">111、121、211:光學層</p>
        <p type="p">BM:遮光層</p>
        <p type="p">CF1、CF2:色阻層</p>
        <p type="p">d0、d1、d2:距離</p>
        <p type="p">NL:填充層</p>
        <p type="p">OC:介質層</p>
        <p type="p">RL、RL1、RL2、RL3:反射層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="52" publication-number="202616237">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616237</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137355</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機械操作模擬訓練系統</chinese-title>
        <english-title>MECHANICAL OPERATION SIMULATION TRAINING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241031B">G09B9/00</main-classification>
        <further-classification edition="200601120241031B">G06F3/01</further-classification>
        <further-classification edition="202001120241031B">G06F30/17</further-classification>
        <further-classification edition="202001120241031B">G06F30/20</further-classification>
        <further-classification edition="202001320241031B">G06F119/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞動部職業安全衛生署</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OCCUPATIONAL SAFETY AND HEALTH ADMINISTRATION, MINISTRY OF LABOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國家科學及技術委員會南部科學園區管理局</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOUTHERN TAIWAN SCIENCE PARK BUREAU, MINISTRY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳慶煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, QING-HUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, CHIA-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種機械操作模擬訓練系統，用以解決習知工安教育訓練缺少實際操作體驗的問題。係包含：一感應模組，感測一操作人員的動作及視線方向以產生一動態資訊；一處理單元，耦合連接該感應模組，該處理單元分析該動態資訊以產生一互動資訊；一頭戴顯示器，耦合連接該處理單元，該頭戴顯示器依據該互動資訊提供畫面及聲音予該操作人員；及一捲夾模擬機，耦合連接該處理單元，該操作人員手動操作該捲夾模擬機，及該處理單元以該互動資訊觸發該捲夾模擬機做自動反應。藉此可以達成實際體驗工安教育訓練的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A mechanical operation simulation training system is provided to solve the problem of lack of practical operating experience in conventional industrial safety education and training. The system includes a sensing module, a processing unit coupled to the sensing module, a head-mounted display coupled to the processing unit, and a clamp simulator coupled to the processing unit. The sensing module senses the movement and sight direction of an operator to generate a dynamic information. The processing unit analyzes the dynamic information to generate an interactive information. The head-mounted display provides images and sounds to the operator based on the interactive information. The operator manually operates the clamp simulator, and the processing unit uses the interactive information to trigger the clamp simulator to make an automatic response. The mechanical operation simulation training system provides the effect of practical experience in industrial safety education and training.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:感應模組</p>
        <p type="p">2:處理單元</p>
        <p type="p">3:頭戴顯示器</p>
        <p type="p">4:捲夾模擬機</p>
        <p type="p">D:動態資訊</p>
        <p type="p">V:互動資訊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="53" publication-number="202615277">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615277</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137356</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>拖吊車之承板位移機構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250106B">B60P1/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王潔懿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>南投縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃彥鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林湧群</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹銘煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓修齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種拖吊車之承板位移機構，其包含有一設置在車體上的車載座、一樞設於車載座之二限位座的承載座、一移動伸縮組設於承載座內的移動板、一跨設於移動板上的連動板及一樞接於連動板的承板。承載座受一第一驅動裝置驅動而上下擺動，同時移動板受一第二驅動裝置驅動在承載座內伸縮移動，並由移動板推動分別繞設於其前端部的第一鏈條或繞設於其後端部的第二鏈條帶動連動板移動，從而帶動承板移動。整體結構簡化，僅以一驅動裝置即可驅動移動板、連動板及承板同步移動，減少維護費用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:承載座</p>
        <p type="p">21:前端</p>
        <p type="p">22:後端</p>
        <p type="p">23:補強板</p>
        <p type="p">24:導輪</p>
        <p type="p">25:緩衝元件</p>
        <p type="p">26:第二驅動裝置</p>
        <p type="p">27:滾輪</p>
        <p type="p">3:移動板</p>
        <p type="p">31:第一滑槽</p>
        <p type="p">32:前端部</p>
        <p type="p">34:後端部</p>
        <p type="p">36:第二滑槽</p>
        <p type="p">4:連動板</p>
        <p type="p">41:第一鏈條</p>
        <p type="p">43:滑輪</p>
        <p type="p">Y:縱向方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="54" publication-number="202615764">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615764</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137357</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>懸吊式拉門結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">E05D15/06</main-classification>
        <further-classification edition="200601120241104B">E05D13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達聚工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林常青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳芳池</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種懸吊式拉門結構，其包含有一緩衝裝置與二移動輪件，緩衝裝置、移動輪件安裝於一軌道內，移動輪件固定於一拉門上，緩衝裝置設有一安裝殼體，安裝殼體滑設有二滑動件，二滑動件間設有一緩衝阻尼缸與一復位彈簧，安裝殼體兩側各設有一固定件，一固定件與一移動輪件樞接，另一固定件設有數輪體，移動輪件具有一本體，本體設有數移動輪，本體側面凹設有一凹槽，本體凸設有一緩衝緣，緩衝緣與凹槽的底面有間距，當移動輪件相對固定件樞轉而相撞時，固定件會抵於緩衝緣上，緩衝緣與凹槽的底面有間距使緩衝緣有彈性彎曲的空間而降低撞擊力道。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">(10):緩衝裝置</p>
        <p type="p">(11):安裝殼體</p>
        <p type="p">(12):滑動件</p>
        <p type="p">(13):緩衝阻尼缸</p>
        <p type="p">(14):復位彈簧</p>
        <p type="p">(15):固定件</p>
        <p type="p">(151):輪體</p>
        <p type="p">(20):移動輪件</p>
        <p type="p">(21):本體</p>
        <p type="p">(211):移動輪</p>
        <p type="p">(22):凹槽</p>
        <p type="p">(23):緩衝緣</p>
        <p type="p">(24):吊座</p>
        <p type="p">(241):螺桿</p>
        <p type="p">(29):外殼</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="55" publication-number="202614949">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614949</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137358</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>經由祭祀用品取得碳權之方法及所應用的祭祀用品</chinese-title>
        <english-title>METHOD AND PRODUCT OF OBTAINING CARBON CREDIT THROUGH BLESSING SUPPLIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250122B">A47G33/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樂功院綠色永續服務有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOVEGONGYUAN GREEN SUSTAINABILITY SERVICES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張軒綸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSUAN-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳庠豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIANG-HAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙志祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種經由祭祀用品取得碳權之方法及所應用的祭祀用品，是以未經碳化的生竹、木頭或植物纖維等可碳化物包裝為祭祀用品，用以取代傳統焚燒的紙錢，並在祭祀後將該祭祀用品經無氧高溫碳化處理，生成生物炭，以降低二氧化碳的排放量、改善空氣品質，並可因生成生物炭而獲得碳權，另外，也可於用以製作祭祀用品的竹林、樹林、森林中獲得吸收二氧化碳的碳權，或將本發明所生成的生物炭應用於製造濾材或將其混入土嚷中，使生物炭重新回到土地中貯存並進行土壤的改善。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and product of obtaining carbon credit through blessing supplies, the said blessing supplies used are to package materials such as raw bamboo, wood or plant fiber that have not been carbonized as blessing supplies to replace the traditional burning joss money and use them during the sacrificial ceremony. The sacrificial items are then subjected to anaerobic high-temperature carbonization treatment to generate biochar, so that the treatment process of the blessing supplies can reduce carbon dioxide emissions and improve air quality, in addition to obtaining carbon credit by generating biochar, the present invention can also obtain carbon credit for absorbing carbon dioxide in bamboo forests, woods. In addition, the biochar generated by the present invention can be used to make filter materials or mixed into soil, so that the biochar can be returned to the land for storage and soil improvement.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="56" publication-number="202616114">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616114</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137359</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>物聯網資安檢測方法及物聯網資安檢測系統</chinese-title>
        <english-title>INTERNET OF THINGS INFORMATION SECURITY DETECTION METHOD AND INTERNET OF THINGS INFORMATION SECURITY DETECTION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250203B">G06F21/57</main-classification>
        <further-classification edition="202201120250203B">H04L9/40</further-classification>
        <further-classification edition="202201120250203B">H04L67/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>耀睿科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AURAY TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗億</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUNG-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐漢宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HAN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種物聯網資安檢測方法及物聯網資安檢測系統。物聯網資安檢測方法包括以下步驟：載入標準法規資訊，標準法規資訊具有多個條件要求、多個測試項目及多個合規數據；輸入規格資訊；利用多個條件要求比對規格資訊以輸出對應的測試項目；通過被輸出的多個測試項目建立檢測清單；載入具有聲明數據的自我聲明資訊；依據檢測清單生成測試情境；帶入聲明數據至測試情境進行問題驗證，以確定是否存在問答關聯性；於問答關聯性不存在時產生修正回饋；傳送修正回饋至修正端，以對聲明數據進行修正；以及於問答關聯性存在時，帶入聲明數據至測試情境進行合規驗證，以確定聲明數據是否符合對應的合規數據。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An internet of things information security detection method and internet of things information security detection system are provided. The information security detection method includes the following steps: loading standard regulatory information, where the standard regulatory information contains multiple requirement conditions, multiple test items, and multiple compliance data; inputting specification information; using the multiple requirement conditions to compare with the specification information to output the corresponding test items; establishing a testing checklist through the outputted multiple test items; loading self-declaration information containing declaration data; generating test scenarios based on the testing checklist; inputting the declaration data into the test scenarios for issue verification to determine if there is a question-answer correlation; generating corrective feedback if the question-answer correlation does not exist; sending the corrective feedback to the correction end to modify the declaration data; and when the question-answer correlation exists, inputting the declaration data into the test scenarios for compliance verification to determine if the declaration data meets the corresponding compliance data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101~S119:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="57" publication-number="202615297">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615297</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137360</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>模組化無人水上載具</chinese-title>
        <english-title>MODULAR UNMANNED WATER VEHICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B63B35/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>點點塑環保科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICRO PLASTIC CLEANSER CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪以柔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, YI-JOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康菀珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, WAN-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱申富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, SHEN-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孚竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種模組化無人水上載具，包括載具本體、電控模組、動力裝置、電池模組、浮油清理模組及微塑膠採集模組，其中，電控模組、動力裝置、電池模組、浮油清理模組及微塑膠採集模組均設置於載具本體上。電控模組用以依據控制訊號執行相應操作；動力裝置用以提供載具本體於水面上移動的動力；電池模組用以供應電力；浮油清理模組用以清理水面浮油；以及微塑膠採集模組用以採集水中的微塑膠。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a modular unmanned water vehicle, including a vehicle body, an electronic control module, a power device, a battery module, an oil slick cleaning module, and a microplastics collection module. The electronic control module, the power device, the battery module, the oil slick cleaning module, and the microplastics collection module are disposed on the vehicle body. The electronic control module is configured to perform corresponding operations according to control signals; the power device is configured to provide power for the vehicle body to move on the water; the battery module is configured to supply electric power; the oil slick cleaning module is configured to clean the oil slick on the water surface; and the microplastics collection module is configured to collect microplastics in the water.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:模組化無人水上載具</p>
        <p type="p">10:載具本體</p>
        <p type="p">20:電控模組</p>
        <p type="p">21:無線通訊單元</p>
        <p type="p">22:處理單元</p>
        <p type="p">30:動力裝置</p>
        <p type="p">40:電池模組</p>
        <p type="p">50:浮油清理模組</p>
        <p type="p">60:微塑膠採集模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="58" publication-number="202616238">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616238</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137361</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電氣作業模擬訓練系統</chinese-title>
        <english-title>ELECTRICAL WORK SIMULATION TRAINING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241007B">G09B9/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞動部職業安全衛生署</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OCCUPATIONAL SAFETY AND HEALTH ADMINISTRATION, MINISTRY OF LABOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國家科學及技術委員會南部科學園區管理局</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOUTHERN TAIWAN SCIENCE PARK BUREAU, MINISTRY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳慶煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, QING-HUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, CHIA-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電氣作業模擬訓練系統，用以解決習知電氣作業之安全教育缺少實際操作體驗的問題。係包含：一感應模組，感測一操作人員的動作及視線方向以產生一動態資訊；一處理單元，耦合連接該感應模組，該處理單元分析該動態資訊以產生一互動資訊；一頭戴顯示器，耦合連接該處理單元，該頭戴顯示器依據該互動資訊提供畫面及聲音予該操作人員；及一感電模組，耦合連接該處理單元，該處理單元以該互動資訊觸發該感電模組做自動反應，模擬該操作人員遭受感電災害，及該操作人員以標準作業程序執行工作。藉此可以達成實際體驗工安教育訓練的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical work simulation training system is provided to solve the problem of lack of practical operating experience in conventional safety education for electrical work. The system includes a sensing module, a processing unit coupled to the sensing module, a head-mounted display coupled to the processing unit, and an induction module coupled to the processing unit. The sensing module senses the movement and sight direction of an operator to generate a dynamic information. The processing unit analyzes the dynamic information to generate an interactive information. The head-mounted display provides images and sounds to the operator based on the interactive information. The processing unit uses the interactive information to trigger the induction module to perform an automatic response to simulate that the operator suffers an induction disaster and the operator performs work according to standard operating procedures. The electrical work simulation training system provides the effect of practical experience in industrial safety education and training.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:感應模組</p>
        <p type="p">2:處理單元</p>
        <p type="p">3:頭戴顯示器</p>
        <p type="p">4:感電模組</p>
        <p type="p">D:動態資訊</p>
        <p type="p">V:互動資訊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="59" publication-number="202616660">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616660</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137363</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多相位雙邊緣數位脈衝寬度調變裝置</chinese-title>
        <english-title>MULTI-PHASE DUAL-EDGE DIGITAL PULSE WIDTH MODULATION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">H03K7/08</main-classification>
        <further-classification edition="201401120250203B">H03K5/13</further-classification>
        <further-classification edition="200601120250203B">H03L7/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立陽明交通大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖育德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, YU-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊映渝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林奕廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種多相位雙邊緣數位脈衝寬度調變裝置，其包含一延遲鎖相迴路、一延遲鎖相迴路邏輯電路與至少一個數位脈衝寬度調變邏輯電路。延遲鎖相迴路接收輸入時脈訊號，並藉此依序產生多個第一延遲時脈訊號與一第二延遲時脈訊號。所有第一延遲時脈訊號被交替式區分為第一群組與第二群組。延遲鎖相迴路產生同步時脈訊號、第一同步延遲時脈訊號與第二同步延遲時脈訊號，並將其傳送給數位脈衝寬度調變邏輯電路，以利用一輸入數位碼產生一脈衝寬度調變訊號，其中脈衝寬度調變訊號之高電壓準位所佔據的時間與輸入數位碼之數值呈正相關。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multi-phase dual-edge digital pulse width modulation device includes a delay locked loop, a delay locked loop logic circuit, and at least one digital pulse width modulation logic circuit. The delay locked loop receives an input clock signal and thereby sequentially generates first delayed clock signals and a second delayed clock signal. All first delayed clock signals are alternately divided into a first group and a second group. The delay locked loop generates a synchronous clock signal, first synchronous delayed clock signals, and second synchronous delayed clock signals and transmits them to the digital pulse width modulation logic circuit to generates a pulse width modulation signal in response to a control digital code. The time occupied by the high voltage level of the pulse width modulation signal is positively correlated with the value of the control digital code.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:多相位雙邊緣數位脈衝寬度調變裝置</p>
        <p type="p">10:延遲鎖相迴路</p>
        <p type="p">11:延遲鎖相迴路邏輯電路</p>
        <p type="p">12:數位脈衝寬度調變邏輯電路</p>
        <p type="p">CI:輸入時脈訊號</p>
        <p type="p">D1、D3、...、D31:第一同步延遲時脈訊號</p>
        <p type="p">D0、D2、...、D30:第二同步延遲時脈訊號</p>
        <p type="p">D31’:第一延遲時脈訊號</p>
        <p type="p">D32’:第二延遲時脈訊號</p>
        <p type="p">CS:同步時脈訊號</p>
        <p type="p">EN1、EN2:輸入個別致能訊號</p>
        <p type="p">POR:上電重置訊號</p>
        <p type="p">Duty[13：0]:輸入數位碼</p>
        <p type="p">PWM:脈衝寬度調變訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="60" publication-number="202615158">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615158</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137370</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>密封膠塗佈系統與自動調整密封膠塗佈參數的方法</chinese-title>
        <english-title>SEALANT DISPENSING SYSTEM AND METHOD FOR AUTOMATICALLY ADJUSTING DISPENSING PARAMETER OF SEALANT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">B05C11/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇義新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, I-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭士豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, SHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈家弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, CHIA HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡文煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, WEN-HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種密封膠塗佈系統以及調整塗佈參數的方法。此系統包含密封膠塗佈裝置與計算裝置。密封膠塗佈裝置依據塗佈參數將密封膠設置在基板上，量測密封膠的參數並產生製程資料。計算裝置讀取製程資料以判斷製程資料是否包含警報訊息。若製程資料包含警報訊息，計算裝置根據密封膠的參數調整塗佈參數以產生新塗佈參數，並將新塗佈參數傳送至密封膠塗佈裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a sealant dispensing system and a method for adjusting dispensing parameters. The system includes a sealant dispensing device and a computing device. The sealant dispensing device dispenses sealant on a substrate based on the dispensing parameters, measures parameters of the sealant, and generates process data. The computing device reads the process data to determine whether the process data contains an alarm message. If the process data contains the alarm message, the computing device adjusts the dispensing parameters based on the parameters of the sealant to generate new dispensing parameters and transmits the new dispensing parameters to the sealant dispensing device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">501~505:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="61" publication-number="202615889">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615889</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137373</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光掃描器、雷射探測系統及自動駕駛車輛</chinese-title>
        <english-title>OPTICAL SCANNER, LASER DETECTION SYSTEM, AND AUTONOMOUS VEHICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120241104B">G01S7/4863</main-classification>
        <further-classification edition="200601120241104B">G01S7/484</further-classification>
        <further-classification edition="202001120241104B">G01S17/931</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾永昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YUNG-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請實施例涉及一種光掃描器、雷射探測系統及自動駕駛車輛。所述光掃描器包括偏振分光鏡、波片及光學相控陣晶片。所述偏振分光鏡用於將入射的光源光分為第一偏振態的第一雷射和第二偏振態的非工作光，並反射所述第一雷射和透射所述非工作光。所述波片位於所述偏振分光鏡的反射出光側，用於接收所述第一雷射並出射第三偏振態的第二雷射。所述第一偏振態、所述第二偏振態、所述第三偏振態不同。所述光學相控陣晶片用於接收所述第二雷射、出射參考光以及改變所述參考光的出射角度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure relate to an optical scanner, a laser detection system, and an autonomous vehicle. The optical scanner includes a polarization beam splitter, a waveplate, and an optical phased array chip. The polarization beam splitter is used to divide an incident light from a light source into a first laser having a first polarization state and a non-working light having a second polarization state, and to reflect the first laser and transmit the non-working light. The waveplate is at a reflected side of the polarization beam splitter and is used to receive the first laser and emit a second laser having a third polarization state. The first, second, and third polarization states are different. The optical phased array chip is used to receive the second laser, emit reference light, and change an emission angle of the reference light.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:雷射探測系統</p>
        <p type="p">10:雷射發射裝置</p>
        <p type="p">11:雷射源</p>
        <p type="p">13:光掃描器</p>
        <p type="p">131:偏振分光鏡</p>
        <p type="p">133:波片</p>
        <p type="p">135:光學相控陣晶片</p>
        <p type="p">15:準直元件</p>
        <p type="p">30:雷射接收裝置</p>
        <p type="p">31:光感測器</p>
        <p type="p">33:收光元件</p>
        <p type="p">50:雷射監控裝置</p>
        <p type="p">L1:光源光</p>
        <p type="p">L2:第一雷射</p>
        <p type="p">L3:第二雷射</p>
        <p type="p">L4:參考光</p>
        <p type="p">L5:探測光</p>
        <p type="p">LF:非工作光</p>
        <p type="p">Q:待測目標</p>
        <p type="p">E:掃描角度</p>
        <p type="p">F:收光角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="62" publication-number="202616205">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616205</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137377</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於人工智慧之鋼筋混凝土結構力量位移關係預測方法、電腦程式產品與裝置</chinese-title>
        <english-title>METHOD, COMPUTER PROGRAM AND DEVICE FOR PREDICTING BETWEEN FORCE-DISPLACEMENT RELATIONSHIP FOR REINFORCED CONCRETE STRUCTURE BASED ON ARTIFICIAL INTELLIGENCE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120241105B">G06Q50/08</main-classification>
        <further-classification edition="202001120241105B">G06F30/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中央大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CENTRAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鵬宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PENG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳漢興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HAN-XHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白大尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種鋼筋混凝土結構力量位移關係預測方法，其包含：提供鋼筋混凝土物件之第一設計參數；將該第一設計參數輸入包含生成器與鑑別器之鋼筋混凝土結構力量位移關係預測模型；以及透過處理器執行該生成器並預測該鋼筋混凝土物件之力量位移關係。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a method for predicting the force-displacement relationship for a reinforced concrete structure, comprising: providing a first design parameter of a reinforced concrete article; inputting the first design parameter into a force-displacement relationship prediction model for reinforced concrete structures comprising a generator and a discriminator; and executing the generator through a processor to predict a force-displacement relationship for the reinforced concrete article.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:鋼筋混凝土結構力量位移關係預測方法</p>
        <p type="p">201-205:實施步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="63" publication-number="202616498">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616498</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137378</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子封裝件及其製法</chinese-title>
        <english-title>ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250122B">H01L23/48</main-classification>
        <further-classification edition="200601120250122B">H01L21/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矽品精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯仲禹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KE, CHUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃博弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, BO HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡琨昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, KUN SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳亮斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LIANG-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子封裝件及其製法，主要在佈線結構之一側設有橋接晶片，另一側設有電子元件及光學引擎，且令該橋接晶片、電子元件及光學引擎電性連接該佈線結構，進而使該電子元件及該光學引擎可透過該橋接晶片相互電性連接，藉以縮短電傳輸的路徑，降低資料傳輸的耗損及用電量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic package and its manufacturing method mainly include a bridge chip on one side of a wiring structure, and an electronic component and an optical engine on the other side. The bridge chip, electronic component and optical engine are electrically connected to the wiring structure, so that the electronic component and the optical engine can be electrically connected to each other through the bridge chip, thereby shortening the path of electrical transmission and reducing the loss and power consumption of data transmission.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:半導體封裝件</p>
        <p type="p">31:橋接晶片</p>
        <p type="p">33:佈線結構</p>
        <p type="p">34:線路結構</p>
        <p type="p">340:導電元件</p>
        <p type="p">35:電子元件</p>
        <p type="p">36:光學引擎</p>
        <p type="p">38:基板</p>
        <p type="p">380:銲球</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="64" publication-number="202615930">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615930</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137384</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有低折射率與大視野之光學模組及增強實境顯示器</chinese-title>
        <english-title>OPTICAL MODULE AND AUGMENTED REALITY DISPLAY WITH LOW INFRACTIVE INDEX AND LARGE FIELD OF VIEW</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241210B">G02B27/01</main-classification>
        <further-classification edition="200601120241210B">G02B6/124</further-classification>
        <further-classification edition="200601120241210B">G02B6/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡瑜庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李錫烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEOK-LYUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王銘瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MING-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江彥俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, YEN-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡庭瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, TING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾佳欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, CHIA-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉俐瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, LI-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種光學模組，包含投影光源、第一光波導以及第二光波導。投影光源提供目標影像，第一光波導具有複數個第一光柵，且複數個第一光柵以第一週期之距離設置。第二光波導具有複數個第二光柵，且複數個第二光柵以第二週期之距離設置，其中第一週期與第二週期之差異值的絕對值大於0且小於或等於目標影像之波長的十分之一。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical module is disclosed, which includes a projection light source, a first optical waveguide and a second optical waveguide. The projection light source provides a target image. The first optical waveguide has multiple first gratings, and the multiple first gratings are disposed in a first periodic distance. The second optical waveguide has multiple second gratings, and the multiple second gratings are disposed in a second periodic distance, wherein the absolute value of the difference between the first periodic distance and the second periodic distance is greater than zero, and the absolute value is less than or equal to 10 percentage of the wavelength of the target image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:第一光波導</p>
        <p type="p">201:第一輸入耦合區</p>
        <p type="p">202:第一轉折區</p>
        <p type="p">203:第一輸出耦合區</p>
        <p type="p">210:第一光柵</p>
        <p type="p">300:第二光波導</p>
        <p type="p">301:第二輸入耦合區</p>
        <p type="p">302:第二轉折區</p>
        <p type="p">303:第二輸出耦合區</p>
        <p type="p">310:第二光柵</p>
        <p type="p">P1:第一週期</p>
        <p type="p">P2:第二週期</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="65" publication-number="202615940">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615940</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137385</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">G02F1/1333</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉邦炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, PANG-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置，包括顯示面板、背板、燈板、擴散板以及多個C字型夾固件。顯示面板包括顯示面，顯示面具有凸面區與凹面區。背板包括背板本體以及至少一個側壁。至少一側壁設置於背板本體的側邊，其中至少一側壁具有夾持凹部以及凸耳容置部。燈板設置於背板本體。擴散板設置於燈板。擴散板包括擴散板本體與至少一凸耳，凸耳伸入凸耳容置部。C字型夾固件具有第一懸臂與相對於第一懸臂的第二懸臂，第一懸臂抵靠於夾持凹部並延伸限位凸耳在遠離背板本體方向上的位移，並且側壁位於第二懸臂及第一懸臂之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device includes a display panel, a back plate, a lighting board, a diffusion plate and a plurality of C-shaped clipping member. The display panel includes a display surface. The display surface includes a convex surface region and a concave surface region. The back plate includes a back plate body and at least one sidewall. The at least one sidewall is disposed on the side of the back plate body, wherein the side wall includes a clamping concave portion and a lug containing portion. The lighting board is disposed on the back plate body. The diffusion plate is disposed on the lighting board. The diffusion plate includes a diffusion plate body and at least one lug, and the lug is extended to the lug containing portion. The C-shaped clipping member includes a first arm and a second arm opposite to the first arm, the first arm is against the clamping concave portion and extended to position the movement of the lug along a direction leaving from the back plate body, and the sidewall is located between the second arm and the first arm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:顯示裝置</p>
        <p type="p">20:背板</p>
        <p type="p">22:側壁</p>
        <p type="p">23:凸肋</p>
        <p type="p">30:燈板</p>
        <p type="p">31:燈板凸耳</p>
        <p type="p">32:鎖附孔</p>
        <p type="p">40:擴散板</p>
        <p type="p">41:擴散板本體</p>
        <p type="p">42:凸耳</p>
        <p type="p">50:C字型夾固件</p>
        <p type="p">51:第一懸臂</p>
        <p type="p">52:第二懸臂</p>
        <p type="p">53:夾體</p>
        <p type="p">211:第一表面</p>
        <p type="p">212:第二表面</p>
        <p type="p">222:夾持凹部</p>
        <p type="p">223:凸耳容置部</p>
        <p type="p">521:卡固件</p>
        <p type="p">D1、D2:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="66" publication-number="202615800">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615800</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137395</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通風管之轉接管結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241014B">F24C15/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>統領工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張金發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳行一</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種通風管之轉接管結構，主要係包括兩管體，以及連接於兩管體間之連接管。其中，該兩管體一端係設有容置口，另端係設有承置口，該容置口係由管體的一側，向另側以斜狀延伸；該連接管兩端係分別設有轉接口，其一側面係設為適當角度之圓弧部，該兩端之轉接口係由該圓弧部向另側面以斜狀延伸，以形成一尖縮端，使該連接管概呈扇形，其兩端之轉接口係分別設有環狀之垣部及內縮之嵌置部。俾將兩管體藉由容置口套置嵌合於連接管之轉接口，使兩管體得以依施工場所的需求，沿連接管轉動調整不同之角度，以供由承置口接續通風管，從而使通風管之施工更為方便、快捷，且藉由該圓弧部避免通風效率的衰減，進而使通風得以保持順暢。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:管體</p>
        <p type="p">11:容置口</p>
        <p type="p">12:承置口</p>
        <p type="p">2:連接管</p>
        <p type="p">22:圓弧部</p>
        <p type="p">23:尖縮端</p>
        <p type="p">24:垣部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="67" publication-number="202616244">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616244</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137403</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置及其驅動方法</chinese-title>
        <english-title>DISPLAY DEVICE AND METHOD FOR DRIVING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241011B">G09F9/35</main-classification>
        <further-classification edition="200601120241011B">G02F1/13357</further-classification>
        <further-classification edition="200601120241011B">G09G3/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巫岳錡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YUEH-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳佳蓉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIA-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余悌魁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, TI-KUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐雅玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YA-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種顯示裝置及其驅動方法。顯示裝置包括第一基板及第二基板。第一基板具有包含第一顯示單元的第一顯示單元區及包含第二顯示單元的第二顯示單元區。第二顯示單元區位於第一顯示單元區之第一側，且第二顯示單元與第一顯示單元不同。第二基板至少部分與第一基板疊設，並具有包含第三顯示單元的第三顯示單元區。驅動方法包括：自第一基板之第一訊號輸入側輸入第一訊號至第一顯示單元 ; 自第一訊號輸入側輸入第二訊號至第二顯示單元；以及自第二基板之第二訊號輸入側輸入第三訊號以驅動第二基板上之複數個第三顯示單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device and a driving method for driving the same are provided. The display device includes a first substrate and a second substrate. The first substrate has a first display unit area including first display units and a second display unit area including second display units. The second display unit area is located on a first side of the first display unit area, and the second display unit is different from the first display unit. The second substrate is at least partially stacked with the first substrate and has a third display unit area including third display units. The driving method includes: inputting a first signal from a first input side of the first substrate to the first display unit; inputting a second signal from the first input side to the second display unit; and inputting a third signal from a second input side of the second substrate to drive the third display units on the second substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:顯示裝置</p>
        <p type="p">100:第一基板</p>
        <p type="p">101:第一側</p>
        <p type="p">102:第二側</p>
        <p type="p">110:第一顯示單元區</p>
        <p type="p">111:第一顯示單元</p>
        <p type="p">120:第二顯示單元區</p>
        <p type="p">121:第二顯示單元</p>
        <p type="p">200:第二基板</p>
        <p type="p">230:第三顯示單元區</p>
        <p type="p">231:第三顯示單元</p>
        <p type="p">301:第一訊號輸入側</p>
        <p type="p">302:第二訊號輸入側</p>
        <p type="p">601:第一驅動訊號源</p>
        <p type="p">602:第二驅動訊號源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="68" publication-number="202616176">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616176</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137405</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子簽名系統與電子簽名辨識方法</chinese-title>
        <english-title>ELECTRONIC SIGNATURE SYSTEM AND ELECTRONIC SIGNATURE VERIFICATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120241125B">G06Q20/38</main-classification>
        <further-classification edition="201201120241125B">G06Q20/40</further-classification>
        <further-classification edition="200601120241125B">H04L9/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>合作金庫商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN COOPERATIVE BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊秉翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, PING-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子簽名系統包含有一簽名平台以及一光學攝影辨識裝置。光學攝影辨識裝置連接於簽名平台，且當使用者在簽名平台上簽名時，光學攝影辨識裝置可穿過簽名平台同時拍攝使用者的簽名以及使用者的人像。此外，一種電子簽名辨識方法亦在此揭露。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic signature system includes a signature platform and an optical photography verification device. The optical photography verification device is connected to the signature platform, and when a user signs on the signature platform, the optical photography verification device may simultaneously capture the user's signature and the user's portrait passing through the signature platform. In addition, an electronic signature verification method is also disclosed here.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子簽名系統</p>
        <p type="p">110:簽名平台</p>
        <p type="p">112:輔助感應平台</p>
        <p type="p">120:光學攝影辨識裝置</p>
        <p type="p">130:手寫筆</p>
        <p type="p">140:銀行交易伺服器</p>
        <p type="p">150:擦拭裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="69" publication-number="202615180">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615180</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137407</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>攻牙機攻牙刀具換刀控管方法及控管系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241118B">B23G1/44</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>業弘科技模具有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭敬耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種攻牙機攻牙刀具換刀控管方法，包括：一攻牙刀具選取程序，按工件攻牙選擇攻牙刀具；一攻牙條件設定程序，在一控制器上設一組攻牙條要求命令；一攻牙能基準值獲取程序，係攻牙測試，由一個以上節點所需能量值作為能量基準值；一攻牙能量上限值獲取程序，係攻牙刀具破壞測試的斷裂所需能量值作為能量極限值，並以該能量極限值的0.8~0.97倍作為能量上限值；一攻牙監控模式建立程序，係該控制器上編寫監控程式及設比較器，並在資料庫寫入能量基準值、能量極限值與能量上限值的多個監控數據；一監控模式啟動程序，係多個工件攻牙製程，由能量值訊號反饋成能量比對值交給比較器與監控數據比較；能在攻牙刀具磨損接近斷裂前，準確作為換刀判定。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">21:工件</p>
        <p type="p">22:攻牙螺孔規格</p>
        <p type="p">310:比較器</p>
        <p type="p">311:資料庫</p>
        <p type="p">40:攻牙刀具選取程序</p>
        <p type="p">50:攻牙條件設定程序</p>
        <p type="p">OR1:攻牙條件要求命令</p>
        <p type="p">60:攻牙能量基準值獲取程序</p>
        <p type="p">BE:能量基準值</p>
        <p type="p">70:攻牙能量上限值獲取程序</p>
        <p type="p">LI:能量極限值</p>
        <p type="p">UP:能量上限值</p>
        <p type="p">80:攻牙監控模式建立程序</p>
        <p type="p">MO1:監控模式</p>
        <p type="p">90:監控模式啟動程序</p>
        <p type="p">CO:能量比對值</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="70" publication-number="202616197">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616197</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137409</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>動產監管系統</chinese-title>
        <english-title>CHATTEL SUPERVISION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241211B">G06Q40/03</main-classification>
        <further-classification edition="202301120241211B">G06Q10/00</further-classification>
        <further-classification edition="200601120241211B">G06F15/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>合作金庫商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN COOPERATIVE BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾于瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YU-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種動產監管系統，包含：一抵押品管理伺服器，通訊連接於與一抵押品連接之一定位標籤，包含：一抵押品建檔模組，用以建立抵押品之一抵押品資料；及一抵押品定位管理模組，用以建立定位標籤之一標籤資料並與抵押品資料關聯，其中標籤資料包含一定位資料，當抵押品管理伺服器接收到由定位標籤傳送之最新的標籤資料時，更新標籤資料之定位資料；以及一儲存裝置，與抵押品管理伺服器耦接，用以儲存關聯之抵押品資料與標籤資料；並且抵押品管理伺服器將關聯之抵押品資料與標籤資料傳送至一動產監管裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chattel supervision system includes a collateral management server, communicatively connected to a positioning tag connecting to a collateral, including: a collateral archiving module, used for creating a collateral data of the collateral; and a collateral positioning management module, used for creating a tag data of the positioning tag and linking to the collateral data, and the tag data includes a positioning data. The collateral positioning management module is further used for renewing the positioning data when the new tag data the positioning tag transmitted is received by the collateral management server. The movable property supervision further includes a storage device which is coupled to the collateral management server, and used for saving the linking collateral data and tag data. The collateral management server is further used for transmitting the linking collateral data and tag data to a chattel supervision device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:動產監管系統</p>
        <p type="p">110:抵押品管理伺服器</p>
        <p type="p">111:抵押品建檔模組</p>
        <p type="p">112:抵押品定位管理模組</p>
        <p type="p">113:聯合網路管理模組</p>
        <p type="p">114:定位視覺化模組</p>
        <p type="p">120:儲存裝置</p>
        <p type="p">121:抵押品資料庫</p>
        <p type="p">122:聯合網路資料庫</p>
        <p type="p">200:定位標籤</p>
        <p type="p">300:抵押品</p>
        <p type="p">400:聯合網路</p>
        <p type="p">401,402,403:行動裝置</p>
        <p type="p">500:動產監管裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="71" publication-number="202615181">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615181</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137411</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>攻牙機攻牙刀具換刀時機管控方法及管控系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">B23G1/44</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>業弘科技模具有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭敬耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種攻牙機攻牙刀具換刀時機管控方法，包括：一攻牙刀具選取程序，按工件攻牙選擇攻牙刀具；一攻牙條件設定程序，在一控制器上設一組攻牙條要求命令；一攻牙能基準值獲取程序，係攻牙測試，由一個以上節點所需能量值作為能量基準值；一攻牙能量上限值獲取程序，係攻牙刀具破壞測試的斷裂所需能量值作為能量極限值，並以該能量極限值的0.8~0.97倍作為能量上限值；一攻牙監控模式建立程序，係該控制器上編寫監控程式及設比較器，並在資料庫寫入能量基準值、能量極限值與能量上限值的多個監控數據；一監控模式啟動程序，係多個工件攻牙製程，由電流值訊號反饋成能量比對值交給比較器與監控數據比較；能在攻牙刀具磨損接近斷裂前，準確作為換刀判定。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">21:工件</p>
        <p type="p">22:攻牙螺孔規格</p>
        <p type="p">310:比較器</p>
        <p type="p">311:資料庫</p>
        <p type="p">40:攻牙刀具選取程序</p>
        <p type="p">50:攻牙條件設定程序</p>
        <p type="p">OR1:攻牙條件要求命令</p>
        <p type="p">60:攻牙能量基準值獲取程序</p>
        <p type="p">BE:能量基準值</p>
        <p type="p">70:攻牙能量上限值獲取程序</p>
        <p type="p">LI:能量極限值</p>
        <p type="p">UP:能量上限值</p>
        <p type="p">80:攻牙監控模式建立程序</p>
        <p type="p">MO1:監控模式</p>
        <p type="p">90:監控模式啟動程序</p>
        <p type="p">CO:能量比對值</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="72" publication-number="202616742">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616742</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137416</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>緊急事故應變系統</chinese-title>
        <english-title>EMERGENCY GUIDING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250203B">H04W4/90</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>合作金庫商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN COOPERATIVE BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃士林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHIH-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江宗祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, TSUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種緊急事故應變系統。該緊急事故應變系統包含至少一監測裝置、複數個使用者裝置及一警示伺服器。該警示伺服器通訊連接至該至少一監測裝置與該等使用者裝置。該至少一監測裝置用以產生一環境監測資料。該警示伺服器基於該環境監測資料、該環境配置資訊及該等使用者裝置各者對應之一位置資訊，產生對應該等使用者裝置各者之一應變指示。該警示伺服器基於該等使用者裝置各者對應之該位置資訊，傳送該等使用者裝置各者之該應變指示至該等使用者裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An emergency guiding system. The emergency guiding system includes at least one monitoring device, a plurality of user devices and an alert server. The alert server is communicatively connected to the at least one monitoring device and the user devices. The at least one monitoring device is used to generate environmental monitoring data. The alert server generates a contingency instruction corresponding to each of the user devices based on the environmental monitoring data, the environmental configuration information and the location information corresponding to each of the user devices. The alert server sends the contingency instructions of each of the user devices to the user devices based on the location information corresponding to each of the user devices.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:緊急事故應變系統</p>
        <p type="p">MD1、MD2、......、MDn:監測裝置</p>
        <p type="p">UD1、UD2、......、UDx:使用者裝置</p>
        <p type="p">AS:警示伺服器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="73" publication-number="202616196">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616196</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137417</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智慧錢箱管理系統及其運作方法</chinese-title>
        <english-title>SMART CASH BOX MANAGEMENT SYSTEM AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241104B">G06Q40/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>合作金庫商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN COOPERATIVE BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱廉松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, LIEN-SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本智慧錢箱管理系統在櫃台人員取用錢箱時須通過身分驗證，且自出納窗口領取及繳回現金時，系統將交叉確認點鈔機及櫃台人員鍵入之交易資訊，並自動擷取櫃台人員使用之所屬錢箱之攝影畫面，監控與勾稽錢箱中櫃內現金的智慧錢箱暨錢箱管理系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This smart cash box management system requires identity verification when counter personnel access the cash box. When collecting and returning cash from the cashier window, the system will cross-confirm the transaction information entered by the cash counter and counter personnel, and automatically captures the photographic footage of the cash box used by the counter staff and monitors and checks the cash in the cash box.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:智慧錢箱管理系統</p>
        <p type="p">110:錢箱</p>
        <p type="p">112:攝影裝置</p>
        <p type="p">114:通訊裝置</p>
        <p type="p">120:錢櫃</p>
        <p type="p">122:顯示器</p>
        <p type="p">124:儲存裝置</p>
        <p type="p">126:處理裝置</p>
        <p type="p">128:通訊裝置</p>
        <p type="p">129:智慧卡感應裝置</p>
        <p type="p">130:點鈔機</p>
        <p type="p">132:顯示器</p>
        <p type="p">134:儲存裝置</p>
        <p type="p">136:處理裝置</p>
        <p type="p">138:通訊裝置</p>
        <p type="p">140:櫃台內電子裝置</p>
        <p type="p">142:輸入裝置</p>
        <p type="p">144:儲存裝置</p>
        <p type="p">146:處理裝置</p>
        <p type="p">148:通訊裝置</p>
        <p type="p">149:顯示器</p>
        <p type="p">150:伺服器電子裝置</p>
        <p type="p">152:影像資料庫</p>
        <p type="p">154:報表模組</p>
        <p type="p">156:現金系統</p>
        <p type="p">160:網路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="74" publication-number="202616159">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616159</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137418</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動產生稽核問題系統及其方法</chinese-title>
        <english-title>AUTOMATICALLY GENERATING AUDIT QUESTION SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241125B">G06Q10/0635</main-classification>
        <further-classification edition="201901120241125B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>合作金庫商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN COOPERATIVE BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳云珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUN-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭錫青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, HSI-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例提供一種自動產生稽核問題系統，且包括複數個第一輸入輸出裝置及處理器。處理器包括稽核資料匯入模組、操作紀錄匯入模組、稽核態樣學習模組及稽核題目產生模組。稽核資料匯入模組匯入複數個稽核相關資訊。操作紀錄匯入模組收集第一輸入輸出裝置的複數個存取紀錄。稽核態樣學習模組分析存取紀錄並產生風險查核異常資訊。稽核題目產生模組根據風險查核異常資訊並透過生成式人工智慧來產生針對稽核項目的至少一稽核題目的稽核題目表單。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of this disclosure provide an automatically generating audit question system, including a plurality of first input/output devices and a processor. The processor includes an audit data import module, an operation record import module, an audit typology learning module and an audit question generation module. The audit data import module imports audit-related information. The operation record import module collects a plurality of access records of each of the first input/output devices. The audit typology learning module analyzes the access records and generates a risk audit abnormal information. The audit question generation module generates an audit question form for at least one audit question of the audit project based on the risk audit abnormal information and through a generative artificial intelligence.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:自動產生稽核問題系統</p>
        <p type="p">102:第一輸入輸出裝置</p>
        <p type="p">104:第二輸入輸出裝置</p>
        <p type="p">106:處理器</p>
        <p type="p">112:內規資料庫</p>
        <p type="p">114:稽核資料庫</p>
        <p type="p">116:時事新聞資料庫</p>
        <p type="p">120:稽核資料匯入模組</p>
        <p type="p">130:操作紀錄匯入模組</p>
        <p type="p">140:稽核態樣學習模組</p>
        <p type="p">150:稽核題目產生模組</p>
        <p type="p">160:稽核題目答覆模組</p>
        <p type="p">170:稽核題目查核模組</p>
        <p type="p">180:稽核學習優化模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="75" publication-number="202615771">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615771</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137419</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微型泵浦</chinese-title>
        <english-title>MINIATURE PUMP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250324B">F04D13/06</main-classification>
        <further-classification edition="200601120250324B">F04D29/08</further-classification>
        <further-classification edition="200601120250324B">F04D29/22</further-classification>
        <further-classification edition="200601120250324B">F04D29/42</further-classification>
        <further-classification edition="200601120250324B">F04B9/10</further-classification>
        <further-classification edition="200601120250324B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇鋐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIA VITAL COMPONENTS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈慶行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, CHING-HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫大龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種微型泵浦，包括一泵殼體、一轉子、一定子、一連接該頂側的封閉件及一固持件，該泵殼體設有一形成有一泵浦腔室的頂側、一底側、一入水口及一出水口，一軸心的一端固設在該泵浦腔室，該軸心上樞設有一軸承，該轉子設該泵浦腔室內，用以循環通過該泵浦腔室內的一工作液體，該固持件設於對應該軸承的該封閉件之一側，且該軸心的另一端容設於該固持件內；透過本發明此設計，使得有效達到避免摩擦的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:微型泵浦</p>
        <p type="p">10:泵殼體</p>
        <p type="p">101:頂側</p>
        <p type="p">103:底側</p>
        <p type="p">1031:凹設空間</p>
        <p type="p">104:入水口</p>
        <p type="p">11:分隔板</p>
        <p type="p">111:導水孔</p>
        <p type="p">12:轉子</p>
        <p type="p">123:葉輪</p>
        <p type="p">1231:葉輪蓋</p>
        <p type="p">1232:第一套孔</p>
        <p type="p">1233:對接孔</p>
        <p type="p">1234:葉輪底座</p>
        <p type="p">1235:第二套孔</p>
        <p type="p">1236:葉片</p>
        <p type="p">1238:環凸緣</p>
        <p type="p">125:磁性件</p>
        <p type="p">13:定子</p>
        <p type="p">131:電路板</p>
        <p type="p">132:矽鋼片組</p>
        <p type="p">133:線圈組</p>
        <p type="p">14:軸承</p>
        <p type="p">15:封閉件</p>
        <p type="p">16:固持件</p>
        <p type="p">161:凸環部</p>
        <p type="p">162:容納空間</p>
        <p type="p">17:蓋板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="76" publication-number="202616039">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616039</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137421</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水冷泵浦連結單元</chinese-title>
        <english-title>WATER-COOLING PUMP COUPLING UNIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250422B">G06F1/20</main-classification>
        <further-classification edition="200601120250422B">F16L39/02</further-classification>
        <further-classification edition="200601120250422B">H05K7/20</further-classification>
        <further-classification edition="200601120250422B">F04B53/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇鋐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIA VITAL COMPONENTS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈慶行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, CHING-HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫大龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種水冷泵浦連結單元，係包含一本體，該本體具有一第一面及第二面及第三面，該第一面具有跟一水冷頭連通的一第一入口及一第一出口，該第二面具有與複數泵浦連接的一第一出水孔及一第一進水孔與一第二出水孔及一第二進水孔，且該第一出水孔及第二進水孔經由一第一聯通孔連通，該第三面具有跟一水冷排連通的一第二入口及一第二出口；該第一入口連通該第一出水孔，該第二出口連通該第一進水孔，該第二入口連通該第二出水孔，該第一出口連通該第二進水孔，透過該本體可同時連通複數泵浦及一水冷頭與水冷排，藉以預防其中一泵浦損壞時，可使工作液體仍持續被至少另一泵浦驅動在水冷頭與該水冷排之間循環者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:本體</p>
        <p type="p">11:第一入口</p>
        <p type="p">12:第一出口</p>
        <p type="p">15:第二入口</p>
        <p type="p">16:第二出口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="77" publication-number="202616209">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616209</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137422</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>交通運輸工具判斷方法以及交通運輸工具判斷及交通費用計算系統</chinese-title>
        <english-title>TRANSPORTATION DETERMINING METHOD AND TRANSPORTATION DETERMINING AND TRANSPORT CHARGE CALCULATING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120241104B">G06Q50/43</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彥豐實業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNGO, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧　譽展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種交通運輸工具判斷方法，包含以下步驟：伺服器根據電子裝置所傳送的行程開始訊息偵測並取得電子裝置的移動參數，其中移動參數包含移動軌跡、移動速度以及停留位置；以及伺服器根據移動參數判斷電子裝置所搭乘的一交通運輸工具的交通運輸工具種類。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transportation determining method includes the following steps of: a server detecting and obtaining a moving parameter of an electrical device according to a travel starting message send by the electrical device, wherein the moving parameter includes a moving track, a moving speed and a stay location; and the server determining a transportation type of a transportation on which the electronic device rides according to the moving parameter.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S11~S12:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="78" publication-number="202616061">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616061</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137424</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具矩陣編碼金屬層的電容式觸控模組</chinese-title>
        <english-title>CAPACITIVE TOUCH MODULE WITH MATRIX CODED METAL LAYER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">G06F3/044</main-classification>
        <further-classification edition="200601120250203B">G06F3/041</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茂林光電科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBAL LIGHTING TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳東佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝煒勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具矩陣編碼金屬層的電容式觸控模組，包含一電容式感應金屬層，由複數訊號線TX及複數接收線RX交錯組成；一介電層，位於電容式感應金屬層上方；一矩陣編碼金屬層，位於介電層上方且具有複數編碼線，編碼線係鏡射且電性連接訊號線TX，並以一編碼矩陣對編碼線進行物理編碼；一處理單元，內建一運算矩陣以對應編碼矩陣輸出弦波訊號至訊號線TX，並透過接收線RX回收經過編碼矩陣編碼後的電容式感應訊號，藉此透過物理編碼提升訊號解析度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A capacitive touch module with matrix coded metal layer is disclosed. The capacitive touch module includes a capacitive sensing metal layer which is composed of a plurality of signal lines TX and a plurality of receiving lines RX; a dielectric layer located above the capacitive sensing metal layer; a matrix encoding metal layer is located above the dielectric layer and has a plurality of encoding lines, the encoding lines are mirrored and electrically connected to the signal lines TX, and a encoding matrix is used to physically encode the encoding lines; a processing unit with a built-in matrix to output the sine wave signal to the signal lines TX corresponding to the encoding matrix, and recover the capacitive sensing signal encoded by encoding matrix through the receiving lines RX. This improves signal resolution through physical encoding.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電容式觸控模組</p>
        <p type="p">10:電容式感應金屬層</p>
        <p type="p">11:介電層</p>
        <p type="p">12:矩陣編碼金屬層</p>
        <p type="p">14:薄膜按壓組件</p>
        <p type="p">141:基膜</p>
        <p type="p">142:凸塊</p>
        <p type="p">15:底膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="79" publication-number="202616117">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616117</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137426</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>旁通道洩漏評估裝置及方法</chinese-title>
        <english-title>SIDE CHANNEL LEAKAGE ASSESSMENT APPARATUS AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250512B">G06F21/72</main-classification>
        <further-classification edition="201301120250512B">G06F21/75</further-classification>
        <further-classification edition="201301120250512B">G06F21/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人資訊工業策進會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INSTITUTE FOR INFORMATION INDUSTRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡春在</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, CHUN TSAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾　松剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHONG, SONG KONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴偉峻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI, WEI CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王聖銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHUN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種旁通道洩漏評估裝置及方法，該裝置將一測試集分類為包含一第一明文以及複數個第一金鑰的一第一測試集以及包含一第二金鑰以及複數個第二明文的一第二測試集。該裝置量測一待測電路以取得對應該第一測試集的複數個第一旁通道訊號以及對應該第二測試集的複數個第二旁通道訊號。該裝置基於第一旁通道訊號及第二旁通道訊號的複數個訊號功率，計算第一功率分布及第二功率分布。該裝置基於第一功率分布及第二功率分布的極值，判斷該待測電路是否具有一旁通道洩漏風險。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A side channel leakage assessment apparatus and method are provided. The apparatus classifies a testing set into a first set comprising a first plaintext and first keys and a second set comprising a second key and second plaintexts. The apparatus measures a tested circuit to obtain first side channel signals corresponding to the first set and second side channel signals corresponding to the second set. The apparatus calculates a first power distribution and a second power distribution based on signal powers of the first side channel signals and the second side channel signals. The apparatus determines that whether the tested circuit has a risk of side channel leakage based on extreme values of the first power distribution and the second power distribution.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:旁通道洩漏評估裝置</p>
        <p type="p">12:處理器</p>
        <p type="p">14:儲存器</p>
        <p type="p">16:旁通道感測器</p>
        <p type="p">C:待測電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="80" publication-number="202615947">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615947</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137427</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示光機及投影顯示裝置</chinese-title>
        <english-title>LIGHT ENGINE AND PROJECTION DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241211B">G02F1/1335</main-classification>
        <further-classification edition="200601120241211B">G02B3/00</further-classification>
        <further-classification edition="200601120241211B">G02B27/18</further-classification>
        <further-classification edition="200601120241211B">G02B6/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>毛宇農</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAO, YU-NUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊子玄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TZU-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱訓箴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, HSUN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丘兆仟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHAO-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種顯示光機，包括液晶顯示層、朝向液晶顯示層發出光線的光源、位於液晶顯示層以及光源之間的彩色濾光基板以及設置於光源以及彩色濾光基板之間的透鏡陣列層。彩色濾光基板包括黑色矩陣層與位於黑色矩陣層以及光源之間的透光基板，且黑色矩陣層具有沿著一方向延伸並間隔排列的條狀遮蔽區，而相鄰的條狀遮蔽區之間形成開口區。位於光線傳遞路徑上的透鏡陣列層包括多個透鏡，這些透鏡重疊條狀遮蔽區但不重疊開口區。每個透鏡的寬度不大於條狀遮蔽區的寬度，且透鏡用以偏折光線的一部分，以使此部分通過開口區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light engine is provided, and this light engine includes a liquid crystal display (LCD) layer, a light source which emits the light ray toward the LCD layer, a color filter substrate between the LCD layer and the light source and a lens array layer between the light source and the color filter substrate. The color filter substrate includes a black matrix layer and a transparent plate between the black matrix layer and the light source. The black matrix layer has a plurality of strip shielding regions which extend along with one direction and are spaced from each other. Each of a plurality of opening regions is located between two adjacent strip shielding regions. The lens array layer is on the light path of the light ray and includes a plurality of lenses. These lenses overlap the strip shielding regions but the opening regions. The width of each lens is less than or equal to the width of each strip shielding region. The lens is used to deflect a part of the light ray, so that the part of the light ray passes through the opening regions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示光機</p>
        <p type="p">120:光源</p>
        <p type="p">140:液晶顯示層</p>
        <p type="p">150:聚光透鏡</p>
        <p type="p">160:彩色濾光基板</p>
        <p type="p">180:透鏡陣列層</p>
        <p type="p">L1:光線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="81" publication-number="202616920">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616920</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137428</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光元件封裝結構</chinese-title>
        <english-title>LIGHT EMITTING ELEMENT PACKAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10H20/856</main-classification>
        <further-classification edition="202501120250102B">H10H20/851</further-classification>
        <further-classification edition="200601120250102B">G02B27/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝毅勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, I-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種發光元件封裝結構，包含杯體、發光元件、封裝體及透鏡。杯體包含底板及側壁。發光元件設置於底板上並被側壁圍繞。封裝體填充於杯體中並包覆發光元件，且具有高於側壁的圓弧表面。透鏡設置於杯體上並具有相對的入光側及出光側，且包含內弧面、屋頂式光學元件及外弧面。內弧面位於入光側，且與圓弧表面接觸並貼合。屋頂式光學元件對應發光元件，且包含凹陷部及填充於凹陷部的反射材，凹陷部具有自出光側往入光側凹陷的弧面。外弧面位於出光側，且圍繞屋頂式光學元件，弧面的曲率大於內弧面的曲率，且內弧面的曲率大於外弧面的曲率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light emitting element package includes a cup body, a light emitting element, a package body, and a lens. The cup body includes a bottom plate and a sidewall. The light emitting element is disposed on the bottom plate and surrounded by the sidewall. The package body is filled in the cup body and covers the light emitting element, and has an arc surface higher than the sidewall. The lens is disposed on the cup body, has a light incident side and a light emitting side, and includes an inner arc surface, a roof-type optical element and an outer arc surface. The inner arc surface is located on the light incident side, and is in contact with and attached to the arc surface. The roof-type optical element corresponds to the light emitting element and includes a concave portion and a reflective material filled in the concave portion, and the concave portion has a curve surface recessed from the light emitting side to the light incident side. The outer arc surface is located on the light emitting side and surrounds the roof-type optical element. The curvature of the curve surface is greater than the curvature of the inner arc surface, and the curvature of the inner arc surface is greater than the curvature of the outer arc surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:發光元件封裝結構</p>
        <p type="p">110:杯體</p>
        <p type="p">110B:底板</p>
        <p type="p">110S:側壁</p>
        <p type="p">120:發光元件</p>
        <p type="p">130:封裝體</p>
        <p type="p">140:透鏡</p>
        <p type="p">140R:屋頂式光學元件</p>
        <p type="p">CP:凹陷部</p>
        <p type="p">CS:圓弧表面</p>
        <p type="p">E:邊緣</p>
        <p type="p">EL:出光側</p>
        <p type="p">IL:入光側</p>
        <p type="p">IW:內壁面</p>
        <p type="p">OW:外壁面</p>
        <p type="p">RM:反射材</p>
        <p type="p">S1:內弧面</p>
        <p type="p">S2:外弧面</p>
        <p type="p">S3:弧面</p>
        <p type="p">US:表面</p>
        <p type="p">θ:鈍角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="82" publication-number="202615124">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615124</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137429</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可用於訓練及測量的握力裝置</chinese-title>
        <english-title>GRIPPING DEVICE FOR USES OF USER TRAINING AND MEASURING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">A63B23/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>智遊科技服務股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIFREE INTERACTIVE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矜輝實業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN HUI SILICONE REBBER INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥呈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YANG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張虔祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIEN-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭彥頡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YEN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡紘齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, HUNG CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許智為</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李威聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可用於訓練及測量的握力裝置，其包括：一主體；一彎曲部，設置於該主體一側，用以讓虎口抵靠；及一慣性感測裝置，可拆卸地設置於該主體相對於該彎曲部之一側，可選擇地供一拇指與其他四指中至少一指抵靠並進行按壓，其中，該慣性感測裝置包括：一無線感測模組，一處理器及一回饋裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A gripping device for uses of user training and measuring comprising: a main body; a bending portion arranged on one side of the main body and fitting a purlicue; and an inertial sensing device detachably provided on one side of the main body relative to the bending part, wherein the inertial sensing device can optionally be fitting a thumb or at least one of the other four fingers to pressed, and wherein the inertial sensing device comprises: a wireless sensing module, a processor and a feedback device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:握力裝置</p>
        <p type="p">2:主體</p>
        <p type="p">3:彎曲部</p>
        <p type="p">4:慣性感測裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="83" publication-number="202615735">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615735</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137431</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿精微加工方法及其形成之工件特徵</chinese-title>
        <english-title>A PLASMA MICRO-MACHINING METHOD AND THE RESULTING CHARACTERISTICS OF THE WORKPIECE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">C25F3/16</main-classification>
        <further-classification edition="200601120241104B">H05H1/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>見微科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UCSM TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅尙賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROU, SHANGHSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡孟宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MENGHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>時渝恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種電漿精微加工方法及其形成之工件特徵，其係一種超潔淨表面加工（Ultra Clean Surface Machining, UCSM），其步驟包含：於一容置有一工件之腔室內通入氣體；藉由一供電單元以負載於一具磁場之陰極材料，使該氣體離子化產生電漿，以對該工件表面進行加工；藉此，本發明係可應用於各種材料，如：金屬或陶瓷之工件表面加工，藉以透過電漿以非接觸式加工移除工件表面上之各種切削痕跡、刮痕以及其他汙染物；且加工過程中，無須溶液接觸，加工後亦無須清洗，可大幅度減少工件接觸空氣後之氧化程度；且透過非接觸式加工之方式，使無須施加正向力於工件，因此減少對工件的機械應力，可有效避免於工件表面殘留應力及產生變形問題，且本案係使用氣體產生電漿之方式對工件表面進行加工，故無酸洗處理後所需之廢液回收，使可同時避免對環境造成危害，以達致綠色環保之目標者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a plasma micro-machining method and the resulting characteristics of the workpiece, specifically an Ultra Clean Surface Machining (UCSM) process. The method involves the following steps: introducing gas into a chamber containing a workpiece; utilizing a power supply unit to apply a load to a cathode material within a magnetic field, thereby ionizing the gas to generate plasma for processing the surface of the workpiece. This invention is applicable to various materials, such as metal or ceramic workpiece surfaces, allowing for the non-contact removal of cutting marks, scratches, and other contaminants from the workpiece surface using plasma. During the machining process, no liquid contact is required, and no cleaning is necessary afterward, thereby significantly reducing the oxidation of the workpiece upon exposure to air. Additionally, the non-contact machining method eliminates the need to apply a normal force to the workpiece, thereby reducing mechanical stress and effectively preventing residual stress and deformation issues on the workpiece surface. Furthermore, as the process uses gas to generate plasma for surface machining, it eliminates the need for waste liquid recovery after acid treatment, thereby avoiding environmental harm and achieving the goal of green and environmentally friendly processing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S010~S042:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="84" publication-number="202616250">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616250</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137432</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>驅動電路</chinese-title>
        <english-title>DRIVING CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120241021B">G09G3/32</main-classification>
        <further-classification edition="200601120241021B">G02F1/1335</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧名揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, MING-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊銘宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, MING-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種背光模組的驅動電路，包含數個電晶體及電容器。背光模組陽極接收系統電壓，陰極耦接第一電晶體。驅動電晶體一端耦接第一及第三電晶體，另一端耦接第二電晶體。第一至第三電晶體控制端接收發光控制訊號。第四電晶體兩端各耦接驅動電晶體之第二端及控制端。第一電容器一端耦接第三電晶體，另一端耦接驅動電晶體控制端。第二電容器一端接收輸入電壓，另一端耦接第一電容器。第五電晶體一端耦接第二電容器，另一端接收資料電壓。第六電晶體一端耦接第一電容器，另一端接收輸入電壓。第七電晶體一端耦接驅動電晶體，另一端接收參考電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A backlight module driver circuit includes several transistors and capacitors. An anode of the backlight module receives a system voltage and a cathode of the backlight module is electrically coupled to the first transistor. One terminal of a drive transistor is electrically coupled to the first transistor and a third transistor and another terminal of the drive transistor is electrically coupled to the second transistor. Control terminals of the first transistor, a second transistor and the third transistor receive a light-emitting control signal. Two terminals of the fourth transistor are electrically coupled to the second terminal and the control terminal of the driver transistor respectively. A terminal of a first capacitor is electrically coupled to a third transistor and another terminal of the first capacitor is electrically coupled to the control terminal of the drive transistor. A terminal of a second capacitor receives an input voltage and another terminal of the second terminal is electrically coupled to the first capacitor. A terminal of the fifth transistor is electrically coupled to the second capacitor and another terminal of the fifth transistor receives a data voltage. A terminal of the sixth transistor is electrically coupled to the first capacitor and another terminal of the sixth transistor receives the input voltage. A terminal of the seventh transistor is electrically coupled to the driver transistor and another terminal of the seventh transistor receives a reference voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:驅動電路</p>
        <p type="p">BM:背光模組</p>
        <p type="p">C1,C2:電容器</p>
        <p type="p">EM[n]:發光控制訊號</p>
        <p type="p">S1&lt;sub&gt;n-1&lt;/sub&gt;,S1&lt;sub&gt;n&lt;/sub&gt;,S1&lt;sub&gt;n+1&lt;/sub&gt;:掃描訊號</p>
        <p type="p">T1-T7:電晶體</p>
        <p type="p">TDR:驅動電晶體</p>
        <p type="p">L:發光元件</p>
        <p type="p">VDD:系統高電壓</p>
        <p type="p">V&lt;sub&gt;DATA&lt;/sub&gt;:資料電壓</p>
        <p type="p">V&lt;sub&gt;REF&lt;/sub&gt;:參考電壓</p>
        <p type="p">V&lt;sub&gt;INI&lt;/sub&gt;:輸入電壓</p>
        <p type="p">VSS:系統低電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="85" publication-number="202615941">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615941</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137433</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示面板</chinese-title>
        <english-title>DISPLAY PANEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">G02F1/1333</main-classification>
        <further-classification edition="202501120250102B">H10D30/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯舜齡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, SHUN-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何昇儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, SHENG-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許倩雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIAN-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示面板包含基板、第一畫素、第二畫素、第三畫素、第四畫素、第一數據線、第二數據線、第三數據線以及第四數據線。第一畫素位於基板上。第二畫素鄰近第一畫素的第一側。第三畫素鄰近第一畫素的第二側，第一側垂直第二側。第四畫素鄰近第三畫素的第一側，其中第三畫素的第一側對齊第一畫素的第一側。第一數據線位於基板上及電性連接第一畫素。第二數據線位於基板上及第一畫素與第二畫素之間，電性連接第三畫素。第三數據線位於基板上及第一畫素與第二畫素之間，電性連接第四畫素。第四數據線位於基板上，電性連接第二畫素。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display panel includes a substrate, a first pixel, a second pixel, a third pixel ,a fourth pixel, a first data line, a second data line, a third data line and a fourth data line. The first pixel is located on the substrate. The second pixel is adjacent to a first side of the first pixel. The second pixel is adjacent to a second side of the first pixel. The first side is perpendicular to the second side. The fourth pixel is adjacent to a first side of the third pixel, in which the first side of the third pixel is aligning to the first side of the first pixel. The first data line is located on the substrate and electrically connects the first pixel. The second data line is located on the substrate and between the first pixel and the second pixel and electrically connects the third pixel. The third data is located on the substrate and between the first pixel and the second pixel and electrically connects the fourth pixel. The fourth data line is located on the substrate and electrically connects the second pixel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:顯示面板</p>
        <p type="p">1100:基板</p>
        <p type="p">1101:第一畫素</p>
        <p type="p">1102:第二畫素</p>
        <p type="p">1103:第三畫素</p>
        <p type="p">1104:第四畫素</p>
        <p type="p">1201:第一數據線</p>
        <p type="p">1202:第二數據線</p>
        <p type="p">1203:第三數據線</p>
        <p type="p">1204:第四數據線</p>
        <p type="p">1310:彩色濾光層開口區</p>
        <p type="p">1320:薄膜電晶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="86" publication-number="202614927">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614927</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137435</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具旋轉功能的燒窯</chinese-title>
        <english-title>KILN WITH ROTATING FUNCTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241128B">A21B1/44</main-classification>
        <further-classification edition="200601120241128B">F27B1/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>耀聰文創有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO TSUNG CREATIVE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡聰耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, TSUNG-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具旋轉功能的燒窯包含腔體、加熱裝置、轉軸、第一承托盤、驅動裝置以及至少兩軸承。腔體具有作業空間。加熱裝置設置於腔體，並配置以對作業空間加熱。轉軸具有相對之第一端以及第二端，第一端位於腔體外，第二端位於腔體內。第一承托盤連接第二端。驅動裝置設置於腔體並位於腔體外，驅動裝置連接第一端，並配置以轉動轉軸。軸承設置於腔體，轉軸穿越軸承。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A kiln with rotating function includes a chamber, a heating device, a shaft, a first supporting plate, a driving device and at least two bearings. The chamber has a working space. The heating device is disposed on the chamber and configured to heat up the working space. The shaft has a first end and a second end opposite to the first end. The first end is located outside the chamber. The second end is located inside the chamber. The first supporting plate is connected with the second end. The driving device is disposed on the chamber and located outside the chamber. The driving device is connected with the first end and configured to rotate the shaft. The bearings are disposed on the chamber. The shaft penetrates through the bearings.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:具旋轉功能的燒窯</p>
        <p type="p">110:腔體</p>
        <p type="p">111:底板</p>
        <p type="p">112:軸承座</p>
        <p type="p">113:頂蓋</p>
        <p type="p">1131:板體</p>
        <p type="p">1132:管體</p>
        <p type="p">1133:擋板</p>
        <p type="p">114:側壁</p>
        <p type="p">120:加熱裝置</p>
        <p type="p">121:第一火焰噴嘴</p>
        <p type="p">122:第二火焰噴嘴</p>
        <p type="p">123:第三火焰噴嘴</p>
        <p type="p">124:第四火焰噴嘴</p>
        <p type="p">130:轉軸</p>
        <p type="p">131:第一端</p>
        <p type="p">132:第二端</p>
        <p type="p">140:第一承托盤</p>
        <p type="p">145:第二承托盤</p>
        <p type="p">150:驅動裝置</p>
        <p type="p">160:軸承</p>
        <p type="p">175:保護罩</p>
        <p type="p">191:第一溫度計</p>
        <p type="p">192:第二溫度計</p>
        <p type="p">A-A:線段</p>
        <p type="p">H:穿孔</p>
        <p type="p">OP:開口</p>
        <p type="p">WS:作業空間</p>
        <p type="p">X1:第一高度</p>
        <p type="p">X2:第二高度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="87" publication-number="202616456">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616456</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137441</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光罩載具之充氣載盤</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241217B">H01L21/683</main-classification>
        <further-classification edition="200601120241217B">H01L21/67</further-classification>
        <further-classification edition="201201120241217B">G03F1/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>家碩科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王安邦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, AN-PANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, ZHE-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張博翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, PO-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜林炘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, LIN-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作係一種光罩載具之充氣載盤，其能設於載架上並能承載光罩載具，光罩載具之充氣載盤主要係於盤體上方形成矩形的承載區域，並於對應承載區域的長邊側形成取料凹口，且盤體穿設有充氣接頭及包含有檢知器及按壓開關的檢知組件，充氣接頭與按壓開關係位於承載區域內，檢知器位於承載區域外圍，本創作光罩載具之充氣載盤能透過盤體提供矩形的承載區域供光罩載具置放，並藉由檢知器搭配按壓開關進行多點的檢測控制充氣接頭啟閉，以確保光罩載具置放時之平整度，使充氣接頭能確實對光罩載具進行充氣，藉此能讓光罩載具之充氣載盤能適用於矩形外型之光罩載具。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:盤體</p>
        <p type="p">11:承載區域</p>
        <p type="p">12:取料側</p>
        <p type="p">20:取料凹口</p>
        <p type="p">30:充氣接頭</p>
        <p type="p">40:檢知組件</p>
        <p type="p">41:檢知器</p>
        <p type="p">42:按壓開關</p>
        <p type="p">50:定位擋片</p>
        <p type="p">60:鎖附孔</p>
        <p type="p">70:定位凸柱</p>
        <p type="p">80:支撐板件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="88" publication-number="202615080">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615080</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137442</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>桃子萃取物的用途</chinese-title>
        <english-title>USE OF PEACH EXTRACT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241101B">A61K36/736</main-classification>
        <further-classification edition="200601120241101B">A61K31/7048</further-classification>
        <further-classification edition="200601120241101B">A61P17/00</further-classification>
        <further-classification edition="200601120241101B">A61P7/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大江生醫股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TCI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林詠翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUNG-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴汎蓁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI, FAN-JHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇尹帝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YIN-DI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政大</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種桃子萃取物用於製備改善肌膚及/或貧血的組合物的用途，其中桃子萃取物提取自桃子的紅色果肉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A use of a peach extract for preparing a composition for improving skin and/or anemia, wherein the peach extract is extracted from the red pulp of vinous peach.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="89" publication-number="202615806">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615806</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137446</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>AI智能嬰兒無塵室系統</chinese-title>
        <english-title>AI SMART BABY CLEAN ROOM SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120241213B">F24F11/58</main-classification>
        <further-classification edition="201801120241213B">F24F11/70</further-classification>
        <further-classification edition="201801120241213B">F24F11/88</further-classification>
        <further-classification edition="201801320241213B">F24F110/50</further-classification>
        <further-classification edition="201801320241213B">F24F110/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>研能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICROJET TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫皓然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOU, HAO-JAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳錦銓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIN-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃啟峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHI-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種AI智能嬰兒無塵室系統，包含：空氣監控感測器、空污清淨處理設備、聯網雲端運算服務裝置及中控電腦控制設備，基於空氣監控感測器能夠持續監測環境之空氣品質，並自動啟動空污清淨處理設備，同時配合聯網雲端運算服務裝置之AI智能演算平台具備AI智能控制、智能化的能源管理和故障診斷功能技術，使得嬰兒無塵室環境能夠根據實時的環境變化做出快速反應，優化系統能效，並保持最佳空氣品質，為嬰兒創造一個持續潔淨、健康的空氣環境，並減少空氣中有害污染物對嬰兒的影響。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An ai smart baby clean room system is disclosed and includes an air monitoring detector, an air pollution cleaning device, a networked cloud computing service device and a central computer control device. Based on the air monitoring detector, it can continuously monitor the air quality of the environment and automatically turn on the air pollution purification treatment equipment. At the same time, cooperating with an AI ​​intelligent computing platform of the networked cloud computing service device, which is equipped with an AI intelligent controlling, an intelligent energy management and a fault diagnosis function technology, the baby clean room is enabled to respond quickly according to real-time environmental changes. Therefore, the energy efficiency of the system is optimized, and the air quality is maintained at the best level, creating a continuously clean and healthy air environment for babies, and reducing the impact of harmful pollutants in the air on babies.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:空氣監控感測器</p>
        <p type="p">2:空污清淨處理設備</p>
        <p type="p">3:聯網雲端運算服務裝置</p>
        <p type="p">4:中控電腦控制設備</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="90" publication-number="202615937">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615937</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137447</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢測方法</chinese-title>
        <english-title>INSPECTION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250418B">G02F1/133</main-classification>
        <further-classification edition="200601120250418B">G02B5/22</further-classification>
        <further-classification edition="202301120250418B">H04N25/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江俊宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHUN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓國豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, GUO HAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種檢測方法適於檢測彩色濾光基板。檢測方法包括下列步驟。取得彩色濾光基板的原始彩色影像資料。過濾出原始彩色影像資料中的RGB三種顏色成份，以獲得第一初步處理影像資料。掃描第一初步處理影像資料，以獲得對應彩色濾光基板的多個色阻的第一映射資料。根據原始彩色影像資料，建立原始位置影像資料。將第一映射資料映射至原始位置影像資料，以建立理想彩色影像資料。映射彩色濾光基板的原始彩色影像資料的漏光區域的多個畫素座標至理想彩色影像資料，以判斷漏光區域於彩色濾光基板上的實際位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An inspection method is adapted to inspect a color filter substrate. The inspection method includes following steps. An original color image data of the color filter substrate is obtained. RGB three color component of the original color image data is filtered out to obtain a first preliminary processed image data. The first preliminary processed image data is scanned to obtain a first mapping data corresponding to color resistors of the color filter substrate. Based on the original color image data, an original position image data is established. The first mapping data is mapped to the original position image data to establish an ideal color image data. Pixel coordinates of a light leakage area of the original color image data of the color filter substrate are mapped to the ideal color image data to determine an actual position of a light leakage area on the color filter substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:彩色濾光基板</p>
        <p type="p">110:遮光圖案層</p>
        <p type="p">110a:開口</p>
        <p type="p">112:第一遮光部</p>
        <p type="p">114:第二遮光部</p>
        <p type="p">120R:第一色阻</p>
        <p type="p">120G:第二色阻</p>
        <p type="p">120B:第三色阻</p>
        <p type="p">d1:第一方向</p>
        <p type="p">d2:第二方向</p>
        <p type="p">IM:彩色影像資料</p>
        <p type="p">R:漏光區域</p>
        <p type="p">W112、W114:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="91" publication-number="202616200">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616200</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137448</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>大眾傳播媒體民自維新系統與其運作方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250203B">G06Q50/00</main-classification>
        <further-classification edition="202301120250203B">G06Q30/0201</further-classification>
        <further-classification edition="202301120250203B">G06Q10/00</further-classification>
        <further-classification edition="202201120250203B">H04L51/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜明潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜佳隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜明潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳友炘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種大眾傳播媒體民自維新系統與其運作方法。大眾傳播媒體民自維新系統包含一主系統模組及一資料庫。資料庫透過有線方式或無線方式與主系統模組進行一資料傳輸。其中，主系統模組具有複數次系統模組與至少一次資料庫，且複數次系統模組與至少一次資料庫為與公民議題相關之次系統模組與次資料庫，而其運作法，乃是為使社會產生永續、自動化、快速但溫和改革、創新目的，而以媒體固有功能，結合社會價值、品管、資管、企管等科學理論與技術，所作的一連串努力，型塑出能有效解決社會問題的一種可行性方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:大眾傳播媒體民自維新系統</p>
        <p type="p">220:議題評價系統</p>
        <p type="p">230:公眾討論系統</p>
        <p type="p">240:提案系統</p>
        <p type="p">250:推廣與圈會組織管理組建系統</p>
        <p type="p">260:擴大公眾參與系統</p>
        <p type="p">270:成果分析檢定系統</p>
        <p type="p">280:達標成果推廣系統</p>
        <p type="p">410:專家知識資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="92" publication-number="202615797">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615797</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137451</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>燃氣混合裝置</chinese-title>
        <english-title>GAS MIXER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">F23D14/02</main-classification>
        <further-classification edition="200601120241105B">F23D14/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺北科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李達生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DA-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李尚澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SHANG-TSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥棠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種燃氣混合裝置包括殼體與進氣管。殼體具有主體、第一進氣通道、第二進氣通道以及出氣通道。第一進氣通道、第二進氣通道以及出氣通道分別連通於主體。第一進氣通道的中心軸與第二進氣通道的中心軸延伸相交。進氣管與殼體的第一進氣通道可移動地耦合，使得進氣管的前端可以通過第一進氣通道延伸至第二進氣通道上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A gas mixer includes a housing and an intake pipe. The housing has a main body, a first intake port, a second intake port, and an outlet. The first intake port, the second intake port, and the outlet are connected to the main body, respectively. A central axis of the first intake port and a central axis of the second intake port intersect. The intake pipe is movably coupled to the first intake port of the housing, such that a front end of the intake pipe extends through the first intake port to above the second intake port.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:燃氣混合裝置</p>
        <p type="p">100:殼體</p>
        <p type="p">110:主體</p>
        <p type="p">120:第一進氣通道</p>
        <p type="p">130:第二進氣通道</p>
        <p type="p">140:出氣通道</p>
        <p type="p">200:進氣管</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="93" publication-number="202615821">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615821</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137453</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>線性感測器</chinese-title>
        <english-title>LINEAR SENSOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">G01D5/245</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商多摩川精機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMAGAWA SEIKI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>下平勝紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMODAIRA, KATSUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐宏昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉俞佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠偵測軸構件的軸心方向的位置以及軸構件的圓周方向的角度的線性感測器。該線性感測器包括軸構件，具有由磁性材料製成的第一被檢測部和第二被檢測部，並可沿軸心方向移動、以及第一磁性感測器、第二磁性感測器、和位置角度運算單元、該第一被檢測部的外周面形成右旋螺紋，第二被檢測部的外周面形成右旋螺紋，第一磁性感測器輸出與第一被檢測部的位置相對應的第一感測信號。且第二磁性感測器輸出對應於右旋螺紋相對於第二磁性感測器的位置的第二感測信號。位置角度運算單元根據第一感測信號與第二感測信號計算軸構件在軸心方向上的角度以及軸構件在圓周方向上的角度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:軸構件</p>
        <p type="p">2:第一磁性感測器</p>
        <p type="p">3:第二磁性感測器</p>
        <p type="p">11:第一被檢測部</p>
        <p type="p">12:第二被檢測部</p>
        <p type="p">111:左旋螺紋</p>
        <p type="p">121:右旋螺紋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="94" publication-number="202616175">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616175</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137454</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>區塊鏈錢包管理方法</chinese-title>
        <english-title>A MANAGEMENT METHOD FOR A CRYPTOCURRENCY WALLET</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250203B">G06Q20/36</main-classification>
        <further-classification edition="201201120250203B">G06Q20/02</further-classification>
        <further-classification edition="201201120250203B">G06Q20/40</further-classification>
        <further-classification edition="202201120250203B">H04L9/40</further-classification>
        <further-classification edition="200601120250203B">H04L9/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣大哥大股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN MOBILE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓昆舉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, KUN-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張天磯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TIEN-JI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種區塊鏈錢包的管理方法包含：透過裝置接收電信資訊；針對電信資訊以預設電信資訊進行電信特徵驗證；當電信特徵驗證通過後，透過裝置接收還原密碼；當還原密碼相同於預設還原密碼後，允許裝置登入區塊鏈錢包；當電信特徵驗證失敗或還原密碼不同於預設還原密碼，使裝置無法利用區塊鏈錢包進行交易申請。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A management method for a cryptocurrency wallet includes: receiving a telecommunication information by a device; operating a telecommunication feature verification with a preset telecommunication information for the telecommunication information; when the telecommunication feature verification is passed, receiving a restore password by the device; when the restore password is same as a preset restore password, allowing the device to log in to the cryptocurrency wallet; when the telecommunication feature verification is failed or the restore password is different from the preset restore password, the device is not able to make transaction requests by using the cryptocurrency wallet.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:區塊鏈錢包管理方法</p>
        <p type="p">S210、S220、S230、S240、S250、S260:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="95" publication-number="202616781">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616781</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137455</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>內埋元件電路板及其製造方法</chinese-title>
        <english-title>CIRCUIT BOARD WITH EMBEDDED ELEMENTS AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">H05K1/02</main-classification>
        <further-classification edition="200601120241204B">H05K1/18</further-classification>
        <further-classification edition="200601120241204B">H05K3/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商慶鼎精密電子(淮安)有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QINGDING PRECISION ELECTRONICS (HUAI'AN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商鵬鼎控股(深圳)股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVARY HOLDING (SHENZHEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鵬鼎科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐菀翎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, WAN-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種內埋元件電路板及其製造方法，內埋元件電路板包含兩個互相電性連接的線路基板、設置於線路基板之間的接合層、電子元件以及超導抗磁模組。接合層具有容置開槽，電子元件以及超導抗磁模組設置於接合層的容置開槽內側。電子元件電性連接至至少一線路基板。超導抗磁模組包含第一部件以及第二部件。第一部件固定於電子元件上，而第二部件固定於其中一線路基板上，並且對應第一部件而設置。第一部件位於電子元件以及第二部件之間，且當超導抗磁模組處於邁斯納效應下，第一部件懸浮於接合層的容置開槽內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit board with embedded elements and a method for fabricating the same are provided. The circuit board with embedded elements includes two circuit boards electrically connected to each other, an adhesive layer between the circuit boards, an electronic component and a superconductive diamagnetism module. The adhesive layer has a cavity, and the electronic component and the superconductive diamagnetism module are disposed inside the cavity. The electronic component is electrically connected to at least one of the circuit boards. The superconductive diamagnetism module includes a first component and a second component. The first component is fixed to the electronic component, while the second component is fixed to one of the circuit boards and is disposed opposite to the first component. The first component is located between the electronic component and the second component. When the superconductive diamagnetism module is under Meissner effect, the first component is suspended in the cavity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:內埋元件電路板</p>
        <p type="p">305:導電孔</p>
        <p type="p">310,320,330:線路基板</p>
        <p type="p">312,322,332:絕緣層</p>
        <p type="p">314,324a,324b,334:線路層</p>
        <p type="p">340,350:接合層</p>
        <p type="p">345,355:容置開槽</p>
        <p type="p">360,370:電子元件</p>
        <p type="p">320f,320s:表面</p>
        <p type="p">380,390:超導抗磁模組</p>
        <p type="p">382a,382b,392a,392b:第一部件</p>
        <p type="p">384a,384b,394a,394b:第二部件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="96" publication-number="202615960">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615960</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137457</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學檢測裝置及光學檢測方法</chinese-title>
        <english-title>OPTICAL DETECTION DEVICE AND OPTICAL DETECTION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120241104B">G03B35/08</main-classification>
        <further-classification edition="200601120241104B">G01B11/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龔士勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNG, SYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃彥樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YAN-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種具有光學檢測模組之光學檢測裝置及光學檢測方法。光學檢測模組包括：3D光學檢測儀，沿著平行於第一方向之中軸設置且具有3D檢測鏡頭，且3D檢測鏡頭之鏡頭方向朝向對準中軸之預定區塊以檢測其3D資訊；照明模組，在3D檢測鏡頭與預定區塊之間環繞著中軸設置，且對預定區塊提供照明光線；以及2D檢測模組，包含具有2D檢測鏡頭之複數個2D光學檢測儀環繞著中軸設置。各2D檢測鏡頭之鏡頭方向偏移中軸，且基於預設光徑取得預定區塊之2D影像。預設光徑至少具有第一光徑，且第一光徑相對於第一方向具有至少一傾斜角。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides an optical inspection device with an optical inspection module and an optical inspection method. The optical inspection module includes: a 3D optical inspection instrument set along a central axis parallel to a first direction and having a 3D inspection lens, the direction of the lens of the 3D inspection lens aimed at a predetermined region aligned with the central axis to detect its 3D information; an illumination module, set around the central axis between the 3D inspection lens and the predetermined region, providing illumination light to the predetermined region; and a 2D inspection module, including a plurality of 2D optical inspection instruments having a 2D inspection lens set around the central axis. The direction of the lens of each 2D inspection lens is offset from the central axis and captures 2D images of the predetermined region based on a preset optical path. The preset optical path includes at least a first optical path, and the first optical path has at least one tilt angle relative to the first direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:光學檢測模組</p>
        <p type="p">100:照明模組</p>
        <p type="p">110:燈條</p>
        <p type="p">120:支架</p>
        <p type="p">200:2D光學檢測儀</p>
        <p type="p">210:2D檢測鏡頭</p>
        <p type="p">300:3D光學檢測儀</p>
        <p type="p">400:2D光學檢測儀</p>
        <p type="p">500:線掃雷射儀</p>
        <p type="p">600:遠心鏡頭</p>
        <p type="p">D1:第一方向</p>
        <p type="p">O:中軸</p>
        <p type="p">Q1:照射面</p>
        <p type="p">RD:2D檢測模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="97" publication-number="202615920">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615920</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137458</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鏡頭模組及電子裝置</chinese-title>
        <english-title>LENS MODULE AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120241101B">G02B7/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新鉅科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEWMAX TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁永福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, YUN GFU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王宗珪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TSUNG-KUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鏡頭模組包括：一電路板，包括一開窗結構，該開窗結構由上表面貫穿至下表面；一鏡筒，設置於該電路板之該上表面；一光學透鏡組，設置於該鏡筒內，並對應該開窗結構，其中該光學透鏡組包括第一透鏡至第N透鏡，該第N透鏡為該光學透鏡組之最靠近該像側的透鏡；一光學感測器，設置且電性連接於該電路板之該下表面，並對應該電路板之該開窗結構；其中該鏡筒朝向該像側之一端部設有一環狀凸塊，該環狀凸塊環繞該中心軸，且該環狀凸塊比該第N透鏡之像側表面更接近該像側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A lens module includes: a circuit board including a window structure that penetrates from an upper surface to a lower surface; a lens barrel disposed on the upper surface of the circuit board; an optical lens assembly disposed on in the lens barrel and corresponding to the window structure, wherein the optical lens assembly includes a first lens to an N-th lens, and the N-th lens is the lens of the optical lens assembly being closest to an image side; an optical sensor disposed and electrically connected to the lower surface of the circuit board and corresponding to the window structure of the circuit board; wherein the lens barrel is provided with an annular protrusion at one end portion toward the image side, and the annular protrusion surrounds a central axis, and the annular protrusion is closer to the image side than an image-side surface of the Nth lens.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:鏡頭模組</p>
        <p type="p">10:電路板</p>
        <p type="p">101:上表面</p>
        <p type="p">102:下表面</p>
        <p type="p">103:開窗結構</p>
        <p type="p">11:鏡筒</p>
        <p type="p">110:端部</p>
        <p type="p">111:環狀凸塊</p>
        <p type="p">1111:切邊</p>
        <p type="p">12:光學透鏡組</p>
        <p type="p">120:第N透鏡</p>
        <p type="p">1201:像側表面</p>
        <p type="p">121:第一透鏡</p>
        <p type="p">122:第二透鏡</p>
        <p type="p">123:第三透鏡</p>
        <p type="p">13:光學感測器</p>
        <p type="p">CL:中心軸</p>
        <p type="p">L1:距離</p>
        <p type="p">L2:厚度</p>
        <p type="p">L3:厚度</p>
        <p type="p">OS:物側</p>
        <p type="p">IS:像側</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="98" publication-number="202616896">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616896</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137459</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鈣鈦礦太陽能發電模組及建築物遮蔽裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10F19/00</main-classification>
        <further-classification edition="202501120250102B">H10F77/12</further-classification>
        <further-classification edition="202501120250102B">H10F71/00</further-classification>
        <further-classification edition="202301120250102B">H10K30/88</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈞匠科技實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOLDEN ARTISTAN TECHNOLOGY INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳律謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖鉦達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鈣鈦礦太陽能發電模組，包含一太陽能板邊框、至少一太陽能板、一第一保護面板、一第二保護面板與一密封體結構，該太陽能板設置於該太陽能板邊框，該太陽能板邊框壓合於該第一保護面板與該第二保護面板之間並由該密封體結構環繞其周邊，於內部形成一密封腔，使該太陽能板不易受環境影響氧化，從而提升其穩定性；此外，在另一實施例提供一種建築物遮蔽裝置，將前述之鈣鈦礦太陽能發電模組嵌設於一外框體內，可依建築物風格與需求進行多樣化的遮蔽裝置設計，並將再生能源落實於日常生活中，進一步推動綠色建築發展。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:鈣鈦礦太陽能發電模組</p>
        <p type="p">10:太陽能板邊框</p>
        <p type="p">11:開口</p>
        <p type="p">20:太陽能板</p>
        <p type="p">30:第一保護面板</p>
        <p type="p">40:第二保護面板</p>
        <p type="p">50:密封體結構</p>
        <p type="p">60:絕緣體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="99" publication-number="202616297">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616297</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137460</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>預測計算系統及其運作方法</chinese-title>
        <english-title>PREDICTION COMPUTING SYSTEM AND ITS OPERATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120241202B">G16H50/20</main-classification>
        <further-classification edition="201801120241202B">G16H50/30</further-classification>
        <further-classification edition="201801120241202B">G16H50/50</further-classification>
        <further-classification edition="201801120241202B">G16H50/70</further-classification>
        <further-classification edition="201801120241202B">G16H30/40</further-classification>
        <further-classification edition="201901120241202B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺北醫學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIPEI MEDICAL UNIVERSITY (TMU)</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭徐鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, SYU-JYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡明蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MIN-LAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種預測計算系統的運作方法，其包含以下步驟。對兒童大腦的磁振造影影像進行前處理，以得出前處理後磁振造影影像；從前處理後磁振造影影像找出感興趣區域；基於感興趣區域以得出多個影像組學特徵；以及基於多個影像組學特徵進行機器學習，以得出癲癇預測模型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an operating method of a prediction computing system, which includes steps as follows. The magnetic resonance imaging image of children's brain is pre-processed to obtain a pre-processed magnetic resonance imaging image; a regions of interest is found from the pre-processed magnetic resonance imaging image; multiple radiomic features are obtained based on the regions of interest; and a machine learning based on the multiple radiomics features is performed to derive an epilepsy prediction model.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:運作方法</p>
        <p type="p">S201~S204:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="100" publication-number="202616063">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616063</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137461</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>存儲管理方法及存儲管理裝置</chinese-title>
        <english-title>STORAGE MANAGEMENT METHOD AND STORAGE MANAGEMENT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">G06F3/06</main-classification>
        <further-classification edition="200601120250203B">G06F12/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商星宸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIGMASTAR TECHNOLOGY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪艷青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YAN-QING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳艷雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YAN-XIONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">存儲管理方法，藉由一文件系統存取一存儲設備。存儲設備包括複數個區塊，文檔系統中包括映射於複數個區塊的複數個邏輯塊，複數個邏輯塊的每一者有一個邏輯塊號。存儲管理方法包含：接收一第一存儲請求以存儲第一類型的一第一資料；回應第一存儲請求將複數個邏輯塊中的一第一邏輯塊劃分為複數個子邏輯塊；分配複數個子邏輯塊的一第一子邏輯塊予第一資料；生成映射於第一子邏輯塊的一第一邏輯識別碼以在第一邏輯識別碼中記錄第一類型對應的一為第一值的狀態標記、第一子邏輯塊的一子邏輯塊號以及第一邏輯塊的邏輯塊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A storage management method accesses a storage device via a file system. The storage device includes a plurality of blocks, and the file system includes a plurality of logical blocks mapped to the plurality of blocks. Each of the plurality of logical blocks has a logical block number. The storage management method includes: receiving a first storage request to store a first data of a first type; in response to the first storage request, dividing a first logical block of the plurality of logical blocks into a plurality of sub-logical blocks; assigning a first sub-logical block of the plurality of sub-logical blocks to the first data; generating a first logical identification code mapped to the first sub-logical block, to record in the first logical identification code a status flag of the first type corresponding to a first value, a sub-logical block number of the first sub-logical block, and a logical block number of the first logical block.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:方法</p>
        <p type="p">210~240:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="101" publication-number="202616725">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616725</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137462</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影音資料同步裝置與影音資料同步方法</chinese-title>
        <english-title>VIDEO DATA AND AUDIO DATA SYNCHRONIZATION DEVICE AND VIDEO DATA AND AUDIO DATA SYNCHRONIZATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120250203B">H04N21/242</main-classification>
        <further-classification edition="201101120250203B">H04N21/43</further-classification>
        <further-classification edition="201101120250203B">H04N21/236</further-classification>
        <further-classification edition="200601120250203B">H04N5/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商星宸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIGMASTAR TECHNOLOGY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳建華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JIAN-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">影音資料同步裝置包含音訊輸入電路、圖像輸入電路、處理器、音訊輸出電路及圖像輸出電路。音訊輸入電路根據第一時脈訊號接收音訊輸入。處理器用以：根據寫入指標儲存音訊輸入憶體；處理經由圖像輸入電路接收的圖像輸入以產生圖像輸出並儲存至記憶體；處理音訊輸入以產生音訊輸出並儲存至記憶體。音訊輸出電路根據讀取指標及第二時脈訊號輸出音訊輸出中的子音訊資料，並調整第二時脈訊號。圖像輸出電路自記憶體讀出圖像輸出中的圖幀資料。處理器根據圖幀資料與子音訊資料的時間戳差值決定是否控制圖像輸出電路停止輸出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A video data and audio data synchronization device includes an audio input circuit, a video input circuit, a processor, an audio output circuit, and a video output circuit. The audio input circuit receives audio input according to a first clock signal. The processor is configured to: store the audio input into a memory according to a write pointer; process the video input received via the video input circuit to generate video output and store it into the memory; process the audio input to generate audio output and store it into the memory. The audio output circuit outputs sub-audio data in the audio output according to a read pointer and a second clock signal, and adjusts the second clock signal. The video output circuit reads out frame data in the video output from the memory. The processor determines whether to control the video output circuit to stop outputting according to the timestamp difference between the frame data and the sub-audio data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:影音資料同步裝置</p>
        <p type="p">101:輸入介面</p>
        <p type="p">102:記憶體</p>
        <p type="p">102A:儲存空間</p>
        <p type="p">110:音訊輸入電路</p>
        <p type="p">120:圖像輸入電路</p>
        <p type="p">130:處理器</p>
        <p type="p">140:音訊輸出電路</p>
        <p type="p">150:圖像輸出電路</p>
        <p type="p">160:音訊處理電路</p>
        <p type="p">170:圖像處理電路</p>
        <p type="p">AD1:音訊輸入資料</p>
        <p type="p">AD2:音訊輸出資料</p>
        <p type="p">ATS:音訊時間戳</p>
        <p type="p">CLK1:時脈訊號</p>
        <p type="p">CLK2:時脈訊號</p>
        <p type="p">ID1:圖像輸入資料</p>
        <p type="p">ID2:圖像輸出資料</p>
        <p type="p">IF:圖幀資料</p>
        <p type="p">ITS:圖像時間戳</p>
        <p type="p">LT:目標值</p>
        <p type="p">RP:讀取指標</p>
        <p type="p">SA:子音訊資料</p>
        <p type="p">WP:寫入指標</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="102" publication-number="202616098">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616098</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137463</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於通用序列匯流排協議的訊號發射器與其交握方法</chinese-title>
        <english-title>SIGNAL TRANSMITTER BASED ON UNIVERSAL SERIAL BUS PROTOCOL AND HANDSHAKE METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">G06F13/40</main-classification>
        <further-classification edition="200601120250203B">G06F13/38</further-classification>
        <further-classification edition="200601120250203B">G06F13/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商星宸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIGMASTAR TECHNOLOGY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪思鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, SI-XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龐振洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANG, ZHEN-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>屈甜麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QU, TIAN-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">訊號發射器包含驅動電路、控制電路以及箝位電路。驅動電路在一交握階段中根據一資料訊號調整一訊號墊的位準，以與一電子裝置進行速度協商。控制電路根據一通用序列匯流排協議中的一操作模式訊號以及一發射有效訊號產生一箝位訊號。箝位電路根據該箝位訊號在該交握階段中啟動，以限制該訊號墊的位準。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A signal transmitter includes a driving circuit, a control circuit, and a clamping circuit. The driving circuit adjusts a level of a signal pad according to a data signal during a handshake phase to perform a speed negotiation with an electronic device. The control circuit generates a clamping signal according to an operational mode signal and a transmit valid signal in a universal serial bus (USB) protocol. The clamping circuit is activated according to the clamping signal during the handshake phase to limit the level of the signal pad.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:訊號發射器</p>
        <p type="p">101:電子裝置</p>
        <p type="p">110:驅動電路</p>
        <p type="p">120:控制電路</p>
        <p type="p">130:箝位電路</p>
        <p type="p">AVDD1,AVDD2:電源電壓</p>
        <p type="p">HSCJ:箝位訊號</p>
        <p type="p">DN,DP:資料訊號</p>
        <p type="p">MN1~MN3,MP1:電晶體</p>
        <p type="p">OpMode[1：0]:操作模式訊號</p>
        <p type="p">P1:訊號墊</p>
        <p type="p">RDN:下拉電阻</p>
        <p type="p">RT1,RT2:終端電阻</p>
        <p type="p">RUP:上拉電阻</p>
        <p type="p">TxValid:發射有效訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="103" publication-number="202615156">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615156</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137464</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>殘膠清潔模組與電子組件組裝系統</chinese-title>
        <english-title>GLUE RESIDUE CLEANING MODULE AND ELECTRONIC COMPONENT ASSEMBLY SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120241204B">B05B15/50</main-classification>
        <further-classification edition="202401120241204B">B08B1/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>致茂電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHROMA ATE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王勝弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHENG-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張博翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, PO-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖哲民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, ZHE-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種殘膠清潔模組與電子組件組裝系統，其中殘膠清潔模組設置用以清除物件上的殘膠。所述殘膠清潔模組包含基座以及殘膠容置部。基座具有進氣接頭與至少一導氣狹縫，進氣接頭連通所述至少一導氣狹縫，且所述至少一導氣狹縫相鄰於清潔區域。殘膠容置部可拆卸地連接基座且具有至少一出氣孔。其中於垂直方向上，殘膠容置部在基座下方，所述至少一導氣狹縫用以導引氣流沖擊清潔區域中的物件，並且氣流係自所述至少一出氣孔離開所述殘膠清潔模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a glue residue cleaning module and an electronic component assembly system, wherein the glue residue cleaning module is configured to remove glue residue on an object. The glue residue cleaning module comprises a base and a glue residue receiving portion. The base has an air inlet and at least one air guide slit. The air inlet is connected to the at least one air guide slit, and the at least one air guide slit is adjacent to a cleaning area. The glue residue receiving portion is detachably connected to the base and has at least one air outlet. In a vertical direction, the glue residue receiving portion is below the base, the at least one air guide slit is used to guide an air flow to impact the object in the cleaning area, and the air flow leaves the glue residue cleaning module from the at least one air outlet.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:殘膠清潔模組</p>
        <p type="p">10:基座</p>
        <p type="p">100:進氣接頭</p>
        <p type="p">102:通孔部</p>
        <p type="p">12:殘膠容置部</p>
        <p type="p">120:出氣孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="104" publication-number="202615888">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615888</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137465</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>封裝殼體、雷射雷達模組及自動駕駛車輛</chinese-title>
        <english-title>PACKAGING HOUSING, LASER LIDAR MODULE, AND AUTONOMOUS VEHICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">G01S7/481</main-classification>
        <further-classification edition="200601120241104B">G01S7/483</further-classification>
        <further-classification edition="200601120241104B">G01S17/08</further-classification>
        <further-classification edition="200601120241104B">B60W40/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭修維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, HSIU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖友廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請實施例涉及封裝殼體、雷射雷達模組及自動駕駛車輛。所述封裝殼體包括管殼、第一功能層、第二功能層、用於電連接的第一引腳及控溫層。所述管殼包括密閉的內腔和包圍所述內腔的第一側壁及第二側壁。第一透光孔和第二透光孔貫穿所述第一側壁並間隔設置。第一通孔貫穿所述第二側壁。所述第一功能層嵌入並填充所述第一透光孔。所述第一功能層包括第一準直鏡和第一濾波片。所述第二功能層嵌入並填充所述第二透光孔。所述第二功能層包括第一收光鏡和第二濾波片。所述第一引腳穿過並填充所述第一通孔。所述控溫層容置於所述內腔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure relate to a packaging housing, a laser Light Detection and Ranging (LiDAR)module, and an autonomous vehicle. The packaging housing includes a shell, a first functional layer, a second functional layer, a first pin for electrical connection, and a temperature control layer. The shell includes a sealed inner cavity surrounded by a first side wall and a second side wall. A first light-transmitting hole and a second light-transmitting hole penetrate the first side wall and are spaced apart from each other. A first through-hole penetrates the second side wall. The first functional layer is embedded in and fills the first light-transmitting hole. The first functional layer includes a first collimating lens and a first filter. The second functional layer is embedded in and fills the second light-transmitting hole. The second functional layer includes a first light-receiving lens and a second filter. The first pin passes through and fills the first through-hole. The temperature control layer is accommodated within the inner cavity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:雷射雷達模組</p>
        <p type="p">10:封裝殼體</p>
        <p type="p">11:管殼</p>
        <p type="p">111:第一側壁</p>
        <p type="p">112:第二側壁</p>
        <p type="p">113:第三側壁</p>
        <p type="p">114:內腔</p>
        <p type="p">13:功能層</p>
        <p type="p">131:第一功能層</p>
        <p type="p">131a:第一準直鏡</p>
        <p type="p">131b:第一濾波片</p>
        <p type="p">132:第二功能層</p>
        <p type="p">132a:第一收光鏡</p>
        <p type="p">132b:第二濾波片</p>
        <p type="p">15:引腳</p>
        <p type="p">151:第一引腳</p>
        <p type="p">152:第二引腳</p>
        <p type="p">17:控溫層</p>
        <p type="p">20:雷射收發模組</p>
        <p type="p">21:發光模組</p>
        <p type="p">211:雷射源</p>
        <p type="p">212:第二準直鏡</p>
        <p type="p">213:掃描模組</p>
        <p type="p">214:光學相位陣列晶片</p>
        <p type="p">215:四分之一波片</p>
        <p type="p">216:偏振分光鏡</p>
        <p type="p">23:收光模組</p>
        <p type="p">231:光感測器</p>
        <p type="p">233:第二收光鏡</p>
        <p type="p">30:內置電路板模組</p>
        <p type="p">31:第一電路板</p>
        <p type="p">33:光源驅動板</p>
        <p type="p">35:晶片驅動板</p>
        <p type="p">Q:待測目標</p>
        <p type="p">H1:第一透光孔</p>
        <p type="p">H2:第二透光孔</p>
        <p type="p">K1:第一通孔</p>
        <p type="p">K2:第二通孔</p>
        <p type="p">M1、M2:腔面</p>
        <p type="p">S1:上蓋</p>
        <p type="p">S2:底座</p>
        <p type="p">W:外壁面</p>
        <p type="p">G1:第一導線</p>
        <p type="p">G2:第二導線</p>
        <p type="p">G3:第三導線</p>
        <p type="p">G4:第四導線</p>
        <p type="p">L1:光源光</p>
        <p type="p">L2:平行光</p>
        <p type="p">L21:第一雷射</p>
        <p type="p">L22:非工作光</p>
        <p type="p">L3:第二雷射</p>
        <p type="p">L4:參考光</p>
        <p type="p">L5:探測光</p>
        <p type="p">Z:垂直方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="105" publication-number="202615212">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615212</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137476</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>除鏽裝置</chinese-title>
        <english-title>HIGH-PRESSURE FLUID DESCALING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250106B">B24B27/033</main-classification>
        <further-classification edition="200601120250106B">B08B3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立勤益科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃豊翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, LI-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, REN-JHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許國壬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, KUO-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳凱榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KAI-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仕偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種改良的除鏽裝置，其包含液體連通的一第一矩形框架與一第二矩形框架，透過流道搭配支撐架的設計來提升整體的結構強度，經證實本發明所提供的除鏽裝置能夠承受水壓達250BAR，持久性與耐用性顯著提升，可有效的去除鋼胚表面的繡皮，減少鋼胚表面缺陷，提升整體製程的良率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a high-pressure fluid descaling device, which consists of a first rectangular frame and a second rectangular frame connected via liquid communication. The design incorporates flow channels and support structures to enhance the overall structural strength. It has been proven that the rust removal device provided by this invention can withstand water pressure up to 250 BAR, significantly improving durability and longevity. The device effectively removes rust from the surface of steel billets, reduces surface defects, and enhances the overall yield of the manufacturing process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:除鏽裝置</p>
        <p type="p">10:第一矩形框架</p>
        <p type="p">11:進水管</p>
        <p type="p">111:固定板</p>
        <p type="p">12:第一矩形框架上管</p>
        <p type="p">13:第一矩形框架左支撐柱</p>
        <p type="p">14:第一矩形框架右支撐柱</p>
        <p type="p">15:第一矩形框架下管</p>
        <p type="p">16:第一連通管</p>
        <p type="p">17:第二連通管</p>
        <p type="p">20:第二矩形框架</p>
        <p type="p">21:第二矩形框架上支撐管</p>
        <p type="p">22:第二矩形框架左管</p>
        <p type="p">23:第二矩形框架右管</p>
        <p type="p">24:第二矩形框架下支撐管</p>
        <p type="p">25:第三連通管</p>
        <p type="p">26:第四連通管</p>
        <p type="p">30:加強連接件</p>
        <p type="p">F:固定板</p>
        <p type="p">S:噴嘴</p>
        <p type="p">θ&lt;sub&gt;1&lt;/sub&gt;、θ&lt;sub&gt;2&lt;/sub&gt;:夾角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="106" publication-number="202615559">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615559</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137480</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱裂解反應系統及其方法</chinese-title>
        <english-title>THERMAL CRACKING REACTION SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241016B">C08J11/12</main-classification>
        <further-classification edition="202201120241016B">B09B3/40</further-classification>
        <further-classification edition="200601120241016B">C10G1/00</further-classification>
        <further-classification edition="200601120241016B">F23G7/12</further-classification>
        <further-classification edition="202201320241016B">B09B101/75</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穩碳永續股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACCE BIOTECH COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾堯宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YAO-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡育德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YU-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉建良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIEN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾宛真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, WAN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種熱裂解反應系統及其方法。系統至少包含進料單元、反應單元、及冷凝單元。進料單元用以提供反應物料，並使反應物料在充滿氮氣氣體及幾乎無氧的條件下輸送，其中反應物料為可熱裂解的塑膠物料。反應單元用以連續接收反應物料，並進行熱裂解反應，以產生裂解氣體。冷凝單元用以接收並冷凝裂解氣體，以產生冷凝液體，且排出尾氣氣體。其中，冷凝液體包含反應物料經裂解後所產生的單體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A thermal cracking reaction system and a method thereof are provided. The system includes a feeding unit, a reaction unit, and a condensation unit. The feeding unit is used to supply and transport the reaction material under nitrogen-filled and nearly oxygen-free conditions, where the reaction material is a thermally decomposable plastic material. The reaction unit is configured to continuously receive the reaction material and perform a thermal cracking reaction to generate cracked gas. The condensation unit is used to receive and condense the cracked gas to produce a condensed liquid and discharge exhaust gas. The condensed liquid contains monomers produced from the cracking of the reaction material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">E1:熱裂解反應系統</p>
        <p type="p">1:進料單元</p>
        <p type="p">11:進料桶槽</p>
        <p type="p">12:進料管線</p>
        <p type="p">13a:第一閥體</p>
        <p type="p">13b:第二閥體</p>
        <p type="p">1a:氮氣供應機</p>
        <p type="p">1b:流量控制器</p>
        <p type="p">2:反應單元</p>
        <p type="p">21:加熱爐體</p>
        <p type="p">22:反應管體</p>
        <p type="p">22a:管體前段</p>
        <p type="p">22c:管體末段</p>
        <p type="p">221:輸送螺桿</p>
        <p type="p">23:驅動組件</p>
        <p type="p">231:驅動電機</p>
        <p type="p">232:驅動滾輪</p>
        <p type="p">233:驅動鍊條</p>
        <p type="p">24:固料桶槽</p>
        <p type="p">25:固定夾套</p>
        <p type="p">3:冷凝單元</p>
        <p type="p">31:冷凝管體</p>
        <p type="p">32:冷卻水槽</p>
        <p type="p">33:收料槽體</p>
        <p type="p">3a:水洗瓶</p>
        <p type="p">3b:氣體分析儀</p>
        <p type="p">R1:反應物料</p>
        <p type="p">G1:氮氣氣體</p>
        <p type="p">G2:裂解氣體</p>
        <p type="p">G3:尾氣氣體</p>
        <p type="p">L1:冷凝液體</p>
        <p type="p">CW:循環冷卻水</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="107" publication-number="202616136">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616136</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137481</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>環境監控裝置、環境監控系統、及環境監控方法</chinese-title>
        <english-title>ENVIRONMENTAL MONITORING DEVICE, ENVIRONMENTAL MONITORING SYSTEM AND ENVIRONMENTAL MONITORING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">G06K19/067</main-classification>
        <further-classification edition="200601120241104B">G08C17/02</further-classification>
        <further-classification edition="200601120241104B">G01N33/00</further-classification>
        <further-classification edition="200601120241104B">G08B5/36</further-classification>
        <further-classification edition="200601120241104B">G08B21/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>啟碁科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON NEWEB CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳佳興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIA-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭志翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, CHIH-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫楚淇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, CHU-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>左克文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSO, KO-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亢福明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, FU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳庭輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TING-HUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉　倩詩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IP, SIN SZE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種環境監控裝置、環境監控系統及環境監控方法。環境監控裝置包括無線射頻辨識標籤、射頻讀取模組以及判斷電路，無線射頻辨識標籤經配置以傳送目標設備內的空氣品質資訊。射頻讀取模組讀取空氣品質資訊。判斷電路經配置以判斷空氣品質資訊是否符合空氣品質標準。當空氣品質資訊未符合空氣品質標準時，產生警示資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an environmental monitoring device, an environmental monitoring system and an environmental monitoring method. The environmental monitoring device includes a radio frequency identification tag, a radio frequency reading module and a determination circuit. The radio frequency identification (RFID) tag is configured to transmit air quality information of an interior of a target device. The RF reading module receives the air quality information. The determination circuit is configured to determine whether the air quality information complies with an air quality standard. When the air quality information does not comply with the air quality standard, a warning message is generated.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:環境監控裝置</p>
        <p type="p">200:目標設備</p>
        <p type="p">2001:進氣口</p>
        <p type="p">2002:出氣口</p>
        <p type="p">2003:晶圓槽</p>
        <p type="p">10:無線射頻辨識標籤</p>
        <p type="p">101:氣體濃度感測電路</p>
        <p type="p">102:控制電路</p>
        <p type="p">103:射頻訊號處理電路</p>
        <p type="p">104:發光元件</p>
        <p type="p">105:射頻天線</p>
        <p type="p">20:射頻讀取模組</p>
        <p type="p">201:射頻天線</p>
        <p type="p">202:射頻讀取電路</p>
        <p type="p">30:判斷電路</p>
        <p type="p">300:後台監控中心</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="108" publication-number="202616710">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616710</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137493</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>遠距肢體引導系統及其方法</chinese-title>
        <english-title>REMOTE LIMB GUIDING SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241113B">H04N7/14</main-classification>
        <further-classification edition="200601120241113B">G06F3/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞東學校財團法人亞東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIA EASTERN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴金輪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHIN-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張玉梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林柏岑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PO-TSEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳承恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHENG-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳盈伶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YING-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種遠距肢體引導系統及其方法，所述遠距肢體引導方法應用於所述遠距肢體引導系統，所述遠距肢體引導方法包含感測一指導員的多個身體部位的所在位置，以產生多個標準位置訊號；轉換多個所述標準位置訊號為多個標準姿態數據；根據多個所述標準姿態數據及一學員的一生理特徵資訊建立一三維標準姿態模型；偵測所述學員的所述生理特徵資訊，並且於所述學員的所述生理特徵資訊發生劇烈變化時，發出一注意通知；通過一虛擬實境環境判斷所述學員的學習情況，並發出一修正通知。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a remote limb guiding system and method thereof. The remote limb guiding method is applied to the remote limb guiding system. The remote limb guiding method includes sensing a plurality of body parts of an instructor to generate a plurality of standard position signals; converting the plurality of standard position signals into a plurality of standard posture data; establishing a three-dimensional standard posture model based on a plurality of the standard posture data and a physiological characteristic information of a student; detecting the physiological characteristic information of the student, and when the physiological characteristic information of the student changes drastically, an attention notification is issued; judging the student's learning status through a virtual reality environment and issuing a correction notification.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:遠距肢體引導系統</p>
        <p type="p">1:第一感測模組</p>
        <p type="p">11:第一位置感測裝置</p>
        <p type="p">2:第一虛擬實境裝置</p>
        <p type="p">21:第一通訊單元</p>
        <p type="p">22:第一影像單元</p>
        <p type="p">23:第一計算單元</p>
        <p type="p">24:音訊單元</p>
        <p type="p">25:收音單元</p>
        <p type="p">3:第二感測模組</p>
        <p type="p">31:第二位置感測裝置</p>
        <p type="p">32:體徵感測裝置</p>
        <p type="p">4:第二虛擬實境裝置</p>
        <p type="p">41:第二通訊單元</p>
        <p type="p">42:第二影像單元</p>
        <p type="p">43:第二計算單元</p>
        <p type="p">44:音訊單元</p>
        <p type="p">45:收音單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="109" publication-number="202616898">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616898</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137503</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>太陽能電池包覆結構及包覆方法</chinese-title>
        <english-title>A SOLAR CELL ENCAPSULATION STRUCTURE AND ENCAPSULATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10F19/80</main-classification>
        <further-classification edition="202501120250102B">H10F71/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山青股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAN-CING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫治宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, CHIH-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峰豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, FENG-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種太陽能電池包覆結構及包覆方法，其太陽能電池包覆結構包含：一太陽能電池元件，依序堆疊一下基板、一太陽能發電結構與一上基板，該下基板為一透明基板；一第一玻璃，設置於該太陽能電池元件之該下基板外側，該第一玻璃外側為一入光面；一第二玻璃，設置於該太陽能電池元件之上基板外側；一第一膠體，設置於太陽能電池元件與第一玻璃之間，且固定該太陽能電池元件於第一玻璃表面，該第一膠體包含EVA、POE、PVB或矽膠材料且混參能轉換光線波長材料及/或防紫外線材料；及一第二膠體，封裝接合於該第一玻璃與該第二玻璃之內側，形成一封裝層，該封裝層固定且包封該太陽能電池元件，該太陽能電池元件與該第二玻璃不接觸。藉此，能加強太陽能電池的防水性能以防止電路短路、腐蝕及絕緣失效，更能降低熱傳導，以免因太陽能電池的升溫而降低光電轉換效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A solar cell encapsulation structure and encapsulation method, where the solar cell encapsulation structure includes: a solar cell element, sequentially stacked with a lower substrate, a solar power generation structure, and an upper substrate, where the lower substrate is a transparent substrate; a first glass, positioned on the outer side of the lower substrate of the solar cell element, with the outer side of the first glass serving as a light-receiving surface; a second glass, positioned on the outer side of the upper substrate of the solar cell element; a first adhesive, positioned between the solar cell element and the first glass, fixing the solar cell element to the surface of the first glass. The first adhesive contains EVA, POE, PVB, or silicone material, and may be mixed with light wavelength conversion materials and/or UV protection materials; a second adhesive, encapsulating and bonding the inner sides of the first glass and the second glass to form an encapsulation layer. This encapsulation layer fixes and encloses the solar cell element, without the solar cell element contacting the second glass. Thus, this structure enhances the waterproof performance of the solar cell to prevent circuit shorting, corrosion, and insulation failure, and also reduces heat conduction, preventing reduced photoelectric conversion efficiency due to temperature increase in the solar cell.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(10):太陽能電池元件</p>
        <p type="p">(11):下基板</p>
        <p type="p">(12):太陽能發電結構</p>
        <p type="p">(13):上基板</p>
        <p type="p">(21):第一玻璃</p>
        <p type="p">(211):入光面</p>
        <p type="p">(22):第二玻璃</p>
        <p type="p">(23):第一膠體</p>
        <p type="p">(24):封裝層</p>
        <p type="p">(241):第二膠體</p>
        <p type="p">(242):空腔區域</p>
        <p type="p">(26):內密封壁</p>
        <p type="p">(261):鋁支撐件</p>
        <p type="p">(262):第三膠體</p>
        <p type="p">(S):間隔</p>
        <p type="p">(L):光線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="110" publication-number="202615307">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615307</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137509</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具防漏與熱氣釋放機制之杯蓋</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">B65D43/02</main-classification>
        <further-classification edition="200601120241105B">B65D51/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林律辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林律辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許家華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李易撰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種具防漏與熱氣釋放機制之杯蓋，包括一蓋本體、一熱封層與一過濾層，其中，該蓋本體為紙質材料，其上設有複數個貫穿孔，該熱封層能披覆於該蓋本體之內表面，且不會遮蔽住該等貫穿孔，該過濾層能直接或間接固定至該蓋本體的內表面，並能覆蓋該等貫穿孔的區域，又，該過濾層由高透氣性纖維材料製成，其孔隙小於各該貫穿孔，且僅能允許氣體通過，而無法供液體分子直接穿透，如此，藉由該杯蓋的整體結構，能夠有效將杯身內的熱氣釋放出來，且不會使杯內液體透過該等貫穿孔大量溢出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:杯蓋</p>
        <p type="p">11:蓋本體</p>
        <p type="p">110:貫穿孔</p>
        <p type="p">112:裂縫區</p>
        <p type="p">13:熱封層</p>
        <p type="p">15:過濾層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="111" publication-number="202615309">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615309</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137510</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具釋氣通道之杯蓋</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241118B">B65D51/16</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林律辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林律辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許家華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李易撰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種具釋氣通道之杯蓋，包括一蓋本體、一熱封層與一水氣阻隔層，其中，該蓋本體為紙質材料，其上設有複數個貫穿孔；該熱封層設置於該蓋本體內表面，且不會遮蔽住該等貫穿孔；該水氣阻隔層設置於該蓋本體內表面，其區分為一中心區域及一周邊區域，該中心區域能完全覆蓋該等貫穿孔，且僅浮貼於該蓋本體上，該周邊區域設有至少一條釋氣通道，且該周邊區域除該釋氣通道之外的範圍均直接或間接固定至該蓋本體內表面，使得處於該水氣阻隔層外的氣體，僅能通過該釋氣通道流入該中心區域與該蓋本體之間，並通過該等貫穿孔而釋放至外界，如此，藉由該杯蓋的整體結構，能夠有效將杯身內的熱氣釋放出來，且不會使杯內液體透過該等貫穿孔大量溢出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:杯蓋</p>
        <p type="p">11:蓋本體</p>
        <p type="p">114:拉持片</p>
        <p type="p">13:熱封層</p>
        <p type="p">15:水氣阻隔層</p>
        <p type="p">151:中心區域</p>
        <p type="p">153:周邊區域</p>
        <p type="p">154:釋氣通道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="112" publication-number="202615306">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615306</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137511</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具內緣裂痕區之食品容器及其紙蓋</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241118B">B65D41/18</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林律辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林律辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許家華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李易撰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種具內緣裂痕區之食品容器及其紙蓋，該紙蓋能組裝至一容器本體上，且該紙蓋包括一蓋本體與一熱封層，其中，該蓋本體為紙質材料，且其外表面設有一內緣裂痕區，該蓋本體對應該內緣裂痕區的區域厚度較鄰近區域淺薄；該熱封層設置於該蓋本體內表面靠近邊緣的位置，且位於該內緣裂痕區的外側位置。如此，藉由該內緣裂痕區的設計，使用者可以輕易地將該紙蓋分離為撕裂部分與留存部分，以暴露出該容器本體的開口，且避免在使用者撕裂紙蓋的過程中，該容器本體的頂端殘留熱封層或紙蓋碎片，影響了美觀與衛生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:紙蓋</p>
        <p type="p">112:內緣裂痕區</p>
        <p type="p">114:拉持片</p>
        <p type="p">2:容器本體</p>
        <p type="p">20:開口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="113" publication-number="202616050">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616050</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137513</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通訊系統、主控式通訊裝置，及從屬式通訊裝置</chinese-title>
        <english-title>COMMUNICATION SYSTEM AND MASTER COMMUNICATION DEVICE AND SLAVE COMMUNICATION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">G06F3/01</main-classification>
        <further-classification edition="200601120250203B">G02B27/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊熠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUN-YIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浦大鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PU, TA-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭彥良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YEN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種通訊系統，包括一主控式通訊裝置和一從屬式通訊裝置。主控式通訊裝置包括一第一信號產生器、一第二信號產生器、一信號結合器，以及一發射型人體通訊電極。信號結合器可將第一信號與第二信號作結合，以產生第三信號。發射型人體通訊電極可透過人體來傳送第三信號。從屬式通訊裝置包括：一接收型人體通訊電極、一信號分配器、一處理器，以及一注入鎖定數位控制振盪器。接收型人體通訊電極可從人體處接收一混合信號。信號分配器可將混合信號劃分為一資料信號和一同步信號。注入鎖定數位控制振盪器可根據同步信號來執行一時間同步程序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A communication system includes a master communication device and a slave communication device. The master communication device includes a first signal generator, a second signal generator, a signal combiner, and a transmitting HBC (Human Body Communication) electrode. The signal combiner combines a first signal with a second signal, so as to generate a third signal. The transmitting HBC electrode transmits the third signal through a human body. The slave communication device includes a receiving HBC electrode, a signal splitter, a processor, and an injection-locked DCO (Digital Control Oscillator). The receiving HBC electrode receives a mix signal from the human body. The signal splitter divides the mix signal into a data signal and a synchronization signal. The injection-locked DCO performs a time synchronization process according to the synchronization signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:通訊系統</p>
        <p type="p">200:主控式通訊裝置</p>
        <p type="p">210:第一信號產生器</p>
        <p type="p">220:第二信號產生器</p>
        <p type="p">230:信號結合器</p>
        <p type="p">250:發射型人體通訊電極</p>
        <p type="p">300:從屬式通訊裝置</p>
        <p type="p">310:接收型人體通訊電極</p>
        <p type="p">320:信號分配器</p>
        <p type="p">330:處理器</p>
        <p type="p">350:注入鎖定數位控制振盪器</p>
        <p type="p">HB:人體</p>
        <p type="p">IA:資料資訊</p>
        <p type="p">IB:同步資訊</p>
        <p type="p">PY:時間同步程序</p>
        <p type="p">S1:第一信號</p>
        <p type="p">S2:第二信號</p>
        <p type="p">S3:第三信號</p>
        <p type="p">SD:資料信號</p>
        <p type="p">SS:同步信號</p>
        <p type="p">SX:混合信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="114" publication-number="202615199">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615199</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137514</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>木工機刀具夾持於刀桿螺帽結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241118B">B23Q3/06</main-classification>
        <further-classification edition="200601120241118B">B23Q3/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張聰捷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張聰捷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏廣炯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種木工機刀具夾持於刀桿螺帽結構，其係包含一螺帽本體，該螺帽本體具有一螺頭部及呈中空狀之一螺身部，該螺頭部係徑向對稱設有二螺孔，各該螺孔係分別螺設一固定螺絲，該等固定螺絲係共同抵頂於一滾珠，該螺身部具有對稱設置之二開孔，此外，該螺帽本體軸向開設有一剖槽，該剖槽係自該螺頭部頂面延伸至該螺身部之該等開孔，並與該等開孔連通，藉此，本發明透過旋轉該螺頭部，使該外錐面段與一限位套筒之一內錐面段相抵靠，並使該螺頭部推抵該限位套筒，同時可藉由旋轉該等固定螺絲，使該等固定螺絲朝內抵頂該滾珠以略微撐開該剖槽，進而使該外錐面段逼緊該內錐面段，而可有效地防止刀具脫落，提升作業的安全性。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">40:螺帽本體</p>
        <p type="p">41:螺頭部</p>
        <p type="p">411:螺孔</p>
        <p type="p">415:斜面</p>
        <p type="p">42:螺身部</p>
        <p type="p">422:開孔</p>
        <p type="p">43:剖槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="115" publication-number="202615200">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615200</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137515</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>木工機刀具夾持於刀桿結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241030B">B23Q3/06</main-classification>
        <further-classification edition="200601120241030B">B23Q3/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張聰捷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張聰捷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏廣炯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種木工機刀具夾持於刀桿結構，其係包含一刀軸裝置、一限位環、一限位套筒及一螺固元件，該刀軸裝置包括一刀具及一刀桿，該限位環係套設於該刀桿，並貼抵於該刀具的端面，該限位套筒係套設於該刀桿，且內周緣設置一內錐面段，該螺固元件具有一螺頭部及一螺身部，該螺頭部與該螺身部之連接處設置一外錐面段，該螺身部係容置於該限位套筒內，藉此，透過旋轉該螺固元件之該螺頭部，使該外錐面段與該內錐面段相抵靠，並使該螺頭部推抵該限位套筒，以讓該限位環貼緊該刀具，而可有效地防止該刀具脫落，提升作業的安全性。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">100:木工機刀具夾持於刀桿結構</p>
        <p type="p">10:刀軸裝置</p>
        <p type="p">11:刀具</p>
        <p type="p">13:刀片</p>
        <p type="p">20:限位環</p>
        <p type="p">30:限位套筒</p>
        <p type="p">40:螺固元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="116" publication-number="202615747">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615747</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137518</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>紡織料封邊設備</chinese-title>
        <english-title>TEXTILE MATERIAL EDGE BANDING EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">D03D47/40</main-classification>
        <further-classification edition="200601120241105B">D06C25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塑華科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENERAL TECHNICAL CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳周杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHOU-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高宏銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種紡織料封邊設備，其包含了一第一滑台、一第一殼體、一第二殼體、一第一推力傳感器、一第二推力傳感器、一第一伺服馬達、一第二伺服馬達、一機殼、一第一伺服馬達控制器、一第二伺服馬達控制器、一可程式化邏輯控制器、一電力供應模組及一觸控面板。本發明分別利用第一推力傳感器與第二推力傳感器來感測第一殼體與第二殼體位移時所產生的反力，這讓背膠輪與塗佈輪間，及塗佈輪與引料輪間的力量變為可知，進而藉由第一伺服馬達與第二伺服馬達分別控制第一殼體與第二殼體移動，達到黏著劑壓擠塗佈時處於最佳應力範圍的目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A textile material edge banding equipment is disclosed. It includes a first slide table, a first housing, a second housing, a first thrust sensor, a second thrust sensor, a first servo motor, a second servo motor, a casing, a first servo motor controller, a second servo motor controller, a programmable logic controller, a power supply module and a touch panel. The present invention uses the first thrust sensor and the second thrust sensor respectively to sense the reaction force generated when the first housing and the second housing are displaced, which allows the forces between a backing wheel and a coating wheel, and between the coating wheel and a primer to be known, and then the first servo motor and the second servo motor are used to control the movement of the first housing and the second housing respectively, so as to achieve the purpose of keeping the adhesive in an optimal stress range when extruding and coating.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:工作機台</p>
        <p type="p">10:第一滑台</p>
        <p type="p">11:第一殼體</p>
        <p type="p">110:線性滑軌</p>
        <p type="p">111:軸承</p>
        <p type="p">112:塗佈輪</p>
        <p type="p">1121:塗佈輪輪軸</p>
        <p type="p">1122:塗佈輪圓盤</p>
        <p type="p">1123:彈性塗料環</p>
        <p type="p">113:第二滑台</p>
        <p type="p">12:第二殼體</p>
        <p type="p">120:線性滑軌</p>
        <p type="p">121:軸承</p>
        <p type="p">122:引料輪</p>
        <p type="p">1221:引料輪輪軸</p>
        <p type="p">1222:引料輪圓盤</p>
        <p type="p">15:第一伺服馬達</p>
        <p type="p">16:第二伺服馬達</p>
        <p type="p">17:轉動模組</p>
        <p type="p">2:操控機箱</p>
        <p type="p">20:機殼</p>
        <p type="p">25:觸控面板</p>
        <p type="p">3:線束</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="117" publication-number="202616582">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616582</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137553</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120241217B">H01R13/6461</main-classification>
        <further-classification edition="200601120241217B">H01R13/648</further-classification>
        <further-classification edition="200601120241217B">H01R13/518</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏致電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACES ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳鑄城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王睿平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, RUI-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費爾頓　米奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FELTON, MICKEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李毓庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張朝坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種電連接器結構，包括：複數線纜，包括長度較長之複數前排線纜及長度較短之複數後排線纜，且該前排線纜與該後排線纜係呈交錯排列；一線架組，成型於該些線纜外部並使相鄰的該前排線纜與該後排線纜之間形成有預定間距，於該線架組頂側設有複數凸扣；一接地片，包括套置定位於該些凸扣的複數扣槽，且該接地片係呈平整板狀構造，前述成型於複數線纜外部之線架組可提供該前排線纜與該後排線纜之間的固定間距，用以減少相鄰線纜之間的耦合效應，並透過該接地片吸收該些線纜傳輸高頻信號時所產生電磁波，藉此大幅降低電磁干擾效應。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:線纜</p>
        <p type="p">21:前排線纜</p>
        <p type="p">22:後排線纜</p>
        <p type="p">23:信號線芯</p>
        <p type="p">24:接地線芯</p>
        <p type="p">3:線架組</p>
        <p type="p">31:上排線架</p>
        <p type="p">312:定位槽</p>
        <p type="p">313:凸扣</p>
        <p type="p">32:下排線架</p>
        <p type="p">321:卡榫</p>
        <p type="p">5:接地片</p>
        <p type="p">51:固定部</p>
        <p type="p">510:扣槽</p>
        <p type="p">52:焊接部</p>
        <p type="p">521:接地腳</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="118" publication-number="202616566">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616566</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137554</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器結構及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120241217B">H01R12/70</main-classification>
        <further-classification edition="201101120241217B">H01R13/6461</further-classification>
        <further-classification edition="200601120241217B">H01R43/00</further-classification>
        <further-classification edition="200601120241217B">H01R43/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏致電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACES ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳鑄城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王睿平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, RUI-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費爾頓　米奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FELTON, MICKEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李毓庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張朝坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種電連接器結構及其製造方法，包括：複數線纜，包括長度較長之複數前排線纜及長度較短之複數後排線纜，且該前排線纜與該後排線纜係呈交錯排列；一線架組，成型於該些線纜外部並使相鄰的該前排線纜與該後排線纜之間形成有預定間距；一電路板，於至少一表面上設有供該線架組前側之該些前排線纜之線芯焊接的複數前排焊墊組，及供該些後排線纜之線芯焊接的複數後排焊墊組，於該些前排焊墊組相對於該些後排焊墊組另一側設有複數接點，且該前排焊墊組與該後排焊墊組係呈交錯排列。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:絕緣本體</p>
        <p type="p">11:外座體</p>
        <p type="p">111:固定槽</p>
        <p type="p">112:容置槽</p>
        <p type="p">12:內座體</p>
        <p type="p">121:卡扣</p>
        <p type="p">13:鎖接彈片</p>
        <p type="p">130:繫帶孔</p>
        <p type="p">14:拉帶</p>
        <p type="p">3:線架組</p>
        <p type="p">31:上排線架</p>
        <p type="p">313:凸扣</p>
        <p type="p">32:下排線架</p>
        <p type="p">4:電路板</p>
        <p type="p">41:前排焊墊組</p>
        <p type="p">42:後排焊墊組</p>
        <p type="p">43:接點</p>
        <p type="p">5:接地片</p>
        <p type="p">51:固定部</p>
        <p type="p">52:焊接部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="119" publication-number="202616914">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616914</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137560</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體磊晶結構以及半導體元件</chinese-title>
        <english-title>SEMICONDUCTOR EPITAXIAL STRUCTURE AND SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10H20/822</main-classification>
        <further-classification edition="202501120250102B">H10H20/824</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富采光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENNOSTAR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SHIH-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉家銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIA-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容提供一種半導體磊晶結構，包括第一半導體結構、第二半導體結構以及活性區。第一半導體結構包括第一覆蓋層及第一接觸層。第二半導體結構包括第二覆蓋層及第二接觸層。活性區位於第一半導體結構及第二半導體結構間，且包括一發光疊層。第一覆蓋層及第二覆蓋層鄰接於活性區。第一覆蓋層之厚度大於等於100Å且小於1000Å。第一覆蓋層包含鋁，且第一覆蓋層中之鋁含量百分比大於50%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a semiconductor epitaxial structure, which includes a first semiconductor structure, a second semiconductor structure and an active region. The first semiconductor structure includes a first cladding layer and a first contact layer. The second semiconductor structure includes a second cladding layer and a second contact layer. The active region is located between the first semiconductor structure and the second semiconductor structure and includes a light-emitting stack. The first cladding layer and the second cladding layer are adjacent to the active region. The first cladding layer has a thickness greater than or equal to 100Å and less than 1000Å. The first cladding layer includes aluminum. The first cladding layer has an Al content percentage greater than 50%.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:半導體磊晶結構</p>
        <p type="p">10:第一磊晶疊層</p>
        <p type="p">100:基底</p>
        <p type="p">110:第一半導體結構</p>
        <p type="p">110a:第一覆蓋層</p>
        <p type="p">110b:第一過渡結構</p>
        <p type="p">110c:第一接觸層</p>
        <p type="p">120:第二半導體結構</p>
        <p type="p">120a:第二覆蓋層</p>
        <p type="p">120b:第二過渡結構</p>
        <p type="p">120c:第二接觸層</p>
        <p type="p">130:第一活性區</p>
        <p type="p">130a:第一發光疊層</p>
        <p type="p">130b:第一侷限結構</p>
        <p type="p">130b1:第一子層</p>
        <p type="p">130b2:第二子層</p>
        <p type="p">130c:第二侷限結構</p>
        <p type="p">130c1:第三子層</p>
        <p type="p">130c2:第四子層</p>
        <p type="p">t0:厚度</p>
        <p type="p">t1:第一厚度</p>
        <p type="p">t2:第二厚度</p>
        <p type="p">t3:第三厚度</p>
        <p type="p">t4:第四厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="120" publication-number="202616684">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616684</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137568</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光纖終端裝置及其光纖傳輸線</chinese-title>
        <english-title>OPTICAL FIBER TERMINAL DEVICE AND OPTICAL FIBER TRANSMISSION LINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120241029B">H04B10/40</main-classification>
        <further-classification edition="200601120241029B">G02B6/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>智易科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARCADYAN TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張嘉升</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉與凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIOU, YU-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">光纖傳輸線包括光纖、不可見光發射器、不可見光接收器、可見光發射器及光纖連接器。光纖具有第一端及第二端。不可見光發射器鄰近第一端配置且用以發出第一不可見光。不可見光接收器鄰近第一端配置且用以接收第二不可見光。可見光發射器鄰近第一端配置且用以發出可見光。光纖連接器連接第二端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical fiber transmission line includes an optical fiber, an invisible light transmitter, an invisible light receiver, a visible light transmitter, and a fiber optic connector. The optical fiber has a first end and a second end. The invisible light transmitter is disposed adjacent to the first end and configured to emit a first invisible light. The invisible light receiver is disposed adjacent to the first end and configured to receive a second invisible light. The visible light transmitter is disposed adjacent to the first end and configured to emit a visible light. The fiber optic connector is connected to the second end.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:弱電箱</p>
        <p type="p">20:傳輸線模組</p>
        <p type="p">21,110:光纖傳輸線</p>
        <p type="p">22,114:光纖連接器</p>
        <p type="p">100:光纖終端裝置</p>
        <p type="p">111:不可見光發射器</p>
        <p type="p">112:不可見光接收器</p>
        <p type="p">113:可見光發射器</p>
        <p type="p">120:驅動電流電路</p>
        <p type="p">130:處理器</p>
        <p type="p">140:光源驅動器</p>
        <p type="p">150:觸發件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="121" publication-number="202615289">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615289</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137570</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>縱向兩輪個人載具及其可收摺式的前叉模組</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241029B">B62K21/22</main-classification>
        <further-classification edition="200601120241029B">B62K15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台鋼學校財團法人台鋼科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN STEEL UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寶兆工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BESTZONE INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳邦家</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PANG-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種縱向兩輪個人載具及其可收摺式的前叉模組，該縱向兩輪個人載具的前叉模組包括往上穿插在車架機構的豎管單元、往上插裝在該豎管單元的前叉單元、左右延伸穿設在該豎管單元並與該前叉單元連結的連結栓，及安裝在該豎管單元的快拆單元。當該快拆單元位於釋放狀態時，該前叉單元可經由該連結栓相對該豎管單元下移並往正後方樞擺，且帶動該前輪往後上方擺靠向該車架機構。透過該前叉模組的收摺結構設計，使得本發明縱向兩輪個人載具進行收摺時，不會增加收摺後的左右寬度，確實可改善現有兩輪載具之前輪收摺時會增加車體左右寬度的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:車架機構</p>
        <p type="p">31:車身本體</p>
        <p type="p">32:頭管</p>
        <p type="p">6:前輪機構</p>
        <p type="p">61:前叉模組</p>
        <p type="p">62:豎管單元</p>
        <p type="p">621:豎管</p>
        <p type="p">622:前叉上座</p>
        <p type="p">623:插裝空間</p>
        <p type="p">624:擺置缺口</p>
        <p type="p">63:連結栓</p>
        <p type="p">64:前叉單元</p>
        <p type="p">641:上凸件</p>
        <p type="p">642:限位導孔</p>
        <p type="p">643:限位槽</p>
        <p type="p">644:前叉本體</p>
        <p type="p">65:快拆單元</p>
        <p type="p">651:快拆套組</p>
        <p type="p">652:套環組件</p>
        <p type="p">653:快拆把手</p>
        <p type="p">654:旋鈕插銷</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="122" publication-number="202616843">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616843</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137571</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構以及其製作方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10D30/01</main-classification>
        <further-classification edition="200601120250102B">H01L21/302</further-classification>
        <further-classification edition="200601120250102B">H01L21/22</further-classification>
        <further-classification edition="200601120250102B">H01L21/76</further-classification>
        <further-classification edition="202501120250102B">H10D62/10</further-classification>
        <further-classification edition="202501120250102B">H10D30/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳晃毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUANG-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李振鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHENG-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周正華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHENG-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體結構的製作方法，包含提供一基底，該基底上形成有一淺溝隔離結構以及一第一主動區，其中該淺溝隔離結構的一頂面高於該第一主動區中的該基底的一頂面，進行一蝕刻步驟，以移除部分該淺溝隔離結構，使該淺溝隔離結構的該頂面低於該第一主動區的該基底的該頂面，以及在該蝕刻步驟之後，對該第一主動區進行一摻雜步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a method for manufacturing a semiconductor structure, which comprises the following steps: providing a substrate with a shallow trench isolation structure and a first active area, wherein a top surface of the shallow trench isolation structure is higher than a top surface of the substrate in the first active area, performing an etching step to remove part of the shallow trench isolation structure so that the top surface of the shallow trench isolation structure is lower than that of the substrate in the first active area, and after the etching step, a doping step is performed on the first active area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:襯墊層</p>
        <p type="p">12:絕緣層</p>
        <p type="p">21:閘極介電層</p>
        <p type="p">22:閘極導電層</p>
        <p type="p">23:閘極介電層</p>
        <p type="p">24:閘極導電層</p>
        <p type="p">AA1:第一主動區</p>
        <p type="p">AA2:第二主動區</p>
        <p type="p">D1:深度</p>
        <p type="p">G1:閘極結構</p>
        <p type="p">G2:閘極結構</p>
        <p type="p">H1:高度</p>
        <p type="p">NW:N型摻雜區</p>
        <p type="p">PW:P型摻雜區</p>
        <p type="p">RC1:圓角結構</p>
        <p type="p">RC2:圓角結構</p>
        <p type="p">S:基底</p>
        <p type="p">STI:淺溝隔離結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="123" publication-number="202615777">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615777</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137572</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>扣接結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">F16B5/06</main-classification>
        <further-classification edition="200601120241230B">F16B2/22</further-classification>
        <further-classification edition="200601120241230B">H01L23/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍隆國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FIVEGRAND INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鼎瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TING-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種扣接結構及其扣接方法，其包含中介體及作動體。作動體活動或固定設於中介體，作動體包括身部及操動部，操動部與身部活動組接，操動部設有扣部。藉此，可使作動體設於物體，且由操動部使扣部與另一物體扣接或解扣，以完成至少兩物體之快速結合與分離，而達到反復快速結合與分離之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:扣接結構</p>
        <p type="p">11:中介體</p>
        <p type="p">111:孔部</p>
        <p type="p">12:作動體</p>
        <p type="p">121:身部</p>
        <p type="p">122:操動部</p>
        <p type="p">123:扣部</p>
        <p type="p">13:彈性元件</p>
        <p type="p">10:物體</p>
        <p type="p">20:另一物體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="124" publication-number="202616183">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616183</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137573</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>以結婚用品作為增加特定商品銷量之方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250502B">G06Q30/0207</main-classification>
        <further-classification edition="202301120250502B">G06Q30/0208</further-classification>
        <further-classification edition="202301120250502B">G06Q30/0241</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭進興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, CHING-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭逸涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, YI-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭逸軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, YI-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭進興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, CHING-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭逸涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, YI-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭逸軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, YI-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種「以結婚用品作為增加特定商品銷量之方法」，其可對現有市售之各種實體商品及服務商品，來建構出一可增加其銷售量之創新銷售方法的平台，係由一特定網站來輸出優惠會員碼，並將其設置在與特定網站相互約定的每一對結緍者所屬之結婚用品的外部表面上，再由結婚者以其智慧型手機內鍵的拍照鏡頭，對其所屬任何一個結婚用品外部表面上的優惠會員碼拍攝後，即可獲得一優惠編碼，並將該優惠編碼帶往與特定網站有相互約定販售特定商品所屬的特定商品販售處，再交由該特定商品販售處之人員以其上網裝置中的掃描裝置來掃描後，該每一對結緍者即可達成以優惠折扣來購買該特定商品之目的。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:特定網站</p>
        <p type="p">11:網站伺服器</p>
        <p type="p">12:會員應用程式</p>
        <p type="p">13:優惠會員資料庫</p>
        <p type="p">14:優惠會員比對程式</p>
        <p type="p">20:結緍者</p>
        <p type="p">21:結婚用品</p>
        <p type="p">33、202:螢幕</p>
        <p type="p">30:特定商品販售處</p>
        <p type="p">31:上網裝置</p>
        <p type="p">32:掃描裝置</p>
        <p type="p">34:准予優惠訊息</p>
        <p type="p">35:拒絕優惠訊息</p>
        <p type="p">100:優惠會員碼</p>
        <p type="p">101:貼紙</p>
        <p type="p">200:智慧型手機</p>
        <p type="p">201:拍照鏡頭</p>
        <p type="p">B:優惠編碼</p>
        <p type="p">I:網際網路</p>
        <p type="p">K:優惠會員</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="125" publication-number="202616184">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616184</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137574</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>以結婚用品作為增加家電產品銷量之方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250228B">G06Q30/0207</main-classification>
        <further-classification edition="202301120250228B">G06Q30/0208</further-classification>
        <further-classification edition="202301120250228B">G06Q30/02</further-classification>
        <further-classification edition="202301120250228B">G06Q30/0241</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭進興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, CHING-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭逸涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, YI-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭逸軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, YI-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭進興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, CHING-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭逸涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, YI-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭逸軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, YI-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種「以結婚用品作為增加家電產品銷量之方法」，其可對現有市售之各種實體商品及服務商品，來建構出一可增加其銷售量之創新銷售方法的平台，係由一特定網站來輸出優惠會員碼，並將其設置在與特定網站相互約定的每一對結緍者所屬之結婚用品的外部表面上，再由結婚者以其智慧型手機內鍵的拍照鏡頭，對其所屬任何一個結婚用品外部表面上的優惠會員碼拍攝後，即可獲得一優惠編碼，並將該優惠編碼帶往與特定網站有相互約定販售特定商品所屬的特定商品販售處，再交由該特定商品販售處之人員以其上網裝置中的掃描裝置來掃描後，該每一對結緍者即可達成以優惠折扣來購買該特定商品之目的。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:家電產品</p>
        <p type="p">11:網站伺服器</p>
        <p type="p">12:會員應用程式</p>
        <p type="p">13:優惠會員資料庫</p>
        <p type="p">14:優惠會員比對程式</p>
        <p type="p">20:結緍者</p>
        <p type="p">21:結婚用品</p>
        <p type="p">33、202:螢幕</p>
        <p type="p">30:特定商品販售處</p>
        <p type="p">31:上網裝置</p>
        <p type="p">32:掃描裝置</p>
        <p type="p">34:准予優惠訊息</p>
        <p type="p">35:拒絕優惠訊息</p>
        <p type="p">100:優惠會員碼</p>
        <p type="p">101:貼紙</p>
        <p type="p">200:智慧型手機</p>
        <p type="p">201:拍照鏡頭</p>
        <p type="p">B:優惠編碼</p>
        <p type="p">I:網際網路</p>
        <p type="p">K:優惠會員</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="126" publication-number="202616105">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616105</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137581</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資訊推薦系統及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250203B">G06F16/90</main-classification>
        <further-classification edition="202301120250203B">G06Q30/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國信託商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CTBC BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹正城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許沛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許元銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周錫彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種資訊推薦系統包含一處理單元及一與該處理單元電連接且儲存有一資訊資料庫的儲存單元，該資訊資料庫包含多筆候選資訊及多筆對應的資訊特徵資料。該處理單元用於：對一需求描述資料執行一向量轉換處理以產生一以向量形式呈現的需求特徵資料；根據每一資訊特徵資料包含的多個資訊特徵向量，計算每一資訊特徵資料與該需求特徵資料之間的關聯度，並從該等資訊特徵資料中選出一最匹配資訊特徵資料；將該最匹配資訊特徵資料所對應的該候選資訊傳送至一對應於該需求描述資料的使用端電子裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:資訊推薦系統</p>
        <p type="p">11:處理單元</p>
        <p type="p">12:儲存單元</p>
        <p type="p">M:語言處理模型</p>
        <p type="p">D1:資訊資料庫</p>
        <p type="p">D11:候選資訊</p>
        <p type="p">D11A:第一候選資訊</p>
        <p type="p">D11B:第二候選資訊</p>
        <p type="p">D12:資訊特徵資料</p>
        <p type="p">D12A:第一資訊特徵資料</p>
        <p type="p">D12B:第二資訊特徵資料</p>
        <p type="p">D2:客戶資料庫</p>
        <p type="p">D21:客戶屬性資料</p>
        <p type="p">D211:關注特徵部分</p>
        <p type="p">D212:資產特徵部分</p>
        <p type="p">D3:門檻值資料</p>
        <p type="p">D31:門檻值參數</p>
        <p type="p">D32:主題類型資料</p>
        <p type="p">5:使用端電子裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="127" publication-number="202616559">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616559</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137588</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>設置於散熱口內的天線</chinese-title>
        <english-title>ANTENNA INSTALLED IN THE HEAT DISSIPATION VENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">H01Q1/22</main-classification>
        <further-classification edition="200601120241204B">G06F1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泓博無線通訊技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONGBO WIRELESS COMMUNICATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李佳典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHIA TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏紅方</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, HONG-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種設置於散熱口內的天線，包括散熱框體、主天線體以及輔助天線體。散熱框體具有複數個第一開口與複數個第二開口。主天線體具有主天線圖案與複數個第一對位口，所述的複數個第一對位口對位於所述的複數個第一開口，且貼合散熱框體。輔助天線體具有輔助天線圖案與複數個第二對位口，所述的複數個第二對位口對位於所述的複數個第二開口且貼合散熱框體。據此，可提升散熱器及天線元件整合的程度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An antenna installed in the heat dissipation vent comprises a heat dissipation frame, a main antenna body and an auxiliary antenna body. The heat dissipation frame has a plurality of first openings and a plurality of second openings. The main antenna body has a main antenna pattern and a plurality of first alignment openings, wherein the plurality of first alignment openings are aligned with the plurality of first openings and fitted to the heat dissipation frame. The auxiliary antenna body has an auxiliary antenna pattern and a plurality of second alignment openings, wherein the plurality of second alignment openings are aligned with the plurality of second openings and fitted to the heat dissipation frame. Thus, the degree of integration of heat sink and antenna components can be improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:散熱框體</p>
        <p type="p">2:主天線體</p>
        <p type="p">3:輔助天線體</p>
        <p type="p">4:第一同軸電纜</p>
        <p type="p">5:第二同軸電纜</p>
        <p type="p">6:隔離體</p>
        <p type="p">61:接地金屬圖案</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="128" publication-number="202616228">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616228</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137593</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具自適應關注區域之最佳化影像儲存系統</chinese-title>
        <english-title>OPTIMIZED IMAGE STORAGE SYSTEM WITH SELF-ADAPTIVE ATTENTION AREAS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250203B">G06V20/52</main-classification>
        <further-classification edition="201701120250203B">G06T7/20</further-classification>
        <further-classification edition="202301120250203B">H04N23/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>逢甲大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG CHIA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華岡保全股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWAKANG SECURITY LTD., CO.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佩蓉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PEI-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何丞堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHENG-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宥廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊庭豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TING-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡孟軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MENG-SHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仕偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種利用數位影像處理、深度學習之物件辨識及影像分析、儲存與通報系統，可部署於監控場域的監視錄影模組、資訊處理模組、電腦程式、電腦可讀取之影像數據資料庫、物件辨識模型及其訓練用之資料集；透過獲取設置於監控區域內的多個錄影機的原始影像，儲存於資料庫，資訊處理模組中的系統程式及深度學習之物件辨識模型，該系統程式可以為錄影機影設定電子圍籬關注區域，並透過影像處理模組進行處理以獲得初步判斷結果，再輸入該物件偵測模型進行運算而得到辨識結果，再依據結果判斷最終儲存格式及方法，並在需要時進行潛在風險行為之通報。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an optimized image storage system with self-adaptive attention areas utilizing digital image processing, object recognition through machine deep learning, and image analysis, storage, and notification techniques. The present invention provides the system capable of deployed in surveillance environments, including surveillance video modules, information processing modules, computer programs, computer-readable image data databases, object recognition models, and datasets used for training. By acquiring raw images from multiple cameras set up in the monitoring area, the images are stored in a database. The system program and machine deep learning-based object recognition model can set up electronic fence monitoring zones for the cameras. The image processing module processes the images to obtain preliminary recognition, which are input into the object detection model to obtain recognition results. Based on these results, the system determines the final storage format and method, and issues warning notifications regarding potential risk behaviors when necessary.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:具自適應關注區域之最佳化影像儲存的系統</p>
        <p type="p">10:監視錄影模組</p>
        <p type="p">20:資訊處理模組</p>
        <p type="p">30:資料庫</p>
        <p type="p">40:通報單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="129" publication-number="202615217">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615217</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137603</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>夾具裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241030B">B25B9/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沛科精密股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PASCO PRECISION CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志菁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種夾具裝置，包含座體機構、操作單元，及夾持機構。該夾持機構包括往上穿過該座體機構且連結該操作單元的移動座，及夾持模組。該夾持模組具有數個樞設在該座體機構與該移動座間的夾持單元。每一該夾持單元之延伸末端具有夾持部。當該夾持機構可被該操作單元帶動而自一釋放位置變化至一夾持位置時，該移動座會被帶動上移，進而帶動該等夾持部往上並相向內縮，而可用以夾持住一盤狀物。透過上述設計，人員就能透過操作本發明夾具裝置來夾持該盤狀物，而能夠降低接觸到化學品的安全風險。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:座體機構</p>
        <p type="p">31:基座單元</p>
        <p type="p">32:固定座</p>
        <p type="p">321:座體部</p>
        <p type="p">322:裝設部</p>
        <p type="p">33:握持單元</p>
        <p type="p">34:座體</p>
        <p type="p">340:容設空間</p>
        <p type="p">341:中央部</p>
        <p type="p">342:臂部</p>
        <p type="p">344:端部</p>
        <p type="p">35:靠抵座</p>
        <p type="p">350:穿伸空間</p>
        <p type="p">4:夾持機構</p>
        <p type="p">5:移動座</p>
        <p type="p">50:彈性件</p>
        <p type="p">51:安裝部</p>
        <p type="p">511:安裝部位</p>
        <p type="p">52:軸接部</p>
        <p type="p">520:調移空間</p>
        <p type="p">521:頂部區域</p>
        <p type="p">522:底部區域</p>
        <p type="p">6:夾持模組</p>
        <p type="p">7:夾持單元</p>
        <p type="p">71:夾持件</p>
        <p type="p">711:樞設部</p>
        <p type="p">712:延伸部</p>
        <p type="p">713:夾持部</p>
        <p type="p">714:第一樞設段</p>
        <p type="p">715:第二樞設段</p>
        <p type="p">72:連動件</p>
        <p type="p">721:第一端</p>
        <p type="p">722:第二端</p>
        <p type="p">8:操作單元</p>
        <p type="p">81:操作件</p>
        <p type="p">82:限位件</p>
        <p type="p">9:盤狀物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="130" publication-number="202616727">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616727</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137613</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像捕捉裝置及方法</chinese-title>
        <english-title>IMAGE CAPTURING DEVICE AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250203B">H04N23/60</main-classification>
        <further-classification edition="202201120250203B">G06V40/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茂傑國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAGIC CONTROL TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉培中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, PEI-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種影像補捉方法，包括：取得視訊影像；分析視訊影像中是否存在手掌並辨識手掌手勢；當手掌手勢為追蹤手勢時，進入追蹤辨別模式，以使用者與物件之互動方式，確定物件為追蹤物件並計算追蹤物件的相關資訊；使用追蹤操作追蹤該追蹤物件，以產生追蹤影像；以及依據第一視訊顯示模式，使用追蹤影像以及視訊影像，產生直播影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is related to an image capturing method, including: obtaining a video image; analyzing whether there is a palm in the video image and identifying a palm gesture; when the palm gesture is a tracking gesture, entering a tracking identification mode to determine a tracking object and calculate relevant information of the tracking object based on a interaction method between a user and the tracking object; use tracking operation to track the tracking object to generate a tracking image; and use the tracking image and video image to generate a live image based on a first video display mode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:影像捕捉方法</p>
        <p type="p">S201-S205:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="131" publication-number="202615216">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615216</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137621</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>C型扣環鉗</chinese-title>
        <english-title>PAIR OF PLIERS WITH A LATCH UNIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">B25B7/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桔林工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JYE LINS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾敏政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林松柏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一個C型扣環鉗，包括：一個第一滑動件、一個第二滑動件、一個棘輪機構與一個開關。該第一、該第二滑動件彼此樞接，往復運動一個張開位置和一個合攏位置。該棘輪機構裝入該第一、該第二滑動件之間。該棘輪機構包括：一個固定件、一個活動件與一個彈性件。該固定件有一個齒。該活動件有連續的多個齒。該彈性件帶動該活動件往該固定件方向位移。該開關裝在該第一滑動件或該第二滑動件。該開關切換「省力模式」，該活動件的齒嚙接該固定件的齒，限制該第一、該第二滑動件逐漸合攏，不能往外張開。該開關切換「一般模式」，長期解除該活動件與該固定件的嚙接關係，讓該第一滑動件與該第二滑動件自由往返於張開位置和合攏位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pair of pliers includes two handles and a latch unit. The handles are pivotally connected to each other. The latch unit includes a pawl, a rack, a spring and a switch. The pawl is secured to the first handle. The rack is pivotally connected to the second handle. The spring biases the rack into engagement with the pawl. The switch is movable between two positions. In the first position, the switch allows engagement of the rack with the pawl. In the second position, the switch keeps the rack from the pawl.</p>
      </isu-abst>
      <representative-img>
        <p type="p">14:棘輪機構</p>
        <p type="p">15:開關</p>
        <p type="p">24:第一滑動件</p>
        <p type="p">26:第二滑動件</p>
        <p type="p">30:固定件</p>
        <p type="p">31:活動件</p>
        <p type="p">32:扭簧</p>
        <p type="p">33、34:齒</p>
        <p type="p">35:壁</p>
        <p type="p">36:柱</p>
        <p type="p">37:銷</p>
        <p type="p">40:基座</p>
        <p type="p">41:長孔</p>
        <p type="p">42:阻擋部</p>
        <p type="p">43:受力部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="132" publication-number="202615768">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615768</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137624</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有強風防護的風力發電系統及其應用方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120241105B">F03D80/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>創奕能源科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稻田太一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃振聲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴國榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有強風防護的風力發電系統及其應用方法，主要包括：一基座、一旋轉架、一風向翼、一強風調整器、至少三葉片、及一傳動模組，其特徵在於：藉由強風調整器的有效設計，搭配獨特葉片形狀和角度的優化排列，讓葉片可在正常風力時，處在最佳受風位置以提高氣動效率，於不同風速下保持最佳的發電性能，從而產生最大化能量捕獲；而當遭受強風時，該強風調整器又可及時發揮作用提供保護，讓該葉片自動旋轉移換到避風位置，避免遭受強風襲擊造成損壞。優點在於可確保長期運行的穩定性提高發電效率，還能延長設備的使用壽命降低維護成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:具有強風防護的風力發電系統</p>
        <p type="p">1:基座</p>
        <p type="p">10:支撐桿</p>
        <p type="p">11:固定纜繩</p>
        <p type="p">15:動力發電裝置</p>
        <p type="p">2:旋轉架</p>
        <p type="p">20:中心軸</p>
        <p type="p">21:第一架板</p>
        <p type="p">22:第二架板</p>
        <p type="p">23:第三架板</p>
        <p type="p">3:風向翼</p>
        <p type="p">30:套管</p>
        <p type="p">31:風向片</p>
        <p type="p">32:尾端</p>
        <p type="p">35:強風調整器</p>
        <p type="p">36:旋動導板</p>
        <p type="p">37:彈簧</p>
        <p type="p">4:葉片</p>
        <p type="p">40:葉片軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="133" publication-number="202615942">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615942</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137625</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具承載膜的顯示模組及背光模組</chinese-title>
        <english-title>DISPLAY MODULE AND BACKLIGHT MODULE HAVING CARRIER FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241217B">G02F1/1333</main-classification>
        <further-classification edition="200601120241217B">G02F1/13357</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳慧娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUI-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李尹婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YIN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇柏元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, BO-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種顯示模組及背光模組。顯示模組及背光模組包含背板、承載膜以及燈板。承載膜設置於背板上，並藉由第一連接單元連接於背板周緣之至少部分；其中承載膜的彈性係數小於背板的彈性係數。燈板設置於承載膜上，並藉由第二連接單元連接於承載膜朝向燈板之承載面。藉由承載膜的設置，當顯示模組或背光模組需要重工或是回收再利用時，可易於快速拆解及分離燈板及背板，且不易損傷兩者。因此可提高組件回收再利用的比例，而有利於循環經濟的實現。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display module and a backlight module are provided. The display module and the backlight module comprise a backplate, a carrier film, and a light board. The carrier film is disposed on the backplate and is connected to at least a portion of the periphery of the backplate by first connection units; wherein the elasticity coefficient of the carrier film is smaller than the elasticity coefficient of the backplate. The light board is provided on the carrier film and is connected to a carrier surface of the carrier film facing towards the light board by second connecting units. By setting up the carrier film, when the display module or backlight module needs to be reused or recycled, it is easy to disassemble and separate the light board and the backplate quickly, and it is not easy to damage both of them. Therefore, it can increase the proportion of recycling and reuse of components, which is beneficial to the realization of circular economy.        &lt;br/&gt;&lt;br/&gt;Translated with DeepL.com (free version)      </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:背光模組</p>
        <p type="p">100:背板</p>
        <p type="p">110:板體</p>
        <p type="p">130:側壁</p>
        <p type="p">300:承載膜</p>
        <p type="p">301:承載面</p>
        <p type="p">310:膜本體</p>
        <p type="p">330:彎折部</p>
        <p type="p">500:燈板</p>
        <p type="p">510:基材</p>
        <p type="p">530:光源</p>
        <p type="p">710:第一連接單元</p>
        <p type="p">720:第二連接單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="134" publication-number="202615123">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615123</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137632</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於腳踏車運動時序同步的設備</chinese-title>
        <english-title>DEVICE FOR BICYCLE IN TIMING SYNCHRONIZED EXERCISE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241029B">A63B22/08</main-classification>
        <further-classification edition="200601120241029B">A63B69/16</further-classification>
        <further-classification edition="200601120241029B">G01P3/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾蒙特科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMOTEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林儀佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI-JIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張清瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許維君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳素芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SUFEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林季樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JI-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李廷恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, TING-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡秀玫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係為一種用於腳踏車運動時序同步的設備，其包含一測量裝置，用以測量一使用者於一運動設備之一使用狀態，該運動設備設置二受力元件，透過一基板上設置複數個第一感測元件並設置於該運動設備上，以偵測至少一受力元件樞接之一曲柄上所設置之一訊號發射元件，以及透過一第二感測元件偵測該使用者之一運動情況，同時藉由該些第一感測元件所提供之第一感測訊號用以同步該第二感測元件之偵測結果，以判斷該使用者於該運動設備之使用狀態，並讓該使用者依據該些第一感測元件與該第二感測元件之偵測結果調整騎運動設備之姿勢。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a device for a bicycle in timing synchronized exercise, which comprising a measuring device to measure a user’s usage on an exercise device The bicycle at least includes two force-bearing elements. A plurality of magnetic sensing elements are disposed on a substrate disposed on the exercise device and detect a magnetic element set on a crank pivoted with at least one of the force-bearing elements, and detects a motion state of the user on the exercise device through a motion sensing element, thereby providing the first sensing signal of the magnetic sensing elements applied for synchroning detection results of the motion sensing element, to determine the user’s usage on the exercise device, and allow the user adjust the posture of riding the exercise device based on the detection results of the magnetic sensing elements and the motion sensing elements.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:運動設備</p>
        <p type="p">12:主車架</p>
        <p type="p">122A:前管</p>
        <p type="p">122B:鉤爪</p>
        <p type="p">1222:傳動部</p>
        <p type="p">124:轉向車把</p>
        <p type="p">1242:手把</p>
        <p type="p">126:第一車輪</p>
        <p type="p">1262:第一花鼓</p>
        <p type="p">128:第二車輪</p>
        <p type="p">1282:第二花鼓</p>
        <p type="p">1284:飛輪</p>
        <p type="p">130:傳動元件</p>
        <p type="p">1302:基板</p>
        <p type="p">1304:傳動帶</p>
        <p type="p">132:坐墊組件</p>
        <p type="p">14A:受力元件</p>
        <p type="p">14B:受力元件</p>
        <p type="p">142:第一曲柄</p>
        <p type="p">1422:訊號發射元件</p>
        <p type="p">144:第二曲柄</p>
        <p type="p">146:中軸</p>
        <p type="p">22:主機</p>
        <p type="p">24:第一感測元件</p>
        <p type="p">26:第二感測元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="135" publication-number="202615794">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615794</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137633</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>曲型框架模組及包含其之曲型顯示模組</chinese-title>
        <english-title>CURVED FRAME MODULE AND CURVED DISPLAY MODULE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241125B">F16M11/00</main-classification>
        <further-classification edition="200601120241125B">G09F11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俐媛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, LI-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林建欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIEN-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種曲型框架模組及包含其之曲型顯示模組。曲型框架模組之各模組單元包含：界定預設曲面之基座架構；橫向地定位於基座架構從第一骨架及第二骨架突出的擱架之複數條第一支架；豎立地延伸且具有立板之複數條第二支架；以及具有固定於第一支架及立板之第一及第二翼片之連接件。第一支架排列有第一定位部，且第一定位部包含定位孔及導槽。立板排列有第二定位部，且第二定位部包含導片、從導片開口之開槽、及伸入開槽之定位凸塊。導槽之軸線方向穿過定位孔及預設曲面之曲率中心，且定位凸塊嵌入定位孔，而導片插入導槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a curved frame module and a curved display module including the same. Each module unit of the curved frame module includes: a base frame structure defining a preset curved surface; a plurality of first brackets positioning laterally on the shelves of the base frame structure protruding from a first frame and a second frame; a plurality of second brackets extending uprightly and having a stand-up plate; and a connector having first and second flanges fixed to the first bracket and the stand-up plate. The first bracket is arranged with first positioning parts, and the first positioning part includes a positioning hole and a guiding groove. The stand-up plate is arranged with second positioning parts, and the second positioning part includes a guiding plate, a slot opening from the guiding plate, and a positioning protrusion extending into the slot. The axis direction of the guiding groove passes through the positioning hole and the center of curvature of the preset curved surface, and the positioning protrusion is fitted into the positioning hole and the guiding plate is inserted into the guiding groove.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:曲型框架模組</p>
        <p type="p">100:第一支架</p>
        <p type="p">200:第二支架</p>
        <p type="p">300:連接件</p>
        <p type="p">1000、2000:模組單元</p>
        <p type="p">B:基座架構</p>
        <p type="p">B1:第一骨架</p>
        <p type="p">B2:第二骨架</p>
        <p type="p">B3:腳架</p>
        <p type="p">C1、C2:曲形設置面</p>
        <p type="p">CM:預設曲面</p>
        <p type="p">FL:基準設置面</p>
        <p type="p">T1、T2:擱架</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="136" publication-number="202616572">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616572</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137644</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>充電器</chinese-title>
        <english-title>CHARGER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241202B">H01R13/20</main-classification>
        <further-classification edition="200601120241202B">H01R13/66</further-classification>
        <further-classification edition="200601120241202B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群光電能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHICONY POWER TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施閔耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, MIN-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種充電器，包括本體及插頭。本體包括插頭承接部及插接部。插頭承接部設置有金屬接觸片。插頭可拆卸地組裝於本體，插頭包括第一表面、第二表面、第三表面、火線端子、中性線端子、接地端子及耦合部。第一表面與第二表面為相對之表面，第三表面為分別與第一表面及第二表面鄰接之表面。接地端子的接觸端凸設於第二表面，耦合部位於第三表面。耦合部對應組裝至插接部，接地端子的接觸端對應金屬接觸片設置，並受作用力持續朝金屬接觸片頂抵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A charger includes a body and a plug. The body includes a receiving portion and an inserting portion. The receiving portion is provided with a metal contact piece. The plug is detachably assembled on the body. The plug includes a first surface, a second surface, a third surface, a live wire terminal, a neutral wire terminal, a ground terminal and a coupling portion. The first surface and the second surface are opposite surfaces, and the third surface is a surface adjacent to the first surface and the second surface respectively. The contact end of the ground terminal is protruding from the second surface, and the coupling portion is located on the third surface. The coupling portion is assembled to the inserting portion, and the contact end of the grounding terminal is arranged corresponding to the metal contact piece, and is continuously pressed against the metal contact piece by the force.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:充電器</p>
        <p type="p">110:本體</p>
        <p type="p">1111:金屬接觸片</p>
        <p type="p">112:插接部</p>
        <p type="p">113:電路板</p>
        <p type="p">114:金屬防護板</p>
        <p type="p">1141:第一接腳</p>
        <p type="p">1142:第二接腳</p>
        <p type="p">130:插頭</p>
        <p type="p">131:第一表面</p>
        <p type="p">132:第二表面</p>
        <p type="p">1321:孔槽</p>
        <p type="p">133:第三表面</p>
        <p type="p">135:中性線端子</p>
        <p type="p">136:接地端子</p>
        <p type="p">1361A:接觸端</p>
        <p type="p">1361B:連接端</p>
        <p type="p">137:耦合部</p>
        <p type="p">X,Y,Z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="137" publication-number="202616800">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616800</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137645</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電源供應器</chinese-title>
        <english-title>POWER SUPPLY UNIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">H05K7/14</main-classification>
        <further-classification edition="200601120250102B">H05K7/18</further-classification>
        <further-classification edition="200601120250102B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群光電能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHICONY POWER TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳政展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHENG-CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電源供應器，包括機架、電路板、開關組件及栓鎖組件。機架具有開孔、第一開槽及第二開槽。電路板設置於機架內。開關組件包括按鈕部、本體及耦接部。本體嵌設於開孔，按鈕部設於本體並位於機架外側，耦接部設於本體且可選擇性地與電路板導通或斷路。栓鎖組件包括操作件及栓鎖件。操作件具有按壓部及延伸部。按壓部連接延伸部，且凸設第一開槽，延伸部連接栓鎖件。栓鎖件連接機架並具有卡扣部，卡扣部自第二開槽凸出於機架。於按鈕部遠離機架，且耦接部形成斷路時，按壓部受作用力沿第一開槽往開孔方向移動，帶動卡扣部往機架內部移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power supply unit includes a frame, a circuit board, a switch component and a latch component. The frame has an opening, a first slot and a second slot. The circuit board is arranged in the frame. The switch component includes a button portion, a body and a coupling portion. The body is embedded in the opening, the button portion is provided on the body and located outside the frame, and the coupling portion is provided on the body and can be selectively connected or disconnected with the circuit board. The latch component includes an operating portion and a latch portion. The operating portion has a pressing part and an extending part. The pressing part is connected to the extending part and protrudes from the first slot, and the extending part is connected to the latch portion. The latch portion is connected to the frame and has a buckle part, and the buckle part protrudes from the frame from the second slot. When the button portion is far away from the frame and the coupling portion forms an open circuit, the pressing part is forced to move along the first slot toward the opening direction, driving the buckle part to move into the frame.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電源供應器</p>
        <p type="p">110:機架</p>
        <p type="p">130:電路板</p>
        <p type="p">150:開關組件</p>
        <p type="p">170:栓鎖組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="138" publication-number="202616146">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616146</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137646</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>大型語言模型系統及其運作方法以及應用方法</chinese-title>
        <english-title>A LARGE LANGUAGE MODEL SYSTEM AND ITS OPERATION METHOD AND APPLICATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250203B">G06N3/08</main-classification>
        <further-classification edition="202301120250203B">G06N3/04</further-classification>
        <further-classification edition="202301120250203B">G06N5/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種大型語言模型系統，包含個人人工智慧代理、企業人工智慧代理和公共人工智慧代理。大型語言模型系統之運作方法，包含：由個人人工智慧代理根據第一問題執行第一行動計劃以獲得第一整合答案及第一整合分數；以及由企業人工智慧代理根據第二問題執行第二行動計劃以獲得第二整合答案及第二整合分數。一種大型語言模型系統之應用方法，包含：將區塊圖的點陣圖轉換為可伸縮向量圖，並整合語意標籤到可伸縮向量圖；透過整合語意標籤的可伸縮向量圖與功能規格文件來訓練大型語言模型；以及利用已訓練的大型語言模型生成結構化文字描述的區塊圖。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A large language model system includes a personal AI agent, an enterprise AI agent, and a public AI agent. An operation method of a large language model system includes: executing a first action plan by the personal AI agent based on the first question to obtain the first integrated answer and the first integrated score; and executing a second action plan by the enterprise AI agent based on the second question to obtain the second integrated answer and the second integrated score. An application method of a large language model system, includes: converting a bitmap of a block diagram into a scalable vector graphic, integrating semantic tags into the scalable vector graphic; training the large language model by inputting the scalable vector graphics integrated with semantic tags and the functional specification documents; and using the trained large language model to generate a block diagram with structured text descriptions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:個人人工智慧電腦</p>
        <p type="p">102:個人人工智慧代理</p>
        <p type="p">104:個人向量資料庫</p>
        <p type="p">106:個人大型語言模型</p>
        <p type="p">200:企業人工智慧伺服器</p>
        <p type="p">202:企業人工智慧代理</p>
        <p type="p">204:企業向量資料庫</p>
        <p type="p">206:企業大型語言模型</p>
        <p type="p">300:公共人工智慧伺服器</p>
        <p type="p">302:公共人工智慧代理</p>
        <p type="p">304:公共向量資料庫</p>
        <p type="p">306:公共大型語言模型</p>
        <p type="p">600:使用者</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="139" publication-number="202616697">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616697</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137655</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置組件</chinese-title>
        <english-title>ELECTRONIC DEVICE COMBINATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">H04L9/38</main-classification>
        <further-classification edition="200601120241104B">H04L12/50</further-classification>
        <further-classification edition="200601120241104B">G06F13/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>致伸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRIMAX ELECTRONICS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>温朝欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, CHAO-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王瑞閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JUI-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃崇涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUNG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">電子裝置組件，包括第一電子裝置以及第二電子裝置。第一電子裝置包括第一處理單元、第一連接介面、第一開關以及第一檢測模塊。第一連接介面包括第一資料傳輸接腳或是第一控制訊號接腳。第一開關電性連接第一處理單元與第一資料傳輸接腳或是電性連接第一處理單元與第一控制訊號接腳。第一檢測模塊電性連接第一開關。第二電子裝置包括第二處理單元、第二連接介面以及裝置識別元件。當第一連接介面連接第二連接介面後，若第一檢測模塊檢測到裝置識別元件，第一開關允許第一處理單元接收來自於第一資料傳輸接腳或來自第一控制訊號接腳的訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device combination is provided. The electronic device combination includes a first electronic device and a second electronic device. The first electronic device includes a first processing unit, a first connection interface, a first switch and a first detection module. The first connection interface includes a one first data transmission pin or a first control signal pin. The first switch is electrically connected to the first processing unit andthe first data transmission pin or connected to the first processing unit and the first control signal pin. The first detection module is electrically connected to the first switch. The second electronic device includes a second processing unit, a second connection interface and a device recognition component. When the first connection interface is connected to the second connection interface, if the first detection module detects the device recognition element, the first switch allows the first processing unit to receive a signal from the first data transmission pin or from the first control signal pin.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一電子裝置</p>
        <p type="p">11:第一處理單元</p>
        <p type="p">12:第一連接介面</p>
        <p type="p">13:第一開關</p>
        <p type="p">14:第一檢測模塊</p>
        <p type="p">2:第二電子裝置</p>
        <p type="p">21:第二處理單元</p>
        <p type="p">22:第二連接介面</p>
        <p type="p">23:裝置識別元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="140" publication-number="202615761">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615761</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137657</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>離合機構及電子鎖</chinese-title>
        <english-title>CLUTCH MECHANISM AND ELECTRONIC LOCK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">E05B47/02</main-classification>
        <further-classification edition="200601120241104B">E05B15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>啓碁科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON NEWEB CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟慶勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENG, CHING HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李振緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHEN WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭　潔盈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEANG, KIT IENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MO</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉欣宜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HSIN YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種離合機構，包含一離合件、至少一離合部、一彈性件以及至少一連動部。前述至少一離合部設置於離合件。彈性件包含二彈臂，且二彈臂之間具有一角度，二彈臂受力作動並提供一復位力給前述至少一離合部。前述至少一連動部與前述至少一離合部對應。藉此簡化結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a clutch mechanism including a clutch member, at least one clutch portion, an elastic member and at least one linking portion. The at least one clutch portion is disposed at the clutch member. The elastic member includes two elastic arms, and an angle is contained between the two elastic arms. The two elastic arms are forced to operate so as to provide a restoring force to the at least one clutch portion. The at least one linking portion corresponds to the at least one clutch portion. Therefore, the structure is simplified.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:離合機構</p>
        <p type="p">110:齒輪</p>
        <p type="p">111:內環面</p>
        <p type="p">112:連動部</p>
        <p type="p">113:中心孔</p>
        <p type="p">114:側齒</p>
        <p type="p">120:彈性件</p>
        <p type="p">121:彈臂</p>
        <p type="p">122:捲繞部</p>
        <p type="p">130:離合件</p>
        <p type="p">131:板體</p>
        <p type="p">1311:段差部</p>
        <p type="p">1311a:內表面</p>
        <p type="p">1312:銷件</p>
        <p type="p">1313:銷槽</p>
        <p type="p">1314:穿孔</p>
        <p type="p">132:導引槽</p>
        <p type="p">140:離合部</p>
        <p type="p">150:設置盤</p>
        <p type="p">151:樞軸</p>
        <p type="p">152:軸孔</p>
        <p type="p">153:限位柱</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="141" publication-number="202616527">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616527</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137661</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像感測器封裝結構及其封裝方法</chinese-title>
        <english-title>IMAGE SENSOR PACKAGE AND PACKAGING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250102B">H01L25/065</main-classification>
        <further-classification edition="202501120250102B">H10F39/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力成科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERTECH TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周武毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, WU-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳志豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIU-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巫勤達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIN-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林南君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, NAN-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾仁棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, JENTUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡書慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳嘉敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種影像感測器封裝結構及其封裝方法，該影像感測器封裝結構係主要於一透光基板的其中一表面形成一朝向相對的另一表面的環凹部，並於該環凹部內設一遮光件，由於一感光晶片的感光區係朝向形成有該環凹部之透光基板的表面，其中的遮光件能有效地為該感光區遮擋由該透光基板側入的光線，確保該感光晶片不受側入光線的影響。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an image sensor package and packaging method thereof. In the image sensor package, a transparent substrate has two opposite surfaces and a ring recess is formed on one of the surface facing the opposite surface. A light-shading part is mounted in the ring recess. Since a light-sensing zone of the light-sensing chip faces the surface with the ring recess, the light-shading part can effectively block lights entering the light-sensing zone from sides of the transparent substrate. Therefore, the photosensitive chip is not affected by the side-entering light.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:影像感測器封裝結構</p>
        <p type="p">10:感光晶片</p>
        <p type="p">101:外側</p>
        <p type="p">11:主動面</p>
        <p type="p">111:第一線路層</p>
        <p type="p">12:感光區</p>
        <p type="p">121:半導體感光元件</p>
        <p type="p">13:非感光區</p>
        <p type="p">131:晶片線路層</p>
        <p type="p">14:背面</p>
        <p type="p">141:第二線路層</p>
        <p type="p">142:外連接件</p>
        <p type="p">15:矽穿孔</p>
        <p type="p">20:透光基板</p>
        <p type="p">201:外側</p>
        <p type="p">21:第一表面</p>
        <p type="p">22:第二表面</p>
        <p type="p">23:環凹部</p>
        <p type="p">24:遮光件</p>
        <p type="p">30:膠堤</p>
        <p type="p">31:外側</p>
        <p type="p">40:封膠體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="142" publication-number="202616528">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616528</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137662</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像感測器封裝結構及其晶片級接合封裝方法</chinese-title>
        <english-title>IMAGE SENSOR PACKAGE AND CHIP LEVEL BONDING PACKAGING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250102B">H01L25/065</main-classification>
        <further-classification edition="202501120250102B">H10F39/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力成科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERTECH TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周武毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, WU-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳志豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIU-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巫勤達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIN-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林南君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, NAN-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾仁棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, JENTUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡書慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳嘉敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種影像感測器封裝結構及其晶片級接合封裝方法，於晶片級接合封裝方法中，將多個經切割的感光晶片設置於一透光基板上，再以一封膠體包覆各該感光晶片經切割而外露於其外側的晶片線路層，即該封膠體係形成在各該感光晶片的外側；如此，可確保感光晶片避免環境影響其外露的晶片線路層，確保影像感測器封裝結構的可靠度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a image sensor package and chip level bonding packaging method thereof. In the chip level bonding packaging method, a plurality of diced light-sensing chips mounted on a transparent substrate and then an encapsulation encapsulating an exposed chip wiring layer of each diced light-sensing chip. That is, the encapsulation is formed on outsides of each diced light-sensing chip. Therefore, the exposed chip wiring layer is not affected by outside environment to ensure the reliability of the image sensor package.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:影像感測器封裝結構</p>
        <p type="p">10:感光晶片</p>
        <p type="p">101:外側</p>
        <p type="p">11:主動面</p>
        <p type="p">111:第一線路層</p>
        <p type="p">121:半導體感光元件</p>
        <p type="p">12:感光區</p>
        <p type="p">13:非感光區</p>
        <p type="p">131:晶片線路層</p>
        <p type="p">132:低介電(low-k)材料層</p>
        <p type="p">133:金屬層</p>
        <p type="p">14:背面</p>
        <p type="p">141:第二線路層</p>
        <p type="p">142:外連接件</p>
        <p type="p">15:矽穿孔</p>
        <p type="p">20:透光基板</p>
        <p type="p">201:外側</p>
        <p type="p">21:第一表面</p>
        <p type="p">22:第二表面</p>
        <p type="p">30:膠堤</p>
        <p type="p">31:外側</p>
        <p type="p">40:封膠體</p>
        <p type="p">41:外側</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="143" publication-number="202614980">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614980</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137663</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在脊椎手術中創造空腔的裝置</chinese-title>
        <english-title>DEVICES FOR CREATING CAVITIES IN SPINE SURGERY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250102B">A61B90/50</main-classification>
        <further-classification edition="200601120250102B">A61B17/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIUNG, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIUNG, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何美瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盛珮雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在此揭示供脊椎手術用的裝置。所述裝置包括：一第一元件，其具有一遠端及一近端且包括一第一腔，其延伸通過第一元件的軸長並具有一近端開口，用以引入第一流體於其中；一第二元件，其具有一遠端及一近端且包括一第二腔，其大小恰可容納除第一元件的遠端及近端以外的第 一元件於其中，一第三腔，其具有一遠端開口並與第二腔平行，以及一近端入口，與第三腔相接；以及一可膨脹的結構，與第三腔的遠端開口耦接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein is a device for use in a spine surgery. The device includes: a first member having a distal end and a proximal end and includes a first lumen extending through the axial length of the first member and has a proximal opining for introducing a first fluid therethrough; a second member having a distal end and a proximal end and includes a second lumen sized to accommodate the first member therein except the distal and proximal ends thereof, a third lumen having a distal opening and is parallel to the second lumen, and a proximal inlet connected to the third lumen for introducing a second fluid therethrough; and an expandable structure coupled to the distal opening of the third lumen.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:第一元件</p>
        <p type="p">112、122:遠端</p>
        <p type="p">114、124:近端</p>
        <p type="p">116:第一腔</p>
        <p type="p">118:近端開口</p>
        <p type="p">120:第二元件</p>
        <p type="p">125:第二腔</p>
        <p type="p">126:第三腔</p>
        <p type="p">127:遠端開口</p>
        <p type="p">128:近端入口</p>
        <p type="p">130:可膨脹的結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="144" publication-number="202616091">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616091</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137664</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通用序列匯流排集線裝置及其控制方法</chinese-title>
        <english-title>UNIVERSAL SERIAL BUS HUB DEVICE AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">G06F13/38</main-classification>
        <further-classification edition="200601120250203B">G06F13/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭俊竑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIAU, JIUNN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林能賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, NENG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">通用序列匯流排集線裝置包含第一下行接口、可擴展主機控制器介面、第二下行接口、路由器以及上行接口。第一下行接口用以接收第一通用序列匯流排資料。可擴展主機控制器介面用以將第一通用序列匯流排資料轉換為高速周邊元件互連資料。第二下行接口用以接收第二通用序列匯流排資料。路由器用以將高速周邊元件互連資料轉換為第一隧道資料，並將第二通用序列匯流排資料轉換為第二隧道資料。上行接口用以輸出第一隧道資料以及第二隧道資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A universal serial bus (USB) hub includes a first down facing port (DFP), an eXtensible Host Controller Interface (xHCI), a second down facing port (DFP), a router, and an up facing port (UFP). The first DFP is configured to receive a first USB data. The xHCI is configured to convert the first USB data into a peripheral component interconnection express (PCIe) data. The second DFP is configured to receive a second USB data. The router is configured to convert the PCIe data into a first tunneled data, and convert the second USB data into a second tunneled data. The UFP is configured to output the first tunneled data and the second tunneled data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:通用序列匯流排集線裝置</p>
        <p type="p">111~115:下行接口</p>
        <p type="p">120:可擴展主機控制器介面</p>
        <p type="p">130:路由器</p>
        <p type="p">131~136:適配器</p>
        <p type="p">137、138:下行埠</p>
        <p type="p">139:上行埠</p>
        <p type="p">140:上行接口</p>
        <p type="p">151~156:多工器</p>
        <p type="p">161、162:集線器</p>
        <p type="p">170:高速周邊元件互連交換器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="145" publication-number="202616726">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616726</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137665</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可從複數個影音輸入源作選擇以決定影音輸出源給外部裝置的方法及可執行該方法的顯示器</chinese-title>
        <english-title>METHOD CAPABLE OF SELECTING FROM MULTIPLE VIDEO/AUDIO INPUT SOURCES TO DETERMINE VIDEO/AUDIO OUTPUT SOURCE FOR EXTERNAL DEVICE AND MONITOR CAPABLE OF PERFORMING THE METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120250203B">H04N21/422</main-classification>
        <further-classification edition="201101120250203B">H04N21/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王君華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUN-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳政鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHENG-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可從複數個影音輸入源作選擇以決定一影音輸出源給一外部裝置的方法。該方法是由一顯示器來執行，包含：經由複數個輸入埠分別接收該複數個影音輸入源，並接收一使用者命令，其中該使用者命令用來指定該複數個影音輸入源的一第一影音輸入源作為該影音輸出源的一選擇來源；判斷該選擇來源是否正由該顯示器播放；以及當判斷該選擇來源正由該顯示器播放時，執行輸出步驟。該輸出步驟包含：當該顯示器之一輸出埠的頻寬足夠時，依據該選擇來源的格式與該輸出埠的規格來設定一影音輸出電路，其中該輸出埠用來實體耦接該外部裝置；以及在設定完該影音輸出電路後，令該影音輸出電路依據該選擇來源輸出該影音輸出源給該輸出埠。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method capable of selecting from multiple video/audio input sources to determine a video/audio output source for an external device. The method is performed by a monitor and comprises: receiving the multiple video/audio input sources via multiple input ports respectively, and receiving a user command appointing a first video/audio input source of the multiple video/audio input sources as a selected source of the video/audio output source; determining whether the monitor displays frame(s) according to the selected source, and if so, executing output steps. The output steps include: when a bandwidth of an output port of the monitor is enough, setting a video/audio output circuit according to a format of the selected source and a specification of the output port, wherein the output port is coupled to the external device; and using the video/audio output circuit to output the video output source to the output port according to the selected source.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210~S260:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="146" publication-number="202614966">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614966</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137666</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可更換式排氣管件、安裝該排氣管件之血壓計及其排氣方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241106B">A61B5/022</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豪展醫療科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVITA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊弼皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, PI-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃義智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, I-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳有新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YU-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡旺霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可更換式排氣管件，用於連通一氣袋單元，包含：一本體，具有一氣體通道；一第一管道，自該本體延伸；以及一第二管道，自該本體延伸，其中，該第一管道與該第二管道經該氣體通道彼此連通，且該第二管道形成至少一氣孔，俾使該氣袋單元經由該氣體通道進行加壓期間，該氣孔作用為一慢速洩壓孔。本發明血壓計與排氣方法使用該可更換式排氣管件，以因應該氣袋單元的不同預設尺寸，使血壓計的量測可獲得更精確的結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">22’:排氣管件</p>
        <p type="p">23:氣孔</p>
        <p type="p">220:本體</p>
        <p type="p">221:第一管道</p>
        <p type="p">222:第二管道</p>
        <p type="p">2201:扣持臂</p>
        <p type="p">2202:扣持臂</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="147" publication-number="202616045">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616045</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137667</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高輸出穩定度之電源供應器</chinese-title>
        <english-title>POWER SUPPLY DEVICE WITH HIGH OUTPUT STABILITY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">G06F1/28</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹子增</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, TZU-TSENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種高輸出穩定度之電源供應器，包括：一橋式整流器、一升壓電感器、一功率切換器、一第一輸出級電路、一切換電路、一變壓器、一諧振電容器、一第二輸出級電路，以及一偵測及控制電路。諧振電容器可產生一電容電位。第二輸出級電路可產生一輸出電位。偵測及控制電路可根據電容電位和輸出電位來判斷是否有一過電壓事件發生。若過電壓事件有發生且已持續長達一既定時間，則偵測及控制電路即停止輸出一第一驅動電位至功率切換器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power supply device with high output stability includes a bridge rectifier, a boost inductor, a power switch element, a first output stage circuit, a switch circuit, a transformer, a resonant capacitor, a second output stage circuit, and a detection and control circuit. The resonant capacitor generates a capacitive voltage. The second output stage circuit generates an output voltage. The detection and control circuit determines whether an over voltage event occurs according to the capacitive voltage and the output voltage. If the over voltage event occurs and the duration of the over voltage event reaches a predetermined time, the detection and control circuit will stop outputting a first driving voltage to the power switch element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電源供應器</p>
        <p type="p">110:橋式整流器</p>
        <p type="p">120:功率切換器</p>
        <p type="p">130:第一輸出級電路</p>
        <p type="p">140:切換電路</p>
        <p type="p">150:變壓器</p>
        <p type="p">151:主線圈</p>
        <p type="p">152:第一副線圈</p>
        <p type="p">153:第二副線圈</p>
        <p type="p">160:第二輸出級電路</p>
        <p type="p">170:偵測及控制電路</p>
        <p type="p">CR:諧振電容器</p>
        <p type="p">LM:激磁電感器</p>
        <p type="p">LR:漏電感器</p>
        <p type="p">LU:升壓電感器</p>
        <p type="p">TD:既定時間</p>
        <p type="p">VE:中間電位</p>
        <p type="p">VG1:第一驅動電位</p>
        <p type="p">VG2:第二驅動電位</p>
        <p type="p">VG3:第三驅動電位</p>
        <p type="p">VIN1:第一輸入電位</p>
        <p type="p">VIN2:第二輸入電位</p>
        <p type="p">VOUT:輸出電位</p>
        <p type="p">VP:電容電位</p>
        <p type="p">VR:整流電位</p>
        <p type="p">VSS:接地電位</p>
        <p type="p">VW:切換電位</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="148" publication-number="202616046">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616046</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137668</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高輸出穩定度之電源供應器</chinese-title>
        <english-title>POWER SUPPLY DEVICE WITH HIGH OUTPUT STABILITY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">G06F1/28</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹子增</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, TZU-TSENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種高輸出穩定度之電源供應器，包括：一橋式整流器、一第一電感器、一第一功率切換器、一第一輸出級電路、一輔助調整電路、一切換電路、一變壓器、一諧振電容器、一放大電路、一第二輸出級電路，以及一微控制器，其中微控制器可根據一溝通電位和一選擇電位來操作於一交錯模式或一同步模式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power supply device with high output stability includes a bridge rectifier, a first inductor, a first power switch element, a first output stage circuit, an auxiliary adjustment circuit, a switch circuit, a transformer, a resonant capacitor, an amplifying circuit, a second output stage circuit, and an MCU (Microcontroller Unit). The MCU operates in an interleaving mode or a synchronizing mode according to a communication voltage and a selection voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電源供應器</p>
        <p type="p">110:橋式整流器</p>
        <p type="p">120:第一功率切換器</p>
        <p type="p">130:第一輸出級電路</p>
        <p type="p">140:輔助調整電路</p>
        <p type="p">145:第二功率切換器</p>
        <p type="p">150:切換電路</p>
        <p type="p">160:變壓器</p>
        <p type="p">161:主線圈</p>
        <p type="p">162:第一副線圈</p>
        <p type="p">163:第二副線圈</p>
        <p type="p">170:放大電路</p>
        <p type="p">180:第二輸出級電路</p>
        <p type="p">190:微控制器</p>
        <p type="p">CR:諧振電容器</p>
        <p type="p">L1:第一電感器</p>
        <p type="p">LM:激磁電感器</p>
        <p type="p">LR:漏電感器</p>
        <p type="p">MD1:交錯模式</p>
        <p type="p">MD2:同步模式</p>
        <p type="p">VC:控制電位</p>
        <p type="p">VE:中間電位</p>
        <p type="p">VG1:第一驅動電位</p>
        <p type="p">VG2:第二驅動電位</p>
        <p type="p">VG3:第三驅動電位</p>
        <p type="p">VG4:第四驅動電位</p>
        <p type="p">VIN1:第一輸入電位</p>
        <p type="p">VIN2:第二輸入電位</p>
        <p type="p">VL:選擇電位</p>
        <p type="p">VM:放大電位</p>
        <p type="p">VOUT:輸出電位</p>
        <p type="p">VP:電容電位</p>
        <p type="p">VR:整流電位</p>
        <p type="p">VSS:接地電位</p>
        <p type="p">VT:溝通電位</p>
        <p type="p">VW:切換電位</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="149" publication-number="202615142">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615142</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137698</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>混合裝置及混合系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120241204B">B01F25/433</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立高雄科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊政達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種混合裝置，包含：一流體輸入部，適於接收至少一待混合流體，該流體輸入部包括：至少一流體輸入管道；以及一流體混合部，連通於該流體輸入部，該流體混合部包括：一流體混合管道，連通於該至少一流體輸入管道；以及一被動晃動導流件，設置於該流體混合管道；其中，該被動晃動導流件係由流經該被動晃動導流件的待混合流體所驅動而晃動。混合裝置適於在管道中以無外加動力方式提升混合效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:混合裝置</p>
        <p type="p">100:流體輸入部</p>
        <p type="p">110:流體輸入管道</p>
        <p type="p">200:流體混合部</p>
        <p type="p">210:流體混合管道</p>
        <p type="p">220:被動晃動導流件</p>
        <p type="p">500:待混合流體</p>
        <p type="p">510:第一待混合流體</p>
        <p type="p">520:第二待混合流體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="150" publication-number="202616412">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616412</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137723</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於晶圓盒承載設備的上鎖及解鎖模組及晶圓盒承載設備</chinese-title>
        <english-title>LOCKING/UNLOCKING MODULE FOR WAFER CARRIER LOAD PORT AND WAFER CARRIER LOAD PORT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241101B">H01L21/67</main-classification>
        <further-classification edition="200601120241101B">H01L21/673</further-classification>
        <further-classification edition="200601120241101B">H01L21/677</further-classification>
        <further-classification edition="200601120241101B">B65D43/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華景電通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRILLIAN NETWORK &amp; AUTOMATION INTEGRATED SYSTEM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪毓蔚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, YU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉信金</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於晶圓盒承載設備的上鎖及解鎖模組，包含傳動組件、驅動元件、齒輪元件及閂鎖鍵。傳動組件包含線性滑軌及可沿線性滑軌滑動的一線性移動件，且線性移動件設有沿一直線方向排列的多個齒形結構。驅動元件連接線性移動件，用以使線性移動件產生沿直線方向的往復運動。齒輪元件嚙合線性移動件的齒形結構，閂鎖鍵與齒輪元件同軸設置且與齒輪元件連動，且閂鎖鍵可旋轉於一第一位置及一第二位置之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A locking and unlocking module for a wafer carrier lord port includes a transmission assembly, a drive element, a gear component, and a latch member. The transmission assembly includes a linear slide rail and a linear motion element that slides along the slide rail, and the linear motion element has multiple teeth structures aligned in a straight line. The drive element is coupled to the linear motion element to enable linear reciprocating movements of the linear motion element. The gear component engages with the teeth structures of the linear motion element, the latch member is coaxially positioned with the gear component to ensure synchronized movement, and the latch member can rotate between a first position and a second position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:上鎖及解鎖模組</p>
        <p type="p">110:驅動元件</p>
        <p type="p">110a:氣缸</p>
        <p type="p">112:活塞桿</p>
        <p type="p">114:活塞</p>
        <p type="p">120:傳動組件</p>
        <p type="p">122:線性滑軌</p>
        <p type="p">122a:軌道</p>
        <p type="p">122b:滑塊</p>
        <p type="p">124:線性移動件</p>
        <p type="p">124a:齒形結構</p>
        <p type="p">126:連接件</p>
        <p type="p">128:浮動接頭</p>
        <p type="p">130、130a、130b:齒輪元件</p>
        <p type="p">140、140a、140b:閂鎖鍵</p>
        <p type="p">142:軸承組件</p>
        <p type="p">142a:軸承</p>
        <p type="p">142b:間隔環</p>
        <p type="p">142c:軸承座</p>
        <p type="p">152:限位件</p>
        <p type="p">P、Q:端部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="151" publication-number="202615191">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615191</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137735</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於複合材料鑽孔的GHz脈衝串雷射光源系統與方法</chinese-title>
        <english-title>GHZ PULSE BURST LASER SOURCE SYSTEM AND METHOD FOR DRILLING COMPOSITE MATERIAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120241104B">B23K26/38</main-classification>
        <further-classification edition="201401120241104B">B23K26/062</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聚嶸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COHPROS INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游智偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種 GHz脈衝串雷射光源系統，包括：承載模組，承載複合材料；雷射光產生模組，提供雷射光束；雷射光擴束器，產生擴大雷射光束；X軸雷射光振鏡掃描模組，反射擴大雷射光束；X軸雷射光振鏡控制器，控制X軸雷射光振鏡掃描模組的X軸方向旋轉角度；Y軸雷射光振鏡掃描模組，反射擴大雷射光束；Y軸雷射光振鏡控制器，控制Y軸雷射光振鏡掃描模組的Y軸方向旋轉角度；聚光鏡，將自Y軸雷射光振鏡掃描模組的擴大雷射光束聚焦為具有期望加工之高徑深比(high aspect ratio)的聚焦後雷射光束，以將聚焦後雷射光束投射至複合材料的一或多個鑽孔處；以及監控模組，用以監控所述複合材料的鑽孔狀態；其中雷射光束的脈衝寬度位於50~500 fs之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a GHz pulse burst laser source system. The GHz pulse burst laser source system comprises: a carrier module, configured to carry a composite material; a laser light generator module, configured to provide a laser beam; a laser beam expander, configured to generate an expanded laser beam; an X-axis laser light Galvo scanning module, configured to reflect the expanded laser beam; a X-axis laser light Galvo controller, configured to control X-axis direction rotation angles of the X-axis laser light Galvo scanning module; a Y-axis laser light Galvo scanning module, configured to reflect the expanded laser beam; a Y-axis laser light Galvo controller, configured to control Y-axis direction rotation angles of the Y-axis laser light Galvo scanning module; a condenser, configured to aggregate the expanded laser beam from the Y-axis laser light Galvo scanning module into an focused laser beam having a predetermined high aspect ratio, so as to project the focused laser beam to one or more drilling places of the composite material; and a monitoring module, configured to monitor the cutting status of the composite material; wherein a pulse width of the laser beam is between 50 and 500 fs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:雷射光產生模組</p>
        <p type="p">104:雷射光擴束器</p>
        <p type="p">106:X軸雷射光振鏡掃描模組</p>
        <p type="p">108:X軸雷射光振鏡控制器</p>
        <p type="p">110:Y軸雷射光振鏡掃描模組</p>
        <p type="p">112:Y軸雷射光振鏡控制器</p>
        <p type="p">114:聚光鏡</p>
        <p type="p">116:承載模組</p>
        <p type="p">118:複合材料</p>
        <p type="p">120:鑽孔處</p>
        <p type="p">D1:GHz脈衝串雷射光源系統</p>
        <p type="p">L1:雷射光束</p>
        <p type="p">L2:擴大雷射光束</p>
        <p type="p">L3:聚焦後雷射光束</p>
        <p type="p">V:偏移速度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="152" publication-number="202616137">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616137</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137741</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>混合式儲能電子標籤裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241016B">G06K19/07</main-classification>
        <further-classification edition="200601120241016B">G09F9/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>駿善科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RFINCHARGE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭政宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李硯楷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭元福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁嘉君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address></address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種混合式儲能電子標籤裝置，包含一電子紙顯示單元，一儲能單元，一近場通信單元及一控制單元。該近場通信單元被動響應一電子裝置發起的通訊產生一感應磁場信號。該控制單元連接該近場通信單元與該電子紙顯示單元，該控制單元具有一以該感應磁場信號所含能量及資訊令該電子紙顯示單元改變顯示的第一狀態，及一令該儲能單元向該電子紙顯示單元供應電力使該電子紙顯示單元得基於該感應磁場信號所含資訊來改變顯示的第二狀態。其中，於該第二狀態中，該控制單元得令該儲能單元以該感應磁場信號所含能量進行儲能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:混合式儲能電子標籤裝置</p>
        <p type="p">21:電子紙顯示單元</p>
        <p type="p">22:儲能單元</p>
        <p type="p">23:近場通信單元</p>
        <p type="p">231:感應磁場信號</p>
        <p type="p">24:控制單元</p>
        <p type="p">30:電子裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="153" publication-number="202616850">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616850</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137748</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10D30/60</main-classification>
        <further-classification edition="202501120250102B">H10D62/10</further-classification>
        <further-classification edition="202501120250102B">H10D62/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張華源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HUA-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體裝置。半導體裝置包括基板、埋置層、磊晶層、深井區、高壓井區及閘極導電層。基板具有第一導電型態。埋置層具有第一導電型態，且設置在基板上。磊晶層具有不同於第一導電型態的第二導電型態，且設置在埋置層上。深井區具有第二導電型態且設置於磊晶層中。高壓井區，具有第一導電型態，且設置於磊晶層中。閘極導電層設置在磊晶層上。其中，深井區包括第一部分。第一部分包括至少兩個第一子部分。至少兩個第一子部分彼此分離且磊晶層設置於至少兩個第一子部分之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device is provided. The semiconductor device includes a substrate, a buried layer, an epitaxial layer, a deep well, a high pressure well, and a gate conductive layer. The substrate has a first conductivity type. The buried layer has the first conductivity type and is disposed on the substrate. The epitaxial layer has a second conductivity type different from the first conductivity type and is disposed on the buried layer. The deep well region has the second conductive type and is disposed in the epitaxial layer. The high pressure well region has the first conductive type and is disposed in the epitaxial layer. The gate conductive layer is disposed on the epitaxial layer. Wherein, the deep well includes a first portion. The first portion includes at least two first sub-portions. The at least two first sub-portions are separated from each other and the epitaxial layer is disposed between the at least two first sub-portions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體裝置</p>
        <p type="p">100:基板</p>
        <p type="p">102:埋置層</p>
        <p type="p">103:開口</p>
        <p type="p">104:磊晶層</p>
        <p type="p">112:深井區</p>
        <p type="p">114:高壓井區</p>
        <p type="p">122:井區</p>
        <p type="p">124:基極區</p>
        <p type="p">200:隔離區</p>
        <p type="p">210:閘極介電層</p>
        <p type="p">220:閘極導電層</p>
        <p type="p">230:閘極間隔物</p>
        <p type="p">302:第一摻雜區</p>
        <p type="p">304:第二摻雜區</p>
        <p type="p">306:第三摻雜區</p>
        <p type="p">A:第一部分</p>
        <p type="p">A1,A2,A3,A4:第一子部分</p>
        <p type="p">B:第二部分</p>
        <p type="p">BE:基極電極</p>
        <p type="p">C:第三部分</p>
        <p type="p">DE:汲極電極</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">GE:閘極電極</p>
        <p type="p">I-I’:線段</p>
        <p type="p">R1:第一區域</p>
        <p type="p">R2:第二區域</p>
        <p type="p">R3:第三區域</p>
        <p type="p">s1:第一距離</p>
        <p type="p">s2:第二距離</p>
        <p type="p">SE:源極電極</p>
        <p type="p">w1:第一寬度</p>
        <p type="p">w2:第二寬度</p>
        <p type="p">w3:第三寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="154" publication-number="202615886">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615886</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137749</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>定位系統及方法</chinese-title>
        <english-title>POSITIONING SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120250203B">G01S5/02</main-classification>
        <further-classification edition="200601120250203B">G01S5/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仁寶電腦工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COMPAL ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝弘軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, HUNG-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案係關於一種定位系統，包含待定位裝置及第一定位單元。待定位裝置包含相互電連接之第一收發器、第二收發器及控制器，控制器根據第一收發器及第二收發器之間的第一距離設定座標系，第一收發器及第二收發器於座標系中之座標分別為第一座標及第二座標。第一定位單元包含與第一收發器及第二收發器相互通訊的第三收發器。控制器透過第一收發器、第二收發器及第三收發器之間的訊號傳輸，獲取第二收發器與第三收發器之間的第二距離及第一收發器與第三收發器之間的第三距離。控制器依據第一至第三距離、第一座標及第二座標獲取第一定位單元之第三收發器的第三座標。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A positioning system is provided. The positioning system includes a positioning device and a first positioning unit. The positioning device includes a first transceiver, a second transceiver and a controller electrically connected to each other. The controller sets a coordinate system according to a first distance between the first transceiver and the second transceiver. The coordinates of the first transceiver and the second transceiver in the coordinate system are a first coordinate and a second coordinate respectively. The first positioning unit includes a third transceiver that communicates with the first transceiver and the second transceiver. The controller obtains a second distance between the second transceiver and the third transceiver and a third distance between the first transceiver and the third transceiver through signal transmission between the first transceiver, the second transceiver and the third transceiver. The controller obtains a third coordinate of the third transceiver of the first positioning unit based on the first to third distances, the first coordinate and the second coordinate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:定位系統</p>
        <p type="p">10:待定位裝置</p>
        <p type="p">11:第一收發器</p>
        <p type="p">12:第二收發器</p>
        <p type="p">13:控制器</p>
        <p type="p">2:第一定位單元</p>
        <p type="p">20:第三收發器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="155" publication-number="202615186">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615186</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137750</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於切割複合材料的GHz脈衝串雷射光源系統與方法</chinese-title>
        <english-title>GHZ PULSE BURST LASER SOURCE SYSTEM AND METHOD FOR DICING COMPOSITE MATERIAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120241104B">B23K26/046</main-classification>
        <further-classification edition="201401120241104B">B23K26/042</further-classification>
        <further-classification edition="201401120241104B">B23K26/38</further-classification>
        <further-classification edition="201401120241104B">B23K26/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聚嶸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COHPROS INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游智偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種 GHz脈衝串雷射光源系統，包括：承載模組，承載複合材料；雷射光產生模組，提供雷射光束；準直模組，準直雷射光束為準直雷射光束；雷射光調整模組，用以反射準直雷射光束；聚光鏡，將反射的準直雷射光束聚焦至具有期望加工的切割寬度的聚焦後雷射光束，以將聚焦後雷射光束投射至複合材料的切割處；以及監控模組，用以監控所述複合材料的切割狀態；其中聚焦後雷射光束的投射路徑透過雷射光調整模組的調整使投射至複合材料的切割處之聚焦後雷射光束被平行偏移，或者複合材料透過承載模組的移動使複合材料的切割處被平行偏移，雷射光束的脈衝寬度位於50~500 fs之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a GHz pulse burst laser source system. The GHz pulse burst laser source system comprises: a carrier module, configured to carry a composite material; a laser light generator module, configured to provide a laser beam; a collimating module, configured to collimate the laser beam to a collimated laser beam; a laser light adjustment scanning module, configured to reflect the collimated laser beam; a condenser, configured to aggregate the reflected collimated laser beam into an focused laser beam having a predetermined cutting width, so as to project the focused laser beam to a cutting place of the composite material; and a monitoring module, configured to monitor the cutting status of the composite material; wherein projection path of the focused laser beam is adjusted by the laser light adjustment scanning module to project the composite material to the cut part The focused laser beam is shifted in parallel, or the cutting place of the composite material is shifted in parallel by movement of the composite material. A pulse width of the laser beam is between 50 and 500 fs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:雷射光產生模組</p>
        <p type="p">104:準直模組</p>
        <p type="p">106:雷射光調整模組</p>
        <p type="p">108:聚光鏡</p>
        <p type="p">110:承載模組</p>
        <p type="p">112:複合材料</p>
        <p type="p">114:切割處</p>
        <p type="p">D1:GHz脈衝串雷射光源系統</p>
        <p type="p">L1:雷射光束</p>
        <p type="p">L2:準直雷射光束</p>
        <p type="p">V:平移速度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="156" publication-number="202616210">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616210</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137752</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像強化裝置及其方法</chinese-title>
        <english-title>IMAGE ENHANCEMENT APPARATUS AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250203B">G06T5/00</main-classification>
        <further-classification edition="202401120250203B">G06T5/73</further-classification>
        <further-classification edition="202401120250203B">G06T5/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>信驊科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASPEED TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂忠晏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHUNG-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉信金</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種影像強化裝置，包含：N個線緩衝器、一局部窗格統計電路、一色調映射電路、一邊緣強化電路以及一適應性處理電路。該 N個線緩衝器，用以接收一目前影像，以及根據一個N        &lt;img align="absmiddle" height="9px" width="5px" file="ed10001.jpg" alt="ed10001.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;N的局部窗格，輸出        &lt;img align="absmiddle" height="9px" width="9px" file="ed10002.jpg" alt="ed10002.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;個像素。該局部窗格統計電路對該        &lt;img align="absmiddle" height="9px" width="9px" file="ed10002.jpg" alt="ed10002.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;個像素的值，進行低通濾波操作，以產生一濾波值        &lt;img align="absmiddle" height="9px" width="4px" file="ed10003.jpg" alt="ed10003.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;，以及計算該濾波值        &lt;img align="absmiddle" height="9px" width="4px" file="ed10003.jpg" alt="ed10003.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;及該        &lt;img align="absmiddle" height="9px" width="9px" file="ed10002.jpg" alt="ed10002.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;個像素之中心像素的值之間的差值        &lt;img align="absmiddle" height="9px" width="4px" file="ed10004.jpg" alt="ed10004.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;。該色調映射電路根據該濾波值        &lt;img align="absmiddle" height="9px" width="4px" file="ed10003.jpg" alt="ed10003.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;的亮度成分        &lt;img align="absmiddle" height="9px" width="8px" file="ed10005.jpg" alt="ed10005.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;及該中心像素的座標，產生一映射值        &lt;img align="absmiddle" height="10px" width="16px" file="ed10006.jpg" alt="ed10006.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;；該邊緣強化電路對該        &lt;img align="absmiddle" height="9px" width="9px" file="ed10002.jpg" alt="ed10002.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;個像素的亮度成分，進行邊緣強化濾波操作，以產生一亮度差值        &lt;img align="absmiddle" height="9px" width="11px" file="ed10007.jpg" alt="ed10007.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;；適應性處理電路則根據上述四個輸出(        &lt;img align="absmiddle" height="9px" width="8px" file="ed10005.jpg" alt="ed10005.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="9px" width="8px" file="ed10008.jpg" alt="ed10008.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="10px" width="16px" file="ed10006.jpg" alt="ed10006.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="9px" width="11px" file="ed10007.jpg" alt="ed10007.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;)，來更新該中心像素的亮度成分。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image enhancement apparatus is disclosed, comprising: N line buffers, local window statistics (LWS) circuitry, tone mapping (TM) circuitry, edge enhancement (EE) circuitry and adaptive processing (AP) circuitry. The N line buffers receive N rows of a current image and outputs        &lt;img align="absmiddle" height="15px" width="11px" file="ed10009.jpg" alt="ed10009.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;pixels according to a N        &lt;img align="absmiddle" height="15px" width="5px" file="ed10010.jpg" alt="ed10010.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;N local window. The LWS circuitry performs lowpass filtering operation over values of the        &lt;img align="absmiddle" height="15px" width="9px" file="ed10011.jpg" alt="ed10011.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;pixels to generate a filtered value        &lt;img align="absmiddle" height="15px" width="4px" file="ed10012.jpg" alt="ed10012.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;, and to calculate a difference value        &lt;img align="absmiddle" height="15px" width="4px" file="ed10013.jpg" alt="ed10013.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;between        &lt;img align="absmiddle" height="15px" width="4px" file="ed10012.jpg" alt="ed10012.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;and a value of a center pixel of the        &lt;img align="absmiddle" height="15px" width="11px" file="ed10009.jpg" alt="ed10009.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;pixels. The TM circuitry produces a mapped value        &lt;img align="absmiddle" height="15px" width="17px" file="ed10014.jpg" alt="ed10014.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;according to a luma component        &lt;img align="absmiddle" height="15px" width="8px" file="ed10015.jpg" alt="ed10015.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;of        &lt;img align="absmiddle" height="15px" width="4px" file="ed10012.jpg" alt="ed10012.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;and coordinates of the center pixel. The EE circuitry performs edge-enhancement filtering over the luma components of the N        &lt;sup&gt;2&lt;/sup&gt;pixels to produce a luma difference        &lt;img align="absmiddle" height="15px" width="13px" file="ed10016.jpg" alt="ed10016.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;. The AP circuitry updates the luma component of the center pixel according to four outputs (        &lt;img align="absmiddle" height="15px" width="8px" file="ed10015.jpg" alt="ed10015.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="15px" width="8px" file="ed10017.jpg" alt="ed10017.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,Y        &lt;sub&gt;map&lt;/sub&gt;,        &lt;img align="absmiddle" height="15px" width="11px" file="ed10018.jpg" alt="ed10018.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;).      </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:影像強化裝置</p>
        <p type="p">210:局部窗格統計模組</p>
        <p type="p">220:色調映射模組</p>
        <p type="p">230:邊緣強化模組</p>
        <p type="p">240:適應性處理模組</p>
        <p type="p">250:N個線緩衝器</p>
        <p type="p">260:輸出緩衝器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="157" publication-number="202615188">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615188</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137763</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>脈衝雷射系統以及脈衝雷射鑽孔方法</chinese-title>
        <english-title>PLUSE LASER SYSTEM AND PULSE LASER DRILLING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120241105B">B23K26/064</main-classification>
        <further-classification edition="201401120241105B">B23K26/062</further-classification>
        <further-classification edition="201401120241105B">B23K26/082</further-classification>
        <further-classification edition="201401120241105B">B23K26/38</further-classification>
        <further-classification edition="201401120241105B">B23K26/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聚嶸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COHPROS INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游智偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種脈衝雷射系統以及脈衝雷射鑽孔方法。脈衝雷射系統包括：發射模組，其用於提供脈衝雷射光束，其中，脈衝雷射光束的脈衝寬度介於50~500 fs之間，重複頻率介於0.5~10 GHz之間，脈衝能量介於100~1000 μJ之間；光束調整模組，其用於將脈衝雷射光束轉換成第一調變雷射光束；光學模組，其用於將第一調變雷射光束轉換成第二調變雷射光束；掃描模組，其用於選擇性地以投射方向投射第二調變雷射光束；聚焦模組，其用於將第二調變雷射光束轉換成投射至待鑽工件的平頂雷射光束；以及監控模組，用以即時監控所述待鑽工件的鑽孔狀態。藉此，本發明可提升待鑽工件的加工效率，同時降低待鑽工件的損壞率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pulse laser system and a pulse laser drilling method are provided. The pulse laser system includes: a transmitting module, which is used to provide a pulse laser beam, in which a pulse width of the pulse laser beam is between 50 and 500 fs, a repetition frequency is between 0.5 and 10 GHz, and a pulse energy is between 100~1000 μJ; a beam adjustment module, which is used to convert the pulsed laser beam into a first modulated laser beam; an optical module, which is used to convert the first modulated laser beam into a second modulated laser beam; a scanning module, which is used to selectively project the second modulated laser beam in a projection direction; a focusing module, which is used to convert the second modulated laser beam into a flat-top laser beam projected to a workpiece to be drilled; and a a monitoring module, configured to monitor the cutting status of the workpiece. By virtue of the present disclosure, the processing efficiency of the composite material can be improved while the damage rate of the composite material can be reduced.</p>
      </isu-abst>
      <representative-img>
        <p type="p">Z:脈衝雷射系統</p>
        <p type="p">1:發射模組</p>
        <p type="p">2:光束調整模組</p>
        <p type="p">3:光學模組</p>
        <p type="p">4:掃描模組</p>
        <p type="p">40:第一光束掃描單元</p>
        <p type="p">41:第二光束掃描單元</p>
        <p type="p">5:聚焦模組</p>
        <p type="p">6:分析模組</p>
        <p type="p">7:分光模組</p>
        <p type="p">8:載座模組</p>
        <p type="p">B:待鑽工件</p>
        <p type="p">L:脈衝雷射光束</p>
        <p type="p">L1:第一調變雷射光束</p>
        <p type="p">L2:第二調變雷射光束</p>
        <p type="p">LT:平頂雷射光束</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="158" publication-number="202616709">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616709</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137772</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>投影畫面調整方法及其投影機裝置</chinese-title>
        <english-title>PROJECTION SCREEN ADJUSTMENT METHOD AND THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241030B">H04N5/74</main-classification>
        <further-classification edition="200601120241030B">H04N5/58</further-classification>
        <further-classification edition="200601120241030B">G03B21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明基電通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENQ CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃知本</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIH-PEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種投影畫面調整方法，應用於電連接一外部電腦設備的一投影機裝置。該投影畫面調整方法包含有該投影機裝置之一投影鏡頭朝向一投影布幕投射來自該外部電腦設備之一影像輸出源的一投影畫面，該投影機裝置之一影像偵測器取得關聯於該投影畫面之一偵測影像，該投影機裝置之一運算處理器分析該偵測影像以找出該投影布幕之多個邊框與一框面比例，以及該運算處理器將該框面比例轉換為一控制指令發送給該外部電腦設備，從而驅使該外部電腦設備依照該框面比例相對應調整該影像輸出源之一輸出畫面比例。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A projection screen adjustment method is applied to a projector device electrically connected with an external computer apparatus. The projection screen adjustment method includes a projection lens of the projector device projecting a projection frame which is transmitted from an image output source of the external computer apparatus towards a projection screen, an image detector of the projector device acquiring a detection image relevant to the projection frame, an operation processor of the projector device analyzing the detection image to find rims and a rim ratio of the projection screen, and transforming the rim ratio into a control command for transmitting towards the external computer apparatus, so that the external computer apparatus adjusts an output image ratio of the image output source in accordance with the rim ratio.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100、S102、S104、S106、S108、S110、S112、S114、S116、S118:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="159" publication-number="202616241">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616241</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137775</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於解釋鼻造型術程序的預製鼻模型</chinese-title>
        <english-title>PREFABRICATED NOSE MODEL FOR EXPLAINING RHINOPLASTY PROCEDURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250629B">G09B23/28</main-classification>
        <further-classification edition="200601120250629B">G09B23/32</further-classification>
        <further-classification edition="200601120250629B">G09B23/34</further-classification>
        <further-classification edition="200601120250629B">G09B19/10</further-classification>
        <further-classification edition="200601120250629B">A61F5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商必塑庭股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BISTOOL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裵恩賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, EUN HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種用於解釋鼻造型術程序的預製鼻模型。預製鼻模型用於顯示根據鼻造型術程序中鼻子外觀的變化。預製鼻模型包括具有前表面的主體，該前表面提供有鼻骨對應部，該主體具有在鼻骨對應部的下側邊上提供的貫通空間；耦接至貫通空間的固定體；上側鼻軟骨對應部，其在上側鼻軟骨對應部被支撐在固定體上時從主體向前突出，並且定位在鼻骨對應部的下部處；及安裝在上側鼻軟骨對應部的下側邊上的下側鼻軟骨對應部，使得下側鼻軟骨對應部的位置能被調整。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Proposed is a prefabricated nose model for explaining a rhinoplasty procedure. The prefabricated nose model is used to show a change in the appearance of the nose according to the rhinoplasty procedure. The prefabricated nose model includes a main body having a front surface provided with a nasal bone corresponding portion and having a penetration space provided on a lower side of the nasal bone corresponding portion, a fixing body detachably coupled to the penetration space, an upper lateral cartilage corresponding portion which protrudes forward from the main body while being supported on the fixing body and which is positioned at a lower portion of the nasal bone corresponding portion; and a lower lateral cartilage corresponding portion mounted on a lower side of the upper lateral cartilage corresponding portion such that a position of the lower lateral cartilage corresponding portion is capable of being adjusted.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:預製鼻模型</p>
        <p type="p">11:主體</p>
        <p type="p">11a:鼻骨對應部</p>
        <p type="p">21:固定柱</p>
        <p type="p">23:中心板</p>
        <p type="p">27:固定座蓋</p>
        <p type="p">31:上側鼻軟骨對應部</p>
        <p type="p">41:下側鼻軟骨對應部</p>
        <p type="p">a、b:箭頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="160" publication-number="202616040">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616040</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137780</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>筆記型手提電腦外接式強制對流冷卻系統</chinese-title>
        <english-title>EXTERNAL FORCED-CONVECTION COOLING SYSTEM FOR LAPTOP COMPUTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241217B">G06F1/20</main-classification>
        <further-classification edition="200601120241217B">F04D29/60</further-classification>
        <further-classification edition="200601120241217B">F04D27/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立高雄科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL KAOHSIUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊春陵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG,TSUN-LIRNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂家彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種筆記型手提電腦外接式強制對流冷卻系統，係用於對筆記型電腦產生強制對流達到冷卻效果，其包含有：一主體，該主體提供筆記型電腦架設，並且該主體內部安裝有至少一風扇，一控制模組與該風扇連線，並透過外接電源供應該風扇轉動，藉由該強制對流冷卻裝置對筆記型電腦產生強風，進而將筆記型電腦內部的熱量帶走，保持筆記型電腦工作效率與保護內部精密零件使用壽命。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An external forced-convection cooling system for laptop computers, which provides forced-convection to laptop computers in order to achieve the cooling effect, comprises a main body, wherein the main body provides the laptop a structure and has at least a fan disposed therewithin; a control module is connected with the fan that rotates by the power of an external power supply. The forced-convection cooling device generates strong wind toward the laptop and expels heat within the laptop computer to outside, thus to maintain the operational efficiency and to protect the lifetime of internal precision parts of the laptop computer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:本體</p>
        <p type="p">11:容置空間</p>
        <p type="p">12:進氣口</p>
        <p type="p">13:排氣口</p>
        <p type="p">20:支架</p>
        <p type="p">30:風扇</p>
        <p type="p">40:控制模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="161" publication-number="202616599">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616599</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137781</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自舉電路的靜電放電電路以及使用其之積體電路</chinese-title>
        <english-title>ELECTROSTATIC DISCHARGE CIRCUIT FOR BOOTSTRAP CIRCUIT AND INTEGRATED CIRCUIT USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241101B">H02H9/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂智勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHIH-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的較佳實施例關於一種自舉電路的靜電放電電路以及使用其之積體電路。該電路包含高壓操作區和共接電壓端，其中高壓操作區包括自舉電容偏壓端、開關切換端和自舉二極體。靜電放電電路由第一、第二靜電放電電路、觸發電路和開關電路組成。在正常操作時，自舉二極體外圍區的高電壓使觸發電路輸出失能訊號，開關電路截止。當發生靜電放電時，自舉二極體外圍區無電荷，觸發電路輸出致能訊號，使開關電路導通，從而實現靜電保護功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The preferred embodiment of the present invention describes an electrostatic discharge circuit for bootstrap circuit and an integrated circuit using the same. The circuit includes a high-voltage operation area and a common voltage terminal, with the high-voltage area comprising a bootstrap capacitor bias terminal, a switch terminal, and a bootstrap diode. The static discharge circuit consists of first and second static discharge circuits, a trigger circuit, and a switch circuit. During normal operation, the high voltage in the peripheral area of the bootstrap diode causes the trigger circuit to output a disabled signal, keeping the switch circuit off. When static discharge occurs, the lack of charge in the peripheral area of the bootstrap diode prompts the trigger circuit to output an enable signal, turning on the switch circuit and thus achieving static protection functionality.</p>
      </isu-abst>
      <representative-img>
        <p type="p">VCC:積體電路電源電壓</p>
        <p type="p">HVA:高壓操作區</p>
        <p type="p">LVA:低壓操作區</p>
        <p type="p">VB:自舉電容偏壓端</p>
        <p type="p">SW:開關切換端</p>
        <p type="p">BD:自舉二極體</p>
        <p type="p">GND:共接電壓端</p>
        <p type="p">301:自舉二極體BD的外圍區</p>
        <p type="p">302:觸發電路</p>
        <p type="p">303:開關電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="162" publication-number="202616669">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616669</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137784</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>數位類比轉換系統以及數位類比轉換方法</chinese-title>
        <english-title>DIGITAL TO ANALOG CONVERSION SYSTEM AND DIGITAL TO ANALOG CONVERSION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">H03M1/66</main-classification>
        <further-classification edition="200601120250203B">H03M1/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂奎穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, KUEI-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃亮維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, LIANG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱鈺婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李育禎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種數位類比轉換系統，包含：一控制碼轉換電路，用根據一控制碼轉換表將一第一N位元控制碼轉換成一第一Y位元控制碼，Y大於或等於N；以及一DAC，用以接收該第一Y位元控制碼而輸出複數個DAC輸出電壓其中之一第一DAC輸出電壓，該些DAC輸出電壓的數目小於或等於        &lt;img align="absmiddle" height="15px" width="17px" file="ed10024.JPG" alt="ed10024.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A digital-to-analog conversion system, comprises: a control code conversion circuit for converting a first N-bit control code into a first Y-bit control code according to a control code conversion table, Y is greater than or equal to N; and a DAC , used to receive the first Y-bit control code and output a first DAC output voltage of a plurality of DAC output voltages; wherein a number of the DAC output voltages is less than or equal to        &lt;img align="absmiddle" height="15px" width="17px" file="ed10024.JPG" alt="ed10024.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:數位類比轉換系統</p>
        <p type="p">201:控制碼轉換</p>
        <p type="p">203,203_1:DAC</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="163" publication-number="202615296">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615296</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137792</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自行車後變速器</chinese-title>
        <english-title>BICYCLE REAR DERAILLEUR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120241105B">B62M9/126</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彥豪智能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEKTRO TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡蘭卓爾　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CALENDRILLE, JR.,L. JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自行車後變速器，用以裝設於一車架，包含一基座構件、一活動構件、一連桿組件、一鏈條導引構件及至少一調整構件。基座構件用以裝設於車架。連桿組件耦接於基座構件及活動構件。鏈條導引構件包含一架體組件、一第一導輪及一第二導輪，架體組件樞設於活動構件，第一導輪及第二導輪可轉動地設置於架體組件。調整構件設置於架體組件，以調整第一導輪及第二導輪之間的相對距離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bicycle rear derailleur is configured to be mounted on a bicycle frame. The bicycle rear derailleur includes a base component, a movable component, a linkage assembly, a chain guide and at least one adjustment component. The base component is configured to be mounted on the bicycle frame. The linkage assembly is coupled to the base component and the movable component. The chain guide includes a frame assembly, a first pulley and a second pulley. The frame assembly is pivotably disposed on the movable component. The first pulley and the second pulley are rotatably disposed on the frame assembly. The adjustment component is disposed on the frame assembly for adjusting a distance between the first pulley and the second pulley.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:鏈條導引構件</p>
        <p type="p">410:架體組件</p>
        <p type="p">411:第一架體</p>
        <p type="p">4111:螺合部</p>
        <p type="p">4112:螺孔</p>
        <p type="p">412:第二架體</p>
        <p type="p">420:第一導輪</p>
        <p type="p">430:第二導輪</p>
        <p type="p">500:調整構件</p>
        <p type="p">P1:樞轉軸線</p>
        <p type="p">P2:轉動軸線</p>
        <p type="p">D1,D2:方向</p>
        <p type="p">C:鏈條</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="164" publication-number="202614916">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614916</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137794</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合式植物生長監測系統</chinese-title>
        <english-title>COMPOSITE PLANT GROWTH MONITORING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250501B">A01G22/00</main-classification>
        <further-classification edition="200601120250501B">A01G9/24</further-classification>
        <further-classification edition="200601120250501B">G05B19/418</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中信金學校財團法人中信科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CTBC UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧宜裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡承恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, CHENG-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘恆堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, HENG-YAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, GUAN-ZHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凃威齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, WEI-CI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴天琮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種複合式植物生長監測系統包含複數個超音波監測模組、至少一生長因子供應模組及至少一控制裝置。超音波監測模組係模組化組接成至少一立體式超音波監測裝置，用以監測一植物在一三維空間中之每一維度之一生長狀態。生長因子供應模組係提供該植物所需之一生長因子。控制裝置係在該植物之一生長過程中，依據該立體式超音波監測裝置監測而得之該植物在該三維空間中之該每一維度之該生長狀態，對應地調整該植物所接收到之該生長因子，藉以使得該植物之該生長狀態符合一預設狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composite plant growth monitoring system comprises multiple ultrasonic monitoring modules, at least one growth factor supply module, and at least one control device. The ultrasonic monitoring modules are modularly assembled into at least one three-dimensional ultrasonic monitoring device, used to monitor the growth state of a plant in each dimension of a three-dimensional space. The growth factor supply module provides a growth factor required by the plant. During the plant’s growth process, the control device adjusts the growth factor received by the plant correspondingly, based on the growth state of the plant in each dimension of the three-dimensional space monitored by the three-dimensional ultrasonic monitoring device, so that the plant’s growth state meets a preset state.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:超音波監測模組</p>
        <p type="p">12:立體式超音波監測裝置</p>
        <p type="p">20:生長因子供應模組</p>
        <p type="p">30:控制裝置</p>
        <p type="p">40:氣流供應器</p>
        <p type="p">50:轉盤</p>
        <p type="p">100:植物</p>
        <p type="p">200:三維空間</p>
        <p type="p">X、Y、Z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="165" publication-number="202616298">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616298</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137803</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於腦波識別的人格特質分析方法</chinese-title>
        <english-title>A PERSONALITY TRAIT ANALYSIS METHOD BASED ON BRAINWAVES RECOGNITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120241128B">G16H50/20</main-classification>
        <further-classification edition="202101120241128B">A61B5/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立清華大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃植懋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIH-MAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪家筠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIA-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃緒文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSU-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳順吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SHUN-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基於腦波識別的人格特質分析方法，藉由一訊號連接一腦波感測單元的電腦裝置來實施，該腦波感測單元用於感測一受測者之大腦來產生並傳送多個關於該受測者之大腦的多個腦波訊號至該電腦裝置，並包含：(A) 藉由該電腦裝置，根據來自該腦波感測單元的該等腦波訊號，獲得多筆目標腦波特徵；(B) 藉由該電腦裝置，根據該等目標腦波特徵，利用一人格特質分析模型，獲得每一種人格特質所對應的一分類結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A personality trait analysis method based on brainwaves recognition is implemented by a computer device connected with a brainwave sensing unit. The brainwave sensing unit is used to sense a subject's brain to generate and transmit a plurality of brainwave signals to the computer device, including: (A) obtaining a plurality of target brainwave characteristics based on the brainwave signals;；(B) based on the target brainwave characteristics, a personality trait analysis model is used to obtain a classification result corresponding to each personality trait.</p>
      </isu-abst>
      <representative-img>
        <p type="p">701、702:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="166" publication-number="202615285">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615285</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137807</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自行車充電置物架</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120241213B">B62J11/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李燕瑟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李燕瑟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴雅韻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係在提供一種自行車充電置物架，主要係設有一太陽能板，該太陽能板之底部設有電源模組，該電源模組上設有USB插接孔，該太陽能板之一側設有照明器，該照明器與該電源模組電性連接，該太陽能板之另一側設有置物盒，該太陽能板之底部設有固定座，該固定座之底面設有凹弧面及數個螺孔，至少一定位件係組設於該固定座上，該定位件上設有與該固定座之凹弧面呈反向之弧面，該定位件上對應於該固定座上之螺孔位置設有穿孔，該定位件之穿孔內穿設有螺絲，該螺絲並螺鎖於該固定座之螺孔內，如此，將該充電置物架組設於自行車上，並藉由該太陽能板經該電源模組蓄電，其電源可輔助該照明器及手機等物品供電使用，且手機等物品可置放於該置物盒內，使用非常方便。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:太陽能板</p>
        <p type="p">2:電源模組</p>
        <p type="p">20:USB插接孔</p>
        <p type="p">3:風扇</p>
        <p type="p">4:照明器</p>
        <p type="p">5:置物盒</p>
        <p type="p">6:水瓶架</p>
        <p type="p">7:固定座</p>
        <p type="p">70:凹弧面</p>
        <p type="p">8:定位件</p>
        <p type="p">80:弧面</p>
        <p type="p">82:螺絲</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="167" publication-number="202615291">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615291</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137810</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自行車煞車碟盤</chinese-title>
        <english-title>BICYCLE BRAKE DISK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">B62L1/02</main-classification>
        <further-classification edition="200601120241105B">B62L5/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彥豪智能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEKTRO TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱恩良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, EN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHIA-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自行車煞車碟盤，用以裝設於一輪轂，包含一碟盤主體。碟盤主體具有一轉動軸線，碟盤主體包含一環形摩擦部及多個肋部，環形摩擦部環繞這些肋部，這些肋部相間隔地沿碟盤主體的周向方向排列，且這些肋部相對環形摩擦部沿平行轉動軸線的方向凹陷成形。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bicycle brake disk is configured to be mounted on a wheel hub. The bicycle brake disk includes a disk main body. The disk main body has a rotation axis. The disk main body includes an annular contact portion and a plurality of rib portions. The annular contact portion surrounds the rib portions. The rib portions are arranged along a circumferential direction and spaced apart from one another. The rib portions are recessed relative to the annular contact portion along a direction parallel to the rotation axis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:自行車煞車碟盤</p>
        <p type="p">10:碟盤主體</p>
        <p type="p">11:環形摩擦部</p>
        <p type="p">12:肋部</p>
        <p type="p">13:連接部</p>
        <p type="p">14:第一內環部</p>
        <p type="p">15:第二內環部</p>
        <p type="p">16:安裝部</p>
        <p type="p">161:穿孔</p>
        <p type="p">20:塗層</p>
        <p type="p">P:轉動軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="168" publication-number="202615280">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615280</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137826</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>駕駛人分心識別系統</chinese-title>
        <english-title>DRIVER DISTRACTION RECOGNITION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120241031B">B60W40/08</main-classification>
        <further-classification edition="201201120241031B">B60W40/09</further-classification>
        <further-classification edition="202001120241031B">B60W50/14</further-classification>
        <further-classification edition="202201120241031B">G06V20/59</further-classification>
        <further-classification edition="202201120241031B">G06V40/18</further-classification>
        <further-classification edition="202201120241031B">G06V40/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺北科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾明桉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, MING-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翟崧雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAI, SUNG-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許嘉醇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIA-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝明鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, MING-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃上睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHANG-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳楷翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KAI-SIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張竣皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JUN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張芷瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, ZHI-XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種駕駛人分心識別系統及其方法，包含攝影機，拍攝駕駛人的眼部，進而獲取駕駛人的視線方向資訊；紅外線陣列感測器，偵測駕駛人的眼球位置，進行眼動追蹤，獲取駕駛人的眼球移動資訊；車用電腦，設有心率計算模組，透過結合視線方向資訊，以及眼球移動資訊，生成眼動範圍後，運用演算法以及心率計算模組，判斷眼動範圍是否超出警戒區域以及該駕駛人的精神狀態；第一傳輸模組；以及第二傳輸模組；其中第一傳輸模組與紅外線陣列感測器以及車用電腦連接；其中第二傳輸模組與車用電腦以及攝影機連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a driver distraction recognition system and method thereof, comprising a camera, an infrared array sensor, a vehicle computer, a first transmission module, and a second transmission module. The camera captures the driver's eyes to obtain the driver's gaze direction information. The infrared array sensor detects the driver's eye position and performs eye tracking to obtain the driver's eye movement information. The vehicle computer is equipped with a heart rate calculation module. By combining the gaze direction information and eye movement information, after generating the eye movement range, the algorithm and the heart rate calculation module are used to determine whether the eye movement range exceeds the warning area and the driver's mental state. The first transmission module is connected to the infrared array sensor and the vehicle computer; and the second transmission module is connected to the vehicle computer and the camera.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:紅外線陣列感測器</p>
        <p type="p">11:第一串行傳輸器</p>
        <p type="p">12:第一單晶片系統</p>
        <p type="p">2:第一傳輸模組</p>
        <p type="p">21:第一乙太網路</p>
        <p type="p">22:第一相機串行接口</p>
        <p type="p">23:第一序列匯流排</p>
        <p type="p">3:車用電腦</p>
        <p type="p">31:中央處理單元</p>
        <p type="p">32:圖像處理單元</p>
        <p type="p">33:記憶體</p>
        <p type="p">4:第二傳輸模組</p>
        <p type="p">41:第二乙太網路</p>
        <p type="p">42:第二相機串行接口</p>
        <p type="p">43:第二通用序列匯流排</p>
        <p type="p">5:攝影機</p>
        <p type="p">51:第二串行傳輸器</p>
        <p type="p">52:第二單晶片系統</p>
        <p type="p">53:感測器</p>
        <p type="p">54:嵌入式視覺技術</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="169" publication-number="202615081">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615081</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137832</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>咖啡膠囊</chinese-title>
        <english-title>COFFEE CAPSULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241106B">A61K36/74</main-classification>
        <further-classification edition="201501120241106B">A61K35/741</further-classification>
        <further-classification edition="201501120241106B">A61K35/742</further-classification>
        <further-classification edition="200601120241106B">A61K9/48</further-classification>
        <further-classification edition="200601120241106B">A61P3/04</further-classification>
        <further-classification edition="200601120241106B">A47J31/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長瑩生技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPACE ARK BIOMEDICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張瑞仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JUI-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃介辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIEH-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣恩沛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, EN-PEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種咖啡膠囊，包含一上蓋、一殼體以及一咖啡組成物。殼體與上蓋耦合，其中殼體包含一容置空間及一過濾組件，且過濾組件設置於容置空間中。咖啡組成物設置於容置空間中，且咖啡組成物包含一咖啡粉末、一丁酸梭菌粉末及一凝結芽孢桿菌粉末。本發明同時提供一種咖啡膠囊的用途，其係用以製備一咖啡飲品，其中咖啡飲品係用以在一個體中治療或預防肥胖。藉此，透過飲用本發明之咖啡膠囊所製備而得的咖啡飲品可以幫助使用者腸胃蠕動，而有預防肥胖的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a coffee capsule including a top cover, a case element and a coffee composition. The case element is coupled to the top cover, wherein the case element includes an accommodating space and a filtering set, and the filtering set is disposed in the accommodating space. The coffee composition is disposed in the accommodating space and includes a coffee powder, a        &lt;i&gt;Clostridium butyricum&lt;/i&gt;powder and a        &lt;i&gt;Bacillus coagulans&lt;/i&gt;powder. The present disclosure also provides a use of the coffee capsule which is for preparing a coffee drink, wherein the coffee drink is used to treat or prevent the obesity in an organism. Therefore, by drinking the coffee drink made from the coffee capsule of the present disclosure, it is favorable for facilitating the gastrointestinal motility of the subject and has the ability to prevent from the obesity.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:咖啡膠囊</p>
        <p type="p">110:上蓋</p>
        <p type="p">120:殼體</p>
        <p type="p">121:容置空間</p>
        <p type="p">122:過濾組件</p>
        <p type="p">123:孔洞</p>
        <p type="p">124:加壓過濾件</p>
        <p type="p">125:反壓過濾件</p>
        <p type="p">130:咖啡組成物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="170" publication-number="202615789">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615789</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137849</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液冷裝置之浮動式連接器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">F16L25/08</main-classification>
        <further-classification edition="200601120241105B">F16L25/14</further-classification>
        <further-classification edition="200601120241105B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恒昌行精密工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANWIT PRECISION INDUSTRIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾英智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YING-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李毓庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張朝坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種液冷裝置之浮動式連接器，包括：一外殼，其內部具有一容置調整空間，該容置調整空間前端形成有一開口且於其後端形成有一穿孔，而該容置調整空間於鄰近該開口處形成有一斜向內壁；一浮動模組，穿設於該容置調整空間中，該浮動模組包括有一接頭且該接頭內部具有一液體流道，位於該接頭中間處之基部前、後端各形成有定位於該開口中之對接部及定位於該穿孔中之定位部，於該定位部外側套設有兩端抵持於該基部及該外殼處之一彈性件，而該接頭於該基部與該對接部之間形成有藉由該彈性件於伸展狀態時抵持於該斜向內壁之一導斜環部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:外殼</p>
        <p type="p">101:開口</p>
        <p type="p">11:座體</p>
        <p type="p">111:組裝部</p>
        <p type="p">1111:固定槽</p>
        <p type="p">12:擋板</p>
        <p type="p">120:穿孔</p>
        <p type="p">121:本體</p>
        <p type="p">122:側板</p>
        <p type="p">1220:透孔</p>
        <p type="p">2:浮動模組</p>
        <p type="p">21:接頭</p>
        <p type="p">210:液體流道</p>
        <p type="p">211:基部</p>
        <p type="p">212:對接部</p>
        <p type="p">2121:操作面</p>
        <p type="p">213:定位部</p>
        <p type="p">2131:環溝</p>
        <p type="p">214:導斜環部</p>
        <p type="p">22:彈性件</p>
        <p type="p">3:緊固件</p>
        <p type="p">4:擋止件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="171" publication-number="202615798">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615798</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137852</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使燃煤電廠煙囪不白煙之煙氣餘熱回收最佳化方法</chinese-title>
        <english-title>OPTIMIZATION METHOD FOR WASTE HEAT RECOVERY OF FLUE GAS FROM THE CHIMNEY OF COAL-FIRED POWER PLANTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">F23J15/00</main-classification>
        <further-classification edition="200601120241105B">F23G5/46</further-classification>
        <further-classification edition="200601120241105B">F01K27/02</further-classification>
        <further-classification edition="200601120241105B">F02G5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國家原子能科技研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL ATOMIC RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡相明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, HSIANG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫士文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, SHYH-WERN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐奉璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種使燃煤電廠煙囪不白煙之煙氣餘熱回收最佳化方法，係能夠根據本方法之即時計算結果，同時精確控制餘熱回收量以及排煙溫度，達成節能減碳的目標，並且適用於任何種類之煙氣餘熱回收設備；另外，為克服煙囪過高而裝設量測設備不易的問題，本發明亦應用AI機械學習技術，開發煙氣在煙囪排放過程中的溫度損失預測方法，使得排煙溫度得以精準控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optimization method for the recovery of flue gas waste heat from the chimney of a coal-fired power plant is based on the real-time calculation results of this method, and the amount of waste heat recovery and exhaust gas temperature can be accurately controlled at the same time, so as to achieve the goal of energy conservation and carbon reduction, and is applicable to any kind of flue gas waste heat recovery equipment; In addition, in order to overcome the problem that the chimney is too high and it is not easy to install measuring equipment, the present invention also applies AI machine learning technology to develop a temperature loss prediction method for flue gas in the process of chimney discharge, so that the exhaust gas temperature can be accurately controlled.</p>
      </isu-abst>
      <representative-img>
        <p type="p">s1~s4:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="172" publication-number="202614973">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614973</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137853</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>手術裝置</chinese-title>
        <english-title>SURGICAL DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241101B">A61B17/00</main-classification>
        <further-classification edition="201601120241101B">A61B90/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康健生醫科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED MEDICAL DESIGN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉延銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, YEN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游秉聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, PING-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種手術裝置，包含一殼體、一電路組件、一驅動元件、一刀具以及一輸入組件。電路組件設置於殼體中。驅動元件設置於殼體中並電性連接於電路組件。刀具連接於驅動元件並用以受驅動元件驅動。刀具從殼體的一第一端部凸出。輸入組件包含一銘版及至少一按鍵開關。至少一按鍵開關設置於銘版中並電性連接於電路組件。銘版設置於殼體並暴露於外。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A surgical device including a housing, a circuit assembly, a driving component, a tool and an input assembly. The circuit assembly is disposed in the housing. The driving component is disposed in the housing and electrically connected to the circuit assembly. The tool is connected to the driving component and configured to be driven thereby. The tool extends out of a first end part of the housing. The input assembly includes a nameplate and a lest one button device. The button device is disposed in the nameplate and electrically connected to the circuit assembly. The nameplate is disposed on the housing and exposed to the outside.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:手術裝置</p>
        <p type="p">100:殼體</p>
        <p type="p">110:第一端部</p>
        <p type="p">120:第二端部</p>
        <p type="p">400:刀具</p>
        <p type="p">410:外管</p>
        <p type="p">411:缺口</p>
        <p type="p">420:刀頭</p>
        <p type="p">450:前蓋</p>
        <p type="p">500:輸入組件</p>
        <p type="p">510:銘版</p>
        <p type="p">520:按鍵開關</p>
        <p type="p">530:發光元件</p>
        <p type="p">700:組裝筒</p>
        <p type="p">830:第二線纜部</p>
        <p type="p">840:墊片部</p>
        <p type="p">20:外部電源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="173" publication-number="202616828">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616828</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137858</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>快閃記憶體裝置及其形成方法</chinese-title>
        <english-title>FLASH MEMORY DEVICE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241101B">H10B41/30</main-classification>
        <further-classification edition="202301120241101B">H10B41/35</further-classification>
        <further-classification edition="202301120241101B">H10B43/30</further-classification>
        <further-classification edition="202301120241101B">H10B43/35</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許漢輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HAN-HUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種快閃記憶體裝置及其形成方法，形成方法包括提供基底；於基底上形成穿隧介電層；於穿隧介電層上形成多個堆疊結構，各堆疊結構包括浮置閘極以及位於浮置閘極上的遮罩圖案；進行第一蝕刻製程，於基底中形成多個第一溝槽；進行第二蝕刻製程，移除從第一溝槽暴露出來的部分基底，於基底中形成多個第二溝槽；全面性形成介電材料。介電材料填充第二溝槽，且覆蓋堆疊結構；移除位於各浮置閘極的第一頂面和第一側面上的遮罩圖案以及介電材料。剩餘的介電材料在第二溝槽中形成多個隔離部件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A flash memory device and a forming method of this invention are provided. The method includes providing a substrate; forming a tunneling dielectric layer on the substrate; and forming stacked structures on the tunneling dielectric layer. Each of the stacked structures includes a floating gate and a mask pattern located on the floating gate. The method further includes performing a first etching process to form first trenches in the substrate; performing a second etching process to remove a portion of the substrate exposed from the first trenches to form second trenches in the substrate; and entirely forming a dielectric material. The dielectric material fills the second trenches and covers the stacked structures. The method further includes removing the mask pattern and the dielectric material on a first top surface and a first side surface of each of the floating gates. The remaining dielectric material forms isolation features in the second trenches.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100,110,120:方向</p>
        <p type="p">200:基底</p>
        <p type="p">200M2:高台</p>
        <p type="p">200M2B:底部</p>
        <p type="p">200M2T,214R3T,224R2T:頂面</p>
        <p type="p">200M2S,206PS:側面</p>
        <p type="p">202P:穿隧介電圖案</p>
        <p type="p">206PB:底面</p>
        <p type="p">206P:浮置閘極</p>
        <p type="p">214R3:絕緣間隔物</p>
        <p type="p">224R2:隔離部件</p>
        <p type="p">228:閘極介電層</p>
        <p type="p">230:控制閘極層</p>
        <p type="p">500:快閃記憶體裝置</p>
        <p type="p">L1,L2:橫向尺寸</p>
        <p type="p">A1:底角</p>
        <p type="p">θ2:夾角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="174" publication-number="202615671">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615671</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137865</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>銅銀合金製的箔材及銅銀合金製的箔材的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241217B">C22C9/00</main-classification>
        <further-classification edition="200601120241217B">B32B15/20</further-classification>
        <further-classification edition="200601120241217B">C22F1/08</further-classification>
        <further-classification edition="200601120241217B">H01B1/02</further-classification>
        <further-classification edition="200601120241217B">H01B13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＳＷＣＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SWCC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新井龍一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, RYUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大達剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ODACHI, GO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邊璃久也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, RIKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小泉勉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOIZUMI, TSUTOMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">箔材為含有10質量%～20質量%的銀且剩餘部分為銅及不可避免的雜質的銅銀合金製。軋製直角方向上箔材的拉伸強度超過1250 MPa。箔材的導電率為50%IACS以上。軋製直角方向上箔材的維氏硬度為300 HV以上。自軋製直角方向觀察到的剖面中的箔材的剪切帶面積率為40%～70%的範圍內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:箔材</p>
        <p type="p">ND:軋製面法線方向(法線方向)</p>
        <p type="p">RD:軋製處理方向(軋製方向)</p>
        <p type="p">TD:軋製直角方向(橫向)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="175" publication-number="202614978">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614978</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137872</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>拇指外翻手術用之骨板結構</chinese-title>
        <english-title>BONE PLATE STRUCTURE FOR HALLUX VALGUS SURGERY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241106B">A61B17/58</main-classification>
        <further-classification edition="200601120241106B">A61B17/76</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>必應科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BING TECHNOLOGY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳亞恬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YA-TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳心慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HSIN-TZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒純忻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃大維</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種拇指外翻手術用之骨板結構，其具有連接端、蹠骨遠端固定端、蹠骨近端外部固定端以及蹠骨近端內部固定端；所述蹠骨遠端固定端與所述蹠骨近端內部固定端位於同一平面，所述連接端之一側垂直地或非垂直地設置於所述蹠骨遠端固定端與所述蹠骨近端內部固定端之間，而所述蹠骨近端外部固定端則垂直地或非垂直地設置於所述連接端之另一側並與所述蹠骨近端內部固定端平行或成角度。藉由所述蹠骨近端外部固定端以及所述蹠骨近端內部固定端分別固定於蹠骨之外部及內部，可達到較佳之固定效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a bone plate structure for hallux valgus surgery, which has a connecting end, a metatarsal bone distal fixed end, a metatarsal bone proximal external fixed end and a metatarsal bone proximal internal fixed end. The metatarsal bone distal fixed end and the metatarsal bone proximal internal fixed end are located on the same plane, one side of the connecting end is vertically or non-vertically disposed between the metatarsal bone distal fixed end and the imetatarsal bone proximal internal fixed end, the metatarsal bone proximal external fixed end is disposed vertically or non-vertically on the other side of the connecting end and parallel or angled to the metatarsal bone proximal internal fixed end. By fixing the metatarsal bone proximal external fixed end and the metatarsal bone proximal internal fixed end respectively to the exterior and interior of the metatarsal bone, a better fixing effect can be achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:骨板結構</p>
        <p type="p">2:連接端</p>
        <p type="p">3:蹠骨遠端固定端</p>
        <p type="p">4:蹠骨近端外部固定端</p>
        <p type="p">5:蹠骨近端內部固定端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="176" publication-number="202615765">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615765</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137873</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可變汽門揚程搖臂裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">F01L1/18</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯國昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>基隆市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯國昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊延壽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可使引擎在低速與高速運轉狀態下，獲得最適動力之運用的可變汽門揚程搖臂裝置。其特徵包括：第一搖臂，設於汽缸頭上的軸接管，一側延伸有二懸臂，另側有連接凸肋；第二搖臂，與第一搖臂樞接，具有第一、第二樞耳及滾輪，能與凸輪軸連動；搖臂連接軸，穿設於第二搖臂與連接凸肋，使第二搖臂能作動；揚程調節裝置，位於第一、第二搖臂間頂端，包括第一、第二調節座、桿體及彈性元件；連結座，具有可往復位移的連結桿；以及控制閥，具有可伸縮的驅動桿，驅動桿可通過控制閥的控制而進行內縮或外推至連結桿，以頂推連結桿至桿體之通孔處；藉此，通過控制閥調節第二搖臂的作動範圍，使引擎能在不同負載和轉速下實現最佳反應，達成汽門揚程的變化，提高引擎效率和動力輸出。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:第一搖臂</p>
        <p type="p">11:軸接管</p>
        <p type="p">12:懸臂</p>
        <p type="p">121:間隙調整件</p>
        <p type="p">1211:螺栓</p>
        <p type="p">1212:螺帽</p>
        <p type="p">122:補強肋</p>
        <p type="p">2:第二搖臂</p>
        <p type="p">21:第一樞耳</p>
        <p type="p">23:滾輪</p>
        <p type="p">3:搖臂連接軸</p>
        <p type="p">4:揚程調節裝置</p>
        <p type="p">41:第一調節座</p>
        <p type="p">42:第二調節座</p>
        <p type="p">43:桿體</p>
        <p type="p">431:通孔</p>
        <p type="p">44:彈性元件</p>
        <p type="p">5:連結座</p>
        <p type="p">51:連結桿</p>
        <p type="p">6:控制閥</p>
        <p type="p">61:驅動桿</p>
        <p type="p">7:限位件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="177" publication-number="202615331">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615331</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137886</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>油類用品置放裝置</chinese-title>
        <english-title>OIL FLOW/ STORAGE APPLIANCE PLACEMENT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120241105B">B67D7/40</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立晏企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIH YANN INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖伯霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, PO-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種油類用品置放裝置，其包括：一置放件、至少一支撐件及至少一磁性件。該置放件圍構有一內部空間，該內部空間供一油類用品插接；該至少一支撐件可分離地連接該置放件；該至少一磁性件定位於該至少一支撐件以供磁吸於一可被磁吸體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An oil flow/ storage appliance placement device is provided, including a placement component, at least one support component, and at least one magnetic component. The placement component defines an internal space, and the internal space is configured to receive an oil flow/ storage appliance. The at least one support component is detachably connected to the placement component. The at least one magnetic component is positioned on the at least one support component, allowing it to magnetically attach to a magnetically attractable object.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:置放件</p>
        <p type="p">3:連結部</p>
        <p type="p">41:第一支撐件</p>
        <p type="p">411:組接孔</p>
        <p type="p">42:第二支撐件</p>
        <p type="p">7:夾角</p>
        <p type="p">8:油類用品</p>
        <p type="p">91:可被磁吸體</p>
        <p type="p">911:平坦面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="178" publication-number="202616301">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616301</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137887</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>車用導線及車用電路系統</chinese-title>
        <english-title>VEHICLE CABLE AND VEHICLE CIRCUIT SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">H01B5/02</main-classification>
        <further-classification edition="200601120241105B">B62L1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拓肯興業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKEN PRODUCTS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鼎鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, DING JIUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種車用導線，包括：一導管，包括一外表面；至少一導電線路，延伸於該導管之外表面，且與該導管之間電性絕緣；及一外覆層，於該導管之外表面上覆蓋該至少一導電線路，且與該至少一導電線路之間電性絕緣。本發明另提供一種車用電路系統，包括一如上所述的車用導線，另包括：一穿刺式接頭，扣接於該車用導線，包括至少一穿刺接端及一聯外電性接端，該至少一穿刺接端穿過該外覆層且與該至少一導電線路電性連接，該聯外電性接端電性連接該至少一穿刺接端且供電性連接至一外部電子裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A vehicle cable is provided, including: a conduit including an outer surface; at least one conductive line extending on the outer surface of the conduit and electrically insulated from the conduit; and an outer coating on the conduit, covering the at least one conductive line and electrically insulated from the at least one conductive line. A vehicle circuit system is provided, including: the vehicle cable; and a piercing connector connected to the vehicle cable and including at least one piercing terminal and an external conducting terminal, the at least one piercing terminal piercing through the outer coating and electrically connected to the at least one conductive line, the external conducting terminal being electrically connected to the at least one piercing terminal and configured to be electrically connected to an external electronic device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:車用導線</p>
        <p type="p">10:導管</p>
        <p type="p">30:外覆層</p>
        <p type="p">40:穿刺式接頭</p>
        <p type="p">42:聯外電性接端</p>
        <p type="p">100:車用電路系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="179" publication-number="202616525">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616525</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137888</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241011B">H01L23/60</main-classification>
        <further-classification edition="202001120241011B">G06F30/392</further-classification>
        <further-classification edition="202001320241011B">G06F113/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鼎堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐天浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, TIEN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李日參</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JIH-SAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李卿瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體裝置。半導體裝置包含基板、在基板中的源極區、在基板中的汲極區、在基板上的閘極結構、以及在基板中的第一井區。汲極區具有面向源極區的汲極側壁。閘極結構介於源極區與汲極區之間。閘極結構具有面向汲極區的第一閘極側壁。第一井區在汲極區下方。第一井區具有面向源極區的井區側壁。第一閘極側壁與汲極側壁之間的第一距離小於或等於第一閘極側壁與井區側壁之間的第二距離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Semiconductor devices are provided. The semiconductor device includes a substrate, a source region in the substrate, a drain region in the substrate, a gate structure on the substrate, and a first well in the substrate. The drain region has a drain sidewall facing toward the source region. The gate structure is between the drain region and the source region. The gate structure has a first gate sidewall facing toward the drain region. The first well is underneath the drain region. The first well has a well sidewall facing toward the source region. A first distance between the first gate sidewall and the drain sidewall is less than or equal to a second distance between the first gate sidewall and the well sidewall.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體裝置</p>
        <p type="p">10E,10E’:靜電放電保護結構</p>
        <p type="p">10S:基板</p>
        <p type="p">102:深井區</p>
        <p type="p">104:第三井區</p>
        <p type="p">112a,112b:閘極結構</p>
        <p type="p">112S1:第一閘極側壁</p>
        <p type="p">112S2:第二閘極側壁</p>
        <p type="p">114a,114b:源極區</p>
        <p type="p">116:汲極區</p>
        <p type="p">116L:下表面</p>
        <p type="p">116S:汲極側壁</p>
        <p type="p">118a,118b,120,122:摻雜區</p>
        <p type="p">132:第一井區</p>
        <p type="p">132S:井區側壁</p>
        <p type="p">134a,134b:第二井區</p>
        <p type="p">136:第四井區</p>
        <p type="p">138:第五井區</p>
        <p type="p">141,143:隔離結構</p>
        <p type="p">151a,151b:間隔元件</p>
        <p type="p">160,162:保護環</p>
        <p type="p">D1:第一距離</p>
        <p type="p">D2:第二距離</p>
        <p type="p">D3:第三距離</p>
        <p type="p">D4:第四距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="180" publication-number="202616851">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616851</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137908</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體元件及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10D30/60</main-classification>
        <further-classification edition="202501120250102B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘欽寒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, CHIN-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童禹謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG, YU-MOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提出一種半導體元件及其製造方法。所述半導體元件包含基板，具有第一導電型；井區，具有第二導電型，以及位於所述基板中；基體，具有所述第一導電型，以及位於所述井區中；源極區，位於所述基體中；汲極區，位於所述井區中；隔離結構，位於所述井區上；閘極結構，位於所述隔離結構的頂面的第一部份上，以及位於所述源極區及所述汲極區間，其中：所述隔離結構的底面包含至少一凸起結構，所述至少一凸起結構朝向遠離所述井區的方向凸起，以及所述井區包含對應於所述至少一凸起結構的凸起井區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a semiconductor device and a method of manufacturing the same. The semiconductor device includes a substrate having a first conductivity type; a well region having a second conductivity type and located in the substrate; a base body having the first conductivity type and located in the well region; a source region located in the base body; a drain region located in the well region; an isolation structure located on the well region; and a gate structure located on a first part of a top surface of the isolation structure and located between the source region and the drain region, wherein: a bottom surface of the isolation structure includes at least one concave structure, the at least one concave structure being concave toward a direction away from the well region, and the well region includes a concave well region corresponding to the at least one concave structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體元件</p>
        <p type="p">100:基板</p>
        <p type="p">102:井區</p>
        <p type="p">110:閘極結構</p>
        <p type="p">120:源極區</p>
        <p type="p">124:基體</p>
        <p type="p">130:汲極區</p>
        <p type="p">170:隔離結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="181" publication-number="202616477">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616477</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137912</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體超薄堆疊結構的製造方法</chinese-title>
        <english-title>METHOD FOR MANUFACTURING SEMICONDUCTOR STACK STRUCTURE WITH ULTRA THIN DIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">H01L21/98</main-classification>
        <further-classification edition="200601120241104B">H01L21/768</further-classification>
        <further-classification edition="200601120241104B">H01L21/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商奈興科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEXTHIN TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱志威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, TZU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉人豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, JEN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體超薄堆疊結構的製造方法，包含製造半導體晶圓，其在半導體基板內形成有由離子佈植形成的停止層結構，將半導體基板分為基板第一部分及基板第二部分，半導體基板形成有磊晶層、主動層及重布線層。在一個半導體晶圓的重布線層上接合承載板，且移除基板第二部分及停止層結構，以顯露基板第一部分，在其上穿設晶圓導電結構且連接至重布線層，經由薄化基板第一部分，使晶圓導電結構突出。形成接合介電層覆蓋晶圓導電結構，經由薄化以顯露晶圓導電結構。在另一個半導體晶圓的重布線層上形成具導電柱的接合層，並切單以形成多批半導體晶片。將一批半導體晶片的接合層以混合鍵合接合在接合介電層上，且導電柱與晶圓導電結構電性連接。以封裝膠體包覆半導體晶片。經由移除製程以顯露半導體晶片的基板第一部分，並於其上穿設晶片導電結構且連接至重布線層，經由薄化基板第一部分使晶片導電結構突出。形成另一接合介電層覆蓋晶片導電結構，並經由薄化以顯露晶片導電結構，以供進行下一批半導體晶片的接合堆疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for manufacturing a semiconductor stack structure with ultra thin dies, including manufacturing a plurality of semiconductor wafers, wherein a stop layer structure formed by ion implantation is formed in each semiconductor substrate to divide the semiconductor substrate into a first substrate part and a second substrate part, and an epitaxial layer, an active layer and a redistribution layer are formed on the semiconductor substrate. A carrier board is bonded to the redistribution layer of one of the semiconductor wafers, then the second substrate part and the stop layer structure are removed to expose the first substrate part, and then the wafer conductive structures are penetrated thereon and connected to the redistribution layer. By thinning the first substrate part, the wafer conductive structures are protruded, and then a bonding dielectric layer is formed to cover the wafer conductive structures and is thinned to expose the wafer conductive structure. A bonding layer with conductive pillars is formed on the redistribution layer of another semiconductor wafer, and a die sawing is performed to form a plurality of batches of dies. The bonding layers of a batch of dies are bonded to the bonding dielectric layer by using hybrid bonding technology, and the conductive pillars are electrically connected to the wafer conductive structures. An encapsulant is formed to cover the batch of dies, and the first substrate part of each die is exposed through a removal process. The die conductive structures are formed to penetrate the first substrate part and connect to the redistribution layer, and then the die conductive structures are protruded from the first substrate part by thinning the first substrate part. Another bonding dielectric layer is formed to cover the die conductive structures and is thinned to expose the die conductive structures for bonding and stacking of the next batch of dies.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2000a:第一批半導體晶片</p>
        <p type="p">2000b:第二批半導體晶片</p>
        <p type="p">2000c:第三批半導體晶片</p>
        <p type="p">123’:基板第一部分</p>
        <p type="p">16:磊晶層</p>
        <p type="p">18:主動層</p>
        <p type="p">20:重布線層</p>
        <p type="p">22b:第一接合層</p>
        <p type="p">40:導電柱</p>
        <p type="p">42b:第二封裝膠體</p>
        <p type="p">42c:第三封裝膠體</p>
        <p type="p">44a:第一晶片導電結構</p>
        <p type="p">44b:第二晶片導電結構</p>
        <p type="p">44c:第三晶片導電結構</p>
        <p type="p">46’:第二接合介電層</p>
        <p type="p">48、48’:第三接合介電層</p>
        <p type="p">50、50’:第四接合介電層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="182" publication-number="202615112">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615112</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137919</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微針貼片及其製造方法</chinese-title>
        <english-title>MICRONEEDLE PATCH AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250122B">A61M37/00</main-classification>
        <further-classification edition="200601120250122B">A61K9/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達運精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DARWIN PRECISIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉伊真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種微針貼片及其製造方法。微針貼片包含一微針層。微針層上具有總面積，且在微針層上包含第一區域。第一區域具有第一面積小於等於總面積。微針層之材料包含生物相容性材料以及感溫變色材料、感光變色材料、溫致變色物、光致變色物或其組合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A microneedle patch and a manufacturing method thereof. The Microneedle patch comprises a microneedle layer. The microneedle layer has a total area, and the microneedle layer has a first region. The first region has a first area less than or equal to the total area. The material of the microneedle layer comprises the biocompatible material, the thermochromic material, the photochromic material, a thermochromic material-induced reactant, a photochromic material-induced reactant or a combination thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110~S150:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="183" publication-number="202615314">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615314</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137924</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水族活體用雙色袋之製造方法及其雙色袋</chinese-title>
        <english-title>METHOD FOR MANUFACTURING DUAL-COLOR BAG FOR AQUATIC LIVE ORGANISMS AND DUAL-COLOR BAG</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241031B">B65D85/50</main-classification>
        <further-classification edition="200601120241031B">A01K63/02</further-classification>
        <further-classification edition="200601120241031B">B65D81/00</further-classification>
        <further-classification edition="200601120241031B">B65D81/18</further-classification>
        <further-classification edition="201701120241031B">A01K63/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡敏輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MIN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡敏輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MIN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種水族活體用雙色袋，其沿一軸向區分成一透光區及一相鄰的不透光區，透光區具有一開口邊，不透光區具有一封閉邊，開口邊與封閉邊對應隔開設置；水族活體用雙色袋沿垂直於軸向的方向對稱設置兩封合線，兩封合線分別一端延伸連接至開口邊，另一端弧形延伸連接至封閉邊，且兩封合線外側具有一第一裁切邊及一第二裁切邊，第一裁切邊及第二裁切邊分別連接於開口邊與封閉邊。本申請透過雙色袋能夠提供水族活體運輸包裝，避免水族活體受到外在影響而驚嚇損傷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a dual-color bag for aquatic live organisms. The bag is divided along an axial direction into a translucent zone and an adjacent opaque zone. The translucent zone has an open edge, and the opaque zone has a closed edge. The open edge and the closed edge are arranged opposite to each other. The dual-color bag has two sealing lines symmetrically disposed along a direction perpendicular to the axial direction. One end of each sealing line is extended to connect to the open edge, and the other end is arcuately extended to connect to the closed edge. The outer side of each sealing line has a first cut edge and a second cut edge, respectively connecting to the open edge and the closed edge. The present application provides transportation packaging for aquatic live organisms through the dual-color bag, preventing the aquatic live organisms from being frightened and damaged by external influences.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:水族活體用雙色袋</p>
        <p type="p">11:透光區</p>
        <p type="p">12:不透光區</p>
        <p type="p">14:封合線</p>
        <p type="p">141:直段部</p>
        <p type="p">142:弧段部</p>
        <p type="p">15:封閉邊</p>
        <p type="p">16:第一裁切邊</p>
        <p type="p">17:第二裁切邊</p>
        <p type="p">18:容置空間</p>
        <p type="p">181:弧形槽</p>
        <p type="p">200:水族活體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="184" publication-number="202616300">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616300</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137929</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>耗電量估算系統及耗電量估算方法</chinese-title>
        <english-title>POWER CONSUMPTION ESTIMATION SYSTEM AND POWER CONSUMPTION ESTIMATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250226B">G16Y20/30</main-classification>
        <further-classification edition="202001120250226B">G16Y40/20</further-classification>
        <further-classification edition="201901120250226B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱以誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, YI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃雅泙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YA-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊謹萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, CHIN-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種耗電量估算系統及耗電量估算方法。耗電量估算系統包括儲存媒體以及處理器。處理器耦接儲存媒體。儲存媒體儲存耗電量資料庫及多個模組。耗電量資料庫儲存多筆歷史耗電資料。多個模組包括狀態監控模組以及耗電估算模型。處理器存取和執行多個模組。狀態監控模組自網路設備接收即時狀態資料，並基於即時狀態資料產生狀態特徵值。耗電估算模型基於狀態特徵值生成耗電估計資料，並輸出耗電估計資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power consumption estimation system and a power consumption estimation method are provided. The power consumption estimation system includes a storage media and a processor. The processor is coupled to the storage media. The storage media stores a power consumption database and a plurality of modules. The power consumption database stores a plurality of historical power consumption data. The plurality of modules includes a status monitoring module and a power estimation model. The processor accesses and executes the plurality of modules. The status monitoring module receives a real-time status data from a network equipment and generates a status eigenvalue based in the real-time status data. The power estimation model generates a power estimation data based on the status eigenvalue and outputs the power estimation data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:耗電量估算系統</p>
        <p type="p">110:處理器</p>
        <p type="p">120:儲存媒體</p>
        <p type="p">121:耗電量資料庫</p>
        <p type="p">122:排程控制模組</p>
        <p type="p">123:狀態監測模組</p>
        <p type="p">124:耗電估算模型</p>
        <p type="p">125:異常偵測模型</p>
        <p type="p">126:事件告警模組</p>
        <p type="p">130:收發器</p>
        <p type="p">200:網路設備</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="185" publication-number="202615759">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615759</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137930</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙緩衝式防撞隔音條構造與設施</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">E04F13/075</main-classification>
        <further-classification edition="200601120241104B">E04F13/077</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣國際門框建材有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FORMOSA INTERNATIONAL DOORFRAME BUILDING MATERIALS CO; LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王國器</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAMG, KUO CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王國器</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAMG, KUO CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種框體之長條狀〝雙緩衝式 防撞隔音條構造與設施〞，係包括：一固定件可嵌入一門框之裝設防撞隔音條用溝槽中，該固定件設有一固定件平滑面，另一側設有逆鉤，該〝固定件基部加上逆鉤總寬度〞比門框之裝設氣密條用溝槽略為寬，逆鉤與其門框側壁有一適當角度，當該逆鉤插入裝設氣密條用溝槽中時，會向內彎曲形成一倒逆鉤如鯁在喉般抵住該溝槽壁不滑脫為度，該逆鉤之抵頂作用，使得其固定件之固定件平滑面，能夠緊貼住裝設氣密條用溝槽之另一側壁端，因頂住及塑膠澀性而不易滑脫，有一圓形氣囊緩衝件，連結固定件上，在該圓形氣囊緩衝件，其外側設一支弧形或直形長臂，生形成於該固定件之一側，該一圓形氣囊緩衝件，一外側設一支弧形或直形長臂，形成〝雙緩衝式 防撞隔音條構造〞，該雙緩衝式 防撞隔音條構造，其固定件用硬質塑膠製造，圓形氣囊緩衝件與弧形長臂或直形長臂，採用軟性塑膠製造之複合結構，該圓形氣囊緩衝件及延伸弧形長臂或直形長臂，外側設多數強化稜線，關門時先撞擊延伸弧形長臂，再壓迫圓形氣囊緩衝件，能夠雙重緩衝，減緩門扇撞擊框體，降低撞擊聲，而延伸弧形長臂或直形長臂彈性高差值，提高門框與門扇間之間隙密封誤差值，能減緩撞擊聲及提高密封效果者。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">
        &lt;u&gt;300&lt;/u&gt;a:門框</p>
        <p type="p">3a:裝設防撞隔音條用溝槽</p>
        <p type="p">31a:溝槽內側壁</p>
        <p type="p">32a:溝槽外側壁</p>
        <p type="p">33a:溝槽寬度</p>
        <p type="p">100a:雙緩衝式 防撞隔音條構造與設施</p>
        <p type="p">1a:固定件</p>
        <p type="p">2a:圓形氣囊緩衝件</p>
        <p type="p">11a:固定件平滑面</p>
        <p type="p">12a:固定件前端部</p>
        <p type="p">13a:逆鉤</p>
        <p type="p">14a:強化稜線</p>
        <p type="p">15a:氣室</p>
        <p type="p">16a:固定件基部</p>
        <p type="p">17a:弧形長臂</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="186" publication-number="202616008">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616008</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137936</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動化生成加工路徑的工件加工方法及其工件加工系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">G05B19/19</main-classification>
        <further-classification edition="200601120241105B">B25J19/04</further-classification>
        <further-classification edition="200601120241105B">B25J9/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中鋼機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方正安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾景弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭威男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李啟英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡承翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黎尚昆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳芳緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白凱仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林思瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林欣儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自動化生成加工路徑的工件加工方法，適用於一工件，並藉由一工件加工系統來實施，且包含以下步驟：(A)當該運算模組接收到來自該影像拍攝模組的該工件影像時，藉由該運算模組辨識出該工件影像中對應於該工件之一工件部份的一工件輪廓；(B)藉由該運算模組根據該工件輪廓獲得一包含N個軌跡點的加工路徑；(C)藉由該運算模組將該加工路徑中之該等N個軌跡點所對應之影像座標轉換為N個機器人運作座標點位；及(D)藉由該運算模組控制該機器人模組根據該等N個機器人運作座標點位對該工件進行加工，以達成自動對該工件進行加工之目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">41~45:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="187" publication-number="202614988">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614988</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137937</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>嫁接睫毛用組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241101B">A61K8/81</main-classification>
        <further-classification edition="201701120241101B">A61K8/9789</further-classification>
        <further-classification edition="200601120241101B">A61K8/34</further-classification>
        <further-classification edition="200601120241101B">A61K8/65</further-classification>
        <further-classification edition="200601120241101B">A61K8/41</further-classification>
        <further-classification edition="200601120241101B">A61K8/92</further-classification>
        <further-classification edition="200601120241101B">A61Q1/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑瑀國際企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳念凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種嫁接睫毛用組成物，包含溶劑、防護劑、生長劑、保濕劑、增稠劑、酸鹼平衡劑及界面活性劑。該防護劑為甲基丙烯酸/丙烯醯胺甲基丙基磺酸鈉共聚物，該生長劑為密羅木葉/莖萃取物，以該嫁接睫毛用組成物的總量為100wt%計，該防護劑的含量範圍為大於5wt%至小於10wt%。透過該密羅木葉/莖萃取物及上述含量的該甲基丙烯酸/丙烯醯胺甲基丙基磺酸鈉共聚物，共同達成減緩黏貼在真睫毛上的人工睫毛脫落，從而延長嫁接睫毛的持久度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="188" publication-number="202615803">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615803</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137940</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>實現人工智慧綠健康建築標準之室內空污清零無塵室系統</chinese-title>
        <english-title>INDOOR AIR POLLUTION CLEAN ROOM SYSTEM ACHIEVING ARTIFICIAL INTELLIGENCE GREEN AND HEALTH BUILDING STANDARDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120241213B">F24F11/30</main-classification>
        <further-classification edition="201801120241213B">F24F11/58</further-classification>
        <further-classification edition="201801120241213B">F24F11/70</further-classification>
        <further-classification edition="201801120241213B">F24F11/88</further-classification>
        <further-classification edition="200601120241213B">E04H14/00</further-classification>
        <further-classification edition="201801320241213B">F24F110/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>研能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICROJET TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫皓然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOU, HAO-JAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳錦銓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIN-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃啟峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHI-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種實現人工智慧綠健康建築標準之室內空污清零無塵室系統室內空污偵測淨化系統，基於室內空污偵測淨化系統結合高效建築設計結構、可再生能源系統、水資源管理系統與循環經濟與資源回收利用，實現綠建築標準(LEED標準)和健康建築標準(WELL標準)中的低能耗與高舒適度要求，並實現新人工智慧綠健康建築標準，做到控制室內空氣污染趨零、水污染趨零、噪音污染趨零、碳排淨零、節能極大化，提升居住環境的健康和舒適度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An indoor air pollution clean room system which achieves artificial intelligence green and health building standards is disclosed. Based on the indoor air pollution detection and purification system combining with efficient building design structure, renewable energy system, water resources management system, circular economy and resource recycling, the requirements of high comfort and low energy consumption of the green building standards (LEED standards) and the healthy building standards (WELL standards) are achieved, the new artificial intelligence green and healthy building standards is achieved, and the advantages of controlling indoor air pollution, water pollution, noise pollution and carbon emission to zero, extremely saving energy, improving the health and comfort of the living environment are achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">a:室內空污清零無塵室系統</p>
        <p type="p">b:高效建築設計結構</p>
        <p type="p">c:可再生能源系統</p>
        <p type="p">d:水資源管理系統</p>
        <p type="p">e:循環經濟與資源回收利用</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="189" publication-number="202616153">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616153</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137950</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於知識管理之負責任人工智慧管理方法</chinese-title>
        <english-title>KNOWLEDGE-BASED APPROACH FOR THE IMPLEMENTATION OF RESPONSIBLE ARTIFICIAL INTELLIGENCE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250203B">G06N20/00</main-classification>
        <further-classification edition="202301120250203B">G06Q10/10</further-classification>
        <further-classification edition="202301120250203B">G06N5/04</further-classification>
        <further-classification edition="202501120250203B">G06F16/35</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>碩網資訊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTUMIT, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱仁鈿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIOU, JEN-DIANN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江明洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, MING-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江國慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種基於知識管理之負責任人工智慧管理方法，包括：提供一企業伺服器，上述企業伺服器至少包含篩選分類模組及資料庫；企業伺服器接收由使用者輸入文本內容；由篩選分類模組對輸入的文本內容進行分類，以判定文本內容的分類類別；依據上述文本內容的分類類別而產生相應的管理規則；依據上述管理規則對文本內容執行篩選；以及由篩選過的文本內容，向一生成式人工智慧伺服器提出詢問並產生合乎負責任人工智慧規範的對應內容。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a ­­­­­knowledge-based approach for the implementation of a responsible AI, which includes providing an enterprise server with a filtering classification module and a database, the enterprise server receives text content input by the user, the filtering classification module classifies the input text content to determine the classification category of the text content for generating corresponding management rules based on the classification category of the text content, the filtering classification module screens the text content based on the management rules and makes queries to a generated AI server for generating corresponding content that complies with the responsible AI standards.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S11,S12,S13,S14,S15:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="190" publication-number="202616682">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616682</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137956</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自適性衛星鏈路路由協調系統、方法及其電腦可讀媒介</chinese-title>
        <english-title>ADAPTIVE SATELLITE ROUTING ORCHESTRATION SYSTEM, METHOD AND COMPUTER READABLE MEDIUM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">H04B7/185</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張博彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, PO-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉家宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIA-HORNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宜誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JHIH-REN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭明宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, MING-ZONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種自適性衛星鏈路路由協調系統及其方法，提供在低軌衛星網路架構下，透過判斷地面網路接入點與行動網路連接之行動核心網路所在地點對外海底電纜的連線狀態，選擇引導行動網路的訊務經海底電纜傳送到行動核心網路或是引導行動網路的訊務透過低軌衛星網路傳送到行動核心網路。本發明復提供一種電腦可讀媒介，係用於執行本發明之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is an adaptive satellite routing orchestration system and method thereof. Under the Low Earth orbit network architecture, by determining the connection status of an external submarine cable at the location where a terrestrial network access point and a mobile core network are connected to a mobile network, traffics of the mobile network transmitted to the mobile core network through the submarine cable or through the Low Earth orbit network can be determined. The present invention also provides a computer-readable medium for executing the method of the present invention.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:自適性衛星鏈路路由協調系統</p>
        <p type="p">11:封包分析模組</p>
        <p type="p">12:路由交換控制模組</p>
        <p type="p">13:路由優先權控制模組</p>
        <p type="p">2:低軌衛星網路系統</p>
        <p type="p">3:海底電纜交換器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="191" publication-number="202615871">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615871</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137963</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電氣特性檢查用導線、絕緣電線及探針卡</chinese-title>
        <english-title>CONDUCTOR FOR ELECTRICAL CHARACTERISTIC TESTING, INSULATED WIRE, AND PROBE CARD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">G01R1/06</main-classification>
        <further-classification edition="200601120250401B">H01B1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＳＷＣＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SWCC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大達剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ODACHI, GO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小泉勉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOIZUMI, TSUTOMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新井龍一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, RYUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邊璃久也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, RIKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之電氣特性檢查用導線係由銅合金所構成，該銅合金含有0.1至30質量%的銀，剩餘部分為銅和不可避雜質。電氣特性檢查用導線的直徑係0.2mm以下。電氣特性檢查用導線之橫剖面中之中心部之維氏硬度相對於外周部之維氏硬度的比係0.90至1.10的範圍內。中心部的維氏硬度和前述外周部的維氏硬度均為250HV以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A conductor for electrical characteristic testing according to the present invention is composed of a copper alloy containing 0.1 to 30 mass % silver, with the remainder being copper and unavoidable impurities. The conductor for electrical characteristic testing has a diameter of 0.2 mm or less. The ratio of the Vickers hardness of the central part to the Vickers hardness of the outer periphery in the cross section of the conductor for electrical characteristics testing is within the range from 0.90 to 1.10. Both the Vickers hardness of the central part and the Vickers hardness of the outer periphery are 250 HV or more.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電路基板</p>
        <p type="p">11:基板</p>
        <p type="p">12:電極</p>
        <p type="p">20:接觸探針</p>
        <p type="p">21:支撐部</p>
        <p type="p">22:探針銷</p>
        <p type="p">30:檢查裝置</p>
        <p type="p">31:保持部</p>
        <p type="p">32:引線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="192" publication-number="202615302">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615302</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137968</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>藥粉混合包裝機</chinese-title>
        <english-title>MEDICINAL POWDER MIXING PACKAGING MACHINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241115B">B65B1/30</main-classification>
        <further-classification edition="200601120241115B">B65B1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>篤信智慧科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAITH TECHNOLOGY CONSULTANT LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃心毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉箐茹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種藥粉混合包裝機，其包括一載台、一支架、一盛裝容器以及一下料機構。載台具有一第一轉軸。支架設置於載台且結合於第一轉軸，支架具有一第二轉軸。盛裝容器設置於支架且結合於第二轉軸，第二轉軸係沿盛裝容器的軸向延伸，盛裝容器具有一進出料開口。下料機構結合於盛裝容器的進出料開口。支架繞第一轉軸轉動，且盛裝容器繞第二轉軸轉動，第一轉軸與第二轉軸的軸線係相交。盛裝容器的內部形成一容置空間，用於容置不同藥粉，經由第一轉軸與第二轉軸的轉動，使得盛裝容器形成一三維移動，不同藥粉在盛裝容器中經由三維移動而混合均勻。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A medicine powder mixing and packaging machine includes a carrying stage, a bracket, a container and a discharging mechanism. The carrying stage has a first rotating axis. The bracket is arranged on the carrier and coupled to the first rotating shaft. The bracket has a second rotating shaft. The container is arranged on the bracket and coupled to the second rotating shaft. The second rotating shaft extends along the axial direction of the container. The container has an inlet and outlet opening. The discharging mechanism is combined with the inlet and outlet opening of the container. The bracket rotates around the first rotating axis, and the container rotates around the second rotating axis. The axes of the first rotating axis and the second rotating axis intersect. An accommodation space is formed inside the container for accommodating the medicinal powders. The rotation of the first rotating shaft and the second rotating shaft causes the container to move in three dimensions, and the powders are mixed in the container through the three-dimensional movement.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:藥粉混合包裝機</p>
        <p type="p">10:載台</p>
        <p type="p">11:基座</p>
        <p type="p">12:直立壁</p>
        <p type="p">13:第一轉軸</p>
        <p type="p">14:皮帶輪組</p>
        <p type="p">20:支架</p>
        <p type="p">21:第一結合壁</p>
        <p type="p">22:第二結合壁</p>
        <p type="p">23:第三結合壁</p>
        <p type="p">26:第二轉軸</p>
        <p type="p">30:盛裝容器</p>
        <p type="p">40:下料機構</p>
        <p type="p">50:第一馬達</p>
        <p type="p">60:第二馬達</p>
        <p type="p">70:秤重裝置</p>
        <p type="p">80:包裝機構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="193" publication-number="202615540">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615540</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137975</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚丁二酸丁二醇酯或其共聚酯的製備方法</chinese-title>
        <english-title>METHOD FOR PREPARATION OF POLYBUTYLENE SUCCINATE OR ITS COPOLYESTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241016B">C08G63/16</main-classification>
        <further-classification edition="200601120241016B">B01J21/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福盈生物材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JINTEX BIOMATERIALS CORPORATION LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳禹皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周志誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHIHCHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊心誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHINCHERNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林發立</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯春岑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種製備聚丁二酸丁二醇酯或其共聚酯的方法，包括：(a) 提供一混合物，包含：丁二酸；丁二醇，該丁二醇與該丁二酸的莫耳比為1.05至1.25:1；甘油，該甘油與該丁二酸的莫耳比為0.0001至0.4:100；磷系安定劑；及催化劑，該催化劑包含醋酸金屬鹽及鈦系催化劑；以及(b)將該混合物加熱至160至245°C進行酯化及聚合反應。其中該鈦系催化劑的結構式為        &lt;img align="absmiddle" height="88px" width="128px" file="ed10001.jpg" alt="ed10001.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;，R為C        &lt;sub&gt;2&lt;/sub&gt;-C        &lt;sub&gt;6&lt;/sub&gt;一元醇或C        &lt;sub&gt;2&lt;/sub&gt;-C        &lt;sub&gt;6&lt;/sub&gt;二元醇。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for preparation of poly(butylene succinate) or its copolyester is provided. The method comprises following steps: (a) providing a mixture including: succinic acid; butanediol, with a molar ratio of the butanediol to the succinic acid being 1.05 to 1.25:1; glycerol, with a molar ratio of the glycerol to the succinic acid being 0.0001 to 0.4:100; a phosphorus-based stabilizer; and a catalyst, where the catalyst includes a magnesium acetate metal salt and a titanium-based catalyst; and (b) heating the mixture to 160 to 245°C to carry out esterification and polymerization reactions. The titanium-based catalyst is        &lt;img align="absmiddle" height="88px" width="128px" file="ed10001.jpg" alt="ed10001.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;, where R is C        &lt;sub&gt;2&lt;/sub&gt;-C        &lt;sub&gt;6&lt;/sub&gt;monohydric alcohol or C        &lt;sub&gt;2&lt;/sub&gt;-C        &lt;sub&gt;6&lt;/sub&gt;diol.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">無圖式</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="194" publication-number="202616724">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616724</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137978</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>串流播放系統及串流播放方法</chinese-title>
        <english-title>STREAMING PLAYBACK SYSTEM AND STREAMING PLAYBACK METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120250203B">H04N21/234</main-classification>
        <further-classification edition="201101120250203B">H04N21/43</further-classification>
        <further-classification edition="201101120250203B">H04N21/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣大哥大股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN MOBILE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳淑琴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SHU-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭凱中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, KAI-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張美惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, MEI-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥佐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YAN-ZUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林峻譚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-TAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">串流播放系統用以執行以下運作：由第一電子裝置自影音服務伺服器接收影片串流及至少一廣告串流之第一播放腳本；由第一電子裝置基於第一播放腳本，分別自影片串流伺服器獲得對應影片串流之第一串流索引檔，及自廣告串流伺服器對應至少一廣告串流之第二串流索引檔；由第一電子裝置基於第一播放腳本，將第一串流索引檔及第二串流索引檔整合為第三串流索引檔；由第一電子裝置基於第三串流索引檔，自影片串流伺服器播放影片串流；以及由第一電子裝置基於第三串流索引檔，自廣告串流伺服器將至少一廣告串流插入影片串流。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A streaming playback system is configured to perform following operations: receiving a first playback script of a video streaming and at least one advertisement streaming from an audio-visual service server by a first electronic device; obtaining a first streaming index file corresponding to the video streaming from a video streaming server and a second streaming index file corresponding to the at least one advertisement streaming from an advertisement streaming server according to the first playback script by the first electronic device; integrating the first streaming index file and the second streaming index file into a third streaming index file according to the first playback script by the first electronic device; playing the video streaming from the video streaming server according to the third streaming index file by the first electronic device; and inserting the at least one advertisement streaming from the advertisement streaming server into the video streaming according to the third stream index file by the first electronic device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:串流播放系統</p>
        <p type="p">110:影音服務伺服器</p>
        <p type="p">120:影片串流伺服器</p>
        <p type="p">130:廣告串流伺服器</p>
        <p type="p">140,150:電子裝置</p>
        <p type="p">111,121,131,141,151:記憶體</p>
        <p type="p">112,122,132,142,152:處理器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="195" publication-number="202616092">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616092</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137980</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有通用序列匯流排C型介面的電子裝置及其運作方法</chinese-title>
        <english-title>ELECTRONIC DEVICE WITH USB TYPE-C INTERFACE AND OPERATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">G06F13/38</main-classification>
        <further-classification edition="200601120250102B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>圓剛科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVERMEDIA TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉冠佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KUAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕衡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有通用序列匯流排C型介面的電子裝置包含功率輸送控制器以及第一通用序列匯流排C型介面。第一通用序列匯流排C型介面透過第一溝通介面電性連接功率輸送控制器。當功率輸送控制器偵測到觸發事件發生時，功率輸送控制器停止第一溝通介面的溝通，然後再開啟第一溝通介面的溝通。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device with a Universal Serial Bus (USB) Type-C interface includes a power delivery controller and a first USB Type-C interface. The first USB Type-C interface is electrically connected to the power delivery controller through a first communication interface. When the power delivery controller detects that the trigger event occurs, the power delivery controller stops communication with the first communication interface, and then starts the communication with the first communication interface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子裝置</p>
        <p type="p">110:功率輸送控制器</p>
        <p type="p">111:微控制器</p>
        <p type="p">112:邏輯閘</p>
        <p type="p">115、116:接腳</p>
        <p type="p">120:電源匯流排</p>
        <p type="p">130:第一溝通介面</p>
        <p type="p">131:第一介面</p>
        <p type="p">132:第二介面</p>
        <p type="p">180:第一通用序列匯流排C型介面</p>
        <p type="p">190:外接裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="196" publication-number="202616666">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616666</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137982</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>訊號轉換裝置與誤碼率測試方法</chinese-title>
        <english-title>SIGNAL CONVERSION DEVICE AND BIT ERROR RATE TEST METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">H03M1/10</main-classification>
        <further-classification edition="200601120250102B">H03M1/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃銘崇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, MING-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">誤碼率測試方法包含下列操作：藉由類比數位轉換器電路取樣對稱性訊號以產生複數個輸出數位碼；找出複數個輸出數位碼中的起始數位碼；將起始數位碼與輸出數位碼中追隨起始數位碼的第一數位碼按照一順序儲存到第一暫存器電路，以作為第二數位碼，其中起始數位碼與第一數位碼對應於對稱性訊號的一週期；將起始數位碼與第一數位碼按照相反順序儲存到第二暫存器電路；將第二暫存器電路中的起始數位碼與該些第一數位碼進行移位，以作為複數個第三數位碼；以及根據一對應第二數位碼與一對應第三數位碼之間的差值決定類比數位轉換器電路的誤碼率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A error rate test method comprises the following operations: sampling a symmetrical signal by an analog-to-digital converter circuit to generate output digital codes; finding a starting digital code from the output digital codes; storing the starting digital code and first digital codes following the starting digital code in the output digital codes in an order into a first register circuit as second digital codes, where the starting digital code and the first digital codes correspond to a cycle of the symmetrical signal; storing the starting digital code and the first digital codes in a reverse order into a second register circuit; shifting the starting digital code and the first digital codes in the second register circuit as third digital codes; and determining an error rate of the analog-to-digital converter circuit according to a difference between a corresponding second digital code and a corresponding third digital code.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:誤碼率測試方法</p>
        <p type="p">S210,S220,S230,S240,S250,S260:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="197" publication-number="202616739">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616739</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137984</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>整合感知與通訊的方法與使用所述方法的使用者設備</chinese-title>
        <english-title>METHOD OF INTEGRATING SENSING AND COMMUNICATION AND USER EQUIPMENT USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250203B">H04W4/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明峻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MING-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周頎翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHI-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康博竣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, PO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種整合感知與通訊的方法與使用所述方法的使用者設備。所述方法適用於使用者設備且包含以下步驟。傳送一網路註冊請求，並從第一網路實體接收一合作感知服務的詢問資訊。傳送詢問資訊的回應訊息。從第一網路實體接收合作感知服務的第一合作感知配置資訊。根據第一合作感知配置資訊致能合作感知服務。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An aspect of the disclosure includes a method of integrating sensing and communication and a user equipment using the same. The method is adapted to the user equipment and includes the following steps. A network registration request is transmitted, and a query information of a collaborative sensing service is received from a first network entity. A response message of the query information is transmitted. A first collaborative sensing configuration information of the collaborative sensing service is received from the first network entity. The collaborative sensing service is enabled according to the first collaborative sensing configuration information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S2410~S2440:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="198" publication-number="202616030">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616030</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137985</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有離線智能客服的自走式裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120241104B">G05D1/86</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬潤科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALL RING TECH CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任威丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEN, WEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有離線智能客服的自走式裝置，設有設置在自走式模組的多個本體感測模組、多個環境感測模組、數據庫與客服模組。該等本體感測模組可偵測取得該自走式模組的運作參數。該等環境感測模組可感測取得該自走式模組周圍環境的環境參數。該客服模組會根據被點選之事件日誌，以一狀態分析模型分析該事件日誌相關之運作參數與環境參數，而顯示出答覆訊息。透過使該客服模組以該狀態分析模型自數據庫提取並分析相關運作參數與環境參數，而得到該答覆訊息的設計，可使該自走式裝置在不使用網路功能的情況下，具備自行問題排查的功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:自走式裝置</p>
        <p type="p">3:自走式模組</p>
        <p type="p">4:本體感測模組</p>
        <p type="p">5:環境感測模組</p>
        <p type="p">6:數據庫</p>
        <p type="p">7:客服模組</p>
        <p type="p">71:輸入/輸出單元</p>
        <p type="p">72:狀態分析單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="199" publication-number="202615979">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615979</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137988</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化學增幅型正型感光性樹脂組成物、硬化膜以及具有硬化膜的元件</chinese-title>
        <english-title>CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND COMPONENTS WITH CURED FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241011B">G03F7/039</main-classification>
        <further-classification edition="200601120241011B">G03F7/004</further-classification>
        <further-classification edition="200601120241011B">H01L21/027</further-classification>
        <further-classification edition="200601120241011B">H01L21/312</further-classification>
        <further-classification edition="200601120241011B">C08K5/5455</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇美實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI MEI CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉文光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, WEN-KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關於一種化學增幅型正型感光性樹脂組成物、硬化膜及具有硬化膜的元件。化學增幅型正型感光性樹脂組成物包括：酸解離性樹脂（A）、光酸產生劑（B）、溶劑（C）、以及封閉型異氰酸酯矽烷化合物（D）。包含化學增幅型正型感光性樹脂組成物形成的硬化膜，所測定的內部應力為40 MPa以下。利用此化學增幅型正型感光性樹脂組成物所製得的硬化膜具有良好的長時耐化性和高溫高濕信賴性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a chemically-amplified positive photosensitive resin composition, a protective film, and a device with the protective film. The chemically-amplified positive photosensitive resin composition comprises acid a dissociation resin (A), a photoacid generator (B), a solvent (C), and a blocked isocyanate silane compound (D). The measured internal stress of a cured film composed of the chemically amplified positive photosensitive resin composition is 40 MPa or less. The cured film prepared by using this chemically amplified positive photosensitive resin composition has good long-term chemical resistance and high temperature and high humidity reliability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="200" publication-number="202615311">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615311</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113137990</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有倒酒功能之保溫袋結構</chinese-title>
        <english-title>ISOTHERMAL BAG STRUCTURE WITH WINE-POURED FUNCTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">B65D81/05</main-classification>
        <further-classification edition="200601120241105B">B65D81/38</further-classification>
        <further-classification edition="200601120241105B">B65D25/22</further-classification>
        <further-classification edition="200601120241105B">B65D33/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喀雷提夫有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COLLECTIVEIT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡佳翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHIA-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏福楨</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有倒酒功能之保溫袋結構，具有一筒部與一連接於該筒部外側的握持部，使用時可將酒瓶裝入該筒部內，並以手握該握持部來倒酒，而將酒瓶裝入該筒部內後，可解決過往以裸瓶倒酒時可能手滑的問題，同時也可延緩酒瓶回溫的速度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention related to an isothermal bag structure with wine-poured function comprises a barrel part and a grip part connected to the barrel part. Users can put wine bottle into the barrel part and grab the grip part to pour the wine. By putting the wine bottle into the barrel part, the problem about butterfingers when pouring with naked wine bottle can be solved. The present invention also can slow the rewarming speed down of the cold wine bottle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:主體</p>
        <p type="p">11:筒部</p>
        <p type="p">111:筒側</p>
        <p type="p">112:筒底</p>
        <p type="p">13:握持部</p>
        <p type="p">131:握持外層</p>
        <p type="p">132:握持內層</p>
        <p type="p">14:握持孔</p>
        <p type="p">15:內視孔</p>
        <p type="p">16:內視片</p>
        <p type="p">2:上束組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="201" publication-number="202614919">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614919</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138000</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包裝結構</chinese-title>
        <english-title>PACKING STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">A01K47/02</main-classification>
        <further-classification edition="200601120241105B">B65D85/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和碩聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEGATRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林千宸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIEN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政大</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種包裝結構由二板體分別摺疊並黏接而成。各板體包括主板、側板、分隔板以及隔間板。主板具有相對之第一側邊及第二側邊。側板具有相鄰之第三側邊及第四側邊，第三側邊連接於主板之第一側邊。分隔板連接於主板之第二側邊，分隔板包括複數長隔板及複數彎折板。各彎折板設置於二長隔板之間且與二長隔板相連接，透過彎折彎折板與長隔板相連接處可使得長隔板平行設置。隔間板連接於側板之第四側邊，且具有相互平行設置之複數隔間槽。其中，二板體彼此相黏接以圍繞形成容置空間。各隔間板經彎折後使每一隔間槽夾持一個長隔板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A packaging structure is formed by folding and adhering two plates. Each plate includes a main board, a side board, a separation board and a partition board. The main board has a first side and a second side opposite to each other. The side board has an adjacent third and fourth side, and the third side is connected to the first side of the main board. The separation board is connected to the second side of the main board, and the separation board includes a plurality of long separation boards and a plurality of bending plate. Each bending plate is disposed between two long separation boards and connected to the two long separation boards. By bending the connection between the bending plate and the long separation board, the long separation boards can be arranged parallel. The partition board is connected to the fourth side of the side board and has a plurality of partition grooves arranged parallel to each other. Two plates are adhered to each other to surround and form an accommodation space. Each partition board is bent so that each partition slot clamps a long separation board.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:主板</p>
        <p type="p">13:蓋板</p>
        <p type="p">14:黏接板</p>
        <p type="p">20:側板</p>
        <p type="p">22:第四側邊</p>
        <p type="p">31:長隔板</p>
        <p type="p">311:圓弧形缺口</p>
        <p type="p">312:限位插槽</p>
        <p type="p">313:凸出部</p>
        <p type="p">32:彎折板</p>
        <p type="p">33,35:長邊側</p>
        <p type="p">351:取物凹槽</p>
        <p type="p">34,36:短邊側</p>
        <p type="p">40:隔間板</p>
        <p type="p">402:第二板</p>
        <p type="p">403:第三板</p>
        <p type="p">41:隔間槽</p>
        <p type="p">42:長直槽</p>
        <p type="p">43:對位孔</p>
        <p type="p">D:間距</p>
        <p type="p">S:容置空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="202" publication-number="202616537">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616537</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138007</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電極結構、電池及製備電極結構的方法</chinese-title>
        <english-title>ELECTRODE STRUCTURE, BATTERY AND METHOD OF MANUFACTURING ELECTRODE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120241205B">H01M4/131</main-classification>
        <further-classification edition="201001120241205B">H01M4/133</further-classification>
        <further-classification edition="201001120241205B">H01M4/1391</further-classification>
        <further-classification edition="201001120241205B">H01M4/1393</further-classification>
        <further-classification edition="201001120241205B">H01M4/505</further-classification>
        <further-classification edition="201001120241205B">H01M4/525</further-classification>
        <further-classification edition="201001120241205B">H01M4/587</further-classification>
        <further-classification edition="200601120241205B">H01M4/62</further-classification>
        <further-classification edition="201001120241205B">H01M10/0525</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明斯特大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIVERSITY OF MUNSTER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁郁婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳乃立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, NAE-LIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃炳照</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, BING-JOE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穩特　馬丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINTER, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托比思　佩雷克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOBIAS, PLACKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容中的一些實施方式提供電極結構，包含電極活性物質顆粒以及電極覆層。電極覆層覆蓋於電極活性物質顆粒上，其中電極覆層包含式一的結構：        &lt;br/&gt;&lt;img align="absmiddle" height="134px" width="585px" file="ed10022.JPG" alt="ed10022.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，        &lt;br/&gt;其中R        &lt;sub&gt;1&lt;/sub&gt;為氧、硫、酮基或烴基，R        &lt;sub&gt;2&lt;/sub&gt;為氧、硫、酮基或烴基，R        &lt;sub&gt;3&lt;/sub&gt;為氧、硫、酮基或烴基，X為磺酸基。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrode structure is provided in some embodiments of the present disclosure, including an electrode active material particle and an electrode coating layer. The electrode coating layer is covered on the electrode active material particle, in which the electrode coating layer includes a structure of formula 1,        &lt;img align="absmiddle" height="149px" width="675px" file="ed10024.JPG" alt="ed10024.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, in which R        &lt;sub&gt;1&lt;/sub&gt;is oxygen, sulfur, ketone group or hydrocarbon group, R        &lt;sub&gt;2&lt;/sub&gt;is oxygen, sulfur, ketone group or hydrocarbon group, R        &lt;sub&gt;3&lt;/sub&gt;is oxygen, sulfur, ketone group or hydrocarbon group, X is sulfonic acid group.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">S110、S120、S130、S140:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="203" publication-number="202615149">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615149</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138010</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>應用於負載觸媒之薄膜反應器之製造方法</chinese-title>
        <english-title>METHOD FOR MANUFACTURING FILM REACTOR FOR LOADING CATALYST</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120241105B">B01J35/39</main-classification>
        <further-classification edition="202401120241105B">B01J35/56</further-classification>
        <further-classification edition="200601120241105B">B01J37/00</further-classification>
        <further-classification edition="200601120241105B">B01J37/02</further-classification>
        <further-classification edition="200601120241105B">B01J37/08</further-classification>
        <further-classification edition="200601120241105B">B01J19/12</further-classification>
        <further-classification edition="200601120241105B">B01D53/86</further-classification>
        <further-classification edition="202301120241105B">C02F1/32</further-classification>
        <further-classification edition="201501120241105B">B33Y10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立宜蘭大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL ILAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>宜蘭縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴鵬仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, PENG-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾祥瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAN, SHIANG-RUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張傑勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIEH-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭明翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, MING-HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊鈺祈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YU-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡秀玫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡依庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種應用於負載觸媒之薄膜反應器之製造方法，其步驟包含：提供漿料；設定列印參數；以3D列印機逐層將漿料列印成坯體；以溶劑清洗坯體；利用高溫爐將坯體進行脫脂；利用高溫爐將坯體燒結成薄膜反應器；以觸媒流體掃流並過濾形成負載觸媒之薄膜反應器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is to provide a method for manufacturing a film reactor for loading catalyst, which comprises firstly providing slurry material, setting printing parameter, printing an embryonic body layer by layer using a 3D printer, flushing the embryonic body using a solvent, defatting the embryonic body using a furnace, forming a film reactor using the furnace, and sweeping and filtering the film reactor using a catalyst flow to form the film reactor loading catalyst.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10~S70:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="204" publication-number="202615196">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615196</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138011</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高精度雷射切割機</chinese-title>
        <english-title>HIGH PRECISION LASER CUTTING MACHINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">B23Q1/01</main-classification>
        <further-classification edition="201401120241105B">B23K26/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡豐股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANFON TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃德豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TE FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉志偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIH WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種高精度雷射切割機包括金屬基座、花崗岩床台及雷射光源。花崗岩床台位於金屬基座上。花崗岩床台包括至少一第一花崗岩塊與至少一第二花崗岩塊。第二花崗岩塊堆疊於第一花崗岩塊上。第一花崗岩塊沿金屬基座的長度方向設置，第二花崗岩塊沿金屬基座的寬度方向設置。雷射光源移動地位於花崗岩床台上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A high precision laser cutting machine includes a metal base, a granite bed, and a laser light source. The granite bed is located on the metal base. The granite bed includes at least one first granite block and at least one second granite block. The second granite block is stacked on the first granite block. The first granite block is disposed along the lengthwise direction of the metal base, and the second granite block is disposed along the widthwise direction of the metal base. The laser light source is movably located above the granite bed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:金屬基座</p>
        <p type="p">120:花崗岩床台</p>
        <p type="p">122:第一花崗岩塊</p>
        <p type="p">124:第二花崗岩塊</p>
        <p type="p">150:吸震片</p>
        <p type="p">D1:長度方向</p>
        <p type="p">D2:寬度方向</p>
        <p type="p">O:開口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="205" publication-number="202615288">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615288</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138013</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機動車架</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241015B">B62K19/30</main-classification>
        <further-classification edition="201301120241015B">B62K11/00</further-classification>
        <further-classification edition="200601120241015B">B62D21/07</further-classification>
        <further-classification edition="202001120241015B">B62J43/28</further-classification>
        <further-classification edition="200601120241015B">B60K1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍舜有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭文吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林永昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供適宜組設於一機動車之一種機動車架，藉由該機動車架所揭露之一承載段的二端係各別連接在一中管與二後管等技術特徵，如此一來，相較於先前技術所揭露之內容，除了讓該機動車架能顯著提升並強化整體結構強度的功效外，更能讓該機動車架中所預設之可裝設或擺放電瓶的空間相對變大，並大幅提昇使用者在裝設、擺放或更換電瓶時之便利性功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:機動車</p>
        <p type="p">3:機動車架</p>
        <p type="p">70:承載段</p>
        <p type="p">80:組設部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="206" publication-number="202615857">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615857</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138014</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種測量食品天然度、加工程度的居家型檢驗工具</chinese-title>
        <english-title>A HOME-BASED INSPECTION KIT FOR MEASURING THE NATURALNESS AND PROCESSING DEGREE OF FOODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241120B">G01N33/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊沐恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, MU-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊沐恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, MU-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">飲食是人類每天的課題，但隨著加工技術的突破，我們難以在食品外觀來判斷食物含有多少的精緻添加劑，許多的研究也表示精煉後的原料缺乏營養素，不但較為不健康，還會對身體代謝帶來負擔。本技術多醣居家型檢驗套組原理是測量自然界的產物都會有糖的存在，藉改變溶液極性或密度等物理現象，觀察糖類沉澱或溶解度多寡，用來判別該食品組成原料的天然程度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Diet is a daily issue for humans, but with breakthroughs in processing technology, it is difficult for us to judge how many refined additives a food contains from the appearance of the food. Many studies have also shown that refined raw materials lack nutrients and are not only unhealthy, but also bring burden or harmful to body metabolism. The principle of this invention“sugar home test kit” is to measure the presence of sugar from natural or additional in the food product. By changing physical phenomena such as the polarity or density of the solution, and observing the precipitation or solubility of the sugar, it is a tool used to determine the naturalness of the foods.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="207" publication-number="202616541">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616541</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138018</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>燃料電池</chinese-title>
        <english-title>HYDROGEN FUEL CELL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120241016B">H01M8/04</main-classification>
        <further-classification edition="201601120241016B">H01M8/04014</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>元智大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN ZE UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泓明科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOMYTECH GLOBAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李其源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHI-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳德仲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TE CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳嘉鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIA-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖振凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHENG-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪嘉德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHIA-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種燃料電池，其包含兩個端模組及反應模組。反應模組設置於兩個端模組之間。反應模組包含多個流道構件、多個膜電極及多個擴散構件。各個流道構件包含塑膠外框及導電板，塑膠外框以包射的方式，形成於導電板的外圍。相鄰的兩個流道構件共同夾持膜電極及擴散構件。相鄰且相互固定的兩個流道構件之間，形成有次進氣通道。次進氣通道用以導引氣體，流入擴散構件，並藉由擴散構件流通於膜電極的各個區域。本發明的燃料電池相較於傳統的燃料電池，具有相對較低的製造成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a hydrogen fuel cell comprising two end modules and a reaction module. The reaction module is disposed between the two end modules. The reaction module comprising a plurality of flow channel components, a plurality of membrane electrode assembly, and a plurality of diffusion components. Each flow channel component consists of a plastic outer frame and a conductive plate, with the plastic outer frame being formed around the perimeter of the conductive plate by an over-molding process. Two adjacent flow channel components jointly clamp the membrane electrode assembly and the diffusion component. A sub-air inlet channel is formed between the two adjacent and fixed flow channel components. The sub-air inlet channel guides gas into the diffusion component, which then distributes the gas across various regions of the membrane electrode assembly. Compared to conventional hydrogen fuel cells, the hydrogen fuel cell of the present invention offers a relatively lower manufacturing cost.</p>
      </isu-abst>
      <representative-img>
        <p type="p">A:燃料電池</p>
        <p type="p">100:端模組</p>
        <p type="p">11:端板</p>
        <p type="p">111:貫穿孔</p>
        <p type="p">12:絕緣板</p>
        <p type="p">121:貫穿孔</p>
        <p type="p">13:電極板</p>
        <p type="p">131:貫穿孔</p>
        <p type="p">2:流道構件</p>
        <p type="p">20:塑膠外框</p>
        <p type="p">201:進氣穿孔</p>
        <p type="p">208:中間部</p>
        <p type="p">2084:凸起結構</p>
        <p type="p">209:擴散結構</p>
        <p type="p">3:膜電極</p>
        <p type="p">4:擴散構件</p>
        <p type="p">5:輔助構件</p>
        <p type="p">A1:主進氣通道</p>
        <p type="p">A2:次進氣通道</p>
        <p type="p">A3:Y字氣體流道</p>
        <p type="p">A4:輔助通道</p>
        <p type="p">1A:進氣通道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="208" publication-number="202615322">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615322</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138020</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣浮式供料平台及其設備</chinese-title>
        <english-title>AIR-FLOATING FEED PLATFORM AND EQUIPMENT THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B65G51/03</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立勤益科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳奕翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳凱榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KAI-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉彥良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, YEN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡明義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MING-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仕偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種氣浮式供料平台，基於氣浮原理與氣流控制技術，使物料懸浮並實現精確的位移控制，透過不同的腔室型設計，使用小腔室獨立進氣或利用大型腔體均勻分佈氣流，提升懸浮力穩定性，圓形導流設計同時保留上述優化特性之簡化進氣點設計，減少氣流渦流現象，提高懸浮力的穩定性與位移控制的精確性；本發明的氣浮式柔性供料平台在自動化產業中，尤其在需要高精度和無污染處理的場景中，將具有廣泛的應用前景。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is related to an air-floating feed platform, based on the principles of air flotation and airflow control technology, allows materials to be suspended and enables precise displacement control. Through different chamber designs, the present invention uses either small chambers for independent air intake or large chambers for evenly distributed airflow to enhance the stability of the suspension force. The circular airflow guide design retains the simplified intake point optimization while reducing airflow turbulence, thus improving the stability of the suspension force and the precision of displacement control. This air-floating flexible feeding platform has broad application prospects in the automation industry, especially in scenarios requiring high precision and contamination-free processing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:氣浮式供料平台實施例一</p>
        <p type="p">110:進氣底盤</p>
        <p type="p">120:出氣盤</p>
        <p type="p">130:圍擋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="209" publication-number="202614951">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614951</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138025</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>風機結構</chinese-title>
        <english-title>FAN MOTOR STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">A47J36/38</main-classification>
        <further-classification edition="200601120241230B">F24C15/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣櫻花股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SAKURA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳昱慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YU-HYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林毅韋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張志任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳雯毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種風機結構，安裝於抽油煙機的機體上，所述風機結構包括一外殼體、一抽氣馬達、一塑膠盒體、一散熱板及一電控模組。外殼體具有一進氣口、一出氣口及一開孔，抽氣馬達設置於外殼體內，抽氣馬達啟動時能抽送氣流經由進氣口輸入外殼體內，再通過出氣口向外輸出。塑膠盒體設置於外殼體上，塑膠盒體能通過開孔伸入外殼體內。電控模組設置於散熱板上，且電控模組及散熱板之間可設置一絕緣片。散熱板及電控模組設置於塑膠盒體內，散熱板的一部分曝露於塑膠盒體底部的一散熱口，以利排散熱源。抽氣馬達電性連接於電控模組，而能由電控模組控制抽氣馬達的運作，抽氣馬達運作時，可抽送氣流冷卻散熱板及電控模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fan motor structure is installed on a housing of a range hood. The fan motor structure included an outer casing, an extraction motor, a plastic box, a heat sink, and an electric control module. The outer casing has an air inlet, an air outlet and an opening. The extraction motor is arranged in the outer casing. When the extraction motor is started, it can pump air into the outer casing through the air inlet, and then output it outward through the air outlet. The plastic box is arranged on the outer casing, and the plastic box can extend into the outer casing through the opening. The electric control module is arranged on the heat sink, and an insulating sheet can be disposed between the electric control module and the heat sink. The heat sink and the electric control module are arranged in the plastic box, and a part of the heat sink is exposed to a heat dissipation port at the bottom of the plastic box to facilitate heat dissipation. The extraction motor is electrically connected to the electric control module, and the electric control module can control the operation of the extraction motor. When the extraction motor is operating, airflow can be pumped to cool the heat sink and the electric control module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:外殼體</p>
        <p type="p">12:出氣口</p>
        <p type="p">13:開孔</p>
        <p type="p">22:出風側</p>
        <p type="p">3:塑膠盒體</p>
        <p type="p">32:側板</p>
        <p type="p">34:開口</p>
        <p type="p">35:線孔</p>
        <p type="p">5:電控模組</p>
        <p type="p">8:盒蓋</p>
        <p type="p">81:螺絲</p>
        <p type="p">82:冷卻散熱孔</p>
        <p type="p">9:阻油墊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="210" publication-number="202615270">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615270</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138026</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>延長電池使用壽命的電池管理系統及方法</chinese-title>
        <english-title>BATTERY MANAGEMENT SYSTEM AND METHOD EXTENDING BATTERY LIFETIME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120241029B">B60L58/10</main-classification>
        <further-classification edition="201901120241029B">B60L50/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>天聯達創新循環能源科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TALENT INNOVATIVE CIRCULAR ENERGY TECHNOLOGY CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周俊宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHUN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, KUO-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種延長電池使用壽命的電池管理系統及方法。本發明的電池管理系統產生多個脈波寬度調變訊號，分別在多個時間區間內用於控制電池單元在測試模式下的充電頻率。本發明的電池管理系統監測在各時間與容量區間內的電池單元的阻抗。本發明的電池管理系統將電池單元在多個時間區間內分別的多個阻抗相互比較以從多個阻抗中選擇其中一者，取電池單元具有選擇的那一阻抗時輸出的脈波寬度調變訊號的頻率，作為電池單元在實際使用模式下的充電頻率，以延緩電池單元的阻抗的增加，進而延長電池的使用壽命。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A battery management system and method extending battery lifetime is provided. In a test mode, the battery management system generates a plurality of pulse wave modulation signals and controls a frequency of charging or discharging of a battery module according to the plurality of pulse wave modulation signals respectively within a plurality of time and capacitance intervals. The battery management system monitors a resistance of the battery module within each of the time intervals. The battery management system selects one of the resistances of the battery module that are monitored respectively within the plurality of time intervals. The battery management system uses a frequency of the pulse wave modulation signal generated within the time interval during which the battery module has the one of the resistances, as a charging frequency of the battery module in an actual operation mode. As a result, an increase in the resistance of the battery module is delayed so as to extend lifetime of the battery module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">BT:電池單元</p>
        <p type="p">BMIC:電池監測電路</p>
        <p type="p">CTR:控制電路</p>
        <p type="p">BNC:平衡電路</p>
        <p type="p">CFET:充電側電晶體</p>
        <p type="p">DFET:放電側電晶體</p>
        <p type="p">DRV1:第一驅動器</p>
        <p type="p">DRV2:第二驅動器</p>
        <p type="p">TP:電池組的正端</p>
        <p type="p">TN:電池組的負端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="211" publication-number="202614970">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614970</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138027</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>腦波輔助復健系統</chinese-title>
        <english-title>BRAINWAVE AUXILIARY REHABILITATION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120250203B">A61B5/369</main-classification>
        <further-classification edition="202101120250203B">A61B5/375</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞東學校財團法人亞東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIA EASTERN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴金輪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHIN-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張玉梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUN-HORNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林柏岑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PO-TSEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳承恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHENG-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連佑阡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIEN, YU-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇冠瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, GUAN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾　雪亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FERRIN, EVELINA LAURENCIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許　美蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANUKUSUMA, CARMELLA EGITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇柏元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, PO-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種腦波輔助復健系統，其包含資料庫、播放模組、腦波感測單元、篩選單元、及控制單元。資料庫包含不同特徵的多個多媒體檔案。播放模組載入多個多媒體檔案以執行播放任務，並依序提供使用者觀看多個多媒體檔案。腦波感測單元分析使用者觀看任一個多媒體檔案時的腦波訊號未介於刺激區間時對對應的多媒體檔案建立無效標籤。篩選單元將具有無效標籤的多媒體檔案自資料庫中刪除並於播放模組執行完播放任務後發出有效播放指令。控制單元接收有效播放指令後控制播放模組再次載入資料庫的多個多媒體檔案並再次執行播放任務。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a brainwave auxiliary rehabilitation system. The brainwave auxiliary rehabilitation system includes a database, a playback module, a brainwave sensing unit, a screening unit, and a control unit. The database includes a plurality of multimedia files having different characteristics. The playback module loads the multimedia files to perform a playback task, and the playback module provides a user for watching the multimedia files in sequence. When the user watches any one of the multimedia files and the brainwave sensing unit analyzes the brainwave signal that is not within a stimulus interval, the brainwave sensing unit assigns an invalid label to the corresponding multimedia file. The screening unit deletes the multimedia files having the invalid label, and the screening unit issues a valid playback instruction after the playback module completes the playback task. The control unit controls the playback module to reload the multimedia files of the database to perform the playback task again after receiving the valid playback instruction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:腦波輔助復健系統</p>
        <p type="p">1:資料庫</p>
        <p type="p">11:多媒體檔案</p>
        <p type="p">2:播放模組</p>
        <p type="p">3:腦波感測單元</p>
        <p type="p">31:支架</p>
        <p type="p">32:貼片</p>
        <p type="p">33:運算單元</p>
        <p type="p">34:特徵辨識模組</p>
        <p type="p">341:多媒體分析報告</p>
        <p type="p">4:篩選單元</p>
        <p type="p">41:蒐集單元</p>
        <p type="p">4a:有效播放指令</p>
        <p type="p">5:控制單元</p>
        <p type="p">6:個人影音資料庫</p>
        <p type="p">61:個人多媒體檔案</p>
        <p type="p">7:警示單元</p>
        <p type="p">A:分析單元</p>
        <p type="p">W:公開瀏覽器</p>
        <p type="p">P:使用者</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="212" publication-number="202615371">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615371</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138030</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>節能環保輕質預製混凝土鎂牆蜂巢板的材料</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241205B">C04B28/32</main-classification>
        <further-classification edition="200601120241205B">C04B14/42</further-classification>
        <further-classification edition="200601120241205B">C04B22/06</further-classification>
        <further-classification edition="200601120241205B">C04B22/10</further-classification>
        <further-classification edition="200601120241205B">C04B22/12</further-classification>
        <further-classification edition="200601120241205B">C04B24/26</further-classification>
        <further-classification edition="200601120241205B">E04B1/90</further-classification>
        <further-classification edition="200601120241205B">E04B2/72</further-classification>
        <further-classification edition="200601120241205B">E04B2/74</further-classification>
        <further-classification edition="200601120241205B">E04C2/36</further-classification>
        <further-classification edition="200601320241205B">C04B103/65</further-classification>
        <further-classification edition="200601320241205B">C04B111/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許健亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許健亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種節能環保輕質預製混凝土鎂牆蜂巢板的材料，其主要係用煅燒菱鎂礦石所得的輕燒粉或低溫煅燒白雲石所得的灰粉(主要成分為MgO)作為膠結劑，再以六水氯化鎂(MgCL2．6H2O)等水溶性鎂鹽為調和劑，再加入水，所形成的輕燒鎂粉和六水氯化鎂而成氯氧鎂水泥，再採用複合外加劑技術，把氣硬性鎂水泥變成了抗水性鎂水泥，克服鎂水泥不耐水的特性。</p>
        <p type="p">製作時，加入適當的EPS顆粒與氯氧鎂水泥及外加劑混合成漿料，再將漿料倒入框狀模具內，使其整平、壓掣並定型成塊狀，待乾燥脫模即成節能環保輕質蜂巢之預製混凝土鎂牆板，本發明為一種新的複合建築材料，克服鎂水泥不耐水的缺點，能發揮氯氧鎂水泥的特性，使該材料所製成的牆板具有高強度、高耐磨、耐高溫、耐低溫、高耐火、抗鹽滷腐蝕、耐候性、輕質低密度、快凝性、抗滲性、抗震性及易於加工的優點，實為產業上的新科技材料。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">a:加入適當的EPS顆粒與氯氧鎂水泥混合成漿料</p>
        <p type="p">b:將漿料倒入框狀模具內，使其整平、壓掣並定型成塊狀</p>
        <p type="p">c:待乾燥脫模即成節能環保輕質之預製混凝土鎂牆蜂巢板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="213" publication-number="202615221">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615221</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138033</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>扭力結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241216B">B25B23/143</main-classification>
        <further-classification edition="200601120241216B">B25B23/155</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和嘉興精密股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭文進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭文進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種扭力結構，其係包括：一第一本體係設有一第一容置槽；一第二本體組係包括一第二本體、一螺桿座、一螺桿、一螺合件及一彈性元件；該第二本體係設有一第一螺合部；該螺桿座內係設有一第二螺合部；該螺桿設有一第三螺合部；該螺合件與該第三螺合部相螺設，該螺合件抵於該螺桿座上；一第三本體組係包括：一第三本體及一轉動件；該第三本體設有一第四螺合部；該轉動件外部設有一第一外周面、一第一內周面、複數第一凸緣及複數第一凹部；一移動組包括一移動件、一第一珠體及一第二珠體；該移動件設有一第一抵部及一第二抵部。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:第一本體</p>
        <p type="p">11:第一容置槽</p>
        <p type="p">20:第二本體組</p>
        <p type="p">21:第二本體</p>
        <p type="p">28:彈性元件</p>
        <p type="p">30:第三本體組</p>
        <p type="p">40:移動組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="214" publication-number="202615218">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615218</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138034</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>棘輪扳手結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241216B">B25B13/46</main-classification>
        <further-classification edition="200601120241216B">B25B23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>暘陞精密科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖嘉冠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種棘輪扳手結構，其係包括：一本體係設有一第一容槽、一第二容槽、一容蓋槽、一第一扣環槽及一第一抵部；一棘輪係設有一棘輪部、一套合部、一第一樞部、一第二扣環槽及一第二樞部；一制齒設有一咬合部，該咬合部係與該棘輪部相嚙合；一第一扣環係容設於該第一扣環槽及該第二扣環槽內，使該棘輪係樞設於該第一容槽內而不脫出，該第一扣環二端係設有二壓抵部，二個該壓抵部係凸伸於該第二容槽範圍處，二個該壓抵部抵於該制齒上，使該制齒受限於該第一扣環之限制而不脫出該第二容槽外；一蓋體係容設於該容蓋槽處。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:本體</p>
        <p type="p">11:第一容槽</p>
        <p type="p">20:棘輪</p>
        <p type="p">30:制齒</p>
        <p type="p">40:轉向組</p>
        <p type="p">41:轉向件</p>
        <p type="p">42:第一頂帽</p>
        <p type="p">43:彈性件</p>
        <p type="p">44:第二頂帽</p>
        <p type="p">50:第一扣環</p>
        <p type="p">51:壓抵部</p>
        <p type="p">60:蓋體</p>
        <p type="p">61:穿孔</p>
        <p type="p">62:第二結合部</p>
        <p type="p">70:結合件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="215" publication-number="202616526">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616526</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138041</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靜電放電保護結構及靜電放電保護裝置</chinese-title>
        <english-title>ELECTROSTATIC DISCHARGE PROTECTION STRUCTURE AND DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241011B">H01L23/60</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>世界先進積體電路股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張廷瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊介堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, CHIEH-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖顯峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, HSIEN-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周業甯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOU, YEH-NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李建興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JIAN-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種靜電放電保護結構，包括一基底、第一至第四井區、第一至第四摻雜區以及一分隔結構。基底具有一第一導電型。第一及第三井區設置於基底之中，並具有一第二導電型。第二井區設置於第一井區之中，並具有第一導電型。第一摻雜區設置於第一井區之中，並具有第一導電型。第二摻雜區設置於第二井區之中，並具有第二導電型。第四井區設置於第三井區之中，並具有第一導電型。第三摻雜區設置於第四井區之中，並具有第二導電型。第四摻雜區設置於第三井區之中，並具有第一導電型。分隔結構設置於基底之中，用以分隔第一及第三井區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrostatic discharge protection structure is provided. A first well is disposed in a substrate. A second well and a first doped region are disposed in the first well. A second doped region is disposed in the second well. A third well is disposed in the substrate. A fourth well is disposed in the third well. A third doped region is disposed in the fourth well. A fourth doped region is disposed in the third well. A partition structure is disposed in the substrate to isolate the first well from the third well. Each of the substrate, the second well, the third well, the first doped region and the fourth doped region has a first conductivity type. Each of the first well, the third well, the second doped region and the third doped region has a second conductivity type.</p>
      </isu-abst>
      <representative-img>
        <p type="p">VH、VL:電源端</p>
        <p type="p">200:靜電放電保護結構</p>
        <p type="p">210:基底</p>
        <p type="p">W1~W4:井區</p>
        <p type="p">D1~D4:摻雜區</p>
        <p type="p">221~223:分隔結構</p>
        <p type="p">h1~h3:深度</p>
        <p type="p">w:寬度</p>
        <p type="p">231、232:內連結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="216" publication-number="202616922">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616922</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138042</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置及其製造方法</chinese-title>
        <english-title>DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10H29/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范鐸正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, TO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝承志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHENG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施景耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, CHING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊文瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, WEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林冠亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUAN-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置包括驅動線路基板、多個發光元件、色轉換結構、封裝層、對向基板及堤岸層。多個發光元件設置於驅動線路基板上，且與驅動線路基板電性連接。色轉換結構包覆多個發光元件的第一發光元件。封裝層設置於驅動線路基板上。對向基板設置於驅動線路基板的對向。堤岸層設置於對向基板上，且位於對向基板與封裝層之間。色轉換結構的頂面與對向基板之間存在低折射率材料。低折射率材料的折射率小於或等於1.2。此外，上述顯示裝置的製造方法也被提出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display apparatus includes a driving circuit substrate, light-emitting elements, a color conversion structure, a encapsulation layer, an opposite substrate and a bank layer. The light-emitting elements are disposed on the driving circuit substrate and are electrically connected to the driving circuit substrate. The color conversion structure covers a first light-emitting element of the light-emitting elements. The encapsulation layer is disposed on the driving circuit substrate. The opposite substrate is disposed opposite to the driving circuit substrate. The bank layer is disposed on the opposite substrate and is located between the opposite substrate and the encapsulation layer. There is a low refractive index material between a top surface of the color conversion structure and the opposing substrate. Refractive index of the low refractive index material is less than or equal to 1.2. In addition, a manufacturing method of the display apparatus is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:顯示裝置</p>
        <p type="p">100:發光元件基板</p>
        <p type="p">110:驅動線路基板</p>
        <p type="p">110a:第一區</p>
        <p type="p">110b:第二區</p>
        <p type="p">120:發光元件</p>
        <p type="p">120B:第三發光元件</p>
        <p type="p">120G:第二發光元件</p>
        <p type="p">120R:第一發光元件</p>
        <p type="p">122:主動層</p>
        <p type="p">130:色轉換結構</p>
        <p type="p">130s、220s1、220s2、220s3:側壁</p>
        <p type="p">130t、140t:頂面</p>
        <p type="p">140:封裝層</p>
        <p type="p">140a:貫孔</p>
        <p type="p">142:第一部分</p>
        <p type="p">144:第二部分</p>
        <p type="p">200:對向元件</p>
        <p type="p">210:對向基板</p>
        <p type="p">212:透明基底</p>
        <p type="p">214:遮光圖案層</p>
        <p type="p">214a、220a:開口</p>
        <p type="p">216:彩色濾光圖案</p>
        <p type="p">216R:第一彩色濾光圖案</p>
        <p type="p">216G:第二彩色濾光圖案</p>
        <p type="p">216B:第三彩色濾光圖案</p>
        <p type="p">220:堤岸層</p>
        <p type="p">220aR:第一開口</p>
        <p type="p">220aG:第二開口</p>
        <p type="p">220aB:第三開口</p>
        <p type="p">300:低折射率材料</p>
        <p type="p">310、320:部分</p>
        <p type="p">AG1:第一空氣間隙</p>
        <p type="p">AG2:第二空氣間隙</p>
        <p type="p">AG3:第三空氣間隙</p>
        <p type="p">D1、D3、D4:距離</p>
        <p type="p">G120:發光元件組</p>
        <p type="p">G216:彩色濾光圖案組</p>
        <p type="p">H120:高度</p>
        <p type="p">I:界面</p>
        <p type="p">L:第四色光</p>
        <p type="p">T130、T216、T220、TAG2、TAG3:厚度</p>
        <p type="p">T140、T142、T144、T214:膜厚</p>
        <p type="p">x、z:方向</p>
        <p type="p">△H:差</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="217" publication-number="202616897">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616897</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138047</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10F19/50</main-classification>
        <further-classification edition="202501120250102B">H10D99/00</further-classification>
        <further-classification edition="200601120250102B">H01L21/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台亞半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳厚潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HOU-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵駿昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAO, CHUN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁國隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體結構及其製造方法，其中半導體結構包含一體矽（Bulk Silicon）基板、一氧化層、一圖案化多晶矽層及一圖案化磊晶層。氧化層設置於體矽基板上方，圖案化多晶矽層設置於氧化層上方，圖案化磊晶層設置於圖案化多晶矽層上方。其中，圖案化磊晶層具有一光電構件及一控制電路，光電構件及控制電路因應圖案化多晶矽層彼此空間隔離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes a bulk silicon substrate, an oxide layer, a patterned polycrystalline silicon layer and a patterned epitaxial layer. The oxide layer is disposed above the bulk silicon substrate, the patterned polycrystalline silicon layer is disposed above the oxide layer, and the patterned epitaxial layer is disposed above the patterned polycrystalline silicon layer. The patterned epitaxial layer has an optoelectronic component and a control circuit. The optoelectronic component and the control circuit are spatially isolated from each other due to the patterned polycrystalline silicon layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:體矽基板</p>
        <p type="p">110:氧化層</p>
        <p type="p">120:多晶矽層</p>
        <p type="p">130:磊晶層</p>
        <p type="p">O:光電構件</p>
        <p type="p">C:控制電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="218" publication-number="202616663">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616663</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138049</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>頻率合成器</chinese-title>
        <english-title>FREQUENCY SYNTHESIZER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">H03L7/08</main-classification>
        <further-classification edition="200601120250102B">G06F1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇景光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIMAX TECHNOLOGIES LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭光偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, KUANG WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林敬倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種頻率合成器，包含鎖相迴路，其包含壓控振盪器，間接受控於控制電壓以產生輸出信號；及寬調變範圍控制器，根據控制電壓以直接控制鎖相迴路，據以將輸出頻率範圍切割為多個連續的子頻帶。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A frequency synthesizer includes a phase-locked loop that includes a voltage-controlled oscillator being indirectly controlled by a control voltage to generate an output signal; and a wide modulation range controller that directly controls the phase-locked loop according to the control voltage, thereby dividing output frequency range into multiple consecutive sub-frequency bands.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:頻率合成器</p>
        <p type="p">11:鎖相迴路</p>
        <p type="p">111:除頻器</p>
        <p type="p">112:相位頻率偵測器</p>
        <p type="p">113:多工器</p>
        <p type="p">114:電荷泵</p>
        <p type="p">115:低通濾波器</p>
        <p type="p">116:壓控振盪器</p>
        <p type="p">117:緩衝器</p>
        <p type="p">118:調變器</p>
        <p type="p">119:三角波產生器</p>
        <p type="p">12:寬調變範圍控制器</p>
        <p type="p">Fref:參考信號</p>
        <p type="p">Fdiv:除頻信號</p>
        <p type="p">COUNT:計數值</p>
        <p type="p">ZG:選定偏壓</p>
        <p type="p">VCTRL:控制電壓</p>
        <p type="p">Fout:輸出信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="219" publication-number="202616389">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616389</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138051</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>降低碳化矽磊晶缺陷的方法</chinese-title>
        <english-title>METHOD FOR REDUCING DEFECTS IN SILICON CARBIDE EPITAXIAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">H01L21/322</main-classification>
        <further-classification edition="200601120250102B">H01L21/306</further-classification>
        <further-classification edition="200601120250102B">H01L21/20</further-classification>
        <further-classification edition="202501120250102B">H10D62/83</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華旭先進股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUA HSU ADVANCED TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭穆光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JENQ, MUH-GUENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林永祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUNG-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林秉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾頎堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, CHI-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種降低碳化矽磊晶缺陷的方法，提供原生基底，原生基底具有原生頂面；在蝕刻劑的存在下施行蝕刻製程，在原生頂面形成複數個蝕刻坑洞；施行填補製程，將填補劑填補在複數個蝕刻坑洞中；在填補劑的存在下施行磊晶製程，將碳化矽磊晶填滿複數個蝕刻坑洞並外延形成復原層。復原層中的縱向延伸缺陷密度小於復原層以外的原生基底中的縱向延伸缺陷密度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for reducing defects in silicon carbide epitaxial by providing a native substrate with a native top surface; performing an etching process in the presence of an etchant to form a plurality of etching pits on the native top surface; performing a filling process to fill a filler in the etching pits; performing an epitaxial process in the presence of the filler to fill up the etching pits with silicon carbide epitaxial crystals and to epitaxially form a recovery layer. A vertical extending defect density in the recovery layer is less than a vertical extending defect density in the native substrate outside of the recovery layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:原生頂面</p>
        <p type="p">120:緩衝層</p>
        <p type="p">121:蝕刻坑洞</p>
        <p type="p">140:填補劑</p>
        <p type="p">142:先流</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="220" publication-number="202615839">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615839</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138061</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於揮發性有機化合物之快速採樣便攜式裝置</chinese-title>
        <english-title>RAPID SAMPLING PORTABLE DEVICE FOR VOLATILE ORGANIC COMPOUNDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">G01N1/24</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立嘉義大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHIAYI UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龔毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNG, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝博全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, BO-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於揮發性有機化合物之快速採樣便攜式裝置，係專門用於在植物環境中快速取樣和濃縮揮發性有機化合物。本發明之用於揮發性有機化合物之快速採樣便攜式裝置僅需30分鐘的採樣時間，就能夠生成約100倍於傳統方法的氣相層析質譜儀（GC-MS）信號強度，同時減少了干擾峰的產生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a rapid sampling portable device for volatile organic compounds, which is specially used for rapid sampling and concentrating of volatile organic compounds in a plant environment.        &lt;br/&gt;The rapid sampling portable device for volatile organic compounds of the present invention only needs 30 minutes of sampling time to generate a gas chromatography mass spectrometer (GC-MS) signal intensity that is approximately 100 times that of the conventional method, at the same time, the generation of interference peaks is reduced.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:裝置</p>
        <p type="p">101:調節器與電源</p>
        <p type="p">102:進氣用空氣幫浦</p>
        <p type="p">103:進氣用氣體流量調節器</p>
        <p type="p">104:過濾器</p>
        <p type="p">105:待分析樣品室</p>
        <p type="p">106:氣相層析用吸附管柱</p>
        <p type="p">107:出氣用氣體流量調節器</p>
        <p type="p">108:出氣用空氣幫浦</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="221" publication-number="202616078">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616078</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138066</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體控制方法及記憶體控制裝置</chinese-title>
        <english-title>MEMORY CONTROL METHOD AND MEMORY CONTROL DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">G06F11/22</main-classification>
        <further-classification edition="200601120250102B">G06F11/30</further-classification>
        <further-classification edition="200601120250102B">G06F13/10</further-classification>
        <further-classification edition="200601120250102B">G06F13/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒秉翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSOU, PING-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　紀匡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, JI-KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王柏超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, BO-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊皓中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HAO-JHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林秉民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, BING-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬立謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAN, LI-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林韋翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUN-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種記憶體控制方法，適用於一主機板，主機板包含一基本輸入輸出系統以及一記憶體，記憶體具有複數記憶體參數項，基本輸入輸出系統儲存對應於複數記憶體參數項之複數原始參數值。首先，在複數記憶體參數項中選擇其中之一。隨後，透過訊號強度驗證找出對應於所選擇之記憶體參數項之一有效參數值。然後，確認有效參數值是否優於相對應之原始參數值。當有效參數值優於相對應之原始參數值，利用有效參數值進行穩定性驗證。當有效參數值通過穩定性驗證，利用有效參數值取代相對應之原始參數值。本案並提供一種記憶體控制裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory control method for a main board having a BIOS and a memory is provided. The memory features a plurality of memory parameter items, and there is an original parameter set including a plurality of ordinary parameter values corresponding to the plurality of memory parameter items stored in the BIOS. Firstly, one of the memory parameter items is selected. Then, an effective parameter value for the selected memory parameter item is identified by using signal strength verification. Then, the effective parameter value and its corresponding ordinary parameter value are compared. When the effective parameter value is better than its corresponding ordinary parameter value, the effective parameter value is used for doing stability verification test. The effective parameter value is used to replace the original parameter value when passing the stability verification test. A memory control device is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S310,S320,S330,S340,S350,S360,S370:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="222" publication-number="202615726">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615726</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138077</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>銅箔及其製造方法</chinese-title>
        <english-title>COPPER FOIL AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241011B">C25D3/38</main-classification>
        <further-classification edition="200601120241011B">C25D5/10</further-classification>
        <further-classification edition="200601120241011B">C25D7/06</further-classification>
        <further-classification edition="200601120241011B">C25D21/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞塑膠工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN YA PLASTICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁敬堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, CHING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭維昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, WEI-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝育淇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, YU-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種銅箔的製造方法，包括：提供生箔；以及對所述生箔進行多次的粗化處理以及多次的固化處理。所述粗化處理所使用的電鍍液為包括含氮有機化合物的硫酸銅水溶液。所述固化處理所使用的電鍍液為包括含氮有機化合物的硫酸銅水溶液。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method for a copper foil including the following steps is provided: providing a base foil; and performing multiple roughening treatments and multiple solidification treatments on the base foil. An electroplating solution used in the roughening treatment is a copper sulfate aqueous solution including a nitrogen-containing organic compound. An electroplating solution used in the solidification treatments is a copper sulfate aqueous solution including a nitrogen-containing organic compound.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S91、S92、S93、S94、S95:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="223" publication-number="202616391">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616391</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138078</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感測晶片的製造方法</chinese-title>
        <english-title>MANUFACTURING METHOD OF SENSOR CHIP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">H01L21/4763</main-classification>
        <further-classification edition="200601120241104B">H01L23/15</further-classification>
        <further-classification edition="200601120241104B">G01N27/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞塑膠工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN YA PLASTICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁敬堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, CHING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹俊哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, CHUN-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周逸蓁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, YI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">感測晶片的製造方法包括以下步驟，其中感測晶片被配置為感測溶液的性質。提供基板。在基板上形成導電氧化物層，其中導電氧化物層包括多個導電氧化物圖案，多個導電氧化物圖案彼此電性隔離。在部分導電氧化物層上形成導電層，其中導電層與導電氧化物層直接接觸。在導電氧化物層及導電層上形成保護層，其中保護層包括多個開口，以定義感測晶片的感測區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of a sensor chip includes the following steps, where the sensor chip is configured to measure properties of a solution. A substrate is provided. A conductive oxide layer is formed on the substrate. The conductive oxide layer includes a plurality of conductive oxide patterns which is electrically isolated from each other. A conductive layer is formed on a portion of the conductive oxide layer. The conductive layer and the conductive oxide layer are in direct contact. A protective layer is formed on the conductive oxide layer and the conductive layer. The protective layer includes openings to define sensing areas of the sensor chip.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:感測晶片</p>
        <p type="p">100:基板</p>
        <p type="p">102:第一保護層</p>
        <p type="p">110a:第一導電氧化物圖案</p>
        <p type="p">110b:第二導電氧化物圖案</p>
        <p type="p">110c:第三導電氧化物圖案</p>
        <p type="p">110d:第四導電氧化物圖案</p>
        <p type="p">120a:第一導電圖案</p>
        <p type="p">120b:第二導電圖案</p>
        <p type="p">120c:第三導電圖案</p>
        <p type="p">130:第二保護層</p>
        <p type="p">140:參考電極</p>
        <p type="p">152:第一感測圖案</p>
        <p type="p">154:第二感測圖案</p>
        <p type="p">156:第三感測圖案</p>
        <p type="p">158:校正圖案</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="224" publication-number="202615579">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615579</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138079</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物</chinese-title>
        <english-title>RESIN COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241014B">C08L63/00</main-classification>
        <further-classification edition="200601120241014B">C08K9/04</further-classification>
        <further-classification edition="200601120241014B">C08K3/36</further-classification>
        <further-classification edition="200601120241014B">C08K5/3432</further-classification>
        <further-classification edition="200601120241014B">C08K13/02</further-classification>
        <further-classification edition="200601120241014B">H01L23/29</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞塑膠工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN YA PLASTICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁敬堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, CHING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳立昀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LI YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃威儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEI-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張宏毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HUNG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉家霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIA-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種樹脂組成物。以樹脂組成物的總重量計，樹脂組成物包括3重量%至10重量%的含萘環結構的固態環氧樹脂、10重量%至30重量%的活性酯化合物、50重量%至80重量%的無機填充材料、以及0.05重量%至0.3重量%的促進劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A resin composition is provided. The resin composition includes 3 to 10 wt% of a solid epoxy resin having a naphthalene ring structure, 10 to 30 wt% of an active ester compound, 50 to 80 wt% of an inorganic filler material, and 0.05 to 0.3 wt% of an accelerant, based on a total weight of the resin composition.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="225" publication-number="202615517">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615517</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138081</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組合物</chinese-title>
        <english-title>RESIN COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241011B">C08F232/08</main-classification>
        <further-classification edition="200601120241011B">C08F212/34</further-classification>
        <further-classification edition="200601120241011B">C08F236/20</further-classification>
        <further-classification edition="200601120241011B">C08F8/46</further-classification>
        <further-classification edition="200601120241011B">C08J5/24</further-classification>
        <further-classification edition="200601120241011B">B32B15/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞塑膠工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN YA PLASTICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁敬堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, CHING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張宏毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HUNG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳其霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種樹脂組合物，包括具有以下式1所示結構的第一聚合物：        &lt;br/&gt;&lt;img align="absmiddle" height="49px" width="240px" file="ed10001.jpg" alt="ed10001.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;（式1）        &lt;br/&gt;其中，每一R1或R2各自獨立選自由以下基團所組成的群組：        &lt;br/&gt;&lt;img align="absmiddle" height="54px" width="55px" file="ed10002.jpg" alt="ed10002.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="49px" width="54px" file="ed10003.jpg" alt="ed10003.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="38px" width="41px" file="ed10004.jpg" alt="ed10004.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="59px" width="68px" file="ed10005.jpg" alt="ed10005.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="58px" width="36px" file="ed10006.jpg" alt="ed10006.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="49px" width="36px" file="ed10007.jpg" alt="ed10007.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="56px" width="37px" file="ed10008.jpg" alt="ed10008.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="65px" width="46px" file="ed10009.jpg" alt="ed10009.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="66px" width="83px" file="ed10010.jpg" alt="ed10010.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="78px" width="96px" file="ed10011.jpg" alt="ed10011.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="72px" width="60px" file="ed10012.jpg" alt="ed10012.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="94px" width="71px" file="ed10013.jpg" alt="ed10013.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="67px" width="37px" file="ed10014.jpg" alt="ed10014.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="72px" width="38px" file="ed10015.jpg" alt="ed10015.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="61px" width="49px" file="ed10016.jpg" alt="ed10016.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="41px" width="44px" file="ed10017.jpg" alt="ed10017.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="44px" width="40px" file="ed10018.jpg" alt="ed10018.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="63px" width="59px" file="ed10019.jpg" alt="ed10019.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="57px" width="63px" file="ed10020.jpg" alt="ed10020.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="48px" width="52px" file="ed10021.jpg" alt="ed10021.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="28px" width="78px" file="ed10022.jpg" alt="ed10022.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="32px" width="69px" file="ed10023.jpg" alt="ed10023.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;img align="absmiddle" height="28px" width="75px" file="ed10024.jpg" alt="ed10024.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="32px" width="55px" file="ed10025.jpg" alt="ed10025.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="31px" width="54px" file="ed10026.jpg" alt="ed10026.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="41px" width="70px" file="ed10027.jpg" alt="ed10027.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="41px" width="71px" file="ed10028.jpg" alt="ed10028.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="47px" width="82px" file="ed10029.jpg" alt="ed10029.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="47px" width="86px" file="ed10030.jpg" alt="ed10030.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="61px" width="66px" file="ed10031.jpg" alt="ed10031.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;以及        &lt;img align="absmiddle" height="64px" width="58px" file="ed10032.jpg" alt="ed10032.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;，        &lt;br/&gt;其中*表示鍵結位點；m為0至5的整數；n為1至10的整數；p為1至10的整數。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A resin composition is provide. The resin composition includes a first polymer having a structure of Formula 1 below:        &lt;br/&gt;&lt;img align="absmiddle" height="49px" width="240px" file="ed10001.jpg" alt="ed10001.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;(Formula 1)        &lt;br/&gt;wherein each R1 or R2 is independently selected from the group consisting of        &lt;br/&gt;&lt;img align="absmiddle" height="54px" width="55px" file="ed10002.jpg" alt="ed10002.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="49px" width="54px" file="ed10003.jpg" alt="ed10003.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="38px" width="41px" file="ed10004.jpg" alt="ed10004.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="59px" width="68px" file="ed10005.jpg" alt="ed10005.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="58px" width="36px" file="ed10006.jpg" alt="ed10006.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="49px" width="36px" file="ed10007.jpg" alt="ed10007.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="56px" width="37px" file="ed10008.jpg" alt="ed10008.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="65px" width="46px" file="ed10009.jpg" alt="ed10009.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="66px" width="83px" file="ed10010.jpg" alt="ed10010.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="78px" width="96px" file="ed10011.jpg" alt="ed10011.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="72px" width="60px" file="ed10012.jpg" alt="ed10012.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="94px" width="71px" file="ed10013.jpg" alt="ed10013.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="67px" width="37px" file="ed10014.jpg" alt="ed10014.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="72px" width="38px" file="ed10015.jpg" alt="ed10015.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="61px" width="49px" file="ed10016.jpg" alt="ed10016.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="41px" width="44px" file="ed10017.jpg" alt="ed10017.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="44px" width="40px" file="ed10018.jpg" alt="ed10018.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="63px" width="59px" file="ed10019.jpg" alt="ed10019.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="57px" width="63px" file="ed10020.jpg" alt="ed10020.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="48px" width="52px" file="ed10021.jpg" alt="ed10021.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="28px" width="78px" file="ed10022.jpg" alt="ed10022.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="32px" width="69px" file="ed10023.jpg" alt="ed10023.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="28px" width="75px" file="ed10024.jpg" alt="ed10024.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="32px" width="55px" file="ed10025.jpg" alt="ed10025.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="31px" width="54px" file="ed10026.jpg" alt="ed10026.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="41px" width="70px" file="ed10027.jpg" alt="ed10027.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="41px" width="71px" file="ed10028.jpg" alt="ed10028.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="47px" width="82px" file="ed10029.jpg" alt="ed10029.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="47px" width="86px" file="ed10030.jpg" alt="ed10030.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="61px" width="66px" file="ed10031.jpg" alt="ed10031.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;and        &lt;img align="absmiddle" height="64px" width="58px" file="ed10032.jpg" alt="ed10032.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;br/&gt;wherein * represents a bonding site; m is an integral from 0 to 5; n is an integral from 1 to 10; and p is an integral from 1 to 10.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="226" publication-number="202616815">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616815</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138082</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體元件及其製造方法</chinese-title>
        <english-title>MEMORY DEVICE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241011B">H10B12/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳皇男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUANG-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種記憶體元件及其製造方法。記憶體元件包括：存取電晶體；以及電容接觸結構，經配置以將存取電晶體的一汲極/源極連接至上方的儲存電容，且包括：底部接觸結構；以及頂部接觸結構，設置於底部接觸結構上方，且包括阻障層與經由阻障層而連接底部接觸結構的導體填充材料。阻障層沿著導體填充材料的底部與兩相對側壁延伸。導體填充材料的下部填入於阻障層定義出的凹陷，且導體填充材料的上部高於阻障層的最頂端且相對於導體填充材料的下部而具有更大寬度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device and a manufacturing method thereof are provided. The memory device includes: an access transistor; and a capacitor contact structure, configured to connect a source/drain of the access transistor to an overlying storage capacitor, and including: a bottom contact structure; and a top contact structure, disposed on the bottom contact structure, and including an adhesion layer and a conductive filling material in contact with the bottom contact structure through the adhesion layer. The adhesion layer extends along a bottom surface and two opposite sidewalls of the conductive filling material. A bottom part of the conductive filling material is filled in a recess defined by the adhesion layer, and a top part of the conductive filling material is higher than a topmost end of the adhesion layer and has a greater width as compared to the bottom part of the conductive filling material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:主動區</p>
        <p type="p">102:字元線</p>
        <p type="p">108:電容接觸結構</p>
        <p type="p">110:基底</p>
        <p type="p">112:隔離結構</p>
        <p type="p">118:絕緣插塞</p>
        <p type="p">124:間隙壁</p>
        <p type="p">126:底部接觸結構</p>
        <p type="p">128:頂部接觸結構</p>
        <p type="p">130:金屬矽化物層</p>
        <p type="p">132:阻障層</p>
        <p type="p">134:導體填充材料</p>
        <p type="p">134b:下部</p>
        <p type="p">134t:上部</p>
        <p type="p">GC:位元線堆疊結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="227" publication-number="202615122">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615122</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138087</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電動車滅火裝置及電動車滅火緊急替代裝置</chinese-title>
        <english-title>ELECTRIC VEHICLE FIRE EXTINGUISHING INSTALLATION AND ELECTRIC VEHICLE EMERGENCY REPLACEMENT FIRE EXTINGUISHING INSTALLATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241216B">A62C3/07</main-classification>
        <further-classification edition="200601120241216B">A62C3/16</further-classification>
        <further-classification edition="200601120241216B">A62C31/00</further-classification>
        <further-classification edition="200601120241216B">A62C37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林哲儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JHE-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林哲儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JHE-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電動車滅火裝置及電動車滅火緊急替代裝置，它有一電動車電池室內結構空腔通道並將其延伸至車體結構表面上的接頭。如第一種實施例，則銜接在車外的相對應接頭、管線及控制盤、滅火藥劑外部供給，當探測器感應火災時，便傳信給控制盤，自動開啟滅火藥劑管閥，釋放其藥劑。如第二種實施例，則銜接在車外的相對應接頭、管線、滅火水源外部供給，並手動開啟滅火水源管閥，釋放其水源。二實施例釋放的藥劑或水源，最終皆再以行經管線、接頭、車內通道的路徑方式，直接滅火，以快速縮短滅火時間、減少滅火材料用量及災損。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">100:電動車滅火裝置</p>
        <p type="p">20:車內滅火藥劑通道單元</p>
        <p type="p">21:電動車車內結構</p>
        <p type="p">22:車內滅火藥劑通道</p>
        <p type="p">30:固定式嵌入接頭單元</p>
        <p type="p">40:外部活動式接頭單元</p>
        <p type="p">50:可活動所有管線的延長單元</p>
        <p type="p">60:控制盤單元</p>
        <p type="p">70:滅火藥劑外部供給單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="228" publication-number="202616161">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616161</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138092</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>地址校正方法及其系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250203B">G06Q10/08</main-classification>
        <further-classification edition="201901120250203B">G06F16/215</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大聯大控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李子瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, TZU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋品燊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNG, PIN SEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種地址校正方法，藉由一地址校正系統來實施，該地址校正系統包含一儲存模組，及一電連接該儲存模組的處理模組。該儲存模組儲存有多筆對應多個客戶的客戶資料，每筆客戶資料包含所對應之客戶的一客戶識別資訊及至少一客戶地址。該處理模組根據一包含一待派送客戶識別資訊及一待派送地址的派送請求，自該等客戶資料之客戶地址獲得至少一候選地址。判定該至少一候選地址中存在至少一相似地址時，將該至少一相似地址作為一地址校正結果，以達到將運送地點、運送公司、運送地址校正為同一地址的功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">31~37:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="229" publication-number="202615595">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615595</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138095</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>降低寄生電感或寄生電容的方法及導電塗料之用途</chinese-title>
        <english-title>METHOD FOR REDUCING PARASITIC INDUCTANCE OR PARASITIC CAPACITANCE AND APPLICATIONS OF CONDUCTIVE COATING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250324B">C09D5/24</main-classification>
        <further-classification edition="200601120250324B">H01H13/785</further-classification>
        <further-classification edition="200601120250324B">H01B1/24</further-classification>
        <further-classification edition="200701120250324B">H02M1/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浩盛科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAO-SHENG TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳世偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃青鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, QING-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧治中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一種降低寄生電感或寄生電容的方法，其係將有電力傳導經過處的接點處塗佈導電塗料。透過本發明所述之方法，其可以降低寄生電感或寄生電容，並且操作方式單純，無需改變電路設計或是增加任何電子電路元件，並可使得電力傳輸的性能與穩定性都可以大幅提升。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of reducing parasitic inductance or parasitic capacitance of the present invention is to apply conductive paint to the contacts where electricity is transmitted. Through the method of the present invention, the parasitic inductance or parasitic capacitance can be reduced, and the operation method is simple, without changing the circuit design or adding any electronic circuit components, and can greatly improve the performance and stability of power transmission.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="230" publication-number="202616597">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616597</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138097</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電子式保險絲的控制方法及控制裝置</chinese-title>
        <english-title>CONTROL METHOD AND CONTROL DEVICE FOR ELECTRONIC FUSE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250805B">H02H9/02</main-classification>
        <further-classification edition="200601120250805B">H02H3/02</further-classification>
        <further-classification edition="200601120250805B">H01H85/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>能創半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERX SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王國任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, KUO-JENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂皓鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, HAO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃溫仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEN-REN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於一電子式保險絲的控制方法，包含有以一時間間隔偵測通過該電子式保險絲之電流；儲存複數個時點所偵測的複數個電流值；根據該複數個電流值，判斷對應於複數個行程時間的複數個行程電流，包含有將該複數個行程電流分為兩部分進行判斷，第一部分對儲存的電流值進行複數個算數平均運算程序所得，而第二部分對當前及先前計算而得的行程電流進行複數個算數平均運算程序所得；比較該複數個行程電流與一預設行程電流對行程時間曲線中對應於該複數個行程時間的預設電流值，以產生複數個比較結果，藉以控制該電子式保險絲的狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A control method for an electronic fuse includes detecting current passing through the electronic fuse at regular time intervals; storing a plurality of current values detected at a plurality of time points; determining a plurality of trip currents corresponding to a plurality of trip times based on the plurality of current values, including dividing the plurality of trip currents into two parts for determination, where the first part is obtained by performing a plurality of arithmetic averaging operations on the stored current values, and the second part is obtained by performing a plurality of arithmetic averaging operations on the current and previously calculated trip currents; comparing the plurality of trip currents with current values corresponding to the plurality of trip times in a trip current versus trip time curve, to generate a plurality of comparison results for controlling a state of the electronic fuse based on the plurality of multiple comparison results.</p>
      </isu-abst>
      <representative-img>
        <p type="p">40:判斷流程</p>
        <p type="p">400~408:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="231" publication-number="202615271">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615271</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138105</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>汽車座椅調整固定裝置及其方法</chinese-title>
        <english-title>AUTOMOTIVE SEAT ADJUSTMENT AND FIXING DEVICE AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250328B">B60N2/22</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周柏均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, BO-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周柏均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, BO-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧治中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種汽車座椅調整固定裝置，用於調整汽車椅背相對汽車坐墊的傾斜角度，本發明包含轉動單元、徑向固定單元和軸向固定單元。轉動單元由固定件、旋轉件和外殼體組成，固定件與外殼體連接於汽車坐墊，旋轉件連接於汽車椅背。徑向固定單元包括插塊和彈性件，彈性件推動插塊固定旋轉件。軸向固定單元包括蓋體、壓片和鎖固件，蓋體沿軸向壓抵於轉動單元上，有效防止旋轉件和固定件的軸向鬆動。本創作確保長時間使用後調整的順暢性和可靠性，提高駕駛和乘坐的舒適度，並防止因部件鬆動引起的調整卡頓或故障，提升穩定性和使用壽命。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a automotive seat adjustment and fixing device for adjusting the inclination angle of the car seat back relative to the car seat cushion. The invention includes a rotating unit, a radial fixing unit and an axial fixing unit. The rotating unit is composed of a fixed part, a rotating part and an outer shell. The fixed part and the outer shell are connected to the car seat cushion, and the rotating part is connected to the car seat back. The radial fixing unit includes an insert block and an elastic member, and the elastic member pushes the insert block to fix the rotating member. The axial fixing unit includes a cover body, a pressing piece and a locking piece. The cover body is pressed against the rotating unit in the axial direction, effectively preventing the axial loosening of the rotating piece and the fixed piece. This creation ensures the smoothness and reliability of adjustment after long-term use, improves driving and riding comfort, prevents adjustment jams or failures caused by loose parts, and improves stability and service life.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:裝置</p>
        <p type="p">110:轉動單元</p>
        <p type="p">111:固定件</p>
        <p type="p">112:旋轉件</p>
        <p type="p">113:外殼體</p>
        <p type="p">120:徑向固定單元</p>
        <p type="p">121:插塊</p>
        <p type="p">130:軸向固定單元</p>
        <p type="p">131:蓋體</p>
        <p type="p">132:壓片</p>
        <p type="p">132a:第一壓片</p>
        <p type="p">132b:第二壓片</p>
        <p type="p">133:鎖固件</p>
        <p type="p">133a:頭部</p>
        <p type="p">133b:牙部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="232" publication-number="202616187">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616187</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138108</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>銀行個人化獎勵系統及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250102B">G06Q30/0226</main-classification>
        <further-classification edition="202301120250102B">G06Q30/0207</further-classification>
        <further-classification edition="202301120250102B">G06Q40/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國信託商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CTBC BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李敏瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡聖雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種銀行個人化獎勵系統，適用於與一資料庫伺服器及一客戶端電子裝置通訊，該銀行個人化獎勵系統用於：在接收來自該客戶端電子裝置的多筆目標設定資料之後，根據該等目標設定資料產生分別對應於該等目標設定資料的多筆任務設定資料；傳送多筆身分識別資料至該資料庫伺服器，使該資料庫伺服器根據該等身分識別資料查詢及提供多筆任務進度資料；根據該等任務進度資料執行一轉換積分程序以產生一對應於該等任務進度資料的任務積分資料；接收來自該客戶端電子裝置且對應於該任務積分資料的一兌換指令，並根據該兌換指令使用該任務積分資料執行一兌換獎勵程序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:銀行個人化獎勵系統</p>
        <p type="p">1:處理單元</p>
        <p type="p">2:儲存單元</p>
        <p type="p">200:資料庫伺服器</p>
        <p type="p">300:客戶端電子裝置</p>
        <p type="p">D1:身分識別資料</p>
        <p type="p">D2:轉換積分資料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="233" publication-number="202616100">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616100</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138109</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有自適應提示的學習系統</chinese-title>
        <english-title>LEARNING SYSTEM WITH ADAPTIVE HINT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120241011B">G06F16/2457</main-classification>
        <further-classification edition="200601120241011B">G09B7/02</further-classification>
        <further-classification edition="201201120241011B">G06Q50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>十八豆教育科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>18DICE EDUCATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡立仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, LI-REN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡廷軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, TING-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有自適應提示的學習系統，用以解決習知學習系統只能提供單一提示資訊的問題。係包含：使用者資料庫儲存學習指標；評鑑模組將學習指標中的一者或多者分別乘上其對應的權重並加總來計算出評鑑分數；或者根據特定分數區間將評鑑分數區分為對應的評鑑等級；及答案提示模組接收評鑑分數或評鑑等級，並在預設狀態下，根據評鑑分數或評鑑等級給予對應的提示資訊；提示資訊與題目的標準正確解答的相似度與評鑑分數高低或評鑑等級高低呈負相關。本發明可以提升使用者學習成效的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A learning system with adaptive hint is adapted for solving the problem that the convention learning system provides a single hint information for a question. The learning system includes a user database, an evaluation module and a hint module. The user database stores learning indicators. The evaluation module calculates an evaluation score by multiplying one or more of the learning indicators with a corresponding weight respectively and summing each multiplied result, or provides an evaluation level by classifying the evaluation score based on specific score ranges correspondingly. In a preset state, the hint module receives one of the evaluation score or the evaluation level and correspondingly provides a hint information according to the received one of the evaluation score or the evaluation level. A similarity between the hint information and a standard correct answer of a question is negatively correlated with the received one of the evaluation score or the evaluation level.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:使用者資料庫</p>
        <p type="p">11:數值分級模組</p>
        <p type="p">2:評鑑模組</p>
        <p type="p">21:評鑑規則設置模組</p>
        <p type="p">22:評鑑分級模組</p>
        <p type="p">3:答案提示模組</p>
        <p type="p">31:答案資料庫</p>
        <p type="p">32:提示設定模組</p>
        <p type="p">32M:提示模板</p>
        <p type="p">33:提示供給模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="234" publication-number="202616646">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616646</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138110</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>放大電路及控制方法</chinese-title>
        <english-title>AMPLIFICATION CIRCUIT AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241101B">H03F3/19</main-classification>
        <further-classification edition="200601120241101B">H03F1/26</further-classification>
        <further-classification edition="200601120241101B">H04B1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立積電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHWAVE TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉軒銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HSUAN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">放大電路及控制方法。放大電路包含輸入端、輸出端、第一路徑電路及第二路徑電路。該輸入端接收輸入訊號。該輸出端輸出對應於該輸入訊號之輸出訊號。該第一路徑電路包含共設計電路、放大器電路、第二匹配元件及電性過度應力電路。該共設計電路包含第一匹配元件。該共設計電路之第一端耦接於該輸入端。該電性過度應力電路與該第二匹配元件耦接於該共設計電路之第二端。該放大器電路耦接於該共設計電路之該第二端及該輸出端之間。該第二路徑電路耦接於該輸入端與該輸出端之間。該共設計電路在第一模式提供第一阻抗，在第二模式提供第二阻抗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An amplification circuit and a control method. The amplification circuit includes an input terminal, an output terminal, a first path circuit, and a second path circuit. The input terminal would receive an input signal. The output terminal would output an output signal corresponding to the input signal. The first path circuit includes a co-design circuit, an amplifier circuit, a second matching element, and an electrical overstress (EOS) circuit. The co-design circuit includes a first matching element. A first terminal of the co-design circuit is coupled to the input terminal. The electrical overstress circuit and the second matching element are coupled to a second terminal of the co-design circuit. The amplifier circuit is coupled between the second terminal of the co-design circuit and the output terminal. The second path circuit is coupled between the input terminal and the output terminal. The co-design circuit provides a first impedance in a first mode and a second impedance in a second mode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:放大電路</p>
        <p type="p">110:共設計電路</p>
        <p type="p">120:放大器電路</p>
        <p type="p">130:電性過度應力(EOS)電路</p>
        <p type="p">MT1,MT2:匹配元件</p>
        <p type="p">NI:輸入端</p>
        <p type="p">NO:輸出端</p>
        <p type="p">P1,P2:路徑電路</p>
        <p type="p">RFIN:輸入訊號</p>
        <p type="p">RFOUT:輸出訊號</p>
        <p type="p">α,β:節點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="235" publication-number="202616699">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616699</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138113</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具備改良時序與相關容限的線路接收器</chinese-title>
        <english-title>WIRELINE RECEIVER WITH IMPROVED TIMING AND RELATED MARGINS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">H04L25/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>円星科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>M31 TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭柏辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, PO-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王懷德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUAI-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅正斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOU, ZHENG-BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林致煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH-HUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸舜東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, SHUN-TUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃鼎鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TING-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉明源</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具備改良時序與相關容限的線路接收器，其可包含一資料取樣器、一第一邊緣取樣器、一第二邊緣取樣器、一基本相位偵測電路、一附加相位偵測電路、一時脈電路與一相位偏移電路。該資料取樣器、第一邊緣取樣器與該第二邊緣取樣器可分別在一資料時脈、一第一邊緣時脈與一第二邊緣時脈的觸發下取樣與比較一接收器訊號是否大於一資料臨限位準、一第一臨限位準與一第二臨限位準，以作為相位偵測的依據。基於相位偵測，該時脈電路可提供該第一邊緣時脈與該資料時脈，該相位偏移電路可進行相位偏移以提供該第二邊緣時脈。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wireline receiver with improved timing and related margins, may comprise a data sampler, a first edge sampler, a second edge sampler, a base phase detection circuit, an additional phase detection circuit, a clock circuit and a phase shifting circuit. The data sampler, the first edge sampler and the second edge sampler may sample and compare whether a receiver signal is higher than a data threshold level, a first threshold level and a second threshold level under triggering of a data clock, a first edge clock and a second edge clock respectively, and may therefore provide basis for phase detection. According to the phase detection, the clock circuit may provide the first edge clock and the data clock, and the phase shifting circuit may provide the second edge clock by phase shifting.</p>
      </isu-abst>
      <representative-img>
        <p type="p">210:取樣電路區塊</p>
        <p type="p">220:相位偵測電路區塊</p>
        <p type="p">222、224:相位偵測電路</p>
        <p type="p">230:時脈電路區塊</p>
        <p type="p">240:時脈電路</p>
        <p type="p">250:相位偏移電路</p>
        <p type="p">2221、2241至2243:內部電路</p>
        <p type="p">ck0、cke1、cke2:時脈</p>
        <p type="p">261、262:計數電路</p>
        <p type="p">cnt1、cnt2:計數值</p>
        <p type="p">d_p0、d_phi:偏移量</p>
        <p type="p">sa0至sa3:取樣器</p>
        <p type="p">pd1至pd4:模態相位偵測單元</p>
        <p type="p">L0至L3:臨限位準</p>
        <p type="p">n1至n7、a1至a3、b1至b4:節點</p>
        <p type="p">p1至p4:模態</p>
        <p type="p">H、L:定義值</p>
        <p type="p">sr1、sd1、x1至x3、ud1至ud4、scr1、scr2:訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="236" publication-number="202616142">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616142</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138115</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>海水表面溫度預測之偏差校正方法及其系統</chinese-title>
        <english-title>BIAS CORRECTION METHOD AND SYSTEM THEREOF FOR SEA SURFACE TEMPERATURE PREDICTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250328B">G06N3/0442</main-classification>
        <further-classification edition="201901120250328B">G06F17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中興大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHUNG HSING UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊秉潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUANG, BEN-JEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李淑敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SHU-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王行健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SYING-JYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳芳其</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, FANG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛哈巴胡　那頓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINHABAHU, NADUN NIPULITHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種海表溫度預測之偏差校正方法包含：建立數個時間序列模型，並自數個該時間序列模型選擇至少一最佳時間序列模型；提供數個初始海溫資料，並將該初始海溫資料進行一訓練前處理作業，以獲得數個已前處理海溫資料；將數個該已前處理海溫資料於一主要模型進行一初步訓練作業至一預定值，以獲得數個已初步訓練海溫資料；將數個該已初步訓練海溫資料於一次要模型進行一次級訓練作業，以獲得數個已次級訓練海溫資料；將數個該已次級訓練海溫資料於該次要模型進行一補償計算作業或一公平性計算作業，以獲得至少一最後偏差預測結果；利用該最後偏差預測結果校正至少一海溫預測值，以便獲得一已校正海表溫度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bias correction method for SST prediction includes: providing a plurality of time series models from which to select an optimized model; providing and pre-processing a plurality of SST data to obtain a plurality of pre-processed SST data; training the plurality of pre-processed SST data in a main model with a predetermined value to obtain a plurality of pre-trained SST data; further training the plurality of pre-trained SST data in a secondary model to obtain a plurality of well-trained SST data; calculating the plurality of well-trained SST data in the secondary model for compensation and fairness to obtain at least one final bias prediction result; correction-calculating at least one SST prediction data with the final bias prediction result to obtain a correct SST data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:輸入單元</p>
        <p type="p">10:初始海溫資料</p>
        <p type="p">2:計算單元</p>
        <p type="p">20:時間序列模型</p>
        <p type="p">21:主要模型</p>
        <p type="p">22:次要模型</p>
        <p type="p">3:輸出單元</p>
        <p type="p">30:已校正海表溫度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="237" publication-number="202615767">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615767</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138117</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可變速液壓伺服節能系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">F03B15/08</main-classification>
        <further-classification edition="200601120241230B">F15B11/08</further-classification>
        <further-classification edition="200601120241230B">F15B21/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崑山科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUN SHAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江智偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHIH WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫書煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, SHU HUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱韋丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, WEI CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江宏偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, HUNG WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾天穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, TIEN YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱銘峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王傳勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種可變速液壓伺服節能系統，包含一儲油箱儲放有一液壓油；一液壓泵抽取及輸送該液壓油；一伺服馬達的驅動器接收一流量訊號及一壓力訊號，進而控制該伺服馬達的轉速及扭力，以產生不同的輸出功率；一方向控制閥通過該液壓油；一液壓缸輸入該液壓油，以推動一致動器移動伸出或縮回；一流量偵測單元可供輸入、設定及偵測該液壓油的一流量值，根據該流量值的大小，輸出該流量訊號至該驅動器；一壓力偵測單元可供輸入、設定及偵測該液壓油的一壓力值，根據該壓力值的大小，輸出該壓力訊號至該驅動器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:儲油箱</p>
        <p type="p">11:液壓油</p>
        <p type="p">2:液壓泵</p>
        <p type="p">21:第一管路</p>
        <p type="p">22:過濾網</p>
        <p type="p">3:伺服馬達</p>
        <p type="p">31:驅動器</p>
        <p type="p">4:方向控制閥</p>
        <p type="p">41:第一接頭</p>
        <p type="p">42:第二接頭</p>
        <p type="p">43:進油接頭</p>
        <p type="p">44:回油接頭</p>
        <p type="p">45:第二管路</p>
        <p type="p">5:液壓缸</p>
        <p type="p">51:第一端口</p>
        <p type="p">52:第二端口</p>
        <p type="p">53:第三管路</p>
        <p type="p">54:致動器</p>
        <p type="p">55:活塞</p>
        <p type="p">56:第四管路</p>
        <p type="p">6:流量偵測單元</p>
        <p type="p">7:壓力偵測單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="238" publication-number="202615766">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615766</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138119</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機車的配置構造</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">F02B77/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光陽工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭岳霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡瑞桓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂宗翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周哲民</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種機車的配置構造，機車包括有內燃引擎的動力單元，該動力單元係被連接於車架單元；該動力單元至少包含有汽缸部及該汽缸部一端上的曲軸箱，該汽缸部包含有汽缸本體與連接於該汽缸本體上的汽缸頭；該汽缸頭連接有進氣元件，該進氣元件藉由鎖固元件鎖固於該汽缸頭上，該鎖固元件同軸的鎖設有爆震感知器；藉此該爆震感知器係與鎖固元件同軸與該進氣元件共同鎖固於該動力單元的汽缸部上，從而可減少鎖固該爆震感知器的零件數，同時該鎖固元件可作為傳遞該汽缸部爆震震動的介質，俾能提升該爆震感知器偵測爆震的準確度。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">4:動力單元</p>
        <p type="p">41:汽缸部</p>
        <p type="p">411:汽缸頭蓋</p>
        <p type="p">412:汽缸頭</p>
        <p type="p">413:汽缸本體</p>
        <p type="p">416:張緊器</p>
        <p type="p">419:進氣元件</p>
        <p type="p">4191:出氣口連接埠</p>
        <p type="p">4194:爆震感知器安裝座</p>
        <p type="p">4195:燃油噴嘴安裝座</p>
        <p type="p">42:曲軸箱</p>
        <p type="p">44:最終傳動軸</p>
        <p type="p">45:冷卻風扇</p>
        <p type="p">6:導風罩</p>
        <p type="p">62:下罩</p>
        <p type="p">63:側罩</p>
        <p type="p">7:爆震感知器</p>
        <p type="p">E:電子控制單元</p>
        <p type="p">M:排氣管</p>
        <p type="p">J:燃油噴嘴</p>
        <p type="p">V:節流閥體</p>
        <p type="p">W:空氣濾清器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="239" publication-number="202615292">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615292</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138120</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機車的配置結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120241226B">B62M6/20</main-classification>
        <further-classification edition="200601120241226B">G01L23/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光陽工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭岳霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡瑞桓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂宗翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周哲民</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種機車的配置結構，機車包括有內燃引擎的動力單元，該動力單元係被連接於車架單元；該車架單元外周罩設有車體蓋單元；該動力單元至少包含有汽缸部及該汽缸部一端上的曲軸箱，該汽缸部包含有汽缸本體與連接於該汽缸本體上的汽缸頭；該汽缸頭連接有進氣元件，該進氣元件藉由鎖固元件鎖固於該汽缸頭上，該進氣元件鎖設有爆震感知器；該爆震感知器係鄰近該汽缸部的汽缸本體中心線；該車體蓋單元至少包含有中央車體蓋，該中央車體蓋開設有入風口，該入風口與該爆震感知器相對應的設置；藉此外界的冷卻風由該入風口進入來吹襲與冷卻該爆震感知器，從而可提升該爆震感知器散熱及使用的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">4:動力單元</p>
        <p type="p">41:汽缸部</p>
        <p type="p">41c:汽缸本體中心線</p>
        <p type="p">411:汽缸頭蓋</p>
        <p type="p">412:汽缸頭</p>
        <p type="p">413:汽缸本體</p>
        <p type="p">416:張緊器</p>
        <p type="p">419:進氣元件</p>
        <p type="p">4191:出氣口連接埠</p>
        <p type="p">4194:爆震感知器安裝座</p>
        <p type="p">4195:燃油噴嘴安裝座</p>
        <p type="p">42:曲軸箱</p>
        <p type="p">44:最終傳動軸</p>
        <p type="p">45:冷卻風扇</p>
        <p type="p">6:導風罩</p>
        <p type="p">62:下罩</p>
        <p type="p">63:側罩</p>
        <p type="p">7:爆震感知器</p>
        <p type="p">E:電子控制單元</p>
        <p type="p">X1:第一假想中心線</p>
        <p type="p">X2:第二假想中心線</p>
        <p type="p">M:排氣管</p>
        <p type="p">J:燃油噴嘴</p>
        <p type="p">V:節流閥體</p>
        <p type="p">W:空氣濾清器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="240" publication-number="202616536">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616536</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138121</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電池的電極、電池以及電池包</chinese-title>
        <english-title>ELECTRODE FOR BATTERIES, BATTERY, AND BATTERY PACK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250418B">H01M4/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡內基美隆大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARNEGIE MELLON UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中揭露使用奈米線結構來增大電池的庫侖效率及電壓輸出的電極的各種實施例。電極可包括例如銅箔層及自銅箔層的表面或自銅箔層的兩個表面突出的銅奈米線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are various embodiments of electrodes using nanowire structures to increase the columbic efficiency and voltage output of a battery. The electrodes may include, for example, a copper foil layer and copper nanowires protruding from a surface of the copper foil layer or from both surfaces of the copper foil layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">401:陰極</p>
        <p type="p">402:陽極</p>
        <p type="p">403:電解質</p>
        <p type="p">404:隔板</p>
        <p type="p">405:陰極集電器</p>
        <p type="p">406:陰極活性材料</p>
        <p type="p">407:陽極集電器/基板層</p>
        <p type="p">408:奈米線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="241" publication-number="202616306">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616306</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138126</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鐵芯材質並聯結構及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">H01F27/26</main-classification>
        <further-classification edition="200601120241104B">H01F41/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汎速科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>譚隆競</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王偉杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鐵芯材質並聯結構，其包括一第一鐵芯體環，其中央有一貫孔且外側面環設有一連續容置槽；及一第二鐵芯體，其結合於連續容置槽之中。本發明將較不易加工的第二鐵芯體繞製於第一鐵芯體環之外側面之連續容置槽之中，第二鐵芯體可不突出於連續容置槽，在容易加工生產且增加鐵芯體的整體效能時還能讓鐵芯體同時有多種不同工作波段的特性。本發明並提供一種鐵芯材質並聯結構之製造方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一鐵芯體環</p>
        <p type="p">11:貫孔</p>
        <p type="p">2:第二鐵芯體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="242" publication-number="202614986">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614986</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138129</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可調整長度的拋棄式奶瓶</chinese-title>
        <english-title>THE LENGTH ADJUSTABLE DISPOSABLE BABY BOTTLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250422B">A61J9/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＭＯＴＨＥＲ　Ｋ公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTHER-K CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玟廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MIN-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭莊憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, JANG-HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗姬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JONG-HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示提供一種當外出時可以方便地攜帶的拋棄式奶瓶，因為可以調整奶瓶的長度。本揭示的拋棄式奶瓶包括：瓶蓋單元，包括奶嘴和瓶蓋，並且具有在下端的第一緊固部；第一本體區段，耦合於瓶蓋單元；以及第二本體區段，耦合於第一本體區段，並且當鬆開第一本體區段和第二本體區段時，第一本體區段可以縱向地配接到第二本體區段中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a disposable baby bottle that can be conveniently carried when going out because the length of the baby bottle can be adjusted. The a disposable baby bottle of the present disclosure includes: a cap unit including a nipple and a cap and having a first fastening portion at a lower end; a first body section coupled with the cap unit; and a second body section coupled with the first body section, and when the first body section and the second body section are unfastened, the first body section can be longitudinally fitted into the second body section.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:拋棄式奶瓶</p>
        <p type="p">110:瓶蓋單元</p>
        <p type="p">114:第一緊固部</p>
        <p type="p">120:第一本體區段</p>
        <p type="p">123:第二緊固部</p>
        <p type="p">126:第三緊固部</p>
        <p type="p">130:第二本體區段</p>
        <p type="p">131:第四緊固部</p>
        <p type="p">140:基座</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="243" publication-number="202614914">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614914</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138130</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>上臂省力輔助裝置</chinese-title>
        <english-title>UPPER ARM LABOR-SAVING AUXILIARY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241106B">A01B76/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中山大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL SUN YAT-SEN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林韋至</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黎　鄧慶冷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LE, DANG KHANH LINH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙淑真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, SUE-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種上臂省力輔助裝置，裝設於一穿戴裝置上。該上臂省力輔助裝置包含一可拆裝地設置於該穿戴裝置上的組接機構、一設置於該組接機構上且在受壓縮後可提供頂推力的動力輔助機構、一設置於該動力輔助機構上的連接機構，及一樞接該動力輔助機構及該連接機構的承托機構。當套設或固定於使用者臂上的承托機構受壓時，會壓縮該動力輔助機構，而該動力輔助機構則會提供與之抗衡的頂推力，如此以該連接機構與該承托機構的樞接處為支點，該動力輔助機構提供的頂推力會在該承托機構上產生扭矩，從而對使用者搬運重物時的手臂產生輔助支撐之作用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An upper arm labor-saving auxiliary device is installed on a wearable device. Said upper arm labor-saving auxiliary device includes an assembly mechanism that is detachably disposed on said wearable device, a power auxiliary mechanism that is disposed on said assembly mechanism and can provide pushing force after being compressed, a connecting mechanism provided on said power auxiliary mechanism, and a supporting mechanism pivotally connected to said power auxiliary mechanism and said connecting mechanism. When said supporting mechanism set or fixed on the user's arm is under pressure, said power auxiliary mechanism will be compressed, and said power auxiliary mechanism will provide a counter-pushing force, thus providing auxiliary support to the user's arms when carrying heavy objects.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:上臂省力輔助裝置</p>
        <p type="p">3:組接機構</p>
        <p type="p">31:接合件</p>
        <p type="p">32:多向關節</p>
        <p type="p">33:延伸桿</p>
        <p type="p">34:鎖定件</p>
        <p type="p">341:立座</p>
        <p type="p">343:底殼體</p>
        <p type="p">344:鎖榫板</p>
        <p type="p">4:動力輔助機構</p>
        <p type="p">41:殼座</p>
        <p type="p">42:缸體</p>
        <p type="p">43:推桿</p>
        <p type="p">5:連接機構</p>
        <p type="p">51:扣座</p>
        <p type="p">511:定位槽</p>
        <p type="p">52:調整帶</p>
        <p type="p">521:定位斜齒</p>
        <p type="p">53:連接索</p>
        <p type="p">6:承托機構</p>
        <p type="p">61:主臂桿</p>
        <p type="p">611:滑槽</p>
        <p type="p">612:端座部</p>
        <p type="p">613:桿體部</p>
        <p type="p">62:撐托架</p>
        <p type="p">63:調節件</p>
        <p type="p">631:調整螺桿</p>
        <p type="p">632:滑塊</p>
        <p type="p">A:樞接處</p>
        <p type="p">B:樞接處</p>
        <p type="p">C:樞接處</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="244" publication-number="202615856">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615856</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138132</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一茶葉產地鑑別檢驗方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120241225B">G01N27/623</main-classification>
        <further-classification edition="200601120241225B">G06F17/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>農業部茶及飲料作物改良場</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉天麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴佳如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱春火</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇宗振</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱垂豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡憲宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林金池</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡智益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江峻蔚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李奇恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一茶葉產地鑑別檢驗方法，其包含步驟：第一步驟，提供一茶葉樣品，該茶葉樣品進行研磨烘乾秤重作業；第二步驟，將上述該茶葉樣品接續進行一微波輔助酸消化作業；第三步驟，接續將該茶葉樣品再經過定量過濾後進一步使用一感應耦合電漿質譜儀進行微量元素檢測作業；第四步驟，接續該茶葉樣品經上述該微量元素檢測作業會產生一筆微量元素資料，其中對該微量元素資料進行資料前處理作業，以建置一微量元素分析資料，接續對該微量元素分析資料進行矩陣建模以產生茶葉產地鑑定資訊，該茶葉產地鑑定資訊再經統計比對模型作業，得到該茶葉樣品的一茶葉產地鑑別結果；第五步驟，其中該茶葉產地鑑別結果可進一步出具一茶葉產地鑑別檢驗報告。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">100:第一步驟</p>
        <p type="p">200:第二步驟</p>
        <p type="p">300:第三步驟</p>
        <p type="p">400:第四步驟</p>
        <p type="p">401:微量元素資料前處理作業</p>
        <p type="p">500:第五步驟</p>
        <p type="p">1000:茶葉產地鑑別檢驗方法</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="245" publication-number="202615885">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615885</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138135</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>耦合狀態偵測裝置及其偵測方法</chinese-title>
        <english-title>COUPLING STATE DETECTION DEVICE AND DETECTION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120241104B">G01R31/40</main-classification>
        <further-classification edition="200601120241104B">H03K17/687</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯陽半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITE TECH. INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, YI-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳東山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, DONG-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉邵玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SHAO-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種耦合狀態偵測裝置及其偵測方法。控制電路控制開關電路將發送端的輸出端切換連接至電阻電路或電壓脈衝產生電路，控制電壓脈衝產生電路產生電壓脈衝，並依據開關電路連接至電阻電路時以及開關電路連接至電壓脈衝產生電路時偵測電路偵測發送端的輸出電壓而產生的偵測信號，判斷發送端與接收端間的耦合狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A coupling state detection device and a detection method thereof are provided. A control circuit controls a switching circuit to switch an output of a transmitter to connect to a resistance circuit or a voltage pulse generating circuit, controls the voltage pulse generating circuit to generate a voltage pulse, and determines a coupling status between the transmitter and a receiver based on a detection signal generated by a detection circuit that detects output voltages of the transmitter when the switching circuit is connected to the resistance circuit and when the switching circuit is connected to the voltage pulse generating circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:耦合狀態偵測裝置</p>
        <p type="p">TX:發送端</p>
        <p type="p">102:開關電路</p>
        <p type="p">104:電壓脈衝產生電路</p>
        <p type="p">106:控制電路</p>
        <p type="p">108:偵測電路</p>
        <p type="p">110:電阻電路</p>
        <p type="p">Vlow:參考電壓</p>
        <p type="p">Vpulse:電壓脈衝</p>
        <p type="p">SW1、SW2:開關</p>
        <p type="p">A1:比較器</p>
        <p type="p">Vout:輸出電壓</p>
        <p type="p">Vref:參考電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="246" publication-number="202616067">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616067</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138136</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於Azure　DevOps　Repos的微服務版本管控系統及其方法</chinese-title>
        <english-title>MICROSERVICE VERSION CONTROL SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250203B">G06F8/70</main-classification>
        <further-classification edition="201801120250203B">G06F8/71</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹振宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, CHENG-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許順興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, SHUN-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡士哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, SHIH-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基於Azure DevOps Repos的微服務版本管控系統及其方法，方法包括依據微服務更新程式對系統版本號與系統版本號下的更新的微服務版號進行更新，以獲取並且儲存更新後的版本資訊；取得更新後的版本資訊，且經由包版模組進行包版，以獲取並且儲存經包版後的版本定義檔；以及下載版本定義檔，以依據版本定義檔進行微服務部署，方便進行系統定版測試。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A microservice version control system and method thereof is provided, the method includes updating a system version number and an updated microservice version number under the system version number according to a microservice update program to obtain and store an updated version information, obtaining the updated version information and performing a roadblock through a roadblock module to obtain and store a version definition file after the roadblock, and downloading the version definition file to deploy microservices according to the version definition file, facilitating the system final version testing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:管道模組</p>
        <p type="p">102:介面模組</p>
        <p type="p">103:更新組件版本模組</p>
        <p type="p">104:包版模組</p>
        <p type="p">105:輸出版本定義檔模組</p>
        <p type="p">106:Azure repos儲存模組</p>
        <p type="p">107:貼標模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="247" publication-number="202616222">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616222</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138142</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像失真的修復系統及其方法</chinese-title>
        <english-title>IMAGE DISTORTION RESTORATION SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120251105B">G06V10/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>元樣人工智能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAIAM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張為義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, WEI-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳澔偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HAO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅士傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, SHIH-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林淑娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種影像失真的修復方法及系統，影像失真的修復系統包括檢測模組、遮罩生成模組及修復模組。影像失真的修復方法透過檢測模組獲取原始紅外線圖像的紅外線標記圖像與原始深度圖像的深度標記圖像，接著使用遮罩生成模組從紅外線標記圖像及深度標記圖像生成語義圖，再使用修復模組根據原始紅外線圖像、原始深度圖像語義圖，生成修復紅外線圖像與修復深度圖像，藉此提升修復效果、影像辨識準確度與可靠性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an image distortion restoration system and method thereof. The image distortion repair system comprises a detection module, a mask generation module, and an inpainting module. The image distortion inpainting method acquires an infrared labeled image from an original infrared image and a depth labeled image from an original depth image through the detection module. Then, the mask generation module is used to generate a semantic map from the infrared labeled image and the depth labeled image. Subsequently, the inpainting module uses the original infrared image, the original depth image, and the semantic map to generate the repaired infrared image and the repaired depth image, thereby improving repair effectiveness, image recognition accuracy, and reliability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:檢測模組</p>
        <p type="p">2:遮罩生成模組</p>
        <p type="p">3:修復模組</p>
        <p type="p">30:生成單元</p>
        <p type="p">32:判別單元</p>
        <p type="p">4:預處理模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="248" publication-number="202616614">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616614</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138143</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無線電子模組的製造方法</chinese-title>
        <english-title>MANUFACTURING METHOD OF WIRELESS ELECTRONIC MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250108B">H02J50/20</main-classification>
        <further-classification edition="201601120250108B">H02J50/10</further-classification>
        <further-classification edition="200601120250108B">H05K1/09</further-classification>
        <further-classification edition="200601120250108B">H05K7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人紡織產業綜合研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN TEXTILE RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈乾龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, CHIEN-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐建發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, CHIEN-FA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳芬苓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, FEN-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃厚升</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HOU-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">無線電子模組的製造方法包括：接收包含第一圖案及第二圖案的軟性底材，其中第一圖案包含具有第一末端的同心圓線圈圖案及具有第一櫛狀圖案的第一閘型圖案，第二圖案包含具有第二末端及第二櫛狀圖案的第二閘型圖案，且第二櫛狀圖案的多個第二櫛齒圖案嵌入第一櫛狀圖案的多個第一櫛齒圖案之間且與多個第一櫛齒圖案交替排列；在軟性底材上形成第一導電圖案及第二導電圖案，其中第一導電圖案與第二導電圖案分別具有對應第一末端及第二末端的第一接合點及第二接合點；使第二接合點越過部分的同心圓線圈圖案以跨接第一接合點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of a wireless electronic module includes the following steps: receiving a flexible substrate including a first pattern and a second pattern, in which the first pattern includes a concentric circular coil pattern having a first end and a first gate-shaped pattern having a first comb-shaped pattern, the second pattern includes a second gate-shaped pattern having a second end and a second comb-shaped pattern, a plurality of second comb tooth patterns of the second comb-shaped pattern are embedded in a plurality of first comb tooth patterns of the first comb-shaped pattern, and the first comb tooth patterns are alternately arranged with the second comb tooth patterns; forming a first conductive pattern and a second conductive pattern on the flexible substrate, in which the first conductive pattern and the second conductive pattern respectively have a first joint and a second joint that are respectively corresponding to the first end and the second end; making the second joint cross over the concentric circle coil pattern to bridge the first joint.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10~S40:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="249" publication-number="202615113">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615113</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138147</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>血栓抽取導管之方向導引裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241106B">A61M39/08</main-classification>
        <further-classification edition="200601120241106B">A61M25/01</further-classification>
        <further-classification edition="200601120241106B">A61M1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺北醫學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安締思生物科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃逸君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂岳勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳佳明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳行一</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種血栓抽取導管之方向導引裝置，主要係包含一操控單元及連結該操控單元之牽制件。其中，該操控單元係設有一滑塊，該牽制件係連接該滑塊，亦或於滑塊設有擺動件，於擺動件連接第一牽制件及第二牽制件，該等牽制件係與血栓抽取導管並置且包覆於一外罩管體，該等牽制件的一端另端係定位於外罩管體的前端部。藉此；可利用操控單元之簡易操作該滑塊之前後位移或擺動件之左右擺動，進而帶動該牽制件，以牽制連動外罩管體呈不同角度之彎折，從而達到血栓抽取導管遠端同步彎曲之目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:血栓抽取導管</p>
        <p type="p">4:操控單元</p>
        <p type="p">41:座體</p>
        <p type="p">42:滑塊</p>
        <p type="p">5:第一牽制件</p>
        <p type="p">6:控制鈕</p>
        <p type="p">62:固定件</p>
        <p type="p">7:外罩管體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="250" publication-number="202615184">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615184</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138149</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>碳化矽晶圓的雷射切片裝置及其方法</chinese-title>
        <english-title>LASER SLICING DEVICE FOR SILICON CARBIDE WAFER AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120241029B">B23K26/04</main-classification>
        <further-classification edition="201401120241029B">B23K26/362</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏貿科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝承靖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴國榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作是一種碳化矽晶圓的雷射切片裝置及其方法，其中包括：一固定夾台，固持一晶圓棒的一端；一操作台，設有至少一抽氣管、至少一冷媒導管、其中該操作台的吸附面，經由該抽氣管，吸附該晶圓棒的另一端； 一控制模組，連結該固定夾台以及該操作台，進行同步旋轉該晶圓棒、該固定夾台以及該操作台；以及一飛秒雷射，該飛秒雷射的照射光點，垂直對準於該晶圓棒的中心軸，逐圈旋轉該晶圓棒時，進行融熔蝕刻該晶圓棒，直到新形成的一晶圓片融熔斷離該晶圓棒。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:晶圓棒</p>
        <p type="p">11:薄片狀晶圓片</p>
        <p type="p">2:固定夾台</p>
        <p type="p">3:操作台</p>
        <p type="p">311:吸附面</p>
        <p type="p">32:抽氣管</p>
        <p type="p">33:冷媒導管</p>
        <p type="p">5:控制模組</p>
        <p type="p">C:中心軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="251" publication-number="202615222">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615222</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138151</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電動釘槍時序控制裝置及其方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241216B">B25C1/06</main-classification>
        <further-classification edition="200601120241216B">B25C5/15</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力肯實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE POAN PNEUMATIC CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁嘉生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, CHIA-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴彩汶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, TSAI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖英杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YING-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宜宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, I-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳律丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LU-CHEN STAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈維揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電動釘槍時序控制裝置及其方法，包括依序管制一擊釘電磁鐵於一擊釘時間內受電激勵而能完成一擊釘操作，及一推釘電磁鐵於該擊釘時間終了受電激勵而能完成擊釘後的一推釘操作，其中該推釘電磁鐵憑藉一電容於該擊釘時間內持續充電並於該擊釘時間終了放電激勵而完成所述推釘操作，使得所述擊釘操作和所述推釘操作之間生成時間差，據以簡化現有電動釘槍的時序控制技術。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:槍體</p>
        <p type="p">14:衍架</p>
        <p type="p">16:釘匣</p>
        <p type="p">30:餵釘器</p>
        <p type="p">40:擊釘驅動組</p>
        <p type="p">41:動力飛輪</p>
        <p type="p">42:擊釘電磁鐵</p>
        <p type="p">43:撞針</p>
        <p type="p">44:馬達</p>
        <p type="p">45:皮帶</p>
        <p type="p">Z:擊釘軸向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="252" publication-number="202616547">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616547</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138152</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>固態電解質及應用彼之電池</chinese-title>
        <english-title>SOLID-STATE ELECTROLYTE AND CELL USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120241106B">H01M10/0562</main-classification>
        <further-classification edition="200601120241106B">C01G35/00</further-classification>
        <further-classification edition="200601120241106B">C01G25/00</further-classification>
        <further-classification edition="200601120241106B">C01G15/00</further-classification>
        <further-classification edition="200601120241106B">C01G33/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台塑新智能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FORMOSA SMART ENERGY TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬爾　毛里亞　迪拉吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR MAURYA, DHEERAJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　白羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAZRI, BEHROUZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪源廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, YUAN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉如熹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, RU-SHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏大華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, DA-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉慧啟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HUI-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王瑞瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, RUEY-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃琮益</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於鋰離子電池之固態電解質，其包含石榴石型固態電解質以及聚合物填料，其中該聚合物填料係分散於該石榴石型固態電解質中。該石榴石型固態電解質係不含碳酸鋰，以及以該石榴石型固態電解質與該聚合物填料的總重量計，該石榴石型固態電解質的含量係60重量%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A solid-state electrolyte for lithium-ion cell is provided. The solid-state electrolyte comprises a garnet-type solid-state electrolyte and a polymer filler, wherein the polymer filler is dispersed within the garnet-type solid-state electrolyte. The garnet-type solid-state electrolyte does not contain lithium carbonate, and the content of the garnet-type solid-state electrolyte is 60 wt% or more based on the total weight of the garnet-type solid-state electrolyte and the polymer filler.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="253" publication-number="202615778">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615778</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138153</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>球接頭總成</chinese-title>
        <english-title>BALL JOINT ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">F16C11/04</main-classification>
        <further-classification edition="200601120241105B">B62D3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>世祥汽材製造廠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH HSIANG AUTO PARTS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周哲弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHE-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴榮胤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, JUNG-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡承宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, CHENG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種球接頭總成，球接頭總成包含一球座、一球接頭、一底蓋以及一彈性件。球座具有彼此相反的一第一開口及一第二開口，球座包含複數第一定位部鄰近第二開口且彼此間隔排列。球接頭插設於球座且包含一球桿自第一開口朝外穿出。底蓋蓋設於球座且包含一柱體、一蓋體及一定位件。柱體可拆地由第二開口鎖接於球座。蓋體連接於柱體，且蓋體包含至少一第二定位部。定位件連接於蓋體。彈性件容設於球座，且彈性件設置於球接頭與柱體之間。藉此，透過在球座設置定位件及彈性件，並使底蓋遠離球桿，可方便調整球接頭轉動的阻力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a ball joint assembly. The ball joint assembly includes a ball seat, a ball joint, a bottom cover and an elastic member. The ball seat has a first opening and a second opening opposite to each other. The ball seat includes a plurality of first positioning portions which are adjacent to the second opening and are arranged at intervals from each other. The ball joint is inserted into the ball seat and includes a ball rod extending outward from the first opening. The bottom cover is disposed at the ball seat and includes a cylindrical body, a covering body and a positioning member. The cylindrical body is detachably locked to the ball seat through the second opening. The covering body is connected to the cylindrical body, and the covering body includes at least one second positioning portion. The positioning member is connected to the covering body. The elastic member is disposed at the ball seat, and the elastic member is disposed between the ball joint and the cylindrical body. Therefore, with disposing the positioning member and the elastic member at the ball seat, and with disposing the bottom cover away from the ball rod, a resistance of the rotation of the ball joint can be adjusted conveniently.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:球接頭總成</p>
        <p type="p">110:球座</p>
        <p type="p">112:第二開口</p>
        <p type="p">113:座體</p>
        <p type="p">114:第一定位部</p>
        <p type="p">115:第一指示線</p>
        <p type="p">117:第二凸緣</p>
        <p type="p">118:環槽</p>
        <p type="p">119:固定環</p>
        <p type="p">120:球接頭</p>
        <p type="p">121:球桿</p>
        <p type="p">122:球頭</p>
        <p type="p">123:鎖固件</p>
        <p type="p">130:底蓋</p>
        <p type="p">131:柱體</p>
        <p type="p">132:蓋體</p>
        <p type="p">1321:第二定位部</p>
        <p type="p">1322:第二指示線</p>
        <p type="p">133:定位件</p>
        <p type="p">140:彈性件</p>
        <p type="p">150:軸承</p>
        <p type="p">160:防塵套</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="254" publication-number="202616698">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616698</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138154</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>透過虛擬私人網路管理軟體介接之虛擬私人網路連線驗證方法</chinese-title>
        <english-title>AUTHENTICATION METHOD OF VIRTUAL PRIVATE NETWORK CONNECTION VIA INTERFACE OF VIRTUAL PRIVATE NETWORK MANAGEMENT SOFTWARE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250203B">H04L9/40</main-classification>
        <further-classification edition="200601120250203B">H04L12/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威聯通科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QNAP SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, MING LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種以虛擬私人網路(VPN)管理軟體為介接，提供VPN使用者連線裝置於VPN伺服器進行驗證之方法，係VPN使用者連線裝置登入VPN管理軟體。VPN管理軟體再將VPN使用憑證發送至符合VPN連線閾值之VPN伺服器。待該VPN伺服器接收成功後，VPN管理軟體即回傳VPN伺服器驗證資訊至VPN使用者連線裝置。VPN使用者連線裝置再發送此VPN伺服器驗證資訊至對應之VPN伺服器進行驗證。待驗證後，VPN使用者連線裝置與VPN伺服器間形成VPN隧道，係完成此發明之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The instant disclosure provides a method for authenticating VPN user’s connection device on a VPN server using VPN management software as an interface. The method involves the VPN user’s connection device logging into the VPN management software; the VPN management software then sends the VPN usage credential to a VPN server that meets the VPN connection threshold; once the VPN server successfully receives the credentials, the VPN management software returns the VPN server authentication information to the VPN user’s connection device; the VPN user’s connection device then sends this VPN server authentication information to the corresponding VPN server for authentication; after authentication, a VPN tunnel is formed between the VPN user’s connection device and the VPN server, completing the method of this invention.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1~6:步驟</p>
        <p type="p">100:VPN使用者於VPN伺服器進行驗證之流程</p>
        <p type="p">102:VPN使用者</p>
        <p type="p">104:VPN使用者連線裝置</p>
        <p type="p">114:VPN伺服器</p>
        <p type="p">116:私有資料</p>
        <p type="p">118:VPN隧道</p>
        <p type="p">120:規範管理軟體</p>
        <p type="p">122:汲取規範</p>
        <p type="p">124:身分識別提供者(IdP)</p>
        <p type="p">126:VPN管理軟體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="255" publication-number="202616179">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616179</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138155</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>飲食及卡路里追蹤方法及其系統</chinese-title>
        <english-title>DIET AND CARLORIE TRACKING METHOD AND SYSTEM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250107B">G06Q30/02</main-classification>
        <further-classification edition="201201120250107B">G06Q50/10</further-classification>
        <further-classification edition="200601120250107B">G06F17/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全家便利商店股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN FAMILYMART CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王啟丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林淑敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHU-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許育寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YU-NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡喜羽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HSI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種飲食及卡路里追蹤系統，包含用於儲存資料及指令的記憶體裝置及電性耦接記憶體裝置的處理電路。處理電路用以存取儲存在記憶體的資料及指令以執行下列步驟。自資訊來源以及輸入資料中至少一者，獲取飲食記錄，並且獲取飲食記錄的步驟包含下列步驟。自儲存在會員載具的電子發票明細，獲取食物的食物名稱，且根據食物名稱獲取食物的食物資料。將食物資料加入飲食列表，以產生飲食記錄。根據飲食記錄，計算累積卡路里攝取量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A diet and calorie tracking system includes a memory device for storing data and instructions and a processing circuitry electrically coupled to the memory device. The processing circuitry is configured to access the data and instructions stored in the memory device to execute the following step. A diet record is obtained from at least one of an information source and input data, and the step for obtaining the diet record includes the following steps. A food name of a food is obtained from an electronic invoice which is stored in a member carrier, and food data is obtained according to the food name. The food data is added into a diet list to generate the diet record. Cumulative caloric intake is calculated according to the diet record.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:飲食及卡路里追蹤系統</p>
        <p type="p">110:用戶設備</p>
        <p type="p">111:穿戴式裝置</p>
        <p type="p">112:手持裝置</p>
        <p type="p">120:伺服器</p>
        <p type="p">122:電子發票整合平台</p>
        <p type="p">130:伺服器</p>
        <p type="p">140:應用程式</p>
        <p type="p">141:客戶端</p>
        <p type="p">142:伺服器端</p>
        <p type="p">150:資料庫</p>
        <p type="p">152:食物成分列表</p>
        <p type="p">160:網路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="256" publication-number="202616180">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616180</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138156</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>飲食推薦方法及其系統</chinese-title>
        <english-title>DIET RECOMMENDATION METHOD AND SYSTEM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250107B">G06Q30/02</main-classification>
        <further-classification edition="201201120250107B">G06Q50/10</further-classification>
        <further-classification edition="200601120250107B">G06F17/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全家便利商店股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN FAMILYMART CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王啟丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林淑敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHU-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許育寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YU-NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡喜羽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HSI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種飲食推薦系統，包含用於儲存資料及指令的記憶體裝置及電性耦接記憶體裝置的處理電路。處理電路用以存取儲存在記憶體裝置的資料及指令以執行下列步驟。自資訊來源以及輸入資料中至少一者，獲取飲食記錄。根據飲食記錄，計算累積卡路里攝取量。獲取由穿戴式裝置估算的卡路里消耗量。獲取卡路里攝取目標。根據卡路里攝取目標、累積卡路里攝取量以及卡路里消耗量，計算的卡路里剩餘量。根據卡路里剩餘量，自與銷售通路關聯的食物成分列表選擇至少一食品以組成飲食計劃。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A diet recommendation system includes a memory device for storing data and instructions and a processing circuitry electrically coupled to the memory device. The processing circuitry is configured to access the data and instructions stored in the memory device to execute the following step. A diet record is obtained from at least one of an information source and input data. Cumulative caloric intake is calculated according to the diet record. Obtained a calorie consumption estimated by a wearable device. A calorie intake goal is obtained. Calorie remaining is calculated according to the calorie intake goal, the cumulative caloric intake and the calorie consumption. At least on of food is selected from a food ingredient list associated with a sale channel to constitute a diet plan.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:用戶設備</p>
        <p type="p">111:穿戴式裝置</p>
        <p type="p">112:手持裝置</p>
        <p type="p">120:伺服器</p>
        <p type="p">122:電子發票整合平台</p>
        <p type="p">130:伺服器</p>
        <p type="p">140:應用程式</p>
        <p type="p">141:客戶端</p>
        <p type="p">142:伺服器端</p>
        <p type="p">150:資料庫</p>
        <p type="p">152:食物成分列表</p>
        <p type="p">160:網路</p>
        <p type="p">1300:飲食推薦系統</p>
        <p type="p">1370:伺服器</p>
        <p type="p">1372:健康數據平台</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="257" publication-number="202615891">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615891</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138162</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學測距模組及電子裝置</chinese-title>
        <english-title>OPTICAL RANGING MODULE AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250122B">G01S17/08</main-classification>
        <further-classification edition="200601120250122B">G01S7/481</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新鉅科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEWMAX TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁永福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, YUNG FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳烱弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIUNG-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學測距模組定義有一物側及與物側相對之一元件側，並包括：一光學發射單元，由物側至元件側依序包括一第一光學透鏡組及一光源；一光學接收單元，由物側至元件側依序包括一第二光學透鏡組及一光學感測器； 一支撐蓋，包含可貫穿該物側及該元件側的兩個開口，該光學發射單元之該第一光學透鏡組及該光學接收單元之該第二光學透鏡組分別設置於該兩個開口；以及一光學濾光層，其由只限紅外線可穿透之材料所製，並設置於該光學發射單元之一光波發射路徑上及/或該光學接收單元之一光波接收路徑上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical ranging module includes an object side and an element side opposite to the object side, including: an optical emission unit, in order from the object side to the element side including a first optical lens assembly and a light source; an optical receiving unit in order from the object side to the element side including a second optical lens assembly and an optical sensor; a support unit including two openings that can penetrate the object side and the element side, The optical emission unit and the optical receiving unit are respectively disposed at the two openings; and an optical filter disposed on the object side of the optical emission unit and/or the optical receiving unit; wherein the optical filter is used to filter visible light, and the optical filter and the support unit have the same color.</p>
      </isu-abst>
      <representative-img>
        <p type="p">a1:第一中心軸</p>
        <p type="p">a2:第二中心軸</p>
        <p type="p">b1:第一開口</p>
        <p type="p">b2:第二開口</p>
        <p type="p">1:光學測距模組</p>
        <p type="p">110:光學發射單元</p>
        <p type="p">120:光學接收單元</p>
        <p type="p">130:光學支撐蓋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="258" publication-number="202615919">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615919</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138163</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>窄邊鏡頭模組及電子裝置</chinese-title>
        <english-title>NARROW-EDGE LENS MODULE AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120250801B">G02B7/00</main-classification>
        <further-classification edition="202301120250801B">H04N25/61</further-classification>
        <further-classification edition="202301120250801B">H04N23/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新鉅科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEWMAX TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁永福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, YUNG FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳烱弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIUNG-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種窄邊鏡頭模組包括：一鏡筒；一光學透鏡組，設置於該鏡筒內，其中該光學透鏡組包括至少一透鏡；一光學墊片，設置於該鏡筒內，並位於該透鏡之一物側表面；以及一光學感測器，設置於該鏡筒內，並位於一成像面上；其中該光學墊片包括一環型本體，具有一外周緣及一内周緣，該外周緣圍繞該内周緣，而該内周緣圍繞形成有一開口；以及，該外周緣包括第一及第二切邊，其分別沿Y軸朝該光學墊片之中心處內縮，該內周緣包括第三及第四切邊，其分別沿該Y軸朝該光學墊片之中心處內縮。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A narrow-edge lens module includes: a lens barrel; an optical lens assembly disposed in the lens barrel, wherein the optical lens assembly includes at least one lens; an optical gasket disposed in the lens barrel and located on an object-side surface of the lens; and an optical sensor disposed in the lens barrel and located on an image plane; wherein the optical gasket includes an annular body having an outer peripheral edge and an inner peripheral edge, the outer peripheral edge surrounds the inner peripheral edge, and an opening is formed around the inner peripheral edge; and the outer peripheral edge includes first and second cut edges, which are respectively retracted toward the center of the optical gasket along the Y-axis, and the inner peripheral edge includes third and second cut edges, which are respectively retracted toward the center of the optical gasket along the Y-axis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:窄邊鏡頭模組</p>
        <p type="p">11:鏡筒</p>
        <p type="p">12:光學透鏡組</p>
        <p type="p">120:透鏡</p>
        <p type="p">13:光學感測器</p>
        <p type="p">14:光學墊片</p>
        <p type="p">15:濾鏡</p>
        <p type="p">16:保護玻璃</p>
        <p type="p">CL:中心軸</p>
        <p type="p">OS:物側</p>
        <p type="p">SS:源側</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="259" publication-number="202615921">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615921</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138164</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>窄邊鏡頭模組及電子裝置</chinese-title>
        <english-title>NARROW-EDGE LENS MODULE AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120241104B">G02B7/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新鉅科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEWMAX TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁永福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, YUNG FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳烱弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIUNG-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種窄邊鏡頭模組包括：一鏡筒；一光學透鏡組，設置於該鏡筒內，其中該光學透鏡組包括至少一透鏡；一遮光板，設置於該鏡筒內，並比該透鏡更接近該物側；以及一光學感測器，設置於該鏡筒內，並位於一成像面上；其中該遮光板包括一環型本體，具有一外周緣及一内周緣，該外周緣圍繞該内周緣，而該内周緣圍繞形成有一開口；以及，該外周緣包括第一及第二切邊，其分別沿Y軸朝該遮光板之中心處內縮，該內周緣包括第三及第四切邊，其分別沿該Y軸朝該遮光板之中心處內縮。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A narrow-edge lens module includes: a lens barrel; an optical lens assembly disposed in the lens barrel, wherein the optical lens assembly includes at least one lens; a light shielding sheet disposed in the lens barrel and being closer to the object side than the lens; and an optical sensor disposed in the lens barrel and located on an image plane; wherein the light shielding sheet includes an annular body having an outer peripheral edge and an inner peripheral edge, the outer peripheral edge surrounds the inner peripheral edge, and an opening is formed around the inner peripheral edge; and the outer peripheral edge includes first and second cut edges, which are respectively retracted toward the center of the light shielding sheet along the Y-axis, and the inner peripheral edge includes third and second cut edges, which are respectively retracted toward the center of the light shielding sheet along the Y-axis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:窄邊鏡頭模組</p>
        <p type="p">10:遮光板</p>
        <p type="p">11:鏡筒</p>
        <p type="p">12:光學透鏡組</p>
        <p type="p">120:透鏡</p>
        <p type="p">13:光學感測器</p>
        <p type="p">15:濾鏡</p>
        <p type="p">16:保護玻璃</p>
        <p type="p">CL:中心軸</p>
        <p type="p">OS:物側</p>
        <p type="p">SS:源側</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="260" publication-number="202616102">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616102</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138166</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資料處理方法和裝置</chinese-title>
        <english-title>DATA PROCESSING METHOD AND DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250203B">G06F16/58</main-classification>
        <further-classification edition="202301120250203B">G06N3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁筱雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIN, HSIAO-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種資料處理方法。資料處理方法可包括底下步驟。藉由一資料處理裝置之一處理裝置，根據複數輸入資料，取得對應上述每一輸入資料之一結構化資料和一非結構化資料。藉由上述處理裝置，整合上述結構化資料和上述非結構化資料，以產生對應上述每一輸入資料之一整合資料 。藉由上述處理裝置，將上述整合資料儲存到一檢索強化生成資料庫中，以提供一大型語言模型使用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A data processing method is provided in the invention. The data processing method comprise the following steps. A processing device of a data processing device is configured to obtain a structured data and a non-structured data corresponding to each input data according to the input data. The processing device is configured to combine the structured data and the non-structured data to generate a combined data corresponding to each input data. The processing device is configured to store the combined data in a retrieval augmented generation (RAG) database to provide a large language model (LLM) for use.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S610~S630:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="261" publication-number="202615757">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615757</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138167</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組合式整體衛浴及其組裝方法</chinese-title>
        <english-title>COMBINED INTEGRATED BATHROOM AND METHOD FOR ASSEMBLING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120241230B">E04B1/61</main-classification>
        <further-classification edition="200601120241230B">E04F19/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞塑膠工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN YA PLASTICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林豐欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, FONG-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種組合式整體衛浴及其組裝方法。所述組合式整體衛浴包括一框架、多個水泥板、多個牆板、一組合式防水結構及一衛浴設備。所述框架包含一底部框體及位於所述底部框體的周緣的多個側部框體。多個所述水泥板及所述多個牆板分別是設置於所述底部框體及所述側部框體。所述組合式防水結構設置於多個所述水泥板。所述組合式防水結構包含一防水膜盤、設置於所述防水膜盤的一發泡板及設置於所述發泡板的多個防滑板。所述防水膜盤形成有一凹槽且所述防水膜盤是通過將一可撓性防水膜向其一側凹折而形成。所述發泡板形成有一洩水坡度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A combined integrated bathroom and method for assembling the same are provided. The combined integrated bathroom includes a frame, a plurality of cement boards, a plurality of wall boards, an assembled waterproof structure, and a bathroom equipment. The frame includes a plurality of bottom frame bodies and a plurality of side frame bodies arranged at a peripheral edge of the bottom frame body. The cement boards and the wall boards are respectively disposed on the bottom frame body and the side frame bodies. The assembled waterproof structure is disposed on the cement boards. The assembled waterproof structure includes a waterproof film plate, a foam board disposed on the waterproof film plate, and a plurality of anti-skid boards disposed on the foam board. The waterproof film plate has a groove and is formed by bending a flexible waterproof toward one side thereof. The foam board has a discharge slope.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:組合式整體衛浴</p>
        <p type="p">1:框架</p>
        <p type="p">11:底部框體</p>
        <p type="p">12:側部框體</p>
        <p type="p">2:水泥板</p>
        <p type="p">3:牆板</p>
        <p type="p">4:組合式防水結構</p>
        <p type="p">5:衛浴設備</p>
        <p type="p">6:支撐腳</p>
        <p type="p">7:排水管線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="262" publication-number="202616730">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616730</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138168</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>環景影像記錄裝置及車用環景影像系統</chinese-title>
        <english-title>SURROUND VIEW IMAGE RECORDING DEVICE AND VEHICLE SURROUND VIEW IMAGE SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250203B">H04N23/698</main-classification>
        <further-classification edition="200601120250203B">H04N5/89</further-classification>
        <further-classification edition="202201120250203B">B60R1/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宗盈國際科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOIN-LINK INTERNATIONAL TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳均嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃玉樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝上鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, SHANG-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開是一種環景影像記錄裝置及車用環景影像系統。環景影像記錄裝置，包括影像輸入介面、影像輸出介面、無線通訊電路及控制電路，其中影像輸入介面具有多個影像輸入埠，且每一影像輸入埠具有一數位影像接收晶片。數位影像接收晶片接受一攝影機的一數位影像傳送晶片輸出的第一數位影像訊號，並將第一數位影像訊號轉換成第二數位影像訊號。影像輸出介面具有多個影像輸出埠，每一影像輸出埠輸出相對應的一個影像輸入埠的第一數位影像訊號。控制電路對每一數位影像接收晶片輸出的第二數位影像訊號儲存，並透過無線通訊電路無線輸出第二數位影像訊號至無線連網裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A surround view image recording device and a vehicle surround view image system are provided. The surround view image recording device includes an image input interface, an image output interface, a wireless communication circuit and a control circuit. The image input interface has multiple image input ports, and each image input port has a digital image receiving chip. The digital image receiving chip receives a first digital image signal output by a digital image transmission chip of a video camera, and converts the first digital image signal into a second digital image signal. The image output interface has a plurality of image output ports, and each image output port corresponds to the first digital image signal of an image input port. The control circuit stores the second digital image signal output by each digital image receiving chip, and wirelessly outputs the second digital image signal to a wireless network connection device through the wireless communication circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:環景影像記錄裝置</p>
        <p type="p">11:影像輸入介面</p>
        <p type="p">111:影像輸入埠</p>
        <p type="p">112:數位影像接收晶片</p>
        <p type="p">12:儲存裝置</p>
        <p type="p">13:影像輸出介面</p>
        <p type="p">131:影像輸出埠</p>
        <p type="p">3:影像拍攝裝置</p>
        <p type="p">31:攝影機</p>
        <p type="p">311:影像傳送晶片</p>
        <p type="p">5:環景影像監控設備</p>
        <p type="p">51:數位影像接收晶片</p>
        <p type="p">7:無線連網裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="263" publication-number="202614950">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614950</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138179</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>支援個人舒適風味之膠囊咖啡機及其沖泡與管理方法</chinese-title>
        <english-title>CAPSULE COFFEE MACHINE AND BREWING AND MANAGEMENT METHOD THAT SUPPORTS PERSONAL COMFORT FLAVOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">A47J31/44</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞東學校財團法人亞東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIA EASTERN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鵬文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PENG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種支援個人舒適風味之膠囊咖啡機及其沖泡與管理方法。膠囊咖啡機包含一專家資料模組、一調整資料模組、一辨識模組及一調控模組。專家資料模組包含多個膠囊身份數據、多個原液調控命令與多個標準濃度數據。調整資料模組包含多個濃度調整數據。辨識模組通過多個膠囊身份數據比對一咖啡膠囊，以選取對應咖啡膠囊的原液調控命令。調控模組依據原液調控命令輸入一第一液體沖泡咖啡膠囊，以產生具備對應標準濃度數據的一標準濃度的一咖啡原液。調控模組利用濃度調整數據輸入一第二液體至咖啡原液中，以產生一最適濃度飲用液。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A capsule coffee machine and a brewing and management method that supports personal comfort flavor are provided. The capsule coffee machine includes an expert data module, a flavor cloud data module, an identification module, and a control module. The expert data module contains multiple capsule identity data, multiple raw material control commands, and multiple standard concentration data. The flavor cloud data module contains multiple concentration adjustment data. The identification module selects the raw material control command for the corresponding coffee capsule by comparing multiple capsule identity data with a coffee capsule. The control module brews the coffee capsule with the first liquid according to the raw material control command to generate a coffee extract with a corresponding standard concentration data. The control module inputs the second liquid into the coffee extract based on the concentration adjustment data to produce an optimum concentration drinking liquid.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:專家資料模組</p>
        <p type="p">2:調整資料模組</p>
        <p type="p">21:整合單元</p>
        <p type="p">22:輸出子資料庫</p>
        <p type="p">23:收集單元</p>
        <p type="p">24:初始子資料庫</p>
        <p type="p">25:輸出單元</p>
        <p type="p">3:辨識模組</p>
        <p type="p">4:調控模組</p>
        <p type="p">5:分析模組</p>
        <p type="p">6:推播模組</p>
        <p type="p">7:訂購模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="264" publication-number="202615639">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615639</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138185</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用聚山梨醇酯非離子界面活性劑增加去光阻劑效果及保存期限之方法</chinese-title>
        <english-title>METHOD FOR IMPROVEMENT OF EFFECT AND STORAGE LIFE OF PHOTORESIST STRIPPER BY UTILIZING NONIONIC SURFACTANT OF POLYSORBATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250207B">C11D1/76</main-classification>
        <further-classification edition="200601120250207B">G03F7/004</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣寶來特實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN POLYGAS TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡孟峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MENG-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀天昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">
        &lt;b&gt;本發明描述使用含有聚山梨醇酯非離子界面活性劑，添加至去光阻劑，藉由該等非離子界面活性劑的乳化、擴散、安定作用，增強去光阻效果，並抑制去光阻劑中之鄰苯二酚氧化以增加去光阻劑保存期限之方法。&lt;/b&gt;
      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        &lt;b&gt;Described are methods of utilizing nonionic surfactant of polysorbate, adding the same to photoresist stripper, thereby through the functions as emulsification, dispersion and stabilization of such nonionic surfactant, to improve the effect of stripping photoresist and inhibit oxidation of catechol in the photoresist stripper, so as to increase the storage life of the photoresist stripper&lt;/b&gt;
      </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="265" publication-number="202615353">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615353</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138186</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用二重蒸餾塔之氨之純化方法</chinese-title>
        <english-title>METHOD FOR PURIFICATION OF AMMONIA BY TWO SETS OF DISTILLATION COLUMN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250704B">C01C1/02</main-classification>
        <further-classification edition="200601120250704B">B01D3/14</further-classification>
        <further-classification edition="200601120250704B">B01D3/32</further-classification>
        <further-classification edition="200601120250704B">B01D3/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣寶來特實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN POLYGAS TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林進勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀天昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">
        &lt;b&gt;本發明描述使用二重蒸餾塔，藉此經由二個不同尺寸大小、壓力及溫度控制之蒸餾塔以達到藉由蒸餾純化氨之方法。&lt;/b&gt;
      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        &lt;b&gt;Described are methods of utilizing two sets of distillation column, thereby through two distillation columns with different size, pressure and temperature to purify ammonia.&lt;/b&gt;
      </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:蒸餾塔一</p>
        <p type="p">11:蒸餾塔二</p>
        <p type="p">20:蒸餾塔一底部排出口</p>
        <p type="p">21:蒸餾塔一頂部管線</p>
        <p type="p">30:膨脹閥</p>
        <p type="p">40:蒸餾塔二頂部排出口</p>
        <p type="p">50:儲存槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="266" publication-number="202616125">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616125</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138194</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路模型資料集的產生方法及產生裝置</chinese-title>
        <english-title>GENERATING METHOD AND GENERATING DEVICE FOR INTEGRATED CIRCUIT MODEL DATA SET</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250102B">G06F30/33</main-classification>
        <further-classification edition="202001120250102B">G06F30/20</further-classification>
        <further-classification edition="202001120250102B">G06F30/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程皓瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, HAO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳英傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YING-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余美儷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, MEI-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅幼嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, YU-LAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種積體電路模型資料集的產生方法及產生裝置。產生方法包括下列步驟：取得多個參考模型資料集；產生參考資料趨勢，並依據目標參數的目標參數值決定出重點區域；依據參考資料趨勢及重點區域取得多個篩選後模型資料集；以及將該等篩選後模型資料集輸入遞迴機器學習模型，其中，遞迴機器學習模型依序執行內插程序及外插程序；在內插程序中，依據該等篩選後模型資料集產生內插模型資料集，在外插程序中，依據該等篩選後模型資料集及內插模型資料集產生對應目標參數值的外插模型資料集，以作為目標模型資料集。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A generating method and a generating device for generating an integrated circuit model data set are provided. The generating method includes the following processes: obtaining a plurality of reference model data sets; generating a reference trend and determining a key area based on a target parameter value of a target parameter; obtaining a plurality of filtered model data sets based on the reference trend and the key area; and inputting the filtered model data sets into a recursive machine learning model. The recursive machine learning model executes an interpolation process and an extrapolation process sequentially. In the interpolation process, an interpolation model data set is generated based on the filtered model data set. In the extrapolation process, an extrapolation model data set corresponding to the target parameter value is generated based on the filtered model data set and the interpolation model data set, so as to serve as a target model data set.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S20,S21,S22,S23:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="267" publication-number="202615116">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615116</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138197</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>物理養生機</chinese-title>
        <english-title>PHYSICAL HEALTH MACHINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250418B">A61N1/44</main-classification>
        <further-classification edition="200601120250418B">A61N1/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant sequence="1">
            <addressbook>
              <chinese-name>
                <last-name>鍾兆恭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name>
                <last-name>CHUNG, CHAO-KONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor sequence="1">
            <addressbook>
              <chinese-name>
                <last-name>鍾兆恭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name>
                <last-name>CHUNG, CHAO-KONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種主機離子產生裝置，包括有主機外殼、隔板、濾波裝置、離子產生器、及輸出導線組成，該主機外殼內部設置離子產生器有一離子分離裝置安插在主機上，該隔板係設於主機外殼內部，將主機外殼內部區隔成一用以容納驅動元件，透過離子產生器將低電壓通過升壓電路升至為直流負高壓，利用直流電壓產生高電暈分布在貼片，高速的放出大量的電子(e-)，離子經分離後形成負離子，它的工作原理與自然現象“打雷閃電”時產生負離子的現象相一致。負離子透過導線傳輸至外部。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p></p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="268" publication-number="202615949">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615949</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138205</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>背光模組</chinese-title>
        <english-title>BACKLIGHT MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">G02F1/13357</main-classification>
        <further-classification edition="200601120250102B">G09F9/302</further-classification>
        <further-classification edition="200601120250102B">G09F9/33</further-classification>
        <further-classification edition="202501120250102B">H10H20/851</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>隆達電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEXTAR ELECTRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林峻弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳富鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, FU-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種背光模組。背光模組包括板材及複數個封裝結構。板材具有上表面，且上表面具有第一方向及第二方向。複數個封裝結構設置於板材上，且沿著第一方向及第二方向排列，其中封裝結構中的任一者包括基板、一對發光單元及色轉換層。基板具有固晶面。一對發光單元中的任一者具有長軸及短軸。色轉換層覆蓋一對發光單元與部分的固晶面。其中，任兩相鄰的封裝結構中，一對發光單元的長軸沿著不同方向延伸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A backlight module is provided. The backlight module includes a plate and a plurality of packaging structures. The plate has an upper surface, and the upper surface has a first direction and a second direction. The plurality of packaging structures are disposed on the plate and arranged along the first direction and the second direction, wherein any one of the packaging structures includes a substrate, a pair of light-emitting units, and a color conversion layer. The substrate has a bonding surface. Each one of the light-emitting units has a long axis and a short axis. The color conversion layer covers the pair of light-emitting units and part of the bonding surface. Among them, the long axes of the pair of light-emitting units in adjacent two packaging structures extend along different directions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:背光模組</p>
        <p type="p">10:板材</p>
        <p type="p">10S:上表面</p>
        <p type="p">11:封裝結構</p>
        <p type="p">11A:一側</p>
        <p type="p">11B:一側</p>
        <p type="p">d1:第一距離</p>
        <p type="p">d2:第二距離</p>
        <p type="p">DL:虛線</p>
        <p type="p">DR1:第一方向</p>
        <p type="p">DR2:第二方向</p>
        <p type="p">LA:長軸</p>
        <p type="p">SA:短軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="269" publication-number="202616700">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616700</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138213</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無線通訊裝置以及用來補償無線通訊裝置的非線性失真的方法</chinese-title>
        <english-title>WIRELESS COMMUNICATION DEVICE AND METHOD FOR COMPENSATING NONLINEAR DISTORTION OF WIRELESS COMMUNICATION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">H04L25/02</main-classification>
        <further-classification edition="200601120250203B">H04B1/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王至詰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種無線通訊裝置以及用來補償一無線通訊裝置的非線性失真的方法。該無線通訊裝置包含一傳送基頻電路、一振幅調變（簡稱AM）電路、一相位調變（簡稱PM）電路、一功率放大器、一計算電路以及一補償電路。該傳送基頻電路輸出傳送訊號，以供該AM電路以及該PM電路分別產生AM訊號以及PM訊號。該功率放大器將該AM訊號作為供應電壓，並且依據該PM訊號產生輸出訊號。該計算電路依據該輸出訊號的偵測結果估計該AM訊號與該PM訊號之間的延遲差異以產生估計結果，以及該補償電路依據該估計結果補償該AM訊號或該PM訊號，以減小該延遲差異。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wireless communication device and a method for compensating nonlinear distortion of a wireless communication device are provided. The wireless communication device includes a transmitting (TX) baseband circuit, an amplitude modulation (AM) circuit, a phase modulation (PM) circuit, a power amplifier (PA), a calculation circuit and a compensation circuit. The TX baseband circuit outputs a TX signal to make the AM circuit and the PM circuit generate an AM signal and a PM signal, respectively. The PA takes the AM signal as a supply voltage and generates an output signal according to the PM signal. The calculation circuit estimates a delay skew between the AM signal and the PM signal according to a detection result of the output signal to generate an estimation result, and the compensation circuit compensates the AM signal or the PM signal according to the estimation result, in order to reduce the delay skew.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:無線通訊裝置</p>
        <p type="p">100:切換式電容功率放大器</p>
        <p type="p">101:延遲差異計算電路</p>
        <p type="p">102:延遲差異補償電路</p>
        <p type="p">110:傳送基頻電路</p>
        <p type="p">120:振幅調變電路</p>
        <p type="p">121:振幅調變數位至類比轉換器</p>
        <p type="p">122:重建濾波器</p>
        <p type="p">130:相位調變電路</p>
        <p type="p">131:相位調變數位至類比轉換器</p>
        <p type="p">132:相位調變調變器</p>
        <p type="p">140:接收電路</p>
        <p type="p">141:耦合器</p>
        <p type="p">142:混頻器</p>
        <p type="p">143:類比至數位轉換器</p>
        <p type="p">150:接收基頻電路</p>
        <p type="p">f&lt;sub&gt;LO&lt;/sub&gt;:本地振盪頻率</p>
        <p type="p">τ&lt;sub&gt;CAL&lt;/sub&gt;:估計結果</p>
        <p type="p">STX&lt;sub&gt;AM&lt;/sub&gt;,STX&lt;sub&gt;PM&lt;/sub&gt;,SC&lt;sub&gt;AM&lt;/sub&gt;,VDD&lt;sub&gt;ENV&lt;/sub&gt;,SRF&lt;sub&gt;PM&lt;/sub&gt;,S&lt;sub&gt;OUT&lt;/sub&gt;,SRX,S&lt;sub&gt;IMD3&lt;/sub&gt;:訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="270" publication-number="202615198">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615198</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138215</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有冷卻迴路的迴轉工作台</chinese-title>
        <english-title>ROTARY TABLE WITH A COOLING LOOP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">B23Q1/52</main-classification>
        <further-classification edition="200601120241105B">B23Q11/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上銀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIWIN TECHNOLOGIES CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張元泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YUAN-TAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佑儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種具有冷卻迴路的迴轉工作台，包含：心軸，沿軸向成形，並具有複數個流道入口段、複數分別連通該流道入口段且圍繞該軸向的第一流道段、連通各該第一流道段的流道出口段、平行該軸向的第一迴流段，該第一迴流段的兩端分別為第一迴流入口及第一迴流出口；以及轉盤，與該心軸鎖固，並具有與該流道出口段連通的第二流道段、與該第二流道段連通的冷卻腔室、及連通該冷卻腔室與該第一迴流入口之間的第二迴流段；藉以使該迴轉工作台高速運轉時，將密封件、制動器和軸承等部件所產生的熱量有效帶走，以維持正常及高效運作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A rotary table with a cooling loop, which includes a central axis formed along an axial direction and defined with a plurality of flow inlet sections, a plurality of first passage sections connecting to the flow inlet sections and around the axial direction, a plurality of flow outlet sections connecting to the first passage sections and a plurality of first circulation passages parallel to the axial direction, both ends of the first circulation section are a first circulation inlet and a first circulation outlet, respectively, and a turntable locked in the central axis and has a second passage section connecting to the flow outlet section, a cooling chamber connecting to the second passage section, and a second circulation section connecting to the cooling chamber and the first circulation inlet, therefore, when the rotary table operates at high speed, the heat generated from seals, brakes and bearings, and other components is effectively removed to maintain normal and efficient operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">Y:軸向</p>
        <p type="p">X:徑向</p>
        <p type="p">100:迴轉工作台</p>
        <p type="p">10:心軸</p>
        <p type="p">11:流道入口段</p>
        <p type="p">12:第一流道段</p>
        <p type="p">13:流道出口段</p>
        <p type="p">14:第一迴流段</p>
        <p type="p">20:轉盤</p>
        <p type="p">21:第二流道段</p>
        <p type="p">22:冷卻腔室</p>
        <p type="p">23:第二迴流段</p>
        <p type="p">30:分流座</p>
        <p type="p">40:密封件</p>
        <p type="p">50:轉子</p>
        <p type="p">60:定子</p>
        <p type="p">70:制動器</p>
        <p type="p">80:軸承</p>
        <p type="p">90:軸承座</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="271" publication-number="202615683">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615683</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138228</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樟腦製石墨烯感測器及其製造方法</chinese-title>
        <english-title>CAMPHOR-BASED GRAPHENE SENSOR AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">C23C16/02</main-classification>
        <further-classification edition="200601120241105B">C23C16/26</further-classification>
        <further-classification edition="200601120241105B">C23C16/455</further-classification>
        <further-classification edition="200601120241105B">C23C16/52</further-classification>
        <further-classification edition="200601120241105B">C23C16/56</further-classification>
        <further-classification edition="200601120241105B">A61B5/024</further-classification>
        <further-classification edition="202101120241105B">A61B5/263</further-classification>
        <further-classification edition="200601120241105B">G01N27/327</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中原大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG YUAN CHRISTIAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡東昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, DUNG-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周詳育</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, HSIANG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤奕賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOU, YI-XIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種樟腦製石墨烯感測器之製造方法，首先是製備一常壓化學氣相沉積系統，將一金屬載體放置於一反應腔室，並將一樟腦放置於一加熱管中；接著將反應腔室加熱至930℃至980℃之間，並將一惰性氣體通入該反應腔室中；然後將一氫氣通入反應腔室；之後利用加熱管將樟腦加熱以產生一樟腦氣體，並將惰性氣體與氫氣分別經由加熱管通入反應腔室中，使樟腦氣體在金屬載體上沉積形成一樟腦碳源之石墨烯薄膜；最後，利用一濕式轉移法將樟腦碳源之石墨烯薄膜轉移到一聚二甲基矽氧烷基板，藉以形成一樟腦製石墨烯感測器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for manufacturing a camphor-based graphene sensor involves the following steps: First, prepare an atmospheric pressure chemical vapor deposition system, placing a metal substrate in a reaction chamber and camphor in a heating tube. Next, heat the reaction chamber to a temperature between 930℃ and 980℃, and introduce an inert gas into the chamber. Then, introduce hydrogen gas into the reaction chamber. After that, use the heating tube to heat the camphor, generating camphor gas, and introduce the inert gas and hydrogen gas separately through the heating tube into the reaction chamber, causing the camphor gas to deposit on the metal substrate and form a camphor-derived carbon source graphene film. Finally, transfer the camphor-derived graphene film onto a polydimethylsiloxane substrate using a wet transfer method, thereby forming a camphor-based graphene sensor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:常壓化學氣相沉積系統</p>
        <p type="p">11:反應腔室</p>
        <p type="p">111:進氣口</p>
        <p type="p">112:出氣口</p>
        <p type="p">12:加熱爐</p>
        <p type="p">13:加熱管</p>
        <p type="p">2:氬氣供應源</p>
        <p type="p">3:氮氣供應源</p>
        <p type="p">4:氫氣供應源</p>
        <p type="p">5:金屬載體</p>
        <p type="p">6:樟腦</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="272" publication-number="202616886">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616886</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138234</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電晶體、反相器及其製造方法以及記憶體單元</chinese-title>
        <english-title>TRANSISTOR, INVERTER AND MANUFATURING METHOD OF THE SAME, AND MEMORY UNIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250314B">H10D84/82</main-classification>
        <further-classification edition="202501120250314B">H10D30/60</further-classification>
        <further-classification edition="202501120250314B">H10D62/60</further-classification>
        <further-classification edition="202301120250314B">H10B10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃晧庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HAW-TYNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉伯淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, PO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖顯毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, HSIEN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓曜擎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, YAO-CING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭繼元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHI-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳志毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIH-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王祥駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HSIANG-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電晶體，其包括基板、堆疊結構以及閘極結構。堆疊結構設置於基板上，且包括汲極電極、源極電極、半導體層、第一緩衝層以及第二緩衝層。源極電極設置於汲極電極上。半導體層設置於汲極電極與源極電極之間。第一緩衝層設置於汲極電極與半導體層之間。第二緩衝層設置於源極電極與半導體層之間。閘極結構設置於基板上，其中閘極結構在基板的俯視方向上延伸且貫穿堆疊結構。閘極結構包括閘極電極以及閘介電層。閘介電層設置於閘極電極與堆疊結構之間。本揭露另提供一種反相器、一種反相器的製造方法以及一種記憶體單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transistor including a substrate, a stack structure and a gate structure. The stacked structure is disposed on the substrate and includes a drain electrode, a source electrode, a semiconductor layer, a first buffer layer and a second buffer layer. The source electrode is disposed on the drain electrode. The semiconductor layer is disposed between the drain electrode and the source electrode. The first buffer layer is disposed between the drain electrode and the semiconductor layer. The second buffer layer is disposed between the source electrode and the semiconductor layer. The gate structure is disposed on the substrate, wherein the gate structure extends in a vertical direction of the substrate and penetrates the stacked structure. The gate structure includes a gate electrode and a gate dielectric layer. The gate dielectric layer is disposed between the gate electrode and the stacked structure. An inverter, a manufacturing method of an inverter and a memory unit are also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">22:基板</p>
        <p type="p">24、24A、24B:堆疊結構</p>
        <p type="p">26:閘極結構</p>
        <p type="p">26A:閘極電極</p>
        <p type="p">26B:閘介電層</p>
        <p type="p">20:反相器</p>
        <p type="p">BF1、BF2:緩衝層</p>
        <p type="p">CW1、CW11、CW12、CW2、CW21、CW22:接觸窗</p>
        <p type="p">D1、D2:汲極電極</p>
        <p type="p">DR1、DR2:摻雜區</p>
        <p type="p">INT、INT1、INT2、INT3、INT4:內連線層</p>
        <p type="p">PV1、PV2、PV3、PV4、PV5:絕緣層</p>
        <p type="p">S1、S2:源極電極</p>
        <p type="p">28、SE:半導體層</p>
        <p type="p">W1、W2:寬度</p>
        <p type="p">X:方向</p>
        <p type="p">Z:俯視方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="273" publication-number="202615235">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615235</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138236</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學膜的製造方法</chinese-title>
        <english-title>METHOD OF PRODUCING OPTICAL FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250402B">B29C35/10</main-classification>
        <further-classification edition="200601120250402B">B29C41/26</further-classification>
        <further-classification edition="200601120250402B">B29C59/04</further-classification>
        <further-classification edition="200601320250402B">B29L7/00</further-classification>
        <further-classification edition="200601320250402B">B29L11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>誠美材料科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG MEI MATERIALS TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林必松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PI-SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃雅郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YA-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪詩惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, SHI-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彤云</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TUNG-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳懷章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HUAI-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林筱蘋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIAO-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種光學膜的製造方法。方法包含沿預定方向放卷卷狀膜材及卷狀壓印膜片，其中卷狀膜材包含成型面，卷狀壓印膜片包含壓印結構；塗布塗料層在卷狀膜材的成型面或卷狀壓印膜片的壓印結構上；壓合卷狀壓印膜片與卷狀膜材，以使塗料層夾設於成型面與壓印結構之間；對塗料層進行光固化處理，以將塗料層固化成光學機能層；以及分別卷收卷狀膜材與卷狀壓印膜片，以使光學機能層的光學結構與卷狀壓印膜片的壓印結構分離，而光學機能層與卷狀膜材結合成光學膜。藉此，可連續性地生產光學膜，並降低生產成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of producing an optical film is provided. The method includes unreeling a roll-shaped film substrate and a roll-shaped impression film sheet, in which the roll-shaped film substrate includes a forming surface, and the roll-shaped impression film sheet includes an impression structure; coating a coating layer on the forming surface of the roll-shaped film substrate or the impression structure of the roll-shaped impression film sheet; pressing the roll-shaped impression film sheet and the roll-shaped film substrate, thereby sandwiching the coating layer between the forming surface and the impression structure; performing a light curing process on the coating layer to cure the coating layer as an optical functional layer; and reeling the roll-shaped film substrate and the roll-shaped impression film sheet, thereby separating an optical structure of the optical functional layer from the impression structure of the roll-shaped impression film sheet, and combining the optical functional layer and the roll-shaped film substrate to the optical film. Therefore, the optical film can be produced continuously and cost can be decreased.</p>
      </isu-abst>
      <representative-img>
        <p type="p">210:方向</p>
        <p type="p">215:噴頭</p>
        <p type="p">220:卷狀膜材</p>
        <p type="p">225:成型面</p>
        <p type="p">230:卷狀壓印膜片</p>
        <p type="p">235:壓印結構</p>
        <p type="p">240:塗料層</p>
        <p type="p">245:壓印滾輪</p>
        <p type="p">250:光學機能層</p>
        <p type="p">255:光源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="274" publication-number="202616057">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616057</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138239</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>觸控圖標模組</chinese-title>
        <english-title>TOUCH ICON MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250109B">G06F3/041</main-classification>
        <further-classification edition="201301120250109B">G06F3/048</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>致伸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRIMAX ELECTRONICS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JIA-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林慧玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HUI-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊宇璔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YU-ZENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種觸控圖標模組，觸控圖標模組電性連接一電子設備並用於控制電子設備。觸控圖標模組包括一觸控表面、一主圖標以及複數副圖標。觸控表面具有一主區域以及複數副區域，複數副區域與該主區域相鄰。觸控表面之主圖標對應主區域，複數副圖標對應複數副區域，並且一副圖標對應一副區域。當主圖標受觸碰，使主區域產生一第一觸摸訊號控制複數副圖標顯示於複數副區域中，當複數副區域中之一副圖標受觸碰後，對應該副圖標的副區域產生一第二觸摸訊號並控制電子設備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a touch icon module. The touch icon module is electrically connected to an electronic device and used to control the electronic device. The touch icon module including a touch surface, a main icon and plurality of auxiliary icons. The touch surface including a main area and plurality of auxiliary areas. The main icon of the touch surface correspond to the main area, the plurality of auxiliary icons correspond to the plurality of auxiliary areas, and one of auxiliary icon corresponds to one of auxiliary area. When the main icon is touched, the main area is generated a first touch signal to controlled the plurality of auxiliary icons to be displayed in the plurality of auxiliary areas. When the one of auxiliary icon is touched, the auxiliary area corresponds to the auxiliary icon is generated a second touch signal and controlled the electronic device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:觸控圖標模組</p>
        <p type="p">N:電子設備</p>
        <p type="p">10:觸控表面</p>
        <p type="p">20:主圖標</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="275" publication-number="202615953">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615953</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138241</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241218B">G02F1/1343</main-classification>
        <further-classification edition="200601120241218B">G02F1/1347</further-classification>
        <further-classification edition="200601120241218B">G02F1/1333</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱育進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, YU-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭勝文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, SHENG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董人郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG, JEN-LANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種顯示裝置，包括第一基板、第二基板以及多個顯示單元，該些顯示單元中的至少一者包括第一結構以及第二結構。第一結構包括發光元件以及第一圖案層。第二結構包括第二圖案層以及第三圖案層。發光元件配置於第一基板的第一區域上。第一圖案層配置於第一基板的第二區域上。第二圖案層配置於第二基板的第三區域上。第三圖案層配置於第二基板的第四區域上。第一區域對應第三區域，第二區域對應第四區域。第二圖案層為光調變層且藉由第一電極層控制，第三圖案層為光調變層且藉由第二電極層控制。第一電極層以及所述第二電極層不連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device including a first substrate, a second substrate and a plurality of display units is provided. At least one display unit includes a first structure and a second structure. The first structure includes a light emitting element and a first pattern layer. The second structure includes a second pattern layer and a third pattern layer. The light emitting element is disposed on a first region of the first substrate. The first pattern layer is disposed on a second region of the first substrate. The second pattern layer is disposed on a third region of the second substrate. The third pattern layer is disposed on a fourth region of the second substrate. The first region corresponds to the third region, and the second region corresponds to the fourth region. The second pattern layer is a light modulation layer, and controlled via a first electrode layer. The third pattern layer is a light modulation layer, and controlled via a second electrode layer. The first electrode layer does not connect to the second electrode layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一結構</p>
        <p type="p">2:第二結構</p>
        <p type="p">10:第一基板</p>
        <p type="p">11、12、21、22:區域</p>
        <p type="p">20:第二基板</p>
        <p type="p">100:發光元件</p>
        <p type="p">101:第一圖案層</p>
        <p type="p">102:第二圖案層</p>
        <p type="p">103:第三圖案層</p>
        <p type="p">1000:顯示裝置</p>
        <p type="p">DU:顯示單元</p>
        <p type="p">E0:共電極</p>
        <p type="p">E1、E2:電極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="276" publication-number="202616731">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616731</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138242</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置與其高動態範圍影像產生方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND HIGH DYNAMIC RANGE IMAGE GENERATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250203B">H04N23/70</main-classification>
        <further-classification edition="202301120250203B">H04N23/741</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭珍如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHEN-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李建緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JIAN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置與其高動態範圍影像產生方法。電子裝置包括影像感測器，所述方法包括下列步驟。判斷拍攝場景屬於影片拍攝或靜態影像拍攝。根據影像感測器所擷取之至少一影像，決定拍攝場景的逆光狀態。當拍攝場景為影片拍攝，根據拍攝場景的逆光狀態決定採用第一高動態範圍模式或伽瑪調整模式來輸出一目標影像序列。當拍攝場景為靜態影像拍攝，根據拍攝場景的逆光狀態決定採用第二高動態範圍模式或伽瑪調整模式來輸出一目標影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device and a high dynamic range image generation method thereof are provided. The electronic device includes an image sensor, and the method includes the following steps. A shooting scene is determined to belong to either video recording or still image capture. Based on at least one image captured by the image sensor, the backlight condition of the shooting scene is determined. When the shooting scene is video recording, a first high dynamic range mode or gamma adjustment mode is selected to output a target image sequence, based on the backlight condition of the shooting scene. When the shooting scene is still image capture, a second high dynamic range mode or gamma adjustment mode is selected to output a target image, based on the backlight condition of the shooting scene.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210~S240:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="277" publication-number="202615134">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615134</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138246</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>揮發性有機廢氣淨化處理裝置及其淨化處理方法</chinese-title>
        <english-title>VOLATILE ORGANIC EXHAUST GAS PURIFICATION TREATMENT DEVICE AND PURIFICATION TREATMENT METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">B01D53/74</main-classification>
        <further-classification edition="200601120241105B">B01D53/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑智環境科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JG ENVIRONMENTAL TECHNOLOGY CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張豐堂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, FENG-TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃建良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張少謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種揮發性有機廢氣淨化處理裝置及其淨化處理方法，其裝置以管路連通於箱體與熱交換單元之間，其中有冷側旁通管一端連通廢氣輸入管，另一端連通前段管與後段管間的通道，廢氣輸入管與冷側旁通管的至少一者設置有控制氣體流量之閥門。由於有機廢氣從冷側旁通管通入熱交換單元的位置，是設在前段管與後段管間的通道，有機廢氣在通道的溫度會比在後段管輸出的溫度低而壓差小，使得控制閥門的開度能夠被穩定控制，確保有機廢氣穩定從冷側旁通管與前段管通入通道而均勻混和，避免後段管的結構材料因氣流溫度過高而發生結構性損壞。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a volatile organic exhaust gas purification treatment device and a purification treatment method thereof. The device is communicated between a casing and a heat exchange unit through a pipeline, one end of a cold side bypass pipe communicates with an exhaust gas input pipe, and the other end of the cold side bypass pipe communicates with a channel between the front section pipe and the rear pipe section. At least one of the exhaust gas input pipe and the cold side bypass pipe is provided with a control valve for controlling gas flow. Since the position where the organic waste gas flows from the cold side bypass pipe into the heat exchange unit is the channel between the front section pipe and the rear section pipe, the temperature of the organic exhaust gas in the channel will be lower than the temperature output in the rear section pipe, and the pressure difference will be smaller, the opening degree of the control valve can be controlled stably, to ensure that the organic exhaust gas flows stably into the channel from the cold side bypass pipe and the front section pipe and uniformly mixed, and to avoid structural damage to the structural materials of the rear section pipe due to excessive airflow temperature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:箱體</p>
        <p type="p">11:熱交換室</p>
        <p type="p">111:進氣口</p>
        <p type="p">112:排氣口</p>
        <p type="p">12:廢氣輸入管</p>
        <p type="p">13:廢氣輸出管</p>
        <p type="p">14:燃燒室</p>
        <p type="p">20:熱交換單元</p>
        <p type="p">21:殼體</p>
        <p type="p">22:前段管</p>
        <p type="p">221:第一進氣端</p>
        <p type="p">222:第一出氣端</p>
        <p type="p">23:後段管</p>
        <p type="p">231:第二進氣端</p>
        <p type="p">232:第二出氣端</p>
        <p type="p">24:熱吸收結構</p>
        <p type="p">25:通道</p>
        <p type="p">251:導流壁</p>
        <p type="p">26:第一預熱管</p>
        <p type="p">261:第三進氣端</p>
        <p type="p">262:第三出氣端</p>
        <p type="p">263:脫附入氣管</p>
        <p type="p">30:冷側旁通管</p>
        <p type="p">31:第一端</p>
        <p type="p">32:第二端</p>
        <p type="p">40:控制閥門</p>
        <p type="p">50:焚燒單元</p>
        <p type="p">51:爐頭</p>
        <p type="p">H:熱源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="278" publication-number="202616622">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616622</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138249</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種用於兩相位轉換器模組之控制系統、方法及其非暫態電腦可讀取儲存媒體</chinese-title>
        <english-title>A CONTROL SYSTEM, METHOD AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM THEREOF FOR 2 PHASES CONVERTER MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">H02M1/084</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光寶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李仲恆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZHONG-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡子翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, TZU-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的一方面為一種用於兩相位轉換器模組的控制方法。方法包括取樣兩相位轉換器模組的總輸出電壓、第一轉換器的第一輸出電壓及第一輸出電流、及第二轉換器的第二輸出電壓及第二輸出電流。方法同樣包括輸入有關於總輸出電壓的第一誤差量至第一控制器，以得到一第一計算結果。方法同樣包括輸入有關於總輸出電流的第二誤差量至第二控制器，以得到第二計算結果。方法同樣包括比較第一計算結果的值與第二計算結果的值，將其中較小的值經過週期轉換後同時設置為第一轉換器與第二轉換器的切換週期。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An aspect of the present disclosure features a control method for a 2 phases converter module. The method comprises sampling a total output voltage of the 2 phases converter, a first output current and voltage of a first converter, and a second output current and voltage of a second converter, of the 2 phases converter. The method also comprises inputting a first error related to the total output to a first controller to obtain a first calculation result. The method also comprises inputting a second error related to a total current to a first controller to obtain a second calculation result. The method also comprises comparing values of the first calculation result and the second calculation result, and setting the smaller value as a switching period for the first converter and the second converter after transforming the smaller value to a period.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:兩相位轉換器模組</p>
        <p type="p">110:第一轉換器</p>
        <p type="p">120:第二轉換器</p>
        <p type="p">130:中繼電路</p>
        <p type="p">200:控制系統</p>
        <p type="p">210:控制單元</p>
        <p type="p">220:主控制迴路</p>
        <p type="p">221:第一控制器</p>
        <p type="p">222:第二控制器</p>
        <p type="p">223:比較器</p>
        <p type="p">224:週期轉換器</p>
        <p type="p">230:均衡控制迴路</p>
        <p type="p">231:並聯計算模組</p>
        <p type="p">232:第三控制器</p>
        <p type="p">233:串聯計算模組</p>
        <p type="p">234:第四控制器</p>
        <p type="p">235:相移角度決定模組</p>
        <p type="p">Comp&lt;sub&gt;base&lt;/sub&gt;:主控制輸出值</p>
        <p type="p">Comp&lt;sub&gt;sharing&lt;/sub&gt;:均衡控制輸出值</p>
        <p type="p">Deff&lt;sub&gt;1&lt;/sub&gt;:第一相移角度</p>
        <p type="p">Deff&lt;sub&gt;2&lt;/sub&gt;:第二相移角度</p>
        <p type="p">I&lt;sub&gt;BAT&lt;/sub&gt;:總輸出電流</p>
        <p type="p">I&lt;sub&gt;P1_EV&lt;/sub&gt;:第一輸出電流</p>
        <p type="p">I&lt;sub&gt;P2_EV&lt;/sub&gt;:第二輸出電流</p>
        <p type="p">Period:切換週期</p>
        <p type="p">Rs&lt;sub&gt;1&lt;/sub&gt;:第一計算結果</p>
        <p type="p">Rs&lt;sub&gt;2&lt;/sub&gt;:第二計算結果</p>
        <p type="p">Rs&lt;sub&gt;3&lt;/sub&gt;:第三計算結果</p>
        <p type="p">Rs&lt;sub&gt;4&lt;/sub&gt;:第四計算結果</p>
        <p type="p">V&lt;sub&gt;BAT&lt;/sub&gt;:總輸出電壓</p>
        <p type="p">V&lt;sub&gt;P1_EV&lt;/sub&gt;:第一輸出電壓</p>
        <p type="p">V&lt;sub&gt;P2_EV&lt;/sub&gt;:第二輸出電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="279" publication-number="202614964">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614964</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138250</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>導引結構及應用導引結構的脊椎鏡組</chinese-title>
        <english-title>A GUIDE STRUCTURE AND A SPINAL SCOPE SET USING THE GUIDE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241106B">A61B1/317</main-classification>
        <further-classification edition="200601120241106B">A61B1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>天影科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECH-IMAGE COOPERATION LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林燕聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YEN TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭士豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, SHIH HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊益松</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明一種導引結構及應用導引結構的脊椎鏡組，其包括有導引結構及應用有導引結構的脊椎鏡組兩部分，首先在導引結構的結構上具有上持件、導管件及透明管件，上持件及透明管件分別裝設於導管件的兩端；又脊椎鏡組除了導引結構以外還具有脊椎槍，脊椎槍包含槍體及內視管，內視管一端的內部裝設攝像模組，攝像模組之部分顯露於內視管的另一端端面，且攝像模組顯露的部分相對內視管呈傾斜設置，又內視管顯露有攝像模組的一端活動的從上持件穿入，並經過導管件而從透明管件穿出進行拍攝，藉由透視部具有透明的設置下，醫療人員只需要轉動脊椎槍改變攝像模組的拍攝方向即可從透視部進行拍攝，不須轉動管型器械而造成患者患部的二次傷害，且內視鏡還會受到管型器械的遮擋而無法判斷患部的拍攝位置等缺失。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a guide structure and a spinal scope set using the guide structure. It includes two parts: a guide structure and a spinal scope set using the guide structure. First, the guide structure has an upper holding member, The conduit piece and the transparent pipe piece, the upper holding piece and the transparent pipe piece are respectively installed at both ends of the conduit piece; in addition to the guide structure, the spinal scope set also has a spinal gun, and the spinal gun includes a gun body and an internal viewing tube, and one end of the internal viewing tube A camera module is installed inside, and part of the camera module is exposed at the other end of the inner viewing tube, and the exposed part of the camera module is arranged at an angle relative to the inner viewing tube, and one end of the camera module is movable when exposed on the inner viewing tube. It penetrates from the upper holding part, and passes through the conduit part and out of the transparent pipe part for shooting. With the transparent part of the see-through part, the medical staff only needs to rotate the spinal gun to change the shooting direction of the camera module to shoot from the see-through part. When shooting, there is no need to rotate the tube-shaped instrument to cause secondary damage to the patient's affected part. Moreover, the endoscope will be blocked by the tube-shaped instrument and cannot determine the shooting position of the affected part.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:導引結構</p>
        <p type="p">1:上持件</p>
        <p type="p">11:穿孔</p>
        <p type="p">13:握持柄</p>
        <p type="p">131:凹槽</p>
        <p type="p">2:導管件</p>
        <p type="p">3:透明管件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="280" publication-number="202616633">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616633</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138252</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>交錯式維也納整流器裝置與其控制方法</chinese-title>
        <english-title>INTERLEAVED VIENNA RECTIFYING DEVICE AND CONTROLLING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">H02M7/217</main-classification>
        <further-classification edition="200701120250102B">H02M1/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光寶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周孝澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, HSIAO-TSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供交錯式維也納整流器裝置與其控制方法。對一電壓正負序分量與一電流正負序分量進行正負序分離，以將一電壓正序分量分離於一電壓負序分量分離，以及，將一電流正序分量分離於一電流負序分量分離。分別控制該電壓正序分量、該電壓負序分量、該電流正序分量與該電流負序分量。於一電流內環內，利用一比例積分(PI)控制器與一諧波消除(PR)控制器對該電壓正序分量、該電壓負序分量、該電流正序分量與該電流負序分量進行控制以產生複數個控制信號來控制該交錯式維也納整流電路的該些開關。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides an interleaved Vienna rectifier device and its control method. It involves performing positive and negative sequence separation on a voltage's positive and negative sequence components and a current's positive and negative sequence components, thereby separating the voltage's positive sequence component from its negative sequence component, and the current's positive sequence component from its negative sequence component. The voltage's positive sequence component, the voltage's negative sequence component, the current's positive sequence component, and the current's negative sequence component are separately controlled. Within a current inner loop, a Proportional-Integral (PI) controller and a Harmonic Elimination (PR) controller are used to control the voltage's positive sequence component, the voltage's negative sequence component, the current's positive sequence component, and the current's negative sequence component to generate multiple control signals that control the switches of the interleaved Vienna rectifier circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:交錯式維也納整流器裝置</p>
        <p type="p">110:交錯式維也納整流電路</p>
        <p type="p">120:控制器</p>
        <p type="p">L1-L9:電感</p>
        <p type="p">D1-D12:二極體</p>
        <p type="p">C1-C2:電容</p>
        <p type="p">Q1-Q12:開關</p>
        <p type="p">S1-S12:控制信號</p>
        <p type="p">V1-V3:交流輸入電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="281" publication-number="202615111">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615111</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138254</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>醫用導管減壓輔助裝置、鼻部支架、嘴部支架及口鼻支架組</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241031B">A61M25/01</main-classification>
        <further-classification edition="200601120241031B">A61M25/02</further-classification>
        <further-classification edition="200601120241031B">A61J15/00</further-classification>
        <further-classification edition="200601120241031B">A61B17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛教慈濟醫療財團法人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>花蓮縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立高雄科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王琬詳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施冠丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭淑敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林恒毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂明恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳陶霈瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇筱雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳靜怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐘珮真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種醫用導管減壓輔助裝置，包括口鼻支架組及頭部支架。口鼻支架組包括鼻部支架、嘴部支架與組合支架。鼻部支架與嘴部支架以組合支架相接在一起，使得鼻部支架放置對應於相對於鼻孔的位置，用於支撐及固定穿過鼻部支架的第一醫療導管，同時嘴部支架放置對應於相對於嘴部的位置，用於支撐及固定穿過嘴部支架的第二醫療導管，而頭部支架則包括底座、延伸部及導管固定部，其中延伸部設在底座一面與導管固定部的一面之間，底座背對延伸部的一面用於放置在額頭位置，而導管固定部背對延伸部的一面用於放置銜接第一醫療導管或第二醫療導管。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:口鼻支架組</p>
        <p type="p">10:鼻部支架</p>
        <p type="p">12:嘴部支架</p>
        <p type="p">14:組合支架</p>
        <p type="p">2:頭部支架</p>
        <p type="p">3:第一醫療導管</p>
        <p type="p">6:第一綁帶</p>
        <p type="p">8:頭部固定繩</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="282" publication-number="202616049">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616049</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138257</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>應用於農用機具之機上盒系統之智慧節能管理方法</chinese-title>
        <english-title>A SMART ENERGY-SAVING MANAGEMENT METHOD FOR A SET-TOP BOX SYSTEM USED IN AGRICULTURAL MACHINERY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250203B">G06F1/3203</main-classification>
        <further-classification edition="201101120250203B">H04N21/43</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邁森科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MYSHINE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王嗣諠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SZU-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林明正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MING-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅群智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, CHUN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪盟峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORNG, MONG-FONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭永興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, YUNG-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許智為</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李威聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種應用於農用機具之機上盒系統之智慧節能管理方法，步驟包含: 以一監控模組偵測該農用機具及該機上盒系統之使用狀態，以取得對應之一運行數據；運算該運行數據，以產生一耗能資訊；根據該耗能資訊產生一運行模式，該運行模式包含一高負載模式、一低負載模式及一休眠模式；及根據該運行模式輸出對應之一調整指令至該監控模組，以此，實現智慧化之管理及節能之目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a smart energy-saving management method for a set-top box system used in agricultural machinery. The method comprises the steps of: detecting the usage status of the agricultural machinery and the set-top box system using a monitoring module to obtain a corresponding operational data; processing the operational data to generate an energy consumption information; generating an operating mode based on the energy consumption information, with the operating mode including a high-load mode, a low-load mode, and a sleep mode; and outputting a corresponding adjustment command to the monitoring module based on the operating mode. Thus, smart management and energy-saving objectives can be achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:監控模組</p>
        <p type="p">2:動態負載管理模組</p>
        <p type="p">3:電源管理模組</p>
        <p type="p">4:資料傳輸管理模組</p>
        <p type="p">5:定位模組</p>
        <p type="p">6:儲存模組</p>
        <p type="p">F:農用機具</p>
        <p type="p">S:機上盒系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="283" publication-number="202616154">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616154</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138260</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>數位內容產生方法與數位內容產生系統</chinese-title>
        <english-title>DIGITAL CONTENT GENERATION METHOD AND DIGITAL CONTENT GENERATION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250203B">G06N20/00</main-classification>
        <further-classification edition="202301120250203B">G06N3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唯晶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINKING ENTERTAINMENT CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐文正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉同梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TUNG-MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種數位內容產生方法與數位內容產生系統。所述方法包括：建立風格描述資料庫；取得對應於目標用戶的身分識別資料；根據所述身分識別資料，從風格描述資料庫取得對應於目標用戶的風格描述資料；以及使用所述風格描述資料影響人工智慧模型的輸出，使人工智慧模型產生具有特定風格的數位內容。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A digital content generation method and a digital content generation system are disclosed. The method includes: establishing a style description database; obtaining identity identification data corresponding to a target user; obtaining style description data corresponding to the target user from the style description database according to the identity identification data; and influencing an output of an artificial intelligence model by using the style description data, so that the artificial intelligence model produces a digital content with a specific style.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S701~S704:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="284" publication-number="202615267">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615267</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138262</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於電池荷電狀態之電池交換方法，及其電池能源站</chinese-title>
        <english-title>BATTERY EXCHANGE METHODS BASED ON BATTERY STATE-OF-CHARGE, AND BATTERY ENERGY STATIONS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120241018B">B60L53/62</main-classification>
        <further-classification edition="201901120241018B">B60L53/80</further-classification>
        <further-classification edition="202401120241018B">G06Q50/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光陽工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWANG YANG MOTOR CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯一安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, YI-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈怡宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基於電池荷電狀態之電池交換方法，適用於用以收納且對複數電池進行充電之一電池能源站。首先，接收對應一用戶訂閱荷電狀態資料之一電池交換要求。接著，取得相應電池能源站中每一電池之一荷電狀態，其表示相應電池之一電池電量。於一電池選定作業中，將荷電狀態高於用戶訂閱荷電狀態資料之至少一特定電池進行排除，並由荷電狀態不高於用戶訂閱荷電狀態資料之至少一候選電池中選擇至少一目標電池，並相應於電池交換要求提供此目標電池。其中電池選定作業係由該至少一候選電池中優先選擇具有相應最高之荷電狀態之目標電池。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Battery exchange methods based on battery state-of-charge (SOC) are provided, which are suitable for a battery energy station used for storing and charging a plurality of batteries. First, a battery exchange request with user's subscribed SOC data is received. Then, a SOC which indicates a battery power of each battery is obtained. In a battery selection operation, at least one specific battery whose battery SOC is higher than the user's subscribed SOC data is excluded from the battery selection operation. At least one target battery is selected from at least one candidate whose SOC in the battery is not higher than the user's subscribed SOC data, and the target battery is provided in response to the battery exchange request. The battery selection operation is to preferentially select the target battery with the highest SOC from the at least one candidate battery.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S310、S320、S330、S340:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="285" publication-number="202616494">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616494</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138267</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>車用運算裝置</chinese-title>
        <english-title>COMPUTING DEVICE FOR AUTOMOBILES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">H01L23/34</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明泰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPHA NETWORKS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴瑞言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI, RUEI-YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜智維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林柏辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PO-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊淇閎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHI-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可改變處理晶片操作溫度的車用運算裝置，包含一處理晶片、一控溫模組、一溫度偵測模組、一訊號處理模組，及一控制模組。溫度偵測模組偵測處理晶片的溫度。訊號處理模組判斷溫度是否符合設定，若不在一溫度上限值和一溫度下限值之間，則產生一加熱訊號或一冷卻訊號。控制模組根據加熱訊號或冷卻訊號將控溫模組切換至導通狀態，控溫模組將處理晶片的晶片溫度調整至一穩定操作溫度。透過控溫模組調整處理晶片的操作溫度以改用一般處理晶片取代車用晶片，並可達到車用晶片溫度可靠度測項要求之目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An automotive computing device used for changing a chip temperature of a controlling chip includes a controlling chip, a temperature control module, a temperature detecting module, a signal processing module, and a control module. The temperature detecting module detects the temperature of the controlling chip. The signal processing module determines whether the value of the temperature of the controlling chip meets the setting or not. If the value of the temperature of the controlling chip is larger than an upper limit temperature value or lower than a lower limit temperature value, the signal processing module generates a heating signal or a cooling signal. The control module conducts the temperature control module according to the heating signal or the cooling signal, and the temperature control module adjusts the chip temperature of the controlling chip to a stable operating temperature. Via the temperature control module adjusts the chip temperature of the controlling chip, a normal chip satisfies road vehicle testing items, and can be used to replace an automotive chip.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:處理晶片</p>
        <p type="p">2:控溫模組</p>
        <p type="p">21:加熱部件</p>
        <p type="p">211:主加熱器</p>
        <p type="p">212:副加熱器</p>
        <p type="p">22:冷卻部件</p>
        <p type="p">31:溫度偵測模組</p>
        <p type="p">32:電壓偵測模組</p>
        <p type="p">33:電流偵測模組</p>
        <p type="p">41:電源模組</p>
        <p type="p">42:控制模組</p>
        <p type="p">5:訊號處理模組</p>
        <p type="p">61:第一發光元件</p>
        <p type="p">62:第二發光元件</p>
        <p type="p">63:第三發光元件</p>
        <p type="p">81:車用周邊元件</p>
        <p type="p">821:車載電源</p>
        <p type="p">822:外接電源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="286" publication-number="202615255">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615255</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138269</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學膜</chinese-title>
        <english-title>OPTICAL FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250402B">B32B27/00</main-classification>
        <further-classification edition="201901120250402B">B32B7/023</further-classification>
        <further-classification edition="200601120250402B">B32B7/12</further-classification>
        <further-classification edition="200601120250402B">G02B5/30</further-classification>
        <further-classification edition="200601120250402B">G02F1/13363</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>誠美材料科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG MEI MATERIALS TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林必松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PI-SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃雅郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YA-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪詩惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, SHI-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種光學膜。光學膜包含正C相位差板、負B相位差板以及黏著層，其中黏著層設於正C相位差板與負B相位差板之間，以接合正C相位差板與負B相位差板。黏著層在25℃下之儲存彈性模數為1.0×10        &lt;sup&gt;5&lt;/sup&gt;Pa至10×10        &lt;sup&gt;5&lt;/sup&gt;Pa。藉此，可避免光學膜在受到衝擊應力後產生裂紋。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical film is provided. The optical film includes a positive C retardation plate, a negative B retardation plate and an adhesive layer, in which the adhesive layer is disposed between the positive C retardation plate and the negative B retardation plate, thereby joining the positive C retardation plate and the negative B retardation plate. The adhesive layer has a storage modulus of 1.0×10        &lt;sup&gt;5&lt;/sup&gt;Pa to 10×10        &lt;sup&gt;5&lt;/sup&gt;Pa under 25°C. Therefore, the optical film can avoid cracking after suffering impact stress.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學膜</p>
        <p type="p">110:正C相位差板</p>
        <p type="p">120:負B相位差板</p>
        <p type="p">130:黏著層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="287" publication-number="202616841">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616841</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138270</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電晶體以及其製作方法</chinese-title>
        <english-title>TRANSISTOR AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10D30/00</main-classification>
        <further-classification edition="202501120250102B">H10D62/80</further-classification>
        <further-classification edition="202501120250102B">H10D62/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡明樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MING-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張維軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, WEI-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏浩評</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, HAO-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭晉佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHIN-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電晶體，包括一井區，設置在一基底中，一閘極結構，設置在井區之上，一閘極氧化物層，其中閘極氧化物層的一第一部分比閘極氧化物層的一第二部分厚，一第一摻雜區與一第二摻雜區，設置在井區中，其中沿著水平方向，第一摻雜區與閘極氧化物層的第一部分之間的距離大於第二摻雜區與閘極氧化物層的第二部分之間的距離，以及一金屬矽化物遮罩，位於基底上並且位於閘極結構的其中一側，其中金屬矽化物遮罩位於閘極氧化物層的第一部分與第一摻雜區之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a transistor, which comprises a well region arranged in a substrate, a gate structure arranged on the well region, a gate oxide layer, wherein a first part of the gate oxide layer is thicker than a second part of the gate oxide layer, a first doped region and a second doped region arranged in the well region, wherein along the horizontal direction, the distance between the first doped region and the first part of the gate oxide layer is greater than the distance between the second doped region and the second part of the gate oxide layer, and a metal silicide block located on the substrate and at one side of the gate structure, wherein the metal silicide block is located between the first part of the gate oxide layer and the first doped region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體基底</p>
        <p type="p">12:深井區</p>
        <p type="p">14A:井區</p>
        <p type="p">20:隔離結構</p>
        <p type="p">30:閘極氧化物層</p>
        <p type="p">101:高壓電晶體</p>
        <p type="p">D1:水平方向</p>
        <p type="p">D2:水平方向</p>
        <p type="p">D3:垂直方向</p>
        <p type="p">DR11:摻雜區(第一摻雜區)</p>
        <p type="p">DR12:摻雜區(第二摻雜區)</p>
        <p type="p">GS1:閘極結構</p>
        <p type="p">L:長度</p>
        <p type="p">L1:長度</p>
        <p type="p">L2:長度</p>
        <p type="p">L3:長度</p>
        <p type="p">L4:長度</p>
        <p type="p">LD11:漂移區</p>
        <p type="p">LD12:漂移區</p>
        <p type="p">P11:第一部分</p>
        <p type="p">P12:第二部分</p>
        <p type="p">SAB:金屬矽化物遮罩</p>
        <p type="p">SP1:側壁子</p>
        <p type="p">SP2:側壁子</p>
        <p type="p">TK1:厚度</p>
        <p type="p">TK2:厚度</p>
        <p type="p">X1:距離</p>
        <p type="p">X2:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="288" publication-number="202616058">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616058</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138277</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>透光觸壓顯示裝置</chinese-title>
        <english-title>LIGHT-TRANSMISSIVE TOUCH DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241028B">G06F3/041</main-classification>
        <further-classification edition="200601120241028B">G02F1/1333</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>絢麗光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRILLIANT OPTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TSUNG HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李承璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHENG-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張立旻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, LI-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭端毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, DUAN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林冠吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUAN-WU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂致毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, JHIH-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林欣儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種透光觸壓顯示裝置，用以解決習知穿透式顯示面板低對比度的問題。係包含：二基板，彼此相對並分別電性連接一電壓源，用於在該二基板之間形成可切換之一電場，其中該二基板的相對內側呈水平配向；及一液晶層，包含填充於該二基板之間的一液晶材料，該液晶材料包含一向列型液晶、一旋性分子及一吸收染料，用於分別響應一外部壓力或該電場而切換該液晶層至一反射態或一透光態；其中，該吸收染料在該反射態吸收入射至該液晶層的一穿透光，以減少對一反射光成像的干擾。藉此可以達成提升影像品質的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light-transmissive touch display includes two substrates and a liquid crystal layer, for solving the problems of low display contrast associated with conventional transmissive display panels. The two substrates face each other in parallel and are electrically connected to a voltage source to create a switchable electric field between them. The liquid crystal layer, filled with a liquid crystal material, is located between the two substrates. The liquid crystal material includes a nematic liquid crystal, a chiral molecule, and an absorptive dye. The liquid crystal material responds to external touch or the electric field respectively to switch between a reflective state and a transmissive state. The absorptive dye absorbs transmitted light in the liquid crystal layer to reduce interference from the transmitted light on imaging. This provides the effects of enhancing image quality.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">2:液晶層</p>
        <p type="p">21:液晶材料</p>
        <p type="p">L11:環境光線</p>
        <p type="p">L12:反射光線</p>
        <p type="p">L21:透射光線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="289" publication-number="202616151">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616151</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138283</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於人工智慧的考題生成方法及考題生成系統</chinese-title>
        <english-title>AI-BASED EXAM QUESTION GENERATING METHOD AND SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241218B">G06N5/04</main-classification>
        <further-classification edition="202301120241218B">G06N5/045</further-classification>
        <further-classification edition="201201120241218B">G06Q50/20</further-classification>
        <further-classification edition="201901120241218B">G06F16/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>優派國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIEWSONIC INTERNATIONAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林心玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳以昕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, I-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧與明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱　國偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, KEVIN-KUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛昀城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIN, YUN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王順達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHUN-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林晉守</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIN-SHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何宏發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, WANG-FAT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基於人工智慧的考題生成方法，包括接收一使用者輸入的至少一參考資料；接收該使用者輸入的至少一考題參數；以及透過一人工智慧模型，生成複數個考題規則，並根據該至少一參考資料及該至少一考題參數，生成符合該複數個考題規則之至少一考題；其中，該人工智慧模型經過一預訓練過程，該預訓練過程包括將至少一教育資料設定為一訓練資料集；以及分析該訓練資料集，以歸納出該複數個考題規則。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An artificial intelligence-based method for generating exam questions, includes receiving at least one reference material input by a user; receiving at least one exam parameter input by the user; and through an artificial intelligence model, generating multiple exam question rules, and generating at least one exam question that conforms to the multiple exam question rules based on the at least one reference material and the at least one exam parameter; wherein the artificial intelligence model has undergone a pre-training process, and the pre-training process includes setting at least one educational material as a training dataset; and analyzing the training dataset to induce the multiple exam question rules.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:考題生成流程</p>
        <p type="p">100~108:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="290" publication-number="202616911">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616911</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138285</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製造點接觸太陽能電池的方法及設備</chinese-title>
        <english-title>METHOD OF MANUFACTURING POINT-CONTACT SOLAR CELLS AND APPARATUS USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10F77/20</main-classification>
        <further-classification edition="200601120250102B">H01B1/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友晁能源材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERASOLAR ENERGY MATERIALS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳邦豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU,BANG HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN,SHIH CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯承訓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG,CHENG SYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">茲描述藉由改善電極接觸阻抗並形成點接觸以達成高效率太陽能電池的製造方法及設備。方法包括提供具有金屬電極於表面的矽晶片，及施加包括脈衝開啟時間和脈衝關閉時間的高頻脈衝電壓至金屬電極。方法進一步包括在施加高頻脈衝電壓下，利用雷射照射矽晶片並進行掃描。在脈衝開啟時間期間，雷射光子促使金屬電極受到高頻脈衝電壓作用的對應部分內的金屬與矽晶片表面附近的矽受熱相互擴散，而於矽晶片與金屬電極間的界面原位形成複數個分離導通區。設備包括承載裝置、導電模組、脈衝電源供應器及雷射，用以施行本文所述各種方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The method and the apparatus of manufacturing high-efficiency solar cells by reducing contact resistance and forming point contacts are described. The method includes providing a silicon substrate with a metallic electrode on its surface, and applying a high-frequency pulsed voltage comprised of an on-time duration and an off-time duration to the metallic electrode. The method further includes illuminating the silicon substrate using a laser and scanning the substrate under the high-frequency pulsed voltage. For the on-time duration, photons from the laser cause metal within a corresponding portion of the metallic electrode affected by the high-frequency pulsed voltage to thermally inter-diffuse with silicon near the surface of the substrate, in-situ forming a plurality of separate contact pathways in the interface between the silicon substrate and the metallic electrode. The apparatus disclosed herein includes a carrying device, a conductive module, a pulsed power supply, and a laser to perform various inventive methods.</p>
      </isu-abst>
      <representative-img>
        <p type="p">310:矽晶片</p>
        <p type="p">324:金屬層</p>
        <p type="p">326:分離導通區</p>
        <p type="p">350:高頻脈衝電壓</p>
        <p type="p">360:光源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="291" publication-number="202616251">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616251</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138286</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示畫面更新控制裝置及其方法</chinese-title>
        <english-title>DISPLAY FRAME UPDATE CONTROL DEVICE AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120241104B">G09G3/32</main-classification>
        <further-classification edition="200601120241104B">G06F3/147</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>星亞視覺股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STAR ASIA VISION CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國書</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, KUO-SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧翔宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENG, HSIANG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁國隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種顯示畫面更新控制裝置及其方法。顯示畫面更新控制裝置包含一畫面暫存元件以及一畫面更新處理元件。畫面暫存元件依序接收一第一影像資料與一第二影像資料，分別儲存於一第一暫存區與一第二暫存區，該等影像資料分別具有複數個區塊資料，對應於複數個區塊位置編號。畫面更新處理元件比對第一影像資料與第二影像資料相對應之各區塊位置編號之各區塊資料。當第一影像資料與第二影像資料相對應之各區塊資料不同時，暫存至少一不同區塊資料並標記至少一不同區塊資料之至少一不同區塊位置編號，當被標記的至少一不同區塊資料之一數量小於一設定值，且顯示畫面更新控制裝置之一畫面補償功能開啟時，依據第一影像資料與第二影像資料產生一第一中間值影像資料，並於一第一半畫面週期時點提供第一中間值影像資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a display frame update control device and a method thereof. The display frame update control device comprises a frame buffer element and a frame update processing element. The frame buffer element sequentially receives first image data and second image data, stored in a first buffer area and a second buffer area, respectively. The image data contains a plurality of block data corresponding to a plurality of block position numbers. The frame update processing element compares the block data of the corresponding block position numbers between the first image data and the second image data. When the block data between the first and second image data differ, it temporarily stores at least one different block data and marks at least one different block position number. If the number of different block data marked is less than a set value, and when a frame compensation function of the display frame update control device is enabled, a first intermediate value image data is generated based on the first and second image data, and the first intermediate value image data is provided at a first half-frame period time point.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:顯示畫面更新控制裝置</p>
        <p type="p">11:畫面暫存元件</p>
        <p type="p">111:第一暫存區</p>
        <p type="p">113:第二暫存區</p>
        <p type="p">13:畫面更新處理元件</p>
        <p type="p">131:比較單元</p>
        <p type="p">133:補償畫面暫存單元</p>
        <p type="p">135:更新標記單元</p>
        <p type="p">137:畫面補償單元</p>
        <p type="p">139:傳送選擇單元</p>
        <p type="p">2:顯示裝置</p>
        <p type="p">21:顯示面板</p>
        <p type="p">23:訊號轉換單元</p>
        <p type="p">25:串流傳輸單元</p>
        <p type="p">3:影像資料提供裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="292" publication-number="202615732">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615732</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138289</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>玻璃基板電鍍夾具</chinese-title>
        <english-title>GLASS SUBSTRATE PLATING FIXTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241014B">C25D17/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>億鴻工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PROCESS ADVANCE TECHNOLOGY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李伯仲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, PO-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種玻璃基板電鍍夾具包括夾具基座、第一金屬夾持件與第二金屬夾持件。該第一金屬夾持件為金屬材料製成，且該第一金屬夾持件之其中一側面為凹凸連續交錯排列的一第一凹凸狀平面，其中第偶數個位置之凸狀表面為內崁著具有彈性材質之一第一軟性接觸部，其中第奇數個位置之凸狀表面為一第一硬性接觸部。該第二金屬夾持件為金屬材料製成，且該第二金屬夾持件之其中一側面為凹凸連續交錯排列的一第二凹凸狀平面，其中第奇數個位置之凸狀表面為內崁著具有彈性材質之一第二軟性接觸部，其中第偶數個位置之凸狀表面為一第二硬性接觸部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A glass substrate plating fixture includes a fixture base, a first metal clamping member and a second metal clamping member. The first metal clamp is made of metal, and one side of the first metal clamp is a first concave-convex plane with a continuous concave-convex staggered arrangement, wherein the convex surface of the even-numbered positions is embedded with a first soft contact portion made of elastic material, and the convex surface of the odd-numbered positions is a first hard contact portion. The second metal clamp is made of metal, and one side of the second metal clamp is a second concave-convex plane with a continuous concave-convex staggered arrangement, wherein the convex surface of the odd-numbered positions is embedded with a second soft contact portion made of an elastic material, and the convex surface of the even-numbered positions is a second hard contact portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:玻璃基板電鍍夾具</p>
        <p type="p">120:第一金屬夾持件</p>
        <p type="p">122:第一軟性接觸部</p>
        <p type="p">124:第一硬性接觸部</p>
        <p type="p">126:第一凹凸狀平面</p>
        <p type="p">130:第二金屬夾持件</p>
        <p type="p">132:第二軟性接觸部</p>
        <p type="p">134:第二硬性接觸部</p>
        <p type="p">136:第二凹凸狀平面</p>
        <p type="p">GB:玻璃基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="293" publication-number="202616623">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616623</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138292</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電源轉換裝置及其控制方法</chinese-title>
        <english-title>POWER CONVERSION DEVICE AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200701120250102B">H02M1/42</main-classification>
        <further-classification edition="200601120250102B">H02M7/217</further-classification>
        <further-classification edition="200601120250102B">H02M3/156</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光寶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李仲恆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZHONG-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電源轉換裝置及其控制方法，該電源轉換裝置包括一功率因數校正電路、耦接至該功率因數校正電路的一LLC轉換器，以及耦接至該功率因數校正電路及該LLC轉換器的一控制器，該功率因數校正電路輸出一直流電壓及該直流電壓的漣波電壓，該LLC轉換器接收該直流電壓並輸出一輸出電流，該控制器則接收該漣波電壓及該輸出電流，並產生多個開關控制訊號至該LLC轉換器；其中，該控制器根據該漣波電壓對該輸出電流進行補償，以調節該等開關控制訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a power conversion device and a control method thereof. The power conversion device comprises a power factor correction circuit, an LLC converter coupled to the power factor correction circuit, and a controller coupled to the power factor correction circuit and the LLC converter. The power factor correction circuit outputs a direct-current voltage and a ripple voltage of the direct-current voltage. The LLC converter receives the direct-current voltage and outputs an output current. The controller receives the ripple voltage and the output current, and generates a plurality of switch control signals to the LLC converter. The controller compensates the output current according to the ripple voltage to adjust the plurality of switch control signals.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:功率因數校正電路</p>
        <p type="p">12:LLC轉換器</p>
        <p type="p">13:控制器</p>
        <p type="p">Vbus:直流電壓</p>
        <p type="p">Vbus_Ripple:漣波電壓</p>
        <p type="p">Io:輸出電流</p>
        <p type="p">S1、S2、S3、S4:開關控制訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="294" publication-number="202615760">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615760</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138298</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁磚掛件及建物結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241216B">E04F13/21</main-classification>
        <further-classification edition="200601120241216B">E04F13/22</further-classification>
        <further-classification edition="200601120241216B">E04C2/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李俊明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>南投縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李俊明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡芝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為應用於建物表面施工的一種磁磚掛件及建物結構，用以解決懸掛磁磚於外牆之破壞牆面的問題，係掛設於一牆壁所設二溝槽，用於固定一磁磚外牆，其包含有:一掛件組，係更包含有二片體，其中該二片體設有一貼合面，而該貼合面設有一結合部及二固定部，且該二片體互為鏡射方向使該貼合面對齊，又該貼合面延伸設有一相對垂直面，而該貼合面與該相對垂直面呈直角，又其中該相對垂直面的另一端延伸出一傾斜卡合面；二鎖固組，係分別接設於該掛件組的二片體之該二固定部，使該二片體互相固定；藉由二片體拆開再組合，解決不需破壞外牆整體結構性之問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">A:磁磚掛件</p>
        <p type="p">1:掛件組</p>
        <p type="p">10:片體</p>
        <p type="p">11:貼合面</p>
        <p type="p">111:結合部</p>
        <p type="p">12:相對垂直面</p>
        <p type="p">13:傾斜卡合面</p>
        <p type="p">2:鎖固組</p>
        <p type="p">21:螺絲</p>
        <p type="p">22:螺帽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="295" publication-number="202615330">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615330</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138301</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>封口罐</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B67B3/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佳錡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佳錡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種封口罐，包含一被配置為金屬材料且界定一容室的罐身、一可卸離地對合於該罐身的罐蓋，及一可被破壞地連接於該罐身且封閉該容室的封口膜。該罐身包括一向一內表面捲收的開口緣。該封口膜可被破壞地連接於該罐身，且隱藏在該罐身與該罐蓋間。該封口膜包括一被限位在該開口緣與該內表面間的周緣，且能夠由一封閉狀態變化至一破損狀態。在該封閉狀態時，該封口膜封閉該容室。在該破損狀態時，該封口膜開放該容室。藉此，通過未被破壞的封口膜，確保該容室未被開啟，進而提升包裝美感，及原封可靠度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:罐身</p>
        <p type="p">20:容室</p>
        <p type="p">21:內表面</p>
        <p type="p">22:外表面</p>
        <p type="p">23:開口緣</p>
        <p type="p">24:封口部</p>
        <p type="p">3:罐蓋</p>
        <p type="p">4:封口膜</p>
        <p type="p">41:周緣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="296" publication-number="202615840">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615840</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138303</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>生物檢測晶片之定量塗佈方法</chinese-title>
        <english-title>QUANTITATIVE COATING METHOD FOR BIODETECTION CHIPS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">G01N1/28</main-classification>
        <further-classification edition="200601120241105B">G01N27/02</further-classification>
        <further-classification edition="200601120241105B">G01N33/543</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國家原子能科技研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL ATOMIC RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王娟瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊亦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇星華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, SING-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐奉璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明旨在揭露一種生物檢測晶片之定量塗佈方法，可運用於各類塗佈加工，不須架設昂貴機台。本方法係以擋牆作為控制塗佈範圍及厚度之方法，堆疊在欲塗佈之處四周，再將塗佈液注入至矽膠牆填滿。此法可減少塗佈液的消耗、噴濺，且能將厚度控制於一定範圍內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention aims to reveal a quantitative coating method for biodetection chips, which can be applied to various coating processes without the need to erect expensive machines. This method uses the retaining wall as a method to control the coating range and thickness, stacks it around the place to be coated, and then injects the coating solution into the silica gel wall to fill it. This method can reduce the consumption of coating solution, splashing, and control the thickness within a certain range.</p>
      </isu-abst>
      <representative-img>
        <p type="p">s11~s13:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="297" publication-number="202616567">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616567</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138304</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>固定端子連接器及其組裝方法</chinese-title>
        <english-title>FIXED TERMINAL CONNECTOR AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120241120B">H01R12/70</main-classification>
        <further-classification edition="200601120241120B">H01R13/02</further-classification>
        <further-classification edition="200601120241120B">H01R13/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀚荃股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CVILUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃文星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WUN-SING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃靜雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之固定端子連接器，包含：連接器本體、至少一組固定件及連接端子；該連接器本體設有一個或一個以上之端子槽，上方適當處設有彈片固定槽A，下方適當處設有彈片固定槽B，而該連接器本體二側適當處設有一個或一個以上之固定卡條；該固定件分為上固定件及下固定件，該上固定部為一長方條體，左右二側均向下彎折90°並延伸，形成適當長度之固定部A，該固定部A內設有檔塊A，且該上固定部之下方設有一個或一個以上之上彈片；該下固定件為一長方條體，左右二側均向上彎折90°並延伸，形成適當長度之固定部B，該固定部B內設有檔塊B，且該下固定部之上方設有一個或一個以上之下彈片；該連接端子具有一接觸端及一鉚線端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The fixed terminal connector of the present invention includes: a connector body, at least one set of fixing parts and connecting terminals; the connector body is provided with one or more terminal slots, and a spring fixing slot A is provided at an appropriate place above, and a spring fixing slot A is provided at an appropriate place below. There is an elastic piece fixing groove B, and one or more fixing strips are provided at appropriate places on both sides of the connector body; the fixing part is divided into an upper fixing part and a lower fixing part, and the upper fixing part is a rectangular bar , both the left and right sides are bent downward at 90° and extended to form a fixed part A of appropriate length. There is a stopper A inside the fixed part A, and one or more upper elastic pieces are provided below the upper fixed part; The lower fixing piece is a rectangular body, with both left and right sides bent upward at 90° and extended to form a fixing part B of appropriate length. The fixing part B is provided with a stopper B, and above the lower fixing part is There is one or more lower spring pieces; the connection terminal has a contact end and a riveting end.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:固定端子連接器</p>
        <p type="p">10:連接器本體</p>
        <p type="p">100:端子槽</p>
        <p type="p">101:彈片固定槽A</p>
        <p type="p">103:固定卡條</p>
        <p type="p">1031:上固定卡條</p>
        <p type="p">1032:下固定卡條</p>
        <p type="p">104:防止壁部</p>
        <p type="p">11:固定件</p>
        <p type="p">110:上固定件</p>
        <p type="p">1104:卡勾</p>
        <p type="p">111:下固定件</p>
        <p type="p">1111:固定部B</p>
        <p type="p">1112:檔塊B</p>
        <p type="p">1113:下彈片</p>
        <p type="p">12:連接端子</p>
        <p type="p">120:接觸端</p>
        <p type="p">121:鉚線端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="298" publication-number="202615817">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615817</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138307</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>車用底盤狀態檢知系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">G01B21/16</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>昕銳智能車輛科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN RUEI INTELLIGENT VEHICLE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巫紘全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HUNG-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉箐茹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種車用底盤狀態檢知系統，包含：第一偵測裝置，安裝於輪圈蓋的輪圈蓋中心位置，第一偵測裝置取得圈胎結構的第一加速度數據且包含第一傳輸模組：第二偵測裝置，設置於底盤主體，第二偵測裝置包含第二加速度計及第二傳輸模組，第二傳輸模組通訊連接於第一傳輸模組，並且第二偵測裝置運用第二加速度計以取得底盤主體的一第二加速度數據；第二偵測裝置將第二加速度數據與同一時間區間之第一加速度數據進行比較以得出加速度差異值，並且將加速度差異值與預定加速度閾值進行比較以產生出避震器訊號、車輛寬度間隙訊號及/或車輛長度間隙訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:車輛</p>
        <p type="p">110:第一偵測裝置</p>
        <p type="p">120:第二偵測裝置</p>
        <p type="p">141:底盤中心軸線</p>
        <p type="p">142:底盤中心位置</p>
        <p type="p">150:輪軸</p>
        <p type="p">170:輪胎</p>
        <p type="p">200:資料中心</p>
        <p type="p">300:用戶端</p>
        <p type="p">1000:車用底盤狀態檢知系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="299" publication-number="202614952">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614952</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138308</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>煎烤設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241031B">A47J37/00</main-classification>
        <further-classification edition="200601120241031B">A47J37/06</further-classification>
        <further-classification edition="200601120241031B">A47J37/10</further-classification>
        <further-classification edition="200601120241031B">G05D23/30</further-classification>
        <further-classification edition="200601120241031B">G05D23/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳鳳學校財團法人吳鳳科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱榮祿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, JUNG-LU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫佳蓉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, CHIA-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊宗益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, ZONG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳品瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEH, PIN-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許慧雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HUI-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種煎烤設備，包含煎烤裝置、影音輸出裝置、資料庫、溫度感測器及控制裝置。該資料庫儲存有多個煎烤教學檔。每一煎烤教學檔具有多個動作指示片段。每一動作指示片段設定有溫度條件及時間條件。控制裝置於執行煎烤教學檔的動作指示片段時，會於判斷計時之時間滿足對應之時間條件及/或煎烤裝置之溫度滿足對應之溫度條件時，切換執行下一動作指示片段。透過該控制裝置會經由該影音輸出裝置輸出煎烤教學檔以供觀看，並於判斷對應之時間條件及/或溫度條件被滿足，就切換執行下一動作指示片段的設計，可用以對廚房新手進行自動煎烤教學。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">101:食材</p>
        <p type="p">102:煎烤用具</p>
        <p type="p">103:使用者</p>
        <p type="p">2:煎烤裝置</p>
        <p type="p">21:煎烤板</p>
        <p type="p">22:加熱器</p>
        <p type="p">3:影像擷取裝置</p>
        <p type="p">5:點餐裝置</p>
        <p type="p">51:點餐模組</p>
        <p type="p">6:調味指示裝置</p>
        <p type="p">61:容置槽</p>
        <p type="p">62:調味指示器</p>
        <p type="p">7:影音輸出裝置</p>
        <p type="p">9:控制裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="300" publication-number="202614974">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614974</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138309</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>管狀打結裝置</chinese-title>
        <english-title>TUBULAR KNOTTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">A61B17/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邁磊醫療器材股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATRIXLABS MEDICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋清俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNG, CHING CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王中志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUNG CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何崇民</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種管狀打結裝置，包含中空的一操作件，以及貫穿該操作件的一縫合線，該縫合線其中一端纏繞於該操作件之外表面以形成一預打結以及位置於該操作件與該預打結之間的一打結線段，該管狀打結裝置於未使用時，該打結線段沿著該長度方向抵靠於操作件之外表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A tubular knotting device has a hollow operating member and a suture thread through the operating member. One end of the suture is wrapped around the outer surface of the operating member to form a pre-knot and a knotting segment between the pre-knot and the operating member. The knotting segment abuts against the outer surface of the operating member along a length direction before the tubular knotting device is used.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:操作件</p>
        <p type="p">11:遠端</p>
        <p type="p">12:近端</p>
        <p type="p">15:外表面</p>
        <p type="p">20:縫合線</p>
        <p type="p">21:預打結</p>
        <p type="p">22:打結線段</p>
        <p type="p">23:縫合線末端</p>
        <p type="p">24:操作結構</p>
        <p type="p">241:死結</p>
        <p type="p">242:拉動環</p>
        <p type="p">A:縫針</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="301" publication-number="202616784">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616784</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138310</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可彎折電路板</chinese-title>
        <english-title>BENDABLE CIRCUIT BOARD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241029B">H05K1/03</main-classification>
        <further-classification edition="200601120241029B">H05K1/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商宏啟勝精密電子（秦皇島）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商鵬鼎控股（深圳）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVARY HOLDING (SHENZHEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鵬鼎科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李成佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHENG-JIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可彎折電路板包括第一結構以及第二結構。第一結構包括第一絕緣層、第一絕緣延展材料、第一導電層以及第一導電延展特徵。第一絕緣延展材料環繞第一絕緣層。第一導電層包含第一導電特徵以及第二導電特徵。第一導電延展特徵連接第一導電特徵至第二導電特徵。第二結構，沿垂直方向與第一結構接合，其中第二結構包括第二絕緣層、第二絕緣延展材料、第二導電層以及第二導電延展特徵。第二絕緣延展材料環繞第二絕緣層。第二導電層包含第三導電特徵以及第四導電特徵。第二導電延展特徵連接第三導電特徵至第四導電特徵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bendable circuit board includes a first structure and a second structure. The first structure includes a first insulation layer, a first insulation extension material, a first conductive layer and a first conductive extension feature. The first insulation extension material surrounds the first insulation layer. The first conductive layer includes a first conductive feature and a second conductive feature. The first conductive extension feature connects the first conductive feature to the second conductive feature. The second structure is bonded to the first structure along a vertical direction, in which the second structure includes a second insulation layer, a second insulation extension material, a second conductive layer and a second conductive extension feature. The second insulation extension material surrounds the second insulation layer. The second conductive layer includes a third conductive feature and a fourth conductive feature. The second conductive extension feature connects the third conductive feature to the fourth conductive feature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:可彎折電路板</p>
        <p type="p">110、120:結構</p>
        <p type="p">112、122:絕緣層</p>
        <p type="p">114、124:絕緣延展材料</p>
        <p type="p">114A、114B、124A、124B:部分</p>
        <p type="p">112A、112B、112C、112D、114C、114D、122A、122B、122C、122D、124C、124D:表面</p>
        <p type="p">116、126:導電層</p>
        <p type="p">116A、116B、126A、126B:導電特徵</p>
        <p type="p">118、128、140:導電延展特徵</p>
        <p type="p">130:可拉伸膠層</p>
        <p type="p">CV:腔體</p>
        <p type="p">W1、W2、W3:寬度</p>
        <p type="p">TH1、TH2、TH3、TH4、TH5、TH6、TH7、TH8:厚度</p>
        <p type="p">X、Y、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="302" publication-number="202616659">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616659</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138311</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電壓值移位器</chinese-title>
        <english-title>VOLTAGE LEVEL SHIFTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">H03K5/003</main-classification>
        <further-classification edition="200601120250102B">H03K19/0185</further-classification>
        <further-classification edition="202001120250102B">H03K19/17788</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宗仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUNG-ZEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電壓值移位器。電壓值移位器包括電壓準位移位電路以及升壓電路。電壓準位移位電路操作在第一電壓以及第二電壓之間。電壓準位移位電路包括交叉耦合電晶體對以及差動電晶體對。差動電晶體對耦接交叉耦合電晶體，並且接收輸入信號對。升壓電路耦接電壓準位移位電路。升壓電路對交叉耦合電晶體對的多個升壓輸入端執行預充電操作，並且根據控制脈波信號以基於電壓泵操作來產生電壓脈波，並提供電壓脈波至此些升壓輸入端。控制脈波信號對應輸入信號對的轉態緣來被產生。如此，電壓拉扯被降低。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A voltage level shifter is provided. The voltage level shifter includes a voltage level shift circuit and a boost circuit. The voltage level shift circuit operates between a first voltage and a second voltage. The voltage level shift circuit includes a pair of cross-coupled transistors and a pair of differential transistors. The pair of differential transistors are coupled to the pair of cross-coupled transistors, and receive a pair of input signals. The boost circuit is coupled to the voltage level shift circuit. The boost circuit performs a pre-charging operation on boost input nodes of the pair of cross-coupled transistors, generates a voltage pulse based on a charge pump operation according to a control pulse signal, and provides the voltage pulse to the boost input nodes. The control pulse signal is generated corresponding to a transient edge of the pair of input signals. As such, a fighting is decreased.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電壓值移位器</p>
        <p type="p">110:電壓準位移位電路</p>
        <p type="p">111:交叉耦合電晶體對</p>
        <p type="p">112:差動電晶體對</p>
        <p type="p">120:升壓電路</p>
        <p type="p">CS:控制脈波信號</p>
        <p type="p">IN:輸入信號對</p>
        <p type="p">N1:第一升壓輸入端</p>
        <p type="p">N2:第二升壓輸入端</p>
        <p type="p">PS:電壓脈波</p>
        <p type="p">VH:第一電壓</p>
        <p type="p">VSS:第二電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="303" publication-number="202616662">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616662</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138312</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電壓值移位器</chinese-title>
        <english-title>VOLTAGE LEVEL SHIFTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">H03K19/0185</main-classification>
        <further-classification edition="200601120250102B">H03K5/003</further-classification>
        <further-classification edition="200601120250102B">H02M3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宗仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUNG-ZEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電壓值移位器。電壓值移位器包括電壓準位移位電路以及升壓電路。電壓準位移位電路包括第一升壓輸入端、第二升壓輸入端、第一參考輸入端、以及第二參考輸入端。電壓準位移位電路操作在第一電壓以及第二電壓之間。升壓電路耦接至電壓準位移位電路。升壓電路對第一升壓輸入端以及第二升壓輸入端預充電至第三電壓值，並且根據提供至第一參考輸入端以及第二參考輸入端的差動信號對，將第三電壓值升壓至第四電壓值，據以降低電壓拉扯。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A voltage level shifter is provided. The voltage level shifter includes a voltage level shift circuit and a boost circuit. The voltage level shift circuit includes a first boost input node, a second boost input node, a first reference input node, and a second reference input node. The voltage level shift circuit operates between a first voltage and a second voltage. The boost circuit is coupled to the voltage level shift circuit. The boost circuit pre-charges the first boost input node and the second boost input node to a third voltage value, and boosts the third voltage value to a fourth voltage value according to a pair of differential signals provided to the first reference input node and the second reference input node, thereby fighting being decreased.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電壓值移位器</p>
        <p type="p">110:電壓準位移位電路</p>
        <p type="p">120:升壓電路</p>
        <p type="p">IN:差動信號對</p>
        <p type="p">N1:第一升壓輸入端</p>
        <p type="p">N2:第二升壓輸入端</p>
        <p type="p">N3:第一參考輸入端</p>
        <p type="p">N4:第二參考輸入端</p>
        <p type="p">VH:第一電壓</p>
        <p type="p">VSS:第二電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="304" publication-number="202616810">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616810</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138320</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>精密端子夾持裝置及高密度端子模組的返修設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250512B">H05K13/08</main-classification>
        <further-classification edition="200601120250512B">H01L21/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>創新服務股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳智孟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIH-MENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉盛豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種精密端子夾持裝置及高密度端子模組的返修設備，該精密端子夾持裝置係用以夾持一高密度端子模組上之多個柱狀端子中之一目標柱狀端子，該目標柱狀端子相對該高密度端子模組之一縱向具有一第一傾斜角及一第一方位角，該精密端子夾持裝置具有：一對可旋爪臂，具有一對夾持部，各該夾持部均具有一抵頂部及與該抵頂部連接之一內凹弧面；以及一電控驅動部，連結該對可旋爪臂且具有一雷射模組，用以依一電氣控制信號之控制執行一夾持操作及一復歸操作，該夾持操作包括：驅使該對可旋爪臂移動一距離並旋轉一第二傾斜角及一第二方位角以與該目標柱狀端子之軸向對齊，以驅使該對夾持部之所述抵頂部合以抵接所述目標柱狀端子之頂面，及使該對夾持部之所述內凹弧面合以夾持所述目標柱狀端子之側面之二相對區域；該復歸操作包括：驅使該雷射模組輸出雷射光以加熱該目標柱狀端子以解除其在該高密度端子模組上之固接狀態，及驅使該對可旋爪臂旋轉一修正傾斜角以使該目標柱狀端子之軸向與該縱向對齊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:精密端子夾持裝置</p>
        <p type="p">110:可旋爪臂</p>
        <p type="p">111:抵頂部</p>
        <p type="p">112:內凹弧面</p>
        <p type="p">120:電控驅動部</p>
        <p type="p">121:雷射模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="305" publication-number="202616446">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616446</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138321</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高密度端子的批次轉移方法及系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241115B">H01L21/677</main-classification>
        <further-classification edition="200601120241115B">H01L21/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>創新服務股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳智孟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIH-MENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉盛豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種高密度端子的批次轉移方法，係由一控制電路實現，其包括：驅使一環狀整列碼頭以一預定角度逐步轉動以週期性地提供一轉移期間，其中，該環狀整列碼頭具有分布在其周緣之多個整列區，各該整列區均具有一容料板，該容料板具有多排容料孔，且在該轉移期間中，該些整列區中位於一水平側者係充作一端子輸入區，而位於正下方者則充作一端子輸出區；執行一整列操作，其包括：驅使一供料裝置在該轉移期間移動至該端子輸入區以抵接該容料板，該供料裝置具有多條通道，各條所述通道均承載有一排柱狀金屬端子；及對該端子輸入區進行一負壓操作以將多個所述柱狀金屬端子對應吸入該些容料孔中；以及執行一植入操作，其包括：解除該端子輸出區之負壓狀態以向下釋放該些容料孔中之該些柱狀金屬端子至一對應基板之多個連接墊上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">步驟a:驅使一環狀整列碼頭以一預定角度逐步轉動以週期性地提供一轉移期間，其中，該環狀整列碼頭具有分布在其周緣之多個整列區，各該整列區均具有一容料板，該容料板具有多排容料孔，且在該轉移期間中，該些整列區中位於一水平側者係充作一端子輸入區，而位於正下方者則充作一端子輸出區</p>
        <p type="p">步驟b:執行一整列操作，其包括：驅使一供料裝置在該轉移期間移動至該端子輸入區以抵接該容料板，該供料裝置具有多條通道，各條所述通道均承載有一排柱狀金屬端子；及對該端子輸入區進行一負壓操作以將多個所述柱狀金屬端子對應吸入該些容料孔中</p>
        <p type="p">步驟c:執行一植入操作，其包括：解除該端子輸出區之負壓狀態以向下釋放該些容料孔中之該些柱狀金屬端子至一對應基板之多個連接墊上</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="306" publication-number="202615279">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615279</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138322</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>行車預警防撞方法</chinese-title>
        <english-title>DRIVING WARNING AND COLLISION AVOIDANCE METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120241230B">B60W30/08</main-classification>
        <further-classification edition="202001120241230B">B60W50/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺北科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾明桉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, MING-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翟崧雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAI, SUNG-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許嘉醇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIA-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝明鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, MING-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃上睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHANG-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳楷翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KAI-SIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張竣皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JUN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張芷瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, ZHI-XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種行車預警防撞方法，包含：利用一行車預警防撞系統，執行一行車預警防撞方法。該行車預警防撞方法包含一混合式眼動追蹤步驟以及一預警步驟。在該混合式眼動追蹤步驟中，基於人眼視線方向偵測法， 透過一紅外線感測器與可執行AI演算法的一相機協作以追蹤眼球。在該預警步驟中，將行車之駕駛的視野劃分且定義成三個判別區域，若該駕駛視線脫離該三個判別區域超過一預定閥值，則判定該駕駛生理狀態處於正常、放空、疲勞三種狀態，若判定為放空或疲勞的狀態則該行車預警防撞系統對該駕駛發出警示。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A driving warning and collision avoidance method is disclosed. The method includes a step of using a driving warning and collision avoidance system to execute a driving warning and collision avoidance method. The traffic warning and collision avoidance method includes a hybrid eye tracking step and an early warning step. In this hybrid eye tracking step, based on the human eye gaze direction detection method, an infrared sensor cooperates with a camera that can execute an AI algorithm to track the eyeballs. In this early warning step, the driver's vision is divided and defined into three discrimination areas. If the driver's vision deviates from the three discrimination areas by more than a predetermined threshold, it is determined that the driving physiological state is normal, relaxed, or fatigued. If the vehicle is determined to be in a state of idleness or fatigue, the driving warning and collision avoidance system will issue a warning to the driver.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:行車預警防撞系統</p>
        <p type="p">102:運算處理裝置</p>
        <p type="p">104:單晶片系統</p>
        <p type="p">106:圖形處理單元</p>
        <p type="p">108:低功率雙倍數據速率5記憶體裝置</p>
        <p type="p">110:嵌入式多媒體卡</p>
        <p type="p">112:加速器</p>
        <p type="p">114:感測器</p>
        <p type="p">116:串行收發器</p>
        <p type="p">118:影像擷取裝置</p>
        <p type="p">120:網路介面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="307" publication-number="202616273">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616273</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138323</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>駕駛人情緒識別系統及駕駛人情緒識別方法</chinese-title>
        <english-title>DRIVER EMOTION RECOGNITION SYSTEM AND DRIVER EMOTION RECOGNITION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120241125B">G10L25/63</main-classification>
        <further-classification edition="200601120241125B">A61B5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺北科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾明桉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, MING-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翟崧雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAI, SUNG-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許嘉醇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIA-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝明鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, MING-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃上睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHANG-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳楷翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KAI-SIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張竣皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JUN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張芷瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, ZHI-XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種駕駛人情緒識別系統及駕駛人情緒識別方法。駕駛人情緒識別系統包含一指向性麥克風以及一毫米波雷達。所述毫米波雷達電訊連接所述指向性麥克風。所述指向性麥克風與所述毫米波雷達均自一駕駛人取得複數個生理資訊，並傳輸至一運算處理裝置，以便所述運算處理裝置根據該些生理資訊產生對所述駕駛人的一警示訊息。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A driver emotion recognition system and a driver emotion recognition method are disclosed. The driver emotion recognition system includes a directional microphone and a millimeter-wave radar. The millimeter-wave radar is electrically connected to the directional microphone. Both the directional microphone and the millimeter-wave radar obtain a plurality of physiological information from a driver and transmit it to a computing device so that the computing device generates a warning message to the driver based on the physiological information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:駕駛人情緒識別系統</p>
        <p type="p">102:運算處理裝置</p>
        <p type="p">104:單晶片系統</p>
        <p type="p">106:圖形處理單元</p>
        <p type="p">108:低功率雙倍數據速率5記憶體裝置</p>
        <p type="p">110:嵌入式多媒體卡</p>
        <p type="p">112:加速器</p>
        <p type="p">114:感測器</p>
        <p type="p">116:音訊裝置</p>
        <p type="p">118:串行收發器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="308" publication-number="202616640">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616640</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138327</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機車發電負載調節系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">H02P27/00</main-classification>
        <further-classification edition="200601120241204B">G05F1/10</further-classification>
        <further-classification edition="201901120241204B">B60L50/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光陽工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳勝騰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳德豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種機車發電負載調節系統，包含一引擎轉速感測器、一油門感測器、一電瓶、一控制器與一穩壓控制裝置，該穩壓控制裝置包含一通訊埠、一電源輸入埠與一電源輸出埠分別電性連接該控制器、一發電機以及該電瓶；該穩壓控制裝置透過該通訊埠接收該控制器所傳送的一引擎轉速資訊與一油門開度資訊，並將該發電機所產生的一感應電源轉換為該電瓶的一充電電源，該充電電源對應一發電負載；當該穩壓控制裝置判斷該引擎轉速資訊落入一轉速區間，且該油門開度資訊的開啟速率大於或等於門檻加速速率時，該穩壓控制裝置調降該充電電源以調降該發電負載。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">21:引擎轉速感測器</p>
        <p type="p">22:油門感測器</p>
        <p type="p">23:電瓶</p>
        <p type="p">24:控制器</p>
        <p type="p">240:通訊埠</p>
        <p type="p">25:穩壓控制裝置</p>
        <p type="p">250:通訊埠</p>
        <p type="p">251:電源輸入埠</p>
        <p type="p">252:電源輸出埠</p>
        <p type="p">30:發電機</p>
        <p type="p">VAC:感應電源</p>
        <p type="p">VDC:充電電源</p>
        <p type="p">VCC:工作電壓</p>
        <p type="p">S1:引擎轉速資訊</p>
        <p type="p">S2:油門開度資訊</p>
        <p type="p">S3:電瓶電壓資訊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="309" publication-number="202616711">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616711</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138329</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用以將空間影片(Spatial　Video)檔案轉換為可裸視SBS立體影像格式之方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250418B">H04N13/302</main-classification>
        <further-classification edition="201801120250418B">H04N13/139</further-classification>
        <further-classification edition="201801120250418B">H04N13/106</further-classification>
        <further-classification edition="201701120250418B">G06T7/194</further-classification>
        <further-classification edition="202201120250418B">G06V10/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江和原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江和原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林湧群</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹銘煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓修齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用以將空間影片(Spatial Video)檔案轉換為可裸視SBS立體影像格式之方法，其中：空間影片檔案具有一第一影像及一第二影像，且該第一影像與該第二影像分別內嵌有與其影像相對應之X軸、Y軸及Z軸之位置資訊，透過一AI裝置依據該第一影像與該第二影像之位置資訊，將各影像中之前景與後景分開對焦，使該第一影像與該第二影像之圖像清晰後，再將其合成為可與一裸視立體成像膜片相互映對之SBS立體影像格式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="310" publication-number="202616413">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616413</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138331</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液體供應系統和單晶圓處理設備</chinese-title>
        <english-title>LIQUID SUPPLY SYSTEMS AND SINGLE WAFER PROCESS EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241127B">H01L21/67</main-classification>
        <further-classification edition="201001120241127B">B67D7/74</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弘塑科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRAND PROCESS TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃立佐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, LI-TSO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張修凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSIU-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種液體供應系統和單晶圓處理設備。液體供應系統包括單流體噴嘴和二流體噴嘴。該單流體噴嘴配置用於向晶圓提供高溫製程液體。該二流體噴嘴與該單流體噴嘴相鄰，配置用於向該晶圓提供由氣體和該高溫製程液體組成的混合流體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a liquid supply system and a single wafer processing equipment. The liquid supply system includes a single-fluid nozzle and a two-fluid nozzle. The single-fluid nozzle is configured to provide high temperature process fluid to a wafer. The two-fluid nozzle is adjacent to the single-fluid nozzle and configured to provide a mixed fluid composed of gas and the high temperature process liquid to the wafer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:晶圓</p>
        <p type="p">10:單晶圓處理設備</p>
        <p type="p">11:承載台</p>
        <p type="p">12:二流體噴嘴</p>
        <p type="p">13:單流體噴嘴</p>
        <p type="p">14:供液裝置</p>
        <p type="p">15:供氣裝置</p>
        <p type="p">16:移動裝置</p>
        <p type="p">161:旋轉升降柱</p>
        <p type="p">162:長臂</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="311" publication-number="202616611">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616611</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138333</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無端子電池組的無線電源傳輸系統</chinese-title>
        <english-title>TERMINAL-LESS BATTERY PACK BASED WIRELESS POWER DELIVERY SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120241104B">H02J50/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉向明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIOU, HSIANG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮　凱棣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, KAI DI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉向明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIOU, HSIANG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮　凱棣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, KAI DI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種以無線電源傳輸系統，包括無端子電池組、開合變壓器，無線負載器以及無線充電器。        &lt;br/&gt;無端子電池組是一種沒有金屬連接器 (或金屬端子)的電池組，用開合變壓器電磁耦合的形式來實施無線供電和無線充電功能。        &lt;br/&gt;開合變壓器是一種初級和次級分別放置於兩個不同器件上的變壓器，當它們處於「分開」狀態時沒有電磁耦合，只有當它們靠近，處於「合攏」狀態時才有電磁耦合。        &lt;br/&gt;每個初級和次級都有各自的磁芯和線圈繞組，被稱爲「磁芯線組」。本專利文件裏提到的「變壓器」除非特別注明，都是指開合變壓器，提到的「磁芯線組」都是指開合變壓器的磁芯線組。        &lt;br/&gt;本發明的開合變壓器還具有,但不限於下列性能：        &lt;br/&gt;以應用爲基礎的初級和次級的靈活性        &lt;br/&gt;不光有強耦合，也有弱耦合        &lt;br/&gt;工作頻率可調，以達到最高效率或最高功率或諧振        &lt;br/&gt;磁芯的串聯和並聯以增加功率        &lt;br/&gt;鐘形的屏蔽，有效地抑制電磁干擾        &lt;br/&gt;無端子電池組包括電池、雙向切換器及第一磁芯線組。當無端子電池組靠近具有第二磁芯線組的無線負載器時，雙向切換器作爲驅動器，第一磁芯線組和第二磁芯線組形成變壓器，電池透過驅動器和變壓器提供電能至無線負載器。當無端子電池組靠近具有第二磁芯線組的無線充電器時，雙向切換器作爲整流器，第一磁芯線組和第二磁芯線組形成變壓器，電池透過變壓器和整流器從無線充電器接收電能。根據前述，透過無線傳輸達成對電池的充電和電池對負載器的供電，都無需金屬連接器或連接端子。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a terminal-less battery pack based wireless power transfer system which includes a terminal-less battery pack, a switchable transformer, a wireless load and a wireless charger. The terminal-less battery pack is a battery pack without metal connectors (or metal terminals) which uses a switchable transformer to implement the electromagnetic coupling required by the functions of wireless power supply and wireless charging.        &lt;br/&gt;A switchable transformer is a transformer in which the primary and secondary are placed on different devices. No electromagnetic coupling occurs between them when they are in the "separated" state while the electromagnetic coupling occurs only when they are closed each other in the "closed" state.        &lt;br/&gt;Each primary or secondary has its own magnetic core and coil windings attached, called a "magnetic core winding set”.        &lt;br/&gt;Unless otherwise specified，the "transformer" mentioned in this patent document refers to the switchable transformer, and the "magnetic core winding set" mentioned in this patent document refers to the magnetic core winding set of the switchable transformer.        &lt;br/&gt;The switchable transformer of the present invention also has the following properties, but is not limited to:        &lt;br/&gt;Flexibility of primary and secondary based on application,        &lt;br/&gt;Not only strong coupling, but also weak coupling,        &lt;br/&gt;Adjustable operating frequency to achieve the highest efficiency or the highest power or resonance,        &lt;br/&gt;Series and parallel connection of magnetic cores to increase the power,        &lt;br/&gt;Bell-shaped shielding to effectively suppress electromagnetic interference.        &lt;br/&gt;The terminal-less battery pack includes a battery pack, a bidirectional converter and a first magnetic core winding set. When the terminal-less battery pack approaches the wireless load with a second magnetic core winding set, the bidirectional converter serves as a driver, the first magnetic core winding set and the second magnetic core winding set form a transformer, and the battery provide power for the wireless load by the driver and the transformer. When the terminal-less battery pack approaches the wireless charger with a second magnetic core winding set, the bidirectional converter serves as a rectifier, the first magnetic core winding set and the second magnetic core winding set form the transformer, and the battery receives the power from the wireless charger by the rectifier and the transformer. According to the descriptions mentioned above, battery charging and providing the battery's power to the loader are implemented by wireless transmission and do not need electrical connectors or electrical terminals.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:無線電源傳輸系統</p>
        <p type="p">1A:無端子電池組</p>
        <p type="p">10:電池</p>
        <p type="p">20:雙向切換器</p>
        <p type="p">1B:無線負載器</p>
        <p type="p">1C:無線充電器</p>
        <p type="p">30A:第一磁芯線組</p>
        <p type="p">30B:第二磁芯線組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="312" publication-number="202616004">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616004</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138339</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無人機與無人機之訓練及控制方法</chinese-title>
        <english-title>DRONE, DRONE TRAINING METHOD AND DRONE CONTROL METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250408B">G05B17/02</main-classification>
        <further-classification edition="200601120250408B">G06F17/17</further-classification>
        <further-classification edition="202401120250408B">G05D1/606</further-classification>
        <further-classification edition="202301120250408B">B64C39/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巫志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIH-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種無人機訓練方法包含依序輸入多個風速分量至對應之多個模糊函數，以分別產生多個風速歸屬值；依序自各風速分量對應之多個風速歸屬值之中選取一者，以獲得一筆風速歸屬值，並根據所有風速分量對應之一筆風速歸屬值，產生規則值；輸入多個風速分量至一推導函數，各規則值分別對應一筆推導函數以作為權重，並計算各風速分量對應之多個推導函數之函數總和；計算偏移分量與各風速分量對應之函數總和的誤差函數並最佳化誤差函數後，產生迴歸模型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Drone training method comprises: sequentially inputting a plurality of wind speed components into a corresponding plurality of fuzzy functions to respectively generate a plurality of wind speed membership values; sequentially selecting one from the plurality of wind speed membership values corresponding to each wind speed component to obtain a single wind speed membership value, and generating a rule value based on all of the single wind speed membership value corresponding to each wind speed components; inputting the plurality of wind speed components into an inference function, where each rule value corresponds to a single inference function as its weight, and calculating a sum value of the plurality of inference functions corresponding to each of the wind speed components; calculating an error function of an offset component and the sum value corresponding to each wind speed component and optimizing the error function to generate regression model.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:無人機</p>
        <p type="p">21:風速感測器</p>
        <p type="p">22:位置感測器</p>
        <p type="p">23:無線接收器</p>
        <p type="p">24:處理器</p>
        <p type="p">241:抗風控制器</p>
        <p type="p">242:飛行控制器</p>
        <p type="p">243:整合控制器</p>
        <p type="p">25:記憶單元</p>
        <p type="p">26:馬達</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="313" publication-number="202615338">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615338</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138340</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體元件及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR ELEMENT AND THE MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120241104B">C01B32/186</main-classification>
        <further-classification edition="200601120241104B">H05K3/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂維珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, WEI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石逸翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, YI-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃政誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體元件的製作方法，包含準備步驟、保護氣體通入步驟、反應氣體通入步驟及沉積步驟。準備步驟是準備半導體樣品於腔體的載台上，半導體樣品的線路圖案層之線寬小於100奈米。保護氣體通入步驟、反應氣體通入步驟及沉積步驟，將載台加熱並維持在攝氏250至480度之間，在保護氣氛中，透過啟動電漿使通入的苯蒸氣裂解，而在線路圖案層上形成石墨烯層，其中石墨烯層的厚度為0.3至4.5奈米。透過石墨烯只生成在金屬的表面的特性，以苯蒸氣做為碳源，能以低溫進行反應，改善了沉積於線路圖案層表面的石墨烯的性質，也大幅降低線路圖案層的電阻。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of a semiconductor element includes a preparation step, a protective gas introduction step, a reaction gas introduction step and a deposition step. The preparation step is to prepare a semiconductor sample and place it on the stage of the cavity. The line width of the circuit pattern layer of the semiconductor sample is less than 100 nanometers. In the protective gas introduction step, the reaction gas introduction step and the deposition step, the stage is heated and maintained between 250 and 480 degree Celsius, and then the plasma is started to crack the benzene vapor and form a graphene layer on the circuit pattern layer. The thickness of the graphene layer ranges from 0.3 to 4.5 nanometers. Based on the characteristic that graphene can only be generated on the surface of metal, benzene vapor is used as a carbon source, so that the reaction can be carried out at low temperature, and it greatly improves the performance of the graphene, and educe the resistance of the circuit pattern layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:半導體元件的製作方法</p>
        <p type="p">S10:準備步驟</p>
        <p type="p">S20:保護氣體通入步驟</p>
        <p type="p">S30:反應氣體通入步驟</p>
        <p type="p">S40:沉積步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="314" publication-number="202616600">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616600</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138343</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接收保護裝置</chinese-title>
        <english-title>RECEIVER PROTECTION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">H02H9/04</main-classification>
        <further-classification edition="200601120250102B">H02H7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉宗延</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TSUNG-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">接收保護裝置包含偏壓電路以及第一保護電路。偏壓電路用以接收輸入電壓，並根據輸入電壓以產生複數個偏壓。第一保護電路包含第一控制電晶體、第一二極體以及第一保護電晶體。第一控制電晶體用以接收電源供應電壓，根據複數個偏壓的第一偏壓以提供電源供應電壓或低位準電壓以作為第一控制電壓，並提供第一控制電壓至第一節點。第一二極體用以根據複數個偏壓的第二偏壓以提供第一輸出電壓至第一節點。第一保護電晶體用以接收輸入電壓，並根據第一節點之第一電壓以提供輸入電壓或低位準電壓以作為保護電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A receiver protection device includes a bias circuit and a first protection circuit. The bias circuit is configured to receive an input voltage and generate a plurality of bias voltages according to the input voltage. The first protection circuit includes a first control transistor, a first diode, and a first protection transistor. The first control transistor is configured to receive a power supply voltage, provide the power supply voltage or a low-level voltage to be a first control voltage according to a first bias voltage of the plurality of bias voltages, and provide the first control voltage to a first node. The first diode is configured to provide a first output voltage to the first node according to a second bias voltage of the plurality of bias voltages. The first protection transistor is configured to receive the input voltage and provide the input voltage or the low-level voltage to be a protection voltage according to a first voltage of the first node.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:接收保護裝置</p>
        <p type="p">110:偏壓電路</p>
        <p type="p">120:第一保護電路</p>
        <p type="p">130:第二保護電路</p>
        <p type="p">140:第三保護電路</p>
        <p type="p">D1~D3:二極體</p>
        <p type="p">N1~N3:節點</p>
        <p type="p">M11~M16:控制電晶體</p>
        <p type="p">M21~M23:保護電晶體</p>
        <p type="p">Msw:開關電晶體</p>
        <p type="p">Vb1~Vb6:偏壓</p>
        <p type="p">Vc1~Vc3:控制電壓</p>
        <p type="p">VDD:電源供應電壓</p>
        <p type="p">Vin:輸入電壓</p>
        <p type="p">Vo1~Vo3:輸出電壓</p>
        <p type="p">Vrx:保護電壓</p>
        <p type="p">Vsw:開關電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="315" publication-number="202616315">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616315</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138345</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>按鍵結構</chinese-title>
        <english-title>KEY STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241114B">H01H25/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹昌遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, CHANG-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳正宜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHENG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提出一種按鍵結構。本申請藉由在第二安裝板上設置支撐體，即使外力沒有作用在主要按壓區域，外力能使第一安裝板貼合支撐體的弧面轉動（傾斜），從而使第一安裝板上的連接部仍能與電路板的觸點接觸，進而能實現相應的功能。也即，在不增大外殼面積的基礎上，提升了按鍵結構的有效按壓面積。此外，按壓在非主要按壓區域導致的第一安裝板轉動的觸感，與直接按壓在按壓區域的觸感一致，提升了用戶的使用體驗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a key structure. By installing a support on a second mounting plate, even if an external force does not act on the main pressing area, the external force can make a first mounting plate rotate (tilt) along the arc surface of the support, so that a connecting part on the first mounting plate can still contact a contact point of a circuit board, thereby realizing the corresponding function. In other words, the effective pressing area of the key structure is increased without increasing the area of the shell. In addition, the tactile sensation of the first mounting plate rotating due to pressing on the non-main pressing area is consistent with that of directly pressing on the pressing area, improving the user experience.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:外殼</p>
        <p type="p">11:第一殼體</p>
        <p type="p">12:第二殼體</p>
        <p type="p">101:腔體</p>
        <p type="p">20:第一安裝板</p>
        <p type="p">30:第二安裝板</p>
        <p type="p">40:電路板</p>
        <p type="p">50:顯示幕</p>
        <p type="p">26:第一黏结層</p>
        <p type="p">51:第二黏结層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="316" publication-number="202615197">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615197</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138359</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>載台控制模組</chinese-title>
        <english-title>CARRIER CONTROL MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241219B">B23Q1/30</main-classification>
        <further-classification edition="200601120241219B">B23Q1/44</further-classification>
        <further-classification edition="200601120241219B">B23Q1/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>致伸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRIMAX ELECTRONICS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘永太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, YUNG-TAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHANG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹文彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, WEN-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種載台控制模組，其包括載台及致動機構。載台設置用以耦接移動載具，並且具有水平感知器。致動機構設置在載台下方，並且連接或耦接載台的第一區域及第二區域，其中水平感知器設置用以感知載台的傾斜角度，並且當載台的傾斜角度為非零或者達到非零的預設值時，致動機構作動，以調整載台的姿態，使載台的傾斜角度變小或為零。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A carrier control module includes a carrier and an actuating mechanism. The carrier is configured to couple to a mobile vehicle and has a level sensor. The actuating mechanism is disposed beneath the carrier and connected or coupled to a first region and a second region of ​​the carrier, in which the level sensor is configured to sense a tilt angle of the carrier, and when the tilt angle of the carrier is non-zero or reaches a non-zero preset value, the actuating mechanism is driven to adjust a posture of the carrier so that the tilt angle of the carrier becomes smaller or zero.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:載台</p>
        <p type="p">110s:水平感知器</p>
        <p type="p">1101:第一區域</p>
        <p type="p">1102:第二區域</p>
        <p type="p">111:第一部分</p>
        <p type="p">1111:第一樞接端</p>
        <p type="p">112:第二部分</p>
        <p type="p">1121:第二樞接端</p>
        <p type="p">1122:第三樞接端</p>
        <p type="p">113:連接部</p>
        <p type="p">120:致動機構</p>
        <p type="p">121:第一致動器</p>
        <p type="p">122:第二致動器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="317" publication-number="202615934">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615934</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138366</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>背光模組</chinese-title>
        <english-title>BACKLIGHT MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120241216B">G02B30/29</main-classification>
        <further-classification edition="200601120241216B">G02B3/06</further-classification>
        <further-classification edition="201801120241216B">H04N13/305</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳慶荃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIN-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張洁瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHI-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江睿安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, JUI-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳忠幟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUNG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇國棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, GUO-DUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭勝文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, SHENG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖仁偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, REN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董人郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG, JEN-LANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種背光模組，包括至少一個子背光單元，各子背光單元包括柱狀透鏡、光源載體、複數個光條、第一側壁以及第二側壁。柱狀透鏡具有入光面以及相對於入光面的出光長條凸曲面。光源載體具有半管凹曲面，其中半管凹曲面為柱狀透鏡的佩茲伐曲面。複數個光條分別沿半管凹曲面的長邊方向延伸並排設置於半管凹曲面上。第一側壁及第二側壁分別位於柱狀透鏡及光源載體所夾空間之相對二長邊側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A backlight module includes at least one sub-backlight unit. Each of the sub-backlight unit includes a columnar lens, a light source carrier, a plurality of lightbars, a first side wall and a second side. The columnar lens includes a light incident surface and a light emitting long-strip convex curved surface opposite to the light incident surface. The light source carrier includes a half-pipe concave curved surface, wherein the half-pipe concave curved surface is a Petzval curved surface of the columnar lens. The plurality of lightbars are extended along a longitudinal direction of the half-pipe concave curved surface and disposed side by side on the half-pipe concave curved surface. The first side wall and the second side wall are respectively located at two relative longitudinal sides of a space between the columnar lens and the light source carrier.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:子背光單元</p>
        <p type="p">101:柱狀透鏡</p>
        <p type="p">103:光源載體</p>
        <p type="p">1011:入光面</p>
        <p type="p">1012:出光長條凸曲面</p>
        <p type="p">1021:第一側壁</p>
        <p type="p">1022:第二側壁</p>
        <p type="p">1031:半管凹曲面</p>
        <p type="p">1032:光條</p>
        <p type="p">1033:底面</p>
        <p type="p">10131:第一側面</p>
        <p type="p">10132:第二側面</p>
        <p type="p">10331:第一連接面</p>
        <p type="p">10332:第二連接面</p>
        <p type="p">L1:光線</p>
        <p type="p">L2:準直光線</p>
        <p type="p">O:中心點</p>
        <p type="p">S:空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="318" publication-number="202616207">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616207</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138378</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>元宇宙智能教育系統</chinese-title>
        <english-title>METAVERSE INTELLIGENT EDUCATION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120241115B">G06Q50/20</main-classification>
        <further-classification edition="200601120241115B">G06F3/01</further-classification>
        <further-classification edition="200601120241115B">G09B5/06</further-classification>
        <further-classification edition="200601120241115B">G02B27/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃煜勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, YU-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃煜勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, YU-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁鐵生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉偉隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種元宇宙智能教育系統，包括至少一個智能載具及一具有連網功能之電腦，該電腦設有一使用者介面，供上述使用者透過該智能載具進入後，可綁定控制一作為該使用者之虛擬分身的一角色物件，而於該使用者介面內活動，且該使用者介面建置有一虛擬建築主體、一資料庫及一人工智能文字語音模組，其中該虛擬建築主體內建構有複數個學習場域，該資料庫內設置有複數個具有不同學習內容之學習模組，每一個學習模組係對應上述每一個學習場域，而該人工智能文字語音模組可接收該使用者以對話式的文字或聲音，來與該角色物件及該學習模組互動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A metaverse intelligent education system, comprising at least one intelligent vehicle        &lt;br/&gt;and a computer with network connection function, which is provided with a user interface through which the user can bind and control a character object that is a virtual avatar of the user and activities within the user interface, and the user interface is equipped with a virtual building body, a database and an artificial intelligence text and speech module, wherein multiple learning fields are constructed in the virtual building body, The database is equipped with a plurality of learning modules with different learning contents, each learning module corresponds to each of the above learning fields, and the AI text and speech module can receive the user's conversational text or voice to interact with the character object and the learning module.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">21:使用者介面</p>
        <p type="p">22:虛擬建築主體</p>
        <p type="p">221:學習場域</p>
        <p type="p">23:資料庫</p>
        <p type="p">231:學習模組</p>
        <p type="p">24:人工智能文字語音模組</p>
        <p type="p">25:人工智能分析模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="319" publication-number="202614981">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614981</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138381</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>動物假牙的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241014B">A61C13/08</main-classification>
        <further-classification edition="200601120241014B">A61C13/34</further-classification>
        <further-classification edition="201701120241014B">G06T7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>醫彼有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾知雋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種動物假牙的製造方法，在一動物處於麻醉狀態下進行，包含下列步驟：取得該動物的一牙齒掃描圖檔；利用該牙齒掃描圖檔建立一假牙設計圖檔；及依該假牙設計圖檔，以加工設備製得一假牙。據此，本發明可以在單一次的麻醉過程中，完成以假牙修復牙損傷的整體程序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:取圖步驟</p>
        <p type="p">S2:建模步驟</p>
        <p type="p">S3:製牙步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="320" publication-number="202616062">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616062</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138383</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>主機、基於物件的操作系統及方法</chinese-title>
        <english-title>HOST, OBJECT-BASED OPERATION SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120241104B">G06F3/0488</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋長華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, CHANG-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述了主機。主機包括儲存電路以及處理器。儲存電路被配置為儲存程式碼。處理器耦合到儲存電路，且被配置為存取程式碼以執行：獲得使用者的周圍的環境的環境影像；基於環境影像，識別環境中的一個或多個物件；執行手追蹤，以判定使用者的手的手軌跡；基於手軌跡，判定一個或多個物件的一個或多個指向期間；基於一個或多個指向期間，將一個或多個物件中的一個判定為目標物件；以及基於目標物件，執行基於物件的操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A host is described herein. The host includes a storage circuit and a processor. The storage circuit is configured to store a program code. The processor is coupled to the storage circuit and configured to access the program code to execute: obtaining an environment image of an environment around a user; identifying one or more objects in the environment based on the environment image; performing a hand tracking to determine a hand track of a hand of the user; determining one or more pointing periods of the one or more objects based on the hand track; determining one of the one or more objects as a target object based on the one or more pointing periods; and performing an object-based operation based on the target object.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:操作情境</p>
        <p type="p">AIQ:人工智慧查詢</p>
        <p type="p">CV:電腦視覺</p>
        <p type="p">H:手</p>
        <p type="p">O1、O2、O3、O4:物件</p>
        <p type="p">TR:手軌跡</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="321" publication-number="202614979">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614979</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138386</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>消融裝置及消融系統</chinese-title>
        <english-title>ABLATION DEVICE AND ABLATION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241101B">A61B18/24</main-classification>
        <further-classification edition="200601120241101B">A61B18/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李若屏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JO-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇忠信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, CHUNG-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種消融裝置及消融系統，其中消融裝置用以與一套管配合並穿刺一患部。消融裝置包含一穿刺針以及一角度調整組件。穿刺針可活動地穿設於套管中，且部分的穿刺針具有可撓性。角度調整組件包含一夾持件。夾持件設置於套管及穿刺針之間。夾持件具有一夾持狀態及一釋放狀態。當夾持件處於夾持狀態時，夾持件用以對穿刺針提供一固持力，而使穿刺針用以沿套管的一軸向方向穿刺患部，且夾持件用以調整穿刺針的穿刺角度。當夾持件處於釋放狀態時，夾持件釋放固持力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An ablation device and an ablation system, where the ablation device is configured to be cooperated with a tube and penetrate through an affected part. The ablation device includes a penetrating needle and an angle adjusting assembly. The penetrating needle is movably disposed through the tube, and a part of the penetrating needle is flexible. The angle adjusting assembly includes a clamping component disposed between the tube and the penetrating needle. The clamping component has a clamping state and a release state. When the clamping component is in the clamping state, it is configured to providing a clamping force to the penetrating needle, such that the penetrating needle is configured to penetrate through the affected part along axial direction of the tube, and the clamping component is configured to adjust the penetrating angle of the penetrating needle. When the clamping component is in the release state, the clamping force is released.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:消融裝置</p>
        <p type="p">30:管路</p>
        <p type="p">100:套管</p>
        <p type="p">200:穿刺針</p>
        <p type="p">210:組裝端部</p>
        <p type="p">220:穿刺端部</p>
        <p type="p">221:撓性段</p>
        <p type="p">222:剛性段</p>
        <p type="p">223:穿刺段</p>
        <p type="p">2300:穿刺斜面</p>
        <p type="p">250:角度調整組件</p>
        <p type="p">300,301:彈性囊</p>
        <p type="p">500:溫度感測器</p>
        <p type="p">A1,A2:軸向方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="322" publication-number="202615924">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615924</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138389</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>成像用光學鏡頭、取像裝置及電子裝置</chinese-title>
        <english-title>IMAGING OPTICAL LENS SYSTEM, IMAGE CAPTURING UNIT AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241216B">G02B11/30</main-classification>
        <further-classification edition="202101120241216B">G02B7/02</further-classification>
        <further-classification edition="200601120241216B">G02B3/00</further-classification>
        <further-classification edition="202101120241216B">G03B17/12</further-classification>
        <further-classification edition="202101120241216B">G03B17/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大立光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LARGAN PRECISION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林榆芮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯郁淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KE, YU-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡承諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHENG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種成像用光學鏡頭，包含五片透鏡。五片透鏡沿光路由物側至像側依序為第一透鏡、第二透鏡、第三透鏡、第四透鏡與第五透鏡。第一透鏡具有正屈折力。第一透鏡物側表面於近光軸處為凸面。第二透鏡物側表面於近光軸處為凸面。第二透鏡像側表面於近光軸處為凹面。第三透鏡具有負屈折力。第三透鏡物側表面於近光軸處為凹面。第四透鏡具有正屈折力。成像用光學鏡頭中至少一透鏡具有反曲點。當被攝物於無窮遠物距時，成像用光學鏡頭處於第一狀態。當滿足特定條件時，成像用光學鏡頭能同時滿足移動對焦功能、望遠功能、小型化和高成像品質的需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An imaging optical lens system includes five lens elements which are, in order from an object side to an image side along an optical path: a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof. The second lens element has an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof. The third lens element with negative refractive power has an object-side surface being concave in a paraxial region thereof. The fourth lens element has positive refractive power. At least one lens element in the imaging optical lens system has an inflection point. When an imaged object is at an infinite object distance, the imaging optical lens system is in a first state. When specific conditions are satisfied, the requirements of movable focus feature, telephoto feature, compactness and high image quality can be met by the imaging optical lens system, simultaneously.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:取像裝置</p>
        <p type="p">S1,S2,S3,S4:光闌</p>
        <p type="p">E1:第一透鏡</p>
        <p type="p">E2:第二透鏡</p>
        <p type="p">E3:第三透鏡</p>
        <p type="p">E4:第四透鏡</p>
        <p type="p">E5:第五透鏡</p>
        <p type="p">E6:反射元件</p>
        <p type="p">E7:濾光元件</p>
        <p type="p">IMG:成像面</p>
        <p type="p">IS:電子感光元件</p>
        <p type="p">G1:移動透鏡群</p>
        <p type="p">G2:最後透鏡群</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="323" publication-number="202615922">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615922</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138391</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>攝像光學系統組及取像裝置</chinese-title>
        <english-title>PHOTOGRAPHY OPTICAL SYSTEM AND IMAGE CAPTURING UNIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241216B">G02B9/04</main-classification>
        <further-classification edition="202101120241216B">G02B7/02</further-classification>
        <further-classification edition="200601120241216B">G02B3/00</further-classification>
        <further-classification edition="200601120241216B">G02B11/34</further-classification>
        <further-classification edition="202101120241216B">G03B9/02</further-classification>
        <further-classification edition="202101120241216B">G03B17/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大根光學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LARGAN INDUSTRIAL OPTICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃日忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JIH CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施語函</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, YU-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種攝像光學系統組依序包含第一透鏡組、光圈以及第二透鏡組。第一透鏡組的透鏡總片數為一片至三片，且包含最靠近物側的第一透鏡。第二透鏡組的透鏡總片數為五片至八片，且包含最靠近像側的最後透鏡。攝像光學系統組在第一透鏡與最後透鏡之間更包含第二透鏡、第三透鏡、第四透鏡以及第五透鏡。第一透鏡組具有正屈折力，且第二透鏡組具有負屈折力。第二透鏡物側表面於近光軸處為凸面。第三透鏡物側表面於近光軸處為凸面，且第三透鏡像側表面於近光軸處為凹面。當滿足特定條件時，攝像光學系統組能同時滿足望遠、小型化和高成像品質的需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A photography optical system sequentially includes a first lens assembly, an aperture stop, and a second lens assembly. The first lens assembly has a total number of lens elements being one to three and includes a first lens element closest to an object side. The second lens assembly has a total number of lens elements being five to eight and includes a last lens element closest to an image side. The photography optical system further includes a second lens element, a third lens element, a fourth lens element, and a fifth lens element between the first lens element and the last lens element. The first lens assembly has positive refractive power, and the second lens assembly has negative refractive power. The second lens element has an object-side surface being convex in a paraxial region thereof. The third lens element has an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof. When specific conditions are satisfied, the requirements of telephoto, compactness and high image quality can be met by the photography optical system, simultaneously.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:取像裝置</p>
        <p type="p">ST:光圈</p>
        <p type="p">S1:光闌</p>
        <p type="p">E1:第一透鏡</p>
        <p type="p">E2:第二透鏡</p>
        <p type="p">E3:第三透鏡</p>
        <p type="p">E4:第四透鏡</p>
        <p type="p">E5:第五透鏡</p>
        <p type="p">E6:第六透鏡</p>
        <p type="p">E7:第七透鏡</p>
        <p type="p">E8:第八透鏡</p>
        <p type="p">E10:濾光元件</p>
        <p type="p">IMG:成像面</p>
        <p type="p">IS:電子感光元件</p>
        <p type="p">A1:第一透鏡組</p>
        <p type="p">A2:第二透鏡組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="324" publication-number="202615796">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615796</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138392</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>燈板裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120241104B">F21V14/00</main-classification>
        <further-classification edition="200601120241104B">F21V23/04</further-classification>
        <further-classification edition="200601120241104B">G02B6/00</further-classification>
        <further-classification edition="201601320241104B">F21Y105/00</further-classification>
        <further-classification edition="201601320241104B">F21Y115/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>咸瑞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭英偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王文虎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種燈板裝置，其包含有第一簇發光單元、第二簇發光單元及燈板控制單元。燈板控制單元依序產生並輸出第一簇控制訊號及第二簇控制訊號至第一簇發光單元及第二簇發光單元，以控制第一簇發光單元於第一時間段發光，且控制第二簇發光單元於第二時間段發光。燈板裝置通過分時發光的方式，讓第一簇發光單元及第二簇發光單元在眼睛視覺暫留期間交替發光。如此一來，人眼視覺無論何時都可感受到第一簇發光單元及第二簇發光單元所發出的共同照明效果而不會減少光亮，且可降低第一簇發光單元及第二簇發光單元同時發光造成的散熱問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:燈板裝置</p>
        <p type="p">101:第一簇發光單元</p>
        <p type="p">102:第二簇發光單元</p>
        <p type="p">103:第三簇發光單元</p>
        <p type="p">11:燈板控制單元</p>
        <p type="p">14:電源單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="325" publication-number="202614915">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614915</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138393</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>淺根作物採收機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120241101B">A01D45/00</main-classification>
        <further-classification edition="200601120241101B">A01D67/00</further-classification>
        <further-classification edition="200601120241101B">A01D57/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立屏東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳韋誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作係一種淺根作物採收機，其包含連接曳引機之機體以及設置於機體之採掘機組及收集機組，採集機組包含連接曳引機之動力輸出軸的傳動機構及聯接傳動機構的犁板及輸送載帶，收集機組係位於輸送載帶後方並包含承載桶及能抬升及翻轉承載桶的抬升機構，本創作淺根作物採收機能藉由犁板配合輸送載帶及承載桶進行淺根作物之採收、運送及收集動作，不但能有效提高淺根作物採收作業之採收效率，且能透過承載桶集中儲放淺根作物，藉此無須動用多個農務人員在曳引機後方逐個撿拾淺根作物，能有效減少人力成本並能有效提高淺根作物的採收效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:機體</p>
        <p type="p">20:採掘機組</p>
        <p type="p">21:傳動機構</p>
        <p type="p">22:犁板</p>
        <p type="p">23:輸送載帶</p>
        <p type="p">24:導引板</p>
        <p type="p">30:收集機組</p>
        <p type="p">31:承載桶</p>
        <p type="p">311:承載空間</p>
        <p type="p">32:抬升機構</p>
        <p type="p">33:導引輪</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="326" publication-number="202616083">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616083</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138400</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>儲存裝置管理方法與資料儲存系統</chinese-title>
        <english-title>STORAGE DEVICE MANAGEMENT METHOD AND DATA STORAGE SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250102B">G06F12/0866</main-classification>
        <further-classification edition="201601120250102B">G06F12/08</further-classification>
        <further-classification edition="200601120250102B">G06F13/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳泓陞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HUNG-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種儲存裝置管理方法與資料儲存系統。所述方法包括：偵測存取事件；根據存取事件的類型，從多個候選管理策略中決定目標管理策略；若目標管理策略為第一管理策略，根據存取事件，對所述多個實體儲存裝置中的至少兩個實體儲存裝置執行平行存取操作；以及若目標管理策略為第二管理策略，根據存取事件，對所述多個實體儲存裝置中的單一實體儲存裝置執行單獨存取操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A storage device management method and a data storage system are disclosed. The method includes: detecting an access event; determining a target management strategy from a plurality of candidate management strategies according to a type of the access event; if the target management strategy is a first management strategy, performing a parallel access operation on at least two physical storage devices among the physical storage devices according to the access event; and if the target management strategy is a second management strategy, performing a single access operation on a single physical storage device among the physical storage devices according to the access event.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S401~S404:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="327" publication-number="202615801">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615801</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138402</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>層濾式負離子空氣淨化器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120241104B">F24F3/16</main-classification>
        <further-classification edition="202101120241104B">F24F8/10</further-classification>
        <further-classification edition="202101120241104B">F24F8/30</further-classification>
        <further-classification edition="200601120241104B">B01D15/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康德納米科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游象揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種層濾式負離子空氣淨化器，主要包含一機座和一淨化器主體；該淨化器主體的核心部件是由下而上依序佈置的雙濾芯模組(個別包含七層奈米級過濾材)以及內層流管，外層流管包圍內層流管而設。在淨化器主體上方設置氣流動力裝置，引動外部空氣進入該淨化器主體中。空氣通過雙濾芯模組以及內層流管、外層流管時，奈米過濾材料的特殊結構與負離子催化功能產生協同作用，使空氣分子在多重物理作用下除去各種污物、異味，並產生高濃度生態級負離子，增進空氣淨化效果。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:機座</p>
        <p type="p">20:淨化器主體</p>
        <p type="p">21:外殼</p>
        <p type="p">22:進風室</p>
        <p type="p">23:緩衝室</p>
        <p type="p">24:層流空間</p>
        <p type="p">26:中心出風口</p>
        <p type="p">27:環狀出風口</p>
        <p type="p">31:第一濾材組</p>
        <p type="p">41:第二濾材組</p>
        <p type="p">51:內層流管</p>
        <p type="p">52:外層流管</p>
        <p type="p">60:氣流動力裝置</p>
        <p type="p">71:電源開關</p>
        <p type="p">72:空氣感測器</p>
        <p type="p">73:變色燈組</p>
        <p type="p">A:箭頭</p>
        <p type="p">B:箭頭</p>
        <p type="p">C:箭頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="328" publication-number="202616642">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616642</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138406</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>太陽能板檢測供電系統</chinese-title>
        <english-title>SOLAR PANEL DETECTION POWER SUPPLY SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120241216B">H02S50/00</main-classification>
        <further-classification edition="202401120241216B">G05D1/46</further-classification>
        <further-classification edition="202401120241216B">G05D1/229</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>優電智能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OPTIMAL POWER CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐碩賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, SHUO-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳豫宛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種太陽能板檢測供電系統，包括複數個太陽能陣列、供電切換模組、以及一空中影像擷取裝置。複數個太陽能陣列沿一第一方向並排設置，每一太陽能陣列包括沿一第二方向並排設置的複數個太陽能板，以任意一太陽能板的表面為基準，第一方向大致正交於第二方向。供電切換模組連接至複數個太陽能陣列，沿第一方向依序點亮單個太陽能陣列，且根據點亮的太陽能陣列產生一點亮資訊以觸發一拍攝訊號。空中影像擷取裝置耦合至供電切換模組，且根據拍攝訊號觸發一飛行指令以沿第二方向移動，且依序近距離拍攝點亮的太陽能板的俯視影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a solar panel detection power supply system, comprising a plurality of solar arrays, a power supply switching module, and an aerial image capturing device. The solar arrays are arranged side by side along a first direction, and each of the solar arrays comprises a plurality of solar panels arranged side by side along a second direction. Based on a surface of any given solar panel, the first direction is approximately perpendicular to the second direction. The power supply switching module is connected to the solar arrays. The power supply switching module sequentially illuminates individual solar arrays along the first direction and generates illumination information based on the illuminated solar array to trigger a capture signal. The aerial image capturing device is coupled to the power supply switching module. The aerial image capturing device triggers a flight command to move along the second direction based on the capture signal, sequentially capturing close-up overhead images of the illuminated solar panels.        &lt;br/&gt;​      </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:太陽能板檢測供電系統</p>
        <p type="p">10:太陽能陣列</p>
        <p type="p">20:供電切換模組</p>
        <p type="p">30:空中影像擷取裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="329" publication-number="202616643">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616643</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138410</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於太陽能發電模組的檢測評估系統</chinese-title>
        <english-title>A DETECTION AND EVALUATION SYSTEM FOR PHOTOVOLTAIC MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120250102B">H02S50/10</main-classification>
        <further-classification edition="201901120250102B">G06F16/54</further-classification>
        <further-classification edition="202501120250102B">G06F16/34</further-classification>
        <further-classification edition="202501120250102B">G06F16/35</further-classification>
        <further-classification edition="201301120250102B">G06F3/048</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>優電智能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OPTIMAL POWER CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐碩賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, SHUO-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳豫宛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於太陽能發電模組的檢測評估系統，包括一感測裝置、一處理裝置及一顯示裝置，該感測裝置用以偵測該太陽能發電模組的複數太陽能板，以獲得各該太陽能板的一線路資訊組及一面板影像擷取資訊組，該處理裝置耦合至該感測裝置，並根據該線路資訊組及該面板掃描影像擷取資訊組，以評估各該太陽能板的面板瑕疵結果，且依據該面板瑕疵結果、該線路資訊組及該面板掃描影像資訊組生成複數可視化檢測分類介面，該顯示裝置耦合至該處理裝置用以顯示該等可視化檢測分類介面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a detection and evaluation system for photovoltaic modules comprising a sensing device, a processing device, and a display device. The sensing device is configured to detect multiple solar panels of the photovoltaic modules to obtain a circuit information set and a panel image capture information set for each of the solar panels. The processing device is coupled to the sensing device and configured to evaluates panel defect results for each of the solar panels based on the circuit information set and the panel scan image capture information set. The processing device generates multiple visual inspection classification interfaces based on the panel defect results, the circuit information set, and the panel scan image information set. The display device is coupled to the processing device to display these visual inspection classification interfaces.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:檢測評估系統</p>
        <p type="p">1:感測裝置</p>
        <p type="p">2:處理裝置</p>
        <p type="p">21:人工智能分類裝置</p>
        <p type="p">22:地圖定位工具</p>
        <p type="p">23:縮放功能模組</p>
        <p type="p">3:顯示裝置</p>
        <p type="p">4:可視化檢測分類介面</p>
        <p type="p">S:太陽能發電模組</p>
        <p type="p">S1:太陽能板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="330" publication-number="202616601">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616601</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138416</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靜電放電保護系統</chinese-title>
        <english-title>ELECTROSTATIC DISCHARGE PROTECTION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241012B">H02H9/04</main-classification>
        <further-classification edition="200601120241012B">G01R1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯穎光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAVETEK MICROELECTRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊彥庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, YAN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李庚諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, GENG-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">靜電放電保護系統包含天線、電子裝置、以及靜電放電保護電路。天線用以接收無線訊號。電子裝置耦接於天線，用以透過天線接收無線訊號。靜電放電保護電路，耦接於電子裝置，用以將靜電能量釋放。靜電放電保護電路包含前向靜電放電電路以及反向靜電放電電路。前向靜電放電電路包含至少一個由至少一個第一二極體及第一電容並聯所組成的第一靜電放電單元。反向靜電放電電路包含至少一個由至少一個第二二極體及第二電容並聯所組成的第二靜電放電單元。前向靜電放電電路及反向靜電放電電路耦接於接地端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrostatic discharge (ESD) protection system includes an antenna, an electronic device, and an ESD protection circuit. The antenna is used for receiving a wireless signal. The electronic device is coupled to the antenna for receiving the wireless signal through the antenna. The ESD protection circuit is coupled to the electronic device for discharging electrostatic power. The ESD protection circuit includes a forward ESD circuit and a reversed ESD circuit. The forward ESD circuit includes at least one first ESD unit including at least one first diode and a first capacitor coupled in series. The reversed ESD circuit includes at least one second ESD unit including at least one second diode and a second capacitor coupled in series. The forward ESD circuit and the reversed ESD circuit are coupled to a ground terminal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:靜電放電保護系統</p>
        <p type="p">10:天線</p>
        <p type="p">11:靜電放電保護電路</p>
        <p type="p">12:電子裝置</p>
        <p type="p">L1及L2:電流路徑</p>
        <p type="p">GND:接地端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="331" publication-number="202616912">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616912</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138423</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光電半導體元件</chinese-title>
        <english-title>OPTOELECTRONIC SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10F77/40</main-classification>
        <further-classification edition="202501120250102B">H10F77/12</further-classification>
        <further-classification edition="202501120250102B">H10F77/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富采光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENNOSTAR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡長達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHANG DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭韋智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, WEI-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇初日</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, CHU-JIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳韋龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐震</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OU, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光電半導體元件，包含基底、半導體疊層及反射結構。半導體疊層包含基底上方的第一半導體層、第一半導體層上方的第二半導體層及第一半導體層與該第二半導體層之間的吸光層。第一半導體層具有改質區及圍繞改質區的未改質區。反射結構位於第一半導體層與基底之間並接觸改質區。第二半導體層的厚度小於或等於50 nm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optoelectronic semiconductor device includes a base, a semiconductor stack and a reflective structure. The semiconductor stack includes a first semiconductor layer on the base, a second semiconductor layer on the first semiconductor layer, and a light absorbing layer between the first semiconductor layer and the second semiconductor layer. The first semiconductor layer has a modified region and an unmodified region surrounding the doping region. The reflective structure is between the first semiconductor layer and the base, and contacts the doping region. A thickness of the second semiconductor layer is not greater than 50 nm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:光電半導體元件</p>
        <p type="p">101:基底</p>
        <p type="p">110:半導體疊層</p>
        <p type="p">112:第一半導體層</p>
        <p type="p">112u:未改質區</p>
        <p type="p">114:吸光層</p>
        <p type="p">116:第二半導體層</p>
        <p type="p">118:改質區</p>
        <p type="p">120:第一接觸結構</p>
        <p type="p">130:第二接觸結構</p>
        <p type="p">132:第一側表面</p>
        <p type="p">134:第二側表面</p>
        <p type="p">140:鈍化層</p>
        <p type="p">150:反射結構</p>
        <p type="p">155:接合結構</p>
        <p type="p">160:第一電極結構</p>
        <p type="p">161:電極墊</p>
        <p type="p">162:延伸部</p>
        <p type="p">170:保護層</p>
        <p type="p">180:抗反射層</p>
        <p type="p">190:第二電極結構</p>
        <p type="p">D1:差值</p>
        <p type="p">T1:第一厚度</p>
        <p type="p">T2:第一厚度</p>
        <p type="p">H、H1、H2:開口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="332" publication-number="202616728">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616728</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138426</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置與其追焦影像產生方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND PANNING SHOT IMAGE GENERATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241104B">H04N23/67</main-classification>
        <further-classification edition="200601120241104B">G06T11/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐為廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, WEI-LIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳若凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JO-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露揭示一種電子裝置與其追焦影像產生方法。此方法包括下列步驟。利用影像擷取裝置擷取包括N張短曝光影像的影像序列。N為大於1的整數。從N張短曝光影像選擇出一目標影像。透過執行光流估計，獲取N張短曝光影像中的第i張短曝光影像與N張短曝光影像中的第(i+1)張短曝光影像之間的光流資料。根據第i張短曝光影像與第(i+1)張短曝光影像之間的光流資料，產生整合光流資料。根據整合光流資料確定一目標物件的物件位置。根據整合光流資料與目標物件的物件位置對目標影像執行運動模糊處理，以產生追焦影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device and a panning shot image generation method thereof are provided. The method includes the following steps. The image capturing device is configured to capture an image sequence including N short exposure images. N is an integer greater than 1. A target image is selected from the N short exposure images. By performing optical flow estimation, optical flow data between the i-th short exposure image among the N short-exposure images and the (i+1)-th short exposure image among the N short-exposure images are obtained. Integrated optical flow data is generated based on the optical flow data between the i-th short exposure image and the (i+1)-th short exposure image. An object position of a target object is determined based on the integrated optical flow data. Motion blur processing is performed on the target image according to the object position of the target object and the integrated optical flow data to generate a panning shot image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210~S260:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="333" publication-number="202616654">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616654</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138432</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聲波裝置及其製造方法</chinese-title>
        <english-title>ACOUSTIC WAVE DEVICE AND FABRICATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">H03H9/145</main-classification>
        <further-classification edition="200601120241104B">H03H3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立積電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHWAVE TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃浩閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HAO-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種聲波裝置包括壓電基板、複數個換能器、及覆膜。壓電基板包括凹部，複數個換能器設置於凹部中。複數個換能器其中至少一者包括：平行於第一方向設置的第一匯流條；平行於第二方向從第一匯流條延伸的複數個第一電極；平行於第一方向設置的第二匯流條；以及平行於第二方向從第二匯流條延伸的複數個第二電極。覆膜覆蓋於壓電基板的凹部上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An acoustic device includes a piezoelectric substrate, a plurality of transducers, and a cover film. The piezoelectric substrate includes a recess and the plurality of transducers are positioned in the recess. At least one of the plurality of transducers includes: a first bus bar disposed in parallel to a first direction; a plurality of first electrodes extending in parallel to a second direction from the first bus bar; a second bus bar disposed in parallel to the first direction; and a plurality of second electrodes extending in parallel to the second direction from the second bus bar. The cover film covers on the recess of the piezoelectric substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:聲波裝置</p>
        <p type="p">10:換能器組</p>
        <p type="p">101至10N:換能器</p>
        <p type="p">20:鈍化層</p>
        <p type="p">30:焊墊</p>
        <p type="p">40:晶種層</p>
        <p type="p">50:金屬層</p>
        <p type="p">60:焊球</p>
        <p type="p">70:壓電基板</p>
        <p type="p">71:基板表面</p>
        <p type="p">70S:凹部</p>
        <p type="p">70B:底部</p>
        <p type="p">701W、702W:側壁</p>
        <p type="p">80:覆膜、乾膜層</p>
        <p type="p">90:載板</p>
        <p type="p">95:保護膜</p>
        <p type="p">96:密封部</p>
        <p type="p">C1,C2:連接部</p>
        <p type="p">St:堆疊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="334" publication-number="202615845">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615845</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138444</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微流體檢測系統及細胞檢測方法</chinese-title>
        <english-title>MICROFLUIDIC DETECTING SYSTEM AND METHOD FOR DETECTING CELL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241125B">G01N21/63</main-classification>
        <further-classification edition="202401120241125B">G01N15/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立虎尾科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL FORMOSA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭如男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, JU-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊宗叡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, ZONG-RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉怡玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, YI-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種微流體檢測系統，包含二基板、一電源供應裝置、一雷射光源、一收集裝置以及一處理器。二基板彼此並列以定義一反應空間。電源供應裝置電性連接二基板，且電源供應裝置用以提供一電場至反應空間。雷射光源設置於二基板中的至少一者，且雷射光源用以提供一雷射光與一熱源至反應空間。收集裝置鄰設於雷射光源。處理器訊號連接收集裝置，且處理器係用以擷取至少一待測細胞反射雷射光的一感測結果。藉此，有利於模擬與分析細胞運動的狀態，並具有相關領域的應用潛力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a microfluidic detecting system. The microfluidic detecting system includes two base plates, a power supply unit, a laser light source, a collection unit and a processor. The two base plates are disposed side by side to each other and then define a reaction space. The power supply unit is electrically connected to the two base plates, and the power supply unit is used to provide an electric field to the reaction space. The laser light source is disposed on at least one of the two base plates, and the laser light source is used to provide a laser light and a heat source to the reaction space. The collection unit is disposed adjacent to the laser light source. The processor is signally connected to the collection unit, and the processor is used to capture a sensing result of at least one testing cell reflecting the laser light. Therefore, it is favorable for simulating and analyzing the state of cell motion and has the potential for application in related fields.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:微流體檢測系統</p>
        <p type="p">110:基板</p>
        <p type="p">111:反應空間</p>
        <p type="p">112:待測細胞</p>
        <p type="p">113:流體</p>
        <p type="p">114:基材</p>
        <p type="p">115:導電玻璃層</p>
        <p type="p">116:環形漩渦</p>
        <p type="p">120:電源供應裝置</p>
        <p type="p">130:雷射光源</p>
        <p type="p">140:收集裝置</p>
        <p type="p">150:處理器</p>
        <p type="p">A,B:厚度</p>
        <p type="p">D1,D2:長度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="335" publication-number="202614936">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614936</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138450</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種滾膠鞋墊的製造方法及其設備</chinese-title>
        <english-title>MANUFACTURING METHOD FOR ADHESIVE-COATED INSOLE AND EQUIPMENT FOR THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241031B">A43B17/08</main-classification>
        <further-classification edition="200601120241031B">A43B17/10</further-classification>
        <further-classification edition="200601120241031B">A43B17/18</further-classification>
        <further-classification edition="200601120241031B">A43B7/06</further-classification>
        <further-classification edition="202201120241031B">A43B7/1455</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大升國際興業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAH SHENG INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張訓誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSUN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏美芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, MEI-FEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張鴻基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HUNG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何崇民</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種滾膠鞋墊的製造方法，其包含以下步驟：將一纖維層片體以及一發泡層片體層疊貼合；將貼合之該纖維層片體以及該發泡層片體以一鞋墊輪廓裁斷，形成一鞋墊原型，該鞋墊原型包含貼合之一纖維層以及一發泡層；將該鞋墊原型至少部分之該發泡層塗布一止滑膠，其中該止滑膠的配方包含一水性不乾膠以及一防水膠；以及將該鞋墊原型烘乾，形成一滾膠鞋墊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method for adhesive-coated insole includes the following steps: laminating a fiber layer sheet and a foam layer sheet together; cutting the laminated fiber layer sheet and foam layer sheet into an insole profile to form an insole prototype, where the insole prototype consists of the laminated fiber layer and foam layer; applying an anti-slip adhesive to at least part of the foam layer of the insole prototype, where the formula of the anti-slip adhesive includes a water-based adhesive and a waterproof adhesive; and drying the insole prototype to form an adhesive-coated insole.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:纖維層</p>
        <p type="p">21:發泡層</p>
        <p type="p">31:鞋墊原型</p>
        <p type="p">G:止滑膠槽</p>
        <p type="p">R1:第一滾輪</p>
        <p type="p">R2:第二滾輪</p>
        <p type="p">R3:滾輪凸齒</p>
        <p type="p">S:硬質表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="336" publication-number="202615185">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615185</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138452</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雷射蝕刻薄片狀晶圓片形成太鼓結構的裝置及其方法</chinese-title>
        <english-title>DEVICE FOR LASER ETCHING THIN WAFERS TO FORM TAIKO STRUCTURE AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120241029B">B23K26/04</main-classification>
        <further-classification edition="201401120241029B">B23K26/362</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏貿科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝承靖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴國榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作是一種形成太鼓狀晶圓片的裝置及其方法，其中一晶圓片，置於該操作台上，沿該長柱型陣列雷射一端的飛秒雷射（femtosecond laser）聚焦該中心軸，延展至該長柱型陣列雷射另一端的飛秒雷射（femtosecond laser）聚焦到該槽半徑R        &lt;sub&gt;1&lt;/sub&gt;，以及至少一控制模組，控制旋轉該晶圓片或是旋轉該長柱型陣列雷射，逐圈旋轉狀態下，該長柱型陣列雷射融蝕該晶圓片，形成薄化後該晶圓片的中央部位是一槽底面，該槽底面形成水平的盤狀凹陷切面，其中環繞薄化後該晶圓片的中央部位的周圍未被融蝕，形成該晶圓片的邊框，該晶圓片的邊框以及該凹槽的槽底面，共同形成太鼓(taiko)結構的該晶圓片。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:晶圓片</p>
        <p type="p">2:操作台</p>
        <p type="p">3:長柱型陣列雷射</p>
        <p type="p">31:飛秒雷射</p>
        <p type="p">32:光點</p>
        <p type="p">4:控制模組</p>
        <p type="p">11:凹槽</p>
        <p type="p">12:邊框</p>
        <p type="p">13:槽底面</p>
        <p type="p">14:晶圓表面</p>
        <p type="p">D1:深度</p>
        <p type="p">W1:寬度</p>
        <p type="p">R&lt;sub&gt;0&lt;/sub&gt;:晶圓片半徑</p>
        <p type="p">R&lt;sub&gt;1&lt;/sub&gt;:槽半徑</p>
        <p type="p">C:中心軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="337" publication-number="202616239">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616239</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138462</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顱內縫合訓練教具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241118B">G09B9/00</main-classification>
        <further-classification edition="200601120241118B">G09B23/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇美醫療財團法人奇美醫院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI MEI MEDICAL CENTER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　思維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, SHER-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖仁傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, JEN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳姿尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TZU-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周偉倪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, WILLY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂冠祺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, KUAN-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴　世島</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NYAM, TEE-TAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭進榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, JINN-RUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁瑞侑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, JUI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種顱內縫合訓練教具，係包含有一頭顱模組、至少一感測模組、一處理模組及一警示單元，該頭顱模組具有一第一殼體容置至少一腦單元、一第二殼體蓋設於該第一殼體露出該等腦單元處及一腦膜單元；該等感測模組分別貼覆於該等腦單元周側表面且位於該等腦單元與該腦膜單元間，且該等感測模組係各具有一軟性感測單元及設置該軟性感測單元周側之一第一電極與一第二電極；該處理模組分別電性該等第一電極與該等第二電極；以及該警示單元電性連接該處理模組；其中，該腦膜單元設於該第二殼體與該等腦單元之間，且該處理模組偵測與計算每一該軟性感測單元於該第一電極與該第二電極間之一電阻值變化量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顱內縫合訓練教具</p>
        <p type="p">10:頭顱模組</p>
        <p type="p">11:第一殼體</p>
        <p type="p">111:第一開口</p>
        <p type="p">112:縫合孔</p>
        <p type="p">12:第二殼體</p>
        <p type="p">13:腦單元</p>
        <p type="p">14:腦膜單元</p>
        <p type="p">20:感測模組</p>
        <p type="p">21:第一電極</p>
        <p type="p">22:第二電極</p>
        <p type="p">23:軟性感測單元</p>
        <p type="p">30:處理模組</p>
        <p type="p">31:盒本體</p>
        <p type="p">40:跳動模組</p>
        <p type="p">41:驅動單元</p>
        <p type="p">42:曲軸單元</p>
        <p type="p">50:警示單元</p>
        <p type="p">R:電阻值變化量</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="338" publication-number="202616816">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616816</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138464</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>三維半導體裝置</chinese-title>
        <english-title>THREE-DIMENSIONAL SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241101B">H10B12/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏宏諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, HUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張維哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, WEI-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種三維半導體裝置，包括多個記憶胞層與多個絕緣層交替地位於基底上，以及多條位元線位於基底上且彼此相距。位元線與記憶胞層定義出一堆疊記憶胞陣列。記憶胞陣列包含多個記憶胞。各記憶胞包含基體、閘極結構和導電部。位於基底上方的基體具有相對的第一表面和第二表面，且基體的一側連接其中一條位元線。閘極結構和導電部分別位於基體之相對的第一表面和第二表面上。導電部位於相鄰的記憶胞層之間且直接接觸基體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A three-dimensional semiconductor device includes several memory cell layers and insulating layers alternately over a substrate, and several bit lines formed on the substrate and separated from each other. The bit lines and the memory cell layers define an array of stacked memory cells that includes several memory cells. One of the memory cells includes a body, a gate structure and a conductive portion. The body that is over the substrate has a first surface and a second surface opposite the first surface. One side of the body is connected to one of the bit lines. The gate structure and the conductive portion are formed on the opposite first and second surfaces. The conductive portion is formed between adjacent memory cell layers and in direct contact with the body.</p>
      </isu-abst>
      <representative-img>
        <p type="p">LM1,LM2:記憶胞層</p>
        <p type="p">CM1,CM2:記憶胞</p>
        <p type="p">BL:位元線</p>
        <p type="p">120:電晶體</p>
        <p type="p">130:基體</p>
        <p type="p">1301,1302:表面</p>
        <p type="p">132:汲極區</p>
        <p type="p">134:源極區</p>
        <p type="p">136:通道區</p>
        <p type="p">140:閘極結構</p>
        <p type="p">141:閘極介電層</p>
        <p type="p">142:閘極電極</p>
        <p type="p">CB:導電部</p>
        <p type="p">160:電子部件</p>
        <p type="p">W1,W2:寬度</p>
        <p type="p">DW,DM:間距</p>
        <p type="p">D1,D2,D3:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="339" publication-number="202615301">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615301</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138468</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>飛行交通工具及使用該飛行交通工具獲取太陽能光電陣列之電致發光影像的方法</chinese-title>
        <english-title>FLYING VEHICLE AND METHOD FOR OBTAINING ELECTROLUMINESCENT IMAGE OF SOLAR PHOTOVOLTAIC ARRAY USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250203B">B64U10/00</main-classification>
        <further-classification edition="201001120250203B">G01S19/14</further-classification>
        <further-classification edition="202401120250203B">G05D1/00</further-classification>
        <further-classification edition="202301320250203B">B64U101/30</further-classification>
        <further-classification edition="202301320250203B">B64U101/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>優電智能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OPTIMAL POWER CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐碩賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, SHUO-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳豫宛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請揭示一種在降低營運成本的同時能獲得清晰且精準的電致發光影像的飛行交通工具及其使用方法。該飛行交通工具包括：一飛行單元；一GPS定位單元，用以接收至少一GPS定位資訊；一紅外線接收器，用以接收至少一紅外線訊號；一影像獲取單元，用以獲取至少一電致發光影像；及一控制單元，與該飛行單元、該GPS定位單元、該紅外線接收器及該影像獲取單元電連接，且其依據該GPS定位資訊及該紅外線訊號以控制該飛行交通工具的飛行高度、飛行速度及飛行路徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The application relates to a flying vehicle and the use thereof, for obtaining clear and accurate electroluminescent images while significantly reducing operating costs. The flying vehicle comprises: a flight unit; a GPS positioning unit for receiving at least one GPS positioning information; an infrared receiver for receiving at least one infrared signal; an image acquisition unit for acquiring at least one electroluminescent image; and a control unit electrically coupled to the flight unit, the GPS positioning unit, the infrared receiver, and the image acquisition unit, which controls the flying height and the flying speed of the flying vehicle according to the GPS positioning information and the infrared signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:飛行交通工具</p>
        <p type="p">10:飛行單元</p>
        <p type="p">20:GPS定位單元</p>
        <p type="p">30:紅外線接收器</p>
        <p type="p">40:影像獲取單元</p>
        <p type="p">50:控制單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="340" publication-number="202616021">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616021</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138470</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動化開關異常跳脫監測系統及其方法</chinese-title>
        <english-title>AUTOMATED SWITCH ABNORMAL TRIPPING MONITORING SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">G05B23/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國家原子能科技研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL ATOMIC RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾興嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TZENG, SING-JIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林坤成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自動化開關異常跳脫監測系統，其包括資料接收模組及處理模組。資料接收模組接收資料採集與監控系統的紀錄資料。處理模組在該些紀錄資料的複數個系統紀錄中選擇一個並根據選定的系統紀錄執行自動化判斷程序。其中，處理模組在自動化判斷程序中判斷選定的系統紀錄中產生跳脫訊號的自動化開關的運作狀態為現場控制狀態或遠端控制狀態，並在判斷此自動化開關在遠端控制狀態且未接收到切開指令時為此自動化開關執行電壓輔助判斷步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An automated switch abnormal tripping monitoring system is provided, which includes a data receiving module and a processing module. The data receiving module receives the record data of a supervisory control and data acquisition system. The reader module selects one of the system records of the record data to execute an automated determining process. In the automated determining process, the processing module determines that the automated switch generating a tripping signal in the selected system record is in on-site control state or remote-control state. The processing module executes a voltage-assistance determining step when determining that the automated switch is in remote-control state without receiving a turn-off instruction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:自動化開關異常跳脫監測系統</p>
        <p type="p">11:資料接收模組</p>
        <p type="p">12:處理模組</p>
        <p type="p">RD:紀錄資料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="341" publication-number="202615281">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615281</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138472</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>行車電腦的倒車指令的驗證方法及其系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120241115B">B60W40/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣松下電器股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUSHITA ELECTRIC (TAIWAN) CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳弘清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張鈞維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種行車電腦的倒車指令的驗證方法，藉由包括一電腦裝置、一可程式化控制電源供應器、一信號轉換器、及一影像擷取裝置的一驗證系統來實施，並包含：該電腦裝置產生一電源控制信號以控制該可程式化控制電源供應器輸出一運作電源至一行車電腦，且產生一倒車控制信號以經由該信號轉換器輸出一倒車指令至該行車電腦；該影像擷取裝置對該行車電腦的一顯示器擷取一動態影像，並將該動態影像傳送至該電腦裝置；及當該電腦裝置在輸出該電源控制信號及該倒車控制信號之後的一預設時間之內，根據該動態影像辨識出一倒車畫面時，判斷驗證結果為正常。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S5:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="342" publication-number="202616281">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616281</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138473</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁性記憶體及其操作方法</chinese-title>
        <english-title>MAGNETIC MEMORY AND OPERATION METHOD OF THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250204B">G11C11/02</main-classification>
        <further-classification edition="202301120250204B">H10B61/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅　哈曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAKH, ZIAUR RAHAMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YAO-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏拯華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, JENG-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種磁性記憶體及其操作方法，其中磁性記憶體包括一重金屬（heavy metal）層以及形成在重金屬層上的至少一磁性穿隧接面（MTJ）。MTJ包括自由層、固定層、穿隧阻障層、第一擴散阻障層與第二擴散阻障層。自由層位於重金屬層上，固定層位於自由層上，且穿隧阻障層位於自由層與固定層之間。第一擴散阻障層則位於穿隧阻障層與自由層之間，第二擴散阻障層位於穿隧阻障層與固定層之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A magnetic memory and operation method of the same are provided in which the magnetic memory includes a heavy metal layer and at least one magnetic tunnel junction (MTJ) formed on the heavy metal layer. The MTJ includes a free layer, a pinned layer, a tunneling barrier layer, a first diffusion barrier layer and a second diffusion barrier layer. The free layer is located on the heavy metal layer, the pinned layer is located on the free layer, and the tunneling barrier layer is located between the free layer and the pinned layer. The first diffusion barrier layer is located between the tunnel barrier layer and the free layer, and the second diffusion barrier layer is located between the tunnel barrier layer and the pinned layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:磁性記憶體</p>
        <p type="p">102:自由層</p>
        <p type="p">104:固定層</p>
        <p type="p">106:穿隧阻障層</p>
        <p type="p">108:第一擴散阻障層</p>
        <p type="p">110:第二擴散阻障層</p>
        <p type="p">112:上電極</p>
        <p type="p">HM:重金屬層</p>
        <p type="p">MTJ:磁性穿隧接面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="343" publication-number="202616923">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616923</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138474</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10H29/10</main-classification>
        <further-classification edition="202501120250102B">H10H20/85</further-classification>
        <further-classification edition="202501120250102B">H10H20/855</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林聖凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHENG-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃子芩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TZU-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置包括驅動線路基板、第一堤岸層、多個發光元件、對向基板、第二堤岸層及封裝層。第一堤岸層設置於驅動線路基板上且具有多個開口。多個發光元件設置於第一堤岸層的多個開口中。對向基板設置於驅動線路基板的對向。第二堤岸層設置於對向基板上。第二堤岸層包括多個堤岸區塊。多個堤岸區塊彼此分離且具有多個間隙。多個發光元件的至少一者重疊於多個間隙的至少一者。封裝層設置於多個堤岸區塊上以及多個堤岸區塊之間的多個間隙。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display apparatus includes a driving circuit substrate, a first bank layer, light-emitting elements, an opposite substrate, a second bank layer and an encapsulation layer. The first bank layer is disposed on the driving circuit substrate and has openings. The light-emitting elements are disposed in the openings of the first bank layer. The opposite substrate is disposed opposite to the driving circuit substrate. The second bank layer is disposed on the opposite substrate. The second bank layer includes bank blocks. The bank blocks are separated from each other and have gaps. At least one of the light-emitting elements overlaps at least one of the gaps. The encapsulation layer is disposed on the bank blocks and in the gaps between the bank blocks.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:顯示裝置</p>
        <p type="p">110:驅動線路基板</p>
        <p type="p">120:第一堤岸層</p>
        <p type="p">214a:開口</p>
        <p type="p">130:發光元件</p>
        <p type="p">130R:第一發光元件</p>
        <p type="p">140:光學結構</p>
        <p type="p">140R:第一光學結構</p>
        <p type="p">210:對向基板</p>
        <p type="p">212:透明基底</p>
        <p type="p">214:遮光圖案層</p>
        <p type="p">216:彩色濾光圖案</p>
        <p type="p">216R:第一彩色濾光圖案</p>
        <p type="p">220:第二堤岸層</p>
        <p type="p">222:堤岸區塊</p>
        <p type="p">222b:底面</p>
        <p type="p">222s:側壁</p>
        <p type="p">222s1:第一側壁</p>
        <p type="p">230:封裝層</p>
        <p type="p">230a:表面</p>
        <p type="p">A-A’:線段</p>
        <p type="p">g:間隙</p>
        <p type="p">L:光束</p>
        <p type="p">T:厚度</p>
        <p type="p">W:寬度</p>
        <p type="p">θ1:第一角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="344" publication-number="202616585">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616585</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138479</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器（十九）</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241126B">H01R13/648</main-classification>
        <further-classification edition="201101120241126B">H01R24/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維將科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>V-GENERAL TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉博文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, PO-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉子維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, TZU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉語侖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, YU-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李建燁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIEN-YEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇彥文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為涉及一種電連接器，包括一屏蔽殼體、一插置口、一絕緣膠體組、及一傳輸導體組，所述傳輸導體組包括一第一傳輸導體群銲接部、二第一高頻差分傳輸導體對銲接部、至少一第一接地傳輸導體銲接部、一第二傳輸導體群銲接部、及二第二高頻差分傳輸導體對銲接部，當一對手電連接器從插置口置入屏蔽殼體內並與絕緣膠體組上的傳輸導體組導通時，第一接地傳輸導體銲接部可隔離第一高頻差分傳輸導體對銲接部產生之雜訊，達到解決高頻串音干擾問題，以穩定高頻傳輸速度之優勢。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:屏蔽殼體</p>
        <p type="p">11:插置口</p>
        <p type="p">2:絕緣膠體組</p>
        <p type="p">311:第一高頻差分傳輸導體對銲接部</p>
        <p type="p">312:第一接地傳輸導體銲接部</p>
        <p type="p">313:第一外側接地傳輸導體銲接部</p>
        <p type="p">314:第一內側電源傳輸導體銲接部</p>
        <p type="p">315:第一低頻傳輸導體對銲接部</p>
        <p type="p">321:第二高頻差分傳輸導體對銲接部</p>
        <p type="p">322:第二接地傳輸導體銲接部</p>
        <p type="p">323:第二外側接地傳輸導體銲接部</p>
        <p type="p">324:第二內側電源傳輸導體銲接部</p>
        <p type="p">325:第二低頻傳輸導體對銲接部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="345" publication-number="202616181">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616181</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138480</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>線上活動平台及線上活動進入方法</chinese-title>
        <english-title>ONLINE ACTIVITY PLATFORM AND ONLINE ACTIVITY ENTER METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250203B">G06Q30/02</main-classification>
        <further-classification edition="201901120250203B">G06F16/955</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辰鈦有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN TAI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林恭正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUNG CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余明祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, MING HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種線上活動平台及線上活動進入方法，其中線上活動平台包括雲端、商店端及消費端，其中商店端包括快速回應圖碼及使用者介面、消費端耦接雲端並包括第一電子裝置。線上活動平台執行線上活動進入方法以包括：通過消費端的第一電子裝置掃描商店端的快速回應圖碼以顯示來自雲端的線上活動進入頁面及獲取來自雲端的第一通關碼；輸入第一通關碼至商店端的使用者介面以查找第二通關碼；以及輸入第二通關碼至消費端的第一電子裝置中的線上活動進入頁面以進入線上活動；其中每一第一通關碼對應一第二通關碼。如此，易於消費者參加商家的活動抽獎。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An online activity platform and an online activity enter method are provided. The online activity platform includes a cloud, a store terminal and a consumer terminal. The store terminal includes a quick response image code and a user interface, and the consumer terminal is coupled to the cloud and includes a first electronic device. The online activity platform executes the online activity enter method to include: scanning the store's quick response image code through the first electronic device of the consumer terminal to display an online activity enter page from the cloud and obtain a first pass code from the cloud; inputting the first pass code to the user interface of the store terminal to find out a second pass code; and inputting the second pass code to the online activity enter page in the first electronic device of the consumer terminal to enter an online activity; wherein each first pass code corresponds to a second pass code. In this way, it is easy for consumers to participate in the store's lottery activities.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1,S3,S5:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="346" publication-number="202616227">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616227</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138496</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>布料瑕疵檢驗方法、可讀取記錄媒體及電子設備</chinese-title>
        <english-title>FABRIC DEFECT INSPECTION METHOD, READABLE RECORDING MEDIUM AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250512B">G06V10/98</main-classification>
        <further-classification edition="202201120250512B">G06V10/764</further-classification>
        <further-classification edition="202201120250512B">G06V10/72</further-classification>
        <further-classification edition="200601120250512B">G06F9/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岳揚智控股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AI MACHINE VISION CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪忠岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHUNG-YUEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇士傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種布料瑕疵檢驗方法，包含，一生成瑕疵圖像步驟，提取一布料圖像和提取一瑕疵特徵予以合成輸出一瑕疵生成布料圖像；一自動標記步驟，依據瑕疵特徵對瑕疵生成布料圖像自動標記；一建立模型步驟，將已自動標記的瑕疵生成布料圖像用於訓練一瑕疵檢驗模型；一模型測試步驟，瑕疵檢驗模型依據瑕疵特徵對瑕疵生成布料圖像進行測試，當分類測試失敗，將被標記的瑕疵特徵予以分類至所屬的一分類集合，當偵測測試失敗，人工找出瑕疵特徵予以標記。藉此，有效加快檢驗速度和降低檢驗錯誤用以提升檢驗效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fabric defect inspection method comprising: a step of generating a defect image, extracting a fabric image and extracting a defect feature to synthesize and output a defect-generated fabric image; a step of automatic marking, automatically marking the defect-generated fabric image based on the defect feature; a step of establishing a model, using the automatically marked defect-generated fabric image to train a defect inspection model; a step of model testing, the defect inspection model testing the defect-generated fabric image based on the defect feature, when a classification test failing, classifying the marked defect feature to a classification set to which the marked defect feature belonging, when a detection test failing, manually identifying and marking the defect feature. Thereby, an inspection speed is effectively accelerated and inspection errors are reduced to improve an inspection effect.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:布料圖像建立步驟</p>
        <p type="p">S2:瑕疵特徵建立步驟</p>
        <p type="p">S3:人工標記步驟</p>
        <p type="p">S4:瑕疵分類步驟</p>
        <p type="p">S5:生成瑕疵圖像步驟</p>
        <p type="p">S6:自動標記步驟</p>
        <p type="p">S7:建立模型步驟</p>
        <p type="p">S8:模型測試步驟</p>
        <p type="p">S9:發布執行步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="347" publication-number="202614928">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614928</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138501</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>珍珠奶茶風味大福結構及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">A23G3/00</main-classification>
        <further-classification edition="200601120250501B">A23G3/34</further-classification>
        <further-classification edition="201601120250501B">A23L7/10</further-classification>
        <further-classification edition="201601120250501B">A23L7/122</further-classification>
        <further-classification edition="201701120250501B">A21D13/19</further-classification>
        <further-classification edition="201601120250501B">A23P20/25</further-classification>
        <further-classification edition="201601120250501B">A23P10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三叔公食品股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳美姚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳行一</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種珍珠奶茶風味大福結構及其製造方法，該大福係包含由中心向外依序為珍珠餡料之第一內層、奶茶風味餡料之第二內層，以及包覆於該第二內層，概呈軟綿密狀之表層。其中，該表層係以50%之量存在，其係為麥芽糖、砂糖、乙醯化磷酸二澱粉等原料經由攪拌、蒸煉等所成型之麻糬皮；該第一內層係以16.7%之量存在，其係為砂糖、羥丙基磷酸二澱粉、黑糖等原料經由攪拌、蒸煉等所成型之珍珠餡料；該第二內層係以33.3%之量存在，其係為白鳳豆、砂糖、大豆油等原料經由攪拌、蒸煉等所成型之奶茶風味餡料；該第二內層係與該第一內層經由充填成型，包覆於該表層，從而構成珍珠奶茶風味大福。使珍珠奶茶風味大福於食用時得以同時呈現麻糬及珍珠奶茶之新奇口感，進而提高珍珠奶茶風味大福之產品價值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:珍珠奶茶風味大福</p>
        <p type="p">21:第一內層</p>
        <p type="p">22:第二內層</p>
        <p type="p">23:表層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="348" publication-number="202616036">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616036</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138502</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>頭戴式結構</chinese-title>
        <english-title>HEAD-MOUNTED STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241218B">G06F1/16</main-classification>
        <further-classification edition="200601120241218B">G02B27/01</further-classification>
        <further-classification edition="200601120241218B">H04R1/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和碩聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEGATRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱正弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, JENG-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石文龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, WEN-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHUN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡旻諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MIN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種頭戴式結構，包括頂部支架、頂部頭靠及二個側向支架。頂部支架包括支架本體與滑設於支架本體內的按鈕。按鈕凸出於支架本體，頂部頭靠滑接於支架本體，且設有至少一卡勾。二個側向支架分別樞接於支架本體的相對兩端，且分別滑接於頂部頭靠的相對兩端。頂部頭靠的卡勾穿過支架本體以卡合於按鈕，從而固定住該二個側向支架，並使二個側向支架之間具有第一距離。當按鈕被按壓以解除卡勾與按鈕之間的卡合關係時，頂部支架適以移動遠離頂部頭靠，並帶動二個側向支架相旋轉，使二個側向支架之間的距離從第一距離擴大至第二距離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A head-mounted structure including a top bracket, a top headrest, and two lateral brackets is provided. The top bracket includes a bracket body and a button slidably disposed in the bracket body. The button protrudes from the bracket body, the top headrest is slidably connected to the bracket body and the top headrest is provided with at least one hook. The two lateral brackets are respectively pivotally connected to two opposite ends of the bracket body and are respectively slidably connected to two opposite ends of the top headrest. The hook of the top headrest penetrates through the bracket body to engage with the button, thereby fixing the two lateral brackets and establishing a first distance between the two lateral brackets. When the button is pressed to disengage the hook from the button, the top bracket is adapted to move away from the top headrest and drive the two lateral brackets to rotate, which increases the distance between the two lateral brackets from the first distance to a second distance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:頭戴式結構</p>
        <p type="p">110:頂部頭靠</p>
        <p type="p">111:卡勾</p>
        <p type="p">112:定位柱</p>
        <p type="p">112a:柱體</p>
        <p type="p">112b:定位凸環</p>
        <p type="p">113:滑動銷</p>
        <p type="p">114、134:靠墊</p>
        <p type="p">120:頂部支架</p>
        <p type="p">121:支架本體</p>
        <p type="p">121a:底部</p>
        <p type="p">121c:定位孔</p>
        <p type="p">121d:止擋面</p>
        <p type="p">122:按鈕</p>
        <p type="p">130:側向支架</p>
        <p type="p">131:滑接端部</p>
        <p type="p">131a:滑槽</p>
        <p type="p">132:樞接端部</p>
        <p type="p">133:定位端部</p>
        <p type="p">D1:內徑</p>
        <p type="p">D2、D3:外徑</p>
        <p type="p">S1:第一距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="349" publication-number="202616047">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616047</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138505</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>裝置控制方法與電子裝置</chinese-title>
        <english-title>DEVICE CONTROL METHOD AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">G06F1/28</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張方瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, FANG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡志勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHIH-YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種裝置控制方法與電子裝置。所述方法包括：透過電子裝置的連接介面電路偵測觸發事件，其中所述觸發事件反映顯示裝置透過連接介面電路連接至電子裝置並對電子裝置供電；響應於所述觸發事件，透過連接介面電路偵測電子裝置與顯示裝置之間的異常連線行為；響應於異常連線行為，調整電子裝置的電源設定；以及透過調整所述電源設定，恢復顯示裝置的畫面顯示功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device control method and an electronic device are disclosed. The method includes: detecting a trigger event through a connection interface circuit of the electronic device, wherein the trigger event reflects that a display device is connected to the electronic device through the connection interface circuit and the display device supplies power to the electronic device; in response to the trigger event, detecting an abnormal connection behavior between the electronic device and the display device through the connection interface circuit; in response to the abnormal connection behavior, adjusting a power setting of the electronic device; and restoring a screen display function of the display device by adjusting the power settings.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S301~S304:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="350" publication-number="202616276">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616276</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138506</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>時脈訊號閘控電路</chinese-title>
        <english-title>CLOCK GATING CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">G11C7/12</main-classification>
        <further-classification edition="200601120250102B">G11C11/4076</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林哲民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHE-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種時脈訊號閘控電路，包括：時脈訊號輸入緩衝器、第一邏輯電路、第二邏輯電路以及閂鎖電路。時脈訊號輸入緩衝器接收時脈訊號，並基於時脈開關訊號，輸出內部時脈訊號。第一邏輯電路接收非同步時脈致能訊號與同步時脈致能訊號，並輸出時脈開關訊號。第二邏輯電路接收非同步時脈致能訊號、同步時脈致能訊號以及內部時脈訊號，並輸出時脈閘控訊號。閂鎖電路接收非同步時脈致能訊號以及時脈閘控訊號，以輸出同步時脈致能訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A clock gating circuit is provided. The clock gating circuit includes a clock signal input buffer, a first logic circuit, a second logic circuit and a latch circuit. The clock signal input buffer receives a clock signal and outputs an internal clock signal based on a clock switch signal. The first logic circuit receives an asynchronous clock enable signal and a synchronous clock enable signal, and outputs the clock switch signal. The second logic circuit receives the asynchronous clock enable signal, the synchronous clock enable signal and the internal clock signal, and outputs a clock gating signal. The latch circuit receives the asynchronous clock enable signal and the clock gating signal to output the synchronous clock enable signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:時脈訊號閘控電路</p>
        <p type="p">110:時脈輸入緩衝器</p>
        <p type="p">112:第一邏輯電路</p>
        <p type="p">114:第二邏輯電路</p>
        <p type="p">114a:XOR閘</p>
        <p type="p">114b:AND閘</p>
        <p type="p">116:閂鎖電路</p>
        <p type="p">118:輸入緩衝器</p>
        <p type="p">CLK_T、CLK_C:一對互補時脈訊號</p>
        <p type="p">CLK:時脈訊號</p>
        <p type="p">CK_t:內部時脈訊號</p>
        <p type="p">CKE:時脈致能訊號</p>
        <p type="p">VREF:參考電壓訊號</p>
        <p type="p">CKE_ASYNC:非同步時脈致能訊號</p>
        <p type="p">CKE_SYNC:同步時脈致能訊號</p>
        <p type="p">CK_CKE_EN:輸出訊號</p>
        <p type="p">CK_CKE:時脈閘控訊號</p>
        <p type="p">CLK_EN:時脈開關訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="351" publication-number="202616278">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616278</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138507</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體記憶體裝置及其初始化方法</chinese-title>
        <english-title>SEMICONDUCTOR MEMORY DEVICE AND INITIALIZATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">G11C7/20</main-classification>
        <further-classification edition="200601120250102B">G11C11/4072</further-classification>
        <further-classification edition="200601120250102B">G11C11/401</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林哲民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHE-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體記憶體裝置及其初始化方法。半導體記憶體裝置包括記憶體陣列、刷新控制器以及初始化控制器。記憶體陣列具有多個等化電路及N個記憶胞。多個等化電路分別經由多個位元線對耦接N個記憶胞。刷新控制器經配置以根據自動刷新命令，將初始資料依序刷新至N個記憶胞。初始化控制器經配置以根據初始化啟動命令，進行初始化操作。在初始化操作期間，初始化控制器致能等化電路，且週期性地產生自動刷新命令。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor memory device and an initialization method of this invention are provided. The semiconductor memory device includes a memory array, a refresh controller, and an initialization controller. The memory array has a plurality of equalization circuits and N memory cells. The plurality of equalization circuits are respectively coupled to the N memory cells via a plurality of bit line pairs. The refresh controller is configured to sequentially refresh initial data to the N memory cells according to an automatic refresh command. The initialization controller is configured to perform an initialization operation according to an initialization start command. The initialization controller enables the equalization circuits and periodically generates the automatic refresh command during the initialization operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體記憶體裝置</p>
        <p type="p">110:記憶體陣列</p>
        <p type="p">120:刷新控制器</p>
        <p type="p">130:初始化控制器</p>
        <p type="p">IC_AR:自動刷新命令</p>
        <p type="p">IData:初始資料</p>
        <p type="p">Init_on:初始化啟動命令</p>
        <p type="p">Init_done:初始化結束命令</p>
        <p type="p">STM:初始化信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="352" publication-number="202615878">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615878</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138508</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢測系統及其檢測方法</chinese-title>
        <english-title>DETECTION SYSTEM AND DETECTION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">G01R23/17</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳佾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉子安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TZE-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林高祺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KAO-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種檢測系統用於檢測待測物的頻寬。檢測系統包括可調頻雷射模組、光導開關以及數位擷取系統。可調頻雷射模組用於提供第一混頻光以及第二混頻光，第一混頻光和第二混頻光之間具有相位差或頻率差。光導開關用於接收第一混頻光，待測物用於接收第二混頻光，且光導開關和待測物耦合後輸出一混頻訊號。數位擷取系統用於接收混頻訊號，以檢測待測物的頻寬。亦提供一種檢測方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A detection system used to detect a bandwidth of an object. The detection system includes a frequency-tunable laser modules, a photoconductive switches and a digital capture systems. The frequency-tunable laser module is used to provide a first mixed frequency light and a second mixed frequency light. There is a phase difference or a frequency difference between the first mixed frequency light and the second mixed frequency light. The photoconductive switchs is used for receiving the first mixed frequency light, the object under test is used for receiving the second mixed frequency light, and the photoconductive switch and the object under test are coupled to output a mixed frequency signal. The digital acquisition system is used to receive mixed signals to detect the bandwidth of the object under test. A detection method is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:檢測系統</p>
        <p type="p">100A:可調頻雷射模組</p>
        <p type="p">101:第一光源</p>
        <p type="p">102:第二光源</p>
        <p type="p">103:第三光源</p>
        <p type="p">104:光混頻器</p>
        <p type="p">110:光導開關</p>
        <p type="p">120:光電轉換元件</p>
        <p type="p">DAQ:數位擷取系統</p>
        <p type="p">DO1:第一待測物</p>
        <p type="p">ES1:第一電訊號</p>
        <p type="p">f1:第一頻率</p>
        <p type="p">f2:第二頻率</p>
        <p type="p">L1:第一混頻光</p>
        <p type="p">L2:第二混頻光</p>
        <p type="p">LS:光訊號</p>
        <p type="p">MS:混頻訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="353" publication-number="202616299">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616299</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138509</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理運動訊號的電子裝置和方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND METHOD OF PROCESSING MOTION SIGNAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250123B">G16H50/20</main-classification>
        <further-classification edition="200601120250123B">G01S17/06</further-classification>
        <further-classification edition="200601120250123B">G01S17/58</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭凱仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, KAIJEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YAO-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳胤語</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YIN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種處理運動訊號的電子裝置和方法。方法包含：通過雷達進行偵測以取得動態訊號；對動態訊號執行連續小波轉換以取得小波量值圖；分割小波量值圖以產生多個樣本；將多個樣本分群為第一群集及第二群集；根據第一群集從動態訊號取樣出運動訊號；以及輸出運動訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device and a method of processing motion signal are provided. The method includes: performing a detection through a radar to obtain a dynamic signal; performing continuous wavelet transform on the dynamic signal to obtain a scalogram; dividing the scalogram to generate a plurality of samples; clustering the plurality of samples into a first cluster and a second cluster; sampling a motion signal from the dynamic signal according to the first cluster; and outputting the motion signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S121,S122,S123,S124,S125,S126</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="354" publication-number="202615173">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615173</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138510</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>數位汽車鈑金壓合成型系統及其方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B21D5/06</main-classification>
        <further-classification edition="200601120241204B">B21B37/48</further-classification>
        <further-classification edition="200601120241204B">B21D22/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崑山科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUN SHAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江智偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHIH WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐘俊顔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, CHUN YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱韋丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, WEI CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江宏偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, HUNG WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾天穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, TIEN YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱銘峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王傳勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種數位汽車鈑金壓合成型系統及其方法，該系統包含有機台、移動單元、二壓合單元及控制單元；該方法(A)根據汽車鈑金構件之外型，取得一數位化移動路徑；(B)輸入數位化移動路徑；(C)控制二模頭相向沿著橫向及縱向移動至預定位置；(D)控制該二模頭沿著垂向而相向移動，以壓合固定一鈑金胚材；(E)對於一模頭施加壓力，控制該二模頭沿著垂向同向的移動一沖程，使得鈑金胚材產生局部形變；(F)釋放壓力，控制二模頭縮回；(G)該二模頭依序重覆上述步驟(C)、(D)、(E)及(F)，將該鈑金胚材壓合成型為汽車鈑金構件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:機台</p>
        <p type="p">11:上基座</p>
        <p type="p">12:下基座</p>
        <p type="p">13:夾具</p>
        <p type="p">2:移動單元</p>
        <p type="p">21:第一滑軌</p>
        <p type="p">22:第一滑座</p>
        <p type="p">23:第二滑軌</p>
        <p type="p">24:第二滑座</p>
        <p type="p">3:壓合單元</p>
        <p type="p">31:致動桿</p>
        <p type="p">32:模頭</p>
        <p type="p">4:控制單元</p>
        <p type="p">K:鈑金胚材</p>
        <p type="p">X:橫向</p>
        <p type="p">Z:垂向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="355" publication-number="202615793">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615793</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138512</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水冷裝置連接結構</chinese-title>
        <english-title>WATER-COOLING DEVICE CONNECTION STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250318B">F16L47/04</main-classification>
        <further-classification edition="200601120250318B">F16L49/06</further-classification>
        <further-classification edition="200601120250318B">F28F9/26</further-classification>
        <further-classification edition="200601120250318B">G06F1/20</further-classification>
        <further-classification edition="200601120250318B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇鋐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIA VITAL COMPONENTS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈慶行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, CHING-HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫大龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明一種水冷裝置連接結構，係包括一具有入水口及出水口的水冷單元、至少一連接單元及一管體，該連接單元具有一組合件及一對接件，該組合件具有一固定座部，該固定座部的前側向外延伸有一延伸部，該延伸部內設有一第一通道，在該延伸部的外側設有至少一防漏部，該延伸部透過該防漏部連接至該水冷單元的入水口或出水口內，該對接件具有一對接座部，該對接座部的前側與固定座部的後側相接，其後側延伸有一套接部，該套接部內設有一第二通道係連通該第一通道，該管體的一端插入該第二通道至該第一通道內相結合，令管體與水冷單元的腔室相連通，藉以達到管體與水冷單元間無須焊接及大幅降低漏水的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:連接單元</p>
        <p type="p">20:組合件</p>
        <p type="p">200:固定座部</p>
        <p type="p">201:第一凸緣</p>
        <p type="p">202:第一穿孔</p>
        <p type="p">205:延伸部</p>
        <p type="p">206:防漏部</p>
        <p type="p">207:第一通道</p>
        <p type="p">21:對接件</p>
        <p type="p">210:第二凸緣</p>
        <p type="p">211:對接座部</p>
        <p type="p">212:第二穿孔</p>
        <p type="p">215:套接部</p>
        <p type="p">216:第二通道</p>
        <p type="p">3:水冷單元</p>
        <p type="p">31:泵浦</p>
        <p type="p">32:入水口</p>
        <p type="p">33:出水口</p>
        <p type="p">34:鎖孔</p>
        <p type="p">4:管體</p>
        <p type="p">41:管接端</p>
        <p type="p">5:固定件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="356" publication-number="202614971">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614971</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138515</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚焦型超音波產生裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241125B">A61B8/08</main-classification>
        <further-classification edition="200601120241125B">A61N7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>振磬科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EPISONICA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭珈瑒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖芳儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖鉦達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種聚焦型超音波產生裝置包括一殼體、一壓電片、一超音波傳導軟墊與一傳導組件。該壓電片設置於該殼體中，該壓電片呈弧形且具有至少五個壓電環，各該壓電環受控制產生特定頻率之超音波；該超音波傳導軟墊設置於該殼體中；該傳導組件包含相連接之一柔性液體袋及一連接座，該連接座連接於該殼體，該柔性液體袋之上部至少部分的與該超音波傳導軟墊接觸，該柔性液體袋之下部顯露於外部空間供與患者接觸；其中該超音波傳導軟墊夾設於該壓電片與該柔性液體袋之間。藉此，透過超音波傳導軟墊填充壓電片與傳導組件之間的空隙，提高超音波能量傳遞的效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:聚焦型超音波產生裝置</p>
        <p type="p">10:殼體</p>
        <p type="p">12:上蓋</p>
        <p type="p">122:連接件</p>
        <p type="p">126:凸塊</p>
        <p type="p">14:環座</p>
        <p type="p">142:固定件</p>
        <p type="p">144:環狀凸垣</p>
        <p type="p">146:凹槽</p>
        <p type="p">20:壓電片</p>
        <p type="p">30:超音波傳導軟墊</p>
        <p type="p">40:傳導組件</p>
        <p type="p">42:柔性液體袋</p>
        <p type="p">422:上部</p>
        <p type="p">424:下部</p>
        <p type="p">44:連接座</p>
        <p type="p">442:卡塊</p>
        <p type="p">444:第一通孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="357" publication-number="202616704">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616704</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138518</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>應用於混合雲監控與階層式告警的系統及其方法</chinese-title>
        <english-title>METHOD AND SYSTEM FOR HYBRID CLOUD MONITORING AND HIERARCHICAL ALERTING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250203B">H04L43/04</main-classification>
        <further-classification edition="202201120250203B">H04L41/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉哲育</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIOU, JHE-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, I-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種應用於混合雲監控與階層式告警的系統及其方法，方法包括使用者於跨雲整合介面訂閱公雲服務以及設定預算金額，以依據預算金額建立告警規則；利用公私雲操作指令庫中的公私雲操作指令從公私雲排程定期獲取公雲使用金額資訊以及雲資源使用細節資訊；以及依據告警規則及公雲使用金額資訊以及雲資源使用細節資訊判斷是否觸發告警規則，倘若觸發告警規則，則執行與告警規則對應的維運腳本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and system for hybrid cloud monitoring and hierarchical alerting is provided, the method includes an user subscribes public cloud service and sets a budget amount through a cross-cloud integration interface to create an alarm rule according to the budget amount, using public and private cloud operation instructions in a public and private cloud operation instruction library to regularly obtain a public cloud usage amount information and a cloud resource usage details information from the public and private cloud, and determining whether an alarm rule is triggered according to the alarm rule and the public cloud usage amount information and cloud resource usage details. If the alarm rule is triggered, a maintenance script corresponding to the alarm rule is executed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:應用於混合雲監控與階層式告警的系統、系統</p>
        <p type="p">200:公私雲</p>
        <p type="p">110:跨雲整合介面</p>
        <p type="p">120:階層告警判別模組</p>
        <p type="p">130:公私雲資料蒐集彙整模組</p>
        <p type="p">140:跨雲維運腳本集合</p>
        <p type="p">150:公私雲操作指令庫</p>
        <p type="p">160:告警規則管理模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="358" publication-number="202615910">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615910</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138519</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通訊光連結裝置及其製造方法</chinese-title>
        <english-title>OPTICAL COMMUNICATION INTERCONNECT DEVICE AND THE MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241028B">G02B6/122</main-classification>
        <further-classification edition="200601120241028B">G02B6/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳致曉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種通訊光連結裝置及其製造方法，其是沿一XYZ三維空間的X軸方向依序將一具至少一波導元件的波導陣列單元、一具至少一光主動元件的光主動元件陣列單元及一具至少一子載板的母載板單元校準定位並連結固定成一體，且各單元間的空隙是利用一光學指數大於空氣的填充材料所填滿，其中各該波導元件、各該光主動元件及各該子載板之間是藉由各光軸或定位參考軸的一對一耦合關係以沿X軸方向依序連結形成一不存在任何空氣或真空間隙的光通道，使該通訊光連結裝置能由至少一該光通道且各該光通道是在YZ平面上間隔排列形成一陣列所構成，達成高耦合效率與高傳輸密度的目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:通訊光連結裝置</p>
        <p type="p">10:波導陣列單元</p>
        <p type="p">11:波導元件</p>
        <p type="p">111:核心</p>
        <p type="p">112:外包層</p>
        <p type="p">12:光軸</p>
        <p type="p">13:表面</p>
        <p type="p">14:第一YZ平面</p>
        <p type="p">20:光主動元件陣列單元</p>
        <p type="p">21:光主動元件</p>
        <p type="p">22:光軸</p>
        <p type="p">23:表面</p>
        <p type="p">24:第二YZ平面</p>
        <p type="p">30:母載板單元</p>
        <p type="p">31:子載板</p>
        <p type="p">32:定位參考軸</p>
        <p type="p">33:表面</p>
        <p type="p">34:表面</p>
        <p type="p">35:聚焦反射鏡</p>
        <p type="p">40:填充材料</p>
        <p type="p">40a:空隙</p>
        <p type="p">50:光通道</p>
        <p type="p">60:吸光體</p>
        <p type="p">60a:吸光體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="359" publication-number="202615266">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615266</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138521</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於組態電動車充電站之系統及方法</chinese-title>
        <english-title>SYSTEMS AND METHODS FOR CONFIGURING AN ELECTRIC VEHICLE CHARGING STATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250203B">B60L53/10</main-classification>
        <further-classification edition="201901120250203B">B60L53/14</further-classification>
        <further-classification edition="201901120250203B">B60L53/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拓連科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOODOE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉昱廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIOU, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龔俊宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNG, CHUN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於組態電動車充電站之系統及方法，適用於一行動裝置與一電動車充電站之間。首先，透過行動裝置取得相應一特定操作之至少一設定參數，其中設定參數用以組態電動車充電站。透過行動裝置依據特定操作以及設定參數產生一無線識別標籤，並透過行動裝置，與電動車充電站建立一短距離通訊連線並透過短距離通訊連線傳送無線識別標籤。接著，利用電動車充電站之一讀取單元透過短距離通訊連線接收無線識別標籤。之後，透過電動車充電站，解析無線識別標籤以取得特定操作以及設定參數並以相應無線識別標籤之設定參數，對電動車充電站執行特定操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and methods for configuring an electric vehicle charging station, applicable between a mobile device and an electric vehicle charging station are provided. First, at least one configuration parameter corresponding to a specific operation is obtained through the mobile device, wherein the configuration parameter is used to configure the electric vehicle charging station. A wireless identification tag is generated through the mobile device based on the specific operation and the configuration parameter, and a short-range communication connection is established between the mobile device and the electric vehicle charging station to transmit the wireless identification tag through the short-range communication connection. Next, the wireless identification tag is received through a reading unit of the electric vehicle charging station via the short-range communication connection. Then, the electric vehicle charging station parses the wireless identification tag to obtain the specific operation and configuration parameter, and performs the specific operation on the electric vehicle charging station according to the configuration parameter corresponding to the wireless identification tag.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S510、S520、S530、S540、S550:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="360" publication-number="202615172">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615172</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138523</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>盤元緩冷產線的保溫罩</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B21B45/02</main-classification>
        <further-classification edition="200601120241204B">C21D9/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李增賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周科名</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪敏雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡怡迦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭楷淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種盤元緩冷產線的保溫罩，適用於蓋設在供一盤元緩冷的緩冷機，且該緩冷機包含一朝一運輸方向運作的運輸單元，及二設置於左右兩側的擋牆。該盤元緩冷產線的保溫罩包含一基板、二銜接件、二抵頂板、二延伸件，及一第一頂板。該基板與該運輸單元界定出一供輻射熱傳遞的預設距離。該等銜接件分別沿該基板之相反兩側向上延伸。每一該抵頂板搭接在個別之該擋牆。該等延伸件分別沿個別之抵頂板向上延伸。該第一頂板與該基板及該等抵頂板間隔界定出一中空層。因此能使該基板貼近該盤元之中間處，使該盤元確保緩冷而降低拉伸強度，以利後續加工。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">2:銜接件</p>
        <p type="p">3:抵頂板</p>
        <p type="p">4:延伸件</p>
        <p type="p">5:第一頂板</p>
        <p type="p">50:中空層</p>
        <p type="p">51:散熱槽</p>
        <p type="p">7:緩冷機</p>
        <p type="p">71:運輸單元</p>
        <p type="p">72:擋牆</p>
        <p type="p">d:預設距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="361" publication-number="202615361">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615361</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138526</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>與來自半導體加工設施的廢物流相關的系統、製品及方法</chinese-title>
        <english-title>SYSTEMS, ARTICLES, AND METHODS RELATED TO WASTE STREAMS FROM SEMICONDUCTOR PROCESSING FACILITIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250925B">C02F1/66</main-classification>
        <further-classification edition="202301120250925B">C02F1/62</further-classification>
        <further-classification edition="202301120250925B">C02F1/44</further-classification>
        <further-classification edition="200601120250925B">B24B57/00</further-classification>
        <further-classification edition="200601320250925B">C02F101/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商格雷迪安特公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRADIANT CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯塔　席法　庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTA, SIVA KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>那塔拉真　桑卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATARAJAN, SANKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑達倫　迪帕克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNDARAM, DEEPAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　尼可拉斯　騰　龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, NICHOLAS TENG LOONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王圓圓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YUANYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦　喬安　彥　騰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIN, JOANNE YAN TENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林蘭君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容總體上關於用於處理來自半導體加工設施的廢物的系統、製品及方法。一些實施方式涉及能夠從離開半導體加工設施的廢物流中去除一種或多種污染物的一個或多個流體系統。在一些實施方式中，該等方法涉及中和系統輸入[IWN]、非飲用再利用系統[NPR]、化學機械拋光機銅再生系統[CMP-Cu]、化學機械拋光機金屬和/或金屬氧化物再生系統[CMP-O/M]、氫氟酸廢水系統[HFW]、異丙醇處理系統[IPAL]、氫氟酸廢水再生系統[HFWR]、過氧化氨處理系統[APM]、洗滌器再生系統[LSR]、和/或中和廢料系統[IWN廢料]。在一些實施方式中，向本文所描述的該等系統提供該等系統的一種或多種輸入，使得一種或多種輸出離開該等系統。一些輸出流具有相對低的污染物濃度，而其他輸出可能具有相對高的污染物濃度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure is generally related to systems, articles, and methods for treating waste from semiconductor processing facilities. Some embodiments involve one or more fluidic systems capable of removing one or more contaminants from waste streams exiting a semiconductor processing facility. In some embodiments, the methods involve a neutralization system input [IWN], a non-potable reuse system [NPR], a chemical mechanical polisher copper reclamation system [CMP-Cu], a chemical mechanical polisher metal and/or metal oxide reclamation system [CMP-O/M], a hydrofluoric wastewater system [HFW], an isopropyl alcohol treatment system [IPAL], a hydrofluoric wastewater reclaim system [HFWR], an ammonia peroxide treatment system [APM], a scrubber reclaim system [LSR], and/or a neutralization reject system [IWN Reject]. In some embodiments, one or more inputs of the systems described herein are provided to the systems such that one or more outputs exit the systems. Some output streams have a relatively low concentration of contaminants while other outputs may have relatively high concentration of contaminants.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">102:IWN</p>
        <p type="p">103:IWN輸入</p>
        <p type="p">104,112,118,128,136,142,146,156,166,174,182,204:入口</p>
        <p type="p">106,108,114,120,122,124,130,132,138,140,148,150,152,158,160,162,168,170,176,178,184,194,197,199,207:出口</p>
        <p type="p">105:第一IWN輸出</p>
        <p type="p">107:第二IWN輸出</p>
        <p type="p">110:NPR</p>
        <p type="p">111:NPR輸入</p>
        <p type="p">113:NPR輸出</p>
        <p type="p">116:HFWR</p>
        <p type="p">117:HFWR輸入</p>
        <p type="p">119:第一HFW輸出</p>
        <p type="p">121:輔助HFWR輸出</p>
        <p type="p">123:第二HFWR輸出</p>
        <p type="p">126:HFW</p>
        <p type="p">127:HFW輸入</p>
        <p type="p">129:第一HFW輸出</p>
        <p type="p">131:第二HFW輸出</p>
        <p type="p">134:APM</p>
        <p type="p">135:第一APM輸入</p>
        <p type="p">137:第一APM輸出</p>
        <p type="p">139:第二APM輸出</p>
        <p type="p">141:第二APM輸入</p>
        <p type="p">144:IPAL</p>
        <p type="p">145:IPAL輸入</p>
        <p type="p">147:第一IPAL輸出</p>
        <p type="p">149:第二IPAL輸出</p>
        <p type="p">151:第三IPAL輸出</p>
        <p type="p">154:CMP-O/M</p>
        <p type="p">155:CMP-O/M輸入</p>
        <p type="p">157:第一CMP-O/M輸出</p>
        <p type="p">159:第二CMP-O/M輸出</p>
        <p type="p">161:第三CMP-O/M輸出</p>
        <p type="p">164:CMP-Cu</p>
        <p type="p">165:CMP-Cu輸入</p>
        <p type="p">167:第一CMP-Cu輸出</p>
        <p type="p">169:第二CMP-Cu輸出</p>
        <p type="p">172:LSR</p>
        <p type="p">173:LSR輸入</p>
        <p type="p">175:第一LSR輸出</p>
        <p type="p">177:第二LSR輸出</p>
        <p type="p">180:IWN廢料</p>
        <p type="p">181:IWN廢料輸入</p>
        <p type="p">183:IWN廢料輸出</p>
        <p type="p">185:酸輸入</p>
        <p type="p">187:廢物</p>
        <p type="p">191A:UPW再生輸出</p>
        <p type="p">191B:UPW輸出的一部分</p>
        <p type="p">191C:CTBD輸出</p>
        <p type="p">191D:IW提升站輸出</p>
        <p type="p">192A:AME輸出</p>
        <p type="p">192B:SWGS輸出</p>
        <p type="p">192C:PLW輸出</p>
        <p type="p">193:下游系統</p>
        <p type="p">196:第三HFW輸出</p>
        <p type="p">198:第四CMP-O/M輸出</p>
        <p type="p">200:UPW</p>
        <p type="p">201:UPW輸出</p>
        <p type="p">203:POTW輸入</p>
        <p type="p">205:POTW</p>
        <p type="p">206:POTW輸出</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="362" publication-number="202616793">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616793</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138527</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>快拆塑料連接件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241029B">H05K5/02</main-classification>
        <further-classification edition="200601120241029B">F16B39/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康揚企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG YANG HARDWARE ENTERPRISES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝淑麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉盛豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種快拆塑料連接件，其包括一幾何造形的軸桿，該軸桿的外周面徑向伸出複數個呈規則或不規則排列且具有可撓性的突出物，且該軸桿的一頂部藉由一連接柱一體連接一帽蓋；以及該軸桿的該頂部另伸出一對斜向翼片，且各該斜向翼片與該帽蓋之間設有一扣片。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">4:快拆塑料連接件</p>
        <p type="p">41:軸桿</p>
        <p type="p">411:切面</p>
        <p type="p">412:錐形端</p>
        <p type="p">413:連接柱</p>
        <p type="p">414:斜向翼片</p>
        <p type="p">415:扣片</p>
        <p type="p">42:突出物</p>
        <p type="p">43:帽蓋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="363" publication-number="202616150">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616150</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138529</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>整合多評準決策與系統動力學進行政策模擬系統及其方法</chinese-title>
        <english-title>POLICY SIMULATION SYSTEM AND METHOD THEREOF WITH INTEGRATING MULTI-CRITERIA DECISION MAKING AND SYSTEM DYNAMICS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250512B">G06N5/02</main-classification>
        <further-classification edition="202301120250512B">G06N5/043</further-classification>
        <further-classification edition="202301120250512B">G06N5/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中山大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL SUN YAT-SEN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昱君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張揚祺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YANG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏　沛亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHATEAU, PIERRE-ALEXANDRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種政策模擬方法包含：收集一相關資料；利用該相關資料初步模擬建立至少一評估指標；利用該評估指標提供數個初步專家問卷，以便獲得至少一初步專家問卷結果；利用該初步專家問卷結果建立一網路程序分析法之層級架構；建立數個ANP專家問卷，以便獲得至少一ANP專家問卷結果；利用該ANP專家問卷結果進行權重計算，以獲得至少一模型權重值；利用該ANP專家問卷結果確立至少一系統動力學模式之指標；利用該ANP專家問卷結果及該系統動力學模式之指標繪製至少一因果回饋圖。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A policy simulation method includes: collecting related data; simulating with the related data to build at least one evaluation index; providing a plurality of preliminary expert questionnaires with the evaluation index to obtain at least one preliminary expert result; building an ANP hierarchical structure according to the preliminary expert result; providing a plurality of ANP preliminary expert questionnaires to obtain at least one ANP expert result; calculating the ANP expert result to obtain at least one weighted values of model; calculating the ANP expert result to confirm at least one index of system dynamic model; producing at least one causal loop diagram according the ANP expert result and the index of system dynamic model.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:輸入單元</p>
        <p type="p">1a:收集資料單元</p>
        <p type="p">10a:初步專家問卷單元</p>
        <p type="p">10b:ANP專家問卷單元</p>
        <p type="p">2:計算單元</p>
        <p type="p">2a:模擬評估指標單元</p>
        <p type="p">2b:ANP之層級架構</p>
        <p type="p">2c:系統動力學模式之指標</p>
        <p type="p">3:輸出單元</p>
        <p type="p">30:因果回饋圖</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="364" publication-number="202616294">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616294</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138540</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>串流系統及串流方法</chinese-title>
        <english-title>STREAMING SYSTEM AND STREAMING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250203B">G16H10/60</main-classification>
        <further-classification edition="200601120250203B">A61B5/00</further-classification>
        <further-classification edition="201101220250203B">H04N21/234</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大立雲康科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LARGAN HEALTH AI-TECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴政國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHENG-KUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚元彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, YUAN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳振祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHEN-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪于傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, YU-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種串流系統，其為一心電圖串流系統，並包含一測量模組、一分析模組以及一顯示模組。測量模組包含一原始數據產生單元。分析模組訊號連接測量模組及顯示模組，並包含一原始數據分割單元、一原始分割數據濾波單元及一濾波分割數據處理單元。顯示模組包含一網頁跨平台串流單元及一資料呈現單元。藉此，有助於改善心電圖檔案龐大且無法即時開啟的缺陷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A streaming system is an electrocardiogram streaming system and includes a measurement module, an analysis module and a display module. The measurement module includes an original data generating unit. The analysis module signal is connected to the measurement module and the display module, and includes an original data segmenting unit, an original segmented data filtering unit and a filtered segmented data processing unit. The display module includes a web page cross-platform streaming unit and a data presenting unit. Thus, the streaming system of the present disclosure can improve the shortcomings of ECG files that are large and cannot be opened immediately.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:串流系統</p>
        <p type="p">110:測量模組</p>
        <p type="p">111:原始數據產生單元</p>
        <p type="p">112:原始數據存檔單元</p>
        <p type="p">113:原始數據傳輸單元</p>
        <p type="p">120:分析模組</p>
        <p type="p">121:原始數據分割單元</p>
        <p type="p">122:原始分割數據時戳賦予單元</p>
        <p type="p">123:原始分割數據存檔單元</p>
        <p type="p">124:原始分割數據濾波單元</p>
        <p type="p">125:濾波分割數據處理單元</p>
        <p type="p">126:分析結果儲存單元</p>
        <p type="p">130:顯示模組</p>
        <p type="p">131:資料提取單元</p>
        <p type="p">132:濾波分割壓縮數據解壓縮單元</p>
        <p type="p">133:網頁跨平台串流單元</p>
        <p type="p">134:網頁限時單元</p>
        <p type="p">135:讀取優化單元</p>
        <p type="p">136:資料暫存單元</p>
        <p type="p">137:資料呈現單元</p>
        <p type="p">138:資料應用單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="365" publication-number="202615387">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615387</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138541</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>從液體流中分離異丙醇</chinese-title>
        <english-title>ISOPROPYL ALCOHOL SEPARATION FROM LIQUID STREAMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">C07C29/82</main-classification>
        <further-classification edition="200601120250602B">C07C29/76</further-classification>
        <further-classification edition="200601120250602B">C07C31/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商格雷迪安特公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRADIANT CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯塔　席法　庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTA, SIVA KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>那塔拉真　桑卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATARAJAN, SANKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑達倫　迪帕克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNDARAM, DEEPAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　尼可拉斯　騰　龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, NICHOLAS TENG LOONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王圓圓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YUANYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦　喬安　彥　騰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIN, JOANNE YAN TENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林蘭君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一般性地描述了用於從水性液體流中分離異丙醇（IPA）之方法及相關系統。一些方面涉及處理含有異丙醇的水性流（例如，半導體加工廢水流）以去除一些或全部IPA，從而產生富含IPA的流，並且在一些情況下產生IPA減少的流。可以經由基於膜的分離（例如，反滲透）與蒸餾的組合來去除IPA。某些方面涉及蒸餾設備配置，該等配置可以高效且有效地從富含IPA的水性流（例如，經由先前的基於膜的濃縮）中分離IPA。例如，該蒸餾設備可以被配置成實現IPA蒸氣在其蒸餾容器內的相對低的停留時間。低停留時間可以例如使用具有相對低高度和/或短床配置的蒸餾容器來實現。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and related systems for separating isopropyl alcohol (IPA) from aqueous liquid streams are generally described. Some aspects are directed to treatment of aqueous streams (e.g., semiconductor processing wastewater streams) containing isopropyl alcohol to remove some or all of the IPA, thereby generating a stream rich in IPA and, in some instances, a stream diminished in IPA. The IPA may be removed via a combination of membrane-based separation (e.g., reverse osmosis) and distillation. Certain aspects relate to distillation apparatus configurations that can efficiently and effectively separate the IPA from an aqueous stream that is enriched in the IPA (e.g., via prior membrane-based concentration). For example, the distillation apparatus may be configured to achieve a relatively low residence time of IPA vapor within its distillation vessel. The low residence time may be achieved, for example, using a distillation vessel with a relatively low height and/or a short-bed configuration.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系统</p>
        <p type="p">101:水性IPA回收输入流</p>
        <p type="p">102:膜分离器</p>
        <p type="p">103:截留物侧</p>
        <p type="p">104:透过物侧</p>
        <p type="p">105:膜分离器截留物入口流</p>
        <p type="p">106:膜分离器截留物出口流</p>
        <p type="p">107:膜分离器透过物出口流</p>
        <p type="p">200:蒸镏设备</p>
        <p type="p">201:蒸镏输入</p>
        <p type="p">202:富含IPA的液体输出流</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="366" publication-number="202616577">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616577</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138543</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可鎖定的連接器總成及可鎖定的連接器</chinese-title>
        <english-title>LOCKABLE CONNECTOR ASSEMBLY AND LOCKABLE CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">H01R13/436</main-classification>
        <further-classification edition="200601120241230B">H01R4/18</further-classification>
        <further-classification edition="200601120241230B">H01R13/627</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禾昌興業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>P-TWO INDUSTRIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林賢昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIEN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐漢民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HAN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁國隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可鎖定的連接器總成，包含可彼此嵌合的第一連接器及第二連接器。第一連接器包含樞設在絕緣殼體的連接器位置保證構件，連接器位置保證構件可在第一位置與第二位置之間樞轉地移動。第二連接器包含具備鎖定臂的絕緣殼體，鎖定臂恆常地偏置至鎖定位置。當連接器位置保證構件被樞轉至第一位置時，允許鎖定臂可被偏置離開鎖定位置。當連接器位置保證構件被樞轉至第二位置時，不允許鎖定臂被偏置離開鎖定位置，確保第一連接器及第二連接器之間的鎖定狀態無法被解除。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A lockable connector assembly comprising a first connector and a second connector which are mateable with each other is provided. The first connector comprises a connector position assurance member which is pivoted on an insulating housing and pivotably movable between a first position and a second position. The second connector comprises an insulating housing having a lock arm normally biased to a lock position. When the connector position assurance member is pivotably moved to the first position, the lock arm is allowed to be biased away from the lock position. When the connector position assurance member is pivotably moved to the second position, the lock arm is not allowed to be biased away from the lock position, ensuring that the lock state between the first connector and the second connector cannot be released.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:可鎖定的連接器總成</p>
        <p type="p">10:插座連接器</p>
        <p type="p">11:絕緣殼體</p>
        <p type="p">12:連接器位置保證構件</p>
        <p type="p">20:插頭連接器</p>
        <p type="p">21:絕緣殼體</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="367" publication-number="202615360">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615360</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138548</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>與降低或消除來自半導體廢物流的液體排放相關的系統、製品及方法</chinese-title>
        <english-title>SYSTEMS, ARTICLES, AND METHODS RELATED TO LOWERING OR ELIMINATING LIQUID DISCHARGE FROM SEMICONDUCTOR WASTE STREAMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250512B">C02F1/44</main-classification>
        <further-classification edition="202301120250512B">C02F1/38</further-classification>
        <further-classification edition="200601120250512B">B01D61/02</further-classification>
        <further-classification edition="200601320250512B">C02F103/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商格雷迪安特公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRADIANT CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯塔　席法　庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTA, SIVA KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>那塔拉真　桑卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATARAJAN, SANKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑達倫　迪帕克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNDARAM, DEEPAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯尼卡拉　喬瑟夫　賽巴斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONINKARA, JOSEPH SEBASTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林蘭君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一般性地描述了與處理來自半導體加工設施的廢物相關的系統、製品及方法。某些方面關於用於處理來自半導體加工設施的廢物（例如，廢水）以使得幾乎不產生液體排放之方法。在一些實施方式中，該等系統及方法涉及一個或多個流體系統，該一個或多個流體系統能夠從離開半導體加工設施和/或半導體加工設施下游的廢水加工設施的進料中去除一種或多種物質（例如，污染物）。在一些實施方式中，該等系統及方法涉及一個或多個膜分離器、一個或多個泡沫分餾分離器、生物處理系統、提取系統、增濕器、固體去除系統、離心機系統、和/或脫水系統。在一些實施方式中，向該等系統提供一種或多種輸入，並且一種或多種輸出（例如，經處理的流和/或固體）離開該等系統。一些輸出流具有相對低的污染物濃度（例如，來自純化），而其他輸出可能具有相對高的污染物濃度（例如，來自污染物富集，比如將棄置）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems, articles, and methods related to treating waste from a semiconductor processing facility are generally described. Certain aspects relate to methods for treating waste (e.g., wastewater) from a semiconductor processing facility such that little to no liquid discharge is produced. In some embodiments, the systems and methods involve one or more fluidic systems capable of removing one or more species (e.g., contaminants) from a feed exiting a semiconductor processing facility and/or a wastewater processing facility downstream from the semiconductor processing facility. In some embodiments, the systems and methods involve one or more membrane separators, one or more foam fractionation separators, a biological treatment system, an extraction system, a humidifier, a solids-removal system, a centrifuge system, and/or a dewatering system. In some embodiments, one or more inputs are provided to the systems and one or more outputs (e.g., treated streams and/or solids) exit the systems. Some output streams have a relatively low concentration of contaminants (e.g., from purification) while other outputs may have relatively high concentration of contaminants (e.g., from contaminant enrichment such as for disposal).</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">102:進料</p>
        <p type="p">104:生物處理系統輸入</p>
        <p type="p">105:第三膜分離器透過物輸出</p>
        <p type="p">106:生物處理系統</p>
        <p type="p">107:半滲透膜</p>
        <p type="p">108,116,117,136,146,154,160,165,175,182,187,190:入口</p>
        <p type="p">110:生物處理系統輸出</p>
        <p type="p">111:第三膜分離器截留物輸出</p>
        <p type="p">112,113,125,128,132,137,142,147,152,158,163,171,173,177,179,184,192,194,195:出口</p>
        <p type="p">114:第一膜分離器截留物輸入</p>
        <p type="p">118:第一膜分離器</p>
        <p type="p">120:半滲透膜</p>
        <p type="p">122:截留物側</p>
        <p type="p">124:透過物側</p>
        <p type="p">126:第一膜分離器截留物輸出</p>
        <p type="p">127:ABF廢料輸出</p>
        <p type="p">130:第一膜分離器透過物輸出</p>
        <p type="p">134:提取系統輸入</p>
        <p type="p">138:提取系統</p>
        <p type="p">139:UF廢料輸出</p>
        <p type="p">140:提取系統輸出</p>
        <p type="p">144:澄清器輸入</p>
        <p type="p">145:澄清器固體富集輸出</p>
        <p type="p">148:澄清器</p>
        <p type="p">150:澄清器產物輸出</p>
        <p type="p">153:ABF輸入</p>
        <p type="p">156:ABF</p>
        <p type="p">157:ABF產物輸出</p>
        <p type="p">159:UF輸入</p>
        <p type="p">161:UF</p>
        <p type="p">164:第二膜分離器截留物輸入</p>
        <p type="p">166:第二膜分離器</p>
        <p type="p">167:透過物側</p>
        <p type="p">168:半滲透膜</p>
        <p type="p">169:截留物側</p>
        <p type="p">170:第二膜分離器截留物輸出</p>
        <p type="p">172:第二膜分離器透過物輸出</p>
        <p type="p">174:固體去除系統輸入</p>
        <p type="p">176:固體去除系統</p>
        <p type="p">178:經稀釋輸出</p>
        <p type="p">180:固體富集輸出</p>
        <p type="p">181:氨去除系統輸入</p>
        <p type="p">183:氨去除系統</p>
        <p type="p">185:氨去除系統輸出</p>
        <p type="p">186:經處理廢水容器輸入</p>
        <p type="p">188:經處理廢水容器</p>
        <p type="p">189:脫水系統輸入</p>
        <p type="p">191:脫水系統</p>
        <p type="p">193:脫水系統固體富集輸出</p>
        <p type="p">196:第三膜分離器截留物輸入</p>
        <p type="p">197:第三膜分離器</p>
        <p type="p">198:截留物側</p>
        <p type="p">199:透過物側</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="368" publication-number="202615728">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615728</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138555</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含金屬鎳/鎳鐵氫氧化物催化層修飾之碘化銅-鉍複合電極及其製備方法以及使用含金屬鎳/鎳鐵氫氧化物催化層修飾之碘化銅-鉍複合電極製備己二腈的方法</chinese-title>
        <english-title>METALLIC NICKEL/NICKEL-IRON HYDROXIDE CATALYTIC LAYER-MODIFIED COPPER IODIDE-BISMUTH COMPOSITE ELECTRODE AND PREPARATION METHOD THEREOF AND METHOD FOR PREPARING ADIPONITRILE USING METALLIC NICKEL/NICKEL-IRON HYDROXIDE CATALYTIC LAYER-MODIFIED COPPER IODIDE-BISMUTH COMPOSITE ELECTRODE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241022B">C25D5/12</main-classification>
        <further-classification edition="200601120241022B">C25D3/12</further-classification>
        <further-classification edition="200601120241022B">C25D17/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林家裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIA-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃詩晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHIH-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡明錡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MING-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡維哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, WEI-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種製備含金屬鎳/鎳鐵氫氧化物催化層修飾之碘化銅-鉍複合電極之方法，包括步驟：配製含0.25 M的氯化銨、0.067 M至0.133 M的氯化鎳、0.067 M至0.133 M的硫酸亞鐵與0.04 M至2 M 的次磷酸鈉之電鍍液，並將碘化銅-鉍複合電極置於該電鍍液中，在氮氣環境下將金屬鎳/鎳鐵氫氧化物催化層電鍍於該碘化銅-鉍複合電極，以得到含金屬鎳/鎳鐵氫氧化物催化層修飾之碘化銅-鉍複合電極。本發明還提供了一種含金屬鎳/鎳鐵氫氧化物催化層修飾之碘化銅-鉍複合電極，以及使用該含金屬鎳/鎳鐵氫氧化物催化層之碘化銅-鉍複合電極製備己二腈的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of preparing a metallic nickel/nickel-iron hydroxide catalytic layer-modified copper iodide-bismuth composite electrode is disclosed. The method comprises steps of: preparation of the plating solution containing 0.25 M ammonium chloride, 0.067 M to 0.133 M nickel chloride, 0.067 M to 0.133 M ferrous sulfate, and 0.04 M to 2 M sodium hypophosphite; placing a copper iodide-bismuth composite electrode in the plating solution for the electrodeposition of metallic nickel/nickel-iron hydroxide catalytic layer on the copper iodide-bismuth composite electrode under nitrogen purge to obtain the metallic nickel/nickel-iron hydroxide catalytic layer-modified copper iodide-bismuth composite electrode. A metallic nickel/nickel-iron hydroxide catalytic layer modified copper iodide-bismuth composite electrode and a method of preparing adiponitrile using the metallic nickel/nickel-iron hydroxide catalytic layer modified copper iodide-bismuth composite electrode are further provided.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="369" publication-number="202614969">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614969</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138559</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>嬰兒型電極貼片</chinese-title>
        <english-title>BABY ELECTRODE PATCH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120241106B">A61B5/28</main-classification>
        <further-classification edition="202101120241106B">A61B5/259</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商宇心生醫股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QT MEDICAL, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳右庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭穎隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YING-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種嬰兒型電極貼片，用以連接心電圖量測設備，以量測嬰兒的心電圖，嬰兒型電極貼片包含有一電極貼片本體部、一電極貼片延長部以及一電極貼片連接部。電極貼片本體部設置有複數個本體電極，電極貼片延長部連接於電極貼片本體部，而電極貼片連接部連接於電極貼片延長部，且電極貼片延長部用以由電極貼片本體部向嬰兒的身側延伸，以使心電圖量測設備可以放置於嬰兒的身側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A baby electrode patch is used to connect electrocardiogram measurement equipment to measure the electrocardiogram of a baby. The baby electrode patch includes an electrode patch main body, an electrode patch extension portion and an electrode patch connection portion. The electrode patch main body is equipped with a plurality of main body electrodes, the electrode patch extension portion is connected to the electrode patch main body, and the electrode patch connection part is connected to the electrode patch extension part, and the electrode patch extension portion is used to extend from the electrode patch main body to place the electrocardiogram measurement equipment beside the baby.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:嬰兒型電極貼片</p>
        <p type="p">110:電極貼片本體部</p>
        <p type="p">120:電極貼片延長部</p>
        <p type="p">130:電極貼片連接部</p>
        <p type="p">140:定位指示器</p>
        <p type="p">142:第一箭頭</p>
        <p type="p">144:中心位置標示</p>
        <p type="p">146:第二箭頭</p>
        <p type="p">380:第一延伸電極</p>
        <p type="p">390:第二延伸電極</p>
        <p type="p">400:第三延伸電極</p>
        <p type="p">500:心電圖量測設備</p>
        <p type="p">510:連接器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="370" publication-number="202616678">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616678</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138561</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>衛星通訊的移動式終端裝置</chinese-title>
        <english-title>MOBILE TERMINAL DEVICE FOR SATELLITE COMMUNICATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120241120B">H04B7/04</main-classification>
        <further-classification edition="201001120241120B">G01S19/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川升股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BWANT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, MIN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張育瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳沛綾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, PEI-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許哲瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHE-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱宗文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, TSUNG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政大</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種衛星通訊的移動式終端裝置，包含複數天線單元、一天線控制單元以及一處理裝置。天線控制單元電性連接複數天線單元，以控制每一天線單元。處理裝置電性連接天線控制單元，並內建有一通道預測模型，處理裝置將複數環境資訊輸入至通道預測模型中，使通道預測模型根據複數環境資訊自複數天線單元中推論出具有最佳通訊品質之一最佳天線單元及最佳天線單元的一最佳指向角度，處理裝置將最佳天線單元及最佳指向角度傳輸至天線控制單元，使天線控制單元控制最佳天線單元作動並朝向最佳指向角度，以進行具有最佳通訊品質的一衛星通訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides a mobile terminal device for satellite communication, including multiple antenna units, an antenna control unit and a processing device. The antenna control unit is electrically connected to the plurality of antenna units to control each antenna unit. The processing device is electrically connected to the antenna control unit and has a built-in channel prediction model. The processing device inputs a plurality of environmental information into the channel prediction model, so that the channel prediction model infers an optimal antenna unit with the best communication quality from the plurality of antenna units and an optimal pointing angle of the optimal antenna unit based on the plurality of environmental information. The processing device transmits the optimal antenna unit and the optimal pointing angle to the antenna control unit, so that the antenna control unit controls the operation of the optimal antenna unit and points toward the optimal pointing angle to perform satellite communication with the best communication quality.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:移動式終端裝置</p>
        <p type="p">12,14,16:天線單元</p>
        <p type="p">18:天線控制單元</p>
        <p type="p">20:處理裝置</p>
        <p type="p">201:通道預測模型</p>
        <p type="p">22:最佳天線單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="371" publication-number="202616655">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616655</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138568</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>帶通濾波器</chinese-title>
        <english-title>BAND PASS FILTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241101B">H03H9/46</main-classification>
        <further-classification edition="200601120241101B">H03H7/01</further-classification>
        <further-classification edition="200601120241101B">H01P1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立高雄師範大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL KAOHSIUNG NORMAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳建銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JIAN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃彥庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YEN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪群雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHUN-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種帶通濾波器包含基板、二個第一傳輸線、二個第二傳輸線、二第三傳輸線和電容耦合傳輸線。第一傳輸線設置於基板上，且彼此間隔。第二傳輸線設置於基板上，且彼此間隔。每一個第二傳輸線位於第一傳輸線之間。第三傳輸線設置於基板上，且彼此間隔。每一個第三傳輸線位於第二傳輸線之間。電容耦合傳輸線設置於基板上，且位於第三傳輸線之間，並連接第三傳輸線。電容耦合傳輸線的等效電路為導納反轉子的串聯電容。每一個第一傳輸線與相鄰的第二傳輸線形成共振點。每一個第二傳輸線與相鄰的第三傳輸線形成共振點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A band pass filter includes a substrate, two first transmission lines, two second transmission lines, two third transmission lines, and a capacitance coupling transmission line. The first transmission lines are disposed on the substrate and separate from each other. The second transmission lines are disposed on the substrate and separate from each other. Each second transmission line is located between the first transmission lines. The third transmission lines are disposed on the substrate and separate from each other. Each third transmission line is located between the second transmission lines. The capacitance coupling transmission line is disposed on the substrate, and is located between the third transmission lines, and is connected to the third transmission lines. An equivalent circuit of the capacitance coupling transmission line is a serial capacitor of an admittance inverter. Each first transmission line and the adjacent second transmission line form a resonance point. Each second transmission line and the adjacent third transmission line form a resonance point.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:帶通濾波器</p>
        <p type="p">301:輸入端</p>
        <p type="p">302:輸出端</p>
        <p type="p">310:基板</p>
        <p type="p">321,322,331,332,341,342:傳輸線</p>
        <p type="p">331a,332a,341a,342a:第一線段</p>
        <p type="p">331b,332b,341b,342b:第二線段</p>
        <p type="p">350:電容耦合傳輸線</p>
        <p type="p">351:長度邊</p>
        <p type="p">352:寬度邊</p>
        <p type="p">361,362:特性阻抗傳輸線</p>
        <p type="p">L&lt;sub&gt;th1&lt;/sub&gt;,L&lt;sub&gt;th2&lt;/sub&gt;,L&lt;sub&gt;th3&lt;/sub&gt;,L&lt;sub&gt;th4&lt;/sub&gt;,L&lt;sub&gt;thm&lt;/sub&gt;:長度</p>
        <p type="p">W&lt;sub&gt;1&lt;/sub&gt;,W&lt;sub&gt;2&lt;/sub&gt;,W&lt;sub&gt;3&lt;/sub&gt;,W&lt;sub&gt;4&lt;/sub&gt;,W&lt;sub&gt;m&lt;/sub&gt;:寬度</p>
        <p type="p">S&lt;sub&gt;1&lt;/sub&gt;,S&lt;sub&gt;2&lt;/sub&gt;:間隙</p>
        <p type="p">X,Y:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="372" publication-number="202616482">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616482</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138570</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>封裝結構及其製造方法</chinese-title>
        <english-title>PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241028B">H01L23/28</main-classification>
        <further-classification edition="200601120241028B">H01L23/488</further-classification>
        <further-classification edition="200601120241028B">H01L21/56</further-classification>
        <further-classification edition="200601120241028B">H01L21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>能創半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERX SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊東漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, TUNG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張景堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳正閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHEN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種封裝結構，包括：具有載板銲墊的載板、設置在載板上方且具有晶片銲墊的晶片、以及設置在晶片銲墊上方且具有奈米孿晶結構的金屬抗壓層。金屬抗壓層電性連接載板銲墊。奈米孿晶結構在金屬抗壓層內均勻分布，或者奈米孿晶結構以階梯方式或漂浮方式集中在金屬抗壓層的一上方區域且金屬抗壓層的其餘區域為雜亂晶粒。        &lt;b&gt;&lt;i/&gt;&lt;/b&gt;&lt;br/&gt;&lt;b&gt;&lt;i&gt; &lt;/i&gt;&lt;/b&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A package structure includes a carrier having a carrier pad; a chip, disposed over the carrier, having a chip pad; and a metal pressure-resistant layer having a nano-twinned structure disposed over the chip bond pad. The metal pressure-resistant layer is electrically connected to the carrier pad. The nano-twinned structure is evenly distributed within the metal pressure-resistant layer, or the nano-twinned structure is concentrated in an upper region of the metal pressure-resistant layer in a stepped or floating manner and distribution of crystal orientation in another region of the metal pressure-resistant layer is disorderly.        &lt;b&gt;&lt;i/&gt;&lt;/b&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:封裝結構</p>
        <p type="p">102:晶片</p>
        <p type="p">104:晶背黏著層</p>
        <p type="p">106:背晶反應層</p>
        <p type="p">108:晶片銲墊</p>
        <p type="p">110:介電層</p>
        <p type="p">122:黏著層</p>
        <p type="p">124:金屬抗壓層</p>
        <p type="p">142:載板</p>
        <p type="p">144/144a/144b:載板銲墊</p>
        <p type="p">146/146a/146b:保護膜</p>
        <p type="p">162:內聯線導體</p>
        <p type="p">1621:一端</p>
        <p type="p">1622:另一端</p>
        <p type="p">A:第一焊點</p>
        <p type="p">B:第二焊點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="373" publication-number="202616483">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616483</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138571</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>封裝結構及其製造方法</chinese-title>
        <english-title>PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241024B">H01L23/28</main-classification>
        <further-classification edition="200601120241024B">H01L23/488</further-classification>
        <further-classification edition="200601120241024B">H01L21/56</further-classification>
        <further-classification edition="200601120241024B">H01L21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>能創半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERX SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張景堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳正閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHEN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊東漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, TUNG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種封裝結構，包括：載板、設置在載板上的載板銲墊、設置在載板上方的晶片、電性連接晶片且具有奈米孿晶結構的金屬抗壓層、以及內聯線導體。內聯線導體的一端電性連接金屬抗壓層，另一端電性連接載板銲墊。        &lt;b&gt;&lt;i/&gt;&lt;/b&gt;&lt;br/&gt;&lt;b&gt;&lt;i&gt; &lt;/i&gt;&lt;/b&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A package structure includes a carrier; a carrier pad disposed on the carrier; a chip disposed over the carrier; a metal pressure-resistant layer electrically connected to the chip and having a nano-twinned structure; and an interconnection conductor. One end of the interconnection conductor is electrically to the metal pressure-resistant layer, and another end of the interconnection conductor is electrically connected to the carrier pad.        &lt;b&gt;&lt;i/&gt;&lt;/b&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:封裝結構</p>
        <p type="p">102:晶片</p>
        <p type="p">104:晶背黏著層</p>
        <p type="p">106:背晶反應層</p>
        <p type="p">108:晶片銲墊</p>
        <p type="p">110:介電層</p>
        <p type="p">122:黏著層</p>
        <p type="p">124:金屬抗壓層</p>
        <p type="p">142:載板</p>
        <p type="p">144/144a/144b:載板銲墊</p>
        <p type="p">146/146a/146b:保護膜</p>
        <p type="p">162:內聯線導體</p>
        <p type="p">1621:一端</p>
        <p type="p">1622:另一端</p>
        <p type="p">A:第一焊點</p>
        <p type="p">B:第二焊點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="374" publication-number="202616240">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616240</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138578</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>車輛校準方法、設備、裝置以及電腦存儲介質</chinese-title>
        <english-title>VEHICLE CALIBRATING METHOD, APPARATUS, DEVICE, AND COMPUTER STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">G09B9/02</main-classification>
        <further-classification edition="200601120241204B">B60W40/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>苗春壯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIAO, CHUN-ZHUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫志杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, CHIH-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊潤郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, JUN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種車輛標定方法、設備、裝置以及電腦存儲介質，方法包括：在預設的虛擬實境環境中向待標定車輛設備對應的使用者展示預設的目標行車場景；其中，目標行車場景對待標定車輛設備對應的目標真實標定場景進行虛擬模擬得到；回應於使用者針對待標定車輛設備輸入的操作資訊；採集待標定車輛設備的當前的設備參數；根據操作資訊、設備參數以及目標行車場景的場景參數進行模擬計算，得到待標定車輛設備的預測性能表現資料；將預測性能表現資料返回至使用者，以使使用者根據預測性能表現資料對待標定車輛設備進行標定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A vehicle calibrating method includes: displaying a predetermined objective driving scene to a user corresponding to a vehicle device to be calibrated in a preset virtual reality environment, the predetermined objective driving scene being obtained by virtual simulation of a predetermined objective real calibration scene corresponding to vehicle devices to be calibrated of the vehicle; collecting the current device parameters of the vehicle devices to be calibrated when receiving operation information entered by the user for the vehicle devices to be calibrated; performing a simulation calculation to obtain a predicted performance data of the vehicle devices to be calibrated based on the operation information, the device parameters, and scene parameters of the objective driving scene; outputting the predicted performance data to the user, so that the user can calibrate the vehicle devices to be calibrated based on the predicted performance data. A vehicle calibrating apparatus, a vehicle calibrating device, and a computer storage medium are also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101、102、103、104、105:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="375" publication-number="202615739">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615739</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138591</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>長晶設備及其熱場機構</chinese-title>
        <english-title>CRYSTAL GROWTH APPARATUS AND THERMAL FIELD MECHANISM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241015B">C30B35/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>環球晶圓股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBALWAFERS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵晉樑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIU, CHUN LEUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖思涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SZU-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施英汝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, YING-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種長晶設備及其熱場機構。所述熱場機構包含一內筒、設置於所述內筒的一上蓋、及設置於所述上蓋的一上環。所述內筒包含一石墨筒體、及由金屬製成且安裝於所述石墨筒體筒頂部的一第一保護環。所述第一保護環間隔於所述筒頂部的內緣。所述上蓋包含設置於所述第一保護環的一石墨蓋體、及由金屬製成且安裝於所述石墨蓋體內側部的一第二保護環。所述第二保護環間隔於所述內側部的內緣。所述上環包含嵌於所述第二保護環的一石墨環體、及由金屬製成且安裝於所述石墨環體的環頂部的一第三保護環。所述第三保護環間隔於所述環頂部的內緣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a crystal growth apparatus and a thermal field mechanism thereof. The thermal field mechanism thereof includes an inner tube, an upper cover disposed on the inner tube, and an upper ring disposed on the upper cover. The inner tube includes a graphite tube and a first protective ring that is made of metal and that is assembled to a tubular top portion of the graphite tube. The first protective ring is spaced apart from an inner edge of the tubular top portion. The upper cover includes a graphite cover disposed on the first protective ring and a second protective ring that is made of metal and that is assembled to an inner side portion of the graphite cover. The second protective ring is spaced apart from an inner edge of the inner side portion. The upper ring includes a graphite ring engaged with the second protective ring and a third protective ring that is made of metal and that is assembled to a ring top portion of the graphite ring. The third protective ring is spaced apart from an inner edge of the ring top portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:長晶設備</p>
        <p type="p">100:熱場機構</p>
        <p type="p">1:內筒</p>
        <p type="p">11:石墨筒體</p>
        <p type="p">111:筒頂部</p>
        <p type="p">12:第一保護環</p>
        <p type="p">121:第一遮蔽段</p>
        <p type="p">122:第一內壁段</p>
        <p type="p">2:上蓋</p>
        <p type="p">21:石墨蓋體</p>
        <p type="p">211:內側部</p>
        <p type="p">22:第二保護環</p>
        <p type="p">221:第二遮蔽段</p>
        <p type="p">222:第二內壁段</p>
        <p type="p">2221:上延區塊</p>
        <p type="p">2222:下延區塊</p>
        <p type="p">3:上環</p>
        <p type="p">31:石墨環體</p>
        <p type="p">311:環頂部</p>
        <p type="p">32:第三保護環</p>
        <p type="p">321:第三遮蔽段</p>
        <p type="p">322:第三內壁段</p>
        <p type="p">200:爐體</p>
        <p type="p">300:坩堝</p>
        <p type="p">G1:第一環形間隙</p>
        <p type="p">G2:第二環形間隙</p>
        <p type="p">G3:第三環形間隙</p>
        <p type="p">H:高度方向</p>
        <p type="p">W:寬度方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="376" publication-number="202616233">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616233</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138592</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>選物販賣機之捲線緩衝機構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250106B">G07F17/32</main-classification>
        <further-classification edition="200601120250106B">G07F9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飛騰精密科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林紹宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種選物販賣機之捲線緩衝機構，包含一轉動板及一復位構件，該轉動板具有一樞接端及一樞擺端，該樞接端係以該樞擺端相對於該樞接端而得以樞擺的方式樞接於選物販賣機之捲線裝置之一基座，該捲線裝置的一第一滑輪設置在該樞擺端，該復位構件連接在該轉動板與該基座之間，而對該樞擺端施加朝一樞擺初始位置樞擺復位的復位力，以對該轉動板的樞擺運動提供緩衝，減低該捲線裝置在運作時的該捲線裝置之一控制線的振動。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:捲線裝置</p>
        <p type="p">11:基座</p>
        <p type="p">12:捲線輪</p>
        <p type="p">13:第一滑輪</p>
        <p type="p">14:第二滑輪</p>
        <p type="p">15:過線管</p>
        <p type="p">16:控制線</p>
        <p type="p">2:捲線緩衝機構</p>
        <p type="p">21:轉動板</p>
        <p type="p">211:樞接端</p>
        <p type="p">212:樞擺端</p>
        <p type="p">22:復位構件</p>
        <p type="p">231:緩衝塊</p>
        <p type="p">232:緩衝彈性構件</p>
        <p type="p">241:樞擺滑塊</p>
        <p type="p">242:樞擺導軌</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="377" publication-number="202615128">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615128</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138593</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>洗牌機撥牌機構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">A63F1/12</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>天下數位科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種洗牌機撥牌機構包含：一左撥牌輪，以自左側牌室朝中央牌室的方向旋轉的方式對應配置在一洗牌機的左側牌室下側，左撥牌輪之輪面凸伸形成有一左撥牌棘齒部；以及一右撥牌輪，以自右側牌室朝中央牌室的方向旋轉的方式對應配置在洗牌機的右側牌室下側，右撥牌輪之輪面係凸伸形成有一右撥牌棘齒部，以藉由左撥牌輪及右撥牌輪的旋轉，將左側牌室及右側牌室中的遊戲牌交錯地撥向中央牌室，而進行洗牌。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">100:洗牌機撥牌機構</p>
        <p type="p">1:左撥牌輪</p>
        <p type="p">11:左撥牌棘齒部</p>
        <p type="p">2:右撥牌輪</p>
        <p type="p">21:右撥牌棘齒部</p>
        <p type="p">3:左送牌輪</p>
        <p type="p">4:右送牌輪</p>
        <p type="p">C:遊戲牌</p>
        <p type="p">S:洗牌機</p>
        <p type="p">S1:左側牌室</p>
        <p type="p">S2:右側牌室</p>
        <p type="p">S3:中央牌室</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="378" publication-number="202615129">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615129</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138594</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>洗牌機壓牌機構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">A63F1/12</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>天下數位科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種洗牌機壓牌機構，包含：一壓牌構件、一出牌速率感測器、及一驅動單元，壓牌構件包括可旋轉地設置在側牌室的一壓牌臂以及隨壓牌臂的旋轉而在側牌室下壓移動的一壓牌輪，出牌速率感測器設置在洗牌機中而感測自側牌室出牌至中央牌室的出牌速率，驅動單元耦接於出牌速率感測器且連接於壓牌構件，驅動單元經配置而在出牌速率出現異常時驅動壓牌構件執行一預設壓牌動作，以使遊戲牌之洗牌保持穩定。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">100:洗牌機壓牌機構</p>
        <p type="p">1:壓牌構件</p>
        <p type="p">11:壓牌臂</p>
        <p type="p">12:壓牌輪</p>
        <p type="p">2:出牌速率感測器</p>
        <p type="p">3:驅動單元</p>
        <p type="p">D12:停頓時間</p>
        <p type="p">D23:停頓時間</p>
        <p type="p">K:預定壓牌行程</p>
        <p type="p">K1:下壓子行程</p>
        <p type="p">K2:下壓子行程</p>
        <p type="p">K3:下壓子行程</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="379" publication-number="202614938">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614938</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138595</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>架橋調節式固定皮帶扣</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241030B">A44B11/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳錫鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳錫鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連阿長</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種架橋調節式固定皮帶扣，其結構主要包含有：皮帶扣座、第一架橋、凸掣、彈性元件、飾板控件、以及第二架橋…等元件所構成，其中的皮帶扣座的中央處樞設有能轉動調節的第一架橋，且該第一架橋延伸有凸掣，該凸掣與該皮帶扣座之間設置有彈性元件，能供該第一架橋與該凸掣得以彈性復位用，而該飾板控件連結設置於該皮帶扣座的一側，該飾板控件的另一側設置有第二架橋，當皮帶由該第二架橋穿設第一架橋至適當位置時，該彈性元件會連動該第一架橋復位，使該凸掣頂抵該皮帶呈固定；若該皮帶再次進行調節時，則須配合該第一架橋推動讓該凸掣向下呈位頂抵狀態，藉以進行皮帶順暢的調節動作，整體利用架橋連動凸掣配合彈性元件的復位作用，能可實現皮帶的快速固定與鬆脫，藉此提升整體的操作便利性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(10):皮帶扣座</p>
        <p type="p">(11):第一架橋</p>
        <p type="p">(111):凸掣</p>
        <p type="p">(112):彈性元件</p>
        <p type="p">(20):飾板控件</p>
        <p type="p">(21):第二架橋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="380" publication-number="202616862">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616862</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138612</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體元件及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10D62/10</main-classification>
        <further-classification edition="202501120250102B">H10D48/00</further-classification>
        <further-classification edition="202501120250102B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻揚半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON YOUNG SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張兆易</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHAO-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體元件包括基材、磊晶層、井區、介電層、閘極電極層以及源極接墊。基材包括鄰接的陣列區與周邊區。磊晶層位於基材上方。井區位於磊晶層中。介電層位於磊晶層上方且位於陣列區與周邊區上方。閘極電極層位於介電層上方且位於陣列區與周邊區上方。閘極電極層具有至少一開口位於周邊區上方。源極接墊位於閘極電極層上方並自陣列區上方延伸至周邊區上方。源極接墊具有至少一第一延伸部位經由閘極電極層的所述至少一開口向下延伸至井區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a substrate, an epitaxial layer, a well, a dielectric layer, a gate electrode layer, and a source pad. The substrate includes an array region and a peripheral region adjacent to each other. The epitaxial layer is over the substrate. The well is in the epitaxial layer. The dielectric layer is over the epitaxial layer and over the array region and the peripheral region. The gate electrode layer is over the dielectric layer and over the array region and the peripheral region. The gate electrode layer has at least one opening over the peripheral region. The source pad is over the gate electrode layer and extends from the array region to the peripheral region. The source pad has at least one portion extending downward to the well through the at least one opening of the gate electrode layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體元件</p>
        <p type="p">100:基材</p>
        <p type="p">102:磊晶層</p>
        <p type="p">104,110:井區</p>
        <p type="p">106:源極摻雜區</p>
        <p type="p">108:體接觸摻雜區</p>
        <p type="p">112,112a,112b,112c:第一介電層</p>
        <p type="p">114,114a,114b,114c:閘極電極層</p>
        <p type="p">116,116a,116b,116c:第二介電層</p>
        <p type="p">118:源極接墊</p>
        <p type="p">118a,118b,118c:延伸部位</p>
        <p type="p">120:閘極接墊</p>
        <p type="p">122:汲極接墊</p>
        <p type="p">A-A’:線段</p>
        <p type="p">AR:陣列區</p>
        <p type="p">PR:周邊區</p>
        <p type="p">SP:接墊區</p>
        <p type="p">TH:孔</p>
        <p type="p">TR:電晶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="381" publication-number="202616913">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616913</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138618</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種彩色太陽能板的印刷結構及其製造方法</chinese-title>
        <english-title>A STRUCTURE OF A COLORED SOLAR PANEL AND A MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10F77/40</main-classification>
        <further-classification edition="202501120250102B">H10F19/00</further-classification>
        <further-classification edition="202501120250102B">H10F71/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖宸賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHEN XIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>睿田能源有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖宸賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHEN XIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭朋深</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示了一種彩色太陽能板的印刷結構及其製造方法，其結構係由C.M.Y.三原色疊印、G.C.R.灰色置換及鏤空設計所組成，係選用太陽能板基底設計、鏤空設計結構與C.M.Y.三原色油墨疊印技術與G.C.R.灰色置換技術相互結合的結構，其方法係選用黑色或深褐色基底太陽能板；採用C.M.Y.三原色係指青色(Cyan)、洋紅色(Magenta)、黃色(Yellow)疊印與GCR灰色置換成黑色的技術；進行鏤空區域設計。以原黑色或深褐色基底太陽能板進行C.M.Y.三原色形成重疊黑色區域處，以鏤空區域設計顯現出黑色或深褐色基底太陽能板的原黑色或深褐色電池，因此減少C.M.Y.三原色油墨層覆蓋量，而提升太陽能板光電轉換效率的結構與方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a printing structure of a colored solar panel and a manufacturing method thereof. The structure is composed of C.M.Y. three primary color overprinting, G.C.R. gray replacement and hollow design. The solar panel base design, hollow design structure and C.M.Y. three primary color ink overprinting technology are selected. The structure combined with G.C.R. gray replacement technology uses black or dark brown base solar panels; the use of C.M.Y. three primary colors refers to the overprinting of cyan, magenta, and yellow and the replacement of GCR gray with black Technology; perform hollow area design. The original black or dark brown base solar panel is used to form an overlapping black area where the C.M.Y. three primary colors form a hollow area design to reveal the original black or dark brown battery of the black or dark brown base solar panel, thereby reducing the coverage of the C.M.Y. three primary color ink layers and improving Structure and method of photoelectric conversion efficiency of solar panels.</p>
      </isu-abst>
      <representative-img>
        <p type="p">A:選擇太陽能板電池板</p>
        <p type="p">B:設計圖案及印刷C.M.Y層</p>
        <p type="p">C:鏤空區域設計</p>
        <p type="p">D:調整鏤空區域比例</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="382" publication-number="202615108">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615108</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138626</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於提供透析液的系統</chinese-title>
        <english-title>SYSTEM FOR PROVIDING DIALYSATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250428B">A61M1/14</main-classification>
        <further-classification edition="202201120250428B">B01F23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商阿瓦克科技私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AWAK TECHNOLOGIES PTE LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝盧爾　文卡塔拉亞　蘇勒沙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELUR VENKATARAYA, SURESHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格里　曼達爾　瑪諾哈爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GORI, MANDAR MANOHAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛格　桑傑　庫瑪爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, SANJAY KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕拉克　馬辛　巴托洛米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAWLAK, MARCIN BARTLOMIEJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許　耀隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOH, YAU LUONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多納迪奧　亞歷山德羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONADIO, ALESSANDRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍　朝方</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AYU, AARON ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多德卡爾　畢彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DODKAL, BIPIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕拉勒　蘇勒什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PALALE, SURESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開總體上涉及一種用於向患者提供透析液的系統。該系統包括透析循環器和排放管線。該排放管線包括用於檢測流體的特性的傳感器和傳感器旁路管線。該透析循環器包括流體入口和流體出口。該系統包括流體連接件和閥，並且透析循環器與流體連接件和閥一起被配置成選擇性地控制沿通過透析循環器、排放管線、傳感器和/或傳感器旁路管線的多個流體流動路徑的流動。本文還公開了一種用於提供滅菌純化水的設備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure generally relates to a system for providing dialysate to a patient. The system comprises a dialysis cycler and a drain line. The drain line comprises sensors for detecting properties of fluid and a sensor bypass line. The dialysis cycler comprises a fluid inlet and a fluid outlet. The system comprises fluid connections and valves, and the dialysis cycler is configured together with the fluid connections and valves to selectively control flow along a plurality of fluid flow paths through the dialysis cycler, drain line, sensors, and/or sensor bypass line. Also disclosed herein is a device for providing sterile purified water.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">102:患者</p>
        <p type="p">110:透析循環器</p>
        <p type="p">112:盒</p>
        <p type="p">120:透析液源</p>
        <p type="p">122:最後填充袋</p>
        <p type="p">124:最後填充袋管線</p>
        <p type="p">130:患者管線</p>
        <p type="p">160:排放管線</p>
        <p type="p">170:傳感器</p>
        <p type="p">180:傳感器旁路管線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="383" publication-number="202615118">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615118</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138631</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>裝療器定位裝置及使用其的近接治療器械</chinese-title>
        <english-title>APPLICATOR SET POSITIONING DEVICE AND BRACHYTHERAPY APPARATUS USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241101B">A61N5/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛教慈濟醫療財團法人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUDDHIST TZU CHI MEDICAL FOUNDATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>花蓮市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪世凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, SHIH-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　嘉慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEW, CHIA HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃淑梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHU-MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MOON-SING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宏益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HON-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱文彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIOU, WEN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳良政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LIANG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝慧苓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, HUI-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石怡婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, YI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許武勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, WU-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉信金</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種裝療器定位裝置至少包含：一升降機構；以及一配接器，固定於升降機構上，並且用於定位一裝療器。配接器包含：一基底；及一第一平台和一第二平台，連接至基底，其中第一平台和第二平台之間形成一通道，第一平台、第二平台和通道形成一定位結構，通道用於定位裝療器的一縱向構造，第一平台和第二平台用於承載裝療器的一橫向構造，升降機構調整裝療器的高度位置。一種使用上述裝療器定位裝置的近接治療器械亦一併提供。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An applicator set positioning device includes: a lifting mechanism; and an adapter being mounted on the lifting mechanism and for positioning an applicator set. The adapter includes: a base; and a first platform and a second platform connected to the base. A passageway is formed between the first platform and the second platform, and the first platform, the second platform and the passageway form a positioning structure. The passageway positions a longitudinal structure of the applicator set. The first platform and the second platform support a transversal structure of the applicator set. The lifting mechanism adjusts a vertical position of the applicator set. A brachytherapy apparatus using the applicator set positioning device is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">X,Y,Z:座標軸</p>
        <p type="p">10:升降機構</p>
        <p type="p">11:頂部</p>
        <p type="p">12:開口</p>
        <p type="p">13:底座</p>
        <p type="p">20:配接器</p>
        <p type="p">21:基底</p>
        <p type="p">22:第一平台</p>
        <p type="p">23:第二平台</p>
        <p type="p">24:通道</p>
        <p type="p">100:裝療器定位裝置</p>
        <p type="p">200:裝療器</p>
        <p type="p">201:末端</p>
        <p type="p">202:輸入端</p>
        <p type="p">210:縱向構造</p>
        <p type="p">220:橫向構造</p>
        <p type="p">230:第一裝療管</p>
        <p type="p">240:第二裝療管</p>
        <p type="p">250:第三裝療管</p>
        <p type="p">260:輔助固定構造</p>
        <p type="p">300:近接式治療器械</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="384" publication-number="202615246">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615246</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138638</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防眩膜</chinese-title>
        <english-title>ANTI-GLARE FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120241016B">B32B7/023</main-classification>
        <further-classification edition="201501120241016B">G02B1/111</further-classification>
        <further-classification edition="200601120241016B">C09D133/08</further-classification>
        <further-classification edition="202001120241016B">C08J7/04</further-classification>
        <further-classification edition="200601120241016B">C08K3/36</further-classification>
        <further-classification edition="200601120241016B">C08J11/00</further-classification>
        <further-classification edition="202201120241016B">B09B3/00</further-classification>
        <further-classification edition="200601120241016B">B29D7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明基材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENQ MATERIALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈玉倢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, YU-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳慶煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHING-HUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, KUO-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡冠彣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種防眩膜，其包含一再生PET基材及一設於再生PET基材上的防眩塗層，其中該再生PET包含至少50%的回收PET樹脂，且該防眩塗層包含一丙烯酸系黏結劑樹脂及複數無定形無機微粒子。本發明之防眩膜由該等無定形無機微粒子在該防眩塗層表面形成一凹凸表面，可有效的遮蔽再生PET膜材中的雜質顆粒及/或微氣泡，以應用於顯示器中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An anti-glare film is disclosed, which comprises a recycled polyethylene terephthalate substrate and an anti-glare coating layer on the recycled PET substrate. The recycled PET substrate contains at least 50% recycled PET resin, and the anti-glare coating layer includes an acrylate binder resin and a plurality of amorphous inorganic microparticles. The disclosed anti-glare film has a concave-convex surface formed on the surface of the anti-glare coating layer by the amorphous inorganic microparticles to effectively shield impurity particles and/or microbubbles in the recycled PET substrate for being used in display devices.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="385" publication-number="202615219">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615219</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138639</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>棘輪扭力扳手之止晃膠環結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241224B">B25B13/46</main-classification>
        <further-classification edition="200601120241224B">B25B23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐梓菘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>南投縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐梓菘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱國雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種棘輪扭力扳手之止晃膠環結構，該扳手係由一具插接軸柱之棘輪驅動頭及一具中空連接端及扭力調整鈕之握柄所組成，其中，於棘輪驅動頭插接軸柱之插孔兩側，開設有二道環缺槽，據以供兩止晃膠環之套設，從而得配合一插銷及一扣環而與握柄之對應連接端形成緊密之結合狀態，進而有效杜絕該兩對接構件間所可能發生之不良晃動現象為其特徵者。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">20:扳手</p>
        <p type="p">30:棘輪驅動頭</p>
        <p type="p">31:插接軸柱</p>
        <p type="p">32:工件作用部</p>
        <p type="p">33:棘輪作用方向切換鈕</p>
        <p type="p">34:插孔</p>
        <p type="p">35:環缺槽</p>
        <p type="p">40:握柄</p>
        <p type="p">41:連接端</p>
        <p type="p">42:扭力調整鈕</p>
        <p type="p">43:貫穿插孔</p>
        <p type="p">50:隔離膠環</p>
        <p type="p">60:止晃膠環</p>
        <p type="p">70:插銷</p>
        <p type="p">71:扣環</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="386" publication-number="202615268">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615268</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138641</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於偵測能源站之異常行為之系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR DETECTING ABNORMAL BEHAVIOR IN AN ENERGY STATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120241028B">B60L53/68</main-classification>
        <further-classification edition="202201120241028B">G06V10/40</further-classification>
        <further-classification edition="202201120241028B">G06V10/764</further-classification>
        <further-classification edition="202201120241028B">G06V10/82</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王智純</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王智純</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於偵測能源站之異常行為之系統包括成像設備、邊緣電腦設備及雲端運算設備。成像設備用於生成影像資料集。邊緣電腦設備用於透過過濾模組自影像資料集中過濾並取得涉及車輛及/或使用者之影像資料，並透過第一分析模組透過神經網路模型根據影像資料辨識車輛及/或使用者之第一行為資料。雲端運算設備用於在第一行為資料屬於異常行為時，透過輸出模組根據第一行為資料及影像資料產生警示訊息和影像串流訊息，並透過運算模組根據對應第一行為資料的回饋訊息指示更新神經網路模型。用於偵測能源站之異常行為之方法可藉由上述系統實現。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for detecting abnormal behavior in an energy station includes an imaging apparatus, an edge computer apparatus, and a cloud computing apparatus. The imaging apparatus is used to generate image dataset. The edge computing apparatus is used to filter out image data related to vehicle and/or user via a filter module, and identify a first behavior data of the vehicle and/or the user via a first analysis module using a neural network model. The cloud computing apparatus is used to generate an alert message and an imaging streaming message according to the first behavior data and the image data via an output module when the first behavior data pertain to an abnormal behavior, and instruct to update the neural network model via a computing module according to a feedback message correspond to the first behavior data. A method for detecting abnormal behavior in an energy station may be realized using the system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:用於偵測能源站之異常行為之系統</p>
        <p type="p">100:成像設備</p>
        <p type="p">200:邊緣電腦設備</p>
        <p type="p">300:幫浦設備</p>
        <p type="p">400:雲端運算設備</p>
        <p type="p">500:用戶管理平台</p>
        <p type="p">600:建模設備</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="387" publication-number="202616414">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616414</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138643</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶圓輸送量測系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241115B">H01L21/67</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>微勁科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>M U TECHNOLOGIES CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程心宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施國彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊仁和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種晶圓輸送量測系統，適用一界定出一缺口的晶圓，且包含一晶圓盒、一機台、一輸送單元、一第一量測單元及一第二量測單元。該晶圓盒包括一呈中空狀的載盤，該載盤具有一界定出一開口的盤體，及一固接於該盤體且形狀對應於該缺口的定位銷。該機台包括一載盤托架。該輸送單元用於搬運該晶圓。該第一量測單元的第一處理模組用於控制一旋轉平台帶動該晶圓轉動至一預定位置。該第二量測單元的一第二影像擷取模組用於針對該晶圓與該載盤生成一第二擷取圖像。本發明藉由再次確認該定位銷與該缺口之間的相對位置，以提高對位精準度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:機台</p>
        <p type="p">20:托架區組</p>
        <p type="p">21:集中區組</p>
        <p type="p">22:接收托架</p>
        <p type="p">23:載盤托架</p>
        <p type="p">24:底座托架</p>
        <p type="p">25:頂蓋托架</p>
        <p type="p">26:載盤集中區</p>
        <p type="p">27:底座集中區</p>
        <p type="p">28:頂蓋集中區</p>
        <p type="p">3:輸送單元</p>
        <p type="p">31:夾持模組</p>
        <p type="p">311:夾持滑軌</p>
        <p type="p">312:夾持滑台</p>
        <p type="p">313:取料夾具</p>
        <p type="p">33:機械手臂模組</p>
        <p type="p">331:操作臂</p>
        <p type="p">4:第一量測單元</p>
        <p type="p">40:旋轉平台</p>
        <p type="p">D1:前後方向</p>
        <p type="p">D2:左右方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="388" publication-number="202615770">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615770</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138648</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>活塞式高壓空氣壓縮機節能控制系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">F04B49/06</main-classification>
        <further-classification edition="200601120241230B">F04B49/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>復記工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU JIH COMPRESSOR INDUSTRIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許記祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種活塞式高壓空氣壓縮機節能控制系統，係利用高效永磁同步伺服電機替代傳統感應電機，並透過多功能驅動器控制電機運行，而動力控制模式可依需求選擇壓差輕重載高低速切換運行，或者是PID恆壓運行無段變速模式，利用永磁同步伺服電機的高效能特性及具備多功能通訊驅動器的導入，使得設備省電環保、壓力波動趨緩、工作噪音降低，冷卻水用量都可同步大幅減少，對工作環境的改善有相當大的助益；另外也導入通訊型控制人機PLC及驅動器，使得本發明具備遠端監控，遠端檢修及運行狀況採集功能，以因應當前及未來工業升級所需。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">100:高壓空氣壓縮機</p>
        <p type="p">10:曲軸箱</p>
        <p type="p">11:第一加壓缸</p>
        <p type="p">12:第二加壓缸</p>
        <p type="p">111、121:進氣閥</p>
        <p type="p">112、122:排氣閥</p>
        <p type="p">113、123:空氣濾清器</p>
        <p type="p">13:曲軸組</p>
        <p type="p">14:油泵</p>
        <p type="p">15:冷卻系統</p>
        <p type="p">20:永磁同步伺服電機</p>
        <p type="p">30:氣體儲存鋼瓶</p>
        <p type="p">60:溫度感測器</p>
        <p type="p">70:壓力感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="389" publication-number="202615242">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615242</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138650</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>撬頂破壞器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250123B">B30B1/08</main-classification>
        <further-classification edition="200601120250123B">B25F1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法妍有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台震機械工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳峻瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林耿本</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李毓庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張朝坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種撬頂破壞器及其撐開座，包括：一動力單元，包括有轉軸且底側耦接有供電單元；一傳動模組，包括有受轉軸旋轉傳導之斜面轉輪；一泵浦模組，包括抵接於斜面轉輪表面之複數柱塞組並將液壓油傳送至液壓輸出口；一推移模組，包括抵接於液壓輸出口並受液壓力推移之推桿及活塞；一抵頂件，包括連接部、接觸部及其撐開面；一撐開座，包括本體及容置腔，而本體頂側具有外凸體且外凸體內部形成有供抵頂件之接觸部做一容置的收納槽，於本體與外凸體共同形成有複數抵持部，該些抵持部與該撐開面形成有可撐開預定物件之間隙的不同間距。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:動力單元</p>
        <p type="p">2:傳動模組</p>
        <p type="p">21:套筒</p>
        <p type="p">27:斜面轉輪</p>
        <p type="p">3:泵浦模組</p>
        <p type="p">31:柱塞組</p>
        <p type="p">311:抵接座</p>
        <p type="p">312:柱塞</p>
        <p type="p">313:彈簧</p>
        <p type="p">314:圓珠</p>
        <p type="p">315:蓋體</p>
        <p type="p">32:封蓋</p>
        <p type="p">320:液壓輸出口</p>
        <p type="p">4:推移模組</p>
        <p type="p">41:推桿</p>
        <p type="p">42:活塞</p>
        <p type="p">43:彈性件</p>
        <p type="p">5:抵頂件</p>
        <p type="p">51:連接部</p>
        <p type="p">52:接觸部</p>
        <p type="p">521:撐開面</p>
        <p type="p">6:撐開座</p>
        <p type="p">60:容置腔</p>
        <p type="p">61:本體</p>
        <p type="p">611:第四抵持部</p>
        <p type="p">612:第五抵持部</p>
        <p type="p">62:外凸體</p>
        <p type="p">621:收納槽</p>
        <p type="p">622:第一抵持部</p>
        <p type="p">623:敲擊部</p>
        <p type="p">624:第二抵持部</p>
        <p type="p">625:第三抵持部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="390" publication-number="202616794">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616794</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138651</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙軸把手</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241028B">H05K5/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恒昌行精密工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANWIT PRECISION INDUSTRIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾英智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YING-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李毓庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張朝坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種雙軸把手，包括：一基座，其包括有軸孔；一第一樞軸，其穿設於該軸孔中且局部自基座處外露；一擺動軸件，其包括樞接於該第一樞軸外部之本體且該本體可以水平方向旋動90度角，該本體向一側延伸有與該第一樞軸呈垂直方向設置之一第二樞軸；一把手，其包括樞接於該第二樞軸之一銜接體，於該銜接體一側具有供局部外露之該第一樞軸收納的一銜接槽，而該把手可於該第二樞軸處以垂直方向旋動180度角，以避免把手與機架之間產生機構干涉後，同時達到便於將機盒內部的電子組件進行維修或更換作業。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基座</p>
        <p type="p">10:軸孔</p>
        <p type="p">101:第一軸孔</p>
        <p type="p">102:第二軸孔</p>
        <p type="p">11:第一軸座</p>
        <p type="p">111:第一導引面</p>
        <p type="p">112:第一定位槽</p>
        <p type="p">113:第二定位槽</p>
        <p type="p">12:第二軸座</p>
        <p type="p">121:第二導引面</p>
        <p type="p">122:第三定位槽</p>
        <p type="p">123:第四定位槽</p>
        <p type="p">13:定位空間</p>
        <p type="p">14:座板</p>
        <p type="p">15:限位壁</p>
        <p type="p">16:扣座</p>
        <p type="p">161:扣槽</p>
        <p type="p">162:擋止壁</p>
        <p type="p">2:第一樞軸</p>
        <p type="p">3:擺動軸件</p>
        <p type="p">31:本體</p>
        <p type="p">310:通孔</p>
        <p type="p">32:第二樞軸</p>
        <p type="p">320:圓槽</p>
        <p type="p">33:限位件</p>
        <p type="p">331:頭部</p>
        <p type="p">332:定位桿</p>
        <p type="p">4:把手</p>
        <p type="p">41:銜接體</p>
        <p type="p">410:第三軸孔</p>
        <p type="p">411:定位組件</p>
        <p type="p">4111:定位珠</p>
        <p type="p">4112:彈性件</p>
        <p type="p">412:延伸體</p>
        <p type="p">413:固定槽</p>
        <p type="p">414:擋止塊</p>
        <p type="p">42:鎖扣臂</p>
        <p type="p">421:銜接槽</p>
        <p type="p">4210:透孔</p>
        <p type="p">4211:磁性體</p>
        <p type="p">422:導斜面</p>
        <p type="p">423:定位部</p>
        <p type="p">43:操作部</p>
        <p type="p">430:組裝空間</p>
        <p type="p">431:勾扣部</p>
        <p type="p">432:立板</p>
        <p type="p">4320:穿槽</p>
        <p type="p">4321:插銷</p>
        <p type="p">44:旋扣</p>
        <p type="p">440:穿孔</p>
        <p type="p">442:扣合部</p>
        <p type="p">443:解扣部</p>
        <p type="p">45:旋動復位件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="391" publication-number="202615810">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615810</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138652</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水冷熱交換排管結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241217B">F28D7/08</main-classification>
        <further-classification edition="200601120241217B">F28D7/16</further-classification>
        <further-classification edition="200601120241217B">F04D25/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>琪達實業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JONDER INDUSTRIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王建昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIEN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張朝坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江明志</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係為一種水冷熱交換排管結構，係包括有設置於一牆體的預設風扇處之一承載架及一降溫排管模組，其中，該承載架之表面為設有複數導風孔，該降溫排管模組為包括有組裝於該承載架頂部之降溫管體，而該降溫管體一側為設有與提供冰水輸送之一輸水閥連接之進水部，且該進水部相對另側為設有與一熱水回收槽相連接之出水部，再於該降溫管體之間為具有保持適當間距以避免形成風阻的複數間隙，其中該降溫管體可為多數層，提供內部冰水吸收周遭熱氣後，再將該降溫管體內升溫後的水排出，以令周圍降溫後的空氣隨著該預設風扇吹入一預設室內空間內部，進而替代冷氣進行室內降溫，以達到節省電力之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:承載架</p>
        <p type="p">10:導風孔</p>
        <p type="p">11:支撐部</p>
        <p type="p">12:擋牆</p>
        <p type="p">2:降溫排管模組</p>
        <p type="p">21:降溫管體</p>
        <p type="p">211:進水部</p>
        <p type="p">212:出水部</p>
        <p type="p">25:蓄水槽</p>
        <p type="p">251:輸水管體</p>
        <p type="p">4:預設風扇</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="392" publication-number="202615753">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615753</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138656</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>曬衣裝置</chinese-title>
        <english-title>CLOTHESHORSE DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241031B">D06F57/00</main-classification>
        <further-classification edition="200601120241031B">D06F57/12</further-classification>
        <further-classification edition="200601120241031B">D06F53/00</further-classification>
        <further-classification edition="200601120241031B">A47G25/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立高雄科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL KAOHSIUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林龍吟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, LUNG-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴宏濱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, HUNG-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種曬衣裝置，其包含裝置動力件、曬衣架件及二活動連桿組。裝置動力件固定於空間的頂面。裝置動力件的兩端或鄰近於兩端處分別具有可收納的一線體。二線體的一端分別固定於曬衣架件。二活動連桿組對角方向鏡射式地配置於裝置動力件與曬衣架件之間。其中，活動連桿組包含第一連桿、第二連桿及第三連桿。第一連桿的一端樞設於裝置動力件。第一連桿的另一端樞設於第二連桿的一端。該第二連桿的另一端樞設於曬衣架件。第三連桿的一端樞設於第二連桿的中點。第三連桿的另一端可滑動地設置於曬衣架件。其中，第三連桿的長度小於第二連桿的長度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a clotheshorse device, which comprises a device power component, a clotheshorse, and two movable linkage groups. The device power component is fixed to an upper surface of a space. Both ends of the device power component have a retractable wire respectively. One end of the wire is fixed to the clotheshorse. The two movable linkage groups are mirroredly arranged between the device power component and the clotheshorse. The movable linkage group includes a first linkage, a second linkage, and a third linkage. One end of the first linkage is pivotally connected to the device power component, while the other end is pivotally connected to one end of the second linkage. The other end of the second linkage is pivotally connected to the clotheshorse. One end of the third linkage is pivotally connected to a midpoint of the second linkage, and the other end of the third linkage is slidably mounted on the clotheshorse. Wherein, the length of the third linkage is less than the length of the second linkage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:裝置動力件</p>
        <p type="p">10:線體</p>
        <p type="p">15:蓋體</p>
        <p type="p">151:風扇單元</p>
        <p type="p">2:曬衣架件</p>
        <p type="p">21:連接件</p>
        <p type="p">22:滑軌桿</p>
        <p type="p">221:滑軌</p>
        <p type="p">23:曬衣桿</p>
        <p type="p">24:連接連桿組</p>
        <p type="p">3:活動連桿組</p>
        <p type="p">31:第一連桿</p>
        <p type="p">32:第二連桿</p>
        <p type="p">33:第三連桿</p>
        <p type="p">34:滑塊</p>
        <p type="p">DL:長度方向</p>
        <p type="p">DW:寬度方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="393" publication-number="202616198">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616198</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138664</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自選商品編輯超量處置之裝置、方法與電腦程式產品</chinese-title>
        <english-title>DEVICE, METHOD, AND COMPUTER PROGRAM PRODUCT FOR EXCESS DISPOSAL OF EDITING CUSTOM WATCHLISTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250102B">G06Q40/04</main-classification>
        <further-classification edition="202301120250102B">G06Q30/06</further-classification>
        <further-classification edition="201301120250102B">G06F3/048</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三竹資訊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITAKE INFORMATION CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱宏哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, HUNG CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鼎堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自選商品編輯超量處置之裝置、方法與電腦程式產品。該裝置包含：記憶體、螢幕及一或多個處理器，記憶體儲存應用程式，應用程式包含：自選編輯與超量處置模組，及，自選報價模組。自選編輯與超量處置模組，依據商品搜尋指令或商品選擇指令將對應的金融商品儲存於記憶體，顯示選擇群組元件並讀取金融商品，選擇群組元件包含呈現複數個自選群組，檢查自選群組各自對應的上限數量以及自選群組各自對應的當前數量，當自選群組尚未達到上限數量且未包含金融商品時顯示對應的選擇按鍵，接收選擇按鍵所產生的設定標的群組指令以將金融商品加至被選擇的自選群組，當自選群組已包含金融商品時顯示對應的商品重複標籤，當自選群組已達上限數量且未包含金融商品時顯示對應的取代商品按鍵，接收取代商品按鍵所產生的取代商品指令以自被選擇的自選群組選擇既有自選商品並以金融商品取代。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure is related to a device, method, and computer program product for excess disposal of editing custom watchlists of a stock quoting software. The device includes a memory, a screen, and one or more processors. The memory stores an application program. The application program includes a watchlist editing and excess disposal module, which allows user to add a new stock to any group of a watchlist even it is full.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:應用程式</p>
        <p type="p">22:登入驗證模組</p>
        <p type="p">24:自選編輯與超量處置模組</p>
        <p type="p">26:自選報價模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="394" publication-number="202616691">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616691</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138665</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於多輸入多輸出正交分頻多工資料檢測中逐層設定簡潔搜尋區域的通訊裝置及方法</chinese-title>
        <english-title>COMMUNICATION DEVICE AND METHOD USED TO LOCATE PER-LAYER COMPACT SEARCH REGIONS FOR MIMO DETECTION IN A MIMO-OFDM SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">H04J1/12</main-classification>
        <further-classification edition="200601120241104B">H04J11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, CHUN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種通訊裝置，包含有一層間干擾消除電路，用來消除一第一觀察訊號的一第一層間干擾，以產生一第一干擾消除訊號；一第一決定電路，耦接於該層間干擾消除電路，用來根據該第一干擾消除訊號，決定一第一搜尋區域的一第一中心；一第二決定電路，耦接於該第一決定電路，用來根據一第一高斯中斷機率及一第一訊雜比，決定該第一搜尋區域的一第一大小；以及一第三決定電路，耦接於該第二決定電路，用來根據該第一搜尋區域的該第一大小，決定該第一干擾消除訊號的至少一第一候選符元的一第一數量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A communication device comprises an inter-layer interference (ILI) removing circuit configured to remove first ILI from a first observed signal to generate a first interference-removed signal; a first determination circuit, coupled to the ILI removing circuit and configured to determine a first center of a first search region (SR) according to the first interference-removed signal; a second determination circuit, coupled to the first determination circuit and configured to determine a first size of the first SR according to a first Gaussian outage probability and a first signal-to-noise ratio (SNR); and a third determination circuit, coupled to the second determination circuit and configured to determine a first number of at least one first candidate symbol for the first interference-removed signal according to the first size of the first SR.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:通訊系統</p>
        <p type="p">210:層間干擾消除電路</p>
        <p type="p">220:第一決定電路</p>
        <p type="p">230:第二決定電路</p>
        <p type="p">240:第三決定電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="395" publication-number="202616598">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616598</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138673</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體元件</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">H02H9/02</main-classification>
        <further-classification edition="200601120241104B">H01L23/58</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>積亞半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PROASIA SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭明奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, MING-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WEN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁國隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體元件，其包含一基板、一電晶體及一緩衝電路。電晶體與緩衝電路設置於同一基板上，緩衝電路與電晶體電性相連。緩衝電路具有一多晶矽層及一介電層，二者相鄰設置而電性串連。其中，多晶矽層電性連接至電晶體之一源極，介電層電性連接至電晶體之一汲極，使多晶矽層成為一電阻且介電層成為一電容，使緩衝電路成為一電阻電容緩衝電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device is provided. The semiconductor device comprises a substrate, a transistor and a snubber circuit. The transistor and the snubber circuit are disposed on the same substrate, and are electrically connected. The snubber circuit has a polycrystalline silicon layer and a dielectric layer, which are adjacently arranged and electrically connected in series. The polycrystalline silicon layer is electrically connected to a source of the transistor, and the dielectric layer is electrically connected to a drain of the transistor so that the polycrystalline silicon layer acts as a resistor, the dielectric layer acts as a capacitor and the snubber circuit acts as an RC snubber circuit</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電晶體</p>
        <p type="p">10:基板</p>
        <p type="p">20:磊晶層</p>
        <p type="p">22:P型井區</p>
        <p type="p">30:閘極</p>
        <p type="p">35:閘極金屬</p>
        <p type="p">40:源極</p>
        <p type="p">50:層間介電層</p>
        <p type="p">60:源極金屬</p>
        <p type="p">70:汲極金屬</p>
        <p type="p">80&lt;sub&gt;A&lt;/sub&gt;:介電層</p>
        <p type="p">80&lt;sub&gt;B&lt;/sub&gt;:介電層</p>
        <p type="p">90&lt;sub&gt;A&lt;/sub&gt;:多晶矽層</p>
        <p type="p">90&lt;sub&gt;B&lt;/sub&gt;:多晶矽層</p>
        <p type="p">100:功率電晶體元件</p>
        <p type="p">A:緩衝電路</p>
        <p type="p">B:緩衝電路</p>
        <p type="p">C&lt;sub&gt;A&lt;/sub&gt;:電容</p>
        <p type="p">C&lt;sub&gt;B&lt;/sub&gt;:電容</p>
        <p type="p">R&lt;sub&gt;A&lt;/sub&gt;:電阻</p>
        <p type="p">R&lt;sub&gt;B&lt;/sub&gt;:電阻</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="396" publication-number="202616216">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616216</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138688</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像產生方法與影像處理系統</chinese-title>
        <english-title>IMAGE GENERATION METHOD AND IMAGE PROCESSING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250102B">G06T7/50</main-classification>
        <further-classification edition="202401120250102B">G06T3/4046</further-classification>
        <further-classification edition="201101120250102B">G06T15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚勝雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, SHENG-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹淩帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, LING-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種影像產生方法與影像處理系統。所述方法包括：建立多個影像處理模型，其分別對應於多個候選影像尺寸；取得多個訓練資料集，其分別對應於所述多個候選影像尺寸；使用所述多個訓練資料集分別訓練所述多個影像處理模型；偵測輸入影像的第一影像尺寸；根據第一影像尺寸，從所述多個影像處理模型中決定目標影像處理模型；透過目標影像處理模型處理輸入影像，以產生對應於輸入影像的深度資訊；以及根據深度資訊，產生第一輸出影像與第二輸出影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image generation method and an image processing system are disclosed. The method includes: establishing a plurality of image processing models respectively corresponding to a plurality of candidate image sizes; obtaining a plurality of training data sets respectively corresponding to the candidate image sizes; using the training data sets to train the image processing models respectively; detecting a first image size of an input image; determining a target image processing model from the image processing models according to the first image size; processing the input image through the target image processing model to generate depth information corresponding to the input image; and generating a first output image and a second output image according to the depth information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S601~S607:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="397" publication-number="202615544">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615544</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138693</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>遙爪寡聚(2,6-二甲基苯醚)、其製備方法、固化物及銅箔基板的製備方法</chinese-title>
        <english-title>TELECHELIC OLIGO-(2,6-DIMETHYL PHENYLENE ETHER), PREPARATION METHOD THEREOF, CURABLE PRODUCT AND MANUFACTURING METHOD OF COPPER CLAD LAMINATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241220B">C08G65/48</main-classification>
        <further-classification edition="200601120241220B">C08L71/12</further-classification>
        <further-classification edition="200601120241220B">C08K5/14</further-classification>
        <further-classification edition="200601120241220B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中興大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHUNGHSING UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林慶炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHING-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭祺興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHI-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種遙爪寡聚(2,6-二甲基苯醚)，其具有式(I)所示之一結構，式(I)中各符號如說明書中所定義者。本發明的遙爪寡聚(2,6-二甲基苯醚)是以一雙酚及2,6-二甲基酚進行一氧化聚合反應後，再進行一官能化反應所製備，且其可應用於固化物和銅箔基板的製備方法。藉此，本發明的固化物具有良好的電氣性質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a telechelic oligo-(2,6-dimethylphenyl ether) that has a structure represented by formula (I), in which each symbol is as defined in the specification. The telechelic oligomer (2,6-dimethylphenyl ether) of the present disclosure is manufactured through an oxidation-polymerization reaction followed by a functionalization, wherein the oxidation-polymerization is carried out with a bisphenol and a 2,6-dimethylphenol, and the telechelic oligomer (2,6-dimethylphenyl ether) can be applied to a curable product and a manufacturing method of a copper clad laminate. Therefore, the present disclosure provides a curable product having good electrical properties.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:遙爪寡聚(2,6-二甲基苯醚)的製備方法</p>
        <p type="p">110,120,130:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="398" publication-number="202616512">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616512</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138711</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>三維整合式晶片模組</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241029B">H01L23/535</main-classification>
        <further-classification edition="200601120241029B">H01L23/488</further-classification>
        <further-classification edition="200601120241029B">H01L23/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芯力威半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THINCHIPWAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱志威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, TZU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種三維整合式晶片模組由下至上包括下層模組、下重佈線膜層(下稱RDL)、中層模組、中RDL及上基板。下層模組具設有凸塊的下絕緣層、疊於下絕緣層並設有下銅柱的下介電層及間隔埋於下介電層的下層晶片。下層晶片由下而上具接觸凸塊的下內連線層、下主動層及帶有下導通孔(下稱TSV)的下基板。下RDL連接下銅柱與下TSV。中層模組包括疊於下RDL的第一混合鍵合層、疊於第一混合鍵合層並設有中銅柱的中介電層及複數運算晶片。運算晶片埋於中介電層且由下而上具下混合鍵合層、RDL、帶有中TSV的中基板、中主動層及中內連線層。中基板厚度與中TVS孔徑皆小於0.5μm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:下層模組</p>
        <p type="p">21:下絕緣層</p>
        <p type="p">210:下開口</p>
        <p type="p">22:下介電層</p>
        <p type="p">220:下介電穿孔</p>
        <p type="p">23:下銅柱</p>
        <p type="p">24:下層晶片</p>
        <p type="p">25:微凸塊</p>
        <p type="p">3:下重佈線膜層</p>
        <p type="p">4:中層模組</p>
        <p type="p">41:第一混合鍵合層</p>
        <p type="p">411:中絕緣層</p>
        <p type="p">4110:中開口</p>
        <p type="p">412:第一接點</p>
        <p type="p">42:中介電層</p>
        <p type="p">420:中介電穿孔</p>
        <p type="p">43:中銅柱</p>
        <p type="p">44:運算晶片</p>
        <p type="p">5:中重佈線膜層</p>
        <p type="p">6:上基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="399" publication-number="202616513">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616513</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138712</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>三維整合式晶片模組</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241029B">H01L23/535</main-classification>
        <further-classification edition="200601120241029B">H01L23/488</further-classification>
        <further-classification edition="200601120241029B">H01L23/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芯力威半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THINCHIPWAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱志威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, TZU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種三維整合式晶片模組包含一中介重佈線路層，及位於該中介重佈線路層彼此反向的一底面及一頂面的一下層半導體模組，及一上層半導體模組。該中介重佈線路層用於電連接該下層半導體模組及該上層半導體模組，並可供對外電連接。該下層半導體模組包括一下介電層、一下絕緣層、多個下銅柱、多個焊錫凸塊及由多個運算晶片所構成的一下層晶片單元。該等運算晶片皆具有至少一微型矽通孔，且該微型矽通孔的孔徑介於100至500nm。該上層半導體模組包括一疊置於該中介重佈線路層的頂面的上介電層，及彼此間隔地埋設於該上介電層中的複數上層晶片。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:下層半導體模組</p>
        <p type="p">21:下介電層</p>
        <p type="p">22:下絕緣層</p>
        <p type="p">221:開口</p>
        <p type="p">23:下銅柱</p>
        <p type="p">24:下層晶片單元</p>
        <p type="p">25:運算晶片</p>
        <p type="p">251:下重佈線層</p>
        <p type="p">252:微型矽通孔</p>
        <p type="p">253:下基板</p>
        <p type="p">254:下主動層</p>
        <p type="p">255:下內連線層</p>
        <p type="p">256:介電連結層</p>
        <p type="p">257:第二矽基板</p>
        <p type="p">258:矽通孔</p>
        <p type="p">26:焊錫凸塊</p>
        <p type="p">3:上層半導體模組</p>
        <p type="p">31:上介電層</p>
        <p type="p">32:混合鍵結層</p>
        <p type="p">321:絕緣基底</p>
        <p type="p">322:導電墊</p>
        <p type="p">33:上層晶片</p>
        <p type="p">331:上內連線層</p>
        <p type="p">332:上主動層</p>
        <p type="p">333:上基板</p>
        <p type="p">4:中介重佈線路層</p>
        <p type="p">5:頂介電連結層</p>
        <p type="p">6:檔片晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="400" publication-number="202616514">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616514</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138713</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>三維整合式晶片模組</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241029B">H01L23/535</main-classification>
        <further-classification edition="200601120241029B">H01L23/488</further-classification>
        <further-classification edition="200601120241029B">H01L23/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>開曼群島商奈興科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEXTHIN TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱志威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, TZU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉人豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, JEN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種三維整合式晶片模組包含一中介重佈線路層，及位於該中介重佈線路層彼此反向的一底面及一頂面的一下層半導體模組，及一上層記憶體模組。該中介重佈線路層用於電連接該下層半導體模組及該上層記憶體模組，並可供對外電連接。該下層半導體模組包括一下介電層、一下絕緣層、多個下銅柱、多個焊錫凸塊及由多個運算晶片所構成的一下層晶片單元。該等運算晶片皆具有至少一微型矽通孔，且該微型矽通孔的孔徑介於100至500nm。該上層記憶體模組包括一疊置於該中介重佈線路層的頂面的上密封層，及彼此間隔的多個堆疊記憶體單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:下層半導體模組</p>
        <p type="p">21:下介電層</p>
        <p type="p">22:下絕緣層</p>
        <p type="p">221:開口</p>
        <p type="p">23:下銅柱</p>
        <p type="p">24:下層晶片單元</p>
        <p type="p">25:運算晶片</p>
        <p type="p">251:下重佈線層</p>
        <p type="p">252:微型矽通孔</p>
        <p type="p">253:下基板</p>
        <p type="p">254:下主動層</p>
        <p type="p">255:下內連線層</p>
        <p type="p">256:介電連結層</p>
        <p type="p">257:第二矽基板</p>
        <p type="p">258:矽通孔</p>
        <p type="p">26:焊錫凸塊</p>
        <p type="p">3:上層記憶體模組</p>
        <p type="p">31:上密封層</p>
        <p type="p">32:混合鍵結層</p>
        <p type="p">321:絕緣基底</p>
        <p type="p">322:導電墊</p>
        <p type="p">33:堆疊記憶體單元</p>
        <p type="p">331:上內連線層</p>
        <p type="p">332:記憶體元件</p>
        <p type="p">333:記憶體</p>
        <p type="p">4:中介重佈線路層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="401" publication-number="202616302">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616302</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138715</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻抗倍增結構及其製造方法</chinese-title>
        <english-title>IMPEDANCE MULTIPLYING STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250512B">H01C17/22</main-classification>
        <further-classification edition="200601120250512B">H01C1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光頡科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIKING TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾冠閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, KUAN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧契佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡朝安</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種阻抗倍增結構及其製造方法，該阻抗倍增結構包含一基板、一第一外電極、一第二外電極、複數個表電阻以及複數個阻抗調整電極，該阻抗倍增結構藉由截斷該複數個阻抗調整電極中的至少一個以調整該阻抗倍增結構的總阻抗值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An impedance multiplying structure and a manufacturing method thereof are provided. The impedance multiplying structure includes a substrate, a first external electrode, a second external electrode, a plurality of surface resistance layers, and a plurality of impedance adjustment electrodes. At least one of the impedance adjustment electrodes is cut off, thereby adjusting a total impedance value of the impedance multiplying structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:阻抗倍增結構</p>
        <p type="p">11:第一表面</p>
        <p type="p">21:第一外電極</p>
        <p type="p">22:第二外電極</p>
        <p type="p">30:表電阻</p>
        <p type="p">40:阻抗調整電極</p>
        <p type="p">41:第一阻抗調整電極</p>
        <p type="p">42:第二阻抗調整電極</p>
        <p type="p">43:第三阻抗調整電極</p>
        <p type="p">50:內保護層</p>
        <p type="p">60:外保護層</p>
        <p type="p">A-A':線</p>
        <p type="p">R1:第一表電阻</p>
        <p type="p">R2:第二表電阻</p>
        <p type="p">R3:第三表電阻</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="402" publication-number="202616618">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616618</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138716</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>時域／時空域三相馬達</chinese-title>
        <english-title>TIME DOMAIN/TIME-SPACE DOMAIN 3-PHASES MOTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">H02K21/24</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美泰萬有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAONE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江國慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, KUO-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江岳峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, YUEH-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種時域-空域三相馬達，包括一對圓盤，分別包含複數磁鐵；三線圈盤，堆疊配置於成對圓盤之間，其中每一線圈盤包含三相線圈配置於其上，且各該三線圈盤的同相線圈之間錯位配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a time-space domain three-phase motor, which includes a pair of discs, each containing a plurality of magnets; and three coil-discs, which are stacked and configurated between the pair of discs, wherein each coil disc includes a three-phase coil arranged thereon. The same phase coils of the three coil-discs are arranged in a displacement manner.</p>
      </isu-abst>
      <representative-img>
        <p type="p">P1:第一相位線圈</p>
        <p type="p">P2:第二相位線圈</p>
        <p type="p">P3:第三相位線圈</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="403" publication-number="202616903">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616903</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138721</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學檢測裝置及光學檢測裝置的製作方法</chinese-title>
        <english-title>OPTICAL DETECTION DEVICE AND MANUFACTURING METHOD OF OPTICAL DETECTION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10F39/15</main-classification>
        <further-classification edition="202501120250102B">H10D99/00</further-classification>
        <further-classification edition="202301120250102B">H04N5/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學檢測裝置包括基板、多個電晶體設置於基板上，多個電晶體的每一個包括一第一電極以及一第一異質半導體層，多個電晶體的每一個的第一電極與第一異質半導體層於基板的法線方向上不重疊。一種光學檢測裝置的製作方法亦被提出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical detection device includes a substrate and a plurality of transistors disposed on the substrate. Each of the plurality of transistors includes a first electrode and a first metal layer. The first electrode of each of the plurality of transistors does not overlap the first metal layer of each of the plurality of transistors in a normal direction of the substrate. A method of manufacturing an optical detection device has also been proposed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:光學檢測裝置</p>
        <p type="p">110:基板</p>
        <p type="p">142、144、147:電極</p>
        <p type="p">C1:補償電容</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">NP1、NP2、NP3、NP4:異質半導體層</p>
        <p type="p">RL:讀取線</p>
        <p type="p">SL1、SL2:掃描線</p>
        <p type="p">T1、T2、T3:電晶體</p>
        <p type="p">Vbias:偏置線</p>
        <p type="p">Vref:參考電源線</p>
        <p type="p">VSS:源極電壓線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="404" publication-number="202615269">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615269</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138723</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電池能源站之火災預警管理方法及其電池能源站</chinese-title>
        <english-title>FIRE WARNING MANAGEMENT METHODS FOR A BATTERY ENERGY STATION, AND BATTERY ENERGY STATIONS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120241025B">B60L53/68</main-classification>
        <further-classification edition="200601120241025B">G08B17/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光陽工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWANG YANG MOTOR CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝欣燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, HSIN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志風</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈怡宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於電池能源站之火災預警管理方法，適用於用以收納且對複數電池進行充電之一電池能源站。首先，利用一煙霧偵測器偵測電池能源站內之煙霧，並利用電池能源站之一第一溫度偵測器偵測一第一溫度。接著，判斷煙霧偵測器是否偵測到煙霧，且第一溫度是否超過一第一臨限值。當煙霧偵測器偵測到煙霧，且第一溫度超過第一臨限值時，產生一警示通知。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Fire warning management methods are provided, which are suitable for a battery energy station used for storing and charging a plurality of batteries. First, a smoke detector is used to detect smoke in the battery energy station, and a first temperature detector of the battery energy station is used to detect a first temperature. Then, it is determined whether smoke is detected by the smoke detector and whether the first temperature exceeds a first threshold value. When smoke is detected by the smoke detector and the first temperature exceeds the first threshold value, a warning notification is generated.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S410、S420、S430、S440、S450:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="405" publication-number="202615758">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615758</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138737</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>免拆外牆結構</chinese-title>
        <english-title>NON-DESTRUCTIVE EXTERIOR WALL STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241022B">E04B1/80</main-classification>
        <further-classification edition="200601120241022B">E04G11/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇筱晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, HSIAO-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇筱晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, HSIAO-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種免拆外牆結構，其包含一外牆板、一定位件及一模板。外牆板包含有一板件及一支架件，板件具有相對設置的一外表面及一內表面，支架件沿垂直於地面的一設置方向固定於內表面，支架件與內表面圍繞形成有一容置空間，支架件遠離內表面之一側穿設有連通容置空間的一支架孔；定位件穿設於容置空間中，定位件對應支架孔設有呈波浪狀的一定位孔，定位孔用以定位一螺件；模板具有一連接件，連接件水平連接於螺件，並用以讓模板與外牆板之間夾設有一灌漿空間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A non-destructive exterior wall structure, which includes an exterior wall panel, a positioning piece, and a formwork. The exterior wall panel comprises a plate and a support piece, where the plate has an outer surface and an inner surface positioned opposite each other. The support piece is fixed to the inner surface along a direction perpendicular to the ground, and together with the inner surface, forms a receiving space. A support hole, which communicates with the receiving space, is provided on one side of the support piece away from the inner surface. The positioning piece is arranged within the receiving space, and a wavy positioning hole corresponding to the support hole is provided on the positioning piece for positioning a screw element. The formwork has a connecting piece that is horizontally connected to the screw element and is used to form a grouting space between the formwork and the exterior wall panel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:免拆外牆結構</p>
        <p type="p">11:板件</p>
        <p type="p">112:內表面</p>
        <p type="p">113a:第一抵擋部</p>
        <p type="p">114a:第二抵擋部</p>
        <p type="p">12:支架件</p>
        <p type="p">123:固定部</p>
        <p type="p">30:模板</p>
        <p type="p">40:固定件</p>
        <p type="p">61:卡接槽</p>
        <p type="p">622:連接孔</p>
        <p type="p">S:灌漿空間</p>
        <p type="p">10:外牆板</p>
        <p type="p">111:外表面</p>
        <p type="p">113:卡凹部</p>
        <p type="p">114:卡凸部</p>
        <p type="p">116:卡接部</p>
        <p type="p">122:支架孔</p>
        <p type="p">124:第一固定孔</p>
        <p type="p">31:連接件</p>
        <p type="p">60:連接柱</p>
        <p type="p">62:連接部</p>
        <p type="p">X:設置方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="406" publication-number="202616059">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616059</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138739</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>觸控總成</chinese-title>
        <english-title>TOUCH ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">G06F3/041</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商祥達光學（廈門）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TPK GLASS SOLUTIONS (XIAMEN) INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡利煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, LI-HUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴建民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHIEN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佘志君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHE, ZHI-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種觸控總成包含保護蓋板、第一黏著層、導線層、第二黏著層以及視效改善結構。第一黏著層設置於保護蓋板上。第一黏著層的厚度在20 µm至200 µm的範圍。導線層包含設置於第一黏著層上的彎曲導線。彎曲導線包含沿著第一方向延伸的第一群導線以及沿著第二方向延伸且搭接於第一群導線上的第二群導線。每一彎曲導線包含導電內芯以及外覆層。第二黏著層覆蓋彎曲導線與第一黏著層。視效改善結構於保護蓋板與導線層的堆疊方向上與每一彎曲導線對應。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A touch assembly includes a protective cover, a first adhesive layer, a wire layer, a second adhesive layer, and a visual effect improvement structure. The first adhesive layer is disposed on the protective cover. A thickness of the first adhesive layer ranges from 20 µm to 200 µm. The wire layer includes curved wires disposed on the first adhesive layer. The curved wires include a first group of wires extending along a first direction and a second group of wires extending along a second direction and overlapping the first group of wires. Each of the curved wire includes a conductive inner core and an outer covering. The second adhesive layer covers the curved wire and the first adhesive layer. The visual effect improvement structure corresponds to each of the curved wires in a stacking direction of the protective cover and the wire layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:觸控總成</p>
        <p type="p">110:保護蓋板</p>
        <p type="p">120:第一黏著層</p>
        <p type="p">13L:導線層</p>
        <p type="p">140:第二黏著層</p>
        <p type="p">210:視效改善結構</p>
        <p type="p">D:堆疊方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="407" publication-number="202616580">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616580</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138743</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器總成</chinese-title>
        <english-title>CONNECTOR ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241227B">H01R13/62</main-classification>
        <further-classification edition="200601120241227B">H01R13/639</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禾昌興業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>P-TWO INDUSTRIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張君瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁國隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種連接器總成，包括第一連接器及第二連接器。第一連接器包括第一絕緣殼體、第一金屬外殼及附接在第一金屬外殼的螺母構件，第一絕緣殼體具有收容空間，第二連接器可沿第一方向插入該收容空間。第二連接器包括第二絕緣殼體、第二金屬外殼及卡扣構件。第二金屬外殼係形成有鎖附孔。卡扣構件係形成有彈臂，該彈臂可在與第一方向垂直的第二方向移動且恆常地偏置至卡合位置。可藉由帶頭螺絲將第二連接器鎖在第一連接器上。藉此，實現具有良好的操作性且可靠度高的連接器總成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A connector assembly is provided, which includes a first connector and a second connector. The first connector includes a first insulating housing having a receiving space, a first metal shell and a nut member attached to the first metal shell, and the second connector can be inserted into the receiving space in a first direction. The second connector includes a second insulating housing, a second metal shell and a locking member. The second insulating housing is formed with a lock hole. The locking member is formed with an elastic arm which is movable in a second direction perpendicular to the first direction and normally biased to a locking position. By means of a headed screw, the second connector can be secured to the first connector. As such, a connector assembly with good operability and high reliability is achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:連接器總成</p>
        <p type="p">10:插座連接器</p>
        <p type="p">20:插頭連接器</p>
        <p type="p">30:帶頭螺絲</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="408" publication-number="202616305">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616305</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138774</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>充磁裝置</chinese-title>
        <english-title>MAGNETIZING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241120B">H01F13/00</main-classification>
        <further-classification edition="200601120241120B">H04R31/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西伯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SABLE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳輝城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧皓駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENG, HAO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黎光昀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, KUANG-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱柏升</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, PO-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王科驊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, KE-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種充磁裝置，適於對揚聲器的磁鐵組件進行充磁，充磁裝置包括至少二充磁組件，其至少二充磁組件設置為分別位於待充磁的磁鐵組件的兩側以進行充磁，充磁組件包括：主線圈、第一副線圈以及第二副線圈。主線圈設置為對主磁鐵進行第一方向充磁。第一副線圈設置為對第一副磁鐵進行第二方向充磁，且第一方向充磁與第二方向充磁的磁力線方向相異。第二副線圈設置為對第二副磁鐵進行第二方向充磁。本發明可滿足特定揚聲器的磁鐵組件內部不同磁鐵之間的異極性需求，不僅降低組裝難度，還增加磁鐵組件的磁場強度與穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a magnetizing device suitable for magnetizing the magnet assembly of a speaker. The magnetizing device includes at least two magnetizing components, which are arranged on opposite sides of the magnet assembly to be magnetized. The magnetizing components comprise a main coil, a first auxiliary coil, and a second auxiliary coil. The main coil is configured to magnetize the main magnet in a first direction. The first auxiliary coil is configured to magnetize the first auxiliary magnet in a second direction, where the magnetic field lines of the first direction magnetization and the second direction magnetization are different. The second auxiliary coil is configured to magnetize the second auxiliary magnet in the second direction. This invention meets the need for opposing polarities between different magnets within the magnet assembly of a specific speaker, reducing assembly difficulty while increasing the magnetic field strength and stability of the magnet assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:磁鐵組件</p>
        <p type="p">110:U鐵</p>
        <p type="p">120a:第一副磁鐵</p>
        <p type="p">120b:第二副磁鐵</p>
        <p type="p">130:金屬片</p>
        <p type="p">140:主磁鐵</p>
        <p type="p">200:充磁裝置</p>
        <p type="p">210:充磁組件</p>
        <p type="p">212:鐵芯</p>
        <p type="p">214:主線圈</p>
        <p type="p">216a:第一副線圈</p>
        <p type="p">216b:第二副線圈</p>
        <p type="p">FDM:第一方向充磁</p>
        <p type="p">SDM:第二方向充磁</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="409" publication-number="202616415">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616415</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138777</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有氣液分離裝置之基板濕處理設備</chinese-title>
        <english-title>SUBSTRATE WET PROCESSING APPARATUS WITH GAS-LIQUID SEPARATION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241224B">H01L21/67</main-classification>
        <further-classification edition="200601120241224B">H01L21/302</further-classification>
        <further-classification edition="200601120241224B">B05C11/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>增縉精機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEN JIN PRECISION MACHINERY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董馨仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG, HSING JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有氣液分離裝置之基板濕處理設備，包含：旋轉台、液體供應裝置、回收環和回收箱。旋轉台配置為放置基板。液體供應裝置設置在該旋轉台上方，且配置為對該基板施加製程液體。回收環環繞地設置在該旋轉台的周圍，並且可沿著垂直方向相對該旋轉台移動。該回收環配置為收集該製程液體及其混合的氣液混合物，以及該回收環包含回收管路。回收箱與該回收環之該回收管路對應連接，以收集該回收環收集的該製程液體和該氣液混合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate wet processing apparatus with a gas-liquid separation device, including: a rotating stage, a liquid supply device, a recycling ring, and a recovery box. The rotating stage is configured to place a substrate. The liquid supply device is disposed above the rotating stage and configured to apply process liquid to the substrate. The recycling ring is disposed circumferentially around the rotating stage and is movable along a vertical direction relative to the rotating stage. The recycling ring is configured to collect the process liquid and its mixed gas-liquid mixture, and the recycling ring includes a recovery pipeline. The recovery box is correspondingly connected to the recovery pipeline of the recycling ring to collect the process liquid and the gas-liquid mixture collected by the recycling ring.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板濕處理設備</p>
        <p type="p">2:基板</p>
        <p type="p">10:旋轉台</p>
        <p type="p">20:液體供應裝置</p>
        <p type="p">21:噴嘴</p>
        <p type="p">30:回收環組合</p>
        <p type="p">40:回收箱</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="410" publication-number="202616484">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616484</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138782</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子封裝件及其製法</chinese-title>
        <english-title>ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241030B">H01L23/28</main-classification>
        <further-classification edition="200601120241030B">H01L23/488</further-classification>
        <further-classification edition="200601120241030B">H01L21/56</further-classification>
        <further-classification edition="200601120241030B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矽品精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱志賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHIH-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>焦嘉振</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIAO, CHIA CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊超雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHAO YA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林建成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子封裝件及其製法，主要於承載結構中形成有凹槽，並於該凹槽中置放線路結構，以將不同規格之晶片作為第一電子元件及第二電子元件而分別電性連接該承載結構與該線路結構，藉以滿足多功能之需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic package is made by embedding a circuit structure in a groove of a carrier structure, and disposing chips of different specifications as first and second electronic components on the carrier structure and the circuit structure respectively, such that the electronic package meets multi-functional need.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:電子封裝件</p>
        <p type="p">20:承載結構</p>
        <p type="p">21:第一電子元件</p>
        <p type="p">22:第二電子元件</p>
        <p type="p">23:第三電子元件</p>
        <p type="p">24:導電結構</p>
        <p type="p">25:封裝層</p>
        <p type="p">29:線路結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="411" publication-number="202615880">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615880</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138789</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶片溫度檢測模組</chinese-title>
        <english-title>CHIP TEMPERATURE MONITORING MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120241204B">G01R31/26</main-classification>
        <further-classification edition="200601120241204B">G01K11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>研能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICROJET TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫皓然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOU, HAO-JAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張正明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHENG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖文雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, WEN-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種晶片溫度檢測模組，配置於噴墨晶片之中，包含：晶片接點；三個以上之雙極性電晶體(bipolar junction transistor, BJT)，所述的雙極性電晶體為並聯且透過晶片接點連接外部訊號端，且該三個以上之雙極性電晶體由同樣製程所製造，其中，所述的雙極性電晶體為PNP型態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chip temperature monitoring module configured in an inkjet chip is disclosed and includes a chip contact and at least three bipolar junction transistors. The bipolar junction transistors are disposed in parallel to each other and in connection with an external signal terminal through the chip contact. The bipolar junction transistors are made by the same manufacturing process and are of the PNP type.</p>
      </isu-abst>
      <representative-img>
        <p type="p">202:晶片接點</p>
        <p type="p">300:晶片溫度檢測模組</p>
        <p type="p">302:雙極性電晶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="412" publication-number="202616899">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616899</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138792</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光伏電池封裝結構及其製造方法</chinese-title>
        <english-title>PHOTOVOLTAIC CELL PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10F19/80</main-classification>
        <further-classification edition="202501120250102B">H10F71/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>位元奈米科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANOBIT TECH. CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王水泉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHUEI-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉遠翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YUAN-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉修銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HSIOU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游秉豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, PING-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光伏電池封裝結構包括：第一透明蓋板；第一下導電層設置於第一透明蓋板的側面上；第一光伏單元設置於第一下導電層的側面上；第一上導電層設置於第一光伏單元的側面上；封裝層設置於第一透明蓋板的周圍；黏著層設置於第一透明蓋板的周圍，並臨設於封裝層；及第二透明蓋板設置於封裝層及黏著層上，並與第一上導電層接觸。第一透明蓋板、第二透明蓋板及封裝層形成封裝區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A photovoltaic cell packaging structure includes: a first transparent cover; a first lower conductive layer, disposed on a side of the first transparent cover; a first photovoltaic unit, disposed on a side of the first lower conductive layer; a first upper conductive layer, disposed on a side of the first photovoltaic unit; a packaging layer, disposed peripherally to the first transparent cover; an adhesive layer, disposed peripherally to the first transparent cover and disposed beside the packaging layer; and a second transparent cover, disposed on the packaging layer and the adhesive layer, and contacted with the first upper conductive layer. A packaging area is defined by the first transparent cover, the second transparent cover, and the packaging layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光伏電池封裝結構</p>
        <p type="p">11:第一透明蓋板</p>
        <p type="p">11S:側面</p>
        <p type="p">12:第二透明蓋板</p>
        <p type="p">12S:側面</p>
        <p type="p">21:第一下導電層</p>
        <p type="p">21S:側面</p>
        <p type="p">22:第二下導電層</p>
        <p type="p">22S:側面</p>
        <p type="p">31:第一光伏單元</p>
        <p type="p">31S:側面</p>
        <p type="p">32:第二光伏單元</p>
        <p type="p">32S:側面</p>
        <p type="p">41:第一上導電層</p>
        <p type="p">42:第二上導電層</p>
        <p type="p">50:封裝層</p>
        <p type="p">51:封裝區</p>
        <p type="p">60:黏著層</p>
        <p type="p">70:電極導線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="413" publication-number="202616126">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616126</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138798</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>時脈控制電路及方法</chinese-title>
        <english-title>CLOCK CONTROL CIRCUIT AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250102B">G06F30/333</main-classification>
        <further-classification edition="200601120250102B">G06F11/26</further-classification>
        <further-classification edition="200601120250102B">G01R31/317</further-classification>
        <further-classification edition="200601120250102B">G11C29/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昱霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛培英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSUEH, PEI-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑩晏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YING-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供電路系統的時脈控制電路及方法。電路系統包含掃描正反器電路、全速域及時序例外域。時脈控制電路包括第一選通控制電路、第一選通電路、第二選通控制電路及第二選通電路。第一選通電路由第一選通控制電路輸出的第一控制訊號、掃描致能訊號及掃描模式訊號控制並阻擋或輸出時脈訊號至掃描正反器電路。第二選通電路由第二選通控制電路輸出的第二控制訊號控制並阻擋或輸出掃描正反器電路的輸出訊號至時序例外域。在掃描模式訊號具有第一邏輯值時，第二控制訊號依據測試型樣在第一邏輯值與第二邏輯值之間切換。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a clock control circuit and method for a circuitry. The circuitry includes a scan flip-flop circuit, an at-speed domain and a timing exception domain. The clock control circuit includes a first gate control circuit, a first gate circuit, a second gate control circuit and a second gate circuit. The first gate circuit is controlled by a first control signal outputted by the first gate control circuit, a scan enable signal and a scan mode signal to block or output a clock signal to the scan flip-flop circuit. The second gate circuit is controlled by a second control signal outputted by the second gate control circuit to block or output an output signal of the scan flip-flop circuit to the timing exception domain. When the scan mode signal has a first logic value, the second control signal is switched between the first logic value and a second logic value according to a test pattern.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電路系統</p>
        <p type="p">10,12:掃描正反器電路</p>
        <p type="p">14:全速域</p>
        <p type="p">16:時序例外域</p>
        <p type="p">20:第一選通控制電路</p>
        <p type="p">22:第一選通電路</p>
        <p type="p">24:第二選通控制電路</p>
        <p type="p">26:第二選通電路</p>
        <p type="p">200:時脈控制電路</p>
        <p type="p">CLK:時脈訊號</p>
        <p type="p">D:第一資料輸入端</p>
        <p type="p">FIX:第二控制訊號</p>
        <p type="p">Q:資料輸出端</p>
        <p type="p">SE:輸入致能端</p>
        <p type="p">SI:第二資料輸入端</p>
        <p type="p">SOB:輸出訊號</p>
        <p type="p">sen:掃描致能訊號</p>
        <p type="p">smode:掃描模式訊號</p>
        <p type="p">TP:第一控制訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="414" publication-number="202616581">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616581</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138800</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防誤觸卡制結構及其母接頭結構</chinese-title>
        <english-title>MISTOUCH PREVENTION LOCKING STRUCTURE AND FEMALE CONNECTOR STRUCTURE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250421B">H01R13/64</main-classification>
        <further-classification edition="200601120250421B">H01R13/629</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富世達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOSITECK CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐安賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, AN-SZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家萌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-MENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫大龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種防誤觸卡制結構及其母接頭結構。所述防誤觸卡制結構用於公、母接頭對接卡制，其包括：內部形成有插接通道的本體、套設在該本體的套筒以及按壓單元組。所述按壓單元組具有環體、按壓體及彈簧。該環體容置於該本體內的組設槽中並可通過貫孔垂直移動，該按壓體設置於該套筒的開口內並連接該環體，該彈簧係抵撐該按壓體及本體間。其中，該本體端部徑向凸設一擋部，該擋部外徑至少與該按壓體按壓面平齊或略高。藉此在有限的空間中可輕易對該公、母接頭進行對接組設或分離，更藉由擋部之設計可有效防止誤觸按壓體導致非預期的分離者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:公接頭</p>
        <p type="p">110:卡槽</p>
        <p type="p">111:凸堤</p>
        <p type="p">111a:坡面</p>
        <p type="p">112:平台</p>
        <p type="p">2a:母接頭</p>
        <p type="p">20b:環槽</p>
        <p type="p">201:組設槽</p>
        <p type="p">21:本體</p>
        <p type="p">21u:凹槽</p>
        <p type="p">213:擋部</p>
        <p type="p">23:套筒</p>
        <p type="p">230:開口</p>
        <p type="p">232:把手</p>
        <p type="p">241:環體</p>
        <p type="p">241a:環狀斜面</p>
        <p type="p">242:按壓體</p>
        <p type="p">242a:按壓面</p>
        <p type="p">242b:受接面</p>
        <p type="p">242r:凸塊</p>
        <p type="p">243:彈簧</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="415" publication-number="202615623">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615623</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138808</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種應用於窗戶隔熱紙貼膜之無溶劑黏膠及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241220B">C09J201/02</main-classification>
        <further-classification edition="200601120241220B">C09J4/02</further-classification>
        <further-classification edition="200601120241220B">C09J11/06</further-classification>
        <further-classification edition="201801120241220B">C09J7/20</further-classification>
        <further-classification edition="201801120241220B">C09J7/38</further-classification>
        <further-classification edition="200601120241220B">E06B9/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東鏘工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOP COLOUR FILM LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡國雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周金城</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種應用於窗戶隔熱紙貼膜之無溶劑黏膠，由一組成物交聯形成，該組成物包括：20至60wt%的寡聚物；40至80wt%的液態單體；以及0.5至5wt%的光起始劑，其中，該組成物的交聯度為50至70%。本發明的無溶劑黏膠的交聯度僅為50至70%，因此在施作至窗戶玻璃後，能夠利用未交聯的部分繼續吸收UV光，以延長隔熱紙的使用壽命。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="416" publication-number="202615320">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615320</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138818</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶片載盤切換裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241126B">B65G49/07</main-classification>
        <further-classification edition="200601120241126B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國大陸商無錫艾方芯動自動化設備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林德禮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱創先</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種晶片載盤切換裝置，包括：平台及切換裝置，平台設有至少一個被架高的第一載盤及貫穿平台的一作動通道；切換裝置設置平台底部且鄰近作動通道，切換裝置包括載台及移動機構，載台上設有位置相鄰的第二載盤及升降載盤，第二載盤被架高且所在高度是與第一載盤相同，升降載盤的連動機構於作動通道運作，以調整升降載盤高度與第二載盤相同或低於第二載盤，移動機構負責帶動載台移動，以切換為第一載盤與第二載盤併排狀態，或是為該第一載盤、該升降載盤與該第二載盤依序併排狀態，藉此讓平台上閒置空間能被更有效的利用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:托盤</p>
        <p type="p">30:平台</p>
        <p type="p">31:第一載盤</p>
        <p type="p">32:作動通道</p>
        <p type="p">34:空間</p>
        <p type="p">40:切換裝置</p>
        <p type="p">41:載台</p>
        <p type="p">42:移動機構</p>
        <p type="p">43:第二載盤</p>
        <p type="p">44:升降載盤</p>
        <p type="p">45:支撐件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="417" publication-number="202616199">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616199</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138819</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>風險名單監管系統及方法</chinese-title>
        <english-title>RISK LIST MANAGING SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120241224B">G06Q40/04</main-classification>
        <further-classification edition="202301120241224B">G06Q40/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台北富邦商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIPEI FUBON COMMERCIAL BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, PEI LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱愛倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, AI LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳淯兆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YU CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林詩盈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIN YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉晉儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIN JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉書夢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SHU MENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種風險名單監管系統包含資料庫、風險分析單元、風險名單產生單元及伺服器。資料庫用以儲存帳戶的帳戶資料及交易金流資料。風險分析單元的交易風險模型用以分析交易金流資料以產生對應交易金流資料的至少一風險因子，並且計算該至少一風險因子的權重以產生風險評分。當風險評分大於一風險標準閾值時，風險名單產生單元產生並發送風險帳號名單。伺服器將風險帳號名單中的帳戶資料所對應的帳戶註記為暫時禁提的狀態。本發明的風險名單監管系統可即時、高效且快速地自動辨識高風險帳戶，以提高效率並降低人力成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A risk list managing system includes a database, a risk analyzing unit, a risk list generating unit and a server. The database is configured to store an account data and trading data of an account. A trading risk model of the risk analyzing unit is configured to analyze the trading data to generate at least one risk factor of the account data and calculate the weighting of the risk factor to generate a risk score. The risk list generating unit generates a risk account list when the risk score is greater than a risk standard threshold value. The server marks the account corresponding to the account data in the risk account list as temporarily blocked. The risk list managing system of the present invention can automatically identify high-risk accounts instantly, efficiently and quickly to improve efficiency and reduce labor costs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:風險名單監管系統</p>
        <p type="p">10:資料庫</p>
        <p type="p">11:風險分析單元</p>
        <p type="p">111:交易風險模型</p>
        <p type="p">12:風險名單產生單元</p>
        <p type="p">13:伺服器</p>
        <p type="p">131:註記單元</p>
        <p type="p">132:檢核單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="418" publication-number="202616160">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616160</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138820</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>全方位敏捷開發風險管控系統及方法</chinese-title>
        <english-title>COMPREHENSIVE AGILE DEVELOPMENT RISK MANAGEMENT SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241031B">G06Q10/0635</main-classification>
        <further-classification edition="202301120241031B">G06Q10/063</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台北富邦商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIPEI FUBON COMMERCIAL BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林世哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯合治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, HO-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳哲宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHEHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林潓祺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HUI-CI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳承璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHENGCHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種全方位敏捷開發風險管控系統，應用於應用程式生命周期管理平台中以進行應用程式生命周期之管理。該系統包含需求溝通模組、程式開發模組、自動化流程與部署模組及維運監控模組。需求溝通模組係用以收集使用者之需求資料，並將需求資料轉換為待辦開發任務資料。程式開發模組係耦接需求溝通模組，並用以接收待辦開發任務資料以及程式。自動化流程與部署模組係耦接程式開發模組，用以接收程式並自動化進行檢測流程，以針對程式進行資安檢測以及品質控管。維運監控模組係耦接自動化流程與部署模組，用以根據資安檢測及品質控管之結果，進行後續追蹤及風險評估。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A comprehensive agile development risk management system is applied to the Application Lifecycle Management platform for managing the application lifecycle. The system comprises a requirement communication module, a program development module, an automated process and deployment module, and an operations monitoring module. The requirement communication module is configured to collect user requirement data and convert it into development task data. The program development module is coupled with the requirement communication module to receive the development task data and program code. The automated process and deployment module is coupled with the program development module to receive the program and automate the detection process, conducting security checks and quality control for the program. The operations monitoring module is coupled with the automated process and deployment module to perform subsequent tracking and risk assessment based on the results of security checks and quality control.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:全方位敏捷開發風險管控系統</p>
        <p type="p">11:需求溝通模組</p>
        <p type="p">12:程式開發模組</p>
        <p type="p">13:自動化流程與部署模組</p>
        <p type="p">14:維運監控模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="419" publication-number="202616852">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616852</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138830</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置與其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10D30/60</main-classification>
        <further-classification edition="202501120250102B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻揚半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON YOUNG SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱玉蓮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YU-LIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置包含基板、第一閘極結構與磊晶層。第一閘極結構在基板上，第一閘極結構的長度方向沿著第一方向。磊晶層在基板上，其中第一閘極結構在磊晶層中，且磊晶層包含複數個第一源極區、複數個第一體接觸區與井區。第一源極區相鄰第一閘極結構，第一源極區具有第一導體型。第一體接觸區相鄰第一閘極結構，第一體接觸區具有第二導體型，且第二導體型不同於第一導體型，其中第一源極區與第一體接觸區沿著第一方向交錯排列。井區在第一源極區與第一體接觸區下，井區具有第二導體型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a substrate, a first gate structure, and an epitaxial layer. The first gate structure is over the substrate. A longitudinal direction of the first gate structure is along a first direction. The epitaxial layer is over the substrate, and the first gate structure is in the epitaxial layer. The epitaxial layer includes a plurality of first source regions, a plurality of first body contact region, and a well region. The first source regions are adjacent to the first gate structure. The first source regions have a first conductivity type. The first body contact regions are adjacent to the first gate structure. The first body contact regions have a second conductivity type different from the first conductivity type. The first source regions and the first body contact regions are alternately arranged along the first direction. The well region is below the first source regions and the first body contact regions. The well region has a second conductivity type</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:閘極結構</p>
        <p type="p">123、127:源極區</p>
        <p type="p">124、128:體接觸區</p>
        <p type="p">125:遮蔽區</p>
        <p type="p">140:源極電極</p>
        <p type="p">A-A、B-B:線</p>
        <p type="p">D1、D2:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="420" publication-number="202616131">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616131</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138834</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於人工智慧的電話詐騙防護系統</chinese-title>
        <english-title>ARTIFICIAL INTELLIGENCE-BASED TELEPHONE FRAUD PREVENTION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120241115B">G06F40/20</main-classification>
        <further-classification edition="200601120241115B">G08B25/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昭宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHAO-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昭宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHAO-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳東豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TUNG-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳柏松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, PO-SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳思源</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種基於人工智慧的系統，旨在防止電話詐騙通訊。當使用者無法接聽或來電者未被識別時，該系統會自動接聽來電，並通過即時對話使用自然語言處理及語意分析驗證來電者的身份。系統動態分析對話內容以檢測潛在的詐騙或網路釣魚活動，並將通話分類為安全、可疑或危險等風險類別。根據該分類，系統執行適當的操作，例如提供對話摘要、記錄可疑通話以便進一步分析，或終止並封鎖危險通話，同時將事件報告給政府當局。此外，該系統還可整合至外部服務，如日曆和訊息平台，以自動安排事件並高效管理通訊。使用者可即時監控對話並在必要時進行干預，確保通話互動的安全性及控制權。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an artificial intelligence (AI)-powered system designed to prevent fraudulent telephone communications. The system automatically answers incoming calls when the user is unavailable or the caller is unidentified, engaging in real-time dialogue to verify the caller's identity using natural language processing (NLP) and semantic analysis. It dynamically analyzes conversational content to detect potential fraud or phishing activities, classifying calls into risk categories of Safe, Suspicious, or Dangerous. Based on this classification, the system executes appropriate actions such as providing conversation summaries, recording suspicious calls for further analysis, or terminating and blocking dangerous calls while reporting incidents to relevant authorities. Additionally, the system integrates with external services like calendars and messaging platforms to automatically schedule events and manage communication efficiently. Users retain the ability to monitor conversations in real-time and intervene when necessary, ensuring both security and control over telephone interactions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電話詐騙防護系統</p>
        <p type="p">10:來電者</p>
        <p type="p">20:外部服務</p>
        <p type="p">30:政府當局</p>
        <p type="p">40:外部威脅情報來源</p>
        <p type="p">60:第三方AI公司提供的大語言模型</p>
        <p type="p">110:通信介面</p>
        <p type="p">120:AI模組</p>
        <p type="p">130:音頻輸出介面</p>
        <p type="p">140:資料儲存元件</p>
        <p type="p">142:白名單</p>
        <p type="p">144:黑名單</p>
        <p type="p">150:整合模組</p>
        <p type="p">160:使用者干預介面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="421" publication-number="202615153">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615153</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138838</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>藉由脈衝波電化學提升電催化CO2形成CO的效率之方法</chinese-title>
        <english-title>METHOD OF IMPROVING EFFICIENCY TO ELECTROCATALYZE CO2 TO FORM CO BY USING PULSE WAVE ELECTROCHEMISTRY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">B01J37/34</main-classification>
        <further-classification edition="200601120241105B">B01J23/06</further-classification>
        <further-classification edition="202101120241105B">C25B1/23</further-classification>
        <further-classification edition="202101120241105B">C25B11/052</further-classification>
        <further-classification edition="202101120241105B">C25B11/077</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立陽明交通大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉大中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TA-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃昱瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳心樵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HSIN-CHIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種藉由脈衝波電化學提升電催化二氧化碳形成一氧化碳的效率之方法。方法包括以下操作。對電極上的含金屬催化劑施加具有脈衝波形的電壓隨時間變化來改質含金屬催化劑以形成改質後含金屬催化劑。電解電解池中的二氧化碳以形成一氧化碳，其中電解池中的陰極電極包括電極及改質後含金屬催化劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a method of improving the efficiency to electrocatalyze carbon dioxide to form carbon monoxide by using pulse wave electrochemistry. The method includes the following operations. A voltage chaning with time and having a pulse waveform is applied to a metal-containing catalyst disposed on an electrode to modify the metal-containing catalyst to form a modified metal-containing catalyst. Carbon dioxide in an electrolytic cell is electrolyzed to form carbon monoxide, in which a cathode electrode in the electrolytic cell includes the electrode and the modified metal-containing catalyst.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">101:操作</p>
        <p type="p">102:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="422" publication-number="202616785">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616785</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138846</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路板、電路板組件及電路板組件的製造方法</chinese-title>
        <english-title>CIRCUIT BOARD, CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE CIRCUIT BOARD ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">H05K1/11</main-classification>
        <further-classification edition="200601120241104B">H05K3/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商宏啟勝精密電子(秦皇島)有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商鵬鼎控股(深圳)股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVARY HOLDING (SHENZHEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鵬鼎科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林原宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林海濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HAITAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電路板、電路板組件及電路板組件的製造方法。電路板包括線路基板、絕緣基板、第一導電柱、第二導電柱與接墊。電路板組件還包含電子元件與焊料。絕緣基板設置於線路基板上，具有凹槽。第一導電柱設置於絕緣基板中，不位於凹槽內。第二導電柱設置於絕緣基板中，分別位於凹槽內，其中第一導電柱的長度大於第二導電柱的長度。接墊分別設置於第一導電柱與第二導電柱上。電子元件裝設於絕緣基板上，其中絕緣基板位於電子元件與線路基板之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit board, circuit board assembly and a method of manufacturing circuit board assembly are provided. The circuit board includes a wire board, an insulated board, a plurality of first and second conductor pillars and contact pads. The circuit board assembly also includes an electronic component and a plurality of solders. The insulated board is placed on the wire board and has a plurality of recesses. The first conductor pillars are placed on the insulated board and not in the recesses. The second conductor pillars are placed on the insulated board, and placed in the recesses apiece, wherein the length of the first conductor pillar is greater than the length of the second conductor pillar. The contact pads are placed on the first and second conductor pillars apiece. The electronic component is placed on the insulated board, which is placed between the electronic component and the wire board.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電路板組件</p>
        <p type="p">110:電路板</p>
        <p type="p">120:線路基板</p>
        <p type="p">122:線路結構</p>
        <p type="p">124:第三表面</p>
        <p type="p">126:接墊</p>
        <p type="p">130:絕緣基板</p>
        <p type="p">131:第一表面</p>
        <p type="p">132:第二表面</p>
        <p type="p">133:凹槽</p>
        <p type="p">134:第一導電柱</p>
        <p type="p">135:第二導電柱</p>
        <p type="p">136:第一接墊</p>
        <p type="p">137:第二接墊</p>
        <p type="p">138:第一頂面</p>
        <p type="p">139:第二頂面</p>
        <p type="p">140:電子元件</p>
        <p type="p">141:本體</p>
        <p type="p">142:底表面</p>
        <p type="p">143:連接墊</p>
        <p type="p">144:導電塊</p>
        <p type="p">145:焊料</p>
        <p type="p">150:第一方向</p>
        <p type="p">152:第二方向</p>
        <p type="p">190:防焊層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="423" publication-number="202615539">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615539</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138850</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱塑性樹脂組成物、母料用熱塑性樹脂組成物、熔融紡絲用樹脂組成物、三維印表機長絲用樹脂組成物、以及膜用熱塑性樹脂組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08G63/00</main-classification>
        <further-classification edition="200601120260102B">C08G63/183</further-classification>
        <further-classification edition="201801120260102B">C08K3/00</further-classification>
        <further-classification edition="201801120260102B">C08K3/013</further-classification>
        <further-classification edition="201801120260102B">C08K3/017</further-classification>
        <further-classification edition="200601120260102B">C08K5/00</further-classification>
        <further-classification edition="200601120260102B">C08K5/098</further-classification>
        <further-classification edition="200601120260102B">C08K5/17</further-classification>
        <further-classification edition="200601120260102B">C08K5/42</further-classification>
        <further-classification edition="200601120260102B">C08K5/51</further-classification>
        <further-classification edition="200601120260102B">C08L101/00</further-classification>
        <further-classification edition="200601120260102B">C08L23/00</further-classification>
        <further-classification edition="200601120260102B">C08L67/00</further-classification>
        <further-classification edition="200601120260102B">C08L67/03</further-classification>
        <further-classification edition="200601120260102B">C08J5/18</further-classification>
        <further-classification edition="202001120260102B">C08J7/04</further-classification>
        <further-classification edition="202001120260102B">C08J7/043</further-classification>
        <further-classification edition="200601120260102B">C08J9/00</further-classification>
        <further-classification edition="200601120260102B">B32B27/00</further-classification>
        <further-classification edition="200601120260102B">B32B27/18</further-classification>
        <further-classification edition="200601120260102B">B32B27/20</further-classification>
        <further-classification edition="200601120260102B">B32B27/30</further-classification>
        <further-classification edition="200601120260102B">B32B27/36</further-classification>
        <further-classification edition="200601120260102B">B32B3/26</further-classification>
        <further-classification edition="201901120260102B">B32B7/023</further-classification>
        <further-classification edition="201901120260102B">B32B7/025</further-classification>
        <further-classification edition="201501120260102B">G02B1/11</further-classification>
        <further-classification edition="201501120260102B">G02B1/14</further-classification>
        <further-classification edition="200601120260102B">G02B5/02</further-classification>
        <further-classification edition="200601120260102B">G02B5/30</further-classification>
        <further-classification edition="200601120260102B">H05B33/14</further-classification>
        <further-classification edition="202301120260102B">H10K50/86</further-classification>
        <further-classification edition="202301120260102B">H10K59/10</further-classification>
        <further-classification edition="201901120260102B">B29C48/08</further-classification>
        <further-classification edition="201901120260102B">B29C48/88</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東洋紡股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOBO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邊奈穂子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, NAOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肥後衣里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIGO, ERI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樋口諒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIGUCHI, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>広井紀彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROI, NORIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具有靜電施加性，並且異物的存在量少，具有高度的澄清度之熱塑性樹脂組成物。本發明揭示：一種熱塑性樹脂組成物，含有熱塑性樹脂及離子性化合物，構成前述離子性化合物之陰離子與陽離子的解離能Q(kJ/mol)為850以下，離子性化合物相對於熱塑性樹脂的添加量R(ppm)為950以下，並且揭示：如前述之熱塑性樹脂組成物，其係母料用途、防熔融用途、3D(Three Dimensions；三維)印表機長絲用途、膜用途之任一用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="424" publication-number="202616543">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616543</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138852</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>以膜分離單元提高固體氧化物燃料電池燃料利用率的系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120241016B">H01M8/12</main-classification>
        <further-classification edition="200601120241016B">H01M8/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崑鼎綠能環保股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ECOVE ENVIRONMENT CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邢忠彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHING, CHUNG-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊傑銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIEH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳昇芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SHENG-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹師維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, CATHERINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁傑權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, JIE-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾永信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, YUNG-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種以膜分離單元提高固體氧化物燃料電池燃料利用率的系統，包括：SOFC，包含電解質及陽極和陰極，包含烴類、碳氫氧化合物、或一氧化碳的燃料和氧氣分別進入陽極和陰極進行氧化還原，隨後分別排出陽極和陰極尾氣；冷卻塔，接收並冷卻陽極尾氣的第一部分，產生含有冷凝水的陽極尾氣；氣水分離槽，接收該陽極尾氣並將其中的冷凝水分離；CO        &lt;sub&gt;2&lt;/sub&gt;膜分離單元，接收該陽極尾氣並分離其中的CO        &lt;sub&gt;2&lt;/sub&gt;，其中，陽極尾氣自保留物側進入，其中的CO        &lt;sub&gt;2&lt;/sub&gt;通過分離膜到達透過物側，其他部分則留在保留物側並隨後回流到陽極；再沸水槽，接收冷凝水並利用所述系統的熱整合將其再沸，隨後回流到陽極；以及氧化器，接收陽極尾氣的第二部分及陰極尾氣，使其進行氧化反應後排放。本發明的系統可增加燃料回收率，並且可避免額外補充水蒸氣的需求或製程難度高之複合膜材的使用。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:固體氧化物燃料電池</p>
        <p type="p">1’:固體氧化物電解質</p>
        <p type="p">2:陽極</p>
        <p type="p">3:陰極</p>
        <p type="p">4:CO&lt;sub&gt;2&lt;/sub&gt;膜分離單元</p>
        <p type="p">4’:分離膜</p>
        <p type="p">5:保留物側</p>
        <p type="p">6:透過物側</p>
        <p type="p">7:燃料流量調節閥</p>
        <p type="p">8:脫硫裝置</p>
        <p type="p">9:混合槽</p>
        <p type="p">10:燃料熱交換器</p>
        <p type="p">11:重整反應器</p>
        <p type="p">12:陰極供氣鼓風機</p>
        <p type="p">13:陰極供氣預熱器</p>
        <p type="p">14:陰極供氣熱交換器</p>
        <p type="p">15:陽極尾氣熱交換器</p>
        <p type="p">16:陽極尾氣回流泵</p>
        <p type="p">17:氧化器</p>
        <p type="p">18:排氣風機</p>
        <p type="p">19:冷卻塔</p>
        <p type="p">20:氣水分離槽</p>
        <p type="p">21:吹掃風機</p>
        <p type="p">22:再沸水槽</p>
        <p type="p">23:補充水調節閥</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="425" publication-number="202616804">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616804</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138853</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>散熱模組</chinese-title>
        <english-title>HEAT DISSIPATION MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241120B">H05K7/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和碩聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEGATRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳勃翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱珍元</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種散熱模組，適於與一電路模組配合應用，電路模組包含至少一電子單元，散熱模組包括至少一固定座以及至少一鰭片單元。固定座包括一本體及一固定單元，固定單元設置於本體並適於將本體固定於電路模組，本體包括至少一導引槽及對應導引槽的一第一卡合結構，導引槽具有鄰近電子單元一側的一開口，第一卡合結構設置於導引槽內。鰭片單元適於貼合電子單元，並包括彼此相反的一第一端與一第二端，第一端適於由開口插入導引槽並卡合於第一卡合結構，第二端適於固定在電路模組並鄰近電子單元的另一側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a heat dissipation module, which is suitable for cooperated with a circuit module. The circuit module includes at least one electronic unit. The heat dissipation module includes at least one fixing base and at least one fin unit. The fixed base includes a body and a fixed unit. The fixed unit is disposed at the body and is suitable for fixing the body to the circuit module. The body includes at least one guiding groove and a first engaging structure corresponding to the guiding groove. The guiding groove has an opening adjacent to one side of the electronic unit, and the first engaging structure is disposed in the guiding groove. The fin unit is adapted to attach the electronic unit and includes a first end and a second end opposite to each other. The first end is adapted to be inserted into the guiding groove through the opening and engaged with the first engaging structure. The second end is adapted to fixed on the circuit module and adjacent to the other side of the electronic unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:散熱模組</p>
        <p type="p">11a、11b:固定座</p>
        <p type="p">12a、12b:鰭片單元</p>
        <p type="p">121:散熱鰭片組</p>
        <p type="p">122a:第一固定件</p>
        <p type="p">122b:第二固定件</p>
        <p type="p">2:電路模組</p>
        <p type="p">21a、21b:電子單元</p>
        <p type="p">22:電路板</p>
        <p type="p">221:第二定位結構</p>
        <p type="p">23a、23b:連接器</p>
        <p type="p">E1:第一端</p>
        <p type="p">E2:第二端</p>
        <p type="p">F4:螺絲</p>
        <p type="p">G1:第一導引槽</p>
        <p type="p">G2:第二導引槽</p>
        <p type="p">S1:表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="426" publication-number="202616927">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616927</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138854</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250210B">H10H29/30</main-classification>
        <further-classification edition="202501120250210B">H10H29/85</further-classification>
        <further-classification edition="202501120250210B">H10H29/851</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊惇婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TUN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭家綺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHIA-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳逸安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭冠宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, KUAN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露公開一種電子裝置，具有多個顯示區與環繞顯示區的透明區，電子裝置包括第一基板、多個發光單元、多個第一光學單元、第一封裝層及第二封裝層。發光單元設置於第一基板上、並分別位於顯示區中；第一光學單元分別位於顯示區中、並分別設置於發光單元上；第一封裝層設置於發光單元上、並位於發光單元與第一光學單元之間；第二封裝層設置於第一光學單元上；第一封裝層於透明區接觸第二封裝層，使多個第一光學單元分別被封閉於第一封裝層與第二封裝層所形成的多個空間之中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses an electronic device, which includes a plurality of display areas and a transmissive area surrounding the display areas. The electronic device includes a first substrate, a plurality of light-emitting units, a first encapsulating layer, and a second encapsulating layer. The light-emitting units are arranged on the first substrate and disposed in the display areas, respectively. The first optical units are disposed in the the display areas, respectively, and located above the light-emitting units, respecitviely. The first encapsulating layer is arranged on the light-emitting units and located between the light-emitting units and the first optical units. The second encapsulating layer is disposed on the first optical units. The first encapsulating layer contacts the second encapsulating layer in the transmissive area, so that the first optical units are sealed in a plurality of spaces formed by the first encapsulating layer and the second encapsulating layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電子裝置</p>
        <p type="p">11:第一基板</p>
        <p type="p">12:發光單元</p>
        <p type="p">121:第一堤岸層</p>
        <p type="p">121a:第一開口</p>
        <p type="p">122:發光元件</p>
        <p type="p">123:電路層</p>
        <p type="p">13:第一光學單元</p>
        <p type="p">131:第二堤岸層</p>
        <p type="p">131a:第二開口</p>
        <p type="p">132:光轉換元件</p>
        <p type="p">132G:綠光轉換元件</p>
        <p type="p">132R:紅光轉換元件</p>
        <p type="p">132D:光擴散元件</p>
        <p type="p">14:第一封裝層</p>
        <p type="p">15:第一濾光單元</p>
        <p type="p">151:第一遮光層</p>
        <p type="p">151a:第三開口</p>
        <p type="p">152:第一彩色濾光元件</p>
        <p type="p">152B:藍光濾光元件</p>
        <p type="p">152G:綠光濾光元件</p>
        <p type="p">152R:紅光濾光元件</p>
        <p type="p">16:第二封裝層</p>
        <p type="p">17:第三封裝層</p>
        <p type="p">18:第四封裝層</p>
        <p type="p">19:第一支撐層</p>
        <p type="p">20:第一黏著層</p>
        <p type="p">21:第二支撐層</p>
        <p type="p">22:第二黏著層</p>
        <p type="p">23:第一透光材料層</p>
        <p type="p">AA’:剖面線</p>
        <p type="p">DA:顯示區</p>
        <p type="p">SP1,SP2,SP3:空間</p>
        <p type="p">TA:透明區</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
        <p type="p">Z:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="427" publication-number="202616532">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616532</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138855</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250102B">H01L25/16</main-classification>
        <further-classification edition="202501120250102B">H10H29/10</further-classification>
        <further-classification edition="200601120250102B">H01L23/52</further-classification>
        <further-classification edition="200601120250102B">H05K1/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏子旻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, TZU-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍哲毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHE-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露公開一種電子裝置，包括一基板、一電路層、一半導體晶片以及一感測元件。電路層設置於基板上，半導體晶片設置於基板與電路層之上並與電路層電性連接，半導體晶片包括一半導體晶粒、圍繞半導體晶粒的一填充層、設置於填充層周圍的反射層、以及設置於半導體晶粒上且與電路層電性連接的一透明導電層，感測元件至少部分重疊基板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses an electronic device, which includes a substrate, a circuit layer, a semiconductor chip, and a sensing element. The circuit layer is disposed on the substrate. The semiconductor chip is disposed over the substrate and the circuit layer, and is electrically connected to the circuit layer. The semiconductor chip includes a semiconductor die, an underfill layer surrounding the semiconductor die, a reflective layer arranged around the underfill layer, and a transparent conductive layer arranged on the semiconductor die and electrically connected to the circuit layer. The sensing element is at least partially overlapped with the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電子裝置</p>
        <p type="p">11:基板</p>
        <p type="p">111:第一表面</p>
        <p type="p">12:電路層</p>
        <p type="p">121,123,125:金屬層</p>
        <p type="p">122,124:絕緣層</p>
        <p type="p">13:半導體晶片</p>
        <p type="p">131:半導體晶粒</p>
        <p type="p">132:填充層</p>
        <p type="p">133:反射層</p>
        <p type="p">134:透明導電層</p>
        <p type="p">14:感測元件</p>
        <p type="p">141:連接腳</p>
        <p type="p">C1,C2:導電件</p>
        <p type="p">P1,P2:連接墊</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="428" publication-number="202616311">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616311</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138857</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電容器元件及其製作方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">H01G4/002</main-classification>
        <further-classification edition="200601120250102B">H01G4/005</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華新科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾明燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾為隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳惠如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞業武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種電容器元件及其製作方法，電容器元件包含有一電容本體、複數第一電容圖層、複數第二電容圖層、一第一表面電極及一第二表面電極。第一電容圖層及第二電容圖層分別設置於該電容本體內，且相互交疊設置，並相隔一間隙。第一電容圖層彼此連接，且連接第一表面電極。第二電容圖層彼此連接，且連接第二表面電極。由於電容器元件的第一表面電極及第二表面電極直接設置於電容本體的本體底面，在電容器元件的製作過程中無需端銀作業，藉此減少資源的浪費，並且能夠節約製作成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電容器元件</p>
        <p type="p">11:電容本體</p>
        <p type="p">111:本體頂面</p>
        <p type="p">112:本體底面</p>
        <p type="p">121:第一電容圖層</p>
        <p type="p">1210:第一電極薄帶基板</p>
        <p type="p">1211:第一電容通孔</p>
        <p type="p">1212:第一連接通孔</p>
        <p type="p">1213:第一頂面</p>
        <p type="p">1214:第一底面</p>
        <p type="p">1215:第一導電膏</p>
        <p type="p">1216:第一通孔圖層</p>
        <p type="p">122:第二電容圖層</p>
        <p type="p">1220:第二電極薄帶基板</p>
        <p type="p">1221:第二電容通孔</p>
        <p type="p">1222:第二連接通孔</p>
        <p type="p">1223:第二頂面</p>
        <p type="p">1224:第二底面</p>
        <p type="p">1225:第二導電膏</p>
        <p type="p">1226:第二通孔圖層</p>
        <p type="p">131:第一表面電極</p>
        <p type="p">132:第二表面電極</p>
        <p type="p">14:表面電極薄帶基板</p>
        <p type="p">141:第一電極通孔</p>
        <p type="p">142:第二電極通孔</p>
        <p type="p">143:電極導電膏</p>
        <p type="p">15:頂面薄帶基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="429" publication-number="202616656">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616656</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138858</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>濾波器元件及其製作方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241101B">H03H9/46</main-classification>
        <further-classification edition="200601120241101B">H03H7/01</further-classification>
        <further-classification edition="200601120241101B">H05K3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華新科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾明燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝育容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳惠如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞業武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種濾波器元件及其製作方法，濾波器元件包含有一基板、至少一電容圖層及複數電極片。電容圖層形成於基板內部且具有調整開孔，用於調整電容圖層的面積。如此一來，即便已預製好的第二生胚薄帶上的電容圖層均已印刷完成，也可通過調整開孔調整電容圖層的面積，來調整濾波器元件的元件成品的頻率偏移電性，讓濾波器元件的元件成品得以通過電性測試。因此，已預製好電容圖層的第二生胚薄帶便可再利用，以減少資源的浪費，並且能夠節約濾波器元件的製作成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:濾波器元件</p>
        <p type="p">11:基板</p>
        <p type="p">12:電容圖層</p>
        <p type="p">121:調整開孔</p>
        <p type="p">13:導通孔</p>
        <p type="p">131:導電膏</p>
        <p type="p">14:電極片</p>
        <p type="p">15:電感圖層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="430" publication-number="202616485">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616485</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138866</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙面封裝晶片載板及應用其之雙面晶片封裝結構</chinese-title>
        <english-title>DOUBLE-SIDE PACKAGING CHIP CARRIER AND DOUBLE-SIDE PACKAGING STRUCTURE USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241028B">H01L23/28</main-classification>
        <further-classification edition="200601120241028B">H01L23/488</further-classification>
        <further-classification edition="200601120241028B">H01L23/525</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>景碩科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINSUS INTERCONNECT TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊佳霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIA-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱蔚菁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, WEI-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種雙面封裝晶片載板，包含基底層、第一線路層、複數個第一保護層及第二線路層、第二保護層、第三線路層、第三保護層、第四線路層、第一防銲層及第二防銲層。第一線路層包含第一晶片接點。複數個第一保護層及第二線路層於第一線路層上依序地堆疊。第三線路層包含第二晶片接點。第三保護層與基底層具有共同暴露出第一晶片接點的開槽。第四線路層位於第三保護層上，具有複數個銲接接點。第一防銲層位於第四線路層上，暴露出銲接接點。第二防銲層位於第三線路層上，暴露出第二晶片接點。雙面封裝晶片載板的厚度大於250μm，且開槽的深度大於100μm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A double-side packaging chip carrier includes a base layer, a first circuit layer, a plurality of first protective layers and a plurality of second circuit layers, a second protective layer, a third circuit layer, a third protective layer, a fourth circuit layer, The first solder mask layer and the second solder mask layer. The first circuit layer includes first chip contacts. The first protective layers and the second circuit layers are sequentially stacked on the first circuit layer. The third circuit layer includes the second chip contacts. The third protective layer and the base layer have a groove exposing the first chip contacts. The fourth circuit layer is on the third protective layer and has a plurality of soldering contacts. The first solder mask layer is on the fourth circuit layer but exposes the soldering contacts. The second solder mask layer is on the third circuit layer but exposes the second chip contact. The thickness of the double-side packaging chip carrier is greater than 250 μm, and the depth of the groove is greater than 100 μm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:雙面封裝晶片載板</p>
        <p type="p">11:基底層</p>
        <p type="p">11A:第一表面</p>
        <p type="p">11B:第二表面</p>
        <p type="p">13:第一保護層</p>
        <p type="p">131:第一連通開口</p>
        <p type="p">15:第二保護層</p>
        <p type="p">151:第二連通開口</p>
        <p type="p">21:第一線路層</p>
        <p type="p">211:第一晶片接點</p>
        <p type="p">23:第二線路層</p>
        <p type="p">25:第三線路層</p>
        <p type="p">251:第二晶片接點</p>
        <p type="p">253:連接接點</p>
        <p type="p">31:第三保護層</p>
        <p type="p">311:第三連通開口</p>
        <p type="p">313:開槽</p>
        <p type="p">33:第四線路層</p>
        <p type="p">331:銲接接點</p>
        <p type="p">41:第一防銲層</p>
        <p type="p">411:第一防銲開口</p>
        <p type="p">43:第二防銲層</p>
        <p type="p">431:第二防銲開槽</p>
        <p type="p">433:第三防銲開槽</p>
        <p type="p">P1:第一間距</p>
        <p type="p">P2:第二間距</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="431" publication-number="202616296">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616296</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138867</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>軟體驗證系統</chinese-title>
        <english-title>SOFTWARE VERIFICATION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250110B">G16H20/10</main-classification>
        <further-classification edition="201801120250110B">G16H70/40</further-classification>
        <further-classification edition="202001120250110B">G06F30/27</further-classification>
        <further-classification edition="200601120250110B">G06N3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康得漢股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CADUHAMMER CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王經富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHING-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳右穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YOU-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方毓廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅伃君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, YU-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SHIH-ZHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡居諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提出一種軟體驗證系統，適於驗證軟體標的，所述軟體標的用以處理二維資訊。軟體驗證系統包含輸入介面、執行環境、雜訊生成模組以及統計模組。輸入介面用以加載二維資訊。執行環境用以掛載以運行軟體標的，軟體標的於執行環境運行之期間讀取二維資訊，以產生第一檢測結果。雜訊生成模組用以讀取二維資訊並對二維資訊進行雜訊處理後，產生二維干擾資訊，軟體標的於執行環境運行之期間讀取二維干擾資訊，以產生第二檢測結果；以及統計模組用以統計第一檢測結果及第二檢測結果，以產生驗證結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A software verification system is provided. The system is configured to verify a software target, which is capable of processing two-dimensional information. The system includes an input interface, an execution environment, a noise generation module and a statistical module. The input interface is configured to load the two-dimensional information. The execution environment is configured to execute the software target, which reads the two-dimensional information during its runtime to generate a first detection result. The noise generation module is configured to process the two-dimensional information to generate two-dimensional interference information. The software target reads the two-dimensional interference information during its runtime to generate a second detection result. The statistical module is configured to analyze the first detection result and the second detection result, generating a verification result.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:軟體驗證系統</p>
        <p type="p">101:輸入介面</p>
        <p type="p">102:執行環境</p>
        <p type="p">103:雜訊生成模組</p>
        <p type="p">104:統計模組</p>
        <p type="p">20:軟體標的</p>
        <p type="p">901:二維資訊</p>
        <p type="p">903:驗證結果</p>
        <p type="p">N1:二維干擾資訊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="432" publication-number="202615870">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615870</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138868</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於高壓測試之探針卡模組、其晶圓檢測設備及其檢測方法</chinese-title>
        <english-title>PROBE CARD MODULE FOR HIGH VOLTAGE TESTING, WAFER TESTING DEVICE HAVING THE SAME AND WAFER TESTING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241101B">G01R1/04</main-classification>
        <further-classification edition="200601120241101B">G01R1/073</further-classification>
        <further-classification edition="202001120241101B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>致茂電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHROMA ATE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王勝弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHENG-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林享億</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIANG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃政誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於高壓測試之探針卡模組，包括基板、固定環及活動環，固定環耦接於基板，活動環耦接於固定環，固定環之內側表面、活動環之內側表面以及基板形成一壓力腔，基板的探針的一端延伸於壓力腔內。此外，該活動環受一致動器之驅使而相對固定環移動，以使壓力腔內的氣體壓力發生改變。因此，根據壓力腔內的氣體壓力，主動地調控活動環位置，可有效地維持壓力腔內的氣體壓力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A probe card module for high voltage testing comprises a base plate, a fixed ring, and a movable ring. The fixed ring is coupled to the base plate. The movable ring is coupled to the fixed ring. An inside surface of the fixed ring, an inside surface of the movable ring, and the base plate are formed as a pressure chamber. An end of a probe of the base plate is extended to the pressure chamber. Besides, the movable ring is driven by an activator to move along the fixed ring, so that a gas pressure of the pressure chamber is changed. As a result, the gas pressure within the pressure chamber can be effectively maintained by actively adjusting the position of the movable ring according to the gas pressure inside the pressure chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:探針卡模組</p>
        <p type="p">10:晶圓檢測設備</p>
        <p type="p">13:連接架</p>
        <p type="p">15:壓力感測器</p>
        <p type="p">16:溫度感測器</p>
        <p type="p">17:晶圓載盤</p>
        <p type="p">18:溫度調節器</p>
        <p type="p">19:距離感測器</p>
        <p type="p">20:致動器</p>
        <p type="p">35:待測晶圓</p>
        <p type="p">40:固定板</p>
        <p type="p">50:活動環</p>
        <p type="p">60:固定環</p>
        <p type="p">610:壓力腔</p>
        <p type="p">70:基板</p>
        <p type="p">71:探針</p>
        <p type="p">D1:下降方向</p>
        <p type="p">D2:上升方向</p>
        <p type="p">P:氣體壓力</p>
        <p type="p">g:間隙</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="433" publication-number="202614967">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614967</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138871</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>非接觸式脈搏量測裝置</chinese-title>
        <english-title>NON-CONTACT PULSE MONITORING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241106B">A61B5/024</main-classification>
        <further-classification edition="202101120241106B">A61B5/05</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>空軍航空技術學院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIR FORCE INSTITUTE OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳威龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, WEI-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭康峻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, KANG-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳峰蒼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, FENG TSANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張啟威</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種非接觸式脈搏量測裝置，其包含一載體、一第一驅動板、一第二驅動板、一基座及一非接觸式感測器，該第一驅動板活動地結合於該載體，使該第一驅動板可擺動及/或移動，該第二驅動板活動地結合於該第一驅動板，使該第二驅動板可移動及/或擺動，該基座活動地結合於該第二驅動板，使該基座可移動及/或轉動，該非接觸式感測器結合於該基座，並隨著該基座移動，以對一脈搏進行量測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A non-contact pulse monitoring device includes a carrier, a first driving plate, a second driving plate, a base and a non-contact sensor. The first driving plate is movable mounted on the carrier and able to be swung and/or moved. The second driving plate is movable mounted on the first driving plate and able to be swung and/or moved. The base is movable mounted on the second driving plate and able to be moved and/or rotated. The non-contact sensor is mounted on the base and can be moved with the base for pulse monitoring.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:非接觸式脈搏量測裝置</p>
        <p type="p">110:載體</p>
        <p type="p">111:載板</p>
        <p type="p">112:本體部</p>
        <p type="p">113:第一導槽</p>
        <p type="p">114:第二導槽</p>
        <p type="p">120:第一驅動板</p>
        <p type="p">121:第一結合部</p>
        <p type="p">122:第一支持部</p>
        <p type="p">124:弧形穿槽</p>
        <p type="p">125:第三導槽</p>
        <p type="p">130:第二驅動板</p>
        <p type="p">131:第二結合部</p>
        <p type="p">132:第二支持部</p>
        <p type="p">133:第四導槽</p>
        <p type="p">134:第五導槽</p>
        <p type="p">140:基座</p>
        <p type="p">141:間隔部</p>
        <p type="p">150:非接觸式感測器</p>
        <p type="p">D1:第一結合件</p>
        <p type="p">D2:第二結合件</p>
        <p type="p">D3:第三結合件</p>
        <p type="p">P:樞接件</p>
        <p type="p">S:空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="434" publication-number="202615697">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615697</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138883</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>碳化矽磊晶結構與形成碳化矽磊晶結構的方法</chinese-title>
        <english-title>METHOD FOR FORMING SILICON CARBIDE EPITAXIAL STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">C23C16/32</main-classification>
        <further-classification edition="200601120250602B">C23C16/455</further-classification>
        <further-classification edition="200601120250602B">C23C16/52</further-classification>
        <further-classification edition="200601120250602B">H01L21/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華旭先進股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUA HSU ADVANCED TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俐彤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, LI-TONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭樵陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHIAO-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾頎堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, CHI-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林秉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種碳化矽磊晶結構，包含碳化矽晶種層、碳化矽緩衝層、以及碳化矽漂移層。碳化矽緩衝層設置在碳化矽晶種層上，並包含至少一組的緩衝疊層。每組的緩衝疊層包含一層的碳化矽缺陷轉換層與一層的碳化矽磊晶層。碳化矽漂移層設置在碳化矽緩衝層上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A silicon carbide epitaxial structure includes a silicon carbide seed layer, a silicon carbide buffer layer, and a silicon carbide drift layer. The silicon carbide buffer layer is disposed on the silicon carbide seed layer and includes at least one set of buffer stack. Each set of the buffer stack includes a silicon carbide defect conversion layer and a silicon carbide epitaxial layer. The silicon carbide drift layer is disposed on the silicon carbide buffer layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:碳化矽磊晶結構</p>
        <p type="p">110:碳化矽晶種層</p>
        <p type="p">111:表面</p>
        <p type="p">120:碳化矽緩衝層</p>
        <p type="p">121:碳化矽缺陷轉換層</p>
        <p type="p">122:表面</p>
        <p type="p">125:碳化矽磊晶層</p>
        <p type="p">129:緩衝疊層</p>
        <p type="p">130:碳化矽漂移層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="435" publication-number="202616626">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616626</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138885</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>諧振轉換器及其控制方法</chinese-title>
        <english-title>RESONANT CONVERTER AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250109B">H02M3/156</main-classification>
        <further-classification edition="200601120250109B">H02M7/217</further-classification>
        <further-classification edition="200601120250109B">H02M1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MING-HSUEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種諧振轉換器，變壓器包含一次側繞組及兩個二次側繞組，諧振電路包含兩個串聯的第一開關，整流電路包含兩個串聯的第二開關及輸出端，輸出端連接於兩個二次側繞組之間的連接點，感測電路感測輸出端的電壓及電流的至少其中之一，根據電壓及電流的至少其中之一分別提供複數個開關控制信號給兩個第一開關及兩個第二開關，控制器對應設置該些開關控制信號的起始頻率與輸出端的電壓及電流的至少其中之一呈現反向關係，更控制該些開關控制信號由起始頻率下降，且控制該些開關控制信號間的時序偏移下降，使輸出端的電壓達到預設電壓值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a resonant converter. The transformer includes a primary winding and two secondary windings. The resonant circuit includes two first switches connected in series. The rectifier circuit includes two second switches connected in series and an output terminal. The output terminal is connected to a connection point between the two secondary windings. The detect circuit detects at least one of the voltage and the current of the output terminal and provides a plurality of switch control signals to the two first switches and the two second switches according to at least one of the voltage and the current. The controller controls the starting frequency of the plurality of switching control signals and at least one of the voltage and the current of the output terminal having a negative relationship correspondingly. The controller controls the plurality of switching control signals to decrease from the starting frequency. The timing offset between the plurality of switch control signals is controlled to decrease so that the voltage of the output terminal reaches a preset voltage value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:諧振轉換器</p>
        <p type="p">2:電源</p>
        <p type="p">3:負載</p>
        <p type="p">4:諧振電路</p>
        <p type="p">5:變壓器</p>
        <p type="p">51:一次側繞組</p>
        <p type="p">511:第一端</p>
        <p type="p">512:第二端</p>
        <p type="p">52:第一二次側繞組</p>
        <p type="p">521:第一端</p>
        <p type="p">522:第二端</p>
        <p type="p">53:第二二次側繞組</p>
        <p type="p">531:第一端</p>
        <p type="p">532:第二端</p>
        <p type="p">6:整流電路</p>
        <p type="p">7:感測電路</p>
        <p type="p">8:控制器</p>
        <p type="p">9:保護電路</p>
        <p type="p">Co1:第一輸出電容</p>
        <p type="p">Co2:第二輸出電容</p>
        <p type="p">Cr1、Cr2:第一電容</p>
        <p type="p">Cr3:第二電容</p>
        <p type="p">L1:第一電感</p>
        <p type="p">L2:第二電感</p>
        <p type="p">M1:第一中點</p>
        <p type="p">M2:第二中點</p>
        <p type="p">M3:第三中點</p>
        <p type="p">M4:第四中點</p>
        <p type="p">Q1、Q2:第一開關</p>
        <p type="p">Q3、Q4:第二開關</p>
        <p type="p">Q5:輸出開關</p>
        <p type="p">Vo:總輸出端</p>
        <p type="p">VoL:本地輸出端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="436" publication-number="202616066">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616066</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138892</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於生成式人工智能的自動化腳本生成方法及其系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250203B">G06F8/33</main-classification>
        <further-classification edition="201801120250203B">G06F8/41</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>視旅科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫士牧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, SHIMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳緯帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEIFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昀翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YUNHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳全正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種基於生成式人工智能的自動化腳本生成方法及其系統，該系統包括一流程語庫模組、一流程腳本配置模組、一生成式語言模組、一溝通介面模組與一腳本程式生成模組，其中，該生成式語言模組根據該流程腳本配置模組所提供的數據類型，自該流程語庫模組中選擇問題模板，並生成對應的自然語言的問句，之後，經由該溝通介面模組呈現問句與接收使用者的回答訊息，又，該生成式語言模組能解析該回答訊息，以提取至少一數據後，將各該數據經由該流程腳本配置模組傳送至該腳本程式生成模組，令該腳本程式生成模組能生成一完整腳本程式。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">S01~S08:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="437" publication-number="202614982">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614982</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138900</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>點眼液瓶</chinese-title>
        <english-title>EYE DROP BOTTLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241118B">A61F9/00</main-classification>
        <further-classification edition="200601120241118B">A61K9/08</further-classification>
        <further-classification edition="200601120241118B">A61P27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>視陽光學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VISCO VISION INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾錦港</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, CHIN-KANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐聖凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, SHENG-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊博智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, PO-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種點眼液瓶包括瓶身、瓶頭及瓶蓋。瓶身包括瓶身擠壓部、及瓶身螺接段，瓶身螺接段形成於瓶身擠壓部的上方。瓶身螺接段的頂端形成液體填充口。瓶頭包括瓶頭螺接段及出液段。瓶頭螺接段螺接於瓶身螺接段。出液段具有出液口。瓶蓋螺接於瓶頭之出液段。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An eye drop bottle includes a bottle body, a bottle head and a bottle cap. The bottle body includes a bottle pressing portion and a body screwing section. The body screwing section is formed above the bottle pressing portion. A top of the body screwing section forms a liquid filling port. The bottle head includes a head screwing section, and a liquid outlet section. The head screwing section is screwed to the body screwing section. The liquid outlet section has a liquid outlet. The bottle cap is screwed to the liquid outlet section.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:點眼液瓶</p>
        <p type="p">10:瓶身</p>
        <p type="p">11:瓶身擠壓部</p>
        <p type="p">12:頸部段</p>
        <p type="p">13:瓶身螺接段</p>
        <p type="p">130:液體填充口</p>
        <p type="p">132:瓶身外螺紋</p>
        <p type="p">20:瓶頭</p>
        <p type="p">21:瓶頭螺接段</p>
        <p type="p">22:緩衝段</p>
        <p type="p">23:出液段</p>
        <p type="p">230:出液口</p>
        <p type="p">232:瓶頭外螺紋</p>
        <p type="p">30:瓶蓋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="438" publication-number="202616129">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616129</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138902</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靜態隨機存取記憶體的佈局圖案以及其製作方法</chinese-title>
        <english-title>LAYOUT PATTERN OF STATIC RANDOM ACCESS MEMORY AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120241101B">G06F30/392</main-classification>
        <further-classification edition="202301120241101B">H10B10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何立軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, LI-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱亮維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, LIANG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宗訓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TSUNG-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾俊硯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, CHUN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHU-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭有策</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YU-TSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種靜態隨機存取記憶體的佈局圖案，包含一第一區域與一第二區域相鄰，一第一SRAM單元位於該第一區域內，該第一區域內包含有一第一擴散區，一第二SRAM單元位於該第二區域內，該第二區域內包含有一第二擴散區，一閘極結構，跨越該第一擴散區並且構成該第一SRAM單元的一第一傳輸閘電晶體，該閘極結構跨越該第二擴散區並且構成該第二SRAM單元的一第二傳輸閘電晶體，其中該閘極結構沿著一第一方向延伸，且與該閘極結構重疊的該第一擴散區與該第二擴散區在該第一方向上不相連。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a layout pattern of a static random access memory, which comprises a first region adjacent to a second region, a first SRAM cell located in the first region, a first diffusion region in the first region, and a second SRAM cell located in the second region, which comprises a second diffusion region. A gate structure spans the first diffusion region and constitutes a first pass gate transistor of the first SRAM cell, and the gate structure spans the second diffusion region and constitutes a second pass gate transistor of the second SRAM cell, wherein the gate structure extends along a first direction, and the first diffusion region overlapping with the gate structure and the second diffusion region overlapping with the gate structure are not connected in the first direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">AA:主動區</p>
        <p type="p">CT:接觸插塞</p>
        <p type="p">CT-B1:連接位元線的接觸插塞</p>
        <p type="p">CT-B2:連接位元線的接觸插塞</p>
        <p type="p">D3:擴散區(第一擴散區)</p>
        <p type="p">D4:擴散區(第二擴散區)</p>
        <p type="p">Diff:擴散區</p>
        <p type="p">G:閘極結構</p>
        <p type="p">G3:閘極結構</p>
        <p type="p">G4:閘極結構</p>
        <p type="p">M0:第零金屬層</p>
        <p type="p">N&lt;sup&gt;+&lt;/sup&gt;-Diff:N型擴散區</p>
        <p type="p">P1:提取接觸插塞</p>
        <p type="p">P2:提取接觸插塞</p>
        <p type="p">P&lt;sup&gt;+&lt;/sup&gt;-Diff:P型擴散區</p>
        <p type="p">PU2:第二上拉電晶體</p>
        <p type="p">PD2:第二下拉電晶體</p>
        <p type="p">PG2:第二傳輸閘電晶體</p>
        <p type="p">R21:區域</p>
        <p type="p">R22:區域</p>
        <p type="p">R23:區域</p>
        <p type="p">R24:區域</p>
        <p type="p">STI:淺溝隔離</p>
        <p type="p">STI-1:淺溝隔離</p>
        <p type="p">STI-2:淺溝隔離</p>
        <p type="p">Vcc:電壓源</p>
        <p type="p">Vss:電壓源</p>
        <p type="p">WL:字元線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="439" publication-number="202615127">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615127</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138912</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>碳匯教育之桌遊</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241218B">A63F1/04</main-classification>
        <further-classification edition="200601120241218B">G09B19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣亞學校財團法人育達科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志菁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志菁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉安鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作乃提供一種碳匯教育之桌遊，其包括：一闖關地圖、複數張命運卡、複數張機會卡、複數個旗座、一個點數骰子、複數個碳球；藉由上述之教具，乃可讓幼兒進行桌遊的比賽，讓幼兒透過桌遊方式，來學習及認識碳匯（碳儲存）的知識，並且透過桌遊正確辨識和學習到各種有益和傷害碳儲存的行為，協助幼兒從小建立正向的碳匯知識與行為。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:闖關地圖</p>
        <p type="p">21:地圖路徑</p>
        <p type="p">210:起點關卡</p>
        <p type="p">211:第一關卡</p>
        <p type="p">212:第二關卡</p>
        <p type="p">213:第三關卡</p>
        <p type="p">214:第四關卡</p>
        <p type="p">215:第五關卡</p>
        <p type="p">216:第六關卡</p>
        <p type="p">217:第七關卡</p>
        <p type="p">218:第八關卡</p>
        <p type="p">219:第九關卡</p>
        <p type="p">220:第十關卡</p>
        <p type="p">221:第十一關卡</p>
        <p type="p">222:第十二關卡</p>
        <p type="p">223:第十三關卡</p>
        <p type="p">224:第十四關卡</p>
        <p type="p">225:命運關卡</p>
        <p type="p">226:暫停關卡</p>
        <p type="p">227:機會關卡</p>
        <p type="p">23:命運卡放置區</p>
        <p type="p">24:機會卡放置區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="440" publication-number="202615749">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615749</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138913</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>針織雙面色織織物的圓針織機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">D04B15/68</main-classification>
        <further-classification edition="200601120241230B">D04B23/08</further-classification>
        <further-classification edition="200601120241230B">D04B1/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佰龍機械廠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI LUNG MACHINERY MILL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIH-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江滔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種針織雙面色織織物的圓針織機，包含一針筒，一針盤，一針筒山角組，一針盤山角組，至少一喂紗嘴及至少一選針器。該針筒包含複數第一織針，該針盤包含複數第二織針，該些第一織針針織形成一雙面織物的正面，該些第二織針針織形成該雙面織物的背面。該至少一喂紗嘴喂入一第一色紗與一第二色紗。該些第一織針每一具有一第一軌跡及一第二軌跡，該些第一織針每一於該第一軌跡僅勾引該第一色紗成圈，該些第一織針每一於該第二軌跡僅勾引該第二色紗成圈。該些第二織針每一受該針盤山角組導引僅具單一軌跡，且勾引該第一色紗與該第二色紗成圈。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">211:第一織針</p>
        <p type="p">31:第一軌跡</p>
        <p type="p">32:第二軌跡</p>
        <p type="p">331:第一出針段</p>
        <p type="p">332:第一收針段</p>
        <p type="p">333:保持段</p>
        <p type="p">334:成環段</p>
        <p type="p">335:第二出針段</p>
        <p type="p">336:第二收針段</p>
        <p type="p">34:第三軌跡</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="441" publication-number="202615748">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615748</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138914</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙面色織織物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241031B">D04B1/10</main-classification>
        <further-classification edition="200601120241031B">D04B21/06</further-classification>
        <further-classification edition="200601120241031B">D04B15/68</further-classification>
        <further-classification edition="202101120241031B">D03D15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佰龍機械廠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI LUNG MACHINERY MILL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIH-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江滔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種雙面色織織物，包含複數正面紗圈及複數背面紗圈。該雙面色織織物由至少二色紗針織形成，該些正面紗圈每一分別由該至少二色紗其中之一針織形成，該些背面紗圈每一由該至少二色紗共同針織形成，該雙面色織織物的正面由該至少二色紗產生變化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:雙面色織織物</p>
        <p type="p">21:正面紗圈</p>
        <p type="p">22:背面紗圈</p>
        <p type="p">30、31:色紗</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="442" publication-number="202615780">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615780</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138926</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防撓曲破壞之襯套</chinese-title>
        <english-title>BUSHING FOR ANTI-FLEX BREAKAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250123B">F16C33/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝清耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, QING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝清耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, QING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種防撓曲破壞之襯套組件，適用於一組裝系統，該組裝系統包括一趁套本體、一動力本體、一支撐本體、一軸心，其中該動力本體具有動力本體軸套，該支撐本體具有支撐本體支架套管，將軸心穿射於該支撐本體支架套管及動力本體軸套，並套設於兩端襯套本體，並利用螺姆鎖固(圖示未示出)，且具有防塵外蓋本體設置於襯套本體外。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bushing assembly is suitable for an assembly system, the assembly system comprises a set of bodies, a power body, a support body, and an axis, wherein the power body has a power body shaft sleeve, the support body has a support body support sleeve, the shaft is penetrated to the support body support sleeve and the power body shaft sleeve, and is sleeved at two ends of the bushing body, and is locked by a nut, and has a dust-proof outer cover body and is arranged outside the bushing body.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:襯套本體</p>
        <p type="p">2:支撐本體</p>
        <p type="p">3:動力本體</p>
        <p type="p">4:軸心</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="443" publication-number="202616172">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616172</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138928</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>留言處理分派方法及系統</chinese-title>
        <english-title>DISPATCHING METHOD AND SYSTEM FOR MESSAGE HANDLING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250102B">G06Q10/10</main-classification>
        <further-classification edition="202301120250102B">G06Q30/01</further-classification>
        <further-classification edition="201201120250102B">G06Q50/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>玉山商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>E.SUN COMMERCIAL BANK, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝宇瀚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, YU-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹亞婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, YA-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭紫心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, TZU-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳逸璟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, I-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭仁柏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, JEN-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏睿陞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, JUI-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖子瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, TZU-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王竣平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUN-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種留言處理分派系統，適用於與一前台伺服器及一客服端電子裝置電連接，並包含一處理單元及一儲存單元。該處理單元電連接該前台伺服器及該客服端電子裝置。該儲存單元電連接該處理單元並儲存有一語言處理模型。該處理單元自該前台伺服器取得多筆分別包括多筆留言的待處理案件後，利用該語言處理模型分析該等留言以辨識出每一留言的一語意內容，並比對每一語意內容與一優先處理條件的相符程度，產生每一待處理案件的一比對結果。該處理單元根據該等比對結果產生一處理順序，並根據該處理順序依序將該等待處理案件傳送至該客服端電子裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A dispatching system for message handling adapted to electrically connect to a front-end server and a customer service electronic device is provided. The dispatching system for message handling includes a processing unit and a storage unit. The processing unit is electrically connected to the front-end server and the customer service electronic device. The storage unit is electrically connected to the processing unit and stores a language processing model. The processing unit obtains a plurality of pending cases including a plurality message respectively from the front-end server. The processing unit uses the language processing model to analyze the plurality of messages to identify a semantic content of each message, and compares the degree of consistency of each semantic content with a priority processing condition to generate a comparison result of each pending case. The processing unit generates a processing order according to the comparison result, and sequentially transmits the plurality of pending cases to the customer service electronic device according to the processing order.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:留言處理分派系統</p>
        <p type="p">10:前台伺服器</p>
        <p type="p">20:客服端電子裝置</p>
        <p type="p">1:處理單元</p>
        <p type="p">2:儲存單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="444" publication-number="202616636">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616636</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138929</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>馬達控制裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120241126B">H02P7/29</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>至上電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖貫淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, KUAN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡益帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, I-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種馬達控制裝置，用於接收一命令訊號，並驅動一馬達。該馬達控制裝置包含一將該命令訊號轉換為一查找參考值的控制器、一將該查找參考值對照一查找資料轉換為一目標馬達驅動參數的查找模組、一將該目標馬達驅動參數轉換為一脈波調變訊號的轉換模組，及一根據該脈波調變訊號產生一電力訊號以控制該馬達的驅動模組。透過該控制器、內建該查找資料的該查找模組、該轉換模組和該驅動模組將該命令訊號轉換為該電力訊號驅動該馬達，達成本發明不外加硬體設備，透過內建查找資料更精確控制馬達之目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:控制器</p>
        <p type="p">2:查找模組</p>
        <p type="p">21:限制器</p>
        <p type="p">22:積分器</p>
        <p type="p">23:查找單元</p>
        <p type="p">3:轉換模組</p>
        <p type="p">4:驅動模組</p>
        <p type="p">5:霍爾傳感器</p>
        <p type="p">61:馬達控制驅動器</p>
        <p type="p">62:馬達</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="445" publication-number="202614918">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614918</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138931</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智能寵物陪伴裝置</chinese-title>
        <english-title>INTELLIGENT PET COMPANION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241031B">A01K13/00</main-classification>
        <further-classification edition="200601120241031B">A01K15/02</further-classification>
        <further-classification edition="200601120241031B">A01K5/02</further-classification>
        <further-classification edition="200601120241031B">A01K7/02</further-classification>
        <further-classification edition="200601120241031B">A01K29/00</further-classification>
        <further-classification edition="202201120241031B">H04L67/12</further-classification>
        <further-classification edition="201801120241031B">H04W4/029</further-classification>
        <further-classification edition="202101120241031B">H04M1/72415</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龍華科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUNGHWA UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯莉蓁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, LI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳佳莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIA-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉展睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHAN-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉紜綺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YUN-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-SHUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種智能寵物陪伴裝置，包括有智能攝影機機器人以及充電基座。該智能攝影機機器人包括殼體以及設置於殼體內第一容置空間的第一充電裝置。該充電基座包括底座、設置於該底座一側的保護裝置、設置於保護裝置第二容置空間內壁的第二充電裝置，以及樞設於該保護裝置外側上的防撥動裝置。藉由上述，該第一充電裝置與該第二充電裝置完成電訊連接，該防撥動裝置進行該旋轉位移運動，貼靠於該智能攝影機機器人的一側，並固定該智能攝影機機器人於該第二容置空間中，以防止該智能攝影機機器人進行充電時被寵物拍打撥動而與該充電基座分離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention provides an intelligent pet companion device, including an intelligent camera robot and a charging base. The smart camera robot includes a housing and a first charging device disposed in a first accommodation space in the housing. The charging base includes a base, a protection device disposed on one side of the base, a second charging device disposed on the inner wall of the second accommodation space of the protection device, and an anti-toggle device pivoted on the outside of the protection device. Through the above, the first charging device and the second charging device complete the telecommunications connection, and the anti-toggle device performs the rotation displacement movement, so that the anti-toggle device is close to one side of the smart camera robot, and at the same time, the anti-toggle device The anti-toggle device fixes the smart camera robot in the second accommodation space to prevent the smart camera robot from being patted and toggled by a pet and separated from the charging base when charging.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:智能寵物陪伴裝置</p>
        <p type="p">2:智能攝影機機器人</p>
        <p type="p">251:攝影機</p>
        <p type="p">252:收音麥克風</p>
        <p type="p">253:雷射發射器</p>
        <p type="p">254:音箱</p>
        <p type="p">31:底座</p>
        <p type="p">311:引導部</p>
        <p type="p">32:保護裝置</p>
        <p type="p">35:防撥動裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="446" publication-number="202614917">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614917</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138932</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>寵物互動餵食機及其餵食方法</chinese-title>
        <english-title>PET INTERACTIVE FEEDING MACHINE AND FEEDING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241118B">A01K5/01</main-classification>
        <further-classification edition="200601120241118B">A01K5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龍華科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUNGHWA UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳佳莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIA-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯莉蓁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, LI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉紜綺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YUN-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉展睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHAN-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-SHUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種寵物互動餵食機，包括有一殼體、一位移裝置、一控制裝置、一互動裝置以及一投食裝置。該殼體具有一第一容置空間，且該殼體為不倒翁結構。該位移裝置設置於該殼體底部，且該位移裝置能夠將該殼體進行一位移運動。該控制裝置設置於該第一容置空間，該控制裝置與該位移裝置電訊連接。該互動裝置設置於該第一容置空間，該互動裝置與該控制裝置電訊連接，以及該投食裝置設置於該第一容置空間，該投食裝置與該控制裝置電訊連接。藉由上述，該寵物互動餵食機能夠進行該位移運動，且與一寵物進行互動以及餵食。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides an interactive pet feeding machine, which includes a housing, a displacement device, a control device, an interactive device and a feeding device. The housing has a first accommodation space, and the housing has a tumbler structure. The displacement device is arranged at the bottom of the housing, and the displacement device can perform a displacement movement of the housing. The control device is disposed in the first accommodation space, and the control device is electrically connected to the displacement device. The interactive device is disposed in the first accommodation space and is electrically connected to the control device. The feeding device is disposed in the first accommodation space and the feeding device is electrically connected to the control device. Through the above, the pet interactive feeding machine can perform the displacement movement and interact with and feed a pet.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:寵物互動餵食機</p>
        <p type="p">11:第一定位裝置</p>
        <p type="p">2:殼體</p>
        <p type="p">21:第一容置空間</p>
        <p type="p">22:孔洞</p>
        <p type="p">3:位移裝置</p>
        <p type="p">4:控制裝置</p>
        <p type="p">41:主電路板</p>
        <p type="p">42:控制晶片</p>
        <p type="p">5:互動裝置</p>
        <p type="p">51:攝影機</p>
        <p type="p">52:收音麥克風</p>
        <p type="p">53:紅外線發射器</p>
        <p type="p">54:音箱</p>
        <p type="p">55:感應器</p>
        <p type="p">6:投食裝置</p>
        <p type="p">61:儲存空間</p>
        <p type="p">62:餵食管</p>
        <p type="p">7:智慧行動裝置</p>
        <p type="p">8:電池</p>
        <p type="p">81:第一充電裝置</p>
        <p type="p">S:位移運動</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="447" publication-number="202616863">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616863</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138937</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10D62/10</main-classification>
        <further-classification edition="202501120250102B">H10D62/80</further-classification>
        <further-classification edition="202501120250102B">H10D48/00</further-classification>
        <further-classification edition="202501120250102B">H10D30/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凃伯璁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, PO-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王祥駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HSIANG-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞琴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUI-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝長諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHANG-YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳暉宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIEH, DE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉伯淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, PO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李柏璁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, PO-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭浩中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, HAO-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體結構包括第一半導體層、第二半導體層、多個第三半導體結構、導電層以及絕緣層。第一半導體層設置於基底之上。第二半導體層設置於第一半導體層上。多個第三半導體結構設置於第二半導體層上。導電層設置於多個第三半導體結構之上。絕緣層設置於導電層與多個第三半導體結構之間，以將導電層與多個第三半導體結構電性隔離。二維電子氣通道形成於第一半導體層的一部分中，第一半導體層的該部分在垂直方向上與多個第三半導體結構不重疊，且二維電子氣通道靠近第一半導體層與第二半導體層的界面。垂直方向平行於基底的頂面的法線方向。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure includes a first semiconductor layer, a second semiconductor layer, a plurality of third semiconductor structures, a conductive layer and an insulating layer. The first semiconductor layer is disposed over a substrate. The second semiconductor layer is disposed on the first semiconductor layer. The plurality of third semiconductor structures are disposed on the second semiconductor layer. The conductive layer is disposed over the plurality of third semiconductor structures. The insulating layer is disposed between the conductive layer and the plurality of third semiconductor structures to electrically isolate the conductive layer from the plurality of third semiconductor structures. A two-dimensional electron gas channel is formed in a portion of the first semiconductor layer, the portion of the first semiconductor layer is not overlapped with the third semiconductor structures in a vertical direction, and the two-dimensional electron gas channel is located near an interface between the first semiconductor layer and the second semiconductor layer. The vertical direction is parallel to a normal direction of a top surface of the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體結構</p>
        <p type="p">100:基底</p>
        <p type="p">110:第一半導體層</p>
        <p type="p">120:第二半導體層</p>
        <p type="p">130:第三半導體結構</p>
        <p type="p">140:絕緣層</p>
        <p type="p">150:導電層</p>
        <p type="p">CH:二維電子氣通道</p>
        <p type="p">G:閘極</p>
        <p type="p">L1:距離</p>
        <p type="p">d1:第一方向</p>
        <p type="p">d3:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="448" publication-number="202616808">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616808</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138938</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及安裝配件</chinese-title>
        <english-title>ELECTRONIC DEVICE AND MOUNTING ACCESSORY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241218B">H05K13/04</main-classification>
        <further-classification edition="200601120241218B">F16M11/04</further-classification>
        <further-classification edition="200601120241218B">F16M11/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威盛電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIA TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張啟昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHI CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳雅玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YA-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置包括一裝置主體及一安裝配件。安裝配件包括一第一側向支架及一第二側向支架。當第一側向支架及第二側向支架以第一安裝型態安裝至裝置主體時，第一側向支架及第二側向支架提供一組鎖點。當第一側向支架及第二側向支架以第二安裝型態安裝至裝置主體時，第一側向支架及第二側向支架提供另一組鎖點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device is provided with a device body and a mounting accessory. The mounting accessory includes a first lateral bracket and a second lateral bracket. When the first lateral bracket and the second lateral bracket are mounted on the device body in a first mounting configuration, the first lateral bracket and the second lateral bracket provide a set of locking points. When the first lateral bracket and the second lateral bracket are mounted on the device body in a second mounting configuration, the first lateral bracket and the second lateral bracket provide another set of locking points.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:電子裝置</p>
        <p type="p">52:裝置主體</p>
        <p type="p">52a:第一主體側面</p>
        <p type="p">52a-1:第一主體鎖孔</p>
        <p type="p">52b:第二主體側面</p>
        <p type="p">52c:主體底面</p>
        <p type="p">100:安裝配件</p>
        <p type="p">110:第一側向支架</p>
        <p type="p">110a:第一安裝側部</p>
        <p type="p">110a-1:第一下安裝鎖孔</p>
        <p type="p">110a-2:第一上安裝鎖孔</p>
        <p type="p">110b:第一安裝底部</p>
        <p type="p">110b-1:第一底安裝鎖孔</p>
        <p type="p">110b-2:第一底安裝螺柱</p>
        <p type="p">110c:第一加強肋</p>
        <p type="p">120:第二側向支架</p>
        <p type="p">D:距離</p>
        <p type="p">H:高度</p>
        <p type="p">S:螺絲</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="449" publication-number="202616289">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616289</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138939</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於隱藏資料的寫入方法及讀取方法及其記憶體裝置</chinese-title>
        <english-title>WRITING METHOD AND READING METHOD FOR HIDING DATA AND MEMORY DEVICE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">G11C16/06</main-classification>
        <further-classification edition="200601120250102B">G11C16/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旺宏電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周佑亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, YOU-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡文哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, WEN-JER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂君章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHUN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於在記憶體裝置中隱藏資料的寫入方法、讀取方法及其記憶體裝置。記憶體裝置可為具備高容量及高性能的立體NAND快閃記憶體。寫入方法包括：提供記憶體區塊，每個記憶胞包括擦除狀態及多個潛在狀態，每個潛在狀態包括第一子潛在狀態和第二子潛在狀態；執行第一程式化操作，以將特定頁中第一部分的臨界電壓移動至第一子潛在狀態；以及，執行第二程式化操作，以將特定頁中第二部分的臨界電壓移動至第二子潛在狀態。第一程式化操作包括：施加第一通過電壓至第一頁的第一字元線，其中第一頁與特定頁的一側相鄰；以及，施加第二通過電壓至第二頁的第二字元線，其中第二頁與特定頁的另一側相鄰。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A writing method and a reading method for hiding data in a memory device and a memory device thereof are provided. The memory device may be a 3D NAND flash with high capacity and high performance. The writing method includes: providing a memory block, each memory cell including an erase state and potential states, each potential state including a first sub-potential state and a second sub-potential state; performing a first program operation to move threshold voltages of a first portion in a specific page to the first sub-potential state; and, performing a second program operation to move threshold voltages of a second portion in the specific page to the second sub-potential state. The first programmed operation includes: applying a first pass voltage to a first word line of a first page, the first page is adjacent a side of the specific page; and, applying a second pass voltage to a second word line of a second page, the second page is adjacent another side of the specific page.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S410~S440:用於在記憶體裝置中隱藏資料的寫入方法的各步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="450" publication-number="202616853">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616853</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138944</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>碳化矽金屬氧化物半導體場效電晶體及其製造方法</chinese-title>
        <english-title>SIC MOSFET AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10D30/60</main-classification>
        <further-classification edition="202501120250102B">H10D62/83</further-classification>
        <further-classification edition="202501120250102B">H10D64/20</further-classification>
        <further-classification edition="202501120250102B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝宗翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHUANG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李凱霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KAI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳威任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出了一種碳化矽金屬氧化物半導體場效電晶體，包含一碳化矽基底、一閘極氧化層位於該碳化矽基底上、一隔離氧化層位於該閘極氧化層上、兩個閘極分別位於該隔離氧化層兩側的該閘極氧化層上，其中該兩閘極都具有一延伸部向內延伸至該隔離氧化層上、兩個源極分別位於該閘極氧化層兩側的該碳化矽基底中、以及一汲極接觸金屬位於該碳化矽基底相對於該閘極氧化層的另一面上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A SiC MOSFET is provided in the present invention, including a SiC substrate, a gate oxide layer on the SiC substrate, an isolation oxide layer on the gate oxide layer, two gates respectively on the gate oxide layer at two sides of the isolation oxide layer, wherein the two gates are both provided with an extending part extending inwardly on said isolation oxide layer, two sources respectively in the SiC substrate at two sides of the gate oxide layer, and a drain contact metal on the other side of the SiC substrate opposite to the gate oxide layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基底</p>
        <p type="p">102:漂移區</p>
        <p type="p">104:P型井</p>
        <p type="p">106:閘極氧化層</p>
        <p type="p">114a:隔離氧化層</p>
        <p type="p">124:鈍化層</p>
        <p type="p">126:延伸部</p>
        <p type="p">128:源極接觸金屬</p>
        <p type="p">B:基極</p>
        <p type="p">D:汲極接觸金屬</p>
        <p type="p">d1:第一方向</p>
        <p type="p">G1:(第一)閘極</p>
        <p type="p">G2:(第二)閘極</p>
        <p type="p">JFET:接面場效電晶體</p>
        <p type="p">S:源極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="451" publication-number="202615906">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615906</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138945</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>導光板、背光模組及顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241017B">G02B6/00</main-classification>
        <further-classification edition="200601120241017B">G02F1/13357</further-classification>
        <further-classification edition="200601120241017B">G02F1/1335</further-classification>
        <further-classification edition="200601120241017B">G02F1/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞儀光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳蔚軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾元振</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種導光板、背光模組及顯示裝置，背光模組包括所述導光板，顯示裝置包括所述背光模組，其中，導光板於其板體之反入光側之凹槽設有調光單元，調光單元的第一反射部設於二第二反射部之間，且第一反射部與第二反射部具有不同的調光特性，在光線入射至導光板時，藉以利用相異調光特性之第一反射部與第二反射部配置在凹槽的周壁，調節在板體之凹槽周邊區域之明暗差異，使光源入射至導光板時能達到良好的光均勻度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:導光板</p>
        <p type="p">11:板體</p>
        <p type="p">113:反入光側</p>
        <p type="p">114:側邊</p>
        <p type="p">115:凹槽</p>
        <p type="p">1151:槽底壁</p>
        <p type="p">1152:槽邊壁</p>
        <p type="p">12:調光單元</p>
        <p type="p">121:第一反射部</p>
        <p type="p">122:第二反射部</p>
        <p type="p">123:反射片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="452" publication-number="202616444">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616444</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138946</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶舟裝置及電漿解離爐管系統</chinese-title>
        <english-title>CRYSTAL BOAT DEVICE AND PLASMA DISSOCIATION FURNACE TUBE SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">H01L21/673</main-classification>
        <further-classification edition="200601120241105B">C23C16/458</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李政熹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZHENG XI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃秉敦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PING TUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪政源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHENG-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉昌鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, CHANG-SIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種晶舟裝置，包含第一正、負電極板、電漿區、鍍膜區、及饋入區。第一負電極板與第一正電極板相對。電漿區、鍍膜區、及饋入區均設於第一正、負電極板之間。電漿區包含數個第二正、負電極板。鍍膜區與電漿區之間相隔第一斷路區。鍍膜區包含數個第三正、負電極板，每個第三正、負電極板可承載數個晶片。饋入區與鍍膜區之間相隔第二斷路區。饋入區包含數個第四正、負電極板，且饋入區與電漿區電性連接。第二正、負電極板，第三正、負電極板，及第四正、負電極板，均與第一正、負電極板以正負交錯方式彼此間隔排列。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wafer boat device includes s first positive electrode plate, a first negative electrode plates, a plasma region, a coating region, and a feed region. The first negative electrode plate is opposite to the first positive electrode plate. The plasma region, the coating region, and the feed region are all located between the first positive electrode plate and the first negative electrode plate. The plasma region includes plural second positive electrode plates and plural second negative electrode plates. The coating region and the plasma region are separated from each other by a first circuit breaking region. The coating area includes plural third positive electrode plates and plural third negative electrode plates, and each of the third positive electrode plates and the third negative electrode plates can carry plural cells. The feed region and the coating region are separated from each other by a second circuit breaking region. The feed region includes plural fourth positive electrode plates and plural fourth negative electrode plates, and the feed region is electrically connected to the plasma region. The second positive electrode plates and the second negative electrode plates, the third positive electrode plates and the third negative electrode plates, and the fourth positive electrode plates and the fourth negative electrode plates are arranged at intervals from each other in a staggered manner with the first positive electrode plate and the first negative electrode plate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:晶舟裝置</p>
        <p type="p">110a:第一正電極板</p>
        <p type="p">110b:第一正電極板</p>
        <p type="p">120:第一負電極板</p>
        <p type="p">130:電漿區</p>
        <p type="p">132:第二正電極板</p>
        <p type="p">134:第二負電極板</p>
        <p type="p">140:鍍膜區</p>
        <p type="p">142:第三正電極板</p>
        <p type="p">144:第三負電極板</p>
        <p type="p">150:饋入區</p>
        <p type="p">152:第四正電極板</p>
        <p type="p">154:第四負電極板</p>
        <p type="p">160:第一斷路區</p>
        <p type="p">170:第二斷路區</p>
        <p type="p">180:連接單元</p>
        <p type="p">190:連接單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="453" publication-number="202616609">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616609</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138955</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>整合空間資訊之電網配置鏈結方法</chinese-title>
        <english-title>ELECTRIC NETWORK TRACKING METHOD INTEGRATING SPATIAL INFORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">H02J13/00</main-classification>
        <further-classification edition="202401120241104B">G06Q50/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國家原子能科技研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL ATOMIC RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹振旻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, CHEN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾興嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TZENG, SING-JIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐奉璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種整合空間資訊之電網配置鏈結方法，以開關為例，正確地描述可連接的開關資訊，可據以顯示其單線配置，從而識別電網的組成。藉此，本方法不僅符合當前電力公司的實際操作，更進一步標記不可連接部分的空間資訊，以便於後續在軟體系統或現場硬體設備端進行檢查，對於電網中的特殊結構，如並聯形式，也能進行標記與顯示。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A electric network tracking method integrating spatial information, taking switches as an example, correctly describes the information of switches that can be connected, and can display their single-line configurations, so as to identify the composition of the power grid. Therefore, this method not only conforms to the actual operation of the current power company, but also further marks the spatial information of the non-connectable part, so as to facilitate the subsequent inspection on the software system or the field hardware equipment, and can also mark and display the special structure in the power grid, such as the parallel form.</p>
      </isu-abst>
      <representative-img>
        <p type="p">s11~s30:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="454" publication-number="202615171">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615171</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138958</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>異材質墊體回收設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120241204B">B09B3/32</main-classification>
        <further-classification edition="202201120241204B">B09B3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詠興機械工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林清賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作異材質墊體回收設備包含一破碎裝置、一出料輸送帶、一一般收集區、一分料輸送帶、一磁力篩選機、一撞擊分選機及一餘料回收裝置，異材質墊體經該破碎裝置破碎後輸出至該出料輸送帶，該分料輸送帶與該出料輸送帶相鄰，該磁力篩選機跨設於該出料輸送帶上方並能將異材質物料篩選區分為具有磁性的混和物料及不具磁性的一般物料，一般物料輸送至一般收集區，該撞擊分選機將混和物料中的彈簧碎片分離，而剩餘物料由餘料回收裝置收集，如此能將異材質墊體中不同回收性質的材料確實分類回收，無須透過人工拆解所述異材質墊體，提升回收效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:破碎裝置</p>
        <p type="p">11:入料道</p>
        <p type="p">12:二軸破碎機</p>
        <p type="p">13:四軸破碎機</p>
        <p type="p">20:出料輸送帶</p>
        <p type="p">30:一般收集區</p>
        <p type="p">31:一般收集槽</p>
        <p type="p">40:分料輸送帶</p>
        <p type="p">50:磁力篩選機</p>
        <p type="p">60:撞擊分選機</p>
        <p type="p">70:餘料回收裝置</p>
        <p type="p">71:旋風收集器</p>
        <p type="p">72:袋式集塵器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="455" publication-number="202616641">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616641</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138964</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種大尺寸可調透光率之輕質太陽能發電模組</chinese-title>
        <english-title>A LARGE-SIZE LIGHTWEIGHT SOLAR PANEL MODULE WITH ADJUSTABLE LIGHT TRANSMITTANCE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120250102B">H02S40/20</main-classification>
        <further-classification edition="201401120250102B">H02S40/30</further-classification>
        <further-classification edition="201401120250102B">H02S20/23</further-classification>
        <further-classification edition="202501120250102B">H10F19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鴻文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HON WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>宜蘭縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鴻文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HON WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種大尺寸可調透光率之輕質太陽能發電模組，可應用於農棚透光屋頂、軍用掩體頂面、魚電共生裝置頂面等各式空間體頂面上覆蓋功能，及具有降低成本、安全、便攜性、高功率、快速佈置特性，又能達到太陽能發電的需求。該大尺寸可調透光率之輕質太陽能發電模組，包含：太陽能發電單元、大尺寸的透明基板、連接線組、固定層的結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A large-size lightweight solar panel module with adjustable light transmittance technology can be applied to various building rooftops, such as transparent roofs of agricultural greenhouses, military bunker tops, fishery and solar symbiosis device tops, container tops, cold chain vehicle roofs, and sunshade roofs. It offers advantages such as cost reduction, safety, portability, high power output, and rapid deployment, while also meeting the demand for solar power generation. For instance, for large-scale coverage, power generation, and adjustable light transmittance in agricultural greenhouses or fishery and solar symbiosis fields, solar power generation components with a flexible, lightweight, and reinforced substrate are required.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:大尺寸可調透光率之輕質太陽能發電模組結構</p>
        <p type="p">2:太陽能發電單元</p>
        <p type="p">24:導電連接層</p>
        <p type="p">3:透明基板</p>
        <p type="p">31:雙層式多個密閉氣室透明基板</p>
        <p type="p">311:獨立密閉氣室</p>
        <p type="p">32:單層式透明基板</p>
        <p type="p">33:單層透明邊緣板</p>
        <p type="p">331:扣接式機構</p>
        <p type="p">4:連接線組</p>
        <p type="p">41:正極端頭</p>
        <p type="p">42:負極端頭</p>
        <p type="p">5:固定層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="456" publication-number="202616044">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616044</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138965</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電源管理裝置及電源轉換的方法</chinese-title>
        <english-title>POWER MANAGEMENT DEVICE AND METHOD FOR POWER CONVERSION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">G06F1/26</main-classification>
        <further-classification edition="200601120250102B">H02M3/156</further-classification>
        <further-classification edition="200601120250102B">H02M1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仁寶電腦工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COMPAL ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余和年</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, HO-NIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電源管理裝置及電源轉換的方法。電源管理裝置包括降壓電路、升壓電路、第一以及第二O型環二極體電路。降壓電路將輸入電源提供的輸入電壓調整為第一電壓。嵌入式控制器基於第一電壓而啟動且被供電。升壓電路將第一電壓調整為第二電壓。系統裝置基於第二電壓而啟動且被供電。經啟動的系統裝置分別在第一及第二替代電源路徑上提供第一及第二替代電源。在啟動系統裝置之後，第一及第二O型環二極體電路分別將第一及第二替代電源供電給嵌入式控制器及系統裝置。降壓電路與升壓電路在系統裝置被啟動且經過預定延遲時間之後被關閉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power management device and a method for power conversion are provided. The power management device includes a buck circuit, a boost circuit, and a first and a second O-ring diode circuits. The buck circuit adjusts an input voltage provided by an input power source to a first voltage. An embedded controller is activated and powered based on the first voltage. The boost circuit adjusts the first voltage to a second voltage. A system device is activated and powered based on the second voltage. The activated system device provides a first and second alternative power source on the first and second alternative power paths, respectively. After the system device is activated, the first and second O-ring diode circuits supply the first and second alternative power sources to the embedded controller and system device, respectively. The buck circuit and the boost converter circuit are turned off after the system device is activated and a predetermined delay time has passed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電源管理裝置</p>
        <p type="p">110:降壓電路</p>
        <p type="p">120:升壓電路</p>
        <p type="p">130:第一O型環二極體電路</p>
        <p type="p">140:第二O型環二極體電路</p>
        <p type="p">150:嵌入式控制器</p>
        <p type="p">160:系統裝置</p>
        <p type="p">Vin:輸入電壓</p>
        <p type="p">V1:第一電壓</p>
        <p type="p">V2:第二電壓</p>
        <p type="p">ALTP1:第一替代電源路徑</p>
        <p type="p">ALTP2:第二替代電源路徑</p>
        <p type="p">VA1:第一替代電源</p>
        <p type="p">VA2:第二替代電源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="457" publication-number="202614920">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614920</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138967</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種噴射式太陽能養殖用水調控裝置</chinese-title>
        <english-title>A SOLAR-POWERED JET-TYPE WATER REGULATION DEVICE FOR AQUACULTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241128B">A01K63/04</main-classification>
        <further-classification edition="201701120241128B">A01K61/00</further-classification>
        <further-classification edition="201401120241128B">H02S10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鴻文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HON WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>宜蘭縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鴻文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HON WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的一種噴射式太陽能養殖用水調控裝置可應用於養殖用水調控上，包含：一浮體單元，由至少一浮體組成，提供水管理裝置浮力；一保護外殼體，安置於浮體上方及內置水體管理系統；一太陽能發電模組，貼附於保護外殼體外表面；一水體管理系統，內置儲能單元、臭氧產生器、流體噴射器、電路控制器、數據傳送與接收單元等，安裝於機體內部；一定向定位器，置於水管理裝置前後，連接纜繩及錨來固定水管理裝置方向與位置；一工作狀態監測系統，內置水質檢測單元、數據傳送與接收單元，安置於機體內部。使用太陽能供應綠電，具有降低成本、安全、高效率、即時監控水體狀態，又能達到水體消毒的需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The solar-powered jet-type water regulation device for aquaculture, as described in this invention, can be applied to managing aquaculture water. It includes: a floating unit consisting of at least one float, which provides buoyancy for the water management device; a protective housing placed above the float, housing the water management system; a solar power generation module attached to the outer surface of the protective housing; a water management system inside the device, which contains an energy storage unit, an ozone generator, a gas injector, a circuit controller, and a data transmission and reception unit, all installed within the main body; a directional positioning system, located at the front and back of the water management device, connected to ropes and anchors to fix the direction and position of the device; and an operational status monitoring system, equipped with a water quality detection unit and a data transmission and reception unit, also installed inside the main body. Powered by solar energy, this device provides green electricity, ensuring cost reduction, safety, high efficiency, real-time monitoring of water conditions, while also meeting the need for water disinfection.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:一種噴射式太陽能養殖用水調控裝置</p>
        <p type="p">2:浮體單元</p>
        <p type="p">21:浮體</p>
        <p type="p">3:保護外殼體</p>
        <p type="p">4:太陽能發電模組</p>
        <p type="p">5:水體管理系統</p>
        <p type="p">51:儲能單元</p>
        <p type="p">52:臭氧產生器</p>
        <p type="p">53:流體噴射器</p>
        <p type="p">54:電路控制器</p>
        <p type="p">55:工作狀態監測系統</p>
        <p type="p">551:水質檢測單元</p>
        <p type="p">552:數據傳送與接收單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="458" publication-number="202614976">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614976</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138969</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>綁帶固定裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241031B">A61B17/56</main-classification>
        <further-classification edition="200601120241031B">A61B17/00</further-classification>
        <further-classification edition="200601120241031B">A61F5/37</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>強骨生醫器材股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNGU BIOMEDICAL DEVICE CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宜蓁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊佳儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐維彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種綁帶固定裝置，適於將一綁帶固定於一固定物且包括一本體、一固定件以及一鎖固件。本體包括一冠部、一身部以及一固持部，其中冠部形成有一鎖固孔，且鎖固孔沿一縱向延伸；身部連接於冠部且形成有一固定孔，固定孔沿一橫向延伸且連通鎖固孔；固持部連接於身部且形成有一固持槽以及一貫孔，固持槽適於與固定物的至少一部份彼此卡掣，且固持槽透過貫孔連通固定孔。固定件適於穿設於固定孔且包括一固定面以及一受抵面，其中固定面對應於固定物的一表面的至少一部份，且受抵面相對於固定面配置。鎖固件適於穿設於鎖固孔且包括一抵頂面，且抵頂面選擇性地抵接於受抵面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:綁帶固定裝置</p>
        <p type="p">100:本體</p>
        <p type="p">200:固定件</p>
        <p type="p">300:鎖固件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="459" publication-number="202615834">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615834</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138971</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>漏水偵測裝置及其偵測方法</chinese-title>
        <english-title>WATER LEAKAGE DETECTION DEVICE AND DETECTION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">G01M3/38</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳啓鐘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHI-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種漏水偵測裝置及漏水偵測方法。漏水偵測裝置包括一漏水感知帶、一處理器、一紅外線成像感測器及一無線通訊發射模組。漏水感知帶用以偵測是否發生漏水。處理器電性連接於漏水感知帶。紅外線成像感測器連接於處理器。紅外線成像感測器用以偵測漏水範圍。無線通訊發射模組連接於處理器。無線通訊發射模組用以傳送一漏水偵測結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A water leakage detection device and a detection method thereof are provided. The water leakage detection device includes a leakage sensing tape, a processor, an infrared imaging sensor and a wireless communication transmitting module. The leakage sensing tape is used to detect whether a water leakage occurs. The processor is electrically connected to the water leakage sensing tape. The infrared imaging sensor is connected to the processor. The infrared imaging sensor is used to detect a water leakage area. The wireless communication transmitting module is connected to the processor. The wireless communication transmitting module is used to transmit a water leakage detection result.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:漏水感知帶</p>
        <p type="p">110:電源監控器</p>
        <p type="p">120:電源控制器</p>
        <p type="p">130:電源保護器</p>
        <p type="p">140:切換電路</p>
        <p type="p">150:訊號放大器</p>
        <p type="p">160:處理器</p>
        <p type="p">170:濕度感測器</p>
        <p type="p">180:無線通訊發射模組</p>
        <p type="p">190:紅外線成像感測器</p>
        <p type="p">1000:漏水偵測裝置</p>
        <p type="p">HM:濕度變化</p>
        <p type="p">IM1:溫度分布影像</p>
        <p type="p">RI:訊號接收強度</p>
        <p type="p">RS1:漏水偵測結果</p>
        <p type="p">RS7:水霧偵測結果</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="460" publication-number="202615807">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615807</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138973</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>風機過濾裝置及其控制方法</chinese-title>
        <english-title>FAN FILTER UNIT AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">F24F13/28</main-classification>
        <further-classification edition="201801120241204B">F24F11/32</further-classification>
        <further-classification edition="201801120241204B">F24F11/39</further-classification>
        <further-classification edition="200601120241204B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱錦鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHIN-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李瑞鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JUI-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊鴻民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUANG, HUNG-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種風機過濾裝置及其控制方法。風機過濾裝置包括一風扇及一控制模組。控制模組包括一邏輯判斷電路、一風機電源及一控制電路。邏輯判斷電路連接於一半導體機台之一機台電源。邏輯判斷電路用以判斷機台電源是否跳脫。控制電路連接於風機電源及邏輯判斷電路。若機台電源跳脫，則控制電路將風扇之一供電路徑從機台電源切換為風機電源。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fan filter unit and a control method thereof are provided. The fan filter unit includes a fan and a control module. The control module includes a logic judgment circuit, a fan power supply and a control circuit. The logic judgment circuit is connected to an apparatus power supply of a semiconductor apparatus. The logic judgment circuit is used to judge whether the apparatus power supply is shut down. The control circuit is connected to the fan power supply and the logic judgment circuit. If the apparatus power supply is shut down, the control circuit switches a fan power supply path from the apparatus power supply to the fan power supply.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:風機過濾裝置</p>
        <p type="p">110:風扇</p>
        <p type="p">120:控制模組</p>
        <p type="p">121:邏輯判斷電路</p>
        <p type="p">122:風機電源</p>
        <p type="p">1221:交流電源連接埠</p>
        <p type="p">1222:充電電池</p>
        <p type="p">123:控制電路</p>
        <p type="p">124:風機緊急斷電開關</p>
        <p type="p">125:偵測電路</p>
        <p type="p">126:通訊電路</p>
        <p type="p">600:伺服器</p>
        <p type="p">700:雲端</p>
        <p type="p">800:接地端</p>
        <p type="p">900:半導體機台</p>
        <p type="p">922:機台電源</p>
        <p type="p">924:機台緊急斷電開關</p>
        <p type="p">EV:異常事件</p>
        <p type="p">IX:健康指數</p>
        <p type="p">PH1:供電路徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="461" publication-number="202616120">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616120</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138975</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鍵盤安全裝置及鍵盤安全方法</chinese-title>
        <english-title>KEYBOARD SECURITY DEVICE AND KEYBOARD SECURITY METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250102B">G06F21/83</main-classification>
        <further-classification edition="200601120250102B">G06F3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯保辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, PAO-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鍵盤安全裝置，包含：鍵盤控制模組，用於當鍵盤被使用時，輸出打字資訊；音訊訊號控制模組，用於當麥克風模組開啟時，輸出第一原始音訊訊號；智能學習模組，用於：基於從鍵盤控制模組接收的打字資訊及從音訊訊號控制模組接收的第一原始音訊訊號，產生額外音訊訊號；以及輸出額外音訊訊號；以及混合聲音模組，用於：響應於觸發訊號，混合從音訊訊號控制模組接收的第二原始音訊訊號及從智能學習模組接收的額外音訊訊號，以產生混合音訊訊號；以及輸出混合音訊訊號。第一原始音訊訊號對應於打字資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A keyboard security device, comprising: a keyboard control module for outputting typing information when a keyboard is used; an audio signal control module for outputting a first original audio signal when a microphone module is turned on; an intelligent learning module for: generating an additional audio signal based on the typing information received from the keyboard control module and the first original audio signal received from the audio signal control module; and outputting the additional audio signal; and a mixed sound module for: mixing, in response to a trigger signal, a second original audio signal received from the audio signal control module and the additional audio signal received from the intelligent learning module to generate a mixed audio signal; and outputting the mixed audio signal. The first original audio signal corresponds to the typing information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:鍵盤安全裝置</p>
        <p type="p">110:鍵盤控制模組</p>
        <p type="p">110A:鍵盤</p>
        <p type="p">120:音訊訊號控制模組</p>
        <p type="p">120A:麥克風模組</p>
        <p type="p">130:智能學習模組</p>
        <p type="p">140:混合聲音模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="462" publication-number="202615804">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615804</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138976</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人工智慧調控的空調系統</chinese-title>
        <english-title>AI-MODULATED AIR CONDITION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120241030B">F24F11/46</main-classification>
        <further-classification edition="201801120241030B">F24F11/65</further-classification>
        <further-classification edition="201801120241030B">F24F11/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>志天實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VOLITION INDUSTRIAL CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>千植昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, CHIH-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝逢鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, FENG-JIUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡冠彣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明乃揭示一種人工智慧調控的空調系統，包括：一空調單元；以及一人工智慧控制單元，耦接該空調單元，使該空調單元在該人工智慧控制單元的動態調控下進行運轉，並使該空調系統的電源使用效率值維持在一較低的預定值，達到節能減碳之目標。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses an AI-modulated air condition system including an air condition unit and an AI- modulated unit coupled to the air condition unit. The air condition unit is operated under the dynamic control of the AI-modulated unit, thereby the power efficiency value of the AI-modulated air condition system can be maintained at a lower predetermined value to achieve the goal of energy saving and carbon reduction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:人工智慧調控的空調系統</p>
        <p type="p">100:空調單元</p>
        <p type="p">200:人工智慧控制單元</p>
        <p type="p">210:環境參數收集模組</p>
        <p type="p">230:深度學習模組</p>
        <p type="p">250:溫度預測值校正模組</p>
        <p type="p">270:人工智慧人員偵測模組</p>
        <p type="p">280:空調單元溫度設定模組</p>
        <p type="p">290:體感溫度偵測模組</p>
        <p type="p">P:存在人員的數目</p>
        <p type="p">T:溫度值</p>
        <p type="p">Tf:存在人員的體感溫度</p>
        <p type="p">Ts:空間內環境溫度</p>
        <p type="p">Tp:預測的空調溫度數值</p>
        <p type="p">Tc:校正的空調溫度設定值Tc</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="463" publication-number="202615756">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615756</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138979</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>隔熱通風裝置</chinese-title>
        <english-title>INSULATED VENTILATING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241105B">E03F3/04</main-classification>
        <further-classification edition="200601120241105B">F16L9/133</further-classification>
        <further-classification edition="200601120241105B">F16L59/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉愉如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YU-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉康研</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KANG-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉愉如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YU-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉康研</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KANG-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉子銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TZU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種隔熱通風裝置，用以設置於水泥結構中的排水管內，以解決排水管內溫度過高的問題。係包含：一內管；一導流管，該導流管環繞於該內管的外側，且該導流管的內管壁與該內管的外管壁保持間隔，該導流管具有一導流管第一端及一導流管第二端，該導流管在該導流管第一端的管徑大於在導流管第二端的管徑；及一支撐件，該支撐件連接該內管及該導流管，以使該內管及該導流管之間保持相對位置。藉此可以達成在不影響排水功能的前提下，降低排水管內溫度的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An insulated ventilating device for installation within a drainage pipe of concrete structures to address the problem of high temperature inside the drainage pipe. The insulated ventilating device comprises: an inner tube; a flow-guiding tube circumferentially arranged around an outer side of the inner tube, with an inner wall of the flow-guiding tube spaced apart from an outer wall of the inner tube, wherein the flow-guiding tube has a flow-guiding tube first end and a flow-guiding tube second end, and wherein a diameter at the flow-guiding tube first end is greater than a diameter at the flow-guiding tube second end; and a support member connecting the inner tube and the flow-guiding tube to maintain a relative position between the inner tube and the flow-guiding tube. The present invention can reduce the temperature within the drainage pipe without affecting its drainage function.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:內管</p>
        <p type="p">1a:內管第一端</p>
        <p type="p">1b:內管第二端</p>
        <p type="p">2:導流管</p>
        <p type="p">2a:導流管第一端</p>
        <p type="p">2b:導流管第二端</p>
        <p type="p">3:支撐件</p>
        <p type="p">31:內支撐件</p>
        <p type="p">32:外支撐件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="464" publication-number="202616368">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616368</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138984</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體元件及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">H01L21/22</main-classification>
        <further-classification edition="200601120250102B">H01L21/265</further-classification>
        <further-classification edition="202501120250102B">H10D30/87</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻揚半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON YOUNG SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安　布</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMAKRISHNAN, ANBALAGAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體元件的製造方法包括執行第一佈植製程，以形成第一摻雜區於磊晶層中。磊晶層與第一摻雜區具有第一導電型。製造方法還包括執行第二佈植製程，以形成第二摻雜區的第一部位於磊晶層中。第二摻雜區的第一部位具有不同於第一導電型的第二導電型且相鄰於第一摻雜區。製造方法還包括執行第三佈植製程，以形成具有第二導電型的第二摻雜區的第二部位於磊晶層中。第二摻雜區的第二部位垂直地位於第一摻雜區下方。製造方法還包括形成電極結構。電極結構電性連接至第一摻雜區與第二摻雜區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of a semiconductor device includes performing a first implantation process to form a first doped region in an epitaxial layer. The epitaxial layer and the first doped region have a first conductive type. The manufacturing method further includes performing a second implantation process to form a first portion of a second doped region in the epitaxial layer. The first portion of the second doped region has a second conductive type that is different from the first conductive type and is adjacent to the first doped region. The manufacturing method further includes performing a third implantation process to form a second portion of the second doped region having the second conductive type in the epitaxial layer. The second portion of the second doped region is vertically below the first doped region. The manufacturing method further includes forming an electrode structure. The electrode structure is electrically connected to the first and second doped regions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體元件</p>
        <p type="p">102,112,114:導電層</p>
        <p type="p">104:基材</p>
        <p type="p">106:磊晶層</p>
        <p type="p">108:第一摻雜區</p>
        <p type="p">110:第二摻雜區</p>
        <p type="p">110-1:第一部位</p>
        <p type="p">110-2:第二部位</p>
        <p type="p">116:鈍化層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="465" publication-number="202616234">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616234</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138985</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>結合行動信令與統計數據推估道路交通流量之系統、方法及其電腦可讀媒介</chinese-title>
        <english-title>SYSTEM, METHOD, AND COMPUTER READABLE MEDIUM FOR ESTIMATING ROAD TRAFFIC FLOW BY COMBINING MOBILE SIGNALING AND STATISTICAL DATA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">G08G1/01</main-classification>
        <further-classification edition="201801120250203B">H04W4/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅彬榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, BIN-ROONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種結合行動信令與統計數據推估道路交通流量之系統、方法及其電腦可讀媒介，包括信令資料擷取模組、資料處理模組以及小汽車當量交通量運算模組，其中，該資料處理模組依據該信令資料擷取模組所取得的目標路段對應之行動信令產生路段移動總旅次，俾令該小汽車當量交通量運算模組依據該路段移動總旅次，且於取得小汽車當量乘載率後，推估出小汽車當量交通流量，故無須使用大量之路段對應的歷史資料以建立及訓練模型，解決不同路段無法適用之問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a system, method and computer-readable medium for estimating road traffic flow by combining mobile signaling and statistical data. The system includes a signaling data acquisition module, a data processing module, and a passenger car unit (PCU) traffic volume calculation module. Wherein, the data processing module generates the total number of travels on the road link based on the mobile signaling corresponding to the target road link obtained by the signaling data acquisition module. And then the passenger car unit traffic volume calculation module can estimate the car equivalent traffic flow according to the number of the total number of travels on the road link and obtained the car equivalent occupancy rate. Therefore, there is no need to use a large number of historical data corresponding to road links to establish and train the model to solve the problem of inapplicability for different road links.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:結合行動信令與統計數據推估道路交通流量之系統</p>
        <p type="p">11:信令資料擷取模組</p>
        <p type="p">12:資料處理模組</p>
        <p type="p">13:小汽車當量交通運算模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="466" publication-number="202615848">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615848</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138986</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像檢測流道</chinese-title>
        <english-title>IMAGE INSPECTION FLOW CHANNEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">G01N21/85</main-classification>
        <further-classification edition="202401120241104B">G01N15/0205</further-classification>
        <further-classification edition="202401120241104B">G01N15/14</further-classification>
        <further-classification edition="202401120241104B">G01N15/075</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邑流微測股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLOWVIEW TEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾翊涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YI-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鈺凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種影像檢測流道，包括本體、觀測窗、檢測流道。本體包括一第一表面以及一第二表面，第一表面包括多個第一孔隙，第二表面包括多個第二孔隙，第一孔隙與第二孔隙之間具有沿第一方向的多個第一流道，第一流道用以連接第一孔隙和第二孔隙。一觀測窗設置於第一流道之間，包括一第一部分以及一第二部分。一檢測流道設置於觀測窗的第一部分和第二部分之間，檢測流道具有一檢測流道口，且檢測流道口的尺寸與第一孔隙的尺寸不同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image detection flow channel includes a body, an observation window, and a detection flow channel. The body includes a first surface and a second surface. The first surface includes a plurality of first pores. The second surface includes a plurality of second pores. There are a plurality of first flow channels located between the first pores and the second pores along the first direction. The first flow channel is configured to connect the first pore and the second pore. An observation window is disposed between the plurality of first flow channels and includes a first part and a second part. A detection flow channel is disposed between the first part and the second part of the observation window. The detection flow channel has a detection flow channel opening, and the size of the detection flow channel opening is different from the size of the first hole.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:影像檢測流道</p>
        <p type="p">110:本體</p>
        <p type="p">110S1:第一表面</p>
        <p type="p">110S2:第二表面</p>
        <p type="p">120:觀測窗</p>
        <p type="p">120a:第一部分</p>
        <p type="p">120b:第二部分</p>
        <p type="p">130:檢測流道</p>
        <p type="p">132a:外部</p>
        <p type="p">132b:底部</p>
        <p type="p">132E1:側部</p>
        <p type="p">140:光學鏡頭</p>
        <p type="p">150:燈源</p>
        <p type="p">D1、D2、D3:方向</p>
        <p type="p">O1:第一孔隙</p>
        <p type="p">r:參考軸</p>
        <p type="p">θ1:夾角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="467" publication-number="202615769">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615769</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138988</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>動態式單擺推力量測系統及方法</chinese-title>
        <english-title>DYNAMIC PENDULUM THRUST MEASUREMENT SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">F03H1/00</main-classification>
        <further-classification edition="200601120241204B">B64G1/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李約亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YUEH-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝勛丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, HSUN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃朝偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHAO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃丙翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PING-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴天琮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種動態式單擺推力量測系統及方法，用於量測推進器所提供之推力。動態式單擺推力量測系統包含擺臂、驅動裝置以及數據擷取裝置。推進器係設於擺臂之擺動端上，藉以形成單擺結構。驅動裝置係使得單擺結構在無推力組擺盪步驟及有推力組擺盪步驟中各自進行往復擺盪過程。其中，在有推力組擺盪步驟中，推進器在該單擺結構具有位能及/或動能時啟動以提供推力。數據擷取裝置用以取得單擺結構進行無推力輔助單擺運動時之無推力輔助擺動數據以及進行有推力輔助單擺運動時之有推力輔助擺動數據，藉以推算出推進器所提供之推力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A dynamic pendulum thrust measurement system and method for measuring the thrust provided by a thruster. The dynamic pendulum thrust measurement system comprises an arm, a driving device, and a data acquisition device. The thruster is mounted on a swinging end of the arm to form a pendulum structure. The driving device causes the pendulum structure to undergo reciprocating swinging processes in both the no-thrust group swinging step and the thrust group swinging step. In particular, in the thrust group swinging step, the thruster is activated to provide the thrust when the pendulum structure has potential and/or kinetic energy. The data acquisition device is used to acquire the no-thrust auxiliary swing data when the pendulum structure performs the no-thrust auxiliary pendulum motion and the thrust auxiliary swing data when the pendulum structure performs the thrust auxiliary pendulum motion, so as to calculate the thrust provided by the thruster.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:動態式單擺推力量測系統</p>
        <p type="p">20:擺臂</p>
        <p type="p">22:懸掛端</p>
        <p type="p">24:擺動端</p>
        <p type="p">25:單擺結構</p>
        <p type="p">26:定位點</p>
        <p type="p">40:驅動裝置</p>
        <p type="p">42:弧狀齒條</p>
        <p type="p">44:半齒輪</p>
        <p type="p">44a:齒輪面</p>
        <p type="p">44b:無齒輪面</p>
        <p type="p">46:轉動元件</p>
        <p type="p">60:數據擷取裝置</p>
        <p type="p">70:支承架</p>
        <p type="p">72:懸掛部</p>
        <p type="p">200:推進器</p>
        <p type="p">Pa:平衡高度</p>
        <p type="p">Pb:釋放高度</p>
        <p type="p">Pc’:折返高度</p>
        <p type="p">G:重力</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="468" publication-number="202615438">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615438</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138989</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鋅金屬有機框架材料及其用途</chinese-title>
        <english-title>ZNIC-BASED METAL-ORGANIC FRAMEWORK MATERIAL AND APPLICATION THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241106B">C07F3/06</main-classification>
        <further-classification edition="200601120241106B">C07C63/26</further-classification>
        <further-classification edition="200601120241106B">C07C69/157</further-classification>
        <further-classification edition="200601120241106B">B01J31/22</further-classification>
        <further-classification edition="202301120241106B">C02F1/58</further-classification>
        <further-classification edition="202101120241106B">C25B1/04</further-classification>
        <further-classification edition="202101120241106B">C25B11/049</further-classification>
        <further-classification edition="200601320241106B">C02F101/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明志科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MING CHI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴怡廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕　亨普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATTAPPAN, DHANAPRABHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鋅金屬有機框架材料，包含鋅金屬離子、配位在該鋅金屬離子上的對苯二甲酸配位基，及配位在該鋅金屬離子上的(2-乙醯氧基)苯甲酸配位基，且該對苯二甲酸配位基是衍生自由廢棄的對苯二甲酸乙二酯經醇解反應所形成的對苯二甲酸。本發明亦提供一種鋅金屬有機框架材料的用途，用於作為光催化降解四環黴素的光觸媒或者作為電解水產氫的觸媒。透過對苯二甲酸配位基及(2-乙醯氧基)苯甲酸配位基，本發明鋅金屬有機框架材料對四環黴素具有高降解性的優點，此外，在電解水產氫上具有低能耗的優點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A Znic-based metal organic framework material comprise zinc metal ion, benzenedicarboxylic acid ligand coordinating on the zinc metal ion, and acetylsalicylic acid ligand coordinating on the zinc metal ion. The benzenedicarboxylic acid ligand is derived from benzenedicarboxylic acid which is formed by alcoholic decomposition of wasted poly(ethylene terephthalate). The present disclosure also provides the use of a Znic-based metal organic framework material for being a photocatalyst of photocatalytic degradation tetracycline or for being a catalyst of water electrolysis to produce hydrogen. Through the benzenedicarboxylic acid ligand and acetylsalicylic acid ligand, the Znic-based metal organic framework material of the present disclosure has the advantages of high degradability to tetracycline and low energy consumption in the water electrolysis to produce hydrogen.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="469" publication-number="202616023">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616023</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138993</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自走式裝置及其直立光達校正方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120241028B">G05D1/24</main-classification>
        <further-classification edition="202401120241028B">G05D1/648</further-classification>
        <further-classification edition="202401320241028B">G05D105/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬潤科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALL RING TECH CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳立昕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LI-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是有關一種自走式裝置及其直立光達校正方法，該自走式裝置的直立光達校正方法包含使自走式裝置之水平光達與直立光達同時對校正件進行感測以分別得到第一感測資料與第二感測資料，使該自走式裝置分析該第一感測資料與該第二感測資料以分別得到第一點雲資料與第二點雲資料，並使顯示屏同時顯示該第一點雲資料及該第二點雲資料；基於該第一點雲資料與該第二點雲資料間的偏差值，對該直立光達補償該水平光達與該直立光達間的誤差。透過上述設計，能夠有效率地校正該直立光達，進而與該水平光達配合建構出正確的環境資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:自走式裝置</p>
        <p type="p">2:裝置單元</p>
        <p type="p">22:驅動輪</p>
        <p type="p">23:支架</p>
        <p type="p">3:光達單元</p>
        <p type="p">31:水平光達</p>
        <p type="p">32:直立光達</p>
        <p type="p">4:防撞單元</p>
        <p type="p">42:第二防撞感測器</p>
        <p type="p">5:顯示屏</p>
        <p type="p">9:校正件</p>
        <p type="p">R2:實際可校正範圍</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="470" publication-number="202615830">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615830</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138995</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分體式測量裝置</chinese-title>
        <english-title>MEASUREMENT DEVICE OF SPLIT TYPE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120250512B">G01K1/14</main-classification>
        <further-classification edition="200601120250512B">G01R1/04</further-classification>
        <further-classification edition="200601120250512B">G01R1/067</further-classification>
        <further-classification edition="200601120250512B">G01R15/18</further-classification>
        <further-classification edition="200601120250512B">G01R19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商路特克股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROOTECH INC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭昌溶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, CHANG-YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卞永福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BYUN, YOUNG-BOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴哉炯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JAE-HYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹成雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, SUNG-WOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔成奉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, SEONG-BONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃在虎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, JAE-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹貞勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUN, JUNG-HUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的分體式測量裝置包括：第1環形芯，在第1電力線路的周圍形成磁性閉合回路，由第1上部芯及第1下部芯組成；以及第2環形芯，在第2電力線路的周圍形成磁性閉合回路，由第2上部芯及第2下部芯組成，上部模組與下部模組之間能夠實現結合及分離，上述上部模組包括用於收容上述第1上部芯及上述第2上部芯的上部外殼，上述下部模組包括用於收容上述第1下部芯及上述第2下部芯的下部外殼，使用上述第1環形芯測量上述第1電力線路的電流，使用上述第2環形芯測量上述第2電力線路的電流，上述分體式測量裝置的特徵在於，上述第1上部芯和上述第1下部芯相互接觸的一對第1接觸區域與上述第2上部芯和上述第2下部芯相互接觸的一對第2接觸區域在上述第1電力線路及上述第2電力線路延伸的方向上相互隔開設置，即在延伸方向上相互隔開設置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The measurement device of split type of the present invention includes a first ring-shaped core, which forms a magnetic closed loop around the first power line and is composed of a first upper core and a first lower core; and, a second ring-shaped core, which is formed a magnetic closed loop around the second power line and is composed of a second upper core and a second lower core. The upper module and the lower module can be combined and separated. The upper module includes a module for accommodating an upper housing of the first upper core and the second upper core. The lower module includes a lower housing for accommodating the first lower core and the second lower core. The first ring-shaped core applies to measure a current of the first power line, and the second ring-shaped core applies to measure a current of the second power line. The measurement device of split type is characterized in that a pair of first contact areas where the first upper core and the first lower core are in contact to each other, and a pair of second contact areas where the second upper core and the second lower core are in contact to each other are spaced apart from each other in a direction in which the first power line and the second power line extend, that is, setting apart from each other in the extension direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:分體式測量裝置</p>
        <p type="p">11a:第1-1接觸區域</p>
        <p type="p">11b:第1-2接觸區域</p>
        <p type="p">12a:第2-1接觸區域</p>
        <p type="p">12b:第2-2接觸區域</p>
        <p type="p">W1、W2:寬度</p>
        <p type="p">T1:第1線路貫通孔</p>
        <p type="p">T2:第2線路貫通孔</p>
        <p type="p">P1:第1側面的突出部分</p>
        <p type="p">P2:第2側面的突出部分</p>
        <p type="p">Q1、Q2:凹陷部分</p>
        <p type="p">L:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="471" publication-number="202615243">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615243</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139006</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具翻模結構之水平臥式油壓機</chinese-title>
        <english-title>HORIZONTAL HYDRAULIC PRESS WITH MOLD TURNING STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B30B15/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東毓油壓機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG YU HYDRAULIC MACHINERY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>南投縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡嘉良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, CHIA-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種具翻模結構之水平臥式油壓機，所述翻模結構具有第一模具固定板及第二模具固定板，將欲壓合之材料放置於所述第一模具固定板之容置空間及所述第二模具固定板之容置空間中，再將所述第一模具固定板及所述第二模具固定板分別進行90度翻轉使其呈現垂直狀態後，藉由油壓之方式將其兩者之容置空間進行合模壓製，以使材料快速壓製成型，提高製程效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a horizontal hydraulic press with a mold turning structure, and the mold turning structure has a first mold fixing plate and a second mold fixing plate. The material to be pressed is placed in the accommodation space of the first mold fixing plate and the accommodation space of the second mold fixing plate, and then the first mold fixing plate and the second mold fixing plate are turned over 90 degrees respectively to make them appear vertical, and the accommodating spaces of the the first mold fixing plate and the second mold fixing plate are clamped and pressed by hydraulic pressure, so that the material can be quickly pressed and formed to improve process efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:具翻模結構之水平臥式油壓機</p>
        <p type="p">2:支架</p>
        <p type="p">3:第一模具固定板</p>
        <p type="p">4:第二模具固定板</p>
        <p type="p">5:第一固定端</p>
        <p type="p">6:移動端</p>
        <p type="p">7:第二固定端</p>
        <p type="p">8:通孔</p>
        <p type="p">9:主油缸</p>
        <p type="p">10:固定桿</p>
        <p type="p">11:翻板油缸</p>
        <p type="p">12:翻板油缸支撐座</p>
        <p type="p">13:翻轉連接件</p>
        <p type="p">14:翻轉支撐件</p>
        <p type="p">15:防落插銷</p>
        <p type="p">16:第一容置空間</p>
        <p type="p">17:第二容置空間</p>
        <p type="p">18:滑軌</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="472" publication-number="202615152">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615152</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139009</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光觸媒液體及其製造方法</chinese-title>
        <english-title>PHOTOCATALYST LIQUID AND METHOD FOR PRODUCING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241017B">B01J37/04</main-classification>
        <further-classification edition="200601120241017B">B01J37/03</further-classification>
        <further-classification edition="200601120241017B">B01J21/06</further-classification>
        <further-classification edition="200601120241017B">B01J23/50</further-classification>
        <further-classification edition="200601120241017B">B01J23/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>昊偉環境科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAO WEI ENVIRONMENTAL TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀朝威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHAO WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案係揭露一種光觸媒液體，該光觸媒液體包含奈米貴金屬粒子，佔該光觸媒液體中的重量百分比的0.01~0.2 wt.%之間且包含奈米銀粒子； 奈米光觸媒材料，佔該光觸媒液體之重量百分比的0.01~25 wt.%之間且包含奈米二氧化鈦粒子及奈米三氧化鎢粒子至少其中之一； 分散劑，佔該光觸媒液體之重量百分比的0.01~5 wt.%；以及溶劑，佔該光觸媒液體之剩餘比例。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A photocatalyst liquid is disclosed. The photocatalyst liquid includes a noble metal nanoparticle having a weight percent of 0.01-0.2 wt.% in the photocatalyst liquid and including a silver nanoparticle, a nano-scale photo-catalytic material having a weight percent of 0.01-25 wt.% in the photocatalyst liquid and including at least one of a titanium dioxide nanoparticle and a tungsten trioxide nanoparticle, a dispersant having a weight percent of 0.01-5 wt.% in the catalyst dispersion solution, and a solvent having a balance in the photocatalyst liquid.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S11、S12、S13、S14:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="473" publication-number="202616584">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616584</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139013</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>改造連接器的方法及其所形成的高速連接器</chinese-title>
        <english-title>METHOD TO MODIFY CONNECTORS AND HIGH-SPEED CONNECTORS CREATED THEREBY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120250418B">H01R13/6477</main-classification>
        <further-classification edition="201101120250418B">H01R13/646</further-classification>
        <further-classification edition="201101120250418B">H01R12/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺北科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李士修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ERIC S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張水美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JUI MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪志偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, JEH WEIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施咸光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, HSIEN KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊世超</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種改造連接器的方法及其所形成的高速連接器。該方法包括在連接器的插座端及其匹配的插頭端兩者內部的訊號端子的部分線段上分別包覆介電材料，並且與在連接器插頭端內的電路板上所提出的兩種修改擇一結合，以增加連接器其傳輸頻寬及提高其資料傳輸速率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a method to modify connectors and high-speed connectors created by the method. The method includes wrapping around some portions of the signal lines with dielectric materials inside the receptacle and its paired plug of a connector, and then combining with one of the two proposed modifications made on the printed circuit board within the plug of the connector. The method increases the transmission bandwidth of the connector, and therefore its data transmission rate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S11~S13及S21~S22:改造連接器的方法的各步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="474" publication-number="202616683">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616683</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139014</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光纖性能偵測系統</chinese-title>
        <english-title>OPTICAL FIBER PERFORMANCE DETECTION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120241231B">H04B10/077</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓哲鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, CHE-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖虹惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, HUNG-HUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>段秉鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUAN, BING-XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林敬博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHING-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳惠珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUEI-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例提供一種光纖性能偵測系統，包括第一光纖偵測裝置及第二光纖偵測裝置。第一光纖偵測裝置外接於主光纖的第一位置，並提供具有第一波長的第一光訊號在主光纖上傳輸，其中第一波長不同於傳輸於主光纖上的主要光訊號的波長。第二光纖偵測裝置外接於主光纖的第二位置，並偵測傳輸於主光纖上的第一光訊號，其中第二光纖偵測裝置經配置以執行：反應於判定未偵測到傳輸於主光纖上的第一光訊號，判定主光纖已故障。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the disclosure provide an optical fiber performance detection system, which includes a first optical fiber detection device and a second optical fiber detection device. The first optical fiber detection device is externally connected to a first position of a main optical fiber and provides a first optical signal with a first wavelength for transmission on the main optical fiber, wherein the first wavelength is different from a wavelength of a primary optical signal transmitted on the main optical fiber. The second optical fiber detection device is externally connected to a second position of the main optical fiber and detects the first optical signal transmitted on the main optical fiber. The second optical fiber detection device is configured to perform: in response to determining that the first optical signal transmitted on the main optical fiber is not detected, determining that the main optical fiber is malfunctioned.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光纖性能偵測系統</p>
        <p type="p">110:第一光纖偵測裝置</p>
        <p type="p">120:第二光纖偵測裝置</p>
        <p type="p">OS1:第一光訊號</p>
        <p type="p">SS:主要光訊號</p>
        <p type="p">112:光源</p>
        <p type="p">111,121:分波濾片</p>
        <p type="p">122:光感測器</p>
        <p type="p">11:主光纖</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="475" publication-number="202614923">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614923</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139022</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高穩定度的理線換線機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241218B">A01K89/015</main-classification>
        <further-classification edition="200601120241218B">A01K89/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周盈君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周盈君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉元琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種高穩定度的理線換線機，至少包含一底座、一驅動馬達、一第一螺母、一彈簧、一線杯、二錐型套體、一第二螺母與一軸承，底座的兩相對側分設有第一支撐架與第二支撐架，驅動馬達設於第一支撐架上，傳動軸與驅動馬達的驅動軸之間連接設有萬向接頭，第一螺母螺接於傳動軸的前端，彈簧、線杯與二錐型套體均套設於傳動軸上，彈簧頂抵第一螺母，二錐型套體分設於線杯的兩側，各錐型套體的錐部頂抵線杯的擋部，第二螺母螺接於傳動軸的中段，第二螺母旋緊時，第二螺母與第一螺母可將錐型套體、線杯與彈簧夾緊固定，軸承樞接於傳動軸的後端並可置於第二支撐架上，達到可高穩定轉動供釣線理線或換線之目的。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:底座</p>
        <p type="p">11:第一支撐架</p>
        <p type="p">12:第二支撐架</p>
        <p type="p">20:驅動馬達</p>
        <p type="p">30:傳動軸</p>
        <p type="p">31:萬向接頭</p>
        <p type="p">40:第一螺母</p>
        <p type="p">41:鎖固件</p>
        <p type="p">50:彈簧</p>
        <p type="p">60:線杯</p>
        <p type="p">61:線軸</p>
        <p type="p">62:擋部</p>
        <p type="p">70:錐型套體</p>
        <p type="p">71:錐部</p>
        <p type="p">80:第二螺母</p>
        <p type="p">90:軸承</p>
        <p type="p">100:阻力片</p>
        <p type="p">110:墊片</p>
        <p type="p">120:捲線器支架</p>
        <p type="p">121:支撐桿</p>
        <p type="p">122:固定桿</p>
        <p type="p">123:第一固定件</p>
        <p type="p">1231:嵌槽</p>
        <p type="p">124:第二固定件</p>
        <p type="p">130:控制單元</p>
        <p type="p">131:開關</p>
        <p type="p">132:調速器</p>
        <p type="p">140:蓋板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="476" publication-number="202616637">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616637</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139023</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於PWM電壓積分電路之馬達狀態估測裝置</chinese-title>
        <english-title>PWM INTEGRATION BASED MOTOR STATE ESTIMATION APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120241104B">H02P21/14</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東訊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECOM CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜顯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, YI HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊士進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHIH CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>易承霈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YI, CHEN PEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊虹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一第一差分電路處理一第一脈波寬度調變降壓訊號及一第二脈波寬度調變降壓訊號以得到一第一脈波寬度調變差分訊號；一第一全波整流電路處理該第一脈波寬度調變差分訊號以得到一第一脈波寬度調變全波訊號；一第一半波整流電路處理該第一脈波寬度調變差分訊號以得到一第一脈波寬度調變半波訊號；一電壓處理單元處理至少該第一脈波寬度調變全波訊號及該第一脈波寬度調變半波訊號以得到一第一相電壓、一第二相電壓及一第三相電壓，並且基於至少該第一相電壓、該第二相電壓及該第三相電壓估測一馬達裝置之一馬達狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A first differential circuit processes a first pulse width modulation buck signal and a second pulse width modulation buck signal to obtain a first pulse width modulation differential signal. A first full wave rectification circuit processes the first pulse width modulation differential signal to obtain a first pulse width modulation full wave signal. A first half wave rectification circuit processes the first pulse width modulation differential signal to obtain a first pulse width modulation half wave signal. A voltage-processing unit processes at least the first pulse width modulation full wave signal and the first pulse width modulation half wave signal to obtain a first phase voltage, a second phase voltage, and a three phase voltage, and estimates a motor state of a motor apparatus based on at least the first phase voltage, the second phase voltage, and the third phase voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基於PWM電壓積分電路之馬達狀態估測裝置</p>
        <p type="p">20:脈波寬度調變驅動裝置</p>
        <p type="p">30:馬達裝置</p>
        <p type="p">108:電壓處理單元</p>
        <p type="p">1021:第一差分電路</p>
        <p type="p">1022:第二差分電路</p>
        <p type="p">1041:第一全波整流電路</p>
        <p type="p">1042:第二全波整流電路</p>
        <p type="p">1061:第一半波整流電路</p>
        <p type="p">1062:第二半波整流電路</p>
        <p type="p">1181:第一降壓電路</p>
        <p type="p">1182:第二降壓電路</p>
        <p type="p">1183:第三降壓電路</p>
        <p type="p">1201:第一電流偵測器</p>
        <p type="p">1202:第二電流偵測器</p>
        <p type="p">ia:第一相電流</p>
        <p type="p">ia1:第一相電流訊號</p>
        <p type="p">ib:第二相電流</p>
        <p type="p">ib1:第二相電流訊號</p>
        <p type="p">Vab1:第一脈波寬度調變差分訊號</p>
        <p type="p">Vab11:第一脈波寬度調變全波訊號</p>
        <p type="p">Vab12:第一脈波寬度調變半波訊號</p>
        <p type="p">VaN:第一脈波寬度調變訊號</p>
        <p type="p">VaN1:第一脈波寬度調變降壓訊號</p>
        <p type="p">Vbc1:第二脈波寬度調變差分訊號</p>
        <p type="p">Vbc11:第二脈波寬度調變全波訊號</p>
        <p type="p">Vbc12:第二脈波寬度調變半波訊號</p>
        <p type="p">VbN:第二脈波寬度調變訊號</p>
        <p type="p">VbN1:第二脈波寬度調變降壓訊號</p>
        <p type="p">VcN:第三脈波寬度調變訊號</p>
        <p type="p">VcN1:第三脈波寬度調變降壓訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="477" publication-number="202614945">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614945</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139025</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可調整寬度電動床</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241120B">A47C19/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>欣上原股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施權航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, CHUAN-HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊育其</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YU-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳邦禮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種可調整寬度電動床，包含有一底架以及多數支撐單元，該些支撐單元位於該底架上方且前後排列，其中，每一該支撐單元包含有一主架體、二滑接件以及一延伸架；該主架體包含有一第一前桿、一第一後桿、以及二第一縱桿以其頂側連接該第一前桿與該第一後桿；每一該滑接件具有一頂壁、一側壁以及一底壁，該二滑接件分別以其頂壁與底壁連接於該第一前桿與該第一後桿而形成一前滑槽與一後滑槽；該延伸架包含有一第二前桿、一第二後桿、以及一第二縱桿設於該第二前桿與該第二後桿之外端，該第二前桿與該第二後桿之內端穿過該前滑槽與該後滑槽。藉此，本發明之電動床可降低包裝或倉儲材積，且消費者能依需要自行調整床架的寬度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:可調整寬度電動床</p>
        <p type="p">10:底架</p>
        <p type="p">16:腳柱</p>
        <p type="p">20:支撐單元</p>
        <p type="p">22:主架體</p>
        <p type="p">23:第一前桿</p>
        <p type="p">24:第一後桿</p>
        <p type="p">25:第一縱桿</p>
        <p type="p">30:滑接件</p>
        <p type="p">40:延伸架</p>
        <p type="p">50:致動器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="478" publication-number="202615305">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615305</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139026</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>瓶口引流器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241101B">B65D23/06</main-classification>
        <further-classification edition="200601120241101B">B65D47/06</further-classification>
        <further-classification edition="200601120241101B">B65D85/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佳冠科技通信有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEST COMMUNICATIONS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>宜蘭縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳維勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳友炘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種瓶口引流器，包括︰一引流器本體，係於底部設有呈內凹之一嵌槽且於頂部形成一內頂部，該嵌槽外側及內側分別形成一內側肉厚及一外側肉厚；一引流嘴，係一體成型設於該引流器本體中央且向上及向後端傾斜延伸且該引流嘴兩側具有延伸至該引流器本體上端之一內凹側緣，該引流嘴內側/或及該引流器本體內側之該內側肉厚中央位於前端設有呈尖錐形狀之一引流道；該引流道形狀係呈錐形狀；利用該引流器本體可套用固定於瓶子其瓶口，利用該引流嘴/或及該引流器本體之該引流道導引該瓶子內部盛裝液體；解決習用品圓形瓶口無法使液體流速平緩及控制之問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:引流器本體</p>
        <p type="p">10:嵌槽</p>
        <p type="p">101:內側肉厚</p>
        <p type="p">102:外側肉厚</p>
        <p type="p">103:內頂部</p>
        <p type="p">11:引流嘴</p>
        <p type="p">110:內凹側緣</p>
        <p type="p">111:引流道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="479" publication-number="202615802">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615802</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139027</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>冷氣冷房功率評估器</chinese-title>
        <english-title>AIR CONDITIONER CAPACITY ESTIMATOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241031B">F24F3/044</main-classification>
        <further-classification edition="200601120241031B">F24F5/00</further-classification>
        <further-classification edition="201801120241031B">F24F11/46</further-classification>
        <further-classification edition="201801120241031B">F24F11/62</further-classification>
        <further-classification edition="200601120241031B">F24F3/06</further-classification>
        <further-classification edition="200601120241031B">F24F13/06</further-classification>
        <further-classification edition="202401120241031B">G06Q50/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>城市學校財團法人臺北城市科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIPEI CITY UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊文治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, WEN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳家偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JIA-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳妤婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡綵庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, CAI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許博瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, BO-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志青</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種冷氣冷房功率評估器，包含：測距部，用以測定該測距部與物體的距離，包含第一測距模組、第二測距模組；轉動部，連接於該測距部；控制部，該控制部電連接於該第一測距模組、該第二測距模組及該轉動部；及輸出部，連接於該控制部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is an air conditioner capacity estimator comprising a distance measurement part which is used to measure the distance between the distance measurement part and an object and including a first distance measurement module and a second distance measurement module; a rotating part which is connected to the distance measurement part; a control part which is electrically connected to the first ranging module, the second ranging module and the rotating part; and a output part which is connected to the control part.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:冷氣冷房功率評估器</p>
        <p type="p">1:測距部</p>
        <p type="p">11:第一測距模組</p>
        <p type="p">12:第二測距模組</p>
        <p type="p">2:轉動部</p>
        <p type="p">3:控制部</p>
        <p type="p">4:輸出部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="480" publication-number="202615754">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615754</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139030</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗壓殼模組及其製造方法</chinese-title>
        <english-title>PRESSURE-RESISTANT MODULE AND ITS MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">E02D29/09</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃奇卿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHI-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃奇卿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHI-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃家鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JIA-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜臨軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEUNG, LIN-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種抗壓殼模組，其包括有至少一外層單元及至少一內層單元，該外層單元包括有一吸震材料、一第一金屬層及多個毛細孔，該第一金屬層包覆該吸震材料，該些毛細孔貫通該吸震材料；該內層單元的彈性軟墊、流體管路、液態水或固態冰包覆於該第二金屬層內；其中，該外層單元的第一金屬層貼附該內層單元的第二金屬層。借此，該耐高壓承壓殼結構可以具有抗壓、抗腐蝕、抗地震功效，並能在受損時可以自動修補裂痕，並提高承壓結構物的承壓能力和使用壽命。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pressure-resistant module is provided, which includes at least one outer unit and at least one inner unit. The outer unit includes a first silicone, a first metal layer, and a plurality of capillaries. The first metal layer covers the first silicone, and the capillaries penetrate through the first silicone. The inner unit includes an elastic cushion, a fluid pipeline, liquid water, or solid ice wrapped inside a second metal layer. The first metal layer of the outer unit is attached to the second metal layer of the inner unit. Thus, the pressure-resistant module can have the effects of pressure resistance, corrosion resistance, and earthquake resistance, and can automatically repair cracks when damaged, thereby improving the pressure-bearing capacity and service life of the pressure-bearing structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:抗壓殼模組</p>
        <p type="p">11:外層單元</p>
        <p type="p">11M:第一金屬層</p>
        <p type="p">114:吸震材料</p>
        <p type="p">115:毛細孔</p>
        <p type="p">12:內層單元</p>
        <p type="p">12M:第二金屬層</p>
        <p type="p">123:彈性軟墊</p>
        <p type="p">124:流體管路</p>
        <p type="p">124A:端部</p>
        <p type="p">71:黏合劑</p>
        <p type="p">81:液態水</p>
        <p type="p">82:固態冰</p>
        <p type="p">91:致冷裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="481" publication-number="202615125">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615125</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139031</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多功能健身器材支架結構</chinese-title>
        <english-title>MULTI-FUNCTIONAL FITNESS EQUIPMENT SUPPORT STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241031B">A63B23/12</main-classification>
        <further-classification edition="200601120241031B">A63B23/00</further-classification>
        <further-classification edition="200601120241031B">A63B23/035</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>百盛全球股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BYZOOM WORLDWIDE LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商特里法健身有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRIPHA FITNESS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳保江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊益松</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明一種多功能健身器材支架結構，其包括:主支撐架頂、底端兩端的中心區段位置分別設有上軸動部及下軸動部；二第一展臂呈ㄈ字狀並以兩端分別樞組於上軸動部及下軸動部，且二第一展臂組係以上軸動部及下軸動部為軸心活動的朝向同側方向樞擺；二第二展臂分別以一端樞接於各第一展臂的底端，且各第二展臂相對所樞接組合之第一展臂活動樞擺，另外在各第二展臂的另一端進一步分別設有地撐組，各地撐組係活動撐抵於地面；及複數健身配件可活動拆卸、組裝於各第一展臂、主支撐架；透過各第一展臂相對主支撐架的樞擺，使其能夠縮減收納上的空間，且快速展開完成以及收納；另外可提供更多元的選擇使用提升使用者在健身上的興趣與熱誠，改善習知的健身器材在使用上，多數為單一健身型態而已，且在展開、收合操作上都必須耗費一番力氣，重點是收合後整體還是佔據過多的收納空間等缺失。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a multi-functional fitness equipment support structure, which includes: an upper shaft moving part and a lower shaft moving part are respectively provided at the central sections at the top and bottom ends of the main support frame; two first arms are U-shaped and The two ends are respectively pivoted to the upper shaft moving part and the lower shaft moving part, and the two first exhibition arm groups are pivoted in the same side direction with the upper shaft moving part and the lower shaft moving part as the axis; the second second exhibition arm group is One end of each arm is pivotally connected to the bottom end of each first boom, and each second boom is movable and pivotable relative to the first boom of the pivotally connected combination. In addition, the other end of each second boom is further provided with a The ground support group, each support group is movable to support the ground; and a plurality of fitness accessories can be movable, disassembled and assembled on each first boom and the main support frame; through the pivoting of each first boom relative to the main support frame, the It can reduce the storage space and quickly unfold and store it; in addition, it can provide more diverse choices to increase users' interest and enthusiasm in fitness, and improve the use of conventional fitness equipment, most of which are single fitness types. It's just a state, and it takes a lot of effort to unfold and fold it. The key point is that after folding, the whole thing still occupies too much storage space and other shortcomings.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:主支撐架</p>
        <p type="p">11:上軸動部</p>
        <p type="p">12:下軸動部</p>
        <p type="p">13:底框</p>
        <p type="p">14:支撐條</p>
        <p type="p">17:插柱</p>
        <p type="p">2:第一展臂</p>
        <p type="p">3:第二展臂</p>
        <p type="p">4:地撐組</p>
        <p type="p">5:健身配件</p>
        <p type="p">51:槓片</p>
        <p type="p">52:槓把</p>
        <p type="p">53:引體向上握把</p>
        <p type="p">7:槓鈴支撐架</p>
        <p type="p">8:高掛組件</p>
        <p type="p">9:球架</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="482" publication-number="202616924">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616924</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139032</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>透明顯示器及其製作方法</chinese-title>
        <english-title>TRANSPARENT DISPLAYS AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10H29/10</main-classification>
        <further-classification edition="202501120250102B">H10H20/85</further-classification>
        <further-classification edition="202501120250102B">H10H20/855</further-classification>
        <further-classification edition="200601120250102B">B29D11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商業成科技（成都）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERFACE TECHNOLOGY (CHENGDU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商業成光電（深圳）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英特盛科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENERAL INTERFACE SOLUTION LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林柏青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PO-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴玟佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, WEN-YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高秉詳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, PING-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種透明顯示器包括一透明驅動板、多個發光元件以及一透明封裝層。該多個發光元件是設置在該透明驅動板上。該透明封裝層覆蓋該多個發光元件，並且該透明封裝層在該多個發光元件的上方的表面具有微透鏡陣列結構。該微透鏡陣列結構的微透鏡幾乎不覆蓋該透明顯示器的透光區域，因此該透明顯示器具有高透明度及高亮度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transparent display includes a transparent driver board, a plurality of light-emitting elements, and a transparent encapsulation layer. The plurality of light-emitting elements are set up on the transparent driver board. The transparent encapsulation layer covers the plurality of light-emitting elements, and the transparent encapsulation layer has a micro lens array structure on the surface above the plurality of light-emitting elements. Micro lens of the micro lens array structure hardly covers a light-transmitting area of the transparent display, so the transparent display has high transparency and high brightness.</p>
      </isu-abst>
      <representative-img>
        <p type="p">40:透明顯示器</p>
        <p type="p">41:透明驅動板</p>
        <p type="p">42:發光元件</p>
        <p type="p">43:發光元件</p>
        <p type="p">44:發光元件</p>
        <p type="p">45:透明封裝層</p>
        <p type="p">451:微透鏡</p>
        <p type="p">Ao:不透光區域</p>
        <p type="p">At:透光區域</p>
        <p type="p">L1:光線</p>
        <p type="p">L2:光線</p>
        <p type="p">La:外界光線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="483" publication-number="202616402">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616402</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139033</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>壓膜方法</chinese-title>
        <english-title>VACUUM LAMINATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241220B">H01L21/603</main-classification>
        <further-classification edition="200601120241220B">B29C65/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群翊工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GROUP UP INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳安順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, AN-SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖鉦達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種壓膜方法，包含：提供一真空壓膜裝置包含一上壓膜單元及一下壓膜單元；提供一封膜及一基板，該封膜與該基板間具有一預定距離而未相互接觸；移動該上壓膜單元及該下壓膜單元中之至少一者，使該上壓膜單元及該下壓膜單元相互靠近並共同圍設形成一腔室，該封膜及該基板容置於該腔室中未相互接觸；對該腔室抽真空；移動該封膜及該基板中之至少一者，使該封膜及該基板相互靠近，使該封膜層疊於該基板上；對該封膜及該基板加熱；解除該腔室之真空狀態；移動該上壓膜單元及該下壓膜單元中之至少一者，使該上壓膜單元及該下壓膜單元相互遠離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A vacuum lamination method, comprising: providing a vacuum lamination device, which comprises an upper film pressing unit and a lower film pressing unit; providing a sealing film and a substrate, with a predetermined distance maintained between the sealing film and the substrate without contact; moving at least one of the upper film pressing unit and the lower film pressing unit to bring them closer together, thereby forming a chamber that encloses the sealing film and the substrate, which are positioned within the chamber without contact; evacuating the chamber; moving at least one of the sealing film and the substrate to bring them closer together, so that the sealing film is stacked onto the substrate; heating the sealing film and the substrate; breaking the vacuum in the chamber; and moving at least one of the upper film pressing unit and the lower film pressing unit to separate them from each other.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S02,S04,S06,S08,S10,S12,S14,S16:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="484" publication-number="202615190">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615190</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139035</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雷射表面處理骨材的方法及其奈米結構</chinese-title>
        <english-title>METHOD OF BONE MATERIAL USING LASER SURFACE TREATMENT AND NANOSTRUCTURE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120250430B">B23K26/352</main-classification>
        <further-classification edition="200601120250430B">A61C13/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>京達醫材科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIOMATE MEDICAL DEVICES TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慶達科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SHAN YIN INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇國材</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, KOU-TSAIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇昱榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YU-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴國榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作是一種雷射表面處理骨材的方法及其奈米結構，其中該骨材的表面是鈦金屬，藉由雷射熔融噴濺形成熔融金屬鈦，冷卻後具有二氧化鈦(TiO        &lt;sub&gt;2&lt;/sub&gt;)的至少一微通道，其中包括：至少一微孔洞、至少一導引溝道、以及至少一奈米牆所形成至少一奈米凸粒層以及至少一個奈米壁。達成下列骨癒合與抗菌指標的功效和目的：A.加速骨癒合相關蛋白質沉積，B.加速骨細胞附著，C.誘發新生血管，D.加速初期鈣化(calcification)、以及骨礦化(bone mineralization)，E.提高營養物質交換，F.穩定表面骨結構，G.抗牙菌斑形成。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:鈦金屬</p>
        <p type="p">10:微通道</p>
        <p type="p">11:奈米牆</p>
        <p type="p">111:奈米凸粒層</p>
        <p type="p">112:壁底層</p>
        <p type="p">12:微孔洞</p>
        <p type="p">15:附著物</p>
        <p type="p">16:導引溝道</p>
        <p type="p">D1:第1高度</p>
        <p type="p">D2:第2高度</p>
        <p type="p">D3:第3高度</p>
        <p type="p">P1:節距</p>
        <p type="p">W1:第1寬度</p>
        <p type="p">K:雷射照射掃描方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="485" publication-number="202616635">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616635</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139037</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>摩擦奈米發電機及其操作方法</chinese-title>
        <english-title>TRIBOELECTRIC NANOGENERATOR AND OPERATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">H02N1/04</main-classification>
        <further-classification edition="200601120241231B">C08J5/18</further-classification>
        <further-classification edition="200601120241231B">C08L5/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, ZONG-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種摩擦奈米發電機包括第一及第二疊層及電表。第一疊層包括第一導電層及胺基酸層。第二疊層設置於第一疊層上方，且包括負摩擦層及設置於負摩擦層上的第二導電層。電表電性連接第一及第二導電層。另一種摩擦奈米發電機包括封裝容器、填充劑、電極、導線及電表。封裝容器具有容置空間及摩擦層。填充劑被容納於容置空間中。填充劑包括水、電解質或液態金屬。電極貫穿封裝容器，且接觸填充劑。導線電性連接電極，且具有接地末端。電表設置於導線上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A triboelectric nanogenerator includes first and second stacks and an electricity meter. The first stack includes a first conductive layer and an amino acid layer. The second stack is disposed over the first stack and includes a negative friction layer and a second conductive layer disposed on the negative friction layer. The electricity meter is electrically connected to the first and second conductive layers. Another triboelectric nanogenerator includes an encapsulation container, a filler, an electrode, a wire, and an electricity meter. The encapsulation container has an accommodating space and a friction layer. The filler is contained in the accommodating space. The filler includes water, an electrolyte, or a liquid metal. The electrode penetrates through the encapsulation container and contacts the filler. The wire is electrically connected to the electrode and has a grounded end. The electricity meter is disposed on the wire.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:摩擦奈米發電機</p>
        <p type="p">210:第一疊層</p>
        <p type="p">212:第一導電層</p>
        <p type="p">214:胺基酸層</p>
        <p type="p">220:第二疊層</p>
        <p type="p">222:負摩擦層</p>
        <p type="p">224:第二導電層</p>
        <p type="p">226:絕緣層</p>
        <p type="p">230:電表</p>
        <p type="p">D1:距離</p>
        <p type="p">D2:極限距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="486" publication-number="202616767">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616767</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139039</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無線通訊裝置及其封包接收控制方法</chinese-title>
        <english-title>WIRELESS COMMUNICATION DEVICE AND PACKET RECEPTION CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120250102B">H04W88/02</main-classification>
        <further-classification edition="200901120250102B">H04W80/06</further-classification>
        <further-classification edition="202201120250102B">H04L67/2866</further-classification>
        <further-classification edition="202201120250102B">H04L69/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林正峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHENG FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種無線通訊裝置，包含射頻電路、基頻電路和媒體存取控制電路。射頻電路用以接收由存取點傳送的封包以產生射頻訊號，並將射頻訊號轉換為基頻訊號。基頻電路耦接射頻電路，其用以對基頻訊號進行解碼處理，以取得位元資料。媒體存取控制電路耦接基頻電路，其用以對該位元資料進行分析處理，以取得封包中特定欄位的資訊，且在判別出特定欄位的資訊不匹配無線通訊裝置下停止封包的接收。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wireless communication device includes a radio frequency (RF) circuit, a baseband circuit, and a media access control (MAC) circuit. The RF circuit is configured to receive a packet from an access point to generate an RF signal and convert the RF signal into a baseband signal. The baseband circuit is coupled to the RF circuit, and is configured to decode the baseband signal to obtain bit data. The MAC circuit is coupled to the baseband circuit, and is configured to parse the bit data to obtain information of a specific field in the packet, and stops receiving the packet when determining that the information of the specific field does not match the wireless communication device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:無線通訊裝置</p>
        <p type="p">202:射頻電路</p>
        <p type="p">204:基頻電路</p>
        <p type="p">206:MAC電路</p>
        <p type="p">206A:TSF計時器</p>
        <p type="p">208:WLAN處理器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="487" publication-number="202616127">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616127</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139040</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路的測試方法與使用其之積體電路</chinese-title>
        <english-title>TEST METHOD FOR INTEGRATED CIRCUIT AND INTEGRATED CIRCUIT USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250109B">G06F30/333</main-classification>
        <further-classification edition="200601120250109B">G01R31/3181</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>敦泰電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOCALTECH SYSTEMS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇芳毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, FANG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉信金</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種積體電路的測試方法與使用其之積體電路，在類比區塊中設置核對位元產生電路，從多個測試點生成核對位元。自動佈局與繞線區塊則包含測試圖樣產生電路，從控制訊號輸出端產生測試訊號。系統根據這些測試訊號產生檢查位元，並將其與核對位元比較。若兩者不符，則判定積體電路損毀。這種方法有效地整合了不同區塊的測試，提高了積體電路的檢測效率和準確性。        &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;b&gt;&lt;br/&gt;&lt;/b&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A test method for an integrated circuit and an integrated circuit using the same are provided in the embodiments of the present invention. In the analog block, a check bit generation circuit is set up to produce a check bit from multiple test points. The auto-layout and routing block contains a test pattern generation circuit that produces test signals from control signal outputs. The system generates a verification bit based on these test signals and compares it with the check bit. If they don't match, the integrated circuit is deemed damaged. This method effectively integrates testing of different blocks, improving the efficiency and accuracy of integrated circuit inspection.        &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;b&gt;&lt;br/&gt;&lt;/b&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">S501~S513:本發明一較佳實施例的積體電路的測試方法之流程步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="488" publication-number="202615121">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615121</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139041</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有繩體清潔毛刷之防墜器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250106B">A62B35/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>振鋒企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKE INDUSTRIAL CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪暐傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王嘉賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁子倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖鉦達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有繩體清潔毛刷之防墜器，具有一外殼，外殼具有一出口且內部設置一防墜器本體與一減速裝置；防墜器本體於外殼內固定一主軸用以設置一轉轂，於主軸與轉轂之間連接一渦捲彈簧，於轉轂纏繞一繩體，於轉轂的一側結合一制動組件；減速裝置固定於外殼內且配置為在制動組件旋轉的速度超過一預定轉速時與其接合；於出口處固定具有多個放射狀刷毛的毛刷單元，繩體一端穿過出口時被該些刷毛的內端接觸；藉此，當繩體被拉出外殼再被轉轂捲回時，能以刷毛清潔沾附於繩體的金屬屑或髒汙，保持外殼內的清潔而使防墜器運行順暢不受阻礙。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:具有繩體清潔毛刷之防墜器</p>
        <p type="p">10:外殼</p>
        <p type="p">12:側壁</p>
        <p type="p">14:周壁</p>
        <p type="p">21:繩體</p>
        <p type="p">40:毛刷模組</p>
        <p type="p">L:吊環</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="489" publication-number="202615838">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615838</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139043</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>變壓器絕緣油自動取樣裝置及其取樣方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">G01N1/14</main-classification>
        <further-classification edition="200601120241204B">G01N33/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>士林電機廠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪偉國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇騰鋐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種變壓器絕緣油自動取樣裝置，包括有一本體，該本體上設有一容置部，該容置部上裝設有一夾緊結構，該容置部中裝設有一螺桿及套接於該螺桿的一滑移件；該自動取樣裝置安裝有一抽油針筒位於該容置部中，該抽油針筒包含有內部中空的一筒體，該筒體裝設有一推拉桿從該筒體內延伸至該筒體外，該推拉桿於該筒體外的一端設有一柄部，該筒體的外緣面設有一開口部，該開口部套接有一油閥與該開口部相連通，該油閥裝設有一控制裝置；一變壓器的側邊具有一洩油口，該洩油口套接有一吸油管，該吸油管的另外一端與該油閥套接並相連通，一廢油桶具有一排油管與該廢油桶內連通，該排油管的另外一端與該油閥套接並相連通。一種變壓器絕緣油自動取樣方法，藉由上述自動取樣裝置，來進行絕緣油取樣程序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:自動取樣裝置</p>
        <p type="p">11:本體</p>
        <p type="p">12:開關</p>
        <p type="p">13:螢幕面板</p>
        <p type="p">14:速度控制旋鈕</p>
        <p type="p">16:夾緊結構</p>
        <p type="p">18:滑移件</p>
        <p type="p">20:抽油針筒</p>
        <p type="p">21:筒體</p>
        <p type="p">22:推拉桿</p>
        <p type="p">23:柄部</p>
        <p type="p">24:開口部</p>
        <p type="p">25:油閥</p>
        <p type="p">28:控制裝置</p>
        <p type="p">30:變壓器</p>
        <p type="p">31:洩油口</p>
        <p type="p">32:吸油管</p>
        <p type="p">35:廢油桶</p>
        <p type="p">36:排油管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="490" publication-number="202616638">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616638</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139045</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>馬達驅動器之負載路阻辨別方法及其功率元件保護裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">H02P23/14</main-classification>
        <further-classification edition="202001120241204B">G01R31/34</further-classification>
        <further-classification edition="200601120241204B">H02H7/085</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>士林電機廠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周永堂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃朝建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇騰鋐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種馬達驅動器之負載路阻辨別方法及其功率元件保護裝置，首先偵測馬達之轉速，若小於第一轉速值時表示負載堵死，若大於第一轉速值且小於第二轉速值時，表示負載不完全堵死；接著檢測三相功率元件之相電流，若大於第一相電流值則依相電流大小計算出堵死權重值或不完全堵死權重值，並依相電流大小計算出堵死目標溫度值或一不完全堵死目標溫度值；最後檢測馬達驅動器之溫度，若大於堵死目標溫度值或大於不完全堵死目標溫度值，則判斷堵死權重值或不完全堵死權重值是否超出累加權重值，若是，則關閉該馬達驅動器之一電力供應以保護該功率元件者，並且可確保電動車在遇到斜坡時不會因電流過大而誤判讓負載停止運行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:馬達驅動器</p>
        <p type="p">20:三相功率元件</p>
        <p type="p">30:馬達</p>
        <p type="p">40:負載</p>
        <p type="p">50:電源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="491" publication-number="202616266">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616266</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139046</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>音訊識別系統及其音訊分類裝置與方法</chinese-title>
        <english-title>AUDIO IDENTIFICATION SYSTEM AND AUDIO CATEGORIZATION APPARATUS AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">G10L15/08</main-classification>
        <further-classification edition="200601120250203B">G10L15/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙盈盈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, YING-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種音訊分類方法，包含：自區分為複數音訊類型的複數訓練音訊檔案中，選擇任一音訊類型做為對應音訊類型並擷取區分為對應音訊類型的訓練音訊檔案，以對訓練音訊檔案進行音訊取樣以及特徵擷取，並產生複數訓練特徵資料；對訓練特徵資料進行高斯混合模型訓練，以產生複數高斯曲線趨近訓練特徵資料的資料分佈；以及產生高斯曲線各具有的複數曲線參數做為對應音訊類型的分類特徵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An audio categorization method is provided that includes steps outlined below. From a plurality of training audio files categorized into a plurality of audio types, one of the audio types is selected to be a corresponding audio type and the training audio files categorized in to the corresponding audio type is retrieved so as to perform sampling and feature extraction thereon to generate a plurality of training feature data. A Gaussian mixture model training is performed on the training feature data to generate a plurality of Gaussian distribution curves to approximate a data distribution of the training feature data. A plurality of curve parameters of the Gaussian distribution curves are generated to be a categorizing feature of the corresponding audio type.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:音訊分類方法</p>
        <p type="p">S410~S430:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="492" publication-number="202614975">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614975</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139047</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>脊椎經皮穿刺導引輔助組件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241101B">A61B17/34</main-classification>
        <further-classification edition="200601120241101B">A61B17/56</further-classification>
        <further-classification edition="200601120241101B">A61B17/90</further-classification>
        <further-classification edition="200601120241101B">A61M25/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡東翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡東翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方晶晶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳恩澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作脊椎經皮穿刺導引輔助組件用以於脊椎手術時輔助導引穿刺器械的穿刺路徑，其包含一主支架及分別裝設於主支架的一第一導引臂、一第二導引臂及一座體，該第一導引臂、該第二導引臂及該座體分別係可拆組地裝設於該主支架，座體包含一抵靠部及一固定部，抵靠部用於抵靠患者之背部皮膚表面，固定部的底面緊貼患者的待手術之椎弓板的表面，第一導引臂及第二導引臂分別用於導引穿刺器械，座體用於固定輔助裝置的位置，第一導引臂及第二導引臂係能夠有多個不同尺寸的型號供選擇，而僅有座體為客製化製作，故能夠有效降低手術成本並縮短製作時間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:主支架</p>
        <p type="p">11:第一安裝部</p>
        <p type="p">12:第二安裝部</p>
        <p type="p">13:座安裝部</p>
        <p type="p">20:第一導引臂</p>
        <p type="p">21:第一組設部</p>
        <p type="p">22:第一導引部</p>
        <p type="p">23:第一缺口</p>
        <p type="p">30:第二導引臂</p>
        <p type="p">31:連接件</p>
        <p type="p">311:第二組設部</p>
        <p type="p">312:橋部</p>
        <p type="p">313:管連接部</p>
        <p type="p">32:導引管件</p>
        <p type="p">321:導管部</p>
        <p type="p">322:導引通道</p>
        <p type="p">323:管連接塊</p>
        <p type="p">324:延長部</p>
        <p type="p">40:座體</p>
        <p type="p">41:抵靠部</p>
        <p type="p">42:固定部</p>
        <p type="p">421:穿孔</p>
        <p type="p">43:第二缺口</p>
        <p type="p">44:座組設部</p>
        <p type="p">45:座桿</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="493" publication-number="202615818">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615818</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139050</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於檢查一多邊形待測物的輪廓影像的調整方法</chinese-title>
        <english-title>IMAGE ADJUSTMENT METHOD FOR CHECKING OUTLINE OF POLYGONAL OBJECT TO BE MEASURED</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241104B">G01C11/04</main-classification>
        <further-classification edition="200601120241104B">G01B11/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>興城科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CENTRUM TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊文忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, WEN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許皓威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HAO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種影像調整方法，用於檢查一多邊形待測物的輪廓，包括下列步驟：提供該多邊形待測物，其中該多邊形待測物具複數點位；辨識相關於該複數點位之座標參數，並將各該複數點位之座標參數予以關聯，而產生具有一多邊形關係之一多邊形結果；選定一基準點；以及以該基準點為旋轉中心，而旋轉該多邊形結果至一預定方位，以形成該多邊形待測物之一擺正結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image adjustment method for checking an outline of a polygonal object to be measured is disclosed. The method includes the following steps: providing the polygonal object to be measured, wherein the polygonal object to be measured has a plurality of points; identifying coordinate parameters related to the plurality of points, and associating the coordinate parameters of the plurality of points to generate a polygon result with a polygon relationship; selecting a reference point; and using the reference point as a rotation center to rotate the polygon result to a predetermined orientation so as to form an alignment result of the polygonal object to be measured.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:比對平台</p>
        <p type="p">100U:上邊緣</p>
        <p type="p">100D:下邊緣</p>
        <p type="p">100L:左邊緣</p>
        <p type="p">100R:右邊緣</p>
        <p type="p">31:載板</p>
        <p type="p">31F:正面</p>
        <p type="p">3101:第一內邊線</p>
        <p type="p">3101’:第一外邊線</p>
        <p type="p">3102:第二內邊線</p>
        <p type="p">3102’:第二外邊線</p>
        <p type="p">3103:第三內邊線</p>
        <p type="p">3103’:第三外邊線</p>
        <p type="p">3104:第四內邊線</p>
        <p type="p">3104’:第四外邊線</p>
        <p type="p">node1:第一交點</p>
        <p type="p">TF:正面三角標記</p>
        <p type="p">LU:左上對位標記</p>
        <p type="p">RU:右上對位標記</p>
        <p type="p">Re:多邊形結果</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="494" publication-number="202616168">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616168</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139051</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於自動庫的出庫任務動態分配的方法與系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR DYNAMICALLY ALLOCATING STOCK-OUTBOUND TASKS BASED ON AUTOMATED WAREHOUSE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241218B">G06Q10/087</main-classification>
        <further-classification edition="202301120241218B">G06Q10/04</further-classification>
        <further-classification edition="200601120241218B">B65G1/137</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃德瑞克智能倉儲設備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WORLD RACK INTELLIGENCE STORAGE EQUIPMENT CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林明我</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MING-WO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種基於自動庫的出庫任務動態分配的方法與系統，其中一倉儲管理系統(WMS)依據一出庫訂單的一目標貨物來分配庫存中的一目標物料，並得到一棧板數；依據該目標物料及該棧板數產生與該棧板數相同數量的至少一筆出庫任務，並選定至少一目標出庫站臺，且將該至少一筆出庫任務初始平均分配給該至少一目標出庫站臺；將所有目標出庫站臺所初始分配到的出庫任務中的一筆出庫任務初始發送給一設備調度系統(WCS)執行；當WCS控制一四向車執行一筆出庫任務中的一棧板取貨動作且當該四向車完成該棧板取貨動作時，WMS將該筆出庫任務的一狀態設定為即將完成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a method and system for dynamically allocating stock-outbound tasks based on an automated warehouse, wherein a warehouse management system (WMS) allocates a target material in an inventory based on a target item of a stock-outbound order and obtains a pallet count; generates at least one stock-outbound task based on the target material and the pallet count, with the number of the at least one outbound task being the same as the pallet count; selects at least one target stock-outbound station, and initially evenly allocates the at least one stock-outbound task to the at least one target stock-outbound station; initially assigns one of the stock-outbound tasks initially allocated to all target stock-outbound stations to a warehouse control system (WCS) for execution; when the WCS controls a four-way shuttle to execute a pallet-pickup action in an stock-outbound task and when the four-way shuttle completes the pallet-pickup action, the WMS sets a state of the stock-outbound task as soon-to-be-completed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S0~S17:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="495" publication-number="202615600">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615600</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139052</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>噴墨型透光油墨</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120250102B">C09D11/30</main-classification>
        <further-classification edition="201401120250102B">C09D11/32</further-classification>
        <further-classification edition="201401120250102B">C09D11/38</further-classification>
        <further-classification edition="200601120250102B">C09D11/00</further-classification>
        <further-classification edition="201401120250102B">C09D11/03</further-classification>
        <further-classification edition="201401120250102B">C09D11/101</further-classification>
        <further-classification edition="202501120250102B">H10F77/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泓瀚科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧廉淞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂椬境</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃士杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李健廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧廉淞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種噴墨型透光油墨，包括：1至30 wt%的透光粒子、1至10 wt%的顏料、2至12 wt%的分散劑、20至75 wt%的單體、可選地10 wt%以下的寡聚物、1至15 wt%的光起始劑、以及0.01至3.5 wt%的助劑。本發明的噴墨型透光油墨在噴印於太陽能板上後，能夠使太陽能板呈現繽紛的色彩而不至過於單調，從而可良好地融入建築外觀或景觀設計，並且同時保有良好的太陽能轉換效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:噴墨層</p>
        <p type="p">2:透光粒子</p>
        <p type="p">3a:入射光</p>
        <p type="p">3b:穿透光</p>
        <p type="p">4:交聯結構</p>
        <p type="p">5:顏料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="496" publication-number="202616162">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616162</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139070</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>交貨遵守率預測方法及其系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR PREDICTING FILL RATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250208B">G06Q10/08</main-classification>
        <further-classification edition="202301120250208B">G06Q10/04</further-classification>
        <further-classification edition="200601120250208B">G06F17/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, KE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宗翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, ZONGHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏崴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁修坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, XIUKUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臧勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZANG, YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐智俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, ZHIJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝特　潘卡　拉坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHETE, PANKAJ RATAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何敬禹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, JINGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯瑪士　雷恩　吉諾　溫斯頓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THOMAS, RYAN GINO WINSTON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉曼　安納馬萊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMAN, ANNAMALAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係有關於一種交貨遵守率預測方法及其系統。根據本揭露一實施例的交貨遵守率預測方法包括如下步驟：接收包括待預測訂貨單的資訊和與該待預測訂貨單相關的適當訂購數量的資訊的待預測資料，該待預測訂貨單以預測日為基準處於未完成狀態；使用預測模型獲取與該待預測訂貨單相關的交貨遵守率預測結果；和向使用者終端提供預測的該交貨遵守率預測結果，該預測模型是使用與該預測日對應的星期日期為相同星期日期的過去訂貨單資料集和與該過去訂貨單資料集相關的過去適當訂購數量資料集學習的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a method and system for predicting a fill rate. The method for predicting a fill rate may include receiving prediction target data including information on a prediction target purchase order and information on an appropriate order quantity associated with the prediction target purchase order, the prediction target purchase order being not completed based on a prediction date, obtaining a fill rate prediction result associated with the prediction target purchase order using a prediction model, and providing the predicted fill rate prediction result to a user terminal, wherein the prediction model may be trained using a past purchase order data set of a day of the week that is the same as a day of the week corresponding to the prediction date and a past appropriate order quantity data set associated with the past purchase order data set.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100、S200、S210、S220、S221、S222、S300:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="497" publication-number="202615318">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615318</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139071</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>周轉箱運輸方法及其系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR TRANSFERRING TOTE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250701B">B65G47/90</main-classification>
        <further-classification edition="200601120250701B">B65G1/137</further-classification>
        <further-classification edition="200601120250701B">B65G43/08</further-classification>
        <further-classification edition="200601120250701B">B65B43/26</further-classification>
        <further-classification edition="200601120250701B">B65B43/52</further-classification>
        <further-classification edition="200601120250701B">B65G47/71</further-classification>
        <further-classification edition="200601120250701B">B65G47/52</further-classification>
        <further-classification edition="200601120250701B">B65G47/82</further-classification>
        <further-classification edition="200601120250701B">B65D55/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全正宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEON, JUNG WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種周轉箱運輸方法以及用於執行該方法的系統。該方法包括如下步驟：獲取包含物品的周轉箱的重量；基於獲取的該重量在多個重量範圍中所屬的範圍，確定凹凸形態；和控制包括輥筒的輸送機以運輸該周轉箱，其中，該多個重量範圍中的每一個分別與多個凹凸形態中的每一個對應地預先設置，該周轉箱的第一凹凸部和該輥筒的第二凹凸部分別形成為確定的該凹凸形狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a method for transferring a tote and a system for performing the method. The method includes: obtaining a weight of a tote including goods; determining a unevenness shape based on a range to which the obtained weight belongs among a plurality of weight ranges; and controlling a transfer conveyor to transfer the tote to a conveyor line including a roller, wherein a first unevenness portion of the tote and a second unevenness portion of the roller are each formed in the determined unevenness shape, and each of the plurality of weight ranges is predetermined to correspond to each of a plurality of unevenness shapes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100、S200、S300:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="498" publication-number="202615317">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615317</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139072</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>模組化輸送機管理方法和系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR MANAGING MODULAR CONVEYORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241204B">B65G43/02</main-classification>
        <further-classification edition="200601120241204B">B65G43/08</further-classification>
        <further-classification edition="200601120241204B">B65G11/20</further-classification>
        <further-classification edition="200601120241204B">B65G47/19</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全正宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEON, JUNG WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明的實施例的模組化輸送機管理方法由計算裝置執行，包括如下步驟：監測包括多個輸送機模組的輸送機系統；根據所述監測結果，判斷所述多個輸送機模組中的第一輸送機模組是否需要更換；確定要替換所述第一輸送機模組的第二輸送機模組的類型；及向用戶通知所述第一輸送機模組是否需要更換或確定的第二輸送機模組的類型中的至少一個。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A modular conveyor management method according to an embodiment of the present invention is executed by a computing device and includes the following steps: monitoring a conveyor system comprising multiple conveyor modules; determining, based on the monitoring results, whether a first conveyor module among the multiple conveyor modules requires replacement; identifying the type of a second conveyor module to replace the first conveyor module; and notifying the user of at least one of whether the first conveyor module requires replacement or the identified type of the second conveyor module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1010、S1020、S1030、S1040:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="499" publication-number="202616795">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616795</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139125</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具支撐架之滑軌</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">H05K5/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南俊國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN JUEN INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱怡翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, I-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳敏明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, MIN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡嘉宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, JIA-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李勇宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YONG-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具支撐架之滑軌，包含一第一軌、一第一支撐架安裝於第一軌一側與一第二支撐架，第一支撐架包含有一第一側牆，第一側牆二端分別彎折延伸有一橫牆，二橫牆末端分別朝相對內側彎折延伸有一縱段，第二支撐架包含一第二側牆，其兩端分別朝二縱段彎折延伸有一第一部，二第一部末端分別反向彎折有靠抵二縱段之一彎折部，二彎折部末端分別朝第一側牆延伸有支撐於二橫牆之一第二部，二第二部靠抵於二第一部相鄰二橫牆之一側，藉此，用以增加第二支撐架受該第一軌拉扯時避免變形的抗扭強度。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">11:第一軌</p>
        <p type="p">12:第一支撐架</p>
        <p type="p">121:第一側牆</p>
        <p type="p">122:橫牆</p>
        <p type="p">123:縱段</p>
        <p type="p">13:第二支撐架</p>
        <p type="p">131:第二側牆</p>
        <p type="p">132:牆體</p>
        <p type="p">133:第一部</p>
        <p type="p">134:彎折部</p>
        <p type="p">135:第二部</p>
        <p type="p">136:連接部</p>
        <p type="p">14:第二軌</p>
        <p type="p">15:第三軌</p>
        <p type="p">H:間距</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="500" publication-number="202614943">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614943</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139126</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>滑軌總成</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120241204B">A47B88/417</main-classification>
        <further-classification edition="201701120241204B">A47B88/49</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南俊國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN JUEN INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳北辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PEI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴國欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, KUO-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志盈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIH-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖偉良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, WEI-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種滑軌總成，包含一第一軌、一第二軌、一第三軌及一齒輪機構，第一軌、第二軌與第三軌可相對彼此縱向位移，第三軌用以延長第二軌相對第一軌位移長度，第二軌及第三軌相對第一軌朝一第一方向與反向朝一第二方向位移，透過齒輪機構進行快速位移與減速位移。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:滑軌總成</p>
        <p type="p">311:第一框槽</p>
        <p type="p">511:第一齒部</p>
        <p type="p">2:第一軌</p>
        <p type="p">4:第二軌</p>
        <p type="p">52:第一阻尼器</p>
        <p type="p">21:一側</p>
        <p type="p">41:縱向牆</p>
        <p type="p">521:第一容器</p>
        <p type="p">3:第三軌</p>
        <p type="p">50:第一齒條</p>
        <p type="p">522:第一齒輪</p>
        <p type="p">31:第一端部</p>
        <p type="p">501:第一齒部</p>
        <p type="p">53:第二阻尼器</p>
        <p type="p">32:第二端部</p>
        <p type="p">51:第二齒條</p>
        <p type="p">532:第二齒輪</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="501" publication-number="202616796">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616796</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139127</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有調整機構之支撐裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">H05K5/02</main-classification>
        <further-classification edition="200601120241230B">A47B96/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南俊國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN JUEN INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱怡翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, I-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡嘉宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, JIA-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, KUO-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李羿瑱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YI-TIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有調整機構之支撐裝置，包含一轉接板、一前支架及一調整機構，前支架相對轉接板位移，調整機構具有調整件，調整件帶動前支架相對轉接板進行快速位移與微調位移。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">11:轉接板</p>
        <p type="p">111:彎折部</p>
        <p type="p">112:第一端部</p>
        <p type="p">113:第二端部</p>
        <p type="p">114:彎折段</p>
        <p type="p">116:內緣面</p>
        <p type="p">12:前支架</p>
        <p type="p">13:固定件</p>
        <p type="p">14:安裝件</p>
        <p type="p">15:調整機構</p>
        <p type="p">151:鎖固件</p>
        <p type="p">152:支撐件</p>
        <p type="p">153:調整件</p>
        <p type="p">16:軌件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="502" publication-number="202616163">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616163</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139133</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>貨物管理方法和系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR CARGO MANAGEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250211B">G06Q10/08</main-classification>
        <further-classification edition="202301120250211B">G06Q10/06</further-classification>
        <further-classification edition="202301120250211B">G06Q30/02</further-classification>
        <further-classification edition="200601120250211B">G06F17/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金太原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, TAE WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全正宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEON, JUNG WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明的實施例的貨物管理方法由計算裝置執行，包括如下步驟：藉由至少一個第一尺寸測量感測器測量第一貨物的尺寸；藉由第一重量測量感測器測量所述第一貨物的重量；藉由第一條碼識別感測器識別所述第一貨物上附著的條碼；及將所述第一貨物的尺寸、所述第一貨物的重量或所述第一貨物的條碼中的至少一個傳輸至伺服器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The cargo management method according to an embodiment of the present invention is performed by a computing device and includes the following steps: measuring the dimensions of a first cargo by at least one first dimension-measuring sensor; measuring the weight of the first cargo by a first weight-measuring sensor; identifying the barcode attached to the first cargo by a first barcode identification sensor; and transmitting at least one of the dimensions, weight, or barcode of the first cargo to a server.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S910、S920、S930、S940、S950:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="503" publication-number="202616602">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616602</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139140</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>均流式電源供應裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">H02J1/10</main-classification>
        <further-classification edition="200601120250203B">H02M3/158</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商明緯（廣州）電子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEAN WELL (GUANGZHOU) ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明緯企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEAN WELL ENTERPRISES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱致翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林浩源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡敏強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種均流式電源供應裝置，其包括一主電源供應器及與其電性連接之一從電源供應器。主電源供應器與從電源供應器電性連接負載。主電源供應器提供一主輸出電流給負載，並擷取主輸出電流，以據此產生一主回授電流。從電源供應器接收主回授電流，並據此提供等於主輸出電流之一從輸出電流給負載。從電源供應器擷取從輸出電流，以據此產生一從回授電流與一從類比電流，並相加主回授電流與從回授電流，以產生一控制電流。從電源供應器根據控制電流與從類比電流穩定從輸出電流。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:均流式電源供應裝置</p>
        <p type="p">10:主電源供應器</p>
        <p type="p">100:主電源供應電路</p>
        <p type="p">101:主電流回授電路</p>
        <p type="p">102:主電壓回授電路</p>
        <p type="p">103:主均流控制器</p>
        <p type="p">104:主壓差放大電路</p>
        <p type="p">105:主比較器</p>
        <p type="p">11:從電源供應器</p>
        <p type="p">110:從電源供應電路</p>
        <p type="p">111:從電流回授電路</p>
        <p type="p">112:從電壓回授電路</p>
        <p type="p">113:從均流控制器</p>
        <p type="p">114:從壓差放大電路</p>
        <p type="p">115:從比較器</p>
        <p type="p">2:負載</p>
        <p type="p">IO1:主輸出電流</p>
        <p type="p">VO1:主輸出電壓</p>
        <p type="p">IF1:主回授電流</p>
        <p type="p">IO2:從輸出電流</p>
        <p type="p">VO2:從輸出電壓</p>
        <p type="p">IF2:從回授電流</p>
        <p type="p">IA2:從類比電流</p>
        <p type="p">VR1:主驅動電壓</p>
        <p type="p">IA1:主類比電流</p>
        <p type="p">VF1:主回授電壓</p>
        <p type="p">VD1:主數位設定電壓</p>
        <p type="p">VA1:主類比參考電壓</p>
        <p type="p">VR2:從驅動電壓</p>
        <p type="p">VF2:從回授電壓</p>
        <p type="p">VD2:從數位設定電壓</p>
        <p type="p">VA2:從類比參考電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="504" publication-number="202616685">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616685</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139333</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於差分訊號實現負啁啾調製的光調製器及光傳輸系統</chinese-title>
        <english-title>OPTICAL MODULATOR AND OPTICAL TRANSMISSION SYSTEM WITH NEGATIVE CHIRP BASED ON DIFFERENTIAL SIGNALLING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250203B">H04B10/50</main-classification>
        <further-classification edition="200601120250203B">G02F1/225</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商寧波環球廣電科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBAL TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯偉康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KE, WEIKANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃起坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, QIKUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光調製器及光傳輸系統，所述光調製器包含一第一/第二光波導、一第一/第二射頻訊號通道及一第一/第二接地通道。所述第二光波導與所述第一光波導光耦合於一光輸入端及一光輸出端。所述第一射頻訊號通道設置於所述第一光波導的一側，且用於接收一第一差分訊號。所述第二射頻訊號通道設置於所述第一光波導的另一側，且用於接收一第二差分訊號，其中所述第一差分訊號與所述第二差分訊號具有不同的相位。所述第一接地通道設置於所述第二光波導的一側且用於接地。所述第二接地通道設置於所述第二光波導的另一側且用於接地。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical modulator and optical transmission system. The optical modulator includes a first/second optical waveguide, a first/second radio frequency signal channel and a first/second ground channel. The second optical waveguide and the first optical waveguide are optically coupled to an optical input end and an optical output end. The first radio frequency signal channel is disposed on one side of the first optical waveguide and is configured to receive a first differential signal. The second radio frequency signal channel is disposed on another side of the first optical waveguide and is configured to receive a second differential signal, wherein the first differential signal and the second differential signal have different phases. The first ground channel is disposed on one side of the second optical waveguide and is configured for grounding. The second ground channel is disposed on another side of the second optical waveguide and is configured for grounding.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光傳輸系統</p>
        <p type="p">10:光調製器</p>
        <p type="p">101:第一光波導</p>
        <p type="p">102:第二光波導</p>
        <p type="p">103,104:射頻訊號通道</p>
        <p type="p">105,106,107:接地通道</p>
        <p type="p">108:第一熱電極</p>
        <p type="p">109:第二熱電極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="505" publication-number="202615925">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615925</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139446</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學成像鏡頭</chinese-title>
        <english-title>OPTICAL IMAGING LENS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250107B">G02B11/32</main-classification>
        <further-classification edition="202101120250107B">G02B7/02</further-classification>
        <further-classification edition="200601120250107B">G02B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商玉晶光電（廈門）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENIUS ELECTRONIC OPTICAL (XIAMEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董傳博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONG, CHUANBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陽松林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SONG LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝宏健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, HUNG-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學成像鏡頭包括第一透鏡至第六透鏡。第一透鏡像側面的光軸區域為凸面、第二透鏡像側面的圓周區域為凹面、第三透鏡像側面的光軸區域為凸面且其像側面的圓周區域為凸面、第四透鏡有正屈光率且其物側面的圓周區域為凹面、第五透鏡物側面的光軸區域為凸面、及第六透鏡物側面的光軸區域為凸面且其物側面的圓周區域為凹面。光學成像鏡頭的透鏡只有上述六片，Fno為光學成像鏡頭的光圈值、AAG為第一透鏡到第六透鏡在光軸上的五個空氣間隙總和、T3為第三透鏡在光軸上的厚度、G34為第三透鏡與第四透鏡在光軸上的空氣間隙，滿足Fno*AAG/（T3+G34）≦3.000。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging lens includes a first lens element to a sixth lens element. An optical axis region of the image-side surface of a first lens element is convex, a periphery region of the image-side surface of the second lens element is concave, an optical axis region of the image-side surface of the third lens element is convex, a periphery region of the image-side surface of the third lens element is convex, the fourth lens element has positive refracting power and a periphery region of the object-side surface of the fourth lens element is concave, an optical axis region of the object-side surface of the fifth lens element is convex, an optical axis region of the object-side surface of the sixth lens element is convex and a periphery region of the object-side surface of the sixth lens element is concave. Lens elements included by the optical imaging lens are only six lens elements described above to satisfy Fno*AAG/（T3+G34）≤3.000.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光學成像鏡頭</p>
        <p type="p">2:光圈</p>
        <p type="p">3:濾光片</p>
        <p type="p">4:成像面</p>
        <p type="p">11、21、31、41、51、61:物側面</p>
        <p type="p">12、22、32、42、52、62:像側面</p>
        <p type="p">13、16、23、26、33、36、43、46、53、56、63、66:光軸區域</p>
        <p type="p">14、17、24、27、34、37、44、47、54、57、64、67:圓周區域</p>
        <p type="p">10:第一透鏡</p>
        <p type="p">20:第二透鏡</p>
        <p type="p">30:第三透鏡</p>
        <p type="p">40:第四透鏡</p>
        <p type="p">50:第五透鏡</p>
        <p type="p">60:第六透鏡</p>
        <p type="p">A1:物側</p>
        <p type="p">A2:像側</p>
        <p type="p">I:光軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="506" publication-number="202616243">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616243</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139522</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微型發光二極體陣列</chinese-title>
        <english-title>MICRO LIGHT-EMITTING DIODE ARRAY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">G09F9/33</main-classification>
        <further-classification edition="202501120250102B">H10H29/10</further-classification>
        <further-classification edition="200601120250102B">G02B6/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商業成科技（成都）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERFACE TECHNOLOGY (CHENGDU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商業成光電（深圳）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英特盛科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENERAL INTERFACE SOLUTION LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳秉揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PING-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種微型發光二極體陣列，包含複數個微型發光二極體、一隔離結構，位於微型發光二極體之間、一化合物半導體層，覆蓋微型發光二極體以及隔離結構，其中化合物半導體層具有一第一折射率、一折射率調節層，覆蓋化合物半導體層，其中折射率調節層具有一第二折射率，第二折射率小於第一折射率、以及一光調節結構，貫穿折射率調節層並延伸至化合物半導體層中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A micro light-emitting diode array includes a plurality of micro light-emitting diodes, an isolation structure located between the micro light-emitting diodes, a compound semiconductor layer covering the micro light-emitting diodes and the isolation structure , wherein the compound semiconductor layer has a first refractive index, a refractive index adjustment layer covering the compound semiconductor layer, wherein the refractive index adjustment layer has a second refractive index and the second refractive index is lower than the first refractive index, and a light adjustment structure penetrating the refractive index adjustment layer and extending into the compound semiconductor layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:外部環境</p>
        <p type="p">60:溝槽</p>
        <p type="p">100:微型發光二極體</p>
        <p type="p">200:隔離結構</p>
        <p type="p">300:化合物半導體層</p>
        <p type="p">400:折射率調節層</p>
        <p type="p">517:出光介面</p>
        <p type="p">518:出光介面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="507" publication-number="202616595">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616595</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139731</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配電系統</chinese-title>
        <english-title>POWER DISTRIBUTION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">H02B1/20</main-classification>
        <further-classification edition="200601120241231B">H02B1/24</further-classification>
        <further-classification edition="200601120241231B">H02B1/048</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡培倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, PEI-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳煜儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種配電系統，包括一架體、至少一匯流排及多個開關模組。匯流排配置於架體且用以耦接於至少一輸入線路。各開關模組包括一開關模組主體及一控制單元，開關模組主體可拆卸地配置於架體且具有一輸入接口及一輸出接口。輸入接口耦接於控制單元且連接於匯流排，輸出接口耦接於控制單元且用以耦接於至少一輸出線路。控制單元配置於開關模組主體內且包括相互耦接的一繼電器及一控制電路板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power distribution system includes a frame, at least one busbar and a plurality of switch modules. The busbar is disposed on the frame and is configured to couple to at least one input line. Each switch module includes a switch module main body and a control unit. The switch module main body is detachably disposed on the frame and has an input interface and an output interface. The input interface is coupled to the control unit and connected to the busbar, and the output interface is coupled to the control unit and configured to couple to at least one output line. The control unit is disposed in the switch module main body and includes a relay and a control circuit board coupled to each other.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120:架體</p>
        <p type="p">122:背板</p>
        <p type="p">124:座體</p>
        <p type="p">124a:承載面</p>
        <p type="p">124b:底面</p>
        <p type="p">128:絕緣柱</p>
        <p type="p">140:開關模組</p>
        <p type="p">1401:連接埠</p>
        <p type="p">142:開關模組主體</p>
        <p type="p">1421:滑槽</p>
        <p type="p">1422:卡勾</p>
        <p type="p">142a:輸入接口</p>
        <p type="p">142b:輸出接口</p>
        <p type="p">160A:第一相位匯流排</p>
        <p type="p">160B:第二相位匯流排</p>
        <p type="p">164A:第二匯流排端子</p>
        <p type="p">170:連接端子</p>
        <p type="p">170a:第一端部</p>
        <p type="p">170b:第二端部</p>
        <p type="p">H2:開孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="508" publication-number="202615114">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615114</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139835</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多極輸出裝置以及控制方法</chinese-title>
        <english-title>MULTIPOLAR-TYPE OUTPUT APPARATUS AND CONTROL METHOD THEREFOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241217B">A61N1/04</main-classification>
        <further-classification edition="200601120241217B">A61N1/06</further-classification>
        <further-classification edition="200601120241217B">A61N1/08</further-classification>
        <further-classification edition="200601120241217B">A61N5/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商元特技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONTECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金鍾元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JONG WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金正賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JUNG HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐永錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, YOUNG SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的多極輸出裝置以及控制方法，其中，多極輸出裝置包括：主體；機頭，可與主體電性連接且可在主體上進行拆裝，用於傳遞高頻能量；以及尖端，可與機頭電性連接且可在機頭的一側進行拆裝，用於照射高頻能量；主體包括：第一電源部，用於供應電源；第一控制部，接收從第一電源部載入的電力並對主體、機頭以及尖端的整體動作進行控制；第一顯示部，接收從第一電源部載入的電力並向使用者輸出動作狀態；第一儲存部，接收從第一電源部載入的電源並在第一控制部的控制下執行動作，包括與尖端的固有資料匹配的資料；能量生成部，接收從第一電源部載入的電源並在第一控制部的控制下執行動作，用於生成高頻能量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:主體</p>
        <p type="p">110:第一電源部</p>
        <p type="p">120:第一控制部</p>
        <p type="p">130:第一顯示部</p>
        <p type="p">140:第一儲存部</p>
        <p type="p">150:能量生成部</p>
        <p type="p">160:冷卻部</p>
        <p type="p">200:機頭</p>
        <p type="p">210:第二電源部</p>
        <p type="p">220:第二控制部</p>
        <p type="p">230:第二顯示部</p>
        <p type="p">240:能量傳遞部</p>
        <p type="p">250:氣體傳遞部</p>
        <p type="p">300:尖端</p>
        <p type="p">310:電極部</p>
        <p type="p">320:感測器部</p>
        <p type="p">330:腔體</p>
        <p type="p">340:第二儲存部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="509" publication-number="202616104">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616104</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113139897</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用以提供針對內容之投票功能之裝置、方法及記錄媒體</chinese-title>
        <english-title>APPARATUS, METHOD AND RECORDING MEDIUM FOR PROVIDING VOTING FUNCTION FOR CONTENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250801B">G06F16/735</main-classification>
        <further-classification edition="201901120250801B">G06F16/738</further-classification>
        <further-classification edition="200601120250801B">G07C13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂彩蓮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEO, CHAERYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種用以提供針對目標內容之投票功能之電子裝置。本發明之一實施例之電子裝置能夠以如下方式構成，即，處理器如下：自用戶之終端獲得連接至平台服務之目標內容之第1網頁的請求；產生用於將上述第1網頁顯示於上述終端中之網頁資訊；向上述終端傳輸上述網頁資訊；且上述網頁資訊可包括如下資訊：使第1投票介面在上述用戶可參與上述投票之時間段內顯示於上述第1網頁中，該第1投票介面係用以進行與上述目標內容相關之投票者；響應於選擇上述第1投票介面中包括之一個以上之投票項目之第1用戶輸入，使第2投票介面顯示於上述第1網頁中，該第2投票介面係顯示上述平台服務之用戶對上述投票之投票結果者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S310:動作</p>
        <p type="p">S320:動作</p>
        <p type="p">S330:動作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="510" publication-number="202616191">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616191</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140074</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用以儲存登入資訊之裝置、方法及記錄有命令之記錄媒體</chinese-title>
        <english-title>APPARATUS, METHOD AND RECORDING MEDIUM STORING A LOGIN INFORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250710B">G06Q30/0601</main-classification>
        <further-classification edition="202301120250710B">G06Q30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜河羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, HARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　凱瑟琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CATHERINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔允貞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, YUNJEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊震希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, ZHENXI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>代抗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI, KANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪　國威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, KUO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種裝置，其包括：顯示裝置；一個以上之處理器；及一個以上之記憶體，其等儲存有用以藉由上述一個以上之處理器而執行之命令；上述裝置以如下方式構成：將請求自電子商務服務退出之第1請求傳輸至伺服器；自上述伺服器獲得用以產生第1頁面之第1資訊，並藉由上述顯示裝置而顯示上述第1頁面，上述第1頁面包括請求用戶確認上述退出之進行之資訊；根據確認上述退出之進行之第1用戶輸入，將請求進行上述退出之第2請求傳輸至上述伺服器；自上述伺服器獲得用以產生第2頁面之第2資訊，並藉由上述顯示裝置而顯示上述第2頁面，上述第2頁面包括請求用戶確認登入資訊之儲存之資訊，上述登入資訊係用以供上述用戶登入上述電子商務服務之資訊；根據確認上述登入資訊之儲存之第2用戶輸入，儲存上述登入資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">110:裝置</p>
        <p type="p">120:伺服器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="511" publication-number="202616103">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616103</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140117</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用以提供針對內容之提示點之裝置、方法及記錄媒體</chinese-title>
        <english-title>APPARATUS, METHOD AND RECORDING MEDIUM FOR PROVIDING CUE POINT FOR CONTENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250801B">G06F16/70</main-classification>
        <further-classification edition="201901120250801B">G06F16/738</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂彩蓮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEO, CHAERYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一實施例之電子裝置之處理器能夠以如下之方式構成：自用戶之終端獲得訪問平台服務之對象內容之第1網頁之請求，並基於上述用戶之資訊，確定與上述對象內容相關之複數個第1提示點中之一個以上之第2提示點，產生使上述第1網頁包括上述一個以上之第2提示點而顯示於上述終端之網頁資訊，將上述網頁資訊傳輸至上述終端；且上述網頁資訊包括如下之資訊：響應於選擇上述一個以上之第2提示點中之一個第2提示點之第1用戶輸入，使上述對象內容自選擇之上述一個第2提示點指示之播放時點開始於上述第1網頁中播放。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S310,S320,S330,S340:動作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="512" publication-number="202616106">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616106</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140247</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>圖像渲染監測方法及其系統</chinese-title>
        <english-title>IMAGE RENDERING MONITORING METHOD AND SYSTEM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250203B">G06F16/957</main-classification>
        <further-classification edition="200601120250203B">G06T1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘正斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, ZHENGBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本揭露實施例的圖像渲染監測方法透過計算裝置執行，可以包括如下步驟：接收與目標頁面的圖像渲染相關的設置；基於接收的該設置，嘗試渲染該目標頁面中包括的第一圖像；收集與該第一圖像的屬性相關的圖像資訊資料；和基於收集的該圖像資訊資料，監測該渲染是否成功或失敗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image rendering monitoring method is performed by a computing device, and may include receiving a setting related to image rendering of a target page, attempting rendering of a first image included in the target page based on the received setting, collecting image information data related to an attribute of the first image, and monitoring whether the rendering is successful or unsuccessful based on the collected image information data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100、S200、S300、S400:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="513" publication-number="202616192">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616192</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140483</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用以評估目標特徵之裝置、方法及記錄有命令之記錄媒體</chinese-title>
        <english-title>APPARATUS, METHOD AND RECORDING MEDIUM STORING INSTRUCTION FOR TESTING TARGET FEATURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250710B">G06Q30/0601</main-classification>
        <further-classification edition="202301120250710B">G06Q30/02</further-classification>
        <further-classification edition="202301120250710B">G06Q30/01</further-classification>
        <further-classification edition="202301120250710B">G06Q10/107</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉應玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YINGLING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王建偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIANWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電子裝置，其包括：一個以上之處理器；及一個以上之記憶體，其儲存有用以藉由上述一個以上之處理器而執行之命令；且上述裝置以如下方式構成，即，於執行上述命令時，上述一個以上之處理器如下：獲得請求對第1目標特徵進行評估之第1評估請求；響應於上述第1評估請求，從而基於一個以上之第1測試帳戶，產生指示第1目標頁面中之上述第1目標特徵之可存取性程度的第1評估指標，該第1目標頁面係應用一個以上之第1特徵及上述第1目標特徵者；基於一個以上之第2測試帳戶，產生指示第1基準頁面中之上述第1基準特徵之可存取性程度的第2評估指標，該第1基準頁面係應用與上述第1目標特徵形成對比之第1基準特徵、及與上述一個以上之第1特徵各者形成對比之一個以上之第2特徵者；基於上述第1評估指標及上述第2評估指標，將上述第1目標特徵及上述第1基準特徵中之可存取性程度更高之特徵確定為優勝者並產生第1評估結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">110:裝置</p>
        <p type="p">120:用戶之終端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="514" publication-number="202615791">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615791</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140629</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>流體連接器</chinese-title>
        <english-title>FLUID COUPLING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251023B">F16L37/36</main-classification>
        <further-classification edition="200601120251023B">F16L37/373</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許修源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HSIU-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳銘佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀諆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YAO-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陶玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAO, LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李凌雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, LING-XIONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種流體連接器，包括具有流體通道的殼體、收容於殼體內設有通孔的球閥、安裝於殼體外操控球閥轉動的操作構件、銷構件，操作構件操控球閥以使之能夠在閉合位置和打開位置之間轉動，當球閥處於閉合位置時，通孔與流體通道不連通，當球閥處於打開位置時，通孔與流體通道連通，殼體的前端設有容置孔及鎖定孔，容置孔內設有銷構件及彈性構件，殼體的前端設有能夠伴隨流體連接器與適配端連接器的對接轉動而位移以控制銷構件伸出與縮回的偵測組件，鎖定孔內設置有能夠移動以封閉鎖定孔及打開鎖定孔的止擋構件，當銷構件未伸出偵測組件而縮回時，銷構件阻止操作構件操控球閥打開，當銷構件伸出偵測組件而伸出時，銷構件解除對操作構件的鎖定以使球閥能夠被打開。流體連接器結構簡單且能夠實現與適配端連接器之間的可靠對接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fluid coupling includes a body defining a fluid channel, a ball valve with a through hole received in the body, an operating member installed outside the body to control the rotation of the ball valve, and a pin member. The operating member controls the ball valve so that it can rotate between a closed position that blocks the fluid channel and an open position that opens the fluid channel. When the ball valve is in the closed position, the through hole is not connected to the fluid channel. When the ball valve is in the open position, the through hole is connected to the fluid channel. The front end of the body is provided with an accommodating hole and a locking hole, and the pin member and an elastic member supporting the pin member are provided in the accommodating hole. The front end of the housing is provided with a detection component that can be displaced along with the docking rotation of the fluid coupling and a mating end coupling to control the extension and retraction of the pin member. The locking hole is provided with a stop member that can move to close the locking hole and open the locking hole. When the pin member is in a retracted state without extending out of the detection component, the pin member prevents the operating member from controlling the opening of the ball valve. When the pin member is in an extended state extending out of the detection component, the pin member unlocks the operating member so that the operating member can operate the opening of the ball valve. The fluid coupling of the present invention has a simple structure and can realize reliable docking with the mating coupling.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:流體通道</p>
        <p type="p">2:球閥</p>
        <p type="p">201:柱狀體</p>
        <p type="p">4:銷構件</p>
        <p type="p">51:滑塊</p>
        <p type="p">510:突塊</p>
        <p type="p">52:彈性元件</p>
        <p type="p">6:止擋構件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="515" publication-number="202615792">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615792</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140630</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>流體連接器</chinese-title>
        <english-title>FLUID COUPLING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251023B">F16L37/36</main-classification>
        <further-classification edition="200601120251023B">F16L37/373</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許修源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HSIU-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀諆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YAO-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陶玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAO, LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李凌雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, LING-XIONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種流體連接器，包括具有流體通道的本體，轉動設置於流體通道內的閥構件，連接至閥構件以控制閥構件轉動以實現打開和關閉的把手以及鎖銷組件，本體具有用於與一對接連接器接合的對接表面，對接表面凹設形成有收容鎖銷組件的收容孔，鎖銷組件包括旋轉部、能夠以旋轉部為軸心在收容孔內旋轉移動的插入部、用於與把手接合的操作部及彈性構件。插入部除上下運動外，還能夠隨著把手操作閥構件而繞旋轉部轉動，以與對接連接器完成對接，防止流體連接器因誤操作而導通。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fluid coupling includes a body having a fluid channel, a valve member rotatably disposed in the fluid channel, a handle connected to the valve member to control the rotation of the valve member to achieve opening and closing, and an interlock member assembly. The body has a docking surface for combining with a complementary coupling, and the docking surface is concavely formed with a receiving hole for receiving the interlock member assembly. The interlock member assembly includes a rotating portion, an insertion portion that can rotate in the receiving hole around the rotating portion, an operating portion for engaging with the handle, and an elastic member. In addition to moving up and down, the insertion portion can also rotate around the rotating portion as the handle operates the valve member to complete docking with the complementary coupling to prevent the fluid coupling from being opened by mistake.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:流體連接器</p>
        <p type="p">1:本體</p>
        <p type="p">11:對接表面</p>
        <p type="p">110:讓位空間</p>
        <p type="p">111:收容孔</p>
        <p type="p">112:對接凸起</p>
        <p type="p">113:對接凹槽</p>
        <p type="p">114:對接孔</p>
        <p type="p">3:把手</p>
        <p type="p">31:基體</p>
        <p type="p">32:握把</p>
        <p type="p">33:螺釘</p>
        <p type="p">4:鎖銷組件</p>
        <p type="p">402:插入部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="516" publication-number="202616797">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616797</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113140637</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示模組</chinese-title>
        <english-title>DISPLAY MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241129B">H05K5/02</main-classification>
        <further-classification edition="200601120241129B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商友達光電（蘇州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO (SUZHOU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳紅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示模組包含殼體、光學元件以及框體。殼體包含底板、第一擋板、第二擋板以及卡扣板。第一擋板至少部分垂直設置於底板。第二擋板至少部分垂直設置於底板並與第一擋板彼此分隔。卡扣板連接於第一擋板遠離底板之一端並與底板至少部分平行。光學元件位於底板，第一擋板位於光學元件與第二擋板之間。框體至少部分位於第一擋板與第二擋板之間，並至少部分夾置於底板與卡扣板之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display module includes a casing, an optical element and a frame. The casing includes a base plate, a first baffle, a second baffle and a locking plate. The first baffle is at least partially disposed perpendicularly on the base plate. The second baffle is at least partially disposed perpendicularly on the base plate and is spaced apart from the first baffle. The locking plate is connected to an end of the first baffle away from the base plate and is at least partially parallel with the base plate. The optical element is located on the base plate. The first baffle is located between the optical element and the second baffle. The frame is at least partially located between the first baffle and the second baffle, and is at least partially pressed between the base plate and the locking plate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示模組</p>
        <p type="p">110:殼體</p>
        <p type="p">111:底板</p>
        <p type="p">112:第一擋板</p>
        <p type="p">113:第二擋板</p>
        <p type="p">114:卡扣板</p>
        <p type="p">120:光學元件</p>
        <p type="p">130:框體</p>
        <p type="p">DA:排列方向</p>
        <p type="p">H:穿孔</p>
        <p type="p">H1:第一高度</p>
        <p type="p">H2:第二高度</p>
        <p type="p">L1:第一長度</p>
        <p type="p">L2:第二長度</p>
        <p type="p">OP:開口</p>
        <p type="p">TK:厚度</p>
        <p type="p">X:距離</p>
        <p type="p">ZP:抵壓區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="517" publication-number="202616687">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616687</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141216</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>相位陣列天線的校準方法與系統</chinese-title>
        <english-title>CALIBRATION METHOD AND SYSTEM FOR PHASED ARRAY ANTENNA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120250203B">H04B17/11</main-classification>
        <further-classification edition="201501120250203B">H04B17/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台揚科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICROELECTRONICS TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃浩雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HAO-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王聲遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHENG YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種校準方法，包含以下操作：將相位陣列天線分成N個群組，其中每個群組包含M個天線；將探頭設置在N個群組中第X群組的中心上方；根據第一組態和第二組態，獲得第X群組的M個天線中第Y天線輻射出的無線電波的第一預估振幅和第一預估相位；根據第一組態和第二組態，獲得第X群組的M個天線中第Y天線輻射出的無線電波的第二預估振幅和第二預估相位；以及根據第一預估振幅、第二預估振幅、第一預估相位和第二預估相位，校準第Y天線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a calibration method. The calibration method includes operations of: dividing a phased array antenna to N groups, wherein each groups includes M antennas; disposing a probe above a center of an Xth group of the N groups; obtaining a first estimated amplitude and a first estimated phase of a radio wave radiated by a Yth antenna of the M antennas of the Xth group according to a first and a second configurations; obtaining a second estimated amplitude and a second estimated phase of the radio wave radiated by the Yth antenna of the M antennas of the Xth group according to the first and second configurations; and calibrating the Yth antenna according to the first estimated amplitude, the second estimated amplitude, the first estimated phase, and the second estimated phase.</p>
      </isu-abst>
      <representative-img>
        <p type="p">60:校準方法</p>
        <p type="p">S610:操作</p>
        <p type="p">S620:操作</p>
        <p type="p">S630:操作</p>
        <p type="p">S640:操作</p>
        <p type="p">S650:操作</p>
        <p type="p">S660:操作</p>
        <p type="p">S670:操作</p>
        <p type="p">S680:操作</p>
        <p type="p">S690:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="518" publication-number="202616285">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616285</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113142252</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>動態隨機存取記憶體（DRAM）裝置</chinese-title>
        <english-title>DYNAMIC RANDOM-ACCESS MEMORY (DRAM) DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">G11C11/401</main-classification>
        <further-classification edition="200601120250401B">G11C5/04</further-classification>
        <further-classification edition="200601120250401B">G06F13/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳至仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種動態隨機存取記憶體（dynamic random-access memory，DRAM）裝置。DRAM裝置包括從屬DRAM晶片以及主DRAM晶片。從屬DRAM晶片包括從屬控制電路以及從屬電源電路。從屬控制電路依據從屬類別信號以及設定信號來產生從屬控制信號。從屬電源電路反應於從屬控制信號的第一值停止產生多個從屬電壓的至少其中之一，並反應於從屬控制信號的第二值產生所述多個從屬電壓。主DRAM晶片包括主控制電路。主控制電路依據主類別信號以及設定信號來產生主控制信號，並依據主控制信號來控制主DRAM晶片產生多個主電壓。從屬類別信號不同於主類別信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A dynamic random-access memory (DRAM) device is provided. The DRAM device includes a slave DRAM chip and a master DRAM chip. The slave DRAM chip includes a slave control circuit and a slave power circuit. The slave control circuit generates a slave control signal according to a slave category signal and a setting signal. The slave power circuit stops generating at least one of slave voltages in response to a first value of the slave control signal and generates the slave voltages in response to a second value of the slave control signal. The master DRAM chip includes a master control circuit. The master control circuit generates a master control signal according to a master category signal and the setting signal, and controls the master DRAM chip to generate master voltages according to the master control signal. The slave category signal is different from the master category signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:DRAM裝置</p>
        <p type="p">110:從屬DRAM晶片</p>
        <p type="p">120:主DRAM晶片</p>
        <p type="p">111:從屬控制電路</p>
        <p type="p">112:從屬電源電路</p>
        <p type="p">121:主控制電路</p>
        <p type="p">SC1:從屬控制信號</p>
        <p type="p">SC2:主控制信號</p>
        <p type="p">SM:主類別信號</p>
        <p type="p">SSL:從屬類別信號</p>
        <p type="p">SST:設定信號</p>
        <p type="p">VSL1~VSLn:從屬電壓</p>
        <p type="p">VM1~VMn:主電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="519" publication-number="202616084">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616084</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143189</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>快閃記憶體中的緩衝區管理</chinese-title>
        <english-title>BUFFER MANAGEMENT IN FLASH MEMORY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250206B">G06F12/0866</main-classification>
        <further-classification edition="201601120250206B">G06F12/08</further-classification>
        <further-classification edition="200601120250206B">G11C16/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慧榮科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICON MOTION, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳一誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳奕達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, I-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文殊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於一快閃記憶體控制器的一緩衝區管理控制裝置，該緩衝區管理控制裝置包含：一旗標表與一旗標管理引擎。該旗標表用於追蹤該快閃記憶體控制器的一共享記憶體內複數個配置單元的可用性狀態。該旗標管理引擎用於從該複數個配置單元中分配一個或多個配置單元，以緩存與一主機讀取命令相關的一讀取資料，並根據已分配的該一個或多個配置單元更新該旗標表，從而指出已分配的該一個或多個配置單元被佔用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A buffer management control device for use in a flash memory controller includes: a flag table and a flag management engine. The flag table is configured track availability status of a plurality of allocation units within a shared memory of the flash memory controller. The flag management engine is configured to assign one or more allocation units from the plurality of allocation units for buffering read data related to a host read command, and update the flag table according to the one or more assigned allocation units, thereby indicating that the one or more assigned allocation units are occupied.</p>
      </isu-abst>
      <representative-img>
        <p type="p">140:前端控制電路</p>
        <p type="p">180:緩衝區管理控制裝置</p>
        <p type="p">181:旗標更新緩衝區</p>
        <p type="p">182:旗標更新引擎</p>
        <p type="p">183:旗標表</p>
        <p type="p">184:旗標管理引擎</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="520" publication-number="202615828">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615828</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143403</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>溫度檢測裝置及方法</chinese-title>
        <english-title>TEMPERATURE DETECTION APPARATUS AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120241204B">G01J5/48</main-classification>
        <further-classification edition="202101120241204B">G01K13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周孫甫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, SUN-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘啟明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, CHI MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤文晉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, WEN CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃日正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JIH-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種溫度檢測裝置及方法。該裝置擷取一物體的一影像以及一熱影像。該裝置基於該影像，判斷該物體在該影像中的一第一輪廓。該裝置將該影像中的該第一輪廓疊合至該熱影像，以產生該熱影像中的一第二輪廓。該裝置基於該熱影像在該第二輪廓內的複數個溫度值，產生該物體的一溫度記錄。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Temperature detection apparatus and method are provided. The apparatus captures an image and a thermal image of an object. The apparatus determines a first contour of the object in the image based on the image. The apparatus overlays the first contour in the image on the thermal image to generate a second contour in the thermal image. The apparatus generates a temperature record of the object based on temperature values among the second contour in the thermal image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:溫度檢測裝置</p>
        <p type="p">12:處理器</p>
        <p type="p">14:相機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="521" publication-number="202614998">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614998</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143481</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>止血藥物配方</chinese-title>
        <english-title>FORMULATION OF HEMOSTATIC MEDICATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">A61K31/195</main-classification>
        <further-classification edition="200601120250501B">A61K31/7024</further-classification>
        <further-classification edition="200601120250501B">A61K33/00</further-classification>
        <further-classification edition="200601120250501B">A61P7/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內適境生醫科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDO-PEACE MEDICAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林錫璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, XI ZHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳劭農</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHAO NUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜學謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, HSUEH CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱銘峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王傳勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種止血藥物配方，包含：傳明酸(tranexamic acid)，重量份介於1至3.5之間；斯克拉非(sucralfate)，重量份介於1至4之間；鋇劑(barium)，重量份介於1至5之間；賦形劑，添加至止血藥物配方的比重介於1.2至2.5之間。血液的比重在4℃時大約在1.0590至1.0621之間，在37℃時大約在1.0475至1.037之間，血液的黏稠度大約在2.3至4.1泊(centipoise)之間，血液的表面張力大約在5.89N/m，透過控制止血藥物配方的比重介於1.2至2.5之間而大於血液的比重，使止血藥物配方可以克服血液的比重及黏稠性而沉降覆蓋出血處，提高止血效果。本發明也是一種將前述止血藥物配方透過內視鏡輸送至體內患部，並直接噴灑覆蓋在體內患部進行止血的用途。本發明也是一種將前述止血藥物配方透過噴灑裝置直接噴灑覆蓋在體外患部進行止血的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a formulation of hemostatic medication, including: 1 to 3.5 parts by weight of tranexamic acid; 1 to 4 parts by weight of sucralfate; 1 to 5 parts by weight of barium; and excipient added until the specific gravity of the hemostatic medication reaches between 1.2 and 2.5. The specific gravity of blood is approximately between 1.0590 and 1.0621 at 4°C, and between 1.0475 and 1.0370 at 37°C. The viscosity of blood ranges from about 2.3 to 4.1 centipoise, and the surface tension of blood is approximately 5.89 N/m. By controlling the specific gravity of the hemostatic medication to be between 1.2 and 2.5, and greater than that of blood, the hemostatic medication can overcome the specific gravity and viscosity of blood, allowing it to settle and cover the bleeding site, thereby enhancing the hemostatic effect. The present invention also provides a method for delivering the aforementioned hemostatic medication to an internal affected area through an endoscope, and directly spraying it to cover the internal affected area for hemostasis. The present invention also provides a method for directly spraying the aforementioned hemostatic medication onto an external affected area using a spraying device for hemostasis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="522" publication-number="202616627">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616627</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143494</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>降壓轉換器及其操作方法</chinese-title>
        <english-title>BUCK CONVERTER AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H02M3/156</main-classification>
        <further-classification edition="200601120250303B">H02M1/08</further-classification>
        <further-classification edition="200601120250303B">G05F1/565</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立錡科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHTEK TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉宇軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YU-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊詠竣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, YUNG-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種降壓轉換器，包括功率級、反饋網路、控制迴路、邏輯電路、驅動電路以及旁路檢測器。功率級包括輸入端及輸出端。反饋網路耦接於功率級，用以根據輸出電壓產生反饋電壓。控制迴路包括誤差放大器及比較器。誤差放大器用以通過比較參考電壓與反饋電壓來產生誤差電壓，比較器耦接於誤差放大器用以根據誤差電壓產生比較器信號。邏輯電路用以根據一組控制信號產生邏輯控制信號以實現控制方案。驅動電路用以根據邏輯控制信號驅動功率級。旁路檢測器用以將輸入電壓及預定閾值進行比較，並相應地產生旁路模式信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A buck converter includes a power stage, a feedback network, a control loop, a logic circuit, a driver circuit, and a bypass detector. The power stage includes an input terminal and an output terminal. The feedback network is coupled to the power stage and used to generate a feedback voltage according to the output voltage. The control loop includes an error amplifier and a comparator. The error amplifier is used to generate an error voltage by comparing a reference voltage with the feedback voltage. The comparator is coupled to the error amplifier and used to generate a comparator signal according to the error voltage. The logic circuit is used to generate a logic control signal to implement a control scheme according to a set of control signals. The driver circuit is used to drive the power stage according to the logic control signal. The bypass detector is used to compare the input voltage with a predetermined threshold and generate a bypass mode signal accordingly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:降壓轉換器</p>
        <p type="p">110:功率級</p>
        <p type="p">120:反饋網路</p>
        <p type="p">130:控制迴路</p>
        <p type="p">140:邏輯電路</p>
        <p type="p">150:驅動電路</p>
        <p type="p">160:旁路檢測器</p>
        <p type="p">170:零電流檢測器</p>
        <p type="p">180:導通時間產生器</p>
        <p type="p">132:誤差放大器</p>
        <p type="p">134:比較器</p>
        <p type="p">162:過電流保護電路</p>
        <p type="p">164:大電流檢測電路</p>
        <p type="p">VIN:輸入電壓</p>
        <p type="p">VOUT:輸出電壓</p>
        <p type="p">VFB:反饋電壓</p>
        <p type="p">VREF:參考電壓</p>
        <p type="p">VEAO:誤差放大器輸出電壓</p>
        <p type="p">VLX:切換節點電壓</p>
        <p type="p">VTH_IN:輸入電壓閾值</p>
        <p type="p">VTH_OUT:輸出電壓閾值</p>
        <p type="p">IL:輸出電感電流</p>
        <p type="p">ILOAD:負載電流</p>
        <p type="p">S1:第一開關</p>
        <p type="p">S2:第二開關</p>
        <p type="p">LOUT:輸出電感</p>
        <p type="p">COUT:輸出電容</p>
        <p type="p">SHYS:遲滯開關</p>
        <p type="p">RBYP:旁路電阻</p>
        <p type="p">RFB1,RFB2:反饋電阻</p>
        <p type="p">CFF:前饋電容</p>
        <p type="p">REAO:電阻</p>
        <p type="p">CEAO:電容</p>
        <p type="p">RLOAD:負載電阻</p>
        <p type="p">dCOMP:比較器輸出信號</p>
        <p type="p">LGC:邏輯控制信號</p>
        <p type="p">dBYP_IN:旁路模式輸入信號</p>
        <p type="p">dBYP_OUT:旁路模式輸出信號</p>
        <p type="p">dSLP:睡眠模式信號</p>
        <p type="p">TON:開啟時間信號</p>
        <p type="p">dOCP:過電流保護信號</p>
        <p type="p">dLCD:大電流檢測信號</p>
        <p type="p">EN_CMP:比較器啟用信號</p>
        <p type="p">EN_BYP:旁路啟用信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="523" publication-number="202616677">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616677</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143566</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有振鈴抑制的發射器電路</chinese-title>
        <english-title>TRANSMITTER CIRCUIT WITH RINGING SUPPRESSION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H04B3/20</main-classification>
        <further-classification edition="200601120250303B">G06F13/38</further-classification>
        <further-classification edition="200601120250303B">H04B1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晶焱科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMAZING MICROELECTRONIC CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周庭義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, TING-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李哲政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHE-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃煦修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSUN-HSIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有振鈴抑制的發射器電路，適於應用於控制器區域網路，該發射器電路包括：接收發射資料訊號並產生控制器區域網路高位準訊號與控制器區域網路低位準訊號的一控制器區域網路匯流排驅動電路、接收該控制器區域網路高位準訊號的一第一運算轉導放大器、以及接收該控制器區域網路低位準訊號的一第二運算轉導放大器。本發明係藉由通過採用顯性狀態時的共模電壓訊號與一控制訊號，當該控制訊號為高電壓位準時，第一、第二運算轉導放大器可主動地調整所述的控制器區域網路高、低位準訊號與該共模電壓一致，藉此抑制並消弭匯流排上的振鈴問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transmitter circuit with ringing suppression applicable to a controller area network bus is provided, which includes a CAN bus driver stage receiving a transmit data signal and generating a CAN high voltage signal and a CAN low voltage signal, a first operational transconductance amplifier electrically connected with the CAN bus driver stage for receiving the CAN high voltage signal, and a second operational transconductance amplifier electrically connected with the CAN bus driver stage for receiving the CAN low voltage signal. A common mode voltage of a dominant state as well as a control signal are applied such that when the control signal is logically high, the first and second operational transconductance amplifiers actively pulls the CAN high voltage signal and the CAN low voltage signal to be equal to the common mode voltage of the dominant state so as to suppress ringing phenomenon occurring in the CAN bus.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:發射器電路</p>
        <p type="p">301:第一運算轉導放大器</p>
        <p type="p">302:第二運算轉導放大器</p>
        <p type="p">303:控制器區域網路匯流排驅動電路</p>
        <p type="p">TXD:發射資料訊號</p>
        <p type="p">CANH:CAN高位準訊號</p>
        <p type="p">CANL:CAN低位準訊號</p>
        <p type="p">SIC_ON:控制訊號</p>
        <p type="p">V&lt;sub&gt;CM_DOM&lt;/sub&gt;:顯性狀態時的共模電壓訊號</p>
        <p type="p">VCC:電源供應電壓</p>
        <p type="p">GND:接地電壓</p>
        <p type="p">SC:斜率控制電路</p>
        <p type="p">MP1:第一電晶體</p>
        <p type="p">MP2:第二電晶體</p>
        <p type="p">MN3:第三電晶體</p>
        <p type="p">MN4:第四電晶體</p>
        <p type="p">D1:第一二極體</p>
        <p type="p">D2:第二二極體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="524" publication-number="202616658">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616658</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144172</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>訊號去噪處理方法、裝置、設備及存儲介質</chinese-title>
        <english-title>SIGNAL DENOISING PROCESSING METHOD, DEVICE, APPARATUS AND STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250708B">H03H17/02</main-classification>
        <further-classification edition="201301120250708B">G10L21/02</further-classification>
        <further-classification edition="200601120250708B">A61B5/024</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>疆域醫創科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGYU INNOVATIVE MEDICAL TECHNOLOGY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEI, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉秉昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, PING-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, ZHI-BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種訊號去噪處理方法、裝置、設備及存儲介質，訊號去噪處理方法包括：基於小波變換濾波器對電訊號進行小波去噪，得到小波去噪後的電訊號；基於形態篩檢程式削弱所述小波去噪後的電訊號中的偽吉布斯效應，得到去除肌電雜訊的目標電訊號。本申請提升了目標電訊號的純淨度與品質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a signal denoising processing method, a device, an apparatus and a storage medium, the signal denoising processing method includes: filtering electrical signals using a wavelet transform filter and obtaining wavelet denoised electrical signals; attenuating the pseudo-Gibbs effect in the wavelet denoised electrical signals using a morphological filter, and obtaining target electrical signals without myoelectric noises. This application enhances the purity and quality of target electrical signals.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10~S12:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="525" publication-number="202616157">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616157</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144196</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>預測商品訂單量之方法、電子裝置及記錄媒體</chinese-title>
        <english-title>METHOD, ELECTRONIC APPARATUS AND RECORDING MEDIUM FOR PREDICTING PRODUCT DEMAND</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250502B">G06Q10/04</main-classification>
        <further-classification edition="202301120250502B">G06Q10/087</further-classification>
        <further-classification edition="202301120250502B">G06Q30/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張攀峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, PANFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董火明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONG, HUOMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭睿銳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, RUIRUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何立文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, LIWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡馬爾　尤努斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMAL, YUNUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一實施例之藉由電子裝置而實行之預測商品之訂單量之方法，其可包括如下步驟：獲得第1時間段中之上述商品之第1預測訂單量之資訊，第1預測訂單量之資訊包括複數個學習模型各者算出之商品之預測訂單量之資訊；識別擬於上述第1時間段中應用於上述商品之一個以上之事件應用區間；基於預先確定之基準，確定上述一個以上之事件應用區間中的重複應用互不相同種類之事件之重複事件區間中之上述商品的預測訂單量；及基於上述第1時間段中之商品之第1預測訂單量之資訊、及上述重複事件區間之上述商品之預測訂單量，產生上述第1時間段中之上述商品之第2預測訂單量之資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S910:步驟</p>
        <p type="p">S920:步驟</p>
        <p type="p">S930:步驟</p>
        <p type="p">S940:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="526" publication-number="202616507">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616507</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144448</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置、包含其的半導體封裝及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE COMPRISING THE SAME AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250421B">H01L23/522</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪昇暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, SHEN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王明璁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MING-TSONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉人誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">電容結構設置在半導體晶粒的互連層中，所述半導體晶粒在半導體晶粒的垂直堆疊中與另一半導體晶粒接合。為了使電容結構的垂直長度能夠增加，電容結構的頂部電極層直接連接到半導體晶粒的接合結構，而不是電容結構的頂部電極層通過互連層中的一或多個中間導電結構連接到接合結構。這使得電容結構能夠垂直延伸穿過互連層的更多層，從而增加電容結構的頂部電極層及底部電極層的長度，進而增加電容結構的電容。電容結構的增加的電容能夠使半導體裝置實現增加的性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A capacitor structure is included in an interconnect layer of a semiconductor die that is bonded to another semiconductor die in a vertical stack of semiconductor dies. To enable the vertical length of the capacitor structure to be increased, the top electrode layer of the capacitor structure is directly connected to a bonding structure of the semiconductor die as opposed to the top electrode layer of the capacitor structure being connected to the bonding structure through one or more intermediate conductive structures in the interconnect layer. This enables the capacitor structure to vertically extend through a greater quantity of layers of the interconnect layer, which increases the length of the top and bottom electrode layers of the capacitor structure, which increases the capacitance of the capacitor structure. The increased capacitance of the capacitor structure may enable increased performance for the semiconductor device to be achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:示例實施方式</p>
        <p type="p">102:半導體裝置</p>
        <p type="p">104:元件層</p>
        <p type="p">106:互連層</p>
        <p type="p">108:接合層</p>
        <p type="p">110:基底層</p>
        <p type="p">112:積體電路元件</p>
        <p type="p">114,148,152:介電層</p>
        <p type="p">116,124,128,132,136:層間介電層/ILD層</p>
        <p type="p">118,122,126,130,134,146,150:蝕刻停止層/ESL</p>
        <p type="p">120:導電結構</p>
        <p type="p">138,142:頂部導孔</p>
        <p type="p">140,144:頂部金屬層</p>
        <p type="p">154:接合導孔</p>
        <p type="p">156:接合墊</p>
        <p type="p">158:接合介電層</p>
        <p type="p">160:電容結構</p>
        <p type="p">162:底部電極層</p>
        <p type="p">164:絕緣層</p>
        <p type="p">166:頂部電極層</p>
        <p type="p">168:介電填充物</p>
        <p type="p">170,172:覆蓋層</p>
        <p type="p">174,176:側壁間隔物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="527" publication-number="202616164">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616164</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144566</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>管理學習模型之方法、電子裝置及記錄媒體</chinese-title>
        <english-title>METHOD, ELECTRONIC APPARATUS AND RECORDING MEDIUM FOR MANAGING LEARNING MODEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250901B">G06Q10/08</main-classification>
        <further-classification edition="202301120250901B">G06Q30/06</further-classification>
        <further-classification edition="202001120250901B">G06F30/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張攀峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, PANFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董火明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONG, HUOMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭睿銳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, RUIRUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何立文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, LIWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一實施例之藉由電子裝置而實行之管理學習模型的方法可包括如下步驟：確定預先學習之第1學習模型之第1性能，上述第1學習模型係以預測商品之訂購量之方式學習之學習模型；基於學習資料集，產生使上述第1學習模型再次學習之第2學習模型；確定上述第2學習模型之第2性能；及基於上述第1性能與上述第2性能之間的比較結果，確定上述第1學習模型及上述第2學習模型中之將發佈至用戶終端之學習模型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S310:步驟</p>
        <p type="p">S320:步驟</p>
        <p type="p">S330:步驟</p>
        <p type="p">S340:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="528" publication-number="202616505">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616505</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144800</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250108B">H01L23/52</main-classification>
        <further-classification edition="200601120250108B">H01L23/58</further-classification>
        <further-classification edition="200601120250108B">H01L23/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日月光半導體製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED SEMICONDUCTOR ENGINEERING, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐紹恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, SHAO-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳信宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳弈錡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電子裝置。該電子裝置包括一第一電路模組及一第一屏蔽件。該第一屏蔽件安置於該電路模組之一側向側處，且包括經組態以減少該第一電路模組與該第一屏蔽件之一寄生耦合的一第一開口。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device is provided. The electronic device includes a first circuit module and a first shield. The first shield is disposed at a lateral side of the circuit module and includes a first opening configured to reduce a parasitic coupling of the first circuit module and the first shield.</p>
      </isu-abst>
      <representative-img>
        <p type="p">5:電子裝置</p>
        <p type="p">12:電子組件</p>
        <p type="p">12c:連接元件</p>
        <p type="p">14:電路模組</p>
        <p type="p">14s1a:部分</p>
        <p type="p">14s2a:部分</p>
        <p type="p">17:屏蔽件</p>
        <p type="p">17h:開口</p>
        <p type="p">21:囊封層</p>
        <p type="p">22:電子組件</p>
        <p type="p">24:電路模組</p>
        <p type="p">24s1:頂面</p>
        <p type="p">24s2:側向側(或側向表面)</p>
        <p type="p">27:屏蔽件</p>
        <p type="p">27h:開口</p>
        <p type="p">131:被動組件/第二電阻器</p>
        <p type="p">132:被動組件/電容器</p>
        <p type="p">132s1:頂面</p>
        <p type="p">132s3:側向表面</p>
        <p type="p">133:被動組件/第一電阻器</p>
        <p type="p">150:載體</p>
        <p type="p">150s1:長側</p>
        <p type="p">171:第一部分</p>
        <p type="p">172:第二部分</p>
        <p type="p">231:被動組件</p>
        <p type="p">232:被動組件</p>
        <p type="p">233:被動組件</p>
        <p type="p">333:被動組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="529" publication-number="202615599">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615599</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144959</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>轉印油墨及其轉印方法</chinese-title>
        <english-title>TRANSFER INK AND TRANSFERING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120250402B">C09D11/03</main-classification>
        <further-classification edition="201401120250402B">C09D11/10</further-classification>
        <further-classification edition="201401120250402B">C09D11/101</further-classification>
        <further-classification edition="201401120250402B">C09D11/107</further-classification>
        <further-classification edition="200601120250402B">B41M5/382</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊國林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, GUO-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃博文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PO-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊玉純</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YU-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牛二保</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIU, ER-BAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種轉印油墨。此轉印油墨包含55wt%-70wt%之聚合性預聚物、11wt%-16wt%之感光性單體、0.8wt%-1.7wt%之光引發劑、6wt%-11wt%之液體、12wt%-22wt%之耐磨丙烯酸混合反應樹脂以及溶劑。本案並提供應用此轉印油墨之轉印方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transfer ink is provided. The transfer ink comprises 55wt%-70wt% of aggregation prepolymer, 11wt%-16wt% of photosensitivity monomer, 0.8wt%-1.7wt% of photoinitiator, 6wt%-11wt% of liquid, 12wt%-22wt% of wear-resistant acrylic acid mixed reaction resin, and solvent. A transfer method using the transfer ink is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110,S120,S130,S140,S150:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="530" publication-number="202616359">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616359</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144970</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>形成半導體結構之方法</chinese-title>
        <english-title>METHODS OF FORMING SEMICONDUCTOR STRUCTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">H01L21/027</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方偉權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, WEI-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種形成半導體結構之方法。方法包括以下操作。形成類金剛石碳硬遮罩層在基板上，其中類金剛石碳硬遮罩層的吸光度小於或等於0.5。形成介電抗反射塗層在類金剛石碳硬遮罩層上。形成底部抗反射塗層在介電抗反射塗層上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a method of forming a semiconductor structure. The method includes the following operations. A diamond-like carbon hard mask layer is formed on a substrate, in which an absorbance of the diamond-like carbon hard mask layer is smaller than or equal to 0.5. A dielectric anti-reflective coating layer is formed on the diamond-like carbon hard mask layer. A bottom anti-reflective coating layer is formed on the dielectric anti-reflective coating layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">101:操作</p>
        <p type="p">102:操作</p>
        <p type="p">103:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="531" publication-number="202616041">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616041</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145147</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>工業用電子設備之散熱風扇</chinese-title>
        <english-title>COOLING FAN FOR INDUSTRIAL ELECTRONIC EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250207B">G06F1/20</main-classification>
        <further-classification edition="200601120250207B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商成原產電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNGWON INDUSTRIAL SYSTEMS CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金太根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, TAEKEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種工業用電子設備之散熱風扇，具體而言，散熱風扇之電源供應結構不採取現有之連接器類型而採取能夠直接連接之結構，從而能提高電源線連接作業之工作便利性並解決連接器方式中長期存在之問題。本發明包含：外殼，構成散熱風扇之外形；葉片，安裝在前述外殼之內部；馬達，安裝在前述外殼並且為葉片提供旋轉力；電源供應單元，安裝在前述外殼並且為馬達供應電源；前述電源供應單元上外部電源線藉由螺絲結合方式固定於此，以進行電氣連接而實現電源供應之方式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:外殼</p>
        <p type="p">200:葉片</p>
        <p type="p">300:馬達</p>
        <p type="p">400:電源供應單元</p>
        <p type="p">500:外部電源線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="532" publication-number="202616486">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616486</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145329</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有無機基材的無導線光學感測器封裝</chinese-title>
        <english-title>WIRE-FREE OPTICAL SENSOR PACKAGE WITH AN INORGANIC SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250925B">H01L23/28</main-classification>
        <further-classification edition="200601120250925B">H01L23/488</further-classification>
        <further-classification edition="202501120250925B">H10F39/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商半導體組件工業公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博塔庫爾　斯瓦爾納爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BORTHAKUR, SWARNAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西爾斯比　克里斯多福　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILSBY, CHRISTOPHER D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種封裝，該封裝包括無機基材，其中第一金屬間介電層設置在該無機基材的第一表面上。光學感測器晶粒透過連接器附接至並且電連接至第一金屬間介電層中的焊墊。模製材料層設置在第一金屬間介電層上，包封光學感測器晶粒。第二金屬間介電層設置在模製材料層上。開口延伸穿過在第一金屬間介電層與第二金屬間介電層之間的模製材料層。該開口填充或內襯導電材料，該導電材料電連接第一金屬間介電層和第二金屬間介電層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A package includes an inorganic substrate with a first inter-metal dielectric layer disposed on a first surface of the inorganic substrate. An optical sensor die is attached to and electrically connected to a pad in the first inter-metal dielectric layer by a connector. A molding material layer is disposed on the first inter-metal dielectric layer encapsulating the optical sensor die. A second inter-metal dielectric layer is disposed on the molding material layer. An opening extends through the molding material layer between the first inter-metal dielectric layer and the second inter-metal dielectric layer. The opening is filled or lined with conductive material electrically connecting the first inter-metal dielectric layer and the second inter-metal dielectric layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:玻璃基材</p>
        <p type="p">100A:無導線光學感測器封裝(光學感測器封裝)</p>
        <p type="p">110:光學感測器晶粒</p>
        <p type="p">111:氣隙、氣腔</p>
        <p type="p">112:OASA</p>
        <p type="p">113:焊墊</p>
        <p type="p">116,118:IMD層</p>
        <p type="p">124:導電焊墊、金屬焊墊</p>
        <p type="p">126:導電焊墊、金屬焊墊(焊墊)</p>
        <p type="p">150:球柵陣列</p>
        <p type="p">152:焊球</p>
        <p type="p">154:無導線連接器</p>
        <p type="p">160:封裝材料層</p>
        <p type="p">162:TMV</p>
        <p type="p">165:模製本體</p>
        <p type="p">BG:底部表面、後表面</p>
        <p type="p">D:直徑</p>
        <p type="p">DT:厚度</p>
        <p type="p">DW:寬度</p>
        <p type="p">EP:邊緣部分</p>
        <p type="p">EW:寬度</p>
        <p type="p">GT:厚度</p>
        <p type="p">GW:寬度</p>
        <p type="p">MT:厚度</p>
        <p type="p">S1,S2:側面</p>
        <p type="p">TG,TS,TM:頂部表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="533" publication-number="202616503">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616503</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145421</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>整合式被動元件封裝、半導體封裝及其形成方法</chinese-title>
        <english-title>INTEGRATED PASSIVE DEVICE PACKAGE, SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250703B">H01L23/498</main-classification>
        <further-classification edition="200601120250703B">H01L23/525</further-classification>
        <further-classification edition="200601120250703B">H01L23/538</further-classification>
        <further-classification edition="200601120250703B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂孟昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, MONSEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳碩懋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHUO-MAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳憲偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>言　瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, KATHY WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">整合式被動元件(IPD)封裝被製造為在IPD封裝的兩側或更多側上包括電連接。IPD封裝可以嵌入在半導體封裝的封裝基板的基板核心中，這使得能夠使用IPD封裝的多側上的導電焊墊將電連接連接到封裝基板的頂部和底部重分佈結構，從而使得IPD封裝中所包含的被動元件結構的數量和密度能夠增加。IPD封裝的兩側或更多側上的電連接使得IPD封裝能夠包括多個被動元件部件的IPD層或層面，這使得IPD封裝中所包含的被動元件結構的數量和密度能夠進一步增加。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated passive device (IPD) package is manufactured to include electrical connections on two or more sides of the IPD package. The IPD package may be embedded in a substrate core of a package substrate of a semiconductor package, which enables electrical connections to be connected to top and bottom redistribution structures of the package substrate using the conductive pads on multiple sides of the IPD package, thereby enabling the quantity and density of passive device structures included in the IPD package to be increased. The electrical connections on two or more sides of the IPD package enable the IPD package to include a plurality of IPD layers or slides of passive device components, which enables the quantity and density of passive device structures included in the IPD package to be further increased.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體封裝</p>
        <p type="p">102:封裝基板</p>
        <p type="p">302:基板核心</p>
        <p type="p">304a:第一重分佈結構</p>
        <p type="p">304b:第二重分佈結構</p>
        <p type="p">308:基板層</p>
        <p type="p">312:凹槽</p>
        <p type="p">314:填充材料</p>
        <p type="p">316:整合式被動元件(IPD)封裝</p>
        <p type="p">318a,318b:被動元件結構</p>
        <p type="p">320a,320b:絕緣體層</p>
        <p type="p">322a,322b:導電結構</p>
        <p type="p">400:範例</p>
        <p type="p">402a:第一IPD層</p>
        <p type="p">402b:第二IPD層</p>
        <p type="p">404a,404b:基板層</p>
        <p type="p">406a,406a-1,406a-2,406b,406b-1,406b-2:導電焊墊/導電結構</p>
        <p type="p">408a,408a-1,408a-2,408b,408b-1,408b-2:導電焊墊</p>
        <p type="p">410a,410a-1,410a-2,410b,410b-1,410b-2:互連結構</p>
        <p type="p">412a,412a-1,412a-2,412b,412b-1,412b-2:接觸件</p>
        <p type="p">414a,414b:凹槽</p>
        <p type="p">416a,416b:鈍化層</p>
        <p type="p">418:接合界面</p>
        <p type="p">420:接地路徑</p>
        <p type="p">422:信號/功率路徑</p>
        <p type="p">D1,D2,D3:尺寸</p>
        <p type="p">x,z:軸</p>
        <p type="p">B-B:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="534" publication-number="202615132">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615132</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145447</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔過濾器的方法及設備</chinese-title>
        <english-title>FILTER CLEANING METHODS AND APPARATUSES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">B01D29/60</main-classification>
        <further-classification edition="200601120251103B">B01D46/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾易龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, YI-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾恒毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, HENG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧順展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENG, SHUN CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪志誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHIH-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TSUNG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊豐安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, FENG-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭聖嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, SHENG CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭榮晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, JUNG-HUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於清潔過濾器的方法包括使清潔液體流經過濾器殼體以清潔過濾器殼體中的過濾器，並獲得清潔液體的流動參數。此方法更包括基於清潔液體的流動參數確定過濾器的狀態以及當過濾器的狀態為乾淨時將流動參數關聯到過濾器的屬性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for cleaning a filter includes flowing a cleaning fluid through a filter housing to clean the filter in the filter housing and obtaining flowing parameters of the cleaning fluid. The method further includes determining a condition of the filter based on the flowing parameters of the cleaning fluid, and associating the flowing parameters to attributes of the filter when the condition of the filter is clean.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:過濾器</p>
        <p type="p">20:乾淨的過濾器</p>
        <p type="p">30:晶圓製造設備</p>
        <p type="p">100:過濾器清潔設備</p>
        <p type="p">101:槽</p>
        <p type="p">102:泵</p>
        <p type="p">103a:入口</p>
        <p type="p">103b:出口</p>
        <p type="p">103:過濾器殼體組件</p>
        <p type="p">104:過濾器殼體</p>
        <p type="p">105:連接管線</p>
        <p type="p">106a、106b:感測器</p>
        <p type="p">150:控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="535" publication-number="202616147">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616147</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145462</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用于目標市場的語言模型學習方法及裝置</chinese-title>
        <english-title>METHOD AND DEVICE FOR TRAINING LANGUAGE MODEL FOR TARGET MARKET</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250203B">G06N3/08</main-classification>
        <further-classification edition="201901120250203B">G06N20/00</further-classification>
        <further-classification edition="202001120250203B">G06F40/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪瑜婧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YUJING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李豁然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, HUORAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳逸人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YIREN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>毛祥薈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAO, XIANGHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許春旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, CHUNXU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文沛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, PEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬爾　山塔努</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, SHANTANU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王音</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>駱宇沖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, YUCHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣琦琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, QIQI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬春洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, CHUNYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉賈拉姆　維傑延德拉薩薩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAJARAM, VIJAYENDRASASTHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫文婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MO, WENTING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="15">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程　滔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="16">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴　泰鎮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, TAEJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="17">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋意維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, YIWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="18">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜爾吉亞　索努</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DURGIA, SONU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="19">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科拉里　普拉南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOLARI, PRANAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及通過至少一個處理器執行的語言模型學習方法。語言模型學習方法包括如下步驟：獲取預訓練的基礎語言模型；獲取與客源市場（source market）有關的第一數據；以第一數據爲基礎調整基礎語言模型來生成第一語言模型；獲取與目標市場（target market）有關的第二數據；以及以第二數據爲基礎調整第一語言模型來生成第二語言模型，第二語言模型爲以所輸入的查詢（query）及商品（product）對爲基礎來輸出查詢和商品的相關性標簽（relevance label）的機器學習模型，相關性標簽表示查詢與商品的相關程度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a method for training a language model for a target market, performed by at least one processor. The method includes obtaining a pretrained base language model, obtaining first data associated with a source market, generating a first language model by tuning the base language model based on the first data, obtaining second data associated with the target market, and generating a second language model by tuning the first language model based on the second data, wherein the second language model is a machine learning model configured to output a relevance label based on a pair of an input query and a product and the relevance label indicates a level of relevance between the input query and the product.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基礎語言模型</p>
        <p type="p">110:第一語言模型</p>
        <p type="p">120:第二語言模型</p>
        <p type="p">102:第一數據</p>
        <p type="p">104:第二數據</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="536" publication-number="202616901">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616901</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145490</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICES AND METHODS OF FORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250401B">H10F39/12</main-classification>
        <further-classification edition="202501120250401B">H10F39/18</further-classification>
        <further-classification edition="200601120250401B">G02B5/20</further-classification>
        <further-classification edition="200601120250401B">G02B5/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王苡璇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YI-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃正宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHENG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江偉傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, WEI-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周耕宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, KENG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊君豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, CHUN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳紋浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, WEN-HAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張志光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-KUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置的半導體光學感測器結構可以包括光子吸收區域和位於光子吸收區域上方的抗反射結構（例如，抗反射膜、光柵結構）。可以針對半導體光學感測器結構調整抗反射結構以實現入射光的最小反射。具體地，可以調整諸如抗反射結構的膜厚度、折射率、光柵高度、光柵半節距、光柵寬度和/或光柵間距（以及其他示例）之類的屬性，以實現入射光的高百分比的透射率（例如，傳播到半導體光學感測器結構的光子吸收區域的入射光的高百分比的光子）和/或以實現對被反射的入射光的相消干涉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor optical sensor structure of a semiconductor device may include a photon absorption region and an anti-reflection structure (e.g., an anti-reflection film, a grating structure) above the photon absorption region. The anti-reflection structure may be tuned for the semiconductor optical sensor structure to achieve minimal reflection of incident light. In particular, attributes such as film thickness, refractive index, grating height, grating half-pitch, grating width, and/or grating spacing (among other examples) of the anti-reflection structure may be tuned to achieve a high percentage of transmittance of incident light (e.g., a high percentage of photons of the incident light that propagate through to the photon absorption region of the semiconductor optical sensor structure) and/or may be tuned to achieve destructive interference for incident light that is reflected.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:光偵測器結構</p>
        <p type="p">104:隔離結構</p>
        <p type="p">200:範例實施方式</p>
        <p type="p">202:半導體層</p>
        <p type="p">204:光子吸收區域</p>
        <p type="p">206:抗反射膜</p>
        <p type="p">208:光學間隔件結構</p>
        <p type="p">210:微透鏡結構</p>
        <p type="p">D1:尺寸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="537" publication-number="202616111">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616111</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145516</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>主機、安全登入系統以及安全登入方法</chinese-title>
        <english-title>HOST, SECURE LOGIN SYSTEM, AND SECURE LOGIN METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250203B">G06F21/30</main-classification>
        <further-classification edition="201301120250203B">G06F21/32</further-classification>
        <further-classification edition="200601120250203B">G06F3/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪御恆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, YU HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭家堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIAU, JIA-YAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述了主機、安全登入系統以及安全登入方法。主機包括儲存電路以及處理器。儲存電路被設置成儲存程式碼。處理器耦接到儲存電路，並被設置成存取程式碼，以執行：響應於登入請求，將多個關鍵字元編碼為多個關鍵手勢，以判定多個關鍵字元與多個關鍵手勢之間的關鍵關係；基於關鍵關係，在虛擬世界中顯示多個關鍵字元中的至少一部分；取得使用者的多個輸入手勢的手勢序列；基於關鍵關係，將手勢序列解碼為輸入序列；以及輸出用於登入請求的輸入序列。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A host, a secure login system, and a secure login method are described herein. The host includes a storage circuit and a processor. The storage circuit is configured to store a program code. The processor is coupled to the storage circuit and configured to access the program code to execute: in response to a login request, encoding a plurality of key characters into a plurality of key gestures to determine a key relationship between the plurality of key characters and the plurality of key gestures; displaying at least part of the plurality of key characters in a virtual world based on the key relationship; obtaining a gesture sequence of a plurality of input gestures of a user; decoding the gesture sequence into an input sequence based on the key relationship; and outputting the input sequence for the login request.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:安全登入方法</p>
        <p type="p">S710、S720、S730、S740、S750:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="538" publication-number="202616396">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616396</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145587</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>封裝結構及形成裝置結構的方法</chinese-title>
        <english-title>PACKAGE STRUCTURE AND METHOD OF FORMING DEVICE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250526B">H01L21/56</main-classification>
        <further-classification edition="200601120250526B">H01L21/60</further-classification>
        <further-classification edition="200601120250526B">H01L23/31</further-classification>
        <further-classification edition="200601120250526B">H01L23/488</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉醇鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TZUAN-HORNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇安治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, AN-JHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YEN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧博元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENG, PO-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于宗源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, TSUNG-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張智浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許喆翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHE-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁崇銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, CHUNG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">裝置結構可以通過以下方式形成：提供第一重分佈結構；在第一重分佈結構的周邊區域上設置包含至少一個金屬柱的金屬阻裂結構；將連接晶粒附著到第一重分佈結構的中心區域；在連接晶粒和金屬阻裂結構周圍形成封裝框架；以及在連接晶粒、金屬阻裂結構和封裝框架上形成第二重分佈結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device structure may be formed by: providing a first redistribution structure; disposing a metallic crack-stop structure comprising at least one metallic pillar over a peripheral region of the first redistribution structure; attaching a connection die to a center region of the first redistribution structure; forming an encapsulation frame around the connection die and the metallic crack-stop structure; and forming a second redistribution structure over the connection die, the metallic crack-stop structure, and the encapsulation frame.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:連接晶粒</p>
        <p type="p">110:TSV基底</p>
        <p type="p">111:可選的介電蓋層</p>
        <p type="p">120:貫穿基底通孔結構</p>
        <p type="p">122:金屬墊</p>
        <p type="p">144:連接晶粒凸塊結構</p>
        <p type="p">148:焊料部分</p>
        <p type="p">149:底膠材料部分</p>
        <p type="p">150:連接晶粒重分佈介電層</p>
        <p type="p">160、340、380:重分佈線路連接件</p>
        <p type="p">200、201:晶粒</p>
        <p type="p">205:晶粒框架</p>
        <p type="p">210:晶粒半導體基底</p>
        <p type="p">220:半導體裝置</p>
        <p type="p">222:金屬內連線結構</p>
        <p type="p">224:晶粒側接合墊</p>
        <p type="p">230:介電材料層</p>
        <p type="p">290:複合晶粒</p>
        <p type="p">300、600、600':中介層</p>
        <p type="p">305:封裝框架</p>
        <p type="p">320、390:重分佈結構</p>
        <p type="p">330、370:重分佈介電層</p>
        <p type="p">340E/380E:密封環結構</p>
        <p type="p">350:TIV結構/貫穿中介層通孔結構</p>
        <p type="p">354、394、3541、3542:凸塊結構</p>
        <p type="p">354E:凸塊結構/密封環結構</p>
        <p type="p">360:金屬阻裂結構</p>
        <p type="p">365:中介層邊緣保護組件</p>
        <p type="p">398:焊料部分</p>
        <p type="p">800:複合封裝</p>
        <p type="p">UA1:區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="539" publication-number="202616169">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616169</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145665</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>安全庫存計算系統以及安全庫存計算方法</chinese-title>
        <english-title>SAFETY STOCK CALCULATION AND SAFETY STOCK CALCULATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250319B">G06Q10/087</main-classification>
        <further-classification edition="202301120250319B">G06Q10/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商鼎捷數智股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIGIWIN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鼎新數智股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DATA SYSTEMS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝麗霞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, LIXIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李驍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王佳辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIACHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家征</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JIAZHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李成力</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHENGLI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏斯琴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, SIQIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐陽佩智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OUYANG, PEIZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣周萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, ZHOUPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
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          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹孟宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, MENGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
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          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方肖峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, XIAOFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>覃月仙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIN, YUEXIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="15">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹有沛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, YOUPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="16">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王晨燁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHENYE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種安全庫存計算系統以及安全庫存計算方法。安全庫存計算系統包括處理器以及儲存裝置。儲存裝置用以儲存庫存計算模組、統計模組以及模擬及比對模組。處理器電性連接儲存裝置，並且用以執行庫存計算模組、統計模組以及模擬及比對模組。庫存計算模組根據歷史數據、當前數據以及可靠因子數據計算出推薦安全庫存。統計模組根據可靠因子數據以及當前數據計算出統計安全庫存。模擬及比對模組基於歷史數據對推薦安全庫存以及統計安全庫存進行模擬，以根據模擬結果產生適合安全庫存。庫存計算模組包括可靠因子分析單元，可靠因子分析單元分析歷史數據以及當前數據以產生可靠因子數據。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A safety stock calculation system and a safety stock calculation method. The safety stock calculation system includes a processor and a storage device. The storage device is used to store a stock calculation module, a statistics module, and a simulation and comparison module. The processor is electrically connected to the storage device and is used to execute the stock calculation module, the statistics module, and the simulation and comparison module. The stock calculation module calculates the recommended safety stock based on historical data, current data, and reliability factor data. The statistics module calculates the statistical safety stock based on reliability factor data and current data. The simulation and comparison module compares the recommended safety stock and statistical safety stock based on historical data, and generates the appropriate safety stock according to the comparison results. The stock calculation module includes a reliability factor analysis unit, which analyzes historical data and current data to generate reliability factor data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:安全庫存計算系統</p>
        <p type="p">110:處理器</p>
        <p type="p">120:儲存裝置</p>
        <p type="p">121:庫存計算模組</p>
        <p type="p">122:統計模組</p>
        <p type="p">123:模擬及比對模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="540" publication-number="202616515">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616515</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145947</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>背側電源軌裝置的形成方法與半導體裝置結構</chinese-title>
        <english-title>METHOD OF FORMING BACK-SIDE POWER RAIL DEVICE AND SEMICONDUCTOR DEVICE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251008B">H01L23/535</main-classification>
        <further-classification edition="200601120251008B">H01L23/528</further-classification>
        <further-classification edition="200601120251008B">H01L21/768</further-classification>
        <further-classification edition="200601120251008B">H01L21/76</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭詠世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YUNG-SHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">背側電源軌裝置的形成方法包括形成裝置層於基板的前側上；形成第一內連線結構於裝置層上，且第一內連線結構包括第一導電結構；形成第一介電層於第一內連線結構上；形成壓縮材料層於第一介電層上；形成接合層於第一介電層與壓縮材料層上；接合承載基板與接合層；自基板的背側移除基板的至少一部分以露出裝置層；形成與第一內連線結構對向的一或多個背側通孔以耦接至裝置層；形成第二內連線結構於裝置層與背側通孔上；以及形成一或多個第二導電結構於第二內連線結構上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of forming a back-side power rail device includes forming a device layer over a front-side of a substrate, forming a first interconnect structure over the device layer, the first interconnect structure including a first conductive feature, forming a first dielectric layer over the first interconnect structure, forming a compressive material layer over the first dielectric layer, forming a bonding layer over the first dielectric layer and the compressive material layer, bonding a carrier substrate with the bonding layer, removing, from a back-side of the substrate, at least a portion of the substrate to expose the device layer, forming one or more back-side vias coupled with the device layer opposite the first interconnect structure, forming a second interconnect structure over the device layer and the one or more back-side vias, and forming one or more second conductive features over the second interconnect structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">T1,T2:厚度</p>
        <p type="p">W1,W2:寬度</p>
        <p type="p">100:半導體裝置結構</p>
        <p type="p">102:基板</p>
        <p type="p">102a:前側</p>
        <p type="p">102b:背側</p>
        <p type="p">106:第一半導體層</p>
        <p type="p">118:絕緣材料</p>
        <p type="p">144:介電間隔物</p>
        <p type="p">146:磊晶源極/汲極區</p>
        <p type="p">162:接點蝕刻停止層</p>
        <p type="p">164:第一層間介電層</p>
        <p type="p">170:閘極介電層</p>
        <p type="p">172:閘極層</p>
        <p type="p">176:閘極遮罩</p>
        <p type="p">178:第二層間介電層</p>
        <p type="p">179:第三層間介電層</p>
        <p type="p">180:源極/汲極接點</p>
        <p type="p">181:源極/汲極通孔</p>
        <p type="p">182:閘極接點</p>
        <p type="p">184:電晶體結構</p>
        <p type="p">185:裝置層</p>
        <p type="p">186:前側內連線結構</p>
        <p type="p">188,188a,188b,188c,188d:第一導電結構</p>
        <p type="p">190:第一介電層</p>
        <p type="p">192:前側通孔</p>
        <p type="p">194:第二介電層</p>
        <p type="p">200:壓縮材料層</p>
        <p type="p">206:接合層</p>
        <p type="p">208:承載基板</p>
        <p type="p">210:第二接合層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="541" publication-number="202616077">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616077</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145963</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電腦系統、修復記憶體模組的方法以及電腦程式產品</chinese-title>
        <english-title>COMPUTER SYSTEM AND METHOD OF REPAIRING A MEMORY MODULE AND COMPUTER-PROGRAM PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">G06F11/07</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣達電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUANTA COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林毓庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳茂文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MAO-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李韋德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, WEI-DE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊清皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CING-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供用於儲存與記憶體模組中之記憶體橫列的後封裝修復相關之資料的方法以及系統。判斷於記憶體模組之記憶體庫組之橫列中的錯誤。在電腦系統的初始啟動時，對橫列執行軟體後封裝修復。累加對橫列執行之軟體後封裝修復的次數，並儲存於永久儲存裝置中，比如記憶體模組的EEPROM。已儲存的軟體後封裝修復計數可用於判斷在電腦系統的下一次啟動時，是否對橫列執行軟體後封裝修復，或是否對橫列執行硬體後封裝修復。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and system for storing data relating to post package repairs for memory rows in a memory module is provided. An error in a row of a memory bank of the memory module is determined. A software post package repair is performed on the row on an initial boot of the computer system. A number of software post package repairs performed on the row is incremented and stored in a permanent storage device such as an EEPROM of the memory module. The stored software post package repair count may be used to determine whether to perform a software post package repair on the row or whether to perform a hardware post package repair on the row on a subsequent boot of the computer system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:流程圖</p>
        <p type="p">510,512,514,516,518,520,522,524,526,528,530,532,534,536,538,540,542,544:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="542" publication-number="202616509">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616509</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146156</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體模組、半導體模組的製造方法及封裝結構</chinese-title>
        <english-title>SEMICONDUCTOR MODULE, METHOD FOR MAKING SEMICONDUCTOR MODULE AND PACKAGE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250703B">H01L23/525</main-classification>
        <further-classification edition="200601120250703B">H01L23/538</further-classification>
        <further-classification edition="200601120250703B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴杰隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHIEH-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MENG-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳憲偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>言　瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, KATHY WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體模組，包括中介層、複數個半導體晶粒以及背側電容器。複數個半導體晶粒位於中介層上，其中半導體晶粒中的每個半導體晶粒具有朝向中介層的前側表面以及相對於中介層的背側表面。背側電容器位於半導體晶粒中的至少一者的背側表面上並且電性耦合到中介層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor module includes an interposer, a plurality of semiconductor dies on the interposer, wherein each semiconductor die of the plurality of semiconductor dies has a frontside surface facing the interposer and a backside surface opposite to the interposer, and a backside capacitor on the backside surface of at least one of the plurality of semiconductor dies and electrically coupled to the interposer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:中介層</p>
        <p type="p">12:聚合物層</p>
        <p type="p">12a:重分佈層</p>
        <p type="p">13:上鈍化層</p>
        <p type="p">13a:上接合墊</p>
        <p type="p">14:下鈍化層</p>
        <p type="p">14a:下接合墊</p>
        <p type="p">120:半導體模組</p>
        <p type="p">121:可控塌陷晶片連接凸塊(C4凸塊)</p>
        <p type="p">127:上成型層</p>
        <p type="p">128:微凸塊</p>
        <p type="p">129:半導體模組底部填充層</p>
        <p type="p">140:半導體晶粒</p>
        <p type="p">140a:半導體晶粒上表面(上表面)</p>
        <p type="p">141:第一半導體晶粒</p>
        <p type="p">142:第二半導體晶粒</p>
        <p type="p">145:主動區</p>
        <p type="p">201:鈍化膜</p>
        <p type="p">210:背側電容器</p>
        <p type="p">210A:第一電容器</p>
        <p type="p">210B:第二電容器</p>
        <p type="p">211:第一金屬膜</p>
        <p type="p">212:第二金屬膜</p>
        <p type="p">215:第一金屬膜</p>
        <p type="p">216:第二金屬膜</p>
        <p type="p">220:分佈結構</p>
        <p type="p">221:第一分佈線</p>
        <p type="p">222:第二分佈線</p>
        <p type="p">230:連接結構</p>
        <p type="p">231:第一成型通孔</p>
        <p type="p">232:第二成型通孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="543" publication-number="202616397">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616397</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146158</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>裝置結構及其製造方法</chinese-title>
        <english-title>DEVICE STRUCTURE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250703B">H01L21/56</main-classification>
        <further-classification edition="200601120250703B">H01L23/31</further-classification>
        <further-classification edition="200601120250703B">H01L23/498</further-classification>
        <further-classification edition="200601120250703B">H01L23/525</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴杰隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHIEH-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MENG-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳憲偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>言　瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, KATHY WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">可提供包括半導體晶粒的二維陣列以及沿著切割通道區域橫向延伸的溝槽的矩形網格的基板。溝槽的矩形網格可以用彈性介電填充材料填充。可以沿著切割通道區域切割半導體晶粒的二維陣列以及填充溝槽的矩形網格的彈性介電填充材料的網格形部分的組合。形成複數個彈性襯墊半導體晶粒。每一個彈性填充半導體晶粒包括相應的單片化半導體晶粒，單片化半導體晶粒包括位於介電材料層上的半導體裝置以及金屬凸塊結構，且更包括彈性保護材料部分，彈性保護材料部分包括彈性介電填充材料的一部分，並且彈性保護材料部分橫向地圍繞介電材料層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate including a two-dimensional array of semiconductor dies and a rectangular grid of trenches that laterally extend along dicing channel regions may be provided. The rectangular grid of trenches may be filled with an elastic dielectric fill material. A combination of the two-dimensional array of semiconductor dies and a grid-shaped portion of the elastic dielectric fill material filling the rectangular grid of trenches may be diced along the dicing channel regions. A plurality of elastically padded semiconductor dies is formed. Each of the elastically padded semiconductor dies includes a respective singulated semiconductor die that includes semiconductor devices and metal bump structures located on dielectric material layers, and further includes an elastic protective material portion including a portion of the elastic dielectric fill material and laterally surrounding the dielectric material layers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2510,2520,2530:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="544" publication-number="202616398">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616398</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146177</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>裝置結構及其形成方法</chinese-title>
        <english-title>DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250925B">H01L21/60</main-classification>
        <further-classification edition="200601120250925B">H01L21/768</further-classification>
        <further-classification edition="200601120250925B">H01L23/488</further-classification>
        <further-classification edition="200601120250925B">H01L23/535</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林政男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHENG-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇昱澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YU-TSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭景文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, CHING-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊泰紳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TAI-SHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凃偉祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, WEI-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種裝置結構，可由以下方法提供：在半導體基板上，形成多個介電材料層中的多個金屬內連線結構和多個半導體裝置；在介電材料層的最上層形成多個金屬墊；形成包括第一介電擴散阻障層、矽酸鹽玻璃層、以及聚合物層的一鈍化層堆疊；在金屬墊上形成穿過鈍化層堆疊的多個開口；在金屬墊上形成多個晶粒凸塊結構；以及沿著多個分割通道將包括鈍化層堆疊、介電材料層、以及半導體基板的晶圓分割成多個半導體晶粒。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device structure may be provided by: forming semiconductor devices and metal interconnect structures formed within dielectric material layers over a semiconductor substrate; forming metal pads in a topmost layer of the dielectric material layers; forming a passivation layer stack including a first dielectric diffusion barrier layer, a silicate glass layer, a second dielectric diffusion barrier layer, and a polymer layer; forming openings through the passivation layer stack over the metal pads; forming die bump structures on the metal pads; and dicing a wafer including the passivation layer stack, the dielectric material layers, and the semiconductor substrate along dicing channels into a plurality of semiconductor dies.</p>
      </isu-abst>
      <representative-img>
        <p type="p">94T:錐形側壁表面</p>
        <p type="p">100:半導體晶粒</p>
        <p type="p">101:半導體基板</p>
        <p type="p">120:半導體裝置</p>
        <p type="p">140:邊緣密封結構</p>
        <p type="p">160:介電材料層</p>
        <p type="p">180:金屬內連線結構</p>
        <p type="p">188:金屬墊</p>
        <p type="p">190:鈍化層堆疊</p>
        <p type="p">191:第一介電擴散阻障層</p>
        <p type="p">192:矽酸鹽玻璃層</p>
        <p type="p">193:第二介電擴散阻障層</p>
        <p type="p">194:聚合物層</p>
        <p type="p">196:金屬黏附板</p>
        <p type="p">198:晶粒凸塊結構</p>
        <p type="p">199:焊料部分</p>
        <p type="p">lod1:第一橫向偏移距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="545" publication-number="202616208">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616208</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146350</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及其資訊提供方法</chinese-title>
        <english-title>ELECTRONIC APPARATUS AND PROVIDING INFORMATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250709B">G06Q50/40</main-classification>
        <further-classification edition="202301120250709B">G06Q30/0601</further-classification>
        <further-classification edition="202301120250709B">G06Q10/109</further-classification>
        <further-classification edition="202401120250709B">G06Q10/08</further-classification>
        <further-classification edition="202301120250709B">G06Q10/047</further-classification>
        <further-classification edition="202301120250709B">G06Q10/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴俊奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JUN GYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜　泰宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, TAEHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金度賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DU HYEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯耶爾　阿尤什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYAL, AYUSH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹大洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, DA YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納德卡尼　耶萬特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NADKARNI, YESHWANT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古普塔　拉胡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUPTA, RAHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡利亞爾　賈加迪什　維魯帕克沙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HULIYAR, JAGADEESH VIRUPAKSHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　鴻吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HONG GYEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫納爾　羅希特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNAL, ROHIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬賈裡　哈沙爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANJARI, HARSHAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴華鍾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, HWA JONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴拉吉　維克拉姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BALAJI, VIKRAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種電子裝置之資訊提供方法。資訊提供方法可包括如下步驟：自第1用戶之第1終端獲得針對第1物品之第1資訊請求，該第1資訊請求包括上述第1物品之第1數量之資訊；確認與上述第1物品對應之第1 SKU(stock keeping unit)為複數個物流中心(fulfillment center)內之第1類型之區域群組(zone group)中陳列之複數個SKU中的一者；基於上述第1資訊請求之獲得時刻之資訊、與由上述第1用戶設定為配送地之第1地址對應之營地之類型的資訊、上述第1類型之區域群組之庫存資訊及上述第1數量之資訊中的至少一者，確定上述第1物品之預計到達時刻(product delivery date，PDD)；及對上述第1終端提供上述第1物品之預計到達時刻之資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S400:步驟</p>
        <p type="p">S405:步驟</p>
        <p type="p">S410:步驟</p>
        <p type="p">S415:步驟</p>
        <p type="p">S420:步驟</p>
        <p type="p">S425:步驟</p>
        <p type="p">S430:步驟</p>
        <p type="p">S435:步驟</p>
        <p type="p">S440:步驟</p>
        <p type="p">S445:步驟</p>
        <p type="p">S450:步驟</p>
        <p type="p">S455:步驟</p>
        <p type="p">S460:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="546" publication-number="202616165">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616165</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146542</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提供與運單相關聯之資訊之方法及裝置</chinese-title>
        <english-title>METHOD AND APPARATUS FOR PROVIDING INFORMATION ASSOCIATED WITH INVOICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250602B">G06Q10/08</main-classification>
        <further-classification edition="202301120250602B">G06Q10/0833</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金庚中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, GYEONG JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田熙昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, HUI SEUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一實施例之電子裝置提供與運單相關聯之資訊之方法的特徵在於包括如下步驟：提取複數個運單中包括之資訊；基於複數個運單中包括之資訊而確定與複數個運單分別對應之複數個配送地座標；基於複數個配送地座標而確定將於地圖上顯示之複數個配送地座標各者之標記之位置；基於標記之位置而確定複數個配送地座標中要合併之配送地座標；及向用戶之終端提供確定為要合併之配送地座標之資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:順序圖</p>
        <p type="p">S210:步驟</p>
        <p type="p">S220:步驟</p>
        <p type="p">S230:步驟</p>
        <p type="p">S240:步驟</p>
        <p type="p">S250:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="547" publication-number="202616166">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616166</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146802</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及其物品分配方法</chinese-title>
        <english-title>ELECTRONIC APPARATUS AND ASSIGNING ITEMS METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250909B">G06Q10/08</main-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金度賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DU HYEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金道英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DO YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權峰塡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, BONG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李康永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KANG YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卞周英</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>BYON, JU YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
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          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李勇俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YOUNG JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴拉吉　維克拉姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BALAJI, VIKRAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　志浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JIHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安相熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, SANG HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯耶爾　阿尤什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYAL, AYUSH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹大洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, DA YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納德卡尼　耶萬特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NADKARNI, YESHWANT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡利亞爾　賈加迪什　維魯帕克沙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HULIYAR, JAGADEESH VIRUPAKSHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　鴻吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HONG GYEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="15">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫納爾　羅希特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNAL, ROHIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="16">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬賈裡　哈沙爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANJARI, HARSHAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="17">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴華鍾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, HWA JONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開一種電子裝置之物品分配方法。物品分配方法可包括如下步驟：自用戶之終端獲得包括一個以上之物品之資訊的第1訂單之資訊；基於複數個物流中心(fulfillment center)內之區域群組(zone group)之庫存資訊，確認上述區域群組中之存在與上述一個以上之物品對應之一個以上之SKU(stock keeping unit)之庫存的複數個區域群組；基於與上述複數個區域群組對應之預計到達時刻(promised delivery date，PDD)之資訊、上述複數個區域群組之庫存資訊、包括上述複數個區域群組之物流中心之位置之資訊、及與針對上述複數個區域群組而設定之包裝方式對應之費用之資訊，確定上述複數個區域群組中之與上述一個以上之SKU各者對應之候選區域群組；及確定對上述候選區域群組中之一個以上之候選區域群組分配上述一個以上之SKU的分配方法，該分配方法係用以將包裝上述一個以上之SKU之包裹(parcel)之數量最小化者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1800:步驟</p>
        <p type="p">S1820:步驟</p>
        <p type="p">S1840:步驟</p>
        <p type="p">S1860:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="548" publication-number="202615950">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615950</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146853</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>背光模組及顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241219B">G02F1/13357</main-classification>
        <further-classification edition="200601120241219B">G02F1/1335</further-classification>
        <further-classification edition="200601120241219B">G02F1/1333</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞儀光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃啓賓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳沛然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳英傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李育儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯珮棻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種背光模組及包括背光模組之顯示裝置，該背光模組係在其外框的光源容置部裝設光源，並設置有彈力作用部，導光板能以其入光端置入該外框的光源容置部內，利用入光端的結合部與外框之光源容置部中對應位置之彈力作用部之相互干涉且受彈力作用，使該導光板快速而簡便地組裝定位於該外框中，且導光板之入光面對應於光源，藉此免除使用固定膠帶黏著導光板及光源，降低材料成本，並能有效地避免組裝錯誤產生的重工及重工時黏膠或異物殘留的風險。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:外框</p>
        <p type="p">11:光源容置部</p>
        <p type="p">111:邊板部</p>
        <p type="p">112:組接板部</p>
        <p type="p">12:彈力作用部</p>
        <p type="p">121:彈扣</p>
        <p type="p">122:缺槽</p>
        <p type="p">123:限位凹槽</p>
        <p type="p">13:背板部</p>
        <p type="p">131:支撐部</p>
        <p type="p">20:導光板</p>
        <p type="p">21:出光面</p>
        <p type="p">23:入光端</p>
        <p type="p">25:結合部</p>
        <p type="p">251:定位塊</p>
        <p type="p">252:扣抵凸緣</p>
        <p type="p">30:光源</p>
        <p type="p">31:電路基板</p>
        <p type="p">32:發光元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="549" publication-number="202616068">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616068</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146930</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>消息積壓處理系統以及消息積壓處理方法</chinese-title>
        <english-title>MESSAGE BACKLOG PROCESSING SYSTEM AND MESSAGE BACKLOG PROCESSING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">G06F9/06</main-classification>
        <further-classification edition="200601120250203B">G06F9/50</further-classification>
        <further-classification edition="200601120250203B">G06F11/34</further-classification>
        <further-classification edition="200601120250203B">G06F11/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商鼎捷數智股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIGIWIN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鼎新數智股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DATA SYSTEMS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊葉偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YEWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝麗霞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, LIXIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李驍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐玲玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, LINGLING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種消息積壓處理系統以及消息積壓處理方法。消息積壓處理系統包括儲存裝置以及處理器。儲存裝置用以儲存數據偵測模組、決策模組以及計算模組。處理器耦接儲存裝置，並且用以執行數據偵測模組、決策模組以及計算模組。數據偵測模組採集生產日誌、消費日誌、訊息佇列數據以及處理器中的處理數據組。響應於消息積壓量大於消息積壓閾值，決策模組根據決策表中的決策權重以及處理數據組獲得處理策略。計算模組根據處理策略計算適合性能數值，並且根據適合性能數值更新消息處理設置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A message backlog processing system and a message backlog processing method. The message backlog processing system includes a storage device and a processor. The storage device stores a data detection module, a decision module, and a calculation module. The processor coupled to the storage device and executes the data detection module, the decision module, and the calculation module. The data detection module collects production logs, consumption logs, message queue data, and processing data sets in the processor. In response to the message backlog exceeding a message backlog threshold, the decision module obtains a processing strategy based on decision weights in a decision table and the processing data sets. The calculation module calculates an appropriate performance value according to the processing strategy and updates message processing settings based on the appropriate performance value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210~S230:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="550" publication-number="202616487">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616487</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147104</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>封裝基底</chinese-title>
        <english-title>PACKAGE SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250925B">H01L23/28</main-classification>
        <further-classification edition="200601120250925B">H01L23/488</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張介明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIEH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴柏辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, PO-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游明志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEW, MING-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張國欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KUO-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>言　瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, KATHY WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體封裝的封裝基底形成為包含位於封裝連接墊和封裝基底的導電結構之間的底部導電墊，其中底部導電墊在沿著徑向軸通過半導體封裝的中心的方向上為長橢圓形。底部導電墊的長橢圓形形狀和徑向方位增加了封裝基底的韌性，從而使得封裝基底能夠抵抗可能由於封裝基底引起的應力而發生的變形。如此一來，底部導電墊的長橢圓形形狀和方位降低了封裝基底中可能是因封裝基底中的應力所導致的破裂及/或分層的可能性，從而可降低封裝基底失效的可能性、及/或可增加半導體封裝的可靠性和壽命。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A package substrate of a semiconductor package is formed to include bottom conductive pads between package connection pads and conductive structures of the package substrate, where the bottom conductive pads are oblong in a direction along a radial axis through a center of the semiconductor package. The oblong shape and the radial orientation of the bottom conductive pads increase the stiffness of the package substrate, which enables the package substrate to resist deformation that might otherwise occur due to the stresses induced in the package substrate. In this way, the oblong shape and the orientation of the bottom conductive pads reduce the likelihood of cracking and/or delamination in the package substrate that might otherwise be caused by the stresses in the package substrate, which may reduce the likelihood of failure of the semiconductor package and/or may increase the reliability and longevity of the semiconductor package.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體封裝</p>
        <p type="p">102:封裝基底</p>
        <p type="p">104:半導體晶粒封裝</p>
        <p type="p">106:加強結構</p>
        <p type="p">108:中介物</p>
        <p type="p">110a,110b:積體電路(IC)晶粒</p>
        <p type="p">112:連接結構</p>
        <p type="p">114:底部填充材料</p>
        <p type="p">116:區域</p>
        <p type="p">118:基底核芯</p>
        <p type="p">120a,120b:重佈結構</p>
        <p type="p">122a,122b:鈍化層</p>
        <p type="p">124:基底層</p>
        <p type="p">126:互連結構</p>
        <p type="p">128a,128b:絕緣層</p>
        <p type="p">130a,130b:金屬化層</p>
        <p type="p">132a,132b:互連層</p>
        <p type="p">134,134a,134b:底部導電墊</p>
        <p type="p">136:封裝連接墊</p>
        <p type="p">138:封裝連接結構</p>
        <p type="p">A-A:剖面</p>
        <p type="p">D1,D2,D3:尺寸</p>
        <p type="p">x,z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="551" publication-number="202616072">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616072</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147118</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢查用戶介面之方法、電子裝置及記錄媒體</chinese-title>
        <english-title>METHOD OF INSPECTING USER INTERFACE, ELECTRONIC DEVICE AND RECORDING MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250602B">G06F9/44</main-classification>
        <further-classification edition="201801120250602B">G06F8/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之各種實施例之藉由電子裝置而實行之檢查用戶介面的方法可包括如下步驟：獲得包括藉由應用程式而提供之用戶介面之資訊之影像；基於上述影像，判斷上述用戶介面中是否產生錯誤；及於判斷為上述用戶介面中產生錯誤之情形時，識別上述錯誤之原因。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:系統</p>
        <p type="p">100:電子裝置</p>
        <p type="p">210:用戶之終端</p>
        <p type="p">220:管理者之終端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="552" publication-number="202616177">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616177</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147209</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提供服務相關資訊之電子裝置及其方法</chinese-title>
        <english-title>ELECTRONIC APPARATUS FOR PROVIDING SERVICE-RELATED INFORMATION AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250624B">G06Q30/015</main-classification>
        <further-classification edition="202301120250624B">G06Q10/06</further-classification>
        <further-classification edition="202301120250624B">G06N3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種提供服務相關資訊之電子裝置及其方法。本發明之服務相關資訊提供方法可包括如下步驟：識別連接於應用程式之用戶；確認應用程式之用戶之使用日誌資料；基於使用日誌資料而確認針對用戶預估之潛在問題；及將與潛在問題對應之服務相關資訊提供給用戶。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S210:步驟</p>
        <p type="p">S220:步驟</p>
        <p type="p">S230:步驟</p>
        <p type="p">S240:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="553" publication-number="202616037">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616037</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147581</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>伺服器系統</chinese-title>
        <english-title>SERVER SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241219B">G06F1/16</main-classification>
        <further-classification edition="200601120241219B">G06F1/20</further-classification>
        <further-classification edition="200601120241219B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣達電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUANTA COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳敬仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHING-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種包含具有發熱電子元件的伺服器機殼的伺服器系統。冷卻系統裝設於伺服器機殼並向發熱電子元件提供冷空氣。通風管道設置於伺服器機殼上，位於冷卻系統和發熱電子元件之間。通風管道包含冷空氣沿著流通的冷卻路徑。冷卻路徑至少部分形成於兩個側壁和蓋板之間。通風管道更進一步包含導線路徑配置以收納導線。導線路徑部分形成為凹進蓋板的開槽區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A server system includes a server chassis with heat-generating electronic components. A cooling system is mounted on the server chassis and provides cooling air to the heat-generating electronic components. A ventilation channel is disposed on the server chassis between the cooling system and the heat-generating electronic components. The ventilation channel includes a cooling path along which the cooling air flows. The cooling path is formed at least in part between two sidewalls and a cover plate. The ventilation channel further includes a wire path configured to receive a wire. The wire path is formed in part as a slotted region that is recessed within the cover plate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:通風管道</p>
        <p type="p">24:熱交換器</p>
        <p type="p">30:導線路徑</p>
        <p type="p">33:蓋板</p>
        <p type="p">36:插槽</p>
        <p type="p">37:冷卻路徑進口端</p>
        <p type="p">38:切口</p>
        <p type="p">39:冷卻路徑出口端</p>
        <p type="p">40:通風管道出口端</p>
        <p type="p">41:側壁</p>
        <p type="p">42:開槽區域</p>
        <p type="p">47,48:箭頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="554" publication-number="202615632">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615632</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147673</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多晶矽蝕刻液的混合方法、多晶矽的製造方法、多晶矽的洗淨裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250918B">C09K13/08</main-classification>
        <further-classification edition="200601120250918B">C01B33/037</further-classification>
        <further-classification edition="202301120250918B">C02F1/60</further-classification>
        <further-classification edition="200601120250918B">B08B3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商德山股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKUYAMA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮城翼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAGI, TSUBASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提案：使用無水氫氟酸，同時可極力減少須自排氣回收之無水氫氟酸之量的蝕刻液的混合方法等。其控制壓力或溫度或其兩者，而將無水氫氟酸製成液體的狀態。又，將該液體狀態的無水氫氟酸，與水之含量為45重量％以下之，含有無機酸的水溶液、含有無機酸及有機酸之混合水溶液或含有過氧化氫之水溶液進行混合。進而，使該無水氫氟酸溶解於該含有無機酸之水溶液、含有無機酸及有機酸之混合水溶液或該含有過氧化氫之水溶液的水分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">P1:液化步驟</p>
        <p type="p">P2:混合步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="555" publication-number="202616158">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616158</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147674</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>銀行業人力資源自動調度系統</chinese-title>
        <english-title>BANKING INDUSTRY HUMAN RESOURCES AUTOMATED SCHEDULING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250313B">G06Q10/06</main-classification>
        <further-classification edition="202301120250313B">G06Q40/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺灣土地銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAND BANK OF TAIWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種銀行業人力資源自動調度系統，用以即時分析及調配人力並產出分析報表。該銀行業人力資源自動調度系統係與總行系統、營業單位系統及人事系統資訊相連接，提供查詢、統計及分析總行系統之各部門及營業單位系統之各分行的人力資源現況，並依據來客數、承辦案件量、業績目標及營業額等參數，自動規劃出人力自動調度方案；經人事單位及相關權責主管審核放行後立即執行，發送派令簡訊或電子郵件通知相關人員進行職務調派或短期支援性工作。該銀行業人力資源自動調度系統並自動依據調度前後之人力資源配置產出分析報表以自動追蹤調度之成效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention pertains to a Banking Industry Human Resources Automated Scheduling System designed to facilitate real-time analysis and allocation of human resources while generating comprehensive analytical reports. This system integrates with the headquarters system, branch office systems, and personnel management systems to inquire, compile statistics, and analyze the human resource status across various departments within the headquarters and branches. Utilizing parameters such as customer traffic, case workload, performance objectives, and revenue metrics, the system autonomously develops optimized human resource scheduling plans. Upon review and approval by the personnel management unit and relevant authority supervisors, the system promptly executes the approved plans, issuing dispatch notifications via SMS or email to inform the designated personnel of task reassignments or temporary support assignments. Furthermore, the Banking Industry Human Resources Automated Scheduling System automatically generates detailed analytical reports based on pre- and post-scheduling resource allocations, enabling continuous monitoring and evaluation of the scheduling efficiency and outcomes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:銀行業人力資源自動調度系統</p>
        <p type="p">11:分析報表</p>
        <p type="p">12:第一人力資源配置資料</p>
        <p type="p">13:人力自動調度方案</p>
        <p type="p">14:第二人力資源配置資料</p>
        <p type="p">100:主伺服器</p>
        <p type="p">200:總行系統</p>
        <p type="p">300:營業單位系統</p>
        <p type="p">400:人事系統</p>
        <p type="p">500:人力派遣公司系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="556" publication-number="202616170">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616170</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147794</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提供資訊之電子裝置之動作方法及支持該動作方法之電子裝置</chinese-title>
        <english-title>OPERATING METHOD FOR ELECTRONIC APPARATUS FOR PROVIDING INFORMATION AND ELECTRONIC APPARATUS SUPPORTING THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250908B">G06Q10/087</main-classification>
        <further-classification edition="202301120250908B">G06Q30/02</further-classification>
        <further-classification edition="200601120250908B">G06F17/40</further-classification>
        <further-classification edition="201301120250908B">G06F3/048</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉勉特　阿恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAMET, ARNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金素珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SO JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西門弘益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEOMOON, HONG IK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金賢洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYUN SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本文所揭示之實施例，資訊提供方法可包括如下步驟：於上述電子裝置提供之服務中提供與用戶之訂購歷史資訊相關之第1頁面，上述第1頁面包括用以檢索上述訂購歷史資訊之與第1檢索方式對應之第1檢索介面、及與第2檢索方式對應之第2檢索介面；藉由上述第1頁面中之上述第1檢索介面及上述第2檢索介面中之至少一者而獲得來自上述用戶之檢索請求；及提供第2頁面，該第2頁面係包括基於上述檢索請求而確認之上述訂購歷史資訊之檢索結果者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:伺服器設備</p>
        <p type="p">200:用戶設備</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="557" publication-number="202616857">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616857</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147814</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250626B">H10D30/62</main-classification>
        <further-classification edition="202501120250626B">H10D30/01</further-classification>
        <further-classification edition="200601120250626B">H01L21/20</further-classification>
        <further-classification edition="200601120250626B">H01L21/302</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇崇毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, CHUNG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許經佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIN-YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳岳展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YUEH-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　君平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, JUAN PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉冠廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KUAN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李顯銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HSIEN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　志安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUI, CHI ON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種方法，包括提供具有用於n型場效電晶體(nFETs)的N型區和用於p型場效電晶體(pFETs)的P型區的基板；在N型區和P型區形成閘極介電層以包繞垂直堆疊的通道；將閘極介電層於N型區的第一部分進行偶極處理，而閘極介電層於P型區的第二部分保持未處理；在P型區和N型區的閘極介電層中沉積P型金屬層；在P型區和N型區的P型金屬層上形成填充金屬層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a method that includes providing a substrate having a N region for n-type field-effect transistors (nFETs) and a P region for p-type field-effect transistors (pFETs); forming a gate dielectric layer in the N region and the P region to wrap around channels vertically stacked; performing a dipole treatment to a first portion of the gate dielectric layer in the N region while a second portion of the gate dielectric layer in the P region remain untreated; depositing a P metal layer in the gate dielectric layer in both the P region and the N region; and forming a fill metal layer on the P metal layer in both the P region and the N region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:半導體裝置</p>
        <p type="p">202:基板</p>
        <p type="p">236A:第一半導體層</p>
        <p type="p">236B:第二半導體層</p>
        <p type="p">238:層間介電(interlevel dielectric,ILD)層</p>
        <p type="p">240:底接觸蝕刻停止層</p>
        <p type="p">244:通道</p>
        <p type="p">250:金屬閘極結構</p>
        <p type="p">260:自對準閘極蓋(self-aligned gate cap,SAGC)</p>
        <p type="p">261:導電蓋</p>
        <p type="p">X:X方向</p>
        <p type="p">Y:Y方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="558" publication-number="202616733">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616733</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147886</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>耳罩及具有其之頭戴式耳機</chinese-title>
        <english-title>EARMUFF AND HEADPHONE HAVING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">H04R1/10</main-classification>
        <further-classification edition="200601120250502B">H04R5/033</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明基電通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENQ CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林致宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張淑淨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SHU-JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種頭戴式耳機的耳罩及具有其之頭戴式耳機。所述頭戴式耳機的耳罩包括一殼體、一耳墊、和一調整件。殼體具有至少一定位結構。耳墊設置在殼體上。調整件設置在耳墊和殼體之間。調整件包括至少一可調部和至少一固定部。該至少一可調部對應且可動地連接至殼體的該至少一定位結構。該至少一固定部固定於耳墊。通過調整可調部，調整件形成的環繞形狀可以改變，進而帶動耳墊的形狀變化，達成不更換耳罩也能調整聽感的目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An earmuff for a headphone and a headphone having the same are provided. The earmuff includes a case, an earpad, and an adjusting component. The case has at least one locating structure. The earpad is disposed on the case. The adjusting component is disposed between the earpad and the case. The adjusting component comprises at least one adjustable portion and at least one fixed portion. The at least one adjustable portion is correspondingly movably connected to the at least one locating structure of the case. The at least one fixed portion is fixed with the earpad. By adjusting the adjustable portion, a surrounding shape formed by the adjusting component can be changed, thereby causing the shape of the earpad to change. As such, a purpose of adjusting a listening experience without exchanging the earmuff can be achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:耳罩</p>
        <p type="p">110:殼體</p>
        <p type="p">112:定位結構</p>
        <p type="p">114:主體</p>
        <p type="p">130:調整件</p>
        <p type="p">132:可調部</p>
        <p type="p">134:固定部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="559" publication-number="202616189">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616189</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148296</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提供資訊之方法及電子裝置</chinese-title>
        <english-title>METHOD AND ELECTRONIC DEVICE FOR PROVIDING INFORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250801B">G06Q30/06</main-classification>
        <further-classification edition="200601120250801B">G06F17/40</further-classification>
        <further-classification edition="201301120250801B">G06F3/048</further-classification>
        <further-classification edition="202301120250801B">G06Q30/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉勉特　阿恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAMET, ARNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉霖善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, LAM SUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金賢洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYUN SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明，揭示了一種於電子裝置中實行之資訊提供方法，該資訊提供方法包括如下步驟：確認目標用戶之購買歷史；基於上述購買歷史來確認物品清單；基於上述物品清單中所包括之物品來確認關鍵字清單；及將上述關鍵字清單提供至上述目標用戶之終端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">110:電子裝置</p>
        <p type="p">120:用戶終端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="560" publication-number="202616190">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616190</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148298</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>與物品相關聯之資料處理方法及裝置</chinese-title>
        <english-title>METHOD AND APPARATUS FOR PROCESSING DATA ASSOCIATED WITH ITEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250801B">G06Q30/06</main-classification>
        <further-classification edition="202401120250801B">G06Q10/08</further-classification>
        <further-classification edition="200601120250801B">G06F17/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　頌伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SUNG IHK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一實施例之電子裝置處理與物品相關聯之資料的方法包括如下步驟：自複數個資料源確認複數個事件；自複數個事件產生與對應於複數個資料源各者之第1物品相關聯之複數個槽資料；基於複數個槽資料中之至少一部分而產生與第1物品相關聯之快照；及基於快照而提供與第1物品相關聯之視圖。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:順序圖</p>
        <p type="p">S210:步驟</p>
        <p type="p">S220:步驟</p>
        <p type="p">S230:步驟</p>
        <p type="p">S240:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="561" publication-number="202615872">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615872</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148350</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置、測試系統及用於測試半導體晶圓上的待測裝置的方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE, TESTING SYSTEM, AND METHOD FOR TESTING DEVICE UNDER TEST ON SEMICONDUCTOR WAFER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250429B">G01R1/067</main-classification>
        <further-classification edition="200601120250429B">G01R31/28</further-classification>
        <further-classification edition="200601120250429B">H01L21/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>愛普科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AP MEMORY TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　文良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WENLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃愷</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置，其包含半導體晶圓、天線元件以及射頻應答器。該半導體晶圓包含多個區域。每個區域包含一或多個裸晶。該天線元件設置在該多個區域中待測裝置所處在的區域之中。該天線元件用以將射頻訊號耦合為電訊號。該射頻應答器設置在該區域之中而耦接於該天線元件與該待測裝置。該射頻應答器用以因應該電訊號來發送激勵訊號，以及用以根據從該待測裝置接收的響應訊號，來致使該天線元件輸出調變後的射頻訊號。該響應訊號因應該激勵訊號而從該待測裝置產生。該調變後的射頻訊號指示出該待測裝置的行為。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a semiconductor wafer, an antenna element and a radio frequency (RF) transponder. The semiconductor wafer includes a plurality of regions. Each region includes one or more dies. The antenna element is disposed in one of the regions where a device under test (DUT) is disposed. The antenna element is arranged to couple an RF signal into an electrical signal. The RF transponder is disposed in the one of the regions, and coupled to the antenna element and the DUT. The RF transponder is configured to send a stimulus signal to the DUT in response to the electrical signal, and drive the antenna element to output a modulated RF signal according to a response signal received from the DUT. The response signal is generated from the DUT in response to the stimulus signal. The modulated RF signal is indicative of a behavior of the DUT.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:測試系統</p>
        <p type="p">102:射頻讀取器</p>
        <p type="p">104:半導體裝置</p>
        <p type="p">110:半導體晶圓</p>
        <p type="p">120:天線元件</p>
        <p type="p">130:應答器</p>
        <p type="p">140:待測裝置</p>
        <p type="p">S_I:無線詢問訊號</p>
        <p type="p">S_M:調變後的射頻訊號</p>
        <p type="p">S_E,S_A:電訊號</p>
        <p type="p">S_P:電源訊號</p>
        <p type="p">S_S:激勵訊號</p>
        <p type="p">S_R:響應訊號</p>
        <p type="p">RG:區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="562" publication-number="202616182">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616182</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148422</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提供評論資訊之電子裝置之動作方法及支持其之電子裝置</chinese-title>
        <english-title>OPERATING METHOD FOR ELECTRONIC APPARATUS FOR PROVIDING REVIEW INFORMATION AND ELECTRONIC APPARATUS SUPPORTING THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250801B">G06Q30/02</main-classification>
        <further-classification edition="202301120250801B">G06Q30/06</further-classification>
        <further-classification edition="200601120250801B">G06F17/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔玄彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, HYUN BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電子裝置提供評論資訊之方法，該方法包括如下步驟：自用戶終端獲得包括目標物品資訊之評論資訊請求；確認屬於上述目標物品之上位類別之製品及上述目標物品之屬性；基於上述目標物品資訊而於上述製品中確認與第1參數對應之複數個物品，該第1參數係表示與上述目標物品之屬性相關之程度者；及基於上述第1參數，將按照上述第1參數而排列之評論提供至上述用戶終端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S210:步驟</p>
        <p type="p">S230:步驟</p>
        <p type="p">S250:步驟</p>
        <p type="p">S270:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="563" publication-number="202616871">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616871</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148527</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置結構及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250922B">H10D62/13</main-classification>
        <further-classification edition="202501120250922B">H10D30/01</further-classification>
        <further-classification edition="202501120250922B">H10D30/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱雨薇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂濬洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHUN-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳亮吟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LIANG-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供具有底部絕緣層的多閘極裝置及其製造方法，例示性方法包含分別在第一及第二裝置區中形成第一及第二源極/汲極凹口，分別在第一及第二源極/汲極凹口中形成第一及第二源極/汲極結構，形成第二源極/汲極結構的步驟包含在第二源極/汲極凹口中形成絕緣層，在對絕緣層進行第一氮熱處理之後，在第一源極/汲極結構上方形成遮罩，及在對遮罩進行第二氮熱處理之後，在絕緣層上方形成摻雜半導體層，第一氮熱處理可增加絕緣層的厚度及/或降低絕緣層的蝕刻速率，第一裝置區可為p型電晶體區，且第二裝置區可為n型電晶體區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Multigate devices having bottom insulation and methods of fabrication thereof are disclosed. An exemplary method includes forming a first source/drain recess in a first device region, forming a second source/drain recess in a second device region, forming a first source/drain structure in the first source/drain recess, and forming a second source/drain structure in the second source/drain recess. Forming the second source/drain structure includes forming an insulator layer in the second source/drain recess, forming a mask over the first source/drain structure after performing a first nitrogen thermal treatment on the insulator layer, and forming a doped semiconductor layer over the insulator layer after performing a second nitrogen thermal treatment on the mask. The first nitrogen thermal treatment may increase a thickness and/or reduce an etch rate of the insulator layer. The first device region may be a p-type transistor region, and the second device region may be an n-type transistor region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:方法</p>
        <p type="p">15,20,25,30,35,40,45,50,55,60,65,70:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="564" publication-number="202616107">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616107</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148580</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提供用以查詢特徵資訊之功能之裝置及其方法</chinese-title>
        <english-title>APPARATUS FOR PROVIDING A FUNCTION TO RETRIEVE FEATURE INFORMATION AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250908B">G06F17/40</main-classification>
        <further-classification edition="201301120250908B">G06F3/048</further-classification>
        <further-classification edition="201901120250908B">G06F16/9535</further-classification>
        <further-classification edition="202301120250908B">G06Q30/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>苗智才</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIAO, ZHICAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐學志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, XUEZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐開誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, KAICHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明，揭示一種於電子裝置中提供資訊之方法，其包括如下步驟：確認用戶之代碼資訊；獲得與代碼資訊相關聯之一個以上之特徵資訊；及向用戶提供用以查詢一個以上之特徵資訊之功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">110:電子裝置</p>
        <p type="p">120:用戶之裝置</p>
        <p type="p">130:伺服器</p>
        <p type="p">201:動作</p>
        <p type="p">202:動作</p>
        <p type="p">203:動作</p>
        <p type="p">204:動作</p>
        <p type="p">205:動作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="565" publication-number="202616652">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616652</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148671</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250704B">H03H7/38</main-classification>
        <further-classification edition="200601120250704B">H01Q1/22</further-classification>
        <further-classification edition="200601120250704B">H01Q1/38</further-classification>
        <further-classification edition="200601120250704B">H01Q1/44</further-classification>
        <further-classification edition="201501120250704B">H01Q5/50</further-classification>
        <further-classification edition="201501120250704B">H01Q5/335</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日月光半導體製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED SEMICONDUCTOR ENGINEERING, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余遠灝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, YUANHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂宗蔚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, TSUNG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳弈錡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電子裝置。該電子裝置包括一電子組件及一天線組件。該天線組件安置於該電子組件上方且界定一腔體，該腔體經組態以容納一組件以調整該電子組件與該天線組件之間的一阻抗匹配。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an electronic device. The electronic device includes an electronic component and an antenna component. The antenna component is disposed over the electronic component and defines a cavity configured to accommodating a component to adjust an impedance matching between the electronic component and the antenna component.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:電子裝置</p>
        <p type="p">10:載體</p>
        <p type="p">10s1:表面</p>
        <p type="p">10s2:表面</p>
        <p type="p">10s3:表面</p>
        <p type="p">12:襯墊</p>
        <p type="p">20:天線組件</p>
        <p type="p">22:介電結構</p>
        <p type="p">22b:下部部分</p>
        <p type="p">22bs1:表面</p>
        <p type="p">22bs2:表面</p>
        <p type="p">22bs3:表面</p>
        <p type="p">22bs4:表面</p>
        <p type="p">22p:延伸部分</p>
        <p type="p">22ps1:側壁</p>
        <p type="p">22ps2:側壁</p>
        <p type="p">22s1:表面</p>
        <p type="p">22s2:表面</p>
        <p type="p">22t:上部部分</p>
        <p type="p">24:天線圖案</p>
        <p type="p">25:饋電結構</p>
        <p type="p">26:導電層</p>
        <p type="p">28:導電層</p>
        <p type="p">30:電子組件</p>
        <p type="p">32:電連接器</p>
        <p type="p">40:囊封體</p>
        <p type="p">40s1:表面</p>
        <p type="p">50:腔體</p>
        <p type="p">52:凹部</p>
        <p type="p">60a:阻抗匹配組件</p>
        <p type="p">60b:阻抗匹配組件</p>
        <p type="p">72:電連接器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="566" publication-number="202616185">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616185</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113149064</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提供與結算方式相關聯之頁面之方法及裝置</chinese-title>
        <english-title>METHOD AND APPARATUS FOR PROVIDING PAGE ASSOCIATED WITH PAYMENT METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250710B">G06Q30/0207</main-classification>
        <further-classification edition="202301120250710B">G06Q30/06</further-classification>
        <further-classification edition="201301120250710B">G06F3/048</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, XING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秀姜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SU GANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳慧珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, HYE JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　德瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HENG, DERRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一實施例之電子裝置提供與結算方式相關聯之頁面的方法包括如下步驟：自用戶之終端獲得對包括結算方式之資訊之第1頁面的請求；確認與用戶之服務相關聯之歷史資訊；基於歷史資訊而確認與用戶之結算方式相關聯之預估優惠；及提供進而包括預估優惠之資訊之第1頁面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:順序圖</p>
        <p type="p">S210:步驟</p>
        <p type="p">S220:步驟</p>
        <p type="p">S230:步驟</p>
        <p type="p">S240:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="567" publication-number="202616193">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616193</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113149269</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及其資訊提供方法</chinese-title>
        <english-title>ELECTRONIC APPARATUS AND PROVIDING INFORMATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250522B">G06Q30/0601</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉勉特　阿恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAMET, ARNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金素珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SO JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西門弘益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEOMOON, HONG IK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金賢洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYUN SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電子裝置之資訊提供方法。資訊提供方法可包括如下步驟：基於用戶之物品購買歷史而確認一個以上之物品；確認與一個以上之物品各者對應之一個以上之物品類別；及提供包括與一個以上之物品類別各者對應之物品類別資訊之第1頁面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S310:步驟</p>
        <p type="p">S320:步驟</p>
        <p type="p">S330:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="568" publication-number="202616649">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616649</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113149530</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>向量加法放大器、包括其的相移裝置以及控制向量加法放大器的方法</chinese-title>
        <english-title>VECTOR SUMMING AMPLIFIER, PHASE SHIFT DEVICE INCLUDING THE SAME AND METHOD OF CONTROLLING VECTOR SUMMING AMPLIFIER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">H03F3/45</main-classification>
        <further-classification edition="200601120250602B">H03F3/21</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>釜山大學校産學協力團</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PUSAN NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭在淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, JAEYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南日求</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAM, ILKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴賢哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, HYUNCHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許準會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUR, JOONHOI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種向量加法放大器包括：相位控制電路，被配置成接收多個正交訊號且藉由所述多個正交訊號的至少一部分的向量和輸出具有目標相位的差動中間訊號；增益補償電路，被配置成接收所述差動中間訊號且輸出具有所述目標相位及目標增益的差動輸出訊號；以及通訊處理器，被配置成控制所述相位控制電路及所述增益補償電路。所述通訊處理器可基於對應於所述目標相位的放大因數而控制所述增益補償電路中所包括的多個補償電晶體，使得所述增益補償電路輸出具有所述目標增益的所述差動輸出訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A vector summing amplifier includes a phase control circuit configured to receive a plurality of orthogonal signals and output a differential intermediate signal having a target phase through a vector sum of at least a portion of the plurality of orthogonal signals, a gain compensation circuit configured to receive the differential intermediate signal and output a differential output signal having the target phase and a target gain, and a communication processor configured to control the phase control circuit and the gain compensation circuit. The communication processor may control a plurality of compensation transistors, included in the gain compensation circuit, based on an amplification factor corresponding to the target phase such that the gain compensation circuit outputs the differential output signal having the target gain.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:向量加法放大器</p>
        <p type="p">111:相位控制電路</p>
        <p type="p">112:增益補償電路</p>
        <p type="p">120:通訊處理器/處理器</p>
        <p type="p">CMD:命令</p>
        <p type="p">CTR1:第一控制訊號</p>
        <p type="p">CTR2:第二控制訊號</p>
        <p type="p">DOS:差動輸出訊號/訊號</p>
        <p type="p">DMS:差動中間訊號/訊號</p>
        <p type="p">MS1:第一中間訊號/中間訊號/訊號</p>
        <p type="p">MS2:第二中間訊號</p>
        <p type="p">OS1:正交訊號/第一正交訊號/輸入訊號</p>
        <p type="p">OS2:正交訊號/第二正交訊號/輸入訊號</p>
        <p type="p">OS3:正交訊號/第三正交訊號/輸入訊號</p>
        <p type="p">OS4:正交訊號/第四正交訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="569" publication-number="202616664">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616664</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113149675</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>振盪訊號產生電路及振盪訊號產生方法</chinese-title>
        <english-title>OSCILLATION SIGNAL GENERATING CIRCUIT AND OSCILLATION SIGNAL GENERATING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">H03L7/08</main-classification>
        <further-classification edition="200601120250401B">H03K4/48</further-classification>
        <further-classification edition="200601120250401B">H03K5/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立積電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHWAVE TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳品丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PIN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李泰成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TAI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳則朋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TSE-PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王銘鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MING-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提出一種振盪訊號產生電路及振盪訊號產生方法。振盪訊號產生電路包括第一電路以及第二電路。第一電路用以依據參考時脈訊號及回饋時脈訊號來產生輸出訊號。第一電路包括壓控振盪器。壓控振盪器用以輸出一輸出訊號，且輸出訊號的頻率受到控制電壓所控制。第二電路包括電壓補償電路以及最大相位差偵測器。當最大相位差偵測器偵測到最大相位差時，則最大相位差偵測器控制電壓補償電路，以將控制電壓補償至目標電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An oscillation signal generating circuit and an oscillation signal generating method are provided. The oscillation signal generating circuit includes a first circuit and a second circuit. The first circuit is configured to generate an output signal according to a reference clock signal and a feedback clock signal. The first circuit includes a voltage-controlled oscillator (VCO). The VCO is configured to output the output signal, and a frequency of the output signal is controlled by a control voltage. The second circuit includes a voltage compensation circuit and a maximum phase difference detector. When a maximum phase difference is detected by the maximum phase difference detector, the maximum phase difference detector controls the voltage compensation circuit to compensate the control voltage to a target voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:振盪訊號產生電路</p>
        <p type="p">110:第一電路</p>
        <p type="p">111:壓控振盪器</p>
        <p type="p">120:第二電路</p>
        <p type="p">121:最大相位差偵測器</p>
        <p type="p">122:電壓補償電路</p>
        <p type="p">DIV:回饋時脈訊號</p>
        <p type="p">OUT:輸出訊號</p>
        <p type="p">Svc:電壓補償訊號</p>
        <p type="p">Vctrl:控制電壓</p>
        <p type="p">REF:參考時脈訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="570" publication-number="202616360">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616360</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113150287</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250926B">H01L21/027</main-classification>
        <further-classification edition="200601120250926B">H01L21/306</further-classification>
        <further-classification edition="202501120250926B">H10D62/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭榮賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, JUNG TZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種一半導體裝置的製造方法包括：將一第一硬式遮罩層堆疊於一主動區域層上；在該第一硬式遮罩層上塗佈一光阻劑，其中該光阻劑覆蓋該第一硬式遮罩層的一第一周邊部分；部分蝕刻該第一硬式遮罩層；側向蝕刻該光阻劑以暴露該第一硬式遮罩層的一第二周邊部分；蝕刻該第一硬式遮罩層及該主動區域層，其中在該蝕刻步驟之後，該主動區域層具有一梯形上表面；及在該梯形上表面上沈積一介電層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of a semiconductor device includes stacking a first hard mask layer on an active area layer; coating a photoresist on the first hard mask layer, in which the photoresist covers a first peripheral portion of the first hard mask layer; partially etching the first hard mask layer; side etching the photoresist to expose a second peripheral portion of the first hard mask layer; etching the first hard mask layer and the active area layer, in which after the etching, the active area layer has a ladder-shaped upper surface; and depositing a dielectric layer on the ladder-shaped upper surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">110:基板</p>
        <p type="p">120:主動區域層</p>
        <p type="p">132:第一介電層</p>
        <p type="p">134:第三介電層</p>
        <p type="p">150:第二介電層</p>
        <p type="p">160:第一導電層</p>
        <p type="p">161:周邊部分</p>
        <p type="p">170:第二導電層</p>
        <p type="p">180:導電觸點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="571" publication-number="202616817">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616817</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113150357</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構的製造方法</chinese-title>
        <english-title>MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250103B">H10B12/00</main-classification>
        <further-classification edition="200601120250103B">H01L21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝沛築</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIE, PEI-JHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種半導體結構的製造方法。方法包括以下步驟。提供基板，基板具有第一陣列區、第二陣列區以及周邊區。在基板上形成第一下導電層，第一下導電層連續地具有位於第一陣列區中的第一部分、位於第二陣列區中的第二部分以及位於周邊區中的第三部分。移除第一下導電層的第一部分和第一下導電層的第二部分。在基板上形成第二下導電層。第二下導電層和第一下導電層包括相同的材料，使得第二下導電層和第一下導電層共同形成下導電層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of a semiconductor structure is provided. The method includes following steps. A substrate is provided, and the substrate has a first array region, a second array region, and a periphery region. A first lower conductive layer is formed on the substrate, the first lower conductive layer continuously has a first portion in the first array region, a second portion in the second array region, and a third portion in the periphery region. The first portion of the first lower conductive layer and the second portion of the first lower conductive layer are removed. A second lower conductive layer is formed on the substrate. The second lower conductive and the first lower conductive layer comprise the same material such that the second lower conductive and the first lower conductive layer form a lower conductive layer collectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:基板</p>
        <p type="p">142:下導電層</p>
        <p type="p">144:摻雜下導電層</p>
        <p type="p">160:上導電層</p>
        <p type="p">170:覆蓋層</p>
        <p type="p">180:第一位元線結構</p>
        <p type="p">182:第二位元線結構</p>
        <p type="p">190:第一間隔物</p>
        <p type="p">192:第二間隔物</p>
        <p type="p">R1:第一陣列區</p>
        <p type="p">R2:第二陣列區</p>
        <p type="p">R3:周邊區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="572" publication-number="202615915">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615915</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113150471</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝結構</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250703B">G02B6/42</main-classification>
        <further-classification edition="200601120250703B">G02B6/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>元澄半導體科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BE EPITAXY SEMICONDUCTOR TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宜臻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃柏翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PO-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪勇智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, YUNG-JR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱安國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, ANN-KUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王亦倢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YI-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體封裝結構包含光子積體電路晶片以及光纖陣列單元。光子積體電路晶片包含光波導、光柵耦合器以及介電結構。光柵耦合器連接光波導。介電結構位於光波導以及光柵耦合器上，且具有位於介電結構的上表面之第一定位件。光纖陣列單元位於光子積體電路晶片上，且包含光纖座以及光纖。光纖座具有位於光纖座的下表面之第二定位件，其中第一定位件與第二定位件配合。光纖固定於光纖座且光學耦合至光柵耦合器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor package structure includes a photonic integrated circuit chip and a fiber array unit. The photonic integrated circuit chip includes an optical waveguide, a grating coupler, and a dielectric structure. The grating coupler is connected to the optical waveguide. The dielectric structure is located on the optical waveguide and the grating coupler and has a first positioning member located on an upper surface of the dielectric structure. The fiber array unit is located on the photonic integrated circuit chip and includes a fiber holder and an optical fiber. The fiber holder has a second positioning member located on a lower surface of the fiber holder, in which the first positioning member cooperates with the second positioning member. The optical fiber is fixed to the fiber holder and optically coupled to the grating coupler.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體封裝結構</p>
        <p type="p">110:光子積體電路晶片</p>
        <p type="p">112:光波導</p>
        <p type="p">114:光柵耦合器</p>
        <p type="p">116:介電結構</p>
        <p type="p">117:半導體基板</p>
        <p type="p">118:下包覆層</p>
        <p type="p">119:上包覆層</p>
        <p type="p">120:光纖陣列單元</p>
        <p type="p">122:光纖座</p>
        <p type="p">124:光纖</p>
        <p type="p">m1:定位件</p>
        <p type="p">m2:定位件</p>
        <p type="p">s1:上表面</p>
        <p type="p">s2:下表面</p>
        <p type="p">s3,s4:側壁</p>
        <p type="p">R:反射鏡</p>
        <p type="p">L1:微透鏡</p>
        <p type="p">X,Y,Z:方向</p>
        <p type="p">θ:角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="573" publication-number="202615516">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615516</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113150731</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水凝膠組成物、水凝膠強化纖維素紙電池隔板及包含其的紙電池</chinese-title>
        <english-title>HYDROGEL COMPOSITION, HYDROGEL-REINFORCED CELLULOSE PAPER BATTERY SEPARATOR AND A PAPER BATTERY COMPRISING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F220/56</main-classification>
        <further-classification edition="200601120260102B">C08F222/38</further-classification>
        <further-classification edition="200601120260102B">C08J3/075</further-classification>
        <further-classification edition="201001120260102B">H01M10/0565</further-classification>
        <further-classification edition="202101120260102B">H01M50/403</further-classification>
        <further-classification edition="202101120260102B">H01M50/411</further-classification>
        <further-classification edition="202101120260102B">H01M50/423</further-classification>
        <further-classification edition="202101120260102B">H01M50/429</further-classification>
        <further-classification edition="202101120260102B">H01M50/44</further-classification>
        <further-classification edition="202101120260102B">H01M50/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商飛林特電池有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MADEBYFLINT PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查爾斯　卡洛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHARLES, CARLO EMMANUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於強化纖維素紙電池隔板之水凝膠組成物，其包含單體、交聯試劑、引發劑及金屬鹽。水凝膠強化纖維素紙電池隔板包含纖維素紙及整合於該纖維素紙內之水凝膠。紙電池包含該水凝膠強化纖維素紙電池隔板。一種用於製造該水凝膠強化纖維素紙電池隔板之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hydrogel composition for reinforcing a cellulose paper battery separator comprises a monomer, a cross-linking reagent, an initiator, and a metal salt. A hydrogel-reinforced cellulose paper battery separator comprises a cellulose paper, and a hydrogel integrated within the cellulose paper. A paper battery comprises the hydrogel reinforced cellulose paper batter separator. A method for fabricating the hydrogel reinforced cellulose paper batter separator.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="574" publication-number="202616707">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616707</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113150739</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>交換機裝置</chinese-title>
        <english-title>SWITCH DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250526B">H04L49/10</main-classification>
        <further-classification edition="202201120250526B">H04L47/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUI, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鳳林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, FENG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鵬天</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PENGTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙正揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, ZHENGYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種交換機裝置包含多個本地連接埠、多個級聯連接埠、緩衝記憶體以及處理單元。級聯連接埠用以連接至多個外部交換機裝置。處理單元用以分辨傳送至交換機裝置的輸入封包的來源連接埠。處理單元用以對應本地連接埠、級聯連接埠、交換機裝置以及外部交換機裝置取得複數個輸入計數。處理單元用以根據該些輸入計數判斷來源連接埠是否發生輸入壅塞。當判定未壅塞時，處理單元用以將輸入封包存入緩衝記憶體並且更新輸入計數。當判定壅塞時，處理單元用以發送暫停通知至來源連接埠或者丟棄輸入封包。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A switch device includes local connection ports, cascade connection ports, a buffer memory and a processing unit. The local connection ports are configured to connect with external switch devices. The processing unit is configured to distinguish a source connection port of an input packet transmitted to the switch device. The processing unit is configured to obtain a plurality of input counts corresponding to the local connection ports, the cascade connection ports, the switch device and the external switch devices. The processing unit is configured to determine whether an input congestion occurs according to the input counts. In response to that the input congestion is not detected, the processing unit is configured to store the input packet into the buffer memory and update the input counts. In response to that the input congestion is detected, the processing unit is configured to send a pause notification to the source connection port or drop the input packet.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120:處理單元</p>
        <p type="p">140:緩衝記憶體</p>
        <p type="p">CPw0,CPx0,CPx1,CPy1:級聯連接埠</p>
        <p type="p">Px0~Px19:本地連接埠</p>
        <p type="p">Sx:交換機裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="575" publication-number="202616194">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616194</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113151070</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及其資訊提供方法</chinese-title>
        <english-title>ELECTRONIC APPARATUS AND PROVIDING INFORMATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250521B">G06Q30/0601</main-classification>
        <further-classification edition="200601120250521B">G06F15/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇鵬飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, PENGFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴鍾范</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JONG BUM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉恩澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, ENZE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳奕安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹　基勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, KIYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種電子裝置之資訊提供方法。資訊提供方法可包括如下步驟：自用戶之第1終端獲得對應用程式之第1頁面之第1請求；基於複數個測試之資訊，確認與上述第1請求對應之一個以上之測試；基於上述一個以上之測試之資訊而獲得複數個資料，該等複數個資料包括實行上述一個以上之測試所需之一個以上之測試資料；及將基於上述複數個資料而構成之上述第1頁面之資訊提供至上述第1終端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子裝置</p>
        <p type="p">120:用戶終端</p>
        <p type="p">140:管理者終端</p>
        <p type="p">160:資料庫</p>
        <p type="p">S200:步驟</p>
        <p type="p">S210:步驟</p>
        <p type="p">S220:步驟</p>
        <p type="p">S230:步驟</p>
        <p type="p">S240:步驟</p>
        <p type="p">S250:步驟</p>
        <p type="p">S260:步驟</p>
        <p type="p">S270:步驟</p>
        <p type="p">S280:步驟</p>
        <p type="p">S290:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="576" publication-number="202616887">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616887</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113151170</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體元件及形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250626B">H10D84/83</main-classification>
        <further-classification edition="202501120250626B">H10D84/01</further-classification>
        <further-classification edition="202501120250626B">H10D30/62</further-classification>
        <further-classification edition="202501120250626B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡原宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YUAN TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林則維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHE WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王暉棠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUEI TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王英名</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YING MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林學溢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SYUE YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊松鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SUNG-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王琳松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LING-SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一高壓電晶體包含一不對稱閘極介電層及/或包含一個或多個不對稱功函數金屬層的一閘極結構。該閘極介電層及/或該功函數金屬層為不對稱的，因該閘極結構相對側上的閘極介電層的高度及/或該功函數金屬層的高度不同。具體來說，面向高壓電晶體的汲極區的一側閘極結構的閘極介電層的高度及/或功函數金屬層的高度低於面向高壓電晶體的源極區的另一側閘極結構的閘極介電層的高度及/或功函數金屬層的高度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A high-voltage transistor includes an asymmetric gate dielectric layer and/or a gate structure that includes one or more asymmetric work function metal layers. The gate dielectric layer and/or the work function metal layer(s) are asymmetric in that the height of the gate dielectric layer and/or the height of the work function metal layer(s) on opposing sides of the gate structure are different. In particular, the height of the gate dielectric layer and/or the height of the work function metal layer(s) on a side of the gate structure facing the drain region of the high-voltage transistor are lower than the height of the gate dielectric layer and/or the height of the work function metal layer(s) on an opposing side of the gate structure facing the source region of the high-voltage transistor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體元件</p>
        <p type="p">106:基板層</p>
        <p type="p">108:介電層</p>
        <p type="p">110a:積體電路元件</p>
        <p type="p">110b:積體電路元件</p>
        <p type="p">112a:源極/汲極區</p>
        <p type="p">112b:源極/汲極區</p>
        <p type="p">114:閘極介電層</p>
        <p type="p">116a:n型閘極結構</p>
        <p type="p">116b:p型閘極結構</p>
        <p type="p">118:側壁間隔物</p>
        <p type="p">120:源極/汲極接觸件</p>
        <p type="p">202:鰭結構</p>
        <p type="p">504:p型功函數金屬層</p>
        <p type="p">506a:側壁區段</p>
        <p type="p">506b:側壁區段</p>
        <p type="p">506d:底部區段</p>
        <p type="p">506e:底部區段</p>
        <p type="p">506f:過渡區段</p>
        <p type="p">512:閘極電極</p>
        <p type="p">700:實施例</p>
        <p type="p">702:覆蓋層</p>
        <p type="p">A-A:線段A-A</p>
        <p type="p">B-B:線段B-B</p>
        <p type="p">x,z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="577" publication-number="202616736">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616736</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113151265</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多功能發聲器件及電子設備</chinese-title>
        <english-title>MULTIFUNCTION SOUND DEVICE AND ELECTRONIC EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">H04R9/08</main-classification>
        <further-classification edition="200601120250203B">H04R7/02</further-classification>
        <further-classification edition="200601120250203B">H04R31/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商美特科技（蘇州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERRY ELECTRONICS (SUZHOU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭春隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, CHUNLONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅明亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, MINGYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>饒利國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAO, LIGUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明屬於聲電轉換技術領域，公開了一種多功能發聲器件及電子設備，多功能發聲器件的發聲單體包括固定於殼體的振動組件和具有磁間隙的磁路組件，所述磁路組件中心位置設有一通孔，所述振動組件在所述磁路組件的驅動下沿第一方向振動發聲；承載件透過彈性臂活動連接於所述殼體，包括收容於所述通孔內的線圈單元及馬達磁體，所述線圈單元連接於所述承載件，所述馬達磁體連接於所述磁路組件，所述線圈單元能驅動所述承載件沿第二方向振動。本發明集成揚聲器/受話器和線性振動馬達的功能，整體尺寸相較於分開設置的揚聲器/受話器和線性振動馬達較小，能夠應用在對尺寸要求較高的電子設備中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to acoustic to electrical conversion, and provides a multifunction sound device and an electronic equipment. A unit of the multifunction sound device comprises a vibrating component fixed to a housing and a magnetic path component with a magnetic gap. A hole is positioned at the central of the magnetic path component. The vibrating component generates sound vibrations along a first direction driven by the magnetic pate component. A bearing is movably connected to the housing via an elastic arm. A motor component comprises a coil unit and a motor magnet, the coil unit and the motor magnet contained within the hole. The coil unit is connected to the bearing. The motor magnet is connected to the magnetic path component. The coil unit drives the bearing to vibrate along a second direction. The present disclosure integrates a function of both a speaker/a receiver and a liner vibration motor. The overall size is smaller than that of a separate speaker/the receive and the liner vibration motor. It can be applied to the electronic equipment with high size requirement.</p>
      </isu-abst>
      <representative-img>
        <p type="p">130:頂蓋</p>
        <p type="p">140:底殼</p>
        <p type="p">200:發聲單體</p>
        <p type="p">210:振動組件</p>
        <p type="p">220:磁路組件</p>
        <p type="p">2213:彈性臂</p>
        <p type="p">240:導磁體</p>
        <p type="p">300:磁軛</p>
        <p type="p">321:通孔</p>
        <p type="p">400:承載件</p>
        <p type="p">500:馬達組件</p>
        <p type="p">X:第一方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="578" publication-number="202616186">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616186</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113151424</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用以提供與內容相關之優惠之方法、裝置及記錄媒體</chinese-title>
        <english-title>METHOD, APPARATUS AND RECORDING MEDIUM FOR PROVIDING BENEFIT CORRESPONDING TO CONTENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250701B">G06Q30/0207</main-classification>
        <further-classification edition="202301120250701B">G06Q30/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權銀善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, EUNSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴鎮亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JIN HYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里安托諾　伯納德斯　比利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIANTONO, BERNADUS BILLY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿斯法魯丁　穆罕默德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASFARUDIN, MUHAMMAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之各種實施例之方法可包括如下步驟：獲得用戶對第1頁面之連接請求，該第1頁面包括內容提供服務中提供之一個以上之內容之內容目錄；識別可提供給上述用戶之優惠及上述一個以上之內容中之可應用上述優惠之目標內容；將用於輸出上述第1頁面之第1頁面資訊傳輸至上述用戶之終端，以使得上述第1頁面包括顯示上述目標內容之資訊之第1區域，且於上述第1區域包括指示上述目標內容之優惠之第1優惠介面；自上述用戶之終端接收與上述第1優惠介面對應之上述用戶之第1優惠輸入；於接收到上述第1優惠輸入後，將用於輸出第2頁面之第2頁面資訊傳輸至上述用戶之終端，該第2頁面包括上述目標內容之詳細資訊、及指示上述目標內容之優惠之第2優惠介面；自上述用戶之終端接收與上述第2優惠介面對應之上述用戶之第2優惠輸入；及於接收到上述第2優惠輸入後，將用於輸出變更後之第2頁面的變更後之第2頁面資訊傳輸至上述用戶之終端，該變更後之第2頁面係上述第2優惠介面變更為用以接收對上述目標內容之播放輸入之播放介面者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S310,S320,S330,S340,S350,S360,S370:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="579" publication-number="202615733">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615733</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100044</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電化學反應製程系統及電化學反應製程方法</chinese-title>
        <english-title>ELECTROCHEMICAL REACTION PROCESS SYSTEM AND ELECTROCHEMICAL REACTION PROCESS METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250328B">C25D21/12</main-classification>
        <further-classification edition="200601120250328B">C25D21/14</further-classification>
        <further-classification edition="202301120250328B">G06N5/025</further-classification>
        <further-classification edition="202201120250328B">H04L41/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張佑祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YIU-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅鈺婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何　志明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHIH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>饒達仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, DA-JENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王慶鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHING-CHIUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電化學反應製程方法，包括：於電鍍設備設定相關於一電化學反應製程的參數以及參數範圍，以實驗設計法執行與電化學反應製程相關的實驗，並產生實驗後結果；透過處理器計算電化學反應製程的最佳化參數，包括：自電鍍設備接收參數以及實驗後結果；分析實驗後結果進行以得到相關於電化學反應製程的幾何參數，根據幾何參數計算關鍵因子；以及基於參數以及關鍵因子透過複雜系統響應（Complex System Response，CSR）軟體計算電化學反應製程的最佳化參數；透過處理器輸出最佳化參數至電鍍設備；以及透過電鍍設備根據最佳化參數修正相關於電化學反應製程的參數以及參數範圍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrochemical reaction process method includes: setting parameters and parameter ranges related to an electrochemical reaction process, executing experiment related to the electrochemical reaction process according to the experimental design method, and generating post-experiment results through an electroplating equipment; calculating the optimization parameters of the electrochemical reaction process through a processor, including: receiving the parameters and the post-experiment results from the electroplating equipment; analyzing the post-experiment results to obtain geometric parameters related to the electrochemical reaction process, and calculating key factors based on the geometric parameters; and calculating the optimal parameters of the electrochemical reaction process based on the parameters and the key factors through a complex system response (CSR) software; outputting the optimized parameters to the electroplating equipment through the processor; and correcting the parameters and the parameter ranges related to the electrochemical reaction process based on the optimized parameters through the electroplating equipment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:電化學反應製程方法</p>
        <p type="p">S21~S24、S231~S233:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="580" publication-number="202616279">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616279</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101490</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>時脈相位控制電路與電子裝置</chinese-title>
        <english-title>CLOCK PHASE CONTROL CIRCUIT AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">G11C7/22</main-classification>
        <further-classification edition="200601120250303B">G06F1/04</further-classification>
        <further-classification edition="200601120250303B">H03L7/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慧榮科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICON MOTION, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃漢城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HAN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種時脈相位控制電路，包括一取樣電路與一相位監控電路。取樣電路接收複數參考時脈訊號，並且響應於一讀取指令根據參考時脈訊號對從一記憶體裝置讀取的資料進行取樣，以取得複數取樣結果。參考時脈訊號是基於一基礎時脈訊號以複數不同的候選相位被產生的。相位監控電路接收取樣結果，並且根據取樣結果決定一最佳相位。從記憶體裝置讀取的資料包括響應於讀取指令依序被接收的一或多個資料區塊內的資料，並且響應於各資料區塊的結束，用於取樣從記憶體裝置讀取的資料的基礎時脈訊號的一取樣相位會根據最佳相位被調整。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A clock phase control circuit includes a sampling circuit and a phase monitoring circuit. The sampling circuit receives a plurality of reference clock signals and, in response to a read command, samples data read from a memory device according to the reference clock signals to obtain a plurality of sampling results. The reference clock signals are generated based on a fundamental clock signal with different candidate phases. The phase monitoring circuit receives the sampling results and determines an optimal phase according to the sampling results. The data read from the memory device comprises data in one or more data blocks which are sequentially received in response to the read command. In response to an end of each data block, a sampling phase of the fundamental clock signal to sample the data read from the memory device is adjusted according to the optimal phase.</p>
      </isu-abst>
      <representative-img>
        <p type="p">410:時脈訊號產生電路</p>
        <p type="p">420:時脈相位控制電路</p>
        <p type="p">430:取樣電路</p>
        <p type="p">440:相位監控電路</p>
        <p type="p">442:比較電路</p>
        <p type="p">446:最佳相位決定電路</p>
        <p type="p">B_pass,F_pass:距離</p>
        <p type="p">DATA:資料</p>
        <p type="p">Phase[1],Phase[2],Phase[n_C],Phase[N]:候選相位</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="581" publication-number="202616085">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616085</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101509</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資料儲存裝置與記憶體控制器</chinese-title>
        <english-title>DATA STORAGE DEVICE AND MEMORY CONTROLLER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250602B">G06F12/0866</main-classification>
        <further-classification edition="200601120250602B">G06F13/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慧榮科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICON MOTION, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃漢城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HAN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種資料儲存裝置，包括一記憶體裝置與一主機介面。主機介面與一主機裝置通訊，並且包括一第一電路與一第二電路。第一電路配置在一訊號接收路徑上，並且運作在一第一電源域。第一電路從主機裝置接收包括由主機裝置提供的一時脈訊號的複數訊號。第二電路配置在一訊號傳送路徑上，並且運作在第一電源域。第二電路根據時脈訊號輸出從記憶體裝置讀取的資料。第一電路耦接至第二電路，並且時脈訊號直接由第一電路提供給第二電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A data storage device includes a memory device and a host interface. The host interface, communicates with a host device and includes a first circuit and a second circuit. The first circuit is configured on a signal reception path and operates in a first power domain. The first circuit receives a plurality of signals from the host device, and the signals comprise a clock signal provided by the host device. The second circuit is configured on a signal transmission path and operates in the first power domain. The second circuit outputs data read from the memory device according to the clock signal. The first circuit is coupled to the second circuit and the clock signal is directly provided from the first circuit to the second circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">318:主機介面</p>
        <p type="p">338:裝置介面</p>
        <p type="p">310,320,330,340:電路</p>
        <p type="p">CLK,CLK’:時脈訊號</p>
        <p type="p">core:核心</p>
        <p type="p">DLL:延遲鎖定迴路</p>
        <p type="p">FF:正反器</p>
        <p type="p">IO:輸入輸出</p>
        <p type="p">LS:位準移位器</p>
        <p type="p">MUX:多工器</p>
        <p type="p">PCB:印刷電路板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="582" publication-number="202616818">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616818</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101546</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置的製造方法</chinese-title>
        <english-title>MANUFACTURING METHOD OF MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250203B">H10B12/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊英政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, YING-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴朝文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAY, CHAO-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體裝置的製造方法，包括：在基板上方形成硬式遮罩層，其中硬式遮罩層由氧化物類材料製成，且硬式遮罩層具有第一寬度；穿過硬式遮罩層在基板中形成溝槽；對基板執行第一清潔製程，其中硬式遮罩層的第一寬度在第一清潔製程完成之後減小至第二寬度；形成第一介電層，從而為內襯於溝槽；在溝槽中形成第一字元線層；在溝槽中與第一字元線層上方形成第二字元線層；在溝槽中及該第二字元線層上方形成頂蓋層；移除硬式遮罩層；及在頂蓋層上方形成閘極接觸層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of a memory device, including forming a hard mask layer over a substrate, in which the hard mask layer is made of an oxide-based material, and the hard mask layer has a first width, forming a trench in the substrate through the hard mask layer, performing a first cleaning process to the substrate, in which the first width of the hard mask layer is reduced to a second width after the first cleaning process is complete, forming a first dielectric layer lining the trench, forming a first word line layer in the trench, forming a second word line layer in the trench and over the first word line layer, forming a cap layer in the trench and over the second word line layer, removing the hard mask layer, and forming a gate contact layer over the cap layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板</p>
        <p type="p">105:隔離結構</p>
        <p type="p">112:介電層</p>
        <p type="p">120:熱氧化物層</p>
        <p type="p">122:介電層</p>
        <p type="p">124:介電層</p>
        <p type="p">126:介電層</p>
        <p type="p">130:字元線層</p>
        <p type="p">140:字元線層</p>
        <p type="p">150:頂蓋層</p>
        <p type="p">AA:主動區</p>
        <p type="p">WL:字元線結構/字元線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="583" publication-number="202616676">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616676</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101554</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分時雙工無線電收發器</chinese-title>
        <english-title>TIME-DIVISION DUPLEXING RADIO TRANSCEIVER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120250801B">H04B1/38</main-classification>
        <further-classification edition="201501120250801B">H04B1/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　嘉亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIA-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種分時雙工無線電收發器，包含：用以處理第一訊號並產生第二訊號的功率放大器、用以處理第四訊號並產生第五訊號的低雜訊放大器、與第三訊號相接的天線以及協同匹配網路。協同匹配網路包含用以接收第二訊號的第一電感、用以建立第三訊號的第二電感、與第一電容以及由第一邏輯訊號控制以提供該第三訊號分流路徑的第一開關相串聯的第三電感、將第三訊號連接至第四訊號的第四電感，以及由第一邏輯訊號控制以將第四訊號短路至接地的第二開關，其中第一電感、第二電感以及第三電感強烈互耦。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A TDD (time-division duplexing) radio transceiver includes: a PA (power amplifier) that processes a first signal and delivers a second signal; an LNA (low-noise amplifier) that processes a fourth signal and delivers a fifth signal; an antenna interfacing with a third signal; and a co-matching network with a first inductor receiving the second signal, a second inductor establishing the third signal, a third inductor in series with a first capacitor and a first switch controlled by a first logical signal providing a shunt path for the third signal, a fourth inductor linking the third signal to the fourth signal, and a second switch controlled by the logical signal to short the fourth signal to ground, wherein the first, second, and third inductors are strongly mutually coupled.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:分時雙工無線電收發器</p>
        <p type="p">210:功率放大器</p>
        <p type="p">220:協同匹配網路</p>
        <p type="p">230:低雜訊放大器</p>
        <p type="p">240:天線</p>
        <p type="p">250:切換電容網路</p>
        <p type="p">C1:第一電容</p>
        <p type="p">C2:第二電容</p>
        <p type="p">C3:第三電容</p>
        <p type="p">ENRX:接收器致能訊號</p>
        <p type="p">ENTX:傳送器致能訊號</p>
        <p type="p">L1:第一電感</p>
        <p type="p">L2:第二電感</p>
        <p type="p">L3:第三電感</p>
        <p type="p">L4:第四電感</p>
        <p type="p">
        &lt;i&gt;K&lt;/i&gt;
        &lt;sub&gt;12&lt;/sub&gt;:強烈互耦</p>
        <p type="p">
        &lt;i&gt;K&lt;/i&gt;
        &lt;sub&gt;23&lt;/sub&gt;:強烈互耦</p>
        <p type="p">S1:第一開關</p>
        <p type="p">S2:第二開關</p>
        <p type="p">S3:第三開關</p>
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;1&lt;/sub&gt;:第一訊號</p>
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;1+&lt;/sub&gt;、&lt;i&gt;V&lt;/i&gt;&lt;sub&gt;1-&lt;/sub&gt;:電壓</p>
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;2&lt;/sub&gt;:第二訊號</p>
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;2+&lt;/sub&gt;、&lt;i&gt;V&lt;/i&gt;&lt;sub&gt;2-&lt;/sub&gt;:電壓</p>
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;3&lt;/sub&gt;:第三訊號</p>
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;4&lt;/sub&gt;:第四訊號</p>
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;5&lt;/sub&gt;:第五訊號</p>
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;CT&lt;/i&gt;
        &lt;/sub&gt;:中央抽頭電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="584" publication-number="202616260">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616260</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101625</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>時序控制器及其操作方法</chinese-title>
        <english-title>TIMING CONTROLLER AND OPERATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">G09G5/18</main-classification>
        <further-classification edition="200601120250501B">G09G3/20</further-classification>
        <further-classification edition="200601120250501B">G06F13/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳勇智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YONG-JHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇國彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, KUO-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅仁鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, REN-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳政隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, ZHENG-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐浩哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HAO-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種時序控制器及其操作方法。時序控制器包括時序訊號產生部分以及畫面訊號產生部分。時序訊號產生部分產生時脈訊號給用以驅動顯示面板的多個源極驅動器。畫面訊號產生部分產生與時脈訊號同步的畫面訊號。畫面訊號包括對應於不同源極驅動器的多個資料區段。時序控制器調整時脈訊號與畫面訊號至少其中一者的相位，使時脈訊號對不同資料區段有不同的時間偏差，以適配於時序控制器至這些源極驅動器之間的不同傳輸路徑延遲。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a timing controller and an operating method thereof. The timing controller includes a timing signal generation part and a frame signal generation part. The timing signal generation part generates a clock signal to a plurality of source drivers for driving a display panel. The frame signal generation part generates a frame signal synchronized with the clock signal. The frame signal includes a plurality of data segments corresponding to different source drivers. The timing controller adjusts the phase of at least one of the clock signal and the frame signal so that the clock signal has different timing skews to different data segments for adapting to different transmission paths between the timing controller and the source drivers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S310、S320:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="585" publication-number="202616523">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616523</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102330</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於測試圖案之裝置、用於檢測橋接缺陷之方法及用於修改製造程序之方法</chinese-title>
        <english-title>DEVICE FOR TEST PATTERN, METHOD FOR DETECTING BRIDGING DEFECT, AND METHOD FOR MODIFYING MANUFACTURING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250207B">H01L23/544</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳東穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TUNG-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種裝置。該裝置包含：包括一第一主動傳導形貌體之一主動電路區；及自該主動傳導形貌體偏置之一測試圖案。該測試圖案包括：在一第一金屬層中之一第一傳導形貌體；在該第一金屬層中之一第二傳導形貌體；一第一測試電壓供應線路，其在該第一金屬層下方之一第二金屬層中且電氣連接至該第一傳導形貌體；及一第二測試電壓供應線路，其在該第二金屬層下方之一第三金屬層中且電氣連接至該第二傳導形貌體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device is provided. The device comprises: an active circuit region including a first active conductive feature; and a test pattern offset from the active conductive feature. The test pattern includes: a first conductive feature in a first metal layer; a second conductive feature in the first metal layer; a first test voltage supply line in a second metal layer below the first metal layer and electrically connected to the first conductive feature; and a second test voltage supply line in a third metal layer below the second metal layer and electrically connected to the second conductive feature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:部分</p>
        <p type="p">500A:主動電路區</p>
        <p type="p">500T:測試圖案</p>
        <p type="p">510A,510T:傳導形貌體</p>
        <p type="p">512,512A:襯裡層</p>
        <p type="p">514,514A:核心層</p>
        <p type="p">520:第一傳導層或接點</p>
        <p type="p">520A:第一傳導層</p>
        <p type="p">530:第二傳導層或接點</p>
        <p type="p">532:第一通孔</p>
        <p type="p">540:第三傳導層或接點</p>
        <p type="p">542:第二通孔</p>
        <p type="p">550:第四傳導層或接點</p>
        <p type="p">552:第三通孔</p>
        <p type="p">560:互連結構</p>
        <p type="p">561:接點</p>
        <p type="p">562:通孔</p>
        <p type="p">570:裝置層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="586" publication-number="202615974">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615974</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102716</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>絕緣膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">G03F7/004</main-classification>
        <further-classification edition="200601120260112B">G03F7/028</further-classification>
        <further-classification edition="200601120260112B">B32B27/18</further-classification>
        <further-classification edition="200601120260112B">H05K3/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村彰宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>代島雄汰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIJIMA, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平原真菜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAHARA, MANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下俊貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, TOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新川太一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIIKAWA, TAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野本周司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMOTO, SHUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種絕緣膜，其依序具備覆蓋膜、樹脂層及支撐膜，覆蓋膜的樹脂層側的表面的算術平均粗糙度Ra為0.3μm以上，最大峰高度Rp未達4μm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">
        </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="587" publication-number="202615980">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615980</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102943</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於強健先進成像技術之測量之方法</chinese-title>
        <english-title>METHODS FOR MEASUREMENT OF RAIM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G03F7/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飛勒　亞爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FELER, YOEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種疊對計量系統可根據一計量處方接收一樣本上之一疊對目標之一影像，其中該影像係藉由利用一或多對照射光束經由傾斜照射來照射包括複數個疊紋結構之一疊對目標而產生的，其中該影像的與該複數個疊紋結構中具有沿著一測量方向之週期性之一或多個疊紋結構相關聯的部分係經由來自該一或多對照射光束中具有與該測量方向正交之一偶極分離軸之一對照射光束之疊紋繞射階而形成，其中該複數個疊紋結構包含包括具有重疊區域之兩個或更多個光柵之疊紋結構。該疊對計量系統可基於該疊對目標之該影像而判定與樣本層之相對位置相關聯之疊對測量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An overlay metrology system may receive an image of an overlay target on a sample in accordance with a metrology recipe, wherein the image is generated by illuminating via oblique illumination an overlay target comprising a plurality of Moiré structures with one or more pairs of illumination beams, wherein portions of the image associated with one or more Moiré structures of the plurality of Moiré structures having periodicity along a measurement direction are formed via Moiré diffraction orders from one of the one or more pairs of the illumination beams having a dipole separation axis orthogonal to the measurement direction, wherein the plurality of Moiré structures include Moiré structures comprising two or more gratings with overlapping regions. The overlay metrology system may determine overlay measurements associated with relative positions of sample layers based on the image of the overlay target.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:疊對計量系統</p>
        <p type="p">102:疊對計量子系統</p>
        <p type="p">104:疊對目標</p>
        <p type="p">106:樣本</p>
        <p type="p">108a:照射光束</p>
        <p type="p">108b:照射光束</p>
        <p type="p">110:控制器</p>
        <p type="p">112:處理器</p>
        <p type="p">114:記憶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="588" publication-number="202615901">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615901</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103041</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層光學薄膜之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">G02B5/30</main-classification>
        <further-classification edition="200601120260112B">C09J5/04</further-classification>
        <further-classification edition="200601120260112B">C09J183/06</further-classification>
        <further-classification edition="200601120260112B">C09J183/08</further-classification>
        <further-classification edition="200601120260112B">C09F9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>笹川泰介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAGAWA, TAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三田聰司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種積層光學薄膜之製造方法，前述積層光學薄膜係透過接著劑層至少積層有第1光學薄膜及第2光學薄膜者；前述製造方法具備以下步驟：第1塗敷步驟，係於第1光學薄膜之貼合面塗敷至少含有胺基系矽烷耦合劑之第1接著劑組成物；及，第2塗敷步驟，係於第2光學薄膜之貼合面塗敷至少含有環氧系矽烷耦合劑之第2接著劑組成物；貼合步驟，係貼合第1光學薄膜之第1接著劑組成物塗敷面與第2光學薄膜之第2接著劑組成物塗敷面；以及，接著步驟，係藉由將已在貼合步驟中貼合之第1接著劑組成物及前述第2接著劑組成物硬化，來接著第1光學薄膜及第2光學薄膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="589" publication-number="202614939">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614939</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103206</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>開口端設有前置定位的開口拉鏈及在拼裝式拉桿箱上的應用方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250210B">A44B19/24</main-classification>
        <further-classification edition="200601120250210B">A45C13/10</further-classification>
        <further-classification edition="200601120250210B">A45C7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯雄企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王聯洲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李毓庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張朝坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種在開口端設有前置定位的開口拉鍊及在拼裝式拉桿箱上的應用。它是一種用於開合拉桿箱左、右箱殼或/和將拉桿箱左、右箱殼內的左、右內襯相互拉合組成手提袋或單肩包或雙肩包的開口拉鍊，它包括左、右鏈帶，以及開合該左、右鏈帶的拉頭，在左、右鏈帶的前端設有相互插接的下擋和插銷的連接裝置，其特徵是在連接裝置前面的延長布帶上還設有，使插銷插入下擋槽底部後不會後退、拉頭能正常合齒的前置定位裝置，所述的前置定位裝置為：插齒式定位裝置或搭扣式定位裝置或扣壓式定位裝置。它具有結構簡單、使用方便，功能多樣的優點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:主拉鍊</p>
        <p type="p">2:左、右鏈帶</p>
        <p type="p">3:拉頭</p>
        <p type="p">6:連接裝置</p>
        <p type="p">7:引手</p>
        <p type="p">8:連接片</p>
        <p type="p">9:布帶</p>
        <p type="p">15:前置定位裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="590" publication-number="202616261">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616261</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103455</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蜂鳴器之驅動系統及其方法</chinese-title>
        <english-title>BUZZER DEVICE, DRIVING SYSTEM FOR A BUZZER AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">G10K9/20</main-classification>
        <further-classification edition="200601120250401B">G10K9/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張寶樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, PAO-SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡志煒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種蜂鳴器之驅動系統，電連接一蜂鳴器，該驅動系統包含一驅動單元及一升壓單元；該驅動單元接收一類比音頻訊號，並根據該類比音頻訊號輸出一驅動電壓至該蜂鳴器；該升壓單元電連接該驅動單元，並將一輸入電壓升壓以產生一工作電壓至該驅動單元；該驅動系統透過類比形式訊號來產生該驅動電壓，以提升該蜂鳴器的輸出音訊品質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a driving system for a buzzer. The driving system includes a driving unit and a boost unit. The driving unit receives an analog audio and outputs a driving voltage to the buzzer according to the analog audio. The boost unit is electrically connected to the driving unit, generates a working voltage by boosting an input voltage and transmits the working voltage to the driving unit. The driving system generates the driving voltage through an analog signal to improve an output audio quality of the buzzer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:蜂鳴器之驅動系統</p>
        <p type="p">2:蜂鳴器</p>
        <p type="p">10:升壓單元</p>
        <p type="p">20:驅動單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="591" publication-number="202616262">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616262</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103527</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具信號補償功能之蜂鳴器驅動系統及其方法</chinese-title>
        <english-title>BUZZER DRIVING SYSTEM WITH SIGNAL COMPENSATION FUNCTION AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">G10K9/20</main-classification>
        <further-classification edition="200601120250401B">G10K9/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張寶樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, PAO-SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳威信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-SIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具信號補償功能之蜂鳴器驅動系統，用於一蜂鳴器，該蜂鳴器驅動系統包含一控制模組及一濾波模組；該控制模組具有一神經網路單元，該神經網路單元根據該蜂鳴器之一頻譜資料，產生對應該蜂鳴器頻率響應之一濾波係數；該濾波模組接收一音頻播放訊號，根據該濾波係數對該音頻播放訊號進行濾波，以產生一輸出訊號；該蜂鳴器驅動系統透過該濾波係數的調整來實現蜂鳴器的信號補償，並防止輸出音訊失真。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a buzzer driving system with signal compensation function. The buzzer driving system includes a control module and a filter module. The control module has a neural network unit. The neural network unit generates a filter coefficient corresponding to the frequency response of the buzzer according to the frequency spectrum data of the buzzer. The filter module receives an audio signal and filters the audio signal according to the filter coefficient to generate an output signal. The buzzer drive system realizes signal compensation of the buzzer by adjusting the filter coefficient, thereby preventing distortion of the output audio.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:蜂鳴器驅動系統</p>
        <p type="p">2:蜂鳴器</p>
        <p type="p">10:濾波模組</p>
        <p type="p">20:控制模組</p>
        <p type="p">21:神經網路單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="592" publication-number="202616263">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616263</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103530</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蜂鳴器之驅動系統及其方法</chinese-title>
        <english-title>DRIVING SYSTEM FOR A BUZZER AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">G10K9/20</main-classification>
        <further-classification edition="200601120250401B">G10K9/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張寶樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, PAO-SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種蜂鳴器之驅動系統，電連接一蜂鳴器，包含：包含一驅動單元、一升壓單元及一倍率偵測單元；該驅動單元包含一增益控制電路，透過該增益控制電路以一放大倍率調整一音頻訊號之增益，並根據該音頻訊號輸出一驅動電壓至該蜂鳴器；該升壓單元電連接該驅動單元，將一輸入電壓升壓以產生一工作電壓至該驅動單元；該倍率偵測單元電連接該驅動單元及該升壓單元，並預設根據該工作電壓產生複數階層電壓，由該倍率偵測單元將該輸入電壓依序與各該階層電壓進行比對以產生一估測倍率；其中，該增益控制電路之該放大倍率對應該估測倍率而設置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a driving system for a buzzer. The driving system includes a driving unit, a boost unit and a magnification detecting unit. The driving unit includes a gain control circuit, adjusts a gain of an audio signal through the gain control circuit according to a magnification factor and outputs a driving voltage to the buzzer based on the audio signal. The boost unit is electrically connected to the driving unit, generates a working voltage by boosting an input voltage and transmits the working voltage to the driving unit. The magnification detecting unit is electrically connected to both the driving unit and the boost unit and presets to generate multiple dividing voltages based on the working voltage. The magnification detecting unit sequentially compares the input voltage with each of the dividing voltages to generate an estimated magnification. Wherein the magnification factor of the gain control circuit is configured to correspond to the estimated magnification.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:蜂鳴器之驅動系統</p>
        <p type="p">2:蜂鳴器</p>
        <p type="p">10:驅動單元</p>
        <p type="p">20:升壓單元</p>
        <p type="p">30:倍率偵測單元</p>
        <p type="p">S:音頻訊號</p>
        <p type="p">D:驅動電壓</p>
        <p type="p">M:倍率訊號</p>
        <p type="p">R:準備訊號</p>
        <p type="p">VDD:輸入電壓</p>
        <p type="p">VOUT:工作電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="593" publication-number="202616029">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616029</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103825</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無人機群系統和無人機編隊飛行方法</chinese-title>
        <english-title>UNMANNED AERIAL VEHICLE SWARM SYSTEM AND UNMANNED AERIAL VEHICLE FORMATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250317B">G05D1/695</main-classification>
        <further-classification edition="202401120250317B">G05D1/46</further-classification>
        <further-classification edition="202401320250317B">G05D109/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立虎尾科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL FORMOSA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李孟澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MENG-TSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余柏伭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, PO-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊明龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, MING-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝哲瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHE-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪家勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, JIA-XUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊承翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHUANG, CHENG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俐吟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LI-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種無人機群系統，包含有一長機，包含一第一長機通訊模組，用來傳送一廣播訊息；以及一僚機，包含一第一僚機通訊模組，用來接收該廣播訊息；其中該廣播訊息包含該長機的複數個飛行資訊，用來使該僚機根據該複數個飛行資訊和該長機協同飛行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A drone swarm system includes a leader drone including a first leader drone communication module to transmit a broadcast message; and a wingman drone including a first wingman drone communication module to receive the broadcast; wherein the broadcast message includes a plurality of flight information of the leader drone and is configured to allow the wingman drone to fly in coordination with the leader drone according to the plurality of flight information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:無人機群系統</p>
        <p type="p">10:長機</p>
        <p type="p">20:僚機</p>
        <p type="p">101:第一長機通訊模組</p>
        <p type="p">201:第一僚機通訊模組</p>
        <p type="p">202:處理單元</p>
        <p type="p">203:儲存單元</p>
        <p type="p">204:飛行控制模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="594" publication-number="202616264">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616264</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103867</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蜂鳴器裝置、蜂鳴器之驅動系統及其方法</chinese-title>
        <english-title>BUZZER DEVICE, DRIVING SYSTEM FOR A BUZZER AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">G10K9/20</main-classification>
        <further-classification edition="200601120250401B">G10K9/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張寶樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, PAO-SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種蜂鳴器之驅動系統，包含一濾波電路及一驅動電路，由濾波電路對一音頻播放訊號進行濾波並輸出一類比播放訊號，該驅動電路電連接該濾波電路，並根據該類比播放訊號輸出一驅動電壓至該蜂鳴器。該驅動系統透過類比形式訊號來產生該驅動電壓，以提升該蜂鳴器的輸出音訊品質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a driving system for a buzzer. The driving system includes a filter circuit and a driving circuit. The filter circuit generates an analog playing signal by filtering a playing audio. The driving circuit is electrically connected to the filter circuit and generates a driving voltage according to the analog playing signal. The driving system generates the driving voltage through an analog signal to improve an output audio quality of the buzzer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:蜂鳴器之驅動系統</p>
        <p type="p">2:蜂鳴器</p>
        <p type="p">10:訊號處理電路</p>
        <p type="p">20:濾波電路</p>
        <p type="p">30:驅動電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="595" publication-number="202616734">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616734</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104025</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻尼機構及頭戴耳機</chinese-title>
        <english-title>DAMPING MECHANISM AND HEADPHONE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250331B">H04R1/10</main-classification>
        <further-classification edition="200601120250331B">H04R1/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商立訊精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXSHARE PRECISION INDUSTRY COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>段翔翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUAN, XIANGXIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明屬於耳機技術領域，公開了一種阻尼機構及頭戴耳機，阻尼機構包括支撐件和阻尼組件。支撐件設有滑槽和連通於滑槽的第一通孔，阻尼組件能夠將滑槽分隔為調節腔和平衡腔，平衡腔連通於外部，阻尼組件的一端滑動設置於滑槽中，阻尼組件伸入滑槽內的一端為密封端，密封端與滑槽靠近第一通孔的一端形成調節腔，調節腔通過第一通孔連通於外部，阻尼組件在滑槽中滑動時，使得調節腔內的壓強產生變化，並產生阻尼。頭戴耳機包括耳機本體和阻尼機構，阻尼機構設置於耳機本體上。通過上述設置，本申請的阻尼機構的阻尼效果更好，物料成本更低。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention belongs to the field of earphone technology, and discloses a damping mechanism and a headphone. The damping mechanism includes a support and a damping element. The support is provided with a slide groove and a first through hole connected to the slide groove. The damping assembly can separate the slide groove into an adjustment chamber and a balance chamber. The balance chamber is connected to the outside. One end of the damping assembly is slidably arranged in the slide groove. The end of the damping assembly extending into the slide groove is a sealed end. The sealed end and an end of the slide groove close to the first through hole form an adjustment chamber. The adjustment chamber is connected to the outside through the first through hole. When the damping element slides in the slide groove, the pressure in the adjustment chamber changes and damping is generated. The headphone includes an earphone body and a damping mechanism. The damping mechanism is arranged on the earphone body. Through the above arrangement, the damping effect of the damping mechanism of the present application is better and the material cost is lower.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:耳機本體</p>
        <p type="p">1:支撐件</p>
        <p type="p">2:阻尼組件</p>
        <p type="p">5:限位件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="596" publication-number="202614941">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614941</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104245</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>拉鏈之滑動阻力測定裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250827B">A44B19/62</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＹＫＫ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YKK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹久文康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEHISA, FUMIYASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠測定具有包含曲線部分之滑動路徑之拉鏈之滑動阻力的拉鏈之滑動阻力測定裝置。本發明係關於具有於滑動路徑13滑動而開閉之滑件11、及連結於滑件11之拉片12的拉鏈10之滑動阻力測定裝置100。滑動阻力測定裝置100具備：固定部110，其用以固定具有拉鏈10之測定對象物1；連結部120，其連結於拉片12；驅動裝置130，其藉由使連結部120沿著基於滑動路徑13設定之軌道移動，而經由拉片12使滑件11沿著滑動路徑13滑動；及負載感測器140，其經由連結部120測定於滑件11滑動時從上述拉片12傳遞之負載。驅動裝置130包含調整機構，該調整機構在滑件11於滑動路徑13之曲線部分13D、13E滑動時調整負載感測器140及連結部120相對於滑動路徑13之姿勢。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:測定對象物(包)</p>
        <p type="p">2:正面部</p>
        <p type="p">3:右側部</p>
        <p type="p">4:上部</p>
        <p type="p">5:左側部</p>
        <p type="p">10:拉鏈</p>
        <p type="p">11:滑件</p>
        <p type="p">12:拉片</p>
        <p type="p">13:滑動路徑</p>
        <p type="p">13A:第1垂直部</p>
        <p type="p">13B:水平部</p>
        <p type="p">13C:第2垂直部</p>
        <p type="p">13D:第1曲線部</p>
        <p type="p">13E:第2曲線部</p>
        <p type="p">120:連結部</p>
        <p type="p">130:驅動裝置</p>
        <p type="p">131:驅動端部</p>
        <p type="p">132:支持部</p>
        <p type="p">140:負載感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="597" publication-number="202616619">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616619</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104399</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電子組件之磁力預載平台總成</chinese-title>
        <english-title>MAGNETICALLY PRELOADED STAGE ASSEMBLY FOR ELECTRONIC COMPONENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">H02K41/02</main-classification>
        <further-classification edition="200601120260108B">F16C32/04</further-classification>
        <further-classification edition="200601120260108B">H02K7/09</further-classification>
        <further-classification edition="201601120260108B">H02K11/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商奧寶科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORBOTECH LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈伊克赫曼　塔爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOICHMAN, TAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿哈加尼　艾許坎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGHAJANI, ASHKAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯朗夫曼　阿卡迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRONFMAN, ARKADY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於支撐及移動電子組件之平台總成包含一導軌。該平台總成亦包含用於支撐一電子組件且可沿著該導軌之一長度移動之一載體。該平台總成進一步包含一線性馬達，該線性馬達包括一轉子及沿著該導軌之該長度定位之一定子總成，該轉子可操作地耦合至該載體以致動該載體沿著該導軌之該長度之移動。該平台總成又進一步包含由一鐵磁材料形成且定位於該定子總成與該載體之間的一磁通屏蔽件。該平台總成亦包含可操作地耦合至該載體之一或多個磁性預載總成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A stage assembly for supporting and moving electronic components includes a guide rail. The stage assembly also includes a carrier for supporting an electronic component and moveable along a length of the guide rail. The stage assembly further includes a linear motor comprising a rotor and a stator assembly positioned along the length of the guide rail, the rotor operatively coupled to the carrier to actuate movement of the carrier along the length of the guide rail. The stage assembly yet further includes a flux shield formed of a ferromagnetic material and positioned between the stator assembly and the carrier. The stage assembly also includes one or more magnetic preload assemblies operatively coupled to the carrier.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:平台總成</p>
        <p type="p">12:導軌</p>
        <p type="p">14:載體</p>
        <p type="p">16:線性馬達</p>
        <p type="p">18:磁通屏蔽件</p>
        <p type="p">20:可調整磁性預載總成</p>
        <p type="p">20a:第一複數個磁性預載總成</p>
        <p type="p">20b:第二複數個磁性預載總成</p>
        <p type="p">22:空氣軸承</p>
        <p type="p">22a:第一對空氣軸承</p>
        <p type="p">22b:第二對空氣軸承</p>
        <p type="p">24:上表面</p>
        <p type="p">26:下表面</p>
        <p type="p">28:側</p>
        <p type="p">30:端</p>
        <p type="p">32:馬達接納腔</p>
        <p type="p">34:上側</p>
        <p type="p">36:下側</p>
        <p type="p">38:側</p>
        <p type="p">40:端</p>
        <p type="p">42:軌道接納腔</p>
        <p type="p">44:切口</p>
        <p type="p">46:開口</p>
        <p type="p">46a:安裝開口</p>
        <p type="p">46b:通孔</p>
        <p type="p">46c:安裝開口</p>
        <p type="p">52:定子總成/定子</p>
        <p type="p">54:U形外殼</p>
        <p type="p">56:氣體供應源</p>
        <p type="p">58:閥單元</p>
        <p type="p">60:凹部</p>
        <p type="p">C:幾何中心線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="598" publication-number="202616108">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616108</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104791</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理資訊之方法及用於該方法之電子裝置</chinese-title>
        <english-title>METHOD FOR PROCESSING INFORMATION AND ELECTRONIC DEVICE FOR PERFORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250704B">G06F17/40</main-classification>
        <further-classification edition="202301120250704B">G06Q30/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種於電子裝置中處理資訊之方法。具體而言，於電子裝置中處理資訊之方法可包括如下步驟：對應於確認目標原始碼為分發目標，自第1資料庫確認包括與目標原始碼相關之作業之識別資訊之第1資訊；基於第1資訊，自第2資料庫確認包括用以實行作業之詳細資訊之第2資訊；及基於第2資訊，實行作業。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S110:步驟</p>
        <p type="p">S120:步驟</p>
        <p type="p">S130:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="599" publication-number="202616834">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616834</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104885</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構的形成方法</chinese-title>
        <english-title>FORMING METHOD OF SEMICONDUCTOR STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250303B">H10D1/60</main-classification>
        <further-classification edition="200601120250303B">H01L21/027</further-classification>
        <further-classification edition="200601120250303B">H01L21/033</further-classification>
        <further-classification edition="200601120250303B">H01L21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳禹唐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種形成半導體結構的方法。此方法包括以下操作。形成第一硬遮罩疊層在介電層上，其中介電層包括陣列區域。蝕刻第一硬遮罩疊層以形成第二硬遮罩疊層與第一溝槽，第一溝槽沿著第一方向在陣列區域的上方且在第二硬遮罩疊層中延伸。形成第二溝槽在第二硬遮罩疊層中，第二溝槽沿著與第一方向不同的第二方向延伸，其中第一溝槽與第二溝槽相互交叉以形成相交處。蝕刻相交處的正下方的第二硬遮罩疊層與介電層以形成通孔。形成第一著陸墊在通孔中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a method of forming a semiconductor structure. The method includes the following operations. A first hard mask stack is formed on a dielectric layer, in which the dielectric layer includes an array region. The first hard mask stack is etched to form a second hard mask stack and a first trench extending along a first direction above the array region and in the second hard mask stack. A second trench is formed in the second hard mask stack extending along a second direction different from the first direction, in which the first trench and the second trench cross each other to form an intersection. The second hard mask stack and the dielectric layer directly below the intersection are etched to form a through-hole. A first landing pad is formed in the through-hole.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體結構</p>
        <p type="p">110、150:介電層</p>
        <p type="p">120:第一著陸墊</p>
        <p type="p">130:第二著陸墊</p>
        <p type="p">140:電容器結構</p>
        <p type="p">140d:電容器介電層</p>
        <p type="p">140o:外介電層</p>
        <p type="p">140f:第一電極層</p>
        <p type="p">140s:第二電極層</p>
        <p type="p">152:導線</p>
        <p type="p">AR:陣列區域</p>
        <p type="p">PR:週邊區域</p>
        <p type="p">T1、T2、T3:厚度</p>
        <p type="p">S1:間距</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="600" publication-number="202616696">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616696</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105145</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>密碼系統管線數論變換加速器</chinese-title>
        <english-title>CRYPTOGRAPHIC SYSTEM PIPELINED NUMBER THEORETIC TRANSFORM ACCELERATOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H04L9/14</main-classification>
        <further-classification edition="200601120260102B">G01C1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商微軟技術授權有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICROSOFT TECHNOLOGY LICENSING, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比謝尼薩爾　穆傑塔巴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BISHEH NIASAR, MOJTABA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱利　布萊恩大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KELLY, BRYAN DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮里里　巴拉特Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PILLILLI, BHARAT S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">密碼加速器利用並行及管線蝶形運算子電路的組合來執行數論變換(NTT)或逆NTT (INTT)。加速器包括第一組管線並行蝶形運算子電路對，該等電路經配置以對多項式係數對進行運算以提供輸出係數。第一緩衝器經耦合以儲存輸出係數。第二組管線並行蝶形運算子電路對經配置以對從第一緩衝器獲得的係數對進行運算，以提供數論變換(NTT)域中或NTT域之外的多項式的係數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cryptographic accelerator utilizes a combination of parallel and pipelined butterfly operator circuit to perform number theoretic transform (NTT) or inverse NTT (INTT.) The accelerator includes a first set of pipelined pairs of parallel butterfly operator circuits configured to operate on pairs of polynomial coefficients to provide output coefficients. A first buffer is coupled to store the output coefficients. A second set of pipelined pairs of parallel butterfly operator circuits are configured to operation on pairs of coefficients obtained from the first buffer to provide coefficients of the polynomial in a number theoretic transform (NTT) domain or out of the NTT domain.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:電路</p>
        <p type="p">610:記憶體</p>
        <p type="p">615:第一階段並行蝶形電路</p>
        <p type="p">616:第一階段並行蝶形電路</p>
        <p type="p">618:輸出</p>
        <p type="p">619:輸出</p>
        <p type="p">620:輸出</p>
        <p type="p">621:輸出</p>
        <p type="p">623:第二階段並行蝶形電路</p>
        <p type="p">624:第二階段並行蝶形電路</p>
        <p type="p">630:緩衝器</p>
        <p type="p">631:緩衝器</p>
        <p type="p">632:緩衝器</p>
        <p type="p">633:緩衝器</p>
        <p type="p">635:多工器</p>
        <p type="p">640:第三階段並行蝶形電路</p>
        <p type="p">641:第三階段並行蝶形電路</p>
        <p type="p">643:輸出</p>
        <p type="p">644:輸出</p>
        <p type="p">645:輸出</p>
        <p type="p">646:輸出</p>
        <p type="p">650:蝶形電路</p>
        <p type="p">651:蝶形電路</p>
        <p type="p">655:緩衝器</p>
        <p type="p">656:緩衝器</p>
        <p type="p">657:緩衝器</p>
        <p type="p">658:緩衝器</p>
        <p type="p">660:多工器</p>
        <p type="p">665:控制器</p>
        <p type="p">670:ROM</p>
        <p type="p">u&lt;sub&gt;00&lt;/sub&gt;:係數</p>
        <p type="p">u&lt;sub&gt;01&lt;/sub&gt;:係數</p>
        <p type="p">u&lt;sub&gt;10&lt;/sub&gt;:係數</p>
        <p type="p">u&lt;sub&gt;11&lt;/sub&gt;:係數</p>
        <p type="p">u&lt;sub&gt;20&lt;/sub&gt;:係數</p>
        <p type="p">u&lt;sub&gt;21&lt;/sub&gt;:係數</p>
        <p type="p">V&lt;sub&gt;00&lt;/sub&gt;:係數</p>
        <p type="p">V&lt;sub&gt;01&lt;/sub&gt;:係數</p>
        <p type="p">V&lt;sub&gt;10&lt;/sub&gt;:係數</p>
        <p type="p">V&lt;sub&gt;11&lt;/sub&gt;:係數</p>
        <p type="p">V&lt;sub&gt;20&lt;/sub&gt;:係數</p>
        <p type="p">V&lt;sub&gt;21&lt;/sub&gt;:係數</p>
        <p type="p">ω&lt;sub&gt;00&lt;/sub&gt;:權重|旋轉因子</p>
        <p type="p">ω&lt;sub&gt;10&lt;/sub&gt;:權重|旋轉因子</p>
        <p type="p">ω&lt;sub&gt;11&lt;/sub&gt;:權重|旋轉因子</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="601" publication-number="202615135">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615135</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105240</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在水系統中去除硝酸鹽以改進ＰＦＡＳ破壞之方法及系統</chinese-title>
        <english-title>METHODS AND SYSTEMS OF NITRATE REMOVAL IN AQUEOUS SYSTEMS FOR IMPROVED PFAS DESTRUCTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B01D61/02</main-classification>
        <further-classification edition="200601120260102B">B01D61/08</further-classification>
        <further-classification edition="200601120260102B">B01D61/14</further-classification>
        <further-classification edition="200601120260102B">B01D69/02</further-classification>
        <further-classification edition="202301120260102B">C02F1/32</further-classification>
        <further-classification edition="202301120260102B">C02F1/44</further-classification>
        <further-classification edition="202301120260102B">C02F1/66</further-classification>
        <further-classification edition="202301120260102B">C02F1/70</further-classification>
        <further-classification edition="202301120260102B">C02F1/72</further-classification>
        <further-classification edition="202301120260102B">C02F1/78</further-classification>
        <further-classification edition="200601320260102B">C02F101/16</further-classification>
        <further-classification edition="200601320260102B">C02F101/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商凱洛思科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLAROS TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉澤坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, ZEKUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密斯　特倫斯Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMITH, TERRANCE P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希爾布蘭茲　亞當邁克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HILBRANDS, ADAM MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡姆　內森恩斯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMM, NATHAN ERNST</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒂拉多　約瑟夫魯埃爾萊文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIRADO, JOSEPH REUEL LEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆恩斯　索尼婭伊莉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOONS, SONJA ELISE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布洛克格雷騰斯　約翰威爾弗里德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROCKGREITENS, JOHN WILFRID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希利　安德魯托馬斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEALY, ANDREW THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供在含有硝酸鹽之水中破壞PFAS之方法及系統。該方法及系統包含使含有PFAS及硝酸鹽之水通過對PFAS具有選擇性之膜以進行過濾，以獲得含有PFAS及硝酸鹽之膜廢液以及含有硝酸鹽之濾液；使用該膜廢液形成處理溶液，包含：稀釋該膜廢液，以及結合該膜廢液與光敏化劑、亞硫酸鹽以及足夠量之鹼，使該處理溶液之pH值為約10或更高；以及於光反應器中以紫外光照射該處理溶液，以破壞該PFAS之一部分。於稀釋之前，該膜廢液中PFAS濃度可比該過濾步驟之前高約3倍至約20倍。該膜廢液之稀釋可包含約3倍至約20倍之稀釋。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and systems of PFAS destruction in water containing nitrate. The methods and systems include filtering water containing PFAS and nitrate through a membrane selective for PFAS to obtain a membrane reject containing PFAS and nitrate and a filtrate containing nitrate, forming a treatment solution using the membrane reject including diluting the membrane reject and combining the membrane reject with a photosensitizer, a sulfite salt, and a sufficient amount of base such that the treatment solution has a pH of about 10 or more, and irradiating the treatment solution with UV light in a photoreactor to destroy a portion of the PFAS. Before dilution, a concentration of PFAS in the membrane reject may be between about 3 times and about 20 times greater than before the filtering step. Dilution of the membrane reject may include between about a 3 and about a 20 times dilution.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="602" publication-number="202615534">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615534</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105496</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>觸媒組合物、封閉型聚異氰酸酯組合物、塗料組合物、塗膜及塗膜的形成方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08G18/62</main-classification>
        <further-classification edition="200601120260102B">C08G18/82</further-classification>
        <further-classification edition="200601120260102B">C09D175/04</further-classification>
        <further-classification edition="201801120260102B">C09D7/63</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東楚股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOSOH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野口周人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOGUCHI, SHUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島雄次</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKASHIMA, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種觸媒組合物，其為用於使封閉劑從封閉型聚異氰酸酯解離的觸媒組合物，包括四級銨鹽、以及選自由羥胺化合物及肟化合物所組成之群組的至少一種化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="603" publication-number="202615975">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615975</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105597</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性轉印材料及其製造方法</chinese-title>
        <english-title>PHOTOSENSITIVE TRANSFER MATERIAL AND METHOD OF PRODUCING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">G03F7/004</main-classification>
        <further-classification edition="200601120260112B">G03F7/11</further-classification>
        <further-classification edition="201901120260112B">B32B7/022</further-classification>
        <further-classification edition="200601120260112B">B32B27/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>両角一真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOROZUMI, KAZUMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤本進二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMOTO, SHINJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢那慎一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANNA, SHINICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題為提供一種藉由臨時支撐體剝離曝光而獲得之圖案的圖案形狀優異之感光性轉印材料及其製造方法。本發明提供一種臨時支撐體剝離曝光用感光性轉印材料及其製造方法，該感光性轉印材料依序具有臨時支撐體、熱塑性樹脂層、中間層及感光性樹脂層，上述臨時支撐體的與上述熱塑性樹脂層接觸之面上之高度0.5μm以上且小於10μm的突起的量為1×10        &lt;sup&gt;2&lt;/sup&gt;個/mm        &lt;sup&gt;2&lt;/sup&gt;以上且小於5×10        &lt;sup&gt;6&lt;/sup&gt;個/mm        &lt;sup&gt;2&lt;/sup&gt;，上述熱塑性樹脂層包含共聚聚酯樹脂，上述熱塑性樹脂層的平均厚度為1μm～10μm，上述熱塑性樹脂層與上述中間層的剝離力為50mN/cm以下。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:感光性轉印材料</p>
        <p type="p">11:臨時支撐體</p>
        <p type="p">12:轉印層</p>
        <p type="p">13:熱塑性樹脂層</p>
        <p type="p">15:中間層</p>
        <p type="p">17:感光性樹脂層</p>
        <p type="p">19:保護膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="604" publication-number="202615441">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615441</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105809</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>三矽烷胺化合物、包括彼之用於沉積含矽薄膜的組合物、包括彼之含矽薄膜、以及使用彼之含矽薄膜的製造方法</chinese-title>
        <english-title>TRISILYLAMINE COMPOUND, COMPOSITION FOR DEPOSITING SILICON-CONTAINING THIN FILM INCLUDING THE SAME, SILICON-CONTAINING THIN FILM INCLUDING THE SAME, AND METHOD OF MANUFACTURING SILICON-CONTAINING THIN FILM USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">C07F7/02</main-classification>
        <further-classification edition="200601120250303B">C07F7/10</further-classification>
        <further-classification edition="200601120250303B">C23C16/42</further-classification>
        <further-classification edition="200601120250303B">C23C16/44</further-classification>
        <further-classification edition="200601120250303B">H01L21/205</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＤＮＦ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DNF CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張世珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, SE JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴廷主</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JEONG JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛銀眞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, EUN JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴重鎭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JOONG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴建柱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, GUN JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金成基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNG GI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭仁京</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, IN KYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李三東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SAMDONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李均相</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, GYUN SANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種三矽烷胺化合物、包括彼之用於沉積含矽薄膜的組合物、使用彼之含矽薄膜的製造方法。根據本發明的由三矽烷胺化合物製造的含矽薄膜不僅具有優異的化學及熱穩定性，而且具有低介電常數，因此能夠有用地適用為半導體裝置的絕緣膜，尤其是半導體小型化製程的間隔件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a trisilylamine compound, a composition for depositing a silicon-containing thin film including the compound, and a method of manufacturing a silicon-containing thin film using the same, and since the silicon-containing thin film manufactured from the trisilylamine compound according to the present invention has both excellent chemical and thermal stability and has low permittivity, it may be usefully applied as an insulating film of a semiconductor device, in particular, a spacer of a semiconductor miniaturization process.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="605" publication-number="202615584">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615584</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105826</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚酯樹脂、以及含有其之黏接劑組成物、黏接片、及疊層體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251106B">C08L67/06</main-classification>
        <further-classification edition="200601120251106B">C08G63/12</further-classification>
        <further-classification edition="200601120251106B">C09J167/07</further-classification>
        <further-classification edition="200601120251106B">B32B15/09</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東洋紡ＭＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOBO MC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡島裕樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAJIMA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木津本博俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIZUMOTO, HIROTOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三上忠彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIKAMI, TADAHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供具有高還原黏度，同時可形成高交聯密度的聚酯樹脂。&lt;br/&gt;一種聚酯樹脂，其中，聚酯樹脂的還原黏度為0.50dl/g以上，聚酯樹脂的酸值(AV)為150eq/t以上，屬於2個羧基形成酯鍵，1個羧基以游離的羧基的狀態存在之三羧酸成分之羧基的酸值(AV&lt;sub&gt;2&lt;/sub&gt;)為50eq/t以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="606" publication-number="202615319">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615319</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105879</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吸附裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250719B">B65G47/91</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商美倍亞三美股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINEBEA MITSUMI INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北野智章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITANO, TOMOAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武田裕一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEDA, YUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西部寿起</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIBU, KOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>下畠剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMOHATA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長島達浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGASHIMA, TATSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本吸附裝置包括：吸附部安裝部，供藉由負壓來吸附對象物的吸附部進行安裝；以及按壓部，與吸附部分開設置，並按壓對象物的外表面，按壓部構成為於利用吸附部吸附對象物時比吸附部先接觸對象物的外表面並進行按壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:吸附部</p>
        <p type="p">3a:吸附面</p>
        <p type="p">4:按壓部</p>
        <p type="p">4a:按壓面</p>
        <p type="p">6:共用配管部</p>
        <p type="p">7:配管</p>
        <p type="p">30:墊固定件</p>
        <p type="p">30a:卡合槽部</p>
        <p type="p">31:波紋管(蛇紋管)</p>
        <p type="p">32:吸附墊</p>
        <p type="p">40:按壓構件</p>
        <p type="p">51:主管</p>
        <p type="p">70:分支配管部</p>
        <p type="p">70a:外側端部</p>
        <p type="p">72:增強肋部</p>
        <p type="p">73:吸附裝置主體安裝部</p>
        <p type="p">74:吸附部安裝部</p>
        <p type="p">74a:突起部</p>
        <p type="p">100:吸附裝置</p>
        <p type="p">100a:按壓吸附機構</p>
        <p type="p">C1:中心軸線</p>
        <p type="p">C2:中心軸線</p>
        <p type="p">r:方向</p>
        <p type="p">RE:區域</p>
        <p type="p">S1:面積</p>
        <p type="p">S2:吸附面積</p>
        <p type="p">X:方向</p>
        <p type="p">Y:方向</p>
        <p type="p">Z:方向</p>
        <p type="p">Z1:方向</p>
        <p type="p">Z2:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="607" publication-number="202616620">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616620</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106048</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有單電感多輸出之混合切換轉換器及其控制方法</chinese-title>
        <english-title>HYBRID SWITCHING CONVERTER WITH SINGLE INDUCTOR AND MULTIPLE OUTPUTS AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250701B">H02M1/08</main-classification>
        <further-classification edition="200601120250701B">H02M3/04</further-classification>
        <further-classification edition="200601120250701B">G05F1/565</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立錡科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHTEK TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉國基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KUO-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯智化</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, CHIH-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許麗美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有單電感多輸出之混合切換轉換器及其控制方法，用以將輸入電壓轉換為第一輸出電壓與第二輸出電壓。混合切換轉換器包含：子切換轉換器，將輸入電壓轉換為中繼電壓；第一輸出開關與第二輸出開關，分別於第一電感週期與第二電感週期導通中繼電壓，以產生第一與第二輸出電壓。子切換轉換器包括：切換電容分壓電路，透過多組脈寬調變訊號控制多個開關，以於不同電感週期分別產生兩個不同位準的分壓以供應予其中之電感；以及控制電路，產生脈寬調變訊號，分時控制多個開關及輸出開關，並基於輸出電壓回授訊號調節輸出電壓至目標電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a hybrid switching converter with a single inductor and multiple outputs and a control method thereof, configured to convert an input voltage to a first and a second output voltages. The hybrid switching converter includes: a sub-switching converter, which converts the input voltage into an intermediate voltage; a first and a second output switch, which conduct the intermediate voltage during a first and a second inductance cycle, respectively, to generate the first and second output voltages. The sub-switching converter comprises: a switched capacitor voltage divider circuit, which controls multiple switches through pulse-width modulation (PWM) signals to generate two divided voltage levels in each inductance cycle for supplying an inductor therein; and a control circuit, which generates PWM signals to control the multiple switches and the output switches in a time-division manner, and regulates the output voltages to target values according to output voltage feedback signals.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:具有單電感多輸出之混合切換轉換器</p>
        <p type="p">21:子切換轉換器</p>
        <p type="p">211:切換電容分壓電路</p>
        <p type="p">213:控制電路</p>
        <p type="p">Co1,Co2:輸出電容</p>
        <p type="p">iL:電感電流</p>
        <p type="p">Iout1:第一輸出電流</p>
        <p type="p">Iout2:第二輸出電流</p>
        <p type="p">L1:電感</p>
        <p type="p">N1:第一端</p>
        <p type="p">N2:第二端</p>
        <p type="p">PWM1:第一組脈寬調變訊號</p>
        <p type="p">PWM2:第二組脈寬調變訊號</p>
        <p type="p">Q5,Q6:輸出開關</p>
        <p type="p">S5:第一分時控制訊號</p>
        <p type="p">S6:第二分時控制訊號</p>
        <p type="p">SiL:電感電流訊號</p>
        <p type="p">V1:第一電壓</p>
        <p type="p">V2:第二電壓</p>
        <p type="p">Vfb1:第一回授訊號</p>
        <p type="p">Vfb2:第二回授訊號</p>
        <p type="p">Vin:輸入電壓</p>
        <p type="p">Vm:中繼電壓</p>
        <p type="p">Vout1:第一輸出電壓</p>
        <p type="p">Vout2:第二輸出電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="608" publication-number="202616557">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616557</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106321</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>天線自動定位結構</chinese-title>
        <english-title>ANTENNA AUTOMATIC POSITIONING STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250304B">H01Q1/12</main-classification>
        <further-classification edition="200601120250304B">H01Q3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>昆山聯滔電子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANTO ELECTRONIC LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古峻瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KU, CHUN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許宗驥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHUNG-GI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種天線自動定位結構，其設置於柱體，天線自動定位結構包括：第一驅動組件、移動組件、天線組件與第二驅動組件。第一驅動組件設置於柱體的側面。移動組件設置於第一驅動組件上，第一驅動組件帶動移動組件相對於沿著柱體的側面水平轉動。天線組件樞接設置於第一移動件。第二驅動組件設置於移動組件與天線組件的樞接處，第二驅動組件帶動天線組件相對於移動組件向上仰角轉動或向下俯角轉動，其中天線組件更包括感應器與控制器，感應器電性連接控制器，控制器分別電性連接於第一驅動組件與第二驅動組件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses an antenna automatic positioning structure, which is disposed on a column. The antenna automatic positioning structure comprises: a first driving component, a moving component, an antenna component and a second driving component. The first driving component is disposed on a side of the column. The moving component is disposed on the first driving component, and the first driving component drives the moving component to rotate horizontally relative to the side along the column. The antenna component is pivotally disposed on the first moving piece. The second driving component is disposed at a pivot joint between the moving component and the antenna component. The second driving component drives the antenna component to rotate upward or downward relative to the moving component. The antenna component further comprises a sensor and a controller. The sensor is electrically connected to the controller. The controller is electrically connected to the first driving component and the second driving component respectively.        &lt;br/&gt;​      </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:天線自動定位結構</p>
        <p type="p">2:柱體</p>
        <p type="p">11:第一驅動組件</p>
        <p type="p">12:移動組件</p>
        <p type="p">13:天線組件</p>
        <p type="p">14:第二驅動組件</p>
        <p type="p">111:驅動軌道</p>
        <p type="p">112:第一連動杆</p>
        <p type="p">113:第一驅動件</p>
        <p type="p">121:第一移動件</p>
        <p type="p">122:第二移動件</p>
        <p type="p">123:第三移動件</p>
        <p type="p">133:天線本體</p>
        <p type="p">134:天線組裝件</p>
        <p type="p">141:第二驅動件</p>
        <p type="p">152:第三連動杆</p>
        <p type="p">1210:組裝孔</p>
        <p type="p">1221:平面部</p>
        <p type="p">1222:組裝部</p>
        <p type="p">1231:轉動面部</p>
        <p type="p">1232:連接部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="609" publication-number="202616832">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616832</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106330</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體元件與半導體電感結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND SEMICONDUCTOR INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251110B">H10D1/20</main-classification>
        <further-classification edition="202501120251110B">H10D62/10</further-classification>
        <further-classification edition="202501120251110B">H10D64/20</further-classification>
        <further-classification edition="200601120251110B">H01L21/768</further-classification>
        <further-classification edition="200601120251110B">H01L21/76</further-classification>
        <further-classification edition="200601120251110B">H01L23/535</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁磐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JEN-PAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃嘉銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIA-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露揭示了一半導體元件與其製造方法。該製造方法包含在基板上形成具有源極、汲極與閘極的電晶體，在基板上形成被配置為源極、汲極與閘極提供電連接的互聯層，該互連層包含設置在介電材料層內的金屬材料的區域，該互連層包含具有金屬材料的第一螺旋狀區域與金屬材料靠近第一螺旋狀區域的第二螺旋狀區域的電感結構以提供在第一螺旋狀區域與第二螺旋狀區域之間的電感，以及在基板上的互聯層內形成第一導通孔與第二導通孔，第一導通孔將第一螺旋狀區域電連接到基板上的第一區域，第二導通孔將第二螺旋狀區域電連接到基板上的第二區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Semiconductor devices and fabrication methods are disclosed. A fabrication method involves forming, on a substrate, a transistor comprising a source, drain, and gate, forming, on the substrate, an interconnect layer configured to provide electrical connections for the source, drain, and gate, the interconnect layer comprising regions of metal material disposed within a layer of dielectric material, wherein the interconnect layer includes an inductor structure including a first spiral-shaped region of the metal material and a second spiral-shaped region of the metal material proximate the first spiral-shaped region to provide an inductance between the first spiral-shaped region and the second spiral-shaped region, and forming, on the substrate, within the interconnect layer, a first via that electrically connects the first spiral-shaped region to a first region on the substrate and a second via that electrically connects the second spiral-shaped region to a second region on the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:電感結構</p>
        <p type="p">202:基板</p>
        <p type="p">204,206:導電結構</p>
        <p type="p">205,207:連接區域</p>
        <p type="p">208:間隔距離</p>
        <p type="p">209:介入部分</p>
        <p type="p">210:共同點/中心點</p>
        <p type="p">212:軸線</p>
        <p type="p">214:內端</p>
        <p type="p">216:內端</p>
        <p type="p">218:橫向寬度</p>
        <p type="p">219:節距尺寸</p>
        <p type="p">220:絕緣材料</p>
        <p type="p">224:外端</p>
        <p type="p">226:外端</p>
        <p type="p">3-3:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="610" publication-number="202616128">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616128</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106344</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及產生半導體裝置布局計劃的方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF GENERATING LAYOUT PLAN FOR SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250701B">G06F30/39</main-classification>
        <further-classification edition="200601120250701B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊惠中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHUANG, HUI-ZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江宏禮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, HUNG-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林威呈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾健庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TZENG, JIANN-TYNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">實施例的半導體裝置包括第一電路單元和第二電路單元，第二電路單元在兩者之間的單元邊界處與第一電路單元相鄰。第一電路單元包括第一金屬化層的第一金屬線區域中的第一一個或多個導電線，並包括第一金屬化層下方的第一一個或多個通孔結構。第二電路單元包括第一金屬化層的第二金屬線區域中的第二一個或多個導電線，並包括第一金屬化層下方的第二一個或多個通孔結構。第一金屬線區域和第二金屬線區域被沿著單元邊界延伸的共享空間分開。第一一個或多個通孔結構和第二一個或多個通孔結構位於沿著單元邊界具有鋸齒狀圖案的區域內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An embodiment semiconductor device includes a first circuit cell and a second circuit cell abutting the first circuit cell at a cell boundary therebetween. The first circuit cell includes first one or more conductive lines in a first metallization line region of a first metallization layer and includes first one or more via structures under the first metallization layer. The second circuit cell includes second one or more conductive lines in a second metallization line region of the first metallization layer and includes second one or more via structures under the first metallization layer. The first metallization line region and the second metallization line region are spaced apart by a shared space extending along the cell boundary. The first one or more via structures and the second one or more via structures are within an area having a zig-zag pattern along the cell boundary.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">110:電路巨集</p>
        <p type="p">112、114、116:電路單元</p>
        <p type="p">H1、H2、H3:單元高度</p>
        <p type="p">X、Y:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="611" publication-number="202616416">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616416</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106356</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黏性膠帶施加系統及將黏性膠帶施加至工件的方法</chinese-title>
        <english-title>ADHESIVE TAPE APPLICATION SYSTEM AND METHOD OF APPLYING ADHESIVE TAPE TO WORKPIECE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251230B">H01L21/67</main-classification>
        <further-classification edition="200601120251230B">B65H35/00</further-classification>
        <further-classification edition="200601120251230B">B32B37/15</further-classification>
        <further-classification edition="201801120251230B">C09J7/38</further-classification>
        <further-classification edition="200601120251230B">C09J133/08</further-classification>
        <further-classification edition="200601120251230B">B29C35/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余安棣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, AN-DIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林文益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王郁盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YU-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳承軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHENG-XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒　志華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZOU, ZHIHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種黏性膠帶施加系統，包括黏性膠帶分配器、層壓單元以及光處理裝置，黏性膠帶分配器配置以分配黏性膠帶，層壓單元配置以將黏性膠帶層壓在工件上，光處理裝置在黏性膠帶分配器以及層壓單元之間，且配置以對黏性膠帶執行光處理，以調節黏性膠帶的黏著強度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An adhesive tape application system includes an adhesive tape dispenser configured to dispense adhesive tape, a laminating unit configured to laminate the adhesive tape on a workpiece, and a photo-treatment device between the adhesive tape dispenser and the laminating unit and configured to perform photo-treatment of the adhesive tape to tune an adhesive strength of the adhesive tape.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:黏性膠帶</p>
        <p type="p">10a:遠端部分</p>
        <p type="p">102:黏性膠帶分配器/膠帶供應卷</p>
        <p type="p">11:工件台</p>
        <p type="p">12:層壓單元</p>
        <p type="p">12a:層壓滾筒/滾筒</p>
        <p type="p">2:膠帶供應卷</p>
        <p type="p">20:工件</p>
        <p type="p">30:光處理裝置</p>
        <p type="p">31:光源</p>
        <p type="p">50:黏性膠帶施加系統</p>
        <p type="p">6:張力桿</p>
        <p type="p">D1:距離</p>
        <p type="p">D2:光到膠帶距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="612" publication-number="202615637">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615637</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106685</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抑制生物油與鋼容器接觸致使催化劑中毒之方法</chinese-title>
        <english-title>METHOD FOR SUPPRESSING CATALYST POISONING BY BIO-OILS IN CONTACT WITH STEEL CONTAINMENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C10L1/188</main-classification>
        <further-classification edition="200601120260102B">C10L1/22</further-classification>
        <further-classification edition="200601120260102B">C10L10/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴斯夫歐洲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈格　莫妮卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAAG, MONICA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希伯　吉斯拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIEBER, GISELA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮拉斯基　奧立佛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PILARSKI, OLIVER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波爾　賽巴斯蒂安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POHL, SEBASTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝姆　羅曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEM, ROMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈克　馬蒂亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAAKE, MATHIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲恩　馬提亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FEYEN, MATHIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍爾斯曼　菲立克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUELSMANN, FELIX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華格納　約亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAGNER, JOCHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>路特爾　菲力</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUETHER, FEELLY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及包含至少一種催化劑中毒抑制劑之生物油、生物油之混合物及摻合物，其中催化劑中毒抑制劑選自兩親化合物，該兩親化合物包含至少一種選自C&lt;sub&gt;6&lt;/sub&gt;至C&lt;sub&gt;26&lt;/sub&gt;烷基及/或伸烷基之非極性殘基及至少一種極性殘基，該至少一種極性殘基包含至少一個氮原子。&lt;br/&gt;本發明進一步涉及一種用於在熱製程期間抑制催化劑中毒及/或結垢之方法，以及一種選自兩親化合物之催化劑中毒抑制劑之用途，該兩親化合物包含至少一個選自C&lt;sub&gt;6&lt;/sub&gt;至C&lt;sub&gt;26&lt;/sub&gt;烷基及/或伸烷基之非極性殘基及至少一個極性殘基，該至少一個極性殘基包含至少一個氮原子或氧原子。在至少一種催化劑中毒抑制劑存在下，減少在生物油及此類生物油之混合物/摻合物之純化、升級及/或轉化所用之熱製程期間之非均相催化劑之中毒及/或結垢。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention concerns bio-oils, mixtures, and blends of bio-oils comprising at least one catalyst poisoning suppressant, wherein the catalyst poisoning suppressant is selected from amphiphilic compounds, the amphiphilic compounds comprising at least one nonpolar residue selected from C&lt;sub&gt;6&lt;/sub&gt;to C&lt;sub&gt;26&lt;/sub&gt;alkyl and/or alkylene and at least one polar residue, the at least one polar residue comprising at least one nitrogen atom.&lt;br/&gt;The invention further concerns a method for suppressing catalyst poisoning and/or fouling during thermal processes and the use of catalyst poisoning suppressants selected from amphiphilic compounds, the amphiphilic compounds comprising at least one nonpolar residue selected from C&lt;sub&gt;6&lt;/sub&gt;to C&lt;sub&gt;26&lt;/sub&gt;alkyl and/or alkylene and at least one polar residue, the at least one polar residue comprising at least one nitrogen or oxygen atom. The poisoning of heterogeneous catalysts and/or fouling during thermal processes used in the purification, upgrading, and/or conversion of bio-oils and mixtures/blends of such bio-oils is reduced in the presence of at least one catalyst poisoning suppressant.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="613" publication-number="202616489">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616489</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106781</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路封裝及其形成之方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT PACKAGES AND FORMING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251027B">H01L23/29</main-classification>
        <further-classification edition="200601120251027B">H01L23/58</further-classification>
        <further-classification edition="200601120251027B">H01L23/52</further-classification>
        <further-classification edition="200601120251027B">H01L21/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳承先</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHEN-SHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳旭賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊曜群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, YAO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JYUN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種積體電路封裝及其形成方法。積體電路封裝可包含積體電路晶粒以及在積體電路晶粒的側壁上的介電材料。積體電路晶粒可包含基材、在基材中的保護結構、在基材上的互連結構以及在互連結構中與保護結構接觸的密封環結構。保護結構與基材可包含相同半導體材料，且保護結構可包含第一摻雜物與不同於第一摻雜物的第二摻雜物。互連結構可包含介電層與在介電層中的導電性特徵。密封環結構可在由上而下的視角中圍繞互連結構的導電性特徵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated circuit package and the method of forming the same are provided. The integrated circuit package may include an integrated circuit die and a dielectric material on sidewalls of the integrated circuit die. The integrated circuit die may include a substrate, a protective structure in the substrate, an interconnect structure on the substrate, and a seal ring structure in the interconnect structure and in contact with the protective structure. The protective structure and the substrate may include a same semiconductor material, and the protective structure may include a first dopant and a second dopant different from the first dopant. The interconnect structure may include dielectric layers and conductive features in the dielectric layers. The seal ring structure may encircle the conductive features of the interconnect structure in a top-down view.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:積體電路晶粒</p>
        <p type="p">51:保護結構</p>
        <p type="p">51A:第一部位</p>
        <p type="p">51B:第二部位</p>
        <p type="p">52:晶片/基材</p>
        <p type="p">54:互連結構</p>
        <p type="p">54A,56:介電層</p>
        <p type="p">54B:導電性特徵</p>
        <p type="p">55:密封環結構</p>
        <p type="p">58:晶粒連接器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="614" publication-number="202616286">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616286</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106787</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體電路及操作方法及資料儲存的系統</chinese-title>
        <english-title>MEMORY CIRCUIT AND OPERATING SYTEM THEREOF AND SYSTEM FOR DATA STORAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">G11C11/417</main-classification>
        <further-classification edition="200601120251103B">G11C7/06</further-classification>
        <further-classification edition="200601120251103B">G11C7/12</further-classification>
        <further-classification edition="200601120251103B">G11C7/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原拓実</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARA, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>横山佳巧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOYAMA, YOSHISATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供具有多個追蹤單元的多個記憶體電路。一記憶體電路包含一記憶體陣列，包括複數個第一記憶體單元。該記憶體電路包含一追蹤行，包括一或多個第二記憶體單元。該些第二記憶體單元中的每一者耦接至安置在一基板的一第一側上的一第一金屬化層及安置在該基板的一第二側上的一第二金屬化層，該第二側與該第一側相對。該第二金屬化層用以自該些第二記憶體單元接收一記憶體節點的一內部節點的一位準。該第一金屬化層用以向該些第二記憶體單元提供至少一個供應電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Memory circuits with tracking cells are provided. A memory circuit includes a memory array comprising a plurality of first memory cells. The memory circuit includes a tracking column comprising one or more second memory cells. Each of the second memory cells is coupled to a first metallization layer disposed on a first side of a substrate and a second metallization layer disposed on a second side of the substrate, the second side opposite to the first side. The second metallization layer is configured to receive, from the second memory cells, a level of an internal node of a memory node. The first metallization layer is configured to provide, to the second memory cells, at least one supply voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:記憶體裝置</p>
        <p type="p">105:記憶體控制器</p>
        <p type="p">107:輸入/輸出電路</p>
        <p type="p">120:記憶體陣列</p>
        <p type="p">125:記憶體單元</p>
        <p type="p">130:追蹤行</p>
        <p type="p">135:追蹤單元</p>
        <p type="p">140:虛設單元</p>
        <p type="p">145:追蹤字元線</p>
        <p type="p">150:追蹤位元線</p>
        <p type="p">160:寫入驅動器</p>
        <p type="p">BL0~BLk:位元線</p>
        <p type="p">WL0~WLJ:字元線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="615" publication-number="202616842">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616842</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106963</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置、電子元件、pH感測器、生物感測器、以及半導體裝置的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260107B">H10D30/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼康股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岸梅工</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISHIUME, TSUKASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中積誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAZUMI, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置，具有設置於基板上的底部閘極型的電晶體，其中所述電晶體具有：閘極電極；氧化物半導體層，介隔閘極絕緣層而位於所述閘極電極上；蝕刻停止層，在所述氧化物半導體層上與其相接觸地形成，包含環烯烴聚合物；以及源極電極及汲極電極，在所述蝕刻停止層上與其相接觸地形成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體裝置</p>
        <p type="p">11:基板</p>
        <p type="p">12:閘極電極</p>
        <p type="p">13:閘極絕緣層</p>
        <p type="p">14:氧化物半導體層</p>
        <p type="p">15:絕緣層</p>
        <p type="p">15a:蝕刻停止層</p>
        <p type="p">15b:第一絕緣層</p>
        <p type="p">15c:第二絕緣層</p>
        <p type="p">16:源極電極</p>
        <p type="p">17:汲極電極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="616" publication-number="202615763">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615763</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107160</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防止錯位鬆動的吊掛機構及其卡接螺桿與加工方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">E05D13/00</main-classification>
        <further-classification edition="200601120260115B">E05D15/06</further-classification>
        <further-classification edition="200601120260115B">E06B3/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳崇堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TSUNG-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐傑宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIEH-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳崇堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TSUNG-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種防止錯位鬆動的吊掛機構及其卡接螺桿與加工方法，該吊掛機構包含固定座模組、安裝在固定座模組中的兩卡扣模組與擋靠模組，及卡接螺桿。每一卡扣模組包括恆被往另一卡扣模組方向彈性頂推的卡扣件。該卡接螺桿的卡接段具有二徑向相對且上下直立貫穿的止轉槽。當該卡接段往下插入該固定座模組時，卡接螺桿能以該等止轉槽分別供該等卡扣件之兩個直立突伸的卡嵌部徑向嵌卡。透過該等卡嵌部與該等止轉槽間以垂直面相靠抵限位的結構設計，能大幅提高卡接螺桿的止轉效果，防止錯位鬆動，確實可改善現有吊掛機構之螺桿容易振動產生旋轉的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">41:卡扣件</p>
        <p type="p">411:扣片部</p>
        <p type="p">412:嵌槽</p>
        <p type="p">413:撥塊部</p>
        <p type="p">414:卡嵌部</p>
        <p type="p">415:擋止面</p>
        <p type="p">6:卡接螺桿</p>
        <p type="p">61:卡接段</p>
        <p type="p">611:插卡槽</p>
        <p type="p">612:止轉槽</p>
        <p type="p">613:頸部</p>
        <p type="p">614:遮擋部</p>
        <p type="p">615:止轉部</p>
        <p type="p">616:止轉槽面</p>
        <p type="p">62:螺接段</p>
        <p type="p">R3:外圓角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="617" publication-number="202615527">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615527</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107380</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>馬來醯亞胺樹脂固形物、馬來醯亞胺樹脂固形物之製造方法、馬來醯亞胺樹脂組成物及其硬化物</chinese-title>
        <english-title>MALEIMIDE RESION SOLID, METHOD FOR PRODUCING MALEIMIDE RESIN SOLID, MALEIMIDE RESIN COMPOISTION, AND CURED PRODUCT THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08G12/40</main-classification>
        <further-classification edition="200601120260102B">C08G61/02</further-classification>
        <further-classification edition="200601120260102B">C08K5/00</further-classification>
        <further-classification edition="200601120260102B">C08L35/00</further-classification>
        <further-classification edition="200601120260102B">C08L79/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本化藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON KAYAKU KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村謙吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, KENGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舘野将輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TATENO, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>入澤禅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRISAWA, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関允諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKI, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本伴理</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, BANRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今岡大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAOKA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武藤正嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUTO, MASAYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>口石大貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUCHIISHI, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供對溶劑之溶解性優異之具有馬來醯亞胺基之平均數為2~20之重複單元之酚醛清漆型馬來醯亞胺樹脂固形物及其製造方法。一種酚醛清漆型馬來醯亞胺樹脂固形物，係含有具有馬來醯亞胺基之平均數為2~20之重複單元之酚醛清漆型馬來醯亞胺樹脂及溶劑A，前述溶劑A之含量為100ppm以上30000ppm以下，前述溶劑A之希德布朗溶解度參數為12.0以上18.0以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a novolac-type maleimide resin solid having a repeating unit in which the average number of maleimide groups is 2 to 20, which has excellent solubility in a solvent, and a method for producing the same. A novolac-type maleimide resin solid containing a novolac-type maleimide resin having a repeating unit in which the average number of maleimide groups is 2 to 20, and a solvent A, the content of the solvent A being 100 ppm or more and 30,000 ppm or less, and the Hildebrand solubility parameter of the solvent A being 12.0 or more and 18.0 or less.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="618" publication-number="202615523">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615523</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107445</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性組成物、感光性膜、底層膜、具有相分離構造之構造體之製造方法，及化合物</chinese-title>
        <english-title>PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE FILM, LOWER LAYER FILM, METHOD FOR PRODUCING STRUCTURE HAVING PHASE-SEPARATED STRUCTURE, AND COMPOUND</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F297/02</main-classification>
        <further-classification edition="200601120260102B">C08G63/00</further-classification>
        <further-classification edition="200601120260102B">C08G63/08</further-classification>
        <further-classification edition="200601120260102B">C08G63/91</further-classification>
        <further-classification edition="200601120260102B">C09D153/00</further-classification>
        <further-classification edition="200601120260102B">G03F7/00</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/09</further-classification>
        <further-classification edition="200601120260102B">G03F7/11</further-classification>
        <further-classification edition="200601120260102B">G03F7/40</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
        <further-classification edition="201101120260102B">B82Y30/00</further-classification>
        <further-classification edition="201101120260102B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅原𨺓太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGAWARA, RYUTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小北悠暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKITA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上原卓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEHARA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀬下武広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SESHIMO, TAKEHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太宰尚宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAZAI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 提供即使在曝光量或後烘烤溫度為低之條件下，藉由曝光仍能使膜表面之極性產生變化之感光性組成物、感光性膜、底層膜、包含相分離構造之構造體之製造方法，及化合物。&lt;br/&gt;[解決手段] 一種感光性組成物，其包含：酸分解性化合物(A)與光酸產生劑(B)，且酸分解性化合物(A)為下述式(A1)~(A4)之任一式所示之1種以上之化合物。&lt;br/&gt;&lt;img align="absmiddle" height="185px" width="633px" file="ed10057.JPG" alt="ed10057.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="619" publication-number="202616314">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616314</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107690</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電容結構及其製造方法</chinese-title>
        <english-title>CAPACITOR STRUCTURE AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250508B">H01G11/34</main-classification>
        <further-classification edition="201301120250508B">H01G11/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方偉權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, WEI-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請揭露一種電容結構及其製作方法。此電容結構包括：一第一電極，包括碳奈米管；一第二電極，包括石墨烯及氧化釩；一隔離膜，分隔該第一電極與該第二電極；以及一第一型電解質，圍繞該第一電極、該第二電極及該隔離膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application discloses a capacitor structure and a method for fabricating the capacitor structure. The capacitor structure includes a first electrode including carbonn anotubes; a second electrode including graphene and vanadiumoxide; a separator separating the first electrode and the second electrode; and a first type electrolyte surrounding the first electrode, the second electrode, and the separator.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:電容結構</p>
        <p type="p">110:第一電極</p>
        <p type="p">120:第一導電集極</p>
        <p type="p">210:第二電極</p>
        <p type="p">220:第二導電集極</p>
        <p type="p">310:隔離膜</p>
        <p type="p">410:第一型電解質</p>
        <p type="p">610:殼體</p>
        <p type="p">D1:尺寸</p>
        <p type="p">D2:尺寸</p>
        <p type="p">D3:尺寸</p>
        <p type="p">D4:尺寸</p>
        <p type="p">D5:尺寸</p>
        <p type="p">Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="620" publication-number="202615572">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615572</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107693</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合粒子及其製造方法</chinese-title>
        <english-title>COMPOSITE PARTICLES AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08L1/04</main-classification>
        <further-classification edition="200601120260102B">C08K3/22</further-classification>
        <further-classification edition="200601120260102B">C08K5/353</further-classification>
        <further-classification edition="200601120260102B">C08J3/12</further-classification>
        <further-classification edition="200601120260102B">G01N33/53</further-classification>
        <further-classification edition="200601120260102B">G01N33/543</further-classification>
        <further-classification edition="200601120260102B">G01N33/548</further-classification>
        <further-classification edition="201101120260102B">B82Y30/00</further-classification>
        <further-classification edition="201101120260102B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商第一工業製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DKS CO. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邊真衣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, MAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本恒平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供可簡易導入蛋白質等含羧基之化合物的纖維素奈米纖維及磁性體粒子的複合粒子。&lt;br/&gt;本發明之實施型態的複合粒子，係包含纖維素奈米纖維及磁性體粒子的複合粒子，其中前述纖維素奈米纖維具有下述通式(1)表示之基。式(1)中的R&lt;sup&gt;1&lt;/sup&gt;表示單鍵或碳數1至10的二價脂肪族基。&lt;br/&gt;&lt;img align="absmiddle" height="100px" width="307px" file="ed10007.JPG" alt="ed10007.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are composite particles of cellulose nanofibers and magnetic particles, into which carboxyl group-containing compounds such as proteins can be easily introduced.&lt;br/&gt;The composite particles according to the embodiment are composite particles including cellulose nanofibers and magnetic particles, wherein the cellulose nanofibers have a group represented by the following general formula (1). In formula (1), R&lt;sup&gt;1&lt;/sup&gt;represents a single bond or a divalent aliphatic group having 1 to 10 carbon atoms.&lt;br/&gt;&lt;img align="absmiddle" height="110px" width="297px" file="ed10008.JPG" alt="ed10008.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="621" publication-number="202615573">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615573</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107718</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合粒子及其製造方法</chinese-title>
        <english-title>COMPOSITE PARTICLE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08L1/04</main-classification>
        <further-classification edition="200601120260102B">C08K3/22</further-classification>
        <further-classification edition="200601120260102B">C08K5/353</further-classification>
        <further-classification edition="200601120260102B">C08J3/12</further-classification>
        <further-classification edition="200601120260102B">G01N33/53</further-classification>
        <further-classification edition="200601120260102B">G01N33/543</further-classification>
        <further-classification edition="200601120260102B">G01N33/548</further-classification>
        <further-classification edition="201101120260102B">B82Y30/00</further-classification>
        <further-classification edition="201101120260102B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商第一工業製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DKS CO. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邊真衣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, MAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本恒平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供可簡易導入蛋白質等含胺基之化合物的纖維素奈米纖維及磁性體粒子的複合粒子。&lt;br/&gt;本發明之實施型態的複合粒子，係包含纖維素奈米纖維及磁性體粒子的複合粒子，其中前述纖維素奈米纖維具有活性酯基。亦可藉由使含胺基之生物素或蛋白質等含胺基之化合物的胺基與前述活性酯基反應而將含胺基之化合物導入複合粒子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a composite particle formed of cellulose nanofibers and magnetic particles into which amino group-containing compounds such as proteins can be easily introduced.&lt;br/&gt;The composite particle according to the embodiment is a composite particle including cellulose nanofibers and magnetic particles, wherein the cellulose nanofiber has an active ester group. An amino group-containing compound may be introduced into the composite particle by reacting the amino group of the amino group-containing compound, such as amino group-containing biotin or a protein, with the active ester group.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="622" publication-number="202616741">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616741</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107743</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>環境物聯網（ＩＯＴ）與電子貨架標籤（ＥＳＬ）共存</chinese-title>
        <english-title>AMBIENT INTERNET OF THINGS (IOT) COEXISTENCE WITH ELECTRONIC SHELF LABEL (ESL)</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260102B">H04W4/021</main-classification>
        <further-classification edition="201801120260102B">H04W4/35</further-classification>
        <further-classification edition="201801120260102B">H04W4/38</further-classification>
        <further-classification edition="201801120260102B">H04W4/80</further-classification>
        <further-classification edition="200901120260102B">H04W48/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤維爾　艾哈邁德　阿卜杜拉齊茲　易卜拉欣　阿卜杜拉齊茲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZEWAIL, AHMED ABDELAZIZ IBRAHIM ABDELAZIZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>EG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　志飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, ZHIFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　成錦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHENGJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海登　羅賓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEYDON, ROBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林斯基　喬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINSKY, JOEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了用於無線通信的系統和技術。例如，過程可以包括測量來自第二無線系統的第二設備的第一廣告信標的信號強度；將第一廣告信標的信號強度與閾值信號強度進行比較；基於第一廣告信標的信號強度與閾值信號強度的比較來確定第二無線系統的延遲時段；以及基於所確定的延遲時段輸出用於傳輸的第二廣告信標。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and techniques are provided for wireless communication. For example, a process can include measuring a signal strength of a first advertisement beacon from a second device of a second wireless system; comparing the signal strength of the first advertisement beacon to a threshold signal strength; determining a delay period for the second wireless system based on the comparison of the signal strength of the first advertisement beacon to a threshold signal strength; and outputting a second advertisement beacon for transmission based on the determined delay period.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:信號定時</p>
        <p type="p">702:激勵器</p>
        <p type="p">704:電子貨架標籤(ESL)系統</p>
        <p type="p">706:廣告封包傳輸</p>
        <p type="p">708:上行鏈路(UL)傳輸</p>
        <p type="p">710:週期性廣告響應時槽延遲</p>
        <p type="p">712:喚醒信號UL傳輸</p>
        <p type="p">714:上行鏈路(UL)響應</p>
        <p type="p">716:能量收集設備</p>
        <p type="p">718:電子貨架標籤(ESL)存取點(AP)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="623" publication-number="202616225">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616225</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107793</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於多模式成像之視覺基礎模型</chinese-title>
        <english-title>VISION FOUNDATION MODEL FOR MULTIMODE IMAGING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260109B">G06V10/77</main-classification>
        <further-classification edition="201701120260109B">G06T7/00</further-classification>
        <further-classification edition="202201120260109B">G06V10/26</further-classification>
        <further-classification edition="202201120260109B">G06V10/764</further-classification>
        <further-classification edition="202201120260109B">G06V10/774</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張晶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董　宇杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONG, YUJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴　相奉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SANGBONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬杜里　阿提庫爾　拉赫曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOWDHURY, ATIQUR RAHMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BD</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於判定一樣品之資訊之方法及系統。一個系統包含一電腦系統及由該電腦系統執行之一或多個組件。該一或多個組件包含一預訓練視覺基礎模型(VFM)，其經組態用於經由連續預訓練將一樣品之多個影像投射至高維嵌入。該多個影像包含使用一成像系統之一或多種模式為該樣品產生之一影像。該一或多個組件亦包含經組態用於自該等高維嵌入判定該樣品之資訊之一或多個額外組件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and systems for determining information for a specimen are provided. One system includes a computer system and one or more components executed by the computer system. The one or more components include a pre-trained vision foundation model (VFM) configured for projecting multiple images for a specimen to high dimensional embeddings via continuous pretraining. The multiple images include an image generated for the specimen with one or more modes of an imaging system. The one or more components also include one or more additional components configured for determining information for the specimen from the high dimensional embeddings.</p>
      </isu-abst>
      <representative-img>
        <p type="p">14:樣品</p>
        <p type="p">16:光源</p>
        <p type="p">18:光學元件</p>
        <p type="p">20:透鏡</p>
        <p type="p">22:載物台</p>
        <p type="p">24:收集器</p>
        <p type="p">26:元件</p>
        <p type="p">28:偵測器</p>
        <p type="p">30:收集器</p>
        <p type="p">32:元件</p>
        <p type="p">34:偵測器</p>
        <p type="p">36:電腦系統</p>
        <p type="p">100:成像系統</p>
        <p type="p">102:電腦系統</p>
        <p type="p">104:組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="624" publication-number="202615582">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615582</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107958</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>成形洩漏的推定方法、粒子狀的半導體密封材用樹脂組成物的製造方法及半導體封裝的製造方法</chinese-title>
        <english-title>METHOD FOR ESTIMATING MOLDING LEAKAGE, METHOD FOR PRODUCING PARTICULATE RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251211B">C08L63/02</main-classification>
        <further-classification edition="200601120251211B">C08G59/06</further-classification>
        <further-classification edition="200601120251211B">C08K3/22</further-classification>
        <further-classification edition="200601120251211B">C08K3/36</further-classification>
        <further-classification edition="200601120251211B">H01L23/28</further-classification>
        <further-classification edition="200601120251211B">B29C31/06</further-classification>
        <further-classification edition="200601120251211B">B29C70/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>助川雄太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUKEGAWA, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上村和也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMIMURA, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大久保友裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHKUBO, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臼井広司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USUI, KOUZI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明基於粒子狀的半導體密封材用樹脂組成物的熔融性來簡便地推定壓縮成形時自模具洩漏的程度。對粒子狀的半導體密封材用樹脂組成物一邊於熔融溫度以上的溫度下進行加熱一邊施加剪切力，獲取與所述粒子狀的半導體密封材用樹脂組成物有關的黏度資訊，基於所獲取的黏度資訊來推定壓縮成形時自模具洩漏的程度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The degree of leakage from a mold during compression molding is simply estimated based on the melting property of a particulate resin composition for semiconductor encapsulation. A shear force is applied to the particulate resin composition for semiconductor encapsulation while heating the composition at a temperature equal to or higher than the melting temperature, viscosity information on the particulate resin composition for semiconductor encapsulation is obtained, and the degree of leakage from a mold during compression molding is estimated based on the obtained viscosity information.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="625" publication-number="202615819">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615819</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108079</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在ＧＰＳ無效的環境中使用資訊理論賦能的目標指示器之瞄準裝置與方法</chinese-title>
        <english-title>TARGETING APPARATUS AND METHOD FOR USING INFORMATION-THEORY ENABLED TARGET INDICATORS IN GPS-DENIED ENVIRONMENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">G01C21/16</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坎普森　彼得　喬納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUMPSON, PETER JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坎普森　彼得　喬納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUMPSON, PETER JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">
        &lt;b&gt;使用電腦可讀影像標記的自主瞄準系統&lt;/b&gt;
        &lt;b&gt;
        &lt;/b&gt;
        &lt;br/&gt;本發明提供一套系統，利用多個電腦可讀影像標記(CRIM)和成像裝置，在GPS失效的環境中進行精確的目標定位。CRIM(例如AprilTags)由空中載具部署在目標區域周圍。每個CRIM都包含一個唯一的代碼和一個吸收濕氣來穩定其位置的錨定裝置。高空成像裝置會捕捉CRIM相對於目標的位置，這些資料經過處理後會建立地圖，用於自主導航。攻擊型無人機會使用此地圖，識別未移動的CRIM，以調整航向並準確擊中目標，即使是在有電子反制措施的干擾環境中。此方法利用強大的影像識別功能，可降低計算負載並提高可靠性。此系統可為GPS受損的軍事與人道應用提供符合成本效益的解決方案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        &lt;b&gt;System for Autonomous Targeting Using Computer-Readable Image Markers&lt;/b&gt;
        &lt;br/&gt;The invention provides a system for precise targeting in GPS-denied environments using a plurality of Computer-Readable Image Markers (CRIMs) and imaging devices. CRIMs, such as Apriltags, are deployed around a target area by an aerial vehicle. Each CRIM includes a unique code and an anchor that absorbs moisture to stabilize its position. High-altitude imaging devices capture the CRIMs’ positions relative to the target, and this data is processed to create a map for autonomous navigation. An attack drone uses this map, identifying unmoved CRIMs to adjust its course and engage the target accurately, even in contested environments with electronic countermeasures. The method leverages robust image recognition, reducing computational load and enhancing reliability. The system offers a costeffective solution for military and humanitarian applications where GPS is compromised.</p>
      </isu-abst>
      <representative-img>
        <p type="p">401:無線電接收器</p>
        <p type="p">405:衛星</p>
        <p type="p">410:載人航空器</p>
        <p type="p">415:監視無人機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="626" publication-number="202616749">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616749</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108094</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基站管理系統、基站管理方法和無線網路控制器</chinese-title>
        <english-title>BASE STATION MANAGEMENT SYSTEM, BASE STATION MANAGEMENT METHOD AND RADIO NETWORK CONTROLLER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120250401B">H04W52/02</main-classification>
        <further-classification edition="200901120250401B">H04W24/06</further-classification>
        <further-classification edition="200901120250401B">H04W24/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光寶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佩萱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PEI-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃威創</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEI-CHUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種基站管理系統。基站管理系統可包括複數基站和一無線網路控制器。無線網路控制器可連接上述複數基站。無線網路控制器可定期從每一上述基站，接收一報告，以及根據每一上述基站之報告，判斷是否調整上述複數基站之一或多者進入或離開一節能狀態。上述報告可包括用戶設備資訊和流量資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A base station management system is provided in the invention. The base station management system includes a plurality of base stations and a radio network controller (RNC). The RNC may be connected to the base stations. The RNC may periodically receive a report from each base station, and determine whether to adjust one or more of the base stations to enter or leave a power saving mode according to the report of each base station. The base station may include the user equipment (UE) information and the throughput information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:流程圖</p>
        <p type="p">S510~S520:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="627" publication-number="202616688">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616688</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108101</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種用於校正射頻系統的射頻校正裝置、射頻校正方法及其非暫態電腦可讀取儲存媒體</chinese-title>
        <english-title>AN RF CALIBRATION DEVICE, RF CALIBRATION METHOD AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM THEREOF FOR CALIBRATING RF SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120250401B">H04B17/11</main-classification>
        <further-classification edition="200601120250401B">H04B1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光寶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周俊杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, JIN-JYE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種用於校正射頻系統之射頻校正方法。射頻校正方法包括藉由射頻校正裝置的決策運算模組的邊緣運算處理器將位於決策運算模組的校正資料庫中的對應複數馬可夫狀態的複數校正參數區間組合提供至射頻校正裝置的校正控制模組。射頻校正方法同樣包括藉由射頻校正裝置的校正分析模組接收射頻系統的輸出訊號。射頻校正方法同樣包括校正控制模組透過射頻系統的系統處理器使用複數校正參數區間組合對射頻系統進行校正，直到校正分析模組所接收到的輸出訊號的抑制度大於閾值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention is an RF calibration method for calibrating RF system. The RF calibration method includes providing, by an edge computing processor of a Markov decision computing module of an RF calibration device, multiple calibration parameter range sets, corresponding to multiple Markov states, in a calibration database of the Markov decision computing unit to a calibration control module of the RF calibration device. The RF calibration method also includes receiving, by a calibration analysis module of the RF calibration device, an output signal of the RF system. The RF calibration method also includes the calibration control module using the multiple calibration parameter range sets to calibrate RF system through a system processor of the RF system, until a rejection of the output signal received by the calibration analysis module is greater than a threshold.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:射頻校正裝置</p>
        <p type="p">110:決策運算模組</p>
        <p type="p">111:校正資料庫</p>
        <p type="p">112:邊緣運算處理器</p>
        <p type="p">120:校正控制模組</p>
        <p type="p">130:校正分析模組</p>
        <p type="p">200:射頻系統</p>
        <p type="p">300:雲端系統</p>
        <p type="p">310:雲端資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="628" publication-number="202616819">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616819</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108106</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有覆蓋基底狹槽的堤壩結構的半導體元件</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE WITH DAM STRUCTURE COVERING SLOT OF SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250424B">H10B12/00</main-classification>
        <further-classification edition="200601120250424B">H01L23/31</further-classification>
        <further-classification edition="200601120250424B">H01L21/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊吳德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, WU-DER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種半導體元件及其製備方法。該半導體元件包括一基底、一電子元件、一封裝件及一堤壩結構。該基底具有一下表面和相對於該第下表面的一上表面。該電子元件設置在該基底的該上表面上。該封裝件設置在該基底的該上表面上，且具有貫穿該基底的一部分。該堤壩結構垂直地與該封裝件的該部分重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device and method for manufacturing the same are provided. The semiconductor device includes a substrate, an electronic component, an encapsulant, and a dam structure. The substrate has a lower surface and an upper surface opposite to the first surface. The electronic component is disposed on the upper surface of the substrate. The encapsulant is disposed on the upper surface of the substrate and has a portion penetrating the substrate. The dam structure vertically overlaps the portion of the encapsulant.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:半導體元件</p>
        <p type="p">10:基底</p>
        <p type="p">10s1:表面</p>
        <p type="p">10s2:表面</p>
        <p type="p">20:開口</p>
        <p type="p">30:電子元件</p>
        <p type="p">32:黏著劑</p>
        <p type="p">50:封裝件</p>
        <p type="p">50p1:部分</p>
        <p type="p">60:導線</p>
        <p type="p">70:電子連接器</p>
        <p type="p">X:方向</p>
        <p type="p">Y:方向</p>
        <p type="p">Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="629" publication-number="202616529">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616529</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108350</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有高記憶體頻寬及密度的單一混合系統單晶片（ＳｏＣ）晶粒結構</chinese-title>
        <english-title>SINGLE HYBRID SYSTEM-ON-CHIP (SOC) DIE STRUCTURE WITH HIGH MEMORY BANDWIDTH AND DENSITY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260108B">H01L25/065</main-classification>
        <further-classification edition="200601120260108B">H01L23/373</further-classification>
        <further-classification edition="202301120260108B">H10B80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康　宇泰格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, WOO TAG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　中澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHONGZE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝達羅格魯　默斯塔法</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BADAROGLU, MUSTAFA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曲丹巴瑞　派瑞安南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIDAMBARAM, PERIANNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述一種三維(three-dimensional, 3D)堆疊晶片封裝。該3D堆疊晶片封裝包括一晶粒，該晶粒具有一寬輸入/輸出(input/output, IO)邏輯晶粒區域及一系統單晶片(system-on-chip, SoC)邏輯晶粒區域，該系統單晶片(SoC)邏輯晶粒區域與該寬IO邏輯晶粒區域隔離。該3D堆疊晶片封裝亦包括一記憶體堆疊，該記憶體堆疊在該晶粒之該寬IO邏輯區域上。該3D堆疊晶片封裝進一步包括一封裝基材，該封裝基材支撐該晶粒。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A three-dimensional (3D) stacked chip package is described. The 3D stacked chip package includes a die having a wide input/output (IO) logic die area and a system-on-chip (SoC) logic die area isolated from the wide IO logic die area. The 3D stacked chip package also includes a memory stack on the wide IO logic area of the die. The 3D stacked chip package further includes a package substrate supporting the die.</p>
      </isu-abst>
      <representative-img>
        <p type="p">402:封裝基材</p>
        <p type="p">404:第一微凸塊</p>
        <p type="p">410:貫穿基材通孔(TSV)</p>
        <p type="p">412:第二微凸塊</p>
        <p type="p">420:混合晶粒結構</p>
        <p type="p">430:寬輸入/輸出(IO)邏輯晶粒區域</p>
        <p type="p">440:SoC邏輯晶粒區域</p>
        <p type="p">460:記憶體(MEM)核心堆疊</p>
        <p type="p">480:SoC封裝</p>
        <p type="p">482:虛置熱緩解堆疊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="630" publication-number="202615795">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615795</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108357</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣化器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251008B">F17C9/02</main-classification>
        <further-classification edition="200601120251008B">C23C16/448</further-classification>
        <further-classification edition="200601120251008B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商琳科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINTEC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小野弘文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONO, HIROFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本健太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>八木茂雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAGI, SHIGEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種氣化器(10)，由氣化器本體(20)、球狀體(30)、加熱器(H)所構成。氣化器本體(20)，由：液體原料供給部(12)、供給液體原料(LM)；及氣化部(22)，在內部具有將液體原料(LM)氣化的氣化用空間(K)；及原料氣體排出部(40)，將氣化的原料氣體(VG)朝下一個過程給進所構成。球狀體(30)被充填在氣化部(22)內。加熱器(H)將紅外線放射。加熱器(H)與氣化部(22)隔有間隙(d1)地配置。氣化部(22)及球狀體(30)由紅外線可透過的透明構件所構成。液滯留(E)，被設置在氣化部(22)，且位於比流動於氣化用空間(K)的液體原料(LM)的流路(R)更低的位置，液體原料(LM)可流入。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:氣化器</p>
        <p type="p">12:液體原料供給部</p>
        <p type="p">12b:液體原料供給管</p>
        <p type="p">20:氣化器本體</p>
        <p type="p">21:頂板</p>
        <p type="p">22:氣化部</p>
        <p type="p">22e:彎曲部分</p>
        <p type="p">22f,22g:直管部分</p>
        <p type="p">22h:側壁</p>
        <p type="p">23f,23g:多孔質過濾器</p>
        <p type="p">25:置換氣體供給部</p>
        <p type="p">26:置換氣體排出部</p>
        <p type="p">27:底面板</p>
        <p type="p">28:反射構件</p>
        <p type="p">28k:鏡面</p>
        <p type="p">30:球狀體</p>
        <p type="p">40:原料氣體排出部</p>
        <p type="p">40d:出口</p>
        <p type="p">E:液滯留</p>
        <p type="p">H:加熱器</p>
        <p type="p">K:氣化用空間</p>
        <p type="p">LM:液體原料</p>
        <p type="p">P:空隙</p>
        <p type="p">R:流路</p>
        <p type="p">VG:原料氣體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="631" publication-number="202616668">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616668</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108371</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>時間數位轉換裝置</chinese-title>
        <english-title>TIME-TO-DIGITAL CONVERSION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">H03M1/50</main-classification>
        <further-classification edition="200601120250801B">H03L7/085</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂宗哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, TSUNG-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅敬銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, CHIN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張智賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">時間數位轉換裝置實施例包括配置為響應第一事件輸出第一時脈信號的第一振盪器以及配置為響應第二事件輸出第二時脈信號的第二振盪器。時間數位轉換裝置實施例更包括配置為基於第一時脈信號和第二時脈信號之間相位關係而產生偵測信號的相位偵測器，以及時脈計數器，所述時脈計數器配置為基於第一時脈信號響應偵測信號而產生計數值，所述偵測信號指示第二時脈信號的相位滯後於第一時脈信號的相位。計數值指示第一事件和第二事件之間時間差。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A time-to-digital conversion device embodiment includes a first oscillator configured to output a first clock signal in response to a first event and a second oscillator configured to output a second clock signal in response to a second event. The time-to-digital conversion device embodiment further includes a phase detector configured to generate a detection signal based on a phase relationship between the first clock signal and the second clock signal, and a clock counter configured to generate a count value based on the first clock signal in response to the detection signal indicating that a phase of the second clock signal lags behind a phase of the first clock signal. The count value is indicative of a time difference between the first event and the second event.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:時間數位轉換裝置</p>
        <p type="p">210:第一振盪器</p>
        <p type="p">220:第二振盪器</p>
        <p type="p">230:相位偵測器</p>
        <p type="p">240:時脈計數器</p>
        <p type="p">250:時脈閘控電路</p>
        <p type="p">260:計數器</p>
        <p type="p">START1:第一參考信號</p>
        <p type="p">START2:第二參考信號</p>
        <p type="p">SLOW1:第一減速控制信號</p>
        <p type="p">SLOW2:第二減速控制信號</p>
        <p type="p">CKA_M:第一時脈信號</p>
        <p type="p">CKB_M:第二時脈信號</p>
        <p type="p">HITB:偵測信號</p>
        <p type="p">EN:致能端</p>
        <p type="p">CKC:計數時脈信號</p>
        <p type="p">TDC_OUT:計數值</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="632" publication-number="202615799">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615799</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108518</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用氨的設備</chinese-title>
        <english-title>EQUIPMENT USING AMMONIA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">F23K5/00</main-classification>
        <further-classification edition="200601120260102B">F17D1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＩＨＩ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IHI CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤田美樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJITA, MIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中澤亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAZAWA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野村弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMURA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松井麻有</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUI, MAYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">使用氨的設備100係具備：複數個導管L31、L32、L33、L34、L5、L6，係供氨氣流動；複數個罩蓋20，係覆蓋複數個導管L31、L32、L33、L34、L5、L6，且該複數個罩蓋20之各者係包圍複數個導管L31、L32、L33、L34、L5、L6之限定的區域；及至少一個風扇F，係從複數個罩蓋20抽吸氣體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An equipment 100 using ammonia includes: a plurality of conduits L31, L32, L33, L34, L5 and L6 through which ammonia gas flows; a plurality of covers 20 covering the plurality of conduits L31, L32, L33, L34, L5 and L6, each of the plurality of covers 20 surrounding a limited area of ​​the plurality of conduits L31, L32, L33, L34, L5 and L6; and at least one fan F that draws gas from the plurality of covers 20.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:鍋爐</p>
        <p type="p">11:燃燒器</p>
        <p type="p">20:罩蓋</p>
        <p type="p">40:空間</p>
        <p type="p">50:建築物</p>
        <p type="p">100:設備</p>
        <p type="p">D1:切換風門</p>
        <p type="p">F:風扇</p>
        <p type="p">ga:氨氣</p>
        <p type="p">gv:換氣氣體</p>
        <p type="p">J1:漸縮管(管接頭)</p>
        <p type="p">J2:漸縮管(管接頭)</p>
        <p type="p">J3:凸緣連接(管接頭)</p>
        <p type="p">L1:主導管</p>
        <p type="p">L5:主通氣管(供氨流動的導管)</p>
        <p type="p">L6:通氣管(供氨流動的導管)</p>
        <p type="p">L7:換氣管</p>
        <p type="p">L8:主換氣管</p>
        <p type="p">L21,L22:二次導管</p>
        <p type="p">L31,L32,L33,L34:三次導管(供氨流動的導管)</p>
        <p type="p">L41,L42:四次導管</p>
        <p type="p">S1:第一燃料供給系統</p>
        <p type="p">S2:第二燃料供給系統</p>
        <p type="p">S3:第三燃料供給系統</p>
        <p type="p">S4:第四燃料供給系統</p>
        <p type="p">Se:感測器</p>
        <p type="p">T:撓性管</p>
        <p type="p">V1:第一燃料閥</p>
        <p type="p">V2:第二燃料閥</p>
        <p type="p">V3:主通氣閥</p>
        <p type="p">V4:通氣閥</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="633" publication-number="202616936">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616936</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108548</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置及包含其之電子裝置</chinese-title>
        <english-title>DISPLAY DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">H10K59/131</main-classification>
        <further-classification edition="202301120260102B">H10K59/121</further-classification>
        <further-classification edition="202301120260102B">H10K59/122</further-classification>
        <further-classification edition="202301120260102B">H10K59/123</further-classification>
        <further-classification edition="202301120260102B">H10K59/88</further-classification>
        <further-classification edition="202301120260102B">H10K59/80</further-classification>
        <further-classification edition="202501120260102B">H10H29/30</further-classification>
        <further-classification edition="202501120260102B">H10H29/37</further-classification>
        <further-classification edition="202501120260102B">H10H29/39</further-classification>
        <further-classification edition="202501120260102B">H10H29/80</further-classification>
        <further-classification edition="201601120260102B">G09G3/3208</further-classification>
        <further-classification edition="200601120260102B">G09F9/33</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星顯示器有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金惠琬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYEWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高裕敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, YOOMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金善浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴注燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JUCHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫藝林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SON, YERIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李弼錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, PILSUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔忠碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, CHUNG SOCK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪性珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, SUNGJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置包含一第一像素驅動電路及一第二像素驅動電路、連接至該第一像素驅動電路的一第一連接電極、連接至該第二像素驅動電路的一第二連接電極、設置在該第一連接電極及該第二連接電極上的一第一電極、覆蓋該第一電極的至少一部分並界定一第一發射區域及一第二發射區域的一像素定義層、連接至該第一連接電極並部分地圍繞該第一發射區域的一第一連接圖樣、連接至該第二連接電極並部分地圍繞該第二發射區域的一第二連接圖樣、覆蓋該第一連接圖樣及該第二連接圖樣各自的至少一部分的一分隔件、以及分別連接至該第一連接圖樣及該第二連接圖樣的一電極層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device includes a first pixel driving circuit and a second pixel driving circuit, a first connection electrode connected to the first pixel driving circuit, a second connection electrode connected to the second pixel driving circuit, a first electrode disposed on the first connection electrode and the second connection electrode, a pixel defining layer covering at least a portion of the first electrode and defining a first emission area and a second emission area, a first connection pattern connected to the first connection electrode and partially surrounding the first emission area, a second connection pattern connected to the second connection electrode and partially surrounding the second emission area, a separator covering at least a portion of each of the first connection pattern and the second connection pattern, and an electrode layer connected to each of the first connection pattern and the second connection pattern.</p>
      </isu-abst>
      <representative-img>
        <p type="p">CNa:第一發光連接部</p>
        <p type="p">CNb:第二發光連接部</p>
        <p type="p">CNc:第三發光連接部</p>
        <p type="p">CNPa:第一連接圖樣</p>
        <p type="p">CNPb:第二連接圖樣</p>
        <p type="p">CNPc:第三連接圖樣</p>
        <p type="p">EAa:第一發射區域</p>
        <p type="p">EAb:第二發射區域</p>
        <p type="p">EAc:第三發射區域</p>
        <p type="p">PDL:像素定義層</p>
        <p type="p">UEA1:第一單元發射區域</p>
        <p type="p">UEA2:第二單元發射區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="634" publication-number="202615951">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615951</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108824</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及其驅動方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND DRIVING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250624B">G02F1/13357</main-classification>
        <further-classification edition="202001120250624B">H05B45/10</further-classification>
        <further-classification edition="200601120250624B">G02B6/00</further-classification>
        <further-classification edition="200601120250624B">G09G5/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林承澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHENG-ZE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝宏昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, HONG-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝志勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHIH-YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董冠廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG, KUAN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇建太</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電子裝置及其驅動方法。電子裝置的驅動方法包含：提供一電子裝置，包含一面板、一可分區驅動的背光模組和一可調控隱私元件，其中，可分區驅動的背光模組具有一分區調光功能，且可調控隱私元件用以切換一隱私模式或一分享模式；以及提供一偵測器，用以偵測一環境光亮度或電子裝置的對比；其中，當可調控隱私元件切換至分享模式時，可分區驅動的背光模組開啟分區調光功能，其中，當可調控隱私元件切換至隱私模式時，可分區驅動的背光模組根據偵測器所偵測到的環境光亮度或電子裝置的對比來開啟或關閉分區調光功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device and a driving method thereof are provided. The driving method of the electronic device comprises: providing an electronic device comprising a panel, a backlight module that can be driven by partition and an adjustable privacy element, wherein the backlight module has a local dimming function, and the adjustable privacy element is used to switch a privacy mode or a sharing mode; and providing a detector for detecting a brightness of an ambient light or a contrast ratio of the electronic device; wherein when the adjustable privacy element switches to the sharing mode, the backlight module turns on the local dimming function, and when the adjustable privacy element switches to the privacy mode, the backlight module turns on or off the local dimming function based on the brightness of the ambient light or the contrast ratio of the electronic device detected by the detector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子裝置</p>
        <p type="p">1:可分區驅動的背光模組</p>
        <p type="p">2:可調控隱私元件</p>
        <p type="p">21:第一部分</p>
        <p type="p">22:第二部分</p>
        <p type="p">3:面板</p>
        <p type="p">3s1:顯示側</p>
        <p type="p">3s2:非顯示側</p>
        <p type="p">4:偵測器</p>
        <p type="p">5:偏光板</p>
        <p type="p">X、Y:方向</p>
        <p type="p">Z:法線方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="635" publication-number="202616665">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616665</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108968</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子電路及電子機器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H03M1/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼半導體解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>落合保博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OCHIAI, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明抑制因電子電路內部之干涉而引起之誤動作。  &lt;br/&gt;本發明之電子電路具備：類比電路，其形成於半導體晶片；數位電路，其混載於半導體晶片；電流監視電路，其於半導體晶片上監視流動於半導體晶片之電流；及時序調整電路，其基於流動於半導體晶片之電流之波形，調整類比電路或數位電路之至少任一者之動作時序。類比電路亦可具備AD(Analog to Digital)轉換電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體晶片</p>
        <p type="p">110:類比電路</p>
        <p type="p">111:類比信號產生源</p>
        <p type="p">112:AD轉換電路</p>
        <p type="p">113:AD轉換控制電路</p>
        <p type="p">120:數位電路</p>
        <p type="p">121:電流監視電路</p>
        <p type="p">123:數位時序調整電路</p>
        <p type="p">123A,124A:暫存器</p>
        <p type="p">124:AD轉換時序調整電路</p>
        <p type="p">125:數位處理部</p>
        <p type="p">126:輸出介面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="636" publication-number="202616718">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616718</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108986</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>視訊寫碼中的框內空間幾何分割模式與矩陣框內分割模式變換集選擇</chinese-title>
        <english-title>INTRA SPATIAL GEOMETRIC PARTITION MODE AND MATRIX INTRA PARTITION MODE TRANSFORM SET SELECTION IN VIDEO CODING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260107B">H04N19/12</main-classification>
        <further-classification edition="201401120260107B">H04N19/157</further-classification>
        <further-classification edition="201401120260107B">H04N19/176</further-classification>
        <further-classification edition="201401120260107B">H04N19/593</further-classification>
        <further-classification edition="201401120260107B">H04N19/61</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡茲維克茲　馬塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARCZEWICZ, MARTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯本　穆漢麥德　傑德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COBAN, MUHAMMED ZEYD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞瑞金　法迪姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEREGIN, VADIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述實例方法、裝置、及電腦可讀取媒體。一種實例裝置包括一或多個處理器，該一或多個處理器經組態以判定對一目前區塊使用一空間幾何分割模式(SGPM)、及執行一基於Sobel之框內預測方向推導。該一或多個處理器經組態以基於該基於Sobel之框內預測方向推導之一輸出來判定一第一框內預測模式及一第二框內預測模式。該一或多個處理器經組態以基於該第一框內預測模式來判定一第一組變換，及基於該第二框內預測模式來判定一第二組變換。該一或多個處理器經組態以基於該SGPM以及該第一組變換或該第二組變換中之至少一者對該目前區塊進行解碼。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Example methods, devices, and computer-readable media are described. An example device includes one or more processors configured to determine to use a spatial geometric partition mode (SGPM) for a current block and perform a Sobel-based intra prediction direction derivation. The one or more processors are configured to determine a first intra prediction mode and a second intra prediction mode based on an output of the Sobel-based intra prediction direction The one or more processors are configured to determine a first set of transforms based on the first intra prediction mode and determine a second set of transforms based on the second intra prediction mode. The one or more processors are configured to decode the current block based on the SGPM, and at least one of the first set of transforms or the second set of transforms.</p>
      </isu-abst>
      <representative-img>
        <p type="p">250,252,254,256,258,260,262:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="637" publication-number="202615520">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615520</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109067</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚碳二亞胺化合物、樹脂組成物、及樹脂硬化物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F290/06</main-classification>
        <further-classification edition="200601120260102B">C08F299/06</further-classification>
        <further-classification edition="200601120260102B">C08G18/09</further-classification>
        <further-classification edition="200601120260102B">C08G18/48</further-classification>
        <further-classification edition="200601120260102B">C08G18/67</further-classification>
        <further-classification edition="200601120260102B">C08G18/79</further-classification>
        <further-classification edition="200601120260102B">C08G65/48</further-classification>
        <further-classification edition="200601120260102B">C08G81/00</further-classification>
        <further-classification edition="200601120260102B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日清紡化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSHINBO CHEMICAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島真一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKASHIMA, SHINICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤有馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, YUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供可得到介電係數及介電損耗正切低、低介電性優良且與金屬箔的密合性優良之樹脂硬化物的具有以聚苯醚為基礎之結構的聚碳二亞胺化合物、包含其之樹脂組成物及其硬化物。本發明的聚碳二亞胺化合物具有以二異氰酸酯聚合而成之聚碳二亞胺(a)為基礎之結構及以聚苯醚(b)為基礎之結構，該以聚苯醚(b)為基礎之結構相對於該以聚碳二亞胺(a)為基礎之結構的質量比(b/a)為0.20～1.50。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="638" publication-number="202615607">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615607</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109083</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>去除異物用之塗覆膜形成組成物及半導體基板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C09D201/00</main-classification>
        <further-classification edition="201801120260102B">C09D7/20</further-classification>
        <further-classification edition="200601120260102B">C09D5/00</further-classification>
        <further-classification edition="200601120260102B">C09J5/02</further-classification>
        <further-classification edition="200601120260102B">H01L21/02</further-classification>
        <further-classification edition="200601120260102B">H01L21/683</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上林哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMIBAYASHI, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森谷俊介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIYA, SHUNSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岸岡高広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISHIOKA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種去除異物用之塗覆膜形成組成物，其包含水溶性化合物及溶劑，且可形成能藉由水去除之塗覆膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="639" publication-number="202616350">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616350</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109091</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>混合接合方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H01L21/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＸ金屬股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JX ADVANCED METALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人東北大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOHOKU UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倉知明史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURACHI, AKIFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊森徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMORI, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島誉史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, TAKAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種混合接合方法，其係將具備第1接合面之第1接合對象與具備第2接合面之第2接合對象接合之方法，上述第1接合面具有第1介電體部及第1金屬電極部，上述第2接合面具有第2介電體部及第2金屬電極部，上述混合接合方法包括：第1單分子膜形成步驟，係使用pH5.0以下之第1表面處理液於上述第1接合面之上述第1金屬電極部之上形成第1自組裝單分子膜；第2單分子膜形成步驟，係使用pH5.0以下之第2表面處理液於上述第2接合面之上述第2金屬電極部之上形成第2自組裝單分子膜；及加熱步驟，係將上述第1接合對象之上述第1接合面與上述第2接合對象之上述第2接合面重疊並進行加熱。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="640" publication-number="202616277">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616277</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109128</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>延遲鎖定迴路裝置</chinese-title>
        <english-title>DELAY LOCKED LOOP DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">G11C7/12</main-classification>
        <further-classification edition="200601120250501B">G11C11/4076</further-classification>
        <further-classification edition="200601120250501B">H03L7/08</further-classification>
        <further-classification edition="200601120250501B">H03K5/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊吳德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, WU-DER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種延遲鎖定迴路裝置，其包括一接收器、一延遲線、一頻率檢測和控制電路、一相位檢測器、以及一延遲控制電路。該接收器比較一輸入時脈信號和一參考電壓以產生一第一信號，並基於該輸入時脈信號產生一參考時脈信號。該延遲線基於一延遲控制信號延遲該第一信號以產生一第二信號。該頻率檢測和控制電路檢測該參考時脈信號的一工作頻率以產生一啟動信號。該相位檢測器當該啟動信號，檢測該參考時脈信號和一回饋時脈信號之間的一相位差以產生一相位檢測結果。該延遲控制電路用以基於該相位檢測結果產生用於該延遲線的該延遲控制信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A delay locked loop device is provided, which includes a receiver, a delay line, a frequency detection and control circuit, a phase detector, and a delay control circuit. The receiver compares an input clock signal and a reference voltage to generate a first signal, and generate a reference clock signal based on the input clock signal. The delay line delays the first signal to generate a second signal based on a delay control signal. The frequency detection and control circuit detects an operating frequency of the reference clock signal to generate an enable signal. The phase detector detects, in response to the enable signal, a phase difference between the reference clock signal and a feedback clock signal to generate a phase detection result. The delay control circuit is configured to generate the delay control signal for the delay line based on the phase detection result.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:系統</p>
        <p type="p">11:記憶體裝置</p>
        <p type="p">12:信號產生裝置</p>
        <p type="p">13:測量裝置</p>
        <p type="p">14:計算裝置</p>
        <p type="p">15:顯示裝置</p>
        <p type="p">111:輸入信號</p>
        <p type="p">112:輸出信號</p>
        <p type="p">121:第一操作參數</p>
        <p type="p">122:第二操作參數</p>
        <p type="p">123:第三操作參數</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="641" publication-number="202616820">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616820</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109137</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括堆疊多個半導體晶片的電子元件及其製備方法</chinese-title>
        <english-title>ELECTRONIC DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250401B">H10B12/00</main-classification>
        <further-classification edition="202501120250401B">H10D88/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇國輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, KUO-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電子元件及其製備方法。該電子元件包括一第一半導體晶片、一第二半導體晶片、一第三半導體晶片、一第四半導體晶片和一第五半導體晶片。該第二半導體晶片堆疊在該第一半導體晶片上，並藉由混合接合而與該第一半導體晶片電性連接。該第四半導體晶片堆疊在該第三半導體晶片上，並藉由混合接合而與該第三半導體晶片電性連接。該第三半導體晶片堆疊在該第二半導體晶片上，並藉由多個凸塊而與第二半導體晶片電性連接。該第五半導體晶片設置在該第一半導體晶片下方，並經由多個電子連接器而與該第一半導體晶片電性連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device and a manufacturing method are provided. The electronic device includes a first semiconductor chip, a second semiconductor chip, a third semiconductor chip, a fourth semiconductor and a fifth semiconductor chip. The second semiconductor chip is stacked on the first semiconductor chip, and is electrically connected to the first semiconductor chip by hybrid bonding. The fourth semiconductor chip is stacked on the third semiconductor chip, and is electrically connected to the third semiconductor chip by hybrid bonding. The third semiconductor chip is stacked on the second semiconductor chip, and is electrically connected to the second semiconductor chip through a plurality of bumps. The fifth semiconductor chip disposed below the first semiconductor chip, and is electrically connected to the first semiconductor chip through a plurality of electrical connectors.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一半導體晶片</p>
        <p type="p">2:第二半導體晶片</p>
        <p type="p">3:第三半導體晶片</p>
        <p type="p">4:第四半導體晶片</p>
        <p type="p">5:第五半導體晶片</p>
        <p type="p">6:電子元件</p>
        <p type="p">10:第一基部</p>
        <p type="p">11:下表面</p>
        <p type="p">12:上表面</p>
        <p type="p">13:側表面</p>
        <p type="p">14:第一導電結構</p>
        <p type="p">15:第一下結構</p>
        <p type="p">16:第一上結構</p>
        <p type="p">17:第一導電通孔</p>
        <p type="p">18:第一封裝件</p>
        <p type="p">20:第二基部</p>
        <p type="p">21:下表面</p>
        <p type="p">22:上表面</p>
        <p type="p">23:側表面</p>
        <p type="p">24:第二導電結構</p>
        <p type="p">25:第二下結構</p>
        <p type="p">26:第二上結構</p>
        <p type="p">27:第二導電通孔</p>
        <p type="p">30:第三基部</p>
        <p type="p">31:下表面</p>
        <p type="p">32:上表面</p>
        <p type="p">33:側表面</p>
        <p type="p">34:第三導電結構</p>
        <p type="p">35:第三下結構</p>
        <p type="p">36:第三上結構</p>
        <p type="p">37:第三導電通孔</p>
        <p type="p">38:第三封裝件</p>
        <p type="p">40:第四基部</p>
        <p type="p">41:下表面</p>
        <p type="p">42:上表面</p>
        <p type="p">43:側表面</p>
        <p type="p">44:第四導電結構</p>
        <p type="p">45:第四下結構</p>
        <p type="p">50:第五基部</p>
        <p type="p">51:下表面</p>
        <p type="p">53:側表面</p>
        <p type="p">54:第五導電結構</p>
        <p type="p">55:第五下結構</p>
        <p type="p">56:第五上結構</p>
        <p type="p">57:第五導電通孔</p>
        <p type="p">61:凸塊</p>
        <p type="p">62:下填充件</p>
        <p type="p">63:電子連接器</p>
        <p type="p">64:保護材料</p>
        <p type="p">65:外圍封裝件</p>
        <p type="p">66:外部連接器</p>
        <p type="p">71:第一組件</p>
        <p type="p">72:第二組件</p>
        <p type="p">73:第三組件</p>
        <p type="p">101:第一表面</p>
        <p type="p">102:第二表面</p>
        <p type="p">151:第一下介電層</p>
        <p type="p">152:第一下焊墊</p>
        <p type="p">161:第一上介電層</p>
        <p type="p">162:第一上焊墊</p>
        <p type="p">251:第二下介電層</p>
        <p type="p">252:第二下焊墊</p>
        <p type="p">261:第二上介電層</p>
        <p type="p">262:第二上焊墊</p>
        <p type="p">351:第三下介電層</p>
        <p type="p">352:第三下焊墊</p>
        <p type="p">361:第三上介電層</p>
        <p type="p">362:第三上焊墊</p>
        <p type="p">451:第四下介電層</p>
        <p type="p">452:第四下焊墊</p>
        <p type="p">501:第一表面</p>
        <p type="p">502:第二表面</p>
        <p type="p">510:第五晶粒</p>
        <p type="p">511:導線</p>
        <p type="p">513:接觸墊</p>
        <p type="p">551:鈍化層</p>
        <p type="p">552:導電層</p>
        <p type="p">561:第五上介電層</p>
        <p type="p">562:第五上焊墊</p>
        <p type="p">581:第一部分</p>
        <p type="p">582:第二部分</p>
        <p type="p">700:載體結構</p>
        <p type="p">701:載體基底</p>
        <p type="p">701TS:上表面</p>
        <p type="p">705:貫穿半導體通孔</p>
        <p type="p">705TS:上表面</p>
        <p type="p">707:導電板</p>
        <p type="p">709:接合層</p>
        <p type="p">801:中間接合層</p>
        <p type="p">HDU:散熱單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="642" publication-number="202616872">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616872</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109459</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251001B">H10D62/13</main-classification>
        <further-classification edition="202501120251001B">H10D64/23</further-classification>
        <further-classification edition="202501120251001B">H10D64/27</further-classification>
        <further-classification edition="202501120251001B">H10D30/62</further-classification>
        <further-classification edition="202501120251001B">H10D64/01</further-classification>
        <further-classification edition="202501120251001B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊宗翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, TSUNG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡佳澄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHIA-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張榮宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JUNG-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳豪育</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HOU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃禹軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江國誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, KUO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置的第一裝置包含第一突出部，突出於基底上方；第一奈米結構，包含第一半導體材料且設置於第一突出部上方；第一磊晶延伸區，設置於第一奈米結構的第一側壁上；第一閘極結構，包含設置於第一奈米結構與第一突出部之間的第一下部；第一絕緣間隙壁，設置於第一閘極結構的第一下部的第二側壁上；以及第一源極/汲極區，設置相鄰於第一突出部及第一奈米結構的第一側壁，且包含設置於第一磊晶延伸區及第一絕緣間隙壁的側表面上的第一連續半導體層。第一連續半導體層的第二半導體材料的濃度大於第一磊晶延伸區的第二半導體材料的濃度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A first device of a semiconductor device includes a first protrusion protruding over a substrate; a first nanostructure including a first semiconductor material and disposed over the first protrusion; a first epitaxial extension region disposed on a first sidewall of the first nanostructure; a first gate structure including a first lower portion between the first nanostructure and the first protrusion; a first insulating spacer disposed on a second sidewall of the first lower portion of the first gate structure; and a first source/drain region disposed adjacent to the first protrusion and the first sidewall of the first nanostructure. The first source/drain region includes a first continuous semiconductor layer disposed on side surfaces of the first epitaxial extension region and the first insulating spacer. The first continuous semiconductor layer has a higher concentration of the second semiconductor material than the first epitaxial extension region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">100A:p型金屬氧化物半導體區</p>
        <p type="p">101:基底</p>
        <p type="p">110:第一奈米結構</p>
        <p type="p">114:鰭</p>
        <p type="p">134:閘極間隙壁</p>
        <p type="p">150:內部間隙壁</p>
        <p type="p">152:緩衝層</p>
        <p type="p">157A:p型源極/汲極延伸區</p>
        <p type="p">157E:磊晶部件</p>
        <p type="p">158A:p型源極/汲極區</p>
        <p type="p">158A1:第一層</p>
        <p type="p">158A2:第二層</p>
        <p type="p">158A3:第三層</p>
        <p type="p">160:絕緣層</p>
        <p type="p">162:接觸蝕刻停止層</p>
        <p type="p">164:第一層間介電層</p>
        <p type="p">168:閘極介電層</p>
        <p type="p">170:閘極電極</p>
        <p type="p">172:閘極結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="643" publication-number="202616093">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616093</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109474</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>PCIe裝置的適應性枚舉之系統及方法</chinese-title>
        <english-title>SYSTEM AND METHODS FOR ADAPTIVE ENUMERATION OF PCIE DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">G06F13/38</main-classification>
        <further-classification edition="200601120250801B">G06F13/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商微晶片科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICROCHIP TECHNOLOGY INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦拉達拉詹　普拉桑納文卡泰尚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VARADHARAJAN, PRASANNA VENGATESHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘納瑟爾瓦姆　維格內什拉賈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANNERSELVAM, VIGNESHRAJA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼伽拉潘迪安　普拉加什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANGALAPANDIAN, PRAGASH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高什　阿提什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHOSH, ATISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種系統，包含耦合至一或多個主機且耦合至一或多個外部組件的PCIe交換器。該PCIe交換器包含適應性枚舉控制器。該PCIe交換器可自該一或多個外部組件讀取第一組態資訊，且可將該第一組態資訊與儲存於該PCIe交換器中之第二組態資訊進行比較。基於比較結果，該適應性枚舉控制器可允許該一或多個主機與該一或多個外部組件之間的通信，或可防止該一或多個主機與該一或多個外部組件之間的通信，或可修改該一或多個主機與該一或多個外部組件之間的通信。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system includes a PCIe switch coupled to one or more hosts and coupled to one or more external components. The PCIe switch includes an adaptive enumeration controller. The PCIe switch may read first configuration information from the one or more external components and may compare the first configuration information with second configuration information stored in the PCIe switch. Based on the results of the comparison, the adaptive enumeration controller may allow communication between the one or more hosts and the one or more external components or may prevent communication between the one or more hosts and the one or more external components or may modify communication between the one or more hosts and the one or more external components.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">111:第一主機</p>
        <p type="p">112:第二主機</p>
        <p type="p">113:第三主機</p>
        <p type="p">120:第一PCIe交換器</p>
        <p type="p">121:第一上游埠</p>
        <p type="p">122:第二上游埠</p>
        <p type="p">123:第三上游埠</p>
        <p type="p">131:第一分區</p>
        <p type="p">132:第二分區</p>
        <p type="p">133:第三分區</p>
        <p type="p">141:適應性枚舉控制器</p>
        <p type="p">142:記憶體</p>
        <p type="p">143:規則表</p>
        <p type="p">144:裝置能力追蹤器電路</p>
        <p type="p">151:第一下游埠</p>
        <p type="p">152:第二下游埠</p>
        <p type="p">153:第三下游埠</p>
        <p type="p">154:第四下游埠</p>
        <p type="p">161:第二PCIe交換器</p>
        <p type="p">162:高速非揮發性記憶體(NVMe)控制器</p>
        <p type="p">163:乙太網路控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="644" publication-number="202615619">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615619</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109484</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>保護膜形成膜及具保護膜的工件單片化物的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C09J11/04</main-classification>
        <further-classification edition="200601120260102B">C09J201/00</further-classification>
        <further-classification edition="201801120260102B">C09J7/30</further-classification>
        <further-classification edition="200601120260102B">H01L21/683</further-classification>
        <further-classification edition="200601120260102B">H01L21/78</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商琳得科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上村和恵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEMURA, KAZUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供保護膜形成膜及使用該保護膜形成膜製造具保護膜的半導體晶片等具保護膜的工件單片化物的方法。該保護膜形成膜能夠形成可將半導體晶片等工件單片化物上產生的熱充分散熱且溫度變化大的環境下的黏合可靠性充分高的保護膜。該保護膜形成膜為包含填充材料的硬化性的保護膜形成膜，在硬化後的保護膜形成膜的平行於厚度方向的剖面中，觀察將與厚度方向的厚度相同的長度作為一條邊且面積為625μm        &lt;sup&gt;2&lt;/sup&gt;的長方形區域時，填充材料的剖面面積相對於內包填充材料的剖面的所有外周線的最小包含圓的面積的比率為0.6以上至0.9以下並且填充材料的剖面的最大長度大於0.5μm的填充材料以0.08個以上/μm        &lt;sup&gt;2&lt;/sup&gt;至0.80個以下/μm        &lt;sup&gt;2&lt;/sup&gt;存在。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:硬化後的保護膜形成膜(保護膜)</p>
        <p type="p">3a,3b,3c:填充材料</p>
        <p type="p">RA:長方形區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="645" publication-number="202616910">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616910</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109556</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光電裝置生產中之表面鈍化方法</chinese-title>
        <english-title>SURFACE PASSIVATION METHODS IN PRODUCTION OF OPTOELECTRONIC DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260102B">H10F71/00</main-classification>
        <further-classification edition="202501120260102B">H10F77/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商皮寇桑公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PICOSUN OY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林哲歆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳曉鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, XIAOPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科斯塔莫　朱哈納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSTAMO, JUHANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容涉及一種生產具有經改良光電流產生效能之基體的方法(200)，該方法包含：在經組態以響應於入射光子而產生移動電荷載子之一選定(202)基體上沉積(208)一固定電荷鈍化膜，該固定電荷鈍化膜產生一電場且使光生電荷載子自基體表面排斥，從而抑制該等光生電荷載子之復合(recombination)。在沉積該固定電荷膜之前，對該基體表面進行預處理(204)以產生(206)具有經減小界面陷阱密度之一鈍化界面。本揭露內容進一步涉及一種藉由該方法獲得(212)之經鈍化基體結構及一種包含該經鈍化基體結構之光電裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure concerns a method (200) of producing a substrate with improved photocurrent generation performance, the method comprising: on a selected (202) substrate configured to generate mobile charge carriers in response to incident photons, depositing (208) a fixed charge passivation film that creates an electric field and repels photogenerated charge carriers from the substrate surface hence suppressing recombination thereof. Prior to depositing the fixed charge film, the substrate surface is pretreated (204) to generate (206) a passivation interface having reduced interface trap density. The disclosure further concerns a passivated substrate structure obtained (212) by the method, and an optoelectronic device comprising the same.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:方法</p>
        <p type="p">202,204,206,208,210,212:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="646" publication-number="202616760">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616760</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109584</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於對選擇性無線客戶端進行動態刪餘以減輕干擾的技術</chinese-title>
        <english-title>TECHNIQUES FOR DYNAMIC PUNCTURING ON SELECTIVE WIRELESS CLIENTS TO MITIGATE INTERFERENCE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">H04W72/0453</main-classification>
        <further-classification edition="202301120260102B">H04W72/121</further-classification>
        <further-classification edition="202301120260102B">H04W72/541</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福普　維尼思庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VUPPU, VENEETH KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾爾雪里夫　亞曼德拉蓋博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELSHERIF, AHMED RAGAB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷馬查德利　山迪普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOMCHAUDHURI, SANDIP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾斯特傑迪　阿爾佛瑞德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASTERJADHI, ALFRED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供用於對選擇性無線客戶端進行動態刪餘以減輕干擾的技術的方法、組件、裝置、及系統。更具體而言，一些態樣係關於使存取點(AP)能夠使用一「完整BW」與一些站台(STA)通訊及使用一「經刪餘BW」與其他STA通訊的技術。例如，一AP可使用一「完整BW」與STA通訊，且可從STA接收指示由該等各別STA所經歷（或預期經歷）的干擾的報告。對於報告沒有干擾的STA，該AP可使用該完整BW與該等STA繼續通訊。對比地，對於報告該完整BW的一或多個子頻帶上的干擾的STA，該AP可傳輸針對一「經刪餘BW」的報告，該報告省略該完整BW中易受干擾的一或多個子頻帶。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure provides methods, components, devices and systems for techniques for dynamic puncturing on selective wireless clients to mitigate interference. Some aspects more specifically relate to techniques that enable access points (APs) to communicate with some stations (STAs) using a “full BW,” and to communicate with other STAs using a “punctured BW.” For example, an AP may communicate with STAs using a “full BW,” and may receive reports from STAs that indicate interference experienced by (or expected to be experienced by) the respective STAs. For STAs that report no interference, the AP may continue communicating with the STAs using the full BW. Comparatively, for STAs that report interference on one or more sub-bands of the full BW, the AP may transmit a report for a “punctured BW” that omits one or more sub-bands of the full BW that are susceptible to the interference.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102-A:第一AP</p>
        <p type="p">102-B:第二AP</p>
        <p type="p">104-A:第一STA；STA</p>
        <p type="p">104-B:第二STA；STA</p>
        <p type="p">104-C:第三STA</p>
        <p type="p">205-A:第一基本服務集(BSS)</p>
        <p type="p">205-B:第二BSS</p>
        <p type="p">210:完整BW通訊</p>
        <p type="p">215:經刪餘BW通訊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="647" publication-number="202616786">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616786</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109630</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多層基板、多層基板的製造方法、及電子機器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H05K1/11</main-classification>
        <further-classification edition="200601120260102B">H05K3/40</further-classification>
        <further-classification edition="200601120260102B">H05K3/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＦＩＣＴ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FICT LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尾崎德一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OZAKI, NORIKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮川哲郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAGAWA, TETSUROU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中川隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAWA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂井直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種不在金屬層施加化學密著皮膜，即可實現金屬層的高速傳輸化的多層基板、多層基板的製造方法、及電子機器。&lt;br/&gt;  [解決手段]以下為其要件：積層複數個積層體(56)，前述積層體(56)具有：在第1表面(26a)形成有圖案狀的第1金屬層(40)的第1絕緣層(26)；積層在第1絕緣層(26)的第2表面(26b)並於第3表面(24a)埋設圖案狀的第2金屬層(22)而形成的第2絕緣層(24)；以埋設第1金屬層(40)的方式依序積層在第1表面(26a)的第3絕緣層(44)及第4絕緣層(48)；貫通第1絕緣層(26)及第2絕緣層(24)而形成的第1通孔(34)；貫通第3絕緣層(44)及第4絕緣層(48)而形成的第2通孔(54)，且至少第2絕緣層(24)及第4絕緣層(48)由低介電損耗正切的材料構成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">22:第2金屬層</p>
        <p type="p">24:第2絕緣層</p>
        <p type="p">24a:第3表面</p>
        <p type="p">26:第1絕緣層</p>
        <p type="p">26a:第1表面</p>
        <p type="p">26b:第2表面</p>
        <p type="p">34:第1通孔</p>
        <p type="p">40:第1金屬層</p>
        <p type="p">44:第3絕緣層</p>
        <p type="p">48:第4絕緣層</p>
        <p type="p">54:第2通孔，導電膏</p>
        <p type="p">56:積層體</p>
        <p type="p">58:積層體</p>
        <p type="p">64:第9絕緣層</p>
        <p type="p">66:第10絕緣層</p>
        <p type="p">68:第3通孔</p>
        <p type="p">72:金屬層</p>
        <p type="p">74:第3金屬層</p>
        <p type="p">200:多層基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="648" publication-number="202615805">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615805</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109727</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具顯示器的空氣調節裝置</chinese-title>
        <english-title>AIR CONDITIONING APPARATUS WITH DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250418B">F24F11/52</main-classification>
        <further-classification edition="201801120250418B">F24F11/89</further-classification>
        <further-classification edition="201801120250418B">F24F11/63</further-classification>
        <further-classification edition="201801120250418B">F24F11/66</further-classification>
        <further-classification edition="201801120250418B">F24F11/74</further-classification>
        <further-classification edition="201801120250418B">F24F11/80</further-classification>
        <further-classification edition="201801120250418B">F24F11/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>虹彩光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRIS OPTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林政宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHENG YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚正宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, CHENG HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖奇璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHI CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種具顯示器的空氣調節裝置，包含一空氣調節裝置本體、一顯示裝置以及一控制器。顯示裝置設置於空氣調節裝置本體的一側，並包含至少一顯示模組及一光吸收模組。此些顯示模組包含一畫素矩陣層。光吸收模組設置於此些顯示模組的一側。控制器訊號連接空氣調節裝置本體及顯示裝置，並用以控制顯示裝置顯示一圖像資料。藉此，能夠以數位畫框的方式遮擋空氣調節裝置本體，而兼具美觀與空氣調節的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An air conditioning apparatus with display device is proposed. The air conditioning apparatus with display device includes an air conditioning apparatus body, a displaying device and a controller. The displaying device is disposed on one side of the air conditioning apparatus body and includes at least one display modules and a light absorption module. The at least one display modules includes a pixel matrix layer. The light absorption module is disposed on one side of the at least one display modules. The controller is signally connected to the air conditioning apparatus body and the display device, and is configured to control the display device to display the image data. Thus, the air conditioning apparatus body can be shielded in the form of a digital picture frame so as to achieve both aesthetic and air condition effects.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:具顯示器的空氣調節裝置</p>
        <p type="p">110:空氣調節裝置本體</p>
        <p type="p">120:顯示裝置</p>
        <p type="p">130:攝影裝置</p>
        <p type="p">150:框體</p>
        <p type="p">L:可見光</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="649" publication-number="202615943">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615943</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109766</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具顯示器的居家保全裝置</chinese-title>
        <english-title>HOME SECURITY DEVICE WITH DIGITAL DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250513B">G02F1/1333</main-classification>
        <further-classification edition="200601120250513B">G08B13/196</further-classification>
        <further-classification edition="200601120250513B">H04N5/77</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>虹彩光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRIS OPTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林政宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHENG YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚正宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, CHENG HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖奇璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHI CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種具顯示器的居家保全裝置，包含一居家保全裝置本體、一顯示裝置、一檢測裝置以及一控制器。顯示裝置設置於居家保全裝置本體的一側，並包含至少一顯示模組及一光吸收模組。至少一顯示模組包含一畫素矩陣層。光吸收模組設置於至少一顯示模組的一側。檢測裝置設置於顯示裝置的一側，用以取得一使用者的一影像。控制器用以控制顯示裝置顯示一圖像資料，且辨識影像而確認是否解鎖居家保全裝置本體。藉此，能夠提升居家保全裝置的便利性與安全性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A home security device with digital display device is proposed. The home security device with digital display device includes a home security device body, a displaying device, a detecting device and a controller. The displaying device is disposed on one side of the home security device body and includes at least one display module and a light absorption module. The at least one of display module includes a pixel matrix layer. The light absorption module is disposed on one side of the at least one of display module. The detecting device is disposed on one side of the displaying device, and is configured to obtain an image of a user. The controller is configured to control the display device to display the image data, and is configured to identify the image and confirm whether to unlock the home security device body. Thus, the home security device with digital display device can improve the convenience and security in the use of the home security device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:具顯示器的居家保全裝置</p>
        <p type="p">110:居家保全裝置本體</p>
        <p type="p">111:門板</p>
        <p type="p">112:箱體</p>
        <p type="p">120:顯示裝置</p>
        <p type="p">130:檢測裝置</p>
        <p type="p">150:框體</p>
        <p type="p">L:可見光</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="650" publication-number="202615615">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615615</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109806</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黏合片和光學層疊體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260112B">C09J7/30</main-classification>
        <further-classification edition="200601120260112B">C09J133/06</further-classification>
        <further-classification edition="200601120260112B">B32B7/12</further-classification>
        <further-classification edition="200601120260112B">B32B27/30</further-classification>
        <further-classification edition="200601120260112B">G02B5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商琳得科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯塚亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IIZUKA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供黏合片和光學層疊體，該黏合片適合用於製造即使在置於高溫環境下的情況下偏振片的變色也得到抑制的光學層疊體，該光學層疊體包含影像顯示單元、偏振片和前面透明板，上述偏振片經由黏合劑層貼合於上述前面透明板，上述前面透明板為玻璃板等水蒸氣透過性低的板。一種黏合片，其是具有由活性能量射線固化性黏合劑構成的黏合劑層的黏合片，其特徵在於：對通過活性能量射線的照射使厚度為200μm的上述黏合劑層固化而成的固化後黏合劑層，在40℃、90%RH的條件下，依據JIS Z0208測定的上述固化後黏合劑層的水蒸氣透過度為160g/(m&lt;sup&gt;2&lt;/sup&gt;．24小時・200μm)以上；以及使用上述黏合片的光學層疊體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="651" publication-number="202615244">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615244</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109901</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>共固化多材料複合管及併有此種複合管之複合管總成</chinese-title>
        <english-title>CO-CURED MULTI-MATERIAL COMPOSITE TUBES AND COMPOSITE TUBE ASSEMBLIES INCORPORATING SUCH COMPOSITE TUBES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B32B1/08</main-classification>
        <further-classification edition="200601120260102B">B32B27/08</further-classification>
        <further-classification edition="200601120260102B">B32B27/20</further-classification>
        <further-classification edition="200601120260102B">B32B3/08</further-classification>
        <further-classification edition="200601120260102B">B32B3/10</further-classification>
        <further-classification edition="200601120260102B">B29C70/30</further-classification>
        <further-classification edition="200601120260102B">B29D23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾維科技泰尹股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVTECHTYEE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格林斯特里特　馬修　Ｃ　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GREENSTREET, MATTHEW CHARLES SHELDON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種複合管包括：一第一末端，其與一第二末端相對；一第一軸向區段，其包括穿過其厚度之一非導電材料；及一第二軸向區段，其包括一導電材料。一種用於形成一複合管之方法包括：在一心軸上方鋪設複數個複合材料層，從而形成一複合管，且該複數個層中之各者包括一非導電區段及一導電區段。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composite tube includes a first end opposite a second end, a first axial section including a non-conductive material through its thickness, and a second axial section including a conductive material. A method for forming a composite tube includes laying a plurality of composite material layers over a mandrel forming a composite tube, and each of the plurality of layers includes a non-conductive section and a conductive section.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:複合管</p>
        <p type="p">12:材料區段</p>
        <p type="p">14:末端</p>
        <p type="p">16:末端</p>
        <p type="p">50:軸向中間部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="652" publication-number="202616692">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616692</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109976</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>與基地台（BS）通訊的用戶設備及其操作方法</chinese-title>
        <english-title>USER EQUIPMENT COMMUNICATING WITH BASE STATION (BS) AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H04J11/00</main-classification>
        <further-classification edition="200601120260109B">H04L25/02</further-classification>
        <further-classification edition="200601120260109B">H04L27/26</further-classification>
        <further-classification edition="200901120260109B">H04W84/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳珍宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, JINWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金鎭虎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JINHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴廷敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JUNGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供與基地台通信的使用者設備及使用者設備的操作方法。與基地台通信的使用者設備的操作方法包括基於服務小區的第一頻率偏移和干擾小區的第二頻率偏移計算服務小區和干擾小區之間的頻率偏移差異，頻率偏移差異包括子載波偏移和殘餘頻率偏移，子載波偏移為子載波間隔的整數倍，以及通過基於殘餘頻率偏移補償頻率偏移差異，從使用者設備接收的接收信號中移除干擾信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a user equipment (UE) communicating with a base station (BS) and an operating method thereof. The operating method of the UE communicating with a base station (BS) includes calculating a frequency offset difference between a serving cell and an interference cell based on a first frequency offset for the serving cell and a second frequency offset for the interference cell, the frequency offset difference including a subcarrier offset and a residual frequency offset, the subcarrier offset being an integer multiple of a subcarrier spacing (SCS), and removing an interference signal from a reception signal received by the UE by compensating for the frequency offset difference based on the residual frequency offset.</p>
      </isu-abst>
      <representative-img>
        <p type="p">30:操作方法</p>
        <p type="p">S310、S320:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="653" publication-number="202616001">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616001</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110006</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>全像基板之製造方法、全像基板、複製全像基板之製造方法、及積層全像元件之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">G03H1/04</main-classification>
        <further-classification edition="200601120260108B">G03H1/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>篠﨑貴博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINOZAKI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅原淳弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGAHARA, ATSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>細山田将士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSOYAMADA, MASANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能容易且精度良好地讀取設置於全像基板之對準標記之全像基板之製造方法等。本發明係具備全像層20、及設置於全像層之外部之複數個對準標記31、32之全像基板100之製造方法。本發明之製造方法包含：全像層形成步驟ST2，其係自至少1個方向不為感光材料之法線方向之互不相同之2個方向對感光材料10照射光L1、L2，使上述光發生干涉，藉此形成全像層；及對準標記形成步驟ST3，其係自感光材料之法線方向一側及另一側對感光材料之供形成全像層之區域之外部照射光L1、L3，使上述光發生干涉，藉此形成由全像構成之對準標記。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:感光材料</p>
        <p type="p">20:全像層</p>
        <p type="p">31,32:對準標記</p>
        <p type="p">40:遮罩</p>
        <p type="p">41:第1開口部</p>
        <p type="p">42,43:第2開口部</p>
        <p type="p">50:透光板</p>
        <p type="p">60:反射鏡</p>
        <p type="p">70:基板</p>
        <p type="p">100:全像基板(主全像基板)</p>
        <p type="p">L1,L2,L3:光</p>
        <p type="p">α,β:角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="654" publication-number="202616703">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616703</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110135</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>增強服務品質(QOS)政策之網路資料分析功能(NWDAF)輔助</chinese-title>
        <english-title>NETWORK DATA ANALYTICS FUNCTION (NWDAF) ASSISTANCE FOR ENHANCED QUALITY OF SERVICE (QOS) POLICIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260102B">H04L41/147</main-classification>
        <further-classification edition="202201120260102B">H04L41/16</further-classification>
        <further-classification edition="202201120260102B">H04L41/5067</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商內數位專利控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERDIGITAL PATENT HOLDINGS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邁森尼　阿赫雷夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METHENNI, ACHREF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧維拉　赫恩安德茨　烏利斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLVERA-HERNANDEZ, ULISES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛迪　沙米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FERDI, SAMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">網路裝置可包括處理器，其被配置以：從第二網路功能接收第一請求訊息，以提供針對觀察的服務經驗永續性（SES）的網路分析；將第二請求訊息發送至第三網路功能，以獲得用於與觀察SES相關聯的SES分析識別符（ID）的機器學習（ML）模型；從第三網路功能接收第一回應訊息；使用經訓練的ML模型確定針對SES分析ID的一或更多分析；以及將回應訊息發送至第二網路功能。回應訊息可表明例如針對SES分析ID的一或更多分析。針對SES分析ID的一或更多分析可包括例如對複數個服務品質（QoS）參數中每一者的一或更多預測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A network device may comprise a processor configured to receive a first request message from a second network function to provide network analytics for observed service experience sustainability (SES), send a second request message to a third network function to obtain a machine learning (ML) model for an SES analytics identifier (ID) that is associated with the observed SES, receive a first response message from the third network function, determine one or more analytics for the SES analytics ID using the trained ML model, and send a response message to the second network function. The response message may indicate, for example, the one or more analytics for the SES analytics ID. The one or more analytics for the SES analytics ID may include, for example, one or more predictions for each of a plurality of quality of service (QoS) parameters.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:呼叫流程</p>
        <p type="p">202、204、206、208、210、212、214、216、218、220:流程步驟</p>
        <p type="p">AF:應用功能</p>
        <p type="p">ID:識別符</p>
        <p type="p">ML:機器學習</p>
        <p type="p">MTLF:模型訓練邏輯功能</p>
        <p type="p">NF:網路功能</p>
        <p type="p">NWDAF:網路資料分析功能</p>
        <p type="p">OAM:操作管理及維護</p>
        <p type="p">PCF:策略控制功能</p>
        <p type="p">QoS:服務品質</p>
        <p type="p">SES:服務經驗永續性</p>
        <p type="p">SMF:對話管理功能</p>
        <p type="p">S-NSSAI:單一網路切片選擇輔助資訊</p>
        <p type="p">UPF:使用者平面功能</p>
        <p type="p">VFL:縱向聯合學習</p>
        <p type="p">WTRU:無線傳輸/接收單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="655" publication-number="202616780">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616780</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110171</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>線性加速器設備、離子植入機及線性加速器</chinese-title>
        <english-title>LINEAR ACCELERATOR APPARATUS, ION IMPLANTER AND LINEAR ACCELERATOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H05H7/22</main-classification>
        <further-classification edition="200601120260102B">H01J37/317</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威波　亞隆　Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEBB, AARON P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏勒　傑森　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHALLER, JASON M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕克　威廉　赫倫　Ｊｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, WILLIAM HERRON JR.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>譚　偉明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAM, WAI MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恰伊卡　克里斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CZAJKA, CHRIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>席夢思　麥可　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIMMONS, MICHAEL C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯內卡特爾　路奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BONECUTTER, LUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯拉尼克　大衛　Ｔ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLAHNIK, DAVID T.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡雷爾　麥可　梅森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARRELL, MICHAEL MASON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種線性加速器設備，可包括定義出多邊形骨幹的束線殼體，以及沿著束線殼體的長度設置的多個加速級。給定加速級可包括傳導離子束通過的漂移管組件、耦合以傳遞射頻信號到漂移管組件的共振器，以及使離子束成形的四極組件。因此，在第一加速級處，第一共振器可沿著多邊形骨幹的第一邊設置，且在第二加速級，第一共振器鄰近並位於第一加速級的下游，第二共振器可沿著多邊形骨幹的第二邊設置，第二邊不同於第一邊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A linear accelerator apparatus may include a beamline enclosure that defines a polygonal backbone, and a plurality of acceleration stages, disposed along a length of the beamline enclosure. A given acceleration stage may include a drift tube assembly to conduct an ion beam therethrough, a resonator, coupled to deliver an RF signal to the drift tube assembly, and a quadrupole assembly to shape the ion beam. As such, at a first acceleration stage, a first resonator may be disposed along a first side of the polygonal backbone, and at a second acceleration stage, adjacent to and downstream of the first acceleration stage, a second resonator may be disposed along a second side of the polygonal backbone, different from the first side.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:設備</p>
        <p type="p">102:束線殼體</p>
        <p type="p">102V1:第一垂直邊</p>
        <p type="p">102V2:第二垂直邊</p>
        <p type="p">104:共振器</p>
        <p type="p">106:共振器殼體、共振器</p>
        <p type="p">106A:第一端面</p>
        <p type="p">106B:第二端面</p>
        <p type="p">106C:端面</p>
        <p type="p">108:共振線圈</p>
        <p type="p">108A:延伸部</p>
        <p type="p">109:泵組件</p>
        <p type="p">110:泵</p>
        <p type="p">112:泵腔室</p>
        <p type="p">114:漂移管組件</p>
        <p type="p">115:離子束</p>
        <p type="p">A:圓柱軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="656" publication-number="202616824">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616824</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110185</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置與製造記憶體單元的方法</chinese-title>
        <english-title>MEMORY DEVICE AND METHOD OF FABRICATING MEMORY CELL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251103B">H10B12/10</main-classification>
        <further-classification edition="200601120251103B">H01L21/302</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱于建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YU-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂文琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, WEN-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭雅云</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YA-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉逸青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YI-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　奕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, ZHIQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李婕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體裝置包括一通道層。該記憶體裝置包括該通道層之一第一側上的一閘極結構，其中該閘極結構具有面向該通道層的一頂表面。該記憶體裝置包括該通道層之與該第一側相對之一第二側上的一汲極結構，其中該汲極結構具有面向該通道層的一第一底表面。該記憶體裝置包括一源極結構，其係在該通道層的該第二側上且沿著一側向方向相鄰於該汲極結構，其中該源極結構具有面向該通道層的一第二底表面。該記憶體裝置包括一第一通道基座及自該通道層突出的一第二通道基座。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device includes a channel layer. The memory device includes a gate structure on a first side of the channel layer, where the gate structure has a top surface facing the channel layer. The memory device includes a drain structure on a second side of the channel layer opposite to the first side, where the drain structure has a first bottom surface facing the channel layer. The memory device includes a source structure on the second side of the channel layer and adjacent to the drain structure along a lateral direction, where the source structure has a second bottom surface facing the channel layer. The memory device includes a first channel pedestal and a second channel pedestals protruding from the channel layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:記憶體裝置</p>
        <p type="p">103:介電層</p>
        <p type="p">104:記憶體單元</p>
        <p type="p">105:電晶體</p>
        <p type="p">110:通道層</p>
        <p type="p">120:突出/提升之結構/平臺</p>
        <p type="p">124a:介電層</p>
        <p type="p">124b:氫吸收層/吸收層</p>
        <p type="p">124:吸收結構</p>
        <p type="p">125:通道結構</p>
        <p type="p">126:介電層</p>
        <p type="p">132:金屬層</p>
        <p type="p">134:金屬層</p>
        <p type="p">140:汲極結構/汲極金屬電極</p>
        <p type="p">142:源極結構/源極金屬電極</p>
        <p type="p">148:介電層</p>
        <p type="p">152:閘極介電層</p>
        <p type="p">154:閘極結構</p>
        <p type="p">154a~154c:材料層</p>
        <p type="p">155a:阻障層</p>
        <p type="p">155b:填充層</p>
        <p type="p">155:字線(WL)結構</p>
        <p type="p">176:介電層</p>
        <p type="p">188:介電層</p>
        <p type="p">190:SVIA結構</p>
        <p type="p">192:介電結構</p>
        <p type="p">194:吸收層</p>
        <p type="p">196:介電層</p>
        <p type="p">198:介電層</p>
        <p type="p">200:電容器</p>
        <p type="p">202:底板/底部金屬層</p>
        <p type="p">204:電容器介電層</p>
        <p type="p">206:頂板</p>
        <p type="p">BS140:頂表面</p>
        <p type="p">BS142:底表面</p>
        <p type="p">CL:中心線</p>
        <p type="p">P1:單元節距/尺寸</p>
        <p type="p">R’:分離距離</p>
        <p type="p">R:厚度</p>
        <p type="p">TS110:頂表面</p>
        <p type="p">TS154:頂表面</p>
        <p type="p">W1:第一寬度</p>
        <p type="p">W2:第二寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="657" publication-number="202616491">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616491</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110400</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝結構</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250624B">H01L23/31</main-classification>
        <further-classification edition="200601120250624B">H01L23/34</further-classification>
        <further-classification edition="200601120250624B">H01L23/498</further-classification>
        <further-classification edition="200601120250624B">H01L23/528</further-classification>
        <further-classification edition="200601120250624B">H01L23/538</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳新瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周孟緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, MENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭竣翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, JYUN-SIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡毓祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, YU-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李建勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIEN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>言　瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, KATHY WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種半導體封裝結構，包括基板、藉由多個第一類型焊料特徵接合至基板的中介層、以及藉由多個第二類型焊料特徵接合至中介層的積體電路晶粒。中介層包括重分布結構以及環繞重分布結構延伸的密封環結構。第二類型焊料特徵中至少一者電性耦接至密封環結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor package structure according to the present disclosure includes a substrate, an interposer bonded to the substrate by way of a plurality of first type solder features, and an integrated circuit (IC) die bonded to the interposer by way of a plurality of second type solder features. The interposer includes a redistribution structure and a seal ring structure extending around the redistribution structure. At least one of the plurality of second type solder features is electrically coupled to the seal ring structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10-1:第一系統晶粒</p>
        <p type="p">10-2:第二系統晶粒</p>
        <p type="p">10-3:第三系統晶粒</p>
        <p type="p">10-4:第四系統晶粒</p>
        <p type="p">20-1:第一記憶體晶粒</p>
        <p type="p">20-2:第二記憶體晶粒</p>
        <p type="p">20-3:第三記憶體晶粒</p>
        <p type="p">20-4:第四記憶體晶粒</p>
        <p type="p">20-5:第五記憶體晶粒</p>
        <p type="p">20-6:第六記憶體晶粒</p>
        <p type="p">20-7:第七記憶體晶粒</p>
        <p type="p">20-8:第八記憶體晶粒</p>
        <p type="p">20-9:第九記憶體晶粒</p>
        <p type="p">20-10:第十記憶體晶粒</p>
        <p type="p">20-11:第十一記憶體晶粒</p>
        <p type="p">20-12:第十二記憶體晶粒</p>
        <p type="p">200:封裝結構</p>
        <p type="p">202:封裝基板</p>
        <p type="p">204:中介層</p>
        <p type="p">208:焊料凸塊</p>
        <p type="p">210:功能性凸塊特徵</p>
        <p type="p">220:功能性微凸塊</p>
        <p type="p">222:散熱微凸塊</p>
        <p type="p">300:散熱凸塊特徵</p>
        <p type="p">402:散熱導孔</p>
        <p type="p">2020:重分布結構</p>
        <p type="p">2040:密封環結構</p>
        <p type="p">2048:重分布線</p>
        <p type="p">A-A’:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="658" publication-number="202615634">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615634</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110409</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電光學用組成物、電光學層、積層體、轉印薄膜、光波導及光調變器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C09K19/02</main-classification>
        <further-classification edition="200601120260102B">C09K19/20</further-classification>
        <further-classification edition="200601120260102B">C09K19/22</further-classification>
        <further-classification edition="200601120260102B">C09K19/38</further-classification>
        <further-classification edition="200601120260102B">C09K19/60</further-classification>
        <further-classification edition="200601120260102B">G02F1/061</further-classification>
        <further-classification edition="200601120260102B">G02F1/13</further-classification>
        <further-classification edition="200601120260102B">G02F1/137</further-classification>
        <further-classification edition="200601120260102B">G02B6/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部拓海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>星野渉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSHINO, WATARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村秀之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, HIDEYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北村拓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAMURA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森田梨奈子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORITA, RINAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題為提供一種能夠形成顯示高電光學常數之電光學層之電光學用組成物、以及電光學層、積層體、轉印薄膜、光波導及光調變器。本發明的電光學用組成物含有不顯示鐵電性之液晶化合物及二次分子極化率為15000×10&lt;sup&gt;-33&lt;/sup&gt;esu以上的有機色素，其中，液晶化合物顯示向列液晶性或層列液晶性，液晶化合物為低分子液晶化合物及具有顯示液晶性之重複單元L之高分子液晶化合物中的至少一者，低分子液晶化合物及高分子液晶化合物滿足既定的條件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="659" publication-number="202615981">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615981</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110519</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資料處理方法，帶電粒子束照射裝置及電腦可讀取記錄媒體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">G03F7/20</main-classification>
        <further-classification edition="200601120260114B">G06T11/20</further-classification>
        <further-classification edition="200601120260114B">H01J37/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商紐富來科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUFLARE TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梶原佑航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAJIWARA, YUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安井健一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YASUI, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">高速且正確地進行包含曲線的圖形的像素交點等的圖像處理中所必要的資訊的計算。按照本實施方式之資料處理方法，係將表現電路圖案的形狀的第1參數曲線的複數個控制點的位置湊整(rounding；或稱捨入)至規定間隔的網格上，針對複數個第2參數曲線的各者，檢索定義著控制點的位置及從曲線求出的參數的表格，參照具有位置關係和湊整至前述網格上的複數個控制點相同的控制點之第2參數曲線的前述參數，而算出前述電路圖案的圖像處理中運用的資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20(20a~20e):多射束</p>
        <p type="p">100:描繪裝置</p>
        <p type="p">101:基板</p>
        <p type="p">102:電子光學鏡筒</p>
        <p type="p">103:描繪室</p>
        <p type="p">105:XY平台</p>
        <p type="p">110:控制計算機</p>
        <p type="p">111:面積密度算出部</p>
        <p type="p">112:照射時間算出部</p>
        <p type="p">113:資料處理部</p>
        <p type="p">114:描繪控制部</p>
        <p type="p">130:偏向控制電路</p>
        <p type="p">139:平台位置檢測器</p>
        <p type="p">140:記憶部(描繪資料)</p>
        <p type="p">142:記憶部(表格)</p>
        <p type="p">144:記憶部(程式)</p>
        <p type="p">150:描繪部</p>
        <p type="p">160:控制部</p>
        <p type="p">200:電子束</p>
        <p type="p">201:電子槍</p>
        <p type="p">202:照明透鏡</p>
        <p type="p">203:成形孔徑陣列基板</p>
        <p type="p">204:遮沒孔徑陣列基板</p>
        <p type="p">205:縮小透鏡</p>
        <p type="p">206:限制孔徑構件</p>
        <p type="p">207:對物透鏡</p>
        <p type="p">208:偏向器</p>
        <p type="p">210:鏡</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="660" publication-number="202616051">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616051</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110553</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>節能的追蹤系統和追蹤方法</chinese-title>
        <english-title>TRACKING SYSTEM AND TRACKING METHOD FOR POWER SAVING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">G06F3/01</main-classification>
        <further-classification edition="201901120250502B">G06F1/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃兆選</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHAO SHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種節能的追蹤系統和追蹤方法。追蹤方法包含：由第一行動裝置調整第一行動裝置的感測器的第一功率消耗與第一行動裝置的第一光源的第二功率消耗的至少其中之一；由第一行動裝置執行下列的至少其中之一：根據經調整的第一功率消耗取得感測資料；以及根據經調整的第二功率消耗調整第一光源的照明；以及由第二行動裝置根據感測資料與第一光源的照明的至少其中之一追蹤第一行動裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A tracking system and a tracking method for power saving are provided. The tracking method includes: adjusting, by a first mobile device, at least one of a first power consumption of a sensor of the first mobile device and a second power consumption of a first light source of the first mobile device; executing at least one of the following by the first mobile device: obtaining sensed data according to the adjusted first power consumption; and adjusting illumination of the first light source according to the adjusted second power consumption; and tracking, by a second mobile device, the first mobile device according to at least one of the sensed data and the illumination of the first light source.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S601,S602,S603:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="661" publication-number="202615388">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615388</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110747</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性樹脂、硬化性樹脂組成物、清漆及其硬化物</chinese-title>
        <english-title>CURABLE RESIN, CURABLE RESIN COMPOSITION, VARNISH AND CURED PRODUCT THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C49/798</main-classification>
        <further-classification edition="200601120260102B">C08F12/34</further-classification>
        <further-classification edition="200601120260102B">C08L101/00</further-classification>
        <further-classification edition="200601120260102B">C08L25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本化藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON KAYAKU KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長谷川篤彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASEGAWA, ATSUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠島𨺓行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOHJIMA, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前原拓哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEHARA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関允諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKI, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本多理沙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONDA, RISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>近藤裕貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONDO, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種硬化物，其係除了溶劑溶解性、及在清漆狀態之保管安定性優異以外，且尺寸安定性、低介電特性亦為優異者。  &lt;br/&gt;本發明之硬化性樹脂，係使下述式(1)所示的乙烯基苯甲基化合物(A)、與在二甲基亞碸溶劑中之pKa未達31之化合物(B)反應而成，且與甲苯之HSP距離為2.5以下。  &lt;br/&gt;&lt;img align="absmiddle" height="174px" width="204px" file="ed10018.JPG" alt="ed10018.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;式(1)中，X表示鹵素原子。R&lt;sub&gt;1&lt;/sub&gt;表示碳數1至20之烷基、或可具有取代基之碳數6至20的芳香族基，s為0至4之整數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a cured product that has excellent solvent solubility and excellent storage stability in a varnish state, as well &lt;br/&gt;as excellent dimensional stability and low dielectric properties. &lt;br/&gt;A curable resin according to the present invention is obtained by reacting a vinylbenzyl compound (A) represented by the following formula (1) with a compound (B) having a pKa of less than 31 in a dimethylsulfoxide solvent. The curable resin has an HSP distance to toluene of 2.5 or less. &lt;br/&gt;&lt;img align="absmiddle" height="186px" width="186px" file="ed10019.JPG" alt="ed10019.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, &lt;br/&gt;wherein X represents a halogen atom; R1 represents an alkyl group having 1 to 20 carbon atoms or an aromatic group having 6 to 20 carbon atoms which may have a substituent; and s is an integer of 0 to 4.</p>
      </isu-abst>
      <representative-img>
        <p type="p">本案無圖式。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="662" publication-number="202616878">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616878</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110845</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250703B">H10D64/27</main-classification>
        <further-classification edition="202501120250703B">H10D62/17</further-classification>
        <further-classification edition="202501120250703B">H10D64/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒家仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZOU, JIA-REN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴偉銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, WEI-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游國彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, KUO-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JYUN-JI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林學溢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SYUE YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林文生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例係關於一種半導體裝置及其製造方法。該半導體裝置包含一基板、一閘極介電質、一隔離結構及一閘極電極。該閘極介電質放置於該基板上。該隔離結構位於該基板內。該閘極介電質包含鄰接該隔離結構之一錐形部分。該閘極電極放置於該閘極介電質及該隔離結構上。該閘極介電質之該錐形部分由該閘極電極暴露。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a substrate, a gate dielectric, an isolation structure, and a gate electrode. The gate dielectric is disposed on the substrate. The isolation structure is within the substrate. The gate dielectric includes a tapered portion abutting the isolation structure. The gate electrode is disposed on the gate dielectric and the isolation structure. The tapered portion of the gate dielectric is exposed by the gate electrode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10a:半導體裝置</p>
        <p type="p">102:基板</p>
        <p type="p">102p1:部分</p>
        <p type="p">102p2:部分</p>
        <p type="p">110:隔離結構</p>
        <p type="p">112:隔離層</p>
        <p type="p">114:隔離層</p>
        <p type="p">116:隔離層</p>
        <p type="p">132:閘極介電質</p>
        <p type="p">132s1:側</p>
        <p type="p">132s2:側</p>
        <p type="p">132s3:側</p>
        <p type="p">132s4:側</p>
        <p type="p">134a:閘極電極</p>
        <p type="p">134s1:側</p>
        <p type="p">134s2:側</p>
        <p type="p">136a1:凹槽</p>
        <p type="p">136a2:凹槽</p>
        <p type="p">136s1:側</p>
        <p type="p">136s2:側</p>
        <p type="p">136s3:側</p>
        <p type="p">136s4:側</p>
        <p type="p">142:源極/汲極(S/D)區</p>
        <p type="p">144:S/D區</p>
        <p type="p">150:層間介電質(ILD)</p>
        <p type="p">162:接點</p>
        <p type="p">164:接點</p>
        <p type="p">166:接點</p>
        <p type="p">C1:隅角</p>
        <p type="p">C2:隅角</p>
        <p type="p">C3:隅角</p>
        <p type="p">C4:隅角</p>
        <p type="p">D&lt;sub&gt;1&lt;/sub&gt;:距離</p>
        <p type="p">P1:點</p>
        <p type="p">X&lt;sub&gt;1&lt;/sub&gt;:長度</p>
        <p type="p">X&lt;sub&gt;2&lt;/sub&gt;:長度</p>
        <p type="p">Y&lt;sub&gt;1&lt;/sub&gt;:長度</p>
        <p type="p">Y&lt;sub&gt;2&lt;/sub&gt;:長度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="663" publication-number="202616858">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616858</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110907</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置結構及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251103B">H10D30/62</main-classification>
        <further-classification edition="202501120251103B">H10D64/27</further-classification>
        <further-classification edition="202501120251103B">H10D64/23</further-classification>
        <further-classification edition="202501120251103B">H10D30/01</further-classification>
        <further-classification edition="202501120251103B">H10D64/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, GUAN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周君易</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江國誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, KUO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱熙甯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JU, SHI-NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例提供半導體裝置結構及其形成方法，此結構包含第一半導體層，設置於第一區中；及第二半導體層，圍繞第一區中的第一半導體層，第一半導體層及第二半導體層包括不同材料。此結構更包含第一閘極電極層，圍繞第二半導體層的一部分；第一源極/汲極區，電性連接至第二半導體層；以及第二源極/汲極區，電性連接至第二半導體層，第二半導體層設置於第一源極/汲極區與第二源極/汲極區之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure provide a semiconductor device structure and methods for forming the same. The structure includes a first semiconductor layer disposed in a first region and a second semiconductor layer surrounding the first semiconductor layer in the first region. The first and second semiconductor layers comprise different materials. The structure further includes a first gate electrode layer surrounding a portion of the second semiconductor layer, a first source/drain region electrically connected to the second semiconductor layer, and a second source/drain region electrically connected to the second semiconductor layer. The second semiconductor layer is disposed between the first and second source/drain regions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置結構</p>
        <p type="p">101:基底</p>
        <p type="p">106:第一半導體層</p>
        <p type="p">109:介電層</p>
        <p type="p">116:基底部分</p>
        <p type="p">144:介電間隙壁</p>
        <p type="p">146N,146P:源極/汲極區</p>
        <p type="p">162:接觸蝕刻停止層</p>
        <p type="p">163:層間介電層</p>
        <p type="p">169:界面層</p>
        <p type="p">170:閘極介電層</p>
        <p type="p">172:閘極電極層</p>
        <p type="p">174:閘極結構</p>
        <p type="p">202:p型金屬氧化物半導體區</p>
        <p type="p">204:n型金屬氧化物半導體區</p>
        <p type="p">210:蓋層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="664" publication-number="202615608">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615608</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110917</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>異物去除用塗佈膜形成組成物及半導體基板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C09D201/00</main-classification>
        <further-classification edition="201801120260102B">C09D7/20</further-classification>
        <further-classification edition="201801120260102B">C09D7/63</further-classification>
        <further-classification edition="200601120260102B">C09D5/00</further-classification>
        <further-classification edition="200601120260102B">C09J5/02</further-classification>
        <further-classification edition="200601120260102B">H01L21/02</further-classification>
        <further-classification edition="200601120260102B">H01L21/683</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上林哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMIBAYASHI, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岸岡高広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISHIOKA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可形成可藉由去除液去除的塗佈膜之異物去除用塗佈膜形成組成物，其  &lt;br/&gt;　　含有膜構成成分及溶劑，  &lt;br/&gt;　　前述膜構成成分含有配位性化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="665" publication-number="202615209">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615209</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110946</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>圓筒研削方法及圓筒研削機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260102B">B24B41/06</main-classification>
        <further-classification edition="200601120260102B">B24B49/12</further-classification>
        <further-classification edition="200601120260102B">B24B5/04</further-classification>
        <further-classification edition="200601120260102B">B24B49/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU HANDOTAI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中川和也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAWA, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種圓筒研削方法，對結晶棒進行圓筒研削，作為支持裝置，使用具有凹形狀的支持部之支持裝置，該凹形狀的支持部能支持結晶棒的圓錐狀端部，作為圓筒研削機，使用具備殘存狀態判定手段之圓筒研削機，該殘存狀態判定手段判定結晶棒的圓錐狀端部的一部分是否殘存於支持部內，在圓筒研削的連續處理中，藉由殘存狀態判定手段，在判定為端部的一部分沒有殘存於支持部內的情況，使連續處理繼續進行，而在判定為端部的一部分殘存於支持部內的情況，則使連續處理停止。藉此，能提供一種圓筒研削方法及圓筒研削機，針對將單晶矽晶棒進行圓筒研削後的搬出步驟，在圓錐狀尾部的頂端殘存於支持裝置內的情況，能夠確實地發現該情況。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:圓筒研削機</p>
        <p type="p">2a,2b:支持裝置</p>
        <p type="p">3a:主軸</p>
        <p type="p">3b:副軸</p>
        <p type="p">4a,4b:支持單元</p>
        <p type="p">5:研削單元</p>
        <p type="p">6:磨石</p>
        <p type="p">7:殘存狀態判定手段</p>
        <p type="p">8:圖像攝影部</p>
        <p type="p">9:缺損判定部</p>
        <p type="p">10:自動停止手段</p>
        <p type="p">51:結晶棒</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="666" publication-number="202615613">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615613</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110982</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含二片矽基板之積層體的製造方法及該積層體</chinese-title>
        <english-title>LAMINATE HAVING TWO SILICON SUBSTRATES AND METHOD FOR PRODUCING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C09J5/00</main-classification>
        <further-classification edition="200601120260102B">C09J5/04</further-classification>
        <further-classification edition="200601120260102B">C09J183/00</further-classification>
        <further-classification edition="200601120260102B">B32B15/08</further-classification>
        <further-classification edition="200601120260102B">H01L21/02</further-classification>
        <further-classification edition="200601120260102B">H01L21/762</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大金工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大向吉景</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHMUKAI, YOSHIKAGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中川智尋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAWA, CHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>細田一輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSODA, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>並川敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAMIKAWA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種包含二片矽基板之積層體的製造方法，其包含下列步驟：  &lt;br/&gt;(a) 準備第1矽基板及第2矽基板之步驟，其中，前述第1矽基板具有第1接合部，前述第2矽基板具有第2接合部，且前述第1接合部及前述第2接合部為包含氧化矽的部分；  &lt;br/&gt;(b) 準備第1組成物之步驟，其中，該第1組成物係包含可與氫矽基及/或矽醇基反應之有機系材料、以及可與氧化矽接合之無機系材料中的至少一者，且粒子量為3,000個/mL以下；以及  &lt;br/&gt;(c) 設置接著層之步驟，係使用前述有機系材料及無機系材料中的至少一者，將前述第1接合部及前述第2接合部以該有機系材料及/或源自該有機系材料之反應生成物進行接合，或者，將前述第1接合部及前述第2接合部以無機系材料及/或源自無機系材料之反應生成物進行接合；其中，  &lt;br/&gt;前述接著層系包含設置於前述第1接合部上之第1接著部；  &lt;br/&gt;前述第1接著部之與前述第1接合部為相反側的面所含有之粒子的群集數為5個/cm&lt;sup&gt;2&lt;/sup&gt;。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for producing a laminate having two silicon substrates according to the present invention includes the following steps: &lt;br/&gt;(a) preparing a first silicon substrate having a first bonding portion and a second silicon substrate having a second bonding portion, wherein the first bonding portion and the second bonding portion are portions containing silicon oxide; &lt;br/&gt;(b) preparing a first composition containing at least one of an organic material that can react with a hydrosilyl group and/or a silanol group and an inorganic material that can be bonded to silicon oxide, wherein the first composition has a particle amount of 3,000 particles/mL or less; and &lt;br/&gt;(c) providing an adhesive layer using at least one of the organic material and the inorganic material that bonds the first bonding portion and the second bonding portion with the organic material and/or a reaction product derived therefrom, or that bonds the first bonding portion and the second bonding portion with the inorganic material and/or a reaction product derived therefrom; &lt;br/&gt;wherein the adhesive layer includes a first adhesive portion provided on the first bonding portion, and the number of particle clusters included on the surface of the first adhesive portion opposite the first bonding portion is 5/cm2 or less.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第1矽基板</p>
        <p type="p">11:第1本體部</p>
        <p type="p">13:第1接合部</p>
        <p type="p">20:第2矽基板</p>
        <p type="p">21:第2本體部</p>
        <p type="p">23:第2接合部</p>
        <p type="p">30:接著層</p>
        <p type="p">31:第1接著部</p>
        <p type="p">40:積層體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="667" publication-number="202615597">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615597</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111018</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光性樹脂墨水、使用前述發光性樹脂墨水的光學部件、使用前述光學部件的發光裝置、發電裝置及顯示器，以及發光性樹脂墨水的製造方法及光學部件的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C09D11/00</main-classification>
        <further-classification edition="200601120260102B">C09K11/02</further-classification>
        <further-classification edition="200601120260102B">C09K11/66</further-classification>
        <further-classification edition="200601120260102B">G02B5/20</further-classification>
        <further-classification edition="202501120260102B">H10H20/851</further-classification>
        <further-classification edition="202301120260102B">H10K30/40</further-classification>
        <further-classification edition="202301120260102B">H10K30/50</further-classification>
        <further-classification edition="202301120260102B">H10K59/10</further-classification>
        <further-classification edition="202301120260102B">H10K59/38</further-classification>
        <further-classification edition="202301120260102B">H10K71/13</further-classification>
        <further-classification edition="202301120260102B">H10K71/15</further-classification>
        <further-classification edition="201101120260102B">B82Y20/00</further-classification>
        <further-classification edition="201101120260102B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本瑞翁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZEON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商伊勢化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISE CHEMICALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人山形大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL UNIVERSITY CORPORATION YAMAGATA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏木幹文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASHIWAGI, MOTOFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>淺倉聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAKURA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤貴弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>増原陽人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASUHARA, AKITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大下直晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSHITA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本村秀麿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTOMURA, SHUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水碩人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, HIROTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種發光性樹脂墨水，其係至少包含含發光性奈米粒子及第一溶媒之分散液與樹脂的發光性樹脂墨水，其中前述分散液的液體介電常數ε&lt;sub&gt;1&lt;/sub&gt;（μS／cm）及前述發光性樹脂墨水的液體介電常數ε&lt;sub&gt;2&lt;/sub&gt;（μS／cm）滿足下述式（1）。亦提供使用前述發光性樹脂墨水的光學部件、使用前述光學部件的發光裝置、發電裝置及顯示器，以及發光性樹脂墨水的製造方法及光學部件的製造方法。&lt;br/&gt;  ｜（ε&lt;sub&gt;2&lt;/sub&gt;－ε&lt;sub&gt;1&lt;/sub&gt;）／ε&lt;sub&gt;1&lt;/sub&gt;｜×100≦10（%）　（1）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="668" publication-number="202616283">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616283</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111100</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路、積體晶片及其操作方法</chinese-title>
        <english-title>CIRCUIT, INTEGRATED CHIP AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">G11C11/40</main-classification>
        <further-classification edition="200601120251103B">G11C7/12</further-classification>
        <further-classification edition="200601120251103B">G11C8/08</further-classification>
        <further-classification edition="200601120251103B">G11C7/00</further-classification>
        <further-classification edition="200601120251103B">G11C16/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳承潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHEN-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李婕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉逸青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YI-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴康太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBA, KOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白武慎一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRATAKE, SHINICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜慧如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, KATHERINE H.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電路包括第一位元線、第二位元線、第一字元線、第二字元線、第一記憶體單元、第二記憶體單元、第一感測放大器、第一位元線電晶體和第二位元線電晶體。第一記憶體單元耦合到第一位元線和第一字元線。第二記憶體單元耦合到第二位元線和第二字元線。第一感測放大器具有第一端子。第一位元線電晶體選擇性地將第一位元線耦合到第一感測放大器的第一端子。第二位元線電晶體選擇性地將第二位元線耦合到第一感測放大器的第一端子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit includes a first bit line, a second bit line, a first word line, a second word line, a first memory cell, a second memory cell, a first sense amplifier, a first bit line transistor, and a second bit line transistor. The first memory cell is coupled to the first bit line and the first word line. The second memory cell is coupled to the second bit line and the second word line. The first sense amplifier has a first terminal. The first bit line transistor selectively couples the first bit line to the first terminal of the first sense amplifier. The second bit line transistor selectively couples the second bit line to the first terminal of the first sense amplifier.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電路圖</p>
        <p type="p">104:第二位元線</p>
        <p type="p">106:第一字元線</p>
        <p type="p">108:第二字元線</p>
        <p type="p">110:第一記憶體單元</p>
        <p type="p">112:第一記憶體單元電晶體</p>
        <p type="p">112a、114a、120a、122a、124a、126a、128a:第一端子</p>
        <p type="p">112b、114b、120b、122b、126b、128b:第二端子</p>
        <p type="p">112c、120c、126c、128c:控制端子</p>
        <p type="p">114:第一記憶體單元電容器</p>
        <p type="p">116:參考電壓端子</p>
        <p type="p">118:第二記憶體單元</p>
        <p type="p">120:第二記憶體單元電晶體</p>
        <p type="p">122:第二記憶體單元電容器</p>
        <p type="p">124:第一感測放大器</p>
        <p type="p">126:第一位元線電晶體</p>
        <p type="p">128:第二位元線電晶體</p>
        <p type="p">130、132:寄生電容</p>
        <p type="p">134:第一開關線</p>
        <p type="p">136:第二開關線</p>
        <p type="p">138:第一字元線驅動電路</p>
        <p type="p">140:第二字元線驅動電路</p>
        <p type="p">138a、140a:第一輸出端子</p>
        <p type="p">138b、140b:第二輸出端子</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="669" publication-number="202615342">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615342</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111128</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多孔碳載體的精製方法、通過該方法精製的多孔碳載體及包括其的矽負極材料</chinese-title>
        <english-title>PURIFYING METHOD OF POROUS CARBON SUPPORT, POROUS CARBON SUPPORT PURIFIED BY THE METHOD, AND SILICON-ANODE MATERIAL CONTAINING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260102B">C01B32/378</main-classification>
        <further-classification edition="201701120260102B">C01B32/05</further-classification>
        <further-classification edition="200601120260102B">C01B33/027</further-classification>
        <further-classification edition="201001120260102B">H01M4/583</further-classification>
        <further-classification edition="200601120260102B">H01M4/38</further-classification>
        <further-classification edition="200601120260102B">H01M4/36</further-classification>
        <further-classification edition="200601120260102B">H01M4/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商韓華思路信公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANWHA SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭化敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, HWAKYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜秉贊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, BYUNGCHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張多元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, DAWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全孝鎭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, HYOJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玟妌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MINJEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裵在鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, JAEHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔宰源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JAEWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及有效去除用作矽負極材料的多孔碳載體中的金屬雜質的精製方法、通過該方法精製的超高純度多孔碳載體以及使用其的矽負極材料（電池負極材料）、包括其作為負極材料的鋰離子電池和/或全固態電池。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="670" publication-number="202616417">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616417</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111173</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用以減少處理腔室的邊緣捲邊的腔室襯墊和腔室套件</chinese-title>
        <english-title>CHAMBER LINERS AND CHAMBER KITS TO REDUCE EDGE ROLL OFF FOR PROCESSING CHAMBERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/67</main-classification>
        <further-classification edition="200601120260102B">H01L21/683</further-classification>
        <further-classification edition="200601120260102B">C30B25/08</further-classification>
        <further-classification edition="200601120260102B">C30B25/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕拉帝　亞伯拉罕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PALATY, ABRAHAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張榮基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YOUNGKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　樹坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAU, SHU-KWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係關於具有流動開口的襯墊，以及相關的腔室套件、處理腔室和半導體製造的方法。在一或多個實施例中，提供一種用於處理腔室的襯墊。該襯墊包括內面、與內面相對的外面、界定至少部分外面和內面的第一部分，以及界定至少部分外面和內面的第二部分，第二部分與第一部分相對，且第二部分和第一部分的方位角大於150度。該襯墊進一步包括延伸至內面和第一部分中的氣體入口開口，以及複數個延伸至第二部分中的氣體排氣口。氣體排氣口的剖面在第一部分的對側上延伸至第一部分中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to liners having flow openings, and related chamber kits, processing chambers, and methods for semiconductor manufacturing. In one or more embodiments, a liner for a processing chamber is provided. The liner includes an inner face, an outer face opposing the inner face, a first portion defining at least part of the outer face and the inner face, and a second portion defining at least part of the outer face and the inner face, the second portion opposing the first portion, and the second portion and the first portion having an azimuthal angle greater than 150 degrees. The liner further includes an gas inlet opening extending into the inner face and into the first portion, and a plurality of gas exhaust openings extending into the second portion. A profile of the gas exhaust openings extend into the first portion on opposing sides of the first portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">115:襯墊</p>
        <p type="p">201:內面</p>
        <p type="p">202:外面</p>
        <p type="p">203:氣體入口開口</p>
        <p type="p">204:氣體排氣口</p>
        <p type="p">204A:氣體排氣口</p>
        <p type="p">204B:氣體排氣口</p>
        <p type="p">204C:氣體排氣口</p>
        <p type="p">204D:氣體排氣口</p>
        <p type="p">212:第一側面</p>
        <p type="p">225:中心線</p>
        <p type="p">226:中心點</p>
        <p type="p">227:寬度</p>
        <p type="p">228:中心點</p>
        <p type="p">229A:第一外側端</p>
        <p type="p">229B:第二外側端</p>
        <p type="p">A1:角度</p>
        <p type="p">A2:角度</p>
        <p type="p">AA1:角度</p>
        <p type="p">AA2:角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="671" publication-number="202616403">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616403</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111264</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250704B">H01L21/66</main-classification>
        <further-classification edition="202001120250704B">G01R31/26</further-classification>
        <further-classification edition="200601120250704B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦佑鎭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, WOOJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魯潤碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOH, YUNSEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴相彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SANGUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳太陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOU, TAEYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳海旻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, HAEMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李周桓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JOOHWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容係關於一種半導體裝置，其包括：一第一標準胞元及一第二標準胞元，其位於平行於一半導體基體之一上表面的一第一方向及一第二方向中之至少一者上的不同位置處，該第一標準胞元及該第二標準胞元彼此相交；一信號互連件，其連接該第一標準胞元及該第二標準胞元；及一監測互連件，其在垂直於該上表面之一垂直方向上連接至該信號互連件且位於該垂直方向上比該信號互連件之一第二位準高的一第一位準處，其中該監測互連件包括一監測墊，該監測墊位於一最上部互連層中，該最上部互連層位於該垂直方向上之一最上部位準處。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes: a first standard cell and a second standard cell at different positions in at least one of a first direction and a second direction parallel to an upper surface of a semiconductor substrate, the first standard cell and the second standard cell intersecting each other; a signal interconnection connecting the first standard cell and the second standard cell; and a monitoring interconnection connected to the signal interconnection in a vertical direction perpendicular to the upper surface and at a first level higher than a second level of the signal interconnection in the vertical direction, wherein the monitoring interconnection includes a monitoring pad in an uppermost interconnection layer at an uppermost level in the vertical direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">101:半導體基體</p>
        <p type="p">105:元件區</p>
        <p type="p">131,132,134,135:單元互連件</p>
        <p type="p">133:最上部單元互連件，單元互連件</p>
        <p type="p">141:第一單元監測互連件，中間監測互連件</p>
        <p type="p">142:第二單元監測互連件，中間監測互連件</p>
        <p type="p">143:中間監測互連件</p>
        <p type="p">144:監測墊</p>
        <p type="p">150:互連區</p>
        <p type="p">151,152,153,154,155,156:互連層</p>
        <p type="p">157:最上部互連層，互連層</p>
        <p type="p">SC1:第一標準胞元，標準胞元</p>
        <p type="p">SC2:第二標準胞元，標準胞元</p>
        <p type="p">VA:互連通孔，通孔</p>
        <p type="p">X:第一方向，X軸方向</p>
        <p type="p">Y:第二方向，Y軸方向</p>
        <p type="p">Z:第三方向，Z軸方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="672" publication-number="202616859">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616859</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111336</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置結構及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251029B">H10D30/62</main-classification>
        <further-classification edition="202501120251029B">H10D64/27</further-classification>
        <further-classification edition="202501120251029B">H10D30/01</further-classification>
        <further-classification edition="202501120251029B">H10D64/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張榮宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JUNG-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊宗翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, TSUNG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕承</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張復成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, FU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江國誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, KUO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例提供一種半導體裝置結構及其形成方法，包括第一半導體層，設置於第一區域中、第二半導體層，設置於第一區域中且位於第一半導體層上方、第一閘極電極層，設置於第一區域中且位於第一與第二半導體層之間、第一介電間隔物，設置於第一區域中且相鄰於第一閘極電極層、第三半導體層，設置於第二區域中、第四半導體層，設置於第二區域中且位於第三半導體層上方、第二閘極電極層，設置於第二區域中且位於第三半與第四半導體層之間、及第二介電間隔物，設置在第二區域中且相鄰於第二閘極電極層。第二介電間隔物具有小於第一厚度的第二厚度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure provide a semiconductor device structure and methods for forming the same. The structure includes a first semiconductor layer disposed in a first region, a second semiconductor layer disposed over the first semiconductor layer in the first region, a first gate electrode layer disposed between the first and second semiconductor layers in the first region, a first dielectric spacer disposed adjacent the first gate electrode layer in the first region, a third semiconductor layer disposed in a second region, a fourth semiconductor layer disposed over the third semiconductor layer in the second region, a second gate electrode layer disposed between the third and fourth semiconductor layers in the second region, and a second dielectric spacer disposed adjacent the second gate electrode layer in the second region. The second dielectric spacer has a thickness smaller than a first thickness of the first dielectric spacer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置結構</p>
        <p type="p">101:基板</p>
        <p type="p">106,150:半導體層</p>
        <p type="p">116:基板部分</p>
        <p type="p">132,134:犧牲閘極電極層</p>
        <p type="p">135:氧化物層</p>
        <p type="p">136:遮罩層</p>
        <p type="p">137:氮化物層</p>
        <p type="p">138:間隔物</p>
        <p type="p">143:介電材料</p>
        <p type="p">144:介電間隔物</p>
        <p type="p">156:介電層</p>
        <p type="p">202:PMOS區域</p>
        <p type="p">204:NMOS區域</p>
        <p type="p">210,214,216:半導體材料</p>
        <p type="p">218:介電間隔物</p>
        <p type="p">X,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="673" publication-number="202616418">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616418</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111355</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於改良材料剝離(MLO)半導體處理之設備</chinese-title>
        <english-title>APPARATUS FOR IMPROVED MATERIAL LIFT OFF (MLO) SEMICONDUCTOR PROCESSING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/67</main-classification>
        <further-classification edition="200601120260102B">B08B3/02</further-classification>
        <further-classification edition="200601120260102B">B08B3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商維克儀器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VEECO INSTRUMENTS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰勒　菲利普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TYLER, PHILLIP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰迪　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TADDEI, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐奈利　凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONNELLY, KEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓊斯　杭特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JONES, HUNTER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>揚努齊　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANNUZZI, MARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於執行從複數個晶圓剝離金屬及諸如有機或無機膜之其他材料之浸沒站，其包括：浸沒腔室，其具有錐形底部部分；排洩口，其耦合至該錐形底部；噴霧桿，其耦合至該腔室且具有經調適以將化學溶劑以高流速噴霧至該浸沒腔室中之噴嘴；及浸沒工具，其定位於該腔室內且具有具用於固持複數個晶圓之隔室之盒，其中該浸沒工具具有用於曝露於該化學溶劑噴霧之開口。該浸沒工具及該等噴霧桿噴嘴在該浸沒腔室內經構形以提供遍及該盒中之該複數個晶圓的溶劑之均勻分配，以誘發金屬從該複數個晶圓剝離，且從該等晶圓移除之溶劑與金屬碎屑向下流動至該錐形底部部分，該錐形底部部分將該流引導至該排洩口中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An immersion station for performing lift off of metals and other materials such as organic or inorganic films from a plurality of wafers comprises an immersion chamber having a conical bottom portion, a drain coupled to the conical bottom, a spray bar coupled to the chamber having nozzles adapted to spray chemical solvent at a high flow rate into the immersion chamber, and an immersion tool positioned within the chamber having a cassette with compartments for holding a plurality of wafers, wherein the immersion tool has openings for exposure to the chemical solvent spray. The immersion tool and the spray bar nozzles are configured within the immersion chamber so as to provide an even distribution of solvent across the plurality of wafers in the cassette to induce metals to lift off from the plurality of wafers, and solvent and metal debris removed from the wafers flows downwardly to the conical bottom portion which directs the flow into the drain.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:浸沒站</p>
        <p type="p">105:浸沒腔室</p>
        <p type="p">110:浸沒工具</p>
        <p type="p">115:頂部空間區段</p>
        <p type="p">118:入口</p>
        <p type="p">120:熱電偶</p>
        <p type="p">122:手動接取窗口</p>
        <p type="p">130:錐形底部部分/錐形底部</p>
        <p type="p">135:排洩口</p>
        <p type="p">145:升降機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="674" publication-number="202615253">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615253</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111368</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>窗構造及片材</chinese-title>
        <english-title>WINDOW STRUCTURE AND SHEET</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B32B17/10</main-classification>
        <further-classification edition="200601120260102B">B32B27/06</further-classification>
        <further-classification edition="200601120260102B">B32B27/20</further-classification>
        <further-classification edition="200601120260102B">C03C27/12</further-classification>
        <further-classification edition="200601120260102B">E04B1/92</further-classification>
        <further-classification edition="200601120260102B">E06B5/00</further-classification>
        <further-classification edition="200601120260102B">H01Q1/22</further-classification>
        <further-classification edition="200601120260102B">H01Q15/14</further-classification>
        <further-classification edition="200601120260102B">H05K9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商電化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENKA COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恒吉俊彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUNEYOSHI, TOSHIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比舎佑基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HISHA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>深澤元晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKAZAWA, MOTOHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明一實施態樣之窗構造，具備：窗，其具有第1面以及相對於第1面的第2面；以及片材，其貼合於窗的第1面以及第2面的至少其中一方，並包含基體樹脂以及無機填充材料。穿透窗並到達片材的既定帶域的電波的反射強度以及穿透片材並到達窗的既定帶域的電波的反射強度的至少其中任一方，比穿透在第1面以及第2面的其中任一方或第1面以及第2面雙方接觸空氣的情況下的窗的既定帶域的電波的反射強度更低。基體樹脂，為熱可塑性樹脂或熱硬化性樹脂。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A window structure according to one embodiment of the invention comprises a window that has a first surface and a second surface on the opposite side from the first surface, and a sheet that is affixed to at least one of the first surface and the second surface of the window and contains a matrix resin and an inorganic filler material. At least one of the reflection intensity of electromagnetic waves in a prescribed frequency range that pass through the window and reach the sheet and the reflection intensity of electromagnetic waves in a prescribed frequency range that pass through the sheet and reach the window is lower than the reflection intensity of electromagnetic waves in a prescribed frequency range that pass through the window when either one of the first surface and the second surface, or both the first surface and the second surface, are in contact with air. The matrix resin is a thermoplastic resin or a thermosetting resin.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:窗</p>
        <p type="p">W:電波(入射波)</p>
        <p type="p">W5,W6:反射波</p>
        <p type="p">W7:穿透波</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="675" publication-number="202615552">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615552</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111395</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性組合物及半導體絕緣膜形成劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08G77/14</main-classification>
        <further-classification edition="200601120260102B">C08L83/04</further-classification>
        <further-classification edition="200601120260102B">H01L21/316</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商琳得科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森瑶子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, YOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邉康貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, YASUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森岡孝至</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIOKA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>合田英生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GODA, HIDEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種硬化性組合物以及半導體絕緣膜形成劑，該硬化性組合物含有下述(A)成分與(B)成分，其在23℃的黏度為1,000mPa．s以下。  &lt;br/&gt;(A)成分：一種具有以下述式(a-1)表示的重複單元[重複單元(1)]的矽烷化合物聚合物，  &lt;br/&gt;&lt;img align="absmiddle" height="47px" width="332px" file="ed10012.JPG" alt="ed10012.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[R&lt;sup&gt;1&lt;/sup&gt;表示氫原子、無取代的烴基，或具有取代基的烴基]  &lt;br/&gt;(B)成分：滿足下述要件1及要件2的溶劑。  &lt;br/&gt;要件1：與水形成共沸物的溶劑  &lt;br/&gt;要件2：聚醚系溶劑</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="676" publication-number="202615616">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615616</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111418</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黏著片材及可撓性裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260112B">C09J7/30</main-classification>
        <further-classification edition="200601120260112B">C09J133/08</further-classification>
        <further-classification edition="200601120260112B">C09J11/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒井良介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木翔悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, SHOGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緒方聡一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGATA, SOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可兼顧優異之彎曲回復性與較高之抓固力之黏著片材。又，本發明提供一種具備此種黏著片材之可撓性裝置。  本發明之實施方式之黏著片材係包含基材及黏著劑層者，且其包含與該黏著劑層之該基材側之表面接觸之填料，該黏著劑層包含由丙烯酸系黏著劑組合物所形成之丙烯酸系黏著劑，該丙烯酸系黏著劑組合物包含丙烯酸系聚合物、丙烯酸系低聚物、及2種以上之交聯劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基材</p>
        <p type="p">11:主基材層</p>
        <p type="p">12a:表面層</p>
        <p type="p">20:黏著劑層</p>
        <p type="p">30a:填料</p>
        <p type="p">100:黏著片材</p>
        <p type="p">d2:粒徑</p>
        <p type="p">D2:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="677" publication-number="202615356">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615356</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111507</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有窄尺寸分散之SWIR吸收性InAs量子點的合成</chinese-title>
        <english-title>SYNTHESIS OF SWIR ABSORBING INAS QUANTUM DOTS WITH NARROW SIZE DISPERSION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C01G1/00</main-classification>
        <further-classification edition="200601120260102B">C01G15/00</further-classification>
        <further-classification edition="200601120260102B">C30B29/40</further-classification>
        <further-classification edition="200601120260102B">C30B29/60</further-classification>
        <further-classification edition="200601120260102B">C30B7/14</further-classification>
        <further-classification edition="201101120260102B">B82Y15/00</further-classification>
        <further-classification edition="201101120260102B">B82Y20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商納諾柯技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANOCO TECHNOLOGIES LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈利斯　詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARRIS, JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊瑪薩米　帕席班</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMASAMY, PARTHIBAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施聶德　朱里恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHNEIDER, JULIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種合成大InAs膠體量子點的方法，該方法包含：在反應容器中提供小InAs膠體量子點；提供In-Zn-As原料；將該反應容器加熱至生長溫度；在維持該生長溫度的同時將該In-Zn-As原料以生長添加速率添加至該反應容器中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a method of synthesising large InAs colloidal quantum dots, the method comprising: providing small InAs colloidal quantum dots in a reaction vessel; providing a In-Zn-As feedstock; heating the reaction vessel to a growth temperature; adding the In-Zn-As feedstock to the reaction vessel at a growth addition rate while maintaining the growth temperature.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="678" publication-number="202615404">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615404</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111515</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於形成聚醯亞胺之經取代之鄰硝基苄基光鹼產生劑</chinese-title>
        <english-title>SUBSTITUTED O-NITROBENZYLIC PHOTOBASE GENERATORS FOR POLYIMIDE FORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C271/12</main-classification>
        <further-classification edition="200601120260102B">C07D207/27</further-classification>
        <further-classification edition="200601120260102B">C07D307/38</further-classification>
        <further-classification edition="200601120260102B">C09K3/00</further-classification>
        <further-classification edition="200601120260102B">C09B23/14</further-classification>
        <further-classification edition="200601120260102B">C09B51/00</further-classification>
        <further-classification edition="200601120260102B">C09B57/00</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/038</further-classification>
        <further-classification edition="200601120260102B">G03F7/16</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郑世俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, SHIJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁新亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DING, XINLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達薩裡　拉古納特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DASARI, RAGHUNATH R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚　𦭑莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAJOTO, TISSA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西野晃太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHINO, KOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大塚薫平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKA, KUMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示係關於包括經取代之鄰硝基苄基部分、可見光吸收部分及連接體複合物之光鹼產生劑。將可見光施加至該光鹼產生劑可提供用於製造聚醯亞胺之鹼性實體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to photobase generators including a substituted o-nitrobenzylic moiety, a visible light absorbing moiety, and a linker complex. Application of visible light to the photobase generator may provide a basic entity for manufacturing a polyimide.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="679" publication-number="202616811">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616811</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111813</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250901B">H10B10/00</main-classification>
        <further-classification edition="202501120250901B">H10D89/10</further-classification>
        <further-classification edition="202001120250901B">G06F30/392</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　露</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, LU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖　思雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　建隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, KIAN-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王屏薇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳亭昀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TING-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張永廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YUNG-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種裝置，包括基板，該基板具有第一側及第二側；第一電晶體及第二電晶體，其形成在第一側上的第一層級中；第三電晶體、第四電晶體、第五電晶體、及第六電晶體，其形成在第一側上的第二層級中；第一互連結構、第二互連結構、第三互連結構、及第四互連結構，其形成在第二側上，第一互連結構及第二互連結構各個用以承載供應電壓，第三及第四互連結構各個用以承載地面電壓；及電源結構，其垂直延伸穿過第一層級及第二層級，並用以將第三電晶體之源極/汲極端子及第四電晶體之源極/汲極端子分別電耦接至第三互連結構及第四互連結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device includes a substrate having a first side and a second side; a first transistor and a second transistor formed in a first level on the first side; a third transistor, a fourth transistor, a fifth transistor, and a sixth transistor formed in a second level on the first side; a first interconnect structure, a second interconnect structure, a third interconnect structure, and a fourth interconnect structure formed on the second side, the first and second interconnect structures each configured to carry a supply voltage, and the third and fourth interconnect structures each configured to carry a ground voltage; and a power structure vertically extending through the first and second levels, and configured to electrically couple a source/drain terminal of the third transistor and a source/drain terminal of the fourth transistor to the third interconnect structure and the fourth interconnect structure, respectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:佈局</p>
        <p type="p">201:邊界</p>
        <p type="p">210~220:主動區</p>
        <p type="p">230:閘極結構</p>
        <p type="p">230A~230B:閘極部分</p>
        <p type="p">240:閘極結構</p>
        <p type="p">240A~240B:閘極部分</p>
        <p type="p">242:介電結構</p>
        <p type="p">244:壁結構</p>
        <p type="p">246:隔離結構</p>
        <p type="p">248:隔離結構</p>
        <p type="p">250~260:MD(源極/汲極接觸結構)</p>
        <p type="p">270:內部接觸結構</p>
        <p type="p">272:BM0軌道(互連結構)</p>
        <p type="p">273:BVG(通孔結構)</p>
        <p type="p">274:內部接觸結構</p>
        <p type="p">276:BM0軌道(互連結構)</p>
        <p type="p">277:BVG(通孔結構)</p>
        <p type="p">280~286:BM0軌道(互連結構)</p>
        <p type="p">287~289:BVD(通孔結構)</p>
        <p type="p">291~293:BVD(通孔結構)</p>
        <p type="p">DMY1:電晶體</p>
        <p type="p">DMY2:電晶體</p>
        <p type="p">PU1:電晶體</p>
        <p type="p">PU2:電晶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="680" publication-number="202615617">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615617</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111849</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黏著片材、構造體、構造體之製造方法及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260112B">C09J7/30</main-classification>
        <further-classification edition="201801120260112B">C09J7/40</further-classification>
        <further-classification edition="200601120260112B">C09J11/06</further-classification>
        <further-classification edition="200601120260112B">B32B27/30</further-classification>
        <further-classification edition="200601120260112B">H01L21/683</further-classification>
        <further-classification edition="200601120260112B">H01L21/301</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金田有義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEDA, ARIYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊倉健太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAKURA, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本田哲士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONDA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東別府優樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIGASHIBEPPU, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種即便於經過高溫之加熱處理之情形時，黏著劑層之投錨性亦較佳之具有加熱易剝離性之黏著片材。黏著片材依序包含基材層、樹脂層、及黏著劑層。上述樹脂層之一面與上述基材層相接，另一面與上述黏著劑層相接。又，上述黏著劑層包含聚合物A及熱聚合起始劑。又，上述聚合物A包含乙烯性不飽和基。又，上述黏著劑層中之上述熱聚合起始劑之含量相對於上述聚合物100重量份為0.01重量份以上。又，上述基材層於200℃下加熱10分鐘之熱收縮試驗中之熱收縮率未達1%。又，上述樹脂層包含含胺基之聚合物B及環氧系化合物。並且，上述環氧系化合物相對於上述聚合物B 100重量份包含1～15重量份。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:黏著片材</p>
        <p type="p">1A:接著面</p>
        <p type="p">1B:背面</p>
        <p type="p">10:基材層</p>
        <p type="p">10A:第1面</p>
        <p type="p">10B:第2面</p>
        <p type="p">15:樹脂層</p>
        <p type="p">15A:第1面</p>
        <p type="p">15B:第2面</p>
        <p type="p">20:黏著劑層</p>
        <p type="p">20A:黏著劑層之表面</p>
        <p type="p">30:剝離襯墊</p>
        <p type="p">50:附剝離襯墊之黏著片材</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="681" publication-number="202615515">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615515</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111925</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚合物組成物及含有其之醫療用黏接劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F220/30</main-classification>
        <further-classification edition="200601120260102B">C08L33/04</further-classification>
        <further-classification edition="200601120260102B">C09J133/00</further-classification>
        <further-classification edition="200601120260102B">A61L24/00</further-classification>
        <further-classification edition="200601120260102B">A61L24/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東洋紡股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOBO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木坂和貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISAKA, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西口靖子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIGUCHI, YASUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小柳英里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOYANAGI, ERI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明課題在於提供一種對於濕潤狀態之材料具有更高的黏接強度之醫療用黏接劑。&lt;br/&gt;  前述課題能夠藉由一種聚合物組成物及含有其之醫療用黏接劑來解決，該聚合物組成物含有共聚合聚合物、及醇系溶劑，該共聚合聚合物含有化學式(1-A)表示之單體(A)、為不屬於式(1-A)之化合物且漢森溶解度參數(HSP值)為第1特定範圍內之單體B、及為不屬於式(1-A)之化合物且漢森溶解度參數(HSP值)為第2特定範圍內之單體C作為構成成分。&lt;br/&gt;&lt;img align="absmiddle" height="71px" width="243px" file="ed10015.JPG" alt="ed10015.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;  [式中，R表示氫原子或甲基，L表示醯胺鍵、酯鍵或直接鍵結，Z表示直接鍵結或碳數1~10的伸烷基，y表示1~5的整數。]</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="682" publication-number="202615681">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615681</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112001</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體製造設備用零件以及其再生方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C23C14/50</main-classification>
        <further-classification edition="200601120260102B">C23C16/458</further-classification>
        <further-classification edition="200601120260102B">H01L21/3065</further-classification>
        <further-classification edition="200601120260102B">H01L21/31</further-classification>
        <further-classification edition="200601120260102B">H01L21/683</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本碍子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGK INSULATORS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小島充</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOJIMA, MITSURU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森岡育久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIOKA, IKUHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體製造設備用零件10包括：在上表面具有晶圓載置面26之第一陶瓷板21、配置於第一陶瓷板21的下表面之第二陶瓷板22、存在第一陶瓷板21與第二陶瓷板22之間的第一非晶質層24。第一陶瓷板21的耐腐蝕性比氧化鋁以及第二陶瓷板22的耐腐蝕性更高。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體製造設備用零件</p>
        <p type="p">20:陶瓷板積層體</p>
        <p type="p">21:第一陶瓷板</p>
        <p type="p">22:第二陶瓷板</p>
        <p type="p">23:第三陶瓷板</p>
        <p type="p">24:第一非晶質層</p>
        <p type="p">25:第二非晶質層</p>
        <p type="p">26:晶圓載置面</p>
        <p type="p">26a:密封帶</p>
        <p type="p">26b:圓形小突起</p>
        <p type="p">26c:基準面</p>
        <p type="p">27:吸附電極</p>
        <p type="p">28:加熱器電極</p>
        <p type="p">30:冷卻板</p>
        <p type="p">32:冷媒流道</p>
        <p type="p">40:接著片</p>
        <p type="p">W:晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="683" publication-number="202615150">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615150</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112060</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣體狀物質熱分解裝置及氣體狀物質熱分解裝置層積體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260102B">B01J35/50</main-classification>
        <further-classification edition="202401120260102B">B01J35/54</further-classification>
        <further-classification edition="201901120260102B">B32B7/027</further-classification>
        <further-classification edition="200601120260102B">C01B3/02</further-classification>
        <further-classification edition="200601120260102B">C01B3/04</further-classification>
        <further-classification edition="200601120260102B">C01B3/32</further-classification>
        <further-classification edition="201601120260102B">H01M8/0606</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人東京大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE UNIVERSITY OF TOKYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商都卡洛股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOCALO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日揮世界股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKKI-UNIVERSAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木雄二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李敏赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MINHYEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐南恒佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANAMI, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高木海人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAGI, KAITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土生陽一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HABU, YOICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浅木森遊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAKIMORI, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田口研良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAGUCHI, KENSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>間島悠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAJIMA, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塩田啓介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIOTA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辻一誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUJI, ISSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種氣體狀物質熱分解裝置及氣體狀物質熱分解裝置層積體，導熱效率與觸媒層溫度控制性都較高，壓力損失較小，小型且熱容量較小。  &lt;br/&gt;　　[解決手段] 一種氣體狀物質熱分解裝置(100)，具備：導熱基板構造(10)、熔射觸媒載體(12)，是形成在導熱基板構造(10)之一邊的主面上、觸媒材料(14)，是被熔射觸媒載體(12)所支撐，藉由來自導熱基板構造(10)的熱能，分解氣體狀物質的至少一部分、以及框體(16)，是包覆導熱基板構造(10)與熔射觸媒載體(12)與觸媒材料(14)，並形成有使氣體狀物質通過的空間；還有，將氣體狀物質熱分解裝置(100)層積多個而成的氣體狀物質熱分解裝置層積體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:導熱基板構造</p>
        <p type="p">12:熔射觸媒載體</p>
        <p type="p">14:觸媒材料</p>
        <p type="p">16:框體</p>
        <p type="p">18:壁面</p>
        <p type="p">20:吸氣口</p>
        <p type="p">21:吸氣口</p>
        <p type="p">22:排氣口</p>
        <p type="p">23:排氣口</p>
        <p type="p">100:氣體狀物質熱分解裝置</p>
        <p type="p">H:距離</p>
        <p type="p">h:高度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="684" publication-number="202616690">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616690</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112065</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用者設備處基於射線追蹤組態的射線追蹤</chinese-title>
        <english-title>RAY-TRACING AT A USER EQUIPMENT BASED ON RAY TRACING CONFIGURATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260109B">H04B17/391</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷札拉　穆罕默德艾莉穆罕默德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRZALLAH, MOHAMMED ALI MOHAMMED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JO</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷迪　瓦倫阿瑪爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REDDY, VARUN AMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的態樣係關於與模型化一環境中的一或多個無線通道相關聯的一射線追蹤(RT)程序之RT組態（例如，RT參數，諸如反射次數、折射（穿過牆壁的透射）、繞射、散射類型/模型化等）。在一個態樣中，一種使用者設備(UE)基於該環境之一模型及一各別RT組態執行該RT程序。該UE將基於該RT程序之一RT報告傳輸至一網路組件（例如，數位孿生體(DT)實體、位置管理功能(LMF)、或感知管理功能(SnMF)），然後該網路組件可利用該RT報告來更新該環境之一數位孿生體(DT)。這些態樣可提供各種技術優勢，例如更有效率的RT程序、更高品質的RT程序、更準確的DT模型化等。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Aspects of the disclosure are directed to ray-tracing (RT) configurations (e.g., RT parameters such as the number of reflections, refractions (transmissions through walls), diffractions, scattering type/modeling, etc., and so on) for a RT procedure associated with modeling one or more wireless channels in an environment. In an aspect, a user equipment (UE) performs the RT procedure based on a model of the environment and a respective RT configuration. The UE transmits a RT report based on the RT procedure to a network component (e.g., a digital twin (DT) entity, location management function (LMF), or sensing management function (SnMF)), which may then utilize the RT report to update a digital twin (DT) of the environment. Such aspects may provide various technical advantages, such as more efficient RT procedures, higher quality RT procedures, more accurate DT modeling, etc.</p>
      </isu-abst>
      <representative-img>
        <p type="p">302:使用者設備(UE)</p>
        <p type="p">900:程序</p>
        <p type="p">910:步驟</p>
        <p type="p">920:步驟</p>
        <p type="p">930:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="685" publication-number="202615245">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615245</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112083</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>片材</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">B32B5/22</main-classification>
        <further-classification edition="202201120260105B">B22F1/062</further-classification>
        <further-classification edition="200601120260105B">C08J5/18</further-classification>
        <further-classification edition="200601120260105B">C08K7/06</further-classification>
        <further-classification edition="200601120260105B">H01L23/373</further-classification>
        <further-classification edition="200601120260105B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>垣内良蔵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAITO, RYOZO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豊岡健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOOKA, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川口順二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAGUCHI, JUNJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題為提供一種在熱硬化性化合物的硬化溫度以上的溫度下實施熱壓處理時能夠形成導熱性優異的導熱性片材之片材。本發明的片材為包含金屬奈米線及熱硬化性化合物之片材，其中，金屬奈米線的氧化率為5.0%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">4:金屬</p>
        <p type="p">10:金屬奈米線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="686" publication-number="202615234">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615234</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112099</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>膜形成設備、膜形成方法、及物件之製造方法</chinese-title>
        <english-title>FILM FORMING APPARATUS, FILM FORMING METHOD, AND MANUFACTURING METHOD OF ARTICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B29C35/08</main-classification>
        <further-classification edition="200601120260102B">B29C59/02</further-classification>
        <further-classification edition="200601120260102B">G03F7/00</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山川雄士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAKAWA, YUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種膜形成設備，被組構成用以在基板上形成可固化組成物膜。該膜形成設備包括：固持單元，被組構成用以固持該基板；光照射單元，被組構成用以照射固化該可固化組成物之光；驅動單元，被組構成用以驅動以改變該固持單元與該光照射單元之間的相對位置；及控制單元，被組構成用以控制該驅動單元之驅動及該光照射單元依基於在其中由該光照射單元照射該光的區域中之該光的照度分佈而照射該光的定時。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A film forming apparatus configured to form a film of a curable composition on a substrate. The film forming apparatus comprises a holding unit configured to hold the substrate, a light irradiation unit configured to irradiate light that cures the curable composition, a drive unit configured to drive so as to change a relative position between the holding unit and the light irradiation unit, and a control unit configured to control driving of the drive unit and timing at which the light irradiation unit irradiates the light based on an illuminance distribution of the light in a region in which the light is irradiated by the light irradiation unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:積層板</p>
        <p type="p">2:固持單元</p>
        <p type="p">3:光照射單元</p>
        <p type="p">4:驅動單元</p>
        <p type="p">5:照度測量單元</p>
        <p type="p">6:第一表面板</p>
        <p type="p">7:基座</p>
        <p type="p">8:第一支撐柱</p>
        <p type="p">9:第二表面板</p>
        <p type="p">10:構件運送單元</p>
        <p type="p">100:膜形成設備</p>
        <p type="p">200:控制單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="687" publication-number="202616478">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616478</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112432</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具備透鏡區之半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE WITH LENS REGION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250617B">H01L23/00</main-classification>
        <further-classification edition="200601120250617B">H01L23/528</further-classification>
        <further-classification edition="200601120250617B">H01L23/48</further-classification>
        <further-classification edition="200601120250617B">H01L23/58</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦佑鎭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, WOOJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置包括：一半導體基體；複數個標準胞元，其安置於一第一方向及一第二方向上；複數個信號互連件，其安置於該半導體基體之該上表面上之一上絕緣層中，且與該等複數個標準胞元耦接；以及複數個電力互連件，其安置於該半導體基體之一下表面上且與該等複數個標準胞元之至少一部分耦接。該第一方向及該第二方向平行於該半導體基體之一上表面。來自該等複數個標準胞元當中之至少一目標標準胞元包括一目標接腳。僅包括該上絕緣層之一透鏡區在垂直於該半導體基體之該上表面的一第三方向上安置於該目標接腳之至少一部分區上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a semiconductor substrate, a plurality of standard cells disposed in a first direction and a second direction, a plurality of signal interconnections disposed in an upper insulating layer on the upper surface of the semiconductor substrate and coupled with the plurality of standard cells, and a plurality of power interconnections disposed on a lower surface of the semiconductor substrate and coupled with at least a portion of the plurality of standard cells. The first direction and the second direction are parallel to an upper surface of the semiconductor substrate. At least one target standard cell from among the plurality of standard cells includes a target pin. A lens region including only the upper insulating layer is disposed on at least a partial region of the target pin in a third direction perpendicular to the upper surface of the semiconductor substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:半導體裝置</p>
        <p type="p">201:半導體基體</p>
        <p type="p">202:基體絕緣層</p>
        <p type="p">205:元件區</p>
        <p type="p">210:上絕緣層</p>
        <p type="p">211:第一上絕緣層</p>
        <p type="p">212:第二上絕緣層</p>
        <p type="p">213:第三上絕緣層</p>
        <p type="p">214:第四上絕緣層</p>
        <p type="p">215:第五上絕緣層</p>
        <p type="p">216:第六上絕緣層</p>
        <p type="p">217:第七上絕緣層</p>
        <p type="p">218:第八上絕緣層</p>
        <p type="p">219:第九上絕緣層</p>
        <p type="p">BL:背層互連區</p>
        <p type="p">DL:虛設互連件、虛設線</p>
        <p type="p">FL:前層互連區</p>
        <p type="p">FL1:第一前層互連層</p>
        <p type="p">FL2:第二前層互連層</p>
        <p type="p">FL3:第三前層互連層</p>
        <p type="p">FL4:第四前層互連層</p>
        <p type="p">FL5:第五前層互連層</p>
        <p type="p">FL6:第六前層互連層</p>
        <p type="p">FL7:第七前層互連層</p>
        <p type="p">FL8:第八前層互連層</p>
        <p type="p">FL9:第九前層互連層</p>
        <p type="p">LA:透鏡區</p>
        <p type="p">PIN:目標接腳</p>
        <p type="p">SL:信號互連件</p>
        <p type="p">SV:信號通孔</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
        <p type="p">Z:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="688" publication-number="202615678">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615678</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112472</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>塗層製造方法及由此製造的耐電漿部件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">C23C14/08</main-classification>
        <further-classification edition="200601120260108B">C23C14/06</further-classification>
        <further-classification edition="200601120260108B">C23C14/02</further-classification>
        <further-classification edition="200601120260108B">C23C14/30</further-classification>
        <further-classification edition="200601120260108B">C23C14/22</further-classification>
        <further-classification edition="200601120260108B">C23C14/04</further-classification>
        <further-classification edition="200601120260108B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＫＯＭＩＣＯ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMICO LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳圭祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, GYU-SANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴仁業</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, IN-UP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳周</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴民遇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, MIN-WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭在鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, JAE-HYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王弘來</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HONG RAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李寅行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, IN HAENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邊兒燮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BYEON, IN SEOP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的實施例提供一種塗層製造方法，所述塗層製造方法包括：準備步驟，準備塗覆對象物；第一塗層形成步驟，通過氣溶膠沉積，在所述塗覆對象物上形成鋁（Aluminum）氧化物類、釔（Yttrium）氧化物類或鋯（Zirconium）氧化物類的第一塗層；以及第二塗層形成步驟，通過物理氣相沉積，在所述第一塗層上形成鋁（Aluminum）氧化物類、釔（Yttrium）氧化物類或釔（Yttrium）氟化物類的第二塗層；所述第二塗層包括在所述塗覆對象物表面上沿垂直方向延伸的柱狀晶體的排列。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S400、S410、S420:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="689" publication-number="202615484">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615484</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112490</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>導電性高分子組成物、及其用途</chinese-title>
        <english-title>ELECTRICALLY CONDUCTIVE POLYMER COMPOSITION AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F2/44</main-classification>
        <further-classification edition="200601120260102B">C08L65/00</further-classification>
        <further-classification edition="200601120260102B">C08L71/02</further-classification>
        <further-classification edition="200601120260102B">C09D165/00</further-classification>
        <further-classification edition="200601120260102B">C09D171/02</further-classification>
        <further-classification edition="200601120260102B">C09D201/00</further-classification>
        <further-classification edition="200601120260102B">C09D5/24</further-classification>
        <further-classification edition="200601120260102B">C09J133/00</further-classification>
        <further-classification edition="200601120260102B">C09J165/00</further-classification>
        <further-classification edition="200601120260102B">C09J171/02</further-classification>
        <further-classification edition="200601120260102B">C09J201/00</further-classification>
        <further-classification edition="201801120260102B">C09J7/38</further-classification>
        <further-classification edition="201801120260102B">C09J7/40</further-classification>
        <further-classification edition="200601120260102B">C09J9/02</further-classification>
        <further-classification edition="200601120260102B">H01B1/12</further-classification>
        <further-classification edition="200601120260102B">B32B27/00</further-classification>
        <further-classification edition="201901120260102B">B32B7/025</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東楚股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOSOH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本康敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平山太一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAYAMA, TAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新庄榛花</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINJO, HARUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>箭野裕一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANO, HIROKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">以往周知的導電性材料，有對於黏著劑、樹脂、或脫模劑等之分散性低之課題。為了解決該課題，使用了一種導電性高分子組成物，其含有：含有2個以上的選自由下述通式(1)表示之結構單元、及下述通式(2)表示之結構單元構成之群組中之至少1種的結構單元之聚噻吩(A)、及下述通式(16)表示之聚醚系化合物(B)。  &lt;br/&gt;&lt;img align="absmiddle" height="282px" width="599px" file="ed10019.JPG" alt="ed10019.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="690" publication-number="202615688">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615688</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112525</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C23C16/06</main-classification>
        <further-classification edition="200601120260102B">H01L21/3065</further-classification>
        <further-classification edition="200601120260102B">H01L21/3205</further-classification>
        <further-classification edition="200601120260102B">H01L21/768</further-classification>
        <further-classification edition="200601120260102B">H01L21/285</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂本雅人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石坂忠大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIZAKA, TADAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在形成於基板上的凹部內形成並填充釕膜時防止成膜不良。  &lt;br/&gt;本揭露之基板處理方法係具備下述工序：向形成有凹部的基板供應成膜氣體以於該凹部內形成釕膜，並且在該釕膜向該凹部的填充完成之前停止該成膜氣體向該基板的供應之工序；蝕刻工序，係向該基板供應氧化氣體，以將形成於該凹部的側面的該釕膜氧化並加以去除；還原工序，係向該基板供應為一氧化碳氣體的第1還原氣體，以將殘留在該凹部的底部側的釕膜中由該氧化氣體而被氧化後的表面還原；以及再次向該基板供應該成膜氣體以將該釕膜填充在該凹部之工序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">W:晶圓</p>
        <p type="p">11:基底膜</p>
        <p type="p">12:上層膜</p>
        <p type="p">13:凹部</p>
        <p type="p">14,14A,14B:Ru膜(釕膜)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="691" publication-number="202615998">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615998</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112528</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法、基板處理裝置及電腦記錄媒體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">G03F7/36</main-classification>
        <further-classification edition="200601120260107B">G03F7/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寺下裕一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERASHITA, YUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉原孝介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIHARA, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大塚幸信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKA, YUKINOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小玉輝彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KODAMA, TERUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係獲得良好之含金屬光阻的圖案。  &lt;br/&gt;本發明之基板處理方法包含顯影工序，該顯影工序係將形成有含金屬光阻薄膜並施行了曝光處理及該曝光處理後之加熱處理的基板顯影；該顯影工序包含加熱曝露工序，該加熱曝露工序係在加熱該基板之下，將其曝露在含有弱酸之氣體及噴霧中的至少任一者之氣體環境亦即酸性氣體環境。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:步驟</p>
        <p type="p">S2:步驟</p>
        <p type="p">S3:步驟</p>
        <p type="p">S4:步驟</p>
        <p type="p">S5:步驟</p>
        <p type="p">S6:步驟</p>
        <p type="p">S7:步驟</p>
        <p type="p">S7a:步驟</p>
        <p type="p">S7b:步驟</p>
        <p type="p">S7c:步驟</p>
        <p type="p">S7d:步驟</p>
        <p type="p">S8:步驟</p>
        <p type="p">S9:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="692" publication-number="202616492">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616492</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112622</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及製造電子裝置的方法</chinese-title>
        <english-title>ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H01L23/31</main-classification>
        <further-classification edition="200601120260109B">H01L23/00</further-classification>
        <further-classification edition="200601120260109B">H01L23/498</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商安靠科技新加坡控股私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴大洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, DAE YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江亨義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, HYEONG IL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金吉江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, GI JEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊智妍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JI YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫權守</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANG, KWANG SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置包含嵌入式模塊，所述嵌入式模塊包含模塊組件，所述模塊組件包括第一端子和第二端子。第一模塊基板通過第一接合層耦合到所述第一端子，並且第二模塊基板通過第二接合層耦合到所述第二組件端子。模塊囊封物覆蓋所述模塊組件以及所述第一和第二模塊基板。第一裝置基板耦合到所述第一模塊基板並且第二裝置基板耦合到所述第二模塊基板。裝置端子耦合到所述模塊組件，並且裝置囊封物覆蓋所述嵌入式模塊、所述裝置端子以及所述第一和第二裝置基板。所述第一接合層包含第一燒結材料，所述第二接合層包含第二燒結材料，並且所述第一裝置基板和所述裝置端子的部分從所述裝置囊封物暴露。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes an embedded module including a module component comprising a first terminal and a second terminal. A first module substrate is coupled to the first terminal with a first bonding layer and a second module substrate is coupled to the second component terminal with a second bonding layer. A module encapsulant covers the module component and the first and second module substrates. A first device substrate is coupled to the first module substrate and a second device substrate is coupled to the second module substrate. Device terminals are coupled to the module component and a device encapsulant covers the embedded module, the device terminals, and the first and second device substrates. The first bonding layer includes a first sintering material, the second bonding layer includes a second sintering material, and portions of the first device substrate and the device terminals are exposed from the device encapsulant.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電子裝置</p>
        <p type="p">11:嵌入式模塊</p>
        <p type="p">12:裝置基板</p>
        <p type="p">13:裝置基板</p>
        <p type="p">14:裝置端子</p>
        <p type="p">15:裝置囊封物</p>
        <p type="p">111:第一模塊基板</p>
        <p type="p">112:第二模塊基板</p>
        <p type="p">113b:導電黏著劑</p>
        <p type="p">113t:導電黏著劑</p>
        <p type="p">114:模塊囊封物</p>
        <p type="p">115:模塊組件</p>
        <p type="p">121:向內金屬層</p>
        <p type="p">121i:向內端子</p>
        <p type="p">121t:跡線</p>
        <p type="p">122:向外金屬層</p>
        <p type="p">123:芯層</p>
        <p type="p">131:向內金屬層</p>
        <p type="p">131i:向內端子</p>
        <p type="p">131t:跡線</p>
        <p type="p">132:向外金屬層</p>
        <p type="p">133:芯層</p>
        <p type="p">1111:導電結構</p>
        <p type="p">1111i:向內端子</p>
        <p type="p">1111o:向外端子</p>
        <p type="p">1111t:跡線</p>
        <p type="p">1121:導電結構</p>
        <p type="p">1121o:向外端子</p>
        <p type="p">1121t:向內端子</p>
        <p type="p">1151:組件端子</p>
        <p type="p">1152:組件端子</p>
        <p type="p">1153:組件端子</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="693" publication-number="202616937">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616937</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112648</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置及包含其之電子裝置</chinese-title>
        <english-title>DISPLAY DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">H10K59/131</main-classification>
        <further-classification edition="200601120260102B">G09F9/33</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星顯示器有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曺永振</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, YOUNG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文重守</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOON, JOONG SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李敏九</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MIN KU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李勝熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEUNG HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙恩星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, EUN BYUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置，包含：一焊墊區域，位於一基板的一非顯示區域；一第一群組焊墊及一第二群組焊墊，位於一焊墊區域中；及一走線，位於該基板上，並從該顯示區域電性連接至該第一群組焊墊及該第二群組焊墊，其中，該走線包含：一第一走線，延伸至該第一群組焊墊；及一第二走線，延伸至該第二群組焊墊；該第一走線及該第二走線相鄰，該第一走線包含一第一中間部分，在與作為一水平方向的一第一方向交叉的一第二方向上延伸，而該第二走線包含一第二中間部分，該第二中間部分相鄰且平行於該第一中間部分，且該第一中間部分及該第二中間部分位於該第一群組焊墊及該第二群組焊墊之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device includes: a pad area in a non-display area of a substrate; a first cluster pad and a second cluster pad in a pad area; and routing lines on the substrate and electrically connected from the display area to the first cluster pad and the second cluster pad, wherein the routing lines include a first routing line extending to the first cluster pad and a second routing line extending to the second cluster pad, the first routing line and the second routing line are adjacent, the first routing line includes a first middle portion extending in a second direction crossing a first direction that is a horizontal direction, and the second routing line includes a second middle portion adjacent to and parallel to the first middle portion, and the first middle portion and the second middle portion are between the first cluster pad and the second cluster pad.</p>
      </isu-abst>
      <representative-img>
        <p type="p">DA:顯示區域</p>
        <p type="p">DR1:第一方向</p>
        <p type="p">DR2:第二方向</p>
        <p type="p">DR3:第三方向</p>
        <p type="p">DRL:資料走線</p>
        <p type="p">PA:焊墊區域</p>
        <p type="p">PD1:第一群組焊墊</p>
        <p type="p">PD2:第二群組焊墊</p>
        <p type="p">VDD1:第一電壓線</p>
        <p type="p">VDD2:第二電壓線</p>
        <p type="p">VSS:共用線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="694" publication-number="202616530">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616530</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112726</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路封裝及形成其的方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251023B">H01L25/065</main-classification>
        <further-classification edition="200601120251023B">H01L23/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林建璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIEN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張弘旻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HUNG-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭軒呈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, HSUAN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁威威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, WEI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一些實施例中，裝置包括封裝基底第一側上的中介層元件上晶片，以及封裝基底的第一側上的第一環狀結構。第一環狀結構延伸圍繞中介層元件上晶片的周邊。封蓋可能配置在第一環狀結構上。裝置更包括封裝基底的第二側上的連接器的陣列，其中封裝基底第二側相對於封裝基底第一側。第二環狀結構可能在封裝基底第二側上。第二環狀結構定位圍繞在連接器的陣列的周邊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In some embodiments, a device includes a chip-on-interposer component on a first side of a package substrate, and a first ring structure on the first side of the package substrate. The first ring structure extends around a perimeter of the chip-on-interposer component. A lid may be disposed on the first ring structure. The device may also include an array of connectors on a second side of the package substrate, wherein the second side of the package substrate is opposite a first side of the package substrate. A second ring structure may be on the second side of the package substrate. The second ring structure is positioned around a perimeter of the array of connectors.</p>
      </isu-abst>
      <representative-img>
        <p type="p">109:重分佈層中介層</p>
        <p type="p">116、135:底部填充材</p>
        <p type="p">117:封裝體</p>
        <p type="p">120:積體電路裝置</p>
        <p type="p">125:邏輯元件</p>
        <p type="p">129:銲錫凸塊</p>
        <p type="p">130:記憶體元件</p>
        <p type="p">137:封裝基底</p>
        <p type="p">140、300:環狀結構</p>
        <p type="p">150:接合件</p>
        <p type="p">200:中介層元件上晶片</p>
        <p type="p">299:黏著層</p>
        <p type="p">323:連接器</p>
        <p type="p">373:黏著材料</p>
        <p type="p">374:熱介面材料</p>
        <p type="p">375:封蓋</p>
        <p type="p">H1、H2:高度</p>
        <p type="p">S1:第一側</p>
        <p type="p">S2:第二側</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="695" publication-number="202616474">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616474</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112732</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用低頻射頻（ＬＦＲＦ）處理之碳間隙填充的緻密化</chinese-title>
        <english-title>DENSIFICATION OF CARBON GAPFILL USING LOW FREQUENCY RADIO FREQUENCY (LFRF) TREATMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/768</main-classification>
        <further-classification edition="200601120260102B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加達米迪　瓦姆西克里希納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GADDAMEDI, VAMSHI KRISHNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林姿妤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TZE-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納加拉詹　阿南沙文卡塔拉曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGARAJAN, ANANTHA VENKATARAMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王珮琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PEIQI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克哈嘉　艾比杜亞西斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHAJA, ABDUL AZIZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　尤義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, EWING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供了促進高品質碳間隙填充結構的形成並解決與習知碳間隙填充方法相關的問題的方法和設備。在某些實施例中，本文描述的碳間隙填充方法和設備利用低頻射頻(LFRF)偏壓電漿處理來用高品質和高密度的碳膜來對結構進行間隙填充。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides methods and apparatus that facilitate the formation of high-quality carbon gapfill structures and that address the issues related to conventional carbon gapfill methods. In certain embodiments, the carbon gapfill methods and apparatus described herein utilize a low frequency radio frequency (LFRF) biased plasma treatment to gapfill structures with high-quality and high-density carbon films.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:方法</p>
        <p type="p">205:操作</p>
        <p type="p">210:操作</p>
        <p type="p">215:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="696" publication-number="202615835">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615835</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112780</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及基板處理裝置中之密封構件之異常檢測方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">G01M3/38</main-classification>
        <further-classification edition="201701120260107B">G06T7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡辺友樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於基板處理裝置及基板處理裝置中之密封構件之異常檢測方法，適當地檢測密封構件的異常。該基板處理裝置，具備處理容器、密封構件、照明部、及拍攝部。處理容器，具有可彼此結合之第1構件及第2構件，使第2構件移動而與第1構件結合，藉以在內部形成將基板予以處理的處理空間。密封構件，設置於第1構件及第2構件的其中一方，在第1構件與第2構件結合時和第1構件及第2構件的其中另一方接觸。照明部，在第1構件與第2構件分離的狀態下，對第1構件及第2構件的其中一方中之密封構件照射光線。拍攝部，拍攝接受到來自照明部之光線的照射之密封構件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">18:乾燥處理單元</p>
        <p type="p">181:處理區域</p>
        <p type="p">182:傳遞區域</p>
        <p type="p">31:容器構件</p>
        <p type="p">31a:處理空間</p>
        <p type="p">31b:搬運口</p>
        <p type="p">31c:面</p>
        <p type="p">32:固持構件</p>
        <p type="p">33:蓋體</p>
        <p type="p">33a:移動機構</p>
        <p type="p">33b:面</p>
        <p type="p">34:開口部</p>
        <p type="p">41:貫通孔</p>
        <p type="p">42:推壓構件</p>
        <p type="p">51:密封構件</p>
        <p type="p">55:照明部</p>
        <p type="p">56:拍攝部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="697" publication-number="202616388">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616388</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112792</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用含碳膜前驅物的蝕刻</chinese-title>
        <english-title>ETCHING USING A CARBON-CONTAINING FILM PRECURSOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/3213</main-classification>
        <further-classification edition="200601120260102B">H01L21/311</further-classification>
        <further-classification edition="200601120260102B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏杜皮　薩加　巴拉岡卡達拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UDYAVARA, SAGAR BALAGANGADHARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬利卡爾　維尼特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MALIEKKAL, VINEET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅伯茨　法蘭西斯　斯隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROBERTS, FRANCIS SLOAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多迪亞　阿什　尼勒什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DODHIA, AARSH NILESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普森科維拉甘　拉杰什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PUTHENKOVILAKAM, RAGESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞迪　卡蒲　瑟利西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REDDY, KAPU SIRISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施羅德　托德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHROEDER, TODD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所揭露的範例係關於使用蝕刻劑與含碳膜前驅物來蝕刻含碳膜。此有助於以比在特徵部內更高的速率，在基板之場區域上蝕刻含碳膜。一範例提供在基板上蝕刻碳膜的方法，該基板包含一特徵部以及與該特徵部相鄰的一場區域，該碳膜沉積在該場區域上以及在該特徵部內。該方法包含使用包含一蝕刻劑與一含碳膜前驅物的一氣體混合物來形成電漿，以產生反應性蝕刻物種以及反應性沉積物種。該方法更包含在蝕刻期間，藉由在該特徵部內沉積碳，以比在該特徵部內更高的速率，在該場區域中蝕刻該碳膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Examples are disclosed that relate to etching carbon-containing films using an etching agent and a carbon-containing film precursor. This helps to etch the carbon-containing film at a higher rate on a field region of the substrate than within a feature. One example provides, on a substrate comprising a feature and a field region adjacent to the feature, a method of etching a carbon film deposited on the field region and within the feature. The method comprises forming a plasma using a gas mixture comprising an etching agent and a carbon-containing film precursor to generate reactive etching species and reactive deposition species. The method further comprises etching the carbon film at a higher rate in the field region than within the feature by depositing carbon within the feature during etching.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:基板</p>
        <p type="p">402:特徵部</p>
        <p type="p">404:特徵部</p>
        <p type="p">406C:碳膜部分</p>
        <p type="p">406D:碳膜部分</p>
        <p type="p">410:場區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="698" publication-number="202615604">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615604</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112795</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>銅油墨、電子電路基板及電子電路基板之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260114B">C09D11/52</main-classification>
        <further-classification edition="200601120260114B">H05K1/09</further-classification>
        <further-classification edition="200601120260114B">H05K3/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＸ金屬股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JX ADVANCED METALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>須賀正太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGA, SHOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河野猛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONO, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種能夠抑制將銅油墨印刷在基板上時之滲出，製作短路少且可靠性高之電路圖案的銅油墨、及使用其之電子電路基板及電子電路基板之製造方法。  &lt;br/&gt;本發明係一種銅油墨，其含有銅粒子，由剪切速度1 sec&lt;sup&gt;-1&lt;/sup&gt;時之黏度η1與剪切速度10 sec&lt;sup&gt;-1&lt;/sup&gt;時之黏度η10之比（η1/η10）所定義的觸變指數TI（1/10）為7.5以下，由應變0.01%時之儲存彈性模數G'與損失彈性模數G''之比（G''/G'）表示的tanδ與觸變指數TI（1/10）滿足以下關係式（1）：tanδ＜-0.15×TI（1/10）＋1.31···（1）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="699" publication-number="202616303">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616303</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112823</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合材料</chinese-title>
        <english-title>COMPOSITE MATERIAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251001B">H01F1/33</main-classification>
        <further-classification edition="200601120251001B">C09K5/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＵＡＣＪ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UACJ CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田大輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">複合材料包括熱傳導率為100W/K・m以上的分散材料、及介於該分散材料彼此之間的絕緣體。例如，該分散材料為鋁基金屬粉末。例如，該絕緣體係玻璃轉化溫度低於或等於該分散材料的熔點之氧化物或樹脂。例如，該複合材料的導電率為0.5×10&lt;sup&gt;6&lt;/sup&gt;S/m以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The composite material includes a dispersed material having a thermal conductivity of 100 W/K·m or more, and an insulator interposed between the dispersed materials. For example, the dispersed material may be a metal powder based on aluminum. The insulator may be an oxide or a resin having a glass transition temperature lower than the melting point of the dispersed material. For example, the electrical conductivity of the composite material may be 0.5×10⁶ S/m or less.&lt;br/&gt; final</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:複合材料</p>
        <p type="p">3:分散材料</p>
        <p type="p">4:絕緣體粉末</p>
        <p type="p">5:絕緣體</p>
        <p type="p">21:原料</p>
        <p type="p">S_A:狀態(Status)A</p>
        <p type="p">S_B:狀態(Status)B</p>
        <p type="p">S_C:狀態(Status)C</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="700" publication-number="202616252">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616252</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112829</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示面板及其電子裝置</chinese-title>
        <english-title>DISPLAY PANEL AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260102B">G09G3/32</main-classification>
        <further-classification edition="202301120260102B">H10K59/131</further-classification>
        <further-classification edition="202301120260102B">H10K59/123</further-classification>
        <further-classification edition="202301120260102B">H10K59/121</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星顯示器有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林采讞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, CHAEYEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張炤榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, SOYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曺永振</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, YOUNGJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙恩星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, EUNBYUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的顯示面板包含：第一像素電路及第二像素電路，係在第一方向上彼此相鄰；第一發光二極體，電性連接於該第一像素電路；第二發光二極體，電性連接於該第二像素電路；第一水平電壓線沿第一方向延伸，並電性連接於第一電晶體的半導體層；第一水平電壓線，沿該第一方向延伸，並電性連接於第一電晶體的半導體層；以及第一閘極線，沿該第一方向延伸，並分別電性連接於該第一像素電路的該第一電晶體的閘極及該第二像素電路的該第二電晶體的閘極。該第一水平電壓線與該第二水平電壓線彼此位於不同層，且在平面圖中彼此重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display panel includes: first and second pixel circuits adjacent to each other in a first direction; a first light-emitting diode (LED) electrically connected to the first pixel circuit; a second LED electrically connected to the second pixel circuit; a first horizontal voltage line extending in the first direction, and electrically connected to a semiconductor layer of a first transistor; a second horizontal voltage line extending in the first direction, and electrically connected to a semiconductor layer of a second transistor; and a first gate line extending in the first direction, and electrically connected to each of a gate electrode of the first transistor of the first pixel circuit and a gate electrode of the second transistor of the second pixel circuit. The first horizontal voltage line and the second horizontal voltage line are at different layers from each other, and overlap with each other in a plan view.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1670:第五連接電極</p>
        <p type="p">CNT7a:第七-第一接觸孔</p>
        <p type="p">CNT7b:第七-第二接觸孔</p>
        <p type="p">PC1:第一像素電路</p>
        <p type="p">PC2:第二像素電路</p>
        <p type="p">PC3:第三像素電路</p>
        <p type="p">IVA:分隔空間</p>
        <p type="p">RP,RP':突起</p>
        <p type="p">HVAL(R):第二-第一初始化水平電壓線</p>
        <p type="p">HVAL(GB):第二-第二初始化水平電壓線</p>
        <p type="p">T7:第二初始化電晶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="701" publication-number="202615851">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615851</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112937</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢測裝置及檢測方法</chinese-title>
        <english-title>INSPECTION APPARATUS AND INSPECTION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250909B">G01N23/2251</main-classification>
        <further-classification edition="200601120250909B">H01L21/67</further-classification>
        <further-classification edition="200601120250909B">H01L21/66</further-classification>
        <further-classification edition="200601120250909B">G02B5/30</further-classification>
        <further-classification edition="200601120250909B">G02B3/00</further-classification>
        <further-classification edition="200601120250909B">G02B19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂定勲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, DING-SHIUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳廣行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUANG-SHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　曉萌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XIAOMENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳建利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIEN-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種檢測裝置，其包括配置為發射電子束的電子束源，以及配置為基於電子束將電子分束投射到目標區域的物鏡組。檢測裝置更包括位於物鏡組與目標區域之間並配置為檢測來自目標區域的背向散射電子分束的偵測器。偵測器包括具有電子分束穿過的開口的基底，以及多個配置在基底上並圍繞開口的感測單元。多個感測單元中的每個感測單元具有相對於基底的法線方向傾斜的法線方向。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An embodiment corresponds to an inspection apparatus that includes an electron beam source configured to emit an electron beam, and an objective lens set configured to project, based on the electron beam, an electron beamlet onto a target area. The inspection apparatus further includes a detector between the objective lens set and the target area and configured to detect backscattered electrons beamlets from the target area. The detector includes a substrate having an opening through which the electron beamlet passes, and a plurality of sensing cells disposed on the substrate and surrounding the opening. Each sensing cell of the plurality of sensing cells has a normal direction tilted with respect to a normal direction of the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子束檢測裝置</p>
        <p type="p">110:電子束源</p>
        <p type="p">120:聚光透鏡</p>
        <p type="p">130:物鏡組</p>
        <p type="p">140:偵測器</p>
        <p type="p">150:晶圓</p>
        <p type="p">152:目標區域</p>
        <p type="p">162:電子束/電子分束</p>
        <p type="p">166:電子分束</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="702" publication-number="202616829">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616829</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113010</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置及製造記憶體單元的方法</chinese-title>
        <english-title>MEMORY DEVICE AND METHOD OF FABRICATING MEMORY CELL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251023B">H10B43/27</main-classification>
        <further-classification edition="202301120251023B">H10B41/27</further-classification>
        <further-classification edition="202501120251023B">H10D64/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱于建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YU-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂文琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, WEN-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭雅云</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YA-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉逸青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YI-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王奕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, ZHIQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李婕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體裝置包括通道層。記憶體裝置包括閘極結構，位於通道層的第一側上，其中閘極結構具有面向通道層的頂表面。記憶體裝置包括汲極結構，位於通道層的與第一側相對的第二側上，其中汲極結構具有與通道層接觸的第底表面。第一底表面在第一橫向方向上與閘極結構的頂表面未覆蓋。記憶體裝置包括源極結構，位於通道層的第二側上且沿第一橫向方向與汲極結構相鄰，其中源極結構具有面向通道層的第二底表面。第二底表面在第一橫向方向上與閘極結構的頂表面重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device includes a channel layer. The memory device includes a gate structure on a first side of the channel layer, where the gate structure has a top surface facing the channel layer. The memory device includes a drain structure on a second side of the channel layer opposite to the first side, where the drain structure has a first bottom surface in contact with the channel layer. The first bottom surface underlaps the top surface of the gate structure across a first lateral direction. The memory device includes a source structure on the second side of the channel layer and adjacent to the drain structure along the first lateral direction, where the source structure has a second bottom surface facing the channel layer. The second bottom surface overlaps the top surface of the gate structure across the first lateral direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:記憶體裝置</p>
        <p type="p">102:基底結構</p>
        <p type="p">103:介電層</p>
        <p type="p">104:記憶體單元</p>
        <p type="p">110:通道層</p>
        <p type="p">124:吸收結構</p>
        <p type="p">126:介電層</p>
        <p type="p">130:吸收層</p>
        <p type="p">132、134:金屬層</p>
        <p type="p">140:汲極結構</p>
        <p type="p">142:源極結構</p>
        <p type="p">152:閘極介電層</p>
        <p type="p">154:閘極結構</p>
        <p type="p">155:WL結構</p>
        <p type="p">178:BVIA結構</p>
        <p type="p">180:BL結構</p>
        <p type="p">192:介電結構</p>
        <p type="p">196、198:介電層</p>
        <p type="p">200:電容器</p>
        <p type="p">AA'、BB':線</p>
        <p type="p">X、Y、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="703" publication-number="202616516">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616516</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113045</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於半導體裝置中之高密度介面連接之混合結合中介層</chinese-title>
        <english-title>HYBRID-BONDED INTERPOSER FOR HIGH-DENSITY INTERFACE CONNECTIONS IN SEMICONDUCTOR DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L23/538</main-classification>
        <further-classification edition="202301120260102B">H01L25/065</further-classification>
        <further-classification edition="202301120260102B">H01L25/16</further-classification>
        <further-classification edition="200601120260102B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商馬維爾亞洲私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARVELL ASIA PTE LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查克拉瓦提　阿特雷亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAKRAVARTI, AATREYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬西安　魯伊斯　卡洛斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACIAN RUIZ, CARLOS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫默爾勒　馬克　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUEMERLE, MARK WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索特　沃夫崗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAUTER, WOLFGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛瑞格里二世　約翰　愛德華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GREGORY JR, JOHN EDWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍姆斯　伊娃　莎赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOLMES, EVA SHAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿基基　薩默</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKIKI, SAMER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布萊克洛　卡津　賽蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLACKLOW, KAZIN SIMON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭挺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝內斯　卡爾　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENES, CARL E</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體封裝件包括：包括具有第一複數個正反器之一第一晶粒至晶粒介面的一第一晶片，及包括具有第二複數個正反器之一第二晶粒至晶粒介面的一第二晶片，及經組態以提供用於資料在該第一晶粒至晶粒介面與該第二晶粒至晶粒介面之間流動的路徑的一中介層。該中介層分別藉由一第一混合結合件及一第二混合結合件機械地耦接至該第一晶片及該第二晶片，該中介層包括跨該第一混合結合件耦接至該第一複數個正反器的第一複數個中介層貫孔、跨該第二混合結合件耦接至該第二複數個正反器的第二複數個中介層貫孔及將該第一複數個中介層貫孔當中之各別貫孔耦接至該第二複數個中介層貫孔當中之各別貫孔以提供該等路徑的複數個側向金屬跡線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor package includes a first chip including a first die-to-die interface with a first plurality of flip-flops, and a second chip including a second die-to-die interface with a second plurality of flip-flops, and an interposer configured to provide paths for data to flow between the first die-to-die interface and the second die-to-die interface. The interposer is mechanically coupled to the first chip and to the second chip by a first hybrid bond and a second hybrid bond, respectively, the interposer including a first plurality of interposer vias coupled to the first plurality of flip-flops across the first hybrid bond, a second plurality of interposer vias coupled to the second plurality of flip-flops across the second hybrid bond, and a plurality of lateral metal traces coupling respective vias among the first plurality of interposer vias to respective vias among the second plurality of interposer vias to provide the paths.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:多晶片模組(MCM)半導體封裝件</p>
        <p type="p">110:第一晶片</p>
        <p type="p">112:第一晶粒至晶粒(D2D)介面</p>
        <p type="p">114、124:長距離介面</p>
        <p type="p">120:第二晶片</p>
        <p type="p">122:第二D2D介面</p>
        <p type="p">130:中介層</p>
        <p type="p">132、136:中介層貫孔</p>
        <p type="p">134:側向金屬跡線</p>
        <p type="p">140:微凸塊</p>
        <p type="p">150:積層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="704" publication-number="202615752">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615752</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113047</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>四線刺繡機</chinese-title>
        <english-title>FOUR-THREAD EMBROIDERY MACHINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251230B">D05C11/10</main-classification>
        <further-classification edition="200601120251230B">D05C11/02</further-classification>
        <further-classification edition="200601120251230B">D05C15/26</further-classification>
        <further-classification edition="200601120251230B">D05C7/00</further-classification>
        <further-classification edition="200601120251230B">D05C5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩洛哥商康尼利藝術服務有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ART SERVICES CORNELY SARL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾特　穆罕默德　阿里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIT MHAMED, ALI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>易定芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關一種機械式刺繡機，其可同時處理四條繡線，因而可產生多色漸變的繁複刺繡圖案。本發明刺繡機結合了改良的系統，既可用於同步化組件、管理繡線張力及防止繡線糾纏，同時可透過一種新穎的J-形彎臂機構，精確控制機針及織物的移動。本發明之刺繡機配備了特定的旋梭與齒輪，可以協調動作及優化刺繡精密度及品質，同時有助調整繡線張力及繡線上的壓力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a mechanical embroidery machine capable of simultaneously handling four threads, enabling the creation of complex embroidered patterns with multiple color transitions. It incorporates an improved system for component synchronization, thread tension management, and prevention of thread entanglement, while allowing precise control of needle and fabric movements through an innovative J-shaped curved arm mechanism. The machine is equipped with specific hooks and gears to coordinate movement and optimize the precision and quality of the embroidery, while also facilitating the adjustment of thread tension and applied pressures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:機架</p>
        <p type="p">100:支撐主控台</p>
        <p type="p">7:線盤機構</p>
        <p type="p">705:導引套筒</p>
        <p type="p">700:線軸支架</p>
        <p type="p">706:齒輪</p>
        <p type="p">701:擺梭床導桿</p>
        <p type="p">706a:齒輪</p>
        <p type="p">702:梭芯</p>
        <p type="p">707:軸桿</p>
        <p type="p">703:叉部</p>
        <p type="p">708:軸桿</p>
        <p type="p">703’:叉部</p>
        <p type="p">709:軸桿</p>
        <p type="p">704:樞轉曲柄</p>
        <p type="p">720:圓筒體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="705" publication-number="202616931">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616931</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113069</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置、包含其之電子設備及製造其之方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE, ELECTRONIC APPARATUS COMPRISING THE SAME AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">H10K10/46</main-classification>
        <further-classification edition="202301120260102B">H10K19/10</further-classification>
        <further-classification edition="202301120260102B">H10K71/10</further-classification>
        <further-classification edition="202301120260102B">H10K71/16</further-classification>
        <further-classification edition="202301120260102B">H10K85/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芝加哥大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE UNIVERSITY OF CHICAGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛　珉洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEOL, MINSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權　俊榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, JUNYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳　嬉堤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RYU, HUIJE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬杜里　托莫吉特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOWDHURY, TOMOJIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴　志雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JIWOONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁策</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, CE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆吉德　法吉亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUJID, FAUZIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容揭露一種包括一二維材料之半導體裝置及製造該半導體裝置之方法。該半導體裝置可包括：一通道層，該通道層包括一二維材料層及位於該二維材料層上之一分子晶體層，該二維材料層包括一二維半導體材料；一源電極及一汲電極，該源電極及該汲電極可分別位於該通道層之二側上；以及一閘極絕緣層及一閘電極，該閘極絕緣層及該閘電極可分別在該源電極與該汲電極之間位於該通道層上。該分子晶體層可包括C&lt;sub&gt;20&lt;/sub&gt;至C&lt;sub&gt;40&lt;/sub&gt;之一板狀芳族化合物，且可具有1個分子層至5個分子層之厚度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device including a two-dimensional material and a method of manufacturing the same are disclosed. The semiconductor device may include a channel layer including a two-dimensional material layer and a molecular crystal layer on the two-dimensional material layer, the two-dimensional material layer including a two-dimensional semiconductor material; a source electrode and a drain electrode, which respectively may be on both sides of the channel layer; and a gate insulating layer and a gate electrode, which respectively may be on the channel layer between the source electrode and the drain electrode. The molecular crystal layer may include a plate-shaped aromatic compound of C&lt;sub&gt;20&lt;/sub&gt;-C&lt;sub&gt;40&lt;/sub&gt;, and may have a thickness of 1 molecular layer to 5 molecular layers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">101:基體</p>
        <p type="p">110:二維材料層</p>
        <p type="p">120:分子晶體層</p>
        <p type="p">130:通道層</p>
        <p type="p">140:閘極絕緣層</p>
        <p type="p">151:源電極</p>
        <p type="p">152:汲電極</p>
        <p type="p">160:閘電極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="706" publication-number="202616032">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616032</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113079</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有動態頻率補償的穩壓電路及其操作方法</chinese-title>
        <english-title>VOLTAGE REGULATOR CIRCUIT WITH DYNAMIC FREQUENCY COMPENSATION AND METHOD FOR OPERATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250701B">G05F1/565</main-classification>
        <further-classification edition="200601120250701B">H02M1/08</further-classification>
        <further-classification edition="200601120250701B">H02M3/156</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴韋霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, WEI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連倍興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIEN, BEI-SHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉思麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SZU-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例係關於一種穩壓電路，其包含一輸入級、一跨導補償級、一驅動級及一回授電路。該輸入級經組態以比較一參考電壓與一回授電壓以在該輸入級之一第一輸出端子處產生一第一電壓。該跨導補償級經組態以回應於該回授電壓之一改變而改變該輸入級之一總跨導。該驅動級經耦合於該穩壓電路之該第一輸出端子與一第二輸出端子之間且經組態以將一驅動電流提供至耦合至一負載之該第二輸出端子。該回授電路經耦合至該第二輸出端子且經組態以基於該穩壓電路之一輸出電壓產生該回授電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A voltage regulator circuit is provided, which includes an input stage, a transconductance compensation stage, a driving stage, and a feedback circuit. The input stage is configured to compare a reference voltage and a feedback voltage to generate a first voltage at a first output terminal of the input stage. The transconductance compensation stage is configured to change an overall transconductance of the input stage in response to a change in the feedback voltage. The driving stage is coupled between the first output terminal and a second output terminal of the voltage regulator circuit, and is configured to provide a driving current to the second output terminal which is coupled to a load. The feedback circuit is coupled to the second output terminal, and is configured to generate the feedback voltage based on an output voltage of the voltage regulator circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:低壓降(LDO)穩壓器</p>
        <p type="p">110:輸入級</p>
        <p type="p">111:輸出端子</p>
        <p type="p">120:跨導補償級</p>
        <p type="p">130:驅動級</p>
        <p type="p">140:回授電路</p>
        <p type="p">150:負載</p>
        <p type="p">N1:節點</p>
        <p type="p">N2:節點</p>
        <p type="p">VDD:電源供應電壓</p>
        <p type="p">VFB:回授電壓</p>
        <p type="p">VN1:電壓訊號</p>
        <p type="p">VOUT:輸出電壓</p>
        <p type="p">VREF:參考電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="707" publication-number="202615689">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615689</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113090</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高解析度直接圖案化沉積光罩清潔方法</chinese-title>
        <english-title>HIGH RESOLUTION DPD MASK CLEANING METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C23C16/06</main-classification>
        <further-classification edition="200601120260102B">C23C16/56</further-classification>
        <further-classification edition="200601120260102B">C23G5/036</further-classification>
        <further-classification edition="200601120260102B">H01J37/36</further-classification>
        <further-classification edition="200601120260102B">B08B3/02</further-classification>
        <further-classification edition="202301120260102B">H10K71/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商伊麥傑公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EMAGIN CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高斯　阿曼庫瑪　Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHOSH, AMALKUMAR P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HOWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙方超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, FANGCHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海魯林　伊葉思　Ｉ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHAYRULLIN, ILYAS I.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種清潔一直接圖案化沉積光罩之方法，其中該光罩具有沉積於其上之包括一有機發光二極體(OLED)材料之至少一有機塗層材料。該方法包含以下步驟：提供一電漿源，用於提供清潔電漿以移除沉積於該光罩上之該OLED材料，其中該電漿源利用選自氬氣(Ar)、氮氣(N&lt;sub&gt;2&lt;/sub&gt;)、氧氣(O&lt;sub&gt;2&lt;/sub&gt;)、氯氣(Cl&lt;sub&gt;2&lt;/sub&gt;)、四氟化碳(CF&lt;sub&gt;x&lt;/sub&gt;)、六氟化鈉(SF&lt;sub&gt;6&lt;/sub&gt;)及三氟化硼(BCl&lt;sub&gt;3&lt;/sub&gt;)之至少一者之一氣體。提供一電漿源之步驟可提供反應離子蝕刻、感應耦合電漿、遠端電漿及其類似者。提供一電漿源之步驟可包含依序提供該等氣體之兩者或更多者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of cleaning a direct patterning deposition mask is provided where the mask has at least an organic coating material comprising an organic light emitting diode (OLED) material deposited thereon. The method includes the steps of providing a plasma source for providing cleaning plasma for removing the OLED material deposited on the mask, wherein the plasma source utilizes a gas selected from at least one of argon (Ar), nitrogen (N&lt;sub&gt;2),&lt;/sub&gt;oxygen (O&lt;sub&gt;2),&lt;/sub&gt;Chlorine (Cl&lt;sub&gt;2,&lt;/sub&gt;) carbon tetrafluoride (CF&lt;sub&gt;x&lt;/sub&gt;), sodium hexafluoride (SF&lt;sub&gt;6&lt;/sub&gt;), and boron trifluoride (BCl&lt;sub&gt;3&lt;/sub&gt;). The step of providing a plasma source may provide reactive ion etching, inductively coupled plasma, remote plasma, and the like. The step of providing a plasma source may include sequentially providing two or more of the gases.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:直接圖案化沉積(dPd)光罩清潔系統</p>
        <p type="p">202:遠端電漿源</p>
        <p type="p">204:活化氣體</p>
        <p type="p">206:活化區</p>
        <p type="p">208:表面</p>
        <p type="p">210:直接圖案化沉積(dPd)蔽蔭光罩</p>
        <p type="p">212:RF或微波輻射</p>
        <p type="p">214:激發區</p>
        <p type="p">216:製程氣體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="708" publication-number="202616331">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616331</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113102</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>真空移轉模組末端執行器的原位清潔</chinese-title>
        <english-title>IN-SITU CLEANING OF A VACUUM TRANSFER MODULE END EFFECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01J37/32</main-classification>
        <further-classification edition="200601120260102B">H01L21/67</further-classification>
        <further-classification edition="200601120260102B">H01L21/677</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施羅德　托德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHROEDER, TODD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普森科維拉甘　拉杰什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PUTHENKOVILAKAM, RAGESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彼得森　希瑟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEDERSEN, HEATHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯派斯　庫爾特　奧古斯都</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPIES, KURT AUGUSTUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多迪亞　阿什　尼勒什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DODHIA, AARSH NILESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普爾　傑瑞米　耶柔米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POOL, JEREMY JEROME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小阿查迪　理查　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADACHI, JR., RICHARD S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫頓　狄倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINDOM, DYLAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>濤磊　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THAULAD, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露用於對末端執行器進行原位電漿的清潔方法和設備。方法包括：將末端執行器從與製程模組附接的真空移轉模組移動至製程模組，將末端執行器定位在氣體分佈板下方，使電漿流過氣體分佈板，將末端執行器曝露於電漿，以及將末端執行器收回至真空移轉模組中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a method and apparatus configured to perform an in-situ plasma cleaning of an end effector. The method comprises moving the end effector into a process module from a vacuum transfer module attached to the process module, positioning the end effector below a gas distribution plate, flowing a plasma over the gas distribution plate, exposing the end effector to the plasma, and retracting the end effector into the vacuum transfer module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:流程圖</p>
        <p type="p">102~124:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="709" publication-number="202616864">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616864</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113133</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251201B">H10D62/10</main-classification>
        <further-classification edition="202501120251201B">H10D62/80</further-classification>
        <further-classification edition="202501120251201B">H10D64/20</further-classification>
        <further-classification edition="202501120251201B">H10D88/00</further-classification>
        <further-classification edition="202501120251201B">H10D84/83</further-classification>
        <further-classification edition="200601120251201B">H01L21/20</further-classification>
        <further-classification edition="200601120251201B">H01L21/76</further-classification>
        <further-classification edition="200601120251201B">B82B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖翊博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, YI-BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱奕勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YI-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾政庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, CHENG-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種積體電路，包括基板以及第一導電類型的第一電晶體，第一電晶體包括位於基板上方的第一半導體材料的複數個堆疊的第一通道。積體電路包括第二導電類型的第二電晶體，第二導電類型與第一導電類型相反，並且包括位於基板上方且不同於第一半導體材料的第二半導體材料的複數個堆疊的第二通道。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated circuit includes a substrate and a first transistor of a first conductivity type including a plurality of stacked first channels of a first semiconductor material above the substrate. The integrated circuit includes a second transistor of a second conductivity type opposite the first conductivity type and including a plurality of stacked second channels of a second semiconductor material above the substrate and different from the first semiconductor material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101a:第一區域</p>
        <p type="p">101b:第二區域</p>
        <p type="p">102:基板</p>
        <p type="p">109:硬遮罩結構</p>
        <p type="p">115:介電襯層</p>
        <p type="p">116:淺溝槽隔離區</p>
        <p type="p">128:第一通道</p>
        <p type="p">134:第二通道</p>
        <p type="p">174a,174b:界面介電層</p>
        <p type="p">176:高介電常數閘極介電層</p>
        <p type="p">178,179:閘極金屬</p>
        <p type="p">190a,190b:電晶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="710" publication-number="202615316">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615316</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113261</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於自主載具車隊的基於優先順序管理的系統和方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR PRIORITY BASED MANAGEMENT OF AUTONOMOUS VEHICLE FLEET</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B65G1/137</main-classification>
        <further-classification edition="202401120260102B">G06Q10/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商辛波提克有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYMBOTIC LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　京凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JINGKAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自動化儲存和檢索系統，包括儲存陣列、複數個機器人和控制器。所述控制器連接到每個機器人，為每個機器人分配一系列任務或目標。所述控制器具有包含多代理路徑查找演算法解析器的機器人路線規劃器，所述多代理路徑查找演算法解析器針對每個致效至少一個任務或目標的機器人路線，確定執行所述一系列任務或目標的機器人之間衝突的發生和類型。根據所述衝突的發生和類型的確定，所述多代理路徑查找演算法解析器解析每個無衝突的機器人路線，其基於機器人優先順序和路線支路之間的優先性約束，分別確定每個執行所述至少一個任務或目標的機器人的機器人路線，所述優先性約束至少部分地描述了執行所述至少一個任務或目標的共同機器人的各自機器人路線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An automated storage and retrieval system includes a storage array, a plurality of bots, and a controller. The controller is connected to each bot to assign a series of tasks, or goals, to each bot. The controller has a bot route planner that has a multi-agent path finding algorithm resolver that determines, for each bot route effecting at least one task, or goal, occurrence and type of a conflict between bots performing the series of tasks, or goals. From the determination of occurrence and type of conflict, the multi-agent path finding algorithm resolver resolves each conflict free bot route, that determines the bot route respectively for each bot performing the at least one task, or goal, based on bot priority and precedence constraint between route legs describing, at least in part, the respective bot route of a common bot performing the at least one task, or goal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">LONG1:航道</p>
        <p type="p">LONG2:航道</p>
        <p type="p">LONG3:航道</p>
        <p type="p">LAT2:航道</p>
        <p type="p">LAT3:航道</p>
        <p type="p">LAT4:航道</p>
        <p type="p">130A:揀選過道</p>
        <p type="p">130BW:碼頭；車道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="711" publication-number="202616246">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616246</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113501</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示設備及其顯示驅動裝置與操作方法</chinese-title>
        <english-title>DISPLAY APPARATUS, DISPLAY DRIVING DEVICE AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250417B">G09G3/20</main-classification>
        <further-classification edition="200601120250417B">G09G3/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭人彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, JEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅錦憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, JING-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種顯示設備及其顯示驅動裝置與操作方法。顯示設備包括顯示面板、觸控驅動裝置以及顯示驅動裝置。觸控驅動裝置驅動顯示面板以偵測觸碰事件。顯示驅動裝置產生多個閘時脈給顯示面板的閘極驅動電路。顯示驅動裝置在同一個幀期間的第一掃描子期間中以停用電荷分享功能的情況下產生這些閘時脈。顯示驅動裝置在同一個幀期間的第二掃描子期間中以啟用電荷分享功能的情況下產生這些閘時脈。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a display apparatus, a display driving device and an operating method thereof. The display apparatus includes a display panel, a touch driving device, and the display driving device. The touch driving device drives the display panel to detect touch events. The display driving device generates multiple gate clocks to a gate driving circuit of the display panel. The display driving device generates the gate clocks in a first scanning sub-period of a same frame period with a charge sharing function disabled. The display driving device generates the gate clocks in a second scanning sub-period of the same frame period with the charge sharing function enabled.</p>
      </isu-abst>
      <representative-img>
        <p type="p">F6:幀期間</p>
        <p type="p">GCLK3、GCLK6_1、GCLK6_2、GCLK6_3、GCLK6_4、GCLK6_5、GCLK6_6、GCLK6_7、GCLK6_8:閘時脈</p>
        <p type="p">SP6_1、SP6_2、SP6_3:掃描子期間</p>
        <p type="p">tc:電荷分享期間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="712" publication-number="202615195">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615195</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113505</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>投影系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">B23P21/00</main-classification>
        <further-classification edition="200601120260109B">B62D65/18</further-classification>
        <further-classification edition="200601120260109B">G03B21/00</further-classification>
        <further-classification edition="201201120260109B">G06Q50/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大福股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIFUKU CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>濱口淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAGUCHI, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之投影系統，係具備：投影裝置，係將資訊投影至生產設備上或生產設備附近，該生產設備包括用於搬運車體的搬運裝置；資訊係包含與生產設備有關的設備資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:生產線系統</p>
        <p type="p">2:生產設備</p>
        <p type="p">21:搬運裝置</p>
        <p type="p">3:投影系統</p>
        <p type="p">31:投影裝置</p>
        <p type="p">1:資訊</p>
        <p type="p">IA:設備資訊</p>
        <p type="p">IB:作業資訊</p>
        <p type="p">M:構件安裝位置(檢查位置)</p>
        <p type="p">V:車體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="713" publication-number="202615958">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615958</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113519</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>相機裝置及光學設備</chinese-title>
        <english-title>A CAMERA DEVICE AND AN OPTICAL APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260108B">G03B7/085</main-classification>
        <further-classification edition="202101120260108B">G03B9/06</further-classification>
        <further-classification edition="202101120260108B">G03B30/00</further-classification>
        <further-classification edition="202301120260108B">H04N23/54</further-classification>
        <further-classification edition="202301120260108B">H04N23/55</further-classification>
        <further-classification edition="202301120260108B">H04N23/57</further-classification>
        <further-classification edition="200601120260108B">H04M1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG INNOTEK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金中喆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JUNG CHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴泰峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, TAE BONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本實施例係關於一種相機裝置，其包括：一基座；一載體，其安置在該基座上；一透鏡模組，其耦接至該載體；一孔徑模組，其安置在該透鏡模組上；以及一第一板，其安置在該基座上，其中該孔徑模組包括一葉片、被組態為允許該葉片移動之一第一線圈及一第一磁鐵、以及其上安置有該第一線圈之一第二板，且該第一板及該第二板透過一彈性構件彼此連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present embodiment relates to a camera device including: a base; a carrier disposed on the base; a lens module coupled to the carrier; an aperture module disposed on the lens module; and a first board disposed on the base, wherein the aperture module includes a blade, a first coil and a first magnet, which are configured to allow the blade to move, and a second board, on which the first coil is disposed, and the first board and the second board are connected to each other through an elastic member.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:透鏡模組</p>
        <p type="p">110:基座</p>
        <p type="p">210:AF載體</p>
        <p type="p">220:OIS-x載體</p>
        <p type="p">340:OIS-x磁鐵</p>
        <p type="p">350:OIS-x線圈、線圈</p>
        <p type="p">370:OIS-y磁鐵</p>
        <p type="p">380:OIS-y線圈、線圈</p>
        <p type="p">610:AF連接板、外部板</p>
        <p type="p">611:外部分</p>
        <p type="p">612:內部分</p>
        <p type="p">613:連接部分</p>
        <p type="p">620:連接板、外部板</p>
        <p type="p">700:孔徑模組</p>
        <p type="p">760:孔徑板</p>
        <p type="p">761:本體部分</p>
        <p type="p">762:端子部分</p>
        <p type="p">763:連接部分</p>
        <p type="p">775:孔徑磁軛</p>
        <p type="p">800:彈性構件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="714" publication-number="202616745">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616745</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113529</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>跨技術頻譜共用</chinese-title>
        <english-title>CROSS-TECHNOLOGY SPECTRUM SHARING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260109B">H04W16/14</main-classification>
        <further-classification edition="200901120260109B">H04W84/04</further-classification>
        <further-classification edition="200901120260109B">H04W84/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹加諾維克　艾利克桑達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAMNJANOVIC, ALEKSANDAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伽里恩　喬治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHERIAN, GEORGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秀凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SOO BUM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕提爾　雅伯西斯克普拉蒙德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATIL, ABHISHEK PRAMOD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕帕里歐　馬可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAPALEO, MARCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤賽克　泰福菲克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUCEK, TEVFIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露之各種態樣大致上係關於無線通訊。在一些態樣中，一種無線站台可接收來自一網路實體或一使用者設備(user equipment, UE)的頻譜共用資訊。該無線站台可執行與和蜂巢式通訊共用一頻譜相關聯的一動作。描述多種其他態樣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a wireless station may receive spectrum sharing information from a network entity or a user equipment (UE). The wireless station may perform an action associated with sharing a spectrum with cellular communications. Numerous other aspects are described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">800:實例</p>
        <p type="p">810:網路實體</p>
        <p type="p">815:通道管理功能(CMF)</p>
        <p type="p">820:UE</p>
        <p type="p">825:Wi-Fi STA；STA</p>
        <p type="p">830:Wi-Fi AP；AP</p>
        <p type="p">835:授權伺服器(AS)</p>
        <p type="p">836:服務等級協議；合作服務等級協議</p>
        <p type="p">840,845,850,855,860,865,870:元件符號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="715" publication-number="202615229">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615229</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113536</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電動夾爪及其操作方法</chinese-title>
        <english-title>ELECTRIC GRIPPER AND OPERATING METHOD THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250519B">B25J15/08</main-classification>
        <further-classification edition="200601120250519B">B25J13/00</further-classification>
        <further-classification edition="200601120250519B">B23Q7/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS,INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳信賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HSIN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃啟榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHI-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳信樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴義興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI, YI-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電動夾爪用以夾持物體，且電動夾爪包括電路板、馬達、傳動機構及二指片座。馬達根據電路板所提供的超額電流提供超額轉矩，以通過超額轉矩帶動傳動機構。傳動機構根據超額轉矩帶動二指片座朝閉合方向運動，以提供超額夾持力夾持物體。於夾持該物體後，電動夾爪通過傳動機構維持二指片座的夾持力在上限值為超額夾持力的特定範圍內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electric gripper is used for clamping an object, and the electric gripper includes a circuit board, a motor, a transmission mechanism and a two-finger seat. The motor provides an over-torque according to an over-current provided by the circuit board, so as to drive the transmission mechanism through the over-torque. The transmission mechanism drives the two-finger seat to move in a closing direction according to the over-torque, so as to provide an over-clamping force to clamp the object. After clamping the object, the electric gripper maintains a clamping force of the two-finger seat within a specific range with an upper limit value of the over-clamping force through the transmission mechanism.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100~S500:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="716" publication-number="202615528">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615528</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113551</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可染色聚胺酯組成物及其方法</chinese-title>
        <english-title>DYEABLE POLYURETHANE COMPOSITION AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08G18/02</main-classification>
        <further-classification edition="200601120260102B">C08G18/08</further-classification>
        <further-classification edition="200601120260102B">C08G18/10</further-classification>
        <further-classification edition="200601120260102B">C08G18/18</further-classification>
        <further-classification edition="200601120260102B">C08G18/28</further-classification>
        <further-classification edition="200601120260102B">C08G18/32</further-classification>
        <further-classification edition="200601120260102B">C08G18/48</further-classification>
        <further-classification edition="200601120260102B">C08G18/76</further-classification>
        <further-classification edition="200601120260102B">C08G18/79</further-classification>
        <further-classification edition="200601120260102B">C08G18/80</further-classification>
        <further-classification edition="200601120260102B">C09D175/02</further-classification>
        <further-classification edition="200601120260102B">C09D175/08</further-classification>
        <further-classification edition="200601120260102B">C09J175/02</further-classification>
        <further-classification edition="200601120260102B">C09J175/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴斯夫歐洲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃嘉玥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JIA YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡　泛喬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, FENG CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳海生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HAI SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種胍化合物，其係胺和碳二亞胺的產物；一種可染色組成物，該可染色組成物包含選自聚酯、聚醯胺、和聚胺酯的聚合物以及胍化合物；以及一種織物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a guanidine compound being a product of an amine; and a carbodiimide; a dyeable composition comprising a polymer selected from a polyester, a polyamide, and a polyurethane; and the guanidine compound, and a fabric.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="717" publication-number="202616457">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616457</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113560</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於基板支撐組件的電饋通連接器</chinese-title>
        <english-title>ELECTRICAL FEEDTHROUGH CONNECTOR FOR A SUBSTRATE SUPPORT ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/683</main-classification>
        <further-classification edition="200601120260102B">H01L21/687</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇萊曼　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SULYMAN, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙　在龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, JAEYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普勞蒂　史蒂芬唐納德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PROUTY, STEPHEN DONALD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紐杰姆　安德魯安托萬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOUJAIM, ANDREW ANTOINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古茲曼　馬丁佩雷茲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUZMAN, MARTIN PEREZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露了一種電饋通連接器、一種基板支撐組件，以及一種將電訊號傳送至處理腔室的方法。該電饋通連接器包括第一插座，該插座包含第一電氣插孔；介面主體，以及第二插座，該插座包含第二電氣插孔。該介面主體包括第一面、第二面，以及位於第一面和第二面之間的固體部分。第一面與第一插座連接，第二插座則與第二面連接。該固體部分包括嵌入多層介電層中的導電路徑；該導電路徑被配置用以提供第一電氣插孔與第二電氣插孔之間的電氣連接。基板支撐組件包括該電饋通連接器。該方法利用電饋通連接器為靜電吸盤的電極提供電訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are an electrical feedthrough connector, a substrate support assembly, and a method for feeding electrical signals to a processing chamber. The electrical feedthrough connector includes a first receptacle including a first electrical socket; an interface body, and a second receptacle including a second electrical socket. The interface body includes a first side, a second side, and a solid part disposed between the first side and the second side. The first side is coupled with the first receptacle, and the second receptacle is coupled with the second side. The solid part includes a conductive path embedded in a plurality of dielectric layers; and the conductive path is configured to provide an electrical connection between the first electrical socket and the second electrical socket. The substrate support assembly includes the electrical feedthrough connector. The method utilizes the electrical feedthrough connector to provide electrical signals to electrodes of an electrostatic chuck.</p>
      </isu-abst>
      <representative-img>
        <p type="p">308:電氣端子</p>
        <p type="p">326:金屬接觸件</p>
        <p type="p">340:導電路徑</p>
        <p type="p">342:軌跡</p>
        <p type="p">344:軌跡</p>
        <p type="p">346:導電通孔</p>
        <p type="p">348:導電通孔</p>
        <p type="p">350:通孔</p>
        <p type="p">352:黏接墊</p>
        <p type="p">354:黏接墊</p>
        <p type="p">356:介電層</p>
        <p type="p">358:介電層</p>
        <p type="p">360:介電層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="718" publication-number="202615827">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615827</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113603</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電磁輻射偵測器</chinese-title>
        <english-title>ELECTROMAGNETIC RADIATION DETECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G01J5/22</main-classification>
        <further-classification edition="202201120260102B">G01J5/02</further-classification>
        <further-classification edition="202501120260102B">H10F30/282</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法國原子能和替代能源委員會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾爾布依　安湍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALBOUY, ANTOINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永恩　尚　傑克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YON, JEAN-JACQUES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜蒙　吉歐佛耶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUMONT, GEOFFROY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種電磁輻射偵測器，其包括：  &lt;br/&gt;吸收件，其經組態以吸收電磁輻射；MOS-FET型電晶體，其熱耦接至該吸收件；以及控制電路。該電晶體包括：源極及汲極，其摻雜有第一導電類型；通道；以及閘極，其藉由該電晶體之介電閘極層與該通道電隔離。該控制電路電連接至該源極、該汲極及該閘極，且經組態以在該閘極與該源極之間施加小於或等於該電晶體之臨限電壓的電位差。該閘極由摻雜有與該第一導電類型相對的第二導電類型之矽製成，其中多數電荷載子之濃度小於或等於10&lt;sup&gt;19&lt;/sup&gt; cm&lt;sup&gt;-3&lt;/sup&gt;。該閘極介電層具有小於或等於50 nm之厚度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to an electromagnetic radiation detector, including &lt;br/&gt;an absorber configured to absorb electromagnetic radiation, a MOS-FET type transistor thermally coupled to the absorber, and a control circuit. The transistor includes a source and a drain doped with a first conductivity type, a channel, and a gate electrically isolated from the channel by a dielectric gate layer of the transistor. The control circuit is electrically connected to the source, to the drain and to the gate, and configured to apply an electrical potential difference between the gate and the source less than or equal to a threshold voltage of the transistor. The gate is made of silicon doped with a second conductivity type opposite to the first conductivity type with a concentration of majority charge carriers less than or equal to 10&lt;sup&gt;19&lt;/sup&gt; cm&lt;sup&gt;-3&lt;/sup&gt;. The gate dielectric layer has a thickness of less than or equal to 50 nm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光偵測器</p>
        <p type="p">100:基板</p>
        <p type="p">100.1:上部面</p>
        <p type="p">105:下部錨柱</p>
        <p type="p">110:下部障壁層</p>
        <p type="p">115:上部錨柱</p>
        <p type="p">120:熱絕緣臂</p>
        <p type="p">123:汲極電極</p>
        <p type="p">125:閘極電極</p>
        <p type="p">130:上部障壁層</p>
        <p type="p">135:閘極</p>
        <p type="p">135.1:耗盡區</p>
        <p type="p">136:間隔物</p>
        <p type="p">140:閘極介電層</p>
        <p type="p">150:半導體部分</p>
        <p type="p">150.1:源極</p>
        <p type="p">150.2:通道</p>
        <p type="p">150.3:汲極</p>
        <p type="p">160:微板</p>
        <p type="p">170:吸收件</p>
        <p type="p">A-A:截面平面</p>
        <p type="p">X:X軸方向</p>
        <p type="p">Y:Y軸方向</p>
        <p type="p">Z:X軸方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="719" publication-number="202616458">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616458</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113607</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於控制靜電放電至晶圓之碳塗層碳化矽真空晶圓吸盤</chinese-title>
        <english-title>CARBON COATED SILICON CARBIDE VACUUM WAFER CHUCK TO CONTROL ELECTROSTATIC DISCHARGE TO WAFER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H01L21/683</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛洛雷斯　萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLORES, RYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種真空吸盤可包含由碳化矽形成之一吸盤本體。諸如一類金剛石碳塗層之一碳塗層可沈積於吸盤本體上。用碳塗層塗覆碳化矽真空吸盤可控制靜電放電事件。碳塗層可增大吸盤本體之表面電阻且使真空吸盤符合一靜電放電規範，其係半導體行業中之一加強規範。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A vacuum chuck may include a chuck body formed from silicon carbide. A carbon coating, such as a diamond-like carbon coating, may be deposited on the chuck body. Coating the silicon carbide vacuum chucks with the carbon coatings may control electrostatic discharge events. The carbon coatings may increase the surface resistance of the chuck body and bring the vacuum chucks to within an electrostatic discharge specification which is a tightening specification in the semiconductor industry.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:真空吸盤</p>
        <p type="p">102:吸盤本體</p>
        <p type="p">110:未拋光表面</p>
        <p type="p">112:密封環</p>
        <p type="p">114:圓形凸塊</p>
        <p type="p">116:狹槽</p>
        <p type="p">118:真空孔</p>
        <p type="p">120:銷密封件</p>
        <p type="p">124:頂銷</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="720" publication-number="202615912">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615912</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113638</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>同時使用兩束雷射直寫光束產生光子元件的方法和裝置</chinese-title>
        <english-title>METHOD AND APPARATUS FOR GENERATING A PHOTONIC ELEMENT BY SIMULTANEOUSLY USING TWO LASER DIRECT WRITING BEAMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G02B6/13</main-classification>
        <further-classification edition="201401220260102B">B23K26/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS SMT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商卡爾蔡司ＳＭＳ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS SMS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏紹琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, SHAO-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐榭科夫　薩杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSHEMKOV, SERGEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里奇特　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHTER, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史凱路伯爾　湯瑪士　法蘭茲　卡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHERUEBL, THOMAS FRANZ KARL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯潘格勒　黛安娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPENGLER, DIANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種用於同時使用至少兩束雷射直寫光束(脈衝雷射束123)產生光子元件(190)之方法(1400)和裝置(100、1200、1300)。所述方法(1400)包含以下步驟：(a) 步驟1420，將該等至少兩束雷射直寫光束(脈衝雷射束123)同時聚焦到樣本(140)的至少兩位置，以在該等至少兩位置局部改變該樣本(140)的至少一特性(145)；(b) 步驟1430，相對於該樣本(140)以移動該至少兩束雷射直寫光束(脈衝雷射束123)，以產生該光子元件(190)；及(c) 步驟1440，個別控制該等至少兩束雷射直寫光束(脈衝雷射束123)中之每一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application refers to a method (1400) and an apparatus (100, 1200, 1300) for generating a photonic element (190) by simultaneously using at least two laser direct writing beams (123). The method (1400) comprises: (a) simultaneously focussing (1420) the at least two laser direct writing beams (123) into a sample (140) at least at two positions for locally changing at least one property (145) of the sample (140) at the at least two positions; (b) moving (1430) the at least two laser direct writing beams (123) relative to the sample (140) for generating the photonic element (190); and (c) individually controlling (1440) each one of the at least two laser direct writing beams (123).</p>
      </isu-abst>
      <representative-img>
        <p type="p">900:示意圖</p>
        <p type="p">905:第一局部影像</p>
        <p type="p">910:垂直虛線</p>
        <p type="p">915:第二局部影像</p>
        <p type="p">920:序列</p>
        <p type="p">925:局部影像</p>
        <p type="p">930:雷射脈衝</p>
        <p type="p">935:第四局部影像</p>
        <p type="p">940:熱積累</p>
        <p type="p">945:第五局部影像</p>
        <p type="p">950:第二區段</p>
        <p type="p">960:火花訊號</p>
        <p type="p">970:直徑</p>
        <p type="p">980:局部隆起</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="721" publication-number="202616854">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616854</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113685</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製造溝槽金氧半場效電晶體裝置之方法</chinese-title>
        <english-title>METHOD FOR MANUFACTURING TRENCH MOSFET DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260113B">H10D30/60</main-classification>
        <further-classification edition="202501120260113B">H10D48/00</further-classification>
        <further-classification edition="202501120260113B">H10D64/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商美格納半導體有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAGNACHIP SEMICONDUCTOR, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴美朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, MI RANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李到殷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DO EUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金眞友</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JIN WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈教準</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIM, KYO JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金峻賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JUN HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金宰永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JAE YEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於製造一溝槽MOSFET裝置之方法包含：在一磊晶層中形成一溝槽；在該溝槽中形成屏蔽氧化物及屏蔽多晶矽；蝕刻該屏蔽多晶矽以僅留下該屏蔽多晶矽之一部分；在該屏蔽氧化物及屏蔽多晶矽上形成多晶矽間氧化物(IPO)；蝕刻該IPO及該屏蔽氧化物，在該屏蔽多晶矽及該屏蔽氧化物之一上表面上留下該IPO之一部分；藉由執行一沈積程序來形成一第一閘極犧牲氧化物層；藉由執行一熱氧化程序來在該第一閘極犧牲氧化物層上形成一第二閘極犧牲氧化物層；及執行一蝕刻程序以在該溝槽之一內部之一側壁與該屏蔽氧化物之該上表面之間的一邊界處留下一閘極犧牲氧化物層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for manufacturing a trench MOSFET device includes forming a trench in an epitaxial layer, forming a shield oxide and a shield poly in the trench, etching the shield poly to leave only a portion of the shield poly, forming an inter poly oxide (IPO) on the shield oxide and shield poly, etching the IPO and the shield oxide, leaving a portion of the IPO on an upper surface of the shield poly and the shield oxide, forming a first gate sacrificial oxide layer by performing a deposition process, forming a second gate sacrificial oxide layer on the first gate sacrificial oxide layer by performing a thermal oxidation process, and performing an etching process to leave a gate sacrificial oxide layer at a boundary between a sidewall of an interior of the trench and the upper surface of the shield oxide.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:磊晶層</p>
        <p type="p">30:溝槽</p>
        <p type="p">60-2:多晶矽間氧化物(IPO)</p>
        <p type="p">80:閘極犧牲氧化物</p>
        <p type="p">h:高度</p>
        <p type="p">w:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="722" publication-number="202616653">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616653</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113724</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>壓電薄膜之銑削技術</chinese-title>
        <english-title>MILLING TECHNIQUE FOR PIEZOELECTRIC THIN FILMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">H03H9/02</main-classification>
        <further-classification edition="200601120260107B">H03H3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＱＯＲＶＯ美國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QORVO US, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛格　薩加爾　薩格爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, SAJAL SAGAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅瑟蒙德　拉爾夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROTHEMUND, RALPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫達雷斯　扎德　穆罕默德　賈方</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MODARRES-ZADEH, MOHAMMAD J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙度　喬蒂　斯瓦魯普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SADHU, JYOTHI SWAROOP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩迪克　派崔克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SADIK, PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露了一種壓電薄膜之銑削技術。在一個態樣中，以大體上垂直於一壓電材料之一頂表面的一角度進行一第一遍銑削。此第一遍銑削降低了該壓電材料內摻雜劑之異常定向晶粒(AOG)的高度及覆蓋面積。以一角度進行一第二遍銑削以提供失諧頻率。在例示性態樣中，銑削係用氬進行。本揭露之其他態樣涵蓋一種根據本揭露進行銑削之壓電材料，其具有小於約二十奈米之AOG峰。由本揭露實現之該壓電材料的平滑頂表面產生Q值較高的聲學諧振器，繼而提供Q值較高的聲學濾波器或其類似者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A milling technique for piezoelectric thin films is disclosed. In one aspect, a first milling pass at an angle generally perpendicular to a top surface of a piezoelectric material is made. This first milling pass reduces the height and footprint of abnormally oriented grains (AOG) of dopants within the piezoelectric material. A second milling pass is done at an angle to provide detune frequency. In exemplary aspects, milling is done with argon. Further aspects of the present disclosure contemplate a piezoelectric material milled according to the present disclosure that has AOG peaks of less than approximately twenty nanometers. The smooth top surface of the piezoelectric material enabled by the present disclosure results in higher Q acoustic resonators, which, in turn, provide higher Q acoustic filters or the like.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="723" publication-number="202616534">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616534</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113732</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體晶片及其形成方法</chinese-title>
        <english-title>INTEGRATED CHIP AND MANUFACTURING METHOD OF THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251105B">H01L25/18</main-classification>
        <further-classification edition="202501120251105B">H10F39/18</further-classification>
        <further-classification edition="202301120251105B">H04N25/702</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳亭蓉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TING-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡沂桀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, Y.J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭明育</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, MING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TSUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施志承</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, CHIH CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及一種積體晶片。本案揭露的多種實施例是關於一種積體晶片（IC）。積體晶片包含第一像素區域，包含第一光電感測器，位於基板中；第二像素區域，包含第二光電感測器，位於基板中且第二像素區域鄰近於第一像素區域；以及隔離結構，位於基板中且包含位於第一像素區域與第二像素區域之間的第一隔離結構元件，其中在俯視圖中，第一隔離結構元件具有第一對相對的直線側壁段，以及第一對相對的彎曲側壁段，其鄰近於第一對相對的直線側壁段。第一對相對的直線側壁段之間的第一距離大於第一對相對的彎曲側壁段之間的第二距離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various embodiments of the present disclosure are directed towards an integrated chip (IC). The IC includes a first pixel region comprising a first photodetector in a substrate. A second pixel region comprising a second photodetector is in the substrate and adjacent to the first pixel region. An isolation structure in the substrate and comprising a first isolation structure element between the first and second pixel regions. In top view the first isolation structure element has a first pair of opposing straight sidewall segments and a first pair of opposing curved sidewall segments adjacent to the first pair of opposing straight sidewall segments. A first distance between the first pair of opposing straight sidewall segments is greater than a second distance between the first pair of opposing curved sidewall segments.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100a:俯視圖</p>
        <p type="p">102:基板</p>
        <p type="p">103:像素感測器單元</p>
        <p type="p">103a:第一像素感測器單元</p>
        <p type="p">104:像素區域</p>
        <p type="p">104a:第一像素區域</p>
        <p type="p">104b:第二像素區域</p>
        <p type="p">104c:第三像素區域</p>
        <p type="p">104d:第四像素區域</p>
        <p type="p">106:光電感測器</p>
        <p type="p">107a:第一長條溝槽段</p>
        <p type="p">107b:第二長條溝槽段</p>
        <p type="p">107c:第三長條溝槽段</p>
        <p type="p">108:浮動擴散節點</p>
        <p type="p">112:隔離結構</p>
        <p type="p">114:第一隔離結構段</p>
        <p type="p">116:第二隔離結構段</p>
        <p type="p">139:橫向距離</p>
        <p type="p">140:第一橫向距離</p>
        <p type="p">141:第一對角距離</p>
        <p type="p">142:橫向距離</p>
        <p type="p">143:橫向距離</p>
        <p type="p">144:第二橫向距離</p>
        <p type="p">145:橫向距離</p>
        <p type="p">150:彎曲側壁段</p>
        <p type="p">152、154、156、158:直線側壁段</p>
        <p type="p">160:交叉處</p>
        <p type="p">162:彎曲側壁段</p>
        <p type="p">164:第二對角距離</p>
        <p type="p">166:第三橫向距離</p>
        <p type="p">170:距離</p>
        <p type="p">A-A’、B-B’:線段</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="724" publication-number="202615829">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615829</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113741</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>照相機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">G01J9/00</main-classification>
        <further-classification edition="200601120260112B">G02B5/04</further-classification>
        <further-classification edition="200601120260112B">G02B5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒田育男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARATA, IKUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村共則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, TOMONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之照相機1包含稜鏡5、稜鏡7、稜鏡9及光檢測器11、13、15，該稜鏡5具有：輸入面5a，其接收入射光I&lt;sub&gt;0&lt;/sub&gt;；濾光面5b，其將入射光I&lt;sub&gt;0&lt;/sub&gt;反射而產生計測光，且使入射光I&lt;sub&gt;0&lt;/sub&gt;透過而產生輸出光；及輸出面5c，其輸出計測光；該稜鏡7具有：輸入面7a，其接近濾光面5b，接收輸出光；濾光面7b，其將通過輸入面7a之輸出光反射而產生計測光，且使輸出光透過而產生輸出光；及輸出面7c，其輸出計測光；該稜鏡9具有：輸入面9a，其接近濾光面7b，接收輸出光；及輸出面9c，其將輸出光輸出作為計測光；該等光檢測器11、13、15檢測計測光；於濾光面5b、7b分別設置在規定之波長區域中透過率根據波長而線形變化之特性之傾斜二向分光鏡17&lt;sub&gt;0&lt;/sub&gt;、17&lt;sub&gt;1&lt;/sub&gt;。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:照相機</p>
        <p type="p">3:偏光板(偏光元件)</p>
        <p type="p">5:稜鏡(第1稜鏡)</p>
        <p type="p">5a:輸入面(第1輸入面)</p>
        <p type="p">5b:濾光面(第1濾光面)</p>
        <p type="p">5c:輸出面(第1輸出面)</p>
        <p type="p">7:稜鏡(第2稜鏡)</p>
        <p type="p">7a:輸入面(第2輸入面)</p>
        <p type="p">7b:濾光面(第2濾光面)</p>
        <p type="p">7c:輸出面(第2輸出面)</p>
        <p type="p">9:稜鏡(第3稜鏡)</p>
        <p type="p">9a:輸入面(第3輸入面)</p>
        <p type="p">9c:輸出面(第3輸出面)</p>
        <p type="p">11,13,15:光檢測器</p>
        <p type="p">17&lt;sub&gt;0&lt;/sub&gt;:傾斜二向分光鏡(第1濾光器)</p>
        <p type="p">17&lt;sub&gt;1&lt;/sub&gt;:傾斜二向分光鏡(第2濾光器)</p>
        <p type="p">I&lt;sub&gt;0&lt;/sub&gt;:入射光</p>
        <p type="p">I&lt;sub&gt;R0&lt;/sub&gt;:反射光(第1計測光/第2計測光)/檢測信號之光強度</p>
        <p type="p">I&lt;sub&gt;R1&lt;/sub&gt;:反射光(第2計測光/第3計測光)/檢測信號之光強度</p>
        <p type="p">I&lt;sub&gt;T1&lt;/sub&gt;:透過光(第2輸出光/第3計測光)/檢測信號之光強度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="725" publication-number="202615256">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615256</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113806</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有表面處理被膜之材料</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B32B27/00</main-classification>
        <further-classification edition="200601120260102B">C09D183/04</further-classification>
        <further-classification edition="200601120260102B">C23C26/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本帕卡瀨精股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIHON PARKERIZING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤祐介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐古弘志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKO, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬隆行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOROZU, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內田淳一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UCHIDA, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於：提供一種具有優異防汙性及低溫乾燥性的新穎表面處理被膜之材料。一種於表面或表面上具有被膜之材料，前述被膜含有矽氧聚合物(A)，及選自鈦、鋯及鋁之至少1種金屬元素(B)，且藉由具有有特定的紅外線吸收光譜之峰強度之被膜的材料來解決課題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="726" publication-number="202616361">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616361</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113837</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>膜形成裝置、膜形成方法及物品之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H01L21/027</main-classification>
        <further-classification edition="200601120260109B">B29C59/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>城
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARUYAMA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種膜形成裝置，在基板之上形成硬化性組成物的膜。膜形成裝置，具有：模版保持部，其保持一模版，其中，該模版為具有和基板之上的硬化性組成物進行接觸的區域者；基板保持部，其將基板進行保持；以及檢測手段，其在進行一膜形成處理後，在使模版與基板或基板上的硬化性組成物進行了接觸的狀態下，檢測在模版與基板之間的異物，其中，該膜形成處理，為將基板之上的硬化性組成物在予以接觸於模版的狀態予以硬化，將模版與硬化性組成物進行剝離，從而形成硬化性組成物的膜者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:平坦化裝置</p>
        <p type="p">2:模版</p>
        <p type="p">3:基板</p>
        <p type="p">4:夾具</p>
        <p type="p">5:接觸模組</p>
        <p type="p">6:基板台</p>
        <p type="p">7:攝像部</p>
        <p type="p">8:計測感測器</p>
        <p type="p">9:硬化模組</p>
        <p type="p">10:塗布器</p>
        <p type="p">11:頂部基座</p>
        <p type="p">12:基座</p>
        <p type="p">13:控制部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="727" publication-number="202615714">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615714</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113852</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低溫/BEOL相容、高度可擴展的石墨烯合成工具，包括可重複使用的工具</chinese-title>
        <english-title>LOW-TEMPERATURE/BEOL-COMPATIBLE HIGHLY SCALABLE GRAPHENE SYNTHESIS TOOLS INCLUDING RETASKED TOOLS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">C23C16/46</main-classification>
        <further-classification edition="200601120260112B">C23C16/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商迪斯尼2Ｄ公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DESTINATION 2D INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴納吉　考斯塔夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANERJEE, KAUSTAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊延加　拉維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IYENGAR, RAVI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克朗奎斯特　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRONQUIST, BRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐宏昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉俞佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可擴展的擴散耦合裝置，包括：用於在晶圓上生長擴散材料的處理腔室；其中，該處理腔室包括可加熱底板，該底板加熱到指定的溫度，且基板放置在該可加熱底板上；可加熱頂板包括第二加熱機構，其中，該可加熱頂板配置成可沿x軸和x主軸上下移動，以對位在該可加熱底板上的基板施加機械壓力，且其中，該可加熱頂板施加該機械壓力時，該處理腔室的壓力維持在小於10&lt;sup&gt;-3&lt;/sup&gt;托，其中，該第一加熱機構與該第二加熱機構為獨立調節，或者其中，整個處理腔室為可加熱，且其中，該裝置是經過修改或未經更改的商用接合或熱壓成型工具。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A scalable diffusion-couple apparatus including: a process chamber for growth of a diffusion material on a wafer; where the process chamber includes a heatable bottom platen which is heated to a specified temperature, and where a substrate is placed on the heatable bottom platen; a heatable top platen including a second heating mechanism, where the heatable top platen is configured to move up and down along an x axis and an x prime axis to apply a mechanical pressure to the substrate on the heatable bottom platen, and where the heatable top platen applies the mechanical pressure while a process chamber pressure is maintained at a less than 10&lt;sup&gt;-3&lt;/sup&gt;torr, where the first heating mechanism and the second heating mechanism are tuned independently, or where the entire process chamber is heatable, and where the apparatus is a modified or unchanged commercial bonding or hot-press tool.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:接合工具</p>
        <p type="p">705:底部加熱器</p>
        <p type="p">710:底部接合壓板</p>
        <p type="p">715:晶圓/基板</p>
        <p type="p">720:接合夾具</p>
        <p type="p">725:機械夾鉗</p>
        <p type="p">730:間隔板</p>
        <p type="p">740:頂部加熱器</p>
        <p type="p">750:接合加壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="728" publication-number="202616475">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616475</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113853</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>形成積體電路裝置的後段製程區域的方法</chinese-title>
        <english-title>METHOD OF FORMING BACK-END-OF-LINE REGION OF INTEGRATED CIRCUIT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H01L21/768</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳重錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, JOONGSUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金炳勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, BYOUNGHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔宰銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JAEMYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金尊洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JOHNSOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　康一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, KANG-ILL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種形成積體電路（IC）裝置後段製程（BEOL）區域的方法。形成IC裝置BEOL區域方法包括在下部導孔上形成金屬層。方法包括在金屬層的上部部分形成光刻關鍵結構。方法包括在光刻關鍵結構上形成絕緣材料。此外，方法包括平坦化絕緣材料和包括光刻關鍵結構的金屬層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods of forming a back-end-of-line (BEOL) region of an integrated circuit (IC) device are provided. A method of forming a BEOL region of an IC device includes forming a metal layer on a lower via. The method includes forming a photo key in an upper portion of the metal layer. The method includes forming an insulating material on the photo key. Moreover, the method includes planarizing the insulating material and the metal layer that includes the photo key.</p>
      </isu-abst>
      <representative-img>
        <p type="p">512、514、516、518、520、522、524、526、528:區塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="729" publication-number="202616844">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616844</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113865</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製造半導體裝置的方法</chinese-title>
        <english-title>METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250623B">H10D30/01</main-classification>
        <further-classification edition="202301120250623B">H10B12/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金永仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YOUNG IN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴智訓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JI HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裵珍宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, JIN-WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳承龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, SEUNG YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全寅學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, IN HAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周炳秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOO, BYUNG SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於製造一半導體裝置之方法，其包括：提供包括一元件區及一劃線道區之一基體；在該基體之該元件區上形成一第一遮罩圖案及在該第一遮罩圖案之一側面上形成一間隔件；形成沿著該第一遮罩圖案、該間隔件及該基體延伸之一遮罩膜，其中該遮罩膜包括在該基體之該劃線道區上之一階梯部分；形成填充該階梯部分之一犧牲圖案；藉由蝕刻該遮罩膜以暴露該第一遮罩圖案及該間隔件來形成一第二遮罩圖案；移除該間隔件及該犧牲圖案；以及使用該第一遮罩圖案及該第二遮罩圖案作為蝕刻遮罩以在該基體內部形成一閘極溝槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for manufacturing a semiconductor device, including: providing a substrate including an element region and a scribe lane region; forming a first mask pattern on the element region of the substrate, and a spacer on a side face of the first mask pattern; forming a mask film that extends along the first mask pattern, the spacer, and the substrate, wherein the mask film includes a stepped portion on the scribe lane region of the substrate; forming a sacrificial pattern filling the stepped portion; forming a second mask pattern by etching the mask film to expose the first mask pattern and the spacer; removing the spacer and the sacrificial pattern; and forming a gate trench inside the substrate using the first mask pattern and the second mask pattern as etching masks.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基體</p>
        <p type="p">210:氧化層</p>
        <p type="p">220:遮罩層</p>
        <p type="p">230:蝕刻停止層</p>
        <p type="p">240:第一遮罩圖案</p>
        <p type="p">240_US:上面</p>
        <p type="p">250:間隔件</p>
        <p type="p">260:遮罩膜</p>
        <p type="p">272:犧牲圖案</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D4:第四方向</p>
        <p type="p">D-D':線</p>
        <p type="p">DR:虛設區</p>
        <p type="p">DR1:第一虛設區</p>
        <p type="p">DR2:第二虛設區</p>
        <p type="p">KR:鍵區</p>
        <p type="p">ST:階梯部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="730" publication-number="202615260">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615260</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113877</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電子器件製造過程中接合電子器件結構的方法</chinese-title>
        <english-title>METHOD FOR BONDING ELECTRONICS STRUCTURES DURING INTEGRATED ELECTRONICS MANUFACTURING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B32B37/06</main-classification>
        <further-classification edition="200601120260102B">B32B37/12</further-classification>
        <further-classification edition="200601120260102B">C08J3/28</further-classification>
        <further-classification edition="200601120260102B">H01L21/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商脈衝鍛造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PULSEFORGE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>圖爾卡尼　維克拉姆　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TURKANI, VIKRAM SHREESHAIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿塔爾　瓦希德　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATTAR, VAHID AKHAVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施洛德　寇特　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHRODER, KURT A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　哈利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, HARRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅森　伊恩　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAWSON, IAN M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於接合電子器件結構的裝置及相關聯構件及方法。使用來自閃光燈的數個光脈衝來把第一及第二電子器件結構直接接合。在一些例示中，來自閃光燈的光射入該第一或第二電子器件結構其中至少一者，並被吸收，以加熱該第一及第二電子器件結構之間的接合介面，使該直接接合形成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Apparatus and associated components and methods for bonding electronics structures. First and second electronics structures are directly bonded using a plurality of light pulses from a flashlamp. In some examples, light from the flashlamp passes into and is absorbed by at least one of the first or second electronics structures to heat a bonding interface between the first and second electronics structures to cause the direct bond to form.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:光源</p>
        <p type="p">110:第一晶圓；晶圓</p>
        <p type="p">112:第一矽基板；基板</p>
        <p type="p">114:第一背端</p>
        <p type="p">116:第一金屬互連體；第一互連體；金屬互連體；互連體</p>
        <p type="p">118:第一介電層；介電層；介電構件</p>
        <p type="p">120:第二晶圓；晶圓</p>
        <p type="p">122:第二矽基板</p>
        <p type="p">124:第二背端</p>
        <p type="p">126:第二金屬互連體；第二互連體；金屬互連體</p>
        <p type="p">128:第二介電層；介電層</p>
        <p type="p">130:接合介面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="731" publication-number="202616178">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616178</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113918</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用分散式帳本技術之產品認證</chinese-title>
        <english-title>PRODUCT AUTHENTICATION USING DISTRIBUTED LEDGER TECHNOLOGY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">G06Q30/018</main-classification>
        <further-classification edition="201301120260102B">G06F21/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商3Ｍ新設資產公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>3M INNOVATIVE PROPERTIES COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海因斯　琳賽　婁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HINES, LINDSEY LOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包括：獲得具有一可穿戴物品中所包括的一產品標籤之一第一視圖的一第一影像，該第一影像表示該產品標籤之部分，該等部分包含隨機或偽隨機配置的至少兩種非均質材料；使用一驗證協定基於該第一影像中表示的該等材料之該配置而產生該產品標籤的一第一數位表示；將該數位表示儲存到一帳本中之一第一區塊；獲得該產品標籤的一第二影像；基於該第二影像中表示的該等材料之該配置而產生該產品標籤的一第二數位表示；基於該第一數位表示及該第二數位表示而產生一匹配機率值；基於該匹配機率值而判定該第一影像及該第二影像與該產品標籤相關聯；及產生該帳本中包括的一第二區塊以儲存該第二影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes obtaining a first image having a first view of a product label included in a wearable item and representing portions of the product label that comprise at least two materials randomly or pseudorandomly arranged, generating a first digital representation of the product label based on the arrangement of the materials represented in the first image using a validation protocol, storing the digital representation to a first block in a ledger, obtaining a second image of the product label, generating a second digital representation of the product label based on the arrangement of the materials represented in the second image, generating a match probability value based on the first and second digital representations, determining that the first and second images are associated with the product label based on the match probability value, and generating a second block included in the ledger to store the second image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:程序</p>
        <p type="p">52:方塊；獲得產品標籤之影像</p>
        <p type="p">54:方塊；驗證影像是否為基準真實影像</p>
        <p type="p">56:方塊；將基準真實影像儲存到帳本之第一區塊</p>
        <p type="p">58:方塊；接收認證請求</p>
        <p type="p">60:方塊；產生介於第一影像與第二影像之間的匹配機率</p>
        <p type="p">62:決策方塊；匹配機率是否滿足臨限？</p>
        <p type="p">64:方塊；將第二影像儲存到帳本之第二區塊</p>
        <p type="p">66:方塊；操作；批准認證請求</p>
        <p type="p">68:方塊；操作；拒絕認證請求</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="732" publication-number="202616348">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616348</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113965</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提供用於基板處理的可配置脈衝電壓波形</chinese-title>
        <english-title>DELIVERY OF CONFIGURABLE PULSED VOLTAGE WAVEFORMS FOR SUBSTRATE PROCESSING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">H01J37/34</main-classification>
        <further-classification edition="200601120260108B">C23C14/34</further-classification>
        <further-classification edition="200601120260108B">C23C14/54</further-classification>
        <further-classification edition="200601120260108B">H01L21/285</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　壽應</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, SHOUYIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿迪馬迪亞姆　希里什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADIMADHYAM, SIREESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米勒　凱斯Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MILLER, KEITH A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於給電極傳送可配置脈衝電壓波形以進行基板處理的方法及設備。一種實施例方法通常包括對設置於處理腔室處理區域中的第一電極施加相對於地面的正DC偏壓。該正DC偏壓被配置為改變在處理腔室處理區域中形成的電漿的相對於地面的電漿電勢。該方法還通常包括向位於處理腔室的基板支撐件中的第二電極傳送脈衝電壓（PV）波形。PV波形的脈衝幅度從相對於地面的正電壓延伸至相對於地面的負電壓。相對於地面的正電壓大於相對於地面的電漿電勢。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and apparatus for delivering configurable pulsed voltage waveforms to an electrode for substrate processing. One example method generally includes applying a positive DC bias relative to ground to a first electrode disposed within a processing region of a processing chamber. The positive DC bias is configured to alter a plasma potential relative to ground of a plasma formed in the processing region of the processing chamber. The method also generally includes delivering a pulsed-voltage (PV) waveform to a second electrode disposed in a substrate support within the processing chamber. Amplitudes of pulses of the PV waveform extend from a positive voltage relative to ground to a negative voltage relative to ground. The positive voltage relative to ground is greater than the plasma potential relative to ground.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:圖表</p>
        <p type="p">202:時間t0</p>
        <p type="p">204:時間t1</p>
        <p type="p">206:時間t2</p>
        <p type="p">208:時間t3</p>
        <p type="p">210:時間t4</p>
        <p type="p">212:Vr</p>
        <p type="p">214:Vp</p>
        <p type="p">216:VFO</p>
        <p type="p">218:Vg</p>
        <p type="p">220:Vb1</p>
        <p type="p">222:Vb2</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="733" publication-number="202615999">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615999</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113991</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於接觸孔收縮之選擇性化學方法</chinese-title>
        <english-title>SELECTIVE CHEMICAL METHOD FOR CONTACT HOLE SHRINKING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G03F7/40</main-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪立坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LIKUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮　南西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUNG, NANCY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃特基　魯迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOJTECKI, RUDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈澤清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, ZEQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬里克　亞伯亥吉特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MALLICK, ABHIJIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏瑪　卡許希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHARMA, KASHISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩尚　馬杜爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SACHAN, MADHUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">此處揭露的實施例包括一種使用化學氣相沉積（CVD）製程來處理包括圖案化特徵的阻劑層的方法。在一個實施例中，CVD製程減少了圖案化特徵的尺寸，並且該CVD製程包括將前驅物氣體流入腔室，該前驅物氣體會浸透到阻劑層中。在一個實施例中，該方法進一步包括將圖案化特徵轉移到位於阻劑層下方的層中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments disclosed herein include a method for treating a resist layer comprising a patterned feature with a chemical vapor deposition ‎‎(CVD) process. In an embodiment, the CVD process reduces a dimension of the patterned feature, and the CVD process ‎includes flowing a precursor gas into a chamber that infuses into the resist layer. In an embodiment, the method further comprises transferring the patterned feature into a layer below the resist layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">650:製程</p>
        <p type="p">651:操作</p>
        <p type="p">652:操作</p>
        <p type="p">653:操作</p>
        <p type="p">654:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="734" publication-number="202615201">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615201</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114111</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理頭、基板處理裝置、及基板處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">B24B21/00</main-classification>
        <further-classification edition="200601120260108B">B24B21/08</further-classification>
        <further-classification edition="200601120260108B">B24B9/00</further-classification>
        <further-classification edition="200601120260108B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商荏原製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBARA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大橋弘尭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHASHI, HIROTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, SHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山野邊北斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMANOBE, HOKUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾文岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳凱智</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於處理頭、基板處理裝置、及基板處理方法者。處理頭具備：彈性墊構件、與硬質墊構件。處理頭係以將位於形成在彈性墊構件與硬質墊構件之間的空間之處理帶緊壓在周緣部之方式而構成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:研磨頭(處理頭)</p>
        <p type="p">18,19:導輥</p>
        <p type="p">100:墊(pad)</p>
        <p type="p">101:硬質墊構件</p>
        <p type="p">101a:座部</p>
        <p type="p">102:墊支撐件</p>
        <p type="p">102a:座部</p>
        <p type="p">102b:突起部</p>
        <p type="p">105:彈性墊構件</p>
        <p type="p">CS1:第一接觸部位</p>
        <p type="p">CS2:第二接觸部位</p>
        <p type="p">PT:研磨帶</p>
        <p type="p">SP:空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="735" publication-number="202616845">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616845</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114143</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於GAA　PMOS的均勻SiGe通道形成</chinese-title>
        <english-title>UNIFORM SIGE CHANNEL FORMATION FOR GAA PMOS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260102B">H10D30/01</main-classification>
        <further-classification edition="202501120260102B">H10D30/43</further-classification>
        <further-classification edition="202501120260102B">H10D30/67</further-classification>
        <further-classification edition="202501120260102B">H10D62/10</further-classification>
        <further-classification edition="202501120260102B">H10D62/80</further-classification>
        <further-classification edition="202501120260102B">H10D64/01</further-classification>
        <further-classification edition="202501120260102B">H10D84/01</further-classification>
        <further-classification edition="202501120260102B">H10D84/03</further-classification>
        <further-classification edition="202501120260102B">H10D84/85</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　世海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEONG, SAI HOOI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哥倫布　班傑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COLOMBEAU, BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普蘭薩西哈蘭　巴拉薩拉瑪年</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRANATHARTHIHARAN, BALASUBRAMANIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種形成半導體元件的方法，該方法包括在基板上形成超晶格結構，該超晶格結構包括複數個第一層和對應的複數個第二層，第一層和第二層以複數個堆疊對的方式交替排列；在基板上的閘極區域中形成一或多個閘極和閘極間隔物；從超晶格結構中形成複數個奈米片；用複數個虛擬介電中間層填充對應的複數個孔隙；在一或多個閘極和閘極間隔物之間對複數個奈米片進行蝕刻，以形成一或多個源極區域和一或多個汲極區域；在複數個虛擬介電中間層上形成內部間隔物；並在一或多個源極區域中沉積源極材料，及在一或多個汲極區域中沉積汲極材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of forming a semiconductor device, the method including forming a superlattice structure on a substrate, the superlattice structure including a plurality of first layers and a corresponding plurality of second layers, the first layers and the second layers being alternatingly arranged in a plurality of stacked pairs; forming one or more gate and gate spacers in a gate region on the substrate; forming a plurality of nanosheets from the superlattice structure; filling the corresponding plurality of voids with a plurality of dummy dielectric interlayers; etching the plurality of nanosheets between the one or more gate and gate spacers to form one or more source regions and one or more drain regions; forming an inner spacer on the plurality of dummy dielectric interlayers; and depositing a source material in the one or more source regions and a drain material in the one or more drain regions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:方法</p>
        <p type="p">12:操作</p>
        <p type="p">14:操作</p>
        <p type="p">16:操作</p>
        <p type="p">18:操作</p>
        <p type="p">20:操作</p>
        <p type="p">22:操作</p>
        <p type="p">24:操作</p>
        <p type="p">26:操作</p>
        <p type="p">28:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="736" publication-number="202615340">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615340</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114189</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>負極材料及電池</chinese-title>
        <english-title>AN ANODE MATERIAL, AND A BATTERY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250602B">C01B32/20</main-classification>
        <further-classification edition="201001120250602B">H01M4/587</further-classification>
        <further-classification edition="201001120250602B">H01M10/0525</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商貝特瑞新材料集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BTR NEW MATERIAL GROUP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONG, HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張道富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, DAOFU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周海輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, HAIHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任建國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REN, JIANGUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃友元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YOUYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀雪琴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, XUEQIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>時渝恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種負極材料、電池，負極材料，包括石墨及位於所述石墨至少部分表面的碳層；採用拉曼光譜分別測試所述負極材料的顆粒表面及顆粒切面，位於1300cm&lt;sup&gt;-1&lt;/sup&gt;~1350cm&lt;sup&gt;-1&lt;/sup&gt;範圍內的D特徵峰的峰面積與位於1500cm&lt;sup&gt;-1&lt;/sup&gt;~1580cm&lt;sup&gt;-1&lt;/sup&gt;範圍內的G特徵峰的峰面積比為I&lt;sub&gt;D&lt;/sub&gt;/I&lt;sub&gt;G&lt;/sub&gt;，測得所述負極材料的顆粒表面的I&lt;sub&gt;D&lt;/sub&gt;/I&lt;sub&gt;G&lt;/sub&gt;比值為A，所述負極材料的顆粒切面的I&lt;sub&gt;D&lt;/sub&gt;/I&lt;sub&gt;G&lt;/sub&gt;比值為B，1.22＜A-B≤2.10。採用原子力顯微鏡測試所述負極材料的顆粒表面，在負極材料的顆粒表面隨機選取&lt;img align="absmiddle" height="30px" width="86px" file="ed10011.JPG" alt="ed10011.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;測試區域，測試區域內相對於基準面的高度偏差絕對值的算術平均值為S nm，15nm≤S≤60 nm。本發明提供的負極材料，能夠綜合改善鋰離子傳輸動力學、首次庫倫效率和循環性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides an anode material and a battery. The anode material includes graphite and a carbon layer located on at least a portion of the surface of the graphite. Raman spectroscopy is used to test the particle surface and particle cross-section of the anode material. The peak area of the D characteristic peak in the range of 1300 cm⁻¹ to 1350 cm⁻¹ and the peak area of the G characteristic peak in the range of 1500 cm⁻¹ to 1580 cm⁻¹ give a ratio of I&lt;sub&gt;D&lt;/sub&gt;/I&lt;sub&gt;G&lt;/sub&gt;. The I&lt;sub&gt;D&lt;/sub&gt;/I&lt;sub&gt;G&lt;/sub&gt;ratio measured on the particle surface of the anode material is A, and the I&lt;sub&gt;D&lt;/sub&gt;/I&lt;sub&gt;G&lt;/sub&gt;ratio measured on the particle cross-section of the anode material is B, with 1.22 ＜ A - B ≤ 2.10. Atomic force microscopy (AFM) is used to test the particle surface of the anode material. A random 1μm×1μm test area is selected on the particle surface, and the arithmetic average of the absolute value of the height deviation relative to the reference plane within the test area is denoted as S (nm), where 15 nm ≤ S ≤ 60 nm. The anode material provided in this application can comprehensively improve lithium-ion transport kinetics, first-cycle coulombic efficiency, and cycle performance.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="737" publication-number="202616075">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616075</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114199</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於有效率使用神經信號處理器資源的多圖排程</chinese-title>
        <english-title>MULTI-GRAPH SCHEDULING FOR EFFICIENT USE OF NEURAL SIGNAL PROCESSOR RESOURCES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">G06F9/48</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡內　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAHNE, BRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的某些態樣提供用於一處理系統中之多圖執行的技術及設備。實施例包括藉由該處理系統接收表示與一第一機器學習模型相關之操作的一第一圖及表示與一第二機器學習模型相關之操作的一第二圖。實施例包括藉由該處理系統的一第一共用執行緒，優先排序來自該第一圖的執行就緒操作高於來自該第二圖的執行就緒操作。實施例包括藉由該處理系統的一第二共用執行緒，優先排序來自該第二圖的執行就緒操作高於來自該第一圖的執行就緒操作。實施例包括藉由該第一共用執行緒及該第二共用執行緒，基於該第一共用執行緒的該優先排序及該第二共用執行緒的該優先排序，執行與該第一機器學習模型及該第二機器學習模型相關的各別操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Certain aspects of the present disclosure provide techniques and apparatus for multi-graph execution in a processing system. Embodiments include receiving, by the processing system, a first graph representing operations related to a first machine learning model and a second graph representing operations related to a second machine learning model. Embodiments include prioritizing, by a first shared thread of the processing system, execution-ready operations from the first graph over execution-ready operations from the second graph. Embodiments include prioritizing, by a second shared thread of the processing system, execution-ready operations from the second graph over execution-ready operations from the first graph. Embodiments include executing, by the first shared thread and the second shared thread, respective operations related to the first machine learning model and the second machine learning model based on the prioritizing by the first shared thread and the prioritizing by the second shared thread.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:方法</p>
        <p type="p">505,510,515,520:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="738" publication-number="202616089">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616089</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114200</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於高頻寬應用之光學中介層上之３Ｄ堆疊輸入／輸出小晶片</chinese-title>
        <english-title>3D STACKED I/O CHIPLET ON OPTICAL INTERPOSER FOR HIGH BANDWIDTH APPLICATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">G06F13/20</main-classification>
        <further-classification edition="200601120260107B">G06F13/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商萊特美特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIGHTMATTER, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　光爵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩內　桑迪普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANE, SANDEEP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>圖爾卡特　布拉德福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TURCOTT, BRADFORD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格羅夫斯　泰勒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GROVES, TAYLOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>透納　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TURNER, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈里斯　尼可拉斯　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARRIS, NICHOLAS C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文卡特桑　斯里拉姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VENKATESAN, SRIRAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫迪　米圖爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MODI, MITUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴拉特　克里希那</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHARATH, KRISHNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿南德　立史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANAND, RISHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克林格　史蒂文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLINGER, STEVEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布南達　達里司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUNANDAR, DARIUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂正忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述一種利用具有與包含高速序列器/解序列器(SerDes)之一I/O小晶片整合之一主動光學中介層之一3D堆疊晶粒複合體之新穎方法。藉由以此方式整合矽，消除邊緣頻寬約束，從而允許將SerDes巨集放置於該I/O小晶片上之幾乎任何地方。就頻寬及功率消耗而言，本文所描述之基於光子之互連改良基於共同封裝光學器件(CPO)、線性驅動插拔式光學器件(LPO)及基於銅之解決方案之習知方法。本文所描述之互連依靠光子電子封裝，其中一PIC提供處理單元(例如，XPU)、電子交換晶片或其他類型之應用特定積體電路(ASIC)及對基於光纖之網路之存取而多個SerDes提供高速序列化及解序列化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein is a novel approach that leverages a 3D stacked die complex with an active optical interposer integrated with an I/O chiplet including high-speed serializer/deserializer (SerDes). By integrating silicon in this way, shoreline constraints are eliminated, allowing for the SerDes macros to be placed virtually anywhere on the I/O chiplet. The photonic-based interconnects described herein improve upon conventional approaches based on co-packaged optics (CPO), Linear-drive Pluggable Optics (LPO) and copper-based solutions in terms of bandwidth and power consumption. The interconnects described herein rely on photonic-electronic packages in which a PIC provides processing units (e.g., XPU), electronic switching chips or other types of application-specific integrated circuits (ASIC) with access to optical fiber-based networks while multiple SerDes provide high-speed serialization and deserialization.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:封裝</p>
        <p type="p">101:基板</p>
        <p type="p">102:光子積體電路(PIC)</p>
        <p type="p">104:電子積體電路(EIC)</p>
        <p type="p">105:凸塊</p>
        <p type="p">108:處理單元(XPU)</p>
        <p type="p">109:輸入/輸出(I/O)介面</p>
        <p type="p">110:波導</p>
        <p type="p">111:輸入/輸出(I/O)介面</p>
        <p type="p">112:光纖附接件</p>
        <p type="p">120:資料路徑</p>
        <p type="p">130:貫穿矽通孔(TSV)</p>
        <p type="p">132:貫穿矽通孔(TSV)</p>
        <p type="p">140:矽橋</p>
        <p type="p">150:序列器/解序列器(SerDes)</p>
        <p type="p">160:光子網路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="739" publication-number="202615929">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615929</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114233</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防窺透光裝置</chinese-title>
        <english-title>ANTI-PEEP LIGHT-TRANSMITTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251008B">G02B26/08</main-classification>
        <further-classification edition="200601120251008B">G02B27/10</further-classification>
        <further-classification edition="200601120251008B">G02B5/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深超光電（深圳）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CENTURY TECHNOLOGY (SHENZHEN) CORP.,LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳智忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIH-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬玉溪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIAO, YU-XI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊園</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIONG, YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴孟傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI, MENG-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周欣嫻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種防窺透光裝置，其包括一透光層、一填充層及複數防窺光柵。填充層設置於透光層的一表面上。複數防窺光柵設置於填充層中並沿著一第一方向間隔排列。各該防窺光柵包括複數遮光結構，並且複數遮光結構沿著一第二方向及一第三方向間隔排列。第一方向、第二方向及第三方向彼此正交。各遮光結構的一頂面及一底面平行於透光層的表面，並且各遮光結構的底面面對透光層的表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light-transmitting privacy protection device, comprising a light-transmitting layer, a filling layer, and a plurality of privacy protection gratings. The filling layer is disposed on one surface of the light-transmitting layer. The plurality of privacy protection gratings are disposed within the filling layer and spaced apart along a first direction. Each of the privacy protection gratings includes a plurality of light-blocking structures, and the plurality of light-blocking structures are spaced apart along a second direction and a third direction. The first direction, second direction, and third direction are mutually orthogonal. A top surface and a bottom surface of each light-blocking structure are parallel to the surface of the light-transmitting layer, and the bottom surface of each light-blocking structure faces the surface of the light-transmitting layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:防窺透光裝置</p>
        <p type="p">20:透光層</p>
        <p type="p">21:填充層</p>
        <p type="p">22:防窺光柵</p>
        <p type="p">220:遮光結構</p>
        <p type="p">LT1:光線</p>
        <p type="p">LT1’:光線</p>
        <p type="p">P1:位置</p>
        <p type="p">SB:底面</p>
        <p type="p">SF:表面</p>
        <p type="p">ST:頂面</p>
        <p type="p">LTM:光線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="740" publication-number="202616374">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616374</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114343</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H01L21/304</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>御所眞高</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOSHO, MASATAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江村智文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EMURA, TOMOFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>二郎
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMANAKA, REIJIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]謀求盛裝量的測定之效率化。  &lt;br/&gt;　　[解決手段]本揭示之基板處理裝置，係具備有：乾燥單元；排出管線；密度檢測部；及盛裝量算出部。乾燥單元，係供給有超臨界流體，將被盛裝於基板上的乾燥液置換成超臨界流體，藉此，使基板乾燥。排出管線，係從乾燥單元之內部，排出包含超臨界流體與乾燥液的混合流體。密度檢測部，係檢測流動於排出管線之混合流體的密度。盛裝量算出部，係基於密度檢測部檢測到之混合流體的密度，算出被盛裝於基板上之乾燥液的量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="741" publication-number="202616476">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616476</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114387</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體晶圓、處理半導體晶圓的方法和半導體晶片</chinese-title>
        <english-title>SEMICONDUCTOR WAFER, METHOD OF PROCESSING A SEMICONDUCTOR WAFER, AND SEMICONDUCTOR CHIP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H01L21/78</main-classification>
        <further-classification edition="200601120260109B">H01L23/544</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜敃圭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, MIN GYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴成基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SUNG KEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫鎬俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SON, HO JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔在汎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JAE BUM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據實施方式的半導體晶片包括：基板，其包括晶片區域和圍繞晶片區域的殘餘切割道；以及紅外標記，其設置在晶片區域內或殘餘切割道中。紅外標記包括多個光學圖案。多個光學圖案包括在基板上方具有不同堆疊結構的積體電路結構，並且多個光學圖案具有不同的紅外反射特性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor chip according to an embodiment includes a substrate including a chip region and a residual scribe lane surrounding the chip region, and an infrared marker disposed inside the chip region or in the residual scribe lane. The infrared marker includes a plurality of optical patterns. The plurality of optical patterns include integrated circuit structures with different stack structures over the substrate, and the plurality of optical patterns have differing infrared reflection characteristics.</p>
      </isu-abst>
      <representative-img>
        <p type="p">CR:晶片區域</p>
        <p type="p">FA1:第一框架標識符、框架標識符</p>
        <p type="p">FB1:第二框架標識符、框架標識符</p>
        <p type="p">SA:第一區域</p>
        <p type="p">SB:第二區域</p>
        <p type="p">SL:切割道</p>
        <p type="p">UF1:單元框架</p>
        <p type="p">X1:第一劃切線、劃切線</p>
        <p type="p">X2:第二劃切線、劃切線</p>
        <p type="p">X3:第三劃切線、劃切線</p>
        <p type="p">X4:第四劃切線、劃切線</p>
        <p type="p">X5:第五劃切線、劃切線</p>
        <p type="p">Y1:第六劃切線、劃切線</p>
        <p type="p">Y2:第七劃切線、劃切線</p>
        <p type="p">Y3:第八劃切線、劃切線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="742" publication-number="202615140">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615140</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114457</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣體溶解水之製造系統及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260102B">B01F21/00</main-classification>
        <further-classification edition="202201120260102B">B01F23/23</further-classification>
        <further-classification edition="202201120260102B">B01F25/31</further-classification>
        <further-classification edition="202201120260102B">B01F35/214</further-classification>
        <further-classification edition="202201120260102B">B01F35/221</further-classification>
        <further-classification edition="202301120260102B">C02F1/20</further-classification>
        <further-classification edition="202301120260102B">C02F1/68</further-classification>
        <further-classification edition="200601120260102B">G01N7/14</further-classification>
        <further-classification edition="200601120260102B">H01L21/304</further-classification>
        <further-classification edition="202201320260102B">B01F101/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商栗田工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井田純一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDA, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種氣體溶解水之製造系統，具有用於使氣體在供水中溶解的使用了氣體透過膜的氣體溶解模組，所述氣體溶解水之製造系統的特徵在於，包括氣相部壓力控制部件，所述氣相部壓力控制部件對氣體溶解模組的氣相側的壓力進行控制。一種氣體溶解水製造方法，其特徵在於，使用所述氣體溶解水之製造系統，並藉由所述氣相部壓力控制部件來製造所述規定的溶解氣體濃度的氣體溶解水。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1、3、7、8:配管</p>
        <p type="p">1v、7v:閥</p>
        <p type="p">2:氣體溶解模組</p>
        <p type="p">2a:液相部</p>
        <p type="p">2b:氣相部</p>
        <p type="p">2m:氣體透過膜</p>
        <p type="p">4:氣體注入量控制器</p>
        <p type="p">5:壓力感測器</p>
        <p type="p">6:控制裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="743" publication-number="202616419">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616419</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114510</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於連續晶粒接合之設備及方法</chinese-title>
        <english-title>APPARATUS AND METHOD FOR CONTINUOUS DIE BONDING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">H01L21/67</main-classification>
        <further-classification edition="200601120260107B">H01L21/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班斯洽普　喬茲夫　佩勒斯　韓瑞卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENSCHOP, JOZEF PETRUS HENRICUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澳坦斯　喬斯特　傑洛恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTTENS, JOOST JEROEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德　賈格　皮耶特　威廉　荷曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE JAGER, PIETER WILLEM HERMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於晶粒接合之系統，其包含：一供體載物台，其經組態以接納一或多個供體晶粒且經組態以將該一或多個供體晶粒移動至不同位置；一受體載物台，其經組態以提供一或多個受體部位；一量測系統，其經組態以量測該一或多個供體晶粒相對於該供體載物台之一部位且經組態以量測該一或多個受體部位相對於該受體載物台之一部位；以及一處理器系統，其經組態以基於該一或多個晶粒之經量測部位及/或該一或多個受體部位之經量測部位而驅動至少該供體載物台以將該一或多個供體晶粒中之一供體晶粒與該一或多個受體部位中之一對應受體部位對準，以供將該供體晶粒接合至該對應受體部位。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for die bonding comprising a donor stage configured to accept one or more donor dies and configured to move the one or more donor dies to different locations; an acceptor stage configured to provide one or more acceptor positions; a measurement system configured to measure a position of the one or more donor dies relative to the donor stage and configured to measure a position of the one or more acceptor positions relative to the acceptor stage; and a processor system configured to drive, based on the measured position of the one or more dies and/or measured position of the one or more acceptor positions, at least the donor stage to align a donor die of the one or more donor dies to a corresponding acceptor position of the one or more acceptor positions for bonding of the donor die to the corresponding acceptor position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">402A:供體晶粒</p>
        <p type="p">402B:供體晶粒</p>
        <p type="p">402C:供體晶粒</p>
        <p type="p">402D:供體晶粒</p>
        <p type="p">404A:目標晶粒</p>
        <p type="p">404B:目標晶粒</p>
        <p type="p">404C:目標晶粒</p>
        <p type="p">404D:目標晶粒</p>
        <p type="p">406:晶粒對</p>
        <p type="p">414:載體結構</p>
        <p type="p">416:載體結構</p>
        <p type="p">440:旋轉軸</p>
        <p type="p">442:虛線矩形</p>
        <p type="p">446:方向</p>
        <p type="p">450:位置量測元件</p>
        <p type="p">460:旋轉軸</p>
        <p type="p">466:方向</p>
        <p type="p">470:位置量測元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="744" publication-number="202616713">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616713</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114524</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於視訊寫碼的具有多組神經網路工具及上下文的基於ＣＮＮ的迴路內濾波器的參數傳訊</chinese-title>
        <english-title>PARAMETER SIGNALING FOR CNN-BASED IN-LOOP FILTERS WITH MULTIPLE SETS OF NEURAL NETWORK TOOLS AND CONTEXTS FOR VIDEO CODING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260109B">H04N19/117</main-classification>
        <further-classification edition="201401120260109B">H04N19/176</further-classification>
        <further-classification edition="201401120260109B">H04N19/70</further-classification>
        <further-classification edition="201401120260109B">H04N19/82</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞斯諾斯基　丹姆裘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUSANOVSKYY, DMYTRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>UA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡茲維克茲　馬塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARCZEWICZ, MARTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種視訊編碼器經組態以判定使用一基於神經網路(neural network, NN)的濾波器及一固定區塊大小推論來對視訊資料進行濾波，並且編碼一旗標，該旗標指示該固定區塊大小推論用於該基於NN的濾波器。相對應地，一視訊解碼器經組態以解碼一旗標，該旗標指示一固定區塊大小推論是否用於一基於NN的濾波器，及基於該旗標使用該基於NN的濾波器對視訊資料進行濾波。該旗標可於一序列參數集(sequence parameter set, SPS)層級傳訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A video encoder is configured to determine to filter video data using a neural network (NN)-based filter and a fixed block size inference, and encode a flag that indicates the fixed block size inference is used for the NN-based filter. Reciprocally, a video decoder is configured to decode a flag that indicates whether a fixed block size inference is used for an NN-based filter, and filter video data using the NN-based filter based on the flag. The flag may be signaled at a sequence parameter set (SPS) level.</p>
      </isu-abst>
      <representative-img>
        <p type="p">4200:流程</p>
        <p type="p">4210:流程</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="745" publication-number="202615971">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615971</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114538</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性樹脂組成物、感光性樹脂皮膜、感光性乾薄膜、圖型形成方法、顯示裝置及微發光二極體顯示器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G03F7/00</main-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/031</further-classification>
        <further-classification edition="200601120260102B">G03F7/033</further-classification>
        <further-classification edition="200601120260102B">G03F7/038</further-classification>
        <further-classification edition="200601120260102B">G03F7/075</further-classification>
        <further-classification edition="200601120260102B">G03F7/105</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="202501120260102B">H10H29/01</further-classification>
        <further-classification edition="202501120260102B">H10H29/851</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丸山仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARUYAMA, HITOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊澤久美子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAZAWA, KUMIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]目的在於提供一種可容易形成具有高微影解析性、良好的發光特性的皮膜的感光性樹脂組成物、使用該感光性樹脂組成物所得到的感光性樹脂皮膜、感光性乾薄膜及使用該等的圖型形成方法，以及使用前述感光性樹脂組成物所得到的顯示裝置。  &lt;br/&gt;　　[解決手段]一種感光性樹脂組成物，其特徵在於，包含：(A)支鏈中具有(甲基)丙烯醯基的丙烯酸樹脂、(B1)量子點、(B2)配位於前述(B1)成分的表面，並具有包含選自環氧乙烷及環氧丙烷之至少1種的重複單元的聚合物構造的硫醇配位子、(C)肟系光自由基產生劑、(D)界面活性劑及(E)溶劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="746" publication-number="202615629">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615629</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114540</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多層構造型之感光性乾薄膜、圖型形成方法、顯示裝置及微發光二極體顯示器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C09K11/02</main-classification>
        <further-classification edition="200601120260102B">C09K11/08</further-classification>
        <further-classification edition="200601120260102B">G03F7/00</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/033</further-classification>
        <further-classification edition="200601120260102B">G03F7/038</further-classification>
        <further-classification edition="200601120260102B">G03F7/075</further-classification>
        <further-classification edition="200601120260102B">G03F7/095</further-classification>
        <further-classification edition="200601120260102B">G03F7/105</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G02B5/00</further-classification>
        <further-classification edition="202501120260102B">H10D64/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丸山仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARUYAMA, HITOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊澤久美子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAZAWA, KUMIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 目的在於提供一種不用將含有量子點的光阻劑的製程與吸收藍色發光二極體的光的阻劑材料的製程分開而可一次進行的材料及使用此者的圖型形成方法及顯示裝置。  &lt;br/&gt;　　[解決手段] 一種多層構造型之感光性乾薄膜，其特徵在於，具備支持薄膜、形成於前述支持薄膜上的膜厚1~10μm的感光性樹脂皮膜層(A)、與形成於前述感光性樹脂皮膜層(A)上的含有量子點的膜厚1~100μm的感光性樹脂皮膜層(B)，其中，該感光性樹脂皮膜層(A)，在波長450~470nm之至少一部分的波長中穿透率為2%以下，在波長515~535nm之至少一部分的波長中穿透率為80%以上，在波長620~640nm之至少一部分的波長中穿透率為80%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:支持薄膜</p>
        <p type="p">2:感光性樹脂皮膜層(A)</p>
        <p type="p">3:感光性樹脂皮膜層(B)</p>
        <p type="p">10:多層構造型之感光性乾薄膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="747" publication-number="202615702">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615702</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114576</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置、氣體供給機構及氣體供給方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C23C16/448</main-classification>
        <further-classification edition="200601120260102B">H01L21/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長岡秀樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAOKA, HIDEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高木俊夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAGI, TOSHIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金子裕是</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEKO, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤井祐佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJII, YUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 當「使用原料儲槽內之原料氣化而生成的原料氣體，在基板上形成膜」的情況下，改善原料儲槽之溫度的控制性。  &lt;br/&gt;　　[解決手段] 一種基板處理裝置，係在基板形成膜，該基板處理裝置，其特徵係，具備有：處理容器，被構成為能夠進行減壓；載置台，被設置於前述處理容器內，載置前述基板；及氣體供給機構，將前述膜的原料氣體供給至前述處理容器，前述氣體供給機構，係具有：內側收容容器，收容儲存有前述膜的液體或固體之原料的原料儲槽；外側收容容器，收容前述內側收容容器，將前述內側收容容器與外部空間隔離；排氣機構，對前述外側收容容器內進行排氣；調溫機構，以使前述原料儲槽維持於預定溫度的方式，調節該原料儲槽的溫度；及供給管，以使在前述原料儲槽內氣化而生成的前述原料氣體被供給至前述處理容器的方式，連接前述原料儲槽與前述處理容器，前述調溫機構，係具有：加熱部，加熱前述原料儲槽；及冷卻部，冷卻前述原料儲槽，前述冷卻部，係具有：吸熱部，被設置於前述內側收容容器內，吸收前述原料儲槽的熱；及散熱部，被設置於前述內側收容容器外且前述外側收容容器內，放出前述吸熱部吸收到之前述原料儲槽的熱。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:成膜裝置</p>
        <p type="p">10:處理容器</p>
        <p type="p">11:排氣機構</p>
        <p type="p">20:載置台</p>
        <p type="p">30:氣體導入部</p>
        <p type="p">40:氣體供給機構</p>
        <p type="p">41:供給管</p>
        <p type="p">42:內側收容容器</p>
        <p type="p">43:外側收容容器</p>
        <p type="p">43a:排氣口</p>
        <p type="p">43b:供氣口</p>
        <p type="p">44:調溫機構</p>
        <p type="p">51:開關閥</p>
        <p type="p">52:流量控制閥</p>
        <p type="p">53:開關閥</p>
        <p type="p">61:供給管</p>
        <p type="p">62:流量控制閥</p>
        <p type="p">63:開關閥</p>
        <p type="p">64:排出管</p>
        <p type="p">70:排氣機構</p>
        <p type="p">71:排氣管</p>
        <p type="p">72:排氣泵</p>
        <p type="p">81:加熱部</p>
        <p type="p">82:冷卻部</p>
        <p type="p">82a:吸熱部</p>
        <p type="p">82b:散熱片</p>
        <p type="p">82e:熱導管</p>
        <p type="p">M:控制部</p>
        <p type="p">SN:供給源</p>
        <p type="p">T:原料儲槽</p>
        <p type="p">W:晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="748" publication-number="202615774">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615774</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114603</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電動壓縮機監控和保養的維護方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">F04D27/00</main-classification>
        <further-classification edition="200601120260107B">H01S3/223</further-classification>
        <further-classification edition="201601120260107B">H02P29/024</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商創浦半導體製造雷射系統歐洲股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRUMPF LASERSYSTEMS FOR SEMICONDUCTOR MANUFACTURING SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹施　賽德里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUNSCH, CEDRIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種用於監控和保養電動壓縮機(7)、特別是二氧化碳雷射系統(1)中雷射氣體(4)循環的維護方法(25)，其步驟包括：&lt;br/&gt;  b)      藉由將該電動壓縮機(7)的一電動驅動單元(22)之驅動模式改為發電機模式，以降低(26)該電動壓縮機(7)的一壓縮機轉速(27)；&lt;br/&gt;  c)       藉由以時間(30)為函數偵測該壓縮機轉速(27)，以識別出(32)一減速；&lt;br/&gt;  d)      比較(36)該減速、特別是一減速曲線(31)與至少一儲存的參考減速(33)；&lt;br/&gt;  e)       取決步驟d)的比較，提出(37)一維護建議。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:二氧化碳雷射系統</p>
        <p type="p">4:雷射氣體</p>
        <p type="p">7:電動壓縮機</p>
        <p type="p">22:電動驅動單元</p>
        <p type="p">25:維護方法</p>
        <p type="p">26:步驟</p>
        <p type="p">27:壓縮機轉速</p>
        <p type="p">30:時間</p>
        <p type="p">31:減速曲線</p>
        <p type="p">32:步驟</p>
        <p type="p">33:參考減速</p>
        <p type="p">36:步驟</p>
        <p type="p">37:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="749" publication-number="202615982">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615982</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114604</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於投射微影的成像光學單元</chinese-title>
        <english-title>IMAGING OPTICAL UNIT FOR PROJECTION LITHOGRAPHY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G03F7/20</main-classification>
        <further-classification edition="200601120260102B">G02B17/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS SMT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼凱　克里斯多芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENKE, CHRISTOPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝德　蘇珊納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEDER, SUSANNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明恩茨　霍格爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUENZ, HOLGER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於投射微影的成像光學單元(10)，用於將一物場(5)成像到一像場(11)中，該物場中可配置所要成像的一光罩，該像場中可配置所要曝光的一基板，該成像光學單元(10)具有複數個反射鏡(M1至M8)，用將成像光(16)沿從該物場(5)至該像場(11)的一成像束路徑導引。該成像光學單元(10)的一像側數值孔徑大於0.75。該成像光學單元(10)的一光學擴展量大於45 mm²。如此，成像光學單元具有用於投射曝光設備的改良的可用性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An imaging optical unit (10) for projection lithography serves to image an object field (5), in which a reticle to be imaged is arrangeable, into an image field (11), in which a substrate to be exposed is arrangeable. The imaging optical unit (10) has a plurality of mirrors (M1 to M8) for guiding imaging light (16) along an imaging beam path from the object field (5) to the image field (11). An image-side numerical aperture of the imaging optical unit (10) is greater than 0.75. An étendue of the imaging optical unit (10) is greater than 45 mm². This results in an imaging optical unit with improved usability for a projection exposure apparatus.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:投影曝光設備</p>
        <p type="p">2:照射系統</p>
        <p type="p">3:光源</p>
        <p type="p">4:照射光學單元</p>
        <p type="p">5:物場</p>
        <p type="p">6:物件平面</p>
        <p type="p">7:光罩</p>
        <p type="p">8:光罩承載器</p>
        <p type="p">9:光罩位移驅動器</p>
        <p type="p">10:成像光學單元/投影光學單元</p>
        <p type="p">11:像場</p>
        <p type="p">12:影像平面/焦點平面</p>
        <p type="p">13:晶圓/基板</p>
        <p type="p">14:晶圓承載器</p>
        <p type="p">15:晶圓位移驅動器</p>
        <p type="p">16:照射輻射/成像光</p>
        <p type="p">17:聚光器</p>
        <p type="p">18:中間焦點平面</p>
        <p type="p">19:第一分面反射鏡/場分面反射鏡</p>
        <p type="p">20:分面元件/場分面</p>
        <p type="p">21:第二分面反射鏡/瞳分面反射鏡</p>
        <p type="p">22:第二分面</p>
        <p type="p">23:通道開口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="750" publication-number="202615240">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615240</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114612</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造包裝之方法</chinese-title>
        <english-title>METHODS OF PRODUCING PACKAGING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">B29C51/02</main-classification>
        <further-classification edition="200601120260107B">B29C51/42</further-classification>
        <further-classification edition="200601120260107B">B29C49/00</further-classification>
        <further-classification edition="200601120260107B">B65D85/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商味好美（英國）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCCORMICK (UK) LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勒　戈　羅倫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LE GAL, LAURENCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔特　安迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TART, ANDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴里　阿圖爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BALI, ATUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種製造可堆肥模製食品包裝容器之方法，其中該容器具有用於容納食物之空腔、可藉以存取該食物之開口及至少部分地圍繞該開口延伸之可堆肥蓋可黏附至的唇緣，其中該方法包含：a）提供由可堆肥材料形成之可熱成型膜；及b）在約98℃至約115℃範圍內之溫度下由該可熱成型膜對該包裝容器之該空腔進行熱成型。該所得包裝容器尤其適用於製造用於快餐餐館及外賣店之單份醬汁罐，但亦可用於單份烹調醬汁及濃縮湯料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a method of producing a compostable moulded food packaging container, wherein the container has a cavity for receiving a foodstuff, an opening through which the foodstuff can be accessed, and a lip extending at least partially around the opening to which a compostable lid can be adhered, wherein the method comprises: a) providing a thermoformable film formed of a compostable material; and b) thermoforming the cavity of the packaging container from the thermoformable film at a temperature in the range of about 98 ℃ to about 115 ℃. The resultant packaging container is particularly useful for producing single serve sauce pots for quick serve restaurants and take-away outlets, but could also be used for single serve cooking sauces and concentrated stock.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:奈米摻混樹脂</p>
        <p type="p">2:擠壓模</p>
        <p type="p">3:經熔融奈米摻混聚合物</p>
        <p type="p">4:夾持輥</p>
        <p type="p">5:冷卻輥</p>
        <p type="p">6:膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="751" publication-number="202615684">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615684</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114732</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於遠端電漿的沉積</chinese-title>
        <english-title>REMOTE PLASMA-BASED DEPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C23C16/04</main-classification>
        <further-classification edition="200601120260102B">C23C16/06</further-classification>
        <further-classification edition="200601120260102B">C23C16/24</further-classification>
        <further-classification edition="200601120260102B">C23C16/42</further-classification>
        <further-classification edition="200601120260102B">C23C16/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔平　史帝芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOPPING, STEPHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯尼華森　伊斯華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SRINIVASAN, EASWAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡拉德拉彥　巴德里　Ｎ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VARADARAJAN, BHADRI N.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豪斯曼恩　丹尼斯　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAUSMANN, DENNIS M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴爾加瓦　努普爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHARGAVA, NUPUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃德蒙森　布萊斯　以賽亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EDMONDSON, BRYCE ISAIAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫爾　希瓦吉　比姆拉奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORE, SHAHAJI BHIMRAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勒邁爾　保羅　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEMAIRE, PAUL C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞伯　喬瑟夫　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABEL, JOSEPH R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供利用自由基輔助遠端電漿沉積形成膜的磊晶技術。部分膜可經摻雜。沉積可選擇性地進行。沉積可與蝕刻結合進行，蝕刻亦可選擇性地進行。亦可進行額外操作，包括對基板預清潔及預處理。亦描述用於製備及製造包含摻雜層之膜及材料的設備及系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Epitaxial techniques for forming films using radical-assisted remote plasma deposition are provided. Some films may be doped. Deposition may be performed selectively. Deposition may be performed in conjunction with etching, which also may be performed selectively. Additional operations may also be performed, including pre-cleaning and pre-treating the substrate. Also described are apparatuses and systems for preparing and making the films and materials including doped layers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:自由基輔助磊晶沉積製程、非限定方法</p>
        <p type="p">101:操作</p>
        <p type="p">103:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="752" publication-number="202615640">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615640</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114738</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>烷氧基化脂肪醇於改良金屬組件之低溫清潔的用途</chinese-title>
        <english-title>USE OF ALKOXYLATED FATTY ALCOHOLS TO IMPROVE LOW-TEMPERATURE CLEANING OF METALLIC COMPONENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C11D1/825</main-classification>
        <further-classification edition="200601120260102B">C11D3/04</further-classification>
        <further-classification edition="200601120260102B">C11D3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商漢高股份有限及兩合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HENKEL AG &amp; CO. KGAA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施密特　西爾維亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHMIDT, SILVIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種pH高於8.5之鹼性水性清潔劑，其含有在各情況下相對於該清潔劑：至少0.10重量%的界面活性劑混合物，該界面活性劑混合物包含(i)相對於組分(i)至(iii)之總量至少50重量%的一或多種選自用環氧乙烷(EO)及環氧丙烷(PO)烷氧基化且EO:PO比率大於1:1的脂肪醇的界面活性劑，(ii)相對於組分(i)至(iii)之總量小於50重量%的一或多種選自用環氧乙烷(EO)及環氧丙烷(PO)烷氧基化且EO:PO比率等於或小於1:1的脂肪醇的界面活性劑，及(iii)視情況存在之較佳具有消泡特性的其他界面活性劑；0.10至5.0重量%的鹼金屬氫氧化物；0.05至4.0重量%的水溶性磷酸鹽；視情況存在之至多1.0重量%的有機錯合劑；及水。本發明亦係關於一種用於對組件之金屬表面進行除油的方法，其中至少使該組件之該等金屬表面與該所描述之鹼性水性清潔劑接觸，其中在接觸期間該清潔劑之溫度低於50℃。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an alkaline aqueous cleaner with a pH above 8.5, which, in each case in relation to the cleaner, contains at least 0.10 wt.% of a surfactant mixture comprising (i) at least 50 wt.%, in relation to the total amount of components (i) to (iii), of one or more surfactants selected from fatty alcohols alkoxylated with ethylene oxide (EO) and propylene oxide (PO), which have an EO:PO ratio of greater than 1:1, (ii) less than 50 wt.%, in relation to the total amount of components (i) to (iii), of one or more surfactants selected from fatty alcohols alkoxylated with ethylene oxide (EO) and propylene oxide (PO), which have an EO:PO ratio of 1:1 or less, and (iii) optionally further surfactants, preferably with defoaming properties; 0.10 to 5.0 wt.% of alkali metal hydroxides; 0.05 to 4.0 wt.% of water-soluble phosphates; optionally up to 1.0 wt.% of organic complexing agents and water. The invention also relates to a method for degreasing the metallic surfaces of a component, in which at least the metallic surfaces of the component are brought into contact with the described alkaline aqueous cleaner, wherein the temperature of the cleaner during contact is below 50 ℃.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="753" publication-number="202616737">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616737</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114771</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用行動至頭部音訊記錄的頭部相關轉移函數的空間音訊個人化</chinese-title>
        <english-title>SPATIAL AUDIO PERSONALIZATION OF HEAD-RELATED TRANSFER FUNCTIONS USING MOBILE-TO-HEAD AUDIO RECORDINGS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H04S7/00</main-classification>
        <further-classification edition="200601220260102B">H04R5/033</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金純恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, CHUN KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯里尼瓦桑　蘭吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SRINIVASAN, RAMJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史凱佛奇　安德烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHEVCIW, ANDRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供用於處理音訊資料之系統及技術。例如，一種程序可包括：基於各自使用在一近場測量距離處的一各別測量位置獲得的複數個音訊測量，而判定對應於一使用者的一組近場頭部相關轉移函數(Head-Related Transfer Function, HRTF)。對應於該使用者的一組遠場HRTF可基於該組近場HRTF而產生。該組遠場HRTF可與基於對應於該使用者的人體測量特徵而獲得的一或多個候選遠場HRTF比較。可針對該使用者將一經個別化HRTF判定為該一或多個候選遠場HRTF之與在對應測量位置處的該組遠場HRTF具有最小頻譜差異的一候選遠場HRTF。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and techniques are provided for processing audio data. For example, a process can include determining a set of near-field Head-Related Transfer Functions (HRTFs) corresponding to a user, based on a plurality of audio measurements each obtained using a respective measurement position at a near-field measurement distance. A set of far-field HRTFs corresponding to the user can be generated based on the set of near-field HRTFs. The set of far-field HRTFs can be compared to one or more candidate far-field HRTFs obtained based on anthropometric features corresponding to the user. An individualized HRTF can be determined for the user as a candidate far-field HRTF of the one or more candidate far-field HRTFs having minimum spectral differences from the set of far-field HRTFs at corresponding measurement positions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:音訊處理系統；系統</p>
        <p type="p">402:使用者</p>
        <p type="p">405:耳戴式裝置；第一耳戴式裝置；第二耳戴式裝置；入耳式裝置；耳塞式耳機</p>
        <p type="p">410:行動運算裝置；手持裝置；行動裝置；裝置；行動電話；手持運算裝置</p>
        <p type="p">415:手持至耳朵音訊記錄；音訊測量；行動至耳朵音訊測量；經擷取音訊記錄；第一記錄；第二記錄；第三記錄；音訊記錄；經記錄測量信號；手持至耳朵記錄；手持至耳朵音訊記錄資訊；基於移動音訊的測量</p>
        <p type="p">418:雜訊分析及/或雜訊抑制技術；雜訊分析及雜訊抑制技術；雜訊抑制技術；雜訊分析及抑制技術；雜訊抑制/測量補償</p>
        <p type="p">420:近場HRTF的子集；近場HRTF；HRTF的子集；子集；近場HRTF子集&lt;i&gt;U&lt;/i&gt;；近場離散HRTF；近場離散HRTF子集&lt;i&gt;U&lt;/i&gt;</p>
        <p type="p">430:遠場HRTF外推引擎</p>
        <p type="p">434:HRTF子集；經外推遠場HRTF子集；經外推遠場HRTF；遠場HRTF；遠場HRTF子集；最佳候選HRTF集；經外推遠場使用者HRTF子集</p>
        <p type="p">450:HRTF個人化引擎；遠端HRTF個人化引擎</p>
        <p type="p">454:經個別化HRTF集；最佳匹配HRTF集；最佳匹配候選遠場HRTF；經個人化或經個別化HRTF集</p>
        <p type="p">470:攝影機或影像擷取裝置</p>
        <p type="p">472:使用者聽覺解剖結構的影像資料；使用者的聽覺解剖結構的照片或掃描；影像；影像資料；使用者聽覺人體解剖結構影像資料</p>
        <p type="p">475:人體測量匹配引擎；基於人體測量視覺的匹配引擎</p>
        <p type="p">480:遠場HRTF資料庫；參考資料庫；資料庫；遠場參考HRTF；HRTF資料庫；遠場參考HRTF資料庫</p>
        <p type="p">482:遠場HRTF；遠場候選HRTF；遠場候選集；人體測量HRTF候選；遠場人體測量匹配JHRTF候選；遠場HRTF；遠場HRTF候選集；HRTF候選；候選HRTF集；遠場候選；候選HRTF；候選遠場HRTF；遠場HRTF候選；基於人體測量視覺的候選HRTF；候選集</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="754" publication-number="202616501">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616501</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114787</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝結構及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">H01L23/495</main-classification>
        <further-classification edition="200601120260107B">H01L21/768</further-classification>
        <further-classification edition="200601120260107B">H01L21/78</further-classification>
        <further-classification edition="200601120260107B">H01L23/00</further-classification>
        <further-classification edition="200601120260107B">H01L23/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張晉強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIN-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種半導體封裝結構及其形成方法。該半導體封裝結構包括一半導體晶片和一導電膠層。該半導體晶片包括一半導體基板、一半導體裝置和一通孔。該半導體基板具有第一表面和第二表面。該半導體裝置形成於該半導體基板的第一表面上。該通孔以穿透該半導體基板的方式形成。該導電膠層設置於該半導體基板的第二表面上。該通孔與該導電膠層相連。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor package structure and a method for forming the same are provided. The semiconductor package structure includes a semiconductor die and a conductive adhesive layer. The semiconductor die includes a semiconductor substrate, a semiconductor substrate and a through via. The semiconductor substrate has a first surface and a second surface. The semiconductor device is formed on the first surface of the semiconductor substrate. The through via is formed in such a way that it passes through the semiconductor substrate. The conductive adhesive layer is disposed on the second surface of the semiconductor substrate. The through via is coupled to the conductive adhesive layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:引線架</p>
        <p type="p">102:晶片附著墊</p>
        <p type="p">102B:底表面</p>
        <p type="p">102T:頂表面</p>
        <p type="p">104:綁帶</p>
        <p type="p">110:引線</p>
        <p type="p">130:導電線</p>
        <p type="p">140:封裝化合物</p>
        <p type="p">150:導電膠層</p>
        <p type="p">230:導電墊</p>
        <p type="p">250:半導體晶片</p>
        <p type="p">30:方向</p>
        <p type="p">31:方向</p>
        <p type="p">32:方向</p>
        <p type="p">500:半導體封裝結構</p>
        <p type="p">A-A’:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="755" publication-number="202615704">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615704</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114790</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理系統中的故障安全控制</chinese-title>
        <english-title>FAIL-SAFE CONTROL IN SUBSTRATE PROCESSING SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C23C16/455</main-classification>
        <further-classification edition="200601120260102B">C23C16/52</further-classification>
        <further-classification edition="200601120260102B">H01L21/67</further-classification>
        <further-classification edition="202301120260102B">G06N3/08</further-classification>
        <further-classification edition="201901120260102B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班傑明拉吉　戴米安拉吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENJAMIN RAJ, DAEMIAN RAJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冷　子為</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LENG, COLLEN ZIWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿里　哈桑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALI, HASSAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山卡拉穆席　凡卡塔納拉亞納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANKARAMURTHY, VENKATANARAYANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯坦迪什　彼得邁爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STANDISH, PETER MILES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅茲　崔維斯克拉克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAZZY, TRAVIS CLARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克利歐　托爾斯騰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRIL, THORSTEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙阿　阿希什Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAH, ASHISH A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>罕查諾爾拉特納卡拉勾達　巴拉特庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANCHANOOR RATHNAKARA GOWDA, BHARATH KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科納努爾納根德拉　赫曼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONANUR NAGENDRA, HEMANTH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金昱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包括：執行待用於基板處理系統的流體的自動分類；識別基板處理系統的部分；執行與基板處理系統的部分中的一或多者相關聯的流體的位置感知；並根據自動分類、基板處理系統的部分以及位置感知促使經由基板處理設備的基板處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes: performing auto-classification of fluids to be used in a substrate processing system; identifying portions of the substrate processing system; performing positional awareness of the fluids associated with one or more of the portions of the substrate processing system; and causing substrate processing via substrate processing equipment based on the auto-classification, the portions of the substrate processing system, and the positional awareness.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:方法</p>
        <p type="p">302:方塊</p>
        <p type="p">304:方塊</p>
        <p type="p">306:方塊</p>
        <p type="p">308:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="756" publication-number="202616253">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616253</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114860</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於消除耦合至觸控感測電路的雜訊之補償電路及補償方法</chinese-title>
        <english-title>COMPENSATION CIRCUIT AND METHOD FOR CANCELLING NOISE COUPLED TO TOUCH SENSING CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250901B">G09G3/32</main-classification>
        <further-classification edition="200601120250901B">G06F3/041</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇景光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIMAX TECHNOLOGIES LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YAW-GUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何嘉銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, JIA-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">補償電路的運算處理器對多個第一數位碼進行平均以產生第一平均數位碼，且對多個第二數位碼進行平均以產生第二平均數位碼。第二數位碼對應於源極驅動器向連接到當前驅動閘極線的多個像素所提供的多個灰階電壓。第一數位碼對應於源極驅動器向連接到先前驅動閘極線的多個像素所提供的多個灰階電壓。補償電路的數位類比轉換器將第一平均數位碼轉換為第一電壓並將第二平均數位碼轉換為第二電壓，從而產生從第二電壓變遷到第一電壓的補償訊號。補償電路的放大器電路根據補償訊號產生反向雜訊訊號並將反向雜訊訊號施加至觸控感測電路的輸入端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A compensation circuit includes a computing processor, a DAC, and an amplifier circuit. The computing processor averages first digital codes to generate a first average digital code and averages second digital codes to generate a second average digital code. The second digital codes correspond to grayscale voltages provided from a source driver to pixels connected to a currently driven gate line. The first digital codes correspond to grayscale voltages provided from the source driver to pixels connected to a previously driven gate line. The DAC converts the first average digital code into a first voltage and converts the second average digital code into a second voltage, thereby generating a compensation signal transiting from the second voltage to the first voltage. The amplifier circuit generates an inverse noise signal according to the compensation signal and applies the inverse noise signal to an input terminal of the touch sensing circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:補償電路</p>
        <p type="p">100:觸控感測電路</p>
        <p type="p">200:OLED像素電路</p>
        <p type="p">Cm:互電容</p>
        <p type="p">C_couple:耦合電容</p>
        <p type="p">C_DD:儲存電容</p>
        <p type="p">ELVDD:電壓供應線</p>
        <p type="p">IN:輸入端</p>
        <p type="p">SD_1:源極驅動訊號</p>
        <p type="p">Si:反向訊號</p>
        <p type="p">Sn:雜訊</p>
        <p type="p">TX:觸控訊號</p>
        <p type="p">Vout:類比電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="757" publication-number="202616211">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616211</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114912</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體樣本檢查的粗糙度估算</chinese-title>
        <english-title>ROUGHNESS ESTIMATION FOR EXAMINATION OF SEMICONDUCTOR SPECIMENS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260107B">G06T7/00</main-classification>
        <further-classification edition="202201120260107B">G06V10/46</further-classification>
        <further-classification edition="202201120260107B">G06V10/98</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商應用材料以色列公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS ISRAEL LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝瓦利埃　皮埃爾尚馬力朱利安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEVALIER, PIERRE JEAN-MARIE JULIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布格倫　尚法蘭索瓦阿爾伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOUGRON, JEAN-FRANCOIS ALBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種估算半導體樣本上特徵邊緣粗糙度的系統和方法。該方法包括獲取捕捉特徵的圖像集及該特徵的設計資料；對於圖像集中每個給定圖像，提供該給定圖像中特徵的目標輪廓，從而產生與圖像集對應的目標輪廓集，其中目標輪廓是藉由校正從給定圖像中提取的特徵的實際輪廓來獲得的，校正的依據是特徵的實際輪廓與從設計資料獲得的參考輪廓之間的轉換；並根據目標輪廓集之每一者目標輪廓與參考輪廓之間的邊緣放置差異（EPD）產生功率譜密度（PSD）資料，其中PSD資料可用於估算該特徵的邊緣粗糙度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is provided a system and method of estimating edge roughness of a feature on a semiconductor specimen. The method includes obtaining a set of images capturing the feature and design data of the feature; providing, for each given image in the set, a target contour of the feature in the given image, giving rise to a set of target contours corresponding to the set of images, wherein the target contour is obtained by correcting an actual contour of the feature extracted from the given image, with respect to a transformation between the actual contour and a reference contour of the feature obtained from the design data; and generating power spectral density (PSD) data based on edge placement difference (EPD) between each target contour in the set of target contours and the reference contour, wherein the PSD data is usable for estimating edge roughness of the feature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:檢查系統</p>
        <p type="p">101:基於電腦的系統</p>
        <p type="p">102:處理電路</p>
        <p type="p">103:處理元件</p>
        <p type="p">104:輪廓提取模組</p>
        <p type="p">106:輪廓校正模組</p>
        <p type="p">108:PSD模組</p>
        <p type="p">110:處理元件</p>
        <p type="p">112:去雜訊模組</p>
        <p type="p">114:粗糙度估算模組</p>
        <p type="p">120:檢查工具</p>
        <p type="p">122:儲存單元</p>
        <p type="p">124:GUI</p>
        <p type="p">126:I/O介面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="758" publication-number="202616420">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616420</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114918</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>藉由晶粒上之基於繞射之對準標記進行晶粒接合之系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR DIE BONDING WITH DIFFRACTION BASED ALIGNMENT MARKS ON THE DIE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/67</main-classification>
        <further-classification edition="200601120260102B">H01L21/68</further-classification>
        <further-classification edition="200601120260102B">H01L23/544</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德　賈格　皮耶特　威廉　荷曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE JAGER, PIETER WILLEM HERMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭登　克里斯汀　亨利特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHOUTEN, CHRISTINE HENRIETTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多克　維克托　賽巴斯汀安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOLK, VICTOR SEBASTIAAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦赫貝赫　洛特菲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAHBEH, LOTFI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿森德爾夫特　喬普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASSENDELFT, JOEP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布斯卓恩　可瑞恩　弗瑞德瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUSTRAAN, KRIJN FREDERIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙欣　布凱特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAHIN, BUKET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾利約翰　喬普　漢尼　胡布　瑪麗亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALLELEIJN, JOEP HANNI HUB MARIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布羅爾斯　桑迪爾　克里斯丁安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROERS, SANDER CHRISTIAAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡駑戈帕蘭　斯安　帕拉雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VENUGOPALAN, SYAM PARAYIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許家豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIA-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述一種接合偵測器系統，該接合偵測器系統包含一輻射感測器、一或多個處理器、指令或其他組件。該系統包含一輻射感測器，該輻射感測器經組態以基於自一半導體晶粒之一基於繞射之對準標記接收的一繞射輻射圖案而產生一信號。該等指令致使該一或多個處理器基於該信號來判定該基於繞射之對準標記之一位置；及基於該位置來產生經組態以致使該半導體晶粒對準至一接合部位的一信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bonding detector system comprising a radiation sensor, one or more processors, instructions, or other components is described. The system comprises a radiation sensor configured to generate a signal based on a pattern of diffracted radiation received from a diffraction based alignment mark of a semiconductor die. The instructions cause the one or more processors to determine a position of the diffraction based alignment mark based on the signal; and generate, based on the position, a signal configured to cause alignment of the semiconductor die to a bonding location.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120:晶粒(對準)標記/對準標記/標記/基於繞射之對準標記</p>
        <p type="p">300:供體基板/基板</p>
        <p type="p">301:系統</p>
        <p type="p">302A:供體晶粒/對準點/半導體供體晶粒/半導體晶粒</p>
        <p type="p">302B:供體晶粒/對準點/半導體供體晶粒/半導體晶粒</p>
        <p type="p">302C:供體晶粒/對準點/半導體供體晶粒/半導體晶粒</p>
        <p type="p">303A:對準點</p>
        <p type="p">303B:對準點</p>
        <p type="p">303C:對準點</p>
        <p type="p">305A:對準點</p>
        <p type="p">305B:對準點</p>
        <p type="p">305C:對準點</p>
        <p type="p">314:載體</p>
        <p type="p">332:接合支撐結構</p>
        <p type="p">350:受體基板</p>
        <p type="p">450:晶圓載物台</p>
        <p type="p">Y:Y軸/Y方向</p>
        <p type="p">Z:Z軸/Z方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="759" publication-number="202616821">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616821</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114927</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用記憶體應用後處理的低K間隔物的方法及結構</chinese-title>
        <english-title>METHOD AND STRUCTURE OF LOW-K SPACER USING POST-TREATMENT FOR MEMORY APPLICATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">H10B12/00</main-classification>
        <further-classification edition="202301120260102B">H10B80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜昌錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, CHANG SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪卡拉　拉古維爾薩蒂亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKALA, RAGHUVEER SATYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費雪伯恩　菲德里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FISHBURN, FREDRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳學忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSUEH CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普蘭薩西哈蘭　巴拉薩拉瑪年</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRANATHARTHIHARAN, BALASUBRAMANIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">製造2D DRAM和3D DRAM元件的示範性方法，包含從基板上蝕刻出低K間隔物材料的一部分。這些方法可以包含將2D DRAM位元線的剩餘低K間隔物材料暴露於含碳前驅物中，以補充低K間隔物材料中的碳含量。額外方法可以包含將3D DRAM字線的剩餘低K間隔物材料暴露於含碳前驅物中，以補充低K間隔物材料中的碳含量。進一步的實施例可以包含與紫外線（UV）輻射的同時處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Exemplary methods of manufacturing 2D DRAM and 3D DRAM devices include etching a portion of a low-k spacer material from a substrate. The methods may include exposing the remaining portion of the low-k spacer material of a 2D DRAM bit line to a carbon-containing precursor, to replenish the carbon content in the low-k spacer material. Additional methods may include exposing the remaining portion of the low-k spacer material of a 3D DRAM word line to a carbon-containing precursor to replenish the carbon content in the low-k spacer material. Further embodiments may include simultaneous treatment with ultraviolet (UV) radiation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:DRAM元件/方法</p>
        <p type="p">102:基板</p>
        <p type="p">104:活性層</p>
        <p type="p">106:金屬層</p>
        <p type="p">110:介電層</p>
        <p type="p">116:低K間隔物材料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="760" publication-number="202616574">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616574</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114931</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器</chinese-title>
        <english-title>ELECTRICAL CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251031B">H01R13/24</main-classification>
        <further-classification edition="200601120251031B">H01R13/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖芳竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, FANG-JWU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉家豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JIA-HAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電連接器，包括絕緣本體及端子，絕緣本體設有上、下表面及端子槽，端子設置於對應的端子槽內；端子由金屬板衝壓彎折而形成，包括基部、自所述基部向上依序延伸的上彈性部、上接觸部及上抵接部，以及自基部向下依序延伸的下彈性部、下接觸部及下抵接部，上抵接部自上接觸部向下彎折，下抵接部自下接觸部向上彎折；基部具有沿水平方向延伸的上支撐部及下支撐部；當端子被抵壓時，上抵接部抵接於上支撐部，下抵接部抵接於下支撐部。本發明通過將上、下抵接部分別與對應的上、下支撐部接觸，使得端子的內接觸比較容易且相對穩定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses an electrical connector which includes an insulating housing and plural conductive terminals. The insulating housing includes an upper face, a lower face and plural terminal grooves penetrating the upper face and the lower face. The conductive terminals are received and retained in the corresponding terminal grooves one by one. The conductive terminal is formed from an integral metal plate by stamping and bending and includes a base portion, an upper elastic arm extends upwardly from the base portion and a lower elastic arm extends downwardly from the base portion. The upper elastic arm includes an upper elastic portion, an upper contacting portion and an upper abutting portion extends from the base portion in order and the lower elastic arm includes a lower elastic portion, a lower contacting portion and a lower abutting portion extends from the base portion in order. The upper abutting portion bends from the upper contacting portion downwardly and the lower abutting portion bends from the lower contacting portion upwardly. The conductive terminal has an upper resisting portion and a lower resisting portion extend horizontally. A dual conductive path is able to be achieved easily by the upper abutting portion abutting against the upper resisting portion and the lower abutting portion abutting against the lower resisting portion respectively when the conductive terminal is pressed, and thus, the conductive terminals of the electrical connector have a good conductive property.</p>
      </isu-abst>
      <representative-img>
        <p type="p">202:右表面</p>
        <p type="p">203:上支撐部</p>
        <p type="p">22:上彈性部</p>
        <p type="p">23:上接觸部</p>
        <p type="p">24:下彈性部</p>
        <p type="p">241:下豎直部</p>
        <p type="p">25:上抵接部</p>
        <p type="p">26:下接觸部</p>
        <p type="p">27:下抵接部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="761" publication-number="202615814">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615814</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114940</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用於工件之膜厚推定的參考光譜庫之製作方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">G01B11/06</main-classification>
        <further-classification edition="200601120260109B">H01L21/66</further-classification>
        <further-classification edition="200601120260109B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商荏原製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBARA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邉夕貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾文岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳凱智</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可使對應於複數個參考光譜之複數個膜厚的正確度提高之參考光譜庫的製作方法。參考光譜庫之製作方法係生成來自參考工件在研磨中於複數個研磨時間所獲得的參考工件之反射光的複數個參考光譜，從複數個參考光譜計算顯示參考工件之研磨進展的複數個研磨指標值，從參考工件之初期膜厚、複數個研磨指標值、及參考工件之最終膜厚，決定顯示參考工件之膜厚與研磨時間的關係之研磨率線，再依據研磨率線決定對應於複數個研磨指標值之複數個參考膜厚，藉由將複數個參考膜厚與複數個參考光譜相關連來製作參考光譜庫。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">RH:參考膜厚</p>
        <p type="p">RL:假研磨率線</p>
        <p type="p">RRL:研磨率線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="762" publication-number="202616838">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616838</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115026</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括有周邊區中具有緩衝層的電容器或離子電容器的儲能組件</chinese-title>
        <english-title>AN ENERGY STORAGE COMPONENT COMPRISING A CAPACITOR OR AN IONIC CAPACITOR, WITH A BUFFER LAYER IN A PERIPHERAL REGION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260108B">H10D1/68</main-classification>
        <further-classification edition="202501120260108B">H10D1/00</further-classification>
        <further-classification edition="202501120260108B">H10D84/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商村田製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURATA MANUFACTURING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴佛　賴瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUFFLE, LARRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙拉茲　瓦倫丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SALLAZ, VALENTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維諾恩　福瑞迪瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VOIRON, FREDERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩爾瓦多　維奧萊納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SALVADOR, VIOLAINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏卡西　薩米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OUKASSI, SAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種整合電裝置，其包括儲能組件，組件包括：底部電極層（105），其位於支撐件（100、101、103）上方；中間層（107），其包括在底部電極層上方之介電層或離子導體層；及頂部電極層（108），其位於中間層上方及上，&lt;br/&gt;其中中間層在中央區（CR）中與底部電極層及與頂部電極層接觸，且中間層藉由圍繞中央區之周邊區（PR）中之緩衝層（106）而與底部電極層或頂部電極層間隔開，緩衝層包括絕緣材料且配置於底部電極層上或中間層上，緩衝層具有開口，開口通向底部電極層或中間層，以便界定中央區，&lt;br/&gt;中間層及頂部電極層保形地配置於底部電極層上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated electrical device comprising an energy storage component, the component comprising, above a support (100, 101, 103), a bottom electrode layer (105), an intermediate layer (107) comprising a dielectric layer or an ionic conductor layer above the bottom electrode layer, and a top electrode layer (108) above and on the intermediate layer,&lt;br/&gt;wherein the intermediate layer is in contact with the bottom electrode layer and with the top electrode layer in a central region (CR), and the intermediate layer is are spaced apart from either the bottom electrode layer or the top electrode layer by a buffer layer (106) in a peripheral region (PR) that surrounds the central region, the buffer layer comprising an insulating material and being arranged on the bottom electrode layer or on the intermediate layer, the buffer layer having an opening that opens onto the bottom electrode layer or onto the intermediate layer so as to define the central region,&lt;br/&gt;the intermediate layer and the top electrode layer being arranged conformally above the bottom electrode layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板</p>
        <p type="p">101:陽極化障壁層</p>
        <p type="p">102:金屬層</p>
        <p type="p">103:陽極多孔氧化物區</p>
        <p type="p">105:底部電極層</p>
        <p type="p">106:緩衝層</p>
        <p type="p">107:中間層</p>
        <p type="p">108:頂部電極層</p>
        <p type="p">109:導體區</p>
        <p type="p">L1:寬度</p>
        <p type="p">L2:寬度</p>
        <p type="p">L3:寬度</p>
        <p type="p">OP:開口</p>
        <p type="p">SW:側壁</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="763" publication-number="202616376">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616376</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115087</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法、基板處理裝置及電腦記錄媒體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H01L21/306</main-classification>
        <further-classification edition="200601120260109B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂口慶介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAGUCHI, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢野英嗣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANO, HIDETSUGU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明可適當控制在蝕刻基板的表面後之該基板的表面形狀。  &lt;br/&gt;本發明係用以處理基板之基板處理方法，該基板處理方法包含：導出最適當蝕刻量分布之步驟；以及根據該最適當蝕刻量分布，蝕刻該基板的表面之步驟；在蝕刻該基板的表面之際，一邊使該基板旋轉，並在蝕刻液係以覆蓋該基板的中心部之方式供給的內周位置，與該蝕刻液係以覆蓋該基板的外周部之方式供給的外周位置之間，使蝕刻液供給部往返移動，一邊進行向該基板的表面從該蝕刻液供給部供給該蝕刻液之半蝕刻；在導出該最適當蝕刻量分布之際，根據包含以複數個不同的蝕刻條件進行該半蝕刻之際的蝕刻量分布的複數個學習數據，導出該最適當蝕刻量分布。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">R&lt;sub&gt;1&lt;/sub&gt;,R&lt;sub&gt;-1&lt;/sub&gt;,R&lt;sub&gt;2&lt;/sub&gt;,R&lt;sub&gt;-2&lt;/sub&gt;,R&lt;sub&gt;3&lt;/sub&gt;,R&lt;sub&gt;-3&lt;/sub&gt;:區域</p>
        <p type="p">X&lt;sub&gt;0&lt;/sub&gt;,X&lt;sub&gt;1&lt;/sub&gt;,X&lt;sub&gt;2&lt;/sub&gt;,X&lt;sub&gt;3&lt;/sub&gt;,X&lt;sub&gt;-1&lt;/sub&gt;,X&lt;sub&gt;-2&lt;/sub&gt;,X&lt;sub&gt;-3&lt;/sub&gt;:位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="764" publication-number="202615916">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615916</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115092</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於光學互連模組中之個別界定的光學元件</chinese-title>
        <english-title>INDIVIDUALLY DEFINED OPTICAL ELEMENTS FOR USE IN AN OPTICAL INTERCONNECT MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">G02B6/42</main-classification>
        <further-classification edition="200601120260108B">G02B6/122</further-classification>
        <further-classification edition="200601120260108B">G02B6/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商深特公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMTEC, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾比陶斯　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EPITAUX, MARC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科羅納提　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORONATI, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奈丁吉爾　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIGHTINGALE, JOHN L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫茲尼亞　查理斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUZNIA, CHARLES B.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀蘭　特洛伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOLLAND,TROY B.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一個別對準的光學元件併入一光學互連模組中以實現一電光部件與一光學波導之間的有效光學通訊。該個別對準的光學元件潛在地使用雷射處理或增材製造來界定於該電光部件安裝至的一透明載體內或其一表面上，或界定於經配置以附接至該透明載體的一光學區塊內及/或其一表面上。該個別對準的光學元件相對於該電光部件之一主動區域或一光學波導之一芯界定。可存在複數個主動區域及光學波導，且各主動區域及光學波導具有個別對準之一對應光學元件，從而實現高耦接效率且潛在地提供用於增強裝配公差之如經準直光束的特徵。該光學元件可為一繞射光學元件、一折射光學元件、一反射光學元件或其一組合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An individually aligned optical element is incorporated in an optical interconnect module to enable efficient optical communication between an electrooptic component and an optical waveguide. The individually aligned optical element is defined, potentially using laser processing or additive manufacturing, within or on a surface of a transparent carrier to which the electrooptic component is mounted or within and/or on a surface of an optical block, which is arranged to attach to the transparent carrier. The individually aligned optical element is defined relative to either an active area of the electrooptic component or a core of an optical waveguide. There may be a plurality of active areas and optical waveguides, and each active area and optical waveguide has a corresponding optical element which is individually aligned, enabling high coupling efficiency and potentially providing features like collimated beams for enhanced assembly tolerance. The optical element may be a diffractive optical element, a refractive optical element, a reflective optical element or a combination thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">104:光束</p>
        <p type="p">108:載體次組件</p>
        <p type="p">112:光學波導</p>
        <p type="p">116:透明載體，基板</p>
        <p type="p">118:光學區塊</p>
        <p type="p">121:第一主表面，底部主表面</p>
        <p type="p">125:電光部件</p>
        <p type="p">163:表面光學元件</p>
        <p type="p">164:對準特徵</p>
        <p type="p">188:表面光學元件</p>
        <p type="p">198:光學區塊次組件</p>
        <p type="p">199:對準特徵</p>
        <p type="p">230:光學區塊導引件</p>
        <p type="p">232:頂部對準特徵</p>
        <p type="p">234:底部對準特徵</p>
        <p type="p">236:封裝劑</p>
        <p type="p">240:光學耦接組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="765" publication-number="202615228">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615228</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115105</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>維護裝置、基板處理系統及維護方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">B25J11/00</main-classification>
        <further-classification edition="200601120260109B">B65G1/04</further-classification>
        <further-classification edition="200601120260109B">H01L21/02</further-classification>
        <further-classification edition="200601120260109B">H01L21/677</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠山時生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYAMA, TOKIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池田岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEDA, GAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>若森勤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAKAMORI, TSUTOMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣木勤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROKI, TSUTOMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北澤貴宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAZAWA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>出口紗彩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEGUCHI, SAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>代田敦士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIROTA, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">依照本發明的一態樣的維護裝置具有：殼體，可藉由用以搬運收納基板的載具之搬運機構來加以搬運；及維護機器人，安裝在該殼體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:維護裝置</p>
        <p type="p">210:殼體</p>
        <p type="p">211:底板</p>
        <p type="p">212:頂板</p>
        <p type="p">213:第1側板</p>
        <p type="p">214:第2側板</p>
        <p type="p">215:凸緣</p>
        <p type="p">216:把手</p>
        <p type="p">220:維護機器人</p>
        <p type="p">221:固定部</p>
        <p type="p">222:旋轉部</p>
        <p type="p">223:臂部</p>
        <p type="p">224:手部</p>
        <p type="p">230:容器</p>
        <p type="p">240:照相機</p>
        <p type="p">250:無線通信設備</p>
        <p type="p">260:交換式集線器</p>
        <p type="p">270:電池</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="766" publication-number="202615854">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615854</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115115</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雜質之檢測方法、檢查板及檢測裝置</chinese-title>
        <english-title>IMPURITY DETECTION METHOD, INSPECTION PLATE, AND DETECTION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">G01N27/02</main-classification>
        <further-classification edition="200601120260108B">G01N27/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商奧璐佳瑙股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORGANO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>獨立行政法人國立高等專門學校機構</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL INSTITUTE OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森野翔太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORINO, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔦野恭平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUTANO, KYOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅原広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGAWARA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今泉文伸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAIZUMI, FUMINOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">於檢測液體中所含的雜質之檢測方法中，使用具有基板(11)及形成於基板(11)的表面的複數檢測區域(20)之檢查板(10)，該檢測區域(20)各自係由形成於基板(11)的表面之第1電極(21)、及與第1電極(21)分隔而形成於基板(11)的表面之第2電極(22)所構成。於每個檢測區域(20)，對第1電極(21)與第2電極(22)之間施加交流電壓以進行阻抗測定，藉此特定出雜質(30)存在的檢測區域(20)以檢測雜質(30)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A detection method for detecting impurities contained in a liquid uses an inspection plate (10) having a substrate (11) and a plurality of detection regions (20) formed on the surface of the substrate (11), wherein each of the detection regions (20) comprises a first electrode (21) formed on the surface of the substrate (11) and a second electrode (22) formed on the surface of the substrate (11) positioned apart from the first electrode (21). Impurities (30) are detected by applying an AC voltage between the first electrode (21) and the second electrode (22) for each detection region (20) and measuring the impedance, thereby identifying detection regions (20) in which impurities (30) are present.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:檢查板</p>
        <p type="p">11:基板</p>
        <p type="p">12:半導體層</p>
        <p type="p">13,14:絕緣層</p>
        <p type="p">20:檢測區域</p>
        <p type="p">21,22:電極</p>
        <p type="p">23,24:配線</p>
        <p type="p">25,26:通孔</p>
        <p type="p">30:雜質</p>
        <p type="p">41:震盪電路</p>
        <p type="p">42:測定部</p>
        <p type="p">43:控制裝置</p>
        <p type="p">ε:介電常數</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="767" publication-number="202615163">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615163</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115167</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於半導體設備的清潔裝置及使用其清潔電鍍密封件的方法</chinese-title>
        <english-title>CLEANING APPARATUS FOR SEMICONDUCTOR EQUIPMENT AND METHOD OF CLEANING AN ELECTROPLATING SEAL USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260107B">B08B1/14</main-classification>
        <further-classification edition="202401120260107B">B08B1/20</further-classification>
        <further-classification edition="202401120260107B">B08B1/30</further-classification>
        <further-classification edition="200601120260107B">B08B3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱圖寧　亞倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNTUNEN, AARON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威爾遜　格雷戈里Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILSON, GREGORY J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於半導體設備的清潔裝置，包括清潔頭，清潔頭具有附接件，其配置用於去除電鍍密封件上的污染物，附接件包括基座、位於基座第一側的一第一突出部及位於基座第二側的第二突出部，第二側與第一側相對，且第二突出部包括平坦部分與傾斜部分，其中第二突出部配置用於推抵電鍍密封件的頂端，且電鍍密封件的頂端配置用於沿第二突出部作旋轉滑動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cleaning apparatus for semiconductor equipment, the apparatus including a cleaning head having an attachment configured for removing contamination off an electroplating seal, the attachment including a base, a first protrusion located on a first side of the base, and a second protrusion located on a second side of the base opposite the first side, where the second protrusion comprises a flat portion and a sloped portion, wherein the second protrusion is configured to push an apex of the electroplating seal, and where the apex of the electroplating seal is configured for rotationally sliding along the second protrusion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:清潔頭</p>
        <p type="p">1000:清潔裝置</p>
        <p type="p">1005:臂</p>
        <p type="p">BO:彎曲偏移量</p>
        <p type="p">DF:向下力</p>
        <p type="p">ES:密封件</p>
        <p type="p">UF:向上力</p>
        <p type="p">3B:區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="768" publication-number="202616454">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616454</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115188</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有改良之靜止效能的用於３Ｄ斷層掃描之檢查設備</chinese-title>
        <english-title>INSPECTION APPARATUS FOR 3D TOMOGRAPHY WITH IMPROVED STAND-STILL PERFORMANCE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">H01L21/68</main-classification>
        <further-classification edition="201801120260107B">G01N23/22</further-classification>
        <further-classification edition="201801120260107B">G01N23/225</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS SMT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡伯　弗洛里安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUBER, FLORIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹森　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANTZEN, STEPHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種用於晶圓內生成半導體物件三維體積影像的雙束裝置及一種操作該雙束裝置的方法。該雙束裝置包含一閉迴路監控系統，該系統位於帶電粒子束成像系統的焦點與安裝在晶圓平台的晶圓上的檢查點之間。藉使減輕在帶電粒子束成像系統與晶圓平台之間的漂移。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A dual beam device for three-dimensional volume image generation of semiconductor objects within a wafer and a method of operating the dual beam device are provided. The dual beam device comprises a closed loop monitoring system between a focus point of a charge-particle beam imaging system and an inspection site on a wafer mounted on a wafer stage. Thereby, drifts between a charge-particle beam imaging system and the wafer stage are mitigated.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:雙束裝置</p>
        <p type="p">6:檢查點</p>
        <p type="p">8:晶圓</p>
        <p type="p">15:晶圓支撐表面</p>
        <p type="p">17.2:背散射電子偵測器/透鏡內偵測器</p>
        <p type="p">19:控制單元</p>
        <p type="p">21:測量系統/雷射干涉儀</p>
        <p type="p">25:框架</p>
        <p type="p">27:雷射束</p>
        <p type="p">31:電子源</p>
        <p type="p">40:帶電粒子束成像系統/掃描電子束系統/成像帶電粒子束系統/掃描電子束裝置/掃描電子束柱</p>
        <p type="p">42:光軸/視線/CPB成像系統軸</p>
        <p type="p">44:一次電子束/掃描電子束/成像帶電粒子束/帶電粒子束/帶電粒子成像束/SEM束</p>
        <p type="p">50:FIB/FIB管柱/聚焦離子束管柱</p>
        <p type="p">151:樣品吸盤</p>
        <p type="p">155.t:旋轉平台</p>
        <p type="p">155.xy:XY平台/X-Y平台</p>
        <p type="p">155.z:Z平台</p>
        <p type="p">701:距離感測器/第一距離感測器</p>
        <p type="p">701.5:附加距離感測器/附加普通距離感測器</p>
        <p type="p">701.7:附加距離感測器/附加普通距離感測器</p>
        <p type="p">703.1:雷射束</p>
        <p type="p">706:參考標誌</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="769" publication-number="202616280">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616280</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115245</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體元件及其形成方法</chinese-title>
        <english-title>MEMORY DEVICE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250909B">G11C8/08</main-classification>
        <further-classification edition="200601120250909B">G11C7/10</further-classification>
        <further-classification edition="200601120250909B">G11C7/22</further-classification>
        <further-classification edition="200601120250909B">G11C7/06</further-classification>
        <further-classification edition="200601120250909B">H01L21/768</further-classification>
        <further-classification edition="202501120250909B">H10D30/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　建隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, KIAN-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一元件包含跨栓鎖、第一電晶體、第二電晶體、第三電晶體、第四電晶體與第一讀取位元線。第一電晶體包含沿第一方向延伸且位於第一水平位置上的第一閘極。第二電晶體包含位於第一水平位置下方的第二水平位置上的第二閘極。第三電晶體耦合到第一儲存節點，且包含在第一水平位置上的第三閘極。第四電晶體耦合到第一儲存節點，且包含在第二水平位置上的第四閘極。第一讀取位元線沿著第二方向延伸，且位於基板的前側上方的第一金屬層上，並耦合到第三電晶體與第四電晶體。第三電晶體與第四電晶體對應於該元件的第一埠。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device includes a cross-latch, a first, second, third and fourth transistor and a first read bit line. The first transistor includes a first gate extending in a first direction, and is on a first level. The second transistor includes a second gate on a second level below the first level. The third transistor is coupled to the first storage node, and includes a third gate on the first level. The fourth transistor is coupled to a first storage node, and includes a fourth gate on the second level. The first read bit line extends in a second direction, is on a first metal layer above a front-side of a substrate, and is coupled to the third and fourth transistor. The third and fourth transistor correspond to a first port of the device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">394:絕緣區域圖案</p>
        <p type="p">394a:絕緣區域圖案</p>
        <p type="p">401:單元</p>
        <p type="p">401a:單元邊界</p>
        <p type="p">401b:單元邊界</p>
        <p type="p">401c:單元邊界</p>
        <p type="p">401d:單元邊界</p>
        <p type="p">402a:主動區域</p>
        <p type="p">402b:主動區域</p>
        <p type="p">402c:主動區域</p>
        <p type="p">406:閘極</p>
        <p type="p">406a:閘極</p>
        <p type="p">406a1:閘極</p>
        <p type="p">406a2:閘極</p>
        <p type="p">406a3:閘極</p>
        <p type="p">406b:閘極</p>
        <p type="p">406b1:閘極</p>
        <p type="p">406b2:閘極</p>
        <p type="p">410:接觸件(接觸圖案)</p>
        <p type="p">410a:接觸件</p>
        <p type="p">410b:接觸件</p>
        <p type="p">410c:接觸件</p>
        <p type="p">410d:接觸件</p>
        <p type="p">410e:接觸件</p>
        <p type="p">410f:接觸件</p>
        <p type="p">414:接觸件</p>
        <p type="p">414a:接觸件</p>
        <p type="p">414b:接觸件</p>
        <p type="p">414c:接觸件</p>
        <p type="p">420:導通孔</p>
        <p type="p">420a:導通孔</p>
        <p type="p">420b:導通孔</p>
        <p type="p">420c:導通孔</p>
        <p type="p">420d:導通孔</p>
        <p type="p">420e:導通孔</p>
        <p type="p">420f:導通孔</p>
        <p type="p">424:導通孔</p>
        <p type="p">424a:導通孔</p>
        <p type="p">500:積體電路</p>
        <p type="p">500A:部分</p>
        <p type="p">Active:主動層</p>
        <p type="p">CPO:切割POLY層</p>
        <p type="p">MD:擴散金屬層</p>
        <p type="p">MDLI:擴散金屬局部互連層</p>
        <p type="p">ND:節點</p>
        <p type="p">NDB:節點</p>
        <p type="p">PD1:NFET電晶體</p>
        <p type="p">PD2:NFET電晶體</p>
        <p type="p">PO:閘極層</p>
        <p type="p">RPD1:NFET電晶體</p>
        <p type="p">RPG1:NFET電晶體</p>
        <p type="p">VD:擴散上導通孔層</p>
        <p type="p">VG:閘極上導通孔層</p>
        <p type="p">WPG1:NFET電晶體</p>
        <p type="p">WPG2:NFET電晶體</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
        <p type="p">Z:第二方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="770" publication-number="202616375">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616375</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115258</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H01L21/304</main-classification>
        <further-classification edition="201201120260109B">B24B49/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鎗光正和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YARIMITSU, MASAKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福永信貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUNAGA, NOBUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">基板處理裝置，藉由將構成加工工具之磨石的底面按壓於基板的頂面，將該基板薄化。&lt;br/&gt;  基板處理裝置，具備基板固持部、第1量測部、旋轉部、升降部、第2量測部、及控制電路。&lt;br/&gt;  該控制電路，進行以下控制：&lt;br/&gt;  監視：在該基板的薄化過程中，該旋轉部的高度，與具有與緊接於薄化該基板之前相同的厚度之該磨石推定將接觸到該基板固持部的吸附面時，該旋轉部的高度，兩高度的差異量，並將其作為：若該磨石的磨耗為零，則會得到之該基板的設想厚度；&lt;br/&gt;  在該基板的薄化過程中，監視該第1量測部的量測值是否落在將該設想厚度作為基準包含之第1容許範圍內；及&lt;br/&gt;  若該第1量測部的量測值脫離該第1容許範圍，即判斷發生異常。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板處理裝置</p>
        <p type="p">10:基板固持部</p>
        <p type="p">11:吸附面</p>
        <p type="p">12:多孔體</p>
        <p type="p">13:固持台</p>
        <p type="p">15:第2旋轉部</p>
        <p type="p">16:旋轉馬達</p>
        <p type="p">17:旋轉軸</p>
        <p type="p">20:驅動部</p>
        <p type="p">30:旋轉部</p>
        <p type="p">31:旋轉馬達</p>
        <p type="p">32:轉軸</p>
        <p type="p">33:凸緣</p>
        <p type="p">40:升降部</p>
        <p type="p">41:Z軸導件</p>
        <p type="p">42:Z軸滑件</p>
        <p type="p">43:升降馬達</p>
        <p type="p">44:馬達支架</p>
        <p type="p">51:第1量測部</p>
        <p type="p">51a:第1位移計</p>
        <p type="p">51b:第2位移計</p>
        <p type="p">52:第2量測部</p>
        <p type="p">53:第3量測部</p>
        <p type="p">54:第4量測部</p>
        <p type="p">90:控制電路</p>
        <p type="p">91:運算部</p>
        <p type="p">92:記憶部</p>
        <p type="p">T:加工工具</p>
        <p type="p">T1:轉輪</p>
        <p type="p">T2:磨石</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="771" publication-number="202615983">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615983</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115276</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微影蝕刻裝置的品質監測</chinese-title>
        <english-title>QUALITY MONITORING IN MICROLITHOGRAPHY DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">G03F7/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞典商麥可尼克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MYCRONIC AB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦爾特　喬納斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALTHER, JONAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於微影蝕刻裝置的品質監測之方法包括藉由將一目標曝露於電磁輻射來與該目標上之一二維圖案相互作用(S10)。使用界定一光學路徑之光學組件來執行該曝光。在該相互作用期間，在該光學路徑附近記錄(S11)聲學信號。當記錄各自聲學信號時，使該等經記錄聲學信號與該二維圖案之執行與該圖案之該相互作用之位置相關聯(S20)。基於該等相關聯之聲學信號及圖案位置來監測(S30)與該二維圖案之該相互作用之一品質。亦揭示一種可藉由該方法監測之微影蝕刻裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for quality monitoring in microlithography devices comprises interacting (S10) with a two-dimensional pattern on a target by exposing the target for electromagnetic radiation. The exposing is performed using optical components defining an optical path. Acoustic signals are recorded (S11) in vicinity of the optical path during the interaction. The recorded acoustic signals are associated (S20) to positions of the two-dimensional pattern where the interaction with the pattern was performed when respective acoustic signals were recorded. A quality of the interaction with the two-dimensional pattern is monitored (S30) based on the associated acoustic signals and pattern positions. A microlithography device monitorable by the method is also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10:相互作用/步驟</p>
        <p type="p">S11:記錄/步驟</p>
        <p type="p">S20:相關聯/步驟</p>
        <p type="p">S30:監測/步驟</p>
        <p type="p">S31:運算/步驟</p>
        <p type="p">S32:步驟</p>
        <p type="p">S33:指派/步驟</p>
        <p type="p">S34:定義/步驟</p>
        <p type="p">S35:提醒/步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="772" publication-number="202616770">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616770</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115317</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微波加熱裝置及微波加熱系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">H05B6/80</main-classification>
        <further-classification edition="200601120260108B">H05B6/74</further-classification>
        <further-classification edition="200601120260108B">H05B6/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松尾直之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUO, NAOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平田聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRATA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮下直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYASHITA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西岡将輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIOKA, MASATERU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之圓筒空腔共振器(320)包含壁(330)及輸入耦合部(340)。壁(330)包含內周面(335)。輸入耦合部(340)耦合於壁(330)及波導管(310)。輸入耦合部(340)包含導入開口(343)及鄰接部(345)或(346)。導入開口(343)自波導管(310)內朝圓筒空腔共振器(320)內導入微波。鄰接部(345)或(346)與導入開口(343)鄰接。鄰接部(345)或(346)具有與內周面(335)連續、與導入開口(343)鄰接之鄰接曲面(341)或(342)，及/或在與導入開口(343)鄰接之端(345a)或(346a)中具有10 mm以下之厚度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">315:內表面</p>
        <p type="p">335:內周面</p>
        <p type="p">340:輸入耦合部</p>
        <p type="p">341:第1鄰接曲面/鄰接曲面</p>
        <p type="p">342:第2鄰接曲面/鄰接曲面</p>
        <p type="p">343:導入開口</p>
        <p type="p">345:第1鄰接部/鄰接部</p>
        <p type="p">345a:第1近端/端</p>
        <p type="p">345b:第1遠端</p>
        <p type="p">346:第2鄰接部/鄰接部</p>
        <p type="p">346a:第2近端/端</p>
        <p type="p">346b:第2遠端</p>
        <p type="p">370:空腔</p>
        <p type="p">D1:第1方向</p>
        <p type="p">D2:第2方向</p>
        <p type="p">D3:第3方向</p>
        <p type="p">ta1:厚度</p>
        <p type="p">ta2:厚度</p>
        <p type="p">y:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="773" publication-number="202616771">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616771</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115318</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微波加熱系統及微波加熱方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">H05B6/80</main-classification>
        <further-classification edition="200601120260108B">H05B6/74</further-classification>
        <further-classification edition="200601120260108B">H05B6/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松尾直之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUO, NAOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平田聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRATA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮下直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYASHITA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之微波加熱系統(1A)包含2個以上之圓筒空腔共振器(320)、及搬送裝置(70)。搬送裝置(70)朝2個以上之圓筒空腔共振器(320)內依次搬送被加熱對象物(20)。2個以上之圓筒空腔共振器(320)各者具有朝圓筒空腔共振器(320)內導入微波之導入開口。於2個以上之圓筒空腔共振器(320)內藉由微波來加熱被加熱對象物(20)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:第2被加熱對象物</p>
        <p type="p">320A:第1圓筒空腔共振器</p>
        <p type="p">320B:第2圓筒空腔共振器</p>
        <p type="p">343A:第1導入開口</p>
        <p type="p">343B:第2導入開口</p>
        <p type="p">600:微波加熱裝置群</p>
        <p type="p">610:排列方向</p>
        <p type="p">620:特定方向</p>
        <p type="p">630:入射方向</p>
        <p type="p">D1:第1方向</p>
        <p type="p">D2:第2方向</p>
        <p type="p">D3:第3方向</p>
        <p type="p">Da:軸向</p>
        <p type="p">S:被加熱對象物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="774" publication-number="202616377">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616377</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115343</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H01L21/306</main-classification>
        <further-classification edition="200601120260109B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>根岸康介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEGISHI, KOUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>百武宏展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HYAKUTAKE, HIRONOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]以更短時間準備SPM液。  &lt;br/&gt;　　[解決手段]本揭示之一態樣所涉及的基板處理裝置具備：處理槽，其係使複數基板浸漬於處理液而進行液處理；液供給部，其係對處理槽供給液體；及控制部，其係控制各部。控制部係進行儲存處理、生成處理、混合處理。儲存處理係在處理槽儲存濃硫酸。生成處理係在與處理槽不同之處混合過氧化氫水和純水而生成稀釋過氧化氫水。混合處理係對處理槽供給稀釋過氧化氫水而混合濃硫酸和稀釋過氧化氫水。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="775" publication-number="202615677">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615677</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115366</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬遮罩及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">C23C14/04</main-classification>
        <further-classification edition="200601120260108B">C23C14/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日本印刷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安在祐二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANZAI, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上功</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, ISAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種金屬遮罩，其具有一個或複數個有孔區域、及周圍區域，一個或複數個上述有孔區域之整體之外形具有寬度方向之2個短邊、及長度方向之2個長邊，當在將2個上述短邊在寬度方向上進行N分割時，將任意位置n(其中，1≤n≤N＋1)處之上述有孔區域之長度方向之上述外形之長度設為X&lt;sub&gt;n&lt;/sub&gt;，在將2個上述長邊在長度方向上進行M分割時，將任意位置m(其中，1≤m≤M＋1)處之上述有孔區域之寬度方向之上述外形之長度設為Y&lt;sub&gt;m&lt;/sub&gt;時，X&lt;sub&gt;n&lt;/sub&gt;及Y&lt;sub&gt;m&lt;/sub&gt;滿足下述式(1)及(2)，  &lt;br/&gt;X&lt;sub&gt;n&lt;/sub&gt;≤X&lt;sub&gt;n&lt;/sub&gt;&lt;sub&gt;＋&lt;/sub&gt;&lt;sub&gt;1&lt;/sub&gt;…(1)  &lt;br/&gt;Y&lt;sub&gt;max&lt;/sub&gt;－Y&lt;sub&gt;min&lt;/sub&gt;≤12.5 μm…(2)  &lt;br/&gt;Y&lt;sub&gt;max&lt;/sub&gt;：Y&lt;sub&gt;m&lt;/sub&gt;(1≤m≤M＋1)之最大值  &lt;br/&gt;Y&lt;sub&gt;min&lt;/sub&gt;：Y&lt;sub&gt;m&lt;/sub&gt;(1≤m≤M＋1)之最小值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:位置</p>
        <p type="p">2:位置</p>
        <p type="p">20:金屬遮罩</p>
        <p type="p">22:有孔區域</p>
        <p type="p">22T:外形</p>
        <p type="p">22Ta,22Tb:短邊</p>
        <p type="p">22Tc,22Td:長邊</p>
        <p type="p">23:周圍區域</p>
        <p type="p">M:位置(分割數)</p>
        <p type="p">m:位置</p>
        <p type="p">M+1:位置</p>
        <p type="p">N:位置(分割數)</p>
        <p type="p">n:位置</p>
        <p type="p">N+1:位置</p>
        <p type="p">X&lt;sub&gt;n&lt;/sub&gt;:長度</p>
        <p type="p">Y&lt;sub&gt;m&lt;/sub&gt;:長度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="776" publication-number="202615984">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615984</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115437</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於將寬帶輻射耦合至光纖中之光學元件的設計方法</chinese-title>
        <english-title>METHOD OF DESIGNING AN OPTICAL COMPONENT FOR COUPLING BROADBAND RADIATION INTO AN OPTICAL FIBER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">G03F7/20</main-classification>
        <further-classification edition="200601120260105B">G02B21/06</further-classification>
        <further-classification edition="200601120260105B">G02B6/26</further-classification>
        <further-classification edition="200601120260105B">G02B6/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維利加斯　洛佩茲　大衛　亞歷杭德羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VILLEGAS LOPEZ, DAVID ALEJANDRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於將一寬帶輻射耦合至一第一光纖中之一光學元件的設計方法，其包含：獲得在該寬帶輻射之一波長範圍內該寬帶輻射之一經準直光束半徑與一波長之間的一半徑-波長關係；基於該半徑-波長關係而判定該光學元件之一橫向平面中的複數個透光區帶，其中該橫向平面垂直於該光學元件之一光軸，且其中該複數個透光區帶中之各者經組態以透射與該寬帶輻射之該波長範圍重疊抑或落入該波長範圍內的一不同各別波長範圍；及藉由使與該光學元件相關聯之一或多個參數變化而針對該等不同波長範圍中之各者最佳化將該寬帶輻射耦合至該光纖中之一效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of designing an optical component for coupling a broadband radiation into a first optical fiber, comprising obtaining a radius-wavelength relationship between a collimated beam radius and a wavelength of the broadband radiation in a wavelength range of the broadband radiation; determining a plurality of light-transmitting zones in a transversal plane of the optical component based on the radius-wavelength relationship, wherein the transversal plane is perpendicular to an optical axis of the optical component, and wherein each of the plurality of light-transmitting zones is configured to transmit a different respective wavelength range either overlapping with or falling within the wavelength range of the broadband radiation; and optimizing an efficiency of coupling of the broadband radiation into the optical fiber for each of the different wavelength ranges by varying one or more parameters associated with the optical component.</p>
      </isu-abst>
      <representative-img>
        <p type="p">R:徑向方向</p>
        <p type="p">RIN:折射率</p>
        <p type="p">RP1:第一徑向折射率分佈</p>
        <p type="p">RP2:第二徑向折射率分佈</p>
        <p type="p">RP3:第三徑向折射率分佈</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="777" publication-number="202616304">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616304</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115508</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>重置直接圖案化技術</chinese-title>
        <english-title>RESETTING DIRECT PATTERNING TECHNOLOGY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01F10/14</main-classification>
        <further-classification edition="200601120260102B">H01F10/18</further-classification>
        <further-classification edition="200601120260102B">H01F41/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商相互工程股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RECIPROCAL ENGINEERING - RE OY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法蘭堤　約翰斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRANTTI, JOHANNES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤岡　由香里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIOKA, YUKARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於藉由處理薄膜材料來製造裝置的方法，其使得能夠在半導體裝置製造中實現直接且可重置的圖案化。當絕緣體轉換成導體時可在還原氣體氛圍中進行圖案化，或當藉由還原獲得之導體轉換成絕緣體時可在氧化氣體氛圍中進行圖案化。局部加熱源及尤其鍵斷裂輻射，諸如雷射、極紫外線輻射、x射線或離子束或電子束，實現符合半導體工業標準的圖案化。詳言之，根據本發明的可重置薄膜材料之直接圖案化可在不使用任何光阻或特殊化學物質的情況下進行，因此實現顯著簡化之方法。藉由利用雷射光控制導體與絕緣體之間的轉換，可確保大規模生產的相容性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a method of manufacturing devices by processing a thin film material, which enables a direct and resettable patterning in semiconductor device manufacturing. Patterning is doable in a reductive gas atmosphere when an insulator is converted to conductor, or oxidizing gas atmosphere when the conductor obtained by reduction is converted to insulator. Local heating source, and in particular bond-breaking radiation such as laser, extreme ultraviolet radiation, x-rays, or ion or electron beam allows semiconductor industry compliant patterning. In particular, direct patterning of a resettable thin film material according to the present invention can be done without use of any photoresists or special chemicals, thus enabling a considerably simplified method. By controlling the conversion from conductor to insulator or vice versa by laser light, a mass-production compatibility can be ensured.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="778" publication-number="202615729">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615729</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115518</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用高度攪拌改善高速率銅柱製程的共面性來實現高酸、低銅化學物質之使用</chinese-title>
        <english-title>COPLANARITY IMPROVEMENT OF HIGH-RATE CU PILLAR PROCESSES USING HIGH AGITATION TO ENABLE USE OF HIGH ACID, LOW CU CHEMISTRIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C25D17/00</main-classification>
        <further-classification edition="200601120260102B">C25D17/02</further-classification>
        <further-classification edition="200601120260102B">C25D17/06</further-classification>
        <further-classification edition="200601120260102B">C25D21/14</further-classification>
        <further-classification edition="200601120260102B">C25D3/38</further-classification>
        <further-classification edition="200601120260102B">C25D5/02</further-classification>
        <further-classification edition="200601120260102B">C25D5/08</further-classification>
        <further-classification edition="200601120260102B">C25D5/34</further-classification>
        <further-classification edition="200601120260102B">C25D7/12</further-classification>
        <further-classification edition="200601120260102B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克修　保羅Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCHUGH, PAUL R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威爾遜　格雷戈里Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILSON, GREGORY J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克洛克　約翰Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLOCKE, JOHN L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電鍍系統，包括一銅浴，設置於一容器中，銅浴以一預設銅濃度閾值及一預設酸濃度閾值為特徵，及其中一基板沉浸於銅浴中；以及一噴流陣列，裝配以噴灑一流體到基板上，其中流體具有相同於銅浴的一成分。再者，一種方法，包括利用噴流陣列噴灑一流體至一基板上，其中流體具有相同於銅浴的一成分，及其中噴灑基板係增加沉積到基板上之銅的一沉積率，其中預設酸濃度閾值增加銅浴的一浴導電率，及其中增加之浴導電率改善沉積的數個銅結構的一共面性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electroplating system including a Cu bath disposed within a vessel, the Cu bath characterized by a predetermined threshold of Cu concentration, and a predetermined threshold of acid concentration, and where a substrate is submerged in the Cu bath; and a jet array configured to spray a fluid onto the substrate, where the fluid has a same composition as the Cu bath. Further, a method including spraying a fluid onto a substrate with the jet array, wherein the fluid has a same composition as the Cu bath and where spraying the substrate increases a deposition rate of a deposited Cu onto the substrate, where the predetermined threshold of acid concentration increases a bath conductivity of the Cu bath, and where the increased bath conductivity improves a coplanarity of deposited copper structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電鍍系統</p>
        <p type="p">105:容器</p>
        <p type="p">110:頭部</p>
        <p type="p">115:轉子</p>
        <p type="p">120:頭部升降件</p>
        <p type="p">125:噴流陣列</p>
        <p type="p">130:板</p>
        <p type="p">135:孔</p>
        <p type="p">140:流體泵</p>
        <p type="p">145:電源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="779" publication-number="202616884">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616884</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115523</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>背側功率輸送的隔離模組</chinese-title>
        <english-title>ISOLATION MODULE FOR BACKSIDE POWER DELIVERY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260108B">H10D84/03</main-classification>
        <further-classification edition="200601120260108B">H01L21/285</further-classification>
        <further-classification edition="202501120260108B">H10D62/10</further-classification>
        <further-classification edition="202501120260108B">H10D64/23</further-classification>
        <further-classification edition="202501120260108B">H10D64/27</further-classification>
        <further-classification edition="202501120260108B">H10D48/00</further-classification>
        <further-classification edition="202501120260108B">H10D30/43</further-classification>
        <further-classification edition="202501120260108B">H10D30/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴斯克　維拉拉格萬Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASKER, VEERARAGHAVAN S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科斯特里尼　葛雷戈里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COSTRINI, GREGORY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕爾　阿希什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAL, ASHISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哥倫布　班傑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COLOMBEAU, BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普蘭薩西哈蘭　巴拉薩拉瑪年</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRANATHARTHIHARAN, BALASUBRAMANIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博薩勒　普拉薩德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHOSALE, PRASAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">形成閘極全環繞場效應電晶體（GAA FET）的部分的方法包括在由淺溝槽隔離（STI）隔開的基板的部分內形成佔位元件，每個佔位元件與由內間隔物電氣隔離開替換金屬閘（RMG）堆疊的延伸區域接觸，這些凹槽延伸進入基板上形成的前層間介電質（ILD）中，相對於基板及STI選擇性移除佔位元件，於每個凹槽的延伸區域的暴露表面上形成凹洞，在該凹洞內形成接觸層，在接觸層上形成表面，並執行接觸金屬化製程在每個凹槽內形成金屬接觸，相對於RMG堆疊選擇性蝕刻基板並在相鄰金屬接觸之間形成ILD凹槽，形成環繞金屬接觸的介電性襯墊，並在每個ILD凹槽中形成背ILD。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of forming a portion of a gate-all-around field-effect transistor (GAA FET) includes forming placeholders, each interfacing with an extension region electrically isolated from replacement-metal-gate (RMG) stacks by inner spacers, in recesses formed within portions of a substrate isolated by shallow trench isolations (STIs), the recesses extending into a front inter-layer dielectric (ILD) formed on the substrate, removing the placeholders selectively to the substrate and the STIs, forming a cavity at an exposed surface of the extension region within each of the recesses, forming a contact layer within the cavity, forming an interface on the contact layer, and a contact metallization process to form a metal contact within each of the recesses, selectively etching the substrate against the RMG stacks and form ILD recesses between adjacent metal contacts, forming a dielectric liner surrounding the metal contacts, and forming a back ILD in each of the ILD recesses.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:半導體結構</p>
        <p type="p">202:通道層</p>
        <p type="p">204:替換金屬閘(RMG)堆疊</p>
        <p type="p">206:層間介電質(ILD)</p>
        <p type="p">208:閘極金屬</p>
        <p type="p">210:高介電常數材料</p>
        <p type="p">212:間隔物</p>
        <p type="p">214:延伸區域</p>
        <p type="p">216:S/D磊晶層</p>
        <p type="p">218:內間隔物</p>
        <p type="p">220:接觸蝕刻終止層(CESL)</p>
        <p type="p">222:淺溝槽隔離(STI)</p>
        <p type="p">224:金屬接觸</p>
        <p type="p">226:介電性襯墊</p>
        <p type="p">228:阻障層</p>
        <p type="p">230:ILD</p>
        <p type="p">232:接觸層</p>
        <p type="p">234:凹洞</p>
        <p type="p">236:表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="780" publication-number="202615510">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615510</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115548</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>共聚物、其製造方法、被膜形成用硬化性組成物、硬化被膜及物品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">C08F220/10</main-classification>
        <further-classification edition="200601120260114B">C08F290/12</further-classification>
        <further-classification edition="200601120260114B">C09D133/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森聖矢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, SEIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">藉由將下述共聚物添加於紫外線或電子束等之活性能量線硬化性組成物或熱硬化性組成物等之被膜形成用硬化性組成物中，可對所得之硬化被膜賦予優異的撥水性、防污性、耐磨耗性、流平性，該共聚物係以乙烯基系聚合物為主鏈之共聚物，其具有：具有於同一原子鍵結2個碳數10~40之一價烴基之分支結構的側鏈結構單位(A)，與含有(甲基)丙烯酸基的側鏈結構單位(B)作為鍵結於該主鏈之側鏈，且不含氟原子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="781" publication-number="202616562">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616562</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115552</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雷達吸收材料及製造該材料之方法</chinese-title>
        <english-title>RADAR ABSORBING MATERIALS AND METHOD OF MANUFACTURING SUCH MATERIALS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">H01Q17/00</main-classification>
        <further-classification edition="200601120260108B">C08K3/04</further-classification>
        <further-classification edition="200601120260108B">D06M11/74</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞典商葛來芬有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRAFREN AB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克拉諾斯基　艾利克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHRANOVSKYY, ERIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉貝克　麥克哈洛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHYBAK, MYKHAILO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>UA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有雷達吸收特性之材料，其包含包封一纖維量的基質材料。該纖維經石墨烯及/或氧化石墨烯塗佈。亦揭示一種層壓材料、一種片材、一種3D結構、一種載具、一種管狀結構、一種材料之用途，以及一種形成具有雷達吸收特性之產品之至少一部分的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A material having radar absorbing properties comprises a matrix material enclosing an amount of fiber. The fiber is coated by graphene and/or graphene oxide. Also disclosed is a laminated material, a sheet material, A 3D structure, a vehicle, a tubular structure, a use of a material, as well as a method of forming at least part of a product having radar absorbing properties.</p>
      </isu-abst>
      <representative-img>
        <p type="p">301:初始纖維表面</p>
        <p type="p">302:GC</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="782" publication-number="202616670">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616670</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115577</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H03M1/78</main-classification>
        <further-classification edition="200601120260109B">G09F9/00</further-classification>
        <further-classification edition="200601120260109B">G09F9/30</further-classification>
        <further-classification edition="200601120260109B">G09G3/20</further-classification>
        <further-classification edition="200601120260109B">G09G3/30</further-classification>
        <further-classification edition="201601120260109B">G09G3/3275</further-classification>
        <further-classification edition="201601120260109B">G09G3/3291</further-classification>
        <further-classification edition="200601120260109B">H03F3/45</further-classification>
        <further-classification edition="200601120260109B">H03M1/36</further-classification>
        <further-classification edition="200601120260109B">H05B33/14</further-classification>
        <further-classification edition="202501120260109B">H10D30/67</further-classification>
        <further-classification edition="202501120260109B">H10D84/83</further-classification>
        <further-classification edition="202501120260109B">H10D86/40</further-classification>
        <further-classification edition="202501120260109B">H10D86/60</further-classification>
        <further-classification edition="202301120260109B">H10K59/12</further-classification>
        <further-classification edition="202301120260109B">H10K59/123</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商半導體能源研究所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤港</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, MINATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村清貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, KIYOTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上妻宗広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOZUMA, MUNEHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林英智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, HIDETOMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種抑制輸出電壓的偏差的半導體裝置。本發明的一個實施方式是一種包括第一至第四放大器、第一至第六電阻器以及選擇器電路的半導體裝置。選擇器電路包括第一輸入端子及第二輸入端子。第一放大器的輸入端子藉由第一電阻器與第二放大器的輸入端子連接，第二放大器的輸入端子藉由第二電阻器與第三放大器的輸入端子連接，第三放大器的輸入端子藉由第三電阻器與第四放大器的輸入端子連接。第一放大器的輸出端子藉由第四電阻器與第二放大器的輸出端子連接，第二放大器的輸出端子藉由第五電阻器與第三放大器的輸出端子連接，第三放大器的輸出端子藉由第六電阻器與第四放大器的輸出端子連接。第二放大器的輸出端子與第一輸入端子連接，第三放大器的輸出端子與第二輸入端子連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">AP[j]:放大器</p>
        <p type="p">DAC:數位類比轉換電路</p>
        <p type="p">DHA:放大器</p>
        <p type="p">DHRaS:電阻器</p>
        <p type="p">DHRbS:電阻器</p>
        <p type="p">DLA:放大器</p>
        <p type="p">DLRaS:電阻器</p>
        <p type="p">DLRbS:電阻器</p>
        <p type="p">GA_0:放大器</p>
        <p type="p">GA_1:放大器</p>
        <p type="p">GA_510:放大器</p>
        <p type="p">GA_511:放大器</p>
        <p type="p">PTL[j]:選擇器電路</p>
        <p type="p">Ra_1:電阻器</p>
        <p type="p">Ra_511:電阻器</p>
        <p type="p">Rb_1:電阻器</p>
        <p type="p">Rb_511:電阻器</p>
        <p type="p">RSTR:電壓生成電路</p>
        <p type="p">RSTRa:電路</p>
        <p type="p">SELa_0:佈線</p>
        <p type="p">SELa_1:佈線</p>
        <p type="p">SELa_8:佈線</p>
        <p type="p">SEL[j]:佈線</p>
        <p type="p">VDE:佈線</p>
        <p type="p">VIT_0:端子</p>
        <p type="p">VIT_1:端子</p>
        <p type="p">VIT_510:端子</p>
        <p type="p">VIT_511:端子</p>
        <p type="p">VOT_0:端子</p>
        <p type="p">VOT_1:端子</p>
        <p type="p">VOT_510:端子</p>
        <p type="p">VOT_511:端子</p>
        <p type="p">VSE:佈線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="783" publication-number="202615957">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615957</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115666</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>寬帶輻射源組件及產生寬帶輻射之方法</chinese-title>
        <english-title>BROADBAND RADIATION SOURCE ASSEMBLY AND METHOD OF GENERATING BROADBAND RADIATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G02F1/35</main-classification>
        <further-classification edition="200601120260102B">G02F1/365</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿杜凡德　阿米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABDOLVAND, AMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿森德爾夫特　喬普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASSENDELFT, JOEP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔佛斯　約翰　柯林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRAVERS, JOHN COLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝里　費德瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELLI, FEDERICO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿爾梅加里　阿貝德拉曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALMEGHARI, ABDELRAHMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PS</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹金斯　貴格瑞　瓦倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JENKINS, GREGORY WARREN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金大植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, TAE SHIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡帕特　坦維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARPATE, TANVI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希尼　保羅　克利絲丁安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HINNEN, PAUL CHRISTIAAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種寬帶輻射源組件，其包含：一泵送雷射源，其經組態以輸出輻射脈衝之一爆發；及一光纖，其包含經組態以經由一非線性程序自該等輻射脈衝產生寬帶輻射之一光學介質。各爆發包含複數個輻射脈衝。本發明亦描述一種產生寬帶輻射之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A broadband radiation source assembly comprising: a pump laser source configured to output a burst of radiation pulses; and an optical fiber comprising an optical medium configured to generate broadband radiation from the radiation pulses via a nonlinear process. Each burst comprises a plurality of radiation pulses. A method of generating broadband radiation is also described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">94:爆發</p>
        <p type="p">100:寬帶輻射源組件</p>
        <p type="p">102:泵送雷射源</p>
        <p type="p">104:光學介質</p>
        <p type="p">106:寬帶輻射</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="784" publication-number="202615976">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615976</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115679</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性樹脂組成物、固化物及半導體元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">G03F7/004</main-classification>
        <further-classification edition="200601120260114B">G03F7/027</further-classification>
        <further-classification edition="200601120260114B">C08G73/10</further-classification>
        <further-classification edition="200601120260114B">C08F283/04</further-classification>
        <further-classification edition="200601120260114B">C08F2/44</further-classification>
        <further-classification edition="200601120260114B">C08L79/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤來</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, KITARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西戶圭祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIDO, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種固化物，其為感光性樹脂組成物的固化物，其中，感光性樹脂組成物含有順丁烯二醯亞胺樹脂、（甲基）丙烯酸單體及光聚合起始劑，順丁烯二醯亞胺樹脂為四羧酸二酐（a1）、胺（a2）及順丁烯二酸酐（a3）的反應物，胺（a2）包含二聚物二胺，（甲基）丙烯酸單體包含多官能（甲基）丙烯酸單體，固化物的Tg為80℃以上，並且-20～40℃下的線膨脹係數為120ppm/℃以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:矽晶圓</p>
        <p type="p">2:Cu濺射</p>
        <p type="p">3:絕緣膜</p>
        <p type="p">4:濺射膜</p>
        <p type="p">5:Cu鍍覆</p>
        <p type="p">100:結構體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="785" publication-number="202616292">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616292</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115794</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路及其操作方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT AND OPERATIONAL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251204B">G11C16/34</main-classification>
        <further-classification edition="200601120251204B">G11C16/08</further-classification>
        <further-classification edition="200601120251204B">G11C16/24</further-classification>
        <further-classification edition="200601120251204B">G11C11/54</further-classification>
        <further-classification edition="200601120251204B">G06F7/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪哲民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, JE-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森陽紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, HARUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤原英弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIWARA, HIDEHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種積體電路可包含實體地形成在一基板上的複數個記憶體內運算電路。該些記憶體內運算電路中的每一者可包含：一輸入電路，用以接收複數個第一資料部件；一記憶體陣列，耦接至該輸入電路且用以儲存該些第一資料部件；一資料多工器，用以經由一第一資料路徑或經由一第二資料路徑輸出該些第一資料部件；及複數個運算單元，耦接至該資料多工器且用以對該些第一資料部件及複數個第二資料部件執行多個乘法累加操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated circuit may comprise a plurality of compute-in-memory (CIM) circuits physically formed on a substrate. Each of the plurality of CIM circuits may comprise: an input circuit configured to receive a plurality of first data elements; a memory array coupled to the input circuit and configured to store the plurality of first data elements; a data multiplexer configured to output the plurality of first data elements through a first data path or through a second data path; and a plurality of computing cells coupled to the data multiplexer and configured to perform multiply-accumulate (MAC) operations on the plurality of first data elements and a plurality of second data elements.</p>
      </isu-abst>
      <representative-img>
        <p type="p">800:方法</p>
        <p type="p">805、810、815:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="786" publication-number="202616801">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616801</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115805</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>相機模組</chinese-title>
        <english-title>CAMERA MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H05K7/14</main-classification>
        <further-classification edition="200601120260109B">H05K1/14</further-classification>
        <further-classification edition="200601120260109B">H05K1/02</further-classification>
        <further-classification edition="202301120260109B">H04N23/55</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG INNOTEK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禹炅穆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOO, GYUNG MOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳泰官</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, TAE GUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禹昇沅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOO, SEUNG SON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種相機模組包含：一第一本體，其包括一上板及自該上板之一邊緣向下延伸之一第一側板；一透鏡模組，其耦合在該第一本體上；一第二本體，其包括在一光軸方向上面對該上板之一下板及自該下板之一邊緣向上延伸且面對該第一側板之一第二側板；以及一基板模組，其安置於藉由該第一本體與該第二本體之該耦合而形成之一空間中，其中該基板模組包括一第一基板及安置於該第一基板之一下部分處之一第二基板，其中該第一本體包括：一第一導引件，其自該上板之一下表面向下突出且與該第一基板之一上表面接觸；以及一第二導引件，其自該上板之一下表面向下突出且其至少一部分與該第二基板之一上表面接觸，且其中該第二本體包括：一第三導引件，其自該下面板之一上表面向上突出且與該第一基板之一上表面接觸；以及一第四導引件，其自該下板之一上表面向上突出以與該第二基板之一上表面接觸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A camera module comprises: a first body including an upper plate and a first side plate being extended downward from an edge of the upper plate; a lens module being coupled on the first body; a second body including a lower plate facing the upper plate in an optical axis direction and a second side plate being extended upward from an edge of the lower plate and facing the first side plate; and a substrate module being disposed in a space being formed by the coupling of the first body and the second body, wherein the substrate module includes a first substrate and a second substrate being disposed at a lower portion of the first substrate, wherein the first body includes: a first guide being protruded downward from a lower surface of the upper plate and in contact with an upper surface of the first substrate; and a second guide which is protruded downward from a lower surface of the upper plate and at least a portion thereof is in contact with an upper surface of the second substrate, and wherein the second body includes: a third guide being protruded upward from an upper surface of the lower plate and in contact with an upper surface of the first substrate; and a fourth guide being protruded upward from an upper surface of the lower plate to be in contact with an upper surface of the second substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:相機模組</p>
        <p type="p">100:第一本體</p>
        <p type="p">110:本體部分</p>
        <p type="p">120:鏡筒部分</p>
        <p type="p">200:第二本體</p>
        <p type="p">210:第二側板</p>
        <p type="p">290:連接器抽出部分</p>
        <p type="p">300:透鏡模組</p>
        <p type="p">320:凸緣</p>
        <p type="p">330:透鏡</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="787" publication-number="202616212">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616212</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115808</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶圓密封夾盤組件維護腔室及應用其之方法</chinese-title>
        <english-title>WAFER SEAL CHUCK ASSEMBLY MAINTENANCE CHAMBER AND METHOD USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260107B">G06T7/00</main-classification>
        <further-classification edition="200601120260107B">G01M3/38</further-classification>
        <further-classification edition="200601120260107B">G08B21/18</further-classification>
        <further-classification edition="202301120260107B">H04N23/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝爾萬　甘格達爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEELAVANT, GANGADHAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦蘇　卡爾希克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VASU, KARTHICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希雷古達　帕布古達塞卡古達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIREGOUDRA, PRABHUGOUDA SHEKHARAGOUDA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈理斯　蘭迪Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARRIS, RANDY A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱圖寧　亞倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNTUNEN, AARON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">數個範例性晶圓密封夾盤組件維護腔室可包括一腔室主體，定義一開放內部。此些腔室可包括數個夾盤組件支撐件，設置於開放內部中。此些夾盤組件支撐件可於開放內部中可旋轉。此些腔室可包括一工具臂，可定位於開放內部的上方。此些腔室可包括一影像裝置，固定於工具臂的一遠端上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Exemplary wafer seal chuck assembly maintenance chambers may include a chamber body defining an open interior. The chambers may include a plurality of chuck assembly supports disposed within the open interior. The plurality of chuck assembly supports may be rotatable within the open interior. The chambers may include a tool arm that is positionable above the open interior. The chambers may include an imaging device mounted on a distal end of the tool arm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:維護腔室</p>
        <p type="p">105:夾盤組件支撐件</p>
        <p type="p">110:沖洗容器</p>
        <p type="p">115:旋轉板</p>
        <p type="p">125:中心部</p>
        <p type="p">130:晶圓支撐件</p>
        <p type="p">135:工具臂</p>
        <p type="p">140:遠端</p>
        <p type="p">145:影像裝置</p>
        <p type="p">150:密封沖洗組件</p>
        <p type="p">155:沖洗簾</p>
        <p type="p">175:密封件</p>
        <p type="p">180:晶圓密封夾盤組件</p>
        <p type="p">190:計算裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="788" publication-number="202615699">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615699</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115845</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有雙排氣室之方法及設備</chinese-title>
        <english-title>METHODS AND APPARATUS WITH DUAL EXHAUST PLENUMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">C23C16/44</main-classification>
        <further-classification edition="200601120260114B">C23C16/455</further-classification>
        <further-classification edition="200601120260114B">C23C16/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金堤　安基特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMTEE, ANKIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威克勒　傑瑞德　李</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINKLER, JERELD LEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露技術之各種實施例可提供一種具有兩個分離的排氣室之設備。此設備可包括一頂部部分，此頂部部分具有至少一入口以及一第一排氣室及一第二排氣室。此設備可更包括一底部部分，此底部部分具有耦接至此第一排氣室之複數個第一排氣通孔及耦接至此第二排氣室之複數個第二排氣通孔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various embodiments of the present technology may provide an apparatus having two separate exhaust plenums. The apparatus may include a top portion having at least one inlet and a first exhaust plenum and a second exhaust plenum. The apparatus may further include a bottom portion having a plurality of first exhaust through-holes coupled to the first exhaust plenum and a plurality of second exhaust through-holes coupled to the second exhaust plenum.</p>
      </isu-abst>
      <representative-img>
        <p type="p">105:反應器</p>
        <p type="p">110:氣體分配系統</p>
        <p type="p">115:反應腔室</p>
        <p type="p">120:頂部部分</p>
        <p type="p">125:底部部分</p>
        <p type="p">135:容器</p>
        <p type="p">140:排氣系統</p>
        <p type="p">145:基座</p>
        <p type="p">150:基板</p>
        <p type="p">155:反應空間</p>
        <p type="p">200:進氣室</p>
        <p type="p">205:第一排氣室，氣室，排氣室</p>
        <p type="p">210:第二排氣室，氣室，排氣室</p>
        <p type="p">215:伸縮管</p>
        <p type="p">220:致動器</p>
        <p type="p">225:第二閥</p>
        <p type="p">230:進氣通孔</p>
        <p type="p">235:環形插塞，插塞</p>
        <p type="p">240:第一排氣通孔，第一排氣孔</p>
        <p type="p">245:第二排氣通孔，第二排氣孔</p>
        <p type="p">250:第一表面</p>
        <p type="p">255:第二表面</p>
        <p type="p">260:第二表面</p>
        <p type="p">262:第一表面</p>
        <p type="p">265:氣隙</p>
        <p type="p">270:出口</p>
        <p type="p">275:出口</p>
        <p type="p">280:中心區</p>
        <p type="p">290:第一閥</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="789" publication-number="202616555">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616555</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115846</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池組</chinese-title>
        <english-title>BATTERY PACK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260109B">H01M50/213</main-classification>
        <further-classification edition="202101120260109B">H01M50/262</further-classification>
        <further-classification edition="202101120260109B">H01M50/505</further-classification>
        <further-classification edition="202101120260109B">H01M50/593</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宣尙沃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEON, SANG OK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李容先</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YONGSEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本揭露的實施例的一種電池組包括：多個電池胞元，在一個方向上延伸；電池組框架，形成用於容納所述多個電池胞元的內部空間，且在上表面中敞開以容納所述電池胞元；及按壓板，可在所述電池組框架的內部空間中在上下方向上移動，且支撐所述多個電池胞元，其中所述多個電池胞元可彼此平行地容納於所述電池組框架的內部空間中，使得所述多個電池胞元中的每一者延伸的縱向方向正交於所述上下方向。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A battery pack according to an embodiment of the present disclosure comprises: a plurality of battery cells extending in one direction, a battery pack frame that forms an internal space for accommodating the plurality of battery cells, and is opened in an upper surface to accommodate the battery cells, and a pressing plate that is movable in an up-and-down direction in the internal space of the battery pack frame, and supports the plurality of battery cells, wherein the plurality of battery cells may be accommodated in parallel to each other in the internal space of the battery pack frame so that the longitudinal direction in which each of the plurality of battery cells extends is orthogonal to the up-and-down direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電池組</p>
        <p type="p">100:圓柱形電池胞元/電池胞元</p>
        <p type="p">200:電池組框架</p>
        <p type="p">201:前框架</p>
        <p type="p">204:卡固部分</p>
        <p type="p">205:容納開口</p>
        <p type="p">206:側框架</p>
        <p type="p">207:上部框架</p>
        <p type="p">x、y、z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="790" publication-number="202615895">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615895</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115847</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬塗膜、使用其之偏光板、及光學構件</chinese-title>
        <english-title>HARD COAT FILM, POLARIZING PLATE USING SAME, AND OPTICAL COMPONENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260107B">G02B1/14</main-classification>
        <further-classification edition="200601120260107B">B05D5/00</further-classification>
        <further-classification edition="200601120260107B">B05D7/24</further-classification>
        <further-classification edition="201901120260107B">B32B7/023</further-classification>
        <further-classification edition="200601120260107B">B32B27/18</further-classification>
        <further-classification edition="200601120260107B">B32B27/30</further-classification>
        <further-classification edition="200601120260107B">G02B5/22</further-classification>
        <further-classification edition="200601120260107B">G02B5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商凸版巴川光學薄膜股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOPPAN TOMOEGAWA OPTICAL FILMS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北條智大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOJO, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上壘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尾崎亮太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OZAKI, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡村光紘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMURA, MITSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種硬塗膜，其具有紫外線截止性能，且紫外線吸收劑不會在硬塗層表面偏析。又，提供使用該硬塗膜之偏光板、及顯示裝置等的光學構件。一種硬塗膜，其係在透明支撐體上設有硬塗層之硬塗膜，其中硬塗層為含有100質量份的丙烯酸酯化合物、1.5～25質量份的紫外線吸收劑、及0.1～15質量份的光聚合起始劑之組成物的硬化膜，存在於硬塗層的表面至硬塗層的厚度之30%以內的部分之紫外線吸收劑的比例為50質量%以下，波長380nm的光的穿透率為10%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:硬塗膜</p>
        <p type="p">2:透明支撐體</p>
        <p type="p">3:硬塗層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="791" publication-number="202616888">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616888</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115870</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置結構與其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250905B">H10D84/83</main-classification>
        <further-classification edition="202501120250905B">H10D84/01</further-classification>
        <further-classification edition="200601120250905B">H01L21/302</further-classification>
        <further-classification edition="200601120250905B">H01L21/205</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何梓暘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, TZU-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江雨蓁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, YU-JHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊凱傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KAI-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例提供一種半導體裝置結構及其形成方法。該結構包括設置在半導體層上方的閘電極層、與半導體層相鄰設置的源極/汲極區、設置在源極/汲極區上方的層間介電(ILD)層、設置在汲極/源極區上方的ILD層中的導電特徵、設置在閘電極層與導電特徵之間的第一介電層、設置在第一介電層與閘電極層之間的與第一介電層不同的第二介電層、設置在第二介電層與閘電極層之間的接觸蝕刻終止層、及設置在接觸蝕刻終止層與閘電極層之間的間隔物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure provide a semiconductor device structure and methods of forming the same. The structure includes a gate electrode layer disposed over a semiconductor layer, a source/drain region disposed adjacent the semiconductor layer, an interlayer dielectric (ILD) layer disposed over the source/drain region, a conductive feature disposed in the ILD layer over the source/drain region, a first dielectric layer disposed between the gate electrode layer and the conductive feature, a second dielectric layer distinct from the first dielectric layer disposed between the first dielectric layer and the gate electrode layer, a contact etch stop layer disposed between the second dielectric layer and the gate electrode layer, and a spacer disposed between the contact etch stop layer and the gate electrode layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置結構</p>
        <p type="p">106:第一半導體層</p>
        <p type="p">138:間隔物</p>
        <p type="p">144:介電間隔物</p>
        <p type="p">146:S/D區</p>
        <p type="p">162:CESL</p>
        <p type="p">170:閘極介電層</p>
        <p type="p">172:閘電極層</p>
        <p type="p">202:蝕刻終止層</p>
        <p type="p">208:介電層</p>
        <p type="p">210:矽化物層</p>
        <p type="p">212:金屬層</p>
        <p type="p">214:導電特徵</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="792" publication-number="202616680">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616680</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115947</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無線通訊設備</chinese-title>
        <english-title>WIRELESS COMMUNICATION APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H04B7/06</main-classification>
        <further-classification edition="201901120260109B">G06N20/00</further-classification>
        <further-classification edition="200601120260109B">H04L5/00</further-classification>
        <further-classification edition="200901120260109B">H04W24/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩波　哈米德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SABER, HAMID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裵　正鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, JUNG HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種無線通訊設備可包括：接收器，被配置成使用通道來接收參考訊號；發射器，被配置成傳送與通道相關的表示；以及處理電路，被配置成基於參考訊號確定通道資訊、使用模型基於通道資訊產生表示、以及使用接收器或發射器來傳遞模型資訊以指定模型。模型資訊可包括模型的辨識符。模型資訊可包括模型的結構資訊。模型資訊可包括關於模型的輸入類型的資訊。模型資訊可包括關於模型的輸入格式的資訊。模型資訊可包括映射資訊，所述映射資訊用於將通道資訊映射至模型的輸入。映射資訊可包括第一次頻帶的資訊及第二次頻帶的資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wireless communication apparatus may include a receiver configured to receive a reference signal using a channel, a transmitter configured to transmit a representation relating to the channel, and a processing circuit configured to determine channel information based on the reference signal, generate, using a model, the representation based on the channel information, and transfer, using the receiver or the transmitter, model information to specify the model. The model information may include an identifier for the model. The model information may include structure information for the model. The model information may include information about a type of input for the model. The model information may include information about a format of input for the model. The model information may include mapping information for mapping channel information to an input of the model. The mapping information may include information for a first subband, and information for a second subband.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:無線通訊設備/無線設備/設備</p>
        <p type="p">103:機器學習模型/產生模型/模型</p>
        <p type="p">105:實體層資訊</p>
        <p type="p">107:表示</p>
        <p type="p">109:箭頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="793" publication-number="202615985">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615985</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116060</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於緊湊型均勻性校正模組（UNICOM）之系統及方法</chinese-title>
        <english-title>SYSTEMS AND METHODS FOR COMPACT UNIFORMITY CORRECTION MODULE (UNICOM)</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">G03F7/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡米納　尤瓦爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMINER, YUVAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫古雷亞努　尼古拉　馬利安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNGUREANU, NICOLAE MARIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅爾菲　詹姆斯　二世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MELFI, JAMES, JR.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種均勻性校正系統，其包括：一第一組指形件；一第二組指形件；一第一致動器，其耦接至該第一組指形件以獨立地移動該第一組指形件中之各指形件；以及一第二致動器，其耦接至該第二組指形件以獨立地移動該第二組指形件中之各指形件。該第一致動器及該第二致動器配置於一經堆疊總成中。有利地，該經堆疊總成可獨立地控制該第一組指形件及該第二組指形件中之各指形件進出一輻射光束之一路徑，以校正該輻射光束之一強度、減小該系統之一總體積(佔據面積)、增大該第一組指形件及該第二組指形件之一橫向勁度及一致動速度、將該第一組指形件及該第二組指形件配置於同一平面中，且增大該第一致動器及該第二致動器之冷卻。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A uniformity correction system includes a first set of fingers, a second set of fingers, a first actuator coupled to the first set of fingers to independently move each finger of the first set of fingers, and a second actuator coupled to the second set of fingers to independently move each finger of the second set of fingers. The first and second actuators are arranged in a stacked assembly. Advantageously the stacked assembly can independently control each finger of the first and second sets of fingers into and out of a path of a radiation beam to correct an intensity of the radiation beam, decrease an overall volume (footprint) of the system, increase a transverse stiffness and an actuation speed of the first and second sets of fingers, arrange the first and second sets of fingers in the same plane, and increase cooling of the first and second actuators.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:均勻性校正系統</p>
        <p type="p">202:移動方向</p>
        <p type="p">204:橫向方向</p>
        <p type="p">206:編碼器</p>
        <p type="p">208:量測機構</p>
        <p type="p">210:第一組指形件</p>
        <p type="p">212:第一組指形件尖端</p>
        <p type="p">214:第一組指形件頸部</p>
        <p type="p">216:第一組指形件間隔</p>
        <p type="p">218:第一平面</p>
        <p type="p">220:第二組指形件</p>
        <p type="p">222:第二組指形件尖端</p>
        <p type="p">224:第二組指形件頸部</p>
        <p type="p">226:第二組指形件間隔</p>
        <p type="p">228:第二平面</p>
        <p type="p">230:經堆疊總成</p>
        <p type="p">240:第一致動器</p>
        <p type="p">242:第一線圈盤</p>
        <p type="p">244:第一組磁體</p>
        <p type="p">250:第二致動器</p>
        <p type="p">252:第二線圈盤</p>
        <p type="p">254:第二組磁體</p>
        <p type="p">260:框架</p>
        <p type="p">262:第一通道</p>
        <p type="p">264:第二通道</p>
        <p type="p">X:X軸</p>
        <p type="p">Y:Y軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="794" publication-number="202615897">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615897</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116099</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>各向異性光擴散膜與使用其之顯示器用膜、以及顯示器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">G02B5/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商巴川集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMOEGAWA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉山仁英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIYAMA, MASAHIDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂野翼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKANO, TSUBASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒島純彌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARASHIMA, JUNYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之各向異性光擴散膜係具有由下述組成物之光聚合所形成之各向異性光擴散層(30)的各向異性光擴散膜(3)，該組成物包含光聚合性化合物、光聚合引發劑、及酯系、環氧系、液狀橡膠系中之至少1種塑化劑，且各向異性光擴散層(30)具有基質區域(31)與柱狀區域(32)，該柱狀區域(32)由折射率與基質區域(31)不同之複數個柱狀構造體(33)所構成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:各向異性光擴散膜</p>
        <p type="p">30:各向異性光擴散層</p>
        <p type="p">31:基質區域</p>
        <p type="p">32:柱狀區域</p>
        <p type="p">33:柱狀構造體</p>
        <p type="p">T:厚度</p>
        <p type="p">H:平均高度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="795" publication-number="202615898">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615898</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116101</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>各向異性光擴散膜與使用其之顯示器用膜、以及顯示器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">G02B5/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商巴川集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMOEGAWA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉山仁英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIYAMA, MASAHIDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂野翼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKANO, TSUBASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒島純彌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARASHIMA, JUNYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之各向異性光擴散膜係具有由下述組成物之光聚合所形成之各向異性光擴散層(30)的各向異性光擴散膜(3)，該組成物包含光聚合性化合物、光聚合引發劑、及玻璃轉移溫度為0℃以下之熱塑性彈性體，且各向異性光擴散層(30)具有基質區域(31)與柱狀區域(32)，該柱狀區域(32)由折射率與基質區域(31)不同之複數個柱狀構造體(33)所構成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:各向異性光擴散膜</p>
        <p type="p">30:各向異性光擴散層</p>
        <p type="p">31:基質區域</p>
        <p type="p">32:柱狀區域</p>
        <p type="p">33:柱狀構造體</p>
        <p type="p">T:厚度</p>
        <p type="p">H:平均高度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="796" publication-number="202614937">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614937</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116154</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種滾膠鞋墊的製造方法及其設備</chinese-title>
        <english-title>MANUFACTURING METHOD FOR ADHESIVE-COATED INSOLE AND EQUIPMENT FOR THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">A43B17/14</main-classification>
        <further-classification edition="200601120250602B">A43B17/18</further-classification>
        <further-classification edition="200601120250602B">A43B17/08</further-classification>
        <further-classification edition="200601120250602B">A43B17/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大升國際興業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAH SHENG INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張訓誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSUN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏美芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, MEI-FEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張鴻基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HUNG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何崇民</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種滾膠鞋墊的製造方法，其包含以下步驟：將一纖維層片體以及一發泡層片體層疊貼合；將貼合之該纖維層片體以及該發泡層片體以一鞋墊輪廓裁斷，形成一鞋墊原型，該鞋墊原型包含貼合之一纖維層以及一發泡層；將該鞋墊原型至少部分之該發泡層塗布一止滑膠，其中該止滑膠的配方包含一水性不乾膠以及一防水膠；以及將該鞋墊原型烘乾，形成一滾膠鞋墊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method for adhesive-coated insole includes the following steps: laminating a fiber layer sheet and a foam layer sheet together; cutting the laminated fiber layer sheet and foam layer sheet into an insole profile to form an insole prototype, where the insole prototype consists of the laminated fiber layer and foam layer; applying an anti-slip adhesive to at least part of the foam layer of the insole prototype, where the formula of the anti-slip adhesive includes a water-based adhesive and a waterproof adhesive; and drying the insole prototype to form an adhesive-coated insole.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:纖維層</p>
        <p type="p">21:發泡層</p>
        <p type="p">31:鞋墊原型</p>
        <p type="p">G:止滑膠槽</p>
        <p type="p">R1:第一滾輪</p>
        <p type="p">R2:第二滾輪</p>
        <p type="p">R3:滾輪凸齒</p>
        <p type="p">S:硬質表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="797" publication-number="202615557">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615557</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116168</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合集電體用的塗佈型ＭＰＩ薄膜及其製備方法</chinese-title>
        <english-title>COATED MPI FILM FOR COMPOSITE CURRENT COLLECTORS AND PREPARATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260102B">C08J7/04</main-classification>
        <further-classification edition="200601120260102B">C08L67/02</further-classification>
        <further-classification edition="200601120260102B">C09D179/08</further-classification>
        <further-classification edition="200601120260102B">H05K1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞洲電材股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIA ELECTRONIC MATERIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李韋志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WEI CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何家華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHIA HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜伯賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DU, BO SIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李建輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIEN HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘柏均</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係提供一種複合集電體用的塗佈型MPI薄膜及其製備方法，該複合集電體用的塗佈型MPI薄膜包括載體膜、以及形成於該載體膜的至少一表面的改質聚醯亞胺樹脂清漆層；其中，該載體膜的厚度為25至250μm，該載體膜的表面粗糙度為0.001至10μm；該改質聚醯亞胺樹脂清漆層的單一厚度為1至150μm，該改質聚醯亞胺樹脂清漆層是一次固化生成的單一層或經多次塗佈固化生成的複數子層所構成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a coated MPI film for composite current collectors and a preparation method thereof. The coated MPI film for composite current collectors includes a carrier film and a modified polyimide resin varnish layer formed on at least one side of the carrier film; wherein, the thickness of the carrier film is 25 to 250 μm, and the surface roughness of the carrier film is 0.001 to 10 μm; the total thickness of the modified polyimide resin varnish layer is 1 to 150 μm, the modified polyimide resin varnish layer is a single layer formed by one-time curing or a plurality of layers formed by multiple coatings and curing. The present disclosure adopts meter-long continuous production and has good carrier operability during coating.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:改質聚醯亞胺樹脂薄膜</p>
        <p type="p">101:載體膜</p>
        <p type="p">102:改質聚醯亞胺樹脂清漆層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="798" publication-number="202616421">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616421</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116189</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於處理半導體承載裝置之真空腔室、方法以及系統</chinese-title>
        <english-title>VACUUM CHAMBER, METHOD AND SYSTEM FOR TREATING SEMICONDUCTOR CARRIER DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H01L21/67</main-classification>
        <further-classification edition="200601120260109B">H01L21/673</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商布魯克斯自動化(德國)有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROOKS AUTOMATION (GERMANY) GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑邁斯特　科妮莉亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAUMEISTER, CORNELIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種用於處理一半導體承載裝置之真空腔室，其中該真空腔室經組配以在其內部收納該半導體承載裝置，且其中該真空腔室包含自該真空腔室之一壁中之一通口延伸至該真空腔室之該內部的一擴散器。本案亦提供一種對應方法及一種系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a vacuum chamber for treating a semiconductor carrier device, wherein the vacuum chamber is configured to receive the semiconductor carrier device in its interior, and wherein the vacuum chamber comprises a diffuser extending from a port in a wall of the vacuum chamber into the interior of the vacuum chamber. Provided is also a corresponding method and a system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:真空腔室主體/壁</p>
        <p type="p">110:半導體承載裝置/FOUP/主體</p>
        <p type="p">112:半導體承載裝置/FOUP/蓋</p>
        <p type="p">120:泵送通口</p>
        <p type="p">130:排氣通口</p>
        <p type="p">180:泵</p>
        <p type="p">200:真空腔室</p>
        <p type="p">240:擴散器</p>
        <p type="p">242:管道</p>
        <p type="p">244:開口或孔</p>
        <p type="p">132,222:元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="799" publication-number="202616588">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616588</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116241</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具訊號調理模組的連接器組件</chinese-title>
        <english-title>CONNECTOR ASSEMBLY HAVING A SIGNAL CONDITIONING MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260109B">H01R13/6587</main-classification>
        <further-classification edition="201101120260109B">H01R12/73</further-classification>
        <further-classification edition="200601120260109B">H01R13/02</further-classification>
        <further-classification edition="200601120260109B">H01R13/514</further-classification>
        <further-classification edition="200601120260109B">H01R13/518</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商太谷康奈特提威提索洛訊有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TE CONNECTIVITY SOLUTIONS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希爾茲　琳達　艾倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIELDS, LINDA ELLEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏寧　麥可　詹姆士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORNING, MICHAEL JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫爾斯特　大衛　韋恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HELSTER, DAVID WAYNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電連接器組件(200)包含一連接器殼體(210)，其固持排列於一晶片堆疊(232)中的晶片組件(230)。各晶片組件包含一晶片框架(240)、耦接至該晶片框架的接點、耦接至該晶片框架的訊號調理模組(400)、以及端接至該訊號調理模組的一纜線組件(228)。訊號調理模組包含一電路板(402)與安裝至該電路板的一中繼器裝置(420)。接點的配接端(262)係配接至一匹配連接器組件的匹配接點，而接點的端接端(264)係電連接至訊號調理模組的電路板。纜線(202)及接點經由電路板電連接至中繼器裝置以形成資料通道，且中繼器裝置恢復沿著資料通道傳輸的訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical connector assembly (200) includes a connector housing (210) holding wafer assemblies (230) arranged in a wafer stack (232). Each wafer assembly includes a wafer frame (240), contacts coupled to the wafer frame, a signal conditioning module (400) coupled to the wafer frame, and a cable assembly (228) terminated to the signal conditioning module. The signal conditioning module includes a circuit board (402) and a repeater device (420) mounted to the circuit board. Mating ends (262) of the contacts are mated to mating contacts of a mating connector assembly and terminating ends (264) of the contacts are electrically connected to the circuit board of the signal conditioning module. The contacts and the cables (202) are electrically connected to the repeater device through the circuit board to form data channels and the repeater device restores signals transmitted along the data channels.</p>
      </isu-abst>
      <representative-img>
        <p type="p">202:纜線</p>
        <p type="p">205:接點組件</p>
        <p type="p">206:接點</p>
        <p type="p">208:屏蔽結構</p>
        <p type="p">228:纜線組件</p>
        <p type="p">230:晶片組件</p>
        <p type="p">240:晶片框架</p>
        <p type="p">242:前部</p>
        <p type="p">244:接點支撐平台</p>
        <p type="p">400:訊號調理模組</p>
        <p type="p">600:接地框架</p>
        <p type="p">602:接地框架</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="800" publication-number="202615444">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615444</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116299</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於儲存有機錫化合物之方法及物品</chinese-title>
        <english-title>METHOD FOR STORING ORGANOTIN COMPOUNDS AND ARTICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07F7/22</main-classification>
        <further-classification edition="200601120260102B">C23C16/30</further-classification>
        <further-classification edition="200601120260102B">C23C16/448</further-classification>
        <further-classification edition="200601120260102B">C23C16/455</further-classification>
        <further-classification edition="201201120260102B">G03F1/66</further-classification>
        <further-classification edition="200601120260102B">G03F7/00</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/16</further-classification>
        <further-classification edition="200601120260102B">B32B27/08</further-classification>
        <further-classification edition="200601120260102B">B32B27/32</further-classification>
        <further-classification edition="200601120260102B">B32B27/34</further-classification>
        <further-classification edition="200601120260102B">B65D1/02</further-classification>
        <further-classification edition="200601120260102B">B65D25/14</further-classification>
        <further-classification edition="200601120260102B">B65D81/30</further-classification>
        <further-classification edition="200601120260102B">B65D85/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蓋列斯特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GELEST, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日置優太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIOKI, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福井浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUI, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　力</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐姿漣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述一種用於儲存有機錫化合物之方法及一種尤其適用於維持用於半導體應用之有機錫化合物之高純度的物品。該用於儲存有機錫化合物之方法涉及將有機錫化合物儲存於容器中且用惰性氣體填充該容器之頂部空間，其中該容器為至少含有遮光層、氣體阻隔層及最內層之多層樹脂容器，且構成與該有機錫化合物接觸之該最內層的材料包括全氟烷氧基烷烴、聚四氟乙烯、酚樹脂及/或超高分子量聚乙烯。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for storing organotin compounds and an article that is particularly useful for maintaining the high purity of organotin compounds for semiconductor applications is described. The method for storing an organotin compound involves storing the organotin compound in a container and filling the headspace of the container with an inert gas, in which the container is a multilayer resin container containing, at least a light-shielding layer, a gas barrier layer, and an innermost layer, and the material constituting the innermost layer in contact with the organotin compound includes perfluoroalkoxyalkane, polytetrafluoroethylene, phenol resin, and/or ultra-high molecular weight polyethylene.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:物品</p>
        <p type="p">10:樹脂容器</p>
        <p type="p">11:容器主體</p>
        <p type="p">12:蓋</p>
        <p type="p">13:頂部空間</p>
        <p type="p">21:第一連接管</p>
        <p type="p">22:第二連接管</p>
        <p type="p">23:閥</p>
        <p type="p">24:閥</p>
        <p type="p">A:有機錫化合物</p>
        <p type="p">B:惰性氣體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="801" publication-number="202616470">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616470</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116305</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板支架系統</chinese-title>
        <english-title>SUBSTRATE HOLDER SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H01L21/687</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡晨非</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, CHENFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖　健閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHIEN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒爾　馬克大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHULL, MARC DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫特尼　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUTNEY, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓　湯瑪斯Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, THOMAS K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博德里　克里斯多佛勞倫特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEAUDRY, CHRISTOPHER LAURENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">此處描述的實施例與基板支架系統相關。一種裝置包括基板支架，其具有用來接收基板的表面。該表面具有紋理，該紋理使射向該表面的光束向遠離位於基板支架上方的光學偵測器的至少一個方向散射。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments described herein relate to substrate holder systems. An apparatus includes a substrate holder having a surface to receive a substrate. The surface has a texture that causes an optical beam incident on the surface to scatter in at least one direction away from an optical detector to be located above the substrate holder.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:系統</p>
        <p type="p">410:基板支架</p>
        <p type="p">412:表面</p>
        <p type="p">420:基板</p>
        <p type="p">422:圖案化膜</p>
        <p type="p">440:光束</p>
        <p type="p">442A:光束部分</p>
        <p type="p">442B:光束部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="802" publication-number="202616121">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616121</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116429</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>碳基二維層中的空位及碳基結構</chinese-title>
        <english-title>VACANCIES IN CARBON-BASED 2D LAYERS AND CARBON-BASED STRUCTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260109B">G06F30/00</main-classification>
        <further-classification edition="201901120260109B">G16C60/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴塞隆納大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIVERSITAT DE BARCELONA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡塔蘭研究和高級研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INSTITUCIO CATALANA DE RECERCA I ESTUDIS AVANCATS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西班牙商埃德迪私人有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDEADED, S.L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里貝羅　莫雷拉　伊比利亞　迪　賓賀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIBEIRO MOREIRA, IBERIO DE PINHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯瑪士　布羅姆利　史蒂凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THOMAS BROMLEY, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里歐帕特　莫提斯　基尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LLEOPART MOTIS, GENIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅佩茲　蘇亞雷斯　米格爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOPEZ SUAREZ, MIQUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容提供一種用於決定用於一2D層的一空位模式之電腦實施的方法，所述2D層包括碳原子的碳基六方晶格，所述空位模式定義在所述2D層的一封閉區域中待被移除的在所述2D層之內的一組碳原子的位置，以用於獲得具有一低於所述2D層的密度的一碳基材料。本揭露內容進一步提供一種電腦程式、一種碳基結構、以及一種提供一碳基結構之系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides a computer-implemented method for determining a vacancy-pattern for a 2D layer, the 2D layer comprising a carbon-based hexagonal lattice of carbon atoms, the vacancy-pattern defining a set of positions of carbon atoms within the 2D layer to be removed in a closed region of the 2D layer for obtaining a carbon-based material with a lower density than the 2D layer. The disclosure further provides a computer program, a carbon-based structure, and a system to provide a carbon-based structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:模型</p>
        <p type="p">11:像素</p>
        <p type="p">12:六邊形</p>
        <p type="p">13:圓圈</p>
        <p type="p">14:邊界</p>
        <p type="p">20:石墨烯2D層</p>
        <p type="p">21:六方晶格</p>
        <p type="p">22:六邊形</p>
        <p type="p">23:碳原子</p>
        <p type="p">30:資料結構</p>
        <p type="p">31:位點/資料位點</p>
        <p type="p">32:位點群組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="803" publication-number="202616812">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616812</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116434</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體及其形成方法</chinese-title>
        <english-title>MEMORY AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250901B">H10B10/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李佳蓁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIA CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱韋臻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, WEI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳佳典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIA-TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝艮軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, KEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古舒云</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KU, SHU-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">記憶體包括與第二下部磊晶源極/汲極區域相鄰的第一下部磊晶源極/汲極區域；與第一下部磊晶源極/汲極區域的第一側相鄰的第一下部閘極電極；與第二下部磊晶源極/汲極區域的第二側相鄰的第二下部閘極電極；位於第一下部磊晶源極/汲極區域、第二下部磊晶源極/汲極區域、第一下部閘極電極和第二下部閘極電極下方的介電層；位於介電層內的第一對接接觸件，第一對接接觸件將第一下部磊晶源極/汲極區域電連接到第二下部閘極電極；以及位於介電層內的第二對接接觸件，第二對接接觸件將第二下部磊晶源極/汲極區域電連接到第一下部閘極電極。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device includes a first lower epitaxial source/drain region adjacent a second lower epitaxial source/drain region; a first lower gate electrode adjacent a first side of the first lower epitaxial source/drain region; a second lower gate electrode adjacent a second side of the second lower epitaxial source/drain region; a dielectric layer under the first lower epitaxial source/drain region, the second lower epitaxial source/drain region, the first lower gate electrode, and the second lower gate electrode; a first butted contact within the dielectric layer, wherein the first butted contact electrically connects the first lower epitaxial source/drain region to the second lower gate electrode; and a second butted contact within the dielectric layer, wherein the second butted contact electrically connects the second lower epitaxial source/drain region to the first lower gate electrode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">62L-1,62L-2,62L-3,62L-4:源極/汲極區域</p>
        <p type="p">80L-1,80L-2,80L-3,80L-4:閘極電極</p>
        <p type="p">212A,212B:對接接觸件</p>
        <p type="p">212V:通孔部分</p>
        <p type="p">222A’,222B’:SRAM區域</p>
        <p type="p">D-D’:橫截面</p>
        <p type="p">W2:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="804" publication-number="202616831">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616831</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116455</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250801B">H10B99/00</main-classification>
        <further-classification edition="202501120250801B">H10D89/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王屏薇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪連嶸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, LIEN-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一裝置包含第一、第二、第三與第四電晶體以及第一與第二導體。第一電晶體耦合到第一節點且包含第一閘極。第二電晶體耦合到第一節點且包含第二閘極。第三電晶體耦合到第二節點，且包含在第一方向上與第一閘極分離的第三閘極。第四電晶體耦合到第二節點，且包含第四閘極。第一導體位於基板前側上方的第一金屬層上，且耦合到第一閘極與第二節點。第二導體位於基板背側下方的第二金屬層上，且耦合到第四閘極與第一節點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device includes a first, second, third, and fourth transistor and a first and second conductor. The first transistor is coupled to a first node and includes a first gate. The second transistor is coupled to the first node, the second transistor includes a second gate. The third transistor is coupled to a second node, and includes a third gate separated from the first gate in a first direction. The fourth transistor is coupled to the second node, and includes a fourth gate. The first conductor is on a first metal layer above a front-side of a substrate, and is coupled to the first gate and the second node. The second conductor is on a second metal layer below a back-side of the substrate, and is coupled to the fourth gate and the first node.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:佈局設計</p>
        <p type="p">300A:部分</p>
        <p type="p">301:單元</p>
        <p type="p">301a:單元邊界</p>
        <p type="p">301b:單元邊界</p>
        <p type="p">301c:單元邊界</p>
        <p type="p">301d:單元邊界</p>
        <p type="p">302:主動區域圖案組</p>
        <p type="p">302a:主動區域佈局圖案(主動區域圖案)</p>
        <p type="p">302b:主動區域佈局圖案(主動區域圖案)</p>
        <p type="p">306:閘極圖案組</p>
        <p type="p">306a:閘極圖案</p>
        <p type="p">306b:閘極圖案</p>
        <p type="p">310:接觸圖案</p>
        <p type="p">310a:接觸圖案</p>
        <p type="p">310b:接觸圖案</p>
        <p type="p">310c:接觸圖案</p>
        <p type="p">310d:接觸圖案</p>
        <p type="p">314:接觸圖案組</p>
        <p type="p">314a:接觸圖案</p>
        <p type="p">314b:接觸圖案</p>
        <p type="p">320:通孔圖案組</p>
        <p type="p">320a:通孔圖案</p>
        <p type="p">320b:通孔圖案</p>
        <p type="p">320c:通孔圖案</p>
        <p type="p">320d:通孔圖案</p>
        <p type="p">320e:通孔圖案</p>
        <p type="p">324:通孔圖案組</p>
        <p type="p">324a:通孔圖案</p>
        <p type="p">330:導電特徵圖案組</p>
        <p type="p">330c:導電特徵圖案</p>
        <p type="p">340:切割特徵圖案組</p>
        <p type="p">340a:切割特徵圖案</p>
        <p type="p">340b:切割特徵圖案</p>
        <p type="p">340c:切割特徵圖案</p>
        <p type="p">340d:切割特徵圖案</p>
        <p type="p">BL:位元線</p>
        <p type="p">BLB:位元線條</p>
        <p type="p">CPO:切割閘極層(切割POLY層)</p>
        <p type="p">M0:金屬0層</p>
        <p type="p">MD:金屬過擴散層</p>
        <p type="p">MDLI:金屬過擴散局部互連層</p>
        <p type="p">ND:節點</p>
        <p type="p">NDB:節點</p>
        <p type="p">PD1:NFET電晶體</p>
        <p type="p">PD2:NFET電晶體</p>
        <p type="p">PG1:NFET電晶體</p>
        <p type="p">PG2:NFET電晶體</p>
        <p type="p">PO:閘極層</p>
        <p type="p">VD:通孔過擴散層</p>
        <p type="p">VG:閘極上通孔層</p>
        <p type="p">VSS:參考電壓源</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
        <p type="p">Z:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="805" publication-number="202615333">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615333</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116464</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>由生質氣體製造化學工業品的方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C01B3/36</main-classification>
        <further-classification edition="200601120260102B">C07B61/00</further-classification>
        <further-classification edition="200601120260102B">C07C1/20</further-classification>
        <further-classification edition="200601120260102B">C07C15/02</further-classification>
        <further-classification edition="200601120260102B">C07C29/151</further-classification>
        <further-classification edition="200601120260102B">C07C31/04</further-classification>
        <further-classification edition="200601120260102B">C08G64/20</further-classification>
        <further-classification edition="200601120260102B">C10G3/00</further-classification>
        <further-classification edition="200601120260102B">C10L3/10</further-classification>
        <further-classification edition="202201120260102B">B09B3/65</further-classification>
        <further-classification edition="202201320260102B">B09B101/70</further-classification>
        <further-classification edition="202201320260102B">B09B101/85</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤井尊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJII, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤真樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, MAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一實施形態提供一種由生質氣體製造化學工業品的方法，其包含以下步驟(A)~(C)。  &lt;br/&gt;　　步驟(A)由生質原料、製造含甲烷氣體的生質氣體之步驟，  &lt;br/&gt;　　步驟(B)將前述生質氣體的至少一部份與水作為原料，製造含一氧化碳及氫的合成氣體之步驟，及  &lt;br/&gt;　　步驟(C)將前述合成氣體所含有的一氧化碳及氫作為原料，製造甲醇之步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="806" publication-number="202615524">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615524</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116484</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化物之製造方法、硬化物及電子零件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">C08F299/02</main-classification>
        <further-classification edition="200601120260112B">C08G65/44</further-classification>
        <further-classification edition="200601120260112B">C08G65/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商太陽控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIYO HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉田侑生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGITA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川信広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, NOBUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関口翔也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKIGUCHI, SHOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三島翔子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MISHIMA, SHOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋山茂義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKIYAMA, TAKAYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供關於在大氣環境下使硬化性組成物硬化時，可得到具有充分之強度的硬化物之硬化物之製造方法的技術。某一態樣之硬化物之製造方法包含：將包含下述具有式(1)表示之官能基直接鍵結在苯環之構造的聚苯醚(Polyphenylene Ether)之硬化性組成物於大氣環境下加熱硬化之步驟。  &lt;br/&gt;&lt;img align="absmiddle" height="61px" width="178px" file="ed10014.JPG" alt="ed10014.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式(1)中，R為碳數1~8之烷基)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="807" publication-number="202615648">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615648</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116493</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>建構適合於特定集團之生物學年齡測定指標之裝置及方法以及所被建構之生物學年齡測定裝置及生物學年齡測定方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">C12M1/00</main-classification>
        <further-classification edition="200601120260109B">C12M1/34</further-classification>
        <further-classification edition="201001120260109B">C12N15/117</further-classification>
        <further-classification edition="201801120260109B">C12Q1/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商雷利克薩股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RHELIXA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塘由惟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMO, YUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仲木竜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAKI, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日比野佐和子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIBINO, SAWAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種裝置及方法，其係能夠一面減少模型建構所需之樣本數，同時可從得自於特定集團的少數的DNA甲基化資料，建構出適合於特定集團的高預測精度之模型。本發明的生物學年齡測定裝置1，係基於DNA甲基化程度來測定生物學年齡。生物學年齡測定裝置1，係將由n個樣本所構成的第1母集團之各個樣本的DNA中所包含的q處的CpG位點上的DNA甲基化資訊為基礎的第1解釋變數資訊當作解釋變數矩陣(n×p矩陣(p≦q))，並將n個樣本的生物學年齡資訊為基礎的第1目標變數資訊當作目標變數向量(n維)，基於由與第1母集團不同之第2母集團所被推定出來的生物學年齡測定模型，來進行遷移學習，將其學習結果當作已學習之生物學年齡測定模型而予以輸出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="808" publication-number="202616772">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616772</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116520</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>照明裝置、照明系統及使用其產生照明效果的方法</chinese-title>
        <english-title>LIGHTING DEVICE, LIGHTING SYSTEM AND METHOD FOR GENERATING LIGHTING EFFECTS USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260109B">H05B45/20</main-classification>
        <further-classification edition="202001120260109B">H05B45/46</further-classification>
        <further-classification edition="202001120260109B">H05B47/165</further-classification>
        <further-classification edition="202001120260109B">H05B47/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商雷蛇（亞太）私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAZER (ASIA-PACIFIC) PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　川良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHUANLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種照明裝置。照明裝置可包括：至少一發光裝置；資料接收器，經配置為接收用於至少一發光裝置的控制訊號，控制訊號包括顏色資料和電流增益資料；控制器，經配置為發送顏色資料到至少一發光裝置，以控制至少一發光裝置中的各別發光裝置的色調；恆流模組，經配置為向至少一發光裝置中的各別發光裝置提供恆定電流；及電流增益模組，經配置為基於電流增益資料調變由恆流模組向各別發光裝置提供的恆定電流的電流值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A lighting device is provided. The lighting device may comprise: at least one light emitting device; a data receiver configured to receive a control signal for the at least one light emitting device, the control signal comprising a color data and a current gain data; a controller configured to send the color data to the at least one light emitting device to control a color shade of a respective light emitting device of the at least one light emitting device; a constant current module configured to provide a constant current for a respective light emitting device of the at least one light emitting device; and a current gain module configured to modulate a current value of the constant current provided by the constant current module for the respective light emitting device based the current gain data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">30:電腦周邊裝置</p>
        <p type="p">100:照明裝置</p>
        <p type="p">600:照明系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="809" publication-number="202616351">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616351</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116546</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿增進之氮化矽沉積</chinese-title>
        <english-title>PLASMA-ENHANCED SILICON NITRIDE DEPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H01L21/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳漢鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HANHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉冠彣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, GUAN-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林齊周</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHI-CHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露了直接在氧化鋁(Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;)膜上沉積氮化矽(Si&lt;sub&gt;x&lt;/sub&gt;N&lt;sub&gt;y&lt;/sub&gt;)膜以形成膜堆疊的方法。示範性的方法包括可選擇性地使用含氮(N&lt;sub&gt;2&lt;/sub&gt;)的電漿（例如，微波電漿）處理形成於半導體基板上的氧化鋁(Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;)膜，達一時間段，該時間段範圍為0.1秒至2分鐘。這些方法進一步包括通過電漿增進原子層沉積(PEALD)直接在氧化鋁(Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;)膜上沉積氮化矽(Si&lt;sub&gt;x&lt;/sub&gt;N&lt;sub&gt;y&lt;/sub&gt;)膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods of depositing a silicon nitride (Si&lt;sub&gt;x&lt;/sub&gt;N&lt;sub&gt;y&lt;/sub&gt;) film directly on an aluminum oxide (Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;) film to form a film stack are disclosed. Exemplary methods include, optionally, treating the aluminum oxide (Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;) film formed on a semiconductor substrate with a plasma comprising nitrogen (N&lt;sub&gt;2&lt;/sub&gt;) (e.g., a microwave plasma) for a time period in a range of from 0.1 seconds to 2 minutes. The methods further include depositing the silicon nitride (Si&lt;sub&gt;x&lt;/sub&gt;N&lt;sub&gt;y&lt;/sub&gt;) film directly on the aluminum oxide (Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;) film by plasma-enhanced atomic layer deposition (PEALD).</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:方法</p>
        <p type="p">11~15:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="810" publication-number="202616035">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616035</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116573</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>穩定連續時脈監測器</chinese-title>
        <english-title>STABLE CONTINUOUS CLOCK MONITOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">G06F1/04</main-classification>
        <further-classification edition="200601120260109B">G06F1/08</further-classification>
        <further-classification edition="200601120260109B">G06F1/12</further-classification>
        <further-classification edition="200601120260109B">G06F1/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商谷歌有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOOGLE LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙弗　帕拉塔莫什　拉梅什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAVE, PRATHAMESH RAMESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普拉薩德　賈納丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRASAD, JANARDAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文件描述了針對穩定連續時脈監測器之系統及技術。在態樣中，一種穩定連續時脈監測器包括包含一安全時脈之一安全時脈域及包含一取樣時脈之一取樣時脈域。使用者無法存取該安全時脈域。將所量測之安全時脈增量與所量測之取樣時脈增量進行比較，以判定該比較是否超過一臨限值。以此方式，該技術可準確地判定該取樣時脈之超頻。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This document describes systems and techniques directed at a stable continuous clock monitor. In aspects, a stable continuous clock monitor includes a secure clock domain comprising a secure clock and a sample clock domain comprising a sample clock. The secure clock domain is not user accessible. Measured secure clock increments are compared with measured sample clock increments to determine whether the comparison exceeds a threshold value. In this way, the technique may accurately determine overclocking for the sample clock.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:穩定連續時脈監測器的另一實例實施方案</p>
        <p type="p">502:安全域</p>
        <p type="p">504:取樣域</p>
        <p type="p">506:安全時脈</p>
        <p type="p">508:取樣時脈</p>
        <p type="p">510:比較器</p>
        <p type="p">512:臨限值</p>
        <p type="p">514:臨限值</p>
        <p type="p">516:第一FIFO/主FIFO</p>
        <p type="p">518:第二FIFO/輔FIFO</p>
        <p type="p">520:量測結果/量測</p>
        <p type="p">522:第一輸入</p>
        <p type="p">524:信號</p>
        <p type="p">526:量測結果</p>
        <p type="p">528:安全時脈量測結果</p>
        <p type="p">530:組合量測輸出</p>
        <p type="p">532:輸出</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="811" publication-number="202616679">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616679</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116606</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可重組智慧表面裝置</chinese-title>
        <english-title>RECONFIGURABLE INTELLIGENT SURFACE DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260109B">H04B7/04</main-classification>
        <further-classification edition="200601120260109B">H01Q3/46</further-classification>
        <further-classification edition="200601120260109B">H01Q15/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔炯喆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, HYENG-CHEUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜普暎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, BOYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜秉琯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, BYOUNGGWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昌炯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHANGHYEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹洪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可重組智慧表面裝置包括一基板，該基板包含一第一主表面及與該第一主表面相對之一第二主表面，該第一主表面具有複數個RIS元件，該複數個RIS元件中之各RIS元件包括複數個同心導電閉合環路，該複數個同心導電閉合環路中之各導電閉合環路與一鄰近導電閉合環路分開且藉由複數個鏈結電導體電連接至該鄰近導電閉合環路。該可重組智慧表面裝置在約400 nm至約700奈米之一波長範圍內的一透射率可等於或大於約50%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A reconfigurable intelligent surface device including a substrate comprising a first major surface and a second major surface opposite the first major surface, the first major surface having a plurality of RIS elements, each RIS element of the plurality of RIS elements including a plurality of concentric electrically conductive closed loops, each electrically conductive closed loop of the plurality of concentric electrically conductive closed loops separated from an adjacent electrically conductive closed loop and electrically connected thereto by a plurality of linking electrical conductors. A transmittance of the reconfigurable intelligent surface device over a wavelength range of about 400 nm to about 700 nanometers may be equal to or greater than about 50%.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:RIS裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="812" publication-number="202614935">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614935</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116615</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>閉合系統</chinese-title>
        <english-title>CLOSURE SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">A42B3/14</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳金柱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIN-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳金柱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIN-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示提供一種閉合系統，包含束緊物件、束緊裝置及繫線。束緊物件設置於被束物且包含主框架及至少一導引部。束緊裝置設置於主框架且包含至少一齒條、齒輪、旋鈕及掣動單元。齒條受主框架遮擋，齒條包含內側端及外側端。齒輪囓合於內側端。旋鈕可操作地耦合於齒輪。掣動單元位於齒輪與旋鈕之間。繫線穿過主框架及導引部，且繫線的一端連接於齒條的外側端。當旋鈕受外力朝束緊方向轉動，帶動齒輪驅動齒條，繫線帶動導引部靠近主框架。藉此提升調整後束緊物件的平衡性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a closure system including a closure article, a closure device and a lace. The closure article is disposed on a wound article and includes a main frame and at least one guiding portion. The closure device is disposed at the main frame and includes at least one gear rack, a gear, a knob and an engaging unit. The gear rack is covered by the main frame. The gear rack includes an inner end and an outer end. The gear is engaged with the inner end. The knob is operably coupled to the gear. The engaging unit is located between the gear and the knob. The lace passes the main frame and the guiding portion, and one end of the lace is connected to the outer end of the gear rack. As the knob is rotated in a tensioning direction by an external force, the gear drives the gear rack, and the lace allows the guiding portion to move close to the main frame. Therefore, the balance of the tensioning article after adjusted is increased.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:閉合系統</p>
        <p type="p">1100:束緊物件</p>
        <p type="p">1110:主框架</p>
        <p type="p">1111:設置板</p>
        <p type="p">1111a:中間部</p>
        <p type="p">1111b:翼部</p>
        <p type="p">1112:連接部</p>
        <p type="p">1113:孔洞</p>
        <p type="p">1120:子框架</p>
        <p type="p">1130:導引部</p>
        <p type="p">1200:束緊裝置</p>
        <p type="p">1300:繫線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="813" publication-number="202615349">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615349</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116668</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高濃度且高安定性之中空氧化矽有機溶膠及其之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C01B33/145</main-classification>
        <further-classification edition="200601120260102B">C01B33/149</further-classification>
        <further-classification edition="200601120260102B">C08K3/36</further-classification>
        <further-classification edition="200601120260102B">C08K5/00</further-classification>
        <further-classification edition="200601120260102B">C08K7/26</further-classification>
        <further-classification edition="200601120260102B">C08L101/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中田豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKADA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江原和也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBARA, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>実
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMOYOSHI, MANAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村透</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, TOHRU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供一種有機溶膠，其係以高濃度含有中空氧化矽粒子，且包含對溶媒之分散安定性較高之中空氧化矽粒子。  &lt;br/&gt;　　作為解決手段，為提供一種中空氧化矽有機溶膠及其製造方法，其係含有下述(A)成分與(B)成分之中空氧化矽有機溶膠，且相對於該有機溶膠之全量(100質量%)，以20質量%~70質量%包含(A)成分，  &lt;br/&gt;　　(A)成分：中空氧化矽粒子，其係含鋁原子之中空氧化矽粒子，  &lt;br/&gt;　　且存在於前述中空氧化矽粒子全體之鋁原子之量以Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;換算，相對於前述中空氧化矽粒子之質量，為120~50,000ppm/SiO&lt;sub&gt;2&lt;/sub&gt;，動態光散射所得之平均粒子徑為20~150nm，  &lt;br/&gt;　　(B)成分：包含有機溶媒、反應性單體或聚合物中任一種以上之分散媒。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="814" publication-number="202615345">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615345</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116670</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含低甲醇之氧化矽粒子及有機溶膠與其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C01B33/12</main-classification>
        <further-classification edition="200601120260102B">C01B33/145</further-classification>
        <further-classification edition="200601120260102B">C08K3/36</further-classification>
        <further-classification edition="200601120260102B">C08L101/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江原和也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBARA, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中田豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKADA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本圭吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, KEIGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠藤歲幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDO, TOSHIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>実
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMOYOSHI, MANAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供一種降低甲醇之含量之氧化矽粒子及氧化矽溶膠以及其製造方法。  &lt;br/&gt;　　作為解決手段，本發明為提供一種氧化矽粒子及含有該氧化矽粒子之有機溶膠，該氧化矽粒子為含有鋁原子之氧化矽粒子，且存在於前述氧化矽粒子全體之鋁原子之量以Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;換算且相對於前述氧化矽粒子之質量為120~ 50000ppm/SiO&lt;sub&gt;2&lt;/sub&gt;，相對於前述氧化矽粒子之質量之甲醇含量為未滿800ppm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="815" publication-number="202615265">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615265</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116671</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電動車充電之通訊控制器及其之錯誤偵測方法</chinese-title>
        <english-title>COMMUNICATION CONTROLLER FOR CHARGING ELECTRIC VEHICLE AND METHOD OF DETECTING ERROR THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260107B">B60L3/00</main-classification>
        <further-classification edition="201901120260107B">B60L53/14</further-classification>
        <further-classification edition="201901120260107B">B60L53/30</further-classification>
        <further-classification edition="201901120260107B">B60L53/66</further-classification>
        <further-classification edition="200601120260107B">G01R19/165</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG INNOTEK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申桄燮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, KWANG SEOB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於電動車輛充電的通訊控制器，包含：一正電壓偵測器，配置用於偵測來自一電動車輛供電設備（EVSE）的脈寬調變（PWM）形式之控制導引（CP）訊號的正電壓；一負電壓偵測器，用於該偵測CP信號的負電壓；及一控制器，設定為使用一第一值偵測一第一點的誤差，並使用一第二值偵測一第二點的誤差，其中該第一值為負電壓偵測器所偵測的電壓值，該第一點位於連接該電動車供電設備（EVSE）接地端與該電動車一接地端的一保護接地(PE)線路上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electric vehicle communication controller for charging an electric vehicle according to one embodiment of the present invention includes a positive voltage detector configured to detect a positive voltage of a control pilot (CP) signal in the form of pulse wide modulation (PWM), which is received from electric vehicle supply equipment (EVSE), a negative voltage detector configured to detect a negative voltage of the CP signal, and a controller that is set to detect an error of a first point using a first value and an error of a second point using a second value, wherein the first value is a voltage value detected by the negative voltage detector, and the first point is located on a protective earth (PE) line connecting a ground of the EVSE to a ground of the electric vehicle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S900:步驟</p>
        <p type="p">S910:步驟</p>
        <p type="p">S920:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="816" publication-number="202615496">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615496</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116714</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>脫交聯聚烯烴樹脂、包含其之組合物及其製備方法</chinese-title>
        <english-title>DECROSSLINKED POLYOLEFIN RESIN, COMPOSITION COMPRISING THE SAME, AND METHOD OF PREPARING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F8/50</main-classification>
        <further-classification edition="200601120260102B">C08J11/12</further-classification>
        <further-classification edition="202501120260102B">C08L23/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商韓華思路信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANWHA SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜苑焌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, WON JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金善東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUN DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康喆巸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, CHUL EE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金東淏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DONG HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋瀚秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, HAN SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李在赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JAE HYEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">此處揭露的脫交聯聚烯烴樹脂於0.1弧度/秒的tan δ大於或等於0.9，且脫交聯指數(DI)大於或等於100。本發明的脫交聯聚烯烴樹脂的特性如耐久度、熱穩定性、與抗化學性改良。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein is a decrosslinked polyolefin resin having a tan δ of 0.9 or more at 0.1 rad/s and a decrosslinking index (DI) of 100 or more. The decrosslinked polyolefin resin according to the present invention has improved properties in terms of durability, thermal stability, and chemical resistance.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="817" publication-number="202616561">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616561</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116722</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有可重組智慧表面（　RIS　）之反射陣列</chinese-title>
        <english-title>REFLECTIVE ARRAY WITH A RECONFIGURABLE INTELLIGENCE SURFACE (RIS)</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H01Q15/00</main-classification>
        <further-classification edition="200601120260109B">H01Q15/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔炯喆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, HYENG-CHEUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜普暎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, BOYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜秉琯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, BYOUNGGWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昌炯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHANGHYEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具有一多波束可重組智慧表面（RIS）之反射陣列。該反射陣列可包含：一基板；以及配置於該基板上之複數組單位胞元，各組單位胞元經配置以在接收角度與其他組單位胞元之入射波束的角度相同的一入射波束時產生角度與該等其他組單位胞元之反射波束的角度不同的一反射波束。來自該等複數組單位胞元之該等反射波束的覆蓋範圍可經疊加以形成一集體反射波束，其波束寬度大於來自各組單位胞元之該反射波束的波束寬度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A reflective array with a multi-beam reconfigurable intelligence surface (RIS) is provided. The reflective array may comprise a substrate; and a plurality of sets of unit cells arranged on the substrate, each set of unit cells configured to create a reflective beam with different angle from those of reflective beams of the other sets of unit cells, when receiving an incident beam with the same angle as those of incident beams of the other sets of unit cells. The coverages of the reflective beams from the plurality of set of unit cells may be superposed to form a collective reflective beam with beam width greater than that of the reflective beam from each set of unit cells.</p>
      </isu-abst>
      <representative-img>
        <p type="p">210:基板</p>
        <p type="p">220:圖案</p>
        <p type="p">A、B、C、D:RIS分塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="818" publication-number="202616879">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616879</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116738</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND MANUFACTURE METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251121B">H10D84/01</main-classification>
        <further-classification edition="202501120251121B">H10D84/83</further-classification>
        <further-classification edition="200601120251121B">H01L21/302</further-classification>
        <further-classification edition="200601120251121B">H01L21/205</further-classification>
        <further-classification edition="200601120251121B">B82B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊愷潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KAI-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡旻昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MIN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫偉源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOON, WEI-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖　思雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包括在半導體基板上方形成多層堆疊，多層堆疊包含交替的半導體奈米結構與虛設奈米結構；形成下部源極/汲極區，半導體奈米結構中之下部半導體奈米結構在下部源極/汲極區之間延伸；在下部源極/汲極區上方形成上部源極/汲極區，半導體奈米結構中之上部半導體奈米結構在上部源極/汲極區之間延伸；移除虛設奈米結構以在下部半導體奈米結構之間形成第一開口，及在上部半導體奈米結構之間形成第二開口；在上部半導體奈米結構周圍及在第二開口中形成第一含金屬層；將第一含金屬層之表面曝露於第一分子抑制劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes forming a multi-layer stack over a semiconductor substrate, the multi-layer stack comprising alternating semiconductor nanostructures and dummy nanostructures; forming lower source/drain regions, wherein lower semiconductor nanostructures of the semiconductor nanostructures extend between the lower source/drain regions; forming upper source/drain regions over the lower source/drain regions, wherein upper semiconductor nanostructures of the semiconductor nanostructures extend between the upper source/drain regions; removing the dummy nanostructures to form first openings between the lower semiconductor nanostructures, and second openings between the upper semiconductor nanostructures; forming a first metal-containing layer around the upper semiconductor nanostructures and in the second openings; exposing surfaces of the first metal-containing layer to a first molecular inhibitor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:基板</p>
        <p type="p">62:鰭片</p>
        <p type="p">66L:下部半導體奈米結構</p>
        <p type="p">66M:中間半導體奈米結構</p>
        <p type="p">66U:上部半導體奈米結構</p>
        <p type="p">69:凹槽</p>
        <p type="p">70:隔離區</p>
        <p type="p">100:隔離結構</p>
        <p type="p">132:閘極介電質</p>
        <p type="p">164:含金屬層</p>
        <p type="p">165:分子抑制劑</p>
        <p type="p">166:鈍化層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="819" publication-number="202616447">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616447</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116773</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>搬運支援裝置及搬運支援系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H01L21/677</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>手塚一幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEZUKA, KAZUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豊巻俊明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOMAKI, TOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東海林賢斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKAIRIN, KENTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之搬運支援裝置係被使用在進行基板處理的基板處理系統的搬運支援裝置，具備：兩條軌條；兩個支持構件；及兩支臂。各個支持構件係沿著軌條移動，支持收容基板的容器。各個臂係藉由朝沿著安裝容器的裝載埠的側面的方向作伸縮，支援軌條及支持構件的升降。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:治具</p>
        <p type="p">21:臂</p>
        <p type="p">210:連桿</p>
        <p type="p">211:連桿</p>
        <p type="p">22:軌條</p>
        <p type="p">23:支持構件</p>
        <p type="p">230:鉸鏈</p>
        <p type="p">231:定位銷</p>
        <p type="p">232:板部</p>
        <p type="p">24:連結構件</p>
        <p type="p">25:氣彈簧</p>
        <p type="p">27:支持板</p>
        <p type="p">270:導槽</p>
        <p type="p">271:導槽</p>
        <p type="p">272:螺孔</p>
        <p type="p">273:卡合部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="820" publication-number="202615372">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615372</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116777</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具備霧面表面之衛浴陶器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">C04B33/22</main-classification>
        <further-classification edition="200601120260114B">C04B33/34</further-classification>
        <further-classification edition="200601120260114B">C04B41/86</further-classification>
        <further-classification edition="200601120260114B">E03D11/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＯＴＯ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOTO LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩澤亜希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWASAWA, AKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川上克博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAKAMI, KATSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新崎朝規</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARASAKI, TOMONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木京子
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEKI, KYOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長澤友也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGASAWA, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示一種具備平靜、沉穩的質感之霧面表面之衛浴陶器。本發明的衛浴陶器係具備陶器坯體與在表面上的釉藥層之衛浴陶器，前述釉藥層之表面的(1)20°光澤度為5以下，60°光澤度為20以下，85°光澤度為30以下，(2)表面粗糙度Ra為1.0μm以上之衛浴陶器，係給予觀看者與以往霧面表面不同之平靜、沉穩的印象。藉此，提高產品的外觀(設計性)，還可與在相同空間的牆壁或器具類的質感協調，擴大設計的變化，例如帶來與周圍一體性的設計空間，可提高產品價值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="821" publication-number="202616702">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616702</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116825</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於不等調製的增強鏈路自我調整方法、通信設備和系統</chinese-title>
        <english-title>ENHANCED LINK ADAPTATION METHOD, COMMUNICATION DEVICE, AND SYSTEM FOR UNEQUAL MODULATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H04L27/34</main-classification>
        <further-classification edition="201501120260109B">H04B17/309</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮　淑玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, SHULING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　劍函</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JIANHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮爾二世　湯姆士艾德華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARE, JR.,THOMAS EDWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳佑瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YOU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方　永剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, YONGGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種增強的增強型鏈路自我調整 (eELA) 方法包括：回應設備從請求設備接收包含 eELA 請求消息的實體層協定資料單元 (PPDU)；回應設備至少基于從 eELA 請求消息或 PPDU 獲得的空間流數量，確定包含跨多個空間流的不等調製 (UEQM) 資訊的 eELA 回饋消息；以及回應設備向請求設備發送 eELA 回饋消息。UEQM 資訊指示每個空間流的有效信噪比 (SNR) 或每個空間流的有效 SNR 的衍生物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An enhanced-enhanced link adaptation (eELA) method includes receiving, by a responding device from a requesting device, a physical layer protocol data unit (PPDU) including an eELA request message, determining, by the responding device, an eELA feedback message comprising unequal quadrature amplitude modulation (UEQM) information across a plurality of spatial streams based on at least the number of spatial streams derived from the eELA request message or the PPDU, and transmitting, from the responding device to the requesting device, the eELA feedback message. The UEQM information indicates an effective Signal-to-Noise Ratio (SNR) per spatial stream or a derivative of the effective SNR per spatial stream.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S401，S402，S403:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="822" publication-number="202616846">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616846</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116826</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251121B">H10D30/01</main-classification>
        <further-classification edition="200601120251121B">H01L21/324</further-classification>
        <further-classification edition="200601120251121B">H01L21/302</further-classification>
        <further-classification edition="200601120251121B">H01L21/31</further-classification>
        <further-classification edition="200601120251121B">H01L21/78</further-classification>
        <further-classification edition="202501120251121B">H10D30/62</further-classification>
        <further-classification edition="202501120251121B">H10D62/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林子敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TZU-GING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種製造半導體裝置的方法，包括形成交替層堆疊包括沿著垂直於交替層堆疊之介面的第一方向堆疊的第一半導體層與第二半導體層。對交替層堆疊進行圖案化以形成鰭片結構，鰭片結構具有沿著第一方向的高度、沿著垂直於第一方向的第二方向的長度、及沿著垂直於第二方向及第一方向的第三方向的寬度。對鰭片結構進行圖案化以產生沿著第二方向彼此分離開的源極/汲極區。移除第一半導體層，並在相鄰第二半導體層之間的先前由第一半導體層佔據的空間內形成介電中介層。方法更包括形成源極/汲極磊晶層，及在形成源極/汲極磊晶層之後執行退火操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of manufacturing a semiconductor device includes forming an alternating layer stack including first semiconductor layers and second semiconductor layers stacked along a first direction that is perpendicular to interfaces of the alternating layer stack. The alternating layer stack is patterned to form a fin structure having a height along the first direction, a length along a second direction that is perpendicular to the first direction, and a width along a third direction that is perpendicular to the first direction and the second direction. The fin structure is patterned to generate source/drain regions that are separated from one another along the second direction. The first semiconductor layers are removed and a dielectric interposer layer are formed within spaces between adjacent second semiconductor layers previously occupied by the first semiconductor layers. The method further includes forming source/drain epitaxial layers and performing an annealing operation after forming the source/drain epitaxial layers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:堆疊通道區</p>
        <p type="p">104:閘極結構</p>
        <p type="p">106:閘極介電層</p>
        <p type="p">108:源極/汲極磊晶層</p>
        <p type="p">110:介電間隔物</p>
        <p type="p">112:半導體基板</p>
        <p type="p">1302:層間介電層</p>
        <p type="p">1800:中間結構</p>
        <p type="p">B-B’:橫截面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="823" publication-number="202615560">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615560</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116871</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>塑膠溶劑分解混合物與填料組分的分離</chinese-title>
        <english-title>SEPARATION OF PLASTIC SOLVOLYSIS MIXTURES FROM FILLER COMPONENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">C08J11/14</main-classification>
        <further-classification edition="200601120260114B">B29B17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴斯夫歐洲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐特　約翰斯　克里斯提安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTT, JONAS CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克內曼　馬丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOENEMANN, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼戈德　漢娜　史蒂芬妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANGOLD, HANNAH STEPHANIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪爾曼　馬力歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIEHLMANN, MARIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克尼格　哈特穆特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOENIG, HARTMUT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德斯博伊　菲利浦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DESBOIS, PHILIPPE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於處理包含包含極性溶劑（S）之溶劑組成物（SC）、聚合物（P1）之可溶寡聚物及視需要單體、填料（F1）及視需要其他不溶殘餘物之混合物（M1）之方法，其包含提供混合物（M1）；及自混合物（M1）分離該填料（F1）及不溶殘餘物而獲得包含該填料（F1）及不溶殘餘物的混合物（M-2）及包含該溶劑組成物（SC）及該聚合物（P1）之可溶寡聚物及視需要單體的混合物（M-3），其中該分離係藉由在低於55巴的壓力及於自150至270°C的範圍的溫度下過濾來實施。本發明亦針對可藉由或係藉由所述方法獲得之填料以及其用於製備聚合物產物之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a process for treating a mixture (M1) comprising a solvent composition (SC) comprising a polar solvent (S), soluble oligomers and optionally monomers of a polymer (P1), filler (F1), and optionally further insoluble residues, comprising providing mixture (M1); and separating the filler (F1) and insoluble residues from mixture (M1) obtaining mixture (M-2) comprising the filler (F1) and insoluble residues, and mixture (M-3) comprising the solvent composition (SC) and soluble oligomers and optionally monomers of the polymer (P1), wherein the separation is carried out by filtration at a pressure below 55 bar and a temperature in the range of from 150 to 270°C. The present invention is also directed to the fillers obtainable or obtained by said process as well as the use thereof for preparing a polymeric product.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="824" publication-number="202615986">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615986</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116883</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於疊對量測之系統及方法</chinese-title>
        <english-title>SYSTEMS AND METHODS FOR OVERLAY MEASUREMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">G03F7/20</main-classification>
        <further-classification edition="201701120260109B">G06T7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張晨雨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHENYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>付　繼有</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, JIYOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於判定一樣本中之層疊對的系統及方法。系統及方法包括：基於模擬或樣本影像來判定線輪廓；基於一擬合公式、該等線輪廓以及該等模擬或樣本影像之經程式化之設定疊對來判定超參數；及利用與一所量測影像相關聯之線輪廓、該擬合公式以及該等經判定超參數來判定該所量測影像之一疊對量測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and methods for determining overlay of layers in a sample. Systems and methods include determining line profiles based on simulated or sample images; determining hyperparameters based on a fitting formula, the line profiles, and programmed set overlays of the simulated or sample images; and determining an overlay measurement of a measured image utilizing line profiles associated with the measured image, the fitting formula, and the determined hyperparameters.</p>
      </isu-abst>
      <representative-img>
        <p type="p">800:程序</p>
        <p type="p">802:步驟</p>
        <p type="p">804:步驟</p>
        <p type="p">806:步驟</p>
        <p type="p">808:步驟</p>
        <p type="p">810:步驟</p>
        <p type="p">812:步驟</p>
        <p type="p">814:步驟</p>
        <p type="p">816:步驟</p>
        <p type="p">818:步驟</p>
        <p type="p">820:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="825" publication-number="202615203">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615203</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116939</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於混合接合後ＣＵ墊拋光覆蓋的ＣＭＰ上的整合式濕式鈍化</chinese-title>
        <english-title>INTEGRATED WET PASSIVATION ON CMP FOR HYBRID BONDING POST-CU PAD POLISH CAPPING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260107B">B24B37/10</main-classification>
        <further-classification edition="200601120260107B">H01L23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏琮商</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, TSUNG SHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　政達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOH, ZHENG DA CLINTON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文實施例係關於一種方法和一種用於實施該方法的對應CMP處理系統。該方法包括由CMP處理系統對包含設置在設置於基板上方的介電層上方的互連材料的圖案化裝置結構執行CMP製程，該介電層內含有經蝕刻的互連結構，其中該互連材料填充該等互連結構，並設置於該等互連結構及該介電層的場域區域上方，該CMP製程移除設置於該介電層的該場域區域上的該互連材料的部分，並暴露該等圖案化裝置結構的該等互連結構內的墊，然後由該CMP處理系統在該等圖案化裝置結構的該等暴露墊上方沉積鈍化層，再由整合式混合接合平臺移除該鈍化層；並且由該整合式混合接合平臺將對應的圖案化裝置結構接合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments herein relate to a method and a correspond CMP processing system for implementing the method. The method includes performing, by a CMP processing system, a CMP process on patterned device structures comprising an interconnect material disposed over a dielectric layer disposed over a substrate, the dielectric layer including interconnect structures etched therein, wherein the interconnect material fills the interconnect structures, and is disposed over the interconnect structures and a field region of the dielectric layer, the CMP process removing portions of the interconnect material disposed on the field region of the dielectric layer and exposing pads within the interconnect structures of the patterned device structures, depositing, by the CMP processing system, a passivation layer over the exposed pads of the patterned device structures, removing, by an integrated hybrid bonding platform, the passivation layer; and bonding, by the integrated hybrid bonding platform, corresponding patterned device structures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:CMP系統</p>
        <p type="p">302:工廠介面</p>
        <p type="p">302A:裝載站</p>
        <p type="p">303:第一基板處理裝置</p>
        <p type="p">304:第二基板處理裝置</p>
        <p type="p">306:清潔系統</p>
        <p type="p">306A:清潔單元</p>
        <p type="p">306B:清潔單元</p>
        <p type="p">307:第一清潔模組</p>
        <p type="p">307A:第一門</p>
        <p type="p">309:第二清潔模組</p>
        <p type="p">309A:第一垂直清潔模組</p>
        <p type="p">309B:第二垂直清潔模組</p>
        <p type="p">309C:門</p>
        <p type="p">310:鈍化層沉積模組</p>
        <p type="p">310A:第一鈍化層沉積模組</p>
        <p type="p">310B:第二鈍化層沉積模組</p>
        <p type="p">310C:第一門</p>
        <p type="p">319:拋光墊</p>
        <p type="p">321:拋光站</p>
        <p type="p">322:分配臂</p>
        <p type="p">323:調理頭</p>
        <p type="p">324:承載頭</p>
        <p type="p">326:轉移站</p>
        <p type="p">334:沖洗及乾燥模組</p>
        <p type="p">340:非接觸式清潔單元</p>
        <p type="p">400A:基板處理序列</p>
        <p type="p">400B:基板處理序列</p>
        <p type="p">401:路徑</p>
        <p type="p">402:路徑</p>
        <p type="p">403:路徑</p>
        <p type="p">404:路徑</p>
        <p type="p">405:路徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="826" publication-number="202616874">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616874</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116944</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置和形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250916B">H10D64/01</main-classification>
        <further-classification edition="202501120250916B">H10D30/60</further-classification>
        <further-classification edition="200601120250916B">H01L21/762</further-classification>
        <further-classification edition="200601120250916B">H01L21/306</further-classification>
        <further-classification edition="200601120250916B">B82B1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林子敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TZU-GING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在形成半導體裝置的奈米結構電晶體的內部間隔物和源極/汲極區域之前，從半導體裝置的層堆疊移除犧牲半導體層。犧牲半導體層可以與由於犧牲半導體層和半導體通道層的材料之間的混合而形成的混合層一起移除。犧牲半導體層和混合層可以用犧牲介電層來取代。接著，可以蝕刻犧牲介電層以形成空腔，在空腔中形成內部間隔物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Sacrificial semiconductor layers are removed from a layer stack of a semiconductor device prior to formation of inner spacers and source/drain regions of a nanostructure transistor of the semiconductor device. The sacrificial semiconductor layers may be removed along with intermixing layers that may have formed due to intermixing between the materials of the sacrificial semiconductor layers and semiconductor channel layers. The sacrificial semiconductor layers and intermixing layers may be replaced with sacrificial dielectric layers. The sacrificial dielectric layers may then be etched to form cavities in which the inner spacers are formed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">105:半導體裝置</p>
        <p type="p">110:半導體基板</p>
        <p type="p">165:鰭片部分</p>
        <p type="p">170:襯層</p>
        <p type="p">220:間隔物層</p>
        <p type="p">220a:間隔物層</p>
        <p type="p">220b:間隔物層</p>
        <p type="p">310:台面區域</p>
        <p type="p">315:奈米結構通道</p>
        <p type="p">505:內部間隔物</p>
        <p type="p">605:磊晶區域</p>
        <p type="p">610:源極/汲極區域</p>
        <p type="p">705:介電層</p>
        <p type="p">710:覆蓋層</p>
        <p type="p">810:閘極介電層</p>
        <p type="p">815:閘極結構</p>
        <p type="p">1000:示例實施方式</p>
        <p type="p">1105:隔離間隔物</p>
        <p type="p">B-B:橫截面</p>
        <p type="p">C-C:橫截面</p>
        <p type="p">x:方向</p>
        <p type="p">y:方向</p>
        <p type="p">z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="827" publication-number="202615779">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615779</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116963</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>關節、應用其之機械手臂及分析方法</chinese-title>
        <english-title>JOINT, ROBOT ARM USING THE SAME AND ANALYTICAL METHOD USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">F16C11/04</main-classification>
        <further-classification edition="201101120260114B">F16D3/223</further-classification>
        <further-classification edition="200601120260114B">B25J19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳顥言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HAO-YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素貞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SU-JHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YAN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐陽澔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OU YANG, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉昱顯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黎煥昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, HUAN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳建佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">關節包括關節殼體、第一固定件及第二固定件。第一固定件可轉動地連接於關節殼體且具有第一固定部。第二固定件固定於關節殼體且具有第二固定部。第一固定部與第二固定部分別具有可相配合之結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A joint includes a joint casing, a first fixing element and a second fixing element. The first fixing element is rotatably connected to the joint casing and has a first fixing portion. The second fixing element is fixed to the joint casing and has a second fixing portion. The first fixing portion and the second fixing portion respectively have matching structures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:關節</p>
        <p type="p">110:關節殼體</p>
        <p type="p">120:第一固定件</p>
        <p type="p">120A:第一固定部</p>
        <p type="p">130:第二固定件</p>
        <p type="p">130s:第二抵接面</p>
        <p type="p">130u:第二表面</p>
        <p type="p">130A:第二固定部</p>
        <p type="p">131:凸部</p>
        <p type="p">150:限位件</p>
        <p type="p">151:凹部</p>
        <p type="p">150s:第一抵接面</p>
        <p type="p">150u:第一表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="828" publication-number="202615719">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615719</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116990</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板表面上的抗反射塗層</chinese-title>
        <english-title>AN ANTI-REFLECTIVE COATING ON A SURFACE OF A SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">C23C16/56</main-classification>
        <further-classification edition="201501120260109B">G02B1/11</further-classification>
        <further-classification edition="200601120260109B">C23C16/455</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商倍耐克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENEQ OY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅恩　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RONN, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩索寧　利維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PESONEN, LEEVI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於在基板之表面上產生抗反射塗層的方法。該方法包含：a)在反應空間中，將該基板之該表面交替地曝露於至少兩種前驅物，一次一種前驅物，以進行基本上自限制表面反應，從而在該基板上形成氧化鋁沉積物；b)使該氧化鋁沉積物經歷用水溶液進行之後處理；c)在反應空間中，將經後處理之氧化鋁沉積物交替地曝露於至少兩種前驅物，一次一種前驅物，以進行基本上自限制表面反應，從而在經後處理之氧化鋁沉積物上形成另一氧化鋁沉積物；及d)使該另一氧化鋁沉積物經歷用水溶液進行之該後處理；以在該基板上形成該抗反射氧化鋁塗層。進一步揭露基板之表面上的抗反射氧化鋁塗層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for producing an anti-reflective coating on a surface of a substrate is disclosed. The method comprises: a) exposing the surface of the substrate, in a reaction space, to alternately repeated, essentially self-limiting surface reactions of at least two precursors, one precursor at a time, to form an aluminium oxide deposit on the substrate; b) subjecting the aluminium oxide deposit to a post-treatment with aqueous solution; c) exposing the surface of the post-treated aluminium oxide deposit, in a reaction space, to alternately repeated, essentially self-limiting surface reactions of at least two precursors, one precursor at a time, to form further aluminium oxide deposit thereon; and d) subjecting the further aluminium oxide deposit to the post-treatment with aqueous solution; to form the anti-reflective aluminium oxide coating on the substrate. Further is disclosed an anti-reflective aluminium oxide coating on a surface of a substrate.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="829" publication-number="202616404">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616404</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117018</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>判定平坦化製程的終點</chinese-title>
        <english-title>DETERMINING AN ENDPOINT OF A PLANARIZATION PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H01L21/66</main-classification>
        <further-classification edition="200601120260109B">H01L21/321</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商肯珀爾公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEMPOWER CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴布　蘇爾耶德瓦拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BABU, SURYADEVARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米斯拉　蘇翰舒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MISRA, SUDHANSHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於判定平坦化製程之終點之方法，其包括使用官能化化學平坦化墊來平坦化基板材料。該官能化化學平坦化墊包含複數個鍵結至該墊之材料之官能基。該等官能基在或不在溶液中試劑之輔助下經組態以與該基板材料發生化學反應，從而使基板材料之一部分鍵結至該等官能基。在該平坦化製程期間監測該基板材料及/或該平坦化墊之一或多個參數。基於該基板材料及/或該平坦化墊之該一或多個參數來判定該平坦化製程之該終點，且輸出到達該終點之指示。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for determining an endpoint of a planarization process comprising planarizing a substrate material using a functionalized chemical planarization pad. The functionalized chemical planarization pad includes a plurality of functional groups bonded to a material of the pad. The functional groups are configured, with or without the assistance of reagents in a solution, to chemically react with the substrate material such that a portion of substrate material bonds to the functional groups. One or more parameters of the substrate material and/or the planarization pad are monitored during the planarization process. The endpoint of the planarization process is determined based upon the one or more parameters of the substrate material and/or the planarization pad, and an indication is output that the endpoint is reached.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:方法</p>
        <p type="p">602:步驟</p>
        <p type="p">604:步驟</p>
        <p type="p">606:步驟</p>
        <p type="p">608:步驟</p>
        <p type="p">610:步驟</p>
        <p type="p">612:步驟</p>
        <p type="p">614:步驟</p>
        <p type="p">616:步驟</p>
        <p type="p">618:步驟</p>
        <p type="p">620:步驟</p>
        <p type="p">622:步驟</p>
        <p type="p">624:步驟</p>
        <p type="p">626:步驟</p>
        <p type="p">628:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="830" publication-number="202615237">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615237</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117049</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>與物理發泡中底共模製的鞋部件及其製備方法</chinese-title>
        <english-title>SHOE COMPONENT CO-MOLDED WITH A PHYSICALLY FOAMING MIDSOLE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">B29C44/16</main-classification>
        <further-classification edition="200601120260115B">B29C44/58</further-classification>
        <further-classification edition="201001120260115B">B29D35/12</further-classification>
        <further-classification edition="200601320260115B">B29L31/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豐泰企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG TAY ENTERPRISES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊宗霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TSUNG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張宇達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖鉦達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種與物理發泡中底共模製的鞋部件，包含一複合大底及一物理發泡中底；複合大底包含一大底基層及一網格層，網格層具有相背對的一第一表面與一第二表面，第一表面具有一第一表面結構，第二表面具有一第二表面結構，第一表面結構與第二表面結構係不相同，其中第一表面結合大底基層；物理發泡中底之底面係一部分進入第二表面之第二表面結構而與網格層形成投錨效應，另一實施例提供鞋部件製備方法，係將複合大底置入於一發泡模具，並在發泡模具中注入一熱可塑性發泡流體材料且利用超臨界流體進行發泡成型物理發泡中底以結合複合大底之網格層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A shoe component co-molded with a physically foaming midsole, comprising a composite outsole and a physically foaming midsole; the composite outsole comprises an outsole base layer and a mesh layer. The mesh layer has a first surface and a second surface facing opposite directions. The first surface has a first surface structure, and the second surface has a second surface structure, which the first surface structure and the second surface structure are different from each other. The first surface is bonded to the outsole base layer; the bottom surface of the physically foaming midsole partially enters the second surface structure of the second surface, forming an anchoring effect with the mesh layer. Another embodiment provides the shoe component manufacturing method. The manufacturing method involves placing the composite outsole into a foaming mold, injecting a thermoplastic foaming fluid material into the foaming mold, and using a supercritical fluid to foam the physically foaming midsole to bond with the mesh layer of the composite outsole.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:與物理發泡中底共模製的鞋部件</p>
        <p type="p">10:複合大底</p>
        <p type="p">11:大底基層</p>
        <p type="p">111:第一頂面</p>
        <p type="p">112:第一底面</p>
        <p type="p">12:網格層</p>
        <p type="p">121:第一表面</p>
        <p type="p">122:第二表面</p>
        <p type="p">20:物理發泡中底</p>
        <p type="p">21:第二頂面</p>
        <p type="p">22:第二底面</p>
        <p type="p">30:織造鞋面</p>
        <p type="p">31:底布面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="831" publication-number="202615189">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615189</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117052</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合金屬邊框的加工方法、複合金屬邊框及電子設備</chinese-title>
        <english-title>METHOD FOR PROCESSING A COMPOSITE METAL FRAME, COMPOSITE METAL FRAME, AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120251023B">B23K26/323</main-classification>
        <further-classification edition="201401120251023B">B23K26/21</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商富聯裕展科技（深圳）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FULIAN YUZHAN PRECISION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭曉路</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, XIAO-LU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉於盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YU-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁小鳳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, XIAO-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何圳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, ZHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊仁軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, REN-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種複合金屬邊框的加工方法、複合金屬邊框及電子設備，加工方法包括：提供金屬複合基材，金屬複合基材包括層疊結合的第一金屬層與第二金屬層；自第一金屬層表面向金屬複合基材內部形成沉積孔；在沉積孔內沉積熔融的填充金屬並固化以形成填充體；去除部分填充體和與填充體對應的第二金屬層以形成安裝孔，第二金屬層及填充體從安裝孔內壁露出。上述加工方法可以使填充體緊密貼合第一金屬層與第二金屬層的連接處，第一金屬層與第二金屬層的連接處的均勻性較好，從而提高了複合金屬邊框的品質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The application relates to a method for processing a composite metal frame, a composite metal frame, and an electronic device. The method comprises: providing a metal composite substrate comprising a first metal layer and a second metal layer bonded in a stacked manner; forming a deposition hole from a surface of the first metal layer into the metal composite substrate; depositing molten filler metal into the deposition hole and solidifying the molten filler metal to form a filler body; and removing a portion of the filler body and a corresponding portion of the second metal layer to form a mounting hole, wherein the second metal layer and the filler body are exposed from an inner wall of the mounting hole. The method ensures that the filler body tightly adheres to a junction between the first metal layer and the second metal layer, thereby improving uniformity at the junction and enhancing the quality of the composite metal frame.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:複合金屬邊框</p>
        <p type="p">10:第一金屬層</p>
        <p type="p">20:第二金屬層</p>
        <p type="p">40:填充體</p>
        <p type="p">41:安裝孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="832" publication-number="202615894">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615894</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117101</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>附有吸收層之透明基材及其製造方法、以及車輛用透明零件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260102B">G02B1/115</main-classification>
        <further-classification edition="201501120260102B">G02B1/18</further-classification>
        <further-classification edition="200601120260102B">G02B5/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本洋平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之附有吸收層之透明基材具備：具有第1主面及第2主面之透明基材、與上述透明基材之上述第1主面相接地配置之吸收層、及配置於上述透明基材之上述第2主面之印刷層，且上述吸收層包含：含有水解性矽烷化合物之縮聚物之基質材料、及分散於上述基質材料中之著色顏料粒子，上述吸收層側之最表面之鉛筆硬度為4H以上，視感透過率為10～85%，且上述吸收層側之最表面之表面電阻率為10&lt;sup&gt;11&lt;/sup&gt;～10&lt;sup&gt;15&lt;/sup&gt;Ω/□。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:附有吸收層之透明基材</p>
        <p type="p">1A:吸收層側最表面</p>
        <p type="p">10:印刷層</p>
        <p type="p">20:透明基材</p>
        <p type="p">20A:第1主面</p>
        <p type="p">20B:第2主面</p>
        <p type="p">30:吸收層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="833" publication-number="202616352">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616352</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117113</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造高介電常數閘極結構的方法</chinese-title>
        <english-title>METHODS OF FABRICATING HIGH-K GATE STRUCTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/02</main-classification>
        <further-classification edition="200601120260102B">H01L21/324</further-classification>
        <further-classification edition="202501120260102B">H10D30/01</further-classification>
        <further-classification edition="202501120260102B">H10D64/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博薩勒　普拉薩德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHOSALE, PRASAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪　史蒂芬ＣＨ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, STEVEN C.H.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓜立尼　泰瑞莎Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUARINI, THERESA K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏　燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史文博格　玖漢尼斯Ｆ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SWENBERG, JOHANES F.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德切柯　寶拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE CECCO, PAOLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝巴德　喬瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEPARD, JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康拉德　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CONRAD, MARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克爾克派翠克　布萊恩Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIRKPATRICK, BRIAN K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">處理方法可經執行以產生包含高介電常數介電材料的半導體結構。該方法包括對半導體基板表面進行預清洗。在基板表面上透過將基板暴露於氧化氣氛並對表面進行熱退火而形成界面層。使用水合化學處理界面層以形成經處理的界面層，然後在經處理的界面層上沉積高介電常數介電層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Processing methods may be performed to produce semiconductor structures that include a high-k dielectric material. The methods include pre-cleaning a semiconductor substrate surface. An interfacial layer is formed on the substrate surface by exposing the substrate to an oxidizing atmosphere and thermally annealing the surface. The interfacial layer is treated with hydration chemistry to form a treated interfacial layer, followed by deposition of a high-k dielectric layer on the treated interfacial layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:半導體結構</p>
        <p type="p">305:基板</p>
        <p type="p">320:界面</p>
        <p type="p">330b:層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="834" publication-number="202615373">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615373</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117133</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＰＢＮ容器及ＰＢＮ容器的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250901B">C04B35/583</main-classification>
        <further-classification edition="200601120250901B">C04B41/00</further-classification>
        <further-classification edition="200601120250901B">C04B41/50</further-classification>
        <further-classification edition="200601120250901B">C04B41/85</further-classification>
        <further-classification edition="200601120250901B">H01B1/04</further-classification>
        <further-classification edition="200601120250901B">H01B5/14</further-classification>
        <further-classification edition="200601120250901B">C23C14/24</further-classification>
        <further-classification edition="200601120250901B">C23C14/30</further-classification>
        <further-classification edition="200601120250901B">C30B23/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平手暁大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRATE, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, NOBORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>串橋卓馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSHIHASHI, TAKUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>狩野正樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANO, SHOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山村和市</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMURA, WAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種PBN容器，具備：容器本體，由熱分解氮化硼(PBN)的層積體所構成；以及導電性膜，覆蓋前述容器本體的表面，其特徵係，當前述容器本體之層剖面、前述容器本體中接觸該層剖面的內壁面或外壁面，兩者形成的角度為θ，則該角度θ在前述容器本體的整個開口部中為20˚以上80˚以下；前述容器本體之開口部前端的部分的形狀，在前述容器本體的整個開口部中，曲率半徑R為0.2mm以上3.0mm以下。如此一來，就能提供一種持久性優秀的PBN容器與這種PBN容器的製造方法，該PBN容器是層積PBN而形成的容器，其本體表面層積有導電性膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:PBN容器(爐床襯墊)</p>
        <p type="p">11:容器本體</p>
        <p type="p">12:導電性膜</p>
        <p type="p">13:層剖面</p>
        <p type="p">14:內壁面</p>
        <p type="p">15:外壁面</p>
        <p type="p">16:內壁面</p>
        <p type="p">17:上端面</p>
        <p type="p">18:內壁側的部分</p>
        <p type="p">19:平坦面</p>
        <p type="p">θ,θ’:角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="835" publication-number="202616490">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616490</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117192</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝及製造其的方法</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250912B">H01L23/29</main-classification>
        <further-classification edition="200601120250912B">H01L23/373</further-classification>
        <further-classification edition="200601120250912B">H01L21/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王渝涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YU-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳燕銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾明慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, MING-TSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林詠淇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUNG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種半導體封裝及形成其的方法。半導體封裝可包括封裝基底及在封裝基底上的第一封裝元件。第一封裝元件可包括第一半導體晶粒及在第一半導體晶粒上的散熱基底。散熱基底可包括基底部分及在基底部分第一表面上的第一塗層部分。第一塗層部分可位於第一半導體晶粒與基底部分之間。基底部分可包括具有第一熱導電性的第一材料，且第一塗層部分可包括與第一材料不同的第二材料。第二材料可具有比第一熱導電性小的第二熱導電性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor package and the method of forming the same are provided. The semiconductor package may include a package substrate and a first package component over the package substrate. The first package component may include a first semiconductor die and a heat dissipation substrate over the first semiconductor die. The heat dissipation substrate may comprise a base portion and a first coating portion on a first surface of the base portion. The first coating portion may be between the first semiconductor die and the base portion. The base portion may comprise a first material with a first thermal conductivity and the first coating portion may comprise a second material different from the first material. The second material may have a second thermal conductivity smaller than the first thermal conductivity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">312:晶圓/基底部分</p>
        <p type="p">313:塗層/塗層部分</p>
        <p type="p">315:第二載體基底</p>
        <p type="p">400、500、600、650:半導體封裝元件</p>
        <p type="p">502:主動區</p>
        <p type="p">610:導電特徵</p>
        <p type="p">612、708:電性連接件</p>
        <p type="p">614、616、707:底膠</p>
        <p type="p">618:封裝體</p>
        <p type="p">700:封裝基底</p>
        <p type="p">702:基底核心</p>
        <p type="p">704、706:導電接觸件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="836" publication-number="202616510">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616510</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117223</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路裝置及其製造方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT DEVICE AND METHOD OF FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251023B">H01L23/528</main-classification>
        <further-classification edition="200601120251023B">H01L23/522</further-classification>
        <further-classification edition="200601120251023B">H01L23/535</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾威程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TZENG, WEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭士瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, SHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林威呈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾健庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TZENG, JIANN-TYNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">積體電路裝置包含：第一主動區域結構堆疊，沿第一方向延伸且包含彼此堆疊的下部主動區域結構及上部主動區域結構；前側電力軌，在下部主動區域結構及上部主動區域結構上方的上部導電層中延伸；背側電力軌，在下部主動區域結構及上部主動區域結構下方的下部導電層中延伸；垂直電力線陣列，每一垂直電力線在不同於上部導電層及下部導電層的導電層中沿著垂直於第一方向的第二方向延伸；以及填充單元，位於兩個垂直電力線之間，具有第一主動區域結構堆疊的片段，且具有沿第三方向延伸並導電性地連接前側電力軌及背側電力軌的電力通孔連接器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated circuit device includes a first stack of active-region structures extending in a first direction and including a lower and upper active-region structures stacked with each other; a front-side power rail extending in an upper conductive layer above the lower and upper active-region structures; a back-side power rail extending in a lower conductive layer below the lower and upper active-region structures; an array of vertical power lines each extending in a second direction in a conductive layer different from the upper conductive layer and the lower conductive layer, the second direction being perpendicular to the first direction; and a filler cell having therein a segment of the first stack of active-region structures and having therein a power via-connector which extends in the third direction and conductively connects the front-side power rail with the back-side power rail, and wherein the filler cell is between two of the vertical power lines.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20B:電力軌/第一背側電力軌</p>
        <p type="p">20F:電力軌/第一前側電力軌</p>
        <p type="p">40B:電力軌/第二背側電力軌</p>
        <p type="p">40F:電力軌/第二前側電力軌</p>
        <p type="p">70A:第一垂直電力線</p>
        <p type="p">70B:第二垂直電力線</p>
        <p type="p">70C:第三垂直電力線</p>
        <p type="p">75A:第一電力分接結構區域</p>
        <p type="p">75B:第二電力分接結構區域</p>
        <p type="p">75C:第三電力分接結構區域</p>
        <p type="p">100:積體電路</p>
        <p type="p">101~107:邏輯電路單元</p>
        <p type="p">109:參考線</p>
        <p type="p">110A:第一列</p>
        <p type="p">110B:第二列</p>
        <p type="p">110C:第三列</p>
        <p type="p">181~187:填充單元</p>
        <p type="p">183bv:垂直單元邊界</p>
        <p type="p">P-P’,Q-Q’:線</p>
        <p type="p">X,Y:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="837" publication-number="202616880">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616880</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117235</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>堆疊電晶體及其形成方法</chinese-title>
        <english-title>STACKED TRANSISTORS AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251121B">H10D84/01</main-classification>
        <further-classification edition="202501120251121B">H10D84/83</further-classification>
        <further-classification edition="200601120251121B">B82B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊愷潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KAI-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳思樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SZU-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡旻昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MIN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫偉源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOON, WEI-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖　思雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">形成具有產生不同臨限電壓的不同功函數金屬層組合的互補式場效電晶體。一種方法包括以下步驟：在基板的第一區域上形成第一奈米結構；在基板的第二區域上形成第二奈米結構；在基板的第三區域上形成第三奈米結構；在第一奈米結構上沈積第一閘電極層；在第二奈米結構上及第一奈米結構上的第一閘電極層上沈積第二閘電極層；在第三奈米結構上、在第二奈米結構上的第二閘電極層上及在第一奈米結構上的第二閘電極層上沈積第三閘電極層；及在第三閘電極層上、在第一奈米結構上、在第二奈米結構上及在第三奈米結構上沈積第四閘電極層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Complementary Field-Effect Transistors (CFETs) are formed having different combinations of work function metal layers that produce different threshold voltages. A method includes forming first nanostructures over a first region of a substrate; forming second nanostructures over a second region of the substrate; forming third nanostructures over a third region of the substrate; depositing a first gate electrode layer on the first nanostructures; depositing a second gate electrode layer on the second nanostructures and on the first gate electrode layer on the first nanostructures; depositing a third gate electrode layer on the third nanostructures, on the second gate electrode layer on the second nanostructures, and on the second gate electrode layer on the first nanostructures; and depositing a fourth gate electrode layer on the third gate electrode layer, on the first nanostructures, on the second nanostructures, and on the third nanostructures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10A~10C:區域</p>
        <p type="p">20:基板</p>
        <p type="p">20':半導體條</p>
        <p type="p">26L:下半導體奈米結構</p>
        <p type="p">26U:上半導體奈米結構</p>
        <p type="p">32:STI區域</p>
        <p type="p">56:介電隔離層</p>
        <p type="p">78:閘極介電層</p>
        <p type="p">80:閘電極</p>
        <p type="p">80L、80L-A~80L-C:下閘電極</p>
        <p type="p">80U:上閘電極</p>
        <p type="p">90:閘極結構</p>
        <p type="p">210:第一下電極層</p>
        <p type="p">212:第二下電極層</p>
        <p type="p">214:第三下電極層</p>
        <p type="p">220:功函數調諧層</p>
        <p type="p">222:填充材料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="838" publication-number="202616353">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616353</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117271</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接合狀態檢查裝置以及接合狀態檢查方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H01L21/02</main-classification>
        <further-classification edition="200601120260109B">H01L21/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商邦德科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BONDTECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山內朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAUCHI, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">接合狀態檢查裝置(1)從至少一部分接合的兩個基板(W1、W2)的重疊方向連續檢測隨時間變化的兩個基板(W1、W2)的互相接合的部分與未接合的部分之間的邊界部分。接合狀態檢查裝置(1)包括：拍攝部(21)，拍攝包括刀片(121)的端緣的區域；邊界部分辨識部(919)，在刀片(121)插入於基板(W1、W2)之間的狀態下，藉由分析由拍攝部(21)拍攝的拍攝圖像，而辨識基板(W1、W2)的接合部分與非接合部分之間的邊界部分；以及接合強度計算部(913)，計算基板(W1、W2)的刀片(121)與邊界部分之間的非接合部分距離，並且基於計算出的非接合部分距離，而計算基板(W1、W2)的接合強度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:接合狀態檢查裝置</p>
        <p type="p">11:載台</p>
        <p type="p">11a:載置面</p>
        <p type="p">13:刀片驅動部</p>
        <p type="p">14:壓力感測器/旋轉驅動部</p>
        <p type="p">17:刀片升降驅動部</p>
        <p type="p">21:拍攝部</p>
        <p type="p">23:光源</p>
        <p type="p">90:控制部</p>
        <p type="p">95:操作部</p>
        <p type="p">121:刀片</p>
        <p type="p">122:刀片保持部</p>
        <p type="p">123:臂</p>
        <p type="p">131:滑塊驅動部</p>
        <p type="p">132:滑塊</p>
        <p type="p">161:腔室</p>
        <p type="p">162:氣體供給部</p>
        <p type="p">163:濕度感測器</p>
        <p type="p">241:反射板</p>
        <p type="p">242:光擴散板</p>
        <p type="p">AR1,AR2:箭頭</p>
        <p type="p">J1:旋轉軸</p>
        <p type="p">W1,W2:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="839" publication-number="202615730">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615730</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117276</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板液處理裝置、基板液處理方法及電腦可讀取記錄媒體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">C25D17/00</main-classification>
        <further-classification edition="200601120260112B">C25D7/12</further-classification>
        <further-classification edition="200601120260112B">C25D17/06</further-classification>
        <further-classification edition="200601120260112B">C25D17/08</further-classification>
        <further-classification edition="200601120260112B">C25D21/12</further-classification>
        <further-classification edition="200601120260112B">H01L21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白石豪介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRAISHI, GOUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>濵田正人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMADA, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山村健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMURA, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供有利於部分性調整被形成在基板上的鍍敷膜之厚度的技術。  &lt;br/&gt;　　[解決手段]基板液處理裝置具備：基板支持部；第1電極，其係與被支持於基板支持部的基板電性連接；蓋體，其係與基板面對面，在與該基板之間填充鍍敷液；第2電極，其係位於基板和蓋體之間，具有與第1電極不同的極性，蓋體之中與基板面對面之部分包含：第1蓋部分；和第2蓋部分，其係與第2電極之間的間隔小於第1蓋部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板液處理裝置</p>
        <p type="p">11:基板支持部</p>
        <p type="p">12:陰極</p>
        <p type="p">13:陽極</p>
        <p type="p">14:蓋體</p>
        <p type="p">14A:第1蓋部分</p>
        <p type="p">14B:第2蓋部分</p>
        <p type="p">22:鍍敷吐出部</p>
        <p type="p">23:陽極驅動單元</p>
        <p type="p">23B:陽極驅動支持部</p>
        <p type="p">D:陽極-蓋間隔</p>
        <p type="p">L:鍍敷液</p>
        <p type="p">W:基板</p>
        <p type="p">S:種子層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="840" publication-number="202616479">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616479</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117277</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接合設備、接合方法和製品製造方法</chinese-title>
        <english-title>BONDING APPARATUS, BONDING METHOD AND ARTICLE MANUFACTURING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H01L23/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森堅一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, KENICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三島和彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MISHIMA, KAZUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種接合設備實施將接合物件接合到接合目標物件的接合操作，包括：驅動單元，所述驅動單元配置成實施驅動，使得接合物件接合到接合目標物件；以及控制單元，所述控制單元配置成控制接合操作，使得在將接合物件接合到接合目標物件之後接合物件的接合形狀實現預定扭曲形狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bonding apparatus that performs a bonding operation of bonding a bonding object to a bonding target object, including a driving unit configured to perform driving such that the bonding object is bonded to the bonding target object, and a control unit configured to control the bonding operation such that a bonded shape of the bonding object after the bonding object is bonded to the bonding target object achieves a predetermined distortion shape.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基座</p>
        <p type="p">2:支架</p>
        <p type="p">3:拾取單元</p>
        <p type="p">4:接合單元</p>
        <p type="p">5:切割框架</p>
        <p type="p">6:晶圓</p>
        <p type="p">31:拾取頭</p>
        <p type="p">32:釋放頭</p>
        <p type="p">41:台基座</p>
        <p type="p">42:上基座</p>
        <p type="p">43:晶圓台</p>
        <p type="p">51:晶粒</p>
        <p type="p">421:晶圓觀察相機</p>
        <p type="p">422:干涉儀</p>
        <p type="p">423:接合頭</p>
        <p type="p">425:驅動機構</p>
        <p type="p">431:晶粒觀察相機</p>
        <p type="p">432:條形鏡</p>
        <p type="p">433:晶圓卡盤</p>
        <p type="p">436:驅動機構</p>
        <p type="p">BD:接合設備</p>
        <p type="p">CNT:控制單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="841" publication-number="202616459">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616459</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117283</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板固持裝置及接合系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H01L21/683</main-classification>
        <further-classification edition="200601120260112B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本田浩範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONDA, HIRONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種可穩定固持產生有翹曲之基板的技術。  &lt;br/&gt;依本發明之一態樣的基板固持裝置包含：本體部、流道及抽吸孔。本體部具有與圓板狀之基板相向的圓形之吸附面。流道係形成於從吸附面之中心區域延伸至吸附面之周緣區域的一對肋部彼此之間。抽吸孔係位於流道中的吸附面之中心區域側。又，藉由使一對肋部與基板接近或是接觸，而形成沿著流道從周緣區域往抽吸孔的氣流。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">230:上吸盤(基板固持裝置及第一固持部之一例)</p>
        <p type="p">240:本體部</p>
        <p type="p">241:吸附面</p>
        <p type="p">241a:中心區域</p>
        <p type="p">241b:周緣區域</p>
        <p type="p">242:流道</p>
        <p type="p">243:肋部</p>
        <p type="p">250:抽吸孔</p>
        <p type="p">252:穿通孔</p>
        <p type="p">252a:全周肋部</p>
        <p type="p">F:氣流</p>
        <p type="p">W1:上晶圓(基板及第一基板之一例)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="842" publication-number="202615694">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615694</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117333</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含矽複合顆粒的製備方法</chinese-title>
        <english-title>PROCESSES FOR THE PREPARATION OF SILICON-CONTAINING COMPOSITE PARTICLES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">C23C16/24</main-classification>
        <further-classification edition="200601120260109B">C23C16/04</further-classification>
        <further-classification edition="200601120260109B">H01M4/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商尼克席恩公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEXEON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅德拉諾　加泰隆尼亞　何塞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDRANO CATALAN, JOSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅森　查爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASON, CHARLES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於製備複合顆粒的方法，該方法包含下列步驟：(a)提供複數個多孔顆粒；(b)使該複數個多孔顆粒與矽前驅氣體在有效造成矽沉積在該等多孔顆粒之孔中的條件下接觸。步驟(b)含有啟動期及終止期中之至少一者，其中該矽前驅氣體的低流速係與該等多孔顆粒的總BET表面積成比例地維持。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a process for preparing composite particles, the process comprising the steps of: (a) providing a plurality of porous particles; (b) contacting the plurality of porous particles with a silicon precursor gas at conditions effective to cause deposition of silicon in the pores of the porous particles. Step (b) contains at least one of an initiation phase and a termination phase in which a low flow rate of the silicon precursor gas is maintained in proportion to the total BET surface area of the porous particles.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="843" publication-number="202616890">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616890</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117387</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於降低互補式場效電晶體摻雜偶極負載效應的方法</chinese-title>
        <english-title>METHOD OF DIPOLE DOPING FOR CFETS WITH REDUCED LOADING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251001B">H10D84/85</main-classification>
        <further-classification edition="202501120251001B">H10D84/01</further-classification>
        <further-classification edition="200601120251001B">H01L21/225</further-classification>
        <further-classification edition="200601120251001B">H01L21/324</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃翊帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YI-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王信智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HSIN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李心源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HSIN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈育佃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, YU-TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊智凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIH-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝銘峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIEH, MING-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本方法用以形成下部半導體奈米結構及上覆下部半導體奈米結構的上部半導體奈米結構；在下部半導體奈米結構及上部半導體奈米結構上分別形成上部閘極介電質及下部閘極介電質；塗佈定向自組裝材料以將下部半導體奈米結構及上部半導體奈米結構嵌入於定向自組裝材料中；及使定向自組裝材料退火以形成多個虛設填充區。虛設填充區包括交替定位的第一複數個層及第二複數個層。使虛設填充區凹入，使得虛設填充區的剩餘部分包括低於上部半導體奈米結構的頂表面。偶極摻雜劑摻雜至上部閘極介電質及下部閘極介電質中的一者中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes forming a lower semiconductor nanostructure and an upper semiconductor nanostructure overlying the lower semiconductor nanostructure, forming an upper gate dielectric and a lower gate dielectric on the lower semiconductor nanostructure and the upper semiconductor nanostructure, respectively, dispensing a directed self-assembly material to embed the lower semiconductor nanostructure and the upper semiconductor nanostructure therein, and annealing the directed self-assembly material to form dummy filling-regions. The dummy filling-regions include a first plurality of layers and a second plurality of layers located alternatingly. The dummy filling-regions are recessed, so that remaining portions of the dummy filling-regions include top surfaces lower than the upper semiconductor nanostructure. A dipole dopant is doped into one of the upper gate dielectric and the lower gate dielectric.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20’:半導體條帶</p>
        <p type="p">26’L:下部半導體奈米結構</p>
        <p type="p">26’M:中間半導體奈米結構</p>
        <p type="p">26’U:上部半導體奈米結構</p>
        <p type="p">32:隔離區</p>
        <p type="p">56:介電隔離層</p>
        <p type="p">78:閘極介電質</p>
        <p type="p">78IL:介面層</p>
        <p type="p">78HK:高k介電層</p>
        <p type="p">82:偶極膜</p>
        <p type="p">84:虛設填充區</p>
        <p type="p">86:退火製程</p>
        <p type="p">100A:裝置區</p>
        <p type="p">100B:裝置區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="844" publication-number="202615236">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615236</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117421</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂成形裝置以及樹脂成形品的製造方法</chinese-title>
        <english-title>RESIN MOLDING DEVICE AND METHOD FOR MANUFACTURING RESIN MOLDED PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">B29C43/58</main-classification>
        <further-classification edition="200601120260112B">B29C33/34</further-classification>
        <further-classification edition="200601120260112B">B29C43/04</further-classification>
        <further-classification edition="200601120260112B">B29C43/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＯＷＡ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOWA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林幸佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>八木隆太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAGI, RYUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明防止滑動至壓製部的外部的成形模的溫度降低，包括：成形模14，以能夠滑動至壓製部15的外部的方式設置；加熱部21、加熱部22，對滑動至壓製部15的外部的成形模14進行加熱；及溫度控制部3，控制加熱部21、加熱部22，對滑動至壓製部15的外部的成形模14的溫度降低進行補償。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention prevents a drop in temperature of a molding die that has slid outside a pressing part, and comprises: a molding die 14 slidably arranged outside the pressing part 15; heating parts 21, 22 that heat the molding die 14 that has slid outside the pressing part 15; and a temperature control part 3 that controls the heating parts 21, 22 to compensate for the drop in temperature of the molding die 14 that has slid outside the pressing part 15.</p>
      </isu-abst>
      <representative-img>
        <p type="p">14:成形模</p>
        <p type="p">15:壓製部</p>
        <p type="p">21、22:加熱部</p>
        <p type="p">41、42:溫度感測器</p>
        <p type="p">141:上模</p>
        <p type="p">141a、142a:模腔塊</p>
        <p type="p">141b、142b:加熱用板</p>
        <p type="p">141c、142c:底板</p>
        <p type="p">141d、142d:密閉結構</p>
        <p type="p">142:下模</p>
        <p type="p">142a1:底面塊</p>
        <p type="p">142a2:側面塊</p>
        <p type="p">142a3:彈性構件</p>
        <p type="p">142C:模腔</p>
        <p type="p">151:固定壓板(基底構件)</p>
        <p type="p">152:可動壓板(基底構件)</p>
        <p type="p">153:鎖模機構</p>
        <p type="p">154、155:側壁構件</p>
        <p type="p">F:脫模膜</p>
        <p type="p">W:成形前基板(成形對象物)</p>
        <p type="p">Wx:電子零件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="845" publication-number="202615638">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615638</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117446</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>混合氣體之製造方法及混合氣體之供給方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C10L3/00</main-classification>
        <further-classification edition="200601120260102B">F23K5/00</further-classification>
        <further-classification edition="200601120260102B">F23N1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JFE STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明所提供的混合氣體之製造方法，係在煉鐵廠中被製造且當作燃料被消耗的混合氣體，即使減少焦炭爐氣體產生量的情形，仍可使用適於習知混合氣體的現有設備而未更新照原樣繼續使用者。其將在煉鐵廠中所產生之副產氣體的第1氣體、表示排出熱量之指數A高於焦炭爐氣體的第2氣體、以及表示燃燒速度之指數B高於焦炭爐氣體的第3氣體予以混合。較佳係更進一步混合超過0 vol%且未滿50 vol%的焦炭爐氣體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">BL:鼓風機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="846" publication-number="202616460">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616460</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117449</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體製造裝置用構件</chinese-title>
        <english-title>COMPONENT FOR SEMICONDUCTOR MANUFACTURING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H01L21/683</main-classification>
        <further-classification edition="200601120260112B">C04B35/582</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本碍子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGK INSULATORS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溝口智久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZOGUCHI,TOMOHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山名啓太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMANA, KEITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>昇和宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOBORI, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後藤義信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTO, YOSHINOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種具備導電率的均勻性優異的導電體之半導體製造裝置用構件。  &lt;br/&gt;本發明之實施態樣的半導體製造裝置用構件具備有：陶瓷基材、和導電體。該導電體係設置於該陶瓷基材內。該陶瓷基材係含有熱膨脹係數為2.0×10&lt;sup&gt;-6&lt;/sup&gt;/°C~ 10.0×10&lt;sup&gt;-6&lt;/sup&gt;/°C之陶瓷材料、和尖晶石。該導電體具有包含尖晶石之表層、和位於該表層內側之骨架。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide a component for a semiconductor manufacturing device that comprises a conductor having excellent uniformity of electrical conductivity. The component for a semiconductor manufacturing device according to one embodiment of the invention comprises a ceramic base material and a conductor. The conductor is provided inside the ceramic base material. The ceramic base material contains a ceramic material having a coefficient of thermal expansion within a range from 2.0×10&lt;sup&gt;-6&lt;/sup&gt;/°C to 10.0×10&lt;sup&gt;-6&lt;/sup&gt;/°C, and a spinel. The conductor has a surface layer containing a spinel, and a skeleton positioned inward of the surface layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:陶瓷基材</p>
        <p type="p">1a:載置面</p>
        <p type="p">2:導電體</p>
        <p type="p">2a:電阻發熱體</p>
        <p type="p">2b:ESC電極</p>
        <p type="p">5:陶瓷軸</p>
        <p type="p">6:第1供電桿</p>
        <p type="p">7:第2供電桿</p>
        <p type="p">8:半導體基板</p>
        <p type="p">21:表層</p>
        <p type="p">22:骨架</p>
        <p type="p">100:半導體製造裝置用構件</p>
        <p type="p">101:加熱器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="847" publication-number="202616755">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616755</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117466</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於WI-FI中穿孔通道中分佈式資源單元之資源分配之方法、流程及設備</chinese-title>
        <english-title>METHODS, PROCEDURES AND APPARATUS FOR RESOURCE ALLOCATION OF DISTRIBUTED RESOURCE UNITS IN PUNCTURED CHANNELS IN WI-FI</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260109B">H04W72/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商內數位專利控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERDIGITAL PATENT HOLDINGS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩阿德　默罕默德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAAD, MAHMOUD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樓　漢卿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOU, HANQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　陸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一實例中，一站台(station；STA)自一存取點(AP)接收具有指示一分佈式資源單元(RU) (DRU)索引值之一RU分配欄位之一觸發訊框。此外，該STA基於該所指示之DRU索引值自複數個DRU分配判定一DRU分配。該複數個DRU分配之各者包含一各自載頻調分佈計劃。此外，該經判定DRU分配及該各自載頻調分佈計劃之載頻調與該複數個載頻調分佈計劃之一或多個其他載頻調分佈計劃之載頻調跨一分佈頻寬交錯。接著，該STA基於該經判定DRU分配及該各自載頻調分佈計劃，使用該分佈頻寬內之一DRU向該AP傳輸複數個載頻調。在一進一步實例中，該觸發訊框可包含指示該分佈頻寬之資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In an example, a station (STA) receives, from an access point (AP), a trigger frame with a resource unit (RU) allocation field indicating a distributed RU (DRU) index value. Further, the STA determines, based on the indicated DRU index value, a DRU allocation from a plurality of DRU allocations. Each of the plurality of DRU allocations includes a respective tone distribution plan. Further, tones of the determined DRU allocation and the respective tone distribution plan are interleaved with tones of one or more other tone distribution plans, of the plurality of tone distribution plans, across a distribution bandwidth. The STA then transmits, to the AP, a plurality of tones using a DRU within the distribution bandwidth, based on the determined DRU allocation and the respective tone distribution plan. In a further example, the trigger frame may include information indicating the distribution bandwidth.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1100:表圖</p>
        <p type="p">1110:穿孔圖案</p>
        <p type="p">1120:穿孔圖案</p>
        <p type="p">1130:穿孔圖案</p>
        <p type="p">1140:穿孔圖案</p>
        <p type="p">1150:穿孔圖案</p>
        <p type="p">1160:穿孔圖案</p>
        <p type="p">1170:穿孔圖案</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="848" publication-number="202616735">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616735</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117484</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>直播串流的音訊控制</chinese-title>
        <english-title>AUDIO CONTROL FOR LIVE STREAMING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H04R3/04</main-classification>
        <further-classification edition="200601120260109B">G06F3/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅斯　麥克約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROSS, MICHAEL JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅斯　麥克約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROSS, MICHAEL JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種DCP伺服器，其係與影院處理器一起使用，以用於自諸如音樂會之類的場所播放高品質直播串流內容，並且將其分配用於在電影院中播放。該DCP伺服器將電影院中之揚聲器的音量及等化輸出自動地調整至工業標準，且控制影院處理器之音量設定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A DCP server for use with a cinema processor for playing high quality live streaming content from a venue, such as a concert, and distributing it for playing in a movie theater is disclosed. The DCP server automatically adjusts the volume and the equalization outputs of the speakers in the movie theater to the industry standard and controls the volume setting of the cinema processor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電影院</p>
        <p type="p">102:DCP伺服器</p>
        <p type="p">104:投影機</p>
        <p type="p">106:影院處理器</p>
        <p type="p">108:揚聲器</p>
        <p type="p">110:視訊輸出</p>
        <p type="p">112:音訊輸出</p>
        <p type="p">200:串流數位影院處理器；串流DCP伺服器</p>
        <p type="p">202:網際網路；CPU；音訊校準模組</p>
        <p type="p">206:音訊輸出</p>
        <p type="p">208:音量控制信號；乙太網路連接</p>
        <p type="p">210:MEMS麥克風</p>
        <p type="p">212:Wi-Fi</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="849" publication-number="202616332">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616332</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117490</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電漿製程使用副產物濃度的再循環控制</chinese-title>
        <english-title>RECIRCULATION CONTROL FOR A PLASMA PROCESS USING A BYPRODUCT CONCENTRATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01J37/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾亞拉索瑪亞朱拉　尼拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AYALASOMAYAJULA, NEELA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬柏　納斯林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOPRA, NASREEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納丁帕利　納迦拉維庫馬爾瓦爾瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NADIMPALLI, NAGA RAVIKUMAR VARMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏爾馬　維賈伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHARMA, VIJAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔帕西　維傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRIPATHI, VIJAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錢德蘭　格琵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANDRAN, GOPI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種系統包括遠端電漿源、處理腔室、連接到處理腔室的排氣線、連接到處理腔室的再循環線，以及用於量測處理腔室排氣中副產物（如四氟化矽）濃度的感測器。該系統還包括控制器，該控制器根據處理腔室排氣中副產物的量測濃度，通過排氣線或再循環線釋放處理腔室的排氣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system includes a remote plasma source, a process chamber, an exhaust line connected to the process chamber, a recirculation line connected to the process chamber, and a sensor to measure a concentration of a byproduct, such as silicon tetrafluoride, in an exhaust of the processing chamber. The system also includes a controller to release the exhaust of the processing chamber through the exhaust line or the recirculation line based on the measured concentration of the byproduct in exhaust of the process chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:製造系統</p>
        <p type="p">101:處理腔室</p>
        <p type="p">102:腔室主體</p>
        <p type="p">104:蓋</p>
        <p type="p">105:氣源</p>
        <p type="p">106:內部體積</p>
        <p type="p">108:側壁</p>
        <p type="p">110:底部</p>
        <p type="p">116:外襯墊</p>
        <p type="p">126:排氣線</p>
        <p type="p">128:泵系統</p>
        <p type="p">130:氣體分配組件</p>
        <p type="p">132:孔</p>
        <p type="p">133:氣體輸送線</p>
        <p type="p">134:電漿輸送線</p>
        <p type="p">135:感測器</p>
        <p type="p">136:電極</p>
        <p type="p">144:基板</p>
        <p type="p">146:保護環</p>
        <p type="p">149:氣體出口</p>
        <p type="p">150:基板支撐組件</p>
        <p type="p">151:再循環線</p>
        <p type="p">152:支撐座</p>
        <p type="p">158:電漿源</p>
        <p type="p">166:圓盤</p>
        <p type="p">178:加熱器電源</p>
        <p type="p">182:吸附電源</p>
        <p type="p">188:控制器</p>
        <p type="p">192:氣體分配盤</p>
        <p type="p">194:過濾器</p>
        <p type="p">196:減弱裝置</p>
        <p type="p">197:質量流量感測器</p>
        <p type="p">197A-B:雙閥組件</p>
        <p type="p">198:感測器</p>
        <p type="p">199:電源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="850" publication-number="202616271">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616271</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117511</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>來源控制的可變長度音訊編碼器</chinese-title>
        <english-title>SOURCE-CONTROLLED VARIABLE-LENGTH AUDIO ENCODER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260109B">G10L19/16</main-classification>
        <further-classification edition="201301120260109B">G10L19/22</further-classification>
        <further-classification edition="201301120260109B">G10L19/005</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉馬達斯　普拉文庫馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMADAS, PRAVIN KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索蒂埃　吉廉康拉德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAUTIERE, GUILLAUME KONRAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯科迪利斯　齊西斯艾森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SKORDILIS, ZISIS IASON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉金德蘭　維維克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAJENDRAN, VIVEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種裝置包括一記憶體，其經組態以儲存音訊資料；及一或多個處理器，其經組態以基於與該音訊資料之二或更多個序列訊框相關聯的一或多個相似性度量來判定待編碼的該音訊資料之一訊框群組。該一或多個處理器亦經組態以聯合編碼該訊框群組以產生經編碼訊框資料。該一或多個處理器亦經組態以產生包括該經編碼訊框資料的一封包。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device includes a memory configured to store audio data and one or more processors configured to determine, based on one or more similarity metrics associated with two or more sequential frames of the audio data, a group of frames of the audio data to encode. The one or more processors are also configured to encode the group of frames jointly to generate encoded frame data. The one or more processors are also configured to generate a packet including the encoded frame data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">102:裝置</p>
        <p type="p">120:麥克風</p>
        <p type="p">122:音訊資料</p>
        <p type="p">124:天線</p>
        <p type="p">126:通道資料</p>
        <p type="p">140:來源控制的編碼器</p>
        <p type="p">142:組態選擇器</p>
        <p type="p">144:聯合編碼參數</p>
        <p type="p">146:訊框選擇器</p>
        <p type="p">148:編碼器選擇器</p>
        <p type="p">150:經選擇的訊框</p>
        <p type="p">152,152A,152M:音訊編碼器</p>
        <p type="p">160:遠端裝置</p>
        <p type="p">162:封包</p>
        <p type="p">164:通訊通道</p>
        <p type="p">170:數據機</p>
        <p type="p">172:收發器</p>
        <p type="p">180:記憶體</p>
        <p type="p">190:處理器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="851" publication-number="202616893">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616893</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117611</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路裝置、產生積體電路佈局圖及製造積體電路裝置的方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT (IC) DEVICE AND METHOD FOR GENERATING IC LAYOUT AND MANUFACTURING IC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251103B">H10D89/10</main-classification>
        <further-classification edition="202001120251103B">G06F30/392</further-classification>
        <further-classification edition="202001320251103B">G06F113/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林威呈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾健庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TZENG, JIANN-TYNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種IC裝置包括：隔離結構，沿半導體基板的前側的第一方向在兩個位置之間延伸；電晶體，包括在該兩個位置之間延伸的閘極及MD段，閘極及MD段為沿第二方向位於該兩個位置之間及該些隔離結構之間的整個閘極及MD段；前側閘極通孔，作為電連接至該些閘極的整個前側閘極通孔；及前側S/D通孔，作為電連接至MD段的整個前側S/D通孔。所有前側閘極通孔位於第一至第三層軌道中的第一及/或第二軌道的位置，第一至第三層軌道沿該第二方向延伸且作為位於兩個位置之間的整個最下部前側金屬層軌道，且所有前側S/D通孔位於第二及/或第三軌道的位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An IC device includes isolation structures extending between two locations along a first direction in a front side of a semiconductor substrate, transistors including gates and MD segments extending between the two locations and being entireties of gates and MD segments positioned between the two locations and between the isolation structures in a second direction, frontside gate vias being an entirety of frontside gate vias electrically connected to the gates, and frontside S/D vias being an entirety of frontside S/D vias electrically connected to the MD segments. All of the frontside gate vias are positioned at locations of first and/or second tracks of first through third layer tracks extending in the second direction and being an entirety of lowermost frontside metal layer tracks positioned between the two locations, and all of the frontside S/D vias are positioned at locations of the second and/or third tracks.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:佈局圖</p>
        <p type="p">BB:底部邊界</p>
        <p type="p">BM0:背側金屬區域/段</p>
        <p type="p">BVD、BVG、VD、VG:通孔區域/結構</p>
        <p type="p">C1、C2:單元</p>
        <p type="p">CB:單元邊界</p>
        <p type="p">CH:單元高度</p>
        <p type="p">CMD:切割MD區域</p>
        <p type="p">CPO:切割閘極區域</p>
        <p type="p">G:閘極</p>
        <p type="p">ISO:隔離區域/結構</p>
        <p type="p">M0:前側金屬區域/段</p>
        <p type="p">PR1~PR3:電力軌</p>
        <p type="p">SB:側邊界</p>
        <p type="p">T1~T6:軌道</p>
        <p type="p">TB:頂部邊界</p>
        <p type="p">TP:節距</p>
        <p type="p">WCMD、WCPO:寬度</p>
        <p type="p">X1、X2:電晶體</p>
        <p type="p">X、Y:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="852" publication-number="202615700">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615700</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117663</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於在處理腔室中聚焦能量的反射器配置以及相關的腔室套組和方法</chinese-title>
        <english-title>REFLECTOR CONFIGURATIONS FOR ENERGY FOCUSING IN PROCESSING CHAMBERS, AND RELATED CHAMBER KITS AND METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C23C16/44</main-classification>
        <further-classification edition="200601120260102B">C23C16/46</further-classification>
        <further-classification edition="200601120260102B">C23C16/48</further-classification>
        <further-classification edition="200601120260102B">C30B25/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕蒂爾　阿尼克尼汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATIL, ANIKETNITIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱　作明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, ZUOMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例涉及用於處理腔室的反射器配置，以及相關的腔室套組和方法。在一或多個實施例中，一種適用於半導體製造的處理腔室包含安置在處理空間中的基板支撐，以及被定向以將能量朝向處理空間反射的反射器。該反射器包含一或多個凹入表面，以及曲面外表面。該曲面外表面包含第一部分，相對於一或多個凹入表面徑向向外延伸，及第二部分，相對於第一部分徑向向外延伸。第一部分具有第一曲率半徑，且第二部分具有第二曲率半徑。該曲面外表面包含第三部分，相對於第二部分徑向向外延伸。第三部分的曲率半徑大於第二曲率半徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure relate to reflector configurations for processing chambers, and related chamber kits and methods. In one or more embodiments, a processing chamber applicable for semiconductor manufacturing includes a substrate support disposed in a processing volume, and a reflector oriented to reflect energy toward the processing volume. The reflector includes one or more recessed surfaces, and a curved outer surface. The curved outer surface includes a first section extending radially outwardly relative to the one or more recessed surfaces, and a second section extending radially outwardly relative to the first section. The first section has a first radius of curvature, and the second section has a second radius of curvature. The curved outer surface includes a third section extending radially outwardly relative to the second section. The third section has a third radius of curvature larger than the second radius of curvature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">187:內部板</p>
        <p type="p">188:不透明支撐</p>
        <p type="p">401:反射器</p>
        <p type="p">415:曲面外表面</p>
        <p type="p">416:第一部分</p>
        <p type="p">417:第二部分</p>
        <p type="p">418:第三部分</p>
        <p type="p">419:第四部分</p>
        <p type="p">421:外端</p>
        <p type="p">423:橢圓形狀</p>
        <p type="p">451:護罩</p>
        <p type="p">452:凸緣</p>
        <p type="p">453:內表面</p>
        <p type="p">458:第一端</p>
        <p type="p">459:第二端</p>
        <p type="p">A1:方位角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="853" publication-number="202616390">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616390</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117675</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在奈米片架構中形成SIGE通道的整合製程</chinese-title>
        <english-title>INTEGRATED PROCESS FOR FORMING SIGE CHANNEL IN NANOSHEET ARCHITECTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/324</main-classification>
        <further-classification edition="202501120260102B">H10D30/01</further-classification>
        <further-classification edition="202501120260102B">H10D30/67</further-classification>
        <further-classification edition="202501120260102B">H10D62/10</further-classification>
        <further-classification edition="202501120260102B">H10D62/832</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝帕德二世　約瑟夫法蘭西斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEPARD JR., JOSEPH FRANCIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫布勒　莉迪亞簡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUEBLER, LYDIA JANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋爾　拉曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAIRE, RAMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏　燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露描述了具有奈米片架構的半導體裝置，該奈米片架構例如水平閘極全環繞（hGAA）結構的電晶體；以及形成此類半導體裝置的方法和設備。方法包括：在第一複數個奈米片中每一者周圍形成包覆材料；將包覆材料的一部分進行氧化，以形成包覆材料周圍的氧化物膜，例如氧化矽（SiO&lt;sub&gt;2&lt;/sub&gt;）膜，並形成第二複數個奈米片；在低於或等於850°C的溫度下對第二複數個奈米片進行退火；以及去除氧化物膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Semiconductor devices having nanosheet architectures, e.g., transistors such as horizontal gate-all-around (hGAA) structures, methods, and apparatuses for forming such semiconductor devices are described. The methods comprise forming a cladding material around each of a first plurality of nanosheets; oxidizing a portion of the cladding material to form an oxidize film, such as a silicon oxide (SiO&lt;sub&gt;2&lt;/sub&gt;) film, around the cladding material and a form a second plurality of nanosheets; annealing the second plurality of nanosheets at a temperature of less than or equal to 850 °C; and removing the oxide film.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:方法</p>
        <p type="p">12:操作</p>
        <p type="p">14:操作</p>
        <p type="p">16:操作</p>
        <p type="p">18:操作</p>
        <p type="p">20:操作</p>
        <p type="p">22:操作</p>
        <p type="p">24:操作</p>
        <p type="p">26:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="854" publication-number="202615716">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615716</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117684</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電力傳送系統及電力傳送方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">C23C16/505</main-classification>
        <further-classification edition="200601120260107B">H01L21/3065</further-classification>
        <further-classification edition="200601120260107B">H01L21/31</further-classification>
        <further-classification edition="201601120260107B">H02J50/12</further-classification>
        <further-classification edition="201601120260107B">H02J50/40</further-classification>
        <further-classification edition="200601120260107B">H05H1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大和田伸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOWADA, SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金子和史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEKO, KAZUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川上聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAKAMI, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松隈正明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUKUMA, MASAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之電力傳送系統具有送電單元及受電單元。送電單元具備包含線圈之驅動電路，產生電磁波並將其自線圈放射。受電單元係以與送電單元之間隔著介電板且與介電板分離之方式配置，且具備共振器陣列構造體，該共振器陣列構造體係由能與電磁波之磁場分量共振且尺寸較電磁波之波長小之複數個共振器排列而形成。線圈和介電板與共振器陣列構造體之第1面之間之第1空間藉由利用磁場所形成之第1耦合而耦合，且與第1耦合串聯地連接有第1負載。線圈和共振器陣列構造體係使磁場於第1空間內傳送，從而藉由第2耦合而耦合。共振器陣列構造體和與共振器陣列構造體之第2面相接之第2空間藉由利用磁場所形成之第3耦合而耦合，且與第3耦合串聯地連接有第2負載。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電漿處理裝置</p>
        <p type="p">10:裝置本體</p>
        <p type="p">11:控制裝置</p>
        <p type="p">12:處理容器</p>
        <p type="p">12a:側壁</p>
        <p type="p">12b:底部</p>
        <p type="p">12c:開口</p>
        <p type="p">12h:排氣口</p>
        <p type="p">13:中央氣體注入部</p>
        <p type="p">13a:氣體供給口</p>
        <p type="p">13b:氣體流路</p>
        <p type="p">13c:氣體導入口</p>
        <p type="p">14:載台</p>
        <p type="p">14a:基台</p>
        <p type="p">14b:邊緣環</p>
        <p type="p">14c:靜電吸盤</p>
        <p type="p">14d:電極</p>
        <p type="p">14e,14f:絕緣膜(介電膜)</p>
        <p type="p">14g:流路</p>
        <p type="p">16:RF電源</p>
        <p type="p">20:介電窗</p>
        <p type="p">20a:下表面</p>
        <p type="p">22:支持構件</p>
        <p type="p">30:天線</p>
        <p type="p">38:氣體供給部</p>
        <p type="p">38a:氣源</p>
        <p type="p">38b:流量控制器</p>
        <p type="p">48,50:筒狀支持部</p>
        <p type="p">51:排氣路徑</p>
        <p type="p">52:擋板</p>
        <p type="p">54:排氣管</p>
        <p type="p">56:排氣裝置</p>
        <p type="p">58:高頻電源</p>
        <p type="p">60:匹配單元</p>
        <p type="p">62:饋電棒</p>
        <p type="p">64:直流電源</p>
        <p type="p">66:開關</p>
        <p type="p">68:被覆線</p>
        <p type="p">70,72,74:配管</p>
        <p type="p">100:共振器陣列構造體</p>
        <p type="p">G:閘閥</p>
        <p type="p">S1,S2:空間</p>
        <p type="p">WP:基板</p>
        <p type="p">Z:軸線</p>
        <p type="p">δ&lt;sub&gt;S1&lt;/sub&gt;,δ&lt;sub&gt;S2&lt;/sub&gt;:區間距離</p>
        <p type="p">δ&lt;sub&gt;t&lt;/sub&gt;:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="855" publication-number="202616188">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616188</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117696</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於生成式人工智慧／機器學習（ＡＩ／ＭＬ）模型的廣告匹配</chinese-title>
        <english-title>ADVERTISEMENT MATCHING FOR GENERATIVE ARTIFICIAL INTELLIGENCE/MACHINE LEARNING (AI/ML) MODELS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260109B">G06Q30/0241</main-classification>
        <further-classification edition="202401120260109B">G06T5/77</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔凡羅　麥克法蘭柯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAVEIRA, MICHAEL FRANCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古普塔　維克倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUPTA, VIKRAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種設備具有一或多個記憶體及耦接至該記憶體的一或多個處理器。該（等）處理器經組態以接收至一生成式人工智慧/機器學習(AI/ML)模型的一文字輸入。該（等）處理器亦經組態以使用該生成式AI/ML模型來基於該文字輸入生成一文字輸出。該（等）處理器進一步經組態以判定與該文字輸入及/或該文字輸出相關的一廣告。該（等）處理器經更進一步組態以使用該廣告來修改該文字輸入及/或該文字輸出。該（等）處理器亦經組態以藉由針對該文字輸入及/或該文字輸出的經選擇文字生成該廣告，以在接收該文字輸入時及/或在生成該文字輸出時顯示該廣告。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus has one or more memories and one or more processors coupled to the memory. The processor(s) is configured to receive a text input to a generative artificial intelligence/machine learning (AI/ML) model. The processor(s) is also configured to generate, with the generative AI/ML model, a text output based on the text input. The processor(s) is further configured to determine an advertisement related to the text input and/or the text output. The processor(s) is still further configured to modify the text input and/or the text output with the advertisement. The processor(s) is also configured to display the advertisement while receiving the text input and/or while generating the text output by generating the advertisement for selected text of the text input and/or the text output.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:實例</p>
        <p type="p">502:使用者</p>
        <p type="p">504:生成式AI系統</p>
        <p type="p">506:回應</p>
        <p type="p">508:提示</p>
        <p type="p">510:廣告</p>
        <p type="p">512:橫幅廣告</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="856" publication-number="202616639">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616639</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117723</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>馬達控制系統、機器人系統及馬達控制方法</chinese-title>
        <english-title>MOTOR CONTROL SYSTEM, ROBOT SYSTEM, AND MOTOR CONTROL METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H02P23/14</main-classification>
        <further-classification edition="200601120260109B">B25J13/08</further-classification>
        <further-classification edition="200601120260109B">G05D3/12</further-classification>
        <further-classification edition="200601120260109B">H01L21/677</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商川崎重工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤修大朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, SHUTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大月智史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKI, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島健一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKASHIMA, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的機器人系統(100)係藉由使用表示馬達的驅動狀態的反饋值(FB)的反饋控制，使動作對象動作，並且根據有別於反饋值(FB)取得的姿勢資訊(y&lt;sub&gt;ini&lt;/sub&gt;)，藉由設定反饋控制中的控制參數(ρ)的資料驅動型控制，進行調整控制參數(ρ)的調整動作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A robot system (100) according to the present invention operates an object by feedback control that uses a feedback value (FB) indicative of the driving state of a motor, and performs an adjustment operation, based on posture information (Y&lt;sub&gt;ini&lt;/sub&gt;) acquired separately from the feedback value (FB), to adjust a control parameter (ρ) by data-driven control that sets the control parameter (ρ) in the feedback control.</p>
      </isu-abst>
      <representative-img>
        <p type="p">FB:反饋值</p>
        <p type="p">rf(ρ):擬似參考輸入</p>
        <p type="p">T&lt;sub&gt;d&lt;/sub&gt;:響應特性</p>
        <p type="p">u&lt;sub&gt;ini&lt;/sub&gt;:操作量</p>
        <p type="p">y&lt;sub&gt;ini&lt;/sub&gt;:姿勢資訊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="857" publication-number="202615825">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615825</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117745</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光子計算</chinese-title>
        <english-title>PHOTONIC COMPUTING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">G01J1/44</main-classification>
        <further-classification edition="200601120260109B">G06E1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商光程研創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARTILUX, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>那允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NA, NEIL Y.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝議緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIEH, ANDREW I.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林崇致</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUNG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧彥丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於光子計算之方法、電路、裝置、系統及技術。在一個態樣中，一種方法包括：使用複數個光偵測器偵測至少一個經調變光學信號，至少一個經調變光學信號表示一數學函數之一輸入矩陣之一或多個輸入元素，複數個光偵測器係基於數學函數之一權重矩陣之權重元素而調變；及使用一控制電路基於複數個光偵測器之輸出而產生電輸出，該等電輸出表示對應於輸入矩陣與權重矩陣之一乘積的數學函數之一計算結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods, circuits, devices, systems and techniques for photonic computing are provided. In one aspect, a method includes: detecting at least one modulated optical signal using a plurality of photodetectors, the at least one modulated optical signal representing one or more input elements of an input matrix of a mathematical function, the plurality of photodetectors being modulated based on weight elements of a weight matrix of the mathematical function; and generating electrical outputs based on outputs of the plurality of photodetectors using a control circuitry, the electrical outputs representing a computation result of the mathematical function corresponding to a multiplication of the input matrix and the weight matrix.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:光子系統/光子計算系統</p>
        <p type="p">401:輸入光學信號</p>
        <p type="p">402-1:光偵測器</p>
        <p type="p">402-2:光偵測器</p>
        <p type="p">402-M:光偵測器</p>
        <p type="p">403:電資料/信號</p>
        <p type="p">404:控制電路</p>
        <p type="p">405:電資料/信號</p>
        <p type="p">406:強度調變器/第一強度調變器</p>
        <p type="p">408:分光器</p>
        <p type="p">410-1:權重調變器</p>
        <p type="p">410-2:權重調變器</p>
        <p type="p">410-M:權重調變器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="858" publication-number="202616333">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616333</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117830</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用電感式耦合電漿諧振器源的方法及設備</chinese-title>
        <english-title>METHODS AND APPARATUS THAT USE INDUCTIVELY COUPLED PLASMA RESONATOR SOURCES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01J37/32</main-classification>
        <further-classification edition="200601120260102B">H01G17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣志敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, ZHIMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雨暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YUHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>席門瑞　費南多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILVEIRA, FERNANDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉馬斯瓦米　卡堤克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMASWAMY, KARTIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中提供了一種用於在處理腔室中以電感方式產生電漿的設備，該設備包括閉環系列電感/電容（LC）線圈網路，該網路包括複數個LC部分並具有由該複數個LC部分的總電感和電容限定的共振頻率，使得當RF功率被施加到該閉環系列電感/電容（LC）線圈網路時，會在該閉環系列電感/電容（LC）線圈網路中產生共振電流，以在處理腔室中以電感方式產生並維持電漿。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus for generating plasma inductively in a process chamber is provided herein and comprises a closed-loop series inductor/capacitor (LC) coil network comprising a plurality of LC sections and having a resonant frequency defined by a total inductance and a capacitance of the plurality of LC sections such that when RF power is applied to the closed-loop series inductor/capacitor (LC) coil network a resonant electrical current is generated in the closed-loop series inductor/capacitor (LC) coil network to inductively generate and sustain plasma in the process chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:ICP處理腔室</p>
        <p type="p">102:腔室主體</p>
        <p type="p">104:腔室蓋子</p>
        <p type="p">106:基板支撐件</p>
        <p type="p">108:製程體積</p>
        <p type="p">110:電漿</p>
        <p type="p">112:徑向線圈網路</p>
        <p type="p">114:第一接地</p>
        <p type="p">116:第二接地</p>
        <p type="p">118:第一匹配網路</p>
        <p type="p">120:閉環系列電感/電容(LC)線圈網路</p>
        <p type="p">122:第一RF電源</p>
        <p type="p">124:第二RF電源</p>
        <p type="p">126:基板</p>
        <p type="p">132:CPU(中央處理單元)</p>
        <p type="p">134:記憶體</p>
        <p type="p">136:支援電路</p>
        <p type="p">138:控制器</p>
        <p type="p">140:ICP源</p>
        <p type="p">142:氣體供應</p>
        <p type="p">144:中心餽送設備</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="859" publication-number="202616259">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616259</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117868</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>彩色電泳顯示裝置中灰階分量置換之方法及系統</chinese-title>
        <english-title>METHODS AND SYSTEMS FOR GRAY COMPONENT REPLACEMENT IN COLOR ELECTROPHORETIC DISPLAY DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G09G3/34</main-classification>
        <further-classification edition="200601120260102B">G09G3/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商電子墨水股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>E INK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甘　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAMM, BRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於驅動彩色電泳顯示器之方法，包括接收RGB輸入彩色影像；將RGB彩色影像映射至藉由電泳色域所界定的電泳目的地空間，以生成彩色目的地空間影像；抖動此彩色目的地空間影像以生成經抖動之彩色影像；識別經抖動之彩色影像的中性部分；將RGB彩色影像轉換為黑白影像；將黑白影像映射至黑白電泳目的地空間，以生成黑白目的地空間影像；抖動黑白目的地空間影像以生成經抖動之黑白影像；藉由用經抖動之黑白影像之對應部分置換經抖動之彩色影像之中性部分來合併經抖動之彩色影像及經抖動之黑白影像，以生成合併的彩色影像；及顯示此合併之彩色影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for driving a color electrophoretic display includes receiving an RGB input color image; mapping the RGB color image to an electrophoretic destination space defined by an electrophoretic color gamut to generate a color destination space image; dithering the color destination space image to generate a dithered color image; identifying neutral portions of the dithered color image; converting the RGB color image to a black and white image; mapping the black and white image to a black and white electrophoretic destination space to generate a black and white destination space image; dithering the black and white destination space image to generate a dithered black and white image; merging the dithered color image and the dithered black and white image by replacing the neutral portions of the dithered color image with corresponding portions of the dithered black and white image to generate a merged color image; and displaying the merged color image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:電泳顯示器</p>
        <p type="p">110:頂部透光電極</p>
        <p type="p">120:電泳介質</p>
        <p type="p">121:電泳粒子</p>
        <p type="p">122:電泳粒子</p>
        <p type="p">126:微膠囊</p>
        <p type="p">130:底部驅動電極</p>
        <p type="p">135:底部驅動電極</p>
        <p type="p">140:黏著劑層</p>
        <p type="p">150:基板</p>
        <p type="p">160:保護層</p>
        <p type="p">170:黏著劑層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="860" publication-number="202615194">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615194</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117935</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>引線接合系統和陣列、以及相關方法</chinese-title>
        <english-title>WIRE BONDING SYSTEMS AND ARRAYS, AND RELATED METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">B23K37/047</main-classification>
        <further-classification edition="200601120260112B">B23K20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商庫利克和索夫工業公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KULICKE AND SOFFA INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉馬拉　麥克　克里斯多福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAMARRA, MICHAEL CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種引線接合陣列。該引線接合陣列包含複數個引線接合系統，該等引線接合系統的每一個包含（i）一輸入工作件搬運系統及（ii）一接合頭組件，配置為承載一引線接合工具。該引線接合陣列亦包含一機器人，配置為將工作件供應至該等引線接合系統的每一個的該輸入工作件搬運系統，該機器人包含用於相對於該等引線接合系統移動的一載具，該載具被放置在該輸入工作件搬運系統的一接收部分的上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wire bonding array is provided. The wire bonding array includes a plurality of wire bonding systems, each of the plurality of wire bonding systems including (i) an input workpiece handling system and (ii) a bond head assembly configured to carry a wire bonding tool. The wire bonding array also includes a robot configured to provide workpieces to the input workpiece handling system of each of the plurality of wire bonding systems, the robot including a carriage for moving with respect to the plurality of wire bonding systems, the carriage being positioned above a receiving portion of the input workpiece handling system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:引線接合系統</p>
        <p type="p">120:輸入工作件搬運系統</p>
        <p type="p">120a:接收部分</p>
        <p type="p">130:輸出工作件搬運系統</p>
        <p type="p">130a:緩衝部分</p>
        <p type="p">140':輸出彈匣</p>
        <p type="p">200a:引線接合陣列</p>
        <p type="p">250:物料搬運機器人</p>
        <p type="p">250a:載具</p>
        <p type="p">250c:機械手臂</p>
        <p type="p">260a:機器人支撐結構</p>
        <p type="p">260a1:軌道</p>
        <p type="p">D1:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="861" publication-number="202615987">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615987</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118014</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>以模型為基礎之組合對準和疊對度量衡的系統、方法及軟體</chinese-title>
        <english-title>SYSTEMS, METHODS, AND SOFTWARE FOR MODEL-BASED COMBINED ALIGNMENT AND OVERLAY METROLOGY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">G03F7/20</main-classification>
        <further-classification edition="200601120260107B">G03F9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>付　繼有</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, JIYOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼徹奇可夫　伯瑞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENCHTCHIKOV, BORIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉赫曼　薩米　烏爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REHMAN, SAMEE UR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張晨雨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHENYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甘賈拉　高塔姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUNJALA, GAUTAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普拉特　傑森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PLATT, JASON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔伯里　希拉　艾米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TABERY, CYRUS EMIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示了用於改良之度量衡的方法、系統及電腦程式。一種度量衡方法包括獲得藉由一第一感測器量測一基板上之一對準(AL)標記而產生之第一信號及獲得藉由一第二感測器量測該基板上之一疊對(OVL)標記而產生之第二信號。藉由使用自該等第一信號及該等第二信號導出之組合資訊來判定該基板之一OVL。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are methods, systems, and computer programs for improved metrology. One method of metrology includes obtaining first signals generated by a first sensor measuring an alignment (AL) mark on a substrate and obtaining second signals generated by a second sensor measuring an overlay (OVL) mark on the substrate. An OVL of the substrate is determined by using combined information derived from the first signals and the second signals.</p>
      </isu-abst>
      <representative-img>
        <p type="p">610:第一感測器</p>
        <p type="p">612:第一信號</p>
        <p type="p">614:第二信號</p>
        <p type="p">620:第二感測器</p>
        <p type="p">630:模型</p>
        <p type="p">632:AL模型</p>
        <p type="p">634:OVL模型</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="862" publication-number="202616544">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616544</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118025</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製造電極堆的堆疊裝置及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01M10/04</main-classification>
        <further-classification edition="201001120260102B">H01M10/0583</further-classification>
        <further-classification edition="201001120260102B">H01M10/0585</further-classification>
        <further-classification edition="200601120260102B">B65H39/055</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商ＭＢ自動化有限兩合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MB AUTOMATION GMBH &amp; CO. KG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西格蒙德　尼克拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIGMUND, NIKLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳展俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請案係關於一種用於製造尤其是電池單元的電極堆的堆疊裝置（1）及方法。根據本發明的堆疊裝置（1）具有堆疊臺（40），該堆疊臺（40）配置於經界定陽極提供位置與經界定陰極提供位置之間且能沿垂直方向移動。此外，堆疊裝置（1）具有陽極夾具（11）及陰極夾具（21），該陽極夾具（11）及該陰極夾具（21）分別經組態為自經界定陽極提供位置或經界定陰極提供位置夾持相應電極，即陽極（10）或陰極（20），且將該電極轉移至堆疊臺（40）上的限定位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:堆疊裝置</p>
        <p type="p">10:陽極</p>
        <p type="p">11:陽極夾具</p>
        <p type="p">11a:上陽極夾緊件</p>
        <p type="p">11b:下陽極夾緊件</p>
        <p type="p">121:第一陽極位置感測器</p>
        <p type="p">122:第二陽極位置感測器</p>
        <p type="p">20:陰極</p>
        <p type="p">21:陰極夾具</p>
        <p type="p">21a:上陰極夾緊件</p>
        <p type="p">21b:下陰極夾緊件</p>
        <p type="p">221:第一陰極位置感測器</p>
        <p type="p">222:第二陰極位置感測器</p>
        <p type="p">30:隔離膜</p>
        <p type="p">31:隔離膜導引件</p>
        <p type="p">40:堆疊臺</p>
        <p type="p">41:夾指</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="863" publication-number="202616245">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616245</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118043</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示設備</chinese-title>
        <english-title>DISPLAY APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">G09G3/00</main-classification>
        <further-classification edition="202001120260109B">G01L5/101</further-classification>
        <further-classification edition="201601120260109B">G09G3/32</further-classification>
        <further-classification edition="201601120260109B">G09G3/3233</further-classification>
        <further-classification edition="202501120260109B">H10H29/852</further-classification>
        <further-classification edition="202301120260109B">H10K59/80</further-classification>
        <further-classification edition="202301320260109B">H10K102/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星顯示器有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昇埈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEUNGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金慶昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KYUNG HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南重建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAM, JUNGGUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示設備，包含：一顯示層，其包含一顯示區域及該顯示區域外部的一非顯示區域；一應變感測層，其包含一第一感測線，在該顯示區域中在第一方向上延伸及一第二感測線，在該顯示區域中在第二方向上延伸；一顯示驅動單元，其配置為將圖像資料提供至該複數個像素；以及一拉伸補償單元，其配置為將該顯示區域劃分為複數個子區域，透過比較該第一感測線及該第二感測線中的每一個的一測量電壓值與一參考電壓值來產生一比較資料，並且基於該比較資料產生以子區域為單位校正該圖像資料的一拉伸補償資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display apparatus includes a display layer including a display area and a non-display area outside the display area, a strain sensor layer including first sensing lines extending in a first direction in the display area and second sensing lines extending in a second direction in the display area, a display driving unit configured to provide image data to the plurality of pixels, and a stretch compensation unit configured to divide the display area into a plurality of sub-areas, to generate comparison data obtained by comparing a measurement voltage value with a reference voltage value for each of the first sensing lines and the second sensing lines, and to generate stretch compensation data correcting the image data in a unit of sub-areas based on the comparison data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:顯示設備</p>
        <p type="p">22:閘極驅動單元</p>
        <p type="p">23:資料驅動單元</p>
        <p type="p">24:時序控制單元</p>
        <p type="p">25:電壓產生單元</p>
        <p type="p">200:顯示層</p>
        <p type="p">600:應變感測層</p>
        <p type="p">CONT:顯示控制訊號</p>
        <p type="p">DATA:圖像資料</p>
        <p type="p">DCC:資料時序控制訊號</p>
        <p type="p">DDC:顯示驅動單元</p>
        <p type="p">DL_1,DL_2,DL_j:資料線</p>
        <p type="p">Dm_1:資料訊號</p>
        <p type="p">DP:顯示面板</p>
        <p type="p">GCC:閘極時序控制訊號</p>
        <p type="p">HSL:水平感測線</p>
        <p type="p">PCS:保護控制訊號</p>
        <p type="p">PL:電源線</p>
        <p type="p">PXij:像素</p>
        <p type="p">RGB:圖像來源資料</p>
        <p type="p">SCC:拉伸補償單元</p>
        <p type="p">SCD:拉伸補償資料</p>
        <p type="p">SL_1,SL_2,SL_i,SL_m:掃描線</p>
        <p type="p">VDD:第一電源電壓</p>
        <p type="p">VSL:垂直感測線，維持電壓線</p>
        <p type="p">VSS:第二電源電壓，共用電源電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="864" publication-number="202615717">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615717</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118066</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>環繞式閘極(GAA)介面修整以改善陡度</chinese-title>
        <english-title>GATE-ALL-AROUND (GAA) INTERFACE MODIFICATIONS TO IMPROVE ABRUPTNESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">C23C16/52</main-classification>
        <further-classification edition="200601120260107B">C23C16/455</further-classification>
        <further-classification edition="200601120260107B">C23C16/24</further-classification>
        <further-classification edition="200601120260107B">H01L21/02</further-classification>
        <further-classification edition="202501120260107B">H10D30/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托勒　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOLLE, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪格提斯　喬伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARGETIS, JOE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基申海特爾　湯瑪斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIRSCHENHEITER, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯瑪士　尚恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THOMAS, SHAWN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供可用於環繞式閘極(GAA)電晶體元件的超晶格結構及其製造方法。在本揭露的一或多個實施例中，在矽通道生長之前使用含碳前驅物對矽鍺(SiGe)表面進行劑量處理，以抑制鍺擴散。該等含碳前驅物可選自有機矽前驅物、有機鍺前驅物和碳前驅物。該含碳前驅物可與氯化前驅物一起使用。該含碳前驅物可在整個矽鍺厚度的生長期間流動。該含碳前驅物可朝向矽鍺厚度生長的末端流動。該含碳前驅物可在矽鍺厚度生長之後流動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Superlattice structures that may be used in gate-all around (GAA) transistor devices and methods for manufacturing the same are provided. In one or more implementations of the present disclosure, carbon-containing precursors are used to dose the SiGe surface prior to silicon channel growth to suppress germanium diffusion. The carbon-containing precursors can be selected from organosilane precursors, organogermane precursors, and carbon precursors. The carbon-containing precursor can be used with chlorinated precursors. The carbon-containing precursor can be flowed throughout the growth of the entire SiGe thickness. The carbon-containing precursor can be flowed toward the end of the growth of the SiGe thickness. The carbon-containing precursor can be flowed after growth of the SiGe thickness.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:工件</p>
        <p type="p">202:基板</p>
        <p type="p">204:摻雜碳的矽鍺堆疊</p>
        <p type="p">206:摻雜碳的矽鍺與矽的迷你堆疊</p>
        <p type="p">208:多層磊晶堆疊</p>
        <p type="p">210:矽鍺層</p>
        <p type="p">220:碳矽鍺層</p>
        <p type="p">240:矽膜</p>
        <p type="p">242:矽種晶層</p>
        <p type="p">244:矽體層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="865" publication-number="202615130">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615130</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118085</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於從聚醯胺6解聚混合物中分離高沸物之方法</chinese-title>
        <english-title>PROCESS FOR SEPARATING HIGH BOILERS FROM POLYAMIDE 6 DEPOLYMERIZATION MIXTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B01D1/14</main-classification>
        <further-classification edition="200601120260102B">B01D3/34</further-classification>
        <further-classification edition="200601120260102B">C07D201/16</further-classification>
        <further-classification edition="200601220260102B">C08J11/10</further-classification>
        <further-classification edition="200601220260102B">C08L77/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴斯夫歐洲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉維庫瑪　維克拉姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAVIKUMAR, VIKRAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾　圖發里　費索　阿里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EL-TOUFAILI, FAISSAL-ALI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布莱　史蒂凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLEI, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於從包含單體ε-己內醯胺及一或多種有機化合物X之水性液流S&lt;sub&gt;L0&lt;/sub&gt;中分離該一或多種化合物X之連續方法，該方法包含：（i）提供流S&lt;sub&gt;L0&lt;/sub&gt;；（ii）提供包含至少一種惰性氣體G之非水性汽提氣流S&lt;sub&gt;G0&lt;/sub&gt;；（iii）在汽提單元U&lt;sub&gt;S1&lt;/sub&gt;中，從流S&lt;sub&gt;L0&lt;/sub&gt;製造水性氣流S&lt;sub&gt;V1&lt;/sub&gt;及液流S&lt;sub&gt;L1&lt;/sub&gt;；（iv）在分離單元U&lt;sub&gt;S2&lt;/sub&gt;中，從流S&lt;sub&gt;V1&lt;/sub&gt;製造水性氣流S&lt;sub&gt;V2&lt;/sub&gt;及液流S&lt;sub&gt;L2&lt;/sub&gt;。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A continuous process for separating one or more organic compounds X from an aqueous liquid stream S&lt;sub&gt;L0&lt;/sub&gt; comprising monomeric ε-caprolactam and said one or more compounds X, the process comprising (i) providing the stream S&lt;sub&gt;L0&lt;/sub&gt;; (ii) providing a non-aqueous stripping gas stream S&lt;sub&gt;G0&lt;/sub&gt; comprising at least one inert gas G; (iii) producing in a stripping unit U&lt;sub&gt;S1&lt;/sub&gt; from the stream S&lt;sub&gt;L0&lt;/sub&gt; an aqueous gas stream S&lt;sub&gt;V1&lt;/sub&gt; and a liquid stream S&lt;sub&gt;L1&lt;/sub&gt;; (iv) producing in a separation unit U&lt;sub&gt;S2&lt;/sub&gt; from the stream S&lt;sub&gt;V1&lt;/sub&gt; an aqueous gas stream S&lt;sub&gt;V2&lt;/sub&gt; and a liquid stream S&lt;sub&gt;L2&lt;/sub&gt;.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S&lt;sub&gt;L0&lt;/sub&gt;、S&lt;sub&gt;L1&lt;/sub&gt;、S&lt;sub&gt;L2&lt;/sub&gt;、S&lt;sub&gt;G0&lt;/sub&gt;、S&lt;sub&gt;V1&lt;/sub&gt;、S&lt;sub&gt;V2&lt;/sub&gt;:流</p>
        <p type="p">U&lt;sub&gt;S1&lt;/sub&gt;、U&lt;sub&gt;S2&lt;/sub&gt;:單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="866" publication-number="202616334">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616334</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118120</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及清潔方法</chinese-title>
        <english-title>SUBSTRATE TREATMENT APPARATUS AND CLEANING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H01J37/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商艾發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVATEC AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕施恰得　約爾格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATSCHEIDER, JOERG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱薩　西蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAISER, SIMON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫爾曼　比約恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERMANN, BJOERN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬提　米歇爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARTI, MICHEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈特曼　多明尼克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARTMANN, DOMINIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容係關於藉由電漿蝕刻及/或原子層沉積進行基板表面處理的技術領域。提供了一種基板處理裝置（1），其包含至少一個適於接納磁鐵配置（9）的磁鐵配置容器（13）。在磁鐵配置（9）被磁鐵配置容器（13）接納時，裝置（1）內部未提供電子迴旋共振（ECR）。此外，提供了一種包含至少一個微波透射材料窗口（16）的基板處理裝置（1），以吸引清潔氣體離子，微波透射材料窗口具有導電框架（17）及一或多條導電線（18）。此外，提供了一種對基板處理裝置（1）進行原位清潔的方法以及一種裝置（1）及方法的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure relates to the technical field of substrate surface treatment by plasma etching and/or atomic layer deposition. A substrate processing apparatus (1) comprising at least one magnet arrangement recipient (13) adapted to receive a magnet arrangement (9) is provided. When the magnet arrangement (9) is received by the magnet arrangement recipient (13), no electron cyclotron resonance (ECR) is provided inside the apparatus (1). Furthermore, a substrate processing apparatus (1) comprising at least one microwave transmissive material window (16) having an electrically conductive frame (17) and one or multiple electrically conductive wires (18) is provided to attract cleaning gas ions. Moreover, a method of in-situ cleaning of a substrate processing apparatus (1) and a use of the apparatus (1) and of the method are provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板處理裝置</p>
        <p type="p">2:真空容器</p>
        <p type="p">3:真空容器殼體</p>
        <p type="p">4:抽氣口</p>
        <p type="p">5:氣體入口</p>
        <p type="p">6:電源</p>
        <p type="p">7:第一電極</p>
        <p type="p">8:第二電極</p>
        <p type="p">9:磁鐵配置</p>
        <p type="p">10:永久磁鐵元件</p>
        <p type="p">11:卡盤</p>
        <p type="p">12:控制單元</p>
        <p type="p">13:磁鐵配置容器</p>
        <p type="p">20:斷續器開關</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="867" publication-number="202616422">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616422</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118191</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>裝載鎖定腔室及包含該腔室的基板處理設備</chinese-title>
        <english-title>LOADLOCK CHAMBER AND SUBSTRATE TREATING APPARATUS INCLUDING THE CHAMBER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H01L21/67</main-classification>
        <further-classification edition="200601120260112B">H01L21/687</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＰＳＫ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PSK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金美炅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MI KYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張鉉煜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, HYUN WOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金錫文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SEOK MOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔愉鎭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, YU JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於處理基板之基板處理設備，更詳細地，係關於一種供移送的基板進行等待的裝載鎖定腔室及包括其的基板處理設備。根據一實施例，裝載鎖定腔室可包括：外殼，其提供供基板等待的等待空間；支撐單元，其在等待空間支撐基板；壓力調節單元，其對等待空間進行減壓；及升降單元，其使支撐單元在等待空間內升降；且升降單元包括：軸，其貫通外殼的下壁並結合於支撐單元的下部；升降板，其設置於軸的下部；波紋管，其結合於外殼的下壁及引導板，並以包圍軸的方式配備；及驅動器，其使引導板沿上下方向移動；且在軸的側面形成有狹縫。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">210:外殼</p>
        <p type="p">211:第一側壁</p>
        <p type="p">231:底座</p>
        <p type="p">233:支架</p>
        <p type="p">234:狹槽</p>
        <p type="p">235:連接部</p>
        <p type="p">251:排氣管線</p>
        <p type="p">253:排氣構件</p>
        <p type="p">272:軸</p>
        <p type="p">274:引導桿</p>
        <p type="p">275:升降板</p>
        <p type="p">277:波紋管</p>
        <p type="p">279:驅動器</p>
        <p type="p">210a:等待空間</p>
        <p type="p">211a:第一開口</p>
        <p type="p">213a:排氣埠</p>
        <p type="p">231a:圓形板</p>
        <p type="p">231b:環形板</p>
        <p type="p">231c:固定部</p>
        <p type="p">274a:支撐板</p>
        <p type="p">277a:內部空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="868" publication-number="202616378">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616378</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118203</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H01L21/306</main-classification>
        <further-classification edition="200601120260112B">H01L21/768</further-classification>
        <further-classification edition="200601120260112B">H01L21/3205</further-classification>
        <further-classification edition="200601120260112B">H01L23/522</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人東京大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE UNIVERSITY OF TOKYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大和田伸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOWADA, SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浅子竜一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAKO, RYUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木宏太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, KOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤剛仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, TSUYOHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠實現微細圖案之形成之基板處理方法。  &lt;br/&gt;本發明之基板處理方法具有：使大氣壓電漿作用於包含貴金屬之水溶液，於矽基板上形成包含貴金屬之微粒子之觸媒層；及藉由包含氧化劑及氟化氫之蝕刻液，對形成有觸媒層之矽基板進行蝕刻。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板處理裝置</p>
        <p type="p">10:裝置本體</p>
        <p type="p">11:控制裝置</p>
        <p type="p">12:容器</p>
        <p type="p">12a:狹縫</p>
        <p type="p">12b:空間</p>
        <p type="p">13:噴墨頭</p>
        <p type="p">13a:頭本體</p>
        <p type="p">13b:噴嘴部</p>
        <p type="p">14:載置台</p>
        <p type="p">15:氣體注入部</p>
        <p type="p">16:RF電源</p>
        <p type="p">20,21:電極</p>
        <p type="p">20a,21a:端部</p>
        <p type="p">30:氣體供給部</p>
        <p type="p">30a:氣體源</p>
        <p type="p">30b:流量控制器</p>
        <p type="p">50:液滴</p>
        <p type="p">60:觸媒層</p>
        <p type="p">P:大氣壓電漿</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="869" publication-number="202615890">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615890</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118220</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光檢測裝置及測距裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260112B">G01S7/4863</main-classification>
        <further-classification edition="200601120260112B">G01S3/06</further-classification>
        <further-classification edition="202001120260112B">G01S17/89</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼半導體解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佃恭範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUKUDA, YASUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之一實施形態之光檢測裝置包含：像素陣列，其具有各自包含能夠檢測光脈衝之受光元件之複數個像素，能夠將複數個像素中之2個以上之像素作為受光像素而連結，能夠產生與光脈衝之檢測時序相應之檢測信號；受光控制電路，其能夠以切換構成受光像素之2個以上之像素中之一部分之方式控制像素陣列之動作；及距離圖像產生電路，其能夠基於2個以上之像素為第一2個以上之像素之情形之由複數個受光像素產生之複數個檢測信號而產生第1距離圖像，能夠基於2個以上之像素為第二2個以上之像素之情形之複數個檢測信號而產生第2距離圖像，且能夠藉由基於第1距離圖像及第2距離圖像進行圖像合成處理而產生合成距離圖像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">P1,P2:像素</p>
        <p type="p">PP:受光像素</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="870" publication-number="202615956">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615956</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118225</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有線性化輸出的馬赫-澤恩德干涉儀和用於馬赫-澤恩德干涉儀的方法</chinese-title>
        <english-title>MACH-ZEHNDER INTERFEROMETERS WITH LINEARIZED OUTPUT AND METHODS FOR MACH-ZEHNDER INTERFEROMETERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">G02F1/21</main-classification>
        <further-classification edition="200601120260109B">G02F1/01</further-classification>
        <further-classification edition="200601120260109B">G02F1/025</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商拉諾沃斯公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RANOVUS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈法瑞　歐米德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAFARI, OMID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫瑞　凱爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURRAY, KYLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬特塞隆　艾德加</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANTE-CERON, EDGAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>修安　克里斯多夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHULEIN, CHRISTOPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲力柯亞　堅盧卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PELLECCHIA, GIANLUCA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德旺吉　阿爾博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEWANJEE, ARBAB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">馬赫-澤恩德干涉儀（MZI）包括：一對波導；光輸入，該光輸入被配置為在該一對波導之間將在該光輸入處接收的光分開；及相應環形諧振器調制器，該等相應環形諧振器調制器位於該一對波導上，該等相應環形諧振器調制器包括具有串聯連接的相應電容的相應pn結。MZI進一步包括共用驅動器，該共用驅動器被配置為接收其中編碼有資料的差分電信號；及使用該差分電信號來控制該等相應pn結的相應n側，以控制該等相應環形諧振器調制器以分別將該光調制為相應光信號。MZI進一步包括共用電壓偏置，該共用電壓偏置被配置為將共用電壓提供給該等相應pn結的相應p側。MZI進一步包括光輸出，該光輸出被配置為從該一對波導接收該等相應光信號；及組合該等相應光信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A Mach-Zehnder Interferometer (MZI) includes a pair of waveguides, an optical input configured to split light received at the optical input between the pair of waveguides, and respective ring resonator modulators located on the pair of waveguides, the respective ring resonator modulators comprising respective pn-junctions having respective capacitances connected in series. The MZI further includes a common driver configured to receive a differential electrical signal with data encoded therein and to control, using the differential electrical signal, respective n-sides of the respective pn-junctions to control the respective ring resonator modulators to respectively modulate the light into respective optical signals. The MZI further includes a common voltage bias configured to provide a common voltage to respective p-sides of the respective pn-junctions. The MZI further includes an optical output configured to receive the respective optical signals from the pair of waveguides and combine the respective optical signals.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:光發射器</p>
        <p type="p">301:波導</p>
        <p type="p">302:波導</p>
        <p type="p">303:長度</p>
        <p type="p">304:光輸入</p>
        <p type="p">306:光輸出</p>
        <p type="p">307:雷射器</p>
        <p type="p">311:RRM</p>
        <p type="p">312:RRM</p>
        <p type="p">314:共用驅動器</p>
        <p type="p">316:輸入</p>
        <p type="p">318:輸入</p>
        <p type="p">321:光學環</p>
        <p type="p">322:光學環</p>
        <p type="p">331:p側</p>
        <p type="p">332:p側</p>
        <p type="p">341:n側</p>
        <p type="p">342:n側</p>
        <p type="p">350:共用電壓偏置</p>
        <p type="p">351:電連接</p>
        <p type="p">352:電感器</p>
        <p type="p">361:加熱器</p>
        <p type="p">362:加熱器</p>
        <p type="p">364:電壓供應</p>
        <p type="p">366:驅動器/開關</p>
        <p type="p">379:控制器</p>
        <p type="p">380:感測器</p>
        <p type="p">381:感測器</p>
        <p type="p">382:感測器</p>
        <p type="p">383:感測器</p>
        <p type="p">384:感測器</p>
        <p type="p">385:感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="871" publication-number="202615090">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615090</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118233</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含ＩｇＡ蛋白酶或其變異體及聚乙二醇部分之結合物及其用途</chinese-title>
        <english-title>CONJUGATES COMPRISING IGA PROTEASE OR VARIANTS THEREOF AND A POLYETHYLENE GLYCOL MOIETY, AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K38/48</main-classification>
        <further-classification edition="200601120260102B">C07K14/33</further-classification>
        <further-classification edition="200601120260102B">C07K19/00</further-classification>
        <further-classification edition="200601120260102B">C12N15/62</further-classification>
        <further-classification edition="200601120260102B">C12N9/52</further-classification>
        <further-classification edition="200601120260102B">A61P13/12</further-classification>
        <further-classification edition="200601120260102B">A61P19/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海君祉醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI ALEZYME PHARMACEUTICALS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商禮邦醫藥(香港)有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALEBUND PHARMACEUTICALS (HONG KONG) LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒楚天</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHU, CHUTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱　媛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉仁傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示係關於包含IgA蛋白酶或其變異體及聚乙二醇（PEG）部分之結合物，以及其用於治療與IgA沉積相關之疾病（例如IgA腎病變）的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a conjugate comprising an IgA protease or variants thereof, and a polyethylene glycol (PEG) moiety, as well as uses thereof in treating diseases associated with IgA deposition (&lt;i&gt;e.g.&lt;/i&gt;, IgA nephropathy).</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="872" publication-number="202616902">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616902</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118265</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像感測器及其製造方法</chinese-title>
        <english-title>IMAGE SENSORS AND METHODS OF FABRICATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260109B">H10F39/12</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SHIMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭禎勉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, ZHENMIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閔書迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIN, SHUDI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王大磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, DALEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　欽濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, QINTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李紫祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZIXIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本技術的影像感測器及其製造方法的實施例如下。在某些實施例中，裝置包括：基板，其上有介電層；位於介電層內的柱狀體；以及複數個孔隙以陣列形式排列在介電層內，其中柱狀體位於複數個孔隙的相鄰孔隙之間。可在基板上設置二維彩色濾光片陣列，該彩色濾光片的相鄰彩色濾光片之間設置有複數個孔隙，並且柱狀體位於相鄰孔隙之間以及對角排列的彩色濾光片陣列之間。可在基板中設置複數個光電元件，並且這些光電元件對應於彩色濾光片陣列的每個彩色濾光片並位於每個彩色濾光片之下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of image sensors and methods of fabrication are provided herein. In some embodiments, a device includes: a substrate having a dielectric layer disposed atop the substrate; a pillar disposed within the dielectric layer; and a plurality of voids arranged in an array within the dielectric layer, wherein the pillar is disposed between adjacent voids of the plurality of voids. A two-dimensional array of color filters can be disposed atop the substrate having respective voids of the plurality of voids disposed between adjacent color filters and having the pillar disposed between adjacent voids and between diagonally disposed color filters of the array of color filters. A plurality of photoelectric elements can be disposed in the substrate and correspond to and be disposed beneath individual color filters of the array of color filters.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:截面線</p>
        <p type="p">100:所示的CIS結構</p>
        <p type="p">102&lt;sub&gt;21&lt;/sub&gt;:彩色濾光片</p>
        <p type="p">102&lt;sub&gt;22&lt;/sub&gt;:彩色濾光片</p>
        <p type="p">108:介電層</p>
        <p type="p">110:氣隙</p>
        <p type="p">202:基板</p>
        <p type="p">204:第一層</p>
        <p type="p">206:光電元件</p>
        <p type="p">208:隔離膜</p>
        <p type="p">210:絕緣層</p>
        <p type="p">212:閘極結構</p>
        <p type="p">214:導電層</p>
        <p type="p">216:下方保護層</p>
        <p type="p">218:上方保護層</p>
        <p type="p">220:微透鏡</p>
        <p type="p">222:保護層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="873" publication-number="202615964">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615964</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118266</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>空白光罩及光罩的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260102B">G03F1/28</main-classification>
        <further-classification edition="201201120260102B">G03F1/32</further-classification>
        <further-classification edition="201201120260102B">G03F1/54</further-classification>
        <further-classification edition="201201120260102B">G03F1/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮島千晶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAJIMA, CHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">
        &lt;b&gt;　　&lt;/b&gt;解決手段為一種空白光罩，其具備：透明基板；以含鉻材料形成的膜；及以單層或多層所構成，厚度為0.5～15nm，含有鉭、與氧或氧及氮且以不含矽之材料所形成的膜；構成單層及多層的層之至少最遠離透明基板的層係以鉭的含有率為40～80原子%、氧的含有率為5～50原子%、氮的含有率為50原子%以下的含鉭材料所形成，且最遠離透明基板的層的厚度為0.5nm以上。  &lt;br/&gt;　　發明效果在於可提供一種空白光罩，其中作為形成於以含鉻材料形成的膜上之膜，係具備即使未實施HMDS處理，阻劑膜的密接性亦良好，對於蝕刻之膜面內之CD的均勻性較高，且對於使用含氧氯系氣體之乾蝕刻的蝕刻速率較低的膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:透明基板</p>
        <p type="p">3:以含鉻材料形成的膜</p>
        <p type="p">4:以含鉭材料形成的膜</p>
        <p type="p">5:第1阻劑膜</p>
        <p type="p">103:空白光罩</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="874" publication-number="202616295">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616295</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118294</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>身心狀態通知系統及身心狀態通知程式</chinese-title>
        <english-title>MENTAL AND PHYSICAL CONDITIONS NOTIFICATION SYSTEM, AND MENTAL AND PHYSICAL CONDITIONS NOTIFICATION PROGRAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260112B">G16H20/00</main-classification>
        <further-classification edition="200601120260112B">A61B5/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商西川股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKAWA CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>人
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NONOMURA, TAKUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>理
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOKI, MARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歩
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBATA, MAHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長谷川夏美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASEGAWA, NATSUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荻野恵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGINO, MEGUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明一實施型態的身心狀態通知系統係藉由使用者所使用的使用者終端之操作而使用。使用者終端係具有：設定包含使用者及不同於使用者的其他使用者的群組的功能；取得使用者的睡眠狀態的功能；從使用者的睡眠狀態來推定使用者的身心狀態的功能；以及將對於使用者的身心狀態的建議以及對於其他使用者的身心狀態的建議提供給使用者的功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A mental and physical conditions notification system according to an embodiment of the present invention is used by operation of a user terminal which is used by a user. The user terminal has the following functions: setting a group including the user and other users, acquiring the user’s sleep state, estimating the user’s mental and physical conditions from the user’s sleep state, and providing the user with recommendations for the user’s mental and physical conditions as well as recommendations for the mental and physical conditions of other users.</p>
      </isu-abst>
      <representative-img>
        <p type="p">T:使用者終端</p>
        <p type="p">T11:顯示器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="875" publication-number="202615836">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615836</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118312</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於表徵相機模組的方法及其相關成像系統</chinese-title>
        <english-title>METHOD FOR CHARACTERIZING A CAMERA MODULE AND ASSOCIATED IMAGING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">G01M11/02</main-classification>
        <further-classification edition="202301120260112B">H04N25/61</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商法格爾光學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOGALE OPTIQUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>列格羅斯　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEGROS, ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩蒂格朗　希爾萬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PETITGRAND, SYLVAIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>隆格　布魯諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUONG, BRUNO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種用於表徵包括透鏡組件(6)及感測器(8)的相機模組(4)之方法(30)，透鏡組件(6)屬於和一個別的目標幾何相關的預設的透鏡組件系列，表徵方法(30)包括以下步驟：  &lt;br/&gt;- 獲得(32)指出相機模組的目前的配置的配置資料，並且包括：  &lt;br/&gt;● 至少一設計參數，其代表實際的透鏡組件幾何(6)；及/或  &lt;br/&gt;● 至少一操作參數，其代表針對於相機模組(4)的目前的影像擷取狀況；以及  &lt;br/&gt;- 從以下計算(34)和相機模組(4)的目前的配置相關的目前的光學轉換函數：  &lt;br/&gt;● 所獲得的配置資料；以及  &lt;br/&gt;● 和透鏡組件系列相關的預設的估計函數(16)，其取配置資料作為輸入並且提供對應的估計的光學轉換函數作為輸出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a method (30) for characterizing a camera module (4) comprising a lens assembly (6) and a sensor (8), the lens assembly (6) belonging to a predetermined lens assembly family associated with a respective target geometry, the characterization method (30) comprising the steps of: &lt;br/&gt;- obtaining (32) configuration data indicative of a current configuration of the camera module, and comprising: &lt;br/&gt;● at least one design parameter representative of an actual lens assembly geometry (6); and/or &lt;br/&gt;● at least one operating parameter representative of current image acquisition conditions for the camera module (4); and &lt;br/&gt;- calculating (34) a current optical transfer function, associated with the current configuration of the camera module (4), from: &lt;br/&gt;● the obtained configuration data; and &lt;br/&gt;● a predetermined estimation function (16) associated with the lens assembly family, taking configuration data as input and providing a corresponding estimated optical transfer function as output.</p>
      </isu-abst>
      <representative-img>
        <p type="p">30:表徵方法</p>
        <p type="p">32:獲得步驟</p>
        <p type="p">34:計算步驟</p>
        <p type="p">36:校正步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="876" publication-number="202616875">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616875</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118336</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置和其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND FORMING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251001B">H10D64/01</main-classification>
        <further-classification edition="200601120251001B">C23C16/40</further-classification>
        <further-classification edition="202501120251001B">H10D30/01</further-classification>
        <further-classification edition="202501120251001B">H10D62/17</further-classification>
        <further-classification edition="202501120251001B">H10D64/27</further-classification>
        <further-classification edition="202501120251001B">H10D64/23</further-classification>
        <further-classification edition="202501120251001B">H10D30/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林政頤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHENG-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳書涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHU-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐浩明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, HAO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TSUNG-DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　志安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUI, CHI ON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開的實施例中描述一種形成半導體裝置的方法，包括形成至奈米結構堆疊的開口，其中閘極間隔物及內部間隔物作為開口的側壁。方法可進一步包括將氧化電漿施加至開口中的奈米結構堆疊，以及施加至作為開口側壁的閘極間隔物及內部間隔物的表面。在一些實施例中，氧化電漿在開口中的奈米結構堆疊、閘極間隔物的表面及內部間隔物的表面上形成均勻厚度氧化物表面。方法可進一步包括在開口中的奈米結構堆疊、閘極間隔物的表面及內部間隔物的表面上的均勻厚度氧化物表面上形成高介電常數閘極介電質，及在高介電常數閘極介電質上形成閘極電極。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In an embodiment, a method of forming a semiconductor device is described that includes forming an opening to a stack of nanostructures, wherein sidewalls of the opening are provided by a gate spacer and an inner spacer. The method may further include applying an oxidizing plasma to the stack of nanostructures in the opening and the surfaces of the gate spacer and the inner spacer providing the sidewalls for the opening. In some embodiments, the oxidizing plasma forms a uniform thickness oxide surface on the stack of nanostructures in the opening and the surfaces of the gate spacer and the inner spacer. The method may further includes forming a high-k gate dielectric on the uniform thickness oxide surface on the stack of nanostructures in the opening and the surfaces of the gate spacer and the inner spacer, and forming a gate electrode on the high-k gate dielectric.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:基板</p>
        <p type="p">50N:n型區</p>
        <p type="p">50P:p型區</p>
        <p type="p">54A,54B,54C:第二奈米結構/奈米結構</p>
        <p type="p">66:鰭片</p>
        <p type="p">81:閘極間隔物</p>
        <p type="p">90:內部間隔物</p>
        <p type="p">92:源極/汲極區</p>
        <p type="p">94:接觸蝕刻停止層</p>
        <p type="p">96:第一層間介電質</p>
        <p type="p">100:閘極介電層/高介電常數介電層</p>
        <p type="p">102:閘極電極</p>
        <p type="p">104:閘極遮罩</p>
        <p type="p">106:第二層間介電質</p>
        <p type="p">200:介面層</p>
        <p type="p">201:氧化物表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="877" publication-number="202616894">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616894</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118342</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>佈局設計方法及其系統與電腦程式產品</chinese-title>
        <english-title>LAYOUT DESIGN METHOD AND SYSTEM FOR THE SAME AND COMPUTER PROGRAM PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251001B">H10D89/10</main-classification>
        <further-classification edition="202001120251001B">G06F30/392</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝曜任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, YAO-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王治傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉凱明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KAI-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法，至少部分地由至少一個處理器執行，且包括產生對應於積體電路(IC)裝置之IC原理圖的積體電路佈局。IC裝置包括沿著IC裝置之厚度方向以複數個層級配置的半導體裝置。針對半導體裝置中一半導體裝置，IC佈局包括標籤特徵，該標籤特徵指示複數個層級中該半導體裝置所配置的對應層級。方法進一步包括產生對應於IC佈局的佈局網路連線表，基於對應於IC原理圖的來源網路連線表及佈局網路連線表，執行佈局與原理圖(LVS)檢查，及回應於LVS檢查指示錯誤，修改IC佈局或IC原理圖中之至少一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method is executed at least partially by at least one processor and includes generating an integrated circuit (IC) layout corresponding to an IC schematic of an IC device. The IC device includes semiconductor devices arranged at a plurality of levels along a thickness direction of the IC device. The IC layout includes, for a semiconductor device among the semiconductor devices, a label feature indicating, among the plurality of levels, a corresponding level at which the semiconductor device is arranged. The method further includes generating a layout netlist corresponding to the IC layout, performing a layout versus schematic (LVS) check based on a source netlist corresponding to the IC schematic and the layout netlist, and modifying at least one of the IC layout or the IC schematic in response to the LVS check indicating an error.</p>
      </isu-abst>
      <representative-img>
        <p type="p">800A:方法</p>
        <p type="p">820~826:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="878" publication-number="202616891">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616891</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118350</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及製造半導體裝置的方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251103B">H10D84/85</main-classification>
        <further-classification edition="202501120251103B">H10D64/27</further-classification>
        <further-classification edition="200601120251103B">H01L23/485</further-classification>
        <further-classification edition="200601120251103B">H01L23/528</further-classification>
        <further-classification edition="202501120251103B">H10D84/01</further-classification>
        <further-classification edition="200601120251103B">H01L21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭士瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, SHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾威程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TZENG, WEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林威呈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾健庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TZENG, JIANN-TYNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置包含：複數個第一閘極結構，其沿著一第一方向配置且在一第二方向上延伸，該些第一閘極結構中的至少一個第一閘極結構對應於一第一電晶體區；複數個第二閘極結構，其沿著該第一方向配置且在該第二方向上與該些第一閘極結構中的多者對準，該些第二閘極結構中的至少一個第二閘極結構對應於一第二電晶體區；一絕緣結構，其在該第二方向上延伸且分離該些第一閘極結構與該些第二閘極結構；及一第一導電通孔，該第一導電通孔係在該絕緣結構中且用以攜載針對該第一電晶體區的一信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a plurality of first gate structures arranged along a first direction and extending in a second direction, at least one first gate structure of the plurality of first gate structures corresponding to a first transistor region; a plurality of second gate structures arranged along the first direction and aligned with ones of the first gate structures in the second direction, at least one second gate structure of the plurality of second gate structures corresponding to a second transistor region; an insulating structure extending in the second direction and separating the plurality of first gate structures from the plurality of second gate structures; and a first conductive via in the insulating structure and configured to carry a signal for the first transistor region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:半導體裝置佈局</p>
        <p type="p">508_p:閘極節距</p>
        <p type="p">508_w:寬度</p>
        <p type="p">508a:閘極結構</p>
        <p type="p">508b:閘極結構</p>
        <p type="p">512_h:高度</p>
        <p type="p">512a:預留區</p>
        <p type="p">512b:預留區</p>
        <p type="p">513a:PV功率結構</p>
        <p type="p">513b:PV功率結構</p>
        <p type="p">518a:閘極切割結構</p>
        <p type="p">518b:閘極切割結構</p>
        <p type="p">520:絕緣閘極切割結構</p>
        <p type="p">521_h:高度</p>
        <p type="p">521_w:寬度</p>
        <p type="p">521b:PV信號結構</p>
        <p type="p">522_w:寬度</p>
        <p type="p">525a~525g:導體</p>
        <p type="p">532b1:觸點</p>
        <p type="p">532b2:觸點</p>
        <p type="p">532a1:觸點</p>
        <p type="p">532a2:觸點</p>
        <p type="p">BM0:第一背側導電層</p>
        <p type="p">C501a:單元</p>
        <p type="p">C501b:單元</p>
        <p type="p">C511a:單元</p>
        <p type="p">C511b:單元</p>
        <p type="p">R501:第一列</p>
        <p type="p">R502:第二列</p>
        <p type="p">R503a:共同列邊界</p>
        <p type="p">R503b:列邊界</p>
        <p type="p">R503c:列邊界</p>
        <p type="p">V01:第一電源電壓</p>
        <p type="p">V02:第二電源電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="879" publication-number="202616499">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616499</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118366</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及其製造方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251125B">H01L23/49</main-classification>
        <further-classification edition="200601120251125B">H01L23/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王茹立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JU-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖文祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, WEN-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林政男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JENG-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高克毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, KER-YIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電子裝置及其製造方法。電子裝置的製造方法包括以下步驟。提供基板結構，其中基板結構包括第一基板以及第二基板；提供第一抗翹曲層於基板結構的至少一側上；形成第一電路結構於第一基板上；以及形成封裝結構於第一電路結構上，其中第一基板設置於第一電路結構與第二基板之間且第一基板的熱膨脹係數大於第二基板的熱膨脹係數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an electronic device and a method for manufacturing the same, in which the method includes the following steps. A substrate structure is provided, wherein the substrate structure includes a first substrate and a second substrate. A first anti-warpage layer is provided on at least one side of the substrate structure. A first circuit structure is formed on the first substrate. A packaging structure is formed on the first circuit structure, wherein the first substrate is disposed between the first circuit structure and the second substrate, and the coefficient of thermal expansion of the first substrate is greater than the coefficient of thermal expansion of the second substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電子裝置</p>
        <p type="p">100:基板結構</p>
        <p type="p">300:封裝結構</p>
        <p type="p">302:電子元件</p>
        <p type="p">304:接墊</p>
        <p type="p">306:封裝層</p>
        <p type="p">CS1:第一電路結構</p>
        <p type="p">D1、D2:方向</p>
        <p type="p">IL1:絕緣層</p>
        <p type="p">MK1:對準標記</p>
        <p type="p">WAL1:第一抗翹曲層</p>
        <p type="p">WS1:配線結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="880" publication-number="202614946">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614946</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118410</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高腳椅上之多位置夾具</chinese-title>
        <english-title>MULTI POSITION CLAMP ON HIGH CHAIR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">A47D1/10</main-classification>
        <further-classification edition="200601120260109B">A47D1/04</further-classification>
        <further-classification edition="200601120260109B">A47D1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安德魯Ｊ　霍斯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDREW J., HORST</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬納森Ｍ　帕塞拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JONATHAN M., PACELLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬納森Ｋ　蒙茨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JONATHAN K., MOUNTZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹尼爾Ａ　薩克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DANIEL A., SACK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>約書亞　弗格森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOSHUA, FERGUSON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可安裝至一支撐元件且經組態以用於支撐一兒童座椅之對接基座包括：一夾具部分，其可與該支撐元件嚙合；及一容納結構，其與該夾具部分相關聯。該容納結構可定位於該支撐元件上方且可以可拆卸方式連接至該兒童座椅。一粗略調整機構可操作以調整該夾具部分相對於該支撐元件之一位置，且一精細調整機構可操作以調整由該夾具部分施加於該支撐元件上之一力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A docking base mountable to a support element and configured for supporting a child seat includes a clamp portion engageable with the support element, and a receiving structure associated with the clamp portion. The receiving structure is positionable over the support element and is removably connectable to the child seat. A coarse adjustment mechanism is operable to adjust a position of the clamp portion relative to the support element and a fine adjustment mechanism is operable to adjust a force exerted by the clamp portion on the support element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:上部表面</p>
        <p type="p">20:椅子總成</p>
        <p type="p">22:安裝體</p>
        <p type="p">24:兒童座椅</p>
        <p type="p">25a:第一座椅安裝件</p>
        <p type="p">26:第一側</p>
        <p type="p">28:第二側</p>
        <p type="p">30:夾具部分</p>
        <p type="p">32:支撐部分</p>
        <p type="p">34:上部夾具部分</p>
        <p type="p">36:下部夾具部分</p>
        <p type="p">40a:第一上部夾臂</p>
        <p type="p">40b:第二上部夾臂</p>
        <p type="p">42:橫向構件</p>
        <p type="p">44a:第一下部夾臂</p>
        <p type="p">44b:第二下部夾臂</p>
        <p type="p">46a:第一框架構件</p>
        <p type="p">46b:第二框架構件</p>
        <p type="p">48:橫向支撐構件</p>
        <p type="p">50a:第一安裝件</p>
        <p type="p">50b:第二安裝件</p>
        <p type="p">L1:軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="881" publication-number="202615787">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615787</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118473</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>減振器和車輛</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251124B">F16F9/34</main-classification>
        <further-classification edition="200601120251124B">F16F9/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商比亞迪股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BYD COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧音波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張宏洲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于久州</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張琨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種減振器和車輛，所述減振器包括：筒體；活塞，可移動地設於所述筒體，且所述活塞在所述筒體內分隔出壓縮腔和復原腔；流量調節閥，設於所述活塞內且分別與所述壓縮腔和所述復原腔連通；控制閥，設於所述活塞，所述控制閥透過控制所述流量調節閥，來調節所述壓縮腔與所述復原腔之間的流體流量。根據本發明實施例的減振器能夠透過調節壓縮腔與復原腔之間的流體流量來連續調節阻尼力，有利於提高乘車舒適性和車輛的操控性能，且減振器的結構簡單，便於調節。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:減振器</p>
        <p type="p">100:筒體</p>
        <p type="p">110:內筒</p>
        <p type="p">111:壓縮腔</p>
        <p type="p">112:復原腔</p>
        <p type="p">120:外筒</p>
        <p type="p">121:儲液腔</p>
        <p type="p">130:閥底組件</p>
        <p type="p">200:活塞</p>
        <p type="p">210:活塞桿</p>
        <p type="p">220:活塞閥組件</p>
        <p type="p">230:閥體</p>
        <p type="p">240:上閥體</p>
        <p type="p">241:第一腔室</p>
        <p type="p">242:第二腔室</p>
        <p type="p">243:第四流道</p>
        <p type="p">244:密封環台</p>
        <p type="p">250:下閥體</p>
        <p type="p">251:第五流道</p>
        <p type="p">310:溢流閥體</p>
        <p type="p">311:第二流道</p>
        <p type="p">312:第一抵接環台</p>
        <p type="p">314:第六流道</p>
        <p type="p">315:第七流道</p>
        <p type="p">316:密封沉槽</p>
        <p type="p">320:溢流閥座</p>
        <p type="p">321:第一流道</p>
        <p type="p">322:第三流道</p>
        <p type="p">323:第一座體</p>
        <p type="p">324:第二座體</p>
        <p type="p">325:第二抵接環台</p>
        <p type="p">326:導流面</p>
        <p type="p">330:溢流閥片</p>
        <p type="p">331:連通孔</p>
        <p type="p">350:磁吸件</p>
        <p type="p">351:磁力調節片</p>
        <p type="p">360:第一彈性件(閥體彈性件)</p>
        <p type="p">400:控制閥</p>
        <p type="p">410:線圈組件</p>
        <p type="p">420:隔磁環</p>
        <p type="p">430:靜鐵芯</p>
        <p type="p">510:鐵芯罩</p>
        <p type="p">520:閥芯</p>
        <p type="p">521:第八流道</p>
        <p type="p">530:導向桿</p>
        <p type="p">540:第三彈性件</p>
        <p type="p">550:第四彈性件</p>
        <p type="p">600:先導閥</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="882" publication-number="202615734">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615734</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118475</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>對純鈦、或鈦合金或鎳基合金製之被減面材進行減面之方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C25F3/00</main-classification>
        <further-classification edition="200601120260102B">C25F3/26</further-classification>
        <further-classification edition="200601120260102B">B23H5/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京不鏽鋼研磨興業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO STAINLESS GRINDING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青柳泰樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOYAGI, TAIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉川満久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIKAWA, MITSUHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠藤嘉郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDO, YOSHIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日下部充</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSAKABE, MITSURU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日下部繁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSAKABE, SHIGERU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的一實施形態係提供使用具備有電極和磨石的旋轉減面頭的裝置，對純鈦或鈦合金製成的被減面材進行減面的方法，包含在前述電極與前述被減面材之間的電解電壓為1~25V、電流密度為0.1~2.5A/cm&lt;sup&gt;2&lt;/sup&gt;、以及電解液流速為1.0~3.0m/秒的條件下，使用前述旋轉減面頭對前述被減面材進行減面的工程的方法。又，本發明的一實施形態係提供使用具備有電極和磨石的旋轉減面頭的裝置，對鎳基合金製成的被減面材進行減面的方法，包含在前述電極與前述被減面材之間的電解電壓為25~40V、電流密度為1.0~15.0A/cm&lt;sup&gt;2&lt;/sup&gt;、以及電解液流速為1.0~4.0m/秒的條件下，使用前述旋轉減面頭對前述被減面材進行減面的工程的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:旋轉減面頭</p>
        <p type="p">40:電解液供給部</p>
        <p type="p">50:通電部</p>
        <p type="p">60:絕緣聯軸器</p>
        <p type="p">70:頭部旋轉馬達</p>
        <p type="p">80:昇降裝置</p>
        <p type="p">100:電解減面裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="883" publication-number="202616349">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616349</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118486</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>二次離子質譜法系統的自動校準</chinese-title>
        <english-title>AUTOMATED CALIBRATION OF SECONDARY ION MASS SPECTROMETRY SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01J49/00</main-classification>
        <further-classification edition="200601120260102B">H01J49/02</further-classification>
        <further-classification edition="200601120260102B">H01J49/14</further-classification>
        <further-classification edition="201801120260102B">G01N23/2258</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　明宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, MING HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯理費特薩　阿朗拉馬斯瓦米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SRIVATSA, ARUN RAMASWAMY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法可以包括將二次離子質譜法（SIMS）系統的線圈電流設置為初始線圈電流設置；在該初始線圈電流設置下確定第一樣本的第一量測結果；自動變更該線圈電流至一或多種額外線圈電流設置，該一或多種額外線圈電流設置相對於該初始線圈電流設置具有高達閾值增量；確定在該一或多種額外線圈電流設置下的該第一樣本的一或多個額外量測結果；從該一或多個額外量測結果辨識具有最大值的最大量測結果；以及基於將該線圈電流設置為對應於該最大量測結果的目標線圈電流設置來校準該SIMS系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method can include setting a coil current of a secondary ion mass spectrometry (SIMS) system to an initial coil current setting, determining a first measurement of a first sample at the initial coil current setting, automatically varying the coil current to one or more additional coil current settings that have up to a threshold delta from the initial coil current setting, determining one or more additional measurements of the first sample at the one or more additional coil current settings, identifying, from the one or more additional measurements, a maximal measurement that has a maximal value, and calibrating the SIMS system based on setting the coil current to a target coil current setting corresponding to the maximal measurement.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400A:方法</p>
        <p type="p">410A:操作</p>
        <p type="p">420A:操作</p>
        <p type="p">430A:操作</p>
        <p type="p">440A:操作</p>
        <p type="p">450A:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="884" publication-number="202616813">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616813</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118503</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路裝置及其製造方法，以及產生積體電路布局圖的方法</chinese-title>
        <english-title>INTEGRATE CIRCUIT DEVICE, MANUFACTURING METHOD THEREOF, AND METHOD OF GENERATING INTEGRATE CIRCUIT LAYOUT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250901B">H10B10/00</main-classification>
        <further-classification edition="202501120250901B">H10D89/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王屏薇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種IC裝置，其包括組態為SRAM的CFET，第一CFET包括在第一及第二高度處沿著第一方向的第一下拉電晶體及上拉電晶體，第二及第三CFET包括在第一高度處並在垂直於第一方向的第二及第三方向上與第一下拉電晶體對準的通道閘，第四CFET包括在第一及第二高度處並在第二及第一方向上與通道閘對準的第二下拉電晶體及第二上拉電晶體。第一及第二位元線在第三高度處在第三方向上延伸並電連接至通道閘之S/D結構，參考電壓線在第三高度處的位元線之間延伸並電連接至下拉電晶體中之S/D結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An IC device includes CFETs configured as a SRAM, a first CFET includes first pull-down and pull-up transistors at first and second elevations along a first direction, second and third CFETs includes pass gates at the first elevation and aligned with the first pull-down transistor in second and third directions perpendicular to the first direction, and a fourth CFET includes second pull-down and pull-up transistors at the first and second elevations and aligned with the pass gates in the second and third directions. First and second bit lines extend in the third direction at a third elevation and are electrically connected to S/D structures of the pass gates, and a reference voltage line extends between the bit lines at the third elevation and is electrically connected to a S/D structure of a pull-down transistor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:方法</p>
        <p type="p">502~506:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="885" publication-number="202616423">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616423</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118531</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用脈衝電阻式加熱之熱處理方法及設備</chinese-title>
        <english-title>METHOD AND APPARATUS FOR THERMAL PROCESSING USING PULSED RESISTANCE HEATING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/67</main-classification>
        <further-classification edition="200601120260102B">H05B3/00</further-classification>
        <further-classification edition="200601120260102B">H01L21/02</further-classification>
        <further-classification edition="200601120260102B">H01L23/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商脈衝鍛造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PULSEFORGE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施洛德　寇特　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHRODER, KURT A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑克森　道格拉斯　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JACKSON, DOUGLAS K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>圖爾卡尼　維克拉姆　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TURKANI, VIKRAM SHREESHAIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種用於暫時承載一電子結構以進行熱處理之載體以及其對應系統及使用方法。該載體包括一導電層(「ECL」)，該ECL界定一電流可行進通過之至少一個電流路徑。該載體經組配以連接至一電流源，以便使脈衝電流穿過該電流路徑，以在該載體之一工作區域中產生熱量。該載體經組配以在該工作區域附近承載一電子結構。當該電流源用以在該載體中產生熱量時，執行該電子結構之熱處理。該電子結構及該載體之一溫度係藉由控制該脈衝電流之強度、持續時間及週期來調節。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A carrier for temporarily carrying an electronics structure for thermal processing and corresponding system and methods for using the same. The carrier includes an electrically conductive layer ("ECL") that defines at least one current path through which a current can travel. The carrier is configured to be connected to a current source so pulsed current is passed through the current path to generate heat in a working area of the carrier. The carrier is configured to carry an electronics structure near the working area. When the current source is used to generate heat in the carrier, thermal processing of the electronics structure is performed. A temperature of the electronics structure and the carrier is regulated by controlling the intensity, duration, and period of the pulsed current.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電阻式電子結構處理系統</p>
        <p type="p">12:電路</p>
        <p type="p">20:可移動可重複使用載體，經ECL塗佈載體</p>
        <p type="p">22:導電層(「ECL」)</p>
        <p type="p">24:工作表面</p>
        <p type="p">26:第一電氣接點</p>
        <p type="p">28:第二電氣接點</p>
        <p type="p">30:電路路徑</p>
        <p type="p">32:元件</p>
        <p type="p">34:元件</p>
        <p type="p">40:脈衝電流源</p>
        <p type="p">50:可熱固化材料層，固化層，處理基體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="886" publication-number="202616895">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616895</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118552</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路裝置、其單元區及其形成方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT DEVICE, CELL REGION THEREOF AND METHOD OF FORMING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251001B">H10D89/10</main-classification>
        <further-classification edition="202001120251001B">G06F30/392</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳顗伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧麒友</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳順利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHUN LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周雅琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, YA-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巫承霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHEN-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田麗鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIEN, LI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯永清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, YUNG-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種(裝置的)單元區，包含第一主動區、多個第一金屬至源極/汲極觸點結構及多個段。多個第一金屬至源極/汲極觸點結構與多個貝塔跡線對準。多個段在第一金屬化層中與多個阿爾法跡線對準。針對一或多個第一位置或第二位置，第一主動區的對應區可組態為源極區或汲極區。針對一或多個第三位置，第一主動區的對應區可組態為源極區，但不可組態為汲極區。針對一或多個第四位置，第一主動區的對應區不可組態為源極區或汲極區。第一位置至第四位置中之各者位於對應的阿爾法跡線與對應的貝塔跡線的交點處。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cell region (of a device) includes: a first active region (AR); first MD structures aligning to beta tracks; and in a first metallization layer, segments aligning to alpha tracks. For one or more first or second locations, a corresponding region of the first AR is configurable as a source region or a drain region. For one or more third locations, a corresponding region of the first AR is configurable as a source region, but not as a drain region. For one or more fourth locations, a corresponding region of the AR is not configurable as a source region or a drain region. Each of the first to fourth locations is at an intersection of a corresponding alpha track and a corresponding beta track.</p>
      </isu-abst>
      <representative-img>
        <p type="p">204A:單元區</p>
        <p type="p">206(1):主動區</p>
        <p type="p">210:閘極段</p>
        <p type="p">212:隔離虛設閘極結構</p>
        <p type="p">214:MD結構</p>
        <p type="p">216:M0_PG段</p>
        <p type="p">218:M0_rte段</p>
        <p type="p">220:第一位置/位置</p>
        <p type="p">222:第二位置/位置</p>
        <p type="p">224:第三位置/位置</p>
        <p type="p">226:第四位置/位置</p>
        <p type="p">228:虛線</p>
        <p type="p">230(1)~230(2):M1_PG段</p>
        <p type="p">232:M1_rte段</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="887" publication-number="202616213">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616213</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118588</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電腦程式、資料生成方法、學習模型生成方法及資訊處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260112B">G06T7/00</main-classification>
        <further-classification edition="201701120260112B">G06T7/246</further-classification>
        <further-classification edition="202201120260112B">G06V10/764</further-classification>
        <further-classification edition="202201120260112B">G06V10/774</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林累輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, RUIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種可望支援基於影像的基板處理之動作解析等的電腦程式、資料生成方法、學習模型生成方法及資訊處理裝置。  &lt;br/&gt;依本發明之實施態樣的電腦程式係使電腦執行以下處理：取得對基板處理進行攝影而得的動態影像；及基於取得到的該動態影像所包含之第一時點的訊框影像，及在該第一時點之後的第二時點之訊框影像，而生成擴充資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="888" publication-number="202615695">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615695</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118590</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體基板的耐久性背面層</chinese-title>
        <english-title>DURABLE BACKSIDE LAYER OF A SEMICONDUCTOR SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">C23C16/30</main-classification>
        <further-classification edition="200601120260107B">C23C16/34</further-classification>
        <further-classification edition="200601120260107B">C23C16/40</further-classification>
        <further-classification edition="200601120260107B">C23C16/455</further-classification>
        <further-classification edition="200601120260107B">C23C16/458</further-classification>
        <further-classification edition="200601120260107B">C23C16/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊慧慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HUI HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高珺賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, JUNXIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雯晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, WENQING NMN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷通</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEI, TONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遲玉山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI, YUSHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供在半導體基板上沉積背側層的方法和設備。在一些實施例中，這些技術可以包含：在該半導體基板的背側上沉積第一材料層；及在該第一材料層上方沉積第二材料層，以在該半導體基板的該背側上共同形成材料堆疊，該第二材料層包含比該第一材料層更低​​的拉伸應力或更低的壓縮應力，該材料堆疊包含比該第一材料層更高的化學阻抗性質。在一些實施例中，這些技術可以包含：在第一處理腔室中，在該半導體基板的背側上沉積密封層；及在該密封層上方沉積矽氧碳化物（SiOC）層，以在該半導體基板的該背側上共同形成材料堆疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and apparatus for deposition of a backside layer on a semiconductor substrate are provided. In some embodiments, such techniques may include: depositing a first layer of material on a backside of the semiconductor substrate; and depositing a second layer of material over the first layer of material to collectively form a stack of materials on the backside of the semiconductor substrate, the second layer of material comprising a lower tensile stress or a lower compressive stress than that of the first layer of material, the stack of materials comprising a greater chemically resistive property than that of the first layer of material. In some implementations, such techniques may include: depositing a sealing layer on a backside of the semiconductor substrate in a first process chamber; and depositing a silicon oxycarbide (SiOC) layer over the sealing layer to collectively form a stack of materials on the backside.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:半導體基板</p>
        <p type="p">201:增強型背側層</p>
        <p type="p">202:功能層</p>
        <p type="p">204:封裝層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="889" publication-number="202616424">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616424</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118599</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有含鋁氮化物墊片的半導體處理腔室用組件</chinese-title>
        <english-title>AN ASSEMBLY FOR A SEMICONDUCTOR PROCESSING CHAMBER WITH AN ALUMINUM NITRIDE CONTAINING GASKET</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/67</main-classification>
        <further-classification edition="200601120260102B">H01L21/687</further-classification>
        <further-classification edition="200601120260102B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許　臨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史琳瓦森　撒第斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SRINIVASAN, SATISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達芬提　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAUGHERTY, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本說明書提供一種氣體分配組件用於具有內部的半導體處理腔室。背板具有面向半導體處理腔室之內部的第一側上以及遠離半導體處理腔室之內部的第二側上。至少一電極在背板之第一側上。墊片位於背板及該至少一電極之間。墊片包含含鋁氮化物(AlN)芯材、位於含AlN芯材之第一側上的第一接觸層以及位於與含AlN芯材之第一側上相對的含AlN芯材之第二側上的第二接觸層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A gas distribution assembly for use in a semiconductor processing chamber with an interior is provided. A back plate has a first side facing toward the interior of the semiconductor processing chamber and a second side away from the interior of the semiconductor processing chamber. At least one electrode is on the first side of the back plate. A gasket is between the back plate and the at least one electrode. The gasket comprises an aluminum nitride (AlN) containing core, a first contact layer on a first side of the AlN containing core, and a second contact layer on a second side of the AlN containing core opposite from the first side of the AlN containing core.</p>
      </isu-abst>
      <representative-img>
        <p type="p">212:墊片</p>
        <p type="p">216a:孔</p>
        <p type="p">216b:孔</p>
        <p type="p">300:氣體分配組件</p>
        <p type="p">304:背板</p>
        <p type="p">316:電極</p>
        <p type="p">320:電饋通</p>
        <p type="p">324:調諧電路</p>
        <p type="p">328:氣體源</p>
        <p type="p">332:孔</p>
        <p type="p">336:流體連接器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="890" publication-number="202616480">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616480</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118612</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高密度碳硬遮罩(CHM)的應力控制</chinese-title>
        <english-title>STRESS CONTROL OF HIGH-DENSITY CARBON HARDMASK (CHM)</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H01L23/00</main-classification>
        <further-classification edition="200601120260112B">H01L21/033</further-classification>
        <further-classification edition="200601120260112B">H01L21/66</further-classification>
        <further-classification edition="200601120260112B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙　建平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, JIANPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施勒希特　查爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHLECHTE, CHARLES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡羅爾　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARROLL, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡特薩克　彼得　洛威爾　喬治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VENTZEK, PETER LOWELL GEORGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種微製造方法。方法包含提供具有作業表面的晶圓。執行修正層配方，以於作業表面上形成修正層。於修正層上形成碳硬遮罩（CHM）層。基於CHM層而決定修正層配方，以使在形成修正層與CHM層之後晶圓具有在閾值內的晶圓彎曲值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of microfabrication is provided. The method includes providing a wafer having a working surface. A correction layer recipe is executed to form a correction layer over the working surface. A carbon hardmask (CHM) layer is formed over the correction layer. The correction layer recipe is determined based on the CHM layer so that the wafer has a wafer bow value within a threshold after the correction layer and the CHM layer are formed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:示意圖</p>
        <p type="p">201:壓縮晶圓形狀</p>
        <p type="p">203:拉伸晶圓形狀</p>
        <p type="p">211:壓縮晶圓表面</p>
        <p type="p">213:平坦晶圓表面</p>
        <p type="p">215:拉伸晶圓表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="891" publication-number="202616214">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616214</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118626</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>設計評價系統、設計評價方法及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260109B">G06T7/00</main-classification>
        <further-classification edition="201201120260109B">G06Q50/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商凸版控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOPPAN HOLDINGS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大鋸泰斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOGA, YASUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長谷隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGATANI, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">設計評價系統具備：特徵數值化部，其依據已學習了表示材料設計的材料影像、與前述設計的外觀之特徵經數值化後的特徵量之第1對應關係的第1學習完成模型，將作為評價對象被輸入的材料影像所示之材料設計的外觀之特徵予以數值化，而生成表示前述評價對象的特徵量之特徵量資訊；及感性數值化部，其依據已學習了前述特徵量、與表示前述設計的外觀之感性詞彙經數值化後的感性量之第2對應關係的第2學習完成模型，將和所輸入的前述特徵量資訊所示之前述評價對象的特徵量對應的前述感性詞彙予以數值化，而生成表示前述評價對象的感性量之感性量資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="892" publication-number="202615837">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615837</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118630</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢測夾具、檢測系統、用於使用檢測夾具及檢測系統檢測工件之檢測方法及電腦程式產品</chinese-title>
        <english-title>INSPECTION FIXTURES, INSPECTION SYSTEMS, INSPECTION METHODS, AND COMPUTER PROGRAM PRODUCTS FOR INSPECTING WORKPIECES USING INSPECTION FIXTURES AND INSPECTION SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260112B">G01M13/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法爾科內　克里斯托弗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FALCONE, CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮亞佐　萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PIAZZO, RYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕拉梅什瓦蘭　什雷亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARAMESHWARAN, SHREYAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南德瓦納　丁卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANDWANA, DINKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>圖爾希巴格瓦萊　謝什拉傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TULSHIBAGWALE, SHESHRAJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧爾丹諾夫　奧爾丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IORDANOV, IORDAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈利爾　奧薩馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHALIL, OSAMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉比諾維奇　亞歷克斯　瑞安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RABINOVICH, ALEX RYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種檢測夾具，其包括用以支撐一工件之一基座、一背壓感測器以及一聚焦平面陣列。此背壓感測器耦接至基座以獲取穿過經支撐在此檢測夾具之此基座上之此工件中所界定的一第一流動孔口及一第二流動孔口中之一者的一流體之背壓。此光學聚焦平面陣列亦耦接至此基座以獲取包括經支撐在此檢測夾具之此基座上之此工件中所界定的此第一流動孔口及此第二流動孔口中之一或多者的此工件之一部分之光學影像資料。本揭露亦描述用於檢測工件之檢測系統、檢測方法以及電腦程式產品。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An inspection fixture includes a seat to support a workpiece, a backpressure sensor and a focal plane array. The backpressure sensor is coupled to seat to acquire backpressure of a fluid traversing one of a first flow aperture and a second flow aperture defined in the workpiece supported on the seat of the inspection fixture. The optical focal plane array is also coupled to the seat to acquire optical image data of a portion of the workpiece including one or more of the first flow aperture and the second flow aperture defined in the workpiece supported on the seat of the inspection fixture. Inspection systems, inspection methods, and computer program products for inspecting workpieces are also described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">28:工件</p>
        <p type="p">38:第一流動孔口</p>
        <p type="p">40:第二流動孔口</p>
        <p type="p">54:工件主體</p>
        <p type="p">56:金屬材料</p>
        <p type="p">58:第一表面</p>
        <p type="p">60:第二表面</p>
        <p type="p">62:厚度</p>
        <p type="p">64:第一流動孔口</p>
        <p type="p">66:第一寬度</p>
        <p type="p">68:第二流動孔口</p>
        <p type="p">70:第二寬度</p>
        <p type="p">72:腔室固定特徵</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="893" publication-number="202616881">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616881</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118644</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251127B">H10D84/01</main-classification>
        <further-classification edition="202501120251127B">H10D84/83</further-classification>
        <further-classification edition="202501120251127B">H10D30/62</further-classification>
        <further-classification edition="200601120251127B">H01L21/265</further-classification>
        <further-classification edition="200601120251127B">H01L21/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王屏薇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳稚軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了半導體裝置和製造方法。一種示例性方法包括形成第一鰭片和第二鰭片，第一鰭片和第二鰭片之每一者包括與複數犧牲層交錯的複數通道層，個別在第一鰭片和第二鰭片上方形成第一閘極堆疊和第二閘極堆疊，第一閘極堆疊和第二閘極堆疊具有不同的閘極長度，形成與第一閘極堆疊相鄰的第一源極/汲極特徵和與第二閘極堆疊相鄰的第二源極/汲極特徵，在形成第二源極/汲極特徵之後，執行離子注入製程，以增加第二源極/汲極特徵的上部的摻雜濃度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Semiconductor devices and fabricating methods are provided. An exemplary method includes forming a first fin and a second fin, each of the first fin and the second fin comprising a plurality of channel layers interleaved by a plurality of sacrificial layers, forming a first gate stack and a second gate stack over the first fin and the second fin, respectively, the first gate stack and the second gate stack having different gate lengths, forming a first source/drain feature adjacent to the first gate stack and a second source/drain feature adjacent to the second gate stack, after forming the second source/drain feature, performing an ion implantation process to increase a dopant concentration of an upper portion of the second source/drain feature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102~122:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="894" publication-number="202616531">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616531</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118652</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於冷卻晶粒堆疊的方法及設備</chinese-title>
        <english-title>METHODS AND APPARATUS FOR COOLING DIE STACKS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">H01L25/065</main-classification>
        <further-classification edition="200601120260102B">H01L23/48</further-classification>
        <further-classification edition="200601120260102B">H01L23/427</further-classification>
        <further-classification edition="200601120260102B">H01L23/373</further-classification>
        <further-classification edition="200601120260102B">H01L23/00</further-classification>
        <further-classification edition="200601120260102B">H01L21/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈巴　貝高森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HABA, BELGACEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡特卡　拉杰詡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATKAR, RAJESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電子封裝，其可包含：第一晶粒；冷卻元件，其安置於該第一晶粒上方；第二晶粒，其安置於該冷卻元件上方；及複數個通孔，其從該第一晶粒延伸穿過該冷卻元件至該第二晶粒。該冷卻元件可包含至少一個空腔。該至少一個空腔可包含安置於該至少一個空腔之內部表面上方的芯吸層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronics package can comprise a first die, a cooling element disposed over the first die, a second die disposed over the cooling element, and a plurality of vias extending through the cooling element from the first die to the second die. The cooling element can comprise at least one cavity. The at least one cavity can comprise a wicking layer disposed over an interior surface of the at least one cavity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子封裝</p>
        <p type="p">102:第一晶粒</p>
        <p type="p">104:第二晶粒</p>
        <p type="p">106:冷卻元件/熱管元件/接合結構</p>
        <p type="p">108:空腔/熱管</p>
        <p type="p">108a:第一空腔</p>
        <p type="p">108b:第二空腔</p>
        <p type="p">110:互連件/TSV</p>
        <p type="p">114:芯吸層/表面/芯吸材料</p>
        <p type="p">119:彎曲部</p>
        <p type="p">120:虛設晶粒</p>
        <p type="p">122:上部表面</p>
        <p type="p">124:基板材料</p>
        <p type="p">d:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="895" publication-number="202616425">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616425</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118665</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體製造裝置、照明裝置、半導體裝置的製造方法及照明方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">H01L21/67</main-classification>
        <further-classification edition="200601120251201B">H01L21/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商捷進科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FASFORD TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本啓太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, KEITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三浦宏太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIURA, KOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小橋英晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBASHI, HIDEHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種可以使晶粒接合器的大小變得輕巧化的技術。  &lt;br/&gt;　　[解決手段]半導體製造裝置，係具備：第一拍攝裝置，其拍攝第一拍攝對象物；第二拍攝裝置，其拍攝第二拍攝對象物；照明裝置，其朝第一方向延伸，且由前述第一拍攝裝置與前述第二拍攝裝置共用；第一支撐部，其支撐前述第一拍攝對象物；以及第二支撐部，其支撐前述第二拍攝對象物，且不同於前述第一支撐部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">12:晶圓保持台(第一支撐部)</p>
        <p type="p">13:剝離單元</p>
        <p type="p">14:晶圓辨識相機(第一拍攝裝置)</p>
        <p type="p">21:拾取頭</p>
        <p type="p">22:夾頭</p>
        <p type="p">31:中間載台(第三支撐部)</p>
        <p type="p">34:載台辨識相機(第三拍攝裝置)</p>
        <p type="p">41:接合頭</p>
        <p type="p">42:夾頭</p>
        <p type="p">44:基板辨識相機(第二拍攝裝置)</p>
        <p type="p">46:接合載台(第二支撐部)</p>
        <p type="p">80:控制部</p>
        <p type="p">100:同軸照明裝置(照明裝置)</p>
        <p type="p">101:點光源</p>
        <p type="p">102:光源基板</p>
        <p type="p">103:發光面</p>
        <p type="p">104:半透射鏡</p>
        <p type="p">D:晶粒</p>
        <p type="p">DT:切割帶</p>
        <p type="p">S:基板</p>
        <p type="p">W:晶圓</p>
        <p type="p">WR:晶圓環</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="896" publication-number="202616506">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616506</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118758</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路及其測試方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT AND TESTING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251027B">H01L23/52</main-classification>
        <further-classification edition="202301120251027B">H01L25/16</further-classification>
        <further-classification edition="200601120251027B">H01L21/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張盟昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, MENG-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種積體電路包含複數個半導體裸晶片、一電源網路及一電源控制電路。該些半導體裸晶片可設置於一單一半導體基板上。該些半導體裸晶片中的每一者可包含複數個操作模組。複數個電源開關可分別耦接至該些操作模組。該電源網路可相對於該些半導體裸晶片設置。該電源控制電路可用以：接收指示該些半導體裸晶片中之至少一者的一或多個操作模組已損壞的一第一信號；且基於該第一信號來發送一第二信號至分別耦接至該一或多個操作模組的該些對應電源開關，以便斷開該電源電壓而不提供至該一或多個操作模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated circuit comprises a plurality of semiconductor dies, a power network, and a power control circuit. The plurality of semiconductor dies can be disposed on a single semiconductor substrate. Each of the plurality of semiconductor dies may comprise a plurality of operative modules. A plurality of power switches can be coupled to the plurality of operative modules, respectively. The power network can be disposed with respect to the plurality of semiconductor dies. The power control circuit can be configured to: receive a first signal indicating one or more operative modules of at least one of the plurality of semiconductor dies have failed; and based on the first signal, send a second signal to the corresponding power switches coupled to the one or more operative modules, respectively, so as to disconnect the supply voltage from being provided to the one or more operative modules.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:積體電路</p>
        <p type="p">100a:半導體裸晶片/裸晶片1</p>
        <p type="p">100b:半導體裸晶片/裸晶片2</p>
        <p type="p">100n:半導體裸晶片/裸晶片N</p>
        <p type="p">102:電源開關/頭端</p>
        <p type="p">104:操作模組</p>
        <p type="p">110:電源網路/Power_global</p>
        <p type="p">120:電源控制電路</p>
        <p type="p">PD_d1m1:信號</p>
        <p type="p">PD_d1m2:信號</p>
        <p type="p">PD_d1mN:信號</p>
        <p type="p">PD_d2m1:信號</p>
        <p type="p">PD_d2m2:信號</p>
        <p type="p">PD_d2mN:信號</p>
        <p type="p">PD_dNm1:信號</p>
        <p type="p">PD_dNm2:信號</p>
        <p type="p">PD_dNmN:信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="897" publication-number="202615155">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615155</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118762</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電腦程式、資訊處理方法及資訊處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">B05B12/08</main-classification>
        <further-classification edition="200601120260112B">B05C11/10</further-classification>
        <further-classification edition="201701120260112B">G06T7/00</further-classification>
        <further-classification edition="202201120260112B">G06V10/764</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小川雅之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGAWA, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]&lt;br/&gt;  提供能夠預期達成「判定與基板處理中之藥液或清洗液等液體之噴吐相關的狀態」之效果的電腦程式、資訊處理方法及資訊處理裝置。&lt;br/&gt;  [解決手段]&lt;br/&gt;  依本實施態樣之電腦程式，使電腦執行以下處理：&lt;br/&gt;  取得拍攝有基板處理裝置的噴吐部向作為處理對象之基板噴吐液體的動態影像；&lt;br/&gt;  將包含在所取得的該動態影像中的訊框影像輸入至進行了機器學習的學習模型，其中，該機器學習使該學習模型將該噴吐部的影像作為輸入接收，並輸出關於來自該噴吐部之液體的噴吐狀態的資訊；&lt;br/&gt;  取得該學習模型所輸出之關於噴吐狀態的資訊；及&lt;br/&gt;  基於所取得的該資訊，判定液體的噴吐正常與否。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板處理裝置</p>
        <p type="p">11:腔室</p>
        <p type="p">12:基板固持機構</p>
        <p type="p">12a:固持部</p>
        <p type="p">12b:支柱部</p>
        <p type="p">12c:驅動部</p>
        <p type="p">13:噴吐部</p>
        <p type="p">14:回收杯</p>
        <p type="p">14a:排液口</p>
        <p type="p">14b:排氣口</p>
        <p type="p">15:風扇過濾器單元</p>
        <p type="p">16:供給源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="898" publication-number="202615667">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615667</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118795</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>作為無標記結合試驗之探針之細菌細胞壁組分及其用途</chinese-title>
        <english-title>BACTERIAL CELL WALL COMPONENTS AS PROBES FOR A LABEL-FREE BINDING ASSAY AND THE USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C12Q1/18</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中央研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACADEMIA SINICA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭偉杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, WEI-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JUNG-LEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鈞楷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUN-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供肽聚糖前驅物及其在研究抗生素與肽聚糖結合之用途。具體而言，本揭露中的肽聚糖前驅物用於篩選針對肽聚糖的抗生素並識別肽聚糖上的結合基團之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides peptidoglycan precursors and the use thereof in the study of binding between antibiotic and peptidoglycan. Specifically, the peptidoglycan precursors disclosed herein are used in a method for the screening of peptidoglycan-targeting antibiotics and identifying the binding moiety on a peptidoglycan.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="899" publication-number="202615533">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615533</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118816</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性熱硬化型樹脂組成物、感光性覆蓋膜及撓性印刷配線板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">C08G18/28</main-classification>
        <further-classification edition="200601120260112B">G03F7/029</further-classification>
        <further-classification edition="200601120260112B">C08F2/50</further-classification>
        <further-classification edition="200601120260112B">C08L63/02</further-classification>
        <further-classification edition="200601120260112B">C08L33/10</further-classification>
        <further-classification edition="201801120260112B">C09J7/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小峰卓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMINE, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村牧人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, MAKITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種感光性熱硬化型樹脂組成物，含有預聚物、感光性單體、熱硬化性樹脂及聚合引發劑；前述預聚物含有羧酸改質雙酚型環氧(甲基)丙烯酸酯；前述感光性單體含有單官能單體，該單官能單體於1分子中具有1個(甲基)丙烯醯氧基，且數量平均分子量(Mn)為1300~36000。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:由感光性熱硬化型樹脂組成物構成之片材；片材</p>
        <p type="p">20:脫模膜</p>
        <p type="p">100:感光性覆蓋膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="900" publication-number="202615482">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615482</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118862</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗原結合蛋白</chinese-title>
        <english-title>ANTIGEN BINDING PROTEINS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07K16/40</main-classification>
        <further-classification edition="200601120260102B">A61K39/395</further-classification>
        <further-classification edition="200601120260102B">A61P13/12</further-classification>
        <further-classification edition="200601120260102B">G01N33/68</further-classification>
        <further-classification edition="200601120260102B">C12N9/00</further-classification>
        <further-classification edition="200601120260102B">C12N15/86</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商葛蘭素史密斯克藍智慧財產發展有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLAXOSMITHKLINE INTELLECTUAL PROPERTY DEVELOPMENT LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡　二丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, ERDING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛德奈　馬修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARDENER, MATTHEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係關於抗原結合蛋白。更特定言之，本揭露係關於妊娠相關血漿蛋白A (PAPPA)結合蛋白，甚至更特定言之，抑制胰島素樣生長因子結合蛋白-2 (IGFBP-2)、胰島素樣生長因子結合蛋白-4 (IGFBP-4)及胰島素樣生長因子結合蛋白-5 (IGFBP-5)之裂解的PAPPA結合蛋白。本揭露進一步係關於該等結合蛋白在醫學中之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to antigen binding proteins. More particularly the present disclosure relates to pregnancy associated plasma protein-A (PAPPA) binding proteins, even more particularly PAPPA binding proteins that inhibit cleavage of insulin like growth factor binding protein-2 (IGFBP-2), insulin like growth factor binding protein-4 (IGFBP-4) and insulin like growth factor binding protein-5 (IGFBP-5). The present disclosure further relates to the use of said binding proteins in medicine.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="901" publication-number="202615551">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615551</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118872</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有胺基苯基、異氰酸酯基或環氧官能基的Ｑ—Ｔ—Ｄ—矽氧烷系聚合物組成物及其製備方法</chinese-title>
        <english-title>Q-T-D-SILOXANE-BASED POLYMERIC COMPOSITIONS WITH AMINOPHENYL, ISOCYANATE OR EPOXIDE FUNCTIONALITY, AND METHOD FOR PREPARING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08G77/06</main-classification>
        <further-classification edition="200601120260102B">C08G77/14</further-classification>
        <further-classification edition="200601120260102B">C08G77/26</further-classification>
        <further-classification edition="200601120260102B">C08G77/28</further-classification>
        <further-classification edition="200601120260102B">C08L83/06</further-classification>
        <further-classification edition="200601120260102B">C08L83/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商矽樂信化學股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILOXENE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內梅克　馬雷克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEMEC, MAREK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西瓦拉曼　迪普坦舒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIVARAMAN, DEEPTANSHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科貝爾　馬蒂亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOEBEL, MATTHIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種官能化聚合物液態聚矽氧烷材料組成物，其包含非有機官能性Q-型矽氧烷部分及單有機官能性T-型及/或D-型矽氧烷部分，其中該組成物包含胺基苯基、二級胺、異氰酸酯基及/或環氧官能基，以及一種製造該聚合物液態聚矽氧烷材料的方法及相關的用途、該材料的調配物及製劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Functionalized polymeric liquid polysiloxane material compositions comprising non-organofunctional Q-type siloxane moieties and mono-organofunctional T-type and/or D-type siloxane moieties, wherein the composition comprises aminophenyl, secondary amine, isocyanate and/or epoxide functionalities, methods for producing the polymeric liquid polysiloxane material and associated uses, formulations and preparations of the material.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="902" publication-number="202616335">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616335</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118900</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿處理系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR PLASMA PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">H01J37/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布萊克尼　喬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLAKENEY, JOEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　智穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZHIYING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡魯思　梅根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARRUTH, MEGAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電漿處理方法，包括：將基板設置於電漿處理腔室；藉由向電漿處理腔室的頂部電極提供源功率，在電漿處理腔室中產生電漿；以及藉由向電漿處理腔室的底部電極提供波形電壓，對底部電極施加偏壓。波形電壓包括：包含複數正弦脈衝的放電步驟；以及包含負線性斜率的偏壓步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for plasma processing includes providing a substrate into a plasma processing chamber, generating a plasma in the plasma processing chamber by providing source power to a top electrode of the plasma processing chamber, and biasing a bottom electrode of the plasma processing chamber by providing a waveform voltage to the bottom electrode. The waveform voltage includes: a discharge step including multiple sinusoidal pulses, and a biasing step including a negative linear slope.</p>
      </isu-abst>
      <representative-img>
        <p type="p">40:正弦脈衝步驟</p>
        <p type="p">50:過渡步驟</p>
        <p type="p">60:補償步驟</p>
        <p type="p">T&lt;sub&gt;3&lt;/sub&gt;~T&lt;sub&gt;4&lt;/sub&gt;:步驟</p>
        <p type="p">V&lt;sub&gt;out&lt;/sub&gt;:電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="903" publication-number="202616201">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616201</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118903</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>環境資訊收集系統</chinese-title>
        <english-title>ENVIRONMENT INFORMATION COLLECTION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260112B">G06Q50/04</main-classification>
        <further-classification edition="200601120260112B">G05B23/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三浦工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIURA CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三浦浩二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIURA, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村啓二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, KEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池内裕明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEUCHI, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浅井靖浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAI, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兒玉芳弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KODAMA, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島正隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKASHIMA, MASATAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種環境資訊收集系統(1)，係用以收集設置有產業機械(2)之事業機構(3)的環境資訊，該環境資訊收集系統係具備：感測器群(50)，係包含配置於事業機構(3)內之一個以上的環境感測器(5)；及複數個資訊處理裝置(6)，係構成為可取得及蓄積由感測器群(50)所檢測到的環境資訊，且具有將環境資訊從下游側朝向上游側傳遞的階層構造。複數個資訊處理裝置(6)係構成為，在任意的一個以上的階層中，對已取得的環境資訊執行預先規定的資訊處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An environment information collection system (1) for collecting environment information of a business facility (3) where an industrial machine (2) is installed includes: a sensor group (50) including one or more environment sensors (5) located within the business facility (3); and a plurality of information processing devices (6) configured to be able to acquire and store environment information detected by the sensor group (50) and having a hierarchical structure that transmits the environment information from downstream side to upstream side. The plurality of information processing devices (6) are configured to perform a predetermined information processing on acquired environment information at one or more hierarchies.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:環境資訊收集系統</p>
        <p type="p">2:產業機械</p>
        <p type="p">2A:第一產業機械</p>
        <p type="p">2B:第二產業機械</p>
        <p type="p">3:事業機構</p>
        <p type="p">3A:第一事業機構</p>
        <p type="p">3B:第二事業機構</p>
        <p type="p">3C:第三事業機構</p>
        <p type="p">4:工廠</p>
        <p type="p">4A:第一工廠</p>
        <p type="p">4B:第二工廠</p>
        <p type="p">5:環境感測器</p>
        <p type="p">6:資訊處理裝置</p>
        <p type="p">7:資料收集終端機</p>
        <p type="p">50:感測器群</p>
        <p type="p">61:產業用控制器</p>
        <p type="p">61A:微電腦</p>
        <p type="p">61B:可程式邏輯控制器</p>
        <p type="p">62:邊緣電腦</p>
        <p type="p">63:閘道</p>
        <p type="p">64:訪客電腦</p>
        <p type="p">65:主機電腦</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="904" publication-number="202615948">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615948</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118930</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>２Ｄ／多視像可切換顯示器及其操作方法</chinese-title>
        <english-title>2D/MULTIVIEW SWITCHABLE DISPLAY AND OPERATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">G02F1/1335</main-classification>
        <further-classification edition="200601120260109B">G02F1/29</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商雷亞有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEIA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商鐳亞電子（蘇州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEIA ELECTRONICS (SUZHOU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>215500中國江蘇省蘇州市</address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張小俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIAOJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出了一種2D/多視像可切換顯示器，包括：顯示面板，被配置為提供合成影像的像素，該合成影像包括多視像影像內容和二維（2D）影像內容；透鏡裝置，包括形成透鏡元件陣列的第一材料層和第二材料層，該第一材料層和該第二材料層中的一個包括具有第一折射率的雙折射材料；可切換液晶裝置，被佈置在顯示面板與透鏡裝置之間並且具有電控雙折射率，可切換液晶裝置被配置為：在顯示面板顯示2D影像內容時，將入射光折射率調整為與第一折射率匹配；並且在顯示面板顯示多視像影像內容時，將入射光折射率調整為與第一折射率不匹配。本發明還提出了操作2D/多視像可切換顯示器的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">700:方法</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="905" publication-number="202615705">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615705</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118988</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬化前驅物及機載組合化學合成</chinese-title>
        <english-title>METALLIZATION PRECURSORS AND ONBOARD COMBINATORIAL CHEMICAL SYNTHESIS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C23C16/455</main-classification>
        <further-classification edition="200601120260105B">C23C16/04</further-classification>
        <further-classification edition="200601120260105B">H01L21/285</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼迪亞　大衛　約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANDIA, DAVID JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格里菲斯　馬修　伯特倫　愛德華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRIFFITHS, MATTHEW BERTRAM EDWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波利克　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PLOKHIKH, ALEKSANDR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿格紐　道格拉斯　華特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGNEW, DOUGLAS WALTER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱爾卡爾　桑凱特　沙拉德雷達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KELKAR, SANKET SHARADCHANDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派翠利亞　珍妮佛　莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PETRAGLIA, JENNIFER LEIGH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供用於遠端形成氣體混合物以使用混合金屬鹵化物前驅物沉積金屬之方法及設備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and apparatuses for forming gas mixtures remotely to deposit metal using a mixed metal halide precursor are provided herein.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:操作</p>
        <p type="p">104:操作</p>
        <p type="p">106:操作</p>
        <p type="p">108:操作</p>
        <p type="p">110:操作</p>
        <p type="p">112:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="906" publication-number="202615247">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615247</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119004</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多層相位差薄膜及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260102B">B32B7/023</main-classification>
        <further-classification edition="202001120260102B">C08J7/04</further-classification>
        <further-classification edition="200601120260102B">G02B5/30</further-classification>
        <further-classification edition="200601120260102B">G02F1/13363</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本瑞翁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZEON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波多野拓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATANO, TAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大里和弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSATO, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種多層相位差薄膜，其包含第一相位差層及第二相位差層，其中前述第一相位差層的面內延遲超過0 nm且為60 nm以下並且厚度方向延遲為50 nm以上且150 nm以下，前述第二相位差層的面內延遲為100 nm以上且150 nm以下並且厚度方向延遲為－150 nm以上且－50 nm以下並且NZ係數NZ超過－0.5且為0.0以下，前述第二相位差層之慢軸方向相對於前述第一相位差層之慢軸方向所夾之角度為10°以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:多層相位差薄膜</p>
        <p type="p">110:第一相位差層</p>
        <p type="p">120:第二相位差層</p>
        <p type="p">A&lt;sub&gt;110&lt;/sub&gt;,A&lt;sub&gt;120&lt;/sub&gt;:慢軸</p>
        <p type="p">θ&lt;sub&gt;1-2&lt;/sub&gt;:角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="907" publication-number="202615160">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615160</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119005</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於產生光學效應層的裝置及製程</chinese-title>
        <english-title>APPARATUSES AND PROCESSES FOR PRODUCING OPTICAL EFFECTS LAYERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">B05D3/06</main-classification>
        <further-classification edition="200601120260112B">B05D3/00</further-classification>
        <further-classification edition="200601120260112B">B05D5/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商西克帕控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SICPA HOLDING SA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼克瑟瑞斯迦內波爾　奈達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKSERESHT GHANEPOUR, NEDA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祖林登　蒂博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZURLINDEN, THIBAULT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡勒嘉里　安德雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CALLEGARI, ANDREA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於保護安全文件(諸如舉例而言，鈔票及身份文件)免受偽造及非法複製的領域。具體而言，本發明提供了用於產生包含磁性定向的光學效應層(OEL)的裝置及製程，所述光學效應層(OEL)在傾斜時不僅表現出動態運動，且亦表現出醒目的浮雕及/或3D效果，可用作安全文件或安全製品的防偽手段，或用於裝飾目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to the field of the protection of security documents such as for example banknotes and identity documents against counterfeit and illegal reproduction. In particular, the present invention provides apparatuses and processes for producing optical effect layers (OEL) comprising magnetically oriented, said optical effect layers (OEL) exhibiting not only a dynamic movement but also an eye-catching relief and/or 3D effect upon tilting and may be used as anti- counterfeit means on security documents or security articles or for decorative purposes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:裝置</p>
        <p type="p">110:基板</p>
        <p type="p">120:塗佈層</p>
        <p type="p">130:軟磁板</p>
        <p type="p">131:凹痕</p>
        <p type="p">132:空隙</p>
        <p type="p">140:磁場產生元件</p>
        <p type="p">150:非磁性支架殼體</p>
        <p type="p">160:磁性組件</p>
        <p type="p">170:固化單元</p>
        <p type="p">1100:組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="908" publication-number="202615154">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615154</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119024</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含電導體粒子及電絕緣體粒子之混合物的分離方法及靜電分離裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">B03C7/06</main-classification>
        <further-classification edition="202301120260112B">C02F1/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商可樂麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURARAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中田治生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKADA, HARUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>靍田拓大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSURUTA, TAKUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩崎秀治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWASAKI, HIDEHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的一形態係關於一種分離方法，其係在包含電導體粒子及電絕緣體粒子的混合物中，分離前述電導體粒子與前述電絕緣體粒子之分離方法，其包含：在第一電極上通過前述混合物、對前述混合物施加電荷、將未帶電的前述電絕緣體粒子吸引到前述第一電極、及將帶電的前述電導體粒子吸引到第二電極，且前述電導體粒子的密度d1與前述電絕緣體粒子的密度d2滿足0.2≦d1/d2≦1。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:靜電分離裝置</p>
        <p type="p">2:供給手段</p>
        <p type="p">3:電暈放電裝置</p>
        <p type="p">4:第一電極</p>
        <p type="p">5:第二電極</p>
        <p type="p">6:刮刀</p>
        <p type="p">7:隔板</p>
        <p type="p">8:分離容器</p>
        <p type="p">9:電導體粒子</p>
        <p type="p">10:電絕緣體粒子</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="909" publication-number="202615713">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615713</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119064</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>增加壽命的基板支撐組件</chinese-title>
        <english-title>INCREASED LIFE SUBSTRATE SUPPORT ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">C23C16/458</main-classification>
        <further-classification edition="200601120260112B">C23C16/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高若特拉　安奇特艾托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GORATELA, ANKIT ATUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黎　堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班莎　阿米特庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANSAL, AMIT KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史維史達瓦　夏蘭德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SRIVASTAVA, SHAILENDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布萊瑟維特　艾默森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRAITHWAITE, EMERSON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密哈　拉菲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIMHA, RAVI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文的實施例通常係針對用於電漿處理腔室的基板支撐組件。基板支撐組件包括支撐主體、具有基板支撐表面且從支撐主體的頂表面延伸的支撐突起、沿著支撐主體外邊緣設置的邊緣凹槽，以及具有邊緣支撐表面的邊緣環，該邊緣環設置於並可拆卸式耦合至支撐主體的頂表面上，邊緣環部分設置於邊緣凹槽中。在另一個實施例中，支撐環位於頂表面上，在邊緣環與支撐突起之間。在又一個實施例中，內部加熱元件和外部加熱元件嵌入支撐主體中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments herein are generally directed to a substrate support assembly for use in a plasma processing chamber. The substrate support assembly includes a support body, a support protrusion having a substrate support surface and extending from a top surface of the support body, an edge recess disposed along an outer edge of the support body, and an edge ring having an edge support surface and disposed on and removably coupled to the top surface of the support body, the edge ring being partially disposed in the edge recess. In another embodiment, a support ring is disposed on the top surface between the edge ring and the support protrusion. In yet another embodiment, an inner heating element and an outer heating element is embedded in the support body.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電漿處理腔室</p>
        <p type="p">102:電漿</p>
        <p type="p">104:蓋子</p>
        <p type="p">105:襯墊</p>
        <p type="p">106:腔室主體</p>
        <p type="p">108:平臺</p>
        <p type="p">109:升舉銷</p>
        <p type="p">110:波紋管組件</p>
        <p type="p">111:軸</p>
        <p type="p">112:中空支撐軸</p>
        <p type="p">113:升降機構</p>
        <p type="p">114:泵送系統</p>
        <p type="p">115:接地</p>
        <p type="p">117:偏壓電源</p>
        <p type="p">118:製程氣體供應器</p>
        <p type="p">120:腔室內部體積</p>
        <p type="p">121:處理體積</p>
        <p type="p">122:基板</p>
        <p type="p">124:基板支撐</p>
        <p type="p">126:底表面</p>
        <p type="p">130:基板升舉組件</p>
        <p type="p">131:波紋管組件</p>
        <p type="p">132:第二升舉機構</p>
        <p type="p">140:負脈衝DC電源</p>
        <p type="p">141:背部氣體供應器</p>
        <p type="p">150:靜電卡盤組件</p>
        <p type="p">152:靜電卡盤</p>
        <p type="p">154:吸附電極</p>
        <p type="p">170:RF電漿電源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="910" publication-number="202615936">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615936</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119089</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>隱形眼鏡中的改進或相關改進</chinese-title>
        <english-title>IMPROVEMENTS IN OR RELATING TO CONTACT LENSES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G02C7/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利物浦大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIVERSITY OF LIVERPOOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商實瞳股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEED CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾爾榭克　阿漢默德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELSHEIKH, AHMED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫爾　潔西卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOORE, JESSICA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冉紫滎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAN, ZIYING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松永透</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUNAGA, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　泰宏玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOANG, THI HONG NGOC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西岡千里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIOKA, CHISATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種軟性隱形眼鏡，尤其為一種由具有0.8 MPa至3.0 MPa範圍內的楊氏模數（「E」）值之材料形成的軟性隱形眼鏡，其經調適以供在矯正角膜中使用，使得在使用中，在該隱形眼鏡被佩戴且佩戴者閉上眼睛時，該隱形眼鏡在該眼睛上施加壓力，該壓力具有分布輪廓，其中角膜上的壓力在該角膜之中央區帶中相對較高，且在該角膜之在該中央區帶外部但實質鄰近於該中央區帶之中間區帶中相對較低，該隱形眼鏡自該鏡片之中央向外依序包含：  &lt;br/&gt;a）中央部分，其接觸該角膜之該中央區帶；  &lt;br/&gt;b）中間部分，其覆蓋於該角膜之該中間區帶上，該中間部分之至少部分具有的曲率半徑小於該角膜之該中間區帶的曲率半徑；以及  &lt;br/&gt;c）周邊部分，其接觸該角膜之周邊區帶之至少部分，該周邊區帶在該中間區帶外部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a soft contact lens, especially a soft contact lens formed of a material having a Young's modulus (“E”) value in the range 0.8 - 3.0 MPa, adapted for use in orthokeratology such that, in use, when the contact lens is worn and the wearer closes their eye, the contact lens exerts a pressure on the eye having a distribution profile in which the pressure on the cornea is relatively high in a central zone of the cornea and is relatively low in an intermediate zone of the cornea outside of, but substantially adjacent to, the central zone, the contact lens comprising, sequentially, from the centre of the lens outwards: &lt;br/&gt;a) a central portion which contacts the central zone of the cornea; &lt;br/&gt;b) an intermediate portion which overlies the intermediate zone of the cornea, at least part of the intermediate portion having a radius of curvature which is smaller than the radius of curvature of the intermediate zone of the cornea; and &lt;br/&gt;c) a peripheral portion, which contacts at least part of a peripheral zone of the cornea, which peripheral zone is outside of the intermediate zone.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:鏡片</p>
        <p type="p">4:角膜</p>
        <p type="p">10:中央部分</p>
        <p type="p">12:中間部分</p>
        <p type="p">14:區/隆脊或「凸出部」</p>
        <p type="p">16:周邊部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="911" publication-number="202616568">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616568</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119126</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器</chinese-title>
        <english-title>ELECTRICAL CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120250829B">H01R12/72</main-classification>
        <further-classification edition="200601120250829B">H01R13/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖芳竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, FANG-JWU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸麒翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHI-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉家豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JIA-HAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>司明倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SZU, MING-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>範家玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, CHIA-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電連接器，包括設有端子槽的絕緣體及設於端子槽內的端子；端子包括固持部和上、下彈性臂，上彈性臂包括上彈性部、上接觸部及上抵接部，下彈性臂包括下彈性部、下接觸部及下抵接部；固持部固持於端子槽內且包括第一豎直部，上、下彈性部分別自第一豎直部延伸，上、下彈性部二者之一沿水平方向的投影向後超出二者之另一；端子包括自固持部沿水平方向延伸或大致呈水平方向延伸的抵觸部，端子被抵壓時，上、下抵接部均與抵觸部抵接，如此，上、下彈性臂更容易接觸抵觸部，內接觸比較容易實現，電連接器具有穩定的傳輸路徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses an electrical connector which includes an insulating housing and plural conductive terminals. The insulating housing includes an upper face, a lower face and plural terminal grooves penetrating the upper face and the lower face. The conductive terminals are received and retained in the corresponding terminal grooves one by one. Each conductive terminal includes a fixing portion, an upper elastic arm and a lower elastic arm. The upper elastic arm includes an upper elastic portion, an upper contacting portion and an upper abutting portion, and the lower elastic arm includes a lower elastic portion, a lower contacting portion and a lower abutting portion. The fixing portion includes a first vertical portion. The upper elastic portion extends upward and forward from the first vertical portion, and the lower elastic portion extends downward and forward from the first vertical portion. A horizontal projection of one of the upper elastic portion and the lower elastic extends backward beyond the projection of the other. Each contact includes at least one resisting portion that is horizontal or substantially horizontal, both the upper abutting portion and the lower abutting portion abut against the resisting portion easily when the conductive terminals are pressed as contacting surfaces of the resisting portion are not arc , and thus, the electrical connector has a stable inner stable transmission path.</p>
      </isu-abst>
      <representative-img>
        <p type="p">221:上接觸部</p>
        <p type="p">2221:上直臂</p>
        <p type="p">2223:勺狀接觸端</p>
        <p type="p">231:下接觸部</p>
        <p type="p">2321:下直臂</p>
        <p type="p">2323:勺狀接觸端</p>
        <p type="p">24:抵觸部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="912" publication-number="202616889">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616889</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119134</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路裝置及製造方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251003B">H10D84/83</main-classification>
        <further-classification edition="202501120251003B">H10D84/01</further-classification>
        <further-classification edition="200601120251003B">H01L23/50</further-classification>
        <further-classification edition="200601120251003B">H01L23/535</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤韋翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOU, WEI-XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱宗凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, TSUNG-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳亭昀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TING-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖　思雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示係對埋入式電源軌架構之電源傳輸提供不同的互補式堆疊電晶體單元內中段連接。一種積體電路裝置包含一裝置堆疊、一頂部接觸結構、一背側電源軌以及一通孔互連。該裝置堆疊包含一底部半導體裝置以及沿一方向堆疊於該底部半導體裝置上之一頂部半導體裝置。該頂部接觸結構係位於該頂部半導體裝置之一源極/汲極之上並電性接觸該源極/汲極。該通孔互連延伸於該頂部接觸結構及該背側電源軌之間並電性耦接該頂部接觸結構及該背側電源軌。該通孔互連沿該背側電源軌朝向該頂部接觸結構之方向而逐漸變細。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various CFET in-cell MOL connections for power delivery under buried power rail scheme are provided. An integrated circuit (IC) device includes a device stack, a top contact structure, a back side power rail, and a via interconnect. The device stack includes a bottom semiconductor device, and a top semiconductor device stacked over the bottom semiconductor device along a direction. The top contact structure is over and in electrical contact with a source/drain of the top semiconductor device. The via interconnect extends between and electrically couples the top contact structure and the back side power rail. The via interconnect tapers along the direction from the back side power rail towards the top contact structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300A:IC裝置</p>
        <p type="p">380:前側再分布結構</p>
        <p type="p">390:背側再分布結構</p>
        <p type="p">303:基板</p>
        <p type="p">304:前側</p>
        <p type="p">305:背側</p>
        <p type="p">334:BMD接觸部</p>
        <p type="p">332:源極/汲極</p>
        <p type="p">331:通道</p>
        <p type="p">335:閘極</p>
        <p type="p">345:介電層</p>
        <p type="p">342:源極/汲極局部互連</p>
        <p type="p">322:源極/汲極</p>
        <p type="p">321:通道</p>
        <p type="p">327:底部表面</p>
        <p type="p">325:閘極</p>
        <p type="p">351:表面</p>
        <p type="p">324:MD接觸部</p>
        <p type="p">326:頂部表面</p>
        <p type="p">350:介電結構</p>
        <p type="p">352:表面</p>
        <p type="p">360:通孔互連</p>
        <p type="p">361:頂部表面</p>
        <p type="p">362:底部表面</p>
        <p type="p">311:中心線</p>
        <p type="p">312:中心線</p>
        <p type="p">381、382、383、384:金屬圖案</p>
        <p type="p">391、392、393:BM0導線</p>
        <p type="p">M0:金屬層</p>
        <p type="p">M0_1、M0_2、M0_3、M0_4:M0導線</p>
        <p type="p">BM0:金屬層</p>
        <p type="p">BM0_1、BM0_2、BM0_3:BM0導線</p>
        <p type="p">H、H1:高度</p>
        <p type="p">374:BVD通孔</p>
        <p type="p">308:裝置堆疊</p>
        <p type="p">MN:頂部半導體裝置</p>
        <p type="p">MP:底部半導體裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="913" publication-number="202616167">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616167</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119175</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>產品追蹤配置、方法及電腦程式</chinese-title>
        <english-title>PRODUCT TRACKING ARRANGEMENT, METHOD AND COMPUTER PROGRAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260112B">G06Q10/08</main-classification>
        <further-classification edition="202301120260112B">G06Q10/087</further-classification>
        <further-classification edition="202301120260112B">G06Q10/0832</further-classification>
        <further-classification edition="202301120260112B">G06Q10/0833</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴地斯顏料化工廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐普夫爾曼　德克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OPFERMANN, DIRK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾爾努德　潔西卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AERNOUDT, JESSICA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波塞米爾　卡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POSSEMIERS, KARL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫洛芬格　盧卡斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KROPFINGER, LUKAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美梅克　馬克思</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEMECKE, MARCUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於管理指示經裝運產品(102)之產品參數之產品資料項(PD1、PD2、PD3)之產品追蹤配置(100)。該產品追蹤配置包括：資料儲存單元(104)，其經組態以接收及儲存該等產品資料項(PD1、PD2、PD3)；識別符單元(106)，其與該經裝運產品(102)相關聯，該識別符單元經組態以啟用/授予對該資料儲存單元之存取以用於存取該等產品資料項(PD1、PD2、PD3)之至少部分；及裝運狀況確定單元(108)，其經組態以：確定指示與相關聯於該識別符單元(106)之該產品之裝運(110)有關的狀況(C1、C2)之裝運狀況資料(CD)；及將該經確定之裝運狀況資料(CD)作為產品資料項(PD3)提供至該資料儲存單元。此改良該產品之可追溯性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is directed to a product tracking arrangement (100) for managing product data items (PD1, PD2, PD3) indicative of product parameters of a shipped product (102). The product tracking arrangement comprises a data storage unit (104) configured to receive and store the product data items (PD1, PD2, PD3), an identifier unit (106) associated to the shipped product (102), the identifier unit configured to enable/grant access to the data storage unit for accessing at least a part of the product data items (PD1, PD2, PD3); and a shipment condition ascertainment unit (108) configured to ascertain shipment condition data (CD) indicative of conditions (C1, C2) pertaining to a shipment (110) of the product associated to the identifier unit (106); and to provide the ascertained shipment condition data (CD) to the data storage unit as a product data item (PD3). This improves the traceability of the product.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:產品追蹤配置</p>
        <p type="p">101:生產設施</p>
        <p type="p">102:經裝運產品/材料產品</p>
        <p type="p">103:最終客戶</p>
        <p type="p">104:資料儲存單元/資料儲存器</p>
        <p type="p">105:實驗室/研究設施</p>
        <p type="p">106:識別符單元</p>
        <p type="p">108:裝運狀況確定單元</p>
        <p type="p">110:裝運/裝運路線</p>
        <p type="p">C1:狀況</p>
        <p type="p">C2:狀況</p>
        <p type="p">CD:裝運狀況資料</p>
        <p type="p">EC1:環境狀況</p>
        <p type="p">EC2:環境狀況</p>
        <p type="p">ED:環境資料</p>
        <p type="p">PD1:產品資料項</p>
        <p type="p">PD2:產品資料項</p>
        <p type="p">PD3:額外產品資料項</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="914" publication-number="202615312">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615312</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119195</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>芳香劑容器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">B65D85/00</main-classification>
        <further-classification edition="200601120260113B">A61L9/12</further-classification>
        <further-classification edition="200601120260113B">B60H3/00</further-classification>
        <further-classification edition="200601120260113B">B65D83/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱鉛筆股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI PENCIL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中田瑛大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKADA, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大本慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOMOTO, KEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神谷俊史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMITANI, TOSHIMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種芳香劑容器，係將多支芳香劑匣收容至容器本體內而成，前述芳香劑匣係收容有直液狀態之揮發性液體所構成的芳香消臭劑，並具備具有毛細管力的多孔質揮發體，前述芳香劑匣中，具備按壓環機構，前述按壓環機構係按壓環構件各自抵接配置，且前述按壓環構件各自嚙合並連動，前述芳香劑匣可自由交換地收容於前述容器本體內，並以螺合(螺旋式)的方式卡止於前述容器本體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10a,10b,10c:芳香劑匣</p>
        <p type="p">20:按壓環構件(左)</p>
        <p type="p">30:按壓環構件(中央)</p>
        <p type="p">40:按壓環構件(右)</p>
        <p type="p">90:罩蓋上部單元</p>
        <p type="p">120:罩蓋下部單元</p>
        <p type="p">X:芳香劑容器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="915" publication-number="202615505">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615505</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119205</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻劑組成物及阻劑圖型形成方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F212/14</main-classification>
        <further-classification edition="200601120260102B">C08F220/06</further-classification>
        <further-classification edition="200601120260102B">C08F220/18</further-classification>
        <further-classification edition="200601120260102B">C08F220/24</further-classification>
        <further-classification edition="200601120260102B">C08F20/28</further-classification>
        <further-classification edition="200601120260102B">C08F220/30</further-classification>
        <further-classification edition="200601120260102B">C08F220/32</further-classification>
        <further-classification edition="200601120260102B">C08F220/36</further-classification>
        <further-classification edition="200601120260102B">C07C309/42</further-classification>
        <further-classification edition="200601120260102B">C07C381/12</further-classification>
        <further-classification edition="200601120260102B">C07D327/04</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/09</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荻野衣梨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGINO, ERI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤井達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJII, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>保貴昭
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAIHO, TAKAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種阻劑組成物，含有：樹脂成分(A1)、通式(b0)所示之化合物(B0)，及具有包含特定結構的鹼解離性基之結構單元(f1)之氟樹脂成分(F1)。式中，Ar表示芳香環。Rf&lt;sup&gt;0&lt;/sup&gt;表示碳原子數1~5的氟化烷基或氟原子。L&lt;sup&gt;0&lt;/sup&gt;表示包含  &lt;br/&gt;-C(=O)-O-、-O-C(=O)-，或者-O-S(=O)&lt;sub&gt;2&lt;/sub&gt;-之2價的連結基。Yb&lt;sup&gt;0&lt;/sup&gt;表示環式基。Rb&lt;sup&gt;0&lt;/sup&gt;表示有機基。n01為原子價允許之1以上的整數。n02為原子價允許之0以上的整數。  &lt;br/&gt;&lt;img align="absmiddle" height="160px" width="447px" file="ed10130.JPG" alt="ed10130.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="916" publication-number="202616312">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616312</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119226</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層型電子零件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H01G4/30</main-classification>
        <further-classification edition="200601120260112B">H01C7/02</further-classification>
        <further-classification edition="200601120260112B">H01C7/04</further-classification>
        <further-classification edition="200601120260112B">H01F27/29</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商京瓷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYOCERA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福田大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUDA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鶴林大樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSURUBAYASHI, DAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木竜也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之積層型電子零件包含：積層體，其係由內部電極與介電層積層而成；基底電極；以及外部電極。內部電極具有第1內部電極及第2內部電極，基底電極具有第1基底電極及第2基底電極，外部電極具有第1外部電極及第2外部電極。第1外部電極及第2外部電極分別具有連接於第1內部電極或第2內部電極之第1部分、及連接於基底電極中之任一者之第2部分。第1部分所包含之金屬粒子之平均粒徑小於第2部分所包含之金屬粒子之平均粒徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="917" publication-number="202615869">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615869</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119292</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於掃描探針顯微鏡之具有尖端延伸的探針尖端</chinese-title>
        <english-title>PROBE TIP WITH TIP EXTENSION FOR SCANNING PROBE MICROSCOPE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260107B">G01Q60/38</main-classification>
        <further-classification edition="201001120260107B">G01Q70/08</further-classification>
        <further-classification edition="201001120260107B">G01Q70/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商分子遠景公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLECULAR VISTA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴　聖一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SUNG I.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾瓦克　德瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOWAK, DEREK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威奎瑪辛吉　Ｈ　庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WICKRAMASINGHE, H. KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿爾布萊希特　湯瑪斯　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALBRECHT, THOMAS R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種懸臂結構、一種掃描探針顯微鏡及一種操作該掃描探針顯微鏡之方法，其使用具有一探針尖端之一懸臂，該探針尖端具有一尖端延伸以介接一樣本。該尖端延伸可具有小於100 nm之一高度。該懸臂係受驅動以振動且一光源用於將一光束傳輸至該尖端延伸上。該懸臂之振動經光學量測以對該樣本成像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cantilever structure, a scanning probe microscope and a method of operating the scanning probe microscope use a cantilever having a probe tip with a tip extension to interface a sample. The tip extension can have a height less than 100 nm. The cantilever is driven to vibrate and a light source is used to transmit an optical beam onto the tip extension. Vibrations of the cantilever is optically measured to image the sample.</p>
      </isu-abst>
      <representative-img>
        <p type="p">502:區塊</p>
        <p type="p">504:區塊</p>
        <p type="p">506:區塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="918" publication-number="202615926">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615926</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119323</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學成像系統</chinese-title>
        <english-title>OPTICAL IMAGING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251229B">G02B11/34</main-classification>
        <further-classification edition="200601120251229B">G02B9/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李知秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JI SU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許宰赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUH, JAE HYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙鏞主</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, YONG JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學成像系統包括第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡、第六透鏡、第七透鏡、第八透鏡和第九透鏡，自物體側依序設置，其中第一透鏡和第二透鏡的複合焦距具有正值，其中第八透鏡和第九透鏡的複合焦距具有負值，其中第八透鏡和第九透鏡相互粘合，且光學成像系統滿足條件表達式0.05 ＜ CT9/CT8 ＜ 0.5，其中CT9是第九透鏡在光軸上的厚度，且CT8是第八透鏡在光軸上的厚度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, a seventh lens, an eighth lens, and a ninth lens sequentially disposed from an object side, wherein a composite focal length of the first lens and the second lens has a positive value, wherein a composite focal length of the eighth lens and the ninth lens has a negative value, wherein the eighth lens and the ninth lens are cemented to each other, and wherein the optical imaging system satisfies the following conditional expression:0.05 ＜ CT9/CT8 ＜ 0.5, where CT9 is a thickness on an optical axis of the ninth lens, and CT8 is a thickness on an optical axis of the eighth lens.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學成像系統</p>
        <p type="p">110:第一透鏡</p>
        <p type="p">120:第二透鏡</p>
        <p type="p">130:第三透鏡</p>
        <p type="p">140:第四透鏡</p>
        <p type="p">150:第五透鏡</p>
        <p type="p">160:第六透鏡</p>
        <p type="p">170:第七透鏡</p>
        <p type="p">180:第八透鏡</p>
        <p type="p">190:第九透鏡</p>
        <p type="p">IF:濾光器</p>
        <p type="p">IP:成像平面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="919" publication-number="202616882">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616882</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119330</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251002B">H10D84/01</main-classification>
        <further-classification edition="200601120251002B">H01L21/324</further-classification>
        <further-classification edition="200601120251002B">H01L21/3065</further-classification>
        <further-classification edition="202501120251002B">H10D84/83</further-classification>
        <further-classification edition="200601120251002B">B81C1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈育佃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, YU-TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊智凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIH-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李心源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HSIN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂宣瑾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, HSUAN-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王信智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HSIN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張鈞彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝銘峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIEH, MING-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包括在基板上方形成裝置層，該裝置層包括與下電晶體垂直堆疊的上電晶體；平坦化基板以暴露下電晶體的閘電極和下電晶體的源極/汲極區；並執行定向自組裝（DSA）過程以定義第一組分聚合物的區塊和第二組分聚合物的區塊。第一組分聚合物的區塊與閘電極重疊，第二組分聚合物的區塊與源極/汲極區重疊。該方法還包括用介電材料替換第一組分聚合物的區塊；並用電連接到源極/汲極區的背面接觸替換第二組成聚合物的區塊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes forming a device layer over a substrate, the device layer comprising an upper transistor that is vertically stacked with a lower transistor; planarizing the substrate to expose a gate electrode of the lower transistor and a source/drain region of the lower transistor; and performing a directed self assembly (DSA) process to define a block of a first constituent polymer and a block of a second constituent polymer. The block of the first constituent polymer overlaps the gate electrode, and the block of the second constituent polymer overlaps the source/drain region. The method further includes replacing the block of the first constituent polymer with a dielectric material; and replacing the block of the second constituent polymer with a backside contact that is electrically connected to the source/drain region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:堆疊電晶體</p>
        <p type="p">10L:電晶體</p>
        <p type="p">10U:電晶體</p>
        <p type="p">26L:半導體奈米結構</p>
        <p type="p">26U:半導體奈米結構</p>
        <p type="p">62L:源極/汲極區</p>
        <p type="p">62U:源極/汲極區</p>
        <p type="p">78:閘極介電</p>
        <p type="p">80L:閘電極</p>
        <p type="p">80U:閘電極</p>
        <p type="p">90:閘極堆疊/閘極結構</p>
        <p type="p">A-A':橫截面/線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="920" publication-number="202615567">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615567</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119361</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>犧牲膜形成用組合物和犧牲膜圖案的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08K5/053</main-classification>
        <further-classification edition="200601120260102B">C08K5/28</further-classification>
        <further-classification edition="200601120260102B">C08L101/00</further-classification>
        <further-classification edition="200601120260102B">C08L61/06</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/023</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/40</further-classification>
        <further-classification edition="200601120260102B">H05K3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大阪有機化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSAKA ORGANIC CHEMICAL INDUSTRY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹內祐太朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEUCHI, YUTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供能夠形成曝光靈敏度高、分辨率優異、並且具有良好的圖案形狀、且耐乾蝕刻性優異的抗蝕劑圖案（犧牲膜圖案）的犧牲膜形成用組合物。本發明的犧牲膜形成用組合物含有酚醛清漆樹脂（A）、醌二疊氮化合物（B）和化合物（C），該化合物（C）具有芳香環、鍵合於上述芳香環的羥基和鍵合於上述芳香環的烷氧基甲基。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="921" publication-number="202616517">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616517</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119388</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置與其製造方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND MANUFATURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250703B">H01L23/538</main-classification>
        <further-classification edition="200601120250703B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾嘉平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, CHIA-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宏文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, HUNG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王茹立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JU-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電子裝置，其包括基板、通孔、導電元件以及電路結構。通孔貫穿基板，且包括第一通孔以及第二通孔。導電元件設置於通孔中，且包括第一導電元件以及第二導電元件，其中第一導電元件設置於第一通孔中，且第二導電元件設置於第二通孔中。電路結構設置於基板上且電性連接導電元件。在第一方向上，兩相鄰第一導電元件之間有第一間距，兩相鄰第二導電元件之間有第二間距，且第一間距大於第二間距。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device including a substrate, a through hole, a conductive element and a circuit structure. The through hole penetrates through the substrate and includes a first through hole and a second through hole. The conductive element is disposed in the through hole and includes a first conductive element and a second conductive element, wherein the first conductive element is disposed in the first through hole and the second conductive element is disposed in the second through hole. The circuit structure is disposed on the substrate and is electrically connected to the conductive element. In a first direction, there is a first spacing between two adjacent first conductive elements, and there is a second spacing between two adjacent second conductive elements, and the first spacing is greater than the second spacing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3、3a、3b、3c:電子元件</p>
        <p type="p">10:基板</p>
        <p type="p">10S:基板的側邊</p>
        <p type="p">20:導電元件</p>
        <p type="p">22:第一導電元件</p>
        <p type="p">24:第二導電元件</p>
        <p type="p">26:第三導電元件</p>
        <p type="p">30、32、34:電路結構</p>
        <p type="p">A-A’:剖線</p>
        <p type="p">AA:主動區</p>
        <p type="p">CU1、CU2:連接元件</p>
        <p type="p">F:填充材料</p>
        <p type="p">F1:第一填充材料</p>
        <p type="p">F2:第二填充材料</p>
        <p type="p">IL:絕緣層</p>
        <p type="p">L:寬度</p>
        <p type="p">M:導電層</p>
        <p type="p">PA:周邊區</p>
        <p type="p">PAD:接墊</p>
        <p type="p">PL:封裝層</p>
        <p type="p">T:通孔</p>
        <p type="p">T1:第一通孔</p>
        <p type="p">T2:第二通孔</p>
        <p type="p">T3:第三通孔</p>
        <p type="p">UF:中介層</p>
        <p type="p">X、Y、Z:方向</p>
        <p type="p">d1:第一間距</p>
        <p type="p">d2:第二間距</p>
        <p type="p">d3:第三間距</p>
        <p type="p">p1、p2、p3:孔徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="922" publication-number="202616354">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616354</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119393</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理方法、半導體裝置之製造方法、處理裝置及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H01L21/02</main-classification>
        <further-classification edition="200601120260112B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高野望</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKANO, NOZOMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中谷公彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKATANI, KIMIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>早稻田崇之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WASEDA, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>濵田啓太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMADA, KEITARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供能夠有效地對所需的表面進行選擇性處理的技術。其具有：(a)準備基板的步驟，該基板具有第1表面及材質與上述第1表面不同的第2表面，在上述第1表面形成有第1氧化膜且在上述第2表面形成有第2氧化膜；和(b)使上述基板暴露於蝕刻劑，藉此在使形成於上述第1表面的上述第1氧化膜殘存的同時將形成於上述第2表面的上述第2氧化膜除去的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="923" publication-number="202615917">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615917</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119395</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有高對比度基準結構之光纖陣列單元適配器</chinese-title>
        <english-title>FIBER ARRAY UNIT ADAPTER WITH HIGH-CONTRAST FIDUCIAL STRUCTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">G02B6/42</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧研發公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING RESEARCH &amp; DEVELOPMENT CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格里吉爾　提姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRYGIEL, TIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施普里曼　馬汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPREEMANN, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種FAU適配器包括一玻璃基板及塗覆於該玻璃基板之第一表面上之一不透明層。該玻璃基板包括與該FAU適配器之一光纖方向以及該FAU適配器之一對準方向兩者平行的一第一表面，其中該對準方向與該光纖方向正交。在該玻璃基板及該不透明層內形成複數個V形槽，該些V形槽中之各V形槽包括在該光纖方向上延伸之一V形槽軸線，並且該些V形槽中之各V形槽延伸穿過該不透明層並穿過該玻璃基板之該第一表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An FAU adapter includes a glass substrate and a non-transparent layer coated on the first surface of the glass substrate.The glass substrate includes a first surface that is parallel with both a fiber direction of the FAU adapter and an alignment direction of the FAU adapter, wherein the alignment direction is orthogonal to the fiber direction.A plurality of V-grooves are formed within the glass substrate and the non-transparent layer, each V-groove of the plurality of V-grooves including a V-groove axis that extends in the fiber direction, and each V-groove of the plurality of V-grooves extending through the non-transparent layer and through the first surface of the glass substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光纖陣列單元適配器</p>
        <p type="p">110:玻璃基板</p>
        <p type="p">110-1:第一側</p>
        <p type="p">110-2:第二側</p>
        <p type="p">112:第一表面</p>
        <p type="p">120:不透明層</p>
        <p type="p">124:第二表面</p>
        <p type="p">130:V形槽</p>
        <p type="p">132A:第一對準V形槽</p>
        <p type="p">132B:第二對準V形槽</p>
        <p type="p">134A:第一基準V形槽</p>
        <p type="p">134B:第二基準V形槽</p>
        <p type="p">136A:第一間隔V形槽</p>
        <p type="p">136B:第二間隔V形槽</p>
        <p type="p">L&lt;sub&gt;VG&lt;/sub&gt;:基準V形槽間隔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="924" publication-number="202615565">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615565</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119403</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚合性組成物及其用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08K3/34</main-classification>
        <further-classification edition="200601120260102B">C08K5/09</further-classification>
        <further-classification edition="200601120260102B">C08K5/1539</further-classification>
        <further-classification edition="200601120260102B">C08K5/3492</further-classification>
        <further-classification edition="200601120260102B">C08K7/00</further-classification>
        <further-classification edition="200601120260102B">C08L63/00</further-classification>
        <further-classification edition="200601120260102B">C09D163/00</further-classification>
        <further-classification edition="201801120260102B">C09D7/61</further-classification>
        <further-classification edition="201801120260102B">C09D7/63</further-classification>
        <further-classification edition="200601120260102B">C09J11/04</further-classification>
        <further-classification edition="200601120260102B">C09J11/06</further-classification>
        <further-classification edition="200601120260102B">C09J163/00</further-classification>
        <further-classification edition="200601120260102B">B32B27/18</further-classification>
        <further-classification edition="200601120260102B">B32B27/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商蘇膜爾股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOMAR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福原邦昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUHARA, KUNIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]仍然需求一種在使用層狀無機化合物之複合化材料中，提升水蒸氣阻隔性能的方法。  &lt;br/&gt;　　[解決手段]一種聚合性組成物，其包含(A)包含選自鈉離子及鋰離子之至少1種作為交換性陽離子之層狀無機化合物、(B)選自縮水甘油胺型環氧樹脂、羥甲基三聚氰胺、無氮型環氧樹脂與胺系化合物之組合、無氮環氧樹脂與硫醇系化合物之組合，及具有80~165g/eq之環氧當量與180~420g/mol之分子量之無氮型環氧樹脂之至少1種，及(C)羧酸化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="925" publication-number="202616336">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616336</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119423</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>採用脈衝雙射頻電漿之PECVD氮化矽溝槽底部輪廓控制</chinese-title>
        <english-title>PECVD SILICON NITRIDE TRENCH BOTTOM PROFILE CONTROL WITH PULSED DUAL RF FREQUENCY PLASMA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H01J37/32</main-classification>
        <further-classification edition="200601120260112B">C23C16/515</further-classification>
        <further-classification edition="200601120260112B">C23C16/56</further-classification>
        <further-classification edition="200601120260112B">H01L21/02</further-classification>
        <further-classification edition="200601120260112B">H01L21/311</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾蔚婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, WEITING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加　普拉凱特普拉卡什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHA, PRAKET PRAKASH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁　璟梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, JINGMEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冀翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JI, XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的各實施例涉及用於製造半導體元件的裝置和方法。在一個實施例中，形成層的方法包括將基板置於處理腔室中；將至少一個前驅物氣體引入處理腔室；通過脈衝化第一RF電源和第二RF電源產生雙RF電漿，其中第一RF電源和第二RF電源具有不同的頻率；利用雙RF電漿在基板上沉積一層；將至少一個額外的前驅物氣體引入處理腔室；通過將第一RF電源施加於至少一個額外的前驅物氣體來產生蝕刻電漿；並利用該蝕刻電漿蝕刻該層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure relate to an apparatus and method utilized in the manufacture of semiconductor devices. In one embodiment, a method of forming a layer, including positioning a substrate in a processing chamber; introducing at least one precursor gas into the processing chamber; generating a dual RF plasma with the at least one precursor gas by pulsing a first RF power source and a second RF power source, the first RF power source and the second RF power source having different frequencies; depositing a layer on the substrate with the dual RF plasma; introducing at least one additional precursor gas into the processing chamber; generating an etching plasma by applying the first RF power source to the at least one additional precursor gas; and etching the layer with the etching plasma.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400B:溝槽</p>
        <p type="p">402:基板</p>
        <p type="p">404:表面</p>
        <p type="p">404a:溝槽鰭片頂部</p>
        <p type="p">404b:溝槽側壁</p>
        <p type="p">404c:溝槽底切</p>
        <p type="p">404d:溝槽底部</p>
        <p type="p">412:膜</p>
        <p type="p">412a:凹形</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="926" publication-number="202615442">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615442</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119424</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含氮有機氧矽烷化合物及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07F7/18</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>市位駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHII, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>殿村洋一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TONOMURA, YOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清森歩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIYOMORI, AYUMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">下述通式(1)表示之含氮有機氧矽烷化合物，為具有3個以上的3級胺基之新穎的化合物，能夠以工業上可獲得多品種的2級胺作為原料來合成。  &lt;br/&gt;&lt;img align="absmiddle" height="114px" width="354px" file="ed10021.JPG" alt="ed10021.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(式中，R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;係分別獨立表示取代或非取代之碳數1~10之1價烴基，R&lt;sup&gt;3&lt;/sup&gt;表示中間亦可存在有雜原子的非取代之碳數1~10之2價烴基，R&lt;sup&gt;4&lt;/sup&gt;及R&lt;sup&gt;5&lt;/sup&gt;係分別獨立表示取代(惟矽烷基除外)或非取代之碳數1~10之1價烴基，R&lt;sup&gt;4&lt;/sup&gt;與R&lt;sup&gt;5&lt;/sup&gt;亦可彼此鍵結並與此等所鍵結之氮原子一起形成環，n表示0~2之整數)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="927" publication-number="202615250">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615250</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119431</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>離型膜</chinese-title>
        <english-title>MOLD RELEASE FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260112B">B32B7/06</main-classification>
        <further-classification edition="200601120260112B">B32B27/00</further-classification>
        <further-classification edition="200601120260112B">B32B27/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電木股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO BAKELITE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻池昭吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONOIKE, SHOGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種離型膜，其在從撓性印刷電路基板剝離離型膜時，能夠迅速且良好地剝離離型膜，並且能夠以優異的生產性製造成形品。本發明的離型膜為具有離型層之離型膜，其特徵在於，含有熔點為180℃以上之樹脂，且當在紅外線吸收光譜中，將2855±7cm&lt;sup&gt;-1&lt;/sup&gt;處之吸光度設為Xa，將2920±7cm&lt;sup&gt;-1&lt;/sup&gt;處之吸光度設為Xb，將2960±7cm&lt;sup&gt;-1&lt;/sup&gt;處之吸光度設為Xc時，滿足Xc/Xb≤1.6的關係，並滿足Xc/Xa≤2.6的關係。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a mold release film that can be quickly and satisfactorily peeled off from a flexible printed circuit board and can produce a molded product with excellent productivity. The mold release film of the present invention is a mold release film having a mold release layer, the mold release film including a resin having a melting point of 180°C or higher, wherein in an infrared absorption spectrum of the mold release film, when an absorbance at 2855 ± 7 cm-1 is Xa, an absorbance at 2920 ± 7 cm-1 is Xb and an absorbance at 2960 ± 7 cm-1 is Xc, a relationship of Xc/Xb ≦ 1.6 is satisfied and a relationship of Xc/Xa ≦ 2.6 is satisfied.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="928" publication-number="202616156">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616156</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119525</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於會議情境之電子集線器系統</chinese-title>
        <english-title>ELECTRONIC HUB SYSTEM FOR USE IN A MEETING CONTEXT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260112B">G06Q10/02</main-classification>
        <further-classification edition="202301120260112B">G06Q10/0631</further-classification>
        <further-classification edition="202301120260112B">G06Q10/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比利時商巴可公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARCO N.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒂特加特　唐尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TYTGAT, DONNY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西克斯　艾爾文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIX, ERWIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞納爾　高蒂爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RENARD, GAUTHIER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子集線器系統，用於促進至少一個技術設施在一會議情境中之共享使用，其包含：&lt;br/&gt;  l  設施介接構件，其用來連接至這些技術設施。&lt;br/&gt;  l  用戶端介接構件，其允許來自用戶端裝置之同時連接。&lt;br/&gt;  l  互連邏輯，其連接有用戶端裝置，被組配用以進行下列動作：&lt;br/&gt;  o    偵測與一用戶端裝置相關聯之一觸發。&lt;br/&gt;  o    向該用戶端裝置通告一些或全部技術設施之可用性。&lt;br/&gt;  o    從用戶端裝置取得設施中要接取之相應選擇。&lt;br/&gt;  o    根據情境規則向該用戶端裝置調適並提供所選擇設施。&lt;br/&gt;  該等技術設施包括下列一或多者：電力、網路接取、人性化介面裝置、感測器、致動器、視聽來源裝備及視聽輸出裝備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic hub system for facilitating shared use of at least one technical facilities in a meeting context comprising:&lt;br/&gt; l Facility interfacing means to connect to these technical facilities.&lt;br/&gt; l Client interfacing means allowing simultaneous connections from client devices.&lt;br/&gt; l Interconnection logic, having client devices connected, configured to:&lt;br/&gt; o Detect a trigger associated with a client device.&lt;br/&gt; o Advertise the availability of some or all technical facilities to the client device.&lt;br/&gt; o Obtain respective selections of facilities to be accessed from the client device.&lt;br/&gt; o Adapt and provide the selected facilities to the client device according to contextual rules.&lt;br/&gt; The technical facilities include one or more of the following: electrical power, network access, human interface devices, sensors, actuators, audiovisual source equipment, and audiovisual output equipment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統；集線器系統；電子集線器系統</p>
        <p type="p">110:設施介接構件</p>
        <p type="p">115:技術設施；資源；給定設施</p>
        <p type="p">120:用戶端介接構件</p>
        <p type="p">125:用戶端裝置；技術設施；技術會議設施</p>
        <p type="p">130:互連邏輯</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="929" publication-number="202614972">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614972</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119568</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>脈波延遲控制程式、超音波診斷裝置以及脈波延遲控制方法</chinese-title>
        <english-title>PULSE DELAY CONTROL PROGRAM, ULTRASONIC DIAGNOSTIC DEVICE, AND PULSE DELAY CONTROL METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">A61B8/14</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商帝酷科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>D-CLUE TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美齊津摂夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MISAIZU, SETSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田村吉紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMURA, YOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">以往存在下述問題：需要進行與焦點深度的數量相同次數的超音波訊號的傳送、接收。本發明為一種脈波延遲控制程式，係執行脈波輸出處理，該脈波輸出處理係根據每個振動器的延遲設定值，對振動器分別輸出具有因應延遲設定值的延遲量之驅動脈波；延遲設定值為根據下述延遲曲線算出的值：愈往複數個振動器的掃描方向的中心部則延遲量愈大，且愈朝向掃描方向的起點及終點則延遲量愈小，該延遲曲線係具有針對每個焦點深度不同的曲線；延遲設定值係包含針對每個振動器群而根據因應對應的焦點深度的延遲曲線算出的值，該振動器群係因應作為對象的焦點深度的數量分組複數個振動器而成；於脈波輸出處理中，以一次的掃描週期輸出具有根據不同的延遲曲線所算出的延遲量之複數個驅動脈波。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="930" publication-number="202616381">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616381</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119586</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於選擇性蝕刻半導體材料的鈍化</chinese-title>
        <english-title>PASSIVATION FOR SELECTIVE ETCHING SEMICONDUCTOR MATERIALS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/3065</main-classification>
        <further-classification edition="200601120260102B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉約西耶　阿德里　卡米爾安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUILLAUSSIER, ADRIEN CAMILLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈登　瑪德蓮　派克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GORDON, MADELEINE PARKER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬塞爾懷特　那森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUSSELWHITE, NATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴　承豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SEUNG-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱濟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, JI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏　曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIA, MAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川口　直志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAGUCHI, MARK NAOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅大宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, TA-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在此提供方法及設備，用於選擇性蝕刻具有可變鍺含量的介電材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and apparatuses for selectively etching dielectric material having variable germanium content are provided herein.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="931" publication-number="202616328">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616328</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119587</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於處置多射束檢測中失效射束之影響的系統及方法</chinese-title>
        <english-title>SYSTEMS AND METHODS FOR HANDLING THE IMPACT OF FAILING BEAMS IN MULTIBEAM INSPECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">H01J37/26</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫柏　芬森特　席爾菲斯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUIPER, VINCENT SYLVESTER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威蘭德　瑪寇　傑　加寇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIELAND, MARCO JAN-JACO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於處置多射束檢測中失效射束之影響的系統及方法。方法包括判定基於多射束配置之失效射束之一數目的一捕捉率。方法包括藉由使用包括該多射束配置中之失效射束之位置的多射束配置資訊而判定用於使用該多射束配置掃描具有至少兩個具有一共同圖案之區的一樣本表面之一掃描策略，其中該多射束配置在該樣本表面上具有為該樣本表面之一部分的一視場，且當樣本與射束柵格之視場相對於彼此步進時，該掃描策略判定該掃描策略中該樣本表面上之不同部分之位置，該掃描策略在依序部分之該等位置之間應用一移位，該移位為該部分之一尺寸之一分率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and methods for handling the impact of failing beams in multibeam inspection. Methods include determining a capture rate that is based on a number of failing beams of the multibeam arrangement. Methods include determining a scanning strategy for scanning a sample surface having at least two regions having a common pattern using the multibeam arrangement by using multibeam arrangement information including positions of failing beams in the multibeam arrangement, wherein the multibeam arrangement has a field of view on the sample surface that is a portion of the sample surface and the scanning strategy determines the positions of different portions on the sample surface in the scanning strategy when stepping the sample and field of view of the beam grid relative to each other, the scanning strategy applying a shift between the positions of sequential portions that is a fraction of a dimension of the portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:射束映圖</p>
        <p type="p">610:陣列</p>
        <p type="p">612:功能性帶電粒子射束</p>
        <p type="p">614:失效帶電粒子射束</p>
        <p type="p">616:失效帶電粒子射束</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="932" publication-number="202615443">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615443</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119726</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含經有機矽化合物表面處理的基材之物品、預浸體、印刷配線基板及玻璃布處理液</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07F7/18</main-classification>
        <further-classification edition="200601120260102B">C08J5/08</further-classification>
        <further-classification edition="200601120260102B">C08J5/24</further-classification>
        <further-classification edition="200601120260102B">C09C1/28</further-classification>
        <further-classification edition="200601120260102B">C09C3/12</further-classification>
        <further-classification edition="200601120260102B">D06M13/513</further-classification>
        <further-classification edition="200601120260102B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安田成紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YASUDA, SHIGEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣神宗直</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROKAMI, MUNENAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種包含經下述式(1)所示的有機矽化合物表面處理的基材之物品。  &lt;br/&gt;&lt;img align="absmiddle" height="104px" width="272px" file="ed10017.JPG" alt="ed10017.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式中，Me為甲基，R&lt;sup&gt;1&lt;/sup&gt;各自獨立地表示氫原子、碳數1~10的烷基或碳數6~20的芳基，R&lt;sup&gt;2&lt;/sup&gt;為氫原子或甲基，m為1~3之整數)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="933" publication-number="202616932">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616932</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119734</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光電轉換元件、攝像元件、攝像元件的製造方法、光感測器、化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">H10K30/60</main-classification>
        <further-classification edition="202001120260102B">A61K41/00</further-classification>
        <further-classification edition="200601120260102B">C07D403/10</further-classification>
        <further-classification edition="200601120260102B">C07D409/06</further-classification>
        <further-classification edition="200601120260102B">C07D409/14</further-classification>
        <further-classification edition="200601120260102B">C07D495/04</further-classification>
        <further-classification edition="200601120260102B">C07D495/14</further-classification>
        <further-classification edition="200601120260102B">C07D519/00</further-classification>
        <further-classification edition="202301120260102B">H10K30/30</further-classification>
        <further-classification edition="202301120260102B">H10K39/32</further-classification>
        <further-classification edition="202301120260102B">H10K71/00</further-classification>
        <further-classification edition="202301120260102B">H10K85/20</further-classification>
        <further-classification edition="202301120260102B">H10K85/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉浦寛記</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIURA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米久田康智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEKUTA, YASUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種對綠色光之量子效率的電場強度依賴性小之光電轉換元件。又，提供一種與上述光電轉換元件相關之攝像元件、攝像元件的製造方法、光感測器及化合物。本發明的光電轉換元件依序具有導電性膜、光電轉換膜及透明導電性膜，其中，上述光電轉換膜含有式（1）所表示之化合物。  &lt;br/&gt;&lt;img align="absmiddle" height="279px" width="368px" file="ed10039.JPG" alt="ed10039.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="934" publication-number="202616448">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616448</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119780</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於具有同軸致動系統之磊晶反應器的晶圓卡匣裝載及卸載系統以及磊晶反應器</chinese-title>
        <english-title>WAFER CASSETTE LOADING AND UNLOADING SYSTEM FOR AN EPITAXIAL REACTOR WITH COAXIAL ACTUATION SYSTEM AND AN EPITAXIAL REACTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H01L21/677</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商ＬＰＥ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LPE S.P.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑托斯　Ｅ　米格爾　雷納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANTOS, E. MIGUEL REINER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科里亞　弗朗西斯科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COREA, FRANCESCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅斯基亞　莫瑞里奧　朱塞佩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MESCHIA, MAURILIO GIUSEPPE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種用於裝載及卸載用於一磊晶反應器(4)之晶圓(3)卡匣(2)的系統(1)，該系統(1)包括：一迴轉料架平台(5)，其經配置以輸送至少一個卡匣(2)，其中該迴轉料架平台(5)能夠圍繞一迴轉料架軸(7)樞轉地連接至該磊晶反應器(4)；一迴轉料架致動器(6)，其經配置以驅動該迴轉料架平台(5)圍繞該迴轉料架軸(7)相對於該磊晶反應器(4)之旋轉；至少一個支撐平台(8)，其適於支撐至少一個卡匣(2)，其中至少一個支撐平台(8)圍繞不同於該迴轉料架軸(7)之一旋轉軸(9)樞轉地連接至該迴轉料架平台(5)；一旋轉致動器(10)，其經配置以驅動至少一個支撐平台(8)圍繞該旋轉軸(9)相對於該迴轉料架平台(5)之旋轉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system (1) for loading and unloading wafer (3) cassettes (2) for an epitaxial reactor (4), the system (1) includes a carousel platform (5), configured to transport at least one cassette (2), wherein the carousel platform (5) is pivotally able to be connected to the epitaxial reactor (4) around a carousel axis (7); a carousel actuator (6), configured to drive the rotation of the carousel platform (5) around the carousel axis (7) in relation to the epitaxial reactor (4); at least one support platform (8), suitable to support at least one cassette (2), wherein at least one support platform (8) is pivotally connected to the carousel platform (5) around a rotation axis (9) that differs from the carousel axis (7); a rotation actuator (10), configured to drive the rotation of at least one support platform (8) around the rotation axis (9) relative to the carousel platform (5).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:晶圓卡匣裝載及卸載系統</p>
        <p type="p">2:卡匣</p>
        <p type="p">5:迴轉料架平台</p>
        <p type="p">6:迴轉料架致動器</p>
        <p type="p">7:迴轉料架軸</p>
        <p type="p">8:支撐平台</p>
        <p type="p">9:旋轉軸</p>
        <p type="p">10:旋轉致動器</p>
        <p type="p">13:鏈輪</p>
        <p type="p">14:驅動輪</p>
        <p type="p">15:驅動輪</p>
        <p type="p">16:迴轉料架軸桿</p>
        <p type="p">25:次要旋轉軸桿</p>
        <p type="p">27:主要旋轉軸桿</p>
        <p type="p">28:惰輪</p>
        <p type="p">29:惰輪旋轉軸</p>
        <p type="p">30:定子</p>
        <p type="p">31:第二鏈輪</p>
        <p type="p">32:同軸軸桿總成</p>
        <p type="p">33:滾珠軸承</p>
        <p type="p">34:工作台</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="935" publication-number="202615424">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615424</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119800</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻劑組成物、阻劑圖型形成方法、化合物，及高分子化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07D307/33</main-classification>
        <further-classification edition="200601120260102B">C07D307/93</further-classification>
        <further-classification edition="200601120260102B">C07D327/04</further-classification>
        <further-classification edition="200601120260102B">C07D493/08</further-classification>
        <further-classification edition="200601120260102B">C07D493/18</further-classification>
        <further-classification edition="200601120260102B">C08F212/14</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤広樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　慶信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, KHANHTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於含有具有由一般式(a0-m0)所示之化合物所衍生之構成單位的樹脂成分之阻劑組成物。於前述一般式(a0-m0)中，W為含有聚合性基之基，Ar&lt;sup&gt;01&lt;/sup&gt;為可具有取代基之芳香族基，L&lt;sup&gt;01&lt;/sup&gt;及L&lt;sup&gt;02&lt;/sup&gt;各自獨立為2價連結基或單鍵，X&lt;sup&gt;0&lt;/sup&gt;為碘原子或溴原子，Z&lt;sup&gt;0&lt;/sup&gt;表示含有內酯之環式基、含有  &lt;br/&gt;-SO&lt;sub&gt;2&lt;/sub&gt;-之環式基，或含有碳酸酯之環式基；m0及n0各自獨立為於原子價所允許之範圍內之1以上之整數。  &lt;br/&gt;&lt;img align="absmiddle" height="168px" width="307px" file="ed10102.JPG" alt="ed10102.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="936" publication-number="202616471">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616471</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119810</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>升降銷總成、包括升降銷總成之半導體處理系統及使用升降銷總成在半導體處理系統中轉移基板之方法</chinese-title>
        <english-title>LIFT PIN ASSEMBLIES, SEMICONDUCTOR PROCESSING SYSTEMS INCLUDING LIFT PIN ASSEMBLIES AND METHODS OF TRANSFERRING SUBSTRATES IN SEMICONDUCTOR PROCESSING SYSTEMS USING LIFT PIN ASSEMBLIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">H01L21/687</main-classification>
        <further-classification edition="202301120260113B">H10N30/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克利　克里斯多福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CILLIE, CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種升降銷總成包括一升降銷主體、兩個或更多個壓電單元及一引線。該升降銷主體包括界定於該升降銷主體之一第一端上的一接觸特徵及與該接觸特徵縱向相對之一固定特徵。該兩個或更多個壓電單元在該固定特徵與該接觸特徵之間堆疊於該升降銷主體內。該引線電連接至該複數個壓電單元且延伸至該升降銷主體外部之外部環境，以使用施加至該引線之一電壓而使該升降銷主體之長度在一第一長度與一第二長度之間改變。亦描述包括該等升降銷總成之半導體處理系統，及基板轉移方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A lift pin assembly includes a lift pin body, two or more piezoelectric cells and a lead. The lift pin body includes a contact feature defined on a first end of the lift pin body and a fixation feature longitudinally opposite the contact feature. The two or more piezoelectric cells are stacked within the lift pin body between the fixation feature and the contact feature. The lead is electrically connected to the plurality of piezoelectric cells and extends to the external environment outside of the lift pin body to change the length of the lift pin body between a first length and a second length using a voltage applied to the lead. Semiconductor processing systems including the lift pin assemblies and substrate transfer methods are also described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:基板</p>
        <p type="p">18:中空內部</p>
        <p type="p">100:腔室主體</p>
        <p type="p">101:升降銷總成</p>
        <p type="p">102:升降銷總成</p>
        <p type="p">104:基板支撐件</p>
        <p type="p">105:升降銷總成</p>
        <p type="p">106:可變電壓源</p>
        <p type="p">108:控制器</p>
        <p type="p">110:上壁</p>
        <p type="p">112:下壁</p>
        <p type="p">114:第一側壁</p>
        <p type="p">116:第二側壁</p>
        <p type="p">136:升降銷孔徑</p>
        <p type="p">138:引線</p>
        <p type="p">150:有線或無線鏈路</p>
        <p type="p">170:源極引線</p>
        <p type="p">172:正端子</p>
        <p type="p">174:返回引線</p>
        <p type="p">176:負端子</p>
        <p type="p">192:升降銷總成</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="937" publication-number="202616540">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616540</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119869</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有改良的化學層配置之電池單元、電池單元堆疊及用於製造之方法</chinese-title>
        <english-title>CELL UNIT WITH IMPROVED CHEMICAL LAYER ARRANGEMENT, STACK OF CELL UNITS AND METHOD FOR MANUFACTURING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260102B">H01M8/0206</main-classification>
        <further-classification edition="201601120260102B">H01M8/0232</further-classification>
        <further-classification edition="201601120260102B">H01M8/12</further-classification>
        <further-classification edition="201601120260102B">H01M8/1213</further-classification>
        <further-classification edition="201601120260102B">H01M8/2432</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商席瑞絲電力有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CERES POWER LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊因哈特　戈茨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REINHARDT, GOETZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林克　卡特琳娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINK, KATARINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱萊伊　邁赫迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOOLAEI, MEHDI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邦恩　保羅　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BONE, PAUL ADAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莉亞　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEAH, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊勒　哈特維格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEHLE, HARTWIG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關具有改良的電池化學層配置(16)之電化學電池單元 (10)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention is related to an electrochemical cell unit (10) with an improved arrangement of cell chemistry layers (16).</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電化學電池單元/電池單元</p>
        <p type="p">12:互連結構/互連板</p>
        <p type="p">14:支撐結構/支撐板</p>
        <p type="p">15:電池體積/電池空間/流體體積</p>
        <p type="p">16:電池化學層</p>
        <p type="p">18:燃料電極層</p>
        <p type="p">20:氧化劑電極層</p>
        <p type="p">22:電解質層</p>
        <p type="p">28:堆疊方向</p>
        <p type="p">34:邊緣/外周</p>
        <p type="p">36:外周/穿通孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="938" publication-number="202615425">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615425</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119892</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻劑組成物、阻劑圖型形成方法、化合物及高分子化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07D307/33</main-classification>
        <further-classification edition="200601120260102B">C07D307/77</further-classification>
        <further-classification edition="200601120260102B">C07D493/18</further-classification>
        <further-classification edition="200601120260102B">C08F212/14</further-classification>
        <further-classification edition="200601120260102B">C08F220/10</further-classification>
        <further-classification edition="200601120260102B">C08F8/12</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤広樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　慶信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, KHANHTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長峰高志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAMINE, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]本發明提供一種阻劑組成物，其係於阻劑圖型的形成中，可維持良好的感度亦可減低粗糙度且耐蝕刻性優異的阻劑組成物。  &lt;br/&gt;　　[解決手段]一種含有樹脂成分之阻劑組成物，該樹脂成分具有由一般式(a0-m0)所示化合物衍生的構成單位。一般式(a0-m0)中，W為含聚合性基之基。Ar&lt;sup&gt;01&lt;/sup&gt;為亦可具有取代基之芳香族基。L&lt;sup&gt;01&lt;/sup&gt;及L&lt;sup&gt;02&lt;/sup&gt;各自獨立地為2價的連結基或單鍵。R&lt;sup&gt;01&lt;/sup&gt;為烷基或氫原子。Z&lt;sup&gt;0&lt;/sup&gt;為含內酯之環式基、含   -SO&lt;sub&gt;2&lt;/sub&gt;-之環式基或含碳酸酯之環式基。m0及n0在原子價容許之下，各自獨立地為1以上的整數。  &lt;br/&gt;　　  &lt;br/&gt;&lt;img align="absmiddle" height="197px" width="340px" file="ed10098.JPG" alt="ed10098.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="939" publication-number="202615969">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615969</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119920</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於特徵化半導體微影之測量設備的方法以及測量設備</chinese-title>
        <english-title>METHOD FOR CHARACTERIZING A MEASUREMENT APPARATUS FOR SEMICONDUCTOR LITHOGRAPHY AND MEASUREMENT APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260112B">G03F1/84</main-classification>
        <further-classification edition="201101120260112B">G01M99/00</further-classification>
        <further-classification edition="200601120260112B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS SMT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉茨施　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RATZSCH, STEPHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施邁斯納　羅曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHMEISSNER, ROMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明的一種用於特徵化半導體微影之一測量設備的方法，包含以下步驟：  &lt;br/&gt;執行複數個測量；特別是標記特性或晶粒特性（例如，配準值或CD值）  &lt;br/&gt;確定得自平均的測量結果的一信賴區間的寬度與用於所執行之所有測量的測量值的子集的元素數量之間的一關係。  &lt;br/&gt;此外，本發明有關於應用此方法的測量設備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a method for characterizing a measurement apparatus for semiconductor lithography, comprising the following steps: &lt;br/&gt;- performing a plurality of measurements, in particular of a marker property or die property (for example, registration values or CD values) &lt;br/&gt;- determining a relationship between the width of a confidence interval of the measurement result from averaging and the number of elements of a subset of all the measurements carried out. &lt;br/&gt;Furthermore, the invention relates to a measurement apparatus in which the method is applied.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:第一步驟</p>
        <p type="p">13:第二步驟</p>
        <p type="p">14:第三步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="940" publication-number="202616449">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616449</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119955</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理系統、儲存由致動器在半導體處理系統之閘閥中的運動產生之能量的方法以及致動器</chinese-title>
        <english-title>SUBSTRATE PROCESSING SYSTEM, METHOD OF STORING ENERGY GENERATED FROM MOTION OF AN ACTUATOR IN A GATE VALVE OF A SEMICONDUCTOR PROCESSING SYSTEM, AND ACTUATOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H01L21/677</main-classification>
        <further-classification edition="200601120260112B">H02K7/18</further-classification>
        <further-classification edition="200601120260112B">H02J7/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈布　薩拉姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARB, SALAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班納　薩梅爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANNA, SAMER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹蒂旺　凱爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANTIWONG, KYLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種具有一閘閥總成之基板處理系統。該基板處理系統包括：一閘閥本體，界定一閘閥通道；一閥組件，可移動以打開及關閉該閘閥通道；一致動器，耦接至該閥組件；以及一發電機，耦接至該致動器之一可移動組件。該可移動組件之機械運動控制該閥組件之移動以打開及關閉該閘閥通道。當該可移動組件處於運動中時，該發電機經組態以將該可移動組件之該機械運動轉換成電能，該電能可經儲存及再使用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate processing system having a gate valve assembly is provided. The substrate processing system includes a gate valve body defining a gate valve passage, a valve component that is movable to open and close the gate valve passage, an actuator coupled to the valve component, and an electrical generator coupled to a movable component of the actuator. The mechanical motion of the movable component controls movement of the valve component to open and close the gate valve passage. When the movable component is in motion, the electrical generator is configured to convert the mechanical motion of the movable component to electrical energy, which may be stored and reused.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板處理系統</p>
        <p type="p">20:基板處理腔室</p>
        <p type="p">22:基板支撐件</p>
        <p type="p">30:負載鎖模組</p>
        <p type="p">32:基板固持組件</p>
        <p type="p">50:基板處置腔室</p>
        <p type="p">52:機械臂</p>
        <p type="p">60:裝備前端模組</p>
        <p type="p">62:機械臂</p>
        <p type="p">70-1:FOUP</p>
        <p type="p">70-4:FOUP</p>
        <p type="p">100:閘閥</p>
        <p type="p">100B:閘閥</p>
        <p type="p">100C:閘閥</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="941" publication-number="202615706">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615706</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119956</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於形成半導體結構的方法、用於在基板上積沉偶極層的方法以及用於形成半導體裝置用之閘極結構的相關方法</chinese-title>
        <english-title>METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE, METHOD FOR DEPOSITING A DIPOLE LAYER ON A SUBSTRATE, AND ASSOCIATED METHODS FOR FORMING A GATE STRUCTURE FOR A SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">C23C16/455</main-classification>
        <further-classification edition="200601120260112B">C23C16/34</further-classification>
        <further-classification edition="200601120260112B">C23C16/40</further-classification>
        <further-classification edition="200601120260112B">C23C16/56</further-classification>
        <further-classification edition="202501120260112B">H01L21/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯　福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希羅　艾瑞克　詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHERO, ERIC JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仁頡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, REN-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露揭露用於形成半導體結構之方法。所揭露之方法包括藉由循環沉積製程在高k介電材料表面上沉積包含三元鎵材料的偶極層。亦揭露藉由原子層沉積製程在基板上沉積偶極層的方法。亦揭露使用三元鎵材料形成半導體裝置的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods for forming a semiconductor structure are disclosed. The methods disclosed include depositing a dipole layer comprising a ternary gallium material on a surface of a high-k dielectric material by a cyclical deposition process. Methods for depositing a dipole layer on a substrate by an atomic layer deposition process are also disclosed. Methods of forming a semiconductor device employing a ternary gallium material are also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:步驟</p>
        <p type="p">104:步驟</p>
        <p type="p">106:子步驟</p>
        <p type="p">108:子步驟</p>
        <p type="p">110:子步驟</p>
        <p type="p">112:步驟</p>
        <p type="p">114:循環迴路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="942" publication-number="202615902">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615902</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120011</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學積層體、影像顯示面板及影像顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">G02B5/30</main-classification>
        <further-classification edition="201901120260113B">B32B7/023</further-classification>
        <further-classification edition="201901120260113B">B32B7/025</further-classification>
        <further-classification edition="200601120260113B">B32B27/00</further-classification>
        <further-classification edition="201801120260113B">C09J7/38</further-classification>
        <further-classification edition="200601120260113B">C09J11/00</further-classification>
        <further-classification edition="200601120260113B">C09J133/14</further-classification>
        <further-classification edition="201501120260113B">G02B1/16</further-classification>
        <further-classification edition="200601120260113B">G02F1/1333</further-classification>
        <further-classification edition="200601120260113B">G02F1/1335</further-classification>
        <further-classification edition="200601120260113B">G09F9/00</further-classification>
        <further-classification edition="200601120260113B">H05B33/14</further-classification>
        <further-classification edition="202301120260113B">H10K50/85</further-classification>
        <further-classification edition="202301120260113B">H10K50/86</further-classification>
        <further-classification edition="202301120260113B">H10K59/10</further-classification>
        <further-classification edition="202301120260113B">H10K85/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本悟士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鶴留雅之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSURUDOME, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村智之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, TOMOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明所提供之光學積層體依序包含黏著片、抗靜電層及光學薄膜，且滿足以下式(1)；式(1)之A係光學積層體中，黏著片之與抗靜電層相反側之主面的表面電阻率(單位：Ω/□)。B係歷經德國工業規格DIN75220所規定之耐候性試驗(試驗條件：Z-IN1)後之光學積層體中，黏著片之與抗靜電層相反側之主面的表面電阻率(單位：Ω/□)。該光學積層體適合應用於在車載等之嚴酷環境下使用之影像顯示裝置。&lt;br/&gt;  -1≦logB-logA≦2　　　　(1)</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:黏著片</p>
        <p type="p">2:抗靜電層</p>
        <p type="p">3:光學薄膜</p>
        <p type="p">10,10A:光學積層體</p>
        <p type="p">5:主面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="943" publication-number="202616371">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616371</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120061</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用電漿抑制之直立及橫向特徵間隙填充方法</chinese-title>
        <english-title>METHODS FOR GAP FILLING VERTICAL AND LATERAL FEATURES WITH PLASMA INHIBITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H01L21/285</main-classification>
        <further-classification edition="200601120260112B">H01J37/32</further-classification>
        <further-classification edition="200601120260112B">H01L21/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索曼　巴斯卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOMAN, BHASKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈許　蘇里亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHOSH, SUPRIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄔晏澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YANZE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達萬　蘇克蘭特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DHAWAN, SUKRANT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛哈羅伊　蘇密特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGHA ROY, SUSMIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛哈爾　阿奇爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGHAL, AKHIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬禮克　亞伯希吉特巴蘇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MALLICK, ABHIJIT BASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種處理具有直立特徵及從該直立特徵延伸的複數個橫向特徵的基板的方法。該方法包含將直立特徵及複數個橫向特徵的表面暴露於由抑制氣體混合物產生的各向異性電漿，以在直立特徵及複數個橫向特徵的表面上形成抑制梯度，以及在直立特徵及橫向特徵中沉積間隙填充結構。在實施例中，該抑制梯度使得可以改變直立特徵及複數個橫向特徵中間隙填充結構的生長速率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of processing a substrate with a vertical feature and a plurality of lateral features extending from the vertical feature is provided. The method includes exposing surfaces of the vertical feature and the plurality of lateral features to an anisotropic plasma generated from an inhibiting gas mixture to form an inhibition gradient on surfaces of the vertical feature and the plurality of lateral features, and depositing a gapfill structure in the vertical feature and lateral features. In an embodiment, the inhibition gradient provides for varying the growth rate of the gapfill structure in the vertical feature and the plurality of lateral features.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:基板</p>
        <p type="p">202:特徵</p>
        <p type="p">206:溝槽</p>
        <p type="p">216:膜</p>
        <p type="p">218:橫向溝槽</p>
        <p type="p">222:第三側壁</p>
        <p type="p">224:第四側壁</p>
        <p type="p">226:端表面</p>
        <p type="p">232:頂部</p>
        <p type="p">234:底部</p>
        <p type="p">238:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="944" publication-number="202615536">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615536</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120081</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性樹脂組成物、樹脂硬化膜、半導體封裝、顯示裝置</chinese-title>
        <english-title>CURABLE RESIN COMPOSITION, CURED RESIN FILM, SEMICONDUCTOR PACKAGE, AND DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08G59/20</main-classification>
        <further-classification edition="200601120260102B">C08G59/42</further-classification>
        <further-classification edition="200601120260102B">C08G77/14</further-classification>
        <further-classification edition="200601120260102B">C08L63/00</further-classification>
        <further-classification edition="200601120260102B">C08J5/18</further-classification>
        <further-classification edition="200601120260102B">C09K3/10</further-classification>
        <further-classification edition="200601120260102B">H01L23/29</further-classification>
        <further-classification edition="200601120260102B">H01L23/31</further-classification>
        <further-classification edition="202501120260102B">H10H20/854</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日鐵化學材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON STEEL CHEMICAL &amp; MATERIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>内田一幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UCHIDA, KAZUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤恵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, MEGUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種與由含有(甲基)丙烯醯基之化合物所形成之彩色光阻材料或與金屬膜可形成密著性、耐藥品性、耐熱性及透明性優異、且為高硬度之樹脂硬化膜之硬化性樹脂組成物，以及使用前述樹脂硬化膜之半導體封裝、顯示裝置。&lt;br/&gt;本發明之解決手段為一種硬化性樹脂組成物，係含有：(A)於末端部具有異三聚氰酸環與環氧基之通式(1)所表示之環氧化合物、(B)具有至少2個環氧基之環狀聚矽氧化合物、(C)酸產生劑、及(G)溶劑；將前述(A)成分的含有質量設成為分子，前述(A)成分的含有質量相對於前述(A)成分及前述(B)成分的合計質量之質量比[(A)/[(A)+(B)]]為0.2至0.8。&lt;br/&gt;&lt;img align="absmiddle" height="130px" width="312px" file="ed10016.JPG" alt="ed10016.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a curable resin composition which is able with a color resist material formed from a compound comprising (metha)acryloyl group or with a metal film to form a cured resin film having a high hardness and excellent in adhesion, chemicals resistance, thermal resistance and transparence, and a semiconductor package and a display device using the foresaid cured resin film.&lt;br/&gt;The curable resin composition comprises (A) an epoxy compound represented by general formula (1) having an isocyanuric ring and an epoxy group at a terminal thereof, (B) a cyclic silicone compound having at least 2 epoxy groups, (C) an acid generator and (G) a solvent, wherein by taking the mass of the component (A) is taken as the numerator, the mass ratio of the mass of the component (A) to the total mass of the component (A) and the component (B) [(A)/[(A)+(B)]] is 0.2 to 0.8.&lt;br/&gt;&lt;img align="absmiddle" height="108px" width="282px" file="ed10017.JPG" alt="ed10017.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">本案無圖式。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="945" publication-number="202615375">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615375</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120084</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製造高純度1-丁烯及高純度異丁烷之方法</chinese-title>
        <english-title>PROCESS FOR PRODUCING HIGH-PURITY 1-BUTENE AND HIGH-PURITY ISOBUTANE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C5/05</main-classification>
        <further-classification edition="200601120260102B">C07C7/00</further-classification>
        <further-classification edition="200601120260102B">C07C7/04</further-classification>
        <further-classification edition="200601120260102B">C07C7/148</further-classification>
        <further-classification edition="200601120260102B">C07C9/10</further-classification>
        <further-classification edition="200601120260102B">C07C9/12</further-classification>
        <further-classification edition="200601120260102B">C07C11/08</further-classification>
        <further-classification edition="200601120260102B">C07C11/167</further-classification>
        <further-classification edition="200601120260102B">C07C41/06</further-classification>
        <further-classification edition="200601120260102B">C07C43/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商贏創奧克森諾有限責任兩合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVONIK OXENO GMBH &amp; CO. KG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩茲　斯蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEITZ, STEPHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史多尼奧　圭多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STOCHNIOL, GUIDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗萊舍　文詹茲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLEISCHER, VINZENZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆勒　奧利佛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOELLER, OLIVER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種由兩個C4烴流製造高純度1-丁烯及高純度異丁烯的方法，其中該兩個物流部分地合在一起處理。本發明另外亦關於用於執行本發明之方法的設備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a process for producing high-purity 1-butene and high-purity isobutene from two C4 hydrocarbon streams, in which the two streams are in part processed together. The present invention furthermore also relates to an apparatus for carrying out the process according to the invention.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:異丁烷分離單元</p>
        <p type="p">14:反應單元</p>
        <p type="p">16:第一分離單元</p>
        <p type="p">17:回收單元</p>
        <p type="p">18:氫化單元</p>
        <p type="p">20:第二分離單元</p>
        <p type="p">22:第三分離單元</p>
        <p type="p">24:第四分離單元</p>
        <p type="p">A:物流</p>
        <p type="p">B:物流</p>
        <p type="p">C:物流</p>
        <p type="p">D:物流</p>
        <p type="p">E:物流</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="946" publication-number="202615468">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615468</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120125</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>局部晚期或轉移性ＥＧＦＲ突變之非小細胞肺癌之治療</chinese-title>
        <english-title>TREATMENT OF LOCALLY ADVANCED OR METASTATIC EGFR-MUTATED NON-SMALL CELL LUNG CANCER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07K16/28</main-classification>
        <further-classification edition="200601120260102B">A61K39/395</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
        <further-classification edition="200601120260102B">A61K31/5377</further-classification>
        <further-classification edition="200601120260102B">C07K14/71</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商健生生物科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANSSEN BIOTECH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑姆爾　喬許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAUML, JOSHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴格　馬哈迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAIG, MAHADI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿爾哈達布　阿里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALHADAB, ALI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒斯特　帕梅拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHUSTER, PAMELA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示改善用於局部晚期或轉移性EGFR突變之非小細胞肺癌(non-small cell lung cancer，NSCLC)之治療的包含雙特異性表皮生長因子受體(epidermal growth factor receptor，EGFR)/肝細胞生長因子受體(c-Met)抗體的療法之安全性及功效之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are methods of improving the safety and efficacy of a therapy comprising a bispecific epidermal growth factor receptor (EGFR)/ hepatocyte growth factor receptor (c-Met) antibody for the treatment of locally advanced or metastatic EGFR-mutated non-small cell lung cancer (NSCLC).</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="947" publication-number="202615207">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615207</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120193</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>保持環、基板研磨裝置、基板處理裝置及保持環之清洗方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260114B">B24B37/32</main-classification>
        <further-classification edition="201201120260114B">B24B37/30</further-classification>
        <further-classification edition="201201120260114B">B24B37/10</further-classification>
        <further-classification edition="200601120260114B">B24B55/06</further-classification>
        <further-classification edition="201201120260114B">B24B41/06</further-classification>
        <further-classification edition="200601120260114B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商荏原製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBARA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赤澤賢一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKAZAWA, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>並木計介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAMIKI, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾文岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳凱智</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種安裝在用於將基板壓緊研磨墊之研磨頭的保持環，且具備在與研磨墊抵接之底面形成有從內周側朝向外周側延伸的複數個溝部之環本體，構成形成於環本體之溝部內壁的第一面、以及與該第一面相向之第二面概略平行地形成，第一面及第二面朝向研磨基板時之保持環的旋轉方向而傾斜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">19:保持環</p>
        <p type="p">19A:環本體</p>
        <p type="p">19a:底面</p>
        <p type="p">19b:溝部</p>
        <p type="p">20a:研磨面</p>
        <p type="p">P:區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="948" publication-number="202615850">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615850</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120221</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於在大間距目標中臨界尺寸之物理增強迴歸演算法</chinese-title>
        <english-title>PHYSICS AUGMENTED REGRESSION ALGORITHM FOR CRITICAL DIMENSIONS IN LARGE PITCH TARGETS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G01N21/95</main-classification>
        <further-classification edition="200601120260102B">H01L21/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿金斯　菲利浦　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATKINS, PHILLIP R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史　津川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, JINCHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於判定一樣品之資訊之方法及系統。一個系統包含回應於對一樣品上之一目標結構之照明而偵測信號之一度量子系統。該系統亦包含一物理增強回歸演算法及一目標函數。該目標函數經組態用於將該等經偵測信號與該目標結構之不同實體特性之間的關係分離。該物理增強回歸演算法自該等經偵測信號判定該目標結構之該等不同實體特性之一或多者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and systems for determining information for a specimen are provided. One system includes a metrology subsystem that detects signals responsive to illumination of a target structure on a specimen. The system also includes a physics augmented regression algorithm and an objective function. The objective function is configured for separation of relationships between the detected signals and different physical characteristics of the target structure. The physics augmented regression algorithm determines one or more of the different physical characteristics of the target structure from the detected signals.</p>
      </isu-abst>
      <representative-img>
        <p type="p">126:樣品</p>
        <p type="p">130:寬頻反射光譜儀(BRS)</p>
        <p type="p">132:透鏡</p>
        <p type="p">134:寬頻光譜儀/偵測器</p>
        <p type="p">136:透鏡</p>
        <p type="p">138:孔徑</p>
        <p type="p">140:色散元件</p>
        <p type="p">142:偵測器陣列</p>
        <p type="p">143:反射鏡</p>
        <p type="p">144:探測束</p>
        <p type="p">145:透鏡</p>
        <p type="p">146:光源</p>
        <p type="p">148:反射鏡</p>
        <p type="p">150:反射鏡</p>
        <p type="p">152:電腦子系統</p>
        <p type="p">153:組件</p>
        <p type="p">154:寬頻光譜橢偏儀(BSE)</p>
        <p type="p">155:物理增強回歸演算法</p>
        <p type="p">156:偏振器</p>
        <p type="p">158:聚焦反射鏡</p>
        <p type="p">160:準直反射鏡</p>
        <p type="p">162:旋轉補償器</p>
        <p type="p">164:分析器</p>
        <p type="p">166:反射鏡</p>
        <p type="p">168:膜/膜層</p>
        <p type="p">170:基板</p>
        <p type="p">172:電馬達</p>
        <p type="p">174:束輪廓橢偏儀(BPE)</p>
        <p type="p">176:四分之一波板</p>
        <p type="p">178:偏振器</p>
        <p type="p">180:透鏡</p>
        <p type="p">182:四偵測器</p>
        <p type="p">183:光源/雷射</p>
        <p type="p">184:探測束</p>
        <p type="p">186:反射鏡</p>
        <p type="p">188:反射鏡</p>
        <p type="p">190:反射鏡</p>
        <p type="p">192:束輪廓反射計(BPR)</p>
        <p type="p">194:透鏡</p>
        <p type="p">196:分束器</p>
        <p type="p">198:偵測器陣列</p>
        <p type="p">200:偵測器陣列</p>
        <p type="p">202:偵測器/攝影機</p>
        <p type="p">204:橢偏儀</p>
        <p type="p">206:光源</p>
        <p type="p">208:偏振器</p>
        <p type="p">210:透鏡</p>
        <p type="p">212:透鏡</p>
        <p type="p">214:旋轉補償器</p>
        <p type="p">216:分析器</p>
        <p type="p">218:偵測器</p>
        <p type="p">220:準單色探測束</p>
        <p type="p">222:電馬達</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="949" publication-number="202616807">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616807</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120231</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電磁波屏蔽膜及屏蔽印刷配線板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251107B">H05K9/00</main-classification>
        <further-classification edition="200601120251107B">H05K1/02</further-classification>
        <further-classification edition="200601120251107B">B32B15/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商拓自達電線股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TATSUTA ELECTRIC WIRE &amp; CABLE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青柳慶彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOYAGI, YOSHIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邊正博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電磁波屏蔽膜，其即便於高溫高濕環境等嚴苛環境下，屏蔽層及保護層仍難以剝離。本發明之電磁波屏蔽膜，特徵在於具備：屏蔽層，其包含金屬層；錨定層，其積層於上述屏蔽層；及保護層，其積層於上述錨定層之與上述屏蔽層相反側；並且，上述錨定層含有酸值為2800g/eq以上且5400g/eq以下之胺甲酸酯樹脂。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電磁波屏蔽膜</p>
        <p type="p">10:接著劑層</p>
        <p type="p">20:屏蔽層</p>
        <p type="p">25:錨定層</p>
        <p type="p">30:保護層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="950" publication-number="202616900">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616900</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120233</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光檢測器及光檢測器之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260114B">H10F30/22</main-classification>
        <further-classification edition="202501120260114B">H10F77/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>細山知宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSOYAMA, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高塚雅嗣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKATSUKA, MASATSUGU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>港谷恭輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTANI, KYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯間敦矢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IIMA, ATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之光檢測器包含受光元件、及封裝。封裝具有底壁、框壁、及窗構件。框壁具有：第1部分，其包圍受光元件，且具有與窗構件之內表面對向之上表面；及第2部分，其位於第1部分上，具有包圍窗構件之側面之內側面。窗構件經由配置於內表面與上表面之間且與側面接觸之接著構件，接合於上表面。在窗構件與框壁之間設置有通氣口。通氣口係由內表面與上表面之間之第1空間、及側面與內側面之間之第2空間形成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光檢測器</p>
        <p type="p">10:受光元件</p>
        <p type="p">11:讀出積體電路</p>
        <p type="p">20:封裝</p>
        <p type="p">40:框壁</p>
        <p type="p">41b,42b:上表面(支持面)</p>
        <p type="p">41c,42c:內側面</p>
        <p type="p">42:第2部分</p>
        <p type="p">42e:角部</p>
        <p type="p">50:窗構件</p>
        <p type="p">51,52:邊部</p>
        <p type="p">60:接著構件</p>
        <p type="p">70:通氣口</p>
        <p type="p">II-II,III-III:線</p>
        <p type="p">X,Y,Z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="951" publication-number="202616362">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616362</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120256</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含金屬之膜圖案之形成方法</chinese-title>
        <english-title>METAL-CONTAINING FILM PATTERNING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H01L21/027</main-classification>
        <further-classification edition="200601120260112B">H01L21/3065</further-classification>
        <further-classification edition="200601120260112B">H01L21/308</further-classification>
        <further-classification edition="200601120260112B">H01L21/311</further-classification>
        <further-classification edition="200601120260112B">H01L21/3213</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林直貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口秀範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, HIDENORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石綿健汰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIWATA, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供藉由將經電漿照射的含金屬之膜圖案用於蝕刻遮罩而能夠在被加工膜形成邊緣粗糙度良好的圖案的方法。&lt;br/&gt;  在本發明中，提供一種圖案形成方法，係在基板上形成圖案的方法，其包括下列步驟：&lt;br/&gt;  (I-1)在形成有被加工膜的基板上塗佈含金屬之膜形成用組成物後，進行熱處理以形成含金屬之膜；&lt;br/&gt;  (I-2)在含金屬之膜直接或間接地形成圖案；&lt;br/&gt;  (I-3)對該含金屬之膜圖案進行電漿照射；&lt;br/&gt;  (I-4)將經電漿照射的含金屬之膜圖案用於蝕刻遮罩，在被加工膜直接或間接地形成圖案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a patterning process for forming a pattern on a substrate, including the steps of: (I-1) applying a composition for forming a metal­containing film onto a substrate on which a film to be processed has been formed, followed by heating to form a metal-containing film; (I-2) forming a pattern directly &lt;br/&gt; or indirectly in the metal-containing film; (I-3) subjecting the pattern of the metal-containing film to plasma irradiation; and (I-4) forming the pattern directly or indirectly in the film to be processed while using the plasma-irradiated pattern of the metal­containing film as an etching mask. This can provide a method that makes it possible to form a pattern having excellent edge roughness in a film to be processed by using a plasma-irradiated metal-containing film pattern as an etching mask.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:被加工基板</p>
        <p type="p">2:被加工層</p>
        <p type="p">2a:圖案(形成於被加工層的圖案)</p>
        <p type="p">3:含金屬之膜</p>
        <p type="p">3a:含金屬之膜圖案</p>
        <p type="p">3b:電漿照射後的含金屬之膜圖案</p>
        <p type="p">6:阻劑上層膜</p>
        <p type="p">6a:阻劑上層膜圖案</p>
        <p type="p">7:曝光部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="952" publication-number="202615571">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615571</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120280</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08K9/08</main-classification>
        <further-classification edition="200601120260102B">C08L101/12</further-classification>
        <further-classification edition="200601120260102B">C08J3/20</further-classification>
        <further-classification edition="200601120260102B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商花王股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小田義朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ODA, YOSHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小塚寛斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOZUKA, HIROTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>星田浩樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSHIDA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浜田文哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMADA, FUMIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種樹脂組合物，其含有於無機粒子表面具有高分子接枝鏈之複合粒子及樹脂，上述無機粒子之平均粒徑大於200 nm且為3,000 nm以下，上述樹脂係滿足以下(1)～(3)之條件之至少一者之樹脂[(1)硬化性樹脂；(2)玻璃轉移點、Tg為135℃以上之熱塑性樹脂；(3)熔點、Tm為230℃以上之熱塑性樹脂]。根據本發明，可提供一種含有於難以熔融混練之樹脂中之分散性優異之複合粒子之樹脂組合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="953" publication-number="202616123">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616123</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120286</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在虛擬製造平台中ＤＯＥ結果檢查用的製程瀏覽器</chinese-title>
        <english-title>PROCESS NAVIGATOR FOR DOE RESULTS CHECKING IN VIRTUAL FABRICATION PLATFORM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260102B">G06F30/20</main-classification>
        <further-classification edition="202001120260102B">G06F30/27</further-classification>
        <further-classification edition="200601120260102B">H01L21/66</further-classification>
        <further-classification edition="200601120260102B">H01L21/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王青鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, QING PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金正勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JEONG HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳育德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU DE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃仕澔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHI-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恰克羅夫　伊凡　雷得夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAKAROV, IVAN RADEV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃文　約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ERVIN, JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　寓瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布盧姆　查克里　傑克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLUM, ZACHARY JAKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕特爾　蘇瑞吉　康利旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATEL, SURAJ KAMLESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福斯特　奧斯汀　凱西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAUCETT, AUSTIN CASEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索爾　哲夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOL, ZIV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>路羽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於查看虛擬計量資料的技術係予以提供。虛擬計量資料可使用經過訓練的模型或模擬演算法產生。使用者介面可接收用以查看虛擬計量資料的請求。虛擬計量資料可響應該請求而加以產生及/或檢索。互動式使用者介面係顯示有虛擬計量資料。互動式使用者介面有助於根據接收到的選擇查看不同的虛擬計量資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Techniques for viewing virtual metrology data are provided. Virtual metrology data may be generated using trained models or simulation algorithms. A user interface may receive requests to view virtual metrology data. The virtual metrology data may be generated and/or retrieved in response to the request. An interactive user interface is displayed with the virtual metrology data. The interactive user interface facilitates viewing different virtual metrology data based on received selections.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:使用者介面</p>
        <p type="p">104:輸入製程參數決定邏輯</p>
        <p type="p">105:訓練模型邏輯</p>
        <p type="p">106:製造程序模擬邏輯</p>
        <p type="p">108:結果檢視器邏輯</p>
        <p type="p">110:(模擬的製造基板)和虛擬計量資料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="954" publication-number="202615692">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615692</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120292</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>針對後段製程金屬化的使用氧化劑之有機金屬膜轉化</chinese-title>
        <english-title>CONVERSION OF ORGANOMETAL FILMS USING OXIDANTS FOR BEOL METALLIZATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C23C16/08</main-classification>
        <further-classification edition="200601120260102B">C23C16/455</further-classification>
        <further-classification edition="200601120260102B">C23C16/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼迪亞　大衛　約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANDIA, DAVID JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布萊克尼　凱爾　喬丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLAKENEY, KYLE JORDAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格里菲斯　馬修　伯特倫　愛德華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRIFFITHS, MATTHEW BERTRAM EDWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡那卡沙巴怕希　希瓦難陀　克里希那</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANAKASABAPATHY, SIVANANDA KRISHNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供用於沉積金屬在用於後段製程基板中之雙鑲嵌結構之內連線上之方法及設備。方法包括，藉由不含氯的有機金屬前驅物以沉積含有機金屬的膜在內連線上、以及利用氧化劑以使含有機金屬的膜轉化為金屬氧化物。接著使金屬氧化物還原，以形成擴散層在內連線上方。方法亦包括，進一步金屬沉積在藉由轉化所形成之擴散層上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and apparatuses for depositing metals on interconnects for dual damascene structures in back-end-of-line substrates are provided. The methods include deposition of an organometal-containing film by a chlorine-free organometal precursor on an interconnect and conversion of the organometal-containing film to a metal oxide with an oxidant. The metal oxide is then reduced to form a diffusion layer over the interconnect. The method also includes further metal deposition over the diffusion layer formed by the conversion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:橫剖面圖</p>
        <p type="p">101:基板</p>
        <p type="p">103:含金屬膜</p>
        <p type="p">105:含金屬氧化物的層</p>
        <p type="p">107:金屬膜</p>
        <p type="p">109:含金屬膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="955" publication-number="202616814">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616814</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120326</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路結構以及製造積體電路的方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT(IC) STRUCTURE AND METHODS OF MANUFACTURING INTEGRATED CIRCUITS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">H10B10/00</main-classification>
        <further-classification edition="202501120260102B">H10D84/85</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張峰銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, FENG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王屏薇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種IC結構，包含基板，具有SRAM區域、邏輯區域，及橫跨SRAM區域與邏輯區域之間的邊緣區域；形成在基板中的摻雜井，包含第一N型井、第二N型井，及P型井；形成在摻雜井上並沿第一方向縱向地定向的主動區；形成在基板上並圍繞主動區的淺溝槽隔離結構；形成在主動區上並沿垂直於第一方向的第二方向縱向地定向的閘極結構；及形成在邊緣區域中並沿第二方向縱向地定向的第一隔離結構。閘極結構和第一隔離結構沿第一方向以週期性的尺寸Pg均勻地分布，第一N型井和第二N型井彼此相隔小於3倍的該週期性的尺寸Pg的第一尺寸並由P型井分開。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an IC structure that includes a substrate having a SRAM region, a logic region, and an edge region spanning between the SRAM region and the logic region; doped wells formed in the substrate and including a first N-well, a second N-well and a P-well; active regions formed on the doped wells and longitudinally oriented along a first direction; a STI structure formed on the substrate and surrounding the active regions; gate structures formed on the active regions and longitudinally oriented along a second direction perpendicular to the first direction; and a first isolation structure formed in the edge region and longitudinally oriented along the second direction, wherein the gate structures and the first isolation structure are evenly distributed along the first direction with a periodic dimension Pg, the first and second N-wells are distanced by a first dimension less than 3 times the periodic dimension Pg and separated by the P-well.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:IC結構</p>
        <p type="p">22:SRAM區域</p>
        <p type="p">24:邊緣區域/過渡區域</p>
        <p type="p">24S:SRAM邊緣區域/SRAM邊緣單元</p>
        <p type="p">24L:邏輯邊緣區域/邏輯邊緣單元</p>
        <p type="p">24D:介電部分</p>
        <p type="p">26:邏輯區域</p>
        <p type="p">De,Dl,Ds,Da1,Da2:尺寸</p>
        <p type="p">Pg:週期性的尺寸/尺寸/間距</p>
        <p type="p">Wps,Wns,Wpl,Wnl:寬度</p>
        <p type="p">36,38:主動區</p>
        <p type="p">40:閘極結構</p>
        <p type="p">42:N型井</p>
        <p type="p">44:P型井</p>
        <p type="p">58:隔離結構/STI結構</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="956" publication-number="202615139">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615139</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120363</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合半透膜、分離膜組件、液體分離裝置及複合半透膜的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B01D69/02</main-classification>
        <further-classification edition="200601120260102B">B01D69/10</further-classification>
        <further-classification edition="200601120260102B">B01D69/12</further-classification>
        <further-classification edition="200601120260102B">B01D71/56</further-classification>
        <further-classification edition="200601120260102B">B01D67/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>誉田剛士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONDA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡本宜記</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMOTO, YOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉松朋希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIMATSU, TOMOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小川貴史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGAWA, TAKAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是有關於一種複合半透膜，其包括多孔性支撐層、及設置於所述多孔性支撐層上的分離功能層，所述複合半透膜中，所述分離功能層含有具有鹵素的聚醯胺，所述分離功能層表面中的鍵結有鹵素的碳數相對於總碳數之比為0.002以上且0.016以下，且相對於所述複合半透膜，於5.5 MPa的操作壓力下使25℃、pH為6.5、氯化鈉濃度為32000 mg/L、硼濃度為5 mg/L的水溶液透過時的硼去除率為90%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="957" publication-number="202616855">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616855</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120389</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置結構與製作半導體裝置結構的方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF MAKING SEMICONDUCTOR DEVICE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251110B">H10D30/60</main-classification>
        <further-classification edition="202501120251110B">H10D62/10</further-classification>
        <further-classification edition="202501120251110B">H10D62/60</further-classification>
        <further-classification edition="202501120251110B">H10D64/20</further-classification>
        <further-classification edition="200601120251110B">H01L21/76</further-classification>
        <further-classification edition="200601120251110B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江宏禮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, HUNG-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林威呈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾健庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TZENG, JIANN-TYNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置結構包括複數個電晶體。複數個電晶體中之各者包括奈米結構，其具有第一摻雜劑類型，其中奈米結構在第一方向上延伸；閘極結構；第一源極/汲極(S/D)區；及第二S/D區。半導體裝置結構進一步包括在第二方向上從複數個電晶體偏移開的第二奈米結構，其中第二奈米結構具有與第一摻雜劑類型相反的第二摻雜劑類型。半導體裝置結構進一步包括與第二奈米結構直接接觸的介電材料。介電材料(1)在第二方向上與閘極結構或第一S/D區中之至少一者對準；或(2)在第一方向上延伸等於或大於閘極結構、第一S/D區、及第二S/D區之組合寬度的距離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device structure includes a plurality of transistors. Each of the plurality of transistors includes a nanostructure having a first dopant type, wherein the nanostructure extends in a first direction; a gate structure; a first source/drain (S/D) region; and a second S/D region. The semiconductor device structure further includes a second nanostructure offset from the plurality of transistors in a second direction, wherein the second nanostructure has a second dopant type opposite the first dopant type. The semiconductor device structure further includes a dielectric material in direct contact with the second nanostructure. The dielectric material is (1) aligned with at least one of the gate structure or the first S/D region in the second direction; or (2) extends in the first direction for a distance equal to or greater than a combined width of the gate structure, the first S/D region and the second S/D region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:CFET結構</p>
        <p type="p">210a:第一組奈米線</p>
        <p type="p">210b:第二組奈米線</p>
        <p type="p">215:第一S/D電極</p>
        <p type="p">220:第二S/D電極/源極/汲極電極</p>
        <p type="p">225:通孔</p>
        <p type="p">230:閘電極</p>
        <p type="p">240:頂部互連結構</p>
        <p type="p">250:底部互連結構</p>
        <p type="p">260:輸入導線</p>
        <p type="p">270:輸出導線</p>
        <p type="p">A-A:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="958" publication-number="202616545">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616545</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120406</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>對用於鋰離子電池的電極進行預鋰化的方法和由其獲得的鋰離子電池</chinese-title>
        <english-title>METHODS OF PRE-LITHIATING ELECTRODES FOR LITHIUM-ION BATTERIES, AND LITHIUM-ION BATTERIES OBTAINED THEREFROM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260102B">H01M10/0525</main-classification>
        <further-classification edition="200601120260102B">H01M4/02</further-classification>
        <further-classification edition="200601120260102B">H01M4/04</further-classification>
        <further-classification edition="201001120260102B">H01M4/13</further-classification>
        <further-classification edition="200601120260102B">H01M4/36</further-classification>
        <further-classification edition="200601120260102B">H01M4/38</further-classification>
        <further-classification edition="200601120260102B">H01M4/42</further-classification>
        <further-classification edition="200601120260102B">H01M4/46</further-classification>
        <further-classification edition="201001120260102B">H01M4/485</further-classification>
        <further-classification edition="200601120260102B">H01M4/80</further-classification>
        <further-classification edition="200601120260102B">H01M4/86</further-classification>
        <further-classification edition="201001120260102B">H01M4/505</further-classification>
        <further-classification edition="201001120260102B">H01M4/525</further-classification>
        <further-classification edition="201001120260102B">H01M4/58</further-classification>
        <further-classification edition="201001120260102B">H01M4/587</further-classification>
        <further-classification edition="200601120260102B">H01M4/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商泰法斯特公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TYFAST</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉豪東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HAODONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉奧　杰拉爾多　約瑟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏　敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金鋼云</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KANGWOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮詩杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, SHIJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">現有的預鋰化方法受到許多限制的困擾，諸如不均勻性、過度鋰化、與電池組件的相容性差以及規模化挑戰。本揭露內容提供了針對有效地預鋰化電極的問題的若干技術解決方案。一些變型提供了一種對含有鋰釩氧化物的鋰離子電池進行預鋰化的電化學方法。多孔電極改進了V&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;5&lt;/sub&gt;預鋰化過程，提高了整體效率。揭露了採用兩個或三個電極的各種構型。其他方法利用具有電極前體粉末材料的運輸路徑中的液體鋰離子導體來預鋰化用於鋰離子電池的任何電極材料，以使鋰與電極前體材料反應，從而生成預鋰化電極。還有其他方法預鋰化用於鋰離子電池的任何電極材料，機械地攪拌電極前體材料與固態含鋰材料，以使鋰與電極前體材料反應，從而生成預鋰化電極。呈現了實驗資料來證明該技術。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Existing pre-lithiation methods are beset by many limitations, such as non-uniformity, over-lithiation, poor compatibility with battery components, and scaling challenges. This disclosure provides several technical solutions to the problem of effectively pre-lithiating electrodes. Some variations provide an electrochemical method of pre-lithiating a lithium-ion battery containing lithium vanadium oxide. Porous electrodes ameliorate the V&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;5&lt;/sub&gt; pre-lithiation procedure, enhancing overall efficiency. Various configurations are disclosed, employing two or three electrodes. Other methods pre-lithiate any electrode material for a lithium-ion battery, utilizing a liquid lithium-ion conductor in a transport path with an electrode precursor powder material, to react lithium with the electrode precursor material, thereby generating a pre-lithiated electrode. Still other methods pre-lithiate any electrode material for a lithium-ion battery, mechanically agitating an electrode precursor material with a solid lithium-containing material, to react lithium with the electrode precursor material, thereby generating a pre-lithiated electrode. Experimental data are presented to demonstrate the technology.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="959" publication-number="202615561">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615561</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120446</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用以分解氧化分解性成形物之分解液</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08J11/16</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商長瀨化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGASE CHEMTEX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久留島康功</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURUSHIMA, YASUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芳野一希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHINO, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神谷幸佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMIYA, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種分解液，其能夠於短時間內分解氧化分解性成形物。本發明係關於一種用以分解氧化分解性成形物之分解液，其包含有機溶劑、氧化劑、及水。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="960" publication-number="202615511">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615511</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120459</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>導電性糊組成物、導電性糊組成物之製造方法及電子零件之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F220/10</main-classification>
        <further-classification edition="200601120260102B">C08F220/26</further-classification>
        <further-classification edition="200601120260102B">C08L33/04</further-classification>
        <further-classification edition="200601120260102B">C08L33/06</further-classification>
        <further-classification edition="200601120260102B">C08L33/14</further-classification>
        <further-classification edition="201801120260102B">C08K3/01</further-classification>
        <further-classification edition="200601120260102B">C08K3/08</further-classification>
        <further-classification edition="200601120260102B">H01B1/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商積水化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山內健司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAUCHI, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大丈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKA, JO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種無機粒子之分散性良好，且發揮充分之儲存穩定性，電極密接性、耐起泡性、燒結性優異之導電性糊組成物。又，本發明提供一種該導電性糊組成物之製造方法、使用該導電性糊組成物之電子零件之製造方法。  &lt;br/&gt;本發明係一種導電性糊組成物，其含有(甲基)丙烯酸樹脂系分散劑（A1）、無機粒子（B1）、溶劑（C1）及黏合劑樹脂（D1），上述(甲基)丙烯酸樹脂系分散劑（A1）含有50重量%以上之來自酯取代基中具有分支結構之(甲基)丙烯酸酯之鏈段、1重量%以上30重量%以下之來自酯取代基中含有氧之(甲基)丙烯酸酯之鏈段，上述酯取代基中含有氧之(甲基)丙烯酸酯中之酯取代基中之氧重量比為0.28以上0.36以下，且上述酯取代基中之氧於分子中之重量比為0.23以上0.33以下，上述無機粒子（B1）包含平均粒徑為0.05 μm以上10 μm以下之導電粒子，上述溶劑（C1）之沸點為200℃以上250℃以下，且上述黏合劑樹脂（D1）為(甲基)丙烯酸樹脂。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="961" publication-number="202616319">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616319</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120461</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有原位成像計量的緊湊光束處理系統</chinese-title>
        <english-title>COMPACT BEAM PROCESSING SYSTEM HAVING IN-SITU IMAGING METROLOGY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">H01J37/08</main-classification>
        <further-classification edition="200601120260114B">H01J37/244</further-classification>
        <further-classification edition="200601120260114B">H01J37/317</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普拉格　瑞安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRAGER, RYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩雷爾　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEREL, ALEXANDER S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種處理系統。該處理系統可以包含電漿腔室，用以產生電漿；抽取系統，用以從電漿腔室抽取離子束並將離子束遞送至腔室外的基板位置；以及原位光束計量系統，具有至少一個偵測器，用以在成像區域內成像該離子束，該成像區域延伸於電漿腔室與基板位置之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A processing system. The processing system may include a plasma chamber to generate a plasma; an extraction system, to extract an ion beam from the plasma chamber and deliver the ion beam to a substrate position, external to the plasma chamber; and an in-situ beam metrology system, having at least one detector to image the ion beam in imaging region that extends between the plasma chamber and the substrate position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:處理系統</p>
        <p type="p">102:功率產生器</p>
        <p type="p">104:電漿腔室</p>
        <p type="p">106:電漿</p>
        <p type="p">108:光束抽取供應</p>
        <p type="p">110:處理腔室</p>
        <p type="p">112:抽取孔</p>
        <p type="p">114:離子束</p>
        <p type="p">116:基板固持件</p>
        <p type="p">118:基板</p>
        <p type="p">120:偵測器</p>
        <p type="p">130:控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="962" publication-number="202615469">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615469</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120464</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>重複結合複數個抗原的抗原結合分子</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07K16/28</main-classification>
        <further-classification edition="200601120260102B">C07K16/24</further-classification>
        <further-classification edition="200601120260102B">C07K16/00</further-classification>
        <further-classification edition="200601120260102B">A61K39/395</further-classification>
        <further-classification edition="200601120260102B">A61K39/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商中外製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUGAI SEIYAKU KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井川智之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IGAWA, TOMOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井慎也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前田敦彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEDA, ATSUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中井貴士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種在早期內囊胞內pH的抗原結合活性較在血漿中pH的抗原結合活性弱的抗體，該抗體可以1分子與複數個分子的抗原結合，延長血漿中半衰期，改善可與抗原結合的時間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="963" publication-number="202616274">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616274</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120477</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>音頻解碼裝置、音頻解碼方法及音頻編碼方法</chinese-title>
        <english-title>AUDIO DECODING DEVICE, AUDIO DECODING METHOD, AND AUDIO ENCODING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260105B">G10L25/69</main-classification>
        <further-classification edition="201301120260105B">G10L19/002</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商杜比實驗室特許公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOLBY LABORATORIES LICENSING CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊德米勒　傑佛瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIEDMILLER, JEFFREY C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞達克里斯納　雷格納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RADHAKRISHNAN, REGUNATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普萊巴迪　馬文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRIBADI, MARVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法拉赫尼　法翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FARAHANI, FARHAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密特斯　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMITHERS, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種音頻解碼方法，包含：藉由音頻解碼器取得編碼位元流，該編碼位元流包括音頻資料及信號資料，該信號資料指示目標物響度值係包括於該編碼位元流中；藉由該音頻解碼器自該編碼位元流取得該目標物響度值；以及藉由該音頻解碼器根據該目標物響度值處理該音頻資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An audio decoding method comprising: obtaining, by an audio decoder, an encoded bitstream, the encoded bitstream including audio data and signaling data, the signaling data indicating that a target loudness value is included in the encoded bitstream; obtaining, by the audio decoder, the target loudness value from the encoded bitstream; and processing, by the audio decoder, the audio data according to the target loudness value.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="964" publication-number="202615972">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615972</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120485</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>增強型運行間製程控制建模平臺</chinese-title>
        <english-title>ENHANCED RUN-TO-RUN PROCESS CONTROL MODELING PLATFORM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">G03F7/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪漢達潘尼　席維庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DHANDAPANI, SIVAKUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡夏　派克尚帕萊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTCHER, PRATIK CHAMPALAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　志健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, STEVEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威利　馬克麥克塔加</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WYLIE, MARK MCTAGGART</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦內博　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANEBO, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">方法包括運行間控制器以獲取計量資料。該運行間控制器與處理腔室相關聯。計量資料來自第一基板。第一基板已依據處理操作在該處理腔室中進行了處理。運行間控制器包括第一模型，該模型配置用於確定基板計量與一或多個製程旋鈕輸入之間的關係。運行間控制器還包括第二模型，該模型配置用於根據第一模型產生的輸出建議一或多個校正動作。該方法進一步包括透過第一模型處理計量資料，以確定基板的計量資料與第一處理操作的製程旋鈕之間的關係。該方法進一步包括由第二模型決定建議的一或多個製程配方更新。該方法進一步包括更新該處理操作的配方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes a run-to-run controller to obtain metrology data. The run-to-run controller is associated with a process chamber. The metrology data is of a first substrate. The first substrate has been processed in the process chamber in accordance with a processing operation. The run-to-run controller includes a first model, configured to determine a relationship between substrate metrology and one or more process knob inputs. The run-to-run controller includes a second model, which is configured to recommend one or more corrective actions based on output generated by the first model. The method further includes processing the metrology data by the first model to determine a relationship between the metrology data of the substrate and process knobs of the first processing operation. The method further includes determining, by the second model, a recommended one or more process recipe updates. The method further includes updating a recipe of the processing operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500A:工作流程</p>
        <p type="p">502:製造設備</p>
        <p type="p">504:製程操作</p>
        <p type="p">506:基板感測</p>
        <p type="p">508:擾動</p>
        <p type="p">510:虛擬計量模型</p>
        <p type="p">512:外部參考計量</p>
        <p type="p">514:運行間控制器</p>
        <p type="p">516:輸入/輸出模型</p>
        <p type="p">518:優化器模型</p>
        <p type="p">520:約束</p>
        <p type="p">522:成本函數</p>
        <p type="p">524:目標</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="965" publication-number="202615525">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615525</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120487</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>經離子注入處理之阻劑下層膜、阻劑下層膜形成用組成物、經離子注入處理之阻劑下層膜之製造方法及層合體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08G8/04</main-classification>
        <further-classification edition="200601120260102B">G03F7/11</further-classification>
        <further-classification edition="200601120260102B">G03F7/16</further-classification>
        <further-classification edition="200601120260102B">G03F7/26</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香西純</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSAI, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德永光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKUNAGA, HIKARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>服部隼人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATTORI, HAYATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種經離子注入處理之阻劑下層膜，其含有包含下述式(1)表示之結構單位的樹脂(I)。  &lt;br/&gt;&lt;img align="absmiddle" height="101px" width="321px" file="ed10152.JPG" alt="ed10152.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(式(1)中，C表示具有芳香族環之結構，D表示具有1個以上的碳原子之結構，＊表示鍵結部位)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="966" publication-number="202615541">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615541</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120512</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱塑性樹脂及包含熱塑性樹脂之成形體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08G63/181</main-classification>
        <further-classification edition="200601120260102B">C08G63/695</further-classification>
        <further-classification edition="200601120260102B">C08G63/91</further-classification>
        <further-classification edition="200601120260102B">G02B1/04</further-classification>
        <further-classification edition="200601120260102B">G02B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋元宣人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKIMOTO, HISATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂井健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平川学</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAKAWA, MANABU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>島田昌宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMADA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上等和良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UERA, KAZUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小寺雅斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KODERA, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種在光學用途等中為必要之性質，例如折射率、色像差等性質優異之熱塑性樹脂、包含此種熱塑性樹脂的成形品等。  &lt;br/&gt;　　作為上述課題之解決手段，可舉出以下的熱塑性樹脂。亦即，一種熱塑性樹脂，其具有矽烷構成單元(S)、酯構成單元(I)及二醇構成單元(A)，  &lt;br/&gt;　　前述矽烷構成單元(S)源自包含二芳基二烷氧基矽烷、二芳基二芳氧基矽烷及二芳基單烷氧基單芳氧基矽烷之矽烷化合物的任一者，  &lt;br/&gt;　　前述酯構成單元(I)源自本案說明書中記載的以通式(1)~(6)的任一者表示之二羧酸、單羧酸單酯及羧酸二酯的任一者，  &lt;br/&gt;　　前述二醇構成單元(A)源自本案說明書中記載的以通式(7)~(10)表示之二醇化合物的任一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="967" publication-number="202615100">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615100</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120580</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靶向ＥＮＰＰ３之抗體藥物接合物</chinese-title>
        <english-title>ANTIBODY DRUG CONJUGATES THAT TARGET ENPP3</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260102B">A61K47/68</main-classification>
        <further-classification edition="200601120260102B">C07K16/28</further-classification>
        <further-classification edition="200601120260102B">A61K31/40</further-classification>
        <further-classification edition="200601120260102B">A61K31/16</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商健生生物科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANSSEN BIOTECH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維賈亞拉加汎　斯姆魯蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIJAYARAGHAVAN, SMRUTHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　林曉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LINXIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊希　艾琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LACY, EILYN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈德堡　沙洛姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOLDBERG, SHALOM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克萊因　唐娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLEIN, DONNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威利　克莉絲汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILEY, KRISTEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱拉　克莉絲汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KELLAR, KRISTEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於結合至ENPP3之抗體，以及包含與藥物諸如奧瑞他汀接合的結合至ENPP3之抗體的抗體-藥物接合物。本文亦提供了用於治療實體腫瘤或白血病的方法，其包含投予此類ADC。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to antibodies that bind to ENPP3 and antibody-drug conjugates comprising an antibody that binds to ENPP3 conjugated to a drug, such as an auristatin. Also provided herein are methods for treating a solid tumor or leukemia comprising administering such ADCs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="968" publication-number="202615077">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615077</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120582</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用溶瘤病毒治療膀胱癌之方法</chinese-title>
        <english-title>METHODS OF TREATING BLADDER CANCER USING AN ONCOLYTIC VIRUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260102B">A61K35/761</main-classification>
        <further-classification edition="200601120260102B">A61K48/00</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
        <further-classification edition="200601120260102B">A61P37/04</further-classification>
        <further-classification edition="200601120260102B">C12N7/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商永恆生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CG ONCOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡斯圖里　維杰　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASTURI, VIJAY K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基根　柯克　Ａ　三世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEEGAN, KIRK A. III</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示案提供用於患有膀胱癌之個體之方法，該等方法包括向該個體膀胱內投與溶瘤病毒，諸如克瑞托司替莫基因格拉納諾瑞普韋克(cretostimogene grenadenorepvec)，視情況與一或多種額外治療劑，諸如免疫檢查點調節劑或化學治療劑組合。亦提供用於治療膀胱癌之醫藥組合物及套組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides methods for individuals having bladder cancer comprising intravesically administering to the individual an oncolytic virus, such as cretostimogene grenadenorepvec, optionally in combination with one or more additional therapeutic agents, such as an immune checkpoint modulator or a chemotherapeutic agent. Also provided are pharmaceutical compositions and kits for treating bladder cancer.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="969" publication-number="202615078">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615078</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120584</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於生物標誌物引導之膀胱癌療法之方法及組合物</chinese-title>
        <english-title>METHODS AND COMPOSITIONS FOR BIOMARKER-GUIDED BLADDER CANCER THERAPY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260102B">A61K35/761</main-classification>
        <further-classification edition="200601120260102B">A61K39/395</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
        <further-classification edition="200601120260102B">C12N7/01</further-classification>
        <further-classification edition="201801120260102B">C12Q1/6886</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商永恆生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CG ONCOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡斯圖里　維杰　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASTURI, VIJAY K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基根　柯克　Ａ　三世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEEGAN, KIRK A. III</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示案提供用於患有膀胱癌之個體之方法，該等方法包括向該個體膀胱內投與溶瘤病毒，諸如克瑞托司替莫基因格拉納諾瑞普韋克(cretostimogene grenadenorepvec)，視情況與一或多種額外治療劑，諸如免疫檢查點調節劑或化學治療劑組合。亦提供用於治療膀胱癌之醫藥組合物及套組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides methods for individuals having bladder cancer comprising intravesically administering to the individual an oncolytic virus, such as cretostimogene grenadenorepvec, optionally in combination with one or more additional therapeutic agents, such as an immune checkpoint modulator or a chemotherapeutic agent. Also provided are pharmaceutical compositions and kits for treating bladder cancer.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="970" publication-number="202616287">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616287</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120595</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體的電路及操作記憶體的方法</chinese-title>
        <english-title>MEMORY CIRCUIT AND METHOD FOR OPERATING MEMORY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251209B">G11C11/54</main-classification>
        <further-classification edition="202301120251209B">G06N3/063</further-classification>
        <further-classification edition="200601120251209B">G06N3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤韋翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOU, WEI-XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　露</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, LU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖　思雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提出一種電路。電路包括：記憶體陣列，包括多個記憶體單元，每一記憶體單元包括多個電晶體，且耦合至第一字元線及第二字元線，且接收第一資料元素、存儲第二資料元素及提供第一資料元素及第二資料元素的乘積值。該第一字元線用以接收第一邏輯狀態，對應於二值化第一資料元素，且第二字元線用以接收第二邏輯狀態，對應於二值化第一資料元素。該些電晶體之間的第一內部節點存儲第一邏輯狀態，對應於二值化該第二資料元素，且該些電晶體之間的第二內部節點用以存儲第二邏輯狀態，對應於二值化第二資料元素。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit is provided. The circuit includes a memory array including memory cells, each of the memory cells including a plurality of transistors, and coupled to a first word line and a second word line, and configured to receive a first data element, store a second data element, and provide a multiplication value of the first data element and the second data element. The first word line is configured to receive a first logic state corresponding to the first data element being binarized, and the second word line is configured to receive a second logic state corresponding to the first data element being binarized. A first internal node among the transistors is configured to store a first logic state corresponding to the second data element being binarized, and a second internal node among the transistors is configured to store a second logic state corresponding to the second data element being binarized.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:方法</p>
        <p type="p">510、520、530、540、550、560、570:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="971" publication-number="202616591">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616591</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120608</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>纜線連接方法、連接構件之製造方法及熱處理裝置</chinese-title>
        <english-title>CABLE CONNECTING METHOD, PRODUCTION METHOD OF CONNECTING MEMBER, AND THERMAL PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01R43/02</main-classification>
        <further-classification edition="200601120260102B">H01R43/048</further-classification>
        <further-classification edition="200601120260102B">H01R43/28</further-classification>
        <further-classification edition="200601120260102B">H01R4/02</further-classification>
        <further-classification edition="200601120260102B">H01R4/06</further-classification>
        <further-classification edition="200601120260102B">H01R4/40</further-classification>
        <further-classification edition="200601120260102B">H01R11/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林聡樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, TOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAJIMA, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種可穩定連接導電纜線同時可降低成本的技術。&lt;br/&gt;  本發明之纜線連接方法，用來將設於熱處理裝置並具有加熱器本體及與該加熱器本體導通之端子部的加熱器部，與對該加熱器部供給電力的導電纜線加以連接。該纜線連接方法包含以下步驟：（A）提供用於將該端子部及該導電纜線進行連接的連接構件之步驟、（B）藉由焊接將該連接構件中由與該端子部相同之材料形成的第一部位及該端子部進行接合之步驟，及（C）藉由鉚接將該連接構件中由與該第一部位不同之材料形成的第二部位及該導電纜線進行連接之步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">50:調溫爐</p>
        <p type="p">51:殼體</p>
        <p type="p">70,70’:電源連接構造</p>
        <p type="p">71:固持部</p>
        <p type="p">71a:接觸體</p>
        <p type="p">71b:夾持板</p>
        <p type="p">72:匯流排</p>
        <p type="p">72a:另一面</p>
        <p type="p">73:連接構件</p>
        <p type="p">74:板部</p>
        <p type="p">75:套筒部</p>
        <p type="p">76:導電纜線</p>
        <p type="p">79a:連接器</p>
        <p type="p">79b:螺栓</p>
        <p type="p">79c:螺帽</p>
        <p type="p">741:第一區域</p>
        <p type="p">741a:其中一面</p>
        <p type="p">742:第二區域</p>
        <p type="p">742a:其中一面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="972" publication-number="202616701">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616701</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120623</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>決策反饋等化器以及用來在決策反饋等化器中對輸入訊號進行決策反饋等化的方法</chinese-title>
        <english-title>DECISION FEEDBACK EQUALIZER AND METHOD FOR PERFORMING DECISION FEEDBACK EQUALIZATION ON INPUT SIGNAL IN DECISION FEEDBACK EQUALIZER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250701B">H04L25/02</main-classification>
        <further-classification edition="200601120250701B">H04L25/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種決策反饋等化器以及用來在該決策反饋等化器中對輸入訊號進行決策反饋等化的方法。該決策反饋等化器包含一第一比較器、一第一運算電路、一第二比較器以及一第二運算電路。該第一比較器是用來比較一第一運算訊號以及一第一閾值以產生一第一比較結果，以及該第一運算電路是用來依據該輸入訊號以及該第一比較結果的一第一延遲訊號產生該第一運算訊號。該第二比較器是用來比較一第二運算訊號以及一第二閾值以產生一第二比較結果，以及該第二運算電路是用來依據該輸入訊號以及該第二比較結果的一第二延遲訊號產生該第二運算訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A decision feedback equalizer (DFE) and a method for performing decision feedback equalization on an input signal in the DFE are provided. The DFE includes a first comparator, a first calculating circuit, a second comparator and a second calculating circuit. The first comparator is configured to compare a first calculation signal with a first threshold to generate a first comparison result, and the first calculating circuit is configured to generate the first calculating signal according to the input signal and a first delayed signal of the first comparison result. The second comparator is configured to compare a second calculation signal with a second threshold to generate a second comparison result, and the second calculating circuit is configured to generate the second calculation signal according to the input signal and a second delayed signal of the second comparison result.</p>
      </isu-abst>
      <representative-img>
        <p type="p">40:決策反饋等化器</p>
        <p type="p">101,102:比較器</p>
        <p type="p">111,112:加總電路</p>
        <p type="p">121,122:比較器</p>
        <p type="p">Td1,Td2:預定延遲</p>
        <p type="p">h1,h2:預定係數</p>
        <p type="p">IN:輸入訊號</p>
        <p type="p">OUT&lt;sub&gt;H&lt;/sub&gt;,OUT&lt;sub&gt;L&lt;/sub&gt;:加總訊號</p>
        <p type="p">V&lt;sub&gt;THH&lt;/sub&gt;,V&lt;sub&gt;THL&lt;/sub&gt;:閾值</p>
        <p type="p">CLK:時脈訊號</p>
        <p type="p">R&lt;sub&gt;H&lt;/sub&gt;,R&lt;sub&gt;L&lt;/sub&gt;:輸出訊號</p>
        <p type="p">RD&lt;sub&gt;H1&lt;/sub&gt;,RD&lt;sub&gt;H2&lt;/sub&gt;,RD&lt;sub&gt;L1&lt;/sub&gt;,RD&lt;sub&gt;L2&lt;/sub&gt;:延遲訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="973" publication-number="202615635">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615635</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120644</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可聚合的液晶組合物</chinese-title>
        <english-title>POLYMERIZABLE LIQUID CRYSTAL COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C09K19/52</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商馬克專利公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCK PATENT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬爾卡希　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MULCAHY, STEPHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾倫　詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALLEN, JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡烏爾　莎拉賈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAUR, SARABJOT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於包含配向添加劑之可聚合的液晶組合物(作為液晶材料之子類)，其較佳地不含PFAS (以使得能夠減少全氟碳，且提供環境友好型材料)；由該等組合物獲得之調配物、聚合物及聚合物膜；以及該等組合物、調配物、聚合物及聚合物膜在光學或電光學組件或裝置中之用途，尤其用於數位光學或擴增實境或虛擬實境(AR/VR)應用，如偏振器、光學補償器、反射膜、繞射或表面光柵、布拉格偏振光柵(布拉格PG)、偏振體積光柵(PVG)、偏振體積全像圖(PVH)、盤貝(Pancharatnam Berry；PB)光柵、非機械光束偏轉元件、光學波導、光學耦合器、光學組合器、偏振光束分光器、部分反射鏡、透鏡或PB透鏡。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates topolymerizable liquid crystal compositions (as a subcategory of liquid crystal materials) comprising an alignment additive, which are preferably PFAS-free (for enabling the reduction of perfluorocarbons and providing an environment friendly material), toformulations, polymers and polymer films obtained from such compositions, and tothe use of the compositions, formulations, polymers and polymer films in optical or electrooptical components or devices, especially for digital optics or augmented reality or virtual reality (AR/VR) applications like polarizers, optical compensators, reflective films, diffraction or surface gratings, Bragg polarization gratings (Bragg PG), polarization volume gratings (PVG), polarization volume holograms (PVH), Pancharatnam Berry (PB) gratings, nonmechanical beam steering elements, optical waveguides, optical couplers, optical combiners, polarization beam splitters, partial mirrors, lenses or PB lenses.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="974" publication-number="202615453">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615453</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120666</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>單特異性及雙特異性TAU結合蛋白及其組合物</chinese-title>
        <english-title>MONOSPECIFIC AND BISPECIFIC TAU BINDING PROTEINS AND COMPOSITIONS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07K14/435</main-classification>
        <further-classification edition="200601120260102B">C07K14/47</further-classification>
        <further-classification edition="200601120260102B">C07K16/18</further-classification>
        <further-classification edition="200601120260102B">C07K16/28</further-classification>
        <further-classification edition="200601120260102B">A61K39/395</further-classification>
        <further-classification edition="200601120260102B">G01N33/68</further-classification>
        <further-classification edition="200601120260102B">A61P25/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商賽諾菲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANOFI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯特朗　菲利普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERTRAND, PHILIPPE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡梅倫　貝特麗斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAMERON, BEATRICE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達布杜比　塔里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DABDOUBI, TARIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德伍德　凱瑟琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEVAUD, CATHERINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜雅爾丹　西蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUJARDIN, SIMON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾奎姆　史蒂芬妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EYQUEM, STEPHANIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里蘇士　多米尼克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LESUISSE, DOMINIQUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫尼爾　米雷里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEUNIER, MIREILLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米肖特　納丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICHOT, NADINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納米　蘇亞德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAIMI, SOUAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇布里爾　法比安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOUBRIER, FABIENNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供靶向tau的結合蛋白、以及靶向tau和中樞神經系統蛋白(例如，轉鐵蛋白受體1)的雙特異性結合蛋白。還提供該等結合蛋白用於治療tau蛋白病之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides binding proteins that target tau, as well as bispecific binding proteins that target tau and a central nervous system protein (e.g., transferrin receptor 1). Also provided is the use of these binding proteins to treat tauopathies.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="975" publication-number="202615644">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615644</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120690</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>剝離劑組合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C11D7/06</main-classification>
        <further-classification edition="200601120260102B">C11D7/26</further-classification>
        <further-classification edition="200601120260102B">C11D7/32</further-classification>
        <further-classification edition="200601120260102B">C11D7/50</further-classification>
        <further-classification edition="200601120260102B">G03F7/42</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商花王股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田晃平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, KOUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小受敦志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKE, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">於一態樣中，本發明提供一種樹脂遮罩之溶解速度優異之剝離劑組合物。  &lt;br/&gt;於一態樣中，本發明係關於一種剝離劑組合物，其含有羥胺(成分A)、除成分A以外之鹼劑(成分B)、除成分A及成分B以外之有機溶劑(成分C)、及水(成分D)，成分C與成分A之質量比C/A為超過2.25且50以下，成分D與成分A之質量比D/A未達11。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="976" publication-number="202616822">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616822</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120721</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置、半導體裝置及其製造方法</chinese-title>
        <english-title>MEMORY DEVICE, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251020B">H10B12/00</main-classification>
        <further-classification edition="202501120251020B">H10D89/10</further-classification>
        <further-classification edition="202001120251020B">G06F30/392</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張永廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YUNG-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪連嶸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, LIEN-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體裝置，包括：具有第一側和第二側的基板；形成在第一側的第一電晶體、第二電晶體、第三電晶體和第四電晶體，第一至第四電晶體均具有p型導電性；形成在第一側且位於第一至第四電晶體上方的第五電晶體和第六電晶體，第五至第六電晶體均具有n型導電性；形成在第一側且位於第五至第六電晶體上方的第一互連結構，並與第一電晶體連接，其中第一互連結構配置為第一位元線的一部分；以及形成在第二側上且也與第一電晶體連接的第二互連結構，其中第二互連結構配置為第一位元線的另一部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device includes a substrate having a first side and a second side; a first transistor, a second transistor, a third transistor, and a fourth transistor formed on the first side, the first to fourth transistors each formed with a p-type conductivity; a fifth transistor and a sixth transistor formed on the first side and over the first to fourth transistors, the fifth to sixth transistors each formed with an n-type conductivity; a first interconnect structure formed on the first side and over the fifth to sixth transistors, and coupled to the first transistor, wherein the first interconnect structure is configured as a portion of a first bit line; and a second interconnect structure formed on the second side, and also coupled to the first transistor, wherein the second interconnect structure is configured as another portion of the first bit line.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1700:方法</p>
        <p type="p">1702:操作</p>
        <p type="p">1704:操作</p>
        <p type="p">1706:操作</p>
        <p type="p">1708:操作</p>
        <p type="p">1710:操作</p>
        <p type="p">1712:操作</p>
        <p type="p">1714:操作</p>
        <p type="p">1716:操作</p>
        <p type="p">1718:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="977" publication-number="202615084">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615084</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120729</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>治療嬰兒的ＥＮＰＰ１缺乏症和ＡＢＣＣ６缺乏症</chinese-title>
        <english-title>TREATMENT OF ENPP1 DEFICIENCY AND ABCC6 DEFICIENCY IN INFANTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K38/16</main-classification>
        <further-classification edition="200601120260102B">C12N9/14</further-classification>
        <further-classification edition="200601120260102B">A61P19/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商伊諾臻醫藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOZYME PHARMA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甘特　庫爾特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUNTER, KURT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩巴格　伊夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SABBAGH, YVES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明除其他事項外，亦提供用於體內治療ENPP1缺乏症之特定劑量的ENPP1劑，例如用於治療廣泛性嬰兒動脈鈣化症（Generalized Arterial Calcification of Infancy，GACI）、低磷酸鹽血症、體染色體隱性遺傳低磷酸鹽血性佝僂病2型（Autosomal Recessive Hypophosphatemic Rickets 2，ARHR2）、PXE及其他因病理性鈣化、ENPP1缺乏症或ABCC6缺乏症，例如涉及出生後超過30分鐘但未滿12個月嬰兒之軟組織異位鈣化相關疾病或病症。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides, among other things, specific doses of an ENPP1 agent for in vivo treatment of an ENPP1 deficiency, such as for treatment of Generalized Arterial Calcification of Infancy (GACI), Hypopyrophosphatemia, Autosomal Recessive Hypophosphatemic Rickets 2 (ARHR2), PXE and other diseases resulting from pathological calcification, ENPP1 deficiency, ABCC6 deficiency such as diseases or disorders involving ectopic calcification of soft tissue in an infant of age between of greater than 30 minutes but less than 12 months.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="978" publication-number="202616556">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616556</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120783</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>威爾金森分配器與合成器電路、功率分配器與合成器系統及射頻前端</chinese-title>
        <english-title>WILKINSON POWER DIVIDER/COMBINER CIRCUIT, POWER DIVIDER/COMBINER SYSTEM AND RF FRONTEND</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01P5/16</main-classification>
        <further-classification edition="200601120260102B">H03H7/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商加拿大斯威特科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SWIFTLINK TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　守濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, THOMAS SHOUTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納瓦拉特納　多努萬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAVARATNE, DONUWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希爾　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HILL, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾哈邁德　阿基爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHMAD, AQEEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃爾　薩瓦夫　赫巴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EL SAWAF, HEBA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>EG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳文靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, WENJING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據一實施例，一威爾金森分配器與合成器(WPDC)電路包括一對第一差動埠，包括一埠Vin+與一埠Vin-；一對第二差動埠，包括一埠Vout1+與一埠Vout1-；以及一對第三差動埠，包括一埠Vout2+與一埠Vout2-。WPDC電路包括一第一變壓器繞阻，具有耦接至埠Vin+的一第一端以及耦接至埠Vin-的一第二端；一第二變壓器繞阻，具有作為埠Vout1+的一第一端以及作為埠Vout1-的一第二端，第二變壓器繞阻磁性耦接至第一變壓器繞阻的一第一部分；以及一第三變壓器繞阻，具有作為埠Vout2+的一第一端以及作為埠Vout2-的一第二端，第三變壓器繞阻磁性耦接至第一變壓器繞阻的一第二部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to one embodiment, a Wilkinson power divider/combiner (WPDC) circuit includes a pair of first differential ports including a Vin+ port and a Vin– port, a pair of second differential ports including a Vout1+ port and a Vout1– port, and a pair of third differential ports including a Vout2+ port and a Vout2– port. The WPDC circuit includes a first transformer winding having a first end coupled to the Vin+ port and a second end coupled to the Vin- port, a second transformer winding having a first end as Vout1+ port and a second end as Vout1- port, the second transformer winding magnetically coupled to a first portion of the first transformer winding, and a third transformer winding having a first end as Vout2+ port and a second end as Vout2- port, the third transformer winding magnetically coupled to a second portion of the first transformer winding.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:無線通訊裝置/無線裝置</p>
        <p type="p">101:RF前端模組/RF前端</p>
        <p type="p">102:基頻處理器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="979" publication-number="202616318">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616318</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120809</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通過掃描方向旋轉減輕充電偽影</chinese-title>
        <english-title>CHARGING ARTIFACT MITIGATION VIA SCANNING DIRECTION ROTATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">H01J37/02</main-classification>
        <further-classification edition="200601120260113B">H01J37/22</further-classification>
        <further-classification edition="200601120260113B">H01J37/26</further-classification>
        <further-classification edition="200601120260113B">H01J37/28</further-classification>
        <further-classification edition="200601120260113B">G06T5/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＦＥＩ公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FEI COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲切克　多明尼克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FICEK, DOMINIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波盧切克　帕維爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POLOUCEK, PAVEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CZ</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了用於通過掃描方向旋轉促進充電偽影減輕的系統/技術。在各種實施例中，該系統可以訪問裝載有樣本的帶電粒子顯微鏡。在各個方面，該系統可以基於帶電粒子顯微鏡根據目標掃描方向和多個旋轉掃描方向捕獲的樣本的多個圖像，生成樣本的聚合圖像。在某些情況下，多個旋轉掃描方向和目標掃描方向可以在360度範圍內均勻分佈。在各種情況下，樣本在掃描期間可以非均勻充電，多個圖像中的每個圖像可以展示各自的充電偽影，而聚合圖像可能不顯示充電偽影，或顯示減少後的充電偽影。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems/techniques are provided for facilitating charging artifact mitigation via scanning direction rotation. In various embodiments, a system can access a charged-particle microscope that is loaded with a specimen. In various aspects, the system can generate an aggregated image of the specimen, based on a plurality of images of the specimen that are captured by the charged-particle microscope according to a target scanning direction and a plurality of rotated scanning directions. In some instances, the plurality of rotated scanning directions and the target scanning direction can be uniformly distributed within a 360-degree range. In various cases, the specimen can charge non-homogeneously during scanning, each of the plurality of images can exhibit respective charging artifacts, and the aggregated image can exhibit no or reduced charging artifacts.</p>
      </isu-abst>
      <representative-img>
        <p type="p">302:帶電粒子顯微鏡</p>
        <p type="p">304:樣本</p>
        <p type="p">306:系統</p>
        <p type="p">308:處理器</p>
        <p type="p">310:非暫態計算機可讀存儲器</p>
        <p type="p">311:軟體組件</p>
        <p type="p">312:訪問組件</p>
        <p type="p">314:掃描組件</p>
        <p type="p">316:對齊組件</p>
        <p type="p">318:裁剪組件</p>
        <p type="p">320:聚合組件</p>
        <p type="p">322:目標掃描方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="980" publication-number="202615344">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615344</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120937</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣體捕捉的設備及方法</chinese-title>
        <english-title>APPARATUS AND METHOD FOR CAPTURING GAS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260114B">C01B32/50</main-classification>
        <further-classification edition="200601120260114B">B01D53/14</further-classification>
        <further-classification edition="200601120260114B">G01N1/22</further-classification>
        <further-classification edition="200601120260114B">F24F3/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博力特綠色科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOLITE GREEN TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUH-YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王振乾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHEN-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUI-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種氣體捕捉的設備及方法。氣體捕捉的設備包含配置以產生微粒化氣體的氣體微粒化裝置；配置以接收微粒化氣體的氣體吸收裝置，其中氣體微粒化裝置設置於氣體吸收裝置內；連接氣體吸收裝置的熱交換器；連接熱交換器的氣體解吸裝置，其中氣體解吸裝置包含加熱源；連接氣體解吸裝置的內循環管；包圍內循環管的一部分的加熱裝置；以及設置於氣體解吸裝置中並連接內循環管的噴灑器。藉由上述設備進行氣體捕捉的方法，可提升對二氧化碳的氣體捕獲率並降低能源消耗量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus and a method for capturing gas are provided. The apparatus for capturing gas includes a gas micronizing device configured to produce micronized gas; a gas absorption device configured to receive the micronized gas, in which the gas micronizing device is installed inside the gas absorption device; a heat exchanger connected to the gas absorption device; a gas desorption device connected to the heat exchanger, in which the gas desorption device includes a heating source; an internal circulation pipe connected to the gas desorption device; a heating device surrounding a portion of the internal circulation pipe; and a sprayer installed inside the gas desorption device and connected to the internal circulation pipe. Therefore, a gas capturing rate for carbon dioxide can be increased and energy consumption can be reduced by the method for capturing gas with the aforementioned apparatus.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:氣體捕捉的設備</p>
        <p type="p">105:進氣管</p>
        <p type="p">110:氣體微粒化裝置</p>
        <p type="p">120:氣體吸收裝置</p>
        <p type="p">130:脫泡裝置</p>
        <p type="p">140:熱交換器</p>
        <p type="p">150:氣體解吸裝置</p>
        <p type="p">160:加熱源</p>
        <p type="p">170:加熱裝置</p>
        <p type="p">180:內循環管</p>
        <p type="p">185:噴灑器</p>
        <p type="p">190:吸收劑填充裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="981" publication-number="202616493">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616493</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120990</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於晶粒強度增強及不規則狀切割之多層晶粒之電漿切割</chinese-title>
        <english-title>PLASMA DICING FOR MULTI-TIER DIE FOR DIE STRENGTH ENHANCEMENT AND IRREGULAR SHAPED DICING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L23/31</main-classification>
        <further-classification edition="200601120260102B">H01L23/00</further-classification>
        <further-classification edition="200601120260102B">H01L21/78</further-classification>
        <further-classification edition="200601120260102B">H01L21/3065</further-classification>
        <further-classification edition="201401120260102B">B23K26/364</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘋果公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚　計敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, JIMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈甘姆　西法錢德拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANGAM, SIVACHANDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達布拉　山傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DABRAL, SANJAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任明鎭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIM, MYUNG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倪　其農</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NI, CHI NUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉瑪錢德　維亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMACHANDRAN, VIDHYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全　永斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, YOUNG DOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翟　軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAI, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述組裝積體電路(IC)結構之積體電路結構方法，其中利用包括電漿蝕刻的各種蝕刻序列以移除對於未接合或脫層具有高風險之晶粒隅角或邊緣處的直接接合界面。在一實施例中，首先執行雷射蝕刻操作以移除相鄰組件之間的局部區域處之模製化合物，隨後進行電漿切割操作至通過直接接合結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Integrated circuit (IC) structures methods of assembling an integrated circuit structure are described in which various etching sequences including plasma etching are utilized to remove direct bonded interfaces at die corners or edges that are at high-risk for non-bonding or delamination. In an embodiment, a laser etching operation is first performed to remove molding compound at local areas between adjacent components, following by a plasma dicing operation through the direct bonded structures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:電漿蝕刻側壁</p>
        <p type="p">110:第一級電子組件</p>
        <p type="p">118:半導體層</p>
        <p type="p">120:BEOL增層結構</p>
        <p type="p">130A:第二級組件</p>
        <p type="p">130D:第二級組件</p>
        <p type="p">132:第一級接合表面</p>
        <p type="p">135:介電質接合層</p>
        <p type="p">136:後段製程(BEOL)增層結構</p>
        <p type="p">140:間隙填充材料</p>
        <p type="p">142:空間</p>
        <p type="p">150:雷射蝕刻側壁</p>
        <p type="p">150D:第二部分</p>
        <p type="p">152:底部表面</p>
        <p type="p">154:重鑄間隙填充材料</p>
        <p type="p">155:電漿蝕刻凹口</p>
        <p type="p">157:電漿蝕刻凹陷側壁</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="982" publication-number="202616394">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616394</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121035</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>元件轉印方法及元件轉印裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/50</main-classification>
        <further-classification edition="201401120260102B">B23K26/50</further-classification>
        <further-classification edition="201401120260102B">B23K26/362</further-classification>
        <further-classification edition="200601120260102B">H01L21/302</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY ENGINEERING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池原巧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEHARA, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>津田雄一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUDA, YUICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡田達弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKADA, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新井義之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, YOSHIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種即使於元件之厚度相對較小且自重較小之情形時，亦可將元件自黏著層分離之元件轉印方法。具體而言，該半導體晶片轉印方法(元件轉印方法)具備：配置工序，其於轉印基板10將黏著層2、抗蝕劑層3及半導體晶片1以依序相互附著之方式積層配置；及轉印工序，其藉由自與於轉印基板10配置半導體晶片1之面相反側向轉印基板10照射雷射光L使黏著層2變形，而於被轉印基板20轉印半導體晶片1；且於轉印工序中，藉由抗蝕劑層3因黏著層2之變形而被破壞，使黏著層2與半導體晶片1分離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體晶片(元件)</p>
        <p type="p">2:黏著層</p>
        <p type="p">3:抗蝕劑層(破壞層)</p>
        <p type="p">3c:碎片</p>
        <p type="p">10:轉印基板(第1基板)</p>
        <p type="p">20:被轉印基板(第2基板)</p>
        <p type="p">21:黏著層</p>
        <p type="p">L:雷射光</p>
        <p type="p">X,Y,Z,Z1,Z2:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="983" publication-number="202615429">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615429</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121041</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光電轉換元件、攝像元件、光感測器、攝像元件的製造方法、化合物</chinese-title>
        <english-title>PHOTOELECTRIC CONVERSION ELEMENT, IMAGING ELEMENT, LIGHT SENSOR, METHOD FOR MANUFACTURING IMAGING ELEMENT, AND COMPOUND</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07D403/10</main-classification>
        <further-classification edition="200601120260102B">C07D487/04</further-classification>
        <further-classification edition="200601120260102B">C07D403/14</further-classification>
        <further-classification edition="200601120260102B">C07F7/10</further-classification>
        <further-classification edition="200601120260102B">C07F7/30</further-classification>
        <further-classification edition="202301120260102B">H10K39/32</further-classification>
        <further-classification edition="202301120260102B">H10K85/60</further-classification>
        <further-classification edition="202301120260102B">H10K30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和泉彩香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IZUMI, SAIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本陽介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉浦寛記</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIURA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米久田康智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEKUTA, YASUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題為提供一種在接收到藍綠光時的響應速度的電場強度依賴性小的光電轉換元件。本發明的光電轉換元件依序具有導電性膜、光電轉換膜及透明導電性膜，其中，上述光電轉換膜包含由式（1）表示之化合物。  &lt;br/&gt;&lt;img align="absmiddle" height="193px" width="585px" file="ed10022.JPG" alt="ed10022.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="984" publication-number="202615101">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615101</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121059</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>CA19-9結合分子</chinese-title>
        <english-title>CA19-9 BINDING MOLECULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260102B">A61K47/68</main-classification>
        <further-classification edition="200601120260102B">A61K39/395</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
        <further-classification edition="200601120260102B">C07K16/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商拜恩技術股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIONTECH SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莎新　烏葛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAHIN, UGUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>愛琳豪斯　烏蘇拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELLINGHAUS, URSULA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅斯奇　凱瑟琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROSCH, KATHRIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏奇　瑪格達雷納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UTSCH, MAGDALENA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史黛勒　克里斯蒂安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STADLER, CHRISTIANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於結合分子-有效負載結合物(BPC)，其包含結合分子及一或多個有效負載部分體，其中該結合分子特異性結合至CA19-9，諸如用於治療胰管腺癌(PDAC)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to binding molecule-payload conjugates (BPCs) comprising a binding molecule and one or more payload moieties, wherein the binding molecule specifically binds to CA19-9, such as for use in the treatment of pancreatic ductal adenocarcinoma (PDAC).</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="985" publication-number="202616307">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616307</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121150</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>線圈部件</chinese-title>
        <english-title>COIL COMPONENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250912B">H01F27/28</main-classification>
        <further-classification edition="200601120250912B">H01F27/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DONG GUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曺正熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, JOUNG HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安桐輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, DONG HWI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">線圈部件包括具有在第一方向上彼此相對的第一側表面和第二側表面、以及在第二方向上彼此相對的第三側表面和第四側表面的主體。線圈設置於主體內部，包括延伸至第一和第二側表面的引線。引線框位於主體的第一側表面上並連接至引線。引線框包括具有面向主體的內表面和與內表面相對的外表面的側表面部分。引線包括與側表面部分的內表面接觸的接觸部分和位於接觸部分上方的彎曲部分。彎曲部分位於比側表面部分的外表面更靠近主體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A coil component includes a body having a first side surface and a second side surface opposing each other in a first direction, and a third side surface and a fourth side surface opposing each other in a second direction. A coil is disposed within the body, including a lead wire extending to the first and second side surfaces. A lead frame is positioned on the first side surface of the body and is connected to the lead wire. The lead frame includes a side surface portion having an internal surface facing the body and an external surface opposite the internal surface. The lead wire includes a contact portion that is in contact with the internal surface of the side surface portion and a bent portion positioned above the contact portion. The bent portion is positioned closer to the body than the external surface of the side surface portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:主體</p>
        <p type="p">101,102,103,104:側表面</p>
        <p type="p">105,106:表面</p>
        <p type="p">300:線圈</p>
        <p type="p">400,500:引線框</p>
        <p type="p">1000:線圈部件</p>
        <p type="p">I-I':線</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="986" publication-number="202615141">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615141</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121151</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>細緻氣泡生成器、處理液供給裝置以及基板處理裝置</chinese-title>
        <english-title>FINE BUBBLE GENERATOR, PROCESSING LIQUIS SUPPLYING APPARATUS AND SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260102B">B01F23/2375</main-classification>
        <further-classification edition="200601120260102B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中根慎悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANE, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種即使在流量已經變動之情形中亦能使細緻氣泡的生成效率穩定之技術。細緻氣泡生成器(1)係具備第一管部(21)、第二管部(23)、狹窄管部(24)、迴旋流形成部(26)以及可變機構(27)。第二管部(23)係位於比第一管部(23)還靠下游側。狹窄管部(24)係位於第一管部(21)與第二管部(23)之間，並具有流路剖面積朝向下游而變小之縮小部(241)。迴旋流形成部(26)係在縮小部(241)或者比縮小部(24)還靠上游側處形成迴旋流路(40)，該迴旋流路(40)為迴旋中的液體的流路。可變機構(27)係因應第一管部(21)的流量變更迴旋流路(40)中的流路剖面積。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:細緻氣泡生成器</p>
        <p type="p">21:第一管部</p>
        <p type="p">23:第二管部</p>
        <p type="p">24:狹窄管部</p>
        <p type="p">25:閥外殼</p>
        <p type="p">26:迴旋流形成部</p>
        <p type="p">27:可變機構</p>
        <p type="p">29:分支管部</p>
        <p type="p">30:軸部</p>
        <p type="p">31:第一閥體</p>
        <p type="p">32:第二閥體</p>
        <p type="p">33:進退驅動部</p>
        <p type="p">40:迴旋流路</p>
        <p type="p">241:縮小部</p>
        <p type="p">242:中間部</p>
        <p type="p">243:擴大部</p>
        <p type="p">252:擴寬部</p>
        <p type="p">253:調整螺絲</p>
        <p type="p">321:凸緣部</p>
        <p type="p">323:環部</p>
        <p type="p">331:隔膜</p>
        <p type="p">332:施力部</p>
        <p type="p">334:軸承部</p>
        <p type="p">A1:軸</p>
        <p type="p">P1:第一流入口</p>
        <p type="p">P2:第二流入口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="987" publication-number="202614987">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614987</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121245</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化妝料組合物及毛髮化妝料</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K8/44</main-classification>
        <further-classification edition="200601120260102B">A61K8/06</further-classification>
        <further-classification edition="200601120260102B">A61K8/31</further-classification>
        <further-classification edition="200601120260102B">A61K8/37</further-classification>
        <further-classification edition="200601120260102B">A61K8/81</further-classification>
        <further-classification edition="200601120260102B">A61Q5/00</further-classification>
        <further-classification edition="200601120260102B">A61Q5/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日油股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOF CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宗形裕基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUNEKATA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋村大輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMURA, DAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森川稔之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIKAWA, TOSHIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種化妝料組合物，其含有以下之成分(A)、及成分(B)。  &lt;br/&gt;(A)下述式(1)所表示之N-醯基胺基酸  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="163px" width="369px" file="ed10008.JPG" alt="ed10008.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式(1)中，R&lt;sup&gt;1&lt;/sup&gt;CO表示碳數10～22之脂肪族醯基，R&lt;sup&gt;2&lt;/sup&gt;表示氫原子、或碳數1～4之可具有1個OH基之烷基，R&lt;sup&gt;3&lt;/sup&gt;表示碳數1～4之伸烷基)  &lt;br/&gt;(B)於25℃下黏度為300 mPa･s以下之選自酯油、及烴油中之至少1種油劑。  &lt;br/&gt;根據本發明，可提供一種化妝料組合物，其在用於毛髮後，即便於多次使用燙髮器，在乾燥之條件下長時間度過之情形時，亦能夠維持毛髮之硬挺感、順滑感，且藉由對毛髮之吸附力或融入性較高，即便於洗淨後亦持續上述效果，進而，與使用燙髮器前相比，使用燙髮器後更能感受到潤澤感。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="988" publication-number="202615395">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615395</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121271</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻劑組成物、阻劑圖型形成方法、化合物、酸產生劑及酸擴散抑制劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C63/70</main-classification>
        <further-classification edition="200601120260102B">C07C65/05</further-classification>
        <further-classification edition="200601120260102B">C07C65/10</further-classification>
        <further-classification edition="200601120260102B">C07C309/12</further-classification>
        <further-classification edition="200601120260102B">C07C381/12</further-classification>
        <further-classification edition="200601120260102B">C07D333/76</further-classification>
        <further-classification edition="200601120260102B">C09K3/00</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蝦名昌徳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBINA, MASANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種阻劑組成物，其係含有包含一般式(c0)表示之陽離子(C0)之化合物。式中，Rc&lt;sup&gt;1&lt;/sup&gt;、Rc&lt;sup&gt;2&lt;/sup&gt;及Rc&lt;sup&gt;3&lt;/sup&gt;表示直鏈狀或分支鏈狀之烷基。Rpg&lt;sup&gt;1&lt;/sup&gt;、Rpg&lt;sup&gt;2&lt;/sup&gt;及Rpg&lt;sup&gt;3&lt;/sup&gt;表示酸分解性基。Xh&lt;sup&gt;1&lt;/sup&gt;、Xh&lt;sup&gt;2&lt;/sup&gt;及Xh&lt;sup&gt;3&lt;/sup&gt;表示鹵素原子或三氟甲基。L&lt;sup&gt;01&lt;/sup&gt;及L&lt;sup&gt;02&lt;/sup&gt;各自獨立表示氫原子或取代基，L&lt;sup&gt;01&lt;/sup&gt;及L&lt;sup&gt;02&lt;/sup&gt;亦可互相鍵結，並與式中之硫原子一起形成環。  &lt;br/&gt;&lt;img align="absmiddle" height="226px" width="376px" file="ed10198.JPG" alt="ed10198.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="989" publication-number="202616155">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616155</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121338</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資訊處理系統、資訊處理方法及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260102B">G06N20/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本瑞翁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZEON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長岡正宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAOKA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">資訊處理系統具備：取得部，取得包含指定說明變數與正確標籤的訓練資料；候補生成部，生成包含滿足指定約束條件之說明變數的候補資料；維度縮減部，生成將訓練資料及候補資料各自維度縮減的多個特徵資料；選擇部，依據使用特徵資料計算之與訓練資料的相似性來選擇候補資料；以及輸出部，輸出所選擇的候補資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:模型學習裝置</p>
        <p type="p">20:資料生成裝置</p>
        <p type="p">50:終端裝置</p>
        <p type="p">210:請求接受部</p>
        <p type="p">220:取得部</p>
        <p type="p">230:候補生成部</p>
        <p type="p">240:預測部</p>
        <p type="p">250:維度縮減部</p>
        <p type="p">260:評價部</p>
        <p type="p">270:選擇部</p>
        <p type="p">280:輸出部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="990" publication-number="202616774">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616774</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121392</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>EUV輻射產生方法</chinese-title>
        <english-title>EUV RADIATION GENERATING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">H05G2/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭基金會科研院所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STICHTING NEDERLANDSE WETENSCHAPPELIJK ONDERZOEK INSTITUTEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭ＶＵ基金會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STICHTING VU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭格羅寧根大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIJKSUNIVERSITEIT GRONINGEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭阿姆斯特丹大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIVERSITEIT VAN AMSTERDAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普維斯　麥可　安東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PURVIS, MICHAEL ANTHONY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恩格斯　迪翁　二世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENGELS, DION, JUNIOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維索拉圖　奧斯卡　奧雷斯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERSOLATO, OSCAR ORESTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種調整極紫外線(EUV)輻射之一量的方法，該EUV輻射係藉由將雷射脈衝引導至液體燃料目標上以產生EUV發射電漿而產生，該等雷射脈衝具有在1.6微米與2.5微米之間的一波長，其中該方法包含調整該等雷射脈衝之一強度，其中該等雷射脈衝在該等雷射脈衝之該強度經調整之前完全燒穿該等液體燃料目標，並且其中該等雷射脈衝在該等雷射脈衝之該強度經調整之後完全燒穿該等液體燃料目標。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of adjusting an amount of extreme ultraviolet (EUV) radiation generated by directing laser pulses onto liquid fuel targets to generate EUV emitting plasma, the laser pulses having a wavelength between 1.6 microns and 2.5 microns, wherein the method comprises adjusting an intensity of the laser pulses, wherein the laser pulses burn fully through the liquid fuel targets before the intensity of the laser pulses is adjusted, and wherein the laser pulses burn fully through the liquid fuel targets after the intensity of the laser pulses is adjusted.</p>
      </isu-abst>
      <representative-img>
        <p type="p">60a:雷射脈衝</p>
        <p type="p">60b:雷射脈衝</p>
        <p type="p">60c:雷射脈衝</p>
        <p type="p">FB:時間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="991" publication-number="202616461">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616461</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121397</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板支持器及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">H01L21/683</main-classification>
        <further-classification edition="200601120260113B">H02N13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小岩真悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOIWA, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示之基板支持器具備基台、靜電吸盤、至少一個凸部、及接著劑。基台包含第1本體部。第1本體部具有上表面。靜電吸盤包含第2本體部。第2本體部具有下表面，且具有0.5 mm以上1.0 mm以下之厚度。靜電吸盤配置於基台上。至少一個凸部自第1本體部之上表面及第2本體部之下表面中一者朝向第1本體部之上表面及第2本體部之下表面中另一者突出。至少一個凸部於第1本體部之上表面與第2本體部之下表面之間劃分形成空隙。接著劑將靜電吸盤接著於基台。接著劑配置於空隙內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">5:本體部</p>
        <p type="p">5a:中央區域</p>
        <p type="p">50:基台</p>
        <p type="p">50a:流路</p>
        <p type="p">51:靜電吸盤</p>
        <p type="p">51b:靜電電極</p>
        <p type="p">52:接著劑</p>
        <p type="p">53:複數個凸部</p>
        <p type="p">500:第1本體部</p>
        <p type="p">501:上表面</p>
        <p type="p">510:第2本體部</p>
        <p type="p">511:下表面</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="992" publication-number="202616337">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616337</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121411</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電漿輔助製程均勻性改善的調校聚焦環</chinese-title>
        <english-title>TUNED FOCUS RING FOR UNIFORMITY IMPROVEMENT OF PLASMA-ASSISTED PROCESSES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H01J37/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷通</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEI, TONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡振華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, ZHEN HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高政寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, ZHENG NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述一種電漿處理裝置，其包含調校聚焦環。調校聚焦環包含內側壁，其具有較高部分以及延伸於較高部分以下的較低部分，以及自內側壁在較高部分與較低部分之間延伸的突出部。突出部圍繞內側壁之較低部分的圓周延伸。內側壁之較高部分沿著調校聚焦環的第一環形區段，以第一高度延伸超過突出部。較高部分沿著調校聚焦環的第二環形區段，以第二高度延伸超過突出部。第一高度大於第二高度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein is a plasma processing apparatus that comprises a tuned focus ring. The tuned focus ring comprises an inner sidewall having an upper portion and a lower portion extending below the upper portion, and a ledge extending from the inner sidewall between the upper portion and the lower portion. The ledge extends around a circumference of the lower portion of the inner sidewall. The upper portion of the inner sidewall extends a first height over the ledge along a first annular segment of the tuned focus ring. The upper portion extends a second height over the ledge along a second annular segment of the tuned focus ring. The first height is greater than the second height.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:流程圖</p>
        <p type="p">702,704,706,708:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="993" publication-number="202616372">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616372</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121412</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於改善晶圓厚度均勻性的基板處理</chinese-title>
        <english-title>SUBSTRATE PROCESSING FOR IMPROVED WAFER THICKNESS UNIFORMITY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">H01L21/302</main-classification>
        <further-classification edition="200601120260108B">H01L21/306</further-classification>
        <further-classification edition="200601120260108B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹博成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, BOCHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡札　帕拉希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAJJAR, PALASH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫　興華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, XINGHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格蘭特　黛維卡沙卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRANT, DEVIKA SARKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑瑞安　班傑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHERIAN, BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　吉尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, GENE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普拉納塔拉蒂哈蘭　巴拉蘇布拉馬尼安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRANATHARTHIHARAN, BALASUBRAMANIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露了減少基板厚度變化的方法。一種方法包括在對第一基板施加第一次熱處理時，接收第一基板的複數個區域的第一蝕刻量，決定第二基板的平均目標厚度，以及在對第二基板施加次級熱處理和第一次熱處理時，決定第二基板的複數個區域的每個區域的第二蝕刻量。該方法可能進一步包括決定第二基板的每個區域的蝕刻修正量，並基於第二基板的每個區域的蝕刻修正量生成溫度圖，其中該溫度圖表示複數個區域的每個區域的溫度變化。該方法可能進一步包括基於溫度圖生成蝕刻配方，以便對第二基板進行蝕刻。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Approaches for reducing substrate thickness variation of a substrate are disclosed. One method includes receiving a first etching amount for a plurality of zones of a first substrate when a first thermal application is being provided to the first substrate, determining a mean target thickness of a second substrate, and determining a second etching amount for each of a plurality of zones of the second substrate when a secondary thermal application and the first thermal application are being provided. The method may further include determining an etch correction amount for each zone of the second substrate, and generating a temperature map based on the etch correction amount for each zone of the second substrate, wherein the temperature map indicates a temperature change for each zone of the plurality of zones. The method may further include generating an etching recipe based on the temperature map for etching the second substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:方法</p>
        <p type="p">201:區塊</p>
        <p type="p">202:區塊</p>
        <p type="p">203:區塊</p>
        <p type="p">204:區塊</p>
        <p type="p">205:區塊</p>
        <p type="p">206:區塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="994" publication-number="202616355">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616355</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121430</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>選擇性沉積蝕刻停止層的方法</chinese-title>
        <english-title>METHOD FOR SELECTIVELY DEPOSITING ETCH STOP LAYER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/02</main-classification>
        <further-classification edition="200601120260102B">H01L21/311</further-classification>
        <further-classification edition="200601120260102B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅傑斯　傑克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROGERS, JACK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">製造半導體元件之方法可包括：提供包含第一介電層之中間結構，第一介電層具有形成於其中之第一介層窗孔洞，其中第一介層窗孔洞係打開至下方的金屬接觸窗；在第一介層窗孔洞中形成第一金屬介層窗；選擇性沉積第一自組裝單層（SAM）在第一金屬介層窗上；選擇性沉積第一蝕刻停止層在第一介電層上；及去除第一SAM以暴露第一金屬介層窗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for making a semiconductor device can include providing an intermediate structure including a first dielectric layer, the first dielectric layer having a first via hole formed therein, where the first via hole opens to an underlying metal contact, forming a first metal via in the first via hole, selectively depositing a first self-assembled monolayer (SAM) on the first metal via, selectively depositing a first etch stop layer on the first dielectric layer, and removing the first SAM to expose the first metal via.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2610-2650:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="995" publication-number="202616940">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616940</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121520</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電阻式隨機存取記憶體裝置</chinese-title>
        <english-title>RESISTIVE RANDOM ACCESS MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">H10N70/20</main-classification>
        <further-classification edition="202301120260102B">H10B63/00</further-classification>
        <further-classification edition="200601120260102B">G11C13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商本徵半導體技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTRINSIC SEMICONDUCTOR TECHNOLOGIES LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅弘尼克　阿德南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEHONIC, ADNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肯揚　安東尼　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KENYON, ANTHONY J</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍　永鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NG,WING H</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿吉雷　費爾南多　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGUIRRE, FERNANDO L</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種電阻式隨機存取記憶體裝置(8)，其包括一第一電極(3)及一第二電極(5)。該電阻式隨機存取記憶體裝置(8)亦包括堆疊在該第一電極(3)與該第二電極(5)之間的以下項目：一電阻切換層(9)，其由氧化矽、二氧化矽、氮化矽、碳化矽及氮氧化矽中之一或多者形成；以及一導電氧化物層(10)。該導電氧化物層具有小於或等於300 mΩ.cm之一電阻率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A resistive random access memory device (8) included a first electrode (3) and a second electrode (5). The resistive random access memory device (8) also includes, stacked between the first electrode (3) and the second electrode (5): a resistance switching layer (9) formed from one or more of silicon oxide, silicon dioxide, silicon nitride, silicon carbide and silicon oxynitride; and a conductive oxide layer (10). The conductive oxide layer has a resistivity of less than or equal to 300 mΩ.cm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:第一金屬電極，第一電極，電極</p>
        <p type="p">5:第二金屬電極，第二電極，電極</p>
        <p type="p">6:第一金屬化層/跡線</p>
        <p type="p">7:第二金屬化層/跡線</p>
        <p type="p">8:改良型電阻式隨機存取記憶體(RRAM)裝置，RRAM裝置</p>
        <p type="p">9:矽基電阻切換層，結晶或多晶電阻切換層</p>
        <p type="p">10:導電氧化物層，導電金屬氧化物層</p>
        <p type="p">11:控制器</p>
        <p type="p">12:控制信號</p>
        <p type="p">I&lt;sub&gt;read&lt;/sub&gt;:電流</p>
        <p type="p">SW:開關</p>
        <p type="p">VP&lt;sub&gt;reset&lt;/sub&gt;:重設偏壓源，偏壓源，操作量值，操作電壓，量值</p>
        <p type="p">VP&lt;sub&gt;set&lt;/sub&gt;:設定偏壓源，偏壓源，操作量值，適當量值，量值</p>
        <p type="p">V&lt;sub&gt;read&lt;/sub&gt;:讀取電壓，電壓，讀取電位</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="996" publication-number="202615056">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615056</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121541</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>活化HIF1的多核苷酸及其治療方法</chinese-title>
        <english-title>HIF1 ACTIVATING POLYNUCLEOTIDES AND METHOD OF TREATMENT THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/7088</main-classification>
        <further-classification edition="201001120260102B">C12N15/113</further-classification>
        <further-classification edition="200601120260102B">A61P9/00</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
        <further-classification edition="200601120260102B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澳大利亞商基因有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENE COMPANY PTY. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫里斯　凱文　Ｖ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORRIS, KEVIN V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孚竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供可活化、上調或恢復低氧誘導因子1（HIF1）表現的肝細胞核低氧誘導因子1活化多核苷酸、包含一種或多種HIF1活化多核苷酸的組成物及其使用和治療方法。本發明亦提供包含包封本發明任何實施例的一種或多種HIF1活化多核苷酸的奈米顆粒的醫藥組成物。於一實施例中，該奈米顆粒包含外泌體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides hepatocyte nuclear hypoxia-inducible factor 1 (HIF1) activating polynucleotides capable of activating, upregulating or restoring expression of HIF1, compositions comprising one or more of the HIF1 activating polynucleotides and method of use and treatment thereof. The present invention also provides a pharmaceutical composition comprising a nanoparticle encapsulating any embodiment of the one or more HIF1 activating polynucleotide of the present invention. In an embodiment, the nanoparticle comprises an exosome.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="997" publication-number="202616650">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616650</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121594</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>音響多層膜器件的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H03H3/04</main-classification>
        <further-classification edition="200601120260102B">C23C14/08</further-classification>
        <further-classification edition="200601120260102B">H03H9/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中川翔太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAWA, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多田憲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TADA, NORITOMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種音響多層膜器件(1)的製造方法，製造具備基板(10)、音響反射層(20)及音響共振器(30)之音響多層膜器件(1)，前述音響反射層(20)包含低音響阻抗層(22)及音響阻抗比該低音響阻抗層(22)更高之高音響阻抗層(21)，前述音響共振器(30)積層於音響反射層(20)，前述音響多層膜器件(1)的製造方法包含：藉由將Yb氧化物或SiC作為靶材材料(200)來對基板(10)進行濺鍍而形成高音響阻抗層(21)之高音響阻抗層形成步驟(S11)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S10:音響反射層形成步驟</p>
        <p type="p">S11:高音響阻抗層形成步驟</p>
        <p type="p">S12:低音響阻抗層形成步驟</p>
        <p type="p">S20:音響共振器形成步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="998" publication-number="202615737">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615737</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121605</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於改進熱均勻性的紋理化感受器</chinese-title>
        <english-title>TEXTURED SUSCEPTOR FOR IMPROVED THERMAL UNIFORMITY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C30B25/10</main-classification>
        <further-classification edition="200601120260102B">C30B25/12</further-classification>
        <further-classification edition="200601120260102B">H01L21/67</further-classification>
        <further-classification edition="200601120260102B">H01L21/687</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖　艷琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEOW, YEN LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　賢奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYEON GEU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬希　加甘迪普辛格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOSHI, GAGANDEEP SINGH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文所描述的實施例係關於一種設備，包含具有第一發射率的基板，其中基板包含第一表面、第二表面以及將第一表面耦接至第二表面的側壁表面。在實施例中，第一表面上具有紋理化區域，其中該紋理化區域包含高於第一發射率的第二發射率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments described herein relate to an apparatus that includes a substrate with a first emissivity, where the substrate includes a first surface, a second surface, and a sidewall surface that couples the first surface to the second surface. In an embodiment, a textured region is on the first surface, where the textured region includes a second emissivity that is higher than the first emissivity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:工具</p>
        <p type="p">105:燈具</p>
        <p type="p">110:腔室</p>
        <p type="p">112:上圓頂</p>
        <p type="p">114:下圓頂</p>
        <p type="p">115:支撐</p>
        <p type="p">120:感受器</p>
        <p type="p">121:入口</p>
        <p type="p">122:出口</p>
        <p type="p">124:環</p>
        <p type="p">126:襯墊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="999" publication-number="202616005">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616005</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121612</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用基於相位的評分的腔室匹配的系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR CHAMBER MATCHING USING PHASE-BASED SCORING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G05B17/02</main-classification>
        <further-classification edition="202001120260102B">G06F30/20</further-classification>
        <further-classification edition="202001320260102B">G06F111/06</further-classification>
        <further-classification edition="202001320260102B">G06F111/20</further-classification>
        <further-classification edition="202001320260102B">G06F119/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞胡納森　安恩善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAGHUNATHAN, ANANTHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓　雁妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATHEW, GRACE YANNI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格塔莎拉　薩西研卓庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHANTASALA, SATHYENDRA KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包含為製造系統的一或多個腔室中的每一者計算複數個匹配評分，各自對應於腔室匹配製程中的複數個階段中的一者，其中複數個匹配評分是基於相應腔室的複數個參數設定與參考腔室的複數個基準參數設定之間的偏差，以一或多個腔室中的每一者的複數個匹配評分填充資料結構，並將資料結構的內容呈現給客戶端設備處的使用者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes calculating, for each of one or more chambers of a manufacturing system, a plurality of match scores each corresponding to one of a plurality of phases of a chamber matching process, where the plurality of match scores are based on a deviation of a plurality of parameter settings of a respective chamber from a plurality of baseline parameter settings of a reference chamber, populating a data structure with the plurality of match scores for each of the one or more chambers, and presenting content of the data structure to a user at a client device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">102:基板</p>
        <p type="p">104:處理工具</p>
        <p type="p">106:工廠介面</p>
        <p type="p">108:外殼</p>
        <p type="p">110:移送腔室</p>
        <p type="p">112:移送腔室機器人</p>
        <p type="p">114:處理腔室</p>
        <p type="p">116:處理腔室</p>
        <p type="p">118:處理腔室</p>
        <p type="p">120:裝載閘</p>
        <p type="p">122:基板載體</p>
        <p type="p">124:裝載埠</p>
        <p type="p">126:工廠介面機器人</p>
        <p type="p">128:系統控制器</p>
        <p type="p">130A:第一真空埠</p>
        <p type="p">130B:第二真空埠</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1000" publication-number="202615396">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615396</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121630</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻劑組成物、阻劑圖型形成方法、化合物、酸產生劑、酸擴散控制劑及高分子化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C63/70</main-classification>
        <further-classification edition="200601120260102B">C07C65/05</further-classification>
        <further-classification edition="200601120260102B">C07C65/10</further-classification>
        <further-classification edition="200601120260102B">C07C309/12</further-classification>
        <further-classification edition="200601120260102B">C07C381/12</further-classification>
        <further-classification edition="200601120260102B">C09K3/00</further-classification>
        <further-classification edition="200601120260102B">C08F212/14</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/09</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大西行志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONISHI, KOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤野晃也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJINO, AKIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浅羽拓郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASABA, TAKURO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供靈敏度、粗糙度及解像性良好的阻劑組成物、阻劑圖型形成方法、化合物、酸產生劑、酸擴散控制劑及高分子化合物。採用一種阻劑組成物，係藉由曝光而產生酸，且藉由酸的作用而對於顯影液之溶解性發生變化之阻劑組成物，其含有：包含通式(c0)表示之陽離子(C0)之化合物。通式(c0)中Ar&lt;sup&gt;01&lt;/sup&gt;及Ar&lt;sup&gt;02&lt;/sup&gt;表示芳香環。Rs&lt;sup&gt;01&lt;/sup&gt;表示芳基、烷基或烯基。Rc&lt;sup&gt;01&lt;/sup&gt;表示取代基。R&lt;sup&gt;01&lt;/sup&gt;及R&lt;sup&gt;02&lt;/sup&gt;表示烴基。Rh&lt;sup&gt;02&lt;/sup&gt;表示含有鹵素原子之取代基。Rc&lt;sup&gt;02&lt;/sup&gt;表示含有鹵素原子之取代基以外之取代基。Rs&lt;sup&gt;01&lt;/sup&gt;及Ar&lt;sup&gt;02&lt;/sup&gt;可互相鍵結與式中之硫原子一起形成環。k01及k02表示0以上之整數。m02表示1以上之整數。  &lt;br/&gt;&lt;img align="absmiddle" height="272px" width="391px" file="ed10150.JPG" alt="ed10150.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1001" publication-number="202616426">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616426</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121645</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>冷卻系統、基板處理裝置、基板處理方法、半導體裝置的製造方法及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/67</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>
                </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIYAMA, SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 提供能夠提高基板的冷卻效率的技術。  &lt;br/&gt;　　[解決手段] 具備：容器，其具有能夠將多個基板多層支承的支承件；和多個冷卻噴管，其沿著上述容器的內表面配置，具備與支承於上述支承件的多個上述基板對應地供給冷卻氣體的氣體供給孔，一個上述冷卻噴管的上述氣體供給孔和其他上述冷卻噴管的上述氣體供給孔與不同的上述基板對應地供給冷卻氣體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">14:加載互鎖室</p>
        <p type="p">15:容器</p>
        <p type="p">15A:頂板部</p>
        <p type="p">15B:底板部</p>
        <p type="p">15C:外周壁部</p>
        <p type="p">22:連通部</p>
        <p type="p">24:閘閥</p>
        <p type="p">32:晶舟</p>
        <p type="p">34:上板部</p>
        <p type="p">36:下板部</p>
        <p type="p">38:支柱部</p>
        <p type="p">40:支承部</p>
        <p type="p">41,42:氣體供給管</p>
        <p type="p">43:閥</p>
        <p type="p">44:排氣管</p>
        <p type="p">45:閥</p>
        <p type="p">46:真空泵</p>
        <p type="p">47:MFC</p>
        <p type="p">48:惰性氣體供給源</p>
        <p type="p">49A,49B:噴管</p>
        <p type="p">50A,50B:氣體供給孔</p>
        <p type="p">52:旋轉軸</p>
        <p type="p">100:晶圓</p>
        <p type="p">102:開口部</p>
        <p type="p">104:閘閥</p>
        <p type="p">110:溫度感測器</p>
        <p type="p">142:窗部</p>
        <p type="p">148:開口部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1002" publication-number="202615210">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615210</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121654</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>最佳厚度測定位置之決定方法、基板處理方法及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">B24B49/10</main-classification>
        <further-classification edition="200601120260114B">B24B7/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂口慶介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAGUCHI, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林累輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, RUIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在基板的表面處理中，決定在對受到處理的基板之厚度分布進行測定時的最佳化的厚度測定位置。  &lt;br/&gt;本發明係對基板處理裝置中受到處理的基板之厚度分布進行測定時的最佳厚度測定位置之決定方法，該決定方法包含：根據訓練資料，決定該最佳厚度測定位置之步驟；該訓練資料係透過測定一個以上受到處理的該基板之高維厚度分布而預先取得；應決定的該最佳厚度測定位置，係於根據透過在某個厚度測定位置測定該基板厚度所取得的實測資料，來計算作為高維厚度分布即推定資料的情況下，為了使該推定資料接近於真正的高維厚度分布，而根據該訓練資料所最佳化的該厚度測定位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">St201~St202:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1003" publication-number="202615057">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615057</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121687</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於分離雙股寡核苷酸的非鏡像異構物之方法</chinese-title>
        <english-title>METHODS FOR SEPARATING DIASTEREOMERS OF DOUBLE-STRANDED OLIGONUCLEOTIDES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/7088</main-classification>
        <further-classification edition="200601120260102B">B01D15/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商安進公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMGEN INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>管良修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUAN, LIANXIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋茲　傑瑞多　二世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GATEZ, GERARDO, JR.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供了分離雙股寡核苷酸的非鏡像異構物之方法。在示例性實施方式中，該方法包括：(a) 將包含雙股寡核苷酸的非鏡像異構物的樣本施加至陰離子交換（AEX）層析基質，其中該雙股寡核苷酸的每條股包含至少一個硫代磷酸酯核苷酸間鍵；以及 (B) 將流動相施加至AEX層析基質以從基質洗脫該雙股寡核苷酸的非鏡像異構物，其中該流動相包含緩衝液和洗脫鹽並且具有大於10的pH。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are methods of separating diastereomers of a double-stranded oligonucleotide. In exemplary embodiments, the method comprises: (a) applying a sample comprising diastereomers of a double-stranded oligonucleotide to an anion exchange (AEX) chromatographic matrix, wherein each strand of the double-stranded oligonucleotide comprises at least one phosphorothioate internucleotide linkage; and (B) applying a mobile phase to the AEX chromatographic matrix to elute the diastereomers of the double-stranded oligonucleotide from the matrix, wherein the mobile phase comprises a buffer and an elution salt and has a pH of greater than 10.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1004" publication-number="202615133">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615133</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121718</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>巨觀結構化網</chinese-title>
        <english-title>MACROSTRUCTURED WEB</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B01D39/16</main-classification>
        <further-classification edition="200601120260102B">D04H1/22</further-classification>
        <further-classification edition="200601120260102B">D04H1/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商３Ｍ新設資產公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>3M INNOVATIVE PROPERTIES COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>可卡塞爾　克里斯　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKAISEL, CHRIS ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安德森　蒂莫西　詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDERSON, TIMOTHY JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁吉爾丹　喬瑟夫　卡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DINGELDEIN, JOSEPH CARL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福克斯　安德魯　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOX, ANDREW ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛哈得　布萊恩　李</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GERHARDT, BRYAN LEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬治森　葛蘭　歐文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GREGERSON, GLEN OWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒙托亞　奧斯皮納　瑪麗亞　卡蜜拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONTOYA OSPINA, MARIA CAMILA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CO</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任麗贇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REN, LIYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅馬諾　麥可　丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROMANO, MICHAEL DEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">巨觀結構化網、製備此類網之方法、以及包含此類網的空氣過濾器。此類網可包括直接形成的一體式中空面外特徵之陣列，該等特徵展現出高度、特徵性間隔、及拓樸突出比。該等面外特徵可沿該巨觀結構化網之至少第一及第二非對齊面內方向相互強化。該等面外特徵可包括一些區域複合面外特徵。該巨觀結構化網可係不可壓縮、自支撐、可適形、及/或可嵌套中之任一者或全部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Macrostructured webs, methods of making such webs, and air filters comprising such webs. Such webs may include an array of directly-formed, integral, hollow out-of-plane features that exhibit a height, a characteristic spacing, and a topological prominence ratio. The out-of-plane features may be mutually reinforcing along at least first and second non-aligned in-plane directions of the macrostructured web. The out-of-plane features may include some areal-composite out-of-plane features. The macrostructured web may be any or all of incompressible, self-supporting, conformable, and/or nestable.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:巨觀結構化網</p>
        <p type="p">2:第一側</p>
        <p type="p">3:第二側；相對側</p>
        <p type="p">4:熔噴纖維</p>
        <p type="p">10:面外特徵</p>
        <p type="p">11:突出特徵；角錐體</p>
        <p type="p">12:位置；Z軸向外終端；向外頂端</p>
        <p type="p">13:基部</p>
        <p type="p">14:側壁</p>
        <p type="p">15:次側壁部分</p>
        <p type="p">18:周緣部分；周緣</p>
        <p type="p">19:中心區域</p>
        <p type="p">20:平台區域；平表面</p>
        <p type="p">21:主側壁部分</p>
        <p type="p">23:谷</p>
        <p type="p">24:區域</p>
        <p type="p">25:區域</p>
        <p type="p">Cs:特徵性間隔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1005" publication-number="202616052">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616052</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121731</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>裝置解鎖方法及系統及非暫態電腦可讀取儲存媒體</chinese-title>
        <english-title>DEVICE UNLOCKING METHOD AND SYSTEM AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250701B">G06F3/01</main-classification>
        <further-classification edition="202201120250701B">G06V40/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YEN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供裝置解鎖方法及系統。裝置解鎖方法用以解鎖可由使用者操作的電子裝置。裝置解鎖方法包含：判斷使用者是否做出起始手勢；當使用者做出起始手勢時，顯示包含具有第一外觀的指示性物件的解鎖影像；取得自起始手勢的狀態變化，以依據狀態變化將指示性物件從第一外觀改變為第二外觀；響應於第二外觀與預設外觀實質相同，判斷使用者是否做出結束手勢；以及當使用者做出結束手勢時，解鎖電子裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a device unlocking method and system. The device unlocking method is configured to unlock an electronic device operable by a user, and includes: determining if the user makes a begin hand gesture; displaying an unlocking image having an indicative object with a first appearance when the user makes the begin hand gesture; obtaining a state change from the begin hand gesture, to change the indicative object from the first appearance to a second appearance according to the state change; in response to that the second appearance is substantially the same as a preset appearance, determining if the user makes an end hand gesture; and unlocking the electronic device when the user makes the end hand gesture.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:裝置解鎖方法</p>
        <p type="p">S301~S306:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1006" publication-number="202615646">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615646</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121769</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>啤酒風味飲料</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C12C12/00</main-classification>
        <further-classification edition="200601120260102B">C12C7/04</further-classification>
        <further-classification edition="200601120260102B">A23L2/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商朝日啤酒股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI BREWERIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久保田順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBOTA, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中川路伸吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAKAWAJI, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木繭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, MAYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供：一種啤酒風味飲料，其包含麥芽作為原料，真實萃取物之比率為5.0%Plato以上，脯胺酸濃度(mg/L)相對於真實萃取物(%Plato)之比為100以上，乳酸濃度(mg/L)相對於脯胺酸濃度(mg/L)之比為0.50以上；作為醱酵啤酒風味飲料之上述所記載之啤酒風味飲料；作為濃縮型啤酒風味飲料之上述所記載之啤酒風味飲料；酒精濃度為5.0體積%以上之上述所記載之啤酒風味飲料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1007" publication-number="202615497">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615497</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121777</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、預浸體、附樹脂之薄膜、附樹脂之金屬箔、覆金屬積層板及配線基板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F12/00</main-classification>
        <further-classification edition="200601120260102B">C08F290/06</further-classification>
        <further-classification edition="200601120260102B">C08G61/02</further-classification>
        <further-classification edition="200601120260102B">C08J5/24</further-classification>
        <further-classification edition="200601120260102B">B32B15/08</further-classification>
        <further-classification edition="200601120260102B">B32B15/082</further-classification>
        <further-classification edition="200601120260102B">B32B27/30</further-classification>
        <further-classification edition="200601120260102B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小澤龍成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOZAWA, RYUSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米田陽平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEDA, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北井佑季</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAI, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">樹脂組成物係包含熱硬化性樹脂(A)與含磷化合物(B)之樹脂組成物；熱硬化性樹脂(A)包含(i)式(1)所示茚化合物(A1)及(ii)下述式(2)所示茚化合物(A2)中之至少1者；含磷化合物(B)包含選自具有下述式(5)所示結構之化合物及具有下述式(6)所示結構之化合物中之至少1種化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:預浸體</p>
        <p type="p">2:樹脂組成物或樹脂組成物之半硬化物</p>
        <p type="p">3:纖維質基材</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1008" publication-number="202615485">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615485</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121778</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、預浸體、附樹脂之薄膜、附樹脂之金屬箔、覆金屬積層板及配線基板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F2/44</main-classification>
        <further-classification edition="200601120260102B">C08K5/32</further-classification>
        <further-classification edition="200601120260102B">C08K5/53</further-classification>
        <further-classification edition="200601120260102B">C08L101/00</further-classification>
        <further-classification edition="200601120260102B">C08J5/24</further-classification>
        <further-classification edition="200601120260102B">B32B15/08</further-classification>
        <further-classification edition="200601120260102B">B32B27/18</further-classification>
        <further-classification edition="200601120260102B">B32B27/26</further-classification>
        <further-classification edition="200601120260102B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米田陽平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEDA, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣川祐樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROKAWA, YUUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小澤龍成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOZAWA, RYUSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北井佑季</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAI, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>幸田征士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KODA, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">樹脂組成物係包含交聯劑(A)、自由基化合物(B)、磷系阻燃劑(C)及具有會與交聯劑(A)進行反應之反應性不飽和基的自由基聚合性化合物(D)之樹脂組成物；交聯劑(A)包含選自(i)式(1)所示乙烯基苄基茚化合物(A1)、(ii)式(2)所示乙烯基苄基茀化合物(A2)及(iii)其等之混合物中之化合物或混合物；自由基化合物(B)包含具有選自式(3)所示結構、式(4)所示結構、式(5)所示結構及式(6)所示結構中之至少1種結構之化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:預浸體</p>
        <p type="p">2:樹脂組成物或樹脂組成物之半硬化物</p>
        <p type="p">3:纖維質基材</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1009" publication-number="202615690">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615690</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121782</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在氫氣環境中使用非電漿微波減緩鉬氮化的方法</chinese-title>
        <english-title>METHODS FOR USING NON-PLASMA MICROWAVE IN HYDROGEN AMBIENT TO MITIGATE MOLYBDENUM NITRIDATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C23C16/06</main-classification>
        <further-classification edition="200601120260102B">C23C16/34</further-classification>
        <further-classification edition="200601120260102B">C23C16/455</further-classification>
        <further-classification edition="200601120260102B">C23C16/56</further-classification>
        <further-classification edition="200601120260102B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐　先敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, XIANMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑拉多斯　艾夫傑尼諾斯Ｖ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GELATOS, AVGERINOS V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅保奇　班雀奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEBARKI, BENCHERKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岑嘉杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CEN, JIAJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申允娥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, YOON AH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔瑞加　高拉夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THAREJA, GAURAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　正周</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JOUNG JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程　志康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHING, CHI HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例大體而言係關於在氫氣環境中使用非電漿微波以減緩鉬（Mo）氮化的製程，特別是在金屬-N膜沉積期間。在某些實施例中，製備半導體元件的方法包含在基板上沉積鉬（Mo）層。該方法進一步包含使基板暴露於空氣斷路中以在暴露的Mo層部分上形成氧化鉬（MoOx）層。該方法還包含在基板表面沉積氮化鎢（TaN）層。該方法進一步包含對基板執行微波輔助的氧化還原操作，以從MoOx層再生Mo層。執行微波輔助的氧化還原操作包含將基板放置於處理腔室內，將製程氣體流動至處理腔室，以及對製程氣體施加非電漿產生的微波能量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure generally relate to methods for using non-plasma microwave in hydrogen ambient to mitigate molybdenum (Mo) nitridation during metal-N film deposition. In some embodiments, a method for preparing a semiconductor device includes depositing a molybdenum (Mo) layer onto a substrate. The method further includes exposing the substrate to an air break to form a molybdenum oxide (MoOx) layer on the exposed portion of the Mo layer. The method further includes depositing a tantalum nitride (TaN) layer on the surface of the substrate. The method further includes performing a microwave assisted redox operation on the substrate to regenerate the Mo layer from the MoOx layer. Performing the microwave assisted redox operation includes positioning the substrate within a processing chamber, flowing a process gas into the processing chamber, and applying a non-plasma generating microwave energy to the process gas.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:方法</p>
        <p type="p">310:操作</p>
        <p type="p">320:操作</p>
        <p type="p">330:操作</p>
        <p type="p">340:操作</p>
        <p type="p">350:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1010" publication-number="202615529">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615529</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121785</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱固化性接著劑組成物、積層膜、以及連接體及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">C08G18/06</main-classification>
        <further-classification edition="200601120260112B">C08G18/20</further-classification>
        <further-classification edition="200601120260112B">C09J163/04</further-classification>
        <further-classification edition="201801120260112B">C09J7/25</further-classification>
        <further-classification edition="200601120260112B">H01L21/302</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小菅洋輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSUGA, YOHSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷口紘平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGUCHI, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋吉利泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKIYOSHI, TOSHIYASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種熱固化性接著劑組成物，其含有環氧樹脂、酚醛樹脂、固化促進劑、無機填料及彈性體。環氧樹脂包含選自由在25℃下為液狀之液狀的環氧樹脂及在25℃下為固體之固體的環氧樹脂組成的組中的至少1種。酚醛樹脂包含選自由在25℃下為液狀之液狀的酚醛樹脂及在25℃下為固體之固體的酚醛樹脂組成的組中的至少1種。固化促進劑包含選自由在25℃下為液狀之液狀的固化促進劑及在25℃下為固體之固體的固化促進劑組成的組中的至少1種。以熱固化性接著劑組成物的總量為基準，在25℃下為液狀之成分的合計含量為5質量%以上。以熱固化性接著劑組成物的總量為基準，液狀的環氧樹脂的含量為14質量%以下，在95℃下的剪切黏度為100～12000Pa·s。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1011" publication-number="202615973">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615973</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121812</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於雙鑲嵌結構的光微影製程</chinese-title>
        <english-title>LITHOGRAPHY PROCESSES FOR DUAL DAMASCENE STRUCTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">G03F7/00</main-classification>
        <further-classification edition="200601120260114B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊俊智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, CHUN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王嫈喬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YINGCHIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊迪格　湯瑪斯Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAIDIG, THOMAS L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康　宗勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, CHUNG-SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　正方</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JANG FUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡　啓銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHI-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝振源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHEN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案的實施方式包括用於製造雙鑲嵌結構的裝置和方法。光阻劑的第一區域內的第一部分暴露於來自輻射源的第一劑量的電磁輻射。該第一部分具有第一深度和第一表面積。該光阻劑的該第一區域內的第二部分則暴露於來自該輻射源的第二劑量的電磁輻射。第二部分具有第二深度和第二表面積，該第一部分的該第一表面積皆位於該第二部分的某一個第二表面積內。該光阻劑的第二區域內的第三部分則暴露於來自該輻射源的該第一劑量的該電磁輻射。該第三部分具有該第一深度和該第一表面積。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the disclosure include apparatus and methods for fabricating dual damascene structures. First portions within a first region of a photoresist are exposed to electromagnetic radiation from a radiation source at a first dose. The first portions have first depths and first surface areas. Second portions within the first region of the photoresist are exposed to electromagnetic radiation from the radiation source at a second dose. The second portions have second depths and second surface areas, each of the first surface areas of the first portions is disposed within one of the second surface areas of the second portions. Third portions within a second region of the photoresist are exposed to the electromagnetic radiation from the radiation source at the first dose. The third portions have the first depths and the first surface areas.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:方法流程圖</p>
        <p type="p">502:操作</p>
        <p type="p">504:操作</p>
        <p type="p">506:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1012" publication-number="202616873">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616873</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121846</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層構造體及電子裝置</chinese-title>
        <english-title>LAMINATED STRUCTURE AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260102B">H10D62/40</main-classification>
        <further-classification edition="202501120260102B">H10D62/80</further-classification>
        <further-classification edition="202501120260102B">H10D86/01</further-classification>
        <further-classification edition="202501120260102B">H10D88/00</further-classification>
        <further-classification edition="200601120260102B">H01L21/20</further-classification>
        <further-classification edition="201901120260102B">B32B7/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商蓋亞尼克斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAIANIXX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木島健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIJIMA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>關雅志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKI, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供於基板上形成單晶狀金屬膜且提高金屬膜之磁化特性或導電率等物性並提高膜表面之平滑度的積層構造體及電子裝置。  &lt;br/&gt;本發明之解決手段為一種積層構造體10，係具有含有主面11p之基板11、形成於主面11p上之緩衝膜12、及形成於緩衝膜12上之金屬膜14。基板11為Si基板或SOI基板所構成，SOI基板包含Si基板所構成之基體、基體上之絕緣層、及絕緣層上之SOI層。緩衝膜12為以下組成式(化1)所示第一金屬氧化物所構成，x滿足0≦x＜1或滿足x=1。金屬膜14作為主成分含有Fe、Cu、Mo、W、Ag、Al、Ti或Ir。  &lt;br/&gt;(Hf&lt;sub&gt;1-x&lt;/sub&gt;Zr&lt;sub&gt;x&lt;/sub&gt;)O&lt;sub&gt;2&lt;/sub&gt;…(化1)</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide a laminated structure and electronic device in which a single-crystalline metal film is formed on a substrate, improving the physical properties of the metal film, such as its magnetization characteristics or electrical conductivity, and improving the smoothness of the film surface. &lt;br/&gt;As a solution, the laminated structure (10) includes a substrate (11) including a main surface (11p), a buffer film (12) formed on the main surface (11p), and a metal film (14) formed on the buffer film (12). The substrate (11) is a Si substrate or an SOI substrate including a base made of a Si substrate, an insulating layer on the base, and an SOI layer on the insulating layer. The buffer film (12) is made of a first metal oxide represented by the following composition formula (Chemical Formula 1), where x satisfies 0≦x＜1 or x=1. The metal film (14) contains Fe, Cu, Mo, W, Ag, Al, Ti, or Ir as a primary component. &lt;br/&gt;(Hf&lt;sub&gt;1-x&lt;/sub&gt;Zr&lt;sub&gt;x&lt;/sub&gt;)O&lt;sub&gt;2&lt;/sub&gt;…(Chemical Formula 1)</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:積層構造體</p>
        <p type="p">11:基板</p>
        <p type="p">11p:主面</p>
        <p type="p">12:緩衝膜</p>
        <p type="p">13、14:金屬膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1013" publication-number="202615655">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615655</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121847</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>iRNA組合物及其使用方法</chinese-title>
        <english-title>IRNA COMPOSITION AND METHODS OF USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260102B">C12N15/113</main-classification>
        <further-classification edition="200601120260102B">A61K31/713</further-classification>
        <further-classification edition="200601120260102B">A61P13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商齊魯製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QILU PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商山東安舜製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANDONG ANSHUN PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁　詩莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEUNG, SZE LEE CECILIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, QUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　科明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, KEMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, ZHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陶　維康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAO, WEIKANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種iRNA組合物及其使用方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses an iRNA composition and methods of use thereof.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1014" publication-number="202615656">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615656</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121867</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於肝外遞送的雙重接合化合物</chinese-title>
        <english-title>DUAL CONJUGATE COMPOUNDS FOR EXTRAHEPATIC DELIVERY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260102B">C12N15/113</main-classification>
        <further-classification edition="200601120260102B">A61K31/713</further-classification>
        <further-classification edition="201701120260102B">A61K47/54</further-classification>
        <further-classification edition="200601120260102B">A61P9/00</further-classification>
        <further-classification edition="200601120260102B">A61P21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾拉倫製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALNYLAM PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納爾　傑亞拉卡斯Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAIR, JAYAPRAKASH K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕納雷斯　約瑟夫　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANARESE, JOSEPH DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施密特　卡林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHMIDT, KARYN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜利　凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOOLEY, KEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　海青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HAIQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩利納斯　胡安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SALINAS, JUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托倫蒂諾　馬克　尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOLENTINO, MARK NEIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茲拉捷夫　伊凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZLATEV, IVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞思　普尼特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SETH, PUNIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基哈夫　瓦聖特Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JADHAV, VASANT R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英戈利亞　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INGOGLIA, BRYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中田昌明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKATA, MASAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種用於抑制標靶基因表現的雙股核糖核酸(dsRNA)劑，包括：與標靶基因互補的反義股；與該反義股互補並與該反義股形成雙股區域的有義股；至少一個介導遞送至肌肉組織的alpha-v-beta-6(αvβ6)整合素靶向配體，其與至少一股接合；以及至少一個體內遞送增強部分體，其與至少一股的一個或多個內部位置接合。本揭露也提供包括此類dsRNA劑的組成物，以及其用於治療具有可從降低標靶基因表現受益的疾病之受試者的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides double stranded ribonucleic acid (dsRNA) agents for inhibiting expression of a target gene, comprising an antisense strand which is complementary to the target gene; a sense strand which is complementary to the antisense strand and forms a double stranded region with the antisense strand; at least one alpha-v-beta-6 (αvβ6) integrin targeting ligand that mediates delivery to muscle tissue conjugated to at least one strand; and at least one in vivo delivery enhancing moiety conjugated to one or more internal positions on at least one strand. The present disclosure also provides compositions comprising such dsRNA agents, and methods of use thereof for treating a subject having a disorder that would benefit from reduction in expression of the target gene.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1015" publication-number="202615058">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615058</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121868</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>失養強直性肌肉蛋白質激酶（ＤＭＰＫ）ＩＲＮＡ組成物及其使用方法</chinese-title>
        <english-title>DYSTROPHY MYOTONIC PROTEIN KINASE (DMPK) IRNA COMPOSITIONS AND METHODS OF USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/7088</main-classification>
        <further-classification edition="201001120260102B">C12N15/113</further-classification>
        <further-classification edition="201701120260102B">A61K47/50</further-classification>
        <further-classification edition="200601120260102B">C12N15/11</further-classification>
        <further-classification edition="200601120260102B">A61P21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾拉倫製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALNYLAM PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施密特　卡林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHMIDT, KARYN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史奇蓋爾　馬克Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHLEGEL, MARK K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡斯托雷諾　亞當</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CASTORENO, ADAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥金尼奇　詹姆斯Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCININCH, JAMES D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係關於靶向失養強直性肌肉蛋白質激酶(DMPK)基因的雙股核糖核酸(dsRNA)劑及組成物，以及使用此類dsRNA劑及組成物抑制DMPK基因之表現的方法及治療患有DMPK相關疾病或疾患(例如肌強直性營養不良(DM))之受試者的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure relates to double stranded ribonucleic acid (dsRNA) agents and compositions targeting a dystrophy myotonic protein kinase (DMPK) gene, as well as methods of inhibiting expression of a DMPK gene and methods of treating subjects having a DMPK-associated disease or disorder, &lt;i&gt;e.g.&lt;/i&gt;, myotonic dystrophy (DM), using such dsRNA agents and compositions.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1016" publication-number="202616113">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616113</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121881</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理系統，基板處理裝置，半導體裝置的製造方法及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120251103B">G06F21/32</main-classification>
        <further-classification edition="201301120251103B">G06F21/33</further-classification>
        <further-classification edition="201301120251103B">G06F21/35</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>反怖勇希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMBO, YUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北本之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAMOTO, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題是在於提供一種可進行對基板處理裝置的登入的簡易化及安全性的強化之技術。  &lt;br/&gt;　　其解決手段，具有認證裝置及基板處理裝置，  &lt;br/&gt;　　前述認證裝置是具備：  &lt;br/&gt;　　第一記憶部，其記憶了操作基板處理裝置的使用者的生物資訊與前述使用者的使用者資訊；  &lt;br/&gt;　　生物資訊取得部，其取得前述使用者的生物資訊；  &lt;br/&gt;　　認證部，其比較取得的前述生物資訊與記憶的前述生物資訊而進行前述使用者的認證；  &lt;br/&gt;　　位置資訊取得部，其在前述認證部的前述使用者的認證成功時，取得取得了前述使用者的生物資訊的位置的位置資訊；及  &lt;br/&gt;　　第一通訊部，其在與外部裝置之間進行通訊，  &lt;br/&gt;　　前述基板處理裝置是具備：  &lt;br/&gt;　　第二記憶部，其記憶了操作基板處理裝置的複數的使用者的使用者資訊與顯示允許使用場所的位置資訊；  &lt;br/&gt;　　第二通訊部，其在與前述認證裝置之間進行通訊；  &lt;br/&gt;　　判定部，其在前述第二通訊部與前述認證裝置之間可通訊時，從前述認證裝置接收使用者資訊和位置資訊，並在接收到的使用者資訊與記憶在前述第二記憶部的複數的使用者資訊之中的任一個一致時，依據從前述認證裝置接收到的位置資訊與記憶在前述第二記憶部的位置資訊是否顯示相同的場所，來判定是否允許該使用者的登入；及  &lt;br/&gt;　　控制部，其可依據前述判定部的判定結果來進行登入的控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1017" publication-number="202615091">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615091</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121913</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>穩定的單鏈可變片段</chinese-title>
        <english-title>STABLE SINGLE-CHAIN VARIABLE FRAGMENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K39/395</main-classification>
        <further-classification edition="200601120260102B">C12N15/13</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
        <further-classification edition="200601120260102B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商安進公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMGEN INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權　賢珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, HYUNJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　傑瑞米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING, JEREMY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃克　肯尼斯　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALKER, KENNETH W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於具有改善的生物物理特性的單鏈可變片段（scFv）及其用途的領域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the field of single-chain variable fragments (scFvs) having improved biophysical properties and uses thereof.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1018" publication-number="202615085">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615085</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121941</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可溶性GLP1/GIP/NPY2受體三重促效劑</chinese-title>
        <english-title>SOLUBLE GLP1/GIP/NPY2 RECEPTOR TRIPLE AGONISTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K38/16</main-classification>
        <further-classification edition="200601120260102B">C07K14/575</further-classification>
        <further-classification edition="200601120260102B">C07K14/605</further-classification>
        <further-classification edition="200601120260102B">A61P3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商百靈佳殷格翰國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOEHRINGER INGELHEIM INTERNATIONAL GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海貝爾　彼得　威爾海穆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAEBEL, PETER WILHELM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼德森　夏綠蒂　史戴爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MADSEN, CHARLOTTE STAHL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫瑞　安東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURRAY, ANTHONY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋伯　亞力山德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEBER, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於促效GIP、GLP-1及神經肽Y2 (NPY2)受體之肽化合物、促效劑、其製備方法、其醫藥組合物、及其於治療及/或預防各種疾病(諸如肥胖、糖尿病、代謝症候群及/或MASH / NASH)中之醫學用途。本發明之肽化合物適用於皮下投與。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to peptide compounds that agonize the GIP, GLP-1 and neuropeptide Y2 (NPY2) receptors, agonists, processes for their preparation, pharmaceutical compositions thereof, and their medical use in the treatment and/or prevention of a variety of diseases such as obesity, diabetes, metabolic syndrome, and/or MASH / NASH. The peptide compounds of the invention are suitable for subcutaneous administration.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1019" publication-number="202616330">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616330</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121956</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於佔空比斜坡定時離子佈植匹配的方法和系統</chinese-title>
        <english-title>METHODS AND SYSTEM FOR DUTY FACTOR RAMPED TIMED ION IMPLANT MATCHING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01J37/317</main-classification>
        <further-classification edition="200601120260102B">H01J37/32</further-classification>
        <further-classification edition="200601120260102B">H03K5/156</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德諾　文森特Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENO, VINCENT A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿佩爾三世　理查Ｇ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPEL III, RICHARD G.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　桂陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CUIYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米塔爾　德汶拉吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITTAL, DEVEN RAJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克萊恩　詹姆斯Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCLANE, JAMES R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博斯勒　維克拉姆Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHOSLE, VIKRAM M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭露了一種用於佔空比斜坡定時離子佈植匹配的方法。該方法包含由處理電路自與該處理電路相關聯的使用者介面接收工作週期參數。該方法進一步包含由處理電路產生控制訊號，以供電漿摻雜系統的晶圓脈衝電源，根據工作週期參數改變晶圓脈衝電源的脈衝工作週期。該方法進一步包含由處理電路將控制訊號發送至晶圓脈衝電源，以此改變由晶圓脈衝電源產生的脈衝訊號的工作週期。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein is a method for duty factor ramped timed ion implant matching. The method includes receiving, by a processing circuit, a duty cycle parameter from a user interface associated with the processing circuit. The method further includes generating, by the processing circuit, a control signal for a wafer pulse power supply of a plasma doping system to alter a pulse duty cycle of the wafer pulse power supply according to the duty cycle parameter. The method further includes sending, by the processing circuit, the control signal to the wafer pulse power supply to thereby alter a duty cycle of a pulse signal generated by the wafer pulse power supply.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:處理腔室</p>
        <p type="p">102:腔室主體</p>
        <p type="p">104:感應線圈</p>
        <p type="p">106:處理空間</p>
        <p type="p">107:電漿</p>
        <p type="p">110:基板</p>
        <p type="p">111:基板支撐</p>
        <p type="p">111A:ESC基板支撐</p>
        <p type="p">111B:支撐底座</p>
        <p type="p">111C:絕緣體板</p>
        <p type="p">112:偏壓電極</p>
        <p type="p">115:接收表面</p>
        <p type="p">116:氣體入口</p>
        <p type="p">117:基板支撐組件</p>
        <p type="p">120:處理氣源</p>
        <p type="p">122:側壁</p>
        <p type="p">123:腔室蓋</p>
        <p type="p">124:腔室底部</p>
        <p type="p">127:真空出口</p>
        <p type="p">134:系統控制器</p>
        <p type="p">137:接地板</p>
        <p type="p">138:支撐軸</p>
        <p type="p">140:源組件</p>
        <p type="p">142:切換模式電源</p>
        <p type="p">144:諧振電路</p>
        <p type="p">146:電漿控制器</p>
        <p type="p">148:處理氣體</p>
        <p type="p">150:功率產生器</p>
        <p type="p">151:傳輸線</p>
        <p type="p">155:高壓模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1020" publication-number="202616325">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616325</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121971</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於帶電粒子射束設備之掃描式偏轉器設計</chinese-title>
        <english-title>SCANNING DEFLECTOR DESIGN FOR A CHARGED PARTICLE BEAM APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H01J37/24</main-classification>
        <further-classification edition="200601120260112B">H01J37/26</further-classification>
        <further-classification edition="200601120260112B">H01J37/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　勇新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YONGXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於在一掃描電子顯微鏡中操作一電子偏轉器之系統及方法，其包含在兩種不同操作模式下操作該電子偏轉器。在一第一操作模式下，一控制電路可包含經組態為一跨阻抗放大器之一放大器級。該第一操作模式可用於以相對較低空間解析度執行相對較高掃描速度。在一第二操作模式下，該放大器級可經組態為一積分放大器。該第二操作模式可用於以相對較高空間解析度執行相對較低掃描速度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and method for operating an electron deflector in a scanning electron microscope comprises operating the electron deflector in two different modes of operation. In a first mode of operation, a control circuit may comprise an amplifier stage configured as a transimpedance amplifier. The first mode of operation may be used for performing relatively higher scanning speeds with relatively lower spatial resolution. In a second mode of operation, the amplifier stage may be configured as an integrator amplifier. The second mode of operation may be used for performing relatively lower scanning speeds with relatively higher spatial resolution.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:帶電粒子射束偏轉器</p>
        <p type="p">460:電極</p>
        <p type="p">461:控制電路</p>
        <p type="p">462:DAC</p>
        <p type="p">464:電阻器</p>
        <p type="p">465:電容器</p>
        <p type="p">466:開關</p>
        <p type="p">A1:放大器</p>
        <p type="p">C11:電容器</p>
        <p type="p">C12:電容器</p>
        <p type="p">C21:電容器</p>
        <p type="p">C22:電容器</p>
        <p type="p">K11:第一開關</p>
        <p type="p">R11:電阻器</p>
        <p type="p">R12:電阻器</p>
        <p type="p">R21:電阻器</p>
        <p type="p">R22:電阻器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1021" publication-number="202616326">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616326</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121972</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用帶電粒子系統之影像之原位偵測器頻寬量測</chinese-title>
        <english-title>IN-SITU DETECTOR BANDWIDTH MEASUREMENT USING IMAGES OF A CHARGED PARTICLE SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H01J37/244</main-classification>
        <further-classification edition="200601120260112B">H01J37/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博金　文森特　克勞德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEUGIN, VINCENT CLAUDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慕克　亨錐克　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOOK, HINDRIK WILLEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史蒂莉亞諾　安翠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STYLIANOU, ANTRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勃蘭德　彼得　盧卡斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRANDT, PIETER LUCAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹煒華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, WEIHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種帶電粒子射束設備，其包括一帶電粒子射束源、一帶電粒子光學系統、一帶電粒子偵測器及一控制器。該帶電粒子射束源產生初級帶電粒子之一射束。該帶電粒子光學系統將初級帶電粒子之該射束引導於一樣本表面處。該帶電粒子偵測器偵測與該等初級帶電粒子與該樣本表面之相互作用相關聯的次級帶電粒子。該控制器基於所偵測之次級帶電粒子而判定該樣本表面之一影像。該影像包括一像素陣列。該控制器亦判定由一行該等像素表示之一信號與該信號之經延遲複本之間的一自相關函數。該控制器亦基於該自相關函數而判定該帶電粒子偵測器之一頻寬。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A charged particle beam apparatus includes a charged particle beam source, a charged particle optical system, a charged particle detector, and a controller. The charged particle beam source generates a beam of primary charged particles. The charged particle optical system directs the beam of primary charged particles at a sample surface. The charged particle detector detects secondary charged particles associated with interaction of the primary charged particles with the sample surface. The controller determines an image of the sample surface based on the detected secondary charged particles. The image includes an array of pixels. The controller also determines an autocorrelation function between a signal represented by a line of the pixels and delayed copies of the signal. The controller also determines a bandwidth of the charged particle detector based on the autocorrelation function.</p>
      </isu-abst>
      <representative-img>
        <p type="p">311:感測元件</p>
        <p type="p">312:感測元件</p>
        <p type="p">313:感測元件</p>
        <p type="p">314:感測元件</p>
        <p type="p">315:元件間開關元件</p>
        <p type="p">316:元件-匯流排開關元件</p>
        <p type="p">317:列</p>
        <p type="p">321:區域/區段</p>
        <p type="p">400:偵測器陣列</p>
        <p type="p">402:佈線路徑</p>
        <p type="p">404:放大器</p>
        <p type="p">405:類比信號路徑</p>
        <p type="p">406:類比至數位轉換器</p>
        <p type="p">408:開關元件</p>
        <p type="p">409:數位多工器</p>
        <p type="p">410:放大器</p>
        <p type="p">416:互連層</p>
        <p type="p">420:互連開關元件</p>
        <p type="p">421:互連開關元件</p>
        <p type="p">422:互連開關元件</p>
        <p type="p">423:互連開關元件</p>
        <p type="p">426:輸入/輸出點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1022" publication-number="202615530">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615530</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121995</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>觸媒組合物、封閉聚異氰酸酯組合物、塗料組合物、塗膜及塗膜的形成方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08G18/16</main-classification>
        <further-classification edition="200601120260102B">C08G18/18</further-classification>
        <further-classification edition="200601120260102B">C08G18/80</further-classification>
        <further-classification edition="200601120260102B">C09D175/04</further-classification>
        <further-classification edition="200601120260102B">C09D5/00</further-classification>
        <further-classification edition="200601120260102B">B05D3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東楚股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOSOH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野口周人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOGUCHI, SHUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安田斉弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YASUDA, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種觸媒組合物，其為用於從封閉聚異氰酸酯解離封閉劑的觸媒組合物，含有：下述式(1)所表示的四級銨鹽、與分子量350以下的單醇，  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="205px" width="418px" file="ed10005.JPG" alt="ed10005.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[式(1)中，R&lt;sup&gt;1&lt;/sup&gt;表示碳數4~8的烷基，R&lt;sup&gt;2&lt;/sup&gt;~R&lt;sup&gt;4&lt;/sup&gt;分別獨立地表示碳數1~2的烷基，R&lt;sup&gt;5&lt;/sup&gt;表示碳數1~8的烷基或氫原子]。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1023" publication-number="202615531">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615531</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121996</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>觸媒組合物、封閉聚異氰酸酯組合物、塗料組合物、塗膜及塗膜的形成方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08G18/16</main-classification>
        <further-classification edition="200601120260102B">C08G18/18</further-classification>
        <further-classification edition="200601120260102B">C08G18/80</further-classification>
        <further-classification edition="200601120260102B">C09D175/04</further-classification>
        <further-classification edition="200601120260102B">C09D5/00</further-classification>
        <further-classification edition="200601120260102B">B05D3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東楚股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOSOH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野口周人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOGUCHI, SHUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安田斉弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YASUDA, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種觸媒組合物，其為用於從封閉聚異氰酸酯解離封閉劑的觸媒組合物，含有：包含下述式(1)所表示的四級銨陽離子、與有機酸陰離子的四級銨鹽；與分子量350以下的醇化合物，醇化合物的含量相對於四級銨鹽的含量之比，以質量比計，為4~99。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="172px" width="206px" file="ed10004.JPG" alt="ed10004.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[式(1)中，R&lt;sup&gt;1&lt;/sup&gt;~R&lt;sup&gt;4&lt;/sup&gt;表示分別獨立的碳數1~4的烷基。]</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1024" publication-number="202615059">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615059</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122016</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含聚去氧核糖核苷酸之可注射黏彈性凝膠</chinese-title>
        <english-title>INJECTABLE VISCOELASTIC GEL CONTAINING POLYDEOXYRIBONUCLEOTIDES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/7088</main-classification>
        <further-classification edition="200601120260102B">A61K8/98</further-classification>
        <further-classification edition="200601120260102B">A61P19/02</further-classification>
        <further-classification edition="200601120260102B">A61Q19/00</further-classification>
        <further-classification edition="200601120260102B">A61P17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商瑪斯特利股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASTELLI S.R.L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪米歇爾　寶拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DI MICHELE, PAOLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾比雷　利維奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOBILE, LIVIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普西亞　卡羅琳納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRUSSIA, CAROLINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係指一種可注射黏彈性凝膠，其含有萃取自天然來源(無論是動物或植物)的聚去氧核糖核苷酸(PN/PDRN)，含量介於3%至8%之間，以及係指一種其在美容和骨科目的之用途。&lt;br/&gt;  該聚去氧核糖核苷酸具有介於50至500 bp之間的平均分子量，在水溶液中，由於分子間橋的作用，在適當的濃度下，會自然地形成凝膠。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention refers to an injectable viscoelastic gel containing polydeoxyribonucleotides (PN/PDRN) extracted from natural sources, whether animal or plant, in an amount between 3 and 8% and to uses thereof for aesthetic and orthopaedic purposes.&lt;br/&gt; The polydeoxyribonucleotides have an average molecular weight between 50 and 500 bp and in aqueous solution, and at the appropriate concentrations, thanks to intermolecular bridges, naturally form a gel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1025" publication-number="202616835">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616835</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122021</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置、及半導體裝置的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260102B">H10D1/60</main-classification>
        <further-classification edition="202501120260102B">H01L21/28</further-classification>
        <further-classification edition="200601120260102B">H01L21/768</further-classification>
        <further-classification edition="200601120260102B">H01L21/302</further-classification>
        <further-classification edition="200601120260102B">H01L23/535</further-classification>
        <further-classification edition="200601120260102B">H01B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商Ｒａｐｉｄｕｓ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAPIDUS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宇佐美達矢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USAMI, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置，具備：重複層積第1絕緣膜、及能相對於前述第1絕緣膜以高選擇比蝕刻的第2絕緣膜的多層構造的層間絕緣膜；配置於前述層間絕緣膜上下的下層導電圖案及上層導電圖案；從前述層間絕緣膜的上面沿著設於前述層間絕緣膜的凹部的內壁連續依序層積下部電極層、絕緣層、及上部電極層的構造的電容器；前述凹部的側周壁，具有包含形成於前述第2絕緣膜的橫溝的內壁的凹凸形狀；前述電容器，在前述凹部的側周壁沿著前述凹凸形狀配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體裝置</p>
        <p type="p">10:下層導電圖案</p>
        <p type="p">20:層間絕緣膜</p>
        <p type="p">20a:凹部</p>
        <p type="p">20b:橫溝</p>
        <p type="p">30:電容器</p>
        <p type="p">40:導孔</p>
        <p type="p">41:埋入絕緣膜</p>
        <p type="p">42:平坦化絕緣膜</p>
        <p type="p">50:上層導電圖案</p>
        <p type="p">51:上層導電圖案</p>
        <p type="p">52:上層導電圖案</p>
        <p type="p">100:基底絕緣膜</p>
        <p type="p">201:第1絕緣膜</p>
        <p type="p">202:第2絕緣膜</p>
        <p type="p">301:下部電極層</p>
        <p type="p">302:絕緣層</p>
        <p type="p">303:上部電極層</p>
        <p type="p">401:第1導孔</p>
        <p type="p">402:第2導孔</p>
        <p type="p">[W1]:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1026" publication-number="202616338">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616338</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122045</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>溫度調整裝置及電漿處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">H01J37/32</main-classification>
        <further-classification edition="200601120260108B">H05H1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武藤亮磨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUTO, RYOMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村野翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURANO, SHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口伸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赤尾健司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKAO, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種調整基板溫度的溫度調整裝置，其係具備載台、貯存槽及傳熱部件。載台係支撐基板。貯存槽係設置在載台下方，並貯存傳熱流體。傳熱部件係連接到載台的下表面，並由金屬製成，並且至少一部分浸入貯存槽中的傳熱流體中。又，貯存槽係包含槽主體、供給口、排出口及攪拌部。供給口係向槽主體內供給傳熱流體。排出口係排出槽主體內的傳熱流體。攪拌部係構成為會攪拌槽主體中的傳熱流體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:基板支撐部</p>
        <p type="p">111:主體部</p>
        <p type="p">111a:中央區域</p>
        <p type="p">1111:靜電吸盤</p>
        <p type="p">1111a:陶瓷部件</p>
        <p type="p">1111b:靜電電極</p>
        <p type="p">1111c:RF/DC電極</p>
        <p type="p">1111d:直流電源</p>
        <p type="p">1111g:傳熱棒</p>
        <p type="p">112:環組件</p>
        <p type="p">30:電源</p>
        <p type="p">50a:配管</p>
        <p type="p">50b:配管</p>
        <p type="p">51a:供給口</p>
        <p type="p">51b:排出口</p>
        <p type="p">60:冷卻機構</p>
        <p type="p">61:槽</p>
        <p type="p">62:密封部件</p>
        <p type="p">63:冷媒</p>
        <p type="p">65:攪拌部</p>
        <p type="p">650:驅動部</p>
        <p type="p">651:軸</p>
        <p type="p">652:攪拌葉片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1027" publication-number="202615790">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615790</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122116</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>卡扣式鎖緊連接器</chinese-title>
        <english-title>BAYONET CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250807B">F16L33/03</main-classification>
        <further-classification edition="200601120250807B">F16L37/08</further-classification>
        <further-classification edition="200601120250807B">F16L37/12</further-classification>
        <further-classification edition="200601120250807B">F16L37/138</further-classification>
        <further-classification edition="200601120250807B">F16L37/32</further-classification>
        <further-classification edition="200601120250807B">F16L37/248</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商溯聯（重慶）智控技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SULIAN (CHONGQING) INTELLIGENT CONTROL TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹樹林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, SHULIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李旭陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XUYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申太明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, TAIMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓宗俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, ZONGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田琳婕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAN, LINJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒲清洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PU, QINGYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜宇茜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, YUQIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種卡扣式鎖緊連接器，包括鎖止塊、連接套、上殼體組件、鎖緊卡套以及與下殼體組件，在上述上殼體組件中彈性設有上閥芯，在上述上閥芯上設有第一密封圈，在上述下殼體組件中設有頂桿以及下閥芯，上述下閥芯套接在頂桿一側的外側壁上，在上述頂桿上設有第二密封圈。本發明設置上殼體組件擠壓下殼體組件，並用頂桿抵接上閥芯，鎖止塊卡接上殼體組件固定限位，再由鎖緊卡套限位鎖止塊，在實現下殼體組件與上殼體組件連接貫通的同時，頂桿與上閥芯之間抵接不留間隙，且能防止鎖止塊自動解鎖；拆卸時，鬆開鎖緊卡套，移動鎖止塊且實現上殼體組件自動彈出，並同時由密封圈同步對連通位置實現密封，實現拆卸無外漏的目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a bayonet connector, including a locking block, a connecting sleeve, an upper shell assembly, a locking sleeve and a lower shell assembly. An upper valve core is elastically provided in the upper shell assembly, a first sealing ring is provided on the upper valve core. A push rod and a lower valve core are provided in the lower shell assembly. The lower valve core is sleeved on an outer side wall of one side of the push rod. A second sealing ring is provided on the push rod. The present invention arranges an upper shell assembly to squeeze the lower shell assembly, and uses a push rod to abut against the upper valve core. The locking block is clamped into the upper shell assembly and fixed, then the locking block is limited by the locking sleeve , so that when the lower shell assembly and the upper shell assembly are connected , no gap exists between the push rod and the upper valve core, and avoid the locking block being automatically unlocked. When disassembling, loosens the locking sleeve, and then the locking block is moved, and the upper shell assembly is automatically ejected, the sealing ring seals off a connecting position at the same time, so as to achieve the purpose of disassembly without leakage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:連接套</p>
        <p type="p">10:連接凸台</p>
        <p type="p">100:固定凸台</p>
        <p type="p">101:開口槽</p>
        <p type="p">102:定位槽</p>
        <p type="p">11:鎖止塊</p>
        <p type="p">111:讓位孔</p>
        <p type="p">113:延伸段</p>
        <p type="p">12:鎖緊卡套</p>
        <p type="p">122:止位凸台</p>
        <p type="p">123:撥片</p>
        <p type="p">124:「V」形通槽</p>
        <p type="p">14:復位彈簧</p>
        <p type="p">143:第一凸塊</p>
        <p type="p">144:第二凸塊</p>
        <p type="p">171:第一定位斜面</p>
        <p type="p">2:上閥芯</p>
        <p type="p">20:第一密封圈</p>
        <p type="p">21:過渡斜面</p>
        <p type="p">3:套管</p>
        <p type="p">40:限位凸台</p>
        <p type="p">401:放置孔</p>
        <p type="p">402:止退環</p>
        <p type="p">41:定向凸台</p>
        <p type="p">42:限位槽</p>
        <p type="p">5:下閥芯</p>
        <p type="p">50:頂桿</p>
        <p type="p">51:第二密封圈</p>
        <p type="p">52:連接凸塊</p>
        <p type="p">54:安裝環</p>
        <p type="p">60:隔離環</p>
        <p type="p">61:第一壓簧</p>
        <p type="p">62:第二壓簧</p>
        <p type="p">63:上密封圈</p>
        <p type="p">64:下密封圈</p>
        <p type="p">7:陰插頭套</p>
        <p type="p">72:第三密封圈</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1028" publication-number="202615649">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615649</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122124</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人類滋養層幹細胞分泌體、外泌體及其用途</chinese-title>
        <english-title>HUMAN TROPHOBLAST STEM CELL SECRETOMES, EXOSOMES, AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260102B">C12N5/071</main-classification>
        <further-classification edition="201501120260102B">A61K35/28</further-classification>
        <further-classification edition="202501120260102B">A61K40/10</further-classification>
        <further-classification edition="200601120260102B">A61P39/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商安斯瑞德生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACCELERATED BIOSCIENCES CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美國衛生與公眾服務部</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY, DEPARTMENT OF HEALTH AND HUMAN SERVICES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李育達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YU-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昭男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿卜杜勒穆赫森　科特布</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABDELMOHSEN, KOTB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示分泌體（條件培養基）及其可用於治療一年齡相關的疾病或病況的方法。本發明揭示外泌體及其可用於治療一年齡相關的疾病或病況的方法。本發明揭示包含有分泌體（條件培養基）與外泌體的組成物及其可用於治療一年齡相關的疾病或病況的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein are secretomes (conditioned media), and methods that can be used to treat an age-related disease or condition. Described herein are exosomes and methods that can be used to treat an age-related disease or condition. Described herein are compositions comprising secretomes (conditioned media) and exosomes and methods that can be used to treat an age-related disease or condition.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1029" publication-number="202616790">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616790</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122148</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層體的製造方法、電路基板的製造方法、印刷配線板、封裝基板、中介層、電磁波屏蔽膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H05K3/38</main-classification>
        <further-classification edition="201901120260102B">B32B7/02</further-classification>
        <further-classification edition="201901120260102B">B32B7/04</further-classification>
        <further-classification edition="200601120260102B">B32B15/20</further-classification>
        <further-classification edition="200601120260102B">B32B15/08</further-classification>
        <further-classification edition="200601120260102B">H01L21/306</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＤＩＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田村礼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMURA, REI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新林昭太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIIBAYASHI, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>深澤憲正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKAZAWA, NORIMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冨士川亘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIKAWA, WATARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹東穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供在微蝕刻步驟中不會發生導電性銀奈米粒子層損傷從而導電性降低、具有基材與導體電路的高密著性、底切少、設計再現性良好、與能夠形成具有良好的矩形截面形狀的配線作為電路配線的兩面或內層的電路圖案電連接的積層體，以及使用其的印刷配線板。發現如下的內容，於在支撐體(A)的至少一面依次積層有樹脂層(B)、含有導電性物質(c1)和分散劑(c2)的鍍敷基底層(C)、和銅層(D)的積層體中，藉由使用蝕刻液選擇性地去除銅層(D)的步驟，能夠形成具有基材與導體電路的高密著性、底切少、設計再現性良好、與作為電路配線的具有良好的矩形截面形狀的兩面或內層的電路圖案電連接的印刷配線板，從而完成本發明。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:支撐體</p>
        <p type="p">2:樹脂層</p>
        <p type="p">3:導電性鍍敷基底層</p>
        <p type="p">4:銅層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1030" publication-number="202616014">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616014</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122155</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微型ＬＥＤ晶片系統之ＡＩ自動化蝕刻</chinese-title>
        <english-title>AI AUTOMATED ETCHING OF MICRO LED CHIPS SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G05B19/418</main-classification>
        <further-classification edition="200601120260102B">H01L21/304</further-classification>
        <further-classification edition="200601120260102B">H01L21/306</further-classification>
        <further-classification edition="202501120260102B">H10H20/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商弗瑞爾公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VUEREAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查吉　格拉姆瑞札</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAJI, GHOLAMREZA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克朗寧　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRONIN, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪安戴利　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>D'ANDREA, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種用於微型LED的蝕刻的自動化系統，該系統在一準備步驟（諸如施加一光阻劑層）、一程序步驟（諸如蝕刻一晶圓）、及一後處理步驟（諸如清潔該晶圓）之前、期間、及之後檢查該晶圓。該晶圓經成像，且可獲取額外的感測器資料，該額外的感測器資料可由一或多個人工智慧模型用來識別缺陷，將缺陷與來自產生該缺陷的該程序步驟的參數及感測器資料相關聯，預測及測試新的最佳化參數，且然後更新該等程序參數以供處理額外的晶圓，以防止將來的缺陷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses an automated system for the etching of micro-LED, which inspects a wafer before, during, and after a preparatory step, such as applying a photoresist layer, a process step, such as etching the wafer, and a post-processing step, such as cleaning the wafer. The wafer is imaged, and additional sensor data may be acquired, which may be used by one or more artificial intelligence models to identify defects, correlate defects with parameters and sensor data from the process step which yielded the defect, predict and test new optimized parameters, and then updating the process parameters for processing additional wafers to prevent future defects.&lt;b&gt;  &lt;/b&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:第三方AI網路</p>
        <p type="p">104:基礎模組</p>
        <p type="p">106:蝕刻預處理模組</p>
        <p type="p">108:蝕刻程序模組</p>
        <p type="p">110:蝕刻後處理模組</p>
        <p type="p">112:歷史蝕刻模組</p>
        <p type="p">114:蝕刻整合模組</p>
        <p type="p">116:程序資料庫</p>
        <p type="p">118:雲端</p>
        <p type="p">120:預處理設備</p>
        <p type="p">122:預處理感測器</p>
        <p type="p">124:預處理通訊介面</p>
        <p type="p">126:預處理設備記憶體</p>
        <p type="p">128:蝕刻預處理AI模組</p>
        <p type="p">130:預處理資料庫</p>
        <p type="p">132:處理設備</p>
        <p type="p">134:處理感測器</p>
        <p type="p">136:處理通訊介面</p>
        <p type="p">138:處理設備記憶體</p>
        <p type="p">140:蝕刻處理AI模組</p>
        <p type="p">142:處理資料庫</p>
        <p type="p">144:後處理設備</p>
        <p type="p">146:後處理感測器</p>
        <p type="p">148:後處理通訊介面</p>
        <p type="p">150:後處理設備記憶體</p>
        <p type="p">152:蝕刻後處理AI模組</p>
        <p type="p">154:後處理資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1031" publication-number="202616321">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616321</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122198</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於高翹曲晶圓專用腔室中的混合真空靜電吸盤</chinese-title>
        <english-title>HYBRID VACUUM ELECTROSTATIC CHUCK IN DEDICATED CHAMBER FOR HIGH WARPAGE WAFERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H01J37/20</main-classification>
        <further-classification edition="200601120260112B">H01J37/26</further-classification>
        <further-classification edition="200601120260112B">H01L21/67</further-classification>
        <further-classification edition="200601120260112B">H01L21/677</further-classification>
        <further-classification edition="200601120260112B">H01L21/683</further-classification>
        <further-classification edition="200601120260112B">H02N13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商應用材料以色列公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS ISRAEL LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜多維奇　歐佛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUDOVITCH, OFER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哲　葉胡達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZUR, YEHUDA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種在包括主要區域和可與該主要區域環境隔離的輔助區域的處理腔室中處理基板的方法，該方法包括：在該主要區域處於真空壓力時，將該基板轉移到該處理腔室的該主要區域並放置在基板保持器的上表面上，其中該基板保持器包括一或多個設置在該上表面的真空通道以及一或多個靠近該上表面設置在該基板保持器中的電極；在該處理腔室內移動該基板保持器，使該基板從該主要區域移至該輔助區域；將該輔助區域與該主要區域密封並增加該輔助區域內的壓力；當該基板位於該輔助區域內時，藉由對該一或多個真空通道施加真空來吸附並扁平化該基板至該基板保持器；當該基板位於該輔助區域並藉由該一或多個真空通道吸附至該基板保持器時，對該一或多個電極施加電壓，以進一步利用靜電力將該基板吸附至該基板保持器；在該基板由該靜電力吸附至該基板保持器的同時，將該基板從該輔助區域移回該主要區域並在該主要區域以真空壓力處理該基板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of processing a substrate in a processing chamber that includes a primary volume and an auxiliary volume that can be environmentally sealed from the primary volume, the method including: transferring the substrate into the primary volume of the processing chamber and onto an upper surface of a substrate holder while the primary volume is at a vacuum pressure, wherein the substrate holder comprises one or more vacuum channels disposed at the upper surface and one or more electrodes disposed within the substrate holder proximate to the upper surface; moving the substrate holder within the processing chamber such that the substrate is moved from the primary volume to the auxiliary volume; sealing the auxiliary volume from the primary volume and increasing the pressure within the auxiliary volume; while the substrate is within the auxiliary volume, clamping and flattening the substrate to the substrate holder by applying a vacuum to the one or more vacuum channels; while the substrate is within the auxiliary volume and clamped to the substrate holder via the one or more vacuum channels, applying a voltage to the one or more electrodes to further clamp the substrate to the substrate holder with an electrostatic force; and while the substrate is clamped to the substrate holder by the electrostatic force, moving the substrate from the auxiliary volume back into the primary volume and processing the substrate in the primary volume at a vacuum pressure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1100:方法</p>
        <p type="p">1110:步驟</p>
        <p type="p">1120:步驟</p>
        <p type="p">1130:步驟</p>
        <p type="p">1140:步驟</p>
        <p type="p">1150:步驟</p>
        <p type="p">1160:步驟</p>
        <p type="p">1170:步驟</p>
        <p type="p">1180:步驟</p>
        <p type="p">1190:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1032" publication-number="202615470">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615470</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122239</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在酸性pH結合至VISTA之抗體</chinese-title>
        <english-title>ANTIBODIES BINDING TO VISTA AT ACIDIC PH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07K16/28</main-classification>
        <further-classification edition="200601120260102B">A61K39/395</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
        <further-classification edition="200601120260102B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商戊瑞治療有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FIVE PRIME THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商必治妥美雅史谷比公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRISTOL-MYERS SQUIBB COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>約翰史東　羅伯特　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOHNSTON, ROBERT J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷吉帕爾　阿爾文德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAJPAL, ARVIND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛帕德　保羅　Ｏ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEPPARD, PAUL O.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波吉士　路易斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BORGES, LUIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魯恩金　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RANKIN, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴傑特　凱西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAHJAT, KEITH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯爾曼　亞倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KORMAN, ALAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧　安迪　Ｘ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, ANDY X.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇　玲惠　茱莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, LINHUI JULIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷克史鐸　芹潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAKESTRAW, GINGER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請案係關於在酸性pH特異性結合至T細胞活化之含V域免疫球蛋白之抑制因子(VISTA)之抗體及其在癌症治療中之用途。在一些實施例中，該等抗體在酸性pH特異性結合至人類VISTA，但在中性或生理性pH並不顯著結合至人類VISTA。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application relates to antibodies specifically binding to the V-domain immunoglobulin-containing suppressor of T-cell activation (VISTA) at acidic pH and their use in cancer treatment. In some embodiments, the antibodies bind specifically to human VISTA at acidic pH, but do not significantly bind to human VISTA at neutral or physiological pH.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1033" publication-number="202616015">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616015</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122244</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於微型ＬＥＤ的自動化基於ＡＩ之晶圓接合器</chinese-title>
        <english-title>AN AUTOMATED AI-BASED WAFER BONDER FOR MICROLEDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G05B19/418</main-classification>
        <further-classification edition="202501120260102B">H10H29/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商弗瑞爾公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VUEREAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查吉　格拉姆瑞札</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAJI, GHOLAMREZA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克朗寧　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRONIN, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪安戴利　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>D'ANDREA, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供了一種LED基材系統的自動化晶圓接合，其中一自動化晶圓接合檢查模組用以判定進入的處理材料的品質，且一自動化晶圓接合處理模組用以處理該處理材料，一自動化晶圓接合後處理模組用以檢查所得處理材料的可接受性，且一自動化晶圓接合歷史模組用以針對所有歷史資料分析最近處理的後處理結果以找出該自動化晶圓接合處理模組中之增強處理改變，且一自動化晶圓接合整合模組用以基於該自動化晶圓接合歷史模組的該等結果來更新該自動化晶圓接合處理模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an automated wafer bonding of LED substrates system in which an automated wafer bonding inspection module is used to determine the quality of incoming processing material and an automated wafer bonding process module is used to process the processing material, an automated wafer bonding post-process module is used to inspect the resultant process material for acceptability, and an automated wafer bonding historical module is used to analyze the post process results of the most recent process, against all historical data to find enhanced process changes in the automated wafer bonding process module and an automated wafer bonding integration module to update the automated wafer bonding process module based upon the results of the automated wafer bonding historical module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:第三方晶圓接合AI網路</p>
        <p type="p">104:通訊介面</p>
        <p type="p">106:記憶體</p>
        <p type="p">108:基本模組</p>
        <p type="p">110:WB檢查模組</p>
        <p type="p">112:WB處理模組</p>
        <p type="p">114:WB後處理模組</p>
        <p type="p">116:WB歷史模組</p>
        <p type="p">118:WB整合模組</p>
        <p type="p">120:WB檢查資料庫</p>
        <p type="p">122:WB處理資料庫</p>
        <p type="p">124:WB後處理資料庫</p>
        <p type="p">126:WB網路資料庫</p>
        <p type="p">128:雲端；晶圓接合預處理；預處理WB設備</p>
        <p type="p">130:晶圓接合預處理</p>
        <p type="p">132:通訊介面</p>
        <p type="p">134:記憶體；晶圓接合處理</p>
        <p type="p">136:晶圓接合預處理AI模組</p>
        <p type="p">138:晶圓接合預處理資料庫</p>
        <p type="p">140:晶圓接合處理</p>
        <p type="p">142:通訊介面</p>
        <p type="p">144:記憶體</p>
        <p type="p">146:晶圓接合處理AI模組</p>
        <p type="p">148:晶圓接合處理資料庫；後處理WB設備</p>
        <p type="p">150:晶圓接合後處理</p>
        <p type="p">152:通訊介面</p>
        <p type="p">154:記憶體</p>
        <p type="p">156:晶圓接合後處理AI模組</p>
        <p type="p">158:晶圓接合後處理資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1034" publication-number="202615773">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615773</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122257</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>真空排氣裝置</chinese-title>
        <english-title>VACUUM EXHAUST DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">F04D19/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商埃地沃茲日本有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EDWARDS JAPAN LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商阿德特克等離子技術公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADTEC PLASMA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樺澤剛志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KABASAWA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浦山卓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>URAYAMA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種沈積物之洗淨特性優異之真空排氣裝置。  &lt;br/&gt;本發明之真空排氣裝置包含：壓力容器100B；旋轉體下部圓筒部103b，其於壓力容器100B內可旋轉地受保持；及螺紋定子131，其於壓力容器100B內介以外側放電間隙部264與旋轉體下部圓筒部103b對向而配設；且能夠對螺紋定子131施加電壓。於旋轉體下部圓筒部103b與螺紋定子131之對向面之至少一部分，配設沿圓周方向以規定之角度連續之突起部131b，構成牽引泵部。突起部131b形成為朝前端側縮窄之錐形狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">To provide a vacuum exhaust device having excellent characteristics for cleaning deposited material. &lt;br/&gt;A vacuum exhaust device includes: a pressure container 100B; a lower cylindrical portion 103b of a rotating body that is rotatably retained inside the pressure container 100B; and a thread stator 131 that is disposed inside the pressure container 100B to be opposed to the lower cylindrical portion 103b of the rotating body via an outer discharge gap portion 264, wherein application of a voltage to the thread stator 131 is enabled. Protruding portions 131b continuous in a circumferential direction at a prescribed angle are disposed on at least a part of a surface, where the lower cylindrical portion 103b of the rotating body and the thread stator 131 are opposed to each other, so as to constitute a drag pump portion. The protruding portions 131b are each formed in a tapered shape to narrow toward tip ends thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100B:壓力容器</p>
        <p type="p">103b:旋轉體下部圓筒部</p>
        <p type="p">122:定子柱</p>
        <p type="p">129:基座部</p>
        <p type="p">131:螺紋定子</p>
        <p type="p">131a:螺紋槽</p>
        <p type="p">131b:突起部</p>
        <p type="p">132:沖洗用氣體埠</p>
        <p type="p">204:霍爾維克型排氣機構部</p>
        <p type="p">210:電漿產生部</p>
        <p type="p">212:內側定子</p>
        <p type="p">214,234:螺栓</p>
        <p type="p">216,218,236,238:凸緣部</p>
        <p type="p">220,222,240,242:絕緣構件</p>
        <p type="p">224:本體部</p>
        <p type="p">226:總定子部</p>
        <p type="p">250:電漿電源部/電源部</p>
        <p type="p">252:第1交流電源部</p>
        <p type="p">254:第2交流電源部</p>
        <p type="p">256:信號產生器</p>
        <p type="p">258:連接器</p>
        <p type="p">258a,258b:配線</p>
        <p type="p">262:內側放電間隙部</p>
        <p type="p">264:外側放電間隙部</p>
        <p type="p">272a,272b,272c,274a,274b,274c:非對向部位</p>
        <p type="p">276a:下端面</p>
        <p type="p">276b:進氣側階差面</p>
        <p type="p">276c:鄰接部</p>
        <p type="p">A,B:框</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1035" publication-number="202616016">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616016</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122259</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於微型ＬＥＤ的自動化基於ＡＩ之晶粒接合器</chinese-title>
        <english-title>AN AUTOMATED AI-BASED DIE BONDER FOR MICROLEDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G05B19/418</main-classification>
        <further-classification edition="202501120260102B">H10H29/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商弗瑞爾公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VUEREAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查吉　格拉姆瑞札</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAJI, GHOLAMREZA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克朗寧　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRONIN, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪安戴利　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>D'ANDREA, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供了一種LED基材系統的自動化晶粒接合，其中一自動化晶粒接合檢查模組用以判定進入的處理材料的品質，且一自動化晶粒接合處理模組用以處理該處理材料，一自動化晶粒接合後處理模組用以檢查所得處理材料的可接受性，且一自動化晶粒接合歷史模組用以針對所有歷史資料分析最近處理的後處理結果以找出該自動化晶粒接合處理模組中之增強處理改變，且一自動化晶粒接合整合模組用以基於該自動化晶粒接合歷史模組的該等結果來更新該自動化晶粒接合處理模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an automated die bonding of LED substrates system in which an automated die bonding inspection module is used to determine the quality of incoming processing material and an automated die bonding process module is used to process the processing material, an automated die bonding post-process module is used to inspect the resultant process material for acceptability, and an automated die bonding historical module is used to analyze the post process results of the most recent process, against all historical data to find enhanced process changes in the automated die bonding process module and an automated die bonding integration module to update the automated die bonding process module based upon the results of the automated die bonding historical module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:第三方晶粒接合AI網路</p>
        <p type="p">104:通訊介面</p>
        <p type="p">106:記憶體</p>
        <p type="p">108:基本模組</p>
        <p type="p">110:DB檢查模組</p>
        <p type="p">112:DB處理模組</p>
        <p type="p">114:DB後處理模組</p>
        <p type="p">116:DB歷史模組</p>
        <p type="p">118:DB整合模組</p>
        <p type="p">120:DB檢查資料庫</p>
        <p type="p">122:DB處理資料庫</p>
        <p type="p">124:DB後處理資料庫</p>
        <p type="p">126:DB網路資料庫</p>
        <p type="p">128:雲端；晶粒接合預處理；DB檢查設備</p>
        <p type="p">130:晶粒接合預處理</p>
        <p type="p">132:通訊介面</p>
        <p type="p">134:記憶體；晶粒接合處理</p>
        <p type="p">136:晶粒接合預處理AI模組</p>
        <p type="p">138:晶粒接合預處理資料庫；晶粒接合處理；DB處理設備</p>
        <p type="p">140:晶粒接合處理</p>
        <p type="p">142:通訊介面</p>
        <p type="p">144:記憶體</p>
        <p type="p">146:晶粒接合處理AI模組</p>
        <p type="p">148:晶粒接合處理資料庫；DB後處理設備</p>
        <p type="p">150:晶粒接合後處理</p>
        <p type="p">152:通訊介面</p>
        <p type="p">154:記憶體</p>
        <p type="p">156:晶粒接合後處理AI模組</p>
        <p type="p">158:晶粒接合後處理資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1036" publication-number="202616017">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616017</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122270</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於微型ＬＥＤ的自動化基於ＡＩ之修復處理</chinese-title>
        <english-title>AN AUTOMATED AI-BASED REPAIR PROCESS FOR MICROLEDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G05B19/418</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商弗瑞爾公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VUEREAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查吉　格拉姆瑞札</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAJI, GHOLAMREZA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克朗寧　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRONIN, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪安戴利　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>D'ANDREA, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供了一種LED基材系統的自動化修復，其中一自動化修復檢查模組用以判定進入的處理材料的品質，一自動化修復處理模組用以處理該處理材料，一自動化修復後處理模組用以檢查所得處理材料的可接受性，且一自動化修復歷史模組用以針對所有歷史資料分析最近處理的後處理結果以發現該自動化修復處理模組中之增強處理改變，且一自動化修復整合模組用以基於該自動化修復歷史模組的該等結果來更新該自動化修復處理模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an automated repair of LED substrates system in which an automated repair inspection module is used to determine the quality of incoming processing material an automated repair process module is used to process the processing material, an automated repair post-process module is used to inspect the resultant process material for acceptability, and an automated repair historical module is used to analyze the post process results of the most recent process, against all historical data to find enhanced process changes in the automated repair process module, and an automated repair integration module to update the automated repair process module based upon the results of the automated repair historical module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:第三方修復AI網路</p>
        <p type="p">104:通訊介面</p>
        <p type="p">106:記憶體</p>
        <p type="p">108:基本模組</p>
        <p type="p">110:修復檢查模組</p>
        <p type="p">112:修復處理模組</p>
        <p type="p">114:修復後處理模組</p>
        <p type="p">116:修復歷史模組</p>
        <p type="p">118:修復整合模組</p>
        <p type="p">120:修復檢查資料庫</p>
        <p type="p">122:修復處理資料庫</p>
        <p type="p">124:修復後處理資料庫</p>
        <p type="p">126:修復網路資料庫</p>
        <p type="p">128:雲端；修復預處理</p>
        <p type="p">130:修復預處理</p>
        <p type="p">132:通訊介面</p>
        <p type="p">134:記憶體；修復處理</p>
        <p type="p">136:修復預處理AI模組</p>
        <p type="p">138:修復預處理資料庫</p>
        <p type="p">140:修復處理；修復處理設備</p>
        <p type="p">142:通訊介面</p>
        <p type="p">144:記憶體</p>
        <p type="p">146:修復處理AI模組</p>
        <p type="p">148:修復處理資料庫</p>
        <p type="p">150:修復後處理；修復後處理設備</p>
        <p type="p">152:通訊介面</p>
        <p type="p">154:記憶體</p>
        <p type="p">156:修復後處理AI模組</p>
        <p type="p">158:修復後處理資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1037" publication-number="202616000">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616000</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122290</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於微型ＬＥＤ之自動化基於ＡＩ之無遮罩對準器</chinese-title>
        <english-title>AN AUTOMATED AI-BASED MASKLESS ALIGNER FOR MICROLEDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">G03F9/00</main-classification>
        <further-classification edition="202501120260109B">H10H29/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商弗瑞爾公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VUEREAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查吉　格拉姆瑞札</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAJI, GHOLAMREZA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克朗寧　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRONIN, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪安戴利　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>D'ANDREA, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種LED基材系統的自動化無遮罩對準器，其中一自動化無遮罩對準器檢查模組用以判定進入的處理材料的品質，且一自動化無遮罩對準器處理模組用以處理該處理材料，一自動化無遮罩對準器後處理模組用以檢查所得處理材料的允收性，且一自動化無遮罩對準器歷史模組用以針對所有歷史資料分析最近程序的後處理結果以發現該自動化無遮罩對準器處理模組中經改善之程序改變，且一自動化無遮罩對準器整合模組用以基於該自動化無遮罩對準器歷史模組的該等結果來更新該自動化無遮罩對準器處理模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an automated maskless aligner of LED substrates system in which an automated maskless aligner inspection module is used to determine the quality of incoming processing material and an automated maskless aligner process module is used to process the processing material, an automated maskless aligner post-process module is used to inspect the resultant process material for acceptability, and an automated maskless aligner historical module is used to analyze the post process results of the most recent process, against all historical data to find enhanced process changes in the automated maskless aligner process module and an automated maskless aligner integration module to update the automated maskless aligner process module based upon the results of the automated maskless aligner historical module.&lt;b&gt;  &lt;/b&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:第三方無遮罩對準器AI網路</p>
        <p type="p">104:通訊介面</p>
        <p type="p">106:記憶體</p>
        <p type="p">108:基本模組</p>
        <p type="p">110:MA檢查模組</p>
        <p type="p">112:MA處理模組</p>
        <p type="p">114:MA後處理模組</p>
        <p type="p">116:MA歷史模組</p>
        <p type="p">118:MA整合模組</p>
        <p type="p">120:MA檢查資料庫</p>
        <p type="p">122:MA處理資料庫</p>
        <p type="p">124:MA後處理資料庫</p>
        <p type="p">126:MA網路資料庫</p>
        <p type="p">128:無遮罩對準器預處理/雲端</p>
        <p type="p">130:無遮罩對準器預處理</p>
        <p type="p">132:通訊介面</p>
        <p type="p">134:無遮罩對準器處理</p>
        <p type="p">136:無遮罩對準器預處理AI模組</p>
        <p type="p">138:無遮罩對準器預處理資料庫</p>
        <p type="p">140:無遮罩對準器處理</p>
        <p type="p">142:通訊介面</p>
        <p type="p">146:無遮罩對準器處理AI模組</p>
        <p type="p">148:無遮罩對準器處理資料庫</p>
        <p type="p">150:無遮罩對準器後處理</p>
        <p type="p">152:通訊介面</p>
        <p type="p">156:無遮罩對準器後處理AI模組</p>
        <p type="p">158:無遮罩對準器後處理資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1038" publication-number="202616481">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616481</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122317</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含位於整合裝置之間的虛置矽結構的封裝</chinese-title>
        <english-title>PACKAGE COMPRISING DUMMY SILICON STRUCTURE LOCATED BETWEEN INTEGRATED DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L23/16</main-classification>
        <further-classification edition="200601120260102B">H01L23/31</further-classification>
        <further-classification edition="200601120260102B">H01L23/538</further-classification>
        <further-classification edition="202301120260102B">H01L25/065</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋　艷梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, YANMEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史東　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STONE, WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種封裝，其包含：一封裝中介層；一第一整合裝置，其耦接至該封裝中介層；一第二整合裝置，其耦接至該封裝中介層；一虛置矽結構，其側向位於該第一整合裝置與該第二整合裝置之間；及一第二囊封層，其耦接至該封裝中介層，其中該囊封層至少部分地囊封該第一整合裝置、該第二整合裝置、及該虛置矽結構。該封裝中介層包含：一第一金屬化部分；一第二金屬化部分；一第一被動裝置，其位於該第一金屬化部分與該第二金屬化部分之間；及一第一囊封層，其位於該第一金屬化部分與該第二金屬化部分之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A package comprising a package interposer, a first integrated device coupled to the package interposer, a second integrated device coupled to the package interposer, a dummy silicon structure located laterally between the first integrated device and the second integrated device, and a second encapsulation layer coupled to the package interposer, wherein the encapsulation layer at least partially encapsulates the first integrated device, the second integrated device and the dummy silicon structure. The package interposer comprises a first metallization portion; a second metallization portion; a first passive device located between the first metallization portion and the second metallization portion; and a first encapsulation layer located between the first metallization portion and the second metallization portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:板</p>
        <p type="p">107:虛置矽結構</p>
        <p type="p">110:板介電層</p>
        <p type="p">112:板互連件</p>
        <p type="p">114:焊料互連件</p>
        <p type="p">303a:整合裝置</p>
        <p type="p">303b:整合裝置</p>
        <p type="p">305a:整合裝置</p>
        <p type="p">305b:整合裝置</p>
        <p type="p">306:橋接器</p>
        <p type="p">309:囊封層</p>
        <p type="p">331a:柱狀互連件</p>
        <p type="p">331b:柱狀互連件</p>
        <p type="p">350a:柱狀互連件</p>
        <p type="p">350b:柱狀互連件</p>
        <p type="p">352a:焊料互連件</p>
        <p type="p">352b:焊料互連件</p>
        <p type="p">365:柱互連件</p>
        <p type="p">367:焊料互連件</p>
        <p type="p">399:底部填充物</p>
        <p type="p">400:封裝</p>
        <p type="p">402:封裝中介層</p>
        <p type="p">404a:被動裝置</p>
        <p type="p">404b:被動裝置</p>
        <p type="p">420:金屬化部分</p>
        <p type="p">422:介電層</p>
        <p type="p">423:金屬化互連件</p>
        <p type="p">425:柱狀互連件</p>
        <p type="p">430:囊封部分</p>
        <p type="p">432:囊封層</p>
        <p type="p">433:柱互連件</p>
        <p type="p">440:金屬化部分</p>
        <p type="p">442:介電層</p>
        <p type="p">443:金屬化互連件</p>
        <p type="p">445a:柱互連件</p>
        <p type="p">445b:柱互連件</p>
        <p type="p">447a:焊料互連件</p>
        <p type="p">447b:焊料互連件</p>
        <p type="p">448a:互連件</p>
        <p type="p">448b:互連件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1039" publication-number="202615143">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615143</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122341</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種選擇性吸附二氧化碳的模組、方法及生物反應器系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250701B">B01J20/04</main-classification>
        <further-classification edition="200601120250701B">B01J20/28</further-classification>
        <further-classification edition="200601120250701B">B01D53/02</further-classification>
        <further-classification edition="200601120250701B">B01D53/04</further-classification>
        <further-classification edition="200601120250701B">B01D53/62</further-classification>
        <further-classification edition="200601120250701B">C12M1/00</further-classification>
        <further-classification edition="200601120250701B">C12M1/04</further-classification>
        <further-classification edition="200601120250701B">C12M1/107</further-classification>
        <further-classification edition="200601120250701B">C12P5/02</further-classification>
        <further-classification edition="200601120250701B">C10L3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡科技設計大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGAPORE UNIVERSITY OF TECHNOLOGY AND DESIGN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立屏東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱瑞宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, JUEI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐鈺宸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　順年</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SHUNNIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特努瓦拉　哈山Ｎ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THENUWARA, HASHAN N.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽內維拉斯納　哈桑蒂Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENEVIRATHNA, HASANTHI L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種選擇性吸附二氧化碳（CO&lt;sub&gt;2&lt;/sub&gt;）的模組，該模組包含：一個氣體入口，用於接收氣體混合物；一個與氣體入口流體連接的第一容器，該第一容器包含MgO-Mg(OH)&lt;sub&gt;2&lt;/sub&gt;複合材料，用於從該氣體混合物中選擇性地吸附二氧化碳。本發明之模組用於吸附二氧化碳時，可避免MgO顆粒上形成之MgCO&lt;sub&gt;3&lt;/sub&gt;殼層阻礙二氧化碳被吸附，從而可提高對二氧化碳的捕集效率。本發明同時提供一種選擇性吸附二氧化碳的方法，藉由MgO-Mg(OH)&lt;sub&gt;2&lt;/sub&gt;複合材料選擇性吸附二氧化碳。本發明可進一步結合使用光合細菌，無縫整合到現有生物反應器，用於分離氣體混合物中的甲烷與二氧化碳。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1040" publication-number="202615585">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615585</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122351</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱成形之蛋白質聚胺甲酸酯混摻物材料</chinese-title>
        <english-title>THERMOFORMED PROTEIN POLYURETHANE ALLOY MATERIALS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08L75/04</main-classification>
        <further-classification edition="200601120260102B">D06N3/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商現代牧場股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MODERN MEADOW, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢德林　小戴爾　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANDLIN, JR.,DALE LEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉卡尼　舒維塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAKHANI, SHWETA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽斯　阿努吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SETH, ANUJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密斯　傑弗里　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMITH, JEFFREY ALAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威廉森　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILLIAMSON, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">包含熱成形之複合物的物品，該熱成形之複合物包含注入紡織物中的蛋白質聚胺甲酸酯混摻物。複合材料可經歷熱成形程序，該等熱成形程序將該複合物從原始形狀成形為最終形狀。在一些實施例中，該等熱成形之複合材料可係復鞣材料，該復鞣材料包含注入非織造紡織物中的蛋白質聚胺甲酸酯混摻物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Articles comprising a thermoformed composite comprising of a protein polyurethane alloy infused into a textile. The composite materials can be subjected to thermoforming processes that shape the composite from an original shape to a final shape. In some embodiments, the thermoformed composite materials can be retanned material comprising the protein polyurethane alloy infused into a non-woven textile.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1041" publication-number="202615088">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615088</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122366</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於改善胰島素敏感性之組合物及方法</chinese-title>
        <english-title>COMPOSITIONS AND METHODS FOR IMPROVING INSULIN SENSITIVITY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K38/30</main-classification>
        <further-classification edition="200601120260102B">C07K14/65</further-classification>
        <further-classification edition="200601120260102B">C07K14/605</further-classification>
        <further-classification edition="200601120260102B">A61P3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美國禮來大藥廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELI LILLY AND COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬瑟　基蘭　詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATHER, KIEREN JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普瑞特　愛德華　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRATT, EDWARD JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勒爾　威廉　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROELL, WILLIAM C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於對人類葡萄糖依賴性促胰島素多肽受體(GIP-R)具有活性之組合物、尤其長效肽化合物以及用於治療患者之胰島素敏感性或與改善胰島素敏感性有關之症狀或病狀之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to compositions, particularly, long-acting peptide compounds having activity at the human glucose-dependent insulinotropic polypeptide receptor (GIP-R) and methods of use for treating insulin sensitivity in a patient, or a symptom or condition associated with improving insulin sensitivity.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1042" publication-number="202616630">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616630</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122417</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電源轉換電路及其控制方法</chinese-title>
        <english-title>POWER CONVERSION CIRCUIT AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250708B">H02M3/325</main-classification>
        <further-classification edition="200601120250708B">H02M7/217</further-classification>
        <further-classification edition="200601120250708B">G05F1/565</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立錡科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHTEK TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊大勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TA-YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉國基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KUO-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林梓誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TZU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電源轉換電路包括變壓器、諧振電容、上橋電晶體、上橋電晶體以及控制電路。變壓器包括耦接於切換節點以及諧振節點之間之初級線圈以及次級線圈。諧振電容耦接於諧振節點以及接地端之間且產生諧振電壓。上橋電晶體基於上橋驅動信號，將輸入電壓提供至切換節點。下橋電晶體基於下橋驅動信號，將切換節點耦接至接地端。控制電路產生上橋驅動信號以及下橋驅動信號。當控制電路執行啟動程序時，控制電路基於諧振電壓以及輸出電壓之關係，對諧振電容進行放電。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power conversion circuit includes a transformer, a resonant capacitor, a high-side transistor, a low-side transistor, and a control circuit. The transformer includes a primary coil coupled between a switch node and a resonant node and a secondary coil. The resonant capacitor is coupled between the resonant node and a ground and generates a resonant voltage. The high-side transistor provides an input voltage to the switch node based on a high-side driving signal. The low-side transistor couples the switch node to the ground based on a low-side driving signal. The control circuit generates the high-side driving signal and the low-side driving signal. When the control circuit executes a start-up process, the control circuit discharges the resonant capacitor based on the relationship between resonant voltage and the output voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:電源轉換電路</p>
        <p type="p">111:上橋電晶體</p>
        <p type="p">111D:上橋寄生二極體</p>
        <p type="p">112:下橋電晶體</p>
        <p type="p">112D:下橋寄生二極體</p>
        <p type="p">120:電壓產生電路</p>
        <p type="p">130:整流電路</p>
        <p type="p">140:次級控制電路</p>
        <p type="p">310:控制電路</p>
        <p type="p">160:位準移位電路</p>
        <p type="p">CR:諧振電容</p>
        <p type="p">TM:變壓器</p>
        <p type="p">PD:光耦合元件</p>
        <p type="p">HSD:上橋驅動電路</p>
        <p type="p">LSD:下橋驅動電路</p>
        <p type="p">HSG:上橋閘極驅動信號</p>
        <p type="p">LSG:下橋閘極驅動信號</p>
        <p type="p">VIN:輸入電壓</p>
        <p type="p">SW:切換節點</p>
        <p type="p">NR:諧振節點</p>
        <p type="p">VCR:諧振電壓</p>
        <p type="p">PS:初級線圈</p>
        <p type="p">SS:次級線圈</p>
        <p type="p">AS:輔助線圈</p>
        <p type="p">NA:輔助節點</p>
        <p type="p">VNA:助線圈電壓</p>
        <p type="p">IOUT:輸出電流</p>
        <p type="p">IP:初級電流</p>
        <p type="p">VOUT:輸出電壓</p>
        <p type="p">RD1:第一分壓電阻</p>
        <p type="p">RD2:第二分壓電阻</p>
        <p type="p">TR:整流電晶體</p>
        <p type="p">COUT:輸出電容</p>
        <p type="p">VD:汲極電壓</p>
        <p type="p">DR:整流寄生二極體</p>
        <p type="p">IFB:回授電流</p>
        <p type="p">VFB:回授電壓</p>
        <p type="p">SH:上橋驅動信號</p>
        <p type="p">SL:下橋驅動信號</p>
        <p type="p">HSG:上橋閘極驅動信號</p>
        <p type="p">LSG:下橋閘極驅動信號</p>
        <p type="p">RDT:偵測電阻</p>
        <p type="p">RDG:放電電阻</p>
        <p type="p">DMG:退磁電壓</p>
        <p type="p">VCTL:控制電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1043" publication-number="202616427">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616427</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122456</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低熱預算雷射退火</chinese-title>
        <english-title>LOW THERMAL BUDGET LASER ANNEALING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">H01L21/67</main-classification>
        <further-classification edition="200601120260113B">H01L21/324</further-classification>
        <further-classification edition="202501120260113B">H10D84/01</further-classification>
        <further-classification edition="202501120260113B">H10D84/83</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛瑪　雪恩克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHARMA, SHASHANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布瑞爾　尼可拉斯路易斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BREIL, NICOLAS LOUIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江　柳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, LIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本實施例提供熱處理設備。熱處理設備包括輻射模組，該模組配置為產生用於退火製程的輻射線、配置為在其上接收基板的基板支撐件，及平移機構。基板支撐件包括一或多個通道，該等通道配置為允許工作流體從中流經。該工作流體配置為使設置於基板支撐件上的基板的底表面在退火製程中冷卻至約200°C至約-200°C的溫度。平移機構配置為使基板支撐件和輻射線彼此相對平移。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The embodiments herein provide thermal processing apparatus. The thermal processing apparatus includes a radiation module configured to generate a line of radiation for an annealing process, a substrate support configured to receive a substrate thereon, and a translation mechanism. The substrate support includes one or more channels configured to flow a working fluid therethrough. The working fluid is configured to enable a bottom surface of the substrate disposed upon the substrate support to be cooled to a temperature of about 200°C to about -200°C during the annealing process. The translation mechanism is configured to translate the substrate support and the line of radiation relative to one another.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:裝置</p>
        <p type="p">414:基板</p>
        <p type="p">424:上表面</p>
        <p type="p">425:底表面</p>
        <p type="p">450:前側信號線</p>
        <p type="p">452:背側隔離層</p>
        <p type="p">454:vdd</p>
        <p type="p">456:vss</p>
        <p type="p">458:介電層</p>
        <p type="p">460:隔離層</p>
        <p type="p">462:背側觸點</p>
        <p type="p">464:觸點</p>
        <p type="p">466:接觸層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1044" publication-number="202615341">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615341</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122537</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電雙層電容器的由木質素獲得的活性碳</chinese-title>
        <english-title>ACTIVATED CARBON OBTAINED FROM LIGNIN FOR ELECTRIC DOUBLE LAYER CAPACITOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260102B">C01B32/30</main-classification>
        <further-classification edition="201701120260102B">C01B32/318</further-classification>
        <further-classification edition="201701120260102B">C01B32/336</further-classification>
        <further-classification edition="201301120260102B">H01G11/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商史託拉安索公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STORA ENSO OYJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐森　維禾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLSSON, VILHELM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦奇勒　馬瑞歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WACHTLER, MARIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦特　史帝芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALTER, STEPHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及由木質素獲得的活性碳。該活性碳具有在1200至1600 m&lt;sup&gt;2&lt;/sup&gt;/g的範圍內的BET比表面積、以及在0.6至0.8 cm&lt;sup&gt;3&lt;/sup&gt;/g的範圍內的總孔隙體積，並且其中，當使用重量吸附容量掃描法從300℃掃描至290℃時，以活性碳的總重量計，該活性碳吸附小於1.1 wt%的1,1,1,2-四氟乙烷。本發明進一步涉及用於生產此種活性碳的方法、用於包含此種活性碳的電雙層電容器（EDLC）的電極材料、以及此種活性碳用於EDLC的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to activated carbon obtained from lignin. The activated carbon has a BET specific surface area in the range of from 1200-1600 m2/g and a total pore volume in the range of from 0.6-0.8 cm3/g, and wherein the activated carbon adsorbs less than 1.1 wt% 1,1,1,2 tetra-fluoroethane based on the total weight of the activated carbon when scanning from 300 to 290°C using gravimetric adsorption capacity scanning. The invention further relates to a method for producing such an activated carbon, an electrode material for an electric double layer capacitor (EDLC) comprising such an activated carbon, and use of such an activated carbon in an EDLC.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1045" publication-number="202615832">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615832</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122631</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>壓力感測器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G01L1/22</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商藤倉股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIKURA LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙口裕哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAGUCHI, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡辺政巳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, MASAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明目的是提供能夠達成輸出特性之提升的壓力感測器。壓力感測器1A包括：基材11、設置於基材11上表面111的電阻體14、設置於上表面111且連接至電阻體14的佈線圖案12、設置於上表面111且各自獨立地連接至電阻體14的梳齒圖案15A至15I、設置於上表面111的佈線圖案16、基材21、設置於基材21之下表面的連接體22、介於基材11和基材21之間的間隔件30、設置於基材11之下表面112的間隔件40，上表面111具有藉由間隔件40而比上表面111的其他部分更高的最高部114、從最高部114延伸的傾斜面115，在頂視視角中，梳齒圖案15A至15I包括與傾斜面115重疊的梳齒圖案15A至15I。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:壓力感測器</p>
        <p type="p">10:下側膜狀基板</p>
        <p type="p">11:基材</p>
        <p type="p">111:上表面</p>
        <p type="p">112:下表面</p>
        <p type="p">113:對向區域</p>
        <p type="p">114:最高部</p>
        <p type="p">115:傾斜面</p>
        <p type="p">15A,15B,15C,15D,15E,15F,15G,15H,15I:梳齒圖案</p>
        <p type="p">16:佈線圖案</p>
        <p type="p">161:前端部(擴徑部)</p>
        <p type="p">20:上側膜狀基板</p>
        <p type="p">21:基材</p>
        <p type="p">211:上表面</p>
        <p type="p">212:下表面</p>
        <p type="p">22:連接體</p>
        <p type="p">30:間隔件</p>
        <p type="p">31:開口</p>
        <p type="p">40:間隔件</p>
        <p type="p">70:支持體</p>
        <p type="p">71:支持面</p>
        <p type="p">CP:中心</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1046" publication-number="202616364">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616364</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122645</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於極紫外線(EUV)微影術之含氟底層</chinese-title>
        <english-title>UNDERLAYER WITH FLUORINE FOR EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/033</main-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮　南西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUNG, NANCY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高　賴利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, LARRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪立坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LIKUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金澤秀行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANZAWA, HIDEYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　樂群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, LEQUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文所述的實施例係關於一種方法，該方法包括在基板上方形成底層，其中該底層是包含碳和氟的極紫外線（EUV）阻劑。在實施例中，該方法包括在底層上方形成阻劑層，其中該阻劑層是EUV化學增強阻劑（CAR）。在實施例中，該方法包括將阻劑層和底層曝光於EUV電磁輻射，其中來自該底層的氟擴散進入該阻劑層。在實施例中，該方法包括使該阻劑層顯影。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments described herein relate to a method that includes forming an underlayer over a substrate, wherein the underlayer is an extreme ultraviolet (EUV) resist that includes carbon and fluorine. In an embodiment, the method includes forming a resist layer over the underlayer, wherein the resist layer is an EUV chemically amplified resist (CAR). In an embodiment, the method includes exposing the resist layer and the underlayer to EUV electromagnetic radiation, wherein fluorine from the underlayer diffuses into the resist layer. In an embodiment, the method includes developing the resist layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">450:製程</p>
        <p type="p">451~455:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1047" publication-number="202615833">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615833</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122653</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理系統用液體感測器</chinese-title>
        <english-title>LIQUID SENSORS FOR SUBSTRATE PROCESSING SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">G01M3/16</main-classification>
        <further-classification edition="200601120260114B">G01M3/18</further-classification>
        <further-classification edition="200601120260114B">G01M3/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坦杜爾卡爾　馬立卡君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANDURKAR, MALLIKARJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴哈特　科塔　查魯奇亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHAT, KOTA CHALUKYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙瓦拉尼　卡皮爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWLANI, KAPIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯圖姆夫　約翰　福爾登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STUMPF, JOHN FOLDEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿南塔拉賈亞　阿布舍克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANANTHARAJAIAH, ABHISHEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">感測器包括第一絕緣材料之第一層、包含導線之柵格之第二層以及包含佈設於第二層上之第二絕緣材料之網格的第三層。導線包括佈設第一層上的絕緣導體。導線之柵格包括沿第一軸佈設之第一導線、沿與第一軸相交之第二軸佈設之第二導線以及沿第一軸佈設之第三導線。部分的第一、第二及第三導線部分未絕緣，以在第一、第二與第三導線相交之區域中部分暴露相應導體。第一、第二與第三導線相交處之導線的部分絕緣部分位於部分暴露之相應導體之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sensor includes a first layer of a first insulating material, a second layer including a grid of wires, and a third layer including a mesh of a second insulating material arranged on the second layer. The wires include insulated conductors arranged on the first layer. The grid of wires includes first wires arranged along a first axis, second wires arranged along a second axis intersecting the first axis, and third wires arranged along the first axis. Portions of the first, second, and third wires are partially uninsulated to partially expose respective conductors in regions where the first, second, and third wires intersect. Partially insulated portions of the first, second, and third wires where the first, second, and third wires intersect lie between the partially exposed respective conductors.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:洩漏檢測感測器、液體檢測感測器、液體感測器</p>
        <p type="p">302:第一層(基層)、基礎絕緣層(或第一絕緣層)</p>
        <p type="p">304:第二層、網格導體層</p>
        <p type="p">306:第三層、網格絕緣層(或第二絕緣層)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1048" publication-number="202615680">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615680</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122677</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁控濺鍍裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C23C14/35</main-classification>
        <further-classification edition="200601120260102B">H01J37/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商愛發科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ULVAC, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北沢僚也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAZAWA, RYOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高木大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAGI, DAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種可膜質之面內均勻性良好地形成預定薄膜的磁控濺鍍裝置。  &lt;br/&gt;　　[解決手段]本發明之磁控濺鍍裝置(SM&lt;sub&gt;1&lt;/sub&gt;)，係具備有：屏蔽板(4)，具有對向配置靶材(2)與基板(Sg)之真空腔室(1)，並被配置為包圍靶材的周圍，在靶材之濺鍍時作為陽極而發揮功能；及磁鐵單元(3)，使洩漏磁場作用於靶材與基板之間的成膜空間。在從靶材朝向基板之方向即屏蔽板的下面具備有筒狀壁部(40)，該筒狀壁部(40)，係從接近靶材端的位置朝向下方延伸預定長度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:真空腔室</p>
        <p type="p">1a:成膜空間</p>
        <p type="p">2:靶材</p>
        <p type="p">3:磁鐵單元</p>
        <p type="p">4:屏蔽板</p>
        <p type="p">5:驅動手段</p>
        <p type="p">11:排氣口</p>
        <p type="p">12:排氣管</p>
        <p type="p">13:真空泵</p>
        <p type="p">14:氣體導入口</p>
        <p type="p">15:質量流控制器</p>
        <p type="p">16:氣體導入管</p>
        <p type="p">21:濺鍍面</p>
        <p type="p">22:背板</p>
        <p type="p">23:絕緣板</p>
        <p type="p">24:濺鍍電源</p>
        <p type="p">24a:輸出</p>
        <p type="p">31:支撐板</p>
        <p type="p">32:中央磁鐵</p>
        <p type="p">33:周邊磁鐵</p>
        <p type="p">40:上筒狀壁部</p>
        <p type="p">51:驅動軸</p>
        <p type="p">D1:靶材端與筒狀壁部之間的距離、第2接收凹部</p>
        <p type="p">Gp:迷宮式構造的間隙</p>
        <p type="p">Is:絕緣體</p>
        <p type="p">Sd:屏蔽板</p>
        <p type="p">Sd1:下筒狀壁部</p>
        <p type="p">Sg:基板</p>
        <p type="p">SM&lt;sub&gt;1&lt;/sub&gt;:濺鍍裝置</p>
        <p type="p">St:基板平台</p>
        <p type="p">St1:平台本體</p>
        <p type="p">Uc:陰極單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1049" publication-number="202615202">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615202</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122685</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有熱管理特徵之拋光墊</chinese-title>
        <english-title>POLISHING PAD WITH THERMAL MANAGEMENT FEATURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260112B">B24B37/015</main-classification>
        <further-classification edition="201201120260112B">B24B37/24</further-classification>
        <further-classification edition="201201120260112B">B24B37/26</further-classification>
        <further-classification edition="200601120260112B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商杜邦電子材料控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUPONT ELECTRONIC MATERIALS HOLDING, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商杜邦專業產品美國有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUPONT SPECIALTY PRODUCTS USA, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加丁斯基　馬修Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GADINSKI, MATTHEW R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>輝　戴夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUI, DAVE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　哈內亨　馬修　理查</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN HANEHEM, MATTHEW RICHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝爾頓　卡梅倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHELTON, CAMERON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅斯　傑弗瑞　史考特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METH, JEFFREY SCOTT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯特雷德　傑森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STRADER, JASON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於化學機械拋光的拋光墊，該拋光墊包括拋光層和相鄰的副墊層。該拋光層包括拋光表面、與該拋光表面相反的拋光層介面表面、從該拋光表面延伸到該拋光層介面表面的拋光層厚度、以及從該拋光層表面向該拋光層介面表面延伸的凹部。該凹部的深度係該拋光層厚度的至少80%。該副墊層具有與該拋光層介面表面相鄰的副墊介面表面和與該副墊介面表面相反的底部表面。該副墊層具有1至35W/m-K的熱導率。主墊層中的深凹槽和副墊層的導熱性的組合可以在襯底的拋光期間促進拋光介面處的熱管理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A polishing pad for chemical mechanical polishing comprises a polishing layer and an adjacent subpad layer. The polishing layer includes a polishing surface, a polishing layer interface surface opposite the polishing surface, a polishing layer thickness extending from the polishing surface to the polishing layer interface surface, and recesses extending from the polishing layer surface toward the polishing layer interface surface. A depth of the recesses is at least 80% the polishing layer thickness. The subpad layer has a subpad interface surface adjacent to the polishing layer interface surface and a bottom surface opposite the subpad interface surface. The subpad layer has a thermal conductivity of 1 to 35 Watts/m-K. The combination of the deep grooves in the top layer and the thermal conductivity of the subpad layer can facilitate thermal management at the polishing interface during polishing of a substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:拋光墊</p>
        <p type="p">12:頂部拋光表面</p>
        <p type="p">14:凹部</p>
        <p type="p">16:拋光層介面表面</p>
        <p type="p">20:副墊</p>
        <p type="p">22:副墊底部表面</p>
        <p type="p">26:副墊介面表面</p>
        <p type="p">d:深度</p>
        <p type="p">t:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1050" publication-number="202615685">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615685</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122695</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>互連結構及積體電路裝置</chinese-title>
        <english-title>INTERCONNECT STRUCTURE AND INTEGRATED CIRCUIT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">C23C16/04</main-classification>
        <further-classification edition="200601120260108B">C23C16/18</further-classification>
        <further-classification edition="200601120260108B">C23C16/455</further-classification>
        <further-classification edition="200601120260108B">C23C16/46</further-classification>
        <further-classification edition="200601120260108B">C23C16/56</further-classification>
        <further-classification edition="200601120260108B">H01L23/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林容徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEEM, YOUNGCHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李煐敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YOUNG MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李政燁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JEONGYUB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙恩亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, EUN-HYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種互連結構及一種積體電路裝置。該互連結構包括：一膜，其包括非單晶材料；以及一釕膜，其定位於該膜上且包括晶粒，其中該釕膜之具有＜001＞取向之該等晶粒具有約0.7至1的晶粒紋理化因數&lt;i&gt;F&lt;/i&gt;&lt;sub&gt;001&lt;/sub&gt;，且該釕膜之平均晶粒大小為約50 nm至約200 nm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An interconnect structure and an integrated circuit device are disclosed. The interconnect structure includes a film including non-single crystalline material, and a ruthenium film positioned on the film and including crystal grains, wherein the crystal grains with ＜001＞ orientation of the ruthenium film has a crystal grain texturing factor, &lt;i&gt;F&lt;/i&gt;&lt;sub&gt;001&lt;/sub&gt;, of about 0.7 to 1, and an average crystal grain size of the ruthenium film is about 50 nm to about 200 nm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:膜</p>
        <p type="p">20:介電膜</p>
        <p type="p">21:溝槽</p>
        <p type="p">30:釕膜</p>
        <p type="p">100:互連結構</p>
        <p type="p">W:寬度，線寬</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1051" publication-number="202615092">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615092</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122724</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗Ｃ２抗體及其用途</chinese-title>
        <english-title>ANTI-C2 ANTIBODIES AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K39/395</main-classification>
        <further-classification edition="200601120260102B">C07K16/18</further-classification>
        <further-classification edition="200601120260102B">A61P25/00</further-classification>
        <further-classification edition="200601120260102B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澳大利亞商ＣＳＬ創新有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CSL INNOVATION PTY LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈迪　馬修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARDY, MATTHEW PHILIP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>懷曼　桑德拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WYMANN, SANDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅維　東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROWE, TONY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞特　薩賓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAUTH, SABINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維爾哈根　安妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERHAGEN, ANNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫拉萊斯　羅德里戈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORALES, RODRIGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露有關與C2之絲胺酸蛋白酶域內之表位特異性地結合之補體C2結合蛋白及其用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to complement C2-binding proteins that specifically bind to an epitope within a serine protease domain of C2 and uses thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1052" publication-number="202616148">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616148</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122751</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示控制資訊生成裝置、目視檢查裝置、基板檢查系統、顯示控制資訊生成方法以及電腦可讀取的程式</chinese-title>
        <english-title>DISPLAY CONTROL INFORMATION GENERATING APPARATUS, VISUAL INSPECTION APPARATUS, SUBSTRATE INSPECTION SYSTEM, DISPLAY CONTROL INFORMATION GENERATING METHOD, AND COMPUTER-READABLE PROGRAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">G06N3/08</main-classification>
        <further-classification edition="201301120260102B">G06F3/048</further-classification>
        <further-classification edition="201801120260102B">G06F9/44</further-classification>
        <further-classification edition="200601120260102B">G01N21/88</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海津正博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAIZU, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">顯示控制資訊生成裝置的控制資訊生成部係基於缺陷候補資訊生成與檢查區域的複數個缺陷候補相關的顯示控制資訊。缺陷候補資訊的複數個缺陷候補資料要素係分別包含缺陷候補位置以及匹配率。缺陷候補位置係根據藉由針對基板9的規則庫的一次檢查所檢測到的暫時缺陷候補，顯示利用了藉由機器學習所作成的學習完畢模型之二次檢查所檢測到的一個缺陷候補在基板9上的位置。匹配率係顯示該一個缺陷候補匹配至預定的缺陷種類的程度。顯示控制資訊係包含：控制資訊，係在與檢查區域相關的複數個缺陷候補資料要素中最高的匹配率為預定的匹配率臨限值以上之情形中，將檢查區域的複數個缺陷候補設定成在顯示器中為非顯示。藉此，能縮短驗證作業所需的時間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A control information generating part of a display control information generating apparatus generates display control information relating to a plurality of defect candidates in an inspection area based on the defect candidate information. The plurality of defect candidate data elements of the defect candidate information each include a defect candidate position and a matching ratio. The defect candidate position indicates the position of one defect candidate on the substrate 9. The one defect candidate is detected by secondary inspection using a learned model created by machine learning from a temporary defect candidate detected by rule-based primary inspection on the substrate 9. The fitting ratio indicates the degree to which the one defect candidate fits a predetermined defect type. The display control information includes control information to make the plurality of candidate defects in the inspection area non-displayable on the display, when the highest fitting rate in the plurality of candidate defect data elements in the inspection area is higher than the predetermined threshold of fitting rate. This can shorten the time required for verification work.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板檢查系統</p>
        <p type="p">2:一次檢查裝置</p>
        <p type="p">3:二次檢查裝置</p>
        <p type="p">4:目視檢查裝置</p>
        <p type="p">9:基板</p>
        <p type="p">21:圖像取得裝置</p>
        <p type="p">22:第一電腦</p>
        <p type="p">32:第二電腦</p>
        <p type="p">41:拍攝裝置</p>
        <p type="p">42:第三電腦</p>
        <p type="p">211,411:台</p>
        <p type="p">212,412:台移動機構</p>
        <p type="p">213,413:拍攝部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1053" publication-number="202615204">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615204</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122798</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於漿料的收集的噴嘴設計</chinese-title>
        <english-title>NOZZLE DESIGN FOR COLLECTION OF SLURRY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260108B">B24B37/10</main-classification>
        <further-classification edition="200601120260108B">B24B57/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥拉帕那哈尼納瑞辛侅　契丹庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MYLAPPANAHALLI NARASINGAIAH, CHETAN KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴迪　尼基爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BADDI, NIKHIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許龍龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, LONGLONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的某些態樣針對一種漿料收集裝置。該裝置一般包括：研磨站，包括第一平臺和鄰近第一平臺的第一溝槽；配置為從第一溝槽內收集漿料的第一噴嘴；以及連接到第一噴嘴的至少一個第一支撐件，並配置為支撐第一噴嘴的底端在第一溝槽內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Certain aspects of the present disclosure are directed towards an apparatus for slurry collection. The apparatus generally includes: a polishing station including a first platen and a first trench adjacent to the first platen; a first nozzle configured to collect slurry from within the first trench; and at least one first supporting element coupled to the first nozzle and configured to support a bottom end of the first nozzle within the first trench.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:半導體處理裝置</p>
        <p type="p">201:研磨機</p>
        <p type="p">202:連接元件</p>
        <p type="p">204:連接元件</p>
        <p type="p">206:連接元件</p>
        <p type="p">208:連接元件</p>
        <p type="p">210:溝槽</p>
        <p type="p">212:平臺</p>
        <p type="p">214:連接元件</p>
        <p type="p">216:連接元件</p>
        <p type="p">218:連接元件</p>
        <p type="p">220:連接元件</p>
        <p type="p">230:研磨站</p>
        <p type="p">231:外壁</p>
        <p type="p">240:垂直支撐件</p>
        <p type="p">242:水平支撐件</p>
        <p type="p">250:垂直支撐件</p>
        <p type="p">272:管道</p>
        <p type="p">274:管道</p>
        <p type="p">290:歧管組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1054" publication-number="202616115">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616115</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122824</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於在保護隱私的同時評估生命週期影響之系統、方法及設備</chinese-title>
        <english-title>SYSTEM, METHOD, AND APPARATUS FOR ESTIMATING LIFE-CYCLE IMPACT WHILE PRESERVING PRIVACY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260102B">G06F21/62</main-classification>
        <further-classification edition="202401120260102B">G06Q50/26</further-classification>
        <further-classification edition="201201120260102B">G06Q50/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商馬克專利公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCK PATENT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納拉西姆漢　維傑　克里斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARASIMHAN, VIJAY KRIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐婷婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OU, TINGTING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於在保護資料隱私之同時評估生命週期影響之系統、方法及設備，其使用聯邦學習在不暴露隱私資料之情況下訓練跨多個局部客戶端之機器學習模型。局部客戶端對隱私資料集訓練局部模型。來自此等局部模型之隱私化更新資料可傳輸至一中央伺服器，該中央伺服器聚合此資料以增強一全域模型。該全域模型經重新分布至客戶端，藉此在不存取任何原始隱私資料之情況下透過連續聯邦學習回合提高其準確性。局部客戶端可查詢其等局部模型以獲得基於聚合學習之產品或程序之影響分數。各種隱私保護運算協定限制敏感資料之暴露。此合作框架在不損及保密性之情況下實現反映廣泛資料存取之集體模型改進。該系統為客戶端提供準確影響值連同資料安全性保證。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system, method, and apparatus for estimating life-cycle impact while preserving data privacy uses federated learning to train machine learning models across multiple local clients without exposing private data. Local clients train local models on private datasets. Privatized update data from these local models may be transmitted to a central server which aggregates this data to enhance a global model. The global model is redistributed to clients, thereby improving its accuracy through successive federated learning rounds, without accessing any raw private data. Local clients can query their local models to obtain impact scores for products or processes based on the aggregated learning. A range of privacy-preserving computation protocols limit exposure of sensitive data. This cooperative framework enables collective model refinement reflective of broad data access without compromising confidentiality. The system provides accurate impact values alongside data security assurances for clients.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">102:雲端服務提供器/中央伺服器</p>
        <p type="p">104a:局部客戶端</p>
        <p type="p">104b:局部客戶端</p>
        <p type="p">104c:局部客戶端</p>
        <p type="p">108:網路</p>
        <p type="p">110:資源調度器</p>
        <p type="p">114:聚合模型</p>
        <p type="p">115:最佳化組件</p>
        <p type="p">116:接收器</p>
        <p type="p">118:GUI組件</p>
        <p type="p">119:伺服器場</p>
        <p type="p">120:查詢組件</p>
        <p type="p">121a至121n:伺服器</p>
        <p type="p">122:虛擬伺服器</p>
        <p type="p">124:虛擬處理器</p>
        <p type="p">125:密碼組件</p>
        <p type="p">126:虛擬記憶體</p>
        <p type="p">128:虛擬磁碟空間</p>
        <p type="p">132:資料庫</p>
        <p type="p">146:轉換因數查找表</p>
        <p type="p">148:訓練資料</p>
        <p type="p">150:使用者帳戶</p>
        <p type="p">152:聚合隱私化資料</p>
        <p type="p">154:資料庫</p>
        <p type="p">156:局部資料集</p>
        <p type="p">158:公用資料</p>
        <p type="p">160:隱私資料</p>
        <p type="p">162:處理器</p>
        <p type="p">164:局部模型</p>
        <p type="p">166:訓練組件</p>
        <p type="p">168:更新資料</p>
        <p type="p">170:隱私化組件</p>
        <p type="p">172:密碼組件</p>
        <p type="p">174:隱私化更新資料</p>
        <p type="p">176:傳輸器</p>
        <p type="p">178:影響值</p>
        <p type="p">180:影響分數</p>
        <p type="p">182:分數組件</p>
        <p type="p">184:生命週期評估器</p>
        <p type="p">186:GUI組件</p>
        <p type="p">187:查詢組件</p>
        <p type="p">188:影響值</p>
        <p type="p">189:分數組件</p>
        <p type="p">190:影響分數</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1055" publication-number="202616762">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616762</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122848</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無線網路中低潛時流量站點、存取點及方法</chinese-title>
        <english-title>STATION, ACCESS POINT AND METHODS FOR LOW LATENCY TRAFFIC IN WIRELESS NETWORKS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">H04W72/20</main-classification>
        <further-classification edition="200901120260102B">H04W88/08</further-classification>
        <further-classification edition="200901120260102B">H04W28/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商內數位專利控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERDIGITAL PATENT HOLDINGS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樓　漢卿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOU, HANQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　曉飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, XIAOFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供與無線網路中的低潛時訊務有關的方法、裝置、及/或系統。一種方法可包含向存取點（AP）傳輸包括一或更多個欄位或子欄位的訊框，欄位或子欄位用於指示STA支援與支援低潛時訊務指示符（LLTI）通訊的AP相關聯的第一群組的其它STA進行低潛時訊務指示符（LLTI）通訊。該方法可包含從AP接收第一控制訊框，其指示第一TXOP期間的經准許LLTI通訊傳輸；在第一TXOP期間傳輸LLTI訊號；及基於經傳輸LLTI訊框，傳輸相對於其它資料訊務具有低潛時要求的資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods, apparatuses, and/or systems relating to low latency traffic in wireless networks are provided. One method may include transmitting, to an Access Point (AP), a frame comprising one or more fields or subfields for indicating the STA supports Low Latency Traffic Indicator (LLTI) communications with a first group of other STAs associated with the AP that support the Low Latency Traffic Indicator (LLTI) communications. The method may include receiving, from the AP, a first control frame indicating a permitted transmission of LLTI communications during a first TXOP, transmitting, an LLTI signal during the first TXOP, and transmitting, data having a low latency requirement relative to other data traffic based on the transmitted LLTI frame.</p>
      </isu-abst>
      <representative-img>
        <p type="p">280:傳輸訊框(STA允許LLTI)</p>
        <p type="p">281:接收經准許傳輸LLTI</p>
        <p type="p">282:傳輸LLTI</p>
        <p type="p">283:傳輸低潛時要求</p>
        <p type="p">LLTI:低潛時訊務指示符</p>
        <p type="p">STA:站台</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1056" publication-number="202615187">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615187</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122856</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雷射加工裝置、光強度修正方法、光強度修正程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260102B">B23K26/062</main-classification>
        <further-classification edition="201401120260102B">B23K26/082</further-classification>
        <further-classification edition="201401120260102B">B23K26/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之雷射加工裝置具備：光源，其發出雷射光；光纖，其使上述雷射光、及上述加工對象物中被照射上述雷射光之照射點所發出之熱輻射光傳播；監視部，其連接有上述光纖，使來自上述光源之上述雷射光入射至上述光纖，且接收上述光纖中傳播之上述熱輻射光之入射，檢測該熱輻射光之光強度；光掃描部，其具有反射自上述光纖出射之上述雷射光、及上述照射點所發出之上述熱輻射光之反射面，藉由使上述反射面之角度變動，而對上述加工對象物掃描上述雷射光，且使上述熱輻射光入射至上述光纖；及修正部，其修正上述監視部檢測之上述光強度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:雷射加工裝置</p>
        <p type="p">2:光源</p>
        <p type="p">3:第1光纖</p>
        <p type="p">4:第2光纖(光纖)</p>
        <p type="p">5:雷射加工頭</p>
        <p type="p">6:光掃描部</p>
        <p type="p">7:fθ透鏡</p>
        <p type="p">10:雷射加工監視器(監視部)</p>
        <p type="p">100:光強度修正裝置</p>
        <p type="p">110:修正部</p>
        <p type="p">120:保持部</p>
        <p type="p">L1:雷射光</p>
        <p type="p">L1a:雷射光</p>
        <p type="p">L2:熱輻射光</p>
        <p type="p">S:加工對象物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1057" publication-number="202615183">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615183</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122858</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雷射加工裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260108B">B23K26/00</main-classification>
        <further-classification edition="201401120260108B">B23K26/02</further-classification>
        <further-classification edition="201401120260108B">B23K26/082</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之雷射加工裝置具備：光源即光纖雷射，其發出雷射光；光纖，其使上述雷射光、及加工對象物中被照射上述雷射光之照射點所發出之熱輻射光傳播；監視部，其連接有上述光纖，使來自上述光纖雷射之上述雷射光入射至上述光纖，且接收上述光纖中傳播之上述熱輻射光之入射，檢測該熱輻射光；及光掃描部，其具有反射自上述光纖出射之上述雷射光、及上述照射點所發出之上述熱輻射光之反射面，藉由使上述反射面之角度變動，而對上述加工對象物掃描上述雷射光，且使上述熱輻射光入射至上述光纖；且上述反射面由金屬材料形成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:雷射加工裝置</p>
        <p type="p">2:光纖雷射</p>
        <p type="p">3:第1光纖</p>
        <p type="p">4:第2光纖(光纖)</p>
        <p type="p">6:光掃描部</p>
        <p type="p">7:fθ透鏡</p>
        <p type="p">10:雷射加工監視器(監視部)</p>
        <p type="p">L1:雷射光</p>
        <p type="p">L1a:雷射光</p>
        <p type="p">L2:熱輻射光</p>
        <p type="p">S:加工對象物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1058" publication-number="202616124">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616124</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122892</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於積體電路設計的系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR INTEGRATED CIRCUIT DESIGN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260114B">G06F30/327</main-classification>
        <further-classification edition="201901120260114B">G06N20/00</further-classification>
        <further-classification edition="202501120260114B">H10D89/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商西林特公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILIMATE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>列維　阿卡什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEVY, AKASH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於積體電路設計的方法，其較佳包含：確定模型、確定輸入、及/或提供預測。一種用於積體電路設計的系統，其較佳包含：訓練模組、輸入模組、預測模組、運算子模型、縮放模型，及/或一或多個計算系統。在一些變體中，該系統及/或方法可以作用來提供與一或多個積體電路設計關聯之積體電路指標（諸如功率、效能、面積及/或類似者）的快速預測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for integrated circuit design, preferably including: determining a model, determining an input, and/or providing predictions. A system for integrated circuit design, preferably including: a training module, an input module, a prediction module, an operator model, a scaling model, and/or one or more computing systems. In some variants, the system and/or method can function to provide rapid predictions of integrated circuit metrics, such as power, performance, area, and/or the like, associated with one or more integrated circuit designs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:方法</p>
        <p type="p">S100:確定模型</p>
        <p type="p">S200:確定輸入</p>
        <p type="p">S300:提供預測</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1059" publication-number="202615657">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615657</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122895</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>PRNP　RNAi藥劑</chinese-title>
        <english-title>PRNP RNAI AGENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260102B">C12N15/113</main-classification>
        <further-classification edition="200601120260102B">A61K31/7088</further-classification>
        <further-classification edition="200601120260102B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美國禮來大藥廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELI LILLY AND COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿拉姆　里亞祖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALAM, RIAZUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔻茲　古勒莫　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORTEZ, GUILLERMO S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奎格　凱文　派翠克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRAIG, KEVIN PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁岩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DING, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桂萬淑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYE, MAHN SUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　蘇玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SHIRLEY SO LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬歇爾　凱瑟琳　瑪莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARSHALL, KATHERINE MARIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫亞瑞迷　麥可　帕揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOAZAMI, MICHAEL PAYAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　延</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍羅伯里斯基　亞隆　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WROBLESKI, AARON D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供PRNP RNAi藥劑及包含PRNP RNAi藥劑之組合物。本文亦提供使用該等PRNP RNAi藥劑或包含PRNP RNAi藥劑之組合物降低PRNP表現及/或治療普里昂疾病(prion diseases)之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are PRNP RNAi agents and compositions comprising a PRNP RNAi agent. Also provided herein are methods of using the PRNP RNAi agents or compositions comprising a PRNP RNAi agent in reducing PRNP expression and/or treating prion diseases.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1060" publication-number="202615822">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615822</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122897</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製作絕對位置測量刻度結構之方法</chinese-title>
        <english-title>METHOD OF MAKING ABSOLUTE POSITION MEASUREMENT SCALE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G01D5/347</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商雷尼紹上市公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RENISHAW PLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史提蘭　湯瑪士　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STICKLAND, THOMAS JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞福　席奧多　理查</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REEVE, THEODORE RICHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈登　英葛藍　伊安　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GORDON-INGRAM, IAIN ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於製作包括具有沿著一測量維度延伸之一刻度軌道之一基板之一絕對位置測量刻度結構之方法，該刻度軌道包括一系列刻度特徵，該方法包括經由以下兩個程序製作該等刻度特徵：經組態以根據一預定空間週期&lt;i&gt;p&lt;/i&gt;在該刻度軌道內沿著該測量維度在規則間隔位置處更改該基板以便形成複數個主要特徵之一程序；及經組態以在該刻度軌道內沿著該測量維度在複數個不規則間隔位置處更改該基板以便形成次要特徵之一程序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for making an absolute position measurement scale structure which comprises a substrate having a scale track extending along a measurement dimension, the scale track comprising a series of scale features, the method comprising making the scale features via the following two processes: a process configured to alter the substrate within the scale track at regularly spaced locations along the measurement dimension, according to a predetermined spatial period &lt;i&gt;p&lt;/i&gt;, so as to form a plurality of primary features; and a process configured to alter the substrate within the scale track at plurality of irregularly spaced locations along the measurement dimension so as to form secondary features.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法/程序</p>
        <p type="p">102:第一程序</p>
        <p type="p">103:虛線框</p>
        <p type="p">104:第二程序</p>
        <p type="p">105:選用步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1061" publication-number="202616339">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616339</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122914</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>射頻匹配網路</chinese-title>
        <english-title>RADIO FREQUENCY MATCHING NETWORK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01J37/32</main-classification>
        <further-classification edition="200601120260102B">H05H1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓蒙得四世　愛德華Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMMOND, IV, EDWARD P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫姆　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUMOU, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">某些態樣係關於一種半導體處理裝置。該裝置一般包括複數個腔室外殼，每個腔室外殼包含複數個匹配網路中的一個相應匹配網路和複數個腔室負載中的一個相應腔室負載；以及具有耦接到分割節點的輸入路徑的分割電路。多個分割路徑可能經由多個傳輸線中的一個相應傳輸線耦接於該分割節點與複數個腔室外殼中的一個相應腔室外殼之間，而複數個匹配網路中的每個匹配網路可能耦接於多個傳輸線中的一個相應傳輸線與複數個腔室負載中的一個相應腔室負載之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Certain aspects are directed towards an apparatus for semiconductor processing. The apparatus generally includes a plurality of chamber enclosures, each including a respective one of a plurality of matching networks and a respective one of a plurality of chamber loads and a splitting circuit having an input path coupled to a splitting node. Multiple split paths may be coupled between the splitting node and a respective one of the plurality of chamber enclosures through a respective one of multiple transmission lines, and each of the plurality of matching networks may be coupled between the respective one of the multiple transmission lines and the respective one of the plurality of chamber loads.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:半導體處理電路系統</p>
        <p type="p">202:HF輸入端</p>
        <p type="p">204:分割電路系統</p>
        <p type="p">205:感應元件</p>
        <p type="p">206:電容元件</p>
        <p type="p">208:分割節點</p>
        <p type="p">210:感應元件</p>
        <p type="p">212:電容元件</p>
        <p type="p">214:感測器</p>
        <p type="p">216:RF傳輸線</p>
        <p type="p">218:感應元件</p>
        <p type="p">220:匹配網路</p>
        <p type="p">222:電容元件</p>
        <p type="p">224:電容元件</p>
        <p type="p">226:LPF</p>
        <p type="p">228:LF輸入端</p>
        <p type="p">229:LF輸入端</p>
        <p type="p">230:腔室負載</p>
        <p type="p">240:RF傳輸線</p>
        <p type="p">241:HF訊號產生器</p>
        <p type="p">250:RF腔室</p>
        <p type="p">252:RF腔室</p>
        <p type="p">260:感應元件</p>
        <p type="p">262:電容元件</p>
        <p type="p">264:感測器</p>
        <p type="p">270:匹配網路</p>
        <p type="p">272:腔室負載</p>
        <p type="p">274:LPF</p>
        <p type="p">276:LF訊號產生器</p>
        <p type="p">278:LF訊號產生器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1062" publication-number="202615471">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615471</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122963</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>BCMA　嵌合抗原受體及其用途</chinese-title>
        <english-title>BCMA CHIMERIC ANTIGEN RECEPTORS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07K16/28</main-classification>
        <further-classification edition="200601120260102B">C07K16/30</further-classification>
        <further-classification edition="201001120260102B">C12N5/0783</further-classification>
        <further-classification edition="202501120260102B">A61K35/17</further-classification>
        <further-classification edition="200601120260102B">A61P35/02</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
        <further-classification edition="202501120260102B">A61K40/11</further-classification>
        <further-classification edition="202501120260102B">A61K40/31</further-classification>
        <further-classification edition="200601120260102B">C12N15/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商諾華公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVARTIS AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾柏喬　艾達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABUJOUB, AIDA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛雷明　湯尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLEMING, TONY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　綠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, LU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪　康妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, CONNIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布藍肯錫　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLANKENSHIP, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍姆柏格　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOLMBERG, BRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張重輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHONGHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>部　德秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BU, DEXIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了用於治療與BCMA表現相關的疾病之組成物及方法。本發明還涉及對BCMA具有特異性的嵌合抗原受體（CAR）、編碼其的載體以及包含該BCMA CAR之重組T細胞。本發明還包括施用表現包含BCMA結合結構域的CAR的經遺傳修飾的T細胞之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides compositions and methods for treating diseases associated with expression of BCMA. The invention also relates to chimeric antigen receptor (CAR) specific to BCMA, vectors encoding the same, and recombinant T cells comprising the BCMA CAR. The invention also includes methods of administering a genetically modified T cell expressing a CAR that comprises a BCMA binding domain.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1063" publication-number="202614968">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614968</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122994</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有經改善之彎曲性質的連續分析物感測器</chinese-title>
        <english-title>A CONTINUOUS ANALYTE SENSOR HAVING IMPROVED BENDING PROPERTIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61B5/145</main-classification>
        <further-classification edition="200601120260102B">G01N27/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商羅氏血糖健康醫護公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROCHE DIABETES CARE GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊巴哈　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IBACH, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫伯勒　賽巴斯欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUEBLER, SEBASTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希佛特　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIEFFERT, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林蘭君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種分析物感測器，其包含用於插入至使用者之身體中的活體內部分及用於接附至分析物監測裝置之外部零件的活體外部分。該感測器之該活體內部分及該活體外部分係彎曲為彼此成一角度，藉此限定塗覆有可撓性熱塑性聚合物材料的彎曲區域。進一步地，本發明涉及一種製造新穎分析物感測器之方法以及一種包含該新穎分析物感測器的連續分析物監測系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an analyte sensor comprising an in-vivo portion for insertion into the body of a user and an ex-vivo portion for attachment to the external part of an analyte monitoring device. The in-vivo portion and the ex-vivo portion of the sensor are bent in an angle to each other thereby defining a bending area which is coated with a flexible thermoplastic polymer material. Further, the present invention relates to a method of manufacturing the new analyte sensor and a continuous analyte monitoring system comprising the new analyte sensor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:外部零件</p>
        <p type="p">20:分析物感測器</p>
        <p type="p">22:活體內部分</p>
        <p type="p">24:活體外部分</p>
        <p type="p">26:彎曲區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1064" publication-number="202615472">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615472</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122998</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>結合CCR8之抗體及融合蛋白及其用途</chinese-title>
        <english-title>ANTIBODIES AND FUSION PROTEINS THAT BIND TO CCR8 AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07K16/28</main-classification>
        <further-classification edition="200601120260102B">A61K39/395</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
        <further-classification edition="200601120260102B">C12N15/13</further-classification>
        <further-classification edition="200601120260102B">C12N15/63</further-classification>
        <further-classification edition="200601120260102B">C12N15/64</further-classification>
        <further-classification edition="200601120260102B">G01N33/574</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商基利科學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GILEAD SCIENCES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥格拉思　蘿拉　路易斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCGRATH, LARA LEWIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴皮斯　法比安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEPIS, FABIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡昌云</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, CHANGYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裴斯塔　雷納德　Ｇ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRESTA, LEONARD G.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴格　約書亞　亞當</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUGGE, JOSHUA ADAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供關於抗體及融合蛋白及其用途之多個實施例。一些實施例包括結合CCR8之抗體。一些實施例包括結合CCR8之融合蛋白。此類抗體及融合蛋白可用於治療例如癌症之方法中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are various embodiments relating to antibodies and fusion proteins and uses thereof. Some of the embodiments include antibodies that bind CCR8. Some of the embodiments include fusion proteins that bind CCR8. Such antibodies and fusion proteins can be used in methods to treat, for example, cancer.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1065" publication-number="202615137">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615137</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123000</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電透析系統及電透析裝置之清洗方法</chinese-title>
        <english-title>ELECTRODIALYSIS SYSTEM AND METHOD FOR CLEANING ELECTRODIALYSIS DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B01D61/48</main-classification>
        <further-classification edition="200601120260102B">B01D61/52</further-classification>
        <further-classification edition="200601120260102B">B01D61/58</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商奧璐佳瑙股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORGANO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中野徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANO, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村友綺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木慶介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">電透析系統1A具有：電透析裝置50，係藉由通電來從被處理液生成酸液與鹼液；以及清洗機構20，係清洗電透析裝置50之生成鹼液的鹼室7。在對電透析裝置50通電到鹼室7之處理液的pH值成為7以上，然後停止通電動作，且清洗機構20會使水通水於鹼室7以進行清洗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrodialysis system 1A has an electrodialysis device 50 which uses an electric current to generate an acid solution and an alkali solution from a liquid to be processed, and a cleaning mechanism 20 which cleans the alkali chamber 7 of the electrodialysis device 50 that generates the alkali solution. After passing a current through the electrodialysis device 50 until the pH of the treated liquid in the alkali chamber 7 reaches pH 7 or higher, the electrification operation is stopped and the cleaning mechanism 20 cleans the alkali chamber 7 by passing water through the chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:電透析系統</p>
        <p type="p">2a~2d:閥</p>
        <p type="p">3a:陽極</p>
        <p type="p">3b:陰極</p>
        <p type="p">4:離子交換分隔壁</p>
        <p type="p">5:陰離子交換膜</p>
        <p type="p">6a:陽極室</p>
        <p type="p">6b:陰極室</p>
        <p type="p">7:鹼室</p>
        <p type="p">8:酸室</p>
        <p type="p">10:控制裝置</p>
        <p type="p">11:電源裝置</p>
        <p type="p">12:原液槽</p>
        <p type="p">12a:配管</p>
        <p type="p">12b:配管</p>
        <p type="p">12c:配管</p>
        <p type="p">13:排水槽</p>
        <p type="p">14:回收水槽</p>
        <p type="p">14a:配管</p>
        <p type="p">14b:配管</p>
        <p type="p">20:清洗機構</p>
        <p type="p">21:配管</p>
        <p type="p">50:電透析裝置</p>
        <p type="p">PW:純水</p>
        <p type="p">A:流動方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1066" publication-number="202615961">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615961</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123004</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>反射型空白光罩（Ｍａｓｋ　Ｂｌａｎｋ）及其之製造方法以及反射型空白光罩關連基板的檢測方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260108B">G03F1/24</main-classification>
        <further-classification edition="201201120260108B">G03F1/42</further-classification>
        <further-classification edition="201201120260108B">G03F1/54</further-classification>
        <further-classification edition="201201120260108B">G03F1/84</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武田惇弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEDA, ATSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>棟安陸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUNEYASU, RIKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種能夠在不將缺陷錯誤地檢測為基準標記的情況下，可靠地檢測基準標記的反射型空白光罩及其之製造方法以及反射型空白光罩關連基板的檢測方法。  &lt;br/&gt;　　[解決手段]一種反射型空白光罩，至少具備：基板；多層反射膜，其設置在該基板上，並用於反射曝光光；及吸收體膜，其設置在該多層反射膜之上，並用於吸收前述曝光光；還具備：在前述反射型空白光罩的與前述多層反射膜相同側的表面上所形成的作為缺陷位置的基準位置的基準標記，和用於搜尋該基準標記的基準標記形成區域；前述基準標記形成區域的高度係形成為與該基準標記形成區域的周圍的高度不同；前述基準標記形成為至少一部分包含在前述基準標記形成區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:反射型空白光罩</p>
        <p type="p">10:基板</p>
        <p type="p">20:多層反射膜</p>
        <p type="p">21:對EUV光具有相對高折射率的層(Si層)</p>
        <p type="p">22:對EUV光具有相對低折射率的層(Mo層或Ru層)</p>
        <p type="p">25:堆疊部(Si/Mo堆疊部或Si/Ru堆疊部)</p>
        <p type="p">30:吸收體膜</p>
        <p type="p">40:基準標記</p>
        <p type="p">41:基準標記形成區域</p>
        <p type="p">50:主圖案形成區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1067" publication-number="202615686">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615686</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123020</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鉬沉積</chinese-title>
        <english-title>MOLYBDENUM DEPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">C23C16/04</main-classification>
        <further-classification edition="200601120260114B">C23C16/14</further-classification>
        <further-classification edition="200601120260114B">C23C16/455</further-classification>
        <further-classification edition="200601120260114B">C23C16/50</further-classification>
        <further-classification edition="200601120260114B">C23C16/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格里菲斯　馬修　伯特倫　愛德華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRIFFITHS, MATTHEW BERTRAM EDWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱爾卡爾　桑凱特　沙拉德雷達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KELKAR, SANKET SHARADCHANDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾卡西亞　亞什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARGASYA, YASH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼迪亞　大衛　約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANDIA, DAVID JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布萊克尼　凱爾　喬丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLAKENEY, KYLE JORDAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥德里格　凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MADRIGAL, KEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙瑪　戴維德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHARMA, DAVINDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王塞納克運　潘亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONGSENAKHUM, PANYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡那卡沙巴怕希　希瓦難陀　克里希那</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANAKASABAPATHY, SIVANANDA KRISHNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請案描述含鉬膜的沉積方法和相關設備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and related apparatus for deposition of molybdenum-containing films are described.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1068" publication-number="202616322">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616322</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123021</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於高翹曲晶圓的混合真空靜電夾盤載體</chinese-title>
        <english-title>HYBRID VACUUM ELECTROSTATIC CHUCK CARRIER FOR HIGH WARPAGE WAFERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H01J37/20</main-classification>
        <further-classification edition="200601120260112B">H01J37/26</further-classification>
        <further-classification edition="200601120260112B">H01L21/67</further-classification>
        <further-classification edition="200601120260112B">H01L21/677</further-classification>
        <further-classification edition="200601120260112B">H01L21/683</further-classification>
        <further-classification edition="200601120260112B">H02N13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商應用材料以色列公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS ISRAEL LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜多維奇　歐佛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUDOVITCH, OFER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哲　葉胡達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZUR, YEHUDA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">處理基板的方法包括：將基板定位在第一腔室的基板固持件的上表面，其中基板固持件包含一或多個設置在上表面的真空通道及接近上表面的設置於基板固持件內的一或多個電極；在基板固持件位於第一腔室內時藉由對一或多個真空通道施加真空來吸附並扁平化基板至基板固持件；在基板藉由一或多個真空通道吸附至基板固持件時對一或多個電極施加電壓以進一步利用靜電力吸附基板至基板固持件；在持續利用靜電力吸附基板至基板固持件時將第一腔室抽至真空壓力；在基板藉由靜電力吸附至基板固持件時將基板固持件從第一腔室轉移至在真空條件下的第二腔室；及在基板固持件位於第二腔室內時維持靜電力吸附基板至基板固持件並在第二腔室內以真空壓力處理基板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of processing a substrate comprising: positioning the substrate on an upper surface of a substrate holder in a first chamber, wherein the substrate holder comprises one or more vacuum channels disposed at the upper surface and one or more electrodes disposed within the substrate holder proximate to the upper surface; while the substrate holder is within the first chamber, clamping and flattening the substrate to the substrate holder by applying a vacuum to the one or more vacuum channels; while the substrate is clamped to the substrate holder via the one or more vacuum channels, applying a voltage to the one or more electrodes to further clamp the substrate to the substrate holder with an electrostatic force; pumping out the first chamber to a vacuum pressure while continuing to clamp the substrate to the substrate holder with electrostatic force; while the substrate is clamped to the substrate holder by electrostatic force, transferring the substrate holder from the first chamber into a second chamber under vacuum conditions; and while the substrate holder is within the second chamber, maintaining the electrostatic force clamping the substrate to the substrate holder, and processing the substrate in the second chamber at a vacuum pressure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:流程圖(方法)</p>
        <p type="p">610-690:方法步驟編號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1069" publication-number="202616323">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616323</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123026</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>真空腔室中用於高翹曲晶圓的混合真空靜電吸盤</chinese-title>
        <english-title>HYBRID VACUUM ELECTROSTATIC CHUCK IN VACUUM CHAMBER FOR HIGH WARPAGE WAFERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H01J37/20</main-classification>
        <further-classification edition="200601120260112B">H01J37/26</further-classification>
        <further-classification edition="200601120260112B">H01L21/67</further-classification>
        <further-classification edition="200601120260112B">H01L21/677</further-classification>
        <further-classification edition="200601120260112B">H01L21/683</further-classification>
        <further-classification edition="200601120260112B">H02N13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商應用材料以色列公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS ISRAEL LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜多維奇　歐佛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUDOVITCH, OFER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哲　葉胡達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZUR, YEHUDA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示一種處理基板的方法，包括：將基板轉移到處理腔室中，並將基板定位在處理腔室中基板固持件的上表面上，其中基板固持件包括一或多個位於上表面的真空通道以及一或多個位於基板固持件內接近上表面的電極；當基板固持件位於處理腔室內時，藉由對一或多個真空通道施加真空來吸附並扁平化基板到基板固持件上；當基板藉由一或多個真空通道吸附到基板固持件時，對一或多個電極施加電壓，以進一步藉由靜電力吸附基板到基板固持件；在持續以靜電力吸附基板的同時，將處理腔室抽真空至真空壓力；並在基板由靜電力吸附到基板固持件時，在真空條件下在處理腔室中對基板進行處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of processing a substrate is disclosed that comprises: transferring the substrate into a processing chamber and positioning the substrate on an upper surface of a substrate holder in the processing chamber, wherein the substrate holder comprises one or more vacuum channels disposed at the upper surface and one or more electrodes disposed within the substrate holder proximate to the upper surface; while the substrate holder is within the processing chamber, clamping and flattening the substrate to the substrate holder by applying a vacuum to the one or more vacuum channels; while the substrate is clamped to the substrate holder via the one or more vacuum channels, applying a voltage to the one or more electrodes to further clamp the substrate to the substrate holder with an electrostatic force; pumping out the processing chamber to a vacuum pressure while continuing to clamp the substrate to the substrate with the electrostatic force; and while the substrate is clamped to the substrate holder by the electrostatic force, processing the substrate in the processing chamber under vacuum conditions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">900:扁平化和處理翹曲基板的方法</p>
        <p type="p">910:步驟</p>
        <p type="p">920:步驟</p>
        <p type="p">930:步驟</p>
        <p type="p">940:步驟</p>
        <p type="p">950:步驟</p>
        <p type="p">960:步驟</p>
        <p type="p">970:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1070" publication-number="202615914">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615914</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123027</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>非實體接觸式光纖連接器</chinese-title>
        <english-title>NON-PHYSICAL-CONTACT OPTICAL FIBER CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">G02B6/38</main-classification>
        <further-classification edition="200601120260108B">G02B6/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商爾雅實驗室公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AYAR LABS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　建華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIANHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　崇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">光纖連接器總成包括底板、複數光纖、透鏡陣列、及蓋板。複數v形凹槽係形成在底板的頂面內。複數v形凹槽從底板的背側延伸至底板的前側。複數v形凹槽的每一者接收並對準相應光纖。複數光纖係分別設置在複數v形凹槽內。透鏡陣列係設置在底板的前側上並包括與複數v形凹槽分別對準的複數透鏡，使得複數光纖的光核心係分別與複數透鏡光學耦合。蓋板係設置在複數v形凹槽內的複數光纖上方並且係固定至底板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical fiber connector assembly includes a base plate, a plurality of optical fibers, a lens array, and a cover plate. A plurality of v-grooves are formed within a top surface of the base plate. The plurality of v-grooves extend from a back side of the base plate to a front side of the base plate. Each of the plurality of v-grooves receives and aligns a corresponding optical fiber. The plurality of optical fibers are respectively disposed within the plurality of v-grooves. The lens array is disposed on the front side of the base plate and includes a plurality of lenses respectively aligned with the plurality of v-grooves, such that optical cores of the plurality of optical fibers are respectively optically coupled with the plurality of lenses. The cover plate is disposed over the plurality of optical fibers within the plurality of v-grooves and is secured to the base plate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:NPC光纖連接器總成</p>
        <p type="p">101:底板</p>
        <p type="p">101F:底板之前側</p>
        <p type="p">103-1~103-12:v形凹槽</p>
        <p type="p">105-1~105-12:光纖</p>
        <p type="p">107:蓋板</p>
        <p type="p">109:透鏡陣列</p>
        <p type="p">111-1~111-12:透鏡</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1071" publication-number="202615575">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615575</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123031</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>交聯橡膠物品、含氟共聚物組成物、交聯橡膠物品之製造方法</chinese-title>
        <english-title>CROSS-LINKED RUBBER ARTICLES, FLUORINE-CONTAINING COPOLYMER COMPOSITIONS, AND METHODS OF MANUFACTURING CROSS-LINKED RUBBER ARTICLES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">C08L27/24</main-classification>
        <further-classification edition="200601120260112B">C08F14/26</further-classification>
        <further-classification edition="200601120260112B">C08F214/10</further-classification>
        <further-classification edition="200601120260112B">C08J5/16</further-classification>
        <further-classification edition="200601120260112B">C08J5/22</further-classification>
        <further-classification edition="200601320260112B">B29K105/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田村翼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMURA, TASUKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神守廣一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMIMORI, KOICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳谷碧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANAGIYA, AOI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田口大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAGUCHI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河合剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAI, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴崎浩輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBASAKI, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田武志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種交聯橡膠物品，包含含氟共聚物之交聯物，該含氟共聚物具有以具腈基之單體為主體之單元與以四氟乙烯為主體之單元；且，測定交聯橡膠物品表面之不同10處的60°鏡面光澤度時，不同10處的60°鏡面光澤度中之最小值為1.0~50.0。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1072" publication-number="202615576">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615576</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123034</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>交聯橡膠物品、含氟共聚物組成物</chinese-title>
        <english-title>CROSS-LINKED RUBBER ARTICLES, FLUORINE-CONTAINING COPOLYMER COMPOSITIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">C08L27/24</main-classification>
        <further-classification edition="200601120260112B">C08L35/08</further-classification>
        <further-classification edition="202501120260112B">C08L23/28</further-classification>
        <further-classification edition="200601120260112B">C08F214/26</further-classification>
        <further-classification edition="200601120260112B">C08J5/16</further-classification>
        <further-classification edition="200601120260112B">C08J5/22</further-classification>
        <further-classification edition="202301120260112B">H10K71/16</further-classification>
        <further-classification edition="200601120260112B">D06M13/493</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神守廣一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMIMORI, KOICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田村翼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMURA, TASUKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳谷碧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANAGIYA, AOI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴崎浩輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBASAKI, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田武志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田口大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAGUCHI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河合剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAI, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示交聯橡膠物品包含含氟共聚物之交聯物，並且以試驗1之方法對交聯橡膠物品施行完濺鍍處理時，濺鍍處理後之交聯橡膠物品表面的算術平均高度Sa大於1.6µm，且濺鍍處理後之交聯橡膠物品表面的長寬比Str為0.90以下。試驗1：將交聯橡膠物品載置於離子濺鍍裝置之試料台上，並將試料台之交聯橡膠物品之載置面與由鉑構成之靶材的距離設定成35mm。接著，將離子濺鍍裝置之試料室內的真空度設定成6kPa後，以靶材附加電流值25mA放電30秒鐘，對交聯橡膠物品施行濺鍍處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1073" publication-number="202615873">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615873</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123038</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接觸子中間製品及接觸子中間製品的切斷方法</chinese-title>
        <english-title>CONTACTOR INTERMEDIATE PRODUCTS AND METHOD OF CUTTING CONTACTOR INTERMEDIATE PRODUCTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G01R1/067</main-classification>
        <further-classification edition="200601120260102B">G01R1/073</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本麥克隆尼股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KABUSHIKI KAISHA NIHON MICRONICS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>那須美佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NASU, MIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村本剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAMOTO, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山內優輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAUCHI, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林崎孝幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHIZAKI, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種接觸子中間製品及接觸子中間製品的製造方法，可以不會損傷接觸子且容易將接觸子從基板剝離。  &lt;br/&gt;　　[技術內容]本發明的接觸子中間製品，具備：直線狀的接觸子、及與接觸子的一端部連結的矩形狀的標籤，標籤，具有：與接觸子連結的矩形狀的本體部、及從本體部突出的舌片部。本發明的接觸子中間製品製造方法，是將剝離用止動器與標籤的一端接觸，將標籤朝與剝離用止動器接觸的側移動，以剝離用止動器及標籤的接觸點作為支點使標籤旋轉，利用藉由標籤的旋轉發生的力而使被固定於基板上的固定標籤被切斷，使標籤及固定標籤被切離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:接觸子中間製品</p>
        <p type="p">10:基板</p>
        <p type="p">11:探針</p>
        <p type="p">20:主標籤</p>
        <p type="p">21:第1標籤</p>
        <p type="p">22:第2標籤</p>
        <p type="p">100:基板上中間製品</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1074" publication-number="202616495">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616495</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123126</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>導熱片、散熱裝置以及導熱片的製造方法</chinese-title>
        <english-title>HEAT CONDUCTION SHEET, HEAT DISSIPATING DEVICE, AND METHOD OF MANUFACTURING HEAT CONDUCTION SHEET</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">H01L23/36</main-classification>
        <further-classification edition="201801120260114B">C09J7/29</further-classification>
        <further-classification edition="200601120260114B">F28F3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後藤昭人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTO, AKIHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小舩美香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBUNE, MIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉原佑介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIHARA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡田穣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKADA, YUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>横山耕祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOYAMA, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新林良太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIIBAYASHI, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海野篤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMINO, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種導熱片，包括：導熱層，含有碳系材料（A）；以及接著層，包含樹脂成分以及導熱性填料，且位於所述導熱層的主表面的至少一部分，接著層的表面粗糙度為7.0 μm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heat conduction sheet includes a heat conduction layer containing a carbon‐based material (A), and an adhesive layer which contains a resin component and a heat conductive filler and which is positioned on at least a portion of a main surface of the heat conduction layer, and a surface roughness of the adhesive layer is 7.0 μm or less.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:導熱片</p>
        <p type="p">11:導熱層</p>
        <p type="p">12、13:接著層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1075" publication-number="202615465">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615465</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123158</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多特異性抗原結合蛋白</chinese-title>
        <english-title>MULTISPECIFIC ANTIGEN BINDING PROTEINS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">C07K16/24</main-classification>
        <further-classification edition="200601120260112B">A61K39/395</further-classification>
        <further-classification edition="200601120260112B">C12N15/13</further-classification>
        <further-classification edition="200601120260112B">C12N15/63</further-classification>
        <further-classification edition="200601120260112B">C12N15/64</further-classification>
        <further-classification edition="200601120260112B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商葛蘭素史密斯克藍智慧財產發展有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLAXOSMITHKLINE INTELLECTUAL PROPERTY DEVELOPMENT LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭　豔霞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, YANXIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納格帕爾　桑尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGPAL, SUNIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩恩　海倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAYNE, HELEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托克　喬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOCKER, JOEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供結合至一或多種細胞介素(更特別地促炎性細胞介素)之多特異性抗原結合蛋白。詳言之，本發明係關於包含介白素18 (IL-18)結合域及介白素23 (IL-23)結合域之多特異性抗原結合蛋白，及該等多特異性抗原結合蛋白在醫學中之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides multispecific antigen binding proteins that bind to one or more cytokines, more particularly to pro-inflammatory cytokines. In particular, the present disclosure relates to multispecific antigen binding proteins that comprise an interleukin 18 (IL-18) binding domain and an interleukin 23 (IL-23) binding domain, and the use of said multispecific antigen binding proteins in medicine.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1076" publication-number="202616883">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616883</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123183</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251119B">H10D84/01</main-classification>
        <further-classification edition="202501120251119B">H10D84/83</further-classification>
        <further-classification edition="202501120251119B">H10D30/62</further-classification>
        <further-classification edition="202501120251119B">H10D88/00</further-classification>
        <further-classification edition="200601120251119B">B82B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊愷潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KAI-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳思樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SZU-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫偉源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOON, WEI-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖　思雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包括形成包括交替的半導體奈米結構及虛擬奈米結構的多層堆疊；形成下部源極/汲極區在下部源極/汲極區上方形成上部源極/汲極區；移除虛擬奈米結構以在下部半導體奈米結構之間形成第一開口並在上部半導體奈米結構之間形成第二開口；在下部半導體奈米結構及上部半導體奈米結構周圍形成閘極介電層；在下部半導體奈米結構周圍及第一開口中形成下部閘極電極；在下部閘極電極的頂表面上方選擇性地沉積虛擬層，虛擬層包括第一聚合物；及在上部半導體奈米結構周圍及第二開口中形成上部閘極電極。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes forming a multi-layer stack including alternating semiconductor nanostructures and dummy nanostructures, forming lower source/drain regions, forming upper source/drain regions over the lower source/drain regions, removing the dummy nanostructures to form first openings between the lower semiconductor nanostructures, and second openings between the upper semiconductor nanostructures, forming a gate dielectric layer around the lower semiconductor nanostructures and the upper semiconductor nanostructures, forming a lower gate electrode around the lower semiconductor nanostructures and in the first openings, selectively depositing a dummy layer over top surfaces of the lower gate electrode, the dummy layer including a first polymer, and forming an upper gate electrode around the upper semiconductor nanostructures and in the second openings.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:基板</p>
        <p type="p">62:鰭片</p>
        <p type="p">66L:下部半導體奈米結構</p>
        <p type="p">66M:中間半導體奈米結構</p>
        <p type="p">66U:上部半導體奈米結構</p>
        <p type="p">70:隔離區</p>
        <p type="p">100:隔離結構</p>
        <p type="p">132:閘極介電質</p>
        <p type="p">134L:下部閘極電極</p>
        <p type="p">134U:上部閘極電極</p>
        <p type="p">152:蝕刻終止層</p>
        <p type="p">154:第三層間介電質</p>
        <p type="p">156:閘極觸點</p>
        <p type="p">164:導電層</p>
        <p type="p">166:導電層</p>
        <p type="p">168:隔離層</p>
        <p type="p">174:上部閘極電極層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1077" publication-number="202615254">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615254</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123191</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>層疊板、層疊板的製造方法、及減少層疊板降解之摻雜物的用途</chinese-title>
        <english-title>LAMINATE, METHOD FOR PRODUCING LAMINATE, AND USE OF DOPANT FOR REDUCING DEGRADATION OF LAMINATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">B32B17/10</main-classification>
        <further-classification edition="200601120260114B">B32B7/12</further-classification>
        <further-classification edition="200601120260114B">B32B27/08</further-classification>
        <further-classification edition="200601120260114B">B32B27/36</further-classification>
        <further-classification edition="200601120260114B">C08K3/04</further-classification>
        <further-classification edition="200601120260114B">H05B3/84</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商卡纳圖芬蘭有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANATU FINLAND OY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索利曼　艾哈邁德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOLIMAN, AHMED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>EG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓊圖寧　塔內利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNTUNEN, TANELI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露關於層疊板(1)。層疊板(1)包括第一層(11)，其含有至少一碳的同素異形體與一摻雜物。層疊板(1)包括第二層(12)，其包括有機材料。基於第一層(11)的表面積的第一層(11)中的摻雜物的濃度為25 nmol/cm&lt;sup&gt;2&lt;/sup&gt;至1000 nmol/cm&lt;sup&gt;2&lt;/sup&gt;。本揭露亦關於層疊板(1)的製造方法。方法包括提供第一層(11)，其包括至少一碳的同素異形體與摻雜物。方法包括提供第二層(12)，其包括有機材料。第一層(11)中的摻雜物的濃度為25 nmol/cm&lt;sup&gt;2&lt;/sup&gt;至1000 nmol/cm&lt;sup&gt;2&lt;/sup&gt;。本發明亦關於減少層疊板降解之摻雜物的用途，且摻雜物的濃度為25 nmol/cm&lt;sup&gt;2&lt;/sup&gt;至1000 nmol/cm&lt;sup&gt;2&lt;/sup&gt;。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure relates to a laminate (1). The laminate (1) comprises a first layer (11) comprising at least one allotrope of carbon and a dopant. The laminate (1) comprises a second layer (12) comprising organic material. The concentration of dopant in the first layer (11) is 25 to 1000 nmol/cm&lt;sup&gt;2&lt;/sup&gt;, based on the surface area of the first layer (11). The disclosure relates also to a method for producing a laminate (1). The method comprises providing a first layer (11) comprising at least one allotrope of carbon and a dopant. The method comprises providing a second layer (12) comprising organic material. The concentration of dopant in the first layer (11) is 25 to 1000 nmol/cm&lt;sup&gt;2&lt;/sup&gt;. The disclosure relates also to the use of a dopant in a concentration of 25 to 1000 nmol/cm&lt;sup&gt;2&lt;/sup&gt; for reducing degradation of a laminate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:層疊板</p>
        <p type="p">11:第一層</p>
        <p type="p">12:第二層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1078" publication-number="202616340">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616340</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123269</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有多相前驅物遞送的反應腔室</chinese-title>
        <english-title>REACTION CHAMBER WITH MULTI PHASE PRECURSOR DELIVERY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">H01J37/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　天發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴拉蘇拔馬尼安　葛尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BALASUBRAMANIAN, GANESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加納基拉曼　卡希克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANAKIRAMAN, KARTHIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅查阿爾瓦雷斯　胡安卡洛斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROCHA-ALVAREZ, JUAN CARLOS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓　新海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, XINHAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾庫特　艾丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AYKUT, AYDIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史威尼　凱莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SWEENEY, KELLY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐘廣顏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHONG, GUANGYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐘馨怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHONG, XINYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">示範性的半導體處理系統可以包括至少一個處理腔室。至少一個處理腔室中的每一個可以包括氣體分配組件。該系統可以包括與每個氣體分配組件流體連接的氣體分配盤。該系統可以包括與氣體分配盤流體連接的遠端前驅物遞送系統。該遠端前驅物遞送系統可以包括與非氣態前驅物相關的前驅物源。該前驅物源可以操作以從非氣態前驅物生成蒸汽。該遠端前驅物遞送系統可以包括可操作以控制蒸汽流向氣體分配盤的流量控制器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Exemplary semiconductor processing systems may include at least one processing chamber. Each of the at least one processing chamber may include a gas distribution assembly. The systems may include a gas panel that is fluidly coupled with each gas distribution assembly. The systems may include a remote precursor delivery system that is fluidly coupled with the gas panel. The remote precursor delivery system may include a precursor source associated with a non-gaseous precursor. The precursor source may be operable to generate a vapor from the non-gaseous precursor. The remote precursor delivery system may include a flow controller that is operable to control a flow of the vapor to the gas panel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:處理系統</p>
        <p type="p">305:處理腔室</p>
        <p type="p">310:氣體分配組件</p>
        <p type="p">315:輸出歧管</p>
        <p type="p">320:遠端電漿單元</p>
        <p type="p">325:氣體分配盤</p>
        <p type="p">330:前驅物源</p>
        <p type="p">335a:遠端前驅物遞送系統</p>
        <p type="p">335b:遠端前驅物遞送系統</p>
        <p type="p">340a:前驅物源</p>
        <p type="p">340b:前驅物源</p>
        <p type="p">345a:流量控制器</p>
        <p type="p">345b:流量控制器</p>
        <p type="p">350a:遞送管線</p>
        <p type="p">350b:遞送管線</p>
        <p type="p">355a:感測器</p>
        <p type="p">355b:感測器</p>
        <p type="p">360:液體蒸發器</p>
        <p type="p">365:加熱器</p>
        <p type="p">370:淨化管路</p>
        <p type="p">375:控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1079" publication-number="202615332">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615332</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123271</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氨分解設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251111B">C01B3/04</main-classification>
        <further-classification edition="200601120251111B">B01D53/76</further-classification>
        <further-classification edition="200601120251111B">B01D53/86</further-classification>
        <further-classification edition="202201120251111B">B01D46/82</further-classification>
        <further-classification edition="200601120251111B">B01D53/58</further-classification>
        <further-classification edition="200601120251111B">B01J23/755</further-classification>
        <further-classification edition="200601120251111B">B01J23/46</further-classification>
        <further-classification edition="201801120251111B">F24S50/80</further-classification>
        <further-classification edition="201801120251111B">F24S20/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本碍子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGK INSULATORS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鳥井淳史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORII, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">氨分解設備係，包括聚光裝置、氨分解裝置、檢測裝置、以及控制裝置。聚光裝置係，聚集太陽光。氨分解部係，將藉由聚光裝置聚集的太陽光作為熱源使用而分解氨、且產生氫。檢測裝置係，檢測從由太陽光的照射量以及氨分解裝置的溫度所組成的群組選擇的至少一個物理量。控制裝置係，因應檢測裝置所檢測的物理量，控制被供給到氨分解裝置的氨的量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:氨分解設備</p>
        <p type="p">2:聚光裝置</p>
        <p type="p">3:氨分解裝置</p>
        <p type="p">4:供給管線</p>
        <p type="p">5:排出管線</p>
        <p type="p">6:檢測裝置</p>
        <p type="p">7:控制裝置</p>
        <p type="p">21:反射板</p>
        <p type="p">22:追蹤裝置</p>
        <p type="p">61:第一照度計</p>
        <p type="p">FL:焦線</p>
        <p type="p">FP:焦點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1080" publication-number="202615908">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615908</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123338</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>共封裝光學的系統與方法</chinese-title>
        <english-title>SYSTEM AND METHODS FOR CO-PACKAGE OPTICS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251203B">G02B6/12</main-classification>
        <further-classification edition="200601120251203B">G02B6/13</further-classification>
        <further-classification edition="200601120251203B">H01L23/28</further-classification>
        <further-classification edition="200601120251203B">H01L23/473</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　又坪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, WOOPOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中所揭露的系統、方法及裝置可包括具有第一附接位置及第二附接位置的基板，在第一附接位置內可安裝有第一光子積體電路，且在第二附接位置內可安裝有橋接器。第一計算裝置可安裝在基板上，且至少部分地在第一附接位置及第二附接位置上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems, methods and devices disclosed herein may include a substrate having a first attachment location and a second attachment location, a first photonic integrated circuit may be mounted within the first attachment location, and a bridge may be mounted within the second attachment location. A first compute device may be mounted on the substrate and at least partially over the first attachment location and the second attachment location.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:裝置封裝架構</p>
        <p type="p">101:基板</p>
        <p type="p">102:第一裝置</p>
        <p type="p">104:第二裝置</p>
        <p type="p">106:第一光學連接件</p>
        <p type="p">108:嵌入式橋接器</p>
        <p type="p">109:附接膜</p>
        <p type="p">110:第一PIC</p>
        <p type="p">112:第一重佈線層(RDL)</p>
        <p type="p">114:穿孔</p>
        <p type="p">116:第二RDL</p>
        <p type="p">118:導電連接件</p>
        <p type="p">120:介電接合件</p>
        <p type="p">122:基板內連線</p>
        <p type="p">130:支撐基板</p>
        <p type="p">X、Y:方向軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1081" publication-number="202615259">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615259</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123342</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學積層體、偏光透鏡及眼用器具</chinese-title>
        <english-title>OPTICAL LAMINATE, POLARIZING LENS AND EYEWEAR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">B32B27/30</main-classification>
        <further-classification edition="200601120260114B">B32B27/36</further-classification>
        <further-classification edition="201901120260114B">B32B7/023</further-classification>
        <further-classification edition="200601120260114B">G02B5/22</further-classification>
        <further-classification edition="200601120260114B">G02B5/30</further-classification>
        <further-classification edition="200601120260114B">G02C7/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本化藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON KAYAKU KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片倉隼人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAKURA, HAYATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>相澤良祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIZAWA, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀬川淳一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEGAWA, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沼陽介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUMA, YOUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川島孝之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASHIMA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古川真紀子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUKAWA, MAKIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅原健史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGAWARA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關一種光學積層體(100、110)，係具備：支撐體(10)、偏光元件(20)、及在支撐體(10)及偏光元件(20)之間至少一層的接著層(30)；且，  偏光元件(20)係在CIE 1976 L&lt;sup&gt;＊&lt;/sup&gt;a&lt;sup&gt;＊&lt;/sup&gt;b&lt;sup&gt;＊&lt;/sup&gt;色空間中之色相值a&lt;sup&gt;＊&lt;/sup&gt;s及b&lt;sup&gt;＊&lt;/sup&gt;s分別為屬於-5以上5以下之範圍的灰色之聚乙烯醇系偏光膜，接著層(30)之至少一層係包含複數之調整光學積層體(100、110)的色相及可見光區域之穿透率的色相調整色素，且，前述色相調整色素係包含下列(A)至(C)之色素的至少一種，  (A)藍色系之色素(在600nm以上700nm以下之波長區域具有極大吸收波長)  (B)綠色系之色素(在500nm以上600nm以下之波長區域具有極大吸收波長的)  (C)紅色系之色素(在400nm以上500nm以下之波長區域具有極大吸收波長)</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an optical laminate (100, 110) comprising a support (10), a polarizing element (20), and at least one adhesive layer (30) between the support (10) and the polarizing element (20). The polarizing element (20) is a gray polyvinyl alcohol-based polarizing film having hue values ​​a*s and b*s in the CIE 1976 L*a*b* color space ranging from -5 to 5, and at least one adhesive layer (30) contains a plurality of hue adjustment pigments that adjust the hue and visible light transmittance of the optical laminate (100, 110), and the hue adjustment dyes contain at least one of the following pigments (A) to (C)： &lt;br/&gt;(A) blue pigment (having a maximum absorption wavelength in the wavelength range of 600 nm or higher and 700 nm or lower ) &lt;br/&gt;(B) green pigment (having a maximum absorption wavelength in the wavelength range of 500 nm or higher and 600 nm or lower) &lt;br/&gt;(C) red pigment (having a maximum absorption wavelength in the wavelength range of 400 nm or higher and 500 nm or lower).</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:支撐體</p>
        <p type="p">20:偏光元件</p>
        <p type="p">30:接著層</p>
        <p type="p">40:透鏡基材</p>
        <p type="p">100:光學積層體</p>
        <p type="p">200:眼用器具</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1082" publication-number="202615437">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615437</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123359</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種稠雜環化合物、其製備方法及用途</chinese-title>
        <english-title>FUSED HETEROCYCLIC COMPOUND, PREPARATION METHODS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C07D519/00</main-classification>
        <further-classification edition="200601120260105B">C07D487/14</further-classification>
        <further-classification edition="200601120260105B">C07D491/22</further-classification>
        <further-classification edition="200601120260105B">C07D498/22</further-classification>
        <further-classification edition="200601120260105B">A61K31/437</further-classification>
        <further-classification edition="200601120260105B">A61K31/5386</further-classification>
        <further-classification edition="200601120260105B">A61K31/553</further-classification>
        <further-classification edition="200601120260105B">A61P37/00</further-classification>
        <further-classification edition="200601120260105B">A61P29/00</further-classification>
        <further-classification edition="200601120260105B">A61P11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海美悅生物科技發展有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI MEIYUE BIOTECH DEVELOPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳友喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YOUXI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃年峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, NIANFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳現民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XIANMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳永凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YONGKAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>付賢磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, XIANLEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種稠雜環化合物、其製備方法和用途。具體提供了一類式(IG)所示的稠雜環化合物或其藥學上可接受的鹽，式(IG)中各基團如說明書中所定義，其可用於製備藥物，特別是製備預防和/或治療c-kit介導的疾病或病症的藥物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a fused heterocyclic compound, preparation methods and uses thereof. Specifically, the present invention provides a class of fused heterocyclic compounds represented by formula (IG) or pharmaceutically acceptable salts thereof, wherein the groups in formula (IG) are as defined in the specification. These compounds can be used to prepare medicaments, particularly medicaments for preventing and/or treating diseases or conditions mediated by c-kit.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1083" publication-number="202615473">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615473</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123375</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含抗免疫檢查點抗體或其片段和單鏈ＴＮＦＲＳＦ配體多聚體之結合蛋白</chinese-title>
        <english-title>BINDING PROTEINS COMPRISING AN ANTI-IMMUNE CHECKPOINT ANTIBODY OR A FRAGMENT THEREOF AND SINGLE-CHAIN TNFRSF LIGAND MULTIMERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C07K16/28</main-classification>
        <further-classification edition="200601120260105B">A61K39/395</further-classification>
        <further-classification edition="200601120260105B">C07K16/46</further-classification>
        <further-classification edition="200601120260105B">C12N15/13</further-classification>
        <further-classification edition="200601120260105B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商賽諾菲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANOFI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧茲格爾布魯德勒　塞維姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OEZGUER BRUEDERLE, SEVIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威爾　桑德拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEIL, SANDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜普雷茲　林德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUPREZ, LINDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩松　英格麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASSOON, INGRID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博杜安　傑若米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAUDHUIN, JEREMY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉奧　埃爾科萊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAO, ERCOLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝爾　克里斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIL, CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種特異性結合至少兩個蛋白質的結合蛋白，其中該結合蛋白包含（i）特異性結合第一蛋白質的抗體或抗體片段，以及（ii）多聚體，其中該多聚體中的每個單體各自特異性結合第二目標，且其中該多聚體插入在抗體或抗體片段的VH域和CH1域之間。在某些實施例中，第一目標是免疫檢查點分子，第二目標是TNFRSF成員，且該多聚體是TNFRSF配體的多聚體。本發明還涉及包含所述結合蛋白的醫藥組成物及其在癌症治療中的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a binding protein that specifically binds at least two proteins, wherein said binding protein comprises (i) an antibody or antibody fragment specially binding a first protein and (ii) a multimer, wherein each monomer of the multimer specifically binds a second target and wherein the multimer is inserted between the VH domain and the CH1 domain of the antibody or antibody fragment. In some embodiments, the first target is an immune checkpoint molecule, the second target is a TNFRSF member and the multimer is a multimer of a TNFRSF ligand. The present invention also relates to a pharmaceutical composition comprising said binding protein and the use thereof for the treatment of cancer.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1084" publication-number="202615060">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615060</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123422</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於肝外遞送之整合素配體</chinese-title>
        <english-title>INTEGRIN LIGANDS FOR EXTRAHEPATIC DELIVERY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/7088</main-classification>
        <further-classification edition="200601120260102B">A61K31/535</further-classification>
        <further-classification edition="200601120260102B">A61K31/506</further-classification>
        <further-classification edition="200601120260102B">A61K31/4375</further-classification>
        <further-classification edition="200601120260102B">A61K31/437</further-classification>
        <further-classification edition="201001120260102B">C12N15/113</further-classification>
        <further-classification edition="200601120260102B">A61P11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾拉倫製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALNYLAM PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕納里斯　喬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANARESE, JOE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奈爾　加亞普拉卡什　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAIR, JAYAPRAKASH K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英格里亞　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INGOGLIA, BRYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於抑制目標基因表現之雙股核糖核酸(dsRNA)劑、包含此等dsRNA劑之組合物，及使用其治療患有可因減少目標基因表現而受益之病症的個體之方法，該等dsRNA劑包含：與目標基因互補之反義股；與該反義股互補且與該反義股形成雙股區之有義股；及與至少一個股接合之至少一種α-v-β-6 (αvβ6)整合素靶向配體，其介導遞送至肝外組織，例如肌肉組織(例如骨骼肌組織及/或心肌組織)或肺組織。該dsRNA可視情況含有活體內遞送促進劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides double stranded ribonucleic acid (dsRNA) agents for inhibiting expression of a target gene, comprising an antisense strand which is complementary to the target gene; a sense strand which is complementary to the antisense strand and forms a double stranded region with the antisense strand; and at least one alpha-v-beta-6 (αvβ6) integrin targeting ligand that mediates delivery to an extrahepatic tissues, &lt;i&gt;e.g.,&lt;/i&gt; muscle tissue, &lt;i&gt;e.g.,&lt;/i&gt; skeletal muscle tissue and/or cardiac muscle tissue, or lung tissue, conjugated to at least one strand, compositions comprising such dsRNA agents, and methods of use thereof for treating a subject having a disorder that would benefit from reduction in expression of the target gene. The dsRNA may optionally contain an &lt;i&gt;in vivo&lt;/i&gt; delivery enhancing agent.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1085" publication-number="202615415">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615415</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123430</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於熱穩定鈣鈦礦之動態鈍化劑及相關鈣鈦礦太陽能電池</chinese-title>
        <english-title>DYNAMIC PASSIVATOR FOR THERMALLY STABLE PEROVSKITES AND ASSOCIATED PEROVSKITE SOLAR CELL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">C07C333/02</main-classification>
        <further-classification edition="202301120251201B">H10K30/50</further-classification>
        <further-classification edition="202301120251201B">H10K85/50</further-classification>
        <further-classification edition="202301120251201B">H10K85/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港城市大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CITY UNIVERSITY OF HONG KONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮憲平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, SHIEN-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王瑋婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WEI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何品毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明聚焦於推進鈣鈦礦太陽能電池(perovskite solar cell；PSC)，其係藉由改良在製造及運行期間鈣鈦礦光活性層內之離子缺陷的管理來進行。傳統鈣鈦礦鈍化劑傾向於在沉積之後保持固定在表面上，但鈣鈦礦對環境條件敏感，該等環境條件可能改變其結構且產生新的缺陷。因此，習知鈍化劑通常無法有效解決此等變化。此新發明將硫胺甲酸酯鍵併入鈍化分子中，從而使其在高溫下解離且釋放額外鈍化劑以鈍化新形成的缺陷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention focuses on advancing perovskite solar cells (PSCs) by improving the management of ionic defects within the perovskite photoactive layer during both fabrication and operation. Traditional perovskite passivators tend to remain fixed on the surface after deposition, but perovskites are sensitive to environmental conditions that can alter their structure and create new defects. As a result, conventional passivators are often ineffective in addressing these changes. This innovation incorporates thiocarbamate bonds into the passivating molecules, allowing them to dissociate under high temperatures and release additional passivators to passivate newly formed defects.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1086" publication-number="202615988">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615988</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123452</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用資料至文字機器翻譯進行光源系統狀態追蹤及維護的設備與程序</chinese-title>
        <english-title>APPARATUSES AND PROCESSES FOR LIGHT SOURCE SYSTEM STATUS TRACKING AND MAINTENANCE UTILIZING DATA TO TEXT MACHINE TRANSLATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">G03F7/20</main-classification>
        <further-classification edition="202301120260113B">G06Q10/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商希瑪有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CYMER, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威爾斯　內森　吉布森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WELLS, NATHAN GIBSON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史蒂文斯　克里斯多夫　詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEVENS, CHRISTOPHER JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邁索爾　納加拉傑　迪普提</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MYSORE NAGARAJ, DEEPTHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕斯科　吉安　保羅　庫斯托迪奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PASCO, GIAN PAOLO CUSTODIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種光源系統，其包括：兩個或更多個光源系統模組；及一控制器，其與該等模組通信，該控制器經組態以：(1)接收及儲存來自該光源系統之多變量時間數列(time series)效能及/或診斷資料，包括來自該兩個或更多個模組之資料；及(2)週期性地及/或回應於一觸發信號，藉由使用一序列(sequence)至序列轉換器將一轉換器輸入資料序列轉換成一文字序列來產生一生成文字序列，該轉換器輸入資料序列至少部分地自所儲存之多變量時間數列效能及/或診斷資料生成，該生成文字序列包括對以下中之一或多者的一指示：(a)該光源系統之一狀態；(b)對該光源系統之一維護動作；及(c)對該光源系統之一監測動作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light source system includes two or more light source system modules and a controller in communication with the modules, the controller configured to (1) receive and store multivariate time series performance and/or diagnostic data from the light source system including data from the two or more modules and (2) periodically and/or in response to a triggering signal, produce a generated text sequence by transforming a transformer input data sequence into a text sequence using a sequence-to-sequence transformer, the transformer input data sequence generated at least in part from the stored multivariate time series performance and/or diagnostic data, the generated text sequence including an indication of one or more of (a) a status of the light source system, (b) a maintenance action for the light source system, and (c) a monitoring action for the light source system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">330:方法</p>
        <p type="p">332:多變量時間數列資料</p>
        <p type="p">333:柵格</p>
        <p type="p">334a:字串序列資料</p>
        <p type="p">334b:字串序列資料</p>
        <p type="p">336:序列至序列轉換器</p>
        <p type="p">338:生成文字序列</p>
        <p type="p">340:值</p>
        <p type="p">350:值</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1087" publication-number="202615238">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615238</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123454</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>成型機與成型方法、以及射出裝置及其製造方法</chinese-title>
        <english-title>MOLDING MACHINE AND MOLDING METHOD, INJECTION DEVICE, AND METHOD FOR PRODUCING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">B29C45/07</main-classification>
        <further-classification edition="200601120260114B">B29C45/64</further-classification>
        <further-classification edition="200601120260114B">B29C45/76</further-classification>
        <further-classification edition="200601120260114B">B29C45/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本製鋼所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE JAPAN STEEL WORKS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤田靖彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWADA, YASUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>天内康裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMAUCHI, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡和司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKA, KAZUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係提供可因應各種成型製程之成型機。&lt;br/&gt;成型機1具有：射出裝置2、鎖模裝置3，該射出裝置具有於水平方向延伸之射出缸11及安裝於射出缸11之射出部51；該鎖模裝置具有：可安裝下模具M1之下模板101、可安裝上模具M2之上模板102、將下模板101與上模板102中至少任一者朝鉛直方向驅動之模板驅動裝置103。射出部51具有射出噴嘴52，射出噴嘴52之繞射出缸11的中心軸CL之角度為可改變。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the invention is to provide a molding machine that is adaptable to a variety of molding processes.&lt;br/&gt;A molding machine 1 comprises: an injection device 2 having an injection cylinder 11 extending in the horizontal direction and an injection section 51 attached to the injection cylinder 11, and a mold clamping device 3 having a lower plate 101 to which a lower mold M1 can be attached, an upper plate 102 to which an upper mold M2 can be attached, and a mold plate drive device 103 which drives at least one or other of the lower plate 101 and the upper plate 102 in the vertical direction. The injection section 51 has an injection nozzle 52, and the angle of the injection nozzle 52 is variable around the central axis CL of the injection cylinder 11.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:射出缸</p>
        <p type="p">12:螺絲</p>
        <p type="p">13:凹部</p>
        <p type="p">14:陰螺紋</p>
        <p type="p">15:面</p>
        <p type="p">16:底面</p>
        <p type="p">18:內部空間</p>
        <p type="p">51:射出部</p>
        <p type="p">52:射出噴嘴</p>
        <p type="p">53:支持部</p>
        <p type="p">54:凸緣構件</p>
        <p type="p">55:流路部</p>
        <p type="p">56:噴嘴安裝部</p>
        <p type="p">57:流路</p>
        <p type="p">58:陰螺紋</p>
        <p type="p">59:陽螺紋</p>
        <p type="p">60:流路</p>
        <p type="p">61:流路</p>
        <p type="p">62:孔</p>
        <p type="p">63:孔</p>
        <p type="p">64:陰螺紋</p>
        <p type="p">65:套管固持面</p>
        <p type="p">68:陽螺紋</p>
        <p type="p">69:圓筒部</p>
        <p type="p">70:凸緣</p>
        <p type="p">71:貫穿孔</p>
        <p type="p">72:缸對向面</p>
        <p type="p">73:套管對向面</p>
        <p type="p">81:套管</p>
        <p type="p">82:陽螺紋</p>
        <p type="p">B-B:線</p>
        <p type="p">C-C:線</p>
        <p type="p">CL:中心軸</p>
        <p type="p">G:間隙</p>
        <p type="p">X:方向</p>
        <p type="p">Y:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1088" publication-number="202616386">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616386</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123464</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鑲嵌蝕刻方法及設備</chinese-title>
        <english-title>METHOD AND APPARATUS FOR DAMASCENE ETCHING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">H01L21/311</main-classification>
        <further-classification edition="200601120260115B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山多斯　李維拉　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANTOS RIVERA, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CO</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松原稜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUBARA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種晶圓蝕刻方法，包括將晶圓置於蝕刻設備的腔室中。晶圓包括低k值介電材料層、介電材料層上方的介電硬遮罩層，以及介電硬遮罩層上方的鎢基金屬硬遮罩層。方法進一步包括：藉由腔室中的第一蝕刻氣體蝕刻鎢基金屬硬遮罩層，以及藉由腔室中的第二蝕刻氣體蝕刻介電硬遮罩層。因此，金屬硬遮罩層與介電硬遮罩層的蝕刻可於單一相同蝕刻設備中執行，從而有利地節省蝕刻製程的成本與時間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for etching a wafer includes providing the wafer in a chamber of an etching apparatus. The wafer includes a low-k dielectric material layer, a dielectric hard mask layer over the dielectric material layer, and a tungsten-based metal hard mask layer over the dielectric hard mask layer. The method further includes etching the tungsten-based metal hard mask layer by a first etchant gas in the chamber, and etching the dielectric hard mask layer by a second etchant gas in the chamber. Therefore, the etchings of the metal hard mask layer and the dielectric hard mask layer can be performed in the single same etching apparatus, thereby advantageously saving the cost and time of the etching processes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:晶圓</p>
        <p type="p">110:蝕刻停止(ESL)層</p>
        <p type="p">120:介電材料層</p>
        <p type="p">130:介電硬遮罩(DHM)層</p>
        <p type="p">140:鎢基硬遮罩(MHM)層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1089" publication-number="202616341">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616341</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123476</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防止電弧的加熱器材料</chinese-title>
        <english-title>HEATER MATERIALS TO PREVENT ARCING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H01J37/32</main-classification>
        <further-classification edition="200601120260112B">H05B3/14</further-classification>
        <further-classification edition="200601120260112B">H05B3/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚　亞利森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAU, ALLISON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>札那　馬諾哲古瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANA, MANOJ KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅世晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, SHICHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林文珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEN-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于　航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕迪　迪內什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PADHI, DEENESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高若特拉　安奇特艾托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GORATELA, ANKIT ATUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉馬林格　齊達巴拉Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMALINGAM, CHIDAMBARA A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍　凱瑟琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOO, KATHERINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴拉蘇拔馬尼安　葛尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BALASUBRAMANIAN, GANESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅查阿爾瓦雷斯　胡安卡洛斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROCHA-ALVAREZ, JUAN CARLOS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MX</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文所揭露的實施例大體而言係關於基板支撐及其製造方法。該基板支撐包含具有高電阻率的加熱器，例如介於1E8歐姆-厘米（ohm-cm）和1E11之間的電阻率。該加熱器的電阻率被配置為防止電弧。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments disclosed herein generally relate to a substrate support and a method for fabricating the same. The substrate support includes a heater having a high resistivity, such as a resistivity between 1E8 ohm-centimeter (ohm-cm) and 1E11. The resistivity of the heater is configured to prevent arcing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">112:隔離變壓器</p>
        <p type="p">114:電源</p>
        <p type="p">120:基板支撐</p>
        <p type="p">122:支撐主體</p>
        <p type="p">123:頂表面</p>
        <p type="p">124:加熱器</p>
        <p type="p">125:電源</p>
        <p type="p">126:靜電吸盤</p>
        <p type="p">127:側表面</p>
        <p type="p">220:基板</p>
        <p type="p">310:背側</p>
        <p type="p">330:輪緣</p>
        <p type="p">335:內壁</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1090" publication-number="202615010">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615010</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123497</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>藥物連接子、其偶聯物及其用途</chinese-title>
        <english-title>DRUG LINKER, CONJUGATE THEREOF, AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260106B">A61K31/44</main-classification>
        <further-classification edition="200601120260106B">A61K31/437</further-classification>
        <further-classification edition="200601120260106B">A61K31/403</further-classification>
        <further-classification edition="200601120260106B">A61K39/395</further-classification>
        <further-classification edition="201701120260106B">A61K47/68</further-classification>
        <further-classification edition="201701120260106B">A61K47/65</further-classification>
        <further-classification edition="201701120260106B">A61K47/54</further-classification>
        <further-classification edition="200601120260106B">A61P35/00</further-classification>
        <further-classification edition="200601120260106B">C07K16/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京加科思新藥研發有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JACOBIO PHARMACEUTICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, XIONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秀偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XIUWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李阿敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, AMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦文芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIN, WENFANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊貴群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, GUIQUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊海艷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HAIYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔言開</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUI, YANKAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王蕾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王燕萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YANPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種藥物連接體及包含免疫激動劑的抗體-藥物偶聯物（ADC）。本文提供了包含此類ADC的組合物，以及製備和使用所述ADC的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure relates to a drug linker and an antibody-drug conjugate (ADC), comprising an immune agonist. Provided herein are compositions comprising such ADC, as well as methods of making and using the same.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1091" publication-number="202616254">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616254</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123514</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>像素及電子裝置</chinese-title>
        <english-title>PIXEL AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260113B">G09G3/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星顯示器有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金善浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高裕敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, YOOMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴注燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JUCHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔忠碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, CHUNG SOCK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種像素，包含：一發光元件，其包含一陽極，該陽極連接至一第一驅動電壓線，及一陰極，該陰極連接至一第一節點；一第一電晶體，包含一第一電極、一第二電極、一閘極電極、及一下閘極電極；一第二電晶體，連接於一資料線及該第一電晶體的該閘極電極之間；一第五電晶體，連接於該第一節點及該第一電晶體的該第一電極之間；一第六電晶體，連接於該第一電晶體的該第二電極及一第二驅動電壓線之間；一第七電晶體，連接於該第一電晶體的該第一電極及該下閘極電極之間；一第一電容器，連接於該第一電晶體的該閘極電極及該第二電極之間；以及一第二電容器，連接於該第一電晶體的該下閘極電極及該第二電極之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pixel includes: a light emitting element including an anode connected to a first driving voltage line and a cathode connected to a first node; a first transistor including a first electrode, a second electrode, a gate electrode, and a lower gate electrode; a second transistor connected between a data line and the gate electrode of the first transistor; a fifth transistor connected between the first node and the first electrode of the first transistor; a sixth transistor connected between the second electrode of the first transistor and a second driving voltage line; a seventh transistor connected between the first electrode of the first transistor and the lower gate electrode; a first capacitor connected between the gate electrode of the first transistor and the second electrode; and a second capacitor connected between the lower gate electrode of the first transistor and the second electrode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">BG:下閘極電極</p>
        <p type="p">Cst:第一電容器</p>
        <p type="p">Cth:第二電容器</p>
        <p type="p">D:第一電極</p>
        <p type="p">Dj:資料訊號</p>
        <p type="p">DLj:資料線</p>
        <p type="p">ED:發光元件</p>
        <p type="p">ELVDD:第一驅動電壓</p>
        <p type="p">ELVSS:第二驅動電壓</p>
        <p type="p">EM1i:第一發光訊號</p>
        <p type="p">EM2i:第二發光訊號</p>
        <p type="p">EML1i:第一發光線</p>
        <p type="p">EML2i:第二發光線</p>
        <p type="p">G:閘極電極</p>
        <p type="p">GCi:第二掃描訊號</p>
        <p type="p">GCLi:第二掃描線</p>
        <p type="p">GIi:第三掃描訊號</p>
        <p type="p">GILi:第三掃描線</p>
        <p type="p">GWi:第一掃描訊號</p>
        <p type="p">GWLi:第一掃描線</p>
        <p type="p">N1:第一節點</p>
        <p type="p">PX:像素</p>
        <p type="p">S:第二電極</p>
        <p type="p">T1:第一電晶體</p>
        <p type="p">T2:第二電晶體</p>
        <p type="p">T3:第三電晶體</p>
        <p type="p">T4:第四電晶體</p>
        <p type="p">T5:第五電晶體</p>
        <p type="p">T6:第六電晶體</p>
        <p type="p">T7:第七電晶體</p>
        <p type="p">Vcint:第二初始化電壓</p>
        <p type="p">VL1:第一驅動電壓線</p>
        <p type="p">VL2:第二驅動電壓線</p>
        <p type="p">VL3:第三驅動電壓線</p>
        <p type="p">VL4:第四驅動電壓線</p>
        <p type="p">VREF:第一初始化電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1092" publication-number="202616939">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616939</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123522</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>超導結構及其製造方法</chinese-title>
        <english-title>SUPERCONDUCTING STRUCTURES AND METHODS OF MANUFACTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260114B">H10N60/01</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商牛津儀器奈米科技工具有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OXFORD INSTRUMENTS NANOTECHNOLOGY TOOLS LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任重</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REN, ZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHU, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種至少部分延伸穿過基板之超導結構，該基板包括：平坦第一表面以及與該第一表面相對之平坦第二表面；以及形成於該基板中之凹槽，該凹槽具有自該第一表面至少部分穿過該基板向該第二表面延伸之側壁；且該超導結構包括：超導體材料塗層，該超導體材料塗層包括：彼此重疊之複數層，該複數重疊層包括該超導體材料之至少一較高結晶度層以及該超導體材料之至少一較低結晶度層，以使該一個或多個較高結晶度層與位於該側壁及該第一表面之其中另一者上之該超導體材料一起形成電性連接該基板之該第一表面與該凹槽之該側壁的超導路徑。本揭露還提供一種製造至少部分延伸穿過基板之超導結構的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A superconducting structure extending at least part-way through a substrate, the substrate comprising: a planar first surface and a planar second surface opposed to the first surface; and a recess formed in the substrate, the recess having a side wall extending from the first surface at least part-way through the substrate towards the second surface; and the superconducting structure comprising: a superconductor material coating, the superconductor material coating comprising a plurality of layers overlapping one another, the plurality of overlapping layers comprising at least one higher-crystallinity layer of the superconductor material and at least one lower-crystallinity layer of the superconductor material, such that said one or more higher-crystallinity layers and the superconductor material on the other of the side wall and the first surface together form a superconductive pathway electrically connecting the first surface of the substrate and the side wall of the recess. The present disclosure further provides a method of manufacturing a superconducting structure extending at least part-way through a substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:超導結構</p>
        <p type="p">101:基板</p>
        <p type="p">102:第一表面</p>
        <p type="p">103:通孔</p>
        <p type="p">104:第二表面</p>
        <p type="p">105:側壁</p>
        <p type="p">110:第一堆疊</p>
        <p type="p">111:較高結晶度層</p>
        <p type="p">112:較低結晶度層</p>
        <p type="p">113:較高結晶度層</p>
        <p type="p">120:第二堆疊</p>
        <p type="p">121:較低結晶度層</p>
        <p type="p">122:較高結晶度層</p>
        <p type="p">123:較低結晶度層</p>
        <p type="p">131:超導體材料層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1093" publication-number="202615786">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615786</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123525</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於自行車組件之空氣彈簧</chinese-title>
        <english-title>AIR SPRINGS FOR BICYCLE COMPONENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">F16F9/02</main-classification>
        <further-classification edition="200601120260105B">F16F9/32</further-classification>
        <further-classification edition="200601120260105B">F16F9/34</further-classification>
        <further-classification edition="200601120260105B">F16F9/36</further-classification>
        <further-classification edition="200601120260105B">F16F9/44</further-classification>
        <further-classification edition="200601120260105B">F16F9/46</further-classification>
        <further-classification edition="200601120260105B">F16F9/43</further-classification>
        <further-classification edition="200601120260105B">B62J1/02</further-classification>
        <further-classification edition="200601120260105B">B62J1/08</further-classification>
        <further-classification edition="200601120260105B">B62K25/08</further-classification>
        <further-classification edition="200601120260105B">B62K25/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商速聯有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SRAM, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧拉普　查理斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUNLAP, CHARLES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文說明用於自行車組件之空氣彈簧。一範例空氣彈簧包括一管體、耦接至該管體之一第一密封頭、耦接至該管體之一第二密封頭，以使得一密封壓力腔室在該等第一與第二密封頭之間形成於該管體中，以及耦接至該第二密封頭之一密封件。該第二密封頭及該管體係沿著一軸向介面鎖定長度耦接。該管體具有一排放埠。該密封件係與該排放埠間隔開一埠密封件間隙，該埠密封件間隙小於該軸向介面鎖定長度，以使得在該第二密封頭正從該管體解耦時，該密封件失去與該內表面之密封接觸，以使該密封壓力腔室之至少一部分能夠在該第二密封頭從該管體完全解耦之前與大氣空氣均衡化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Air springs for bicycle components are described herein. An example air spring includes a tube, a first sealhead coupled to the tube, a second sealhead coupled to the tube such that a sealed pressure chamber is formed in the tube between the first and second sealheads, and a seal coupled to the second sealhead. The second sealhead and the tube are coupled along an axial interface locking length. The tube has a vent port. The seal is spaced from the vent port by a port seal gap that is less than the axial interface locking length such that as the second sealhead is being decoupled from the tube, the seal loses sealing contact with the inner surface to enable at least a portion of the sealed pressure chamber to be equalized with atmospheric air before the second sealhead is fully decoupled from the tube.</p>
      </isu-abst>
      <representative-img>
        <p type="p">201:空氣彈簧</p>
        <p type="p">204:第二管，上管，管體</p>
        <p type="p">400:第二端，下端</p>
        <p type="p">402:密封壓力腔室</p>
        <p type="p">406:第二密封頭，下密封頭，密封頭</p>
        <p type="p">408:桿棒</p>
        <p type="p">410:活塞總成</p>
        <p type="p">412:活塞</p>
        <p type="p">414:內表面</p>
        <p type="p">416:第一腔室</p>
        <p type="p">418:第二腔室</p>
        <p type="p">602:密封件</p>
        <p type="p">605:外表面</p>
        <p type="p">622:活塞密封件，密封件</p>
        <p type="p">634:排放埠</p>
        <p type="p">638:凹窩</p>
        <p type="p">1000:內部螺紋，螺紋</p>
        <p type="p">1002:外部螺紋，螺紋</p>
        <p type="p">1003:凸緣</p>
        <p type="p">1004:第一區段</p>
        <p type="p">1006:第二區段</p>
        <p type="p">1008:引入部</p>
        <p type="p">D1:第一內徑</p>
        <p type="p">D2:第二內徑</p>
        <p type="p">L3:軸向介面鎖定長度</p>
        <p type="p">L4:凹窩密封件間隙</p>
        <p type="p">L5:埠密封件間隙</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1094" publication-number="202616921">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616921</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123533</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於發光二極體（ＬＥＤ）封裝件中回焊緩解的引線框架結構</chinese-title>
        <english-title>LEAD FRAME STRUCTURES FOR REFLOW MITIGATION IN LIGHT-EMITTING DIODE (LED) PACKAGES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260105B">H10H20/857</main-classification>
        <further-classification edition="202501120260105B">H10H20/852</further-classification>
        <further-classification edition="202501120260105B">H10H20/85</further-classification>
        <further-classification edition="200601120260105B">H01L25/075</further-classification>
        <further-classification edition="200601120260105B">H01L23/498</further-classification>
        <further-classification edition="200601120260105B">H01L23/495</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科銳ＬＥＤ公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CREELED, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>切克　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHECK, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施密特　羅伯特　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHMIDT, ROBERT DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示發光二極體（LED）裝置，且更特定言之，揭示用於LED封裝件中之回焊緩解的引線框架結構。引線框架結構包括定位於封裝件殼體之凹部內的各種特徵及在該凹部內的LED晶片之鄰近安裝區域。所述特徵可包括相對於該凹部之底面的非平面形狀，其促進與該凹部中的囊封物之增大的黏附，同時亦緩解當稍後在裝置層級接合該封裝件時的回焊效應。例示性非平面形狀包括引線之向上延伸至該凹部中的部分及/或引線之向下延伸至該凹部之該底面下方的部分。所述特徵可布置成列、布置為島狀物，或甚至布置為沿著所述引線之部分的隨機結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Light-emitting diode (LED) devices and more particularly lead frame structures for reflow mitigation in LED packages are disclosed. Lead frame structures include various features positioned within a recess of a package housing and proximate mounting areas of LED chips within the recess. The features may include nonplanar shapes relative to a floor of the recess that promote increased adhesion with an encapsulant in the recess while also mitigating effects of reflow when the package is later bonded at a device level. Exemplary nonplanar shapes include portions of leads that extend upward into the recess and/or portions of leads that extend downward below the floor of the recess. The features may be arranged in rows, as islands, or even as random structures along portions of the leads.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1B-1B:截面線</p>
        <p type="p">10:LED封裝件</p>
        <p type="p">12-1:引線</p>
        <p type="p">12-2:引線</p>
        <p type="p">12-3:引線</p>
        <p type="p">12-4:引線</p>
        <p type="p">12-5:引線</p>
        <p type="p">12-6:引線</p>
        <p type="p">14:本體或殼體</p>
        <p type="p">14&lt;sub&gt;F&lt;/sub&gt;:凹部底面</p>
        <p type="p">14&lt;sub&gt;R&lt;/sub&gt;:凹部</p>
        <p type="p">14&lt;sub&gt;S&lt;/sub&gt;:凹部側壁</p>
        <p type="p">16-1:LED晶片</p>
        <p type="p">16-2:LED晶片</p>
        <p type="p">16-3:LED晶片</p>
        <p type="p">28:特徵</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1095" publication-number="202616002">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616002</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123566</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於溫度控制之先進控制系統及方法</chinese-title>
        <english-title>ADVANCED CONTROL SYSTEMS AND METHODS FOR TEMPERATURE CONTROL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">G05B11/42</main-classification>
        <further-classification edition="200601120260114B">G05D23/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商瓦特洛威電子製造公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATLOW ELECTRIC MANUFACTURING COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅科奇　法蘭西斯科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MECOCCI, FRANCESCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於例如在一半導體蝕刻操作內控制一加熱器之方法及系統包括基於設定點溫度資料產生至該加熱器之第一控制信號；在一資料儲存裝置中，儲存與在一時段產生之該等第一控制信號相關聯之樣本資料；藉由一處理器，基於該樣本資料來運算至少一個信號調整值；藉由該處理器，將該至少一個信號調整值套用於後續控制信號以提供經調整控制信號；以及產生至該加熱器之該等經調整控制信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and systems for controlling a heater, for example within a semiconductor etch operation, include generating first control signals to the heater based on setpoint temperature data; storing, in a data storage device, sample data associated with the first control signals generated over a time period; computing, by a processor, at least one signal adjustment value based on the sample data; applying, by the processor, the at least one signal adjustment value to subsequent control signals to provide adjusted control signals; and generating the adjusted control signals to the heater.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:過程</p>
        <p type="p">405:步驟</p>
        <p type="p">410:步驟</p>
        <p type="p">420:步驟</p>
        <p type="p">430:步驟</p>
        <p type="p">440:過程</p>
        <p type="p">450:步驟</p>
        <p type="p">460:步驟</p>
        <p type="p">470:步驟</p>
        <p type="p">480:步驟</p>
        <p type="p">482:步驟</p>
        <p type="p">484:步驟</p>
        <p type="p">486:步驟</p>
        <p type="p">488:步驟</p>
        <p type="p">490:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1096" publication-number="202615315">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615315</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123616</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板裝載用載盒</chinese-title>
        <english-title>CASSETTE FOR LOADING SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B65D85/90</main-classification>
        <further-classification edition="200601120260102B">B65G49/06</further-classification>
        <further-classification edition="200601120260102B">H01L21/67</further-classification>
        <further-classification edition="200601120260102B">H01L21/677</further-classification>
        <further-classification edition="200601120260102B">H01L21/687</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商愛玻索立克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABSOLICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宰源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JAE WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彩黙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, CHAEMOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據實施例的基板裝載用載盒包括：上部構架；下部構架，與上部構架相向。基板裝載用載盒包括支撐構架，其沿基板裝載用載盒的垂直方向形成，以在基板裝載用載盒的邊緣側連接上部構架與下部構架。基板裝載用載盒包括運輸裝置結合部，其配置在上部構架上，並且與基板裝載用載盒的運輸裝置結合。運輸裝置結合部包括：運輸裝置結合構架，沿基板裝載用載盒的水平方向形成；振動衰減部，配置在運輸裝置結合構架下方。支撐構架包括：第一支撐構架，配置在所述基板裝載用載盒的左側及右側；第二支撐構架，配置在所述基板裝載用載盒的後方。基板裝載用載盒包括支撐桿，其與第二支撐構架連接，並且具有向基板裝載用載盒的內側方向延伸的形狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a substrate loading cassette including an upper frame, a lower frame disposed so as to face the upper frame, a support frame configured to connect the upper frame and the lower frame to each other at an edge side of the substrate loading cassette, a transfer device coupling unit disposed on the upper frame, the transfer device coupling unit being coupled to a transfer device configured to transfer the substrate loading cassette, wherein the transfer device coupling unit includes a transfer device coupling frame and a vibration damping portion disposed under the transfer device coupling frame, the support frame includes a first support frame disposed on each of left and right sides of the substrate loading cassette and a second support frame disposed on a rear side of the substrate loading cassette, and the substrate loading cassette includes a support bar connected to the second support frame.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板裝載用載盒</p>
        <p type="p">10:上部構架</p>
        <p type="p">20:下部構架</p>
        <p type="p">30:支撐構架</p>
        <p type="p">40:運輸裝置結合部</p>
        <p type="p">50:支撐桿</p>
        <p type="p">60:載盒門</p>
        <p type="p">x:方向</p>
        <p type="p">y:方向</p>
        <p type="p">z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1097" publication-number="202616428">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616428</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123637</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/67</main-classification>
        <further-classification edition="200601120260102B">H01L21/66</further-classification>
        <further-classification edition="200601120260102B">H01L21/677</further-classification>
        <further-classification edition="200601120260102B">H01L21/687</further-classification>
        <further-classification edition="200601120260102B">H01L21/306</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森本大貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIMOTO, DAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永松辰也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAMATSU, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]本公開提供一種能夠抑制基板處理系統之運轉率下降的技術。  &lt;br/&gt;　　[解決手段]根據本公開的一種態樣的基板處理系統，具備對複數片基板進行整批處理的分批處理部、對基板一片一片地進行處理的單片處理部、將上述基板從上述分批處理部傳送至上述單片處理部的介面部、以及控制電路，上述介面部具有保持上述基板的基板保持部、向被保持在上述基板保持部中的上述基板的上面供給抑制上述上面乾燥的處理液的處理液供給部、以及攝像上述基板的上面的攝像部，上述控制電路根據上述攝像部攝像到的圖像，判定上述處理液供給部是否向上述基板的上述上面供給上述處理液。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1098" publication-number="202615605">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615605</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123670</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水系耐油劑組合物、水系耐油劑組合物的製造方法、紙的耐油處理方法及耐油紙</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C09D129/04</main-classification>
        <further-classification edition="200601120260102B">C09D183/05</further-classification>
        <further-classification edition="200601120260102B">C09D183/07</further-classification>
        <further-classification edition="201801120260102B">C09D7/45</further-classification>
        <further-classification edition="201801120260102B">C09D7/63</further-classification>
        <further-classification edition="200601120260102B">C09K3/18</further-classification>
        <further-classification edition="200601120260102B">D21H17/06</further-classification>
        <further-classification edition="200601120260102B">D21H17/09</further-classification>
        <further-classification edition="200601120260102B">D21H17/13</further-classification>
        <further-classification edition="200601120260102B">D21H17/36</further-classification>
        <further-classification edition="200601120260102B">D21H17/59</further-classification>
        <further-classification edition="200601120260102B">D21H21/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豊増智也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOMASU, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹脇一幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEWAKI, KAZUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中山健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAYAMA, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">議題：提供一種非氟樹脂系的水系耐油劑組合物，其係能獲得具有高的耐油性及高的透氣性之耐油紙之耐油劑組合物，其所含有之成分不含有氟系樹脂及有機溶劑，亦顧及健康面及環境面。解決方式：一種水系耐油劑組合物，其係包含（A）聚乙烯醇（PVA）系樹脂、（B）加成硬化型聚矽氧乳液、（E）水及（F）鉑族金屬系觸媒之水系耐油劑組合物，上述（B）加成硬化型聚矽氧乳液包含（G）含有烯基的有機聚矽氧烷、（H）有機氫聚矽氧烷、（I）界面活性劑及（J）水。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1099" publication-number="202616782">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616782</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123675</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>軟性電路板及其製造方法及包括該軟性電路板的半導體封裝和電子設備</chinese-title>
        <english-title>FLEXIBLE CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE AND ELECTRONIC APPARATUS INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">H05K1/02</main-classification>
        <further-classification edition="200601120260114B">H05K1/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商斯天克有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEMCO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李在文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JAE MUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東熹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DONG HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種軟性電路板及其製造方法及包括該軟性電路板的半導體封裝和電子設備，將與焊盤連接的延伸佈線的線寬變化點調整至能夠分散應力的位置。軟性電路板包括基材層；佈線層，形成於基材層上；及焊盤部，與佈線層電連接，焊盤部包括：第一焊盤；第二焊盤；及延伸佈線，從佈線層延伸並穿過第二焊盤連接至第一焊盤，延伸佈線的線寬變化起點不位於與第一焊盤相鄰的第二焊盤的第一側邊的延長線上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">310:第一測試焊盤</p>
        <p type="p">320:第一延伸佈線</p>
        <p type="p">330:第二測試焊盤</p>
        <p type="p">340:第二延伸佈線</p>
        <p type="p">410:第一側邊</p>
        <p type="p">420:第一側邊</p>
        <p type="p">430:線寬變化起點</p>
        <p type="p">440:線寬變化終點</p>
        <p type="p">D1:第一方向，線寬方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">INT:線寬變化區間</p>
        <p type="p">LW1:線寬</p>
        <p type="p">LW2:常規線寬，常規佈線寬度</p>
        <p type="p">RP:基準點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1100" publication-number="202616805">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616805</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123681</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>區域增強冷卻模組和具有微射流捕獲歧管的電子組件</chinese-title>
        <english-title>AREA-ENHANCED COOLING MODULE AND ELECTRONIC ASSEMBLY WITH MICROJET CAPTURE MANIFOLD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">H05K7/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商捷控技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JETCOOL TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈伯　Ｌ　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HABER, LUDWIG C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波吉歐　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOGGIO, CAMERON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種液體冷卻模組及冷卻組件，其採用射流衝擊來冷卻發熱電子裝置。該液體冷卻模組包括微射流捕獲歧管，該微射流捕獲歧管位於該液體冷卻模組之底板之頂部上或整合至該底板中。電子組件包括位於發熱裝置之冷卻表面上之微射流捕獲歧管。該微射流捕獲歧管包含與產生複數個經加壓冷卻劑之微射流之射流噴嘴對準的空腔陣列。各空腔包括入口及內部側壁，其經組態以捕獲及隔離來自個別或成組的微射流之湍流及流出物，由此最小化交叉射流干擾且增強局部熱轉移。所述空腔既用以約束高剪切湍流且又增加有效熱轉移表面積。當經加壓冷卻劑之微射流導入所述空腔中時，其從所述內部壁吸收熱且將該熱從熱源帶走，從而產生經提升熱效能及冷卻效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A liquid cooling module and cooling assembly are disclosed that employ jet impingement to cool a heat-generating electronic device. The liquid cooling module includes a microjet capture manifold that is located on top of the base plate or integrated into the base plate of the liquid cooling module. The electronic assembly includes a microjet capture manifold located on a cooling surface of a heat-generating device. The microjet capture manifold comprises an array of cavities aligned with jet nozzles that create a plurality microjets of pressurized coolant. Each cavity includes an inlet and interior sidewalls configured to capture and isolate turbulence and effluent from individual or grouped microjets, thereby minimizing cross-jet interference and enhancing local heat transfer. The cavities serve both to confine high-shear turbulent flow and to increase the effective heat transfer surface area. As microjets of pressurized coolant are directed into the cavities, they absorb heat from the interior walls and carry the heat away from the heat source, resulting in improved thermal performance and cooling efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:冷卻模板</p>
        <p type="p">105:底板</p>
        <p type="p">110:射流板</p>
        <p type="p">115:入口</p>
        <p type="p">120:出口</p>
        <p type="p">125:外殼</p>
        <p type="p">130:張力器板</p>
        <p type="p">132a:螺釘</p>
        <p type="p">132b:螺釘</p>
        <p type="p">132c:螺釘</p>
        <p type="p">134a:彈簧</p>
        <p type="p">134b:彈簧</p>
        <p type="p">134c:彈簧</p>
        <p type="p">136a:螺釘</p>
        <p type="p">136b:螺釘</p>
        <p type="p">136c:螺釘</p>
        <p type="p">138a:螺母</p>
        <p type="p">138b:螺母</p>
        <p type="p">138c:螺母</p>
        <p type="p">140:微射流捕獲歧管</p>
        <p type="p">145:空腔</p>
        <p type="p">170a:螺母</p>
        <p type="p">170b:螺母</p>
        <p type="p">170c:螺母</p>
        <p type="p">180:基板</p>
        <p type="p">185:熱介面材料</p>
        <p type="p">190:熱源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1101" publication-number="202615782">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615782</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123748</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液壓煞車卡鉗</chinese-title>
        <english-title>HYDRAULIC BRAKE CALIPER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">F16D65/02</main-classification>
        <further-classification edition="200601120260105B">B62L1/00</further-classification>
        <further-classification edition="200601120260105B">F16D65/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商速聯有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SRAM, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧拉普　查理斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUNLAP, CHARLES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬丹　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JORDAN, BRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>衛斯林　凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WESLING, KEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一煞車卡鉗包括一卡鉗殼體，其具有一第一空腔。一套筒安置在該第一空腔中。該套筒可沿著一軸向方向相對於該卡鉗殼體往復滑動。該套筒包括一第二空腔。一活塞安置在該第二空腔中。該活塞可沿著該軸向方向相對於該套筒往復滑動。一第一密封件安置在該套筒與該卡鉗殼體之間。一第二密封件安置在該活塞與該套筒之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A brake caliper includes a caliper housing having a first cavity. A sleeve is disposed in the first cavity. The sleeve is reciprocally slidable relative to the caliper housing along an axial direction. The sleeve includes a second cavity. A piston is disposed in the second cavity. The piston is reciprocally slidable relative to the sleeve along the axial direction. A first seal is disposed between the sleeve and the caliper housing. A second seal is disposed between the piston and the sleeve.</p>
      </isu-abst>
      <representative-img>
        <p type="p">8:軸向方向</p>
        <p type="p">212:煞車墊</p>
        <p type="p">224:非致動外側卡鉗部分，非致動卡鉗部分，致動卡鉗部分，外側卡鉗部分，卡鉗部分，外側部分</p>
        <p type="p">226:致動內側卡鉗部分，致動卡鉗部分，內側卡鉗部分，內側部分</p>
        <p type="p">228:緊固件</p>
        <p type="p">236:洩放配適件</p>
        <p type="p">238:洩放埠</p>
        <p type="p">240:轉返套筒，套筒</p>
        <p type="p">242:活塞</p>
        <p type="p">244:第一空腔，空腔</p>
        <p type="p">248:外或外部表面，外部表面</p>
        <p type="p">250:內部表面</p>
        <p type="p">252:第二空腔，空腔</p>
        <p type="p">254:第二外部表面，外徑密封表面，外部表面</p>
        <p type="p">256:轉返密封件</p>
        <p type="p">258:活塞密封件，密封件</p>
        <p type="p">280:第一環狀部分，環狀部分</p>
        <p type="p">282:第二環狀部分，環狀部分</p>
        <p type="p">284:環狀唇部</p>
        <p type="p">285:擋止表面</p>
        <p type="p">286:環狀壁</p>
        <p type="p">287:擋止表面</p>
        <p type="p">289:套筒擋止，第一擋止，擋止</p>
        <p type="p">290:中心開口</p>
        <p type="p">300:活塞背托環</p>
        <p type="p">400:轉返調整器，調整器</p>
        <p type="p">414:第二擋止，擋止</p>
        <p type="p">420:洩放配適件密封件</p>
        <p type="p">430:墊擴展器彈簧</p>
        <p type="p">450:軸向面</p>
        <p type="p">452:第二擋止，擋止</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1102" publication-number="202615784">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615784</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123749</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>煞車卡鉗</chinese-title>
        <english-title>BRAKE CALIPER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">F16D65/18</main-classification>
        <further-classification edition="200601120260105B">F16D65/02</further-classification>
        <further-classification edition="200601120260105B">B62L1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商速聯有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SRAM, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯尼德　布蘭登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SNEAD, BRADEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種煞車卡鉗包括一卡鉗殼體，其具有一空腔、可在該空腔中在一非煞車位置與一煞車位置之間往復移動的一活塞。一密封件安置在該活塞與該空腔之一內部表面之間。一抓握構件係與該活塞銜接且與該空腔之該內部表面間隔開。該抓握構件在該活塞位於該非煞車位置時抵接一擋止部，且在該活塞位於該煞車位置時與該擋止部間隔開。一偏壓構件將該抓握構件及活塞從該煞車位置偏壓至該非煞車位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A brake caliper includes a caliper housing having a cavity, a piston reciprocally moveable in the cavity between a non-braking position and a braking position. A seal is disposed between the piston and an interior surface of the cavity. A gripping member is engaged with the piston and spaced apart from the interior surface of the cavity. The gripping member abuts a stop when the piston is in the non-braking position and is spaced apart from the stop when the piston is in the braking position. A biasing member biases the gripping member and piston from the braking position to the non-braking position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">202:卡鉗</p>
        <p type="p">208:轉子</p>
        <p type="p">210:轉子槽孔，槽孔</p>
        <p type="p">212:煞車墊，墊</p>
        <p type="p">214:第一側，相對側</p>
        <p type="p">216:第二側，相對側</p>
        <p type="p">222:卡鉗殼體，殼體</p>
        <p type="p">224:內側卡鉗部分，外側卡鉗部分，外側部分</p>
        <p type="p">226:內側卡鉗部分，外側卡鉗部分，內側部分</p>
        <p type="p">300:卡鉗活塞，活塞</p>
        <p type="p">301:元件</p>
        <p type="p">302:卡鉗殼體空腔，內孔，空腔</p>
        <p type="p">308:密封件</p>
        <p type="p">322:抓握構件</p>
        <p type="p">342:偏壓構件</p>
        <p type="p">344:扣持件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1103" publication-number="202614962">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614962</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123832</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔裝置</chinese-title>
        <english-title>CLEANING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">A47L13/42</main-classification>
        <further-classification edition="200601120260114B">A47L25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商3Ｍ新設資產公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>3M INNOVATIVE PROPERTIES COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布萊森　凱爾　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRYSON, KYLE C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希拉揚　瑪妮莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIVRAYAN, MANISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴芬波特　馬力歐　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAVENPORT, MARIO A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種清潔裝置包括：一擦洗元件；及一手柄總成，其可移除地連接至該擦洗元件。該手柄元件包括：一主體，其沿著一縱軸延伸；及一彈性本體，其至少部分地圍封該主體。該主體包括：一剛性插入件；一周邊，其由該剛性插入件界定；一內部空腔，其用於容納清潔溶液；至少一個窗，其經界定在該周邊上且與該內部空腔流體連通；及一施配閥，其與該內部空腔流體連通且經構形以將該清潔溶液從該內部空腔施配至該擦洗元件中。該彈性本體包括對應於該至少一個窗的至少一個擠壓部分。在擠壓該彈性本體的該至少一個擠壓部分後，該清潔溶液經由該施配閥從該內部空腔施配至該擦洗元件中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cleaning device includes a scrubbing element and a handle assembly removably connected to the scrubbing element. The handle element includes a main body extending along a longitudinal axis and an elastic body at least partially enclosing the main body. The main body includes a rigid insert, a periphery defined by the rigid insert, an internal cavity for holding a cleaning solution, at least one window defined on the periphery and fluidly communicated with the internal cavity, and a dispensing valve fluidly communicated with the internal cavity and configured to dispense the cleaning solution from the internal cavity into the scrubbing element. The elastic body includes at least one squeeze portion corresponding to the at least one window. Upon squeezing the at least one squeeze portion of the elastic body, the cleaning solution is dispensed from the internal cavity into the scrubbing element via the dispensing valve.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:清潔裝置</p>
        <p type="p">102:擦洗元件</p>
        <p type="p">104:手柄總成</p>
        <p type="p">108:彈性本體</p>
        <p type="p">122:擠壓部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1104" publication-number="202614961">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614961</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123833</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔物品</chinese-title>
        <english-title>CLEANING ARTICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A47L13/26</main-classification>
        <further-classification edition="200601120260102B">A47L13/17</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商3Ｍ新設資產公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>3M INNOVATIVE PROPERTIES COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布萊森　凱爾　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRYSON, KYLE C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴芬波特　馬力歐　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAVENPORT, MARIO A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希拉揚　瑪妮莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIVRAYAN, MANISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普德利克　馬修　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PUDLIK, MATTHEW E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種清潔物品包括一彈性體構件，該彈性體構件包括：一第一主表面；及一第二主表面，其與該第一主表面相對且與該第一主表面間隔開。該彈性體構件進一步包括一周邊表面，該周邊表面自該第一主表面延伸至該第二主表面且界定該彈性體構件的周邊。該彈性體構件進一步包括一空腔表面，該空腔表面自該第一主表面延伸至該第二主表面。該空腔表面與該周邊表面間隔開，使得該空腔表面由該周邊表面所圍繞。該空腔表面界定一空腔，該空腔經構形以至少部分地接收清潔劑於其中。該彈性體構件進一步包括複數個貫穿開口，該複數個貫穿開口自該第一主表面延伸至該第二主表面且沿著該縱軸及該橫軸彼此間隔開，其中來自該複數個貫穿開口之各貫穿開口配置在該空腔表面與該周邊表面之間，且其中各貫穿開口包含在由該縱軸及該橫軸所定義的一平面中自該空腔表面所測量的一最小距離。本文亦揭示該清潔物品的一擦洗構件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cleaning article includes an elastomeric member including a first major surface and a second major surface opposite to the first major surface and spaced apart from the first major surface. The elastomeric member further includes a periphery surface extending from the first major surface to the second major surface and defining a periphery of the elastomeric member. The elastomeric member further includes a cavity surface extending from the first major surface to the second major surface. The cavity surface is spaced apart from the periphery surface, such that the cavity surface is surrounded by the periphery surface. The cavity surface defines a cavity configured to at least partially receive a cleaning agent therein. The elastomeric member further includes a plurality of through openings extending from the first major surface to the second major surface and spaced apart from each other along the longitudinal axis and the transverse axis, wherein each through opening from the plurality of through openings is arranged between the cavity surface and the periphery surface, and wherein each through opening comprises a minimum distance from the cavity surface measured in a plane defined by the longitudinal axis and the transverse axis. A scrubbing member of the cleaning article is also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:清潔物品</p>
        <p type="p">35:縱軸</p>
        <p type="p">40:橫軸</p>
        <p type="p">45:垂直軸</p>
        <p type="p">50:清潔劑</p>
        <p type="p">100:彈性體構件</p>
        <p type="p">102:第一主表面</p>
        <p type="p">104:第二主表面</p>
        <p type="p">106:周邊表面</p>
        <p type="p">108:空腔表面</p>
        <p type="p">110:空腔</p>
        <p type="p">112:凸部</p>
        <p type="p">122:貫穿開口</p>
        <p type="p">125:平面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1105" publication-number="202615459">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615459</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123837</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗ＣＤ３抗體以及其相關組合物及方法</chinese-title>
        <english-title>ANTI-CD3 ANTIBODIES AND COMPOSITIONS AND METHODS RELATED THERETO</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07K16/18</main-classification>
        <further-classification edition="200601120260102B">C07K16/28</further-classification>
        <further-classification edition="200601120260102B">A61K39/395</further-classification>
        <further-classification edition="200601120260102B">C07K16/46</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
        <further-classification edition="200601120260102B">C12N15/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商阿迪瑪有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADIMAB, LLC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦金斯　漢娜　克莉絲汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATKINS, HANNAH CHRISTINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡萊夫　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHALIFE, PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥格克　伊莉莎白　安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCGURK, ELIZABETH ANNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>保力　諾爾　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAULI, NOEL THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露包括抗CD3結合域，諸如VHH，以及包括該等域之抗體及/或抗原結合片段。亦包括多特異性抗體及抗體片段。本揭露進一步包括編碼該等抗體或抗體片段之核酸；含有該等核酸之載體；以及包含該等核酸及/或載體之宿主細胞。進一步包括與抗CD3抗體或抗原結合片段相關的醫藥組合物及方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure includes anti-CD3 binding domains such as VHHs and antibodies and/or antigen-binding fragments including such domains. Also included are multi-specific antibodies and antibody fragments. The present disclosure further includes nucleic acids encoding such antibodies or antibody fragments, vectors containing such nucleic acids, and host cells comprising such nucleic acids and/or vectors. Further included are pharmaceutical compositions and methods relating to anti-CD3 antibodies or antigen-binding fragments.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1106" publication-number="202615208">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615208</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123847</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>墊表面判定方法及墊表面判定系統</chinese-title>
        <english-title>PAD-SURFACE DETERMINATION METHOD AND PAD-SURFACE DETERMINATION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260106B">B24B41/047</main-classification>
        <further-classification edition="200601120260106B">B24D7/00</further-classification>
        <further-classification edition="201201120260106B">B24B37/34</further-classification>
        <further-classification edition="201201120260106B">B24B37/00</further-classification>
        <further-classification edition="200601120260106B">B24B49/12</further-classification>
        <further-classification edition="200601120260106B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商荏原製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBARA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金馬利文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMBA, TOSHIFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大島浩平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHSHIMA, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾文岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳凱智</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種墊表面判定方法及墊表面判定系統，其能夠適當地判定研磨墊的表面性狀，該研磨墊的表面性狀包含在研磨墊的研磨面形成的凸部的狀態。本墊表面判定方法從複數個投光部（51、52、53）將複數個光以不同的入射角照射至研磨墊（2）的研磨面（2a）內的目標區域（T），利用攝像裝置（59）接收來自目標區域（T）的複數個反射光，藉由攝像裝置（59）來生成與不同的入射角對應的複數個圖像，基於複數個圖像中的至少一個圖像來判定研磨墊（2）的表面性狀。在目標區域（T）內的研磨面（2a）形成有凸部（76）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:研磨頭</p>
        <p type="p">2:研磨墊</p>
        <p type="p">2a:研磨面</p>
        <p type="p">3:研磨台</p>
        <p type="p">3a:台軸</p>
        <p type="p">5:研磨液供給噴嘴</p>
        <p type="p">6:台電動機</p>
        <p type="p">10:研磨頭軸</p>
        <p type="p">14:支軸</p>
        <p type="p">16:研磨頭擺動臂</p>
        <p type="p">40:墊表面判定系統</p>
        <p type="p">50:研磨控制部</p>
        <p type="p">50a:存儲裝置</p>
        <p type="p">50b:運算裝置</p>
        <p type="p">51、52、53:投光部</p>
        <p type="p">58:圖像傳感器</p>
        <p type="p">59:攝像裝置</p>
        <p type="p">70:系統處理部</p>
        <p type="p">70a:存儲裝置</p>
        <p type="p">70b:運算裝置</p>
        <p type="p">T:目標區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1107" publication-number="202615965">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615965</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123896</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用來自機器模擬之機器學習的缺陷減少策略</chinese-title>
        <english-title>DEFECT REDUCTION STRATEGIES USING MECHANICAL LEARNINGS FROM MECHANICAL SIMULATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260114B">G03F1/36</main-classification>
        <further-classification edition="201201120260114B">G03F1/70</further-classification>
        <further-classification edition="200601120260114B">G03F7/00</further-classification>
        <further-classification edition="200601120260114B">G03F7/004</further-classification>
        <further-classification edition="200601120260114B">G03F7/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張一弛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬圖拉　莫妮卡　沙沃卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATHUR, MONICA SAWKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種靜態機器模擬決定在顯影之後在該光阻中的應力及變形。該機器模擬取用圖案化曝光資料及曝光後烘烤資料作為輸入以決定在該光阻之中的差異初始應變及應力。該初始應變係關於由於曝光及曝光後烘烤所造成的在光阻中發生的毯覆體積損失。使用該初始應變、膜特性、及幾何佈局作為輸入，該機器模擬決定或甚至量化在顯影之後該光阻中的最終應力和變形。在光阻中的最終應力和變形可對於缺陷事例取相關性。各種策略，包含利用機器模擬學習的主體遮罩最佳化、曝光前操作、及增進的光學鄰近校正（OPC），可加以應用以降低在光阻中的初始應變或應力且藉此降低顯影之後的缺陷率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A static mechanical simulation determines stress and deformation in a resist after development. The mechanical simulation takes patterned exposure data and post-exposure bake data as inputs to determine differential initial strain and stress in the resist. The initial strain is related to blanket volume loss that occurs in the resist as a result of exposure and post-exposure bake. Using the initial strain, film property, and geometry layout as inputs, the mechanical simulation determines or even quantifies a final stress and deformation in the resist after development. The final stress and deformation in the resist can be correlated to defect instances. Various strategies, including bulk mask optimization, pre-exposure operations, and enhanced optical proximity correction (OPC) that utilize the mechanical simulation learning, can be applied to reduce the initial strain or stress in the resist and thereby reduce defectivity after development.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1310:第一線</p>
        <p type="p">1320:第二線</p>
        <p type="p">1330:重疊交接區域</p>
        <p type="p">1350:光阻膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1108" publication-number="202616316">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616316</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123899</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有動態萃取角度控制的離子萃取光學元件</chinese-title>
        <english-title>ION EXTRACTION OPTICS WITH DYNAMIC EXTRACTION ANGLE CONTROL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H01J27/02</main-classification>
        <further-classification edition="200601120260112B">H01J27/08</further-classification>
        <further-classification edition="200601120260112B">H01J37/317</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索爾迪　湯瑪士詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOLDI, THOMAS JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪斯塔索　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DISTASO, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於萃取複數個離子束的離子萃取光學元件包括定義萃取孔的萃取板，以及位於萃取孔旁邊並由第一致動器和第二致動器安裝在萃取板上的光束阻擋器，其中光束阻擋器和萃取孔定義第一萃取狹縫和第二萃取狹縫，並且第一致動器和第二致動器被調適為相對於萃取板移動光束阻擋器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An ion extraction optics for extracting a plurality of ion beams includes an extraction plate defining an extraction aperture, and a beam blocker located adjacent the extraction aperture and mounted to the extraction plate by a first actuator and a second actuator, wherein the beam blocker and the extraction aperture define a first extraction slit and a second extraction slit, and wherein the first actuator and the second actuator are adapted to move the beam blocker relative to the extraction plate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:處理設備</p>
        <p type="p">102:電漿腔室</p>
        <p type="p">103:電漿</p>
        <p type="p">104:處理腔室</p>
        <p type="p">105:RF發生器</p>
        <p type="p">106:天線/電漿腔室</p>
        <p type="p">107:RF匹配網路</p>
        <p type="p">109:氣體歧管</p>
        <p type="p">112:偏壓電壓供應器</p>
        <p type="p">114:基板固持件</p>
        <p type="p">116:基板</p>
        <p type="p">117:絕緣體</p>
        <p type="p">118:電氣餽通</p>
        <p type="p">120:離子萃取光學元件</p>
        <p type="p">122:萃取板</p>
        <p type="p">123:萃取孔</p>
        <p type="p">124:光束阻擋器</p>
        <p type="p">129a:第一萃取狹縫</p>
        <p type="p">129b:第二萃取狹縫</p>
        <p type="p">130a:第一離子束</p>
        <p type="p">130b:第二離子束</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1109" publication-number="202615698">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615698</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123913</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>形成薄膜的方法</chinese-title>
        <english-title>METHOD FOR FORMING THIN FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">C23C16/40</main-classification>
        <further-classification edition="200601120260114B">C23C16/455</further-classification>
        <further-classification edition="202501120260114B">H10D1/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商周星工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUSUNG ENGINEERING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東燁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DONG YEUP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃喆周</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, CHUL-JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金志潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JI YOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭振榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWAK, JIN YEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明一示例性實施例的形成薄膜的方法包含裝載一基板至一腔體中以及形成一二氧化鈦(TiO&lt;sub&gt;2&lt;/sub&gt;)層於基板上。形成二氧化鈦(TiO&lt;sub&gt;2&lt;/sub&gt;)層包含將一含鈦(Ti)氣體供應至基板、將一含氧(O)氣體供應至基板以及形成一含氦(He)或含鍺(Ge)氣體的電漿於基板上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for forming a thin film in accordance with an exemplary embodiment of the present disclosure includes loading a substrate into a chamber, and forming a titanium dioxide (TiO2) layer on the substrate. The forming of the titanium dioxide (TiO2) layer includes supplying a titanium (Ti)-containing gas to the substrate, supplying an oxygen (O)-containing gas to the substrate, and forming plasma of a helium (He) or germanium (Ge)-containing gas on the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100,S200,S210,S220,S230:製程</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1110" publication-number="202616118">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616118</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123921</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>降低硬體可信執行環境的潛時</chinese-title>
        <english-title>REDUCING LATENCY OF HARDWARE TRUSTED EXECUTION ENVIRONMENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260107B">G06F21/79</main-classification>
        <further-classification edition="200601120260107B">G06F12/14</further-classification>
        <further-classification edition="201301120260107B">G06F21/53</further-classification>
        <further-classification edition="200601120260107B">G06F3/06</further-classification>
        <further-classification edition="200601120260107B">G06F9/50</further-classification>
        <further-classification edition="200601120260107B">H04L9/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商英特爾股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦迪奧伯　安喬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAHLDIEK-OBERWAGNER, ANJO LUCAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莎西塔　拉維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAHITA, RAVI L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維傑　孟那</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIJ, MONA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊利卡　拉梅庫馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ILLIKKAL, RAMESHKUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯坦納　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEINER, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯諾特　湯瑪斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KNAUTH, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫維斯基　迪米崔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUVAISKII, DMITRII</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克許納庫瑪　蘇達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRISHNAKUMAR, SUDHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫辛斯基　克萊斯多夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZMUDZINSKI, KRYSTOF C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史嘉拉塔　文森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCARLATA, VINCENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥金恩　法蘭西斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCKEEN, FRANCIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">範例方法和系統旨在減少提供可信執行環境(TEE)的潛時。在TEE開始執行之前，初始化該TEE包含多個步驟。除了特定於工作負載的初始化之外，還會執行與工作負載無關的初始化，例如向TEE增加記憶體。在函數即服務(FaaS)環境中，TEE大部分與工作負載無關，因此可以在接收該工作負載之前執行。在TEE初始化期間執行的某些步驟對於某些類別的工作負載是相同的。因此，TEE初始化序列的共同部分可以在請求TEE之前執行。當為該類別中的工作負載請求TEE且為特定目的特殊化TEE的部分是已知時，執行初始化TEE的最後步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Example methods and systems are directed to reducing latency in providing trusted execution environments (TEEs). Initializing a TEE includes multiple steps before the TEE starts executing. Besides workload-specific initialization, workload-independent initialization is performed, such as adding memory to the TEE. In function-as-a-service (FaaS) environments, a large portion of the TEE is workload-independent, and thus can be performed prior to receiving the workload. Certain steps performed during TEE initialization are identical for certain classes of workloads. Thus, the common parts of the TEE initialization sequence may be performed before the TEE is requested. When a TEE is requested for a workload in the class and the parts to specialize the TEE for its particular purpose are known, the final steps to initialize the TEE are performed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:方塊圖</p>
        <p type="p">410:應用程式</p>
        <p type="p">420:指定位址空間</p>
        <p type="p">430:作業系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1111" publication-number="202615672">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615672</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123931</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>超硬合金及切削工具</chinese-title>
        <english-title>CEMENTED CARBIDE AND CUTTING TOOL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C22C29/08</main-classification>
        <further-classification edition="200601120260102B">B23B27/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電工硬質合金股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO ELECTRIC HARDMETAL CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>城戸保樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIDO, YASUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中佑樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関谷喬啓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKIYA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之超硬合金係具備由複數個碳化鎢粒子構成之第1硬質相、及含有鈷之結合相者，上述超硬合金之上述第1硬質相及上述結合相之合計含有率為80.0體積%以上，上述超硬合金之上述結合相之含有率為5.0體積%以上21.0體積%以下，上述結合相之鈷含有率為50質量%以上，上述結合相以面積基準計之50%累積粒徑D50為0.10 μm以上0.30 μm以下，上述結合相以面積基準計之10%累積粒徑D10與90%累積粒徑D90之比D10/D90為0.26以上0.40以下，上述超硬合金之釩含有率為0.01質量%以上0.20質量%以下，上述超硬合金之鉻含有率為0.01質量%以上1.00質量%以下，上述碳化鎢粒子包含具有{11-20}之晶面之第1碳化鎢粒子、及與上述{11-20}之晶面鄰接存在之第2碳化鎢粒子，於上述第1碳化鎢粒子之{11-20}之晶面與上述第2碳化鎢粒子之界面區域A中，釩含有率之最大值A&lt;sub&gt;V&lt;/sub&gt;相對於鈷含有率之最大值A&lt;sub&gt;Co&lt;/sub&gt;之比A&lt;sub&gt;V&lt;/sub&gt;/A&lt;sub&gt;Co&lt;/sub&gt;為0.01以上0.5以下，於上述界面區域A中，鉻含有率之最大值A&lt;sub&gt;Cr&lt;/sub&gt;相對於上述鈷含有率之最大值A&lt;sub&gt;Co&lt;/sub&gt;之比A&lt;sub&gt;Cr&lt;/sub&gt;/A&lt;sub&gt;Co&lt;/sub&gt;為0.01以上2.0以下，上述碳化鎢粒子包含具有{0001}之晶面之第3碳化鎢粒子、及與上述{0001}之晶面鄰接存在之第4碳化鎢粒子，於上述第3碳化鎢粒子之{0001}之晶面與上述第4碳化鎢粒子之界面區域C中，釩含有率之最大值B&lt;sub&gt;V&lt;/sub&gt;相對於鈷含有率之最大值B&lt;sub&gt;Co&lt;/sub&gt;之比B&lt;sub&gt;V&lt;/sub&gt;/B&lt;sub&gt;Co&lt;/sub&gt;為0.01以上1.2以下，於上述界面區域C中，鉻含有率之最大值B&lt;sub&gt;Cr&lt;/sub&gt;相對於上述鈷含有率之最大值B&lt;sub&gt;Co&lt;/sub&gt;之比B&lt;sub&gt;Cr&lt;/sub&gt;/B&lt;sub&gt;Co&lt;/sub&gt;為0.01以上2.0以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cemented carbide comprising a first hard phase consisting of a plurality of tungsten carbide particles and a binder phase containing cobalt, wherein a total content of the first hard phase and the binder phase of the cemented carbide is 80.0% by volume or more, a content of the binder phase of the cemented carbide is 5.0% by volume or more and 21.0% by volume or less, a cobalt content of the binder phase is 50% by mass or more, a 50% cumulative particle diameter D50 of the binder phase based on an area is 0.10 μm or more and 0.30 μm or less, a ratio D10/D90 of a 10% cumulative particle diameter D10 of the binder phase based on an area to a 90% cumulative particle diameter D90 of the binder phase based on an area is 0.26 or more and 0.40 or less, a vanadium content of the cemented carbide is 0.01% by mass or more and 0.20% by mass or less, a chromium content of the cemented carbide is 0.01% by mass or more and 1.00% by mass or less, the tungsten carbide particles include a first tungsten carbide particle having a crystal plane of {11-20} and a second tungsten carbide particle that exists adjacent to the crystal plane of {11-20}, in an interface region A between the crystal plane of {11-20} of the first tungsten carbide particle and the second tungsten carbide particle, a ratio A&lt;sub&gt;V&lt;/sub&gt;/A&lt;sub&gt;Co&lt;/sub&gt; of a maximum value A&lt;sub&gt;V&lt;/sub&gt; of the vanadium content to a maximum value A&lt;sub&gt;Co&lt;/sub&gt; of the cobalt content is 0.01 or more and 0.5 or less, in the interface region A, a ratio A&lt;sub&gt;Cr&lt;/sub&gt;/A&lt;sub&gt;Co&lt;/sub&gt; of a maximum value A&lt;sub&gt;Cr&lt;/sub&gt; of the chromium content to the maximum value A&lt;sub&gt;Co&lt;/sub&gt; of the cobalt content is 0.01 or more and 2.0 or less, the tungsten carbide particles include a third tungsten carbide particle having a crystal plane of {0001} and a fourth tungsten carbide particle that exists adjacent to the crystal plane of {0001}, in an interface region C between the crystal plane of {0001} of the third tungsten carbide particle and the fourth tungsten carbide particle, a ratio B&lt;sub&gt;V&lt;/sub&gt;/B&lt;sub&gt;Co&lt;/sub&gt; of a maximum value B&lt;sub&gt;V&lt;/sub&gt; of the vanadium content to a maximum value B&lt;sub&gt;Co&lt;/sub&gt; of the cobalt content is 0.01 or more and 1.2 or less, and in the interface region C, a ratio B&lt;sub&gt;Cr&lt;/sub&gt;/B&lt;sub&gt;Co&lt;/sub&gt; of a maximum value B&lt;sub&gt;Cr&lt;/sub&gt; of the chromium content to the maximum value B&lt;sub&gt;Co&lt;/sub&gt; of the cobalt content is 0.01 or more and 2.0 or less.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第1碳化鎢粒子</p>
        <p type="p">2:第2碳化鎢粒子</p>
        <p type="p">3:結合相</p>
        <p type="p">B:箭頭</p>
        <p type="p">R:測定區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1112" publication-number="202615954">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615954</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123936</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含微胞之可變光透射裝置</chinese-title>
        <english-title>A VARIABLE LIGHT TRANSMISSION DEVICE COMPRISING MICROCELLS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260105B">G02F1/167</main-classification>
        <further-classification edition="201901120260105B">G02F1/1681</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商電子墨水股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>E INK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUNN, BRYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡米夫　帕弗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMAEV, PAVEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾孟森　卡爾瑞蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMUNDSON, KARL RAYMOND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏禹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIA, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種可變光透射裝置，其能夠減輕負面孔徑繞射效應(negative aperture diffraction effects)，並在開啟光學狀態與閉合光學狀態之間顯現良好的切換速度。該裝置包括設置在兩個透光電極層之間的一微胞層，該微胞層具有複數個微胞，每個微胞包含一電泳介質。並且，每個微胞包括一凸起結構及一通道。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A variable light transmission device is disclosed that mitigates negative aperture diffraction effects and shows good switching speed between the open and the closed optical states. The device comprises a microcell layer disposed between two light transmissive electrode layers, the microcell layer having a plurality of microcells, each microcell including an electrophoretic medium. And each microcell comprises a protrusion structure and a channel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1113" publication-number="202615955">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615955</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123938</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含微胞之可變光透射裝置</chinese-title>
        <english-title>A VARIABLE LIGHT TRANSMISSION DEVICE COMPRISING MICROCELLS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260105B">G02F1/167</main-classification>
        <further-classification edition="201901120260105B">G02F1/1681</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商電子墨水股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>E INK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUNN, BRYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏禹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIA, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈瑞斯　喬治Ｇ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARRIS, GEORGE G.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種可變光透射裝置，其能夠減輕負面孔徑繞射效應(negative aperture diffraction effects)，並在開啟光學狀態與閉合光學狀態之間顯現良好的切換速度。該裝置包括設置在兩個透光電極層之間的一微胞層，該微胞層具有複數個微胞，每個微胞包含一電泳介質，每個微胞包括一凸起結構，該凸起結構具有一個或多個井。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A variable light transmission device is disclosed that mitigates negative aperture diffraction effects and shows good switching speed between the open and the closed optical states. The device comprises a microcell layer disposed between two light transmissive electrode layers, the microcell layer having a plurality of microcells, each microcell including an electrophoretic medium, each microcell comprising a protrusion structure, the protrusion structure having one or more wells.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1114" publication-number="202615673">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615673</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123941</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>超硬合金及切削工具</chinese-title>
        <english-title>CEMENTED CARBIDE AND CUTTING TOOL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C22C29/08</main-classification>
        <further-classification edition="200601120260102B">B23B27/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電工硬質合金股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO ELECTRIC HARDMETAL CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>城戸保樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIDO, YASUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中佑樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関谷喬啓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKIYA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之超硬合金係具備由複數個碳化鎢粒子構成之第1硬質相、及含有鈷之結合相者，上述超硬合金之上述第1硬質相及上述結合相之合計含有率為80.0體積%以上，上述超硬合金之上述結合相之含有率為5.0體積%以上21.0體積%以下，上述結合相之鈷含有率為50質量%以上，上述超硬合金於600℃下之硬度H&lt;sub&gt;600&lt;/sub&gt;相對於25℃下之硬度H&lt;sub&gt;25&lt;/sub&gt;之百分率(H&lt;sub&gt;600&lt;/sub&gt;/H&lt;sub&gt;25&lt;/sub&gt;)×100為50%以上70%以下，上述超硬合金於600℃下之比熱c相對於上述超硬合金之上述結合相之質量基準之含有率M的比c/M為0.032以上0.044以下，上述超硬合金之上述結合相之質量基準之含有率M為3.0質量%以上13.0質量%以下，上述比熱c之單位為J/g・K。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cemented carbide is a cemented carbide comprising a first hard phase consisting of a plurality of tungsten carbide particles and a binder phase containing cobalt, wherein a total content of the first hard phase and the binder phase of the cemented carbide is 80.0% by volume or more, a content of the binder phase of the cemented carbide is 5.0% by volume or more and 21.0% by volume or less, a cobalt content of the binder phase is 50% by mass or more, a percentage (H&lt;sub&gt;600&lt;/sub&gt;/H&lt;sub&gt;25&lt;/sub&gt;) × 100 of a hardness H&lt;sub&gt;600&lt;/sub&gt; of the cemented carbide at 600℃ to a hardness H&lt;sub&gt;25&lt;/sub&gt; of the cemented carbide at 25℃ is 50% or more and 70% or less, a ratio c/M of a specific heat c of the cemented carbide at 600℃ to a content M of the binder phase of the cemented carbide based on mass is 0.032 or more and 0.044 or less, the content M of the binder phase of the cemented carbide based on mass is 3.0% by mass or more and 13.0% by mass or less, and a unit of the specific heat c is J/gK.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:切削工具</p>
        <p type="p">11:刀尖</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1115" publication-number="202616644">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616644</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123946</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>壓電振動裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H03B5/32</main-classification>
        <further-classification edition="200601120260102B">H03H9/15</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商精工電子水晶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SII CRYSTAL TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮田秀光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYATA, HIDEMITSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤弘夢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITOU, HIROMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種能夠提高良率、具有優異量產性且具備高操作可靠度的壓電振動裝置。  &lt;br/&gt;　　[解決手段]提供一種壓電振動裝置，具備：壓電振動片、包含接地端子之複數電路端子的積體電路晶片(4)、以及包含安裝壓電振動片的第1安裝區域和安裝積體電路的第2安裝區域(R2)的封裝，在第1安裝區域中，形成與壓電振動片的激勵電極導通的一對搭載電極(40)，在第2安裝區域中，形成與積體電路端子導通的複數積體電路電極(81)，複數積體電路電極包含與接地端子導通的接地電極(82)，同時分別與搭載電極導通的一對監測電極(83)，接地電極的面積(S1)被形成為比複數積體電路電極中，排除接地電極和監測電極後的其餘積體電路電極的面積(S3～S5)更大。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">R2:第2安裝區域</p>
        <p type="p">22:第2框架</p>
        <p type="p">23:切口部</p>
        <p type="p">4:積體電路晶片(積體電路)</p>
        <p type="p">40:搭載電極</p>
        <p type="p">41:外部連接電極</p>
        <p type="p">81:積體電路電極</p>
        <p type="p">82:接地電極</p>
        <p type="p">83:監測電極</p>
        <p type="p">84:積體電路電極</p>
        <p type="p">85,86,87:引出電極</p>
        <p type="p">S1~S5:面積</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1116" publication-number="202616317">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616317</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123968</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子電離源及其使用方法</chinese-title>
        <english-title>ELECTRON IONIZATION SOURCE AND METHODS OF USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H01J27/02</main-classification>
        <further-classification edition="200601120260112B">H01J37/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＭＫＳ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MKS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布魯克爾　葛拉多　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRUCKER, GERARDO A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊斯利　喬納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LESLIE, JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹寧斯　喬治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JENNINGS, GEORGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子電離源，包括：至少一個氣體源組件，氣體源組件具有至少一個噴嘴，噴嘴具有至少一個出口，出口經配置以將至少一個分析物材料遞送到至少一個電離區域；至少一個電子源組件，電子源組件經配置以產生與電離區域相交的至少一個電子束；以及至少一個夾具，夾具經配置以將氣體源組件固定到位，使得噴嘴的出口相對於電子束對準，夾具包括：第一鉗口，其定義一夾鉗空間以接收氣體源組件的夾鉗部分；第二鉗口，其以可移動的方式耦接到第一鉗口並且經配置以將夾鉗部分夾緊在夾鉗空間內，其中一或多個緊固件經操作以調整氣體源組件在夾鉗空間內沿著x軸、y軸和/或z軸中的至少一者的垂直位置，其中氣體源組件可以在三個維度上相對於電子束和位於電離區域下游的真空泵的入口而對準。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electron ionization source including at least one gas source assembly having at least one nozzle having at least one outlet configured to deliver at least one analyte material into at least one ionization region, at least one electron source assembly configured to generate at least one electron beam intersecting the ionization region, and at least one fixture configured to positionally secure the gas source assembly such that the outlet of the nozzle is aligned relative to the electron beam, the fixture comprises a first jaw defining a clamping space to receive a clamping section of the gas source assembly, a second jaw movably coupled to the first jaw and configured to clamp the clamping section within the clamping space, wherein one or more fasteners may be operated to adjust the vertical position of the gas source assembly along at least one of the x-axis, y-axis, and/or z-axis within the clamping space, wherein the gas source assembly may be alignable in three dimensions relative to the electron beam and to an inlet of a vacuum pump positioned downstream of the ionization region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">4:線</p>
        <p type="p">100:電子電離源</p>
        <p type="p">100a:分析物輸送軸</p>
        <p type="p">100b:虛線箭頭</p>
        <p type="p">100c:虛線箭頭</p>
        <p type="p">101:安裝凸緣</p>
        <p type="p">102:氣體源組件</p>
        <p type="p">103:安裝板</p>
        <p type="p">104a:第一電子源組件</p>
        <p type="p">105:套管</p>
        <p type="p">107:緊固件組件</p>
        <p type="p">108:第二燈絲電子入口電極</p>
        <p type="p">108a:第二電極孔</p>
        <p type="p">109:緊固件組件</p>
        <p type="p">110:離子排斥電極</p>
        <p type="p">112:離子出口電極</p>
        <p type="p">114:透鏡電極</p>
        <p type="p">118:噴嘴</p>
        <p type="p">120:夾具</p>
        <p type="p">122:第一鉗口</p>
        <p type="p">124:第二鉗口</p>
        <p type="p">126:夾鉗部分</p>
        <p type="p">400:出口孔</p>
        <p type="p">+x:方向</p>
        <p type="p">+y:方向</p>
        <p type="p">+z:方向</p>
        <p type="p">-x:方向</p>
        <p type="p">-y:方向</p>
        <p type="p">-z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1117" publication-number="202616935">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616935</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124021</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">H10K59/123</main-classification>
        <further-classification edition="202501120260102B">H10H29/39</further-classification>
        <further-classification edition="201601120260102B">G09G3/3233</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星顯示器有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴注燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JUCHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金善浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高裕敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, YOOMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔忠碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, CHUNG SOCK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置包含：像素驅動電路，其包含電晶體；發光元件，其包含第一電極、設置於第一電極上的中間層、以及設置於中間層上的第二電極；連接電極，其將發光元件與像素驅動電路電性連接，且包含連接至發光元件的發光連接部以及連接至像素驅動電路的驅動連接部；像素定義層，其包含透過其定義並與第一電極之一部分重疊的發光開口；以及突起圖案，其設置於該像素定義層上。突起圖案包含自其上表面以厚度方向延伸的溝槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes a pixel driving circuit including a transistor, a light emitting element including a first electrode, an intermediate layer disposed on the first electrode, and a second electrode disposed on the intermediate layer, a connection electrode electrically connecting the light emitting element and the pixel driving circuit and including a light emitting connection portion connected to the light emitting element and a driving connection portion connected to the pixel driving circuit, a pixel definition layer including a light emitting opening defined therethrough and overlapping a portion of the first electrode, and a protruding pattern disposed on the pixel definition layer. The protruding pattern includes a groove that extends from its upper surface in a thickness direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">AA’:區域</p>
        <p type="p">B_TP:尖端部之下表面</p>
        <p type="p">CNE:連接電極</p>
        <p type="p">EL2:第二電極</p>
        <p type="p">FNL:功能層</p>
        <p type="p">D1:第一虛設層</p>
        <p type="p">D2:第二虛設層</p>
        <p type="p">GV:突起圖案</p>
        <p type="p">IB_SPR:突起圖案之內下表面</p>
        <p type="p">IS_SPR:突起圖案之內側表面</p>
        <p type="p">OS_SPR:突起圖案之外側表面</p>
        <p type="p">IL1:第一無機層</p>
        <p type="p">PDL:像素定義層</p>
        <p type="p">SPR:突起圖案</p>
        <p type="p">TP:尖端部</p>
        <p type="p">U_SPR:突起圖案之上表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1118" publication-number="202615907">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615907</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124077</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多芯光套管、多芯光連接器及多芯光套管的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">G02B6/02</main-classification>
        <further-classification edition="200601120260107B">G02B6/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商白山股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAKUSAN INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹崎元人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEZAKI, MOTOHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林護章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, MORIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上野翔平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UENO, SHOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 本發明的目的為提供具有與從前的光連接器的連接互換性的多芯光套管及多芯光連接器。  &lt;br/&gt;　　[解決手段] 多芯光套管(100)，具有：由樹脂組成物形成的本體；設於本體，插入光纖(11)的複數芯的光纖插入孔(103)；設於本體，插入導銷的2個導銷孔(102)；光纖插入孔由24個以上形成，配設於連結2個導銷孔的直線上；光纖插入孔具有小徑部(110)及大徑部(106)，小徑部的內徑為81μm；光纖插入孔的中央部中的間距(Pm)為中央部以外的光纖插入孔的間距(P)的2倍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:多芯光套管</p>
        <p type="p">101:纖維膠帶收容口</p>
        <p type="p">102:導銷孔</p>
        <p type="p">103:光纖插入孔</p>
        <p type="p">104:開口部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1119" publication-number="202616255">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616255</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124156</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置及包含其之電子裝置</chinese-title>
        <english-title>DISPLAY DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260102B">G09G3/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星顯示器有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李志朠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JIYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔賢榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, HYUNYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙亨旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, HYUNG UK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡知松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAE, JISONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置中的一像素包含：一發光元件，連接至一第一電源線；一第一電晶體，連接在該發光元件的一陰極及一第二電源線之間；一第二電晶體，連接在一第二節點及一資料線之間；一第一電容器，連接在一第一節點及該第二節點之間；一第三電晶體，連接在該第一電晶體的該第一電極及該第一節點之間；一第二電容器，連接在該第二節點及該第一電源線之間；以及一第四電晶體，在一初始化期間內，響應於一第二掃描訊號初始化該第二節點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pixel in a display device includes a light emitting element connected to a first power line, a first transistor connected between a cathode of the light emitting element and a second power line, a second transistor connected between a second node and a data line, a first capacitor connected between a first node and the second node, a third transistor connected between the first electrode of the first transistor and the first node, a second capacitor connected between the second node and the first power line, and a fourth transistor that initializes the second node in response to a second scan signal during an initialization period.</p>
      </isu-abst>
      <representative-img>
        <p type="p">C1:第一電容器</p>
        <p type="p">C2:第二電容器</p>
        <p type="p">DLj:資料線</p>
        <p type="p">DSj:資料訊號</p>
        <p type="p">ED:發光元件</p>
        <p type="p">ELVDD:第一驅動電壓</p>
        <p type="p">ELVSS:第二驅動電壓</p>
        <p type="p">EMi:發射控制訊號</p>
        <p type="p">EMLi:發射控制線</p>
        <p type="p">ET:發射控制電晶體</p>
        <p type="p">GIi,GIi+1:初始化掃描訊號</p>
        <p type="p">GILi,GILi+1:初始化掃描線</p>
        <p type="p">GWi:寫入掃描訊號</p>
        <p type="p">GWLi:寫入掃描線</p>
        <p type="p">N1:第一節點</p>
        <p type="p">N2:第二節點</p>
        <p type="p">N3:第三節點</p>
        <p type="p">N4:第四節點</p>
        <p type="p">PL1:第一電源線</p>
        <p type="p">PL2:第二電源線</p>
        <p type="p">PXCa:像素電路</p>
        <p type="p">PXij:像素</p>
        <p type="p">T1:第一電晶體，電晶體</p>
        <p type="p">T2:第二電晶體，電晶體</p>
        <p type="p">T3:第三電晶體，電晶體</p>
        <p type="p">T4:第四電晶體，電晶體</p>
        <p type="p">T5:第五電晶體，電晶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1120" publication-number="202615050">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615050</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124185</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>局部用藥物組合物及其用途</chinese-title>
        <english-title>TOPICAL PHARMACEUTICAL COMPOSITIONS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/553</main-classification>
        <further-classification edition="200601120260102B">A61K31/35</further-classification>
        <further-classification edition="200601120260102B">A61K47/36</further-classification>
        <further-classification edition="201701120260102B">A61K47/58</further-classification>
        <further-classification edition="200601120260102B">A61P17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳市藥欣生物科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN PHARMACIN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　澤人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZEREN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周小艷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, XIAOYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵晶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAO, JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供米哚妥林(midostaurin)或其藥學上可接受之鹽及視情況選用之滲透增強劑(例如萜類(terpenoid)，諸如薄荷腦)的局部用藥物組合物。進一步描述用於製備此等局部用藥物組合物之方法及使用其來治療個體之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are topical pharmaceutical compositions of midostaurin or a pharmaceutically acceptable salt thereof and optionally a penetration enhancer (&lt;i&gt;e.g.&lt;/i&gt;, terpenoid such as menthol). Further described are methods for preparing such topical pharmaceutical compositions and methods of using the same for treating a subject.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1121" publication-number="202616500">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616500</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124200</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及製造電子裝置的方法</chinese-title>
        <english-title>ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L23/49</main-classification>
        <further-classification edition="200601120260102B">H01L23/495</further-classification>
        <further-classification edition="200601120260102B">H01L23/14</further-classification>
        <further-classification edition="200601120260102B">H01L23/31</further-classification>
        <further-classification edition="200601120260102B">H01L21/60</further-classification>
        <further-classification edition="200601120260102B">H01L21/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商安靠科技新加坡控股私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金吉江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, GI JEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫權守</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANG, KWANG SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳東秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RYU, DONG SU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一個實例中，一種電子裝置包括：基板，其包括第一側和與所述第一側相對的第二側，其中所述基板在所述基板的所述第一側上包括凹坑；電子組件，其在所述基板的所述第一側上方；囊封體，其在所述基板的所述第一側上方且覆蓋所述電子組件的橫向側；以及第一互連件，其處於所述囊封體中且耦合到所述電子組件和所述基板。本文中還公開了其它實例和相關方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In one example, an electronic device, comprises a substrate comprising a first side and a second side opposite to the first side, wherein the substrate comprises dimples on the first side of the substrate, an electronic component over the first side of the substrate, an encapsulant over the first side of the substrate and covering a lateral side of the electronic component, and a first interconnect in the encapsulant and coupled to the electronic component and the substrate. Other examples and related methods are also disclosed herein.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子裝置</p>
        <p type="p">110:基板</p>
        <p type="p">111:引線</p>
        <p type="p">111a:引線向內端子</p>
        <p type="p">111b:引線向外端子</p>
        <p type="p">111P:引線鍍層</p>
        <p type="p">112:焊盤</p>
        <p type="p">112a:焊盤向內端子</p>
        <p type="p">112P:焊盤鍍層</p>
        <p type="p">113:凹坑</p>
        <p type="p">120:電子組件</p>
        <p type="p">121:第一側</p>
        <p type="p">122:第二側</p>
        <p type="p">123:接觸襯墊</p>
        <p type="p">130:晶粒附接材料</p>
        <p type="p">140:互連件</p>
        <p type="p">150:囊封體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1122" publication-number="202616865">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616865</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124259</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路及其製造方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT AND METHOD OF FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251201B">H10D62/10</main-classification>
        <further-classification edition="202501120251201B">H10D64/20</further-classification>
        <further-classification edition="202501120251201B">H10D88/00</further-classification>
        <further-classification edition="200601120251201B">H01L21/768</further-classification>
        <further-classification edition="200601120251201B">H01L23/535</further-classification>
        <further-classification edition="202501120251201B">H01L21/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳顗伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧麒友</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巫承霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHEN-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周雅琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, YA-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">積體電路包括第一和第二主動區、第一和第二觸點、第一導體及第一絕緣區。第一主動區在第一方向上延伸，位於基板的前側上方的第一層上，且對應於第一組電晶體。第二主動區在第一方向上延伸，位於第二層上，且對應於第二組電晶體。第一觸點在第二方向上延伸，位於第三層上，且與第一主動區重疊。第二觸點在第二方向上延伸，位於第四層上，且與第二主動區重疊。第一導體在第一方向上延伸，位於第三層及第四層上，並耦接至第一觸點及第二觸點。第一絕緣區位於第一導體的凹槽內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated circuit includes a first and second active region, a first and second contact, a first conductor and a first insulating region. The first active region extends in a first direction, is on a first level above a front-side of a substrate, and corresponds to a first set of transistors. The second active region extends in the first direction, is on a second level, and corresponds to a second set of transistors. The first contact extends in a second direction, is on a third level, and overlaps the first active region. The second contact extends in the second direction, is on a fourth level, overlaps the second active region. The first conductor extends in the first direction, is on the third level and the fourth level, and is coupled to the first contact and the second contact. The first insulating region is within a recess of the first conductor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:積體電路</p>
        <p type="p">402a,404a:主動區</p>
        <p type="p">403a:前側</p>
        <p type="p">403b:後側</p>
        <p type="p">410c,412c:觸點</p>
        <p type="p">416:導體組</p>
        <p type="p">416a,430a,430b,430c2,432a,432b,432c,460c:導體</p>
        <p type="p">420c,422b,450c:通孔</p>
        <p type="p">440:絕緣區組</p>
        <p type="p">440a:絕緣區</p>
        <p type="p">490:基板</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1123" publication-number="202616009">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616009</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124290</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>作業機器人之控制方法及作業機器人</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G05B19/19</main-classification>
        <further-classification edition="200601120260102B">G05B19/404</further-classification>
        <further-classification edition="200601120260102B">G01B11/03</further-classification>
        <further-classification edition="200601120260102B">C23C16/54</further-classification>
        <further-classification edition="200601120260102B">C23C16/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商武藏工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUSASHI ENGINEERING, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>生島和正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKUSHIMA, KAZUMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明可解決根據位置資訊測定裝置所取得之位置資訊而對作業機器人之動作路徑進行修正時所產生之座標偏差的問題。  &lt;br/&gt;本發明係一種作業機器人控制方法及作業機器人1，該作業機器人控制方法係具有如下步驟：建立第1動作路徑的步驟，該第1動作路徑具有第1示教點p、及方向轉換部(421~424)；建立第2動作路徑的步驟，該第2動作路徑具有被設定在第1動作路徑上的第2示教點P、及圓弧路徑(521~525)；取得位置資訊的步驟，其藉由位置資訊測定裝置30而在第2示教點或其附近取得位置資訊；進行修正的步驟，其根據位置資訊而對第1示教點之座標進行修正；及進行作業的步驟，其藉由作業裝置20在已被修正之第1動作路徑的第1示教點進行作業；且其具備有：示教點前路徑(531~533)，其係進入成為通過點之第2示教點P的直線路徑；及示教點後路徑(541~543)；而示教點前路徑(531~533)或示教點後路徑(541~543)係接續於圓弧路徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">40:第1動作路徑(第1實施形態例)</p>
        <p type="p">50:第2動作路徑(第1實施形態例)</p>
        <p type="p">511~513:第2連絡路徑</p>
        <p type="p">512a:起點部分</p>
        <p type="p">512b:終點部分</p>
        <p type="p">521~525:圓弧路徑</p>
        <p type="p">531~533:示教點前路徑</p>
        <p type="p">541~543:示教點後路徑</p>
        <p type="p">P1~P4:第2示教點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1124" publication-number="202615989">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615989</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124339</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法、基板處理裝置、基板處理系統及基板處理程式</chinese-title>
        <english-title>SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING PROGRAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G03F7/20</main-classification>
        <further-classification edition="200601120260102B">G03F7/26</further-classification>
        <further-classification edition="200601120260102B">H01L21/324</further-classification>
        <further-classification edition="200601120260102B">H01L21/677</further-classification>
        <further-classification edition="200601120260102B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡田聡一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKADA, SOICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安東健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDO, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>只友浩貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TADATOMO, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達文多爾發　阿諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAUENDORFFER, ARNAUD ALAIN JEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之基板處理方法，包含以下步驟：對基板的表面實行感光性被膜的成膜處理；將成膜處理完成的基板收納於第1處理室，並在第1處理室內對感光性被膜實行曝光處理；將成膜處理完成的基板收納到有別於第1處理室的第2處理室，並實行將第2處理室內減壓的減壓處理；在減壓處理之後，且在顯影處理之前，實行令感光性被膜曝露於含水分氣體中的水合處理；以及對曝光處理完成且水合處理完成的基板的感光性被膜實行顯影處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate processing method of the invention comprises: a step of performing film deposition processing of a photosensitive coating film on the surface of a substrate; a step of housing, in a first chamber, the substrate that has undergone film deposition processing, and conducting exposure processing of the photosensitive coating film inside the first chamber; a step of housing, in a second chamber, which differs from the first chamber, the substrate that has undergone film deposition processing, and conducting depressurization processing which reduces the pressure inside the second chamber; a step, performed after the depressurization processing and before development processing, of performing hydration processing which exposes the photosensitive coating film to a water-containing gas; and a step of performing development processing of the photosensitive coating film on the substrate that has undergone exposure processing and hydration processing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">22,23,33,41,42:搬運裝置</p>
        <p type="p">34:成膜處理裝置</p>
        <p type="p">36:熱處理裝置</p>
        <p type="p">5:曝光裝置</p>
        <p type="p">68:減壓裝置</p>
        <p type="p">69:水合裝置</p>
        <p type="p">37:熱處理裝置</p>
        <p type="p">35:顯影裝置</p>
        <p type="p">100:控制裝置</p>
        <p type="p">111:搬運控制部</p>
        <p type="p">112:成膜控制部</p>
        <p type="p">113:熱處理控制部</p>
        <p type="p">114:曝光控制部</p>
        <p type="p">115:減壓控制部</p>
        <p type="p">116:水合控制部</p>
        <p type="p">117:顯影控制部</p>
        <p type="p">118:熱處理控制部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1125" publication-number="202616462">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616462</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124344</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>承載環設計</chinese-title>
        <english-title>CARRIER RING DESIGNS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">H01L21/683</main-classification>
        <further-classification edition="200601120260108B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉查孔達　沙依</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RACHAKONDA, SAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許偉峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHO, LEONARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕爾馬　拉維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARMAR, RAVI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科撒帕里　維杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTHAPALLI, VIJAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">承載環包括環形構件及佈設於環形構件表面上的N個凹槽，其中N為大於1的整數。N個凹槽從環形構件表面內邊緣朝外邊緣徑向延伸。承載環包括環形構件，其包含N個凹槽，其中N為大於1的整數；以及N個支撐組件，其分別與N個凹槽配合，並配置成支撐基板。承載環套組包括環形構件，其包含表面及位於該表面上的N個凹槽，其中N為大於1的整數；以及N個支撐組件，其配置成分別與N個凹槽配合並支撐基板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A carrier ring comprises an annular member and N grooves arranged on a surface of the annular member, where N is an integer greater than 1. The N groves extend radially from an inner edge of the surface of the annular member towards an outer edge of the surface of the annular member. A carrier ring comprises an annular member comprising N grooves, where N is an integer greater than 1; and N support assemblies mated with the N grooves, respectively, and configured to support a substrate. A carrier ring kit comprises an annular member comprising a surface and N grooves situated on the surface, where N is an integer greater than 1; and N support assemblies configured to mate with the N grooves, respectively, and to support a substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:承載環</p>
        <p type="p">301:通孔</p>
        <p type="p">302-1:凸部</p>
        <p type="p">302-2:凸部</p>
        <p type="p">302-3:凸部</p>
        <p type="p">304-1:孔</p>
        <p type="p">304-2:孔</p>
        <p type="p">304-3:孔</p>
        <p type="p">307-1:緊固件</p>
        <p type="p">307-2:緊固件</p>
        <p type="p">307-3:緊固件</p>
        <p type="p">352:附接構件</p>
        <p type="p">354:指狀件</p>
        <p type="p">370:滾輪</p>
        <p type="p">372:凸部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1126" publication-number="202615430">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615430</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124360</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>作為CD38抑制劑之雜雙環醯胺</chinese-title>
        <english-title>HETEROBICYCLIC AMIDES AS INHIBITORS OF CD38</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">C07D403/10</main-classification>
        <further-classification edition="200601120260107B">C07D417/10</further-classification>
        <further-classification edition="200601120260107B">C07D471/04</further-classification>
        <further-classification edition="200601120260107B">A61K31/519</further-classification>
        <further-classification edition="200601120260107B">A61K31/437</further-classification>
        <further-classification edition="200601120260107B">A61K31/425</further-classification>
        <further-classification edition="200601120260107B">A61K31/4184</further-classification>
        <further-classification edition="200601120260107B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商百靈佳殷格翰國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOEHRINGER INGELHEIM INTERNATIONAL GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申克爾　羅利　Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHENKEL, LAURIE B.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦斯賓達　梅麗莎　瑪麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VASBINDER, MELISSA MARIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坎茲　凱文　韋恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNTZ, KEVIN WAYNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯爾　尼可拉斯　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PERL, NICHOLAS ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>道寧　珍妮弗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOWNING, JENNIFER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於雜雙環醯胺及相關化合物，其等係CD38抑制劑且可用於治療癌症。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to heterobicyclic amides and related compounds which are inhibitors of CD38 and are useful in the treatment of cancer.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1127" publication-number="202615448">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615448</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124434</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於液相肽及寡核苷酸合成之選擇性可溶檸檬酸衍生撐體</chinese-title>
        <english-title>SELECTIVELY SOLUBLE CITRIC ACID-DERIVED SUPPORTS FOR LIQUID-PHASE PEPTIDE AND OLIGONUCLEOTIDE SYNTHESIS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">C07K1/02</main-classification>
        <further-classification edition="200601120260115B">C07K1/04</further-classification>
        <further-classification edition="200601120260115B">C12P19/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商維諾達有限合夥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERANOVA, L.P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯奎爾　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SQUIRE, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉布洛　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIBOULOT, STEVEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齊茲科娃　瑪蒂娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CIZKOVA, MARTINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何　譚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, THANH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀畊宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種保護試劑，其甚至在酸性條件下可以高產率移除，並且可在有機合成反應，諸如肽合成、寡核苷酸合成及類似者中，提供高純度之所得產物。該保護試劑為衍生自檸檬酸的式(I)之選擇性可溶化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a protecting reagent that can be removed in a high yield even under acidic conditions and can afford a resulting product at a high purity in an organic synthesis reaction such as peptide synthesis, oligonucleotide synthesis, and the like. The protecting reagent is a selectively soluble compound of Formula (I), which is derived from citric acid.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1128" publication-number="202615892">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615892</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124512</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>根據多階段檢測控制在無線通信系統中進行目標檢測的方法及相關設備</chinese-title>
        <english-title>METHOD FOR PERFORMING OBJECT DETECTION WITH AID OF MULTI-STAGE DETECTION CONTROL IN WIRELESS COMMUNICATION SYSTEM, AND ASSOCIATED APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260102B">G01S17/10</main-classification>
        <further-classification edition="201801120260102B">H04W4/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏恩捷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIA, EN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡宗翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, TSUNG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種由第一無線通信設備執行的進行目標檢測的方法。該方法可以包括：獲得至少兩個通道狀態資訊（CSI），並根據該至少兩個CSI執行初步檢測以生成初步檢測結果，其中該初步檢測結果指示在該第一無線通信設備和第二無線通信設備之間是否檢測到潛在目標；以及，響應於該初步檢測結果指示檢測到該潛在目標，在該第一階段之後的第二階段，發送雷達信號，接收該雷達信號的反射雷達信號，並根據該雷達信號和該反射雷達信號執行基於雷達的檢測以生成基於雷達的檢測結果，其中該基於雷達的檢測結果指示該潛在目標是否存在。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for performing object detection, performed by a first wireless communication device. The method may include: obtaining at least two channel state information (CSI), and performing a preliminary detection according to the at least two CSIs to generate a preliminary detection result in a first stage, for indicating whether potential object is detected between the first wireless communication device and a second wireless communication device; and in response to the preliminary detection result indicating that the potential object is detected, transmitting a radar signal, receiving a reflected radar signal of the radar signal, and performing a radar-based detection according to the radar signal and the reflected radar signal to generate a radar-based detection result in a second stage, for indicating whether the potential object is present.</p>
      </isu-abst>
      <representative-img>
        <p type="p">210:第一階段</p>
        <p type="p">220:第二階段</p>
        <p type="p">211,212,221,222:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1129" publication-number="202615376">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615376</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124582</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、預浸體、附樹脂之薄膜、附樹脂之金屬箔、覆金屬積層板及配線板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">C07C13/465</main-classification>
        <further-classification edition="200601120260113B">C08F112/08</further-classification>
        <further-classification edition="200601120260113B">C08L33/10</further-classification>
        <further-classification edition="200601120260113B">C08L63/00</further-classification>
        <further-classification edition="200601120260113B">C08K3/36</further-classification>
        <further-classification edition="200601120260113B">C08K7/22</further-classification>
        <further-classification edition="201801120260113B">C09J7/22</further-classification>
        <further-classification edition="200601120260113B">H05K1/05</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高城順一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKASHIRO, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤宏典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, HIROSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一面向係一種樹脂組成物，包含：下述通式(1)所示具有茚烷骨架之(甲基)丙烯酸酯化合物(A)；及中空二氧化矽粒子(B)。&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="176px" width="661px" file="ed10025.JPG" alt="ed10025.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;  上述式(1)中，X表示(甲基)丙烯醯氧基，Ra及Rb分別獨立表示碳原子數1~12之烷基、芳基、芳烷基或環烷基，j表示1~3之整數，k及l分別獨立表示0~4之整數，n為平均重複單元且表示0.5~20之數值，m表示0~2之整數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1130" publication-number="202615502">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615502</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124583</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、預浸體、附樹脂之薄膜、附樹脂之金屬箔、覆金屬積層板及配線板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">C08F212/08</main-classification>
        <further-classification edition="200601120260113B">C08K3/36</further-classification>
        <further-classification edition="200601120260113B">C07D207/448</further-classification>
        <further-classification edition="200601120260113B">C01G39/02</further-classification>
        <further-classification edition="200601120260113B">C08L25/16</further-classification>
        <further-classification edition="200601120260113B">C08L71/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高城順一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKASHIRO, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤宏典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, HIROSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一面向係一種樹脂組成物，包含：下述通式(1)所示具有茚烷骨架之(甲基)丙烯酸酯化合物(A)；分子內具有不直接鍵結於芳香環的乙烯基之苯乙烯系聚合物(B)；及硬化劑(C)。&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="178px" width="640px" file="ed10025.JPG" alt="ed10025.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;  上述式(1)中，X表示(甲基)丙烯醯氧基，Ra及Rb分別獨立表示碳原子數1~12之烷基、芳基、芳烷基或環烷基，j表示1~3之整數，k及l分別獨立表示0~4之整數，n為平均重複單元且表示0.5~20之數值，m表示0~2之整數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1131" publication-number="202616012">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616012</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124593</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G05B19/4068</main-classification>
        <further-classification edition="200601120260102B">G05B23/02</further-classification>
        <further-classification edition="202301120260102B">G06N3/0475</further-classification>
        <further-classification edition="202001120260102B">G06F40/35</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中野凜太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANO, RINTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">實施形態的控制裝置，為了控制與作業者協動來對對象物進行既定作業的產業機械，取得包含產業機械之動作中的第1感測器資訊、警告資訊、產業機械之周邊裝置的第2感測器資訊、以及與既定作業有關之處理資訊的至少任一者之狀況資料。控制裝置當根據狀況資料，偵測出既定作業中與產業機械的通常動作時不同之異常狀態時，在檢索儲存有與產業機械有關之文件的資料庫，並附加與狀況資料類似的相關文件之後，作成對生成式語言模型就狀況資料的問題點及解決方法進行提問的第1提示詞。控制裝置取得對第1提示詞之來自生成式語言模型的回答，並通知作業者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:控制裝置</p>
        <p type="p">11:資料取得部</p>
        <p type="p">12:異常偵測部</p>
        <p type="p">13:提示詞作成部</p>
        <p type="p">14:通知部</p>
        <p type="p">15:接收部</p>
        <p type="p">16:執行部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1132" publication-number="202616020">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616020</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124594</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制裝置、監視裝置及監視系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G05B23/00</main-classification>
        <further-classification edition="201801120260102B">G06F8/65</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弘中悠馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRONAKA, YUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">實施形態之監視系統，其係於同一網路內配置有複數個產業用機械的控制裝置、及將前述控制裝置作為監視對象的監視裝置的監視系統。前述控制裝置儲存用於將前述監視裝置進行之監視處理所使用的軟體升級到可對應至自身裝置之版本的升級用檔案，且當自身裝置新連接至前述網路時，識別前述升級用檔案的應用對象亦即前述監視裝置，將前述升級用檔案發送至由前述識別部所識別的前述監視裝置。前述監視裝置於當從前述控制裝置接收前述升級用檔案時，應用前述升級用檔案來升級前述軟體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:監視系統</p>
        <p type="p">10:控制裝置</p>
        <p type="p">11:控制部</p>
        <p type="p">111:識別部</p>
        <p type="p">112:發送部</p>
        <p type="p">12:儲存部</p>
        <p type="p">20:監視裝置</p>
        <p type="p">22:儲存部</p>
        <p type="p">211:接收部</p>
        <p type="p">212:判定部</p>
        <p type="p">213:應用部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1133" publication-number="202616399">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616399</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124599</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於先進封裝的TSV形成方法</chinese-title>
        <english-title>METHODS OF TSV FORMATION FOR ADVANCED PACKAGING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">H01L21/60</main-classification>
        <further-classification edition="200601120260107B">H01L21/762</further-classification>
        <further-classification edition="200601120260107B">H01L21/304</further-classification>
        <further-classification edition="200601120260107B">H01L23/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>所　鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUO, PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YING W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　源輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEE, GUAN HUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龍昌範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONG, CHANG BUM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑達羅傑　艾文德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNDARRAJAN, ARVIND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露案係關於用於先進晶圓級半導體封裝的具有互連介電屏蔽的通孔結構。本文所述的方法使得能夠在低深寬比的通孔結構內形成高厚度介電屏蔽層，從而促進具有高I/O密度及改善的帶寬及功率的薄且小形狀因數的封裝結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to through-via structures with dielectric shielding of interconnections for advanced wafer level semiconductor packaging. The methods described herein enable the formation of high thickness dielectric shielding layers within low aspect ratio through-via structures, thus facilitating thin and small-form-factor package structures having high I/O density with improved bandwidth and power.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:基板</p>
        <p type="p">202:表面</p>
        <p type="p">205:頂側</p>
        <p type="p">207:背側</p>
        <p type="p">216:頂表面</p>
        <p type="p">222:介電屏蔽層</p>
        <p type="p">350:操作</p>
        <p type="p">430:導電層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1134" publication-number="202616823">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616823</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124610</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬訊號或電源線隔離之解決方案</chinese-title>
        <english-title>METAL SIGNAL OR POWER LINE ISOLATION SOLUTIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">H10B12/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳智君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZHIJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪卡拉　拉古維爾Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKALA, RAGHUVEER S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本技術包括用於形成進階記憶結構及由此產生的裝置的方法和系統。方法包括在一或多個特徵的第一側壁、第二側壁和底表面上形成介電材料層，其中第一側壁與第二側壁彼此間隔，底表面位於第一側壁和第二側壁之間。方法還包括在第一側壁、第二側壁和底表面的介電材料層上沉積低電阻率導電材料。方法包括用犧牲隔離材料填充形成於第一側壁上的低電阻率導電材料與第二側壁上的低電阻率材料之間的間隙。方法還包括去除底表面的至少一部分，暴露出在底表面上形成的低電阻率導電材料的至少一部分並去除犧牲隔離材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present technology includes methods and systems for forming advanced memory structures, and devices therefrom. Methods include forming a dielectric material layer over a first sidewall, a second sidewall, and a bottom surface, of one or more features, where the first sidewall is spaced apart from the second sidewall and the bottom surface is disposed between the first sidewall and the second sidewall. Methods include depositing a low resistivity conductive material on the dielectric material layer on the first sidewall, the second sidewall, and the bottom surface. Methods include filling a gap formed between the low resistivity conductive material on the first sidewall and the low resistivity material on the second sidewall with a sacrificial isolation material. Methods include removing at least a portion of the bottom surface, exposing at least a portion of the low resistivity conductive material formed on the bottom surface and removing the sacrificial isolation material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:結構</p>
        <p type="p">301:基板材料</p>
        <p type="p">302:通道</p>
        <p type="p">304:特徵</p>
        <p type="p">306:介電材料</p>
        <p type="p">320:第一側壁</p>
        <p type="p">322:底表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1135" publication-number="202616405">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616405</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124621</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像處理系統、檢查系統、及影像處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/66</main-classification>
        <further-classification edition="202001120260102B">G01R31/26</further-classification>
        <further-classification edition="200601120260102B">G01N21/84</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邊真二郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, SHINJIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種能夠自動改善設定資料以適當設定基板處理之配方的技術。  &lt;br/&gt;  影像處理系統係處理半導體元件之影像資訊及探針卡之影像資訊中至少一者。影像處理系統係具備：計算部，係計算作為已取得之該影像資訊的比較影像與預先保有之登錄影像的一致率相關之資訊；比較部，係比較計算出之該一致率相關之資訊與預先保有之閾值；以及登錄部，係在該一致率相關之資訊未達該閾值時會將該比較影像加上該登錄影像後更新為新的登錄影像，另一方面，在該一致率相關之資訊為該閾值以上時不會將該比較影像加上該登錄影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">CP:比較圖案</p>
        <p type="p">EP:登錄圖案</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1136" publication-number="202616511">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616511</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124638</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>裝置封裝</chinese-title>
        <english-title>DEVICE PACKAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">H01L23/528</main-classification>
        <further-classification edition="200601120250801B">H01L23/535</further-classification>
        <further-classification edition="200601120250801B">H01L23/538</further-classification>
        <further-classification edition="200601120250801B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>愛普科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AP MEMORY TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WENLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉景宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳詩堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種裝置封裝包括第一層級、堆疊在第一層級上的第二層級以及單一地貫穿第一和第二層級的層級穿孔。第一層級包括第一裝置和電性耦合到第一裝置的第一互連線結構，第一互連線結構包括第一金屬層且第一金屬層包括第一連接分支。第二層級包括第二裝置和電性耦合到第二裝置的第二互連線結構，第二互連線結構包括第二金屬層且第二金屬層包括第二連接分支。層級穿孔電性耦合到第一和第二連接分支。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device package includes a first tier, a second tier stacked upon the first tier, and a through tier via unitarily penetrating through the first and second tiers. The first tier includes a first device and a first interconnect structure electrically coupled to the first device, the first interconnect structure includes a first metal layer, and the first metal layer includes a first connection branch. The second tier includes a second device and a second interconnect structure electrically coupled to the second device, the second interconnect structure includes a second metal layer, and the second metal layer includes a second connection branch. The through tier via is electrically coupled to the first and second connection branches.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:裝置封裝</p>
        <p type="p">100:底部層級</p>
        <p type="p">100F、200F、300F、400F:前側</p>
        <p type="p">100H、200H、300H、400H:厚度</p>
        <p type="p">102:底部基板</p>
        <p type="p">104:底部裝置/邏輯裝置</p>
        <p type="p">106:底部互連線結構</p>
        <p type="p">200:第一層級</p>
        <p type="p">200B、300B、400B:背側</p>
        <p type="p">206:第一互連線結構</p>
        <p type="p">300:第二層級</p>
        <p type="p">306:第二互連線結構</p>
        <p type="p">400:第三層級</p>
        <p type="p">406:第三互連線結構</p>
        <p type="p">510、510D:介電穿孔(TDV)/層級穿孔</p>
        <p type="p">530:鈍化結構</p>
        <p type="p">540:凸塊下金屬化(UBM)接墊</p>
        <p type="p">BRDL1:背側重佈線路層</p>
        <p type="p">CAP1:第一裝置</p>
        <p type="p">CAP2:第二裝置</p>
        <p type="p">CAP3:第三裝置</p>
        <p type="p">CAP4:第四裝置</p>
        <p type="p">DR1、DR2、DR3:額外的連接分支/連接分支</p>
        <p type="p">R1、R2、R3:連接分支</p>
        <p type="p">FB1、FB2:前側對背側的接合介面/接合介面</p>
        <p type="p">FF1:前側對前側的接合介面/接合介面</p>
        <p type="p">FRDL1:前側重佈線路層</p>
        <p type="p">M3:金屬層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1137" publication-number="202615952">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615952</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124714</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>背光模組及顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">G02F1/13357</main-classification>
        <further-classification edition="200601120250801B">G02F1/133</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞儀光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張忠成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡宇恆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾志宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種背光模組及顯示裝置，顯示裝置包括所述背光模組，其中，背光模組於其導光板之入光側設有反射單元及光源，反射單元之第一反射片具有位於入光側之一貼附部以及自該貼附部沿著該出光面延伸的一延伸部，藉由，第一反射片的光反射特性，將光源未直接投射至導光板之入光側之光線反射回導光板中，並利用延伸部將射向出光面鄰近入光側之邊緣區之光線反射回導光板中，減少漏光及熱點，並提升光能利用率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:背光模組</p>
        <p type="p">10:導光板</p>
        <p type="p">11:出光面</p>
        <p type="p">111:主出光區</p>
        <p type="p">112:邊緣區</p>
        <p type="p">12:背面</p>
        <p type="p">13:入光側</p>
        <p type="p">20:反射單元</p>
        <p type="p">21:第一反射片</p>
        <p type="p">211:貼附部</p>
        <p type="p">2111:穿孔</p>
        <p type="p">212:延伸部</p>
        <p type="p">23:黏貼件</p>
        <p type="p">30:光源</p>
        <p type="p">31:電路基板</p>
        <p type="p">32:發光元件</p>
        <p type="p">40:光學膜片組</p>
        <p type="p">41:光學膜片</p>
        <p type="p">L1、L2:光線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1138" publication-number="202616267">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616267</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124852</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>助聽器的訊號處理方法及裝置</chinese-title>
        <english-title>SIGNAL PROCESSING METHOD AND DEVICE FOR HEARING AID</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">G10L15/16</main-classification>
        <further-classification edition="200601120260115B">G10L15/22</further-classification>
        <further-classification edition="201301120260115B">G10L21/06</further-classification>
        <further-classification edition="200601120260115B">H04R25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中央研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACADEMIA SINICA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹昱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王新民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HSIN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　安德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZEZARIO, RYANDHIMAS EDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙　菲克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHMED, SHAFIQUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁惠冠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, HUI-GUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供了一種助聽器的訊號處理方法，包括：接收一輸入聲音訊號；提供一聽者聽力圖；藉由應用一神經網路基於該聽者聽力圖的表示及該輸入聲音訊號的特徵，放大該輸入聲音訊號；以及從該神經網路輸出一放大的聲音訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides a signal processing method for hearing aid, comprising: receiving an incoming sound signal; providing a listener audiogram; amplifying the incoming sound signal based on a representation of the listener audiogram and features of the incoming sound signal by using a neural network; and outputting an amplified sound signal from the neural network.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:輸入聲音訊號</p>
        <p type="p">12:聽者聽力圖</p>
        <p type="p">13:藉由應用整合型神經網路放大</p>
        <p type="p">131:處方配適公式</p>
        <p type="p">132:WDRC</p>
        <p type="p">133:STFT</p>
        <p type="p">134:全連接層</p>
        <p type="p">135:串接</p>
        <p type="p">136:神經網路</p>
        <p type="p">137:全連接層</p>
        <p type="p">138:iSTFT</p>
        <p type="p">14:放大的聲音訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1139" publication-number="202615931">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615931</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124880</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>產生用於近眼顯示器的具有內部反射器的光導的方法和中間結構</chinese-title>
        <english-title>METHODS AND INTERMEDIATE STRUCTURES FOR PRODUCING LIGHTGUIDES WITH INTERNAL REFLECTORS FOR NEAR-EYE DISPLAYS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G02B27/01</main-classification>
        <further-classification edition="200601120260102B">G02B6/00</further-classification>
        <further-classification edition="200601120260102B">G02B6/122</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商魯姆斯有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUMUS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙爾林　埃拉德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHARLIN, ELAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種用於製造在近眼顯示器中使用的具有內部部分反射表面（“小平面”）的光導部件的方法。通過使用光學黏合劑接合多個光學板而形成堆疊，其中每個黏合劑介面處的至少一個表面帶有部分反射塗層。使用間隔件部件來控制板間間隔，所述間隔件部件可以包括分散在黏合劑內的透明的、折射率匹配的固體包含物，或定位在板邊緣處的外圍間隔件元件。將黏合劑固化以形成接合的堆疊，沿不平行於板的平面對該堆疊切片以形成包含處於受控取向的內部小平面的光導部件。這些部件可以組合成組裝的光導結構，該光導結構包括耦入區域、用於面內傳播的重定向區域和將光朝向觀看者引導的耦出區域，從而實現二維孔徑擴展。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method is provided for fabricating lightguide components with internal partially-reflecting surfaces (“facets”) for use in near-eye displays. A stack is formed by bonding a plurality of optical plates using optical adhesive, with at least one surface at each adhesive interface carrying a partially reflective coating. The inter-plate spacing is controlled using spacer components, which may include transparent, index-matched solid inclusions dispersed within the adhesive, or peripheral spacer elements positioned at the plate margins. The adhesive is cured to form a bonded stack, which is sliced along planes non-parallel to the plates to form lightguide components containing internal facets at controlled orientations. These components may be combined into an assembled lightguide structure including a coupling-in region, a redirection region for in-plane propagation, and a coupling-out region directing light toward a viewer, enabling two-dimensional aperture expansion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:堆疊</p>
        <p type="p">12:板</p>
        <p type="p">30:切片</p>
        <p type="p">32,33:部件</p>
        <p type="p">34:光導結構</p>
        <p type="p">36:路徑</p>
        <p type="p">38:耦入元件</p>
        <p type="p">40:出口路徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1140" publication-number="202616866">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616866</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124889</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260102B">H10D62/10</main-classification>
        <further-classification edition="202501120260102B">H10D64/20</further-classification>
        <further-classification edition="200601120260102B">H01L23/58</further-classification>
        <further-classification edition="200601120260102B">G05F1/625</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商瑞薩電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RENESAS ELECTRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森下玄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORISHITA, FUKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體裝置，其經組態以抑制因溫度增加而增加之功率消耗之增加。一邏輯電路具有其中達成操作之一下限電壓因溫度增加而降低之特性。一參考電壓產生電路基於因溫度增加而降低之一負係數電壓Vpn2而產生一參考電壓。一電壓調節器電路基於該參考電壓產生一電力供應電壓。一電力供應電壓維持電路在因溫度增加而使該電力供應電壓低於一下限電壓之前，抑制因溫度增加而降低之該參考電壓之降低。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device configured to suppress increase in power consumption increased by temperature increase is provided. A logic circuit has characteristics in which a lower limit voltage achieving operations is decreased by temperature increase. A reference voltage generation circuit generates a reference voltage based on a negative coefficient voltage Vpn2 decreased by temperature increase. A voltage regulator circuit generates a power supply voltage based on the reference voltage. A power supply voltage maintenance circuit suppresses decrease in the reference voltage decreased by temperature increase, before the power supply voltage is made lower than a lower limit voltage by temperature increase.</p>
      </isu-abst>
      <representative-img>
        <p type="p">AMPb:專用緩衝放大器電路</p>
        <p type="p">AMPc:專用鉗位放大器電路</p>
        <p type="p">AMPd:專用驅動放大器電路</p>
        <p type="p">CK:時脈信號</p>
        <p type="p">CS1:恆定電流源</p>
        <p type="p">CS2:恆定電流源</p>
        <p type="p">LGC:邏輯電路</p>
        <p type="p">MNc:專用鉗位nMOS電晶體</p>
        <p type="p">MNr:nMOS電晶體</p>
        <p type="p">MNx:nMOS電晶體</p>
        <p type="p">MPr:pMOS電晶體</p>
        <p type="p">MPx:pMOS電晶體</p>
        <p type="p">NTATC:負至絕對溫度電路</p>
        <p type="p">PWGa:電力供應電路</p>
        <p type="p">Vcc:外部電力供應電壓</p>
        <p type="p">Vdd:電力供應電壓</p>
        <p type="p">Vlmt:極限電壓</p>
        <p type="p">VLMTG:極限電壓產生電路</p>
        <p type="p">VMN:電力供應電壓維持電路</p>
        <p type="p">Vpn2:負係數電壓/第一電壓</p>
        <p type="p">Vref:參考電壓</p>
        <p type="p">VREG:電壓調節器電路</p>
        <p type="p">VRFGa:參考電壓產生電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1141" publication-number="202615693">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615693</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124891</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用含氟材料塗佈用於半導體處理之組件</chinese-title>
        <english-title>COATING COMPONENTS FOR SEMICONDUCTOR PROCESSING WITH FLUORINE-CONTAINING MATERIALS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">C23C16/08</main-classification>
        <further-classification edition="200601120260107B">C23C16/52</further-classification>
        <further-classification edition="200601120260107B">C23C16/54</further-classification>
        <further-classification edition="200601120260107B">C23C16/30</further-classification>
        <further-classification edition="200601120260107B">H01J37/32</further-classification>
        <further-classification edition="200601120260107B">H01L21/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>狄帕克　尼汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEEPAK, NITIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛爾　萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEIL, RYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫　語南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, JENNIFER Y.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣　志鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, ZHIJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍　凱瑟琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOO, KATHERINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">範例處理方法可包括提供用於半導體處理之組件至處理腔室的處理區。此方法可包括提供一或多種沉積前驅物至處理區。此一或多種沉積前驅物可包括含金屬前驅物與含氟前驅物。此方法可包括在處理區中用於半導體處理的組件上沉積材料層。此材料層包括含金屬與氟材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Exemplary processing methods may include providing a component for semiconductor processing to a processing region of a processing chamber. The methods may include providing one or more deposition precursors to the processing region. The one or more deposition precursors may include a metal-containing precursor and a fluorine-containing precursor. The methods may include depositing a layer of material on the component for semiconductor processing in the processing region. The layer of material comprises a metal-and-fluorine-containing material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:方法</p>
        <p type="p">205,210,215,220:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1142" publication-number="202616791">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616791</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124921</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配線基板及半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H05K3/46</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商京瓷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYOCERA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久木田壮太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUKITA, SOUTAROU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南政明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINAMI, MASAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山元泉太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, SENTAROU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, DAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光岡正史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUOKA, TADASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之配線基板具備無機基材、導體、第1有機基材、第2有機基材、及接合層。無機基材以陶瓷為主成分。導體位於貫通無機基材之貫通孔之內部。第1有機基材包含含有有機成分之複數個第1有機層，且接合於無機基材之第1面。第2有機基材含有有機成分，且接合於無機基材之位於第1面之相反側之第2面。接合層分別位於第1有機基材與無機基材之間、及第2有機基材與無機基材之間。配線基板中，第1有機基材之熱膨脹率大於無機基材之熱膨脹率，且第2有機基材之熱膨脹率大於無機基材之熱膨脹率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:配線基板</p>
        <p type="p">3:半導體元件</p>
        <p type="p">10:無機基材</p>
        <p type="p">11:陶瓷層</p>
        <p type="p">12:第1貫通孔</p>
        <p type="p">20:第1有機基材</p>
        <p type="p">21:第1有機層</p>
        <p type="p">22:補強層</p>
        <p type="p">25:接合層</p>
        <p type="p">27:接合層</p>
        <p type="p">30:第2有機基材</p>
        <p type="p">31:第2有機層</p>
        <p type="p">32:補強層</p>
        <p type="p">35:第1導體</p>
        <p type="p">36:通孔</p>
        <p type="p">37:第1焊墊</p>
        <p type="p">38:第3焊墊</p>
        <p type="p">101:第1面</p>
        <p type="p">102:第2面</p>
        <p type="p">103:第3面</p>
        <p type="p">104:第4面</p>
        <p type="p">105:第5面</p>
        <p type="p">106:第6面</p>
        <p type="p">107:第7面</p>
        <p type="p">108:第8面</p>
        <p type="p">109:第9面</p>
        <p type="p">110:第10面</p>
        <p type="p">111:第11面</p>
        <p type="p">112:第12面</p>
        <p type="p">113:第13面</p>
        <p type="p">114:第14面</p>
        <p type="p">115:第15面</p>
        <p type="p">116:第16面</p>
        <p type="p">117:第17面</p>
        <p type="p">118:第18面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1143" publication-number="202615334">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615334</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124929</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一氧化碳及氫的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C01B3/40</main-classification>
        <further-classification edition="201701120260102B">C01B32/40</further-classification>
        <further-classification edition="200601120260102B">B01J23/10</further-classification>
        <further-classification edition="200601120260102B">B01J23/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商柯萊斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRASUS CHEMICAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松原仁志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUBARA, HITOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>板垣真太朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITAGAKI, SHINTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>細木康弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSOGI, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為提供一種方法，其係藉由對觸媒施加電壓，使二氧化碳與甲烷於氣相中進行反應，製造一氧化碳及氫的方法，其特徵為改善目的物之一氧化碳及氫的STY之方法。一邊於對由鈰(Ce)與Ln(Ln表示選自由釔(Y)及鑭系元素所構成之群組中之至少一種的元素)所構成之複合金屬氧化物載體，載持釕(Ru)的觸媒流通電流，一邊在反應溫度80~400℃，於觸媒的存在下，使二氧化碳與甲烷於氣相中進行反應之一氧化碳及氫的製造方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:二氧化碳與甲烷的反應裝置</p>
        <p type="p">2:觸媒層</p>
        <p type="p">3:反應管</p>
        <p type="p">4:高壓側電極</p>
        <p type="p">5:接地側電極</p>
        <p type="p">6:電源</p>
        <p type="p">7:加熱器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1144" publication-number="202614993">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614993</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124930</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>穩定化脂質</chinese-title>
        <english-title>STABILIZING LIPIDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260114B">A61K9/127</main-classification>
        <further-classification edition="200601120260114B">A61K31/7088</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比利時商ｅＴｈｅＲＮＡ免疫治療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ETHERNA IMMUNOTHERAPIES NV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕多瓦大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIVERSITY OF PADUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡司米　薩巴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASMI, SABAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德科克　史黛芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE KOKER, STEFAAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芙拉卡索　阿爾貝托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRACASSO, ALBERTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝內蒂　艾德蒙多　瑪麗亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENETTI, EDMONDO MARIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅蘭迪　弗蘭西斯卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LORANDI, FRANCESCA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明總體上係關於脂質之領域，尤其穩定化脂質，且尤其提供諸如由本文中所揭示之任何化學式表示之新穎類型的此等脂質。本發明亦提供用於製造此等脂質之方法以及其用途，尤其在製備奈米粒子組成物，更尤其包含活性劑之奈米粒子組成物中之用途。本發明亦提供醫藥調配物，其包含基於本文所揭示之穩定化脂質之奈米粒子組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention generally relates to the field of lipids, in particular stabilizing lipids, and in particular provides a novel type of such lipids as represented by any of the formula disclosed herein. The present invention further provides methods for making such lipids as well as uses thereof, in particular in the preparation of nanoparticle compositions, more in particular nanoparticle compositions comprising active agents. It further provides pharmaceutical formulations comprising nanoparticle compositions based on the stabilizing lipids disclosed herein.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1145" publication-number="202615346">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615346</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124932</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>由二氧化碳製備沉澱二氧化矽之方法</chinese-title>
        <english-title>A METHOD FOR PREPARING PRECIPITATED SILICA FROM CARBON DIOXIDE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C01B33/12</main-classification>
        <further-classification edition="200601120260105B">C01B33/18</further-classification>
        <further-classification edition="200601120260105B">C01B33/32</further-classification>
        <further-classification edition="200601120260105B">C08K3/36</further-classification>
        <further-classification edition="200601120260105B">C08L9/06</further-classification>
        <further-classification edition="200601120260105B">A61K8/25</further-classification>
        <further-classification edition="200601120260105B">A61Q11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商羅地亞經營管理公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RHODIA OPERATIONS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費洛馬丁　賽德里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FERAL-MARTIN, CEDRIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯納德　喬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERNARD, JOEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格勞　波琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRAU, PAULINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞里奧爾　帕斯卡琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAURIOL, PASCALINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布特里夫　阿卜杜勒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOUTRIF, ABDEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於沉澱二氧化矽、其生產方法及其應用，如聚合物組成物中的增強填料材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to precipitated silica, a production method thereof and its applications, such as reinforcing filler material in polymer compositions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1146" publication-number="202615875">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615875</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124940</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電性連接裝置</chinese-title>
        <english-title>ELECTRICAL CONNECTION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">G01R1/073</main-classification>
        <further-classification edition="202001120260112B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本麥克隆尼股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KABUSHIKI KAISHA NIHON MICRONICS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>横内匡俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOUCHI, MASATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福士直城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHI, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅田竜一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMEDA, RYUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奈良勇斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARA, YUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">電性連接裝置係具備：探針；探針導引件，係支持探針；探針墊，係連接有探針的基端部；及配線基板。探針導引件係支持已穿通從第一面貫穿到朝向第一面之相反方向的第二面的導引孔之狀態的探針，且具有與導引孔連通而形成於第二面的凹部。探針墊係配置於凹部的內部。配線基板係與第二面相向並積層於探針導引件，且包含與探針墊電性連接的內部配線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical connection device according to the present invention includes a probe, a probe guide supporting the probe, a probe pad connected to the base end of the probe, and a wiring substrate. The probe guide supports the probe in a state where the probe passes through a guide hole extending from a first surface to a second surface facing the opposite direction from the first surface, and the probe guide has a recess formed in the second surface that communicates with the guide hole. The probe pad is located within the recess. The wiring substrate is stacked on the probe guide facing the second surface and includes internal wiring that is electrically connected to the probe pad.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電性連接裝置</p>
        <p type="p">2:檢查對象物</p>
        <p type="p">10G:接地探針</p>
        <p type="p">10S:信號探針</p>
        <p type="p">10V:電源探針</p>
        <p type="p">20:探針導引件</p>
        <p type="p">30:探針墊</p>
        <p type="p">40:配線基板</p>
        <p type="p">41:基板</p>
        <p type="p">42:薄膜</p>
        <p type="p">200:導引孔</p>
        <p type="p">201:第一面</p>
        <p type="p">202:第二面</p>
        <p type="p">210:凹部</p>
        <p type="p">220:側面配線層</p>
        <p type="p">231:第一電源層</p>
        <p type="p">232:第二電源層</p>
        <p type="p">410:電極端子</p>
        <p type="p">L1:第一配線層</p>
        <p type="p">L2:第二配線層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1147" publication-number="202615169">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615169</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124955</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>離子脈衝空氣噴射裝置及使用該裝置的乾式清洗系統和方法</chinese-title>
        <english-title>IONIZED PULSE AIR INJECTION DEVICE AND SYSTEM AND METHOD FOR DRY CLEANING USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250716B">B08B11/00</main-classification>
        <further-classification edition="200601120250716B">B08B5/00</further-classification>
        <further-classification edition="200601120250716B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商通盈科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOINTECH INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳東錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, DONG SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明實施例的離子脈衝空氣噴射裝置包括：壓力調節部，用以將從外部供應的空氣的壓力值調節至設定壓力值；脈衝產生部，用以產生脈衝，所述脈衝用於以設定頻帶的脈衝形式供應調節至所述設定壓力值的空氣；離子產生部，用以電離從所述脈衝產生部以脈衝形式供應的空氣；以及離子脈衝空氣噴射部，用以將在所述離子產生部電離的脈衝形式的空氣噴射到清洗物件的表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:乾式清洗系統</p>
        <p type="p">100:製造執行系統(MES)</p>
        <p type="p">200:故障檢測和分類伺服器(FDC伺服器)</p>
        <p type="p">300:設備</p>
        <p type="p">400:離子脈衝空氣噴射裝置</p>
        <p type="p">500:無線通訊通道</p>
        <p type="p">CH:通訊通道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1148" publication-number="202615106">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615106</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124980</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>治療癌症之方法</chinese-title>
        <english-title>METHODS OF TREATING CANCER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">A61K51/02</main-classification>
        <further-classification edition="200601120260109B">A61K51/04</further-classification>
        <further-classification edition="200601120260109B">A61K51/06</further-classification>
        <further-classification edition="200601120260109B">C07B59/00</further-classification>
        <further-classification edition="200601120260109B">C07F5/00</further-classification>
        <further-classification edition="200601120260109B">G01N33/60</further-classification>
        <further-classification edition="200601120260109B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商安德賽特公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDOCYTE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞莫　艾利森　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARMOUR, ALISON A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文所述之發明係關於用於靶向療法之藥物遞送結合物。本文所述之發明係關於用式1化合物治療表現PSMA之癌症的方法。本文所述之發明亦係關於用式1化合物治療患者中表現PSMA之癌症的方法，其中以該式1化合物治療後產生穩定疾病。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention described herein pertains to drug delivery conjugates for targeted therapy. The invention described herein relates to methods of treating PSMA expressing cancers with a compound of the formula 1. .The invention described herein also relates to methods of treating PSMA-expressing cancers with a compound of the formula 1 in patients where stable disease results after treatment with the compound of the formula 1.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1149" publication-number="202615239">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615239</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125000</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>射出成型機之最佳控制支持裝置及方法</chinese-title>
        <english-title>OPTIMAL CONTROL SUPPORT APPARATUS AND METHOD FOR INJECTION MOLDING MACHINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">B29C45/76</main-classification>
        <further-classification edition="200601120260114B">B29C45/63</further-classification>
        <further-classification edition="202301120260114B">G06N3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商願景創新股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VISION INNOVATION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭熙運</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEONG, HEE WOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭明</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王奕軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種用於抑制在射出成型機產生有害氣體的射出成型機最佳控制輔助裝置及輔助方法，更具體地，通過應用田口方法（Taguchi Method）並作為特性值使用氣體收集數據，獲取基於控制參數數據的特徵向量的特性值的信噪比（Signal-to-Noise Ratio），並準備使用特徵向量預測信噪比的模型，在用於製程的多個控制參數數據中，根據使用模型預測的信噪比推薦最佳控制參數數據，並將其應用於射出成型機的製程執行中，由此最小化氣體產生量的變動，並且減少氣體產生量，從而能夠穩定地淨化所產生的氣體後進行排放。此技術是在韓國政府（科學技術訊息通訊部）的資助下，在韓國訊息通訊企劃評估院的支持下進行的區域智能化創新人才培育事業開發的成果（RS-2024-00436765）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an auxiliary device and an auxiliary method for optimal control of an injection molding machine to suppress generation of harmful gases in the injection molding machine. More specifically, by applying the Taguchi Method and using gas collection data as characteristic values, the Signal-to-Noise Ratio of the characteristic values of feature vectors based on control parameter data is obtained, and a model for predicting the Signal-to-Noise Ratio by using the feature vectors is prepared, and among multiple sets of control parameter data for the process, optimal control parameter data is recommended according to the Signal-to-Noise Ratio predicted by the model and applied to the execution of the process of the injection molding machine, which minimizes variation in gas generation amount and reduces the gas generation amount, thereby enabling stable purification and subsequent emission of generated gases. This technology was developed through the Regional Smart Innovation Talent Development Project supported by the Institute for Information &amp;amp; Communications Technology Planning &amp;amp; Evaluation and funded by the Korean government (Ministry of Science and ICT) (Project No. RS-2024-00436765).</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10~S70:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1150" publication-number="202615868">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615868</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125009</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>計測裝置以及準備方法</chinese-title>
        <english-title>MEASURING APPARATUS AND PREPARATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G01P5/08</main-classification>
        <further-classification edition="200601120260102B">G01F1/64</further-classification>
        <further-classification edition="200601120260102B">G06F17/10</further-classification>
        <further-classification edition="201801120260102B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青木竜哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOKI, RYUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斎藤奎介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種能響應性佳且精密度佳地計測流體的流速之技術。計測裝置2係具有壓電感測器50以及運算部60。首先，運算部60係將從壓電感測器50輸出的電壓值的時間序列資料進行傅立葉轉換，藉此取得振幅譜。接著，運算部60係算出振幅譜中的特定的頻率範圍的積分值。之後，運算部60係基於積分值算出流體的流速。計測裝置2係利用壓電感測器50，藉此能響應性佳地計測流速。此外，不將從壓電感測器50輸出的電壓值直接轉換成流速，而是基於振幅譜的積分值算出流體的流速。藉此，能精密度佳地計測流速。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:計測裝置</p>
        <p type="p">50:壓電感測器</p>
        <p type="p">60:運算部</p>
        <p type="p">61:處理器</p>
        <p type="p">62:記憶體</p>
        <p type="p">63:記憶部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1151" publication-number="202616860">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616860</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125084</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>SIGE奈米片通道的形成</chinese-title>
        <english-title>FORMATION OF SIGE NANOSHEET CHANNELS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260112B">H10D30/67</main-classification>
        <further-classification edition="202501120260112B">H10D62/10</further-classification>
        <further-classification edition="202501120260112B">H10D62/832</further-classification>
        <further-classification edition="202501120260112B">H10D84/03</further-classification>
        <further-classification edition="202501120260112B">H10D84/85</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝巴德　喬瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEPARD, JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫布勒　莉迪亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUEBLER, LYDIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗隆海瑟　喬迪Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRONHEISER, JODY A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普蘭薩西哈蘭　巴拉薩拉瑪年</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRANATHARTHIHARAN, BALASUBRAMANIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述了半導體元件，特別是水平環繞式閘極元件及其製造方法。該方法包括在第一材料上形成包覆材料，然後在包覆層上形成帽層。該元件經過快速熱退火處理，溫度低於850°C，以形成均勻的矽鍺（SiGe）通道。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Semiconductor devices, specifically horizontal gate-all-around devices and methods of manufacture are described. The method includes formation of a cladding material on a first material followed by forming a cap layer on the cladding layer. The device is subjected to a rapid thermal anneal process at a temperature less than 850 °C to form a uniform silicon germanium (SiGe) channel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">224:第一材料</p>
        <p type="p">250:包覆材料</p>
        <p type="p">256:帽層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1152" publication-number="202616764">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616764</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125104</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>針對處於不同狀態的環境無線裝置的基於讀取器的排程</chinese-title>
        <english-title>READER-BASED SCHEDULING FOR AMBIENT WIRELESS DEVICES IN DIFFERENT STATES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260102B">H04W74/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內野徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UCHINO, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭瑞明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, RUIMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克里希南　尚卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRISHNAN, SHANKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福耶爾　優美西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHUYAL, UMESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述用於無線通訊的方法、系統、及裝置。大致上，所描述技術使得讀取器裝置能夠在第一排程週期期間，根據共同排程方案將一或多個訊息傳輸至一或多個環境無線裝置，且可在第二排程週期期間，根據專用方案將一或多個第二訊息傳輸至一或多個環境無線裝置。讀取器裝置可基於排程週期切換準則經滿足而切換排程方案。在一些實例中，讀取器裝置可在共同排程週期與專用排程週期之間週期性地或動態地切換。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods, systems, and devices for wireless communications are described. Generally, the described techniques enable a reader device to transmit one or more messages to one or more ambient wireless devices in accordance with the common scheduling scheme during a first scheduling period and may transmit one or more second messages to the one or more ambient wireless devices in accordance with a dedicated scheme during a second scheduling period. The reader device may switch scheduling schemes based on a scheduling period switching criterion being satisfied. In some examples, the reader device may switch between the common scheduling period and the dedicated scheduling period periodically or dynamically.</p>
      </isu-abst>
      <representative-img>
        <p type="p">105-A:網路實體</p>
        <p type="p">115-A:UE</p>
        <p type="p">125-A:通訊鏈路</p>
        <p type="p">200:無線通訊系統</p>
        <p type="p">205-A:第一環境無線裝置</p>
        <p type="p">205-B:第二環境無線裝置</p>
        <p type="p">210-A,210-B:下行鏈路傳輸</p>
        <p type="p">215-A,215-B:上行鏈路傳輸</p>
        <p type="p">220-A,220-B:指示</p>
        <p type="p">225:共同訊息；第二共同訊息</p>
        <p type="p">225-A,225-B:共同訊息</p>
        <p type="p">230-A:第一命令訊息</p>
        <p type="p">230-B:命令訊息</p>
        <p type="p">235-A,235-B:回應訊息</p>
        <p type="p">240-A,240-B:命令回應訊息</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1153" publication-number="202615990">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615990</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125177</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理系統、基板處理方法及記錄媒體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260106B">G03F7/20</main-classification>
        <further-classification edition="200601120260106B">H01L21/027</further-classification>
        <further-classification edition="200601120260106B">H01L23/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>志村悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMURA, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉原孝介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIHARA, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達文多爾發　阿諾　艾倫　吉恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAUENDORFFER, ARNAUD ALAIN JEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於藉由氣體處理而在基板形成光阻膜的時候提高處理效率。  &lt;br/&gt;解決手段為：本發明的基板處理系統具備：一個處理容器及其他處理容器，分別形成儲存基板的一個處理空間、其他處理空間；環境調整機構，將包含前述一個處理空間及前述其他處理空間的調整區域調整成相較於該調整區域的外側的第1環境具有低氧濃度及低濕度、並且具有前述外側的壓力或者接近該壓力的壓力的第2環境；光阻膜成膜裝置，具備前述一個處理容器，對於具有前述第2環境的前述一個處理空間供給含有光阻成分的氣體，而在前述基板形成光阻膜；及熱處理裝置，具備前述其他處理容器，並且在前述第2環境將前述光阻膜曝光之前的前述基板予以加熱。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:晶圓處理系統</p>
        <p type="p">3:處理站</p>
        <p type="p">6:光阻膜成膜裝置</p>
        <p type="p">8:熱處理裝置</p>
        <p type="p">31:層</p>
        <p type="p">32:晶圓搬運區域</p>
        <p type="p">33:晶圓搬運區域</p>
        <p type="p">90:晶圓搬運區域</p>
        <p type="p">91:框體</p>
        <p type="p">92:搬運臂</p>
        <p type="p">93:基台</p>
        <p type="p">94:移動機構</p>
        <p type="p">95:晶圓搬運裝置</p>
        <p type="p">96:排氣機構</p>
        <p type="p">96A:排氣口</p>
        <p type="p">97:N&lt;sub&gt;2&lt;/sub&gt;氣體供給機構</p>
        <p type="p">97A:氣體供給口</p>
        <p type="p">G1:第1區塊</p>
        <p type="p">G2:第2區塊</p>
        <p type="p">R0:調整區域</p>
        <p type="p">R1:上部區域</p>
        <p type="p">R2:下部區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1154" publication-number="202616488">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616488</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125186</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置、半導體裝置之製造方法、及電子機器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L23/28</main-classification>
        <further-classification edition="200601120260102B">H01L23/18</further-classification>
        <further-classification edition="200601120260102B">H01L23/488</further-classification>
        <further-classification edition="200601120260102B">H01L21/764</further-classification>
        <further-classification edition="200601120260102B">B32B27/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼半導體解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池邉祐希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEBE, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡崎涼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAZAKI, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>合庭健介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIBA, KENSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>細川広陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSOKAWA, KOHYOH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>信原智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOBUHARA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>児玉遼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KODAMA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提高半導體裝置之可靠性。  &lt;br/&gt;本發明之半導體裝置具備：半導體零件，其具有半導體基板、保護基板、及設置於半導體基板及保護基板之間並使半導體基板及保護基板接著之接著樹脂；安裝基板，其被安裝半導體零件；及保護樹脂，其與半導體零件之側面接觸；且至少於接著樹脂之一部分與保護樹脂之間形成空隙。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體裝置</p>
        <p type="p">11:CSP</p>
        <p type="p">12:安裝基板</p>
        <p type="p">13:焊球</p>
        <p type="p">14:底部填料</p>
        <p type="p">15:空隙</p>
        <p type="p">21:半導體基板</p>
        <p type="p">22:接著樹脂</p>
        <p type="p">23:保護基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1155" publication-number="202616463">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616463</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125228</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>安裝裝置，半導體製造裝置及半導體裝置的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251230B">H01L21/683</main-classification>
        <further-classification edition="200601120251230B">G05B19/416</further-classification>
        <further-classification edition="200601120251230B">G05B19/402</further-classification>
        <further-classification edition="201701120251230B">G06T7/70</further-classification>
        <further-classification edition="200601120251230B">B65G43/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商捷進科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FASFORD TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>栗田哲平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURITA, TEPPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楯充明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TATE, MITSUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題是在於提供一種無需等待辨識結果即可驅動移動體的技術。  &lt;br/&gt;　　其解決手段，亦即，安裝裝置是具備：  &lt;br/&gt;　　移動體；  &lt;br/&gt;　　驅動部，其驅動前述移動體；  &lt;br/&gt;　　攝像裝置，其拍攝前述移動體的目標位置；及  &lt;br/&gt;　　控制部，其被構成為根據前述攝像裝置所拍攝的影像算出前述目標位置的同時，根據基礎目標位置藉由前述驅動部驅動前述移動體，並將前述基礎目標位置設定為始終比所算出的前述目標位置更靠前的位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">83e:馬達控制裝置</p>
        <p type="p">110:運動控制器</p>
        <p type="p">112:指令波形生成部(CWG)</p>
        <p type="p">120:馬達驅動器</p>
        <p type="p">122:速度迴路控制部(SLC)</p>
        <p type="p">130:馬達(M)</p>
        <p type="p">211:理想波形生成部</p>
        <p type="p">Aobj:目標加速度的振幅值</p>
        <p type="p">AP:實際位置</p>
        <p type="p">AS:實際速度</p>
        <p type="p">113:類比轉換器</p>
        <p type="p">ENC:編碼器訊號</p>
        <p type="p">Jobj:目標加加速度的振幅值</p>
        <p type="p">Pobj:目標位置的振幅值</p>
        <p type="p">Pocj:辨識位置波形的振幅</p>
        <p type="p">PA0:實際位置</p>
        <p type="p">SCV:速度指令值</p>
        <p type="p">VD”1:指令速度波形</p>
        <p type="p">Vobj:目標速度的振幅值</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1156" publication-number="202615882">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615882</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125235</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>測試封裝基板的方法、操作用於測試封裝基板的設備的方法及用於測試封裝基板的設備</chinese-title>
        <english-title>METHOD OF TESTING A PACKAGING SUBSTRATE, METHOD OF OPERATING AN APPARATUS FOR TESTING OF A PACKAGING SUBSTRATE, AND APPARATUS FOR TESTING A PACKAGING SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">G01R31/28</main-classification>
        <further-classification edition="200601120260112B">G01R31/305</further-classification>
        <further-classification edition="201901120260112B">G01R31/396</further-classification>
        <further-classification edition="200601120260112B">H01J3/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆勒　博哈德Ｇ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUELLER, BERNHARD G.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫茲爾　艾希爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENZEL, AXEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了利用至少一個帶電粒子束柱來測試封裝基板的方法。該方法包含將封裝基板放置在真空腔室中的工作台上；在封裝基板上的第一位置對至少一個帶電粒子束柱的帶電粒子束進行消光；在帶電粒子束被消光的情況下，將帶電粒子束從封裝基板的第一位置向量掃描至第二位置，該向量掃描是基於對帶電粒子束的一或多個帶電粒子束性質的第一校準以及對帶電粒子束的束位置的第二校準；在第二位置上對帶電粒子束進行去消光；在第二位置對帶電粒子束進行消光；在帶電粒子束被消光的情況下，將帶電粒子束從第二位置向量掃描至封裝基板上的第三位置，該向量掃描是基於第一校準和第二校準；以及基於從至少第三位置接收到的訊號，在真空腔室中測試封裝基板上的一或多個網路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of testing a packaging substrate with at least one charged particle beam column is described. The method includes placing the packaging substrate on a stage in a vacuum chamber; blanking a charged particle beam of the at least one charged particle beam column at a first position on the packing substrate; vector scanning the charged particle beam from the first position on the packaging substrate to a second position on the packaging substrate while the charged particle beam is blanked, the vector scanning being based upon a first calibration of one or more charged particle beam properties of the charged particle beam and being based upon a second calibration of a beam position of the charged particle beam; un-blanking the charged particle beam onto the second position; blanking the charged particle beam at the second position; vector scanning the charged particle beam from the second position to a third position on the packaging substrate while the charged particle beam is blanked, the vector scanning being based upon the first calibration and the second calibration; and testing one or more networks on the packaging substrate in the vacuum chamber based upon signals received from at least the third position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:封裝基板</p>
        <p type="p">20:電氣互連路徑</p>
        <p type="p">21:第一表面接觸點</p>
        <p type="p">22:第二表面接觸點</p>
        <p type="p">23:電氣互連路徑</p>
        <p type="p">27:表面接觸點</p>
        <p type="p">100:設備</p>
        <p type="p">105:工作台</p>
        <p type="p">106:電源</p>
        <p type="p">110:真空腔室</p>
        <p type="p">111:電子束</p>
        <p type="p">113:訊號電子</p>
        <p type="p">120:電子束柱</p>
        <p type="p">121:電子源</p>
        <p type="p">122:掃描偏轉器</p>
        <p type="p">123:掃描控制器</p>
        <p type="p">124:透鏡組件</p>
        <p type="p">125:第二掃描偏轉器</p>
        <p type="p">126:消像散器</p>
        <p type="p">128:束接收器</p>
        <p type="p">130:電源</p>
        <p type="p">140:電子偵測器</p>
        <p type="p">141:分析單元</p>
        <p type="p">142:能量過濾器</p>
        <p type="p">146:第一複數個電極</p>
        <p type="p">148:第二複數個電極</p>
        <p type="p">154:電極</p>
        <p type="p">180:控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1157" publication-number="202616011">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616011</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125240</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>工作機械的誤差補正方法、工作機械的誤差補正系統、及工作機械</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G05B19/404</main-classification>
        <further-classification edition="200601120260102B">G05B19/29</further-classification>
        <further-classification edition="202301120260102B">H04N23/67</further-classification>
        <further-classification edition="200601120260102B">G01B11/03</further-classification>
        <further-classification edition="200601120260102B">B23Q5/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商芝浦機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBAURA MACHINE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋山貴信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKIYAMA, TAKANOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土屋康二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUCHIYA, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">工作機械(1)，具有：載置工件的工作台(12)、裝設有工具(17)的主軸(16)、使工作台(12)及工具(17)相對移動的移動機構(18)、及控制移動機構(18)的控制裝置(20)，具有：設置於工作機械(1)的第1部分(工作台(12))，並且光學刻度沿一方向排列的基準器(31)、設置於藉由移動機構(18)對第1部分相對移動的第2部分(主軸頭(15))，並且用於檢測基準器(31)的圖像的圖像檢測器(32)、及從由圖像檢測器(32)檢測到的檢測圖像讀取光學刻度，以測定第1部分及第2部分的位置誤差，並根據測定到的位置誤差對移動機構(18)的動作進行補正的誤差補正裝置(33)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:工作機械</p>
        <p type="p">10:工作機械本體</p>
        <p type="p">11:基座</p>
        <p type="p">12:工作台</p>
        <p type="p">13:架</p>
        <p type="p">14:橫桿</p>
        <p type="p">15:主軸頭</p>
        <p type="p">16:主軸</p>
        <p type="p">17:工具</p>
        <p type="p">18:移動機構</p>
        <p type="p">20:控制裝置</p>
        <p type="p">21:動作控制部</p>
        <p type="p">22:加工程式</p>
        <p type="p">30:誤差補正系統</p>
        <p type="p">31:基準器</p>
        <p type="p">32:圖像檢測器</p>
        <p type="p">33:誤差補正部</p>
        <p type="p">121:X軸移動機構</p>
        <p type="p">131:立柱</p>
        <p type="p">141:Z軸移動機構</p>
        <p type="p">151:Y軸移動機構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1158" publication-number="202615151">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615151</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125273</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>乙酸烯丙酯製造用觸媒及乙酸烯丙酯製造用觸媒之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B01J37/02</main-classification>
        <further-classification edition="200601120260102B">B01J37/04</further-classification>
        <further-classification edition="200601120260102B">B01J37/16</further-classification>
        <further-classification edition="200601120260102B">B01J21/08</further-classification>
        <further-classification edition="200601120260102B">B01J23/89</further-classification>
        <further-classification edition="202401120260102B">B01J35/30</further-classification>
        <further-classification edition="202401120260102B">B01J35/32</further-classification>
        <further-classification edition="202401120260102B">B01J35/40</further-classification>
        <further-classification edition="202401120260102B">B01J35/61</further-classification>
        <further-classification edition="200601120260102B">C07C67/055</further-classification>
        <further-classification edition="200601120260102B">C07C69/155</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商柯萊斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRASUS CHEMICAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩間康拓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWAMA, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>五十嵐諒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IGARASHI, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>細木康弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSOGI, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種於由丙烯、氧及乙酸製造乙酸烯丙酯之際，能賦予經改善的時空產率之乙酸烯丙酯製造用觸媒。一種將(a)鈀、(b)銥、(c)選自銅、鎳、鋅及鈷中之至少一種元素、以及(d)鹼金屬鹽擔載於(e)載體上之乙酸烯丙酯製造用觸媒。特別是，(a)鈀、(b)銥、(c)選自銅、鎳、鋅及鈷中之至少一種元素的合計量、以及(d)鹼金屬鹽的質量比，較佳為(a)：(b)：(c)：(d)=100：5.0～17.0：5.0～150.0：150～4000。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1159" publication-number="202616320">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616320</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125275</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多帶電粒子束描繪方法，多帶電粒子束描繪裝置，及用來令電腦執行之程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01J37/147</main-classification>
        <further-classification edition="200601120260102B">H01J37/302</further-classification>
        <further-classification edition="201801120260102B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商紐富來科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUFLARE TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本裕史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種藉由高精度的描繪裝置，不需做硬體的更換，便可描繪以低精度的描繪裝置得到的精度的圖案之多帶電粒子束描繪方法，多帶電粒子束描繪裝置，及用來令電腦執行之程式。  &lt;br/&gt;　　本發明的一態樣之多帶電粒子束描繪方法，係將從格子狀地以等間距排列的複數個理想網格挪移至少一部分的網格的相對位置而成的複數個描繪網格設定為試料的描繪區域，運用多射束，以照射挪移至少一部分的網格的相對位置而成的複數個描繪網格之方式，對試料描繪圖案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S102,S104,S106,S110,S112,S120,S122,S130:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1160" publication-number="202615300">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615300</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125415</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢驗系統及檢驗方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250719B">B64C39/02</main-classification>
        <further-classification edition="200601120250719B">B64D47/08</further-classification>
        <further-classification edition="200601120250719B">F03D1/06</further-classification>
        <further-classification edition="200601120250719B">G01B11/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>屋嘉広行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAKA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平野正博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRANO, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之目的在於提供一種適當進行風力發電設備之檢驗之檢驗系統等。  &lt;br/&gt;本揭示之檢驗系統100具備：通信部17，其設置於風力發電設備W1，與固定翼之無人飛行器20之間進行通信；及控制部18，其控制風力發電設備W1之致動器；且控制部18於風力發電設備W1之葉片14a、14b、14c旋轉期間，以無人飛行器20之相機22拍攝葉片14a時，與無人飛行器20之間進行協調控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:塔</p>
        <p type="p">12:機艙</p>
        <p type="p">13:輪轂</p>
        <p type="p">14a:葉片</p>
        <p type="p">14b:葉片</p>
        <p type="p">14c:葉片</p>
        <p type="p">15:偏航控制用馬達(致動器)</p>
        <p type="p">16a:俯仰控制用馬達(致動器)</p>
        <p type="p">16b:俯仰控制用馬達(致動器)</p>
        <p type="p">16c:俯仰控制用馬達(致動器)</p>
        <p type="p">17:通信部</p>
        <p type="p">18:控制部</p>
        <p type="p">20:無人飛行器</p>
        <p type="p">21:機體</p>
        <p type="p">21a:主翼(固定翼)</p>
        <p type="p">22:相機</p>
        <p type="p">23:收發部</p>
        <p type="p">24:處理部</p>
        <p type="p">25:電池</p>
        <p type="p">26:記錄媒體</p>
        <p type="p">30:電腦</p>
        <p type="p">31:記憶部</p>
        <p type="p">32:輸入部</p>
        <p type="p">33:處理部</p>
        <p type="p">34:顯示部</p>
        <p type="p">100:檢驗系統</p>
        <p type="p">W1:風力發電設備</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1161" publication-number="202616132">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616132</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125520</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自迴歸生成式人工智慧模型中的使用預報嵌入的自推測解碼</chinese-title>
        <english-title>SELF-SPECULATIVE DECODING USING FORECASTED EMBEDDINGS IN AUTOREGRESSIVE GENERATIVE ARTIFICIAL INTELLIGENCE MODELS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260102B">G06F40/284</main-classification>
        <further-classification edition="202001120260102B">G06F40/35</further-classification>
        <further-classification edition="202301120260102B">G06N3/0475</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明谷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MINGU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈爾　拉加夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOEL, RAGHAVV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全元錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, WONSEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加格拉尼　穆克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAGRANI, MUKUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樸俊英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JUNYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛特　克里斯多夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOTT, CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的某些態樣提供用於在一生成式人工智慧模型中產生對一查詢輸入的一回應的技術及設備。一種實例方法大致上包括接收一輸入提示以用於處理；使用一參數預測模型針對該輸入提示產生一組預報參數；基於該輸入提示及該組預報參數，而使用一生成式人工智慧模型產生對該輸入提示的一回應；及輸出經產生的該回應。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Certain aspects of the present disclosure provide techniques and apparatus for generating a response to a query input in a generative artificial intelligence model. An example method generally includes receiving an input prompt for processing; generating a set of forecasted parameters for the input prompt using a parameter prediction model; generating, using a generative artificial intelligence model, a response to the input prompt based on the input prompt and the set of forecasted parameters; and outputting the generated response.</p>
      </isu-abst>
      <representative-img>
        <p type="p">800:操作</p>
        <p type="p">810:方塊</p>
        <p type="p">820:方塊</p>
        <p type="p">830:方塊</p>
        <p type="p">840:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1162" publication-number="202615862">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615862</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125580</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>偵測溶液中之分析物的可重複使用試劑匣</chinese-title>
        <english-title>REUSABLE CARTRIDGES FOR DETECTING ANALYTES IN SOLUTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">G01N33/53</main-classification>
        <further-classification edition="200601120260113B">G01N33/543</further-classification>
        <further-classification edition="200601120260113B">G01N33/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商建南德克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENENTECH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波拉克　山穆爾　班傑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POLLOCK, SAMUEL BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示涉及製備包含基質的可重複使用且可乾燥的試劑匣之方法，該等基質包含偵測分子，例如抗體，以用於偵測或富集樣品中之分析物，例如被抗體識別的抗原。在一些實施方案中，該試劑匣包含保持該基質的管或孔。在一些實施方案中，該基質或相關試劑匣可以濕性或乾燥儲存。本揭示亦涉及該等試劑匣及其使用方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure relates to methods of preparing re-usable and dry-able cartridges comprising matrices comprising a detection molecule such as an antibody, for detection or enrichment of an analyte in a sample, such as an antigen recognized by an antibody. In some embodiments, the cartridge comprises a tube or well that holds the matrix. In some embodiments, the matrix or associated cartridges may be stored wet or dry. The disclosure also relates to the cartridges and methods of their use.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1163" publication-number="202615431">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615431</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125593</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>２－（３，５－二氯－４－（（５－異丙基－６－側氧基－１，６－二氫噠嗪－３－基）氧）苯基）－３，５－二側氧基－２，３，４，５－四氫－１，２，４－三嗪－６－腈之固體型式</chinese-title>
        <english-title>SOLID FORMS OF 2-(3,5-DICHLORO-4-((5-ISOPROPYL-6-OXO-1,6-DIHYDROPYRIDAZIN-3-YL)OXY)PHENYL)- 3,5-DIOXO-2,3,4,5-TETRAHYDRO-1,2,4-TRIAZINE-6-CARBONITRILE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">C07D403/12</main-classification>
        <further-classification edition="200601120260112B">A61K31/501</further-classification>
        <further-classification edition="200601120260112B">A61P1/16</further-classification>
        <further-classification edition="200601120260112B">A61P3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商瑪德瑞高製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MADRIGAL PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米梅拉比　馬墨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIRMEHRABI, MAHMOUD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤那斯　馬可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JONAS, MARCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴楚　帕凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BATCHU, PAVAN KARTHIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於2-(3,5-二氯-4-((5-異丙基-6-側氧基-1,6-二氫噠嗪-3-基)氧)苯基)-3,5-二側氧基-2,3,4,5-四氫-1,2,4-三嗪-6-腈之形態型式、共晶體、鹽及非晶形固態分散物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is directed to morphic forms, co-crystals, salts, and amorphous solid dispersions of 2-(3,5-dichloro-4-((5-isopropyl-6-oxo-1,6-dihydropyridazin-3-yl)oxy)phenyl)-3,5-dioxo-2,3,4,5-tetrahydro-1,2,4-triazine-6-carbonitrile.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1164" publication-number="202615703">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615703</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125610</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置，電漿生成方法，半導體裝置的製造方法及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C23C16/452</main-classification>
        <further-classification edition="200601120260102B">C23C16/455</further-classification>
        <further-classification edition="200601120260102B">C23C16/50</further-classification>
        <further-classification edition="200601120260102B">C23C16/52</further-classification>
        <further-classification edition="200601120260102B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坪田康寿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUBOTA, YASUTOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本克彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, KATSUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹島雄一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKESHIMA, YUICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井川博登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IGAWA, HIROTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山角宥貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAKADO, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岸本宗樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISHIMOTO, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基板處理裝置，其具有：  &lt;br/&gt;　　處理室，其處理基板；  &lt;br/&gt;　　氣體供給部，其連接到前述處理室，並能將含有第一元素和與前述第一元素不同的第二元素的氣體，或含有前述第一元素的氣體與含有前述第二元素的氣體的混合氣體作為供給氣體供給到前述處理室；  &lt;br/&gt;　　激勵部，其能從供給到前述處理室的供給氣體來生成含有前述第一元素的第一自由基和含有前述第二元素的第二自由基；及  &lt;br/&gt;　　活化部，其設置在比前述激勵部更靠近前述基板的載置部，並能從前述供給氣體來個別地活化前述第一自由基和前述第二自由基。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:處理裝置(基板處理裝置)</p>
        <p type="p">200:晶圓(基板)</p>
        <p type="p">201:處理室</p>
        <p type="p">201a:電漿生成空間</p>
        <p type="p">201b:基板處理空間</p>
        <p type="p">202:處理爐</p>
        <p type="p">203:處理容器</p>
        <p type="p">210:上側容器</p>
        <p type="p">211:下側容器</p>
        <p type="p">212:共振線圈</p>
        <p type="p">213:可動抽頭</p>
        <p type="p">214:固定接地點</p>
        <p type="p">215:可動抽頭</p>
        <p type="p">217:基座</p>
        <p type="p">217a:貫通孔</p>
        <p type="p">217b:加熱器</p>
        <p type="p">217c:調整電極</p>
        <p type="p">221:控制器</p>
        <p type="p">223:遮蔽板</p>
        <p type="p">231:氣體排氣管</p>
        <p type="p">232,232a,232b,232c:氣體供給管</p>
        <p type="p">233:蓋體</p>
        <p type="p">234:氣體導入孔</p>
        <p type="p">235:氣體排氣口</p>
        <p type="p">236:氣體供給頭</p>
        <p type="p">237:緩衝室</p>
        <p type="p">238:開口</p>
        <p type="p">239:氣體吹出口</p>
        <p type="p">240:遮蔽板</p>
        <p type="p">242:APC閥</p>
        <p type="p">243a,243b:閥</p>
        <p type="p">244:閘閥</p>
        <p type="p">245:搬入出口</p>
        <p type="p">246:真空泵</p>
        <p type="p">250a:第一元素氣體供給源</p>
        <p type="p">250b:第二元素氣體供給源</p>
        <p type="p">250c:惰性氣體供給源</p>
        <p type="p">252a:質量流量控制器(MFC)</p>
        <p type="p">252b,252c:MFC</p>
        <p type="p">253a,253b,253c:閥</p>
        <p type="p">266:晶圓頂升銷</p>
        <p type="p">268:基座升降機構</p>
        <p type="p">272:RF感測器</p>
        <p type="p">273:高頻電源</p>
        <p type="p">274:頻率匹配器</p>
        <p type="p">275:阻抗可變機構</p>
        <p type="p">276:加熱器電力調整機構</p>
        <p type="p">280a:第一活化部</p>
        <p type="p">280b:第二活化部</p>
        <p type="p">281a:第一電力供給部</p>
        <p type="p">281b:第二電力供給部</p>
        <p type="p">282a:第一檢測部</p>
        <p type="p">282b:第二檢測部</p>
        <p type="p">A,B,C,D,E,F,G,H,I:訊號線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1165" publication-number="202615583">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615583</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125625</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱傳導易拆解接著組合物、熱傳導易拆解接著片材、接合體及接合體之拆解方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">C08L63/04</main-classification>
        <further-classification edition="200601120260113B">C08G59/18</further-classification>
        <further-classification edition="201801120260113B">C09J7/26</further-classification>
        <further-classification edition="200601120260113B">C09J11/06</further-classification>
        <further-classification edition="200601120260113B">C09J123/14</further-classification>
        <further-classification edition="200601120260113B">B32B27/24</further-classification>
        <further-classification edition="200601120260113B">B32B27/38</further-classification>
        <further-classification edition="201801120260113B">C08K3/105</further-classification>
        <further-classification edition="200601120260113B">C04B35/536</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮崎義和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAZAKI, YOSHIKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下卓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種熱傳導易拆解接著組合物，其可形成熱傳導性優異，顯示出牢固地接著被接著體之優異之接著力，且拆解性優異之熱傳導易拆解接著層。本發明係關於一種熱傳導易拆解接著組合物、熱傳導易拆解接著片材、拆解性優異之接合體、及接合體之拆解方法，其中，上述熱傳導易拆解接著組合物包含無機膨脹劑及樹脂，且由上述熱傳導易拆解接著組合物所形成之熱傳導易拆解接著層受到刺激則被破壞，熱傳導率為1.0 W/mK以上，對鋁板之剪切接著力為2.5 MPa以上，上述熱傳導易拆解接著片材包含該熱傳導易拆解接著層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1166" publication-number="202615532">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615532</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125709</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚胺基甲酸酯分散液及油墨組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08G18/18</main-classification>
        <further-classification edition="200601120260102B">C08G18/28</further-classification>
        <further-classification edition="201401120260102B">C09D11/30</further-classification>
        <further-classification edition="201801120260102B">C09J7/21</further-classification>
        <further-classification edition="200601120260102B">C08L75/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甲田千佳子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOUDA, CHIKAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福田和幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUDA, KAZUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之聚胺基甲酸酯分散液係聚胺基甲酸酯樹脂經水分散所成。聚胺基甲酸酯樹脂係異氰酸酯基末端預聚物與鏈延長劑之反應生成物。異氰酸酯基末端預聚物係聚異氰酸酯成分與含有大分子多元醇及含親水基活性氫化合物之多元醇成分的反應生成物。聚胺基甲酸酯樹脂之重量平均分子量為50000以上。聚異氰酸酯成分與鏈延長劑為既定組合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1167" publication-number="202616472">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616472</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125738</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶圓搬運設備及晶圓搬運方法</chinese-title>
        <english-title>APPARATUS FOR HANDLING A WAFER AND METHOD OF HANDLING A WAFER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/687</main-classification>
        <further-classification edition="200601120260102B">H01L21/677</further-classification>
        <further-classification edition="200601120260102B">H01L21/66</further-classification>
        <further-classification edition="200601120260102B">H01L21/68</further-classification>
        <further-classification edition="200601120260102B">B65G49/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商美特拉斯有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METRYX LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃姆斯伯里　尼古拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMESBURY, NICHOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝利斯　克里斯多福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAYLISS, CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">晶圓搬運設備包括：用於支撐晶圓的支撐件；用於將晶圓放置於支撐件上或從支撐件抓取晶圓的末端執行器；以及用於使末端執行器沿垂直方向移動以將晶圓放置於支撐件上或從支撐件抓取晶圓的致動器，其中該末端執行器包括感測器，設備配置為至少部分基於感測器的輸出，於將晶圓放置於支撐件上或從支撐件抓取晶圓時偵測事件，且設備配置為於偵測到事件時從致動器獲取位置資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Apparatus for handling a wafer, comprising: a support for supporting a wafer; an end effector for placing the wafer onto the support or for picking the wafer up from the support; and an actuator for moving the end effector in a vertical direction to place the wafer onto the support or to pick the wafer up from the support, wherein the end effector comprises a sensor, the apparatus is configured to detect an event when placing the wafer onto the support or when picking the wafer up from the support based at least in part on an output of the sensor, and the apparatus is configured to obtain positional information from the actuator when the event is detected.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:設備</p>
        <p type="p">3:稱重裝置</p>
        <p type="p">5:秤盤</p>
        <p type="p">7:腔室</p>
        <p type="p">9:溫度調節部件</p>
        <p type="p">13:溫度調節部件</p>
        <p type="p">15:帕耳帖裝置</p>
        <p type="p">17:散熱器</p>
        <p type="p">18:晶圓載具</p>
        <p type="p">19:氣流</p>
        <p type="p">21:區域</p>
        <p type="p">22:控制器(處理器)</p>
        <p type="p">50:記憶體</p>
        <p type="p">W:晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1168" publication-number="202616133">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616133</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125744</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及電子裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">G06G7/60</main-classification>
        <further-classification edition="202301120260107B">G06N3/063</further-classification>
        <further-classification edition="200601120260107B">G11C7/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商半導體能源研究所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村肇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, HAJIME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黒川義元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUROKAWA, YOSHIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種能夠以低功耗進行積和運算的半導體裝置。本發明的一個實施方式是一種包括第一、第二電路的半導體裝置，第一電路包括第一保持節點，第二電路包括第二保持節點。第一電路與第一、第二輸入佈線及第一、第二佈線電連接，第二電路與第一、第二輸入佈線及第一、第二佈線電連接，第一、第二電路的每一個具有將對應於第一資料的第一、第二電位保持在第一、第二保持節點的功能。藉由對第一、第二輸入佈線輸入對應於第二資料的電位，第一電路向第一佈線和第二佈線的一方輸出電流，第二電路向第一佈線和第二佈線的另一方輸出電流。第一、第二電路向第一佈線或第二佈線輸出的電流根據第一、第二保持節點所保持的第一、第二電位決定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">MP:電路</p>
        <p type="p">MC:電路</p>
        <p type="p">MCr:電路</p>
        <p type="p">HC:保持部</p>
        <p type="p">HCr:保持部</p>
        <p type="p">IL:佈線</p>
        <p type="p">ILB:佈線</p>
        <p type="p">OL:佈線</p>
        <p type="p">OLB:佈線</p>
        <p type="p">WL:佈線</p>
        <p type="p">X1L:佈線</p>
        <p type="p">X2L:佈線</p>
        <p type="p">VL:佈線</p>
        <p type="p">VLr:佈線</p>
        <p type="p">ina:節點</p>
        <p type="p">inb:節點</p>
        <p type="p">outa:節點</p>
        <p type="p">outb:節點</p>
        <p type="p">nd1:節點</p>
        <p type="p">nd1r:節點</p>
        <p type="p">M1:電晶體</p>
        <p type="p">M1r:電晶體</p>
        <p type="p">M2:電晶體</p>
        <p type="p">M2r:電晶體</p>
        <p type="p">M3:電晶體</p>
        <p type="p">M3r:電晶體</p>
        <p type="p">M4:電晶體</p>
        <p type="p">M4r:電晶體</p>
        <p type="p">C1:電容器</p>
        <p type="p">C1r:電容器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1169" publication-number="202615348">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615348</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125748</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硫氧化物吸附成分、硫氧化物吸附劑、硫氧化物的吸附脫離方法、及排氣處理系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260106B">C01B33/14</main-classification>
        <further-classification edition="200601120260106B">B01D53/04</further-classification>
        <further-classification edition="202501120260106B">C01G45/1221</further-classification>
        <further-classification edition="200601120260106B">B01J20/06</further-classification>
        <further-classification edition="200601120260106B">D21H27/06</further-classification>
        <further-classification edition="200601120260106B">C01G49/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商科納維股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANADEVIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤井一輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJII, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西田侑介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIDA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤岡公一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIOKA, KOHICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日野尚荣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HINO, NAOE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日数谷進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIKAZUDANI, SUSUMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的硫氧化物吸附成分含有氧化錳，氧化錳的晶體結構為正方晶及/或六方晶。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:排氣處理系統</p>
        <p type="p">2:排氣通路</p>
        <p type="p">10:硫氧化物吸附部</p>
        <p type="p">20:排氣處理部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1170" publication-number="202615374">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615374</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125782</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>肥料用原料及肥料用原料之製造方法、肥料之製造方法、以及、液體性肥料用原料及液體性肥料用原料之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260106B">C05G3/20</main-classification>
        <further-classification edition="200601120260106B">C05F7/04</further-classification>
        <further-classification edition="200601120260106B">C05F11/00</further-classification>
        <further-classification edition="202001120260106B">C05F17/993</further-classification>
        <further-classification edition="200601120260106B">C03B27/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商優瑞納股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EUGLENA CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>静井章朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIZUKAI, AKIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤原祐輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIWARA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉岡勉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIOKA, TSUTOMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村弘人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, HIROTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前柳佳孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEYANAGI, YOSHITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>花城拓史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANASHIRO, TAKUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>横山一樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOYAMA, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種肥料用原料之製造方法，其特徵在於：將玻璃藉由包含硝酸鉀之熔融鹽進行離子交換，將上述熔融鹽進行冷卻固化，而獲得含硝酸鉀之鹽。又，本發明亦係關於一種肥料用原料，其特徵在於：其係包含複數個塊者，且於上述肥料用原料中，水溶性鉀相對於上述肥料用原料之比率為40 wt%以上，且硝酸性氮相對於上述肥料用原料之總重量之比率為11 wt%以上，上述肥料用原料每10 kg採取每1個之質量為50 g以上150 g以下之上述塊2個時，上述2個塊之水溶性鉀之濃度差為6.0 wt%以下，且硝酸性氮之濃度差為1.9 wt%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1171" publication-number="202616789">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616789</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125922</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配線基板及其製造方法和配線基板之樹脂去除裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H05K3/06</main-classification>
        <further-classification edition="201401120260102B">B23K26/402</further-classification>
        <further-classification edition="201401120260102B">B23K26/082</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商野田士克林股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NODA SCREEN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤良忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, YOSHITADA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森康充</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, YASUMITSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]謀求對被形成於基板的表面之樹脂層進行研磨的研磨工程之生產率的提升或防止對於基板的損傷抑或成本降低。  &lt;br/&gt;　　[解決手段]在執行將形成於核心基板(2)的表面之樹脂層(6)的一部分去除之樹脂去除工程的配線基板之製造方法中，在執行樹脂去除工程之前執行雷射照射工程，該雷射照射工程，係對樹脂層(6)之表面上於樹脂去除工程中樹脂被去除的預定之區域的全部或一部分照射雷射(16)，藉此，使樹脂脆弱化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:印刷電路基板</p>
        <p type="p">2:核心基板</p>
        <p type="p">4:樹脂</p>
        <p type="p">6:樹脂層</p>
        <p type="p">16:雷射</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1172" publication-number="202616327">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616327</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125976</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在半導體偵測器中形成頂部電極之內埋部分之方法</chinese-title>
        <english-title>METHOD OF FORMING A BURIED PORTION OF A TOP ELECTRODE IN SEMICONDUCTOR DETECTORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">H01J37/244</main-classification>
        <further-classification edition="200601120260113B">H01J37/28</further-classification>
        <further-classification edition="202501120260113B">H10F30/29</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅瑞托　詹保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LORITO, GIANPAOLO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>耐田諾　史多元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIHTIANOV, STOYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁　心清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, XINQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金井建一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANAI, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述一種用於臨界尺寸掃描電子顯微鏡(CD-SEM)中且再檢測SEM系統的偵測器。在一項實施例中，該偵測器包括一半導體結構，該半導體結構具有一p-n接面及一掃描射束被傳遞至一目標所通過之一孔。該偵測器亦包括用於該p-n接面之一頂部電極(例如陽極或陰極)，該頂部電極提供用於偵測電子或電磁輻射(例如來自該目標之後向散射)之一作用區域。該頂部電極具有一摻雜層且亦可具有該摻雜層之下之一內埋部分，以在不改變該作用區域的情況下減少該頂部電極之一串聯電阻。在另一實施例中，一隔離結構可在該半導體結構中在該孔之側壁附近形成，以將該作用區域與該等側壁電隔離。亦描述一種用於形成該頂部電極之該內埋部分之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure describes a detector used in critical dimension scanning electron microscopes (CD-SEM) and review SEM systems. In one embodiment, the detector includes a semiconductor structure having a p-n junction and a hole through which a scanning beam is passed to a target. The detector also includes a top electrode for the p-n junction (e.g., anode or cathode) that provides an active area for detecting electrons or electromagnetic radiation (e.g., backscattering from the target). The top electrode has a doped layer and can also have a buried portion beneath the doped layer to reduce a series resistance of the top electrode without changing the active area. In another embodiment, an isolation structure can be formed in the semiconductor structure near sidewalls of the hole to electrically isolate the active area from the sidewalls. A method for forming the buried portion of the top electrode is also described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10:步驟</p>
        <p type="p">S20:步驟</p>
        <p type="p">S30:步驟</p>
        <p type="p">S40:步驟</p>
        <p type="p">S50:步驟</p>
        <p type="p">S60:步驟</p>
        <p type="p">S70:步驟</p>
        <p type="p">S80:步驟</p>
        <p type="p">S90:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1173" publication-number="202616778">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616778</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126019</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於非正弦產生器的高精度偵測器</chinese-title>
        <english-title>HIGH ACCURACY DETECTOR FOR NON-SINUSOIDAL GENERATOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H05H1/46</main-classification>
        <further-classification edition="200601120260102B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＭＫＳ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MKS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索瑞爾　札克立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SORRELL, ZACHARY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞多姆斯基　亞倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RADOMSKI, AARON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電源供應器系統包括：射頻產生器，其被配置為向負載輸出非正弦訊號；至少一個寬頻傳輸感測器，其被配置為測量非正弦訊號的電壓和電流中的至少一個；以及控制器，其耦合到射頻產生器。此控制器被配置為自至少一個寬頻傳輸感測器接收與非正弦訊號相關聯的波形，確定波形中的數個諧波分量中的每一個的未經校準值，並且基於相對應的未經校準值和至少一個寬頻傳輸感測器的頻率響應來產生數個諧波分量中的每一個的經校準值。本文也揭露用於射頻產生器的其它實例電源供應器、電腦可讀取媒體和控制器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power supply system includes a RF generator configured to output a nonsinusoidal signal to a load, at least one wideband sensor configured to measure at least one of a voltage and a current of the nonsinusoidal signal, and a controller coupled to the RF generator. The controller is configured to receive a waveform associated with the nonsinusoidal signal from the at least one wideband sensor, determine an uncalibrated value at each of a number of harmonic components of the waveform, and generate a calibrated value at each of the number of harmonic components based on the corresponding uncalibrated value and a frequency response of the at least one wideband sensor. Other example power supplies, computer-readable mediums, and controllers for RF generators are also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">410:功率產生系統</p>
        <p type="p">412a:源產生器</p>
        <p type="p">412b:偏置產生器</p>
        <p type="p">414b&lt;sub&gt;1&lt;/sub&gt;、414b&lt;sub&gt;(n-1)&lt;/sub&gt;、414b&lt;sub&gt;n&lt;/sub&gt;:功率放大器模組</p>
        <p type="p">416b:寬頻傳輸感測器/感測器</p>
        <p type="p">418:匹配和濾波網路</p>
        <p type="p">432:負載</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1174" publication-number="202615997">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615997</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126076</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯影方法、顯影裝置及記錄媒體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">G03F7/26</main-classification>
        <further-classification edition="200601120260113B">H01L21/027</further-classification>
        <further-classification edition="200601120260113B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寺下裕一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERASHITA, YUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小玉輝彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KODAMA, TERUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大塚幸信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKA, YUKINOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山中晋一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMANAKA, SHINICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之顯影方法，使用包含弱酸之氣體及氣霧的至少其中任一方在內的顯影用流體，令基板良好地顯影。本發明之顯影方法，包含令形成有光阻被膜且被實施過曝光處理的基板顯影的步驟；該顯影步驟，將顯影用流體供給到處理空間內，以令該處理空間內的該基板顯影；該顯影用流體，係從顯影用液體生成，包含弱酸之氣體及氣霧的至少其中任一方，且該弱酸之濃度經過調整。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S10:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1175" publication-number="202615746">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615746</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126213</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於促進冷卻的紡織品</chinese-title>
        <english-title>TEXTILE CONFIGURED TO PROMOTE COOLING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260102B">D03D15/527</main-classification>
        <further-classification edition="202101120260102B">D03D15/233</further-classification>
        <further-classification edition="200601120260102B">D04B21/12</further-classification>
        <further-classification edition="200601120260102B">D04B21/16</further-classification>
        <further-classification edition="200601120260102B">D04B1/22</further-classification>
        <further-classification edition="200601120260102B">A41D13/005</further-classification>
        <further-classification edition="200601120260102B">A41D27/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商耐克創新有限合夥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKE INNOVATE C.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豪金森　凱倫　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAWKINSON, KAREN A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩根　丹尼爾　Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORGAN, DANIEL P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文各方面涉及一種紡織品，該紡織品包括由第一多根紗線或纖維形成的第一層。該第一層包括第一組孔口，每個孔口具有第一開口大小。該紡織品還包括由第二多根紗線或纖維形成的第二層。該第二層包括第二組孔口。該第二組孔口中的每個孔口與第一組孔口中的對應孔口軸向對準。第二組孔口中的每個孔口具有第二開口大小，該第二開口大小小於第一組孔口中的孔口的第一開口大小。第一層比第二層相對更親水。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Aspects herein are directed to textile that includes a first layer formed from a first plurality of yarns or fibers. The first layer includes a first set of apertures, each aperture having a first opening size. The textile further includes a second layer formed from a second plurality of yarns or fibers. The second layer includes a second set of apertures. Each aperture in the second set of apertures is axially aligned with a corresponding aperture in the first set of apertures. Each aperture in the second set of apertures has a second opening size that is smaller than the first opening size of apertures in the first set of apertures. The first layer is relatively more hydrophilic than the second layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:針織間隔紡織品</p>
        <p type="p">110:第一針織層</p>
        <p type="p">112:第二針織層</p>
        <p type="p">113:第二多根紗線</p>
        <p type="p">114:多根系結紗線</p>
        <p type="p">115:通常從視圖中隱藏的系結紗線114的各部分代表系結紗線114的與分別形成第一針織層110和第二針織層112的紗線相互串套的那些區域</p>
        <p type="p">116:第一組孔口</p>
        <p type="p">116a:孔口</p>
        <p type="p">118:第一開口大小</p>
        <p type="p">120:第二組孔口</p>
        <p type="p">120a:孔口</p>
        <p type="p">122:第二開口大小</p>
        <p type="p">124:軸向對準線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1176" publication-number="202616904">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616904</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126269</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>攝像元件及攝像裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260102B">H10F39/18</main-classification>
        <further-classification edition="202301120260102B">H04N25/78</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼半導體解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>末永亮介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUENAGA, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辻清茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUJI, KIYOSHIGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴田智彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBATA, TOMOHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丸山俊介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARUYAMA, SHUNSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於能夠抑制像素電路之規模大型化，且能夠將複數個像素每一者之信號電荷相加。  &lt;br/&gt;本發明之攝像元件包含：光電轉換膜，其遍設於複數個像素；第1像素，其於前述複數個像素之中，具有與前述光電轉換膜電性連接之像素電路；及第2像素，其於前述複數個像素之中，具有與前述光電轉換膜非電性連接之狀態之像素電路。第1像素配置為能夠蓄積第2像素所產生之信號電荷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:光電轉換部</p>
        <p type="p">10d:非讀出像素/像素</p>
        <p type="p">10k:加算像素/像素</p>
        <p type="p">11A:第1Cu電極</p>
        <p type="p">11B:第2Cu電極</p>
        <p type="p">12:第1半導體層</p>
        <p type="p">12A:擴散區域</p>
        <p type="p">13:光電轉換膜</p>
        <p type="p">14:第2半導體層</p>
        <p type="p">15:第2電極</p>
        <p type="p">16:鈍化膜</p>
        <p type="p">17:層間絕緣膜</p>
        <p type="p">20:電路基板</p>
        <p type="p">20d,20k:像素電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1177" publication-number="202616387">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616387</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126274</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法、半導體裝置之製造方法、基板處理裝置及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/311</main-classification>
        <further-classification edition="200601120260102B">H01L21/762</further-classification>
        <further-classification edition="200601120260102B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野野村一樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NONOMURA, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>磯邊紀之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISOBE, NORIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江田輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EDA, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可形成具有所期望之特性(例如，足夠的薄度、高介電率、及高絕緣性等)之膜的技術。  &lt;br/&gt;本發明具有：第1混合膜形成步驟，其進行(a)準備於表面被形成有第1結晶膜之基板的步驟，上述第1結晶膜含有已結晶化之第1物質、及(b)於上述第1結晶膜上形成含有非晶質的第2物質之第1非晶質膜的步驟，而於上述基板上形成第1厚度的第1混合膜，其含有已結晶化之上述第1物質及非晶質之上述第2物質；以及(c)於上述第1混合膜形成步驟之前，對與上述第1厚度相關聯之在上述第1混合膜形成步驟中之處理量進行設定，以使上述第1厚度的上述第1物質之非晶質膜的結晶化溫度高於塊體的上述第1物質之非晶質的結晶化溫度的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:晶圓(基板)</p>
        <p type="p">301:第1結晶膜</p>
        <p type="p">302:第2結晶膜</p>
        <p type="p">303:第3結晶膜</p>
        <p type="p">401:第1非晶質膜</p>
        <p type="p">402:第2非晶質膜</p>
        <p type="p">501:第1混合膜</p>
        <p type="p">502:第2混合膜</p>
        <p type="p">503:第3混合膜</p>
        <p type="p">Ta1、Ta2、Tc1、Tc2:厚度</p>
        <p type="p">Tm1:第1厚度</p>
        <p type="p">Tm2:第2厚度</p>
        <p type="p">Tm3:第3厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1178" publication-number="202615562">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615562</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126290</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>縮合聚合物之解聚合方法及其反應器系統</chinese-title>
        <english-title>METHOD OF DEPOLYMERIZING A CONDENSATION POLYMER AND REACTOR SYSTEM THEREFOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08J11/24</main-classification>
        <further-classification edition="200601120260102B">B01J19/00</further-classification>
        <further-classification edition="200601120260102B">B01J19/24</further-classification>
        <further-classification edition="202201120260102B">G01F23/00</further-classification>
        <further-classification edition="200601220260102B">C08L67/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商愛奧尼亞解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IONIQA SOLUTIONS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德　佛里斯　特耶克　詹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE VRIES, TJERK JAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述一種在載液中解聚合縮合聚合物之方法。該方法包括以下步驟：將載液與分散於其中之固體縮合聚合物之反應混合物提供於反應器容器中，該反應混合物具有自由表面；提供用於測量該反應器容器中該反應混合物之該自由表面之液位的構件；使含在該載液中之該縮合聚合物經受解聚合反應，以在該載液中產生單體及其寡聚物；在該解聚合反應期間以規則時間間隔或連續測量該反應混合物之該自由表面之液位以確定成反應時間之函數關係之自由表面液位曲線，該自由表面液位曲線顯示成反應時間之函數關係之以下後續階段：(i)該自由表面液位之可選下降、(ii)該自由表面液位之上升及(iii)該自由表面液位之穩定化；及繼續該解聚合反應直至至少階段(iii)之起始。亦描述一種反應器系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described is a method of depolymerizing a condensation polymer in a carrier liquid. The method comprises the steps of providing a reaction mixture of a carrier liquid with a solid condensation polymer dispersed therein in a reactor vessel, the reaction mixture having a free surface; providing a means for measuring the level of the free surface of the reaction mixture in the reactor vessel; subjecting the condensation polymer in the carrier liquid to a depolymerization reaction to produce monomers and oligomers thereof in the carrier liquid; measuring the level of the free surface of the reaction mixture at regular time intervals or continuously during the depolymerization reaction to determine a free surface level profile as a function of reaction time, said free surface level profile showing the subsequent phases of (i) an optional decline of the free surface level, (ii) a rise of the free surface level and (iii) a stabilization of the free surface level as a function of reaction time; and continuing the depolymerization reaction until at least the onset of phase (iii). A reactor system is also described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:反應器容器</p>
        <p type="p">1a:頂部部分</p>
        <p type="p">1b:中間部分</p>
        <p type="p">1c:底部部分</p>
        <p type="p">2:氣態體積</p>
        <p type="p">2a:入口</p>
        <p type="p">2b:入口</p>
        <p type="p">3:載液分散體</p>
        <p type="p">3a:出口</p>
        <p type="p">4:表面液位測量構件</p>
        <p type="p">D:直徑</p>
        <p type="p">F:距離</p>
        <p type="p">H:高度</p>
        <p type="p">L:液位</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1179" publication-number="202616933">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616933</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126307</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有分隔件之顯示面板及包含其之電子裝置</chinese-title>
        <english-title>DISPLAY PANEL HAVING SEPARATORS AND ELECTRONIC DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">H10K59/122</main-classification>
        <further-classification edition="202301120260102B">H10K59/131</further-classification>
        <further-classification edition="202301120260102B">H10K59/12</further-classification>
        <further-classification edition="201301120260102B">G06F3/048</further-classification>
        <further-classification edition="201801120260102B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星顯示器有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴注燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JUCHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高裕敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, YOOMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金善浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示面板，包含：一驅動元件層，該驅動元件層包含一像素驅動器；一發光元件，位於該驅動元件層上，該發光元件包含一下電極；一中間層，包含至少一發光層及一上電極；一像素定義膜，位於該驅動元件層上；一連接電極，由一導電材料製成，該連接電極位於該像素定義膜上，且電性連接至該像素驅動器及該上電極；一第一分隔件，位於該像素定義膜上，該像素定義膜與該發光元件相鄰；以及一第二分隔件，位於該像素定義膜上，且該第二分隔件與該第一分隔件間隔開，其中，該第一分隔件包含與該發光元件相鄰的一第一側表面及面向該第二分隔件的一第二側表面，且該第一連接電極設置在至少一部分的該第一側表面上，並且該導電材料暴露該第二側表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display panel includes a driving element layer including a pixel driver, a light-emitting element on the driving element layer and including a lower electrode, an intermediate layer including at least a light-emitting layer, and a upper electrode, a pixel defining film on the driving element layer, a connection electrode formed of a conductive material on the pixel defining film and electrically connected to the pixel driver and the upper electrode, a first separator on the pixel defining film adjacent to the light-emitting element, and a second separator on the pixel defining film and spaced apart from the first separator, wherein the first separator includes a first side surface adjacent to the light-emitting element and a second side surface facing the second separator, and the first connection electrode is disposed on at least a portion of the first side surface, and the conductive material exposes the second side surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">60:第六絕緣層</p>
        <p type="p">AA':區域</p>
        <p type="p">AP:附加虛設層</p>
        <p type="p">AP1:第一附加虛設層</p>
        <p type="p">AP1a:第(1-1)附加虛設層</p>
        <p type="p">AP1b:第(1-2)附加虛設層</p>
        <p type="p">AP2:第二附加虛設層</p>
        <p type="p">BB':區域</p>
        <p type="p">CNE1:第一連接電極，連接電極</p>
        <p type="p">CNE2:第二連接電極，連接電極</p>
        <p type="p">EL11:第一下電極，下電極</p>
        <p type="p">EL12:第二下電極，下電極</p>
        <p type="p">EL21:第一上電極，上電極，第一陰極</p>
        <p type="p">EL22:第二上電極，上電極，第二陰極</p>
        <p type="p">EML1:第一發光層，發光層</p>
        <p type="p">EML2:第二發光層，發光層</p>
        <p type="p">FNL1:第一功能層，功能層</p>
        <p type="p">FNL11:第一中間功能層</p>
        <p type="p">FNL12:第二中間功能層</p>
        <p type="p">FNL2:第二功能層，功能層</p>
        <p type="p">FNL21:第三中間功能層</p>
        <p type="p">FNL22:第四中間功能層</p>
        <p type="p">II-II':線</p>
        <p type="p">IML1:第一中間層，中間層</p>
        <p type="p">IML2:第二中間層，中間層</p>
        <p type="p">LD1:第一發光元件，發光元件</p>
        <p type="p">LD2:第二發光元件，發光元件</p>
        <p type="p">PDL:像素定義膜</p>
        <p type="p">S1:間隔距離</p>
        <p type="p">S2:間隔距離</p>
        <p type="p">S3:間隔距離</p>
        <p type="p">SPR:分隔件</p>
        <p type="p">SPR1:第一分隔件，分隔件</p>
        <p type="p">SPR2:第二分隔件，分隔件</p>
        <p type="p">SS1:第一側表面，側表面</p>
        <p type="p">SS2:第二側表面，側表面</p>
        <p type="p">SS3:第三側表面，側表面</p>
        <p type="p">SS4:第四側表面，側表面</p>
        <p type="p">UP:虛設層</p>
        <p type="p">UP1:第一虛設層</p>
        <p type="p">UP1a:第(1-1)虛設層</p>
        <p type="p">UP1b:第(1-2)虛設層</p>
        <p type="p">UP2:第二虛設層</p>
        <p type="p">UP3:第三虛設層</p>
        <p type="p">UP3a:第(3-1)虛設層</p>
        <p type="p">UP3b:第(3-2)虛設層</p>
        <p type="p">UP4:第四虛設層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1180" publication-number="202615011">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615011</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126312</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療對第一病毒療法之治療無反應之病毒感染之吲哚啉基化合物</chinese-title>
        <english-title>INDOLINYL COMPOUND FOR TREATMENT OF VIRAL INFECTIONS UNRESPONSIVE TO TREATMENT WITH A FIRST ANTIVIRAL THERAPY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/44</main-classification>
        <further-classification edition="200601120260102B">A61K31/403</further-classification>
        <further-classification edition="200601120260102B">A61P31/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商基利科學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GILEAD SCIENCES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅西耶　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCIER, ALEXANDRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奈爾　瓦爾莎　瓦里賈克尚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAIR, VARSHA VARIJAKSHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬特奧　費爾南德斯　羅伯托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATEO FERNANDEZ, ROBERTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅　林賽　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAY, LINDSEY A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何　沛殷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, PUI YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>理查茲　克里斯多福　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHARDS, CHRISTOPHER M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於使用吲哚啉基化合物治療及預防對一或多種第一抗病毒療法之治療無反應之病毒感染之方法及醫藥調配物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides methods and pharmaceutical formulations for the treatment and prophylaxis of a viral infection unresponsive to treatment with one or more first antiviral therapy using an indolinyl compound.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1181" publication-number="202615286">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615286</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126333</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢測雙輪載具傾斜角之測量誤差的方法</chinese-title>
        <english-title>METHOD FOR DETECTING MEASUREMENT ERRORS IN THE ANGLE OF INCLINATION OF A TWO-WHEELED VEHICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260114B">B62J45/415</main-classification>
        <further-classification edition="200601120260114B">G01C25/00</further-classification>
        <further-classification edition="201301120260114B">G01P15/02</further-classification>
        <further-classification edition="200601120260114B">F02N11/10</further-classification>
        <further-classification edition="200601120260114B">G01C9/00</further-classification>
        <further-classification edition="200601120260114B">G06F17/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商舍弗勒科技股份有限兩合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHAEFFLER TECHNOLOGIES AG &amp; CO. KG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富瑞茂克思　琴路克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FREMAUX, JEAN-LUC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關一種檢測雙輪載具(1)的側向傾斜角(θ)中之測量誤差的方法，包含以下步驟：&lt;br/&gt;  在第一相位中，檢查(E3)該載具(1)之引擎(10)是否停止；&lt;br/&gt;  如果引擎(10)停止，則比較(E6)傾斜感測器(111)相對至少一個參考傾斜範圍的測量值；&lt;br/&gt;  如果電子控制單元(11)確定測量值超出參考範圍，則檢測到傾斜角(θ)之測量值中的誤差；&lt;br/&gt;  於第二相位中，啟動(E7)載具(1)之引擎(10)；&lt;br/&gt;  當引擎(10)運轉時，計算(E8)傾斜感測器(111)的測量值中之變動；&lt;br/&gt;  如果傾斜感測器(111)的測量值中之變動係在預定持續時間內低於一預定閾值，則檢測(E9)傾斜角(θ)的測量誤差。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a method for detecting measurement errors in the lateral angle of inclination (θ) of a two-wheeled vehicle (1), comprising the steps of:&lt;br/&gt; in a first phase, checking (E3) that the engine (10) of the vehicle (1) is stopped;&lt;br/&gt; if the engine (10) is stopped, comparing (E6) the measurements of the inclination sensor (111) relative to the at least one reference inclination range;&lt;br/&gt; if the electronic control unit (11) determines that the measurements are outside the reference range, detecting an error in the measurement of the angle of inclination (θ);&lt;br/&gt; in a second phase, starting (E7) the engine (10) of the vehicle (1);&lt;br/&gt; computing (E8) the variation in the measurements of the inclination sensor (111) while the engine (10) is running;&lt;br/&gt; if the variation in the measurements of the inclination sensor (111) is below a predetermined threshold for a predetermined duration, detecting (E9) an error in the measurement of the angle of inclination (θ).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:載具</p>
        <p type="p">10:引擎</p>
        <p type="p">11:電子控制單元</p>
        <p type="p">12:支架</p>
        <p type="p">111:傾斜感測器</p>
        <p type="p">112:記憶體區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1182" publication-number="202616938">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616938</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126352</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>母基板及母基板之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">H10K77/10</main-classification>
        <further-classification edition="202301120260102B">H10K59/80</further-classification>
        <further-classification edition="200601120260102B">H01L21/301</further-classification>
        <further-classification edition="200601120260102B">H01L21/302</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商邁格諾皓特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAGNOLIA WHITE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大久保雅一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKUBO, MASAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今井信雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAI, NOBUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">大體而言，根據實施形態，母基板具備：複數個面板部，其等各自包含顯示區域及上述顯示區域之周圍之周邊區域；上述複數個面板部之周圍之空餘區域；下電極，其配置於上述顯示區域；肋層，其具有與上述下電極重疊之像素開口，且配置於上述面板部及上述空餘區域；及隔離壁，其配置於上述空餘區域；且上述隔離壁包含配置於上述肋層之上之底層、配置於上述底層之上且具有導電性之軸層、及配置於上述軸層之上之上部；上述底層具有自上述軸層之側面突出之突出部；上述上部具有自上述軸層之側面突出之簷部；上述簷部具有俯視時與上述突出部重疊之缺口；上述缺口於俯視時與上述底層和上述軸層之邊界重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">7:隔離壁</p>
        <p type="p">71:下部</p>
        <p type="p">71B:邊界</p>
        <p type="p">72:上部</p>
        <p type="p">73:底層</p>
        <p type="p">74:軸層</p>
        <p type="p">74S:側面</p>
        <p type="p">77:突出部</p>
        <p type="p">78:簷部</p>
        <p type="p">78N:缺口</p>
        <p type="p">78V:凸部</p>
        <p type="p">79:槽部</p>
        <p type="p">701:隔離壁開口</p>
        <p type="p">702:隔離壁開口</p>
        <p type="p">D1:方向</p>
        <p type="p">L:長度</p>
        <p type="p">TG:測試圖案</p>
        <p type="p">θ1:角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1183" publication-number="202615272">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615272</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126394</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>兒童安全座椅</chinese-title>
        <english-title>CHILD SAFETY SEAT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">B60N2/28</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張大亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, DALIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁嘉俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, JIAJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提出一種兒童安全座椅，包括：座椅本體，用於承載兒童；連接部，其設置在座椅本體上；繫帶組件，一端固定在連接部，另一端設有用於連接車輛座椅的錨固部；以及第二夾器，其設置在連接部上，用於可操作地鎖定車輛的安全帶。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure proposes a child safety seat, comprising: a seat body for carrying children; a connecting part provided on the seat body; a strap component, with one end fixed to the connecting part and another end equipped with an anchoring part for connecting a vehicle seat; and a second clip provided on the connecting part for operable locking of a seat belt of a vehicle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1001:兒童安全座椅</p>
        <p type="p">1002:車輛座椅</p>
        <p type="p">1010:座椅本體</p>
        <p type="p">1011:繫帶組件</p>
        <p type="p">1012:底座</p>
        <p type="p">1020:乘坐部</p>
        <p type="p">1021:靠背部</p>
        <p type="p">1101:背靠</p>
        <p type="p">1100:主體部</p>
        <p type="p">1102:座部</p>
        <p type="p">1103:側翼</p>
        <p type="p">1103a:貫穿部</p>
        <p type="p">1103b:阻擋部</p>
        <p type="p">1104:頭靠部</p>
        <p type="p">1111:繫帶本體</p>
        <p type="p">1111a:端部</p>
        <p type="p">1112:錨固部</p>
        <p type="p">1200:連接部</p>
        <p type="p">1210:連接杆</p>
        <p type="p">1220:定位部</p>
        <p type="p">1221:安全帶</p>
        <p type="p">1221a:肩帶</p>
        <p type="p">1221b:腰帶</p>
        <p type="p">1222:固定點</p>
        <p type="p">1223:拉出部</p>
        <p type="p">1224:插扣</p>
        <p type="p">1300:第一固定部、第一夾器</p>
        <p type="p">1400:第二固定部、第二夾器</p>
        <p type="p">1410:夾座</p>
        <p type="p">1420:夾臂</p>
        <p type="p">1430:連接件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1184" publication-number="202615110">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615110</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126473</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣體輸送醫療導管之水分檢測</chinese-title>
        <english-title>MOISTURE DETECTION IN GASES CONVEYING MEDICAL CONDUITS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61M16/00</main-classification>
        <further-classification edition="200601120260102B">A61M16/04</further-classification>
        <further-classification edition="200601120260102B">A61M16/06</further-classification>
        <further-classification edition="200601120260102B">A61M16/16</further-classification>
        <further-classification edition="200601120260102B">G01N22/04</further-classification>
        <further-classification edition="200601120260102B">G01N25/18</further-classification>
        <further-classification edition="200601120260102B">G01N27/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紐西蘭商費雪派克保健有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FISHER &amp; PAYKEL HEALTHCARE LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋梅爾　路克　摩根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GEMMELL, LUKE MORGAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　艾力克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOUNG, ALEX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>席卡普　彼得　亞倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEEKUP, PETER ALAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史托克斯　埃爾默　班森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STOKS, ELMO BENSON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">使用導管的電性質來檢測該導管中的水分狀況，尤其是檢測用於供應呼吸氣體或外科手術氣體的氣體供應系統導管中的水分狀況。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Detection of moisture conditions in a conduit, particularly a gases supply system conduit for supplying respiratory or surgical gases, using an electrical property of the conduit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:患者</p>
        <p type="p">103:吸氣管</p>
        <p type="p">105:氣體源</p>
        <p type="p">107:加濕器</p>
        <p type="p">109:端部</p>
        <p type="p">111、149:埠</p>
        <p type="p">113:Y形件</p>
        <p type="p">115:患者介面</p>
        <p type="p">117:呼氣管</p>
        <p type="p">119:排氣口</p>
        <p type="p">121:風扇</p>
        <p type="p">123:電子控制器</p>
        <p type="p">125:控制器</p>
        <p type="p">129:加濕腔室</p>
        <p type="p">130:水</p>
        <p type="p">131:加熱器板</p>
        <p type="p">133:使用者介面</p>
        <p type="p">135:溫度探針</p>
        <p type="p">145、147:加熱器、感測器及/或水分檢測元件</p>
        <p type="p">157:乾燥線管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1185" publication-number="202615820">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615820</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126551</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>校準雙輪載具之傾斜感測器的方法</chinese-title>
        <english-title>METHOD FOR CALIBRATING AN INCLINATION SENSOR FOR A TWO-WHEELED VEHICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">G01C25/00</main-classification>
        <further-classification edition="202001120260114B">B62J45/415</further-classification>
        <further-classification edition="201301120260114B">G01P15/02</further-classification>
        <further-classification edition="200601120260114B">G06F17/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商舍弗勒科技股份有限兩合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHAEFFLER TECHNOLOGIES AG &amp; CO. KG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富瑞茂克思　琴路克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FREMAUX, JEAN-LUC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種校準用於動力雙輪的載具(1)之一傾斜感測器(111)之方法，包括以下步驟：&lt;br/&gt;  選擇(E1)包括待校準的該傾斜感測器(111)之至少一雙輪的載具(1)；&lt;br/&gt;  以一第一確定側向傾角傾斜(E2)該載具(1)；&lt;br/&gt;  記錄(E3)地球重力在三個軸上的投影值；&lt;br/&gt;  以一第二預定側向傾角傾斜(E4)該載具(1)；&lt;br/&gt;  記錄(E5)該地球重力在該三個軸上的投影值；&lt;br/&gt;  根據該地球重力在本質參考座標系以及該載具(1)之參考座標系的該三個軸上的投影，計算(E9)該傾斜感測器(111)之該本質參考座標系與專屬於該載具(1)之該參考座標系之間的投影矩陣；&lt;br/&gt;  記錄(E10)為每個載具(1)計算之該投影矩陣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a method for calibrating an inclination sensor (111) for a two-wheeled vehicle (1), comprising the steps of:&lt;br/&gt; - selecting (E1) a two-wheeled vehicle (1) comprising said inclination sensor (111) to be calibrated；&lt;br/&gt; - inclining (E2) the vehicle (1) at a first determined lateral inclination angle；&lt;br/&gt; - recording (E3) the value of the projection of the earth’s gravity over the three axes；&lt;br/&gt; - inclining (E4) the vehicle (1) at a second predetermined lateral inclination angle；&lt;br/&gt; - recording (E5) the value of the projection of the earth’s gravity over the three axes；&lt;br/&gt; - computing (E9) a projection matrix between the intrinsic reference frame of the inclination sensor (111) and the reference frame specific to the vehicle (1) based on the projection of the earth’s gravity over the three axes of the intrinsic reference frame and the reference frame of the vehicle (1)；&lt;br/&gt; - recording (E10) the projection matrix computed for each vehicle (1).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:載具</p>
        <p type="p">2:校準裝置</p>
        <p type="p">11:電子控制單元</p>
        <p type="p">111:傾斜感測器</p>
        <p type="p">112:記憶區</p>
        <p type="p">θ1:第一傾角</p>
        <p type="p">θ2:第二傾角</p>
        <p type="p">E1:第一步驟</p>
        <p type="p">E2:第二步驟</p>
        <p type="p">E3:步驟</p>
        <p type="p">E4:步驟</p>
        <p type="p">E5:步驟</p>
        <p type="p">E6:步驟</p>
        <p type="p">E7:步驟</p>
        <p type="p">E8:步驟</p>
        <p type="p">E9:步驟</p>
        <p type="p">E10:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1186" publication-number="202616836">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616836</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126601</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電容元件和包含電容元件的電路結構</chinese-title>
        <english-title>CAPACITIVE ELEMENT AND CIRCUIT STRUCTURE INCLUDING CAPACITIVE ELEMENT(S)</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260102B">H10D1/60</main-classification>
        <further-classification edition="202501120260102B">H10D62/10</further-classification>
        <further-classification edition="202501120260102B">H10D64/20</further-classification>
        <further-classification edition="202501120260102B">H10D64/66</further-classification>
        <further-classification edition="202501120260102B">H10D80/20</further-classification>
        <further-classification edition="202501120260102B">H10D88/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商格芯（美國）集成電路科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBALFOUNDRIES U.S. INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝拉爾　阿貝拉特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELLAOUAR, ABDELLATIF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴拉薩伯拉馬尼彥　亞若</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BALASUBRAMANIYAN, ARUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案說明揭露一種電容性元件（CE）以及一種包含該CE的電路結構。該CE包含串聯連接的第一、第二和第三電晶體（雙閘極n型場效應電晶體）。在該第二和第一電晶體之間以及該第一和第三電晶體之間的共用源極/汲極區，分別連接有電容器。該第一電晶體大於該第二電晶體和該第三電晶體。該第一電晶體的前閘極以及所有三個電晶體的後閘極皆接收第一控制電壓（VC1）。該第二和第三電晶體的前閘極皆接收第二控制電壓（VC2）。VC1和VC2可同時切換，以使這三個電晶體在導通和截止狀態之間同時切換。VC1的高電壓位準和低電壓位準分別位於第一正電壓位準和接地。VC2的高電壓位準和低電壓位準分別位於該第一正電壓位準和第二正電壓位準。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are a capacitive element (CE) and a circuit structure including CE(s). The CE includes series-connected first, second, and third transistors (dual-gate n-type field effect transistors). Shared source/drain regions between the second and first transistors and between the first and third transistors are connected to capacitors, respectively. The first transistor is larger than the second and third transistors. The front gate of the first transistor and back gates of all three transistors receive a first control voltage (VC1). The front gates of the second and third transistors receive a second control voltage (VC2). VC1 and VC2 are concurrently switchable to concurrently switch the three transistors between on and off states. High and low voltage levels of VC1 are at a first positive voltage level and at ground. High and low voltage levels of VC2 are at the first positive voltage level and at a second positive voltage level.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:數位可調電容器電路結構</p>
        <p type="p">101&lt;sub&gt;0&lt;/sub&gt;、101&lt;sub&gt;n&lt;/sub&gt;:電容元件</p>
        <p type="p">102:第一電壓線(正電壓線)</p>
        <p type="p">103:第二電壓線(負電壓線)</p>
        <p type="p">110:第一電晶體(NFET)</p>
        <p type="p">112:第一源極/汲極區</p>
        <p type="p">113:第一通道區</p>
        <p type="p">115:第一前閘極指</p>
        <p type="p">116:第一後閘極</p>
        <p type="p">120:第二電晶體(NFET)</p>
        <p type="p">122:第二源極/汲極區</p>
        <p type="p">123:第二通道區</p>
        <p type="p">125:第二前閘極指</p>
        <p type="p">126:第二後閘極</p>
        <p type="p">130:第三電晶體(NFET)</p>
        <p type="p">132:第三源極/汲極區</p>
        <p type="p">133:第三通道區</p>
        <p type="p">135:第三前閘極指</p>
        <p type="p">136:第三後閘極</p>
        <p type="p">161:第一電容器</p>
        <p type="p">162:第二電容器</p>
        <p type="p">190&lt;sub&gt;0&lt;/sub&gt;、190&lt;sub&gt;n&lt;/sub&gt;:控制電壓電路</p>
        <p type="p">191:第一電壓供應器</p>
        <p type="p">192:第二電壓供應器</p>
        <p type="p">199:接地軌</p>
        <p type="p">201:半導體基板</p>
        <p type="p">A:第一共享源極/汲極區(連接節點)</p>
        <p type="p">B:第二共享源極/汲極區(連接節點)</p>
        <p type="p">VC1:第一控制電壓</p>
        <p type="p">VC2:第二控制電壓</p>
        <p type="p">VM:負電壓線</p>
        <p type="p">VP:正電壓線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1187" publication-number="202616576">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616576</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126608</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器及電連接器組件</chinese-title>
        <english-title>ELECTRICAL CONNECTOR AND ELECTRICAL CONNECTOR ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251126B">H01R13/40</main-classification>
        <further-classification edition="200601120251126B">H01R13/502</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商富加宜電子（南通）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FCI NANTONG LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商富加宜連接器（東莞）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FCI CONNECTORS DONGGUAN LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡華林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, HUALIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種電連接器和電連接器組件。該電連接器可包括：絕緣殼體，包括絕緣殼體主體及多個絕緣管狀構件，這些絕緣管狀構件被配置為從絕緣殼體主體突出，並在絕緣殼體主體上布置成一列或多列，絕緣管狀構件中的每列構成絕緣管狀構件組；固定結構，設置在絕緣管狀構件組中的至少一個絕緣管狀構件組在其延伸方向上的至少一個端部處；多個適配接觸件，容納在絕緣管狀構件中的每個絕緣管狀構件中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides an electrical connector and electrical connector assembly. The electrical connector may comprise: an insulating housing comprising an insulating housing main body and a plurality of insulating tubular members which are configured to protrude from the insulating housing main body and arranged in one or more rows on the insulating housing main body, each row of insulating tubular members constituting an insulating tubular members group; a securing structure disposed on at least one end of at least one of the insulating tubular members groups in an extending direction thereof; a plurality of mating contacts accommodated in each of the insulating tubular members.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:插座連接器</p>
        <p type="p">130:絕緣殼體</p>
        <p type="p">131:絕緣殼體主體</p>
        <p type="p">132:絕緣管狀構件</p>
        <p type="p">140:固定結構</p>
        <p type="p">144:引導凸起部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1188" publication-number="202616712">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616712</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126674</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於點雲壓縮之以學習為基礎之硬速率控制機制</chinese-title>
        <english-title>LEARNING-BASED HARD RATE CONTROL MECHANISM FOR POINT CLOUD COMPRESSION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260102B">H04N19/10</main-classification>
        <further-classification edition="201401120260102B">H04N19/157</further-classification>
        <further-classification edition="200601120260102B">G06T9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商內數位ＶＣ控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERDIGITAL VC HOLDINGS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛迪　穆罕默德　阿薩德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LODHI, MUHAMMAD ASAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龐　家昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANG, JIAHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安廷炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, JUNGHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田　棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAN, DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法之一些實施例可包含：獲得一位元串流及一組已解碼座標；藉由使用該組已解碼座標來產生一特徵圖；使用一神經網路從該特徵圖中之各特徵產生一或多個預測位移；及將該一或多個預測位移添加至該組已解碼座標以獲得一最終重構。一種方法之一些實施例可包含：獲得一原始點雲與一縮小點雲之間之複數個每點殘差；使用一神經網路獲得各殘差之一特徵；根據該縮小點雲之一幾何結構來匯集該等特徵；及將該等經匯集特徵編碼成一位元串流。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Some embodiments of a method may include: obtaining a bitstream and an already-decoded set of coordinates; generating a feature map by using the already-decoded set of coordinates; using a neural network to produce one or more predicted displacements from each feature in the feature map; and adding the one or more predicted displacements to the already decoded set of coordinates to obtain a final reconstruction. Some embodiments of a method may include: obtaining a plurality of per-point residuals between an original and a downscaled point cloud; using a neural network to obtain a feature for each residual; pooling the features according to a geometry of the downscaled point cloud; and encoding the pooled features into a bitstream.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:速率控制解碼器</p>
        <p type="p">702:特徵解碼器(FD)</p>
        <p type="p">704:MLP區塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1189" publication-number="202616548">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616548</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126826</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>全固態電池用固態電解質及包含其之全固態電池</chinese-title>
        <english-title>SOLID ELECTROLYTE FOR ALL SOLID-STATE BATTERY AND SOLID-STATE BATTERY COMPRISING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120250801B">H01M10/0562</main-classification>
        <further-classification edition="201001120250801B">H01M10/0525</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商博思有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASS CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴兌浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, TAE HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金吉鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KIL HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安炫俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, HYUN JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿姆帕杜　以馬內利夸梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMPADU, EMMANUEL KWAME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧蒂諾　約翰馬格克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTIENO, JOHN MAGAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種全固態電池用固態電解質及包含其之全固態電池。依本發明的一實施例之全固態電池用固態電解質由包含Li、B、Al、Cl及鹼土金屬之氧化物形成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:全固態電池</p>
        <p type="p">14,15:外部電極</p>
        <p type="p">16:殼體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1190" publication-number="202615991">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615991</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126860</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>網格射束描繪方法，及網格射束描繪裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G03F7/20</main-classification>
        <further-classification edition="200601120260102B">H01J37/317</further-classification>
        <further-classification edition="200601120260102B">H01J37/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商紐富來科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUFLARE TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本裕史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤原悠嗣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIWARA, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種網格射束描繪方法及網格射束描繪裝置，在網格射束描繪中，不對主晶片區域內的圖案的描繪精度造成影響而可縮短描繪時間。  &lt;br/&gt;　　本發明的一態樣之網格射束描繪方法，具備：算出用來修正當藉由帶電粒子束描繪試料的情形下的鄰近效應之標準化後的鄰近效應修正照射量之工序；依試料的描繪區域被網目狀地分割而成的複數個小區域的每一小區域，判定該小區域的鄰近效應修正照射量是否比閾值還大之工序；依判定的結果，針對成為比閾值還大的鄰近效應修正照射量之小區域，算出用來做虛設曝光的虛設照射量之工序；針對試料的描繪區域被網目狀地分割而成的用來照射帶電粒子束的複數個照射單位區域，將成為比閾值還大的鄰近效應修正照射量之照射單位區域，藉由對基於比已算出的鄰近效應修正照射量還受限制的限制修正照射量之照射量加上虛設照射量而成的入射照射量的帶電粒子束予以描繪，將未成為比閾值還大的鄰近效應修正照射量之照射單位區域，不做虛設曝光而藉由基於已算出的鄰近效應修正照射量之入射照射量的帶電粒子束予以描繪之工序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1191" publication-number="202616429">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616429</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126906</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體基板之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/67</main-classification>
        <further-classification edition="200601120260102B">B08B3/02</further-classification>
        <further-classification edition="200601120260102B">B08B3/08</further-classification>
        <further-classification edition="200601120260102B">B08B3/12</further-classification>
        <further-classification edition="200601120260102B">C11D3/12</further-classification>
        <further-classification edition="200601120260102B">C11D7/50</further-classification>
        <further-classification edition="200601120260102B">C11D1/68</further-classification>
        <further-classification edition="200601120260102B">C11D3/43</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商花王股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田晃平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, KOUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小受敦志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKE, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">於一態樣中，本發明提供一種能夠抑制於乾燥後之基板表面產生污跡之半導體基板之製造方法。  &lt;br/&gt;於一態樣中，本發明係關於一種半導體基板之製造方法，其係包括下述步驟1、步驟2及步驟3者，且進而包括於步驟1之前，對接著有暫時固定劑之半導體基板進行剝落處理而將暫時固定劑剝離之步驟。  &lt;br/&gt;步驟1：利用洗淨劑對上述剝落處理後之附著有暫時固定劑殘渣之半導體基板進行洗淨處理之步驟  &lt;br/&gt;步驟2：對步驟1後之半導體基板進行沖洗處理之步驟，包括利用對疏水性溶劑及水之任一者均具有親和性之溶劑進行沖洗處理  &lt;br/&gt;步驟3：使用旋轉處理器對步驟2後之半導體基板進行乾燥處理之步驟</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1192" publication-number="202615596">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615596</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126975</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>導電膏及乾燥膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C09D5/24</main-classification>
        <further-classification edition="200601120260102B">H01B1/22</further-classification>
        <further-classification edition="200601120260102B">H01B3/12</further-classification>
        <further-classification edition="200601120260102B">H01B5/16</further-classification>
        <further-classification edition="200601120260102B">H01F1/33</further-classification>
        <further-classification edition="200601120260102B">H01G4/30</further-classification>
        <further-classification edition="200601120260102B">H01G4/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商則武股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NORITAKE CO., LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小池智久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOIKE, TOMOHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武藤一将</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUTO, KAZUMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴田拓実</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBATA, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文公開的導電膏包含導電粉末、介電質粉末、黏結劑和有機溶劑。該導電膏的導電粉末至少含有D&lt;sub&gt;50&lt;/sub&gt;粒徑為110nm以上且240nm以下的第1導電粒子和D&lt;sub&gt;50&lt;/sub&gt;粒徑為20nm以上且90nm以下的第2導電粒子。而且，將導電粉末的總質量設為100wt%時，第2導電粒子的含有比率為0.2wt%以上且8wt%以下。根據該構成的導電膏，能夠在抑制煆燒初期的急劇熱收縮所導致的接觸不良和界面剝離等的基礎上，實現薄層化為亞微米級的內部電極層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1193" publication-number="202616671">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616671</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126999</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>迭代檢測和解碼電路及其操作方法</chinese-title>
        <english-title>ITERATIVE DETECTION AND DECODING (IDD) CIRCUIT AND OPERATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">H03M13/11</main-classification>
        <further-classification edition="200601120251201B">H04L1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金周漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JOOHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JANGHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭暎錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, YOUNGSEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供迭代檢測和解碼（iterative detection and decoding，IDD）電路及其操作方法，IDD電路包括具有低功耗的多輸入多輸出（multiple-input and multiple-output，MIMO）檢測器、IDD電路的操作方法、以及數據機晶片。IDD電路，經組態以用於接收包括符號的訊號，包括經組態以用於藉由使用線性檢測方法基於符號產生第一對數似然比的第一檢測器，經組態以用於基於第一對數似然比執行第一解碼操作以及當第一解碼操作失敗時產生後對數似然比的解碼電路，以及經組態以用於當第一解碼操作失敗時，藉由使用非線性檢測方法基於符號和後對數似然比產生第二對數似然比的第二檢測器，其中解碼電路更經組態以用於基於第二對數似然比執行第二解碼操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An iterative detection and decoding (IDD) circuit and operation method thereof are provided, the IDD circuit includes a multiple-input and multiple-output (MIMO) detector having low power consumption, an operation method of the IDD circuit, and a modem chip. The IDD circuit, which is configured to receive a signal including a symbol, includes a first detector configured to generate a first log-likelihood ratio based on the symbol by using a linear detection method, a decoding circuit configured to perform a first decoding operation based on the first log-likelihood ratio and to generate a post-log-likelihood ratio when the first decoding operation fails, and a second detector configured to, when the first decoding operation fails, generate a second log-likelihood ratio based on the symbol and the post-log-likelihood ratio by using a nonlinear detection method, wherein the decoding circuit is further configured to perform a second decoding operation based on the second log-likelihood ratio.</p>
      </isu-abst>
      <representative-img>
        <p type="p">60:操作方法</p>
        <p type="p">S610、S620、S630、S640、S650、S660:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1194" publication-number="202615051">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615051</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127034</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吡咯并嗒ＶＥＧＦＲ抑制劑</chinese-title>
        <english-title>PYRROLOPYRIDAZINE VEGFR INHIBITORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/553</main-classification>
        <further-classification edition="200601120260102B">A61K31/502</further-classification>
        <further-classification edition="200601120260102B">A61K31/403</further-classification>
        <further-classification edition="200601120260102B">A61K31/343</further-classification>
        <further-classification edition="200601120260102B">A61K31/381</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商默沙東有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCK SHARP &amp; DOHME LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿特曼　麥克　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALTMAN, MICHAEL D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張藝真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YEJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪蒙　杜恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEMONG, DUANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮莎莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, SHASHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海耶斯　羅伯特　Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYES, ROBERT P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱洛爾　米切爾　Ｈ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEYLOR, MITCHELL H.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　奇　奇普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LE,CHI CHIP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅瑟　烏瑪　法烏克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANSOOR, UMAR FARUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施派克曼　凱文　安東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPIEKERMANN, KEVIN ANTON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供式I化合物  &lt;br/&gt;&lt;img align="absmiddle" height="134px" width="197px" file="ed10533.JPG" alt="ed10533.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;及其醫藥上可接受之鹽、酯及前藥，其為VEGFR抑制劑。亦提供製備式I化合物之方法、包括式I化合物之醫藥組合物，及使用該等化合物治療癌症及相關疾病及病狀之方法，包括向有需要之患者投與式I化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are compounds of formula I &lt;br/&gt;&lt;img align="absmiddle" height="134px" width="198px" file="ed10534.JPG" alt="ed10534.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;and the pharmaceutically acceptable salts, esters, and prodrugs thereof, which are VEGFR inhibitors. Also provided are methods of making compounds of Formula I, pharmaceutical compositions comprising compounds of Formula I, and methods of using these compounds to treat cancer and related diseases and conditions, comprising administering a compound of Formula I to a patient in need thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1195" publication-number="202616430">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616430</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127071</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/67</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙橋周平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, SHUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木下貴文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINOSHITA, TAKAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 本公開說明一種能夠抑制異物(例如，顆粒、藥液殘渣等)附著於基板的上面之中的周緣部的基板處理裝置及基板處理方法。  &lt;br/&gt;　　[解決手段] 基板處理裝置具備：被構成為支持基板的支持部；被構成為朝向被支持於支持部之基板的上面供給洗淨液的供給部；被構成為朝向被支持於支持部之基板的下面供給處理液的另外的供給部；以及控制部。控制部被構成為實行：朝向被支持於支持部之基板的下面，至少供給一次作為處理液之一的藥液的第1處理；在第1處理之後，朝向被支持於支持部之基板的下面，供給作為處理液之一的另外的洗淨液的第2處理；以及在至少橫跨第1處理及第2處理的期間，朝向被支持於支持部之基板的上面供給洗淨液的第3處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板處理裝置</p>
        <p type="p">10:框體</p>
        <p type="p">11:側壁</p>
        <p type="p">12:搬入搬出口</p>
        <p type="p">13:底壁</p>
        <p type="p">20:旋轉部</p>
        <p type="p">21:旋轉軸</p>
        <p type="p">22:驅動機構</p>
        <p type="p">23:支持板(支持部)</p>
        <p type="p">24:支持銷(支持部)</p>
        <p type="p">25:環狀構件</p>
        <p type="p">25a:上壁部</p>
        <p type="p">25b:側壁部</p>
        <p type="p">26:連接構件</p>
        <p type="p">30:升降部</p>
        <p type="p">31:軸構件</p>
        <p type="p">32:驅動機構</p>
        <p type="p">33:支持銷</p>
        <p type="p">40:蓋構件</p>
        <p type="p">41:上壁部</p>
        <p type="p">42:側壁部</p>
        <p type="p">43:底壁部</p>
        <p type="p">50:供給部</p>
        <p type="p">51,52:供給部(另外的供給部)</p>
        <p type="p">53:供給部(氣體供給部)</p>
        <p type="p">60:整流構件</p>
        <p type="p">61:基座構件</p>
        <p type="p">62:突出部</p>
        <p type="p">63:密封構件</p>
        <p type="p">70:升降部</p>
        <p type="p">71:基座構件</p>
        <p type="p">72:桿件</p>
        <p type="p">73:滑動器</p>
        <p type="p">80:上側供給部(供給部)</p>
        <p type="p">81:本體部</p>
        <p type="p">82:噴嘴</p>
        <p type="p">90:驅動部</p>
        <p type="p">91:連接構件</p>
        <p type="p">100:攝像部</p>
        <p type="p">Ax1:中心軸</p>
        <p type="p">B:鼓風機</p>
        <p type="p">Ctr:控制器(控制部)</p>
        <p type="p">H1:排氣管</p>
        <p type="p">H2:貫通孔</p>
        <p type="p">S1:傾斜面</p>
        <p type="p">S2:下面</p>
        <p type="p">ST:狹縫</p>
        <p type="p">V:空間</p>
        <p type="p">W:基板</p>
        <p type="p">Wa:上面</p>
        <p type="p">Wb:下面</p>
        <p type="p">Wc:周緣部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1196" publication-number="202616918">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616918</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127079</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光結構及其製備方法、發光面板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250801B">H10H20/83</main-classification>
        <further-classification edition="202501120250801B">H10H20/01</further-classification>
        <further-classification edition="202501120250801B">H10H29/49</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國商京東方科技集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOE TECHNOLOGY GROUP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牛晋飞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIU, JINFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陈小川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XIAOCHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
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          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>张粲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
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          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王灿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丛宁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CONG, NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赵蛟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, JIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>闫家魁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, JIAKUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>刘超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王明星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MINGXING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齐琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QI, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卢美荣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, MEIRONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DING, DING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種發光結構，包括：至少一個發光元件組、多個第一導電電極（151）以及多個第二導電電極（152）。至少一個發光元件組包括串聯連接的N個發光元件（EL1、EL2、EL3、EL4），N為大於1的整數。發光元件（EL1）包括：堆疊設置的第一半導體層（111）、發光功能層（121）和第二半導體層（131）；第一半導體層（111）與至少一個第一導電電極（151）電連接，第二半導體層（131）與至少一個第二導電電極（152）電連接。N個發光元件中的第i個發光元件的第二半導體層所連接的第二導電電極與第i+1個發光元件的第一半導體層所連接的第一導電電極電連接，其中，i為大於或等於1且小於N的整數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">111:第一半導體層</p>
        <p type="p">1111:第一表面</p>
        <p type="p">1112:第二表面</p>
        <p type="p">1113:第一側壁</p>
        <p type="p">112,113,114:第一半導體層</p>
        <p type="p">1211:第五表面</p>
        <p type="p">1212:第六表面</p>
        <p type="p">1213:第三側壁</p>
        <p type="p">121,122,123,124:發光功能層</p>
        <p type="p">131:第二半導體層</p>
        <p type="p">1311:第三表面</p>
        <p type="p">1312:第四表面</p>
        <p type="p">1313:第二側壁</p>
        <p type="p">132,133,134:第二半導體層</p>
        <p type="p">14:分散式布拉格反射器層</p>
        <p type="p">151:第一導電電極</p>
        <p type="p">152:第二導電電極</p>
        <p type="p">16:平坦層</p>
        <p type="p">17:連接電極</p>
        <p type="p">171:第一連接電極</p>
        <p type="p">172:第二連接電極</p>
        <p type="p">173:第三連接電極</p>
        <p type="p">30:驅動背板</p>
        <p type="p">EL1:第一個發光元件</p>
        <p type="p">EL2:第二個發光元件</p>
        <p type="p">EL3:第三個發光元件</p>
        <p type="p">EL4:第四個發光元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1197" publication-number="202615674">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615674</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127205</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連續鑄造鋼胚及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C22C38/00</main-classification>
        <further-classification edition="200601120260102B">C22C38/06</further-classification>
        <further-classification edition="200601120260102B">C22C38/14</further-classification>
        <further-classification edition="200601120260102B">C21D9/00</further-classification>
        <further-classification edition="200601120260102B">B22D11/00</further-classification>
        <further-classification edition="200601120260102B">B22D11/12</further-classification>
        <further-classification edition="200601120260102B">B22D11/124</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JFE STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川崎大輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASAKI, TAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小田垣智也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ODAGAKI, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎和彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAZAKI, KAZUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠藤一輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDOH, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供即使為韌性較低的連續鑄造鋼胚，在該連續鑄造鋼胚冷卻中仍不會產生該鋼胚放置裂紋的連續鑄造鋼胚及其製造方法。其提供具有既定成分組成的高強度鋼用連續鑄造鋼胚，於連續鑄造鋼胚表層下10mm位置處的平均舊沃斯田鐵粒徑d&lt;sub&gt;10&lt;/sub&gt;、與20mm位置處的平均舊沃斯田鐵粒徑d&lt;sub&gt;20&lt;/sub&gt;之平均舊沃斯田鐵粒徑比(d&lt;sub&gt;20&lt;/sub&gt;/d&lt;sub&gt;10&lt;/sub&gt;)係1.0以上且4.0以下，微觀組織係由肥粒鐵、波來鐵、變韌肥粒鐵、回火麻田散鐵、淬火麻田散鐵及殘留沃斯田鐵所構成，連續鑄造鋼胚表層下10mm位置處的微觀組織、與連續鑄造鋼胚表層下20mm處的微觀組織係由具有既定面積率的組織所形成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1198" publication-number="202615233">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615233</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127225</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可更換之刀架</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B26D7/26</main-classification>
        <further-classification edition="200601120260102B">B23D21/06</further-classification>
        <further-classification edition="200601120260102B">B26D3/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商Ｃ　格斯塔夫 　布希 　克尼佩克斯工廠公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KNIPEX WERK C. GUSTAV PUTSCH KG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢索恩　安德烈亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEINSOHN, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種用於諸如管子切割器(1)之類的切割機(S)的可更換刀架(M)，其中，此刀架(M)具有保持件(2)，具有曝露的切割尖端(34)之切割刀片(3，4)保持在該保持件上，其中進一步地，該切割刀片(3，4)構建為厚度(g)較小的扁平件，具有兩個相對立的扁平側(27，28)及一個構建在緣邊(29)上之形成該切割尖端(34)的切割刃(30)，其中進一步地，該切割刀片(3，4)被形狀配合地容置在橫跨該二扁平側(27，28)之保持件(2)中，其特徵在於：該保持件(2)具有與該等扁平側(27，28)中的一個相匹配之凹陷(22)，該凹陷具有凹陷緣邊(73)，該凹陷緣邊與該切割刀片(3，4)之緣邊(32，33)相匹配，使得，該切割刀片(3，4)以相對於垂直於扁平側(27，28)而穿過該切割刀片(3，4)的軸線(y)的轉動而言為旋轉鎖定的方式，被容置在該保持件(22)中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:保持件</p>
        <p type="p">3:(第一)切割刀片</p>
        <p type="p">4:(第二)切割刀片</p>
        <p type="p">5:(第一)保持殼身</p>
        <p type="p">6:(第二)保持殼身</p>
        <p type="p">8:殼底</p>
        <p type="p">9:殼身側面</p>
        <p type="p">10:殼身側面</p>
        <p type="p">11:殼身端區/殼端面/保持殼身</p>
        <p type="p">12:殼身端區/殼端面/保持殼身</p>
        <p type="p">13:倒棱段</p>
        <p type="p">14:清理段</p>
        <p type="p">15:清理底部</p>
        <p type="p">16:清理路徑</p>
        <p type="p">17:清理路徑壁部</p>
        <p type="p">18:清理開口</p>
        <p type="p">19:倒棱刃</p>
        <p type="p">20:倒棱尖端</p>
        <p type="p">21:保持鑽孔</p>
        <p type="p">24:形狀配合元件</p>
        <p type="p">26:形狀配合頭部</p>
        <p type="p">30:切割刃</p>
        <p type="p">34:切割尖端</p>
        <p type="p">L:縱向延伸度</p>
        <p type="p">M:刀架</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1199" publication-number="202615526">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615526</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127278</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>有機膜形成用組成物、有機膜形成方法及圖案形成方法</chinese-title>
        <english-title>COMPOSITION FOR FORMING ORGANIC FILM, METHOD FOR FORMING ORGANIC FILM, AND PATTERNING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08G8/04</main-classification>
        <further-classification edition="200601120260102B">C08G8/20</further-classification>
        <further-classification edition="200601120260102B">C08G8/30</further-classification>
        <further-classification edition="200601120260102B">C08G61/12</further-classification>
        <further-classification edition="200601120260102B">C08G63/16</further-classification>
        <further-classification edition="200601120260102B">C08G63/672</further-classification>
        <further-classification edition="200601120260102B">C08L61/12</further-classification>
        <further-classification edition="200601120260102B">C08L61/14</further-classification>
        <further-classification edition="200601120260102B">C08L65/00</further-classification>
        <further-classification edition="200601120260102B">C08L67/02</further-classification>
        <further-classification edition="200601120260102B">C08L67/06</further-classification>
        <further-classification edition="200601120260102B">G03F7/11</further-classification>
        <further-classification edition="200601120260102B">G03F7/16</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/40</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩森頌平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWAMORI, SHOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林直貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郡大佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KORI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供兼具填埋/平坦化特性之有機膜形成用組成物、使用了該組成物之有機膜形成方法及圖案形成方法。一種有機膜形成用組成物，其特徵為含有(A)含有芳香族環之樹脂、(B)含有下式(1)表示之含有β二酮結構之重複單元之聚合物、(C)溶劑。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="231px" width="562px" file="ed10088.JPG" alt="ed10088.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;上式(1)中，L&lt;sub&gt;1&lt;/sub&gt;為碳數2~20之飽和或不飽和之直鏈或分支之2價烴基。R&lt;sub&gt;A&lt;/sub&gt;及R&lt;sub&gt;B&lt;/sub&gt;為氫原子、經取代或未經取代之碳數1~20之直鏈烷基、經取代或未經取代之碳數3~20之分支或環狀烷基、經取代或未經取代之含有1個以上之雙鍵或參鍵之碳數2~20之脂肪族不飽和烴基、經取代或未經取代之碳數1~30之雜烷基、經取代或未經取代之碳數6~30之芳基、硫醇基、羥基、胺基、羧基或鹵素基。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a composition for forming an organic film which has both embedding and planarization properties, and a method for forming an organic film and a patterning process using the composition. A composition for forming an organic film, containing: (A) an aromatic ring-containing resin; (B) a polymer containing a repeating unit containing a β-diketone structure represented by the following formula (1): &lt;br/&gt;&lt;img align="absmiddle" height="148px" width="397px" file="ed10089.JPG" alt="ed10089.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;wherein L1 is a saturated or unsaturated linear or branched divalent hydrocarbon group having 2 to 20 carbon atoms, R&lt;sub&gt;A&lt;/sub&gt; and R&lt;sub&gt;B&lt;/sub&gt; each are a hydrogen atom, a substituted or unsubstituted linear alkyl group having 1 to 20 carbon atoms, a substituted or unsubstituted branched or cyclic alkyl group having 3 to 20 carbon atoms, a substituted or unsubstituted aliphatic unsaturated hydrocarbon group having 2 to 20 carbon atoms and containing one or more double or triple bonds, a substituted or unsubstituted heteroalkyl group having 1 to 30 carbon atoms, a substituted or unsubstituted aryl group having 6 to 30 carbon atoms, a thiol group, a hydroxy group, an amino group, a carboxy group, or a halogen group; and (C) a solvent.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">2:被加工層</p>
        <p type="p">2a:被加工層形成之圖案</p>
        <p type="p">3:有機膜</p>
        <p type="p">3a:有機膜圖案</p>
        <p type="p">4:含矽之阻劑中間膜</p>
        <p type="p">4a:含矽之阻劑中間膜圖案</p>
        <p type="p">5:阻劑上層膜</p>
        <p type="p">5a:阻劑上層膜圖案</p>
        <p type="p">6:曝光部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1200" publication-number="202615205">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615205</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127283</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於化學機械拋光的撓性安裝墊</chinese-title>
        <english-title>FLEXURE MOUNTED PAD FOR CHEMICAL MECHANICAL POLISHING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260102B">B24B37/20</main-classification>
        <further-classification edition="201201120260102B">B24B37/34</further-classification>
        <further-classification edition="201201120260102B">B24B37/32</further-classification>
        <further-classification edition="201201120260102B">B24B41/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>努尼佳　史帝文Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZUNIGA, STEVEN M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古魯薩米　傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GURUSAMY, JAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　正勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, JEONGHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">化學機械研磨系統包括吸附組件，其中有吸盤用於夾持基板，馬達用於圍繞第一軸旋轉吸盤，以及墊載體組件。該墊載體組件包括可移動的支撐、連接於支撐的側向致動器，該致動器用於沿徑向方向移動支撐、撓性連接件，其有第一端固定於支撐以及第二端、固定於撓性連接件第二端底部的墊載體/緊固件，用於接收和夾持拋光墊、從支撐延伸至撓性連接件上方的支撐臂，使得支撐臂和撓性連接件沿徑向方向共同移動，而撓性連接件的第二端相對於支撐臂可垂直移動，以及固定於臂上的墊載體致動器，用於對撓性部件的頂部施加向下壓力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chemical mechanical polishing system includes a chuck assembly with a chuck for holding a substrate, a motor to rotate the chuck about a first axis, and a pad carrier assembly. The pad carrier assembly includes a movable support, a lateral actuator coupled the support to move the support along the radial direction, a flexure having a first end secured to the support and a second end, a pad carrier/attachment secured to a bottom side of the second end of the flexure for receiving and holding a polishing pad, a support arm extending from the support over the flexure such that the support arm and the flexure move together along the radial direction with the second end of the flexure vertically movable relative to the support arm, and a pad carrier actuator secured to the arm to apply a downward pressure to a top of the flexure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">60:水庫</p>
        <p type="p">64:導管</p>
        <p type="p">70:儲液庫</p>
        <p type="p">72:導管</p>
        <p type="p">80:壓力源</p>
        <p type="p">82:導管</p>
        <p type="p">90:控制器</p>
        <p type="p">91:中央處理單元</p>
        <p type="p">92:記憶體</p>
        <p type="p">93:支援電路</p>
        <p type="p">100:研磨系統</p>
        <p type="p">101:吸附組件</p>
        <p type="p">103:研磨組件</p>
        <p type="p">104:調整組件</p>
        <p type="p">105:吸盤</p>
        <p type="p">105a:表面</p>
        <p type="p">107:端效器</p>
        <p type="p">109a:機械臂</p>
        <p type="p">111:升舉銷</p>
        <p type="p">112:調整環</p>
        <p type="p">114:機器人</p>
        <p type="p">115:通道</p>
        <p type="p">116:真空源</p>
        <p type="p">117:驅動軸</p>
        <p type="p">119a:馬達</p>
        <p type="p">119b:垂直致動器</p>
        <p type="p">121:撓性連接件</p>
        <p type="p">123:緊固件</p>
        <p type="p">125:掃描臂</p>
        <p type="p">127:驅動馬達</p>
        <p type="p">129:導軌</p>
        <p type="p">131:可加壓腔室</p>
        <p type="p">133:孔</p>
        <p type="p">135:支撐臂</p>
        <p type="p">139:皮帶</p>
        <p type="p">141:馬達</p>
        <p type="p">200:研磨墊</p>
        <p type="p">220:研磨表面</p>
        <p type="p">250:腔室</p>
        <p type="p">252:膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1201" publication-number="202615653">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615653</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127310</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>純化治療等級的質體DNA之方法及組成物</chinese-title>
        <english-title>METHODS AND COMPOSITIONS FOR PURIFYING THERAPEUTIC-GRADE PLASMID DNA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C12N15/10</main-classification>
        <further-classification edition="200601120260102B">C12N15/63</further-classification>
        <further-classification edition="200601120260102B">A61K31/7088</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商Ｗ　Ｒ　康格雷氏公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>W. R. GRACE &amp; CO.-CONN.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　雷諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, RENO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫爾策爾　雅各</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HELTZEL, JACOB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>可蘭尼　馬諾傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KORANNE, MANOJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示者為使用磁性顆粒以純化治療等級的質體DNA之方法及套組。具體而言，本揭示之技術係關於使用具有矽質氧化物表面層及超順磁核心之磁性顆粒，以純化高純度之治療等級的質體DNA之方法及套組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are methods and kits for purifying therapeutic-grade plasmid DNA using magnetic particles. In particular, the technology of the present disclosure relates to methods and kits for purifying therapeutic-grade plasmid DNA at a high degree of purity using magnetic particles with a siliceous oxide surface layer and a superparamagnetic core.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1202" publication-number="202615474">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615474</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127339</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用抗ＣＣＲ８／抗ＣＤ３雙特異性抗體治療癌症的方法</chinese-title>
        <english-title>METHODS OF TREATING CANCER WITH ANTI-CCR8/ANTI-CD3 BISPECIFIC ANTIBODIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07K16/28</main-classification>
        <further-classification edition="200601120260102B">C07K16/46</further-classification>
        <further-classification edition="200601120260102B">A61K39/395</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商建南德克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENENTECH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威爾曼　克莉絲汀　梅塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEHRMAN, KRISTIN META</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐘　宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHONG, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　凱淇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CASSIE KAI-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃森　謝爾金　埃梅爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ESEN SERGIN, EMEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷賽尼　伊拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSSEINI, IRAJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雅各貝利　安東尼　喬瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IACOVELLI, ANTHONY JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　冉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, RAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>習瓦　維塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIVVA, VITTAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯賓諾薩　菲利浦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPINOSA, PHILLIP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及細胞增生性病症之治療。更具體而言，本發明涉及使用單獨的或與抗程式性死亡配體 1 (PD-L1) 抗體 (例如，阿替利珠單抗) 組合的抗 C-C 模體趨化因子受體 8 (CCR8)/抗分化簇 3 (CD3) 雙特異性抗體對患有實性瘤惡性腫瘤之人類個體的特異性治療。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the treatment of cell proliferative disorders. More specifically, the invention relates to the specific treatment of human subjects having a solid tumor malignancy using anti-C-C motif chemokine receptor 8 (CCR8)/anti-cluster of differentiation 3 (CD3) bispecific antibodies alone or in combination with an anti-programmed death-ligand 1 (PD-L1) antibody (e.g., atezolizumab).</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1203" publication-number="202616590">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616590</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127365</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器模組</chinese-title>
        <english-title>CONNECTOR MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">H01R13/66</main-classification>
        <further-classification edition="201101120250801B">H01R24/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝爾威勒電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELLWETHER ELECTRONIC CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾瑟拉　吉米安立奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACERA, JIMMY ENRIQUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種連接器模組包含匯流排夾式連接器、匯流排連接器、至少一第一匯流排組件以及至少一第二匯流排組件。第一匯流排組件包含至少一第一匯流排，第一匯流排具有相對之第一端以及第二端，第一端連接匯流排夾式連接器，第二端連接匯流排連接器。第二匯流排組件包含至少一第二匯流排，第二匯流排具有相對之第三端以及第四端，第三端連接匯流排夾式連接器，並與第一端至少部分沿第一方向排列，第四端連接匯流排連接器，並與第二端至少部分沿第二方向排列，第一方向與第二方向彼此相交。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A connector module includes a busbar clip (BBC) connector, a busbar connector, at least one first busbar set and at least one second busbar set. The first busbar set includes at least one first busbar having a first end and a second end opposite to the first end. The first end is connected with the BBC connector. The second end is connected with the busbar connector. The second busbar set includes at least one second busbar having a third end and a fourth end opposite to the third end. The third end is connected with the BBC connector and at least partially arranged along a first direction with the first end. The fourth end is connected with the busbar connector and at least partially arranged along a second direction with the second end. The first direction and the second direction intersect with each other.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:連接器模組</p>
        <p type="p">110:匯流排夾式連接器</p>
        <p type="p">111:端子組</p>
        <p type="p">120:匯流排連接器</p>
        <p type="p">121:導電部</p>
        <p type="p">122:導電套筒</p>
        <p type="p">130:第一匯流排組件</p>
        <p type="p">131:第一匯流排</p>
        <p type="p">131a:第一端</p>
        <p type="p">131b:第二端</p>
        <p type="p">132:第一段</p>
        <p type="p">133:第二段</p>
        <p type="p">134:第一轉向段</p>
        <p type="p">1341:第一連接部</p>
        <p type="p">1342:第二連接部</p>
        <p type="p">1343:第一彎曲部</p>
        <p type="p">140:第二匯流排組件</p>
        <p type="p">141:第二匯流排</p>
        <p type="p">141a:第三端</p>
        <p type="p">141b:第四端</p>
        <p type="p">142:第三段</p>
        <p type="p">143:第四段</p>
        <p type="p">144:第二轉向段</p>
        <p type="p">1441:第三連接部</p>
        <p type="p">1442:第四連接部</p>
        <p type="p">1443:第二彎曲部</p>
        <p type="p">150:第一延伸件</p>
        <p type="p">160:第二延伸件</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">E1:第一延伸方向</p>
        <p type="p">E2:第二延伸方向</p>
        <p type="p">H:穿孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1204" publication-number="202615096">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615096</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127386</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>SARS-CoV-2感染症治療及/或預防用細胞及其製法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K39/42</main-classification>
        <further-classification edition="200601120260102B">C07K16/28</further-classification>
        <further-classification edition="200601120260102B">A61K39/395</further-classification>
        <further-classification edition="200601120260102B">A61P31/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人京都大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYOTO UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人大阪大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE UNIVERSITY OF OSAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>學校法人藤田學園</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJITA ACADEMY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立研究開發法人國立成育醫療研究中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CENTER FOR CHILD HEALTH AND DEVELOPMENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河本宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAMOTO, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上堀淳二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEHORI, JUNJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤雄真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, YUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山﨑晶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASAKI, SHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川絵里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, ERI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川瀬孝和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASE, TAKAKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美山貴彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAMA, TAKAHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種針對新型冠狀病毒感染症之通用性較高之即時供應型異體T細胞以及其製法。本發明提供一種包含表現SARS-CoV-2特異性人類TCR之T細胞或T前驅細胞之SARS-CoV-2感染症治療及/或預防用細胞集群之製造方法、以及包含利用該方法所製造之異體源T細胞或T前驅細胞之SARS-CoV-2感染症治療及/或預防用細胞集群，其中，該SARS-CoV-2感染症治療及/或預防用細胞集群之製造方法包括在體外於T細胞或T前驅細胞中表現單個或複數個SARS-CoV-2特異性人類T細胞受體(TCR)之步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1205" publication-number="202615086">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615086</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127422</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>脂化肽之延長釋放結合物及其用途</chinese-title>
        <english-title>EXTENDED-RELEASE CONJUGATES OF LIPIDATED PEPTIDES, AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">A61K38/16</main-classification>
        <further-classification edition="201701120260107B">A61K47/64</further-classification>
        <further-classification edition="201701120260107B">A61K47/60</further-classification>
        <further-classification edition="200601120260107B">C07K14/47</further-classification>
        <further-classification edition="200601120260107B">C07K14/575</further-classification>
        <further-classification edition="200601120260107B">A61P25/00</further-classification>
        <further-classification edition="200601120260107B">A61P3/00</further-classification>
        <further-classification edition="200601120260107B">A61P9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商普洛林克斯有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PROLYNX LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史奈德　艾瑞克　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHNEIDER, ERIC L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>愛許利　蓋瑞　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASHLEY, GARY W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費爾南德斯　洛奇歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FERNANDEZ, ROCIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供具有適用於至少每月投與之釋放動力學之脂化肽之結合物。本文亦提供此等結合物於治療有需要之個體之代謝性或神經性疾病或疾患或相關症狀之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are conjugates of lipidated peptides having release kinetics appropriate for at least monthly administration. Also provided are uses of such conjugates to treat metabolic or neurologic disease or disorder or associated symptoms in a subject in need thereof.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1206" publication-number="202616714">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616714</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127426</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於選擇級聯濾波的濾波器集的自適應迴路濾波器的語法設計</chinese-title>
        <english-title>ADAPTIVE LOOP FILTER SYNTAX DESIGN FOR FILTER SETS SELECTION OF CASCADE FILTERING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260102B">H04N19/117</main-classification>
        <further-classification edition="201401120260102B">H04N19/82</further-classification>
        <further-classification edition="201401120260102B">H04N19/70</further-classification>
        <further-classification edition="201401120260102B">H04N19/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭裕霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, YU-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱世鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, SHIH-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐志瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳慶曄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHING-YEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊子德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, TZU-DER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳渏紋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃毓文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種在視頻系統中的自適應迴路濾波器中進行級聯濾波信令的方法。視頻編解碼器接收要編碼或解碼作為視頻的當前圖像的當前像素塊的數據。視頻編解碼器信令或接收包括第一和第二濾波器的級聯濾波器的濾波係數選擇。第二濾波器使用的濾波係數的選擇可以在第一濾波器使用的濾波係數的選擇之前被信令。視頻編解碼器將級聯濾波器應用於當前塊的樣本。由第一濾波器濾波的樣本進一步由第二濾波器濾波。視頻編解碼器基於由級聯濾波器濾波的樣本編碼或解碼當前塊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of signaling for cascaded filtering in adaptive loop filter (ALF) in a video system is provided. A video coder receives data to be encoded or decoded as a current block of pixels of a current picture of a video. The video coder signals or receives signaling of a selection of filter coefficients for a cascaded filter comprising first and second filters. A selection of filter coefficients used by the second filter may be signaled before a selection of filter coefficients used by the first filter. The video coder applies the cascaded filter to samples of the current block. Samples filtered by the first filter are further filtered by the second filter. The video coder encodes or decodes the current block based on samples filtered by the cascaded filter.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1800:過程</p>
        <p type="p">1810-1840:區塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1207" publication-number="202616825">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616825</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127447</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體記憶體裝置</chinese-title>
        <english-title>SEMICONDUCTOR MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251103B">H10B12/10</main-classification>
        <further-classification edition="200601120251103B">G11C11/401</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申樹浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, SOO HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張志熏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JI HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴桐湜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, DONG-SIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體記憶體裝置包括：包括沿著第一方向排列的第一區和第二區的基板；設置在第一區中且包括第一部分和第二部分的主動圖案；在與第一方向相交的第二方向上延伸的閘極電極，閘極電極橫跨於第一部分和第二部分之間；設置在基板上且連接至第一部分的導電圖案，導電圖案在第一方向上延伸且具有在第二區上的末端；設置在第一區上導電圖案的側表面上以連接至第二部分的埋置接觸件；連接至埋置接觸件的電容器結構；和設置在第二區上導電圖案的側表面上的邊緣絕緣膜，邊緣絕緣膜包圍導電圖案的末端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor memory device includes a substrate including a first area and a second area arranged along a first direction, an active pattern disposed in the first area and including a first portion and a second portion, a gate electrode extending in a second direction intersecting the first direction, the gate electrode crossing between the first portion and the second portion, a conductive pattern disposed on the substrate and connected to the first portion, the conductive pattern extending in the first direction, and having an end on the second area, a buried contact disposed on a side surface of the conductive pattern on the first area to connect to the second portion, a capacitor structure connected to the buried contact, and an edge insulating film disposed on the side surface of the conductive pattern on the second area, the edge insulating film surrounding the end of the conductive pattern.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:字元線結構</p>
        <p type="p">130:導電圖案</p>
        <p type="p">140:間隔件結構</p>
        <p type="p">170:柵絕緣膜</p>
        <p type="p">175:邊緣絕緣膜</p>
        <p type="p">210:填充絕緣膜</p>
        <p type="p">A1-A1、A2-A2、B-B:線</p>
        <p type="p">AP:主動圖案</p>
        <p type="p">BC:埋置接觸件</p>
        <p type="p">CP:接觸插塞</p>
        <p type="p">CR:胞元區</p>
        <p type="p">CT1:第一接觸溝槽</p>
        <p type="p">D110:虛設字元線</p>
        <p type="p">DLP:虛設著陸接墊</p>
        <p type="p">I:第一區</p>
        <p type="p">II:第二區</p>
        <p type="p">LP:著陸接墊</p>
        <p type="p">PR:周邊區</p>
        <p type="p">R:區</p>
        <p type="p">W:第三方向</p>
        <p type="p">X:第二方向</p>
        <p type="p">Y:第一方向</p>
        <p type="p">Z:第四方向</p>
        <p type="p">θ:角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1208" publication-number="202616723">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616723</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127462</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於點雲壓縮之體素級編碼控制方法</chinese-title>
        <english-title>VOXEL-WISE CODING CONTROL METHOD FOR POINT CLOUD COMPRESSION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260102B">H04N19/91</main-classification>
        <further-classification edition="201401120260102B">H04N19/186</further-classification>
        <further-classification edition="201401120260102B">H04N19/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商內數位ＶＣ控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERDIGITAL VC HOLDINGS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龐　家昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANG, JIAHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛迪　穆罕默德　阿薩德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LODHI, MUHAMMAD ASAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安廷炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, JUNGHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田　棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAN, DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法之一些實施例可包含：將待編碼之點雲資料之一當前層次之兩個或更多個體素劃分成至少兩個群組；存取該當前層次之已編碼之體素；基於該當前層次之該等已編碼之體素，預測該當前層次中之一當前體素群組之機率分佈；存取待編碼之該當前體素群組之值；及基於該等預測機率分佈而將該當前體素群組之該等值編碼成一位元流。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Some embodiments of a method may include: partitioning, into at least two groups, two or more voxels of a current level of point cloud data to be encoded; accessing already-encoded voxels of the current level; predicting probability distributions of a current voxel group in the current level based on the already-encoded voxels of the current level; accessing values of the current voxel group to be encoded; and encoding the values of the current voxel group into a bitstream based on the predicted probability distributions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:編碼器程序</p>
        <p type="p">1004:機率分佈估計</p>
        <p type="p">1006:算術編碼</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1209" publication-number="202615381">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615381</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127469</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鎓鹽、化學增幅阻劑組成物及圖案形成方法</chinese-title>
        <english-title>ONIUM SALT, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERN FORMING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C25/18</main-classification>
        <further-classification edition="200601120260102B">C07C43/225</further-classification>
        <further-classification edition="200601120260102B">C07C211/63</further-classification>
        <further-classification edition="200601120260102B">C07C309/58</further-classification>
        <further-classification edition="200601120260102B">C07C381/12</further-classification>
        <further-classification edition="200601120260102B">C07D327/08</further-classification>
        <further-classification edition="200601120260102B">C07D333/76</further-classification>
        <further-classification edition="200601120260102B">C09K3/00</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供在使用高能射線之光微影中，無論正型或負型皆為高感度，解析度優良，改善EL、LWR、CDU、DOF等微影性能，且可抑制阻劑圖案之崩塌的化學增幅阻劑組成物所使用的鎓鹽、化學增幅阻劑組成物及圖案形成方法。  &lt;br/&gt;該課題之解決手段為一種鎓鹽，係以下式(1)表示。  &lt;br/&gt;&lt;img align="absmiddle" height="125px" width="331px" file="ed10306.JPG" alt="ed10306.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are an onium salt, a chemically amplified resist composition comprising the onium salt, and a pattern forming process using the chemically amplified resist composition, the chemically amplified resist composition exhibiting a high sensitivity, high resolution, improved lithography properties including EL, LWR, CDU and DOF, and resist pattern collapse resistance, when processed by photolithography using high-energy radiation independent of whether it is of positive or negative tone. &lt;br/&gt;An onium salt has the formula (1): &lt;br/&gt;&lt;img align="absmiddle" height="145px" width="336px" file="ed10307.JPG" alt="ed10307.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1210" publication-number="202616400">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616400</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127513</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及半導體裝置的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">H01L21/60</main-classification>
        <further-classification edition="200601120251103B">B32B15/088</further-classification>
        <further-classification edition="200601120251103B">B32B37/06</further-classification>
        <further-classification edition="200601120251103B">C08G73/10</further-classification>
        <further-classification edition="200601120251103B">H01L21/98</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商Ｒａｐｉｄｕｓ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAPIDUS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野中敏央</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NONAKA, TOSHIHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供能以低接合溫度實現強接合強度的半導體裝置(1)。半導體裝置(1)中，有機絕緣材的玻璃轉變溫度為140℃以上180℃以下；金屬材包含焊料；接觸金屬材的有機絕緣材的形成區域，與層積的半導體晶片(5)的大小較小的半導體晶片的外形相同或比外形還內側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體裝置</p>
        <p type="p">5A:第1半導體晶片</p>
        <p type="p">5B:第2半導體晶片</p>
        <p type="p">10A:第1半導體晶片本體</p>
        <p type="p">10B:第2半導體晶片本體</p>
        <p type="p">20:接合部</p>
        <p type="p">21:金屬接合部</p>
        <p type="p">22:樹脂接合部</p>
        <p type="p">30A:第1被壓合層</p>
        <p type="p">30B:第2被壓合層</p>
        <p type="p">34A:第1金屬被壓合部</p>
        <p type="p">34B:第2金屬被壓合部</p>
        <p type="p">36A:第1樹脂被壓合部</p>
        <p type="p">36B:第2樹脂被壓合部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1211" publication-number="202616080">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616080</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127520</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於ＬＩＮＴ錯誤的識別與解決的基於生成式ＡＩ的工具</chinese-title>
        <english-title>GENERATIVE AI-BASED TOOL FOR IDENTIFICATION AND RESOLUTION OF LINT ERRORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260102B">G06F11/36</main-classification>
        <further-classification edition="201801120260102B">G06F8/72</further-classification>
        <further-classification edition="201801120260102B">G06F8/41</further-classification>
        <further-classification edition="201801120260102B">G06F8/33</further-classification>
        <further-classification edition="202301120260102B">G06N3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商微軟技術授權有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICROSOFT TECHNOLOGY LICENSING, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈埃爾　希娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOEL, SHEENA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭　路克迪軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOK, LUKE TEE XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏格　艾瑞克威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERG, ERIK WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉米雷斯貝爾特蘭　雷蒙德彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMIREZ BELTRAN, RAYMOND PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊利　湯瑪斯大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RILEY, THOMAS DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露案的實施例包含用於在驗證軟體應用中解決Lint錯誤的軟體解決方案。可為類似於給定Lint錯誤的RAG條目而查詢RAG索引，前述給定Lint錯誤為在原始代碼中偵測到。從查詢返回的RAG條目可以反過來而利用在生成用於大型語言模型（LLM）的提示。LLM接收提示並且生成結果，前述結果含有隨後將作為可能解決方案而呈現給使用者的取代軟體代碼，以改正驗證軟體中的Lint錯誤。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure include a software solution for resolving Lint errors in a verification software application. A RAG index can be queried for a RAG entry that is similar to a given Lint error detected in the source code. The RAG entry returned from the query can in turn be utilized in generating a prompt for a Large Language Model (LLM). The LLM receives the prompt and generates a result that contains replacement software code that is subsequently presented to the user as a possible solution to correct the Lint error in the verification software.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:系統</p>
        <p type="p">210:GUI</p>
        <p type="p">220:軟體代碼分析工具</p>
        <p type="p">230:生成式AI工具</p>
        <p type="p">235:參考索引</p>
        <p type="p">240:資料來源</p>
        <p type="p">242:規則檔案</p>
        <p type="p">244:錯誤紀錄檔案</p>
        <p type="p">246:軟體代碼</p>
        <p type="p">250:大型語言模型(LLM)</p>
        <p type="p">260:Lint工具</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1212" publication-number="202616729">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616729</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127649</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚焦位置偏移量修正方法、聚焦位置偏移量修正系統及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251201B">H04N23/67</main-classification>
        <further-classification edition="201701120251201B">G06T7/13</further-classification>
        <further-classification edition="201701120251201B">G06T7/571</further-classification>
        <further-classification edition="201701120251201B">G06T7/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹下未來</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKESHITA, MIKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤田亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJITA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">聚焦位置偏移量修正方法是對相機(12)與零件(P1)進行對位，以使焦點對準被拍攝物即零件(P1)之聚焦位置偏移量修正方法，對學習模型輸入輸入資料，前述學習模型是藉由輸入包含相機(12)所拍攝的零件(P1)的聚焦評價值之輸入資料，來輸出相機(12)的聚焦位置與零件(P1)的相對位置偏移量，依據學習模型所輸出的前述相對位置偏移量來控制相機(12)及零件(P1)的至少一者的位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:聚焦位置偏移量修正系統</p>
        <p type="p">10:處理裝置</p>
        <p type="p">11:載台</p>
        <p type="p">12:相機</p>
        <p type="p">12a:相機本體</p>
        <p type="p">12b:光學系統</p>
        <p type="p">12c:照明機器</p>
        <p type="p">13:相機載台</p>
        <p type="p">20:控制裝置</p>
        <p type="p">M1:對準標記</p>
        <p type="p">P1:零件</p>
        <p type="p">X:X軸</p>
        <p type="p">Y:Y軸</p>
        <p type="p">Z:Z軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1213" publication-number="202615545">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615545</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127658</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚醯胺組成物</chinese-title>
        <english-title>POLYAMIDE COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08G69/26</main-classification>
        <further-classification edition="200601120260102B">C08L77/06</further-classification>
        <further-classification edition="200601120260102B">C08L77/00</further-classification>
        <further-classification edition="200601120260102B">C08K5/526</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商贏創運營有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVONIK OPERATIONS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王麗俠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LIXIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹奇　瓦倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DANKE, VARUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>滕飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENG, FEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藍曼　雷恩哈德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINEMANN, REINHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種組成物，其包含：至少50重量%之聚醯胺分率；該聚醯胺分率由下列組成：  &lt;br/&gt;　　a) 50至95重量份之至少一種基於具有10-20個碳原子之環脂族二胺和具有8-18個碳原子之脂族二羧酸的環脂族聚醯胺；及b) 50至5重量份之至少一種單體單元中具有平均9至12個C原子的線性脂族聚醯胺，其中a)和b)的重量份之總和為100。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composition, comprising: at least 50% by weight of a polyamide fraction; the polyamide fraction consisting of: a) 50 to 95 parts by weight of at least one cycloaliphatic polyamide based on a cycloaliphatic diamine having 10-20 carbon atoms and an aliphatic dicarboxylic acid having 8-18 carbon atoms; and b) 50 to 5 parts by weight of at least one linear aliphatic polyamide having an average of from 9 to 12 C atoms in the monomer units, wherein the sum of the parts by weight of a) and b) is 100.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1214" publication-number="202616596">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616596</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127694</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>齒輪型纜線保護系統</chinese-title>
        <english-title>GEAR TYPE CABLE PROTECTION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">H02G9/02</main-classification>
        <further-classification edition="200601120260114B">H02G3/04</further-classification>
        <further-classification edition="200601120260114B">F16L57/00</further-classification>
        <further-classification edition="200601120260114B">F16B7/04</further-classification>
        <further-classification edition="200601120260114B">F16L3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商班狄特公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANDUIT CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞力　羅得尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROULEAU, RODNEY G.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴克維爾　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASKERVILLE, STEVEN J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>車　謙武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEO, FRANCIS C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西塞羅　約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CICERO, JOSEPH D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米茲　諾亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZE, NOAH C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼爾森　凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NELSON, KEVIN L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴那熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, NAHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申正勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, JUNG HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛斯　加布里拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIMS, GABRIELA R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫　艦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯切爾克　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SZCZYRK, STEVEN A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔西　瑪麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TREACY, MARY G.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">
        &lt;b&gt;　　&lt;/b&gt;提供一種纜線保護系統，其包括配接特徵，用於實現環繞待保護纜線之有效且高效的組裝。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cable protection system is provided that includes mating features for enabling efficient and effective assembly around a cable to be protected.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1200:套管系統</p>
        <p type="p">1202:半套管</p>
        <p type="p">1204:強化區段</p>
        <p type="p">1204’:加強區段</p>
        <p type="p">1206:緊固件</p>
        <p type="p">1208:緊固件</p>
        <p type="p">1210:視覺提示</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1215" publication-number="202616464">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616464</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127698</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靜電卡盤、半導體處理設備及製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">H01L21/683</main-classification>
        <further-classification edition="200601120251103B">H01L21/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡楚洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倪　圖強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NI, TU-QIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種靜電卡盤、半導體處理設備及製造方法，所述靜電卡盤包括：電極層；設置於所述電極層上方的介電層；所述介電層由包括高介電常數材料和絕緣材料的混合物製備；所述高介電常數材料呈晶須狀，且所述高介電常數材料的介電常數大於所述絕緣材料的介電常數；所述混合物中所述高介電常數材料的質量百分比為0.5%~1%。本發明可以提高靜電卡盤仲介電層的介電常數，使得晶圓與靜電卡盤之間形成的電容增大，從而使得分配在靜電卡盤的射頻能量減少且分配在鞘層的射頻能量增加，以保證晶圓的工藝處理結果滿足要求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:靜電卡盤</p>
        <p type="p">110:電極層</p>
        <p type="p">120:介電層</p>
        <p type="p">200:晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1216" publication-number="202616342">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616342</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127700</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>約束環、電漿處理裝置及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">H01J37/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉　如彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, RUBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種約束環、電漿處理裝置及方法，電漿處理裝置的反應腔內設有用於承載晶圓的基座，約束環圍繞在基座的外周將反應腔內的空間分為電漿處理區域和排氣區域，約束環包括：第一子環，其為導電材質並電性連接第一電源，通過第一子環防止電漿進入排氣區域，第一子環設有第一氣流通道；第二子環，其位於電漿處理區域與第一子環之間，第二子環設有與第一氣流通道氣路連通的第二氣流通道；第二子環表面的電漿鞘層電壓小於第一子環表面的電漿鞘層電壓。本發明的約束環具有較大的抽氣流導，有效約束電漿的同時還能避免對晶圓造成顆粒污染。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:電漿處理裝置</p>
        <p type="p">20:反應腔</p>
        <p type="p">20a:電漿處理區域</p>
        <p type="p">20b:排氣區域</p>
        <p type="p">202:基座</p>
        <p type="p">203:氣體噴淋頭</p>
        <p type="p">204:中接地環</p>
        <p type="p">205:下接地環</p>
        <p type="p">206:約束環</p>
        <p type="p">2061:第一子環</p>
        <p type="p">20611:第一環板</p>
        <p type="p">2062:第二子環</p>
        <p type="p">20621:第二環板</p>
        <p type="p">210:第一電源</p>
        <p type="p">240:源射頻電源</p>
        <p type="p">241:低頻射頻電源</p>
        <p type="p">Td1:第一氣流通道</p>
        <p type="p">Td2:第二氣流通道</p>
        <p type="p">P:電漿</p>
        <p type="p">W:晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1217" publication-number="202616465">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616465</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127703</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靜電吸盤及電漿處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250902B">H01L21/683</main-classification>
        <further-classification edition="200601120250902B">H02N13/00</further-classification>
        <further-classification edition="200601120250902B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉　如彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, RUBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種靜電吸盤，設置在電漿處理裝置的反應腔內，包括：基座，所述基座的內部形成有第一通孔，所述第一通孔內設有分流部件；基板，所述基板設置在所述基座的上方，其上表面用於承載晶圓，該基板的內部形成有與所述第一通孔連通的第二通孔，該第二通孔的頂端位於所述晶圓的下表面；隔離層，設置在所述第一通孔的側壁和分流部件的側壁之間，所述隔離層包括導電層，該導電層與所述基座電位相等，使基座和導電層形成等電勢體，從而使基座和導電層之間不存在電勢差，從而避免了基座和分流部件之間發生起弧放電現象，延長了靜電吸盤的使用壽命。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">230:基板</p>
        <p type="p">232:第二通孔</p>
        <p type="p">240:基座</p>
        <p type="p">241:第一通孔</p>
        <p type="p">242:氣體通道</p>
        <p type="p">250:分流部件</p>
        <p type="p">251:導電層</p>
        <p type="p">270:黏合層</p>
        <p type="p">A:重合區域</p>
        <p type="p">W:晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1218" publication-number="202615405">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615405</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127707</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻劑組成物、阻劑圖型形成方法、化合物，以及酸擴散控制劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C309/11</main-classification>
        <further-classification edition="200601120260102B">C07C381/12</further-classification>
        <further-classification edition="200601120260102B">C07D333/76</further-classification>
        <further-classification edition="200601120260102B">C09K3/00</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤広樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明採用一種阻劑組成物，其為藉由曝光產生酸，且藉由酸的作用使對顯影液的溶解性產生變化的阻劑組成物，其包含：藉由酸的作用使對顯影液的溶解性產生變化的基材成分，與由通式(d0)所表示之化合物。在通式(d0)中，R&lt;sup&gt;Ar&lt;/sup&gt;為芳香環。I為碘原子，R&lt;sup&gt;d0&lt;/sup&gt;為碘原子以外之取代基。k為1以上之整數。j為0以上之整數。h為1、2或3。Y&lt;sup&gt;d0&lt;/sup&gt;為(h+1)價之連接基或單鍵。m為1以上之整數，且M&lt;sup&gt;m+&lt;/sup&gt;表示m價之有機陽離子。根據該阻劑組成物，在阻劑圖型之形成中，可謀求高感度化，並能提高降低粗糙度等之微影特性。  &lt;br/&gt;&lt;img align="absmiddle" height="251px" width="538px" file="ed10109.JPG" alt="ed10109.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1219" publication-number="202615909">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615909</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127728</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光源裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G02B6/12</main-classification>
        <further-classification edition="200601120260102B">G02B6/122</further-classification>
        <further-classification edition="200601120260102B">G02B6/293</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新倉史智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIIKURA, FUMINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村共則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, TOMONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之光源裝置具備：光積體電路，其具有基板；光學元件，其形成於基板，輸出具有指定波長之計測光；輸出部，其形成於基板，將計測光輸出至基板之外部；光分離部，其係被輸入自輸出部輸出之計測光之一部分，將計測光之一部分以指定之分離率分離成第1光與第2光者，且分離率於指定之波長域中單調變化；光檢測部，其檢測第1光及第2光之至少一者；及運算部，其至少基於光檢測部之檢測結果，算出計測光之全光量及重心波長。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光源裝置</p>
        <p type="p">2:光源</p>
        <p type="p">3:輸入部</p>
        <p type="p">4:波長濾光部</p>
        <p type="p">5:波長選擇部</p>
        <p type="p">5a:光學元件</p>
        <p type="p">5b:加熱器</p>
        <p type="p">6:輸出部</p>
        <p type="p">7:分光器</p>
        <p type="p">8:波長檢測部</p>
        <p type="p">9:電腦</p>
        <p type="p">9a:控制部</p>
        <p type="p">9b:運算部</p>
        <p type="p">10:光積體電路</p>
        <p type="p">11:基板</p>
        <p type="p">12:第1波導</p>
        <p type="p">13:分支耦合器</p>
        <p type="p">14:第2波導</p>
        <p type="p">LB:對象光</p>
        <p type="p">Li:輸入光</p>
        <p type="p">LM:計測光</p>
        <p type="p">Lo:輸出光</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1220" publication-number="202615843">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615843</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127729</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>物質感測裝置、光積體電路及物質感測方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251203B">G01N21/45</main-classification>
        <further-classification edition="200601120251203B">G02B6/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村共則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, TOMONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新倉史智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIIKURA, FUMINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之物質感測裝置具備：光積體電路，其具有基板；環形諧振器，其係形成於基板者，具有第1波導、設置有供物質結合之複數個受體之環形波導、及第2波導；光分離部，其係被輸入於第1波導中行進之計測光，將計測光以指定之分離率分離成第1光與第2光者，且該分離率於指定之波長域中單調變化；光檢測部，其檢測第1光及第2光之至少一者；及運算部，其至少基於光檢測部之檢測結果，取得計測光之重心波長相關之資訊，基於重心波長相關之資訊，取得與複數個受體結合之物質的量相關之資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:物質感測裝置</p>
        <p type="p">2:光源</p>
        <p type="p">3:輸入部</p>
        <p type="p">4:波長過濾部</p>
        <p type="p">5:環形諧振器</p>
        <p type="p">6:輸出部</p>
        <p type="p">8:波長檢測部</p>
        <p type="p">9:電腦</p>
        <p type="p">9a:控制部</p>
        <p type="p">9b:運算部</p>
        <p type="p">9c:顯示部</p>
        <p type="p">9d:輸入部</p>
        <p type="p">10:光積體電路</p>
        <p type="p">11:基板</p>
        <p type="p">51:第1波導</p>
        <p type="p">51a:透過部</p>
        <p type="p">52:環形波導</p>
        <p type="p">53:第2波導</p>
        <p type="p">L:計測光</p>
        <p type="p">RP:受體</p>
        <p type="p">S:物質</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1221" publication-number="202615422">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615422</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127732</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鹼產生劑、硬化性樹脂組成物、其硬化物及印刷配線板</chinese-title>
        <english-title>BASE-GENERATING AGENT, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF, AND PRINTED CIRCUIT BOARD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07D233/58</main-classification>
        <further-classification edition="200601120260102B">C07F5/02</further-classification>
        <further-classification edition="200601120260102B">C09K3/00</further-classification>
        <further-classification edition="200601120260102B">C08K5/3445</further-classification>
        <further-classification edition="200601120260102B">C08K5/55</further-classification>
        <further-classification edition="200601120260102B">C08L63/00</further-classification>
        <further-classification edition="200601120260102B">H05K1/03</further-classification>
        <further-classification edition="200601120260102B">H05K3/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本化藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON KAYAKU KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅原堅太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGAWARA, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寺田究</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERADA, KIWAMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供在一液中之儲存穩定性優異，同時在期望的硬化溫度中發揮高的觸媒活性並在短時間內引發硬化反應之鹼產生劑、硬化性樹脂組成物及印刷配線板。  &lt;br/&gt;一種下述式(a)所表示之鹼產生劑，其係由咪唑鎓陽離子(imidazolium cation)與有機酸或無機酸的陰離子殘基所構成。  &lt;br/&gt;&lt;img align="absmiddle" height="119px" width="417px" file="ed10024.JPG" alt="ed10024.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;式(a)中，A係表示可包含雜原子的碳數1至8的二價基，R&lt;sub&gt;1&lt;/sub&gt;至R&lt;sub&gt;4&lt;/sub&gt;係分別獨立地為氫原子、可具有取代基的碳數1至8的烷基、可具有取代基的碳數6至20的芳基或可具有取代基的碳數7至20的烷基芳基，R&lt;sub&gt;1&lt;/sub&gt;與R&lt;sub&gt;2&lt;/sub&gt;、R&lt;sub&gt;2&lt;/sub&gt;與R&lt;sub&gt;3&lt;/sub&gt;、R&lt;sub&gt;3&lt;/sub&gt;與R&lt;sub&gt;4&lt;/sub&gt;可分別鍵結而形成環結構。R&lt;sub&gt;5&lt;/sub&gt;至R&lt;sub&gt;9&lt;/sub&gt;係分別獨立地表示氫原子、可具有取代基的碳數1至8的烷基、鹵素原子、羥基、烷氧基、巰基、硫醚基(sulfide group)、矽基、矽烷醇基、硝基、亞硝基、氰基、亞磺酸基、磺酸基、磺酸根基、膦基、亞膦醯基(phosphinyl group)、膦醯基(phosphono group)、膦酸根基(phosphonato group)、胺基或銨基，R&lt;sub&gt;5&lt;/sub&gt;與R&lt;sub&gt;6&lt;/sub&gt;、R&lt;sub&gt;6&lt;/sub&gt;與R&lt;sub&gt;7&lt;/sub&gt;、R&lt;sub&gt;7&lt;/sub&gt;與R&lt;sub&gt;8&lt;/sub&gt;、R&lt;sub&gt;8&lt;/sub&gt;與R&lt;sub&gt;9&lt;/sub&gt;可分別鍵結而形成環結構。X&lt;sup&gt;-&lt;/sup&gt;為有機酸或無機酸的陰離子殘基。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are an base-generating agent, curable resin composition, and printed circuit board, all having excellent storage stability in a liquid, demonstrate high catalytic activity at the desired curing temperature, and initiate the curing reaction within a short time. &lt;br/&gt;The base-generating agent represented by the following formula (a), which is composed of an imidazolium cation and an anionic residue of an organic or inorganic acid. &lt;br/&gt;&lt;img align="absmiddle" height="114px" width="422px" file="ed10025.JPG" alt="ed10025.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(In the formula (a), A represents a divalent group having 1 to 8 carbon atoms that may include heteroatoms; R&lt;sub&gt;1&lt;/sub&gt; to R&lt;sub&gt;4&lt;/sub&gt; each independently represent a hydrogen atom, an alkyl group having 1 to 8 carbon atoms which may have substituents, an aryl group having 6 to 20 carbon atoms which may have substituents, or an alkylaryl group having 7 to 20 carbon atoms which may have substituents; R&lt;sub&gt;1&lt;/sub&gt; may be bonded to R&lt;sub&gt;2&lt;/sub&gt;, R&lt;sub&gt;2&lt;/sub&gt; may be bonded to R&lt;sub&gt;3&lt;/sub&gt;, R&lt;sub&gt;3&lt;/sub&gt; and R&lt;sub&gt;4&lt;/sub&gt; may each be bonded to form a ring structure. R&lt;sub&gt;5&lt;/sub&gt; to R&lt;sub&gt;9&lt;/sub&gt; each independently represent a hydrogen atom; an alkyl group having 1 to 8 carbon atoms which may have substituents; a halogen atom; a hydroxyl group; an alkoxy group; a mercapto group; a sulfide group; a silyl group, a silanol group, a nitro group, a nitroso group, a cyano group, a sulfino group, a sulfo group, a sulfonate group, a phosphine group, a phosphinyl group, a phosphono group, a phosphonato group, an amino group, or an ammonium group; R&lt;sub&gt;5&lt;/sub&gt; may be bonded to R&lt;sub&gt;6&lt;/sub&gt;, R&lt;sub&gt;6&lt;/sub&gt; to R&lt;sub&gt;7&lt;/sub&gt;, R&lt;sub&gt;7&lt;/sub&gt; to R&lt;sub&gt;8&lt;/sub&gt;, and R&lt;sub&gt;8&lt;/sub&gt; to R&lt;sub&gt;9&lt;/sub&gt; to form ring structures. X⁻ represents the anionic residue of an organic or inorganic acid.)</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1222" publication-number="202615962">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615962</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127843</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於極紫外線光罩檢測工具之跡變測量光學件及測量方法</chinese-title>
        <english-title>APODIZATION MEASUREMENT OPTICS AND MEASUREMENT METHOD FOR EUV RETICLE INSPECTION TOOL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260102B">G03F1/24</main-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日高康弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIDAKA, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　晙源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JUNWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種檢測系統可為一EUV光罩檢測工具。該檢測系統可包含物鏡光學件及成像光學件。該等成像光學件可包含光瞳中繼光學件。該等光瞳中繼光學件之一第一光瞳中繼反射鏡可延伸至成像路徑中及自該成像路徑回縮，以實現在一偵測器上對場影像及光瞳影像成像。該等光瞳影像可用於測量光瞳之強度剖面。該等光瞳中繼光學件之組態可包含延伸於該等物鏡光學件之一第二反射物鏡與一第三反射物鏡之間或延伸於該等物鏡光學件之第四反射物鏡與該偵測器之間的該第一光瞳中繼反射鏡。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An inspection system may be an EUV reticle inspection tool. The inspection system may include objective optics and imaging optics. The imaging optics may include pupil-relay optics. A first pupil-relay mirror of the pupil-relay optics may be extended into and retracted from the imaging path to enable imaging field images and pupil images on a detector. The pupil images may be used for measuring the intensity profile in pupil. Configurations of the pupil-relay optics may include the first pupil-relay mirror extending between a second and third objective mirrors of the objective optics or extending between fourth objective mirror of the objective optics and the detector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">103:樣本</p>
        <p type="p">106b:光瞳成像模式</p>
        <p type="p">108:偵測器</p>
        <p type="p">118:孔徑光闌</p>
        <p type="p">120:第一反射物鏡</p>
        <p type="p">122:第二反射物鏡</p>
        <p type="p">124:第三反射物鏡</p>
        <p type="p">126:第四反射物鏡</p>
        <p type="p">128:第一光瞳中繼反射鏡</p>
        <p type="p">130:第二光瞳中繼反射鏡</p>
        <p type="p">132:場平面</p>
        <p type="p">138:光瞳影像</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1223" publication-number="202615842">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615842</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127882</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>濃度測量裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260102B">G01N21/3577</main-classification>
        <further-classification edition="200601120260102B">G01N9/24</further-classification>
        <further-classification edition="200601120260102B">G01J1/10</further-classification>
        <further-classification edition="200601120260102B">G06F17/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士金股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIKIN INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中一輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, KAZUTERU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井秀和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, HIDEKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉本耕祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIMOTO, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永瀬正明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGASE, MASAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種濃度測量裝置(100)，具備：測量元件(10)；光源單元(20)，發出入射至測量元件的測量光；測量光檢測器(24)，接受從測量元件射出的測量光；測量光源單元的構件溫度的溫度感測器(16)、或測量流經測量元件的流體之溫度的溫度感測器(6)；以及處理電路(28)，被連接至測量光檢測器及溫度感測器，並基於測量光檢測器及溫度感測器的輸出，測量流經測量元件的流體之濃度；其中，流體的濃度是根據朗伯-比爾定律來運算而求出，該定律係基於測量光檢測器(24)所輸出的透射光強度I相對於入射光強度I&lt;sub&gt;0&lt;/sub&gt;的比；入射光強度I&lt;sub&gt;0&lt;/sub&gt;係基於溫度感測器(6、16)所測量的溫度來被決定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:窗</p>
        <p type="p">4:反射部件</p>
        <p type="p">6:溫度感測器</p>
        <p type="p">8:壓力感測器</p>
        <p type="p">10:測量元件</p>
        <p type="p">12,14:光纖纜線</p>
        <p type="p">16:溫度感測器</p>
        <p type="p">20:電性單元</p>
        <p type="p">20a,20b:發光元件</p>
        <p type="p">22:立方體分光器</p>
        <p type="p">24:測量光檢測器</p>
        <p type="p">26:參照光檢測器</p>
        <p type="p">28:控制電路</p>
        <p type="p">50A:流體單元</p>
        <p type="p">50B:電性單元</p>
        <p type="p">100:濃度測量裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1224" publication-number="202615416">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615416</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127929</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鎓鹽、化學增幅阻劑組成物及圖案形成方法</chinese-title>
        <english-title>ONIUM SALT, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERN FORMING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C381/00</main-classification>
        <further-classification edition="200601120260102B">C07C381/12</further-classification>
        <further-classification edition="200601120260102B">C07D327/08</further-classification>
        <further-classification edition="200601120260102B">C07D333/76</further-classification>
        <further-classification edition="200601120260102B">C07D335/12</further-classification>
        <further-classification edition="200601120260102B">C09K3/00</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供在使用高能射線的微影中，溶劑溶解性優異、高感度、高對比度且LWR、CDU、MEF、EL、DOF等微影性能優異的化學增幅阻劑組成物中使用的鎓鹽、包含該鎓鹽作為光酸產生劑的化學增幅阻劑組成物、及使用該化學增幅阻劑組成物的圖案形成方法。一種鎓鹽，以下述式(1)表示。  &lt;br/&gt;&lt;img align="absmiddle" height="128px" width="495px" file="ed10316.JPG" alt="ed10316.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An onium salt having the formula (1). &lt;br/&gt;&lt;img align="absmiddle" height="121px" width="491px" file="ed10317.JPG" alt="ed10317.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1225" publication-number="202616042">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616042</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127973</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>冷板、冷板組件及主機板模組</chinese-title>
        <english-title>COLD PLATE, COLD PLATE ASSEMBLY AND MOTHERBOARD MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250829B">G06F1/20</main-classification>
        <further-classification edition="200601120250829B">H05K7/20</further-classification>
        <further-classification edition="200601120250829B">F28F3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯穎科技服務股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIWYNN CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪晧展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, HAO-JHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳璁毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TSUNG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭屹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, TSUNG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YAN YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種冷板，包含一主入流道、一子入流道、一熱交換腔室、一子出流道及一主出流道。主入流道具有一冷液入口及一冷液出口。子入流道連通於主入流道。熱交換腔室連通於子入流道。子出流道連通於熱交換腔室。主出流道連通於子出流道，且具有一熱液入口及一熱液出口。冷板具有相對的一第一側及一第二側。主入流道的冷液入口及主出流道的熱液出口位於冷板的第一側。主入流道的冷液出口及主出流道的熱液入口位於冷板的第二側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cold plate includes a main inlet channel, a sub-inlet channel, a heat exchange chamber, a sub-outlet channel and a main outlet channel. The main inlet channel has a cold coolant inlet and a cold coolant outlet. The sub-inlet channel is in communication with the main inlet channel. The heat exchange chamber is in communication with the sub-inlet channel. The sub-outlet channel is in communication with the heat exchange chamber. The main outlet channel is in communication with the sub-outlet channel and has a hot coolant inlet and a hot coolant outlet. The cold plate has a first side and second side located opposite to each other. The cold coolant inlet of the main inlet channel and the hot coolant outlet of the main outlet channel are located on the first side of the cold plate. The cold coolant outlet of the main inlet channel and the hot coolant inlet of the main outlet channel are located on the second side of the cold plate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:主機板</p>
        <p type="p">11:電路板</p>
        <p type="p">111:表面</p>
        <p type="p">12:第一熱源</p>
        <p type="p">13:第二熱源</p>
        <p type="p">20:冷板組件</p>
        <p type="p">21:第一冷板</p>
        <p type="p">22:第二冷板</p>
        <p type="p">23:主入液管</p>
        <p type="p">24:主出液管</p>
        <p type="p">25:第一連通管</p>
        <p type="p">26:第二連通管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1226" publication-number="202615102">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615102</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128000</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗體藥物偶聯物用於治療癌症的方法</chinese-title>
        <english-title>THE METHOD OF USING ANTIBODY DRUG CONJUGATES FOR THE TREATMENT OF CANCER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260102B">A61K47/68</main-classification>
        <further-classification edition="200601120260102B">A61K39/395</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海翰森生物醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI HANSOH BIOMEDICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商常州恆邦藥業有限公司 中國江蘇省常州市新北區遼河路1028號　郵編：213001</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANGZHOU HANSOH PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, ZHIQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董一唯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONG, YIWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉清源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, QINGYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張曉青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIAOQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種抗體藥物偶聯物用於治療癌症的方法。具體而言，本發明提供一種抗體藥物偶聯物用於治療癌症的方法以及該抗體藥物偶聯物在製備治療癌症的藥物中的應用，該方法具有改善的安全性，且在多個瘤種中展現了有前景的抗腫瘤活性，能夠滿足醫療需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the method of using antibody drug conjugates for the treatment of cancer. Specifically, the present invention provides a method of using antibody drug conjugates for the treatment of cancer and the application of the antibody drug conjugates in the preparation of drugs for cancer treatment. The method has improved safety and shows promising anti-tumor activity in multiple tumor types, which can meet medical needs.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1227" publication-number="202615287">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615287</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128028</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於折疊自行車的可拆卸車把及前叉</chinese-title>
        <english-title>DETACHABLE HANDLEBAR AND FRONT FORK FOR COMPACTABLE BICYCLES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B62K15/00</main-classification>
        <further-classification edition="200601120260102B">B62K21/18</further-classification>
        <further-classification edition="200601120260102B">B62K19/30</further-classification>
        <further-classification edition="200601120260102B">B62K19/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商海利克斯實驗室公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HELIX LABS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑塔奇斯　彼特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOUTAKIS, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了用於可折疊自行車的可拆卸車把和前叉中的至少一者。可折疊自行車包括：車架；可旋轉地連接到車架的叉件；可旋轉地連接到叉件的第一車輪；可旋轉地連接到車架並機械連接到曲柄的第二車輪；連接到車架的車座；可拆卸地連接到叉件的立管，立管在附接後使叉件相對於車架旋轉；連接到立管的車把；以及位於立管和車架中間的鉸鏈，容許車把和立管從車架拆卸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is provided at least one of a detachable handlebar and a front fork for a compactable bicycle. The compactable bicycle includes: a frame; a fork rotatably connected to the frame; a first wheel rotationally connected to the fork; a second wheel rotationally connected to the frame and in mechanical connection to a crank; a saddle connected to the frame; a stem detachable connectable to the fork, the stem rotates the fork relative to the frame when attached; a handlebar connected to the stem; and a hinge located intermediate the stem and the frame to permit detachment of the handlebar and the stem from the frame.</p>
      </isu-abst>
      <representative-img>
        <p type="p">9:縱向軸線</p>
        <p type="p">10:折疊自行車/可折疊自行車/自行車</p>
        <p type="p">12:前車架/基架</p>
        <p type="p">14:後車架</p>
        <p type="p">16:第一車輪/前輪</p>
        <p type="p">18:第二車輪/後輪</p>
        <p type="p">20:車把/可拆卸車把</p>
        <p type="p">22:曲柄</p>
        <p type="p">24:車座柱</p>
        <p type="p">26:車座</p>
        <p type="p">28:前叉</p>
        <p type="p">29:轉向構件</p>
        <p type="p">30:車把立管/立管</p>
        <p type="p">31:前鏈輪</p>
        <p type="p">32:前車架鉸鏈/叉件鉸鏈</p>
        <p type="p">33:後鏈輪</p>
        <p type="p">34:後車架鉸鏈</p>
        <p type="p">35:鏈條</p>
        <p type="p">36:車把鉸鏈/立管鉸鏈</p>
        <p type="p">38:後夾</p>
        <p type="p">42:車把立管鎖定構件/可拆卸夾機構/前叉鎖定構件</p>
        <p type="p">72:頭管</p>
        <p type="p">G:地面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1228" publication-number="202615045">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615045</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128095</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ATR激酶抑制劑的鹽、其固體形式及其製備方法與用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/535</main-classification>
        <further-classification edition="200601120260102B">A61K31/519</further-classification>
        <further-classification edition="200601120260102B">A61K31/44</further-classification>
        <further-classification edition="200601120260102B">A61K31/4155</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國商北京泰德製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING TIDE PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孙宇航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, YUHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王红军</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HONGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冯泽旺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, ZEWANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田娜娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAN, NANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赵焰平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, YANPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>付深振</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, SHENZHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>张正祎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, ZHENGYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黄闯闯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUANGCHUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏来</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, LAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜春雪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, CHUNXUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楚文豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, WENHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及化合物A的鹽酸鹽及其晶型、它們的製備方法、包含所述鹽酸鹽或晶型的組合物及它們在治療ART激酶抑制劑調節的疾病中的用途。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="154px" width="287px" file="ed10016.JPG" alt="ed10016.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1229" publication-number="202615508">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615508</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128120</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含羧基之高分子分散劑、導電性糊料、電子零件及積層陶瓷電容器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F220/06</main-classification>
        <further-classification edition="200601120260102B">C08F220/18</further-classification>
        <further-classification edition="202201120260102B">C09K23/52</further-classification>
        <further-classification edition="202201120260102B">B22F1/107</further-classification>
        <further-classification edition="200601120260102B">C09D1/00</further-classification>
        <further-classification edition="201801120260102B">C09D7/20</further-classification>
        <further-classification edition="201801120260102B">C09D7/45</further-classification>
        <further-classification edition="200601120260102B">C09D5/24</further-classification>
        <further-classification edition="200601120260102B">H01B1/22</further-classification>
        <further-classification edition="200601120260102B">H01G4/008</further-classification>
        <further-classification edition="200601120260102B">H01G4/12</further-classification>
        <further-classification edition="200601120260102B">H01G4/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友金屬鑛山股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO METAL MINING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福田健二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUDA, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供可抑制導電性粉末與陶瓷粉末之分離，且經時黏度穩定性良好之低黏度導電性糊料、含羧基之高分子分散劑、電子零件及積層陶瓷電容器。  &lt;br/&gt;　　係由丙烯酸或甲基丙烯酸中至少任一者，與以下述通式(1)所表示之丙烯酸酯或以下述通式(2)所表示之甲基丙烯酸酯中至少任一者之共聚物所構成之含羧基之高分子分散劑，質量平均分子量為2000以上至未達30000，以莫耳比計，前述丙烯酸及前述甲基丙烯酸之合計(X)與前述丙烯酸酯及前述甲基丙烯酸酯之合計(1-X)之比為X：1-X，前述分散劑之漢森溶解度參數與溶媒之漢森溶解度參數之距離(Ra)為5.5以上至7.5以下。  &lt;br/&gt;&lt;img align="absmiddle" height="157px" width="351px" file="ed10023.JPG" alt="ed10023.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="188px" width="379px" file="ed10024.JPG" alt="ed10024.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:積層陶瓷電容器</p>
        <p type="p">10:陶瓷積層體</p>
        <p type="p">20:外部電極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1230" publication-number="202616473">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616473</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128136</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及半導體裝置的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251230B">H01L21/764</main-classification>
        <further-classification edition="200601120251230B">H01L23/535</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商Ｒａｐｉｄｕｓ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAPIDUS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿佐見範之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAMI, NORIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">構成半導體裝置，具備：連接至形成於上層配線層，上層配線的形成於下層配線層的第1下層配線；未與上層配線連接，形成於下層配線層的第2下層配線。半導體裝置，具備：接觸第1下層配線與第2下層配線形成的空氣間隙；相對於第2下層配線接觸空氣間隙相反側的下層絕緣層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">101:空氣間隙</p>
        <p type="p">102,103,104,105,106,107,151,152:配線</p>
        <p type="p">110:配線區域</p>
        <p type="p">111,112,113,114,115,116,117,118,119,155,156,157:絕緣層</p>
        <p type="p">120:下層</p>
        <p type="p">130:上層</p>
        <p type="p">150:虛擬配線區域</p>
        <p type="p">160:虛線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1231" publication-number="202615230">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615230</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128153</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機器手</chinese-title>
        <english-title>HAND</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">B25J15/08</main-classification>
        <further-classification edition="200601120260114B">B25J15/12</further-classification>
        <further-classification edition="200601120260114B">B25J9/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商川崎重工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>榎本和馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENOMOTO, KAZUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡朋暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKA, TOMOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠山善貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYAMA, YOSHITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">機器手10係具備：複數手指2，係可沿第一方向X作張開閉合，且沿與第一方向X交叉的第二方向Y延伸；本體3，係支持複數個指部2；及爪部4，係配置在複數個指部2的前端。爪部4係具有導引面43，該導引面係與複數手指2的進接對象接觸，藉此進行複數個指部2在與第二方向Y交叉的平面內的定位。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The hand (10) comprises a plurality of fingers (2) configured to open and close along a first direction (X) and extending in a second direction (Y) intersecting the first direction (X); a body (3) that supports the plurality of fingers (2); and a claw (4) disposed at the distal ends of the plurality of fingers (2). The claw (4) comprises a guide surface (43) that positions the plurality of fingers (2) within a plane intersecting the second direction (Y) by contacting an object accessed by the plurality of fingers (2).</p>
      </isu-abst>
      <representative-img>
        <p type="p">2A:第一指部</p>
        <p type="p">2B:第二指部</p>
        <p type="p">3:本體</p>
        <p type="p">4:爪部</p>
        <p type="p">5A:第一繩帶</p>
        <p type="p">6:共同致動器(開閉致動器、進退致動器)</p>
        <p type="p">7:配件</p>
        <p type="p">10:機器手</p>
        <p type="p">31a:第一側壁</p>
        <p type="p">31b:第二側壁</p>
        <p type="p">35:開縫</p>
        <p type="p">41:爪部本體</p>
        <p type="p">42:腳部</p>
        <p type="p">43c:第三導引面</p>
        <p type="p">43d:第四導引面</p>
        <p type="p">45a:第一前端面</p>
        <p type="p">45b:第二前端面</p>
        <p type="p">45c:第三前端面</p>
        <p type="p">45d:第四前端面</p>
        <p type="p">45e:切口</p>
        <p type="p">46:開縫</p>
        <p type="p">51:第一導件</p>
        <p type="p">62b:卡止部</p>
        <p type="p">63:殼體</p>
        <p type="p">A:基準軸</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
        <p type="p">Z:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1232" publication-number="202615589">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615589</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128190</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於增強熱界面材料之性能之膦酸</chinese-title>
        <english-title>PHOSPHONIC ACID FOR ENHANCING PERFORMANCE OF THERMAL INTERFACE MATERIALS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08L101/00</main-classification>
        <further-classification edition="200601120260102B">C08L83/04</further-classification>
        <further-classification edition="201801120260102B">C08K3/013</further-classification>
        <further-classification edition="200601120260102B">C08K5/5317</further-classification>
        <further-classification edition="200601120260102B">H01L23/373</further-classification>
        <further-classification edition="200601120260102B">H01L23/552</further-classification>
        <further-classification edition="200601120260102B">H05K9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商雷爾德科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAIRD TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐德　克里斯汀娜　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLDER, CHRISTINA M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派德森　安納塔西亞　莉莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATTERSON, ANASTASIA LILY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恩瓦楚庫　奇德拉　伊函依</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NWACHUKWU, CHIDERAA IHEANYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁芮綺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, RUIQI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅斯　傑弗瑞　史考特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METH, JEFFREY SCOTT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯納德　史蒂芬妮　安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERNARD, STEPHANIE ANN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示關於一種膦酸之用途，其用於增強熱界面材料（廣義上指複合物）之性能，例如藉由改善流變性質、改善老化性質、改善儲存壽命、改善黏性/黏附性、及/或減少從中遷移之材料（若有）之擴散（例如，減少滲油擴散等）。本揭示亦關於使用膦酸增強用於熱及/或電磁干擾（EMI）管理之複合物之性能之方法。複合物可包含熱管理及/或電磁干擾（EMI）減輕材料，諸如熱界面材料（TIM）、EMI吸收劑材料、導熱EMI吸收劑材料、導電材料、其組合等。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to the use of phosphonic acid to enhance performance of thermal interface materials (broadly, composites), e.g., by improving rheological properties, improving aging properties, improving shelf life, improving tack/adhesion, and/or reducing the spreading of material(s), if any, migrating therefrom (e.g., reduced oil bleed spreading, etc.). The present disclosure also relates to methods of using phosphonic acids for enhancing performance of composites useful for management of heat and/or electromagnetic interference (EMI). The composite may comprise thermal management and/or electromagnetic interference (EMI) mitigation materials, such as thermal interface materials (TIMs), EMI absorber materials, thermally-conductive EMI absorber materials, electrically-conductive materials, combinations thereof, etc.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1233" publication-number="202615061">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615061</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128209</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自魚類萃取ＤＮＡ之方法及在骨質疏鬆症與骨關節炎中使用其之方法</chinese-title>
        <english-title>METHOD OF EXTRACTING DNA FROM FISH AND METHOD OF USING THE SAME IN OSTEOPOROSIS AND OSTEOARTHRITIS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/7088</main-classification>
        <further-classification edition="200601120260102B">A61P19/02</further-classification>
        <further-classification edition="200601120260102B">A61P19/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利統股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LYTONE ENTERPRISE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂明真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, MING JHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓宇聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, YU-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張薇婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, WEI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張天鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, WILLIAM T.H.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗邦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種自魚類萃取DNA之方法及使用該DNA萃取物之方法。本文所提供之DNA萃取物在改善或治療骨關節炎或骨質疏鬆症上產生功效。小鼠實驗證明，該DNA萃取物改善與骨關節炎或骨質疏鬆症相關之臨床參數。另外，該DNA萃取物展現自由基清除活性、抗氧化活性、抗抑鬱劑活性及黑髮促進活性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a method of extracting DNA from fish and a method of using the DNA extract. The DNA extract provided herein produces the efficacies in ameliorating or treating osteoarthritis or osteoporosis. Mice experiments prove that clinical parameters associated with osteoarthritis or osteoporosis are improved by the DNA extract. In addition, the DNA extract exhibits free radical scavenging activities, anti-oxidative activities, anti-depressant activities, and black hair promoting activities.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1234" publication-number="202615074">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615074</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128264</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>補充益生菌雞尾酒醫用食品配方可延長帕金森氏症患者對　L-DOPA　用藥的穩定性及減低長期用藥副作用的發生</chinese-title>
        <english-title>PROBIOTIC COCKTAIL MEDICAL FOOD TO ENHANCE L-DOPA STABILITY AND REDUCE SIDE EFFECTS IN PARKINSON'S DISEASE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120251001B">A61K35/74</main-classification>
        <further-classification edition="201501120251001B">A61K35/744</further-classification>
        <further-classification edition="201501120251001B">A61K35/745</further-classification>
        <further-classification edition="201501120251001B">A61K35/747</further-classification>
        <further-classification edition="200601120251001B">A61K31/197</further-classification>
        <further-classification edition="200601120251001B">A61K31/405</further-classification>
        <further-classification edition="200601120251001B">A61K31/4172</further-classification>
        <further-classification edition="200601120251001B">A61P25/16</further-classification>
        <further-classification edition="201601120251001B">A23L33/135</further-classification>
        <further-classification edition="201601120251001B">A23L33/175</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺北醫學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIPEI MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃惠宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HUI YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李保祿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種益生菌雞尾酒醫用食品配方，包含至少一種益生菌及可選擇性搭配一種或多種胺基酸，其可應用於帕金森氏症患者以提升左旋多巴（L-DOPA）在體內的穩定性與中樞神經可利用率。該配方能調節腸道菌群、強化腸道屏障功能、減輕系統性發炎與氧化壓力，進而改善運動與非運動功能障礙，並延緩或減少L-DOPA長期治療所致副作用如異動症之發生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a medical food composition comprising at least one probiotic and optionally one or more amino acids. The composition is useful in patients with Parkinson's disease to enhance the systemic stability and central bioavailability of levodopa (L-DOPA). It exerts effects by modulating gut microbiota, reinforcing intestinal barrier integrity, and reducing systemic inflammation and oxidative stress, thereby improving motor and non-motor symptoms and minimizing L-DOPA-induced long-term side effects such as dyskinesia.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1235" publication-number="202615075">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615075</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128265</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>益生菌雞尾酒醫用食品組合物及其延緩帕金森氏症進展的用途</chinese-title>
        <english-title>USING PROBIOTIC MIXTURE FORMULAS ATTENUATE NEURODEGENERATIVE DISEASES PROGRESSION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120251001B">A61K35/744</main-classification>
        <further-classification edition="201501120251001B">A61K35/745</further-classification>
        <further-classification edition="201501120251001B">A61K35/747</further-classification>
        <further-classification edition="201501120251001B">A61K35/74</further-classification>
        <further-classification edition="200601120251001B">A61K31/197</further-classification>
        <further-classification edition="200601120251001B">A61K31/405</further-classification>
        <further-classification edition="200601120251001B">A61K31/4172</further-classification>
        <further-classification edition="200601120251001B">A61P25/00</further-classification>
        <further-classification edition="200601120251001B">A61P3/00</further-classification>
        <further-classification edition="201601120251001B">A23L33/135</further-classification>
        <further-classification edition="201601120251001B">A23L33/175</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺北醫學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIPEI MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃惠宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HUI YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李保祿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種益生菌雞尾酒醫用食品組合物及其用於延緩帕金森氏症進展之用途，該組合物包含：(a) 至少一種具神經保護或代謝調節功能之益生菌；(b) 一種功能性胺基酸組合，所述功能性胺基酸組合包含四種或四種以上之必需胺基酸。所述組合物可製成醫用食品配方，適用於改善或緩解帕金森氏症相關之運動障礙、認知退化、發炎反應及粒線體功能失衡等病理變化，可用於帕金森氏症患者或高風險族群之日常營養補充與疾病進展延緩用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a probiotic cocktail medical food composition and its use in delaying the progression of Parkinson’s disease. The composition comprises: (a) at least one probiotic with neuroprotective or metabolic regulatory functions; (b) a functional amino acid combination comprising four or more essential amino acids. The composition can be formulated as a medical food product for improving or alleviating pathological conditions associated with Parkinson’s disease, including motor dysfunction, cognitive decline, inflammation, and mitochondrial impairment. It is suitable for daily nutritional supplementation and disease progression delay in patients with Parkinson’s disease or individuals at high risk.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1236" publication-number="202615413">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615413</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128266</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造聯芳基硫醚之方法</chinese-title>
        <english-title>PROCESSES FOR MANUFACTURING BIARYL THIOETHERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C319/06</main-classification>
        <further-classification edition="200601120260102B">C07C323/31</further-classification>
        <further-classification edition="200601120260102B">C07C323/32</further-classification>
        <further-classification edition="200601120260102B">C07D213/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧切蒂　尼可拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUCCHETTI, NICOLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬康尼　葛托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARCONI, GUIDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波斐特　羅伯多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PROFETA, ROBERTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷納　喬斯皮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RENNA, GIUSEPPE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅西　艾米利亞諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROSSI, EMILIANO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了製造式 &lt;b&gt;1a&lt;/b&gt; 化合物之方法，  &lt;br/&gt;&lt;img align="absmiddle" height="178px" width="223px" file="ed10060.JPG" alt="ed10060.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;其中 PG 為選自 Fmoc、Alloc、Boc、Cbz 及 C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;4&lt;/sub&gt;-胺甲酸酯之胺基保護基團；且 R&lt;sup&gt;2&lt;/sup&gt; 為選自 F、Cl 及 Br 之鹵素原子。根據本發明之方法特定而言適用於在 GMP 條件下之大規模製造。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides processes for manufacturing compounds of formula &lt;b&gt;1a&lt;/b&gt;, &lt;br/&gt;&lt;img align="absmiddle" height="185px" width="231px" file="ed10061.JPG" alt="ed10061.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;wherein PG is an amino protective group selected from Fmoc, Alloc, Boc, Cbz, and a C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;4&lt;/sub&gt;-carbamate; and R&lt;sup&gt;2&lt;/sup&gt; is a halogen atom selected from F, Cl, and Br. The process according to the invention is particularly suitable for large-scale manufacturing under GMP conditions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1237" publication-number="202616905">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616905</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128267</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光檢測裝置及電子機器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260102B">H10F39/18</main-classification>
        <further-classification edition="200601120260102B">H01L21/768</further-classification>
        <further-classification edition="200601120260102B">H01L23/488</further-classification>
        <further-classification edition="200601120260102B">H01L23/535</further-classification>
        <further-classification edition="202501120260102B">H10D64/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼半導體解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羽根田雅希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANEDA, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中一成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, KAZUNARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種可謀求兼顧性能提高與高集成化兩者之光檢測裝置及電子機器。  &lt;br/&gt;本揭示之一實施形態之光檢測裝置包含第1基板及第2基板。第1基板具有：第1光電轉換元件，其包含藉由將光進行光電轉換而產生第1電荷之第1光電轉換部；第1銲墊，其包含沿著第1平面之第1接合面；及第1通孔，其於與第1平面交叉之第1方向延伸設置。第2基板具有：第2銲墊，其包含與第1接合面接合之第2接合面；及第2通孔，其與該第2銲墊電性連接，自第2銲墊於第1方向延伸設置。第1光電轉換元件與第1銲墊經由第1通孔電性連接。在第1平面中第1銲墊占有之第1銲墊占有區域之整體與在第1平面中第1通孔占有之第1通孔占有區域在第1方向上重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:攝像裝置</p>
        <p type="p">11M1,11M2,11M3,21M1,21M2,21M3,22M1,22M2,31M1,31M2,31M3,31M4,31M5:配線層</p>
        <p type="p">11S1,12S1,13S1:第1面</p>
        <p type="p">11Z,21Z,22Z,31Z:層間絕緣膜</p>
        <p type="p">12S2,13S2:第2面</p>
        <p type="p">21V:通孔</p>
        <p type="p">101:第1基板</p>
        <p type="p">101S1,102S1,102S2,103S1:對向面</p>
        <p type="p">101S2:面</p>
        <p type="p">102:第2基板</p>
        <p type="p">103:第3基板</p>
        <p type="p">110:受光層</p>
        <p type="p">111,121,122,131:配線部</p>
        <p type="p">112a,112b:光電轉換元件</p>
        <p type="p">120,130:半導體層</p>
        <p type="p">AMP:放大電晶體</p>
        <p type="p">CF:彩色濾光器</p>
        <p type="p">FD1,FD2:浮動擴散部</p>
        <p type="p">Lv1~Lv2:位置</p>
        <p type="p">OCL:晶載透鏡</p>
        <p type="p">P1~P4:銲墊</p>
        <p type="p">PD1,PD2:光電二極體</p>
        <p type="p">SEL:選擇電晶體</p>
        <p type="p">TR1,TR2:傳送電晶體</p>
        <p type="p">TRG1,TRG2:信號</p>
        <p type="p">V1,V2,V4:通孔</p>
        <p type="p">X,Y:軸</p>
        <p type="p">Z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1238" publication-number="202616906">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616906</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128278</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光檢測裝置、電子機器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260102B">H10F39/18</main-classification>
        <further-classification edition="202501120260102B">H10F77/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼半導體解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関口浩司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKIGUCHI, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於抑制眩光或重影之產生。  &lt;br/&gt;本發明之光檢測裝置包含：光電轉換部；集光部，其將光集光至光電轉換部；像素，其具有集光部；及像素陣列部，其矩陣狀地配置有像素；且集光部為可設定不同長度之軸之形狀，相鄰之集光部之軸位於不同之方向。本技術可應用於檢測光之光檢測裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2-1-1,2-1-2,2-1-3,2-1-4,2-2-1,2-2-2,2-2-3,2-2-4,2-3-1,2-3-2,2-3-3,2-3-4,2-4-1,2-4-2,2-4-3,2-4-4:像素</p>
        <p type="p">52-1-1,52-1-2,52-1-3,52-1-4,52-2-1,52-2-2,52-2-3,52-2-4,52-3-1,52-3-2,52-3-3,52-3-4,52-4-1,52-4-2,52-4-3,52-4-4:晶載透鏡</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1239" publication-number="202615378">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615378</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128292</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有六氟丙烯之組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C17/42</main-classification>
        <further-classification edition="200601120260102B">C07C21/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大金工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江藤友亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ETO, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉山明平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIYAMA, AKINARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黒木克親</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUROKI, YOSHICHIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村新吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供新穎的含有六氟丙烯之組成物。  &lt;br/&gt;　　一種組成物，其包含六氟丙烯。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1240" publication-number="202615781">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615781</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128314</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>套筒、附軸承套筒以及旋轉機器</chinese-title>
        <english-title>SLEEVE, SLEEVE WITH BEARING AND ROTATING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">F16C33/58</main-classification>
        <further-classification edition="200601120251201B">F04D29/66</further-classification>
        <further-classification edition="200601120251201B">F16C33/64</further-classification>
        <further-classification edition="200601120251201B">F04D25/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商精工電子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEIKO INSTRUMENTS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯野朗弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IINO, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明渡悠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKEDO, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種套筒，係能夠抑制於旋轉機器之組裝時在滾動軸承之軌道輪形成壓痕，而抑制於旋轉機器之旋轉時產生噪音之情事。  &lt;br/&gt;　　[解決手法]套筒(140)，係於內側裝設有第1軸承(1A)之圓筒狀之套筒；該套筒係具備：外輪受部(143)，係自下方接觸第1軸承(1A)之外輪(20)之端面；以及突出部(144)，係形成於比外輪受部(143)更下方，且比外輪受部(143)更往徑方向之內側突出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:軸承</p>
        <p type="p">100:風扇馬達(旋轉機器)</p>
        <p type="p">101:推彈構件</p>
        <p type="p">114:周壁</p>
        <p type="p">115:葉片</p>
        <p type="p">130:驅動部</p>
        <p type="p">131:定子</p>
        <p type="p">132:轉子</p>
        <p type="p">103:C型環</p>
        <p type="p">111a:推拔面</p>
        <p type="p">120:基部</p>
        <p type="p">140:套筒</p>
        <p type="p">110:旋轉體</p>
        <p type="p">112:風扇</p>
        <p type="p">113:凸緣</p>
        <p type="p">1A:第1軸承(滾動軸承)</p>
        <p type="p">O:中心軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1241" publication-number="202616053">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616053</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128344</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>追蹤方法、多裝置系統及非暫態電腦可讀取儲存媒體</chinese-title>
        <english-title>TRACKING METHOD, MULTI-DEVICE SYSTEM AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250901B">G06F3/01</main-classification>
        <further-classification edition="201301120250901B">G06F3/0346</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃群凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUN-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳至謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供追蹤方法、多裝置系統及非暫態電腦可讀取儲存媒體。追蹤方法適用於在實體環境中的多裝置系統。多裝置系統包含主機裝置以及週邊裝置。追蹤方法包含：藉由主機裝置，基於主機裝置與週邊裝置之間的互動，產生週邊裝置的第一姿態資料；藉由週邊裝置，接收主機裝置所建立的實體環境的主機地圖；藉由週邊裝置，基於主機地圖，產生週邊裝置的第二姿態資料；以及藉由週邊裝置，傳輸第二姿態資料，以讓主機裝置停止產生第一姿態資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a tracking method, a multi-device system and a non-transitory computer readable storage medium. The tracking method is applicable to the multi-device system in a physical environment. The multi-device system includes a host device and a peripheral device. The tracking method includes: by the host device, generating a first pose data of the peripheral device based on an interaction between the host device and the peripheral device; by the peripheral device, receiving a host map of the physical environment established by the host device; by the peripheral device, generating a second pose data of the peripheral device based on the host map; and by the peripheral device, transferring the second pose data to stop the host device generating the first pose data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:追蹤方法</p>
        <p type="p">S201~S204:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1242" publication-number="202615844">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615844</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128355</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>量測各向異性結晶基板的光耗損的方法</chinese-title>
        <english-title>METHOD TO MEASURE LIGHT LOSS OF ANISOTROPIC CRYSTAL SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G01N21/59</main-classification>
        <further-classification edition="200601120260102B">G02B6/26</further-classification>
        <further-classification edition="200601120260102B">G02B1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱宇鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, YUPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅晉欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, JINXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例係關於光學元件計量的方法及裝置。該方法包括在第一時間段期間以初始角度將光束引入光學元件，該光學元件包含各向異性結晶光學基板，該光學元件包括第一表面和第二表面；經由光學元件傳播光束，該光束包括橫電極化光與橫磁極化光；在該第一時間段期間量測複數個量測值，該複數個量測值包括在該第一時間段期間從該第一表面或該第二表面上的複數個位置傳遞的該橫電極化光和該橫磁極化光的量，其中該量測是由偵測器執行的；以及使用在該第一時間段期間的量測值來確定光耗損。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure relate to a method of optical device metrology and a device. The method includes introducing a light beam into an optical device during a first time period at an initial angle, the optical device including an anisotropic crystal optical substrate, the optical device including a first surface and a second surface, propagating the light beam through the optical device, the light beam including a transverse electric polarization light and a transverse magnetic polarization light, measuring a plurality of measurements, during the first time period, the plurality of measurements including a quantity of the transverse electric polarization light and the transverse magnetic polarization light transmitted from a plurality of locations on the first surface or the second surface during the first time period, wherein the measuring is performed by a detector, and using the measurements during the first time period to determine optical loss.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:量測系統</p>
        <p type="p">102:光源</p>
        <p type="p">104:棱鏡</p>
        <p type="p">106:偵測器</p>
        <p type="p">112:基板</p>
        <p type="p">116:橫磁極化光</p>
        <p type="p">118:第一表面</p>
        <p type="p">120:第二表面</p>
        <p type="p">124:光束</p>
        <p type="p">126:散射光</p>
        <p type="p">d:厚度</p>
        <p type="p">p:傳播長度</p>
        <p type="p">X&lt;sub&gt;0&lt;/sub&gt;:點</p>
        <p type="p">X&lt;sub&gt;1&lt;/sub&gt;:點</p>
        <p type="p">X&lt;sub&gt;n&lt;/sub&gt;:點</p>
        <p type="p">θ&lt;sub&gt;TIR&lt;/sub&gt;:全內反射角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1243" publication-number="202615592">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615592</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128381</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組成物、漿料組成物、介電質層及多層陶瓷電容器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08L101/14</main-classification>
        <further-classification edition="200601120260102B">C08L33/08</further-classification>
        <further-classification edition="200601120260102B">C08K3/22</further-classification>
        <further-classification edition="200601120260102B">C08K5/47</further-classification>
        <further-classification edition="200601120260102B">C04B35/468</further-classification>
        <further-classification edition="200601120260102B">C04B35/632</further-classification>
        <further-classification edition="200601120260102B">H01G4/12</further-classification>
        <further-classification edition="200601120260102B">H01G4/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本瑞翁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZEON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木智一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, TOMOKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種組成物，其能夠對漿料組成物賦予優異之與脫模基材的可溼性及分散穩定性，且能夠對介電質層賦予優異之與導電膠的可溼性。本發明係一種組成物，其含有：水溶性聚合物、具有異噻唑酮結構的化合物與具有鈣鈦礦結構的介電質材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:多層陶瓷電容器</p>
        <p type="p">11:介電質</p>
        <p type="p">12:內部電極</p>
        <p type="p">13:外部電極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1244" publication-number="202615460">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615460</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128382</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗β２—微球蛋白抗體及其用途</chinese-title>
        <english-title>ANTI-β2-MICROGLOBULIN ANTIBODY AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07K16/18</main-classification>
        <further-classification edition="200601120260102B">C12N15/13</further-classification>
        <further-classification edition="201701120260102B">A61K47/68</further-classification>
        <further-classification edition="200601120260102B">A61K39/395</further-classification>
        <further-classification edition="200601120260102B">A61P25/00</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商愛黛兒公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADEL, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人峨山社會福祉財團</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE ASAN FOUNDATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔚山大學校產學協力團</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIVERSITY OF ULSAN FOUNDATION FOR INDUSTRY COOPERATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹丞鏞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, SEUNG-YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙美香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, MI HYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金糯英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, NA-YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金晙燮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JUN-SUB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金旻奭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MIN-SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓承奐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, SEUNG-HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開了一種特異性結合β2-微球蛋白(β2m)的抗體及其用途，其中所述抗體特異性結合從MHCI中解離的游離β2m蛋白。該抗體或其抗原結合片段與β2m的單體形式和澱粉樣物質形式兩者皆結合，並且能夠在癡呆動物模型和腎臟疾病動物模型的體液中檢測游離β2m的單體形式和澱粉樣物質形式，因而可用作用於該等疾病的診斷性抗體。此外，該抗體有效保護野生型小鼠免受由β2m誘導的認知損害，在癡呆小鼠模型中經腹腔內施用後減少腦中澱粉樣物質-β積累和發炎，在腎纖維化動物模型中減輕腎纖維化和降低生物標誌物水準，並且在肝纖維化動物模型中降低肝纖維化，因而可用於預防和/或治療該等疾病。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1245" publication-number="202615707">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615707</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128383</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣體供應裝置及基板處理設備</chinese-title>
        <english-title>GAS SUPPLY DEVICE AND SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C23C16/455</main-classification>
        <further-classification edition="200601120260102B">C23C16/50</further-classification>
        <further-classification edition="200601120260102B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商周星工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUSUNG ENGINEERING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裵晋模</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, JIN MO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金俊永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JUN YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>車相允</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHA, SANG YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裵鐘太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, JONG TAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張在勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, JAE HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜東准</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, DONG JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃喆周</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, CHUL-JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種氣體供應裝置包含包含分為一第一區域與一第二區域的一處理空間的一腔體；於多個氣體塊之中以n列排列形成於第一區域上的的一第一氣體塊；以及於多個氣體塊之中以m列排列形成於第二區域上的一第二氣體塊，其中，n列中的第一供應器的數量大於m列中的第二供應器數量(n＞m)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a gas supply device comprising a chamber including a processing space divided into a first area and a second area; a first gas block arranged in n rows formed above the first area among a plurality of gas blocks; and a second gas block arranged in m rows formed above the second area among a plurality of gas blocks, wherein the number of first suppliers in the ‘n’ row is greater than the number of second suppliers in the ‘m’ row (n＞m).</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:供應管線</p>
        <p type="p">51:第一儲存部</p>
        <p type="p">52:第二儲存部</p>
        <p type="p">531:第一填充槽</p>
        <p type="p">532:第一氣體管線</p>
        <p type="p">532a:第一槽通道</p>
        <p type="p">532b:第一噴射通道</p>
        <p type="p">533:第二填充槽</p>
        <p type="p">534:第二氣體管線</p>
        <p type="p">534a:第二槽通道</p>
        <p type="p">534b:第二噴射通道</p>
        <p type="p">535:連通管</p>
        <p type="p">536:連接器</p>
        <p type="p">537:第一入口管線</p>
        <p type="p">538:第二入口管線</p>
        <p type="p">541:第一壓力量測器</p>
        <p type="p">5421:第2-1壓力量測器</p>
        <p type="p">5422:第2-2壓力量測器</p>
        <p type="p">55:第一閥體</p>
        <p type="p">56:第二閥體</p>
        <p type="p">57:第一入口</p>
        <p type="p">58:第二入口</p>
        <p type="p">6:排出管線</p>
        <p type="p">61:第一排出管線</p>
        <p type="p">62:第二排出管線</p>
        <p type="p">D1,D2,D3,D4:直徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1246" publication-number="202615457">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615457</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128408</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用於對受體蛋白質之接觸的組成物</chinese-title>
        <english-title>COMPOSITION FOR CONTACTING A RECEPTOR PROTEIN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07K14/705</main-classification>
        <further-classification edition="200601120260102B">A61K38/16</further-classification>
        <further-classification edition="200601120260102B">G01N21/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仁木隆裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本真寿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, MASATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関口美知留</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKIGUCHI, MICHIRU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種更有效率地進行使受體蛋白質與配體及/或配體候補物質接觸之試驗之技術。  &lt;br/&gt;一種使用於對受體蛋白質之接觸的組成物，其係含有複數種配體及/或配體候補物質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a technique for more efficiently conducting a test of contacting a receptor protein with a ligand and/or a ligand candidate substance. &lt;br/&gt;A composition for contacting a receptor protein includes a plurality of ligands and/or ligand candidates.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1247" publication-number="202615062">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615062</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128529</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可觸發基因沉默的核糖核酸化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/7088</main-classification>
        <further-classification edition="201001120260102B">C12N15/113</further-classification>
        <further-classification edition="200601120260102B">A61K31/4192</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商維亞臻生物技術（蘇州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VISIRNA THERAPEUTICS (SUZHOU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸劍宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, JIANYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀輝君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, HUIJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, NA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒　曉明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZOU, XIAOMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃雅君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請案揭示了一類可觸發基因靜默的核糖核酸化合物，具體揭示了如式(I)所示結構的核糖核酸化合物、其綴合體及其應用。  &lt;br/&gt;&lt;img align="absmiddle" height="78px" width="121px" file="ed10258.JPG" alt="ed10258.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1248" publication-number="202616013">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616013</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128536</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>加工程式生成裝置及加工程式生成方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G05B19/4099</main-classification>
        <further-classification edition="200601120260102B">G05B19/418</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商西鐵城精機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CITIZEN MACHINERY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人東京農工大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL UNIVERSITY CORPORATION TOKYO UNIVERSITY OF AGRICULTURE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡部修一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATABE, SYUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋山直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKIYAMA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三宮一彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANNOMIYA, KAZUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中谷尊一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAYA, TAKAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中本圭一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMOTO, KEIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高波太一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKANAMI, TAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田栗悠斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAGURI, YUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關一種加工程式生成裝置，其係生成工具機之加工步驟及加工程式者，該工具機具備：主軸，其安裝有切削目標物；旋轉機構，其使主軸旋轉；切削目標物輸送機構，其使切削目標物相對於主軸在輸送方向移動；工具保持部，其係保持對切削目標物進行切削之切削工具；及移動機構，其使上述切削工具在與上述主軸之輸送方向交叉之方向移動；該加工程式生成裝置具備：加工區域獲取部，其獲取切削目標物之素材形狀與目標形狀相差之部分作為藉由切削工具進行加工之加工區域；加工區域分割部，其將加工區域分割成複數個要素；及決定順序部，其決定複數個要素之加工順序；且決定順序部針對複數個要素中在切削目標物被安裝於主軸之狀態下進行加工之要素，以輸送方向之前端位置遠離主軸者開始依序進行加工的方式，來決定加工順序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">MFa:第一加工特徵</p>
        <p type="p">MFb:第二加工特徵</p>
        <p type="p">MFc:第三加工特徵</p>
        <p type="p">MFd:第四加工特徵</p>
        <p type="p">MPa:第一加工基元</p>
        <p type="p">MPb:第二加工基元</p>
        <p type="p">MPc:第三加工基元</p>
        <p type="p">MPd:第四加工基元</p>
        <p type="p">TS:目標形狀</p>
        <p type="p">TSa:外徑部</p>
        <p type="p">TSb:外徑部</p>
        <p type="p">TSc:倒角</p>
        <p type="p">TSd:倒角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1249" publication-number="202616783">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616783</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128538</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>撓性多層電路基板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251128B">H05K1/02</main-classification>
        <further-classification edition="200601120251128B">H05K1/11</further-classification>
        <further-classification edition="200601120251128B">H05K3/10</further-classification>
        <further-classification edition="200601120251128B">H05K3/32</further-classification>
        <further-classification edition="200601120251128B">H05K3/46</further-classification>
        <further-classification edition="202301120251128B">H10K77/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>有馬敬雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARIMA, TAKAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永見直斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAMI, NAOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種撓性多層電路基板，其具備：&lt;br/&gt;  絕緣層；&lt;br/&gt;  第1導體層，其配置於前述絕緣層之厚度方向之一側；&lt;br/&gt;  第2導體層，其配置於前述絕緣層之厚度方向之另一側；及&lt;br/&gt;  導通部，其將前述第1導體層與前述第2導體層電性連接；且&lt;br/&gt;  前述絕緣層具有多孔質絕緣體區域及非多孔質絕緣體區域，&lt;br/&gt;  前述非多孔質絕緣體區域覆蓋前述導通部之側面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:絕緣層</p>
        <p type="p">2:第1導體層</p>
        <p type="p">3:第2導體層</p>
        <p type="p">4:導通部</p>
        <p type="p">11:多孔質絕緣體區域</p>
        <p type="p">12:非多孔質絕緣體區域</p>
        <p type="p">T:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1250" publication-number="202615522">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615522</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128542</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>嵌段共聚物</chinese-title>
        <english-title>BLOCK COPOLYMER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F293/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電木股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO BAKELITE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>櫻井春香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKURAI, HARUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>早川瞬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYAKAWA, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種聚合物，其能夠形成高耐熱性且膜應力小之樹脂膜，並且含有源於降莰烯或其衍生物之結構單元。  &lt;br/&gt;亦提供一種具有嵌段A和嵌段B之嵌段共聚物。在該嵌段共聚物中，由選自由以下通式（1-1）、（1-2）及（1-3）組成之群中的至少一個化學式表示之結構單元在嵌段A中的所有結構單元中的比率超過50mol%。又，在該嵌段共聚物中，由以下通式（2）表示之結構單元在嵌段B中的所有結構單元中的比率超過50mol%。  &lt;br/&gt;&lt;img align="absmiddle" height="407px" width="452px" file="ed10010.JPG" alt="ed10010.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1251" publication-number="202616705">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616705</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128546</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於多協定標籤交換的行動使用者平面之系統及其方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR MUP OVER MPLS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260102B">H04L45/02</main-classification>
        <further-classification edition="202201120260102B">H04L47/10</further-classification>
        <further-classification edition="202201120260102B">H04L47/20</further-classification>
        <further-classification edition="202201120260102B">H04L47/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商阿爾克斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARRCUS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派德　凱優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATEL, 　KEYUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村上　哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKAMI, 　TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派　納林納許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, 　NALINAKSH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　民傑德瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEUNG, MAN-KIT DEREK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鼎鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種多協定標籤交換（Multi-Protocol Label Switching, MPLS）上之行動使用者平面（Mobile User Plane, MUP）係透過一個存取網路實施，此存取網路連接供應商邊緣路由器至閘道路由器，所述閘道路由器連接至基地台，此基地台具有與使用者設備（User Equipment, UE）之無線連接。所述供應商邊緣路由器與閘道路由器之間的流量係根據MPLS協定及MUP協定進行路由。MUP控制器可發現UE、基地台及對應之隧道資訊，並將此資訊傳輸至供應商邊緣路由器及閘道路由器，接著，所述供應商邊緣路由器及閘道路由器建立MPLS標籤及路由項目以實施MUP。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Mobile User Plane (MUP) over Multi-Protocol Label Switching (MPLS) is implemented over an access network connecting a provider edge router to a gateway router, the gateway router being connected to a base station having a wireless connection to user equipment (UE). Traffic between the provider edge router and the gateway router is routed according to both of multi-protocol label switching (MPLS) protocol and mobile user plane (MUP) protocol. An MUP-controller may discover the UE, base station, and corresponding tunnel information and transmit this information to the provider edge router and gateway router, which then create an MPLS label and routing entries to implement MUP.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:網路環境</p>
        <p type="p">102:使用者設備</p>
        <p type="p">104:資料網路</p>
        <p type="p">106:存取網路</p>
        <p type="p">108:使用者平面功能</p>
        <p type="p">110:基地台</p>
        <p type="p">112:啟用MUP之閘道器</p>
        <p type="p">114:供應商邊緣路由器</p>
        <p type="p">116:會話管理功能</p>
        <p type="p">118:啟用MUP之控制節點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1252" publication-number="202615006">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615006</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128618</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＴＭＥＭ１７５的二唑調節劑用於治療神經退化性病症</chinese-title>
        <english-title>OXADIAZOLE MODULATORS OF TMEM175 FOR THE TREATMENT OF NEURODEGENERATIVE DISORDERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/4245</main-classification>
        <further-classification edition="200601120260102B">A61K31/4025</further-classification>
        <further-classification edition="200601120260102B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商建南德克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENENTECH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰利斯　約翰　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TELLIS, JOHN C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　文淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNG, MAN UN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布勞恩　德比恩　瑪麗　加布里埃爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRAUN DEBIEN, MARIE-GABRIELLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭德瑞　馬修　里歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANDRY, MATTHEW LEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派斯特　理查　馬汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PASTOR, RICHARD MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉维茨　班傑明　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAVETZ, BENJAMIN DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽普　杰倫　巴特　Ｉ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAP, JEROEN BART I.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請案提供式 (I) 化合物及式 (II) 化合物，   &lt;br/&gt;&lt;img align="absmiddle" height="254px" width="190px" file="ed10412.JPG" alt="ed10412.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;、&lt;img align="absmiddle" height="264px" width="192px" file="ed10413.JPG" alt="ed10413.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;及其醫藥上可接受之鹽，其為 TMEM175 的㗁二唑調節劑。本文還提供其醫藥組成物，以及使用該等醫藥組成物治療神經退化性病症之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides compounds of formula (I) and formula (II) &lt;br/&gt;&lt;img align="absmiddle" height="244px" width="179px" file="ed10414.JPG" alt="ed10414.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;,&lt;img align="absmiddle" height="259px" width="187px" file="ed10415.JPG" alt="ed10415.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;,&lt;br/&gt;and pharmaceutically acceptable salts thereof, that are oxadiazole modulators of TMEM175. Also provided herein are pharmaceutical compositions thereof, and methods of treating neurodegenerative disorders using the same.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1253" publication-number="202616450">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616450</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128630</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/677</main-classification>
        <further-classification edition="200601120260102B">B65G49/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西山耕二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIYAMA, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑原丈二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUWAHARA, JOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可提高基板處理裝置的產出量(throughput)之基板處理裝置及基板處理方法。  &lt;br/&gt;本發明係關於一種基板處理裝置及基板處理方法。基板處理裝置1具備有：第1前部5、第1後部6及橋接部4。第1前部5、橋接部4及第1後部6依此順序沿前後方向X排列。第1前部5具備有複數個處理單元50。第1前部5具備有搬送機構55。第1前部5的搬送機構55將基板W搬送至第1前部5的處理單元50。第1後部6具備有複數個處理單元60。第1後部6具備有搬送機構65。第1後部6的搬送機構65將基板W搬送至第1後部6的處理單元60。橋接部4具備有搬送機構25。橋接部4的搬送機構25將基板W載置於第1前部5。橋接部4的搬送機構25將基板W載置於第1後部6。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板處理裝置</p>
        <p type="p">2:移載傳送部</p>
        <p type="p">3:滑塊部</p>
        <p type="p">4:橋接部</p>
        <p type="p">5:第1前部</p>
        <p type="p">6:第1後部</p>
        <p type="p">7:第2前部</p>
        <p type="p">8:第2後部</p>
        <p type="p">11:載台</p>
        <p type="p">12:搬送機構(第1搬送機構)</p>
        <p type="p">21:載置部(第1中間載置部)</p>
        <p type="p">22:載置部(第2中間載置部)</p>
        <p type="p">23:搬送機構(第3搬送機構)</p>
        <p type="p">24:搬送機構(第1回收機構)</p>
        <p type="p">25:搬送機構(第1分配機構)</p>
        <p type="p">26:搬送機構(第2分配機構)</p>
        <p type="p">41:搬送機構(第2搬送機構)</p>
        <p type="p">50:處理單元(第1前部的處理單元)</p>
        <p type="p">51,61,71,81:第1處理單元</p>
        <p type="p">52,62,72,82:第2處理單元</p>
        <p type="p">53,63,73,83:第3處理單元</p>
        <p type="p">54:載置部(第1前載置部)</p>
        <p type="p">55:搬送機構(第1前搬送機構)</p>
        <p type="p">60:處理單元(第1後部的處理單元)</p>
        <p type="p">64:載置部(第1後載置部)</p>
        <p type="p">65:搬送機構(第1後搬送機構)</p>
        <p type="p">70:處理單元(第2前部的處理單元)</p>
        <p type="p">74:載置部(第2前載置部)</p>
        <p type="p">75:搬送機構(第2前搬送機構)</p>
        <p type="p">80:處理單元(第2後部的處理單元)</p>
        <p type="p">84:載置部(第2後載置部)</p>
        <p type="p">85:搬送機構(第2後搬送機構)</p>
        <p type="p">C:載具</p>
        <p type="p">P1:第1位置</p>
        <p type="p">P2:第2位置</p>
        <p type="p">PAHP:密接強化處理單元</p>
        <p type="p">PHP:加熱冷卻單元</p>
        <p type="p">T1-T4,T17-T20,T5a-T16a,T5b-T16b,T7c-T16c,T7d-T16d:搬送動作</p>
        <p type="p">X:前後方向(第1方向)</p>
        <p type="p">Y:寬度方向(第2方向)</p>
        <p type="p">Z:鉛直方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1254" publication-number="202615401">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615401</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128646</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>非化學增幅型阻劑組成物之製造方法、及圖案形成方法</chinese-title>
        <english-title>METHOD FOR MANUFACTURING NON-CHEMICALLY AMPLIFIED RESIST COMPOSITION AND PATTERNING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C69/63</main-classification>
        <further-classification edition="200601120260102B">C07D347/00</further-classification>
        <further-classification edition="200601120260102B">C08F212/14</further-classification>
        <further-classification edition="200601120260102B">C08F220/06</further-classification>
        <further-classification edition="200601120260102B">C08F220/22</further-classification>
        <further-classification edition="200601120260102B">C08L33/02</further-classification>
        <further-classification edition="200601120260102B">C08L25/18</further-classification>
        <further-classification edition="200601120260102B">C08K5/101</further-classification>
        <further-classification edition="200601120260102B">C08K5/1535</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>草間理志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSAMA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊地駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大山皓介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHYAMA, KOUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西川諒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKAWA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大橋正樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHASHI, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供已將品質管理成標準化之非化學增幅型阻劑組成物之製造方法、及圖案形成方法。  &lt;br/&gt;該課題之解決手段為一種非化學增幅型阻劑組成物之製造方法，其特徵為按順序包含：  &lt;br/&gt;步驟(i)，於容器中放入含羧基之聚合物、超原子價碘化合物、及溶劑並進行混合，製備阻劑組成物原始型態，  &lt;br/&gt;步驟(ii)，收集一部分該阻劑組成物原始型態，並使用該收集來的阻劑組成物原始型態於試驗用基板上形成阻劑膜，再評價該阻劑膜之膜物性，及  &lt;br/&gt;步驟(iii)，基於該步驟(ii)之評價結果，為了獲得作為目的之膜物性而在該阻劑組成物原始型態中進一步添加追加材料並進行混合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a method for manufacturing a non-chemically amplified resist composition, including, in the following order, the steps of: (i) placing a carboxy-group-containing polymer, a hypervalent iodine compound, and a solvent in a container and mixing together to prepare a fundamental resist composition; (ii) collecting part of the fundamental resist composition, forming a resist film on a test substrate by using the collected fundamental resist composition, and evaluating a film physical property of the resist film; and (iii) adding an additional material to the fundamental resist composition and mixing together to achieve a target film physical property based on an evaluation result of the step (ii). This can provide: a method for manufacturing a non-chemically amplified resist composition whose quality is controlled to be constant; and a patterning process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1255" publication-number="202615449">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615449</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128648</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蠶粉末之亞胺糖去除方法及含有低亞胺糖的蠶粉末之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07K1/14</main-classification>
        <further-classification edition="201501120260102B">A61K35/64</further-classification>
        <further-classification edition="200601120260102B">A61P3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商摩如斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORUS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青柳清治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOYAGI, SEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種蠶粉末中之亞胺糖含量之降低方法。解決該課題之方法之特徵在於包括如下步驟：用非極性有機溶劑對蠶處理物進行萃取，獲得萃取殘渣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1256" publication-number="202616455">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616455</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128702</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>量測堆疊晶粒中的特徵的設備及方法</chinese-title>
        <english-title>APPARATUS AND METHOD OF MEASURING FEATURES IN STACKED DIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/68</main-classification>
        <further-classification edition="200601120260102B">H01L21/67</further-classification>
        <further-classification edition="200601120260102B">H01L21/66</further-classification>
        <further-classification edition="200601120260102B">H01L23/538</further-classification>
        <further-classification edition="201701120260102B">G06T7/70</further-classification>
        <further-classification edition="201701120260102B">G06T7/60</further-classification>
        <further-classification edition="201801120260102B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪　海文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, RAYMOND HOIMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　耀龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHONG, YAU LOONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包含將包含第二特徵的第二晶粒接合至第一晶粒。第一晶粒包含第一特徵。使用以垂直於第一表面的第一角度安置的第一影像感測器來捕捉第一晶粒的至少一部分的第一影像。使用以第二角度安置的第二影像感測器來捕捉第二晶粒的至少一部分的第二影像。第一影像和第二影像包含第一特徵和第二特徵的至少一部分。基於第一影像和第二影像來確定特徵之間的至少一個偏移。基於該偏移來確定晶粒之間的對準校正。基於該對準校正，將一或多個對準命令發送至光學檢查系統的機器人端效器系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes bonding a second die including second feature to a first die. The first die includes a first feature. A first image of at least a portion of the first die is captured using a first image sensor disposed at a first angle that is normal to the first surface. A second image of at least a portion of the second die is captured using a second image sensor disposed at a second angle. The first and second images include at least a portion of the first feature and the second feature. At least one offset between the features are determined based on the first image and the second image. An alignment correction between the dies are determined based on the offset. One or more alignment commands are sent based on the alignment correction to a robot end effector system of an optical inspection system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學檢查系統</p>
        <p type="p">101:影像裝置</p>
        <p type="p">104:工作台</p>
        <p type="p">105:堆疊半導體組件</p>
        <p type="p">106:機器人端效器系統</p>
        <p type="p">108:基礎基板</p>
        <p type="p">109:第一晶粒</p>
        <p type="p">110:第二晶粒</p>
        <p type="p">111:基礎特徵</p>
        <p type="p">112:第一特徵</p>
        <p type="p">114:第二特徵</p>
        <p type="p">126:控制器</p>
        <p type="p">133:CPU</p>
        <p type="p">134:記憶體</p>
        <p type="p">135:支援電路</p>
        <p type="p">140a:第一影像感測器</p>
        <p type="p">140b:第二影像感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1257" publication-number="202615432">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615432</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128729</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>稠合三環KRAS抑制劑</chinese-title>
        <english-title>FUSED TRICYCLIC KRAS INHIBITORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07D471/04</main-classification>
        <further-classification edition="200601120260102B">A61K31/4375</further-classification>
        <further-classification edition="200601120260102B">A61K31/437</further-classification>
        <further-classification edition="200601120260102B">A61P29/00</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商英塞特公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INCYTE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱　文育</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, WENYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王曉釗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, XIAOZHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史巴斯巴特　亞頓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHVARTSBART, ARTEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QI, CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波利卡波　羅可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POLICARPO, ROCCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚　文清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, WENQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示式I化合物、使用該等化合物抑制KRAS活性之方法及包含此類化合物之醫藥組合物。該等化合物適用於治療、預防或改善與KRAS活性相關之疾病或病症，諸如癌症。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are compounds of Formula I, methods of using the compounds for inhibiting KRAS activity and pharmaceutical compositions comprising such compounds. The compounds are useful in treating, preventing or ameliorating diseases or disorders associated with KRAS activity such as cancer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1258" publication-number="202615660">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615660</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128746</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>編碼ＦＡＦ１蛋白之新穎聚核苷酸及ＦＡＦ１蛋白變異體</chinese-title>
        <english-title>NOVEL POLYNUCLEOTIDE ENCODING FAF1 PROTEIN AND FAF1 PROTEIN VARIANTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C12N15/12</main-classification>
        <further-classification edition="200601120260105B">A61K31/7088</further-classification>
        <further-classification edition="200601120260105B">C12N15/86</further-classification>
        <further-classification edition="200601120260105B">C12N15/63</further-classification>
        <further-classification edition="200601120260105B">C12N15/64</further-classification>
        <further-classification edition="200601120260105B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商康佳諾醫療科技發展有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAINOS MEDICINE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金銀姬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, EUNHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南守珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAM, SUJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴大浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, DAEHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>俞亨權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, HYEONG GWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓政勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, JEONG-HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一個態樣係關於編碼FAF1蛋白之新穎聚核苷酸、FAF1蛋白變異體及編碼其之聚核苷酸。該聚核苷酸與野生型FAF1聚核苷酸相比呈現改良之穩定性，且該FAF1蛋白變異體與野生型FAF1蛋白相比可呈現極佳的抗癌功效及誘導細胞凋亡之能力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An aspect of the present invention relates to a novel polynucleotide encoding an FAF1 protein, an FAF1 protein variant, and a polynucleotide encoding the same. The polynucleotide exhibits improved stability compared to a wild-type FAF1 polynucleotide, and the FAF1 protein variant can exhibit excellent anticancer efficacy and apoptosis inducing ability compared to the wild-type FAF1 protein.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1259" publication-number="202615578">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615578</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128750</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、高爾夫球及改質劑</chinese-title>
        <english-title>RESIN COMPOSITION, GOLF BALL, AND MODIFIER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08L33/10</main-classification>
        <further-classification edition="201801120260102B">C08K3/105</further-classification>
        <further-classification edition="202501120260102B">C08L23/08</further-classification>
        <further-classification edition="200601120260102B">C08K5/06</further-classification>
        <further-classification edition="200601120260102B">C08L29/04</further-classification>
        <further-classification edition="200601120260102B">C08L75/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井　陶氏聚合化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW-MITSUI POLYCHEMICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水貴廣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村圭司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, KEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大木和幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOGI, KAZUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小泉綠夢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOIZUMI, GURIMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之樹脂組成物含有乙烯/不飽和羧酸系共聚合體之羧基藉由金屬離子中和而成的離子聚合物樹脂(A)、聚乙烯丁醛樹脂(B)與醚型可塑劑(C)，且滿足下述要件(i)~(iii)。(i)相對於上述離子聚合物樹脂(A)與上述聚乙烯丁醛樹脂(B)之合計100質量份，上述離子聚合物樹脂(A)之含量為50質量份~99質量份；  &lt;br/&gt;(ii)相對於上述離子聚合物樹脂(A)與上述聚乙烯丁醛樹脂(B)之合計100質量份，上述聚乙烯丁醛樹脂(B)之含量為1質量份~50質量份；  &lt;br/&gt;(iii)相對於上述聚乙烯丁醛樹脂(B)100質量份，上述醚型可塑劑(C)之含量為25質量份~50質量份。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1260" publication-number="202615063">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615063</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128787</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於將治療劑送至心肌細胞之類升糖素肽－１（ＧＬＰ１）受體配體</chinese-title>
        <english-title>GLUCAGON-LIKE PEPTIDE-1 (GLP1) RECEPTOR LIGANDS FOR THE DELIVERY OF THERAPEUTIC AGENTS TO CARDIOMYOCYTES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/7088</main-classification>
        <further-classification edition="201001120260102B">C12N15/113</further-classification>
        <further-classification edition="200601120260102B">A61K31/498</further-classification>
        <further-classification edition="200601120260102B">A61K31/425</further-classification>
        <further-classification edition="200601120260102B">A61K31/4184</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商愛羅海德製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARROWHEAD PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納克勒爾里歐　喬治　三世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NACLERIO, GEORGE, III</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坎　克里斯多夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAIN, CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　曉愷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XIAOKAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裴　濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEI, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示根據式(&lt;b&gt;I&lt;/b&gt;)及(&lt;b&gt;II&lt;/b&gt;)之化合物，其包含GLP1R配體結合物，用於將基於寡核苷酸之劑(例如雙股RNAi劑)遞送至活體內某種細胞類型(例如心肌細胞)。本文揭示之化合物當結合至基於寡核苷酸之治療劑或診斷劑(諸如RNAi劑)時，可增強組合物遞送至靶向之特定細胞以促進抑制該等細胞中之基因表現。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are compounds according to Formula (&lt;b&gt;I&lt;/b&gt;) and (&lt;b&gt;II&lt;/b&gt;) comprising GLP1R ligand conjugates for the delivery of oligonucleotide-based agents, e.g., double stranded RNAi agents, to certain cell types, for example cardiomyocytes, &lt;i&gt;in vivo&lt;/i&gt;. The compounds disclosed herein, when conjugated to an oligonucleotide-based therapeutic or diagnostic agent, such as an RNAi agent, can enhance the delivery of the composition to the specified cells being targeted to facilitate the inhibition of gene expression in those cells.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1261" publication-number="202616610">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616610</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128792</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>以多層式人工智慧致能模型偵測及特徵化電力品質議題之系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD TO DETECT AND CHARACTERIZE POWER QUALITY ISSUES WITH MULTI-TIER AI-ENABLED MODELS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H02J13/00</main-classification>
        <further-classification edition="200601120260102B">G01R19/25</further-classification>
        <further-classification edition="200601120260102B">G01R31/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商斐斯鋒公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHASEFRONT INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納斯爾　阿札達尼　穆罕默德　邁赫德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NASR-AZADANI, MOHAMAD MEHDI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔什曼　薩德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TASHMAN, ZAID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴維斯　凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAVIES, KEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾曼　艾德溫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMA, EDWIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示包含編碼於一電腦儲存媒體上之電腦程式之方法、系統及設備，其經組態以藉由針對各電力品質議題(power quality issue；PQI)獨立地訓練人工智慧(artificial intelligence；AI)及機器學習(machine learning；ML)模型且循序地部署該等模型來偵測及特徵化電力品質議題。一多層式架構包含可靠地部署以在經縮減時間內監測電力品質議題之PQI代理程式。該多層式架構包含使該等模型根據新資料動態地更新以適應電網之不斷變化狀況的能力。一可擴展電力品質議題感知偵測系統產生資料驅動之異常評分以指引工程師及其他人對與一設施或設備相關聯之電力品質事件執行根本原因分析(root cause analysis；RCA)。該系統經設計用於與用於識別不同類別之電力品質議題之不同敏感度或臨限值之各種電力品質監測系統無縫整合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, are configured to detect and characterize power quality issues (PQIs) by independently training artificial intelligence (AI) and machine learning (ML) models on each power quality issue and sequentially deploying them is disclosed. A multi-tier architecture includes PQI agents that are deployed reliably to monitor the power quality issues in reduced time. The multi-tier architecture includes the capability for the models to dynamically update on new data to adjust to the constantly changing conditions of the power grid. An extensible power-quality-issue-aware detection system generates data-driven anomaly scores to guide engineers and others in performing root case analysis (RCA) on power quality events associated with a facility or equipment. The system is designed for seamless integration with various power quality monitoring systems of different sensitivity or thresholds used to identify different classes of power quality issues.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:分佈式環境</p>
        <p type="p">102:通訊網路</p>
        <p type="p">104a:使用者裝置</p>
        <p type="p">104b:使用者裝置</p>
        <p type="p">104n:使用者裝置</p>
        <p type="p">106a:信號</p>
        <p type="p">106b:信號</p>
        <p type="p">106n:信號</p>
        <p type="p">108a:工程師</p>
        <p type="p">108b:操作者</p>
        <p type="p">108n:設備專家</p>
        <p type="p">110a:信號</p>
        <p type="p">110b:信號</p>
        <p type="p">110n:信號</p>
        <p type="p">112:智慧人工智慧(AI)致能系統</p>
        <p type="p">114:人工智慧(AI)致能智慧系統</p>
        <p type="p">116:信號線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1262" publication-number="202616082">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616082</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128833</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>異質計算系統、異質計算方法及儲存系統</chinese-title>
        <english-title>HETEROGENEOUS COMPUTING SYSTEM, HETEROGENEOUS COMPUTING METHOD AND STORAGE SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260102B">G06F12/08</main-classification>
        <further-classification edition="200601120260102B">G06F3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　漢秋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HANQIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種異質計算系統、異質計算方法及儲存系統。所述異質計算系統可包括可含有處理元件的多個節點，所述處理元件包括本地記憶體。所述多個節點可具有可能不同的能力。所述異質計算系統亦可包括可由處理元件存取的記憶體池。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heterogeneous computing system, heterogeneous computing method and storage system are provided. The heterogeneous computing system may include nodes, which may include processing elements, the processing elements including local memories. The nodes may have capabilities that may differ. The heterogeneous computing system may also include a memory pool, accessible to the processing elements.</p>
      </isu-abst>
      <representative-img>
        <p type="p">105-1、105-2、105-3:節點</p>
        <p type="p">110-1、110-2、110-3:處理器</p>
        <p type="p">115-1、115-2、115-3:記憶體</p>
        <p type="p">120-1、120-2、120-3:儲存裝置</p>
        <p type="p">135-1、135-2、135-3:處理元件/GPU</p>
        <p type="p">140-1、140-2、140-3:本地記憶體</p>
        <p type="p">305:異質計算系統</p>
        <p type="p">310-1、310-2、310-3、315-1、315-2、315-3:部分</p>
        <p type="p">320-1、320-2、320-3、325-1、325-2、325-3:子部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1263" publication-number="202615079">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615079</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128851</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>血壓上升抑制用組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K36/02</main-classification>
        <further-classification edition="201601120260102B">A23K10/16</further-classification>
        <further-classification edition="200601120260102B">A23L2/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＤＩＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今井康行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAI, YASUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋拓矢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小關友莉乃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSEKI, YURINO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古我匠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOGA, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種含有藻藍素之蛋白酶分解物作為有效成分的血壓上升抑制用組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1264" publication-number="202616840">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616840</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128863</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙極性電晶體及雙極性電晶體之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260102B">H10D10/01</main-classification>
        <further-classification edition="202501120260102B">H10D10/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商村田製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURATA MANUFACTURING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村光宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, MITSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川端久敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWABATA, HISATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供比以往使離子注入深度更淺，且減少劑量，使基極集極間之寄生電容降低之雙極性電晶體。  &lt;br/&gt;在基板之上表面的一部分區域，配置有包含集極層、及配置在集極層之上之基極層之基極台面。在基極台面之上表面的一部分區域配置有射極台面。在基極層之上表面中於俯視時位於射極台面之外側之區域，與射極台面隔著間隔而配置有基極電極。在基極層中於俯視時從射極台面觀察之情形下，至少位於比基極電極更遠的區域，設成含有將基極層高電阻化之雜質之高電阻化區域，高電阻化區域以外之活性區域電氣連接於基極電極。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">11:子集極層</p>
        <p type="p">20:HBT(異質接合雙極性電晶體)</p>
        <p type="p">20AC:活性區域</p>
        <p type="p">20B:基極層</p>
        <p type="p">20BM:基極台面</p>
        <p type="p">20C:集極層</p>
        <p type="p">20E:射極層</p>
        <p type="p">20E1:射極蓋層</p>
        <p type="p">20E2:射極接觸層</p>
        <p type="p">20EM:射極台面</p>
        <p type="p">20HR:高電阻化區域</p>
        <p type="p">22B:基極電極</p>
        <p type="p">22C:集極電極</p>
        <p type="p">22E:射極電極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1265" publication-number="202614929">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614929</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128883</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>啤酒風味發酵飲料及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A23L2/56</main-classification>
        <further-classification edition="200601120260102B">A23L2/52</further-classification>
        <further-classification edition="200601120260102B">A23L2/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商麒麟控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIRIN HOLDINGS KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋沙織</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, SAORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安藝萌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKI, MEBAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土屋友理</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUCHIYA, YURI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種新穎之啤酒風味發酵飲料，其嘌呤體濃度降低，並且因嘌呤體濃度降低所致之香味之惡化得到改善。根據本發明，提供一種啤酒風味發酵飲料，其嘌呤體濃度為35,000 ppb以下，或腺苷濃度為15,000 ppb以下，或鳥苷濃度為56,000 ppb以下，且2-乙醯基吡咯濃度為20 ppb以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1266" publication-number="202615609">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615609</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128894</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於拋光基板之組合物</chinese-title>
        <english-title>COMPOSITIONS FOR POLISHING SUBSTRATES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C09G1/02</main-classification>
        <further-classification edition="200601120260105B">C09K3/14</further-classification>
        <further-classification edition="200601120260105B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維爾瑪　阿迪亞　迪利普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERMA, ADITYA DILIP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛吉　雷傑　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, RAJIV K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛吉　潘卡吉　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, PANKAJ K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪　桑妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE, SUNNY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於拋光基板之組合物。一組合物包括一水溶性聚合物、一第一複數個粒子、一第二複數個粒子或其任意組合之至少一者。當該組合物與一多晶基板接觸時，且當該多晶基板由該組合物拋光時，該組合物包括一足量之該水溶性聚合物、該第一複數個粒子及該第二複數個粒子，以導致至少0.5 μm之一材料移除速率；及/或50埃或更小之一平均表面粗糙度S&lt;sub&gt;a&lt;/sub&gt;。該平均表面粗糙度係藉由原子力顯微鏡(AFM)在一10 μm x 10 μm區域上量測。本發明亦提供相關方法等。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Compositions for polishing substrates are provided. A composition comprises at least one of a water soluble polymer, a first plurality of particles, a second plurality of particles, or any combination thereof. When the composition is contacted with a polycrystalline substrate and when the polycrystalline substrate is polished by the composition, the composition comprises a sufficient amount of the water soluble polymer, the first plurality of particles, and the second plurality of particles to result in a material removal rate of at least 0.5 µm; and/or an average surface roughness, S&lt;sub&gt;a&lt;/sub&gt;, of 50 Angstroms or less. The average surface roughness is measured by Atomic Force Microscopy (AFM) over a 10 µm x 10 µm area. Related methods, among other things, are also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:步驟</p>
        <p type="p">104:步驟</p>
        <p type="p">106:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1267" publication-number="202615708">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615708</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128905</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於基體處理設備之流體擴散器及方法</chinese-title>
        <english-title>FLUID DIFFUSER FOR A SUBSTRATE PROCESSING APPARATUS AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">C23C16/455</main-classification>
        <further-classification edition="202201120260114B">B01F25/432</further-classification>
        <further-classification edition="202201120260114B">B01F25/421</further-classification>
        <further-classification edition="200601120260114B">F15D1/14</further-classification>
        <further-classification edition="200601120260114B">H01L21/205</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商皮寇桑公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PICOSUN OY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏爾馬　瓦倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHARMA, VARUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆罕默德　薩夫達爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUHAMMAD, SAFDAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基維奧哈　賈尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIVIOJA, JANI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布隆伯格　湯姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLOMBERG, TOM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於基體處理之流體擴散器(100)及方法，其包含包圍該流體擴散器(100)之一中央注射口(150)的一壁總成(200)，其中該注射口(150)組配來形成從該流體擴散器(100)朝向該基體處理設備(300)之一反應容積(315)的一流體連通路徑，其中該壁總成(200)組配來形成由數條流動路徑組成的一迷宮，它從該壁總成(200)外面穿過該壁總成(200)到該注射口(150)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fluid diffuser(100) and a method for a substrate processing, comprising a wall assembly (200) surrounding a central injection port (150) of the fluid diffuser (100) wherein the injection port (150) is configured to form a fluid communication path from the fluid diffuser (100) towards a reaction volume (315) of the substrate processing apparatus (300), wherein the wall assembly (200) is configured to form a maze of flow paths through the wall assembly (200) from outside of the wall assembly (200) to the injection port (150).</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:流體擴散器</p>
        <p type="p">110:分隔板</p>
        <p type="p">120:壁</p>
        <p type="p">130:貫穿孔</p>
        <p type="p">140:流動通道</p>
        <p type="p">150:中央注射口</p>
        <p type="p">160:入口管路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1268" publication-number="202614997">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614997</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128921</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製造塞拉德帕之程序</chinese-title>
        <english-title>PROCESS FOR MAKING SELADELPAR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/19</main-classification>
        <further-classification edition="200601120260102B">A61K31/10</further-classification>
        <further-classification edition="200601120260102B">A61K31/075</further-classification>
        <further-classification edition="200601120260102B">A61P3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商賽馬拜製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CYMABAY THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古拉勒　巴拉特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GURALE, BHARAT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊奧內斯庫　杜米特魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IONESCU, DUMITRU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱瑟　艾瑞克　傑森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISER, ERIC JASON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史特夫克　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEFFKE,STEPHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔英　希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAING, HI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦杜拉　布奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VADDULA, BUCHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, FEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露大致上係關於用於製備塞拉德帕（一種過氧化體增殖活化受體(PPAR)-δ之促效劑）及其組成物之程序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates generally to processes for preparing seladelpar, an agonist of peroxisome proliferator-activated receptor (PPAR)-delta, and compositions thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1269" publication-number="202615036">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615036</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128938</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>三環類化合物及其用途</chinese-title>
        <english-title>TRICYCLIC COMPOUNDS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/519</main-classification>
        <further-classification edition="200601120260102B">A61K31/553</further-classification>
        <further-classification edition="200601120260102B">A61K31/4353</further-classification>
        <further-classification edition="200601120260102B">A61K31/416</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商和記黃埔醫藥（上海）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUTCHMED LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張維漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, WEIHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肖坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張崢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, ZHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳垚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及式(I)的三環類化合物、包含它們的醫藥組成物以及它們的製備方法和用途，其中各變量如說明書中所定義。</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="207px" width="247px" file="d10001.TIF" alt="化學式ed10001.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10001.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to tricyclic compounds of formula (I), pharmaceutical compositions comprising same, preparation methods therefor and uses thereof, wherein each variable is as defined in the description.</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="218px" width="213px" file="d10002.TIF" alt="化學式ed10002.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10002.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1270" publication-number="202616401">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616401</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128939</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有多光罩晶粒及光罩橋接導體之半導體裝置總成</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE ASSEMBLIES WITH MULTI-RETICLE DIES AND RETICLE-BRIDGING CONDUCTORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/60</main-classification>
        <further-classification edition="200601120260102B">H01L23/528</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美光科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICRON TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布珊　巴拉特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHUSHAN, BHARAT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派瑞克　庫諾　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAREKH, KUNAL R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛　阿克斯海　Ｎ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, AKSHAY N.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾卡爾　亞明　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKEL, AMEEN D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀佩君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置總成包含：一多光罩半導體裝置，其包含一連續半導體基板，該連續半導體基板具有藉由沒有任何電導體之一光罩邊緣區彼此分離之複數個電路區；一裝置連接層，其形成於該多光罩半導體裝置上方且包含將該多光罩半導體裝置中之該複數個電路區彼此電耦合之複數個光罩橋接導體；及複數個半導體裝置，其等安置於該裝置連接層上方且藉由延伸穿過該裝置連接層之垂直導體電耦合至該多光罩半導體裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device assembly includes a multi-reticle semiconductor device including a continuous semiconductor substrate having a plurality of circuit regions separated from one another by a reticle-edge region absent any electrical conductors, a device connection layer formed over the multi-reticle semiconductor device and including a plurality of reticle-bridging conductors electrically coupling the plurality of circuit regions in the multi-reticle semiconductor device to one another, and a plurality of semiconductor devices disposed over the device connection layer and electrically coupled to the multi-reticle semiconductor device by vertical conductors extending through the device connection layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:晶圓</p>
        <p type="p">104:晶圓</p>
        <p type="p">105:晶圓</p>
        <p type="p">106:晶圓</p>
        <p type="p">108:裝置連接層</p>
        <p type="p">112:多光罩半導體裝置晶圓</p>
        <p type="p">113:離散光罩限制電路區/重佈層(RDL)/離散光罩限制電路區域</p>
        <p type="p">114:離散光罩限制電路區/外部接觸件/離散光罩限制電路區域</p>
        <p type="p">115:TSV/焊球</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1271" publication-number="202616518">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616518</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128955</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具備多光罩晶粒及光罩橋接導體之邏輯頂層半導體裝置總成</chinese-title>
        <english-title>LOGIC-UPPERMOST SEMICONDUCTOR DEVICE ASSEMBLIES WITH MULTI-RETICLE DIES AND RETICLE-BRIDGING CONDUCTORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L23/538</main-classification>
        <further-classification edition="200601120260102B">H01L23/535</further-classification>
        <further-classification edition="200601120260102B">H01L23/488</further-classification>
        <further-classification edition="200601120260102B">H01L21/768</further-classification>
        <further-classification edition="202501120260102B">H10D88/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美光科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICRON TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布珊　巴拉特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHUSHAN, BHARAT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派瑞克　庫諾　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAREKH, KUNAL R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛　阿克斯海　Ｎ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, AKSHAY N.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾卡爾　亞明　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKEL, AMEEN D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀佩君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置總成包含：複數個半導體裝置堆疊，其等各包含藉由TSV可操作地耦合至穿過一RDL之外部封裝接觸件之多個裝置；及一裝置連接層，其形成於該複數個堆疊上方且包含耦合至該等TSV之第一複數個接觸件、背離該等TSV之第二複數個接觸件、將該第一複數個接觸件之接觸件可操作地耦合至該第二複數個接觸件之對應接觸件之第一複數個導體及將該第二複數個接觸件之接觸件可操作地耦合至該第二複數個接觸件之其他接觸件之第二複數個導體。該總成進一步包含一多光罩半導體裝置，該多光罩半導體裝置安置於該裝置連接層上方且包含一連續半導體基板，該連續半導體基板具有藉由沒有任何電導體之一光罩邊緣區分離之複數個電路區。該裝置連接層中之該第二複數個導體使該複數個電路區可操作地互連。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device assembly includes a plurality of stacks of semiconductor devices, each including multiple devices operably coupled by TSVs to external package contacts through an RDL, and a device connection layer formed over the plurality of stacks and including a first plurality of contacts coupled to the TSVs, a second plurality of contacts facing away from the TSVs, a first plurality of conductors operably coupling contacts of the first plurality to corresponding contacts of the second plurality, and a second plurality of conductors operably coupling contacts of the second plurality to other contacts of the second plurality. The assembly further includes a multi-reticle semiconductor device disposed over the device connection layer and including a continuous semiconductor substrate having a plurality of circuit regions separated by a reticle-edge region absent any electrical conductors. The second plurality of conductors in the device connection layer operably interconnect the plurality of circuit regions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:晶圓</p>
        <p type="p">104:晶圓</p>
        <p type="p">105:晶圓</p>
        <p type="p">106:晶圓</p>
        <p type="p">108:重佈層(RDL)/裝置連接層</p>
        <p type="p">111:裝置連接層</p>
        <p type="p">115:晶圓</p>
        <p type="p">116:離散光罩限制電路區/離散光罩限制電路區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1272" publication-number="202615021">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615021</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128986</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有三羥基苯的化合物、包含含有三羥基苯的化合物的組成物、及相關用途</chinese-title>
        <english-title>TRIHYDROXYBENZENE-CONTAINING COMPOUNDS, COMPOSITIONS COMPRISING TRIHYDROXYBENZENE-CONTAINING COMPOUNDS AND RELATED USES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/4965</main-classification>
        <further-classification edition="200601120260102B">A61K31/7088</further-classification>
        <further-classification edition="200601120260102B">A61K31/35</further-classification>
        <further-classification edition="200601120260102B">A61K48/00</further-classification>
        <further-classification edition="200601120260102B">A61P3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商波西達治療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POSEIDA THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃麗君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, LIJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維穆里　戈皮　納特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VEMURI, GOPI NATH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示了一種含有三羥基苯的化合物、包含該等含有三羥基苯的化合物的組成物、製備此類化合物及組成物之方法、以及這些組成物在基因遞送應用中之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Trihydroxybenzene containing compounds, compositions comprising the trihydroxybenzene containing compounds, methods of preparing such compounds and compositions, and the use of these compositions in gene delivery applications are disclosed.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1273" publication-number="202616431">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616431</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128988</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製程設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/67</main-classification>
        <further-classification edition="200601120260102B">H01J37/32</further-classification>
        <further-classification edition="200601120260102B">H05H1/46</further-classification>
        <further-classification edition="200601120260102B">C23C16/455</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商ＨＱ　絕緣體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HQ-DIELECTRICS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勒奇　威爾弗里德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LERCH, WILFRIED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼斯　尤爾根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIESS, JURGEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種用於處理基板、特別是半導體基板的製程設備，製程設備包括：形成製程室的用於容置基板的製程室殼體；在製程室中用於容置待處理基板的基板容置部；及穿過製程室及製程室殼體延伸的管元件，其中管元件被配置成用於加熱燈或電漿棒，且其中管元件的末端對周圍環境敞開且/或連接氣體源以供氣體通過。製程設備還具有：分隔元件，其佈置在管元件與基板容置部之間，從而將製程室分隔成至少一管元件容置空間及一基板容置空間，其中管元件容置空間不對周圍環境敞開；以及用於設定及/或監控管元件容置空間中的氣氛的構件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:製程設備</p>
        <p type="p">2:殼體/製程室殼體</p>
        <p type="p">3:製程室</p>
        <p type="p">4:基板容置部</p>
        <p type="p">6:氣體管理系統</p>
        <p type="p">8:能量輸入單元</p>
        <p type="p">10:通道</p>
        <p type="p">11:通道</p>
        <p type="p">12:通道</p>
        <p type="p">14:基板保持件</p>
        <p type="p">15:軸體</p>
        <p type="p">18:供氣單元</p>
        <p type="p">20:管線</p>
        <p type="p">22:能量輸入元件</p>
        <p type="p">24:容置部</p>
        <p type="p">26:供應管線</p>
        <p type="p">30:管元件/第一管元件</p>
        <p type="p">32:管元件/第二管元件</p>
        <p type="p">36:容置空間/管元件容置空間</p>
        <p type="p">38:容置空間/基板容置空間</p>
        <p type="p">44:次級氣體管理系統</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1274" publication-number="202615046">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615046</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128996</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自噬功能活化化合物</chinese-title>
        <english-title>AUTOPHAGY FUNCTION ACTIVATING COMPOUNDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/535</main-classification>
        <further-classification edition="200601120260102B">A61K31/403</further-classification>
        <further-classification edition="200601120260102B">A61P3/00</further-classification>
        <further-classification edition="200601120260102B">A61P9/00</further-classification>
        <further-classification edition="200601120260102B">A61P25/00</further-classification>
        <further-classification edition="200601120260102B">A61P37/00</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
        <further-classification edition="200601120260102B">A61P27/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商莫萊斯柯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORESCO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商自噬作用出行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUTOPHAGYGO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人大阪大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE UNIVERSITYL OF OSAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前田達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEDA, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中野陽一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANO, YOICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今井一徳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAI, KAZUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林正輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大久保充</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHKUBO, MITSURU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>建部恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TATEBE, HISASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庄司志咲子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHOJI, SHISAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福田加奈子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUDA, KANAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石堂美和子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIDO, MIWAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>濱﨑万穂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMASAKI, MAHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉森保</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIMORI, TAMOTSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永田龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGATA, RYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請之發明的實施型態之一乃揭示一種下述式(I)所示之化合物或其醫藥上可容許之鹽，該化合物係具有自噬功能的活化作用，並且可用作為疾病的預防或治療劑，該疾病係因自噬功能的降低所引起的疾病、或是因自噬功能的亢進而抑制或改善病態之疾病：  &lt;br/&gt; &lt;img align="absmiddle" height="183px" width="468px" file="ed10090.JPG" alt="ed10090.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式中，各記號係如說明書中所記載般)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application discloses, as one embodiment of the invention, a compound represented by the following formula (I): &lt;br/&gt;&lt;img align="absmiddle" height="186px" width="479px" file="ed10091.JPG" alt="ed10091.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(wherein each symbol is as defined in the specification) &lt;br/&gt;or a pharmaceutically acceptable salt thereof, which has effects of activating autophagy function and is useful as a prophylatic or therapeutic agent for diseases caused by decreased autophagy or diseases whose pathology can be suppressed or ameliorated by increased autophagy.</p>
      </isu-abst>
      <representative-img>
        <p type="p">本案無圖式。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1275" publication-number="202615350">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615350</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129096</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>沸石、沸石之製造方法、樹脂組合物、半導體密封材料、半導體密封材料之製造方法及電子裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C01B33/26</main-classification>
        <further-classification edition="200601120260102B">C01B39/48</further-classification>
        <further-classification edition="200601120260102B">C08K3/34</further-classification>
        <further-classification edition="200601120260102B">C08L101/00</further-classification>
        <further-classification edition="200601120260102B">H01L23/29</further-classification>
        <further-classification edition="200601120260102B">H01L23/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中裕太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, YUTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大西良治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHNISHI, RYOHJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>引間脩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIKIMA, SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片桐紀子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAGIRI, NORIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田裕人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, HIROTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武脇隆彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEWAKI, TAKAHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種沸石，其於藉由熱重量分析(TGA)，在空氣氣體氛圍中以升溫速度10℃/分鐘升溫至800℃並於800℃下保持10分鐘時，以400℃下之重量為基準，800℃下之重量減少率為1%以上，且鈾及釷之含量合計為200質量ppb以下。  &lt;br/&gt;本發明可提供一種低吸濕且阿爾法射線量較低之適宜用作半導體密封材料之沸石。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1276" publication-number="202614931">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614931</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129130</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>海藻加工品的製造方法</chinese-title>
        <english-title>METHOD FOR PRODUCING PROCESSED SEAWEED PRODUCTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260102B">A23L17/00</main-classification>
        <further-classification edition="201601120260102B">A23L17/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商理研食品股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIKEN FOOD CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香取尚久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATORI, NAOHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白瀨達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRASE, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種口感輕盈且優異、不易殘留於口中的海藻加工品的製造方法。本發明的解決手段為一種海藻加工品的製造方法，其包括下述步驟A及步驟B，  &lt;br/&gt;步驟A：將海藻與糖質加熱混合而得到混合物{例如含有水分的混合物[例如水分含量為規定量(例如25.0~95.0質量%)的混合物]}，其中，作為混合時的海藻與糖質的比例，相對於100.0質量份的海藻的固體成分，糖質的固體成分為13.0~190.0質量份；  &lt;br/&gt;步驟B：以固體成分計，以相對於100.0質量份的海藻的固體成分為3.0質量份以上的比例向步驟A得到的混合物中添加糖質及/或食物纖維，並在品溫為65℃以下的條件下進行混合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide a method for producing a processed seaweed product with a light, excellent texture that does not easily linger in the mouth. The solution of the present invention is a method for producing a processed seaweed product, which includes the following steps A and B. &lt;br/&gt;Step A: Seaweed and carbohydrates are heated and mixed to obtain a mixture [for example, a moisture-containing mixture (for example, a mixture with a moisture content of a predetermined amount (for example, 25.0 to 95.0% by mass))]. The ratio of seaweed to carbohydrates during mixing is 13.0 to 190.0 parts by mass of carbohydrate solid content relative to 100.0 parts by mass of seaweed solid content. &lt;br/&gt;Step B: Carbohydrates and/or dietary fiber are added to the mixture obtained in step A at a ratio of 3.0 parts by mass or more of solid content relative to 100.0 parts by mass of seaweed solid content, and mixed under the condition that the product temperature is 65°C or less.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1277" publication-number="202614991">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614991</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129142</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化妝料組合物或頭飾製品用纖維處理組合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K8/89</main-classification>
        <further-classification edition="200601120260102B">A61Q5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商花王股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中岡志保</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAOKA, SHIHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邊雅彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, MASAHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹治範文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANJI, NORIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種化妝料組合物或頭飾製品用纖維處理組合物，其係無論對象物上之皮脂等油性成分之存在量為多少，均能夠均勻地附著於該對象物，具有優異之洗淨耐久性，且能形成外觀及觸感良好之皮膜。  &lt;br/&gt;即，本發明提供一種化妝料組合物或頭飾製品用纖維處理組合物，其含有下述成分(A)～(D)，水之含量為0.9質量%以下，且乙醇之含量為15質量%以下。  &lt;br/&gt;(A)皮膜形成性聚合物，其包含(R&lt;sup&gt;1&lt;/sup&gt;)&lt;sub&gt;3&lt;/sub&gt;SiO&lt;sub&gt;1/2&lt;/sub&gt;(R&lt;sup&gt;1&lt;/sup&gt;表示可經氟取代之碳數1以上12以下之烴基或羥基，複數個R&lt;sup&gt;1&lt;/sup&gt;可彼此相同，亦可不同)所表示之M單元及SiO&lt;sub&gt;4/2&lt;/sub&gt;所表示之Q單元  &lt;br/&gt;(B)除上述成分(A)以外之有機聚矽氧烷，其具有聚環氧烷部位及陽離子性基，且動黏度為30萬mm&lt;sup&gt;2&lt;/sup&gt;/s以下  &lt;br/&gt;(C)除上述成分(A)及(B)以外之聚矽氧系聚合物  &lt;br/&gt;(D)一種以上之不揮發性之油性成分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1278" publication-number="202616356">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616356</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129143</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具不同鍺濃度之含矽及鍺材料間的選擇性蝕刻</chinese-title>
        <english-title>SELECTIVE ETCHING BETWEEN SILICON-AND-GERMANIUM-CONTAINING MATERIALS WITH VARYING GERMANIUM CONCENTRATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/02</main-classification>
        <further-classification edition="200601120260102B">H01L21/3065</further-classification>
        <further-classification edition="200601120260102B">H01L21/311</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李子匯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZIHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高　嘉玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, CHIA-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　安川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ANCHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">示範性半導體處理方法可包含提供預處理前驅物至半導體處理腔室的處理區域。基板內可能裝設第一層含矽及鍺材料，並且第二層含矽及鍺材料可能裝設於處理區域內。原生氧化物可能存在。這些方法可包含將基板與預處理前驅物接觸以移除原生氧化物。這些方法可包含將基板與含氧前驅物接觸，以氧化第一層含矽及鍺材料的至少一部分和第二層含矽及鍺材料的至少一部分。這些方法可包含將基板與蝕刻前驅物接觸，以選擇性地蝕刻第一層含矽及鍺材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Exemplary semiconductor processing methods may include providing a pre-treatment precursor to a processing region of a semiconductor processing chamber. A substrate may be housed having a first layer of silicon-and-germanium-containing material and a second layer of silicon-and-germanium-containing material may be housed within the processing region. A native oxide may be present. The methods may include contacting the substrate with the pre-treatment precursor to remove the native oxide. The methods may include contacting the substrate with an oxygen-containing precursor to oxidize at least a portion of the first layer of silicon-and-germanium-containing material and at least a portion of the second layer of silicon-and-germanium-containing material. The methods may include contacting the substrate with an etchant precursor to selectively etch the first layer of silicon-and-germanium-containing material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:方法</p>
        <p type="p">405:操作</p>
        <p type="p">410:操作</p>
        <p type="p">415:操作</p>
        <p type="p">420:操作</p>
        <p type="p">425:可選操作</p>
        <p type="p">430:操作</p>
        <p type="p">435:操作</p>
        <p type="p">440:可選操作</p>
        <p type="p">445:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1279" publication-number="202614942">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614942</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129145</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>美容具及使用該美容具之美容方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A45D27/42</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商花王股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新津貴利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIITSU, TAKATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村智美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, TOMOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村朋也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村有加</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, YUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之美容具(1)具備自基面(2)突出之1根或2根以上之突起(3)、及1個或2個以上之噴出孔(4)。1根或2根以上之突起(3)之前端直徑為10 μm以上1,000 μm以下，高度超過0 μm且為3000 μm以下。1個或2個以上之噴出孔(4)具有噴出入口(42)，該噴出入口(42)係經由噴出孔(4)噴出之液態物之入口，噴出入口(42)之內徑為10 μm以上200 μm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:基面</p>
        <p type="p">3:突起</p>
        <p type="p">3L:突起行</p>
        <p type="p">3R:突起配置區域</p>
        <p type="p">K:假想線</p>
        <p type="p">X:第1方向</p>
        <p type="p">Y:第2方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1280" publication-number="202615676">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615676</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129163</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬板及包括其之沉積遮罩</chinese-title>
        <english-title>METAL PLATE AND DEPOSITION MASK COMPRISING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C22C38/40</main-classification>
        <further-classification edition="200601120260105B">C23C14/04</further-classification>
        <further-classification edition="200601120260105B">G02F1/1333</further-classification>
        <further-classification edition="202301120260105B">H10K50/10</further-classification>
        <further-classification edition="202301120260105B">H10K71/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG INNOTEK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李相侑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SANGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種金屬板，包括：鐵(Fe)、鎳(Ni)、氧(O)和鉻(Cr)；及一第一區域和位於該第一區域之間的一第二區域， 其中，該第一區域形成的一深度為距該金屬板表面9奈米，其中，該第一區域包括0 at%至0.02 at%的鉻。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A metal plate comprising; iron (Fe), nickel (Ni), oxygen (O), and chromium (Cr); and a first region and a second region between the first regions, wherein the first region is formed to a depth of 9 nm from the surface of the metal plate, wherein the first region includes 0 at% to 0.02 at% of chromium.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:沉積遮罩</p>
        <p type="p">200:遮罩框架</p>
        <p type="p">205:開口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1281" publication-number="202615709">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615709</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129168</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於基體處理設備之蓋子</chinese-title>
        <english-title>LID FOR SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">C23C16/455</main-classification>
        <further-classification edition="202201120260114B">B01F25/432</further-classification>
        <further-classification edition="202201120260114B">B01F25/422</further-classification>
        <further-classification edition="200601120260114B">F15D1/14</further-classification>
        <further-classification edition="200601120260114B">H01L21/205</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商皮寇桑公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PICOSUN OY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏爾馬　瓦倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHARMA, VARUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆罕默德　薩夫達爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUHAMMAD, SAFDAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於基體處理設備(200)之蓋子(100)，其包含在該蓋子(100)內的一第一混合容積(110)和一第二混合容積(120)，其中該第一混合容積(110)與該第二混合容積(120)彼此互相流體連通，其中該蓋子(100)組配成通過一或多個反應物入口(210)來接收至少一股反應物流動(Fr)在該第一混合容積(110)中，且使接收到的該至少一股反應物流動(Fr)從該第二混合容積(120)通過分佈構件(130)來分佈成輸出流動(Fo)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A lid (100) for a substrate processing apparatus (200), comprising a first mixing volume (110) and a second mixing volume (120) within the lid (100), wherein the first mixing volume (110) and the second mixing volume (120) are in fluid communication with each other, wherein the lid (100) is configured to receive at least one reactant flow (Fr) in the first mixing volume (110) through one or more reactant inlets (210) and distribute the received at least one reactant flow (Fr) as output flow (Fo) from the second mixing volume (120) through distributing means (130).</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:蓋子</p>
        <p type="p">110:第一混合容積</p>
        <p type="p">120:第二混合容積</p>
        <p type="p">130:分佈構件</p>
        <p type="p">140:底板</p>
        <p type="p">150:分隔件</p>
        <p type="p">160:分隔件開口</p>
        <p type="p">170:狹縫狀注射口</p>
        <p type="p">180:頂板</p>
        <p type="p">185:側壁</p>
        <p type="p">Fi:流動</p>
        <p type="p">Fo:輸出流動</p>
        <p type="p">Fr:反應物流動</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1282" publication-number="202615554">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615554</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129187</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用微流體技術生產通用高效右旋葡萄聚糖微粒</chinese-title>
        <english-title>UNIVERSAL EFFICIENT DEXTRAN MICROPARTICLES PRODUCTION WITH MICROFLUIDIC TECHNOLOGY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08J3/24</main-classification>
        <further-classification edition="200601120260102B">C08L5/02</further-classification>
        <further-classification edition="200601120260102B">C12N3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商賽諾菲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANOFI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴斯德研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INSTITUT PASTEUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法國原子能與替代能源委員會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫泰　格列姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTTET, GUILLAUME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魯薩諾夫　維亞契斯拉夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUSANOV, VIACHESLAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈巴　薩米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOBAA, SAMY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特謝爾　諾格斯　伊莎貝拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEXIER-NOGUES, ISABELLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　安托萬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOANG, ANTOINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於經修飾的右旋葡萄聚糖水凝膠微粒用於封裝至少一種合成細胞或天然細胞之用途，該等經修飾的右旋葡萄聚糖水凝膠微粒包含：(i) 至少一種經乙烯碸官能化的右旋葡萄聚糖，以及 (ii) 具有至少兩個硫醇官能基的至少一種可交聯聚合物，其中該右旋葡萄聚糖具有包含在5和500 kDa之間的分子量，並且該乙烯碸對該右旋葡萄聚糖的取代度包含在5%和60%之間。本發明還關於經修飾的右旋葡萄聚糖水凝膠微粒，用於製備其之方法，用於培育包含在所述微粒中的至少一種細胞之體外方法，用於篩選、產生或測試化合物之體外方法，套組，微流體或毫流體通道，用於封裝所述微粒之方法以及用於批次品質控制之方法。所述微粒可用於生物和醫學應用領域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the use of modified dextran hydrogel microparticles comprising (i) at least one vinyl sulfone functionalized dextran, and (ii) at least one crosslinkable polymer having at least two thiol functions, wherein the dextran has a molecular weight comprised between 5 and 500 kDa, and the substitution degree of the dextran by the vinyl sulfone is comprised between 5 and 60%, for encapsulating at least one synthetic or natural cell. The present invention also relates to modified dextran hydrogel microparticles, a process for preparing them, an &lt;i&gt;in vitro&lt;/i&gt; method for cultivating at least one cell comprised in said microparticles, &lt;i&gt;in vitro&lt;/i&gt; methods for screening, for producing or for testing compounds, a kit, a microfluidic or millifluidic channel, a process for encapsulating said microparticles, and a method for the quality control of a batch. Said microparticles are useful in the field of biological and medical applications.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1283" publication-number="202615012">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615012</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129240</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於抑制甲狀腺刺激激素受體之化合物</chinese-title>
        <english-title>COMPOUNDS FOR INHIBITION OF THYROID STIMULATING HORMONE RECEPTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/44</main-classification>
        <further-classification edition="200601120260102B">A61K31/438</further-classification>
        <further-classification edition="200601120260102B">A61K31/4375</further-classification>
        <further-classification edition="200601120260102B">A61K31/4192</further-classification>
        <further-classification edition="200601120260102B">A61P27/00</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商安立文股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENLIVEN INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任　力</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REN, LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊多斯　喬瑟夫　Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LYSSIKATOS, JOSEPH P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱勒姆　艾力克斯　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KELLUM, ALEX ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫雷諾　大衛　奧斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORENO, DAVID AUSTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密斯　亞歷山卓　妮可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMITH, ALEXANDRA NICOLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肯茲　山謬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINTZ, SAMUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示案大體上係關於用於抑制甲狀腺刺激激素受體(TSHR)之化合物及其組合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates generally to compounds and compositions thereof for inhibition of thyroid stimulating hormone receptor (TSHR).</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1284" publication-number="202615099">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615099</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129248</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＧＬＰ—１Ｒ／ＧＩＰＲ促效劑之合成</chinese-title>
        <english-title>SYNTHESIS OF GLP-1R/GIPR AGONISTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260102B">A61K47/62</main-classification>
        <further-classification edition="200601120260102B">A61K38/16</further-classification>
        <further-classification edition="200601120260102B">A61P3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商卡默療法股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARMOT THERAPEUTICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克里希那　希亞姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRISHNAN, SHYAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索德科姆庫姆　切特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SODKOMKUM, CHET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維蘭　馬蒂奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VILLAIN, MATTEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬汀　克里斯多夫　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARTIN, CHRISTOPHER E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威斯納　馬庫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIESNER, MARKUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒尼博　拉爾夫　奧斯卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHONLEBER, RALPH OSCAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑟瓦特尤斯　菲爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SERVATIUS, PHIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏洛斯　加博爾　諾伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOROSS, GABOR NORBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍爾　詹　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOYER, JAN PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恩基　帕斯卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENGI, PASCAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克勞林　奈爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCLOUGHLIN, NIALL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於製備GLP-1R/GIPR促效劑之新穎合成方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides novel synthetic methods for preparing GLP-1R/GIPR agonists.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1285" publication-number="202615157">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615157</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129291</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>片狀構件的端面之塗佈方法、塗佈用噴嘴及自動塗佈裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">B05C5/02</main-classification>
        <further-classification edition="200601120260108B">B05B1/02</further-classification>
        <further-classification edition="200601120260108B">B05C11/10</further-classification>
        <further-classification edition="200601120260108B">B05C9/08</further-classification>
        <further-classification edition="200601120260108B">B05C13/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商武藏工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUSASHI ENGINEERING, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>生島和正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKUSHIMA, KAZUMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一面可減輕朝向片狀構件之端面以外之面的液體材料之附著，一面進行不會在片狀構件之端面產生塗佈遺漏的塗佈。  &lt;br/&gt;一種片狀構件的端面之塗佈方法及執行該方法之自動塗佈裝置，在該塗佈方法中係使用噴嘴10；該噴嘴10具有：槽13，其具有朝向最深部而前端變細的剖面形狀；及液體材料供給路徑16，其在槽13之最深部呈開口；該塗佈方法具備有以下之步驟：以片狀構件21之端面位於槽13內之方式配置噴嘴10及片狀構件21的步驟；自液體材料供給路徑16供給液體材料，而在液體材料供給路徑16之開口端形成具有凸型彎月面之液面的液滴100的步驟；及在使片狀構件21之端面抵接至液滴100之液面的狀態下，使上述片狀構件在水平方向移動而藉此塗佈端面的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:基底部</p>
        <p type="p">12:隆起部</p>
        <p type="p">13:槽(V字槽)</p>
        <p type="p">14a,14b:內壁面</p>
        <p type="p">15:內底面</p>
        <p type="p">16:供給流路(液體材料供給路徑)</p>
        <p type="p">16a:上部開口</p>
        <p type="p">16b:下部開口</p>
        <p type="p">21:片狀構件</p>
        <p type="p">21a:下端面</p>
        <p type="p">24:送出方向</p>
        <p type="p">100:液滴</p>
        <p type="p">101:第1緩衝空間</p>
        <p type="p">102:第2緩衝空間</p>
        <p type="p">W1:片狀構件21之厚度</p>
        <p type="p">W2:槽13之上端之短邊方向之寬度</p>
        <p type="p">W3:內底面15之短邊方向之寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1286" publication-number="202616329">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616329</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129298</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙束裝置中的樣品傾斜量測</chinese-title>
        <english-title>SAMPLE TILT MEASUREMENT IN DUAL-BEAM DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01J37/28</main-classification>
        <further-classification edition="200601120260102B">G01C11/18</further-classification>
        <further-classification edition="201801120260102B">G01N23/2251</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS SMT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅爾　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAYER, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於判定具有彼此相對以角度α所設置的第一帶電粒子束和第二帶電粒子束的雙束計量裝置中樣品傾斜的方法。該方法包含使用該第一帶電粒子束從該第一方向將一圖案投影到該樣品表面上。該所投影圖案係使用該第二帶電粒子束從該第二方向成像在該樣品表面上。藉由分析該等所投影與所成像圖案之對應圖案幾何形狀，判定該樣品表面之傾斜角度。本發明另提供一種用於校正雙束裝置中的該角度α的方法。該等所揭示技術實現在3D斷層掃描程序期間，基於該等成像與銑削處理模組對影像進行即時傾斜修正。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for determining sample tilt in a dual-beam metrology device having a first charged-particle beam and a second charged-particle beam arranged at an angle α relative to each other. The method comprises projecting, from the first direction using the first charged-particle beam, a pattern onto the sample surface. The projected pattern is imaged on the sample surface from the second direction using the second charged-particle beam. By analyzing corresponding pattern geometries of the projected and imaged patterns, a tilt angle of the sample surface is determined. A further method for calibrating the angle α in a dual-beam device is provided. The disclosed techniques enable real-time tilt correction of images based on the imaging and milling processing modules during 3D tomography processes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一標記；點；標記</p>
        <p type="p">20:第二標記；點；標記</p>
        <p type="p">30:第三標記；點；標記</p>
        <p type="p">40:第四標記；點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1287" publication-number="202615722">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615722</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129315</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置</chinese-title>
        <english-title>SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C23F1/46</main-classification>
        <further-classification edition="200601120260102B">B01D15/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩畑翔太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWAHATA, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種基板處理裝置，其能夠以低能量從藥液與有機溶劑之混合液中分離出藥液。  &lt;br/&gt;基板處理裝置具備處理單元、回收配管60a、及回收單元6。處理單元使藥液與有機溶劑之混合液作用於基板之主面。回收配管60a具有連接於處理單元之上游端部。來自處理單元之混合液流入回收配管60a。回收單元6包含分離膜72c，上述分離膜72c從通過回收配管60a而供給之混合液中分離出藥液，而使混合液中之有機溶劑之濃度上升。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">6:回收單元</p>
        <p type="p">7:循環部</p>
        <p type="p">44a:溶劑供給管</p>
        <p type="p">60:配管</p>
        <p type="p">60a:回收配管</p>
        <p type="p">61:回收閥</p>
        <p type="p">65:再利用管</p>
        <p type="p">66:供給閥</p>
        <p type="p">67:送液部</p>
        <p type="p">71:循環配管</p>
        <p type="p">72:膜分離器</p>
        <p type="p">72a:第1路徑</p>
        <p type="p">72b:第2路徑</p>
        <p type="p">72c:分離膜</p>
        <p type="p">73:送液部</p>
        <p type="p">74:循環閥</p>
        <p type="p">75:調溫部</p>
        <p type="p">76:第1金屬過濾器</p>
        <p type="p">78:排出配管</p>
        <p type="p">79:排出閥</p>
        <p type="p">Sn1:濃度感測器</p>
        <p type="p">Sn2:流量計</p>
        <p type="p">Tk1:貯槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1288" publication-number="202615669">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615669</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129319</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鋼板線圈之批次退火方法及冷軋鋼板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C21D1/26</main-classification>
        <further-classification edition="200601120260102B">C21D9/663</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東洋鋼鈑股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYO KOHAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤敦志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原田直治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARADA, NAOHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, HIROYASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種技術，其抑制經批次退火之冷軋鋼板於批次退火後之後續步驟中可能產生之形狀不良。  &lt;br/&gt;本發明之鋼板線圈之批次退火方法之特徵在於：  &lt;br/&gt;包括下述步驟：  &lt;br/&gt;將批次式退火爐之內罩內之環境溫度自室溫升至目標達到溫度－300℃之步驟A；  &lt;br/&gt;其後升至目標達到溫度－100℃之步驟B；  &lt;br/&gt;其後升至目標達到溫度之步驟C；以及  &lt;br/&gt;其後於目標達到溫度加以維持之步驟D；  &lt;br/&gt;目標達到溫度為450℃以上750℃以下，於步驟B及步驟C中，將環境溫度之溫升Q（t）之下降差量ΔQ設為-50℃/h以上且未達0℃/h。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1289" publication-number="202615252">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615252</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129348</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B32B15/08</main-classification>
        <further-classification edition="200601120260102B">B32B15/20</further-classification>
        <further-classification edition="200601120260102B">B32B27/28</further-classification>
        <further-classification edition="200601120260102B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小沼勇輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONUMA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西岡宏司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIOKA, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高岡裕太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAOKA, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平城慎也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAKI, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是有關於一種積層體，包括：包含聚醯亞胺系樹脂的聚醯亞胺系膜、以及設置於該膜的兩面的金屬層，在所述積層體中，在自所述積層體的金屬層表面向積層體的厚度方向壓入壓頭時的最大壓入深度超過壓入壓頭的一側的所述金屬層的厚度、且成為所述聚醯亞胺系膜的厚度的10%以上且50%以下的條件下，在該積層體的兩面基於ISO 14577求出維氏硬度及馬氏硬度時，滿足式（I）的關係。  &lt;br/&gt;&lt;br/&gt;PV/PM≦0.135   （I）  &lt;br/&gt;&lt;br/&gt;[式中，PV表示在該積層體的其中一面測定的維氏硬度與在另一面測定的維氏硬度的差，PM表示在該積層體的其中一面測定的馬氏硬度與在另一面測定的馬氏硬度的差]</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">A、B、C、D、E:點</p>
        <p type="p">h&lt;sub&gt;1&lt;/sub&gt;、h&lt;sub&gt;2&lt;/sub&gt;:凹陷深度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1290" publication-number="202616519">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616519</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129364</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電源轉換器及電源模組</chinese-title>
        <english-title>A POWER CONVERTER AND A POWER MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">H01L23/538</main-classification>
        <further-classification edition="200601120260108B">H01L23/52</further-classification>
        <further-classification edition="200601120260108B">H02M1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商茂力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛挺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GE, TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　埃里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣　航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, HUNT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　景海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, JINGHAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種電源轉換器，包括母板和放置在母板上的電源模組。電源模組包括第一基板、散熱器、輸出電感器、以及垂直於母板平面的電源晶粒。電源晶粒包括閘極驅動器及形成開關節點的一對MOSFET。輸出電感器電連接至開關節點。電源晶粒的第一平面附著在第一基板的第一平面，散熱器附著在電源晶粒的第二平面，電源晶粒的底部邊緣面朝母板的平面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a power converter, which comprises a mother board and a power module disposed on the motherboard. The power module comprises a first substrate, a heat sink, an output inductor, and a power die which is disposed vertically relative to a plane of the motherboard. The power die comprises a gate driver and a pair of metal-oxide-semiconductor field-effect transistors (MOSFETs), the output inductor is electrically connected to a switch node formed by the pair of MOSFETS. A first planar side of the power die is attached to a first planar side of the first substrate, the heatsink is attached to a second planar side of the power die, and a bottom edge of the power die faces toward the plane of the motherboard. Current density is increased by utilizing a vertically oriented power die configuration.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:電源模組</p>
        <p type="p">202:被動元件</p>
        <p type="p">205:母板</p>
        <p type="p">206:電源晶粒</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1291" publication-number="202615968">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615968</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129410</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>帶電粒子束描繪方法，帶電粒子束描繪裝置，及非暫態地記錄了程式的可讀取記錄媒體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260102B">G03F1/72</main-classification>
        <further-classification edition="201201120260102B">G03F1/86</further-classification>
        <further-classification edition="201201120260102B">G03F1/78</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商紐富來科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUFLARE TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野村春之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMURA, HARUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中山田憲昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAYAMADA, NORIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種可修正由於帶電粒子束的照射所造成的不可逆的EUV光罩基板的變形而缺陷偏離吸收體圖案的區域之帶電粒子束描繪方法、帶電粒子束描繪裝置、及非暫態地記錄了程式的可讀取記錄媒體。  &lt;br/&gt;　　一個態樣的帶電粒子束描繪方法，係對試料求出位置偏離量分布，其中該試料會取決於帶電粒子束的照射量分布而不可逆地變形，且具有基板本體與配置於基板本體上的將光反射的層積體與配置於層積體上的將光吸收的吸收體膜，該位置偏離量分布係定義在照射帶電粒子束的時間點的試料的各位置中的由於試料的不可逆變形而發生的距試料的設計上的位置的位置偏離量，運用位置偏離量分布，以在試料發生的缺陷會於描繪後被涵括於吸收體膜殘留的區域之方式，算出帶電粒子束的照射位置的修正量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1292" publication-number="202615696">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615696</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129420</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>惰性自由基輔助之低K薄膜沉積</chinese-title>
        <english-title>INERT RADICAL ASSISTED LOW K FILM DEPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C23C16/30</main-classification>
        <further-classification edition="200601120260102B">C23C16/455</further-classification>
        <further-classification edition="200601120260102B">C23C16/50</further-classification>
        <further-classification edition="200601120260102B">H01L21/316</further-classification>
        <further-classification edition="200601120260102B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐子瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OU, TZU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝　波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郎　紀一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANG, CHI-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏　立群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIA, LI-QUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉馬林格　齊達巴拉Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMALINGAM, CHIDAMBARA A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡卡塔拉曼　尚卡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VENKATARAMAN, SHANKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種處理基板的方法。該方法包括將基板設置在處理腔室的處理區域中，以及使含矽前驅物氣體流入該處理區域。該方法亦包括將前驅物氣體僅暴露於由惰性氣體電漿生成的電漿自由基和非帶電物種，以在該基板上沉積低介電常數膜，其中該低介電常數膜包括來自該前驅物氣體中的一或多種含矽前驅物的一或多個含矽官能團的保留鍵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for processing a substrate is provided. The method includes disposing a substrate in a processing region of a process chamber and flowing a silicon containing precursor gas into the processing region. The method also includes exposing the precursor gas to only plasma radicals and non-charged species generated from an inert gas plasma to deposit a low-k film on the substrate, wherein the low-k film comprises preserved bonds of one or more silicon containing functional groups from the one or more silicon containing precursors of the precursor gas.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:方法</p>
        <p type="p">202:操作</p>
        <p type="p">204:操作</p>
        <p type="p">206:操作</p>
        <p type="p">208:操作</p>
        <p type="p">210:操作</p>
        <p type="p">212:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1293" publication-number="202615025">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615025</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129441</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＣＹＰ１１Ａ１抑制劑化合物及其用途</chinese-title>
        <english-title>CYP11A1 INHIBITOR COMPOUNDS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/506</main-classification>
        <further-classification edition="200601120260102B">A61K31/44</further-classification>
        <further-classification edition="200601120260102B">A61K31/403</further-classification>
        <further-classification edition="200601120260102B">A61K31/145</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾愷醫療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACAI THERAPEUTICS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　連紅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, LIANHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供式(I)之治療活性CYP11A1抑制劑化合物及其醫藥組合物，其可用於治療類固醇受體依賴性病狀及疾病，特定言之雄激素受體依賴性病狀及疾病，諸如內分泌癌症、前列腺癌、去勢抗性前列腺癌及乳癌。  &lt;br/&gt;&lt;img align="absmiddle" height="203px" width="430px" file="ed10213.JPG" alt="ed10213.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There are provided therapeutically active CYP11A1 inhibitor compounds of Formula (I) and pharmaceutical compositions thereof that are useful in the treatment of steroid receptor-dependent conditions and diseases, in particular androgen receptor-dependent conditions and diseases such as endocrine cancer, prostate cancer, castration-resistant prostate cancer, and breast cancer. &lt;br/&gt;&lt;img align="absmiddle" height="213px" width="435px" file="ed10214.JPG" alt="ed10214.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1294" publication-number="202616754">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616754</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129447</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在無線網路中訓練基於人工智慧定位模型資料收集方法及系統</chinese-title>
        <english-title>METHODS AND SYSTEMS FOR DATA COLLECTION FOR ARTIFICIAL INTELLIGENCE BASED POSITIONING MODEL TRAINING IN A WIRELESS NETWORK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260102B">H04W64/00</main-classification>
        <further-classification edition="202201120260102B">H04L41/16</further-classification>
        <further-classification edition="201001120260102B">G01S5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商內數位專利控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERDIGITAL PATENT HOLDINGS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　光州</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, GUANZHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧爾韋拉　赫南德茲　烏利塞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLVERA-HERNANDEZ, ULISES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫仲濟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SON, JUNG JE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邁森尼　阿赫雷夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METHENNI, ACHREF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　志必</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHIBI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種網路裝置可例如自網路資料分析功能(NWDAF)及/或自模型訓練邏輯功能(MTLF)接收收集用於人工智慧或機器學習(AI/ML)定位模型訓練之資料之請求。該請求可包含以下之指示：所關注區域、與用於AI/ML定位模型訓練之該資料相關聯之時間窗、用於AI/ML定位模型訓練之該資料之資料樣本之所請求數目及/或用於AI/ML定位模型訓練之該資料之一資料來源類型。該網路裝置可接收用於AI/ML定位模型訓練之該資料及/或接收與該一或多個WTRU相關聯之位置資料。該網路裝置可將該位置資料及用於AI/ML定位模型訓練之該資料發送至該NWDAF或該MTLF。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A network device may receive a request to collect data for artificial intelligence or machine learning (AI/ML) positioning model training, for example from a network data analytics function (NWDAF) and/or from a model training logical function (MTLF). The request may include an indication of an area of interest, a time window associated with the data for AI/ML positioning model training, a requested number of data samples of the data for AI/ML positioning model training, and/or a data source type of the data for AI/ML positioning model training. The network device may receive the data for AI/ML positioning model training and/or receive location data associated with the one or more WTRUs. The network device may send the location data and the data for AI/ML positioning model training to the NWDAF or the MTLF.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:實例程序</p>
        <p type="p">305:無線傳輸/接收單元(WTRU)</p>
        <p type="p">310:RAN節點</p>
        <p type="p">315:5GC、5GC訓練功能</p>
        <p type="p">DL:下行鏈路</p>
        <p type="p">LMF:位置管理功能</p>
        <p type="p">MTLF:自模型訓練邏輯功能</p>
        <p type="p">PRU:定位參考單元</p>
        <p type="p">RAN:無線電存取網路</p>
        <p type="p">UL:上行鏈路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1295" publication-number="202615026">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615026</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129468</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>經取代咪唑基二氫嘧啶－２，４－二酮及經取代咪唑基哌啶－２，６－二酮衍生物及其用途</chinese-title>
        <english-title>SUBTITUTED IMIDAZOLYL DIHYDROPYRIMIDINE-2,4-DIONE AND SUBSTITUTED IMIDAZOLYL PIPERIDINE-2,6-DIONE DERIVATIVES AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/506</main-classification>
        <further-classification edition="200601120260102B">A61K31/4178</further-classification>
        <further-classification edition="200601120260102B">A61K31/44</further-classification>
        <further-classification edition="200601120260102B">A61K31/403</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商尼奧莫夫公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEOMORPH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕拉喬斯　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PALACIOS, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今瀨英智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMASE, HIDETOMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示提供一種式(I)化合物：  &lt;br/&gt;&lt;img align="absmiddle" height="180px" width="282px" file="ed12437.JPG" alt="ed12437.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，  &lt;br/&gt;或其醫藥學上可接受之鹽、水合物、溶劑合物、前藥、立體異構物或互變異構物，其中R&lt;sub&gt;1&lt;/sub&gt;、R&lt;sub&gt;2a&lt;/sub&gt;、R&lt;sub&gt;2b&lt;/sub&gt;、R&lt;sub&gt;2c&lt;/sub&gt;、R&lt;sub&gt;2d&lt;/sub&gt;、R&lt;sub&gt;4&lt;/sub&gt;、R&lt;sub&gt;4a&lt;/sub&gt;、R&lt;sub&gt;5&lt;/sub&gt;及X&lt;sub&gt;1&lt;/sub&gt;如本文所定義，及其製備及使用方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a Compound of Formula (I): &lt;br/&gt;&lt;img align="absmiddle" height="178px" width="270px" file="ed12438.JPG" alt="ed12438.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; , &lt;br/&gt;or a pharmaceutically acceptable salt, hydrate, solvate, prodrug, stereoisomer, or tautomer thereof, wherein R&lt;sub&gt;1&lt;/sub&gt;, R&lt;sub&gt;2a&lt;/sub&gt;, R&lt;sub&gt;2b&lt;/sub&gt;, R&lt;sub&gt;2c&lt;/sub&gt;, R&lt;sub&gt;2d&lt;/sub&gt;, R&lt;sub&gt;4&lt;/sub&gt;, R&lt;sub&gt;4a&lt;/sub&gt;, R&lt;sub&gt;5&lt;/sub&gt;, and X&lt;sub&gt;1&lt;/sub&gt; are as defined herein, and methods of making and using same.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1296" publication-number="202615382">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615382</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129499</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鎓鹽型單體、單體型光酸產生劑、聚合物、化學增幅阻劑組成物及圖案形成方法</chinese-title>
        <english-title>ONIUM-SALT-TYPE MONOMER, MONOMERIC PHOTO-ACID GENERATOR, POLYMER, CHEMICALLY-AMPLIFIED RESIST COMPOSITION, AND PATTERNING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C25/18</main-classification>
        <further-classification edition="200601120260102B">C07C309/42</further-classification>
        <further-classification edition="200601120260102B">C07C309/43</further-classification>
        <further-classification edition="200601120260102B">C07C311/44</further-classification>
        <further-classification edition="200601120260102B">C07C381/12</further-classification>
        <further-classification edition="200601120260102B">C07D307/12</further-classification>
        <further-classification edition="200601120260102B">C07D327/08</further-classification>
        <further-classification edition="200601120260102B">C07D333/54</further-classification>
        <further-classification edition="200601120260102B">C07D333/76</further-classification>
        <further-classification edition="200601120260102B">C09K3/00</further-classification>
        <further-classification edition="200601120260102B">C08F212/14</further-classification>
        <further-classification edition="200601120260102B">C08F212/32</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供溶劑溶解性優異、高感度、高對比度，且EL、LWR、CDU、DOF優異，抗圖案崩塌強，蝕刻耐性亦優異的鎓鹽型單體。  &lt;br/&gt;本發明之解決手段為式(a)表示之鎓鹽型單體。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="240px" width="600px" file="ed10284.JPG" alt="ed10284.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;n1為0～1、n2為1～4、n3為0～2、n4為0～1、n5為0～4、n6為0～2；R&lt;sup&gt;A&lt;/sup&gt;為氫原子、氟原子、甲基或三氟甲基；R&lt;sup&gt;AL&lt;/sup&gt;為酸不穩定基；R&lt;sup&gt;1&lt;/sup&gt;為鹵素原子、硝基、氰基等；R&lt;sup&gt;2&lt;/sup&gt;為氟原子以外之鹵素原子、硝基、氰基等；R&lt;sup&gt;F&lt;/sup&gt;為氟原子、氟化飽和烴基、氟化飽和烴氧基或碳數1～6之氟化飽和烴基硫基；L&lt;sup&gt;A&lt;/sup&gt;及L&lt;sup&gt;B&lt;/sup&gt;為單鍵、酯鍵等；X&lt;sup&gt;L&lt;/sup&gt;為單鍵、或伸烴基；Z&lt;sup&gt;＋&lt;/sup&gt;為鎓陽離子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is an onium-salt-type monomer represented by the formula (a), where “n1” is 0 or 1, “n2” is 1 to 4, “n3” is 0 to 2, “n4” is 0 or 1, “n5” is 0 to 4, and “n6” is 0 to 2; R&lt;sup&gt;A&lt;/sup&gt; is a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group; R&lt;sup&gt;AL&lt;/sup&gt; is an acid-labile group; R&lt;sup&gt;1&lt;/sup&gt; is a halogen atom, a nitro group, a cyano group, etc.; R&lt;sup&gt;2&lt;/sup&gt; is a halogen atom other than a fluorine atom, a nitro group, a cyano group, etc.; R&lt;sup&gt;F&lt;/sup&gt; is a fluorine atom, a fluorinated saturated hydrocarbyl group, a fluorinated saturated hydrocarbyloxy group, or a fluorinated saturated hydrocarbylthio group having 1 to 6 carbon atoms; L&lt;sup&gt;A&lt;/sup&gt; and L&lt;sup&gt;B&lt;/sup&gt; are each a single bond, an ester bond, etc.; X&lt;sup&gt;L&lt;/sup&gt; is a single bond or a hydrocarbylene group; and Z&lt;sup&gt;+&lt;/sup&gt; is an onium cation. This can provide an onium-salt-type monomer that is excellent in solvent solubility, has high sensitivity and high contrast, is excellent in EL, LWR, CDU, and DOF, is resistant to pattern collapse, and is also excellent in etching resistance. &lt;br/&gt;&lt;img align="absmiddle" height="179px" width="486px" file="ed10285.JPG" alt="ed10285.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1297" publication-number="202616806">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616806</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129506</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括蒸氣壓縮冷卻環路之浸沒式冷卻系統</chinese-title>
        <english-title>IMMERSION COOLING SYSTEMS INCLUDING VAPOR-COMPRESSION COOLING LOOP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">H05K7/20</main-classification>
        <further-classification edition="200601120260108B">F25B1/00</further-classification>
        <further-classification edition="200601120260108B">H01L23/427</further-classification>
        <further-classification edition="200601120260108B">F28D15/02</further-classification>
        <further-classification edition="200601120260108B">F25B39/00</further-classification>
        <further-classification edition="202101120260108B">F25B41/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科慕ＦＣ有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE CHEMOURS COMPANY FC, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波特克　古斯塔沃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POTTKER, GUSTAVO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一浸沒式冷卻系統包括：一浸沒式冷卻槽，該浸沒式冷卻槽界定一空腔，該空腔經定大小及定形狀以用於保留一第一流體的一液體體積及待浸沒在該第一流體的該液體體積中之至少一個電氣組件，及用於界定該第一流體的該液體體積上方之一蒸氣間隙；一蒸氣壓縮系統，其可與該浸沒式冷卻槽結合操作。該蒸氣壓縮系統包括用於對一第二流體加壓之一壓縮機、定位在該壓縮機上游且至少部分位於該浸沒式冷卻槽的該蒸氣間隙內之一第一熱交換器、及定位在該壓縮機下游之一第二熱交換器。該第一熱交換器可操作以將熱能從該蒸氣間隙中之該第一流體的氣相傳遞至該第二流體。該第二熱交換器可操作以將熱從該第二流體中排出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An immersion cooling system includes an immersion cooling tank defining a cavity sized and shaped for retaining a liquid volume of a first fluid and at least one electrical component to be immersed in the liquid volume of the first fluid, and for defining a vapor clearance above the liquid volume of the first fluid, and a vapor compression system operable in conjunction with the immersion cooling tank. The vapor compression system includes a compressor for pressurizing a second fluid, a first heat exchanger positioned upstream from the compressor and at least partially within the vapor clearance of the immersion cooling tank, and a second heat exchanger positioned downstream from the compressor. The first heat exchanger is operable to transfer thermal energy from a vapor-phase of the first fluid in the vapor clearance to the second fluid. The second heat exchanger is operable to reject heat from the second fluid.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:浸沒式冷卻系統</p>
        <p type="p">12:浸沒槽</p>
        <p type="p">12a:蒸發器</p>
        <p type="p">12b:蒸發器</p>
        <p type="p">14:側表面</p>
        <p type="p">16:下表面</p>
        <p type="p">18:上表面</p>
        <p type="p">19:槽蓋</p>
        <p type="p">20:內表面</p>
        <p type="p">22:空腔</p>
        <p type="p">26:流體</p>
        <p type="p">28:電氣組件</p>
        <p type="p">30:基材</p>
        <p type="p">32:晶片</p>
        <p type="p">34:冷板</p>
        <p type="p">36:流體表面</p>
        <p type="p">38:蒸氣</p>
        <p type="p">40:蒸氣間隙</p>
        <p type="p">44:通道</p>
        <p type="p">50:環路</p>
        <p type="p">52:冷凝器</p>
        <p type="p">52a:出口</p>
        <p type="p">54:流體冷卻器</p>
        <p type="p">54a:入口</p>
        <p type="p">56:泵</p>
        <p type="p">60:熱交換器或盤管</p>
        <p type="p">62:熱回收盤管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1298" publication-number="202616006">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616006</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129516</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>工作機械控制裝置及工作機械</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G05B19/04</main-classification>
        <further-classification edition="200601120260102B">G05B19/418</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤本泰生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMOTO, TAISEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種工作機械控制裝置，其控制工作機械，該工作機械具有：加工機構，其藉由使工具相對於工件進行相對移動，來利用上述工具對上述工件進行加工；以及消耗電力之複數個輔助裝置；其具備：自動控制部，其使上述加工機構自動地進行動作來進行加工；手動控制部，其依照來自操作人員之輸入，使上述加工機構進行動作；籌備節電部，其將不使用於操作人員進行之籌備作業之至少一個上述輔助裝置之電源予以切斷；以及模式選擇部，其選擇複數個運轉模式中之任一者，該複數個運轉模式包含：由上述自動控制部控制之自動運轉模式、以及在藉由上述籌備節電部切斷上述輔助裝置之電源之狀態下由上述手動控制部控制之籌備作業模式；上述模式選擇部於有既定之輸入的情形時，切換至上述籌備作業模式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:工作機械</p>
        <p type="p">10:加工機構</p>
        <p type="p">11:主軸馬達</p>
        <p type="p">12:工具定位馬達</p>
        <p type="p">13:平台馬達</p>
        <p type="p">21:門驅動裝置</p>
        <p type="p">22:冷卻劑泵</p>
        <p type="p">23:潤滑油泵</p>
        <p type="p">24:霧收集器</p>
        <p type="p">25:去油器</p>
        <p type="p">26:工件裝載器</p>
        <p type="p">27:人體感測器</p>
        <p type="p">30:工作機械控制裝置</p>
        <p type="p">31:自動控制部</p>
        <p type="p">32:手動控制部</p>
        <p type="p">33:籌備節電部</p>
        <p type="p">34:驅動限制部</p>
        <p type="p">35:模式選擇部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1299" publication-number="202616090">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616090</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129522</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用緩衝器支援網路單晶片之多種功能</chinese-title>
        <english-title>SUPPORTING MULTIPLE FUNCTIONS OF A NETWORK-ON-CHIP USING A BUFFER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">G06F13/36</main-classification>
        <further-classification edition="200601120251201B">G06F13/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商谷歌有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOOGLE LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝思　凱坦庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHETH, KETANKUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝爾　安庫爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEHL, ANKUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了用於使用緩衝器支援網路單晶片之多種功能的技術及設備。在實例態樣中，網路單晶片(110)使用基於信用之協定且促進與不同時脈域(206)、不同電壓域208、不同電力域210、不同資料寬度(212)或其某種組合相關聯之不同子系統(108)之間的通信。該網路單晶片(110)包括緩衝器(118)，該緩衝器提供用於信用管理(214)之儲存、用於非同步時脈域交叉(216)之儲存及用於資料放大(218)之儲存。雖然其他網路單晶片或其他系統單晶片可具有個別儲存元件以支援各功能，但該緩衝器(118)充當能夠支援此等功能中之各者的單一儲存元件。利用該緩衝器(118)，與利用多個儲存元件之其他網路單晶片相比，該網路單晶片(110)可具有更小之佔地面積、可消耗更少電力且可具有更少延時。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Techniques and apparatuses are described for supporting multiple functions of a network-on-chip using a buffer. In example aspects, a network-on-chip (110) uses a credit-based protocol and facilitates communication between different subsystems (108) associated with different clock domains (206), different voltage domains 208, different power domains 210, different data widths (212), or some combination thereof. The network-on-chip (110) includes a buffer (118), which provides storage for credit management (214), storage for an asynchronous clock-domain crossing (216), and storage for data upscaling (218). While other network-on-chips or other system-on-chips can have individual storage elements to support each function, the buffer (118) acts as a single storage element capable of supporting each of these functions. With the buffer (118), the network-on-chip (110) can have a smaller footprint, can consume less power, and can have less latency compared to other network-on-chips that utilize multiple storage elements.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:環境</p>
        <p type="p">102:計算裝置</p>
        <p type="p">104:使用者</p>
        <p type="p">106:系統單晶片/SOC</p>
        <p type="p">108-1:子系統/第一子系統</p>
        <p type="p">108-2:子系統/第二子系統</p>
        <p type="p">108-S:子系統</p>
        <p type="p">110:網路單晶片/NOC</p>
        <p type="p">112:基於信用之協定</p>
        <p type="p">114:服務品質/QoS</p>
        <p type="p">116-1:虛擬通道/VC/第一虛擬通道</p>
        <p type="p">116-V:虛擬通道/VC</p>
        <p type="p">118:緩衝器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1300" publication-number="202616392">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616392</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129527</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/48</main-classification>
        <further-classification edition="200601120260102B">B32B37/12</further-classification>
        <further-classification edition="200601120260102B">C23C16/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯野克宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IINO, KATSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供可減少薄化後之基板的厚度之參差不齊的技術。作為上述課題之解決手段，本發明之一態樣的基板處理方法係具有第1接合工序；薄化工序；及剝離工序。第1接合工序係將第2基板接合在第1面形成有元件的第1基板的第1面而形成疊合基板。薄化工序係磨削疊合基板的第1基板側，將第1基板薄化。剝離工序係從薄化後之第1基板將第2基板剝離。且，第1接合工序係將第1基板與第2基板藉由矽氧烷鍵結而接合在一起。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S101~S110:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1301" publication-number="202615409">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615409</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129534</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鋶鹽型單體、聚合物、化學增幅阻劑組成物及圖案形成方法</chinese-title>
        <english-title>SULFONIUM SALT TYPE MONOMER, POLYMER, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERN FORMING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C309/30</main-classification>
        <further-classification edition="200601120260102B">C07C309/42</further-classification>
        <further-classification edition="200601120260102B">C07C309/43</further-classification>
        <further-classification edition="200601120260102B">C07C309/73</further-classification>
        <further-classification edition="200601120260102B">C07C381/12</further-classification>
        <further-classification edition="200601120260102B">C07D327/08</further-classification>
        <further-classification edition="200601120260102B">C07D333/54</further-classification>
        <further-classification edition="200601120260102B">C07D333/76</further-classification>
        <further-classification edition="200601120260102B">C09K3/00</further-classification>
        <further-classification edition="200601120260102B">C08F212/14</further-classification>
        <further-classification edition="200601120260102B">C08F212/32</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供在使用高能射線之光微影中，溶劑溶解性優良，為高感度、高對比度，且EL、LWR、CDU、DOF等微影性能優良的化學增幅阻劑組成物所使用的鋶鹽型單體、含有來自該鋶鹽型單體之重複單元的聚合物、含有該聚合物之化學增幅阻劑組成物、及使用該化學增幅阻劑組成物之圖案形成方法。  &lt;br/&gt;該課題之解決手段為一種鋶鹽型單體，係以下式(A)表示。  &lt;br/&gt;&lt;img align="absmiddle" height="124px" width="414px" file="ed10478.JPG" alt="ed10478.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sulfonium salt type monomer having the following formula (A). &lt;br/&gt;&lt;img align="absmiddle" height="137px" width="437px" file="ed10479.JPG" alt="ed10479.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1302" publication-number="202615310">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615310</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129542</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>間隔件及捆包體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">B65D71/70</main-classification>
        <further-classification edition="200601120260115B">H01L21/673</further-classification>
        <further-classification edition="200601120260115B">B65D19/44</further-classification>
        <further-classification edition="200601120260115B">B65D85/30</further-classification>
        <further-classification edition="200601120260115B">B65D65/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本電氣硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON ELECTRIC GLASS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中室友良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURO, TOMOYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">作為間隔件(1)的構成要素之框體(2)具備：將板狀物(G)的外緣部(Ga)從下方接收之接收部(5)、限制板狀物(G)的橫向移動之限制部(6)、以及用於將板狀物(G)往上方取出之取出部(4)，取出部(4)設置在比框體(2)的外側端部(2B)靠內側的位置。間隔件(1)，作為框體(2)以外的構成要素，係具備防掉落部(7)及外側延伸部(8)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:間隔件</p>
        <p type="p">2:框體</p>
        <p type="p">2A:框體的內側端部</p>
        <p type="p">2Aa:框體的內側端部之上端部</p>
        <p type="p">2Ab:框體的內側端部之下端部</p>
        <p type="p">2B:框體的外側端部(外側端壁部)</p>
        <p type="p">2Ba:框體的外側端部之平面部</p>
        <p type="p">2C:框體的上表面部</p>
        <p type="p">3:保持部</p>
        <p type="p">4:取出部(凹部)</p>
        <p type="p">4a:凹部的底面</p>
        <p type="p">4aa:凹部的底面之平面</p>
        <p type="p">4ab:凹部的底面之傾斜面</p>
        <p type="p">4b:凹部的側面</p>
        <p type="p">4c:凹部的外側端面</p>
        <p type="p">5:接收部</p>
        <p type="p">6:限制部</p>
        <p type="p">7:防掉落部</p>
        <p type="p">8:外側延伸部</p>
        <p type="p">9:隆起部</p>
        <p type="p">9a:隆起部的外側端部</p>
        <p type="p">9b:隆起部的上表面部</p>
        <p type="p">9ba:隆起部的上表面部之內側端部</p>
        <p type="p">9c:隆起部的第三縱面部</p>
        <p type="p">La:防掉落部之內外方向(徑向)的長度</p>
        <p type="p">Lb:外側延伸部之內外方向的長度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1303" publication-number="202615258">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615258</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129544</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層薄膜、使用其之積層體、及包含該積層體之顯示器構件或包裝材</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B32B27/06</main-classification>
        <further-classification edition="200601120260102B">B32B27/30</further-classification>
        <further-classification edition="202001120260102B">B33Y40/20</further-classification>
        <further-classification edition="202001120260102B">B33Y70/00</further-classification>
        <further-classification edition="201501120260102B">B33Y80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中西佑太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANISHI, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩谷忠彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWAYA, TADAHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒本光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAMOTO, HIKARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>園田和衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONODA, KAZUMORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太田一善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTA, KAZUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的積層薄膜係具有基材樹脂、與位於前述基材樹脂的至少一面之樹脂層(X)之積層薄膜，其中前述樹脂層(X)滿足以下的特徵。&lt;br/&gt;  (1)前述樹脂層(X)的表面自由能為42.5mN/m以上55.0mN/m以下。(2)在前述樹脂層(X)上進一步設置水系硬塗層時的劃格(cross-cut)法所得到之24小時煮沸後接著性為60/100以上。&lt;br/&gt;  提供與藉由水系塗材所形成之加工層在濕潤環境下的接著性優異的積層薄膜、使用其之積層體、及包含前述積層體之顯示器構件或包裝材。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1304" publication-number="202615397">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615397</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129546</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鎓鹽、化學增幅阻劑組成物及圖案形成方法</chinese-title>
        <english-title>ONIUM SALT, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERN FORMING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C63/70</main-classification>
        <further-classification edition="200601120260102B">C07C65/05</further-classification>
        <further-classification edition="200601120260102B">C07C65/21</further-classification>
        <further-classification edition="200601120260102B">C07C69/80</further-classification>
        <further-classification edition="200601120260102B">C07C323/62</further-classification>
        <further-classification edition="200601120260102B">C07C381/12</further-classification>
        <further-classification edition="200601120260102B">C07D307/12</further-classification>
        <further-classification edition="200601120260102B">C07D327/08</further-classification>
        <further-classification edition="200601120260102B">C07D333/76</further-classification>
        <further-classification edition="200601120260102B">C09K3/00</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係提供使用於在使用高能量射線之光微影中，為高感度，解析性優良，改善EL、LWR、CDU、DOF等之微影性能，此外可抑制阻劑圖案之崩塌的化學增幅阻劑組成物中的新穎鎓鹽、化學增幅阻劑組成物及圖案形成方法。  &lt;br/&gt;本發明之解決手段係由下式(1A)表示之陽離子及下式(1B)表示之陰離子構成之鎓鹽。  &lt;br/&gt;&lt;img align="absmiddle" height="239px" width="435px" file="ed10399.JPG" alt="ed10399.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An onium salt consisting of a cation having the formula (1A) and an anion having the formula (1B). &lt;br/&gt;&lt;img align="absmiddle" height="106px" width="416px" file="ed10400.JPG" alt="ed10400.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="135px" width="348px" file="ed10401.JPG" alt="ed10401.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1305" publication-number="202615144">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615144</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129553</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>醋酸乙烯酯製造用觸媒及醋酸乙烯酯的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B01J21/08</main-classification>
        <further-classification edition="200601120260102B">B01J23/66</further-classification>
        <further-classification edition="200601120260102B">B01J31/04</further-classification>
        <further-classification edition="202401120260102B">B01J35/30</further-classification>
        <further-classification edition="202401120260102B">B01J35/40</further-classification>
        <further-classification edition="202401120260102B">B01J35/61</further-classification>
        <further-classification edition="202401120260102B">B01J35/63</further-classification>
        <further-classification edition="202401120260102B">B01J35/64</further-classification>
        <further-classification edition="200601120260102B">B01J37/02</further-classification>
        <further-classification edition="200601120260102B">B01J37/04</further-classification>
        <further-classification edition="200601120260102B">B01J37/16</further-classification>
        <further-classification edition="200601120260102B">C07C67/055</further-classification>
        <further-classification edition="200601120260102B">C07C69/15</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商柯萊斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRASUS CHEMICAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白倉那桜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRAKURA, NAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩間康拓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWAMA, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅原和樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMEHARA, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供能以高觸媒活性來製造醋酸乙烯酯的觸媒及其製造方法。一種醋酸乙烯酯製造用觸媒，其係鈀、金及醋酸鹽被載持於矽膠載體，該矽膠載體之比表面積為200~ 350m&lt;sup&gt;2&lt;/sup&gt;/g，細孔容積為0.760~1.000cc/g。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1306" publication-number="202615389">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615389</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129564</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分離（甲基）丙烯酸的方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C51/43</main-classification>
        <further-classification edition="200601120260102B">C07C57/04</further-classification>
        <further-classification edition="200601120260102B">C07C57/07</further-classification>
        <further-classification edition="200601120260102B">B01D5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴地斯顏料化工廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬奇特　喬瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACHT, JOSEF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕拉西歐　蒙帝斯　阿圖羅　阿朗索</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PALACIO MONTES, ARTURO ALONZO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬克維茲　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACKEWITZ, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫德　莫里茲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MODL, MORITZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫羅韋爾斯　菲利普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRAUWELS, FILIP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種自氣體混合物分離(甲基)丙烯酸的方法，該氣體混合物作為該(甲基)丙烯酸的至少一個C&lt;sub&gt;3&lt;/sub&gt;/C&lt;sub&gt;4&lt;/sub&gt;前驅體之催化氣相氧化的粗製產物而存在，其中，耗盡該氣體混合物中的高沸化合物，在具有有效分離內裝件的分離塔中對該耗盡高沸化合物的氣體混合物進行凝聚，並且自該分離塔引出包含該(甲基)丙烯酸的液體混合物，其中，將該液體混合物可調節地輸送至精餾塔以進一步對該(甲基)丙烯酸進行提純以及/或者在未進一步進行提純的情況下，將該液體混合物直接輸送至酯化設備以將該(甲基)丙烯酸轉化為(甲基)丙烯酸烷基酯。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:分離塔</p>
        <p type="p">101:分離塔中的合成氣流(氣體混合物)</p>
        <p type="p">102:塔板</p>
        <p type="p">103:回流液體流</p>
        <p type="p">104:來自分離塔的粗製丙烯酸流(液體混合物)</p>
        <p type="p">105:精餾塔</p>
        <p type="p">106:高純度丙烯酸流</p>
        <p type="p">107:蒸發器</p>
        <p type="p">108:冷卻器</p>
        <p type="p">109:酯化設備</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1307" publication-number="202615214">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615214</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129587</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化合物半導體晶圓用砥石</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B24D3/04</main-classification>
        <further-classification edition="200601120260102B">B24D3/34</further-classification>
        <further-classification edition="200601120260102B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商聯合材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>A.L.M.T. CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>道内真人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICHIUCHI, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山村健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMURA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富田佑介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMITA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡田雅伸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKADA, MASANOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種化合物半導體晶圓用砥石，其具備平均粒徑0.10 μm以上20.00 μm以下之金剛石研磨粒及玻璃熔結劑，且具有設置有氣孔之超研磨粒層，該超研磨粒層之上述氣孔含有藉由壓汞法測定之孔徑40.00 μm以下之細孔，且上述細孔之直徑D50大於上述金剛石研磨粒之平均粒徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">6:超研磨粒層</p>
        <p type="p">20:化合物半導體晶圓用砥石</p>
        <p type="p">120:母材</p>
        <p type="p">122:孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1308" publication-number="202616144">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616144</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129592</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構、半導體裝置、存算一體裝置、電子裝置及其操作方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURES, SEMICONDUCTOR DEVICES, COMPUTING-IN-MEMORY DEVICES, ELECTRONIC APPARATUS, AND OPERATION METHODS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250910B">G06N3/063</main-classification>
        <further-classification edition="200601120250910B">G11C11/54</further-classification>
        <further-classification edition="200601120250910B">G06F17/10</further-classification>
        <further-classification edition="200601120250910B">G11C7/16</further-classification>
        <further-classification edition="202301120250910B">H10B41/35</further-classification>
        <further-classification edition="202301120250910B">H10B43/35</further-classification>
        <further-classification edition="202301120250910B">H10B12/00</further-classification>
        <further-classification edition="202501120250910B">H10D88/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商長江存儲科技控股有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANGTZE MEMORY TECHNOLOGIES HOLDING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>靳磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍宗亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUO, ZONG-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所揭露的半導體裝置包括：第一半導體結構，所述第一半導體結構包括類比數位轉換器電路和資料處理電路；以及第二半導體結構，所述第二半導體結構包括存儲陣列和耦合到所述存儲陣列的週邊電路；其中，所述類比數位轉換器電路與所述存儲陣列耦合並且被配置為將基於由所述存儲陣列執行的第一操作的類比計算資訊轉換成數位資訊，並且所述資料處理電路與所述類比數位轉換器電路耦合並且被配置為基於所述數位資訊執行第二操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosed semiconductor device includes: a first semiconductor structure including an analog-to-digital converter circuit and a data processing circuit; and a second semiconductor structure including a storage array and a peripheral circuit coupled to the storage array. The analog-to-digital converter circuit is coupled to the storage array and configured to convert analog computing information based on a first operation performed by the storage array into digital information. The data processing circuit is coupled to the analog-to-digital converter circuit and configured to perform a second operation based on the digital information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:第一鍵合層</p>
        <p type="p">102:第二鍵合層</p>
        <p type="p">103:第三鍵合層</p>
        <p type="p">104:第四鍵合層</p>
        <p type="p">200:第一半導體結構</p>
        <p type="p">210:類比數位轉換器電路</p>
        <p type="p">220:資料處理電路</p>
        <p type="p">230:第一介面電路</p>
        <p type="p">240:控制器</p>
        <p type="p">301:存儲陣列</p>
        <p type="p">302:週邊電路</p>
        <p type="p">320:第一互連結構</p>
        <p type="p">330:第四互連結構</p>
        <p type="p">516:第二介面電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1309" publication-number="202615720">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615720</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129593</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬箔的製造方法，和導熱性材料用的金屬箔</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C23C18/16</main-classification>
        <further-classification edition="200601120260102B">C23C18/20</further-classification>
        <further-classification edition="200601120260102B">C23C18/38</further-classification>
        <further-classification edition="200601120260102B">C09K5/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商迪睿合股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEXERIALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙奕靖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, YIJING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嶋田和人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMADA, KAZUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波木秀次</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAMIKI, HIDETSUGU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渋谷弘毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBUYA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長島稔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGASHIMA, MINORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種金屬箔的製造方法，其包括在具有算術平均粗糙度Ra50nm以下的平坦面的樹脂基材上，形成金屬箔的工序，以及除去上述樹脂基材，製造金屬箔的工序，上述金屬箔的算術平均粗糙度Ra為50nm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:金屬箔</p>
        <p type="p">101:第1面</p>
        <p type="p">102:第2面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1310" publication-number="202615082">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615082</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129597</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阿托西班(ATOSIBAN)組合物及其用途</chinese-title>
        <english-title>ATOSIBAN COMPOSITIONS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260102B">A61K38/08</main-classification>
        <further-classification edition="200601120260102B">A61P15/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商輝凌責任有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FERRING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜洪亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DU, HONGLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于葦凌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, WEILING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫鵬飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, PENGFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣大中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述了可注射的基於油之阿托西班醫藥組合物及使用其之治療方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein are injectable, oil-based atosiban pharmaceutical compositions and therapeutic methods using them.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1311" publication-number="202615454">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615454</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129637</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>以CNP變異體治療身材矮小</chinese-title>
        <english-title>TREATMENT OF SHORT STATURE WITH CNP VARIANTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07K14/435</main-classification>
        <further-classification edition="200601120260102B">A61K38/10</further-classification>
        <further-classification edition="200601120260102B">A61P43/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商拜奧馬林製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIOMARIN PHARMACEUTICAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫特　丹尼爾　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENDT, DANIEL J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克羅福德　布萊特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRAWFORD, BRETT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐　正佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, CHENG-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕普蓋利　伊琳娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAPNGELI, IRINNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴　強納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAY, JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費薛里凡　艾琳娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FISHELEVA, ELENA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明概言之係關於使用C型利尿鈉肽(C-type natriuretic peptide；CNP)變異體治療對生長激素療法無反應個體之身材矮小病症的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates, in general, to methods of treating short stature disorders in a subject who is non-responsive to growth hormone therapy using variants of C-type natriuretic peptide (CNP).</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1312" publication-number="202615664">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615664</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129652</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於增強遞送的新型工程化蛋白質遞送載體</chinese-title>
        <english-title>NOVEL ENGINEERED PROTEIN DELIVERY VEHICLES FOR ENHANCED DELIVERY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C12N15/86</main-classification>
        <further-classification edition="200601120260102B">C12N15/12</further-classification>
        <further-classification edition="200601120260102B">A61K38/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商正基基因科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENEDITBIO LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳子蔚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, CHI WAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣自華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, ZIHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭宗立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, ZONGLI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種經工程化改造的蛋白質遞送載體，該載體能夠在宿主細胞內自組裝，並包裹或包埋負載。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1313" publication-number="202615410">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615410</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129688</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鋶鹽型單體、聚合物、化學增幅阻劑組成物及圖案形成方法</chinese-title>
        <english-title>SULFONIUM SALT MONOMER, POLYMER, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERN FORMING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C309/30</main-classification>
        <further-classification edition="200601120260102B">C07C309/42</further-classification>
        <further-classification edition="200601120260102B">C07C309/43</further-classification>
        <further-classification edition="200601120260102B">C07C309/73</further-classification>
        <further-classification edition="200601120260102B">C07C381/12</further-classification>
        <further-classification edition="200601120260102B">C07D327/08</further-classification>
        <further-classification edition="200601120260102B">C07D333/54</further-classification>
        <further-classification edition="200601120260102B">C07D333/76</further-classification>
        <further-classification edition="200601120260102B">C09K3/00</further-classification>
        <further-classification edition="200601120260102B">C08F212/14</further-classification>
        <further-classification edition="200601120260102B">C08F212/32</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係在使用高能射線之光微影中，提供溶劑溶解性優良，為高感度、高對比度，且EL、LWR、CDU、DOF等微影性能優良之化學增幅阻劑組成物中使用之鋶鹽型單體、含有來自該鋶鹽型單體之重複單元之聚合物、含有該聚合物之化學增幅阻劑組成物、及使用該化學增幅阻劑組成物之圖案形成方法。  &lt;br/&gt;本發明之解決手段係下式(A)表示之鋶鹽型單體。  &lt;br/&gt;&lt;img align="absmiddle" height="109px" width="379px" file="ed10478.JPG" alt="ed10478.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sulfonium salt monomer having the formula (A). &lt;br/&gt;&lt;img align="absmiddle" height="98px" width="360px" file="ed10479.JPG" alt="ed10479.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1314" publication-number="202616667">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616667</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129698</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>讀出類比數位轉換器電路系統、對可預設斜坡驅動器進行預設的方法及讀出類比數位轉換器圖像感測系統</chinese-title>
        <english-title>READOUT ANALOG-TO-DIGITAL CONVERTER CIRCUITRIES, METHODS OF PRESETTING A PRESETTABLE RAMP DRIVER AND READOUT ANALOG-TO-DIGITAL CONVERTER IMAGE SENSING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H03M1/12</main-classification>
        <further-classification edition="202301120260102B">H04N25/77</further-classification>
        <further-classification edition="202301120260102B">H04N25/76</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商豪威科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭絃溶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, HYUNYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海老原弘知</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBIHARA, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳澤暢大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANAGISAWA, NOBUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種讀出類比數位轉換器（ADC）電路系統通過ADC比較器將位元線接收的類比圖像信號轉成數位信號，及使用其的圖像感測系統。ADC比較器將其第一輸入處的圖像信號電壓與其第二輸入處的斜坡電壓進行比較以觸發栓鎖器且使ADC輸出數位信號。每一畫素電壓僅通過採樣電容器在一個比較器的第一輸入處耦合到一個比較器。斜坡產生器產生全域斜坡電壓作為多個可預設斜坡驅動器的輸入。每一可預設斜坡驅動器輸出經緩衝的斜坡電壓以在多個ADC比較器的第二輸入處同時驅動多個ADC比較器。揭露可預設斜坡驅動器的模型電路，且呈現對可預設斜坡驅動器進行預設的相應程序以展示如何調節每一特徵化的可預設斜坡驅動器來驅動ADC的多個ADC比較器。揭露預設可預設斜坡驅動器的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An readout analog-to-digital converter (ADC) converts analog image signal received from a bitline to a digital signal through an ADC comparator, and an image sensing system using the same. The ADC comparator compares an image signal voltage at its first input against a ramp voltage at its second input to trigger a latch and to cause a digital signal output from the ADC. Each pixel voltage is coupled to only one comparator at its first input through a sample capacitor. A ramp generator generates a global ramp voltage as an input to a plurality of presettable ramp drivers. Each presettable ramp driver outputs a buffered ramp voltage to drive multiple ADC comparators simultaneously at their second inputs. Model circuits of the presettable ramp drivers are disclosed, and respective procedures of presetting the presettable ramp drivers are presented to demonstrate how each of featured presettable ramp drivers is conditioned to drive multiple ADC comparators of the ADCs. Methods of presetting the presettable ramp driver are disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">208:讀出位元線/位元線</p>
        <p type="p">220:讀出ADC電路</p>
        <p type="p">222:類比輸入電壓/類比圖像電壓信號/類比信號(Vpixel)</p>
        <p type="p">224:畫素電容器(C_pxl)</p>
        <p type="p">226:第一輸入端子(IN1)</p>
        <p type="p">228:第二輸入端子(IN2)</p>
        <p type="p">230:斜坡產生器</p>
        <p type="p">232:斜坡輸入電壓(Vramp_i)</p>
        <p type="p">238:輸入</p>
        <p type="p">240:可預設斜坡驅動器</p>
        <p type="p">260:斜坡輸出電壓(Vramp_o)</p>
        <p type="p">262:輸出</p>
        <p type="p">270:ADC比較器</p>
        <p type="p">278:輸出電壓(Vout)</p>
        <p type="p">280:斜坡計數器</p>
        <p type="p">290:數位輸出碼/數位信號(dig_out)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1315" publication-number="202615383">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615383</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129700</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鎓鹽型單體、單體型光酸產生劑、聚合物、化學增幅阻劑組成物及圖案形成方法</chinese-title>
        <english-title>ONIUM-SALT-TYPE MONOMER, MONOMERIC PHOTO-ACID GENERATOR, POLYMER, CHEMICALLY-AMPLIFIED RESIST COMPOSITION, AND PATTERNING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C25/18</main-classification>
        <further-classification edition="200601120260102B">C07C309/12</further-classification>
        <further-classification edition="200601120260102B">C07C309/75</further-classification>
        <further-classification edition="200601120260102B">C07C381/12</further-classification>
        <further-classification edition="200601120260102B">C07D327/08</further-classification>
        <further-classification edition="200601120260102B">C07D333/54</further-classification>
        <further-classification edition="200601120260102B">C07D333/76</further-classification>
        <further-classification edition="200601120260102B">C09K3/00</further-classification>
        <further-classification edition="200601120260102B">C08F212/14</further-classification>
        <further-classification edition="200601120260102B">C08F212/32</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係提供溶劑溶解性優良，為高感度、高對比度，且EL、LWR、CDU、DOF優良，抗圖案崩塌，蝕刻耐性亦優良之鎓鹽型單體。  &lt;br/&gt;本發明之解決手段係式(a)表示之鎓鹽型單體。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="237px" width="628px" file="ed10265.JPG" alt="ed10265.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;n1係0~1，n2係1~4，n3係0~2，n4係0~4；R&lt;sup&gt;A&lt;/sup&gt;係氫原子、氟原子、甲基或三氟甲基；R&lt;sup&gt;AL&lt;/sup&gt;係酸不穩定基；R&lt;sup&gt;1&lt;/sup&gt;係鹵素原子、硝基、氰基等；L&lt;sup&gt;A&lt;/sup&gt;及L&lt;sup&gt;B&lt;/sup&gt;係單鍵、酯鍵等；X&lt;sup&gt;L&lt;/sup&gt;係單鍵、或伸烴基；Q&lt;sup&gt;1&lt;/sup&gt;及Q&lt;sup&gt;2&lt;/sup&gt;係氫原子、氟原子或氟化飽和烴基；Q&lt;sup&gt;3&lt;/sup&gt;及Q&lt;sup&gt;4&lt;/sup&gt;係氟原子或氟化飽和烴基；Z&lt;sup&gt;+&lt;/sup&gt;係鎓陽離子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is an onium-salt-type monomer represented by the formula (a), where “n1” is 0 or 1, “n2” is 1 to 4, “n3” is 0 to 2, “n4” is 0 to 4; R&lt;sup&gt;A&lt;/sup&gt; is a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group; R&lt;sup&gt;AL&lt;/sup&gt; is an acid-labile group; R&lt;sup&gt;1&lt;/sup&gt; is a halogen atom, a nitro group, a cyano group, etc.; L&lt;sup&gt;A&lt;/sup&gt; and L&lt;sup&gt;B&lt;/sup&gt; are each a single bond, an ester bond, etc.; X&lt;sup&gt;L&lt;/sup&gt; is a single bond or a hydrocarbylene group; Q&lt;sup&gt;1&lt;/sup&gt; and Q&lt;sup&gt;2&lt;/sup&gt; are each a hydrogen atom, a fluorine atom, or a fluorinated saturated hydrocarbyl group; Q&lt;sup&gt;3&lt;/sup&gt; and Q&lt;sup&gt;4&lt;/sup&gt; are each a fluorine atom or a fluorinated saturated hydrocarbyl group; and Z&lt;sup&gt;+&lt;/sup&gt; is an onium cation. This can provide an onium-salt-type monomer that is excellent in solvent solubility, has high sensitivity and high contrast, is excellent in EL, LWR, CDU, and DOF, is resistant to pattern collapse, and is also excellent in etching resistance. &lt;br/&gt;&lt;img align="absmiddle" height="148px" width="453px" file="ed10266.JPG" alt="ed10266.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1316" publication-number="202615166">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615166</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129708</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>
        <english-title>SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B08B3/08</main-classification>
        <further-classification edition="200601120260102B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊豆田崇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IZUTA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木光敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, MITSUTOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関優介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之基板處理裝置1具備：步驟S2(浸漬過程)，其使將鉛直姿勢之基板W排列於水平方向而構成之基板行浸漬於硫酸中；步驟S3(提起過程)，其將基板行全體自硫酸中提起；及步驟S5(霧供給過程)，其對提起之基板行供給過氧化氫水霧。如此，僅將基板之正面附著之硫酸液膜SPM化。藉此，與先前相比，大幅抑制過氧化氫水之消耗量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate processing apparatus according to the present invention includes a step (immersing step) of immersing a substrate array that is a horizontal arrangement of vertically oriented substrates in sulfuric acid, a step (elevating step) of elevating an entirety of the substrate array from the sulfuric acid, and a step (mist supplying step) of supplying mist of hydrogen peroxide solution to the substrate array having been elevated. With this configuration, only the liquid sulfuric acid film attached to the surface of the substrate is turned into SPM. In this manner, much less hydrogen peroxide solution is consumed, as compared with that in a conventional method.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S11:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1317" publication-number="202615736">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615736</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129726</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>矽熔液對流模式控制方法、矽單晶之製造方法、矽熔液對流模式控制裝置、以及矽單晶製造裝置</chinese-title>
        <english-title>MOLTEN SILICON CONVECTION MODE CONTROL METHOD, SILICON SINGLE CRYSTAL MANUFACTURING METHOD, MOLTEN SILICON CONVECTION MODE CONTROL DEVICE, AND SILICON SINGLE CRYSTAL MANUFACTURING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251229B">C30B15/20</main-classification>
        <further-classification edition="200601120251229B">C30B29/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＳＵＭＣＯ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMCO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松島直輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUSHIMA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>横山竜介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOYAMA, RYUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種矽熔液對流模式控制方法，係為直體部的直徑為300mm以上的矽單晶的製造中使用的矽熔液對流模式控制方法，其中在藉由磁場施加裝置對由加熱器加熱的坩堝內的前述矽熔液施加水平磁場的狀態下，在正交於前述水平磁場的施加方向且包括前述坩堝的中心軸的磁場正交剖面的右側，形成左旋的第一對流，並且在左側形成右旋的第二對流。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A molten silicon convection mode control method is disclosed, which is used in manufacturing silicon single crystals with a diameter of 300mm or more in a cylindrical body portion. When a horizontal magnetic field is applied to the molten silicon in a crucible heated by a heater using a magnetic field application device, a first convection which is counterclockwise is formed on a right side of an orthogonal cross-section of the magnetic field and a second convection which is clockwise is formed on a left side. The orthogonal cross-section of the magnetic field is orthogonal to an application direction of the horizontal magnetic field, and includes a central axis of the crucible.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1,1A:矽單晶製造裝置</p>
        <p type="p">10:製造部</p>
        <p type="p">11:腔室</p>
        <p type="p">12:坩堝</p>
        <p type="p">13:加熱器</p>
        <p type="p">14:保溫筒</p>
        <p type="p">15:屏蔽罩</p>
        <p type="p">16:提拉部</p>
        <p type="p">17:溫度測量部</p>
        <p type="p">20,30:控制裝置</p>
        <p type="p">111:氣體導入口</p>
        <p type="p">112:排氣口</p>
        <p type="p">113:石英窗</p>
        <p type="p">121:石墨坩堝</p>
        <p type="p">122:石英坩堝</p>
        <p type="p">123:坩堝驅動部</p>
        <p type="p">124:支持軸</p>
        <p type="p">131:上部加熱器</p>
        <p type="p">132:下部加熱器</p>
        <p type="p">161:導線</p>
        <p type="p">171:反射部</p>
        <p type="p">172:放射溫度計</p>
        <p type="p">173:反射面</p>
        <p type="p">C1:第一對流</p>
        <p type="p">C2:第二對流</p>
        <p type="p">GC:中心磁力線</p>
        <p type="p">L:輻射光</p>
        <p type="p">M:矽熔液</p>
        <p type="p">P1:第一測量點</p>
        <p type="p">P2:第二測量點</p>
        <p type="p">SC:晶種</p>
        <p type="p">SM:矽單晶</p>
        <p type="p">SM1:直體部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1318" publication-number="202615642">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615642</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129757</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造電子裝置之水溶液、製造光阻圖案之方法及製造裝置之方法</chinese-title>
        <english-title>ELECTRONIC DEVICE MANUFACTURING AQUEOUS SOLUTION, METHOD FOR PRODUCING RESIST PATTERN, AND METHOD FOR MANUFACTURING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C11D3/20</main-classification>
        <further-classification edition="200601120260102B">C11D3/43</further-classification>
        <further-classification edition="200601120260102B">C11D7/26</further-classification>
        <further-classification edition="200601120260102B">C11D7/50</further-classification>
        <further-classification edition="200601120260102B">G03F7/40</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商默克專利有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCK PATENT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本和磨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, KAZUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　志越</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, ZHI YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]&lt;br/&gt;  提供一種可減少缺陷的製造電子裝置之水溶液。&lt;br/&gt;  [解決方案]&lt;br/&gt;  一種包含醇(A)、醇(B)及溶劑(S)的製造電子裝置之水溶液。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">[Problem]&lt;br/&gt; To provide an electronic device manufacturing aqueous solution that can reduce defects.&lt;br/&gt; [Solution]&lt;br/&gt; An electronic device manufacturing aqueous solution comprising an alcohol (A), an alcohol (B) and a solvent (S).</p>
      </isu-abst>
      <representative-img>
        <p type="p">θ:接觸角</p>
        <p type="p">D:壁間的間隙</p>
        <p type="p">H:壁高度</p>
        <p type="p">W:壁寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1319" publication-number="202616761">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616761</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129760</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種調度方法、系統及裝置</chinese-title>
        <english-title>A SCHEDULING METHOD, SYSTEM, AND DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251201B">H04W72/12</main-classification>
        <further-classification edition="202301120251201B">H04W72/04</further-classification>
        <further-classification edition="202301120251201B">H04W72/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商華為技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIU, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉雨晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YUQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊嶸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, RONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種調度方法、系統及裝置，用以提供一種可行的方式來避免空口的隨機退避衝突。該方法包括：控制節點接收N個網路節點分別上報的業務資訊，所述業務資訊用於指示網路節點需要通過通道傳輸的業務資料的資訊，所述N為正整數；所述控制節點根據所述N個網路節點分別上報的業務資訊，確定當前調度週期被調度的M個網路節點，所述M為正整數；所述控制節點向所述M個網路節點發送第一調度消息，所述第一調度消息用於指示允許所述M個網路節點競爭通道。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application discloses a scheduling method, system, and device, which provide a feasible way to avoid random backoff conflicts in the air interface. The method includes: a control node receiving service information reported by N network nodes respectively, where the service information is used to indicate the information of service data that the network nodes need to transmit through the channel, and N is a positive integer; the control node determines M network nodes to be scheduled in the current scheduling period based on the service information reported by the N network nodes respectively, where M is a positive integer; the control node sends a first scheduling message to the M network nodes, where the first scheduling message is used to indicate that the M network nodes are allowed to compete for the channel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">601、602、603、604:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1320" publication-number="202615003">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615003</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129763</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有SLC15A4抑制活性之化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/4188</main-classification>
        <further-classification edition="200601120260102B">A61K31/44</further-classification>
        <further-classification edition="200601120260102B">A61K31/35</further-classification>
        <further-classification edition="200601120260102B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商協和麒麟股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYOWA KIRIN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三浦祐輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIURA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江尾知也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBI, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊古田秀夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKOTA, HIDEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喜多村佳委</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAMURA, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本澤真麻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTOSAWA, MAASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>植田大樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEDA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前原知明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEHARA, TOMOAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大坪茂記</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUBO, SHIGEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種式(I)所表示之化合物或其藥學上容許之鹽。          &lt;img align="absmiddle" height="455px" width="397px" file="ed10048.JPG" alt="ed10048.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式中，所有符號表示與說明書中之符號相同含義)</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1321" publication-number="202615083">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615083</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129815</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>環肽類似物及其製備方法和用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K38/12</main-classification>
        <further-classification edition="200601120260102B">C07K11/02</further-classification>
        <further-classification edition="200601120260102B">A61P9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商石藥集團中奇製藥技術（石家莊）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CSPC ZHONGQI PHARMACEUTICAL TECHNOLOGY (SHIJIAZHUANG) CO.,LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙傳武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, CHUANWU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王琛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王礦磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, KUANGLEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊漢煜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HANYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>初燕燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, YANYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛嶺嶺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIN, LINGLING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭文敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, WENMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴曉玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAI, XIAOLING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于云鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, YUNPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋云龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, YUNLONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一類式（I）所示的化合物，或其立體異構體或其藥學上可接受的鹽。所述化合物具有治療與血脂異常有關的心血管疾病，能顯著拮抗受試者中的PCSK9的活性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1322" publication-number="202616018">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616018</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129823</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制系統、控制方法及控制程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G05B19/418</main-classification>
        <further-classification edition="200601120260102B">G05B19/406</further-classification>
        <further-classification edition="200601120260102B">G05B19/416</further-classification>
        <further-classification edition="200601120260102B">G05B23/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>峰村今朝明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINEMURA, KESAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤原浩一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIWARA, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">控制系統自對作為控制對象的設備的現實狀態進行檢測的感測器獲取表示該現實狀態的檢測資料，參照對如下輔助資訊，即包含設備的既定狀態和與該設備的運轉及該設備的性能的至少一者有關的管理參數的一個以上的對應關係的輔助資訊進行記憶的記憶裝置，對用以控制處於現實狀態的設備的管理參數進行確定，並基於所確定的管理參數來控制設備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:控制系統</p>
        <p type="p">2:感測器</p>
        <p type="p">3:設備</p>
        <p type="p">11:接收部</p>
        <p type="p">12:處理部</p>
        <p type="p">13:確定部</p>
        <p type="p">14:控制部</p>
        <p type="p">101:處理器</p>
        <p type="p">102:記憶裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1323" publication-number="202616768">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616768</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129844</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多跳UE到網路中繼連接之中繼重選方法、架構、裝置及系統</chinese-title>
        <english-title>METHODS, ARCHITECTURES, APPARATUSES AND SYSTEMS FOR RELAY RESELECTION FOR MULTIHOP UE-TO-NETWORK RELAY CONNECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260102B">H04W88/04</main-classification>
        <further-classification edition="200901120260102B">H04W40/22</further-classification>
        <further-classification edition="200901120260102B">H04W84/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商內數位專利控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERDIGITAL PATENT HOLDINGS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫仲濟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SON, JUNG JE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿巴斯　泰穆爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABBAS, TAIMOOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛迪　沙米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FERDI, SAMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於無線通訊網路中的中繼重選的程序、方法、架構、設備、系統、裝置、及電腦程式產品。遠端使用者設備(UE)可經由一或更多中間中繼及UE到網路(U2N)中繼建立與網路的多跳連接。當觸發中繼重選時，中間中繼或U2N中繼可檢查是否存在用於該遠端UE的現有連接（例如，是否存在用於訊務轉發的映射）。例如，該中間中繼可決定重用至U2N中繼的現有連接，以用於通往遠端UE的新路徑。可將該遠端UE的IP位址傳訊至沿新路徑的其他中間中繼。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Procedures, methods, architectures, apparatuses, systems, devices, and computer program products for relay reselection in a wireless communication network. A remote user equipment (UE) may establish a multihop connection to a network via one or more intermediate relays and a UE-to-network (U2N) relay. When relay reselection is triggered, an intermediate relay or the U2N relay may check whether there is an existing connection (e.g., a mapping for traffic forwarding exists) for the remote UE. For example, the intermediate relay may decide to reuse the existing connection to the U2N relay for a new path to the remote UE. An IP address of the remote UE may be signaled to other intermediate relays along the new path.</p>
      </isu-abst>
      <representative-img>
        <p type="p">702、704、706、708、710、712:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1324" publication-number="202615967">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615967</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129850</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具透明視窗之光罩盒及其製造方法</chinese-title>
        <english-title>RETICLE POD HAVING TRANSPARENT WINDOW AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120251104B">G03F1/66</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>家登精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUDENG PRECISION INDUSTRIAL CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱銘乾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, MING-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡瑞瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, JUI-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛新民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSUEH, HSIN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊家和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, CHIA-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳舟偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHOU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳慧玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具透明視窗之光罩盒及其製造方法，光罩盒包括相互配合之第一殼體及第二殼體、透明視窗件，以及熱塑性密封材。第一殼體及第二殼體兩者間界定出用以容置光罩之容置空間，第一殼體具有穿透其之窗口，用以暴露出光罩。透明視窗件設置於窗口，用以供光線穿透過而抵達光罩。熱塑性密封材位於第一殼體與透明視窗件之間，且圍繞於透明視窗件，用以將透明視窗件氣密接合於第一殼體上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A reticle pod having a transparent window and a manufacturing method thereof are disclosed. The reticle pod includes a first housing, a second housing, a transparent window member, and a thermoplastic sealing material. The first housing is configured to mate with the second housing and the two define an accommodation space for receiving a reticle. The first housing includes a window formed therethrough for exposing the reticle. The transparent window member is disposed at the window to allow a light to pass through and reach the reticle. The thermoplastic sealing material is disposed between the first housing and the transparent window member and surrounds the transparent window member, so as to air-tightly join the transparent window member to the first housing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光罩盒</p>
        <p type="p">110:第一殼體</p>
        <p type="p">110a:窗口</p>
        <p type="p">120:第二殼體</p>
        <p type="p">113:內側壁</p>
        <p type="p">115:凸緣</p>
        <p type="p">150:透明視窗件</p>
        <p type="p">160:熱塑性密封材</p>
        <p type="p">R:光罩</p>
        <p type="p">X:方向</p>
        <p type="p">Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1325" publication-number="202616594">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616594</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129892</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光源裝置以及檢查裝置</chinese-title>
        <english-title>LIGHT SOURCE APPARATUS AND INSPECTION APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01S5/024</main-classification>
        <further-classification edition="202301120260102B">H10N59/00</further-classification>
        <further-classification edition="200601120260102B">G01N21/956</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤本力夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMOTO, RIKIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">光源裝置3係具備：雷射二極體封裝31，係內置有雷射二極體晶片311；保持單元32，係具有內部流路321，並以雷射二極體封裝31的一部分露出於內部流路321之方式保持雷射二極體封裝31，且於與雷射二極體封裝31的出射面310對向的位置設置有開口部331；以及氣體供給部39，係對內部流路321供給冷卻氣體。藉此，能以簡單的構成冷卻雷射二極體封裝31。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light source apparatus 3 includes an LD package 31 having a laser diode chip 311 therein, a holding unit 32 having an internal flow path 321 and an opening 331, and holding the LD package 31 such that a part of the LD package 31 is exposed to the internal flow path 321, the opening 331 being provided at a position facing an emission surface 310 of the LD package 31, and a gas supply part 39 that supplies a cooling gas to the internal flow path 321. This makes it possible to cool the LD package 31 with a simple configuration.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:光源裝置</p>
        <p type="p">31:LD封裝(雷射二極體封裝)</p>
        <p type="p">32:保持單元</p>
        <p type="p">33:蓋部</p>
        <p type="p">34:保持部</p>
        <p type="p">35:第一構件</p>
        <p type="p">36:第二構件</p>
        <p type="p">37:固定部</p>
        <p type="p">39:氣體供給部</p>
        <p type="p">310:出射面</p>
        <p type="p">311:LD晶片(雷射二極體晶片)</p>
        <p type="p">312:帽蓋部</p>
        <p type="p">313:基座部</p>
        <p type="p">321:內部流路</p>
        <p type="p">322:連接口</p>
        <p type="p">331:開口部</p>
        <p type="p">332:凹部</p>
        <p type="p">359:孔部</p>
        <p type="p">351:保持部</p>
        <p type="p">352:對向面</p>
        <p type="p">353:溝槽部</p>
        <p type="p">371:固定構件</p>
        <p type="p">381:連接端子</p>
        <p type="p">391:氣塞</p>
        <p type="p">J2:光軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1326" publication-number="202615849">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615849</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129894</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>拍攝裝置</chinese-title>
        <english-title>IMAGING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G01N21/88</main-classification>
        <further-classification edition="202101120260102B">G03B15/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水田靖生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUTA, YASUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤本力夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMOTO, RIKIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">拍攝裝置2的第一照明部3係配置於與印刷基板9上的拍攝區域90垂直的光軸J1上，並具有照明部本體31，照明部本體31係形成有用以覆蓋拍攝區域90之圓頂狀的內表面311且於與光軸J1相交的該內表面311上的位置設置有開口部310，第一照明部3係從該內表面311對拍攝區域90照射第一照明光。第二照明部4係相對於照明部本體31配置於與印刷基板9相反側，並將第二照明光經由開口部310照射至拍攝區域90。在照明部本體31中，第二照明部4之側的面為與光軸J1垂直的支撐面316；在光軸J1的方向中，支撐面316係與內表面311中的三維曲面區域313重疊。第二照明部41、分光器43以及光學系統42係固定於支撐面316。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A first illumination part 3 of an imaging apparatus 2 is disposed on an optical axis J1 perpendicular to an imaging area 90 on a printed substrate 9, includes an illumination part main body 31 having a dome-shaped inner surface 311 covering the imaging area 90 and an opening 310 at a position on the inner surface 311 intersecting with the optical axis J1, and irradiates the imaging area 90 with a first illumination light from the inner surface 311. A second illumination part 4 is disposed on a side opposite to the printed substrate 9 with respect to the illumination part main body 31, and irradiates the imaging area 90 with a second illumination light through the opening 310. In the illumination part main body 31, a surface on the second illumination part 4 side is a support surface 316 perpendicular to the optical axis J1, and the support surface 316 overlaps with a three-dimensional curved surface area 313 on the inner surface 311 in the direction of the optical axis J1. A light source part 41, a beam splitter 43, and an optical system 42 of the second illumination part 4 are fixed to the support surface 316.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:檢查裝置</p>
        <p type="p">2:拍攝裝置</p>
        <p type="p">3:第一照明部</p>
        <p type="p">4:第二照明部</p>
        <p type="p">7:拍攝部</p>
        <p type="p">9:印刷基板</p>
        <p type="p">10:電腦</p>
        <p type="p">11:檢查部</p>
        <p type="p">21:台</p>
        <p type="p">22:台移動機構</p>
        <p type="p">32:光源部</p>
        <p type="p">33:環狀底面部</p>
        <p type="p">34:冷卻構造</p>
        <p type="p">35:環狀流路</p>
        <p type="p">41:(第二照明部的)光源部</p>
        <p type="p">42:(第二照明部的)光學系統</p>
        <p type="p">43:分光器</p>
        <p type="p">44:鏡膜</p>
        <p type="p">51:支撐構件</p>
        <p type="p">71:拍攝元件</p>
        <p type="p">72:拍攝光學系統</p>
        <p type="p">73:鏡筒</p>
        <p type="p">90:拍攝區域</p>
        <p type="p">310:開口部</p>
        <p type="p">311:圓頂內表面</p>
        <p type="p">312:平坦區域</p>
        <p type="p">313:三維曲面區域</p>
        <p type="p">321:(第一照明部的)光源</p>
        <p type="p">342:散熱座</p>
        <p type="p">351:環狀板部</p>
        <p type="p">352:圓筒部</p>
        <p type="p">421:(第二照明部的)光學元件</p>
        <p type="p">431,432:側面</p>
        <p type="p">J1:光軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1327" publication-number="202616406">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616406</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129905</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>外觀檢查裝置及外觀檢查方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251225B">H01L21/66</main-classification>
        <further-classification edition="200601120251225B">G01N21/956</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY ENGINEERING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東實先進股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TASMIT, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小池豊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOIKE, YUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大美英一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHMI, HIDEKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卜部直輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>URABE, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種能夠抑制在藉由切割而形成之元件晶片產生缺陷於未然之外觀檢查裝置。  &lt;br/&gt;於該外觀檢查裝置100中，控制部41進行如下控制：於攝像圖像50中，將缺陷候選213中之以外周線L1為基點、未到達缺陷判定線L2、且到達設定於外周線L1與缺陷判定線L2之間之崩刃判定線L3的缺陷候選213，判定為係用於解析之解析用崩刃(更換時序判斷用崩刃213c)，且報知解析用崩刃之檢測結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">44:顯示部</p>
        <p type="p">61:熱圖</p>
        <p type="p">62:直方圖</p>
        <p type="p">200:被檢查單元</p>
        <p type="p">211:元件晶片</p>
        <p type="p">DL:切割線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1328" publication-number="202615658">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615658</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129913</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於嚴重發熱伴血小板減少症候群病毒的處理之核酸、以及標靶分子與前述核酸的複合體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260102B">C12N15/113</main-classification>
        <further-classification edition="200601120260102B">A61K31/7088</further-classification>
        <further-classification edition="200601120260102B">A61P31/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商領先基因生物技術股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENAHEAD BIO, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立健康危機管理研究機構</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN INSTITUTE FOR HEALTH SECURITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白砂圭崇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRASAGO, YOSHITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周郷司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGO, TSUKASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水上智晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUKAMI, TOMOHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>深澤征義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKASAWA, MASAYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示關於對嚴重發熱伴血小板減少症候群病毒（SFTSV）的減弱型核酸、以及該核酸與抗體之複合體。減弱型核酸可於細胞內減弱（knockdown）SFTSV的RNA基因組。減弱型核酸對SFTSV可具有抗病毒作用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1329" publication-number="202615251">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615251</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129916</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含石墨烯積層體</chinese-title>
        <english-title>A GRAPHENE-CONTAINING LAMINATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B32B9/00</main-classification>
        <further-classification edition="201901120260102B">B32B7/02</further-classification>
        <further-classification edition="200601120260102B">C23C14/06</further-classification>
        <further-classification edition="200601120260102B">C23C14/08</further-classification>
        <further-classification edition="200601120260102B">C23C14/24</further-classification>
        <further-classification edition="200601120260102B">C23C14/54</further-classification>
        <further-classification edition="200601120260102B">C23C16/26</further-classification>
        <further-classification edition="200601120260102B">C23C16/34</further-classification>
        <further-classification edition="200601120260102B">C23C16/40</further-classification>
        <further-classification edition="200601120260102B">C23C16/455</further-classification>
        <further-classification edition="200601120260102B">C23C16/52</further-classification>
        <further-classification edition="200601120260102B">C23C28/04</further-classification>
        <further-classification edition="200601120260102B">G01R33/00</further-classification>
        <further-classification edition="200601120260102B">G01R33/07</further-classification>
        <further-classification edition="202501120260102B">H10D30/00</further-classification>
        <further-classification edition="202501120260102B">H10D62/80</further-classification>
        <further-classification edition="202501120260102B">H10D62/83</further-classification>
        <further-classification edition="202301120260102B">H10N52/00</further-classification>
        <further-classification edition="202301120260102B">H10N52/80</further-classification>
        <further-classification edition="202301120260102B">H10N52/85</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商佩拉葛拉夫有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARAGRAF LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格拉斯　休佛瑞德瑞克約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLASS, HUGH FREDERICK JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱因特　潔思普莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAINTH, JASPREET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科爾曼　麗貝卡路易絲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COLEMAN, REBECCA LOUISE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉格福爾　札卡里亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAGHFOUR, ZAKARIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種含石墨烯積層體(100)，該含石墨烯積層體包含：基板(105)；在該基板(105)上之石墨烯層結構(110)；在該石墨烯層結構(110)上之保形障壁層(115)，其中該障壁層(115)是介電金屬氧化物或氮化矽，且具有至少3 nm之第一厚度；及在該障壁層(115)上之摻雜劑層(120)，其中該摻雜劑層(120)是由以下中之一或多者形成：氧化釩、氧化鈮、氧化鉭、氧化鉻、氧化鉬、氧化鎢及氧化鎳；其中該摻雜劑層(120)具有第二厚度，且該第一厚度與該第二厚度之比率是1:1至1:10。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is provided a graphene-containing laminate (100) comprising: a substrate (105); a graphene layer structure (110) on the substrate (105); a conformal barrier layer (115) on the graphene layer structure (110), wherein the barrier layer (115) is a dielectric metal oxide or silicon nitride, and has a first thickness which is at least 3 nm; and a dopant layer (120) on the barrier layer (115), wherein the dopant layer (120) is formed of one or more of vanadium oxide, niobium oxide, tantalum oxide, chromium oxide, molybdenum oxide, tungsten oxide, and nickel oxide; wherein the dopant layer (120) has a second thickness, and a ratio of the first thickness to the second thickness is from 1:1 to 1:10.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:含石墨烯積層體、積層體</p>
        <p type="p">105:基板</p>
        <p type="p">110:石墨烯單層</p>
        <p type="p">115:障壁層</p>
        <p type="p">120:摻雜劑層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1330" publication-number="202616451">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616451</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129923</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有自動定位系統的晶圓載具</chinese-title>
        <english-title>WAFER CARRIER WITH AUTOMATION POSITIONING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/677</main-classification>
        <further-classification edition="200601120260102B">H01L21/673</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾布德　穆托利布　穆罕默德　扎卡利亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABD MUTHOLIB, MOHAMAD ZAKARIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　欣潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, SIN GHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　漢欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, HANG KHIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基板載具包含一基座及一架匣，其中該架匣固定至該基座。該架匣可與該基座一體形成、使用緊固件附接至該基座、藉由一機械界面附接至該基座或者以其他方式進行附接。該基座包含經構形以接納用於搬運該基板載具之自動裝置上之對準特徵的特徵。經構形以接納該等對準特徵之該等特徵可係三個通道。該基板載具可包含於具有一盒罩(pod dome)之一基板容器中，該盒罩經構形以接納該基座，進而圍封一敞口端，該基座係該基板容器之一盒門。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate carrier includes a base and a cassette, where the cassette is fixed to the base. The cassette can formed integrally with the base, attached to the base using fasteners, attached to the base through a mechanical interface or otherwise attached. The base includes features configured to receive alignment features on automation for handling the substrate carrier. The features configured to receive the alignment features can be three channels. The substrate carrier can be included in a substrate container having a pod dome configured to receive the base to enclose an open end, the base being a pod door of the substrate container.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板容器/容器</p>
        <p type="p">102:盒罩</p>
        <p type="p">104:基板載具</p>
        <p type="p">106:盒門</p>
        <p type="p">108:架匣</p>
        <p type="p">110:緊固件</p>
        <p type="p">112:第一側壁</p>
        <p type="p">114:第二側壁</p>
        <p type="p">116:頂部壁</p>
        <p type="p">118:基板支撐件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1331" publication-number="202614921">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614921</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129973</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有經修飾免疫球蛋白重鏈恆定區基因座之非人類動物及其用途</chinese-title>
        <english-title>NON-HUMAN ANIMALS HAVING MODIFIED IMMUNOGLOBULIN HEAVY CHAIN CONSTANT REGION LOCUS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260102B">A01K67/027</main-classification>
        <further-classification edition="200601120260102B">C12N15/13</further-classification>
        <further-classification edition="200601120260102B">C07K16/00</further-classification>
        <further-classification edition="200601120260102B">A61K49/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商再生元醫藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REGENERON PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克惠特　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCWHIRTER, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭春光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, CHUNGUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克唐納　琳恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACDONALD, LYNN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>墨菲　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURPHY, ANDREW J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供非人類動物(及/或非人類細胞)及其使用方法，該等非人類動物(及/或非人類細胞)具有包含人類抗體編碼序列(亦即免疫球蛋白基因)之基因體。本文所述之非人類動物表現具有IgA、IgD或IgM同型之抗體。在一些實施例中，本文所提供之非人類動物之特徵在於含有人類重鏈及輕鏈可變結構域及囓齒類動物恆定結構域之IgA抗體之表現。本發明亦提供用於自非人類動物產生抗體之方法，該等抗體含有人類可變區及囓齒類動物恆定區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Non-human animals (and/or non-human cells) and methods of using the same are provided, which non-human animals (and/or non-human cells) have a genome comprising human antibody-encoding sequences (i.e., immunoglobulin genes). Non-human animals described herein express antibodies that are of IgA, IgD, or IgM isotypes. Non-human animals provided herein are, in some embodiments, characterized by expression of IgA antibodies that contain human heavy chain and light chain variable domains and rodent constant domains. Methods for producing antibodies from non-human animals are also provided, which antibodies contain human variable regions and rodent constant regions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1332" publication-number="202616934">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616934</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130015</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置及包含其之電子裝置</chinese-title>
        <english-title>DISPLAY DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">H10K59/122</main-classification>
        <further-classification edition="202301120260102B">H10K59/12</further-classification>
        <further-classification edition="202301120260102B">H10K59/131</further-classification>
        <further-classification edition="202301120260102B">H10K59/80</further-classification>
        <further-classification edition="202301120260102B">H10K50/805</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星顯示器有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴注燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JUCHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金善浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高裕敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, YOOMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李弼錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, PILSUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔忠碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, CHUNG SOCK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置，包含：一基板，該基板包含一顯示區域，及與該顯示區域相鄰的一周邊區域；一第一電極，布置在該基板上的該顯示區域內；一輔助電極，布置在該基板上的該顯示區域內，並與該第一電極分隔開；一像素定義層，布置在該基板上，並界定一開口以暴露該第一電極；一電極層，布置在該第一電極上，並電性連接至該輔助電極；一分隔件，布置在該像素定義層上，並在該顯示區域中將該電極層分隔成彼此分隔開的第二電極；以及一有機膜圖案，布置在該顯示區域及該周邊區域中的該像素定義層及該分隔件之間，並且在該顯示區域及該周邊區域的一平面圖中，該有機膜圖案與該分隔件的至少一部分重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device includes a substrate including a display area and a peripheral area adjacent to the display area, a first electrode arranged in the display area on the substrate, an auxiliary electrode arranged in the display area on the substrate and spaced apart from the first electrode, a pixel defining layer arranged on the substrate and defining an opening which exposes the first electrode, an electrode layer arranged on the first electrode and electrically connected to the auxiliary electrode, a separator arranged on the pixel defining layer and separating the electrode layer into second electrodes spaced apart from each other in the display area, and an organic film pattern arranged between the pixel defining layer and the separator in the display area and in the peripheral area and overlapping at least a portion of the separator in a plan view in the display area and in the peripheral area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">ACE:陽極連接電極</p>
        <p type="p">AP1:第一主動圖案</p>
        <p type="p">AUE:輔助電極</p>
        <p type="p">BML1:第一底部導電層</p>
        <p type="p">BML2:第二底部導電層</p>
        <p type="p">CAa:第一輔助電極連接部分</p>
        <p type="p">CAP1:第一電容器</p>
        <p type="p">CAP2:第二電容器</p>
        <p type="p">CCEa:第一輔助連接電極</p>
        <p type="p">CH1:第一通道區域</p>
        <p type="p">CL1:第一導電層</p>
        <p type="p">CL1-S:側表面</p>
        <p type="p">CL2:第二導電層</p>
        <p type="p">CL2-S:側表面</p>
        <p type="p">CL3:第三導電層</p>
        <p type="p">CL3-S:側表面</p>
        <p type="p">CNa:第一發光連接部分</p>
        <p type="p">CNT:接觸孔</p>
        <p type="p">CPE1:第一電容器電極</p>
        <p type="p">CPE2:第二電容器電極</p>
        <p type="p">CPE3:第三電容器電極</p>
        <p type="p">D1:第二接觸區域</p>
        <p type="p">DA:顯示區域</p>
        <p type="p">DD1:顯示裝置</p>
        <p type="p">DE1:第二接觸電極</p>
        <p type="p">DP1:第一虛設層</p>
        <p type="p">DP2:第二虛設層</p>
        <p type="p">DR1:第一方向</p>
        <p type="p">DR2:第二方向</p>
        <p type="p">E1:第一電極</p>
        <p type="p">E2:第二電極</p>
        <p type="p">E2L:電極層</p>
        <p type="p">EAa:第一發射區域</p>
        <p type="p">ENC:封裝層</p>
        <p type="p">GE1:第一閘極電極</p>
        <p type="p">LDa:第一發光元件</p>
        <p type="p">IEL1:第一無機封裝層</p>
        <p type="p">IEL2:第二無機封裝層</p>
        <p type="p">IL1:第一絕緣層</p>
        <p type="p">IL2:第二絕緣層</p>
        <p type="p">IL3:第三絕緣層</p>
        <p type="p">IL4:第四絕緣層</p>
        <p type="p">IL5:第五絕緣層</p>
        <p type="p">IL6:第六絕緣層</p>
        <p type="p">ML:中間層</p>
        <p type="p">OEL:有機封裝層</p>
        <p type="p">OGP:有機膜圖案</p>
        <p type="p">OP:子開口</p>
        <p type="p">PDL:像素定義層</p>
        <p type="p">S1:第一接觸區域</p>
        <p type="p">SE1:第一接觸電極</p>
        <p type="p">SO1:第一子開口</p>
        <p type="p">SO2:第二子開口</p>
        <p type="p">SPP1:第一部分</p>
        <p type="p">SPP2:第二部分</p>
        <p type="p">SPR:分隔件</p>
        <p type="p">SUB:基板</p>
        <p type="p">TR1:第一電晶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1333" publication-number="202616043">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616043</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130017</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有通訊界面之系統及其重啟方法</chinese-title>
        <english-title>SYSTEM WITH A COMMUNICATION INTERFACE AND A RESTART METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G06F1/24</main-classification>
        <further-classification edition="200601120260102B">G06F13/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商光程研創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARTILUX, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許凱琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, KAI-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁哲夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, CHE-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊億</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種用於使一主裝置經由一通訊介面重啟一副裝置之範例方法。副裝置包括一暫存器對應表。方法包括由主裝置經由通訊介面在副裝置執行對暫存器對應表中一預設位址之寫入交易。所述方法包括由主裝置經由通訊介面對副裝置執行讀取交易，以連續讀取暫存器對應表中之一預設暫存器群，使副裝置對預設暫存器群完成連續讀取後重啟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An example method for a primary device to restart a secondary device through a communication interface. The secondary device includes a register table. The method includes performing, by the primary device and through the communication interface, a write transaction on the secondary device for a predetermined address in the register table. The method includes performing, by the primary device and through the communication interface, a read transaction on the secondary device for continuously reading a predetermined register group in the register table to cause the secondary device to restart after completing the continuous reading of the predetermined register group.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:方法</p>
        <p type="p">S41:步驟</p>
        <p type="p">S43:步驟</p>
        <p type="p">S45:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1334" publication-number="202616265">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616265</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130038</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於減輕計算裝置中由於該計算裝置之揚聲器至該計算裝置之部分的機械耦接而引起之機械咔嗒聲的系統、用於減輕主機裝置中由於該主機裝置之揚聲器至該主機裝置之部分的機械耦接而引起之機械咔嗒聲的系統、用於減輕主機裝置中由於該計算裝置之揚聲器至該計算裝置之部分的機械耦接而引起之機械咔嗒聲的系統、積體電路，及主機裝置</chinese-title>
        <english-title>A SYSTEM FOR MITIGATING MECHANICAL RATTLE IN A COMPUTING DEVICE ARISING DUE TO A MECHANICAL COUPLING OF A SPEAKER OF THE COMPUTING DEVICE TO A PART OF THE COMPUTING DEVICE, A SYSTEM FOR MITIGATING MECHANICAL RATTLE IN A HOST DEVICE ARISING DUE TO A MECHANICAL COUPLING OF A SPEAKER OF THE HOST DEVICE TO A PART OF THE HOST DEVICE, A SYSTEM FOR MITIGATING MECHANICAL RATTLE IN A HOST DEVICE ARISING DUE TO A MECHANICAL COUPLING OF A SPEAKER OF THE COMPUTING DEVICE TO A PART OF THE COMPUTING DEVICE, AN INTEGRATED CIRCUIT, AND A HOST DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">G10K11/178</main-classification>
        <further-classification edition="201301120251201B">G10L21/0208</further-classification>
        <further-classification edition="200601120251201B">G06F3/16</further-classification>
        <further-classification edition="200601120251201B">H04R3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商思睿邏輯國際半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CIRRUS LOGIC INTERNATIONAL SEMICONDUCTOR LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧爾德森　傑弗瑞　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALDERSON, JEFFREY D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾法沃　庫爾特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EFAW, KURT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茲韋爾內曼　布拉德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZWERNEMANN, BRAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃克倫德　喬恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EKLUND, JON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於減輕一計算裝置中由於該計算裝置之一揚聲器至該計算裝置之一部分的一機械耦接而引起之機械咔嗒聲的系統，其中該計算裝置包含一處理子系統，該處理子系統包含被配置為執行作業系統軟體及一軟體應用程式的一或多個處理器，該系統包含一咔嗒聲減輕子系統，操作該咔嗒聲減輕子系統以施加一衰減函數來衰減輸出至該揚聲器之一音訊信號的一分量，其中該咔嗒聲減輕子系統被配置為自該計算裝置接收該計算裝置之一操作參數的一指示，且基於所接收之該指示來調整該衰減函數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for mitigating mechanical rattle in a computing device arising due to a mechanical coupling of a speaker of the computing device to a part of the computing device, wherein the computing device comprises a processing subsystem comprising one or more processors configured to execute operating system software and a software application, the system comprising: a rattle mitigation subsystem operative to apply an attenuation function to attenuate a component of an audio signal output to the speaker, wherein the rattle mitigation subsystem is configured to receive, from the computing device, an indication of an operational parameter of the computing device, and to adjust the attenuation function based on the received indication.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:音訊輸出換能器</p>
        <p type="p">120:音訊系統</p>
        <p type="p">200:主機裝置</p>
        <p type="p">210:處理子系統</p>
        <p type="p">212:作業系統軟體</p>
        <p type="p">214:軟體應用程式</p>
        <p type="p">230:機械咔嗒聲減輕子系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1335" publication-number="202615407">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615407</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130046</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鋶鹽型單體、聚合物、化學增幅阻劑組成物及圖案形成方法</chinese-title>
        <english-title>SULFONIUM SALT TYPE MONOMER, POLYMER, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERN FORMING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C309/12</main-classification>
        <further-classification edition="200601120260102B">C07C309/17</further-classification>
        <further-classification edition="200601120260102B">C07C309/73</further-classification>
        <further-classification edition="200601120260102B">C07C381/12</further-classification>
        <further-classification edition="200601120260102B">C07D327/08</further-classification>
        <further-classification edition="200601120260102B">C07D333/54</further-classification>
        <further-classification edition="200601120260102B">C07D333/76</further-classification>
        <further-classification edition="200601120260102B">C09K3/00</further-classification>
        <further-classification edition="200601120260102B">C08F212/14</further-classification>
        <further-classification edition="200601120260102B">C08F212/32</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係在使用高能射線之光微影時，提供溶劑溶解性優良，為高感度、高對比度，且EL、LWR、CDU、DOF等微影性能優良之化學增幅阻劑組成物中使用之鋶鹽型單體、含有來自該鋶鹽型單體之重複單元之聚合物、含有該聚合物之化學增幅阻劑組成物、及使用該化學增幅阻劑組成物之圖案形成方法。  &lt;br/&gt;本發明之解決手段係下式(A)表示之鋶鹽型單體。  &lt;br/&gt;&lt;img align="absmiddle" height="124px" width="417px" file="ed10370.JPG" alt="ed10370.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sulfonium salt type monomer having the following formula (A). &lt;br/&gt;&lt;img align="absmiddle" height="116px" width="423px" file="ed10371.JPG" alt="ed10371.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1336" publication-number="202615398">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615398</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130061</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鎓鹽、化學增幅阻劑組成物及圖案形成方法</chinese-title>
        <english-title>ONIUM SALT, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERN FORMING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C63/70</main-classification>
        <further-classification edition="200601120260102B">C07C65/05</further-classification>
        <further-classification edition="200601120260102B">C07C65/21</further-classification>
        <further-classification edition="200601120260102B">C07C69/80</further-classification>
        <further-classification edition="200601120260102B">C07C323/62</further-classification>
        <further-classification edition="200601120260102B">C07C381/12</further-classification>
        <further-classification edition="200601120260102B">C07D307/12</further-classification>
        <further-classification edition="200601120260102B">C07D327/08</further-classification>
        <further-classification edition="200601120260102B">C07D333/76</further-classification>
        <further-classification edition="200601120260102B">C09K3/00</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供在使用高能射線之光微影中，為高感度，解析度優良，改善EL、LWR、CDU、DOF等微影性能，且可抑制阻劑圖案之崩塌的化學增幅阻劑組成物所使用的新穎鎓鹽、化學增幅阻劑組成物及圖案形成方法。  &lt;br/&gt;該課題之解決手段為一種鎓鹽，係由下式(1A)表示之陽離子及下式(1B)表示之陰離子構成。  &lt;br/&gt;&lt;img align="absmiddle" height="255px" width="435px" file="ed10400.JPG" alt="ed10400.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An onium salt comprising a cation having the following formula (1A) and an anion having the following formula (1B). &lt;br/&gt;&lt;img align="absmiddle" height="315px" width="431px" file="ed10401.JPG" alt="ed10401.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1337" publication-number="202615263">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615263</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130069</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>懸吊裝置及具備其之跨坐型車輛</chinese-title>
        <english-title>SUSPENSION DEVICE AND STRADDLED VEHICLE HAVING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251121B">B60G15/02</main-classification>
        <further-classification edition="200601120251121B">B60G17/02</further-classification>
        <further-classification edition="200601120251121B">B60M1/234</further-classification>
        <further-classification edition="200601120251121B">B62K25/02</further-classification>
        <further-classification edition="200601120251121B">B62K25/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商山葉發動機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAHA HATSUDOKI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋啓介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之懸吊裝置(1)具備：汽缸(10)；活塞桿(20)；彈簧(30)；彈簧座(43)，其支持彈簧(30)之第1端部(31)；止動部(13)，其向汽缸(10)之徑向外側突出；及調整器(50)，其支持彈簧(30)之第2端部(32)並且被止動部(13)支持，且能夠相對於汽缸(10)旋轉。調整器(50)具備：彈簧片(60)，其具有各自於汽缸(10)之軸向之位置不同且與止動部(13)卡合之複數個凸輪面(66)；及握把(70)，其與彈簧片(60)一起旋轉，且具有供作業人員之手抓握之抓握面(70a)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A suspension device &lt;b&gt;(1)&lt;/b&gt; includes a cylinder &lt;b&gt;(10)&lt;/b&gt;, a piston rod &lt;b&gt;(20)&lt;/b&gt;, a spring &lt;b&gt;(30)&lt;/b&gt;, a spring bearing &lt;b&gt;(43)&lt;/b&gt; supporting a first end &lt;b&gt;(31)&lt;/b&gt; of the spring &lt;b&gt;(30)&lt;/b&gt;, a stopper &lt;b&gt;(13)&lt;/b&gt; projecting outward in a radial direction of the cylinder &lt;b&gt;(10)&lt;/b&gt;, and an adjuster &lt;b&gt;(50)&lt;/b&gt; supporting a second end &lt;b&gt;(32)&lt;/b&gt; of the spring &lt;b&gt;(30)&lt;/b&gt; and being supported by the stopper &lt;b&gt;(13)&lt;/b&gt;, the adjuster &lt;b&gt;(50)&lt;/b&gt; being rotatable relative to the cylinder &lt;b&gt;(10)&lt;/b&gt;. The adjuster &lt;b&gt;(50)&lt;/b&gt; includes a spring seat &lt;b&gt;(60)&lt;/b&gt; having a plurality of cam surfaces &lt;b&gt;(66)&lt;/b&gt;, each having a different position in the axial direction of the cylinder &lt;b&gt;(10)&lt;/b&gt; and being engaged with the stopper &lt;b&gt;(13)&lt;/b&gt;, and a grip &lt;b&gt;(70)&lt;/b&gt; that rotates together with the spring seat &lt;b&gt;(60)&lt;/b&gt; and has a gripping surface &lt;b&gt;(70a)&lt;/b&gt; to be gripped by a hand of an operator.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:懸吊裝置</p>
        <p type="p">10:汽缸</p>
        <p type="p">13:止動部</p>
        <p type="p">20:活塞桿</p>
        <p type="p">30:彈簧</p>
        <p type="p">31:第1端部</p>
        <p type="p">32:第2端部</p>
        <p type="p">40:桿蓋</p>
        <p type="p">41:托架</p>
        <p type="p">43:彈簧座</p>
        <p type="p">44:彈簧導件</p>
        <p type="p">50:調整器</p>
        <p type="p">60:彈簧片</p>
        <p type="p">70:握把</p>
        <p type="p">76:防滑部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1338" publication-number="202616672">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616672</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130080</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於解碼量子錯誤更正碼之校驗子之方法、裝置及系統</chinese-title>
        <english-title>METHODS, DEVICES, AND SYSTEMS FOR DECODING SYNDROME OF QUANTUM ERROR CORRECTION CODES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H03M13/11</main-classification>
        <further-classification edition="202201120260102B">G06N10/70</further-classification>
        <further-classification edition="202201120260102B">G06N10/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商光子公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHOTONIC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錢德拉　達柳斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANDRA, DARYUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格勞戴爾　安德魯　諾貝爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLAUDELL, ANDREW NOBLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一種用於解碼一QEC碼之一校驗子之方法中，獲得該QEC碼之一校驗子及複數個變換對。各變換對包括一第一變換及一第二變換。將各變換對應用於該QEC碼之一同位檢查矩陣使該同位檢查矩陣保持不變。對於各變換對，將該第一變換應用於該校驗子以獲得一經變換校驗子，且基於該經變換校驗子及該同位檢查矩陣來判定一錯誤估計。針對該等錯誤估計之至少一者基於該第二變換及該錯誤估計來判定一經置換錯誤估計。基於該複數個變換對之該等經置換錯誤估計來判定與該校驗子相關聯之一錯誤。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In a method for decoding a syndrome of a QEC code, a syndrome of the QEC code and a plurality of transformation pairs are obtained. Each transformation pair comprises a first transformation and a second transformation. Applying each transformation pair to a parity check matrix of the QEC code leaves the parity check matrix invariant. For each transformation pair, the first transformation is applied to the syndrome to obtain a transformed syndrome, and an error estimate is determined based on the transformed syndrome and the parity-check matrix. A permuted error estimate is determined for at least one of the error estimates based on the second transformation and the error estimate. An error associated with the syndrome is determined based on the permuted error estimates of the plurality of transformation pairs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101:步驟</p>
        <p type="p">S102:步驟</p>
        <p type="p">S103:步驟</p>
        <p type="p">S104:步驟</p>
        <p type="p">S105:步驟</p>
        <p type="p">S106:步驟</p>
        <p type="p">S107:步驟</p>
        <p type="p">S108:步驟</p>
        <p type="p">S109:步驟</p>
        <p type="p">S110:步驟</p>
        <p type="p">S111:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1339" publication-number="202616876">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616876</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130099</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於有機發光二極體（ＯＬＥＤ）顯示背板面板的具有高介電常數層的薄膜電晶體（ＴＦＴ）及電容器結構</chinese-title>
        <english-title>THIN-FILM TRANSISTOR (TFT) AND CAPACITOR STRUCTURES WITH HIGH DIELECTRIC CONSTANT LAYERS FOR ORGANIC LIGHT-EMITTING DIODE (OLED) DISPLAY BACKPLANE PANELS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260102B">H10D64/20</main-classification>
        <further-classification edition="202501120260102B">H10D64/68</further-classification>
        <further-classification edition="202501120260102B">H10D62/10</further-classification>
        <further-classification edition="202501120260102B">H10D62/80</further-classification>
        <further-classification edition="202501120260102B">H10D80/20</further-classification>
        <further-classification edition="202501120260102B">H10D30/67</further-classification>
        <further-classification edition="202501120260102B">H10D1/60</further-classification>
        <further-classification edition="200601120260102B">H01L21/762</further-classification>
        <further-classification edition="202301120260102B">H10K50/805</further-classification>
        <further-classification edition="202301120260102B">H10K59/80</further-classification>
        <further-classification edition="202301120260102B">H10K59/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金正培</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JUNG BAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范德久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, DEJIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裴良浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, YANG HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　魯德尼順良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, RODNEY SHUNLEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪　銘欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, MING CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳正興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHENG-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許光秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUH, KWANG SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙　來</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, LAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔　壽永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, SOO YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例大體係關於薄膜電晶體（TFT）和電容器結構。這些結構包括一或多個具有介電常數大於五的層。具有介電常數大於五的層可用於第二緩衝層、第一底部閘極絕緣層（GI）層、第一頂部GI層、第二頂部GI層、第一低溫多晶矽（LTPS）層間介電層（ILD）層及/或第一ILD層。第一頂部GI層的介電常數也可以小於五。使用不同介電常數的層將導致TFT和電容器結構的多項功能改進。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments disclosed herein generally relate to thin-film transistor (TFT) and capacitor structures. The structures include one or more layers having a dielectric constant greater than five. The layer(s) having the dielectric constant greater than five may be implemented in a second buffer layer, a first bottom gate insulator (GI) layer, a first top GI layer, a second top GI layer, a first low temperature polycrystalline silicon (LTPS) interlayer dielectric (ILD) layer, and/or a first ILD layer. The first top GI layer may also have a dielectric constant less than five. Implementing the layer(s) with different dielectric constants results in various functional improvements of TFT and capacitor structures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:第一驅動TFT結構</p>
        <p type="p">101:裝置</p>
        <p type="p">102:電容器結構</p>
        <p type="p">104a:第一開關TFT結構</p>
        <p type="p">104b:第二開關TFT結構</p>
        <p type="p">106:第一緩衝層</p>
        <p type="p">108:第二緩衝層</p>
        <p type="p">110:第一底部GI層</p>
        <p type="p">112:第一ILD介電層</p>
        <p type="p">114:第一底部閘極</p>
        <p type="p">116:第二底部閘極</p>
        <p type="p">118:金屬氧化物層</p>
        <p type="p">120:第一頂部GI層</p>
        <p type="p">122:第一頂部閘極</p>
        <p type="p">124a:第一源極電極</p>
        <p type="p">124b:第二源極電極</p>
        <p type="p">124c:第三源極電極</p>
        <p type="p">126a:第一汲極電極</p>
        <p type="p">126b:第二汲極電極</p>
        <p type="p">126c:第三汲極電極</p>
        <p type="p">128:第二底部閘極</p>
        <p type="p">130:金屬氧化物層</p>
        <p type="p">134:第一頂部GI層</p>
        <p type="p">136:第一頂部閘極</p>
        <p type="p">137:第一底部閘極</p>
        <p type="p">138:第二底部閘極</p>
        <p type="p">140:金屬氧化物層</p>
        <p type="p">142:第一頂部GI層</p>
        <p type="p">144:第一頂部閘極</p>
        <p type="p">C1:第一電容器</p>
        <p type="p">C2:第二電容器</p>
        <p type="p">V&lt;sub&gt;D1&lt;/sub&gt;:汲極電壓</p>
        <p type="p">V&lt;sub&gt;D2&lt;/sub&gt;:汲極電壓</p>
        <p type="p">V&lt;sub&gt;D3&lt;/sub&gt;:汲極電壓</p>
        <p type="p">V&lt;sub&gt;G1&lt;/sub&gt;:閘極電壓</p>
        <p type="p">V&lt;sub&gt;G2&lt;/sub&gt;:閘極電壓</p>
        <p type="p">V&lt;sub&gt;G3&lt;/sub&gt;:閘極電壓</p>
        <p type="p">V&lt;sub&gt;S1&lt;/sub&gt;:源極電壓</p>
        <p type="p">V&lt;sub&gt;S2&lt;/sub&gt;:源極電壓</p>
        <p type="p">V&lt;sub&gt;S3&lt;/sub&gt;:源極電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1340" publication-number="202615518">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615518</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130102</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、複合材料及其硬化物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F283/10</main-classification>
        <further-classification edition="200601120260102B">C08F299/02</further-classification>
        <further-classification edition="200601120260102B">C08G59/17</further-classification>
        <further-classification edition="200601120260102B">C08K5/01</further-classification>
        <further-classification edition="200601120260102B">C08K5/098</further-classification>
        <further-classification edition="200601120260102B">C08K5/14</further-classification>
        <further-classification edition="200601120260102B">C08K5/3445</further-classification>
        <further-classification edition="200601120260102B">C08K7/06</further-classification>
        <further-classification edition="200601120260102B">C08L63/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林健一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中西絵梨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANISHI, ERI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 提供可在低溫且短時間內硬化之樹脂組成物及含前述樹脂組成物與纖維基材之複合材料。  &lt;br/&gt;　　[解決手段] 一種樹脂組成物，係含有：  &lt;br/&gt;　　乙烯酯樹脂(A)；  &lt;br/&gt;　　含乙烯性不飽和基之單體(B)；  &lt;br/&gt;　　含金屬之化合物(C)；  &lt;br/&gt;　　有機過氧化物(D)；  &lt;br/&gt;　　咪唑化合物(E)；  &lt;br/&gt;　　前述乙烯酯樹脂(A)為具有環氧基之乙烯酯樹脂；  &lt;br/&gt;　　前述含金屬之化合物(C)為含有元素周期表VIIB族至IB族之金屬元素之化合物；  &lt;br/&gt;　　前述含金屬之化合物(C)之金屬換算含量，相對於前述乙烯酯樹脂(A)及含乙烯性不飽和基之單體(B)之合計100質量份，為0.1×10&lt;sup&gt;-6&lt;/sup&gt;質量份至2000×10&lt;sup&gt;-6&lt;/sup&gt;質量份。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1341" publication-number="202615625">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615625</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130125</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於拋光基板之組合物及方法</chinese-title>
        <english-title>COMPOSITIONS AND METHODS FOR POLISHING SUBSTRATES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C09K3/14</main-classification>
        <further-classification edition="200601120260105B">C09G1/02</further-classification>
        <further-classification edition="200601120260105B">H01L21/304</further-classification>
        <further-classification edition="201201120260105B">B24B37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦許　亞倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALSH, AARON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維爾瑪　阿迪亞　迪利普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERMA, ADITYA DILIP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪　桑妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE, SUNNY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛吉　雷傑　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, RAJIV K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供用於拋光基板之組合物。組合物包括複數個塗覆顆粒、氧化劑、pH調節劑或其任一組合中之至少一者。在用於拋光碳化矽基板時，該複數個塗覆顆粒、該氧化劑及該pH調節劑以足夠量存在以使該組合物將該碳化矽基板之表面粗糙度R&lt;sub&gt;a&lt;/sub&gt;降低至0.1 nm或更低；及/或以0.01 µm/hr或更大之材料去除速率自該碳化矽基板去除碳化矽。亦尤其提供相關方法及相關套組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Compositions for polishing substrates are provided. A composition comprises at least one of a plurality of coated particles, an oxidizer, a pH adjuster, or any combination thereof. The plurality of coated particles, the oxidizer, and the pH adjuster are present in an amount sufficient for the composition, when used for polishing a silicon carbide substrate, to reduce a surface roughness, R&lt;sub&gt;a&lt;/sub&gt;, of the silicon carbide substrate to 0.1 nm or less; and/or remove silicon carbide from the silicon carbide substrate at a material removal rate of 0.01 µm/hr or greater. Related methods and related kits, among other things, are also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:獲得/步驟</p>
        <p type="p">104:分配/步驟</p>
        <p type="p">106:拋光/步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1342" publication-number="202615037">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615037</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130174</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靶向ＫＲＡＳ且包含拓樸異構酶有效載荷之共價誘導之藥物結合物</chinese-title>
        <english-title>COVALENT-INDUCED DRUG CONJUGATES TARGETING KRAS AND COMPRISING A TOPOISOMERASE PAYLOAD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/519</main-classification>
        <further-classification edition="200601120260102B">A61K31/517</further-classification>
        <further-classification edition="200601120260102B">A61K31/437</further-classification>
        <further-classification edition="200601120260102B">A61K31/407</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商太斯萊特醫藥美國有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TESSERACT MEDICINES US, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡斯楚　艾爾法度　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CASTRO, ALFREDO C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡蘭德拉　尼可拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CALANDRA, NICHOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅勒迪斯　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEREDITH, ERIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘　越</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示案提供包含KRAS&lt;sup&gt;G12C&lt;/sup&gt;結合部分及拓樸異構酶1抑制劑有效載荷部分之共價誘導之藥物結合物，以及其組合物及使用方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides covalent-induced drug conjugates comprising a KRAS&lt;sup&gt;G12C&lt;/sup&gt; binding moiety and a topoisomerase 1 inhibitor payload moiety, as well as compositions and methods of use thereof.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1343" publication-number="202615038">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615038</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130186</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含拓樸異構酶有效載荷之靶向ＫＲＡＳ之共價誘導之藥物結合物</chinese-title>
        <english-title>KRAS-TARGETING COVALENT-INDUCED DRUG CONJUGATES COMPRISING A TOPOISOMERASE PAYLOAD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/519</main-classification>
        <further-classification edition="200601120260102B">A61K31/517</further-classification>
        <further-classification edition="200601120260102B">A61K31/4985</further-classification>
        <further-classification edition="200601120260102B">A61K31/437</further-classification>
        <further-classification edition="200601120260102B">A61K31/4192</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商太斯萊特醫藥美國有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TESSERACT MEDICINES US, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡斯楚　艾爾法度　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CASTRO, ALFREDO C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡蘭德拉　尼可拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CALANDRA, NICHOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅勒迪斯　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEREDITH, ERIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘　越</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示案提供包含KRAS&lt;sup&gt;G12C&lt;/sup&gt;結合部分及拓樸異構酶1有效載荷部分之共價誘導之藥物結合物，以及其組合物及使用方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides covalent-induced drug conjugates comprising a KRAS&lt;sup&gt;G12C&lt;/sup&gt; binding moiety and a topoisomerase 1 payload moiety, as well as compositions and methods of use thereof.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1344" publication-number="202615013">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615013</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130216</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於ＨＳＶ之治療的氮雜環丁烷化合物</chinese-title>
        <english-title>AZETIDINE COMPOUNDS FOR TREATMENT OF HSV</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/44</main-classification>
        <further-classification edition="200601120260102B">A61K31/437</further-classification>
        <further-classification edition="200601120260102B">A61K31/403</further-classification>
        <further-classification edition="200601120260102B">A61K31/397</further-classification>
        <further-classification edition="200601120260102B">A61K31/145</further-classification>
        <further-classification edition="200601120260102B">A61P31/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾森伯利生物科學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASSEMBLY BIOSCIENCES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派喬哈遜　海森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAJOUHESH, HASSAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃克　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALKER, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾　民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHONG, MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布爾斯　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BURES, MARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史崔頓　湯瑪士　Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STRATTON, THOMAS P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣大中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明部分地提供氮雜環丁烷化合物，及其醫藥組合物，及治療及預防HSV感染之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides, in part, azetidine compounds, and pharmaceutical compositions thereof, and methods of the treatment and prophylaxis of HSV infections.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1345" publication-number="202615029">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615029</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130223</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療ＨＳＶ之三環化合物</chinese-title>
        <english-title>TRICYCLIC COMPOUNDS FOR TREATMENT OF HSV</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/517</main-classification>
        <further-classification edition="200601120260102B">A61K31/407</further-classification>
        <further-classification edition="200601120260102B">A61K31/145</further-classification>
        <further-classification edition="200601120260102B">A61P31/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾森伯利生物科學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASSEMBLY BIOSCIENCES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派喬哈遜　海森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAJOUHESH, HASSAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃克　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALKER, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾　民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHONG, MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布爾斯　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BURES, MARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史崔頓　湯瑪士　Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STRATTON, THOMAS P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣大中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明部分地提供三環化合物及其醫藥組合物，及治療及預防HSV感染之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides, in part, tricyclic compounds, and pharmaceutical compositions thereof, and methods of the treatment and prophylaxis of HSV infections.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1346" publication-number="202616088">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616088</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130229</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>串流處理裝置及方法，以及非暫態電腦可讀媒體</chinese-title>
        <english-title>SYSTEMS AND METHODS OF STREAM PROCESSING, AND NON-TRANSITORY COMPUTER-READABLE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">G06F12/14</main-classification>
        <further-classification edition="202201120251201B">H04L67/12</further-classification>
        <further-classification edition="200601120251201B">G06F13/28</further-classification>
        <further-classification edition="201301120251201B">G06F21/78</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇　亮奭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KI, YANG SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭明俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, MYUNG JUNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供用於記憶體池的串流處理架構的系統、方法和裝置。在一或多個範例中，系統、裝置和方法包括接收包括請求標頭和輸入資料串流的記憶體交易請求；確定請求標頭指示基於輸入資料串流執行的函數；基於請求標頭的位置指示器確定執行函數的位置，位置指示器指示輸入資料串流的來源裝置、輸出資料串流的目標裝置、或處理輸入資料串流的來源裝置和輸出資料串流的目標裝置之間的資料通訊的交換器；以及基於執行與輸入資料串流相關的函數產生輸出資料串流。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are systems, methods, and apparatuses for stream processing architecture for memory pools. In one or more examples, the systems, devices, and methods include receiving a memory transaction request that includes a request header and an input data stream; determining that the request header indicates a function to execute based on the input data stream; determining a location to execute the function based on a location indicator of the request header, the location indicator indicating a source device of the input data stream, a destination device of an output data stream, or a switch that processes data communication between the source device of the input data stream and the destination device of the output data stream; and generating the output data stream based on executing the function in relation to the input data stream.</p>
      </isu-abst>
      <representative-img>
        <p type="p">800:方法</p>
        <p type="p">805、810、815、820:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1347" publication-number="202615718">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615718</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130248</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置、判定方法、半導體裝置之製造方法及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C23C16/52</main-classification>
        <further-classification edition="200601120260102B">C23C16/455</further-classification>
        <further-classification edition="200601120260102B">H01L21/67</further-classification>
        <further-classification edition="202301120260102B">G06N3/08</further-classification>
        <further-classification edition="201801120260102B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林原秀元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHIHARA, HIDEMOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供藉由複數判定項目執行基板處理有無重現性的判定，可抑制錯誤判定可能性的技術。  &lt;br/&gt;本發明係具備有：基板處理部，係對基板施行處理；氣體供應部，係對上述基板處理部供應處理上述基板的氣體；取得部，係施行預定次數之上述基板之處理，取得各上述基板之處理中預定特定區間的計測值；判定條件設定部，係利用由上述取得部取得的上述計測值，設定預定複數判定項目的各自之閾值；與判定部，係在設定上述閾值後的上述基板處理中，於上述各判定項目中判斷所取得的計測值是否涵蓋於上述閾值範圍內，而判定上述基板的處理有無重現性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1348" publication-number="202616551">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616551</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130267</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池平衡系統與方法</chinese-title>
        <english-title>BATTERY BALANCING SYSTEMS AND METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01M10/44</main-classification>
        <further-classification edition="200601120260102B">H01M10/48</further-classification>
        <further-classification edition="200601120260102B">H02J7/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾歐斯能源科技控股有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EOS ENERGY TECHNOLOGY HOLDINGS, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊斯蘭姆　Ｓ　Ｍ　拉基烏爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISLAM, S. M. RAKIUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩洛哥　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORROCCO, WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查昆特　蒙特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TCHAKOUNTE, MONTHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗拉特科維奇　弗拉特科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VLATKOVIC, VLATKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及用於平衡複數電池之充電狀態（state of charge, SOC）之改良系統與方法。例如，一系統可包含複數電池串，該些電池串係經由一共用匯流排彼此並聯連接。各電池串可包含一電力轉換器以及複數串聯連接之電池模組。該電力轉換器可被配置為調節該複數電池模組之合併輸出功率。各電池模組可包含複數繼電器，該些繼電器可被控制以對該電池模組進行放電、充電及／或旁路。透過控制該些電池串之電力轉換器以及該些電池模組之繼電器，可使該些電池串彼此間達成平衡，並使各電池串內之電池模組彼此間達成平衡。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Improved systems and methods for balancing a state of charge (SOC) of a plurality of batteries are disclosed. For example, a system may include multiple battery strings connected in parallel to one another through a common bus. Each battery string may include a power converter and multiple battery modules connected in series. The power converter may be configured to regulate the combined power output of the battery modules. Each battery module may include multiple relays that may be controlled to discharge, charge, and/or bypass that battery module. Collectively, the power converters of the battery strings and the relays of the battery modules may be controlled to balance the battery strings with one another and to balance the battery modules within each of the battery strings.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:可充電電池系統</p>
        <p type="p">101、102、103:電池串</p>
        <p type="p">140:共用匯流排</p>
        <p type="p">111A、111B、111C、111D、112A、112B、112C、112D、113A、113B、113C、113D:電池模組</p>
        <p type="p">131、132、133:繼電器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1349" publication-number="202615887">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615887</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130269</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光檢測裝置及測距系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G01S7/48</main-classification>
        <further-classification edition="202001120260102B">G01S17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼半導體解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林賢哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, KENYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大澤拓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHSAWA, TAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡辺直</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, NAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, DAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本技術係關於一種可提高測距精度之光檢測裝置及測距系統。  &lt;br/&gt;本技術之光檢測裝置具備：讀出電路，其輸出表示受光元件檢測出照射光被物體反射之反射光之時序的檢測信號；TDC，其基於自讀出電路輸出之檢測信號對時間進行計數；直方圖產生部，其根據基於檢測信號之TDC之輸出而產生直方圖；第1多工器，其將測定用信號輸入至信號路徑，該測定用信號用於以未達TDC之時間分辨力之時間單位，測定讀出電路與TDC之間之信號路徑之至少一部分之信號之傳播延遲；傳播延遲測定部，其根據基於測定用信號之TDC之輸出，以未達TDC之時間分辨力之時間單位測定傳播延遲；及修正部，其基於傳播延遲測定部之測定結果，對基於檢測信號之TDC之輸出或直方圖產生部之輸出進行修正。本技術可應用於例如直接ToF方式之測距裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">34-1:TDC</p>
        <p type="p">34-(N-1):TDC</p>
        <p type="p">141-1:累加器</p>
        <p type="p">141-(N-1):累加器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1350" publication-number="202615811">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615811</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130272</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>乾式冷卻器</chinese-title>
        <english-title>DRY COOLER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">F28D7/16</main-classification>
        <further-classification edition="200601120260102B">F28D7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商維蘭德昂達有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIELAND ONDA S.R.L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費倫　安德烈亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FERRON, ANDREA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈科梅蒂　安德烈亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIACOMETTI, ANDREA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格拉納　西蒙娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRANA, SIMONE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒙托里奧　馬泰奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONTORIO, MATTEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裡博尼　阿爾貝托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIBONI, ALBERTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦卡里尼　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VACCARINI, DANIELE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種乾式冷卻器，其包含至少一個基本結構(2)，該至少一個基本結構(2)形成至少一個區域(3)以進行空氣與待冷卻之流體之間之熱交換。該熱交換區域(3)具有至少一個空氣進入口(4)及至少一個空氣出口(5)，二者均與外部環境連通。存在用於順著至少一個自該進入口(4)延伸至該出口(5)之路徑產生至少一個空氣流(6a)之構件(6)；及順著該空氣路徑配置且具有至少一個熱交換管道(7a)之熱交換階段(7)，該待冷卻之流體在該至少一個熱交換管道(7a)內部循環；及配置於該熱交換階段(7)的上游且經組態成將意欲通過該熱交換階段(7)之該空氣冷卻之絕熱空氣冷卻階段(8)；在該熱交換階段(7)的下游，順著該空氣流(6a)順著其路徑前進之方向，存在至少一個附加熱交換階段(7)及至少一個附加絕熱冷卻階段(8)，該附加絕熱冷卻階段(8)係順著該空氣流(6a)順著其路徑前進之方向配置於該附加熱交換階段(7)的上游。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A dry cooler, comprising at least one basic structure (2), forming at least one region (3) for heat exchange between air and a fluid to be cooled. The heat exchange region (3) has at least one air intake (4) and at least one air outlet (5), both communicating with the external environment. There are means (6) for generating at least one air flow (6a) along at least one path extending from the intake (4) to the outlet (5), and a heat exchange stage (7) which is arranged along the air path and has at least one heat exchange duct (7a), inside which the fluid to be cooled circulates, and an adiabatic air cooling stage (8) arranged upstream of the heat exchange stage (7) and configured to cool the air intended to pass through the heat exchange stage (7); downstream of the heat exchange stage (7), along the direction of advancement of the air flow (6a) along its path, there are at least one additional heat exchange stage (7) and at least one additional adiabatic cooling stage (8), the additional adiabatic cooling stage (8) being arranged upstream of the additional heat exchange stage (7) along the direction of advancement of the air flow (6a) along its path.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:基本結構</p>
        <p type="p">3:區域</p>
        <p type="p">4:空氣進入口</p>
        <p type="p">5:空氣出口</p>
        <p type="p">6:構件</p>
        <p type="p">6a:空氣流</p>
        <p type="p">7:熱交換階段</p>
        <p type="p">7a:熱交換管道</p>
        <p type="p">8:絕熱空氣冷卻階段</p>
        <p type="p">8a:絕熱面板</p>
        <p type="p">12:水施配構件</p>
        <p type="p">12a:噴嘴</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1351" publication-number="202615064">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615064</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130278</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>TAU剪接轉換寡核苷酸及用於治療或預防TAU相關疾病之醫藥組合物</chinese-title>
        <english-title>TAU SPLICE-SWITCHING OLIGONUCLEOTIDE AND PHARMACEUTICAL COMPOSITION FOR TREATING OR PREVENTING TAU-RELATED DISEASE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/7088</main-classification>
        <further-classification edition="201001120260102B">C12N15/113</further-classification>
        <further-classification edition="200601120260102B">A61P21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大塚製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKA PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木俊也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, SHUNYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>額賀陽平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUKAGA, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國吉勇輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNIYOSHI, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長瀬剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGASE, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高場準二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKABA, JUNJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浦島博樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>URASHIMA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>二村隆史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUTAMURA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>内野祐次郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UCHINO, YUJIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福田耕一朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUDA, KOICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明包括與TAU pre-mRNA之內含子1B結合之剪接轉換寡核苷酸、及含有上述剪接轉換寡核苷酸之用於治療或預防TAU相關疾病之醫藥組合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1352" publication-number="202616343">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616343</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130292</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿處理裝置及電源系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01J37/32</main-classification>
        <further-classification edition="200601120260102B">H05H1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水上大地</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUKAMI, DAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤秀生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, HIDEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>相河光太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIKAWA, KOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明於電漿處理中控制基板之邊緣部分處之離子入射角。第1電壓脈衝產生器之第1電壓脈衝信號於第1週期各自之第1期間具備具有第1電壓位準之第1電壓脈衝之序列，於第1週期各自之第2期間具有基準電壓位準，於第2週期各自之第3期間具備具有第2電壓位準之第2電壓脈衝之序列，於第2週期各自之第4期間具有基準電壓位準。第2電壓脈衝產生器之第2電壓脈衝信號於第1期間具備具有第3電壓位準之第3電壓脈衝之序列，於第2期間具有基準電壓位準，於第3期間具備具有第4電壓位準之第4電壓脈衝之序列，於第4期間具有基準電壓位準。第1電壓位準與第3電壓位準之差分不同於第2電壓位準與第4電壓位準之差分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">C(n):主週期</p>
        <p type="p">DP1:第1電壓脈衝</p>
        <p type="p">DP2:第2電壓脈衝</p>
        <p type="p">DP3:第3電壓脈衝</p>
        <p type="p">DP4:第4電壓脈衝</p>
        <p type="p">p1:第1功率位準</p>
        <p type="p">p2:第2功率位準</p>
        <p type="p">p3:第3功率位準</p>
        <p type="p">p4:第4功率位準</p>
        <p type="p">PSC1:第1電壓脈衝之序列</p>
        <p type="p">PSC2:第2電壓脈衝之序列</p>
        <p type="p">PSC3:第3電壓脈衝之序列</p>
        <p type="p">PSC4:第4電壓脈衝之序列</p>
        <p type="p">SC1(m):第1週期</p>
        <p type="p">SC2(o):第2週期</p>
        <p type="p">SCG1:第1週期群</p>
        <p type="p">SCG2:第2週期群</p>
        <p type="p">T1:第1期間</p>
        <p type="p">T2:第2期間</p>
        <p type="p">T3:第3期間</p>
        <p type="p">T4:第4期間</p>
        <p type="p">v1:第1電壓位準</p>
        <p type="p">v2:第2電壓位準</p>
        <p type="p">v3:第3電壓位準</p>
        <p type="p">v4:第4電壓位準</p>
        <p type="p">v&lt;sub&gt;ref1&lt;/sub&gt;:基準電壓位準</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1353" publication-number="202615679">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615679</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130297</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機械鎖定濺鍍靶材接合方法及藉此生成的靶材總成</chinese-title>
        <english-title>MECHANICAL LOCKING SPUTTERING TARGET BONDING METHOD AND TARGET ASSEMBLIES PRODUCED THEREBY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">C23C14/34</main-classification>
        <further-classification edition="200601120260108B">B23K20/00</further-classification>
        <further-classification edition="200601120260108B">B23K20/14</further-classification>
        <further-classification edition="200601120260108B">B23P19/02</further-classification>
        <further-classification edition="200601120260108B">B32B3/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商哈尼威爾國際公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONEYWELL INTERNATIONAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　穗瓊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SUIQIONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞爾瓦拉吉　奈尚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SELVARAJ, NISHANTH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費拉斯　斯特凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FERRASSE, STEPHANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅爾　威恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEYER, WAYNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古德沃特　麥克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOODWATER, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種在一濺鍍總成中形成一接合的方法包括：在一濺鍍靶材之一接合表面上形成第一突出部；在一背襯板之一接合表面上形成第二突出部；將該濺鍍靶材與該背襯板對準，使得該等第一突出部適配於該等第二凹部內且該等第二突出部適配於該等第一凹部內以形成一總成；及對該總成施加壓力，使得第一突出部在該濺鍍靶材與該背襯板之間形成一互鎖接合，其中該互鎖接合係無空隙的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of forming a bond in a sputtering assembly includes forming first projections on a bonding surface of a sputtering target, forming second projections on a bonding surface of a backing plate, aligning the sputtering target and the backing plate so that the first projections fit within the second recesses and the second projections fit within the first recesses to form an assembly; and applying pressure to the assembly so that first projections form an interlock bond between the sputtering target and the backing plate, wherein the interlock bond is void-free.</p>
      </isu-abst>
      <representative-img>
        <p type="p">8:物理氣相沉積(PVD)設備</p>
        <p type="p">10:濺鍍靶材總成</p>
        <p type="p">12:背襯板</p>
        <p type="p">14:靶材</p>
        <p type="p">16:表面</p>
        <p type="p">18:基材</p>
        <p type="p">20:塗層</p>
        <p type="p">22:濺鍍材料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1354" publication-number="202616706">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616706</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130357</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於行動使用者平面的前綴無關收斂之系統及其方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR PREFIX-INDEPENDENT CONVERGENCE OVER MOBILE USER PLANE RELATED APPLICATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260102B">H04L45/02</main-classification>
        <further-classification edition="202201120260102B">H04L47/17</further-classification>
        <further-classification edition="202201120260102B">H04L47/125</further-classification>
        <further-classification edition="200901120260102B">H04W36/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商阿爾克斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARRCUS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派德　凱優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATEL, 　KEYUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村上　哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKAMI, 　TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派　納林納許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, 　NALINAKSH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　民傑德瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEUNG, MAN-KIT DEREK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鼎鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在行動使用者平面（Mobile User Plane, MUP）上實現邊界閘道協定（Border Gateway Protocol, BGP）前綴無關收斂（Prefix-Independent Convergence, PIC）。基地台（gNodeB）相對於多個MUP閘道器（MUP-GW）為雙歸屬。第一MUP閘道器響應於通往基地台之鏈路故障，將流量路由至第二MUP閘道器。第一MUP閘道器可透過解析ST1路由與第二MUP閘道器之N3 ISD路由來確定通往第二MUP閘道器之備援路徑。第一MUP閘道器可透過檢測第二MUP閘道器之N3 ISD路由，參考基地台之位址來確定通往第二MUP閘道器之備援路徑。路由可使用多協定標籤交換（Multi-Protocol Label Switching, MPLS）或基於IPv6的分段路由 （Segment Routing v6, SRv6）執行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Border gateway protocol (BGP) prefix-independent convergence is implemented over a mobile user plane (MUP). A gNodeB is dual-home with respect to multiple MUP gateways (MUP-GW). A first MUP-GW routes traffic to a second MUP-GW in response to failure of a link to the gNodeB. The first MUP-GW may determine a backup path to the second MUP-GW by resolving an ST1 route with a N3 ISD route of the second MUP-GW. The first MUP-GW may determine a backup path to the second MUP-GW by detecting that the N3 ISD route of the second MUP-GW references the address of the gNodeB. Routing may be performed using MPLS or SRv6.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:網路環境</p>
        <p type="p">102:使用者設備</p>
        <p type="p">104:資料網路</p>
        <p type="p">106:存取網路</p>
        <p type="p">108:基地台</p>
        <p type="p">110a,110b:MUP閘道器</p>
        <p type="p">112:MUP供應商邊緣路由器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1355" publication-number="202615866">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615866</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130359</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>癌的檢查劑</chinese-title>
        <english-title>TEST AGENT FOR CANCER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G01N33/68</main-classification>
        <further-classification edition="200601120260102B">G01N21/62</further-classification>
        <further-classification edition="200601120260102B">G01N33/533</further-classification>
        <further-classification edition="200601120260102B">G01N33/574</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関口美知留</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKIGUCHI, MICHIRU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋康彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, YASUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供一種利用嗅覺受體之癌檢查技術。藉由癌種a的檢查劑解決上述課題，該癌種a的檢查劑係包含對於癌種a具有反應性之昆蟲嗅覺受體蛋白質A、及對於包含癌種a的癌不具有反應性之昆蟲嗅覺受體蛋白質C。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide a cancer testing technique using an olfactory receptor. The aforementioned problem is solved by an agent for testing cancer type a, which comprises an insect olfactory receptor protein A having reactivity to cancer type a and an insect olfactory receptor protein C having no reactivity to cancer including cancer type a.</p>
      </isu-abst>
      <representative-img>
        <p type="p">本案無圖式。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1356" publication-number="202615864">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615864</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130363</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>癌的檢查劑</chinese-title>
        <english-title>TEST AGENT FOR CANCER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G01N33/574</main-classification>
        <further-classification edition="200601120260102B">G01N33/68</further-classification>
        <further-classification edition="200601120260102B">G01N21/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関口美知留</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKIGUCHI, MICHIRU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋康彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, YASUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供一種利用嗅覺受體之癌檢查技術。藉由癌種a的檢查劑解決上述課題，該癌種a的檢查劑係包含昆蟲嗅覺受體蛋白質A’，其係對於癌種a具有反應性且對於癌種a以外之癌之至少1種不具有反應性，或對於癌種a以外之癌之至少1種的反應性為相反者；及嗅覺受體蛋白質B，其係對於包含癌種a之複數種癌具有反應性且該反應性的方向為相同者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide a cancer testing technique using an olfactory receptor. The aforementioned problem is solved by an agent for testing cancer type a, which comprises an insect olfactory receptor protein A' having reactivity to cancer type a and not having reactivity to at least one of cancers other than cancer type a, or having reverse reactivity to at least one of cancers other than cancer type a; and an insect olfactory receptor protein B having reactivity to a plurality of types of cancers including cancer type a, and the direction of the reactivity is the same.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1357" publication-number="202615065">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615065</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130372</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>mRNA疫苗佐劑</chinese-title>
        <english-title>ADJUVANT FOR MRNA VACCINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/7088</main-classification>
        <further-classification edition="202501120260102B">A61K9/127</further-classification>
        <further-classification edition="201701120260102B">A61K47/50</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商第一三共股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIICHI SANKYO COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡竜也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKA, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西野幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHINO, MIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古賀哲文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOGA, TETSUFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>粕谷裕司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASUYA, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森田浩司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORITA, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小泉誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOIZUMI, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種佐劑，其係用以與粒子中內封mRNA而成之mRNA疫苗組合投予之包含B型CpG寡去氧核苷酸(CpG ODN)、其修飾體或其複合體者，包含上述B型CpG ODN之佐劑係獨立於內封mRNA之上述粒子而存在。本發明之佐劑可增強mRNA疫苗之抗原特異性細胞毒殺性T細胞(CTL)誘導。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1358" publication-number="202615631">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615631</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130398</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>藥液、藥液之製造方法、及半導體器件之製造方法</chinese-title>
        <english-title>CHEMICAL SOLUTION, METHOD FOR MANUFACTURING CHEMICAL SOLUTION, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C09K13/04</main-classification>
        <further-classification edition="200601120260105B">C11D1/12</further-classification>
        <further-classification edition="200601120260105B">C11D1/40</further-classification>
        <further-classification edition="202501120260105B">H10D62/832</further-classification>
        <further-classification edition="200601120260105B">G03F7/42</further-classification>
        <further-classification edition="202301120260105B">C02F1/56</further-classification>
        <further-classification edition="202201120260105B">C09K23/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋和敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, KAZUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋智威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, TOMONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮崎広輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAZAKI, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大津暁彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHTSU, AKIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種濁度低、可抑制對含SiOCN物的蝕刻性、且對含SiGe物的蝕刻性良好的藥液、以及藥液之製造方法及半導體器件之製造方法。本發明之藥液包含蝕刻劑（etchant）化合物、陽離子性聚合物和陰離子性聚合物，其中，當將陽離子性聚合物相對於藥液之總質量的含量設為含量X、將陰離子性聚合物相對於藥液之總質量的含量設為含量Y時，該藥液滿足下述式（1）或（2）的關係。  &lt;br/&gt;　　式（1）　6≤Y/X  &lt;br/&gt;　　式（2）　6≤X/Y</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1359" publication-number="202616578">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616578</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130403</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可修復連接器模組及電子設備</chinese-title>
        <english-title>REPAIRABLE CONNECTOR MODULE AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250902B">H01R13/506</main-classification>
        <further-classification edition="201101120250902B">H01R24/60</further-classification>
        <further-classification edition="202301120250902B">H04N23/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本航空電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN AVIATION ELECTRONICS INDUSTRY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可修復連接器模組，包括第一插座連接器和第二插座連接器，前述第一插座連接器和第二插座連接器均構成為符合相同的形狀標準。前述可修復連接器模組相對於外殼插頭連接器的嵌合方向可在以下兩種嵌合方向之間切換：第一嵌合方向，在前述方向下，前述第二插座連接器與前述外殼插頭連接器嵌合，且前述第一插座連接器構成為與前述外部插頭連接器嵌合；第二嵌合方向，在前述方向下，前述第一插座連接器與前述外殼插頭連接器嵌合，且前述第二插座連接器構成為與前述外部插頭連接器嵌合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A repairable connector module includes a first receptacle connector and a second receptacle connector. The first and second receptacle connectors are configured to conform to the same shape standard. A mating orientation of the repairable connector module with respect to an enclosure plug connector is switchable between: a first mating orientation in which the second receptacle connector is mated with the enclosure plug connector and the first receptacle connector is configured to mate with an external plug connector; and a second mating orientation in which the first receptacle connector is mated with the enclosure plug connector and the second receptacle connector is configured to mate with the external plug connector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:可修復連接器模組</p>
        <p type="p">3:外殼</p>
        <p type="p">4:外殼插頭連接器</p>
        <p type="p">5:外殼基板</p>
        <p type="p">7:外殼主體</p>
        <p type="p">10:第一插座連接器</p>
        <p type="p">11:第二插座連接器</p>
        <p type="p">12:支架</p>
        <p type="p">12B:凸緣</p>
        <p type="p">12E:定位孔</p>
        <p type="p">17:模組下支架</p>
        <p type="p">17A:上表面</p>
        <p type="p">17B:定位孔</p>
        <p type="p">17C:模組定位板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1360" publication-number="202616432">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616432</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130445</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>溫度控制系統、基板加熱方法、半導體裝置之製造方法、基板處理裝置及記錄媒體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/67</main-classification>
        <further-classification edition="200601120260102B">H01L21/324</further-classification>
        <further-classification edition="200601120260102B">G05B11/36</further-classification>
        <further-classification edition="200601120260102B">G05B13/02</further-classification>
        <further-classification edition="200601120260102B">G05D23/32</further-classification>
        <further-classification edition="200601120260102B">G05D23/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉下雅士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGISHITA, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口英人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, HIDETO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>重松聖也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIGEMATSU, SEIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種技術，其具有：加熱器，其對複數個分區進行加熱；及溫度控制部，其以使根據預先保持之預測模型算出之預測溫度行接近將來之目標溫度行之方式，控制供給至上述加熱器之電力；修正上述複數個分區中之特定分區之上述預測模型並更新上述預測溫度行，基於更新後之預測溫度行，藉由上述加熱器而進行加熱，對於上述複數個分區中之除上述特定分區以外之分區，基於上述預測溫度行，藉由上述加熱器而進行加熱。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">36:上位控制器</p>
        <p type="p">206:加熱器</p>
        <p type="p">238:溫度控制部</p>
        <p type="p">718:電力供給部</p>
        <p type="p">800:溫度歷程記憶部</p>
        <p type="p">802:電力供給值歷程記憶部</p>
        <p type="p">804:個別特性創建部</p>
        <p type="p">806:目標溫度行算出部</p>
        <p type="p">808:整合特性創建部</p>
        <p type="p">810:約束最佳化計算部</p>
        <p type="p">812:限制器</p>
        <p type="p">F、H、S:輸入端</p>
        <p type="p">P:輸出端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1361" publication-number="202615501">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615501</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130450</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>以改性聚丙烯酸酯聚合物為基之環保加工助劑</chinese-title>
        <english-title>ENVIRONMENTALLY FRIENDLY PROCESSING AID BASED ON MODIFIED POLYACRYLATE POLYMER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F120/18</main-classification>
        <further-classification edition="200601120260102B">C08F8/14</further-classification>
        <further-classification edition="200601120260102B">C08L23/06</further-classification>
        <further-classification edition="200601120260102B">C08L33/06</further-classification>
        <further-classification edition="200601120260102B">C08J3/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴地斯顏料化工廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅諾茲　艾杜爾多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENOZZI, EDOARDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格那特　安佐斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GERNANDT, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮爾倫　法蘭克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PIRRUNG, FRANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫德利希　威珀特　維布克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WUNDERLICH-WIPPERT, WIEBKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慕勒　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUELLER, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種成型聚合物製品，其包含熱塑性聚合物；及可藉由一種製程獲得之改性聚丙烯酸酯聚合物，該製程包括i.使選自經取代或未經取代之丙烯酸C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;22&lt;/sub&gt;烷基酯、經取代或未經取代之丙烯酸C&lt;sub&gt;4&lt;/sub&gt;-C&lt;sub&gt;22&lt;/sub&gt;環烷基酯、經取代或未經取代之C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;22&lt;/sub&gt;丙烯醯胺、或丙烯酸與聚烷基醚醇之酯之至少一種甲基丙烯酸酯單體及/或至少一種丙烯酸酯單體聚合，以獲得至少一種聚丙烯酸酯聚合物；及ii.藉由用至少一種選自未經取代之C&lt;sub&gt;8&lt;/sub&gt;-C&lt;sub&gt;36&lt;/sub&gt;醇(c1)或聚烷基醚醇(c2)之醇轉酯化來改性在步驟(i)中所獲得之該至少一種聚丙烯酸酯聚合物。本發明亦關於一種用於改良包含熱塑性聚合物之熔體之流動性質之方法，該方法包括在熔體加工之前或期間將該改性聚丙烯酸酯聚合物併入該熱塑性聚合物中之步驟。本發明亦關於一種改性聚丙烯酸酯聚合物於改良包含熱塑性聚合物之熔體之流動性質之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a shaped polymeric article comprising a thermoplastic polymer; and a modified polyacrylate polymer obtainable by a process comprising i. polymerizing at least one methacrylate monomer and/or at least one acrylate monomer selected from substituted or unsubstituted C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;22&lt;/sub&gt; alkyl acrylates, substituted or unsubstituted C&lt;sub&gt;4&lt;/sub&gt;-C&lt;sub&gt;22&lt;/sub&gt; cycloalkyl acrylates, substituted or unsubstituted C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;22&lt;/sub&gt; acrylamides, or esters of acrylic acid with polyalkylether alcohols, to obtain at least one polyacrylate polymer; and ii. modifying the at least one polyacrylate polymer obtained in step (i) by transesterification with at least one alcohol selected from unsubstituted C&lt;sub&gt;8&lt;/sub&gt;-C&lt;sub&gt;36&lt;/sub&gt; alcohols (c1), or polyalkylether alcohols (c2). The present invention also relates to a process for improving the flow properties of a melt comprising a thermoplastic polymer, which comprises the step of incorporating the modified polyacrylate polymer into the thermoplastic polymer prior to or during melt processing. The present invention also relates to a use of the modified polyacrylate polymer to improve the flow properties of a melt comprising a thermoplastic polymer.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1362" publication-number="202616270">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616270</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130457</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>經編碼音訊資料信號的產生及處理</chinese-title>
        <english-title>GENERATION AND PROCESSING OF ENCODED AUDIO DATA SIGNAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260102B">G10L19/04</main-classification>
        <further-classification edition="201301120260102B">G10L19/08</further-classification>
        <further-classification edition="201301120260102B">G10L25/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商皇家飛利浦有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONINKLIJKE PHILIPS N.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雪吉兒　艾瑞克　哥蘇納斯　佩托拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHUIJERS, ERIK GOSUINUS PETRUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克奇奇安　派翠克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KECHICHIAN, PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉維　阿克夏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAVI, AKSHAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種音訊設備接收一經編碼音訊資料信號，該經編碼音訊資料信號包含表示一音訊信號的一信號分量的性質的一潛在空間特徵集。一經訓練人工神經網路(205)從該潛在空間特徵集產生頻率參數（且一般係音高參數），該參數反映該音訊信號的該信號分量的一音高性質。一脈衝序列產生器(207)產生一脈衝序列，該脈衝序列具有取決於該音高參數的性質。一整形電路(209)藉由對該脈衝序列應用一頻譜時間整形，從該脈衝序列產生一第一音訊信號，其中該頻譜時間整形係取決於該潛在空間特徵集。一輸出處理器(211)經配置以從該第一音訊信號產生一輸出信號。一種編碼設備可使用接收描述正弦波/諧波/諧波網格的參數作為輸入的一經訓練人工神經網路來產生該潛在空間特徵集。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An audio apparatus receives an encoded audio data signal comprises a latent space feature set representing properties of a signal component of an audio signal. A trained artificial neural network (205) generates a frequency, and typically a pitch, parameter reflecting a pitch property of the signal component of the audio signal from the latent space feature set. A pulse sequence generator (207) generates a pulse sequence having properties dependent on the pitch parameter. A shaping circuit (209) generates a first audio signal from the pulse sequence by applying a spectro-temporal shaping to the pulse sequence with the spectro-temporal shaping being dependent on the latent space feature set. An output circuit (211) arranged to generate an output signal from the first audio signal. An encoding apparatus may generate the latent space feature set using a trained artificial neural network receiving parameters describing sinusoids/harmonics/harmonic grids as inputs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">201:接收器</p>
        <p type="p">203:信號解碼器</p>
        <p type="p">205:第一經訓練人工神經網路；全連接神經網路FC；解碼器</p>
        <p type="p">207:脈衝序列產生器</p>
        <p type="p">209:整形電路</p>
        <p type="p">211:輸出電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1363" publication-number="202615098">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615098</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130464</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>口服組成物及使用其之提升鼻後香氣的方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K47/46</main-classification>
        <further-classification edition="201701120260102B">A61K47/44</further-classification>
        <further-classification edition="200601120260102B">A61K47/06</further-classification>
        <further-classification edition="201601120260102B">A23L27/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三生醫藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNSHO PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田和哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豊田航平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOTA, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種可提升鼻後香氣之口服組成物等。  &lt;br/&gt;　　一種口服組成物，其包含揮發性成分及膠化劑，其中，10%壓縮時之硬度為0.1~9.0N，水分活性為0.73以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1364" publication-number="202615755">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615755</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130481</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資料處理系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">E03C1/00</main-classification>
        <further-classification edition="201801120260102B">G16H50/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＯＴＯ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOTO LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浮貝清岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UKIGAI, KIYOTAKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岸和田潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISHIWADA, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑原香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUWAHARA, KAORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩田成美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWATA, NARUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姬野剛至</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIMENO, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋諒太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於資料處理系統能夠進行因應服務之適當的資料供給。  &lt;br/&gt;　　用以解決課題之手段為，實施形態之資料處理系統，係具備：連接手段，其將複數個用水機器經由預定的網路可通訊地連接；第1儲存手段，其儲存從前述複數個用水機器中包含的第1用水機器取得的第1利用資料；第2儲存手段，其儲存從前述複數個用水機器中包含的第2用水機器取得的第2利用資料；及資料供給手段，其針對提供使用基於儲存在前述第1儲存手段或前述第2儲存手段之前述第1利用資料及前述第2利用資料中至少一方的利用資料之提供用資料之服務的各個複數個資料處理部，根據與提供資料至前述複數個資料處理部的各個有關的條件，來供給前述提供用資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:資料處理系統</p>
        <p type="p">2:資料資料供給系統</p>
        <p type="p">100:雲端伺服器</p>
        <p type="p">210:廁所</p>
        <p type="p">220:浴室</p>
        <p type="p">211:廁所裝置</p>
        <p type="p">212:廁所用感測器</p>
        <p type="p">221:浴室裝置</p>
        <p type="p">222:浴室用感測器</p>
        <p type="p">230:洗臉台</p>
        <p type="p">231:洗臉台裝置</p>
        <p type="p">232:洗臉台用感測器</p>
        <p type="p">240:外部資料提供裝置</p>
        <p type="p">300:使用者終端</p>
        <p type="p">301:使用者相關終端</p>
        <p type="p">U:使用者</p>
        <p type="p">RU:使用者相關主體</p>
        <p type="p">DS:資料供給手段</p>
        <p type="p">AC1:睡眠資訊</p>
        <p type="p">AC2:飲食資訊</p>
        <p type="p">AC3:運動資訊</p>
        <p type="p">DBS:儲存手段</p>
        <p type="p">DB1~DB5:資料庫</p>
        <p type="p">DP11,DP12,DP13,DP21,DP22,DP23:資料處理部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1365" publication-number="202615630">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615630</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130482</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含矽材料的選擇性蝕刻</chinese-title>
        <english-title>SELECTIVE ETCHING OF SILICON-CONTAINING MATERIAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C09K13/00</main-classification>
        <further-classification edition="200601120260102B">H01L21/306</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王柏瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, BAIWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　小林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XIAOLIN C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐萬興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, WANXING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔　振江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUI, ZHENJIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　安川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ANCHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">示範性半導體處理方法可能包含提供含氟前驅物、含氯前驅物以及含氫前驅物至半導體處理腔室的處理區域。基板可能裝設於處理區域內。含矽材料及含矽和鍺材料可能安置於基板上。這些方法可能包含將基板與含氟前驅物、含氯前驅物及含氫前驅物接觸。這些方法可能包含選擇性地從基板上移除含矽材料的至少一部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Exemplary semiconductor processing methods may include providing a fluorine-containing precursor, a chlorine-containing precursor, and a hydrogen-containing precursor to a processing region of a semiconductor processing chamber. A substrate may be housed within the processing region. A silicon-containing material and a silicon-and-germanium-containing material may be disposed on the substrate. The methods may include contacting the substrate with the fluorine-containing precursor, the chlorine-containing precursor, and the hydrogen-containing precursor. The methods may include selectively removing at least a portion of the silicon-containing material from the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:方法</p>
        <p type="p">405:操作</p>
        <p type="p">410:操作</p>
        <p type="p">415:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1366" publication-number="202616112">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616112</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130490</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>認證裝置、認證方法以及電腦程式產品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260102B">G06F21/31</main-classification>
        <further-classification edition="201301120260102B">G06F21/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＮＴＩ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NTI, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村宇利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, TAKATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的目的是解決因使用者被分配的唯一通用編號被盜用，發生的使用者個人資訊之失竊有關的問題。  &lt;br/&gt;本揭露的解決方法是，使用者終端從認證裝置接收一次性密碼資料的發行(S1204、S1103)。一次性密碼資料與個人資料從使用者終端交付給請求裝置(S1105、S1301)。請求裝置將一次性密碼資料與個人資訊傳送給認證裝置(S1302、S1205)。認證裝置判定一次性密碼資料為正當，且個人資訊為正當後(S1206)，生成認證資料並將它送往請求裝置(S1207、S1208、S1303)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1101-S1105,S1201-S1208,S1301-S1303:流程</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1367" publication-number="202615654">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615654</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130512</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>純化重組質體ＤＮＡ的方法</chinese-title>
        <english-title>METHOD FOR PURIFYING RECOMBINANT PLASMID DNA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C12N15/10</main-classification>
        <further-classification edition="200601120260102B">B01D15/36</further-classification>
        <further-classification edition="200601120260102B">C12N15/63</further-classification>
        <further-classification edition="200601120260102B">A61K48/00</further-classification>
        <further-classification edition="200601120260102B">C07H21/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科赫　莎賓娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOCH, SABRINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比蕭夫　安娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BISCHOF, ANNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝德　賽琳娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAEDER, SELINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛肯斯丹　羅伯托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FALKENSTEIN, ROBERTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文報導了一種利用以陰離子交換 (AEX) 材料進行的層析步驟從溶液中獲得重組質體 DNA (pDNA) 的方法，該溶液包含該重組 pDNA 的不同同功型以及其他非 pDNA 污染物的混合物，其中將藉由以下確定的一定體積的包含該混合物的該溶液施加至該 AEX 材料，該一定體積的包含該混合物的該溶液包含一定量的該重組 pDNA：將包含該混合物的該溶液施加至該 AEX 材料，確定該 AEX 材料之流穿液中重組 pDNA 的量，將所施加的包含該混合物的溶液可以使得約 10% 比例的該重組 pDNA 存在於該流穿液中時的體積確定為該待施加至該 AEX 材料的包含該混合物的該溶液的體積，由此藉由施加溶析緩衝液而從該 AEX 材料獲得該重組 pDNA。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Herein is reported a method for obtaining recombinant plasmid DNA (pDNA) from a solution comprising a mixture of different isoforms of the recombinant pDNA as well as other non-pDNA contaminants with a chromatography step with an anion-exchange (AEX) material, wherein a volume of the solution comprising the mixture is applied to the AEX material that comprises an amount of the recombinant pDNA that has been determined by applying the solution comprising the mixture to the AEX material, determining the amount of recombinant pDNA in the flow-through of the AEX material, determining the volume of the applied solution comprising the mixture that results in a fraction of about 10 % of the recombinant pDNA to be in the flow-through to be the volume of the solution comprising the mixture to be applied to the AEX material, whereby the recombinant pDNA is obtained from the AEX material by applying an elution buffer.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1368" publication-number="202615282">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615282</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130515</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於調適診斷範圍的極限值以計算橫向傾斜角度之方法</chinese-title>
        <english-title>METHOD FOR ADAPTING THE LIMITS OF A DIAGNOSTIC RANGE FOR COMPUTING THE ANGLE OF LATERAL INCLINATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260102B">B60W40/103</main-classification>
        <further-classification edition="200601120260102B">G01C9/02</further-classification>
        <further-classification edition="200601120260102B">G01M17/007</further-classification>
        <further-classification edition="201001120260102B">B62M6/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商舍弗勒科技股份有限兩合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHAEFFLER TECHNOLOGIES AG &amp; CO. KG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富瑞茂克思　琴路克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FREMAUX, JEAN-LUC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種用於調適診斷範圍的極限值以計算機動兩輪車輛(1)的橫向傾斜角度之方法，該方法由一電子控制單元(11)實施，包括以下步驟：&lt;br/&gt;  在一第一診斷階段中，根據來自該傾斜感測器(111)的預定測量值計算(E3)一診斷值；&lt;br/&gt;  將該診斷值儲存(E5)在該記憶區(112)中；&lt;br/&gt;  在更新該診斷範圍的極限值之一第二階段中，驗證(E9)該車輛(1)的引擎(10)已停止；&lt;br/&gt;  將測量的該傾斜角度與該參考傾斜範圍進行比較(E12)；以及&lt;br/&gt;  如果測量的該傾斜角度在該參考靜止傾斜範圍內，則修改與該第一階段期間計算之該診斷值的符號相對應之該至少一個診斷範圍的極限值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a method for adapting the limits of a diagnostic range for computing the angle of lateral inclination of a motorized two-wheeled vehicle (1), implemented by an electronic control unit (11), comprising the steps of:&lt;br/&gt; - in a first diagnostic phase, computing (E3) a diagnostic value from predefined measurements from the inclination sensor (111),&lt;br/&gt; - storing (E5) the diagnostic value in the memory zone (112),&lt;br/&gt; - in the second phase of updating the limits of the diagnostic range, verifying (E9) that the engine (10) of the vehicle (1) is stopped,&lt;br/&gt; - comparing (E12) the measured angle of inclination with the reference inclination range,&lt;br/&gt; - if the measured angle of inclination is within the reference stationary inclination range, modifying the limit of the at least one diagnostic range corresponding to the sign of the diagnostic value computed during the first phase.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:機動兩輪車輛</p>
        <p type="p">10:引擎</p>
        <p type="p">11:電子控制單元</p>
        <p type="p">12:車架</p>
        <p type="p">111:傾斜感測器</p>
        <p type="p">112:記憶區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1369" publication-number="202615392">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615392</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130620</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鋶鹽型單體、鋶鹽型淬滅劑、聚合物、化學增幅阻劑組成物、及圖案形成方法</chinese-title>
        <english-title>SULFONIUM SALT TYPE MONOMER, SULFONIUM SALT TYPE QUENCHER, POLYMER, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERN FORMING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C59/315</main-classification>
        <further-classification edition="200601120260102B">C07C65/28</further-classification>
        <further-classification edition="200601120260102B">C07C69/78</further-classification>
        <further-classification edition="200601120260102B">C07C309/73</further-classification>
        <further-classification edition="200601120260102B">C07C381/12</further-classification>
        <further-classification edition="200601120260102B">C07D327/08</further-classification>
        <further-classification edition="200601120260102B">C07D333/76</further-classification>
        <further-classification edition="200601120260102B">C09K3/00</further-classification>
        <further-classification edition="200601120260102B">C08F212/14</further-classification>
        <further-classification edition="200601120260102B">C08F212/32</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供在使用高能射線之光微影中，溶劑溶解性優良，為高感度、高對比度，且微影性能優良，同時即使在微細圖案形成時，圖案崩塌耐性強，蝕刻耐性亦優良的係為化學增幅阻劑組成物所含的聚合物之材料的被使用作為鋶鹽型淬滅劑之鋶鹽型單體、由該鋶鹽型單體構成的鋶鹽型淬滅劑、含有來自該鋶鹽型淬滅劑之重複單元的聚合物、含有包含該聚合物之基礎聚合物的化學增幅阻劑組成物、及使用該化學增幅阻劑組成物之圖案形成方法。  &lt;br/&gt;該課題之解決手段為一種鋶鹽型單體，其特徵為係下述通式(a)表示者之鋶鹽型單體。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="180px" width="474px" file="ed10456.JPG" alt="ed10456.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a sulfonium salt type monomer, wherein the sulfonium salt type monomer is represented by the following general formula (a). This can provide: a sulfonium salt type monomer used as a sulfonium salt type quencher that is a material for a polymer contained in a chemically amplified resist composition that has excellent solvent solubility, high sensitivity, high contrast, and excellent lithography performance in lithography using high-energy radiation, and is resistant to pattern collapse even in fine pattern formation and has excellent etching resistance; a sulfonium salt type quencher consisting of the sulfonium salt type monomer; a polymer containing a repeating unit derived from the sulfonium salt type quencher; a chemically amplified resist composition including a base polymer containing the polymer; and a pattern forming method using the chemically amplified resist composition. &lt;br/&gt;&lt;img align="absmiddle" height="131px" width="447px" file="ed10457.JPG" alt="ed10457.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1370" publication-number="202616433">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616433</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130623</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置、溫度控制方法、半導體裝置之製造方法及溫度控制程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/67</main-classification>
        <further-classification edition="200601120260102B">H01L21/324</further-classification>
        <further-classification edition="200601120260102B">G05B11/36</further-classification>
        <further-classification edition="200601120260102B">G05B13/02</further-classification>
        <further-classification edition="200601120260102B">G05D23/32</further-classification>
        <further-classification edition="200601120260102B">G05D23/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉下雅士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGISHITA, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口英人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, HIDETO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>重松聖也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIGEMATSU, SEIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種控制對當前加熱器之供給電力的技術，以使按照預先保持之預測模型而計算出之預測溫度行接近將來之目標溫度行，其係根據當前實測溫度與當前預測溫度的誤差來對上述預測溫度行進行更新，該當前實測溫度係此次實測出之溫度，該當前預測溫度係基於過去實測出之溫度即過去溫度與上述預測溫度行而計算得出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">36:上位控制器</p>
        <p type="p">206:加熱器</p>
        <p type="p">238:溫度控制部</p>
        <p type="p">718:電力供給部</p>
        <p type="p">800:溫度歷程記憶部</p>
        <p type="p">802:電力供給值歷程記憶部</p>
        <p type="p">804:個別特性創建部</p>
        <p type="p">806:目標溫度行計算部</p>
        <p type="p">808:整合特性創建部</p>
        <p type="p">810:約束最佳化計算部</p>
        <p type="p">812:限制器</p>
        <p type="p">F,H,S:輸入端</p>
        <p type="p">P:輸出端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1371" publication-number="202615393">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615393</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130626</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鋶鹽型單體、鋶鹽型淬滅劑、聚合物、化學增幅阻劑組成物及圖案形成方法</chinese-title>
        <english-title>SULFONIUM SALT MONOMER, SULFONIUM SALT QUENCHER, POLYMER, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERNING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C59/70</main-classification>
        <further-classification edition="200601120260102B">C07C65/28</further-classification>
        <further-classification edition="200601120260102B">C07C69/635</further-classification>
        <further-classification edition="200601120260102B">C07C69/78</further-classification>
        <further-classification edition="200601120260102B">C07C309/73</further-classification>
        <further-classification edition="200601120260102B">C07C381/12</further-classification>
        <further-classification edition="200601120260102B">C07D327/08</further-classification>
        <further-classification edition="200601120260102B">C07D333/76</further-classification>
        <further-classification edition="200601120260102B">C09K3/00</further-classification>
        <further-classification edition="200601120260102B">C08F212/14</further-classification>
        <further-classification edition="200601120260102B">C08F212/32</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供在使用高能射線之光微影中，溶劑溶解性優異、高感度、高對比度、微影性能優異而且即使是微細圖案形成時仍耐圖案崩塌、蝕刻耐性也優良的化學增幅阻劑組成物中含有的係作為聚合物之材料之鋶鹽型淬滅劑使用之鋶鹽型單體、由該鋶鹽型單體構成之鋶鹽型淬滅劑、含有來自該鋶鹽型淬滅劑之重複單元之聚合物、包含含有該聚合物之基礎聚合物之化學增幅阻劑組成物、及使用該化學增幅阻劑組成物之圖案形成方法。係一種鋶鹽型單體，其特徵為以下列通式(a)表示。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="218px" width="615px" file="ed10463.JPG" alt="ed10463.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are: a sulfonium salt monomer to be used as a sulfonium salt quencher, which is a material of a polymer to be contained in a chemically amplified resist composition that exhibits superior solubility in solvents and has superior lithographic performance with high sensitivity and high contrast in photolithography with use of a high-energy ray, and also has superior etching resistance with durability against pattern collapse even in fine patterning; a sulfonium salt quencher containing the sulfonium salt monomer; a polymer containing a repeating unit derived from the sulfonium salt quencher; a chemically amplified resist composition containing a base polymer containing the polymer; and a patterning method with the chemically amplified resist composition. A sulfonium salt monomer represented by the following general formula (a): &lt;br/&gt;&lt;img align="absmiddle" height="143px" width="416px" file="ed10464.JPG" alt="ed10464.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1372" publication-number="202616232">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616232</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130627</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>貨幣處理裝置</chinese-title>
        <english-title>CURRENCY PROCESSING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120251128B">G07D11/22</main-classification>
        <further-classification edition="201901120251128B">G07D11/235</further-classification>
        <further-classification edition="201901120251128B">G07D11/18</further-classification>
        <further-classification edition="200601120251128B">G07D3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本金錢機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN CASH MACHINE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅原拓郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGAWARA, TAKURO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種貨幣處理裝置（100），其為具備有：具有門（105）的收納硬幣用之框體（101）、偵測門的開啟關閉用之開關（195）、連接於開關且主旨以保持門為被開啟的狀態用之閂鎖電路（192）、將電力提供至閂鎖電路用之電容器（193）、取得在開始從外部供給電力時之閂鎖電路的狀態控制部（191）；其中閂鎖電路為不包含IC而是含有至少2個電晶體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a currency processing device (100), which comprises a housing (101) for storing coins and having a door (105), a switch (195) for detecting the opening and closing of the door, a latch circuit (192) connected to the switch for maintaining a state indicating that the door is open, a capacitor (193) for supplying power to the latch circuit, and a control unit (191) for acquiring the state of the latch circuit when power begins to be supplied from outside, wherein the latch circuit does not include an IC but includes at least two transistors.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:貨幣處理裝置</p>
        <p type="p">190:控制基板</p>
        <p type="p">191:CPU</p>
        <p type="p">192:閂鎖電路</p>
        <p type="p">193:雙電層電容器</p>
        <p type="p">194:連接器</p>
        <p type="p">195:物理開關</p>
        <p type="p">196:通訊界面</p>
        <p type="p">197:連接器</p>
        <p type="p">200:伺服器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1373" publication-number="202615514">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615514</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130631</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>有機膜形成用組成物、有機膜形成方法、圖案形成方法、及聚合物</chinese-title>
        <english-title>COMPOSITION FOR FORMING ORGANIC FILM, METHOD FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND POLYMER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F220/28</main-classification>
        <further-classification edition="200601120260102B">C08F220/32</further-classification>
        <further-classification edition="200601120260102B">C08F220/56</further-classification>
        <further-classification edition="200601120260102B">C08F290/06</further-classification>
        <further-classification edition="200601120260102B">C08F8/14</further-classification>
        <further-classification edition="200601120260102B">G03F7/11</further-classification>
        <further-classification edition="200601120260102B">G03F7/16</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/40</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新井田恵介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIIDA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本靖之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, YASUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供作為膜形成材料用係為有用之環境負荷少且不屬於PFAS之聚合物。又，提供含有該聚合物之無基板(晶圓)上的針孔等塗佈缺陷且成膜性(面內均勻性)及填埋性等塗佈性優良的有機膜材料組成物及有機膜形成方法。又，提供使用了運用該有機膜形成用組成物之阻劑膜的製程寬容度優良的圖案形成方法。  &lt;br/&gt;該課題之解決手段為一種有機膜形成用組成物，其特徵為含有：  &lt;br/&gt;(A)有機膜形成用材料，  &lt;br/&gt;(B)具有下式(B1)表示之重複單元的聚合物，及  &lt;br/&gt;(C)溶劑。  &lt;br/&gt;&lt;img align="absmiddle" height="33px" width="65px" file="ed10075.JPG" alt="ed10075.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="428px" width="497px" file="ed10076.JPG" alt="ed10076.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;式中，R&lt;sub&gt;1&lt;/sub&gt;為氫原子或甲基，R&lt;sub&gt;2&lt;/sub&gt;及R&lt;sub&gt;3&lt;/sub&gt;分別獨立地為碳數10~20之不含氟原子之1價有機基，X為氮原子或氧原子，W&lt;sub&gt;1&lt;/sub&gt;為單鍵或碳數1~10之也可含有氧原子且不含氟原子之2價連結基。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a composition for forming an organic film, the composition containing (A) a material for forming an organic film, (B) a polymer having a repeating unit represented by the following formula (B1), and (C) a solvent: &lt;br/&gt;&lt;img align="absmiddle" height="177px" width="203px" file="ed10077.JPG" alt="ed10077.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;wherein R&lt;sub&gt;1&lt;/sub&gt; is a hydrogen atom or a methyl group, R&lt;sub&gt;2&lt;/sub&gt; and R&lt;sub&gt;3&lt;/sub&gt; are each independently a monovalent organic group having 10 to 20 carbon atoms and not containing fluorine atom, X is a nitrogen atom or an oxygen atom, and W&lt;sub&gt;1&lt;/sub&gt; is a single bond or a divalent linking group having 1 to 10 carbon atoms and not containing fluorine atom and optionally containing an oxygen atom. This can provide a polymer that is useful for a film forming material, has a low environmental impact, and does not fall under PFAS. Also provided are an organic film material composition containing this polymer that has no coating defects such as pinholes on a substrate (wafer), and is excellent in coatability such as film formability (in-plane uniformity) and filling characteristic, and a method for forming an organic film. Also provided is a patterning process with excellent process tolerance using a resist film that uses this composition for forming an organic film.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">2:被加工層</p>
        <p type="p">2a:圖案(形成於被加工層之圖案)</p>
        <p type="p">3:有機膜</p>
        <p type="p">3a:有機膜圖案</p>
        <p type="p">4:含矽之阻劑中間膜</p>
        <p type="p">4a:含矽之阻劑中間膜圖案</p>
        <p type="p">5:阻劑上層膜</p>
        <p type="p">5a:阻劑上層膜圖案</p>
        <p type="p">6:曝光部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1374" publication-number="202615628">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615628</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130649</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低熔點金屬或合金摻入之微/奈米結構複合材料</chinese-title>
        <english-title>LOW MELTING POINT METAL OR ALLOY INCORPORATED MICRO-/NANO-STRUCTURED COMPOSITE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C09K5/12</main-classification>
        <further-classification edition="200601120260102B">F28D15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商諾微聯科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVOLINC, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申　盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王則驍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZEXIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯春岑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種熱介面組合物，其包含摻有一有效量之低熔點金屬或合金的機械順應性互連微/奈米結構材料，其中該低熔點金屬或合金在大氣壓力下的熔點低於300℃且高於31℃；該微/奈米結構材料具有自持式互連微或奈米結構，且能夠在內部承載該低熔點金屬或合金；該微/奈米結構材料由金屬或半導體或介電材料製成；且該自持式互連微或奈米結構係選自由以下所組成群組之形式：對齊式及/或分散式線、網、核殼、異質結構及其組合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A thermal interface composition comprising a mechanically compliant interconnected micro/nano-structured material incorporated with an effective amount of a low melting point metal or alloy in which the low melting point metal or alloy has a melting point below 300℃ and above 31℃ under atmospheric pressure; the micro/nano-structured material has a self-supporting interconnected micro- or nano-structure and is capable of holding the low melting point metal or alloy internally; the micro/nano-structured material is made of a metal or semiconductor or dielectric material; and the self-supporting interconnected micro- or nano-structure is in a form selected from the group consisting of aligned and/or distributed wires, meshes, core-shells, heterostructures, and combinations thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:微/奈米結構複合材料</p>
        <p type="p">102:散熱器</p>
        <p type="p">103:熱源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1375" publication-number="202615337">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615337</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130660</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磷鹵化合物之純化</chinese-title>
        <english-title>PURIFYING PHOSPHORUS HALIDE COMPOUNDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C01B25/10</main-classification>
        <further-classification edition="200601120260102B">B65D85/84</further-classification>
        <further-classification edition="200601120260102B">F17C1/10</further-classification>
        <further-classification edition="200601120260102B">H01L21/3065</further-classification>
        <further-classification edition="200601120260102B">H01L21/311</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫雷斯基尼　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORESCHINI, PAOLO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪斯彼　喬瑟夫　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DESPRES, JOSEPH R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞倫斯　凱特琳　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAWRENCE, KAITLIN J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於處理高純度磷氟化合物之容器及方法。該容器可包含含有具有至少99.9%之純度之磷氟化合物之氟化磷組分，如藉由氣相層析及/或紅外光譜術所量測。亦揭示包含下列步驟之方法：獲得含有金屬氟磷酸鹽化合物及水之固體組分、加熱該固體組分以去除水及進一步加熱以形成具有如藉由氣相層析及/或紅外光譜術所量測之至少99.9%之純度之磷氟化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure provides a vessel and methods for handling high-purity phosphorus fluoride compounds. The vessel can include a phosphorus fluoride component including a phosphorus fluoride compound with a purity of at least 99.9%, as measured by gas chromatography and/or infrared spectroscopy. Also disclosed is a method which includes obtaining a solid component containing a metal fluorophosphate compound and water, heating the solid component to remove water, and further heating to form a phosphorus fluoride compound with a purity of at least 99.9%, as measured by gas chromatography and/or infrared spectroscopy.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:容器</p>
        <p type="p">110:容器主體</p>
        <p type="p">115:內部體積</p>
        <p type="p">120:內表面</p>
        <p type="p">125:外表面</p>
        <p type="p">130:塗層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1376" publication-number="202615450">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615450</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130668</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>經修飾之ＡＡＶ顆粒</chinese-title>
        <english-title>MODIFIED AAV PARTICLES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07K14/075</main-classification>
        <further-classification edition="200601120260102B">C12N7/01</further-classification>
        <further-classification edition="200601120260102B">C12N15/33</further-classification>
        <further-classification edition="200601120260102B">A61K48/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗蘭肯　琳達　艾莉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRANKEN, LINDA ELISE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法希里　朱莉婭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAKHIRI, JULIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞曼　利普　尼可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAUMANN-LIPP, NICO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿里　阿陶雷曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALI, ATAUREHMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞斯奇　約翰內斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REUSCH, JOHANNES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彼克曼儂　奧里奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRINKMANN, ULRICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱騰伯格　胡伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KETTENBERGER, HUBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞斯蘭德　賽門　托馬斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUSLAENDER, SIMON THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紐荷那　珍斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIEWOEHNER, JENS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬治絲　蓋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GEORGES, GUY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪克歐普夫　史帝芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DICKOPF, STEFFEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛洛紹爾　提爾曼　賽巴斯蒂安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHLOTHAUER, TILMAN SEBASTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文報導一種新穎變異體腺相關病毒 (AAV) 殼體蛋白，其相對於對應的親代 AAV 殼體蛋白包含共價插入該殼體蛋白之 GH 環中的異源性肽或多肽，其中該異源性肽或多肽包含轉麩醯胺酸酶之識別序列且在 AAV-2 之 VP1 (SEQ ID NO: 65) 的位置 452 至 455 或 453 至 459 處或在另一 AAV 血清型之殼體蛋白的對應位置處的胺基酸殘基係經該異源性肽或多肽替換，或插入在胺基酸位置 456 處。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Herein is reported a novel variant adeno-associated virus (AAV) capsid protein comprising a heterologous peptide or polypeptide covalently inserted in the GH-loop of the capsid protein relative to a corresponding parental AAV capsid protein, wherein the heterologous peptide or polypeptide comprises a recognition sequence of a transglutaminase and the amino acids residues at positions 452-455 or 453-459 of VP1 of AAV-2 (SEQ ID NO: 65) or at the corresponding positions in the capsid protein of another AAV serotype are replaced by the heterologous peptide or polypeptide or inserted at amino acid position 456.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1377" publication-number="202615411">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615411</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130671</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鎓鹽、光酸產生劑、化學增幅阻劑組成物、及圖案形成方法</chinese-title>
        <english-title>ONIUM SALT, PHOTOACID GENERATOR, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERNING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C309/42</main-classification>
        <further-classification edition="200601120260102B">C07C309/43</further-classification>
        <further-classification edition="200601120260102B">C07C309/58</further-classification>
        <further-classification edition="200601120260102B">C07C309/71</further-classification>
        <further-classification edition="200601120260102B">C07C309/73</further-classification>
        <further-classification edition="200601120260102B">C07C381/12</further-classification>
        <further-classification edition="200601120260102B">C07D307/93</further-classification>
        <further-classification edition="200601120260102B">C07D327/08</further-classification>
        <further-classification edition="200601120260102B">C07D333/62</further-classification>
        <further-classification edition="200601120260102B">C07D333/76</further-classification>
        <further-classification edition="200601120260102B">C09K3/00</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供在使用高能射線之光微影中，溶劑溶解性優良，為高感度、高對比度，且微影性能優良的化學增幅阻劑組成物中所含之使用作為光酸產生劑的鎓鹽、由該鎓鹽構成的光酸產生劑、含有該光酸產生劑之化學增幅阻劑組成物、及使用該化學增幅阻劑組成物之圖案形成方法。  &lt;br/&gt;該課題之解決手段為一種鎓鹽，其特徵為：係由下述通式(1A)表示之陰離子、及下述通式(1B)表示之陽離子構成。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="310px" width="473px" file="ed10560.JPG" alt="ed10560.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is an onium salt, wherein the onium salt includes an anion represented by the following general formula (1A) and a cation represented by the following general formula (1B). This provides: an onium salt used as a photoacid generator contained in a chemically amplified resist composition having excellent solvent solubility, high sensitivity, high contrast, and excellent lithography performance in photolithography using high-energy beams; a photoacid generator consisting of the onium salt; a chemically amplified resist composition containing the photoacid generator; and a patterning process using the chemically amplified resist composition. &lt;br/&gt;&lt;img align="absmiddle" height="239px" width="453px" file="ed10561.JPG" alt="ed10561.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="142px" width="456px" file="ed10562.JPG" alt="ed10562.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1378" publication-number="202615486">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615486</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130685</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>三維光造形用硬化性組合物及牙科用部件的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F2/44</main-classification>
        <further-classification edition="200601120260102B">C08F222/20</further-classification>
        <further-classification edition="200601120260102B">C08F222/22</further-classification>
        <further-classification edition="200601120260102B">C08F265/06</further-classification>
        <further-classification edition="201701120260102B">B29C64/124</further-classification>
        <further-classification edition="200601120260102B">A61C13/01</further-classification>
        <further-classification edition="202001120260102B">A61K6/887</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商德山牙科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKUYAMA DENTAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>品川裕作</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINAGAWA, YUSAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂田英武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKATA, EIBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKASHIMA, KEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種三維光造形用硬化性組合物，是具有適於透過液槽光聚合法進行的牙科用部件的製造之流動性，並且即使在口腔內長期使用了該牙科用部件後，牙科用部件和襯裡材料或與其相當的其他部件之黏接性也優異；該三維光造形用硬化性組合物，其包含：100質量份之（甲基）丙烯酸酯系聚合性單體成分（A），為含有多官能（甲基）丙烯酸酯系聚合性單體，且不含（甲基）丙烯酸甲酯，0.7 ~ 220質量份之單官能（甲基）丙烯酸酯的聚合物（B），透過凝膠滲透層析法測量之數均分子量為1000 ~ 50000，以及光聚合引發劑（C）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1379" publication-number="202615357">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615357</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130687</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磊晶薄膜及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C01G33/00</main-classification>
        <further-classification edition="200601120260102B">C23C14/08</further-classification>
        <further-classification edition="200601120260102B">C23C14/34</further-classification>
        <further-classification edition="200601120260102B">C30B23/02</further-classification>
        <further-classification edition="200601120260102B">C30B29/30</further-classification>
        <further-classification edition="202301120260102B">H10N30/079</further-classification>
        <further-classification edition="202301120260102B">H10N30/093</further-classification>
        <further-classification edition="202301120260102B">H10N30/85</further-classification>
        <further-classification edition="202301120260102B">H10N30/853</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商新柯隆股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINCRON CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稲瀬陽介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INASE, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為了將不具旋轉雙晶且發揮與理想的完全結晶比較仍不遜色的特性的磊晶薄膜形成在LN單晶或LT單晶等的表面，藉由高頻濺鍍法在基板的表面磊晶成長在作為母材的鈮酸鋰或鉭酸鋰摻鈉、鉀、銣、銫或鍅任一種鹼金族元素的磊晶薄膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:磊晶薄膜的製造裝置</p>
        <p type="p">2:基板</p>
        <p type="p">11:反應室</p>
        <p type="p">12A,12B:濺鍍電極</p>
        <p type="p">13:基座</p>
        <p type="p">111:成膜室</p>
        <p type="p">112:排氣口</p>
        <p type="p">113:排氣裝置</p>
        <p type="p">121A,121B:靶材</p>
        <p type="p">122:遮蔽板</p>
        <p type="p">123:多孔金屬板</p>
        <p type="p">124:多孔石英板</p>
        <p type="p">125:氣體供應裝置</p>
        <p type="p">131:旋轉軸</p>
        <p type="p">132:驅動裝置</p>
        <p type="p">133:加熱器</p>
        <p type="p">134:高頻整合器</p>
        <p type="p">135:直流電源</p>
        <p type="p">PL1:面法線</p>
        <p type="p">PL2:基板法線</p>
        <p type="p">α:傾斜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1380" publication-number="202615179">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615179</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130692</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>棒材長度判定裝置、棒材長度判定方法、棒材長度判定程式及加工系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251231B">B23B13/00</main-classification>
        <further-classification edition="200601120251231B">B23Q15/00</further-classification>
        <further-classification edition="200601120251231B">G05B19/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商西鐵城精機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CITIZEN MACHINERY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡部修一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATABE, SYUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安藤颯一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDO, SOICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種當將複數個種類的工件分別依所期望的預定數量來依序加工時，連續的加工處理中斷的疑慮較低之棒材長度判定裝置。&lt;br/&gt;  [解決手段]棒材長度判定裝置10具有：加工處理資訊取得部24，取得顯示從棒材100依序加工複數個第1工件之第1加工處理已結束的第1加工處理結束資訊；棒材長度資訊取得部25，取得顯示第1加工處理結束時的棒材100的長度之棒材長度資訊；判定部26，判定棒材的長度是否為在第1加工處理的下一個處理所加工的第2工件的加工長度以上；及輸出部27，當判定為棒材100的長度不是第2工件的加工長度以上時，輸出顯示棒材100的更換之棒材更換訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:加工系統</p>
        <p type="p">10:工作機械</p>
        <p type="p">11:主軸</p>
        <p type="p">11a:夾頭</p>
        <p type="p">12:刀具台</p>
        <p type="p">13:工具</p>
        <p type="p">15:NC裝置</p>
        <p type="p">16:通訊部</p>
        <p type="p">17:記憶部</p>
        <p type="p">17a:排程程式</p>
        <p type="p">17b1:第1加工程式</p>
        <p type="p">17b2:第2加工程式</p>
        <p type="p">17bN:第N加工程式</p>
        <p type="p">17c:棒材長度判定程式</p>
        <p type="p">17d:加工長度表</p>
        <p type="p">18:輸入部</p>
        <p type="p">19:顯示部</p>
        <p type="p">20:處理部</p>
        <p type="p">21:排程運作部</p>
        <p type="p">221:第1加工處理部</p>
        <p type="p">222:第2加工處理部</p>
        <p type="p">22N:第N加工處理部</p>
        <p type="p">23:棒材長度判定部</p>
        <p type="p">24:加工處理資訊取得部</p>
        <p type="p">25:棒材長度資訊取得部</p>
        <p type="p">26:判定部</p>
        <p type="p">27:輸出部</p>
        <p type="p">30:供材機</p>
        <p type="p">31:推桿</p>
        <p type="p">31a:指形夾頭</p>
        <p type="p">32:推桿驅動馬達</p>
        <p type="p">33:推桿驅動機構</p>
        <p type="p">34:棒材位置感測器</p>
        <p type="p">35:供材控制裝置</p>
        <p type="p">36:供材通訊部</p>
        <p type="p">37:供材記憶部</p>
        <p type="p">38:供材處理部</p>
        <p type="p">100:棒材</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1381" publication-number="202616217">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616217</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130696</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>幾何升取樣</chinese-title>
        <english-title>GEOMETRIC UPSAMPLING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260102B">G06T7/593</main-classification>
        <further-classification edition="202401120260102B">G06T3/40</further-classification>
        <further-classification edition="202201120260102B">G06V10/82</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　潔米明杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JAMIE MENJAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露之某些態樣提供用於將輸入資料升取樣之技術，其包括：以一第一解析度將輸入資料輸入至包含複數個選擇性核心之一機器學習(machine learning, ML)模型中，該複數個選擇性核心之各者經組態以執行一不同類型之選擇性以將該輸入資料升取樣；及自該ML模型以一第二解析度獲得對應於該輸入資料的輸出資料，該第二解析度高於該第一解析度，其中該輸出資料基於來自該複數個選擇性核心之輸出的一綜合(composite)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Certain aspects of the present disclosure provide techniques for upsampling input data including inputting input data at a first resolution into a machine learning (ML) model comprising a plurality of selectivity kernels, each of the plurality of selectivity kernels configured to perform a different type of selectivity to upsample the input data; and obtaining output data, corresponding to the input data, at a second resolution, from the ML model, the second resolution being higher than the first resolution, wherein the output data is based on a composite of outputs from the plurality of selectivity kernels.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:方法</p>
        <p type="p">1002,1004:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1382" publication-number="202615911">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615911</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130715</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於多波長反射器的二元傅立葉域合成光柵</chinese-title>
        <english-title>BINARY, FOURIER DOMAIN-SYNTHESIZED GRATINGS FOR MULTIPLE WAVELENGTH REFLECTORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">G02B6/124</main-classification>
        <further-classification edition="200601120260108B">G02B5/18</further-classification>
        <further-classification edition="200601120260108B">G02B6/293</further-classification>
        <further-classification edition="200601120260108B">H01S5/125</further-classification>
        <further-classification edition="200601120260108B">H04J14/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商昆特森有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUINTESSENT INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯佐克　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SZOKE, SZILARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝爾特　Ｍ　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELT, MICHAEL LAWRENCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾爾曼　Ｊ　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NORMAN, JUSTIN COLBY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達文波特　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAVENPORT, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及一種用於產生特定光譜響應的二元傅立葉光柵，包括多個光柵超結構，所述多個光柵超結構沿光訊號的傳播方向彼此順序相鄰地設置。每個光柵超結構包括具有交替折射率的連續區段以及一個或多個折射率不交替的相移區段。所述一個或多個相移區段的位置決定了在特定波長處的反射以及在所述特定波長之外對反射的抑制，並且所述光柵超結構的長度決定了所述特定波長之間的波長間距，從而產生所述特定光譜響應。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A binary Fourier grating for producing a specified spectral response includes a plurality of grating superstructures disposed sequentially adjacent with respect to one another along a propagation direction of a light signal. Each of the grating superstructures have sequential sections with alternating refractive indices and one or more phase shift sections in which the refractive index does not alternate. A location of the one or more phase shift sections determines reflections at specified wavelengths and suppression of reflections outside of the specified wavelengths and a length of the grating superstructure determines a wavelength spacing between the specified wavelengths to thereby produce the specified spectral response.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1383" publication-number="202615412">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615412</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130716</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鎓鹽、化學增幅阻劑組成物及圖案形成方法</chinese-title>
        <english-title>ONIUM SALT, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERNING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C309/42</main-classification>
        <further-classification edition="200601120260102B">C07C309/43</further-classification>
        <further-classification edition="200601120260102B">C07C309/58</further-classification>
        <further-classification edition="200601120260102B">C07C309/71</further-classification>
        <further-classification edition="200601120260102B">C07C309/73</further-classification>
        <further-classification edition="200601120260102B">C07C381/12</further-classification>
        <further-classification edition="200601120260102B">C07D307/93</further-classification>
        <further-classification edition="200601120260102B">C07D327/08</further-classification>
        <further-classification edition="200601120260102B">C07D333/54</further-classification>
        <further-classification edition="200601120260102B">C07D333/76</further-classification>
        <further-classification edition="200601120260102B">C09K3/00</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供作為在使用高能射線之光微影中，溶劑溶解性優異、高感度、高對比度且微影性能優異化學增幅阻劑組成物中含有的光酸產生劑使用之鎓鹽、由該鎓鹽構成之光酸產生劑、含有該光酸產生劑之化學增幅阻劑組成物、及使用該化學增幅阻劑組成物之圖案形成方法。一種鎓鹽，其特徵為由下列通式(1A)表示之陰離子、及下列通式(1B)表示之陽離子構成。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="264px" width="574px" file="ed10570.JPG" alt="ed10570.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="178px" width="592px" file="ed10571.JPG" alt="ed10571.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is an onium salt composed of: an anion represented by general formula (1A); and a cation represented by general formula (1B). This can provide an onium salt used as a photoacid generator contained in a chemically amplified resist composition with excellent solvent solubility, high sensitivity, high contrast, and excellent lithography performance in photolithography using high-energy radiation; a photoacid generator composed of the onium salt; a chemically amplified resist composition containing the photoacid generator; and a patterning process using the chemically amplified resist composition. &lt;br/&gt;&lt;img align="absmiddle" height="269px" width="465px" file="ed10572.JPG" alt="ed10572.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1384" publication-number="202615030">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615030</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130720</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>新穎甲基喹唑啉酮衍生物</chinese-title>
        <english-title>NEW METHYLQUINAZOLINONE DERIVATIVES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/517</main-classification>
        <further-classification edition="200601120260102B">A61K31/145</further-classification>
        <further-classification edition="200601120260102B">A61K31/4025</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫埃尼　倫茨　菲利普　約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUENI RENZ, PHILIPP JOSEF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克雷托奇威　妮可　安東妮亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRATOCHWIL, NICOLE ANTONIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩塔佐尼　皮爾喬喬　弗朗西斯　托馬斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PETTAZZONI, PIERGIORGIO FRANCESCO TOMMASO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里恩　卡洛琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RYNN, CAROLINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>衛奇曼　裘根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WICHMANN, JUERGEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具有通式 (I) 的新穎化合物，  &lt;br/&gt;&lt;img align="absmiddle" height="145px" width="320px" file="ed10057.JPG" alt="ed10057.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;   &lt;br/&gt;或其醫藥上可接受之鹽，且其中 X、R&lt;sub&gt;1&lt;/sub&gt; 至 R&lt;sup&gt;6&lt;/sup&gt; 係如本文所述。該式 (I) 化合物可用為藥物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a novel compound having the general formula (I) &lt;br/&gt;&lt;img align="absmiddle" height="154px" width="324px" file="ed10058.JPG" alt="ed10058.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; , &lt;br/&gt;or a pharmaceutically acceptable salt thereof, and wherein X, R&lt;sub&gt;1&lt;/sub&gt;-R&lt;sup&gt;6&lt;/sup&gt; are as described herein. The compound of formula (I) can be used as a medicament.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1385" publication-number="202616775">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616775</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130734</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H05H1/34</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商牛尾電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USHIO DENKI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石田賢志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIDA, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平岡尊宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAOKA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村謙介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, KENSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三浦真毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIURA, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種提高了在電漿噴出開口延伸方向上，含電漿氣體的噴出量之均勻性的電漿處理裝置。  &lt;br/&gt;　　電漿處理裝置具備：(a)氣體導入部，其將原料氣體導入至前述電漿處理裝置的內部；(b)流速抑制器，其抑制從前述氣體導入部導入之前述原料氣體的流速；(c)氣體分配流路，其具有複數個氣體分配口，將通過前述流速抑制器的前述原料氣體分配至前述複數個氣體分配口；(d)電漿生成部，其具備電漿生成空間、及連接前述複數個氣體分配口的各個與前述電漿生成空間之間的複數個分支管；(e)一對電極，其以夾持前述電漿生成空間之方式配置；及(f)開口，其噴出含電漿氣體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一構件(第二電極)</p>
        <p type="p">2:第二構件</p>
        <p type="p">3:氣體導入管</p>
        <p type="p">5:電漿噴出開口</p>
        <p type="p">10:第一電極</p>
        <p type="p">15:第二電極(第一構件)</p>
        <p type="p">27:電漿生成空間</p>
        <p type="p">30:介電質基板</p>
        <p type="p">60:氣體導入部</p>
        <p type="p">63:高電壓電源裝置</p>
        <p type="p">70:流速抑制器</p>
        <p type="p">70a:第一流速抑制器</p>
        <p type="p">70b:第二流速抑制器</p>
        <p type="p">71:封閉流路</p>
        <p type="p">100:電漿處理裝置</p>
        <p type="p">G1:含電漿氣體</p>
        <p type="p">GF:氣流</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1386" publication-number="202616369">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616369</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130814</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磊晶方法、處理形成於半導體基板之上的膜層的方法及半導體叢集工具</chinese-title>
        <english-title>METHOD FOR EPITAXIAL CRYSTALLIZATION, METHOD OF PROCESSING A FILM LAYER FORMED OVER A SEMICONDUCTOR SUBSTRATE AND SEMICONDUTOR CLUSTER TOOL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/265</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肯尼迪　邁克爾　諾埃爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KENNEDY, MICHAEL NOEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢特曼　克里斯多夫　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATEM, CHRISTOPHER R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐爾森　約瑟　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLSON, JOSEPH C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里維拉　阿里安娜　多納泰拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIVERA, ARIANNA DONATELLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中揭露用於積體處理架構上的磊晶結晶的方法及系統。在一些實施例中，一種方法可包括對半導體基板實行第一電漿處置，以沿著半導體基板的上表面移除原生氧化物層；以及藉由對半導體基板實行第二電漿處置而在上表面之上形成膜層。所述方法可更包括實行離子植入製程以使膜層結晶，其中植入製程包括在半導體基板處於大於100℃的溫度下的同時向膜層遞送離子物種。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are methods and systems for epitaxial crystallization on an integrated processing architecture. In some embodiments, a method may include performing a first plasma treatment on a semiconductor substrate to remove a native oxide layer along an upper surface of the semiconductor substrate, and forming a film layer over the upper surface by performing a second plasma treatment on the semiconductor substrate. The method may further include performing an ion implantation process to crystallize the film layer, wherein the implant process comprises delivering an ion species to the film layer while the semiconductor substrate is at a temperature greater than 100°C.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:半導體基板</p>
        <p type="p">403:鰭結構</p>
        <p type="p">404:基板基部</p>
        <p type="p">407:頂表面</p>
        <p type="p">409:側壁</p>
        <p type="p">411:基部表面</p>
        <p type="p">416:膜層</p>
        <p type="p">418:離子物種</p>
        <p type="p">421:垂線</p>
        <p type="p">β:非零角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1387" publication-number="202615586">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615586</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130816</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>研磨墊</chinese-title>
        <english-title>POLISHING PADPAD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08L75/08</main-classification>
        <further-classification edition="200601120260102B">C08K5/18</further-classification>
        <further-classification edition="200601120260102B">C08K5/3442</further-classification>
        <further-classification edition="200601120260102B">C08J5/14</further-classification>
        <further-classification edition="200601120260102B">C08J9/12</further-classification>
        <further-classification edition="201201120260102B">B24B37/24</further-classification>
        <further-classification edition="200601120260102B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商霓塔杜邦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTA DUPONT INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村上陽平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKAMI, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薄谷美由紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USUTANI, MIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川端丈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWABATA, JO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種能夠提昇機械研磨力之研磨墊。  &lt;br/&gt;本發明之研磨墊於表示形成研磨面之聚胺基甲酸酯樹脂發泡體之與厚度方向正交之面方向之剖面且經二值化處理之CT圖像中，以規定步序抽選出規定數量之100 μm×100 μm之正方形區域，針對構成各正方形區域之所有像素，對表示氣孔之白色像素賦予1，對表示樹脂之黑色像素賦予100，將各正方形區域之總像素數設為N，將被賦予0之白色像素數設為a，並且將被賦予100之黑色像素數設為b，並藉由(0×a＋100×b)/N算出各正方形區域中之樹脂存在比，於將上述樹脂存在比為90以上之正方形區域設為有效樹脂區域時，由[(上述有效樹脂區域之數量)/(上述正方形區域之總數)]×100算出之有效樹脂比率為2%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide a polishing pad capable of improving mechanical polishing force. &lt;br/&gt;A polishing pad according to the present invention having an effective resin ratio of 2% or more which is obtained by calculating [(number of effective resin regions)/(total number of square regions)] × 100, when a square region having a resin presence ratio of 90 % or more is designated as the effective resin ratio, the resin presence ratio being obtained by:extracting a certain number of 100 μm × 100 μm square regions in a certain procedure in a 2 valued CT image showing a cross section in a plane direction orthogonal to a thickness direction of a polyurethane resin foam forming a polishing surface; giving 1 to a white pixel showing a pore, while giving 100 to a black pixel showing a resin, of all the pixels constituting each of the square regions; and obtaining the resin presence ratio of each of the square regions by (0 × a + 100 × b) /N, in which N represents the total number of pixels in each of the square regions, a represents the number of white pixels to each of which 0 is given, and b represents the number of black pixels to each of which 100 is given.</p>
      </isu-abst>
      <representative-img>
        <p type="p">CI:縮小圖像</p>
        <p type="p">MA:測定區域</p>
        <p type="p">Pa:白色像素</p>
        <p type="p">Pb:黑色像素</p>
        <p type="p">SA:正方形區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1388" publication-number="202616275">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616275</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130821</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有背側連接之雙側記憶體陣列</chinese-title>
        <english-title>DOUBLE SIDE MEMORY ARRAY WITH BACKSIDE CONNECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G11C5/02</main-classification>
        <further-classification edition="200601120260102B">G11C11/40</further-classification>
        <further-classification edition="200601120260102B">G11C7/18</further-classification>
        <further-classification edition="200601120260102B">G11C8/14</further-classification>
        <further-classification edition="200601120260102B">H01L21/768</further-classification>
        <further-classification edition="200601120260102B">H01L23/535</further-classification>
        <further-classification edition="202501120260102B">H10D62/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳　炳林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RYU, ALBERT B.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露的本文係有關於一種裝置，其包含記憶體晶片、另一記憶體晶片、以及在記憶體晶片與另一記憶體晶片之間的電路晶片，其中電路晶片係透過不同連接而連接至記憶體晶片以及另一記憶體晶片。記憶體晶片可包括第一記憶體陣列以及第一接合墊，以及另一記憶體晶片可包括第二記憶體陣列以及第二接合墊。電路晶片可包括在耦接至第一接合墊之電路晶片之第一表面上的第三接合墊，以及耦接至第二接合墊之電路晶片之第二表面上的第四接合墊。電路晶片可包括透過前側連接耦接至第三接合墊的電晶體以及透過背側連接耦接至第四接合墊的另一電晶體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are related to a device comprising a memory chip, another memory chip, and a circuit chip between the memory chip and the another memory chip, where the circuit chip is connected to the memory chip and the another memory chip through different connections. The memory chip may include a first memory array and a first bond pad, and the another memory chip may include a second memory array and a second bond pad. The circuit chip may include a third bond pad on a first surface of the circuit chip coupled to the first bond pad, and a fourth bond pad on a second surface of the circuit chip coupled to the second bond pad. The circuit chip may include a transistor coupled to the third bond pad through a front side connection and another transistor coupled to the fourth bond pad through a backside connection.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120A:記憶體裝置</p>
        <p type="p">BP:接合墊</p>
        <p type="p">CC:電路晶片</p>
        <p type="p">HR1,HR2,HR3,HR4:引線區域</p>
        <p type="p">MC1,MC2:記憶體晶片</p>
        <p type="p">MR1,MR2:記憶體區域</p>
        <p type="p">PERI:外圍電路區域</p>
        <p type="p">PR1,PR2,PR3:墊區域</p>
        <p type="p">SR:感測放大器區域</p>
        <p type="p">XR1,XR2:傳輸區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1389" publication-number="202615663">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615663</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130827</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於生產治療性構築體之載體</chinese-title>
        <english-title>VECTORS FOR PRODUCTION OF THERAPEUTIC CONSTRUCTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C12N15/48</main-classification>
        <further-classification edition="200601120260102B">A61K48/00</further-classification>
        <further-classification edition="200601120260102B">A61K31/7088</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商凱特製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITE PHARMA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖　海濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, EDWARD H.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供DNA分子，諸如轉移質體，其可用於製造經包裝反轉錄病毒載體，該等載體編碼治療性蛋白質，諸如嵌合抗原受體(CAR)及T細胞受體(TCR)。DNA分子中經編碼之反轉錄病毒轉錄本包括轉殖基因、可操作地連接至轉殖基因之延伸因子1-α1 (EF1α)啟動子（不具有EF1α內含子）、及Rev反應元件(RRE)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides DNA molecules, such as transfer plasmids, useful for manufacturing packaged retroviral vectors encoding a therapeutic protein such as chimeric antigen receptors (CARs) and T cell receptors (TCRs). The encoded retroviral transcript in the DNA molecule includes a transgene, an elongation factor 1-alpha 1 (EF1α) promoter, without the EF1α intron, operably linked to the transgene and a Rev response element (RRE).</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1390" publication-number="202616787">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616787</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130834</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配線電路基板</chinese-title>
        <english-title>PRINTED CIRCUIT BOARD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H05K1/11</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今谷梨乃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMATANI, RINO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高野譽大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKANO, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊池泰明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, YASUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">配線電路基板具備透明基板、及在透明基板上形成為網孔狀之金屬層。金屬層包含複數個交點部、及將複數個交點部相連之複數個配線部。各配線部具有1μm以上且10μm以下的寬度W。在透明基板的一面上規定有用來形成複數個交點部的複數個交點形成區域、及用來形成複數個配線部的複數個配線形成區域。包圍各交點形成區域之交點包圍區域藉由從該交點形成區域延伸出之複數個配線形成區域而被分割成複數個小區域。金屬層當中，形成為從形成在各交點形成區域上之交點部超出到包圍該交點形成區域之各小區域上之部分的面積為4.00μm&lt;sup&gt;2&lt;/sup&gt;以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:配線電路基板</p>
        <p type="p">10:透明基板</p>
        <p type="p">20:金屬層</p>
        <p type="p">21:交點部</p>
        <p type="p">22:配線部</p>
        <p type="p">90:覆蓋絕緣層</p>
        <p type="p">A-A:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1391" publication-number="202615377">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615377</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130836</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製造部分氯化烷烴之裝置</chinese-title>
        <english-title>DEVICE FOR PRODUCING PARTIALLY CHLORINATED ALKANES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C17/02</main-classification>
        <further-classification edition="200601120260102B">C07C17/38</further-classification>
        <further-classification edition="200601120260102B">C07C19/045</further-classification>
        <further-classification edition="200601120260102B">B01J19/24</further-classification>
        <further-classification edition="200601120260102B">F25B27/02</further-classification>
        <further-classification edition="200601120260102B">F28D21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商蒂森克魯伯伍德有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THYSSENKRUPP UHDE GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商蒂森克魯伯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THYSSENKRUPP AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商西湖維諾立有限兩合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WESTLAKE VINNOLIT GMBH &amp; CO. KG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班傑　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENJE, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡默霍夫　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMMERHOFER, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克雷奇　克勞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KREJCI, KLAUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克萊伯　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLEIBER, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關一種用於製造部分氯化烷烴之裝置，可使於製造部分氯化烷烴期間所產生之反應熱有效地排出並於其他處加以利用。本發明亦有關一種可藉由此裝置實施之製造部分氯化烷烴之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a device for producing partially chlorinated alkanes which allows the reaction heat that arises during the production of the partially chlorinated alkanes to be discharged efficiently and used elsewhere. The present invention also relates to a method for producing partially chlorinated alkanes which can be carried out using the device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:循環式反應器</p>
        <p type="p">2:氯/氯化氣體</p>
        <p type="p">4:上升管</p>
        <p type="p">5:循環之EDC</p>
        <p type="p">6:EDC循環流/循環流</p>
        <p type="p">7:部分/EDC分流/第一分流</p>
        <p type="p">8:下降管/下降區</p>
        <p type="p">9:循環泵浦</p>
        <p type="p">10:液體噴射式氣體壓縮器/混合裝置</p>
        <p type="p">12:EDC分流/第二分流</p>
        <p type="p">13:氣態EDC流/氣態產品流</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1392" publication-number="202615687">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615687</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130852</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於低頻線寬粗糙度降低之反應性層</chinese-title>
        <english-title>RESPONSIVE LAYER FOR LOW FREQUENCY LINE WIDTH ROUGHNESS REDUCTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C23C16/04</main-classification>
        <further-classification edition="200601120260105B">C23C16/40</further-classification>
        <further-classification edition="200601120260105B">C01B13/28</further-classification>
        <further-classification edition="200601120260105B">G03F7/028</further-classification>
        <further-classification edition="201201120260105B">G03F1/22</further-classification>
        <further-classification edition="200601120260105B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃特基　魯迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOJTECKI, RUDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡納卡沙巴帕斯　西法納迪哈克利錫南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANAKASABAPATHY, SIVANANDHA KRISHNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黄志宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, ZHIYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文所描述的實施例涉及一種方法，包含在提供於包含反應性層的圖案化堆疊上方的阻劑層中形成圖案。在實施例中，該方法可能包含將圖案轉移到反應性層中，並對反應性層施加處理。在實施例中，該處理引發反應性層中的拉伸應力，並降低圖案的線寬粗糙度（LWR）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments described herein relate to a method that includes forming a pattern in a resist layer that is provided over a patterning stack that includes a responsive layer. In an embodiment, the method may include transferring the pattern into the responsive layer, and applying a treatment to the responsive layer. In an embodiment, the treatment induces a tensile stress in the responsive layer and reduces a line width roughness (LWR) of the pattern.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:裝置</p>
        <p type="p">105:基板</p>
        <p type="p">110:圖案化阻劑層</p>
        <p type="p">111:側壁</p>
        <p type="p">λ:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1393" publication-number="202616434">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616434</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130859</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/67</main-classification>
        <further-classification edition="200601120260102B">C23C16/455</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>照内怜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERUUCHI, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩瀬正廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWASE, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>網倉紀彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMIKURA, NORIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種簡化基板處理裝置之組裝或維護之技術。基板處理裝置具備：框架；複數個公用設施供給管線，其等沿著框架延伸；複數個第1連接器單元，複數個第1連接器單元之各者具有電性連接或流體連接於複數個公用設施供給管線之各者之複數個第1公用設施連接器；及複數個分割腔室單元，複數個分割腔室單元之各者具有可裝卸地連接於複數個第1連接器單元中之任一者之複數個第2連接器單元，複數個第2連接器單元之各者具有與複數個第1公用設施連接器分別對應之複數個第2公用設施連接器，複數個第2公用設施連接器之各者經由對應之第1公用設施連接器而電性連接或流體連接於對應之公用設施供給管線，複數個分割腔室單元於複數個第2連接器單元連接於複數個第1連接器單元時構成1個基板處理腔室單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:控制部</p>
        <p type="p">2a:電腦</p>
        <p type="p">2a1:處理部</p>
        <p type="p">2a2:記憶部</p>
        <p type="p">2a3:通信介面</p>
        <p type="p">3:基板處理裝置</p>
        <p type="p">40:大氣部</p>
        <p type="p">41,42:裝載閉鎖模組</p>
        <p type="p">43:大氣搬送模組</p>
        <p type="p">44:負載埠</p>
        <p type="p">45,55:基板搬送機構</p>
        <p type="p">50:減壓部</p>
        <p type="p">53:真空搬送模組</p>
        <p type="p">60:分割腔室單元</p>
        <p type="p">65:氣體箱單元</p>
        <p type="p">71:開口</p>
        <p type="p">100:框架</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1394" publication-number="202616308">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616308</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130868</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>線圈裝置</chinese-title>
        <english-title>COIL DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01F27/28</main-classification>
        <further-classification edition="200601120260102B">H01F27/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電工印刷電路股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮原将希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYABARA, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種提高電感特性之線圈裝置。  &lt;br/&gt;本發明之線圈裝置包含：基底膜、第1配線、及第2配線。基底膜具有第1主面及第2主面。第1配線具有：第1捲繞部，其配置於第1主面上，且於俯視下呈螺旋狀捲繞；及第2捲繞部，其配置於第2主面上，且於俯視下呈螺旋狀捲繞。第2配線具有：第3捲繞部，其配置於第1主面上，且於俯視下呈螺旋狀捲繞；及第4捲繞部，其配置於第2主面上，且於俯視下呈螺旋狀捲繞。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A coil device includes: a base film; a first wire; and a second wire. The base film has a first main surface and a second main surface. The first wire has a first wound portion disposed on the first main surface and a second wound portion disposed on the second main surface, each of the first wound portion and the second wound portion being a portion where the first wire is wound spirally in a plan view. The second wire has a third wound portion disposed on the first main surface and a fourth wound portion disposed on the second main surface, each of the third wound portion and the fourth wound portion being a portion where the second wire is wound spirally in a plan view.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基底膜</p>
        <p type="p">10a,10b:主面</p>
        <p type="p">20:配線</p>
        <p type="p">21:第1捲繞部</p>
        <p type="p">22:第2捲繞部</p>
        <p type="p">30:配線</p>
        <p type="p">31:第3捲繞部</p>
        <p type="p">32:第4捲繞部</p>
        <p type="p">41:晶種層</p>
        <p type="p">42:無電解鍍覆層</p>
        <p type="p">43:電解鍍覆層</p>
        <p type="p">100:線圈裝置</p>
        <p type="p">H1,H2:高度</p>
        <p type="p">SP1,SP2:間隔</p>
        <p type="p">W1,W2,W3,W4:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1395" publication-number="202615727">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615727</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130878</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於金屬電鍍之包含用於無缺陷填充電子基板上之特徵之添加劑之組成物</chinese-title>
        <english-title>COMPOSITION FOR METAL ELECTROPLATING COMPRISING AN ADDITIVE FOR DEFECT-FREE FILLING OF FEATURES ON ELECTRONIC SUBSTRATES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C25D3/38</main-classification>
        <further-classification edition="200601120260102B">C25D7/12</further-classification>
        <further-classification edition="200601120260102B">H01L21/288</further-classification>
        <further-classification edition="200601120260102B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴斯夫歐洲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈格　亞莉珊卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAAG, ALEXANDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞諾　馬可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARNOLD, MARCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安傑哈德特　納迪尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENGELHARDT, NADINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於銅電鍍的非酸性水性組成物，其包含(a)銅離子；(b)至少一種式S1的添加劑  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="113px" width="483px" file="ed10030.JPG" alt="ed10030.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;                                              。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a non-acidic aqueous composition for copper electroplating comprising (a) copper ions; (b) at least one additive of formula &lt;sup&gt;S1&lt;/sup&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="105px" width="521px" file="ed10031.JPG" alt="ed10031.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1396" publication-number="202615379">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615379</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130881</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有１，１，１，２－四氟乙烷的組成物及其保存方法</chinese-title>
        <english-title>COMPOSITION CONTAINING 1,1,1,2-TETRAFLUOROETHANE AND ITS PRESERVATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C19/08</main-classification>
        <further-classification edition="200601120260102B">C07C17/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大金工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江藤友亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ETO, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村新吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黒木克親</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUROKI, YOSHICHIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉山明平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIYAMA, AKINARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關一種組成物，其係含有具有1,1,1,2-四氟乙烷及1個以上的雙鍵之氟碳系化合物的組成物，且氧濃度係5.0體積ppm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is related to a composition, which is a composition containing a fluorocarbon compounds having a 1,1,2,2-tetrafluoroethane and at least one douible-bond, and the oxygen concentration is below 5.0 volumn ppm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">本案無圖式。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1397" publication-number="202615918">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615918</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130889</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有可釋放連接的雷射封裝的積體電路模組</chinese-title>
        <english-title>INTEGRATED CIRCUIT MODULE WITH RELEASABLY ATTACHED LASER PACKAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">G02B6/42</main-classification>
        <further-classification edition="202101120260108B">H01S5/0239</further-classification>
        <further-classification edition="200601120260108B">G02B6/43</further-classification>
        <further-classification edition="200601120260108B">G02B6/36</further-classification>
        <further-classification edition="202301120260108B">H01L25/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾斯史卡佩光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XSCAPE PHOTONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉古納坦　維偉克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAGHUNATHAN, VIVEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋米　艾倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHAEMI, ALLAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>門多薩　費迪南德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENDOZA, FERDINAND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李普森　米夏爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIPSON, MICHAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種模組，包含：光子積體電路（PIC），PIC包含一或多個用於引導光訊號的波導；電子積體電路（EIC），EIC堆疊在PIC上並與PIC電連接；雷射封裝，包含半導體雷射；以及連接器組件，用於將雷射封裝可拆卸地連接至模組，連接器組件包含一或多個光學元件，用於接收來自雷射封裝的光訊號，並將光訊號耦合至PIC中的一或多個波導。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A module includes a photonic integrated circuit (PIC) including one or more waveguides for guiding optical signals; an electronic integrated circuit (EIC) stacked on the PIC and electrically connected to the PIC; a laser package including a semiconductor laser; and a connector assembly configured to releasably attach the laser package to the module, the connector assembly including one or more optical elements arranged to receive the optical signals from the laser package and to couple the optical signals into the one or more waveguides in the PIC.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:模組</p>
        <p type="p">102:電子積體電路(EIC)</p>
        <p type="p">104:光子積體電路(PIC)</p>
        <p type="p">104a:上表面</p>
        <p type="p">104b:下表面</p>
        <p type="p">105:波導</p>
        <p type="p">106:基板</p>
        <p type="p">108:連接器組件</p>
        <p type="p">110:處理器</p>
        <p type="p">112:穿矽通孔(TSV)</p>
        <p type="p">114a:焊球陣列</p>
        <p type="p">114b:焊球陣列</p>
        <p type="p">116:雷射封裝</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1398" publication-number="202616064">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616064</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130918</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置以及磁碟區管理器的操作方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND OPERATION METHOD OF VOLUME MANAGER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">G06F3/06</main-classification>
        <further-classification edition="200601120251201B">G06F12/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩哈　馬諾伊　普拉瓦卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAHA, MANOJ PRAVAKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BD</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅伊　索姆納特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROY, SOMNATH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿魯　達斯　貝尼松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARUL DHAS, BENIXON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅吉　哈爾西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROOGI, HARSH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供方法和裝置，其中磁碟區管理器接收具有對應磁碟區邏輯區塊位址（vLBA）集合的命令。磁碟區管理器基於對應vLBA集合，確定儲存裝置中用於區塊卷儲存的可變粒度磁碟區對應圖（VVM）的儲存桶。VVM的條目被分割成儲存桶，且條目包含可變vLBA範圍。磁碟區管理器基於確定的儲存桶，確定VVM中vLBA集合的條目或區塊卷儲存的細粒度磁碟區對應圖（FVM）。FVM包含每vLBA粒度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and devices are provided in which a volume manager receives a command with a corresponding volume logical block address (vLBA) set. The volume manager determines a bucket of a variable-granularity volume map (VVM) for block volume storage in a storage device, based on the corresponding vLBA set. Entries of the VVM are divided into buckets and the entries comprise a variable vLBA range. The volume manager determines an entry for the vLBA set in the VVM or a fine-grained volume map (FVM) for the block volume storage, based on the determined bucket. The FVM comprises a per vLBA granularity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:儲存系統</p>
        <p type="p">102:主機</p>
        <p type="p">104:儲存裝置</p>
        <p type="p">106:控制器</p>
        <p type="p">108:儲存媒體</p>
        <p type="p">110:磁碟區管理器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1399" publication-number="202615007">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615007</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130922</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化合物、組成物和方法</chinese-title>
        <english-title>COMPOUNDS, COMPOSITIONS AND METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/436</main-classification>
        <further-classification edition="200601120260102B">A61K31/437</further-classification>
        <further-classification edition="200601120260102B">A61K31/407</further-classification>
        <further-classification edition="201701120260102B">A61K47/68</further-classification>
        <further-classification edition="200601120260102B">A61K39/395</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商樂普生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEPU BIOPHARMA CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔菲菲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUI, FEIFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣雯卿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, WENQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李德亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, DELIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗邦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露關於抗癌化合物，包括但不限於使用該等抗癌化合物的抗體-藥物軛合物，該等化合物及其ADC適用於治療癌症。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to anticancer compounds, including, but not limited to, antibody-drug conjugates using the same, which compounds and ADCs thereof are suitable for the treatment of cancer.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1400" publication-number="202615001">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615001</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130928</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>超音波輔助幾丁聚醣奈米顆粒藥物遞送平台</chinese-title>
        <english-title>ULTRASOUND-ASSISTED DELIVERY OF DRUG-LOADED CHITOSAN NANOPARTICLES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">A61K31/282</main-classification>
        <further-classification edition="200601120260105B">A61K9/51</further-classification>
        <further-classification edition="201701120260105B">A61K47/69</further-classification>
        <further-classification edition="200601120260105B">A61K49/22</further-classification>
        <further-classification edition="200601120260105B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立台灣大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉瑋文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, WEI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李伯訓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, BOR-SHIUNN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃子芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TZU-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張喬貞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, QIAO-ZHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李斌宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明基於非氣泡的聲穿孔技術(non-bubble-based sonoporation)，提供一超音波輔助幾丁聚醣奈米顆粒藥物遞送平台，包含:提供搭載藥物分子的幾丁聚醣奈米顆粒及超音波刺激。將搭藥物的幾丁聚醣奈米顆粒施予於目標區域，讓超音波刺激直接施加於該目標區域，於細胞膜上產生膜形變，導致暫時的膜滲透性變化，使得順鉑幾丁聚醣奈米顆粒能夠進入細胞內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention, based on a non-bubble-based sonoporation technique, provides an ultrasound-assisted delivery platform for drug-loaded chitosan nanoparticles. This platform comprises: the administration of drug-loaded chitosan nanoparticles and the application of ultrasound stimulation. The drug-loaded chitosan nanoparticles are delivered to a target site, where ultrasound waves are directly applied to induce cellular membrane deformation. The ultrasonic mechanical force temporarily alters membrane permeability, thereby facilitating the intracellular delivery of the drug-loaded chitosan nanoparticles.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1401" publication-number="202615659">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615659</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130940</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＭＳＨ３調節分子</chinese-title>
        <english-title>MSH3 MODULATORY MOLECULES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260102B">C12N15/113</main-classification>
        <further-classification edition="200601120260102B">C12N15/63</further-classification>
        <further-classification edition="200601120260102B">C12N15/861</further-classification>
        <further-classification edition="200601120260102B">A61K31/7088</further-classification>
        <further-classification edition="200601120260102B">A61P25/00</further-classification>
        <further-classification edition="200601120260102B">A61P21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾斯迪安治療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASCIDIAN THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕維斯　阿尼卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAVIS, ANIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土井明子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOI, AKIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述MSH3剪接調節子及編碼其之構築體。本文亦涵蓋包含其之組成物及載體(例如AAV載體)。MSH3剪接調節子及編碼其之構築體，以及包含MSH3剪接調節子及編碼MSH3剪接調節子之構築體的組成物及載體(例如AAV載體)可單獨使用或與額外治療劑組合使用，以用於治療核苷酸重複擴增病症或用於製備用以治療核苷酸重複擴增病症之藥劑。例示性核苷酸重複擴增病症包括以下：亨廷頓氏病(Huntington's Disease，HD)、肌強直性營養不良1 (Myotonic Dystrophy 1)(DMPK)、肌強直性營養不良2 (CNBP)、福斯氏角膜內皮細胞失養症(Fuchs Endothelial Corneal Dystrophy，TCF4)、脆弱X染色體症候群(fragile X syndrome ，FMR1)、弗里德賴希共濟失調(Friedreich Ataxia，FXN)、C9orf72 ALS/FTD (C9orf72)、SCA1、SCA2、SCA3、SCA6、SCA7、SCA8、SCA10、SCA17及SCA31、脊髓延髓性肌肉萎縮症(Spinal and bulbar muscular atrophy)(AR)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">MSH3 splice modulators and constructs encoding same are described herein. Compositions and vectors comprising same (e.g., AAV vectors) are also encompassed herein. MSH3 splice modulators and constructs encoding same, as well as compositions and vectors (e.g., AAV vectors) comprising MSH3 splice modulators and constructs encoding MSH3 splice modulators may be used alone or in combination with additional therapeutics for treating nucleotide repeat expansion disorders or in the preparation of medicaments for treating nucleotide repeat expansion disorders. Exemplary nucleotide repeat expansion disorders include the following: Huntington's Disease (HD), Myotonic Dystrophy 1 (DMPK), Myotonic Dystrophy 2 (CNBP), Fuchs Endothelial Corneal Dystrophy (TCF4), Fragile X Syndrome (FMR1), Friedreich Ataxia (FXN), C9orf72 ALS/FTD (C9orf72), SCA1, 2, 3, 6, 7, 8, 10, 17, and 31, Spinal and bulbar muscular atrophy (AR).</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1402" publication-number="202615211">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615211</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130958</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>研磨裝置及研磨裝置的控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B24B49/12</main-classification>
        <further-classification edition="200601120260102B">B24B49/18</further-classification>
        <further-classification edition="201201120260102B">B24B53/017</further-classification>
        <further-classification edition="201201120260102B">B24B37/20</further-classification>
        <further-classification edition="200601120260102B">H01L21/304</further-classification>
        <further-classification edition="200601120260102B">G01B11/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商荏原製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBARA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村貴正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, TAKAMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾文岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳凱智</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種研磨裝置及研磨裝置的控制方法，可控制研磨裝置以在適當的時機實施修整。研磨裝置的控制器基於由測定裝置測定出的研磨墊的研磨面的狀態，決定預測為研磨墊的研磨能力低於閾值水準的時機，從動作計畫中的複數個閒置時間段中確定預測時機來臨前的閒置時間段，在所確定的閒置時間段中，使修整裝置對研磨墊進行修整處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">702、704、706、708、710、712、714:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1403" publication-number="202615549">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615549</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130994</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組合物及其硬化物、成形物、顯示裝置、固體攝像元件以及導光板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08G75/08</main-classification>
        <further-classification edition="200601120260102B">C08L81/02</further-classification>
        <further-classification edition="200601120260102B">C08K5/17</further-classification>
        <further-classification edition="200601120260102B">C08K5/18</further-classification>
        <further-classification edition="200601120260102B">C08K5/375</further-classification>
        <further-classification edition="200601120260102B">C08K5/56</further-classification>
        <further-classification edition="200601120260102B">G02B1/04</further-classification>
        <further-classification edition="200601120260102B">G02B6/00</further-classification>
        <further-classification edition="200601120260102B">G09F9/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>淺津悠司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASATSU, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>出崎光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEZAKI, HIKARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種組合物，其能夠提供顯示出高折射率之硬化物，且進而具有良好之保存穩定性。  &lt;br/&gt;本發明提供一種組合物，其含有：具有環硫乙烷基或硫環丁烷基之化合物(A)、酸產生劑(B)、及沸點為200℃以上之胺化合物(C)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1404" publication-number="202615192">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615192</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131009</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含助焊劑焊線及熔接接頭之製造方法</chinese-title>
        <english-title>FLUX CORED WIRE AND METHOD FOR PRODUCING WELDED JOINT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B23K35/02</main-classification>
        <further-classification edition="200601120260102B">B23K35/36</further-classification>
        <further-classification edition="200601120260102B">B23K35/362</further-classification>
        <further-classification edition="200601120260102B">B23K35/368</further-classification>
        <further-classification edition="200601120260102B">C22C38/00</further-classification>
        <further-classification edition="200601120260102B">C22C38/04</further-classification>
        <further-classification edition="200601120260102B">C22C38/58</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本製鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松尾孟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUO, HAJIME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立花隼人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TACHIBANA, HAYATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加茂孝浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMO, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於熔接的含助焊劑焊線，具備：鋼製外皮、及填充於鋼製外皮之內部的助焊劑；該含助焊劑焊線包含氧化物及合金成分；以相對於含助焊劑焊線之總質量的質量%計，Mn氧化物之MnO換算值的合計量X為0.3%~15.0%，Ti氧化物之TiO&lt;sub&gt;2&lt;/sub&gt;換算值的合計量Y為0.1%~10.0%；相對於Mn氧化物之合計量X與Ti氧化物之合計量Y之總量，Mn氧化物之合計量X的比率(X/(X+Y))為0.65~1.00；作為氧化物所含之Mn以外的Mn合計含量為3.0%~30.0%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1405" publication-number="202615550">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615550</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131013</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組合物及其硬化物、成形物、顯示裝置、固體攝像元件以及導光板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08G75/08</main-classification>
        <further-classification edition="200601120260102B">C08L81/02</further-classification>
        <further-classification edition="200601120260102B">C08K5/17</further-classification>
        <further-classification edition="200601120260102B">C08K5/3432</further-classification>
        <further-classification edition="200601120260102B">C08K5/375</further-classification>
        <further-classification edition="200601120260102B">C08K5/56</further-classification>
        <further-classification edition="200601120260102B">G02B1/04</further-classification>
        <further-classification edition="200601120260102B">G02B6/00</further-classification>
        <further-classification edition="200601120260102B">G09F9/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>出崎光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEZAKI, HIKARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>淺津悠司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASATSU, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種組合物，其能夠提供顯示出高折射率之硬化物，且進而具有良好之保存穩定性。  &lt;br/&gt;本發明提供一種組合物，其含有：具有環硫乙烷基或硫環丁烷基之化合物(A)、酸產生劑(B)、及胺化合物(C)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1406" publication-number="202615487">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615487</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131014</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>著色硬化性樹脂組合物、彩色濾光片及顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F2/44</main-classification>
        <further-classification edition="200601120260102B">C08F265/04</further-classification>
        <further-classification edition="200601120260102B">C09D133/00</further-classification>
        <further-classification edition="200601120260102B">C09D4/00</further-classification>
        <further-classification edition="201801120260102B">C09D7/41</further-classification>
        <further-classification edition="201801120260102B">C09D7/47</further-classification>
        <further-classification edition="201801120260102B">C09D7/63</further-classification>
        <further-classification edition="200601120260102B">G02B5/20</further-classification>
        <further-classification edition="200601120260102B">G02B5/22</further-classification>
        <further-classification edition="200601120260102B">G02F1/1335</further-classification>
        <further-classification edition="200601120260102B">H05B33/02</further-classification>
        <further-classification edition="202301120260102B">H10K50/86</further-classification>
        <further-classification edition="202301120260102B">H10K39/38</further-classification>
        <further-classification edition="202301120260102B">H10K59/86</further-classification>
        <further-classification edition="202301120260102B">H10K85/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹花祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEHANA, SHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種即便不添加無機微粒子亦能夠形成具有霧度之彩色濾光片之著色硬化性樹脂組合物。  &lt;br/&gt;本發明之著色硬化性樹脂組合物包含著色劑、樹脂、聚合性化合物及聚合起始劑，上述樹脂包含具有結構單元A及結構單元B之共聚物α，上述結構單元A源自選自由不飽和羧酸及不飽和羧酸酐所組成之群中之至少1種，上述結構單元B源自式(1)所表示之單體：  &lt;br/&gt;&lt;img align="absmiddle" height="55px" width="234px" file="ed10013.JPG" alt="ed10013.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[式中，  &lt;br/&gt;R&lt;sup&gt;1&lt;/sup&gt;表示氫原子或甲基，  &lt;br/&gt;R&lt;sup&gt;2&lt;/sup&gt;表示碳數6～20之直鏈或支鏈烷基]，  &lt;br/&gt;上述共聚物α中之結構單元B之含有率相對於構成上述共聚物α之結構單元總量為50～90莫耳%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1407" publication-number="202615710">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615710</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131029</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於斜面沉積的系統和方法</chinese-title>
        <english-title>SYSTEMS AND METHODS FOR BEVEL DEPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C23C16/455</main-classification>
        <further-classification edition="200601120260102B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>露波默斯基　德米翠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUBOMIRSKY, DMITRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嘉德雷　普拉納夫維傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GADRE, PRANAV VIJAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李炫周</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HYUN JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布赫伯格二世　道格拉斯亞瑟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUCHBERGER, JR., DOUGLAS ARTHUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>可汗　安柏馬穆德內瓦茲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHAN, ADIB MAHMOOD NEWAZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁　奇偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, QIWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金賢埈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYUNJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞坦尼　薛卡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATHANI, SHEKHAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內馬尼　斯里尼瓦瑟杜格拉薩德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEMANI, SRINIVAS DURGAPRASAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉　怡利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIEH, ELLIE YI-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種系統包含製程腔室、用於支撐基板的基板支撐組件，以及噴頭組件。該噴頭組件包含氣體分配板，該氣體分配板包含具有第一半徑和第一厚度的內部區域，以及與內部區域同心的外部區域，該外部區域具有大於第一半徑的第二半徑。外部區域進一步具有小於第一厚度的第二厚度，使得內部區域距離基板有第一距離，而外部區域距離基板有第二距離。第一距離小於第二距離。該氣體分配板被配置為在基板的外部區域上沉積塗層，而不在基板的內部區域上沉積該塗層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system includes a process chamber, a substrate support assembly to support a substrate, and a shower head assembly. The shower head assembly includes a gas distribution plate including an inner region having a first radius and a first thickness and an outer region, that is concentric with the inner region, having a f second radius that is greater than the first radius. The outer region further having a second thickness that is less than the first thickness causing the inner region to have a first distance from the substrate and the outer region to have a second distance from the substrate. The first distance is less than the second distance. The gas distribution plate is configured to deposit a coating on an outer region of the substrate without depositing the coating on an inner region of the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">202A:基板</p>
        <p type="p">210A:前側</p>
        <p type="p">212A:基板</p>
        <p type="p">214A:厚度</p>
        <p type="p">220A:斜面</p>
        <p type="p">222A:斜面</p>
        <p type="p">260A:晶圓</p>
        <p type="p">271A:內部區域</p>
        <p type="p">272A:外部區域</p>
        <p type="p">290A:塗層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1408" publication-number="202615278">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615278</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131037</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使引擎驅動雙輪車輛之引擎切斷功能失效的方法</chinese-title>
        <english-title>METHOD OF DEACTIVATING A CUT-OFF FUNCTION OF AN ENGINE OF AN ENGINE-DRIVEN TWO-WHEELED VEHICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B60W10/08</main-classification>
        <further-classification edition="200601120260102B">F02N11/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商舍弗勒科技股份有限兩合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHAEFFLER TECHNOLOGIES AG &amp; CO. KG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富瑞茂克思　琴路克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FREMAUX, JEAN-LUC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種使引擎驅動雙輪車輛(1)之引擎(10)切斷功能失效的方法，該車輛(1)包括一電子控制單元(11)，該電子控制單元包括一傾斜感測器(111)，配置成測量該車輛(1)的橫向傾斜角度(θ)及將計算的該傾斜角度(θ)與該第二傾斜臨界值(θ2)進行比較，並且如果計算的該傾斜角度(θ)大於該第二傾斜臨界值(θ2)，則傳送使該該引擎(10)停止的信號，該方法包括以下步驟：&lt;br/&gt;  由一使用者的一動作啟動(E1)該電子控制單元(11)；&lt;br/&gt;  接收(E2)該車輛(1)的速度；&lt;br/&gt;  如果接收到的該速度為零，則計算(E4)該車輛(1)的該傾斜角度(θ)；以及&lt;br/&gt;  如果計算的該傾斜角度(θ)大於該第一傾斜臨界值(θ1)，則該電子控制單元(11)使該引擎(10)的切斷功能失效(E8**)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a method of deactivating a cut-off function of an engine (10) of an engine-driven two-wheeled vehicle (1), said vehicle (1) comprising an electronic control unit (11) comprising an inclination sensor (111) configured to measure the lateral inclination angle (θ) of the vehicle (1) and to compare the calculated inclination angle (θ) with the second inclination threshold (θ2) and send a signal to stop the engine (10) if the calculated inclination angle (θ) is greater than the second inclination threshold (θ1), said method comprising the steps of:&lt;br/&gt; - activating (E1) the electronic control unit (11) by an action of a user,&lt;br/&gt; - receiving (E2) the speed of the vehicle (1),&lt;br/&gt; - if the received speed is zero, calculating (E4) the inclination angle (θ) of the vehicle (1),&lt;br/&gt; - if the calculated inclination angle (θ) is greater than the first inclination threshold (θ1), the electronic control unit (11) deactivates (E8**) the cut-off function of the engine (10).</p>
      </isu-abst>
      <representative-img>
        <p type="p">θ:傾斜角度</p>
        <p type="p">θ1:角度(第一傾斜臨界值)</p>
        <p type="p">θ2:角度(第二傾斜臨界值)</p>
        <p type="p">10:引擎</p>
        <p type="p">11:電子控制單元</p>
        <p type="p">12:車架</p>
        <p type="p">14:通信鏈路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1409" publication-number="202616139">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616139</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131044</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>IC標籤</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G06K19/077</main-classification>
        <further-classification edition="200601120260102B">G06K19/07</further-classification>
        <further-classification edition="200601120260102B">H01Q1/22</further-classification>
        <further-classification edition="200601120260102B">H01Q9/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商新田股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>島井俊治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMAI, TOSHIHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之IC標籤，包括：基材，具有第一表面和第二表面；IC晶片，配置於該基材的該第一表面上；偶極天線，配置在該基材的該第一表面上，用於電性傳送和接收儲存在該IC晶片中的資訊；蓋板，與該基材的該第一表面上接合，用以覆蓋該IC晶片和該偶極天線；第一層樹脂，層壓在該蓋板中與該基材之該第一表面接合的表面相對的表面的至少一部分；以及第二層樹脂，層壓在該基材的該第二表面的至少一部分上。其中，該第一層樹脂和該第二層樹脂的拉伸彈性模量為2.0GPa以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基材</p>
        <p type="p">2:IC晶片</p>
        <p type="p">3:偶極天線</p>
        <p type="p">4:蓋板</p>
        <p type="p">5:黏著劑</p>
        <p type="p">6:第一層樹脂</p>
        <p type="p">7:第二層樹脂</p>
        <p type="p">10:IC標籤</p>
        <p type="p">11:第一表面</p>
        <p type="p">12:第二表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1410" publication-number="202615601">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615601</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131047</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可撓性基板用噴墨標記油墨組成物</chinese-title>
        <english-title>INKJET MARKING INK COMPOSITION FOR FLEXIBLE SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260105B">C09D11/30</main-classification>
        <further-classification edition="200601120260105B">C08F2/50</further-classification>
        <further-classification edition="200601120260105B">C08F220/10</further-classification>
        <further-classification edition="200601120260105B">C08L33/08</further-classification>
        <further-classification edition="200601120260105B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商韓國太陽油墨股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIYO INK MFG. CO.,(KOREA) LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金東守</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DONG SU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>播磨英司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARIMA, EIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金明石</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MYEONG SUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一實施方式係關於一種樹脂組成物，其包括(A)單官能(甲基)丙烯酸酯、(B)多官能(甲基)丙烯酸酯、(C)熱固性樹脂、(D)光聚合起始劑及(E)無機填充劑，丙烯酸當量為160 g/eq以上280 g/eq以下。此種本發明之樹脂組成物可提供一種噴墨標記油墨組成物，其於使用於可撓性基板時，柔軟性與密接性優異且可抑制摺疊或彎曲時發生剝離及龜裂。又，可提供一種保存穩定性優異且密接性亦較高之噴墨標記油墨組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1411" publication-number="202615428">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615428</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131054</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>快速加速纖維肉瘤蛋白質降解之化合物及包含其之組成物</chinese-title>
        <english-title>RAPIDLY ACCELERATING FIBROSARCOMA PROTEIN DEGRADING COMPOUNDS AND A COMPOSITION COMPRISING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07D401/14</main-classification>
        <further-classification edition="200601120260102B">C07D471/04</further-classification>
        <further-classification edition="200601120260102B">A61K31/4545</further-classification>
        <further-classification edition="201701120260102B">A61K47/55</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商阿爾維納斯運營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARVINAS OPERATIONS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍恩伯格　基斯Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORNBERGER, KEITH R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯奈德　勞倫斯Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SNYDER, LAWRENCE B.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　靖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描繪在作為快速加速纖維肉瘤(Raf，諸如c-Raf、A-Raf及/或B-Raf)之調節劑方面具有效用之雙官能化合物。特定言之，本發明之異雙官能化合物在一端含有結合至塞勒布隆(cereblon) E3泛蛋白連接酶之部分且在另一端含有結合Raf之部分，使得目標蛋白質置於該泛蛋白連接酶附近以實現目標蛋白質之降解(及抑制)。本發明之該等異雙官能化合物展現出與目標蛋白質之降解/抑制相關之廣泛範圍的藥理學活性。用本發明之化合物及組成物治療或者預防由該目標蛋白質之異常調節引起的疾病或者病症。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Bifunctional compounds, which find utility as modulators of Rapidly Accelerated Fibrosarcoma (Raf, such as c-Raf, A-Raf, and/or B-Raf), are described herein. In particular, the hetero-bifunctional compounds of the present disclosure contain on one end a moiety that binds to the cereblon E3 ubiquitin ligase and on the other end a moiety which binds Raf, such that the target protein is placed in proximity to the ubiquitin ligase to effect degradation (and inhibition) of target protein. The hetero-bifunctional compounds of the present disclosure exhibit a broad range of pharmacological activities associated with degradation/inhibition of target protein. Diseases or disorders that result from aberrant regulation of the target protein are treated or prevented with compounds and compositions of the present disclosure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1412" publication-number="202616365">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616365</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131068</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有混合接合層的半導體元件</chinese-title>
        <english-title>SEMICONDUCTOR ELEMENTS WITH HYBRID BONDING LAYERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/20</main-classification>
        <further-classification edition="200601120260102B">H01L21/31</further-classification>
        <further-classification edition="200601120260102B">H01L21/76</further-classification>
        <further-classification edition="200601120260102B">H01L23/535</further-classification>
        <further-classification edition="200601120260102B">H01L23/488</further-classification>
        <further-classification edition="200601120260102B">H01L23/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡特卡　拉杰詡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATKAR, RAJESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈巴　貝高森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HABA, BELGACEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方騰二世　蓋烏斯　吉爾曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOUNTAIN, JR., GAIUS GILLMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏佐　賽普里恩　艾米卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UZOH, CYPRIAN EMEKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種具有預成型混合接合層之微電子互連結構。該混合接合層形成於包含實質上平坦上部表面之臨時載體上方。包含裝置或金屬化層之佈線結構接著設置於該混合接合層上方。在適當地強化與該佈線結構耦接之該混合接合層之後，移除該臨時載體以露出該混合接合層之接合表面。該互連結構可包含穿插該混合接合層且形成該佈線結構之部分的有機介電材料，且因此展現彎曲可撓性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A microelectronic interconnect structure having a pre-formed hybrid bonding layer is disclosed. The hybrid bonding layer is formed over a temporary carrier comprising a substantially flat upper surface. A routing structure comprising a device or metallization layers is then provided over the hybrid bonding layer. After the hybrid bonding layer coupled with the routing structure is properly reinforced, the temporary carrier is removed to reveal a bonding surface of the hybrid bonding layer. The interconnect structure can comprise an organic dielectric material interspersing the hybrid bonding layer and forming part of the routing structure, and as such exhibit bending flexibility.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:互連結構</p>
        <p type="p">210:介電接合層</p>
        <p type="p">214:導電接觸特徵</p>
        <p type="p">215:混合接合層</p>
        <p type="p">220:佈線結構</p>
        <p type="p">227:支撐結構</p>
        <p type="p">230:接合表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1413" publication-number="202616086">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616086</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131089</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>管理計算存儲裝置中的程式執行</chinese-title>
        <english-title>MANAGING PROGRAM EXECUTION IN A COMPUTATIONAL STORAGE DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120251112B">G06F12/0866</main-classification>
        <further-classification edition="201601120251112B">G06F12/08</further-classification>
        <further-classification edition="200601120251112B">G06F13/14</further-classification>
        <further-classification edition="201801120251112B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商長江存儲科技有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANGTZE MEMORY TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王天一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TIANYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提出了對執行程式命令進行執行的方法、系統和計算存儲裝置。在一個方面中，該系統包括主機。主機被配置為發送執行程式命令，其中，該執行程式命令指示一個或多個程式，並且當多個程式被指示時，該執行程式命令指示執行多個程式的次序。該系統還包括計算存儲裝置。該計算存儲裝置被配置為：從主機接收執行程式命令；以及回應於確定執行程式命令指示多個程式，根據執行多個程式的次序來執行多個程式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods, systems, and computational storage device of executing an execute program command is presented. In one aspect, the system includes a host. The host is configured to send an execute program command, where the execute program command indicates one or multiple programs and an order of executing the multiple programs when the multiple programs are indicated. The system also includes a computational storage device. The computational storage device is configured to receive the execute program command from the host; and in response to determining that the execute program command indicates multiple programs, execute the multiple programs according to the order of executing the multiple programs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">102:計算存儲裝置</p>
        <p type="p">104:控制器</p>
        <p type="p">106:計算資源</p>
        <p type="p">108:計算資源</p>
        <p type="p">110:記憶體裝置</p>
        <p type="p">112:隨機存取記憶體</p>
        <p type="p">114:主機</p>
        <p type="p">116:主機記憶體</p>
        <p type="p">118:主機處理器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1414" publication-number="202615008">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615008</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131102</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療疾病的利福布汀類似物</chinese-title>
        <english-title>RIFABUTIN ANALOGS FOR THE TREATMENT OF DISEASE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/437</main-classification>
        <further-classification edition="200601120260102B">A61K31/4178</further-classification>
        <further-classification edition="200601120260102B">A61K31/34</further-classification>
        <further-classification edition="200601120260102B">A61P31/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商生物驗證系統股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIOVERSYS AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班德拉　莫妮卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANDERA, MONICA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴爾　格倫Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DALE, GLENN E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德赫諾　奧若爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DRENEAU, AURORE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉欽格　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GITZINGER, MARC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍夫曼　莉娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOFMANN, LINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汗　納瓦茲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHAN, NAWAZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛丘羅　塞爾吉奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOCIURO, SERGIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米凱洛蒂　阿蕾西亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICHELOTTI, ALESSIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米爾科維奇　瑪莉雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MILJKOVIC, MARIJA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特雷博斯克　文森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TREBOSC, VINCENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維朗　尼古拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILLAND, NICOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及用於治療、改善和/或預防疾病的化合物和包含所述化合物的藥物組成物。在一些實施例中，所述疾病是細菌感染。在一些實施例中，細菌感染是由屬於非結核分枝桿菌屬的一種或多種細菌，較佳地為膿腫分枝桿菌(&lt;i&gt;Mycobacterium abscessus&lt;/i&gt;)引起的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to compounds and pharmaceutical compositions comprising the same for the treatment, amelioration and/or prevention of disease. In some embodiments, the disease is a bacterial infection. In some embodiments, the bacterial infection is caused by one or more bacterium belonging to a genus of non-tuberculous Mycobacteria, preferably M. abscessus.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1415" publication-number="202615436">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615436</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131103</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療疾病的利福布汀類似物</chinese-title>
        <english-title>RIFABUTIN ANALOGS FOR THE TREATMENT OF DISEASE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C07D491/22</main-classification>
        <further-classification edition="200601120260105B">A61K31/438</further-classification>
        <further-classification edition="200601120260105B">A61K31/5377</further-classification>
        <further-classification edition="200601120260105B">A61K31/4545</further-classification>
        <further-classification edition="200601120260105B">A61K31/439</further-classification>
        <further-classification edition="200601120260105B">A61K31/496</further-classification>
        <further-classification edition="200601120260105B">A61P31/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商生物驗證系統股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIOVERSYS AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班德拉　莫妮卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANDERA, MONICA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴爾　格倫Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DALE, GLENN E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德赫諾　奧若爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DRENEAU, AURORE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉欽格　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GITZINGER, MARC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍夫曼　莉娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOFMANN, LINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汗　納瓦茲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHAN, NAWAZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛丘羅　塞爾吉奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOCIURO, SERGIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米凱洛蒂　阿蕾西亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICHELOTTI, ALESSIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米爾科維奇　瑪莉雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MILJKOVIC, MARIJA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特雷博斯克　文森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TREBOSC, VINCENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維朗　尼古拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILLAND, NICOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及用於治療、改善和/或預防疾病的化合物和包含此化合物的藥物組合物。在一些實施例中，前述疾病是一種感染疾病，尤其是細菌感染疾病。在一些實施例中，細菌感染疾病是由一種或多種屬於非結核分枝桿菌屬（non-tuberculous&lt;i&gt; Mycobacteria&lt;/i&gt;，NTM）的細菌引起的疾病。較佳地，為膿腫分枝桿菌（&lt;i&gt;M. abscessus&lt;/i&gt;）引起的細菌感染疾病。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to compounds and pharmaceutical compositions comprising the same for the treatment, amelioration and/or prevention of disease. In some embodiments, the disease is an infection, preferably a bacterial infection. In some embodiments, the bacterium belongs to a genus of non-tuberculous &lt;i&gt;Mycobacteria&lt;/i&gt; (NTM), preferably &lt;i&gt;M. abscessus&lt;/i&gt;.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1416" publication-number="202615365">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615365</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131137</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低密度高折射率玻璃</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C03C3/062</main-classification>
        <further-classification edition="200601120260102B">C03C3/064</further-classification>
        <further-classification edition="200601120260102B">C03C3/066</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商首德公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHOTT AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛伊克爾　塞巴斯蒂安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEUKEL, SEBASTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里特　西蒙娜莫尼卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RITTER, SIMONE MONIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種折射率大於1.85的光學玻璃、包含該光學玻璃的玻璃製品及其用途，尤其是在光學器件和透鏡、超穎光學元件及增強現實(AR)領域中的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1417" publication-number="202615363">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615363</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131139</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於直接加熱鉑遞送系統之法蘭設計</chinese-title>
        <english-title>FLANGE DESIGN FOR DIRECT HEATING OF PLATINUM DELIVERY SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">C03B5/235</main-classification>
        <further-classification edition="200601120260114B">F16L23/12</further-classification>
        <further-classification edition="200601120260114B">C03B7/07</further-classification>
        <further-classification edition="200601120260114B">C03B5/225</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕爾默　布萊恩邁克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PALMER, BRIAN MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史萊特　艾琳瑪傑力</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SLATER, IRENE MARJORIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種用於加熱熔融玻璃之玻璃傳遞系統。該玻璃傳遞系統包含一玻璃傳遞管，該玻璃傳遞管經組態以允許熔融玻璃在該玻璃傳遞管之一內腔中流動。該玻璃傳遞系統亦包含一支撐總成，該支撐總成具有一內表面，該內表面中具有一內部開口，該內部開口經組態以接收該玻璃傳遞管。該內部開口具有一高度及一寬度，該高度大於該寬度，並且該支撐總成經組態以在該內部開口內接收該玻璃傳遞管。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A glass transfer system for heating molten glass is provided. The glass transfer system comprises a glass transfer tube that is configured to allow molten glass to flow within an internal volume of the glass transfer tube. The glass transfer system also comprises a support assembly having an inner surface defining an internal opening therein configured to receive the glass transfer tube. The internal opening defines a height and a width, the height is greater than the width, and the support assembly is configured to receive the glass transfer tube within the internal opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">712:法蘭總成</p>
        <p type="p">718:內部結構</p>
        <p type="p">724:中線</p>
        <p type="p">726A:第一側</p>
        <p type="p">726B:第二側</p>
        <p type="p">728A:第一臂</p>
        <p type="p">728B:第二臂</p>
        <p type="p">729A,729B:第三段</p>
        <p type="p">730:中心法蘭元件</p>
        <p type="p">731:上部部分</p>
        <p type="p">732:底部部分</p>
        <p type="p">734A:側部部分/左側部分</p>
        <p type="p">734B:側部部分/右側部分</p>
        <p type="p">736A,736B:第一段</p>
        <p type="p">738A,738B:第二段</p>
        <p type="p">740A,740B:開口</p>
        <p type="p">754A,754B:區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1418" publication-number="202615568">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615568</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131151</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化學放大型正型感光性組合物、感光性乾膜、感光性乾膜之製造方法、經圖案化之阻劑膜之製造方法、附鑄模之基板之製造方法、及鍍敷造形物之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08K5/13</main-classification>
        <further-classification edition="200601120260102B">C08K5/17</further-classification>
        <further-classification edition="200601120260102B">C08K5/3415</further-classification>
        <further-classification edition="200601120260102B">C08K5/3432</further-classification>
        <further-classification edition="200601120260102B">C08K5/3435</further-classification>
        <further-classification edition="200601120260102B">C08K5/375</further-classification>
        <further-classification edition="200601120260102B">C08K5/42</further-classification>
        <further-classification edition="200601120260102B">C08K5/55</further-classification>
        <further-classification edition="200601120260102B">C09D133/06</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/16</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/40</further-classification>
        <further-classification edition="200601120260102B">C25D5/02</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
        <further-classification edition="200601120260102B">H01L21/288</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢吹峻作</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YABUKI, SHUNSAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鷲見岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMI, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠形成表面平滑性及矩形性較高之經圖案化之阻劑膜且能夠抑制顯影殘渣之化學放大型正型感光性組合物、具備感光性層之感光性乾膜、感光性乾膜之製造方法、經圖案化之阻劑膜之製造方法、附鑄模之基板之製造方法、及鍍敷造形物之製造方法。  &lt;br/&gt;本發明係一種化學放大型正型感光性組合物，其包含藉由活性光線或放射線之照射而產生凡得瓦體積為200 Å&lt;sup&gt;3&lt;/sup&gt;以上之酸之酸產生劑(A)、在鹼中之溶解性藉由酸之作用而增大之樹脂(B)、具有酚性羥基之非聚合物化合物(C)及酸擴散抑制劑(F)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1419" publication-number="202615569">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615569</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131152</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化學放大型正型感光性組合物、感光性乾膜、感光性乾膜之製造方法、經圖案化之阻劑膜之製造方法、附鑄模之基板之製造方法、及鍍敷造形物之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08K5/375</main-classification>
        <further-classification edition="200601120260102B">C08L33/06</further-classification>
        <further-classification edition="200601120260102B">C08L33/14</further-classification>
        <further-classification edition="200601120260102B">C09D133/06</further-classification>
        <further-classification edition="200601120260102B">C09D133/14</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/09</further-classification>
        <further-classification edition="200601120260102B">G03F7/16</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/40</further-classification>
        <further-classification edition="200601120260102B">C25D5/02</further-classification>
        <further-classification edition="200601120260102B">C25D5/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鷲見岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMI, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢吹峻作</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YABUKI, SHUNSAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠形成截面形狀為矩形之經圖案化之阻劑膜、曝光後延遲經時穩定性良好並且能夠抑制顯影殘渣之化學放大型正型感光性組合物、具備感光性層之感光性乾膜、感光性乾膜之製造方法、經圖案化之阻劑膜之製造方法、附鑄模之基板之製造方法、及鍍敷造形物之製造方法。  &lt;br/&gt;本發明係一種化學放大型正型感光性組合物，其包含藉由活性光線或放射線之照射而產生酸之酸產生劑(A)、在鹼中之溶解性藉由酸之作用而增大之樹脂(B)、含硫化合物(E)、及酸擴散抑制劑(F)，酸產生劑(A)包含產生凡得瓦體積為150 Å&lt;sup&gt;3&lt;/sup&gt;以下並且pKa為-6.5以下-10以上之超強酸之酸產生劑(A1)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1420" publication-number="202615506">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615506</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131153</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化學放大型正型感光性組合物、感光性乾膜、感光性乾膜之製造方法、經圖案化之阻劑膜之製造方法、及鍍敷造形物之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F212/14</main-classification>
        <further-classification edition="200601120260102B">C08F220/18</further-classification>
        <further-classification edition="200601120260102B">C08F220/28</further-classification>
        <further-classification edition="200601120260102B">C08F220/30</further-classification>
        <further-classification edition="200601120260102B">C08F220/32</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/16</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/40</further-classification>
        <further-classification edition="200601120260102B">C25D5/02</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
        <further-classification edition="200601120260102B">H01L21/288</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小島大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OJIMA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本池直人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTOIKE, NAOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種能夠形成剖面形狀為矩形並且耐裂紋性優異之經圖案化之阻劑膜的化學放大型正型感光性組合物、具備包含該化學放大型正型感光性組合物之感光性層之感光性乾膜、該感光性乾膜之製造方法、經圖案化之阻劑膜之製造方法、及鍍敷造形物之製造方法。  &lt;br/&gt;本發明之化學放大型正型感光性組合物包含：在鹼中之溶解性藉由酸之作用而增大之樹脂(A)、及藉由活性光線或放射線之照射而產生酸之酸產生劑(B)，樹脂(A)包含2種以上之丙烯酸樹脂(A1)，丙烯酸樹脂(A1)具有特定結構之含酚性羥基之單元(a1)，並且含酚性羥基之單元(a1)之莫耳數相對於構成丙烯酸樹脂(A1)之全部結構單元之莫耳數的比率為1 mol%以上20 mol%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1421" publication-number="202615503">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615503</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131154</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化學放大型正型感光性組合物、感光性乾膜、感光性乾膜之製造方法、經圖案化之阻劑膜之製造方法、附鑄模之基板之製造方法、及鍍敷造形物之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F212/08</main-classification>
        <further-classification edition="200601120260102B">C08F212/14</further-classification>
        <further-classification edition="200601120260102B">C08F220/06</further-classification>
        <further-classification edition="200601120260102B">C08F220/18</further-classification>
        <further-classification edition="200601120260102B">C08F220/28</further-classification>
        <further-classification edition="200601120260102B">C08F220/30</further-classification>
        <further-classification edition="200601120260102B">C08F220/32</further-classification>
        <further-classification edition="200601120260102B">C08L25/18</further-classification>
        <further-classification edition="200601120260102B">C08L33/06</further-classification>
        <further-classification edition="200601120260102B">C08L33/14</further-classification>
        <further-classification edition="200601120260102B">C08K5/37</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/09</further-classification>
        <further-classification edition="200601120260102B">G03F7/16</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/40</further-classification>
        <further-classification edition="200601120260102B">C25D5/02</further-classification>
        <further-classification edition="200601120260102B">C25D5/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小島大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OJIMA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本池直人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTOIKE, NAOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題提供一種能夠形成截面形狀為矩形並且底腳得以被抑制之經圖案化之阻劑膜之化學放大型正型感光性組合物、具備感光性層之感光性乾膜、感光性乾膜之製造方法、經圖案化之阻劑膜之製造方法、附鑄模之基板之製造方法、及鍍敷造形物之製造方法。  &lt;br/&gt;本發明之解決手段為化學放大型正型感光性組合物，其包含藉由活性光線或放射線之照射而產生酸之酸產生劑(A)、於鹼中之溶解性藉由酸之作用而增大之樹脂(B)及含硫化合物(E)，樹脂(B)包含含有來自具有1個以上之酚性羥基及1個乙烯性不飽和雙鍵之單體之結構單元(B-1)、及來自不具有酚性羥基之(甲基)丙烯酸酯之結構單元(B-2)之丙烯酸樹脂(B3)，含硫化合物(E)包含式(E1)表示之化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1422" publication-number="202615336">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615336</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131155</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化學放大型正型感光性組合物、感光性乾膜、感光性乾膜之製造方法、經圖案化之阻劑膜之製造方法、附鑄模之基板之製造方法、及鍍敷造形物之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C01B21/093</main-classification>
        <further-classification edition="200601120260102B">C01B25/10</further-classification>
        <further-classification edition="200601120260102B">C07C309/06</further-classification>
        <further-classification edition="200601120260102B">C07C311/48</further-classification>
        <further-classification edition="200601120260102B">C07C381/12</further-classification>
        <further-classification edition="200601120260102B">C07D221/14</further-classification>
        <further-classification edition="200601120260102B">C07D333/46</further-classification>
        <further-classification edition="200601120260102B">C07F5/02</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">C25D5/02</further-classification>
        <further-classification edition="200601120260102B">C25D7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小島大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OJIMA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本池直人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTOIKE, NAOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桃澤綾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOMOZAWA, AYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水石聡佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUISHI, SATOKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題提供一種能夠形成截面形狀為矩形並且底腳得以被抑制之經圖案化之阻劑膜之化學放大型正型感光性組合物、具備感光性層之感光性乾膜、感光性乾膜之製造方法、經圖案化之阻劑膜之製造方法、附鑄模之基板之製造方法、及鍍敷造形物之製造方法。本發明之解決手段為化學放大型正型感光性組合物，其包含藉由活性光線或放射線之照射而產生酸之酸產生劑(A)、於鹼中之溶解性藉由酸之作用而增大之樹脂(B)、及含硫化合物(E)，酸產生劑(A)包含由鋶陽離子及式(A1)：Cf-SO&lt;sub&gt;2&lt;/sub&gt;-N&lt;sup&gt;-&lt;/sup&gt;-SO&lt;sub&gt;2&lt;/sub&gt;-Cf···(A1)表示之陰離子形成之鋶鹽，含硫化合物(E)包含式(E1)：X&lt;sup&gt;e&lt;/sup&gt;-(-R&lt;sup&gt;1e&lt;/sup&gt;-SH)&lt;sub&gt;ne&lt;/sub&gt;···(E1)表示之化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1423" publication-number="202615893">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615893</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131156</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光檢測裝置及測距系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260102B">G01S17/894</main-classification>
        <further-classification edition="200601120260102B">G01S7/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼半導體解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡田千丈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKADA, CHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武田直嗣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEDA, NAOTSUGU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之目的在於可兼顧擴大測距範圍與提高測距精度，並且提高訊框率。  &lt;br/&gt;本揭示之光檢測裝置具備：光電轉換元件，其檢測入射之光子；第1計測部，其計測上述光電轉換元件檢測出光子之時序；及第2計測部，其與上述第1計測部並行地，以較上述第1計測部低之時間解析度計測上述時序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:光檢測裝置</p>
        <p type="p">11:像素陣列部</p>
        <p type="p">12:像素電路</p>
        <p type="p">13:高解析度計測部</p>
        <p type="p">14:低解析度計測部</p>
        <p type="p">15:宏像素</p>
        <p type="p">16:匯集部</p>
        <p type="p">20:像素</p>
        <p type="p">21:計數器</p>
        <p type="p">22:移位暫存器</p>
        <p type="p">23:計數器</p>
        <p type="p">24:移位暫存器</p>
        <p type="p">25:邏輯電路</p>
        <p type="p">30:光電轉換元件</p>
        <p type="p">BIN_CLK:時脈信號</p>
        <p type="p">PIX_OUT:光子檢測信號</p>
        <p type="p">SELBIN_COARSE[3：0]:選擇信號</p>
        <p type="p">SELBIN_FINE[0]:選擇信號</p>
        <p type="p">SELBIN_FINE[11：0]:選擇信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1424" publication-number="202615093">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615093</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131158</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>再使用於已中止免疫檢查點抑制劑給藥之癌症患者之免疫檢查點抑制劑的治療效果提高用醫藥</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K39/395</main-classification>
        <further-classification edition="200601120260102B">A61K31/196</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人東海國立大學機構</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯田忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IIDA, TADASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大脇貴之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OWAKI, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>榎本篤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENOMOTO, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長谷哲成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASE, TETSUNARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赤松秀輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKAMATSU, SHUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川嶋啓揮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASHIMA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種第二免疫檢查點抑制劑的治療效果提高用醫藥，其係將促進美弗林的表達之藥劑作為有效成分之醫藥，其特徵為，以已中止第一免疫檢查點抑制劑給藥之癌症患者為對象，與第二免疫檢查點抑制劑組合而給藥。依據本發明，能夠提高再使用於已中止免疫檢查點抑制劑給藥之癌症患者之免疫檢查點抑制劑的治療效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1425" publication-number="202616366">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616366</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131161</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置中之種結構及其製造</chinese-title>
        <english-title>SEED STRUCTURES IN SEMICONDUCTOR DEVICES AND FABRICATION THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/20</main-classification>
        <further-classification edition="200601120260102B">H01L21/324</further-classification>
        <further-classification edition="200601120260102B">H01L21/762</further-classification>
        <further-classification edition="200601120260102B">H01L21/469</further-classification>
        <further-classification edition="202501120260102B">H10D84/83</further-classification>
        <further-classification edition="200601120260102B">C30B1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商萬國商業機器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERNATIONAL BUSINESS MACHINES CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬泰利　福斯托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARTELLI, FAUSTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托多羅夫　泰德　可斯米洛夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TODOROV, TEODOR KRASSIMIROV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　敬慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHING-TZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮泰拉　潔德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PITERA, JED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾塔　法比歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARTA, FABIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寇漢　蓋　摩希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COHEN, GUY MOSHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐卡拉　利歐尼達斯　埃內斯托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OCOLA, LEONIDAS ERNESTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫施　班傑明　哈迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WUNSCH, BENJAMIN HARDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛拉斯奇寇　歐樂葛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLUSCHENKOV, OLEG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體裝置，其包括安置於一介電層中之複數個種結構。該複數個種結構彼此間隔開。該複數個種結構中之各別者具有一寬度自該介電層之一上表面逐漸減小的一錐形形狀，且包括半導體結晶材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a plurality of seed structures disposed in a dielectric layer. The plurality of seed structures are spaced apart from each other. Respective ones of the plurality of seed structures have a tapered shape with a decreasing width from an upper surface of the dielectric layer, and include semiconductor crystalline material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體結構</p>
        <p type="p">101:半導體基板</p>
        <p type="p">102:介電層</p>
        <p type="p">105:互連件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1426" publication-number="202614925">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614925</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131162</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製造順式-4-胺基四氫呋喃-2-羧酸酯之方法</chinese-title>
        <english-title>PROCESS FOR PRODUCING CIS-4-AMINOTETRAHYDROFURAN-2-CARBOXYLIC ESTERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A01N37/22</main-classification>
        <further-classification edition="200601120260102B">A01N43/08</further-classification>
        <further-classification edition="200601120260102B">C07D307/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商拜耳廠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAYER AKTIENGESELLSCHAFT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布羅姆　德克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROHM, DIRK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫爾曼　坦加</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERRMANN, TANJA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊普　馬提亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUPP, MATTHIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倫比亞克　安德列斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REMBIAK, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於用於製造通式(&lt;b&gt;I&lt;/b&gt;)之順式-4-胺基四氫呋喃-2-羧酸酯之鹽之新穎方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a novel process for producing the salts of cis-4-aminotetrahydrofuran-2-carboxylic esters of general formula (&lt;b&gt;I&lt;/b&gt;).</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1427" publication-number="202615556">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615556</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131175</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多孔質聚醯亞胺膜、多孔質聚醯亞胺膜的製造方法、以及多孔質聚醯亞胺膜形成用清漆</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C08J5/18</main-classification>
        <further-classification edition="200601120260105B">C08J9/26</further-classification>
        <further-classification edition="200601120260105B">B01D71/64</further-classification>
        <further-classification edition="200601120260105B">B32B3/24</further-classification>
        <further-classification edition="200601120260105B">C08G73/10</further-classification>
        <further-classification edition="200601120260105B">C08L79/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商杰富意化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JFE CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋山智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKIYAMA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金丸拓磨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANAMARU, TAKUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小倉丈人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGURA, TAKEHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種孔徑小且流體的穿透性優良之多孔質聚醯亞胺膜及其製造方法、以及適用於前述多孔質聚醯亞胺膜的製造的多孔質聚醯亞胺膜形成用清漆。  &lt;br/&gt;　　一種多孔質聚醯亞胺膜，其藉由半乾法所測得之多孔質聚醯亞胺膜的平均孔徑為30nm以下，構成多孔質聚醯亞胺膜之聚醯亞胺樹脂係藉由聚醯胺酸(A)的加熱而形成，以特定方法所測得之聚醯亞胺樹脂之膜的拉伸彈性模數為2.0GPa以上5.0GPa以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1428" publication-number="202616686">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616686</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131177</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可擴展的去中心化資料庫架構</chinese-title>
        <english-title>SCALABLE DECENTRALIZED DATABASE ARCHITECTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260102B">H04B10/80</main-classification>
        <further-classification edition="200601120260102B">G02B6/42</further-classification>
        <further-classification edition="200601120260102B">G02B6/12</further-classification>
        <further-classification edition="202301120260102B">H01L25/065</further-classification>
        <further-classification edition="200601120260102B">H01L23/538</further-classification>
        <further-classification edition="200601120260102B">H01L23/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏　世驊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, SHE-HWA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇利　塔密希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SURI, TAMEESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肯格埃里　蘇布拉瑪尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KENGERI, SUBRAMANI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述相關於為計算密集型工作負載設計的資料庫架構的技術。裝置包括多個光介面，每個光介面經配置為與不同組的處理資源耦接。裝置的光電轉換區塊各自與至少一個多個光介面耦接。裝置的記憶體區塊各自與至少一個多個光電轉換區塊耦接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Technologies related to database architecture designed for computationally expensive workloads are described. A device includes multiple optical interfaces each configured to couple to different set of processing resources. Optical-to-electrical blocks of the device are each coupled to at least one of the multiple optical interfaces. Memory blocks of the device are each coupled to at least one of the multiple optical-to-electrical blocks.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:計算平臺</p>
        <p type="p">102:電連接</p>
        <p type="p">104:光學波導</p>
        <p type="p">106:光纖</p>
        <p type="p">110:包裝單元</p>
        <p type="p">112:處理裝置</p>
        <p type="p">114:記憶體區塊</p>
        <p type="p">116:光介面</p>
        <p type="p">118:輔助介面</p>
        <p type="p">120:記憶體包裝單元</p>
        <p type="p">122:光介面</p>
        <p type="p">124:O/E介面</p>
        <p type="p">126:遠端記憶體區塊</p>
        <p type="p">128:輔助介面</p>
        <p type="p">130:資源管理控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1429" publication-number="202615577">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615577</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131185</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化學放大型正型感光性組合物、感光性乾膜、感光性乾膜之製造方法、經圖案化之阻劑膜之製造方法、附鑄模之基板之製造方法、及鍍敷造形物之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08L33/06</main-classification>
        <further-classification edition="200601120260102B">C08L33/14</further-classification>
        <further-classification edition="200601120260102B">C08L101/00</further-classification>
        <further-classification edition="200601120260102B">C08K5/17</further-classification>
        <further-classification edition="200601120260102B">C08K5/18</further-classification>
        <further-classification edition="200601120260102B">C08K5/3415</further-classification>
        <further-classification edition="200601120260102B">C08K5/3432</further-classification>
        <further-classification edition="200601120260102B">C08K5/3435</further-classification>
        <further-classification edition="200601120260102B">C08K5/37</further-classification>
        <further-classification edition="200601120260102B">C08K5/375</further-classification>
        <further-classification edition="200601120260102B">C08K5/42</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">C23C18/16</further-classification>
        <further-classification edition="200601120260102B">C25D5/02</further-classification>
        <further-classification edition="200601120260102B">H05K3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村上裕也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKAMI, YUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷優梨花</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANI, YURIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鷲見岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMI, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可形成剖面形狀為矩形之經圖案化之阻劑膜且曝光後擱置經時穩定性良好的化學放大型正型感光性組合物、具備感光性層之感光性乾膜、感光性乾膜之製造方法、經圖案化之阻劑膜之製造方法、附鑄模之基板之製造方法、及鍍敷造形物之製造方法。  &lt;br/&gt;本發明之化學放大型正型感光性組合物包含藉由活性光線或放射線之照射而產生酸之酸產生劑(A)、於鹼中之溶解性因酸之作用而增大之樹脂(B)、含硫化合物(E)、及酸擴散抑制劑(F)，且樹脂(B)包含丙烯酸樹脂(B3)，酸產生劑(A)包含產生pKa為-3.5以上且未達0之酸之酸產生劑(A1)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1430" publication-number="202616750">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616750</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131202</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>環境物聯網裝置至讀取器傳輸控制</chinese-title>
        <english-title>AMBIENT INTERNET OF THINGS DEVICE-TO-READER TRANSMISSION CONTROL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120251201B">H04W52/18</main-classification>
        <further-classification edition="202301120251201B">H04W72/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　樂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, LE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古普達　皮義許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUPTA, PIYUSH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕查法　拉菲特札</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATCHAVA, RAVITEJA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金有哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YUCHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武田和樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEDA, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞可亞瓦利諾　艾柏多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICO ALVARINO, ALBERTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露之各種態樣大致上係關於無線通訊。在一些態樣中，一讀取器可將一第一無線通訊信號傳輸至一第一群組之環境物聯網(internet of things, IoT)裝置。該第一群組之環境IoT裝置可至少部分地基於位於距該讀取器的一第一距離範圍內且該第一信號以一第一傳輸功率傳輸而傳輸對該信號的一回應。該讀取器可將一第二無線通訊信號傳輸至一第二群組之環境IoT裝置。該第二群組之環境IoT裝置可至少部分地基於位於距該讀取器的一第二距離範圍內且該信號以一第二傳輸功率傳輸而傳輸對該信號的一回應。描述多種其他態樣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a reader may transmit a first wireless communication signal to a first group of ambient internet of things (IoT) devices. The first group of ambient IoT devices may transmit a response to the signal based at least in part on being located within a first range of distances from the reader and the first signal being transmitted at a first transmit power. The reader may transmit a second wireless communication signal to a second group of ambient IoT devices. The second group of ambient IoT devices may transmit a response to the signal based at least in part on being located within a second range of distances from the reader and the signal being transmitted at a second transmit power. Numerous other aspects are described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:實例</p>
        <p type="p">705:讀取器</p>
        <p type="p">710,715:環境IoT裝置</p>
        <p type="p">720,725,730,735,740:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1431" publication-number="202616022">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616022</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131222</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>狀態確認系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G05B23/02</main-classification>
        <further-classification edition="200601120260102B">G05B19/418</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商村田機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURATA MACHINERY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中城那津子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAJO, NATSUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">狀態確認系統具備收集裝置、記憶裝置及顯示終端機。收集裝置，是收集包括在物流設施行走的行走車的位置數據的運作數據。記憶裝置記憶標籤資訊數據庫，該標籤資訊數據庫將表示行走車的狀態且是由使用者所指定的資訊的標籤資訊、與行走車的識別資訊進行對應。顯示終端機，是接收運作數據，並顯示運作影像，該運作影像是顯示在虛擬平面或虛擬空間上使行走車的模型根據運作數據行走，並且將與行走車對應的標籤資訊附加在該行走車的模型上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">4:顯示終端機</p>
        <p type="p">41:顯示體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1432" publication-number="202615900">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615900</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131232</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用間隔物和離子束蝕刻來製造閃耀光柵的方法</chinese-title>
        <english-title>METHOD TO FABRICATE BLAZED GRATING USING SPACER AND ION BEAM ETCHING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">G02B5/18</main-classification>
        <further-classification edition="200601120260114B">G02B6/124</further-classification>
        <further-classification edition="200601120260114B">H01L21/3065</further-classification>
        <further-classification edition="200601120260114B">G02B27/01</further-classification>
        <further-classification edition="201801120260114B">H04N13/332</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　文輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WENHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王澤芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZEFANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江　雷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邢　嬋娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XING, CHAN JUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　永安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, YONGAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸瑾宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, JINYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的態樣包括形成波導的方法。形成波導的方法包括在基板上沉積心軸。蝕刻心軸的部分以形成溝槽。在心軸和基板上沉積間隔材料。蝕刻間隔材料以在溝槽中形成間隔物。心軸使用離子束蝕刻（IBE）進行蝕刻。蝕刻心軸和基板以形成閃耀光柵。然後移除間隔物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Aspects of the present disclosure includes methods of forming a waveguide. The method of forming a waveguide includes depositing a mandrel disposed over a substrate. Portions of the mandrel are etched to form a trench. A spacer material is deposited over the mandrel and the substrate. The spacer material is etched to form a spacer in the trench. The mandrel is etched using ion beam etching (IBE). The mandrel and the substrate are etched to form a blazed grating. The spacer is removed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:基板</p>
        <p type="p">104A:輸入耦合區域</p>
        <p type="p">106:閃耀光柵</p>
        <p type="p">108:閃耀表面</p>
        <p type="p">112:側壁</p>
        <p type="p">d:線寬</p>
        <p type="p">h:深度</p>
        <p type="p">γ:閃耀角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1433" publication-number="202615145">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615145</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131233</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造乙酸烯丙酯用觸媒及乙酸烯丙酯的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B01J21/08</main-classification>
        <further-classification edition="200601120260102B">B01J23/89</further-classification>
        <further-classification edition="200601120260102B">B01J37/02</further-classification>
        <further-classification edition="200601120260102B">B01J37/04</further-classification>
        <further-classification edition="200601120260102B">B01J37/16</further-classification>
        <further-classification edition="200601120260102B">C07C67/055</further-classification>
        <further-classification edition="200601120260102B">C07C69/155</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商柯萊斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRASUS CHEMICAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小笠原気八</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGASAWARA, KIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩間康拓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWAMA, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>生嶋麻衣子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKUSHIMA, MAIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>細木康弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSOGI, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種對乙酸烯丙酯生成反應顯示高活性，且觸媒金屬合金的比表面積之降低速度較小的製造乙酸烯丙酯用觸媒。一種製造乙酸烯丙酯用觸媒，其係以丙烯、乙酸及氧氣為原料來製造乙酸烯丙酯時所使用之觸媒，其中(a)鈀、(b)釕、(c)選自銅、鎳、鋅及鈷中的至少1種元素，以及(d)鹼金屬鹽係擔持於(e)擔體上，相對於(a)鈀100質量份，(b)釕的量為20～60質量份。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1434" publication-number="202615103">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615103</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131239</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種抗體藥物偶聯物與酪胺酸激酶抑制劑的組合</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260102B">A61K47/68</main-classification>
        <further-classification edition="200601120260102B">A61K39/395</further-classification>
        <further-classification edition="200601120260102B">A61K31/437</further-classification>
        <further-classification edition="200601120260102B">A61K31/436</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商石藥集團巨石生物製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CSPC MEGALITH BIOPHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張利瓊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LIQIONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郝金恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAO, JINHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉勝男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SHENGNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬學超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAN, XUECHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, MINGHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈冉冉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIA, RANRAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張麗軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LIXUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>淡墨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAN, MO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊金玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JINYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>惠希武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUI, XIWU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種用於聯合治療腫瘤的藥物，其包括抗體藥物偶聯物和奧希替尼。同時提供一種治療腫瘤的方法，所述方法包括向需要治療的患者或者受試者施用治療有效量的抗體偶聯藥物和奧希替尼。還提供抗體偶聯藥物在製備與奧希替尼聯用治療腫瘤的藥物中的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1435" publication-number="202616738">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616738</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131262</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多串流動態空間音訊演現</chinese-title>
        <english-title>MULTI-STREAM DYNAMIC SPATIAL AUDIO RENDERING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H04S7/00</main-classification>
        <further-classification edition="200601120260102B">G06F3/16</further-classification>
        <further-classification edition="202201120260102B">H04L65/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大衛斯　格雷厄姆　布蘭得利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAVIS, GRAHAM BRADLEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩格德　仕瓦帕　山卡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THAGADUR SHIVAPPA, SHANKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種裝置包括一或多個處理器，該一或多個處理器經組態以：獲得一音訊串流；及獲得指示一第一穿戴式音訊裝置的一經估計第一空間狀態的第一空間狀態資料。該一或多個處理器經組態以判定對應於該第一穿戴式音訊裝置的一第一裝置識別符。該一或多個處理器經組態以基於該音訊串流而：產生與該經估計第一空間狀態相關聯的一第一經演現音訊串流；及產生一第二經演現音訊串流。該一或多個處理器經組態以向該第一穿戴式音訊裝置及第二穿戴式音訊裝置輸出該經組合音訊串流，該經組合音訊串流包括該第一經演現音訊串流、該第一裝置識別符、及該第二經演現音訊串流，其中該第一經演現音訊串流與該第一裝置識別符相關聯。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device includes one or more processors configured to obtain an audio stream and to obtain first spatial state data that indicates an estimated first spatial state of a first wearable audio device. The one or more processors are configured to determine a first device identifier that corresponds to the first wearable audio device. The one or more processors are configured, based on the audio stream, to generate a first rendered audio stream associated with the estimated first spatial state and to generate a second rendered audio stream. The one or more processors are configured to output, to the first and second wearable audio devices, the combined audio stream that includes the first rendered audio stream, the first device identifier, and the second rendered audio stream, where the first rendered audio stream is associated with the first device identifier.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">102:來源裝置</p>
        <p type="p">104:穿戴式音訊裝置</p>
        <p type="p">106:使用者</p>
        <p type="p">108:穿戴式音訊裝置</p>
        <p type="p">110:使用者</p>
        <p type="p">112:經組合音訊串流</p>
        <p type="p">114:音訊串流</p>
        <p type="p">116:記憶體</p>
        <p type="p">118:處理器</p>
        <p type="p">120:音訊內容</p>
        <p type="p">130:音訊串流管理器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1436" publication-number="202615812">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615812</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131266</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高流量液態前驅物熱交換器</chinese-title>
        <english-title>HIGH-FLOW LIQUID-PRECURSOR HEAT EXCHANGER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">F28F13/06</main-classification>
        <further-classification edition="200601120260114B">C23C16/448</further-classification>
        <further-classification edition="200601120260114B">B01D1/14</further-classification>
        <further-classification edition="200601120260114B">H01L21/205</further-classification>
        <further-classification edition="200601120260114B">G05D23/19</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＴＳＩ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSI INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克路爾　麥可　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCCLURE, MICHAEL DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯蘭　大衛　雅各</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CURRAN, DAVID JACOB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾爾斯沃茲　艾瑞克　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELLSWORTH, ERIC JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯利弗特　奈森尼爾　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SLIEFERT, NATHANIEL DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在各種實施例中，所揭示之標的係一種熱交換器裝置，其包含一熱質量體及以一蛇形配置形成於該熱質量體內之若干流動通道。該等流動通道具有筆直部分，在該等筆直部分之流體耦合之相鄰筆直部分之間具有彎曲。該等筆直部分之相鄰筆直部分實質上彼此平行且在實質上相反方向上提供流體流動路徑。一載氣(carrier-gas)入口埠耦合至該等流動通道之一入口以接收具有含於其中之液滴之一載氣。至少一個加熱器嵌入與該等流動通道熱接觸之該熱質量體中。該加熱器加熱該載氣且蒸發該等液滴以形成一蒸氣。一流體出口埠在與該入口相對的一端耦合至該等流動通道之一出口。本發明亦揭示其他系統及方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In various embodiments, the disclosed subject-matter is a heat-exchanger device that includes a thermal mass and a number of flow channels formed within the thermal mass in a serpentine arrangement. The flow channels have straight portions with bends between fluidically coupling adjacent ones of the straight portions. Adjacent ones of the straight portions are substantially parallel to one another and provide fluidic flow paths in substantially opposite directions. A carrier-gas inlet port is coupled to an inlet of the flow channels to receive a carrier gas having liquid droplets contained therein. At least one heater is embedded into the thermal mass in thermal contact with the flow channels. The heater heats the carrier gas and vaporizes the liquid droplets to form a vapor. A fluid-outlet port is coupled to an outlet of the flow channels on an end opposite to the inlet. Other systems and methods are disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:高流量熱交換器</p>
        <p type="p">101:驅逐氣體入口</p>
        <p type="p">103:載氣入口</p>
        <p type="p">105:流動通道</p>
        <p type="p">107:第一區域</p>
        <p type="p">109:第二區域</p>
        <p type="p">111:第三區域</p>
        <p type="p">113:末端區域</p>
        <p type="p">115:熱質量體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1437" publication-number="202616661">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616661</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131273</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>過驅動電路</chinese-title>
        <english-title>OVERDRIVE CIRCUITRY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H03K19/003</main-classification>
        <further-classification edition="200601120260102B">H03K19/0944</further-classification>
        <further-classification edition="200601120260102B">H03K19/20</further-classification>
        <further-classification edition="201401120260102B">H03K5/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐薪承</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HSIN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-SHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種過驅動電路，包括：瞬態檢測電路，被配置為檢測輸入訊號的瞬態狀態以生成瞬態檢測結果；偏壓緩衝器，被配置為根據該瞬態檢測結果生成低電平參考電壓和高電平參考電壓；高側預驅動器，由供電電壓和該低電平參考電壓供電，並被配置為根據該輸入訊號生成第一驅動訊號；低側預驅動器，由該高電平參考電壓和地電壓供電，並被配置為根據該輸入訊號生成第二驅動訊號；以及後驅動器，被配置為根據該第一驅動訊號和該第二驅動訊號生成輸出訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An overdrive circuitry comprising: a transient detection circuit, configured to detect a transient state of an input signal to generate a transient detection result; a bias buffer, configured to generate a low-level reference voltage and a high-level reference voltage according to the transient detection result; a high-side pre-driver, supplied by a supply voltage and the low-level reference voltage, and configured to generate a first driving signal according to the input signal; a low-side pre-driver, supplied by the high-level reference voltage and a ground voltage, and configured to generate a second driving signal according to the input signal; and a post-driver, configured to generate an output signal according to the first driving signal and the second driving signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">VI:訊號</p>
        <p type="p">VE:使能訊號</p>
        <p type="p">110:控制邏輯</p>
        <p type="p">Din:輸入訊號</p>
        <p type="p">120:瞬態檢測電路</p>
        <p type="p">122:延遲電路</p>
        <p type="p">Din':延遲後的輸入訊號</p>
        <p type="p">124:XOR門</p>
        <p type="p">TD:瞬態檢測結果</p>
        <p type="p">130:偏壓緩衝器</p>
        <p type="p">V1:第一訊號</p>
        <p type="p">VML:低電平參考電壓</p>
        <p type="p">VMH:高電平參考電壓</p>
        <p type="p">V2:第二訊號</p>
        <p type="p">142:高側預驅動器</p>
        <p type="p">144:低側預驅動器</p>
        <p type="p">VDDIO:供電電壓</p>
        <p type="p">100:過驅動電路</p>
        <p type="p">150:後驅動器</p>
        <p type="p">M1,M2,M3,M4:電晶體</p>
        <p type="p">Vout:輸出訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1438" publication-number="202615039">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615039</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131274</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>作為蕈毒鹼乙醯膽鹼受體之正向異位調節劑的３－環丙基吡唑衍生物</chinese-title>
        <english-title>3-CYCLOPROPYLPYRAZOLE DERIVATIVES AS POSITIVE ALLOSTERIC MODULATORS OF THE MUSCARINIC ACETYLCHOLINE RECEPTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/519</main-classification>
        <further-classification edition="200601120260102B">A61K31/5025</further-classification>
        <further-classification edition="200601120260102B">A61K31/4985</further-classification>
        <further-classification edition="200601120260102B">A61K31/4196</further-classification>
        <further-classification edition="200601120260102B">A61K31/4192</further-classification>
        <further-classification edition="200601120260102B">A61K31/4155</further-classification>
        <further-classification edition="200601120260102B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商紐羅斯特瑞克斯製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEUROSTERIX PHARMA SARL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕帕林　珍勞倫特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAPARIN, JEAN-LAURENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅切　珍菲力浦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROCHER, JEAN-PHILIPPE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝爾肖恩　多明尼克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHELSHORN, DOMINIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">
        &lt;img align="absmiddle" height="118px" width="346px" file="ed11112.JPG" alt="ed11112.JPG" img-content="jpg" orientation="portrait" inline="yes"&gt;
        &lt;/img&gt;本發明係關於新穎的式(I')之化合物，其中P、Q、A、B、m、n、R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;9&lt;/sup&gt;、R&lt;sup&gt;10&lt;/sup&gt;、R&lt;sup&gt;11&lt;/sup&gt;及R&lt;sup&gt;12&lt;/sup&gt;如式(I')中所定義。此等化合物可用作蕈毒鹼M4受體亞型(「M4-mAChR」)正向異位調節劑，其可用於治療或預防與蕈毒鹼M4受體功能障礙相關之神經及精神病症以及涉及M4受體之疾病。本發明亦關於包含此等化合物之醫藥組成物、製備此等化合物及此等組成物之方法及此等化合物用於預防或治療神經及精神病症及疾病的用途，該等神經及精神病症及疾病諸如係認知減退、精神分裂症之正性及負性症狀以及受M4蕈毒鹼受體調節之其他病症。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        &lt;img align="absmiddle" height="126px" width="353px" file="ed11113.JPG" alt="ed11113.JPG" img-content="jpg" orientation="portrait" inline="yes"&gt;
        &lt;/img&gt;
        &lt;br/&gt;The present invention relates to novel compounds of Formula (I'), wherein P, Q, A, B, m, n, R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;9&lt;/sup&gt;, R&lt;sup&gt;10&lt;/sup&gt;, R&lt;sup&gt;11&lt;/sup&gt; and R&lt;sup&gt;12&lt;/sup&gt; are defined as in Formula (I'). These compounds may be useful as muscarinic M4 receptor subtype (“M4-mAChR”) positive allosteric modulators which are useful for the treatment or prevention of neurological and psychiatric disorders associated with muscarinic M4 receptor dysfunction and diseases in which the M4 receptor is involved. The invention is also directed to pharmaceutical compositions comprising such compounds, to processes of preparing such compounds and such compositions, and to the use of such compounds for the prevention or treatment of neurological and psychiatric disorders and diseases such as for example, cognitive decline, both positive and negative symptoms in schizophrenia as well as other disorders modulated by M4 muscarinic receptors.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1439" publication-number="202615417">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615417</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131320</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鋶鹽、化學增幅正型阻劑組成物及阻劑圖案形成方法</chinese-title>
        <english-title>SULFONIUM SALT, CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C381/12</main-classification>
        <further-classification edition="200601120260102B">C07D327/08</further-classification>
        <further-classification edition="200601120260102B">C07D333/76</further-classification>
        <further-classification edition="200601120260102B">C09K3/00</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邉聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小竹正晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTAKE, MASAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松澤雄太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUZAWA, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>増永恵一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASUNAGA, KEIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供：在使用高能射線之光微影中，係溶劑溶解性良好，且解像性、LER、圖案形狀等微影性能優異的化學增幅正型阻劑組成物；以及使用該化學增幅阻劑組成物的圖案形成方法。  &lt;br/&gt;本發明之解決手段為下式(A)表示之鋶鹽。  &lt;br/&gt;&lt;img align="absmiddle" height="134px" width="381px" file="ed10494.JPG" alt="ed10494.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sulfonium salt monomer having the formula (A). &lt;br/&gt;&lt;img align="absmiddle" height="157px" width="433px" file="ed10495.JPG" alt="ed10495.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1440" publication-number="202615414">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615414</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131328</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>有機膜形成用組成物、有機膜形成方法、圖案形成方法及化合物</chinese-title>
        <english-title>COMPOSITION FOR FORMING ORGANIC FILM, METHOD FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND COMPOUND</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C323/12</main-classification>
        <further-classification edition="200601120260102B">C07C323/16</further-classification>
        <further-classification edition="200601120260102B">C07C323/52</further-classification>
        <further-classification edition="200601120260102B">C07C381/00</further-classification>
        <further-classification edition="200601120260102B">C08K5/375</further-classification>
        <further-classification edition="200601120260102B">G03F7/11</further-classification>
        <further-classification edition="200601120260102B">G03F7/16</further-classification>
        <further-classification edition="200601120260102B">G03F7/40</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郡大佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KORI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本靖之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, YASUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供基板(晶圓)上之成膜性(面內均勻性)及填埋特性優良，且會抑制EBR步驟時之突起，而且使用作為多層阻劑用之有機下層膜時之製程寬容度優良的有機膜形成用組成物。&lt;br/&gt;  該課題之解決手段為一種有機膜形成用組成物，含有：&lt;br/&gt;  有機膜形成用樹脂或化合物(A)，&lt;br/&gt;  通式(1)表示之化合物(B)，及&lt;br/&gt;  溶劑(C)。&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="178px" width="326px" file="ed10132.JPG" alt="ed10132.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;  R&lt;sub&gt;1&lt;/sub&gt;為通式(2)表示之末端基，X為碳數2~50之n1價有機基，n1表示2~8之整數。&lt;br/&gt;&lt;img align="absmiddle" height="31px" width="60px" file="ed10133.JPG" alt="ed10133.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="132px" width="541px" file="ed10134.JPG" alt="ed10134.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;  R&lt;sub&gt;2&lt;/sub&gt;為1價有機基，且該1價有機基至少含有通式(3)中之任一者表示之具有氟原子之結構。m1為1或2，且m1為1時，Z表示單鍵或也可含有雜原子之2價有機基，m1為2時，Z表示也可含有雜原子之3價有機基。&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="173px" width="638px" file="ed10135.JPG" alt="ed10135.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a composition for forming an organic film that is excellent in terms of film formability (in-plane uniformity) and embedding characteristics on a substrate (wafer), suppresses a hump during an EBR process, and has an excellent process tolerance when used as an organic lower layer film for a multi-layer resist. A composition for forming an organic film containing (A) a resin or compound for forming an organic film, (B) a compound represented by the general formula (1), and (C) a solvent,&lt;br/&gt;&lt;img align="absmiddle" height="65px" width="121px" file="ed10136.JPG" alt="ed10136.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; wherein R&lt;sub&gt;1&lt;/sub&gt; is a terminal group represented by the general formula (2), X is an n1-valent organic group having 2 to 50 carbon atoms, and n1 represents an integer of 2 to 8,&lt;br/&gt;&lt;img align="absmiddle" height="55px" width="249px" file="ed10137.JPG" alt="ed10137.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; wherein R&lt;sub&gt;2&lt;/sub&gt; is a monovalent organic group, wherein the monovalent organic group contains at least any of structures having fluorine atoms represented by the general formula (3), m1 is 1 or 2, wherein when m1 is 1, Z represents a single bond or a divalent organic group optionally containing a heteroatom, and when m1 is 2, Z represents a trivalent organic group optionally containing a heteroatom,&lt;br/&gt;&lt;img align="absmiddle" height="124px" width="572px" file="ed10138.JPG" alt="ed10138.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1441" publication-number="202615390">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615390</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131335</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分子阻劑組成物及圖案形成方法</chinese-title>
        <english-title>MOLECULAR RESIST COMPOSITION AND PATTERNING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C59/135</main-classification>
        <further-classification edition="200601120260102B">C07C63/70</further-classification>
        <further-classification edition="200601120260102B">C07C309/08</further-classification>
        <further-classification edition="200601120260102B">C07C309/12</further-classification>
        <further-classification edition="200601120260102B">C07C309/30</further-classification>
        <further-classification edition="200601120260102B">C07C309/42</further-classification>
        <further-classification edition="200601120260102B">C07C311/04</further-classification>
        <further-classification edition="200601120260102B">C07C311/48</further-classification>
        <further-classification edition="200601120260102B">C07C317/12</further-classification>
        <further-classification edition="200601120260102B">C07C381/12</further-classification>
        <further-classification edition="200601120260102B">C08F12/30</further-classification>
        <further-classification edition="200601120260102B">C08F12/34</further-classification>
        <further-classification edition="200601120260102B">C08F16/32</further-classification>
        <further-classification edition="200601120260102B">C08F20/38</further-classification>
        <further-classification edition="200601120260102B">C08F22/24</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/038</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊地駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大橋正樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHASHI, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供在使用高能射線之光微影中，感度、解析性及LWR優異之分子阻劑組成物、以及使用該分子阻劑組成物之圖案形成方法。本發明為一種分子阻劑組成物，其特徵在於：包含下式(1)或(2)表示之鋶鹽、含有下式(1-1)表示之錪陽離子、及鹵素離子、硝酸離子、硫酸氫離子、碳酸氫離子、四苯基硼酸根離子或下式(1-2)~(1-8)中之任一者表示之陰離子的錪鹽、及有機溶劑，且不含基礎聚合物。  &lt;br/&gt;&lt;img align="absmiddle" height="413px" width="487px" file="ed10084.JPG" alt="ed10084.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a molecular resist composition comprising: a sulfonium salt represented by the following formula (1) or (2); an iodonium salt comprising an iodonium cation represented by the following formula (1-1) and a halide ion, a nitrate ion, a hydrogen sulfate ion, a hydrogen carbonate ion, a tetraphenylborate ion, or an anion represented by any of the following formulae (1-2) to (1-8); and an organic solvent, in which the molecular resist composition is free of a base polymer. This can provide a molecular resist composition that exhibits excellent sensitivity, resolution, and LWR in photolithography employing high-energy rays, and a patterning process using the molecular resist composition. &lt;br/&gt;&lt;img align="absmiddle" height="399px" width="494px" file="ed10085.JPG" alt="ed10085.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1442" publication-number="202615418">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615418</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131356</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鋶鹽、化學增幅正型阻劑組成物及阻劑圖案形成方法</chinese-title>
        <english-title>SULFONIUM SALT, CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C381/12</main-classification>
        <further-classification edition="200601120260102B">C07D327/08</further-classification>
        <further-classification edition="200601120260102B">C07D333/76</further-classification>
        <further-classification edition="200601120260102B">C09K3/00</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供在使用高能射線之光微影中，溶劑溶解性良好，且解析度、LER、圖案形狀等微影性能優良的化學增幅正型阻劑組成物、及使用該化學增幅阻劑組成物之圖案形成方法。  &lt;br/&gt;該課題之解決手段為一種鋶鹽，係以下式(A)表示。  &lt;br/&gt;&lt;img align="absmiddle" height="139px" width="356px" file="ed10502.JPG" alt="ed10502.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sulfonium salt monomer having the formula (A). &lt;br/&gt;&lt;img align="absmiddle" height="135px" width="351px" file="ed10503.JPG" alt="ed10503.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1443" publication-number="202615903">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615903</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131386</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>附黏著劑層之光學積層膜、附黏著劑層之光學積層膜的研磨方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251231B">G02B5/30</main-classification>
        <further-classification edition="201901120251231B">B32B7/023</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太田裕史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTA, HIROFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萩原慎也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAGIHARA, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供在貼合於被著體的表面時，可避免氣泡混入至端部附近的附黏著劑層之光學積層膜。  &lt;br/&gt;　　[解決手段]附黏著劑層之光學積層膜(1A)依該順序具備表面保護膜(7)、包含吸附配向有二色性色素之偏光片(2)的光學積層膜(4A)、黏著劑層(5)、及可剝離地接觸於黏著劑層(5)的分離件(6)。附黏著劑層之光學積層膜(1A)的側面之至少一部分中，黏著劑層(5)及分離件(6)向比光學積層膜(4A)的最外端位置更外側突出1μm以上且未達10μm，黏著劑層(5)的突出部分向光學積層膜(4A)側上翹1μm以上。剝離分離件(6)並將光學積層膜(4A)貼合於被著體的表面時，黏著劑層(5)的最外端部不會先接觸於被著體的表面，因此氣泡難以混入。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:附黏著劑層之光學積層膜</p>
        <p type="p">2:偏光膜(偏光片)</p>
        <p type="p">3:保護膜</p>
        <p type="p">4A:光學積層膜</p>
        <p type="p">5:黏著劑層</p>
        <p type="p">6:分離件</p>
        <p type="p">7:表面保護膜</p>
        <p type="p">d,d’:突出量</p>
        <p type="p">h:上翹量</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1444" publication-number="202616019">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616019</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131390</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製造製程的系統、方法與媒介</chinese-title>
        <english-title>SYSTEMS, METHODS, AND MEDIA FOR A MANUFACTURING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">G05B19/418</main-classification>
        <further-classification edition="202301120260114B">G06N3/04</further-classification>
        <further-classification edition="200601120260114B">G05B11/32</further-classification>
        <further-classification edition="200601120260114B">H01L21/66</further-classification>
        <further-classification edition="202301120260114B">G06N5/04</further-classification>
        <further-classification edition="200601120260114B">G05B23/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商奈米創尼克影像公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANOTRONICS IMAGING, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樸特曼　強恩　Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PUTMAN, JOHN B.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樸特曼　馬修　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PUTMAN, MATTHEW C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　喬安納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JOANNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黎莫葛　達瑪斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIMOGE, DAMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴布羅　強納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOBROW, JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">各項實施例係關於一種用於分析製造製程資料之方法。該方法包含：藉由一處理器接收來自監測一製造製程之複數個感測器之一序列感測器輸出；使用藉由該處理器執行之一變換器模型基於該等感測器輸出預測未來製造製程參數；基於該變換器模型之一注意力矩陣產生對一當前系統狀態之一或多個關鍵影響者；分析該等經預測參數以識別一不符合規格參數；及基於與該不符合規格參數相關聯之一變換器頭之注意力矩陣識別對該不符合規格參數之一或多個關鍵貢獻者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various embodiments relate to a method for analyzing manufacturing process data. The method includes: receiving, by a processor, a sequence of sensor outputs from a plurality of sensors monitoring a manufacturing process; predicting, using a transformer model executed by the processor, future manufacturing process parameters based on the sensor outputs; generating one or more key influencers on a current system state based on an attention matrix of the transformer model; analyzing the predicted parameters to identify an out-of-specification parameter; and identifying one or more key contributors to the out-of-specification parameter based on the attention matrix of a transformer head associated therewith.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:監督控制及資料獲取(SCADA)系統</p>
        <p type="p">102:人機介面(HMI)</p>
        <p type="p">104:機器學習演算法</p>
        <p type="p">106:現場控制器</p>
        <p type="p">108:感測器</p>
        <p type="p">110:儀器輸出</p>
        <p type="p">112:使用者</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1445" publication-number="202616788">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616788</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131393</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有電路板缺口的垂直整合式穩壓器</chinese-title>
        <english-title>VERTICAL INTEGRATED VOLTAGE REGULATOR WITH CIRCUIT BOARD CUTOUT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H05K1/18</main-classification>
        <further-classification edition="200601120260102B">G06F1/18</further-classification>
        <further-classification edition="200601120260102B">G06F1/26</further-classification>
        <further-classification edition="200601120260102B">H01L23/36</further-classification>
        <further-classification edition="200601120260102B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商ＡＲＭ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARM LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴一馬建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, YIMAJIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴拉庫茲　札菲爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELACRUZ, JAVIER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾肯　史都華詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AITKEN, STUART JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫伯霍爾茲　雷納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERBERHOLZ, RAINER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯里坎特　蘇曼特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SRIKANT, SUMANT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史考特　喬治約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCOTT, GEORGE JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威廉斯　彼得安德魯瑞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILLIAMS, PETER ANDREW REES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭建林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, JIANLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種積體電路組件包含積體電路晶粒及基板，該基板在該基板的第一安裝表面上耦接至該積體電路晶粒。印刷電路板具有形成於其中的孔洞，並在該基板的第二安裝表面上連接至該基板。垂直整合式穩壓器組件包含一或多個電感器及一或多個電壓調節電路，並在該基板的第二安裝表面上的實體位置處連接至該基板，該第二安裝表面與該基板的該第一安裝表面相對。該垂直整合式穩壓器組件的至少一部分及該基板的至少一部分由垂直於且穿過該基板的該等第一及第二安裝表面的軸線相交，且該垂直整合式穩壓器至少部分設置在該印刷電路板中的該孔洞內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated circuit assembly comprises an integrated circuit die and a substrate coupled to the integrated circuit die on a first mounting surface of the substrate. A printed circuit board has a hole formed therein, and is connected to the substrate connected on a second mounting surface of the substrate. A vertically integrated voltage regulator assembly comprises one or more inductors and one or more voltage regulation circuits, and is connected to the substrate at a physical location on a second mounting surface of the substrate opposite the first mounting surface of the substrate. At least a portion of the vertically integrated voltage regulator assembly and at least a portion of the substrate are intersected by an axis normal to and through the first and second mounting surfaces of the substrate, and the vertically integrated voltage regulator is disposed at least partially within the hole in the printed circuit board.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:積體電路晶粒</p>
        <p type="p">104:基板</p>
        <p type="p">106:電感器</p>
        <p type="p">108:電壓調節電路</p>
        <p type="p">110:熱介面</p>
        <p type="p">112:散熱片</p>
        <p type="p">114:印刷電路板</p>
        <p type="p">116:孔洞或缺口</p>
        <p type="p">118:焊球</p>
        <p type="p">120:襯墊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1446" publication-number="202615461">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615461</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131401</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>結合聚集蛋白聚糖之免疫球蛋白</chinese-title>
        <english-title>AGGRECAN BINDING IMMUNOGLOBULINS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07K16/18</main-classification>
        <further-classification edition="200601120260102B">C07K16/40</further-classification>
        <further-classification edition="200601120260102B">A61K39/395</further-classification>
        <further-classification edition="200601120260102B">A61P19/02</further-classification>
        <further-classification edition="200601120260102B">C12N15/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比利時商艾伯林克斯公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABLYNX NV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商馬克專利公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCK PATENT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史蒂芬森　索倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEFFENSEN, SOREN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝斯特　葛拉德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BESTE, GERALD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫曼斯　蓋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERMANS, GUY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古賀林　漢斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUHRING, HANS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉德爾　克莉絲多夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LADEL, CHRISTOPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多立克斯　拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOLEIKIS, LARS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於特異性結合聚集蛋白聚糖之免疫球蛋白，且更尤其關於多肽、編碼此類多肽之核酸；用於製備此類多肽之方法；包含此類多肽之組合物及尤其醫藥組合物，用於達成預防、治療或診斷之目的。詳言之，本發明之免疫球蛋白抑制聚集蛋白聚糖之活性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to immunoglobulins that specifically bind Aggrecan and more in particular to polypeptides, nucleic acids encoding such polypeptides; to methods for preparing such polypeptides; to compositions and in particular to pharmaceutical compositions that comprise such polypeptides, for prophylactic, therapeutic or diagnostic purposes. In particular, the immunoglobulins of the present invention inhibit the activity of Aggrecan.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1447" publication-number="202616031">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616031</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131434</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>冷媒封入裝置及冷媒封入方法</chinese-title>
        <english-title>REFRIGERANT CHARGING DEVICE AND REFRIGERANT CHARGING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251231B">G05D7/06</main-classification>
        <further-classification edition="200601120251231B">F28D15/02</further-classification>
        <further-classification edition="200601120251231B">H01L23/473</further-classification>
        <further-classification edition="200601120251231B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO PRECISION PRODUCTS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木康博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤秀明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, HIDEAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的冷媒封入裝置(100)係具備：冷媒配管(30)，係內部可流通從冷媒貯藏部(21)所供給的液態冷媒；冷媒流量測量部(1)，係測量冷媒配管的內部流通的液態冷媒的流量；真空泵(2)，係進行抽吸而使冷媒配管的內部成為真空；複數個閥(3)，係開閉冷媒配管的內部的流路；控制部(4)，係控制複數個閥及真空泵；以及加熱器(5)，係對冷媒貯藏部進行加熱；控制部，係根據冷媒流量測量部所測量到的液態冷媒的流量來控制加熱器，調整要對冷卻器(50)供給的冷媒量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This refrigerant charging device (100) according to the present invention includes: a refrigerant pipe (30) through which liquid refrigerant supplied from a refrigerant storage unit (21) can flow; a refrigerant flow rate measuring unit (1) that measures the flow rate of the liquid refrigerant flowing through the refrigerant pipe; a vacuum pump (2) that draws air to create a vacuum inside the refrigerant pipe; multiple valves (3) that open and close the flow paths inside the refrigerant pipe; a control unit (4) that controls the multiple valves and the vacuum pump; and a heater (5) that heats the refrigerant storage unit. The control unit controls the heater based on the flow rate of the liquid refrigerant measured by the refrigerant flow rate measuring unit, thereby adjusting the amount of refrigerant supplied to a cooler (50).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:冷媒流量測量部</p>
        <p type="p">2:真空泵</p>
        <p type="p">3:複數個閥</p>
        <p type="p">3a:第一冷媒控制閥</p>
        <p type="p">3b:第二冷媒控制閥</p>
        <p type="p">3c:真空度測量部保護閥</p>
        <p type="p">3d:真空控制閥</p>
        <p type="p">4:控制部</p>
        <p type="p">4a:處理器</p>
        <p type="p">4b:記憶體</p>
        <p type="p">5:加熱器</p>
        <p type="p">5a:溫度調節器</p>
        <p type="p">5b:記憶體</p>
        <p type="p">6:壓力測量部</p>
        <p type="p">7:真空度測量部</p>
        <p type="p">8:顯示部</p>
        <p type="p">9:溫度測量部</p>
        <p type="p">10:冷媒流量調節部</p>
        <p type="p">11:連接部</p>
        <p type="p">12:冷媒供給系統</p>
        <p type="p">12a:第一冷媒供給系統</p>
        <p type="p">12b:第二冷媒供給系統</p>
        <p type="p">20:冷媒迴路</p>
        <p type="p">20a:第一冷媒迴路</p>
        <p type="p">20b:第二冷媒迴路</p>
        <p type="p">21:冷媒貯藏部</p>
        <p type="p">30:冷媒配管</p>
        <p type="p">31:真空度測量部連接配管</p>
        <p type="p">32:真空配管</p>
        <p type="p">100:冷媒封入裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1448" publication-number="202615865">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615865</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131438</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於檢測與監測乳癌的生物標記物</chinese-title>
        <english-title>BIOMARKERS FOR DETECTING AND MONITORING BREAST CANCER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260106B">G01N33/574</main-classification>
        <further-classification edition="200601120260106B">G01N33/53</further-classification>
        <further-classification edition="200601120260106B">G01N33/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>昇捷生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN JET BIOTECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡有光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAY, YEOU-GUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭志玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示一種診斷一患者之乳癌（breast cancer，BC）健康狀態、或BC健康狀態變化、或用於診斷一患者之BC風險或BC存在之方法，其包含：藉由在非還原條件下執行一毛細管電泳，自該患者之一血漿樣本中檢測對應於血小板反應蛋白-1（thrombospondin-1，THBS1）或一含THBS1之複合結構的一或多個生物標記物值；以及基於該等生物標記物值，判定該患者罹患或未罹患BC、或具有或不具有一BC健康狀態之變化，或具有或不具有一BC風險。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a method for diagnosing a patient’s breast cancer (BC) health state, or change in BC health state, or for diagnosing risk of BC or the presence of BC in a patient, comprising detecting, in a plasma sample from said patient, one or more biomarker values that corresponds to thrombospondin-1 (THBS1) or a THBS1-containing complex structure by performing a capillary electrophoresis under non-reducing conditions, and assigning the patient as having or not having BC, or having or not having a change in BC health state, or having or not having a risk of BC based on said biomarker values.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1449" publication-number="202615741">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615741</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131453</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>萊賽爾材料、包含其的用於吸煙製品的過濾嘴和吸煙製品</chinese-title>
        <english-title>LYOCELL MATERIAL, FILTERS FOR SMOKING ARTICLES, AND SMOKING ARTICLES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">D01F2/00</main-classification>
        <further-classification edition="200601120260105B">D01D5/22</further-classification>
        <further-classification edition="200601120260105B">A24D3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商可隆股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOLON INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商韓國煙草人參股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KT&amp;G CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭智恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, JI EUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李廷薫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JEONG HUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權昭延</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, SO YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金聖勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SEONG HUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭鍾喆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, JONG CHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬京培</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, KYENG BAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇聖鍾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KI, SUNG JONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁眞哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JIN CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河成薰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HA, SUNG HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃珉姬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, MIN HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓孟儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及一種萊賽爾材料、一種用於吸煙製品的過濾嘴、包括該萊賽爾材料的過濾嘴、以及包括該過濾嘴的吸煙製品。根據本申請的萊賽爾材料和用於吸煙製品的過濾嘴可以替代傳統的醋酸纖維素材料和包括傳統的醋酸纖維素材料的用於吸煙製品的過濾嘴。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application relates to a lyocell material, a filter for smoking articles, the filter including the lyocell material, and a smoking article including the filter. The lyocell material and the filter for smoking articles, according to the present application, may replace conventional cellulose acetate materials and filters for smoking articles including conventional cellulose acetate materials.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1450" publication-number="202615178">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615178</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131457</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有電場輔助燒結技術材料的高爾夫球桿頭及其製造方法</chinese-title>
        <english-title>GOLF CLUB HEAD HAVING FAST MATERIALS AND METHODS FOR MANUFACURING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251223B">B22F3/10</main-classification>
        <further-classification edition="201501120251223B">A63B53/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商卡斯登製造公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARSTEN MANUFACTURING CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬羅塔　湯瑪士Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MALOTA, THOMAS M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德格內斯　裘夏Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEGERNESS, JOSHUA A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝肯　柯瑞Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BACON, CORY S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑克森　馬丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JACKSON, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛拉漢　西蒙Ｔ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRAHAM, SIMON J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴爾德豪斯　湯瑪士Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHILDERHOUSE, THOMAS M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利斯特　塞繆爾Ｔ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LISTER, SAMUEL T.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布蘭奇　奧利佛Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLANCH, OLIVER L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普雷莫利　丹尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PREMOLI, DENNIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>俞大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明高爾夫球桿頭實施例具有使用電場輔助燒結技術鍛造而成的零件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of a golf club head with components forged using Field Assisted Sintering Technology.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:桿頭</p>
        <p type="p">104:面板</p>
        <p type="p">112:擊球表面</p>
        <p type="p">114:後表面</p>
        <p type="p">118:內腔</p>
        <p type="p">124:開口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1451" publication-number="202615633">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615633</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131472</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蝕刻液、基板之處理方法、及半導體器件之製造方法</chinese-title>
        <english-title>ETCHING LIQUID, METHOD FOR TREATING SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C09K13/08</main-classification>
        <further-classification edition="200601120260102B">H01L21/306</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋和敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, KAZUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋智威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, TOMONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮崎広輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAZAKI, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大津暁彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHTSU, AKIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可抑制對含SiOCN物的蝕刻性、且對含SiGe物的蝕刻性良好的蝕刻液、以及基板之處理方法及半導體器件之製造方法。本發明之蝕刻液包含具有酸性基及鹼性基的特定化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1452" publication-number="202615394">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615394</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131478</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>錪鹽、化學增幅正型阻劑組成物及阻劑圖案形成方法</chinese-title>
        <english-title>IODONIUM SALT, CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C63/10</main-classification>
        <further-classification edition="200601120260102B">C07C65/24</further-classification>
        <further-classification edition="200601120260102B">C07C309/65</further-classification>
        <further-classification edition="200601120260102B">C07D347/00</further-classification>
        <further-classification edition="200601120260102B">C09K3/00</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供使用高能射線之光微影中，溶劑溶解性良好且解像性、LER、圖案形狀等微影性能優異之化學增幅正型阻劑組成物、及使用該化學增幅阻劑組成物之圖案形成方法。一種下式(A)表示之錪鹽。  &lt;br/&gt;&lt;img align="absmiddle" height="148px" width="366px" file="ed10489.JPG" alt="ed10489.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A betaine type iodonium salt containing a C6-C18 alkyl or C4-C18 fluorinated alkyl group and having a iodonium cation and a carboxylate anion within a common molecule is a useful quencher. A chemically amplified positive resist composition comprising the iodonium salt exhibits improved lithography properties such as resolution, LER and pattern profile when processed by photolithography.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1453" publication-number="202615738">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615738</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131484</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>矽基板的處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">C30B33/12</main-classification>
        <further-classification edition="200601120260108B">C23C12/02</further-classification>
        <further-classification edition="202501120260108B">H10D30/64</further-classification>
        <further-classification edition="200601120260108B">H01L21/324</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU HANDOTAI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大槻剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHTSUKI, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上東洋太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEHIGASHI, YOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松原壽樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUBARA, TOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木温</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部達夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, TATSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種矽基板的處理方法，其中，對於面方位為(551)的矽基板，在爐內以比940℃更高的溫度實行高溫處理，該高溫處理後冷卻至低於840℃的溫度時，在該冷卻時通過的840℃至940℃的溫度帶中保持10℃/min以上的冷卻速度來進行冷卻。藉此，提供一種矽基板的處理方法，其能夠抑制由面方位為(551)的矽基板的高溫處理導致的微小突起的產生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1454" publication-number="202614992">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614992</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131486</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水中油型乳化組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">A61K8/92</main-classification>
        <further-classification edition="200601120260113B">A61Q19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商花王股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇武龍太朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOBU, RYUUTAROU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種水中油型乳化組成物，其摻合了紫外線散射劑與固體之紫外線吸收劑，即使不使用聚矽氧油，仍乳化安定性良好、不黏瘩，亦不產生氣味等。  &lt;br/&gt;本發明係關於一種水中油型乳化組成物，其含有下述成分(A)、(B)、(C)及(D)；成分(B)相對於成分(C)之質量比(B/C)為0.3以上，成分(C1)相對於成分(C)總量之含有質量比(C1/C)為0.3以上；且不含聚矽氧油。  &lt;br/&gt;(A)水溶性增黏劑  &lt;br/&gt;(B)經疏水化處理之微粒子金屬氧化物  &lt;br/&gt;(C)含有選自脂肪酸C1-C5烷基酯及二羧酸二(C1-C5烷基)酯之1種以上酯油(C1)的液狀油  &lt;br/&gt;(D)25℃為固體之紫外線吸收劑</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1455" publication-number="202616570">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616570</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131496</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組件、電連接器及電連接器裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260102B">H01R12/78</main-classification>
        <further-classification edition="201101120260102B">H01R12/58</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商愛伯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>I-PEX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小栁昭人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOYANAGI, AKITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之插頭接點(11)連接於具有可撓性之屏蔽電纜(4)之芯線之一端。絕緣性之插頭殼體(12)保持屏蔽電纜(4)及插頭接點(11)。插頭殼(13)固定於插頭殼體(12)，與插頭殼體(12)一起保持屏蔽電纜(4)。插頭殼體(12)具備：嵌合部(50a)，其與插座連接器嵌合，且保持於+Z方向上延伸之屏蔽電纜(4)，且該+Z方向沿著安裝有插座連接器之基板中之主表面之法線；及延伸部(50b)，其與嵌合部(50a)中之遠離插座連接器之端部連續地形成，並保持沿與+Z方向交叉之第2方向(+Z方向與+Y方向之間之方向)上延伸之屏蔽電纜(4)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">4:屏蔽電纜</p>
        <p type="p">10:組件</p>
        <p type="p">11:插頭接點(導電接點)</p>
        <p type="p">12:插頭殼體(殼體)</p>
        <p type="p">12a:基底部</p>
        <p type="p">12b:保持板</p>
        <p type="p">13:插頭殼(導電殼)</p>
        <p type="p">13a:第1保持部</p>
        <p type="p">40:基部</p>
        <p type="p">41:凸部</p>
        <p type="p">42:柱部</p>
        <p type="p">43:端緣部</p>
        <p type="p">50a:嵌合部</p>
        <p type="p">50b:延伸部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1456" publication-number="202615419">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615419</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131508</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鋶鹽、化學增幅正型阻劑組成物及阻劑圖案形成方法</chinese-title>
        <english-title>SULFONIUM SALT, CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C381/12</main-classification>
        <further-classification edition="200601120260102B">C07D327/08</further-classification>
        <further-classification edition="200601120260102B">C07D333/76</further-classification>
        <further-classification edition="200601120260102B">C09K3/00</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供：在使用高能射線之光微影中，係溶劑溶解性良好，且解像性、LER、圖案形狀等微影性能優異的化學增幅正型阻劑組成物；以及使用該化學增幅阻劑組成物的圖案形成方法。  &lt;br/&gt;本發明之解決手段為下式(A)表示之鋶鹽。  &lt;br/&gt;&lt;img align="absmiddle" height="149px" width="338px" file="ed10496.JPG" alt="ed10496.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sulfonium salt monomer having the formula (A). &lt;br/&gt;&lt;img align="absmiddle" height="136px" width="353px" file="ed10497.JPG" alt="ed10497.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1457" publication-number="202615273">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615273</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131510</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於兒童汽車安全座椅之可移動底座</chinese-title>
        <english-title>MOVABLE BASE FOR CHILD CAR SEAT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B60N2/28</main-classification>
        <further-classification edition="200601120260102B">B60N2/07</further-classification>
        <further-classification edition="200601120260102B">B60N2/14</further-classification>
        <further-classification edition="201801120260102B">B60N2/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞繆爾　吉爾哈特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMUEL, GEARHART</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茱莉亞　彭澤克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JULIA, PONZEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種兒童約束系統包括可安裝至一車輛座椅之一支撐底座。該支撐底座包括一第一底座部分及一第二底座部分。該第一底座部分可相對於該支撐底座在一行進位置與一裝載位置之間旋轉，並且該第一底座部分在處於該裝載位置時可在一縮回位置與一延伸位置之間平移。一兒童安全座椅可連接至該第一底座部分。該第一底座部分包括一偏置總成，該偏置總成經組態以將該第一底座部分朝向該行進位置及該縮回位置中之至少一者偏置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A child restraint system includes a support base mountable to a vehicle seat. The support base includes a first base portion and a second base portion. The first base portion is rotatable relative to the support base between a travel position and a loading position and the first base portion is translatable, when in the loading position, between a retracted position and an extended position. A child seat is connectable to the first base portion. The first base portion includes a biasing assembly configured to bias the first base portion toward at least one of the travel position and the retracted position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">122:支撐底座</p>
        <p type="p">150:第一底座部分</p>
        <p type="p">152:第二底座部分</p>
        <p type="p">160:旋轉組件</p>
        <p type="p">162:滑動組件</p>
        <p type="p">164:橫向側</p>
        <p type="p">166:上部表面</p>
        <p type="p">170:第一定位總成</p>
        <p type="p">172:軸或柱</p>
        <p type="p">174:扭轉彈簧</p>
        <p type="p">176:自旋致動器</p>
        <p type="p">178:手柄</p>
        <p type="p">180:第二定位總成</p>
        <p type="p">182a:第一滑動槽</p>
        <p type="p">182b:第二滑動槽</p>
        <p type="p">192a:第一鎖孔</p>
        <p type="p">196:滑動致動器</p>
        <p type="p">198:手柄</p>
        <p type="p">210:偏置總成</p>
        <p type="p">212a:彈簧偏置柱</p>
        <p type="p">212b:彈簧偏置柱</p>
        <p type="p">214a:槽</p>
        <p type="p">214b:槽</p>
        <p type="p">R:旋轉軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1458" publication-number="202616268">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616268</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131525</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於將保真立體音響格式聲訊訊號描繪至二維度（２Ｄ）揚聲器設置之方法和裝置以及電腦可讀式儲存媒體</chinese-title>
        <english-title>METHOD AND APPARATUS FOR RENDERING AMBISONICS FORMAT AUDIO SIGNAL TO 2D LOUDSPEAKER SETUP AND COMPUTER READABLE STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260105B">G10L19/008</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞典商杜比國際公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOLBY INTERNATIONAL AB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱勒　弗羅里安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEILER, FLORIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波漢　約哈拿斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOEHM, JOHANNES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">三維度(3D)音感可合成或擷取為自然聲場。為供解碼，需要解碼矩陣，專用於指定揚聲器設置，並使用已知揚聲器位置產生。然而，有些聲源方向因二維度(2D)揚聲器設置，像例如5.1週圍而衰減。以聲場格式所編碼聲訊訊號為L個揚聲器在已知位置之改進解碼方法，包括步驟為：在L個揚聲器之位置添加(10)至少一虛擬揚聲器之位置；產生(11)3D解碼矩陣(D')，其中使用L個揚聲器之位置(&lt;img align="absmiddle" height="26px" width="22px" file="d10014.TIF" alt="其他非圖式ed10014.png" img-content="character" orientation="portrait" inline="no" giffile="ed10014.png"/&gt;...&lt;img align="absmiddle" height="27px" width="24px" file="d10015.TIF" alt="其他非圖式ed10015.png" img-content="character" orientation="portrait" inline="no" giffile="ed10015.png"/&gt;)和至少一虛擬位置(&lt;img align="absmiddle" height="33px" width="44px" file="d10013.TIF" alt="其他非圖式ed10013.png" img-content="character" orientation="portrait" inline="no" giffile="ed10013.png"/&gt;)；縮混(12)3D解碼矩陣(D')，使用降尺寸3D解碼矩陣(&lt;img align="absmiddle" height="23px" width="18px" file="d10012.TIF" alt="其他非圖式ed10012.png" img-content="character" orientation="portrait" inline="no" giffile="ed10012.png"/&gt;)，解碼(14)所編碼聲訊訊號(i14)。結果，獲得複解碼之揚聲器訊號(q14)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Sound scenes in 3D can be synthesized or captured as a natural sound field. For decoding, a decode matrix is required that is specific for a given loudspeaker setup and is generated using the known loudspeaker positions. However, some source directions are attenuated for 2D loudspeaker setups like e.g. 5.1 surround. An improved method for decoding an encoded audio signal in soundfield format for L loudspeakers at known positions comprises steps of adding (10) a position of at least one virtual loudspeaker to the positions of the L loudspeakers, generating (11) a 3D decode matrix (D’), wherein the positions (&lt;img align="absmiddle" height="29px" width="22px" file="d10019.TIF" alt="其他非圖式ed10019.png" img-content="character" orientation="portrait" inline="no" giffile="ed10019.png"/&gt;...&lt;img align="absmiddle" height="30px" width="26px" file="d10016.TIF" alt="其他非圖式ed10016.png" img-content="character" orientation="portrait" inline="no" giffile="ed10016.png"/&gt;) of the L loudspeakers and the at least one virtual position(&lt;img align="absmiddle" height="32px" width="47px" file="d10018.TIF" alt="其他非圖式ed10018.png" img-content="character" orientation="portrait" inline="no" giffile="ed10018.png"/&gt;) are used, downmixing (12) the 3D decode matrix (D’), and decoding (14) the encoded audio signal (i14) using the downscaled 3D decode matrix(&lt;img align="absmiddle" height="27px" width="17px" file="d10017.TIF" alt="其他非圖式ed10017.png" img-content="character" orientation="portrait" inline="no" giffile="ed10017.png"/&gt;). As a result, a plurality of decoded loudspeaker signals (q14) is obtained.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:添加虛擬揚聲器，方程式(6)</p>
        <p type="p">11:3D解碼矩陣設計</p>
        <p type="p">12:縮混，方程式(8)</p>
        <p type="p">13:常態化，方程式(9)</p>
        <p type="p">14:以解碼矩陣進行解碼</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1459" publication-number="202616379">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616379</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131530</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251008B">H01L21/306</main-classification>
        <further-classification edition="200601120251008B">H01L21/67</further-classification>
        <further-classification edition="200601120251008B">B05C5/02</further-classification>
        <further-classification edition="200601120251008B">G05D7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商芝浦機械電子裝置股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBAURA MECHATRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土持鷹彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUCHIMOCHI, TAKAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種抑制供給至基板的下表面的處理液的溫度降低的基板處理裝置及基板處理方法。基板處理裝置（1）包括：旋轉保持部（10）；下表面噴出噴嘴（32）；下表面供給管（33）；加熱部（35）；流量調整部（38）；以及控制裝置（40），控制裝置（40）包括：升溫控制部（41），在旋轉保持部（10）對基板（W）進行保持的狀態下，對流量調整部（38）進行控制以將處理液（L）噴出至未到達基板（W）的下表面（b）的高度，並使下表面供給管（33）升溫；以及處理控制部（42），在使下表面供給管（33）升溫後，對流量調整部（38）進行控制以將處理液（L）噴出至到達基板（W）的下表面（b）的高度，並進行基板（W）的處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">30:下表面處理液供給部</p>
        <p type="p">31:噴嘴頭</p>
        <p type="p">32:下表面噴出噴嘴</p>
        <p type="p">33:下表面供給管</p>
        <p type="p">34:處理液供給源</p>
        <p type="p">35:加熱部(標記為H)</p>
        <p type="p">36:配管</p>
        <p type="p">36a:泵(標記為P)</p>
        <p type="p">37a、37b、37c:開閉閥</p>
        <p type="p">38:流量調整部</p>
        <p type="p">131:保持筒</p>
        <p type="p">311:凹部</p>
        <p type="p">312:排液孔</p>
        <p type="p">313:排液路</p>
        <p type="p">341:流出口</p>
        <p type="p">342:流入口</p>
        <p type="p">361:送出配管</p>
        <p type="p">362:循環配管</p>
        <p type="p">363:分支配管</p>
        <p type="p">364:流量調整配管</p>
        <p type="p">b:下表面</p>
        <p type="p">t:上表面</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1460" publication-number="202616288">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616288</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131541</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>向量矩陣乘法陣列的可配置輸入及輸出區塊</chinese-title>
        <english-title>CONFIGURABLE INPUT AND OUTPUT BLOCKS FOR VECTOR-BY-MATRIX MULTIPLICATION ARRAY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">G11C11/54</main-classification>
        <further-classification edition="200601120260113B">G11C16/02</further-classification>
        <further-classification edition="200601120260113B">G06N3/06</further-classification>
        <further-classification edition="200601120260113B">G06F17/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商超捷公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICON STORAGE TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　曉萬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRAN, HIEU VAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武　華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VU, HOA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔　安德魯庫尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOE, ANDREW KUNIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武　順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VU, THUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪　史丹利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, STANLEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRINH, STEPHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一個實施例中，一種系統包含：一向量矩陣乘法陣列，其包含排列成列及行之非揮發性記憶體胞元；及一輸出區塊，其耦合至該向量矩陣乘法陣列以自該陣列之該等行接收電流，該輸出區塊包含：一電流至電壓轉換器，其用於自一或二個行接收電流並且將該電流轉換成一電壓，該電流至電壓轉換器包含可配置以調整該電壓之範圍之一或多個可變電阻器；及一類比至數位轉換器，其用於將該電壓轉換成數位位元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In one example, a system comprises a vector-by-matrix multiplication array comprising nonvolatile memory cells arranged into rows and columns; and an output block coupled to the vector-by-matrix multiplication array to receive current from the columns of the array, the output block comprising a current-to-voltage converter to receive current from one or two columns and convert the current into a voltage, the current-to-voltage converter comprising one or more variable resistors configurable to adjust the range of the voltage; and an analog-to-digital converter to convert the voltage into digital bits.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3401:VMM陣列</p>
        <p type="p">3501-0,3501-1,3501-n:列電路</p>
        <p type="p">3502-0,3502-1,3502-n:位址解碼器</p>
        <p type="p">3503-0,3503-1,3503-n:列暫存器</p>
        <p type="p">3504-0,3504-1,3504-n:標籤位元</p>
        <p type="p">3505-0,3505-1,3505-n:選擇器</p>
        <p type="p">3506-0,3506-1,3506-n:緩衝器</p>
        <p type="p">3507:全域數位至類比轉換器(GDAC)</p>
        <p type="p">3508-0,3508-1,3508-n:多工器</p>
        <p type="p">3570:輸入區塊</p>
        <p type="p">ADDR:位址</p>
        <p type="p">DIN-0:資料輸入/所儲存資料</p>
        <p type="p">EN:致能信號</p>
        <p type="p">S:選擇信號</p>
        <p type="p">W/R:埠</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1461" publication-number="202615824">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615824</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131563</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有不同高度的聲學感測器系統</chinese-title>
        <english-title>ACOUSTIC SENSOR SYSTEMS WITH DIFFERENT HEIGHTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G01H11/08</main-classification>
        <further-classification edition="200601120260102B">G06F3/043</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯特洛夫曼　潔西卡劉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STROHMANN, JESSICA LIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王宏仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUNG-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　載亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, JAE HYEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁偉翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, WEI-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林湘琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIANG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示具有不同高度的聲學感測器系統、以及用於組態及操作此類感測器系統的方法。在一些實施例中，本文所描述之一種感測器系統可包括：一聲學傳輸器元件；及一聲學接收器元件；其中該聲學傳輸器元件的該壓電材料的該第一部分包含一第一厚度，且該聲學接收器元件的該壓電材料的該第二部分包含不同於該第一厚度的一第二厚度；且其中該隔離層經結構化以產生一間隙，該間隙將該第二電極層的該第一部分與該第二電極層的該第二部分實體地分開。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Acoustic sensor systems with different heights, as well as methods for configuring and operating such sensor systems are disclosed. In some embodiments, a sensor system described herein may include an acoustic transmitter element; and an acoustic receiver element; wherein the first portion of the piezoelectric material of the acoustic transmitter element comprises a first thickness, and the second portion of the piezoelectric material of the acoustic receiver element comprises a second thickness different from the first thickness; and wherein the isolation layer is structured to create a gap that physically separates the first portion of the second electrode layer from the second portion of the second electrode layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:實例陣列</p>
        <p type="p">502:接收器元件</p>
        <p type="p">504:傳輸器元件；接收元件</p>
        <p type="p">512:基底層</p>
        <p type="p">514:第一電極層</p>
        <p type="p">516:平坦化層</p>
        <p type="p">518:第二電極層</p>
        <p type="p">520:隔離層</p>
        <p type="p">522:電分隔</p>
        <p type="p">523:實體凹口</p>
        <p type="p">524:壓電材料</p>
        <p type="p">526:第三電極層</p>
        <p type="p">
        &lt;i&gt;a&lt;/i&gt;:厚度</p>
        <p type="p">
        &lt;i&gt;b&lt;/i&gt;:厚度；高度；高度值</p>
        <p type="p">
        &lt;i&gt;a&lt;/i&gt;+&lt;i&gt;x&lt;/i&gt;:厚度；距離</p>
        <p type="p">A-B:線</p>
        <p type="p">
        &lt;i&gt;x&lt;/i&gt;:距離；高度差異差值；差值</p>
        <p type="p">
        &lt;i&gt;x'&lt;/i&gt;:距離</p>
        <p type="p">
        &lt;i&gt;x&lt;/i&gt;+&lt;i&gt;b&lt;/i&gt;:厚度；高度；高度值</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1462" publication-number="202616435">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616435</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131582</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>引導裝置以及包括其的被處理物處理裝置</chinese-title>
        <english-title>GUIDING APPARATUS AND OBJECT TREATING APPARATUS INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250912B">H01L21/67</main-classification>
        <further-classification edition="200601120250912B">H01L21/306</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商斯天克有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEMCO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁仁洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, IN SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁晙植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JUN SIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭進鶴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, JIN HAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴鍾爀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JONG HYEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種引導裝置以及包括其的被處理物處理裝置，該引導裝置藉由引導被處理物來防止阻隔膜與被處理物接觸。被處理物處理裝置包括：腔室外殼，包括在內部空間中分別處理被處理物的第一區域及第二區域；輸送部，用於將被處理物從第一區域移動到第二區域；阻隔膜，配置在第一區域及第二區域之間，且在被處理物上與被處理物隔開；以及引導裝置，與阻隔膜相鄰配置，並向下引導被處理物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:濕式蝕刻腔室</p>
        <p type="p">210:腔室外殼</p>
        <p type="p">220:輸送部</p>
        <p type="p">230:阻隔膜</p>
        <p type="p">240:第一噴射部</p>
        <p type="p">250:第二噴射部</p>
        <p type="p">251:噴嘴，第一噴嘴</p>
        <p type="p">252:噴嘴，第二噴嘴</p>
        <p type="p">253:噴嘴，第三噴嘴</p>
        <p type="p">260:通風部</p>
        <p type="p">300:引導裝置</p>
        <p type="p">B:基板</p>
        <p type="p">D1:第一方向，長度方向</p>
        <p type="p">D2:第二方向，水平方向</p>
        <p type="p">D3:第三方向，垂直方向，上下方向</p>
        <p type="p">R1:第一區域</p>
        <p type="p">R2:第二區域</p>
        <p type="p">S1:第一部分</p>
        <p type="p">S2:第二部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1463" publication-number="202615721">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615721</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131587</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>藥液、被處理物之處理方法、半導體器件之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C23F1/24</main-classification>
        <further-classification edition="200601120260102B">C11D7/08</further-classification>
        <further-classification edition="200601120260102B">H01L21/3213</further-classification>
        <further-classification edition="200601120260102B">C09K13/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋和敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, KAZUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種藥液、藥液所涉及的被處理物之處理方法、及半導體器件之製造方法，所述藥液能夠從具有Ge濃度不同之兩種含SiGe物的被處理物中，相較於Ge濃度較低的含SiGe物選擇性地去除Ge濃度較高的含SiGe物。本發明之藥液係用於具有鍺濃度不同之兩種含矽-鍺物的被處理物的藥液，所述藥液包含水、氯化氫、及過氧化氫，並且過氧化氫的含量與氯化氫的含量之質量比為0.20以上，水的含量與氯化氫的含量之質量比為130～560。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:被處理物</p>
        <p type="p">202:基板</p>
        <p type="p">204:第一含SiGe物</p>
        <p type="p">206:第二含SiGe物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1464" publication-number="202616140">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616140</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131610</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於增強晶圓製造之系統及方法</chinese-title>
        <english-title>SYSTEMS AND METHODS FOR ENHANCED WAFER MANUFACTURING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G06N3/02</main-classification>
        <further-classification edition="201201120260102B">B24B37/013</further-classification>
        <further-classification edition="201201120260102B">B24B37/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>環球晶圓股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBALWAFERS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TSUNG CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴哈格維特　桑米特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHAGAVAT, SUMEET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪榮宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電腦裝置。該電腦裝置包含與至少一個記憶體裝置通信之至少一個處理器。該至少一個處理器經程式化以在該至少一個記憶體裝置中儲存用於預測一晶圓之研磨後厚度之一模型；接收一晶圓之一第一檢測之掃描資料；使用該掃描資料作為輸入來執行該模型，以判定該晶圓之一最終厚度；將該最終厚度與一或多個臨限值進行比較；判定該最終厚度是否超過該一或多個臨限值之至少一者；及當判定該最終厚度超過該一或多個臨限值之至少一者時，引起調整一研磨站。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A computer device is provided. The computer device includes at least one processor in communication with at least one memory device. The at least one processor is programmed to store, in the at least one memory device, a model for predicting post-grinding thickness of a wafer; receive scan data of a first inspection of a wafer; execute the model using the scan data as inputs to determine a final thickness of the wafer; compare the final thickness to one or more thresholds; determine if the final thickness exceeds at least one of the one or more thresholds; and cause a grinding station to be adjusted when it is determined that the final thickness exceeds at least one of the one or more thresholds.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:預測模型</p>
        <p type="p">605:多模態輸入</p>
        <p type="p">610:深度神經網路</p>
        <p type="p">615:雙面研磨(DGRD)後預測輸出</p>
        <p type="p">620:多維程序序列資料/序列訊框資料/數值資料</p>
        <p type="p">625:多維晶圓形狀或厚度輪廓</p>
        <p type="p">630:一維數值資料/數值輸入</p>
        <p type="p">635:一維標稱資料/標稱輸入</p>
        <p type="p">640:長短期記憶體(LSTM)及/或變換器區塊之組合</p>
        <p type="p">645:卷積及/或變換器區塊之組合</p>
        <p type="p">650:多層感知器(MLP)區塊</p>
        <p type="p">655:嵌入區塊</p>
        <p type="p">660:全連接層</p>
        <p type="p">665:輸出變量</p>
        <p type="p">670:上取樣區塊</p>
        <p type="p">675:晶圓輪廓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1465" publication-number="202616065">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616065</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131621</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>快取感知動態模組選擇</chinese-title>
        <english-title>CACHE-AWARE DYNAMIC MODULE SELECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">G06F3/06</main-classification>
        <further-classification edition="200601120251201B">G06F12/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　巴倫　馬里努斯　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN BAALEN, MARINUS WILLEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝利　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELLI, DAVIDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯克利亞爾　安德烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SKLIAR, ANDRII</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅吉爾　本斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAJOR, BENCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納格爾　馬庫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGEL, MARKUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃特沙米　貝諾迪　巴巴克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EHTESHAMI BEJNORDI, BABAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威特莫　保羅　尼古拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WHATMOUGH, PAUL NICHOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費德里奇　馬可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FEDERICI, MARCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈拉利拉德　阿米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JALALIRAD, AMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露之某些態樣提供用於運算模型的快取感知動態模組選擇的技術及設備。一種實例方法大致上包括：在第一推論回合中使用從另一記憶體載入至快取記憶體中的運算模型中的第一模組子集來產生至少一個輸出；使用使已在該快取中的該運算模型的該第一模組子集的評估偏差之函數來評估該運算模型之要用於第二推論回合的模組；及基於該評估而使用該運算模組的第二模組子集來執行該第二推論回合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Certain aspects of the present disclosure provide techniques and apparatus for cache aware dynamic module selection for a computation model. An example method generally includes generating at least one output, in a first inference round, using a first subset of modules of a computational model loaded in a cache memory from another memory, evaluating modules of the computational model to use for a second inference round, using a function that biases evaluation of the first subset of modules of the computational model already in the cache, and performing the second inference round with a second subset of modules of the computational module, based on the evaluation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:方法</p>
        <p type="p">705,710,715:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1466" publication-number="202615447">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615447</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131668</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>超原子價鉍化合物、阻劑組成物及圖案形成方法</chinese-title>
        <english-title>HYPERVALENT BISMUTH COMPOUND, RESIST COMPOSITION AND PATTERN FORMING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07F9/94</main-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大山皓介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHYAMA, KOUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大橋正樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHASHI, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊地駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>草間理志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSAMA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供在使用高能射線之光微影，尤其電子束(EB)微影及EUV微影中，感度及解析度優良的非化學增幅阻劑組成物、及使用該阻劑組成物之圖案形成方法。該課題之解決手段為一種超原子價鉍化合物，係以式(1)表示。  &lt;br/&gt;&lt;img align="absmiddle" height="116px" width="244px" file="ed10016.JPG" alt="ed10016.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A resist composition comprising a hypervalent bismuth compound having formula (1) and a solvent is provided. When processed by photolithography using high‑energy radiation, the resist composition exhibits a high sensitivity and resolution. &lt;br/&gt;&lt;img align="absmiddle" height="109px" width="241px" file="ed10017.JPG" alt="ed10017.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1467" publication-number="202616407">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616407</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131675</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分析裝置、基板處理系統、分析方法及電腦可讀取之程式</chinese-title>
        <english-title>ANALYSIS APPARATUS, SUBSTRATE PROCESSING SYSTEM, ANALYSIS METHOD, AND COMPUTER-READABLE PROGRAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/66</main-classification>
        <further-classification edition="200601120260102B">H01L21/67</further-classification>
        <further-classification edition="201301120260102B">G06F3/048</further-classification>
        <further-classification edition="200601120260102B">G06F17/10</further-classification>
        <further-classification edition="201801120260102B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中野佑太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANO, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之分析裝置(8)係分析對基板之處理結果並顯示不良狀況原因之裝置。分析裝置(8)包含：資訊受理部(804)、記憶部(801)、不良狀況運算部(802)、及顯示器(86)。資訊受理部(804)受理輸入資訊。輸入資訊包含表示由基板處理裝置對基板進行處理之結果之處理結果資訊。記憶部(801)記憶不良狀況資訊。不良狀況資訊示出表示基板上之不良狀況之種類之不良狀況種類、與該不良狀況之原因即不良狀況原因之關係。不良狀況運算部(802)基於輸入資訊及不良狀況資訊，辨別與處理結果資訊對應之不良狀況種類及不良狀況原因。顯示器(86)顯示由不良狀況運算部(802)辨別出之不良狀況原因作為不良狀況原因候選。藉此，可使不良狀況原因之辨別容易化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The analysis apparatus (8) is an apparatus that analyzes the results of processing on a substrate and displays the causes of defects. The analysis apparatus (8) includes an information receiving part (804), a memory part (801), a defect calculation part (802), and a display (86). The information receiving part (804) receives input information. The input information includes processing result information that indicates the results of the processing of the substrate by the substrate processing apparatus. The memory part (801) stores defect information. The defect information indicates a relationship between a defect type indicating a type of defect on the substrate and a defect cause, which is a cause of the defect. The defect calculation part (802) identifies the defect type and defect cause corresponding to the processing result information based on the input information and the defect information. The display (86) shows the defect causes identified by the defect calculation part (802) as defect cause candidates. This facilitates the identification of the defect causes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">8:分析裝置</p>
        <p type="p">86:顯示器</p>
        <p type="p">87b:滑鼠</p>
        <p type="p">801:記憶部</p>
        <p type="p">802:不良狀況運算部</p>
        <p type="p">803:資訊加工部</p>
        <p type="p">804:資訊受理部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1468" publication-number="202616202">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616202</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131676</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>探索支援裝置、探索支援方法及電腦可讀取程式</chinese-title>
        <english-title>SEARCH SUPPORT APPARATUS, SEARCH SUPPORT METHOD, AND COMPUTER-READABLE PROGRAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260102B">G06Q50/04</main-classification>
        <further-classification edition="200601120260102B">G06F17/10</further-classification>
        <further-classification edition="201801120260102B">G06F9/44</further-classification>
        <further-classification edition="201301120260102B">G06F3/048</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中野佑太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANO, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之探索支援裝置之記憶部記憶處理結果資訊。處理結果資訊係將表示在複數個處理條件各者下對基板進行單位處理時間之液處理後之結果的複數個處理結果(522)、與該複數個處理條件分別建立關聯之資訊。處理結果運算部對選擇處理結果組所含之各選擇處理結果(522a)乘以處理時間比例且予以合計而求得複合處理結果(527)。處理時間比例係將對各選擇處理結果(522a)任意設定之處理時間以單位處理時間相除而得之值。顯示器(86)顯示各選擇處理結果(522a)、及與各選擇處理結果(522a)對應之處理時間。又，顯示器(86)將複合處理結果(527)與基準處理結果(51)以可比較之方式顯示。藉此，可將處理條件之探索容易化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The memory part stores processing result information. The processing result information is information that associates a plurality of processing results (522), each of which indicates the results of liquid processing of a substrate for a unit processing time under each of a plurality of processing conditions, with the plurality of processing conditions. The processing result calculation part obtains the combined processing result (527) by multiplying each selected processing result (522a) included in the selected processing result group by the processing time ratio and then summing them. The processing time ratio is a value obtained by dividing the processing time arbitrarily set for each selected processing result (522a) by the unit processing time. The display (86) shows each selected processing result (522a) and the processing time corresponding to each selected processing result (522a). The display (86) also displays the combined processing result (527) and the reference processing result (51) in a comparable manner. This facilitates the search for processing conditions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">51:基準處理結果</p>
        <p type="p">86:顯示器</p>
        <p type="p">522a:選擇處理結果(處理結果)</p>
        <p type="p">527:複合處理結果</p>
        <p type="p">862:第2視窗</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1469" publication-number="202615492">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615492</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131685</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶圓加工用帶及晶圓加工方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F2/50</main-classification>
        <further-classification edition="200601120260102B">C08F283/01</further-classification>
        <further-classification edition="200601120260102B">C08L77/06</further-classification>
        <further-classification edition="201801120260102B">C09J7/35</further-classification>
        <further-classification edition="201801120260102B">C09J7/29</further-classification>
        <further-classification edition="200601120260102B">C09J5/06</further-classification>
        <further-classification edition="200601120260102B">H01L21/683</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商電化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENKA COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楯洋亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TATE, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金田一修平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINDAICHI, SHUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>升田優亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASUDA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種晶圓加工用帶、及藉由使用該帶而能夠將複數個半導體加工步驟整合之晶圓加工方法，該晶圓加工用帶係於進行加熱之步驟中不易於黏著層中產生空隙，又，於剝離步驟中對黏著層照射紫外線時能夠使黏著力充分降低，從而能夠於半導體加工中貫穿使用。  &lt;br/&gt;本發明之晶圓加工用帶具有基材層、及配置於該基材層之至少一面側之黏著層，該黏著層包含分子量為350以上之光聚合起始劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:晶圓加工用帶</p>
        <p type="p">11:基材層</p>
        <p type="p">11a:正面</p>
        <p type="p">11b:背面</p>
        <p type="p">12:黏著層</p>
        <p type="p">12a:正面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1470" publication-number="202615614">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615614</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131686</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶圓加工用帶及晶圓加工方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260102B">C09J7/25</main-classification>
        <further-classification edition="201801120260102B">C09J7/35</further-classification>
        <further-classification edition="200601120260102B">C09J11/06</further-classification>
        <further-classification edition="200601120260102B">C09J133/00</further-classification>
        <further-classification edition="200601120260102B">H01L21/02</further-classification>
        <further-classification edition="200601120260102B">H01L21/683</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商電化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENKA COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楯洋亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TATE, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金田一修平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINDAICHI, SHUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>升田優亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASUDA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種晶圓加工用帶、及藉由使用該帶而能夠將複數個半導體加工步驟整合之晶圓加工方法，該晶圓加工用帶於經過進行加熱之步驟後對黏著層照射紫外線之情形時能夠使黏著力充分降低，從而能夠於半導體加工中貫穿使用。  &lt;br/&gt;本發明之晶圓加工用帶具有基材層、及配置於該基材層之至少一面側之黏著層，該黏著層之5%重量減少溫度為270℃以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:晶圓加工用帶</p>
        <p type="p">11:基材層</p>
        <p type="p">11a:正面</p>
        <p type="p">11b:背面</p>
        <p type="p">12:黏著層</p>
        <p type="p">12a:正面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1471" publication-number="202616436">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616436</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131688</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體製造裝置及溫度調整方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/67</main-classification>
        <further-classification edition="200601120260102B">C23C16/52</further-classification>
        <further-classification edition="200601120260102B">C23C16/50</further-classification>
        <further-classification edition="200601120260102B">H05H1/28</further-classification>
        <further-classification edition="200601120260102B">F28D21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茂山和基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOYAMA, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山平聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAHIRA, SHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木琢也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之半導體製造裝置包含：構件，其形成有熱傳遞介質之流路；循環路徑，其與流路連通而使熱傳遞介質循環；及熱聲系統，其與於循環路徑中流通之熱傳遞介質之間進行熱交換。熱聲系統具備：環形管，其傳遞聲音；第1堆棧，其設置於環形管，於經第1高溫熱交換器進行了熱交換之一端與經第1低溫熱交換器進行了熱交換之另一端之間形成溫度梯度而將聲波輸出至環形管；及第2堆棧，其設置於環形管之與第1堆棧分離之位置，經由環形管而被輸入第1堆棧之聲波，藉此於經第2高溫熱交換器進行了熱交換之一端與循環路徑所接觸之另一端之間形成溫度梯度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電漿處理裝置</p>
        <p type="p">3:上底板</p>
        <p type="p">4:下底板</p>
        <p type="p">10:電漿處理腔室</p>
        <p type="p">10e:氣體排出口</p>
        <p type="p">10s:電漿處理空間</p>
        <p type="p">11:基板支持部</p>
        <p type="p">13:簇射頭</p>
        <p type="p">13b:氣體擴散室</p>
        <p type="p">13c:氣體導入口</p>
        <p type="p">50:調溫模組</p>
        <p type="p">51A:熱聲系統</p>
        <p type="p">52:環形管</p>
        <p type="p">53:第1堆棧</p>
        <p type="p">54:第2堆棧</p>
        <p type="p">55:第1高溫熱交換器</p>
        <p type="p">56:第1低溫熱交換器</p>
        <p type="p">57:第2高溫熱交換器</p>
        <p type="p">58:第2低溫熱交換器</p>
        <p type="p">60:底座</p>
        <p type="p">61:循環路徑</p>
        <p type="p">62:泵</p>
        <p type="p">63:熱交換部</p>
        <p type="p">64:邊界壁</p>
        <p type="p">65:熱交換用加熱器</p>
        <p type="p">66:第1調溫流體路徑</p>
        <p type="p">67:第2調溫流體路徑</p>
        <p type="p">111:本體部</p>
        <p type="p">112:環組件</p>
        <p type="p">521:上方區域</p>
        <p type="p">522:下方區域</p>
        <p type="p">532:一端</p>
        <p type="p">533:另一端</p>
        <p type="p">542:一端</p>
        <p type="p">543:另一端</p>
        <p type="p">641:支持體</p>
        <p type="p">1110:基台</p>
        <p type="p">1110a:流路</p>
        <p type="p">1111:靜電吸盤</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1472" publication-number="202614932">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614932</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131694</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鹹味增強劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260102B">A23L27/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商摩如斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORUS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>纐纈將太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKETSU, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>栃尾巧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOCHIO, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係提供飲食品之鹹味增強劑或鹹味增強方法。可解決本發明課題的鹹味增強劑其特徵為將蠶粉當作有效成分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1473" publication-number="202616382">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616382</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131702</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含碳材料之高深寬比蝕刻</chinese-title>
        <english-title>HIGH ASPECT RATIO ETCHING INTO CARBON-CONTAINING MATERIALS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">H01L21/3065</main-classification>
        <further-classification edition="200601120260105B">H01J37/32</further-classification>
        <further-classification edition="200601120260105B">H01L21/311</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李夢輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, MENGHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛格　亞彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, ARYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　夏萬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, XIAWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體處理的方法可包括將蝕刻劑前驅物、鈍化前驅物和閃光前驅物提供到半導體處理腔室的處理區域。基板可容納在該處理區域內。含碳材料的層可設置在基板上。該等方法可包括形成前驅物的電漿流出物。該等方法可包括在施加偏壓電壓時將基板與前驅物的電漿流出物接觸達第一時間段。接觸可將特徵蝕刻到含碳材料的層中。該等方法可包括在第一時間段之後，在不施加偏壓電壓的情況下將基板與前驅物的電漿流出物接觸達第二時間段。接觸可從特徵中去除蝕刻副產物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods of semiconductor processing may include providing an etchant precursor, a passivation precursor, and a flash precursor to a processing region of a semiconductor processing chamber. A substrate may be housed within the processing region. A layer of carbon-containing material may be disposed on the substrate. The methods may include forming plasma effluents of the precursors. The methods may include contacting the substrate with the plasma effluents of the precursors while applying a bias voltage for a first period of time. The contacting may etch a feature into the layer of carbon-containing material. The methods may include, subsequent to the first period of time, contacting the substrate with the plasma effluents of the precursors without applying the bias voltage for a second period of time. The contacting may remove etch byproduct from the feature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:方法</p>
        <p type="p">305:操作</p>
        <p type="p">310:操作</p>
        <p type="p">315:操作</p>
        <p type="p">320:操作</p>
        <p type="p">325:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1474" publication-number="202615402">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615402</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131731</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>3-棕櫚醯基-醯胺基-1,2-丙二醇與3-棕櫚醯基-醯胺基-2-羥基-1-二甲氧基三苯基甲基醚-丙烷的結晶固體及其製造與使用之方法</chinese-title>
        <english-title>CRYSTALLINE SOLIDS OF 3-PALMITOYL-AMIDO-1,2- PROPANEDIOL AND 3-PALMITOYL-AMIDO-2-HYDROXY-1- DIMETHOXYTRIPHENYLMETHYLETHER-PROPANE AND METHODS OF MAKING AND USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C233/16</main-classification>
        <further-classification edition="200601120260102B">C07C233/18</further-classification>
        <further-classification edition="200601120260102B">A61K31/164</further-classification>
        <further-classification edition="200601120260102B">C07C231/12</further-classification>
        <further-classification edition="200601120260102B">C07C231/24</further-classification>
        <further-classification edition="200601120260102B">B01D9/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商傑龍公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GERON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿爾巴尼澤　沃克　珍妮佛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALBANEZE-WALKER, JENNIFER ELIZABETH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露方面包括3-棕櫚醯基-醯胺基-1,2-丙二醇與3-棕櫚醯基-醯胺基-2-羥基-1-二甲氧基三苯基甲基醚-丙烷的結晶固體。亦提供製備3-棕櫚醯基-醯胺基-1,2-丙二醇的結晶固體與3-棕櫚醯基-醯胺基-2-羥基-1-二甲氧基三苯基甲基醚-丙烷的單晶之方法。亦描述由3-棕櫚醯基-醯胺基-1,2-丙二醇的結晶固體製備3-棕櫚醯基-醯胺基-2-羥基-1-二甲氧基三苯基甲基醚-丙烷之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Aspects of the disclosure include crystalline solids of 3-palmitoyl-amido-1,2- propanediol and 3-palmitoyl-amido-2-hydroxy-1-dimethoxytriphenylmethylether-propane. Methods for preparing the crystalline solids of 3-palmitoyl-amido-1,2- propanediol and single crystals of 3-palmitoyl-amido-2-hydroxy-1-dimethoxytriphenylmethylether-propane are also provided. Methods for preparing a 3-palmitoyl-amido-2-hydroxy-1-dimethoxytriphenylmethylether-propane from a crystalline solid of 3-palmitoyl-amido-1,2- propanediol are also described.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1475" publication-number="202615066">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615066</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131746</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於調節α－突觸核蛋白表現之化合物及方法</chinese-title>
        <english-title>COMPOUNDS AND METHODS FOR MODULATING ALPHA-SYNUCLEIN EXPRESSION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/7088</main-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＩＯＮＩＳ製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IONIS PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙　賢瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, HIEN THUY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高斯　漢斯　約阿希姆　約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAUS, HANS-JOACHIM JOSEF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查佩爾　阿爾弗雷德　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAPPELL, ALFRED E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法西歐　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAZIO, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬　Ｗ　布萊德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAN, W. BRAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米加瓦　麥可　Ｔ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIGAWA, MICHAEL T.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史瓦瑟　艾瑞克　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SWAYZE, ERIC E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於降低細胞或個體中SNCA RNA之量或活性，且在某些情況下降低細胞或個體中α-突觸核蛋白之量的寡聚劑、醫藥組合物及方法。此等寡聚劑、醫藥組合物及方法可用於改善突觸核蛋白病之至少一種症狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are oligomeric agents, pharmaceutical compositions, and methods for reducing the amount or activity of SNCA RNA in a cell or subject, and in certain instances reducing the amount of alpha-synuclein protein in a cell or subject. Such oligomeric agents, pharmaceutical compositions, and methods are useful to ameliorate at least one symptom of a synucleinopathy.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1476" publication-number="202615147">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615147</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131752</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>甲醇合成觸媒</chinese-title>
        <english-title>METHANOL SYNTHESIS CATALYST</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B01J23/80</main-classification>
        <further-classification edition="202401120260102B">B01J35/61</further-classification>
        <further-classification edition="202401120260102B">B01J35/70</further-classification>
        <further-classification edition="200601120260102B">C07C29/154</further-classification>
        <further-classification edition="200601120260102B">C07C31/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田嶋祐二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAJIMA, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水甫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, HAJIME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供對應於多樣且廣範圍的原料氣體組成之具有更優良的觸媒活性之甲醇合成觸媒。其解決手段為(1)一種甲醇合成觸媒，含有銅、鋅、鋁及矽作為構成元素，其中，觸媒中之銅/鋅的mol比為3.5~6.5，觸媒中之矽/鋅的mol比為3.0×10-2~12.5×10-2，觸媒中之鋁的含量相對於觸媒中之銅、鋅、鋁及矽的合計100mol%，為10.0mol%~17.5mol%甲醇合成觸媒；或(2)一種甲醇合成觸媒，含有銅、鋅、鋁及矽作為構成元素，其中，含有氧化鋅(ZnO)，且根據利用裏特沃爾德(Rietveld)分析予以最適化之晶格常數所計算出的觸媒中之氧化鋅(ZnO)的單位晶格體積為48.30Å3~49.00Å3。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The problem to be solved by the present invention is to provide a methanol synthesis catalyst having superior catalytic activity that can accommodate diverse and wide-ranging feed gas compositions. &lt;br/&gt;The means to solve the problem is: &lt;br/&gt;(1) A methanol synthesis catalyst containing copper, zinc, aluminum, and silicon as constituent elements, wherein the molar ratio of copper/zinc in the catalyst is 3.5 to 6.5, the molar ratio of silicon/zinc in the catalyst is 3.0×10⁻² to 12.5×10⁻², and the aluminum content in the catalyst is 10.0 mol% to 17.5 mol% relative to a total of 100 mol% of copper, zinc, aluminum, and silicon in the catalyst; or &lt;br/&gt;(2) A methanol synthesis catalyst containing copper, zinc, aluminum, and silicon as constituent elements, which includes zinc oxide (ZnO), wherein the unit cell volume of the zinc oxide (ZnO) in the catalyst, as calculated based on the lattice constant optimized by Rietveld analysis, is 48.30 Å³–49.00 Å³.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1477" publication-number="202615762">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615762</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131770</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>閂鎖機構及其應用之非等邊矩形光罩容器</chinese-title>
        <english-title>LATCH MECHANISM AND NON-EQUILATERAL RECTANGULAR RETICLE CONTAINER HAVING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251128B">E05C9/12</main-classification>
        <further-classification edition="201201120251128B">G03F1/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>家登精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUDENG PRECISION INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱銘乾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊家和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛新民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳品丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪亞旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪家倩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘皇維</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種閂鎖機構，適用於一非等邊矩形光罩容器的門中，包括：一主動件，設置於該門；複數個從動組件，分別與該主動件抵接，當該主動件旋轉時，該複數個從動組件被同步驅動而自該門凸出或縮回地往復移動，使該複數個從動組件中之至少一者可鎖定或解鎖該非等邊矩形光罩容器的門的側邊位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A latch mechanism according to the present invention is adapted to a door of a non-equilateral rectangular reticle container. The latch mechanism includes an active member disposed in the door, and a plurality of passive assemblies respectively coupled to the active member. When the active member rotates, the passive assemblies are driven simultaneously by the active member to reciprocatively move to extend from or retract to the door, such that at least one of the passive assemblies can lock or release at a side of the door of the non-equilateral rectangular reticle container.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:主動件</p>
        <p type="p">20A、20B:從動件</p>
        <p type="p">21A、21B、21C、21D:連接肋</p>
        <p type="p">23A、23B、23C、23D:閂鎖件</p>
        <p type="p">90:門</p>
        <p type="p">901A、901B:長邊</p>
        <p type="p">902A、902B:短邊</p>
        <p type="p">θ:角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1478" publication-number="202615580">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615580</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131771</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>助焊劑組合物、連接構造體及連接構造體之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08L63/00</main-classification>
        <further-classification edition="200601120260102B">C08K5/50</further-classification>
        <further-classification edition="200601120260102B">C08K5/521</further-classification>
        <further-classification edition="200601120260102B">B23K35/36</further-classification>
        <further-classification edition="200601120260102B">B23K35/362</further-classification>
        <further-classification edition="200601120260102B">H01R4/02</further-classification>
        <further-classification edition="200601120260102B">H01L21/60</further-classification>
        <further-classification edition="200601120260102B">H01L23/29</further-classification>
        <further-classification edition="200601120260102B">H01L23/31</further-classification>
        <further-classification edition="200601120260102B">H05K3/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商積水化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野元颯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMOTO, HAYATE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>保井秀文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YASUI, HIDEFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松下清人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUSHITA, KIYOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可於所獲得之連接構造體中抑制孔隙之產生且提高導通可靠性的助焊劑組合物。  &lt;br/&gt;本發明之助焊劑組合物係含有環氧化合物、及包含可游離之質子之有機酸或其中和物的助焊劑組合物，將上述助焊劑組合物於250℃下加熱90秒後之加熱物於250℃下之性狀為固體，將上述助焊劑組合物於氮氣氛圍下以60℃/分鐘之升溫速度自30℃加熱至360℃而進行示差掃描熱量測定時，發熱峰之溫度區域包含220℃，且發熱峰之總面積100%中，220℃以下之溫度區域中之發熱峰之面積未達95%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1479" publication-number="202615299">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615299</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131791</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於航空機的升力產生系統</chinese-title>
        <english-title>A LIFT GENERATING SYSTEM FOR AN AERIAL VEHICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">B64C29/00</main-classification>
        <further-classification edition="200601120260114B">F04D29/54</further-classification>
        <further-classification edition="200601120260114B">B64C23/00</further-classification>
        <further-classification edition="200601120260114B">B64D27/00</further-classification>
        <further-classification edition="200601120260114B">B64C3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商ＶＴＯＬ運輸有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VTOL TRANSPORT LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴克斯特　尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAXTER, NEIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種用於航空機(300，400)的升力產生系統(100，200)。該升力產生系統(300，400)包含用於產生一氣流的一氣流產生器(120，220)。該升力產生系統(100，200)也包含用於產生用於該航空機(300，400)之升力的一機翼(140，240)。該升力產生系統(100，200)進一步包含界定一導管入口(162，262)的一導管(160，260)，一導管出口(164，264)與從該導管入口(162，262)延伸到該導管出口(164，264)的一氣流路徑。該導管(160，260)配置來將該氣流從該氣流產生器(120，220)引導至該機翼(140，240)。該導管(160，260)包含一氣流管理區域(167，267)，其中該氣流路徑的厚度沿著一下游方向遞減且該氣流路徑的寬度沿著該下游方向遞增。該機翼(140，240)的至少一部分位在該氣流管理區域(167，267)內或其下游。也提供一種包含該升力產生系統(200)的航空機(300，400)，與用於組裝該升力產生系統(100，200)的一套部件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is provided a lift generating system (100, 200) for an aerial vehicle (300, 400). The lift generating system (300, 400) comprises an airflow generator (120, 220) for generating an airflow. The lift generating system (100, 200) also comprises an aerofoil (140, 240) for generating lift for the aerial vehicle (300, 400). The lift generating system (100, 200) further comprises a duct (160, 260) defining a duct inlet (162, 262), a duct outlet (164,264) and an airflow path extending from the duct inlet (162, 262) to the duct outlet (164, 264). The duct (160, 260) is arranged to direct the airflow from the airflow generator (120, 220) to the aerofoil (140, 240). The duct (160, 260) comprises an airflow management region (167, 267) in which a thickness of the airflow path decreases in a downstream direction and a width of the airflow path increases in the downstream direction. At least a portion of the aerofoil (140, 240) is positioned within, or downstream of, the airflow management region (167, 267). There is also provided an aerial vehicle (300, 400) comprising the lift generating system (200) and a kit of parts for assembly the lift generating system (100, 200).</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:升力產生系統</p>
        <p type="p">140:機翼</p>
        <p type="p">142:第一外部區段</p>
        <p type="p">144:第二外部區段</p>
        <p type="p">146:中間區段</p>
        <p type="p">148:水平穩定器</p>
        <p type="p">160:導管</p>
        <p type="p">162:導管入口</p>
        <p type="p">164:導管出口</p>
        <p type="p">165:導管壁</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1480" publication-number="202615162">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615162</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131805</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低碳足跡仿石塗料之主材</chinese-title>
        <english-title>BASE MATERIAL OF LOW CARBON FOOTPRINT STONE-LIKE COATING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251212B">B05D7/00</main-classification>
        <further-classification edition="200601120251212B">B44F9/04</further-classification>
        <further-classification edition="200601120251212B">C08K3/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華彩塗料實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUA TSAI PAINTS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郁文華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, WUN-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIAN-JHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郁肇倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, JHAO-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周容青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHOU, RONG-CING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種低碳足跡仿石塗料之主材，用以提供一低碳足跡仿石塗料之仿石紋路，該主材包含一無機骨材，該無機骨材為一含矽廢棄物經再處理後得到之矽化物。藉此，該低碳足跡仿石塗料之主材具有更加環保、更低碳足跡、更高硬度及更高耐磨性等特性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A base material of low carbon footprint stone-like coating is adaptable for providing a stone-like texture for the low-carbon footprint coating. This base material includes an inorganic aggregate, which is a silicate obtained from recycled silicon-containing waste. This base material of the low carbon footprint stone-like coating is more environmentally friendly, has a reduced carbon footprint, and offers higher hardness and improved wear resistance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(W):底材</p>
        <p type="p">(11):底漆層</p>
        <p type="p">(12):中塗層</p>
        <p type="p">(13):主材層</p>
        <p type="p">(131):色漿</p>
        <p type="p">(132):無機骨材</p>
        <p type="p">(133):樹脂</p>
        <p type="p">(14):面漆層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1481" publication-number="202615504">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615504</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131816</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光化射線性或感放射線性樹脂組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F212/08</main-classification>
        <further-classification edition="200601120260102B">C08F220/06</further-classification>
        <further-classification edition="200601120260102B">C08F220/10</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/36</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤卷錦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMAKI, NISHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王惠瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OU, KEIYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村貴之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹呉直紘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANGO, NAOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石地洋平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIJI, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後藤研由</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTO, AKIYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種能夠藉由乾式顯影形成微細圖案之感光化射線性或感放射線性樹脂組成物。本發明之感光化射線性或感放射線性樹脂組成物用於包括乾式顯影的圖案形成方法，其中，上述感光化射線性或感放射線性樹脂組成物包含：含有由式（1）表示的重複單元的樹脂；及溶媒。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">12:遮罩</p>
        <p type="p">420:光阻膜XD</p>
        <p type="p">422:光阻膜XD的正型圖案</p>
        <p type="p">430:基底層</p>
        <p type="p">432:基底層的正型圖案</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1482" publication-number="202615031">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615031</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131858</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>作為可溶性環氧化物水解酶抑制劑之吡啶酮甲醯胺衍生型化合物</chinese-title>
        <english-title>PYRIDONE CARBOXAMIDE DERIVED COMPOUNDS AS SOLUBLE EPOXIDE HYDROLASE INHIBITORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">A61K31/517</main-classification>
        <further-classification edition="200601120260105B">A61K31/44</further-classification>
        <further-classification edition="200601120260105B">A61K31/427</further-classification>
        <further-classification edition="200601120260105B">A61K31/421</further-classification>
        <further-classification edition="200601120260105B">A61K31/4192</further-classification>
        <further-classification edition="200601120260105B">A61K31/416</further-classification>
        <further-classification edition="200601120260105B">A61P27/00</further-classification>
        <further-classification edition="200601120260105B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安托萬　馬蒂亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANTOINE, MATHIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴特爾　貝喬恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARTELS, BJOERN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪　法比恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEY, FABIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亨尼克　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNZIKER, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯恩　克勞蒂　伊麗娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KORN, CLAUDIA IRINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉傑爾　埃洛伊絲　亞歷山德拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAGELLE, HELOISE ALEXANDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西米特　席巴斯提恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHMITT, SEBASTIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史丹布雷徹　托馬斯　伯恩德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEINBRECHER, THOMAS BERND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>爾納　羅倫茲　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>URNER, LORENZ MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供具有通式 (I) 的新穎雜環化合物，  &lt;br/&gt;&lt;img align="absmiddle" height="166px" width="338px" file="ed10337.JPG" alt="ed10337.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;其中&lt;sup/&gt;R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、A、X、R&lt;sup&gt;A1&lt;/sup&gt;、R&lt;sup&gt;A2 &lt;/sup&gt;及 R&lt;sup&gt;A3&lt;/sup&gt; 係如本文所描述；包含該等化合物之組成物；製造該等化合物之方法；及使用該等化合物之方法。  &lt;br/&gt;***</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides new heterocyclic compounds having the general formula (I) &lt;br/&gt;&lt;img align="absmiddle" height="184px" width="353px" file="ed10338.JPG" alt="ed10338.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;wherein R&lt;sup&gt;1&lt;/sup&gt;,&lt;sup/&gt;R&lt;sup&gt;2&lt;/sup&gt;,&lt;sup/&gt;A, X, R&lt;sup&gt;A1&lt;/sup&gt;, R&lt;sup&gt;A2&lt;/sup&gt;, and R&lt;sup&gt;A3&lt;/sup&gt; are as described herein, compositions including the compounds, processes of manufacturing the compounds and methods of using the compounds. &lt;br/&gt;***</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1483" publication-number="202616907">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616907</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131861</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光檢測裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260102B">H10F39/18</main-classification>
        <further-classification edition="200601120260102B">H01L23/538</further-classification>
        <further-classification edition="202301120260102B">H04N25/709</further-classification>
        <further-classification edition="202301120260102B">H04N25/78</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼半導體解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寄門雄飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YORIKADO, YUHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牛久結貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USHIKU, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於可實現以低電阻供給規定之電壓之供給路徑。  &lt;br/&gt;本發明之光檢測裝置包含：半導體基板，其具有將入射光進行光電轉換之光電轉換區域；遮光膜，其形成於半導體基板之光入射面側；及電極墊，其形成於半導體基板之光入射面側的相反側；且該光檢測裝置具有：具有像素之像素陣列部、及具有電極墊之墊區域；墊區域包含在貫通半導體基板之溝渠中埋有金屬材料之保護環；保護環將被供給至電極墊之規定之電壓擷取至半導體基板之光入射面側；構成為將由保護環擷取至半導體基板之光入射面側之規定之電壓經由遮光膜供給至像素陣列部之像素。本揭示之技術例如可應用於檢測與被攝體相隔之距離之電子機器等。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">40,40B:像素</p>
        <p type="p">71:像素陣列區域</p>
        <p type="p">72:墊區域</p>
        <p type="p">81:像素陣列部</p>
        <p type="p">82:像素陣列周邊部</p>
        <p type="p">91:電極墊</p>
        <p type="p">92:墊部</p>
        <p type="p">101:第1基板</p>
        <p type="p">102:第2基板</p>
        <p type="p">121:半導體基板(第1半導體基板)</p>
        <p type="p">122:配線層</p>
        <p type="p">141:像素間分離部</p>
        <p type="p">143:絕緣膜</p>
        <p type="p">144:金屬材料</p>
        <p type="p">147:平坦化膜</p>
        <p type="p">155:高濃度P型擴散層</p>
        <p type="p">161:配線層</p>
        <p type="p">182:接觸電極</p>
        <p type="p">251:開口部</p>
        <p type="p">271:保護環</p>
        <p type="p">272:OPB遮光膜</p>
        <p type="p">301:區域</p>
        <p type="p">311:陽極電壓區域</p>
        <p type="p">312:接地區域</p>
        <p type="p">313:保護環</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1484" publication-number="202615723">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615723</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131862</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電化學裝置，特別是燃料電池裝置</chinese-title>
        <english-title>ELECTROCHEMICAL APPARATUS, ESPECIALLY FUEL CELL APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260113B">C25B1/04</main-classification>
        <further-classification edition="201601120260113B">H01M8/0276</further-classification>
        <further-classification edition="200601120260113B">H01M4/88</further-classification>
        <further-classification edition="200601120260113B">B21D22/20</further-classification>
        <further-classification edition="200601120260113B">B23K35/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商羅伯特　博世有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROBERT BOSCH GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>席伯　菲利浦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIEBER, PHILIPP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種電化學裝置(10)，特別是燃料電池裝置(14)，以及一種用於製造此類電化學裝置(10)之製程，該電化學裝置(10)包含至少一個介質傳導單元(20)，其中該介質傳導單元(20)包含：支撐組件(22)，特別是板(26)，及至少一個經支撐組件(24)，特別是深拉件(28)，其中該至少一個經支撐組件(24)焊接至該支撐組件(22)。提出在該支撐組件(22)上形成至少一個樑(30)且在其上焊接該至少一個經支撐組件(24)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an electrochemical apparatus (10), especially fuel cell apparatus (14), and to a process for producing such an electrochemical apparatus (10) comprising at least one media conducting unit (20), wherein the media conducting unit (20) comprises a supporting component (22), especially a plate (26), and at least one supported component (24), especially a deep drawn part (28), wherein the at least one supported component (24) is welded to the supporting component (22). It is proposed to form on the supporting component (22) at least one beam (30) onto which the at least one supported component (24) is to be welded.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電化學裝置</p>
        <p type="p">12:電化學單元</p>
        <p type="p">14:燃料電池裝置</p>
        <p type="p">16:燃料電池單元</p>
        <p type="p">18:燃料電池堆疊</p>
        <p type="p">20:介質傳導單元</p>
        <p type="p">22:支撐組件</p>
        <p type="p">24:經支撐組件</p>
        <p type="p">26:板</p>
        <p type="p">28:深拉件</p>
        <p type="p">30:樑</p>
        <p type="p">32:肋狀物</p>
        <p type="p">34:溝槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1485" publication-number="202615136">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615136</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131874</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具備電氣式去離子水製造裝置之水處理系統及其運轉方法</chinese-title>
        <english-title>WATER TREATMENT SYSTEM COMPRISING ELECTRODEIONIZED WATER PRODUCTION DEVICE AND METHOD FOR OPERATING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B01D61/46</main-classification>
        <further-classification edition="200601120260102B">B01D61/56</further-classification>
        <further-classification edition="202301120260102B">C02F1/469</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商奧璐佳瑙股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORGANO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部眞弓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, MAYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>須藤史生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUDO, FUMIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木慶介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具備EDI裝置之水處理系統具備：循環配管36，其使來自EDI裝置10之處理水(去離子水)循環至EDI裝置10之前級；送水配管35，其將處理水向使用點送水；流量調整部34，其將處理水分配至循環配管36及送水配管35；循環配管44，其使來自EDI裝置10之濃縮水循環至EDI裝置10之前級；排出配管43，其將濃縮水排出至系統外；流量調整部42，其將濃縮水分配至循環配管44及排出配管43；及水質監視裝置51至54，其監視在水處理系統內之水質。依據在水質監視裝置51至54中之至少一者的監視結果，控制流量調整部34、42中之至少一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A water treatment system comprising an EDI device comprises a recirculation line 36 which recirculates treated water (deionized water) from an EDI device 10 to a stage prior to the EDI device 10, a water distribution line 35 which feeds the treated water to a point of use, a flow rate adjustment section 34 which allocates the supply of water between the recirculation line 36 and the water distribution line 35, a recirculation line 44 which recirculates the concentrated water from the EDI device 10 to a stage prior to the EDI device 10, a discharge line 43 which discharges the concentrated water outside the system, a flow rate adjustment section 42 which allocates the supply of concentrated water between the recirculation line 44 and the discharge line 43, and water quality monitoring devices 51 to 54 which monitor the water quality inside the water treatment system from the EDI device 10. At least one of the flow rate adjustment sections 34 and 42 is controlled based on the monitoring results of at least one of the water quality monitoring devices 51 to 54.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:EDI裝置(電氣式去離子水製造裝置)</p>
        <p type="p">15:供給水槽</p>
        <p type="p">20,23:配管</p>
        <p type="p">21:逆滲透膜裝置(RO)</p>
        <p type="p">22:逆滲透膜</p>
        <p type="p">24:透過水配管</p>
        <p type="p">31:供給水配管</p>
        <p type="p">32:泵</p>
        <p type="p">33:處理水配管</p>
        <p type="p">34,42:流量調整部</p>
        <p type="p">35:送水配管</p>
        <p type="p">36,44:循環配管</p>
        <p type="p">41:濃縮水配管</p>
        <p type="p">43:排出配管</p>
        <p type="p">50:控制部</p>
        <p type="p">51,52,53,54:水質監視裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1486" publication-number="202616033">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616033</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131924</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於低功率電壓調節器的電壓限制器</chinese-title>
        <english-title>VOLTAGE LIMITER FOR A LOW POWER VOLTAGE REGULATOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">G05F1/565</main-classification>
        <further-classification edition="200601120260108B">H02M3/156</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商艾姆微體電子　馬林公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EM MICROELECTRONIC-MARIN S.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奈拉德　吉瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NERAD, JIRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CZ</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種用於驅動數位或切換電路之電壓調節器的電壓限制器，其中該電壓限制器包含可連接至電壓調節器的電源輸出端的電源輸入端；該電壓限制器進一步包含連接至參考電壓輸入端和電源輸入端的差動對配置，輔助差動鏡，將該電源輸入端連接至地的輔助負載支路，其包含輔助負載電晶體裝置，以及其中該電壓限制器係組態以當在該電源輸入端處的該電壓大於在該參考輸入端處的該電壓時啟動該輔助負載電晶體裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a voltage limiter for a voltage regulator driving a digital or switching circuit, wherein the voltage limiter comprises a power input terminal connectable to the output of a voltage regulator; the voltage limiter further comprising a differential pair arrangement connected to a reference voltage input terminal and the power input terminal, an auxiliary differential mirror, an auxiliary load branch connecting the power input terminal to ground comprising an auxiliary load transistor device and wherein the voltage limiter is configured to activate the auxiliary load transistor device when the voltage at the power input terminal is larger than the voltage at the reference input terminal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:輔助差動鏡</p>
        <p type="p">2:轉換速率控制裝置</p>
        <p type="p">3:電流鏡複製器</p>
        <p type="p">4:自適應偏壓複製器</p>
        <p type="p">5:輔助回授鏡</p>
        <p type="p">6:輔助差動對</p>
        <p type="p">7:輔助負載支路</p>
        <p type="p">10:電壓限制器</p>
        <p type="p">300:步階電路</p>
        <p type="p">500:切換配置</p>
        <p type="p">BIAS1:偏壓端</p>
        <p type="p">BIAS2:偏壓端</p>
        <p type="p">C10:電容器</p>
        <p type="p">C20:步階電容器</p>
        <p type="p">GND:地端</p>
        <p type="p">N10:電晶體裝置</p>
        <p type="p">N11:電晶體裝置</p>
        <p type="p">N12:電晶體裝置</p>
        <p type="p">N13:電晶體裝置</p>
        <p type="p">N14:電晶體裝置</p>
        <p type="p">N15:電晶體裝置</p>
        <p type="p">N70:電晶體</p>
        <p type="p">N80:電晶體</p>
        <p type="p">P10:電晶體裝置</p>
        <p type="p">P11:電晶體裝置</p>
        <p type="p">P12:輔助負載裝置</p>
        <p type="p">P50:電晶體</p>
        <p type="p">P60:電晶體</p>
        <p type="p">REF:參考端</p>
        <p type="p">STEP:控制輸入</p>
        <p type="p">VREGIN:電源輸入端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1487" publication-number="202615403">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615403</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131939</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有液晶元骨架之化合物、硬化性組成物、密封材、印刷基板材料及電氣電子零件</chinese-title>
        <english-title>COMPOUND WITH LIQUID CRYSTAL FRAMEWORK, CURABLE COMPOSITION, SEALING MATERIAL PRINTED BOARD MATERIAL, AND ELECTRICAL AND ELECTRONIC COMPONENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C251/24</main-classification>
        <further-classification edition="200601120260102B">C08F12/34</further-classification>
        <further-classification edition="200601120260102B">C08L25/18</further-classification>
        <further-classification edition="200601120260102B">C09K3/10</further-classification>
        <further-classification edition="200601120260102B">H01L23/29</further-classification>
        <further-classification edition="200601120260102B">H01L23/31</further-classification>
        <further-classification edition="200601120260102B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商第一工業製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DKS CO. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村井真希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAI, MAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係獲得兼具散熱性與介電特性的硬化物。  &lt;br/&gt;本發明之解決課題之手段為下述通式(1)表示的化合物。式(1)中，R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;各自獨立地表示包含自由基聚合性基之碳數2至15的1價有機基，p、q及r各自獨立地表示0至4的整數。  &lt;br/&gt;&lt;img align="absmiddle" height="147px" width="544px" file="ed10026.JPG" alt="ed10026.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An objective of the present invention is to obtain a cured product with both heat dissipation and dielectric property. &lt;br/&gt;As a means for attaining the objective of the present invention is a compound represented by the following formula (1). In the formula, R¹ and R&lt;sup&gt;2&lt;/sup&gt; each independently represents a organic group containing radical polymerizable group having 2 to 15 carbon atoms. Each of p, q and r independently represents an integer from 0 to 4. &lt;br/&gt;&lt;img align="absmiddle" height="138px" width="541px" file="ed10027.JPG" alt="ed10027.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1488" publication-number="202615553">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615553</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131954</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組合物、聚醯亞胺樹脂膜之製造方法、顯示器之製造方法、及積層體之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08G77/455</main-classification>
        <further-classification edition="200601120260102B">C08L83/10</further-classification>
        <further-classification edition="200601120260102B">C08J5/18</further-classification>
        <further-classification edition="200601120260102B">B32B27/28</further-classification>
        <further-classification edition="200601120260102B">B32B37/24</further-classification>
        <further-classification edition="200601120260102B">G09F9/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商旭化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金田隆行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANADA, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>頼末友裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YORISUE, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大井鶫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOI, TSUGUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種於無機膜形成後之再加熱步驟中脫氣起始溫度充分高且能夠抑制黃度(YI)之增加之樹脂組合物、以及使用其之聚醯亞胺樹脂膜之製造方法、顯示器之製造方法、及積層體之製造方法。  &lt;br/&gt;本發明係一種樹脂組合物，其係含有(A)樹脂及溶劑者，並且  &lt;br/&gt;上述(A)樹脂含有下述通式(1)所表示之聚醯亞胺前驅物結構部位：  &lt;br/&gt;&lt;img align="absmiddle" height="101px" width="389px" file="ed10048.JPG" alt="ed10048.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;{式中，P&lt;sub&gt;1&lt;/sub&gt;表示2價之有機基，P&lt;sub&gt;2&lt;/sub&gt;表示4價之有機基，p表示正整數}  &lt;br/&gt;及/或通式(2)所表示之聚醯亞胺結構單元：  &lt;br/&gt;&lt;img align="absmiddle" height="140px" width="295px" file="ed10049.JPG" alt="ed10049.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;{式中，P&lt;sub&gt;3&lt;/sub&gt;表示2價之有機基，P&lt;sub&gt;4&lt;/sub&gt;表示4價之有機基，q表示正整數}，  &lt;br/&gt;上述樹脂組合物含有上述(A)樹脂及溶劑，並且  &lt;br/&gt;上述(A)樹脂進而含有下述通式(3)所表示之源自含矽之化合物之結構：  &lt;br/&gt;&lt;img align="absmiddle" height="100px" width="183px" file="ed10050.JPG" alt="ed10050.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;{式中，R&lt;sub&gt;1&lt;/sub&gt;及R&lt;sub&gt;2&lt;/sub&gt;分別獨立地表示碳數1～5之1價之脂肪族烴基或碳數6～10之1價之芳香族基，並且m表示1～200之整數}，  &lt;br/&gt;使除不含上述通式(3)所表示之含矽之結構之外與上述(A)樹脂相同之樹脂於氮氣環境下以430℃硬化30分鐘所得之硬化物之玻璃轉移溫度為450℃以上，  &lt;br/&gt;去除上述樹脂組合物中之溶劑所得之產物中之聚矽氧區域之最大直徑為150 nm以下，  &lt;br/&gt;上述產物係  &lt;br/&gt;將上述樹脂組合物塗佈於支持體後，使用預先加熱至80℃之加熱板，將上述支持體乾燥45分鐘所得之產物(I)；  &lt;br/&gt;將上述樹脂組合物塗佈於支持體後，使用加熱式真空乾燥機，於加熱至80℃，以3分鐘將內部壓力自大氣壓降低至100 Pa，繼而以27分鐘將內部壓力降低至50 Pa之條件下，對上述支持體進行乾燥所得之產物(II)；  &lt;br/&gt;中之至少一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2a:下部基板</p>
        <p type="p">2b:密封基板</p>
        <p type="p">25:有機EL結構部</p>
        <p type="p">250a:發出紅光之有機EL元件</p>
        <p type="p">250b:發出綠光之有機EL元件</p>
        <p type="p">250c:發出藍光之有機EL元件</p>
        <p type="p">251:間隔壁(障壁)</p>
        <p type="p">252:下部電極(陽極)</p>
        <p type="p">253:電洞傳輸層</p>
        <p type="p">254:發光層</p>
        <p type="p">255:上部電極(陰極)</p>
        <p type="p">256:TFT</p>
        <p type="p">257:接觸孔</p>
        <p type="p">258:層間絕緣膜</p>
        <p type="p">259:下部電極</p>
        <p type="p">261:中空部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1489" publication-number="202615213">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615213</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131968</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>邊緣區域塗層移除與翹曲補償</chinese-title>
        <english-title>EDGE ZONE COATING REMOVAL WITH WARPAGE COMPENSATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B24C3/12</main-classification>
        <further-classification edition="200601120260102B">B24C5/04</further-classification>
        <further-classification edition="200601120260102B">H01L21/67</further-classification>
        <further-classification edition="200601120260102B">H01L21/66</further-classification>
        <further-classification edition="200601120260102B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商易爾德工程系統股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIELD ENGINEERING SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫姆巴雷　潘卡吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMBHARE, PANKAJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科皮卡　桑迪普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOPPIKAR, SANDEEP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希布　安廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBU, ANTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬爾　希夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, SHIV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查奈亞　克里希納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANNAIAH, KRISHNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班松　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANZON, PAOLO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭　瓊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRINH,QUYNH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿米爾塔拉吉　迪帕克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMIRTHARAJ, DEEPAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於從基底的塗層表面移除塗層至少一部分的裝置可包括噴嘴組件和一個或多個噴嘴頭。每個噴嘴頭可包括至少一個噴嘴噴頭和配置為接收基底的塗層表面一部分的腔體。噴嘴噴頭可配置為當噴嘴組件沿著基底的長度移動時，在基底上引導蝕刻劑的傾斜流束。一或多個感測器可測量基底沿著基底的長度的翹曲，控制器可基於測量的翹曲而使噴嘴頭垂直於噴嘴頭移動方向移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus to remove at least a portion of a coating from a coated surface of a substrate may include a nozzle assembly and one or more nozzle-heads. Each nozzle-head may include at least one nozzle tip and a cavity configured to receive a portion of the coated surface of the substrate. The nozzle tip may be configured to direct an angled stream of an etchant on the substrate as the nozzle assembly moves along the length of the substrate. One or more sensors may measure a warpage of the substrate along the length of the substrate, and a controller may move the nozzle-head orthogonal to the direction of nozzle-head movement based on the measured warpage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基底</p>
        <p type="p">12,12A,12B:塗層</p>
        <p type="p">50,50A,50B:噴嘴頭</p>
        <p type="p">52:間隙</p>
        <p type="p">60A,60B:感測器</p>
        <p type="p">80:控制系統</p>
        <p type="p">R:位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1490" publication-number="202615498">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615498</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131989</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性組成物、光阻膜、圖案形成方法、電子器件之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F12/22</main-classification>
        <further-classification edition="200601120260102B">C08F230/04</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡宏哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKA, HIRONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後瀉敬介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USHIROGATA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀込弘記</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORIGOME, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>椿英明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUBAKI, HIDEAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種能夠形成LCDU較小之圖案的感光性組成物。本發明之感光性組成物含有與鎓鹽型光酸產生劑Z1共價鍵結而成的樹脂A1，或含有樹脂A2和鎓鹽型光酸產生劑Z2，其中，上述鎓鹽型光酸產生劑Z1及上述鎓鹽型光酸產生劑Z2中的陽離子係藉由酸的作用結構發生變化而生成碳-碳多重鍵的陽離子，且當將藉由酸的作用而結構發生變化前的上述陽離子設為陽離子X，並將藉由酸的作用而結構發生變化後的上述陽離子設為陽離子Y時，由上述陽離子Y和上述鎓鹽型光酸產生劑Z1或上述鎓鹽型光酸產生劑Z2中的陰離子構成的鎓鹽在被照射波長200～450nm中之任一波長的光時產生酸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1491" publication-number="202615067">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615067</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131995</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>治療非酒精性脂肪肝疾病的組合物與方法</chinese-title>
        <english-title>COMPOSITIONS AND METHODS FOR TREATING NONALCOHOLIC FATTY LIVER DISEASE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">A61K31/7088</main-classification>
        <further-classification edition="201001120260105B">C12N15/113</further-classification>
        <further-classification edition="200601120260105B">A61P1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商英西特羅公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INSITRO, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞埃德　大衛　強尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LLOYD, DAVID JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩塔帕蒂　桑托許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATAPATI, SANTHOSH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆克吉　蘇米特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUKHERJEE, SUMIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索米奈尼　哈里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOMINENI, HARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波米克　阿里吉特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHOWMICK, ARIJIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦林貝　塔納亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALIMBE, TANAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述用於抑制IRS1基因表現之組合物及方法。描述用於抑制IRS1基因表現之RNA干擾(RNAi)藥劑。本文中所揭示之IRS1 RNAi藥劑可靶向諸如肝細胞之細胞，例如藉由使用結合之靶向配體。亦描述包含一或多種IRS RNAi藥劑及視情況一或多種額外治療劑的醫藥組合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described are compositions and methods for inhibition of IRS1 gene expression. RNA interference (RNAi) agents for inhibiting the expression of IRS1 gene are described. The IRS1 RNAi agents disclosed herein may be targeted to cells, such as hepatocytes, for example, by using conjugated targeting ligands. Pharmaceutical compositions comprising one or more IRS RNAi agents optionally with one or more additional therapeutics are also described.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1492" publication-number="202616357">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616357</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132014</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>流體系統、包括流體系統之半導體處理系統、流量控制方法以及相關電腦程式產品</chinese-title>
        <english-title>FLUID SYSTEMS, SEMICONDUCTOR PROCESSING SYSTEMS INCLUDING FLUID SYSTEMS, FLOW CONTROL METHODS AND RELATED COMPUTER PROGRAM PRODUCTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">H01L21/02</main-classification>
        <further-classification edition="200601120260115B">G05D7/06</further-classification>
        <further-classification edition="200601120260115B">G05D11/08</further-classification>
        <further-classification edition="200601120260115B">C23C16/455</further-classification>
        <further-classification edition="200601120260115B">C23C16/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬哈德文　克里希那斯瓦米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAHADEVAN, KRISHNASWAMY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕蒂爾　基肖爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATIL, KISHOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述一種流體系統，其包括一導管、耦接至該導管之一濃度感測器，以及一處理器。該處理器安置成與該濃度感測器連通且回應於在一記憶體上記錄之指令而：接收一濃度控制選擇；進一步接收一訊號，該訊號指示在由該導管輸送之一流體中之一流體載體中夾帶的一流體成分之濃度；並且判定該流體成分之濃度。當該濃度與一預定濃度值相差超過一預定濃度差時，基於該濃度控制選擇而藉由調節以下中之一者來控制該流體成分的該濃度：(a)該流體之質量流率，(b)流體成分載體之壓力，以及(c)該流體之該質量流率及該流體成分載體之該壓力。本發明亦描述半導體處理系統、流量控制方法以及相關電腦程式產品。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fluid system includes a conduit, a concentration sensor coupled to the conduit, and a processor. The processor is disposed in communication with the concentration sensor and responsive to instructions recorded on a memory to receive a concentration control selection, further receive a signal indicative of concentration of a fluid constituent entrained in a fluid-carrier in a fluid conveyed by the conduit, and determine concentration of the fluid constituent. The concentration of the fluid constituent is controlled by throttling one of (a) mass flow rate of the fluid, (b) pressure of the fluid constituent-carrier, and (c) the mass flow rate of the fluid and the pressure of the fluid constituent-carrier based on the concentration control selection when the concentration differs from a predetermined concentration value by more than a predetermined concentration differential. Semiconductor processing systems, flow control methods, and related computer program products are also described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:流體</p>
        <p type="p">12:流體成分</p>
        <p type="p">14:流體成分載體</p>
        <p type="p">30:液體流體成分裝料</p>
        <p type="p">32:缺量空間</p>
        <p type="p">100:流體系統</p>
        <p type="p">108:濃度控制裝置/CCD</p>
        <p type="p">110:質量流量控制裝置/MFC裝置</p>
        <p type="p">112:液體容器</p>
        <p type="p">114:壓力控制裝置/PCD</p>
        <p type="p">116:載體源</p>
        <p type="p">118:載體源導管</p>
        <p type="p">120:載體供應導管</p>
        <p type="p">152:容器本體</p>
        <p type="p">154:載體入口導管</p>
        <p type="p">156:流體出口導管</p>
        <p type="p">158:流體供應導管</p>
        <p type="p">160:流體源導管</p>
        <p type="p">400:系統控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1493" publication-number="202616861">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616861</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132019</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通道層用氧化物半導體薄膜、薄膜半導體裝置及其製造方法、以及氧化物半導體薄膜形成用濺鍍靶材及氧化物半導體薄膜形成用濺鍍靶材之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260115B">H10D30/67</main-classification>
        <further-classification edition="202501120260115B">H10D62/80</further-classification>
        <further-classification edition="200601120260115B">C04B35/453</further-classification>
        <further-classification edition="200601120260115B">C23C14/34</further-classification>
        <further-classification edition="200601120260115B">H01L21/203</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商愛發科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ULVAC, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷野健太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANINO, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>半那拓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANNA, TAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>手塚尚人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEZUKA, NAOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">實現一種載子濃度低，且電洞遷移率高的氧化物半導體薄膜，並將其作為活性層的薄膜半導體元件，即便在高溫下閾值電壓仍不會負向偏移的氧化物半導體薄膜及使用其的半導體元件、可形成如此之氧化物半導體薄膜的濺鍍靶材及其製造方法。  &lt;br/&gt;一種通道層用氧化物半導體薄膜，由既定的氧化物所形成之氧化物半導體所構成，該既定的氧化物在將必要元素設為Ga、Zn及Ge，且將該必要元素的元素比設為Ga&lt;sub&gt;X&lt;/sub&gt;Zn&lt;sub&gt;Y&lt;/sub&gt;Ge&lt;sub&gt;Z&lt;/sub&gt;的情況，X、Y、Z在X軸、Y軸、Z軸的正三角形之三元相圖中，被包含在既定範圍；該既定範圍係在0＜X≦0.8、0.2≦Y≦0.8、0＜Z≦0.3中，且X＋Y＋Z＝1的範圍內，將座標設為(X,Y,Z)時，為去除掉以點(0.45,0.55,0)、點(0.2,0.8,0)、點(0,0.8,0.2)所構成的三角形的範圍，惟包含去除之三角形與剩餘之範圍的邊界線的範圍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1494" publication-number="202615005">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615005</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132026</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可注射的動物用組合物及其用途</chinese-title>
        <english-title>INJECTABLE VETERINARY COMPOSITION AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/42</main-classification>
        <further-classification edition="200601120260102B">A61K31/425</further-classification>
        <further-classification edition="200601120260102B">A61P33/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商英特威國際公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERVET INTERNATIONAL B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布朗　查德　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROWN, CHAD D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊斯蘭　穆罕默德　賽義夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISLAM, MOHAMMAD SAIFUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BD</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫爾查爾　克里斯多福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KULCZAR, CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加萊斯卡　伊莎貝拉　埃瓦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GALESKA, IZABELA EWA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種可注射的動物用醫藥組合物，其包含異噁唑啉化合物  &lt;br/&gt;&lt;img align="absmiddle" height="199px" width="391px" file="ed10017.JPG" alt="ed10017.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;及大環內酯之組合，其呈含在包含醫藥上可接受之凝膠形成劑、醫藥上可接受之溶劑及釋放改良劑之載劑中之溶液。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An injectable veterinary pharmaceutical composition comprising the combination of an isoxazoline compound &lt;br/&gt;&lt;img align="absmiddle" height="196px" width="368px" file="ed10018.JPG" alt="ed10018.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;and a macrocyclic lactone as a solution in a carrier comprising a pharmaceutically acceptable gel forming agent, a pharmaceutically acceptable solvent, and a release modifying agent.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1495" publication-number="202615809">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615809</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132030</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於旋轉爐火焰控制以熔融金屬的設備及方法</chinese-title>
        <english-title>APPARATUS AND METHOD FOR ROTARY FURNACE FLAME CONTROL TO MELT METAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">F27B7/20</main-classification>
        <further-classification edition="200601120260115B">F27B7/14</further-classification>
        <further-classification edition="200601120260115B">F23N1/00</further-classification>
        <further-classification edition="200601120260115B">F23N5/00</further-classification>
        <further-classification edition="200601120260115B">F27D21/00</further-classification>
        <further-classification edition="200601120260115B">G05D23/19</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商氣體產品及化學品股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIR PRODUCTS AND CHEMICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西歐　艾瑞克Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, ERIC R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杭德蕭特　烈德雅各</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HENDERSHOT, REED JACOB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬克瓦納　阿南德庫馬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKWANA, ANANDKUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩　瓦爾米羅科雷亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SA, VALMIRO CORREIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳展俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於熔融金屬之設備、系統、及程序可經組態以利用火焰控制方案來改良對廢棄金屬之加熱同時亦避免火焰衝擊液化金屬。實施例可利用一或多個感測器或偵測機構來偵測待熔融金屬之狀態且調整自旋轉爐或其他類型之爐子之一或多個燃燒器輸出之（多個）火焰（例如調整該火焰之長度、燃燒速率、及/或方向等）以因應該金屬之該偵測到的狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus, system, and process for melting a metal can be configured to utilize a scheme for flame control to improve heating of scrap metal while also avoid flame impingement on liquified metal. Embodiments can utilize one or more sensors or detection mechanism to detect a state of the metal to be melted and adjust the flame(s) (e.g. adjust the length, firing rate, and/or direction of the flame, etc.) output from one or more burners of a rotary furnace or other type of furnace to account for the detected state of the metal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:設備</p>
        <p type="p">2:基底</p>
        <p type="p">3:旋轉爐</p>
        <p type="p">3b:主體</p>
        <p type="p">3c:腔室</p>
        <p type="p">3d:門</p>
        <p type="p">3f:煙道</p>
        <p type="p">3h:器皿</p>
        <p type="p">4:排氣孔</p>
        <p type="p">5:致動器</p>
        <p type="p">5s:致動器感測器</p>
        <p type="p">10:電腦裝置</p>
        <p type="p">11a:處理器</p>
        <p type="p">11b:記憶體</p>
        <p type="p">11c:收發器</p>
        <p type="p">11d:應用</p>
        <p type="p">11e:資料儲存庫</p>
        <p type="p">21:控制系統</p>
        <p type="p">App:應用</p>
        <p type="p">B:燃燒器</p>
        <p type="p">CC:通訊連接</p>
        <p type="p">CTRL:控制器</p>
        <p type="p">D:資料儲存庫</p>
        <p type="p">F:火焰</p>
        <p type="p">MEM:非暫時性記憶體</p>
        <p type="p">MM:金屬材料</p>
        <p type="p">OD:操作者裝置</p>
        <p type="p">RD:旋轉方向</p>
        <p type="p">S:感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1496" publication-number="202616145">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616145</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132032</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>神經網路的權重縮放</chinese-title>
        <english-title>WEIGHT SCALING FOR NEURAL NETWORK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260112B">G06N3/063</main-classification>
        <further-classification edition="200601120260112B">G11C11/54</further-classification>
        <further-classification edition="200601120260112B">G11C16/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商超捷公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICON STORAGE TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　曉萬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRAN, HIEU VAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一個實例中，一種系統包含：非揮發性記憶體胞元陣列，配置成列及行；控制閘極偏壓產生器，用於產生偏壓電壓以施加至耦合至該陣列中之非揮發性記憶體胞元列之控制閘極線；以及，演算法控制器，用於基於要儲存於該陣列中之神經網路之層以組構該控制閘極偏壓產生器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In one example, a system comprises an array of non-volatile memory cells arranged in rows and columns; a control gate bias generator to generate a bias voltage to apply to a control gate line coupled to a row of non-volatile memory cells in the array; and an algorithm controller to configure the control gate bias generator based on the layer of a neural network to be stored in the array.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1101:VMM陣列</p>
        <p type="p">1106:輸入電路</p>
        <p type="p">1107:輸出電路</p>
        <p type="p">1114:演算法控制器</p>
        <p type="p">1200:VMM系統</p>
        <p type="p">1201:控制閘極偏壓產生器</p>
        <p type="p">1203:類比轉數位轉換器</p>
        <p type="p">1204:縮放區塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1497" publication-number="202616466">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616466</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132040</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體基板放置機器人</chinese-title>
        <english-title>SEMICONDUCTOR SUBSTRATE PLACEMENT ROBOT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">H01L21/683</main-classification>
        <further-classification edition="200601120260114B">H01L21/677</further-classification>
        <further-classification edition="200601120260114B">H01L21/02</further-classification>
        <further-classification edition="200601120260114B">B25J11/00</further-classification>
        <further-classification edition="200601120260114B">B25J9/12</further-classification>
        <further-classification edition="202501120260114B">H10F39/12</further-classification>
        <further-classification edition="202101120260114B">G03B13/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　家信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, KA SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西蒙斯　馬丁傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEAMONS, MARTIN JAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴拉蘇拔馬尼安　葛尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BALASUBRAMANIAN, GANESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露描述了一種半導體基板處理系統，該半導體基板處理系統使用由定位在基板上的照相機所捕捉的影像，將半導體基板放置在處理腔室中。用於移動半導體基板的控制器包括記憶體和處理器。該處理器從定位在半導體基板上的第一照相機接收第一影像，並從定位在半導體基板上的第二照相機接收第二影像。第一照相機與第二照相機不同。該處理器亦偵測該第一影像中的第一升舉銷孔和該第二影像中的第二升舉銷孔，並基於該第一影像中該第一升舉銷孔的位置和該第二影像中該第二升舉銷孔的位置，確定該半導體基板的偏移量，並基於該偏移量移動保持該半導體基板的機器人。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure describes a semiconductor substrate processing system that places a semiconductor substrate in a process chamber using images captured by cameras positioned on the substrate. A controller for moving a semiconductor substrate includes a memory and a processor. The processor receives a first image from a first camera positioned on the semiconductor substrate and a second image from a second camera positioned on the semiconductor substrate. The first camera is different from the second camera. The processor also detects a first lift pin hole in the first image and a second lift pin hole in the second image, determines, based on a position of the first lift pin hole in the first image and a position of the second lift pin hole in the second image, an offset for the semiconductor substrate, and moves a robot holding the semiconductor substrate based on the offset.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:操作</p>
        <p type="p">402A:影像</p>
        <p type="p">402B:影像</p>
        <p type="p">402C:影像</p>
        <p type="p">404A:升舉銷孔</p>
        <p type="p">404B:升舉銷孔</p>
        <p type="p">404C:升舉銷孔</p>
        <p type="p">406A:位置</p>
        <p type="p">406B:位置</p>
        <p type="p">406C:位置</p>
        <p type="p">408:偏移量</p>
        <p type="p">410:平移分量</p>
        <p type="p">412:旋轉分量</p>
        <p type="p">414:指令</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1498" publication-number="202615626">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615626</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132046</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>研磨粒的製造方法、化學機械研磨用組成物及研磨方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">C09K3/14</main-classification>
        <further-classification edition="200601120251201B">C09G1/02</further-classification>
        <further-classification edition="200601120251201B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福與翼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUYO, TSUBASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村康平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亀井康孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMEI, YASUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種可高速研磨多晶矽膜、且貯存後的研磨特性亦優異的化學機械研磨用組成物及使用其的研磨方法。另外，提供一種可用於該化學機械研磨用組成物的研磨粒的製造方法。本發明的研磨粒的製造方法包括如下步驟：對如下混合物，即，含有選自下述通式（1）所表示的官能基及下述通式（2）所表示的官能基中的至少一種官能基經由共價鍵而固定於表面的粒子及含有具有兩個以上的羥基（-OH）的有機基的羥基矽烷（C）的混合物進行加熱。  &lt;br/&gt;-SO&lt;sub&gt;3&lt;/sub&gt;&lt;sup&gt;-&lt;/sup&gt;M&lt;sup&gt;+&lt;/sup&gt;       …（1）  &lt;br/&gt;-COO&lt;sup&gt;-&lt;/sup&gt;M&lt;sup&gt;+&lt;/sup&gt;     …（2）  &lt;br/&gt;（式（1）及式（2）中，M&lt;sup&gt;+&lt;/sup&gt;表示一價陽離子）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1499" publication-number="202615665">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615665</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132047</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>腺相關病毒載體</chinese-title>
        <english-title>ADENO-ASSOCIATED VIRUS VECTORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C12N15/861</main-classification>
        <further-classification edition="200601120260105B">A61K48/00</further-classification>
        <further-classification edition="200601120260105B">A61P27/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高等教育聯邦系統　匹茲堡大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIVERSITY OF PITTSBURGH - OF THE COMMONWEALTH SYSTEM OF HIGHER EDUCATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托馬斯　伯恩　莉亞　卡羅琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THOMAS BYRNE, LEAH CAROLINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>約翰遜　莫莉　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOHNSON, MOLLY E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯塔弗　威廉　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STAUFFER, WILLIAM R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧茲特克　比爾吉　艾辛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OZTURK, BILGE ESIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示案係關於AAV載體（例如AAV2載體）。舉例而言，提供包含AAV衣殼多肽之AAV載體（例如AAV2載體），該AAV衣殼多肽包含SEQ ID NO: 5-34中之任一者（或其變異體）中所示之胺基酸序列或根據基於此一所示序列之式A之胺基酸序列；此類AAV衣殼多肽；編碼此類載體之核酸分子；編碼此類AAV衣殼多肽之核酸分子；含有及∕或表現此類核酸分子之宿主細胞；以及用於製備或使用此類載體及∕或AAV衣殼多肽之方法及材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure relates to AAV vectors (&lt;i&gt;e.g.&lt;/i&gt;, AAV2 vectors). For example, AAV vectors (&lt;i&gt;e.g.&lt;/i&gt;, AAV2 vectors) comprising an AAV capsid polypeptide that comprises an amino acid sequence set forth in any one of SEQ ID NOs: 5-34 (or a variant thereof) or according to Formula A based on such a set forth sequence, such AAV capsid polypeptides, nucleic acid molecules encoding such vectors, nucleic acid molecules encoding such AAV capsid polypeptides, host cells containing and/or expressing such nucleic acid molecules, and methods and materials for making or using such vectors and/or AAV capsid polypeptides are provided.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1500" publication-number="202616833">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616833</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132049</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>新穎切換電感器</chinese-title>
        <english-title>NOVEL SWITCHING INDUCTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260115B">H10D1/20</main-classification>
        <further-classification edition="200601120260115B">H01L23/522</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡科技研究局</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡司吉瓦拉　穆迪特蘇尼庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHASGIWALA, MUDIT SUNILKUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕特爾　梅格納馬赫許庫馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATEL, MEGHNA MAHESHKUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高許　庫納爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHOSH, KUNAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕堤爾　薩欽賈楊特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATIL, SACHIN JAYANT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　德源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, TECK GUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅塔魯　米哈伊德拉戈斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROTARU, MIHAI DRAGOS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔　敬仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUI, KING JIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉奧　維姆帕蒂斯里尼瓦薩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAO, VEMPATI SRINIVASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種嵌入式電感器可包含基板。該電感器可包含安置於基板的第一側上的第一層磁性膜。該電感器可包含安置於基板的第二側上的磁性膜。該電感器可包含介電層，該介電層安置於第一層和第二層磁性膜匯總的每一者上方。該電感器可包含形成於介電層上方的第一再分配層。該電感器可包含形成於介電層上方的第二再分配層。該電感器可包含二或更多個的基板穿孔（TSV），該等基板穿孔穿過介電層和基板，從第一再分配層延伸至第二再分配層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An embedded inductor may include a substrate. The inductor may include a first layer of magnetic film, disposed on a first side of the substrate. The inductor may include a second layer of magnetic film, disposed on a second side of the substrate. The inductor may include a dielectric layer disposed over each of the first and second layers of magnetic film may include. The inductor may include a first redistribution layer formed over the dielectric layer. The inductor may include a second redistribution layer a formed over the dielectric layer. The inductor may include two or more through-substrate vias (TSVs) extending through the dielectric layer and the substrate from the first redistribution layer to the second redistribution layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">322:第二金屬層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1501" publication-number="202616533">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616533</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132075</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於系統單晶片的封裝基板中的背對背堆疊矽基電容器</chinese-title>
        <english-title>BACK-TO-BACK STACKED SILICON-BASED CAPACITORS IN A PACKAGE SUBSTRATE FOR A SYSTEM-ON-CHIP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251230B">H01L25/16</main-classification>
        <further-classification edition="202501120251230B">H10D1/60</further-classification>
        <further-classification edition="200601120251230B">H01G4/30</further-classification>
        <further-classification edition="202501120251230B">H10D88/00</further-classification>
        <further-classification edition="200601120251230B">H01L23/52</further-classification>
        <further-classification edition="200601120251230B">H01L23/498</further-classification>
        <further-classification edition="202501120251230B">H10D89/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商微軟技術授權有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICROSOFT TECHNOLOGY LICENSING, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅德里格斯貝羅特蘭　馬丁亞歷杭德羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RODRIGUEZ BERROTERAN, MARTIN ALEJANDRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍德亞德　喬恩湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOODYARD, JON THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅　恆之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, HENGZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕特馬納坦　普里亞塔山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATHMANATHAN, PRIYATHARSHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明闡述用於一系統單晶片(SoC)之一封裝基板中之背對背堆疊矽基電容器及形成該等背對背堆疊矽基電容器之方法。一實例系統包含一封裝基板，該封裝基板包括包含鍍通孔之一芯層。該系統進一步包含安裝在該封裝基板之頂部上之至少一個晶粒，其中該至少一個晶粒包含至少一個電壓域。該系統進一步包含形成在該封裝基板之該芯層內之一組背對背堆疊矽基電容器。該組背對背堆疊矽基電容器可形成在該芯層內不包含該等鍍通孔之區中之槽中。該組背對背堆疊矽基電容器之一子組可耦合至該至少一個電壓域內之組件以管理與該至少一個電壓域相關聯之一阻抗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Back-to-back stacked silicon-based capacitors in a package substrate for a system-on-chip (SoC) and methods of forming the same are described. An example system includes a package substrate comprising a core layer including plated-through holes. The system further includes at least one die mounted on top of the package substrate, where the at least one die includes at least one voltage domain. The system further includes a set of back-to- back stacked silicon-based capacitors formed within the core layer of the package substrate. The set of back-to-back stacked silicon-based capacitors may be formed in slots within the core layer in regions excluding the plated- through holes. A subset of the set of back-to-back stacked silicon-based capacitors may be coupled to components within the at least one voltage domain to manage an impedance associated with the at least one voltage domain.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">110:封裝基板</p>
        <p type="p">112:重佈層</p>
        <p type="p">114:重佈層</p>
        <p type="p">120:芯層</p>
        <p type="p">122:鍍通孔</p>
        <p type="p">124:鍍通孔</p>
        <p type="p">152:背對背堆疊矽基電容器、矽基電容器</p>
        <p type="p">154:背對背堆疊矽基電容器、矽基電容器</p>
        <p type="p">156:接合層</p>
        <p type="p">162:晶粒側多層陶瓷晶片電容器</p>
        <p type="p">164:晶粒側多層陶瓷晶片電容器</p>
        <p type="p">166:晶粒側多層陶瓷晶片電容器</p>
        <p type="p">172:焊著側多層陶瓷晶片電容器</p>
        <p type="p">174:焊著側多層陶瓷晶片電容器</p>
        <p type="p">176:焊著側多層陶瓷晶片電容器</p>
        <p type="p">182:焊料球</p>
        <p type="p">184:焊料球</p>
        <p type="p">190:系統單晶片</p>
        <p type="p">192:銅柱</p>
        <p type="p">SoC:系統單晶片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1502" publication-number="202615475">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615475</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132086</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>艾帕素（ａｐｅｌｉｎ）受體結合多肽及方法</chinese-title>
        <english-title>APELIN RECEPTOR BINDING POLYPEPTIDES AND METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">C07K16/28</main-classification>
        <further-classification edition="200601120260113B">A61K39/395</further-classification>
        <further-classification edition="200601120260113B">A61P25/00</further-classification>
        <further-classification edition="200601120260113B">A61P35/00</further-classification>
        <further-classification edition="200601120260113B">A61P9/00</further-classification>
        <further-classification edition="200601120260113B">A61P3/00</further-classification>
        <further-classification edition="200601120260113B">A61P27/00</further-classification>
        <further-classification edition="200601120260113B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商泰克托尼克治療股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECTONIC OPERATING COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬雷克　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAREK, PETER JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　垚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪納　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIENER, JOHN L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克納馬拉　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCNAMARA, PETER JEREMIAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼赫蒂拉　瑞安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KNIHTILA, RYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達斯　海梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DARCE, JAIME RENE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯蒂斯　克里斯蒂安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORTIS, CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴羅斯阿爾瓦雷斯　西梅娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARROS ALVAREZ, XIMENA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供特異性結合至艾帕素受體(APJ)之抗體及多肽。亦提供包含此等抗體之組合物、編碼此等抗體之核酸、用於製備此等抗體之表現載體及宿主細胞以及使用此等抗體治療個體之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides antibodies and polypeptides that specifically bind to apelin receptor (APJ). Also provided are compositions comprising these antibodies, nucleic acids encoding these antibodies, expression vectors and host cells for making these antibodies, and methods of treating a subject using these antibodies.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1503" publication-number="202615647">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615647</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132088</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>啤酒風味飲料</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C12C12/00</main-classification>
        <further-classification edition="200601120260102B">C12C12/04</further-classification>
        <further-classification edition="200601120260102B">A23L2/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三得利控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNTORY HOLDINGS LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大舘巧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ODATE, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>四方純</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOMO, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丸橋太一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARUHASHI, TAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">針對啤酒風味飲料，要求適宜的收斂感及優良的酸味俐落感，並抑制了不適當的澀味之啤酒風味飲料。  &lt;br/&gt;　　一種啤酒風味飲料，其酒精度數係8.00(v/v)%以上，  &lt;br/&gt;　　符合下式(1)；  &lt;br/&gt;　　式(1)：X1/Y＞0.2  &lt;br/&gt;　　上述式(1)中，X1表示乙酸之含量(單位：質量ppm)，Y表示乳酸之含量(單位：質量ppm)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1504" publication-number="202615014">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615014</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132101</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>作為蛋白質酪氨酸磷酸酶抑制劑的含雙鍵取代的化合物及其應用</chinese-title>
        <english-title>DOUBLE-BOND SUBSTITUTED COMPOUND AS PROTEIN TYROSINE PHOSPHATASE INHIBITORS AND APPLICATION THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/44</main-classification>
        <further-classification edition="200601120260102B">A61K31/433</further-classification>
        <further-classification edition="200601120260102B">A61K31/4025</further-classification>
        <further-classification edition="200601120260102B">A61K31/397</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商武漢人福創新藥物研發中心有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WUHAN HUMANWELL INNOVATIVE DRUG RESEARCH AND DEVELOPMENT CENTER LIMITED COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張學軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XUE-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐招兵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, ZHAO-BING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肖奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫紅娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, HONG-NA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周圓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于紅琴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, HONG-QIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一類作為PTPN1和/或PTPN2抑制劑的含雙鍵取代的化合物及其應用，具體涉及式（Ⅰ）所示的化合物、其互變異構物、立體異構物或藥學上可接受的鹽及其製備方法，以及在製備用於治療PTPN1和/或PTPN2相關疾病的藥物中的用途。  &lt;br/&gt;&lt;img align="absmiddle" height="203px" width="364px" file="ed10348.JPG" alt="ed10348.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a class of double-bond substituted compounds acting as PTPN1 and/or PTPN2 inhibitors and applications thereof. Specifically, the present invention discloses compounds represented by Formula (I), their tautomers, stereoisomers, or pharmaceutically acceptable salts, as well as their preparation methods and use in the manufacture of medicaments for treating PTPN1 and/or PTPN2-related diseases. &lt;br/&gt;&lt;img align="absmiddle" height="180px" width="323px" file="ed10349.JPG" alt="ed10349.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1505" publication-number="202616109">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616109</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132103</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>特徵標籤篩選方法、裝置、系統、電子設備、媒體及產品</chinese-title>
        <english-title>FEATURE LABEL SCREENING METHOD, APPARATUS, SYSTEM, ELECTRONIC DEVICE, MEDIUM, AND PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251001B">G06F18/214</main-classification>
        <further-classification edition="202301120251001B">G06F18/211</further-classification>
        <further-classification edition="202301120251001B">G06F18/241</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中國銀聯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA UNIONPAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡君一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, JUNYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周雍愷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, YONGKAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高鵬飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, PENGFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請實施例提供一種特徵標籤篩選方法、裝置、系統、電子設備、媒體及產品。該方法包括：獲取多個原始訓練樣本；針對每一原始訓練樣本，在該原始訓練樣本被輸入注意力模型後，得到鍵矩陣和值矩陣，並根據鍵矩陣和值矩陣，確定該原始訓練樣本對應的注意力損失；根據各原始訓練樣本分別對應的注意力損失，確定第一總注意力損失；基於多個目標訓練樣本和注意力模型，確定第二總注意力損失；目標訓練樣本包括至少一個第一特徵標籤；根據第一總注意力損失和第二總注意力損失，確定是否刪除第二特徵標籤。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present application provide a feature label screening method, device, an apparatus, an electronic equipment, a medium, and a product. The method includes: acquiring multiple original training samples; for each original training sample, obtaining a key matrix and a value matrix after the original training sample is input into an attention model, and determining an attention loss corresponding to the original training sample according to the key matrix and the value matrix; determining a first total attention loss according to the attention loss respectively corresponding to each original training sample; determining a second total attention loss based on multiple target training samples and the attention model; the target training sample includes at least one first feature label; determining whether to delete a second feature label according to the first total attention loss and the second total attention loss.</p>
      </isu-abst>
      <representative-img>
        <p type="p">201、202、203、204、205:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1506" publication-number="202616657">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616657</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132123</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>動態超選擇性波導濾波器組件</chinese-title>
        <english-title>DYNAMIC ULTRA-SELECTIVE WAVEGUIDE FILTER ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H03H9/64</main-classification>
        <further-classification edition="200601120260102B">H03H17/00</further-classification>
        <further-classification edition="200601120260102B">H04B1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商諾斯洛普格拉曼系統公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NORTHROP GRUMMAN SYSTEMS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托佩　馬修　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORPEY, MATTHEW S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史卓曼　喬丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STROMAN, JORDAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕科　賈斯汀　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARKE, JUSTIN A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豪威爾　羅伯　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOWELL, ROBERT S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">動態超選擇性波導濾波器(DUST)組件包含複數個基板整合波導(SIW)濾波器之一堆疊，該等基板整合波導(SIW)濾波器之各者包含一第一及第二導電層、安置於該等第一與第二導電層之間以在一輸入埠與一輸出埠之間形成一波導之一介電層，及透過該介電層互連該第一導電層及該第二導電層之複數個導電耦合器。該DUST組件進一步包含一交換網路，該交換網路耦合至該等SIW濾波器之該堆疊以提供離散切換調諧或連續調諧。該交換網路包含用以操作該離散切換調諧或該連續調諧之超晶格齒形場效電晶體(SLCFET)交換機。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The dynamic ultra-selective waveguide filter (DUST) assembly includes a stack of a plurality of substrate integrated waveguide (SIW) filters, each of which includes a first and second conductive layers, a dielectric layer disposed between the first and second conductive layers to form a waveguide between an input port and an output port, and a plurality of conductive couplers that interconnect the first conductive layer and the second conductive layer through the dielectric layer. The DUST assembly further includes a switch network coupled to the stack of the SIW filters to provide discretely switched tuning or continuous tuning. The switch network includes Super Lattice Castellated Field Effect Transistor (SLCFET) switches to operate the discretely switched tuning or the continuous tuning.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:動態超選擇性波導濾波器(DUST)組件</p>
        <p type="p">201:傳入射頻(RF)信號</p>
        <p type="p">202:輸出</p>
        <p type="p">210:波導元件</p>
        <p type="p">211a至211d:波導濾波器</p>
        <p type="p">220a:第一交換網路</p>
        <p type="p">220b:第二交換網路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1507" publication-number="202616293">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616293</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132138</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於動態隨機存取記憶體的一次編程記憶體裝置及半導體封裝</chinese-title>
        <english-title>DRAM-BASED ONE TIME PROGRAMMING MEMORY AND SEMICONDUCTOR PACKAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">G11C17/08</main-classification>
        <further-classification edition="200601120251201B">G11C11/4096</further-classification>
        <further-classification edition="200601120251201B">H01L23/538</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>愛普科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AP MEMORY TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　文良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WENLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃愷</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種基於動態隨機存取記憶體(DRAM)的一次編程(OTP)記憶體裝置包括：至少一個記憶體組，其包含設置為一矩陣的複數記憶體陣列區塊(MAT)。各該等複數MAT包括：複數字線，其沿著一列方向延伸；複數位元線，其沿著一行方向延伸；以及複數記憶體單元，其位於該等複數字線與該等複數位元線之對應交叉點上，各該等複數記憶體單元包含一電容節點。在該記憶體組中沿著該行方向的該等複數記憶體單元之該等電容節點被分成複數電容節點部段，其中該等複數電容節點部段中至少兩者為可分開控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A dynamic random-access memory (DRAM)-based one time programming (OTP) memory device includes: at least one memory bank comprising a plurality of memory array tiles (MATs) arranged in a matrix. Each of the plurality of MATs includes: a plurality of word lines extending along a row direction; a plurality of bit lines extending along a column direction; and a plurality of memory cells located on corresponding cross points of the plurality of word lines and the plurality of bit lines, each of the plurality of memory cells comprising a capacitor node. The capacitor nodes of the plurality of memory cells along the column direction in the memory bank are divided into a plurality of capacitor node segments, wherein at least two of the plurality of capacitor node segments are separately controllable.</p>
      </isu-abst>
      <representative-img>
        <p type="p">30A:記憶體裝置</p>
        <p type="p">300A:第一記憶體陣列</p>
        <p type="p">300B:第二記憶體陣列</p>
        <p type="p">302:控制器</p>
        <p type="p">304:充電泵浦電路</p>
        <p type="p">306:列解碼器</p>
        <p type="p">308:行解碼器</p>
        <p type="p">310:寫入驅動器</p>
        <p type="p">312:電極板電壓(V&lt;sub&gt;PLT&lt;/sub&gt;)開關</p>
        <p type="p">320:感測放大器</p>
        <p type="p">322:行選擇開關</p>
        <p type="p">324:預充電電路</p>
        <p type="p">326:陣列電壓(V&lt;sub&gt;ARY&lt;/sub&gt;)開關</p>
        <p type="p">328:感測電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1508" publication-number="202614948">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614948</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132146</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於展示門鎖芯的展示裝置和用於這種展示裝置的插入部件</chinese-title>
        <english-title>PRESENTATION ARRANGEMENT FOR PRESENTING A DOOR CYLINDER AND INSERTION PART FOR SUCH A PRESENTATION ARRANGEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">A47F7/00</main-classification>
        <further-classification edition="200601120260105B">E05B15/00</further-classification>
        <further-classification edition="200601120260105B">E05B17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商安博歐葛斯特布雷米克索尼公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABUS AUGUST BREMICKER SOEHNE KG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>發明人放棄姓名表示權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>發明人放棄姓名表示權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於展示特別是雙鎖芯或旋鈕鎖芯的門鎖芯的展示裝置，包括包裝，特別是紙板包裝或硬紙板包裝，包裝具有用於門鎖芯的接收器，其中接收器在外壁處具有緊固開口，緊固設備可經引導通過緊固開口，並且可以特別地旋入已插入的門鎖芯的鎖芯固定螺孔中，以便將門鎖芯固定在接收器中，其中，包裝包括穩定設備，用於穩定在接收器中固定門鎖芯，所述固定透過已引入的緊固設備來實現。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A presentation arrangement for presenting a door cylinder, in particular a double cylinder or a knob cylinder, comprises a packaging, in particular a paperboard packaging or cardboard packaging, that has a receiver for the door cylinder, wherein the receiver has, at an outer wall, a fastening opening through which a fastening device can be guided, and can in particular be screwed into a cylinder fixing screw bore of the inserted door cylinder, in order to fix the door cylinder in the receiver, wherein the packaging comprises a stabilizing device for stabilizing the fixing of the door cylinder in the receiver, said fixing taking place by means of the introduced fastening device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">13:展示裝置</p>
        <p type="p">15:包裝</p>
        <p type="p">17:接收器</p>
        <p type="p">19:側向開口</p>
        <p type="p">35:固定設備</p>
        <p type="p">37:外壁</p>
        <p type="p">39:緊固開口</p>
        <p type="p">41:後壁</p>
        <p type="p">43:前壁</p>
        <p type="p">45:第二緊固開口、緊固開口</p>
        <p type="p">47:穩定設備</p>
        <p type="p">49:外壁加固部分</p>
        <p type="p">51:內側</p>
        <p type="p">53:第一層、層</p>
        <p type="p">55:第二層、層</p>
        <p type="p">63:另一緊固開口、緊固開口</p>
        <p type="p">65:基座部分</p>
        <p type="p">66:基座部分開口</p>
        <p type="p">71:凸片</p>
        <p type="p">79:邊界部分</p>
        <p type="p">93:顯示部分</p>
        <p type="p">95:測量刻度</p>
        <p type="p">97:儲存盒</p>
        <p type="p">107:支承部分</p>
        <p type="p">109:懸掛開口</p>
        <p type="p">117:上側部分</p>
        <p type="p">118:上側</p>
        <p type="p">119:前側部分</p>
        <p type="p">121:下基座部分</p>
        <p type="p">131:閉合部分</p>
        <p type="p">G:使用狀態</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1509" publication-number="202615000">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615000</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132147</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>醯胺取代的環烷基類化合物、其製備方法及其在醫藥上的應用</chinese-title>
        <english-title>AMIDE-SUBSTITUTED CYCLOALKYL COMPOUND, PREPARATION METHOD THEREFOR, AND USE THEREOF IN MEDICINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/21</main-classification>
        <further-classification edition="200601120260102B">A61K31/16</further-classification>
        <further-classification edition="200601120260102B">A61K31/075</further-classification>
        <further-classification edition="200601120260102B">A61P9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江蘇恆瑞醫藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGSU HENGRUI PHARMACEUTICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海恆瑞醫藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI HENGRUI PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡國棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, GUODONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬殿強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, DIANQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及醯胺取代的環烷基類化合物、其製備方法及其在醫藥上的應用。具體而言，本揭露涉及一種通式(I)所示的醯胺取代的環烷基類化合物、其製備方法及含有該類化合物的醫藥組成物以及其作為治療劑的用途，特別是作為RXFP1調節劑的用途和在製備用於治療和/或預防由RXFP1介導的或依賴性的疾病或病症的藥物中的用途。</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="221px" width="206px" file="d10001.TIF" alt="化學式ed10001.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10001.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to an amide-substituted cycloalkyl compound, preparation method therefor, and use thereof in medicine. Specifically, the present disclosure relates to an amide-substituted cycloalkyl compound represented by general formula (I), a preparation method therefor, a pharmaceutical composition containing the same, and a use thereof as a therapeutic agent, particularly, use thereof as an RXFP1 regulator and use thereof in preparing a medicament for treating and/or preventing RXFP1-mediated or dependeent disease.</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="207px" width="192px" file="d10002.TIF" alt="化學式ed10002.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10002.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1510" publication-number="202616221">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616221</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132154</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多使用者擴展實境內容</chinese-title>
        <english-title>MULTI-USER EXTENDED-REALITY CONTENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260102B">G06T19/00</main-classification>
        <further-classification edition="200601120260102B">G06F3/01</further-classification>
        <further-classification edition="202201120260102B">H04L67/131</further-classification>
        <further-classification edition="200601120260102B">G01S5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞迪　瓦倫　阿瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REDDY, VARUN AMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿卡拉力南　索尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKKARAKARAN, SONY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述用於擴展實境的系統及技術。例如，提供一種用於擴展實境之方法。該方法可包括：提供用於在一第一裝置處顯示的共同虛擬內容，該共同虛擬內容可在一第二裝置處觀看；在該第一裝置處從該第二裝置接收一射頻(RF)信號；進行該RF信號的一或多個測量；基於該一或多個測量來判定與該第一裝置及該第二裝置相關聯的相對位置資訊；基於該相對位置資訊來判定滿足一相對位置條件；及基於該相對位置條件被滿足而修改該共同虛擬內容以供由至少該第一裝置顯示。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and techniques are described herein for extended reality. For instance, a method for extended reality is provided. The method may include providing common virtual content for display at a first device, the common virtual content viewable at a second device; receiving, at the first device, a radio-frequency (RF) signal from the second device; making one or more measurements of the RF signal; determining relative-position information associated with the first device and the second device based on the one or more measurements; determining that a relative-position condition is satisfied based on the relative-position information; and modifying the common virtual content for display by at least the first device based on the relative-position condition being satisfied.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:擴展實境(XR)系統</p>
        <p type="p">502:擴展實境(XR)裝置</p>
        <p type="p">508:使用者</p>
        <p type="p">510:視場</p>
        <p type="p">512:場景</p>
        <p type="p">514:物體</p>
        <p type="p">516:擴展實境(XR)內容</p>
        <p type="p">522:擴展實境(XR)裝置；第二裝置</p>
        <p type="p">528:使用者</p>
        <p type="p">532:射頻(RF)信號</p>
        <p type="p">536:擴展實境(XR)內容</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1511" publication-number="202615451">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615451</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132161</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>DEV作載體的禽流感疫苗</chinese-title>
        <english-title>VECTORED DEV AVIAN INFLUENZA VACCINES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07K14/08</main-classification>
        <further-classification edition="200601120260102B">C12N15/40</further-classification>
        <further-classification edition="200601120260102B">A61K39/12</further-classification>
        <further-classification edition="200601120260102B">A61P31/12</further-classification>
        <further-classification edition="200601120260102B">A61P31/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商勃林格殷格翰動物保健(中國)有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOEHRINGER INGELHEIM VETMEDICA (CHINA) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皇甫一凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANGFU, YIFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬誠太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, CHENGTAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張諝霄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XUXIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, ZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭　鵬舉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, PENGJU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及動物健康領域。特別地，本發明涉及一種組合物及其用途，所述組合物包含經修飾的鴨腸炎病毒(DEV)，該經修飾的DEV包含並且能夠表達編碼經修飾的H9型禽流感病毒的血凝素(HA)蛋白(AIV H9 HA蛋白)的異源多核苷酸，所述經修飾的AIV H9 HA蛋白相對於SEQ ID NO:1具有胺基酸取代。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the field of animal health. Particularly, the present invention relates to a composition, comprising a modified Duck Enteritis Virus (DEV) which comprises and is capable of expressing a heterologous polynucleotide coding for a modified Hemagglutinin (HA) protein of avian influenza virus type H9 (AIV H9 HA protein) having amino acid substitution(s) relative to SEQ ID NO:1, and the use thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1512" publication-number="202615831">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615831</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132196</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>力學感測系統及其適用之力學感測器</chinese-title>
        <english-title>FORCE SENSING SYSTEM AND FORCE SENSOR THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251008B">G01L1/18</main-classification>
        <further-classification edition="200601120251008B">G01R17/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商心環科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARDIO RING TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施文彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, WEN-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃承俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHENG-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭宗讓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, TSUNG-JANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">力學感測器包含第一基板、第二基板以及力電元件。第一基板具有避讓部。第二基板設置於所述第一基板上，且具有至少部分覆蓋所述避讓部的懸浮部。力電元件設置於所述第二基板上，且具有設置於所述第二基板的所述懸浮部上的一第一端部。其中所述懸浮部經配置以響應於外力，而朝向所述避讓部彎折；其中，響應於所述外力，所述力電元件的至少一電性參數改變。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A force sensor comprises a first substrate, a second substrate, and a piezoresistive element. The first substrate has an avoidance portion. The second substrate is arranged on the first substrate and has a suspended portion that at least partially covers the avoidance portion. The piezoresistive element is arranged on the second substrate and has a first end portion arranged on the suspended portion of the second substrate. The suspended portion is configured to bend towards the avoidance portion in response to an external force. In response to the external force, at least one electrical parameter of the piezoresistive element changes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:力學感測器</p>
        <p type="p">110:第一基板</p>
        <p type="p">111:避讓部</p>
        <p type="p">120:第二基板</p>
        <p type="p">121:懸浮部</p>
        <p type="p">130:力電元件</p>
        <p type="p">131:第一端部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1513" publication-number="202615776">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615776</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132204</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>旋轉油缸</chinese-title>
        <english-title>ROTARY CYLINDER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">F15B15/00</main-classification>
        <further-classification edition="200601120260115B">F15B15/20</further-classification>
        <further-classification edition="201901120260115B">F15B21/04</further-classification>
        <further-classification edition="200601120260115B">F15B15/28</further-classification>
        <further-classification edition="200601120260115B">F16K17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商北川鐵工所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAGAWA IRON WORKS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西宮民和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMIYA, TAMIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種能夠應對缸室內的工作流體的壓力下降發生的旋轉油缸。根據本案，提供一種旋轉油缸，其包括基座和相對於基座可旋轉的旋轉體，其中，該旋轉體包括旋轉體主體、第1活塞、第1缸室、第2缸室、第1保壓閥、第2保壓閥及壓力調整部，該壓力調整部連接於該第1缸室及該第2缸室，並且用於在該第1缸室和該第2缸室中的至少一個缸室中發生了工作流體的壓力下降時緩解該壓力下降的至少一部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">5:壓力調整部</p>
        <p type="p">33a:第1缸室</p>
        <p type="p">33b:第2缸室</p>
        <p type="p">51:壓力調整流路</p>
        <p type="p">51a:第1室</p>
        <p type="p">51b:第2室</p>
        <p type="p">52:第2活塞</p>
        <p type="p">52a:頭部</p>
        <p type="p">52b:桿部</p>
        <p type="p">52b1:延伸部</p>
        <p type="p">53a:彈簧</p>
        <p type="p">53b:彈簧</p>
        <p type="p">54:感測器凸爪</p>
        <p type="p">55:感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1514" publication-number="202615384">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615384</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132205</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鎓鹽、化學增幅正型阻劑組成物及阻劑圖案形成方法</chinese-title>
        <english-title>ONIUM SALT, CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C25/18</main-classification>
        <further-classification edition="200601120260102B">C07C43/225</further-classification>
        <further-classification edition="200601120260102B">C07C309/42</further-classification>
        <further-classification edition="200601120260102B">C07C309/73</further-classification>
        <further-classification edition="200601120260102B">C07C309/75</further-classification>
        <further-classification edition="200601120260102B">C07C309/77</further-classification>
        <further-classification edition="200601120260102B">C07C381/12</further-classification>
        <further-classification edition="200601120260102B">C07D327/08</further-classification>
        <further-classification edition="200601120260102B">C09K3/00</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA,MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邉聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小竹正晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTAKE, MASAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松澤雄太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUZAWA, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>増永恵一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASUNAGA, KEIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣川歓人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROKAWA, YOSHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供可產生具有適當的酸強度且擴散小的酸之鎓鹽、含有其之化學增幅正型阻劑組成物、及使用該阻劑組成物之阻劑圖案形成方法。  &lt;br/&gt;該課題之解決手段為一種鎓鹽，係以下式(A)表示。  &lt;br/&gt;&lt;img align="absmiddle" height="127px" width="582px" file="ed10324.JPG" alt="ed10324.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An onium salt having a substituent group on the carbon atom adjoining the sulfo group in the anion and containing a triarylbenzene or diarylbenzene structure generates an acid with adequate strength and controlled diffusion. A chemically amplified positive resist composition comprising the onium salt has a high resolution and forms a pattern with reduced LER.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1515" publication-number="202615500">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615500</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132207</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性組成物、光阻膜、圖案形成方法、電子器件之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F112/14</main-classification>
        <further-classification edition="200601120260102B">C08F212/12</further-classification>
        <further-classification edition="200601120260102B">C08F212/14</further-classification>
        <further-classification edition="200601120260102B">C08F220/38</further-classification>
        <further-classification edition="200601120260102B">C08F230/04</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡宏哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKA, HIRONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後瀉敬介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USHIROGATA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>椿英明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUBAKI, HIDEAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種能夠形成LCDU較小之圖案的感光性組成物。本發明之感光性組成物係含有具有重複單元的樹脂的感光性組成物，該重複單元源自含有由陰離子性基和陽離子構成的鎓鹼之單體，其中，樹脂具有有機金屬結構，或感光性組成物具有與上述樹脂不同的有機金屬化合物，並且上述單體中的、將上述陽離子取代為質子而成之化合物的酸解離常數為-1.0以下，上述陽離子為藉由酸的作用而結構發生變化的陽離子，當將藉由酸的作用而結構發生變化之前的上述陽離子設為陽離子X、將藉由酸的作用而結構發生變化之後的上述陽離子設為陽離子Y時，上述陽離子Y在波長200～450nm處之莫耳吸光係數的積算值大於上述陽離子X在波長200～450nm處之莫耳吸光係數的積算值，並且由上述陰離子性基和上述陽離子Y構成的鎓鹼在被照射波長200～450nm中之任一波長的光時產生酸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1516" publication-number="202616908">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616908</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132218</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光檢測裝置及電子機器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260102B">H10F39/18</main-classification>
        <further-classification edition="202301120260102B">H04N23/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼半導體解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成瀬純次</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARUSE, JUNJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種能夠高效率地集光之光檢測裝置。  &lt;br/&gt;本揭示之一實施形態之光檢測裝置包含：半導體層；第1光電轉換區域及第2光電轉換區域，其等在前述半導體層中設置為彼此相鄰；及集光元件，其設置於前述半導體層之上方。前述半導體層具有設置於前述集光元件與前述第1光電轉換區域之間之第1凸部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">12a:光電轉換部</p>
        <p type="p">12b:光電轉換部</p>
        <p type="p">20:讀出電路</p>
        <p type="p">AMP,SEL,TR1,TR2:電晶體</p>
        <p type="p">FD:浮動擴散部</p>
        <p type="p">P:像素</p>
        <p type="p">RST:電晶體</p>
        <p type="p">SRST:信號</p>
        <p type="p">SSEL:信號</p>
        <p type="p">STR1:信號</p>
        <p type="p">STR2:信號</p>
        <p type="p">VDD:電源電壓</p>
        <p type="p">VSL:信號線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1517" publication-number="202615261">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615261</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132221</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抽獎券</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120251130B">B42D25/27</main-classification>
        <further-classification edition="201401120251130B">B42D25/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商萬代股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANDAI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>向高宏昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUKODAKA, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種抽獎券，其於不縮小抽獎券之資訊記載區域之情況下操作性良好。  &lt;br/&gt;本發明之抽獎券具備包含開封部11a之本體部10，於本體部10，形成有可保持開封部11a之保持部11d、及可分離開封部11a之分離部20，開封部11a包含捏取部11c，分離部20構成為於捏取部11c附近包含曲線。分離部20藉由具有於捏取部11c附近包含曲線之構成，能夠順利地變更開封方向之朝向而不會發生預料之外之斷裂。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:抽獎券</p>
        <p type="p">10:本體部</p>
        <p type="p">10a:左短邊</p>
        <p type="p">10b:右短邊</p>
        <p type="p">10c:長邊(上長邊)</p>
        <p type="p">10d:長邊(下長邊)</p>
        <p type="p">11:第1片體(一表面部)</p>
        <p type="p">11a:開封部</p>
        <p type="p">11b:外周部分</p>
        <p type="p">11c:捏取部</p>
        <p type="p">11d:保持部</p>
        <p type="p">11g:正面側記載部</p>
        <p type="p">12:第2片體(另一表面部)</p>
        <p type="p">20:分離部</p>
        <p type="p">21:第1分離部(分離部)</p>
        <p type="p">22:第2分離部(分離部)</p>
        <p type="p">23:第3分離部(分離部)</p>
        <p type="p">24:第4分離部(分離部)</p>
        <p type="p">210:曲線部</p>
        <p type="p">211:第1直線部</p>
        <p type="p">212:第2直線部</p>
        <p type="p">223:第3直線部</p>
        <p type="p">224:第4直線部</p>
        <p type="p">238:中央直線部</p>
        <p type="p">239:傾斜直線部</p>
        <p type="p">245:第5直線部</p>
        <p type="p">246:第6直線部</p>
        <p type="p">247:第7直線部</p>
        <p type="p">X1:第1方向</p>
        <p type="p">X2:第2方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1518" publication-number="202616242">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616242</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132224</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>商店用廣告體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250901B">G09F1/08</main-classification>
        <further-classification edition="200601120250901B">G09F15/00</further-classification>
        <further-classification edition="200601120250901B">G09F23/14</further-classification>
        <further-classification edition="200601120250901B">A47F7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商萬代股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANDAI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邉英嗣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, HIDETSUGU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種商店用廣告體，其易使用性優良。  &lt;br/&gt;本發明之商店用廣告體1具備本體部10，上述本體部10能夠自1形態變形為第2形態且包含收納部20，收納部20構成為於第1形態時不作為收納部20發揮功能，於第2形態時作為收納部20發揮功能。於第1形態之商店用廣告體1之本體部10中，於其一部分由切口部與彎折部構成收納部20，由於收納部20並非立體地構成，故而便於保管或搬送本體部10。又，利用切口部及彎折部能夠容易地構成大致箱型之收納部20。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:本體部</p>
        <p type="p">10s:前表面(一面)</p>
        <p type="p">11:下端部</p>
        <p type="p">11a,21a,21b,22a:彎折部</p>
        <p type="p">11b:下端支持部(第1支持部)</p>
        <p type="p">12:側面部</p>
        <p type="p">12b:前方突出部</p>
        <p type="p">12c:側面切口</p>
        <p type="p">20:收納部</p>
        <p type="p">20h:開口部</p>
        <p type="p">21:前表面壁</p>
        <p type="p">21c,23c,24c:切口部</p>
        <p type="p">22:上表面壁</p>
        <p type="p">23:輔助部</p>
        <p type="p">23L:第2輔助部(輔助部)</p>
        <p type="p">23R:第1輔助部(輔助部)</p>
        <p type="p">23a:輔助部彎折部</p>
        <p type="p">24:後方支持部(第2支持部)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1519" publication-number="202615366">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615366</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132238</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗菌玻璃、水處理劑及水處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C03C3/066</main-classification>
        <further-classification edition="200601120260102B">C03C4/00</further-classification>
        <further-classification edition="200601120260102B">A01N25/08</further-classification>
        <further-classification edition="200601120260102B">A01N59/16</further-classification>
        <further-classification edition="200601120260102B">A01P3/00</further-classification>
        <further-classification edition="202301120260102B">C02F1/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東亞合成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOAGOSEI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊谷康平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAGAI, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中崎康太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAZAKI, KOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田喜直</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, YOSHINAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種抗菌玻璃，其以換算為氧化物之量計，  &lt;br/&gt;SiO&lt;sub&gt;2&lt;/sub&gt;之量為1～30質量%，  &lt;br/&gt;B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;之量為40～70質量%，  &lt;br/&gt;Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;之量為0～20質量%，  &lt;br/&gt;K&lt;sub&gt;2&lt;/sub&gt;O及/或Na&lt;sub&gt;2&lt;/sub&gt;O之合計量為0～10質量%，  &lt;br/&gt;選自由MgO、BaO及ZnO所組成之群中之至少1種之合計量為10～30質量%，  &lt;br/&gt;Ag&lt;sub&gt;2&lt;/sub&gt;O之量為0.1～5質量%，  &lt;br/&gt;B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;相對於SiO&lt;sub&gt;2&lt;/sub&gt;之比為1～20。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1520" publication-number="202616550">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616550</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132241</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電源裝置及其製造方法、雷射熔接方法、以及金屬板的雷射熔接方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260102B">H01M10/058</main-classification>
        <further-classification edition="202101120260102B">H01M50/566</further-classification>
        <further-classification edition="202101120260102B">H01M50/536</further-classification>
        <further-classification edition="202101120260102B">H01M50/531</further-classification>
        <further-classification edition="202101120260102B">H01M50/296</further-classification>
        <further-classification edition="202101120260102B">H01M50/284</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>作間祐仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKUMA, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高辻勇貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKATSUJI, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南利洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINAMI, TOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溝口浩章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZOGUCHI, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提升二次電池單元與電路基板的固定的信賴性。&lt;br/&gt;  [解決手段]電源裝置100具備：二次電池單元1，具備正極接片3A與負極接片3B；及電路基板2，具有分別與二次電池單元1的正極接片3A及負極接片3B連接的一對金屬塊8。金屬塊8與電路基板2相向的塊體配置區域10的至少一部分形成有焊料層12。在電源裝置100的平面視角下，焊料層12是沿著正極接片3A及負極接片3B的輪廓的至少一部分形成為島狀。在電源裝置100的平面視角下，在正極及負極接片3B與金屬塊8相向的界面的至少一部分，形成有接合正極及負極接片3B與金屬塊8的接合區域20。在電源裝置100的平面視角下，焊料層12與接合區域20是配置成不重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:電路基板</p>
        <p type="p">3:金屬接片</p>
        <p type="p">3A:正極接片</p>
        <p type="p">3B:負極接片</p>
        <p type="p">8:金屬塊</p>
        <p type="p">10:塊體配置區域</p>
        <p type="p">12:焊料層</p>
        <p type="p">20:接合區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1521" publication-number="202616081">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616081</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132256</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＤＲＡＭ到實體位址轉換的框架</chinese-title>
        <english-title>FRAMEWORK FOR DRAM TO PHYSICAL ADDRESS CONVERSION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">G06F12/02</main-classification>
        <further-classification edition="200601120260115B">G06F13/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商微軟技術授權有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICROSOFT TECHNOLOGY LICENSING, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯托克曼　約翰亨利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STOCKMANN, JOHN HENRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博根斯　麥克愛德華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BORGENS, MICHAEL EDWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　國林派崔克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KOK LIM PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所闡述之技術提供一種方法，該方法包括以下步驟：基於一系統實體位址來判定鏈接至一記憶體控制器節點群組之L3快取節點之一集群；基於該系統實體位址來判定繫結至一SoC網中之一組件集線器之一L3快取節點；判定該SoC網中映射至該系統實體位址之一記憶體控制器節點；藉由將該系統實體位址之低DRAM空間重定位且自該系統實體位址移除該等快取集群位元來產生一去交錯位址；藉由將位元指派給DRAM位址組件來將該去交錯實體位址映射至一DRAM位址；以及儲存該等DRAM位址組件之該等位元指派。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The described technology provides a method including determining, based on a system physical address, a cluster of L3 cache nodes that are linked to a group of memory controller nodes, determining, based on the system physical address, an L3 cache node tied to a component hub in a SoC mesh, determining a memory controller node in the SoC mesh that maps to the system physical address, generating a deinterleaved address by relocating low DRAM space of the system physical address and removing the cache cluster bits from the system physical address, mapping the deinterleaved physical address to a DRAM address by assigning bits to DRAM address components, and storing the bit assignments of the DRAM address components.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">102:母板</p>
        <p type="p">104:CPU封裝</p>
        <p type="p">106:CPU</p>
        <p type="p">108:網狀互連模組</p>
        <p type="p">110:記憶體控制器集線器</p>
        <p type="p">112a:階層式雜湊</p>
        <p type="p">112b:MC節點映射</p>
        <p type="p">114:位址處理節點</p>
        <p type="p">116:映射模組</p>
        <p type="p">130:DRAM模組</p>
        <p type="p">132a:DRAM</p>
        <p type="p">132b:DRAM</p>
        <p type="p">132n:DRAM</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1522" publication-number="202616628">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616628</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132264</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>切換式轉換器及其控制電路和控制方法</chinese-title>
        <english-title>SWITCHING CONVERTER AND ASSOCIATED CONTROL CIRCUIT AND CONTROL METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">H02M3/156</main-classification>
        <further-classification edition="200601120251201B">H02M1/08</further-classification>
        <further-classification edition="200601120251201B">H02M7/217</further-classification>
        <further-classification edition="200601120251201B">G05F1/565</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商茂力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DU, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開了切換式轉換器及其控制電路和控制方法。該切換式轉換器包括串聯耦接在輸入電壓與參考地之間的第一開關對、串聯耦接在輸出電壓與參考地之間的第二開關對以及電感。該控制方法包括；基於輸出電壓回饋訊號與輸出電壓參考訊號提供第一誤差放大訊號；基於第一誤差放大訊號與代表流過電感電流的電流偵測訊號提供第二誤差放大訊號；基於第二誤差放大訊號與一基準電壓的差值，提供控制電壓；以及基於輸入電壓、輸出電壓以及控制電壓，提供控制第一開關對的第一脈寬調變訊號和控制第二開關對的第二脈寬調變訊號，以將電感的第一端可選地耦接至輸入電壓或參考地，並將電感的第二端可選地耦接至輸出電壓或參考地。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a switching converter and associated control circuit and control method. The switching converter has a first switch pair coupled in series between an input voltage and a reference ground, a second switch pair coupled in series between an output voltage and the reference ground, and an inductor. The control method includes: providing a first error amplifying signal upon an output feedback signal representative of the output voltage and an output reference signal, providing a second error amplifying signal upon the first error amplifying signal and a current sense signal representative of a current flowing through the inductor, providing a control voltage upon a voltage difference between the second error amplifying signal and a reference voltage, providing a first pulse width modulation signal to control the first switch pair for selectively coupling a first terminal of the inductor to the input voltage or the reference ground, as well as providing a second pulse width modulation signal to control the second switch pair for selectively coupling a second terminal of the inductor to the output voltage or the reference ground, upon the input voltage, the output voltage and the control voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10A:切換式轉換器</p>
        <p type="p">11:第一開關對</p>
        <p type="p">22:第二開關對</p>
        <p type="p">40:回饋電路</p>
        <p type="p">41:第一誤差放大電路</p>
        <p type="p">42:第二誤差放大電路</p>
        <p type="p">43:控制電壓產生電路</p>
        <p type="p">44:脈寬調變電路</p>
        <p type="p">101A:功率級電路</p>
        <p type="p">104A:控制電路</p>
        <p type="p">Cin:電容</p>
        <p type="p">Cout:電容</p>
        <p type="p">COMP1:第一誤差放大訊號，第一誤差訊號</p>
        <p type="p">COMP2:第二誤差放大訊號</p>
        <p type="p">IL1:電流</p>
        <p type="p">IBATT:充電電流</p>
        <p type="p">L:電感</p>
        <p type="p">Q1:開關，第一開關</p>
        <p type="p">Q2:開關，第二開關</p>
        <p type="p">Q3:開關，第三開關</p>
        <p type="p">Q4:開關，第三開關</p>
        <p type="p">REF:輸出電壓參考訊號</p>
        <p type="p">SWA:開關節點</p>
        <p type="p">SWB:開關節點</p>
        <p type="p">SW_boost:第二脈寬調變訊號</p>
        <p type="p">SW_buck:第一脈寬調變訊號</p>
        <p type="p">V0:基準電壓</p>
        <p type="p">Vx:控制電壓</p>
        <p type="p">VCS:電流偵測訊號</p>
        <p type="p">VFB:輸出電壓回饋訊號</p>
        <p type="p">Vin:輸入電壓</p>
        <p type="p">Vout:輸出電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1523" publication-number="202616624">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616624</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132265</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>切換式轉換器及其控制電路和控制方法</chinese-title>
        <english-title>SWITCHING CONVERTER AND ASSOCIATED CONTROL CIRCUIT AND CONTROL METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">H02M3/04</main-classification>
        <further-classification edition="200601120251201B">H02M3/156</further-classification>
        <further-classification edition="200601120251201B">H02M7/217</further-classification>
        <further-classification edition="200601120251201B">G05F1/565</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商茂力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DU, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開了切換式轉換器及其控制電路和控制方法。該切換式轉換器包括第一誤差放大電路、第二誤差放大電路、控制電壓產生電路與脈寬調變電路。第一誤差放大電路接收代表輸出電壓的輸出電壓回饋訊號，基於輸出電壓回饋訊號與輸出電壓參考訊號，提供第一誤差放大訊號。第二誤差放大電路，接收第一誤差放大訊號和代表流過第一電感電流和流過第二電感電流的和值的電流偵測訊號，在輸出端提供第二誤差放大訊號。控制電壓產生電路基於第二誤差放大訊號與基準電壓的差值，提供控制電壓。脈寬調變電路基於輸入電壓、輸出電壓和控制電壓，提供控制第一橋臂的第一脈寬調變訊號、控制第二橋臂的第二脈寬調變訊號和控制第三橋臂的第三脈寬調變訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a switching converter and associated control circuit and control method. The switching converter has a first error amplifying circuit, a second error amplifying circuit, a control voltage generator and a pulse width modulation circuit. The first error amplifying circuit receives an output feedback signal representative of an output voltage and provides a first error amplifying signal upon the output feedback signal and an output reference signal. The second error amplifying circuit receives the first error amplifying signal and a current sense signal representative of a sum of a first inductor current flowing through a first inductor and a second inductor current flowing through a second inductor, and provides a second error amplifying signal. The control voltage generator provides a control voltage upon a voltage difference between the second error amplifying signal and a reference voltage. The pulse width modulation circuit provides a first pulse width modulation signal for controlling a first-leg portion of the switching converter, a second pulse width modulation signal for controlling a second-leg portion of the switching converter, and a third pulse width modulation signal for controlling a third-leg portion of the switching converter, upon an input voltage, the output voltage and the control voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:第一橋臂</p>
        <p type="p">22:第二橋臂</p>
        <p type="p">33:第三橋臂</p>
        <p type="p">41:第一誤差放大電路</p>
        <p type="p">42:第二誤差放大電路</p>
        <p type="p">43:控制電壓產生電路</p>
        <p type="p">44:脈寬調變電路</p>
        <p type="p">101A:功率級電路</p>
        <p type="p">104A:控制電路</p>
        <p type="p">10A:切換式轉換器</p>
        <p type="p">Cin:電容</p>
        <p type="p">COMP1:第一誤差放大訊號</p>
        <p type="p">COMP2:第二誤差放大訊號</p>
        <p type="p">Cout:電容</p>
        <p type="p">IBATT:充電電流</p>
        <p type="p">IL1:第一電流</p>
        <p type="p">IL2:第二電流</p>
        <p type="p">L1:電感</p>
        <p type="p">L2:電感</p>
        <p type="p">Q1:開關，高側開關</p>
        <p type="p">Q2:開關，低側開關</p>
        <p type="p">Q3:開關，低側開關</p>
        <p type="p">Q4:開關，高側開關</p>
        <p type="p">Q5:開關，高側開關</p>
        <p type="p">Q6:開關，低側開關</p>
        <p type="p">REF:輸出電壓參考訊號</p>
        <p type="p">SW_boost:第二脈寬調變訊號</p>
        <p type="p">SW_buck:第一脈寬調變訊號</p>
        <p type="p">SW_buck_B:第三脈寬調變訊號</p>
        <p type="p">SWA:開關節點</p>
        <p type="p">SWB:開關節點</p>
        <p type="p">SWC:開關節點</p>
        <p type="p">VCS:電流偵測訊號</p>
        <p type="p">VFB:輸出電壓回饋訊號</p>
        <p type="p">Vin:輸入電壓</p>
        <p type="p">Vout:輸出電壓</p>
        <p type="p">Vx:控制電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1524" publication-number="202615406">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615406</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132298</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻劑組成物、阻劑圖型形成方法、化合物及高分子化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C309/11</main-classification>
        <further-classification edition="200601120260102B">C07C381/12</further-classification>
        <further-classification edition="200601120260102B">C07D333/76</further-classification>
        <further-classification edition="200601120260102B">C08F212/14</further-classification>
        <further-classification edition="200601120260102B">C08F220/38</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤広樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明採用一種阻劑組成物，其係因曝光而產生酸且因酸之作用而對顯影液之溶解性產生變化之阻劑組成物，其中含有因酸之作用而對顯影液之溶解性產生變化之樹脂成分，該樹脂成分採用具有由通式(a0-m)表示之化合物所衍生之構成單位之阻劑組成物。通式(a0-m)中，W&lt;sup&gt;0&lt;/sup&gt;為含聚合性基之基。R&lt;sup&gt;Ar&lt;/sup&gt;為芳香環。I為碘原子，R&lt;sup&gt;d0&lt;/sup&gt;為碘原子以外之取代基。k為1以上之整數。j為0以上之整數。Y&lt;sup&gt;d0&lt;/sup&gt;為2價連結基或單鍵。m為1以上之整數且M&lt;sup&gt;m+&lt;/sup&gt;為m價之有機陽離子。根據該阻劑組成物，在阻劑圖型之形成中，可謀求高感度化，且可提升減輕粗度等之微影特性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1525" publication-number="202615047">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615047</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132326</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種ＩＲＡＫ－４降解劑之製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/535</main-classification>
        <further-classification edition="200601120260102B">A61K31/519</further-classification>
        <further-classification edition="200601120260102B">A61K31/44</further-classification>
        <further-classification edition="200601120260102B">A61K31/4184</further-classification>
        <further-classification edition="200601120260102B">A61K31/4155</further-classification>
        <further-classification edition="200601120260102B">A61P43/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海齊魯製藥研究中心有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI QILU PHARMACEUTICAL RESEARCH AND DEVELOPMENT CENTRE LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齊憲亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QI, XIANLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李運波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YUNBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>苗盼楠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIAO, PANNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范傳文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, CHUANWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>覃華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIN, HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>付　家勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, JIASHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畢方超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BI, FANGCHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供式(I)所示化合物及其中間體之製備方法，該方法收率高、反應週期短、原子經濟性好、生產成本低、環境友好、後處理簡單，具有工業化應用前景。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1526" publication-number="202615992">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615992</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132375</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微影裝置的遮光器及帶有遮光器的微影裝置</chinese-title>
        <english-title>SHUTTER FOR A MICROLITHOGRAPHY DEVICE AND A MICROLITHOGRAPHY DEVICE WITH A SHUTTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">G03F7/20</main-classification>
        <further-classification edition="200601120260109B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞典商麥可尼克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MYCRONIC AB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彼得森　亨利克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PETTERSSON, HENRIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉達爾　西蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RADAHL, SIMON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦爾特　喬納斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALTHER, JONAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於一微影裝置之遮光器(40)，其包括可圍繞一旋轉軸線(44)旋轉之一可旋轉本體(41)及一驅動單元。該可旋轉本體具有長於一最大寬度(W)之沿該旋轉軸線之一長度(L)。該可旋轉本體包括至少一第一平面反射表面(42)，其具有沿垂直於該旋轉軸線之一第一方向(N)導引之一表面法線。該第一平面反射表面自該旋轉軸線偏移(O)。該可旋轉本體針對該長度之至少一部分留出一自由視線，該自由視線沿垂直於該旋轉軸線之一第二方向(S)穿過該旋轉軸線。該驅動單元經組態以使該可旋轉本體圍繞該旋轉軸線來回轉動於一第一旋轉位置與一第二旋轉位置之間。亦揭示一種具有一遮光器之微影裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A shutter (40) for a microlithography device, comprises a rotatable body (41), rotatable around a rotation axis (44), and a driving unit. The rotatable body has a length (L) along the rotation axis that is longer than a largest width (W). The rotatable body comprises at least a first plane reflective surface (42) with a surface normal directed in a first direction (N) perpendicular to the rotation axis. The first plane reflective surface is offset (O) from the rotation axis. The rotatable body leaves, for at least a part of the length, a free line-of-sight, passing the rotation axis, in a second direction (S) perpendicular to the rotation axis. The driving unit is configured for turning the rotatable body back and forth between a first rotational position and a second rotational position around the rotation axis. A microlithography device having a shutter is also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">32:光束</p>
        <p type="p">40:遮光器</p>
        <p type="p">41:可旋轉本體</p>
        <p type="p">42:第一平面反射表面</p>
        <p type="p">44:旋轉軸線</p>
        <p type="p">45:開口</p>
        <p type="p">46:軸件</p>
        <p type="p">101:第一旋轉位置</p>
        <p type="p">L:長度</p>
        <p type="p">N:第一方向</p>
        <p type="p">O:距離</p>
        <p type="p">S:第二方向</p>
        <p type="p">W:最大寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1527" publication-number="202616437">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616437</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132376</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>
        <english-title>SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/67</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, SONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之基板處理方法係藉由使傾斜姿勢之基板與浸漬槽內之處理液之表面即液面在上下方向相對移動，而使基板自浸漬狀態變為非浸漬狀態，該傾斜姿勢係基板相對於鉛直面傾斜之姿勢，該浸漬狀態係基板整體配置於浸漬槽內之處理液中的狀態，該非浸漬狀態係基板整體配置於液面之上方的狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">21:浸漬槽</p>
        <p type="p">LS:液面</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1528" publication-number="202615052">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615052</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132384</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多環性化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260106B">A61K31/553</main-classification>
        <further-classification edition="200601120260106B">A61K31/551</further-classification>
        <further-classification edition="200601120260106B">A61K31/506</further-classification>
        <further-classification edition="200601120260106B">A61K31/4985</further-classification>
        <further-classification edition="200601120260106B">A61K31/498</further-classification>
        <further-classification edition="200601120260106B">A61K31/4965</further-classification>
        <further-classification edition="200601120260106B">A61K31/351</further-classification>
        <further-classification edition="200601120260106B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商第一三共股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIICHI SANKYO COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>影治秀晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAGEJI, HIDEAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>下永真里子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMONAGA, MARIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高梨憲幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKANASHI, NORIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袴田容章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAKAMATA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浜田知明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMADA, TOMOAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古屋健史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUYA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本純</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種具有CRBN結合活性之新穎化合物，又，提供一種具有CRBN結合活性及靶蛋白結合活性之新穎化合物、含有該化合物之靶蛋白分解誘導劑、及含有該化合物之醫藥。本發明係關於一種化合物或其鹽、及含有該化合物之醫藥，該化合物係由通式(I)表示，  &lt;br/&gt;&lt;img align="absmiddle" height="50px" width="204px" file="ed10174.JPG" alt="ed10174.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式中之各符號如本說明書中所定義)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1529" publication-number="202616438">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616438</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132405</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子部件托盤系統及其托盤結構</chinese-title>
        <english-title>TRAY SYSTEM FOR ELECTRONIC COMPONENTS AND TRAY STRUCTURE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">H01L21/67</main-classification>
        <further-classification edition="200601120260113B">B65G49/05</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商伊利諾工具工程公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ILLINOIS TOOL WORKS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬　楓栐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEE, HONG YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種托盤結構，包括一或更多個袋，每個袋被配置為接收具有基板的封裝組件或接收基板。每個袋包括複數個抓取件和一個支撐部分。該複數個抓取件被配置為與該基板的側表面接觸。該支撐部分被配置為支撐該基板。該等抓取件和該支撐部分形成接收空間以接收該基板的至少一部分。該抓取件被配置為與該基板的該等側表面的下邊緣部分上方的部分接觸。該支撐部分被配置為與該基板的底表面的一部分接觸，但不與該基板的該底表面的外邊緣部接觸。該托盤結構被配置為當具有該基板的封裝組件或該基板被接收在該接收空間中並且具有該基板的該封裝組件或該基板沿著該接收空間中支撐該基板的表面移動時，不與該基板的該等側表面的該下邊緣部分和該底表面的該外邊緣部分接觸，從而避免了該基板的該等側表面的該下邊緣部分和該底表面的該外邊緣部分上的脫落、划痕等。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a tray structure comprising one or more pockets, each of which is configured to receive a package assembly having a substrate or to receive a substrate. Each pocket includes a plurality of captures and a support portion. The plurality of captures are configured to be in contact with side surfaces of the substrate. The support portion is configured to support the substrate. The captures and the support portion form a receiving space to receive at least a part of the substrate. The captures are configured to be in contact with parts of the side surfaces of the substrate above lower edge portions thereof. The support portion is configured to be in contact with a part of a bottom surface of the substrate but not in contact with an outer edge portion of the bottom surface of the substrate. The tray structure is configured to be not in contact with the lower edge portions of the side surfaces and the outer edge portion of the bottom surface of the substrate when package assembly having the substrate or the substrate is received in the receiving space and the package assembly having the substrate or the substrate moves along a surface which supports the substrate in the receiving space, thereby avoiding chip-off, scratches, etc. on the lower edge portions of the side surfaces and the outer edge portion of the bottom surface of the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:抓取件</p>
        <p type="p">102:支撐部分</p>
        <p type="p">103:安裝框架</p>
        <p type="p">105:接收空間</p>
        <p type="p">150:托盤結構第五實施例</p>
        <p type="p">1011:凸出部分</p>
        <p type="p">1027:線性凸起</p>
        <p type="p">1028:轉彎凸起</p>
        <p type="p">1029:開口</p>
        <p type="p">1031:地板</p>
        <p type="p">1032:通孔</p>
        <p type="p">1033/1034:曲表面結構</p>
        <p type="p">1045:內表面</p>
        <p type="p">102D:支撐部分分離式凸起</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1530" publication-number="202615725">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615725</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132408</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>三價鉻鍍浴</chinese-title>
        <english-title>TRIVALENT CHROMIUM PLATING BATH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C25D3/06</main-classification>
        <further-classification edition="200601120260105B">C25D5/12</further-classification>
        <further-classification edition="200601120260105B">H05K3/18</further-classification>
        <further-classification edition="200601120260105B">C25F3/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商英　邁克士　許洛特博士公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DR.-ING. MAX SCHLOTTER GMBH &amp; CO. KG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩瑪蒂　帕雅姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMADI, PAYAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>道博　奧利佛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAUB, OLIVER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣大中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於三價鉻鍍浴組合物之用途，其用於電沈積厚度為1 µm或更厚之硬鉻層，該組合物包括(A)以5-40 g/l之量之三價鉻離子，(B)至少一種選自硫酸根、氯離子、溴離子及甲磺酸根之陰離子，(C)至少一種選自甲酸根及乙酸根之羧酸根離子，(D)    至少一種選自氨、硼酸、除組分(C)外具有2至8個碳原子之羧酸及其鹽及鋁鹽之緩衝劑物質，及(E) 0.01至100 g/l至少一種包括磺酸酯基團及硫化物或二硫化物基團之具體化合物。本發明之其他態樣係關於硬鉻鍍覆方法、硬鉻鍍層及鍍硬鉻之物件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the use of a trivalent chrome plating bath composition for the electrodeposition of a hard chrome layer with a thickness of 1 µm or more, the composition comprising (A) trivalent chromium ions in an amount of 5-40 g/l, (B) at least one anion selected from sulfate, chloride, bromide and methanesulfonate, (C) at least one carboxylate ion selected from formate and acetate, (D) at least one buffer substance selected from ammonia, boric acid, carboxylic acids with 2 to 8 carbon atoms other than component (C) and salts thereof, and aluminium salts, and (E) 0.01 to 100 g/l of at least one specific compound which comprises a sulfonate group and a sulfide or disulfide group. Other aspects of the invention relate to a hard chrome plating process, a hard chrome plating layer and a hard chrome plated article.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1531" publication-number="202616467">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616467</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132410</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於基板處理腔室的柔性元件</chinese-title>
        <english-title>FLEXIBLE ELEMENT FOR A SUBSTRATE PROCESSING CHAMBER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">H01L21/683</main-classification>
        <further-classification edition="200601120260107B">H01L21/67</further-classification>
        <further-classification edition="200601120260107B">F16K51/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏梅薩拉　烏彭德拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMMETHALA, UPENDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿拉亞里　庫許克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALAYAVALLI, KAUSHIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奈菲許　薩米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAYFEH, SAMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　段安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, TUAN ANH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝沙維亞加雅索莫西卡　維西瓦茲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASAVARAJAIAH SOMASHEKAR, VISHWAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈坦卡迪　艾米特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATTANGADI, AMIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉珍德倫　哈利佩拉薩斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAJENDRAN, HARI PRASATH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索馬納哈利馬勒沙帕　切坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOMANAHALLI MALLESHAPPA, CHETHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">柔性元件經配置用來在密封板和基板處理腔室中的另一元件之間形成密封。該柔性元件包括與密封板的第一介面表面接合的第一部分，以及面對處理腔室中該元件的第二介面表面的第二部分。中間部分從第一部分延伸到第二部分。該中間部分經配置為可以彎曲，以適應第一介面表面和第二介面表面之間的錯位，允許第一部分和第二部分之間的相對運動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A flexible element is configured to form a seal between a seal plate and another component in a substrate processing chamber. The flexible element includes a first portion engaged with a first interface surface of the seal plate, and a second portion facing a second interface surface of the component in the processing chamber. An intermediate portion spans from the first portion to the second portion. The intermediate portion is configured to flex to accommodate a misalignment between the first interface surface and the second interface surface by allowing relative movement between the first and second portions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:腔室主體</p>
        <p type="p">107:第一區域</p>
        <p type="p">108:第二區域</p>
        <p type="p">112:支撐板</p>
        <p type="p">113:密封板</p>
        <p type="p">114:升舉銷</p>
        <p type="p">115:支架</p>
        <p type="p">184:抽氣環</p>
        <p type="p">200:處理腔室</p>
        <p type="p">210:柔性元件</p>
        <p type="p">211:第一部分</p>
        <p type="p">212:第二部分</p>
        <p type="p">213:中間部分</p>
        <p type="p">215:第一密封表面</p>
        <p type="p">221:第一密封溝槽</p>
        <p type="p">222:第二密封溝槽</p>
        <p type="p">223:密封溝槽</p>
        <p type="p">241:第一密封元件</p>
        <p type="p">242:第二密封元件</p>
        <p type="p">245:密封元件</p>
        <p type="p">251:第一介面表面</p>
        <p type="p">252:第二介面表面</p>
        <p type="p">260:偏壓元件</p>
        <p type="p">281:埠</p>
        <p type="p">282:氣室</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1532" publication-number="202615783">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615783</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132416</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣動夾持以及／或制動裝置外殼部件、夾持以及／或制動裝置</chinese-title>
        <english-title>HOUSING PART FOR A PNEUMATIC CLAMPING AND/OR BRAKING DEVICE, CLAMPING AND/OR BRAKING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251210B">F16D65/16</main-classification>
        <further-classification edition="200601120251210B">F16D49/14</further-classification>
        <further-classification edition="200601120251210B">B23Q1/28</further-classification>
        <further-classification edition="200601120251210B">F16B2/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商黑馬機械儀器防護有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEMA MASCHINEN- UND APPARATESCHUTZ GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利庫斯　愛德蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIKUS, EDMUND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種外殼部件，用於氣動夾持以及/或制動裝置，外殼部件包括一環狀凹槽以及一夾持元件。環狀凹槽用於在所述外殼部件的一第一接觸面與一第二接觸面之間夾持一環狀彈簧片，第一接觸面由所述環狀凹槽定義，第二接觸面亦由所述凹槽定義。夾持元件包括一臂部以及一端部，與臂部相連，端部具有一夾持表面，其中當彈簧片以彈簧片的一第一端支撐於第一接觸面的方式夾持於第一接觸面與第二接觸面之間時，彈簧片自第一接觸面延伸至第二接觸面，且彈簧片的一第二端壓靠於第二接觸面，夾持元件配置以能夠經由夾持表面將一夾持以及/或制動力傳遞至一待夾持以及/或待制動物。其中臂部的一部分朝向端部逐漸漸縮。一種用於夾持以及/或制動一待夾持以及/或待制動物的夾持以及/或制動裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A housing part for a pneumatic clamping and/or braking device is described, the housing part comprising: an annular recess for clamping an annular spring plate between a first contact surface of the housing part, which first contact surface is defined by the recess, and a second contact surface of the housing part, which second contact surface is defined by the recess; a clamping element comprising an arm and an end piece which adjoins the arm and has a clamping surface, wherein, when the spring plate is clamped in the recess between the first contact surface and the second contact surface in such a way that a first end of the spring plate is supported on the first contact surface, the spring plate extends from the first contact surface to the second contact surface, and a second end of the spring plate presses on the second contact surface, the clamping element is configured to transmit a clamping and/or braking force to an object which is to be clamped and/or braked via the clamping surface; wherein a portion of the arm tapers towards the end piece. A clamping and/or braking device for clamping and/or braking an object which is to be clamped and/or braked is likewise described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:彈簧</p>
        <p type="p">1a:第一環狀彈簧片</p>
        <p type="p">1b:第二環狀彈簧片</p>
        <p type="p">2:內部壓力空間/第二壓力空間</p>
        <p type="p">4:外部壓力空間/第一壓力空間</p>
        <p type="p">3:外殼</p>
        <p type="p">3a:第一外殼部件</p>
        <p type="p">3b:第二外殼部件</p>
        <p type="p">5:物體/軸</p>
        <p type="p">6:增壓泵/壓縮空氣泵</p>
        <p type="p">7:夾持表面</p>
        <p type="p">8:夾持元件/彈簧叉/彈性元件</p>
        <p type="p">9:軸</p>
        <p type="p">10:夾持以及/或制動裝置</p>
        <p type="p">13:內部空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1533" publication-number="202615785">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615785</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132420</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於氣壓夾持及／或制動裝置之外殼部件、以及氣壓夾持及／或制動裝置</chinese-title>
        <english-title>HOUSING PART FOR A PNEUMATIC CLAMPING AND/OR BRAKING DEVICE, AND CLAMPING AND/OR BRAKING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251210B">F16D65/18</main-classification>
        <further-classification edition="200601120251210B">B23Q1/28</further-classification>
        <further-classification edition="200601120251210B">F16B2/02</further-classification>
        <further-classification edition="200601120251210B">F16D49/16</further-classification>
        <further-classification edition="200601120251210B">F16D49/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商黑馬機械儀器防護有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEMA MASCHINEN- UND APPARATESCHUTZ GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利庫斯　愛德蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIKUS, EDMUND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種外殼部件，用於氣壓夾持及/或制動裝置，所述外殼部件包括：一第一環狀凹槽（11a）、一第一夾持元件（8_1）、一第二環狀凹槽（11b）、以及一第二夾持元件（8_2）。第一環狀凹槽（11a）用以夾持一第一環狀彈簧片（1a），第一夾持元件（8_1）包括一第一端部（8a），第一端部（8a）具有一第一端面（8f）及一第一夾持面（7a），其中第一夾持元件（8_1）配置以：當第一彈簧片（1a）夾持於第一凹槽（11a）內、位於由第一凹槽（11a）定義之一第一接觸面（101）與一第二接觸面（102）之間，使得第一彈簧片（1a）之一端支撐於由第一凹槽（11a）定義之第一接觸面（101），且另一端壓靠於由第一凹槽（11a）定義之第二接觸面（102）時，能經由第一夾持面（7a）將第一夾持及/或制動力傳遞至待夾持及/或制動之一第一物體（5）。第二環狀凹槽（11b）用以夾持一第二環狀彈簧片（1b）。第二夾持元件（8_2）包括一第二端部（8a），第二端部（8a）具有一第二端面（8f）及一第二夾持面（7b），其中第二夾持元件（8_2）配置以：當第二彈簧片（1b）夾持於第二凹槽（11b）內、位於由第二凹槽（11b）定義之第一接觸面（101）與第二接觸面（102）之間，使得第二彈簧片（1b）之一端支撐於由第二凹槽（11b）定義之第一接觸面（101），且另一端壓靠於由第二凹槽（11b）定義之第二接觸面（102）時，能經由第二夾持面（7b）將第二夾持及/或制動力傳遞至待夾持及/或制動之一第二物體（5）。其中第一夾持元件（8_1）之第一端面（8f）與第二夾持元件（8_2）之第二端面（8f）相互背向配置，且較佳地朝相反方向定位。此外，本發明亦揭示一種夾持及/或制動裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A housing part for a pneumatic clamping and/or braking device is described, the housing part comprising: a first annular recess (11a) for clamping a first annular spring plate (1a);&lt;br/&gt; a first clamping element (8_1) comprising a first end piece (8a), wherein the first end piece (8a) has a first end surface (8f) and a first clamping surface (7a), wherein the first clamping element (8_1) is configured, when the first spring plate (1a) is clamped in the first recess (11a) between a first contact surface (101) defined by the first recess (11a) and a second contact surface (102) defined by the first recess (11a) in such a way that a first end of the first spring plate (1a) is supported on the first contact surface (101) defined by the first recess (11a) and a second end of the first spring plate (1a) presses on the second contact surface (102) defined by the first recess (11a), to transmit a first clamping and/or braking force to a first object (5) to be clamped and/or braked via the first clamping surface (7a);&lt;br/&gt; a second annular recess (11b) for clamping a second annular spring plate (1b);&lt;br/&gt; a second clamping element (8_2) comprising a second end piece (8a), wherein the second end piece (8a) has a second end surface (8f) and a second clamping surface (7b), wherein the second clamping element (8_2) is configured, when the second spring plate (1b) is clamped in the second recess (11b) between a first contact surface (101) defined by the second recess (11b) and a second contact surface (102) defined by the second recess (11b) in such a way that a first end of the second spring plate (1b) is supported on the first contact surface (101) defined by the second recess (11b) and a second end of the second spring plate (1b) presses on the second contact surface (102) defined by the second recess (11b), to transmit a second clamping and/or braking force to a second object (5) to be clamped and/or braked via the second clamping surface (7b);&lt;br/&gt; characterized in that&lt;br/&gt; the first end surface (8f) of the first clamping element (8_1) and the second end surface (8f) of the second clamping element (8_2) are arranged facing away from one another, and preferably oriented in opposite directions. A clamping and/or braking device is also described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:彈簧組件/彈簧</p>
        <p type="p">1a:第一環狀彈簧片/第一彈簧片/彈簧片</p>
        <p type="p">1b:第二環狀彈簧片/第二彈簧片/彈簧片</p>
        <p type="p">2:第二壓力空間/內部壓力空間/壓力空間</p>
        <p type="p">3:外殼</p>
        <p type="p">4:第一壓力空間/外部壓力空間/壓力空間</p>
        <p type="p">5:物體</p>
        <p type="p">6:空氣幫浦/增壓裝置</p>
        <p type="p">7:夾持面</p>
        <p type="p">8:夾持元件</p>
        <p type="p">9:主軸/軸線</p>
        <p type="p">10:夾持及/或制動裝置</p>
        <p type="p">13:內部空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1534" publication-number="202615015">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615015</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132462</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>特定毒蕈鹼受體激動劑之投與方法</chinese-title>
        <english-title>METHODS FOR ADMINISTRATION OF CERTAIN MUSCARINIC RECEPTOR AGONISTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260106B">A61K31/44</main-classification>
        <further-classification edition="200601120260106B">A61K31/4155</further-classification>
        <further-classification edition="200601120260106B">A61K31/4025</further-classification>
        <further-classification edition="200601120260106B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商紐羅克里生物科學有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEUROCRINE BIOSCIENCES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納許　亞比蓋　伊琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NASH, ABIGAIL IRENE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供治療有需要之個體之神經學或精神病學疾病或病症之方法、治療該個體之與神經學或精神病學疾病或病症有關之行為問題之方法、及改良該個體之神經學或精神病學疾病或病症之行為及/或心理學症狀之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are methods of treating a neurological or psychiatric disease or disorder, methods of treating behavioral problems associated with a neurological or psychiatric disease or disorder, and methods of improving behavioral and/or psychological symptoms of a neurological or psychiatric disease or disorder in a subject in need thereof.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1535" publication-number="202615016">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615016</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132464</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>醫藥調配物</chinese-title>
        <english-title>PHARMACEUTICAL FORMULATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260106B">A61K31/44</main-classification>
        <further-classification edition="200601120260106B">A61K31/4155</further-classification>
        <further-classification edition="200601120260106B">A61K31/4025</further-classification>
        <further-classification edition="200601120260106B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商紐羅克里生物科學有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEUROCRINE BIOSCIENCES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩爾　理查　亞歷山德　二世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOORE, RICHARD ALEXANDER, JR.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供醫藥調配物及治療有需要之個體之神經學或精神病學疾病或病症之方法、治療該個體之與神經學或精神病學疾病或病症有關之行為問題之方法、及改良該個體之神經學或精神病學疾病或病症之行為及/或心理學症狀之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are pharmaceutical formulations and methods of treating a neurological or psychiatric disease or disorder, methods of treating behavioral problems associated with a neurological or psychiatric disease or disorder, and methods of improving behavioral and/or psychological symptoms of a neurological or psychiatric disease or disorder in a subject in need thereof.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1536" publication-number="202615724">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615724</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132467</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260105B">C25B11/031</main-classification>
        <further-classification edition="200601120260105B">C23C14/14</further-classification>
        <further-classification edition="200601120260105B">C23C14/20</further-classification>
        <further-classification edition="200601120260105B">C23C14/34</further-classification>
        <further-classification edition="200601120260105B">C22C1/08</further-classification>
        <further-classification edition="200601120260105B">B32B27/08</further-classification>
        <further-classification edition="200601120260105B">B32B5/18</further-classification>
        <further-classification edition="202101120260105B">C25B11/032</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片桐正義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAGIRI, MASAYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>住田幹弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMIDA, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本妃央</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, HINAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種積層膜，其係包含基材與多孔質層者，且該積層膜儘管具有該多孔質層，但耐久性亦優異。  &lt;br/&gt;本發明之實施方式之積層膜係包含基材與多孔質層者，且該基材與該多孔質層經由密接層而積層，該多孔質層及該密接層分別包含選自由金屬元素、半金屬元素、碳所組成之群中之至少1種。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1537" publication-number="202616539">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616539</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132479</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鋰二次電池的電極用結著劑、電極用結著劑組成物、負極及鋰二次電池</chinese-title>
        <english-title>BINDER FOR ELECTRODE OF LITHIUM SECONDARY BATTERY, BINDER COMPOSITION FOR ELECTRODE, NEGATIVE ELECTRODE, AND LITHIUM SECONDARY BATTERY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250909B">H01M4/62</main-classification>
        <further-classification edition="200601120250909B">C08G18/65</further-classification>
        <further-classification edition="201001120250909B">H01M4/13</further-classification>
        <further-classification edition="200601120250909B">H01M4/36</further-classification>
        <further-classification edition="201001120250909B">H01M4/48</further-classification>
        <further-classification edition="201001120250909B">H01M4/58</further-classification>
        <further-classification edition="201001120250909B">H01M10/052</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商第一工業製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DKS CO. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂本紘一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中颯一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, SOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西川明良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKAWA, AKIYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種結著性優異，可減少因充放電所造成之電極的膨脹且充放電循環特性優異之鋰二次電池的電極用結著劑。  &lt;br/&gt;本發明之解決手段如下：有關實施型態之鋰二次電池的電極用結著劑係含有聚胺基甲酸酯的水分散體，該聚胺基甲酸酯係將(A)脂肪族聚異氰酸酯及脂環式聚異氰酸酯的至少一方、(B)多元醇、(C)具有2個以上的羥基與羧基之化合物、及(D)鏈延長劑進行反應而得到。前述(B)成分含有氫化聚丁二烯多元醇。前述(A)成分所具有之異氰酸基相對於前述(B)成分及前述(C)成分所具有之羥基的莫耳比(NCO/OH)為1.15以上且未達1.35。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide a binder for electrode of lithium secondary battery having excellent adhesiveness, which can reduce electrode expansion caused by charging and discharging, and exhibits excellent charge and discharge cycle characteristics. &lt;br/&gt;The means for solving the problem of the present invention is as follows. The binder for electrode of lithium secondary battery according to an embodiment contains an aqueous dispersion of a polyurethane, which is obtained by bring (A) at least one of an aliphatic polyisocyanate and an alicyclic polyisocyanate, (B) a polyol, (C) a compound having two or more hydroxyl groups and a carboxyl group, and (D) a chain extender into reaction. The component (B) contains a hydrogenated polybutadiene polyol. The molar ratio (NCO/OH) of the isocyanate groups of the component (A) to the hydroxyl groups contained in the component (B) and the component (C) is 1.15 or more and less than 1.35.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1538" publication-number="202615610">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615610</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132502</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>研磨用組成物、研磨方法，及半導體基板的製造方法</chinese-title>
        <english-title>POLISHING COMPOSITION, POLISHING METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C09G1/02</main-classification>
        <further-classification edition="200601120260105B">C09K3/14</further-classification>
        <further-classification edition="200601120260105B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商福吉米股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMI INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多田真樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TADA, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中尋之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, NORIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊山茜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAYAMA, AKANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神保大地</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIMBO, DAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示提供一種對於含有含矽材料之研磨對象物實現良好的研磨速度，並且可減少研磨結束後之研磨對象物之表面上之刮痕的方法。  &lt;br/&gt;　　本揭示為一種研磨用組成物，其包含：界達電位為  -5mV以下的研磨粒、重量平均分子量為100以上900以下的第一聚氧伸烷基化合物、以及具有與前述第一聚氧伸烷基化合物不同的氧伸烷基單元且重量平均分子量為100以上900以下的第二聚氧伸烷基化合物；且該研磨用組成物的pH未滿7。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a means by which a good polishing removal rate for an object to be polished including a silicon-containing material can be realized while at the same time reducing scratches on the surface of the object to be polished that has been polished. &lt;br/&gt; The present disclosure is a polishing composition containing: abrasive grains having a zeta potential of -5 mV or less; a first polyoxyalkylene compound having a weight average molecular weight of 100 or more and 900 or less; and a second polyoxyalkylene compound having an oxyalkylene unit different from that of the first polyoxyalkylene compound and having a weight average molecular weight of 100 or more and 900 or less, wherein the polishing composition has a pH of less than 7.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1539" publication-number="202616135">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616135</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132513</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於行動單元的射頻識別標籤識別符</chinese-title>
        <english-title>RADIO FREQUENCY IDENTIFICATION TAG IDENTIFIER FOR MOBILE UNIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">G06K7/10</main-classification>
        <further-classification edition="200601120251201B">G06K19/07</further-classification>
        <further-classification edition="201801120251201B">H04W4/029</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗蘭左　羅伯特　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRANZO, ROBERT THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的各種態樣大致上係關於無線通訊。在一些態樣中，行動單元(MU)可接收與該MU唯一地相關聯的超高頻(UHF)射頻識別(RFID)標籤識別符。該MU可回應於接收到該UHF RFID標籤識別符而執行一或多個MU定位操作。描述了多種其他態樣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a mobile unit (MU) may receive an ultra-high frequency (UHF) radio frequency identification (RFID) tag identifier that is uniquely associated with the MU. The MU may perform, responsive to receiving the UHF RFID tag identifier, one or more MU location operations. Numerous other aspects are described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:行動單元</p>
        <p type="p">120:詢問器</p>
        <p type="p">300:實例</p>
        <p type="p">310:元件符號</p>
        <p type="p">320:元件符號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1540" publication-number="202615538">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615538</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132520</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性樹脂組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">C08G59/22</main-classification>
        <further-classification edition="200601120260107B">C08K3/26</further-classification>
        <further-classification edition="200601120260107B">C08K3/36</further-classification>
        <further-classification edition="201101120260107B">C07B60/00</further-classification>
        <further-classification edition="200601120260107B">C08L101/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商味之素股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AJINOMOTO CO., INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張純奈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, JUNNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種硬化性樹脂組成物，其係包含(A)環氧樹脂、(B1)具有環狀構造及3個或4個氫硫基之化合物、(B2)不具有環狀構造，且具有2個或3個氫硫基之化合物，及(C)BET比表面積為5m&lt;sup&gt;2&lt;/sup&gt;/g以上之碳酸鈣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1541" publication-number="202615439">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615439</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132577</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於原子層沉積(ALD)應用之第13族金屬化合物</chinese-title>
        <english-title>GROUP 13 METAL COMPOUNDS FOR ALD APPLICATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07F5/00</main-classification>
        <further-classification edition="200601120260102B">C23C16/40</further-classification>
        <further-classification edition="200601120260102B">C23C16/455</further-classification>
        <further-classification edition="200601120260102B">H01L21/02</further-classification>
        <further-classification edition="200601120260102B">H01L21/316</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商馬克專利公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCK PATENT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥　盧卡斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAI, LUKAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬圖里　馬克　馬賽羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATURI, MARK MARCELLO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅爾曼　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEHLMANN, PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海爾　霍格爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEIL, HOLGER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒爾茲　洛雷納　瑪莉艾拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHULZ, LORENA MARIELLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷　簡　盧卡斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WREE, JAN-LUCAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於銦化合物及使用該等化合物作為前體以尤其藉由原子層沉積來沉積含銦膜之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to indium compounds and a method of using these compounds as precursors for deposition of indium-containing films, in particular by atomic layer deposition.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1542" publication-number="202616629">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616629</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132579</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有積體場效電晶體及外部並聯場效電晶體之功率轉換器</chinese-title>
        <english-title>POWER CONVERTER WITH INTEGRATED FIELD-EFFECT TRANSISTORS AND AN EXTERNAL PARALLEL FIELD-EFFECT TRANSISTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H02M3/158</main-classification>
        <further-classification edition="200701120260102B">H02M1/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商思睿邏輯國際半導體有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CIRRUS LOGIC INTERNATIONAL SEMICONDUCTOR LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬魯　西達爾特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARU, SIDDHARTH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬歇斯　以馬內利　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARCHAIS, EMMANUEL A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科斯奧格魯　馬科斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSEOGLOU, MARKOS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>揚科　馬可　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANKO, MARCO A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BO</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥科伊　布萊恩　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCCOY, BRYAN W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿克拉姆　哈斯奈恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKRAM, HASNAIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杰爾戈維克　伊利亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JERGOVIC, ILIJA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥倫森　約翰　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MELANSON, JOHN L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任昌鍾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, CHANGJONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉怡岑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種系統可包含一功率轉換器，其包括：一積體電路，其包括用於該功率轉換器之複數個積體開關；及一外部開關，其在該積體電路外部且電耦合至該複數個積體開關之一第一積體開關。該系統亦可包含一控制器，該控制器電耦合至該複數個積體開關及該外部開關且經組態以控制該等積體開關及該外部開關，包含適時地控制該外部開關以在該功率轉換器之操作期間最小化該積體電路內之功率耗散。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system may include a power converter comprising an integrated circuit comprising a plurality of integrated switches for the power converter and an external switch external to the integrated circuit and electrically coupled to a first integrated switch of the plurality of integrated switches. The system may also include a controller electrically coupled to the plurality of integrated switches and the external switch and configured to control the integrated switches and the external switch, including opportunistically controlling the external switch to minimize power dissipation within the integrated circuit during operation of the power converter.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:升降壓功率轉換器</p>
        <p type="p">101:積體電路</p>
        <p type="p">102:功率電感器</p>
        <p type="p">104:飛馳電容器</p>
        <p type="p">106a:開關</p>
        <p type="p">106b:開關</p>
        <p type="p">106c:開關</p>
        <p type="p">106d:開關</p>
        <p type="p">106e:積體開關</p>
        <p type="p">106f:內部開關/積體開關</p>
        <p type="p">110:輸出電容器</p>
        <p type="p">116:外部開關</p>
        <p type="p">120:控制器</p>
        <p type="p">EN:啟用信號</p>
        <p type="p">GND:接地電壓</p>
        <p type="p">I&lt;sub&gt;DRV&lt;/sub&gt;:電流</p>
        <p type="p">I&lt;sub&gt;L&lt;/sub&gt;:功率電感器電流</p>
        <p type="p">PWM1:切換信號/控制信號</p>
        <p type="p">PWM1′:互補信號</p>
        <p type="p">PWM2:切換信號/控制信號</p>
        <p type="p">PWM2′:互補信號</p>
        <p type="p">PWM3:切換信號/控制信號</p>
        <p type="p">PWM3′:互補信號</p>
        <p type="p">SW1:第一切換節點</p>
        <p type="p">SW2:第二切換節點</p>
        <p type="p">V&lt;sub&gt;IN&lt;/sub&gt;:輸入電壓</p>
        <p type="p">V&lt;sub&gt;OUT&lt;/sub&gt;:輸出電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1543" publication-number="202615017">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615017</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132611</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>５－［３－［［（３Ｒ）－１－乙基－３－哌啶基］胺基］－５－甲基－１，２，４－三－６－基］－２，３－二氫苯并呋喃－４－醇的新穎固體形式</chinese-title>
        <english-title>NEW SOLID FORMS OF 5-[3-[[(3R)-1-ETHYL-3-PIPERIDYL]AMINO]-5-METHYL-1,2,4-TRIAZIN-6-YL]-2,3- DIHYDROBENZOFURAN-4-OL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">A61K31/44</main-classification>
        <further-classification edition="200601120260114B">A61K31/4196</further-classification>
        <further-classification edition="200601120260114B">A61K31/343</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾爾克　安德魯　馬塞爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALKER, ANDRE MARCEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜　卡斯特爾　保琳　瑪麗　西蒙尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DU CASTEL, PAULINE MARIE SIMONE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛羅斯　姍德　凱特婕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GROSSE-SENDER, KATJA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍勒　馬庫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOHLER, MARKUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉克　弗拉維奧　赫伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LACK, FLAVIO HERBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>席尼德　克里斯俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHNIDER, CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史都瓦舍　法蘭克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STOWASSER, FRANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋伯　盧卡　奧利佛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEBER, LUCA OLIVER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供 5-[3-[[(3R)-1-乙基-3-哌啶基]胺基]-5-甲基-1,2,4-三𠯤-6-基]-2,3-二氫苯并呋喃-4-醇的固體形式及其治療用途以及包含該等固體形式的醫藥組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides solid forms of 5-[3-[[(3R)-1-Ethyl-3-piperidyl]amino]-5-methyl-1,2,4-triazin-6-yl]-2,3- dihydrobenzofuran-4-ol, as well as therapeutic uses thereof and pharmaceutical composition comprising them.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1544" publication-number="202615369">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615369</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132614</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有光調變器和溫度調節層的玻璃單元</chinese-title>
        <english-title>GLAZING UNIT WITH LIGHT MODULATOR AND TEMPERATURE REGULATING LAYER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">C03C27/12</main-classification>
        <further-classification edition="200601120260113B">G02F1/061</further-classification>
        <further-classification edition="202101120260113B">G01K7/02</further-classification>
        <further-classification edition="200601120260113B">B32B17/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商艾爾星動力學專利公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELSTAR DYNAMICS PATENTS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯瑪斯　大衛　李察</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THOMAS, DAVID RICHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬薩德　羅馬利克　馬修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASSARD, ROMARIC MATHIEU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飛利浦　文森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHILIPPI, VINCENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一些實施例係關於一種玻璃單元。該玻璃單元包含一光調變器及一液體填充的溫度調節層，該溫度調節層抵靠該光調變器配置，在該光學層外部，且跨該第一或第二基板之表面延伸，該溫度調節層經配置用於冷卻及/或加熱該光調變器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Some embodiments are directed to a glazing unit. The glazing unit includes a light modulator, and a liquid-filled, temperature regulating layer, the temperature regulating layer being arranged against the light modulator, outside of the optical layer, and extending across the surface of the first or second substrate, the temperature regulating layer being arranged for cooling and/or heating of the light modulator.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:光調變器</p>
        <p type="p">111:第一基板</p>
        <p type="p">112:第二基板</p>
        <p type="p">113.1:電極</p>
        <p type="p">113.2:電極</p>
        <p type="p">113.3:電極</p>
        <p type="p">113.4:電極</p>
        <p type="p">114:光學層</p>
        <p type="p">121:第一玻璃基板</p>
        <p type="p">122:第二玻璃基板</p>
        <p type="p">130:溫度調節層</p>
        <p type="p">131:第一基板</p>
        <p type="p">132:第二基板</p>
        <p type="p">140:絕緣層，例如低壓層</p>
        <p type="p">151:光學層間隔件</p>
        <p type="p">152:絕緣層間隔件，例如低壓層間隔件</p>
        <p type="p">153:溫度調節層間隔件</p>
        <p type="p">160:控制器</p>
        <p type="p">161:溫度感測器</p>
        <p type="p">162:外部感測器</p>
        <p type="p">163:內部感測器</p>
        <p type="p">170:熱電元件</p>
        <p type="p">171:散熱器</p>
        <p type="p">173:框架</p>
        <p type="p">191:外部側</p>
        <p type="p">192:內部側</p>
        <p type="p">300:玻璃單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1545" publication-number="202615602">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615602</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132620</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>噴墨墨水組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260102B">C09D11/322</main-classification>
        <further-classification edition="201401120260102B">C09D11/36</further-classification>
        <further-classification edition="200601120260102B">H05B33/12</further-classification>
        <further-classification edition="202301120260102B">H10K50/11</further-classification>
        <further-classification edition="202301120260102B">H10K50/15</further-classification>
        <further-classification edition="202301120260102B">H10K50/16</further-classification>
        <further-classification edition="202301120260102B">H10K50/17</further-classification>
        <further-classification edition="202301120260102B">H10K71/13</further-classification>
        <further-classification edition="202301120260102B">H10K71/15</further-classification>
        <further-classification edition="201101120260102B">B82Y20/00</further-classification>
        <further-classification edition="201101120260102B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商凸版控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOPPAN HOLDINGS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田久保千晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKUBO, CHIHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣田徹也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROTA, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前田忠俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEDA, TADATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川真也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種技術，其能夠有助於提升陰極與陽極之間具有由金屬氧化物奈米粒子所構成之層之發光元件的性能。本實施形態之噴墨墨水組成物包含：金屬氧化物奈米粒子，其係由選自由電洞注入材料、電洞輸送材料及電子輸送材料組成之群組中之材料所構成；與分散介質，其包含二醇系溶劑與漢森溶解度參數的氫鍵項δH為8以上的非醇系溶劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1546" publication-number="202615598">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615598</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132622</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>墨水組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C09D11/00</main-classification>
        <further-classification edition="201401120260102B">C09D11/52</further-classification>
        <further-classification edition="200601120260102B">B41M5/00</further-classification>
        <further-classification edition="200601120260102B">H05B33/14</further-classification>
        <further-classification edition="200601120260102B">H05B33/22</further-classification>
        <further-classification edition="202301120260102B">H10K50/15</further-classification>
        <further-classification edition="202301120260102B">H10K50/16</further-classification>
        <further-classification edition="202301120260102B">H10K50/17</further-classification>
        <further-classification edition="202301120260102B">H10K71/13</further-classification>
        <further-classification edition="202301120260102B">H10K71/15</further-classification>
        <further-classification edition="202301120260102B">H10K85/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商凸版控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOPPAN HOLDINGS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田久保千晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKUBO, CHIHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣田徹也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROTA, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前田忠俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEDA, TADATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種技術，其能夠有助於提升陰極與陽極之間具有由金屬氧化物奈米粒子所構成之層之發光元件的性能。一種墨水組成物，其包含：金屬氧化物奈米粒子，其係由選自由電洞注入材料、電洞輸送材料及電子輸送材料組成之群組中之材料所構成，藉由動態光散射法測定體積基準的累積粒度分布時的95%粒徑(D95)為60nm以下；與分散介質，其包含二醇系溶劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1547" publication-number="202615339">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615339</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132645</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多孔質碳材料及其製造方法、以及燃料電池用觸媒及燃料電池</chinese-title>
        <english-title>POROUS CARBON MATERIAL AND METHOD OF PRODUCING THE SAME, CATALYST FOR FUEL CELL, AND FUEL CELL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260106B">C01B32/19</main-classification>
        <further-classification edition="202101120260106B">C25B11/032</further-classification>
        <further-classification edition="200601120260106B">H01M4/92</further-classification>
        <further-classification edition="200601120260106B">H01M4/96</further-classification>
        <further-classification edition="200601120260106B">B01J21/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本製鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日鐵化學材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON STEEL CHEMICAL &amp; MATERIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小椋拓哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGURA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯島孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IIJIMA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水隆之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於多孔質碳材料及其製造方法、以及燃料電池用觸媒及燃料電池；該多孔質碳材料以BJH(Barrett-Joyner-Halenda)法對氮吸附等溫線進行解析，所求得之令縱軸為dV/d(logD)、橫軸為細孔直徑D之細孔徑長分布中，在細孔直徑2~6nm之範圍具有細孔直徑為10nm以下之區域中dV/d(logD)之最大值的第一高峰，且在細孔直徑20~150nm之範圍具有細孔直徑大於10nm之區域中dV/d(logD)之最大值的第二高峰，細孔直徑2~6nm之細孔容積VD&lt;sub&gt;2-6&lt;/sub&gt;為0.50cm&lt;sup&gt;3&lt;/sup&gt;/g以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1548" publication-number="202615546">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615546</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132655</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性樹脂組合物及硬化浮凸圖案之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08G73/10</main-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/027</further-classification>
        <further-classification edition="200601120260102B">G03F7/031</further-classification>
        <further-classification edition="200601120260102B">G03F7/037</further-classification>
        <further-classification edition="200601120260102B">G03F7/038</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/40</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
        <further-classification edition="200601120260102B">H01L23/29</further-classification>
        <further-classification edition="200601120260102B">H01L23/31</further-classification>
        <further-classification edition="200601120260102B">H01L23/485</further-classification>
        <further-classification edition="200601120260102B">H01L23/532</further-classification>
        <further-classification edition="200601120260102B">H01L23/538</further-classification>
        <further-classification edition="202301120260102B">H01L25/065</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商旭化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水建樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, TAKEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種感光性樹脂組合物、及使用該感光性樹脂組合物製造硬化浮凸圖案之方法，該感光性樹脂組合物能夠製造耐化學品性優異，即使硬化溫度為低溫亦呈現良好之伸長率，與銅配線之密接性良好之硬化浮凸圖案。  &lt;br/&gt;本發明提供一種感光性樹脂組合物，其包含(A)可溶性聚醯亞胺、(B)光聚合起始劑、及(C)有機溶劑，上述(C)有機溶劑中，以上述(C)有機溶劑之總質量為基準，包含40質量%以上之N-乙基-2-吡咯啶酮，且沸點未達140℃之有機溶劑為20質量%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1549" publication-number="202615032">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615032</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132656</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>（３Ｒ）－Ｎ－［２－氰基－４－氟－３－（３－甲基－４－側氧－喹唑啉－６－基）氧基－苯基］－３－氟－吡咯啶－１－磺醯胺之新固體形式</chinese-title>
        <english-title>NEW SOLID FORMS OF (3R)-N-[2-CYANO-4-FLUORO-3-(3-METHYL-4-OXO-QUINAZOLIN-6-YL)OXY-PHENYL]-3-FLUORO-PYRROLIDINE-1-SULFONAMIDE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">A61K31/517</main-classification>
        <further-classification edition="200601120260112B">A61K31/145</further-classification>
        <further-classification edition="200601120260112B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安可曼　丹尼斯　迪莫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENKELMANN, DENNIS DIMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉瑞　賈柯莫　馬可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LARI, GIACOMO MARCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡梅爾西普　托爾斯滕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUMMELSIEP, THORSTEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供 (3R)-N-[2-氰基-4-氟-3-(3-甲基-4-側氧-喹唑啉-6-基)氧基-苯基]-3-氟-吡咯啶-1-磺醯胺之固體形式、其鹽及溶劑合物，以及其治療用途及包含該等固體形式之醫藥組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides solid forms of (3R)-N-[2-cyano-4-fluoro-3-(3-methyl-4-oxo-quinazolin-6-yl)oxy-phenyl]-3-fluoro-pyrrolidine-1-sulfonamide, salts and solvates thereof, as well as therapeutic uses thereof and pharmaceutical compostion comprising them.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1550" publication-number="202615033">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615033</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132663</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氫喹唑啉衍生物和使用其治療疾病或障礙</chinese-title>
        <english-title>HYDROQUINAZOLINE DERIVATIVES AND TREATMENT OF A DISEASE OR DISORDER USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">A61K31/517</main-classification>
        <further-classification edition="200601120260113B">A61K31/426</further-classification>
        <further-classification edition="200601120260113B">A61K31/4155</further-classification>
        <further-classification edition="200601120260113B">A61K31/4025</further-classification>
        <further-classification edition="200601120260113B">A61P9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商諾華公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVARTIS AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安斯特　丹尼艾拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANGST, DANIELA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>保杜克　菲利浦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOLDUC, PHILIPPE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡森　馬修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARSON, MATTHEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　安特巫德　金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEUNG, ATWOOD KIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙珉娥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, MIN A</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達塞尼　韋羅妮克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DARSIGNY, VERONIQUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴　羅伯特　法蘭西斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAY, ROBERT FRANCIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍爾納克　維克多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORNAK, VIKTOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加西亞　塞薩爾　塞巴斯蒂安　韋爾塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARCIA, CESAR SEBASTIAN HUERTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MX</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍立　提摩西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HURLEY, TIMOTHY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>強登茲　凱斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JENDZA, KEITH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嘉兒期　瑞結許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARKI, RAJESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科尼格　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOENIG, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
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              <chinese-name name-type="organization">
                <last-name>拉爾　阿傑　庫馬爾</last-name>
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              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAL, AJAY KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
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          <inventor app-type="applicant" sequence="16">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勒　凱特琳　蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LE, KATHLEEN THI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　綱</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>LIU, GANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>毛　亦正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAO, JUSTIN YIK CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪肯納　傑佛瑞　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCKENNA, JEFFREY M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
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          <inventor app-type="applicant" sequence="20">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米雷迪斯　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEREDITH, ERIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茂木宗人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOGI, MUNETO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          <inventor app-type="applicant" sequence="22">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錢　明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIAN, MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
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          <inventor app-type="applicant" sequence="23">
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              <chinese-name name-type="organization">
                <last-name>阮尼亞　微微克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAUNIYAR, VIVEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>US</english-country>
            </addressbook>
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          <inventor app-type="applicant" sequence="24">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭　當肯　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAW, DUNCAN E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="25">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密斯　特洛伊　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMITH, TROY D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="26">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇　連勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, LIANSHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="27">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帝奇庫勒　利特希　布哈納達斯吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TICHKULE, RITESH BHANUDASJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="28">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　美英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRAN, MY ANH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="29">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪　雙喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHUANGXI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="30">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="31">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙　亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="32">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭　銳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露關於一種具有式 (I) 的結構的化合物：  &lt;br/&gt;&lt;img align="absmiddle" height="186px" width="236px" file="ed10768.JPG" alt="ed10768.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;b&gt;   &lt;/b&gt;&lt;br/&gt;或其藥學上可接受的鹽，其中R&lt;sup&gt;1&lt;/sup&gt;至R&lt;sup&gt;10&lt;/sup&gt;如本文所描述。本文還提供了組成物和使用此類化合物之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure relates to a compound having the structure of Formula (I): &lt;br/&gt;&lt;img align="absmiddle" height="186px" width="266px" file="ed10769.JPG" alt="ed10769.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;b&gt;   &lt;/b&gt;&lt;br/&gt;or a pharmaceutically acceptable salt thereof wherein R&lt;sup&gt;1&lt;/sup&gt; to R&lt;sup&gt;10 &lt;/sup&gt;are as described herein. Also provided herein are compositions and methods of using such compounds.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1551" publication-number="202615476">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615476</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132664</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>DLL3及CD3抗體構築體</chinese-title>
        <english-title>ANTIBODY CONSTRUCTS FOR DLL3 AND CD3</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">C07K16/28</main-classification>
        <further-classification edition="200601120260107B">C07K16/46</further-classification>
        <further-classification edition="200601120260107B">C12N15/63</further-classification>
        <further-classification edition="200601120260107B">C12N5/10</further-classification>
        <further-classification edition="200601120260107B">C12N15/13</further-classification>
        <further-classification edition="200601120260107B">C12P21/08</further-classification>
        <further-classification edition="200601120260107B">A61K39/395</further-classification>
        <further-classification edition="200601120260107B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商安美基研究（慕尼黑）公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMGEN RESEARCH (MUNICH) GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞烏　托拜耳斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAUM, TOBIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫佛　彼德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUFER, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘茲亞雷克　喬恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENDZIALEK, JOCHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布魯梅爾　克勞蒂亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLUEMEL, CLAUDIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達霍夫　克里斯多夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAHLHOFF, CHRISTOPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍夫曼　派翠克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOFFMANN, PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>路特布斯　勞夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUTTERBUESE, RALF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>那爾沃德　伊麗莎貝斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAHRWOLD, ELISABETH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種雙特異性抗體構築體，其包含結合於目標細胞表面上之人類DLL3的第一結合域及結合於T細胞表面上之人類CD3的第二結合域。此外，本發明提供一種編碼該抗體構築體之聚核苷酸、包含該聚核苷酸之載體及經該聚核苷酸或載體轉型或轉染之宿主細胞。此外，本發明提供一種用於產生本發明之抗體構築體的方法、該抗體構築體之醫療用途及包含該抗體構築體之套組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a bispecific antibody construct comprising a first binding domain which binds to human DLL3 on the surface of a target cell and a second binding domain which binds to human CD3 on the surface of a T cell. Moreover, the invention provides a polynucleotide encoding the antibody construct, a vector comprising said polynucleotide and a host cell transformed or transfected with said polynucleotide or vector. Furthermore, the invention provides a process for the production of the antibody construct of the invention, a medical use of said antibody construct and a kit comprising said antibody construct.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1552" publication-number="202615593">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615593</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132676</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>染料混合物及其用於織物染色或印花之用途</chinese-title>
        <english-title>DYE MIXTURES AND THEIR USE FOR THE DYEING OR PRINTING OF FABRICS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C09B67/22</main-classification>
        <further-classification edition="200601120260102B">C09B62/51</further-classification>
        <further-classification edition="200601120260102B">D06P1/384</further-classification>
        <further-classification edition="200601120260102B">D06P3/66</further-classification>
        <further-classification edition="200601120260102B">D06P5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商亞克羅馬(瑞士)有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARCHROMA (SWITZERLAND) GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾爾特　凡尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EHRET, FANNY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩羅德　山托什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SARODE, SANTOSH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛洛席特　珍　克里斯多夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRACIET, JEAN-CHRISTOPHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅特根　喬治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROENTGEN, GEORG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種包含至少三種不同式之染料、視需要選用之至少四種不同式之染料之染料混合物、該染料混合物作為染色劑及/或印花劑之用途、用該染料混合物對織物進行染色之方法、及用該方法可獲得之染色織物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a dye mixture comprising dyes of at least three different formulae, optionally dyes of at least four different formulae, the use of said dye mixture as a dyeing agent and/or printing agent, a method for dyeing a fabric with said dye mixture, and the dyed fabric obtainable with said method.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1553" publication-number="202615034">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615034</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132695</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療疾病或障礙的氫喹唑啉衍生物</chinese-title>
        <english-title>HYDROQUINAZOLINE DERIVATIVES FOR THE TREATMENT OF A DISEASE OR DISORDER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">A61K31/517</main-classification>
        <further-classification edition="200601120260108B">A61K31/44</further-classification>
        <further-classification edition="200601120260108B">A61K31/4155</further-classification>
        <further-classification edition="200601120260108B">A61P9/00</further-classification>
        <further-classification edition="200601120260108B">A61P11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商諾華公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVARTIS AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安斯特　丹尼艾拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANGST, DANIELA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>保杜克　菲利浦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOLDUC, PHILIPPE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡森　馬修　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARSON, MATTHEW WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　安特巫德　金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEUNG, ATWOOD KIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙珉娥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, MIN A</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達塞尼　韋羅妮克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DARSIGNY, VERONIQUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍爾納克　維克多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORNAK, VIKTOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>強登茲　凱斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JENDZA, KEITH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嘉兒期　瑞結許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARKI, RAJESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉爾　阿傑　庫馬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAL, AJAY KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　綱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, GANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬　縛鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, FUPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>毛　亦正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAO, JUSTIN YIK CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="15">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪肯納　傑佛瑞　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCKENNA, JEFFREY M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="16">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米雷迪斯　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEREDITH, ERIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="17">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茂木宗人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOGI, MUNETO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="18">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫諾維屈　勞倫　吉克瑞絲特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONOVICH, LAUREN GILCHRIST</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="19">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮尼亞　微微克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAUNIYAR, VIVEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="20">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密斯　特洛伊　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMITH, TROY D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="21">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇　連勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, LIANSHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="22">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帝奇庫勒　利特希　布哈納達斯吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TICHKULE, RITESH BHANUDASJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="23">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪　雙喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHUANGXI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="24">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="25">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙　亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="26">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭　銳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="27">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周璽琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, XILIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露關於具有式 (I) 的化合物：  &lt;br/&gt;&lt;img align="absmiddle" height="233px" width="312px" file="ed10389.JPG" alt="ed10389.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;或具有式 (II) 的化合物：  &lt;br/&gt;&lt;img align="absmiddle" height="254px" width="283px" file="ed10390.JPG" alt="ed10390.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，  &lt;br/&gt;&lt;br/&gt;或其藥學上可接受的鹽（其中環A、R&lt;sup&gt;a&lt;/sup&gt;至R&lt;sup&gt;c&lt;/sup&gt;、R&lt;sup&gt;1&lt;/sup&gt;至R&lt;sup&gt;6&lt;/sup&gt;、n1、R&lt;sup&gt;10&lt;/sup&gt;至R&lt;sup&gt;60&lt;/sup&gt;和n2係如本文所描述的），以及使用此類化合物的組成物和方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure relates to a compound of Formula (I): &lt;br/&gt;&lt;img align="absmiddle" height="231px" width="298px" file="ed10391.JPG" alt="ed10391.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;or &lt;br/&gt;a compound of Formula (II): &lt;br/&gt;&lt;img align="absmiddle" height="246px" width="287px" file="ed10392.JPG" alt="ed10392.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, &lt;br/&gt;&lt;br/&gt;or a pharmaceutically acceptable salt thereof wherein Ring A, R&lt;sup&gt;a&lt;/sup&gt; to R&lt;sup&gt;c&lt;/sup&gt;,&lt;sup/&gt;R&lt;sup&gt;1&lt;/sup&gt; to R&lt;sup&gt;6&lt;/sup&gt;, n1, R&lt;sup&gt;10&lt;/sup&gt; to R&lt;sup&gt;60&lt;/sup&gt;,&lt;sup/&gt;and n2 are as described herein, as well as compositions and methods of using such compounds.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1554" publication-number="202615049">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615049</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132696</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療疾病或障礙的氫喹唑啉衍生物</chinese-title>
        <english-title>HYDROQUINAZOLINE DERIVATIVES FOR THE TREATMENT OF A DISEASE OR DISORDER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260106B">A61K31/537</main-classification>
        <further-classification edition="200601120260106B">A61K31/498</further-classification>
        <further-classification edition="200601120260106B">A61K31/44</further-classification>
        <further-classification edition="200601120260106B">A61K31/438</further-classification>
        <further-classification edition="200601120260106B">A61K31/4155</further-classification>
        <further-classification edition="200601120260106B">A61P9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商諾華公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVARTIS AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安斯特　丹尼艾拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANGST, DANIELA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>保杜克　菲利浦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOLDUC, PHILIPPE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡森　馬修　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARSON, MATTHEW WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　安特巫德　金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEUNG, ATWOOD KIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙　珉娥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, MIN A</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達塞尼　韋羅妮克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DARSIGNY, VERONIQUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍爾納克　維克多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORNAK, VIKTOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加西亞　塞薩爾　塞巴斯蒂安　韋爾塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARCIA, CESAR SEBASTIAN HUERTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MX</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>強登茲　凱斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JENDZA, KEITH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嘉兒期　瑞結許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARKI, RAJESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉爾　阿傑　庫馬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAL, AJAY KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　綱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, GANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬　縛鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, FUPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="15">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>毛　亦正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAO, JUSTIN YIK CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="16">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪肯納　傑佛瑞　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCKENNA, JEFFREY M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="17">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米雷迪斯　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEREDITH, ERIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="18">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茂木宗人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOGI, MUNETO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="19">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮尼亞　微微克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAUNIYAR, VIVEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="20">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密斯　特洛伊　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMITH, TROY D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="21">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇　連勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, LIANSHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="22">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帝奇庫勒　利特希　布哈納達斯吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TICHKULE, RITESH BHANUDASJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="23">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　美英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRAN, MY ANH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="24">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪　雙喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHUANGXI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="25">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="26">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙　亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="27">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭　銳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露關於具有式 (I) 的化合物：  &lt;br/&gt;&lt;img align="absmiddle" height="226px" width="257px" file="ed10092.JPG" alt="ed10092.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;或其藥學上可接受的鹽（其中R&lt;sup&gt;a&lt;/sup&gt;至R&lt;sup&gt;d&lt;/sup&gt;和R&lt;sup&gt;2&lt;/sup&gt;至R&lt;sup&gt;5&lt;/sup&gt;係如本文所描述的），以及使用此類化合物的組成物和方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure relates to a compound of Formula (I): &lt;br/&gt;&lt;img align="absmiddle" height="229px" width="267px" file="ed10093.JPG" alt="ed10093.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;or a pharmaceutically acceptable salt thereof wherein R&lt;sup&gt;a&lt;/sup&gt; to R&lt;sup&gt;d&lt;/sup&gt;, and R&lt;sup&gt;2&lt;/sup&gt; to R&lt;sup&gt;5&lt;/sup&gt;, are as described herein, as well as compositions and methods of using such compounds.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1555" publication-number="202616615">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616615</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132702</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電能機械能轉換器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H02K1/14</main-classification>
        <further-classification edition="200601120260102B">H02K3/04</further-classification>
        <further-classification edition="200601120260102B">H02K9/19</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商艾力美客股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELEMEC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水谷祐太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUTANI, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電能機械能轉換器，其具有：定子鐵芯20，其多個齒部從基部凸起設置；U相導電管111、112、…及V相導電管121、122、…及W相導電管131、132、…，其等被配置在齒部之間的空間；一側的熱介質流通構件310，其被配置於定子鐵芯20的一側，用以使在U相導電管111、112、…及V相導電管121、122、…及W相導電管131、132、…流動之熱介質不會洩漏至外部；以及另一側的熱介質流通構件320，其被配置於定子鐵芯20的另一側，用以使在U相導電管111、112、…及V相導電管121、122、…及W相導電管131、132、…流動之熱介質不會洩漏至外部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:U相線</p>
        <p type="p">12:V相線</p>
        <p type="p">13:W相線</p>
        <p type="p">20:定子鐵芯</p>
        <p type="p">50:轉子</p>
        <p type="p">111:U相第一導電管</p>
        <p type="p">112:U相第二導電管</p>
        <p type="p">113:U相第三導電管</p>
        <p type="p">114:U相第四導電管</p>
        <p type="p">121:V相第一導電管</p>
        <p type="p">122:V相第二導電管</p>
        <p type="p">123:V相第三導電管</p>
        <p type="p">124:V相第四導電管</p>
        <p type="p">131:W相第一導電管</p>
        <p type="p">132:W相第二導電管</p>
        <p type="p">133:W相第三導電管</p>
        <p type="p">134:W相第四導電管</p>
        <p type="p">211:U相一端側連接器</p>
        <p type="p">221:V相一端側連接器</p>
        <p type="p">231:W相一端側連接器</p>
        <p type="p">240:中性線連接器</p>
        <p type="p">310:熱介質流通構件</p>
        <p type="p">320:熱介質流通構件</p>
        <p type="p">331:第一熱介質流通管</p>
        <p type="p">332:第二熱介質流通管</p>
        <p type="p">2121:U相另一端側第一連接器</p>
        <p type="p">2122:U相另一端側第二連接器</p>
        <p type="p">2221:V相另一端側第一連接器</p>
        <p type="p">2222:V相另一端側第二連接器</p>
        <p type="p">2322:W相另一端側第二連接器</p>
        <p type="p">3100:分隔部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1556" publication-number="202616732">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616732</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132704</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>支援雙轉換增益及雙類比增益讀出的行放大器</chinese-title>
        <english-title>COLUMN AMPLIFIER TO SUPPORT DUAL CONVERSION GAIN AND DUAL ANALOG GAIN READOUT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">H04N25/78</main-classification>
        <further-classification edition="202301120260102B">H04N25/76</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商豪威科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海老原弘知</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBIHARA, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中揭示支援雙轉換增益讀出及雙類比增益讀出之行放大器。在某些實施例中，供在一影像感測器中使用之一個行放大器可包含一輸入節點及輸出節點以及耦合在該輸入節點與該輸出節點之間的一輸入級。該輸入節點可經耦合以自一或多個像素電路接收影像信號。該輸入級可包含一電容器陣列，該電容器陣列包括耦合至該輸入節點之一第一電容器、耦合至該第一電容器之一浮動電壓節點以及耦合在該浮動電壓節點與該輸出節點之間的一第二電容器。該輸入級亦可包含耦合在該浮動電壓節點與該輸出節點之間的一重設開關以及具有耦合至該浮動電壓節點且耦合在該輸出節點與地之間的一閘極端子之一電晶體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Column amplifiers to support dual conversion gain readout and dual analog gain readout are disclosed herein. In some embodiments, a column amplifier for use in an image sensor can include an input node, and output node, and an input stage coupled between the input node and the output node. The input node can be coupled to receive image signals from one or more pixel circuits. The input stage can include a capacitor array comprising a first capacitor coupled to the input node, a floating voltage node coupled to the first capacitor, and a second capacitor coupled between the floating voltage node and the output node. The input stage can also include a reset switch coupled between the floating voltage node and the output node, and a transistor having a gate terminal coupled to the floating voltage node, and coupled between the output node and ground.</p>
      </isu-abst>
      <representative-img>
        <p type="p">302:開關控制信號</p>
        <p type="p">340:行放大器</p>
        <p type="p">341:輸入節點</p>
        <p type="p">342:第一開關</p>
        <p type="p">344:第二開關</p>
        <p type="p">346:第三開關</p>
        <p type="p">347:叠接電晶體</p>
        <p type="p">348:輸出節點</p>
        <p type="p">349:電流源</p>
        <p type="p">350:第一輸入級</p>
        <p type="p">351:第一浮動電壓節點</p>
        <p type="p">352:第一電容器</p>
        <p type="p">354:第一電晶體</p>
        <p type="p">356:第二電容器</p>
        <p type="p">358:第一重設開關</p>
        <p type="p">360:第二輸入級</p>
        <p type="p">361:第二浮動電壓節點</p>
        <p type="p">362:第三電容器</p>
        <p type="p">364:第二電晶體</p>
        <p type="p">366:第四電容器</p>
        <p type="p">368:第二重設開關</p>
        <p type="p">380:第一電容器陣列</p>
        <p type="p">390:第二電容器陣列</p>
        <p type="p">GND:地</p>
        <p type="p">H:高</p>
        <p type="p">L:低</p>
        <p type="p">rst1:重設控制信號/第一重設控制信號/第一輸入級重設信號</p>
        <p type="p">rst2:第二重設控制信號/第二輸入級重設信號</p>
        <p type="p">sel_input:開關控制信號</p>
        <p type="p">V&lt;sub&gt;IN&lt;/sub&gt;:輸入</p>
        <p type="p">V&lt;sub&gt;OUT&lt;/sub&gt;:輸出</p>
        <p type="p">VDD:電壓源</p>
        <p type="p">VF1:第一浮動電壓節點</p>
        <p type="p">VF2:第二浮動電壓節點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1557" publication-number="202615328">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615328</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132725</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>絲線處理裝置</chinese-title>
        <english-title>YARN PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251016B">B65H63/028</main-classification>
        <further-classification edition="200601120251016B">B65H63/032</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＭＴ機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TMT MACHINERY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米倉踏青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEKURA, TOSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小島匠吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOJIMA, SHOGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒木峻平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAKI, SHUMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">導絲器單元的多個導絲器(45)的至少與絲線接觸的部分具有導電性或半導電性。靜電量檢測電路(51)輸出與由於導絲器中產生的靜電而在導絲器中產生的電壓的電壓值相應的信號。在電壓差(Dv)、即從靜電量檢測電路輸出的信號所表示的電壓值與從針對相鄰導絲器設置的靜電量檢測電路輸出的信號所表示的上述電壓值之間的差在閾值(Dva)以下的情況下(S102：是)，控制部(52)輸出表示導絲器中的絲線的狀態為規定狀態的第一信號(S103)。在電壓差大於閾值的情況下(S102：否)，控制部輸出表示導絲器中的絲線的狀態並非規定狀態的第二信號(S104)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In a yarn processing apparatus, the state of each of yarns is accurately detected with a simple structure. Yarn guides 45 of a yarn guide unit are conductive or intermediate-conductive at least at contact portions with yarns. A static electricity quantity detection circuit 51 is configured to output a signal corresponding to a voltage value of voltage generated in each yarn guide 45 by static electricity generated in the yarn guide 45. When a voltage difference Dv between the voltage value indicated by the signal output from the static electricity quantity detection circuit 51 and the voltage value of a signal output from a static electricity quantity detection circuit 51 provided for a neighboring yarn guide 45 is equal to or less than a threshold Dva (S102: YES), a controller 52 outputs a first signal which indicates that the state of the yarn at the yarn guide 45 is a predetermined state (S103). When the voltage difference Dv is above the threshold Dva (S102: NO), the controller 52 outputs a second signal which indicates that the state of the yarn Y at the yarn guide 45 is not the predetermined state (S104).</p>
      </isu-abst>
      <representative-img>
        <p type="p">45:導絲器</p>
        <p type="p">51:靜電量檢測電路(靜電量檢測部)</p>
        <p type="p">52:控制部</p>
        <p type="p">S101~S104:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1558" publication-number="202615327">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615327</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132726</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>絲線處理裝置</chinese-title>
        <english-title>YARN PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251016B">B65H63/02</main-classification>
        <further-classification edition="200601120251016B">B65H63/032</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＭＴ機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TMT MACHINERY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小島匠吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOJIMA, SHOGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米倉踏青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEKURA, TOSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒木峻平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAKI, SHUMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">將油劑塗布到將從紡絲部紡出的多根長絲集束而形成的絲線上的供油引導件至少在與絲線接觸的接觸部分具有導電性或半導電性。靜電量檢測電路輸出與因絲線和供油引導件的接觸而在供油引導件中產生的靜電量對應的信號。在從規定時間之前的時刻到現在為止的期間內、從靜電量檢測電路輸出的信號所表示的靜電量的最大變化量在閾值以下的情況下，控制部輸出表示供油引導件中的絲線的狀態為規定狀態的第一信號。在最大變化量大於閾值的情況下，控制部輸出表示供油引導器中的絲線的狀態並非規定狀態的第二信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In a yarn processing apparatus, the state of a yarn is accurately detected with a simple structure. An oil supply guide 10 configured to apply oil to a yarn formed by binding filaments spun out from a spinning unit is conductive or intermediate-conductive at least at its contact portion with the yarn. A static electricity quantity detection circuit 51 is configured to output a signal corresponding to the quantity of static electricity generated in the oil supply guide 10 due to contact between the yarn and the oil supply guide 10. When the maximum change quantity ΔE of the static electricity quantity indicated the signal output from the static electricity quantity detection circuit 51 during a period from a time point before a predetermined time to the present is equal to or less than a threshold ΔEa (S102: YES), a controller 52 outputs a first signal which indicates that the state of the yarn at the oil supply guide 10 is a predetermined state (S103). When the maximum change quantity ΔE is above the threshold ΔEa (S102: NO), the controller 52 outputs a second signal which indicates that the state of the yarn at the oil supply guide 10 is not the predetermined state (S104).</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:供油引導件</p>
        <p type="p">51:靜電量檢測電路(靜電量檢測部)</p>
        <p type="p">52:控制部</p>
        <p type="p">S101~S104:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1559" publication-number="202615325">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615325</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132727</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>絲線卷取裝置</chinese-title>
        <english-title>YARN WINDING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250905B">B65H51/08</main-classification>
        <further-classification edition="200601120250905B">B65H57/16</further-classification>
        <further-classification edition="200601120250905B">D01D7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＭＴ機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TMT MACHINERY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小島匠吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOJIMA, SHOGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米倉踏青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEKURA, TOSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒木峻平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAKI, SHUMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在橫動導絲器中，引導橫動的絲線的導軌的至少與絲線接觸的接觸部分具有導電性或半導電性。靜電量檢測電路輸出與因絲線和導軌的接觸而在導軌中產生的靜電的靜電量對應的信號。在從規定時間之前的時刻到現在為止的期間內、從靜電量檢測電路輸出的信號所表示的靜電量的最大變化量在閾值以下的情況下，控制部輸出表示導軌中的絲線的狀態為規定狀態的第一信號。在最大變化量大於閾值的情況下，控制部輸出表示導軌中的絲線的狀態並非規定狀態的第二信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In a yarn winding apparatus, the state of a yarn is accurately detected with a simple structure. &lt;br/&gt;In a traverse guide, a guide rail 63 arranged to guide a yarn which is being traversed is conductive or intermediate-conductive at least at a contact portion with the yarn. A static electricity quantity detection circuit 51 outputs a signal corresponding to the quantity of static electricity generated in the guide rail 63 due to the contact between the yarn and the guide rail 63. When the maximum change quantity ΔE of the static electricity quantity indicated the signal output from the static electricity quantity detection circuit 51 during a period from a time point before a predetermined time to the present is equal to or less than a threshold ΔEa (S102: YES), a controller 52 outputs a first signal which indicates that the state of the yarn at the guide rail 63 is a predetermined state (S103). When the maximum change quantity ΔE is above the threshold ΔEa (S102: NO), the controller 52 outputs a second signal which indicates that the state of the yarn at the guide rail 63 is not the predetermined state (S104).</p>
      </isu-abst>
      <representative-img>
        <p type="p">51:靜電量檢測電路(靜電量檢測部)</p>
        <p type="p">52:控制部</p>
        <p type="p">63:導軌</p>
        <p type="p">S101~S104:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1560" publication-number="202615326">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615326</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132728</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>絲線卷取裝置</chinese-title>
        <english-title>YARN WINDING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251016B">B65H51/08</main-classification>
        <further-classification edition="200601120251016B">B65H57/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＭＴ機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TMT MACHINERY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小島匠吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOJIMA, SHOGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米倉踏青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEKURA, TOSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒木峻平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAKI, SHUMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在橫動裝置中，成為橫動支點的支點導絲器(61)的至少與絲線接觸的接觸部分具有導電性或半導電性。靜電量檢測電路(51)輸出與支點導絲器中產生的靜電量對應的信號。在從規定時間之前的時刻到現在為止的期間內、從靜電量檢測電路輸出的信號所表示的靜電量的最大變化量(∆E)在閾值(∆Ea)以下的情況下(S102：是)，控制部(52)輸出表示支點導絲器(10)中的絲線的狀態處於規定狀態的第一信號(S103)。在最大變化量(∆E)大於閾值(∆Ea)的情況下(S102：否)，控制部輸出表示支點導絲器中的絲線並非規定狀態的第二信號(S104)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In a yarn winding apparatus, the state of a yarn is accurately detected with a simple structure. In a traverse device, a fulcrum guide 61 serving as a fulcrum of traversal is conductive or intermediate-conductive at least at a contact portion with a yarn. A static electricity quantity detection circuit 51 outputs a signal corresponding to the quantity of static electricity generated in the fulcrum guide 61. When the maximum change quantity ΔE of the static electricity quantity indicated the signal output from the static electricity quantity detection circuit 51 during a period from a time point before a predetermined time to the present is equal to or less than a threshold ΔEa (S102: YES), a controller 52 outputs a first signal which indicates that the state of the yarn at the fulcrum guide 10 is a predetermined state (S103). When the maximum change quantity ΔE is above the threshold ΔEa (S102: NO), the controller 52 outputs a second signal which indicates that the state of the yarn at the fulcrum guide 61 is not the predetermined state (S104).</p>
      </isu-abst>
      <representative-img>
        <p type="p">51:靜電量檢測電路(靜電量檢測部)</p>
        <p type="p">52:控制部</p>
        <p type="p">61:支點導絲器</p>
        <p type="p">S101~S104:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1561" publication-number="202616647">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616647</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132781</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自偏壓低諧波高效逆D類RF功率放大器電路系統</chinese-title>
        <english-title>SELF-BIASED LOW HARMONICS HIGH-EFFICIENCY INVERSE CLASS-D RF POWER AMPLIFIER CIRCUITRY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H03F3/217</main-classification>
        <further-classification edition="200601120260102B">H03F1/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＱＯＲＶＯ美國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QORVO US, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿特斯　厄多干　奧茲古爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATES, ERDOGAN OZGUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露了功率放大器電路系統，其具有充當一功率放大器之一逆D類放大器以及產生用於該功率放大器內之開關型功率電晶體的閘極偏壓電壓之自偏壓電路系統。該自偏壓電路系統包括一低壓差調節器，該低壓差調節器回應於根據該功率放大器之操作電流縮放的一回饋電流而產生並施加一閘極偏壓電壓。一基於電流之數位/類比轉換器經組態以基於一所接收數位值來產生參考電流。另外，一數位處理器經組態以回應於該閘極偏壓電壓而產生該數位值。該功率放大器電路系統增強了效能及效率，同時確保對功率電晶體操作之精確控制，為需要射頻信號放大之各種應用提供了優勢。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Power amplifier circuitry is disclosed having an inverse Class-D amplifier functioning as a power amplifier and self-biasing circuitry generating gate bias voltages for switching type power transistors within the power amplifier. The self-biasing circuitry includes a low-dropout regulator that generates and applies a gate bias voltage in response to a feedback current scaled according to the power amplifier's operating current. A current-based digital-to-analog converter is configured to generate the reference current based on a received digital value. Additionally, a digital processor is configured to generate the digital value in response to the gate bias voltage. The power amplifier circuitry enhances performance and efficiency while ensuring precise control over power transistors' operation, offering advantages for various applications requiring radio frequency signal amplification.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1562" publication-number="202615458">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615458</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132786</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>癌症標靶胜肽、輸送載體、及醫藥組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">C07K14/78</main-classification>
        <further-classification edition="200601120260115B">A61K38/39</further-classification>
        <further-classification edition="200601120260115B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>進藤敦徳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINDO, ATSUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀江裕樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORIE, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>玉井宏紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMAI, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小島秀人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOJIMA, HIDETO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樫美和子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAGI, MIWAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種與構成癌症的細胞特異性地結合的胜肽、及含有該胜肽的醫藥組成物。本發明提供一種癌症標靶胜肽，含有與癌症細胞結合的胜肽，前述胜肽由與人類蛋白質中之由5～7個胺基酸殘基構成的部分區域相同之胺基酸序列構成，前述人類蛋白質為選自於由細胞外基質構成蛋白質、轉錄控制因子、核內控制因子、訊號傳遞路徑蛋白質、及RNA控制蛋白質構成之群組中之1種以上的蛋白質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1563" publication-number="202616380">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616380</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132791</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理液調整裝置、基板處理裝置及處理液調整方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251230B">H01L21/306</main-classification>
        <further-classification edition="200601120251230B">H01L21/311</further-classification>
        <further-classification edition="200601120251230B">C09K13/04</further-classification>
        <further-classification edition="200601120251230B">G05D23/19</further-classification>
        <further-classification edition="200601120251230B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商芝浦機械電子裝置股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBAURA MECHATRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡田健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKADA, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小山裕貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOYAMA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>望月克則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOCHIDUKI, KATSUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種處理液調整裝置、基板處理裝置及處理液調整方法，其中，可在短時間內獲得溶解有二氧化矽的所期望的溫度的磷酸溶液。實施形態為一種處理液調整裝置，其與基板的處理裝置連接，所述處理液調整裝置具有：新液供給控制部，使處理液供給部向調整箱內供給處理液；二氧化矽供給控制部，使二氧化矽供給部向調整箱內的處理液供給二氧化矽；加熱控制部，讓加熱器使調整箱內的處理液的溫度成為第一溫度；溫度維持控制部，使加熱器將供給有二氧化矽的調整箱內的處理液的溫度維持為第一溫度；以及降溫控制部，使降溫部在利用溫度維持控制部進行的第一溫度的維持之後，將調整箱內的處理液的溫度降溫到比第一溫度低的第二溫度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:處理液調整裝置</p>
        <p type="p">10a:容器</p>
        <p type="p">21:基板處理控制部</p>
        <p type="p">22:處理液供給控制部</p>
        <p type="p">23:處理液補充控制部</p>
        <p type="p">24:新液供給控制部</p>
        <p type="p">25:二氧化矽供給控制部</p>
        <p type="p">26:加熱控制部</p>
        <p type="p">27:溫度維持控制部</p>
        <p type="p">28:降溫控制部</p>
        <p type="p">29:記憶部</p>
        <p type="p">40a:容器</p>
        <p type="p">100:處理裝置</p>
        <p type="p">100a:腔室</p>
        <p type="p">101:旋轉部</p>
        <p type="p">101a:旋轉體</p>
        <p type="p">101b:保持部</p>
        <p type="p">101c:驅動源</p>
        <p type="p">102:供給部</p>
        <p type="p">102a:噴嘴</p>
        <p type="p">102b:臂</p>
        <p type="p">103:回收部</p>
        <p type="p">C:回收配管</p>
        <p type="p">D:降溫部</p>
        <p type="p">E:控制部</p>
        <p type="p">F:過濾器</p>
        <p type="p">FM、SM:流量計</p>
        <p type="p">H:加熱部</p>
        <p type="p">H1~H2:加熱器</p>
        <p type="p">J:處理液供給部</p>
        <p type="p">K:二氧化矽供給部</p>
        <p type="p">P1~P2:泵</p>
        <p type="p">PL:處理液</p>
        <p type="p">R1:返回配管</p>
        <p type="p">R2:新液配管</p>
        <p type="p">R3:添加配管</p>
        <p type="p">S:供給路徑</p>
        <p type="p">S1:供給配管</p>
        <p type="p">S2:送液配管</p>
        <p type="p">SS:基板處理裝置</p>
        <p type="p">T:箱</p>
        <p type="p">T1:供給箱</p>
        <p type="p">T2:調整箱</p>
        <p type="p">TS:溫度傳感器</p>
        <p type="p">V1a、V1b、V2a、V2b、Vz:閥門</p>
        <p type="p">W:基板</p>
        <p type="p">Z:排出路徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1564" publication-number="202614940">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614940</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132802</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>拉鏈之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">A44B19/26</main-classification>
        <further-classification edition="200601120260108B">A44B19/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＹＫＫ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YKK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>広永令</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRONAGA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川優輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新井巧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高松聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAMATSU, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村由香子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, YUKAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠穩定地製造鏈齒排之隱蔽性優異，進而外觀優異之拉鏈之製造方法。  &lt;br/&gt;本發明之拉鏈(1)之製造方法包括：縫製工序(S1)，其於第1及第2鏈齒排(50、60)相互分離之狀態下進行；染色工序(S3)，其於第1及第2鏈齒排(50、60)相互嚙合，且第1拉鏈鏈布(10)與第2拉鏈鏈布(20)重疊之狀態下進行；以及彎折工序(S4)，其於使第1及第2鏈齒排(50、60)相互嚙合時，將第1拉鏈鏈布(10)及第2拉鏈鏈布(20)彎折。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3,5:拉鏈鏈帶</p>
        <p type="p">10:第1拉鏈鏈布</p>
        <p type="p">10a:寬度方向一端部</p>
        <p type="p">11:背面</p>
        <p type="p">13:正面</p>
        <p type="p">20:第2拉鏈鏈布</p>
        <p type="p">20a:寬度方向一端部</p>
        <p type="p">21:背面</p>
        <p type="p">23:正面</p>
        <p type="p">50:第1鏈齒排</p>
        <p type="p">60:第2鏈齒排</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1565" publication-number="202615750">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615750</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132838</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>不織布及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">D04H1/56</main-classification>
        <further-classification edition="201901120260115B">B29C48/00</further-classification>
        <further-classification edition="200601120260115B">D01F8/14</further-classification>
        <further-classification edition="200601120260115B">C08L67/04</further-classification>
        <further-classification edition="200601120260115B">C08L67/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商可樂麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURARAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>八尋謙介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAHIRO, KENSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久保明香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBO, SAYAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>偉士大宗紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIO, MUNEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丸山圭佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARUYAMA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種不織布，其係包含由含有聚酯系樹脂(A)與聚乳酸系聚合物(B)之樹脂組成物所形成之纖維的不織布，前述聚酯系樹脂(A)包含源自於多元醇(a1)之單元與源自於多元羧酸(a2)之單元，前述多元醇(a1)包含具有烷基作為分支鏈之碳數為4以上的脂肪族二醇(a1-1)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1566" publication-number="202615043">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615043</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132850</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>胰島素生長因子－１受體（ＩＧＦ－１Ｒ）抑制劑及其使用方法</chinese-title>
        <english-title>INSULIN GROWTH FACTOR-1 RECEPTOR (IGF-1R) INHIBITORS AND METHODS OF USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">A61K31/53</main-classification>
        <further-classification edition="200601120260113B">A61K31/519</further-classification>
        <further-classification edition="200601120260113B">A61K31/5025</further-classification>
        <further-classification edition="200601120260113B">A61K31/4985</further-classification>
        <further-classification edition="200601120260113B">A61K31/437</further-classification>
        <further-classification edition="200601120260113B">A61P27/00</further-classification>
        <further-classification edition="200601120260113B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商卡提思治療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHARTIS THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍夫曼　羅伯特　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOFFMAN, ROBERT L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法　波利諾　金裘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VA, PORINO JINJO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮曲曼　喬瑟夫　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PINCHMAN, JOSEPH ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞森　約翰　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAWSON, JOHN DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於調節或抑制IGF-1R之化合物、組合物及方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides for compounds, compositions, and methods for modulating or inhibiting IGF-1R.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1567" publication-number="202615094">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615094</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132872</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用莫蘇妥珠單抗與帕羅托珠單抗維多汀組合之皮下給藥治療癌症之方法</chinese-title>
        <english-title>METHODS FOR TREATING CANCER USING SUBCUTANEOUS DOSING OF MOSUNETUZUMAB IN COMBINATION WITH POLATUZUMAB VEDOTIN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K39/395</main-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商建南德克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENENTECH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>圖　艾瑞思　崔恩圖恩甘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TO, IRIS TRANTHUYNGAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王珏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐海爾　卡羅　伊萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>O'HEAR, CAROL ELAINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大木康弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKI, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　松河</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHAM, SONG HA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及治療患有 CD20 陽性細胞增生性病症 (例如，B 細胞增生性病症，諸如非何杰金氏淋巴瘤 (NHL)；例如，侵襲性 NHL 或者復發性及/或難治性 NHL) 的個體。更具體而言，本發明係有關藉由投予莫蘇妥珠單抗及帕羅托珠單抗維多汀之組合來治療患有 B 細胞增生性病症的個體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the treatment of subjects having a CD20-positive cell proliferative disorder (e.g., B cell proliferative disorders, such as a non-Hodgkin’s lymphoma (NHL); e.g., an aggressive NHL or a relapsed and/or refractory NHL). More specifically, the invention pertains to the treatment of subjects having a B cell proliferative disorder by administering a combination of mosunetuzumab and polatuzumab vedotin.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1568" publication-number="202615661">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615661</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132912</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人類免疫球蛋白二元輕鏈轉殖基因構築體及其用途</chinese-title>
        <english-title>HUMAN IMMUNOGLOBULIN BINARY LIGHT CHAIN TRANSGENE CONSTRUCTS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">C12N15/13</main-classification>
        <further-classification edition="200601120260107B">C12N15/63</further-classification>
        <further-classification edition="200601120260107B">C12N15/64</further-classification>
        <further-classification edition="200601120260107B">C07K16/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商基利科學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GILEAD SCIENCES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅爾　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROHRER, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布萊姆斯　彼德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRAMS, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供人類免疫球蛋白輕鏈轉殖基因構築體，其編碼兩種不同的重排輕鏈V-J區，其等係以使兩種交替輕鏈中之一者在B細胞中重組後由構築體表現之方式排列。亦提供包含該轉殖基因之基因轉殖動物。因此，二元輕鏈轉殖基因允許在動物中表現兩種交替固定輕鏈。亦提供使用該等基因轉殖動物之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Human immunoglobulin light chain transgene constructs are provided that encode two different rearranged light chain V-J regions arranged in such a manner that one of the two alternate light chains is expressed from the construct upon recombination in B cells. Transgenic animals comprising the transgene are also provided. The binary light chain transgene thus allows for expression of two alternate fixed light chains in the animals. Methods of using the transgenic animals are also provided.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1569" publication-number="202614995">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614995</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132916</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可離子化脂質</chinese-title>
        <english-title>IONIZABLE LIPIDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260105B">A61K9/1271</main-classification>
        <further-classification edition="200601120260105B">A61K48/00</further-classification>
        <further-classification edition="200601120260105B">A61K31/7088</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比利時商ｅＴｈｅＲＮＡ免疫治療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ETHERNA IMMUNOTHERAPIES NV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡司米　薩巴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASMI, SABAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德科克　史黛芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE KOKER, STEFAAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德　柯恩　魯本</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE COEN, RUBEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明一般而言係關於可離子化（亦稱為陽離子）脂質之領域，且特定而言提供一種如式（I）所示之新型脂質。本發明進一步提供該等脂質之製備方法以及其用途，特定而言係在製備奈米粒子組合物中，更特定而言為包含核酸之奈米粒子組合物中之用途。本發明進一步提供包含基於本文揭露之可離子化脂質之奈米粒子組合物的疫苗調配物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention generally relates to the field of ionizable (also termed cationic) lipids, and in particular provides a novel type of such lipids as represented by formula (I). The present invention further provides methods for making such lipids as well as uses thereof, in particular in the preparation of nanoparticle compositions, more in particular nanoparticle compositions comprising nucleic acids. It further provides vaccine formulations comprising nanoparticle compositions based on the ionizable lipid disclosed herein.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1570" publication-number="202615477">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615477</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132925</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙特異性抗體及其用途</chinese-title>
        <english-title>A BISPECIFIC ANTIBODY AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">C07K16/28</main-classification>
        <further-classification edition="200601120260107B">C07K16/46</further-classification>
        <further-classification edition="200601120260107B">A61K39/395</further-classification>
        <further-classification edition="200601120260107B">C12N15/13</further-classification>
        <further-classification edition="200601120260107B">C12N15/63</further-classification>
        <further-classification edition="200601120260107B">C12N15/64</further-classification>
        <further-classification edition="200601120260107B">A61P37/00</further-classification>
        <further-classification edition="200601120260107B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商伊蘭迪爾實驗室公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EARENDIL LABS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冉昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAN, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱　禎平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, ZHENPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAN, LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供分離的抗原結合蛋白，其包括：第一結合結構域和第二結合結構域，其中該第一結合結構域特異性地結合TNF樣蛋白A(TL1A)，以及該第一結合結構域和該第二結合結構域不同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides an isolated antigen-binding protein, comprising: a first binding domain and a second binding domain, wherein the first binding domain specifically binds to TNF-like protein A (TL1A), and the first binding domain and the second binding domain are different.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1571" publication-number="202615858">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615858</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132945</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>食用動物的溫度推定系統、食用動物的溫度推定程式及食用動物的溫度推定方法</chinese-title>
        <english-title>TEMPERATURE ESTIMATION SYSTEM FOR EDIBLE ANIMALS, TEMPERATURE ESTIMATION PROGRAM FOR EDIBLE ANIMALS, AND TEMPERATURE ESTIMATION METHOD FOR EDIBLE ANIMALS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G01N33/12</main-classification>
        <further-classification edition="200601120260102B">G06F17/17</further-classification>
        <further-classification edition="201601120260102B">A23L13/00</further-classification>
        <further-classification edition="201601120260102B">A23L17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人北海道大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL UNIVERSITY CORPORATION HOKKAIDO UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坪内直人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUBOUCHI, NAOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>篠原祐治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINOHARA, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於適切地進行食用動物之內部的溫度掌握。  &lt;br/&gt;本發明之解決手段為一種鮮度評估系統(1)，係具有可經由網路(N)相互地通訊之試驗套組(100)及伺服器(200)。試驗套組(100)具有偵測器本體(11)及試驗體(20)。偵測器本體(11)將試驗體(20)內之溫度的偵測結果往伺服器(200)傳送。伺服器(200)係保有表示試驗體(20)內的溫度與食用動物之肉品內的溫度之關係之函數的資訊。伺服器(200)根據此資訊與試驗體(20)內之溫度的偵測結果，來推定食用動物之肉品內的溫度。此外，伺服器(200)係根據推定出之溫度，來算出表示食用動物之肉品的鮮度之評估值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An objective of the present invention is to appropriately estimate an internal temperature of an edible animal. &lt;br/&gt;The present invention provides a freshness evaluation system (1) that includes a test kit (100) and a server (200) capable of communicating with each other via a network (N). The test kit (100) includes a detector body (11) and a test body (20). The detector body (11) transmits a detection result of a temperature inside the test body (20) to the server (200). The server (200) stores information indicating a function representing a relationship between the temperature inside the test body (20) and a temperature inside meat of the edible animal. The server (200) estimates the temperature inside the meat of the edible animal based on the information and the detection result of the temperature inside the test body (20). In addition, the server (200) calculates an evaluation value indicating freshness of the meat of the edible animal based on the estimated temperature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:鮮度評估系統</p>
        <p type="p">11:偵測器本體</p>
        <p type="p">12:探針</p>
        <p type="p">20:試驗體</p>
        <p type="p">90:終端</p>
        <p type="p">100:試驗套組</p>
        <p type="p">200:伺服器</p>
        <p type="p">N:網路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1572" publication-number="202615852">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615852</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132950</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>帶電粒子束裝置及其檢查順序算出方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120251001B">G01N23/2251</main-classification>
        <further-classification edition="200601120251001B">G01N21/896</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立全球先端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡辺大輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高田哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKADA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>磨
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAN, NAOMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三次将太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUGI, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大津賀一雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUGA, KAZUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷內一史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YACHI, KAZUFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>君平太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMIZUKA, HEITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">帶電粒子束裝置(100)，係對試料照射帶電粒子束，基於因照射的帶電粒子束(EB)而生成的二次帶電粒子來生成圖像而進行試料的觀察。帶電粒子束裝置(100)，具備帶電粒子束照射光學系統(200)、及控制帶電粒子束照射光學系統(200)的電腦系統(212)。電腦系統(212)，以對複數個檢查部位當中的任意的檢查部位照射的帶電粒子束不會對接下來檢查的檢查部位造成電性的影響之方式，算出對檢查部位照射帶電粒子束之檢查順序，而以算出的檢查順序對複數個檢查部位依序照射帶電粒子束。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:帶電粒子束裝置</p>
        <p type="p">200:本體</p>
        <p type="p">201:帶電粒子槍</p>
        <p type="p">202:聚光透鏡</p>
        <p type="p">203:脈波調變器</p>
        <p type="p">204:光圈</p>
        <p type="p">205:偏向器</p>
        <p type="p">206:對物透鏡</p>
        <p type="p">207:試料</p>
        <p type="p">208:平台</p>
        <p type="p">209:檢測器</p>
        <p type="p">210:控制器</p>
        <p type="p">211a:顯示元件</p>
        <p type="p">211b:輸入元件</p>
        <p type="p">212:電腦系統</p>
        <p type="p">212a:資料庫</p>
        <p type="p">214:雷射光源</p>
        <p type="p">215:遮斷器</p>
        <p type="p">216:雷射光路調整裝置</p>
        <p type="p">217:雷射光照射裝置</p>
        <p type="p">304:演算器</p>
        <p type="p">EB:電子束</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1573" publication-number="202615588">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615588</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132961</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>膜、半導體封裝</chinese-title>
        <english-title>FILM, SEMICONDUCTOR PACKAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C08L83/14</main-classification>
        <further-classification edition="200601120260105B">C08G77/52</further-classification>
        <further-classification edition="200601120260105B">C08J5/22</further-classification>
        <further-classification edition="200601120260105B">C08F2/50</further-classification>
        <further-classification edition="200601120260105B">B32B27/28</further-classification>
        <further-classification edition="200601120260105B">G01F1/716</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>
                </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林大介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>相見敬太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIMI, KEITARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豊岡健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOOKA, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種線膨脹係數低的膜。本發明的膜為包含有機聚矽氧烷之膜，其中，針對膜，藉由固體NMR的CPMG法測定室溫下的所有質子的自旋間弛豫的自由感應衰減的訊號強度，使用訊號強度藉由式（I）進行擬合處理，並且以弛豫時間由短至長的順序，成分A、成分B及成分C這3個成分中的成分C的弛豫時間T&lt;sub&gt;2c&lt;/sub&gt;為2.0毫秒以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1574" publication-number="202616171">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616171</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132962</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用視覺標記的標籤調查</chinese-title>
        <english-title>TAG SURVEY USING VISUAL MARKERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">G06Q10/087</main-classification>
        <further-classification edition="202201120260102B">G06V20/62</further-classification>
        <further-classification edition="200601120260102B">G06K19/07</further-classification>
        <further-classification edition="201701120260102B">G06T7/73</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾倫　托馬斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALLAN, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普拉薩德　阿比舍克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRASAD, ABHISHEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉婷婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TINGTING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯瑪斯　喬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THOMAS, JOE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述用於調查裝置的系統及技術。例如，一設備可在至少一個攝影機感測器沿著一路徑行進時從該至少一個攝影機感測器獲得包含複數個裝置的複數個影像。各影像係從該至少一個攝影機感測器沿著該路徑的一各別位置獲得。該複數個裝置中之各裝置包括一各別視覺標記。該設備可偵測該複數個影像中之該複數個裝置的視覺標記，並可判定在該複數個影像中偵測到之該等視覺標記的一配置。該設備基於將該等視覺標記的該配置與包含複數個物體的一對應配置的一第一映射對準，將該複數個物體中之一各別物體與該複數個裝置中之各裝置配對。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and techniques are described for surveying devices. For example, an apparatus can obtain, from at least one camera sensor while the at least one camera sensor is traveling along a path, a plurality of images comprising a plurality of devices. Each image is obtained from a respective position of the at least one camera sensor along the path. Each device of the plurality of devices includes a respective visual marker. The apparatus can detect visual markers of the plurality of devices in the plurality of images and can determine an arrangement of the visual markers detected in the plurality of images. The apparatus can pair, based on aligning the arrangement of the visual markers with a first map comprising a corresponding arrangement of a plurality of objects, a respective object of the plurality of objects to each device of the plurality of devices.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:實例</p>
        <p type="p">610:系統</p>
        <p type="p">620:視覺標記</p>
        <p type="p">630:商店布局</p>
        <p type="p">640:貨架圖</p>
        <p type="p">650:標籤ID至產品映射</p>
        <p type="p">660:標籤位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1575" publication-number="202615274">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615274</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132970</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>收折裝置和嬰兒車</chinese-title>
        <english-title>FOLDING DEVICE AND STROLLER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">B60N2/28</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳海濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HAITAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及一種收折裝置和嬰兒車。該收折裝置包括樞轉關節機構、旋轉座、鎖定組件，樞轉關節機構具有驅動件並可在展開狀態和收折狀態之間切換，旋轉座與樞轉關節機構樞接並用於與一連接組件連接，旋轉座具有受驅部，鎖定組件與樞轉關節機構和旋轉座中的至少一者可移動地連接，且鎖定組件具有鎖定位置和釋鎖位置，當樞轉關節機構從展開狀態切換至收折狀態時，樞轉關節機構驅動鎖定組件從鎖定位置移動至釋鎖位置，且鎖定組件位於釋鎖位置時，驅動件驅動受驅部移動，使得旋轉座相對於樞轉關節機構朝第一旋轉方向轉動。該收折裝置從展開狀態切換至收折狀態時可帶動旋轉座單向轉動，能自動地完成進一步的收折，提升操作便利程度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application relates to a folding device and a stroller. The folding device includes a pivot joint mechanism, a rotating base, and a locking assembly. The pivot joint mechanism is provided with a driving member and is switchable between an unfolded state and a folded state. The rotating base is pivotally connected to the pivot joint mechanism and configured to be connected to a connecting assembly. The rotating base is provided with a driven portion. The locking assembly is movably connected to at least one of the pivot joint mechanism and the rotating base. The locking assembly has a locking position and an unlocking position. When the pivot joint mechanism switches from the unfolded state to the folded state, the pivot joint mechanism drives the locking assembly to move from the locking position to the unlocking position, and when the locking assembly is in the unlocking position, the driving member drives the driven portion to move to cause the rotating base to rotate relative to the pivot joint mechanism in a first rotating direction. When the folding device switches from an unfolded state to a folded state, the rotating base can be driven to rotate unidirectionally, and further folding can be automatically completed, thus improving operation convenience.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:第一連接座</p>
        <p type="p">111:驅動件</p>
        <p type="p">1111:第一彈性件</p>
        <p type="p">1112:驅動塊</p>
        <p type="p">112:第一座體</p>
        <p type="p">113:第一連接臂</p>
        <p type="p">114:第三座體</p>
        <p type="p">120:旋轉座</p>
        <p type="p">130:第二連接座</p>
        <p type="p">131:第二座體</p>
        <p type="p">1311:第二斜面</p>
        <p type="p">132:第二連接臂</p>
        <p type="p">140:樞接軸</p>
        <p type="p">141:第二彈性件</p>
        <p type="p">150:鎖定組件</p>
        <p type="p">151:移動件</p>
        <p type="p">152:鎖定件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1576" publication-number="202616877">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616877</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132976</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於U形垂直電極的裝置、系統與方法</chinese-title>
        <english-title>DEVICE, SYSTEM AND METHODS FOR U-SHAPED VERTICAL ELECTRODE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260102B">H10D64/20</main-classification>
        <further-classification edition="202501120260102B">H10D88/00</further-classification>
        <further-classification edition="202501120260102B">H10D89/10</further-classification>
        <further-classification edition="202301120260102B">H10B80/00</further-classification>
        <further-classification edition="200601120260102B">G11C7/18</further-classification>
        <further-classification edition="200601120260102B">H01L21/76</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴素賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SOHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金烔完</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DONGWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金炳哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, BYEUNG CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭露一種用於U形垂直電極的方法、裝置和系統，包括第一電極，第一電極具有第一電極段、第二電極段、以及第三電極段。第一電極段可耦合至第二電極段，以及第二電極段可耦合至第三電極段。第二電極可平行於第一電極延伸。第一介電材料可在第一電極段和第三電極段之間。第三電極可接觸第一電極，以及第三電極可在與第一電極正交的方向延伸。第一電極段可平行於第三電極段延伸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are methods, devices and systems for a U-shaped vertical electrode, including a first electrode, the first electrode having a first electrode segment, a second electrode segment, and a third electrode segment. The first electrode segment may be coupled to the second electrode segment, and the second electrode segment may be coupled to the third electrode segment. A second electrode may extend parallel to the first electrode. A first dielectric material may be between the first electrode segment and the third electrode segment. A third electrode may contact the first electrode, and the third electrode may extend in a direction orthogonal to the first electrode. The first electrode segment may extend parallel to the third electrode segment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:第一裝置架構</p>
        <p type="p">101:基底</p>
        <p type="p">102:電晶體</p>
        <p type="p">103:電極間隔離層</p>
        <p type="p">104:左側胞元電極</p>
        <p type="p">105:左側隔離層</p>
        <p type="p">106:第一介電材料</p>
        <p type="p">107:基底隔離層</p>
        <p type="p">108:第二介電材料</p>
        <p type="p">109:底部電極段</p>
        <p type="p">110:垂直電極</p>
        <p type="p">111:第一垂直電極段</p>
        <p type="p">113:第二垂直電極段</p>
        <p type="p">114:右側胞元電極</p>
        <p type="p">115:右側隔離層</p>
        <p type="p">116:水平電極</p>
        <p type="p">120:個別裝置層</p>
        <p type="p">122:汲極區</p>
        <p type="p">130:胞元電極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1577" publication-number="202616867">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616867</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133019</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路裝置及其製造方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT DEVICES AND METHODS OF FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251204B">H10D62/10</main-classification>
        <further-classification edition="202501120251204B">H10D64/20</further-classification>
        <further-classification edition="202501120251204B">H10D88/00</further-classification>
        <further-classification edition="200601120251204B">H01L21/764</further-classification>
        <further-classification edition="200601120251204B">B82B1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙南奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, EDWARD NAMKYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴起丙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, KIBYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴範璡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, BEOMJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張相信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, SANGSHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　康一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, KANG-ILL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">積體電路裝置包括電晶體結構，電晶體結構具有在第一方向上於源極/汲極區之間延伸並與一個或多個閘極圖案交替堆疊的一個或多個通道圖案。中空內部間隔件設置於一個或多個閘極圖案和源極/汲極區之間。中空內部間隔件包括：在第一方向上一個或多個閘極圖案的側表面和源極/汲極區的第一側表面之間的相應空隙，以及在一個或多個閘極圖案的側表面上和源極/汲極區的第一側表面上的第一襯裡。相關製造方法亦被討論。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated circuit device includes a transistor structure having one or more channel patterns that extend between source/drain regions in a first direction and are alternately stacked with one or more gate patterns. Hollow inner spacers are provided between the one or more gate patterns and the source/drain regions. The hollow inner spacers include respective voids between side surfaces of the one or more gate patterns and first side surfaces of the source/drain regions in the first direction, and a first liner on the side surfaces of the one or more gate patterns and on the first side surfaces of the source/drain regions. Related fabrication methods are also discussed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:閘極圖案</p>
        <p type="p">102s:側表面</p>
        <p type="p">106:閘極絕緣層/閘極絕緣體</p>
        <p type="p">108:源極/汲極區</p>
        <p type="p">108s1:第一側表面/側表面</p>
        <p type="p">108s2:第二側表面/側表面</p>
        <p type="p">110:中空內部間隔件</p>
        <p type="p">111,112:絕緣襯裡/襯裡</p>
        <p type="p">111p,P:部分</p>
        <p type="p">114:空隙/氣穴</p>
        <p type="p">118:隔離圖案</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">TS:電晶體結構</p>
        <p type="p">X1-X1,X2-X2:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1578" publication-number="202616230">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616230</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133036</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>事件辨識系統、機器人系統、事件辨識方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260102B">G06V40/20</main-classification>
        <further-classification edition="202201120260102B">G06V10/82</further-classification>
        <further-classification edition="200601120260102B">B25J13/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人九州工業大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYUSHU INSTITUTE OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>櫻井直人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKURAI, NAOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>内田圭祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UCHIDA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑原大幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUWABARA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田向権</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMUKOH, HAKARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤野友彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJINO, TOMOAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森江隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIE, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中悠一朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, YUICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之事件辨識系統包含：攝像部、自攝像資料擷取時間性且空間性特徵之濾波部、第1處理部、第2處理部、及控制部。於第1模式下，第1處理部使用第1神經網路來處理與由濾波部擷取到之特徵對應之資料，控制部基於自第1神經網路之輸出來判定是否發生規定之事件，於判定為發生事件時啟動第2模式。於第2模式下，第2處理部使用第2神經網路來處理攝像資料，控制部基於自第2神經網路之輸出而辨識事件之詳情。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:機器人系統</p>
        <p type="p">2:事件辨識系統</p>
        <p type="p">3:機器人</p>
        <p type="p">11:攝像部</p>
        <p type="p">12:濾波部</p>
        <p type="p">13:前處理部</p>
        <p type="p">14:第1處理部</p>
        <p type="p">15:第2處理部</p>
        <p type="p">16:控制部</p>
        <p type="p">17:基板</p>
        <p type="p">18:電路部</p>
        <p type="p">21:第1影像感測器(第1二維感測器、第1攝像部、影像感測器)</p>
        <p type="p">22:第2影像感測器(第2二維感測器、第2攝像部)</p>
        <p type="p">23:受光透鏡</p>
        <p type="p">24:受光透鏡</p>
        <p type="p">OJ:對象物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1579" publication-number="202615744">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615744</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133038</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱塑性纖維的低溫穩定化</chinese-title>
        <english-title>LOW TEMPERATURE STABILIZATION OF THERMOPLASTIC FIBERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">D01F9/12</main-classification>
        <further-classification edition="200601120260115B">D01F9/145</further-classification>
        <further-classification edition="200601120260115B">D01D5/08</further-classification>
        <further-classification edition="200601120260115B">B01J15/00</further-classification>
        <further-classification edition="200601120260115B">C01B21/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商線程創新有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THREAD INNOVATIONS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　衛星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEIXING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種處理由諸如瀝青質基前驅物材料的熱塑性前驅物製成的生纖維的低溫方法，包括將生纖維於低於約200°C的溫度下暴露於含NO&lt;sub&gt;2&lt;/sub&gt;的氣體混合物，以生產穩定化生纖維。穩定化生纖維可在含氧環境中於高於約200°C的溫度下進一步穩定化。穩定化生纖維隨後可碳化以生產碳纖維。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A low-temperature process of processing green fibers fabricated from thermoplastic precursors such as asphaltenes-based precursor material includes the step of exposing the green fibers to an NO&lt;sub&gt;2&lt;/sub&gt;-containing gas mixture, at a temperature less than about 200° C to produce stabilized green fibers. The stabilized green fibers may be further stabilized at a temperature greater than 200° C in an oxygen-containing environment. Stabilized green fibers may then be carbonized to produce carbon fiber.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1580" publication-number="202616258">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616258</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133050</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資料驅動電路、其驅動方法及包含資料驅動電路之顯示裝置</chinese-title>
        <english-title>DATA DRIVING CIRCUIT, DRIVING METHOD OF DATA DRIVING CIRCUIT, AND DISPLAY DEVICE INCLUDING DATA DRIVING CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250912B">G09G3/3208</main-classification>
        <further-classification edition="201601120250912B">G09G3/3275</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金範陳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, BEOM-JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露實施例關於一種資料驅動電路、其驅動方法及包含其之顯示裝置，這種資料驅動電路包含：控制電路，透過讀出線路電性連接至像素中之感測節點；多工器，其包含連接至該讀出線路及控制電路之輸入端，並被配置為基於選擇訊號將讀出線路或控制電路電性連接至其輸出端；及類比數位轉換器，電性連接至多工器之輸出端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The embodiments relate to a data driving circuit, a driving method for driving the data driving circuit, and a display device including the data driving circuit, wherein the data driving circuit includes a control circuit electrically connected to a sensing node in a pixel through a readout line, a multiplexer including an input terminal connected to the readout line and the control circuit, and configured to electrically connect either the readout line or the control circuit to an output terminal thereof based on a selection signal, and an analog-to-digital converter electrically connected to the output terminal of the multiplexer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:顯示裝置</p>
        <p type="p">10:時序控制器</p>
        <p type="p">20:閘極驅動電路</p>
        <p type="p">30:資料驅動電路</p>
        <p type="p">40:電源供應單元</p>
        <p type="p">50:顯示面板</p>
        <p type="p">CS:控制訊號</p>
        <p type="p">DCS:資料驅動控制訊號</p>
        <p type="p">GCS:閘極驅動控制訊號</p>
        <p type="p">DATA:影像資料</p>
        <p type="p">PL1,PL2:電源線</p>
        <p type="p">PX:像素</p>
        <p type="p">RVL:讀出線路</p>
        <p type="p">DL:資料線</p>
        <p type="p">GL:閘極線</p>
        <p type="p">ELVDD,ELVSS:驅動電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1581" publication-number="202616929">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616929</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133056</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含電源供應線之顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE INCLUDING POWER SUPPLY LINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251014B">H10H29/39</main-classification>
        <further-classification edition="202501120251014B">H10H29/37</further-classification>
        <further-classification edition="202301120251014B">H10K59/123</further-classification>
        <further-classification edition="202301120251014B">H10K59/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裵賢稷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, HYUN-JIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高仁台</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, INTAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置包含：顯示面板，具有顯示區域及位於顯示區域周邊之非顯示區域；多條閘極線及多條資料線，位於顯示區域中，該些閘極線及該些資料線彼此交叉以限定多個子像素；像素電路單元，位於該些子像素之每一者中；輔助電路單元，位於非顯示區域中；及至少一條電源供應線，位於非顯示區域中並與輔助電路單元重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device includes: a display panel having a display area and a non-display area at a periphery of the display area; a plurality of gate lines and a plurality of data lines in the display area, the plurality of gate lines and the plurality of data lines crossing each other to define a plurality of subpixels; a pixel circuit unit in each of the plurality of subpixels; an auxiliary circuit unit in the non-display area; and at least one power supply line in the non-display area and overlapping the auxiliary circuit unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">130:基板</p>
        <p type="p">132:光遮蔽圖案</p>
        <p type="p">134:第一緩衝層</p>
        <p type="p">136:半導體層</p>
        <p type="p">138:閘極絕緣層</p>
        <p type="p">140:閘極電極</p>
        <p type="p">142:第一電容器電極</p>
        <p type="p">144:第一層間絕緣層</p>
        <p type="p">146:第二電容器電極</p>
        <p type="p">148:第二層間絕緣層</p>
        <p type="p">150:源極電極</p>
        <p type="p">152:汲極電極</p>
        <p type="p">154:平坦化層</p>
        <p type="p">156:第一電極</p>
        <p type="p">158:堤層</p>
        <p type="p">160:發光層</p>
        <p type="p">164:第二電極</p>
        <p type="p">166:第一封裝層</p>
        <p type="p">168:第二封裝層</p>
        <p type="p">170:第三封裝層</p>
        <p type="p">172:第二緩衝層</p>
        <p type="p">174:橋接圖案</p>
        <p type="p">178:感測圖案</p>
        <p type="p">SP1:第一子像素</p>
        <p type="p">SP2:第二子像素</p>
        <p type="p">SP3:第三子像素</p>
        <p type="p">SP4:第四子像素</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1582" publication-number="202615745">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615745</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133057</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>萃取過濾器用織物及萃取過濾器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">D03D1/00</main-classification>
        <further-classification edition="202101120260114B">D03D15/60</further-classification>
        <further-classification edition="200601120260114B">B01D39/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松木洋介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUKI, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木藤雅文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITO, MASAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高田裕一朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKADA, YUICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">作成一種萃取過濾器用織物，其係過濾器用的織物，包含織物的經紗或緯紗之至少一者中所含有的複絲及與複絲正交的單絲，複絲的總纖度(T1)為80dtex以上，單絲的總纖度(T2)為40dtex以下，複絲的總纖度(T1)與前述單絲的總纖度(T2)之比值(T1/T2)為2.0～5.0，用以提供一種具有更有效地補獲咖啡等之萃取中的微細粉末渣且更能使液體透過的萃取性能，還有便宜而亦可用後即丟棄的萃取過濾器用織物及萃取過濾器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:最大單紗間距離(L)</p>
        <p type="p">2:織物中的緯紗複絲</p>
        <p type="p">3:織物中的經紗單絲</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1583" publication-number="202615877">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615877</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133067</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>裝置、方法及記錄媒體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251230B">G01R23/16</main-classification>
        <further-classification edition="200601120251230B">G01R23/02</further-classification>
        <further-classification edition="200601120251230B">G06F17/14</further-classification>
        <further-classification edition="200601120251230B">G06F17/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商愛德萬測試股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANTEST CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊池良典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, YOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>櫻井孝夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKURAI, TAKAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋信孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, NOBUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種裝置，具備：取得部，取得被測量訊號的頻率頻譜；檢測部，檢測頻率頻譜中的峰值分格；設定部，決定相對於與峰值分格相當的被測量訊號的峰值分格頻率依序偏移的複數個假設頻率，並設定會使得測量該假設頻率的訊號時的頻率頻譜的峰值成為峰值分格的取樣頻率；及決定部，基於以設定的取樣頻率對被測量訊號進行測量的測量結果，決定被測量訊號的頻率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:系統</p>
        <p type="p">100:訊號產生器</p>
        <p type="p">110:測量裝置</p>
        <p type="p">120:取得部</p>
        <p type="p">130:檢測部</p>
        <p type="p">140:設定部</p>
        <p type="p">150:決定部</p>
        <p type="p">160:輸出部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1584" publication-number="202615542">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615542</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133070</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱塑性樹脂及光學構件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08G63/64</main-classification>
        <further-classification edition="200601120260102B">G02B1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商帝人股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEIJIN LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松尾尚紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUO, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大山達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOYAMA, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小笠原一良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGASAWARA, KAZUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石原義弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIHARA, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布目和徳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUNOME, KAZUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的為提供高折射率且θgF低之熱塑性樹脂。  &lt;br/&gt;　　本揭示之熱塑性樹脂係於全單位中包含50mol%以上之立體構造系成分單位，前述立體構造系成分單位包含4個以上之選自由單環式芳香族基及縮合多環式芳香族基所成之群組中之芳香族基，或包含2個以上之縮合多環式芳香族基，於20℃測定之波長587.56nm的折射率nd為1.6873以上，且部分分散比θgF為0.685以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1585" publication-number="202616766">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616766</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133091</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>針對按需系統資訊的下行鏈路控制通道監測時機組態</chinese-title>
        <english-title>DOWNLINK CONTROL CHANNEL MONITORING OCCASION CONFIGURATION FOR ON-DEMAND SYSTEM INFORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120251201B">H04W76/10</main-classification>
        <further-classification edition="201801120251201B">H04W76/27</further-classification>
        <further-classification edition="201801120251201B">H04W76/20</further-classification>
        <further-classification edition="202301120251201B">H04W72/04</further-classification>
        <further-classification edition="200901120251201B">H04W52/02</further-classification>
        <further-classification edition="200901120251201B">H04W74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅　江宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, JIANGHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿貝迪尼　納維德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABEDINI, NAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　宏丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LY, HUNG DINH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述用於無線通訊的方法、系統、及裝置。一種使用者設備(UE)可接收針對由一上行鏈路喚醒信號(WUS)觸發的按需系統資訊區塊1 (SIB1)的一WUS組態的一指示。該UE可在一隨機存取回應(random access response, RAR)視窗期間基於該上行鏈路喚醒信號來接收一RAR訊息。該UE可在一實體下行鏈路控制通道(physical downlink control channel, PDCCH)視窗期間監測一或多個按需SIB。在一些實例中，該上行鏈路WUS組態或該RAR訊息可指示該PDCCH視窗的一起始時間及持續時間。在一些實例中，一網路實體可使用時槽聚合以傳輸重複的按需SIB1。該RAR訊息或該上行鏈路WUS組態可指示一時槽聚合參數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods, systems, and devices for wireless communications are described. A user equipment (UE) may receive an indication of an uplink wake up signal (WUS) configuration for on-demand system information block 1 (SIB1) triggered by a WUS. The UE may receive, during a random access response (RAR) window, an RAR message based on the uplink wake up signal. The UE may monitor for one or more on-demand SIBs during a physical downlink control channel (PDCCH) window. In some examples, the uplink WUS configuration or the RAR message may indicate a start time and duration of the PDCCH window. In some examples, a network entity may use slot aggregation to transmit repeated on-demand SIB1s. The RAR message or the uplink WUS configuration may indicate a slot aggregation parameter.</p>
      </isu-abst>
      <representative-img>
        <p type="p">105-a:網路實體</p>
        <p type="p">115-a:UE</p>
        <p type="p">200:無線通訊系統</p>
        <p type="p">205:上行鏈路WUS組態</p>
        <p type="p">210:上行鏈路WUS</p>
        <p type="p">210-a,210-b:WUS</p>
        <p type="p">215:RAR訊息</p>
        <p type="p">215-a:第一RAR訊息</p>
        <p type="p">215-b:第二RAR訊息</p>
        <p type="p">220:SIB1</p>
        <p type="p">225-a,225-b:RAR視窗</p>
        <p type="p">230-a,230-b:時間偏移</p>
        <p type="p">235-a:第一UE側PDCCH視窗</p>
        <p type="p">235-b:第二UE側PDCCH視窗</p>
        <p type="p">240:網路側PDCCH視窗</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1586" publication-number="202615231">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615231</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133115</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>囊體切割裝置</chinese-title>
        <english-title>CUTTING DEVICE FOR CAPSULES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251128B">B26D1/02</main-classification>
        <further-classification edition="200601120251128B">B26D3/08</further-classification>
        <further-classification edition="200601120251128B">B26D7/06</further-classification>
        <further-classification edition="200601120251128B">B26D7/01</further-classification>
        <further-classification edition="200601120251128B">B26F1/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商沙克米機械商業合作艾莫勒精簡公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SACMI COOPERATIVA MECCANICI IMOLA SOCIETA' COOPERATIVA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫圖里尼　馬蒂歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VENTURINI, MATTEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘納利　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENAZZI, DAVIDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開一種用於切割用於封閉容器的系拴型囊體的裝置，其中所述切割裝置包括：第一組水平刀片，其彼此共面；第二組水平刀片，其彼此共面且與所述第一組中的所述水平刀片豎直地間隔開；及一組橫向刀片，其佈置成用於將所述水平刀片接合在一起以便在防拆封帶與所述囊體的側壁之間產生兩個連接綁帶，以及另一橫向刀片，所述橫向刀片在一側上終止於所述水平刀片中的一個的中間點且在相對側上終止於自由點，即，不鄰近於任何刀片，使得藉由這一另一橫向刀片產生的橫向凹槽以由囊體的註定不會斷裂的部分完全環繞的端結束。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device for cutting a capsule of tethered type for closing a container is disclosed, in which the cutting device comprises a first set of horizontal blades that are coplanar with each other, a second set of horizontal blades that are coplanar with each other and spaced vertically apart from the horizontal blades of the first set, and a set of transverse blades arranged for joining together the horizontal blades so as to make two connecting straps between a tamper-evident band and a side wall of the capsule, in addition to another transverse blade that on one side terminates in an intermediate point of one of the horizontal blades and on the opposite side terminates in a free point, i.e. not adjacent to any blade, so that a transverse notch made by this other transverse blade ends with an end completely surrounded by a portion of capsules that is not destined to be broken.</p>
      </isu-abst>
      <representative-img>
        <p type="p">4:第一水平刀片</p>
        <p type="p">5:第二水平刀片</p>
        <p type="p">6:第三水平刀片</p>
        <p type="p">7:第四水平刀片</p>
        <p type="p">8:第五水平刀片</p>
        <p type="p">9:第六水平刀片</p>
        <p type="p">10:第七水平刀片</p>
        <p type="p">11:第一橫向刀片</p>
        <p type="p">12:第二橫向刀片</p>
        <p type="p">13:第三橫向刀片</p>
        <p type="p">14:第四橫向刀片</p>
        <p type="p">15:第五橫向刀片</p>
        <p type="p">18:第一板</p>
        <p type="p">19:第二板</p>
        <p type="p">20:第三板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1587" publication-number="202616079">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616079</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133120</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有漏液檢測之冷卻系統</chinese-title>
        <english-title>COOLING SYSTEM WITH LEAKAGE DETECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G06F11/32</main-classification>
        <further-classification edition="200601120260102B">G01M3/02</further-classification>
        <further-classification edition="200601120260102B">G01F23/02</further-classification>
        <further-classification edition="200601120260102B">G01F23/18</further-classification>
        <further-classification edition="200601120260102B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美超微電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUPER MICRO COMPUTER, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁　見後</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, JIAN HOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳加偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIA-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡　曜燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YAOTSAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示用於檢測冷卻劑洩漏之冷卻系統及方法。伺服器之處理器被附接至冷板。一內部液體冷卻劑含納於一冷卻劑貯存器中且經由一冷卻劑分配歧管而循環通過該等冷板。在該冷卻劑分配歧管及該冷卻劑貯存器中監測該內部液體冷卻劑之液位。至少基於該冷卻劑分配歧管中之該內部液體冷卻劑之該液位及對該等伺服器中內部冷卻劑洩漏之檢測而檢測冷卻劑洩漏。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are cooling systems and methods for detecting coolant leakage. Processors of servers are attached to cold plates. An internal liquid coolant is contained in a coolant reservoir and is circulated through the cold plates via a coolant distribution manifold. The level of the internal liquid coolant is monitored in the coolant distribution manifold and the coolant reservoir. Coolant leakage is detected based at least on the level of the internal liquid coolant in the coolant distribution manifold and detection of internal coolant leakage in the servers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:伺服器冷卻系統/冷卻系統</p>
        <p type="p">101:線</p>
        <p type="p">102:線</p>
        <p type="p">103:線</p>
        <p type="p">104:箭頭</p>
        <p type="p">105:線</p>
        <p type="p">106:線</p>
        <p type="p">120:伺服器</p>
        <p type="p">121:漏液感測器</p>
        <p type="p">130:冷卻劑分配歧管</p>
        <p type="p">131:配件</p>
        <p type="p">132:入口</p>
        <p type="p">134:出口</p>
        <p type="p">135:輔助冷卻環路</p>
        <p type="p">140:電源分配單元</p>
        <p type="p">150:冷卻劑分配單元</p>
        <p type="p">151:泵</p>
        <p type="p">152:冷卻劑貯存器</p>
        <p type="p">153:控制處理器</p>
        <p type="p">154:熱交換器</p>
        <p type="p">170:冷卻塔</p>
        <p type="p">171:主要冷卻環路</p>
        <p type="p">180:控制伺服器</p>
        <p type="p">181:伺服器管理軟體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1588" publication-number="202615028">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615028</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133122</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>錠劑配方</chinese-title>
        <english-title>TABLET FORMULATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">A61K31/513</main-classification>
        <further-classification edition="200601120260114B">A61K31/44</further-classification>
        <further-classification edition="200601120260114B">A61K31/416</further-classification>
        <further-classification edition="200601120260114B">A61K31/145</further-classification>
        <further-classification edition="200601120260114B">A61K9/20</further-classification>
        <further-classification edition="200601120260114B">A61P31/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商基利科學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GILEAD SCIENCES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商默沙東有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCK SHARP &amp; DOHME LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雀爾　班傑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAL, BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷迪　傑伊　普爾納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REDDY, JAY POORNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬拉特　達南傑　德維達斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARATHE, DHANANJAY DEVIDAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>因佩里亞爾　瑪喬麗　Ｚ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMPERIAL, MARJORIE Z.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪農齊奧　詹姆斯　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DINUNZIO, JAMES C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑達拉拉揚　帕維特拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNDARARAJAN, PAVITHRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦戈　瑞安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VARGO, RYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>隆戈　黛安　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LONGO, DIANE M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范姆　蜜雪兒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHAM, MICHELLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯佩格　黛安娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPERGER, DIANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係關於醫藥組成物（例如錠劑），其包含人類免疫缺乏病毒(HIV)殼體抑制劑及核苷反轉錄酶易位抑制劑(NRTTI)，其可用於治療患者之HIV感染。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to pharmaceutical compositions (&lt;i&gt;e.g.&lt;/i&gt;, tablets) comprising an human immunodeficiency virus (HIV) capsid inhibitor and a nucleoside reverse transcriptase translocation inhibitor (NRTTI), useful for the treatment of an HIV infection in a patient.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1589" publication-number="202615711">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615711</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133125</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>成膜方法及成膜裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">C23C16/455</main-classification>
        <further-classification edition="200601120260108B">C23C16/38</further-classification>
        <further-classification edition="200601120260108B">C23C16/50</further-classification>
        <further-classification edition="200601120260108B">H01L21/318</further-classification>
        <further-classification edition="200601120260108B">H01L21/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>酒井宗一朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, SHUICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤良裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 提供一種在基板上形成氮化硼膜時，能夠抑制基板表面的氮化的技術。  &lt;br/&gt;　　[解決手段] 所揭示的成膜方法包含：(a)為了在基板上形成第1氮化硼膜實行第1序列的工程；以及(b)在(a)之後，為了在第1氮化硼膜上形成第2氮化硼膜實行第2序列的工程。第1序列包含：(a1)對腔室內的基板供給包含環硼氮烷化合物的原料氣體的工程；以及(a2)對基板供給從非含氮氣體所生成的第1電漿化學種的工程，且該第1電漿化學種用於從環硼氮烷化合物形成第1氮化硼膜。第2序列包含：(b1)對腔室內的基板上供給原料氣體的工程；以及(b2)對第1氮化硼膜上的環硼氮烷化合物供給從含氮氣體生成的第2電漿化學種的工程。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">MT:方法</p>
        <p type="p">SQ1:第1序列</p>
        <p type="p">SQ2:第2序列</p>
        <p type="p">STa,STb,ST1f,ST11,ST12,ST1p,STc,ST2f,ST21,ST22,ST2p1,ST23,ST2p2:工程</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1590" publication-number="202615913">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615913</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133148</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光電交叉桿開關</chinese-title>
        <english-title>OPTOELECTRICAL CROSSBAR SWITCH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G02B6/35</main-classification>
        <further-classification edition="200601120260102B">G02B6/42</further-classification>
        <further-classification edition="201301120260102B">H04B10/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商覓可思科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIXX TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙維茲　瑞貝卡　凱拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHAEVITZ, REBECCA KAYLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉古拉曼　維維克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAGHURAMAN, VIVEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光電封裝可包含至少一個電開關應用特定積體電路(ASIC)及至少一個光學引擎。該電ASIC可安置於一通信介面之一中心部分處。該電ASIC可併入一交叉桿功能性。該光學引擎可相對於該通信介面配置。該光學引擎可電連接至該至少一個電ASIC。該光學引擎可安置成鄰近於該至少一個電ASIC。該光學引擎可包含用於一或多個光纖之一光纖連接器、一光子積體電路及一電子積體電路。該光學引擎可經組態以將自該光纖連接器獲得之一光學信號轉換成由該電ASIC使用之一電信號且反之亦然。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optoelectrical package may include at least one electrical switch application-specific integrated circuit (ASIC) and at least one optical engine. The electrical ASIC may be disposed at a central portion of a communication interface. The electrical ASIC may incorporate a crossbar functionality. The optical engine may be arranged relative to the communication interface. The optical engine may be electrically connected to the at least one electrical ASIC. The optical engine may be disposed adjacent to the at least one electrical ASIC. The optical engine may include a fiber connector for one or more fibers, a photonic integrated circuit, and an electronic integrated circuit. The optical engine may be configured to convert an optical signal obtained from the fiber connector to an electrical signal for use by the electrical ASIC and vice versa.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光電交叉桿開關</p>
        <p type="p">105:半導體光電封裝</p>
        <p type="p">110:電開關應用特定積體電路(ASIC)</p>
        <p type="p">115:光學引擎</p>
        <p type="p">120:晶片邊緣</p>
        <p type="p">122:全倍縮光罩邊緣</p>
        <p type="p">125:光纖</p>
        <p type="p">130:中介層</p>
        <p type="p">135:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1591" publication-number="202614933">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614933</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133153</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>食物成分及飲料產品</chinese-title>
        <english-title>FOOD INGREDIENT AND BEVERAGE PRODUCTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260105B">A23L33/19</main-classification>
        <further-classification edition="201601120260105B">A23L33/15</further-classification>
        <further-classification edition="201601120260105B">A23L33/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商雀巢製品股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOCIETE DES PRODUITS NESTLE S.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚漫江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, MANJIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐秀娥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, XIUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王曌昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ELAINE ZHAOZHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡文　尚　巴提斯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAVIN, JEAN-BAPTISTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩巴提爾　瑪加莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SABATIER, MAGALIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑蘭吉　克萊兒　羅倫斯　路錫　瑪莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOULANGE, CLAIRE LAURENCE LUCIE MARIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高丁　珍　菲利浦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GODIN, JEAN-PHILIPPE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克里斯汀　史蒂凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHRISTEN, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩溫斯卡　奧加</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKWINSKA, OLGA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種包含半乳寡糖及營養素的食物成分、其生產方法及包含該成分的飲料產品。該食物成分係藉由將β-半乳糖苷酶添加至包含有包括乳糖之脫脂乳固體之組成物中而生產。該食物成分可用於例如飲料產品中以降低脂肪及/或糖，而不會對甜度、味道及/或口感造成不利影響。本發明進一步係關於一種用於在有需要的懷孕或哺乳期個體中治療及/或預防胃腸病症及/或改善消化舒適度的方法及組成物，該組成物包含有包含半乳寡糖(GOS)之低糖、低乳糖、基於乳之組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a food ingredient comprising galactooligosaccharides and nutrients, a way of producing it and beverage products comprising the ingredient. The food ingredient is produced by adding a beta-galactosidase to a composition comprising non-fat milk solids including lactose. The food ingredient may be used e.g. in beverage products to reduce fat and/or sugar without detrimentally impacting sweetness, taste and/or texture. The invention further relates to methods and compositions for treating and/or preventing gastrointestinal disorders and/or improving digestive comfort in a pregnant or lactating individual in need thereof, the composition comprising a low sugar, low lactose, milk-based composition comprising galactooligosaccharide (GOS).</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1592" publication-number="202616468">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616468</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133154</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於搬運半導體元件的環托盤</chinese-title>
        <english-title>RING TRAY FOR TRANSFERRING SEMICONDUCTOR DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">H01L21/683</main-classification>
        <further-classification edition="200601120260105B">H01L21/67</further-classification>
        <further-classification edition="200601120260105B">H01L21/677</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商泰克元股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECHWING, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅閏成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NA, YUN SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於用於搬運半導體元件的環托盤。依據本發明，包括：支撐架，形成有用於辨識方向的凹口；安裝架，固定地安裝於所述支撐架；及，複數個插入件，安裝於所述安裝架，形成有用於裝載半導體元件的裝載槽。依據本發明，能實現可替代黏合性結構環裝載座的新形態的環托盤。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">30:環托盤</p>
        <p type="p">31:支撐架</p>
        <p type="p">32:安裝架</p>
        <p type="p">32h:卡鉤</p>
        <p type="p">33:插入件</p>
        <p type="p">33g:裝載槽</p>
        <p type="p">34:蓋件</p>
        <p type="p">34b:遮擋板</p>
        <p type="p">34h:檢查孔</p>
        <p type="p">34p:防脫板</p>
        <p type="p">35:固定件</p>
        <p type="p">G:間距</p>
        <p type="p">IG:安裝槽</p>
        <p type="p">SD:半導體元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1593" publication-number="202616173">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616173</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133156</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>支付系統、支付方法及程式產品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260102B">G06Q20/06</main-classification>
        <further-classification edition="201201120260102B">G06Q20/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商樂天集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAKUTEN GROUP, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商樂天信用卡股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAKUTEN CARD CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉武季槻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHITAKE, KIZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤涼奈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, SUZUNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之支付系統(1)之利用資訊取得部(112，202)取得與可於使用者終端(30)利用之支付方式之利用相關之利用資訊。利用條件判定部(109，203)基於利用資訊，判定是否滿足與支付方式之分期付款、固定限額繳款或獎金付款之利用相關之利用條件。處理執行部(102，201)基於利用條件判定部(203)之判定結果，執行與分期付款、固定限額繳款或獎金付款相關之處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:支付伺服器</p>
        <p type="p">20:卡片伺服器</p>
        <p type="p">30:使用者終端</p>
        <p type="p">40:店舖終端</p>
        <p type="p">100:資料記憶部</p>
        <p type="p">102:處理執行部</p>
        <p type="p">200:資料記憶部</p>
        <p type="p">201:處理執行部</p>
        <p type="p">202:利用資訊取得部</p>
        <p type="p">203:利用條件判定部</p>
        <p type="p">300:資料記憶部</p>
        <p type="p">301:操作受理部</p>
        <p type="p">302:顯示控制部</p>
        <p type="p">400:資料記憶部</p>
        <p type="p">401:支付請求發送部</p>
        <p type="p">DB1:支付資料庫</p>
        <p type="p">DB2:卡片資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1594" publication-number="202615048">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615048</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133161</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＲＡＳ抑制劑</chinese-title>
        <english-title>RAS INHIBITORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/535</main-classification>
        <further-classification edition="200601120260102B">A61K31/501</further-classification>
        <further-classification edition="200601120260102B">A61K31/4965</further-classification>
        <further-classification edition="200601120260102B">A61K31/44</further-classification>
        <further-classification edition="200601120260102B">A61K31/425</further-classification>
        <further-classification edition="200601120260102B">A61K31/42</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商銳新醫藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REVOLUTION MEDICINES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯普森　賽佛林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THOMPSON, SEVERIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯林森　艾丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMLINSON, AIDAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TYE, MARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維塔　妮可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VITA, NICOLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班尼特　Ｇ　萊斯禮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BURNETT, G. LESLIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>愛德華茲　安　Ｖ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EDWARDS, ANNE V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示案係關於能夠抑制Ras蛋白之大環化合物及其醫藥組合物及蛋白質複合物，以及該等物質在治療癌症中之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure features macrocyclic compounds, and pharmaceutical compositions and protein complexes thereof, capable of inhibiting Ras proteins, and their uses in the treatment of cancers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1595" publication-number="202615018">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615018</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133165</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>固體組成物</chinese-title>
        <english-title>SOLID COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">A61K31/44</main-classification>
        <further-classification edition="200601120260114B">A61K31/192</further-classification>
        <further-classification edition="200601120260114B">A61P11/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商第一三共健康事業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIICHI SANKYO HEALTHCARE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関夏未</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKI, NATSUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種固體組成物，其係改善替哌啶的溶出性的包含選自由替哌啶及其鹽所成群組之至少1種與選自由傳明酸及其鹽所成群組之至少1種者。  &lt;br/&gt;　　其解決手段為一種固體組成物，其包含以下的成分：(A)選自由替哌啶及其鹽所成群組之至少1種、(B)選自由傳明酸及其鹽所成群組之至少1種、以及(C)選自由布洛芬及其鹽所成群組之至少1種，其中，該固體組成物不包括包含左西替利嗪或羅拉他定的固體組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The purpose of the present invention is to provide a solid composition containing at least one compound selected from the group consisting of tipepidine and salts thereof and at least one compound selected from the group consisting of tranexamic acid and salts thereof, wherein the dissolution property of tipepidine is improved. &lt;br/&gt; Provided is a solid composition comprising: (A) at least one compound selected from the group consisting of tipepidine and salts thereof; (B) at least one compound selected from the group consisting of tranexamic acid and salts thereof; and (C) at least one compound selected from the group consisting of ibuprofen and salts thereof, wherein the solid composition excludes compositions comprising levocetirizine or loratadine.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1596" publication-number="202615512">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615512</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133191</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性樹脂組成物、硬化膜、及攝像裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C08F220/18</main-classification>
        <further-classification edition="200601120260105B">C08L101/08</further-classification>
        <further-classification edition="201501120260105B">G02B1/11</further-classification>
        <further-classification edition="200601120260105B">C08G59/34</further-classification>
        <further-classification edition="200601120260105B">C08K3/20</further-classification>
        <further-classification edition="200601120260105B">B32B27/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福田湧己</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUDA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中野由子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANO, YUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種能夠形成具有高的折射率及良好的耐熱性的硬化膜的硬化性樹脂組成物。提供一種硬化性樹脂組成物，含有氧化鈦粒子、樹脂、以及矽烷偶合劑。以硬化性樹脂組成物的固體成分的總量為基準，氧化鈦粒子的含量超過60質量%且未滿90質量%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1597" publication-number="202615509">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615509</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133208</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性樹脂組成物、轉印膜、樹脂圖案的製造方法、導電圖案的製造方法及聚合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251215B">C08F220/06</main-classification>
        <further-classification edition="200601120251215B">C08F220/14</further-classification>
        <further-classification edition="200601120251215B">C08F2/50</further-classification>
        <further-classification edition="200601120251215B">C08J3/24</further-classification>
        <further-classification edition="200601120251215B">G03F7/028</further-classification>
        <further-classification edition="201901120251215B">B32B7/06</further-classification>
        <further-classification edition="200601120251215B">B32B27/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>両角一真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOROZUMI, KAZUMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>深川玲子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKAGAWA, REIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>師岡直之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOROOKA, NAOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢那慎一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANNA, SHINICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠形成密接性優異的樹脂圖案之感光性樹脂組成物等。感光性樹脂組成物等含有：聚合物，包含具有由下述式（1）表示之基之結構單元和具有選自包括矽基及氟基之群組中的至少1種之結構單元；鹼可溶性樹脂；聚合性化合物；及光聚合起始劑。式（1）中，R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;表示氫原子或取代基，*表示與其他結構的鍵結部位。  &lt;br/&gt;&lt;img align="absmiddle" height="114px" width="299px" file="ed10024.JPG" alt="ed10024.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:偽支撐體</p>
        <p type="p">12:轉印層</p>
        <p type="p">13:熱塑性樹脂層</p>
        <p type="p">15:中間層</p>
        <p type="p">17:感光性樹脂層</p>
        <p type="p">19:保護膜</p>
        <p type="p">20:轉印膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1598" publication-number="202615275">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615275</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133211</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>兒童安全座椅及其座椅組件</chinese-title>
        <english-title>CHILD SAFETY SEAT AND SEAT ASSMEBLY THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">B60N2/28</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張大亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, DALIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種兒童安全座椅及其座椅組件。該座椅組件包括上殼體及下殼體。下殼體與上殼體配合連接。其中上殼體和下殼體二者其中之一設有第一定位件，另一設有第二定位件。第一定位件包括第一定位主體及設於第一定位主體上的引導部，第二定位件在引導部的引導下與第一定位件相抵。根據上述座椅組件，在上殼體與下殼體的裝配過程中，引導部能夠導引第二定位件與第一定位件準確對齊，從而實現第二定位件與第一定位件相抵接，操作方便，裝配效率較高。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The application relates to a child safety seat and a seat assembly thereof. The seat assembly includes an upper housing and a lower housing. The lower housing and the upper housing mates with are connected to each other. One of the upper housing and the lower housing is provided with a first positioning member, and the other of the upper housing and the lower housing is provided with a second positioning member. The first positioning member includes a first positioning body and a guide portion arranged on the first positioning body, and the second positioning member abuts against the first positioning member under a guidance of the guide portion. According to the seat assembly described above, during an assembly process of the upper housing with the lower housing, the guide portion can guide the second positioning member to be accurately aligned with the first positioning member, so that an abutment between the second positioning member and the first positioning member is achieved with convenient operation, and high assembly efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">A:部</p>
        <p type="p">A10:第一定位件</p>
        <p type="p">A20:上殼體</p>
        <p type="p">A201:上扶手部</p>
        <p type="p">A202:乘坐部</p>
        <p type="p">A203:缺口</p>
        <p type="p">A40:下殼體</p>
        <p type="p">A401:下扶手部</p>
        <p type="p">A42:底壁</p>
        <p type="p">A44:前壁</p>
        <p type="p">A46:側壁</p>
        <p type="p">A47:遮蔽部</p>
        <p type="p">A48:後壁</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1599" publication-number="202615813">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615813</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133217</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於射彈發射器的彈匣衝擊吸收件</chinese-title>
        <english-title>MAGAZINE IMPACT ABSORBER FOR A PROJECTILE LAUNCHER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">F41A21/12</main-classification>
        <further-classification edition="200601120260107B">F41H13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商愛克勝企業公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AXON ENTERPRISE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德斯科爾　塞繆爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DRISCOLL, SAMUEL R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜菲特　尼可拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DHUYVETTER, NICHOLAS A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　理查</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, RICHARD H.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">射彈發射器可包括配置為用以接收一或多個彈筒的彈匣。彈匣可包括本體，本體包括與第二端相對的第一端。彈匣可包括槍膛，槍膛界定出穿過本體的開口。槍膛可配置為用以接收彈筒。彈匣可包括定位在槍膛中的衝擊吸收件。回應於接收彈筒的槍膛，彈筒的軸向前表面可配置為用以接觸衝擊吸收件。衝擊吸收件可配置為用以回應於彈筒的部署接收作用力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A projectile launcher may comprise a magazine configured to receive one or more cartridges. The magazine may comprise a body comprising a first end opposite a second end. The magazine may comprise a bore defining an opening through the body. The bore may be configured to receive a cartridge. The magazine may comprise an impact absorber positioned within the bore. In response to the bore receiving the cartridge, an axially forward surface of the cartridge may be configured to contact the impact absorber. The impact absorber may be configured to receive a force in response to a deployment of the cartridge.</p>
      </isu-abst>
      <representative-img>
        <p type="p">412:彈匣</p>
        <p type="p">450:殼體</p>
        <p type="p">451:第一端</p>
        <p type="p">452:第二端</p>
        <p type="p">453:槍膛</p>
        <p type="p">454:壁</p>
        <p type="p">456:前本體</p>
        <p type="p">458:後段本體</p>
        <p type="p">461:第一部分</p>
        <p type="p">462:第二部分</p>
        <p type="p">463:第三部分</p>
        <p type="p">465:第一彈筒止擋部</p>
        <p type="p">466:第二彈筒止擋部</p>
        <p type="p">470:撞擊板</p>
        <p type="p">480:衝擊吸收件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1600" publication-number="202616508">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616508</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133224</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有整合電感器之電感裝置</chinese-title>
        <english-title>INDUCTIVE DEVICE WITH INTEGRATED INDUCTORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">H01L23/522</main-classification>
        <further-classification edition="200601120251201B">H01F27/255</further-classification>
        <further-classification edition="200601120251201B">H01F17/02</further-classification>
        <further-classification edition="200601120251201B">H01F17/04</further-classification>
        <further-classification edition="200601120251201B">H01L21/60</further-classification>
        <further-classification edition="201601120251201B">H01F41/06</further-classification>
        <further-classification edition="200601120251201B">G05F1/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藍　吉雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAN, JE-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　龍海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JONGHAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>度塔　蘭娜蒂普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUTTA, RANADEEP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種設備包括一基材，該基材包括一第一整合電感器。該第一整合電感器包括設置於該基材之一第一空腔內的一第一核心材料。該第一整合電感器亦包括至少部分地圍繞該第一空腔內之該第一核心材料的一第一組導電繞組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus includes a substrate that includes a first integrated inductor. The first integrated inductor includes a first core material disposed within a first cavity of the substrate. The first integrated inductor also includes a first set of conductive windings that at least partially encircle the first core material within the first cavity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:裝置</p>
        <p type="p">102:電感裝置</p>
        <p type="p">104:基材</p>
        <p type="p">106:整合電感器</p>
        <p type="p">108:核心材料</p>
        <p type="p">110:導電繞組</p>
        <p type="p">112:外部連接件</p>
        <p type="p">120:晶粒</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1601" publication-number="202615884">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615884</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133232</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池管理裝置及其操作方法</chinese-title>
        <english-title>BATTERY MANAGEMENT DEVICE AND METHOD OF OPERATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260113B">G01R31/36</main-classification>
        <further-classification edition="200601120260113B">H01M10/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金俊榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JUN YEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金承煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SEUNG HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本文中所揭露的實施例的一種電池管理裝置可包括：記憶體，被配置成儲存至少一個指令；以及至少一個處理器，被配置成執行所述至少一個指令，並且所述至少一個處理器可辨識與電池管理裝置的第一操作狀態對應的第一重設計數，且在第一重設計數大於參考重設計數時基於在第一操作狀態之後執行的一或多個軟體程式的操作時間來診斷電池管理裝置的狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A battery management device according to an embodiment disclosed herein may include a memory configured to store at least one instruction and at least one processor configured to execute the at least one instruction, and the at least one processor may identify a first reset count corresponding to a first operating state of the battery management device and diagnose a state of the battery management device based on an operating time of one or more software programs executed after the first operating state when the first reset count is greater than a reference reset count.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電池組</p>
        <p type="p">10:電池管理裝置</p>
        <p type="p">100:記憶體</p>
        <p type="p">102:處理器</p>
        <p type="p">120:電池單元/第一電池單元</p>
        <p type="p">121、122、123:電池單體</p>
        <p type="p">140:電池單元/第二電池單元</p>
        <p type="p">160:電池單元/第三電池單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1602" publication-number="202615478">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615478</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133246</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>類風濕性關節炎中抗介白素—６和抗腫瘤壞死因子—α治療反應之差異生物標誌物</chinese-title>
        <english-title>DIFFERENTIAL BIOMARKERS FOR ANTI-INTERLEUKIN-6 AND ANTI-TUMOR NECROSIS FACTOR-α TREATMENT RESPONSE IN RHEUMATOID ARTHRITIS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">C07K16/28</main-classification>
        <further-classification edition="200601120260108B">A61K39/395</further-classification>
        <further-classification edition="200601120260108B">G01N33/68</further-classification>
        <further-classification edition="200601120260108B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商賽諾菲生物技術公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANOFI BIOTECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾格烏索普　伊諾森特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGUEUSOP, INONCENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畢瑟曼　納汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIESEMANN, NADINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供了涉及生物標誌物的技術（例如，方法、組成物、套組和系統等），該等生物標誌物可用於監測或確定患有類風濕性關節炎的受試者是否顯示出對類風濕性關節炎療法之早期反應性。本文還提供了治療類風濕性關節炎之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are technologies (e.g., methods, compositions, kits, and systems, etc.) involving biomarkers that are useful for monitoring or determining whether a subject with rheumatoid arthritis shows early responsiveness to a rheumatoid arthritis therapy. Methods of treating rheumatoid arthritis are also provided herein.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1603" publication-number="202615566">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615566</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133292</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有環己烷-1,2,4-三丙酸之三甲酯及對苯二甲酸二烷基酯之塑化劑組成物</chinese-title>
        <english-title>PLASTICIZER COMPOSITION CONTAINING TRIMETHYL ESTERS OF CYCLOHEXANE-1,2,4-TRIPROPIONIC ACID AND A DIALKYL TEREPHTHALATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08K5/00</main-classification>
        <further-classification edition="200601120260102B">C08K5/12</further-classification>
        <further-classification edition="200601120260102B">C08L101/00</further-classification>
        <further-classification edition="200601120260102B">C08L27/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商贏創奧克森諾有限責任兩合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVONIK OXENO GMBH &amp; CO. KG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格瑞斯　邁克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRASS, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魯瑟克　莫妮卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUSEK, MONIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡　艾可斯　邁克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN EICKELS, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種塑化劑組成物，其包含式（1）之化合物  &lt;br/&gt;&lt;img align="absmiddle" height="167px" width="343px" file="ed10008.JPG" alt="ed10008.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;及至少一種對苯二甲酸二烷基酯，其中該對苯二甲酸二烷基酯中之兩個烷基各具有8個或9個碳原子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a plasticizer composition comprising a compound of the formula (1) &lt;br/&gt;&lt;img align="absmiddle" height="164px" width="351px" file="ed10009.JPG" alt="ed10009.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;and at least one dialkyl terephthalate, where the two alkyl groups in the dialkyl terephthalate each have 8 or 9 carbon atoms.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1604" publication-number="202615400">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615400</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133294</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有環己烷-1,2,4-三丙酸之三甲酯及環己烷-1,2-二羧酸二烷基酯之塑化劑組成物</chinese-title>
        <english-title>PLASTICIZER COMPOSITION CONTAINING TRIMETHYL ESTERS OF CYCLOHEXANE-1,2,4-TRIPROPIONIC ACID AND DIALKYL CYCLOHEXANE-1,2-DICARBOXYLATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C69/608</main-classification>
        <further-classification edition="200601120260102B">C07C69/75</further-classification>
        <further-classification edition="200601120260102B">C08K5/12</further-classification>
        <further-classification edition="200601120260102B">C08L101/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商贏創奧克森諾有限責任兩合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVONIK OXENO GMBH &amp; CO. KG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格瑞斯　邁克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRASS, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魯瑟克　莫妮卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUSEK, MONIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡　艾可斯　邁克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN EICKELS, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種塑化劑組成物，其包含式（1）之化合物  &lt;br/&gt;&lt;img align="absmiddle" height="170px" width="352px" file="ed10007.JPG" alt="ed10007.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;及至少一種環己烷-1,2-二羧酸二烷基酯，其中該環己烷-1,2-二羧酸二烷基酯中之兩個烷基各具有8個或9個碳原子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a plasticizer composition comprising a compound of the formula (1) &lt;br/&gt;&lt;img align="absmiddle" height="170px" width="340px" file="ed10008.JPG" alt="ed10008.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;and at least one dialkyl cyclohexane-1,2-dicarboxylate, where the two alkyl groups in the dialkyl cyclohexane-1,2-dicarboxylate each have 8 or 9 carbon atoms.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1605" publication-number="202615182">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615182</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133300</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於晶粒堆疊助焊劑移除之良率改善系統</chinese-title>
        <english-title>YIELD IMPROVEMENT SYSTEM FOR DIE STACK FLUX REMOVAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B23K1/018</main-classification>
        <further-classification edition="200601120260102B">H01L21/67</further-classification>
        <further-classification edition="200601120260102B">B08B3/02</further-classification>
        <further-classification edition="200601120260102B">B08B3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商維克儀器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VEECO INSTRUMENTS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓊斯　杭特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JONES, HUNTER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰勒　菲利普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TYLER, PHILLIP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰迪　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TADDEI, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>愛德華茲　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EDWARDS, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>揚努齊　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANNUZZI, MARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐奈利　凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONNELLY, KEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於改善自3D半導體結構之間的開口移除助焊劑及助焊劑殘留物之程序之良率且增加處理量之系統。該系統採用高流量定向加壓氮氣來輔助半導體裝置之間的區域去濕，其中焊料凸塊或微凸塊將一個裝置附接至另一裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for improving yield and increasing throughput on processes that remove flux and flux residues from openings between 3D semiconductor structures. The system employs high flow, directed, pressurized nitrogen to assist in de-wetting the areas between semiconductor devices where solder bumps or micro bumps attach one device to another.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:晶圓</p>
        <p type="p">100:自旋處理腔室</p>
        <p type="p">102:側壁</p>
        <p type="p">110:中空內部</p>
        <p type="p">120:自旋卡盤</p>
        <p type="p">200:施配臂</p>
        <p type="p">210:流體入口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1606" publication-number="202615004">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615004</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133359</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>喹啉cGAS拮抗劑化合物之固體形式及鹽</chinese-title>
        <english-title>SOLID FORMS AND SALTS OF A QUINOLINE CGAS ANTAGONIST COMPOUND</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">A61K31/4196</main-classification>
        <further-classification edition="200601120260113B">A61K31/438</further-classification>
        <further-classification edition="200601120260113B">A61K31/4025</further-classification>
        <further-classification edition="200601120260113B">A61P27/00</further-classification>
        <further-classification edition="200601120260113B">A61P25/00</further-classification>
        <further-classification edition="200601120260113B">A61P9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商免疫感應治療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMMUNESENSOR THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美國德州系統大學評議委員會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE BOARD OF REGENTS OF THE UNIVERSITY OF TEXAS SYSTEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱　鍵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIU, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏　琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史和平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, HEPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫　立軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, LIJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　志堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZHIJIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示案提供作為cGAS拮抗劑之化合物、該等化合物之固體形式、該等化合物及其固體形式之製備方法、包含該等化合物及其固體形式之醫藥組合物及其在醫學療法中之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides compounds that are cGAS antagonists, solid forms of the compounds, methods of preparation of the compounds and their solid forms, pharmaceutical compositions comprising the compounds and their solid forms, and their use in medical therapy.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1607" publication-number="202615115">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615115</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133384</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制裝置、電刺激裝置及電刺激程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251130B">A61N1/36</main-classification>
        <further-classification edition="200601120251130B">A63B26/00</further-classification>
        <further-classification edition="200601120251130B">A63B23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＭＴＧ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MTG CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>島津憲一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMAZU, NORIKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>淺野嘉友</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASANO, YOSHITOMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種電刺激裝置之控制裝置。本發明之控制裝置，係具備於電極部間反覆施加脈衝群之控制部，並且脈衝群中所包含之複數個基本脈衝中的第一個基本脈衝與最後一個基本脈衝的極性不同；控制部，係於每一週期會反轉脈衝群中所包含之複數個基本脈衝的極性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
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  <tw-patent-application no="1608" publication-number="202615488">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615488</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133398</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體元件之製造方法、半導體元件及樹脂</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F2/44</main-classification>
        <further-classification edition="200601120260102B">C08F222/20</further-classification>
        <further-classification edition="200601120260102B">C08F283/04</further-classification>
        <further-classification edition="200601120260102B">C08F290/14</further-classification>
        <further-classification edition="200601120260102B">C08G73/12</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/027</further-classification>
        <further-classification edition="200601120260102B">G03F7/028</further-classification>
        <further-classification edition="200601120260102B">G03F7/037</further-classification>
        <further-classification edition="200601120260102B">G03F7/038</further-classification>
        <further-classification edition="200601120260102B">G03F7/16</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">H01L21/312</further-classification>
        <further-classification edition="200601120260102B">H01L23/29</further-classification>
        <further-classification edition="200601120260102B">H01L23/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野崎敦靖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOZAKI, ATSUYASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種包含樹脂及感光劑之樹脂組成物、硬化上述組成物而成之硬化物及其製造方法、包含硬化物之積層體及其製造方法、半導體元件及其製造方法、以及新型樹脂，前述樹脂為聚醯亞胺或聚醯亞胺前驅物之樹脂，並且具有由下述式（A-1）表示之結構。  &lt;br/&gt;&lt;img align="absmiddle" height="181px" width="356px" file="ed10101.JPG" alt="ed10101.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1609" publication-number="202615590">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615590</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133409</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚合物基質複合材料及其製造方法</chinese-title>
        <english-title>POLYMER MATRIX COMPOSITES, AND METHODS OF MAKING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">C08L101/00</main-classification>
        <further-classification edition="200601120260107B">C08K7/06</further-classification>
        <further-classification edition="200601120260107B">C08K9/00</further-classification>
        <further-classification edition="200601120260107B">C08J5/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商萊登股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LYTEN, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安澤莫　Ｈ　布里斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANZELMO, H.BRYCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉賽兒貝斯　候賽因　阿里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHEZELBASH, HOSSEIN-ALI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡濱陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示了包括碳纖維之碳複合材料，並且展現出獨特有利的機械性質，包括層間剪切強度、抗壓強度及對以偏離平行於整體纖維之縱軸之角度施加之力之抗性。此等改良允許使用更少之材料，同時在大量實際應用中提供改良之強度，從而降低所得產品之製造、分銷及實際利用之整體財務成本。此等優點經由利用將碳絲摻入碳纖維中，較佳地將包括三維(3D)石墨烯薄片之碳絲摻入該等纖維中之發明製造技術來最佳化。藉由使個別纖維與3D石墨烯配體「交聯」，該等絲機械地增強了個別纖維以及包括在單個繩索中串在一起之多個纖維之組合物兩者。此等發明努力之組合結果包括相對於常規碳纖維展現出更優之機械強度及降低之質量之材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Carbon composites, including carbon fibers, are disclosed and exhibit unique, advantageous mechanical properties, including inter laminar shear strength, compression strength, and resistance to forces applied at angles deviating from parallel to the longitudinal axis of the overall fiber. These improvements allow use of less material while conveying improved strength in myriad practical applications, reducing overall financial cost of fabrication, distribution, and practical utilization of resulting products. These advantages are optimized via utilizing inventive fabrication techniques that incorporate carbon filaments into carbon fibers, preferably incorporating carbon filaments including three-dimensional (3D) graphene platelets into said fibers. The filaments mechanically reinforce both individual fibers, as well as compositions including multiple fibers strung together in a single cord, by “crosslinking” the individual fibers with 3D graphene ligands. The combined result of these inventive efforts includes materials exhibiting superior mechanical strength and reduced mass relative to conventional carbon fibers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1610" publication-number="202615874">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615874</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133417</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>探針及探針的製造方法</chinese-title>
        <english-title>PROBE AND METHOD FOR MANUFACTURING THE PROBE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">G01R1/067</main-classification>
        <further-classification edition="202001120260115B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本麥克隆尼股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KABUSHIKI KAISHA NIHON MICRONICS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奈良勇斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARA, YUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福士直城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHI, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的探針係具備彈簧單元，該彈簧單元係依序連結樑狀的第一彈簧零件、第二彈簧零件、第三彈簧零件、第四彈簧零件及連結彈簧零件而成。第一彈簧零件係沿第一方向延伸。第二彈簧零件係沿第二方向延伸。第三彈簧零件係沿第一方向延伸。第四彈簧零件係沿第二方向延伸。連結彈簧零件係連接於第四彈簧零件，且沿第一彈簧零件、第二彈簧零件、第三彈簧零件及第四彈簧零件依此順序積層的第三方向延伸。複數個彈簧單元沿著軸向依序配置，且使鄰接之一方的彈簧單元之連結彈簧零件與另一方的彈簧單元之第一彈簧零件連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A probe includes: a spring unit in which a first spring component, a second spring component, a third spring component, a fourth spring component, and a coupling spring component, each having a beam shape, and are connected in this order. The first spring component extends in a first direction. The second spring component extends in a second direction. The third spring component extends in the first direction. The fourth spring component extends in the second direction. The coupling spring component is connected to the fourth spring component and extends in a third direction in which the first spring component, the second spring component, the third spring component, and the fourth spring component are stacked in this order. A plurality of spring units are arranged along an axial direction in this order, and the coupling spring component of one spring unit adjacent thereto is connected to the first spring component of the other spring unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:彈簧單元</p>
        <p type="p">111:第一彈簧零件</p>
        <p type="p">112:第二彈簧零件</p>
        <p type="p">113:第三彈簧零件</p>
        <p type="p">114:第四彈簧零件</p>
        <p type="p">115:連結彈簧零件</p>
        <p type="p">121:第一連接零件</p>
        <p type="p">122:第二連接零件</p>
        <p type="p">123:第三連接零件</p>
        <p type="p">131:第一接合構件</p>
        <p type="p">132:第二接合構件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1611" publication-number="202615691">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615691</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133467</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>Ｎ金屬膜之沉積</chinese-title>
        <english-title>DEPOSITION OF N-METAL FILMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">C23C16/06</main-classification>
        <further-classification edition="200601120260112B">C23C16/32</further-classification>
        <further-classification edition="200601120260112B">C23C16/42</further-classification>
        <further-classification edition="200601120260112B">C23C16/52</further-classification>
        <further-classification edition="202501120260112B">H10D62/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>干德可塔　史林尼維斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GANDIKOTA, SRINIVAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊逸雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YIXIONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾麗胡瑪爾吐爾遜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AILIHUMAER, TUERXUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬騰洲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, TENGZHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王昊東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HAODONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甘古利　塞沙德里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GANGULI, SESHADRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了半導體元件，例如電晶體，以及用於製造能實現低電阻率的NMOS能帶邊緣並改善元件性能和可靠性的半導體元件的方法。提供了可作為電晶體的有效N金屬膜的材料。相較於習知的碳化鈦鋁（TiAlC）基N金屬膜，提供了二元/三元金屬碳化物膜和金屬矽化物膜，這些可以用作N金屬膜，無需/只需最小高介電常數（HK）帽層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are semiconductor devices, e.g., transistors, and methods of manufacturing semiconductor devices which achieve NMOS band edge with low resistivity and having improved device performance and reliability. Provided are materials that can be used as effective N-metal films for transistors. Instead of conventional titanium aluminum carbide (TiAlC) based N-metal films, provided are binary/ternary metal carbide films and metal silicide films that may be used as N-metal films with no/minimal high-k (HK) capping layer required.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:電子元件</p>
        <p type="p">202:半導體基板</p>
        <p type="p">203:頂表面</p>
        <p type="p">204a:源極</p>
        <p type="p">204b:汲極</p>
        <p type="p">205:頂表面</p>
        <p type="p">206:通道</p>
        <p type="p">207:頂表面</p>
        <p type="p">208:氧化物層</p>
        <p type="p">209:頂表面</p>
        <p type="p">210:高介電常數介電層</p>
        <p type="p">211:頂表面</p>
        <p type="p">212:含鈦層</p>
        <p type="p">214:N金屬區</p>
        <p type="p">216:N金屬層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1612" publication-number="202616752">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616752</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133483</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用不平衡多輸入多輸出傳輸功率限制的射頻暴露合規性</chinese-title>
        <english-title>RADIO FREQUENCY EXPOSURE COMPLIANCE USING IMBALANCED MULTIPLE-INPUT, MULTIPLE-OUTPUT TRANSMIT POWER LIMITS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260102B">H04W52/36</main-classification>
        <further-classification edition="200901120260102B">H04W52/24</further-classification>
        <further-classification edition="201701120260102B">H04B7/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納達庫杜蒂　賈卡迪希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NADAKUDUTI, JAGADISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧　凌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述用於多輸入多輸出(MIMO)傳輸的射頻(RF)暴露合規性的技術及設備。一種可由一無線裝置執行的實例方法包括判定該無線裝置的複數個天線之各者的一各別多輸入多輸出(MIMO)傳輸功率限制。與一MIMO傳輸關聯的一信號由各天線以一各別第一傳輸功率位準傳輸，該各別第一傳輸功率位準基於該天線之符合一射頻(RF)暴露限制的該各別MIMO傳輸功率限制。用於該複數個天線的一第一天線的該第一傳輸功率位準不同於用於該複數個天線的一第二天線的該第一傳輸功率位準。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Techniques and apparatus for radio frequency (RF) exposure compliance for multiple-input, multiple-output (MIMO) transmissions are described. An example method that may be performed by a wireless device includes determining a respective multiple-input, multiple-output (MIMO) transmit power limit for each of a plurality of antennas of the wireless device. A signal associated with a MIMO transmission is transmitted from each antenna at a respective first transmission power level based on the respective MIMO transmit power limit for the antenna in compliance with a radio frequency (RF) exposure limit. The first transmission power level used for a first antenna of the plurality of antennas is different from the first transmission power level used for a second antenna of the plurality of antennas.</p>
      </isu-abst>
      <representative-img>
        <p type="p">800:操作</p>
        <p type="p">802:方塊</p>
        <p type="p">804:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1613" publication-number="202616756">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616756</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133506</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制裝置、使用者終端、控制方法、及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">H04W72/04</main-classification>
        <further-classification edition="200601120260102B">H04B7/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商豐田自動車股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOTA JIDOSHA KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>滝沢賢一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKIZAWA, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基地台的控制裝置，其具備控制部，該控制部執行以下步驟：模式選定步驟，對於使用者終端發送的波束變更要求，採用至少包含對每次要求都分配資源的第一模式、以及預先週期性地分配資源的第二模式之複數個模式中的任一個；模式通知步驟，將選定的模式通知給前述使用者終端；以及波束變更步驟，根據來自前述使用者終端的波束變更要求，變更用於與前述使用者終端通信的波束。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1614" publication-number="202615380">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615380</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133561</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蝕刻氣體</chinese-title>
        <english-title>ETCHING GAS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">C07C19/08</main-classification>
        <further-classification edition="200601120260113B">C09K13/00</further-classification>
        <further-classification edition="200601120260113B">H01L21/3065</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大金工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江藤友亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ETO, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村新吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黒木克親</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUROKI, YOSHICHIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉山明平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIYAMA, AKINARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種蝕刻氣體，其包含1,1,1,2-四氟乙烷，及1種以上之具有雙鍵之氟碳系化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides an etching gas containing 1,1,1,2-tetrafluoroethane and a fluorocarbon-based compound having one or more double bonds.</p>
      </isu-abst>
      <representative-img>
        <p type="p">a:側蝕量</p>
        <p type="p">b:孔直徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1615" publication-number="202615993">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615993</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133574</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>被動式冷卻的鏡片模組</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">G03F7/20</main-classification>
        <further-classification edition="200601120260113B">G02B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商創浦半導體製造雷射系統歐洲股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRUMPF LASERSYSTEMS FOR SEMICONDUCTOR MANUFACTURING SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷加德　包里斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REGAARD, BORIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅爾　法比安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAYER, FABIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤爾里奇　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ULLRICH, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維格勒　言斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAEGERLE, JENS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭伯特　馬丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAMBERT, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施洛瑟　奧利弗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHLOSSER, OLIVER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮勒　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PIEHLER, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西蓋兒　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIEGEL, STEPHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>爾京　陶嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ERGIN, TOLGA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鏡片模組(10)，其設置在無塵室(12)，尤其是無空氣環境(14)中，該鏡片模組(10)用於偏轉電磁波(16)，尤其是雷射光(18)，鏡片模組(10)包括具有至少一鏡面(22)的鏡體(20)和可拆卸地設置在鏡體(20)上的散熱器(24)，其中，該散熱器(24)具有一第一導熱面(26)，該鏡體(20)具有一第二導熱面(28)，該第一導熱面(26)至少部分地直接貼附在第二導熱面(28)上，以排出鏡體(20)的熱能，該鏡片模組(10)包括一固定裝置(30)，使第一導熱面(26)可釋放地壓緊在第二導熱面(28)上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:鏡片模組</p>
        <p type="p">12:無塵室</p>
        <p type="p">14:無空氣環境</p>
        <p type="p">16:電磁波</p>
        <p type="p">18:雷射光</p>
        <p type="p">20:鏡體</p>
        <p type="p">22:鏡面</p>
        <p type="p">24:散熱器</p>
        <p type="p">26:第一導熱面</p>
        <p type="p">28:第二導熱面</p>
        <p type="p">30:固定裝置</p>
        <p type="p">32:壓緊方向</p>
        <p type="p">34:螺絲</p>
        <p type="p">36:固定凹槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1616" publication-number="202615359">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615359</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133606</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>油水分離淨化系統及利用其的油水分離淨化方法</chinese-title>
        <english-title>OIL-WATER SEPARATION AND PURIFICATION SYSTEM AND OIL-WATER SEPARATION AND PURIFICATION METHOD USING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260112B">C02F1/40</main-classification>
        <further-classification edition="200601120260112B">B01D17/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商大信ＭＣ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAESHIN MC CO,.LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔瑛煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, YOUNG HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關於一種藉由提供於混合有水與油的污染水中分階段油水分離處理的操作，以有效分離並排出水與油達成淨化，同時自動以自然落差方式引導進行油水分離處理操作時產生的油水流動，從而能夠提供作業效率及操作自動化的油水分離淨化系統及利用其的油水分離淨化方法。本發明係被設置為將於油水中混合的水和油相分離並淨化，包括：一油水儲存槽，供油水流入並儲存；一供應泵浦，用於將該油水儲存槽內的油水排出並移動；一鼓式濾網，用於對由該供應泵浦投入的油水中的各種污泥進行一次前處理；一浮渣去除機，用於將自該鼓式濾網一次過濾的油水中的殘餘污泥與油水進行二元化分離，並進行二次前處理；一油水分離器，用於將自該浮渣去除機前處理的油水中的水與油進行二元化分離並淨化後排出；一檢查槽，用於檢查自該油水分離器分離排出的水的濁度；以及一排水泵浦，連接設置於該檢查槽的底部，用於將最終淨化後的水排放至下水道，其中自該鼓式濾網至該排水泵浦，各設置設備被構成為依次形成高度差，使得自動引導自該鼓式濾網至該檢查槽的油水以自然落差方式流動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:油水儲存槽</p>
        <p type="p">200:供應泵浦</p>
        <p type="p">300:鼓式濾網</p>
        <p type="p">400:浮渣去除機</p>
        <p type="p">400A:第一浮渣去除機</p>
        <p type="p">400B:第二浮渣去除機</p>
        <p type="p">500:油水分離器</p>
        <p type="p">600:檢查槽</p>
        <p type="p">700:排水泵浦</p>
        <p type="p">R:傾斜面</p>
        <p type="p">P:高度差</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1617" publication-number="202615335">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615335</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133678</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬複合氧化物、複合體、氧產生觸媒、觸媒油墨、電極以及金屬複合氧化物及複合體的製造方法</chinese-title>
        <english-title>OXYGEN EVOLUTION CATALYST, CATALYST INK, ELECTRODE, AND METHOD FOR PRODUCING OXYGEN EVOLUTION CATALYST</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">C01B13/32</main-classification>
        <further-classification edition="201401120260112B">C09D11/03</further-classification>
        <further-classification edition="202201120260112B">B22F1/08</further-classification>
        <further-classification edition="200601120260112B">B01J23/46</further-classification>
        <further-classification edition="200601120260112B">C01G37/02</further-classification>
        <further-classification edition="200601120260112B">C01G9/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＤＩＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原国豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, GUOHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙恵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁建軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, JIANJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許梁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之金屬複合氧化物包含銥、釕、及第3金屬（M），且上述第3金屬（M）為選自由第2族、第13族、第14族、過渡金屬所組成之群中之1種或2種以上之元素，上述金屬複合氧化物為低結晶性氧化物或非晶質（amorphous）氧化物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1618" publication-number="202615479">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615479</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133713</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>細胞激素受體促效劑</chinese-title>
        <english-title>CYTOKINE RECEPTOR AGONIST</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260106B">C07K16/28</main-classification>
        <further-classification edition="200601120260106B">A61K39/395</further-classification>
        <further-classification edition="200601120260106B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃格利　傑洛米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EGLI, JEROME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯達瑞　迪克　蘿拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CODARRI DEAK, LAURA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾希納　提摩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EICHNER, TIMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡薩雷斯　尼可利尼　瑪麗亞　維樂瑞雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GONZALEZ NICOLINI, MARIA VALERIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>剛瑟　西娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUENTHER, SINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈夫特曼　克勞蒂亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAFTMANN, CLAUDIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈福　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOFER, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷斯　勞福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSSE, RALF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克萊　克里斯俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLEIN, CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>屈特爾　克莉斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUETTEL, CHRISTINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉　薩拉　葛雷戈里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LA SALA, GREGORY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩斯納　艾克哈得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOESSNER, EKKEHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐斯曼　卡佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSMAN, KATJA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="15">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波斯　羅琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POUSSE, LAURENE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="16">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒倫伯格　辛蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHULENBURG, CINDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="17">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤瑪那　費爾南德斯　帕洛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMANA FERNANDEZ, PABLO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="18">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔佛　卡蜜拉　伊麗莎白</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TREVOR, CAMILLA ELIZABETH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="19">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜爾　哈洛德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUERR, HARALD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="20">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬治絲　蓋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GEORGES, GUY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="21">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基希納　安吉　加布里埃爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIRCHNER, ANGIE GABRIELE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="22">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勒克萊爾　史蒂芬　杰拉德　艾倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LECLAIR, STEPHANE GERARD ALAIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="23">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮皮格　黛安娜　安琪拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PIPPIG, DIANA ANGELA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請案涉及細胞激素受體促效劑，該等細胞激素受體促效劑包含：i) 能夠結合 PD-1 上之第一表位的第一 PD-1 結合域、ii) 能夠結合 PD-1 上之第二表位的第二 PD-1 結合域、iii) IL2Rγ 結合域、iv) IL2Rβ 結合域及 v) Fc 區，且其中該第一 PD-1 結合域及該第二 PD-1 結合域不競爭結合於 PD-1 上。該等 PD1 結合域同時結合該 PD-1 且 IL-2 受體結合域結合 IL-2 受體複合體之次單元。在 PD-1 之存在下該等 IL-2 受體結合域之雙互補位組裝容許選擇性活化 IL-2 受體且以靶向方式有效地模擬細胞激素活性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The application relates to cytokine receptor agonists comprising: i) a first PD-1 binding domain capable of binding a first epitope on PD-1, ii) a second PD-1 binding domain capable of binding a second epitope on PD-1, iii) an IL2Rγ binding domain, iv) an IL2Rβ binding domain, and v) an Fc region, and wherein the first and second PD-1 binding domains do not compete for binding on PD-1. The PD1-binding domains simultaneously bind the PD-1 and the IL-2 receptor-binding domains bind subunits of an IL-2 receptor complex. Biparatopic assembly of the IL-2 receptor-binding domains in the presence of PD-1 allows to selectively activate IL-2 receptors and effectively mimic cytokine activity in a targeted manner.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1619" publication-number="202615076">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615076</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133714</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>新穎雙叉桿菌屬細菌及其利用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260105B">A61K35/745</main-classification>
        <further-classification edition="201601120260105B">A23L33/135</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商養樂多本社股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KABUSHIKI KAISHA YAKULT HONSHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢矧加奈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAHAGI, KANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>織原健人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORIHARA, KENTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原妙子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARA, TAEKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佃直紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUKUDA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松木隆広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUKI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種新穎之屬於龍根雙叉桿菌嬰兒亞種之細菌。本發明之屬於龍根雙叉桿菌嬰兒亞種之細菌具有使人母乳寡糖及木寡糖合成代謝之能力，且不具有耐藥基因。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1620" publication-number="202615358">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615358</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133735</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鉭酸化合物分散液</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C01G35/00</main-classification>
        <further-classification edition="201001120260102B">H01M4/485</further-classification>
        <further-classification edition="201001120260102B">H01M10/0525</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井金屬股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI MINING &amp; SMELTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三浦高史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIURA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷方惣一朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKATA, SOICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大橋竜太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHASHI, RYUTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>元野隆二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTONO, RYUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原周平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARA, SYUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之鉭酸化合物分散液含有鉭，且含有：元素X，其係選自由鹼金屬元素及/或鹼土族金屬元素所組成之群中之一種以上；及有機酸；且該分散液藉由動態光散射法所測定之D50(體積累計基準)為100nm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1621" publication-number="202616313">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616313</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133737</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層陶瓷電容器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01G4/30</main-classification>
        <further-classification edition="200601120260102B">H01G4/228</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商村田製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURATA MANUFACTURING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富永健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMINAGA, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>栗谷淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURITANI, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邉由紀枝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, YUKIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種於藉由安裝機等進行安裝時可抑制裂痕產生之積層陶瓷電容器。  &lt;br/&gt;本發明之積層陶瓷電容器10包含：積層體，其具有：沿積層方向相對之第1面及第2面、沿與前述積層方向正交之第1方向相對之第3面及第4面、及沿與前述積層方向及前述第1方向正交之第2方向相對之第5面及第6面；及第1外部電極至第4外部電極，其等配置於積層體之表面。積層體包含：第1內部電極，其露出於第3面及第4面；第2內部電極，其露出於第3面及第4面。第1外部電極具有與第1內部電極連接之第1基底鍍層。於將第1基底鍍層之積層方向之尺寸設為t、將積層體之積層方向之尺寸設為T、將積層陶瓷電容器之第1方向之尺寸設為L、將積層陶瓷電容器之第2方向之尺寸設為W時，0.85≦L/W≦1.0、且(T-5 μm)≦t≦(T+2 μm)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:積層陶瓷電容器</p>
        <p type="p">12:積層體</p>
        <p type="p">12a:第1面</p>
        <p type="p">12b:第2面</p>
        <p type="p">12c:第3面</p>
        <p type="p">12d:第4面</p>
        <p type="p">12e:第5面</p>
        <p type="p">12f:第6面</p>
        <p type="p">30:外部電極</p>
        <p type="p">30a:第1外部電極</p>
        <p type="p">30b:第2外部電極</p>
        <p type="p">30c:第3外部電極</p>
        <p type="p">30d:第4外部電極</p>
        <p type="p">IV-IV,V-V,VI-VI,VII-VII:線</p>
        <p type="p">L:積層陶瓷電容器之第1方向之尺寸</p>
        <p type="p">T:積層陶瓷電容器之積層方向之尺寸</p>
        <p type="p">W:積層陶瓷電容器之第2方向之尺寸</p>
        <p type="p">x:積層方向</p>
        <p type="p">y:第1方向</p>
        <p type="p">z:第2方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1622" publication-number="202616269">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616269</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133744</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於建立線性內插的頭部相關傳輸函數之方法</chinese-title>
        <english-title>METHOD FOR CREATION OF LINEARLY INTERPOLATED HEAD RELATED TRANSFER FUNCTIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260109B">G10L19/008</main-classification>
        <further-classification edition="201301120260109B">G10L21/0208</further-classification>
        <further-classification edition="200601120260109B">H04S7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商杜拜研究特許公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOLBY LABORATORIES LICENSING CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥格拉斯　大衛　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCGRATH, DAVID S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述用於判定自一原始對左/右耳頭部相關傳輸函數(HRTF)調適之一「耦合」對左/右耳HRTF之系統、裝置及方法，其中該等耦合HRTF之耳間延遲係使用在低頻下提供正確耳間延遲之全通濾波器來形成。該等全通濾波器經調適以限制高頻下之耳間相位差。此外，描述用於快速產生適合之全通濾波器之一低複雜性程序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems, devices, and methods are described for determining a “coupled” pair of Left/Right ear Head Related Transfer Functions (HRTFs) that are adapted from an original pair of Left/Right ear HRTFs, wherein the inter-aural delay of the coupled HRTFs is formed using all-pass filters that provide the correct inter-aural delay at low frequencies. The all-pass filters are adapted to limit the inter-aural phase difference at high frequencies. Furthermore, a low-complexity process is described for rapid generation of suitable all-pass filters.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2100:方法</p>
        <p type="p">2105:區塊</p>
        <p type="p">2110:區塊</p>
        <p type="p">2115:區塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1623" publication-number="202615164">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615164</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133765</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種晶體生長設備</chinese-title>
        <english-title>A CRYSTAL GROWTH DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250908B">B08B1/32</main-classification>
        <further-classification edition="202401120250908B">B08B1/12</further-classification>
        <further-classification edition="200601120250908B">B08B13/00</further-classification>
        <further-classification edition="200601120250908B">C30B23/00</further-classification>
        <further-classification edition="200601120250908B">C30B35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商眉山博雅新材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEISHAN BOYA ADVANCED MATERIALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧忠輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, ZHONGHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本說明書實施例提供一種晶體生長設備，晶體生長設備包括：爐體，爐體的爐壁上設有測溫視窗；安裝孔，設於爐壁上；測溫清潔裝置，包括清潔部，清潔部設於爐體內，能夠清潔測溫視窗，測溫清潔裝置能夠穿過安裝孔且可活動地設置于安裝孔內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure may disclose a crystal growth device, the crystal growth device includes: a furnace body, and a temperature measurement window is provided on the furnace wall of the furnace body; installation hole, located on the furnace wall; temperature measuring and cleaning device, including a cleaning section, located inside the furnace and capable of cleaning the temperature measuring window, the temperature measuring and cleaning device can pass through the installation hole and be movable inside the installation hole.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:爐體</p>
        <p type="p">11:測溫窗口</p>
        <p type="p">20:安裝孔</p>
        <p type="p">30:測溫清潔裝置</p>
        <p type="p">40:坩堝</p>
        <p type="p">50:保溫氈</p>
        <p type="p">51:測溫孔</p>
        <p type="p">100:晶體生長設備</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1624" publication-number="202616826">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616826</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133770</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括故障偵測電路的半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE INCLUDING FAULT DETECTION CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260115B">H10B12/10</main-classification>
        <further-classification edition="200601120260115B">H01L23/66</further-classification>
        <further-classification edition="200601120260115B">G11C29/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭尙勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, SANG-HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴榮奭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, YOUNG SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐寧焄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, YOUNGHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹炫喆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, HYUN-CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種包括一故障偵測電路的半導體裝置包括：一第一結構，其包括第一測試墊；一第二結構，其安置於該第一結構上且包括分別對應於該等第一測試墊且與該等第一測試墊形成一測試墊鏈之第二測試墊；一第一端子，其連接至該測試墊鏈之一端；複數個故障偵測電路，其連接至該測試墊鏈以偵測該測試墊鏈之一連接狀態；以及一第二端子，其連接至該測試墊鏈之另一端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device including a fault detection circuit includes a first structure including first test pads, a second structure disposed on the first structure and including second test pads that respectively correspond to the first test pads and form a test pad chain with the first test pads, a first terminal connected to one end of the test pad chain, a plurality of fault detection circuits connected to the test pad chain to detect a connection status of the test pad chain, and a second terminal connected to the other end of the test pad chain.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:第一結構</p>
        <p type="p">101:第一基體</p>
        <p type="p">101F,201F:前表面</p>
        <p type="p">101R,201R:後表面</p>
        <p type="p">110:第一電路層</p>
        <p type="p">111,211:層間絕緣層</p>
        <p type="p">113:第一佈線</p>
        <p type="p">115:第一接觸插塞</p>
        <p type="p">200:第二結構</p>
        <p type="p">201:第二基體</p>
        <p type="p">210:第二電路層</p>
        <p type="p">213:第二佈線</p>
        <p type="p">215:第二接觸插塞</p>
        <p type="p">A-A':線</p>
        <p type="p">CNT1:第一連接線</p>
        <p type="p">CNT2:第二連接線</p>
        <p type="p">FDC:故障偵測電路</p>
        <p type="p">TP1:第一測試墊</p>
        <p type="p">TP2:第二測試墊</p>
        <p type="p">TPC:測試墊鏈</p>
        <p type="p">TR:電晶體</p>
        <p type="p">WR1:第一佈線層</p>
        <p type="p">WR2:第二佈線層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1625" publication-number="202615097">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615097</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133785</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>奈米澱粉懸浮液、奈米澱粉／酯懸浮液、碘化奈米澱粉懸浮液以及碘化奈米澱粉／酯懸浮液、其製備方法及其用途</chinese-title>
        <english-title>NANO-STARCH SUSPENSIONS, NANO-STARCH/ESTER SUSPENSIONS, IODINATED NANO-STARCH SUSPENSIONS, AND IODINATED NANO-STARCH/ESTER SUSPENSIONS, METHOD FOR PREPARING SAME AND USING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260106B">A61K47/36</main-classification>
        <further-classification edition="200601120260106B">A61K8/73</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商Ｉ２普爾公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>I2PURE CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱斯勒　傑克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KESSLER, JACK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拜耳　伊爾克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAYER, ILKER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請案中揭示製備奈米澱粉或奈米澱粉/酯懸浮液之新穎方法。該等所獲得之奈米澱粉懸浮液及奈米澱粉/酯懸浮液顯示意外地高穩定性且可使用各種碘溶液碘化以提供在鹼性條件下具有長期穩定性及經改良穩定性之碘化奈米澱粉懸浮液及奈米澱粉/酯懸浮液。新產品可使用該等奈米澱粉懸浮液、奈米澱粉/酯懸浮液、碘化奈米澱粉懸浮液及/或奈米澱粉/酯懸浮液製備並用於如本文所揭示之應用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Novel methods of preparing nano-starch or nano-starch/ester suspensions are disclosed in this application. The obtained nano-starch suspensions and nano-starch/ester suspensions showed unexpectedly high stabilities and can be iodinated using various iodine solutions to provide iodinated nano-starch suspensions and nano-starch/ester suspensions that have long-term stabilities and improved stabilities under basic conditions. New products can be prepared using the nano-starch suspensions, nano-starch/ester suspensions, iodinated nano-starch suspensions, and/or nano-starch/ester suspensions and used for applications as disclosed herein.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1626" publication-number="202616445">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616445</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133786</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板收納容器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251205B">H01L21/673</main-classification>
        <further-classification edition="200601120251205B">B65D85/86</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越聚合物股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU POLYMER CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮田遼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYATA, HARUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">基板收納容器包括：容器主體，能夠上下多層地收納多個基板；蓋體，將容器主體正面的開口關閉；前保持器，設置於蓋體；支撐體，設置於容器主體的左右的側面，在容器主體的開口未被蓋體關閉的狀態下，對多個基板進行支撐；以及支撐結構，設置於容器主體的左右的側面或背面，在容器主體的開口被蓋體關閉的狀態下，在與前保持器之間對多個基板進行保持。前保持器的保持部包括：保持槽，在利用蓋體將容器主體的開口關閉時對基板進行保持；以及提升槽，設置於較保持槽更靠下方處。提升槽在支撐結構中將基板提升至提升位置的提升動作的期間使基板滯留。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">13:支撐體(支撐結構)</p>
        <p type="p">17:後保持器(支撐結構)</p>
        <p type="p">42:基板按壓部</p>
        <p type="p">45:保持槽</p>
        <p type="p">49:提升槽</p>
        <p type="p">422:保持部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1627" publication-number="202615107">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615107</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133814</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>消毒裝置</chinese-title>
        <english-title>DISINFECTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">A61L2/08</main-classification>
        <further-classification edition="200601120260114B">A61L9/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商奈科斯特森斯有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEXTSENSE S.R.L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰斯蒂　喬瓦尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TESTI, GIOVANNI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡蒂埃　卡梅羅拉法埃萊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARTIERE, CARMELO RAFFAELE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦萊斯　羅薩里奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VALLES, ROSARIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種消毒裝置（10），具有至少一發射單元（23），發射單元（23）包含一組三個主發射器（26A、26B、26C）以及至少一次發射器（27）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disinfecting device (10) having at least one emitter unit (23) comprising a set of three of primary emitters (26A, 26B, 26C) and at least one secondary emitter (27).</p>
      </isu-abst>
      <representative-img>
        <p type="p">23:發射單元</p>
        <p type="p">26A、26B、26C:主發射器</p>
        <p type="p">27:次發射器</p>
        <p type="p">28:電子板</p>
        <p type="p">34:光敏塗層</p>
        <p type="p">D1、D2:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1628" publication-number="202615264">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615264</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133818</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>車輛顯示設備及其控制方法</chinese-title>
        <english-title>VEHICLE DISPLAY APPARATUS AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260113B">B60K35/20</main-classification>
        <further-classification edition="200601120260113B">G06F3/041</further-classification>
        <further-classification edition="202401120260113B">B60K35/55</further-classification>
        <further-classification edition="202401120260113B">B60K35/65</further-classification>
        <further-classification edition="202401120260113B">B60K35/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星顯示器有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴埈亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JUNHYEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金慶昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KYUNGHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐榮奭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, YOUNGSEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種車輛顯示設備，包含：一攝影機；一可拉伸顯示面板，該可拉伸顯示面板包含一觸碰感測器；一機械單元，包含至少一個銷釘，該機械單元在一垂直方向上相對於該顯示面板的一後表面移動；以及一處理器，該處理器配置為：控制該顯示面板及該機械單元的操作，識別觸碰該顯示面板的一使用者，並判斷一駕駛座及一乘客座控制模式；於該駕駛座控制模式及該乘客座控制模式下，輸出一驅動控制訊號，用於控制至少一個銷釘的移動；輸出一操作控制訊號，用於執行與該使用者於該顯示面板上的根據至少一個銷釘的移動所形成的一凸起區域的觸碰輸入所相對應的一功能；以及於該駕駛座控制模式下，輸出一回饋控制訊號，用於執行該功能所設定的回饋輸出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A vehicle display apparatus includes: a camera; a stretchable display panel including a touch sensor; a mechanical unit including at least one pin moving in a perpendicular direction with respect to a rear surface of the display panel; and a processor configured to: control operations of the display panel and the mechanical unit, identify a user touching the display panel, and determine a driver's seat or a passenger's seat control mode; in the driver's seat and passenger's seat control modes, output a driving control signal for controlling movement of the at least one pin; output an operation control signal for performing a function corresponding to a touch of the user input to a protruding area of the display panel according to the movement of the at least one pin; and in the driver's seat control mode, output a feedback control signal for feedback output set for performing the function.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:車輛顯示設備</p>
        <p type="p">DA:顯示區域</p>
        <p type="p">DP:顯示面板</p>
        <p type="p">DPL:顯示層</p>
        <p type="p">ENL:封裝層</p>
        <p type="p">NDA:非顯示區域</p>
        <p type="p">SSL:機械單元</p>
        <p type="p">TSL:觸碰輸入層</p>
        <p type="p">z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1629" publication-number="202615826">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615826</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133827</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人員存在偵測系統與人員移動偵測系統</chinese-title>
        <english-title>HUMAN PRESENCE DETECTION SYSTEM AND HUMAN MOTION DETECTION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260102B">G01J5/0801</main-classification>
        <further-classification edition="202201120260102B">G01J5/0806</further-classification>
        <further-classification edition="200601120260102B">G06F7/02</further-classification>
        <further-classification edition="200601120260102B">G06F7/64</further-classification>
        <further-classification edition="201801120260102B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商光寶科技新加坡私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON SINGAPORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEY, SASWATI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何軍華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, JUN-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁　偉健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEO, WEI JIAN JENSON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余　正維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEE, GEORGE CHUN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種人員存在偵測系統與人員移動偵測系統。偵測系統包括有熱感測器、裝設於熱感測器上的鏡片與設於所述系統的控制器的偵測裝置。鏡片用於聚合從空間區域入射的熱輻射或是由一物件輻射出的熱輻射至熱感測器，以感測所述的熱輻射與輸出溫度訊號。控制器使用濾波器與電路處理溫度訊號，並輸出正比於從空間區域或物件得到的熱輻射的數位溫度數值， 所述偵測裝置可以通過處理數位溫度數值的波動以執行人員存在偵測或人員移動偵測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A human presence detection system and a human motion detection system. A detection apparatus that includes a thermal sensor, a lens mounted on the thermal sensor, and a controller are incorporated into the system. The lens is configured to focus thermal radiation incident from a spatial zone or the thermal radiation being radiated by an object onto the thermal sensor for sensing the thermal radiation and outputting a temperature signal. The controller incorporates filters and circuits to process the temperature signal and output digital temperature counts proportional to the thermal radiation from the spatial zone or the object. The detection apparatus can accordingly perform human presence detection or human motion detection by processing fluctuation of the digital temperature counts.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:熱偵測裝置</p>
        <p type="p">101:鏡片</p>
        <p type="p">103:熱感測器</p>
        <p type="p">105:電路板</p>
        <p type="p">107:控制器</p>
        <p type="p">171:低通濾波器</p>
        <p type="p">173:卡爾曼濾波器</p>
        <p type="p">109:主機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1630" publication-number="202616367">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616367</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133832</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>修復半導體處理組件之方法及經修復的半導體處理組件</chinese-title>
        <english-title>METHODS FOR RESTORING SEMICONDUCTOR PROCESSING COMPONENTS AND RESTORED SEMICONDUCTOR PROCESSING COMPONENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/20</main-classification>
        <further-classification edition="200601120260102B">H01L21/302</further-classification>
        <further-classification edition="200601120260102B">H01L21/67</further-classification>
        <further-classification edition="200601120260102B">H01L23/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商摩曼帝夫特性石英材料公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOMENTIVE PERFORMANCE MATERIALS QUARTZ, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倫納茨　沃爾特傑弗瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LENNARTZ, WALTER JEFFREY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　煒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊斯特　拉塞爾喬恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEIST, RUSSELL JON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種修復和保護半導體反應器中使用的半導體處理組件的整修方法。該方法包括：移除來自半導體反應器中使用的半導體處理組件的寄生沉積物。然後塗覆新保護性塗層到半導體處理組件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A refurbishment method is provided to restore and protect a semiconductor processing component used in a semiconductor reactor. The method includes removing parasitic deposits from a semiconductor processing component accumulated from the semiconductor reactor. A new protective coating is then applied to the semiconductor processing component.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:方法</p>
        <p type="p">502、504:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1631" publication-number="202616385">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616385</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133838</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造物件的平坦化製程、設備與方法</chinese-title>
        <english-title>PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANUFACTURING AN ARTICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">H01L21/3105</main-classification>
        <further-classification edition="200601120260107B">B28D5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔　炳鎮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, BYUNG-JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班柏格　賽西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAMESBERGER, SETH J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙克爾頓　史帝文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHACKLETON, STEVEN C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤真樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種平坦化系統，包含：上板夾頭，包含被組態以固持上板的固持面，充氣膜，具有界定內緣的內徑、界定外緣的外徑；及在該內緣與該內緣間之徑向方向中的中點，其中該充氣膜係配置於該上板夾頭的固持面徑向向外，及沖洗氣體通道，配置於該充氣膜的中點徑向向內並配置於該上板夾頭的固持面徑向向外。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A planarization system, comprising a superstrate chuck including a holding surface configured to hold a superstrate, an inflatable membrane having an inner diameter defining an inner edge, an outer diameter defining an outer edge, and, a midpoint between the inner edge and the outer edge in a radial direction, wherein the inflatable membrane is disposed radially outward of the holding surface of the superstrate chuck, and a purge gas channel disposed radially inward of the midpoint of the inflatable membrane and radially outward of the holding surface of the superstrate chuck.</p>
      </isu-abst>
      <representative-img>
        <p type="p">7A:部分</p>
        <p type="p">11:沖洗氣體通道</p>
        <p type="p">12:基板</p>
        <p type="p">14:基板夾頭</p>
        <p type="p">15:貼片</p>
        <p type="p">18:上板</p>
        <p type="p">22:整形面</p>
        <p type="p">24:徑向</p>
        <p type="p">25:充氣膜</p>
        <p type="p">27:外緣</p>
        <p type="p">28:上板夾頭</p>
        <p type="p">28H:固持面</p>
        <p type="p">
        &lt;i&gt;d&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;1&lt;/i&gt;
        &lt;/sub&gt;
        &lt;i&gt;-d&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;4&lt;/i&gt;
        &lt;/sub&gt;:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1632" publication-number="202615462">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615462</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133873</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>二價雙特異性抗體及其生產方法</chinese-title>
        <english-title>BIVALENT BISPECIFIC ANTIBODY AND METHOD FOR PRODUCING THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">C07K16/18</main-classification>
        <further-classification edition="200601120260108B">C07K16/46</further-classification>
        <further-classification edition="200601120260108B">A61K39/395</further-classification>
        <further-classification edition="200601120260108B">C12N15/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>俄羅斯聯邦商拜奧卡德聯合股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOINT STOCK COMPANY ''BIOCAD''</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科特利亞爾　阿琳娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTLYAR, ALINA VALERIEVNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊凡諾娃　阿斯塔西婭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IVANOVA, ANASTASIA ANDREEVNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲琳娜　瓦倫蒂娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FILINA, VALENTINA YURIEVNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩維諾娃　阿麗娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAVINOVA, ALINA SERGEEVNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基特曼諾娃　奧爾加</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYTMANOVA, OLGA LEONIDOVNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊戈茨基　謝爾蓋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEGOTSKII, SERGEI ALEKSANDROVICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩羅佐　狄密崔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOROZOV, DMITRY VALENTINOVICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及生物技術領域，具體涉及二價雙特異性抗體，其包含特異性結合第一抗原的抗體的第一輕鏈和第一重鏈，以及特異性結合第二抗原的抗體的第二輕鏈和重鏈，其中可變結構域VL和VH相互取代，並且其中VL和VH在FR4的C端具有修飾。還提供了生產所述抗體的方法。本發明使得可以以有效的方式生產雙特異性抗體。2個獨立請求項和19個附屬請求項，9個表，9個圖，10個實施例。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to the field of biotechnology, specifically to a bivalent bispecific antibody that comprises a first light chain and a first heavy chain of an antibody that specifically bind to a first antigen, and a second light chain and a heavy chain of an antibody that specifically bind to a second antigen, wherein the variable domains VL and VH are substituted for one another, and wherein the VL and VH have a modification at the C-terminus of FR4. Further provided is a method for producing said antibody. The invention makes it possible to produce bispecific antibodies in an efficient manner. 2 independent and 19 dependent claims, 9 tables, 9 figures, 10 examples.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:重鏈第三恆定結構域中凸起嵌入凹陷突變S354C和T366W以及Y349C、T366S、L368A和Y407V的位置</p>
        <p type="p">2:VL&lt;sup&gt;-3&lt;/sup&gt;可變結構域FR4的C端的另外4個末端胺基酸(TVSS)</p>
        <p type="p">3:VH&lt;sup&gt;-4&lt;/sup&gt;可變結構域FR4的C端的另外3個末端胺基酸(EIK)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1633" publication-number="202615104">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615104</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133874</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>曲妥珠單抗—藥物綴合物</chinese-title>
        <english-title>TRASTUZUMAB-DRUG CONJUGATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260105B">A61K47/68</main-classification>
        <further-classification edition="200601120260105B">A61K31/437</further-classification>
        <further-classification edition="200601120260105B">A61K31/436</further-classification>
        <further-classification edition="200601120260105B">A61K31/407</further-classification>
        <further-classification edition="200601120260105B">A61K39/395</further-classification>
        <further-classification edition="200601120260105B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>俄羅斯聯邦商拜奧卡德聯合股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOINT STOCK COMPANY ''BIOCAD''</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹尼洛夫　安東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DANILOV, ANTON ALEXANDROVICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>扎維亞拉夫　吉利爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZAVIALOV, KIRILL VADIMOVICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐尼斯　悠利亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZONIS, YULIA ALEXANDROVNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科日馬亞金娜　納塔利婭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOZHEMYAKINA, NATALIA VLADIMIROVNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及式I的抗體-藥物綴合物  &lt;br/&gt;&lt;img align="absmiddle" height="263px" width="547px" file="ed10049.JPG" alt="ed10049.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;或其藥學上可接受的鹽、溶劑合物或立體異構體，以及中間體，藥物組合物，治療疾病或病症的方法，以及所述化合物作為治療疾病或病症的藥物產品的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an antibody-drug conjugate of formula &lt;b&gt;I&lt;/b&gt;&lt;br/&gt;&lt;img align="absmiddle" height="270px" width="550px" file="ed10050.JPG" alt="ed10050.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;or pharmaceutically acceptable salt, solvate or stereoisomer thereof, as well as to intermediates, to pharmaceutical compositions, to methods for treating diseases or disorders and the use of said compounds as pharmaceutical products for treating diseases or disorders.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1634" publication-number="202616074">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616074</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133885</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>暫存器分組和虛擬暫存器</chinese-title>
        <english-title>REGISTER GROUPING AND VIRTUAL REGISTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">G06F9/455</main-classification>
        <further-classification edition="200601120260114B">G06F11/22</further-classification>
        <further-classification edition="200601120260114B">G06F12/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商微軟技術授權有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICROSOFT TECHNOLOGY LICENSING, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奈特　塞繆爾切爾西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KNIGHT, SAMUEL CHELSAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴　迪拜恩杜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEY, DIBYENDU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白　東炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAIK, DONG HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍德　查理斯帕克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOOD, CHARLES PARKER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所描述技術提供一種方法，包括判定系統單晶片(SoC)上所配置的複數個區塊；產生暫存器資料庫，其中該暫存器資料庫經配置以儲存複數個暫存器的一或多個參數，該複數個暫存器表示該SoC中的複數個區塊的該等暫存器；判定一或多個型樣字串，其中該等字串中之每一者識別複數個暫存器之間的共同功能性；對暫存器資料庫執行搜尋以自該複數個暫存器中識別暫存器群組，其中該暫存器群組中之每一者的名稱包括該型樣字串；以及產生與該暫存器群組相關的虛擬暫存器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The described technology provides a method including determining a plurality of blocks configured on a system on chip (SoC), generating a register database, wherein the register database is configured to store one or more parameters of a plurality of registers, the plurality of registers representing the registers for a plurality of blocks the SoC, determining one or more pattern strings, wherein each of the strings identify a common functionality among a plurality of registers, performing a search on a register database for identifying a group of registers from the plurality of registers, wherein names of each of the group of registers include the pattern string, and generating a virtual register that relates to the group of registers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">110:SoC</p>
        <p type="p">112:功能區塊</p>
        <p type="p">112a:暫存器</p>
        <p type="p">112b:暫存器</p>
        <p type="p">114:功能區塊</p>
        <p type="p">114a:暫存器</p>
        <p type="p">114b:暫存器</p>
        <p type="p">116:插座</p>
        <p type="p">120:虛擬暫存器(VR)系統</p>
        <p type="p">122:暫存器資料庫</p>
        <p type="p">124:暫存器分組(RG)模組</p>
        <p type="p">126:RG與VR儲存器</p>
        <p type="p">128:VR函數儲存器</p>
        <p type="p">130:除錯器</p>
        <p type="p">132:腳本</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1635" publication-number="202616763">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616763</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133888</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>協調波束成形指示及處理</chinese-title>
        <english-title>COORDINATED BEAMFORMING INDICATION AND PROCESSING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">H04W72/20</main-classification>
        <further-classification edition="202301120260102B">H04W72/12</further-classification>
        <further-classification edition="200901120260102B">H04W16/10</further-classification>
        <further-classification edition="200601120260102B">H04L5/00</further-classification>
        <further-classification edition="200601120260102B">H04B7/06</further-classification>
        <further-classification edition="200601120260102B">H04L25/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費馬尼　薩米耶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERMANI, SAMEER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田　濱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAN, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　嘉陵李</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIALING LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　宇韓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YOUHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷茲克　梅里安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REZK, MERIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倫德　得利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RENDE, DENIZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露之某些態樣提供一種利用協調通訊（諸如協調波束成形(CoBF)）進行無線通訊的方法。根據某些態樣，一種設備（例如，AP或非AP STA）獲得包括一前導碼的一第一訊框，該前導碼具有：至少一個共同部分，其適用於一第一基本服務集(BSS)及一第二BSS，其中該第一無線節點與該第一BSS、一或多個使用者特定部分、該第一訊框係涉及該第一BSS及該第二BSS的一協調通訊方案的部分的一指示、及識別該第一BSS及該第二BSS的資訊相關聯；及基於該指示及該資訊處理該一或多個使用者特定部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Certain aspects of the present disclosure provide a method for wireless communication utilizing coordinated communication, such as coordinated beamforming (CoBF). According to certain aspects, an apparatus (e.g., an AP or non-AP STA) obtains a first frame that includes a preamble, said preamble having: at least one common portion applicable to a first basic service set (BSS) and a second BSS, wherein the first wireless node is associated with the first BSS, one or more user-specific portions, an indication that the first frame is part of a coordinated communication scheme involving the first BSS and the second BSS, and information that identifies the first BSS and the second BSS; and processes the one or more user-specific portions, based on the indication and the information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1600:程序</p>
        <p type="p">1605:方塊</p>
        <p type="p">1610:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1636" publication-number="202615581">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615581</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133905</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、樹脂片及內藏電子零件基板</chinese-title>
        <english-title>RESIN COMPOSITION, RESIN SHEET AND ELECTRONIC COMPONENT BUILT-IN SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C08L63/00</main-classification>
        <further-classification edition="200601120260105B">C08L67/00</further-classification>
        <further-classification edition="201801120260105B">C08K3/013</further-classification>
        <further-classification edition="200601120260105B">B32B27/38</further-classification>
        <further-classification edition="200601120260105B">H05K1/03</further-classification>
        <further-classification edition="200601120260105B">H01L23/29</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>淺野卓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASANO, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村洋平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福原康雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUHARA, YASUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福家直仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUYA, NAOHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示課題在於提供一種樹脂組成物，其即使在含有大量無機充填材之情況下，仍具有高度充填性及低熱膨脹係數。樹脂組成物含有環氧樹脂(A)、硬化劑(B)、聚酯多元醇樹脂(C)及無機充填材(D)。相對於樹脂組成物之總量，聚酯多元醇樹脂(C)之含量大於0質量%且在10質量%以下。相對於樹脂組成物之總量，無機充填材(D)之含量為70質量%以上且98質量%以下。無機充填材(D)在以雷射繞射散射法測定之體積基準之粒度分布中，至少具有第1波峰及第2波峰這2個波峰。第1波峰之位置所示粒徑之大小為0.5µm以上且20µm以下。第2波峰之位置所示粒徑之大小為0.1µm以上且4µm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:內藏電子零件基板</p>
        <p type="p">2:基板</p>
        <p type="p">3:電子零件</p>
        <p type="p">21:第1主面</p>
        <p type="p">22:第2主面</p>
        <p type="p">41:密封部</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1637" publication-number="202615019">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615019</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133924</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>GLP-1R激動劑與恩格列淨的藥物組合物及用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260106B">A61K31/44</main-classification>
        <further-classification edition="200601120260106B">A61K31/4164</further-classification>
        <further-classification edition="200601120260106B">A61P13/12</further-classification>
        <further-classification edition="200601120260106B">A61P3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商杭州中美華東製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANGZHOU ZHONGMEIHUADONG PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱榮遙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, RONGYAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭劉斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, LIUBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭皓文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, HAOWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范未偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, WEIWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　東舟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, DONGZHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及一種包含恩格列淨或其藥學上可接受的鹽和小分子GLP-1受體激動劑或其藥學上可接受的鹽的聯用藥物組合物和製劑藥物組合物，以及所述組合物在治療代謝類疾病和/或腎臟類疾病類中的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1638" publication-number="202615440">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615440</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133941</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組成物、膜、濾光器、固體攝像元件、圖像顯示裝置、紅外線感測器、相機模組、化合物及紅外線吸收劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07F5/02</main-classification>
        <further-classification edition="200601120260102B">C09B7/00</further-classification>
        <further-classification edition="200601120260102B">C09K3/00</further-classification>
        <further-classification edition="200601120260102B">C08K5/55</further-classification>
        <further-classification edition="200601120260102B">C08L101/00</further-classification>
        <further-classification edition="200601120260102B">G02B1/04</further-classification>
        <further-classification edition="200601120260102B">G02B5/20</further-classification>
        <further-classification edition="200601120260102B">G02B5/22</further-classification>
        <further-classification edition="202101120260102B">G03B11/00</further-classification>
        <further-classification edition="202501120260102B">H10F39/00</further-classification>
        <further-classification edition="202501120260102B">H10F39/12</further-classification>
        <further-classification edition="202501120260102B">H10F39/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松村季彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMURA, TOKIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種組成物，其包含由式（1）或式（2）表示之化合物、硬化性化合物及溶劑；式（1）中，M&lt;sup&gt;1&lt;/sup&gt;與X&lt;sup&gt;1&lt;/sup&gt;經由單鍵或2價連結基鍵結，式（2）中，M&lt;sup&gt;11&lt;/sup&gt;與X&lt;sup&gt;11&lt;/sup&gt;經由單鍵或2價連結基鍵結。本發明亦提供一種使用了前述組成物之膜、濾光器、固體攝像元件、圖像顯示裝置、紅外線感測器及相機模組。  &lt;br/&gt;&lt;img align="absmiddle" height="210px" width="518px" file="ed10042.JPG" alt="ed10042.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">110:固體攝像元件</p>
        <p type="p">111:紅外線截止濾波器</p>
        <p type="p">112:濾色器</p>
        <p type="p">114:紅外線透射濾波器</p>
        <p type="p">115:微透鏡</p>
        <p type="p">116:平坦化層</p>
        <p type="p">hν:入射光</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1639" publication-number="202616094">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616094</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133946</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置、記憶體系統及操作記憶體裝置之方法</chinese-title>
        <english-title>MEMORY DEVICE, MEMORY SYSTEM, AND METHOD OF OPERATING THE MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251208B">G06F13/38</main-classification>
        <further-classification edition="200601120251208B">G06F13/14</further-classification>
        <further-classification edition="201601120251208B">G06F12/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭進勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, JINHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭俊鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, JUNHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金大暎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DAEYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴基碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, KI-SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭珉校</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, MIN-GYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓基悳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, KIDEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種記憶體裝置、一種記憶體系統及一種操作該記憶體裝置之方法。該記憶體裝置包括：一記憶體胞元陣列，其包括複數個記憶體胞元；一控制邏輯電路，其經組態以基於自一記憶體控制器接收之一再新命令而執行該記憶體胞元陣列之一再新操作；一輸入/輸出電路，其經組態以將儲存於該記憶體胞元陣列中之使用者資料傳輸至該記憶體控制器；以及一模式暫存器，其經組態以儲存與該記憶體裝置相關之模式暫存器資訊資料，且在該控制邏輯電路之控制下透過該輸入/輸出電路輸出該模式暫存器資訊資料。該控制邏輯電路進一步經組態以回應於自該記憶體控制器接收之一再新模式暫存器讀取命令而在該再新操作之一再新執行時間期間執行該記憶體胞元陣列之該再新操作及控制該模式暫存器輸出該模式暫存器資訊資料之一操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device, a memory system, and a method of operating the memory device are provided. The memory device includes a memory cell array including a plurality of memory cells, a control logic circuit configured to perform a refresh operation of the memory cell array based on a refresh command received from a memory controller, an input/output circuit configured to transmit user data stored in the memory cell array to the memory controller, and a mode register configured to store mode register information data related to the memory device and output the mode register information data through the input/output circuit under controlling of the control logic circuit. The control logic circuit is configured further to perform, in response to a refresh mode register read command received from the memory controller, the refresh operation of the memory cell array and an operation of controlling the mode register to output the mode register information data during a refresh execution time of the refresh operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:模式暫存器</p>
        <p type="p">1000:記憶體系統</p>
        <p type="p">1100:記憶體裝置</p>
        <p type="p">1130:位元線感測放大器</p>
        <p type="p">1150:控制邏輯</p>
        <p type="p">1160:輸入/輸出電路</p>
        <p type="p">1200:記憶體控制器</p>
        <p type="p">MRID:模式暫存器資訊資料</p>
        <p type="p">REF:再新操作信號</p>
        <p type="p">REFMRR:再新模式暫存器讀取命令</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1640" publication-number="202615009">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615009</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133950</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有MYT1抑制活性之含氮雜環化合物的晶體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">A61K31/438</main-classification>
        <further-classification edition="200601120260113B">A61K31/416</further-classification>
        <further-classification edition="200601120260113B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商中外製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUGAI SEIYAKU KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>猪俣祐貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOMATA, YUUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井出貴文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDE, TAKAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供具有MYT1的抑制活性之化合物或者其鹽或其等的溶劑合物的晶體。下述式（1）所表示之化合物或者其鹽或其等的溶劑合物的晶體。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="225px" width="260px" file="ed10097.JPG" alt="ed10097.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1641" publication-number="202616571">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616571</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133964</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>第一端子模組以及第一背板連接器</chinese-title>
        <english-title>FIRST TERMINAL MODULE AND FIRST BACKPLANE CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251001B">H01R13/05</main-classification>
        <further-classification edition="200601120251001B">H01R13/652</further-classification>
        <further-classification edition="201101120251001B">H01R12/71</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立訊技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉琨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李興玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XINGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭金闖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAN, JINCHUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪元鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YUANXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>苟中凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOU, ZHONGFA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種第一端子模組包括絕緣支架以及複數第一導電端子。每一個第一導電端子包括第一接觸部、第一尾部以及連接前述第一接觸部與前述第一尾部的第一連接部。前述第一連接部至少部分固定於前述絕緣支架。前述第一導電端子包括第一訊號端子以及第二訊號端子。前述第一訊號端子的第一尾部包括第一蛇形部以及自前述第一蛇形部延伸的第一末梢部。前述第一末梢部配置為與電路板相抵接且與前述電路板電性連接。如此設置，藉由設置前述第一蛇形部，本發明有利於改善訊號傳輸的品質。本發明還揭示了一種具有前述第一端子模組的第一背板連接器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A first terminal module includes an insulating bracket and a plurality of first conductive terminals. Each first conductive terminal includes a first contact portion, a first tail portion, and a first connecting portion that connects the first contact portion and the first tail portion. The first connecting portion is at least partially fixed to the insulating bracket. The first conductive terminals include a first signal terminal and a second signal terminal. The first tail portion of the first signal terminal includes a first serpentine portion and a first tip portion extending from the first serpentine portion. The first tip portion is configured to abut against and electrically connect with a circuit board. With this arrangement, by providing the first serpentine portion, the present invention is beneficial for improving the quality of signal transmission. Besides, the present invention also discloses a first backplane connector having the first terminal module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2221a:第一單元</p>
        <p type="p">2221a1:第一橫樑部</p>
        <p type="p">2221a2:第一縱樑部</p>
        <p type="p">2221a3:第二縱樑部</p>
        <p type="p">2221a4:第一凹陷口</p>
        <p type="p">2221a5:第二凹陷口</p>
        <p type="p">2221b:第二單元</p>
        <p type="p">2221b1:第二橫樑部</p>
        <p type="p">2221b2:第三縱樑部</p>
        <p type="p">2221b3:第四縱樑部</p>
        <p type="p">2221b4:第三凹陷口</p>
        <p type="p">2221b5:第四凹陷口</p>
        <p type="p">2221c:第三單元</p>
        <p type="p">2221c1:第三橫樑部</p>
        <p type="p">2221c2:第五縱樑部</p>
        <p type="p">2221c3:第六縱樑部</p>
        <p type="p">2221c4:第五凹陷口</p>
        <p type="p">2221c5:第六凹陷口</p>
        <p type="p">2221d1:第一狹縫</p>
        <p type="p">2221d2:第二狹縫</p>
        <p type="p">2222:第一末梢部</p>
        <p type="p">3011:第一訊號端子安裝孔</p>
        <p type="p">A3-A3:第三方向</p>
        <p type="p">L:圖66中畫框部分</p>
        <p type="p">S1:第一訊號端子</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1642" publication-number="202616744">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616744</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133974</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>裝置之間的通訊對話之證明及認證</chinese-title>
        <english-title>ATTESTATION AND AUTHENTICATION FOR COMMUNICATION SESSIONS BETWEEN DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260102B">H04W12/06</main-classification>
        <further-classification edition="201301120260102B">G06F21/32</further-classification>
        <further-classification edition="201801120260102B">H04W4/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>考特恩　賈斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAUTHEN, JUSTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索曼　梅于爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOMAN, MEHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧迪彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENG, DIYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙希德　瑙曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAHID, NAUMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫爾卡尼　雷希米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KULKARNI, RASHMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔維蒂　尼薩爾　庫爾拜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRIVEDI, NISARG KEYURBHAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供用於無線通訊的系統及技術。第一裝置可接收欲起始第二裝置與該第一裝置之間的通訊對話之請求，該請求包括呼叫者證明資訊，該呼叫者證明資訊對應於該第二裝置之使用者且由該第二裝置基於自該第二裝置中所包括之一或多個感測器獲得之資訊而判定。可基於對欲起始該通訊對話之該請求中所包括之該呼叫者證明資訊和與該第一裝置之使用者相關聯之認證組態資訊進行比較而判定對應於該請求之認證結果。可基於該認證結果藉由基於該認證結果而處理對應於該第一裝置之該使用者之生物特徵資訊之一或多個輸入來對該第二裝置與該第一裝置之間的該通訊對話進行組態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and techniques are provided for wireless communications. A first device can receive a request to initiate a communication session between a second device and the first device, the request including caller attestation information corresponding to a user of the second device and determined by the second device based on information obtained from one or more sensors included in the second device. An authentication result corresponding to the request to initiate the communication session can be determined, based on comparing the caller attestation information included in the request with authentication configuration information associated with a user of the first device. The communication session between the second device and the first device can be configured based on the authentication result, by processing one or more inputs corresponding to biometric information of the user of the first device based on the authentication result.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:交互式通訊對話/通訊對話</p>
        <p type="p">302:呼叫接收者使用者裝置/呼叫接收者裝置/呼叫接收者/使用者運算裝置</p>
        <p type="p">305:呼叫接收者使用者/使用者</p>
        <p type="p">306:攝影機</p>
        <p type="p">308:麥克風</p>
        <p type="p">310:方塊</p>
        <p type="p">320:方塊</p>
        <p type="p">330:方塊</p>
        <p type="p">340:方塊</p>
        <p type="p">350:第一組態/方塊/受限的生物特徵資料共用組態</p>
        <p type="p">356:覆疊物/覆疊物遮罩/已混淆影像資料/已降級或已混淆使用者影像或視訊資料</p>
        <p type="p">358:已混淆音訊輸入/已混淆音訊資料/已降級或已混淆使用者音訊</p>
        <p type="p">360:第二組態/方塊</p>
        <p type="p">366:原始或非降級影像資料</p>
        <p type="p">368:原始或非降級音訊資料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1643" publication-number="202615068">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615068</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134006</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於抑制誘導細胞死亡的DFFA樣效應子B（CIDEB）表達的組合物和方法</chinese-title>
        <english-title>COMPOSITIONS AND METHODS FOR INHIBITING EXPRESSION OF CELL DEATH INDUCING DFFA LIKE EFFECTOR B (CIDEB)</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">A61K31/7088</main-classification>
        <further-classification edition="201001120260107B">C12N15/113</further-classification>
        <further-classification edition="200601120260107B">A61P3/00</further-classification>
        <further-classification edition="200601120260107B">A61P35/00</further-classification>
        <further-classification edition="200601120260107B">A61P9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海舶望製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI ARGO BIOPHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒東旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHU, DONGXU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了可用於減少誘導細胞死亡的dffa樣效應子b（CIDEB）基因的表達以及用於治療與CIDEB相關的疾病和病況的組合物和方法。本發明提供了可用於降低細胞和受試者中CIDEB表達的CIDEB dsRNA藥劑、CIDEB反義多核苷酸藥劑、包括CIDEB dsRNA藥劑的組合物和包括CIDEB反義多核苷酸藥劑的組合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Compositions and methods useful to reduce expression of cell death inducing dffa like effector b (CIDEB) gene and for treatment of CIDEB-associated diseases and conditions are provided. Provided are CIDEB dsRNA agents, CIDEB antisense polynucleotide agents, compositions comprising CIDEB dsRNA agents, and compositions comprising CIDEB antisense polynucleotide agents that can be used to reduce CIDEB expression in cells and subjects.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1644" publication-number="202616777">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616777</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134044</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電氣裝置線路濾波器</chinese-title>
        <english-title>ELECTRICAL DEVICE LINE FILTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">H05H1/36</main-classification>
        <further-classification edition="200601120260113B">H01J37/02</further-classification>
        <further-classification edition="200601120260113B">H03H7/075</further-classification>
        <further-classification edition="200601120260113B">H01L21/301</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭　岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫薩　丹尼斯馬丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOOSAU, DENIS MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴許　施里拉姆喬蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DASH, SHREERAM JYOTI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉馬斯瓦米　卡提克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMASWAMY, KARTIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露描述了一種用於處理腔室加熱器線路的濾波器組件。該濾波器組件包括第一阻抗產生元件、第一空心電感器和第二空心電感器。第一阻抗產生元件包括繞在第一環形核心上的第一導電引線和第二導電引線。第一導電引線的第一端和第二導電引線的第一端耦接到電氣裝置的輸出。第一空心電感器與第一導電引線電連接。第二空心電感器與第二導電引線電連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure describes a filter assembly for a heater line of a processing chamber. The filter assembly includes a first impedance producing element, a first air core inductor, and a second air core inductor. The first impedance producing element includes a first conductive lead and a second conductive lead wound around a first toroid shaped core. A first end of the first conductive lead and a first end of the second conductive lead are coupled to an output of an electric device. The first air core inductor is electrically connected with the first conductive lead. The second air core inductor is electrically connected with the second conductive lead.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:處理腔室</p>
        <p type="p">102:腔室主體</p>
        <p type="p">104:感應線圈</p>
        <p type="p">106:處理空間</p>
        <p type="p">107:處理電漿</p>
        <p type="p">110:基板</p>
        <p type="p">111:基板支撐</p>
        <p type="p">111A:ESC基板支撐</p>
        <p type="p">111B:支撐底座</p>
        <p type="p">111C:絕緣體板</p>
        <p type="p">112:偏壓電極</p>
        <p type="p">113:加熱元件</p>
        <p type="p">114:導電元件</p>
        <p type="p">115:接收面</p>
        <p type="p">116:氣體進口</p>
        <p type="p">117:基板支撐組件</p>
        <p type="p">120:處理氣源</p>
        <p type="p">122:側壁</p>
        <p type="p">123:腔室蓋</p>
        <p type="p">124:腔室底座</p>
        <p type="p">127:真空出口</p>
        <p type="p">134:系統控制器</p>
        <p type="p">137:接地板</p>
        <p type="p">138:支撐軸</p>
        <p type="p">140:源組件</p>
        <p type="p">141:RF匹配電路</p>
        <p type="p">142:電源</p>
        <p type="p">150:電源發生器</p>
        <p type="p">151:傳輸線</p>
        <p type="p">155:高壓模組</p>
        <p type="p">160:濾波器組件</p>
        <p type="p">165:AC電源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1645" publication-number="202615666">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615666</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134055</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>工程化腺相關病毒殼體蛋白及其用途</chinese-title>
        <english-title>ENGINEERED ADENO-ASSOCIATED VIRUS CAPSID PROTEIN AND THE USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C12N15/861</main-classification>
        <further-classification edition="200601120260105B">A61K31/7088</further-classification>
        <further-classification edition="200601120260105B">A61K48/00</further-classification>
        <further-classification edition="200601120260105B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商四川至善唯新生物科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SICHUAN REAL&amp;BEST BIOTECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董飆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONG, BIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冷蜜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LENG, MI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種工程化AAV，其包含工程化殼體蛋白，該殼體蛋白包含插入親本AAV殼體蛋白可變區的7肽。工程化AAV具有比包含親本AAV殼體蛋白的AAV更好或與之相似的細胞轉導效率。本發明還涉及使用工程化AAV的基因編輯方法和用於治療疾病的基因編輯產品。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to an engineered AAV, comprising an engineered capsid protein comprising a 7-mer peptide inserted into the variable region of a parental AAV capsid protein. The engineered AAV has a better or similar cell transduction efficiency as an AAV comprising the parental AAV capsid protein. The present disclosure further relates to gene editing method using the engineered AAV, and the gene editing product for use in the treatment of diseases.</p>
      </isu-abst>
      <representative-img>
        <p type="p">Cap2:殼體蛋白</p>
        <p type="p">NGS:高通量測序</p>
        <p type="p">Rep2:複製蛋白</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1646" publication-number="202615290">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615290</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134057</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有用於兩個握把的致動器之整合的自行車控制</chinese-title>
        <english-title>INTEGRATED BICYCLE CONTROL WITH ACTUATOR SUITABLE FOR TWO GRIPS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B62K23/02</main-classification>
        <further-classification edition="200601120260102B">B62L3/02</further-classification>
        <further-classification edition="200601120260102B">B62K23/06</further-classification>
        <further-classification edition="200601120260102B">B62M25/04</further-classification>
        <further-classification edition="200601120260102B">B62M25/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商坎帕克諾羅公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAMPAGNOLO S.R.L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅喬藍　瑪莉歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEGGIOLAN, MARIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波維　菲力保</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOVE, FILIPPO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史傑法　尼可拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SGREVA, NICOLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">整合的控制包括：&lt;br/&gt;  -   一控制主體(11)，&lt;br/&gt;  -   該控制主體(11)之一後抵接區(12)，該後抵接區(12)意欲在該控制安裝在該手把(M)上時與該手把(M)接觸，&lt;br/&gt;  -   一制動桿(18)，該制動桿(18)根據與該後抵接區(12)間隔開之橫向於該控制主體(11)之一樞軸線(X)樞接至該控制主體(11)，&lt;br/&gt;  -   一開關(32)，該開關(32)用於向一電子裝置發送一電訊號，&lt;br/&gt;  -   一致動器(20)，該致動器(20)放置在該控制主體(11)之一側面(14)上，在該後抵接區(12)與該橫向樞軸線(X)之間，安裝為在該控制主體(11)上可成角度地移動以便能夠將一壓力轉移至該開關(32)。&lt;br/&gt;  該致動器(20)包括兩個不同壓力區(41、42)，該兩個不同壓力區以不同方式定向，以便促進當一自行車騎士在兩個不同位置中抓握該手把(M)時藉由他/她之一拇指致動該致動器(20)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The integrated control comprises:&lt;br/&gt; - a control body (11),&lt;br/&gt; - a rear abutment zone (12) of the control body (11), intended to be in contact with the handlebar (M) when the control is mounted on the handlebar (M),&lt;br/&gt; - a brake lever (18) pivoted to the control body (11) according to a pivot axis (X) transverse to the control body (11), spaced from the rear abutment zone (12),&lt;br/&gt; - a switch (32) for sending an electrical signal to an electronic device,&lt;br/&gt; - an actuator (20) placed on a flank (14) of the control body (11), between the rear abutment zone (12) and the transverse pivot axis (X), mounted movable angularly on the control body (11) so as to be able to transfer a pressure to the switch (32).&lt;br/&gt; The actuator (20) comprises two distinct pressure zones (41, 42), oriented differently, so as to facilitate the actuation of the actuator (20) by a thumb of a cyclist when he/she grips the handlebar (M) in two different positions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:左整合的控制、控制、整合的控制</p>
        <p type="p">11:控制主體</p>
        <p type="p">12:後抵接區、抵接區</p>
        <p type="p">14:側面、內側面</p>
        <p type="p">15:下側</p>
        <p type="p">16:上側</p>
        <p type="p">17:前端</p>
        <p type="p">18:制動桿</p>
        <p type="p">19:塗層護套、護套</p>
        <p type="p">20:致動器</p>
        <p type="p">21:管狀座</p>
        <p type="p">23:推桿</p>
        <p type="p">29:墊圈</p>
        <p type="p">30:腔</p>
        <p type="p">31:電子板</p>
        <p type="p">32:開關</p>
        <p type="p">33:板</p>
        <p type="p">34:螺絲</p>
        <p type="p">35:貫穿孔</p>
        <p type="p">37:周界座</p>
        <p type="p">38:孔眼</p>
        <p type="p">39:貫穿孔</p>
        <p type="p">50:另外之致動器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1647" publication-number="202615343">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615343</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134059</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一氧化碳的製造方法及二氧化碳向一氧化碳的轉化方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260105B">C01B32/40</main-classification>
        <further-classification edition="202501120260105B">C01G53/66</further-classification>
        <further-classification edition="202501120260105B">C01G51/66</further-classification>
        <further-classification edition="200601120260105B">B01D3/00</further-classification>
        <further-classification edition="201001120260105B">C01G99/00</further-classification>
        <further-classification edition="200601120260105B">B01J23/58</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永長久寛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EINAGA, HISAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>椿俊太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUBAKI, SHUNTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>手塚記庸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEZUKA, NORIYASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤孝志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示的CO的製造方法的一態樣包括：在包含CO&lt;sub&gt;2&lt;/sub&gt;的氣體的氣氛下，對包含金屬及金屬氧化物的混合物照射微波；以及在包含CO&lt;sub&gt;2&lt;/sub&gt;的氣體的氣氛下，使烴與正經所述微波照射的所述混合物接觸，所述金屬為包含選自Fe、Co、Ni、Mn、Cu及Ti中的至少一種金屬元素的金屬，所述金屬氧化物為選自通式（1）：MaMbO&lt;sub&gt;3&lt;/sub&gt;[Ma表示選自鹼土金屬及鑭系元素中的一種金屬元素，Mb表示與所述金屬所包含的金屬元素相同的金屬元素]所表示的化合物中的至少一種金屬氧化物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1648" publication-number="202615879">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615879</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134069</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>干擾波電力測定裝置及干擾波電力測定方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G01R29/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木晉介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, SHINSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大西敏輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONISHI, TOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安井雄大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YASUI, YUDAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種可以用簡單的構成來測定干擾波電力的干擾波電力測定裝置。&lt;br/&gt;  干擾波電力測定裝置100具備：電源纜線11，連接電源PS與電氣機器EP；天線12，接收來自電源纜線11的放射雜訊；基材2，固定電源纜線11與天線12；及分析器4，求出放射雜訊的頻譜SP，電源纜線11是固定於基材2，天線12是以沿著電源纜線11的方式固定於基材2或電源纜線11。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:基材</p>
        <p type="p">3:放大器</p>
        <p type="p">4:分析器</p>
        <p type="p">5:殼體</p>
        <p type="p">11:電源纜線</p>
        <p type="p">12:天線</p>
        <p type="p">13:接地線</p>
        <p type="p">21:第1基材</p>
        <p type="p">22:第2基材</p>
        <p type="p">23:第3基材</p>
        <p type="p">41:控制部</p>
        <p type="p">100:干擾波電力測定裝置</p>
        <p type="p">CB1:第1電源線</p>
        <p type="p">CB2:第2電源線</p>
        <p type="p">EP:電氣機器</p>
        <p type="p">LB:距離</p>
        <p type="p">P11:一端</p>
        <p type="p">P12,P21,P22,P31:端部位置</p>
        <p type="p">P32:另一端</p>
        <p type="p">PS:電源</p>
        <p type="p">SL:訊號線</p>
        <p type="p">VA:箭頭</p>
        <p type="p">X:X軸</p>
        <p type="p">Y:Y軸</p>
        <p type="p">Z:Z軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1649" publication-number="202615493">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615493</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134074</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">C08F2/50</main-classification>
        <further-classification edition="200601120260115B">G05D5/02</further-classification>
        <further-classification edition="200601120260115B">G01B11/14</further-classification>
        <further-classification edition="200601120260115B">C08G63/195</further-classification>
        <further-classification edition="200601120260115B">B32B27/30</further-classification>
        <further-classification edition="200601120260115B">H01L21/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商旭化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳翔太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANAGI, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種感光性元件，其係感光性樹脂組成物層較薄且能夠形成高解析之光阻圖案，並且抑制起因於支撐膜之光阻圖案之缺陷，能夠使導體圖案之製造良率提升。於一態樣中，係提供一種感光性元件，其係含有支撐膜、及感光性樹脂組成物層；其中，（1）前述感光性樹脂組成物層之厚度係30μm以下；（2）能夠解析10μmφ以下之正圓孔圖案；（3）於前述支撐膜之內部存在之長徑5μm~30μm之異物之個數係0.0004個/mm&lt;sup&gt;2&lt;/sup&gt;以下；（4）前述長徑5μm~30μm之異物之中，在具有數值孔徑0.6之物鏡之光學顯微鏡下可觀測到之不具有空洞之異物之個數比率係50%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1650" publication-number="202616747">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616747</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134084</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用者設備的單一控制器互動</chinese-title>
        <english-title>SINGLE CONTROLLER INTERACTION FOR USER EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260102B">H04W36/18</main-classification>
        <further-classification edition="200901120260102B">H04W36/00</further-classification>
        <further-classification edition="200901120260102B">H04W84/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴特拉　瑪楊克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BATRA, MAYANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連斯基　喬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINSKY, JOEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫格　麥克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINGE, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維吉　佳金德辛格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIJ, GAJINDER SINGH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露之各種態樣大致上係關於無線通訊。在一些態樣中，一第一控制器裝置可接收來自一使用者設備(user equipment, UE)的一連接請求。該第一控制器裝置可將指示該第一控制器裝置與該UE之間的一連接或一潛在連接的一連接訊息傳輸至一中央裝置。該第一控制器裝置可接收來自該中央裝置的一第一交遞訊息。該第一控制器裝置可至少部分地基於該第一交遞訊息而執行該UE至一第二控制器裝置的一第一交遞。描述多種其他態樣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a first controller device may receive a connection request from a user equipment (UE). The first controller device may transmit, to a central device, a connection message that indicates a connection or a potential connection between the first controller device and the UE. The first controller device may receive a first handover message from the central device. The first controller device may perform a first handover of the UE to a second controller device based at least in part on the first handover message. Numerous other aspects are described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:實例</p>
        <p type="p">402:UE</p>
        <p type="p">404:中央裝置</p>
        <p type="p">406:第一控制器</p>
        <p type="p">408:第二控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1651" publication-number="202616740">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616740</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134096</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>交換廠商標識的方法和設備</chinese-title>
        <english-title>METHODS AND APPARATUS FOR VENDOR IDENTIFICATION EXCHANGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260102B">H04W4/02</main-classification>
        <further-classification edition="200901120260102B">H04W8/26</further-classification>
        <further-classification edition="200901120260102B">H04W88/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　國鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KUO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃鏗銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, KENG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉仁倩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JEN-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉仁煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, REN-HUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐家俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIA-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了交換廠商標識的方法和設備，其中一種交換廠商標識的方法包括：由使用者設備UE的處理器與網路交換廠商資訊，其中該廠商資訊包括以下之一或兩者：廠商標識ID；以及廠商版本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and apparatus for vendor identification exchange are provided. In one aspect, a method may involve exchanging, by a processor of a user equipment (UE), vendor information with a network. The vendor information may include either or both of the following: a vendor ID; and a vendor version.</p>
      </isu-abst>
      <representative-img>
        <p type="p">900:過程</p>
        <p type="p">910-918:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1652" publication-number="202615650">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615650</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134130</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>投藥同種異體嵌合抗原受體T細胞之方法及組合物</chinese-title>
        <english-title>METHODS AND COMPOSITIONS FOR DOSING OF ALLOGENEIC CHIMERIC ANTIGEN RECEPTOR T CELLS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260112B">C12N5/0783</main-classification>
        <further-classification edition="202501120260112B">A61K35/17</further-classification>
        <further-classification edition="200601120260112B">A61K31/573</further-classification>
        <further-classification edition="200601120260112B">A61K31/661</further-classification>
        <further-classification edition="200601120260112B">A61K31/7076</further-classification>
        <further-classification edition="200601120260112B">A61K39/395</further-classification>
        <further-classification edition="200601120260112B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商異基因治療有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALLOGENE THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商施維雅藥廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LES LABORATOIRES SERVIER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>空特　賽利爾　艾克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONTO, CYRIL ALKIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麗奈　阿米納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZINAI, AMINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於用於治療易患或診斷患有諸如癌症疾病之劑量。本發明提供用於投與嵌合抗原受體(chimeric antigen receptor，CAR) -T細胞之方法。本發明亦提供該等方法中所用之組合物及製品。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure concerns dosages for the treatment of human patients susceptible to or diagnosed with a disease, such as cancer. Provided are methods for administering chimeric antigen receptor (CAR)-T cells. Also provided are compositions and articles of manufacture for use in the methods.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1653" publication-number="202616719">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616719</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134152</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用有損參考幀的視訊解碼</chinese-title>
        <english-title>VIDEO DECODING WITH LOSSY REFERENCE FRAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260102B">H04N19/44</main-classification>
        <further-classification edition="201401120260102B">H04N19/423</further-classification>
        <further-classification edition="201401120260102B">H04N19/132</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　勝奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHENGQI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昌鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHANGHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哥布里　賽　卡夏普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOBBURI, SAI KASHYAP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於解碼視訊資料的裝置包括：積體電路(IC)，其包含視訊解碼器；及記憶體，其在IC外部並耦接至IC。視訊解碼器經組態以：在第一模式下，基於儲存在記憶體中的第一參考幀來解碼第一幀；及在第二模式下，基於第二有損參考幀來解碼第二幀，其中第二有損參考幀係基於經有損壓縮參考幀的解壓縮來產生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device for decoding video data includes an integrated circuit (IC) comprising a video decoder, and a memory that is external to the IC and coupled to the IC. The video decoder is configured to in a first mode, decode a first frame based on a first reference frame stored in the memory, and in a second mode, decode a second frame based on a second lossy reference frame, wherein the second lossy reference frame is generated based on decompression of a lossy compressed reference frame.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:運算裝置；裝置；電腦裝置</p>
        <p type="p">202:積體電路(IC)</p>
        <p type="p">204:系統快取記憶體</p>
        <p type="p">206:視訊解碼器</p>
        <p type="p">208:中央處理單元(CPU)</p>
        <p type="p">210:圖形處理單元(GPU)</p>
        <p type="p">212:本端快取記憶體</p>
        <p type="p">214:壓縮電路系統</p>
        <p type="p">216:解壓縮電路系統</p>
        <p type="p">218:內部匯流排；匯流排</p>
        <p type="p">220:使用者介面</p>
        <p type="p">222:記憶體控制器</p>
        <p type="p">224:顯示介面</p>
        <p type="p">228:系統記憶體；記憶體</p>
        <p type="p">230:顯示器</p>
        <p type="p">232:匯流排</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1654" publication-number="202616604">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616604</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134154</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>單相控制三相四線電源轉換器</chinese-title>
        <english-title>SINGLE PHASE CONTROLLED 3-PHASE 4 WIRE POWER CONVERTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">H02J3/36</main-classification>
        <further-classification edition="200601120260113B">H02M7/217</further-classification>
        <further-classification edition="200601120260113B">H02M1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商西屋電器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WESTINGHOUSE ELECTRIC COMPANY LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史威特　史考特　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SWEAT, SCOTT M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>依澤勞拉布　易卜拉辛　Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EZELARAB, IBRAHIM B.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種三相電源轉換器包括一轉換器電路，用以將以下耦合至交流發電機：一第一電壓，其具有一第一振幅及一第一相位；一第二電壓，其具有一第二振幅及一第二相位；及一第三電壓，其具有一第三振幅及一第三相位。該轉換器電路包括具有交流發電機閘極驅動器及電網閘極驅動器之一組合器電路。該電源轉換器包括一高壓DC鏈路及一控制電路，用以：自該交流發電機接收具有該等第一、第二及第三振幅及相位之該等第一、第二及第三電壓；控制該複數個交流發電機閘極驅動器及該複數個電網閘極驅動器以組合具有該等第一、第二及第三振幅及相位之該等第一、第二及第三電壓；且基於該等第一、第二及第三電壓之該組合而輸出具有一幅度及一相位之一輸出電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A three-phase power converter comprises a converter circuit to couple to the alternator: a first voltage at a first amplitude and a first phase, a second voltage at a second amplitude and a second phase, and a third voltage at a third amplitude and a third phase. The converter circuit comprises a combiner circuit comprising alternator gate drivers and grid gate drivers. The power converter comprising a high voltage DC link and a control circuit to: receive the first, second, and third voltages at the first, second, and third amplitudes and phases from the alternator; control the plurality of alternator gate drivers and the plurality of grid gate drivers to combine the first, second, and third voltages at the first, second, and third amplitudes and phases; and output an output voltage at an amplitude and a phase based on the combination of the first, second, and third voltages.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100-1:第一電路</p>
        <p type="p">100-2:第二電路</p>
        <p type="p">100-3:第三電路</p>
        <p type="p">102A:第一轉換器</p>
        <p type="p">102B:第二轉換器</p>
        <p type="p">102C:第一轉換器</p>
        <p type="p">102D:第二轉換器</p>
        <p type="p">102E:第一轉換器</p>
        <p type="p">102F:第二轉換器</p>
        <p type="p">104A:電網側高頻濾波器</p>
        <p type="p">104B:電網側高頻濾波器</p>
        <p type="p">104C:電網側高頻濾波器</p>
        <p type="p">104D:電網側高頻濾波器</p>
        <p type="p">104E:電網側高頻濾波器</p>
        <p type="p">104F:電網側高頻濾波器</p>
        <p type="p">106A:第二交流發電機管線濾波器</p>
        <p type="p">106B:第二交流發電機管線濾波器</p>
        <p type="p">106C:第二交流發電機管線濾波器</p>
        <p type="p">106D:第二交流發電機管線濾波器</p>
        <p type="p">106E:第二交流發電機管線濾波器</p>
        <p type="p">106F:第二交流發電機管線濾波器</p>
        <p type="p">108A:第一交流發電機管線濾波器</p>
        <p type="p">108B:第一交流發電機管線濾波器</p>
        <p type="p">108C:第一交流發電機管線濾波器</p>
        <p type="p">108D:第一交流發電機管線濾波器</p>
        <p type="p">108E:第一交流發電機管線濾波器</p>
        <p type="p">108F:第一交流發電機管線濾波器</p>
        <p type="p">110A:轉換器電源電子模組</p>
        <p type="p">110B:轉換器電源電子模組</p>
        <p type="p">110C:轉換器電源電子模組</p>
        <p type="p">110D:轉換器電源電子模組</p>
        <p type="p">110E:轉換器電源電子模組</p>
        <p type="p">110F:轉換器電源電子模組</p>
        <p type="p">112:電網側管線濾波器</p>
        <p type="p">130:三相轉換器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1655" publication-number="202615452">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615452</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134167</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>編輯目標RNA之方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">C07K14/415</main-classification>
        <further-classification edition="200601120260109B">C12N15/29</further-classification>
        <further-classification edition="200601120260109B">C12N15/52</further-classification>
        <further-classification edition="200601120260109B">C12N5/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商基因編輯力股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EDITFORCE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>一瀬瑞穂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHINOSE, MIZUHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古德曼　伯納德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUTMANN, BERNARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>八木祐介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAGI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赤岩友美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKAIWA, YUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>島尻恭香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMAJIRI, YASUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村崇裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種將目標RNA中包含之編輯目標C轉化為U、或將編輯目標U轉化為C之方法。本發明之編輯目標RNA之方法係將包含如下DYW域之人工DYW蛋白應用於目標RNA，上述DYW域包含下述a、b、c、及bc之任一多肽：a.具有x&lt;sub&gt;a1&lt;/sub&gt;PGx&lt;sub&gt;a2&lt;/sub&gt;SWIEx&lt;sub&gt;a3&lt;/sub&gt;-x&lt;sub&gt;a16&lt;/sub&gt;HP…Hx&lt;sub&gt;aa&lt;/sub&gt;E…Cx&lt;sub&gt;a17&lt;/sub&gt;x&lt;sub&gt;a18&lt;/sub&gt;CH…DYW，與SEQ ID NO：1之序列具有至少40%之序列同一性，且具有C-to-U/U-to-C編輯活性之多肽；b.具有x&lt;sub&gt;b1&lt;/sub&gt;PGx&lt;sub&gt;b2&lt;/sub&gt;SWWTDx&lt;sub&gt;b3&lt;/sub&gt;-x&lt;sub&gt;b16&lt;/sub&gt;HP…Hx&lt;sub&gt;bb&lt;/sub&gt;E…Cx&lt;sub&gt;b17&lt;/sub&gt;x&lt;sub&gt;b18&lt;/sub&gt;CH…DYW，與SEQ ID NO：2之序列具有至少40%之序列同一性，且具有C-to-U/U-to-C編輯活性之多肽；c.具有KPAx&lt;sub&gt;c1&lt;/sub&gt;Ax&lt;sub&gt;c2&lt;/sub&gt;IEx&lt;sub&gt;c3&lt;/sub&gt;…Hx&lt;sub&gt;cc&lt;/sub&gt;E…Cx&lt;sub&gt;c4&lt;/sub&gt;x&lt;sub&gt;c5&lt;/sub&gt;CH…x&lt;sub&gt;c6&lt;/sub&gt;x&lt;sub&gt;c7&lt;/sub&gt;x&lt;sub&gt;c8&lt;/sub&gt;，與SEQ ID NO：3之序列具有至少40%之序列同一性，且具有C-to-U/U-to-C編輯活性之多肽；bc.具有x&lt;sub&gt;b1&lt;/sub&gt;PGx&lt;sub&gt;b2&lt;/sub&gt;SWWTDx&lt;sub&gt;b3&lt;/sub&gt;-x&lt;sub&gt;b16&lt;/sub&gt;HP…Hx&lt;sub&gt;cc&lt;/sub&gt;E…Cx&lt;sub&gt;c4&lt;/sub&gt;x&lt;sub&gt;c5&lt;/sub&gt;CH…Dx&lt;sub&gt;bc1&lt;/sub&gt;x&lt;sub&gt;bc2&lt;/sub&gt;，與SEQ ID NO：2之90之序列具有至少40%之序列同一性，且具有C-to-U/U-to-C編輯活性之多肽(序列中，x表示任意之胺基酸，…表示任意之多肽片段)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1656" publication-number="202615480">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615480</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134168</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療自身免疫性甲狀腺疾病的方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260106B">C07K16/28</main-classification>
        <further-classification edition="200601120260106B">A61K39/395</further-classification>
        <further-classification edition="200601120260106B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海賽增醫療科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI SCIZENG MEDICAL TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>衛培培</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, PEIPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫　杲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, GAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周倩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, QIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安夢瑤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AN, MENGYAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康立山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, LISHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王思勤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SIQIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了使用能夠特異性結合TSHR的抗體或其抗原結合片段治療自身免疫性甲狀腺疾病的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1657" publication-number="202615682">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615682</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134183</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>成膜裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251224B">C23C14/56</main-classification>
        <further-classification edition="200601120251224B">C23C14/34</further-classification>
        <further-classification edition="200601120251224B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商芝浦機械電子裝置股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBAURA MECHATRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大塚博司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種在真空槽內能夠防止加熱器等的電熱線部分的斷裂且自動地調整靶與工件之間的距離的成膜裝置。實施形態的成膜裝置包括：工作台，設置於進行成膜處理的真空槽內，載置工件；靶，與工作台相向地設置，包含成膜材料而形成；旋轉軸，貫通至真空槽的外部，設置成能夠向相對於靶接近/遠離的方向移動，並使工作台旋轉；加熱器，對載置於工作台的工件進行加熱；第一管，貫通至真空槽的外部，設置成能夠向相對於靶接近/遠離的方向移動，收容向加熱器供給電力的配線或收納有配線的護套；臂，在真空槽的外部與旋轉軸連接，支撐第一管；以及直線驅動機構，設置於真空槽的外部，使旋轉軸與第一管作為一體，使工作台向相對於靶接近/遠離的方向移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:成膜室</p>
        <p type="p">10a:蓋體</p>
        <p type="p">10b:隔離壁</p>
        <p type="p">10c:密封材</p>
        <p type="p">100:旋轉工作台</p>
        <p type="p">100a:工作台</p>
        <p type="p">100b:旋轉軸</p>
        <p type="p">100c:工作台用馬達</p>
        <p type="p">100d:密封材</p>
        <p type="p">100e:密封材</p>
        <p type="p">100f:殼體</p>
        <p type="p">101:外筒</p>
        <p type="p">101a:密封材</p>
        <p type="p">101b:密封材</p>
        <p type="p">101c:密封材</p>
        <p type="p">110:卡盤機構</p>
        <p type="p">120:加熱部位</p>
        <p type="p">130:加熱器</p>
        <p type="p">130a:發熱部</p>
        <p type="p">130b:非發熱部</p>
        <p type="p">140:管</p>
        <p type="p">140a:密封材</p>
        <p type="p">140b:密封材</p>
        <p type="p">141:外筒</p>
        <p type="p">141a:密封材</p>
        <p type="p">141b:密封材</p>
        <p type="p">141c:密封材</p>
        <p type="p">150:臂</p>
        <p type="p">170:排氣部</p>
        <p type="p">180:直線驅動機構</p>
        <p type="p">180a:線性引導件</p>
        <p type="p">180b:線性引導件用馬達</p>
        <p type="p">180c:旋轉軸支撐部</p>
        <p type="p">190:靶</p>
        <p type="p">S:基底</p>
        <p type="p">WH:工件支架</p>
        <p type="p">X、Y、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1658" publication-number="202614934">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614934</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134244</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>活性碳、用於吸煙製品的過濾器，以及包含該過濾器的吸煙製品</chinese-title>
        <english-title>ACTIVATED CARBON, FILTER FOR SMOKING ARTICLE, AND SMOKING ARTICLE CONTAINING THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">A24D3/04</main-classification>
        <further-classification edition="200601120260114B">A24D3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商韓國煙草人參股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KT&amp;G CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金守鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SOO HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安徹原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AN, CHEOL WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳敬煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, KYOUNG HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種氣相成分之去除能力優異之活性碳。根據一態樣，提供一種活性碳，其係包含孔隙之直徑未達2 nm之微孔(Micropore)者，以活性碳之整體孔隙體積為基準，上述微孔之比率為70至80 vol%，活性碳之BET比表面積為2,000 m&lt;sup&gt;2&lt;/sup&gt;/g以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:吸煙製品</p>
        <p type="p">10:過濾器部</p>
        <p type="p">20:介質部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1659" publication-number="202615226">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615226</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134272</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251203B">B25J9/22</main-classification>
        <further-classification edition="200601120251203B">B25J13/08</further-classification>
        <further-classification edition="200601120251203B">B25J19/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩瀨悠哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWASE, YUUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">機器人的控制裝置在1個實施形態中具備：力檢測部，檢測施加於機器人之外力；及修正部，修正以動作控制部來送出之動作指令。控制裝置具備：接觸判定部，判定以機器人裝置來操作之操作構件是否接觸到接觸物。接觸判定部根據施加於機器人之外力及機器人的動作速度，來判定機器人裝置或操作構件是否已接觸到接觸物。在判定為機器人裝置或操作構件已接觸到接觸物的情況下，修正部實施修正動作指令之控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:機器人</p>
        <p type="p">2:手部</p>
        <p type="p">3:機器人裝置</p>
        <p type="p">4:控制裝置本體</p>
        <p type="p">5:控制裝置</p>
        <p type="p">8:機器人系統</p>
        <p type="p">18:位置檢測器</p>
        <p type="p">19:機器人驅動馬達</p>
        <p type="p">28:扭矩感測器</p>
        <p type="p">40:動作程式</p>
        <p type="p">41:生成程式</p>
        <p type="p">42:記憶部</p>
        <p type="p">43:動作控制部</p>
        <p type="p">44:工具驅動部</p>
        <p type="p">45:機器人驅動部</p>
        <p type="p">49:教示操作盤</p>
        <p type="p">50:顯示部</p>
        <p type="p">51:輸入部</p>
        <p type="p">60:處理部</p>
        <p type="p">61:狀態取得部</p>
        <p type="p">62:教示點設定部</p>
        <p type="p">63:指令語句生成部</p>
        <p type="p">65:力檢測部</p>
        <p type="p">66:接觸判定部</p>
        <p type="p">67:動作指令部</p>
        <p type="p">68:修正部</p>
        <p type="p">69:通知控制部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1660" publication-number="202616358">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616358</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134279</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有多尺度晶圓應力調控的基板夾持</chinese-title>
        <english-title>SUBSTRATE CHUCKING WITH MULTISCALE WAFER STRESS MODULATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">H01L21/02</main-classification>
        <further-classification edition="200601120260114B">H01L21/268</further-classification>
        <further-classification edition="200601120260114B">G02F1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇柏拉曼央　普拉迪庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUBRAHMANYAN, PRADEEP KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　元在</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WONJAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的系統和技術旨在利用具有多尺度輻射劑量的應力補償光束改善基板的夾持。這些技術包括將基板變形的剖面分解為複數個諧波，並使用夾持能力參考資料識別複數個諧波中振幅高於由吸盤施加於基板的預定吸附壓力所能夠扁平化的最大振幅的一或多個諧波。這些技術進一步包括基於至少一或多個諧波的子集來決定應力調控光束的設置，在基板上形成應力補償層（stress-compensation layer; SCL），導致基板變形的修改，並用應力調控光束輻射SCL，其中應力調控光束導致基板變形的減少。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed systems and techniques are directed to improving chucking of substrates using stress-compensation beams with multiscale irradiation doses. The techniques include decomposing a profile of a deformation of a substrate into a plurality of harmonics, and identifying, using chuckability reference data, one or more harmonics of the plurality of harmonics having an amplitude above a maximum amplitude capable of being flattened by a predetermined clamping pressure exerted on the substrate by a chuck. The techniques further include determining, based at least on a subset of the one or more harmonics, settings of a stress-modulation beam, forming a stress-compensation layer (SCL) on the substrate causing a modification of the deformation of the substrate, and irradiating the SCL with the stress-modulation beam, wherein the stress-modulation beam causes a reduction of the deformation of the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:吸附能力參考資料</p>
        <p type="p">201:吸附能力曲線</p>
        <p type="p">202:吸附能力曲線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1661" publication-number="202615399">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615399</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134311</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光化射線性或感放射線性樹脂組成物、光阻膜、圖案形成方法、電子器件之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C65/10</main-classification>
        <further-classification edition="200601120260102B">C07C309/46</further-classification>
        <further-classification edition="200601120260102B">C07C309/49</further-classification>
        <further-classification edition="200601120260102B">C07C309/65</further-classification>
        <further-classification edition="200601120260102B">C07D219/06</further-classification>
        <further-classification edition="200601120260102B">C07D279/26</further-classification>
        <further-classification edition="200601120260102B">C09K3/00</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉岡知昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIOKA, TOMOAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種PED穩定性優異之感光化射線性或感放射線性樹脂組成物。本發明之感光化射線性或感放射線性樹脂組成物含有樹脂和選自由第一化合物及第二化合物所組成之群組中的至少一種光酸產生劑，其中，上述第一化合物為含有由式（1）表示的陰離子的鎓鹽，上述第二化合物包含含有-SO&lt;sub&gt;3&lt;/sub&gt;&lt;sup&gt;-&lt;/sup&gt;基及S&lt;sup&gt;+&lt;/sup&gt;原子的甜菜鹼結構，並且包含鍵結有兩個以上芳香環的N原子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1662" publication-number="202615994">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615994</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134313</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光裝置、曝光裝置、及加工裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">G03F7/20</main-classification>
        <further-classification edition="200601120260105B">H01L21/027</further-classification>
        <further-classification edition="200601120260105B">G02B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼康股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤正紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光裝置，其具備：第1波長轉換光學元件，其供包含具有第1波長之光的第1入射光入射，且使包含具有與前述第1波長不同之第2波長之光的第1出射光出射；第2波長轉換光學元件，其供包含具有第3波長之光的第2入射光入射，且使包含具有與前述第3波長不同之第4波長之光的第2出射光出射；合成裝置，其合成前述第1出射光之至少一部分與前述第2出射光之至少一部分，並出射合成光；以及控制裝置，其使前述第1入射光在前述第1波長轉換光學元件之入射面內之入射位置移動，且使前述第2入射光在前述第2波長轉換光學元件之入射面內之入射位置移動；前述控制裝置進行以下動作：使前述第1入射光在前述第1波長轉換光學元件之前述入射面之移動狀態與前述第2入射光在前述第2波長轉換光學元件之前述入射面之移動狀態不同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">50:光源部</p>
        <p type="p">51:雷射光源</p>
        <p type="p">52:外部調變器</p>
        <p type="p">60:放大部</p>
        <p type="p">61~63:光纖放大器</p>
        <p type="p">70:波長轉換部</p>
        <p type="p">71、72、72a~72h:波長轉換光學元件</p>
        <p type="p">73:半反射鏡</p>
        <p type="p">80、80a~80h:控制部</p>
        <p type="p">181a~181h:第1光源部~第8光源部</p>
        <p type="p">610、620:單包層光纖</p>
        <p type="p">615、625、635:激發光源</p>
        <p type="p">630:雙包層光纖</p>
        <p type="p">721、721a~721h:驅動裝置</p>
        <p type="p">731、731a~731h:監測器</p>
        <p type="p">La:放大光</p>
        <p type="p">Lp:激發光</p>
        <p type="p">Ls:種子光</p>
        <p type="p">Lv:輸出光</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1663" publication-number="202615563">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615563</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134357</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260102B">C08K3/013</main-classification>
        <further-classification edition="200601120260102B">C08K5/14</further-classification>
        <further-classification edition="200601120260102B">C08K5/3445</further-classification>
        <further-classification edition="200601120260102B">C08K5/5399</further-classification>
        <further-classification edition="200601120260102B">C08L71/12</further-classification>
        <further-classification edition="200601120260102B">C08L79/04</further-classification>
        <further-classification edition="200601120260102B">C08J5/18</further-classification>
        <further-classification edition="200601120260102B">H05K1/03</further-classification>
        <further-classification edition="200601120260102B">H01L23/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商味之素股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AJINOMOTO CO., INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野嶋晶子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOJIMA, SHOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供清漆穩定性及膜柔軟性優異的樹脂組成物。  &lt;br/&gt;　　[解決手段]一種樹脂組成物，其是包含具有特定結構的(A)環狀磷腈化合物、(B)馬來醯亞胺樹脂、(C)自由基聚合性化合物(馬來醯亞胺除外)、(E)無機填充材料及(F)固化促進劑的樹脂組成物，其中，相對於樹脂組成物的不揮發成分100質量%，(E)無機填充材料的含量為60質量%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1664" publication-number="202614944">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614944</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134362</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>椅子</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251130B">A47C7/02</main-classification>
        <further-classification edition="200601120251130B">A47C7/36</further-classification>
        <further-classification edition="200601120251130B">A47C27/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＭＴＧ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MTG CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畠田千夏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATADA, CHIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>工藤慎太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUDO, SHINTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中田光海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKATA, AKIMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>時渝恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]減輕對落座者的上半身所造成之負擔。&lt;br/&gt;  [解決方法]椅子包含椅子本體和凸部，該椅子本體包含靠背，該靠背包含靠背面，該靠背面包含傾斜面，該傾斜面朝該靠背之上端部，往上側斜後方傾斜，該凸部自該傾斜面突出，且具有較該椅子本體更低的硬度。該凸部對落座者上半身之局部賦予彈力。藉此，可抑制上半身之特定部位位於後方，結果減輕對上半身造成之負擔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:椅子</p>
        <p type="p">100:椅子本體</p>
        <p type="p">120:內側座部</p>
        <p type="p">140:內側靠背</p>
        <p type="p">22:上端部</p>
        <p type="p">M42:傾斜面</p>
        <p type="p">70:凸部</p>
        <p type="p">72:第1凸部</p>
        <p type="p">74:第2凸部</p>
        <p type="p">90:椅墊部材</p>
        <p type="p">91:第1椅墊部材</p>
        <p type="p">92:第2椅墊部材</p>
        <p type="p">93:第3椅墊部材</p>
        <p type="p">94:第4椅墊部材</p>
        <p type="p">95:椅套部材</p>
        <p type="p">L:高度位置</p>
        <p type="p">M40:內側靠背面</p>
        <p type="p">N40:外側靠背面</p>
        <p type="p">V:落座者</p>
        <p type="p">V1:肩胛骨下部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1665" publication-number="202615385">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615385</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134384</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、膜、圖案形成方法、及電子器件之製造方法</chinese-title>
        <english-title>RESIN COMPOSITION, FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C25/18</main-classification>
        <further-classification edition="200601120260102B">C07C311/48</further-classification>
        <further-classification edition="200601120260102B">C07C311/51</further-classification>
        <further-classification edition="200601120260102B">C07C381/12</further-classification>
        <further-classification edition="200601120260102B">C07D307/12</further-classification>
        <further-classification edition="200601120260102B">C07D307/93</further-classification>
        <further-classification edition="200601120260102B">C07D309/12</further-classification>
        <further-classification edition="200601120260102B">C07D317/38</further-classification>
        <further-classification edition="200601120260102B">C07D327/06</further-classification>
        <further-classification edition="200601120260102B">C07D327/08</further-classification>
        <further-classification edition="200601120260102B">C07D333/46</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/038</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉村務</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIMURA, TSUTOMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小島雅史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOJIMA, MASAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森貴大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的第一課題在於提供一種能夠形成LWR及缺陷抑制性優異之圖案的感光化射線性或感放射線性樹脂組成物。又，本發明的第二課題在於提供一種光阻膜、圖案形成方法、及器件之製造方法。本發明的感光化射線性或感放射線性樹脂組成物包含樹脂和鹽，該鹽包含由式（1）表示的陰離子部及由式（X-1）或式（X-2）表示的陽離子部。  &lt;br/&gt;&lt;img align="absmiddle" height="210px" width="619px" file="ed10089.JPG" alt="ed10089.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1666" publication-number="202615293">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615293</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134395</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>踏板推進式車輛驅動系統</chinese-title>
        <english-title>PEDALLY PROPELLED VEHICLE DRIVE SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260102B">B62M6/45</main-classification>
        <further-classification edition="201001120260102B">B62M6/55</further-classification>
        <further-classification edition="201001120260102B">B62M23/02</further-classification>
        <further-classification edition="200601120260102B">B62M11/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>挪威商蒙特投資３０公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONT INVEST 30 AS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NO</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>理爾森　克努特托爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LJOSNE, KNUT TORE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NO</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種踏板推進式車輛驅動系統(1)，包括：曲柄軸(3)；齒輪系統(10)，具有多個可選擇的齒輪比，其中，該齒輪系統具有齒輪輸入軸(10a)及齒輪輸出軸(10b)，且被建構成在輸入扭矩方向上之輸入扭矩存在於該齒輪輸入軸(10a)上時，在該齒輪輸出軸(10b)上提供輸出扭矩方向上之輸出扭矩；以及，馬達系統(20)，具有馬達輸出軸(20a)，而與該齒輪系統(10)並排配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pedally propelled vehicle drive system (1) comprising: a crankshaft (3); a gear system (10) with multiple selectable gear ratios, wherein the gear system has a gear input shaft (10a) and a gear output shaft (10b), and is configured to provide an output torque in an output torque direction on the gear output shaft (10b) when an in input torque in an input torque direction is present on the gear input shaft (10a); and a motor system (20) with a motor output shaft (20a) arranged in-line with the gear system (10).</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:曲柄軸</p>
        <p type="p">10:齒輪系統</p>
        <p type="p">10a:齒輪輸入軸</p>
        <p type="p">10b:齒輪輸出軸</p>
        <p type="p">20:(電動)馬達系統</p>
        <p type="p">20a:馬達輸出軸</p>
        <p type="p">21:(馬達)單向離合器</p>
        <p type="p">31:(踏板)單向離合器</p>
        <p type="p">41:第一齒輪輸入輪</p>
        <p type="p">42:第二齒輪輸入輪</p>
        <p type="p">51:驅動軸</p>
        <p type="p">52:驅動輪</p>
        <p type="p">53:驅動傳遞元件</p>
        <p type="p">61:齒輪輸出輪</p>
        <p type="p">62:第一輸出中間輪/齒輪</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1667" publication-number="202615294">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615294</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134396</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>踏板推進式車輛驅動系統</chinese-title>
        <english-title>PEDALLY PROPELLED VEHICLE DRIVE SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260102B">B62M6/45</main-classification>
        <further-classification edition="201001120260102B">B62M6/55</further-classification>
        <further-classification edition="201001120260102B">B62M23/02</further-classification>
        <further-classification edition="200601120260102B">B62M11/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>挪威商蒙特投資３０公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONT INVEST 30 AS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NO</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>理爾森　克努特托爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LJOSNE, KNUT TORE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NO</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種踏板推進式車輛驅動系統(1)，包括：曲柄軸(3)；齒輪系統(10)，具有多個可選擇的齒輪比，其中，該齒輪系統具有齒輪輸入軸(10a)及齒輪輸出軸(10b)，且被建構成在輸入扭矩方向上之輸入扭矩存在於該齒輪輸入軸(10a)上時，在該齒輪輸出軸(10b)上提供輸出扭矩方向上之輸出扭矩；以及，馬達系統(20)，圍繞該曲柄軸(3)同心配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pedally propelled vehicle drive system (1) comprising: a crankshaft (3); a gear system (10) with multiple selectable gear ratios, wherein the gear system has a gear input shaft (10a) and a gear output shaft (10b), and is configured to provide an output torque in an output torque direction on the gear output shaft (10b) when an in input torque in an input torque direction is present on the gear input shaft (10a); and an motor system (20) arranged concentric about the crankshaft (3).</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:曲柄軸</p>
        <p type="p">10:齒輪系統</p>
        <p type="p">10a:齒輪輸入軸</p>
        <p type="p">10b:齒輪輸出軸</p>
        <p type="p">20:(電動)馬達系統</p>
        <p type="p">20a:馬達輸出軸</p>
        <p type="p">21:(馬達)單向離合器</p>
        <p type="p">31:(踏板)單向離合器</p>
        <p type="p">41:第一齒輪輸入輪</p>
        <p type="p">42:第二齒輪輸入輪</p>
        <p type="p">51:驅動軸</p>
        <p type="p">52:驅動輪</p>
        <p type="p">53:驅動傳遞元件</p>
        <p type="p">61:齒輪輸出輪</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1668" publication-number="202616309">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616309</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134414</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電感裝置及包括電感裝置之配置</chinese-title>
        <english-title>INDUCTIVE DEVICE AND ARRANGEMENT COMPRISING AN INDUCTIVE DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">H01F27/28</main-classification>
        <further-classification edition="200601120260115B">H01F27/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商伍斯艾索電子有限公司及合資公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WURTH ELEKTRONIK EISOS GMBH &amp; CO. KG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒沙　馬哈茂德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHOUSHA, MAHMOUD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>EG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西特納　馬丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SITTNER, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浩格　馬汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAUG, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣大中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種使用薄膜技術生產之電感裝置，其包括一基板、一透磁芯及至少兩個磁性組件，其中各磁性組件具有至少一個繞組，其中各繞組具有在該芯之一頂側上之至少一個第一部分及在該芯之一下側上之至少一個第二部分，其中該芯具有至少一個通孔且兩個繞組延伸穿過該通孔，其中在該通孔之區域中，該兩個繞組彼此平行延展，或其中該芯具有至少兩個通孔，且第一繞組延伸穿過第一通孔且第二繞組延伸穿過第二通孔，且該第一通孔之區域中之該第一繞組及該第二通孔之區域中之該第二繞組彼此平行配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to an inductive device, produced using thin-film technology, comprising a substrate, a magnetically permeable core and at least two magnetic components, wherein each magnetic component has at least one winding, wherein each winding has at least one first portion on a top side of the core and at least one second portion on an underside of the core, wherein the core has at least one through opening and both windings extend through the through opening, wherein in the region of the through opening the two windings run parallel to one another, or wherein the core has at least two through openings and the first winding extends through the first through opening and the second winding extends through the second through opening and the first winding in the region of the first through opening and the second winding in the region of the second through opening are arranged parallel to one another.</p>
      </isu-abst>
      <representative-img>
        <p type="p">14:透磁芯</p>
        <p type="p">16:通孔/貫通觸點/穿孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1669" publication-number="202616383">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616383</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134426</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>維護裝置、真空處理系統及維護方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">H01L21/3065</main-classification>
        <further-classification edition="200601120260107B">H01L21/205</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>道菅隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOKAN, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之維護裝置，包含：殼體，其形成有大小對應於在處理容器內設有在進行基板之搬出及搬入時使用之第1門以及與第1門不同之第2門之真空處理裝置的第2門之開口部，並可將開口部氣密地安裝於第2門；減壓機構，將殼體內部減壓；以及吸引機構，配置於殼體內部，經由開口部進入處理容器內，並吸引處理容器內之對象物的附著物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電漿蝕刻裝置</p>
        <p type="p">30:處理容器</p>
        <p type="p">31:載置台</p>
        <p type="p">33:基座</p>
        <p type="p">34:支撐台</p>
        <p type="p">35:邊緣環</p>
        <p type="p">36:靜電吸盤</p>
        <p type="p">36a:電極</p>
        <p type="p">36d:載置面</p>
        <p type="p">36g:電極</p>
        <p type="p">36h:電極</p>
        <p type="p">84:第1門</p>
        <p type="p">95:第2門</p>
        <p type="p">96:蓋體</p>
        <p type="p">100:維護裝置</p>
        <p type="p">101:殼體</p>
        <p type="p">101A:開口部</p>
        <p type="p">101B:第1殼體</p>
        <p type="p">101C:第2殼體</p>
        <p type="p">101D:閘門構件</p>
        <p type="p">102:輸送用車輛</p>
        <p type="p">102A:載台</p>
        <p type="p">103:真空泵</p>
        <p type="p">103A:第1配管</p>
        <p type="p">103B:第2配管</p>
        <p type="p">103C:共通配管</p>
        <p type="p">103D:洩氣用配管</p>
        <p type="p">104A:第1閥</p>
        <p type="p">104B:第2閥</p>
        <p type="p">104D:洩氣閥</p>
        <p type="p">105:支撐台</p>
        <p type="p">110:吸引機構</p>
        <p type="p">112:吸引口</p>
        <p type="p">113:供給口</p>
        <p type="p">114:照射部</p>
        <p type="p">115:攝影部</p>
        <p type="p">131:排氣裝置</p>
        <p type="p">131A:排氣管</p>
        <p type="p">131B:閥</p>
        <p type="p">132:測量器</p>
        <p type="p">140:搬運機構</p>
        <p type="p">141:臂部</p>
        <p type="p">142:支撐部</p>
        <p type="p">143:叉部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1670" publication-number="202614983">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614983</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134469</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吸收性物品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251031B">A61F13/51</main-classification>
        <further-classification edition="200601120251031B">A61F13/511</further-classification>
        <further-classification edition="200601120251031B">A61F13/56</further-classification>
        <further-classification edition="200601120251031B">A61F13/84</further-classification>
        <further-classification edition="200601120251031B">A61F13/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大王製紙股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIO PAPER CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊東莉菜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, RINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>與那霸獎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONAHA, SUSUMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤田芽依</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWADA, MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明具有由背片與肌膚側構造部沒有固定而成的非固定區域；在非固定區域中的背片與肌膚側構造部可相對滑動；在背片的非肌膚側形成有在穿著時用以將前述吸收性物品固定於內褲之防偏移部；防偏移部之中，在中央區域中的沿著前後方向的中心線的第一側的側部區域的防偏移部部分的，在自防偏移部部分的橫方向的最外端起算直到長度wa(5mm≦wa≦10mm)的範圍中貼附基布，各別把持基布的第一側及肌膚側構造部的與第一側為相反側的第二側並沿著橫方向互相往相反側拉伸，且將防偏移部部分自基布剝離時的背片與前述肌膚側構造部的相對的移動距離設為d2，則d2≧wa。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:吸收性物品</p>
        <p type="p">3:頂片</p>
        <p type="p">4:吸收體部</p>
        <p type="p">7:側片</p>
        <p type="p">8:黏接劑</p>
        <p type="p">8a:側部黏接劑</p>
        <p type="p">8b:本體黏接劑</p>
        <p type="p">9b:本體用防偏移部(防偏移部)</p>
        <p type="p">9bm:中央防偏移部</p>
        <p type="p">9bs:側方防偏移部</p>
        <p type="p">9bs1:最外側的側方防偏移部(側方防偏移部、最外防偏移部)</p>
        <p type="p">9w:翼用防偏移部</p>
        <p type="p">19:防偏移部部分</p>
        <p type="p">21:固定區域</p>
        <p type="p">25:非固定區域</p>
        <p type="p">bd:吸收性物品本體</p>
        <p type="p">C:中央區域</p>
        <p type="p">CL:前後方向中心線</p>
        <p type="p">D1:前後方向(長邊方向)</p>
        <p type="p">D2:橫方向(短邊方向)</p>
        <p type="p">F:前方區域</p>
        <p type="p">M:橫方向中央區域</p>
        <p type="p">R:後方區域</p>
        <p type="p">S:側部區域</p>
        <p type="p">A:易變形區域的長度(長度)</p>
        <p type="p">k:在橫方向的長度(長度)</p>
        <p type="p">Q:體液排出口對向部</p>
        <p type="p">W:最外防偏移部的寬度(寬度)</p>
        <p type="p">wa:防偏移部部分的橫方向長度(防偏移部部分的長度、橫方向長度)</p>
        <p type="p">wg:翼</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1671" publication-number="202614996">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614996</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134509</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於遞送HPV核酸疫苗的脂質奈米顆粒</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260107B">A61K9/1271</main-classification>
        <further-classification edition="200601120260107B">A61K31/7088</further-classification>
        <further-classification edition="200601120260107B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京劑泰醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING JITAI PHARMACEUTICAL TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商杭州劑泰醫藥科技有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANGZHOU JITAI PHARMACEUTICAL TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹貝貝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, BEIBEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李蕾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, QIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張小駒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIAOJU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉安東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, ANDONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓鴻雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, HONGYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了用於遞送HPV核酸疫苗的脂質奈米顆粒。本申請還提供了所述脂質奈米顆粒的製備方法，包含所述脂質奈米顆粒的組合物、免疫原性組合物和藥物組合物，以及所述脂質奈米顆粒、免疫原性組合物和藥物組合物在治療疾病中的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1672" publication-number="202615662">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615662</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134529</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種HPV疫苗及其應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">C12N15/38</main-classification>
        <further-classification edition="200601120260107B">C12N15/85</further-classification>
        <further-classification edition="200601120260107B">A61K39/12</further-classification>
        <further-classification edition="200601120260107B">A61P35/00</further-classification>
        <further-classification edition="200601120260107B">A61P31/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京劑泰醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING JITAI PHARMACEUTICAL TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商杭州劑泰醫藥科技有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANGZHOU JITAI PHARMACEUTICAL TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹貝貝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, BEIBEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, QIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>欒緒科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUAN, XUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬曉芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, XIAOYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張小駒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIAOJU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓鴻雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, HONGYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及生物醫藥領域，特別涉及核酸疫苗領域。具體而言，本發明提供一種HPV疫苗及其應用，所述HPV疫苗包含編碼HPV抗原和免疫共刺激因子的核酸分子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1673" publication-number="202615023">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615023</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134530</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>經取代之三環雜環磺醯胺衍生物及其用途</chinese-title>
        <english-title>SUBSTITUTED TRICYCLICHETEROCYCLYLSULFONAMIDE DERIVATIVES AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">A61K31/4985</main-classification>
        <further-classification edition="200601120260108B">A61K31/498</further-classification>
        <further-classification edition="200601120260108B">A61K31/145</further-classification>
        <further-classification edition="200601120260108B">A61P3/00</further-classification>
        <further-classification edition="200601120260108B">A61P9/00</further-classification>
        <further-classification edition="200601120260108B">A61P37/00</further-classification>
        <further-classification edition="200601120260108B">A61P35/00</further-classification>
        <further-classification edition="200601120260108B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商九方治療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NINE SQUARE THERAPEUTICS CORPORATIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅森　馬克　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROSEN, MARK D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫塔提　達默德　雷迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTATI, DAMODER REDDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡亞納萊曼　查拉帕尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KALYANARAMAN, CHAKRAPANI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>道　羅伯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>叢　強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CONG, QIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林徹也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供化合物、組合物及用於製備及使用經取代之三環雜環磺醯胺衍生物化合物及包括其等化合物之組合物來調節TRPML1之方法。在一些實施例中，提供用於治療神經退化性疾病之該等化合物及組合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are compounds, compositions, and methods for the preparation and use of substituted tricyclicheterocyclylsulfonamide derivative compounds, and compositions comprising the same, for modulating TRPML1. In some embodiments, the compounds and compositions are provided for treatment of neurodegenerative diseases.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1674" publication-number="202615481">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615481</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134539</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療甲狀腺眼病之方法</chinese-title>
        <english-title>METHODS FOR TREATMENT OF THYROID EYE DISEASE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">C07K16/28</main-classification>
        <further-classification edition="200601120260107B">A61K39/395</further-classification>
        <further-classification edition="200601120260107B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商維里迪恩醫療股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIRIDIAN THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>席烏拉　湯瑪斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CIULLA, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納爾維卡　亞比吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARVEKAR, ABHIJIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米哈爾斯基　凱西　林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICHALSKY, CATHY LYNN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩默菲爾德　羅謝爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMMERFELT, ROCHELLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明尤其提供治療甲狀腺眼病(TED)之方法，其包括以投藥方案將抗IGF-1R抗體投與至患者持續足以減輕一或多種與TED有關之症狀之治療期，其中不良事件、例如聽力損傷較少。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides, among other things, a method of treating thyroid eye disease (TED) comprising administering an anti-IGF-1R antibody to a patient at a dosing regimen for a treatment period sufficient to reduce one or more symptoms associated with TED with low adverse events, such as hearing impairment.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1675" publication-number="202615742">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615742</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134588</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>萊賽爾紡絲原液、萊賽爾材料、吸煙製品過濾嘴、吸煙製品及其製造方法</chinese-title>
        <english-title>LYOCELL DOPE, LYOCELL MATERIAL, SMOKING ARTICLE FILTERS, SMOKING ARTICLES AND METHOD FOR PREPARING THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">D01F2/00</main-classification>
        <further-classification edition="200601120260102B">D01D1/02</further-classification>
        <further-classification edition="200601120260102B">D01D5/06</further-classification>
        <further-classification edition="200601120260102B">D01D10/00</further-classification>
        <further-classification edition="200601120260102B">D01D10/06</further-classification>
        <further-classification edition="200601120260102B">D02G1/00</further-classification>
        <further-classification edition="200601120260102B">A24D3/02</further-classification>
        <further-classification edition="200601120260102B">A24D3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商可隆股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOLON INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商韓國煙草人參股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KT&amp;G CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴恩英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, EUN YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭鍾喆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, JONG CHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李廷薫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JEONG HUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐昇潼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, SEUNG DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃永男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, YEONG NAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃珉姬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, MIN HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇聖鍾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KI, SUNG JONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬京培</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, KYENG BAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁眞哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JIN CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河成薰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HA, SUNG HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及萊賽爾紡絲原液、萊賽爾材料、包括萊賽爾材料的吸菸製品濾嘴、以及吸菸製品。根據本揭露的萊賽爾紡絲原液、萊賽爾材料、以及吸菸製品濾嘴能夠替代傳統的醋酸纖維素材料以及包括其的吸菸製品濾嘴。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a lyocell dope, a lyocell material, a smoking article filter including the lyocell material, and a smoking article. The lyocell dope, the lyocell material, and the smoking article filter according to the present disclosure are capable of replacing conventional cellulose acetate materials and smoking article filters including the same.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1676" publication-number="202616110">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616110</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134606</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>管路損壞預測系統、管路損壞預測方法及管路損壞預測程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">G06F18/245</main-classification>
        <further-classification edition="200601120260102B">F17D5/02</further-classification>
        <further-classification edition="202301120260102B">G06Q10/04</further-classification>
        <further-classification edition="200601120260102B">G01V1/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商久保田股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBOTA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金子正吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONEKO, SHOGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小田圭太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ODA, KEITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種可以藉由考慮軟質地基或地基邊界等的影響，而按每個管路獲得適當的損壞預測資訊之管路損壞預測系統。&lt;br/&gt;  [解決手段]一種管路損壞預測系統，是使用電腦來預測管路的由自然災害所造成之損壞，前述管路損壞預測系統具備有：基礎資料記憶部，記憶表示管路的屬性之管路屬性資料、為表示埋設有前述管路之地基的特性之地基特性資料且為至少包含以GIS中的多邊形為單位之液狀化資料、地基邊界資料及地形改變資料的任一者之地基特性資料、及根據過去已發生之自然災害之表示損壞的程度之損壞資料；及損壞預測運算部，依據已記憶於前述基礎資料記憶部之前述管路屬性資料、前述地基特性資料與前述損壞資料，來生成預測有在前述管路產生之損壞之損壞預測資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:管路損壞預測系統</p>
        <p type="p">11:基礎資料記憶部</p>
        <p type="p">12:損壞預測運算部</p>
        <p type="p">C:電腦</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1677" publication-number="202615995">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615995</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134613</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於微影設備之劑量量測系統</chinese-title>
        <english-title>DOSE MEASUREMENT SYSTEM FOR A LITHOGRAPHIC APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G03F7/20</main-classification>
        <further-classification edition="200601120260102B">G01T1/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德　蒙西　德巴什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE MUNSHI, DEBASHIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>剛　天</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GANG, TIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於一微影設備之劑量量測系統。該劑量量測系統包含：一目標，其上形成於有一繞射光柵，其中該目標經組態以在用輻射輻照照明時經歷熱膨脹，且該繞射光柵之一節距隨著該目標之該熱膨脹而增加；一感測器，其經組態以量測該繞射光柵之一參數，該參數取決於該繞射光柵之該節距；及一處理器，其經組態以基於由該感測器對該繞射光柵之該參數進行之一或多個量測而判定該輻射之劑量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a dose measurement system for a lithographic apparatus. The dose measurement system comprises: a target having a diffraction grating formed thereon, wherein the target is configured to undergo thermal expansion when illuminate irradiated with radiation, and a pitch of the diffraction grating increases with the thermal expansion of the target; a sensor configured to measure a parameter of the diffraction grating that is dependent on the pitch of the diffraction grating; and a processor configured to determine the dose of the radiation based on one or more measurements of the parameter of the diffraction grating made by the sensor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:感測器裝置</p>
        <p type="p">310:基底</p>
        <p type="p">311:安裝部分</p>
        <p type="p">320:目標</p>
        <p type="p">321:近端部分</p>
        <p type="p">322:遠端部分</p>
        <p type="p">330:經塗佈區</p>
        <p type="p">340:繞射光柵</p>
        <p type="p">350:介面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1678" publication-number="202615570">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615570</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134627</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置的製造方法</chinese-title>
        <english-title>METHOD FOR MANUFACTURING ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">C08K7/22</main-classification>
        <further-classification edition="200601120251201B">C09J11/06</further-classification>
        <further-classification edition="200601120251201B">C09J11/08</further-classification>
        <further-classification edition="200601120251201B">C09J133/08</further-classification>
        <further-classification edition="201801120251201B">C09J7/25</further-classification>
        <further-classification edition="201801120251201B">C09J7/29</further-classification>
        <further-classification edition="201801120251201B">C09J7/38</further-classification>
        <further-classification edition="200601120251201B">H01L21/02</further-classification>
        <further-classification edition="200601120251201B">H01L21/683</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學艾喜緹瑪蒂莉亞股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS ICT MATERIA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三浦徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIURA, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置的製造方法，包含：準備結構體（100）的步驟，所述結構體（100）包括黏著性膜（10）及加工對象物（20），所述黏著性膜（10）包括基材層（A）及黏著性樹脂層（C），所述加工對象物（20）暫時固定於所述黏著性樹脂層（C）；以及對暫時固定於所述黏著性樹脂層（C）的所述加工對象物（20）進行加工的步驟，所述黏著性樹脂層（C）包含熱膨脹性微小球，所述熱膨脹性微小球的藉由規定的式子算出的真球度R為0.93以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for manufacturing an electronic device includes: a step of preparing a structure body (100) including an adhesive film (10) and a processing target (20), the adhesive film (10) having a base material layer (A) and an adhesive resin layer (C), and the processing target (20) being temporarily fixed to the adhesive resin layer (C); and a step of processing the processing target (20) temporarily fixed to the adhesive resin layer (C). The adhesive resin layer (C) contains heat-expandable microspheres, and the heat-expandable microspheres have a sphericity R of 0.93 or more as calculated according to a predetermined formula.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:黏著性膜</p>
        <p type="p">20:加工對象物</p>
        <p type="p">30:支撐構件</p>
        <p type="p">40:加工後的加工對象物</p>
        <p type="p">100:結構體</p>
        <p type="p">A:基材層</p>
        <p type="p">C:黏著性樹脂層</p>
        <p type="p">X1:步驟</p>
        <p type="p">X2:步驟</p>
        <p type="p">X3:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1679" publication-number="202616408">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616408</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134641</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種用於檢測半導體元件的底側邊緣的系統與方法</chinese-title>
        <english-title>A SYSTEM AND METHOD FOR INSPECTING SIDE EDGE OF SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251231B">H01L21/66</main-classification>
        <further-classification edition="200601120251231B">G01N21/956</further-classification>
        <further-classification edition="201701120251231B">G06T7/174</further-classification>
        <further-classification edition="200601120251231B">G01B11/24</further-classification>
        <further-classification edition="200601120251231B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬來西亞商正齊科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MI EQUIPMENT (M) SDN. BHD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭　萬泉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEH, BAN CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　仁凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGU, ING KHAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬　尋軼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEH, SIN YEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　美云</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, REBECCA MAY YUIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種用於檢測半導體元件底側邊緣（103AA）的系統（101），所述系統（101）被配置為捕獲由多個子圖像組成的至少一個圖像（401）；其中，所述子圖像是關於多個半導體元件的所述底側邊緣（103AA）的，由此所述系統（101）包括多個光源，所述多個光源被配置為朝向在至少一個轉盤上旋轉的多個半導體元件的底側邊緣（103AA）發射紅外光。本發明還提供了一種使用所述系統（101）來執行所述檢查的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a system (101) for inspecting bottom side edge (103AA) of semiconductor device, configured to capture at least one image (401) comprising of a plurality of sub-images; wherein said sub-images are of the bottom side edge (103AA) of a plurality of semiconductor devices, whereby said system (101) comprises of a plurality of light sources configured to emit infra-red lights towards a bottom side edge (103AA) of a plurality of semiconductor devices rotated on at least one turntable. The present invention also provides a method of performing said inspection using said system (101).</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:系統</p>
        <p type="p">105A:第一半導體元件</p>
        <p type="p">105B:第二半導體元件</p>
        <p type="p">105C:第三半導體元件</p>
        <p type="p">105D:第四半導體元件</p>
        <p type="p">103AA:底側邊緣</p>
        <p type="p">107:第一光源</p>
        <p type="p">108:第二光源</p>
        <p type="p">109:第三光源</p>
        <p type="p">213:第四光源</p>
        <p type="p">215:第五光源</p>
        <p type="p">115A:第一紅外光</p>
        <p type="p">115B:第二紅外光</p>
        <p type="p">115C:第三紅外光</p>
        <p type="p">111A:第一圖像捕獲裝置</p>
        <p type="p">113A:第一光操作裝置</p>
        <p type="p">113B:第二光操作裝置</p>
        <p type="p">203:轉塔</p>
        <p type="p">205A:第一轉盤</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1680" publication-number="202615027">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615027</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134716</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙功能激酶調節劑、包含該調節劑的組合物及該調節劑的使用方法</chinese-title>
        <english-title>BIFUNCTIONAL KINASE MODULATORS, COMPOSITIONS COMPRISING THE SAME, AND METHODS OF USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">A61K31/506</main-classification>
        <further-classification edition="200601120260112B">A61K31/4985</further-classification>
        <further-classification edition="200601120260112B">A61K31/44</further-classification>
        <further-classification edition="200601120260112B">A61K31/437</further-classification>
        <further-classification edition="200601120260112B">A61K31/4192</further-classification>
        <further-classification edition="200601120260112B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>開曼群島商百放開曼有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIOFRONT LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方李超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, LICHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方李超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, LICHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉苗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, MIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供了式I的雙功能化合物、包含式I化合物的組合物以及使用它們治療由抑制某些激酶(例如造血祖細胞激酶1(HPK1))介導的疾病、病症或病狀的方法。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="200px" width="255px" file="ed10171.JPG" alt="ed10171.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides bifunctional compounds of Formula I, compositions comprising the compound of Formula I, and methods of using the same, in treating diseases, disorders, or conditions mediated by the inhibition of certain kinases, such as hematopoietic progenitor kinase 1 (HPK1). &lt;br/&gt;&lt;img align="absmiddle" height="187px" width="257px" file="ed10172.JPG" alt="ed10172.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1681" publication-number="202615109">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615109</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134733</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有藥管更換偵測的注射監控模組</chinese-title>
        <english-title>INJECTION MONITORING MODULE WITH DRUG CARTRIDGE CHANGE DETECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">A61M5/31</main-classification>
        <further-classification edition="200601120260114B">A61M5/315</further-classification>
        <further-classification edition="201801120260114B">G16H20/17</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商拜爾寇生產公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIOCORP PRODUCTION S.A.S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬寇茲　阿蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARCOZ, ALAIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於注射筆系統之注射監控模組，該注射筆系統包含沿著縱向軸線移動之指示器，該模組包含注射監控系統，該注射監控系統包含：感測器，其經配置以非接觸式地偵測該指示器沿著該縱向軸線之軸向移動；及處理器，其連接至該感測器。該處理器接收及處理來自該感測器之訊號且從彼等訊號判定藥管插入或移除事件，這些訊號是由該指示器在沿著該縱向軸線從第一軸向位置移動至第二軸向位置時產生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Injection monitoring module for an injection pen system comprising an indicator of movement along a lengthwise axis, the module comprising an injection monitoring system comprising a sensor configured to contactlessly detect an axial movement of the indicator along the lengthwise axis and a processor connected to the sensor. The processor receives and processes signals from the sensor, which are produced by the indicator when moving from a first axial position to a second axial position along the lengthwise axis, and determines from those signals a drug cartridge insertion or removal event.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:注射監控模組</p>
        <p type="p">2:注射筆系統</p>
        <p type="p">3:中心縱向軸線</p>
        <p type="p">4:筆主體</p>
        <p type="p">5:內部劑量分配套管</p>
        <p type="p">6:刻度套管</p>
        <p type="p">7:內部輪</p>
        <p type="p">8:劑量設定輪</p>
        <p type="p">9a:注射監控模組主體</p>
        <p type="p">9b:注射監控模組主體</p>
        <p type="p">10:封閉近端</p>
        <p type="p">11:遠端</p>
        <p type="p">12:周邊壁</p>
        <p type="p">16:旋轉阻斷溝槽</p>
        <p type="p">17:面向內表面</p>
        <p type="p">25:移動軸向指示器</p>
        <p type="p">26:偶極/四極磁體</p>
        <p type="p">27:指示器支架主體/托架</p>
        <p type="p">30:環形肩形件</p>
        <p type="p">31:近端</p>
        <p type="p">41:狹槽</p>
        <p type="p">44:可移動銷部件</p>
        <p type="p">48:近端</p>
        <p type="p">49:螺紋驅動螺釘/活塞</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1682" publication-number="202616218">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616218</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134762</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用在不同方向上的非對稱降取樣的立體深度估計</chinese-title>
        <english-title>STEREO DEPTH ESTIMATION UTILIZING ASYMMETRIC DOWNSAMPLING IN DIFFERENT DIRECTIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260102B">G06T7/593</main-classification>
        <further-classification edition="201701120260102B">G06T7/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　傑米　門傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JAMIE MENJAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">態樣係關於利用在不同方向上的非對稱降取樣的立體深度估計。一種裝置可包括：一或多個記憶體，其經組態以儲存複數個影像；及複數個攝影機。該複數個攝影機可經組態以擷取一左影像及一右影像，其中該等影像中之各者包括一或多個圖塊，各圖塊包括複數個像素。該裝置可包括一或多個處理器，其耦接至一或多個記憶體，其中該一或多個處理器經組態以：在一第一方向上對一第一影像的一第一圖塊中的一第一像素集進行降取樣，以產生一第一降取樣；及在一第二方向上對一第二影像的一第二圖塊中的一第二像素集進行降取樣，以產生一第二降取樣，該第二降取樣包括數目較多的像素。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Aspects relate to stereo depth estimation utilizing asymmetric down-sampling in different directions. A device may include one or more memories configured to store a plurality of images and a plurality of cameras. The plurality of cameras may be configured to capture a left and right image, in which, each of the images includes one or more patches, each patch including plurality of pixels. The device may include one or more processors coupled to one or more memories, in which, the one or more processors are configured to: down-sample in a first direction on a first set of pixels in a first patch of a first image to generate a first down-sample; and down-sample in a second direction on a second set of pixels in a second patch of a second image to generate a second down-sample, the second down-sample including a greater number of pixels.</p>
      </isu-abst>
      <representative-img>
        <p type="p">402,404,406:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1683" publication-number="202615069">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615069</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134791</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可觸發基因沉默的多聚寡核苷酸</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">A61K31/7088</main-classification>
        <further-classification edition="201001120260114B">C12N15/113</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商維亞臻生物技術（蘇州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VISIRNA THERAPEUTICS (SUZHOU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古　威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GU, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀輝君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, HUIJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸劍宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, JIANYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒　曉明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZOU, XIAOMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃雅君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種可觸發基因沉默的多聚寡核苷酸及其應用，具體揭示了如式（I）所示之化合物及其應用。  &lt;br/&gt;&lt;img align="absmiddle" height="66px" width="115px" file="ed10249.JPG" alt="ed10249.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1684" publication-number="202615938">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615938</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134793</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示整合設備</chinese-title>
        <english-title>DISPLAY INTEGRATION EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250917B">G02F1/133</main-classification>
        <further-classification edition="200601120250917B">G02F1/137</further-classification>
        <further-classification edition="202301120250917B">H04N5/33</further-classification>
        <further-classification edition="200601120250917B">G09G3/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>虹彩光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRIS OPTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林政宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHENG YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚正宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, CHENG HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖奇璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHI CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種顯示整合設備，包含一顯示裝置、一控制器以及至少一攝影裝置。顯示裝置包含複數顯示模組及一光吸收模組。此些顯示模組包含一液晶層。光吸收模組設置於此些顯示模組的一側。控制器訊號連接顯示裝置，並用以控制顯示裝置顯示一圖像資料。至少一攝影裝置設置於光吸收模組遠離此些顯示模組的一側且訊號連接控制器，並用以穿過顯示裝置而擷取一影像。藉此，確保駕駛員監控的有效性和精確性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display integration equipment is proposed. The display integration equipment includes a display device, a controller, and at least one camera device. The display device includes a plurality of display modules and a light absorption module. The display modules include a liquid crystal layer. The light absorption module is disposed on one side of the display modules. The controller is electrically connected to the display device and is configured to control the display device to display the image data. The at least one camera device is disposed on the side of the light absorption module opposite to the display modules and is electrically connected to the controller, and is configured to capture an image through the display device. Thus, the display integration equipment can ensure the effectiveness and accuracy of driver monitoring.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示整合設備</p>
        <p type="p">110:顯示裝置</p>
        <p type="p">112:光吸收模組</p>
        <p type="p">130:攝影裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1685" publication-number="202615367">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615367</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134817</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>UV-C透過玻璃及玻璃零件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">C03C3/118</main-classification>
        <further-classification edition="200601120251103B">C03C4/08</further-classification>
        <further-classification edition="200601120251103B">A61L2/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住田光學玻璃股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITA OPTICAL GLASS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本吉記</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, YOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種在鋁硼酸鹽系玻璃的特定組成中熔融性良好、熱膨脹率低且耐水性優異的UV-C透過玻璃。UV-C透過玻璃的特徵在於，以質量%計含有SiO&lt;sub&gt;2&lt;/sub&gt;：46.90%以上且小於55.00%、B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;：超過27.00%且為35.10%以下、Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;：6.90%以上且12.00%以下、Li&lt;sub&gt;2&lt;/sub&gt;O：0.90%以上且8.00%以下、Na&lt;sub&gt;2&lt;/sub&gt;O：0.90%以上且8.10%以下、K&lt;sub&gt;2&lt;/sub&gt;O：0%以上且5.10%以下、R&lt;sub&gt;2&lt;/sub&gt;O：4.00%以上且小於9.00%（其中，R&lt;sub&gt;2&lt;/sub&gt;O表示Li&lt;sub&gt;2&lt;/sub&gt;O、Na&lt;sub&gt;2&lt;/sub&gt;O及K&lt;sub&gt;2&lt;/sub&gt;O的總和）、MgO：0%以上且3.00%以下、CaO：0%以上且3.00%以下、SrO：0%以上且4.00%以下、BaO：0%以上且4.00%以下、R'O：0%以上且小於5.00%（其中，R'O表示MgO、CaO、SrO及BaO的總和）、Sb&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;：0%以上且1.00%以下、F：超過0.01%且為1.00%以下、Cl：0.05%以上且1.00%以下，且（R&lt;sub&gt;2&lt;/sub&gt;O+R'O）/（SiO&lt;sub&gt;2&lt;/sub&gt;+B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;+Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;）所表示的質量比小於0.1。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1686" publication-number="202615072">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615072</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134830</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>治療退化性眼部疾病的醫藥組成物及其用途</chinese-title>
        <english-title>PHARMACEUTICAL COMPOSITION AND USE THEREOF FOR TREATING DEGENERATIVE OCULAR DISEASE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260107B">A61K35/12</main-classification>
        <further-classification edition="200601120260107B">A61K38/16</further-classification>
        <further-classification edition="200601120260107B">A61P27/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛教慈濟醫療財團法人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUDDHIST TZU CHI MEDICAL FOUNDATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>花蓮縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡榮坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, RONG-KUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>温耀增</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, YAO-TSENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳菟汶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TU-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孚竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種醫藥組成物，其包含幹細胞分泌物及其醫藥上可接受的賦形劑。本揭露亦提供一種使用該醫藥組成物用於治療退化性眼部疾病的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a pharmaceutical composition including secretions of stem cells and a pharmaceutically acceptable excipient thereof. Also provided is a use of the pharmaceutical composition in treating degenerative ocular diseases.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1687" publication-number="202614930">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614930</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134834</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>豆腐製造系統及記錄媒體</chinese-title>
        <english-title>TOFU PRODUCTION SYSTEM AND RECORDING MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260112B">A23L11/60</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商好侍食品集團本社股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOUSE FOODS GROUP INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　偉義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NG, WAI YEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石塚啓子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIZUKA, KEIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種豆腐製造系統（1），其為具備有：從豆漿貯槽（3）供給豆漿，從凝固劑貯槽（4）供給凝固劑，並藉由凝固劑使豆漿凝固而製造成豆漿凝固物的凝固裝置（5）；測定凝固裝置（5）中凝固的豆漿凝固物之硬度的測定裝置（13）；以及基於豆漿凝固物之硬度的測定結果，調整向凝固裝置（5）供給的豆漿及凝固劑中之至少任何一者的供給量之控制裝置（14）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a tofu production system (1) comprising a coagulation device (5) that receives soy milk from a soy milk tank (3), receives a coagulant from a coagulant tank (4), and coagulates the soy milk with the coagulant to produce a soy milk curd; a measuring device (13) that measures the hardness of the soy milk curd produced in the coagulation device (5); and a control device (14) that adjusts the amount of at least one of the soy milk and the coagulant supplied to the coagulation device (5) based on the measurement result of the hardness of the soy milk curd.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:豆腐製造系統</p>
        <p type="p">3:豆漿貯槽</p>
        <p type="p">3a:豆漿供給裝置</p>
        <p type="p">4:凝固劑貯槽</p>
        <p type="p">4a:凝固劑供給裝置</p>
        <p type="p">5:凝固裝置</p>
        <p type="p">6:成型裝置</p>
        <p type="p">7:切割裝置</p>
        <p type="p">8:容器充填裝置</p>
        <p type="p">9:密封裝置</p>
        <p type="p">10:殺菌裝置</p>
        <p type="p">13:測定裝置</p>
        <p type="p">14:控制裝置</p>
        <p type="p">15:凝固桶槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1688" publication-number="202615224">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615224</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134848</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>對機器人教示動作之裝置及方法、設定加工條件之裝置及方法、以及電腦程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B25J9/16</main-classification>
        <further-classification edition="200601120260102B">B25J9/22</further-classification>
        <further-classification edition="200601120260102B">G05B19/425</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古田智大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUTA, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田茂夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, SHIGEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">先前以來，業界不斷追求將機器人之動作教示所耗費之作業簡化之技術。  &lt;br/&gt;本發明中，對以將一群指令建立關聯之加工方式加工工件之機器人12教示動作之裝置70具備：輸入受理部64，其受理用以教示預先設定之加工方式之動作之輸入；及指令取得部76，其於輸入受理部64受理該輸入時，獲取與預先設定之加工方式建立關聯之一群指令，用以產生規定指令之加工程式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:機器人系統</p>
        <p type="p">12:機器人</p>
        <p type="p">14:控制裝置</p>
        <p type="p">16:教示裝置</p>
        <p type="p">34:力感測器</p>
        <p type="p">40:處理器</p>
        <p type="p">42:記憶體</p>
        <p type="p">44:I/O介面</p>
        <p type="p">46:匯流排</p>
        <p type="p">50:處理器</p>
        <p type="p">52:記憶體</p>
        <p type="p">54:I/O介面</p>
        <p type="p">56:輸入裝置</p>
        <p type="p">58:顯示裝置</p>
        <p type="p">59:匯流排</p>
        <p type="p">60:裝置</p>
        <p type="p">62:圖像產生部</p>
        <p type="p">64:輸入受理部</p>
        <p type="p">66:條件設定部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1689" publication-number="202615996">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615996</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134869</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>度量衡工具</chinese-title>
        <english-title>METROLOGY TOOL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">G03F7/20</main-classification>
        <further-classification edition="200601120260115B">G03F9/00</further-classification>
        <further-classification edition="200601120260115B">G01N21/41</further-classification>
        <further-classification edition="200601120260115B">G02B6/12</further-classification>
        <further-classification edition="200601120260115B">G02B6/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布吉思　羅賓　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUIJS, ROBIN DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡　特　衛斯登得　瑪尹克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN T WESTEINDE, MAAIKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　英葛　喬恩　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN ENGELEN, JORN PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於量測一週期性目標之光學度量衡系統。該系統包含經組態以發射第一及第二照明光束之第一及第二發射路徑。該系統包含經組態以收集由該等第一及第二照明光束形成之第一及第二反射光束的第一及第二收集路徑。該系統包含一偵測器，該偵測器光學耦合至該等第一及第二收集路徑且經組態以量測該等第一及第二反射光束之強度。該系統包含一致動系統，該致動系統經組態以產生該週期性目標與該等第一及第二照明光束之間的相對移動。該系統包含一處理器，該處理器經組態以至少部分地基於該等第一及第二反射光束之經量測強度的一相位來判定對準資訊。該系統可至少部分地以一光子積體電路之形式實施。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical metrology system for measuring a periodic target. The system comprises first and second emission paths configured to emit first and second illumination beams. The system comprises first and second collection paths configured to collect first and second reflected beams formed by the first and second illumination beams. The system comprises a detector optically coupled to the first and second collection paths and configured to measure intensities of the first and second reflected beams. The system comprises an actuation system configured to generate relative movement between the periodic target and the first and second illumination beams. The system comprises a processor configured to determine alignment information at least partly based on a phase of the measured intensities of the first and second reflected beams. The system maybe at least partly implemented in the form of a photonic integrated circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學度量衡系統</p>
        <p type="p">110:第一週期性目標</p>
        <p type="p">111:第一光柵</p>
        <p type="p">112:第二光柵</p>
        <p type="p">121:第一發射路徑</p>
        <p type="p">122:第二發射路徑</p>
        <p type="p">131:第一照明光束/實質上圓形照明光束</p>
        <p type="p">132:第二照明光束/實質上圓形照明光束</p>
        <p type="p">141:第一收集路徑</p>
        <p type="p">142:第二收集路徑</p>
        <p type="p">150:偵測器</p>
        <p type="p">160:處理器</p>
        <p type="p">170:電磁輻射源</p>
        <p type="p">181:第一發射波導</p>
        <p type="p">182:第二發射波導</p>
        <p type="p">183:第一發射光柵耦合器</p>
        <p type="p">184:第二發射光柵耦合器</p>
        <p type="p">191:第一收集波導</p>
        <p type="p">192:第二收集波導</p>
        <p type="p">193:第一收集光柵耦合器</p>
        <p type="p">194:第二收集光柵耦合器</p>
        <p type="p">195:箭頭</p>
        <p type="p">X:軸</p>
        <p type="p">Y:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1690" publication-number="202615558">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615558</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134901</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液晶聚酯解聚物之製造方法、再生液晶聚酯樹脂之製造方法、再生液晶聚酯成形體之製造方法、及化學再生方法</chinese-title>
        <english-title>PRODUCTION METHODS FOR LIQUID CRYSTAL POLYESTER DEPOLYMERIZATION PRODUCT, RECYCLED LIQUID CRYSTAL POLYESTER RESIN AND RECYCLED LIQUID CRYSTAL POLYESTER FORMED BODY, AND CHEMICAL RECYCLING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C08J11/04</main-classification>
        <further-classification edition="200601120260105B">C08J11/22</further-classification>
        <further-classification edition="200601120260105B">C08G63/183</further-classification>
        <further-classification edition="200601120260105B">C09K19/20</further-classification>
        <further-classification edition="200601120260105B">B29B17/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商可樂麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURARAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中山和之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAYAMA, KAZUHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本步</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, AYUMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野中壽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NONAKA, YOSHIMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>考菲　派翠克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COFFEY, PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種對於將液晶聚酯製品進行再生係有用的液晶聚酯解聚物之製造方法。前述液晶聚酯解聚物之製造方法係包含透過酯鍵的切斷而將液晶聚酯製品所含有的液晶聚酯進行解聚合以增加總單末端量的步驟，其中解聚合後之液晶聚酯的總單末端量為50meq/kg以上的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a method for producing a liquid crystal polyester depolymerization product useful for recycling a liquid crystal polyester product. The method includes a step of depolymerizing a liquid crystal polyester included in the liquid crystal polyester product by cleaving ester bonds so as to increase a total amount of one-end groups, wherein the total amount of one-end groups of a depolymerized liquid crystal polyester is 50 mEq/kg or more.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1691" publication-number="202615040">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615040</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134904</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＧＬＰ－１受體促效劑及其用途</chinese-title>
        <english-title>GLP-1 RECEPTOR AGONIST AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">A61K31/519</main-classification>
        <further-classification edition="200601120260108B">A61K31/44</further-classification>
        <further-classification edition="200601120260108B">A61K31/4188</further-classification>
        <further-classification edition="200601120260108B">A61K31/4184</further-classification>
        <further-classification edition="200601120260108B">A61P3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商韓美藥品股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANMI PHARM. CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金署熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SEO HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴昭旼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SO MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安永吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, YOUNG GIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓承洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, SEUNG SU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪東進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, DONG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金秀彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SOO BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供新穎GLP-1受體促效劑及其用途，以及用於預防或治療肥胖、糖尿病、或與其相關代謝疾病的藥物組成物，包括治療有效量的GLP-1受體促效劑化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a novel GLP-1 receptor agonist and use thereof, and a pharmaceutical composition for preventing or treating obesity, diabetes, or metabolic diseases associated therewith, including a therapeutically effective amount of a GLP-1 receptor agonist compound.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1692" publication-number="202615362">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615362</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134908</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在２２２ｎｍ下對全氟及多氟烷基物質之光氧化</chinese-title>
        <english-title>PHOTOOXIDATION OF PFAS AT 222 NM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260105B">C02F1/72</main-classification>
        <further-classification edition="202301120260105B">C02F1/32</further-classification>
        <further-classification edition="202301120260105B">C02F9/00</further-classification>
        <further-classification edition="200601120260105B">C07C17/23</further-classification>
        <further-classification edition="200601120260105B">C01B15/08</further-classification>
        <further-classification edition="200601120260105B">H01S3/225</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商凱洛思科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLAROS TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉澤坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, ZEKUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊斯利　埃文安東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LESLIE, EVAN ANTHONY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒂拉多　約瑟夫魯埃爾萊文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIRADO, JOSEPH REUEL LEVINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃正新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHENG-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密斯　特倫斯Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMITH, TERRANCE P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供處理廢水以減少PFAS的方法及系統，其包含將包含PFAS的廢水與氧化物質混合以形成處理溶液，並將該處理溶液暴露於來自222 nm紫外光源之紫外光下，於足夠的強度下持續足夠的時間，以破壞該PFAS。該氧化物質可為過硫酸鹽離子。該廢水可包含，例如高分子PFAS、全氟烷基羧酸鹽、部分氟化之全氟烷基羧酸鹽、全氟烷基醇鹽或全氟烷基醇。該廢水可為於半導體製造過程中產生的廢水。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and systems for treating wastewater for PFAS reduction including mixing wastewater including PFAS with an oxidizing species to form a treatment solution and exposing the treatment solution to UV light from a UV light source at 222 nm for an adequate time and at a sufficient intensity to destroy the PFAS. The oxidizing species may be a persulfate ion. The wastewater may include a polymeric PFAS, a perfluoroalkyl carboxylate, a partially fluorinated perfluoroalkyl carboxylate, a perfluoroalkyl alkoxide or a perfluoroalkyl alcohol, for example. The wastewater may be wastewater produced during semiconductor manufacturing.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1693" publication-number="202615743">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615743</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134912</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>萊賽爾紡絲原液、萊賽爾材料、吸煙製品的過濾嘴、吸煙製品及其製造方法</chinese-title>
        <english-title>LYOCELL DOPE, LYOCELL MATERIAL, FILTERS FOR SMOKING ARTICLES, SMOKING ARTICLES AND METHOD FOR PREPARING THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">D01F2/00</main-classification>
        <further-classification edition="200601120260102B">D01D1/02</further-classification>
        <further-classification edition="200601120260102B">D01D5/06</further-classification>
        <further-classification edition="200601120260102B">D01D10/00</further-classification>
        <further-classification edition="200601120260102B">D01D10/06</further-classification>
        <further-classification edition="200601120260102B">D02G1/00</further-classification>
        <further-classification edition="200601120260102B">A24D3/02</further-classification>
        <further-classification edition="200601120260102B">A24D3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商可隆股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOLON INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商韓國煙草人參股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KT&amp;G CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴恩英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, EUN YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭鍾喆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, JONG CHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李廷薫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JEONG HUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐昇潼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, SEUNG DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃永男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, YEONG NAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃珉姬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, MIN HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇聖鍾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KI, SUNG JONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬京培</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, KYENG BAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁眞哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JIN CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河成薰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HA, SUNG HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請案涉及萊賽爾材料、包括萊賽爾材料的用於吸菸製品的過濾嘴、以及包括過濾嘴的吸菸製品。根據本申請案的萊賽爾材料和用於吸菸製品的過濾嘴，可替代傳統醋酸纖維素材料和包括傳統醋酸纖維素材料的用於吸菸製品的過濾嘴。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application relates to a lyocell material, a filter for smoking articles, the filter including the lyocell material, and a smoking article including the filter. The lyocell material and the filter for smoking articles, according to the present application, may replace conventional cellulose acetate materials and filters for smoking articles including conventional cellulose acetate materials.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1694" publication-number="202616010">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616010</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134929</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>數值控制裝置及工具機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G05B19/402</main-classification>
        <further-classification edition="200601120260102B">G05B19/404</further-classification>
        <further-classification edition="200601120260102B">G05B19/4155</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立木伸吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TACHIKI, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">數值控制裝置是按照加工程式來控制工具機之數值控制裝置，前述工具機具備包含將工件旋轉定位的旋轉定位軸及決定前述工件與工具的相對位置的相對定位軸之複數個驅動軸以及夾持前述旋轉定位軸之夾持機構，前述數值控制裝置具備：優先軸記憶部，記憶前述旋轉定位軸與優先軸的對應關係，前述優先軸被設定為是對於該旋轉定位軸在前述複數個驅動軸之中應優先的驅動軸；及等候控制部，在同時被給予驅動前述旋轉定位軸之指令與驅動前述優先軸之指令的情況下，會等待前述優先軸的動作完成才使前述夾持機構夾持前述旋轉定位軸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:工具機</p>
        <p type="p">11:工作台</p>
        <p type="p">12:夾持機構</p>
        <p type="p">20:數值控制裝置</p>
        <p type="p">21:優先軸記憶部</p>
        <p type="p">22:優先軸設定部</p>
        <p type="p">23:等候控制部</p>
        <p type="p">24:設定建議部</p>
        <p type="p">Ab:旋轉定位軸</p>
        <p type="p">Ac:主軸</p>
        <p type="p">Ax:相對定位軸、優先軸、驅動軸、X軸</p>
        <p type="p">Ay:相對定位軸、驅動軸、Y軸</p>
        <p type="p">Az:相對定位軸、驅動軸、Z軸</p>
        <p type="p">T:工具</p>
        <p type="p">W:工件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1695" publication-number="202616122">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616122</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134930</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>管路工事事業支援系統、管路工事事業支援伺服器及管路工事事業支援系統控制用程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260102B">G06F30/18</main-classification>
        <further-classification edition="202001120260102B">G06F30/12</further-classification>
        <further-classification edition="201201120260102B">G06Q50/08</further-classification>
        <further-classification edition="200601120260102B">E03B7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商久保田股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBOTA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森村克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIMURA, MASARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塚原尚起</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUKAHARA, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西野真依子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHINO, MAIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤井宏明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJII, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林優一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, YUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川崎爽香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASAKI, SAWAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>景山早人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAGEYAMA, HAYATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋井巧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHII, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">實現一種可以在管路工事事業中，在設計施工與維持管理中相互地共享資訊而謀求效率化之管路工事事業支援系統、管路工事工業支援伺服器及管路工事事業支援系統控制用程式。水管工事事業支援系統1具有水管工事事業支援伺服器50、設計施工用伺服器20、設計施工用運算終端10、維持管理用伺服器40與維持管理用運算終端30。水管工事事業支援伺服器50具有：資訊記憶部52，藉由事業體ID、工事ID或管路ID的至少一個ID，將設計施工關連資訊DA1及維持管理關連資訊DB1建立連繫來記憶；及資料輸出部53，依據已記憶於資訊記憶部52之資訊，輸出設計施工運算資訊DA4，另一方面輸出維持管理運算資訊DB4。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:水管工事事業支援系統(管路工事事業支援系統)&lt;br/&gt;  10:設計施工用運算終端&lt;br/&gt;  11:設計施工用運算終端通訊部&lt;br/&gt;  12:設計施工用輸入部&lt;br/&gt;  13:設計施工用運算部&lt;br/&gt;  14:設計施工用運算終端記憶部&lt;br/&gt;  15:設計施工用顯示部&lt;br/&gt;  20:設計施工用伺服器&lt;br/&gt;  21:設計施工用伺服器通訊部&lt;br/&gt;  22:設計施工用伺服器記憶部&lt;br/&gt;  23:設計施工用資料處理部&lt;br/&gt;  30:維持管理用運算終端&lt;br/&gt;  31:維持管理用運算終端通訊部&lt;br/&gt;  32:維持管理用輸入部&lt;br/&gt;  33:維持管理用運算部&lt;br/&gt;  34:維持管理用運算終端記憶部&lt;br/&gt;  35:維持管理用顯示部&lt;br/&gt;  40:維持管理用伺服器&lt;br/&gt;  41:維持管理用伺服器通訊部&lt;br/&gt;  42:維持管理用伺服器記憶部&lt;br/&gt;  43:維持管理用資料處理部&lt;br/&gt;  50:水管工事事業支援伺服器(管路工事事業支援伺服器)&lt;br/&gt;  51:伺服器通訊部&lt;br/&gt;  52:資訊記憶部&lt;br/&gt;  53:資料輸出部&lt;br/&gt;  56:管路結合資訊生成部&lt;br/&gt;  57:管路資訊轉換部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1696" publication-number="202616204">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616204</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134931</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水道資訊管理系統、水道資訊管理裝置及水道資訊管理程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260102B">G06Q50/06</main-classification>
        <further-classification edition="202401120260102B">G06Q50/26</further-classification>
        <further-classification edition="200601120260102B">E03B7/09</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商久保田股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBOTA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森村克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIMURA, MASARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塚原尚起</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUKAHARA, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西野真依子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHINO, MAIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤井宏明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJII, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林優一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, YUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川崎爽香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASAKI, SAWAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>景山早人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAGEYAMA, HAYATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋井巧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHII, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">實現一種可以容易地將管路或機器與配水區域的連繫的關係，活用於水道的維持管理之水道資訊管理系統。水道資訊管理系統1的管理伺服器10具有：資訊取得部31，從運算終端50取得和水道的管路有關之資訊即管路資訊D10或和已設置於前述管路之機器的管理有關之機器管理資訊D20的至少一者的資訊；ID管理部32，依據包含有前述管路或前述機器的至少一者之配水區域，來管理前述至少一者的資訊、與用於特定出前述配水區域的配水區域ID的連繫；及記憶部20，將前述至少一者的資訊與前述配水區域ID以已建立連繫之狀態來記憶。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:水道資訊管理系統</p>
        <p type="p">10:管理伺服器</p>
        <p type="p">20:記憶部</p>
        <p type="p">31:資訊取得部</p>
        <p type="p">32:ID管理部</p>
        <p type="p">50:運算終端</p>
        <p type="p">D10:管路資訊</p>
        <p type="p">D20:機器管理資訊</p>
        <p type="p">D30:配水區域主檔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1697" publication-number="202615466">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615466</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134934</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>針對人間皮素的抗體及其用途</chinese-title>
        <english-title>ANTIBODY AGAINST HUMAN MESOTHELIN AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">C07K16/24</main-classification>
        <further-classification edition="200601120260107B">A61K39/395</further-classification>
        <further-classification edition="200601120260107B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商命運抗體生成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FATIABGEN INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商Ｙ生物股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>Y-BIOLOGICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李爀焌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HYUK JOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林廷采</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, JUNG CHAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李相弼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SANG PIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申智英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, JI YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金知潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JI YOUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白基善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAEK, GI SUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔允瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, YUN SEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DONG JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慶東杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYUNG, DONG GEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴范燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, BUM CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴榮祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, YOUNG WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種與間皮素特異性結合的抗體及其用途，本發明從一方面證實，包含由特定胺基酸序列組成的互補決定區（CDR）的抗-間皮素（MSLN）抗體或其抗原結合片段以非常高的特異性與作為抗原的MSLN結合，上述抗-MSLN抗體或其抗原結合片段不僅可用作能夠通過細胞內化傳遞藥物的治療劑，還可用作能夠以MSLN為靶點，殺滅癌細胞的抗-MSLN抗體-藥物偶聯物，本發明一方面的抗-MSLN抗體或其抗原結合片段、以及包含其的組合物具有可預防或治療MSLN過表達引起的癌症，或者可預測或診斷上述癌症的優異效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1698" publication-number="202615232">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615232</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134937</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>板材的處理方法及處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B26D1/02</main-classification>
        <further-classification edition="200601120260102B">B26D5/20</further-classification>
        <further-classification edition="200601120260102B">B26D5/42</further-classification>
        <further-classification edition="200601120260102B">B26D7/02</further-classification>
        <further-classification edition="200601120260102B">B26D7/32</further-classification>
        <further-classification edition="200601120260102B">H05K3/22</further-classification>
        <further-classification edition="200601120260102B">H05K3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本發條股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NHK SPRING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長澤馨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGASAWA, KAORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貫井晃太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUKUI, KOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古瀬亜斗睦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUSE, ATOMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的板材的處理方法係帶有複數個圖案的板材的處理方法，包括：第一夾緊工序，沿第一切割方向，將被輸送至第一切割位置的板材之相對於第一切割位置的至少一側夾緊；縫隙形成工序，在板材中形成沿板厚方向貫穿且未抵達第一切割方向的兩端部的縫隙；第二夾緊工序，沿第二切割方向，對被輸送至與第一切割位置不同的第二切割位置的板材，將其隔著第二切割位置的兩側分別夾緊；以及分割工序，將形成有縫隙的板材輸送至第二切割位置，將板材沿著第二切割方向切割而分割板材。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:印刷板</p>
        <p type="p">201:第一刀具</p>
        <p type="p">202:第二刀具</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1699" publication-number="202615087">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615087</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134953</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>非蛋白梭菌毒素組成物</chinese-title>
        <english-title>NON-PROTEIN CLOSTRIDIAL TOXIN COMPOSITIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">A61K38/16</main-classification>
        <further-classification edition="200601120260113B">A61K47/10</further-classification>
        <further-classification edition="200601120260113B">A61K47/18</further-classification>
        <further-classification edition="200601120260113B">A61K47/20</further-classification>
        <further-classification edition="200601120260113B">A61K47/22</further-classification>
        <further-classification edition="200601120260113B">A61K47/26</further-classification>
        <further-classification edition="200601120260113B">A61K9/19</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商愛力根公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALLERGAN, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿比德　莫里斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABIAD, MAURICE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達尼　必黑斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DANI, BHAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>修雷夫　葉夫根尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHALAEV, EVGENYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述穩定梭菌毒素活性成分的醫藥組成物。該組成物可為液體或固體組成物，且包含界面活性劑和抗氧化劑。在一些具體實例中，該組成物包含選自泊洛沙姆(poloxamer)和聚山梨醇酯的界面活性劑；選自甲硫胺酸、N-乙醯基半胱胺酸、乙二胺四乙酸及其組合的抗氧化劑；和隨意地，選自例如海藻糖和蔗糖的張力劑及/或凍乾保護劑(lyoprotector)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Pharmaceutical compositions that stabilize a Clostridial toxin active ingredient are described. The compositions can be liquid or solid compositions, and comprise a surfactant and an antioxidant. In some embodiments, the compositions comprise a surfactant selected from a poloxamer and a polysorbate; an antioxidant selected from methionine, N-acetyl cysteine, ethylenediaminetetraacetic acid and combinations thereof; and, optionally, a tonicity agent and/or a lyoprotector selected from, for example, trehalose and sucrose.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1700" publication-number="202616552">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616552</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134969</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>洩漏檢測裝置、包括其的電池組及包括電池組的裝置</chinese-title>
        <english-title>LEAKAGE DETECTION DEVICE, BATTERY PACK INCLUDING THE SAME, AND DEVICE INCLUDING THE BATTERY PACK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251231B">H01M10/48</main-classification>
        <further-classification edition="200601120251231B">G01M3/04</further-classification>
        <further-classification edition="202101120251231B">H01M50/244</further-classification>
        <further-classification edition="201901120251231B">B60L50/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙成殷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, SEONG EUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴成奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SUNG KYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種洩漏檢測裝置。洩漏檢測裝置包括耦接吸收件的濕度檢測單元、將濕度檢測單元固定至電池組的固定支撐部、以及將濕度檢測單元固定至固定支撐部的延伸部，其中吸收件的下端至少延伸至固定支撐部的下端。即使少量冷卻劑洩漏也能迅速被檢測出來。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are a leakage detection device including a moisture detection unit to which an absorption member is coupled, a fixing support portion configured to fix the moisture detection unit to a battery pack, and an extension portion configured to fix the moisture detection unit to the fixing support portion, wherein a lower end of the absorption member extends at least to a lower end of the fixing support portion, and a battery pack including the same. It is possible to rapidly detect even a small amount of coolant leakage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:第一容納部</p>
        <p type="p">111:凹槽</p>
        <p type="p">200:洩漏檢測裝置</p>
        <p type="p">211:感測部</p>
        <p type="p">212:導線</p>
        <p type="p">213:外殼</p>
        <p type="p">214:吸收件</p>
        <p type="p">220:固定支撐部</p>
        <p type="p">230:延伸部</p>
        <p type="p">A-A’:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1701" publication-number="202615456">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615456</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134984</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於肥胖症及第二型糖尿病（Ｔ２ＤＭ）的雙重及三重促效劑化合物</chinese-title>
        <english-title>DUAL- AND TRI-AGONIST COMPOUNDS FOR OBESITY &amp; T2DM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">C07K14/645</main-classification>
        <further-classification edition="200601120260112B">A61K38/30</further-classification>
        <further-classification edition="200601120260112B">A61K38/16</further-classification>
        <further-classification edition="200601120260112B">A61P3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商領導醫療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PROTAGONIST THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班達利　艾索克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHANDARI, ASHOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯爾尼　葛雷格里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOURNE, GREGORY THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔拉那特　魯帕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TARANATH, ROOPA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>當肯　傑克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUNCAN, JACK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹尼爾　詹姆士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DANIEL, JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威爾斯　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WELLS, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈拉戴　傑森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HALLADAY, JASON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於作為人類升糖素樣肽-1(GLP-1)受體(GLP1R)、人類葡萄糖依賴性促胰島素多肽(GIP)受體(GIPR)及/或人類升糖素受體(GCGR)之雙重或三重促效劑的肽化合物。本發明亦係關於適用於口服投與之肽化合物。本發明之肽化合物可適用於治療第二型糖尿病(T2DM)及肥胖症。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to peptide compounds which are dual or tri-agonists of the human glucagon-like peptide-1 (GLP-1) receptor (GLP1R), the human glucose-dependent insulinotropic polypeptide (GIP) receptor (GIPR), and/or the human glucagon receptor (GCGR). The invention also relates to peptide compounds that are suitable for oral administration. Thes peptide compounds of the invention may be useful in the treatment of type 2 diabetes mellitus (T2DM) and obesity.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1702" publication-number="202616564">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616564</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134991</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>第一端子模組以及第一背板連接器</chinese-title>
        <english-title>FIRST TERMINAL MODULE AND FIRST BACKPLANE CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250926B">H01R11/03</main-classification>
        <further-classification edition="200601120250926B">H01R13/24</further-classification>
        <further-classification edition="200601120250926B">H01R13/40</further-classification>
        <further-classification edition="201101120250926B">H01R13/6581</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立訊技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉琨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李興玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XINGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭金闖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAN, JINCHUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪元鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YUANXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>苟中凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOU, ZHONGFA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種第一端子模組包括第一線纜模組以及延伸屏蔽殼體組件。前述第一線纜模組包括複數第一導電端子以及與前述第一導電端子相連的第一線纜。前述延伸屏蔽殼體組件包括第一延伸屏蔽片、第二延伸屏蔽片、第一連接屏蔽片、第二連接屏蔽片以及至少一個彈片。前述第一延伸屏蔽片、前述第二延伸屏蔽片、前述第一連接屏蔽片以及前述第二連接屏蔽片共同圍成一個屏蔽腔體。前述彈片凸伸入前述屏蔽腔體中。本發明有利於改善對第一導電端子的屏蔽效果。本發明還揭示了一種具有前述第一端子模組的第一背板連接器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A first terminal module includes a first cable module and an extension shielding shell assembly. The first cable module includes a number of first conductive terminals and a first cable connected to the first conductive terminals. The extension shielding shell assembly includes a first extension shielding piece, a second extension shielding piece, a first connection shielding piece, a second connection shielding piece and at least one elastic piece. The first extension shielding piece, the second extension shielding piece, the first connection shielding piece and the second connection shielding piece together form a shielding chamber. The elastic piece protrudes into the shielding chamber. The present disclosure is beneficial to improving the shielding effect on the first conductive terminal. A first backplane connector having the first terminal module is also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2a:第一線纜模組</p>
        <p type="p">25:第一屏蔽套筒</p>
        <p type="p">26:延伸屏蔽殼體組件</p>
        <p type="p">27:第一線纜</p>
        <p type="p">29:第一固定塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1703" publication-number="202615303">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615303</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134992</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>紙杯</chinese-title>
        <english-title>PAPER CUP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251007B">B65D3/10</main-classification>
        <further-classification edition="200601120251007B">B65D3/22</further-classification>
        <further-classification edition="200601120251007B">B65D3/06</further-classification>
        <further-classification edition="200601120251007B">A47G19/22</further-classification>
        <further-classification edition="200601120251007B">B65D85/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商湖北克拉弗特實業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUBEI KRAFTPACK INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁椒平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DING, JIAO PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁宇凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DING, YU FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖玉惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種紙杯，本紙杯之內杯層內側面設有一防水膜，且內杯層上設有由內杯層第一端向內杯層外側彎折形成的折疊區，折疊區的厚度和內杯層的厚度相等，內杯層的外側面還設有外杯層，外杯層上的鄰接邊與折疊區的外邊沿相對接或搭接，內杯層之第二端和外杯層之第二端以及折疊區外側面連接形成杯體，內杯層之第二端位於鄰接邊的外側，防水膜之第一端固定在防水膜之第二端以及外杯層之第二端上。本紙杯之內杯層無需切邊，在保證紙杯接縫處密封性的同時還能提高紙杯製作的效率並降低紙杯的製作成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A paper cup is disclosed, wherein an inner cup layer of the paper cup is formed with a waterproof membrane on an inner surface thereof, and the inner cup layer of the paper cup is provided with a folded region formed by folding the inner cup layer from a first end of the inner cup layer toward the outer side of the inner cup layer; the thickness of the folded region is equal to the thickness of the inner cup layer. The outer surface of the inner cup layer is further provided with an outer cup layer. The adjacent edge of the outer cup layer is joined or overlapped with the outer edge of the folded region. The second end of the inner cup layer, the second end of the outer cup layer, and the outer surface of the folded region are connected to form a cup body. The second end of the inner cup layer is located on the outer side of the adjacent edge of the outer cup layer. The first end of the waterproof membrane is fixed to the second end of the waterproof membrane and the second end of the outer cup layer. The inner cup layer of the paper cup of the present invention does not require edge trimming, ensuring the sealing integrity at the joint of the paper cup while improving manufacturing efficiency and reducing the production cost of the paper cup.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:內杯層</p>
        <p type="p">2a:內杯層之第一端</p>
        <p type="p">2b:內杯層之第二端</p>
        <p type="p">3a:外杯層之第一端</p>
        <p type="p">3b:外杯層之第二端</p>
        <p type="p">3c:鄰接邊</p>
        <p type="p">4:折疊層</p>
        <p type="p">4a:外邊沿</p>
        <p type="p">4b:折邊</p>
        <p type="p">8:防水膜</p>
        <p type="p">8a:防水膜之第一端</p>
        <p type="p">8b:防水膜之第二端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1704" publication-number="202616586">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616586</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134994</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器</chinese-title>
        <english-title>CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251023B">H01R13/648</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立訊技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉琨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李興玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XINGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭金闖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAN, JINCHUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪元鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YUANXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>苟中凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOU, ZHONGFA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種連接器包括第二殼體以及第二端子模組。前述第二端子模組包括第二線纜模組以及套接在前述第二線纜模組上的第二屏蔽套筒。前述第二線纜模組包括絕緣體、設置於前述絕緣體的第二端子模組以及與前述第二端子模組電性連接的第二線纜。前述第二屏蔽套筒包括屏蔽腔，前述絕緣體至少部分位於前述屏蔽腔中。前述第二屏蔽套筒包括第一屏蔽片以及第二屏蔽片，其中前述第一屏蔽片與前述第二屏蔽片拼成一個四周圍繞式的屏蔽結構。如此設置，本發明有利於改善對第二端子模組的屏蔽效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A connector includes a second housing and a second terminal module. The second terminal module includes a second cable assembly and a second shielding sleeve sleeved over the second cable assembly. The second cable assembly includes an insulator, a second terminal block disposed in the insulator, and a second cable electrically connected to the second terminal block. The second shielding sleeve includes a shielding cavity in which at least a portion of the insulator is located. The second shielding sleeve includes a first shielding piece and a second shielding piece, which together form an enclosed shielding structure. As a result, the present invention is beneficial for improving the shielding effectiveness of the second terminal block.</p>
      </isu-abst>
      <representative-img>
        <p type="p">60:第二端子模組</p>
        <p type="p">621:第二接觸部</p>
        <p type="p">64:絕緣體</p>
        <p type="p">640:端子收容孔</p>
        <p type="p">641:第一端面</p>
        <p type="p">642:第二端面</p>
        <p type="p">644:第二側壁</p>
        <p type="p">6441:第二開口</p>
        <p type="p">651:第一屏蔽片</p>
        <p type="p">6511:第一後端部</p>
        <p type="p">6511a:第一定位凹口</p>
        <p type="p">6511b:第一凹陷狹槽</p>
        <p type="p">6511c:第二凹陷狹槽</p>
        <p type="p">6512:第一屏蔽部</p>
        <p type="p">6512a:第一翻折片</p>
        <p type="p">6512b:第一開口部</p>
        <p type="p">652:第二屏蔽片</p>
        <p type="p">6521:第二後端部</p>
        <p type="p">6521a:第二定位凹口</p>
        <p type="p">6521b:第三凹陷狹槽</p>
        <p type="p">6522:第二屏蔽部</p>
        <p type="p">6522b:第二開口部</p>
        <p type="p">67:第二線纜</p>
        <p type="p">695:第二包覆塊</p>
        <p type="p">6952:第二定位凸塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1705" publication-number="202616565">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616565</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134996</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>端子模組以及連接器</chinese-title>
        <english-title>TERMINAL MODULE AND CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250926B">H01R11/03</main-classification>
        <further-classification edition="200601120250926B">H01R13/24</further-classification>
        <further-classification edition="200601120250926B">H01R13/40</further-classification>
        <further-classification edition="201101120250926B">H01R13/6581</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立訊技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉琨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李興玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XINGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭金闖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAN, JINCHUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪元鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YUANXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>苟中凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOU, ZHONGFA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種端子模組包括第二端子模組以及第二線纜。第二端子模組包括複數第二導電端子。每一個第二導電端子包括第二接觸部、第二尾部以及第二連接部。每一個第二接觸部包括第一彈性臂、第二彈性臂以及連接壁部。第一彈性臂包括與第二連接部相連的第一尾端部以及第一接觸臂。第二彈性臂包括與第一尾端部相抵接的第二尾端部以及第二接觸臂。本發明藉由將第二彈性臂的第二尾端部與第一彈性臂的第一尾端部相接觸，從而縮短了訊號在藉由第二彈性臂傳輸時的路徑，有利於改善傳輸速率。本發明還揭示了一種具有端子模組的連接器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A terminal module includes a second terminal module and a second cable. The second terminal module includes a plurality of second conductive terminals. Each second conductive terminal includes a second contact portion, a second tail portion, and a second connecting portion. Each second contact portion includes a first elastic arm, a second elastic arm, and a connecting wall portion. The first elastic arm includes a first tail end portion connected to the second connecting portion, and a first contact arm. The second elastic arm includes a second tail end portion abutting against the first tail end portion, and a second contact arm. By having the second tail end portion of the second elastic arm be in contact with the first tail end portion of the first elastic arm, the path for signals transmitted through the second elastic arm is shortened, which helps improve transmission speed. The present invention also discloses a connector having the terminal module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">62:第二導電端子</p>
        <p type="p">621:第二接觸部</p>
        <p type="p">6210:第一夾持空間</p>
        <p type="p">6211a:第一尾端部</p>
        <p type="p">6211b:第一接觸臂</p>
        <p type="p">6211c:第一末端部</p>
        <p type="p">6212a:第二尾端部</p>
        <p type="p">6212b:第二接觸臂</p>
        <p type="p">6212c:第二末端部</p>
        <p type="p">6213:連接壁部</p>
        <p type="p">6214:開槽</p>
        <p type="p">622:第二尾部</p>
        <p type="p">623:第二連接部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1706" publication-number="202615867">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615867</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135015</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>於早產兒受試者中檢測一早產兒視網膜病變相關蛋白質組的方法、系統及試劑盒</chinese-title>
        <english-title>METHODS, SYSTEMS AND KITS OF DETECTING A PANEL OF RETINOPATHY OF PREMATURITY-ASSOCIATED PROTEINS IN PRETERM INFANT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">G01N33/68</main-classification>
        <further-classification edition="201801120260107B">G01N23/2255</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商眼視覺研究中心有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CENTRE FOR EYE AND VISION RESEARCH LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港理工大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE HONG KONG POLYTECHNIC UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　偉青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM, WAI CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM, CHUEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施　英漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SZE, YING HON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖　鎧瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HOI YING ALICIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭　柏文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, PAK MAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何品毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種檢測早產兒視網膜病變(Retinopathy of Prematurity, ROP)相關蛋白質表現量的方法。該方法包括：從早產兒取得淚液樣本，並從該淚液樣本中獲得蛋白質表現譜；於該蛋白質表現譜中檢測一組視網膜病變相關蛋白質，其包含一種或多種的上調蛋白質及下調蛋白質；計算每一該上調蛋白質相對於其基準表現量之對數二倍變化值(Log&lt;sub&gt;2&lt;/sub&gt; fold change, Log&lt;sub&gt;2&lt;/sub&gt;FC)，並同樣的也計算每一該下調蛋白質的對數二倍變化值；生成一清單，其中包含對數二倍變化值大於或等於一正閾值的上調蛋白質，以及對數二倍變化值小於或等於一負閾值的下調蛋白質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method is provided for detecting expression levels of a panel of retinopathy of prematurity (ROP)-associated proteins in a preterm infant. The method involves obtaining a tear sample from the infant and extracting a protein expression profile therefrom. Expression levels of a panel of ROP-associated proteins, including one or more upregulated and downregulated proteins, are detected in the protein expression profile. For each upregulated protein, a log&lt;sub&gt;2&lt;/sub&gt; fold change (Log&lt;sub&gt;2&lt;/sub&gt;FC) value is calculated relative to a corresponding baseline expression level, and similarly for each downregulated protein. A list is then generated that includes upregulated proteins with Log&lt;sub&gt;2&lt;/sub&gt;FC values greater than or equal to a positive threshold, and downregulated proteins with Log&lt;sub&gt;2&lt;/sub&gt;FC values less than or equal to a negative threshold.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101:步驟S101</p>
        <p type="p">S102:步驟S102</p>
        <p type="p">S103:步驟S103</p>
        <p type="p">S104:步驟S104</p>
        <p type="p">S105:步驟S105</p>
        <p type="p">200:檢測早產兒視網膜病變相關蛋白質組表現量之系統</p>
        <p type="p">201:樣本採集模組</p>
        <p type="p">202:蛋白質分析模組</p>
        <p type="p">203:蛋白質檢測模組</p>
        <p type="p">204:運算模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1707" publication-number="202616393">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616393</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135029</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>封裝基板的製作方法</chinese-title>
        <english-title>MANUFACTURE METHOD FOR A PACKAGING SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251113B">H01L21/48</main-classification>
        <further-classification edition="200601120251113B">H01L21/3065</further-classification>
        <further-classification edition="200601120251113B">G05D7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商愛玻索立克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABSOLICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙政柱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, JUNGJU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">實例的封裝基板的製作方法包括如下步驟來準備封裝基板：準備步驟，準備包括芯層、配置於所述芯層的第一電導層及配置於所述第一電導層的絕緣層的基底基板；以及去鑽污步驟，對所述基底基板進行去鑽污。絕緣層包括用於使所述絕緣層朝向厚度方向進行貫通的接觸孔。第一電導層的上部面包括由所述接觸孔所裸露的裸露區域。在去鑽污步驟中，利用包含氧氣和氟類氣體的反應氣體來對所述基底基板進行電漿去鑽污。在去鑽污步驟中，向配置有基底基板的氣氛內導入的所述氟類氣體的流量與所述氧氣的流量之比為4.5以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to an embodiment, a method for manufacturing a packaging substrate comprises: a preparation step to comprise a base substrate including a core layer, a first conductive layer disposed on the core layer, and an insulating layer disposed on the first conductive layer; and a desmear step to comprise desmearing the base substrate, thereby providing a packaging substrate. The insulating layer comprises a contact hole penetrating the insulating layer in a thickness direction. An upper surface of the first conductive layer comprises an exposed region exposed by the contact hole. In the desmear step, the base substrate is plasma-desmeared using a reactive gas comprising oxygen gas and a fluorine-based gas. In the desmear step, a ratio of a flow rate of the fluorine-based gas to a flow rate of the oxygen gas introduced into an atmosphere in which the base substrate is placed is 4.5 or more.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基底基板</p>
        <p type="p">10:芯層</p>
        <p type="p">20:第一電導層</p>
        <p type="p">30:絕緣層</p>
        <p type="p">40:種子層</p>
        <p type="p">41:導電層</p>
        <p type="p">45:第二電導層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1708" publication-number="202615421">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615421</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135073</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>肟酯光起始劑</chinese-title>
        <english-title>OXIME ESTER PHOTOINITIATORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07D209/56</main-classification>
        <further-classification edition="200601120260102B">C08F2/44</further-classification>
        <further-classification edition="200601120260102B">C08F2/50</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/031</further-classification>
        <further-classification edition="200601120260102B">G03F7/038</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">G02B5/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴地斯顏料化工廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀憂茲　帕斯可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYOZ, PASCAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮫島香織</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMESHIMA, KAORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費勒　里昂哈德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FEILER, LEONHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於式(I)之化合物；基於該式(I)化合物之聚合光起始劑；包括該式(I)化合物之可光聚合組合物；用於製備該式(I)化合物之方法；涉及輻照該式(I)化合物之用於化合物之聚合之方法；塗覆有包括該式(I)化合物之可光聚合組合物之經塗覆基板；用於浮凸影像之照相產生之方法，其中對塗覆有包括該式(I)化合物之可光聚合組合物之經塗覆基板實施逐影像曝光，且然後使用顯影劑去除未曝光部分；包括含有該式(I)化合物之光敏樹脂之濾色器及該式(I)化合物作為光起始劑之用途。  &lt;br/&gt;&lt;img align="absmiddle" height="218px" width="377px" file="ed10183.JPG" alt="ed10183.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Compounds of the formula (I), polymeric photoinitiators based upon compounds of the formula (I), photopolymerizable compositions comprising compounds of the formula (I), a process for preparing compounds of the formula (I), a process for the polymerization of compounds involving irradiating compounds of the formula (I), coated substrates coated with a photopolymerizable composition comprising compounds of the formula (I), process for the photographic production of relief images in which a coated substrate coated with a photopolymerizable compositions comprising compounds of the formula (I) is subjected to imagewise exposure and then the unexposed portions are removed with a developer, a color filter comprising a photosensitive resin comprising a compound of the formula (I), and a use of a compound of the formula (I) as a photoinitiator.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1709" publication-number="202616538">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616538</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135120</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>改變的固體電解質界面鋰陽極及方法</chinese-title>
        <english-title>ALTERED SOLID ELECTROLYTE INTERFACE LITHIUM ANODES AND METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260102B">H01M4/134</main-classification>
        <further-classification edition="201001120260102B">H01M4/1395</further-classification>
        <further-classification edition="200601120260102B">H01M4/40</further-classification>
        <further-classification edition="200601120260102B">H01M4/62</further-classification>
        <further-classification edition="201001120260102B">H01M10/052</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商亞比馬利股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALBEMARLE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅德島大學董事會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE UNIVERSITY OF RHODE ISLAND BOARD OF TRUSTEES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴特勒　克莉絲汀納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUTLER, KRISTINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　京南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JINGNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>路赫特　布雷特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUCHT, BRETT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉達拉　慕拿雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEDDALA, MUNAIAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了鋰電池之陽極及能量儲存裝置，包括具有改變的固體電解質界面(SEI)之陽極。藉由曝露於二羧酸形成之陽極SEI展示出能量儲存及穩定性之顯著改良。製造具有改良SEI之陽極之方法包括使一含鋰金屬陽極曝露於包含一或多種二羧酸之一酸溶液持續足以導致一人工SEI在該陽極之一表面上形成之時間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Anodes for Li batteries and energy storage devices are provided, including anodes with an altered solid electrolyte interface (SEI). The anode SEI formed by exposure to a dicarboxylic acid shows significant improvement in energy storage and stability. Methods of making anodes with an improved SEI include exposing a lithium-containing metal anode to an acid solution comprising one or more dicarboxylic acids for a time sufficient to cause the formation of an artificial SEI on a surface of the anode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1710" publication-number="202616220">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616220</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135146</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於射線追蹤著色器之鍊接技術</chinese-title>
        <english-title>CHAINING TECHNIQUES FOR RAY TRACING SHADERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260102B">G06T15/06</main-classification>
        <further-classification edition="201101120260102B">G06T15/04</further-classification>
        <further-classification edition="200601120260102B">G06T1/20</further-classification>
        <further-classification edition="201801120260102B">G06F9/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘋果公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉巴尼　雷克西　阿里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RABBANI RANKOUHI, ALI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>優莉亞諾　盧卡　Ｏ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IULIANO, LUCA O.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛斯特　理查德　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FORSTER, RICHARD J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示關於用於圖形處理器中之射線追蹤之葉著色器的技術。在一些實施例中，圖形處理器包括著色器處理器電路系統及射線加速電路系統，該射線加速電路系統經組態針對圖形場景執行對應於加速資料結構的遍歷操作。該加速電路系統可回應於針對一第一射線到達該加速資料結構中的一節點之遍歷，使該著色器處理器電路系統啟動一第一著色器程式以處理該節點。該處理器可回應於該第一著色器程式中所包括的一指令之執行而啟動及執行一第二著色器程式，以進一步地處理該節點。亦揭示用於針對處理工作集合判定產生單一著色器或多個經鍊接著色器的技術。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Techniques are disclosed relating to leaf shaders for ray tracing in graphics processors. In some embodiments, a graphics processor includes shader processor circuitry and ray acceleration circuitry configured to perform traversal operations corresponding to an acceleration data structure for a graphics scene. The acceleration circuitry may, in response to traversal for a first ray reaching a node in the acceleration data structure, cause the shader processor circuitry to launch a first shader program to process the node. The processor may, in response to execution of an instruction included in the first shader program, launch and execute a second shader program to further process the node. Techniques are also disclosed for determining whether to generate a single shader or multiple chained shaders for a set of processing work.</p>
      </isu-abst>
      <representative-img>
        <p type="p">210:方塊</p>
        <p type="p">220:方塊</p>
        <p type="p">230:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1711" publication-number="202614926">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614926</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135153</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>作為殺有害生物劑的連接的雙環化合物</chinese-title>
        <english-title>LINKED BICYCLIC COMPOUNDS AS PESTICIDES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">A01N43/54</main-classification>
        <further-classification edition="200601120260113B">A01N43/50</further-classification>
        <further-classification edition="200601120260113B">A01P7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商富曼西公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FMC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張文明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, WENMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林發立</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露了具有式&lt;b&gt;1&lt;/b&gt;之化合物，包括其所有幾何異構物和立體異構物、&lt;i&gt;N&lt;/i&gt;-氧化物和鹽，  &lt;br/&gt;&lt;img align="absmiddle" height="208px" width="226px" file="ed10093.JPG" alt="ed10093.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;b&gt;  &lt;/b&gt;&lt;br/&gt;其中R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;、L、A和m如本揭露中所定義。還揭露了含有該等具有式&lt;b&gt;1&lt;/b&gt;之化合物的組成物，以及用於防治和對抗無脊椎有害生物之方法，該等方法包括使該無脊椎有害生物或其環境與生物學有效量的本揭露的化合物或組成物接觸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are compounds of Formula &lt;b&gt;1&lt;/b&gt;, including all geometric and stereoisomers,&lt;b/&gt;&lt;i&gt;N&lt;/i&gt;‑oxides, and salts thereof, &lt;br/&gt;&lt;img align="absmiddle" height="221px" width="217px" file="ed10094.JPG" alt="ed10094.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;b/&gt;&lt;b&gt;  &lt;/b&gt;&lt;br/&gt;wherein R1, R3, L, A and m are as defined in the disclosure. Also disclosed are compositions containing the compounds of Formula &lt;b&gt;1&lt;/b&gt; and methods for controlling and combating an invertebrate pest comprising contacting the invertebrate pest or its environment with a biologically effective amount of a compound&lt;b/&gt;or a composition of the disclosure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1712" publication-number="202615227">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615227</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135181</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>教示裝置、機器人系統及教示程式之作成方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251210B">B25J9/22</main-classification>
        <further-classification edition="200601120251210B">B25J9/18</further-classification>
        <further-classification edition="200601120251210B">G05B19/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古田智大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUTA, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田茂夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, SHIGEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">謀求提供一種教示裝置，可使用直接教學功能來以高作業效率進行機器人的教示程式的作成。教示裝置是把持並移動安裝有作業工具之機器人，對作業對象使用直接教學功能來教示作業之裝置，在使用了直接教學功能之教示中，根據第1輸入來將第1區間中之第1教示條件切換成第2區間中之第2教示條件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">ST1,ST2,ST3,ST4,ST5,ST6,ST7:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1713" publication-number="202615024">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615024</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135188</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>哌啶二酮類化合物、及其藥物組合物和用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">A61K31/4985</main-classification>
        <further-classification edition="200601120260108B">A61K31/44</further-classification>
        <further-classification edition="200601120260108B">A61K31/4196</further-classification>
        <further-classification edition="200601120260108B">A61K31/4188</further-classification>
        <further-classification edition="200601120260108B">A61K31/4184</further-classification>
        <further-classification edition="200601120260108B">A61K31/4178</further-classification>
        <further-classification edition="200601120260108B">A61K31/416</further-classification>
        <further-classification edition="200601120260108B">A61K31/4155</further-classification>
        <further-classification edition="200601120260108B">A61P37/00</further-classification>
        <further-classification edition="200601120260108B">A61P35/00</further-classification>
        <further-classification edition="200601120260108B">A61P3/00</further-classification>
        <further-classification edition="200601120260108B">A61P9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海美悅生物科技發展有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI MEIYUE BIOTECH DEVELOPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>付賢磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, XIANLEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳友喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YOUXI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳永凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YONGKAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUI, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及一種哌啶二酮類化合物、及其藥物組合物和用途，具體而言，提供了一種式( I )所示的哌啶二酮類化合物，其可用於製備藥物，特別是製備預防和/或治療淋巴細胞發育或活性失調引起的或與之相關的疾病或病症的藥物。式( I )中各基團如說明書中所定義。&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="161px" width="142px" file="ed10419.JPG" alt="ed10419.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1714" publication-number="202616535">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616535</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135230</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體系統的可擴充容量及頻寬擴展</chinese-title>
        <english-title>SCALABLE CAPACITY AND BANDWIDTH EXPANSION FOR MEMORY SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">H01L25/18</main-classification>
        <further-classification edition="200601120260102B">H01L23/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘋果公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達布拉　山傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DABRAL, SANJAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述記憶體容量及/或頻寬可擴展的記憶體系統及製造方法。在一些實施方案中，擴展可透過包括客製的緩衝基底晶粒或其他合適的組件來實現，該等其他合適的組件包括連接多個記憶體晶粒堆疊的網路佈線。在一些實施方案中，擴展可透過整合垂直定向的記憶體晶粒堆疊來實現。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Memory system and methods of fabrication are described in which memory capacity and/or bandwidth can be expanded. In some implementations expansion may be accomplished with inclusion of custom buffer base dies, or other suitable components including network routing connecting multiple memory die stacks. In some implementations expansion may be accomplished with integration of vertically oriented memory die stacks.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:記憶體系統</p>
        <p type="p">101:貫通孔</p>
        <p type="p">104:基底矽基材</p>
        <p type="p">108:金屬重分布線</p>
        <p type="p">110:通孔</p>
        <p type="p">112:介電層</p>
        <p type="p">115:晶粒至晶粒佈線</p>
        <p type="p">116:處理器</p>
        <p type="p">117:實體層(PHY)；處理器PHY；邊緣PHY</p>
        <p type="p">117B:客製的晶粒至晶粒PHY；PHY</p>
        <p type="p">118:堆疊記憶體晶粒；記憶體晶粒</p>
        <p type="p">124:實體層(PHY)</p>
        <p type="p">125:網路佈線；內部網路佈線</p>
        <p type="p">126:記憶體控制電路系統</p>
        <p type="p">128:雜項電路系統</p>
        <p type="p">130:系統基材</p>
        <p type="p">134:佈線基材</p>
        <p type="p">138:微凸塊</p>
        <p type="p">140:緩衝基底晶粒；緩衝晶粒</p>
        <p type="p">142:網路佈線電路系統</p>
        <p type="p">143:著陸墊</p>
        <p type="p">144:著陸墊</p>
        <p type="p">150:記憶體晶粒堆疊；記憶體堆疊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1715" publication-number="202616095">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616095</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135231</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>周邊介面之實體層的韌體下載</chinese-title>
        <english-title>FIRMWARE DOWNLOAD FOR PHYSICAL LAYER OF PERIPHERAL INTERFACE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">G06F13/38</main-classification>
        <further-classification edition="201801120260109B">G06F8/65</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘋果公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱爾姆　約翰　Ｈ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KELM, JOHN H.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏克曼　麥克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEKERMAN, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲南　克里斯多福　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FINAN, CHRISTOPHER D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德　凱撒　喬許　Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE CESARE, JOSH P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種設備可包括一電腦系統，該電腦系統包括經組態以執行啟動碼的一或多個處理器電路、一實體介面電路、及一實體介面控制器電路。該實體介面電路可經組態以在複數種模式中操作，該複數種模式包括基於韌體的模式、第一基於硬體的模式、及第二基於硬體的模式。該實體介面控制器電路可耦接至一或多個記憶體電路，且可經組態以在該電腦系統啟動後，在該第一基於硬體的模式中操作該實體介面電路，以從一儲存裝置將啟動碼的至少一第一部分載入至一第一記憶體電路中。在該啟動碼的該第一部分執行之後，該實體介面控制器電路可進一步經組態以在該第二基於硬體的模式中操作該實體介面電路以將韌體載入至一第二記憶體電路中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus may include a computer system that includes one or more processor circuits configured to execute boot code, a physical interface circuit, and a physical interface controller circuit. The physical interface circuit may be configured to operate in a plurality of modes, including firmware-based, first hardware-based, and second hardware-based modes. The physical interface controller circuit, may be coupled to one or more memory circuits, and may be configured to, upon a boot of the computer system, operate the physical interface circuit in the first hardware-based mode to load, from a storage device, at least a first portion of boot code into a first memory circuit. After execution of the first portion of the boot code, the physical interface controller circuit may be further configured to operate the physical interface circuit in the second hardware-based mode to load firmware into a second memory circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電腦系統</p>
        <p type="p">110:實體介面控制器電路</p>
        <p type="p">115:模式</p>
        <p type="p">117:識別符</p>
        <p type="p">120:處理器電路</p>
        <p type="p">130a,130b:記憶體電路</p>
        <p type="p">140:實體介面電路</p>
        <p type="p">150:啟動碼</p>
        <p type="p">155:韌體</p>
        <p type="p">160:通訊網狀架構</p>
        <p type="p">170:儲存裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1716" publication-number="202615591">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615591</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135233</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂加工機用洗淨劑、樹脂加工機用洗淨劑的製造方法、以及洗淨樹脂加工機械的方法</chinese-title>
        <english-title>CLEANING AGENT FOR RESIN PROCESSING MACHINES, MANUFACTURING METHOD OF CLEANING AGENT FOR RESIN PROCESSING MACHINES, AND METHOD FOR CLEANING RESIN PROCESSING MACHINES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08L101/00</main-classification>
        <further-classification edition="200601120260102B">C08L25/12</further-classification>
        <further-classification edition="200601120260102B">C08L53/00</further-classification>
        <further-classification edition="200601120260102B">C08K3/26</further-classification>
        <further-classification edition="200601120260102B">C08K7/14</further-classification>
        <further-classification edition="200601120260102B">C08J3/12</further-classification>
        <further-classification edition="200601120260102B">C08J3/20</further-classification>
        <further-classification edition="200601120260102B">C11D3/10</further-classification>
        <further-classification edition="200601120260102B">C11D3/14</further-classification>
        <further-classification edition="200601120260102B">C11D3/37</further-classification>
        <further-classification edition="200601120260102B">C11D7/12</further-classification>
        <further-classification edition="200601120260102B">C11D7/20</further-classification>
        <further-classification edition="200601120260102B">C11D7/24</further-classification>
        <further-classification edition="200601120260102B">C11D7/32</further-classification>
        <further-classification edition="200601120260102B">C11D11/00</further-classification>
        <further-classification edition="200601120260102B">C11D17/06</further-classification>
        <further-classification edition="200601120260102B">B29B9/06</further-classification>
        <further-classification edition="200601120260102B">B29C33/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商旭化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井俊一朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>I, SHUNICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>室岡茉里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUROOKA, MARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種樹脂加工機用洗淨劑，其可迅速地洗淨、排出熔融成形機之樹脂流路內之殘留樹脂，且樹脂加工機用洗淨劑本身之殘留亦藉由次成形材料而容易取代之洗淨性能及易取代性（非殘留性）、以及顆粒咬入性優異。  &lt;br/&gt;本發明之特徵在於：至少包含（A）熱塑性樹脂、（B）屬於玻璃纖維之第一填料及（C）第二填料，且上述（B）第一填料之重量平均纖維長度為650～1600 μm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide a cleaning agent for resin processing machines that can quickly clean and discharge residual resin from the resin flow path of a melt molding machine, and that has excellent cleaning performance, easy replacement (non-residue properties), and pellet biting properties, so that residual resin in the cleaning agent for resin processing machines itself can be easily replaced by the next molding material. &lt;br/&gt;The present invention is characterized in that it contains at least (A) a thermoplastic resin, (B) a first filler which is a glass fiber, and (C) a second filler, and the weight average fiber length of the (B) first filler is 650 to 1600 μm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1717" publication-number="202615070">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615070</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135235</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於抑制１７β－ＨＳＤ１３基因表現的ＲＮＡｉ劑及其製備方法和用途</chinese-title>
        <english-title>RNAI AGENTS FOR INHIBITING 17β-HSD13 GENE EXPRESSION AND PREPARATION METHOD AND APPLICATION THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">A61K31/7088</main-classification>
        <further-classification edition="201001120260112B">C12N15/113</further-classification>
        <further-classification edition="200601120260112B">A61K48/00</further-classification>
        <further-classification edition="200601120260112B">A61P1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳信立泰藥業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN SALUBRIS PHARMACEUTICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江文娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, WEN-JUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張煒極</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, WEI-JI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李佳霓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIA-NI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　俊軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JUN-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李麗麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, LI-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肖瑛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸銀鎖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YIN-SUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種用於抑制17β-HSD13基因表現的RNAi劑及其製備方法和用途，所述RNAi劑用於治療HSD17B13相關疾病和病症，所述疾病和病症包括NAFLD、NASH、肝纖維化、或者酒精性肝病或非酒精性肝病例如肝硬化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to RNAi agents for inhibiting 17beta-HSD type 13- (17β-HSD13) gene expression and preparation method and application thereof. The RNAi agents disclosed herein can be used in methods of treatment of HSD17B13-related diseases and disorders, including non-alcoholic fatty liver disease (NAFLD), non-alcoholic steatohepatitis (NASH), hepatic fibrosis, or alcoholic or non-alcoholic liver disease, including cirrhosis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1718" publication-number="202616076">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616076</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135239</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於利用異質計算和記憶體資源執行操作的方法</chinese-title>
        <english-title>METHODS FOR PERFORMING OPERATIONS WITH HETEROGENEOUS COMPUTE AND MEMORY RESOURCES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251231B">G06F9/50</main-classification>
        <further-classification edition="200601120251231B">G06F15/80</further-classification>
        <further-classification edition="200601120251231B">G06F13/14</further-classification>
        <further-classification edition="200601120251231B">G06N3/02</further-classification>
        <further-classification edition="200601120251231B">G06F12/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　瑪麗　梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, MARIE MAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮茲馬尼　瑞克哈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PITCHUMANI, REKHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩吉德　烏斯曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAJID, USMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜　亮旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, YANGWOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇　亮奭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KI, YANG SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露用於使用異質計算和記憶體資源執行操作的系統和方法。可以接收識別操作的第一部分和操作的第二部分的資料。可以引起第一資源集合執行操作的第一部分。可以基於操作識別第二資源集合。第二資源集合可以包含具有處理電路的第一基底晶粒、附接至第一基底晶粒的記憶體晶粒、以及連接至第一基底晶粒的第二基底晶粒。第二基底晶粒可以包含第二處理電路。可以引起第二資源集合執行操作的第二部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and methods for performing operations with heterogeneous compute and memory resources are disclosed. Data identifying a first portion of an operation and a second portion of the operation may be received. A first set of resources may be caused to perform the first portion of the operation. A second set of resources may be identified based on the operation. The second set of resources may include a first base die including a processing circuit, a memory die attached to the first base die, and a second base die connected to the first base die. The second base die may include a second processing circuit. The second set of resources may be caused to perform the second portion of the operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1100:程序</p>
        <p type="p">1102、1104、1106、1108:區塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1719" publication-number="202615519">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615519</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135282</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電極之可纖維化聚合物黏合劑</chinese-title>
        <english-title>FIBRILLIZABLE POLYMERIC BINDERS FOR ELECTRODES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F283/12</main-classification>
        <further-classification edition="200601120260102B">C08L27/18</further-classification>
        <further-classification edition="200601120260102B">C01D15/00</further-classification>
        <further-classification edition="200601120260102B">C09J123/28</further-classification>
        <further-classification edition="202101120260102B">H01M50/426</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科慕ＦＣ有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE CHEMOURS COMPANY FC, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布拉德　保羅　道格拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROTHERS, PAU DOUGLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古爾德　班傑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOULD, BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克塔基　寇斯坦帝諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOURTAKIS, KOSTANTINOS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希維特　艾倫　卡普洛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIEVERT, ALLEN CAPRON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏帕薩尼　泰哈斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UPASANI, TEJAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荀士第</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XUN, SHIDI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可纖維化黏合劑組成物，其包含衍生自四氟乙烯(TFE)及共單體之共聚物，該共單體具有至少一個包括氧的極性側接基團。亦提供用於製造電極膜及電池組的黏合劑組成物，其中黏合劑組成物包含可纖維化四氟乙烯(TFE)系聚合物或TFE系共聚物，其與至少一個含氧的極性側接基團之聚合物（諸如離子聚合物）共凝結。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fibrillizable binder composition is provided comprising a copolymer derived from tetrafluoroethylene (TFE) and a comonomer having at least one polar pendant group including oxygen. Also provided are binder compositions for use in making electrode films and batteries wherein the binder compositions comprise a fibrillizable tetrafluoroethylene (TFE)-based polymer or TFE-based copolymer co-coagulated with a polymer having at least one pendant polar group comprising oxygen, such as an ionomer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1720" publication-number="202616069">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616069</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135283</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低精度運算</chinese-title>
        <english-title>LOW-PRECISION COMPUTATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120251201B">G06F9/30</main-classification>
        <further-classification edition="200601120251201B">G06F7/483</further-classification>
        <further-classification edition="200601120251201B">G06F7/57</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商ＡＲＭ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARM LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾約萊　姆布</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EYOLE, MBOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉卡　瑪麗亞姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAKKA, MARIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種設備包含解碼電路系統，其經組態以解碼指令；處理電路系統，其經組態以回應於由該解碼電路系統解碼之該等指令而執行資料處理操作；延伸處理電路系統，其經組態以相對於由該處理電路系統執行的其他資料處理操作異步地執行一低精度運算延伸任務，該低精度運算延伸任務包含處理一或多個資料元素集，其中該等資料元素集中之至少一者包含以一低精度數字格式表示的低精度資料，其精度低於一單精度浮點格式；及一延伸任務卸載介面，其與該處理電路系統向一記憶體系統發布一記憶體系統請求的一介面分開，其中該延伸任務卸載介面回應於由該解碼電路系統解碼的至少一個任務卸載指令，而將該低精度運算延伸任務卸載至該延伸處理電路系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus comprises decoding circuitry configured to decode instructions; processing circuitry configured to perform data processing operations in response to the instructions decoded by the decoding circuitry; extension processing circuitry configured to perform a low-precision computation extension task asynchronously with respect to other data processing operations performed by the processing circuitry, the low-precision computation extension task comprising processing one or more sets of data elements for which at least one of the sets of data elements comprises low-precision data represented in a low-precision number format with lower precision than a single-precision floating-point format; and an extension task offload interface separate from an interface by which the processing circuitry issues a memory system request to a memory system, wherein the extension task offload interface is responsive to at least one task offloading instruction decoded by the decoding circuitry to offload the low-precision computation extension task to the extension processing circuitry.</p>
      </isu-abst>
      <representative-img>
        <p type="p">6:處理電路系統</p>
        <p type="p">8:暫存器；暫存器檔案</p>
        <p type="p">10:設備；處理器</p>
        <p type="p">13:解碼電路系統</p>
        <p type="p">23:延伸處理電路系統</p>
        <p type="p">24:延伸任務卸載介面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1721" publication-number="202616038">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616038</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135309</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251001B">G06F1/16</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仁寶電腦工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COMPAL ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃匯方</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HUI-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭銘崇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, MING-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳科帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KO-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李欣蓉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HSIN-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡臻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林靖傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JING-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林祐安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾綉珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, HSIU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐郁欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YU-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉得益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIOU, DE-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置，包括第一機體、第二機體以及鉸鏈結構。鉸鏈結構包括第一轉軸、連接第一轉軸的第一支架、第二轉軸、連接第二轉軸的第二支架以及第一定位件。第一支架固接於第一機體的第一鉸鏈部。第二支架固接於第二機體的第二鉸鏈部。第一轉軸可旋轉地穿設於第一定位件，且第一定位件可旋轉地套接於第二轉軸。第一鉸鏈部設有第一限位凸起。第二鉸鏈部設有第二限位凸起。第一定位件設有對應第一轉軸的第三限位凸起與對應第二轉軸的第四限位凸起。第三限位凸起位於第一限位凸起的旋轉路徑上。第二限位凸起位於第四限位凸起的旋轉路徑上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device including a first body, a second body, and a hinge structure is provided. The hinge structure includes a first shaft, a first bracket connected to the first shaft, a second shaft, a second bracket connected to the second shaft, and a first positioning member. The first bracket is fixed to a first hinge portion of the first body. The second bracket is fixed to a second hinge portion of the second body. The first shaft rotatably passes through the first positioning member, and the first positioning member is rotatably sleeved on the second shaft. The first hinge portion has a first limiting protrusion. The second hinge portion has a second limiting protrusion. The first positioning member has a third limiting protrusion corresponding to the first shaft and a fourth limiting protrusion corresponding to the second shaft. The third limiting protrusion is located on a rotational path of the first limiting protrusion. The second limiting protrusion is located on a rotational path of the fourth limiting protrusion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:第一機體</p>
        <p type="p">110a:背面</p>
        <p type="p">111:第一鉸鏈部</p>
        <p type="p">1111:第一限位凸起</p>
        <p type="p">120:第二機體</p>
        <p type="p">120a:操作面</p>
        <p type="p">121:第二鉸鏈部</p>
        <p type="p">121a:頂面</p>
        <p type="p">1211:第二限位凸起</p>
        <p type="p">130:鉸鏈結構</p>
        <p type="p">134a:第一固定部</p>
        <p type="p">135:第一定位件</p>
        <p type="p">1351:第三限位凸起</p>
        <p type="p">1352:第四限位凸起</p>
        <p type="p">137:第二定位件</p>
        <p type="p">1371:第一鎖定凹部</p>
        <p type="p">1372:第二鎖定凹部</p>
        <p type="p">139a:第一鎖定件</p>
        <p type="p">1391a:第一鎖定凸部</p>
        <p type="p">139b:第二鎖定件</p>
        <p type="p">1391b:第二鎖定凸部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1722" publication-number="202615904">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615904</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135320</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學構件之配置結構及顯示體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260106B">G02B5/30</main-classification>
        <further-classification edition="200601120260106B">G02F1/1335</further-classification>
        <further-classification edition="202301120260106B">H10K77/00</further-classification>
        <further-classification edition="200601120260106B">G02B27/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種光學構件之配置結構，該光學構件可調整從顯示面往斜向射出之光。關於本發明實施形態之光學構件之配置結構，該光學構件係設於對使用者顯示影像之顯示體；且，前述光學構件之配置結構具備第一偏光構件、調整構件及第二偏光構件。第一偏光構件、調整構件及第二偏光構件係朝使用者依序配置。調整構件之厚度方向的相位差Rth(550)的絕對值為500nm以上且1200nm以下。從使用者側觀看第二偏光構件時，第二偏光構件之透射軸與第一偏光構件之透射軸係配置成大致平行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光學構件之配置結構</p>
        <p type="p">3:使用者之眼睛</p>
        <p type="p">12:顯示元件</p>
        <p type="p">12a:顯示面</p>
        <p type="p">30:調整構件</p>
        <p type="p">31:第一偏光構件</p>
        <p type="p">32:第二偏光構件</p>
        <p type="p">100:顯示體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1723" publication-number="202616757">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616757</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135326</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於無線ＬＡＮ系統中組態執行ＭＡＰＣ協議拆解的訊框的方法及裝置</chinese-title>
        <english-title>METHOD AND APPARTUS FOR CONFIGURING FRAME FOR PERFORMING TEARDOWN OF MAPC AGREEMENT IN WIRELESS LAN SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">H04W72/04</main-classification>
        <further-classification edition="200601120260102B">H04L5/00</further-classification>
        <further-classification edition="202201120260102B">H04L65/40</further-classification>
        <further-classification edition="200901120260102B">H04W36/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金虔煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, GEONHWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔鎭洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JINSOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李弘源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HONGWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仁善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, INSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白善熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAEK, SUNHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹藝隣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, YELIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>車東柱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHA, DONGJU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提出了一種用於無線LAN系統中組態執行MAPC協議拆解的訊框的方法及裝置。具體而言，第一AP向第二AP傳輸協商請求訊框。該第一AP基於該協商請求訊框執行與該第二AP的MAPC協議的拆解。該協商請求訊框是具有公共動作欄位的第一值的公共動作訊框。該協商請求訊框用於拆解該MAPC協議。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and apparatus for configuring a frame for performing a teardown of a MAPC agreement in a wireless LAN system are proposed. Specifically, a first AP transmits a negotiation request frame to a second AP. The first AP performs the teardown of the MAPC agreement with the second AP based on the negotiation request frame. The negotiation request frame is a public action frame having a first value of a public action field. The negotiation request frame is used to teardown the MAPC agreement.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S2910,S2920:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1724" publication-number="202615670">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615670</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135345</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>厚鋼板及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251224B">C21D8/02</main-classification>
        <further-classification edition="200601120251224B">B22D11/00</further-classification>
        <further-classification edition="200601120251224B">C22C38/28</further-classification>
        <further-classification edition="200601120251224B">C21D9/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JFE STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木津谷茂樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITSUYA, SHIGEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柚賀正雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUGA, MASAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種即便於大量含有雜質元素的情況下亦具有優異的板厚方向拉伸特性的厚鋼板。一種厚鋼板，具有以質量%計含有C：0.050%～0.200%、Si：0.02%～0.60%、Mn：0.50%～1.80%、P：0.003%～0.030%、S：0.0005%～0.0080%、Cu：0.02%～0.50%、Cr：0.02%～0.50%、Sn：0.005%～0.050%、Ti：0.002%～0.030%、Al：0.010%～0.100%、及N：0.0010%～0.0080%、且剩餘部分包含Fe及不可避免的雜質的成分組成，板厚為50 mm以下，藉由板厚方向拉伸試驗而測定的收縮值為50%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1725" publication-number="202616868">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616868</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135348</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251201B">H10D62/10</main-classification>
        <further-classification edition="202501120251201B">H10D62/40</further-classification>
        <further-classification edition="202501120251201B">H10D62/60</further-classification>
        <further-classification edition="202501120251201B">H10D62/80</further-classification>
        <further-classification edition="202501120251201B">H10D64/20</further-classification>
        <further-classification edition="202501120251201B">H10D88/00</further-classification>
        <further-classification edition="200601120251201B">G11C7/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金錫源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SEOKWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李政河</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JUNGHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴相炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SANGHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李道仙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DOSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宣姃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SUNJUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李鐘原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JONGWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置包括：一位元線，其于一基體上在一垂直方向上延伸；一電晶體主體，其電氣連接於該位元線且在一第一水平方向上包括一第一源極/汲極區、一通道區及一第二源極/汲極區；一閘極電極，其在與該第一水平方向相交之一第二水平方向上且在該通道區上延伸，其中一閘極介電層位於該閘極電極與該通道區之間；以及一胞元電容器，其電氣連接於該第二源極/汲極區且在該第一水平方向上包括一儲存電極、一電容器介電層及一板電極。一摻雜多晶矽層及一接觸金屬層皆位於該第二源極/汲極區與該儲存電極之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device including a bit line extending in a vertical direction on a substrate, a transistor body electrically connected to the bit line and including a first source/drain region, a channel region, and a second source/drain region in a first horizontal direction, a gate electrode extending in a second horizontal direction intersecting the first horizontal direction and on the channel region where a gate dielectric layer is between the gate electrode and the channel region, and a cell capacitor electrically connected to the second source/drain region and including a storage electrode, a capacitor dielectric layer and a plate electrode in the first horizontal direction. A doped polysilicon layer and a contact metal layer are both between the second source/drain region and the storage electrode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體裝置</p>
        <p type="p">102:基體</p>
        <p type="p">120BD:電晶體主體</p>
        <p type="p">122:第一源極/汲極區</p>
        <p type="p">124:第二源極/汲極區</p>
        <p type="p">126:通道區</p>
        <p type="p">154P:隔離絕緣圖案</p>
        <p type="p">172:間隔體襯裡層</p>
        <p type="p">174:間隔體隱埋層</p>
        <p type="p">182:閘極介電層</p>
        <p type="p">184:閘極電極</p>
        <p type="p">192:間隔體覆蓋層</p>
        <p type="p">194:位元線</p>
        <p type="p">196:第三隱埋絕緣層</p>
        <p type="p">210:摻雜多晶矽層</p>
        <p type="p">220:接觸金屬層</p>
        <p type="p">300:胞元電容器</p>
        <p type="p">310:中空圓柱形儲存電極、儲存電極</p>
        <p type="p">320:電容器介電層</p>
        <p type="p">330:板電極</p>
        <p type="p">B-B':線</p>
        <p type="p">CX:放大部分</p>
        <p type="p">D1:第一水平方向</p>
        <p type="p">D3:垂直方向</p>
        <p type="p">TR:胞元電晶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1726" publication-number="202615731">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615731</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135362</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電場控制元件及電鍍裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251202B">C25D17/00</main-classification>
        <further-classification edition="200601120251202B">C25D21/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商盛美半導體設備(上海)股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH (SHANGHAI), INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊宏超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HONGCHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈照偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIA, ZHAOWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>刁建華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIAO, JIANHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳勐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, MENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電場控制元件及電鍍裝置。電場控制元件用於襯底電鍍期間允許離子電流穿過該電場控制元件並流向所述襯底，所述襯底包括多個晶粒和位於每個晶粒內並用於構成所述襯底內鍍膜圖案的多個凹陷特徵，所述電場控制元件為板狀結構，所述電場控制元件上開有多個孔隙，所述電場控制元件上的孔隙率與所述襯底上的鍍膜率正相關，使得所述襯底上的鍍膜達到期望厚度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">G:間隙</p>
        <p type="p">Z:軸</p>
        <p type="p">1:襯底</p>
        <p type="p">2:襯底保持件</p>
        <p type="p">3:電鍍腔</p>
        <p type="p">4:擴散板</p>
        <p type="p">5:電場控制元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1727" publication-number="202614965">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614965</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135380</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>心房顫動及呼吸中止預測模型建立方法及心房顫動及呼吸中止預測方法</chinese-title>
        <english-title>METHOD OF ATRIAL FIBRILLATION AND APNEA-HYPOPNEA PREDICTION MODEL ESTABLISHMENT AND METHOD OF ATRIAL FIBRILLATION AND APNEA-HYPOPNEA PREDICTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61B5/02</main-classification>
        <further-classification edition="200601120260102B">A61B5/11</further-classification>
        <further-classification edition="202301120260102B">G06F18/214</further-classification>
        <further-classification edition="202301120260102B">G06F18/22</further-classification>
        <further-classification edition="202201120260102B">G06V10/774</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林哲偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHE WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴　誠信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FEBRYAN, SETIAWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林政佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHENG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種心房顫動及呼吸中止預測方法，藉由一儲存有一心房顫動及呼吸中止預測模型的電腦系統來執行以下步驟：獲得一對應於一待測患者的待測心電圖訊號；將該待測心電圖訊號切分成多個具有相同時間長度的待測訊號片段；對該等待測訊號片段進行特徵提取，以獲得多個分別對應於該等待測訊號片段的特徵資訊；及對於每一待測訊號片段的特徵資訊，根據該特徵資訊，利用該心房顫動及呼吸中止預測模型，獲得一對應於該待測訊號片段的症狀類別預測結果，該症狀類別預測結果指示出該待測訊號片段是否對應有心房顫動或呼吸中止。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In a method of atrial fibrillation and apnea-hypopnea prediction, a computer system storing an atrial fibrillation and apnea-hypopnea prediction model is configured to perform the steps of: obtaining an electrocardiogram (ECG) signal corresponding to a patient; dividing the ECG signal into a plurality of signal segments having the same time length; performing feature extraction on the signal segments to obtain a plurality of feature information corresponding to the signal segments; and obtaining a symptom category prediction result corresponding to the signal segment based on the feature information of each signal segment using the atrial fibrillation and apnea-hypopnea prediction model, wherein the symptom category prediction result indicates whether the signal segment corresponds to atrial fibrillation or apnea-hypopnea.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S31~S35:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1728" publication-number="202616344">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616344</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135385</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>下電極組件、下電極組件控制方法和半導體製程設備</chinese-title>
        <english-title>LOWER ELECTRODE ASSEMBLY, LOWER ELECTRODE ASSEMBLY CONTROL METHOD, AND SEMICONDUCTOR PROCESS EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251105B">H01J37/32</main-classification>
        <further-classification edition="200601120251105B">H05H1/46</further-classification>
        <further-classification edition="200601120251105B">H05H1/34</further-classification>
        <further-classification edition="200601120251105B">H05H1/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁倩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, QIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王海莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HAI LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊岩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHUANG, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請實施例提供了一種下電極組件、下電極組件控制方法和半導體製程設備，該下電極組件包括：聚焦環，晶圓承載裝置，射頻電源，檢測模組和控制模組，聚焦環環繞晶圓承載裝置的承載面設置，檢測模組與控制模組連接；射頻電源用於向晶圓承載裝置的偏壓電極和聚焦環施加射頻電壓；檢測模組用於獲取聚焦環下表面的第一射頻電壓信號和承載面上的晶圓下表面的第二射頻電壓信號；控制模組用於根據第一射頻電壓信號和第二射頻電壓信號判斷下電極組件的工作狀態是否正常，從而可以準確對下電極組件的工作狀態進行監測，避免了設備打火。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An embodiment of the present application provides a lower electrode assembly, a lower electrode assembly control method and semiconductor process equipment. The lower electrode assembly includes a focusing ring, a wafer support device, a radio frequency power supply, a detection module and a control module. The focusing ring is arranged around the support surface of the wafer support device, and the detection module is connected to the control module. The radio frequency power supply is used to apply radio frequency voltage to the bias electrode and to the focusing ring of the wafer support device. The detection module is used to obtain a first radio frequency voltage signal on the lower surface of the focusing ring and a second radio frequency voltage signal on the lower surface of the wafer positioned on the support surface. The control module is used to determine whether the working state of the lower electrode assembly is normal based on the first radio frequency voltage signal and the second radio frequency voltage signal, so that the working state of the lower electrode assembly can be accurately monitored to prevent equipment sparking.</p>
      </isu-abst>
      <representative-img>
        <p type="p">106:聚焦環</p>
        <p type="p">112:晶圓</p>
        <p type="p">401:檢測模組</p>
        <p type="p">402:控制模組</p>
        <p type="p">403:晶圓承載裝置</p>
        <p type="p">403a:卡盤</p>
        <p type="p">403b:基座</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1729" publication-number="202615193">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615193</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135433</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電弧銲接用實心線</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B23K35/02</main-classification>
        <further-classification edition="200601120260102B">B23K35/30</further-classification>
        <further-classification edition="200601120260102B">B23K9/02</further-classification>
        <further-classification edition="200601120260102B">B23K9/16</further-classification>
        <further-classification edition="200601120260102B">C22C38/00</further-classification>
        <further-classification edition="200601120260102B">C22C38/38</further-classification>
        <further-classification edition="200601120260102B">C22C38/58</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＦＥ鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JFE STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邊一史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, KAZUFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泉大地</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IZUMI, DAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙田充志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKADA, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安藤彰芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDO, AKIYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田圭治
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEDA, KEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的是為了提供電弧銲接用實心線。  &lt;br/&gt;　　本發明的電弧銲接用實心線，實心線的化學組成，以質量%計，係含有C：0.05~1.00%、Si：0.05~1.00%、Mn：30.0~40.0%、P：0.100%以下、S：0.100%以下、Al：0.005~5.000%、Cr：0.400~10.000%，根據需要含有選自Ni：15.0%以下、Mo：5.00%以下、Cu：1.00%以下、V：1.000%以下、Nb：1.000%以下、Ti：1.000%以下、N：0.400%以下、W：1.000%以下、Ca：0.020%以下、REM：0.020%以下、Sn：0.016%以下、Zn：0.005%以下當中之1種或2種以上，剩餘部分為Fe及不可避免的雜質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:母材(鋼材)</p>
        <p type="p">2:銲接金屬</p>
        <p type="p">3:開槽形狀</p>
        <p type="p">4:背襯材</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1730" publication-number="202614989">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614989</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135453</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於活性劑之受控遞送的皮膚護理組成物</chinese-title>
        <english-title>SKINCARE COMPOSITIONS FOR CONTROLLED DELIVERY OF ACTIVE AGENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">A61K8/85</main-classification>
        <further-classification edition="201701120260108B">A61K47/34</further-classification>
        <further-classification edition="200601120260108B">A61Q19/00</further-classification>
        <further-classification edition="200601120260108B">A61P17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＥＬＣ管理公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELC MANAGEMENT LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索伊卡　米蘭弗朗茲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOJKA, MILAN FRANZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米拉多　約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIRADOR, JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　威爾森Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WILSON A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳展俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示一種水性外用皮膚護理組成物，其包含：一或多種皮膚活性劑，諸如補骨脂酚；微晶纖維素；及成膜聚合物摻合物，其中該聚合物摻合物係丙烯酸酯共聚物及丙烯酸酯/乙酸乙烯酯共聚物之組合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An aqueous topical skincare composition that comprises one or more skin active agents, such as bakuchiol; microcrystalline cellulose; and a film forming polymer blend, wherein the polymer blend is a combination of acrylates copolymer and acrylates/vinyl acetate copolymer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1731" publication-number="202616073">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616073</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135458</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>任務委派</chinese-title>
        <english-title>TASK DELEGATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120251201B">G06F9/44</main-classification>
        <further-classification edition="201801120251201B">G06F9/30</further-classification>
        <further-classification edition="200601120251201B">G06F9/46</further-classification>
        <further-classification edition="200601120251201B">G06F13/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商ＡＲＭ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARM LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比斯康迪　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BISCONDI, ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼塞爾　大衛漢納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANSELL, DAVID HENNAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾約萊　姆布</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EYOLE, MBOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種設備、一種方法、及一種電腦程式。該設備包含用以儲存資料之複數個暫存器，該複數個暫存器包含至少一個陣列暫存器。該設備包含用於處理一指令序列之資料處理電路系統。該資料處理電路系統包含解碼器電路系統，該解碼器電路系統回應於接收到指定該至少一個陣列暫存器之一或多個指令而控制該資料處理電路系統執行與該至少一個陣列暫存器相關之陣列處理操作。該設備包含延伸處理電路系統，該延伸處理電路系統回應於由該資料處理電路系統識別一委派任務而與該資料處理電路系統異步地執行該委派任務。該解碼器電路系統回應於一委派指令而觸發該延伸處理電路系統執行與該等陣列處理操作中之一者相關聯之一或多個操作作為該委派任務。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is provided an apparatus, a method, and a computer program. The apparatus comprises a plurality of registers to store data, the plurality of registers comprising at least one array register. The apparatus comprises data processing circuitry for processing a sequence of instructions. The data processing circuitry comprises decoder circuitry responsive to receipt of one or more instructions specifying the at least one array register to control the data processing circuitry to perform array processing operations in relation to the at least one array register. The apparatus comprises extension processing circuitry responsive to identification, by the data processing circuitry, of a delegated task to perform the delegated task asynchronously to the data processing circuitry. The decoder circuitry is responsive to a delegation instruction to trigger the extension processing circuitry to perform, as the delegated task, one or more operations associated with one of the array processing operations.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:設備</p>
        <p type="p">2:暫存器</p>
        <p type="p">3:陣列暫存器</p>
        <p type="p">4:向量暫存器</p>
        <p type="p">5:純量暫存器</p>
        <p type="p">6:資料處理電路系統；處理電路系統</p>
        <p type="p">7:解碼器電路系統</p>
        <p type="p">8:延伸處理電路系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1732" publication-number="202616226">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616226</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135459</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於局部物體插入的位置模型化</chinese-title>
        <english-title>LOCATION MODELING FOR LOCALIZED OBJECT INSERTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260102B">G06V10/82</main-classification>
        <further-classification edition="202301120260102B">G06N3/045</further-classification>
        <further-classification edition="201701120260102B">G06T7/73</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹柱烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUN, JOOYEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿巴蒂　戴維德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABATI, DAVIDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧姆蘭　穆罕默德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMRAN, MOHAMED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維格斯　奧克喬里斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIGGERS, AUKE JORIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述用於判定定界框座標的系統及技術。例如，一種運算裝置可處理一影像以產生與該影像相關聯的第一複數個符記。該運算裝置可使用一第一機器學習模型，處理該第一複數個符記及與一物體的一類別相關聯的一類別符記以產生與該影像內的一定界框的座標相關聯的一機率分布。該運算裝置可基於該機率分布而判定目標座標以將該定界框定位在該影像內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and techniques are described herein for determining bounding box coordinates. For example, a computing device can process an image to generate a first plurality of tokens associated with the image. The computing device can process, using a first machine learning model, the first plurality of tokens and a class token associated with a class of an object to generate a probability distribution associated with coordinates of a bounding box within the image. The computing device can determine, based on the probability distribution, target coordinates to position the bounding box within the image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200A:系統</p>
        <p type="p">202:影像</p>
        <p type="p">204:物體類別選擇</p>
        <p type="p">206:第一編碼器</p>
        <p type="p">208:第二編碼器</p>
        <p type="p">210:視覺符記</p>
        <p type="p">212:物體類別符記；類別符記</p>
        <p type="p">214:機器學習模型</p>
        <p type="p">216:輸入</p>
        <p type="p">218:輸出</p>
        <p type="p">220A:第一機率；機率</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1733" publication-number="202616070">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616070</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135464</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電腦設備、操作電腦設備的方法以及電腦系統</chinese-title>
        <english-title>COMPUTER APPARATUS, METHOD FOR OPERATING COMPUTER APPARATUS AND COMPUTER SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260102B">G06F9/38</main-classification>
        <further-classification edition="201801120260102B">G06F9/30</further-classification>
        <further-classification edition="200601120260102B">G06F3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張通</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, TONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾健平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, JIANPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮楚馬尼　瑞卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PITCHUMANI, REKHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇　亮奭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KI, YANG SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種用於暫存器重新命名的技術。位移擷取器用以基於識別第一執行緒或第二執行緒中至少一者的執行緒識別碼，根據第一暫存器使用情況和第二暫存器使用情況，分別獲得第一位移和第二位移。第一執行緒和第二執行緒在處理元件上執行。位址指標用以基於第一位移或第二位移中至少一個，分別產生第一暫存器位址或第二暫存器位址中至少一個。第一暫存器位址和第二暫存器位址分別對應儲存在暫存檔案中的第一運算元和第二運算元。第一執行緒和第二執行緒分別包含分別操作第一運算元和第二運算元的第一解碼指令和第二解碼指令。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A technique for register renaming is disclosed. An offset retriever is configured to obtain a first offset and a second offset according to a first register usage and a second register usage respectively based on a thread identifier that identifies at least one of a first thread or a second thread respectively. The first and second threads execute on a processing element (PE). An address pointer is configured to generate at least one of a first register address or a second register address based on at least one of the first offset or the second offset respectively. The first and second register addresses correspond to first and second operands respectively stored in the register file. The first and second threads include first and second decoded instructions respectively that operate on the first and second operands respectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">110:處理器</p>
        <p type="p">120:記憶體管理電路</p>
        <p type="p">125:L2快取</p>
        <p type="p">130:處理管理電路</p>
        <p type="p">132:主執行電路</p>
        <p type="p">134:主記憶體</p>
        <p type="p">136:中斷控制器</p>
        <p type="p">140:輸入/輸出控制器</p>
        <p type="p">142:大容量儲存器</p>
        <p type="p">144:輸入/輸出裝置</p>
        <p type="p">146:網路介面卡</p>
        <p type="p">148:無線媒介</p>
        <p type="p">150:圖形顯示控制器</p>
        <p type="p">152:顯示裝置</p>
        <p type="p">155、190&lt;sub&gt;1&lt;/sub&gt;:匯流排</p>
        <p type="p">160:記憶體控制器</p>
        <p type="p">162:記憶體</p>
        <p type="p">164:高頻寬記憶體</p>
        <p type="p">166:非揮發性記憶體</p>
        <p type="p">170&lt;sub&gt;1&lt;/sub&gt;、170&lt;sub&gt;N&lt;/sub&gt;:處理元件</p>
        <p type="p">172&lt;sub&gt;1&lt;/sub&gt;:L1快取</p>
        <p type="p">174&lt;sub&gt;1&lt;/sub&gt;:配置電路</p>
        <p type="p">180&lt;sub&gt;1&lt;/sub&gt;:執行電路</p>
        <p type="p">182&lt;sub&gt;1&lt;/sub&gt;:中斷電路</p>
        <p type="p">192&lt;sub&gt;1&lt;/sub&gt;:指令記憶體</p>
        <p type="p">194&lt;sub&gt;1&lt;/sub&gt;:資料記憶體</p>
        <p type="p">196&lt;sub&gt;1&lt;/sub&gt;:計算電路</p>
        <p type="p">198&lt;sub&gt;1&lt;/sub&gt;:通訊介面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1734" publication-number="202616693">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616693</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135468</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>子頻帶全雙工感知之裝置的上行鏈路訊息重複</chinese-title>
        <english-title>UPLINK MESSAGE REPETITIONS FOR SUBBAND FULL DUPLEX-AWARE DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H04L5/00</main-classification>
        <further-classification edition="200601120260102B">H04L5/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊普拉欣　阿普杜勒拉曼穆罕默德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IBRAHIM, ABDELRAHMAN MOHAMED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿布達加法爾　穆罕默德賽義德凱里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABDELGHAFFAR, MUHAMMAD SAYED KHAIRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述用於無線通訊的方法、系統、及裝置。一種使用者設備(UE)可接收控制傳訊，該控制傳訊指示對應於一第一類型上行鏈路時機的一第一組上行鏈路時機、及對應於一第二類型上行鏈路時機的一第二組上行鏈路時機，其中該第一類型上行鏈路時機係子頻帶全雙工(SBFD)上行鏈路時機，且該第二類型上行鏈路時機係非SBFD時機。該UE可接收第二控制傳訊，該第二控制傳訊指示一第一組態或一第二組態，該第一組態支援經由該第一類型符號或該第二類型符號的無線通訊，該第二組態支援經由該第一類型符號及該第二類型符號兩者的無線通訊。該UE可執行上行鏈路重複之上行鏈路時機的資源選擇，且可經由該等所選擇一或多個上行鏈路時機傳輸一上行鏈路訊息之一或多個重複。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods, systems, and devices for wireless communications are described. A user equipment (UE) may receive control signaling indicating a first set of uplink occasions corresponding to a first type of uplink occasions, and a second set of uplink occasions corresponding to a second type of uplink occasions, where the first type of uplink occasions are subband full duplex (SBFD) uplink occasions, and the second type of uplink occasions are non-SBFD occasions. The UE may receive second control signaling indicating a first configuration supporting wireless communications via the first type of symbols or the second type of symbols, or a second configuration supporting wireless communications via both the first and second types of symbols. The UE may perform resource selection of uplink occasions for uplink repetitions, and may transmit one or more repetitions of an uplink message via the selected one or more uplink occasions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">105-a:網路實體</p>
        <p type="p">115-a:UE</p>
        <p type="p">200:無線通訊系統</p>
        <p type="p">205:上行鏈路資源</p>
        <p type="p">210:下行鏈路資源</p>
        <p type="p">215:第一上行鏈路時機</p>
        <p type="p">220:第二上行鏈路時機</p>
        <p type="p">225:上行鏈路時槽</p>
        <p type="p">230:SBFD時槽</p>
        <p type="p">235:第一控制傳訊</p>
        <p type="p">240:第二控制傳訊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1735" publication-number="202616439">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616439</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135469</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於檢查系統的頂板</chinese-title>
        <english-title>TOP PLATE FOR INSPECTION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251231B">H01L21/67</main-classification>
        <further-classification edition="200601120251231B">H01L21/66</further-classification>
        <further-classification edition="200601120251231B">G01N21/88</further-classification>
        <further-classification edition="200601120251231B">G01N21/958</further-classification>
        <further-classification edition="200601120251231B">G01N21/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商昂圖創新公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONTO INNOVATION INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>銀圖　斯蒂芬　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTO, STEPHEN W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法里亞斯　亞歷克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FARIAS, ALEX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述一種頂板設計，舉例而言，該頂板設計在頂板總成中允許快速更換反射器板。使用各種技術，反射器板或（在一些實例中）照明源在操作期間藉由一真空保持定位。此技術牢固地固持反射器板而無需頂側固定，從而最大化一基材的可用主動區。真空固定面板或晶圓而未接觸主動區，從而允許無接觸檢查及計量。頂板亦促進使用可替換的反射器板，從而實現對基材特徵的背光或反射照明。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A top plate design is described that allows a quick change of the reflector plates, for example, in the top plate assembly. Using various techniques, the reflector plates or, in some examples, sources of illumination, are held in place by a vacuum during operation. This technique holds the reflector plates securely without top-side fixturing, maximizing the available active area of a substrate. A vacuum secures the panel or wafer without contacting the active areas, allowing for non-contact inspection and metrology. The top plate also facilitates the use of interchangeable reflector plates, enabling backlit or reflective illumination of the substrate’s features.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:頂板</p>
        <p type="p">200a,200b,200c,200d:反射器板；照明源</p>
        <p type="p">300:基材</p>
        <p type="p">304:電連接器</p>
        <p type="p">306:電連接器</p>
        <p type="p">308:纜線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1736" publication-number="202615537">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615537</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135495</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可回收再加工的非晶性環氧樹脂組合物、包含其的固化性組合物及複合材料</chinese-title>
        <english-title>RECYCLABLE AND REPROCESSABLE AMORPHOUS EPOXY RESIN COMPOSITION, CURABLE COMPOSITION AND COMPOSITE MATERIAL CONTAINING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08G59/20</main-classification>
        <further-classification edition="200601120260102B">C08L63/00</further-classification>
        <further-classification edition="200601120260102B">C08K5/156</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商國都化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUK DO CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金源曄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, WON YEOB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李佳英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, GA YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世鎮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SE JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金珉暎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MIN YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許珍煜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUR, JIN WUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種可回收再加工的非晶性環氧樹脂組合物、包含其的固化性組合物及複合材料，具體地，涉及一種通過調整反應產物來控制結晶性的可回收再加工的非晶性環氧樹脂組合物、包含其的固化性組合物及複合材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1737" publication-number="202615284">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615284</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135499</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子車架鎖</chinese-title>
        <english-title>ELECTRONIC FRAME LOCK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251231B">B62H5/14</main-classification>
        <further-classification edition="200601120251231B">E05B71/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商安博歐葛斯特布雷米克索尼公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABUS AUGUST BREMICKER SOEHNE KG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>發明人放棄姓名表示權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>發明人放棄姓名表示權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請係關於電子車架鎖。用於自行車，特別是電動自行車(E-Bike)的電子車架鎖包括機電鎖定機構，該機電鎖定機構具有可在鎖定位置和解鎖位置之間運動的鎖栓，以及具有電動馬達和用於為電動馬達供應電能和/或接收控制信號的纜線。該車架鎖具有相對於環形鎖弓的周向方向徑向向內的內側和相對於環形鎖弓的周向方向徑向向外的外側，其中，鎖體具有位於內側的纜線出口開口，纜線通過該纜線出口開口從鎖體中穿出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic frame lock for a bicycle, in particular for an e-bike, comprises an electromechanical locking mechanism with a bolt that can be moved between a locking position and an unlocking position in order to lock or unlock a round shackle of the frame lock, and with an electric motor and a cable for receiving a control signal and/or a power supply for the electric motor. The frame lock has an inner side located radially inside the round shackle in relation to a circumferential direction of the round shackle and an outer side located radially outside the round shackle in relation to the circumferential direction of the round shackle, wherein a lock body of the frame lock has a cable exit opening located at the inner side through which the cable exits from the lock body.</p>
      </isu-abst>
      <representative-img>
        <p type="p">19:手柄</p>
        <p type="p">57’:車架鎖</p>
        <p type="p">59:纜線</p>
        <p type="p">61:內側</p>
        <p type="p">63:外側</p>
        <p type="p">65:纜線出口開口</p>
        <p type="p">67:鎖體</p>
        <p type="p">75:端側</p>
        <p type="p">83:外殼</p>
        <p type="p">85:固定部段</p>
        <p type="p">87:固定開口</p>
        <p type="p">D:轉動軸線</p>
        <p type="p">T:切向方向</p>
        <p type="p">U:周向方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1738" publication-number="202616229">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616229</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135514</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>部署在可撓性裝置中之指紋感測器的影像增強</chinese-title>
        <english-title>IMAGE ENHANCEMENT FOR FINGERPRINT SENSOR DEPLOYED IN A FLEXIBLE DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260102B">G06V40/13</main-classification>
        <further-classification edition="202201120260102B">G06V10/36</further-classification>
        <further-classification edition="202201120260102B">G06V40/12</further-classification>
        <further-classification edition="200601120260102B">G06F3/041</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐長汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, CHANGTING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　國良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, KWOKLEUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施卓勒曼　潔西卡　劉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STROHMANN, JESSICA LIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許瑋恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEI-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顧　瑾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GU, JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾春文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, CHUENWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一些方法可涉及接收指紋影像資料。一些方法可涉及判定指紋影像資料是由裝置的第一指紋感測器或是裝置的第二指紋感測器所擷取。一些方法可涉及基於指紋影像資料是由裝置的第二指紋感測器所擷取的判定來獲得指紋影像資料的增強版本。一些方法可涉及提供指紋影像資料的增強版本以用於認證。在一些實例中，獲得指紋影像資料的增強版本可涉及影像增強機器學習模型。在一些實例中，在獲得指紋影像資料的增強版本之前，做出由第二指紋感測器所擷取的指紋影像資料無法滿足品質臨限的判定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Some methods may involve receiving fingerprint image data. Some methods may involve determining whether the fingerprint image data was captured by a first fingerprint sensor of a device or a second fingerprint sensor of the device. Some methods may involve obtaining an enhanced version of the fingerprint image data based on a determination that the fingerprint image data was captured by the second fingerprint sensor of the device. Some methods may involve providing the enhanced version of the fingerprint image data for authentication. In some examples, obtaining the enhanced version of the fingerprint image data may involve an image enhancement machine learning model. In some examples, prior to obtaining the enhanced version of the fingerprint image data, a determination is made that the fingerprint image data captured by the second fingerprint sensor fails to satisfy a quality threshold.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:設備</p>
        <p type="p">102:指紋感測器系統</p>
        <p type="p">103:指紋感測器系統</p>
        <p type="p">104:介面系統</p>
        <p type="p">106:控制系統</p>
        <p type="p">108:顯示系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1739" publication-number="202615977">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615977</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135544</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性樹脂積層體、光阻圖案之形成方法及配線板之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G03F7/004</main-classification>
        <further-classification edition="200601120260102B">G03F7/027</further-classification>
        <further-classification edition="200601120260102B">G03F7/031</further-classification>
        <further-classification edition="200601120260102B">G03F7/033</further-classification>
        <further-classification edition="200601120260102B">G03F7/038</further-classification>
        <further-classification edition="200601120260102B">G03F7/09</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/40</further-classification>
        <further-classification edition="200601120260102B">H05K3/06</further-classification>
        <further-classification edition="200601120260102B">H05K3/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商旭化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森達哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日下智史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSAKA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種感光性樹脂積層體，其係具備：支撐體及含有感光性樹脂組成物之感光性樹脂層；並且&lt;br/&gt;  前述感光性樹脂組成物係含有以下成分：&lt;br/&gt;  （A）具有乙烯性不飽和鍵之化合物、&lt;br/&gt;  （B）鹼可溶性樹脂、及&lt;br/&gt;  （C）聚合起始劑；&lt;br/&gt;  前述（A）成分係包含（A1）於一分子中具有3個以上芳香環且具有1個以上乙烯性不飽和鍵之化合物；&lt;br/&gt;  前述（C）成分係含有六芳基聯咪唑化合物；&lt;br/&gt;  前述（C）成分之含量係前述感光性樹脂組成物之總固體成分量中之4.0質量%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1740" publication-number="202615386">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615386</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135567</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感放射線性組成物、圖案形成方法及鎓鹽化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">C07C25/18</main-classification>
        <further-classification edition="200601120251103B">C07C63/70</further-classification>
        <further-classification edition="200601120251103B">C07C65/03</further-classification>
        <further-classification edition="200601120251103B">C07C65/21</further-classification>
        <further-classification edition="200601120251103B">C07C255/13</further-classification>
        <further-classification edition="200601120251103B">C07C255/57</further-classification>
        <further-classification edition="200601120251103B">C07C381/12</further-classification>
        <further-classification edition="200601120251103B">C07D303/23</further-classification>
        <further-classification edition="200601120251103B">C07D317/68</further-classification>
        <further-classification edition="200601120251103B">G03F7/004</further-classification>
        <further-classification edition="200601120251103B">G03F7/039</further-classification>
        <further-classification edition="200601120251103B">G03F7/20</further-classification>
        <further-classification edition="200601120251103B">G03F7/32</further-classification>
        <further-classification edition="200601120251103B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>栗木隆之介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURIKI, RYUNOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷口拓弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGUCHI, TAKUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寺田望</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERADA, NOZOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錦織克聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKORI, KATSUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種感度、CDU及製程窗口優異的感放射線性組成物等。一種感放射線性組成物，包含：式（1）所表示的鎓鹽化合物、含有具有酸解離性基的結構單元的聚合物、及溶劑。  &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="233px" width="308px" file="ed10050.JPG" alt="ed10050.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（式中，X為鹵基；於X包含碘基的情況下，碘基鍵結於所述式的COO&lt;sup&gt;-&lt;/sup&gt;基的p位；R&lt;sup&gt;1&lt;/sup&gt;為烴基、於該基的碳-碳間具有二價含雜原子的基的基（α）、或者利用氯基、溴基、碘基、羥基、硝基、胺基、羧基或氰基對所述烴基或所述基（α）的氫原子進行取代而成的基（β）；於h為2以上的情況下，兩個R&lt;sup&gt;1&lt;/sup&gt;可相互結合而構成環元數5～20的環結構；R&lt;sup&gt;2&lt;/sup&gt;為碳數1～5的一價烴基、氰基、硝基或羥基；Z&lt;sup&gt;+&lt;/sup&gt;為包含經拉電子性基取代的芳香環的有機陽離子）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1741" publication-number="202616440">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616440</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135627</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基材膜的選別方法、切割晶粒接合一體型膜及半導體裝置的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/67</main-classification>
        <further-classification edition="200601120260102B">H01L21/301</further-classification>
        <further-classification edition="201801120260102B">C09J7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>越野美春</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSHINO, MIHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村尚弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, NAOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大久保惠介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHKUBO, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩永有輝啓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWANAGA, YUKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基材膜的選別方法，基材膜用於切割晶粒接合一體型膜，選別方法包括如下步驟：準備將TD作為長邊之長度100mm、寬度10mm、厚度20～200μm的長方形狀的基材膜作為試驗片A；在夾頭間距離為40mm、設定溫度為0℃、拉伸速度為1000mm/min的條件下，將試驗片A沿TD拉伸150%，並測定拉伸後的試驗片A的最大寬度與最小寬度之差分A；及選別差分A為2mm以下的基材膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:晶粒接合膜</p>
        <p type="p">2:黏著劑層</p>
        <p type="p">3:基材膜</p>
        <p type="p">5:切割膜</p>
        <p type="p">10:切割晶粒接合一體型膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1742" publication-number="202616215">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616215</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135628</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於多目標追蹤及投票的標記統一方法及影像獲取系統</chinese-title>
        <english-title>LABEL UNIFORMING METHOD BASED ON MULTIPLE OBJECT TRACKING AND VOTING AND A VIDEO ACQUISITION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120251001B">G06T7/246</main-classification>
        <further-classification edition="202201120251001B">G06V10/82</further-classification>
        <further-classification edition="202201120251001B">G06V20/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐵雲科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRONYUN INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁振軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, JENN-SHIUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳鵬榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, PENG-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基於多目標追蹤及投票的標記統一方法及影像獲取系統，其中該標記統一方法包括以下步驟：接收一影像片段，其中該影像片段具有多個影格；利用多目標追蹤(MOT)在該影像片段的該些影格中追蹤一物件；在該影像片段的各該影格中對該物件標記一推論標籤；產生對應多個類別的多個計數；判斷擁有最高計數的該類別為對應一統一標籤；和更新各該影格中該物件的該推論標籤為該統一標籤；藉由使用該標記統一方法，該物件將於該些影格中具有一貫的標籤，故無需提供更多教材訓練AI模型即可使該物件受到一貫地標示。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A label uniforming method based on multiple object tracking and voting and a video acquisition system are disclosed. The label uniforming method includes steps of: receiving a video segment, wherein the video segment contains multiple frames; keeping track of an object throughout the frames in the video segment by multiple object tracking (MOT); for each of the frames in the video segment, labeling the object with an inference label; generating counts corresponding to multiple categories; determining a uniform label corresponding to the category that has the highest count; and updating the inference label for the object in each of the frames as the uniform label for the object. By using the label uniforming method, the object would have a uniformed label throughout all the frames, and thus the object is labeled consistently without a need to provide additional training materials to train an AI model.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S6:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1743" publication-number="202615483">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615483</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135644</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>六糖~八糖之幾丁寡糖的分離精製方法、及以高含量含有六糖~八糖之幾丁寡糖的幾丁寡糖</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08B37/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商甲陽化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOYO CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泉良太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IZUMI, RYOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黑住誠司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUROZUMI, SEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於六糖~八糖之幾丁寡糖的分離精製方法，該方法包含後述步驟：(A)將幾丁寡糖混合物之水溶液或水分散液加溫或加熱至40℃以上而生成不溶物之步驟、(B)對(A)步驟所生成之不溶物，以30體積%~90體積%之乙醇水溶液進行洗淨之步驟、及(C)回收(B)步驟所洗淨之不溶物之步驟。&lt;br/&gt;  根據本發明，可提供一種從幾丁寡糖混合物，以簡便的手段分離精製六糖~八糖之幾丁寡糖的方法、及以高含量含有六糖~八糖之幾丁寡糖的幾丁寡糖。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1744" publication-number="202615177">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615177</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135657</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>銅粉</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260102B">B22F1/05</main-classification>
        <further-classification edition="200601120260102B">C22C9/00</further-classification>
        <further-classification edition="200601120260102B">H05K1/09</further-classification>
        <further-classification edition="200601120260102B">H01G4/008</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東邦鈦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOHO TITANIUM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林諒太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松田敦司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUDA, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可適合用於銅膏之銅粉。本發明之銅粉係從SEM圖像之以圖像分析法所得之個數基準的平均粒徑D50&lt;sub&gt;SEM&lt;/sub&gt;及粒徑的標準偏差σ&lt;sub&gt;D&lt;/sub&gt;以式：CV=100×σ&lt;sub&gt;D&lt;/sub&gt;/D50&lt;sub&gt;SEM&lt;/sub&gt;所算出之變異係數CV為30%以下，以雷射繞射/散射法所得之體積基準的90%粒徑D90&lt;sub&gt;Laser&lt;/sub&gt;為0.86μm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1745" publication-number="202616792">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616792</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135702</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>軟性電路板及其製造方法以及包括該軟性電路板的電子設備</chinese-title>
        <english-title>FLEXIBLE CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251027B">H05K3/46</main-classification>
        <further-classification edition="200601120251027B">H05K3/10</further-classification>
        <further-classification edition="200601120251027B">H05K3/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商斯天克有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEMCO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫東銀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SON, DONG EUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴孝振</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, HYO JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申建宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, GUN WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金正燮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JUNG SUB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李成進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SUNG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓昌勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, CHANG HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許愍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUR, MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種軟性電路板的製造方法，該方法將原膜接合在載帶的兩面上，並基於每個原膜製造軟性電路板。該軟性電路板的製造方法包括如下步驟：在載帶的兩面分別形成第一原膜和第二原膜；加工第一原膜以製造包含第一電路圖案的第一軟性電路板；加工第二原膜以製造包含第二電路圖案的第二軟性電路板；以及將第一軟性電路板和第二軟性電路板從載帶分離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S110:步驟</p>
        <p type="p">S120:步驟</p>
        <p type="p">S130:步驟</p>
        <p type="p">S140:步驟</p>
        <p type="p">S150:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1746" publication-number="202616224">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616224</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135704</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>外觀篩選系統、外觀篩選方法以及外觀篩選程式</chinese-title>
        <english-title>APPEARANCE INSPECTION SYSTEM, APPEARANCE INSPECTION METHOD, AND APPEARANCE INSPECTION PROGRAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120251204B">G06V10/764</main-classification>
        <further-classification edition="202201120251204B">G06V10/82</further-classification>
        <further-classification edition="201801120251204B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威爾斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO WELD CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>横山嘉彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOYAMA, YOSHIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤嗣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, TSUKASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">(發明要解決的問題)提供一種能夠更準確地篩選良品的外觀篩選系統、外觀篩選方法以及外觀篩選程式。(解決方案)一種外觀篩選系統，包括：成像裝置，用於拍攝檢查物件並產生檢查圖像; 本地計算機，用於基於第一檢查方案，在本地對檢查圖像進行第一良品/次品判別; 伺服器計算機，具有第二判別部，該第二判別部用於基於第二檢查方案，在雲端對檢查圖像進行第二良品/次品判別; 並行處理部，用於並行執行第一良品/次品判別和第二良品/次品判別。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An appearance inspection system includes: an imaging device configured to capture an image of an inspection object and to generate an inspection image; a local computer including a first determination module configured to perform a first determination of acceptability of the inspection image locally, the first determination being based on a first inspection recipe; a server computer including a second determination module configured to perform a second determination of acceptability of the inspection image in a cloud environment, the second determination being based on a second inspection recipe; a parallel processing module configured to perform the first determination and the second determination in parallel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:本地計算機，本地電腦</p>
        <p type="p">2:伺服器計算機，伺服器電腦</p>
        <p type="p">10:成像裝置</p>
        <p type="p">11:第一判別部</p>
        <p type="p">11R:第一檢查方案</p>
        <p type="p">12:通訊部</p>
        <p type="p">21:第二判別部</p>
        <p type="p">21R:第二檢查方案</p>
        <p type="p">22:通訊部</p>
        <p type="p">23:比較提取部</p>
        <p type="p">24:並行處理部</p>
        <p type="p">100:外觀篩選系統</p>
        <p type="p">G:雲端AI邏輯</p>
        <p type="p">N:網路</p>
        <p type="p">R1:規則庫判別邏輯</p>
        <p type="p">R2:本地AI邏輯，AI邏輯</p>
        <p type="p">W:檢查物件</p>
        <p type="p">Wa:註釋圖像</p>
        <p type="p">Wi:檢查圖像</p>
        <p type="p">Wp:提取圖像</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1747" publication-number="202615463">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615463</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135720</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>VISTA抗原結合分子</chinese-title>
        <english-title>VISTA ANTIGEN-BINDING MOLECULES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">C07K16/18</main-classification>
        <further-classification edition="200601120260114B">A61K39/395</further-classification>
        <further-classification edition="200601120260114B">C12N15/13</further-classification>
        <further-classification edition="200601120260114B">C12N15/63</further-classification>
        <further-classification edition="200601120260114B">C12N15/64</further-classification>
        <further-classification edition="200601120260114B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商蜂鳥生物科技私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUMMINGBIRD BIOSCIENCE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波尹德　科庫普　傑洛米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOYD-KIRKUP, JEROME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英葛蘭　皮爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INGRAM, PIERS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩卡　迪普蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THAKKAR, DIPTI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕茲奇維斯　寇拉德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PASZKIEWICZ, KONRAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑西能　文森提</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANCENON, VICENTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>關　詩尤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUAN, SIYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳志浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, ZHIHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢森　布倫登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANSON, BRENDON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁　潔瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEO, JIE YING, JACKLYN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達爾馬迪卡里　布哈山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DHARMADHIKARI, BHUSHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容係關於抗VISTA抗原結合分子，以及編碼該等抗VISTA抗原結合分子之核酸及表現載體，以及包含該等抗VISTA抗原結合分子之組成物。亦揭露使用該等分子及製品治療或預防疾病之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to anti-VISTA antigen-binding molecules, as well as nucleic acids and expression vectors encoding, and compositions comprising the anti-VISTA antigen-binding molecules. Methods of using said molecules and articles for treating or preventing disease are also disclosed.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1748" publication-number="202614994">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614994</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135745</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>遞送編碼分泌型蛋白的核酸分子的脂質奈米顆粒及其用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260112B">A61K9/127</main-classification>
        <further-classification edition="200601120260112B">A61K31/7088</further-classification>
        <further-classification edition="201001120260112B">C12N15/113</further-classification>
        <further-classification edition="200601120260112B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京劑泰醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING JITAI PHARMACEUTICAL TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商劑泰科技（北京）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METIS TECHBIO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉少利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SHAOLI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉安東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, ANDONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃豔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>解晶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵帥博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAO, SHUAIBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范新義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, XINYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張小駒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIAOJU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　紅敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HONGMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江秉諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, BINGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, YA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了用於遞送編碼分泌型蛋白的核酸分子的脂質奈米顆粒及其用途。所述脂質奈米顆粒能夠將核酸分子遞送至肝臟，用於肝臟疾病和其他疾病的治療。本發明還提供了所述脂質奈米顆粒的製備方法、包含所述脂質奈米顆粒的藥物組合物，以及所述脂質奈米顆粒和藥物組合物在治療疾病中的應用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1749" publication-number="202615035">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615035</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135826</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>HSD17B13抑制劑及其用途</chinese-title>
        <english-title>HSD17B13 INHIBITORS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">A61K31/517</main-classification>
        <further-classification edition="200601120260112B">A61K31/437</further-classification>
        <further-classification edition="200601120260112B">A61K31/4355</further-classification>
        <further-classification edition="200601120260112B">A61K31/4192</further-classification>
        <further-classification edition="200601120260112B">A61P1/16</further-classification>
        <further-classification edition="200601120260112B">A61P3/00</further-classification>
        <further-classification edition="200601120260112B">A61P9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商伊尼製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INIPHARM, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安南丹　山姆帕斯　庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANANDAN, SAMPATH KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐汀苟　喬許亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ODINGO, JOSHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許　海瑟　凱　維伯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HEATHER KAY WEBB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文闡述HSD17B13抑制劑及包括該等抑制劑之醫藥組合物。標的化合物及組合物可用於治療肝病、代謝疾病或心血管疾病，例如NAFLD、NASH或MASH或藥物誘導之肝損傷(DILI)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein are HSD17B13 inhibitors and pharmaceutical compositions comprising said inhibitors. The subject compounds and compositions are useful for the treatment of liver disease, metabolic disease, or cardiovascular disease, such as NAFLD, NASH, or MASH, or drug induced liver injury (DILI).</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1750" publication-number="202616441">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616441</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135836</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>反應腔室、密封系統、及密封方法</chinese-title>
        <english-title>REACTION CHAMBER, SEALING SYSTEM, AND SEALING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/67</main-classification>
        <further-classification edition="200601120260102B">C23C16/455</further-classification>
        <further-classification edition="200601120260102B">H01L21/465</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍尼波爾　肯尼思</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONNIBALL, KENNETH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種反應腔室可包含：一基座，其配置以支撐設置於反應腔室容積中之一基板；一上部腔室空間，其在該基座上方；一下部腔室空間，其在該基座下方；及/或一密封系統。該密封系統可使得該上部腔室空間與該下部腔室空間至少部分地流體分離。該密封系統可包含環繞該基座之一分隔板及/或耦接至該基座之一可撓性隔膜。該密封系統可配置以在該分隔板與延伸板之間形成至少一部分密封，且藉由引起該可撓性隔膜之彎曲，使得該可撓性隔膜之一彎曲部分與該分隔板至少部分地接觸，而引起該上部腔室空間與該下部腔室空間之間的至少部分流體分離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A reaction chamber may comprise a susceptor configured to support a substrate disposed in the reaction chamber volume, an upper chamber space above the susceptor, a lower chamber space below the susceptor, and/or a sealing system. The sealing system may cause the upper chamber space and the lower chamber space to be at least partially fluidly separate. The sealing system may comprise a spacer plate surrounding the susceptor and/or a flexible diaphragm coupled to the susceptor. The sealing system may be configured to form at least a partial seal between the spacer plate and the extension plate and cause at least partial fluid separation between the upper chamber space and the lower chamber space by causing bending of the flexible diaphragm such that a bent portion of the flexible diaphragm is at least in partial contact with the spacer plate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">4:反應腔室</p>
        <p type="p">6:基座</p>
        <p type="p">8:流體分配系統</p>
        <p type="p">10:反應物源</p>
        <p type="p">12:反應物源</p>
        <p type="p">14:載體及/或吹掃氣體源</p>
        <p type="p">16:管線</p>
        <p type="p">18:管線</p>
        <p type="p">20:管線</p>
        <p type="p">22:閥或控制器</p>
        <p type="p">24:閥或控制器</p>
        <p type="p">26:閥或控制器</p>
        <p type="p">28:真空源，泵</p>
        <p type="p">29:密封系統</p>
        <p type="p">30:基板</p>
        <p type="p">50:反應器系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1751" publication-number="202616174">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616174</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135844</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>結算系統、顯示控制方法及程式產品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260102B">G06Q20/24</main-classification>
        <further-classification edition="201201120260102B">G06Q20/34</further-classification>
        <further-classification edition="202301120260102B">G06Q40/03</further-classification>
        <further-classification edition="201301120260102B">G06F3/048</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商樂天信用卡股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAKUTEN CARD CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商樂天集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAKUTEN GROUP, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岸岡信伍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISHIOKA, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川貴枝子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, KIEKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之結算系統(1)之狀態取得部(101)取得與適用於結算服務之卡片、且為使用者之卡片相關之狀態。顯示控制部(102)基於狀態，使與結算服務關聯之關聯畫面顯示與卡片相關之資訊內容。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:結算伺服器</p>
        <p type="p">20:卡片伺服器</p>
        <p type="p">30:使用者終端</p>
        <p type="p">100:資料記憶部</p>
        <p type="p">101:狀態取得部</p>
        <p type="p">102:顯示控制部</p>
        <p type="p">200:資料記憶部</p>
        <p type="p">201:卡片管理部</p>
        <p type="p">300:資料記憶部</p>
        <p type="p">301:操作受理部</p>
        <p type="p">302:顯示控制部</p>
        <p type="p">DB1:結算資料庫</p>
        <p type="p">DB2:卡片資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1752" publication-number="202616024">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616024</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135921</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>姿態控制設備</chinese-title>
        <english-title>ATTITUDE CONTROL DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260102B">G05D1/495</main-classification>
        <further-classification edition="200601120260102B">B64C13/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商雙葉電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUTABA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中昌廣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種安裝在無線電控制模型飛機上的姿態控制設備，所述無線電控制模型飛機是基於從外部設備接收的控制信號而被控制的受控對象，所述姿態控制設備包括：計算部分，其被配置為選擇性地輸出作為控制信號輸入的第一副翼控制信號和基於受控對象的滾轉角計算以將受控對象保持在水平狀態的第二副翼控制信號。當滿足以下條件時，計算部分選擇並輸出第二副翼控制信號：開啓功能由從外部設備接收的功能設定信號來指示；第一副翼控制信號是表示中立的信號；以及受控對象的滾轉角在設定角度內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An attitude control device mounted on a radio-controlled model airplane, which is a controlled object controlled based on a control signal received from an external device, comprises a calculation part configured to selectively output a first aileron control signal, which is input as the control signal, and a second aileron control signal, which is calculated based on a roll angle of the controlled object to maintain the controlled object in a horizontal state. The calculation part selects and outputs the second aileron control signal when the following conditions are satisfied: turning on of a function is instructed by a function setting signal received from the external device; the first aileron control signal is a signal indicating neutral; and the roll angle of the controlled object is within a set angle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101:步驟</p>
        <p type="p">S102:步驟</p>
        <p type="p">S103:步驟</p>
        <p type="p">S110:步驟</p>
        <p type="p">S111:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1753" publication-number="202615176">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615176</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135922</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於壓鑄機的固定夾板</chinese-title>
        <english-title>FIXED CLAMPING PLATE FOR DIE CASTING MACHINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B22D17/20</main-classification>
        <further-classification edition="200601120260102B">B22D17/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商布勒股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUHLER AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威爾德　多明尼克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIDLER, DOMINIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃伯勒　畢特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBERLE, BEAT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞斯　羅傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RASS, ROGER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施拉克曼　雷夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHRACKMANN, RALPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於一壓鑄機(D)或一觸變模製機的固定夾板(1)，其包含：一通道，其用於收納一鑄造腔室(2)，該通道自可配置一鑄造半模(3)之一前方第一側(1a)穿過該固定夾板(1)延伸至一後方第二側(1b)，其特徵在於，該通道經設計以使得一鑄造腔室(2)可自該第二側(1b)插入至該通道中及自該通道移除。本發明進一步係關於一種包含此類固定夾板之壓鑄機(D)或觸變模製機，以及一種用於將一鑄造腔室(2)安裝於此類固定夾板(1)中之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a fixed clamping plate (1) for a die casting machine (D) or a thixomolding machine, comprising a channel for receiving a casting chamber (2), which extends through the fixed clamping plate (1) from a front first side (1a), on which a casting mold half (3) can be arranged, to a rear second side (1b), characterized in that the channel is designed such that a casting chamber (2) can be inserted into and removed from the channel from the second side (1b). The present invention further relates to a die casting machine (D) or a thixomolding machine comprising such a fixed clamping plate, and a method for mounting a casting chamber (2) in such a fixed clamping plate (1).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:固定夾板</p>
        <p type="p">1a:固定夾板之第一側/前方第一側</p>
        <p type="p">1b:固定夾板之第二側/後方第二側</p>
        <p type="p">2:鑄造腔室</p>
        <p type="p">2a:鑄造腔室之凸肩</p>
        <p type="p">3:鑄造半模</p>
        <p type="p">7:鑄造腔室固持器</p>
        <p type="p">8:可移除緊固裝置/可釋放及/或可夾緊的緊固裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1754" publication-number="202615053">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615053</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135928</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>稠環類化合物、及其藥物組合物和用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">A61K31/553</main-classification>
        <further-classification edition="200601120260112B">A61K31/535</further-classification>
        <further-classification edition="200601120260112B">A61K31/519</further-classification>
        <further-classification edition="200601120260112B">A61K31/498</further-classification>
        <further-classification edition="200601120260112B">A61K31/44</further-classification>
        <further-classification edition="200601120260112B">A61K31/425</further-classification>
        <further-classification edition="200601120260112B">A61K31/42</further-classification>
        <further-classification edition="200601120260112B">A61K31/4162</further-classification>
        <further-classification edition="200601120260112B">A61P3/00</further-classification>
        <further-classification edition="200601120260112B">A61P9/00</further-classification>
        <further-classification edition="200601120260112B">A61P25/00</further-classification>
        <further-classification edition="200601120260112B">A61P35/00</further-classification>
        <further-classification edition="200601120260112B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海美悅生物科技發展有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI MEIYUE BIOTECH DEVELOPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>付賢磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, XIANLEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳友喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YOUXI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳永凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YONGKAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUI, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及一種稠環類化合物、及其藥物組合物和用途，具體而言，提供了一種式( I )所示的稠環類化合物，其可用於製備藥物，特別是製備預防和/或治療淋巴細胞發育或活性失調引起的或與之相關的疾病或病症的藥物。式( I )中各基團如說明書中所定義。&lt;b&gt;  &lt;/b&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1755" publication-number="202615507">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615507</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135929</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚合物、包括其之阻劑組成物及使用該阻劑組成物的圖案形成的方法</chinese-title>
        <english-title>POLYMER, RESIST COMPOSITION INCLUDING THE SAME, AND PATTERN FORMATION METHOD USING THE RESIST COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F212/14</main-classification>
        <further-classification edition="200601120260102B">C08F220/18</further-classification>
        <further-classification edition="200601120260102B">C08F8/00</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金旻相</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MINSANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, CHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金範錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, BEOMSEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金惠蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYERAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>都星安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DO, SUNGAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文勇勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOON, YONGHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴滸潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, HOYOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安讚在</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, CHANJAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田雅藍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, ARAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔誠原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, SUNGWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種聚合物、一種包括其之阻劑組成物及一種使用該阻劑組成物的圖案形成的方法，該聚合物包括：包括由式1表示的第一重複單元的第一鏈、包括由式2表示的第二重複單元的第二鏈，以及連接該第一鏈與該第二鏈的由式9表示的交聯單元：&lt;br/&gt;  式1&lt;br/&gt;&lt;img align="absmiddle" height="184px" width="331px" file="ed10001.jpg" alt="ed10001.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;  式2&lt;br/&gt;&lt;img align="absmiddle" height="184px" width="331px" file="ed10002.jpg" alt="ed10002.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;  式9&lt;br/&gt;&lt;img align="absmiddle" height="107px" width="427px" file="ed10003.jpg" alt="ed10003.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;  式1、式2及式9中的L&lt;sub&gt;11&lt;/sub&gt;至L&lt;sub&gt;13&lt;/sub&gt;、L&lt;sub&gt;21&lt;/sub&gt;至L&lt;sub&gt;23&lt;/sub&gt;、a11至a13、a21至a23、R&lt;sub&gt;11&lt;/sub&gt;、R&lt;sub&gt;21&lt;/sub&gt;、X&lt;sub&gt;11&lt;/sub&gt;、X&lt;sub&gt;21&lt;/sub&gt;、L&lt;sub&gt;91&lt;/sub&gt;、L&lt;sub&gt;92&lt;/sub&gt;、a91、a92、R&lt;sub&gt;91&lt;/sub&gt;至R&lt;sub&gt;94&lt;/sub&gt;、X&lt;sub&gt;91&lt;/sub&gt;及c91之描述提供於本文中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a polymer, a resist composition including the same, and a pattern formation method using the resist composition, the polymer including a first chain including a first repeating unit represented by Formula 1, a second chain including a second repeating unit represented by Formula 2, and a crosslinking unit represented by Formula 9 linking the first chain and the second chain:&lt;br/&gt; Formula 1&lt;br/&gt;&lt;img align="absmiddle" height="184px" width="331px" file="ed10001.jpg" alt="ed10001.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; Formula 2&lt;br/&gt;&lt;img align="absmiddle" height="184px" width="331px" file="ed10002.jpg" alt="ed10002.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; Formula 9&lt;br/&gt;&lt;img align="absmiddle" height="107px" width="427px" file="ed10003.jpg" alt="ed10003.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; The descriptions of L&lt;sub&gt;11&lt;/sub&gt; to L&lt;sub&gt;13&lt;/sub&gt;, L&lt;sub&gt;21&lt;/sub&gt; to L&lt;sub&gt;23&lt;/sub&gt;, a11 to a13, a21 to a23, R&lt;sub&gt;11&lt;/sub&gt;, R&lt;sub&gt;21&lt;/sub&gt;, X&lt;sub&gt;11&lt;/sub&gt;, X&lt;sub&gt;21&lt;/sub&gt;, L&lt;sub&gt;91&lt;/sub&gt;, L&lt;sub&gt;92&lt;/sub&gt;, a91, a92, R&lt;sub&gt;91&lt;/sub&gt; to R&lt;sub&gt;94&lt;/sub&gt;, X&lt;sub&gt;91&lt;/sub&gt;, and c91 in Formulae 1, 2 and 9 are provided herein.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1756" publication-number="202616673">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616673</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135935</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於機器學習的低密度同位檢查之適應性量化</chinese-title>
        <english-title>MACHINE LEARNING BASED ADAPTIVE QUANTIZATION FOR LOW DENSITY PARITY CHECK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H03M13/11</main-classification>
        <further-classification edition="200601120260102B">H04L1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤努索夫　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUNUSOV, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>圖布勒　阿薩夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOUBOUL, ASSAF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫茨　吉迪恩　夏羅莫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUTZ, GIDEON SHLOMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴歐爾　提林格　阿密特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAR-OR TILLINGER, AMIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種無線裝置可接收與該無線裝置的一傳輸區塊相關聯的一或多個碼區塊中的一第一碼區塊。該無線裝置可使用與該無線裝置相關聯的一神經網路模型輸出針對該第一碼區塊的一低密度同位檢查(low-density parity-check, LDPC)解碼程序之一組迭代的一組LDPC量化值。在一些實例中，該組LDPC量化值可包括該組迭代中的各別迭代的各別LDPC量化值。該無線裝置可根據使用該神經網路模型輸出的該組LDPC量化值中的一或多個LDPC量化值對該第一碼區塊執行該LDPC解碼程序之一或多次迭代。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wireless device may receive a first code block of one or more code blocks associated with a transport block for the wireless device. The wireless device may output, using a neural network model associated with the wireless device, a set of low-density parity-check (LDPC) quantization values for a set of iterations of an LDPC decoding procedure for the first code block. In some examples, the set of LDPC quantization values may include respective LDPC quantization values for respective iterations of the set of iterations. The wireless device may perform one or more iterations of the LDPC decoding procedure for the first code block in accordance with one or more LDPC quantization values of the set of LDPC quantization values output using the neural network model.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:基於機器學習的解碼程序</p>
        <p type="p">305:解調變器</p>
        <p type="p">310:非LDPC解碼方案</p>
        <p type="p">315:非LDPC解碼器</p>
        <p type="p">320、330、335、350、355、360、365:步驟</p>
        <p type="p">325:智慧解碼方案</p>
        <p type="p">340:神經網路模型</p>
        <p type="p">345:LDPC解碼器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1757" publication-number="202616373">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616373</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136010</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理設備</chinese-title>
        <english-title>SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251209B">H01L21/302</main-classification>
        <further-classification edition="200601120251209B">B08B17/02</further-classification>
        <further-classification edition="200601120251209B">H01L21/67</further-classification>
        <further-classification edition="200601120251209B">H01L21/677</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＰＳＫ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PSK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜正賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, JUNG HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁秀榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SOO YEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜成勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, SEONG HUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李庚旼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KYEONG MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種處理基板設備，包括具有移送空間的移送框架，其包括移送機器人，配置於移送空間內，用於在放置於裝載埠的容器與製程處理模組間移送基板；驅動器，用於驅動移送機器人；打孔板，形成有複數個孔，自移送空間的底面隔開配置；及連接管道；其中打孔板包括上部板及設置於比上部板更低高度的下部板；並且上部板的下部空間與下部板的下部空間分隔配備，連接管道可連接上部板的下部空間與下部板的下部空間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">300:移送框架</p>
        <p type="p">306:移送空間</p>
        <p type="p">308:開口</p>
        <p type="p">309:門</p>
        <p type="p">310:移送機器人</p>
        <p type="p">312:底座</p>
        <p type="p">314:驅動器</p>
        <p type="p">320:風扇單元</p>
        <p type="p">322:外殼</p>
        <p type="p">323:內部空間</p>
        <p type="p">324:風扇</p>
        <p type="p">330:氣體供應構件</p>
        <p type="p">332:第1氣體供應管線</p>
        <p type="p">334:第2氣體供應管線</p>
        <p type="p">340:打孔板</p>
        <p type="p">340c:下部板</p>
        <p type="p">350:循環管道</p>
        <p type="p">350a:第1循環管道</p>
        <p type="p">350b:第2循環管道</p>
        <p type="p">360:連接管道</p>
        <p type="p">370:排氣單元</p>
        <p type="p">372:排氣管線</p>
        <p type="p">374:泵</p>
        <p type="p">380:引導構件</p>
        <p type="p">400:製程處理模組</p>
        <p type="p">F:容器</p>
        <p type="p">X:第1方向</p>
        <p type="p">Y:第2方向</p>
        <p type="p">Z:第3方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1758" publication-number="202615420">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615420</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136034</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化合物</chinese-title>
        <english-title>CHEMICAL COMPOUND</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">C07D209/12</main-classification>
        <further-classification edition="200601120251103B">C07D209/40</further-classification>
        <further-classification edition="200601120251103B">C07D209/60</further-classification>
        <further-classification edition="200601120251103B">C09B57/00</further-classification>
        <further-classification edition="200601120251103B">C08K5/3417</further-classification>
        <further-classification edition="200601120251103B">C08L101/00</further-classification>
        <further-classification edition="200601120251103B">C08J5/18</further-classification>
        <further-classification edition="200601120251103B">G02B1/04</further-classification>
        <further-classification edition="200601120251103B">G02B5/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＭＳ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LMS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李承哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEUNG CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金羲卿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HEE KYEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭埈皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, JOON HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本說明書公開了一種化合物及其用途。本說明書提供一種化合物，該化合物表現出優異的耐熱性和抗氧化性，從而即使在高溫或高濕條件下也能穩定地保持光吸收特性。本說明書還提供了一種通過應用該化合物而確保所需光學特性的樹脂膜。本說明書還提供該化合物的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1759" publication-number="202615355">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615355</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136052</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製備氫氧化鈰分散液的方法及氫氧化鈰顆粒分散液</chinese-title>
        <english-title>METHOD FOR PREPARING CERIUM HYDROXIDE DISPERSION AND CERIUM HYDROXIDE PARTICLE DISPERSION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260112B">C01F17/235</main-classification>
        <further-classification edition="200601120260112B">C08F2/56</further-classification>
        <further-classification edition="202401120260112B">B01J35/53</further-classification>
        <further-classification edition="200601120260112B">C09K3/14</further-classification>
        <further-classification edition="200601120260112B">C09G1/02</further-classification>
        <further-classification edition="200601120260112B">C01B25/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商安集微電子科技(上海)股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANJI MICROELECTRONICS TECHNOLOGY (SHANGHAI) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳亞男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YANAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王惠文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUIWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐鵬宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, PENGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寅斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YINBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　守田</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SHOUTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種氫氧化鈰顆粒表面多次包覆的方法。第一層包覆，對表面沒有經過電荷處理，帶有正電荷的氫氧化鈰，藉由超聲震盪的方式，讓含有負電荷的聚合物或單體，和氫氧化鈰顆粒形成配位鍵，實現表面第一層包覆，把表面電荷反轉成負電荷；第二層包覆，加入帶弱正電荷的聚合物，藉由電荷吸引，達成聚合離子對，實現第二次電荷反轉，變成正電荷。包覆後的氫氧化鈰顆粒，不改變顆粒本身的電性，可以極大的減少拋光過程中由於機械力產生的缺陷—顆粒黏附，從而提高產品的良率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a method for multiple surface coating of cerium hydroxide particles. The first layer coating: the surface of the cerium hydroxide particles without undergoing charge treatment and carrying positive charges is coated with negatively charged polymers or monomers through ultrasonic vibration. These negatively charged polymers or monomers form coordination bonds with the cerium hydroxide particles, achieving the first layer of surface coating and reversing the surface charge to negative charges. The second layer coating: weakly positively charged polymers are added, and through charge attraction, polymer ions pairs are formed, achieving the second charge reversal and turning into positive charges. The cerium hydroxide particles after coating do not change the electrical properties of the particles themselves. This can greatly reduce the defects caused by mechanical force during polishing - particle adhesion, thereby improving the yield of the product.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1760" publication-number="202616612">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616612</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136056</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>非接觸供電系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260102B">H02J50/12</main-classification>
        <further-classification edition="200601120260102B">H02M7/521</further-classification>
        <further-classification edition="200701120260102B">H02M7/5387</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商衛來科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIRAXIA EDGE TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮繁夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYA, SHIGEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">非接觸供電系統(10)具備以非接觸方式供給電力的供電裝置(20)、及以非接觸方式接收電力的受電裝置(30)，供電裝置(20)具有並聯共振電路(22)與驅動用開關元件(SW0)，受電裝置(30)具有串聯共振電路(32)、整流電路(33)、及控制電路(40)，控制電路(40)具有第1模式，前述第1模式是對構成整流電路(33)的第2整流用開關元件(SW2)及第4整流用開關元件(SW4)，以在串聯共振電路(32)產生的交流電流的零交越點為基準，使從開啟到關閉的時間點為止之時間變化，藉此使第2整流用開關元件(SW2)及第4整流用開關元件(SW4)同時開啟的持續時間變化，來調整供給至負載(60)的電力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">SW2:第2整流用開關元件</p>
        <p type="p">SW4:第4整流用開關元件</p>
        <p type="p">Vds:汲極源極間電壓</p>
        <p type="p">Vgs:閘極源極間電壓</p>
        <p type="p">Vout:電壓</p>
        <p type="p">T:週期</p>
        <p type="p">δt:時間</p>
        <p type="p">(i),(ii),(iii),(iv):期間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1761" publication-number="202616613">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616613</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136057</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>非接觸供電系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260108B">H02J50/12</main-classification>
        <further-classification edition="200601120260108B">H02J7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商衛來科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIRAXIA EDGE TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮繁夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYA, SHIGEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">非接觸供電系統(10)具備：供電裝置(20)，以非接觸方式來供給電力；及受電裝置(30)，以非接觸方式接收電力並供給至負載(60)，供電裝置(20)具有並聯共振電路(22)與驅動用開關元件(SW0)，受電裝置(30)具有串聯共振電路(32)、整流電路(33)、及控制電路(40)，控制電路(40)具有第2模式，前述第2模式是對構成整流電路(33)的第2整流用開關元件(SW2)及第4整流用開關元件(SW4)，使涵蓋在串聯共振電路(32)產生的交流電力的複數個週期同時開啟的持續時間變化，藉此調整供給至負載(60)的電力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">SW2:第2整流用開關元件</p>
        <p type="p">SW4:第4整流用開關元件</p>
        <p type="p">T:週期</p>
        <p type="p">Ton:持續時間</p>
        <p type="p">Vds:汲極源極間電壓</p>
        <p type="p">Vgs:閘極源極間電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1762" publication-number="202615594">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615594</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136071</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於防污與去污的多層塗層</chinese-title>
        <english-title>MULTI-LAYER COATING FOR STAIN PROTECTION AND STAIN RELEASE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260106B">C09D5/16</main-classification>
        <further-classification edition="200601120260106B">C23C16/18</further-classification>
        <further-classification edition="200601120260106B">B05D1/02</further-classification>
        <further-classification edition="200601120260106B">B05D1/18</further-classification>
        <further-classification edition="200601120260106B">B32B5/00</further-classification>
        <further-classification edition="200601120260106B">B32B27/12</further-classification>
        <further-classification edition="200601320260106B">B29K96/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商我們集團有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WE GROUP, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英格利許　史蒂芬萊特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENGLISH, STEVEN WRIGHT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海德菲爾德　查爾斯葛雷格里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HADFIELD, CHARLES GREGORY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹姆士　哈利森瑪庫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAMES, HARRISON MARKUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的實施方式大體上係關於用於織物和其他基材的塗層。在一或更多實施方式中，提供用於在基材上形成保護塗層的方法，方法包括沉積疏水性底塗層至基材的第一或第二表面的至少一者上以形成第一塗覆基材，其中該疏水性底塗層不含氟碳化合物。該方法進一步包括在周圍條件下風乾或加熱該第一塗覆基材，藉以乾燥該第一塗覆基材，及沉積親水性頂塗層至該疏水性底塗層上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Implementations of the present disclosure generally relate to coatings for textiles and other substrates. In one or more implementation, methods for forming a protective coating on a substrate are provided and include depositing a hydrophobic base coating on at least one of a first or second surface of the substrate to form a first coated substrate, where the hydrophobic base coating is free of fluorocarbon compounds. The method further includes drying the first coated substrate by air-drying in ambient conditions or by heating the first coated substrate and depositing a hydrophilic top coating onto the hydrophobic base coating.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:方法</p>
        <p type="p">202,204,206,208:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1763" publication-number="202615170">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615170</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136072</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251001B">B08B15/02</main-classification>
        <further-classification edition="200601120251001B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商芝浦機械電子裝置股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBAURA MECHATRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁池昂生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANACHI, KOSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大森圭悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOMORI, KEIGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可抑制從對基板進行處理的處理室排出到基板處理裝置外的氣體中包含微粒的基板處理裝置。實施方式的基板處理裝置包括：處理室（50），構成對基板（W）進行處理的空間；旋轉保持部（10），對基板（W）進行保持並使其旋轉；處理液供給部（20），向保持在旋轉保持部（10）的基板（W）供給處理液；排氣部（70），具有用於將從處理室（50）的內部排出的氣體排出到外部的排氣路；以及除去部（80），配置在排氣路的內部，且具有噴出薄霧狀的清洗液的噴嘴（81、82）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板處理裝置</p>
        <p type="p">10:旋轉保持部</p>
        <p type="p">11:旋轉工作台</p>
        <p type="p">12:保持部</p>
        <p type="p">13:旋轉驅動部</p>
        <p type="p">20:處理液供給部</p>
        <p type="p">21、31:噴嘴</p>
        <p type="p">22、32:擺動臂</p>
        <p type="p">23、33:擺動機構</p>
        <p type="p">24:處理液供給管</p>
        <p type="p">24a:連接部</p>
        <p type="p">25:硫酸供給管</p>
        <p type="p">26:過氧化氫水供給管</p>
        <p type="p">30:沖洗液供給部</p>
        <p type="p">34:沖洗液供給管</p>
        <p type="p">40:回收部</p>
        <p type="p">41:第一杯部</p>
        <p type="p">42:第二杯部</p>
        <p type="p">42a:凹部</p>
        <p type="p">43:第一液體接收部</p>
        <p type="p">44:第二液體接收部</p>
        <p type="p">46:第二升降機構</p>
        <p type="p">50:處理室</p>
        <p type="p">51:第一側壁</p>
        <p type="p">52:第二側壁</p>
        <p type="p">55:中板</p>
        <p type="p">55a:安裝孔</p>
        <p type="p">55b:貫通孔</p>
        <p type="p">56:頂板</p>
        <p type="p">56a:開口</p>
        <p type="p">60:氣體供給部</p>
        <p type="p">70:排氣部</p>
        <p type="p">71:第一外壁</p>
        <p type="p">71a:第一排氣口</p>
        <p type="p">72:第二外壁</p>
        <p type="p">72a:第二排氣口</p>
        <p type="p">73:底板</p>
        <p type="p">73a、430、440:排出口</p>
        <p type="p">74、75:蓋體</p>
        <p type="p">80:除去部</p>
        <p type="p">81:第一噴嘴/噴嘴</p>
        <p type="p">82:第二噴嘴/噴嘴</p>
        <p type="p">90:控制裝置</p>
        <p type="p">431:分隔壁</p>
        <p type="p">710:第一排氣路</p>
        <p type="p">720:第二排氣路</p>
        <p type="p">730:連通部</p>
        <p type="p">W:基板</p>
        <p type="p">Z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1764" publication-number="202616553">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616553</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136086</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池包</chinese-title>
        <english-title>BATTERY PACK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260102B">H01M10/6568</main-classification>
        <further-classification edition="201401120260102B">H01M10/659</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>行競科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XING MOBILITY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宇中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂凱翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, KAI-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖資文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, TZU-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汲毓舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI, YU-SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴尚智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI, SHANG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王昉晛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, FANG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊錦堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, CHIN-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宜容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, I-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種浸沒冷卻之電池包包含至少一電池模組。電池模組具有複數個電池單元，複數個電池單元由電池固定座承載且透過位於限液殼體內之電池連接構件進行電性連接。限液殼體提供周邊壁以及頂壁面與底壁面，頂壁面與底壁面具有互鎖結構以利於垂直堆疊。限液殼體與端蓋或第二介面模組以及介面模組共同構成液密電池包外殼，用以容納熱管理液體。儲液槽模組作為緩衝槽以應對液體體積變化並作為外部液體連通介面，儲液槽模組位於液密電池包外殼之上以作為重力勢能液頭。電能介面模組將電池包的高壓電能傳遞至下游負載。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An immersion-cooled battery pack includes at least one battery module having a plurality of battery cells held by a cell holder and electrically connected by battery-cell-connecting members inside a liquid-limiting casing. The casing provides a peripheral wall and top and bottom wall surfaces with interlocking structures for vertical stacking. Together with an interface module and a terminal or second interface module, the casings form a liquid-tight battery-pack enclosure that contains thermal-management liquid. A liquid tank module acts as a buffer for liquid volume change and as an external liquid interface and is positioned above the enclosure to provide a gravitational head. An electrical energy interface module relays high-voltage energy from the battery pack to a downstream load.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3010:電池模組</p>
        <p type="p">3030:電池包</p>
        <p type="p">3040:端蓋模組</p>
        <p type="p">3050:介面模組</p>
        <p type="p">3052:介面模組外殼</p>
        <p type="p">3060:電能介面模組</p>
        <p type="p">3061:電能介面模組空間</p>
        <p type="p">3070:儲液槽模組</p>
        <p type="p">3071:軟管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1765" publication-number="202615847">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615847</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136092</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢測ＤＮＡ甲基化的方法</chinese-title>
        <english-title>METHOD FOR DETECTING DNA METHYLATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">G01N21/65</main-classification>
        <further-classification edition="200601120260108B">G01N33/574</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高雄醫學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAOHSIUNG MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>逢甲大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG CHIA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李偉鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, WEI-PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡儀欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, YI-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王文君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WEN-JYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛　修白</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, SHUBHAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鈺偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林文杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種檢測DNA甲基化的方法，包含將一基因的DNA與一經具有DNA結合功能的分子所修飾的金屬簇進行反應，透過表面增強拉曼散射(SERS)光譜法放大該DNA中甲基化鹼基的訊號，並基於SERS光譜檢測該DNA甲基化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a method for detecting DNA methylation, comprising reacting a DNA of a gene with a metal cluster modified with a molecule having a function for binding DNA, amplifying signals of methylated bases in the DNA by surface-enhanced Raman scattering (SERS) spectroscopy, and detecting the DNA methylation based on the SERS spectrum.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1766" publication-number="202616694">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616694</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136101</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無線通訊模組與其控制方法</chinese-title>
        <english-title>WIRELESS COMMUNICATION MODULE CONTROL METHOD AND RELATED APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251001B">H04L5/00</main-classification>
        <further-classification edition="200901120251001B">H04W52/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃祺翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHI-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種無線通訊模組的控制方法，其中該控制方法包括以下步驟：從低功耗狀態開始進入正常狀態；獲取多個媒體存取控制協定資料單元（MPDUs）；生成前導碼並通過向該前導碼添加不必要或冗餘資訊，或通過調整該前導碼的速率來擴展該前導碼的長度；以及通過使用該前導碼和該多個MPDUs生成實體層協定資料單元（PPDU）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a control method of a wireless communication module, wherein the control method includes the steps of: starting to enter a normal state from a low-power state; obtaining a plurality of MPDUs; generating a preamble and extending a length of the preamble by adding unnecessary or redundant information to the preamble, or by adjusting a rate of the preamble ; and generating a PPDU by using the preamble and the plurality of MPDUs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200、202、204、206、208、210:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1767" publication-number="202615970">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615970</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136139</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於確定針對容器及對應系統之控制及/或清潔指令的方法</chinese-title>
        <english-title>METHOD FOR DETERMINING CONTROL AND/OR CLEANING INSTRUCTIONS FOR A CONTAINER AND CORRESPONDING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260102B">G03F1/84</main-classification>
        <further-classification edition="201201120260102B">G03F1/82</further-classification>
        <further-classification edition="200601120260102B">G01N21/954</further-classification>
        <further-classification edition="200601120260102B">G01N21/27</further-classification>
        <further-classification edition="200601120260102B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商布魯克斯自動化(德國)有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROOKS AUTOMATION (GERMANY) GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種用於確定用於經調適及組配以保持晶圓(106)或倍縮光罩之一容器(102)之控制及/或清潔指令之方法，該方法在一確定循環中包含下列步驟：提供或接收容器資料(210)，其中該容器資料包含與該容器之一污染(104)有關之資料及/或與該容器之特性有關之資料，並且其中該容器資料係或已藉助測量獲取，較佳為在各種時間點獲取；使用一分析模型並基於該容器資料，確定與該晶圓或倍縮光罩之潛在缺陷有關之缺陷資訊(220)；使用一規劃模型並基於該缺陷資訊及/或該容器資料，確定用於該容器之控制指令(220)，並且提供該等控制指令以供該容器之進一步搬運；以及如果該等控制指令包含清潔該容器，則使用一清潔模型並基於該容器資料及/或該缺陷資訊及/或該等控制指令，確定用於該容器之清潔指令，並且提供該等清潔指令以供清潔該容器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a method for determining control and/or cleaning instructions for a container (102) adapted and configured to hold wafers (106) or reticles, the method comprising, in a determination cycle, the steps of: Providing or receiving container data (210), wherein the container data comprises data about a contamination (104) of the container and/or data about characteristics of the container, and wherein the container data is or has been acquired by means of measurement, preferably at various points in time; determining, using an analysis model and based on the container data, defect information (220) about potential defects of the wafer or reticles; determining, using a planning model and based on the defect information and/or the container data, control instructions (220) for the container, and providing the control instructions for further handling of the container; and if the control instructions comprise cleaning the container, determining, using a cleaning model and based on the container data and/or the defect information and/or the control instructions, cleaning instructions for the container, and providing the cleaning instructions for cleaning the container.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:檢驗及分析系統；檢驗及/或分析系統</p>
        <p type="p">102:容器；FOUP</p>
        <p type="p">102’:FOUP</p>
        <p type="p">104:污染</p>
        <p type="p">106:晶圓</p>
        <p type="p">110:資料處理系統；資料處理裝置；處理裝置</p>
        <p type="p">112:顯示器</p>
        <p type="p">120:測量裝置</p>
        <p type="p">150:調換或變換裝置；變換裝置</p>
        <p type="p">160:清潔裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1768" publication-number="202614957">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614957</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136166</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔設備控制方法、裝置、設備、介質和程式產品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A47L11/24</main-classification>
        <further-classification edition="200601120260102B">A47L11/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程冉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種清潔設備控制方法、裝置、設備、介質和程式產品。方法包括：根據機械臂的實際姿態以及自移動清潔設備的運動狀態，確定自移動清潔設備對應的目標預警空間；監測目標預警空間是否存在障礙物；在目標預警空間存在障礙物的情況下，控制自移動清潔設備執行回避動作。可見，本揭露實施例在自移動清潔設備使用機械臂的過程中，對進入目標預警空間的障礙物進行檢測，然後控制自移動清潔設備執行回避動作，降低機械臂在使用過程中與障礙物發生碰撞的可能性，減少機械臂對寵物、小孩、人體、傢俱等造成損傷的可能性，提高機械臂的使用安全性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S31:步驟</p>
        <p type="p">S32:步驟</p>
        <p type="p">S33:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1769" publication-number="202616235">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616235</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136194</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多物件軌跡預測系統及其操作方法</chinese-title>
        <english-title>MULTI-AGENT TRAJECTORY PREDICTION SYSTEM AND OPERATING METHOD THEROF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251001B">G08G1/01</main-classification>
        <further-classification edition="202201120251001B">G06V20/56</further-classification>
        <further-classification edition="202301120251001B">G06N3/08</further-classification>
        <further-classification edition="202301120251001B">G06N3/045</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>栗永徽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YUNG-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉慎軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SHEN-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林沂蓉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI-RONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊凱霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KAI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周梓康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, ZIKANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪　建平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIANPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種多物件軌跡預測系統的操作方法，包含:對多個物件進行篩選，並產生多個目標物件；對目標物件的第一物件資料進行編碼，以產生場景資料；依據場景資料產生第一運算結果及第二運算結果；對第一運算結果及第二運算結果的每一者進行列取向運算，並產生第一預測結果；對第一預測結果進行行取向運算，並產生第二預測結果；以及依據第二預測結果產生目標物件的多個預測軌跡。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of operating a multi-Agent trajectory prediction system, comprising: filtering a plurality of agents to generate a plurality of target agents; encoding a plurality of first agent data of the plurality of target agents to generate a scene data; generating a first computation result and a second computation result according to the scene data; performing a row-wise computation to each of the first computation result and the second computation result to generate a first prediction result; performing a column-wise computation to the first prediction result to generate a second prediction result; and generating a plurality of prediction results of the plurality of target agents according to the second prediction result.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:操作方法</p>
        <p type="p">501~508:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1770" publication-number="202616674">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616674</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136200</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多重干擾消除電路及其操作方法</chinese-title>
        <english-title>MULTIPLE INTERFERENCE CANCELLATION CIRCUIT AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H04B1/10</main-classification>
        <further-classification edition="200601120260102B">H04B1/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金大暎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DAEYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兪炫碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, HYUNSEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">多重干擾消除電路包括第一核心產生電路，接收傳輸信號並基於傳輸信號產生第一干擾模型信號，第二核心產生電路，接收傳輸信號並基於複數個傳輸信號產生不同於第一干擾模型信號的第二干擾模型信號，第一適應性濾波器，接收第一干擾模型信號並基於第一干擾模型信號和第一濾波器係數產生第一干擾估計信號，第二適應性濾波器，接收第二干擾模型信號並基於第二干擾模型信號和第二濾波器係數產生第二干擾估計信號，以及第一加法器，輸出透過從接收信號減去第一干擾估計信號和第二干擾估計信號而獲得的濾波信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multiple interference cancellation circuit includes a first kernel generation circuit that receives transmission signals and, based on the transmission signals, generates a first interference model signal, a second kernel generation circuit that receives the transmission signals and, based on the plurality of transmission signals, generates a second interference model signal different from the first interference model signal, a first adaptive filter that receives the first interference model signal and, based on the first interference model signal and a first filter coefficient, generates a first interference estimation signal, a second adaptive filter that receives the second interference model signal and, based on the second interference model signal and a second filter coefficient, generates a second interference estimation signal, and a first summer that outputs a filtering signal obtained by subtracting the first interference estimation signal and the second interference estimation signal from a reception signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S410、S420、S430、S440、S450:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1771" publication-number="202615146">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615146</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136228</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合觸媒</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B01J23/78</main-classification>
        <further-classification edition="200601120260102B">B01J29/08</further-classification>
        <further-classification edition="200601120260102B">B01J29/18</further-classification>
        <further-classification edition="200601120260102B">B01J29/40</further-classification>
        <further-classification edition="200601120260102B">B01J29/65</further-classification>
        <further-classification edition="200601120260102B">B01J29/70</further-classification>
        <further-classification edition="202401120260102B">B01J35/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商科納維股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANADEVIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立研究開發法人產業技術總合研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今坂怜史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMASAKA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田所秀之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TADOKORO, HIDEYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙野裕之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKANO, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山路覚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAJI, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>望月剛久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOCHIZUKI, TAKEHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮野咲季</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYANO, SAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">複合觸媒包含固體氧化物觸媒及沸石，所述固體氧化物觸媒包括穩定化氧化鋯載體以及擔載於穩定化氧化鋯載體的活性金屬。穩定化氧化鋯載體在氧化鋯中固溶有穩定化元素，且具有四方晶系及/或立方晶系的晶體結構，活性金屬包含Fe及鹼金屬。另外，沸石至少包含具有選自由MFI結構、MOR結構、CHA結構、FER結構、AEI結構、BEA結構及FAU結構所組成的群組中的一種骨架結構的沸石。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1772" publication-number="202615167">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615167</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136264</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清洗裝置及電子零件的安裝裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251120B">B08B7/00</main-classification>
        <further-classification edition="200601120251120B">B08B11/00</further-classification>
        <further-classification edition="200601120251120B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商芝浦機械電子裝置股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBAURA MECHATRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊池一哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種在不降低節拍時間的情況下效率良好地進行清洗的清洗裝置及電子零件的安裝裝置。實施方式的清洗裝置的特徵在於包括：載台部，供具有作為清洗對象的一個或多個電極列的顯示用面板載置，在作為顯示用面板的搬送方向的第一方向、與第一方向交叉的第二方向、以及以與第一方向及第二方向交叉的第三方向為軸的旋轉方向上移動；一個或多個第一清洗部，在第二方向上移動，並進行伴隨載台部的移動而在第一方向上移動的顯示用面板上的一個或多個電極列的清洗；以及第二清洗部，配置在用於定位一個或多個電極列中作為清洗對象的電極列的基準位置，且進行伴隨載台部的移動而在第一方向上移動的顯示用面板上的一個或多個電極列的清洗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">15:支撐部</p>
        <p type="p">16:載台部</p>
        <p type="p">19:控制部</p>
        <p type="p">20:第一清洗部</p>
        <p type="p">21:第二清洗部</p>
        <p type="p">100:顯示用面板</p>
        <p type="p">121:噴出噴嘴</p>
        <p type="p">122:抽吸噴嘴</p>
        <p type="p">123、142:殼體</p>
        <p type="p">124:第一Y方向移動機構</p>
        <p type="p">131:上按壓頭</p>
        <p type="p">132:下按壓頭</p>
        <p type="p">141:電漿照射管</p>
        <p type="p">143:第二Y方向移動機構</p>
        <p type="p">161:搬送載台</p>
        <p type="p">162:X方向移動機構</p>
        <p type="p">163:θ方向移動機構</p>
        <p type="p">164:第三Y方向移動機構</p>
        <p type="p">600:攝像部</p>
        <p type="p">X、Y、Z:方向/軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1773" publication-number="202615612">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615612</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136270</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蝕刻組合物</chinese-title>
        <english-title>ETCHING COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">C09G1/16</main-classification>
        <further-classification edition="200601120260112B">C09K13/08</further-classification>
        <further-classification edition="200601120260112B">C23F11/14</further-classification>
        <further-classification edition="200601120260112B">H01L21/311</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商寧波安集微電子科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NINGBO ANJI MICROELECTRONICS TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張文貝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, WENBEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉兵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, BING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳兵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, WINSTON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭辛煊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, XINXUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪榮宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種用於晶邊的蝕刻液的組合物。所述化學蝕刻組合物包括氧化劑、含氟化合物，緩蝕劑、酸、季銨鹽或者溶劑等。採用本發明的組合物，能夠有效蝕刻去除晶邊不同沉積膜層，同時避免對矽蝕刻，操作視窗較大，在半導體蝕刻製程中具有良好的應用前景。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a composition for an etching liquid for the crystal edge. The chemical etching composition comprises an oxidant, a fluorine-containing compound, a corrosion inhibitor, an acid, a quaternary ammonium salt or a solvent, etc. By using the composition of the present invention, it is possible to effectively etch and remove different deposition film layers at the crystal edge, while avoiding silicon etching. The operating window is large, and it has a good application prospect in semiconductor etching processes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1774" publication-number="202615491">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615491</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136284</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性樹脂組合物、使用此組合物的乾膜光阻及其製造方法、光阻圖案及顯示裝置</chinese-title>
        <english-title>PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM PHOTORESIST AND METHOD FOR PREPARING THE SAME, RESIST PATTERN AND DISPLAY DEVICE USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251223B">C08F2/48</main-classification>
        <further-classification edition="202201120251223B">C09K23/20</further-classification>
        <further-classification edition="200601120251223B">C08F2/28</further-classification>
        <further-classification edition="200601120251223B">C08G59/18</further-classification>
        <further-classification edition="200601120251223B">G03F7/038</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商可隆工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOLON INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓友澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, WOO TACK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓孟儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示關於能夠基於120微米薄膜厚度形成細微圖案，並實現優異黏附性、解析度、剛性和耐化學性的感光性樹脂組成物、使用其的乾膜光阻、製備其的方法、阻劑圖案、以及使用其的顯示裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a photosensitive resin composition capable of forming fine patterns based on a 120 μm film thickness, and implementing excellent adhesion, resolution, rigidity, and chemical resistance, a dry film photoresist using the same, a method for preparing the same, a resist pattern, and a display device using the same.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1775" publication-number="202616631">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616631</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136293</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>DC-DC變換器</chinese-title>
        <english-title>DC-DC CONVERTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H02M3/335</main-classification>
        <further-classification edition="200701120260102B">H02M1/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰商泰達電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS (THAILAND) PUBLIC COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海德　馬提亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAID, MATTHIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案關於一種DC-DC變換器，具有：半橋電路，具有第一開關和第二開關；半橋控制電路，被配置為通過提供驅動信號以選擇性地斷開或閉合第一開關和第二開關來控制半橋電路；變壓器，具有包括初級繞組的初級側和包括次級繞組的次級側；以及第一電容器和第二電容器。DC-DC變換器包括與次級側連接的整流電路。變壓器使得第一初級繞組的匝和次級繞組的匝的每個重疊對的兩個重疊匝在DC-DC變換器運行期間經受匹配的電壓波動。變壓器進一步使得第二初級繞組的匝和次級繞組的匝的每個重疊對的兩個重疊匝在DC-DC變換器運行期間經受匹配的電壓波動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a DC-DC converter with a half-bridge circuit having a first switch and a second switch, a half-bridge control circuit configured to control the half-bridge circuit by providing drive signals for selectively opening or closing the first switch and the second switch, a transformer with a primary side comprising a primary winding and a secondary side comprising a secondary winding, and a first capacitor and a second capacitor. The DC-DC converter further comprises a rectifier circuit connected to the secondary side. The transformer of the DC-DC converter is embodied such that the two overlapping turns of each overlapping pair of a turn of the first primary winding and a turn of the secondary winding, are subject to matching voltage fluctuations during operation of the DC-DC converter. The transformer of the DC-DC converter is further embodied such that the two overlapping turns of each overlapping pair of a turn of the second primary winding and a turn of the secondary winding, are subject to matching voltage fluctuations during operation of the DC-DC converter.</p>
      </isu-abst>
      <representative-img>
        <p type="p">Np1、Np2:初級繞組</p>
        <p type="p">Ns:次級繞組</p>
        <p type="p">10、11、12、13:外匝</p>
        <p type="p">6:半橋節點</p>
        <p type="p">7:正極端子</p>
        <p type="p">8:負極端子</p>
        <p type="p">9:分裂電容節點</p>
        <p type="p">Cin:電容</p>
        <p type="p">S1:第一開關</p>
        <p type="p">S2:第二開關</p>
        <p type="p">1:初級端子</p>
        <p type="p">2:次級端子</p>
        <p type="p">3:初級端子</p>
        <p type="p">4:次級端子</p>
        <p type="p">20:半橋控制電路</p>
        <p type="p">Lr:諧振電感</p>
        <p type="p">Cr1、Cr2、C3、C4:電容</p>
        <p type="p">D1、D2:二極體</p>
        <p type="p">25:LLC諧振變換器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1776" publication-number="202615354">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615354</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136324</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低溫合成α-氧化鋁奈米顆粒的方法、α-氧化鋁奈米顆粒及其用途</chinese-title>
        <english-title>METHOD FOR SYNTHESIZING Α-ALUMINA NANOPARTICLES AT LOW TEMPERATURES, Α-ALUMINA NANOPARTICLES AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260112B">C01F7/026</main-classification>
        <further-classification edition="202201120260112B">C01F7/441</further-classification>
        <further-classification edition="200601120260112B">C04B7/42</further-classification>
        <further-classification edition="202201120260112B">B22F1/07</further-classification>
        <further-classification edition="200601120260112B">H01L21/304</further-classification>
        <further-classification edition="202101120260112B">H01M50/403</further-classification>
        <further-classification edition="202201120260112B">B22F1/065</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商安集微電子科技(上海)股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANJI MICROELECTRONICS TECHNOLOGY (SHANGHAI) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔天露</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUI, TIANLU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹先升</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, XIANSHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李金波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JINBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周振奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, ZHENQI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種低溫合成α-氧化鋁奈米顆粒的方法。以硫酸鋁銨為鋁源，碳酸氫銨為沉澱劑，藉由將沉澱產物進行酸化處理，無需高溫高壓及額外的添加劑，在低於1000°C的條件下焙燒得到了α-氧化鋁奈米粉體。更進一步的，在酸化處理後的前驅體中引入α-氧化鋁晶種，還可進一步降低焙燒溫度，且產物為類球形α-氧化鋁奈米顆粒。α-氧化鋁奈米顆粒經分散後得到的氧化鋁分散液，可應用於積體電路化學機械拋光、鋰電池隔膜塗覆等領域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a method for synthesizing α-alumina nanoparticles at low temperatures. Using ammonium aluminum sulfate as the aluminum source and ammonium bicarbonate as the precipitant, by acidifying the precipitated product, without the need for high temperature and pressure or additional additives, the α-alumina nanopowder was obtained through calcination at a temperature lower than 1000°C. Furthermore, by introducing α-alumina seed crystals into the precursor after acid treatment, the calcination temperature can be further reduced, and the product is spherical-like α-alumina nanoparticles. The alumina dispersion liquid obtained after dispersing the α-alumina nanoparticles can be applied in fields such as chemical mechanical polishing of integrated circuits and coating of lithium battery separators.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1777" publication-number="202616284">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616284</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136335</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>計算系統架構以及包括其的積體電路封裝體</chinese-title>
        <english-title>COMPUTING SYSTEM ARCHITECTURE AND INTEGRATED CIRCUIT PACKAGE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G11C11/40</main-classification>
        <further-classification edition="200601120260102B">G06F13/38</further-classification>
        <further-classification edition="202301120260102B">H10B80/00</further-classification>
        <further-classification edition="202501120260102B">H10D89/10</further-classification>
        <further-classification edition="202501120260102B">H10D88/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李性柱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEONG JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露關於計算系統架構以及包括其的積體電路封裝體。一種計算系統包括基礎裸晶、主機設備和堆疊式記憶體結構。基礎裸晶具有第一表面和第二表面，並且包括第一電路塊和第二電路塊。主機設備被設置為與基礎裸晶的第一電路塊的至少一部分重疊。堆疊式記憶體結構被設置為與基礎裸晶的第二電路塊的至少一部分重疊。主機設備和基礎裸晶的第一電路塊透過第一訊號傳輸路徑耦接。在第一電路塊和第二電路塊之間，以及在第二電路塊和堆疊式記憶體結構之間透過第二訊號傳輸路徑進行耦接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A computing system includes a base die, a host device, and a stacked memory structure. The base die has a first surface and a second surface and includes a first circuit block and a second circuit block. The host device is disposed to overlap at least a portion of the first circuit block of the base die. The stacked memory structure is disposed to overlap at least a portion of the second circuit block of the base die. The host device and the first circuit block of the base die are coupled through a first signal transmission path. Between the first circuit block and the second circuit block, and between the second circuit block and the stacked memory structure, coupling is made through a second signal transmission path.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3000A:計算系統</p>
        <p type="p">3010:基板</p>
        <p type="p">3100:基礎裸晶結構</p>
        <p type="p">3200:主機設備</p>
        <p type="p">3300:堆疊式記憶體結構</p>
        <p type="p">3300A:堆疊式記憶體結構</p>
        <p type="p">3300B:堆疊式記憶體結構</p>
        <p type="p">3300C:堆疊式記憶體結構</p>
        <p type="p">3300D:堆疊式記憶體結構</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">X:部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1778" publication-number="202616096">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616096</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136336</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體子系統及包括該記憶體子系統的伺服器系統</chinese-title>
        <english-title>MEMORY SUBSYSTEM AND SERVER SYSTEM INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G06F13/38</main-classification>
        <further-classification edition="200601120260102B">G06F13/14</further-classification>
        <further-classification edition="202301120260102B">H10B80/00</further-classification>
        <further-classification edition="202501120260102B">H10D88/00</further-classification>
        <further-classification edition="200601120260102B">H01L23/488</further-classification>
        <further-classification edition="200601120260102B">H01L23/535</further-classification>
        <further-classification edition="200601120260102B">H01L21/768</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李性柱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEONG JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">記憶體子系統可以包括I/O裸晶、主機設備和堆疊式記憶體結構。I/O裸晶可以包括第一表面和第二表面。主機設備可以堆疊在I/O裸晶的第一表面上以至少部分地與之鍵合。堆疊式記憶體結構可以堆疊在I/O裸晶的第一表面上以至少部分地與之鍵合。I/O裸晶可以包括：佈置在第一表面上的多個導電焊墊。堆疊式記憶體結構可以包括多個記憶體裸晶和多個垂直引線，多個記憶體裸晶以疊瓦方式堆疊使得多個鍵合焊墊暴露，多個垂直引線將多個記憶體裸晶的鍵合焊墊分別連接至多個導電焊墊。主機設備和堆疊式記憶體結構可以被配置為透過I/O裸晶彼此接駁。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory subsystem may include an I/O die, a host device, and a stacked memory structure. The I/O die may include a first surface and a second surface. The host device may be stacked on the first surface of the I/O die so as to be at least partially bonded thereto. The stacked memory structure may be stacked on the first surface of the I/O die so as to be at least partially bonded thereto. The I/O die may include a plurality of conductive pads arranged on the first surface. The stacked memory structure may include a plurality of memory dies stacked in a shingled manner so that a plurality of bonding pads is exposed, and a plurality of vertical wires respectively connecting the bonding pads of the plurality of memory dies to the plurality of conductive pads. The host device and the stacked memory structure may be configured to interface with each other through the I/O die.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3000:計算系統</p>
        <p type="p">3100:I/O裸晶結構</p>
        <p type="p">3200:主機設備</p>
        <p type="p">3300:堆疊式記憶體結構</p>
        <p type="p">B1:第一匯流排</p>
        <p type="p">B2:第二匯流排</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1779" publication-number="202615494">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615494</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136378</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光阻圖案之形成方法、及感光性樹脂積層體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">C08F2/50</main-classification>
        <further-classification edition="200601120260112B">C08F220/18</further-classification>
        <further-classification edition="200601120260112B">C08F112/08</further-classification>
        <further-classification edition="200601120260112B">G03F7/028</further-classification>
        <further-classification edition="200601120260112B">G03F7/038</further-classification>
        <further-classification edition="200601120260112B">H05K1/09</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商旭化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古谷創</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUTANI, HAJIME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池見昌敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEMI, MASATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種光阻圖案之形成方法，其係包含：（1）將包含支撐膜及具有100μm以上的膜厚之感光性樹脂層之感光性樹脂積層體積層於基材上之步驟；（2）對積層後之感光性樹脂層進行曝光之步驟；以及（3）在曝光後，對感光性樹脂層之未曝光部進行顯影除去之步驟；前述光阻圖案係包含深寬比為2.5以上的圓孔部分。&lt;br/&gt;  前述感光性樹脂層係含有含具有芳香環之單體作為共聚成分之鹼可溶性高分子；在僅由未曝光部所成之感光性樹脂層的最小顯影時間中，感光性樹脂層的顯影速度為0.25μm/s以上3.00μm/s以下；步驟（3）中之顯影時間為僅由未曝光部所成之感光性樹脂層的最小顯影時間的2.5倍以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1780" publication-number="202616722">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616722</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136395</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於指示位元流中的通道數量的方法和裝置</chinese-title>
        <english-title>METHOD AND APPARATUS FOR SIGNALING THE NUMBER OF CHANNELS IN A BITSTREAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260102B">H04N19/70</main-classification>
        <further-classification edition="201401120260102B">H04N19/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商華為技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡拉布托夫　亞歷山大　亞歷山德羅維奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARABUTOV, ALEXANDER ALEXANDROVICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿爾希娜　伊蕾娜　亞歷山德羅夫娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALSHINA, ELENA ALEXANDROVNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索洛維耶夫　蒂莫菲　米哈伊洛維奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOLOVYEV, TIMOFEY MIKHAILOVICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種改進的解碼方法和對位元流進行編碼的改進方法，以確保位元流與傳統解碼器的向後兼容性。所述解碼方法（1400）包括：接收（1401）位元流，所述位元流包括輸入訊號的編碼後的資料，其中，所述位元流由多個子流形成，第一子流包括表示第二子流中用於所述位元流的圖像譯碼格式的分量的通道數量的參數；解析（1402）所述第一子流，所述解析所述第一子流包括：解析所述參數的語法元素，從而確定所述第二子流中用於所述圖像譯碼格式的所述分量的所述通道數量；根據所述第二子流中用於所述圖像譯碼格式的所述分量的所述確定的通道數量，解析（1403）所述第二子流。這可以支持在所述第二位元流中解碼的所述通道數量在所述第一位元流中指示，並且可以減少用於重建的通道數量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an improved decoding method and improved method of encoding a bitstream to ensure backwards compatibility of bitstreams with legacy decoders. The decoding method (1400) comprises: receiving (1401) a bitstream including encoded data of an input signal, wherein the bitstream is formed of multiple substreams, a first substream comprising a parameter indicating a number of channels in a second substream for a component of an image coding format of the bitstream; parsing (1402) the first substream, the parsing of the first substream comprising parsing syntax elements of the parameter to thereby determine the number of channels in the second substream for the component of the image coding format; and parsing (1403) the second substream in dependence on the determined number of channels in the second substream for the component of the image coding format. This may allow the number of channels to be decoded in the second bitstream to be signaled in the first bitstream and allow the number of channels used for reconstruction to be reduced.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1301:參數</p>
        <p type="p">1302:第一子流</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1781" publication-number="202615159">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615159</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136408</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>塗敷裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251205B">B05C13/02</main-classification>
        <further-classification edition="200601120251205B">B05C5/02</further-classification>
        <further-classification edition="200601120251205B">B05C1/12</further-classification>
        <further-classification edition="200601120251205B">B05C1/08</further-classification>
        <further-classification edition="200601120251205B">B05D1/28</further-classification>
        <further-classification edition="200601120251205B">B05D7/04</further-classification>
        <further-classification edition="200601120251205B">B05D7/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼康股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>内藤一夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAITO, KAZUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊倉良幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IGURA, YOSHIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>横田大輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOTA, DAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可容易地使輥與模頭之間的間隔一定的塗敷裝置。塗敷裝置1包括：輥10，支撐被塗敷物W1；模頭15，以相對於輥10隔開規定的間隔而相向的方式配置，對被塗敷物W1塗佈塗敷液W2；輥加熱部20，設置於輥10，並對輥10進行加熱；以及加熱部26，對模頭15進行加熱。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:塗敷裝置</p>
        <p type="p">10:輥</p>
        <p type="p">15:模頭</p>
        <p type="p">15a:蓄液部</p>
        <p type="p">15b:貫通孔</p>
        <p type="p">15c:前端側流路</p>
        <p type="p">15d:基端側流路</p>
        <p type="p">16:模主體</p>
        <p type="p">17:突出部</p>
        <p type="p">17a:塗敷液供給口</p>
        <p type="p">20:輥加熱部</p>
        <p type="p">26:加熱部</p>
        <p type="p">27:熱管</p>
        <p type="p">30:腔室</p>
        <p type="p">35:壓力調整部</p>
        <p type="p">40:濕度調整部</p>
        <p type="p">45:氣體供給部</p>
        <p type="p">50:液槽</p>
        <p type="p">55:第一配管</p>
        <p type="p">60:第二配管</p>
        <p type="p">61:第一部分配管(部分配管)</p>
        <p type="p">62:第二部分配管(部分配管)</p>
        <p type="p">63:開閉部</p>
        <p type="p">63a:第一接頭</p>
        <p type="p">63b:第二接頭</p>
        <p type="p">65:泵(揚水機)</p>
        <p type="p">70:過濾器(濾器)</p>
        <p type="p">75:脫氣裝置</p>
        <p type="p">100:控制部</p>
        <p type="p">A1:方向</p>
        <p type="p">O1:軸線</p>
        <p type="p">R1:區域</p>
        <p type="p">S1:成膜空間</p>
        <p type="p">W1:薄膜(被塗敷物)</p>
        <p type="p">W2:塗敷液</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1782" publication-number="202615126">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615126</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136431</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高爾夫球桿頭的製造方法及該高爾夫球桿頭</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120251023B">A63B53/04</main-classification>
        <further-classification edition="200601120251023B">C22C38/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商遠藤製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>K.K. ENDO SEISAKUSHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>天野淳一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMANO, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種高爾夫球桿頭的製造方法及所述高爾夫球桿頭，其防止伴隨採用低碳鋼來改善打感的情況而產生的桿頸部的變形。在熱鍛加工的最終步驟中，將衝頭3壓抵至由S10C～S15C的低碳鋼製造的高爾夫球桿頭的桿頸部13的外周面131。衝頭3是將中空圓筒對半分割而成的形狀，在衝頭3，相互平行且呈直線的帶狀地以等間隔形成有四條剖面弧狀凹部，在桿頸部13形成有剖面下圓弧狀凸部41。藉由進行剖面圓弧狀凸部41的壓印加工，可形成防止桿頸部13變形的硬化部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">5:衝頭</p>
        <p type="p">13:桿頸部(插鞘部)</p>
        <p type="p">41:圓弧狀凸部</p>
        <p type="p">51:圓弧狀的平坦的內周面</p>
        <p type="p">131:外周面</p>
        <p type="p">H:高度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1783" publication-number="202615881">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615881</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136452</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用機器學習進行基板缺陷故障排除分析</chinese-title>
        <english-title>SUBSTRATE DEFECT TROUBLESHOOTING ANALYSIS USING MACHINE LEARNING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G01R31/265</main-classification>
        <further-classification edition="200601120260102B">H01L21/66</further-classification>
        <further-classification edition="202301120260102B">G06N3/0464</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯林斯　傑佛瑞萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COLLINS, JEFFREY RYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　鶴璇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HEXUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬爾　阿比納夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, ABHINAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古莫　巴斯卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, BHASKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳沁懌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, QINYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西蒙斯　馬丁傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEAMONS, MARTIN JAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴拉蘇拔馬尼安　葛尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BALASUBRAMANIAN, GANESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">方法包括由處理設備獲取在基板處理系統中處理的基板的缺陷資料。該方法進一步包括由處理設備獲取與基板相關的上下文資料。該方法進一步包括確定與缺陷資料相關的故障排除指導。故障排除指導包括一系列故障排除操作，每個操作與一或多個缺陷資料的可能根本原因相關。該方法進一步包括根據故障排除指導確定一組上下文資料的子集。該方法進一步包括使用一或多個訓練過的機器學習模型處理缺陷資料與該子集的上下文資料，該模型輸出與一系列故障排除操作中的故障排除操作相關的預測修正行動。該方法進一步包括啟動修正行動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes obtaining, by a processing device, defect data for a substrate processed in a substrate processing system. The method further includes obtaining, by the processing device, context data associated with the substrate. The method further includes determining a troubleshooting guide associated with the defect data. The troubleshooting guide includes a sequence of troubleshooting operations, each associated with one or more probably root causes for the defect data. The method further includes determining a subset of context data based on the troubleshooting guide. The method further includes processing the defect data and the subset of context data using one or more trained machine learning models that output a predicted corrective action associated with a troubleshooting operation in the sequence of troubleshooting operations. The method further includes initiating the corrective action.</p>
      </isu-abst>
      <representative-img>
        <p type="p">502:缺陷描述資料</p>
        <p type="p">504:故障排除指導</p>
        <p type="p">506:上下文識別碼</p>
        <p type="p">508:機器學習模型</p>
        <p type="p">510:上下文訊息</p>
        <p type="p">512:腔室資料</p>
        <p type="p">514:感測器資料</p>
        <p type="p">516:配方訊息</p>
        <p type="p">518:資料處理</p>
        <p type="p">520:根本原因分析</p>
        <p type="p">522:硬體分析</p>
        <p type="p">530:指示基板缺陷的資料</p>
        <p type="p">532:機器學習模型</p>
        <p type="p">534:修正行動</p>
        <p type="p">540:生成報告</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1784" publication-number="202615627">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615627</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136473</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>研磨用組合物及研磨方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">C09K3/14</main-classification>
        <further-classification edition="200601120260109B">C09G1/02</further-classification>
        <further-classification edition="200601120260109B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商福吉米股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMI INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中貝雄一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAI, YUICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種研磨用組合物，其能夠發揮較高之研磨去除速度且能夠提昇保存穩定性。本發明所提供之研磨用組合物包含：過錳酸鹽(S1)、包含週期表之第4族元素之鹽(S2)、及pKa為2以上6以下之金屬陽離子與陰離子之鹽(S3)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1785" publication-number="202615978">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615978</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136501</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光化射線性或感放射線性樹脂組成物、光阻膜、圖案形成方法、電子器件之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">G03F7/004</main-classification>
        <further-classification edition="200601120260114B">H01L21/027</further-classification>
        <further-classification edition="200601120260114B">C07C381/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今井隆史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAI, TAKAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉岡知昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIOKA, TOMOAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋孝太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, KOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹田和生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEDA, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之第一課題在於提供一種能夠形成LWR優異的圖案並且放置穩定性亦優異的感光化射線性或感放射線性樹脂組成物。又，本發明之第二課題在於提供一種上述感光化射線性或感放射線性樹脂組成物所涉及的光阻膜、圖案形成方法、及電子器件之製造方法。本發明之感光化射線性或感放射線性樹脂組成物包含樹脂、光酸產生劑、及酸擴散控制劑，其中，上述酸擴散控制劑的含量相對於上述組成物的總固體成分為1.0質量%以上，且上述光酸產生劑及上述酸擴散控制劑中的至少一方為由式（1）表示的化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1786" publication-number="202616720">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616720</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136526</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於在碼流中指示立方體工具啟用的方法和裝置</chinese-title>
        <english-title>METHOD AND APPARATUS FOR SIGNALLING CUBE TOOL ENABLE IN A BITSTREAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120251201B">H04N19/46</main-classification>
        <further-classification edition="201401120251201B">H04N19/70</further-classification>
        <further-classification edition="202301120251201B">G06N3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商華為技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡拉布托夫　亞歷山大　亞歷山德羅維奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARABUTOV, ALEXANDER ALEXANDROVICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿爾希娜　伊蕾娜　亞歷山德羅夫娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALSHINA, ELENA ALEXANDROVNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索洛維耶夫　蒂莫菲　米哈伊洛維奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOLOVYEV, TIMOFEY MIKHAILOVICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種改進的解碼方法和對碼流進行編碼的改進的方法，以確保碼流與傳統解碼器的向後兼容性。解碼器實現的解碼方法（1400）包括：接收（1401）碼流，所述碼流包括輸入訊號的編碼後的資料，其中，所述碼流包括表示是否為所述碼流的圖像譯碼格式的分量啟用立方體工具的標誌；解析（1402）所述碼流，所述解析包括：解析所述標誌以確定是否為所述圖像譯碼格式的所述分量啟用所述立方體工具。還描述了用於編碼的方法。這種方法可以節省所述碼流中的位元。當所述立方體工具被禁用時，立方體啟用標誌可以作為單個位元指示，而無需指示多個0。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an improved decoding method and improved method of encoding a bitstream to ensure backwards compatibility of bitstreams with legacy decoders. The decoding method (1400), implemented by a decoder, comprises: receiving (1401) a bitstream including encoded data of an input signal, wherein the bitstream comprises a flag indicating whether a cube tool is enabled for a component of an image coding format of the bitstream; and parsing (1402) the bitstream, the parsing comprising parsing the flag to determine whether the cube tool is enabled for the component of the image coding format. A method for encoding is also described. This approach may result in a bit saving in the bitstream. Instead of signalling multiple zeros when the cube tool is disabled, the cube enable flag can be signalled as a single bit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1302:cube_enable_flag</p>
        <p type="p">1303:碼流</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1787" publication-number="202615313">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615313</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136542</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有用於展示至少一個掛鎖的包裝的展示裝置</chinese-title>
        <english-title>PRESENTATION ARRANGEMENT WITH A PACKAGING FOR PRESENTING AT LEAST ONE PADLOCK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251231B">B65D85/20</main-classification>
        <further-classification edition="200601120251231B">B65D73/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商安博歐葛斯特布雷米克索尼公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABUS AUGUST BREMICKER SOEHNE KG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>發明人放棄姓名表示權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>發明人放棄姓名表示權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種具有用於展示至少一個掛鎖的包裝的展示裝置，該至少一個掛鎖具有鎖體和U型鎖栓，該U型鎖栓能夠選擇性地鎖定到鎖體或者能夠至少部分地從鎖體釋放。該包裝包括在包裝平面中延伸的基座區段和從包裝平面上升的用於掛鎖的保持器，其中，保持器包括至少一個保持器開口，掛鎖的U型鎖栓能夠穿過該至少一個保持器開口，以將掛鎖安裝到包裝。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A presentation arrangement with a packaging for presenting at least one padlock with a lock body and a U-bolt which can be selectively locked to the lock body or can be at least partially released from the lock body is disclosed. The packaging comprises a base section extending in a packaging plane and a holder for the padlock which rises from the packaging plane, wherein the holder comprises at least one holder opening through which the U-bolt of the padlock can be passed through for mounting the padlock to the packaging.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:展示裝置</p>
        <p type="p">13:包裝</p>
        <p type="p">15:掛鎖</p>
        <p type="p">16:鎖體</p>
        <p type="p">17:U型鎖栓</p>
        <p type="p">18:腿</p>
        <p type="p">19:基座區段</p>
        <p type="p">21:保持器</p>
        <p type="p">23:保持器開口</p>
        <p type="p">27:插入槽</p>
        <p type="p">29:對</p>
        <p type="p">35:鑰匙保持器開口</p>
        <p type="p">37:鑰匙桿</p>
        <p type="p">39:鑰匙</p>
        <p type="p">41:鑰匙環</p>
        <p type="p">73:懸掛開口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1788" publication-number="202615489">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615489</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136560</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性樹脂組合物及硬化浮凸圖案之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F2/44</main-classification>
        <further-classification edition="200601120260102B">C08F290/14</further-classification>
        <further-classification edition="200601120260102B">C08F299/02</further-classification>
        <further-classification edition="200601120260102B">C08G73/12</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/027</further-classification>
        <further-classification edition="200601120260102B">G03F7/031</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/40</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
        <further-classification edition="200601120260102B">H01L21/312</further-classification>
        <further-classification edition="200601120260102B">H01L23/485</further-classification>
        <further-classification edition="200601120260102B">H01L23/532</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商旭化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤岡孝亘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIOKA, TAKANOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牛尾孝顕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USHIO, TAKAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種感光性樹脂組合物，其即便於較低之固化溫度下亦能夠使聚醯胺酸酯之醯亞胺化反應完結，從而能夠形成耐化學品性提高之硬化膜。  &lt;br/&gt;本發明之感光性樹脂組合物包含(A)聚醯胺酸酯、(B)光聚合起始劑、(C)熱鹼產生劑、及(D)溶劑，且上述(D)溶劑包含選自(D1)具有醯胺鍵及環狀結構且沸點為210℃以上之化合物、以及(D2)具有脲鍵及環狀結構且沸點為210℃以上之化合物中之1種或2種。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1789" publication-number="202616926">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616926</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136564</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於多晶片發光二極體（ＬＥＤ）封裝件的透鏡結構</chinese-title>
        <english-title>LENS STRUCTURES FOR MULTIPLE-CHIP LIGHT-EMITTING DIODE (LED) PACKAGES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251215B">H10H29/24</main-classification>
        <further-classification edition="202501120251215B">H10H29/85</further-classification>
        <further-classification edition="202501120251215B">H10H29/855</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科銳ＬＥＤ公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CREELED, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩爾圖特　安德烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PERTUIT, ANDRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>切克　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHECK, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布萊克利　科林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLAKELY, COLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇伊希　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUICH, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索科爾　約瑟夫　Ｇ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOKOL, JOSEPH G.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威爾科克斯　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILCOX, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克萊爾　Ｆ　詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLAIRE, F. JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示了發光二極體(LED)裝置，且更具體而言揭示多晶片LED封裝件中的透鏡結構。透鏡結構包括分開的透鏡，所述透鏡定位成減少與對應LED晶片的光學解耦。對於各單獨LED晶片的單獨透鏡提供了定製各透鏡以提供具有目標輪廓的聚合發射之一部分的靈活性。多個透鏡可由共同囊封材料一體形成。其他透鏡結構包括在囊封材料上或穿過囊封材料提供的分開的透鏡。揭示在共同LED封裝件內的不同LED晶片結構與不同透鏡結構之組合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Light-emitting diode (LED) devices and more particularly lens structures in multiple-chip LED packages are disclosed. Lens structures include separate lenses positioned to reduce optical decoupling from corresponding LED chips. Individual lenses for each individual LED chip provide flexibility in tailoring each lens to provide a portion of aggregate emissions with a targeted profile. Multiple lenses may be integrally formed from a common encapsulant material. Other lens structures include separate lenses provided on or through encapsulant materials. Combinations of different LED chip structures and different lens structures within a common LED package are disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:LED封裝件</p>
        <p type="p">12-1:LED晶片</p>
        <p type="p">12-2:LED晶片</p>
        <p type="p">12-3:LED晶片</p>
        <p type="p">12-4:LED晶片</p>
        <p type="p">14:單一透鏡</p>
        <p type="p">16:基座</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1790" publication-number="202616645">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616645</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136571</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於高電流光子應用或其他應用的跨阻抗放大器</chinese-title>
        <english-title>TRANSIMPEDANCE AMPLIFIER FOR HIGH-CURRENT PHOTONIC APPLICATIONS OR OTHER APPLICATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251231B">H03F3/08</main-classification>
        <further-classification edition="200601120251231B">H03F1/32</further-classification>
        <further-classification edition="201301120251231B">H04B10/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商雷神公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAYTHEON COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩頓　馬修　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORTON, MATTHEW A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪　朝陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHAOYANG C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種設備包括一跨阻抗放大器，該跨阻抗放大器具有至少一個輸入端及一輸出端。該設備亦包括至少一個可控的第一電流源，該至少一個可控的第一電流源經組配以將至少一個輸入電流控制為一選定輸入電流，該選定輸入電流被提供至該跨阻抗放大器之該至少一個輸入端。該至少一個可控的第一電流源可連接至該跨阻抗放大器之該至少一個輸入端且可經組配以自施加至該跨阻抗放大器之該至少一個輸入端的該至少一個輸入電流汲取一DC電流。該設備可包括：一第二電流源；一第一電阻器，該第一電阻器連接在該跨阻抗放大器之該至少一個輸入端中的一第一輸入端與該第二電流源之間；及一第二電阻器，該第二電阻器連接在該跨阻抗放大器之該至少一個輸入端中的一第二輸入端與該第二電流源之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus includes a transimpedance amplifier having at least one input and an output. The apparatus also includes at least one controllable first current source configured to control at least one input current to a selected input current provided to the at least one input of the transimpedance amplifier. The at least one controllable first current source may connect to the at least one input of the transimpedance amplifier and may be configured to drain a DC current from the at least one input current applied to the at least one input of the transimpedance amplifier. The apparatus may include a second current source, a first resistor connected between a first input of the at least one input of the transimpedance amplifier and the second current source, and a second resistor connected between a second input of the at least one input of the transimpedance amplifier and the second current source.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:跨阻抗放大器/TIA</p>
        <p type="p">202:可控電流源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1791" publication-number="202615564">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615564</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136594</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電阻穩定的聚合物正溫度係數（PPTC）材料</chinese-title>
        <english-title>RESISTANCE STABLE POLYMER POSITIVE TEMPERATURE COEFFICIENT (PPTC) MATERIAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120251103B">C08K3/013</main-classification>
        <further-classification edition="200601120251103B">C08K3/04</further-classification>
        <further-classification edition="200601120251103B">C08L101/12</further-classification>
        <further-classification edition="200601120251103B">H01B1/24</further-classification>
        <further-classification edition="200601120251103B">H01C7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商力特福斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITTELFUSE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周志勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, FLORY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李慶北</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, QINGBEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　建華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIANHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種電阻穩定的聚合物正溫度係數（PPTC）材料，該材料可以包含聚合物基體、設置在聚合物基體中的多個填料組分，以及多個碳黑顆粒，所述多個碳黑顆粒在多個填料組分中的每一個的周圍結合，以增加多個碳黑顆粒在聚合物基體中的分散，從而增加聚合物基體的導電體積並減小聚合物基體中的電阻變化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A resistance stable polymer positive temperature coefficient (PPTC) material is provided that can include a polymer matrix, a plurality of filler components disposed in the polymer matrix, and a plurality of carbon black particles bonded around each of the plurality of filler components to increase dispersion of the plurality of carbon black particles in the polymer matrix, thereby increasing a conductive volume of the polymer matrix and reducing a resistance variance in the polymer matrix.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:聚合物基體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1792" publication-number="202616231">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616231</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136595</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檔板單元及具有檔板單元的紙幣處理裝置</chinese-title>
        <english-title>BEZEL AND BILL HANDLING APPARATUS HAVING BEZEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120251128B">G07D11/16</main-classification>
        <further-classification edition="201901120251128B">G07D11/14</further-classification>
        <further-classification edition="201901120251128B">G07D11/18</further-classification>
        <further-classification edition="201901120251128B">G07D11/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本金錢機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN CASH MACHINE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原口孝平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARAGUCHI, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>關亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKI, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種檔板單元，其可阻止硬幣侵入紙幣處理裝置的紙幣投入口且可將多張的紙幣束順暢地補充至紙幣處理裝置內。[解決手段] 一種安裝在紙幣處理裝置(1)的檔板單元(30)具備：框體(35)，其被固定於紙幣處理裝置(1)的殼體(4)；紙幣載置台(31)，其從框體(35)向前方突出並形成紙幣投入口(36)；一對側壁(39)，其等在紙幣載置台(31)的兩側邊緣彼此隔開間隔且從框體(35)向前方突出；擺動軸(34)，其橫跨紙幣載置台(31)並被安裝於一對側壁(39)；蓋(50)，其在下方位置與上方位置之間可旋轉地安裝於擺動軸(34)；旋轉軸(51)，其相對於擺動軸(34)平行地安裝於蓋(50)；以及轉動滾輪(52)，其可旋轉地安裝於旋轉軸(51)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:紙幣處理裝置</p>
        <p type="p">2:紙幣入口</p>
        <p type="p">4:殼體</p>
        <p type="p">5:搬送裝置</p>
        <p type="p">6:搬送馬達</p>
        <p type="p">7:搬送通路</p>
        <p type="p">7a:上壁</p>
        <p type="p">7b:下壁</p>
        <p type="p">8:取入滾輪</p>
        <p type="p">9:入口感測器</p>
        <p type="p">11:正轉滾輪</p>
        <p type="p">12:逆轉滾輪(暫時停止滾輪)</p>
        <p type="p">13:凹部</p>
        <p type="p">14:按壓裝置</p>
        <p type="p">15:鑑別感測器</p>
        <p type="p">30:檔板單元</p>
        <p type="p">31:紙幣載置台</p>
        <p type="p">34:擺動軸</p>
        <p type="p">35:框體</p>
        <p type="p">36:紙幣投入口</p>
        <p type="p">39:一對側壁</p>
        <p type="p">50:蓋</p>
        <p type="p">51:旋轉軸</p>
        <p type="p">52:轉動滾輪</p>
        <p type="p">53:前壁</p>
        <p type="p">54:彈性片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1793" publication-number="202616502">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616502</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136603</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>(I)確定半導體封裝的引線環形狀的方法和(II)產生半導體封裝設計的方法</chinese-title>
        <english-title>METHODS OF (I) DETERMINING WIRE LOOP SHAPES FOR A SEMICONDUCTOR PACKAGE AND OF (II) GENERATING A SEMICONDUCTOR PACKAGE DESIGN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251231B">H01L23/495</main-classification>
        <further-classification edition="202001120251231B">G06F30/398</further-classification>
        <further-classification edition="200601120251231B">H01L21/56</further-classification>
        <further-classification edition="200601120251231B">H01L21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商庫利克和索夫工業公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KULICKE AND SOFFA INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米爾頓　巴西爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MILTON, BASIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權五達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, ODAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡思卡特　雷　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CATHCART, RAY L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒沙林　帕維爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHUSHARIN, PAVEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種確定配置為被包含在一半導體封裝中的複數個引線環的引線環形狀的方法。該方法包含以下步驟：（a）提供相關於該半導體封裝的封裝資料；以及（b）使用步驟（a）中提供的該封裝資料，產生該等引線環的每一個的引線環形狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of determining wire loop shapes for a plurality of wire loops configured to be included in a semiconductor package is provided. The method includes the steps of: (a) providing package data related to the semiconductor package; and (b) generating wire loop shapes for each of the plurality of wire loops using the package data provided in step (a).</p>
      </isu-abst>
      <representative-img>
        <p type="p">400,402,404,406,408,410,412,414,416:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1794" publication-number="202616587">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616587</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136606</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>背板連接器組件</chinese-title>
        <english-title>BACKPLANE CONNECTOR ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120251113B">H01R13/6581</main-classification>
        <further-classification edition="200601120251113B">H01R13/22</further-classification>
        <further-classification edition="200601120251113B">H01R13/502</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立訊技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉琨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李興玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XINGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭金闖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAN, JINCHUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪元鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YUANXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>苟中凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOU, ZHONGFA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種背板連接器組件包括第一背板連接器以及第二背板連接器。前述第一背板連接器包括複數第一導電端子以及第一屏蔽套筒。前述第二背板連接器包括複數第二導電端子以及位於前述第二導電端子之外的第二屏蔽套筒。當前述第一背板連接器與前述第二背板連接器對接時，前述第一屏蔽套筒與前述第二屏蔽套筒相互靠近，前述第一導電端子與前述第二導電端子相接觸。如此設置，本發明有利於改善對前述第一導電端子以及前述第二導電端子相接觸時的屏蔽效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A backplane connector assembly includes a first backplane connector and a second backplane connector. The first backplane connector includes a number of first conductive terminals and a first shielding sleeve. The second backplane connector includes a number of second conductive terminals and a second shielding sleeve located outside the second conductive terminals. When the first backplane connector is mated with the second backplane connector, the first shielding sleeve and the second shielding sleeve are disposed adjacent to each other, and the first conductive terminals are in contact with the second conductive terminals. With this arrangement, the shielding effect is improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">25:第一屏蔽套筒</p>
        <p type="p">263:第一連接屏蔽片</p>
        <p type="p">264:第二連接屏蔽片</p>
        <p type="p">265a1:第一彈臂</p>
        <p type="p">265a2:第二彈臂</p>
        <p type="p">265b1:第三彈臂</p>
        <p type="p">265b2:第四彈臂</p>
        <p type="p">266a1:第五彈臂</p>
        <p type="p">266a2:第六彈臂</p>
        <p type="p">266b1:第七彈臂</p>
        <p type="p">266b2:第八彈臂</p>
        <p type="p">65:第二屏蔽套筒</p>
        <p type="p">F:圖53中畫框部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1795" publication-number="202615555">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615555</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136616</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合材料及其製備方法、內襯及其製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">C08J5/08</main-classification>
        <further-classification edition="200601120251201B">C03C13/00</further-classification>
        <further-classification edition="201201120251201B">B24B37/14</further-classification>
        <further-classification edition="200601120251201B">B29C45/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中環領先半導體科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHONGHUAN ADVANCED SEMICONDUCTOR TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祝斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了複合材料及其製備方法、內襯及其製備方法。複合材料適用於矽片拋光機夾具的內襯材料，基於複合材料的總質量，複合材料包括：50%~60%的基體；40%~50%的增強劑；0~2%的添加劑，基體為聚醯胺，增強劑為玻璃纖維，玻璃纖維為絲狀，玻璃纖維的纖維直徑為D，且滿足為5微米≤D≤25微米。聚醯胺為複合材料提供優異的拉伸強度、彎曲強度以及剛性，玻璃纖維進一步加強複合材料的機械強度，進而保證複合材料良好的機械性能，以滿足矽片拋光機夾具對內襯的硬度和耐磨性的要求，有效提高拋光後矽片的幾何參數控制能力，降低同批次矽片的表面平坦度差異，提高拋光效率，降低成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:模具腔</p>
        <p type="p">111,112,113,114,115,116,117,118:注塑孔</p>
        <p type="p">R:間距</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1796" publication-number="202615323">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615323</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136637</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黏貼裝置及電子零件的封裝裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251124B">B65H26/06</main-classification>
        <further-classification edition="200601120251124B">B65H37/04</further-classification>
        <further-classification edition="200601120251124B">B65H23/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商芝浦機械電子裝置股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBAURA MECHATRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊池一哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種不受伴隨黏著帶搬送的黏著帶的伸長或輸送精度影響而能夠高精度地黏貼黏著帶的黏貼裝置及電子零件的封裝裝置。根據一個實施形態，實施形態的黏貼有黏著帶的黏貼裝置包括：搬送部，對黏著帶進行搬送；載台部，供黏貼有黏著帶的黏貼對象物載置；攝像部，對黏著帶的第一切縫及/或第二切縫進行拍攝；支承部，對黏貼對象物的黏貼區域進行支撐；移動機構，供攝像部搭載；切斷部，於黏著帶形成第二切縫；以及加壓頭，對黏著帶進行加壓並黏貼於黏貼對象物。進而，基於藉由拍攝而偵測到的第二切縫的位置來進行將載台部及加壓頭定位於黏貼位置的移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:黏貼裝置</p>
        <p type="p">2:帶狀構件</p>
        <p type="p">11:黏貼部</p>
        <p type="p">12:供給部</p>
        <p type="p">13:回收部</p>
        <p type="p">14:搬送部</p>
        <p type="p">15:剝離部</p>
        <p type="p">16:切斷部</p>
        <p type="p">17:照明部</p>
        <p type="p">18:攝像部</p>
        <p type="p">19a:控制部</p>
        <p type="p">21:黏著帶</p>
        <p type="p">22:脫模帶</p>
        <p type="p">110:加壓頭</p>
        <p type="p">111:支承部</p>
        <p type="p">111a:附著防止構件</p>
        <p type="p">113、162:移動機構</p>
        <p type="p">120:供給捲軸</p>
        <p type="p">121:張力機構</p>
        <p type="p">121a:固定輥</p>
        <p type="p">121b:可動輥</p>
        <p type="p">122、131:路徑輥</p>
        <p type="p">130:回收捲軸</p>
        <p type="p">140:輥/輸送輥</p>
        <p type="p">150、151:剝離棒</p>
        <p type="p">160:切割器</p>
        <p type="p">161:支承構件</p>
        <p type="p">161a:平坦面</p>
        <p type="p">162a:X方向移動機構</p>
        <p type="p">162b:Y方向移動機構</p>
        <p type="p">CL:切縫</p>
        <p type="p">HC:半切線</p>
        <p type="p">L:長度/規定的長度(切出長度)</p>
        <p type="p">OP:黏貼基準位置</p>
        <p type="p">X、Y、Z:方向/軸</p>
        <p type="p">θ:角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1797" publication-number="202616546">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616546</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136638</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鋰離子二次電池用正極活性物質、鋰離子二次電池、及鋰離子二次電池用正極活性物質的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120251031B">H01M10/0525</main-classification>
        <further-classification edition="201001120251031B">H01M10/0562</further-classification>
        <further-classification edition="200601120251031B">C01G53/11</further-classification>
        <further-classification edition="202501120251031B">C01G53/42</further-classification>
        <further-classification edition="200601120251031B">C04B35/19</further-classification>
        <further-classification edition="200601120251031B">H01M4/36</further-classification>
        <further-classification edition="201001120251031B">H01M4/525</further-classification>
        <further-classification edition="200601120251031B">H01M4/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JFE STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商杰富意礦物股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JFE MINERAL &amp; ALLOY COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>枝村紅依</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EDAMURA, KUREI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宇佐美順也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USAMI, JUNYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>須藤幹人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUTO, MIKITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浜野嘉昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMANO, YOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫能奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, NENGQI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小川　依馬未佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGAWA EMA, MIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太田公介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTA, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明以提供循環穩定性優異的鋰離子二次電池用正極活性物質為課題。此外，本發明也以提供鋰離子二次電池及鋰離子二次電池用正極活性物質的製造方法為課題。本發明的鋰離子二次電池用正極活性物質含有活性物質粒子，上述活性物質粒子具有複合氧化物粒子、以及覆蓋上述複合氧化物粒子的表面的至少一部分且含有鋰鋁矽酸鹽的附著層，在孔隙分布測定中，孔徑為6 nm～30 nm的孔隙的孔隙容積為0.00030 cm&lt;sup&gt;3&lt;/sup&gt;/g～0.00100 cm&lt;sup&gt;3&lt;/sup&gt;/g，且藉由X射線光電子分光法測定的、Si的含有量相對於過渡金屬元素的含有量的總和的比，以莫耳比計為0.15～2.00。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:鋰離子二次電池</p>
        <p type="p">12:正極</p>
        <p type="p">14:負極</p>
        <p type="p">16:固體電解質層</p>
        <p type="p">22:正極集電體</p>
        <p type="p">24:正極活性物質層</p>
        <p type="p">26:負極活性物質層</p>
        <p type="p">28:負極集電體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1798" publication-number="202616119">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616119</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136644</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及用以檢測安全攻擊的方法</chinese-title>
        <english-title>AN ELECTRONIC DEVICE AND A METHOD FOR DETECTING SECURITY ATTACKS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120251208B">G06F21/81</main-classification>
        <further-classification edition="201301120251208B">G06F21/78</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科斯納爾　尤佛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIRSCHNER, YUVAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛蘭　塔米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOLAN, TAMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置包含一電源輸入、一受保護電路以及一電壓感測電路。受保護電路，配置為從電源輸入汲取電流，從而自電源輸入獲得一工作電壓波形。電壓感測電路，配置為透過不同於一第一電性連接的一第二電性連接，從電源輸入接收不同於工作電壓波形的一感測電壓波形，並響應於感測電壓波形以檢測對受保護電路的一安全攻擊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes a power-supply input, a protected circuit and a voltage sense circuit, The protected circuit is configured to draw current from the power-supply input, thereby obtaining from the power-supply input an operational voltage waveform. The voltage sense circuit is configured to receive, from the power-supply input, a sense voltage waveform that differs from the operational voltage waveform, via a second electrical connection that is separate from the first electrical connection, and to detect a security attack on the protected circuit responsively to the sense voltage waveform.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:抗攻擊電子裝置</p>
        <p type="p">102:積體電路</p>
        <p type="p">104:受保護電路</p>
        <p type="p">106:電源輸入</p>
        <p type="p">107:電容器</p>
        <p type="p">108:電源電壓走線</p>
        <p type="p">110,120:鍵合線</p>
        <p type="p">112,122:焊墊</p>
        <p type="p">114:電壓感測電路</p>
        <p type="p">116:電壓感測輸入</p>
        <p type="p">Ipc:電流</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1799" publication-number="202615641">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615641</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136652</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>藥液、半導體基板的清洗方法、電子元件之製造方法</chinese-title>
        <english-title>CHEMICAL SOLUTION, METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C11D3/04</main-classification>
        <further-classification edition="200601120260102B">C11D3/30</further-classification>
        <further-classification edition="200601120260102B">C11D3/36</further-classification>
        <further-classification edition="200601120260102B">C11D3/34</further-classification>
        <further-classification edition="200601120260102B">C11D7/06</further-classification>
        <further-classification edition="200601120260102B">C11D7/08</further-classification>
        <further-classification edition="200601120260102B">C11D7/32</further-classification>
        <further-classification edition="200601120260102B">C11D7/34</further-classification>
        <further-classification edition="200601120260102B">C11D7/36</further-classification>
        <further-classification edition="200601120260102B">B08B3/08</further-classification>
        <further-classification edition="200601120260102B">H01L21/02</further-classification>
        <further-classification edition="200601120260102B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉村宣明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIMURA, NOBUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>滋野井悠太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIGENOI, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水谷篤史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUTANI, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題為提供一種在用於清洗實施了化學機械研磨處理之含有銅含有物之半導體基板時銅的腐蝕抑制性優異且銅含有物上的殘渣的去除性亦優異的藥液。又，本發明的另一課題為提供一種使用了上述藥液之半導體基板的清洗方法及電子元件之製造方法。本發明的藥液含有：鹼源；含特定磷原子之化合物，選自包括含磷原子之酸及其鹽之群組中之至少1種；特定化合物，選自包括第1化合物及第2化合物之群組中之至少1種；及水，pH為11.50以下，上述第1化合物具有2個以上的選自包括胺基及羥基之群組中之基，上述第2化合物具有2個以上的選自包括硫醇基及硫醚基之群組中之基。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1800" publication-number="202616839">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616839</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136659</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於嵌套電容器的系統和方法</chinese-title>
        <english-title>SYSTEM AND METHODS FOR A NESTED CAPACITOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251201B">H10D1/68</main-classification>
        <further-classification edition="202501120251201B">H10D88/00</further-classification>
        <further-classification edition="202301120251201B">H10B12/00</further-classification>
        <further-classification edition="202301120251201B">H10N97/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安光虎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, KWANGHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金東完</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DONGWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李重建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DON KOUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭露方法、裝置和系統，包含第一電容器，具有第一電極，第一電極具有第一區段和第二區段，其在第一方向上從近端延伸到遠端，並在近端由連接區段連接以形成口部。第二電極可具有第三區段、第四區段和第五區段，其形成在第一方向上面向第一電極的叉。叉可具有第一槽，其在第三和第四區段之間包圍第一區段，以及第二槽，其在第四和第五區段之間包圍第二區段。第一半導體通道可在第一電極相對第二電極的一側上，第一半導體具有第一末端，在第一方向上延伸進入近端處的口部。中間介電質層可在第一電極和第二電極之間，在第一和第二槽中沿著第三、第四和第五區段延伸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are methods, devices and systems including a first capacitor with a first electrode with a first segment and a second segment extending from a proximal end to a distal end in a first direction and joined at the proximal end by a connecting segment to form a mouth. A second electrode may have a third segment, a fourth segment, and a fifth segment, which form a fork facing the first electrode in the first direction. The fork may have a first slot enclosing the first segment between the third and fourth segments, and a second slot enclosing the second segment between the fourth and fifth segments. A first semiconductor channel may be on a side of the first electrode opposite the second electrode, with the first semiconductor having a first nub end extending in the first direction into the mouth at the proximal end. An intermediate dielectric layer may be between the first electrode and the second electrode, extending alongside the third, fourth, and fifth segment in the first and the second slot.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:第一裝置架構</p>
        <p type="p">102:底部電極</p>
        <p type="p">103:記憶體胞元</p>
        <p type="p">104:中間介電質</p>
        <p type="p">105:電容器</p>
        <p type="p">106:頂部電極</p>
        <p type="p">107:中心突出部</p>
        <p type="p">110:半導體通道</p>
        <p type="p">111:末端</p>
        <p type="p">112:垂直電極</p>
        <p type="p">114:板導體</p>
        <p type="p">116:水平電極</p>
        <p type="p">118:電晶體</p>
        <p type="p">120:隔離層</p>
        <p type="p">122:第一介電材料</p>
        <p type="p">124:第二介電材料</p>
        <p type="p">126:電晶體襯墊層</p>
        <p type="p">128:襯裡介電層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1801" publication-number="202615054">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615054</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136670</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硼酸衍生物及其製備方法和應用</chinese-title>
        <english-title>BORIC ACID DERIVATIVES AND THEIR PREPARATION METHODS AND APPLICATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">A61K31/69</main-classification>
        <further-classification edition="200601120251103B">C07F5/02</further-classification>
        <further-classification edition="200601120251103B">C07F9/53</further-classification>
        <further-classification edition="200601120251103B">A61P31/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商　科睿迪（南京）醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商　南京恩泰醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉春波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHUN-BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳正幫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZHENG-BANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王姍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GE, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯慶辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種硼酸衍生物及其製備方法和應用，硼酸衍生物如式I或式II或式III所示，所述與抗菌劑聯用具有較強的抗菌活性。小鼠單次靜脈給藥後體內暴露量為QPX-7728暴露量的5倍以上，有利於在獲得相似藥效情況下減少給藥劑量，減少藥物毒副作用。  &lt;br/&gt;&lt;img align="absmiddle" height="159px" width="463px" file="ed10162.JPG" alt="ed10162.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無。</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1802" publication-number="202616452">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616452</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136681</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>舟承托裝置及半導體製程設備</chinese-title>
        <english-title>BOAT SUPPORT DEVICE AND SEMICONDUCTOR PROCESS EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251127B">H01L21/677</main-classification>
        <further-classification edition="200601120251127B">H01L21/683</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李朝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓澤南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, ZE NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李金龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIN LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開一種舟承托裝置及半導體製程設備，涉及半導體製備技術領域，所公開的舟承托裝置包括驅動機構、第一承載臂和第二承載臂，驅動機構分別與第一承載臂以及第二承載臂連接，以驅動第一承載臂和第二承載臂通過平移的方式相互靠近或遠離；在第一承載臂和第二承載臂相互靠近的情況下，第一承載臂和第二承載臂分別用於承托承載舟的相背兩側的舟耳。由於第一承載臂和第二承載臂採用平移的方式相對移動，從而使得承載舟與第一承載臂以及第二承載臂能夠處於較為穩定的配合狀態，進而提升了承載舟的承托過程的可靠性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application discloses a boat support device for semiconductor process equipment, relating to the field of semiconductor manufacturing technology. The boat support device includes a drive mechanism, a first support arm, and a second support arm. The drive mechanism is connected to the first support arm and the second support arm to drive them to move toward or away from each other in a translational direction. When the first support arm and the second support arm are close to each other, they are used to support the boat ears on opposite sides of the support boat, respectively. Because the first support arm and the second support arm move relative to each other in a translational direction, the support boat and the support arms can cooperate in a relatively stable manner, thereby improving the reliability of the boat support process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:舟承托裝置</p>
        <p type="p">110:驅動機構</p>
        <p type="p">120:第一承載臂</p>
        <p type="p">130:第二承載臂</p>
        <p type="p">140:第一方向</p>
        <p type="p">200:承載舟</p>
        <p type="p">210:舟耳</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1803" publication-number="202616469">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616469</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136682</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液冷裝置、脈衝電源功率組件及晶圓承載裝置</chinese-title>
        <english-title>LIQUID COOLING DEVICE, PULSED POWER COMPONENT, AND WAFER SUPPORT APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251003B">H01L21/683</main-classification>
        <further-classification edition="200601120251003B">F28D5/00</further-classification>
        <further-classification edition="200601120251003B">F28F21/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王蕾越</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LEI YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張照</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, ZHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王景遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JING YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東彧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, DONG YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李會鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, HUI XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, GANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種液冷裝置、脈衝電源功率組件及晶圓承載裝置，液冷裝置包括：導熱本體，設置有導流冷卻液的導流通道，導流通道由至少兩個通道段連通形成；導熱分隔結構，其至少設置在一通道段中，且與通道段的壁面導熱連接，用於對冷卻液進行分流和/或導向。藉由在導流通道中設置導熱分隔結構，可透過冷卻液與導熱分隔結構的接觸實現與導熱本體的導熱，從而使換熱面積增大，提升冷卻液和導熱本體的換熱效率，另透過導熱分隔結構對冷卻液進行分流和/或導向，使冷卻液的流動性質在通道段中變化為湍流，亦能提升冷卻液和導熱本體的換熱效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a liquid cooling device, a pulsed power component, and a wafer support apparatus. The liquid cooling device includes: a thermally conductive body, which is provided with a flow channel for directing cooling liquid, wherein the flow channel is formed by connecting at least two channel sections; and a thermally conductive partition structure, which is arranged in at least one channel section and is thermally connected to the wall surface of the channel section, used for diverting and/or guiding the cooling liquid. By arranging the thermally conductive partition structure in the flow channel, heat conduction with the thermally conductive body can be achieved through the contact between the cooling liquid and the thermally conductive partition structure, thereby increasing the heat exchange area and improving the heat exchange efficiency between the cooling liquid and the thermally conductive body. Additionally, by diverting and/or guiding the cooling liquid through the thermally conductive partition structure, the flow characteristics of the cooling liquid in the channel section are changed to turbulent flow, which can also improve the heat exchange efficiency between the cooling liquid and the thermally conductive body.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:導熱本體</p>
        <p type="p">3:導熱分隔片</p>
        <p type="p">203:進液口</p>
        <p type="p">204:出液口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1804" publication-number="202615464">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615464</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136684</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>治療狼瘡性腎炎之組成物及方法</chinese-title>
        <english-title>COMPOSITIONS AND METHODS OF TREATING LUPUS NEPHRITIS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">C07K16/18</main-classification>
        <further-classification edition="200601120260114B">A61K39/395</further-classification>
        <further-classification edition="200601120260114B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商建南德克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENENTECH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭德格拉夫特　威廉　富蘭克林　三世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENDERGRAFT, WILLIAM FRANKLIN, III</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿方索　羅斯　特雷斯　喬治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALFONSO ROSS TERRES, JORGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高格　傑　普拉卡什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARG, JAY PRAKASH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露尤其提供了：耗乏患有狼瘡性腎炎的個體之腎駐留型 B 細胞之方法，其包含以三種抗體暴露向該個體投予奧比妥珠單抗；以及與其相關之用途、使用之組成物及套組。在一些實施例中，該方法導致在投予第一抗體暴露之後約 76 週至約 80 週獲得的腎臟生檢樣品中每 mm&lt;sup&gt;2&lt;/sup&gt; 組織平均少於一個 B 細胞，每 mm&lt;sup&gt;2&lt;/sup&gt; 組織的平均 B 細胞數量減少 95% 或更多，以及/或活性指數 (AI) 小於或等於 1。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides, &lt;i&gt;inter alia&lt;/i&gt;, methods for depleting kidney-resident B cells in an individual that has lupus nephritis, comprising administering obinutuzumab to the individual in three antibody exposures, as well as uses, compositions for use, and kits related thereto. In some embodiments, the methods result in an average of less than one B cell per mm&lt;sup&gt;2&lt;/sup&gt; tissue, a 95% or greater reduction in average number of B cells per mm&lt;sup&gt;2&lt;/sup&gt; tissue, and/or an activity index (AI) of less than or equal to 1 in kidney biopsy samples obtained at about 76 weeks to about 80 weeks after administration of the first antibody exposure.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1805" publication-number="202615324">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615324</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136693</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黏貼裝置及電子零件的封裝裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251113B">B65H35/10</main-classification>
        <further-classification edition="200601120251113B">B65H37/00</further-classification>
        <further-classification edition="200601120251113B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商芝浦機械電子裝置股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBAURA MECHATRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊池一哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種不受伴隨黏著帶搬送的黏著帶的伸長或輸送精度影響而能夠高精度地黏貼黏著帶的黏貼裝置及電子零件的封裝裝置。根據一個實施形態，黏貼裝置包括搬送部。進而，黏貼裝置包括載台部。進而，黏貼裝置包括攝像部。進而，黏貼裝置包括在黏貼基準位置與退避位置之間移動的移動機構。進而，黏貼裝置包括在退避位置與切斷位置之間移動的切斷部。進而，黏貼裝置包括加壓頭，所述加壓頭沿與黏貼對象物接觸/分離的方向移動，對黏著帶進行加壓並黏貼於所述黏貼對象物。進而，切斷部基於藉由對所搬送的黏著帶的拍攝而偵測到的第一切縫的位置來進行第二切縫的形成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:黏貼裝置</p>
        <p type="p">2:帶狀構件</p>
        <p type="p">11:黏貼部</p>
        <p type="p">12:供給部</p>
        <p type="p">13:回收部</p>
        <p type="p">14:搬送部</p>
        <p type="p">15:剝離部</p>
        <p type="p">16:切斷部</p>
        <p type="p">17:照明部</p>
        <p type="p">18:攝像部</p>
        <p type="p">19a:控制部</p>
        <p type="p">21:黏著帶</p>
        <p type="p">22:脫模帶</p>
        <p type="p">110:加壓頭</p>
        <p type="p">111:支承部</p>
        <p type="p">111a:附著防止構件</p>
        <p type="p">113、162:移動機構</p>
        <p type="p">120:供給捲軸</p>
        <p type="p">121:張力機構</p>
        <p type="p">121a:固定輥</p>
        <p type="p">121b:可動輥</p>
        <p type="p">122、131:路徑輥</p>
        <p type="p">130:回收捲軸</p>
        <p type="p">140:輥/輸送輥</p>
        <p type="p">150、151:剝離棒</p>
        <p type="p">160:切割器</p>
        <p type="p">161:支承構件</p>
        <p type="p">161a:平坦面</p>
        <p type="p">162a:X方向移動機構</p>
        <p type="p">162b:Y方向移動機構</p>
        <p type="p">CL:切縫</p>
        <p type="p">HC:半切線</p>
        <p type="p">L:長度/規定的長度(切出長度)</p>
        <p type="p">OP:黏貼基準位置</p>
        <p type="p">X、Y、Z:方向/軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1806" publication-number="202616776">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616776</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136708</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電漿腔室的環結構及系統</chinese-title>
        <english-title>RING STRUCTURES AND SYSTEMS FOR USE IN A PLASMA CHAMBER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H05H1/34</main-classification>
        <further-classification edition="200601120260112B">H05H1/02</further-classification>
        <further-classification edition="200601120260112B">H01L21/683</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克拉吉　麥可　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KELLOGG, MICHAEL C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥斯　亞當</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACE, ADAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪瑞卡塔諾　艾力西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARAKHTANOV, ALEXEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍藍德　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOLLAND, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZHIGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯札維奇　菲力克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOZAKEVICH, FELIX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬堤育斯金　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATYUSHKIN, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述用於將邊緣環固定至支撐環的系統及方法。邊緣環係藉由插入至邊緣環之底表面的多個緊固件固定至支撐環。將邊緣環固定至支撐環在電漿腔室內之基板的處理期間提供邊緣環的穩定性。此外，由於支撐環係固定至連接至電漿腔室之絕緣體壁的絕緣體環，所以將邊緣環固定至支撐環將邊緣環固定至電漿腔室。此外，支撐環及邊緣環係在基板的處理期間使用一或更多扣緊機構垂直下拉、且係使用扣緊機構垂直上推以自電漿腔室移除邊緣環及支撐環。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and methods for securing an edge ring to a support ring are described. The edge ring is secured to the support ring via multiple fasteners that are inserted into a bottom surface of the edge ring. The securing of the edge ring to the support ring provides stability of the edge ring during processing of a substrate within a plasma chamber. In addition, the securing of the edge ring to the support ring secures the edge ring to the plasma chamber because the support ring is secured to an insulator ring, which is connected to an insulator wall of the plasma chamber. Moreover, the support ring and the edge ring are pulled down vertically using one or more clasp mechanisms during the processing of the substrate and are pushed up vertically using the clasp mechanisms to remove the edge ring and the support ring from the plasma chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">228:邊緣環</p>
        <p type="p">1604:頂表面</p>
        <p type="p">1606:內表面</p>
        <p type="p">1608:內表面</p>
        <p type="p">1610:內表面</p>
        <p type="p">1612:底表面</p>
        <p type="p">1614:外表面</p>
        <p type="p">1616:彎曲的邊緣</p>
        <p type="p">1618:內表面</p>
        <p type="p">1620:內表面</p>
        <p type="p">1622:台階</p>
        <p type="p">A1:角度</p>
        <p type="p">A2:角度</p>
        <p type="p">d1:距離</p>
        <p type="p">d2:長度</p>
        <p type="p">d3:距離</p>
        <p type="p">ID1:內直徑</p>
        <p type="p">MD:中間直徑</p>
        <p type="p">OD1:外直徑</p>
        <p type="p">R1:半徑</p>
        <p type="p">R2:半徑</p>
        <p type="p">R3:半徑</p>
        <p type="p">R4:半徑</p>
        <p type="p">R5:半徑</p>
        <p type="p">R6:半徑</p>
        <p type="p">R7:半徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1807" publication-number="202615823">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615823</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136735</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>振動感測器及其量測方法</chinese-title>
        <english-title>VIBRATION SENSOR AND MEASUREMENT METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G01H1/06</main-classification>
        <further-classification edition="200601120260102B">G01H1/08</further-classification>
        <further-classification edition="200601120260102B">G01H11/06</further-classification>
        <further-classification edition="200601120260102B">C23C16/54</further-classification>
        <further-classification edition="200601120260102B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>列支敦斯登商英飛康股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INFICON AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LI</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫維契柯　伊格爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUVYCHKO, IGOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉皮多特　馬丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAPIDOT, MATAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種中空裝置，包含中空內部及至少一個振動感測器，此振動感測器被構造來量測裝置或裝置部件之振動。至少一個振動感測器被定位於裝置內部的外側，且中空裝置係例如管道、管子、導管、容器或處理室。亦揭示用於量測裝置或裝置部件之振動的相關聯方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hollow device comprising a hollow interior and at least one vibration sensor configured to measure a vibration of the device or of a component of the device. The at least one vibration sensor is positioned outside the interior of the device and the hollow device is, for example, a pipe, a tube, a duct, a container or a treatment chamber. Associated methods for measuring a vibration of a device or of a component of a device are also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1808" publication-number="202616026">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616026</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136757</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人類活動支援系統、人類活動支援用之自律移動體、人類活動支援方法、及人類活動支援程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260102B">G05D1/646</main-classification>
        <further-classification edition="202401120260102B">G05D1/686</further-classification>
        <further-classification edition="202401120260102B">G05D1/24</further-classification>
        <further-classification edition="202401120260102B">G05D1/226</further-classification>
        <further-classification edition="202401120260102B">G05D1/225</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商川崎重工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松田義基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUDA, YOSHIMOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之移動體處理電路以進行如下步驟之方式構成：自律移動體取得表示用以靠近對象人類之目標地點之目標地點資訊；基於上述目標地點資訊，生成使上述自律移動體朝向上述目標地點自律移動之移動計劃；取得表示存在於區域之實體之位置之位置資訊；於上述自律移動體朝向上述目標地點移動時，根據上述實體之上述位置之變化，修正上述移動計劃；取得用以支援上述對象人類之活動之支援資訊；及於上述自律移動體到達上述目標地點之狀態下，使人機介面向上述對象人類輸出上述支援資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:人類活動支援系統</p>
        <p type="p">2:區域</p>
        <p type="p">3:自律移動體</p>
        <p type="p">3A:第1自律移動體</p>
        <p type="p">3B:第2自律移動體</p>
        <p type="p">4:人類</p>
        <p type="p">4A:對象人類</p>
        <p type="p">5:行動資訊終端</p>
        <p type="p">6:無線存取點(第1靜置感測器之例)</p>
        <p type="p">7:信標(第2靜置感測器之例)</p>
        <p type="p">8:設備</p>
        <p type="p">9:實體</p>
        <p type="p">N:通訊網路</p>
        <p type="p">SV:伺服器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1809" publication-number="202616027">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616027</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136758</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>管理系統、管理方法及管理程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260102B">G05D1/686</main-classification>
        <further-classification edition="202401120260102B">G05D1/648</further-classification>
        <further-classification edition="202401120260102B">G05D1/43</further-classification>
        <further-classification edition="201001120260102B">G01S5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商川崎重工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松田義基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUDA, YOSHIMOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之管理系統之處理電路構成為進行如下步驟：算出對複數個移動體中之至少一個移動體之移動、及區域之設備之運轉之至少一者造成影響之管理資訊；獲取利用設置於前述複數個移動體之各者之感測器所獲得之前述複數個移動體之位置資訊；及基於前述複數個移動體之位置，變更前述管理資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:管理系統</p>
        <p type="p">2:區域</p>
        <p type="p">3:移動機器人</p>
        <p type="p">4:人類</p>
        <p type="p">5:資訊處理終端</p>
        <p type="p">6:無線存取點</p>
        <p type="p">7:設備</p>
        <p type="p">8:伺服器</p>
        <p type="p">9:操作員終端</p>
        <p type="p">N:通訊網路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1810" publication-number="202615206">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615206</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136803</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>研磨墊及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120251201B">B24B37/24</main-classification>
        <further-classification edition="201201120251201B">B24B37/26</further-classification>
        <further-classification edition="200601120251201B">B24D3/32</further-classification>
        <further-classification edition="200601120251201B">B24D11/00</further-classification>
        <further-classification edition="200601120251201B">B24D18/00</further-classification>
        <further-classification edition="200601120251201B">C08L1/12</further-classification>
        <further-classification edition="200601120251201B">C08L75/06</further-classification>
        <further-classification edition="200601120251201B">C08L91/06</further-classification>
        <further-classification edition="200601120251201B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士紡控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIBO HOLDINGS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松岡立馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUOKA, RYUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田竜也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喜樂香枝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIRAKU, YOSHIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮内慶樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAUCHI, YOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>首藤暁子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUTO, AKIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤田永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWADA, HARUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種漿料中的研磨粒、特別是矽（Si）成分不易附著的研磨墊及其製造方法。揭示一種研磨墊，包括研磨層，所述研磨層具有包含多個淚滴形狀氣泡的聚胺基甲酸酯片，所述研磨墊中，所述聚胺基甲酸酯片包含聚胺基甲酸酯樹脂，所述聚胺基甲酸酯樹脂包含離子性聚胺基甲酸酯樹脂。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1811" publication-number="202615071">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615071</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136826</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靶向ＡＮＴ２之小干擾ＲＮＡ及其在疾病治療中之用途</chinese-title>
        <english-title>SMALL INTERFERING RNAS TARGETING ANT2 AND USES THEREOF FOR DISEASE TREATMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">A61K31/7088</main-classification>
        <further-classification edition="201001120260113B">C12N15/113</further-classification>
        <further-classification edition="200601120260113B">A61P3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中天（上海）生物科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICROBIO (SHANGHAI) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張翼中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YI-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊奇凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHI-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊家俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIA-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭志玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於干擾RNA，諸如靶向腺嘌呤核苷酸易位體2 (ANT2)之傳訊RNA的小干擾RNA (siRNA)；包含該等干擾RNA之醫藥組合物；以及其用於治療與ANT2相關之疾病，例如癌症及代謝疾病之治療用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Interfering RNAs such as small interfering RNAs (siRNAs) targeting the messenger RNA of adenine nucleotide translocator 2 (ANT2), pharmaceutical compositions comprising such, and therapeutic uses thereof for treating diseases associated with ANT2, for example, cancer and metabolic diseases.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1812" publication-number="202615490">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615490</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136841</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體元件之製造方法及半導體元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F2/44</main-classification>
        <further-classification edition="200601120260102B">C08F222/20</further-classification>
        <further-classification edition="200601120260102B">C08F290/14</further-classification>
        <further-classification edition="200601120260102B">C08G73/12</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/027</further-classification>
        <further-classification edition="200601120260102B">G03F7/028</further-classification>
        <further-classification edition="200601120260102B">G03F7/031</further-classification>
        <further-classification edition="200601120260102B">G03F7/037</further-classification>
        <further-classification edition="200601120260102B">G03F7/038</further-classification>
        <further-classification edition="200601120260102B">G03F7/16</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
        <further-classification edition="200601120260102B">H01L21/312</further-classification>
        <further-classification edition="200601120260102B">H01L23/29</further-classification>
        <further-classification edition="200601120260102B">H01L23/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友田和貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMOTA, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種感光性樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體元件之製造方法及半導體元件，前述感光性樹脂組成物包含選自由聚醯亞胺前驅物及聚醯亞胺組成之群組中之至少1種樹脂及感光劑，並且滿足下述（i）～（v）：（i）波長365nm的透射率為20%以上，（ii）膜溶解速度為0.8μm/秒鐘以下，（iii）前述樹脂的乙烯性不飽和基值為2.3mmol/g以下，（iv）硬化物的斷裂伸長率為60%以上，（v）硬化物的楊氏模數為3.5GPa以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1813" publication-number="202614999">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614999</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136853</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>促進關節健康的仿II型膠原蛋白胺基酸組合物及植物萃取物的混合物及其用途</chinese-title>
        <english-title>A MIXTURE OF TYPE II COLLAGEN-MIMICKING AMINO ACID COMPOSITIONS AND PLANT EXTRACTS FOR PROMOTING JOINT HEALTH AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">A61K31/198</main-classification>
        <further-classification edition="200601120260108B">A61K36/185</further-classification>
        <further-classification edition="200601120260108B">A61K36/9068</further-classification>
        <further-classification edition="200601120260108B">A61P19/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大江生醫股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TCI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林詠翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUNG-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王玉玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YU-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政大</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及胺基酸組合物及植物萃取物混合物及其用途，還涉及包含該胺基酸組合物及植物萃取物體的關節保健的混合物。本發明的組合物和/或混合物可增加骨質硬度、預防炎症反應、緩解關節疼痛和/或提升關節靈活度，從而為骨骼與關節健康提供系統性支援。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a mixture comprising amino acids compositions and plant extracts and their uses. It further relates to joint health mixture containing said amino acids compositions and plant extracts. The compositions and/or mixture of the invention can increase bone hardness, prevent inflammatory responses, relieve joint pain, and/or improve joint flexibility, thereby providing systemic support for bone and joint health.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1814" publication-number="202616542">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616542</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136872</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於加工的加工裝置、用於在加工期間的識別故障的方法、及用於加工的方法</chinese-title>
        <english-title>MACHINING DEVICE FOR MACHINING, METHOD FOR RECOGNIZING FAULTS DURING MACHINING, AND METHOD FOR MACHINING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260112B">H01M8/04</main-classification>
        <further-classification edition="201601120260112B">H01M8/1097</further-classification>
        <further-classification edition="200601120260112B">G01B11/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商羅伯特　博世有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROBERT BOSCH GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛拉夫　烏利希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRAF, ULRICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於加工用於電化學電池之基板（12）的加工裝置（10）、一種用於在用於電化學電池之基板（12）之加工期間的識別故障的方法、及一種用於加工用於電化學電池之基板（12）的方法。提出了藉助於監測單元（18）來偵測在該基板（12）之該加工期間的該基板（12）之變形。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a machining device (10) for machining a substrate (12) for an electrochemical cell, a method for recognizing faults during the machining of a substrate (12) for an electrochemical cell, and a method for machining a substrate (12) for an electrochemical cell. It is proposed to detect a deformation of the substrate (12) during the machining of the substrate (12) by means of a monitoring unit (18).</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:加工裝置</p>
        <p type="p">12:基板</p>
        <p type="p">14:加工單元</p>
        <p type="p">16:固持器</p>
        <p type="p">18:監測單元</p>
        <p type="p">20:曲率</p>
        <p type="p">22:雷射脈衝</p>
        <p type="p">24:感測器單元</p>
        <p type="p">26:三角量測感測器</p>
        <p type="p">28:控制單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1815" publication-number="202615853">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615853</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136888</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>針對帶電粒子顯微鏡學影像的以文字為條件的異常檢測</chinese-title>
        <english-title>TEXT-CONDITIONED ANOMALY DETECTION FOR CHARGED-PARTICLE MICROSCOPY IMAGES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120251231B">G01N23/2251</main-classification>
        <further-classification edition="202001120251231B">G06F40/30</further-classification>
        <further-classification edition="202201120251231B">G06V10/98</further-classification>
        <further-classification edition="200601120251231B">G06N3/02</further-classification>
        <further-classification edition="202201120251231B">G06V10/82</further-classification>
        <further-classification edition="202201120251231B">G06V10/771</further-classification>
        <further-classification edition="200601120251231B">H01L21/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＦＥＩ公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FEI COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格爾茨　雷姆科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GEURTS, REMCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波托切克　帕維爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POTOCEK, PAVEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CZ</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了用於促進針對帶電粒子顯微鏡學影像的以文字為條件的異常檢測的系統/技術。在各種實施例中，一系統可存取由一帶電粒子顯微鏡擷取的一影像，其中該影像描繪一樣品；在各種態樣中，該系統可基於饋送該影像及一文字提示兩者至一大型語言模型來定位該樣品的一感興趣結構的一或多個離群例示。在各種例子中，該文字提示可包含在語義上定義或描述該一或多個離群例示的一或多個句子或句子片段。在各種情況中，依該一或多個離群例示相對於該感興趣結構的其他例示的大小、形狀、距離、配置、或強度，該一或多個句子或句子片段可在語義上定義或描述該一或多個離群例示。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems/techniques are provided for facilitating text-conditioned anomaly detection for charged-particle microscopy images. In various embodiments, a system can access an image captured by a charged-particle microscope, wherein the image depicts a specimen. In various aspects, the system can localize one or more outlying instantiations of a structure of interest of the specimen, based on feeding both the image and a text prompt to a large language model. In various instances, the text prompt can comprise one or more sentences or sentence fragments that semantically define or describe the one or more outlying instantiations. In various cases, the one or more sentences or sentence fragments can semantically define or describe the one or more outlying instantiations in terms of their sizes, shapes, distances, arrangements, or intensities with respect to other instantiations of the structure of interest.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:科學儀器模組</p>
        <p type="p">104:第一邏輯</p>
        <p type="p">106:第二邏輯</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1816" publication-number="202615618">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615618</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136923</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置的製造方法</chinese-title>
        <english-title>METHOD FOR MANUFACTURING ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260102B">C09J7/35</main-classification>
        <further-classification edition="200601120260102B">C09J11/06</further-classification>
        <further-classification edition="200601120260102B">H01L21/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學艾喜緹瑪蒂莉亞股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS ICT MATERIA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三浦徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIURA, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置的製造方法，包含：準備結構體（100）的步驟，所述結構體（100）包含黏著性膜（10）、加工對象物（20）及支撐構件（30），所述黏著性膜（10）包括基材層（A）、黏著性樹脂層（B）、及黏著性樹脂層（C），所述加工對象物（20）暫時固定於所述黏著性樹脂層（B），所述支撐構件（30）暫時固定於所述黏著性樹脂層（C）；以及對暫時固定於所述黏著性樹脂層（B）的所述加工對象物（20）進行加工的步驟，所述基材層（A）位於所述黏著性樹脂層（B）與所述黏著性樹脂層（C）之間，所述黏著性樹脂層（C）包含含有熱硬化性樹脂的熱膨脹性微小球。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for manufacturing an electronic device includes: a step of preparing a structure (100) which includes an adhesive film (10), an object to be processed (20), and a support member (30), the adhesive film including a substrate layer (A), an adhesive resin layer (B), and an adhesive resin layer (C), the object to be processed (20) being temporarily fixed to the adhesive resin layer (B), the support member (30) being temporarily fixed to the adhesive resin layer (C); and a step of processing the object to be processed (20) temporarily fixed to the adhesive resin layer (B), in which the substrate layer (A) is located between the adhesive resin layer (B) and the adhesive resin layer (C), and the adhesive resin layer (C) includes thermally expandable microspheres containing a thermosetting resin.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:黏著性膜</p>
        <p type="p">20:加工對象物</p>
        <p type="p">30:支撐構件</p>
        <p type="p">40:加工後的加工對象物</p>
        <p type="p">100:結構體</p>
        <p type="p">A:基材層</p>
        <p type="p">B:黏著性樹脂層</p>
        <p type="p">C:黏著性樹脂層</p>
        <p type="p">Y1:步驟</p>
        <p type="p">Y2:步驟</p>
        <p type="p">Y3:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1817" publication-number="202616632">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616632</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136933</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>AC-AC轉換器及電源供應系統</chinese-title>
        <english-title>AC-AC CONVERTER AND POWER SUPPLY SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H02M5/04</main-classification>
        <further-classification edition="200601120260102B">H02M5/293</further-classification>
        <further-classification edition="200601120260102B">H02M1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李海國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, HAIGUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　汝錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, RUXI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>包　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARBOSA, PETER MANTOVANELLI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱　立志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, CHARLES LIZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊政璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHENG-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種AC-AC轉換器及電源供應系統。本案的AC-AC轉換器包括具有兩個子端子的第一交流端子、具有三個子端子的第二交流端子以及具有兩個開關組件的第一橋臂。AC-AC轉換器於二線及三線之間接收並轉換輸入電能。兩個開關組件啟動並且實現雙向電能流動。兩個開關組件作為電壓電源運作以同時支援平衡與不平衡負載，也同時支援有功功率與無功功率。此外，本案的AC-AC轉換器具有降低重量、體積及成本的優點，且提升轉換效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An AC-AC converter and a power supply system are provided. The AC-AC converter of the present disclosure includes a first AC terminal with two sub terminals, a second AC terminal with three sub terminals, and a first bridge arm with two switch assemblies. The AC-AC converter receives and converts the input power between two wires and three wires. The two switch assemblies are activated, so that bidirectional power flow is allowed. The two switch assemblies are performed as a voltage source for supporting both balanced and unbalanced loads. Both active and reactive power are also supported. Moreover, the AC-AC converter of the present disclosure has the advantages of reducing weight, size and cost, and enhancing conversion efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:AC-AC轉換器</p>
        <p type="p">2:第一交流端子</p>
        <p type="p">21:第一子端子</p>
        <p type="p">22:第二子端子</p>
        <p type="p">3:第二交流端子</p>
        <p type="p">31:第三子端子</p>
        <p type="p">32:第四子端子</p>
        <p type="p">33:第五子端子</p>
        <p type="p">4:第一橋臂</p>
        <p type="p">41:第一開關組件</p>
        <p type="p">42:第二開關組件</p>
        <p type="p">5:第二橋臂</p>
        <p type="p">C1:第一電容器</p>
        <p type="p">C2:第二電容器</p>
        <p type="p">L1:第一電感器</p>
        <p type="p">S1:第一開關</p>
        <p type="p">S2:第二開關</p>
        <p type="p">S3:第三開關</p>
        <p type="p">S4:第四開關</p>
        <p type="p">A:連接節點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1818" publication-number="202616520">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616520</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136977</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路和半導體裝置</chinese-title>
        <english-title>AN INTEGRATED CIRCUIT AND A SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251110B">H01L23/538</main-classification>
        <further-classification edition="200601120251110B">G06F13/10</further-classification>
        <further-classification edition="200601120251110B">G06F13/14</further-classification>
        <further-classification edition="201801120251110B">G06F9/44</further-classification>
        <further-classification edition="202301120251110B">H10B80/00</further-classification>
        <further-classification edition="202501120251110B">H10D88/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬爾　阿爾溫德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, ARVIND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬希卡爾　馬赫什Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMASHIKAR, MAHESH K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納拉馬爾普　安基雷迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NALAMALPU, ANKIREDDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種積體電路包括主控晶粒、基底晶粒和至少兩個高頻寬記憶體（HBM）堆疊，其均位於中介層上。主控晶粒包含多個處理器，該至少兩個HBM堆疊位於基底晶粒上並通過基底晶粒和中介層與主控晶粒進行通信。該至少兩個HBM堆疊和主控晶粒排列成一行，其中，主控晶粒位於該行的一端。該積體電路還包括計算電路，用於接收來自該至少兩個HBM堆疊的資料並執行從該主控晶粒接收的指令。位於該基底晶粒上的該計算電路的至少一部分介於該至少兩個HBM堆疊之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated circuit includes a host die, a base die and at least two high-bandwidth memory (HBM) stacks, all of which are disposed on an interposer. The host die includes multiple processors, and the at least two high-bandwidth memory (HBM) stacks that are disposed on the base die and communicate with the host die through the base die and the interposer. The at least two HBM stacks and the host die are arranged in a row with the host die at one end of the row. The integrated circuit further includes compute circuitry to receive data from one or both of the HBM stacks and to execute instructions received from the host die. At least a portion of the compute circuitry is disposed on the base die between the two HBM stacks.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:基底晶粒</p>
        <p type="p">130:主控晶粒</p>
        <p type="p">610:eHBM PHY介面電路</p>
        <p type="p">620:eHBM控制器</p>
        <p type="p">630:CHI/AXI</p>
        <p type="p">680:主處理器</p>
        <p type="p">670:複用器(Mux)</p>
        <p type="p">640:HBM TSV PHY電路</p>
        <p type="p">650,1150:IP模組</p>
        <p type="p">120:HBM堆疊</p>
        <p type="p">910:計算單元</p>
        <p type="p">X,Y:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1819" publication-number="202616370">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616370</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136989</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及半導體裝置的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251230B">H01L21/28</main-classification>
        <further-classification edition="200601120251230B">H01L21/447</further-classification>
        <further-classification edition="200601120251230B">H01L21/54</further-classification>
        <further-classification edition="200601120251230B">H01L23/535</further-classification>
        <further-classification edition="200601120251230B">H01L23/488</further-classification>
        <further-classification edition="200601120251230B">H01L21/302</further-classification>
        <further-classification edition="200601120251230B">G03F7/20</further-classification>
        <further-classification edition="200601120251230B">H01B3/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商Ｒａｐｉｄｕｓ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAPIDUS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野中敏央</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NONAKA, TOSHIHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是在於實現一種對電極間的微粒夾雜的抗性高，能達成半導體器件與半導體器件或基板的電性連接，且不易發生絕緣層的剝離之半導體器件。  &lt;br/&gt;　　半導體裝置(1)為一種藉由複數的柱狀金屬電極(54)電性連接第一半導體器件(10)與第二半導體器件或配線器件即被連接體(40)之半導體裝置(1)，其中，柱狀金屬電極(54)是至少具有以錫為主成分的層和以銅為主成分的層，且在柱狀金屬電極(54)的周圍配置有機絕緣材料(80)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體裝置</p>
        <p type="p">10:半導體器件</p>
        <p type="p">12:第一基板</p>
        <p type="p">14:第一主面</p>
        <p type="p">16:第一電極</p>
        <p type="p">30:配線器件</p>
        <p type="p">32:第二基板</p>
        <p type="p">34:第二主面</p>
        <p type="p">36:第二電極</p>
        <p type="p">50:連接部</p>
        <p type="p">52:樹脂部</p>
        <p type="p">54:柱狀金屬電極</p>
        <p type="p">56:側面</p>
        <p type="p">61:第一電極部</p>
        <p type="p">62:第二電極部</p>
        <p type="p">63:第三電極部</p>
        <p type="p">1010:軸方向</p>
        <p type="p">1020:主面方向</p>
        <p type="p">D201:配置間距</p>
        <p type="p">D202,D203,D205:長度</p>
        <p type="p">D211:軸方向長度</p>
        <p type="p">D2071:第一外徑尺寸</p>
        <p type="p">D2072:第二外徑尺寸</p>
        <p type="p">D2073:基準外徑尺寸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1820" publication-number="202616521">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616521</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136990</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及半導體裝置的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251230B">H01L23/538</main-classification>
        <further-classification edition="200601120251230B">H01L21/447</further-classification>
        <further-classification edition="200601120251230B">H01L23/488</further-classification>
        <further-classification edition="202501120251230B">H01L21/44</further-classification>
        <further-classification edition="200601120251230B">H01L21/68</further-classification>
        <further-classification edition="200601120251230B">H01B3/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商Ｒａｐｉｄｕｓ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAPIDUS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野中敏央</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NONAKA, TOSHIHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供低接合溫度下可實現高接合強度的半導體裝置(1)。在半導體裝置中(1)，金屬材包含依序形成於有機絕緣材的孔內之銅層及焊料層，且該半導體裝置包含接觸於金屬材並由有機絕緣材形成的樹脂接合部(22)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體裝置</p>
        <p type="p">5A:第1半導體晶片</p>
        <p type="p">5B:第2半導體晶片</p>
        <p type="p">10A:第1半導體晶片本體</p>
        <p type="p">10B:第2半導體晶片本體</p>
        <p type="p">15:中介層</p>
        <p type="p">16:中介層本體</p>
        <p type="p">20:接合部</p>
        <p type="p">21:金屬接合部</p>
        <p type="p">22:樹脂接合部</p>
        <p type="p">30A:第1被壓著層</p>
        <p type="p">30B:第2被壓著層</p>
        <p type="p">34A:第1金屬被壓著部</p>
        <p type="p">34B:第2金屬被壓著部</p>
        <p type="p">36A:第1樹脂被壓著部</p>
        <p type="p">36B:第2樹脂被壓著部</p>
        <p type="p">161:主面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1821" publication-number="202616560">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616560</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137002</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有圓形極化超穎材料的天線罩及天線組件</chinese-title>
        <english-title>RADOME WITH CIRCULARLY POLARIZED METAMATERIAL AND ANTENNA ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01Q1/42</main-classification>
        <further-classification edition="200601120260102B">H01Q1/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>乾坤科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CYNTEC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張繼禾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHI-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出了一種具有圓形極化超穎材料的天線罩，其包含一介電載體，以及一圓形極化超穎材料層附著於該介電載體上或是嵌入該介電載體中並相對於接地是電性浮接。該圓形極化超穎材料層具有複數個以陣列方式排列的X形開口，該些開口露出該介電載體，一第一輻射場型發送經過該圓形極化超穎材料層而產生一第二輻射場型，其較該第一輻射場型具有增強的聚焦特性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a radome incorporating a circularly polarized metamaterial, including a dielectric carrier and a circularly polarized metamaterial layer attached to or embedded into the dielectric carrier and electrically floating with respect to ground. The circularly polarized metamaterial layer includes a plurality of X-shaped openings arranged in an array and exposing the dielectric carrier, and a first radiation pattern transmits through the circularly polarized metamaterial layer, resulting in a second radiation pattern having enhanced focusing characteristics compared to the first radiation pattern.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:天線罩</p>
        <p type="p">101:介電載體</p>
        <p type="p">103:(圓形極化)超穎材料層</p>
        <p type="p">105:(方形)單元</p>
        <p type="p">107:X形開口</p>
        <p type="p">T:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1822" publication-number="202615073">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615073</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137008</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>骨質保健魚骨粉的製造方法及其設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">A61K35/60</main-classification>
        <further-classification edition="200601120251103B">A61K31/593</further-classification>
        <further-classification edition="200601120251103B">A61P19/00</further-classification>
        <further-classification edition="201601120251103B">A23L17/00</further-classification>
        <further-classification edition="201601120251103B">A23L33/15</further-classification>
        <further-classification edition="201601120251103B">A23P10/20</further-classification>
        <further-classification edition="201601120251103B">A23P30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立屏東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王貳瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種骨質保健魚骨粉的製造方法，包含一預備步驟、一混拌步驟、一加熱步驟、一添加步驟及一過篩步驟。該預備步驟是預備以魚骨製成的介質粉，及含維生素D3的基礎粉。該混拌步驟是混合該介質粉及該基礎粉而形成製程料粉。該加熱步驟包括以40~60℃加熱的第一階段及以60~80℃加熱的第二階段。該添加步驟是在該製程料粉添加醋液，使該製程料粉所含鈣質解析出鈣離子。本發明還提供一種用來執行該骨質保健魚骨粉的製造方法的設備，成品含有能幫助鈣質吸收的骨化三醇，並藉由磷酸鈣的磷成分使得血液鈣磷比例較容易趨近平衡，經實驗證實確實能優化骨質生長。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:前處理步驟</p>
        <p type="p">11:預備步驟</p>
        <p type="p">12:混拌步驟</p>
        <p type="p">13:加熱步驟</p>
        <p type="p">14:添加步驟</p>
        <p type="p">141:冷卻子步驟</p>
        <p type="p">142:反應子步驟</p>
        <p type="p">15:過篩步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1823" publication-number="202615499">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615499</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137100</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性組成物、硬化物、光學材料、微透鏡及繞射光學元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F28/02</main-classification>
        <further-classification edition="200601120260102B">C08L41/00</further-classification>
        <further-classification edition="200601120260102B">C08K5/13</further-classification>
        <further-classification edition="200601120260102B">C08K5/3435</further-classification>
        <further-classification edition="200601120260102B">G02B1/04</further-classification>
        <further-classification edition="200601120260102B">G02B3/00</further-classification>
        <further-classification edition="200601120260102B">G02B5/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白岩直澄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRAIWA, NAOZUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>師岡直之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOROOKA, NAOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種硬化性組成物、由該硬化性組成物獲得之硬化物、光學材料、微透鏡及繞射光學元件，該硬化性組成物包含：含有芳香族烴環之硫代（甲基）丙烯酸酯單體；含有哌啶基氧自由基結構之化合物；及酚化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:硬化性組成物</p>
        <p type="p">3:基板</p>
        <p type="p">5:鑄模(模具)</p>
        <p type="p">7:硬化物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1824" publication-number="202615225">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615225</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137104</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>校準程式以及校準方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">B25J9/16</main-classification>
        <further-classification edition="200601120251201B">B25J9/10</further-classification>
        <further-classification edition="200601120251201B">B25J19/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畑中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATANAKA, KOKORO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種機器人系統的校準程式，機器人系統包括機器人、具有中心軸的工具，以及可以檢測光束是否被阻斷的感測器；校準程式使電腦執行下列操作：取得與光束接觸的工具前端的第一座標、第二座標以及第三座標；計算將第一座標、第二座標以及第三座標校正後的第一校正座標、第二校正座標以及第三校正座標，並設定以第一校正座標為原點且一軸配置在光束上的感測器座標系；取得對於前端在第一校正座標時的工具，以光束為軸以及以中心軸為軸的角度不同之工具前端的第四座標以及第五座標；以及根據第一校正座標、第四座標以及第五座標，計算前端的位置與原點之間的偏差。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:機器人</p>
        <p type="p">11:基座</p>
        <p type="p">12:旋轉機身</p>
        <p type="p">13:第一機械臂</p>
        <p type="p">14:第二機械臂</p>
        <p type="p">15:手腕元件</p>
        <p type="p">15f:面板</p>
        <p type="p">20:控制裝置</p>
        <p type="p">21:記憶體</p>
        <p type="p">22:處理器</p>
        <p type="p">30:感測器</p>
        <p type="p">31:照射部</p>
        <p type="p">32:光束</p>
        <p type="p">33:受光部</p>
        <p type="p">35:設置部</p>
        <p type="p">100:機器人系統</p>
        <p type="p">C1:機器人座標系</p>
        <p type="p">C2:法蘭座標系</p>
        <p type="p">F:地面</p>
        <p type="p">J1:第一軸線</p>
        <p type="p">J2:第二軸線</p>
        <p type="p">J3:第三軸線</p>
        <p type="p">J4:第四軸線</p>
        <p type="p">J5:第五軸線</p>
        <p type="p">J6:第六軸線</p>
        <p type="p">T:工具</p>
        <p type="p">Tb:本體</p>
        <p type="p">Tp:前端</p>
        <p type="p">Ts:固定部</p>
        <p type="p">X:X軸</p>
        <p type="p">Y:Y軸</p>
        <p type="p">Z:Z軸</p>
        <p type="p">L:中心軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1825" publication-number="202615788">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615788</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137125</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於提供雙重安全性的備用旋轉接頭</chinese-title>
        <english-title>BACKUP SWIVEL FOR PROVIDING DOUBLE SAFETY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">F16G11/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商思凱洛塔克有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SKYLOTEC GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬恩　多梅納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAHNE, DOMEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科蒂奇　克萊門</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COTIC, KLEMEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施陶特　米哈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STAUT, MIHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SI</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡侑芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關於一種用於提供雙重安全性的備用旋轉接頭，其包括一第一連接圓筒，其被配置為穿過至少一主繩索及/或一主旋轉接頭；一第二連接圓筒，其被配置為穿過該至少一主繩索及/或該主旋轉接頭；一第一支架，其被配置為連接至少一第一備用繩索及/或至少一第一備用扣環；以及一第二支架，其被配置為連接至少一第二備用繩索及/或至少一第二備用扣環；其中，該第一連接圓筒與該第二連接圓筒以可旋轉的方式彼此連接，該第一連接圓筒至少部分徑向地配置於該第二連接圓筒之內，且該第一支架可旋轉地連接於該第一連接圓筒，該第二支架可旋轉地連接於該第二連接圓筒。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a backup swivel for providing double safety, comprising a first connecting cylinder configured for passing through at least one main rope and/or a main swivel, a second connecting cylinder configured for passing through the at least one main rope and/or the main swivel, a first bracket configured for connecting at least one first backup rope and/or at least one first backup carabiner and a second bracket configured for connecting at least one second backup rope and/or at least one second backup carabiner, whereby the first connecting cylinder and the second connecting cylinder are attached together in a twistable manner, the first connecting cylinder is radially at least partly arranged within the second connecting cylinder, and the first bracket is swiveling attached to the first connecting cylinder and the second bracket is swiveling attached to the second connecting cylinder.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一連接環、第一連接圓筒</p>
        <p type="p">2:第二連接環、第二連接圓筒</p>
        <p type="p">3:第一支架</p>
        <p type="p">4:第二支架</p>
        <p type="p">5:鉚釘</p>
        <p type="p">6:鉚釘</p>
        <p type="p">7:軸承</p>
        <p type="p">8:環箍</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1826" publication-number="202616758">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616758</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137157</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無線通信方法及裝置</chinese-title>
        <english-title>WIRELESS COMMUNICATION METHOD AND DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">H04W72/04</main-classification>
        <further-classification edition="202301120260102B">H04W72/0453</further-classification>
        <further-classification edition="200601120260102B">H04L5/00</further-classification>
        <further-classification edition="202301120260102B">H04W72/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴逸翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YI-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家鳴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張正義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHENG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂　開穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, KAI YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種無線通信方法包括：在第一時間段內，傳輸佔用第一頻率分段的第一物理層協議資料單元（PPDU）；以及，在第二時間段內，傳輸佔用第二頻率分段的第二PPDU。該第一時間段與該第二時間段重疊，且該第一頻率分段不與該第二頻率分段重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wireless communication method includes: during a first period, transmitting a first physical layer protocol data unit (PPDU) that occupies a first frequency segment; and during a second period, transmitting a second PPDU that occupies a second frequency segment. The first period overlaps the second period, and the first frequency segment does not overlap the second frequency segment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:APPDU</p>
        <p type="p">202_1,202_2,...,202_M-1,202_M:PPDU</p>
        <p type="p">FS_1,FS_2,...,FS_M-1,FS_M:頻率分段</p>
        <p type="p">P_1,P_2,...,P_M-1,P_M:時間段</p>
        <p type="p">CBW&lt;sub&gt;AP&lt;/sub&gt;:AP的信道頻寬</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1827" publication-number="202615321">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615321</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137162</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理系統</chinese-title>
        <english-title>SYSTEM OF PROCESSING SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">B65G49/07</main-classification>
        <further-classification edition="200601120260107B">H01L21/677</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沼倉雅博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUMAKURA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豊卷俊明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOMAKI, TOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝瀬精一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAISE, SEIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武山裕紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEYAMA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於藉由縮短真空處理室內的消耗零件的更換時間，以令基板處理系統的運作效率提高。為了達成上述目的，本發明之基板處理系統具備：常壓搬運室、真空處理室、一個以上的加載互鎖模組、真空搬運室、複數個安裝部、第1搬運機構、第2搬運機構，以及控制部。複數個安裝部，設置於常壓搬運室。可將複數個保管部各自以隨意裝卸的方式安裝於複數個安裝部。控制部，令第1搬運機構以及第2搬運機構同步實行從保管部經由常壓搬運室以及一個以上的加載互鎖模組的其中一個到真空處理室的消耗零件的搬運，與從真空處理室經由真空搬運室以及一個以上的加載互鎖模組的其中另一個的消耗零件的搬運。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system of processing a substrate includes an atmospheric-pressure transfer chamber, at least one vacuum processing chamber, at least two load-lock modules, a vacuum transfer chamber, a plurality of load ports, and a first transfer mechanism and a second transfer mechanism. The load ports are attached to the atmospheric-pressure transfer chamber and detachable containers are mounted on the load ports, respectively. A controller controls the first transfer mechanism and the second transfer mechanism to concurrently transfer a used consumable from the containers to the vacuum processing chamber through the atmospheric-pressure transfer chamber and one of the load-lock modules and to transfer a used consumable from the vacuum processing chamber through the vacuum transfer chamber and another one of the load-lock modules.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S21~S35:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1828" publication-number="202615168">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615168</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137228</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清洗裝置及電子零件的安裝裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251114B">B08B7/00</main-classification>
        <further-classification edition="200601120251114B">B08B11/00</further-classification>
        <further-classification edition="200601120251114B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商芝浦機械電子裝置股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBAURA MECHATRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊池一哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種在不降低節拍時間的情況下效率良好地進行清洗的清洗裝置及電子零件的安裝裝置。實施方式的清洗裝置的特徵在於包括：載台部，供具有作為清洗對象的多個電極列的顯示用面板載置，並在作為所述顯示用面板的搬送方向的第一方向上移動；以及多個清洗部，在與所述第一方向交叉的第二方向上移動，並進行伴隨所述載台部的移動而在所述第一方向上移動的所述顯示用面板上的多個所述電極列的清洗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">12:超音波清洗部</p>
        <p type="p">13:擦拭清洗部</p>
        <p type="p">14:電漿清洗部</p>
        <p type="p">15:支撐部</p>
        <p type="p">16:載台部</p>
        <p type="p">19:控制部</p>
        <p type="p">100:顯示用面板</p>
        <p type="p">121:噴出噴嘴</p>
        <p type="p">122:抽吸噴嘴</p>
        <p type="p">123:殼體</p>
        <p type="p">124:第一Y方向移動機構</p>
        <p type="p">130:第三Y方向移動機構</p>
        <p type="p">131:上按壓頭</p>
        <p type="p">132:下按壓頭</p>
        <p type="p">141:電漿照射管</p>
        <p type="p">142:殼體</p>
        <p type="p">143:第二Y方向移動機構</p>
        <p type="p">161:搬送載台</p>
        <p type="p">162:X方向移動機構</p>
        <p type="p">X、Y、Z:方向/軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1829" publication-number="202615715">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615715</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137229</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於塗佈基材之空間原子層沉積裝置及方法</chinese-title>
        <english-title>SPATIAL ATOMIC LAYER DEPOSITION DEVICE AND A METHOD FOR COATING A SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251110B">C23C16/50</main-classification>
        <further-classification edition="200601120251110B">C23C16/455</further-classification>
        <further-classification edition="200601120251110B">C23C16/52</further-classification>
        <further-classification edition="200601120251110B">H01L21/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商比埃勒阿爾策瑙有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUEHLER ALZENAU GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔庫爾　阿布舍克庫馬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THAKUR, ABHISHEKKUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍洛佩寧　賈尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOLOPAINEN, JANI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明格爾斯　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINGELS, STEPHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾蒂基揚　古魯馬尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARTHIKEYAN, GURUMANI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳展俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於塗佈基材(20)之空間原子層沉積裝置(10)包含一可旋轉轉盤(12)，其具有用於一基材(20)之至少一個收容器(18)，其中該收容器(18)延伸穿過該轉盤(12)，使得配置在該收容器(18)中之一基材(20)可從上方及下方觸及；至少一對氣體處理總成(32, 34)，其中該對氣體處理總成(32, 34)之一第一氣體處理總成(32)配置在該轉盤(12)上方，且該對氣體處理總成(32, 34)之一第二氣體處理總成(34)配置在該轉盤(12)下方，而與該第一氣體處理總成(32)重疊。該至少一對氣體處理總成(32, 34)相對於該轉盤(12)之一旋轉軸配置在與該收容器(18)相同之徑向位置處，藉此形成氣體反應站(26)，且該等氣體處理總成(32, 34)各自包含至少一個氣體入口埠(54, 55)，用於使該基材(20)暴露於該氣體反應站(26)內之氣體。  &lt;br/&gt;進一步地，給出包含此種沉積裝置之一系統及用於塗佈一基材之一方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A spatial atomic layer deposition device (10) for coating substrates (20) comprises a rotatable turntable (12) having at least one receptacle (18) for a substrate (20), wherein the receptacle (18) extends through the turntable (12) such that a substrate (20) arranged in the receptacle (18) is accessible from above and below, at least one pair of gas processing assemblies (32, 34), wherein a first gas processing assembly (32) of the pair of gas processing assemblies (32, 34) is arranged above the turntable (12) and a second gas processing assembly (34) of the pair of gas processing assemblies (32, 34) is arranged below the turntable (12) in overlap with the first gas processing assembly (32). The at least one pair of gas processing assemblies (32, 34) is arranged at the same radial position as the receptacle (18) with respect to a rotation axis of the turntable (12), thereby forming a gas reaction station (26), and the gas processing assemblies (32, 34) each comprise at least one gas inlet port (54, 55) for exposing the substrate (20) with a gas within the gas reaction station (26). &lt;br/&gt;Further, a system comprising such a deposition device and a method for coating a substrate is given.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:沉積裝置</p>
        <p type="p">12:轉盤</p>
        <p type="p">14:支撐軸</p>
        <p type="p">18:收容器</p>
        <p type="p">20:基材</p>
        <p type="p">22:底板</p>
        <p type="p">24:頂板</p>
        <p type="p">26:氣體反應站</p>
        <p type="p">28:電漿反應站</p>
        <p type="p">32:第一氣體處理總成</p>
        <p type="p">34:第二氣體處理總成</p>
        <p type="p">44:第一電漿電極</p>
        <p type="p">46:第二電漿電極</p>
        <p type="p">51:中心氣體噴頭</p>
        <p type="p">52:第一噴頭</p>
        <p type="p">54:第一氣體入口埠；噴頭</p>
        <p type="p">55:第二氣體入口埠</p>
        <p type="p">56:第二噴頭</p>
        <p type="p">57:第一間隙</p>
        <p type="p">58:第二間隙</p>
        <p type="p">59:第三間隙</p>
        <p type="p">60:第四間隙</p>
        <p type="p">61:凹槽</p>
        <p type="p">70:加熱設備</p>
        <p type="p">72:加熱元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1830" publication-number="202616384">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616384</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137246</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿蝕刻方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">H01L21/3065</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北村綾彩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAMURA, AYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田裕樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可在碳材料存在下或氧化矽材料存在下，使用氟化碘且以高蝕刻速度蝕刻矽的電漿蝕刻方法。電漿蝕刻方法係具備蝕刻步驟，該步驟係使用將蝕刻氣體電漿化而得之電漿，在碳材料或氧化矽材料的存在下進行矽的電漿蝕刻。蝕刻氣體係含有氟化碘與含氫化合物，含氫化合物為分子內具有氫原子且分子內不具有氧原子的化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:腔室</p>
        <p type="p">2:下部電極</p>
        <p type="p">3:氟化碘氣體供給部</p>
        <p type="p">4:含氫化合物氣體供給部</p>
        <p type="p">11:蝕刻氣體供給用配管</p>
        <p type="p">12:含氫化合物氣體供給用配管</p>
        <p type="p">13:真空幫浦</p>
        <p type="p">14:壓力計</p>
        <p type="p">15:RF線圈</p>
        <p type="p">16:感測器</p>
        <p type="p">17:分光器</p>
        <p type="p">20:被蝕刻構件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1831" publication-number="202616830">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616830</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137286</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路和半導體裝置</chinese-title>
        <english-title>AN INTEGRATED CIRCUIT AND A SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">H10B80/00</main-classification>
        <further-classification edition="202501120260102B">H10D88/00</further-classification>
        <further-classification edition="200601120260102B">H01L21/768</further-classification>
        <further-classification edition="200601120260102B">H01L23/538</further-classification>
        <further-classification edition="200601120260102B">G11C7/10</further-classification>
        <further-classification edition="200601120260102B">G06F13/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬爾　阿爾溫德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, ARVIND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬希卡爾　馬赫什Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMASHIKAR, MAHESH K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納拉馬爾普　安基雷迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NALAMALPU, ANKIREDDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種積體電路包括主控晶粒、基底晶粒和至少兩個高頻寬記憶體（HBM）堆疊，其均位於中介層上。主控晶粒包含多個處理器，該至少兩個HBM堆疊位於基底晶粒上並通過基底晶粒和中介層與主控晶粒進行通信。該至少兩個HBM堆疊和主控晶粒排列成一行，其中，主控晶粒位於該行的一端。基底晶粒包括控制器電路，用於將來自該至少兩個HBM堆疊的輸出資料複用到主控晶粒，以及，將來自主控晶粒的輸入資料解複用到該至少兩個HBM堆疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated circuit includes a host die, a base die and at least two high-bandwidth memory (HBM) stacks, all of which are disposed on an interposer. The host die includes multiple processors, and the at least two high-bandwidth memory (HBM) stacks that are disposed on the base die and communicate with the host die through the base die and the interposer. The at least two HBM stacks and the host die are arranged in a row with the host die at one end of the row. The base die includes a controller circuit operative to multiplex outgoing data from the at least two HBM stacks to the host die, and demultiplex incoming data from the host die to the at least two HBM stacks.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:集體電路(IC)</p>
        <p type="p">120:HBM堆疊</p>
        <p type="p">125:矽通孔</p>
        <p type="p">122:記憶體晶粒</p>
        <p type="p">126:微凸塊</p>
        <p type="p">110:基底晶粒</p>
        <p type="p">115:PHY介面</p>
        <p type="p">140:中介層</p>
        <p type="p">130:主控晶粒</p>
        <p type="p">150:基板</p>
        <p type="p">X,Y:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1832" publication-number="202616282">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616282</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137293</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鐵電記憶體單元的操作方法及記憶體元件</chinese-title>
        <english-title>OPERATING METHOD FOR FERROELECTRIC MEMORY CELLS AND MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251105B">G11C11/22</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商無錫舜銘存儲科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WUXI SMART MEMORIES TECHNOLOGIES, CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘　鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, KE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>封通</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, TONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種鐵電記憶體單元的操作方法及記憶體元件。該操作方法適用於一組鐵電記憶體單元，包含：將具有第一數值的第一資料位元寫入該一組鐵電記憶體單元中的第一鐵電記憶體單元；將具有第一數值的符號位元寫入該一組鐵電記憶體單元的第二鐵電記憶體單元；接收一讀取操作請求或一寫入操作請求；自該第二鐵電記憶體單元中讀取該符號位元；響應於該符號位元具有第二數值，將該第一資料位元由該第二數值反轉為該第一數值，於反轉後自該第一鐵電記憶體單元讀取該第一資料位元的該第一數值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An operating method for ferroelectric memory cells and a memory device are provided. The operating method for a set of ferroelectric memory cells includes: writing a first data bit having a first value to a first ferroelectric memory cell; writing a sign bit having the first value to second ferroelectric memory cell; receiving a read or a write-operation request; reading the sign bit from the second ferroelectric memory cell; in response to the sign bit having a second value, inverting the first data bit from the second value to the first value; and in response to the sign bit having a second value, reading the first data bit with the first value from the first ferroelectric memory cell after the inverting.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:操作方法</p>
        <p type="p">402~412:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1833" publication-number="202615223">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615223</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137305</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>搬送機器人</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251014B">B25J9/02</main-classification>
        <further-classification edition="200601120251014B">H01L21/677</further-classification>
        <further-classification edition="200601120251014B">H01L21/683</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼得科儀器股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIDEC INSTRUMENTS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中江孝郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAE, TAKAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">搬送機器人（1）具有：第一機械手（30），包括夾持工件（W）的外周端部進行保持的卡盤機構（37）；以及第一移動機構（31），使第一機械手（30）移動到能夠保持盒式殼體（2）中收容的工件（W）的前進位置（30A）、及比前進位置（30A）更遠離盒式殼體（2）的後退位置（30B），在將連結後退位置（30B）與前進位置（30A）的方向設為X方向，將從後退位置（30B）朝向前進位置（30A）的方向設為X1方向，將從前進位置（30A）朝向後退位置（30B）的方向設為X2方向的情況下，卡盤機構（37）包括能夠上下開閉的卡盤部（70）、以及使卡盤部（70）沿X方向移動的移動機構（64）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:晶片環</p>
        <p type="p">12:開口部</p>
        <p type="p">13:黏接片</p>
        <p type="p">14A:第一直線部</p>
        <p type="p">15:切口部</p>
        <p type="p">30:第一機械手</p>
        <p type="p">36:第一機械手本體</p>
        <p type="p">37:卡盤機構</p>
        <p type="p">38:第一板</p>
        <p type="p">61:機械手框體</p>
        <p type="p">63:支撐構件</p>
        <p type="p">64:移動機構</p>
        <p type="p">65:開閉機構</p>
        <p type="p">66:杆</p>
        <p type="p">67:氣缸</p>
        <p type="p">68:滑塊</p>
        <p type="p">69:支軸</p>
        <p type="p">70:卡盤部</p>
        <p type="p">70A:把持位置</p>
        <p type="p">71:第一卡盤構件</p>
        <p type="p">72:第二卡盤構件</p>
        <p type="p">76:凸輪銷</p>
        <p type="p">79:彈簧</p>
        <p type="p">W:工件</p>
        <p type="p">X、X1、X2、Y、Y1、Y2:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1834" publication-number="202615543">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615543</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137320</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>絕緣材料與其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08G65/04</main-classification>
        <further-classification edition="200601120260102B">C08L71/02</further-classification>
        <further-classification edition="200601120260102B">C08K3/38</further-classification>
        <further-classification edition="200601120260102B">H01B3/02</further-classification>
        <further-classification edition="200601120260102B">H01B3/42</further-classification>
        <further-classification edition="200601120260102B">H05K1/03</further-classification>
        <further-classification edition="200601120260102B">H05K1/05</further-classification>
        <further-classification edition="200601120260102B">H05K3/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本發條股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NHK SPRING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>手塚真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEZUKA, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河上岳志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAKAMI, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丸市俊明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARUICHI, TOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">此絕緣材料包含：於各重複單元具有含液晶原側鏈的交聯之聚環氧乙烷。交聯之聚環氧乙烷滿足以下式（I）與（II）。a、b、c分別係在30℃、100℃、260℃下的前述交聯之聚環氧乙烷的儲存彈性模數。絕緣材料亦可由交聯之聚環氧乙烷而成。&lt;br/&gt;&lt;img align="absmiddle" height="177px" width="849px" file="ed10001.jpg" alt="ed10001.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1835" publication-number="202616869">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616869</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137329</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置、包括半導體裝置之電子設備及製造半導體裝置之方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE, ELECTRONIC APPARATUS INCLUDING SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260102B">H10D62/10</main-classification>
        <further-classification edition="202501120260102B">H10D62/80</further-classification>
        <further-classification edition="202501120260102B">H10D64/20</further-classification>
        <further-classification edition="200601120260102B">H01L21/762</further-classification>
        <further-classification edition="200601120260102B">H01L21/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金昌炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, CHANGHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁溵之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, EUNJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李殷奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, EUNKYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置包括：一通道，其包括一二維半導體材料；一源極電極及一汲極電極，其分別電氣連接至該通道之兩端；一二維材料氧化物層，其位於該通道上；一偶極氧化物層，其位於該二維材料氧化物層上；一介電層，其位於該偶極氧化物層上；以及一閘極電極，其位於該介電層上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a channel including a two-dimensional semiconductor material, a source electrode and a drain electrode electrically connected to both ends of the channel, respectively, a two-dimensional material oxide layer on the channel, a dipole oxide layer on the two-dimensional material oxide layer, a dielectric layer on the dipole oxide layer, and a gate electrode on the dielectric layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">120:通道</p>
        <p type="p">130:二維材料氧化物層</p>
        <p type="p">135:偶極氧化物層</p>
        <p type="p">140:介電層</p>
        <p type="p">160:閘極電極</p>
        <p type="p">D:汲極電極</p>
        <p type="p">GI:閘極絕緣層</p>
        <p type="p">S:源極電極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1836" publication-number="202616143">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616143</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137330</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>執行加速程序以加速大型語言模型推理過程的方法</chinese-title>
        <english-title>METHOD FOR PERFORMING ACCELERATION PROCEDURE TO ACCELERATE INFERENCE PROCEDURE OF LARGE LANGUAGE MODEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">G06N3/045</main-classification>
        <further-classification edition="202301120260102B">G06N3/044</further-classification>
        <further-classification edition="200601120260102B">G06F9/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘岳廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, YUE-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李懷霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, HUAI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡一民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YI-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃雅琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YA-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, I-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種執行加速程序以加速大型語言模型（LLM）推理過程的方法，包括： 執行第一草稿程序以生成多個第一草稿標記； 根據與該多個第一草稿標記相關的第一草稿資訊，確定第一規則是否滿足以生成第一確定結果，其中該第一規則對應於該第一加速程序； 響應於該第一確定結果指示不滿足該第一規則，執行第二草稿程序以生成多個第二草稿標記； 至少基於該多個第二草稿標記獲得多個正式草稿標記； 將該多個正式草稿標記輸入至該 LLM以生成多個目標標記；以及對該多個正式草稿標記和該多個目標標記執行匹配操作以生成該 LLM的至少一個輸出標記。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for performing an acceleration procedure to accelerate an inference procedure of a large language model (LLM) includes: performing a first drafting procedure to generate multiple first draft tokens; according to first draft information related to the multiple first draft tokens, determining whether a first rule is met to generate a first determination result, wherein the first rule corresponds to the first acceleration procedure; in response to the first determination result indicating that the first rule is not met, performing a second drafting procedure to generate multiple second draft tokens; obtaining multiple formal draft tokens at least based on the multiple second draft tokens; inputting the multiple formal draft tokens to the LLM in order to generate multiple target tokens; and performing a matching operation upon the multiple formal draft tokens and the multiple target tokens to generate at least one output tokens of the LLM.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S400,S402,S404,S406,S408,S410,S412:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1837" publication-number="202615368">
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      <volno>24</volno>
      <isuno>8</isuno>
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          <doc-number>202615368</doc-number>
        </document-id>
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        <document-id>
          <doc-number>114137334</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>有孔玻璃基板、玻璃基板、玻璃基板及有孔玻璃基板的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C03C3/118</main-classification>
        <further-classification edition="200601120260102B">C03C3/093</further-classification>
        <further-classification edition="200601120260102B">C03C23/00</further-classification>
        <further-classification edition="200601120260102B">C03C15/00</further-classification>
        <further-classification edition="200601120260102B">H05K1/02</further-classification>
        <further-classification edition="200601120260102B">H05K1/11</further-classification>
        <further-classification edition="200601120260102B">H05K3/40</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本電氣硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON ELECTRIC GLASS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牧田雅貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKITA, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木良太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>市丸智憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHIMARU, TOMONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉川有太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKKAWA, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種對於形成接近直孔形狀的貫通孔而言適宜、生產性優異、且於安裝半導體元件時難以產生基板的變形的有孔玻璃基板、玻璃基板及有孔玻璃基板的製造方法。本發明的有孔玻璃基板G包括：第一主表面G1、作為第一主表面G1的相反面的第二主表面G2、以及貫通第一主表面G1與第二主表面G2之間的貫通孔1，所述有孔玻璃基板G中，作為玻璃組成，以莫耳%計含有SiO&lt;sub&gt;2&lt;/sub&gt; 65.0%～85.0%、Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; 0%～10.0%、B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; 0.1%～25.0%、Li&lt;sub&gt;2&lt;/sub&gt;O 0%～5.0%、Na&lt;sub&gt;2&lt;/sub&gt;O 0%～20.0%、K&lt;sub&gt;2&lt;/sub&gt;O 0%～20.0%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1838" publication-number="202616054">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616054</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137348</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於擴展實境（ＸＲ）媒體通訊對話之臉部及身體追蹤ＡＰＩ</chinese-title>
        <english-title>FACE AND BODY TRACKING API FOR EXTENDED REALITY (XR) MEDIA COMMUNICATION SESSIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G06F3/01</main-classification>
        <further-classification edition="201101120260102B">G06T19/00</further-classification>
        <further-classification edition="202201120260102B">G06V40/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堡爾吉吉　依梅德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOUAZIZI, IMED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>隆　尼可　康德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEUNG, NIKOLAI KONRAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史塔克漢莫　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STOCKHAMMER, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於傳達擴增實境(augmented reality, AR)媒體資料之實例裝置包括：一記憶體，其經組態以儲存AR媒體資料；及一處理系統，其以電路系統實施且經組態以：叫用一應用程式介面(application programming interface, API)的一功能以判定一擴增實境(AR)運行時間之一或多個支援的追蹤方案；將代表該一或多個支援的追蹤方案之資料發送至一接收裝置，與該接收裝置將執行一AR媒體通訊對話；從該接收裝置接收代表該一或多個支援的追蹤方案之一經選擇者的資料；使用該一或多個支援的追蹤方案之該經選擇者以該AR運行時間建立一追蹤對話；及將表示符合該一或多個支援的追蹤方案之該經選擇者的追蹤資訊之一動畫串流發送至該接收裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An example device for communicating augmented reality (AR) media data includes: a memory configured to store AR media data; and a processing system implemented in circuitry and configured to: invoke a function of an application programming interface (API) to determine one or more supported tracking schemes of an augmented reality (AR) runtime; send data representative of the one or more supported tracking schemes to a receiving device with which an AR media communication session is to be performed; receive, from the receiving device, data representative of a selected one of the one or more supported tracking schemes; create a tracking session with the AR runtime using the selected one of the one or more supported tracking schemes; and send an animation stream representing tracking information conforming to the selected one of the one or more supported tracking schemes to the receiving device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300,302,304,306,308,310,312,314,316,318:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1839" publication-number="202614990">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614990</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137355</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>延長膠、製備方法及其應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251104B">A61K8/87</main-classification>
        <further-classification edition="200601120251104B">A61K8/25</further-classification>
        <further-classification edition="200601120251104B">A61Q3/02</further-classification>
        <further-classification edition="200601120251104B">C08F2/48</further-classification>
        <further-classification edition="200601120251104B">C09D175/14</further-classification>
        <further-classification edition="201801120251104B">C09D7/61</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海飛凱材料科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋述國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝煒勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種延長膠、製備方法及其應用，屬於美甲技術領域。本申請提供的延長膠包括脂肪族聚氨酯丙烯酸酯、改性環氧丙烯酸酯和氣相二氧化矽，氣相二氧化矽為納米級填料，其折射率較低，與脂肪族聚氨酯丙烯酸酯和改性環氧丙烯酸酯的折射率相近，光在穿透過程中的反射和折射對透明度影響較小，因此，延長膠具有更高的透明度。並且，氣相二氧化矽還可以增強延長膠的可塑型性，具有定型功能，從而使延長膠省去紙托的複雜做法，簡化工藝。另外，硫醇單體不僅可以促進延長膠在365nm的LED光源固化條件下的表幹，還可以加強樹脂在紫外線照射下的自由基聚合體系的反應性和敏感性，很好地適應加色需求，有利於有色體系的深層固化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">
        </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1840" publication-number="202615740">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615740</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137371</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>中空纖維</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251128B">D01F1/08</main-classification>
        <further-classification edition="200601120251128B">D01F6/62</further-classification>
        <further-classification edition="200601120251128B">D01F8/14</further-classification>
        <further-classification edition="200601120251128B">D01D5/24</further-classification>
        <further-classification edition="202101120251128B">D03D15/37</further-classification>
        <further-classification edition="201201120251128B">D04H3/018</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮内優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAUCHI, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長尾優志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAO, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤貴大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, KIRITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>増田正人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASUDA, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種可在抑制中空壓潰的同時維持中空率、較佳用作衣料用纖維的中空纖維。一種中空纖維，在纖維橫剖面具有兩個以上的中空部，所述中空部的中空率為10＜（A/B）×100＜80，中空部的異形度為1.00＜r&lt;sub&gt;2&lt;/sub&gt;/r&lt;sub&gt;1&lt;/sub&gt;≦2.50，所述異形度的偏差（CV%）≦20.0%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1841" publication-number="202615772">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615772</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137372</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>送風裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251127B">F04D17/14</main-classification>
        <further-classification edition="200601120251127B">F04D19/02</further-classification>
        <further-classification edition="200601120251127B">F04D29/38</further-classification>
        <further-classification edition="200601120251127B">F04D29/40</further-classification>
        <further-classification edition="200601120251127B">F04D29/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼得科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIDEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下雄史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, YUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">送風裝置包括一對葉輪、一對殼體、整流格柵以及保持部。一對葉輪能以中心軸線為中心旋轉，且同軸地配置。一對殼體沿中心軸線延伸且形成為筒狀，且軸向的兩端面開口，並分別收納一對葉輪。整流格柵配置在一對葉輪之間，且在與軸向相交的面上排列有多個供氣流流通的管狀的通氣路而構成。保持部由一對殼體夾持，並保持整流格柵的周緣部。整流格柵和保持部由不同構件構成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:殼體</p>
        <p type="p">26:凸緣部</p>
        <p type="p">26a:殼體螺紋孔</p>
        <p type="p">26b:殼體槽部</p>
        <p type="p">30:整流格柵</p>
        <p type="p">40:保持部</p>
        <p type="p">41:夾持構件</p>
        <p type="p">42:支撐部</p>
        <p type="p">42a:內周面</p>
        <p type="p">43:周壁部</p>
        <p type="p">44:夾持螺紋孔</p>
        <p type="p">45:槽部</p>
        <p type="p">101:葉輪</p>
        <p type="p">X1:軸向下側，軸向一方，排氣側</p>
        <p type="p">X2:軸向上側，軸向另一方，進氣側</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1842" publication-number="202616870">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616870</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137426</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括閘極電極的半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICES INCLUDING GATE ELECTRODES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251201B">H10D62/10</main-classification>
        <further-classification edition="202501120251201B">H10D62/13</further-classification>
        <further-classification edition="202501120251201B">H10D64/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓昇煜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, SEUNGUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓珍優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, JINWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜泰逵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, TAEGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種半導體裝置。該裝置包括：主動層，沿第一水平方向延伸，主動層包括沿著第一水平方向依序排列的第一源極/汲極區、通道區、以及第二源極/汲極區；位元線，沿垂直方向延伸並連接至第一源極/汲極區；資訊儲存結構，連接至第二源極/汲極區；閘極電極，環繞主動層並沿與第一水平方向相交的第二水平方向延伸，其中閘極電極包括沿著垂直方向與第一源極/汲極區重疊的第一凹陷區；絕緣圖案，填充第一凹陷區；以及閘極介電層，設置在主動層和閘極電極之間，並環繞主動層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device is provided. The device includes: an active layer extending in a first horizontal direction, the active layer including a first source/drain region, a channel region, and a second source/drain region sequentially arranged along the first horizontal direction; a bit line extending in a vertical direction and connected to the first source/drain region; an information storage structure connected to the second source/drain region; a gate electrode surrounding the active layer and extending in a second horizontal direction intersecting the first horizontal direction, wherein the gate electrode includes a first recessed region overlapping the first source/drain region along the vertical direction; an insulating pattern filling the first recessed region; and a gate dielectric layer provided between the active layer and the gate electrode, and surrounding the active layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體裝置</p>
        <p type="p">5:基底</p>
        <p type="p">10:主動層</p>
        <p type="p">20:閘極電極</p>
        <p type="p">21:絕緣圖案</p>
        <p type="p">22:閘極介電層/堆疊結構</p>
        <p type="p">26:層間絕緣層/堆疊結構</p>
        <p type="p">30:垂直導電圖案</p>
        <p type="p">40:電容器結構</p>
        <p type="p">42:第一電極</p>
        <p type="p">44:電容器介電質</p>
        <p type="p">46:第二電極</p>
        <p type="p">R1:凹陷區</p>
        <p type="p">X、Y、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1843" publication-number="202616453">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616453</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137442</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>塗布系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251021B">H01L21/677</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商阿耐思特岩田股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANEST IWATA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樋川浩一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIKAWA, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村哲朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, TETSURO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井本龍希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMOTO, RYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之塗布系統具備：塗裝室模組，其包含塗裝室框架及塗裝機器人，塗裝室框架係定義執行與塗裝相關之第1塗裝相關動作之第1塗裝處理空間的框構件，塗裝機器人配置於第1塗裝處理空間內，執行第1塗裝相關動作；及第1移載室模組，其包含第1移載室框架及第1移載機器人，第1移載室框架係定義搬送作業空間之框構件，第1移載機器人配置於搬送作業空間內，執行將作為第1塗裝相關動作之對象之工件搬入至第1塗裝處理空間之動作及將工件從第1塗裝相關處理空間搬出之動作中的至少一者。塗裝室框架與第1移載室框架以可裝卸之方式相互連結。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:塗裝系統(塗布系統)</p>
        <p type="p">9:工件(對象物)</p>
        <p type="p">21:裝卸室模組</p>
        <p type="p">22:除塵除靜電室模組(第2塗布模組)</p>
        <p type="p">23:塗裝室模組(第1塗布模組)</p>
        <p type="p">24A:第1乾燥爐模組</p>
        <p type="p">24B:第2乾燥爐模組</p>
        <p type="p">24C:第3乾燥爐模組</p>
        <p type="p">31:第1移載室模組(搬送模組)</p>
        <p type="p">32:第2移載室模組</p>
        <p type="p">41:無塵室模組</p>
        <p type="p">42:供氣裝置室模組</p>
        <p type="p">43:泵室模組</p>
        <p type="p">44:控制盤室模組</p>
        <p type="p">45:設定室模組</p>
        <p type="p">46:塗裝噴房模組(第3塗布模組)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1844" publication-number="202616765">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616765</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137468</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於互動資料傳輸的方法及使用該方法的通信裝置</chinese-title>
        <english-title>METHODS FOR INTERACTIVE DATA TRANSMISSION AND COMMUNICATION DEVICES UTILIZING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260102B">H04W74/08</main-classification>
        <further-classification edition="202401120260102B">H04W74/0816</further-classification>
        <further-classification edition="202301120260102B">H04W72/04</further-classification>
        <further-classification edition="200901120260102B">H04W28/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃舜雍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHUN-YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於互動資料傳輸的方法，包括：確定第一裝置和第二裝置之間互動資料傳輸的持續時間，其中該互動資料傳輸的持續時間涵蓋傳輸第一裝置的第一資料幀所需的時間和傳輸第二裝置的第二資料幀所需的時間；根據該互動資料傳輸的持續時間設置第一幀的持續時間字段；傳輸該第一幀，其中該第一幀是由第一裝置傳輸的發送請求（Request to Send，簡稱 RTS）幀或由第二裝置傳輸的清除發送（Clear to Send，簡稱 CTS）幀；在該互動資料傳輸的持續時間內由第一裝置傳輸該第一資料幀；以及在該互動資料傳輸的持續時間內由第二裝置傳輸該第二資料幀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for interactive data transmission includes determining a duration of an interactive data transmission between a first device and a second device, wherein the duration of the interactive data transmission covers a time required for transmitting a first data frame of the first device and a time required for transmitting a second data frame of the second device; setting a duration field of a first frame based on the duration of the interactive data transmission; transmitting the first frame, wherein the first frame is a Request to Send (RTS) frame transmitted by the first device or a Clear to Send (CTS) frame transmitted by the second device; transmitting the first data frame by the first device within the duration of the interactive data transmission; and transmitting the second data frame by the second device within the duration of the interactive data transmission.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:通信裝置</p>
        <p type="p">110:收發器電路</p>
        <p type="p">120:基頻訊號處理電路</p>
        <p type="p">130:處理器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1845" publication-number="202615283">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615283</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137500</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>兒童載具</chinese-title>
        <english-title>CHILD CARRIER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251009B">B62B7/06</main-classification>
        <further-classification edition="200601120251009B">B62B9/12</further-classification>
        <further-classification edition="200601120251009B">A47D13/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商寶鉅瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAMBINO PREZIOSO SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾海波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, HAIBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提出一種兒童載具（1），所述兒童載具（1）包括：車架（100），其包括至少兩個卡合件（142、143）；以及支撐板（150），其包括至少兩個卡合部（152、153），所述卡合件（142、143）能分別與所述卡合部（152、153）卡合，以使得所述支撐板（150）與所述車架（100）能拆卸地卡合，其中，所述至少兩個卡合件（142、143）包括一鎖定件（142）和一定位件（143），所述至少兩個卡合部（152、153）包括一鎖定件容置部（153）和一定位件容置部（152）；所述定位件（143）可樞轉地卡合於所述定位件容置部（152），以使得所述支撐板（150）能夠相對於所述車架（100）在使用位置和收藏位置之間樞轉；當所述支撐板（150）位於所述使用位置時，所述鎖定件（142）卡合於鎖定件容置部（153），以阻止所述定位件（143）能夠脫離所述定位件容置部（152）；當所述支撐板（150）位於所述收藏位置時，所述鎖定件（142）脫離於鎖定件容置部（153），以使得所述定位件（143）能夠脫離所述定位件容置部（152）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a child carrier (1), the child carrier (1) includes: a frame (100) including at least two engaging members (142, 143); and a support plate (150) including at least two engaging portions (152, 153) respectively engaged with the engaging members (142, 143), to allow the support plate (150) to be detachably engaged with the frame (100), wherein the at least two engaging members (142, 143) include a locking member (142) and a positioning member (143), and the at least two engaging portions (152, 153) include a locking member accommodating portion (153) and a positioning member accommodating portion (152); the positioning member (143) is pivotably engaged with the positioning member accommodating portion (152) to allow the support plate (150) to be pivotable between a use position and a storage position relative to the frame (100); when the support plate (150) is located in the use position, the locking member (142) is engaged with the locking member accommodating portion (153) to prevent the positioning member (143) from being disengaged from the positioning member accommodating portion (152); when the support plate (150) is located in the storage position, the locking member (142) is disengaged from the locking member accommodating portion (153) to allow the positioning member accommodating portion (143) to be disengaged from the positioning member accommodating portion (152).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:兒童載具</p>
        <p type="p">100:車架</p>
        <p type="p">110:前腳架</p>
        <p type="p">120:後腳架</p>
        <p type="p">130:車手</p>
        <p type="p">140:固定座</p>
        <p type="p">150:支撐板</p>
        <p type="p">160:踏板</p>
        <p type="p">170:第一連杆</p>
        <p type="p">180:第二連杆</p>
        <p type="p">200:車輪</p>
        <p type="p">X:前進方向</p>
        <p type="p">Y:橫向方向</p>
        <p type="p">Z:垂直方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1846" publication-number="202616759">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616759</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137521</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種調度方法、系統及裝置</chinese-title>
        <english-title>SCHEDULING METHOD, SYSTEM, AND APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251201B">H04W72/04</main-classification>
        <further-classification edition="200901120251201B">H04W48/06</further-classification>
        <further-classification edition="201301120251201B">H04B10/25</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商華為技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIU, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹劍超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, JIANCHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聶海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIE, HAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種調度方法、系統及裝置，用以提供一種可行的方式來避免空口的隨機退避衝突。該方法包括：控制節點接收N個網路節點分別上報的業務信息，所述業務信息用於指示網路節點需要通過信道傳輸的業務數據的信息，所述N為正整數；所述控制節點根據所述N個網路節點分別上報的業務信息，確定當前調度週期被調度的M個網路節點，所述M為正整數；所述控制節點向所述M個網路節點發送第一調度消息，所述第一調度消息用於指示允許所述M個網路節點競爭信道。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application discloses a scheduling method, system, and apparatus, to provide a feasible manner to avoid a random backoff conflict over an air interface. The method includes: A control node receives service information separately reported by N network nodes, where the service information indicates information about service data that needs to be transmitted by the network node on a channel, and N is a positive integer. The control node determines, based on the service information separately reported by the N network nodes, M network nodes to be scheduled in a current scheduling cycle, where M is a positive integer. The control node sends a first scheduling message to the M network nodes, where the first scheduling message indicates that the M network nodes are allowed to perform channel contention.</p>
      </isu-abst>
      <representative-img>
        <p type="p">601、602、603、604:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1847" publication-number="202616605">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616605</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137562</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251230B">H02J7/10</main-classification>
        <further-classification edition="200601120251230B">H01M10/44</further-classification>
        <further-classification edition="200601120251230B">H01M10/46</further-classification>
        <further-classification edition="202501120251230B">H10D89/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三美電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUMI ELECTRIC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邊敦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹下順司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKESHITA, JUNJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體裝置。半導體裝置具備：第一積體電路，具有第一電源端子、與將從二次電池接受的電壓向外部輸出的外部端子連接的第一電壓端子、與二次電池的負極連接的第二電源端子、與外部端子連接並被輸入或輸出信號的第一信號端子、與第一信號端子電連接的第二信號端子、陽極與第一信號端子連接且陰極與第一電壓端子連接的第一二極體；第二積體電路，具有與二次電池的正極電連接的第三電源端子、將基於由第三電源端子接受的電壓而生成的電源電壓向第一電源端子輸出的第四電源端子、對第二信號端子輸入或輸出信號的第三信號端子，且該第二積體電路控制二次電池的充放電。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電池保護模組</p>
        <p type="p">110:控制IC</p>
        <p type="p">120:保護IC</p>
        <p type="p">200:電池組</p>
        <p type="p">300:二次電池</p>
        <p type="p">B+、B-:外部端子</p>
        <p type="p">BAT:端子</p>
        <p type="p">C1、C2、C3、C4:電容</p>
        <p type="p">CD:寄生二極體</p>
        <p type="p">CH1A、CH1B:端子</p>
        <p type="p">CH2A、CH2B:端子</p>
        <p type="p">CH3A、CH3B:端子</p>
        <p type="p">COUT:充電控制端子</p>
        <p type="p">D1、D2、D3、D4、D5:二極體</p>
        <p type="p">D6、D7、D8、D8A、D9、D10、D11:二極體</p>
        <p type="p">DD:寄生二極體</p>
        <p type="p">DOUT:放電控制端子</p>
        <p type="p">DRV1、DRV2、DRV3:驅動器</p>
        <p type="p">E1、E2:外部端子</p>
        <p type="p">GND1、GND2:接地端子</p>
        <p type="p">IVDD:內部電源線</p>
        <p type="p">P+、P-:外部端子</p>
        <p type="p">R1、R2、R3、R4:電阻</p>
        <p type="p">REG:電源端子</p>
        <p type="p">S1、S2:端子</p>
        <p type="p">SW1、SW2:開關</p>
        <p type="p">TCNT1:控制信號</p>
        <p type="p">TR1、TR2、TR3、TR4、TR5:電晶體</p>
        <p type="p">UVP(V1):低電壓保護電路</p>
        <p type="p">V+:端子</p>
        <p type="p">VDD1、VDD2:電源電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1848" publication-number="202616247">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616247</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137621</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於顯示驅動電路之部分更新方法</chinese-title>
        <english-title>METHOD FOR DISPLAY DRIVER CIRCUIT FOR PARTIAL UPDATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">G09G3/20</main-classification>
        <further-classification edition="200601120260112B">G09G3/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張簡隆宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG CHIEN, LUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於一顯示驅動電路之方法，包含有下列步驟：從一主處理器接收一輸入幀，該輸入幀具有複數個片段；在該複數個片段中偵測一最早水平同步起始封包，其中，該最早水平同步起始封包指示一輸出幀上的一全刷顯示區之最早片段的起始；以及在偵測到該全刷顯示區之最早片段的該最早水平同步起始封包時，更新該輸出幀上的該全刷顯示區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for a display driver circuit includes steps of: receiving an input frame having a plurality of slices from a host processor; detecting the earliest horizontal synchronization start packet in the plurality of slices, wherein the earliest horizontal synchronization start packet indicates a start of the earliest slice of a full refresh display area of an output frame; and updating the full refresh display area of the output frame in response to that the earliest horizontal synchronization start packet of the earliest slice of the full refresh display area is detected.</p>
      </isu-abst>
      <representative-img>
        <p type="p">30:影像傳輸流程</p>
        <p type="p">302~306:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1849" publication-number="202616522">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616522</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137651</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>異質記憶體堆疊</chinese-title>
        <english-title>HETEROGENEOUS MEMORY STACK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">H01L23/538</main-classification>
        <further-classification edition="202301120251103B">H10B80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>補丁科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PIECEMAKERS TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁達剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TING, TAH-KANG JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王明弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MING-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種堆疊式記憶體裝置，包含：一第一記憶體晶粒與一第二記憶體晶粒。該第一記憶體晶粒具有多層結構，每一層包含至少一記憶體單元區與一矽穿孔區，其中該第一記憶體晶粒透過該矽穿孔區內的複數個垂直互連，電性連接至一積體電路裝置。該第二記憶體晶粒設置於該第一記憶體晶粒與該積體電路裝置之間，具有單層結構，該第二記憶體晶粒包含至少一記憶體單元區與一矽穿孔區區，其中該第二記憶體晶粒透過表面接合，電性連接至該積體電路裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A stacked memory device includes a first memory die and a second memory die. The first memory die has multi-layer structure and each of a plurality of layers of the first memory die includes at least a memory cell region and a through-silicon-via (TSV) region. The first memory die is electrically connected to an integrated circuit device through a plurality of vertical interconnects within the TSV region. The second memory die is disposed between the first memory die and the integrated circuit device. The second memory die has single layer structure, and the second memory die includes at least a memory cell region and a TSV region. The second memory die is electrically connected to the integrated circuit device through surface bonding.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:堆疊式記憶體裝置</p>
        <p type="p">110:第一記憶體晶粒</p>
        <p type="p">115:TSV互連</p>
        <p type="p">120:第二記憶體晶粒</p>
        <p type="p">125:表面接合</p>
        <p type="p">130:積體電路裝置</p>
        <p type="p">140:基板</p>
        <p type="p">LS1~LS4:層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1850" publication-number="202616272">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616272</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137657</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>音頻信號處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260102B">G10L21/00</main-classification>
        <further-classification edition="201301120260102B">G10L19/008</further-classification>
        <further-classification edition="200601120260102B">H04S7/00</further-classification>
        <further-classification edition="200601120260102B">H04R5/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商阿爾卑斯阿爾派股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPS ALPINE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仁平一聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIHIRA, KAZUMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹野慶太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANNO, KEITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">課題在於，提供一種在維持音質感的同時實現良好的定位感的“音頻信號處理裝置”。解決方案在於，具備：泛音信號生成部，生成包括將處理對象的音頻信號S的頻率成為k倍後的信號在內的泛音信號AS，k為2以上的整數；左音頻信號生成部，將從該音頻信號S的目標定位位置到收聽者的左耳的頭部傳遞函數與所述音頻信號S進行卷積，生成左音頻信號；右音頻信號生成部，將從所述目標定位位置到收聽者的右耳的頭部傳遞函數與所述音頻信號S進行卷積，生成右音頻信號；左合成部，將所述左音頻信號和所述泛音信號合成，生成左聲道的音頻信號L；以及右合成部，將所述右音頻信號和所述泛音信號合成，生成右聲道的音頻信號R。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:音頻信號處理裝置</p>
        <p type="p">2:音源裝置</p>
        <p type="p">3:左揚聲器</p>
        <p type="p">4:右揚聲器</p>
        <p type="p">11:泛音生成部</p>
        <p type="p">12:頭部傳遞函數卷積部</p>
        <p type="p">13:定位控制部</p>
        <p type="p">14:泛音用放大器</p>
        <p type="p">15:L聲道信號用放大器</p>
        <p type="p">16:R聲道信號用放大器</p>
        <p type="p">17:L聲道用合成器</p>
        <p type="p">18:R聲道用合成器</p>
        <p type="p">19:L聲道用輸出放大器</p>
        <p type="p">20:R聲道用輸出放大器</p>
        <p type="p">121:左耳頭部傳遞函數卷積部</p>
        <p type="p">122:右耳頭部傳遞函數卷積部</p>
        <p type="p">AS:信號</p>
        <p type="p">LHS:音頻信號</p>
        <p type="p">RHS:音頻信號</p>
        <p type="p">L:聲道信號</p>
        <p type="p">S:音頻信號</p>
        <p type="p">R:音頻信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1851" publication-number="202615308">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615308</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137691</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蓋組件及帶蓋容器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251226B">B65D43/14</main-classification>
        <further-classification edition="200601120251226B">B65D47/08</further-classification>
        <further-classification edition="200601120251226B">B65D47/06</further-classification>
        <further-classification edition="200601120251226B">A47J41/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皇冠金屬工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商膳魔師股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊池章吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許家華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李易撰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種蓋組件，能夠防止口形成部上附著飲料殘留，並且提升清洗性。[解決手段]帽蓋本體8係自容器本體2的上部開口部嵌裝至內側，且在具有其底部形成通液口16的口形成部14。口形成部14具有簷部18，該簷部18沿著通液口16的鉸鏈部9側的開口緣部自口形成部14之內側的底面豎立，並自該豎立位置沿著通液口的上表面突出，以覆蓋通液口16的上表面。在口形成部14的內側的底面E1、E2之中，相較於簷部18的豎起位置更靠鉸鏈部9側的底面E2位於較通液口16更上方，並且在夾著自簷部18的立起位置向鉸鏈部9側延伸的稜線T的兩側的底面E2，設有朝向通液口16且互為相反方向的傾斜部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:蓋組件</p>
        <p type="p">2:容器本體</p>
        <p type="p">2b:本體部</p>
        <p type="p">7a:底構件</p>
        <p type="p">7b:肩構件</p>
        <p type="p">8:帽蓋本體</p>
        <p type="p">9:第一鉸鏈部</p>
        <p type="p">10:蓋體</p>
        <p type="p">11:第二鉸鏈部</p>
        <p type="p">12:手柄構件</p>
        <p type="p">13:外筒構件</p>
        <p type="p">13b:開口部</p>
        <p type="p">14:口形成構件</p>
        <p type="p">14e:密封斜面</p>
        <p type="p">14f:懸伸部</p>
        <p type="p">15:傾注口部</p>
        <p type="p">16:通液口</p>
        <p type="p">17:通氣口</p>
        <p type="p">18:簷部</p>
        <p type="p">22:旋動構件</p>
        <p type="p">22a:連結部</p>
        <p type="p">23:帽蓋構件</p>
        <p type="p">24:栓構件</p>
        <p type="p">25:第二陰螺紋部</p>
        <p type="p">26:第二陽螺紋部</p>
        <p type="p">27:栓襯墊</p>
        <p type="p">27a:摘片</p>
        <p type="p">100:帶蓋容器</p>
        <p type="p">E1:底面(後側內側)</p>
        <p type="p">E2:底面(前側)</p>
        <p type="p">T:稜線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1852" publication-number="202616634">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616634</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137711</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>非隔離型交流調壓電路及其控制方法</chinese-title>
        <english-title>NON-ISOLATED AC VOLTAGE CONVERSION CIRCUIT AND CONTROL METHOD THRREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200701120251103B">H02M7/5387</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王達開</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, DAKAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李海國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, HAIGUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬爾　美莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, MISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱　立志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, CHARLES LIZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>包　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARBOSA, PETER MANTOVANELLI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案為非隔離型交流調壓電路，包含輸入端、輸出端、第一開關橋臂、第二開關橋臂及變壓電路。輸出端包含第一至第三連接端。第一與第二開關橋臂包括依序串接於第一及第三連接端間的第一至第四開關。第一及第二開關相連形成第一節點，第三及第四開關相連形成第二節點。變壓電路包含諧振電路及軟開關電路。諧振電路連接於第一及第二節點之間。軟開關電路包含第四及第五連接端。第四連接端耦接於第一與第二節點的其中之一而第五連接端耦接於第一至第三連接端的其中之一，或第四連接端耦接於諧振電路之主諧振電感而第五連接端耦接於第二連接端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A non-isolated AC voltage conversion circuit is disclosed and includes an input terminal, an output terminal, a first switch bridge arm, a second switch bridge arm and a voltage conversion circuit. The output terminal includes a first connection terminal, a second connection terminal and a third connection terminal. The first switch bridge arm and the second switch bridge arm include a first switch, a second switch, a third switch and a fourth switch sequentially connected in series between the first connection terminal and the third connection terminal. The first switch and the second switch are connected to from a first node, and the third switch and the fourth switch are connected to form a second node. The voltage conversion circuit includes a resonant circuit and a soft switch circuit. The resonant circuit is connected between the first node and the second node. The soft switch circuit includes a fourth connection terminal and a fifth connection terminal. The fourth connection terminal is connected to one of the first node and the second node, and the fifth connection terminal is connected to one of the first connection terminal, the second connection terminal and the third connection terminal. Alternatively, the fourth connection terminal is connected to a main resonant inductor of the resonant circuit, and the fifth connection terminal is connected to the second connection terminal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:非隔離型交流調壓電路</p>
        <p type="p">B1:第一開關橋臂</p>
        <p type="p">B2:第二開關橋臂</p>
        <p type="p">2:變壓電路</p>
        <p type="p">Vin+:正連接端</p>
        <p type="p">Vin-:負連接端</p>
        <p type="p">Vac:交流電壓</p>
        <p type="p">T1:第一連接端</p>
        <p type="p">T2:第二連接端</p>
        <p type="p">T3:第三連接端</p>
        <p type="p">Z1:第一負載</p>
        <p type="p">Z2:第二負載</p>
        <p type="p">Vac1:第一輸出電壓</p>
        <p type="p">Vac2:第二輸出電壓</p>
        <p type="p">SW1:第一開關</p>
        <p type="p">SW2:第二開關</p>
        <p type="p">SW3:第三開關</p>
        <p type="p">SW4:第四開關</p>
        <p type="p">A:第一節點</p>
        <p type="p">B:第二節點</p>
        <p type="p">20:諧振電路</p>
        <p type="p">21:軟開關電路</p>
        <p type="p">211:第四連接端</p>
        <p type="p">212:第五連接端</p>
        <p type="p">L1:第一主諧振電感</p>
        <p type="p">L2:第二主諧振電感</p>
        <p type="p">C1:第一主諧振電容</p>
        <p type="p">C2:第二主諧振電容</p>
        <p type="p">L3:輔諧振電感</p>
        <p type="p">3:控制電路</p>
        <p type="p">G11:第一電晶體開關</p>
        <p type="p">G12:第二電晶體開關</p>
        <p type="p">G21:第三電晶體開關</p>
        <p type="p">G22:第四電晶體開關</p>
        <p type="p">G31:第五電晶體開關</p>
        <p type="p">G32:第六電晶體開關</p>
        <p type="p">G41:第七電晶體開關</p>
        <p type="p">G42:第八電晶體開關</p>
        <p type="p">ILr:主諧振電流</p>
        <p type="p">Is:輔諧振電流</p>
        <p type="p">Ig:輸入電流</p>
        <p type="p">Iz1:第一負載電流</p>
        <p type="p">Iz2:第二負載電流</p>
        <p type="p">4:輸出濾波電路</p>
        <p type="p">Cf1:第一濾波電容</p>
        <p type="p">Cf2:第二濾波電容</p>
        <p type="p">Cf3:第三濾波電容</p>
        <p type="p">Cf4:第四濾波電容</p>
        <p type="p">Lf:輸出濾波電感</p>
        <p type="p">Lin:輸入濾波電感</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1853" publication-number="202616603">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616603</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137730</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於ＤＣ能量儲存系統之自主供應及黑啟動應用的電網形成發電廠控制</chinese-title>
        <english-title>GRID-FORMING PLANT CONTROLS FOR SELF-SUPPLY AND BLACK START APPLICATIONS OF DC ENERGY STORAGE SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H02J3/32</main-classification>
        <further-classification edition="200601120260102B">H02J7/34</further-classification>
        <further-classification edition="200601120260102B">H02J13/00</further-classification>
        <further-classification edition="201601120260102B">H02J5/00</further-classification>
        <further-classification edition="200601120260102B">H02J9/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商富安能源有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLUENCE ENERGY, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿瓦尼蒂斯　揚尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARVANITIS, IOANNIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亨寧格　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HENNINGER, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種發電廠包括一發電廠控制器，其與複數個BESS通訊，且在操作上連接至該複數個BESS。該複數個BESS之各者係由複數個BESS外殼、包括一匯流排耦接器的一匯流排、及複數個BESS斷路器組成。該複數個BESS之各者可經由該複數個BESS斷路器中之一各別者連接至該匯流排，以將電力供應至一電網。該發電廠控制器經配置以控制該匯流排耦接器，以將該複數個BESS分成一第一網路及一第二網路，當該匯流排耦接器處於一開路狀態時，控制該第一網路以一自主供應模式操作該發電廠，且當該匯流排耦接器處於該開路狀態時，控制該第二網路以黑啟動模式操作該發電廠。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power plant includes a plant controller in communication with and operatively connected to a plurality of BESSs. Each of the plurality of BESSs is composed of a plurality of BESS enclosures, a bus bar including a bus coupler, and a plurality of BESS circuit breakers. Each of the plurality of BESSs is connectable via a respective one of the plurality of BESS circuit breakers to the bus bar to supply electric power to an electric grid. The plant controller is arranged to control the bus coupler to separate the plurality of BESSs into a first network and a second network, control the first network to operate the power plant in a self-supply mode when the bus coupler is in an open state, and control the second network to operate the power plant in black-start mode when the bus coupler is in the open state.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1854" publication-number="202615248">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615248</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137823</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學積層體及使用其之影像顯示裝置</chinese-title>
        <english-title>OPTICAL LAMINATE AND IMAGE DISPLAY DEVICE USING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120251211B">B32B7/023</main-classification>
        <further-classification edition="200601120251211B">B32B3/30</further-classification>
        <further-classification edition="200601120251211B">G01N21/45</further-classification>
        <further-classification edition="200601120251211B">G06T3/20</further-classification>
        <further-classification edition="201701120251211B">G06T7/42</further-classification>
        <further-classification edition="200601120251211B">G02F1/1335</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商凸版巴川光學薄膜股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOPPAN TOMOEGAWA OPTICAL FILMS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永井友梨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAI, YURI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤匠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金子大陸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEKO, TAIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學積層體，其特徵為：其係依序積層透明基材、無機微粒的含量為5質量%以上80質量%以下之第一功能層、與具有比前述第一功能層的折射率低之折射率的第二功能層，且在最外表面具有凹凸形狀之光學積層體，並滿足以下的條件(1)及(2)。&lt;br/&gt;  6,000≦A≦40,000   (1)&lt;br/&gt;  50≦B≦800   (2)&lt;br/&gt;  (此處，將計測前述凹凸形狀之三維數據藉由快速傅立葉轉換而算出空間頻率f時，A為：50週期/mm≦f≦100週期/mm的範圍之功率譜強度的平均值；B為：200週期/mm≦f≦250週期/mm的範圍之功率譜強度的平均值)</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:透明基材</p>
        <p type="p">2:第一功能層(防眩層)</p>
        <p type="p">3:第二功能層(低折射率層)</p>
        <p type="p">10:光學積層體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1855" publication-number="202616034">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616034</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137844</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙輸入低壓差電壓調節電路及包括該電路的控制電路</chinese-title>
        <english-title>DUAL-INPUT LOW DROP OUT VOLTAGE REGULATING CIRCUIT AND CONTROLLING CIRCUIT INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G05F1/565</main-classification>
        <further-classification edition="200601120260102B">H02M3/156</further-classification>
        <further-classification edition="200601120260102B">H02M1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商茂力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳暐中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昱輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YU-HUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種雙輸入電壓調節電路，包括第一輸入端、第二輸入端和輸出端。第一輸入端接收第一輸入電壓。第二輸入端接收第二輸入電壓。第一輸入電壓高於第二輸入電壓。輸出端提供穩定的輸出電壓。雙輸入電壓調節電路從第一輸入電壓和第二輸入電壓中的至少一個汲取電力。當調節電壓維持在第一電壓值時，雙輸入電壓調節電路從第一輸入電壓和第二輸入電壓兩者汲取電力。當調節電壓維持在高於第一電壓值的第二電壓值時，雙輸入電壓調節電路從第二輸入電壓汲取電力，而不從第一輸入電壓汲取電力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A dual-input voltage regulating circuit includes a first input terminal a second input terminal, and an output terminal. The first input terminal receives a first input voltage. The second input terminal receives a second input voltage. The first input voltage is higher than the second input voltage. The output terminal provides a regulated output voltage. The dual-input voltage regulating circuit draws power from at least one of the first input voltage and the second input voltage. When the regulated output voltage is maintained at a first voltage value, the dual-input voltage regulating circuit draws power from both the first input voltage and the second input voltage. When the regulated output voltage is maintained at a second voltage value that is higher than the first voltage value, the dual-input voltage regulating circuit draws power from the second input voltage and does not draw power from the first input voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:雙輸入電壓調節電路</p>
        <p type="p">110:第一子電壓調節電路</p>
        <p type="p">120:第二子電壓調節電路</p>
        <p type="p">130:第一輸入端</p>
        <p type="p">140:第二輸入端</p>
        <p type="p">150:輸出端</p>
        <p type="p">AMP1:第一差動放大器</p>
        <p type="p">AMP2:第二差動放大器</p>
        <p type="p">Ildo1:第一LDO電流</p>
        <p type="p">Ildo2:第二LDO電流</p>
        <p type="p">Ireg:輸出電流</p>
        <p type="p">MP1:第一傳輸器件</p>
        <p type="p">MP2:第二傳輸器件</p>
        <p type="p">R1,R2:電阻</p>
        <p type="p">Va1:第一控制訊號</p>
        <p type="p">Va2:第二控制訊號</p>
        <p type="p">Vfb:回饋電壓</p>
        <p type="p">Vin_H:第一輸入電壓</p>
        <p type="p">Vin_L:第二輸入電壓</p>
        <p type="p">Vref1:第一參考電壓</p>
        <p type="p">Vref2:第二參考電壓</p>
        <p type="p">Vreg:調節電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1856" publication-number="202615175">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615175</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137850</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>板坯鑄片的連續鑄造方法及板坯鑄片</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251128B">B22D11/12</main-classification>
        <further-classification edition="200601120251128B">B22D11/124</further-classification>
        <further-classification edition="200601120251128B">B22D11/22</further-classification>
        <further-classification edition="200601120251128B">B22D11/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JFE STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鎌田航平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMADA, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西口範孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIGUCHI, NORITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒牧則親</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAMAKI, NORICHIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>入江脩平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRIE, SHUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川越雅嗣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAGOE, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤翔太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的板坯鑄片的連續鑄造方法中，在配置於在鑄片拔出方向上相對於連續鑄造並自鑄模拔出的板坯鑄片的最終凝固位置為下游側並藉由輥對來輕壓下板坯鑄片的輕壓下帶的扇形段中，對於輥對，使用板坯鑄片的在寬度方向上較三重點更靠外側處的部分所對應的輥部的直徑小於在寬度方向上較三重點更靠內側處所對應的輥部的直徑的凸型輥。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">6:板坯鑄片</p>
        <p type="p">11:軸承構件</p>
        <p type="p">61:上表面</p>
        <p type="p">62:下表面</p>
        <p type="p">63:端面</p>
        <p type="p">71b:第一支撐輥</p>
        <p type="p">72b:第二支撐輥</p>
        <p type="p">711b、721b:大徑輥部</p>
        <p type="p">712b、722b:小徑輥部</p>
        <p type="p">713b、723b:旋轉軸</p>
        <p type="p">d:距離</p>
        <p type="p">Pt:三重點</p>
        <p type="p">W:非接觸部</p>
        <p type="p">Φ1、Φ2:直徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1857" publication-number="202616837">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616837</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137938</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電容器、包括該電容器之半導體裝置及製造該半導體裝置之方法</chinese-title>
        <english-title>CAPACITOR, SEMICONDUCTOR DEVICE INCLUDING THE CAPACITOR, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260102B">H10D1/60</main-classification>
        <further-classification edition="202501120260102B">H10D62/10</further-classification>
        <further-classification edition="202501120260102B">H10D62/40</further-classification>
        <further-classification edition="202501120260102B">H10D62/80</further-classification>
        <further-classification edition="202501120260102B">H10D64/20</further-classification>
        <further-classification edition="202501120260102B">H10D64/60</further-classification>
        <further-classification edition="200601120260102B">H01L21/762</further-classification>
        <further-classification edition="200601120260102B">H01L21/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金海龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HAERYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅炳勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NA, BYUNGHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曺恩愛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, EUNAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種電容器、一種包括該電容器之半導體裝置及一種製造該半導體裝置之方法。該電容器包括一第一電極、與該第一電極相對之一第二電極，以及設置於該第一電極與該第二電極之間且包括一金紅石晶相的一介電層。該第一電極包括一金屬氮化物，且該金屬氮化物包括一5B族元素，或一5B族元素及一4B族元素。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a capacitor, a semiconductor device including the capacitor, and a method of manufacturing the semiconductor device. The capacitor includes a first electrode, a second electrode opposing the first electrode, and a dielectric layer provided between the first electrode and the second electrode and including a rutile crystal phase. The first electrode includes a metal nitride, and the metal nitride includes a Group 5B element, or a Group 5B element and a Group 4B element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電容器</p>
        <p type="p">110:第一電極</p>
        <p type="p">120:第二電極</p>
        <p type="p">130:介電層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1858" publication-number="202616549">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616549</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137961</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>物理二次電池</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120251201B">H01M10/0562</main-classification>
        <further-classification edition="201301120251201B">H01G11/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商維度4科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIMENSION 4 TECH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島潤二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAJIMA, JUNJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長田實</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSADA, MINORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>出川章理</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEGAWA, AKIMICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種物理二次電池（100），其具備：第一電極（10）、第二電極（20）、設置於第一電極（10）與第二電極（20）之間之p型半導體層（30）、設置於p型半導體層（30）與第二電極（20）之間且膜厚較p型半導體層（30）更薄之n型半導體層（80）、以及設置於p型半導體層（30）與n型半導體層（80）之間之介電體層（90），並且，p型半導體層（30）之膜厚為100 nm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一電極</p>
        <p type="p">20:第二電極</p>
        <p type="p">30:p型半導體層</p>
        <p type="p">40:奈米片膜</p>
        <p type="p">41:複合奈米片膜</p>
        <p type="p">80:n型半導體層</p>
        <p type="p">90:介電體層</p>
        <p type="p">100:物理二次電池</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1859" publication-number="202616097">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616097</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137962</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路系統和積體電路系統中記憶體控制器的控制方法</chinese-title>
        <english-title>AN INTEGRATED CIRCUIT SYSTEM AND A CONTROL METHOD OF A MEMORY CONTROLLER IN THE INTEGRATED CIRCUIT SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251204B">G06F13/38</main-classification>
        <further-classification edition="200601120251204B">G06F13/16</further-classification>
        <further-classification edition="200601120251204B">G06F13/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬爾　阿爾溫德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, ARVIND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬希卡爾　馬赫什Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMASHIKAR, MAHESH K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納拉馬爾普　安基雷迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NALAMALPU, ANKIREDDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了積體電路系統中的記憶體控制器，以時鐘頻率在記憶體控制器和記憶體模組之間執行雙向資料傳輸。第一方向的資料傳輸採用第一脈衝幅度調製電平，第二方向的資料傳輸採用第二脈衝幅度調製電平。當接收到第一方向資料傳輸需求增加的指示時，記憶體控制器將第一脈衝幅度調製電平提升至第一方向資料傳輸的目標脈衝幅度調製電平，同時在第二方向保持時鐘頻率和第二脈衝幅度調製電平不變。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory controller in an integrated circuit system performs bi-directional data transfer at a clock frequency between the memory controller and a memory module. The data transfer in a first direction is at a first pulse amplitude modulation (PAM) level and in a second direction at a second PAM level. When receiving an indication of an increased demand for data transfer in the first direction, the memory controller increases the first PAM level to a target PAM level for data transfer in the first direction while maintaining the clock frequency and the second PAM level in the second direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:方法</p>
        <p type="p">610,620,630:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1860" publication-number="202616675">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616675</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137988</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>干擾消除電路、干擾消除電路的操作方法及無線通訊設備</chinese-title>
        <english-title>INTERFERENCE CANCELLATION CIRCUIT, METHOD OF OPERATING AN INTERFERENCE CANCELLATION CIRCUIT AND WIRELESS COMMUNICATION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H04B1/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金大暎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DAEYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兪炫碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, HYUNSEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供干擾消除電路、操作干擾消除電路的方法和無線通訊裝置。干擾消除電路可包括核心產生電路，經組態以基於傳輸訊號產生干擾模型，自適應濾波器，經組態以基於自適應演算法估計干擾模型的係數以產生干擾估計訊號，並從接收訊號中濾除干擾估計訊號以產生干擾消除訊號，以及參數控制（parameter control，PC）電路，經組態以基於傳輸訊號的傳輸訊號資訊產生用於控制自適應演算法的至少一個參數的控制訊號並將控制訊號傳輸到自適應濾波器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An interference cancellation circuit, method of operating an interference cancellation circuit and wireless communication device are provided. The interference cancellation circuit may include a kernel generation circuit configured to generate an interference model based on a transmission signal, an adaptive filter configured to estimate coefficients for the interference model based on an adaptive algorithm to generate an interference estimation signal, and filter out the interference estimation signal from a received signal to generate an interference cancellation signal, and a parameter control (PC) circuit configured to generate a control signal for controlling at least one parameter of the adaptive algorithm based on transmission signal information of the transmission signal and transmit the control signal to the adaptive filter.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100、S110、S120、S130:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1861" publication-number="202614924">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614924</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138000</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智能鳥類驅逐方法與系統</chinese-title>
        <english-title>INTELLIGENT BIRD DETERRENCE METHOD AND SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120251231B">A01M29/32</main-classification>
        <further-classification edition="201101120251231B">A01M29/00</further-classification>
        <further-classification edition="201101120251231B">A01M29/16</further-classification>
        <further-classification edition="201101120251231B">A01M29/10</further-classification>
        <further-classification edition="202401120251231B">G06Q50/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>智逐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHASE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃醴萬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, LI-WAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡大爲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, TA-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張光甫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KUANG-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何建勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的實施例提供一種鳥類驅逐方法與系統，透過結合移動機構與智能影像判斷模型，有效辨識並驅離鳥類。首先，根據使用者預設的位置控制移動機構移動，並於指定位置擷取影像。接著，利用智能影像模型判斷鳥類位置，據此規劃移動路徑與驅逐設備的啟動時機，並制定驅逐策略實施之。驅逐後再次擷取影像，透過比對前後影像，評估驅逐成效。最終，系統將評估結果儲存為歷史資料，並進行策略檢討與最佳化。&lt;br/&gt;&lt;br/&gt;&lt;b&gt;&lt;br/&gt;&lt;/b&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The embodiment of the invention provides an intelligent bird deterrence method and system that effectively identifies and drives away birds by combining a mobile mechanism with an intelligent image recognition model. The system first moves the mobile mechanism to user-defined positions and captures images at designated locations. Using the intelligent image model, it identifies bird positions, plans the movement path, and activates deterrent devices accordingly. A deterrence strategy is then executed. Afterward, a second image is captured to assess the effectiveness by comparing it with the initial image. The evaluation results are stored as historical data, which are used to review and optimize future strategies.&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;b&gt;&lt;br/&gt;&lt;/b&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">S501~S513:本發明一較佳實施例的鳥類驅逐方法之流程</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1862" publication-number="202616554">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616554</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138023</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池單元組件、包括其的電池組以及車輛</chinese-title>
        <english-title>BATTERY CELL ASSEMBLIES, BATTERY PACKS COMPRISING THEM, AND MEANS OF TRANSPORTATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260102B">H01M50/193</main-classification>
        <further-classification edition="202101120260102B">H01M50/552</further-classification>
        <further-classification edition="202101120260102B">H01M50/567</further-classification>
        <further-classification edition="202101120260102B">H01M50/291</further-classification>
        <further-classification edition="200601120260102B">B60R16/033</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁誠桓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SEONG HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李永奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YOUNG KYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開一種電池單元組件、包括其的電池組以及車輛。與本發明一個範例相關的電池單元組件包括：複數個電池單元；電池框架，配置為容納內部的複數個電池單元；主匯流排，安裝在電池框架上並電性連接到複數個電池單元；導線件，電性連接主匯流排和複數個電池單元；以及灌封部，配置為圍繞導線件和主匯流排的部分區域，其中主匯流排包括耦接導線件的端子連接部，以及從端子連接部延伸的凸起部，凸起部的高度高於灌封部的填充高度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A battery cell assembly related to one example of the present invention comprises: a plurality of battery cells; a cell frame arranged to accommodate the plurality of battery cells inside; a main bus-bar mounted on the cell frame and electrically connected to the plurality of battery cells; a wire member electrically connecting the main bus-bar and the plurality of battery cells; and a potting part arranged to surround partial regions of the wire member and the main bus-bar, wherein the main bus-bar comprises a terminal connection part to which the wire member is coupled, and a raised part extending from the terminal connection part to have a height higher than a filled height of the potting part.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電池單元組件</p>
        <p type="p">120:主匯流排</p>
        <p type="p">120-1:正極主匯流排</p>
        <p type="p">120-2:負極主匯流排</p>
        <p type="p">130:電池框架</p>
        <p type="p">130a:上側壁</p>
        <p type="p">130b:下側壁</p>
        <p type="p">130c:前側壁</p>
        <p type="p">130d:後側壁</p>
        <p type="p">130e:左側壁</p>
        <p type="p">130f:右側壁</p>
        <p type="p">132:防護壁</p>
        <p type="p">150:灌封部</p>
        <p type="p">212:連接螺栓</p>
        <p type="p">220:BMS連接匯流排</p>
        <p type="p">X、Y、Z:軸方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1863" publication-number="202615883">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615883</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138054</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於確定訊號品質的方法及接收器</chinese-title>
        <english-title>METHOD FOR DETERMINING SIGNAL QUALITY AND ASSOCIATED RECEIVER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">G01R31/317</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬政典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAN, CHENG-TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹博昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, PO-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張惟欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, WEI-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊仲軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHUNG-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瀚融</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HAN-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李名鎮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MING-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TUNG-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李騏名</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHI-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭珩瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PERNG, JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾瑞興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, JUI-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鵬宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PENG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李徹重</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, TSE-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊家豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIA-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">確定訊號品質的方法，包括：根據該訊號生成複數個眼圖；根據基本指標確定每個眼圖是否正常，以生成第一確定結果；回應於該第一確定結果表明每個眼圖正常，根據高級指標確定每個眼圖是否正常，以生成第二確定結果，其中，該高級指標包括面積與輪廓長度的組合、密度與梯度的組合、以及複數個斜率的組合中的至少一個；以及回應於該第二確定結果表明每個眼圖正常，根據該複數個眼圖中的每一個確定訊號的訊號品質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for determining a signal quality includes: receiving a signal from a circuit device; generating multiple eye diagrams according to the signal; determining whether each eye diagram is normal according to a basic index to generate a first determination result, wherein the basic index comprises an eye height and an eye width; in response to the first determination result indicating that each diagram is normal, determining whether each eye diagram is normal according to an advanced index to generate a second determination result, wherein the advanced index comprises at least one of a combination of an area and a contour length, a combination of a density and a gradient, and a combination of multiple slopes; and in response to the second determination result indicating that each eye diagram is normal, determining the signal quality of the signal according to each of the multiple eye diagrams.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S600,S602,S604,S606,S608:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1864" publication-number="202615622">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615622</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138070</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黏著劑組成物及其形成方法</chinese-title>
        <english-title>ADHESIVE COMPOSITION AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251222B">C09J183/05</main-classification>
        <further-classification edition="200601120251222B">C09J183/07</further-classification>
        <further-classification edition="201801120251222B">C09J7/38</further-classification>
        <further-classification edition="200601120251222B">C09J133/08</further-classification>
        <further-classification edition="200601120251222B">C09J4/02</further-classification>
        <further-classification edition="200601120251222B">H01L21/302</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商聖高拜塑膠製品公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔布斯　卡桑德拉Ｔ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUBBS, CASSANDRA T.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁　帥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, SHUAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮特　傑弗瑞Ｈ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEET, JEFFREY H.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔　玉波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUI, YUBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅　洪波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, HONGBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">無溶劑壓敏性黏著劑可包括矽氧基稀釋劑組分、MQ樹脂組分、乙烯基聚矽氧組分、及交聯劑組分。矽氧基稀釋劑組分含量可係無溶劑壓敏性黏著劑總重量之至少約0.1 wt.%且不大於約14 wt.%；MQ樹脂組分含量可係無溶劑壓敏性黏著劑總重量之至少約30 wt.%且不大於約65 wt.%；乙烯基聚矽氧組分含量可係無溶劑壓敏性黏著劑總重量之至少約27 wt.%且不大於約62 wt.%；及交聯劑組分含量可係無溶劑壓敏性黏著劑總重量之至少約0.5 wt.%且不大於約8.0 wt.%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A solventless pressure sensitive adhesive may include a silicone-based diluent component, an MQ resin component, a vinyl silicone component, and a crosslinker component. The silicone-based diluent component content may be at least about 0.1 wt.% and not greater than about 14 wt.% for a total weight of the solventless pressure sensitive adhesive, the MQ resin component content may be at least about 30 wt.% and not greater than about 65 wt.% for a total weight of the solventless pressure sensitive adhesive, the vinyl silicone component content may be at least about 27 wt.% and not greater than about 62 wt.% for a total weight of the solventless pressure sensitive adhesive, and the crosslinker component content may be at least about 0.5 wt.% and not greater than about 8.0 wt.% for a total weight of the solventless pressure sensitive adhesive.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:無溶劑壓敏性黏著劑形成方法</p>
        <p type="p">110:第一步驟</p>
        <p type="p">120:第二步驟</p>
        <p type="p">130:第三步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1865" publication-number="202616753">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616753</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138081</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理操作模式或能力的方法及在用戶設備中實現的裝置</chinese-title>
        <english-title>METHODS FOR HANDLING OPERATION MODE OR CAPABILITY AND APPARATUS IMPLEMENTABLE IN A USER EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120251103B">H04W60/00</main-classification>
        <further-classification edition="200901120251103B">H04W8/24</further-classification>
        <further-classification edition="201801120251103B">H04W76/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>無　邦尼特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NA, PUNEET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納耶米　馬各</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIEMI, MARKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了在行動通信中處理由用戶設備(UE)發起的註銷註冊或分離程序所導致的系統模式能力的技術。一種裝置(例如，UE)執行UE發起的註銷註冊或與網路分離程序。該裝置在操作模式或能力中執行UE發起的註銷註冊或分離程序時保持操作模式或能力(例如，不停用該操作模式或能力)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Techniques pertaining to handling system mode capability due to a user equipment (UE)-initiated deregistration or detach procedure in mobile communications are described. An apparatus (e.g., a UE) performs a UE-initiated deregistration or detach procedure with a network. The apparatus keeps an operation mode or capability (e.g., by not disabling the operation mode or capability) while performing the UE-initiated deregistration or detach procedure in the operation mode or capability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:流程</p>
        <p type="p">310:步驟</p>
        <p type="p">320:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1866" publication-number="202616715">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616715</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138102</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於對重建視訊資料進行迴路濾波的方法和裝置</chinese-title>
        <english-title>METHODS AND APPARATUS FOR IN-LOOP FILTERING OF RECONSTRUCTED VIDEO DATA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120251201B">H04N19/117</main-classification>
        <further-classification edition="201401120251201B">H04N19/119</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江宥呈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, YOU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱世鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, SHIH-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭裕霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, YU-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐志瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳慶曄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHING-YEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊子德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, TZU-DER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳渏紋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃毓文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種用於對重建視訊進行迴路濾波的方法和裝置。根據該方法，目前區塊的輸入資料被接收，其中，該輸入資料包含目前區塊的重建樣本。目前區塊中目前樣本的自適應迴路濾波器 (Adaptive Loop Filter，簡稱ALF)被決定，其中，該自適應迴路濾波器包含與目前樣本的一個或多個參考樣本相關聯的一個或多個濾波器抽頭。該自適應迴路濾波器被應用於目前樣本，以生成濾波後的輸出樣本。包含濾波後的輸出樣本的濾波後輸出被提供。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and apparatus for in-loop filtering of reconstructed video are disclosed. According to the method, input data for a current block is received, wherein the input data comprises reconstructed samples of the current block. An ALF (Adaptive Loop Filter) for a current sample in the current block is determined, wherein the ALF comprises one or more filter taps associated with one or more reference samples of the current sample. The ALF is applied to the current sample to generate a filtered output sample. Filtered output comprising the filtered output sample is provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1410:步驟</p>
        <p type="p">1420:步驟</p>
        <p type="p">1430:步驟</p>
        <p type="p">1440:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1867" publication-number="202616310">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616310</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138103</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電力轉換裝置</chinese-title>
        <english-title>POWER CONVERSION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01F30/10</main-classification>
        <further-classification edition="200601120260102B">H01F27/32</further-classification>
        <further-classification edition="200601120260102B">H01F41/12</further-classification>
        <further-classification edition="200601120260102B">H02M3/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商新電元工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井康大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>内田義孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UCHIDA, YOSHITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂田裕太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKATA, YUTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為防止或抑制因密封樹脂之成型壓而使繞線部非預期地位移或產生短射。本發明之解決手段為一種電力轉換裝置，係具備：一次側基板，係具有安裝有一次側電子零件之一次側安裝部及一次側繞線部；二次側基板，係具有安裝有二次側電子零件之二次側安裝部及二次側繞線部，二次側繞線部與一次側繞線部配置於同軸上；第一絕緣構件及第二絕緣構件，係夾著一次側繞線部而配置，且互相結合；及密封樹脂，係密封一次側繞線部、二次側繞線部、第一絕緣構件及第二絕緣構件。第一絕緣構件及第二絕緣構件係於與一次側繞線部面對的面具有複數肋。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">31:一次側基板</p>
        <p type="p">32:二次側基板</p>
        <p type="p">36:絕緣構件</p>
        <p type="p">311:一次側繞線部，一次側線圈</p>
        <p type="p">312:一次側安裝部</p>
        <p type="p">321:二次側繞線部</p>
        <p type="p">322:二次側安裝部</p>
        <p type="p">361:第一絕緣構件</p>
        <p type="p">362:第二絕緣構件</p>
        <p type="p">3111:一次側繞線，一次側線圈</p>
        <p type="p">3112:貫通孔</p>
        <p type="p">3123:連接插針</p>
        <p type="p">3124a:固定用孔</p>
        <p type="p">3211:捲繞部，二次側線圈</p>
        <p type="p">3221:FET</p>
        <p type="p">3223:連接插針</p>
        <p type="p">3224a:固定用孔</p>
        <p type="p">3225:連接用孔</p>
        <p type="p">R4:肋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1868" publication-number="202616695">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616695</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138148</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於擴展觸發之傳輸之方法及程序</chinese-title>
        <english-title>METHODS AND PROCEDURES FOR EXTENDED TRIGGER BASED TRANSMISSION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H04L5/00</main-classification>
        <further-classification edition="202401120260102B">H04W74/08</further-classification>
        <further-classification edition="202301120260102B">H04W72/0446</further-classification>
        <further-classification edition="202301120260102B">H04W72/1263</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商內數位專利控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERDIGITAL PATENT HOLDINGS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樓　漢卿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOU, HANQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　曉飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, XIAOFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩阿德　默罕默德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAAD, MAHMOUD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　陸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一STA接收包括一共同資訊欄位、使用者資訊欄位及一特殊使用者資訊欄位的一觸發訊框。該STA根據以下來判定一第一、第二或第三變體之一者：共同資訊欄位選擇位元之一第一位元型樣指示一第一變體；該等共同資訊欄位選擇位元之一第二位元型樣及該特殊使用者資訊欄位之一識別符欄位之一值指示一第二或第三變體之一者；且該等共同資訊欄位選擇位元之一第三位元型樣及該特殊使用者資訊欄位之該識別符欄位之一值及與該STA相關聯之該使用者資訊欄位之一識別符欄位之一值指示該第一或該第二變體之一者。該STA傳輸所判定之第一、第二或第三變體之類型之一基於觸發(TB)之實體協定資料單元(PPDU)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A STA receives a trigger frame comprising a common information field, user information fields, and a special user information field. The STA determines one of a first, second or third variant according to: a first bit pattern of common information field selection bits indicates a first variant, a second bit pattern of the common information field selection bits and a value of an identifier field of the special user information field indicates one of a second or third variant, and a third bit pattern of the common information field selection bits and a value of the identifier field of the special user information field and a value of an identifier field of the user information field associated with the STA indicates one of the first or the second variant. The STA transmits a trigger based (TB) physical protocol data unit (PPDU) of type of the determined first, second, or third variant.</p>
      </isu-abst>
      <representative-img>
        <p type="p">900:程序</p>
        <p type="p">902:步驟</p>
        <p type="p">904:步驟</p>
        <p type="p">906:步驟</p>
        <p type="p">908:步驟</p>
        <p type="p">910:步驟</p>
        <p type="p">916:步驟</p>
        <p type="p">924:步驟</p>
        <p type="p">926:步驟</p>
        <p type="p">928:步驟</p>
        <p type="p">942:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1869" publication-number="202615119">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615119</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138161</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>超聲波產生裝置</chinese-title>
        <english-title>ULTRASONIC GENERATOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251210B">A61N7/02</main-classification>
        <further-classification edition="200601120251210B">A61B18/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商格迪優斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GODIUS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜棟丸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, DONG HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李賢淑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HYUN SOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金永周</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YOUNG JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金南國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, NAMKUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李基熏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KI HUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種超聲波產生裝置，所述超聲波產生裝置包括：框架，形成有貫通孔；至少一個支架，包括可分離地結合於所述貫通孔的軸部和向所述軸部的前方延伸的頭部；換能器，可分離地固定於所述頭部，以產生超聲波；以及第一密封部件，密封所述頭部與所述換能器之間，其中，在所述頭部形成有供所述第一密封部件插入的頭部槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:框架</p>
        <p type="p">200:支架</p>
        <p type="p">300:換能器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1870" publication-number="202615675">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615675</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138190</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>罐用鋼板及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">C22C38/00</main-classification>
        <further-classification edition="200601120251201B">C22C38/26</further-classification>
        <further-classification edition="200601120251201B">C22C38/48</further-classification>
        <further-classification edition="200601120251201B">B21C47/02</further-classification>
        <further-classification edition="200601120251201B">C21D1/26</further-classification>
        <further-classification edition="200601120251201B">C21D8/02</further-classification>
        <further-classification edition="200601120251201B">C21D9/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JFE STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹谷健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEYA, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>假屋房亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARIYA, NOBUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種解決所述課題的高強度、高延性及深沖加工性優異的罐用鋼板及其製造方法。所述罐用鋼板具有特定之成分組成，所述C中之作為固溶C的C含有量為0.003%以上且0.030%以下，所述罐用鋼板具有肥粒鐵，所述肥粒鐵平均粒徑為2.0μm以上且7.0μm以下，且差排密度為3.0×10¹⁴ m⁻²以上且1.0×10¹⁵ m⁻²以下，平均塑性應變比r⁻為1.0以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1871" publication-number="202615574">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615574</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138192</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、成形體、光學零件及樹脂組成物的製造方法</chinese-title>
        <english-title>RESIN COMPOSITION, MOLDED ARTICLE, OPTICAL COMPONENT, AND METHOD FOR PRODUCING RESIN COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260106B">C08L23/025</main-classification>
        <further-classification edition="200601120260106B">C08L45/00</further-classification>
        <further-classification edition="200601120260106B">C08L101/12</further-classification>
        <further-classification edition="200601120260106B">C08K5/105</further-classification>
        <further-classification edition="200601120260106B">C08K3/04</further-classification>
        <further-classification edition="200601120260106B">G02B5/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>濱田悠也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMADA, YUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種樹脂組成物，包含含填充材的粒子、以及添加劑（C），所述含填充材的粒子包含環狀烯烴系聚合物（A）及填充材（B），所述樹脂組成物中，在所述含填充材的粒子的表面的至少一部分存在所述添加劑（C），當將所述樹脂組成物的總量設為100質量份時，在所述含填充材的粒子的表面的至少一部分存在的所述添加劑（C）的量為0.001質量份以上且10質量份以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1872" publication-number="202614953">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614953</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138205</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>邏輯單元位於可抽出式卡匣中的咖啡研磨定量設備</chinese-title>
        <english-title>COFFEE GRINDING-DOSING APPLIANCE WITH LOGIC UNIT IN AN EXTRACTABLE CARTRIDGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A47J42/40</main-classification>
        <further-classification edition="200601120260102B">A47J42/46</further-classification>
        <further-classification edition="200601120260102B">A47J42/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商費倫扎拓ＭＣ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FIORENZATO M.C. SRL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利桑德龍　盧卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LISSANDRON, LUCA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>時渝恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種咖啡研磨定量設備（10a、10b），其具有邏輯單元（106），該邏輯單元被包圍在可抽出式卡匣（100a）或第一卡匣中，該可抽出式卡匣或該第一卡匣以可拆卸的方式從外部被插入和緊固在殼體中，從而形成緊湊且可互換的控制單元。該可抽出式卡匣（100a）由剛性箱形截面縱向元件（101）和頭部（102）組成，該剛性箱形截面縱向元件通過插入開口被插入到該殼體（108）中，該錨固頭面朝外；該縱向元件至少將該邏輯單元整個容納和保護在其中，同時使連接件集成在外部表面上。在一個實施例中，該研磨定量設備還配備有用以實時稱重經研磨和分配的咖啡的器件，其具有稱重傳感器，該稱重傳感器位於該殼體內部並且與叉形件連結，同樣容納在可抽出式卡匣（100b）或第二卡匣內，該可抽出式卡匣或第二卡匣以可拆卸的方式從外部被插入和緊固到該殼體上，以形成緊湊且可互換的稱重單元（140）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Coffee grinding-dosing appliance (10a, 10b) having its logic unit (106) enclosed in an extractable cartridge (100a) or first cartridge, inserted and fastened in the casing from the exterior in a removable manner. creating a compact and interchangeable control unit. Said cartridge (100a) is composed of a rigid box-section longitudinal element (101) inserted into the casing (108) through an insertion opening, and of an anchoring head (102) facing outwards; the longitudinal element has at least the logic unit entirely accommodated and protected inside it, while it has connectors integrated on the exterior surface. In one embodiment, the grinding-dosing appliance is also equipped with means to weigh the ground and dispensed coffee in real time, with a load cell located inside the casing and linked to the fork, likewise accommodated inside an extractable cartridge (100b) or second cartridge, inserted and fastened to the casing from the exterior in a removable manner, to form a compact and interchangeable weighing unit (140).</p>
      </isu-abst>
      <representative-img>
        <p type="p">10a:研磨定量設備</p>
        <p type="p">100a:可抽出式卡匣</p>
        <p type="p">101:縱向元件</p>
        <p type="p">102:頭部</p>
        <p type="p">107:機身</p>
        <p type="p">108:殼體</p>
        <p type="p">109:調節環</p>
        <p type="p">110:分配單元</p>
        <p type="p">111:輸送管口</p>
        <p type="p">114a:卡匣插入開口</p>
        <p type="p">117:叉形件</p>
        <p type="p">122:支撐腳</p>
        <p type="p">123:咖啡豆料斗</p>
        <p type="p">124:電插頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1873" publication-number="202616798">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616798</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138214</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電源的外殼組件</chinese-title>
        <english-title>CASING ASSEMBLY FOR POWER SUPPLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251118B">H05K5/15</main-classification>
        <further-classification edition="200601120251118B">H05K5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰商泰達電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS (THAILAND) PUBLIC COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克洛茨比歇爾　古納爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLOTZBUCHER, GUENAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案涉及一種用於電源的外殼組件，包括第一外殼部分和第二外殼部分，配置為在組裝後一起組成外殼並彼此鎖定。第一外殼部分包括彈性臂及突出部分。突出部分包括凹部和相應的接合部。彈性臂上佈置有突出部分。第二外殼部分包括接入通道及配合部。接入通道相應於突出部分。配合部配置為在組裝後與相應的第一外殼部分的凹部一起提供卡合連接。第一外殼部分和第二外殼部分被配置為在組裝前處於未變形狀態，在組裝後第一外殼部分處於變形狀態，且第一外殼部分在第二外殼部分的至少一配合部上施加力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a casing assembly for a power supply, comprising a first casing part and a second casing part, with the first casing part and the second casing part being configured to together provide a casing after an assembly, with the first casing part and the second casing part being locked to one another after the assembly. The first casing part comprises a springy arm and a protruding part. The protruding part comprises a recess and a respective engagement portion. The protruding part is arranged on the springy arm. The second casing part comprises an access channel and a mating portion. The access channel corresponds to the protruding part. The mating portion and the corresponding recess are configured to together provide the snap-fit connection after the assembly. The first casing part and the second casing part are configured to be in an undeformed state before the assembly. The first casing part is configured to be in a deformed state after the assembly, and is exerting a force on the at least one mating portion of the second casing part.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一外殼部分</p>
        <p type="p">3、4、21:彈性臂</p>
        <p type="p">5:第一端</p>
        <p type="p">6:第二端</p>
        <p type="p">7:第一突出部分</p>
        <p type="p">8:第一突出部分</p>
        <p type="p">9:切口</p>
        <p type="p">10:接合部</p>
        <p type="p">11:連接段</p>
        <p type="p">12:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1874" publication-number="202615624">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615624</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138234</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>密封材</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C09K3/10</main-classification>
        <further-classification edition="200601120260105B">C08L27/12</further-classification>
        <further-classification edition="200601120260105B">C08K9/06</further-classification>
        <further-classification edition="200601120260105B">C08K3/36</further-classification>
        <further-classification edition="200601120260105B">C08J3/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱電線工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI CABLE INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稲垣朋也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INAGAKI, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明旨在提供一種密封材，其由藉由使未交聯橡膠組成物交聯而獲得的橡膠組成物形成。未交聯橡膠組成物含有FKM、過氧化物、酸性至中性的補強填料以及鹼性填料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1875" publication-number="202616055">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616055</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138258</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>互動控制系統及互動控制方法</chinese-title>
        <english-title>INTERACTIVE CONTROL SYSTEM AND INTERACTIVE CONTROL METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">G06F3/01</main-classification>
        <further-classification edition="200601120251103B">G06F3/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仁寶電腦工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COMPAL ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉柏君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, PO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳凱逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KAI-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃亭捷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TING-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃嘉偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIA-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　澤俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾戈平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, KO-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例提供一種互動控制系統及互動控制方法。互動控制系統包括頭戴式裝置、輔助感測器及處理器。處理器辨識頭戴式裝置的動作感測器所偵測的動作資訊對應於目標行為，並依據目標行為透過輔助感測器取得輔助資訊。接著，處理器決定輔助資訊對應於目標條件，並依據目標條件透過頭戴式裝置的影像擷取裝置取得待測影像。處理器辨識待測影像中的目標物件，並依據目標物件產生資訊影像的顯示內容。藉此，可提升互動體驗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An interactive control system and an interactive control method are provided. The interactive control system includes a head-mounted device, an auxiliary sensor, and a processor. The processor is configured to identify that motion information detected by a motion sensor of the head-mounted device corresponds to a target behavior, and acquire auxiliary information via the auxiliary sensor according to the target behavior. Then, the processor determines that the auxiliary information corresponds to a target condition, and acquires a test image via an image capture device of the head-mounted device according to the target condition. The processor identifies a target object in the test image and generates display content of an information image according to the target object. Therefore, the interactive experience could be improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S310~S330:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1876" publication-number="202616617">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616617</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138296</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>馬達及馬達的製造方法</chinese-title>
        <english-title>MOTOR AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251023B">H02K3/28</main-classification>
        <further-classification edition="202501120251023B">H02K15/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼得科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIDEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南梨智宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANRI, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亀山和久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMEYAMA, KAZUHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂井秀徳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, HIDENORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種馬達及馬達的製造方法。馬達具有：定子鐵心與多數相的線圈。各相之所述線圈分別具有：多數個接腳部，是平坦導線，於所述凹槽內沿所述軸向貫通，且所述接腳部的端部自所述定子鐵心之所述軸向的一端面朝向軸向外側突出；及多數個連接部件，將所述多數個接腳部中相同相線圈之一對所述接腳部的所述端部彼此電連接。所述連接部件具有：與所述相同相線圈之一對所述接腳部的所述端部於所述周向或徑向上電連接之連接部分。所述連接部件之所述連接部分的至少一部分，於所述軸向上，位於自所述定子鐵心的所述一端面至所述接腳部的所述端部之所述軸向的一端為止的位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A motor and a manufacturing method thereof are provided. The motor includes: a stator core and coils having multiple phases. The coil of each phase respectively includes: multiple pins that are flat conductive wires, which pass through the groove along the axial direction, and the ends of the pins protrude axially outward from one axial end face of the stator core; and multiple connecting components that electrically connect the ends of a pair of pins of the same phase coils in the multiple pins. The connecting component includes: a connecting portion that is electrically connected to the ends of a pair of pins of the same phase coils in the circumferential direction or radial direction. At least a portion of the connecting portion of the connecting component is located in the axial direction at a position from the one end face of the stator core to the one axial end of the end of the pin.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:馬達</p>
        <p type="p">5:定子</p>
        <p type="p">20:定子鐵心</p>
        <p type="p">21:背軛</p>
        <p type="p">22:齒</p>
        <p type="p">23:凹槽</p>
        <p type="p">30:線圈</p>
        <p type="p">31:線圈端部</p>
        <p type="p">40:線圈片</p>
        <p type="p">41:第1部分</p>
        <p type="p">42:第2部分</p>
        <p type="p">60:連接部件</p>
        <p type="p">600:積層體</p>
        <p type="p">A:軸向</p>
        <p type="p">B:徑向</p>
        <p type="p">B1:徑向外側</p>
        <p type="p">B2:徑向內側</p>
        <p type="p">C:周向</p>
        <p type="p">P:中心軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1877" publication-number="202616616">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616616</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138299</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>馬達及馬達的製造方法</chinese-title>
        <english-title>MOTOR AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">H02K3/04</main-classification>
        <further-classification edition="200601120251103B">H02K3/28</further-classification>
        <further-classification edition="200601120251103B">H02K3/26</further-classification>
        <further-classification edition="202501120251103B">H02K15/35</further-classification>
        <further-classification edition="202501120251103B">H02K15/067</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼得科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIDEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南梨智宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANRI, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷田正文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIDA, MASAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂井秀徳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, HIDENORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">馬達具有定子鐵心與多數相線圈。所述多數相線圈具有：各相線圈直線部與線圈端部。所述線圈端部具有：於軸向上積層之多數個基板。所述多數個基板中之各基板分別具有：多數個貫通孔，沿所述軸向貫通所述各基板；多數個連接部，由分別位於所述多數個貫通孔內之導通部件構成，連接了插入所述貫通孔內之所述各相線圈直線部中之一相線圈直線部之多數個接腳部的端部；以及連接圖案部，將所述多數個連接部中之一對連接部彼此電連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The motor has a stator core and a plurality of phase coils. The plurality of phase coils includes: a straight portion of each phase coil and a coil end portion. The coil end portion includes: a plurality of substrates stacked in an axial direction. Each of the plurality of substrates includes: a plurality of through holes penetrating the substrates in the axial direction; a plurality of connecting portions, each consisting of a conductive component located in the plurality of through holes, connecting the ends of a plurality of pin portions of one of the phase coil straight portions inserted into the through holes; and a connecting pattern portion, electrically connecting a pair of the plurality of connecting portions to each other.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:馬達</p>
        <p type="p">20:定子鐵心</p>
        <p type="p">41,42,43:線圈直線部</p>
        <p type="p">50:線圈端部(軸向一側)</p>
        <p type="p">51:多數個基板</p>
        <p type="p">52:接合板</p>
        <p type="p">55:接合板貫通孔</p>
        <p type="p">60:U相基板(基板)</p>
        <p type="p">61,71,81:連接部</p>
        <p type="p">62,72,82:連接圖案部</p>
        <p type="p">65,75,85:貫通孔</p>
        <p type="p">70:V相基板(基板)</p>
        <p type="p">80:W相基板(基板)</p>
        <p type="p">411,421,431:接腳部</p>
        <p type="p">G:基板積層體</p>
        <p type="p">H:基板積層體貫通孔</p>
        <p type="p">X:基板積層體連接部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1878" publication-number="202615298">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615298</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138302</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>浮動平台穩定系統及安裝方法</chinese-title>
        <english-title>FLOATING PLATFORM STABILIZATION SYSTEM AND METHOD OF INSTALLATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120251223B">B63B77/10</main-classification>
        <further-classification edition="200601120251223B">E02B3/20</further-classification>
        <further-classification edition="200601120251223B">B63B35/44</further-classification>
        <further-classification edition="201601120251223B">F03D13/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商德希尼布能源法國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECHNIP ENERGIES FRANCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡薩雷斯　瑪雅　米格爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GONZALEZ-MAYA, MIGUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">可提供一種浮動平台系統，以促進在一浮動平台上安裝及支撐一結構。例如，該浮動平台系統可包括該浮動平台。該浮動平台系統亦可包括該浮動平台內之一壓載接收容積，用於接收壓載液。該浮動平台系統可進一步包括位於該浮動平台上之一安裝表面，用於安裝一結構。額外地，該浮動平台可包括一向下定向之對接導引件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A floating platform system can be provided to facilitate mounting of and for supporting a structure on a floating platform. For example, the floating platform system can include the floating platform. The floating platform system can also include a ballast receiving volume inside the floating platform for receiving a ballasting liquid. The floating platform system can further include a mounting surface on the floating platform for mounting a structure. Additionally, the floating platform can include a downwardly-oriented stabbing guide.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:浮動單元/浮動平台</p>
        <p type="p">102:浮動風力渦輪機平台</p>
        <p type="p">106a:第一浮柱</p>
        <p type="p">106b,106c:浮柱</p>
        <p type="p">114:下連接構件</p>
        <p type="p">116:風力渦輪機</p>
        <p type="p">118:垂直延伸塔</p>
        <p type="p">120:機艙</p>
        <p type="p">122:可旋轉的轉子葉片</p>
        <p type="p">124:水體</p>
        <p type="p">126:表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1879" publication-number="202615928">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615928</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138319</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>深紫外物鏡光學系統、深紫外物鏡及晶圓檢測顯微鏡</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">G02B21/16</main-classification>
        <further-classification edition="200601120251103B">G02B21/06</further-classification>
        <further-classification edition="200601120251103B">G02B9/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商南京中安半導體設備有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANJING ZHONGAN SEMICONDUCTOR EQUIPMENT LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙　永亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, YONGLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李保祿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例公開了一種深紫外物鏡光學系統，包括：從像方到物方沿同一光軸依次設置的第一透鏡組、第二透鏡組和第三透鏡組；其中，該第一透鏡組和該第三透鏡組的屈光度均為正，且該第一透鏡組的光焦度小於該第三透鏡組的光焦度；該第二透鏡組的屈光度為負。本發明中第三透鏡組相比較第一透鏡組具有較大的光焦度，以負責物體缺陷位置的光線散射能量的收集，在短距離內收集物體缺陷位置的光線散射能量，第二透鏡組具備負光焦度，能夠很好地補償各位置的角度差異實現平場校正，第一透鏡組具備較弱的正光焦度，能夠對高階相差進行補償，通過這三組特定透鏡組的組合能夠有效地保證成像的準確性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一透鏡</p>
        <p type="p">2:第二透鏡</p>
        <p type="p">3:第三透鏡</p>
        <p type="p">4:第四透鏡</p>
        <p type="p">5:第五透鏡</p>
        <p type="p">6:第六透鏡</p>
        <p type="p">7:第七透鏡</p>
        <p type="p">8:第八透鏡</p>
        <p type="p">9:第九透鏡</p>
        <p type="p">10:第十透鏡</p>
        <p type="p">G1:第一透鏡組</p>
        <p type="p">G2:第二透鏡組</p>
        <p type="p">G3:第三透鏡組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1880" publication-number="202616708">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616708</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138343</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種在聊天室內對影像或文字訊息進行反應之方法、計算機裝置及計算機可讀記錄介質</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120251201B">H04L51/04</main-classification>
        <further-classification edition="202201120251201B">G06F3/0484</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商連加股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINE PLUS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金娜怜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, NA YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種在聊天室內對影像或文字訊息進行反應之方法、一種計算機裝置，以及記錄有計算機程式之計算機可讀記錄介質。所述聊天室反應提供方法包括：隨著在聊天室中選擇特定訊息，經由影像檢視器顯示該特定訊息之步驟；經由所述影像檢視器接收針對該特定訊息之塗鴉反應(doodling reaction)之步驟；以及在聊天室內之該特定訊息上層疊(layering)並顯示所述塗鴉反應之步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S310:步驟</p>
        <p type="p">S320:步驟</p>
        <p type="p">S330:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1881" publication-number="202616149">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616149</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138364</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>計算儲存裝置和計算系統</chinese-title>
        <english-title>COMPUTATIONAL STORAGE DEVICE AND COMPUTING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">G06N3/08</main-classification>
        <further-classification edition="202301120260102B">G06N3/063</further-classification>
        <further-classification edition="200601120260102B">G06F11/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金鐘律</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JONG RYOOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧　峻明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, KEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閔映勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIN, YOUNG HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧　志恆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, TIMOTHY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金明瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MYOUNG SEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金浩植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HO SHIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露關於計算儲存裝置和計算系統。本揭露的實施例可以在位於訓練裝置外部的儲存裝置中執行用於人工智能模型訓練的計算中的一些，從而減少訓練裝置的計算負載，並且可以減少在執行訓練過程中在訓練裝置與儲存裝置之間移動的資料量，從而提高執行訓練的計算系統的操作性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a computational storage device and a computing system. Embodiments of the present disclosure may perform some of computations for training of an artificial intelligence model in a storage device located outside a training device, thereby reducing the computation load of the training device, and may reduce the amount of data moved between the training device and the storage device in the process of performing training, thereby improving the operational performance of a computing system that performs training.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:訓練裝置100</p>
        <p type="p">110:第一處理器(GPU)</p>
        <p type="p">120:第一處理記憶體(HBM)</p>
        <p type="p">200:儲存裝置</p>
        <p type="p">210:第一記憶體(NVM)</p>
        <p type="p">220:第二記憶體(DRAM)</p>
        <p type="p">230:控制器</p>
        <p type="p">300:主機裝置</p>
        <p type="p">310:第二處理器(CPU)</p>
        <p type="p">320:第二處理記憶體(DRAM)</p>
        <p type="p">LLMs:大型語言模型</p>
        <p type="p">PCIe:高速外圍組件互連</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1882" publication-number="202616003">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616003</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138393</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>激振方法、設計方法、激振裝置、程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">G05B13/04</main-classification>
        <further-classification edition="200601120251103B">G05B15/02</further-classification>
        <further-classification edition="200601120251103B">G01M7/04</further-classification>
        <further-classification edition="200601120251103B">G01M7/06</further-classification>
        <further-classification edition="200601120251103B">G05B19/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人東北大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOHOKU UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>榎田竜太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENOKIDA, RYUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>五十子幸樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKAGO, KOJU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梶原浩一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAJIWARA, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種與先前不同的簡單的激振方法等。於使用自動控制的激振方法中，自動控制為用於使對對象物進行驅動的激振器的輸出訊號與參照訊號一致的控制，藉由不使用設置有對象物的狀態下的激振器的特性的激振方法進行激振。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:振動試驗系統</p>
        <p type="p">2:試驗體</p>
        <p type="p">3:振動台</p>
        <p type="p">10:振動台控制裝置</p>
        <p type="p">30:基台</p>
        <p type="p">31:軸承</p>
        <p type="p">32:工作台</p>
        <p type="p">33:致動器</p>
        <p type="p">34:檢測感測器</p>
        <p type="p">r:輸入訊號</p>
        <p type="p">u:操作訊號</p>
        <p type="p">y:輸出訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1883" publication-number="202615932">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615932</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138396</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>透視可顯示眼鏡及其控制系統</chinese-title>
        <english-title>SEE-THROUGH DISPLAYABLE EYEWEAR AND CONTROL SYSTEM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251211B">G02B27/01</main-classification>
        <further-classification edition="200601120251211B">G02B27/02</further-classification>
        <further-classification edition="200601120251211B">G02F1/133</further-classification>
        <further-classification edition="200601120251211B">G06F3/01</further-classification>
        <further-classification edition="200601120251211B">G06F13/10</further-classification>
        <further-classification edition="200601120251211B">G06F15/163</further-classification>
        <further-classification edition="201801120251211B">H04N13/332</further-classification>
        <further-classification edition="200601120251211B">G02C5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>源奇科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIQXTAL TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宏山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUNG-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳忠憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUNG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種透視可顯示眼鏡及其控制系統。該透視可顯示眼鏡至少具有一前表面及一後表面，且用以向從該前表面觀看之過路人顯示圖形內容，同時容許該透視可顯示眼鏡之配戴者從該後表面觀看。該透視可顯示眼鏡包含至少一透視顯示模組、至少一驅動電路、至少一運算單元、至少一記憶單元、一無線單元及一電源單元。該控制系統包含一在該透視可顯示眼鏡外部之控制模組。該控制模組包含在一外部裝置上執行之一軟體子模組，及在一遠端裝置上執行之一後端子模組。該外部裝置可連線至該遠端裝置，以使該透視可顯示眼鏡在該控制模組之控制下運作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A see-through displayable eyewear and a control system thereof are provided, where the see-through displayable eyewear, at least having a front surface and a back surface, is arranged to display graphic contents to a passersby who is viewing the see-through displayable eyewear from the front surface, while allowing a wearer of the see-through displayable eyewear to view from the back surface. The see-through displayable eyewear includes at least one see-through display module, at least one driver circuit, at least one computation unit, at least one memory unit, a wireless unit, and a power unit. The control system includes a control module outside the see-through displayable eyewear. The control module includes a software sub-module running on the external device, and a backend sub-module running on a remote device. The external device may link to the remote device to allow the see-through displayable eyewear to operate under control of the control module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:控制系統</p>
        <p type="p">80:控制模組</p>
        <p type="p">81,85:外部裝置</p>
        <p type="p">82,86:軟體子模組</p>
        <p type="p">83:遠端裝置</p>
        <p type="p">84:後端子模組</p>
        <p type="p">100:透視可顯示眼鏡</p>
        <p type="p">110:透視顯示模組</p>
        <p type="p">120:驅動電路</p>
        <p type="p">130:運算單元</p>
        <p type="p">140:記憶單元</p>
        <p type="p">150:通訊模組</p>
        <p type="p">151:無線單元</p>
        <p type="p">152:有線單元</p>
        <p type="p">160:電源單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1884" publication-number="202615495">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615495</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138478</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路基板及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251209B">C08F2/50</main-classification>
        <further-classification edition="200601120251209B">H05K1/09</further-classification>
        <further-classification edition="200601120251209B">H05K3/02</further-classification>
        <further-classification edition="200601120251209B">H01L23/049</further-classification>
        <further-classification edition="200601120251209B">C11D1/58</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成清颯斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARIKIYO, HAYATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関口広樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKIGUCHI, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>真多淳二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATA, JUNJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種即便在高密度地配置了貫通電極的情況下亦抑制裂紋的產生的電路基板。一種電路基板，在能夠經由貫通電極進行表背導通的有機核心基板的至少一面包括交替地積層有導體電路層與具有貫通通孔電極的絕緣樹脂層而成的增層層，所述電路基板中，所述有機核心基板的厚度為150 μm以上，斷裂伸長率為4%以上，所述貫通電極的直徑為150 μm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:樹脂組成物基材</p>
        <p type="p">3:有機核心基板</p>
        <p type="p">4:貫通電極</p>
        <p type="p">5:增層層</p>
        <p type="p">6:電路基板</p>
        <p type="p">7:絕緣樹脂層</p>
        <p type="p">8:貫通通孔電極</p>
        <p type="p">9:導體電路層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1885" publication-number="202614960">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614960</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138494</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>滾刷、清潔設備以及清潔系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251128B">A47L11/40</main-classification>
        <further-classification edition="200601120251128B">A46B13/02</further-classification>
        <further-classification edition="200601120251128B">A46B17/06</further-classification>
        <further-classification edition="200601120251128B">A47L11/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹華飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, HUAFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種滾刷、清潔設備以及清潔系統。滾刷可轉動地連接在清潔設備上。滾刷包括刷體，周側設置有切割槽；保護齒，連接在刷體的周側，並設置於切割槽的槽口的外側的至少部分上；兩個刀體，設置於刷體內，兩個刀體的周側的切割刃的至少部分置凸出切割槽，並位於保護齒內，兩個刀體均相對刷體轉動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">502:支撐座</p>
        <p type="p">5051:第一刀體</p>
        <p type="p">5052:第二刀體</p>
        <p type="p">5054:支撐軸</p>
        <p type="p">5083:主齒輪</p>
        <p type="p">5085:從動齒輪</p>
        <p type="p">5086:第一支撐件</p>
        <p type="p">5087:動力輸入軸</p>
        <p type="p">5088:減速機構</p>
        <p type="p">5089:動力輸出軸</p>
        <p type="p">512:固定件</p>
        <p type="p">5121:定位凸起</p>
        <p type="p">514:第二支撐件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1886" publication-number="202615391">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615391</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138496</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光潛性鹼</chinese-title>
        <english-title>PHOTO-LATENT BASES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C59/19</main-classification>
        <further-classification edition="200601120260102B">C07C65/32</further-classification>
        <further-classification edition="200601120260102B">C07C277/00</further-classification>
        <further-classification edition="200601120260102B">C07C277/08</further-classification>
        <further-classification edition="200601120260102B">C07C279/04</further-classification>
        <further-classification edition="200601120260102B">C07C279/10</further-classification>
        <further-classification edition="200601120260102B">C07D207/04</further-classification>
        <further-classification edition="200601120260102B">C07D309/04</further-classification>
        <further-classification edition="200601120260102B">C07D311/16</further-classification>
        <further-classification edition="200601120260102B">C07D405/06</further-classification>
        <further-classification edition="200601120260102B">C07D487/04</further-classification>
        <further-classification edition="200601120260102B">C07D493/04</further-classification>
        <further-classification edition="200601120260102B">C09K3/00</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商開麥妥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEMETALL GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅伊　阿比吉特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROY, ABHIJEET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波蒂　泰哈斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POTHI, TEJAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科蘭布卡爾　布拉齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOLAMBKAR, PRACHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉瑪沙米　巴拉蘇布拉馬尼安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMASAMY, BALASUBRAMANIYAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於結構(PCG)-(BG)&lt;sub&gt;n&lt;/sub&gt;、(PCG)-(BG&lt;sup&gt;s&lt;/sup&gt;)&lt;sub&gt;n&lt;/sub&gt;或(PCG)&lt;sup&gt;-&lt;/sup&gt; (BG)&lt;sup&gt;+&lt;/sup&gt;之光潛性鹼，其中PCG代表光可裂解基團；BG代表鹼基團，且BG&lt;sup&gt;s&lt;/sup&gt;代表含有帶正電氮原子及帶負電鹵離子作為相對離子之鹼基團；n係1或2；在裂解PCG及BG之間之鍵之後形成之該鹼擁有≥ 7.5之共軛酸pK&lt;sub&gt;a&lt;/sub&gt;值，且該光潛性鹼具有在300 nm至420 nm範圍內用於裂解PCG及BG之間之該鍵之光活化波長。本發明進一步係關於製備該等光潛性鹼之方法及該等光潛性鹼在鹼可固化組合物中之用途，其中固化係藉由波長範圍為300至420 nm之UV及/或UV-VIS輻射誘導。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a photo-latent base of the structure (PCG)-(BG)&lt;sub&gt;n&lt;/sub&gt;,(PCG)-(BG&lt;sup&gt;s&lt;/sup&gt;)&lt;sub&gt;n&lt;/sub&gt;; or (PCG)&lt;sup&gt;-&lt;/sup&gt; (BG)&lt;sup&gt;+&lt;/sup&gt;, wherein PCG stands for photocleavable group; BG stands for a base group, and BG&lt;sup&gt;s&lt;/sup&gt; stands for a base group containing a positively charged nitrogen atom and a negatively charged halide ion as counter ion; n is 1 or 2; the base formed after cleaving the bond between PCG and BG possesses a pK&lt;sub&gt;a&lt;/sub&gt; value of the conjugate acid ≥ 7.5, and the photo-latent base has a photoactivation wavelength for cleaving the bond between PCG and BG in the range of 300 nm to 420 nm. The invention further relates to methods of preparing the photo-latent bases and to the use of the photo-latent bases in base curable compositions wherein curing is induced by UV and/or UV-VIS radiation in the wavelengths range from 300 to 420 nm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1887" publication-number="202616324">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616324</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138507</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於基板處理的靜電邊緣環架置系統</chinese-title>
        <english-title>ELECTROSTATIC EDGE RING MOUNTING SYSTEM FOR SUBSTRATE PROCESSING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">H01J37/20</main-classification>
        <further-classification edition="200601120260113B">H01L21/683</further-classification>
        <further-classification edition="200601120260113B">H01L21/687</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬堤育斯金　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATYUSHKIN, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡門登特　凱伊斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COMENDANT, KEITH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥斯　亞當　克利斯多夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACE, ADAM CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾爾利奇　達瑞爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EHRLICH, DARRELL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍藍德　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOLLAND, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯札維奇　菲力克斯　萊布</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOZAKEVICH, FELIX LEIB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪瑞卡塔諾　艾力西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARAKHTANOV, ALEXEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種邊緣環系統，包含一基板支撐件，配置為在電漿處理期間支撐一基板，並且包含一底板及佈置於該底板之上的一上層。一邊緣環支撐件，包含一第一主體及佈置於該第一主體中之一靜電夾持電極。在處理期間該邊緣環支撐件係佈置於該底板上方並且於該基板之徑向外側。一邊緣環包含一第二主體，配置為在電漿處理期間佈置在該邊緣環支撐件之上並且被靜電夾持於該邊緣環支撐件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An edge ring system comprising a substrate support configured to support a substrate during plasma processing and including a baseplate and an upper layer arranged on the baseplate. An edge ring support includes a first body and an electrostatic clamping electrode arranged in the first body. The edge ring support is arranged above the baseplate and radially outside of the substrate during processing. An edge ring includes a second body arranged on and electrostatically clamped to the edge ring support during plasma processing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板支撐件</p>
        <p type="p">110:基板</p>
        <p type="p">112:上層</p>
        <p type="p">114:接合層</p>
        <p type="p">116:底板</p>
        <p type="p">118:冷卻通道</p>
        <p type="p">122:冷卻劑供給管</p>
        <p type="p">126:下板</p>
        <p type="p">132:靜電夾持電極</p>
        <p type="p">136:夾持供給導體</p>
        <p type="p">140:氣體通道</p>
        <p type="p">146:氣體供給線</p>
        <p type="p">150:上邊緣環</p>
        <p type="p">152:環形主體</p>
        <p type="p">154:環形凸部</p>
        <p type="p">160:邊緣環支撐件</p>
        <p type="p">161:主體</p>
        <p type="p">162:靜電夾持電極</p>
        <p type="p">164:夾持供給導體</p>
        <p type="p">166:空腔</p>
        <p type="p">168:氣體供給線</p>
        <p type="p">169:接合層</p>
        <p type="p">170:第一外邊緣環</p>
        <p type="p">172:主體</p>
        <p type="p">174:第一環形臺階</p>
        <p type="p">176:第二環形臺階</p>
        <p type="p">177:環形溝槽</p>
        <p type="p">178:密封件</p>
        <p type="p">180:第二邊緣環</p>
        <p type="p">182:環形主體</p>
        <p type="p">184:環形凸部</p>
        <p type="p">186:環形溝槽</p>
        <p type="p">188:密封件</p>
        <p type="p">194:密封件</p>
        <p type="p">195:定形密封件</p>
        <p type="p">196:空腔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1888" publication-number="202616152">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616152</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138538</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>量子神經網路之修改方法與系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR MODIFYING A QUANTUM NEURAL NETWORK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260102B">G06N10/80</main-classification>
        <further-classification edition="202301120260102B">G06N3/082</further-classification>
        <further-classification edition="202201120260102B">G06N10/70</further-classification>
        <further-classification edition="202301120260102B">G06N3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西班牙商多元宇宙運算公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MULTIVERSE COMPUTING S.L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧魯斯　羅曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORUS, ROMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈赫羅米　賽義德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAHROMI, SAEED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛格　蘇克賓德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, SUKHBINDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托穆特　安德烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMUT, ANDREI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於修改量子神經網路的方法，包含：經由計算裝置識別需要自受訓練之量子神經網路中刪除的資訊；經由計算裝置在受訓練之量子神經網路中定位已識別的資訊；經由計算裝置從受訓練之量子神經網路中刪除已識別的資訊，而不刪除受訓練之量子神經網路中其他不需被刪除的資訊；以及經由計算裝置壓縮於刪除已識別資訊後所得之量子神經網路。此外，亦提供一種系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for modifying a quantum neural network, comprising: identifying via computer means information that needs to be erased from a trained quantum neural network; localizing via the computer means the identified information in the trained quantum neural network; erasing via the computer means the identified information from the trained quantum neural network without erasing from the trained quantum neural network other information that needs not to be erased; compressing via the computer means the quantum neural network which results when the identified information has been erased. Also, a system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101~104:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1889" publication-number="202615808">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615808</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138631</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用對地電壓為零之流電隔離電能加熱流體之系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR HEATING FLUID USING GALVANICALLY ISOLATED ELECTRICAL ENERGY HAVING ZERO VOLTAGE TO GROUND</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260107B">F24H1/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商瓦特洛威電子製造公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATLOW ELECTRIC MANUFACTURING COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奎爾　格雷戈爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUERE, GREGOIRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種流體加熱系統包括界定一流體通道並且由一導電材料所製成之一管子，其中該管子界定用以接收及排出流體之一入口及一出口。一組電力系統包括電氣連接至該管子以提供電能將該管子加熱之一流電隔離電力供應器、以及被組配以操作該流電隔離電力供應器以向該管子提供該電能之一電力控制器。該電力控制器被組配以調整要藉由該流電隔離電力供應器提供之電流，並且該組電力系統被組配以控制該電能以在該入口處具有實質零電壓並在該出口處具有實質零電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fluid heating system includes a tube defining a fluid passage and being made from an electrically conductive material, wherein the tube defines an inlet and an outlet to receive and expel fluid. A set of power systems includes a galvanically isolated power supply electrically connected to the tube to provide electric energy to heat the tube and a power controller configured to operate the galvanically isolated power supply to provide the electric energy to the tube. The power controller is configured to adjust electric current to be provided by the galvanically isolated power supply, and the set of power systems is configured to control the electrical energy to have substantially zero voltage at the inlet and substantially zero voltage at the outlet.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:流體加熱系統；系統</p>
        <p type="p">102:管子</p>
        <p type="p">104A:電力系統</p>
        <p type="p">104B:電力系統</p>
        <p type="p">106A:流電隔離(G-I)電力供應器；G-I電力供應器；電力供應器</p>
        <p type="p">106B:流電隔離(G-I)電力供應器；G-I電力供應器；電力供應器</p>
        <p type="p">107A:變壓器</p>
        <p type="p">107B:變壓器</p>
        <p type="p">108A:電力控制器</p>
        <p type="p">108B:電力控制器</p>
        <p type="p">112:入口</p>
        <p type="p">114:出口</p>
        <p type="p">116:流體輸入歧管；歧管</p>
        <p type="p">118:流體輸出歧管；歧管</p>
        <p type="p">119:催化劑</p>
        <p type="p">120:箭頭</p>
        <p type="p">122A:部分</p>
        <p type="p">122B:部分</p>
        <p type="p">122C:部分</p>
        <p type="p">128:系統控制器</p>
        <p type="p">130A:溫度感測器</p>
        <p type="p">130B:感測器</p>
        <p type="p">130C:感測器</p>
        <p type="p">132:箭頭</p>
        <p type="p">134:箭頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1890" publication-number="202615876">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615876</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138634</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於量測電池胞元電壓的方法及電池系統</chinese-title>
        <english-title>METHOD FOR MEASURING BATTERY CELL VOLTAGE AND BATTERY SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251209B">G01R19/10</main-classification>
        <further-classification edition="200601120251209B">G01R19/165</further-classification>
        <further-classification edition="201901120251209B">G01R31/382</further-classification>
        <further-classification edition="201901120251209B">G01R31/385</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許成儁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEO, SUNGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本揭露實施例的電池系統包括：電性連接的多個電池胞元；電池監測積體電路，包括用於胞元平衡的胞元平衡電流流經的端子，且連接至多個電池胞元中的每一者的兩端，以在對多個電池胞元實行胞元平衡時在每一胞元電壓量測週期期間量測多個胞元電壓中的每一者；以及微控制單元，當多個胞元電壓之中第一電池胞元在當前胞元電壓量測週期期間的胞元電壓與在前一胞元電壓量測週期期間的胞元電壓之間的差大於或等於預定校正值時，基於第一電池胞元在當前胞元電壓量測週期期間的胞元電壓及其餘的多個電池胞元中的每一者的多個胞元電壓中的每一者來判斷是否結束胞元平衡，第一電池胞元包括連接至端子的正電極。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A battery system according to an embodiment of the present disclosure includes a plurality of battery cells electrically connected, a BMIC including a terminal through which a cell balancing current for cell balancing flows and connected to both ends of each of the plurality of battery cells to measure each of the plurality of cell voltages during each cell voltage measurement cycle when the cell balancing is performed on the plurality of battery cells, and an MCU determining whether to end the cell balancing based on the cell voltage of a first battery cell during the current cell voltage measurement cycle and each of the plurality of cell voltages of each of the remaining plurality of battery cells when the difference between the cell voltage of the first battery cell including the positive electrode connected to the terminal during the current cell voltage measurement cycle and the cell voltage during the previous cell voltage measurement cycle among the plurality of cell voltages is greater than or equal to a predetermined correction value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電池</p>
        <p type="p">20:電池管理系統(BMS)</p>
        <p type="p">100:BMIC</p>
        <p type="p">110:胞元電壓量測部</p>
        <p type="p">120:胞元平衡電路</p>
        <p type="p">130:COV及CUV控制器</p>
        <p type="p">200:MCU</p>
        <p type="p">210:胞元電壓校正器</p>
        <p type="p">220:胞元平衡控制器</p>
        <p type="p">Cell&lt;sub&gt;1&lt;/sub&gt;:電池胞元/第一電池胞元</p>
        <p type="p">Cell&lt;sub&gt;2&lt;/sub&gt;:電池胞元/第二電池胞元</p>
        <p type="p">Cell&lt;sub&gt;3&lt;/sub&gt;:電池胞元/第三電池胞元</p>
        <p type="p">Cell&lt;sub&gt;n-1&lt;/sub&gt;:電池胞元/第n-1電池胞元</p>
        <p type="p">Cell&lt;sub&gt;n&lt;/sub&gt;:電池胞元/第n電池胞元</p>
        <p type="p">N:端子</p>
        <p type="p">R:電阻/電阻器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1891" publication-number="202616593">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616593</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138655</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>垂直腔表面發射雷射陣列</chinese-title>
        <english-title>VERTICAL CAVITY SURFACE EMITTING LASER ARRAY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260113B">H01S5/02345</main-classification>
        <further-classification edition="200601120260113B">H01S5/026</further-classification>
        <further-classification edition="200601120260113B">H01S5/183</further-classification>
        <further-classification edition="200601120260113B">H01S5/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商貳陸德拉瓦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>II-VI DELAWARE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潭　傑森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, JASON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史卓澤邦斯基　包威爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STRZEBONSKI, PAWEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞藍　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAURAIN, ALEXANDRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容描述一種具有複數個垂直腔表面發射雷射(VCSEL)的裝置，所述VCSEL是以群組可定址的。所述裝置具有底部RDL，其能夠透過焊墊貫孔來將第一群組的VCSEL電耦接至第一焊墊。所述裝置亦具有頂端RDL，其能夠透過一群組的VCSEL貫孔來將第二群組的VCSEL電耦接至第二焊墊。所述第二群組的VCSEL的每一個VCSEL是電耦接至所述群組的VCSEL貫孔中的對應的VCSEL貫孔。再者，所述複數個VCSEL可以用包含隨機的任何方式來加以設置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure describes a device having a plurality vertical cavity surface emitting lasers (VCSELs) that are addressable in groups. The device has a bottom RDL that is able to electrically couple a first group of VCSELs to a first bond pad through to a bond pad via. The device also has a top RDL that is able to electrically couple a second group of VCSELs to a second bond pad through a group of VCSEL vias. Each VCSEL of the second group of VCSELs is electrically coupled to a corresponding VCSEL via of the group of VCSEL vias. Furthermore, the plurality of VCSEL may be positioned in any manner including randomly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:發射器A</p>
        <p type="p">102:第一連續的金屬表面</p>
        <p type="p">103:發射器B</p>
        <p type="p">104:離散的金屬表面</p>
        <p type="p">105:VCSEL貫孔</p>
        <p type="p">106:實體分開</p>
        <p type="p">107:第一焊墊貫孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1892" publication-number="202615257">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615257</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138656</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>絕緣膜、印刷電路板、電子產品及絕緣膜的製造方法</chinese-title>
        <english-title>INSULATING FILM, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE AND MANUFACTURING METHOD FOR INSULATING FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B32B27/00</main-classification>
        <further-classification edition="200601120260102B">C08J5/18</further-classification>
        <further-classification edition="200601120260102B">C08L29/14</further-classification>
        <further-classification edition="200601120260102B">C08L61/06</further-classification>
        <further-classification edition="200601120260102B">C08L63/00</further-classification>
        <further-classification edition="200601120260102B">C08K3/36</further-classification>
        <further-classification edition="200601120260102B">C08K5/3432</further-classification>
        <further-classification edition="200601120260102B">H05K1/03</further-classification>
        <further-classification edition="200601120260102B">H05K3/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG CHEM, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃盛珉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, SEONGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金太醇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, TAE SOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴多瑟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, DASEUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹泳植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, YOUNGSIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔炳柱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, BYUNG JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供絕緣膜，包括含有樹脂組成物和溶劑的絕緣層，其中溶劑的含量限制在特定範圍內。絕緣膜在顯示改善的處理性能的同時，隨後實現優異的剝離強度和/或熱膨脹係數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an insulating film including an insulating layer containing a resin composition and a solvent, wherein the content of the solvent is limited to a specific range. The insulating film realizes excellent peel strength and/or coefficient of thermal expansion subsequently while showing improved handling property.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1893" publication-number="202616799">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616799</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138671</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>線纜背板殼體及線纜背板</chinese-title>
        <english-title>CABLE BACK PLATE HOUSING AND CABLE BACK PLATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251110B">H05K7/10</main-classification>
        <further-classification edition="200601120251110B">H05K7/12</further-classification>
        <further-classification edition="202501120251110B">H05K5/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立訊技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宏基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HONGJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>苟中凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOU, ZHONGFA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李興玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XINGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明屬於通訊技術領域，提供了一種線纜背板殼體及線纜背板。線纜背板殼體包括殼體、面板及立板，該殼體的一側設有開口，另一側設有多個第一通孔；面板設於該開口，並連接於該殼體，該面板設有用於安裝連接器主體的安裝孔；立板設有多個且均位於該殼體內，該立板的一端連接於該面板，另一端設有第一螺紋孔，多個該第一通孔與多個該第一螺紋孔一一對應，第一螺栓的一端穿過該第一通孔並連接於該第一螺紋孔中，另一端用於連接通訊設備的櫃體。本發明提供的線纜背板殼體及線纜背板，能夠具有較低的成本和較小的重量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure relates to the technical field of communication and discloses a cable back plate housing and a cable back plate. The cable back plate housing includes a housing, a face plate and a vertical plate. One side of the housing is provided with an opening, and the other side of the housing is provided with a plurality of first through holes. The face plate is disposed on the opening and is connected to the housing. The panel is provided with a mounting hole for mounting a connector body. The plurality of vertical plates are located in the housing. One end of the vertical plate is connecting to the face plate, the other end of the vertical plate is provided with a first threaded hole. The plurality of first through holes are corresponded to the plurality of first threaded holes one by one. One end of a first bolt is passed through the first through hole and is connected to the first threaded hole, and the other end of the first bolt is used to connect to the body of a cabinet. The cable back plate housing and the cable back plate of the disclosure have lower cost and smaller weight.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:面板</p>
        <p type="p">200:連接器模組</p>
        <p type="p">300:立板組件</p>
        <p type="p">400:殼體</p>
        <p type="p">600:把手</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1894" publication-number="202616809">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616809</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138673</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>面板、線纜背板殼體及線纜背板</chinese-title>
        <english-title>FACE PLATE, CABLE BACK PLATE HOUSING AND CABLE BACK PLATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251110B">H05K13/04</main-classification>
        <further-classification edition="200601120251110B">H05K13/06</further-classification>
        <further-classification edition="202501120251110B">H05K5/13</further-classification>
        <further-classification edition="200601120251110B">H05K7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立訊技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宏基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HONGJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>苟中凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOU, ZHONGFA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李興玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XINGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種面板、線纜背板殼體及線纜背板，面板包括首尾連接的多個板體，板體開設有多個安裝孔，多個安裝孔沿板體的長度方向間隔設置；在相連接的兩個板體中的第一者設有第一連接部，第二者設有第二連接部，第一連接部與第二連接部在板體的厚度方向相對設置，第一連接部朝向第二連接部的表面設有預裝凹槽，第二連接部朝向第一連接部的表面設有預裝凸起，預裝凸起置於預裝凹槽中，第一連接部和第二連接部均設有定位孔，兩個定位孔中穿設有定位銷，第一連接部和第二連接部透過第三連接件連接。本發明的面板具有較低公差和較高可靠性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A face plate, a cable back plate housing and a cable back plate are disclosed. The face plate includes a plurality of plate bodies connected in series from end to end. The plate body is provided with a plurality of mounted holes. The plurality of mounted holes are disposed at intervals along a length direction of the plate body. One of the two connected plate bodies is provided with a first connecting portion, and the other is provided with a second connecting portion. The first connecting portion and the second connecting portion are disposed oppositely in a thickness direction of the plate body. The surface of the first connecting portion facing the second connecting portion is provided with a pre-mounted slot. The surface of the second connecting portion facing the first connecting portion is provided with a pre-mounted bump. The pre-mounted bump is located in the pre-mounted slot. Both of the first connecting portion and the second connecting portion are provided with a locating hole. A locating pin is penetrated through the locating holes. The first connecting portion and the second connecting portion are connected through a third connecting element. The face plate of the disclosure has lower tolerance and higher reliability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:安裝孔</p>
        <p type="p">12a:第一板體</p>
        <p type="p">12b:第二板體</p>
        <p type="p">12c:第三板體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1895" publication-number="202616579">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616579</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138675</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>固定連接器及連接器模組</chinese-title>
        <english-title>FIXED CONNECTOR AND CONNECTOR MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251023B">H01R13/518</main-classification>
        <further-classification edition="200601120251023B">H01R13/629</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立訊技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宏基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HONGJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>苟中凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOU, ZHONGFA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李興玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XINGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種固定連接器及連接器模組。固定連接器包括底板、蓋板、第一浮動模組、第二浮動模組和連接器主體，底板設有第一裝配孔；蓋板設有與第一裝配孔連通的第二裝配孔；第一浮動模組設置於底板並與面板連接，底板透過第一浮動模組在第一方向和第二方向相對於面板浮動；第二浮動模組連接於蓋板及底板，蓋板透過第二浮動模組在第三方向上相對於底板浮動；連接器主體穿設於第一裝配孔及第二裝配孔，且設有夾設在蓋板和底板之間的限位部。本發明的固定連接器及連接器模組具有較高的通用性，對插箱上的活動連接器的要求較低，易於對插。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fixed connector and a connector module are disclosed. The fixed connector includes a bottom plate, a cover plate, a first floating module, a second floating module and a connector body. The bottom plate is provided with a first assembly hole. The cover plate is provided with a second assembly hole connected to the first assembly hole. The first floating module is disposed on the bottom plate and connected to a face plate. The bottom plate is floated relative to the face plate in a first direction and a second direction through the first floating module. The second floating module is connected to the cover plate and the bottom plate. The cover plate is floated relative to the bottom plate in a third direction through the second floating module. The connector body is penetrated through the first assembly hole and the second assembly hole. A limiting portion is disposed between the cover plate and the bottom plate. The fixed connector and the connector module of the disclosure have higher versatility and lower requirement for the moving connector on the plug-in box. The fixed connector and the connector module are easy to plug in.</p>
      </isu-abst>
      <representative-img>
        <p type="p">210:支撐組件</p>
        <p type="p">211:底板</p>
        <p type="p">2112:安裝區域</p>
        <p type="p">2113:連接區域</p>
        <p type="p">212:蓋板</p>
        <p type="p">213:連接器主體</p>
        <p type="p">214:導向件</p>
        <p type="p">2212:第一連接件</p>
        <p type="p">222:第二浮動模組</p>
        <p type="p">2221:第二連接件</p>
        <p type="p">2222:彈性件</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
        <p type="p">Z:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1896" publication-number="202616802">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616802</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138676</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>線纜背板及通訊設備</chinese-title>
        <english-title>CABLE BACK PLATE AND COMMUNICATION EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">H05K7/14</main-classification>
        <further-classification edition="200601120251201B">H05K5/02</further-classification>
        <further-classification edition="200601120251201B">H05K5/03</further-classification>
        <further-classification edition="202501120251201B">H05K5/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立訊技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宏基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HONGJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>苟中凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOU, ZHONGFA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李興玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XINGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種線纜背板及通訊設備，線纜背板包括面板及連接器模組，面板開設有多個安裝孔；多個連接器模組與多個安裝孔一一對應，各連接器模組包括支撐組件、連接器主體和浮動組件，支撐組件設有與安裝孔連通的裝配孔，連接器主體穿過對應的安裝孔及裝配孔，支撐組件透過浮動組件在第一方向及第二方向上浮動連接於面板，連接器主體透過浮動組件在第三方向上浮動連接於支撐組件，使連接器主體能在第一方向、第二方向及第三方向上相對於面板浮動；本發明降低對活動連接器的位置偏差要求，保證多個連接器主體與多個活動連接器同時插接到位。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cable back plate and a communication equipment are disclosed. The cable back plate includes a face plate and a connector module. The cable back plate is provided with a plurality of mounted holes. A plurality of connector modules correspond to the plurality of mounted holes. Each connector module includes a support component, a connector body and a floating component. The support component is provided with an assembly hole connected to the mounted hole. The connector body is penetrated through the corresponding mounted hole and assembly hole. The support component is floating connected to the face plate in a first direction and a second direction through the floating component. The connector body is floating connected to the support component in a third direction through the floating component. The connector body is floated relative to the face plate in the first direction, the second direction and the third direction. The disclosure reduces the position deviation requirement of the moving connector and ensures that the plurality of connector bodies and the plurality of moving connectors are plugged into place at the same time.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:面板</p>
        <p type="p">200:連接器模組</p>
        <p type="p">213:連接器主體</p>
        <p type="p">220:浮動組件</p>
        <p type="p">300:立板組件</p>
        <p type="p">400:殼體</p>
        <p type="p">420:開口</p>
        <p type="p">600:把手</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1897" publication-number="202616028">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616028</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138707</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無人機群任務規劃方法及無人機群系統</chinese-title>
        <english-title>UNMANNED AERIAL VEHICLE SWARM MISSION PLANNING METHOD AND UNMANNED AERIAL VEHICLE SWARM SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120251114B">G05D1/69</main-classification>
        <further-classification edition="202401120251114B">G05D1/644</further-classification>
        <further-classification edition="202401120251114B">G05D1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立虎尾科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL FORMOSA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李孟澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MENG-TSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊明龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, MING-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, BOR-YEU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝哲瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHE-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳國正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, KUO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李安益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, AN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種無人機群任務規劃方法，用於複數台無人機，該無人機群任務規劃方法包含有：獲得對應複數個目標的複數個目標位置、對應該複數台無人機的複數個無人機位置和一飛行距離限制；以及根據該複數個目標位置、該複數個無人機位置和該飛行距離限制，利用一第一演算法獲得對應該複數台無人機的複數個飛行路徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A drone swarm mission planning method for a plurality of drones includes: obtaining a plurality of target positions corresponding to a plurality of targets, a plurality of drone positions corresponding to the plurality of drones, and a flight distance limit; and obtaining a plurality of flight paths corresponding to the plurality of drones using a first algorithm according to the plurality of target positions, the plurality of drone positions and the flight distance limit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S200,S202,S204,S206,S208:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1898" publication-number="202614977">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614977</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138713</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>治療器具</chinese-title>
        <english-title>TREATMENT INSTRUMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251130B">A61B17/56</main-classification>
        <further-classification edition="200601120251130B">A61F2/44</further-classification>
        <further-classification edition="200601120251130B">A61B18/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本脊椎紀事股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPINE CHRONICLE JAPAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米澤則隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEZAWA, NORITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉信金</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種治療器具，包含椎體穿孔引導件和椎體加工器具，如以下那樣構成。椎體穿孔引導件呈沿著中心軸的中空的筒形，沿著上述中心軸從近位側按順序具有前端刮鏟部、中間部以及末端部，前端刮鏟部在與中心軸垂直的方向開口，末端部在與中心軸垂直的方向具有開口部。中間部的上下方向的內徑大於前端刮鏟部的內徑。椎體加工器具呈棒狀，具有沿著中心軸向下方向彎曲的彎曲部，從末端部沿著中心軸被插入椎體穿孔引導件，在沿著中心軸通過中間部時，前端從前端刮鏟部的開口突出。提供安全的治療器具，在骨折的經皮的椎體形成術、利用骨水泥預防性地加強椎體的手術中，能夠將皮膚的切開限定為最小限度，並且準確地挖削意圖到椎體內的各個角落的位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a treatment instrument comprising a vertebral perforation guide and a vertebral processing instrument, constructed as follows. The vertebral perforation guide has a hollow cylindrical shape along the central axis, and has a front scraping portion, a middle portion, and a distal portion in order from the proximal side along the central axis. The front scraping portion opens in a direction perpendicular to the central axis, and the distal portion has an opening in a direction perpendicular to the central axis. The inner diameter of the middle part in the vertical direction is larger than the inner diameter of the front scraping part. The vertebral processing tool is rod-shaped and has a curved portion that bends downward along the central axis. It is inserted into the vertebral perforation guide from the end along the central axis, and when passing through the middle portion along the central axis, the front end protrudes from the opening of the front scraping part. Provide safe treatment equipment that can minimize skin incision and accurately excavate to every corner of the vertebral body during percutaneous vertebral body formation surgery for fractures and preventive vertebral body strengthening surgery using bone cement.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11-1:開口部</p>
        <p type="p">11-2:開口部</p>
        <p type="p">11-3:開口部</p>
        <p type="p">12:前端刮鏟部</p>
        <p type="p">13:中間部</p>
        <p type="p">14:末端部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1899" publication-number="202616409">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616409</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138736</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>設置有測量距半導體晶圓距離的裝置的測量系統</chinese-title>
        <english-title>MEASUREMENT SYSTEM PROVIDED WITH MEANS FOR MEASURING A DISTANCE FROM THE SEMICONDUCTOR WAFER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/66</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商探針科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECHNOPROBE S. P. A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿佩羅　達維德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPELLO, DAVIDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋托裡　裡卡爾多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VETTORI, RICCARDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托達羅　西蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TODARO, SIMONE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒙泰基奧　巴爾托洛梅歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONTRUCCHIO, BARTOLOMEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝爾納迪　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERNARDI, PAOLO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安吉奧內　法蘭西斯柯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANGIONE, FRANCESCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福斯卡爾　托馬索</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOSCALE, TOMMASO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇建太</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述了一種用於測試整合在半導體晶圓上的被測器件的測量系統（100），其包括：多個接觸元件，這些接觸元件設置有至少一個第一端部，適於與被測器件的相應接觸焊盤接觸；光學感測器，包括光源，該光源被配置為向半導體晶圓或被測器件發射光；和檢測器，以距離光源的給定相對距離佈置，並被配置為收集從半導體晶圓或被測器件反射的光，以及基於收集的反射光生成信號；以及控制單元，與光學感測器操作地連接，並被配置為基於檢測器的信號測量距離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A measurement system (100) for testing a device under test integrated on a semiconductor wafer is herein described, having a plurality of contact elements provided with at least one first end portion adapted to contact a corresponding contact pad of the device under test, an optical sensor comprising a light source configured to emit light towards the semiconductor wafer or the device under test and a detector which is arranged at a given relative distance from the light source and is configured to collect the light reflected from the semiconductor wafer or the device under test and to generate a signal based on the collected reflected light, and a control unit which is in operative communication with the optical sensor and is configured to measure a distance based on the signal of the detector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:接觸元件</p>
        <p type="p">10a:第一端部</p>
        <p type="p">10b:第二相反端部</p>
        <p type="p">20:介面板(PCB)</p>
        <p type="p">40:下導向件</p>
        <p type="p">40h:下導向孔</p>
        <p type="p">40h’:開口</p>
        <p type="p">50:上導向件</p>
        <p type="p">50h:上導向孔</p>
        <p type="p">50h’:開口</p>
        <p type="p">60:光學感測器</p>
        <p type="p">60a:光源</p>
        <p type="p">60b:檢測器</p>
        <p type="p">70h:針孔</p>
        <p type="p">100:測量系統</p>
        <p type="p">D:距離</p>
        <p type="p">d:距離</p>
        <p type="p">DUT:被測器件</p>
        <p type="p">DUTa:接觸焊盤</p>
        <p type="p">H-H:縱軸</p>
        <p type="p">P:參考位置</p>
        <p type="p">P’:位置</p>
        <p type="p">SW:半導體晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1900" publication-number="202616025">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616025</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138747</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無人機任務規劃方法及無人機系統</chinese-title>
        <english-title>UNMANNED AERIAL VEHICLE MISSION PLANNING METHOD AND UNMANNED AERIAL VEHICLE SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120251031B">G05D1/644</main-classification>
        <further-classification edition="202401120251031B">G05D1/69</further-classification>
        <further-classification edition="202401320251031B">G05D109/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立虎尾科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL FORMOSA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李孟澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MENG-TSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, BOR-YEU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊明龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, MING-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俐吟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LI-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳盛祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SHENG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種無人機任務規劃方法，用於一無人機，該無人機群任務規劃方法包含有獲得複數個環境資訊、對應一目標的一目標位置、對應該無人機的一無人機位置和一飛行距離限制；以及根據該複數個環境資訊、該目標位置、該無人機位置和該飛行距離限制，利用一第一演算法獲得對應該無人機的一飛行路徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A drone mission planning method is provided for a drone. The drone swarm mission planning method includes obtaining a plurality of environmental information, a target position corresponding to a target, a drone position corresponding to the drone, and a flight distance limit; and using a first algorithm to obtain a flight path corresponding to the drone based on the plurality of environmental information, the target position, the drone position, and the flight distance limit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100,S102,S104,S106,S108:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1901" publication-number="202616116">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616116</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138816</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於驗證儲存完整性之基於硬體之線內雜湊的系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR HARDWARE-BASED INLINE HASHING FOR VERIFYING STORAGE INTEGRITY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260102B">G06F21/64</main-classification>
        <further-classification edition="200601120260102B">H04L9/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商谷歌有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOOGLE LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李澈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　艾許　巴特　喬里斯　阿諾德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN ASSCHE, BART JORIS ARNOLD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕泰莎瑞西　朗格普里亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARTHASARATHY, RANGAPRIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　在極</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JAEGEUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴維西蓋曼尼　維諾斯　庫馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEIVASIGAMANI, VINOTH KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本技術係關於用於使用基於硬體之線內雜湊來執行資料完整性驗證之系統及方法。在一些態樣中，一種系統包括一儲存裝置、記憶體及與儲存裝置及記憶體通信之一基於硬體之密碼引擎。密碼引擎經組態以針對自儲存裝置擷取之資料產生一計算出之雜湊，且將資料之至少一子集連同計算出之雜湊一起儲存於記憶體中。在一些態樣中，將所儲存雜湊自儲存裝置複製至記憶體中，且系統經組態以藉由將計算出之雜湊與所儲存雜湊進行比較來驗證資料之完整性。在一些態樣中，密碼引擎經組態以在資料自儲存裝置至記憶體之一傳送期間至少部分地產生計算出之雜湊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The technology relates to systems and methods for performing data integrity verification using hardware-based inline hashing. In some aspects, a system includes a storage device, memory, and a hardware-based cryptographic engine in communication with the storage device and memory. The cryptographic engine is configured to generate a computed hash for data retrieved from the storage device and to store at least a subset of the data along with the computed hash in the memory. In some aspects, the stored hash is replicated into the memory from the storage device, and the system is configured to verify the integrity of the data by comparing the computed hash to the stored hash. In some aspects, cryptographic engine is configured to generate the computed hash at least partially during a transfer of the data from the storage device to memory.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">110:系統單晶片</p>
        <p type="p">112:中央處理單元</p>
        <p type="p">114:記憶體控制器</p>
        <p type="p">116:儲存控制器</p>
        <p type="p">117:密碼引擎/基於硬體之密碼引擎</p>
        <p type="p">118:通信層</p>
        <p type="p">120:隨機存取記憶體/記憶體</p>
        <p type="p">130:儲存裝置</p>
        <p type="p">138:通信層</p>
        <p type="p">140:資料</p>
        <p type="p">140':資料之子集</p>
        <p type="p">141:所儲存雜湊</p>
        <p type="p">142:雜湊/密碼雜湊值/計算出之雜湊值/計算出之雜湊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1902" publication-number="202616847">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616847</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138829</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高電子遷移率電晶體之製造方法</chinese-title>
        <english-title>METHOD FOR MANUFACTURING HIGH ELECTRON MOBILITY TRANSISTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251020B">H10D30/01</main-classification>
        <further-classification edition="202501120251020B">H10D30/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>超赫科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ULTRABAND TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳展興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHAN-SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種高電子遷移率電晶體之製造方法，其包含以下步驟：提供一半導體基板；於該半導體基板上方形成一p型層；於該p型層上方對應一閘極開口的位置形成一保護層；以及於該p型層上方及該保護層周圍形成一覆蓋層，並去除該保護層以形成該閘極開口；其中，該覆蓋層的材質係未摻雜或非故意摻雜之氮化鎵或氮化鋁鎵。相較於先前技術，該製造方法簡化了整體製程還降低了技術門檻，並且能夠個別地控制及獲得良好的閾值電壓(Vth)以及導通阻抗(Rds(ON))，更能夠有效地提高產品良率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a method for manufacturing a high electron mobility transistor, which includes the following steps: providing a semiconductor substrate; forming a p-type layer above the semiconductor substrate; forming a protective layer above the p-type layer at a position corresponding to a gate opening; forming an overlay layer above the p-type layer and around the protective layer, and then removing the protective layer to form the gate opening. The material of the overlay layer is gallium nitride or aluminum gallium nitride that is undoped, unintentionally doped or n-type doped. Compared to prior art, this manufacturing method simplifies the overall process, reduces technical complexity, and enables individually control and obtain ideal Vth and Rds(ON), thereby effectively improving product yield.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100~S106:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1903" publication-number="202616848">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616848</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138830</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高電子遷移率電晶體之製造方法</chinese-title>
        <english-title>METHOD FOR MANUFACTURING HIGH ELECTRON MOBILITY TRANSISTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251020B">H10D30/01</main-classification>
        <further-classification edition="202501120251020B">H10D30/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>超赫科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ULTRABAND TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳展興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHAN-SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種高電子遷移率電晶體之製造方法，其包含以下步驟：提供一半導體基板；於該半導體基板上方對應一閘極開口的位置形成一保護層；於該半導體基板上方及該保護層周圍形成一覆蓋層，並去除該保護層以形成該閘極開口；以及於該閘極開口以及該覆蓋層上方形成一p型層；其中，該覆蓋層的材質未摻雜、非故意摻雜或n型摻雜之氮化鎵或氮化鋁鎵。相較於先前技術，該製造方法簡化了整體製程還降低了技術門檻，並且能夠個別地控制及獲得良好的閾值電壓(Vth)以及導通阻抗(Rds(ON))，更能夠有效地提高產品良率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a manufacturing method for a high electron mobility transistor, which includes the following steps: providing a semiconductor substrate; forming a protective layer at a position corresponding to a gate opening above the semiconductor substrate; forming an overlay layer above the semiconductor substrate and surrounding the protective layer, and removing the protective layer to form the gate opening; and forming a p-type layer above the gate opening and the overlay layer. The material of the overlay layer is gallium nitride or aluminum gallium nitride that is undoped, unintentionally doped or n-type doped. Compared to the prior art, this manufacturing method simplifies the overall process, reduces the technical complexity, and enables individually control and obtain ideal threshold voltage (Vth) and on-state resistance (Rds(ON)), thereby effectively improving product yield.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100~S106:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1904" publication-number="202616849">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616849</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138831</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高電子遷移率電晶體之製造方法</chinese-title>
        <english-title>METHOD FOR MANUFACTURING HIGH ELECTRON MOBILITY TRANSISTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251020B">H10D30/01</main-classification>
        <further-classification edition="202501120251020B">H10D30/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>超赫科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ULTRABAND TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳展興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHAN-SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種高電子遷移率電晶體之製造方法，其包含以下步驟：提供一半導體基板；於該半導體基板上方對應一閘極開口的位置圖案化形成一p型層；於該p型層上方形成一保護層，且該保護層覆蓋部分該p型層；以及於該阻障層及該p型層上方及該保護層周圍形成一覆蓋層，並去除該保護層以形成該閘極開口；其中，該覆蓋層覆蓋該p型層之上表面的至少一部分，且該覆蓋層之材質為未摻雜、非故意摻雜或n型摻雜的氮化鋁鎵。相較於先前技術，該製造方法簡化了整體製程還降低了技術門檻，並且能夠個別地控制及獲得良好的閾值電壓(Vth)以及導通阻抗(Rds(ON))，更能夠有效地提高產品良率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a method for manufacturing a high electron mobility transistor, which includes the following steps: providing a semiconductor substrate; patterning and forming a p-type layer over the semiconductor substrate at a position corresponding to a gate opening; forming a protective layer over the p-type layer, wherein the protective layer covers part of the p-type layer; forming an overlay layer over the barrier layer, the p-type layer, and around the protective layer; and removing the protective layer to form the gate opening. The overlay layer covers at least a portion of the upper surface of the p-type layer, and the material of the overlay layer is undoped, unintentionally doped or n-type doped aluminum gallium nitride. Compared to prior art, this manufacturing method simplifies the overall process, reduces technical complexity, and enables individually control and obtain ideal threshold voltage (Vth) and on-state resistance (Rds(ON)), thereby effectively improving product yield.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100~S106:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1905" publication-number="202615174">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615174</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138864</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>輕壓下裝置及連續鑄造機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B22D11/06</main-classification>
        <further-classification edition="200601120260102B">B22D11/12</further-classification>
        <further-classification edition="200601120260102B">B22D11/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JFE STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒牧則親</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAMAKI, NORICHIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>入江脩平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRIE, SHUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日当洸介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HINATA, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>外石圭吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOISHI, KEIGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鎌田航平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMADA, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠在適當的狀態下製造鑄片的輕壓下裝置及連續鑄造機。一種輕壓下裝置，具有輕壓下部，所述輕壓下部包括配置於連續鑄造機的輕壓下帶且相互相向地配置的至少一對輕壓下輥。輕壓下裝置中，所述一對輕壓下輥具有：支撐軸部；以及一個或多個輥部，能夠繞所述支撐軸部的軸旋轉地安裝於所述支撐軸部。在所述一對輕壓下輥的至少一者的所述輥部的表面沿著周向形成有一個或多個凸部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:鋼水</p>
        <p type="p">11:鑄片</p>
        <p type="p">11a:未凝固層</p>
        <p type="p">11b:凝固殼</p>
        <p type="p">13:凝固完成位置</p>
        <p type="p">20:餵槽</p>
        <p type="p">21:浸漬噴嘴</p>
        <p type="p">22:滑動噴嘴</p>
        <p type="p">30:鑄模</p>
        <p type="p">40:輥部</p>
        <p type="p">41:支承輥</p>
        <p type="p">42:引導輥</p>
        <p type="p">43:輕壓下輥</p>
        <p type="p">44:輕壓下帶</p>
        <p type="p">45:輕壓下部</p>
        <p type="p">50:搬送輥</p>
        <p type="p">60:鑄片切斷機</p>
        <p type="p">100:連續鑄造機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1906" publication-number="202615138">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615138</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138871</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電去離子裝置的控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">B01D61/48</main-classification>
        <further-classification edition="200601120251201B">B01D61/54</further-classification>
        <further-classification edition="202301120251201B">C02F1/469</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商栗田工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田部井麗奈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TABEI, RENA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的電去離子裝置的控制方法進行使電去離子裝置1的供給水量變化的運轉。在使自電去離子裝置1排出的濃縮水W5的流量保持為一定的同時，對於供水W0向電去離子裝置1的脫鹽室36的流量，使通水流量以相對於電去離子裝置1的脫鹽室36中的供水的最大流量而為50%/分鐘以下變化。藉由此種電去離子裝置的運轉方法，可防止進行使通水流量變化的運轉時的處理水質下降。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電去離子裝置</p>
        <p type="p">31:陽極(電極)</p>
        <p type="p">32:陰極(電極)</p>
        <p type="p">33:陰離子交換膜</p>
        <p type="p">34:陽離子交換膜</p>
        <p type="p">35:濃縮室</p>
        <p type="p">36:脫鹽室</p>
        <p type="p">37:陽極室</p>
        <p type="p">38:陰極室</p>
        <p type="p">W0:電去離子裝置的供水(脫鹽室供水、供水)</p>
        <p type="p">W2:電去離子裝置的處理水(一次純水、處理水、脫鹽水)</p>
        <p type="p">W4:被濃縮水</p>
        <p type="p">W5:濃縮水</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1907" publication-number="202616497">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616497</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138894</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有直接水冷卻系統的半導體封裝組合件</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE ASSEMBLY WITH DIRECT WATER COOLING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">H01L23/473</main-classification>
        <further-classification edition="200601120251103B">H01L23/31</further-classification>
        <further-classification edition="200601120251103B">H01L23/528</further-classification>
        <further-classification edition="200601120251103B">H01L21/60</further-classification>
        <further-classification edition="200601120251103B">H01L21/71</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商星科金朋私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STATS CHIPPAC PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李知宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JISEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李喜秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HEESOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種半導體封裝組合件，所述半導體封裝組合件包括：第一半導體封裝，所述第一半導體封裝具有從其前表面暴露的至少一個第一電子組件；第二半導體封裝，所述第二半導體封裝堆疊於所述第一半導體封裝上且具有從第二半導體封裝的前表面暴露的至少一個第二電子組件，其中第一半導體封裝和第二半導體封裝在其間界定第一流體通道；以及蓋，所述蓋堆疊於第二半導體封裝上；蓋和第二半導體封裝在其間界定第二流體通道，至少一個第二電子組件暴露於第二流體通道；第二半導體封裝具有穿過其的多個開口以流體地連接第一流體通道與第二流體通道，使得冷卻劑能夠在第一、第二流體通道內流動以將由電子組件生成的熱耗散到半導體封裝組合件之外。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體封裝組合件</p>
        <p type="p">101:第一半導體封裝</p>
        <p type="p">110:第一基板、基板</p>
        <p type="p">110a:前表面</p>
        <p type="p">110b:後表面</p>
        <p type="p">112:包封層</p>
        <p type="p">114:第一流體通道</p>
        <p type="p">116:第二流體通道</p>
        <p type="p">120:第一電子組件、電子組件</p>
        <p type="p">132:閥</p>
        <p type="p">134a:管道</p>
        <p type="p">134b:管道</p>
        <p type="p">136:泵</p>
        <p type="p">138:散熱器</p>
        <p type="p">150:第二基板、基板</p>
        <p type="p">150a:前表面</p>
        <p type="p">150b:後表面</p>
        <p type="p">152:第一開口、開口</p>
        <p type="p">153:第二開口、開口</p>
        <p type="p">160:第二電子組件</p>
        <p type="p">170:黏合層</p>
        <p type="p">172:蓋</p>
        <p type="p">174:支撐部分</p>
        <p type="p">176:流體封閉部分</p>
        <p type="p">178:入口</p>
        <p type="p">179:出口</p>
        <p type="p">180:連接結構</p>
        <p type="p">182:密封環</p>
        <p type="p">190:焊料凸塊、導電凸塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1908" publication-number="202614958">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614958</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138911</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>行走裝置、行走輪機構、移動機器人及機器人系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251124B">A47L11/24</main-classification>
        <further-classification edition="200601120251124B">A47L11/40</further-classification>
        <further-classification edition="200601120251124B">B60K17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, XING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃金虎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JINHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓奕非</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, YIFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李智軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZHIJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>包安寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAO, ANNING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱道文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, DAOWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種行走裝置、移動機器人及機械系統，屬於電器設備的技術領域。行走裝置包括行走輪組件、驅動件和傳動件，行走輪組件包括行走輪，行走輪組件安裝於設備本體傳動件與所述驅動件連接並能夠行走輪組件接合；其中，在傳動件與行走輪組件接合的情況下，傳動件能夠驅動行走輪組件運動，以改變行走輪相對於設備本體的位置。通過傳動件的設置方式使得移動機器人能夠有多種不同的越障方式，提高了設備本體的越障能力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:行走裝置</p>
        <p type="p">112:行走輪</p>
        <p type="p">114:安裝件</p>
        <p type="p">116:接合部</p>
        <p type="p">140:傳動件</p>
        <p type="p">150:復位件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1909" publication-number="202614947">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614947</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138927</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>嬰兒床高度調整</chinese-title>
        <english-title>BASSINET HEIGHT ADJUSTMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A47D13/02</main-classification>
        <further-classification edition="200601120260102B">A47D7/01</further-classification>
        <further-classification edition="200601120260102B">A47D7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彼得Ｒ　塔基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PETER R, TUCKEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安德魯Ｊ　霍斯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDREW J, HORST</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾利克斯　麥爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALEX, MYERS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯蒂斯Ｍ　哈滕斯坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CURTIS M, HARTENSTINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>強納森Ｍ　帕塞拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JONATHAN M, PACELLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>強納森Ｋ　蒙茲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JONATHAN K, MOUNTZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茱莉亞　庫塔賈爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JULIA, CUTAJAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾瑞琳　麥克弗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRELYN, MCIVER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開涉及用於床邊使用的搖籃組件。搖籃組件包括搖籃，其限定第一端部、第二端部和容納區域。搖籃組件還包括供兒童在容納區域內休息的支撐表面。搖籃組件還包括分別靠近搖籃的第一端部和第二端部設置的第一支腳和第二支腳、以及在第一支腳與第二支腳之間延伸的連接臂。搖籃組件還包括能與連接臂以及第一支腳和第二支腳至少其中之一一起操作的高度調節機構。當調節搖籃的第一端部和第二端部其中之一的高度時，高度調節機構被配置為致使搖籃的第一端部和第二端部其中之另一的高度調節為將支撐表面維持在基本水平的定向上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a bassinet assembly for bedside use. The&lt;br/&gt; bassinet assembly includes a bassinet defining a first end, a second end, and a containment area. The bassinet assembly further includes a support surface for a child to rest on within the containment area. The bassinet assembly further includes a first and second legs disposed proximate the first and second ends of the bassinet, respectively, and a connecting arm extending between the first and second legs. The bassinet assembly further includes a height adjustment mechanism operable with the connecting arm and at least one of the first and second legs. When one of the first and second ends of the bassinet is adjusted in height, the height adjustment mechanism is configured to cause the other of the first and second ends of the bassinet to adjust in height to maintain the support surface in a substantially horizontal orientation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:床邊嬰兒床組件</p>
        <p type="p">102:支架</p>
        <p type="p">104:橫向支撐件</p>
        <p type="p">106:上框架</p>
        <p type="p">108:下框架</p>
        <p type="p">107:第一穩定器</p>
        <p type="p">110:嬰兒床</p>
        <p type="p">112:嬰兒床110的第一端</p>
        <p type="p">114:嬰兒床110的第二端</p>
        <p type="p">113:第一角部結構</p>
        <p type="p">115:第二角部結構</p>
        <p type="p">117:加強桿</p>
        <p type="p">119:致動器</p>
        <p type="p">118、120:可調高度的支腳</p>
        <p type="p">122A:輪子</p>
        <p type="p">131:下框架108上的支撐面</p>
        <p type="p">133:圍欄區域</p>
        <p type="p">141:第一樞軸子元件</p>
        <p type="p">143:第二樞軸子元件</p>
        <p type="p">170:第一致動器</p>
        <p type="p">172:第二致動器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1910" publication-number="202615408">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615408</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138976</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感放射線性組成物、抗蝕劑圖案形成方法及化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">C07C309/12</main-classification>
        <further-classification edition="200601120251201B">C07C309/17</further-classification>
        <further-classification edition="200601120251201B">C07C381/12</further-classification>
        <further-classification edition="200601120251201B">C07D307/33</further-classification>
        <further-classification edition="200601120251201B">C07D317/70</further-classification>
        <further-classification edition="200601120251201B">C07D321/10</further-classification>
        <further-classification edition="200601120251201B">C07D333/76</further-classification>
        <further-classification edition="200601120251201B">C07D409/12</further-classification>
        <further-classification edition="200601120251201B">G03F7/004</further-classification>
        <further-classification edition="200601120251201B">G03F7/039</further-classification>
        <further-classification edition="200601120251201B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷口拓弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGUCHI, TAKUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岸田高典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISHIDA, TAKANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白谷宗大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRATANI, MOTOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山川翔也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAKAWA, SHOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種感放射線性組成物，含有具有酸解離性基的聚合物，滿足第一要件及第二要件中的一個以上。第一要件：更含有式（1）所表示的化合物。第二要件：聚合物包含源自式（1）所表示的化合物的結構單元。式（1）中，Ar&lt;sup&gt;1&lt;/sup&gt;為自芳香環中去除（r+s+t+1）個氫原子而成的基。Ar&lt;sup&gt;2&lt;/sup&gt;為自芳香環中去除（k+1）個氫原子而成的基。X&lt;sup&gt;1&lt;/sup&gt;為-O-、-O-CO-、-CO-O-、-S-、-SO-、-SO&lt;sub&gt;2&lt;/sub&gt;-、-O-SO&lt;sub&gt;2&lt;/sub&gt;-或-SO&lt;sub&gt;2&lt;/sub&gt;-O-。R&lt;sup&gt;1&lt;/sup&gt;為一價有機基或氫原子。Y&lt;sup&gt;1&lt;/sup&gt;為與碘基及-X&lt;sup&gt;1&lt;/sup&gt;-R&lt;sup&gt;1&lt;/sup&gt;不同的一價基。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="137px" width="353px" file="ed10042.JPG" alt="ed10042.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1911" publication-number="202615329">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615329</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139055</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>撬頂破壞器之撐開座</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251224B">B66F3/25</main-classification>
        <further-classification edition="200601120251224B">A62B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法妍有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台震機械工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳峻瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林耿本</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李毓庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張朝坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種撬頂破壞器之撐開座，包括包括有本體且於內部具有容置腔，而本體頂側具有外凸體且於內部形成有供抵頂件之接觸部容置的收納槽，於本體與外凸體共同形成有複數抵持部，複數抵持部與位於接觸部上之撐開面形成有可撐開預設物件之間隙的不同間距；而撐開座之外凸體第一側形成上升楔形構造並於其底部形成有第一抵持部；於外凸體呈相對之第三側及第四側底部皆形成有第三抵持部；該二第三抵持部的其中一者底側之外凸處形成有第四抵持部，此撐開座設計有旋轉機制可覆蓋360度範圍使用，具有使用便利性及適用於各種使用環境的優點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:動力單元</p>
        <p type="p">2:傳動模組</p>
        <p type="p">21:套筒</p>
        <p type="p">27:斜面轉輪</p>
        <p type="p">3:泵浦模組</p>
        <p type="p">31:柱塞組</p>
        <p type="p">311:抵接座</p>
        <p type="p">312:柱塞</p>
        <p type="p">313:彈簧</p>
        <p type="p">314:圓珠</p>
        <p type="p">315:蓋體</p>
        <p type="p">32:封蓋</p>
        <p type="p">320:液壓輸出口</p>
        <p type="p">4:推移模組</p>
        <p type="p">41:推桿</p>
        <p type="p">42:活塞</p>
        <p type="p">43:彈性件</p>
        <p type="p">5:抵頂件</p>
        <p type="p">51:連接部</p>
        <p type="p">52:接觸部</p>
        <p type="p">521:撐開面</p>
        <p type="p">6:撐開座</p>
        <p type="p">60:容置腔</p>
        <p type="p">61:本體</p>
        <p type="p">611:第四抵持部</p>
        <p type="p">612:第五抵持部</p>
        <p type="p">62:外凸體</p>
        <p type="p">621:收納槽</p>
        <p type="p">622:第一抵持部</p>
        <p type="p">623:敲擊部</p>
        <p type="p">624:第二抵持部</p>
        <p type="p">625:第三抵持部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1912" publication-number="202615621">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615621</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139062</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>帶剝離片ＦＡ的研磨墊固定用黏著片、帶剝離片ＦＡ及剝離片ＦＢ的研磨墊固定用黏著片及其製造方法、帶剝離片ＦＡ及黏著層Ａ的研磨墊、以及經由黏著片將研磨墊固定在平台的方法</chinese-title>
        <english-title>ADHESIVE SHEET FOR FIXING POLISHING PADS WITH RELEASE SHEET FA, ADHESIVE SHEET FOR FIXING POLISHING PADS WITH RELEASE SHEETS FA AND FB, AND METHOD FOR PRODUCING THE SAME, POLISHING PAD WITH RELEASE SHEET FA AND ADHESIVE LAYER A, AND METHOD FOR FIXING POLISHING PAD TO POLISHING PLATE VIA ADHESIVE SHEET</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C09J133/08</main-classification>
        <further-classification edition="201801120260102B">C09J7/20</further-classification>
        <further-classification edition="201801120260102B">C09J7/25</further-classification>
        <further-classification edition="201801120260102B">C09J7/38</further-classification>
        <further-classification edition="201801120260102B">C09J7/40</further-classification>
        <further-classification edition="201201120260102B">B24B37/12</further-classification>
        <further-classification edition="200601120260102B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商愛天思股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARTIENCE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東洋科美股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOCHEM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木玲二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, REIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於將研磨墊固定在平台的帶剝離片的雙面黏著片，其為面向高精密的CMP加工的帶剝離片的研磨墊固定用黏著片，並且容易進行重貼位置調整，空氣排出性優異，黏著物性亦優異。本發明的課題可藉由如下帶剝離片FA的研磨墊固定用黏著片（1）來解決，所述黏著片（1）具有剝離片FA/黏著層A/片狀基材F/黏著層B的積層結構，剝離片FA的與黏著層A不相接的外側的表面（11）具有凹凸，且剝離片FA外側與該剝離片FA內側反轉後的形狀相同，在貝克平滑度試驗中，在特定的條件1下求出的剝離片FA外側的表面的平滑度為0.1秒～30秒，在特定的條件2下求出的剝離片FA外側的表面的平滑度為1秒～500秒。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:帶剝離片FA的研磨墊固定用黏著片</p>
        <p type="p">5:研磨墊固定用黏著片/黏著片</p>
        <p type="p">A:黏著層</p>
        <p type="p">B:黏著層</p>
        <p type="p">F:片狀基材</p>
        <p type="p">FA:覆蓋黏著層A的表面的剝離片/剝離片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1913" publication-number="202614963">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614963</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139076</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可撓式內視鏡支架</chinese-title>
        <english-title>A HOLDER FOR A FLEXIBLE ENDOSCOPE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">A61B1/00</main-classification>
        <further-classification edition="200601120260115B">A61B1/012</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商巧捷力醫療機器人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGILIS ROBOTICS LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭　嘉威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWOK, KA-WAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何　迪朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, JUSTIN DI-LANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂　家熾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUI, KA-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何美瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種內視鏡控制器的支架。該支架包含一環狀承架，可使該控制器較窄的部分插入其中，並使控制器較寬的部分放置於該環狀承架上。該環狀承架固定於一機械臂的頂端，該機械臂可與置於環狀承架中的控制器共同移動。支架與機械臂之間的連接關係，使控制器能繞三個相互正交的樞軸或其等效形式進行角向運動。該支架具有一固定鎖定狀態，可將控制器支撐於空中位置，以及一可動解鎖狀態，在此狀態下，外科醫生可以像往常一樣自由地握持、移動並使用該控制器，而不受限制。因此，實施例提供一種可即時抓持控制器的支架，使控制器能固定在機械臂可及範圍內的任意空中位置，外科醫生僅需鎖定並固定支架即可。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A holder for the controller of an endoscope. The holder comprises a funnel into which the narrower portion of the controller can be inserted so that the wider portion of the controller sits on the funnel. The funnel is held at the top of a mechanical arm that can be moved along with the controller held in the funnel. The connection between the holder and the mechanical arm provides angular movements of the controller about three mutually orthogonal pivots or equivalent. The holder has an immobilized, locked state to support the controller in a position mid-air, and a mobile, unlocked state during which the controller can be held, moved and used by the surgeon in the regular manner, freely without restraint. Therefore, the embodiment provides a ready support for holding the controller in in any position in mid-air within the reach of the mechanical arm, as all that the surgeon needs to do is to lock and immobilize holder.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1914" publication-number="202614984">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614984</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139098</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>近視或老花訓練裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251130B">A61H5/00</main-classification>
        <further-classification edition="200601120251130B">A61B3/032</further-classification>
        <further-classification edition="200601120251130B">A61F9/007</further-classification>
        <further-classification edition="200601120251130B">A61H39/00</further-classification>
        <further-classification edition="200601120251130B">A61N5/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商麥寶科技私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METABRAIN TECHNOLOGY PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷文芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭士賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李信達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SHIN-DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種近視或老花訓練裝置，包括支架單元、虛擬顯示單元、音頻刺激單元、經顱刺激單元和控制單元；所述支架單元包括頂側部、後側部和兩個耳部；所述虛擬顯示單元包括顯示眼鏡；所述音頻刺激單元包括兩個揚聲器；所述經顱刺激單元包括四個第一刺激媒介，所述控制單元電連接所述顯示眼鏡、所述揚聲器和所述第一刺激媒介；本發明所提供的近視或老花訓練裝置能夠通過設置的顯示眼鏡、揚聲器和第一刺激媒介，在單次療程中對使用者進行多種刺激，達到降低使用者的眼壓和增加使用者的視覺敏銳度的交互和加乘效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:支架單元</p>
        <p type="p">11:耳部</p>
        <p type="p">13:後側部</p>
        <p type="p">2:虛擬顯示單元</p>
        <p type="p">21:顯示眼鏡</p>
        <p type="p">3:音頻刺激單元</p>
        <p type="p">4:眼罩單元</p>
        <p type="p">41:眼罩本體</p>
        <p type="p">42:眼部周圍激光隔絕墊圈</p>
        <p type="p">43:眼周穴位激光熱灸元件</p>
        <p type="p">5:穴位刺激單元</p>
        <p type="p">51:頭穴位媒介</p>
        <p type="p">6:經顱刺激單元</p>
        <p type="p">61:第一刺激媒介</p>
        <p type="p">62:第二刺激媒介</p>
        <p type="p">611:延伸架</p>
        <p type="p">612:安裝座</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1915" publication-number="202614985">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614985</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139099</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>弱視訓練裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251130B">A61H5/00</main-classification>
        <further-classification edition="200601120251130B">A61B3/032</further-classification>
        <further-classification edition="200601120251130B">A61N5/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商麥寶科技私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METABRAIN TECHNOLOGY PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷文芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭士賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李信達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SHIN-DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明弱視訓練裝置，包括支架單元、虛擬顯示單元、濾鏡單元、音頻刺激單元、經顱刺激單元和控制單元，所述支架單元包括頂側部、後側部和耳部，所述虛擬顯示單元包括顯示眼鏡，所述濾鏡單元包括鏡架、第一濾鏡和第二濾鏡，所述音頻刺激單元包括兩個揚聲器，所述經顱刺激單元連接於所述後側部，所述控制單元電連接所述顯示眼鏡、所述揚聲器和所述經顱刺激單元，本發明提供的弱視裝置能夠通過設置的顯示眼鏡、揚聲器、第一濾鏡、第二濾鏡和經顱刺激單元，對使用者進行多種刺激，達到活化使用者的視覺中樞以交互和加乘增加弱視者的視覺敏銳度的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:支架單元</p>
        <p type="p">11:耳部</p>
        <p type="p">12:頂側部</p>
        <p type="p">13:後側部</p>
        <p type="p">21:虛擬顯示單元</p>
        <p type="p">211:顯示眼鏡</p>
        <p type="p">22:濾鏡單元</p>
        <p type="p">221:鏡架</p>
        <p type="p">222:第一濾鏡</p>
        <p type="p">223:第二濾鏡</p>
        <p type="p">3:音頻刺激單元</p>
        <p type="p">4:眼罩單元</p>
        <p type="p">41:眼罩本體</p>
        <p type="p">42:眼部周圍發熱件</p>
        <p type="p">43:穴位發熱件</p>
        <p type="p">5:穴位刺激單元</p>
        <p type="p">51:頭穴位媒介</p>
        <p type="p">6:經顱刺激單元</p>
        <p type="p">61:第一磁刺激媒介</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1916" publication-number="202616748">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616748</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139101</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資訊處理方法、資訊處理裝置、程式、及無線通訊裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260102B">H04W48/18</main-classification>
        <further-classification edition="200901120260102B">H04W24/02</further-classification>
        <further-classification edition="201801120260102B">H04W4/029</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商豐田自動車股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOTA JIDOSHA KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵校</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAO, XIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本賢一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">由核心網路內的第1之NF(Network Function)，從第1之UE(User Equipment)、或與前記第1之UE進行通訊的通訊裝置，取得將前記第1之UE的通訊環境進行感測所得之感測資料；並由第2之NF，基於前記感測資料的分析結果，而將前記第1之UE的通訊會談中所被適用之原則規則，予以生成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:UE</p>
        <p type="p">20:RAN</p>
        <p type="p">30:UPF</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1917" publication-number="202615846">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615846</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139133</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>量子感測器裝置</chinese-title>
        <english-title>QUANTUM SENSOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G01N21/64</main-classification>
        <further-classification edition="200601120260102B">H01L21/265</further-classification>
        <further-classification edition="200601120260102B">H01L21/324</further-classification>
        <further-classification edition="202501120260102B">H10D62/40</further-classification>
        <further-classification edition="202501120260102B">H10D62/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商量子鑽石有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUANTUMDIAMONDS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布赫　多明尼克　Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUCHER, DOMINIK BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿勒特　羅賓　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALLERT, ROBIN DEREK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於使用螢光對一磁場之依賴性來量測該磁場之量子感測器裝置，該量子感測器裝置(18)包含由單晶金剛石製成之一基體及該基體中之氮原子，該等氮原子部分地以帶負電的氮空位(NV&lt;sup&gt;-&lt;/sup&gt;)中心之形式存在，其中NV&lt;sup&gt;-&lt;/sup&gt;中心之濃度對該基體中之該等氮原子之濃度的比率為至多1.4%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention refers to a quantum sensor device for measuring a magnetic field using fluorescence dependence on the magnetic field, the quantum sensor device (18) comprising a substrate made of single-crystal diamond, and nitrogen atoms in the substrate, the nitrogen atoms being partially present in the form of negatively charged nitrogen-vacancy (NV&lt;sup&gt;-&lt;/sup&gt;) centres, wherein a ratio of the concentration of NV&lt;sup&gt;-&lt;/sup&gt; centres to the concentration of the nitrogen atoms in the substrate is at most 1.4%.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1918" publication-number="202616256">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616256</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139227</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示面板和顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120251103B">G09G3/32</main-classification>
        <further-classification edition="200601120251103B">G09G3/36</further-classification>
        <further-classification edition="200601120251103B">H01L23/528</further-classification>
        <further-classification edition="202501120251103B">H10D84/83</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國商京東方科技集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOE TECHNOLOGY GROUP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國商成都京東方光電科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐鹏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>刘庭良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TINGLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>张超群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHAOQUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周于入</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, YURU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖茂颖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, MAOYING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施昆雁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, KUNYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范真瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, ZHENRUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>路山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及顯示技術領域，提出一種顯示面板和顯示裝置，顯示面板包括：襯底基板、多個像素驅動電路組、多條行向初始信號線、多條列向初始信號線。在第x列向初始信號線對應的像素驅動電路組所在的區域中，x區中所有遮光結構在襯底基板上的正投影的面積為S1；在第y列向初始信號線對應的像素驅動電路組所在的區域中，x區中所有遮光結構在襯底基板上的正投影的面積為S2，S1和S2相同或大致相同；第x列向初始信號線在襯底基板上的正投影和與其最近的第y列向初始信號線在襯底基板上的正投影之間的距離小於270μm或大於700μm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">HQ2:第二過孔連接區</p>
        <p type="p">HQ3:第三過孔連接區</p>
        <p type="p">HQx:x區</p>
        <p type="p">Pix:像素驅動電路</p>
        <p type="p">Pz:像素驅動電路組</p>
        <p type="p">VBx1:第x1過孔連接部</p>
        <p type="p">Vinit1H:第一行向初始信號線</p>
        <p type="p">Vinit1V:第一列向初始信號線</p>
        <p type="p">Vinit2H:第二行向初始信號線</p>
        <p type="p">Vinit2V:第二列向初始信號線</p>
        <p type="p">Vinit3H:第三行向初始信號線</p>
        <p type="p">Vinit3V:第三列向初始信號線</p>
        <p type="p">VinitH:行向初始信號線</p>
        <p type="p">VinitHx:第x行向初始信號線</p>
        <p type="p">VinitHy:第y行向初始信號線</p>
        <p type="p">VinitV:列向初始信號線</p>
        <p type="p">VinitVx:第x列向初始信號線</p>
        <p type="p">VinitVy:第y列向初始信號線</p>
        <p type="p">X:行方向</p>
        <p type="p">Y:列方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1919" publication-number="202615351">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615351</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139263</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種SCM-45分子篩及其製備方法和用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C01B39/46</main-classification>
        <further-classification edition="200601120260105B">C01B39/02</further-classification>
        <further-classification edition="200601120260105B">B01J20/18</further-classification>
        <further-classification edition="200601120260105B">B01J29/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中國石油化工科技開發有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA PETROCHEMICAL TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊為民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, WEIMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>付文華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, WENHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁志慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, ZHIQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王振東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHENDONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIAO, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳展俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種SCM-45分子篩及其製備方法和應用。所述SCM-45分子篩的X射線繞射圖譜包括2θ為7.13°±0.30°，8.10°±0.30°，13.00°±0.30°，19.41°±0.30°的繞射峰。本發明的SCM-45分子篩骨架包含Si元素和可選的其他元素，且具有薄片狀形貌，比表面積高，微孔體積大，具有優異的吸附和催化性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
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  <tw-patent-application no="1920" publication-number="202615352">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615352</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139264</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種SCM-47分子篩及其製備方法和用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C01B39/46</main-classification>
        <further-classification edition="200601120260105B">B01J20/18</further-classification>
        <further-classification edition="200601120260105B">B01J29/70</further-classification>
        <further-classification edition="200601120260105B">C01B39/02</further-classification>
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          <applicant app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>大陸商中國石油化工科技開發有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA PETROCHEMICAL TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊為民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, WEIMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>付文華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, WENHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁志慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, ZHIQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王振東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHENDONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙勝利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, SHENGLI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳展俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種SCM-47分子篩及其製備方法和應用。該SCM-47分子篩的X-射線繞射圖譜包括2θ為7.08°±0.30°，8.68°±0.30°，13.08°±0.30°，15.78°±0.30°的繞射峰中的一個或多個，優選地，2θ為8.68°±0.30°的繞射峰為最強峰。本發明的SCM-47分子篩骨架包含Si元素和可選的其他元素，且具有薄片狀形貌，比表面積高，微孔體積大，具有優異的吸附和催化性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1921" publication-number="202616087">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616087</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139289</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於基於實體位址之轉譯後備緩衝區無效的系統及方法</chinese-title>
        <english-title>SYSTEMS AND METHODS FOR PHYSICAL ADDRESS BASED TRANSLATION LOOKASIDE BUFFER INVALIDATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260102B">G06F12/10</main-classification>
        <further-classification edition="200601120260102B">G06F3/06</further-classification>
        <further-classification edition="200601120260102B">G06F9/455</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商谷歌有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOOGLE LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘迪亞　欽丹　彼平錢德拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANDYA, CHINTAN BIPINCHANDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
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          </inventor>
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        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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          </agent>
          <agent rep-type="agent" sequence="2">
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              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">用於以下操作之方法、系統及設備：自一客體應用程式接收對分配受保護記憶體的一請求，回應於該請求，將一實體位址空間分配至經啟動以運行該客體應用程式的一客體作業系統；自與在該計算系統上運行之一主機作業系統相關聯的一第二階段映射中移除至該實體位址空間之映射；基於該實體位址自與該主機作業系統相關聯的一轉譯後備緩衝區(TLB)識別該TLB中之一項目子集，其中該TLB儲存虛擬位址空間與實體位址空間之間的一映射；及使該TLB中之該項目子集無效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods, systems, and apparatus for receiving a request from a guest application for allocation of protected memory, responsive to the request, allocating a physical address space to a guest operating system that is launched to run the guest application; removing mapping to the physical address space from a second stage mapping associated with a host operating system running on the computing system; identifying, based on the physical address and from a translation lookaside buffer (TLB) associated with the host operating system, a subset of entries in the TLB, wherein the TLB stores a mapping between virtual address spaces and physical address spaces; and invalidating the subset of entries in the TLB.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子裝置/系統</p>
        <p type="p">104:中央處理單元/CPU</p>
        <p type="p">105:記憶體控制器</p>
        <p type="p">106:記憶體</p>
        <p type="p">108:資源管理器</p>
        <p type="p">110:IP/電路區塊</p>
        <p type="p">112:影像信號處理器/ISP</p>
        <p type="p">114:主機處理單元/HPU</p>
        <p type="p">116:數位信號處理器/DSP</p>
        <p type="p">118:圖形處理單元/GPU</p>
        <p type="p">120:影像變換引擎</p>
        <p type="p">122:匯流排/SoC匯流排</p>
        <p type="p">126:影像處理引擎</p>
        <p type="p">130:使用者/用戶端裝置</p>
        <p type="p">130a:智慧型電話</p>
        <p type="p">130b:平板電腦</p>
        <p type="p">130c:膝上型電腦</p>
        <p type="p">130d:智慧型手錶或可穿戴裝置</p>
        <p type="p">140:系統單晶片/SoC/SoC處理器</p>
        <p type="p">160:磁碟記憶體</p>
        <p type="p">170:記憶體裝置</p>
      </representative-img>
    </description>
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  <tw-patent-application no="1922" publication-number="202616071">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616071</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139361</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>指令處理方法、指令處理裝置、電腦可讀儲存媒體及電腦設備</chinese-title>
        <english-title>INSTRUCTION PROCESSING METHOD, INSTRUCTION PROCESSING DEVICE, COMPUTER-READABLE STORAGE MEDIUM AND COMPUTER EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120251126B">G06F9/38</main-classification>
        <further-classification edition="201801120251126B">G06F9/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商摩爾線程智能科技(北京)股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOORE THREADS TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>發明人放棄姓名表示權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">指令處理方法包括：獲取指令序列的類型占比值；其中，每個類型占比值，表徵對應一種類型的指令在指令序列中所占的比例；基於類型占比值，確定每種類型的指令所採用的發射通路；將指令序列中的待發射指令，經由對應的發射通路，發射至對應的流水線執行單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The instruction processing method comprises: acquiring the type ratio of the instruction sequence; among them, each type ratio represents the proportion of instructions corresponding to a type in the instruction sequence; based on the type ratio, the transmission path adopted by each type of instruction is determined; the instructions to be transmitted in the instruction sequence are transmitted to the corresponding pipeline execution unit through the corresponding transmission path.&lt;br/&gt; .</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101、S102、S103:步驟</p>
      </representative-img>
    </description>
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  <tw-patent-application no="1923" publication-number="202616589">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616589</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139367</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>延伸屏蔽殼體組件、第一端子模組以及第一背板連接器</chinese-title>
        <english-title>EXTENSION SHIELDING SHELL ASSEMBLY, FIRST TERMINAL MODULE AND FIRST BACKPLANE CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120251124B">H01R13/6587</main-classification>
        <further-classification edition="201101120251124B">H01R13/6461</further-classification>
        <further-classification edition="201101120251124B">H01R12/72</further-classification>
      </classification-ipc>
      <parties>
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          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立訊技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉琨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李興玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XINGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭金闖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAN, JINCHUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪元鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YUANXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>苟中凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOU, ZHONGFA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種延伸屏蔽殼體組件包括第一延伸屏蔽片、第二延伸屏蔽片、第一連接屏蔽片、第二連接屏蔽片以及至少一個彈片。第一延伸屏蔽片、第二延伸屏蔽片、第一連接屏蔽片以及第二連接屏蔽片共同圍成一個屏蔽腔體。彈片包括凸伸入屏蔽腔體中以與對接背板連接器相抵接的彈臂。如此設置，藉由分體設置的延伸屏蔽殼體組件，在改善屏蔽性能的同時，簡化了結構。本發明還揭示了具有延伸屏蔽殼體組件的第一端子模組以及具有第一端子模組的第一背板連接器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An extension shielding shell assembly includes a first extension shielding piece, a second extension shielding piece, a first connection shielding piece, a second connection shielding piece and at least one elastic piece. The first extension shielding piece, the second extension shielding piece, the first connection shielding piece and the second connection shielding piece jointly form a shielding chamber. The elastic piece includes an elastic arm that protrudes into the shielding chamber to abut against a mating backplane connector. With this arrangement, the shielding performance is improved and the structure is simplified through the separately provided extension shielding shell assembly. A first terminal module having the extension shielding shell assembly and a first backplane connector having the first terminal module are also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">260:屏蔽腔體</p>
        <p type="p">261:第一延伸屏蔽片</p>
        <p type="p">2613:第一接觸彈片</p>
        <p type="p">262:第二延伸屏蔽片</p>
        <p type="p">263:第一連接屏蔽片</p>
        <p type="p">2631:第一凸起部</p>
        <p type="p">2633:第一讓位凹槽</p>
        <p type="p">2634:第二讓位凹槽</p>
        <p type="p">264:第二連接屏蔽片</p>
        <p type="p">2641:第三凸起部</p>
        <p type="p">2643:第三讓位凹槽</p>
        <p type="p">265a1:第一彈臂</p>
        <p type="p">266a1:第五彈臂</p>
        <p type="p">2671:第一抵接彈臂</p>
        <p type="p">2681:第三抵接彈臂</p>
        <p type="p">B:圖11中畫框部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1924" publication-number="202616583">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616583</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139368</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>第一端子模組以及第一背板連接器</chinese-title>
        <english-title>FIRST TERMINAL MODULE AND FIRST BACKPLANE CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120251103B">H01R13/6471</main-classification>
        <further-classification edition="201101120251103B">H01R13/6587</further-classification>
        <further-classification edition="201101120251103B">H01R12/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立訊技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉琨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李興玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XINGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭金闖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAN, JINCHUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪元鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YUANXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>苟中凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOU, ZHONGFA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種第一端子模組包括絕緣支架、複數第一導電端子以及至少一個金屬屏蔽片。前述絕緣支架包括凸塊部。前述第一導電端子包括第一訊號端子以及第二訊號端子，前述第一訊號端子以及前述第二訊號端子均包括第一接觸部。前述金屬屏蔽片包括一個通道部，前述凸塊部收容於前述通道部中。本發明藉由設置前述凸塊部，有利於改善前述絕緣支架的結構強度；另，本發明藉由設置前述通道部，有利於改善對第一導電端子的屏蔽效果。本發明還揭示了具有前述第一端子模組的第一背板連接器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A first terminal module includes an insulating bracket, a number of first conductive terminals and at least one metal shielding plate. The insulating bracket includes a protrusion block. The first conductive terminals include a first signal terminal and a second signal terminal. Each of the first signal terminal and the second signal terminal includes a first contact portion. The metal shielding plate includes a channel portion in which the protrusion block resides. The present disclosure is beneficial to improving the structural strength of the insulating bracket by providing the protrusion block. A first backplane connector having the first terminal module is also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">219:凸塊部</p>
        <p type="p">221:第一接觸部</p>
        <p type="p">232:第一延伸部</p>
        <p type="p">2341:第一抵接部</p>
        <p type="p">2342:第二抵接部</p>
        <p type="p">240:通道部</p>
        <p type="p">242:第二延伸部</p>
        <p type="p">25:第一屏蔽套筒</p>
        <p type="p">251:第一夾持槽</p>
        <p type="p">253:第一抵接凸片</p>
        <p type="p">255:第一開槽</p>
        <p type="p">E:圖23中畫框部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1925" publication-number="202615148">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615148</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139475</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種多孔碳複合材料及其製備方法和應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251107B">B01J27/24</main-classification>
        <further-classification edition="200601120251107B">B01J32/00</further-classification>
        <further-classification edition="202401120251107B">B01J35/45</further-classification>
        <further-classification edition="200601120251107B">B01J37/00</further-classification>
        <further-classification edition="202001120251107B">C07C68/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中國石油化工科技開發有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA PETROCHEMICAL TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈軍偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GE, JUNWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王意</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何文軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, WENJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳展俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及本發明涉及一種複合材料，其中所述複合材料包括多孔碳和所述多孔碳體內的氮鹵化鈰。此外，本發明涉及一種製備所述複合材料的方法，包括使鹵代烷基化樹脂與含氮有機化合物發生反應，得到氮改性的含鹵素樹脂；任選地，將氮改性的含鹵素樹脂用鹵鹽溶液進行洗滌；和將所述氮改性的含鹵素樹脂與鈰前驅物混合，然後將混合物在惰性氣體氛圍下焙燒，得到所述複合材料。當將這樣的鈰-碳多孔複合材料作為催化劑應用於酯交換反應中時能夠顯著地提高反應的轉化率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1926" publication-number="202616290">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616290</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139489</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可編程可抹除的非揮發性記憶胞</chinese-title>
        <english-title>ERASABLE PROGRAMMABLE NON-VOLATILE MEMORY CELL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G11C16/14</main-classification>
        <further-classification edition="200601120260102B">G11C16/02</further-classification>
        <further-classification edition="202301120260102B">H10B41/60</further-classification>
        <further-classification edition="202301120260102B">H10B41/40</further-classification>
        <further-classification edition="200601120260102B">H01L21/265</further-classification>
        <further-classification edition="200601120260102B">H01L21/301</further-classification>
        <further-classification edition="202501120260102B">H10D62/10</further-classification>
        <further-classification edition="202501120260102B">H10D64/20</further-classification>
        <further-classification edition="202501120260102B">H10D62/60</further-classification>
        <further-classification edition="202501120260102B">H10D80/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力旺電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EMEMORY TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫文堂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, WEIN-TOWN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉明源</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種非揮發性記憶胞，包括：隔離結構、第一井區、第二井區、第一閘極結構、第一間隙壁與金屬層。隔離結構將半導體基板表面區分為第一區域與第二區域。第一井區形成於第一區域。第二井區形成於第二區域。第一閘極結構形成於第一區域表面上方與第二區域表面上方。第一間隙壁接觸於第一閘極結構的側壁。第一合併摻雜區與第二合併摻雜區形成於第一區域表面下方。第三合併摻雜區形成於第二區域表面下方。金屬層位於第一閘極結構上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A non-volatile memory cell includes an isolation structure, a first well region, a second well region, a first gate structure, a first spacer and a metal layer. The surface of the semiconductor substrate is divided into a first region and a second region by the isolation structure. The first well region is formed in the first region. The second well region is formed in the second region. The first gate structure is formed on the surface of the first region and the surface of the second region. The first spacer is formed on a sidewall of the first gate structure. A first merged doped region and a second merged doped region are formed under the surface of the first region. A third merged doped region is formed under the surface of the second region. The metal layer is formed over the first gate structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">502:隔離結構</p>
        <p type="p">503,505:閘極介電層</p>
        <p type="p">513,515:多晶矽閘極層</p>
        <p type="p">523,525:閘極結構</p>
        <p type="p">548,558:間隙壁</p>
        <p type="p">571,572,573,574:合併p型摻雜區</p>
        <p type="p">580:金屬層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1927" publication-number="202616291">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616291</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139491</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可編程可抹除非揮發性記憶體</chinese-title>
        <english-title>ERASABLE PROGRAMMABLE NON-VOLATILE MEMORY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G11C16/14</main-classification>
        <further-classification edition="200601120260102B">G11C16/02</further-classification>
        <further-classification edition="202301120260102B">H10B41/60</further-classification>
        <further-classification edition="202301120260102B">H10B41/40</further-classification>
        <further-classification edition="200601120260102B">H01L21/265</further-classification>
        <further-classification edition="200601120260102B">H01L21/301</further-classification>
        <further-classification edition="202501120260102B">H10D62/10</further-classification>
        <further-classification edition="202501120260102B">H10D64/20</further-classification>
        <further-classification edition="202501120260102B">H10D62/60</further-classification>
        <further-classification edition="202501120260102B">H10D80/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力旺電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EMEMORY TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳學威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSUEH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉明源</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種非揮發性記憶胞，包括一浮動閘電晶體、一金氧半電容器與 一平板電容器。浮動閘電晶體的第一汲/源端連接至源極線，浮動閘電晶體的第二汲/源端連接至位元線。金氧半電容器的第一端連接至浮動閘電晶體的浮動閘極，金氧半電容器的第二端連接至控制線。平板電容器的第一端連接至浮動閘電晶體的浮動閘極，平板電容器的第二端連接至輔助線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A non-volatile memory cell includes a floating gate transistor, a MOS capacitor and a plate capacitor. A first drain/source terminal of the floating gate transistor is connected to a source line, and a second drain/source terminal of the floating gate transistor is connected to a bit line. A first terminal of the MOS capacitor is connected to a floating gate of the floating gate transistor, and a second terminal of the MOS capacitor is connected to a control line. A first terminal of the plate capacitor is connected to the floating gate of the floating gate transistor, and a second terminal of the plate capacitor is connected to an assist line.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:隔離結構</p>
        <p type="p">113:閘極介電層</p>
        <p type="p">123:多晶矽閘極層</p>
        <p type="p">133:閘極結構</p>
        <p type="p">158:間隙壁</p>
        <p type="p">171,172,173:合併n型摻雜區</p>
        <p type="p">181,182:p型袋形區</p>
        <p type="p">190:金屬層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1928" publication-number="202616621">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616621</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139594</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>輔助電源電路、射頻電源、電路運行方法和存儲裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H02M1/08</main-classification>
        <further-classification edition="200601120260102B">H02M3/156</further-classification>
        <further-classification edition="200601120260102B">G11C5/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳市恒運昌真空技術股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN CSL VACUUM SCIENCE AND TECHNOLOGY CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林桂浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龔城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝幸光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樂衛平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種輔助電源電路、射頻電源、電路運行方法和存儲裝置，輔助電源電路包括：電壓匯流排介面、儲能模組介面、第一功率開關、第二功率開關、第一驅動元件和第二驅動元件；第一功率開關用於在電壓匯流排電壓大於儲能模組電壓時導通，以使電壓匯流排為儲能模組續電；第二功率開關用於在儲能模組的電壓大於電壓匯流排電壓時導通，以使儲能模組為電壓匯流排續電。本發明通過第一功率開關和第二功率開關對於不同的電壓匯流排電壓和儲能模組電壓關係，產生不同的導通關斷狀態，實現在儲能模組的電壓大於電壓匯流排電壓時儲能模組為電壓匯流排續電，降低電壓匯流排電壓下降速率，避免電壓匯流排掉電過快。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:儲能模組介面</p>
        <p type="p">60:電壓匯流排介面</p>
        <p type="p">TH1、TH2:第一晶閘管、第二晶閘管</p>
        <p type="p">Q1、Q2、Q3:第一開關電晶體、第二開關電晶體、第三開關電晶體</p>
        <p type="p">D1、D2、D3:第一二極體、第二二極體、第三二極體</p>
        <p type="p">R1、R2、R3、R4:第一電阻、第二電阻、第三電阻、第四電阻</p>
        <p type="p">ZD1、ZD2:第一齊納二極體、第二齊納二極體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1929" publication-number="202616651">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616651</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139910</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聲波裝置</chinese-title>
        <english-title>ACOUSTIC WAVE DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">H03H3/08</main-classification>
        <further-classification edition="200601120260107B">H03H9/02</further-classification>
        <further-classification edition="200601120260107B">H03H9/145</further-classification>
        <further-classification edition="200601120260107B">H03H9/25</further-classification>
        <further-classification edition="200601120260107B">H03H9/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商天工方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SKYWORKS SOLUTIONS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>門田道雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KADOTA, MICHIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中秀治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, SHUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井良美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, YOSHIMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示聲波裝置及相關方法。在一些實施例中，一聲波裝置可包含：一石英基板，其具有一第一表面；及一壓電板，其由LiTaO&lt;sub&gt;3&lt;/sub&gt;或LiNbO&lt;sub&gt;3&lt;/sub&gt;形成且具有經組態以支援一表面聲波之一第一表面及與該石英基板之該第一表面接合之一第二表面。該壓電板之該第二表面係源自該壓電板之晶體結構定向之一負表面。該聲波裝置可進一步包含一叉指形換能器電極，該叉指形換能器電極形成於該壓電板之該第一表面上且經組態以提供與該表面聲波相關聯之換能器功能性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Acoustic wave devices and related methods are disclosed. In some embodiments, an acoustic wave device can include a quartz substrate having a first surface, and a piezoelectric plate formed from LiTaO&lt;sub&gt;3&lt;/sub&gt; or LiNbO&lt;sub&gt;3&lt;/sub&gt; and having a first surface configured to support a surface acoustic wave and a second surface in engagement with the first surface of the quartz substrate. The second surface of the piezoelectric plate is a minus surface resulting from crystal structure orientation of the piezoelectric plate. The acoustic wave device can further include an interdigital transducer electrode formed on the first surface of the piezoelectric plate and configured to provide transducer functionality associated with the surface acoustic wave.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:表面聲波(SAW)裝置</p>
        <p type="p">103a:第一表面</p>
        <p type="p">103b:第二表面</p>
        <p type="p">104:壓電層/LT薄板或LN薄板</p>
        <p type="p">112:石英基板/石英板</p>
        <p type="p">113a:第一表面</p>
        <p type="p">113b:第二表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1930" publication-number="202615105">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615105</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140856</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗體-藥物結合物之用途</chinese-title>
        <english-title>USE OF ANTIBODY-DRUG CONJUGATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260102B">A61K47/68</main-classification>
        <further-classification edition="200601120260102B">A61K39/395</further-classification>
        <further-classification edition="200601120260102B">A61K31/4745</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商第一三共股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIICHI SANKYO COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內藤博之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAITO, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>扇谷祐輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGITANI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>益田剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASUDA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中田隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKADA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田昌生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, MASAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘆田真二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASHIDA, SHINJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森田浩司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORITA, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮崎秀樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAZAKI, HIDEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>粕谷裕司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASUYA, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>早川市郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYAKAWA, ICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部有生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種製造抗體-藥物結合物之方法，該抗體-藥物結合物作為抗腫瘤效果及安全性面優異之具有優異治療效果的抗腫瘤藥，其特徵為使下式所示的抗腫瘤性化合物與抗HER2抗體，經由下式：  &lt;img align="absmiddle" height="43px" width="480px" file="ed10096.JPG" alt="ed10096.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;所示的構造之連接物(linker)而結合(抗HER2抗體係於L&lt;sup&gt;1&lt;/sup&gt;之末端結合，抗腫瘤性化合物係將1位之胺基之氮原子作為結合部位，而與-(CH&lt;sub&gt;2&lt;/sub&gt;)n&lt;sup&gt;2&lt;/sup&gt;-C(=O)-部分之羰基結合)。&lt;br/&gt;&lt;img align="absmiddle" height="216px" width="273px" file="ed10097.JPG" alt="ed10097.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1931" publication-number="202616060">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616060</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142369</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感測裝置及其感測方法</chinese-title>
        <english-title>SENSING DEVICE AND SENSING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G06F3/041</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃品維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PIN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹昕庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, HSIN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施定騰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, DING-TENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHI-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種感測裝置包括觸控面板及控制電路及控制電路。觸控面板包括多個觸控感測器以在掃描時產生觸控資料。控制電路耦接至觸控面板以掃描觸控面板並根據觸控資料區分普通觸控事件及懸浮觸控事件。觸控面板在幀週期內被完全掃描，幀週期包括N個掃描週期。觸控資料包括維觸控資料及二維觸控資料。控制電路在N個掃描週期中的至少一個掃描週期對該些觸控感測器執行至少一次維掃描以產生維觸控資料，並在剩餘的掃描週期對該些觸控感測器執行多次二維掃描以產生二維觸控資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sensing device includes a touch panel and a control circuit. The touch panel includes multiple touch sensors to generate touch data upon being scanned. The control circuit is coupled to the touch panel to scan the touch panel and differentiate between a normal touch event and a hover touch event according to the touch data. The touch panel is fully scanned within a frame period, and the frame period includes N scan periods. The touch data includes one-dimensional touch data and two-dimensional touch data. The control circuit performs at least one one-dimensional scan on the touch sensors during at least one of the N scan periods to generate one-dimensional touch data, and performs multiple two-dimensional scans on the touch sensors during the remaining scan periods to generate two-dimensional touch data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:感測裝置</p>
        <p type="p">100:控制電路</p>
        <p type="p">102:中心邏輯</p>
        <p type="p">1022:類比累加電路</p>
        <p type="p">1024:數位累加電路</p>
        <p type="p">104:掃描控制器</p>
        <p type="p">106:發送器</p>
        <p type="p">108:接收器</p>
        <p type="p">110:記憶體</p>
        <p type="p">200:觸控面板</p>
        <p type="p">202:觸控感測器</p>
        <p type="p">300:主機處理器</p>
        <p type="p">400:儲存裝置</p>
        <p type="p">500:顯示面板</p>
        <p type="p">h:距離</p>
        <p type="p">T1:懸浮觸控事件</p>
        <p type="p">T2:普通觸控事件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1932" publication-number="202615863">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615863</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142545</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於偵測樣本中之分析物之方法及裝置</chinese-title>
        <english-title>METHOD AND DEVICE FOR DETECTING AN ANALYTE IN A SAMPLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">G01N33/53</main-classification>
        <further-classification edition="200601120260107B">G01N27/74</further-classification>
        <further-classification edition="201101120260107B">B82Y5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澳大利亞商量子智產控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUANTUM IP HOLDINGS PTY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅　揚華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, CAMDEN YEUNG-WAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　保羅　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING, PAUL JEREMY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了一種用於偵測樣本中分析物之方法及裝置，其包括使包括目標分析物之樣本與可磁化顆粒接觸，該等顆粒塗佈有與該目標分析物互補之結合分子，產生結合及未結合之結合劑複合物；將包括結合及未結合之結合劑複合物之該等可磁化顆粒置放在磁場感測器附近；改變磁場，足以將至少一部分包括結合及未結合之結合劑複合物的該等可磁化顆粒自其靠近該磁場感測器之地方釋放出來；以及量測根據該等可磁化顆粒相對於磁感測器之淨移動所偵測到之磁信號的變化，該淨移動係平移或旋轉移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described is a method and device for detecting an analyte in a sample, comprising bringing a sample comprising a target analyte into contact with magnetisable particles, the particles being coated with binding molecules complementary to the target analyte, resulting in bound and unbound binder complexes, positioning the magnetisable particles, comprising both bound and unbound binder complexes, in proximity to a magnetic field sensor, changing the magnetic field sufficient to release at least a portion of the magnetisable particles, comprising both bound and unbound binder complexes, from their proximity to the magnetic field sensor, and measuring changes in a magnetic signal detected from the net movement, being either translational or rotational movement, of the magnetisable particles relative to the magnetic sensor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1933" publication-number="202615521">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615521</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142551</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有具有聚氧伸烷基鏈之化合物及具有聚（甲基）丙烯酸酯鏈之化合物之組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C08F290/06</main-classification>
        <further-classification edition="200601120260105B">C08G65/48</further-classification>
        <further-classification edition="200601120260105B">C08K3/22</further-classification>
        <further-classification edition="200601120260105B">C08K13/02</further-classification>
        <further-classification edition="200601120260105B">C09K5/14</further-classification>
        <further-classification edition="200601120260105B">H01L23/373</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古川直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUKAWA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村優希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松原望</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUBARA, NOZOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橫田弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOTA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種組成物，其含有由下述式（1）表示之化合物和由下述式（2）表示之化合物，式（1）中，R&lt;sup&gt;11&lt;/sup&gt;及R&lt;sup&gt;12&lt;/sup&gt;分別獨立地表示氫原子或甲基，R&lt;sup&gt;13&lt;/sup&gt;表示具有聚氧伸烷基鏈之2價的基。式（2）中，R&lt;sup&gt;21&lt;/sup&gt;及R&lt;sup&gt;22&lt;/sup&gt;分別獨立地表示氫原子或甲基，R&lt;sup&gt;23&lt;/sup&gt;表示具有聚（甲基）丙烯酸酯鏈之2價的基。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">
        </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1934" publication-number="202616007">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616007</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142723</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>根據標準商業化可編程邏輯半導體IC晶片所構成的邏輯驅動器</chinese-title>
        <english-title>LOGIC DRIVE BASED ON STANDARDIZED COMMODITY PROGRAMMABLE LOGIC SEMICONDUCTOR IC CHIPS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">G05B19/042</main-classification>
        <further-classification edition="200601120260107B">G06F3/06</further-classification>
        <further-classification edition="200601120260107B">G11C7/10</further-classification>
        <further-classification edition="202301120260107B">H10B20/00</further-classification>
        <further-classification edition="202301120260107B">H10B41/35</further-classification>
        <further-classification edition="202001120260107B">H03K19/177</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成真股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICOMETRUE COMPANY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李進源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JIN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林茂雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MOU-SHIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一晶片封裝結構包括一中介載板包括一矽基板、複數金屬栓塞穿過該矽基板、一第一交互連接線金屬層位在該矽基板上，一第二交互連接線金屬層位在該矽基板上，及一絕緣介電層位在該矽基板上且位在該第一交互連接線金屬層與該第二交互連接線金屬層之間；    一現場可編程閘極陣列(FPGA)積體電路(IC)晶片位在該中介載板上；複數第一金屬凸塊位在該中介載板與該FPGA IC晶片之間；     一第一底部填充材料位在該中介載板與該FPGA IC晶片之間，其中該第一底部填充材料包覆該第一金屬凸塊；     一非揮發性記憶體(NVM)IC積體電路(IC)晶片位在該中介載板上；複數第二金屬凸塊位在該中介載板與該NVM IC晶片之間；以及一第二底部填充材料位在該中介載板與該NVM IC晶片之間，其中該第二底部填充材料包覆該第二金屬凸塊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chip package includes an interposer comprising a silicon substrate, multiple metal vias passing through the silicon substrate, a first interconnection metal layer over the silicon substrate, a second interconnection metal layer over the silicon substrate, and an insulating dielectric layer over the silicon substrate and between the first and second interconnection metal layers; a field-programmable-gate-array (FPGA) integrated-circuit (IC) chip over the interposer; multiple first metal bumps between the interposer and the FPGA IC chip; a first underfill between the interposer and the FPGA IC chip, wherein the first underfill encloses the first metal bumps; a non-volatile memory (NVM) IC chip over the interposer; multiple second metal bumps between the interposer and the NVM IC chip; and a second underfill between the interposer and the NVM IC chip, wherein the second underfill encloses the second metal bumps.</p>
      </isu-abst>
      <representative-img>
        <p type="p">587:路徑</p>
        <p type="p">551:中介載板</p>
        <p type="p">27:交互連接線金屬層</p>
        <p type="p">563:接合連接點</p>
        <p type="p">564:部填充膠</p>
        <p type="p">565:聚合物層</p>
        <p type="p">582:直通聚合物金屬栓塞</p>
        <p type="p">77:交互連接線金屬層</p>
        <p type="p">77e:接墊</p>
        <p type="p">100:半導體晶片</p>
        <p type="p">79:BISD</p>
        <p type="p">300:邏輯驅動器</p>
        <p type="p">588:SISIP</p>
        <p type="p">560:第一交互連接線結構</p>
        <p type="p">558:金屬栓塞</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1935" publication-number="202615587">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615587</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144382</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>加成硬化性矽酮膠組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C08L83/07</main-classification>
        <further-classification edition="200601120260105B">C08L83/05</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤野步</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, NOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>首藤重揮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHUDO, SHIGEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯野幹夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IINO, MIKIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原立榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARA, TATSUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種加成硬化性矽酮膠組成物，其包含下述成分：(A)平均聚合度為480以上且一分子中含有至少2個與矽原子鍵結的烯基之直鏈狀有機聚矽氧烷；(B)由下述通式(1)表示的含烯基矽氧樹脂，&lt;br/&gt;  (R&lt;sup&gt;1&lt;/sup&gt;&lt;sub&gt;3&lt;/sub&gt;SiO&lt;sub&gt;1/2&lt;/sub&gt;)&lt;sub&gt;a&lt;/sub&gt;(R&lt;sup&gt;1&lt;/sup&gt;&lt;sub&gt;2&lt;/sub&gt;SiO&lt;sub&gt;2/2&lt;/sub&gt;)&lt;sub&gt;b&lt;/sub&gt;(R&lt;sup&gt;1&lt;/sup&gt;SiO&lt;sub&gt;3/2&lt;/sub&gt;)&lt;sub&gt;c&lt;/sub&gt;(SiO&lt;sub&gt;4/2&lt;/sub&gt;)&lt;sub&gt;d&lt;/sub&gt;    (1)；(C)由下述通式(2)表示的直鏈狀有機氫聚矽氧烷，&lt;br/&gt;&lt;img align="absmiddle" height="95px" width="396px" file="ed10009.JPG" alt="ed10009.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;；及，(D)加成反應觸媒，其以鉑族金屬(質量換算)計相對於組成物的合計質量為0.1～10ppm；該加成硬化性矽酮膠組成物中，前述(A)成分與前述(B)成分的質量比為(A)/(B)＝40/60～60/40。藉此可提供一種加成硬化性矽酮膠組成物，其能夠賦予從模具的取出性優異且透明性高的硬化物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1936" publication-number="202616257">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616257</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144805</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120251126B">G09G3/32</main-classification>
        <further-classification edition="200601120251126B">G09G5/02</further-classification>
        <further-classification edition="200601120251126B">G02B5/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹科學園區新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育玄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-SYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置包括驅動背板、堤岸層、多個發光元件及彩色濾光基板。堤岸層設置於驅動背板上，且具有第一開口、第二開口及第三開口，其中第一開口及第二開口位於第三開口的同一側。多個發光元件位於第一開口、第二開口及第三開口中，且電性連接至驅動背板。彩色濾光基板設置於驅動背板的對向。彩色濾光基板具有黃色濾光圖案及青色濾光圖案。黃色濾光圖案位於第一開口及第二開口上。青色濾光圖案位於第三開口上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display apparatus includes a driving backplane, a bank layer, light-emitting elements and a color filter substrate. The bank layer is disposed on the driving backplane and has a first opening, a second opening and a third opening, wherein the first opening and the second opening are located on the same side of the third opening. The light-emitting elements are located in the first opening, the second opening and the third opening, and are electrically connected to the driving backplane. The color filter substrate is disposed opposite to the driving backplane. The color filter substrate has a yellow filter pattern and a cyan filter pattern. The yellow filter pattern is located above the first opening and the second opening. The cyan filter pattern is located above the third opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:顯示裝置</p>
        <p type="p">110:驅動背板</p>
        <p type="p">120:焊墊組</p>
        <p type="p">120M:主要焊墊組</p>
        <p type="p">120M’:閒置焊墊組</p>
        <p type="p">120M-1:第一主要焊墊組</p>
        <p type="p">120R:備用焊墊組</p>
        <p type="p">120R-1:第一備用焊墊組</p>
        <p type="p">120R-2:第二備用焊墊組</p>
        <p type="p">122:焊墊</p>
        <p type="p">130:堤岸層</p>
        <p type="p">132:開口</p>
        <p type="p">132-1:第一開口</p>
        <p type="p">132-2:第二開口</p>
        <p type="p">132-3:第三開口</p>
        <p type="p">140、140’:發光元件</p>
        <p type="p">140-1:第一發光元件</p>
        <p type="p">140-2’:第二發光元件</p>
        <p type="p">140-3’:第三發光元件</p>
        <p type="p">150:光學結構</p>
        <p type="p">151:色轉換圖案</p>
        <p type="p">152:第一透光圖案</p>
        <p type="p">153:第二透光圖案</p>
        <p type="p">210:遮光圖案層</p>
        <p type="p">212:開口</p>
        <p type="p">212-1:第一開口</p>
        <p type="p">212-2:第二開口</p>
        <p type="p">220:彩色濾光圖案</p>
        <p type="p">220Y:黃色濾光圖案</p>
        <p type="p">220C:青色濾光圖案</p>
        <p type="p">W1、W2:寬度</p>
        <p type="p">PX:畫素區</p>
        <p type="p">SPX1:第一子畫素區</p>
        <p type="p">SPX2:第二子畫素區</p>
        <p type="p">SPX3:第三子畫素區</p>
        <p type="p">I-I’、II-II’、III-III’:線段</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1937" publication-number="202615120">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615120</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145795</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於與柔性口罩配戴者通訊之裝置及系統</chinese-title>
        <english-title>DEVICE AND SYSTEM FOR COMMUNICATING WITH A FLEXIBLE MASK WEARER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">A62B18/08</main-classification>
        <further-classification edition="200601120260105B">A62B9/06</further-classification>
        <further-classification edition="200601120260105B">H04R5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商路卡投資公司以佛克斯索尼克之名營業</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUCCA VENTURES, INC. DBA VOXSONIX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利西歐　路卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICCIO, LUCCA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利西歐　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICCIO, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布里埃　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRIERE, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞普　堤摩西　克可瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REPP, TIMOTHY CORCORAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示提出一種通訊裝置，其係配置為可移除地附接至口罩，並且對來自配戴者的聲音及/或語音進行接收、傳輸及放大。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure presents a communication device configured to removably attach to a mask, and to receive, transmit, and amplify sound and/or speech from a wearer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1102:揚聲器</p>
        <p type="p">1110:傳聲器</p>
        <p type="p">1112:傳聲器放大器</p>
        <p type="p">1114:數位訊號處理器</p>
        <p type="p">1116:揚聲器放大器</p>
        <p type="p">1120:電池</p>
        <p type="p">1122:電池管理</p>
        <p type="p">1126:電壓調節器</p>
        <p type="p">1128:USB</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1938" publication-number="202615434">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615434</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146005</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>NEK7激酶抑制劑</chinese-title>
        <english-title>INHIBITORS OF NEK7 KINASE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07D487/04</main-classification>
        <further-classification edition="200601120260102B">C07D471/04</further-classification>
        <further-classification edition="200601120260102B">A61K31/519</further-classification>
        <further-classification edition="200601120260102B">A61K31/437</further-classification>
        <further-classification edition="200601120260102B">A61P37/00</further-classification>
        <further-classification edition="200601120260102B">A61P29/00</further-classification>
        <further-classification edition="200601120260102B">A61P9/00</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商哈利亞製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HALIA THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比爾斯　大衛　詹姆士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEARSS, DAVID JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>考維　約翰　賽　姜　三世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAUWE, JOHN SAI KEONG, III</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫拉德　亞歷克西斯　亨利　亞貝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLLARD, ALEXIS HENRI ABEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供具有作為NEK7抑制劑之活性的化合物。該化合物具有結構(I)：  &lt;br/&gt;&lt;img align="absmiddle" height="185px" width="211px" file="ed10340.JPG" alt="ed10340.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;或其醫藥學上可接受之鹽、立體異構體或前驅藥，其中A、X、Y、R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;及R&lt;sup&gt;4&lt;/sup&gt;如本文中所定義。本發明亦提供與此類化合物之製備及使用相關聯的方法、包含此類化合物之醫藥組合物及調節NLRP3炎性小體之活性的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Compounds having activity as inhibitors of NEK7 are provided. The compounds have structure (I): &lt;br/&gt;&lt;img align="absmiddle" height="181px" width="211px" file="ed10341.JPG" alt="ed10341.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;or a pharmaceutically acceptable salt, stereoisomer or prodrug thereof, wherein A, X, Y, R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;3&lt;/sup&gt; and R&lt;sup&gt;4&lt;/sup&gt; are as defined herein. Methods associated with preparation and use of such compounds, pharmaceutical compositions comprising such compounds and methods to modulate the activity of the NLRP3 inflammasome are also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1939" publication-number="202615547">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615547</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146020</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>負型感光性樹脂組合物、以及使用其之硬化浮凸圖案之製造方法及硬化膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08G73/10</main-classification>
        <further-classification edition="200601120260102B">C08G73/12</further-classification>
        <further-classification edition="200601120260102B">C08L79/08</further-classification>
        <further-classification edition="200601120260102B">C08K5/00</further-classification>
        <further-classification edition="200601120260102B">C08K5/3472</further-classification>
        <further-classification edition="200601120260102B">C08K5/3475</further-classification>
        <further-classification edition="200601120260102B">C08K5/378</further-classification>
        <further-classification edition="200601120260102B">C08F2/44</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/027</further-classification>
        <further-classification edition="200601120260102B">G03F7/031</further-classification>
        <further-classification edition="200601120260102B">G03F7/038</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/40</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商旭化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤友香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, YUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渋井智史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBUI, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種負型感光性樹脂組合物，其包含：(A)聚醯亞胺樹脂：100質量份；(B)含氮雜環式化合物：0.01～10質量份；及(C)光聚合起始劑：1～30質量份。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1940" publication-number="202614959">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614959</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146164</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>滾刷元件、清潔設備和清潔系統</chinese-title>
        <english-title>ROLLER BRUSH ASSEMBLY, CLEANING DEVICE AND CLEANING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A47L11/24</main-classification>
        <further-classification edition="200601120260102B">A47L11/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙百年</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, BAINIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭少雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, SHAOXIONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周志威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, ZHIWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周冲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, CHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張寶奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, BAOKUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐朋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高利峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, LIFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡星星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, XINGXING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種滾刷元件、清潔設備和清潔系統，涉及清潔設備技術領域。滾刷元件包括至少兩個滾刷，每個滾刷包括連接端和自由端，至少兩個滾刷的自由端相對間隔設置；及一支架，該支架包括一套接杆，該滾刷上設置有一套接孔且通過該套接孔套設在該套接杆上，其中，相對設置的兩個該滾刷上的該套接孔的形狀不同，該滾刷上的該套接孔與對應的該套接杆的形狀匹配，提升了滾刷元件的清掃效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A roller brush assembly, a cleaning device and a cleaning system are provided, relating to the technical field of cleaning device. The roller brush assembly includes at least two roller brushes, each roller brush includes a connecting end and a free end, free ends of the at least two roller brushes are arranged oppositely at an interval; and a support including a sleeving rod, where the roller brush is provided with a sleeving hole and is sleeved on the sleeving rod through the sleeving hole, and shapes of sleeving holes on the two oppositely-arranged roller brushes are different and respectively matched with shapes of the corresponding sleeving rods, thereby improving the cleaning effect of the roller brush assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">15111:第一滾刷</p>
        <p type="p">15112:第二滾刷</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1941" publication-number="202615427">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615427</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146172</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>胺基嘧啶醯胺自噬作用抑制劑及其使用方法</chinese-title>
        <english-title>AMINOPYRIMIDINE AMIDE AUTOPHAGY INHIBITORS AND METHODS OF USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07D401/12</main-classification>
        <further-classification edition="200601120260102B">C07D401/14</further-classification>
        <further-classification edition="200601120260102B">C07D403/12</further-classification>
        <further-classification edition="200601120260102B">C07D403/14</further-classification>
        <further-classification edition="200601120260102B">A61K31/506</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商迪賽孚爾製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DECIPHERA PHARMACEUTICALS, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛林　丹尼爾　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLYNN, DANIEL L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安　有美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, YU MI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡德威爾　提摩西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CALDWELL, TIMOTHY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃吉蒂　拉克西米納拉亞娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VOGETI, LAKSHMINARAYANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述作為自噬作用抑制劑之化合物及其用於治療諸如癌症之病症之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein are compounds that are inhibitors of autophagy and their use in the treatment of disorders such as cancers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1942" publication-number="202615751">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615751</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146275</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>過濾器、不織布、以及製造不織布的方法</chinese-title>
        <english-title>FILTER, NONWOVEN FABRIC, AND METHOD OF MAKING NONWOVEN FABRIC</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">D04H5/06</main-classification>
        <further-classification edition="201201120260108B">D04H1/542</further-classification>
        <further-classification edition="201201120260108B">D04H3/011</further-classification>
        <further-classification edition="200601120260108B">B01D39/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商貝里國際公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERRY GLOBAL, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安丹　沙瑞維南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDAN, SARAVANAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西南吉爾　梅赫梅特　賽爾庫克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINANGIL, MEHMET SELCUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了不織布，其包括(i)多個連續基質纖維，其包括具有第一熔點並包括第一聚合物成分的第一聚合材料，其中第一聚合物成分包括第一再生聚酯；以及(ii)隨機分散在多個基質纖維中且具有不規則橫截面的多個黏合纖維，其中多個黏合纖維包括具有第二熔點的第二聚合材料，該第二聚合材料包括第二聚合物成分。第二熔點低於第一熔點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Nonwoven fabrics are provided that include (i) a plurality of continuous matrix fibers comprising a first polymeric material having a first melting point and including a first polymer component, in which the first polymer component comprises a first recycled-polyester, and (ii) a plurality of binder fibers having an irregular cross-section randomly dispersed throughout the plurality of matrix fibers, in which the plurality of binder fibers comprising a second polymeric material having a second melting point including a second polymer component. The second melting point being less than the first melting point.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:連續基質纖維</p>
        <p type="p">20:黏合纖維</p>
        <p type="p">22:窄部</p>
        <p type="p">24:變形部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1943" publication-number="202616681">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616681</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146324</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>每個天線組的時間平均射頻（ＲＦ）暴露</chinese-title>
        <english-title>TIME-AVERAGED RADIO FREQUENCY (RF) EXPOSURE PER ANTENNA GROUP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H04B7/06</main-classification>
        <further-classification edition="200901120260109B">H04W52/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納達古都堤　賈加迪許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NADAKUDUTI, JAGADISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧　林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古基安　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUCKIAN, PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯帝斯　特洛伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CURTISS, TROY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪奧達爾　阿克希爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEODHAR, AKHIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示的某些態樣提供了利用天線群組用於射頻（RF）暴露的技術。一種藉由處理系統對天線進行群組以實現RF暴露合規的示例方法，整體上包括針對複數個傳輸天線決定每個傳輸天線配置的RF暴露分佈、以及基於RF暴露分佈將複數個傳輸天線指派給複數個天線組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Certain aspects of the present disclosure provide techniques for radio frequency (RF) exposure with antenna grouping. An example method for grouping antennas for RF exposure compliance by a processing system generally includes determining RF exposure distributions per transmit antenna configuration for a plurality of transmit antennas and assigning the plurality of transmit antennas to a plurality of antenna groups based on the RF exposure distributions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:操作</p>
        <p type="p">1002:方塊</p>
        <p type="p">1004:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1944" publication-number="202615055">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615055</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146365</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療、改善或預防冠狀病毒感染之製品與方法</chinese-title>
        <english-title>PRODUCTS OF MANUFACTURE AND METHODS FOR TREATING, AMELIORATING OR PREVENTING CORONAVIRUS INFECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">A61K31/7052</main-classification>
        <further-classification edition="200601120260107B">A61K31/593</further-classification>
        <further-classification edition="200601120260107B">A61K31/47</further-classification>
        <further-classification edition="200601120260107B">A61K31/375</further-classification>
        <further-classification edition="200601120260107B">A61K31/35</further-classification>
        <further-classification edition="200601120260107B">A61K33/30</further-classification>
        <further-classification edition="200601120260107B">A61K9/12</further-classification>
        <further-classification edition="200601120260107B">A61K9/00</further-classification>
        <further-classification edition="200601120260107B">A61P31/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澳大利亞商拓比利亞澳大利亞有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOPELIA AUST LIMITED (ACN 652 771 670)</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波羅帝　湯瑪士　朱利葉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BORODY, THOMAS JULIUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在替代實施方式中提供包含藥物之組合之醫藥組成物，包括製品及套組、及其使用方法以治療、預防、改善以下者，減緩以下者之進展，降低以下者之嚴重程度或預防以下者：冠狀病毒感染，或COVID-19或2019-nCoV（或所謂的武漢冠狀病毒）感染，或由正冠狀病毒亞科病毒或冠狀病毒科病毒或網巢病毒目病毒引起之感染。在替代實施方式中，如本文所提供之一或多種藥物之組合或混合物經腸、非經腸及/或藉由吸入投予。在替代實施方式中，如本文所提供之藥物的組合或混合物用於阻斷胞內代謝路徑且防止該感染進展為臨床疾病及死亡。在替代實施方式中，提供用於吸入之新穎氣霧劑、噴霧劑或霧化劑或粉末調配物。在替代實施方式中，提供藥物之治療組合或藥物、醫藥劑型、藥物遞送裝置或製品，其包含：奧帕尼布或YELIVA™，或奧帕尼布或YELIVA™及口服及/或吸入氯喹（或ARALEN™）、磷酸氯喹、二磷酸氯喹及/或羥基氯喹（視情況，PLAQUENIL™），伴隨或不伴隨阿奇黴素，其中視情況該奧帕尼布、該氯喹（或ARALEN™）、磷酸氯喹、二磷酸氯喹及/或羥基氯喹（視情況，PLAQUENIL™）及/或阿奇黴素及其他中之各者或全部呈或調配為用於吸入之調配物，例如調配為氣霧劑、噴霧劑、霧化劑、液體或粉末。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In alternative embodiments, provided are pharmaceutical compositions comprising combinations of drugs, including products of manufacture and kits, and methods for using them, for treating, preventing, ameliorating, slowing the progress of, decreasing the severity of or preventing a coronavirus infection, or a COVID-19 or a 2019-nCoV (or so-called Wuhan coronavirus) infection, or an infection caused by a virus in the subfamily Orthocoronavirinae, or a virus in the family Coronaviridae, or a virus in the order Nidovirales. In alternative embodiments, combinations, or cocktails, of a drug or drugs as provided herein are administered either enterally, parenterally and/or by inhalation. In alternative embodiments, combinations, or cocktails, of drugs as provided herein are used to block intracellular metabolic pathways and prevent progression of the infection to clinical illness and death. In alternative embodiments, novel aerosol, spray or mist or powder formulations for inhalation are provided. In alternative embodiments, provided are therapeutic combinations of drugs or a drug, a pharmaceutical dosage form, a drug delivery device, or a product of manufacture, comprising: opaganib or YELIVA™, or opaganib or YELIVA™ and oral and/or inhaled chloroquine (or ARALEN™), chloroquine phosphate, chloroquine diphosphate and/or hydroxychloroquine (optionally, PLAQUENIL™), with or without azithromycin, wherein optionally each or all of the opaganib, the chloroquine (or ARALEN™), chloroquine phosphate, chloroquine diphosphate and/or hydroxychloroquine (optionally, PLAQUENIL™), and/or azithromycin, and others, are in or formulated as a formulation for inhalation, for example, formulated as an aerosol, spray, mist, liquid or powder.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1945" publication-number="202615712">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615712</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146389</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在基板處理系統中噴淋頭特徵部的分群</chinese-title>
        <english-title>GROUPING FEATURES OF SHOWERHEADS IN SUBSTRATE PROCESSING SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C23C16/455</main-classification>
        <further-classification edition="200601120260105B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐德　羅伊特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ODE, ROHIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯馬爾賈西　尤金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMARGIASSI, EUGENE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃瑪克　傑佛瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOMACK, JEFFREY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小萊恩巴格　尼可　雷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINEBARGER JR., NICK RAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑巴格　達莫達爾　拉夾拉姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANBHAG, DAMODAR RAJARAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬德森　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MADSEN, ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一方法包括：選擇待加工、在第一允差範圍內之複數第一特徵部；以及待加工、在選定特徵部之指定尺寸之第二允差範圍內之複數第二特徵部，該複數第二特徵部係位於相隔至少一預定距離。該方法包括：使用工具之切割配件以加工在該第一允差範圍內之該等第一特徵部，且當與該工具相關、造成該等第一選定特徵部之尺寸變異之參數達到預定臨界點時，使用該切割配件以加工在該第二允差範圍內之該等第二選定特徵部。在第二方法中，該等第一及第二特徵部之複數尺寸之平均值係小於或等於與該指定尺寸之一預定平均偏差，且該等第一及第二特徵部之該等尺寸之標準差係小於或等於一預定標準差。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes selecting first features to be machined within a first tolerance range, and second features, which are located at least a predetermined distance apart, to be machined within a second tolerance range of a specified dimension for the selected features. The method includes machining, using a cutting attachment of a tool, the first features within the first tolerance range, and when a parameter associated with the tool causing variation in dimension of the first selected features reaches a predetermined threshold, machining, using the cutting attachment, the second selected features within the second tolerance range. In a second method, a mean value of dimensions of the first and second features is less than or equal to a predetermined mean deviation from the specified dimension, and a standard deviation of the dimensions of the first and second features is less than or equal to a predetermined standard deviation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:方法</p>
        <p type="p">602~618:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1946" publication-number="202616048">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616048</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146598</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用基於控制效能與工作功耗的本端動態功率管理之基於處理器的系統及相關方法</chinese-title>
        <english-title>PROCESSOR-BASED SYSTEM EMPLOYING LOCAL DYNAMIC POWER MANAGEMENT BASED ON CONTROLLING PERFORMANCE AND OPERATING POWER CONSUMPTION, AND RELATED METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">G06F1/28</main-classification>
        <further-classification edition="201901120260107B">G06F1/32</further-classification>
        <further-classification edition="201901120260107B">G06F1/3206</further-classification>
        <further-classification edition="201901120260107B">G06F1/324</further-classification>
        <further-classification edition="201901120260107B">G06F1/3296</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商微軟技術授權有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICROSOFT TECHNOLOGY LICENSING, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉帕卡　史密薩Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAPAKA, SMITHA L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅　派翠克Ｙ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAW, PATRICK Y.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅普斯　提格Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAPES, TEAGUE C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示一種使用基於控制效能與工作功耗之本端動態功率管理的基於處理器之系統，及相關方法。該基於處理器之系統經配置以藉由動態地調整供應給基於處理器之系統的功率之工作頻率及/或工作電壓而本端地管理其功耗。該基於處理器之系統包括功率控制電路，其知曉基於處理器之系統的總體功率預算。若所消耗功率低於功率預算，則基於處理器之系統中的控制處理器可動態地增加供應給基於處理器之系統的功率之電壓位準，及/或工作頻率。若所消耗功率高於功率預算，則功率控制電路亦可動態地減小供應給基於處理器之系統的功率之工作頻率及/或電壓位準。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Processor-based systems employing local dynamic power management based on controlling perfomiance and operating power consumption, and related methods. The processor-based system is configured to locally manage its power consumption by dynamically adjusting operating frequency and/or operating voltage of power supplied to the processor-based system.. The processor-based system includes a power control circuit that is aware of the overall power budget for the processor-based system. The control processor in the processor-based system can dynamically increase the voltage level of the power supplied to the processor-based system, and/or the operating frequency if the consumed power is lower than the power budget. The power control circuit can also dynamically decrease the operating frequency and/or the voltage level of the power supplied to the processor-based system if the consumed power is higher than the power budget.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:基於處理器之系統</p>
        <p type="p">202:功率控制電路</p>
        <p type="p">204:功率信號</p>
        <p type="p">206:處理器</p>
        <p type="p">208:積體電路(IC)</p>
        <p type="p">209:IC晶片</p>
        <p type="p">210:電路板</p>
        <p type="p">212:處理單元</p>
        <p type="p">214(1):處理器核心</p>
        <p type="p">214(C):處理器核心</p>
        <p type="p">215:時鐘輸出</p>
        <p type="p">216:計算處理器核心</p>
        <p type="p">218:電腦程式碼</p>
        <p type="p">219:系統單晶片(SoC)</p>
        <p type="p">220:記憶體</p>
        <p type="p">222:功率電路</p>
        <p type="p">223:IC晶片</p>
        <p type="p">224:功率信號</p>
        <p type="p">224(1):第二功率信號</p>
        <p type="p">226:功率輸出</p>
        <p type="p">226(1):第二功率輸出</p>
        <p type="p">228:功率導軌</p>
        <p type="p">228(1):第二功率導軌</p>
        <p type="p">230:功率預算</p>
        <p type="p">232:功率管理控制器(PMC)</p>
        <p type="p">234:工作電壓指示符</p>
        <p type="p">236:工作電壓反饋指示符</p>
        <p type="p">238:時鐘電路</p>
        <p type="p">239:鎖相迴路(PLL)電路</p>
        <p type="p">240:工作頻率指示符</p>
        <p type="p">242:工作頻率反饋指示符</p>
        <p type="p">244:有限狀態機(FSM)電路</p>
        <p type="p">246:頻率步進電路</p>
        <p type="p">248:工作頻率暫存器</p>
        <p type="p">250:工作頻率反饋暫存器</p>
        <p type="p">252:工作電壓暫存器</p>
        <p type="p">254:工作電壓反饋暫存器</p>
        <p type="p">CLK:時鐘信號</p>
        <p type="p">F&lt;sub&gt;O&lt;/sub&gt;:工作頻率</p>
        <p type="p">V&lt;sub&gt;OP&lt;/sub&gt;:工作電壓</p>
        <p type="p">V&lt;sub&gt;OP(1)&lt;/sub&gt;:工作電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1947" publication-number="202616909">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616909</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147404</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像感測裝置的製造方法及影像感測裝置</chinese-title>
        <english-title>METHOD FOR MANUFACTURING IMAGE SENSING DEVICE AND IMAGE SENSING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260107B">H10F39/90</main-classification>
        <further-classification edition="200601120260107B">H01L23/043</further-classification>
        <further-classification edition="200601120260107B">H01L23/28</further-classification>
        <further-classification edition="200601120260107B">H01L23/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>同欣電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TONG HSING ELECTRONIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐瑞鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, JUI-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪立群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, LI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種影像感測裝置的製造方法包括至少下列步驟：將一影像感測晶片固定於一承載基板的上表面；提供多條金屬接線分別連接影像感測晶片的多個晶片接墊與承載基板的多個基板接墊；提供一蓋板，於蓋板的底面形成一限位壩牆，限位壩牆包括熱可塑材料鄰接蓋板；將限位壩牆圍繞影像感測晶片的感測區，且固定於感測區與多個基板接墊之間；移除蓋板，進一步可以移除限位壩牆分離；設置一密封材料牆，使密封材料牆覆蓋及多個晶片接墊，且完全覆蓋多條金屬接線；將蓋板覆蓋於影像感測晶片的上方並透過一黏著層黏接於密封材料牆。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of manufacturing an image sensing device includes at least the following steps. An image sensing chip is fixed on the upper surface of a carrier substrate. A plurality of metal wires is provided to respectively connect a plurality of chip pads of the image sensing chip with a plurality of substrate pads of the substrate. A cover board is provided, and a limiting dam is formed on the bottom surface of the cover board. The limiting dam includes a thermoplastic material adjacent to the cover board. The limiting dam is arranged to surround a sensing area of the image sensing chip and is fixed between the sensing area and the substrate pads. Then, the cover board is removed. The limiting dam can further be removed optionally. A sealing material wall is provided to cover the chip pads and completely covers the metal wires. Finally, the cover board is covered above the image sensing chip, and is bonded to the sealing material wall by an adhesive layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:影像感測裝置</p>
        <p type="p">10:承載基板</p>
        <p type="p">101:基板本體</p>
        <p type="p">103:外接端子</p>
        <p type="p">105:基板接墊</p>
        <p type="p">12:影像感測晶片</p>
        <p type="p">120:晶片本體</p>
        <p type="p">122:黏合層</p>
        <p type="p">123:感測區</p>
        <p type="p">125:晶片接墊</p>
        <p type="p">13:金屬接線</p>
        <p type="p">14:限位壩牆</p>
        <p type="p">15:蓋板</p>
        <p type="p">16:密封材料牆</p>
        <p type="p">162:外斜面</p>
        <p type="p">17:黏著層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1948" publication-number="202615652">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615652</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147428</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>新穎的具有改善的穩定性的玻尿酸酶變異體及含有其的醫藥組合物</chinese-title>
        <english-title>NOVEL HYALURONIDASE VARIANTS WITH IMPROVED STABILITY AND PHARMACEUTICAL COMPOSITION CONTAINING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C12N9/26</main-classification>
        <further-classification edition="200601120260102B">C12N9/24</further-classification>
        <further-classification edition="200601120260102B">A61K38/47</further-classification>
        <further-classification edition="200601120260102B">A61K38/16</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商阿特根公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALTEOGEN INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴淳宰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SOON JAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭惠信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, HYE-SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李承柱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEUNG JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金奎完</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KYUWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋炯枏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, HYUNG-NAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露了新穎的PH20變異體或其片段，具有改善熱穩定性及酵素活性的人類玻尿酸酶，其中玻尿酸酶為水解玻尿酸的酵素，尤其是關於在具有SEQ ID NO: 3之胺基酸序列的變體中包含一或多個胺基酸殘基取代的PH20變異體或其片段，其中一或多胺基酸殘基在N端及/或C端更被選擇性地刪除。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are novel PH20 variants or fragments thereof with improved thermal stability and enzyme activity of human hyaluronidase, which is an enzyme that hydrolyzes hyaluronic acid, and more particularly novel PH20 variants or fragments thereof including one or more amino acid residue substitutions in the variant having the amino acid sequence of SEQ ID NO: 3, wherein one or more amino acid residues at the N-terminus and/or the C-terminus are optionally further deleted.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1949" publication-number="202614922">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614922</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147463</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於測試治療藥劑之人類化囓齒動物</chinese-title>
        <english-title>HUMANIZED RODENTS FOR TESTING THERAPEUTIC AGENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260102B">A01K67/027</main-classification>
        <further-classification edition="200601120260102B">C12N15/13</further-classification>
        <further-classification edition="200601120260102B">C07K16/00</further-classification>
        <further-classification edition="200601120260102B">A61K49/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商再生元醫藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REGENERON PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃羅寧娜　維拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VORONINA, VERA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫蒙特　科里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOMONT, COREY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克沃特　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCWHIRTER, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂納新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, NAXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克唐納　琳恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACDONALD, LYNN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆飛　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURPHY, ANDREW J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供與在經遺傳修飾囓齒動物體內活體內測試含有人類Fc之治療藥劑有關的方法以及組合物(意即在經遺傳修飾囓齒動物體內測試此一治療藥劑的藥動學及/或藥效學特性)。在一些具體例中，經遺傳修飾囓齒動物表現含有人類Fc (例如人類IgG1 Fc、人類IgG4 Fc)的抗體。在一些具體例中，囓齒動物表現完全人類抗體(意即具有人類重鏈與人類輕(γ或κ)鏈的抗體)。在某些具體例中，經遺傳修飾囓齒動物包含一或多個帶有一個人類胞外域的Fc受體(例如新生兒Fc受體 (FcRn)、β-2-微球蛋白多肽(β2M)、Fcε受體1 α (FcεR1α)、Fcγ受體1α (FcγR1a)、Fcγ受體2a (FcγR2a)、Fcγ受體2b (FcγR2b)、Fcγ受體3a (FcγR3a)、Fcγ受體3b (FcγR3b)、Fcγ受體2c (FcγR2c))。此等受體的跨膜域以及細胞質域可為人類或非人類(例如囓齒動物)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are methods and compositions related to the &lt;i&gt;in vivo &lt;/i&gt;testing of therapeutic agents comprising a human Fc in genetically modified rodents (&lt;i&gt;e.g., &lt;/i&gt;the testing of the pharmacokinetic and/or pharmacodynamic properties of such a therapeutic agent in genetically modified rodents). In some embodiments the genetically modified rodents express antibodies comprising a human Fc (&lt;i&gt;e.g.&lt;/i&gt;, a human IgG1 Fc, a human IgG4 Fc). In some embodiments, the rodents express fully human antibodies (&lt;i&gt;i.e.&lt;/i&gt;, antibodies having human heavy chains and human light (γ or κ) chains). In certain embodiments the genetically modified rodents comprise one or more Fc receptors with a human extracellular domain (&lt;i&gt;e.g.&lt;/i&gt;, a Neonatal Fc Receptor (FcRn), a β-2-microglobulin polypeptide (β2M), a Fc ε receptor 1 α (FcεR1α), a Fc γ receptor 1 alpha (FcγR1a), a Fc gamma receptor 2a (FcγR2a), a Fc gamma receptor 2b (FcγR2b), a Fc gamma receptor 3a (FcγR3a), a Fc gamma receptor 3b (FcγR3b), a Fc gamma receptor 2c (FcγR2c)). The transmembrane and cytoplasmic domain of such receptors can be human or non-human (&lt;i&gt;e.g.&lt;/i&gt;, rodent).</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1950" publication-number="202615899">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615899</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147626</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>相機模組以及可攜式終端</chinese-title>
        <english-title>CAMERA MODULE AND PORTABLE TERMINAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">G02B5/04</main-classification>
        <further-classification edition="201501120260107B">G02B1/11</further-classification>
        <further-classification edition="202101120260107B">G02B7/18</further-classification>
        <further-classification edition="202101120260107B">G03B19/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金炳賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, BYUNG HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁召渼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SO MI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許宰赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUH, JAE HYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙鏞主</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, YONG JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種相機模組，包含：透鏡模組，包含具有折射能力的多個透鏡；第一光學路徑摺疊單元，安置於透鏡模組的物件側上且經組態以使入射光在透鏡模組的光軸方向上折射或反射。在構成透鏡模組的透鏡當中，最接近於第一光學路徑摺疊單元的透鏡的有效半徑可具有與第一光學路徑摺疊單元的出射表面的有效半徑實質上相同的大小。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A camera module includes a lens module including a plurality of lenses having refractive power, a first optical path folding unit disposed on the object side of the lens module and configured to refract or reflect incident light in an optical axis direction of the lens module. Among the lenses constituting the lens module, an effective radius of a lens closest to the first optical path folding unit may have substantially the same size as an effective radius of an exit surface of the first optical path folding unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:相機模組</p>
        <p type="p">200:第一光學路徑摺疊單元</p>
        <p type="p">500:透鏡模組</p>
        <p type="p">C1:第一光軸</p>
        <p type="p">C2:第二光軸</p>
        <p type="p">IF:濾光器</p>
        <p type="p">IP:影像感測器</p>
        <p type="p">LES1、PRh:最大有效半徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1951" publication-number="202615611">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615611</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147630</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＣＭＰ用研磨液、ＣＭＰ用研磨液套組及研磨方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C09G1/02</main-classification>
        <further-classification edition="200601120260105B">C09K3/14</further-classification>
        <further-classification edition="200601120260105B">C07D309/38</further-classification>
        <further-classification edition="200601120260105B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倉田靖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURATA, YASUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南久貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINAMI, HISATAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大塚祐哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKA, YUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大內真弓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OUCHI, MAYUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林真悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>市毛康裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHIGE, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅野雅博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANNO, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　珍娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JENNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩野友洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWANO, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種CMP用研磨液，其含有研磨粒、添加劑及水，研磨粒包含鈰系粒子，添加劑包含：（A）下述通式（1）所表示之4-吡喃酮系化合物；及環狀化合物，具有（B1）1mM的水溶液的pH為3.7以上的化合物或（B2）選自由羧基、羧酸鹽基、胺基及羥基組成的組中的至少一種官能基。CMP用研磨液含有研磨粒、添加劑及水，研磨粒包含鈰系粒子，添加劑包含具有鍵結有羥基烷基之2個以上的氮原子之化合物。&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="234px" width="329px" file="ed10009.JPG" alt="ed10009.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;  [式中，X&lt;sup&gt;11&lt;/sup&gt;、X&lt;sup&gt;12&lt;/sup&gt;及X&lt;sup&gt;13&lt;/sup&gt;分別獨立地表示氫原子或1價的取代基。]</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">
        </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1952" publication-number="202615467">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615467</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147748</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>特異性結合ＣＬＬ１的抗體及其製法和應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07K16/24</main-classification>
        <further-classification edition="200601120260102B">C07K14/705</further-classification>
        <further-classification edition="200601120260102B">C12N15/62</further-classification>
        <further-classification edition="201701120260102B">A61K47/68</further-classification>
        <further-classification edition="200601120260102B">A61K39/395</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
        <further-classification edition="200601120260102B">C12N15/86</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商蘇州亘喜生物科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZHOU GRACELL BIOTECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈　連軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐嘉行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及特異性結合CLL1的抗體及其製法和應用。具體地，本發明提供了抗CLL1奈米抗體或其結合片段。本發明的抗體具有良好的特異性，並且所述抗體和將該抗體用於製備標靶CLL1的免疫效應細胞，在治療或改善CLL1陽性表現的疾病，表現出良好的治療效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1953" publication-number="202614954">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614954</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147911</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>滾刷組件、清潔設備和清潔系統</chinese-title>
        <english-title>ROLLER BRUSH ASSEMBLY, CLEANING DEVICE AND CLEANING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260106B">A47L9/04</main-classification>
        <further-classification edition="200601120260106B">A47L11/40</further-classification>
        <further-classification edition="200601120260106B">A46B13/00</further-classification>
        <further-classification edition="200601120260106B">A47L11/19</further-classification>
        <further-classification edition="200601120260106B">A47L11/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙百年</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, BAINIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周志威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, ZHIWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭少雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, SHAOXIONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周沖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, CHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張寶奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, BAOKUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐朋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高利峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, LIFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡星星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, XINGXING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供了一種滾刷組件、清潔設備和清潔系統，包括至少兩個滾刷，所述滾刷用於清掃待清潔面，每個所述滾刷包括連接端和自由端，所述連接端被驅動裝置驅動，所述至少兩個滾刷的所述自由端相對設置，相對設置的所述自由端之間設置有間隙。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a roller brush assembly, a cleaning device and a cleaning system including at least two roller brushes. The roller brushes are configured to sweep a surface to be cleaned. Each of the roller brushes includes a connecting end and a free end. The connecting end is driven by a driving device. The free ends of the at least two roller brushes are disposed opposite to each other, with gaps being provided between the oppositely disposed free ends.</p>
      </isu-abst>
      <representative-img>
        <p type="p">5:第一滾刷</p>
        <p type="p">7:第二滾刷</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1954" publication-number="202615643">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615643</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147962</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>洗淨液</chinese-title>
        <english-title>CLEANING LIQUID</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C11D3/20</main-classification>
        <further-classification edition="200601120260105B">C11D3/33</further-classification>
        <further-classification edition="200601120260105B">C11D3/36</further-classification>
        <further-classification edition="200601120260105B">C11D1/22</further-classification>
        <further-classification edition="200601120260105B">C11D1/34</further-classification>
        <further-classification edition="200601120260105B">C11D1/37</further-classification>
        <further-classification edition="200601120260105B">C11D1/74</further-classification>
        <further-classification edition="200601120260105B">C11D7/26</further-classification>
        <further-classification edition="200601120260105B">C11D7/32</further-classification>
        <further-classification edition="200601120260105B">C11D7/36</further-classification>
        <further-classification edition="200601120260105B">C11D11/00</further-classification>
        <further-classification edition="200601120260105B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上村哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMIMURA, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>綿引勉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATAHIKI, TSUTOMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供一種稀釋引起的pH值的變動得到抑制的半導體基板用的洗淨液。本發明的洗淨液為包含螯合劑的半導體基板用的洗淨液，且螯合劑所具有的酸解離常數（pKa）與洗淨液的pH值滿足下述式（A）的條件。  &lt;br/&gt;&lt;br/&gt;pKa-1＜pH值＜pKa+1          （A）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1955" publication-number="202615364">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615364</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148141</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有銅金屬化貫穿孔之玻璃或玻璃陶瓷物件及其製造製程</chinese-title>
        <english-title>GLASS OR GLASS CERAMIC ARTICLES WITH COPPER-METALLIZED THROUGH HOLES AND PROCESSES FOR MAKING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">C03B25/04</main-classification>
        <further-classification edition="200601120260107B">C03C10/00</further-classification>
        <further-classification edition="200601120260107B">C03C17/06</further-classification>
        <further-classification edition="200601120260107B">C03C3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧科羅　恰克伍迪阿祖布克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKORO, CHUKWUDI AZUBUIKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於加熱具有銅金屬化貫穿孔的玻璃或玻璃陶瓷的製程包括將物件從第一溫度加熱至第二溫度。第一溫度大於或等於200°C且小於或等於300°C，而第二溫度大於或等於350°C且小於或等於450°C。在從第一溫度至第二溫度的物件的加熱期間之平均加熱速率大於0.0°C/分且小於8.7°C/分。物件包括玻璃或玻璃陶瓷基板，具有至少一個貫穿孔在厚度方向穿過物件；及銅存在於至少一個貫穿孔中。物件不包括徑向裂痕。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process for heating a glass or glass ceramic article with copper-metallized through holes includes heating the article from a first temperature to a second temperature. The first temperature is greater than or equal to 200°C and less than or equal to 300°C, and the second temperature is greater than or equal to 350°C and less than or equal to 450°C. An average heating rate during the heating of the article from the first temperature to the second temperature is greater than 0.0°C/min and less than 8.7°C/min. An article includes a glass or glass ceramic substrate having at least one through hole penetrating the substrate in a thickness direction; and copper present in the at least one through hole. The article does not comprise radial cracks.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:玻璃或玻璃陶瓷物件</p>
        <p type="p">110:玻璃或玻璃陶瓷基板</p>
        <p type="p">120:銅金屬化貫穿孔</p>
        <p type="p">130:徑向裂痕</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1956" publication-number="202614955">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614955</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148501</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吸塵器</chinese-title>
        <english-title>CLEANER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">A47L9/16</main-classification>
        <further-classification edition="200601120260107B">A47L5/06</further-classification>
        <further-classification edition="200601120260107B">A47L5/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南普鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAM, BOHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金南熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, NAMHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金真珠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JINJU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安賢貞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AN, HYEONJEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃正培</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, JUNGBAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">手持式吸塵器，包括：抽吸單元；抽吸馬達，產生抽吸力，通過抽吸單元引入空氣；葉輪，在抽吸馬達上方，圍繞旋轉軸線旋轉；殼體，收納抽吸馬達；灰塵分離單元，在抽吸馬達下方，以從通過抽吸單元引入的空氣中分離灰塵；灰塵收集本體，收集由灰塵分離單元所分離的灰塵；本體蓋，配置以打開和關閉灰塵收集本體的一底部；排放蓋，位於基於抽吸馬達的灰塵收集本體的相對側，排放蓋界定手持式吸塵器的外觀的一部分，排放蓋圍繞旋轉軸線，使上側流動空間在葉輪上方形成在旋轉軸線周圍，本體蓋及排放蓋在沿著旋轉軸線的延伸方向的相對側上分離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A handy cleaner comprising: a suction unit; a suction motor configured to generate a suction force for causing introduction of the air through the suction unit; an impeller disposed above the suction motor and configured to rotate about a rotational axis; a housing that accommodates the suction motor; a dust separation unit disposed below the suction motor to separate dust from the air sucked through the suction unit; a dust collection body for collecting dust separated by the dust separation unit; a body cover configured to open and close a bottom of the dust collection body; and a discharge cover positioned opposite to the dust collection body with respect to the suction motor, the discharge cover defining a part of an exterior of the cleaner, wherein the discharge cover surrounds the rotational axis so that an upper flow space is formed around the rotational axis above the impeller, wherein the body cover and the discharge cover are provided to separate in opposite directions along an extension direction of the rotational axis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:主體</p>
        <p type="p">5:抽吸單元</p>
        <p type="p">10:灰塵分離單元</p>
        <p type="p">40:電池</p>
        <p type="p">50:灰塵容器</p>
        <p type="p">110:第一分塵單元</p>
        <p type="p">130:第二分塵單元</p>
        <p type="p">210:殼體</p>
        <p type="p">230:抽吸馬達</p>
        <p type="p">232:葉輪</p>
        <p type="p">233:軸</p>
        <p type="p">246:過濾器</p>
        <p type="p">250:印刷電路板(PCB)</p>
        <p type="p">310:第一延伸部</p>
        <p type="p">312:止動件</p>
        <p type="p">502:第一灰塵儲存部件</p>
        <p type="p">504:灰塵儲存引導件</p>
        <p type="p">506:第二灰塵儲存部件</p>
        <p type="p">510:灰塵收集本體</p>
        <p type="p">520:本體蓋</p>
        <p type="p">521:肋條</p>
        <p type="p">A1:軸線</p>
        <p type="p">A2:軸線</p>
        <p type="p">A3:軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1957" publication-number="202615860">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615860</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148592</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光感測裝置及其製造方法</chinese-title>
        <english-title>OPTICAL SENSING DEVICE AND METHOD FOR MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">G01N33/49</main-classification>
        <further-classification edition="200601120260107B">F21V1/00</further-classification>
        <further-classification edition="200601120260107B">A61B5/1455</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台亞半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹科學園區新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴淑玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI, SHU-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡甫擁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, FU-YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁國隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種光感測裝置及其製造方法，其中光感測裝置包含一基板、至少一發光元件及一光感測元件。其中，發光元件用以發出一光線，光感測元件用以接收該光線經由一外界物體漫反射後之一漫反射光。而且，發光元件與光感測元件係個別且分離地安裝至基板上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light sensing device and a manufacturing method thereof are provided. The light sensing device includes a substrate, at least one light-emitting component and a light sensing component. The light-emitting component is used to emit a light, and the light-sensing component is used to receive the diffuse-reflected light after the light is diffuse-reflected by an external object. Moreover, the light-emitting component and the light-sensing component are individually and separately mounted on the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:基板</p>
        <p type="p">120:發光元件</p>
        <p type="p">130:光感測元件</p>
        <p type="p">140:擋光元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1958" publication-number="202615701">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615701</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148700</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高純度含鉬前驅物以及相關系統與方法</chinese-title>
        <english-title>HIGH PURITY MOLYBDENUM-CONTAINING PRECURSORS AND RELATED SYSTEMS AND METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C23C16/44</main-classification>
        <further-classification edition="200601120260105B">C23C16/455</further-classification>
        <further-classification edition="200601120260105B">C23C16/448</further-classification>
        <further-classification edition="200601120260105B">C01G39/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷諾斯　約瑟夫　Ｅ　三世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REYNOLDS, JOSEPH E. III</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華生　麥克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATSON, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢迪克斯　布萊恩　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HENDRIX, BRYAN C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩格哈丹　莎拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOGHADDAM, SARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪昂　得文　Ｎ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DION, DEVON N.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加勒特　班傑明　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARRETT, BENJAMIN R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃得法萊德　卡羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALDFRIED, CARLO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃克　維倫德拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WARKE, VIRENDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供高純度含鉬前驅物及相關系統及方法。一前驅物輸送系統包括一汽化器容器，其經構形以含有一可汽化前驅物，該可汽化前驅物在汽化時產生一前驅物蒸汽。該前驅物輸送系統包括至少一個防護表面處理。該至少一個防護表面處理覆蓋該前驅物輸送系統之足量之至少一個氣體暴露表面，以與由不具有該至少一個防護表面處理之一前驅物輸送系統產生之一前驅物蒸汽相比較，減少該前驅物蒸汽中之一定量之至少一個污染物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">High purity molybdenum-containing precursors and related systems and methods are provided. A precursor delivery system comprises a vaporizer vessel that is configured to contain a vaporizable precursor that, when vaporized, produces a precursor vapor. The precursor delivery system comprises at least one protective surface treatment. The at least one protective surface treatment covers a sufficient amount of at least one gas-exposed surface of the precursor delivery system to reduce an amount of at least one contaminant in the precursor vapor as compared to a precursor vapor produced by a precursor delivery system without the at least one protective surface treatment.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1959" publication-number="202615620">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615620</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148703</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黏著劑組合物、黏著劑層、及黏著片材</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C09J123/22</main-classification>
        <further-classification edition="200601120260105B">C09J133/08</further-classification>
        <further-classification edition="200601120260105B">C09J153/00</further-classification>
        <further-classification edition="201801120260105B">C09J7/20</further-classification>
        <further-classification edition="200601120260105B">H01Q1/22</further-classification>
        <further-classification edition="200601120260105B">H01Q1/38</further-classification>
        <further-classification edition="200601120260105B">H01Q9/04</further-classification>
        <further-classification edition="200601120260105B">H01Q21/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>形見普史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAMI, HIROFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>笹原一輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAHARA, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仲野武史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANO, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野中崇弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NONAKA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋智一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, TOMOKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可形成於高頻帶下介電常數及介電損失較低、適於貼合構成毫米波天線之構件之黏著劑層的黏著劑組合物及黏著片材。  &lt;br/&gt;本發明之第一態樣之黏著劑組合物於頻率28 GHz下之介電常數為2～5，於頻率28 GHz下之介電損失為0.0001～0.05。又，本發明之第二態樣之黏著劑組合物於頻率60 GHz下之介電常數為2～5，於頻率60 GHz下之介電損失為0.0001～0.05。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1960" publication-number="202615513">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615513</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148756</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚合物、聚合物用溶液、色料分散液、感光性樹脂組成物、及硬化物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F220/26</main-classification>
        <further-classification edition="200601120260102B">C08F220/28</further-classification>
        <further-classification edition="200601120260102B">C08F222/20</further-classification>
        <further-classification edition="200601120260102B">C08F265/06</further-classification>
        <further-classification edition="200601120260102B">C08F290/12</further-classification>
        <further-classification edition="200601120260102B">C08L33/00</further-classification>
        <further-classification edition="200601120260102B">C08J3/09</further-classification>
        <further-classification edition="200601120260102B">C09D17/00</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/027</further-classification>
        <further-classification edition="200601120260102B">G03F7/031</further-classification>
        <further-classification edition="200601120260102B">G03F7/033</further-classification>
        <further-classification edition="200601120260102B">G03F7/038</further-classification>
        <further-classification edition="200601120260102B">G02B5/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本觸媒股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON SHOKUBAI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寺田拓真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERADA, TAKUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松浦洋樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUURA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遊佐真一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUSA, SHINICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種即使於低溫硬化條件下，亦可形成耐溶劑性優異之硬化物且保存穩定性亦優異之聚合物、含有上述聚合物之感光性樹脂組成物及其硬化物。本發明為一種聚合物，其特徵在於：具有下述式（1）（式中，X表示氫原子或甲基。L表示直鏈狀或支鏈狀之2價有機基。Y表示會因酸或熱而分解，於聚合物側鏈生成乙烯醚基之有機基。）所表示之結構單元（A）。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="167px" width="234px" file="ed10010.JPG" alt="ed10010.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1961" publication-number="202615022">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615022</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148822</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阿立哌唑治療之劑量起始方法</chinese-title>
        <english-title>METHODS FOR DOSE INITIATION OF ARIPIPRAZOLE TREATMENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/497</main-classification>
        <further-classification edition="200601120260102B">A61K31/496</further-classification>
        <further-classification edition="200601120260102B">A61K31/438</further-classification>
        <further-classification edition="200601120260102B">A61P25/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大塚製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKA PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈理　馬修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARLIN, MATTHEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王曉峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, XIAOFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　燕琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YANLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅歐芬尼安　阿拉什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAOUFINIA, ARASH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示案係關於用於有需要之患者的阿立哌唑治療之劑量起始方法：在各別臀肌及/或三角肌注射部位處向該患者投與阿立哌唑肌內(IM)貯存調配物之兩次獨立的100至500 mg注射，及單劑量之口服阿立哌唑。在治療之第一天進行投藥。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure is directed to a method of dose initiation for an aripiprazole treatment to a patient in need thereof; the patient is administered two, separate 100 to 500 mg injections of an aripiprazole intramuscular (IM) depot formulation at separate gluteal and/or deltoid injection sites, and a single dose of oral aripiprazole. The administration occurs on a first day of the treatment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1962" publication-number="202616746">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616746</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149084</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>協定管理負擔減少</chinese-title>
        <english-title>PROTOCOL OVERHEAD REDUCTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260113B">H04W28/02</main-classification>
        <further-classification edition="202301120260113B">H04W72/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錫瑞薩　巴拉特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHRESTHA, BHARAT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞可亞瓦利諾　艾柏多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICO ALVARINO, ALBERTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福雅爾　烏梅許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHUYAL, UMESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹達　蒙哥辛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DHANDA, MUNGAL SINGH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森古塔　艾言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENGUPTA, AYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　曉峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, XIAO FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬　良平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, LIANGPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了用於無線通訊的方法、系統和設備。無線設備可以接收針對與無線通訊網路中的語音傳輸量相關聯的資料無線電承載的配置。在一些實例中，該配置可以指示與語音傳輸量相關聯的一或多個參數。補充或替代地，無線設備可以接收針對資料無線電承載的配置和與語音傳輸量相關聯的經配置准許。無線設備可以基於配置來辨識經配置准許辨識符與資料無線電承載之間的映射。在一些實例中，無線設備可以基於與語音傳輸量相關聯的一或多個參數或者經配置准許辨識符與資料無線電承載之間的映射來產生包括語音傳輸量的傳輸塊。隨後，無線設備可以發送所產生的包括語音傳輸量的傳輸塊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods, systems, and devices for wireless device are described. A wireless device may receive a configuration for a data radio bearer associated with voice traffic in a wireless communications network. In some examples, the configuration may indicate one or more parameters associated with the voice traffic. Additionally, or alternatively, the wireless device may receive a configuration for a data radio bearer and a configured grant associated with voice traffic. The wireless device may identify a mapping between a configured grant identifier and the data radio bearer based on the configuration In some examples, the wireless device may generate a transport block including the voice traffic based on the one or more parameters associated with the voice traffic or the mapping between the configured grant identifier and the data radio bearer. The wireless device may then transmit the generated transport block including the voice traffic.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:無線通訊系統</p>
        <p type="p">205:基地台</p>
        <p type="p">210:傳輸塊</p>
        <p type="p">215:UE</p>
        <p type="p">220:通訊設備</p>
        <p type="p">225:通訊鏈路</p>
        <p type="p">230:通訊鏈路</p>
        <p type="p">235:通訊鏈路</p>
        <p type="p">250:覆蓋區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1963" publication-number="202615445">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615445</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149264</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於形成可輻射圖案化的有機金屬膜的方法</chinese-title>
        <english-title>METHOD FOR FORMING RADIATION PATTERNABLE ORGANOMETALLIC FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07F7/22</main-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/16</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="200601120260102B">G03F7/38</further-classification>
        <further-classification edition="200601120260102B">G03F7/40</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商英培雅股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INPRIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邁爾斯　史堤芬　Ｔ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEYERS, STEPHEN T.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安德森　傑瑞米　Ｔ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDERSON, JEREMY T.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡迪妮歐　布萊恩　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARDINEAU, BRIAN J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾迪森　約瑟夫　Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EDSON, JOSEPH B.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克斯爾　道格拉斯　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KESZLER, DOUGLAS A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托爾斯基　亞倫　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TELECKY, ALAN J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述基於金屬氧化物氫氧化物化學形成高解析度微影圖案化塗層之有機金屬前驅物。該等前驅物組合物通常包含在適當條件下可易於由水蒸氣或其他OH源組合物水解之配位體。該等有機金屬前驅物通常包含針對錫的輻射敏感有機配位體，其可產生在相對較低輻射劑量下對高解析度圖案化有效，且特別適用於EUV圖案化之塗層。該等前驅物組合物在商業適合條件下可易於處理。利用原位水解或基於蒸氣之沈積的溶液相處理可用以形成該等塗層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Organometallic precursors are described for the formation of high resolution lithography patterning coatings based on metal oxide hydroxide chemistry. The precursor compositions generally comprise ligands readily hydrolysable by water vapor or other OH source composition under modest conditions. The organometallic precursors generally comprise a radiation sensitive organo ligand to tin that can result in a coating that can be effective for high resolution patterning at relatively low radiation doses and is particularly useful for EUV patterning. The precursors compositions are readily processable under commercially suitable conditions. Solution phase processing with in situ hydrolysis or vapor based deposition can be used to form the coatings.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1964" publication-number="202615603">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615603</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149413</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>非水性墨水組合物、墨水組、使用其之記錄方法、記錄物之製造方法、記錄物、及噴墨記錄裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260105B">C09D11/328</main-classification>
        <further-classification edition="201401120260105B">C09D11/36</further-classification>
        <further-classification edition="201401120260105B">C09D11/38</further-classification>
        <further-classification edition="200601120260105B">B41M5/00</further-classification>
        <further-classification edition="200601120260105B">B41J2/01</further-classification>
        <further-classification edition="200601120260105B">B41J2/135</further-classification>
        <further-classification edition="200601120260105B">B41J2/17</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＤＮＰ精細化工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DNP FINE CHEMICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>折笠由佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORIKASA, YUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉森圭士郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIMORI, KEISHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本貴生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, KISEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宇高公淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UTAKA, KOUJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田村充功</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMURA, MITSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種非水性墨水組合物，該非水性墨水組合物即便包含選自由芘酮系顏料、吡咯并吡咯二酮顏料、及鹵化酞菁顏料所組成之群中之至少1種，亦可適切地用作藉由噴墨法噴出之非水性墨水組合物。  &lt;br/&gt;本發明之非水性墨水組合物係含有顏料、顏料分散劑、及有機溶劑並且藉由噴墨法噴出者，顏料含有下述式(1-1)所表示之顏料A1、下述式(1-2)所表示之顏料A2、及鹵化酞菁顏料A3之至少1者所表示之顏料，顏料A1、顏料A2之pH值處於3以上且9以下之範圍內。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="185px" width="466px" file="ed10020.JPG" alt="ed10020.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式(1-1)中，X1～X12彼此獨立地表示氫、鹵素原子、碳數1以上且5以下之可分支之烷基、氫原子可被取代之芳香族烴基、氰基、硝基、胺基、-OH、-COOH、-COO&lt;sup&gt;-&lt;/sup&gt;M&lt;sup&gt;+&lt;/sup&gt;、-SO&lt;sub&gt;3&lt;/sub&gt;H、-SO&lt;sub&gt;3&lt;/sub&gt;&lt;sup&gt;-&lt;/sup&gt;M&lt;sup&gt;+&lt;/sup&gt;、氫原子可被取代之鄰苯二甲醯亞胺基、鄰苯二甲醯亞胺甲基、或雜環化合物，M&lt;sup&gt;+&lt;/sup&gt;表示陽離子)。  &lt;br/&gt;&lt;img align="absmiddle" height="44px" width="70px" file="ed10021.JPG" alt="ed10021.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="199px" width="403px" file="ed10022.JPG" alt="ed10022.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式(1-2)中，X1～X10彼此獨立地表示氫、鹵素原子、碳數1以上且5以下之可分支之烷基、氫原子可被取代之芳香族烴基、氰基、硝基、胺基、-OH、-COOH、-COO&lt;sup&gt;-&lt;/sup&gt;M&lt;sup&gt;+&lt;/sup&gt;、-SO&lt;sub&gt;3&lt;/sub&gt;H、-SO&lt;sub&gt;3&lt;/sub&gt;&lt;sup&gt;-&lt;/sup&gt;M&lt;sup&gt;+&lt;/sup&gt;、氫原子可被取代之鄰苯二甲醯亞胺基、鄰苯二甲醯亞胺甲基、或雜環化合物，M&lt;sup&gt;+&lt;/sup&gt;表示陽離子)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1965" publication-number="202615041">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615041</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149446</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>口服膠囊劑及其製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/519</main-classification>
        <further-classification edition="200601120260102B">A61K31/4184</further-classification>
        <further-classification edition="200601120260102B">A61K9/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商百濟神州瑞士有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIGENE SWITZERLAND GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王亦平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YIPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭遠靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, YUANJING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種口服膠囊劑和一種採用粉末直接混合後灌裝膠囊的方法，該口服膠囊劑包含口服膠囊劑用組合物和膠囊殼，所述口服膠囊劑用組合物包含澤布替尼、填充劑、崩解劑、潤濕劑、助流劑、潤滑劑以及任選的粘合劑。本發明的膠囊劑用組合物能夠獲得令人滿意的產品穩定性，滿足生物利用度標準的溶出度屬性，與生產設備一致的製備工藝和合理的生產成本，另外，本發明的方法為無制粒工序，可簡化整體工藝步驟並降低製劑工藝對產品生物利用度的影響。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1966" publication-number="202615423">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615423</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149591</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>縮醛修飾劑、聚合物、化學增幅正型阻劑組成物及阻劑圖案形成方法</chinese-title>
        <english-title>ACETAL MODIFIER, POLYMER, CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION, AND RESIST PATTERN FORMING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07D305/06</main-classification>
        <further-classification edition="200601120260102B">C07D307/12</further-classification>
        <further-classification edition="200601120260102B">C07D309/06</further-classification>
        <further-classification edition="200601120260102B">C07D319/12</further-classification>
        <further-classification edition="200601120260102B">C07D333/16</further-classification>
        <further-classification edition="200601120260102B">C07D335/02</further-classification>
        <further-classification edition="200601120260102B">C07D493/08</further-classification>
        <further-classification edition="200601120260102B">C09K3/00</further-classification>
        <further-classification edition="200601120260102B">C08F212/14</further-classification>
        <further-classification edition="200601120260102B">C08F212/32</further-classification>
        <further-classification edition="200601120260102B">C08F220/30</further-classification>
        <further-classification edition="200601120260102B">C08F220/32</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/32</further-classification>
        <further-classification edition="201201120260102B">G03F1/24</further-classification>
        <further-classification edition="200601120260102B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邉聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>船津顕之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUNATSU, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>増永恵一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASUNAGA, KEIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小竹正晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTAKE, MASAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松澤雄太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUZAWA, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種化學增幅正型阻劑組成物，可給予能夠形成具有極高之孤立間距解像性，LER小、矩形性優異、抑制顯影負載及殘渣缺陷之影響且蝕刻耐性、圖案崩塌受抑制之阻劑圖案之阻劑膜，並提供用於製造該阻劑組成物使用之基礎聚合物之縮醛修飾劑、經該縮醛修飾劑修飾之聚合物、及使用該化學增幅正型阻劑組成物之阻劑圖案形成方法。  &lt;br/&gt;給予成為脂肪族性或芳香族性羥基之保護基之具有含氧原子或硫原子之環族飽和雜環之縮醛修飾劑、含有側鏈具有芳香族性羥基被下式(AL-1)或(AL-2)表示之酸不安定基保護之結構之重複單元A1且因酸作用而脫保護成為鹼可溶性之聚合物、及含有含該聚合物之基礎聚合物之化學增幅正型阻劑組成物。  &lt;br/&gt;&lt;img align="absmiddle" height="160px" width="508px" file="ed10379.JPG" alt="ed10379.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An acetal modifier affording a group having an oxygen or sulfur-containing cyclic saturated heterocycle serving as a protective group for an aliphatic or aromatic hydroxy group is provided as well as a polymer adapted to turn alkali soluble as a result of deprotection under the action of acid, the polymer comprising repeat units A1 having on side chain a structure including an aromatic hydroxy group protected with an acid labile group. A chemically amplified positive resist composition comprising the polymer is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1967" publication-number="202615435">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615435</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149683</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>有機電致發光裝置</chinese-title>
        <english-title>ORGANIC ELECTROLUMINESCENT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07D487/04</main-classification>
        <further-classification edition="200601120260102B">C07D417/04</further-classification>
        <further-classification edition="200601120260102B">C07D413/04</further-classification>
        <further-classification edition="200601120260102B">C07D413/14</further-classification>
        <further-classification edition="200601120260102B">C07D403/10</further-classification>
        <further-classification edition="200601120260102B">C07D413/10</further-classification>
        <further-classification edition="200601120260102B">C09K11/06</further-classification>
        <further-classification edition="202301120260102B">H10K85/60</further-classification>
        <further-classification edition="202301120260102B">H10K50/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商杜邦特用材料韓國股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUPONT SPECIALTY MATERIALS KOREA LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金比特娜瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, BITNARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李琇炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SU-HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴孝淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, HYO-SOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓泰俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, TAE-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁正恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JEONG-EUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙相熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, SANG-HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文斗鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOON, DOO-HYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及多個主體材料，該多個主體材料包含具有由式1表示的化合物的第一主體材料和具有由式2表示的化合物的第二主體材料，以及涉及一種包含該多個主體材料之有機電致發光裝置。利用包含本揭露的特定化合物組合作為主體材料，有可能提供具有比常規有機電致發光裝置更高的發光效率和/或更長的使用壽命特性之有機電致發光裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a plurality of host materials comprising a first host material having a compound represented by formula 1, and a second host material having a compound represented by formula 2, and an organic electroluminescent device comprising the same. By comprising a specific combination of compounds of the present disclosure as host materials, it is possible to provide an organic electroluminescent device having higher luminous efficiency and/or longer lifespan properties as compared with a conventional organic electroluminescent device.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1968" publication-number="202615651">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615651</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149703</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用嵌合抗原受體治療癌症之組成物及方法</chinese-title>
        <english-title>COMPOSITIONS AND METHODS OF TREATING CANCER WITH CHIMERIC ANTIGEN RECEPTORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260102B">C12N5/0783</main-classification>
        <further-classification edition="200601120260102B">C12N15/87</further-classification>
        <further-classification edition="200601120260102B">C07K14/715</further-classification>
        <further-classification edition="200601120260102B">C07K14/725</further-classification>
        <further-classification edition="200601120260102B">C07K16/30</further-classification>
        <further-classification edition="202501120260102B">A61K35/17</further-classification>
        <further-classification edition="200601120260102B">A61K38/17</further-classification>
        <further-classification edition="200601120260102B">A61K39/395</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
        <further-classification edition="202501120260102B">A61K40/15</further-classification>
        <further-classification edition="202501120260102B">A61K40/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商麥迪紐有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIMMUNE, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆迪　葛登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOODY, GORDON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋迪諾　托爾恰　瑪麗亞　雷特雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIARDINO TORCHIA, MARIA LETIZIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐文史翠特　麥可　格倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OVERSTREET, MICHAEL GLEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉爾布雷斯　萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GILBRETH, RYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露關於使用裝甲的嵌合抗原受體細胞來治療癌症之組成物及方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure relates to compositions and methods for treating cancer using armored chimeric antigen receptor cells.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1969" publication-number="202615645">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615645</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149737</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在低ｋ材料、銅、鈷及／或鎢層存在下用於選擇性蝕刻硬遮罩及／或蝕刻終止層的組成物及方法</chinese-title>
        <english-title>COMPOSITION AND PROCESS FOR SELECTIVELY ETCHING A HARD MASK AND/OR AN ETCH-STOP LAYER IN THE PRESENCE OF LAYERS OF LOW-K MATERIALS, COPPER, COBALT AND/OR TUNGSTEN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C11D7/32</main-classification>
        <further-classification edition="200601120260105B">C11D7/50</further-classification>
        <further-classification edition="200601120260105B">C11D3/28</further-classification>
        <further-classification edition="200601120260105B">C11D3/43</further-classification>
        <further-classification edition="200601120260105B">H01L21/02</further-classification>
        <further-classification edition="200601120260105B">C23C22/10</further-classification>
        <further-classification edition="200601120260105B">C07C317/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴斯夫歐洲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡格布曼　喬恩尼司　席爾多瑞絲　維李恩提納斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOOGBOOM, JOANNES THEODORUS VALENTINUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克里普　安卓亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLIPP, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯志正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KE, JHIH JHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王哲偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHE WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁佳慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TING, CHIA CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述清潔組成物與一或多種氧化劑的組合之用途，用於從半導體基板的表面移除蝕刻後或灰化後殘餘物及/或用於氧化性蝕刻或部分氧化性蝕刻包含選自由TiN、Ta、TaN、Al及HfO&lt;sub&gt;x&lt;/sub&gt;組成之群的材料或由選自由TiN、Ta、TaN、Al及HfO&lt;sub&gt;x&lt;/sub&gt;組成之群的材料組成的層或遮罩及/或包含碳化鎢(WC&lt;sub&gt;x&lt;/sub&gt;)及氮化鎢(WN&lt;sub&gt;x&lt;/sub&gt;)組成之群的材料或由碳化鎢(WC&lt;sub&gt;x&lt;/sub&gt;)及氮化鎢(WN&lt;sub&gt;x&lt;/sub&gt;)組成之群的材料組成的層或遮罩、及/或用於從半導體基板的表面移除包含鋁化合物的層。進一步描述該清潔組成物以及該清潔組成物用於從半導體基板的表面移除蝕刻後或灰化後殘餘物的用途。進一步態樣中，描述包含該清潔組成物及一或多種氧化劑的濕式蝕刻組成物以及該濕式蝕刻組成物的用途。亦描述一種從半導體基板製造半導體裝置的方法以及一種包含該清潔組成物及一或多種氧化劑的套組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The use of a cleaning composition in combination with one or more oxidants is described for removing post-etch or post-ash residue from the surface of a semiconductor substrate and/or for oxidative etching or partially oxidative etching of a layer or mask comprising or consisting of a material selected from the group consisting of TiN, Ta, TaN, Al and HfO&lt;sub&gt;x&lt;/sub&gt; and/or a layer or mask comprising or consisting of a material selected from the group consisting of tungsten carbide (WC&lt;sub&gt;x&lt;/sub&gt;) and tungsten nitride (WN&lt;sub&gt;x&lt;/sub&gt;), and/or for removing from the surface of a semiconductor substrate a layer comprising an aluminium compound. Further is described said cleaning composition and a use of said cleaning composition for removing post-etch or post-ash residue from the surface of a semiconductor substrate. Under a further aspect, it is described a wet-etch composition comprising said cleaning composition and one or more oxidants as well as the use of said wet-etch composition. A process for the manufacture of a semiconductor device from a semiconductor substrate and a kit comprising said cleaning composition and one or more oxidants are also described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1970" publication-number="202616689">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616689</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149812</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於報告軌道角動量波形未對準的系統和方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR REPORTING ORBITAL ANGULAR MOMENTUM WAVEFORM MISALIGNMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260113B">H04B17/30</main-classification>
        <further-classification edition="200601120260113B">H04L25/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏恩　伊登麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORN, IDAN MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藍迪斯　謝伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANDIS, SHAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陶鮑爾　阿薩夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOUBOUL, ASSAF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達拉爾　伊侯納坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DALLAL, YEHONATAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏李爾　倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERLINER, RAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴歐爾提林格　阿密特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAR-OR TILLINGER, AMIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭　丹露</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, DANLU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案內容的各態樣涉及報告和校正從第二設備向第一設備進行通訊的軌道角動量（OAM）波形的空間未對準。在一個態樣中，第一設備從第二設備接收具有相對於第二設備的空間未對準的OAM波形。第一設備決定空間未對準，並且亦決定用於校正空間未對準的空間座標及/或對OAM波形的一或多個通道量測。此後，第一設備向第二設備發送基於空間未對準的報告，該報告包括用於校正空間未對準的空間座標及/或一或多個通道量測。隨後，第一設備從第二設備接收經調整的OAM波形，其中經調整的OAM波形是在具有基於報告的相對於第二設備的經校正的空間對準的情況下接收的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Aspects of the disclosure relate to reporting and correcting a spatial misalignment of an orbital angular momentum (OAM) waveform communicated from a second device to a first device. In an aspect, the first device receives from the second device, the OAM waveform having a spatial misalignment with respect to the second device. The first device determines the spatial misalignment and further determines spatial coordinates for correcting the spatial misalignment and/or one or more channel measurements of the OAM waveform. Thereafter, the first device sends a report based on the spatial misalignment to the second device, the report including the spatial coordinates for correcting the spatial misalignment and/or the one or more channel measurements. The first device then receives an adjusted OAM waveform from the second device, wherein the adjusted OAM waveform is received having a corrected spatial alignment with respect to the second device based on the report.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1100:示意圖</p>
        <p type="p">1102:發送設備</p>
        <p type="p">1104:接收設備</p>
        <p type="p">1112:天線陣列</p>
        <p type="p">1114:目的地天線陣列</p>
        <p type="p">1116:天線元件</p>
        <p type="p">1118:天線元件</p>
        <p type="p">1120:OAM波束/波形</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1971" publication-number="202616363">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616363</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150060</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>
        <english-title>SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01L21/027</main-classification>
        <further-classification edition="200601120260102B">H01L21/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>櫻井宏紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKURAI, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供能以穩定的製程性能處理基板之技術。&lt;br/&gt;  本發明的一態樣之基板處理裝置，具備固持基板之固持部、液體噴吐部、第1供給部、第2供給部、及控制各部之控制部。液體噴吐部，對於由固持部所固持之基板噴吐處理液。第1供給部，對於液體噴吐部供給處理液。第2供給部，對於液體噴吐部供給水蒸氣。第2供給部，具備產生水蒸氣之水蒸氣產生器、供給管線、穩定機構、測定在供給管線流通之水蒸氣的壓力之壓力計、及壓力調整機構。供給管線，將來自水蒸氣產生器之水蒸氣對於液體噴吐部供給。穩定機構，使從水蒸氣產生器對於供給管線供給之水蒸氣的量穩定。壓力調整機構，調整在供給管線流通之水蒸氣的壓力。控制部，控制壓力調整機構，俾使藉由壓力計測定之水蒸氣的壓力成為預先設定的壓力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the invention is to provide technology that enables a substrate to be processed with stable process performance.&lt;br/&gt; A substrate processing device according to one aspect of the invention comprises a holding section which holds a substrate, a liquid discharge section, a first supply section, a second supply section, and a control section which controls each section. The liquid discharge section discharges a process liquid onto the substrate held by the holding section. The first supply section supplies the process liquid to the liquid discharge section. The second supply section supplies water vapor to the liquid discharge section. The second supply section has a water vapor generator which generates water vapor, a supply line, a stabilizing mechanism, a pressure gauge which measures the pressure of the water vapor flowing though the supply line, and a pressure regulating mechanism. The supply line supplies the water vapor generated by the water vapor generator to the liquid discharge section. The stabilizing mechanism stabilizes the amount of water vapor supplied from the water vapor generator to the liquid discharge section. The pressure regulating mechanism adjusts the pressure of the water vapor flowing through the supply line. The control section controls the pressure regulating mechanism so that the pressure of the water vapor measured by the pressure gauge reaches a prescribed pressure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">45:水蒸氣供給部(第2供給部的一例)</p>
        <p type="p">48:水蒸氣供給路(供給管線的一例)</p>
        <p type="p">101:水蒸氣產生器</p>
        <p type="p">102,106:分支部</p>
        <p type="p">103:過濾器</p>
        <p type="p">104:針閥(壓力調整機構的一例)</p>
        <p type="p">105:壓力計</p>
        <p type="p">107:閥(第1開閉閥的一例)</p>
        <p type="p">110:穩定機構</p>
        <p type="p">111:第1分支管線</p>
        <p type="p">112:背壓閥</p>
        <p type="p">113:第2分支管線</p>
        <p type="p">114:閥(第2開閉閥的一例)</p>
        <p type="p">DR:排液部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1972" publication-number="202615347">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615347</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150090</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>空隙層、空隙層之製造方法、積層體、光學構件及光學裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C01B33/12</main-classification>
        <further-classification edition="200601120260102B">C01B33/152</further-classification>
        <further-classification edition="200601120260102B">C01B33/157</further-classification>
        <further-classification edition="200601120260102B">B32B9/00</further-classification>
        <further-classification edition="200601120260102B">B32B27/14</further-classification>
        <further-classification edition="200601120260102B">B32B27/30</further-classification>
        <further-classification edition="200601120260102B">B32B5/16</further-classification>
        <further-classification edition="200601120260102B">C09J133/08</further-classification>
        <further-classification edition="201801120260102B">C09J7/29</further-classification>
        <further-classification edition="200601120260102B">G09F9/30</further-classification>
        <further-classification edition="201801120260102B">F21V5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤啓介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>服部大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATTORI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種低折射率且機械強度優異之空隙層。  &lt;br/&gt;本發明之空隙層(11)係凝膠狀矽化合物之粉碎物化學鍵結而成之空隙層，上述凝膠狀矽化合物係矽烷化合物縮合或部分縮合而成之化合物，上述矽烷化合物包含1～3官能矽烷化合物及4官能矽烷化合物，且空隙層(11)之折射率為1.30以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:積層體</p>
        <p type="p">10a:積層體</p>
        <p type="p">11:空隙層</p>
        <p type="p">12:黏接著層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1973" publication-number="202615426">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615426</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150159</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>（４Ｓ）－２４－氯－４－乙基－７３－氟－３５－甲氧基－３２，５－二側氧－１４－（三氟甲基）－３２氫－６－氮雜－３（４，１）－吡啶－１（１）－［１，２，３］三唑－２（１，２），７（１）－二苯庚烷－７４－羧醯胺的結晶型及其製備方法</chinese-title>
        <english-title>CRYSTALLINE FORMS OF (4S)-24-CHLORO-4-ETHYL-73-FLUORO-35-METHOXY-32,5-DIOXO-14-(TRIFLUORO-METHYL)-32H-6-AZA-3(4,1)-PYRIDINA-1(1)-[1,2,3]TRIAZOLA-2(1,2),7(1)-DIBENZENAHEPTAPHANE-74-CARBOXAMIDE AND PREPARATION PROCESS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07D401/10</main-classification>
        <further-classification edition="200601120260102B">A61K31/4439</further-classification>
        <further-classification edition="200601120260102B">A61K31/4192</further-classification>
        <further-classification edition="200601120260102B">A61P7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商拜耳廠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAYER AKTIENGESELLSCHAFT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊維蘭　吉勞姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEVILAIN, GUILLAUME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雅各布斯　緹雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JACOBS, TIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ZA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧萊尼克　布里塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLENIK, BRITTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧比諾　法蘭科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUBINO, FRANCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齊姆　克里森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZIEM, KRISCHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>首華　米歇爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOWA, MICHAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅里格　蘇珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROEHRIG, SUSANNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於(4&lt;i&gt;S&lt;/i&gt;)-2&lt;sup&gt;4&lt;/sup&gt;-氯-4-乙基-7&lt;sup&gt;3&lt;/sup&gt;-氟-3&lt;sup&gt;5&lt;/sup&gt;-甲氧基-3&lt;sup&gt;2&lt;/sup&gt;,5-二側氧-1&lt;sup&gt;4&lt;/sup&gt;-(三氟甲基)-3&lt;sup&gt;2&lt;/sup&gt;氫-6-氮雜-3(4,1)-吡啶-1(1)-[1,2,3]三唑-2(1,2),7(1)-二苯庚烷-7&lt;sup&gt;4&lt;/sup&gt;-羧醯胺的結晶型，其為結晶變體I與結晶變體II、其製備方法、包含其之藥物組成物及其在病症控制的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to crystalline forms of (4&lt;i&gt;S&lt;/i&gt;)-2&lt;sup&gt;4&lt;/sup&gt;-chloro-4-ethyl-7&lt;sup&gt;3&lt;/sup&gt;-fluoro-3&lt;sup&gt;5&lt;/sup&gt;-methoxy-3&lt;sup&gt;2&lt;/sup&gt;,5-dioxo-1&lt;sup&gt;4&lt;/sup&gt;-(trifluoromethyl)-3&lt;sup&gt;2&lt;/sup&gt;&lt;i&gt;H&lt;/i&gt;-6-aza-3(4,1)-pyridina-1(1)-[1,2,3]triazola-2(1,2),7(1)-dibenzenaheptaphane-7&lt;sup&gt;4&lt;/sup&gt;-carboxamide which are the crystalline modification I and the crystalline modification II, to processes for their preparation, to pharmaceutical compositions comprising them and to their use in the control of disorders.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1974" publication-number="202615044">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615044</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150314</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>作為補體抑制劑之吡咯并嘧啶胺</chinese-title>
        <english-title>PYRROLOPYRIMIDINE AMINES AS COMPLEMENT INHIBITORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K31/53</main-classification>
        <further-classification edition="200601120260102B">A61K31/519</further-classification>
        <further-classification edition="200601120260102B">A61K31/506</further-classification>
        <further-classification edition="200601120260102B">C07D487/04</further-classification>
        <further-classification edition="200601120260102B">C07D471/14</further-classification>
        <further-classification edition="200601120260102B">C07D491/14</further-classification>
        <further-classification edition="200601120260102B">C07D401/14</further-classification>
        <further-classification edition="200601120260102B">A61P25/00</further-classification>
        <further-classification edition="200601120260102B">A61P13/00</further-classification>
        <further-classification edition="200601120260102B">A61P9/00</further-classification>
        <further-classification edition="200601120260102B">A61P37/00</further-classification>
        <further-classification edition="200601120260102B">A61P27/00</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商百歐克斯製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIOCRYST PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科頓　普瑞凡　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTIAN, PRAVIN L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴布　亞拉格達　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BABU, YARLAGADDA S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　明萬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, MINWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黨昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DANG, ZHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　澄宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, TRUNG XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞曼　克里斯南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMAN, KRISHNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示式(I)化合物及其醫藥學上可接受之鹽，其為補體系統之抑制劑。亦提供包含此類化合物之醫藥組合物，以及使用該等化合物及組合物治療或預防特徵在於異常補體系統活性之疾病或病狀之方法。  &lt;br/&gt;&lt;img align="absmiddle" height="175px" width="234px" file="ed10571.JPG" alt="ed10571.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are compounds of formula (I), and pharmaceutically acceptable salts thereof, which are inhibitors of the complement system. Also provided are pharmaceutical compositions comprising such a compound, and methods of using the compounds and compositions in the treatment or prevention of a disease or condition characterized by aberrant complement system activity. &lt;br/&gt;&lt;img align="absmiddle" height="162px" width="213px" file="ed10572.JPG" alt="ed10572.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1975" publication-number="202616892">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616892</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150318</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光裝置</chinese-title>
        <english-title>LIGHT-EMITTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251230B">H10D86/00</main-classification>
        <further-classification edition="202501120251230B">H10H29/10</further-classification>
        <further-classification edition="200601120251230B">G09F9/302</further-classification>
        <further-classification edition="200601120251230B">G09F9/33</further-classification>
        <further-classification edition="200601120251230B">G06F3/041</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商半導體能源研究所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平形吉晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAKATA, YOSHIHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠藤秋男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDO, AKIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可攜性好的發光裝置。還提供一種一覽性強的發光裝置。本發明的一個方式是一種在第一方向上交替配置有帶狀的高撓性區域和帶狀的低撓性區域的發光裝置，其中，該高撓性區域包括具有撓性的發光面板，並且，該低撓性區域以重疊的方式包括其撓性低於發光面板的支撐面板和發光面板。發光面板包括外部連接電極，與該外部連接電極重疊的低撓性區域A的第一方向長度長於最靠近區域A的低撓性區域B的第一方向長度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light-emitting device includes a strip-like high flexibility region and a strip-like low flexibility region arranged alternately in a direction. The high flexibility region includes a flexible light-emitting panel. The low flexibility region includes the light-emitting panel and a support panel having a lower flexibility than that of the light-emitting panel and overlapping with the light-emitting panel. It is preferable that the light-emitting panel include an external connection electrode and that a length in the direction of a low flexibility region A that overlaps with the external connection electrode be longer than a length in the direction of a low flexibility region B that is closest to the region A.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:發光面板</p>
        <p type="p">13a:保護層</p>
        <p type="p">15a:支撐面板</p>
        <p type="p">15b:支撐面板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1976" publication-number="202615548">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615548</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150414</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08G73/10</main-classification>
        <further-classification edition="200601120260102B">C08G73/22</further-classification>
        <further-classification edition="200601120260102B">C08F290/14</further-classification>
        <further-classification edition="200601120260102B">C08K5/205</further-classification>
        <further-classification edition="200601120260102B">C08L79/08</further-classification>
        <further-classification edition="200601120260102B">B32B15/088</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/038</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浅川大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAKAWA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山内晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAUCHI, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種樹脂組成物、將上述樹脂組成物硬化而成之硬化物、包含上述硬化物之積層體、上述硬化物之製造方法及包含上述硬化物或上述積層體之半導體元件，該樹脂組成物包含環化樹脂的前驅物及藉由鹼的作用而產生鹼之化合物B。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1977" publication-number="202615433">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615433</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150460</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>芳香雜環類化合物、藥物組合物及其應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07D471/04</main-classification>
        <further-classification edition="200601120260102B">A61K31/5377</further-classification>
        <further-classification edition="200601120260102B">A61K31/519</further-classification>
        <further-classification edition="200601120260102B">A61K31/506</further-classification>
        <further-classification edition="200601120260102B">A61K31/437</further-classification>
        <further-classification edition="200601120260102B">A61P35/00</further-classification>
        <further-classification edition="200601120260102B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商湃隆生物科技有限公司（香港）</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GT APEIRON THERAPEUTICS LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白海云</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAI, HAI YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴爾博　奧利維爾　雷米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARBEAU, OLIVIER REMY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷曉輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GU, XIAO HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝斯納德　杰瑞米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BESNARD, JEREMY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種芳香雜環類化合物、藥物組合物及其應用。具體公開了一種如式I所示的化合物、其立體異構體、其非對映異構體，或前述任一者的藥學上可接受的鹽，或前述任一者的晶型或溶劑合物。本發明芳香雜環類化合物結構新穎，具有較好的CDK7抑制活性，選擇性較好。&lt;br/&gt;&lt;img align="absmiddle" height="206px" width="165px" file="ed10339.JPG" alt="ed10339.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1978" publication-number="202616219">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616219</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150654</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於自動視覺檢查之圖像增強技術</chinese-title>
        <english-title>IMAGE AUGMENTATION TECHNIQUES FOR AUTOMATED VISUAL INSPECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">G06T11/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商安進公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMGEN INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古德溫　艾爾　派翠克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOODWIN, AL PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏納奇　約瑟夫　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERNACKI, JOSEPH PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米爾內　葛萊漢　Ｆ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MILNE, GRAHAM F.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮爾森　湯瑪士　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEARSON, THOMAS C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杰恩　阿曼　馬漢卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAIN, AMAN MAHANDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬恩　喬丹　雷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FINE, JORDAN RAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢普夏爾　肯尼斯　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMPSHIRE, KENNETH E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　艾俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, AIK JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派瑞茲　凡瑞拉　奧斯瓦爾多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEREZ VARELA, OSVALDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋得維　尼珊特　慕凱西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GADHVI, NISHANT MUKESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">各種技術促進了圖像庫之開發，該圖像庫可以用於訓練和/或驗證自動視覺檢查（AVI）模型，如用於圖像分類的AVI神經網路。在一方面，一種算術轉置演算法用於藉由以像素級真實感將特徵（例如，缺陷）轉置到原始圖像上來從原始圖像生成合成圖像。在其他方面，數位修復技術用於從原始圖像生成逼真的合成圖像。基於深度學習的修復技術可以用於添加、消除和/或修改缺陷或其他描繪的特徵。在又其他方面，品質控制技術用於評估圖像庫用於訓練和/或驗證AVI模型的適用性，和/或評估各個圖像是否適合包括在這樣的庫中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various techniques facilitate the development of an image library that can be used to train and/or validate an automated visual inspection (AVI) model, such an AVI neural network for image classification. In one aspect, an arithmetic transposition algorithm is used to generate synthetic images from original images by transposing features (e.g., defects) onto the original images, with pixel-level realism. In other aspects, digital inpainting techniques are used to generate realistic synthetic images from original images. Deep learning-based inpainting techniques may be used to add, remove, and/or modify defects or other depicted features. In still other aspects, quality control techniques are used to assess the suitability of image libraries for training and/or validation of AVI models, and/or to assess whether individual images are suitable for inclusion in such libraries.</p>
      </isu-abst>
      <representative-img>
        <p type="p">104:電腦系統</p>
        <p type="p">110:處理單元</p>
        <p type="p">114:記憶體單元</p>
        <p type="p">120:AVI神經網路模組</p>
        <p type="p">122:VIS控制模組</p>
        <p type="p">124:庫擴展模組</p>
        <p type="p">126:圖像/庫評估模組</p>
        <p type="p">140:訓練圖像庫</p>
        <p type="p">142:缺陷圖像庫</p>
        <p type="p">102:視覺檢查系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1979" publication-number="202615963">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615963</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150657</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＥＵＶ微影用反射型光罩基底、ＥＵＶ微影用反射型光罩、及該等之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260109B">G03F1/24</main-classification>
        <further-classification edition="200601120260109B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赤木大二郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKAGI, DAIJIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河原弘朋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAHARA, HIROTOMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木健一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, ICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宇野俊之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNO, TOSHIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種EUV微影用反射型光罩基底，其特徵在於：其依序形成有反射EUV光之多層反射膜、上述多層反射膜之保護膜、及吸收EUV光之吸收層；且上述保護膜包含銠(Rh)；或含有Rh、及選自由氮(N)、氧(O)、碳(C)、硼(B)、釕(Ru)、鈮(Nb)、鉬(Mo)、鉭(Ta)、銥(Ir)、鈀(Pd)、鋯(Zr)及鈦(Ti)所組成之群中之至少1種元素之銠系材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1980" publication-number="202616345">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616345</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150673</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無面板噴淋頭及基板處理方法</chinese-title>
        <english-title>FACELESS SHOWERHEAD AND SUBSTRATE PROCESSING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">H01J37/32</main-classification>
        <further-classification edition="200601120260105B">H01L21/683</further-classification>
        <further-classification edition="200601120260105B">C23C16/455</further-classification>
        <further-classification edition="200601120260105B">H01L23/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴帕特　什里拉姆　瓦桑特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAPAT, SHRIRAM VASANT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉姆拿尼　潘卡吉　甘夏姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMNANI, PANKAJ GHANSHYAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威廉斯　布萊恩　喬瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILLIAMS, BRIAN JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓊斯　克里斯托　馬修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JONES, CHRISTOPHER MATTHEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝利　柯蒂斯　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAILEY, CURTIS W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德雷珀　埃米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DRAPER, EMILE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>珊卡　納葛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANKAR, NAGRAJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在某些範例中，無面板噴淋頭包含：包括背板的主體，該主體沒有面板或充氣室；氣體供應桿，用以允許氣體進入噴淋頭；以及阻流板，其被支撐在鄰近背板或氣體供應桿處。無面板噴淋頭可更包含用於在背板或氣體供應桿中之阻流板空腔中支撐阻流板的至少一支撐元件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In some examples, a faceless showerhead comprises a body including a backing plate, the body devoid of a faceplate or plenum; a gas supply stem to admit gas into the showerhead; and a baffle supported adjacent the backing plate or the gas supply stem. The faceless showerhead may further comprise at least one support element for supporting the baffle in a baffle cavity in the backing plate or the gas supply stem.</p>
      </isu-abst>
      <representative-img>
        <p type="p">402:無面板噴淋頭</p>
        <p type="p">404:背板</p>
        <p type="p">406:氣體供應桿</p>
        <p type="p">408:阻流板</p>
        <p type="p">410:支撐元件</p>
        <p type="p">412:空腔</p>
        <p type="p">418:下表面</p>
        <p type="p">420:下表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1981" publication-number="202616141">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616141</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150754</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>神經處理單元與神經處理方法</chinese-title>
        <english-title>NEURAL PROCESSING UNITS AND NEURAL PROCESSING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">G06N3/02</main-classification>
        <further-classification edition="202301120260112B">G06N3/063</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商自然智能系統公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATURAL INTELLIGENCE SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾伊斯　哈羅德　Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOYES, HAROLD B</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅伯茨　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROBERTS, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞埃德　羅素</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LLOYD, RUSSELL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒂凡尼　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIFFANY, WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坦納　杰弗里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANNER, JEFFERY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊斯利　特倫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LESLIE, TERRENCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯金納　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SKINNER, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅伊　英德拉尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROY, INDRANIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種可在神經處理單元中實現的積體電路（也稱為「晶片」）。在高層次上，該些晶片的目標是為機器學習演算法提供比傳統處理單元更高的效能。為了實現這一點，神經處理單元可包括多個計算組件，每個計算組件都可獨立地重疊加以確定，該重疊位於作為輸入而提供的編碼資料與儲存於記憶體中的值之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Introduced here are integrated circuits (also referred to as “chips”) that can be implemented in a neural processing unit. At a high level, the goal of these chips is to provide higher performance for machine learning algorithms than conventional processing units would. To accomplish this, the neural processing unit can include multiple computing components, each of which is able to independently determine the overlap between encoded data provided as input and values stored in a memory.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:數位神經元</p>
        <p type="p">102:重疊記憶體</p>
        <p type="p">104:重疊計數電路</p>
        <p type="p">106:重疊評分排序模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1982" publication-number="202616648">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616648</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150801</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>涉及設計電子電路的方法</chinese-title>
        <english-title>METHOD RELATING TO THE DESIGN OF AN ELECTRONIC CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">H03F3/24</main-classification>
        <further-classification edition="200601120260113B">H03F1/02</further-classification>
        <further-classification edition="201501120260113B">H04B1/40</further-classification>
        <further-classification edition="200901120260113B">H04W52/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商斯帕克微系統公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPARK MICROSYSTEMS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奈卜克　弗雷德里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NABKI, FREDERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德斯蘭德斯　多米尼克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DESLANDES, DOMINIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索伊爾　米希爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOER, MICHIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫林拉波特　加布里埃爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIN-LAPORTE, GABRIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔希爾扎德薩尼　穆罕默德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAHERZADEH-SANI, MOHAMMAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李保祿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">超寬頻（Ultra Wideband ，UWB）無線技術在很寬的頻譜上在短距離內以非常低的功率傳輸作為調製編碼脈衝的數位資料。為了支持擴展操作，特別是通過電池電源，發明人已經建立了UWB裝置，當這些裝置利用超低功耗的低頻時鐘源時，這些裝置支援從深度睡眠模式喚醒。此外，可以通過利用電晶體或所謂的複合MOSFET結構（它們的有效增益和輸出電阻超過任何單個電晶體，而不管長度如何）或者通過在跨導運算放大器內利用無偏置低功率差分（指數）跨導級來提供非常高增益的低功率放大級來降低功耗。此外，發明人已經建立了消耗非常低電流（幾nA）的電壓參考源和超低功率低壓差穩壓器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1983" publication-number="202615535">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615535</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150819</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性樹脂組成物</chinese-title>
        <english-title>CURABLE RESIN COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">C08G59/18</main-classification>
        <further-classification edition="201601120260105B">C08G75/045</further-classification>
        <further-classification edition="200601120260105B">C08K5/37</further-classification>
        <further-classification edition="201801120260105B">C08K3/013</further-classification>
        <further-classification edition="200601120260105B">C08L101/06</further-classification>
        <further-classification edition="200601120260105B">C08L63/00</further-classification>
        <further-classification edition="200601120260105B">C09J11/06</further-classification>
        <further-classification edition="200601120260105B">C09J163/00</further-classification>
        <further-classification edition="202101120260105B">G02B7/02</further-classification>
        <further-classification edition="202101120260105B">G03B11/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商納美仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAMICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部信幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, NOBUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丸山一行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARUYAMA, KAZUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種可形成表面光澤經降低之硬化物的硬化性樹脂組成物、及包含該硬化性樹脂組成物之封裝材。又，本發明又提供一種使前述硬化性樹脂組成物或封裝材硬化所得到的硬化物。再者，本發明更提供一種包含前述硬化物的相機模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a curable resin composition which provides a cured product with reduced surface gloss, and a sealing material containing the curable resin composition. The present invention also provides a cured product obtained by curing the curable resin composition or the sealant. The present invention further provides a camera module comprising the cured product.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1984" publication-number="202615262">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615262</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150848</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於人力車輛之輪轂總成</chinese-title>
        <english-title>HUB ASSEMBLY FOR HUMAN-POWERED VEHICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">B60B27/02</main-classification>
        <further-classification edition="200601120260114B">B60B27/04</further-classification>
        <further-classification edition="200601120260114B">B62J6/12</further-classification>
        <further-classification edition="202001120260114B">B62J45/00</further-classification>
        <further-classification edition="201001120260114B">B62M6/40</further-classification>
        <further-classification edition="200601120260114B">B62M25/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商島野股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMANO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米田友哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEDA, YUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上賢吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, KENKICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎梓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAZAKI, AZUSA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於一人力車輛之輪轂總成。該輪轂總成包含一輪轂輪軸、一輪轂主體、一電纜及一電纜保護器。該輪轂輪軸具有一第一軸向端及一第二軸向端。該輪轂主體以可旋轉方式安裝於該輪轂輪軸上以圍繞該輪轂總成之一旋轉中心軸線旋轉。該電纜具有安置於該輪轂總成內部之一第一部分及安置於該輪轂總成外部之一第二部分。該電纜保護器可移動地配置於一第一位置與一第二位置之間。在該電纜保護器位於該第一位置中之情況下，該電纜之該第二部分沿著該旋轉中心軸線延伸。在該電纜保護器位於該第二位置中之情況下，該電纜之該第二部分相對於該旋轉中心軸線至少部分地侷限於一成角度位置中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hub assembly is provided for a human-powered vehicle. The hub assembly includes a hub axle, a hub body, a cable and a cable protector. The hub axle has a first axial end and a second axial end. The hub body is rotatably mounted on the hub axle to rotate around a rotational center axis of the hub assembly. The cable has a first portion disposed inside of the hub assembly and a second portion disposed outside of the hub assembly. The cable protector is movably arranged between a first position and a second position. The second portion of the cable extends along the rotational center axis where the cable protector is in the first position. The second portion of the cable being at least partly restrained in an angled position with respect to the rotational center axis where the cable protector is in the second position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">18:第二端件/第二端帽/端帽</p>
        <p type="p">18a:開口</p>
        <p type="p">21:旋轉限制部件</p>
        <p type="p">21a:電纜導引結構</p>
        <p type="p">21b:凹槽</p>
        <p type="p">21d:凹部</p>
        <p type="p">30:鏈輪支撐結構</p>
        <p type="p">30b:第二端</p>
        <p type="p">40:電纜</p>
        <p type="p">40e:第二部分</p>
        <p type="p">41:電纜保護器</p>
        <p type="p">41b:第二端</p>
        <p type="p">41c:電纜限制部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1985" publication-number="202615816">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615816</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150949</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於週期性偏移之一維測量之計量目標、疊對計量系統及方法</chinese-title>
        <english-title>METROLOGY TARGET, OVERLAY METROLOGY SYSTEM, AND METHOD FOR ONE-DIMENSIONAL MEASUREMENT OF PERIODIC MISREGISTRATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">G01B11/27</main-classification>
        <further-classification edition="201701120260115B">G06T7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斐勒　尤爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FELER, YOEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉納渥克　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHINOVKER, MARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種計量目標包含具有形成於一樣本之一第一工作區或一第二工作區中之至少一者內之一或多個第一目標結構之一第一目標結構組。該計量目標包含具有形成於該第一工作區或該第二工作區中之至少一者內之一或多個第二目標結構之一第二目標結構組。該第一工作區可包含一對稱中心，該對稱中心在該樣本之一或多個層不存在一疊對誤差時與該第二工作區之一對稱中心重疊。該計量目標可另外包含一第三目標結構組、一第四目標結構組或一第五目標結構組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A metrology target includes a first target structure set having one or more first target structures formed within at least one of a first working zone or a second working zone of a sample. The metrology target includes a second target structure set having one or more second target structures formed within at least one of the first working zone or the second working zone. The first working zone may include a center of symmetry that overlaps with a center of symmetry of the second working zone when an overlay error of one or more layers of the sample is not present. The metrology target may additionally include a third target structure set, a fourth target structure set, or a fifth target structure set.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:計量目標</p>
        <p type="p">102a:第一目標結構</p>
        <p type="p">102b:第一目標結構</p>
        <p type="p">104a:第二目標結構</p>
        <p type="p">104b:第二目標結構</p>
        <p type="p">106:第一工作區</p>
        <p type="p">108:第二工作區</p>
        <p type="p">110:對稱中心</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1986" publication-number="202616751">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616751</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151025</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於無線通訊期間的功率節省的可調整洩漏保護</chinese-title>
        <english-title>ADJUSTABLE LEAK GUARD FOR POWER SAVE DURING WIRELESS COMMUNICATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260112B">H04W52/18</main-classification>
        <further-classification edition="200901120260112B">H04W52/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷馬查德利　山迪普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOMCHAUDHURI, SANDIP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽德　史帝夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAED, STEVE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫帕　斯里坎特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUPPA, SRIKANT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費德瑞克斯　貴多羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FREDERIKS, GUIDO ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納格衛　迪裴薛翰吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAWADE, DEEPAK SHAHAJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坦翠　維斯瓦納特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANTRY, VISHWANATH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案內容提供用於無線通訊的用於調整時間段以延遲進入省電模式（洩漏保護）的系統、方法和裝置，包括編碼在電腦儲存媒體上的電腦程式。在一個態樣中，無線通訊設備可以調整時間段以延遲進入省電模式。時間段與無線通訊設備保持喚醒以防止存取點在無線通訊設備處於省電模式時向無線通訊設備進行傳輸相關聯。無線通訊設備亦可以向AP提供關於無線通訊設備正在進入省電模式的指示，並且無線通訊設備可以進入省電模式。在向AP提供指示之後，在至少經調整的時間段處進入省電模式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for adjusting a time period to delay entering a power save mode (leak guard) for wireless communications. In one aspect, a wireless communication device may adjust a time period to delay entering a power save mode. The time period is associated with the wireless communication device remaining awake to prevent an access point from transmitting to the wireless communication device while the wireless communication device is in the power save mode. The wireless communication device also may provide, to the AP, an indication that the wireless communication device is entering a power save mode, and the wireless communication device may enter the power save mode. Entering the power save mode is at least the adjusted time period after providing the indication to the AP.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:時序圖</p>
        <p type="p">502:區塊認可(BA)訊窗</p>
        <p type="p">504:元件符號</p>
        <p type="p">506:封包</p>
        <p type="p">508:序號</p>
        <p type="p">510:元件符號</p>
        <p type="p">512:元件符號</p>
        <p type="p">514:元件符號</p>
        <p type="p">516:洩漏封包</p>
        <p type="p">518:序號</p>
        <p type="p">520:元件符號</p>
        <p type="p">522:元件符號</p>
        <p type="p">524:元件符號</p>
        <p type="p">526:重試封包</p>
        <p type="p">528:新封包</p>
        <p type="p">530:元件符號</p>
        <p type="p">532:STA功率狀態</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1987" publication-number="202615636">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615636</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151047</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液晶配向劑、液晶配向膜及液晶顯示元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C09K19/56</main-classification>
        <further-classification edition="200601120260102B">C08L79/08</further-classification>
        <further-classification edition="200601120260102B">C08G73/10</further-classification>
        <further-classification edition="200601120260102B">G02F1/1337</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴幸司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMOE, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森本佳道</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIMOTO, YOSHIMICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井秀則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, HIDENORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電壓保持率優良，累積電荷的緩和較快，於驅動中不容易引起閃爍的液晶配向膜所得之液晶配向劑、液晶配向膜及液晶顯示元件。  &lt;br/&gt;　　其為含有具有式(1)所示結構之聚合物(A)與具有式(2)所示結構的聚合物(B)之液晶配向劑。  &lt;br/&gt;&lt;img align="absmiddle" height="328px" width="336px" file="ed10057.JPG" alt="ed10057.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;R&lt;sup&gt;1&lt;/sup&gt;表示氫或碳數1~3的烷基，式(2)中，R&lt;sup&gt;2&lt;/sup&gt;為單鍵或2價有機基，R&lt;sup&gt;3&lt;/sup&gt;為-(CH&lt;sub&gt;2&lt;/sub&gt;)&lt;sub&gt;n&lt;/sub&gt;-所示結構(但，n為2~20的整數，任意  &lt;br/&gt;-CH&lt;sub&gt;2&lt;/sub&gt;-在各不相鄰的條件下，可於選自醚、酯、醯胺、脲及胺基甲酸酯的鍵上被取代，該醯胺及脲的氫原子可由甲基或tert-丁氧基羰基所取代)，R&lt;sup&gt;4&lt;/sup&gt;為單鍵或2價有機基，苯環上的任意氫原子可由1價有機基所取代。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1988" publication-number="202616928">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616928</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151082</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260114B">H10H29/37</main-classification>
        <further-classification edition="202501120260114B">H10H29/41</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池奕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JI, HYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金相吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SANG GIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供一種顯示裝置及其製造方法。顯示裝置包含：設置在基板上的絕緣層；設置在絕緣層上的堤部圖案；包含設置在堤部圖案上的多個金屬層的第一電極；設置在第一電極上的第一金屬層；設置在第一金屬層上的焊料圖案；設置在焊料圖案上的發光元件；以及設置在發光元件上的第二電極，其中第一金屬層僅設置在與發光元件重疊的區域內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a display device and a method of fabricating the same. The display device comprises: an insulating layer disposed on a substrate; a bank pattern disposed on the insulating layer; a first electrode including a plurality of metal layers disposed on the bank pattern; a first metal layer disposed on the first electrode; a solder pattern disposed on the first metal layer; a light-emitting element disposed on the solder pattern; and a second electrode disposed on the light-emitting element, wherein the first metal layer is disposed only in a region overlapping the light-emitting element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">ML1:第一金屬層</p>
        <p type="p">ML2:第二金屬層</p>
        <p type="p">ML3:第三金屬層</p>
        <p type="p">ML4:第四金屬層</p>
        <p type="p">OP:開口</p>
        <p type="p">RT2:第二連接線</p>
        <p type="p">TL6:第六訊號線</p>
        <p type="p">10:發光元件</p>
        <p type="p">10-1:第一導電型半導體層</p>
        <p type="p">10-2:主動層</p>
        <p type="p">10-3:第二導電型半導體層</p>
        <p type="p">14:第二驅動電極</p>
        <p type="p">15:第一驅動電極</p>
        <p type="p">110:基板</p>
        <p type="p">121:緩衝層</p>
        <p type="p">122:絕緣層</p>
        <p type="p">130:堤部圖案</p>
        <p type="p">131:側表面</p>
        <p type="p">133:鈍化層</p>
        <p type="p">133a:開口孔</p>
        <p type="p">141:第一光學層</p>
        <p type="p">161:第一電極</p>
        <p type="p">161a:連接部分</p>
        <p type="p">162:焊料圖案</p>
        <p type="p">170:第二電極</p>
        <p type="p">190:黑色矩陣</p>
        <p type="p">20:像素驅動電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1989" publication-number="202616915">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616915</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151201</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬氧化物半導體為基的發光裝置</chinese-title>
        <english-title>METAL OXIDE SEMICONDUCTOR-BASED LIGHT EMITTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260113B">H10H20/822</main-classification>
        <further-classification edition="202301120260113B">H10K85/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商西拉娜ＵＶ科技私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILANNA UV TECHNOLOGIES PTE LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞坦艾柯維克　比塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATANACKOVIC, PETAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示了一種光電半導體發光裝置，其經組態以發射具有在約150 nm至約425 nm之範圍內的一波長之光。在實施例中，該裝置包含一基板，該基板上具有設置在其上的至少一個磊晶半導體層，其中該一或多個磊晶半導體層中之每一者包含一金屬氧化物。亦揭示了一種用於產生一預定波長之光的光電半導體裝置，該光電半導體裝置包含一基板及一光學發射區域。該光學發射區域具有經組態用於產生該預定波長之光的一光學發射區域帶結構，且包含由該基板支撐的一或多個磊晶金屬氧化物層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optoelectronic semiconductor light emitting device configured to emit light having a wavelength in the range from about 150 nm to about 425 nm is disclosed. In embodiments, the device comprises a substrate having at least one epitaxial semiconductor layer disposed thereon, wherein each of the one or more epitaxial semiconductor layers comprises a metal oxide. Also disclosed is an optoelectronic semiconductor device for generating light of a predetermined wavelength comprising a substrate and an optical emission region.The optical emission region has an optical emission region band structure configured for generating light of the predetermined wavelength and comprises one or more epitaxial metal oxide layers supported by the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10,20,30,35,45,50,60,70,75,80:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1990" publication-number="202616916">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616916</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151207</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬氧化物半導體為基的發光裝置</chinese-title>
        <english-title>METAL OXIDE SEMICONDUCTOR-BASED LIGHT EMITTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260113B">H10H20/822</main-classification>
        <further-classification edition="202301120260113B">H10K85/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商西拉娜ＵＶ科技私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILANNA UV TECHNOLOGIES PTE LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞坦艾柯維克　比塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATANACKOVIC, PETAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示了一種光電半導體發光裝置，其經組態以發射具有在約150 nm至約425 nm之範圍內的一波長之光。在實施例中，該裝置包含一基板，該基板上具有設置在其上的至少一個磊晶半導體層，其中該一或多個磊晶半導體層中之每一者包含一金屬氧化物。亦揭示了一種用於產生一預定波長之光的光電半導體裝置，該光電半導體裝置包含一基板及一光學發射區域。該光學發射區域具有經組態用於產生該預定波長之光的一光學發射區域帶結構，且包含由該基板支撐的一或多個磊晶金屬氧化物層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optoelectronic semiconductor light emitting device configured to emit light having a wavelength in the range from about 150 nm to about 425 nm is disclosed. In embodiments, the device comprises a substrate having at least one epitaxial semiconductor layer disposed thereon, wherein each of the one or more epitaxial semiconductor layers comprises a metal oxide. Also disclosed is an optoelectronic semiconductor device for generating light of a predetermined wavelength comprising a substrate and an optical emission region.The optical emission region has an optical emission region band structure configured for generating light of the predetermined wavelength and comprises one or more epitaxial metal oxide layers supported by the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10,20,30,35,45,50,60,70,75,80:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1991" publication-number="202616917">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616917</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151214</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬氧化物半導體為基的發光裝置</chinese-title>
        <english-title>METAL OXIDE SEMICONDUCTOR-BASED LIGHT EMITTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260113B">H10H20/822</main-classification>
        <further-classification edition="202301120260113B">H10K85/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商西拉娜ＵＶ科技私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILANNA UV TECHNOLOGIES PTE LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞坦艾柯維克　比塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATANACKOVIC, PETAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示了一種光電半導體發光裝置，其經組態以發射具有在約150 nm至約425 nm之範圍內的一波長之光。在實施例中，該裝置包含一基板，該基板上具有設置在其上的至少一個磊晶半導體層，其中該一或多個磊晶半導體層中之每一者包含一金屬氧化物。亦揭示了一種用於產生一預定波長之光的光電半導體裝置，該光電半導體裝置包含一基板及一光學發射區域。該光學發射區域具有經組態用於產生該預定波長之光的一光學發射區域帶結構，且包含由該基板支撐的一或多個磊晶金屬氧化物層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optoelectronic semiconductor light emitting device configured to emit light having a wavelength in the range from about 150 nm to about 425 nm is disclosed. In embodiments, the device comprises a substrate having at least one epitaxial semiconductor layer disposed thereon, wherein each of the one or more epitaxial semiconductor layers comprises a metal oxide. Also disclosed is an optoelectronic semiconductor device for generating light of a predetermined wavelength comprising a substrate and an optical emission region.The optical emission region has an optical emission region band structure configured for generating light of the predetermined wavelength and comprises one or more epitaxial metal oxide layers supported by the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10,20,30,35,45,50,60,70,75,80:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1992" publication-number="202615896">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615896</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151248</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學成像系統</chinese-title>
        <english-title>OPTICAL IMAGING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">G02B3/14</main-classification>
        <further-classification edition="202101120260114B">G02B7/09</further-classification>
        <further-classification edition="202101120260114B">G02B7/18</further-classification>
        <further-classification edition="200601120260114B">G02B9/62</further-classification>
        <further-classification edition="200601120260114B">G02B11/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林台淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, TAE YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金學哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HAG CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭弼鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, PHIL HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙鏞主</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, YONG JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學成像系統包括：第一反射構件；多個反射構件；以及多個固定透鏡，沿光軸設置，設置於所述第一反射構件與所述多個反射構件之間；其中所述多個透鏡包括自所述物體側依次設置的第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡及第六透鏡，其中所述第一透鏡至所述第六透鏡中的至少一者是具有可變焦距的可變透鏡，其中所述可變透鏡被配置成隨著所述焦距改變而具有正第一焦距或負第二焦距，且其中所述多個反射構件中的每一者被配置成隨著所述可變透鏡的所述焦距改變而移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging system includes a first reflective member; a plurality of reflective members; and a plurality of fixed lenses disposed along an optical axis between the first reflective member and the plurality of reflective members. The plurality of lenses includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, and a sixth lens disposed in order from the object side. At least one of the first to sixth lenses is a variable lens having a variable focal length. The variable lens is configured to have a positive first focal length or a negative second focal length as the focal length changes. Each of the plurality of reflective members is configured to move as the focal length of the variable lens changes</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:第一透鏡</p>
        <p type="p">120:第二透鏡</p>
        <p type="p">121:液體透鏡</p>
        <p type="p">123:透鏡</p>
        <p type="p">130:第三透鏡</p>
        <p type="p">140:第四透鏡</p>
        <p type="p">150:第五透鏡</p>
        <p type="p">160:第六透鏡</p>
        <p type="p">170:濾光片</p>
        <p type="p">180:成像表面</p>
        <p type="p">a、b、c:距離</p>
        <p type="p">IS:影像感測器</p>
        <p type="p">L1:線性距離</p>
        <p type="p">R1:第一反射構件</p>
        <p type="p">R2:第二反射構件</p>
        <p type="p">R3:第三反射構件</p>
        <p type="p">TTL1:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1993" publication-number="202615446">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615446</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151323</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高純度單有機錫化合物及其製備方法</chinese-title>
        <english-title>HIGH PURITY MONOORGANO TIN COMPOUNDS AND METHODS FOR PREPARATION THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">C07F7/22</main-classification>
        <further-classification edition="200601120260114B">C23C16/04</further-classification>
        <further-classification edition="200601120260114B">G03F7/004</further-classification>
        <further-classification edition="200601120260114B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蓋列斯特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GELEST, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　力</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡夫　克里斯多夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAROFF, CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日置優太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIOKI, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木谷憲昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIYA, NORIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井洸毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, KOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　陶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, THAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐姿漣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述具有化學式R'SnX&lt;sub&gt;3&lt;/sub&gt;且高純度的單有機錫化合物。R'為視情況經取代之烴基，X選自NR&lt;sub&gt;2&lt;/sub&gt;及OR，且各R獨立地為具有約1至約10個碳原子之直鏈或分支鏈烷基。亦提供用於合成及純化此等化合物之方法。該等單有機錫化合物可用於形成高解析度EUV微影圖案化前驅物，且由於其高純度及二有機錫雜質濃度極低而受到關注。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Monoorgano tin compounds having chemical formula R'SnX&lt;sub&gt;3 &lt;/sub&gt;and high purity&lt;sub/&gt;are described. R' is an optionally substituted hydrocarbyl group, X is selected from NR&lt;sub&gt;2&lt;/sub&gt; and OR, and each R is independently a linear or branched alkyl group having about 1 to about 10 carbon atoms. Methods for synthesizing and purifying these compounds are also provided. The monoorgano tin compounds may be used for the formation of high-resolution EUV lithography patterning precursors and are attractive due to their high purity and minimal concentration of diorgano tin impurities.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1994" publication-number="202616717">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616717</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151350</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於視訊寫碼之系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR VIDEO CODING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260113B">H04N19/119</main-classification>
        <further-classification edition="201401120260113B">H04N19/137</further-classification>
        <further-classification edition="201401120260113B">H04N19/159</further-classification>
        <further-classification edition="201401120260113B">H04N19/176</further-classification>
        <further-classification edition="201401120260113B">H04N19/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商松下電器（美國）知識產權公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　宗順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, CHONG SOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏西達　史寇敘　Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHASHIDHAR, SUGHOSH PAVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖如伶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, RU LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫　海威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, HAI WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　漢文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEO, HAN BOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李靜雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JING YA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安倍清史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, KIYOFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠間正真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMA, TADAMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西孝啓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種影像編碼器具有耦合至一記憶體之電路系統。該電路系統將一目前影像區塊拆分成複數個分區。該電路系統針對該等複數個分區中之一第一分區，從一單向預測運動向量候選者集合預測一第一運動向量，並且使用該第一運動向量來編碼該第一分區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image encoder has circuitry coupled to a memory. The circuitry splits a current image block into a plurality of partitions. The circuitry predicts a first motion vector from a set of uni-prediction motion vector candidates for a first partition of the plurality of partitions, and encodes the first partition using the first motion vector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:程序流程</p>
        <p type="p">S1001~S1003:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1995" publication-number="202616925">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616925</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151425</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示設備</chinese-title>
        <english-title>DISPLAY APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260113B">H10H29/10</main-classification>
        <further-classification edition="202501120260113B">H10H20/851</further-classification>
        <further-classification edition="200601120260113B">C09K11/70</further-classification>
        <further-classification edition="200601120260113B">C09K11/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申裕燮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, YUSEOP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DONG-SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林周相</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RHIM, JUSANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹晟煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, SUNG-HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜玟在</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, MINJAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李祿熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, ROK-HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭容碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWAK, YONGSEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">顯示設備包括：設置在基板上的發光元件；平坦化層，覆蓋發光元件並包括設置在插入其間的發光元件兩側上的多個孔；多個線電極，設置於多個孔的暴露表面上並與發光元件電連接；設置在平坦化層上的多個組裝電極；堤部，設置在多個組裝電極上並包括組裝槽；以及設置在組裝槽內的顏色轉換層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display apparatus includes a light emitting element disposed on a substrate: a planarization layer covering the light emitting element and comprising a plurality of holes disposed on both sides with the light emitting element interposed therebetween; a plurality of wire electrodes disposed on an exposed surfaces of the plurality of holes and electrically connected with the light emitting element; a plurality of assembly electrodes disposed on the planarization layer; a bank disposed on the plurality of assembly electrodes and comprising an assembly groove; and a color conversion layer disposed inside the assembly groove.</p>
      </isu-abst>
      <representative-img>
        <p type="p">SL:掃描線</p>
        <p type="p">VDDL:第一驅動電源線</p>
        <p type="p">VSSL:第二驅動電源線</p>
        <p type="p">Vref:參考電壓線</p>
        <p type="p">DL:資料線</p>
        <p type="p">AE1:第一組裝電極</p>
        <p type="p">AE2:第二組裝電極</p>
        <p type="p">ED1a:第一發光元件</p>
        <p type="p">ED2a:第二發光元件</p>
        <p type="p">ED3a:第三發光元件</p>
        <p type="p">ED1b:第一冗餘發光元件</p>
        <p type="p">ED2b:第二冗餘發光元件</p>
        <p type="p">ED3b:第三冗餘發光元件</p>
        <p type="p">VDD:第一驅動電源</p>
        <p type="p">VSS:第二驅動電源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1996" publication-number="202615249">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615249</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151464</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像顯示裝置及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260112B">B32B7/023</main-classification>
        <further-classification edition="200601120260112B">B32B7/10</further-classification>
        <further-classification edition="200601120260112B">B32B27/32</further-classification>
        <further-classification edition="200601120260112B">G06F3/041</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢野孝伸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANO, TAKANOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙洪賛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, HONG CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仲野武史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANO, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大城創矢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSHIRO, SOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">有機EL顯示裝置(1)往背側依序具備視窗構件(2)、衝擊吸收構件(3)、有機EL面板構件(4)及保護構件(5)。衝擊吸收構件(3)具有60%以上之全光線透射率、0.27%/µm以上之每單位厚度的球衝擊吸收率及0.10%/µm以上之每單位厚度的筆衝擊吸收率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:有機EL顯示裝置</p>
        <p type="p">2:視窗構件</p>
        <p type="p">3:衝擊吸收構件</p>
        <p type="p">4:有機EL面板構件</p>
        <p type="p">5:保護構件</p>
        <p type="p">6:硬塗層</p>
        <p type="p">7:視窗薄膜</p>
        <p type="p">8:第1黏著層</p>
        <p type="p">9:基材</p>
        <p type="p">10:第2黏著層</p>
        <p type="p">11:薄膜密封層</p>
        <p type="p">12:面板本體</p>
        <p type="p">13:表側黏著層</p>
        <p type="p">14:保護基材</p>
        <p type="p">15:背側黏著層</p>
        <p type="p">16:金屬板</p>
        <p type="p">21:表面</p>
        <p type="p">22:背面</p>
        <p type="p">23:邊</p>
        <p type="p">24:中間部</p>
        <p type="p">35:ITO層</p>
        <p type="p">40:試作品</p>
        <p type="p">44:代用面板構件</p>
        <p type="p">61:第1試樣</p>
        <p type="p">62:第2試樣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1997" publication-number="202615966">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615966</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151492</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造光罩及製作平板顯示器之系統</chinese-title>
        <english-title>SYSTEMS OF MANUFACTURING A PHOTOMASK AND A FLAT PANEL DISPLAY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260112B">G03F1/36</main-classification>
        <further-classification edition="201201120260112B">G03F1/70</further-classification>
        <further-classification edition="201201120260112B">G03F1/72</further-classification>
        <further-classification edition="201201120260112B">G03F1/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商福昌公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHOTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普拉葛　克里斯托弗　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PROGLER, CHRISTOPHER J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>咸榮睦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAM, YOUNG MOG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種製造一光罩之方法，該方法包含基於初始光罩設計資料判定與預期由該光罩之寫入產生之至少一個圖案相關聯之一第一輪廓，及基於該第一輪廓判定與預期由該經寫入光罩之蝕刻產生之該至少一個圖案相關聯之一第二輪廓。該第二輪廓係該至少一個圖案之一預期實際輪廓。使用該第二輪廓對該初始光罩資料進行光學近接校正以產生經校正之光罩設計資料。在實施例中，一光罩空白板具備至少三個層且該空白板係根據該經校正之光罩設計資料來處理以最小化蝕刻偏斜效應。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of manufacturing a photomask including determining based on initial photomask design data a first contour associated with at least one pattern expected to result from writing of the photomask and determining based on the first contour a second contour associated with the at least one pattern expected to result from etching of the written photomask. The second contour is an expected actual contour of the at least one pattern. The initial photomask data is optical proximity corrected using the second contour to generate corrected photomask design data. In embodiments, a photomask blank is provided with at least three layers and the blank is processed in accordance with the corrected photomask design data to minimize etch skew effects.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S01:步驟</p>
        <p type="p">S03:步驟</p>
        <p type="p">S05:步驟</p>
        <p type="p">S07:步驟</p>
        <p type="p">S09:步驟</p>
        <p type="p">S11:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1998" publication-number="202616442">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616442</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151497</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於混合接合的化學機械拋光的方法以及微電子組件</chinese-title>
        <english-title>METHODS FOR CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING AND MICROELECTRONIC COMPONENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">H01L21/67</main-classification>
        <further-classification edition="200601120260107B">H01L21/4763</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方騰　二世　蓋烏斯　吉爾曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOUNTAIN, JR., GAIUS, GILLMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼達拉普　肯卓瑟卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANDALAPU, CHANDRASEKHAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏佐　賽普里恩　艾米卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UZOH, CYPRIAN EMEKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>提爾　傑瑞米　阿弗烈德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THEIL, JEREMY ALFRED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">技術及方法之代表性實施包括用於混合接合的化學機械拋光。所揭示之方法包括：在基板上沈積且圖案化介電層以在該介電層中形成開口，在該介電層上方且在該些開口之第一部分內沈積障壁層，及在該障壁層上方且在該些開口之未由該障壁層佔據之第二部分內沈積導電結構，該些開口之該第二部分中之該導電結構的至少一部分耦接或接觸該基板內之電路。另外，該導電結構經拋光以顯露該障壁層之沈積於該介電層上方且未沈積於該些開口之該第二部分中的部分。此外，該障壁層係藉由選擇性拋光來拋光以在該介電層上或在該介電層處顯露接合表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Representative implementations of techniques and methods include chemical mechanical polishing for hybrid bonding. The disclosed methods include depositing and patterning a dielectric layer on a substrate to form openings in the dielectric layer, depositing a barrier layer over the dielectric layer and within a first portion of the openings, and depositing a conductive structure over the barrier layer and within a second portion of the openings not occupied by the barrier layer, at least a portion of the conductive structure in the second portion of the openings coupled or contacting electrical circuitry within the substrate. Additionally, the conductive structure is polished to reveal portions of the barrier layer deposited over the dielectric layer and not in the second portion of the openings. Further, the barrier layer is polished with a selective polish to reveal a bonding surface on or at the dielectric layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:微電子元件</p>
        <p type="p">102:第一晶圓/第一基板</p>
        <p type="p">103:第一基底層</p>
        <p type="p">104:介電質/介電層</p>
        <p type="p">106:導電結構</p>
        <p type="p">108:凹進</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1999" publication-number="202616856">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616856</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151594</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>常開型基於氮化鎵之具有Ｐ型閘極的電晶體</chinese-title>
        <english-title>NORMALLY-ON GALLIUM NITRIDE BASED TRANSISTOR WITH P-TYPE GATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260112B">H10D30/60</main-classification>
        <further-classification edition="202501120260112B">H10D62/85</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商德州儀器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEXAS INSTRUMENTS INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　昌秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUH, CHANG SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙　廷祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOH, JUNGWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東燮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DONG SEUP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和田彰二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WADA, SHOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克姆賽　卡瑞恩　喜得格德　拉歐斯頓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIRMSE, KAREN HILDEGARD RALSTON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂正忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種半導體裝置(100)，其包含具有介於-10伏特與-0.5伏特之間之一臨限電位之一基於氮化鎵之低臨限值空乏模式電晶體(GaN FET) (102)。該GaN FET (102)具有支撐一二維電子氣體(2DEG) (114)之包含鎵及氮之III至N族半導體材料之一通道層(108)。該GaN FET (102)具有在該通道層(108)上方之包含鋁及氮之III至N族半導體材料之一障壁層(112)。該GaN FET (102)進一步具有包含鎵及氮之III至N族半導體材料之一p型閘極(124)。該閘極(124)之鄰近於該障壁層(112)之一底表面(136)未延伸超出該障壁層(112)之與該通道層(108)相對定位之一頂表面(138)。該GaN FET (102)在該閘極(124)與該障壁層(112)之間無一介電層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device (100) includes a gallium nitride based low threshold depletion mode transistor (GaN FET) (102) with a threshold potential between -10 volts and -0.5 volts. The GaN FET (102) has a channel layer (108) of III-N semiconductor material including gallium and nitrogen that supports a two-dimensional electron gas (2DEG) (114). The GaN FET (102) has a barrier layer (112) of III-N semiconductor material including aluminum and nitrogen over the channel layer (108). The GaN FET (102) further has a p-type gate (124) of III-N semiconductor material including gallium and nitrogen. A bottom surface (136) of the gate (124), adjacent to the barrier layer (112), does not extend past a top surface (138) of the barrier layer (112), located opposite from the channel layer (108). The GaN FET (102) is free of a dielectric layer between the gate (124) and the barrier layer (112).</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">102:低臨限值空乏模式氮化鎵場效電晶體(GaN FET)</p>
        <p type="p">104:基板</p>
        <p type="p">106:緩衝層</p>
        <p type="p">108:通道層</p>
        <p type="p">110:高帶隙子層</p>
        <p type="p">112:障壁層</p>
        <p type="p">114:二維電子氣體(2DEG)</p>
        <p type="p">116:蝕刻停止層</p>
        <p type="p">124:閘極</p>
        <p type="p">126:通道區域</p>
        <p type="p">128:接達區域</p>
        <p type="p">130:源極區域</p>
        <p type="p">132:汲極區域</p>
        <p type="p">134:介電層</p>
        <p type="p">136:底表面</p>
        <p type="p">138:頂表面</p>
        <p type="p">140:閘極接觸件</p>
        <p type="p">142:源極接觸件</p>
        <p type="p">144:汲極接觸件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2000" publication-number="202616443">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616443</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151595</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">H01L21/67</main-classification>
        <further-classification edition="200601120260112B">H01L21/304</further-classification>
        <further-classification edition="200601120260112B">F26B5/16</further-classification>
        <further-classification edition="200601120260112B">G05B19/43</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井原亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IHARA, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中暁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>五師源太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOSHI, GENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下剛秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, MASAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>二郎
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMANAKA, REIJIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神代英明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMASHIRO, HIDEAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]更確實地抑制被形成於基板的表面之圖案的倒塌。  &lt;br/&gt;　　[解決手段]一種基板處理裝置，係使用超臨界狀態之處理流體，使表面附著有液體的基板乾燥，該基板處理裝置，其特徵係，具備有：處理容器，收容基板；基板保持部，在處理容器內，將表面朝向上，水平地保持基板；第1供給管線，與被設置於處理容器的第1流體供給部連接，將處理流體供給至處理容器內；排出管線，與被設置於處理容器的排出部連接，從處理容器排出處理流體；旁通管線，在被設定於第1供給管線的第1分歧點，從第1供給管線分歧，並且在被設定於排出管線的連接點，與排出管線連接，可使流動於第1供給管線之處理流體的至少一部分不經由處理容器而排出至排出管線；及旁通開關閥，開關旁通管線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:處理單元</p>
        <p type="p">12:處理容器</p>
        <p type="p">12A:上方空間</p>
        <p type="p">12B:下方空間</p>
        <p type="p">14:托盤</p>
        <p type="p">16:蓋部</p>
        <p type="p">18:基板保持部(板體)</p>
        <p type="p">21:第1流體供給部</p>
        <p type="p">22:第2流體供給部</p>
        <p type="p">24:流體排出部</p>
        <p type="p">30:超臨界流體供給裝置</p>
        <p type="p">32:主供給管線</p>
        <p type="p">33:分歧點</p>
        <p type="p">34:第1供給管線</p>
        <p type="p">36:第2供給管線</p>
        <p type="p">38:排出管線</p>
        <p type="p">40:壓力調整閥</p>
        <p type="p">42:分歧點</p>
        <p type="p">44:旁通管線</p>
        <p type="p">46:連接點</p>
        <p type="p">48:分歧點</p>
        <p type="p">50:分歧排出管線</p>
        <p type="p">52:分歧點</p>
        <p type="p">54:分歧排出管線</p>
        <p type="p">56:分歧排出管線</p>
        <p type="p">60:匯流點</p>
        <p type="p">62:沖洗氣體供給管線</p>
        <p type="p">64:分歧點</p>
        <p type="p">66:排氣管線</p>
        <p type="p">100:控制部</p>
        <p type="p">101:運算部</p>
        <p type="p">102:記憶部</p>
        <p type="p">H:加熱器</p>
        <p type="p">F:流量計(流體流量計)</p>
        <p type="p">P:壓力感測器</p>
        <p type="p">T:溫度感測器</p>
        <p type="p">V1:開關閥</p>
        <p type="p">V2:開關閥</p>
        <p type="p">V3:開關閥</p>
        <p type="p">V4:開關閥</p>
        <p type="p">V5:開關閥</p>
        <p type="p">V6:開關閥</p>
        <p type="p">V7:開關閥</p>
        <p type="p">V8:開關閥</p>
        <p type="p">V9:開關閥</p>
        <p type="p">V10:開關閥</p>
        <p type="p">V11:開關閥</p>
        <p type="p">W:基板</p>
        <p type="p">CV:單向閥(止回閥)</p>
        <p type="p">SV:安全閥(釋壓閥)</p>
        <p type="p">OLF:孔口(固定節流)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2001" publication-number="202616721">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616721</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151696</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>編碼裝置、解碼裝置及非暫時性的記憶媒體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260112B">H04N19/50</main-classification>
        <further-classification edition="201401120260112B">H04N19/176</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商松下電器（美國）知識產權公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖如伶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, RU LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　宗順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, CHONG SOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫　海威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, HAI WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　漢文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEO, HAN BOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李靜雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JING YA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏西達　史寇敘巴曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHASHIDHAR, SUGHOSH PAVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安倍清史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, KIYOFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西孝啓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠間正真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMA, TADAMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">編碼裝置具備電路及連接於前述電路的記憶體，電路在動作中：將第1參數寫入位元流，前述第1參數表示預測模式為(i)多工預測模式、或(ii)包含三角形模式之複數個預測模式之中的任一者，前述多工預測模式為將處理對象區塊的間預測圖像與內預測圖像重疊來產生預測圖像的模式，前述三角形模式為將處理對象區塊分割成三角形區域來產生預測圖像的模式；依照預測模式，將處理對象區塊進行編碼。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S3001,S3002:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2002" publication-number="202615241">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615241</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151749</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚酯膜、偏光板及影像顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">B29D7/01</main-classification>
        <further-classification edition="200601120260112B">B29D11/00</further-classification>
        <further-classification edition="200601120260112B">C08J5/18</further-classification>
        <further-classification edition="200601120260112B">G02B5/30</further-classification>
        <further-classification edition="200601120260112B">G02F1/1335</further-classification>
        <further-classification edition="202301120260112B">H10K59/80</further-classification>
        <further-classification edition="200601320260112B">B29K67/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日本印刷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中佳子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, YOSHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀田光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOTTA, HIKARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久保田翔生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBOTA, SHOSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黒田剛志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURODA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牛山章伸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USHIYAMA, AKINOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種於不增加厚度之情況而鉛筆硬度良好之聚酯膜。本發明係一種聚酯膜，其聚酯膜表面之馬氏硬度之平均為140.0 N/mm&lt;sup&gt;2&lt;/sup&gt;以上，且上述聚酯膜表面之馬氏硬度之標準偏差3σ為9.0 N/mm&lt;sup&gt;2&lt;/sup&gt;以上且36.0 N/mm&lt;sup&gt;2&lt;/sup&gt;以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2003" publication-number="202616773">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616773</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151768</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於發光裝置的偽指數編碼及相關方法</chinese-title>
        <english-title>PSEUDO-EXPONENTIAL ENCODING FOR LIGHT-EMITTING DEVICES AND RELATED METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260107B">H05B45/325</main-classification>
        <further-classification edition="202501120260107B">H10H20/85</further-classification>
        <further-classification edition="202001120260107B">H05B45/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科銳ＬＥＤ公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CREELED, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡塞爾　克里斯多福　Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUSSELL, CHRISTOPHER P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示發光裝置，且更特定言之具有偽指數編碼之發光裝置及相關方法。偽指數編碼或偽指數變換是指包括置放某些資料位元同時以偏離指數變換之一方式引入至少一個資料位元的編碼及解碼技術。該偏離涉及引入該至少一個資料位元以避免在解碼期間可以其他方式存在之重複零值。例示性發光裝置包括發光二極體（LED）封裝及/或LED顯示器。本文中所描述之偽指數編碼提供位元移位及操縱以用於增加動態範圍並且降低硬體資源之複雜度及大小。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Light-emitting devices and, more particularly, light-emitting devices with pseudo-exponential encoding and related methods are disclosed. Pseudo-exponential encoding or pseudo-exponential transformation refers to encoding and decoding techniques that include placement of certain data bits while at least one data bit is introduced in a manner that deviates from exponential transformation. The deviation involves introducing the at least one data bit to avoid duplicate zero values that may otherwise be present during decoding. Exemplary light-emitting devices include light-emitting diode (LED) packages and/or LED displays. Pseudo-exponential encoding as described herein provides bit shifting and manipulation for increased dynamic range with reduced complexity and size of hardware resources.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:LED封裝</p>
        <p type="p">18:主動電子元件</p>
        <p type="p">20-1:LED</p>
        <p type="p">20-2:LED</p>
        <p type="p">20-3:LED</p>
        <p type="p">22:控制邏輯</p>
        <p type="p">24:反相器</p>
        <p type="p">26:驅動器</p>
        <p type="p">28-1:電流源</p>
        <p type="p">28-2:電流源</p>
        <p type="p">28-3:電流源</p>
        <p type="p">30:多工器</p>
        <p type="p">32:串列介面</p>
        <p type="p">34-1:PWM處理器</p>
        <p type="p">34-2:PWM處理器</p>
        <p type="p">34-3:PWM處理器</p>
        <p type="p">36-1:解碼器</p>
        <p type="p">36-2:解碼器</p>
        <p type="p">36-3:解碼器</p>
        <p type="p">DIO1:埠</p>
        <p type="p">DIO2:埠</p>
        <p type="p">GND:接地/埠</p>
        <p type="p">LED1:數位輸出信號/輸出信號/輸出PWM信號/PWM信號</p>
        <p type="p">LED2:數位輸出信號/輸出信號/輸出PWM信號/PWM信號</p>
        <p type="p">LED3:數位輸出信號/輸出信號/輸出PWM信號/PWM信號</p>
        <p type="p">R1:上拉電阻器</p>
        <p type="p">R2:上拉電阻器</p>
        <p type="p">R3:上拉電阻器</p>
        <p type="p">Vdd:供應電壓/埠</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2004" publication-number="202616607">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616607</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151778</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有故障管理的可重構電池系統</chinese-title>
        <english-title>A RECONFIGURABLE BATTERY SYSTEM WITH FAULT MANAGEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260107B">H02J7/34</main-classification>
        <further-classification edition="201901120260107B">B60L58/19</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澳大利亞商銳萊控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RELECTRIFY HOLDINGS PTY LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅科　安東尼奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROCCO, ANTONIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍德考克　史密斯　馬修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOODCOCK-SMITH, MATTHEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普拉澤雷斯　何塞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRAZERES, JOSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可重構電池系統具有多個單體電池，每個單體電池通過開關電路選擇性與其它單體電池串聯連接以控制組合串聯輸出電壓。開關電路具有佈置成單獨或選擇性組合地來控制每個單體電池的串聯連接或旁路的多個開關，開關電路至少具有第一開關組和第二開關組，每組包括開關選擇。多個握手電路均配置為控制一個或更多個握手訊號。多個單體電池控制器均配置為基於一個或更多個接收握手訊號在操作模式和一個或更多個故障模式之一中操作，在操作模式中操作第一開關組的開關，在故障模式中基於接收握手訊號選擇性操作第二開關組的至少一個開關。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">210:握手鏈路</p>
        <p type="p">302b:握手電路接收器</p>
        <p type="p">304a:握手電路</p>
        <p type="p">304b:握手電路接收器</p>
        <p type="p">306a:發射器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2005" publication-number="202616346">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616346</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151853</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿處理裝置及基板處理系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">H01J37/32</main-classification>
        <further-classification edition="200601120260113B">H01L21/683</further-classification>
        <further-classification edition="200601120260113B">H05H1/46</further-classification>
        <further-classification edition="200601120260113B">H01L21/3065</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川学</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, MANABU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤悠貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今橋拓巳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAHASHI, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊谷裕貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAGAI, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>及川翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OIKAWA, SHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黒田亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURODA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明所揭示之電漿處理裝置包含腔室、基板支持部、邊緣環、升降機構、電漿產生部及偏壓電源。基板支持部配置於腔室內。升降機構構成為能夠使邊緣環相對於基板支持部上下移動。基板支持部包含與偏壓電源及/或電漿產生部之高頻電源電性耦合之基台、及基台上之靜電吸盤。升降機構包含導電環及連接構件，導電環以支持該導電環上載置之邊緣環之狀態與邊緣環電性耦合。連接構件構成為根據由升降機構引起之邊緣環及導電環之移動來維持導電環與基台之間的電性連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電漿處理裝置</p>
        <p type="p">2:控制部</p>
        <p type="p">2a:電腦</p>
        <p type="p">2a1:處理部</p>
        <p type="p">2a2:記憶部</p>
        <p type="p">2a3:通信介面</p>
        <p type="p">10:腔室</p>
        <p type="p">11:基板支持部</p>
        <p type="p">12:電漿產生部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2006" publication-number="202614956">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202614956</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151860</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自清潔設備及清潔系統</chinese-title>
        <english-title>AUTOMATIC CLEANING DEVICE AND CLEANING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">A47L11/14</main-classification>
        <further-classification edition="200601120260114B">A47L11/24</further-classification>
        <further-classification edition="200601120260114B">A47L11/283</further-classification>
        <further-classification edition="200601120260114B">A47L11/292</further-classification>
        <further-classification edition="200601120260114B">A47L11/40</further-classification>
        <further-classification edition="200601120260114B">A47L13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓策</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, CE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐洪亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, HONGLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉曉明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, XIAOMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請揭露了一種自清潔設備(100)和清潔系統。自清潔設備(100)包括：移動平台(10)，被配置為在操作面上自移動；至少一個第一清潔組件(20)，可活動式地設於移動平台(10)，並可在第一位置和第二位置之間切換；至少一個第二清潔組件(30)，可活動式地設於移動平台(10)，並可在第三位置和第四位置之間切換；其中，第一清潔組件(20)和第二清潔組件(30)間隔設置，並位於自清潔設備(100)行駛方向的同一側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application discloses an automatic cleaning device (100) and a cleaning system. The automatic cleaning device (100) includes: a mobile platform (10) configured to automatically move on an operation surface; at least one first cleaning assembly (20) movably arranged on the mobile platform (10) and switchable between a first position and a second position; and at least one second cleaning assembly (30) movably arranged on the mobile platform (10) and switchable between a third position and a fourth position, where the first cleaning assembly (20) and the second cleaning assembly (30) are spaced apart from each other and located on the same side of a driving direction of the automatic cleaning device (100).</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:移動平台</p>
        <p type="p">20:第一清潔組件</p>
        <p type="p">30:第二清潔組件</p>
        <p type="p">40:主刷</p>
        <p type="p">R:中軸線</p>
        <p type="p">S1:第一距離</p>
        <p type="p">S2:第二距離</p>
        <p type="p">S3:第三距離</p>
        <p type="p">S4:第四距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2007" publication-number="202616827">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616827</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151888</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260109B">H10B41/27</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒井伸也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田口雄太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAGUCHI, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據一實施例，一種半導體裝置包含：一第一晶片，其包含一基板；及一第二晶片，其在一第一表面處接合至該第一晶片。該第一晶片及該第二晶片之各者包含一元件區及包含一晶片端部之一端區。該第一晶片包含配置於該端區中之該第一表面上且處於一電未耦合狀態中之複數個第一電極。該第二晶片包含配置於該端區中之該第一表面上、處於一電未耦合狀態中且分別與該等第一電極接觸之複數個第二電極。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to an embodiment, a semiconductor device includes a first chip including a substrate, and a second chip bonded to the first chip at a first surface. Each of the first chip and the second chip includes an element region, and an end region including a chip end portion. The first chip includes a plurality of first electrodes that are arranged on the first surface in the end region and are in an electrically uncoupled state. The second chip includes a plurality of second electrodes that are arranged on the first surface in the end region, are in an electrically uncoupled state, and are respectively in contact with the first electrodes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體裝置</p>
        <p type="p">AR:主動墊區</p>
        <p type="p">Bpa,Bpdi,BPdk,Bpdo,BPw2,BPw3:接合墊</p>
        <p type="p">DR:虛設墊區</p>
        <p type="p">ER:元件區</p>
        <p type="p">KR:切口區</p>
        <p type="p">OR:外周邊區</p>
        <p type="p">WR:壁區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2008" publication-number="202616099">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616099</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151957</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於儲存的系統、以及用於實行通訊管理的裝置及方法</chinese-title>
        <english-title>SYSTEM FOR STORAGE, DEVICE AND METHOD FOR PERFORMING COMMUNICATION MANAGEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">G06F13/42</main-classification>
        <further-classification edition="201901120260109B">G06F16/40</further-classification>
        <further-classification edition="202201120260109B">H04L67/06</further-classification>
        <further-classification edition="202201120260109B">H04L49/351</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡恩　卡羅萊恩　戴安娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAHN, CAROLINE DIANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐拉利格　桑龐　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLARIG, SOMPONG PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞巴利　伊爾克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CEBALI, ILKER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供用於實行通訊管理的系統、方法及設備。所述方法可包括：經由第一埠自管理裝置接收帶內資料；產生用於將帶內資料路由至基座中的至少一個儲存裝置的路由資訊；將路由資訊應用至與帶內資料相關聯的資料的封包的標頭；以及基於路由資訊將帶內資料經由第二埠傳輸至所述儲存裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are systems, methods, and apparatuses for performing communication management. The method can include: receiving, via a first port, in-band data from a management device; generating routing information for routing the in-band data to at least one storage device in a chassis; applying the routing information to a header of a packet of data associated with the in-band data; and transmitting, via a second port, the in-band data to the storage device based on the routing information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">702、704、706、708:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2009" publication-number="202615095">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615095</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151960</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗ＲＳＶ單株抗體配製物</chinese-title>
        <english-title>ANTI-RSV MONOCLONAL ANTIBODY FORMULATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">A61K39/395</main-classification>
        <further-classification edition="200601120260114B">A61K47/18</further-classification>
        <further-classification edition="200601120260114B">A61K47/26</further-classification>
        <further-classification edition="200601120260114B">A61K9/19</further-classification>
        <further-classification edition="200601120260114B">C07K16/28</further-classification>
        <further-classification edition="200601120260114B">A61P31/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商梅迪繆思有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIMMUNE LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅玻　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOBO, BRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高登伯格　黛博拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOLDBERG, DEBORAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種配製物，該配製物包含： (i) 抗RSV單株抗體；和 (ii) 離子型賦形劑；其中該單株抗體以約50 mg/ml或更高的濃度存在且該離子型賦形劑以在50至150 mM之間的濃度存在，並且該配製物具有約5.5至約7.5的pH。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a formulation comprising: (i) an anti-RSV monoclonal antibody; and (ii) an ionic excipient; wherein the monoclonal antibody is present at a concentration of about 50mg/ml or greater and the ionic excipient is present at a concentration of between 50 and 150 mM and the formulation has a pH of about 5.5 to about 7.5.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2010" publication-number="202615276">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615276</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151970</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>胯帶長度調整裝置、腰帶距離調整裝置和兒童載具</chinese-title>
        <english-title>CROTCH BELT LENGTH ADJUSTING DEVICE, WAIST BELT DISTANCE ADJUSTING DEVICE AND CHILD CARRIER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">B60N2/28</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁嘉俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, JIAJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張大亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, DALIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李如意</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, RUYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方淦清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, GANQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供了一種兒童載具的胯帶長度調整裝置、腰帶距離調整裝置和兒童載具，其中，胯帶長度調整裝置包括：胯帶，具有第一端和第二端，胯帶的第一端連接於兒童載具的座部；調整孔和多個第二孔，均貫穿座部而形成，胯帶的第二端從座部的上表面穿過調整孔而到達座部的下表面，隨後從下表面穿過其中一個第二孔而露出於上表面，並且第二端的露出於上表面的部分設有第二端阻擋件，第二端阻擋件被設置成不能穿過第二孔。本公開的胯帶長度調整裝置能夠以不同的檔位來調整胯帶的長度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a crotch belt length adjusting device for a child carrier, a waist belt distance adjusting device and a child carrier, wherein the crotch belt length adjusting device includes: a crotch belt having a first end and a second end, with the first end of the crotch belt being connected to a seat part of the child carrier; and an adjustment hole and a plurality of second holes both formed penetrating through the seat part, with the second end of the crotch belt being passing through the adjustment hole from an upper surface of the seat part to a lower surface of the seat part, and then passing through one of the second holes from the lower surface to be exposed on the upper surface, and a portion of the second end exposed on the upper surface being provided with a second end obstruction member, and the second end obstruction member being arranged as unable to pass through the second hole. The crotch belt length adjusting device according to the disclosure can adjust the length of the crotch belt at different adjusting positions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:兒童載具</p>
        <p type="p">10:座部</p>
        <p type="p">11A:上表面</p>
        <p type="p">111:限位肋</p>
        <p type="p">12:調整孔</p>
        <p type="p">13:第二孔</p>
        <p type="p">131:一檔第二孔</p>
        <p type="p">132:二檔第二孔</p>
        <p type="p">133:三檔第二孔</p>
        <p type="p">14:連接孔</p>
        <p type="p">15:第一孔</p>
        <p type="p">100A:胯帶長度調整裝置</p>
        <p type="p">100:胯帶</p>
        <p type="p">101:第一端</p>
        <p type="p">102:第二端</p>
        <p type="p">102A:第二端阻擋件</p>
        <p type="p">20:扣具</p>
        <p type="p">W:寬度方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2011" publication-number="202616410">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616410</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114152094</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>估計腔室狀態的腔室監測元件以及估計腔室狀態的方法</chinese-title>
        <english-title>CHAMBER MONITORING DEVICE OF ESTIMATING STATE OF CHAMBER AND METHOD OF ESTIMATING STATE OF CHAMBER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">H01L21/66</main-classification>
        <further-classification edition="200601120260113B">G01S13/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商怡色公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AETHER, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金宰顯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JAEHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裵仁植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, INSHIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李相元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SANG WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容揭露了一種藉由腔室監測元件來估計腔室狀態的方法。特別地，方法包括：獲得與以N個元素中的每一者作為軸的N維座標系中的Y個座標對應的Y個參考狀態資料；藉由計算當前狀態資料與Y個參考資料中的每一者之間的相似性來產生Y個第一狀態相似性資料；藉由基於所述Y個第一狀態相似性資料在N維座標系中實行內插或外插中的至少一者來確定整個座標的多個第二狀態相似性資料；以及根據以下座標來估計所述N個元素中的每一者的當前狀態，座標包括於與多個第二狀態相似性資料中所包括的多個第二狀態相似性之中具有最大值的第二狀態相似性對應的作為估計狀態相似性資料的第二狀態相似性資料中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure discloses a method of estimating a state of a chamber by a chamber monitoring device. Especially the method comprising: obtaining Y reference state data corresponding to Y coordinates in an N dimensional coordinate system having each of N elements as an axis; generating Y first state similarity data by calculating similarities between the current state data and each of the Y reference data; determining multitude of second state similarity data for the whole coordinates by performing at least one of interpolation or extrapolation in the N dimensional coordinate system based on the Y first state similarity data; and estimating current states of the each of the N elements according to coordinate included in a second state similarity data corresponding to a second state similarity having a maximum value among the second state similarities included in multitude of second state similarity data as an estimation state similarity data.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2012" publication-number="202616716">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616716</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114152146</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>解碼裝置、編碼裝置及發送裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260112B">H04N19/117</main-classification>
        <further-classification edition="201401120260112B">H04N19/136</further-classification>
        <further-classification edition="201401120260112B">H04N19/82</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商松下電器（美國）知識產權公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加納龍一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANOH, RYUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西孝啓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠間正真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMA, TADAMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的編碼裝置實現進一步的改善，其具備處理電路及記憶體，處理電路利用該記憶體，於分別由複數個像素組成的各區塊，利用基底來將該區塊轉換成由複數個轉換係數組成的區塊，於由該複數個轉換係數組成的各區塊，藉由對該區塊至少進行反轉換，來重構成由複數個像素組成的區塊，並根據經重構之相互鄰接的2個區塊各自在轉換中所用的基底組合，來決定相對於該2個區塊的邊界的濾波特性，進行具有已決定的濾波特性的去區塊濾波處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1201~S1203:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2013" publication-number="202616496">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616496</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114152165</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有遍及晶片的高效散熱結構的半導體裝置結構及其單片式製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE STRUCTURE WITH EFFICIENT HEAT-REMOVAL STRUCTURES ACROSS THE CHIP AND MONOLITHIC FABRICATION METHOD THEREFOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">H01L23/36</main-classification>
        <further-classification edition="200601120260113B">H01L23/373</further-classification>
        <further-classification edition="200601120260113B">H01L21/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日日新半導體架構股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTION AND COLLABORATION LABORATORY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧超群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHAO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露包含散熱結構（例如在半導體基板內的高熱傳導率柱及/或板）的裝置結構以提高散熱。裝置結構包含具有原始半導體表面的半導體基板、位於半導體基板的半導體本體區內的電路元件、以及在半導體基板中且圍繞半導體本體區的垂直散熱柱。其中垂直散熱柱包含散熱材料，散熱材料的熱傳導率高於半導體基板的熱傳導率或高於氧化矽的熱傳導率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a device structure including heat removal structure (such as high thermal conductivity column and/or plate within the semiconductor substrate) to enhance heat dissipation. The device structure comprises a semiconductor substrate with an original semiconductor surface; a circuit element located within a semiconductor body region of the semiconductor substrate; and a vertical heat dissipation column in the semiconductor substrate and surrounding the semiconductor body region. Wherein the vertical heat dissipation column comprises a thermal dissipation material with a thermal conductivity higher than that of the semiconductor substrate or that of silicon oxide.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:墊氧化物層</p>
        <p type="p">102:墊氮化物層-1</p>
        <p type="p">201:淺溝槽隔離區</p>
        <p type="p">701:氧化物層</p>
        <p type="p">702:Z材料</p>
        <p type="p">t2:深度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2014" publication-number="202615002">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615002</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114152252</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用阿曲生坦（ＡＴＲＡＳＥＮＴＡＮ）治療ＩｇＡ腎病的方法</chinese-title>
        <english-title>METHODS OF TREATING IGA NEPHROPATHY WITH ATRASENTAN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">A61K31/4025</main-classification>
        <further-classification edition="200601120260114B">A61P13/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商奇努克醫療股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINOOK THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗洛里奇　菲利浦Ｔ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FROHLICH, PHILIP THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　安德魯Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING, ANDREW JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉馬強德瑞　奇丹巴拉姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMACHANDRAN, CHIDAMBARAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾恩伯格　莎拉Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOONBERG, SARAH BETH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供治療IgA腎病的方法，包括向有需要的受試者施用治療有效量的阿曲生坦或其藥學上可接受的鹽。本文還提供在患有IgA腎病的受試者中減少腎臟炎症和/或纖維化、減少血尿症發生、穩定eGFR、減少IgA-腎病相關的疾病發作的數量、延遲ESRD發作、減少蛋白尿和減少疲勞的方法，包括向受試者施用治療有效量的阿曲生坦或其藥學上可接受的鹽。在一些實施方案中，受試者先前未被診斷患有以下的一種或多種：糖尿病腎病、HIV/AIDS、HIV-相關的腎病、前列腺癌或急性腎衰竭。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are methods of treating IgA nephropathy, comprising administering a therapeutically effective amount of atrasentan, or a pharmaceutically acceptable salt thereof, to a subject in need thereof. Also provided herein are methods of decreasing renal inflammation and/or fibrosis, decreasing the occurrence of hematuria, stabilizing eGFR, decreasing the number of IgA-nephropathy associated disease flares, delaying the onset of ESRD, decreasing proteinuria, and decreasing fatigue in a subject having IgA nephropathy, comprising administering a therapeutically effective amount of atrasentan, or a pharmaceutically acceptable salt thereof, to the subject. In some embodiments, the subject has not been previously diagnosed with one or more of diabetic nephropathy, HIV/AIDS, HIV-related nephropathy, prostate cancer, or acute kidney failure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2015" publication-number="202616504">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616504</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100096</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H01L23/498</main-classification>
        <further-classification edition="200601120260109B">H01L21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳顯德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIEN TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置包括：一目標基板、陣列式微半導體結構、陣列式接合件、以及一接合層。陣列式微半導體結構設於目標基板。陣列式接合件對應陣列式微半導體結構、且電連接陣列式微半導體結構至目標基板之圖樣電路；倆倆接合件彼此獨立；各該接合件為由設於該目標基板之一導電墊片、與設於各該微半導體結構之一導電電極通過共晶鍵合之一體性構件。接合層連接各微半導體結構至目標基板；其中，該接合層不具導電材料；各該接合件恰由該接合層接觸包覆，該接合層與該等陣列式接合件形成同層關係。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes a designation substrate, a semiconductor array with plural semiconductor structures, a conductor array with plural conductor members, and a connection layer. The semiconductor structures of the semiconductor array are arranged on the designation substrate. The conductors of the conductor array correspond to the semiconductor structures of the semiconductor array for electrically connecting the semiconductor structures to the designation substrate. The conductors are independent and individual from each other. Each of the conductors is formed of integrity by eutectic bonding between a contact pad of the designation substrate and an electrode of a corresponding one of the semiconductor structures. The connection layer, which excludes conductive materials, joins the semiconductor structures to the designation substrate; and contacts a peripheral surface of each conductor for accommodating the conductors therewith.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電子裝置</p>
        <p type="p">100:目標基板</p>
        <p type="p">110:板材</p>
        <p type="p">200:微半導體結構</p>
        <p type="p">210:本體</p>
        <p type="p">300:接合件</p>
        <p type="p">40:接合層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2016" publication-number="202615927">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615927</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100117</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有連續自適應變焦係數的折疊式相機</chinese-title>
        <english-title>FOLDED CAMERAS WITH CONTINUOUSLY ADAPTIVE ZOOM FACTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">G02B13/00</main-classification>
        <further-classification edition="200601120260109B">G02B9/34</further-classification>
        <further-classification edition="202101120260109B">G02B7/04</further-classification>
        <further-classification edition="202101120260109B">G02B7/18</further-classification>
        <further-classification edition="202101120260109B">G03B17/17</further-classification>
        <further-classification edition="202301120260109B">H04N23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商核心光電有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COREPHOTONICS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古林斯克　納達夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOULINSKI, NADAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅迪克　羅伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUDNICK, ROY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈登堡　以法蓮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOLDENBERG, EPHRAIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>耶德　伊泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEDID, ITAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德羅　邁克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DROR, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥諾　伊泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANOR, ITAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝梅什　齊夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEMESH, ZIV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">折疊式長焦相機包括：光路折疊元件，用於將第一光路折疊到第二光路；鏡頭，包括N個鏡頭元件，鏡頭劃分成四個鏡頭組，四個鏡頭組沿著鏡頭光軸排列並且從鏡頭的物體側到影像側依序標記為G1至G4；以及影像感測器；其中鏡頭組中的鏡頭元件相對於彼此不移動；其中G1及G3相對於彼此不移動；其中G2及G4相對於彼此不移動；其中折疊式長焦相機配置成用以，通過相對於影像感測器一起移動G1及G3及通過相對於影像感測器一起移動G2及G4，在最小變焦係數與最大變焦係數之間連續地改變變焦係數，最小變焦係數對應最小有效焦距，最大變焦係數對應最大有效焦距。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Folded Tele cameras, comprising: an optical path folding element (OPFE) for a folding a first optical path OP1 to second optical path OP2, a lens including N lens elements, the lens being divided into four lens groups arranged along a lens optical axis and marked, in order from an object side of the lens to an image side of the lens, G1, G2, G3 and G4, and an image sensor, wherein the lens elements of a lens group do not move with respect to each other, wherein G1 and G3 do not move with respect to each other, wherein G2 and G4 do not move with respect to each other, wherein the Tele camera is configured to change a zoom factor (ZF) continuously between a minimum zoom factor marked ZF&lt;sub&gt;MIN&lt;/sub&gt; corresponding to a minimal effective focal length marked EFL&lt;sub&gt;MIN&lt;/sub&gt; and a maximum zoom factor marked ZF&lt;sub&gt;MAX&lt;/sub&gt; corresponding to a maximal effective focal length marked EFL&lt;sub&gt;MAX&lt;/sub&gt; by moving G1 and G3 together relative to the image sensor and by moving G2 and G4 together relative to the image sensor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">160:FCZT相機</p>
        <p type="p">162:OPFE</p>
        <p type="p">164:鏡頭</p>
        <p type="p">166:光學元件</p>
        <p type="p">168:影像感測器</p>
        <p type="p">d&lt;sub&gt;MIN&lt;/sub&gt;:最小距離</p>
        <p type="p">G1~G4:鏡頭組</p>
        <p type="p">G24:組</p>
        <p type="p">TTL&lt;sub&gt;MIN&lt;/sub&gt;:最小總軌道長度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2017" publication-number="202616347">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616347</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100209</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿系統</chinese-title>
        <english-title>PLASMA SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H01J37/32</main-classification>
        <further-classification edition="200601120260109B">H05H1/46</further-classification>
        <further-classification edition="200601120260109B">H03K3/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商鷹港科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EAGLE HARBOR TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇巴　堤摩西Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZIEMBA, TIMOTHY M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米勒　肯尼斯Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MILLER, KENNETH E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案的多個實施例包括電漿系統。電漿系統包括一電漿室，電漿室包括多個壁及一晶圓支撐件；一射頻驅動器，包括多個固態開關排列成一全橋配置，並以大於2.0百萬赫茲的一高頻率驅動多個射頻訊號至電漿室內；一奈秒級脈衝產生器，以一脈衝重複頻率驅動脈衝至電漿室內，脈衝重複頻率小於高頻率；一第一濾波器，位於射頻驅動器與電漿室之間；以及一第二濾波器，位於奈秒級脈衝產生器與電漿室之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the invention include a plasma system. The plasma system includes a plasma chamber comprising a plurality of walls and a wafer support; an RF driver comprising a plurality of solid state switches arranged in a full-bridge configuration and drives RF signals into the plasma chamber with a high frequency that is greater than 2.0 MHz; a nanosecond pulser drives pulses into the plasma chamber with a pulse repetition frequency, the pulse repetition frequency being less than the high frequency; a first filter disposed between the RF driver and the plasma chamber; and a second filter disposed between the nanosecond pulser and the plasma chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">105:射頻驅動器</p>
        <p type="p">110:電漿室</p>
        <p type="p">115:奈秒級脈衝產生器</p>
        <p type="p">120:電極</p>
        <p type="p">130:電容器</p>
        <p type="p">135:電感器</p>
        <p type="p">300:電漿系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2018" publication-number="202615959">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615959</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100355</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>照相機模組以及包含其的電子裝置</chinese-title>
        <english-title>CAMERA MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260115B">G03B13/02</main-classification>
        <further-classification edition="200601120260115B">G02B17/08</further-classification>
        <further-classification edition="202101120260115B">G02B7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金學哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HAG CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林台淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, TAE YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭弼鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, PHIL HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙鏞主</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, YONG JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種照相機模組以及包含其的電子裝置。本發明提供一種照相機模組，包含：第一透鏡群組；第一光學路徑折疊單元；第二透鏡群組；以及第二光學路徑折疊單元。第一透鏡群組、第一光學路徑折疊單元、第二透鏡群組以及第二光學路徑折疊單元自第一透鏡群組的物側朝向照相機模組的成像平面依序安置。第一光學路徑折疊單元包含第一固定反射部件及第一可移動反射部件，第一可移動反射部件經組態以改變第一透鏡群組與第二透鏡群組之間的光學路徑的長度，且第二光學路徑折疊單元包含第二固定反射部件及第二可移動反射部件，第二可移動反射部件經組態以改變第二透鏡群組與成像平面之間的光學路徑的長度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A camera module and an electronic device including the same are provided. A camera module includes a first lens group; a first optical path folding unit; a second lens group; and a second optical path folding unit. The first lens group, the first optical path folding unit, the second lens group, and the second optical path folding unit are sequentially disposed from an object side of the first lens group toward an imaging plane of the camera module. The first optical path folding unit includes a first fixed reflective member and a first movable reflective member configured to vary a length of an optical path between the first lens group and the second lens group, and the second optical path folding unit includes a second fixed reflective member and a second movable reflective member configured to vary a length of an optical path between the second lens group and an imaging plane.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:照相機模組</p>
        <p type="p">110:第一透鏡</p>
        <p type="p">120:第二透鏡</p>
        <p type="p">130:第三透鏡</p>
        <p type="p">140:第四透鏡</p>
        <p type="p">150:第五透鏡</p>
        <p type="p">C1:第一光軸</p>
        <p type="p">C2:第二光軸</p>
        <p type="p">C3:第三光軸</p>
        <p type="p">C4:第四光軸</p>
        <p type="p">C5:第五光軸</p>
        <p type="p">C6:第六光軸</p>
        <p type="p">C7:第七光軸</p>
        <p type="p">C8:第八光軸</p>
        <p type="p">C9:第九光軸</p>
        <p type="p">DM1:第一可移動反射部件</p>
        <p type="p">DM2:第二可移動反射部件</p>
        <p type="p">DMS1:第一可移動反射表面</p>
        <p type="p">DMS2:第二可移動反射表面</p>
        <p type="p">DMS3:第三可移動反射表面</p>
        <p type="p">DMS4:第四可移動反射表面</p>
        <p type="p">FM1:第一固定反射部件</p>
        <p type="p">FM2:第二固定反射部件</p>
        <p type="p">FMS1:第一固定反射表面</p>
        <p type="p">FMS2:第二固定反射表面</p>
        <p type="p">FMS3:第三固定反射表面</p>
        <p type="p">FMS4:第四固定反射表面</p>
        <p type="p">G1:第一透鏡群組</p>
        <p type="p">G2:第二透鏡群組</p>
        <p type="p">IF:濾光片</p>
        <p type="p">IP:影像感測器</p>
        <p type="p">M1:第一光學路徑折疊單元</p>
        <p type="p">M2:第二光學路徑折疊單元</p>
        <p type="p">OP:路徑</p>
        <p type="p">P:稜鏡</p>
        <p type="p">TLD:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2019" publication-number="202615165">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615165</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100373</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔用於錫化合物之裝置的方法及藉此所獲得之經清潔之裝置</chinese-title>
        <english-title>METHOD FOR CLEANING AN APPARATUS FOR A TIN COMPOUND AND THE CLEANED APPARATUS OBTAINED THEREBY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">B08B3/04</main-classification>
        <further-classification edition="200601120260109B">B08B3/08</further-classification>
        <further-classification edition="200601120260109B">B08B3/10</further-classification>
        <further-classification edition="200601120260109B">C11D7/08</further-classification>
        <further-classification edition="200601120260109B">C11D7/26</further-classification>
        <further-classification edition="200601120260109B">C11D7/50</further-classification>
        <further-classification edition="200601120260109B">C07F7/22</further-classification>
        <further-classification edition="200601120260109B">G03F7/004</further-classification>
        <further-classification edition="200601120260109B">H01L21/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蓋列斯特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GELEST, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大陽日酸股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIYO NIPPON SANSO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井洸毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, KOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福井浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUI, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亀岡崇史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMEOKA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　力</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供有效及安全地清潔用於錫化合物之裝置之方法及高度經淨化之錫化合物裝置。一種與具有下式(1)之錫化合物接觸之裝置之清潔方法，該方法至少包含步驟(A)至(C)，其中在步驟(A)之後實施步驟(B)，且在步驟(B)之後實施步驟(C)：  &lt;br/&gt;(A)使用非質子溶劑清潔該裝置之步驟，  &lt;br/&gt;(B)使用醇清潔該裝置之步驟，及  &lt;br/&gt;(C)使用25℃下電阻率值為17 MΩ·cm之超純水清潔該裝置之步驟。  &lt;br/&gt;R&lt;sub&gt;p&lt;/sub&gt;SnX&lt;sub&gt;m&lt;/sub&gt; (1)  &lt;br/&gt;在式(1)中，R係烴基，p係1至3之整數，X係可水解取代基，且m = 4-p。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for efficiently and safely cleaning an apparatus for tin compound and a highly purified tin compound apparatus are provided. A cleaning method for an apparatus that has been in contact with a tin compound having formula (1) below includes at least steps (A) to (C), in which step (B) is performed after step (A), and step (C) is performed after step (B): &lt;br/&gt;(A) a step of cleaning the apparatus with a non-protic solvent, &lt;br/&gt;(B) a step of cleaning the apparatus with alcohol, and &lt;br/&gt;(C) a step of cleaning the apparatus with ultrapure water having a resistivity value of 17 MΩ·cm at 25°C. &lt;br/&gt;R&lt;sub&gt;p&lt;/sub&gt;SnX&lt;sub&gt;m&lt;/sub&gt; (1) &lt;br/&gt;In formula (1), R is a hydrocarbon group, p is an integer from 1 to 3, X is a hydrolyzable substituent, and m = 4-p.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2020" publication-number="202616779">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616779</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100374</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿處理裝置及電漿處理方法</chinese-title>
        <english-title>GAS SUPPLY RING AND SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260109B">H05H1/46</main-classification>
        <further-classification edition="200601120260109B">H05H1/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹内貴広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEUCHI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電漿處理裝置及電漿處理方法，利用複數種高頻電力脈衝訊號，改善製程的性能。該電漿處理裝置，具備：第1匹配電路及第2匹配電路，與腔室耦合；第1RF產生部，與第1匹配電路耦合，產生包含複數個第1脈衝循環的第1RF脈衝訊號，第1脈衝循環，包含第1期間、第2期間及第3期間，第1RF脈衝訊號，於第1期間具有第1功率位準，於第2期間具有第2功率位準，並於第3期間具有第3功率位準；第2RF產生部，與第2匹配電路耦合，產生包含複數個第2脈衝循環的第2RF脈衝訊號，第2脈衝循環，包含第4期間及第5期間，第2RF脈衝訊號之頻率，較第1RF脈衝訊號之頻率更低，第2RF脈衝訊號，於第4期間具有第4功率位準，並於第5期間具有第5功率位準，第4期間為30μs以下，第4期間並未和第1期間重複；以及第3RF產生部，與第2匹配電路耦合，產生包含複數個第3脈衝循環的第3RF脈衝訊號，第3脈衝循環，包含第6期間及第7期間，第3RF脈衝訊號之頻率，較第2RF脈衝訊號之頻率更低，第3RF脈衝訊號，於第6期間具有第6功率位準，並於第7期間具有第7功率位準，第6期間並未和第1期間及第4期間重複。&lt;u&gt;  &lt;/u&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A gas supply ring for use in a substrate processing apparatus includes an inner face, an outer face, a first face between the inner face and the outer face, and a second face between the inner face and the outer face and opposite to the first face. The outer face has at least one gas inlet and the first face has an outer groove in communication with the at least one gas inlet. The second face has first and second middle grooves in communication with the outer groove. The first face further has first to fourth inner grooves disposed medial to the outer groove. The inner face has a plurality of gas outlets and each of the gas outlets is in communication with any one of the first to fourth inner grooves.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2021" publication-number="202615042">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615042</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100570</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療進行性纖維化間質性肺病之新穎治療組合</chinese-title>
        <english-title>NEW THERAPEUTIC COMBINATIONS FOR THE TREATMENT OF PROGRESSIVE FIBROSING INTERSTITIAL LUNG DISEASES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">A61K31/519</main-classification>
        <further-classification edition="200601120260114B">A61K31/496</further-classification>
        <further-classification edition="200601120260114B">A61K31/4418</further-classification>
        <further-classification edition="200601120260114B">A61P11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商百靈佳殷格翰國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOEHRINGER INGELHEIM INTERNATIONAL GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀斯林格　克里斯宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HESSLINGER, CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑爾　維瑞納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAUER, VERENA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博賽特　賽巴斯汀　馬丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOSSERT, SEBASTIAN MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫柏　蘇珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBER, SUSAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉藝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼柯勞斯　彼德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NICKOLAUS, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩諾　瑪莉亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SARNO, MARIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃斯　弗羅利安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VOSS, FLORIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種口服醫藥組合物，其包含  &lt;br/&gt;•18 mg或9 mg式III之PDE4B抑制劑  &lt;br/&gt;&lt;img align="absmiddle" height="246px" width="294px" file="ed10028.JPG" alt="ed10028.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，  &lt;br/&gt;•治療有效劑量之選自由尼達尼布或吡非尼酮組成之群的第二活性劑及  &lt;br/&gt;•視情況選用之一或多種醫藥學上可接受之載劑或賦形劑  &lt;br/&gt;用於治療患有進行性纖維化間質性肺病(PF-ILD)的患者，其中此口服醫藥組合物每天兩次投與該患者。  &lt;br/&gt;本發明進一步關於式III之PDE4B抑制劑之用途，其用於製備包含18 mg或9 mg式III之PDE4B抑制劑的口服醫藥組合物，用於治療患有一或多種進行性纖維化間質性肺病(PF-ILD)的患者之方法，其中將該口服醫藥組合物與治療有效量之治療有效劑量之選自由尼達尼布及吡非尼酮組成之群的第二活性劑組合每天兩次口服投與該患者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention concerns an oral pharmaceutical composition comprising &lt;br/&gt;• either 18 mg or 9 mg of the PDE4B-inhibitor of formula III &lt;br/&gt;&lt;img align="absmiddle" height="246px" width="291px" file="ed10029.JPG" alt="ed10029.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, &lt;br/&gt;• a therapeutically effective dose of a second active agent selected from the group consisting of nintedanib or pirfenidone and &lt;br/&gt;• optionally, one or more pharmaceutically acceptable carriers or excipients &lt;br/&gt;for the treatment of a patient suffering from a progressive fibrosing interstitial lung disease (PF-ILD), wherein this oral pharmaceutical composition is to be administered to said patient twice daily. &lt;br/&gt;The invention further concerns the use of the PDE4B-inhibitor of formula III for preparing an oral pharmaceutical composition comprising either18 mg or 9 mg of the PDE4B-inhibitor of formula III for use in a method of treating a patient suffering from one or more Progressive Fibrosing Interstitial Lung Diseases (PF-ILDs), wherein said oral pharmaceutical composition is to be orally administered twice daily to said patient in combination with a therapeutically effective amount of a therapeutically effective dose of a second active agent selected from the group consisting of nintdanib and pirfenidone.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2022" publication-number="202615131">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615131</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100598</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自前驅物移除雜質之方法</chinese-title>
        <english-title>METHOD FOR REMOVING IMPURITIES FROM PRECURSORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260113B">B01D7/00</main-classification>
        <further-classification edition="200601120260113B">C01F7/62</further-classification>
        <further-classification edition="200601120260113B">C01G39/04</further-classification>
        <further-classification edition="200601120260113B">C01G41/04</further-classification>
        <further-classification edition="200601120260113B">C23C16/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華生　麥克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATSON, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧坎波　克莉絲汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OCAMPO, CRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷諾斯　約瑟夫　愛德華　三世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REYNOLDS, JOSEPH EDWARD III</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝托爾　史考特　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BATTLE, SCOTT L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩格哈丹　莎拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOGHADDAM, SARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加勒特　班傑明　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARRETT, BENJAMIN R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於自前驅物移除雜質之方法及相關系統。一種方法包括至少一個熱循環。該至少一個熱循環包括以下步驟之一或多者：將包括一前驅物及至少一種雜質之一容器加熱至一溫度達足以蒸發該至少一種雜質之至少一部分之一持續時間；量測該容器內之一蒸氣壓以獲得一經量測蒸氣壓且比較該經量測蒸氣壓與一設定值蒸氣壓；及當該經量測蒸氣壓高於該設定值蒸氣壓或在該設定值蒸氣壓內時，自該容器移除包括該至少一種雜質之一蒸氣之至少一部分。本文中提供其他方法及系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods for removing impurities from precursors and related systems are provided. A method comprises at least one thermal cycle. The at least one thermal cycle comprises one or more of the following steps: heating a vessel comprising a precursor and at least one impurity to a temperature for a duration sufficient to vaporize at least a portion of the at least one impurity; measuring a vapor pressure within the vessel to obtain a measured vapor pressure and comparing the measured vapor pressure to a set point vapor pressure; and when the measured vapor pressure is above or within the set point vapor pressure, removing, from the vessel, at least a portion of a vapor comprising the at least one impurity. Other methods and systems are provided herein.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:加熱/步驟</p>
        <p type="p">104:量測/步驟</p>
        <p type="p">106:移除/步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2023" publication-number="202615923">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615923</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100681</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>變焦鏡頭</chinese-title>
        <english-title>ZOOM LENS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">G02B9/12</main-classification>
        <further-classification edition="200601120260114B">G02B11/34</further-classification>
        <further-classification edition="200601120260114B">G02B13/02</further-classification>
        <further-classification edition="200601120260114B">G02B13/06</further-classification>
        <further-classification edition="202101120260114B">G02B7/02</further-classification>
        <further-classification edition="202101120260114B">G03B9/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商玉晶光電（廈門）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENIUS ELECTRONIC OPTICAL (XIAMEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖華濱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, HUABIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高偉哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, WEI-JEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林瀅驊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YING-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝宏健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, HUNG-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種變焦鏡頭，從一物側至一像側沿一光軸依序包括一第一透鏡組、一第二透鏡組及一第三透鏡組，該三個透鏡組中至少包含有一第 一透鏡至一第八透鏡，其中該變焦鏡頭至少具有一廣角狀態以及一望遠狀態，第一透鏡具有正屈光率，三個透鏡組中最靠近像側的透鏡的像側面的一光軸區域為凹面以及一圓周區域為凸面；以及2.0≦(Fnow+ Fnot)/2≦4.1的條件，其中Fnow為變焦鏡頭在廣角狀態的光圈值，Fnot為變焦鏡頭在望遠狀態的光圈值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A zoom lens sequentially includes a first lens group, a second lens group and a third lens group along an optical axis from an object side to an image side. The three lens groups include at least a first lens element to an eighth lens element. The zoom lens at least has a wide-angle state and a telephoto state. The first lens has positive refracting power, and an optical axis region of an image-side surface of a lens closest to the image side among the three lens groups is concave while a peripheral region of the same surface is convex. The zoom lens further satisfies the following condition: 2.0≦(Fnow+Fnot)/2≦4.1, in which Fnow is an f-number of the zoom lens in the wide-angle state, and Fnot is an f-number of the zoom lens in the telephoto state.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:變焦鏡頭</p>
        <p type="p">2:光圈</p>
        <p type="p">3:濾光片</p>
        <p type="p">4:成像面</p>
        <p type="p">A1:物側</p>
        <p type="p">A2:像側</p>
        <p type="p">I:光軸</p>
        <p type="p">11、21、31、41、51、61、71、81:物側面</p>
        <p type="p">12、22、32、42、52、62、72、82:像側面</p>
        <p type="p">13、16、23、26、33、36、43、46、53、56、63、66、73、76、83、86:光軸區域</p>
        <p type="p">14、17、24、27、34、37、44、47、54、57、64、67、74、77、84、87:圓周區域</p>
        <p type="p">10:第一透鏡</p>
        <p type="p">20:第二透鏡</p>
        <p type="p">30:第三透鏡</p>
        <p type="p">40:第四透鏡</p>
        <p type="p">50:第五透鏡</p>
        <p type="p">60:第六透鏡</p>
        <p type="p">70:第七透鏡</p>
        <p type="p">80:第八透鏡</p>
        <p type="p">G1:第一透鏡組</p>
        <p type="p">G2:第二透鏡組</p>
        <p type="p">G3:第三透鏡組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2024" publication-number="202615455">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615455</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100764</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含ＧＬＰ－１及澱粉素受體之共促效劑之醫藥調配物</chinese-title>
        <english-title>PHARMACEUTICAL FORMULATION COMPRISING CO-AGONISTS OF THE GLP-1 AND AMYLIN RECEPTORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">C07K14/605</main-classification>
        <further-classification edition="200601120260115B">A61K38/26</further-classification>
        <further-classification edition="201701120260115B">A61K47/64</further-classification>
        <further-classification edition="200601120260115B">A61P3/04</further-classification>
        <further-classification edition="200601120260115B">A61P25/00</further-classification>
        <further-classification edition="200601120260115B">A61P3/10</further-classification>
        <further-classification edition="200601120260115B">A61P9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹麥商諾佛　儂迪克股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVO NORDISK A/S</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克魯斯　湯瑪斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRUSE, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班克　寇達爾　安　路易斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANK KODAL, ANNE LOUISE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥德森　強尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MADSEN, JOHNNY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐斯特賈爾德　索倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OESTERGAARD, SOEREN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何根德夫　沃特　弗雷德里克　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOGENDORF, WOUTER FREDERIK JOHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托諾　克里斯提恩　溫茄爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORNOEE, CHRISTIAN WENZEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史崔佛　洛傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHAEFFER, LAUGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥德森　愛麗斯　拉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MADSEN, ALICE RAVN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關一種包括有GLP-1受體促效劑及澱粉素受體促效劑之化合物。本發明亦有關一種適於(但不限於)口服投予之包括這類化合物的醫藥調配物。該化合物及包括該化合物之醫藥調配物係可使用於患有超重、肥胖症及/或相關合併症的個體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a compound comprising a GLP-1 receptor agonist and an amylin receptor agonist. The invention also relates to a pharmaceutical formulation, suitable for but not limited to oral administration, which comprises such a compound. The compound and pharmaceutical formulation comprising it may be used for the medical treatment of subjects with overweight, obesity and associated co-morbidities.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2025" publication-number="202615606">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202615606</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100774</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黑色塗層、用於光學基板的塗覆的組成物及其製造方法、光學基板及組成物的用途</chinese-title>
        <english-title>BLACK COATING, COMPOSITION FOR COATING OF OPTICAL SUBSTRATES, METHOD OF PRODUCING THE SAME, OPTICAL SUBSTRATE, AND USE OF COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260115B">C09D183/06</main-classification>
        <further-classification edition="201801120260115B">C09D7/41</further-classification>
        <further-classification edition="201801120260115B">C09D7/61</further-classification>
        <further-classification edition="200601120260115B">C03C17/00</further-classification>
        <further-classification edition="201501120260115B">G02B1/10</further-classification>
        <further-classification edition="200601120260115B">G02B5/02</further-classification>
        <further-classification edition="200601120260115B">G02B5/22</further-classification>
        <further-classification edition="201101120260115B">B82Y20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商英克倫股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INKRON OY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海基寧　亞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEIKKINEN, JARKKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波塔寧　米可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POUTANEN, MIKKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雅斯凱萊寧　茱哈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAASKELAINEN, JUHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>増田則之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASUDA, NORIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">光學基板上的黑色塗層、用於生產此種塗層的組成物以及所述組成物用於邊緣黑化及雜散光控制的用途。本發明的塗層包含由固化聚合物與奈米粒子及黑色顏料混合形成的膜，其中所述膜的折射率大於1.6。本發明的組成物包含5重量份至100重量份的可固化聚合物；5重量份至100重量份的奈米粒子；及0.1重量份至20重量份的黑色顏料，並且將奈米粒子及黑色顏料與可固化聚合物混合。本發明的組成物表現出與高RI玻璃基板的RI值相匹配的RI值，同時提供有效的邊緣黑化性質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Black coatings on optical substrates, compositions for producing such coatings and the use of the compositions for edge-blackening and stray light control. The present coatings comprise a film formed by a cured polymer mixed with nanoparticles and black pigment, wherein the film has a refractive index of more than 1.6. The present compositions comprise 5 to 100 parts by weight of a curable polymer; 5 to 100 parts by weight of nanoparticles; and 0.1 to 20 parts by weight of black pigment, and the nanoparticles and black pigment are mixed with the curable polymer. The present compositions exhibit RI values which match that of high-RI glass substrates while providing efficient edge-blackening properties.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2026" publication-number="202616930">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>8</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202616930</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100811</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置及顯示裝置的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260115B">H10H29/49</main-classification>
        <further-classification edition="202501120260115B">H10H29/854</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本啓華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, KEIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>増田有希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASUDA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明解決以下課題：由於LED顯示器裝置於各個方向產生光，因此光被周邊的配線絕緣用絕緣膜、保護膜、隔壁等吸收，作為顯示器的光輸出效率變低，亮度變得不充分。一種顯示裝置，至少具有金屬配線、硬化膜及多個發光元件，所述顯示裝置中，所述發光元件於任意一個面包括一對電極端子，所述一對電極端子與於所述硬化膜中延伸的多條所述金屬配線連接，多條所述金屬配線為利用所述硬化膜保持電絕緣性的結構，所述硬化膜是將包含（A）樹脂的樹脂組成物硬化而成的膜，所述硬化膜於厚度基準5 μm下的波長450 nm的光的透過率為80%以上且100%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:顯示裝置</p>
        <p type="p">2:發光元件</p>
        <p type="p">3:硬化膜</p>
        <p type="p">4、4c:金屬配線</p>
        <p type="p">5:相向基板</p>
        <p type="p">6:電極端子</p>
        <p type="p">7:發光元件驅動基板</p>
        <p type="p">8:驅動元件</p>
        <p type="p">9:障壁金屬</p>
        <p type="p">10:凸塊</p>
        <p type="p">11a:指定區域A</p>
        <p type="p">11b:指定區域B</p>
        <p type="p">19:硬化膜整體的厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
</tw-patent-applications>